DEVICES FOR COOLING ELECTRONIC CIRCUIT BOARDS

Directory of Open Access Journals (Sweden)

T. A. Ismailov

2014-01-01

Full Text Available In the work described structural variants of devices for cooling electronic circuit boards, made on the basis of thermoelectric batteries and consumable working substances, implementing uneven process of removing heat from heat-generating components. A comparison of temperature fields of electronic circuit simulator with his uniform and non-uniform cooling. 

Design principles and realization of electro-optical circuit boards

Science.gov (United States)

Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

2013-02-01

The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

Science.gov (United States)

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

International Nuclear Information System (INIS)

Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

2011-01-01

Highlights: → This paper presents new and important data on characterization of wastes of electric and electronic equipments. → Copper concentration is increasing in mobile phones and remaining constant in personal computers. → Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results

Packaging printed circuit boards: A production application of interactive graphics

Science.gov (United States)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Merging polygons on two-layer printed circuit board

Directory of Open Access Journals (Sweden)

Murov S. Yu.

2011-12-01

Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

Endurance of lead-free assembly under board level drop test and thermal cycling

Energy Technology Data Exchange (ETDEWEB)

Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

2008-06-12

The reliability of lead-free electronic assemblies under board level drop test and thermal cycling was investigated. TSOP (thin small outline package) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) on the reliability performance were studied. The results show that the assemblies with ENIG finishes reveal better reliability performance than its OSP counterparts under drop test, however, the OSP samples outperform those with ENIG finishes under thermal cycling. The failure mechanism is different under these two test conditions: the solder joints fracture into the intermetallic compounds (IMCs) layer under drop test, and cracks initiate in the bulk solder under thermal cycling. The surface finishes have an effect on the failure mode. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface.

Preparing printed circuit boards for rapid turn-around time on a protomat plotter

International Nuclear Information System (INIS)

Hawtree, J.

1998-01-01

This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

Development and verification of printed circuit board toroidal transformer model

DEFF Research Database (Denmark)

Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

2013-01-01

An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...... by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations...

Recovery Act: High-Temperature Circuit Boards for use in Geothermal Well Monitoring Applications

Energy Technology Data Exchange (ETDEWEB)

Hooker, Matthew [Composite Tehcnology Development, Inc., Lafayette, CO (United States); Fabian, Paul [Composite Tehcnology Development, Inc., Lafayette, CO (United States)

2013-05-01

depths. At present, the highest-temperature commercially available circuit boards are based on polyimide materials, and those have maximum use temperatures of 200 to 250°C. In addition to thermal stability, downhole electronics must also be fabricated into high-aspect-ratio packages. For example, the multilayer assemblies produced at SNL were approximately 2.5 cm wide and 50 cm long. Because of this very high form factor, glass-fiber-reinforced polymers are much more desirable than multilayer ceramic modules (MCM). MCMs have many advantages for some applications, but are susceptible to damage induced by the mechanical and vibrational loads commonly experienced by data-logging tools. Thus, as EGS technology continues to advance, there is a strong need for multilayer electronics that can provide the necessary thermal performance while also being compatible with high-form-factor circuit designs. This project involved the design and development of high-temperature circuit materials, as well as the fabrication and testing of circuit components. The material development included the evaluation of various polymer/fiberglass composites, whereas the circuit components were tested using conventional microelectronic evaluation techniques. This effort targeted development of a new class of high-temperature multilayer circuit boards for use in downhole data-logging applications where temperatures are on the order of 300°C. This is consistent with DOE’s multiyear plan for advancing technologies for use in enhanced geothermal systems. Organic and inorganic polymer systems, both with glass reinforcements, were considered to provide the following performance at elevated temperatures: • Mechanical strength and durability • High dielectric strength and electrical resistivity • Thermal stability • Strong adhesion to copper to ensure the reliability of the multilayer assemblies • Processing characteristics that are consistent with state-of-the-art multilayer circuit board

Development of a miniaturized watch-type dosimeter using a silicon printed-circuit board

International Nuclear Information System (INIS)

Ishikura, Takeshi; Sakamaki, Tsuyoshi; Matsumoto, Iwao; Aoyama, Kei; Nakamura, Takashi

2008-01-01

The electrical personal dosimeter using a silicon semiconductor sensor has the advantage of real time response and alarm function, which can prevent unexpected over-exposure. We tried to develop a miniaturized watch-type dosimeter by incorporating the silicon semiconductor sensor on a silicon printed-circuit board. Thin film resistors, capacitors and wiring patterns are formed on a downsized printed-circuit board. Electronic parts including transistors are mounted by soldering on the silicon printed-circuit board. The dosimeter is further miniaturized by downsizing the amplifier circuit, the semiconductor radiation sensor, the power supply circuit, setting parts and alarm part. The performance of the developed dosimeter was evaluated with respect to the gamma-ray spectra, angular dependence and linearity to dose equivalent rate, and it was confirmed that this dosimeter has the performance equivalent to a commercially available electrical personal dosimeter. (author)

A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

International Nuclear Information System (INIS)

Noorliyana, H.A.; Zaheruddin, K.; Mohd Fazlul Bari; M. Sri Asliza; Nurhidayah, A.Z.; Kamarudin, H.

2009-01-01

Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

Single Day Construction of Multigene Circuits with 3G Assembly.

Science.gov (United States)

Halleran, Andrew D; Swaminathan, Anandh; Murray, Richard M

2018-05-18

The ability to rapidly design, build, and test prototypes is of key importance to every engineering discipline. DNA assembly often serves as a rate limiting step of the prototyping cycle for synthetic biology. Recently developed DNA assembly methods such as isothermal assembly and type IIS restriction enzyme systems take different approaches to accelerate DNA construction. We introduce a hybrid method, Golden Gate-Gibson (3G), that takes advantage of modular part libraries introduced by type IIS restriction enzyme systems and isothermal assembly's ability to build large DNA constructs in single pot reactions. Our method is highly efficient and rapid, facilitating construction of entire multigene circuits in a single day. Additionally, 3G allows generation of variant libraries enabling efficient screening of different possible circuit constructions. We characterize the efficiency and accuracy of 3G assembly for various construct sizes, and demonstrate 3G by characterizing variants of an inducible cell-lysis circuit.

Detection of circuit-board components with an adaptive multiclass correlation filter

Science.gov (United States)

Diaz-Ramirez, Victor H.; Kober, Vitaly

2008-08-01

A new method for reliable detection of circuit-board components is proposed. The method is based on an adaptive multiclass composite correlation filter. The filter is designed with the help of an iterative algorithm using complex synthetic discriminant functions. The impulse response of the filter contains information needed to localize and classify geometrically distorted circuit-board components belonging to different classes. Computer simulation results obtained with the proposed method are provided and compared with those of known multiclass correlation based techniques in terms of performance criteria for recognition and classification of objects.

Modelling, analysis, and acceleration of a printed circuit board ...

Indian Academy of Sciences (India)

Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

discuss lead time reduction in a qualitative way with illustrative case studies. Krishnan ... industry practices, and research questions that should drive new methods and computer ... There are three types of printed circuit boards available today.

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Science.gov (United States)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

Directory of Open Access Journals (Sweden)

Marcos Paulo Kohler Caldas

2015-06-01

Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

Science.gov (United States)

Kamata, Masahiro; Honda, Motoshi

2003-01-01

We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

Pre-assembling electric circuits of braided conductors

International Nuclear Information System (INIS)

Mercado Gomez, Martin Elias

1999-01-01

The present article has for object to give to know an innovative concept of pre-assembling electric circuits for distribution of normal and regulated power, to the work position like integral subsystems of the calls intelligent buildings

A filter circuit board for the Earthworm Seismic Data Acquisition System

Science.gov (United States)

Jensen, Edward Gray

2000-01-01

The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

Newnes electronics assembly handbook

CERN Document Server

Brindley, Keith

2013-01-01

Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are des

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

2015-01-15

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

International Nuclear Information System (INIS)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

2015-01-01

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

All-semiconductor metamaterial-based optical circuit board at the microscale

International Nuclear Information System (INIS)

Min, Li; Huang, Lirong

2015-01-01

The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arranging anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

International Nuclear Information System (INIS)

Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

2009-01-01

Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

Science.gov (United States)

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

ELECTRONIC CIRCUIT BOARDS NON-UNIFORM COOLING SYSTEM MODEL

Directory of Open Access Journals (Sweden)

D. V. Yevdulov

2016-01-01

Full Text Available Abstract. The paper considers a mathematical model of non-uniform cooling of electronic circuit boards. The block diagram of the system implementing this approach, the method of calculation of the electronic board temperature field, as well as the principle of its thermal performance optimizing are presented. In the considered scheme the main heat elimination from electronic board is produced by the radiator system, and additional cooling of the most temperature-sensitive components is produced by thermoelectric batteries. Are given the two-dimensional temperature fields of the electronic board during its uniform and non-uniform cooling, is carried out their comparison. As follows from the calculations results, when using a uniform overall cooling of electronic unit there is a waste of energy for the cooling 0f electronic board parts which temperature is within acceptable temperature range without the cooling system. This approach leads to the increase in the cooling capacity of used thermoelectric batteries in comparison with the desired values. This largely reduces the efficiency of heat elimination system. The use for electronic boards cooling of non-uniform local heat elimination removes this disadvantage. The obtained dependences show that in this case, the energy required to create a given temperature is smaller than when using a common uniform cooling. In this approach the temperature field of the electronic board is more uniform and the cooling is more efficient. 

78 FR 23591 - Certain Prepregs, Laminates, and Finished Circuit Boards

Science.gov (United States)

2013-04-19

... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-659 (Enforcement)] Certain Prepregs... United States after importation of certain prepregs, laminates, and finished circuit boards that infringe... prepregs and laminates that are the subject of the investigation or that otherwise infringe, induce, and/or...

Printed circuit board permittivity measurement using waveguide and resonator rings

NARCIS (Netherlands)

Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

2014-01-01

Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Bruno de Castro Braz

Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

Assembly of Nanoscale Organic Single-Crystal Cross-Wire Circuits

DEFF Research Database (Denmark)

Bjørnholm, Thomas

2009-01-01

Organic single-crystal transistors and circuits can be assembled by nanomechanical manipulation of nanowires of CuPc, F(16)CuPc, and SnO(2):Sb. The crossed bar devices have low operational voltage, high mobility and are stable in air. They can be combined into circuits, providing varied functions...... including inverters and NOR and NAND logic gates, opening new opportunities for organic nanoelectronics and highly sophisticated integrated logic devices....

Optimal production planning for PCB assembly

CERN Document Server

Ho, William

2006-01-01

Focuses on the optimization of the Printed circuit board (PCB) assembly lines' efficiency. This book integrates the component sequencing and the feeder arrangement problems together for the pick-and-place machine and the chip shooter machines.

DC arc plasma disposal of printed circuit board

International Nuclear Information System (INIS)

Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

2004-01-01

A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

Polyimide Nanocomposite Circuit Board Materials to Mitigate Internal Electrostatic Discharge, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — In Sub-topic T8.02, NASA has identified a need for improved circuit boards to mitigate the hazards of internal electrostatic discharge (IESD) on missions where high...

WindoWorks: A flexible program for computerized testing of accelerator control system electronic circuit boards

International Nuclear Information System (INIS)

Utterback, J.

1993-09-01

Since most accelerator control system circuit boards reside in a commercial bus architecture, such as CAMAC or VMEbus, a computerized test station is needed for exercising the boards. This test station is needed for the development of newly designed prototypes, for commissioning newly manufactured boards, for diagnosing boards which have failed in service, and for long term testing of boards with intermittent failure problems. WindoWorks was created to address these needs. It is a flexible program which runs on a PC compatible computer and uses a PC to bus crate interface. WindoWorks was designed to give the user a flexible way to test circuit boards. Each test is incapsulated into a window. By bringing up several different windows the user can run several different tests simultaneously. The windows are sizable, and moveable. They have data entry boxes so that the test can be customized to the users preference. The windows can be used in conjunction with each other in order to create supertests. There are several windows which are generic. They can be used to test basic functions on any VME (or CAMAC) board. There are other windows which have been created to test specific boards. New windows for testing specific boards can be easily created by a Pascal programmer using the WindoWorks framework

Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Rasa Volungevičienė

2014-10-01

Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

Directory of Open Access Journals (Sweden)

V.C. Ho

2003-01-01

Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

International Nuclear Information System (INIS)

Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

2014-01-01

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

Energy Technology Data Exchange (ETDEWEB)

Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

2014-01-15

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

DEFF Research Database (Denmark)

Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2015-01-01

Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

Energy Technology Data Exchange (ETDEWEB)

Chiang, H.-L. [Department Risk Management, China Medical University, Taichung 40402, Taiwan (China)], E-mail: hlchiang@mail.cmu.edu.tw; Lin, K.-H. [Department of Environmental Engineering, Fooyin University, Kaohsiung 831, Taiwan (China); Lai, M.-H. [Department of Environmental Engineering, Dayeh University, Changhua 51591, Taiwan (China); Chen, T.-C. [Department of Environmental Science and Engineering, Pingtung University of Science and Technology, Pingtung 91201, Taiwan (China); Ma, S.-Y. [Department of Environmental Engineering, Fooyin University, Kaohsiung 831, Taiwan (China)

2007-10-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards.

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

International Nuclear Information System (INIS)

Chiang, H.-L.; Lin, K.-H.; Lai, M.-H.; Chen, T.-C.; Ma, S.-Y.

2007-01-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

Science.gov (United States)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

DEFF Research Database (Denmark)

Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

2013-01-01

The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

Electronic inverter assembly

Science.gov (United States)

Singh, Brij N.; Schmit, Christopher J.

2018-05-22

A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

International Nuclear Information System (INIS)

Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

2012-01-01

This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

DEFF Research Database (Denmark)

Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

2015-01-01

A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

Electrical Quality Assurance of the Superconducting Circuits during LHC Machine Assembly

CERN Document Server

Bozzini, D; Desebe, O; Mess, K H; Russenschuck, Stephan; Bednarek, M; Dworak, D; Górnicki, E; Jurkiewicz, P; Kapusta, P; Kotarba, A; Ludwin, J; Olek, S; Talach, M; Zieblinski, M; Klisch, M; Prochal, B

2008-01-01

Based on the LHC powering reference database, all-together 1750 superconducting circuits were connected in the various cryogenic transfer lines of the LHC machine. Testing the continuity, magnet polarity, and the quality of the electrical insulation were the main tasks of the Electrical Quality Assurance (ELQA) activities during the LHC machine assembly. With the assembly of the LHC now complete, the paper reviews the work flow, resources, and the qualification results including the different types of electrical non-conformities.

δ-Protocadherins: Organizers of neural circuit assembly.

Science.gov (United States)

Light, Sarah E W; Jontes, James D

2017-09-01

The δ-protocadherins comprise a small family of homophilic cell adhesion molecules within the larger cadherin superfamily. They are essential for neural development as mutations in these molecules give rise to human neurodevelopmental disorders, such as schizophrenia and epilepsy, and result in behavioral defects in animal models. Despite their importance to neural development, a detailed understanding of their mechanisms and the ways in which their loss leads to changes in neural function is lacking. However, recent results have begun to reveal roles for the δ-protocadherins in both regulation of neurogenesis and lineage-dependent circuit assembly, as well as in contact-dependent motility and selective axon fasciculation. These evolutionarily conserved mechanisms could have a profound impact on the robust assembly of the vertebrate nervous system. Future work should be focused on unraveling the molecular mechanisms of the δ-protocadherins and understanding how this family functions broadly to regulate neural development. Copyright © 2017 Elsevier Ltd. All rights reserved.

An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

International Nuclear Information System (INIS)

Combet, M.; Eder, J.; Pagny, C.

1974-12-01

A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

Quality and reliability control on assemblies

International Nuclear Information System (INIS)

Mueller, H.

1976-01-01

Taking as an example electronic assemblies in printed circuit board engineering, quality control during manufacture is dealt with. After giving a survey of four phases of quality and reliability control, some specific methods of quality control are dealt with by means of a flowchart, and by some examples the necessity and the success of these measures are shown. (RW) [de

Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

International Nuclear Information System (INIS)

LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

1999-01-01

We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

Aeroflex Single Board Computers and Instrument Circuit Cards for Nuclear Environments Measuring and Monitoring

International Nuclear Information System (INIS)

Stratton, Sam; Stevenson, Dave; Magnifico, Mateo

2013-06-01

A Single Board Computer (SBC) is an entire computer including all of the required components and I/O interfaces built on a single circuit board. SBC's are used across numerous industrial, military and space flight applications. In the case of military and space implementations, SBC's employ advanced high reliability processors designed for rugged thermal, mechanical and even radiation environments. These processors, in turn, rely on equally advanced support components such as memory, interface, and digital logic. When all of these components are put together on a printed circuit card, the result is a highly reliable Single Board Computer that can perform a wide variety of tasks in very harsh environments. In the area of instrumentation, peripheral circuit cards can be developed that directly interface to the SBC and various radiation measuring devices and systems. Designers use signal conditioning and high reliability Analog to Digital Converters (ADC's) to convert the measuring device signals to digital data suitable for a microprocessor. The data can then be sent to the SBC via high speed communication protocols such as Ethernet or similar type of serial bus. Data received by the SBC can then be manipulated and processed into a form readily available to users. Recent events are causing some in the NPP industry to consider devices and systems with better radiation and temperature performance capability. Systems designed for space application are designed for the harsh environment of space which under certain conditions would be similar to what the electronics will see during a severe nuclear reactor event. The NPP industry should be considering higher reliability electronics for certain critical applications. (authors)

Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

Science.gov (United States)

Weidenhammer, Jeffrey D.

2007-01-01

A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

Leaching of gold and silver from printed circuit board of mobile phones

OpenAIRE

Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

2015-01-01

Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

EMC and the printed circuit board design theory and layout made simple

CERN Document Server

Montrose, Mark I

1999-01-01

"This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

International Nuclear Information System (INIS)

Chiu, K.-C.; Chen, C.-S.

2007-01-01

A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Science.gov (United States)

Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

2010-06-01

Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

Science.gov (United States)

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

Science.gov (United States)

Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

Science.gov (United States)

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Ductile electroless Ni-P coating onto flexible printed circuit board

Science.gov (United States)

Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

2016-03-01

In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

A dishwasher for circuits

CERN Multimedia

Rosaria Marraffino

2014-01-01

You have always been told that electronic devices fear water. However, at the Surface Mount Devices (SMD) Workshop here at CERN all the electronic assemblies are cleaned with a machine that looks like a… dishwasher.   The circuit dishwasher. Credit: Clara Nellist.  If you think the image above shows a dishwasher, you wouldn’t be completely wrong. Apart from the fact that the whole pumping system and the case itself are made entirely from stainless steel and chemical resistant materials, and the fact that it washes electrical boards instead of dishes… it works exactly like a dishwasher. It’s a professional machine (mainly used in the pharmaceutical industry) designed to clean everything that can be washed with a water-based chemical soap. This type of treatment increases the lifetime of the electronic boards and therefore the LHC's reliability by preventing corrosion problems in the severe radiation and ozone environment of the LHC tunn...

Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

Directory of Open Access Journals (Sweden)

Lee Jacqueline Ann L.

2016-01-01

Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Directory of Open Access Journals (Sweden)

Ivănuş R.C.

2010-06-01

Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

Directory of Open Access Journals (Sweden)

Yefimenko A. A.

2014-12-01

Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

Directory of Open Access Journals (Sweden)

Araújo Manuel

2016-01-01

Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

Comparative study of electromagnetic compatibility methods in printed circuit board design tools

International Nuclear Information System (INIS)

Marinova, Galia

2002-01-01

The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

High-speed logic integrated circuits with solution-processed self-assembled carbon nanotubes.

Science.gov (United States)

Han, Shu-Jen; Tang, Jianshi; Kumar, Bharat; Falk, Abram; Farmer, Damon; Tulevski, George; Jenkins, Keith; Afzali, Ali; Oida, Satoshi; Ott, John; Hannon, James; Haensch, Wilfried

2017-09-01

As conventional monolithic silicon technology struggles to meet the requirements for the 7-nm technology node, there has been tremendous progress in demonstrating the scalability of carbon nanotube field-effect transistors down to the size that satisfies the 3-nm node and beyond. However, to date, circuits built with carbon nanotubes have overlooked key aspects of a practical logic technology and have stalled at simple functionality demonstrations. Here, we report high-performance complementary carbon nanotube ring oscillators using fully manufacturable processes, with a stage switching frequency of 2.82 GHz. The circuit was built on solution-processed, self-assembled carbon nanotube arrays with over 99.9% semiconducting purity, and the complementary feature was achieved by employing two different work function electrodes.

High-speed logic integrated circuits with solution-processed self-assembled carbon nanotubes

Science.gov (United States)

Han, Shu-Jen; Tang, Jianshi; Kumar, Bharat; Falk, Abram; Farmer, Damon; Tulevski, George; Jenkins, Keith; Afzali, Ali; Oida, Satoshi; Ott, John; Hannon, James; Haensch, Wilfried

2017-09-01

As conventional monolithic silicon technology struggles to meet the requirements for the 7-nm technology node, there has been tremendous progress in demonstrating the scalability of carbon nanotube field-effect transistors down to the size that satisfies the 3-nm node and beyond. However, to date, circuits built with carbon nanotubes have overlooked key aspects of a practical logic technology and have stalled at simple functionality demonstrations. Here, we report high-performance complementary carbon nanotube ring oscillators using fully manufacturable processes, with a stage switching frequency of 2.82 GHz. The circuit was built on solution-processed, self-assembled carbon nanotube arrays with over 99.9% semiconducting purity, and the complementary feature was achieved by employing two different work function electrodes.

Detecting short circuits during assembly

Science.gov (United States)

Deboo, G. J.

1980-01-01

Detector circuit identifies shorts between bus bars of electronic equipment being wired. Detector sounds alarm and indicates which planes are shorted. Power and ground bus bars are scanned continuously until short circuit occurs.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

International Nuclear Information System (INIS)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-01-01

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

Energy Technology Data Exchange (ETDEWEB)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

2014-11-15

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

Science.gov (United States)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

NARCIS (Netherlands)

Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

2008-01-01

The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

Directory of Open Access Journals (Sweden)

Vučinić Aleksandra S.

2017-01-01

Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

Energy Technology Data Exchange (ETDEWEB)

Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

2013-04-10

Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

OpenAIRE

De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

2007-01-01

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

Science.gov (United States)

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2016-01-01

Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

Directory of Open Access Journals (Sweden)

Maciej Thomas

2014-10-01

Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

Directory of Open Access Journals (Sweden)

Rajeswari Packianathan

2015-01-01

Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

Recovery of high purity precious metals from printed circuit boards

International Nuclear Information System (INIS)

Park, Young Jun; Fray, Derek J.

2009-01-01

Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

Optimization of a readout board for mass assembly and light yield measurements with a cosmic ray test stand

Energy Technology Data Exchange (ETDEWEB)

Chau, Phi [Johannes Gutenberg-Universitaet Mainz, Institut fuer Physik (Germany); Collaboration: CALICE-D-Collaboration

2016-07-01

We have built a readout board prototype, equipped with SiPMs, scintillators and readout electronics for an highly granular calorimeter. The design was optimized for mass assembly due to about 8 million channels in the final detector. The prototype showed good performance in several test beams and in a cosmic ray test stand, which was built to characterize the MIP response of these kinds of boards. We show an overview of the cosmic ray test stand and measurement results for the readout board and plans for an improved 2nd generation prototype.

Interfacial stresses in a bi-material assembly with a compliant bonding layer

International Nuclear Information System (INIS)

Suhir, E; Vujosevic, M

2008-01-01

We examine an elongated bi-material adhesively bonded or soldered assembly with a continuous compliant attachment (bonding layer). The assembly is subjected to external tensile forces or to bending moments applied to one of the assembly components. We develop simple predictive analytical ('mathematical') models for the evaluation of interfacial shearing (in the case of external tensile forces) and peeling (in the case of external bending moments) stresses and strains in the bonding material. The developed models can be helpful in stress-strain analyses of assemblies of the type in question and particularly for printed-circuit-board (PCB)/surface-mounted-device (SMD) assemblies employed in electronic packaging. These models enable one to particularly evaluate the maximum interfacial stresses in the bonding material from the predicted or measured strains in the PCB in the vicinity of but still outside the surface-mounted package

Checking a printed board

CERN Multimedia

1977-01-01

An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

Evaluation of gold and silver leaching from printed circuit board of cellphones

Energy Technology Data Exchange (ETDEWEB)

Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

2014-02-15

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

Evaluation of gold and silver leaching from printed circuit board of cellphones

International Nuclear Information System (INIS)

Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

2014-01-01

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

Science.gov (United States)

Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

2017-06-01

Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

Science.gov (United States)

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

Pressure-Sensor Assembly Technique

Science.gov (United States)

Pruzan, Daniel A.

2003-01-01

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

Energy Technology Data Exchange (ETDEWEB)

Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

2014-01-15

Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

A quick solution, made to measure; Big scientific experiments need big circuit boards and that's where East Kilbride's D-TACQ comes in

CERN Multimedia

Gardner, D

2003-01-01

D-TACQ is a small electronics company operating in a highly-specialised market with technological expertise that few can match worldwide. It specialises in designing and manufacturing bespoke printed circuit boards (PCBs) which handle data acquisition tasks linked to scientific instrumentation and control systems (1 page).

A general design strategy for block copolymer directed self-assembly patterning of integrated circuits contact holes using an alphabet approach.

Science.gov (United States)

Yi, He; Bao, Xin-Yu; Tiberio, Richard; Wong, H-S Philip

2015-02-11

Directed self-assembly (DSA) is a promising lithography candidate for technology nodes beyond 14 nm. Researchers have shown contact hole patterning for random logic circuits using DSA with small physical templates. This paper introduces an alphabet approach that uses a minimal set of small physical templates to pattern all contacts configurations on integrated circuits. We illustrate, through experiments, a general and scalable template design strategy that links the DSA material properties to the technology node requirements.

OptoZIF Drive: a 3D printed implant and assembly tool package for neural recording and optical stimulation in freely moving mice

Science.gov (United States)

Freedman, David S.; Schroeder, Joseph B.; Telian, Gregory I.; Zhang, Zhengyang; Sunil, Smrithi; Ritt, Jason T.

2016-12-01

Objective. Behavioral neuroscience studies in freely moving rodents require small, light-weight implants to facilitate neural recording and stimulation. Our goal was to develop an integrated package of 3D printed parts and assembly aids for labs to rapidly fabricate, with minimal training, an implant that combines individually positionable microelectrodes, an optical fiber, zero insertion force (ZIF-clip) headstage connection, and secondary recording electrodes, e.g. for electromyography (EMG). Approach. Starting from previous implant designs that position recording electrodes using a control screw, we developed an implant where the main drive body, protective shell, and non-metal components of the microdrives are 3D printed in parallel. We compared alternative shapes and orientations of circuit boards for electrode connection to the headstage, in terms of their size, weight, and ease of wire insertion. We iteratively refined assembly methods, and integrated additional assembly aids into the 3D printed casing. Main results. We demonstrate the effectiveness of the OptoZIF Drive by performing real time optogenetic feedback in behaving mice. A novel feature of the OptoZIF Drive is its vertical circuit board, which facilities direct ZIF-clip connection. This feature requires angled insertion of an optical fiber that still can exit the drive from the center of a ring of recording electrodes. We designed an innovative 2-part protective shell that can be installed during the implant surgery to facilitate making additional connections to the circuit board. We use this feature to show that facial EMG in mice can be used as a control signal to lock stimulation to the animal’s motion, with stable EMG signal over several months. To decrease assembly time, reduce assembly errors, and improve repeatability, we fabricate assembly aids including a drive holder, a drill guide, an implant fixture for microelectode ‘pinning’, and a gold plating fixture. Significance. The

PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

Directory of Open Access Journals (Sweden)

Hellington Bastos da Silva de Sant’ana

2015-07-01

Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

Assembly Manual for the Berkeley Lab Cosmic Ray Detector

International Nuclear Information System (INIS)

Collier, Michael

2002-01-01

The Berkeley Lab Cosmic Ray Detector consists of 3 main components that must be prepared separately before they can be assembled. These components are the scintillator, circuit board, and casing. They are described in the main sections of this report, which may be completed in any order. Preparing the scintillator paddles involves several steps--cutting the scintillator material to the appropriate size and shape, preparing and attaching Lucite cookies (optional), polishing the edges, gluing the end to the photomultiplier tube (optional), and wrapping the scintillator. Since the detector has 2 paddles, each of the sections needs to be repeated for the other paddle

Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

International Nuclear Information System (INIS)

Korneeva, Anna; Shaydurov, Vladimir

2016-01-01

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards

Science.gov (United States)

Park, Sanghee; Kim, Ye Chan; Choi, Kisuk; Chae, Heeyop; Suhr, Jonghwan; Nam, Jae-Do

2017-12-01

As device miniaturization in microelectronics is currently requested in the development of high performance device, which usually include highly-integrated metal-polyimide multilayer structures. A redistribution layer (RDL) process is currently emerging as one of the most advance fabrication techniques for on-chip interconnect and packaging. One of the major issues in this process is the poor adhesion of the metal-polyimide interfaces particularly in flexible circuit boards due to the flexibility and bendability of devices. In this study, low pressure O2 plasma treatment was investigated to improve the adhesion of metal-polyimide interfaces, using inductively coupled plasma (ICP) treatment. We identified that the adhesion of metal-polyimide interfaces was greatly improved by the surface roughness control providing 46.1 MPa of shear force in the ball shear test after O2 plasma treatment, compared 14.2 MPa without O2 plasma treatment. It was seemingly due to the fact that the adhesion in metal-polyimide interfaces was improved by a chemical conversion of C=O to C-O bonds and by a ring opening reaction of imide groups, which was confirmed with FT-IR analysis. In the finite element numerical analysis of metal-polyimide interfaces, the O2 plasma treated interface showed that the in-plane stress distribution and the vertical directional deformation agreed well with real failure modes in flexible circuits manufacturing.

Waste printed circuit board recycling techniques and product utilization

International Nuclear Information System (INIS)

Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

2015-01-01

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

Waste printed circuit board recycling techniques and product utilization

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

2015-02-11

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

Advanced circuit simulation using Multisim workbench

CERN Document Server

Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

2012-01-01

Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

Design and implementation of a hybrid circuit system for micro sensor signal processing

International Nuclear Information System (INIS)

Wang Zhuping; Chen Jing; Liu Ruqing

2011-01-01

This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

International Nuclear Information System (INIS)

Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

2014-01-01

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2014-09-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2015-03-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Integration of microelectronic chips in microfluidic systems on printed circuit board

International Nuclear Information System (INIS)

Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

2012-01-01

A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

Design of Introspective Circuits for Analysis of Cell-Level Dis-orientation in Self-Assembled Cellular Systems

Directory of Open Access Journals (Sweden)

Nicholas Jesse Macias

2016-02-01

Full Text Available This paper discusses a novel approach to managing complexity in a large self-assembled system, by employing the self-assembling components themselves to address the complexity. Challenges are discussed, including the question of how to deal with elements that are assembled in different orientations from each other, and a solution based on the idea of introspective circuits is described. A methodology for determining a single cell’s orientation from an adjacent cell is given. An algorithm is then described for using such re-oriented edge cells to determine orientation of more-interior cells, thus allowing re-orientation of an entire 2D region of cells. Test procedures are described, and results are presented to show better-than-linear time performance (O(sqrt(n. The significance of this work is discussed, not only in terms of managing arrays of dis-oriented cells, but more importantly as an example of the usefulness of local, distributed self-configuration to create and use introspective circuitry. Finally, future work is discussed, including extension to 3D collections of cells.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

Energy Technology Data Exchange (ETDEWEB)

Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Mrazikova Anna

2015-06-01

Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

Three-input gate logic circuits on chemically assembled single-electron transistors with organic and inorganic hybrid passivation layers.

Science.gov (United States)

Majima, Yutaka; Hackenberger, Guillaume; Azuma, Yasuo; Kano, Shinya; Matsuzaki, Kosuke; Susaki, Tomofumi; Sakamoto, Masanori; Teranishi, Toshiharu

2017-01-01

Single-electron transistors (SETs) are sub-10-nm scale electronic devices based on conductive Coulomb islands sandwiched between double-barrier tunneling barriers. Chemically assembled SETs with alkanethiol-protected Au nanoparticles show highly stable Coulomb diamonds and two-input logic operations. The combination of bottom-up and top-down processes used to form the passivation layer is vital for realizing multi-gate chemically assembled SET circuits, as this combination enables us to connect conventional complementary metal oxide semiconductor (CMOS) technologies via planar processes. Here, three-input gate exclusive-OR (XOR) logic operations are demonstrated in passivated chemically assembled SETs. The passivation layer is a hybrid bilayer of self-assembled monolayers (SAMs) and pulsed laser deposited (PLD) aluminum oxide (AlO[Formula: see text]), and top-gate electrodes were prepared on the hybrid passivation layers. Top and two-side-gated SETs showed clear Coulomb oscillation and diamonds for each of the three available gates, and three-input gate XOR logic operation was clearly demonstrated. These results show the potential of chemically assembled SETs to work as logic devices with multi-gate inputs using organic and inorganic hybrid passivation layers.

Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

Directory of Open Access Journals (Sweden)

Alafara A. Baba

2014-07-01

Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

Directory of Open Access Journals (Sweden)

Ronal D. Montoya-Montoya

2013-11-01

Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

PUZZLE - A program for computer-aided design of printed circuit artwork

Science.gov (United States)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

Printed circuit for ATLAS

CERN Multimedia

Laurent Guiraud

1999-01-01

A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

Leaching of gold, silver and accompanying metals from circuit boards (PCBs waste

Directory of Open Access Journals (Sweden)

Jana Ficeriová

2011-12-01

Full Text Available Au-Ag noble metal wastes represent a wide range of waste types and forms, with various accompanying metallic elements.The presented leaching strategy for Au-Ag contained in circuit boards (PCBs aims at gaining gold and silver in the metallic form.Application of the proposed ammonium thiosulphate leaching process for the treatment of the above mentioned Au-Ag containing wastesrepresents a practical, economic and at the same time an ecological solution. The ammonium thiosulphate based leaching of gold and silverfrom PCBs waste, using crushing as a pretreatment, was investigated. It was possible to achieve 98 % gold and 93 % silver recovery within48 hours of ammonium thiosulphate leaching. This type of leaching is a better leaching procedure for recovery of gold and silver from PCBwaste than the classical toxic cyanide leaching. 84 % Cu, 82 % Fe, 77 % Al, 76 % Zn, 70 % Ni, 90 % Pd, 88 % Pb and 83 % Sn recovery ofthe accompanying metals was achieved, using sulphuric acid with hydrogen peroxide, sodium chloride and aqua regia. A four steps leachingprocess gave a very satisfactory yield and a more rapid kinetics for all observed metals solubilization than other technologies.

Demonstrating the Effect of Particle Impact Dampers on the Random Vibration Response and Fatigue Life of Printed Wiring Assemblies

Science.gov (United States)

Knight, Brent; Montgomery, Randall; Geist, David; Hunt, Ron; LaVerde, Bruce; Towner, Robert

2013-01-01

In a recent experimental study, small Particle Impact Dampers (PID) were bonded directly to the surface of printed circuit board (PCB) or printed wiring assemblies (PWA), reducing the random vibration response and increasing the fatigue life. This study provides data verifying practicality of this approach. The measured peak strain and acceleration response of the fundamental out of plane bending mode was significantly attenuated by adding a PID device. Attenuation of this mode is most relevant to the fatigue life of a PWA because the local relative displacements between the board and the supported components, which ultimately cause fatigue failures of the electrical leads of the board-mounted components are dominated by this mode. Applying PID damping at the board-level of assembly provides mitigation with a very small mass impact, especially as compared to isolation at an avionics box or shelf level of assembly. When compared with other mitigation techniques at the PWA level (board thickness, stiffeners, constrained layer damping), a compact PID device has the additional advantage of not needing to be an integral part of the design. A PID can simply be bonded to heritage or commercial off the shelf (COTS) hardware to facilitate its use in environments beyond which it was originally qualified. Finite element analysis and test results show that the beneficial effect is not localized and that the attenuation is not due to the simple addition of mass. No significant, detrimental reduction in frequency was observed. Side-by-side life testing of damped and un-damped boards at two different thicknesses (0.070" and 0.090") has shown that the addition of a PID was much more significant to the fatigue life than increasing the thickness. High speed video, accelerometer, and strain measurements have been collected to correlate with analytical results.

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

Directory of Open Access Journals (Sweden)

Domenico Capriglione

2018-03-01

Full Text Available This paper deals with the electromagnetic compatibility (EMC issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs. These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc., based on the Integrated Circuit Emission Model template (ICEM. As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

Science.gov (United States)

Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

2012-06-01

The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

Energy Technology Data Exchange (ETDEWEB)

Olesen, S. T.

1971-11-15

The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

Grounding and shielding circuits and interference

CERN Document Server

Morrison, Ralph

2016-01-01

Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field.

JPRS Report, Science & Technology Europe.

Science.gov (United States)

1988-07-01

tem for autonomous, driverless transport systems. An assembly cell for parts insertion and soldering of circuit boards using several industrial...34 For material handling, the circuit board manufacturing process was connected by a driverless transport system without lane lines; the IPA study

Multiple-Objective Particle Swarm Optimization for Multi-Head Beam-Type Surface Mounting Machines

NARCIS (Netherlands)

Torabi, S.A.; Hamedi, M.; Ashayeri, J.

2010-01-01

The growing demand for electronic devices has made the manufacturing of printed circuit boards (PCBs) a promising industry over the last decades. As the demand for printed circuit boards increases, the industry becomes more dependent on highly automated assembly processes using Surface Mounting

Prioritizing material recovery for end-of-life printed circuit boards

International Nuclear Information System (INIS)

Wang Xue; Gaustad, Gabrielle

2012-01-01

Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

Digital Circuit Analysis Using an 8080 Processor.

Science.gov (United States)

Greco, John; Stern, Kenneth

1983-01-01

Presents the essentials of a program written in Intel 8080 assembly language for the steady state analysis of a combinatorial logic gate circuit. Program features and potential modifications are considered. For example, the program could also be extended to include clocked/unclocked sequential circuits. (JN)

Effects of smoke on functional circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1997-10-01

Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

Science.gov (United States)

Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

2015-01-01

For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

Science.gov (United States)

Wang, Jianbo; Xu, Zhenming

2015-01-20

Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

Circuit bridging of components by smoke

International Nuclear Information System (INIS)

Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J.

1996-10-01

Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmental conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO 2 as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

Energy Technology Data Exchange (ETDEWEB)

Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

2016-07-05

Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

2014-05-30

The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

International Nuclear Information System (INIS)

Quan Cui; Li Aimin; Gao Ningbo

2010-01-01

The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

Compressed Air System Enhancement Increases Efficiency and Provides Energy Savings at a Circuit Board Manufacturer (Sanmina Plant, Oswego, New York): Office of Industrial Technologies (OIT) BestPractices Technical Case Study

International Nuclear Information System (INIS)

Wogsland, J.

2001-01-01

This case study is one in a series on industrial firms who are implementing energy efficient technologies and system improvements into their manufacturing processes. This case study documents the activities, savings, and lessons learned on the circuit board manufacturer (Sanmina Plant) project

78 FR 75360 - Notice of Issuance of Final Determination Concerning Certain Ethernet Switches

Science.gov (United States)

2013-12-11

... printed circuit board assembly (``PCBA''), chassis, top cover, power supply, and fans. The switches... printed circuit board is populated with various electronic components to make a PCBA. 2. The PCBA is... Singapore. You argue that without the EOS software, the units exported from Singapore lack the intelligence...

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

Science.gov (United States)

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

Pulverulent deposits on fuel assemblies in primary circuit on 2 units at EDF (France)

International Nuclear Information System (INIS)

Zatla, A.; Piana, O.

2015-01-01

In march 2013, during the moving of some fuel assemblies in the fuel deactivation pool of two units nuclear power plants (Blayais 4 and Chinon B2 units), some fine and powdery deposits in suspension have been observed. In the two cases, the fuel has stayed in the deactivation pool during a long time (12 and 3 months), the units have started for the first time to inject Zinc in the primary circuit in the beginning of the precedent fuel cycle, and the units have operated an extended fuel cycle. EDF has performed analysis to evaluate the harmfulness of the particles and to investigate the mechanisms involved in this phenomenon. 3 conclusions can be drawn. First, the deposits are made up of usual corrosion products issued from the primary circuit components. Secondly, the chemical composition and the powdery characteristics of the deposits exclude nuclear safety risks. Thirdly, the atypical behaviour of the deposits could probably be linked with a modification of their structure due to a zinc effect. Because of the lack of new understanding elements, the extension of zinc injection to other NPP units has been broken off currently in France. EDF is studying the international experience feedback to identify the operating parameters of the nuclear power plant which might influent the phenomenon, and to evaluate if the deposits could enhance fuel cladding corrosion

Circuit design techniques for non-crystalline semiconductors

CERN Document Server

Sambandan, Sanjiv

2012-01-01

Despite significant progress in materials and fabrication technologies related to non-crystalline semiconductors, fundamental drawbacks continue to limit real-world application of these devices in electronic circuits. To help readers deal with problems such as low mobility and intrinsic time variant behavior, Circuit Design Techniques for Non-Crystalline Semiconductors outlines a systematic design approach, including circuit theory, enabling users to synthesize circuits without worrying about the details of device physics. This book: Offers examples of how self-assembly can be used as a powerf

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

International Nuclear Information System (INIS)

Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

2014-01-01

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

Energy Technology Data Exchange (ETDEWEB)

Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

2014-05-15

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

Single-mode glass waveguide technology for optical interchip communication on board level

Science.gov (United States)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a

Study on characteristics of printed circuit board liberation and its crushed products.

Science.gov (United States)

Quan, Cui; Li, Aimin; Gao, Ningbo

2012-11-01

Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Science.gov (United States)

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

Science.gov (United States)

Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

2011-01-01

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

Science.gov (United States)

Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

2016-11-01

An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

Quality control process improvement of flexible printed circuit board by FMEA

Science.gov (United States)

Krasaephol, Siwaporn; Chutima, Parames

2018-02-01

This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

Science.gov (United States)

Jadhav, Umesh; Su, C; Hocheng, Hong

2016-12-01

In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

International Nuclear Information System (INIS)

Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

2009-01-01

Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

78 FR 69927 - SJI Board of Directors Meeting, Notice

Science.gov (United States)

2013-11-21

... STATE JUSTICE INSTITUTE SJI Board of Directors Meeting, Notice AGENCY: State Justice Institute. ACTION: Notice of meeting. SUMMARY: The SJI Board of Directors will be meeting on Monday, December 9, 2013 at 1:00 p.m. The meeting will be held at the 9th Judicial Circuit of Florida in Orlando, Florida...

Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

International Nuclear Information System (INIS)

Guo Jie; Rao Qunli; Xu Zhenming

2008-01-01

The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

Science.gov (United States)

Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

2009-10-15

This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

Space Time – Track Circuits with Trellis Code Modulation

Directory of Open Access Journals (Sweden)

Marius Enulescu

2017-07-01

Full Text Available The track circuits are very important equipments used in the railway transportation system. Today these are used to send vital information, to the running train, in the same time with the integrity checking of the rail. The actual track circuits have a small problem due to the use of the same transmission medium by the signals containing vital information and the return traction current, the running track rails. But this small problem can produce big disturbances in the train circulation, especially in the rush hours. To improve the data transmission to the train on-board equipment, the implementation of new track circuits using new communication technology were studied. This technology is used by the mobile and satellite communications and applies the principle of diversity encoding both time and space through the use of multiple transmission points of the track circuit signal for telegram which is sent to the train. Since this implementation does not satisfy the intended purpose, other modern communication principles such as 8PSK signals modulation and encoding using Trellis Coded Modulation were developed. This new track circuit aims to solve the problems which appeared in the current operation of track circuits and theoretically manages to transmit vital information to the train on board equipment without being affected by disturbances in electric traction transport systems.

Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

International Nuclear Information System (INIS)

Stafford, F.N.; Hotza, D.

2012-01-01

Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

Science.gov (United States)

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Evolvable designs of experiments applications for circuits

CERN Document Server

Iordache, Octavian

2009-01-01

Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

Detection of transient disturbing signals on PC boards

Directory of Open Access Journals (Sweden)

S. Korte

2008-05-01

Full Text Available This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed.

Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

Science.gov (United States)

Fuh, Yiin-Kuen; Ho, Hsi-Chun

2016-03-04

In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

Science.gov (United States)

Fuh, Yiin-Kuen; Ho, Hsi-Chun

2016-03-01

In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

Photonic hybrid assembly through flexible waveguides

NARCIS (Netherlands)

Wörhoff, Kerstin; Prak, Albert; postma, F; Leinse, A; Wu, K.; Peters, T.J.; Tichem, M.; Amaning-Appiah, B.; Renukappa, V.; Vollrath, G.; Balcells-Ventura, J.; Uhlig, P.; Seyfried, M.; Rose, D.; Santos, Raquel; Leijtens, XJM; Flintham, B.; Wale, M.; Robbins, D.; Vivien, Laurent; Pavesi, Lorenzo; Pelli, Stefano

2016-01-01

Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1

Measurements of the Effects of Smoke on Active Circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1999-01-01

Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The U.S. Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformably coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 MOmega) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the cent acts were corroded. However, the change was very small (< 2%). The stray-capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

Measurements of the effects of smoke on active circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1998-01-01

Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The US Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformally coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 Mohm) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the contacts were corroded. However, the change was very small (< 2%). The stray capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

Discharge quenching circuit for counters

International Nuclear Information System (INIS)

Karasik, A.S.

1982-01-01

A circuit for quenching discharges in gas-discharge detectors with working voltage of 3-5 kV based on transistors operating in the avalanche mode is described. The quenching circuit consists of a coordinating emitter follower, amplifier-shaper for avalanche key cascade control which changes potential on the counter electrodes and a shaper of discharge quenching duration. The emitter follower is assembled according to a widely used flowsheet with two transistors. The circuit permits to obtain a rectangular quenching pulse with front of 100 ns and an amplitude of up to 3.2 kV at duration of 500 μm-8 ms. Application of the quenching circuit described permits to obtain countering characteristics with the slope less than or equal to 0.02%/V and plateau extent greater than or equal to 300 V [ru

Photonic hybrid assembly through flexible waveguides

NARCIS (Netherlands)

Wörhoff, K.; Prak, A.; Postma, F.; Leinse, A.; Wu, K.; Peters, T. J.; Tichem, M.; Amaning-Appiah, B.; Renukappa, V.; Vollrath, G.; Balcells-Ventura, J.; Uhlig, P.; Seyfried, M.; Rose, D.; Santos, R.; Leijtens, X.J.M.; Flintham, B.; Wale, M.; Robbins, D.

2016-01-01

Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm)

Resin intrusion into the primary circuit of NPP Jaslovske Bohunice V-1

International Nuclear Information System (INIS)

Grezdo, O.; Mraz, V.

2005-01-01

During the refueling at the first unit of Bohunice NPP in 2005 a lot of sediment was found on the upper storage rack. This sediment was identification as a filter resin. Resin was found in most of the fuel assemblies, pipes and tanks of the primary circuit and his auxiliary systems. Resin producer and WANO network was contacted in order to get information about similar events. Management of Bohunice NPP made a decision that primary circuit, fuel assemblies and auxiliary systems have to be cleaned. Subsequent cleaning extended outage by 31 days. This paper summarizes causes, existing consequences and corrective actions. Accent was put on the hydraulic characteristics of the primary circuit measurement, power distribution core monitoring and the primary circuit water quality verification (Authors)

An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

Energy Technology Data Exchange (ETDEWEB)

Vianco, P.T.

1998-10-15

A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

Turbine combustor with fuel nozzles having inner and outer fuel circuits

Science.gov (United States)

Uhm, Jong Ho; Johnson, Thomas Edward; Kim, Kwanwoo

2013-12-24

A combustor cap assembly for a turbine engine includes a combustor cap and a plurality of fuel nozzles mounted on the combustor cap. One or more of the fuel nozzles would include two separate fuel circuits which are individually controllable. The combustor cap assembly would be controlled so that individual fuel circuits of the fuel nozzles are operated or deliberately shut off to provide for physical separation between the flow of fuel delivered by adjacent fuel nozzles and/or so that adjacent fuel nozzles operate at different pressure differentials. Operating a combustor cap assembly in this fashion helps to reduce or eliminate the generation of undesirable and potentially harmful noise.

IE Information Notice No. 85-18, Supplement 1: Failures of undervoltage output circuit boards in the Westinghouse-designed solid state protection system

International Nuclear Information System (INIS)

Rossi, C.E.

1992-01-01

The US Nuclear Regulatory Commission (NRC) is issuing this information notice supplement to alert addressees to continuing problems associated with the undervoltage (UV) output circuit boards (driver cards) in the solid state protection system (SSPS) designed by the Westinghouse Electric Corporation (Westinghouse). On June 3, 1991, the Shearon Harris Nuclear Power Plant, Unit 1, (Harris) experienced an automatic reactor trip from 100 percent power on a spurious low reactor coolant system loop flow signal. The signal was generated as a result of a surveillance test being performed on one of three loop flow transmitters. The licensee attributed the spurious signal to both procedural inadequacies and personnel error. A control room operator verified that all control rods had fully inserted following the trip signal and that reactor power was properly decreasing. However, about 22 seconds after the automatic trip signal was generated, operators discovered that the ''A'' reactor trip breaker (RTB) had not opened. The RTB was manually opened using the reactor trip switch on the main control board. Subsequent analyses are discussed

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

Directory of Open Access Journals (Sweden)

Waldir A. Bizzo

2014-06-01

Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

A full feature FASTBUS slave interface using semicustom integrated circuits

International Nuclear Information System (INIS)

Skegg, R.; Daviel, A.; Downing, R.

1986-01-01

Two semi-custom integrated circuits have been designed and manufactured which enable the construction of a full featured FASTBUS slave interface without the need for a detailed knowledge of the FASTBUS protocol. A relatively small amount of board space is required compared to implementations using conventional circuits. The semi-custom devices are described in detail, and an application example is given. (orig.)

Elements configuration of the open lead test circuit

International Nuclear Information System (INIS)

Fukuzaki, Yumi; Ono, Akira

2016-01-01

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Elements configuration of the open lead test circuit

Energy Technology Data Exchange (ETDEWEB)

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp [Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan); Ono, Akira [Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)

2016-07-06

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

Science.gov (United States)

Petter, P M H; Veit, H M; Bernardes, A M

2014-02-01

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

International Nuclear Information System (INIS)

Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

2010-01-01

The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

Vacuum die attach for integrated circuits

Science.gov (United States)

Schmitt, E.H.; Tuckerman, D.B.

1991-09-10

A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die, and an IR lamp or other heat source. For bonding a silicon die to a silicon substrate, a gold silicon alloy bond is used. Multiple dies can be bonded simultaneously. No scrubbing is required. 1 figure.

Design, Assembly, Integration, and Testing of a Power Processing Unit for a Cylindrical Hall Thruster, the NORSAT-2 Flatsat, and the Vector Gravimeter for Asteroids Instrument Computer

Science.gov (United States)

Svatos, Adam Ladislav

This thesis describes the author's contributions to three separate projects. The bus of the NORSAT-2 satellite was developed by the Space Flight Laboratory (SFL) for the Norwegian Space Centre (NSC) and Space Norway. The author's contributions to the mission were performing unit tests for the components of all the spacecraft subsystems as well as designing and assembling the flatsat from flight spares. Gedex's Vector Gravimeter for Asteroids (VEGA) is an accelerometer for spacecraft. The author's contributions to this payload were modifying the instrument computer board schematic, designing the printed circuit board, developing and applying test software, and performing thermal acceptance testing of two instrument computer boards. The SFL's cylindrical Hall effect thruster combines the cylindrical configuration for a Hall thruster and uses permanent magnets to achieve miniaturization and low power consumption, respectively. The author's contributions were to design, build, and test an engineering model power processing unit.

Development of electron beam deflection circuit

International Nuclear Information System (INIS)

Leo Kwee Wah; Lojius Lombigit; Abu Bakar Ghazali; Azaman

2007-01-01

This paper describes a development of a power supply circuit to deflect and move the electron beam across the window of the Baby electron beam machine. It comprises a discussion of circuit design, its assembly and the test results. A variety of input and output conditions have been tested and it was found that the design is capable to supply 1.0 A with 50Hz on X-axis coil and 0.4A with 500Hz on Y-axis coil. (Author)

Display-And-Alarm Circuit For Accelerometer

Science.gov (United States)

Bozeman, Richard J., Jr.

1995-01-01

Compact accelerometer assembly consists of commercial accelerometer retrofit with display-and-alarm circuit. Provides simple means for technician attending machine to monitor vibrations. Also simpifies automatic safety shutdown by providing local alarm or shutdown signal when vibration exceeds preset level.

Experimental Study of WBFC method for testing electromagnetic immunity of integrated circuits

OpenAIRE

香川, 直己; カガワ, ナオキ; Naoki, KAGAWA

2004-01-01

The author made a workbench faraday cage, WBFC, in order to estimate performance of the WBFC method for the measurement of common mode noise immunity of integrated circuits. In this report, characteristics of the constructed workbench faraday cage and results of experimental study of effects of the common mode noise on a circuit board including an electronic device are shown. Selected DUT, LM324 is popular operational amplifier for electrical circuits in vehicles.

At grade optical crossover for monolithic optial circuits

Science.gov (United States)

Jamieson, Robert S. (Inventor)

1983-01-01

Planar optical circuits may be made to cross through each other, (thus eliminating extra steps required to fabricate elevated, nonintersecting crossovers) by control of the dimensions of the crossing light conductors (10, 12) to be significantly greater than d=0.89.lambda. and the angle of crossing as nearly 90.degree. as conveniently possible. A light trap may be provided just ahead of the intersection to trap any light being reflected in the source conductor at angles greater than about 45.degree.. The light trap may take the form of triangular shaped portions (16a, 16b) on each side of the source conductor with the far side of the triangular portion receiving incident light at an angle so that incident light will be reflected to the other side, or it may take the form of windows (18a, 18b) in place of the triangular portions. Planar optical circuit boards (21-23) may be fabricated and stacked to form a keyboard (20) with intersecting conductors (26-29) and keyholes (0-9) where conductors merge at the broad side of the circuit boards. These keyholes may be prearranged to form an array or matrix of keyholes.

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

DEFF Research Database (Denmark)

Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2016-01-01

No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

Lithographic technology for microwave integrated circuits

OpenAIRE

Shepherd, PR; Evans, PSA; Ramsey, BJ; Harrison, DJ

1997-01-01

Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs.

Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

International Nuclear Information System (INIS)

Han, Won Seok; Lee, Jae Young

2012-01-01

Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

Science.gov (United States)

Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

2018-02-01

Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

Advanced engineering materials and thick film hybrid circuit technology

International Nuclear Information System (INIS)

Faisal, S.; Aslam, M.; Mehmood, K.

2006-01-01

The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

Experience with construction and assembly of V-1 nuclear power plant

International Nuclear Information System (INIS)

Prochazka, J.; Stepanek, S.; Drahy, J.

1981-01-01

The model is discussed of the constructions of the V-1 nuclear power plant at Jaslovske Bohunice with SKODA Trust fulfilling the role of the general supplier of the secondary part technology and the chief and special assembly contractor. The SKODA Trust mediated the Soviet supplies of technology, Soviet assembly and special assembly, and the mounting of the primary part according to Soviet projects. Plant start-up was safeguarded by the investor through Bohunice power plant staff and Soviet experts. The assembly of the primary circuit and the test assembly of reactor parts are described and the experience gained is discussed. The technological requirements are illustrated by the most important characteristics of the individual parts of the primary circuit. Also described are the design specifications of the 220 MW saturated steam turbine and the experience with its assembly and start-up. (B.S.)

Integrating DNA strand-displacement circuitry with DNA tile self-assembly

Science.gov (United States)

Zhang, David Yu; Hariadi, Rizal F.; Choi, Harry M.T.; Winfree, Erik

2013-01-01

DNA nanotechnology has emerged as a reliable and programmable way of controlling matter at the nanoscale through the specificity of Watson–Crick base pairing, allowing both complex self-assembled structures with nanometer precision and complex reaction networks implementing digital and analog behaviors. Here we show how two well-developed frameworks, DNA tile self-assembly and DNA strand-displacement circuits, can be systematically integrated to provide programmable kinetic control of self-assembly. We demonstrate the triggered and catalytic isothermal self-assembly of DNA nanotubes over 10 μm long from precursor DNA double-crossover tiles activated by an upstream DNA catalyst network. Integrating more sophisticated control circuits and tile systems could enable precise spatial and temporal organization of dynamic molecular structures. PMID:23756381

Experimental industrial signal acquisition board in a large scientific device

Science.gov (United States)

Zeng, Xiangzhen; Ren, Bin

2018-02-01

In order to measure the industrial signal of neutrino experiment, a set of general-purpose industrial data acquisition board has been designed. It includes the function of switch signal input and output, and the function of analog signal input. The main components are signal isolation amplifier and filter circuit, ADC circuit, microcomputer systems and isolated communication interface circuit. Through the practical experiments, it shows that the system is flexible, reliable, convenient and economical, and the system has characters of high definition and strong anti-interference ability. Thus, the system fully meets the design requirements.

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

International Nuclear Information System (INIS)

Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

2013-01-01

Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

Directory of Open Access Journals (Sweden)

Eun Hye Yuk

2018-06-01

Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

Science.gov (United States)

Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

2018-04-01

Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

Tin Whisker Testing and Modeling

Science.gov (United States)

2015-11-01

to 25°C/85%RH. The greatest whisker nucleation and growth occurred on the Cu alloy lead terminations. During high humidity isothermal exposure...Circuits, Lead-Free Solder, Electronic Assembly, Humidity Exposure, Thermal Cycling, Corrosion, Contamination, Whisker Length Statistics 16. SECURITY...rework fluxes, and immersion Sn finished Cu circuit board pads. The assemblies were exposed to various thermal cycling and isothermal high humidity and

Circuit card failures and industry mitigation strategy

Energy Technology Data Exchange (ETDEWEB)

Mondal, U. [Candu Owners Group, Toronto, Ontario (Canada)

2012-07-01

In recent years the nuclear industry has experienced an increase in circuit card failures due to ageing of components, inadequate Preventive Maintenance (PM), lack of effective circuit card health monitoring, etc. Circuit card failures have caused loss of critical equipment, e.g., electro hydraulic governors, Safety Systems, resulting in loss of function and in some cases loss of generation. INPO completed a root cause analysis of 40 Reactor Trips/Scrams in US reactors and has recommended several actions to mitigate Circuit Card failures. Obsolescence of discrete components has posed many challenges in conducting effective preventative maintenance on circuit cards. In many cases, repairs have resulted in installation of components that compromise performance of the circuit cards. Improper termination and worn edge connectors have caused intermittent contacts contributing to circuit card failures. Traditionally, little attention is paid to relay functions and preventative maintenance of relay. Relays contribute significantly to circuit card failures and have dominated loss of generation across the power industry. The INPO study recommended a number of actions to mitigate circuit card failures, such as; identification of critical components and single point vulnerabilities; strategic preventative maintenance; protection of circuit boards against electrostatic discharge; limiting power cycles; performing an effective burn-in prior to commissioning of the circuit cards; monitoring performance of DC power supplies; limiting cabinet temperatures; managing of component aging/degradation mechanism, etc. A subcommittee has been set up under INPO sponsorship to understand the causes of circuit card failure and to develop an effective mitigation strategy. (author)

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Science.gov (United States)

Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

2016-06-01

While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

Multiplication circuit for particle identification

International Nuclear Information System (INIS)

Gerlier, Jean

1962-01-01

After having commented some characteristics of the particles present in a cyclotron, and their interactions, this report addresses the development and the implementation of a method and a device for selecting and counting particles. The author presents the principle and existing techniques of selection. In comparison with an existing device, the proportional counter and the scintillator are replaced by junctions: a surface barrier type junction (a silicon N layer with a very thin oxygen layer playing the role of the P layer), and lithium-based junction (a silicon P type layer made intrinsic by migration of lithium). The author then describes the developed circuit and assembly (background of the choice of a multiplication circuit), and their operation. In the next part, he presents the performed tests and discuses the obtained results. He finally outlines the benefits of the herein presented circuit [fr

Microprocessor-based single board computer for high energy physics event pattern recognition

International Nuclear Information System (INIS)

Bernstein, H.; Gould, J.J.; Imossi, R.; Kopp, J.K.; Love, W.A.; Ozaki, S.; Platner, E.D.; Kramer, M.A.

1981-01-01

A single board MC 68000 based computer has been assembled and bench marked against the CDC 7600 running portions of the pattern recognition code used at the MPS. This computer has a floating coprocessor to achieve throughputs equivalent to several percent that of the 7600. A major part of this work was the construction of a FORTRAN compiler including assembler, linker and library. The intention of this work is to assemble a large number of these single board computers in a parallel FASTBUS environment to act as an on-line and off-line filter for the raw data from MPS II and ISABELLE experiments

Circuit bridging of digital equipment caused by smoke from a cable fire

International Nuclear Information System (INIS)

Tanaka, T.J.; Anderson, D.J.

1997-01-01

Advanced reactor systems are likely to use protection systems with digital electronics that ideally should be resistant to environmental hazards, including smoke from possible cable fires. Previous smoke tests have shown that digital safety systems can fail even at relatively low levels of smoke density and that short-term failures are likely to be caused by circuit bridging. Experiments were performed to examine these failures, with a focus on component packaging and protection schemes. Circuit bridging, which causes increased leakage currents and arcs, was gauged by measuring leakage currents among the leads of component packages. The resistance among circuit leads typically varies over a wide range, depending on the nature of the circuitry between the pins, bias conditions, circuit board material, etc. Resistance between leads can be as low as 20 kΩ and still be good, depending on the component. For these tests, the authors chose a printed circuit board and components that normally have an interlead resistance above 10 12 Ω, but if the circuit is exposed to smoke, circuit bridging causes the resistance to fall below 10 3 Ω. Plated-through-hole (PTH) and surface-mounted (SMT) packages were exposed to a series of different smoke environments using a mixture of environmentally qualified cables for fuel. Conformal coatings and enclosures were tested as circuit protection methods. High fuel levels, high humidity, and high flaming burns were the conditions most likely to cause circuit bridging. The inexpensive conformal coating that was tested - an acrylic spray - reduced leakage currents, but enclosure in a chassis with a fan did not. PTH packages were more resistant to smoke-induced circuit bridging than SMT packages. Active components failed most often in tests where the leakage currents were high, but failure did not always accompany high leakage currents

Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

Energy Technology Data Exchange (ETDEWEB)

Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

2014-04-01

Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

Nanophotonic integrated circuits from nanoresonators grown on silicon.

Science.gov (United States)

Chen, Roger; Ng, Kar Wei; Ko, Wai Son; Parekh, Devang; Lu, Fanglu; Tran, Thai-Truong D; Li, Kun; Chang-Hasnain, Connie

2014-07-07

Harnessing light with photonic circuits promises to catalyse powerful new technologies much like electronic circuits have in the past. Analogous to Moore's law, complexity and functionality of photonic integrated circuits depend on device size and performance scale. Semiconductor nanostructures offer an attractive approach to miniaturize photonics. However, shrinking photonics has come at great cost to performance, and assembling such devices into functional photonic circuits has remained an unfulfilled feat. Here we demonstrate an on-chip optical link constructed from InGaAs nanoresonators grown directly on a silicon substrate. Using nanoresonators, we show a complete toolkit of circuit elements including light emitters, photodetectors and a photovoltaic power supply. Devices operate with gigahertz bandwidths while consuming subpicojoule energy per bit, vastly eclipsing performance of prior nanostructure-based optoelectronics. Additionally, electrically driven stimulated emission from an as-grown nanostructure is presented for the first time. These results reveal a roadmap towards future ultradense nanophotonic integrated circuits.

Modernization of the memory board of an x-ray spectrometer

International Nuclear Information System (INIS)

Dutra Neto, A.; Dias, A.G.; Marra, J.G.

1992-01-01

This paper presents the design of a constant memory board for the Rigaku X-ray fluorescence spectroscopy, model 3064. This spectroscopy has been used to mineral analysis and materials characterization. It has been applied for elements instrumental analysis in mineral, metallic, ceramic, environmental samples and alloys. The memory board stores the elements sequence to be analyzed in the samples. It allows the automatic continuous operation of the spectroscopy and can be used as temporary register by the system. The spectroscopy data memory was composed by two permanent memory board with magnetic cores. The new memory board has a solid state static RAM, a data bus buffer, control and a special circuit to supply continuous power to the memory. (author)

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2014-05-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

International Nuclear Information System (INIS)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

2014-01-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

Capacitive short circuit detection in transformer core laminations

International Nuclear Information System (INIS)

Schulz, Carl A.; Duchesne, Stephane; Roger, Daniel; Vincent, Jean-Noel

2008-01-01

A capacitive measurement procedure is proposed that serves to detect burr-induced short circuits in transformer core laminations. The tests are conducted on stacks of transformer steel sheets as used for transformer core production and yield a short-circuit probability indicative of the additional eddy current losses to be expected. Applied during the assembly of transformer cores, the measurements can help to decide whether the burr treatment process is working efficiently or has to be readjusted

Optical matrix for nuclear fuel assemblies

International Nuclear Information System (INIS)

Romero G, M.; Gonzaga O, A.

1996-01-01

In order to detect the presence of fuel rods, it was selected a reflection optical transducer, which provides a measurable electrical signal when the beam at a certain distance is interrupted then there is a reflection causing a excitation to the sensor that provides a change of state at the output of transducer. This step is coupled through an operational amplifier which drives the opto coupler circuit isolating this step of the interface and a personal computer. This work presents the description of components, designs, signal coupler and opto isolater circuit, interface circuit and tutorial assemble program. (Author)

Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy

Science.gov (United States)

Schröder, H.; Neitz, M.; Schneider-Ramelow, M.

2018-02-01

Due to its optical transparency and superior dielectric properties glass is regarded as a promising candidate for advanced applications as active photonic interposer for mid-board-optics and optical PCB waveguide integration. The concepts for multi-mode and single-mode photonic system integration are discussed and related demonstration project results will be presented. A hybrid integrated photonic glass body interposer with integrated optical lenses for multi-mode data communication wavelength of 850 nm have been realized. The paper summarizes process developments which allow cost efficient metallization of TGV. Electro-optical elements like photodiodes and VCSELs can be directly flip-chip mounted on the glass substrate according to the desired lens positions. Furthermore results for a silicon photonic based single-mode active interposer integration onto a single mode glass made EOCB will be compared in terms of packaging challenges. The board level integration strategy for both of these technological approaches and general next generation board level integration concepts for photonic interposer will be introductorily discussed.

Methods of assembling large magnetic blocks from NdFeB magnets with a high value of (BH)max and their influence on the magnetic induction reached in an air gap of magnetic circuit

Czech Academy of Sciences Publication Activity Database

Žežulka, Václav; Straka, Pavel

2008-01-01

Roč. 44, č. 4 (2008), s. 485-491 ISSN 0018-9464 Institutional research plan: CEZ:AV0Z30460519 Keywords : assembly * demagnetization * magnet ic circuits Subject RIV: BM - Solid Matter Physics ; Magnet ism Impact factor: 1.129, year: 2008

Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

Science.gov (United States)

Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

2015-07-01

Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

A microprocessor-based single board computer for high energy physics event pattern recognition

International Nuclear Information System (INIS)

Bernstein, H.; Gould, J.J.; Imossi, R.; Kopp, J.K.; Love, W.A.; Ozaki, S.; Platner, E.D.; Kramer, M.A.

1981-01-01

A single board MC 68000 based computer has been assembled and bench marked against the CDC 7600 running portions of the pattern recognition code used at the MPS. This computer has a floating coprocessor to achieve throughputs equivalent to several percent that of the 7600. A major part of this work was the construction of a FORTRAN compiler including assembler, linker and library. The intention of this work is to assemble a large number of these single board computers in a parallel FASTBUS environment to act as an on-line and off-line filter for the raw data from MPS II and ISABELLE experiments. (orig.)

Aqueous corrosion in static capsule tests representing multi-metal assemblies in the hydraulic circuit of Tore Supra

Energy Technology Data Exchange (ETDEWEB)

Lipa, M. [Association Euratom-CEA, CEA/DSM/DRFC, Centre de Cadarache, 13108 Saint-Paul-Lez-Durance (France)], E-mail: manfred.lipa@cea.fr; Blanchet, J.; Feron, D. [CEA/DEN/SCCME, Centre de Saclay, 91191 Gif sur Yvette (France); Cellier, F. [AREVA ANP, Centre Technique, 71380 Saint Marcel (France)

2008-12-15

Tore supra (TS) in vessel components represent a unique combination of metals in the hydraulic circuit. Different materials, e.g. stainless steel, copper alloys, nickel, etc., were joined together by fusion welding, brazing and friction. Since the operation and baking temperature of all in vessel components has been defined to be set at 230 deg. C/40 bars a special water chemistry of the cooling water loop was suggested in order to prevent eventual water leaks due to corrosion at relative high temperatures and pressures in tubes, bellows, coils and coolant plant ancillary equipments. Following experiences with water chemistry in Pressurised Water Reactors, an all volatile chemical treatment (AVT) has been defined for the cooling water quality of TS. Since then, a simplified static (no fluid circulation) corrosion test program at relatively high temperature and pressure has been performed using capsule-type samples made of above mentioned multi-metal assemblies.

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

Energy Technology Data Exchange (ETDEWEB)

Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

2012-06-15

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

One-Step Laser Patterned Highly Uniform Reduced Graphene Oxide Thin Films for Circuit-Enabled Tattoo and Flexible Humidity Sensor Application

Directory of Open Access Journals (Sweden)

Rowoon Park

2018-06-01

Full Text Available The conversion of graphene oxide (GO into reduced graphene oxide (rGO is imperative for the electronic device applications of graphene-based materials. Efficient and cost-effective fabrication of highly uniform GO films and the successive reduction into rGO on a large area is still a cumbersome task through conventional protocols. Improved film casting of GO sheets on a polymeric substrate with quick and green reduction processes has a potential that may establish a path to the practical flexible electronics. Herein, we report a facile deposition process of GO on flexible polymer substrates to create highly uniform thin films over a large area by a flow-enabled self-assembly approach. The self-assembly of GO sheets was successfully performed by dragging the trapped solution of GO in confined geometry, which consisted of an upper stationary blade and a lower moving substrate on a motorized translational stage. The prepared GO thin films could be selectively reduced and facilitated from the simple laser direct writing process for programmable circuit printing with the desired configuration and less sample damage due to the non-contact mode operation without the use of photolithography, toxic chemistry, or high-temperature reduction methods. Furthermore, two different modes of the laser operating system for the reduction of GO films turned out to be valuable for the construction of novel graphene-based high-throughput electrical circuit boards compatible with integrating electronic module chips and flexible humidity sensors.

A deadtime reduction circuit for thermal neutron coincidence counters with Amptek preamplifiers

International Nuclear Information System (INIS)

Bourret, S.C.; Krick, M.S.

1994-01-01

We have developed a deadtime reduction circuit for thermal neutron coincidence counters using Amptek preamplifier/amplifier/discriminator circuits. The principle is to remove the overlap between the output pulses from the Amptek circuits by adding a derandomizer between the Amptek circuits and the shift-register coincidence electronics. We implemented the derandomizer as an Actel programmable logic array; the derandomizer board is small and can be mounted in the high-voltage junction box with the Amptek circuits, if desired. Up to 32 Amptek circuits can be used with one derandomizer. The derandomizer has seven outputs: four groups of eight inputs, two groups of 16 inputs, and one group of 32 inputs. We selected these groupings to facilitate detector ring-ratio measurements. The circuit was tested with the five-ring research multiplicity counter, which has five output signals-one for each ring. The counter's deadtime was reduced from 70 to 30 ns

The Versatile Link Demo Board (VLDB)

International Nuclear Information System (INIS)

Lesma, R. Martín; Alessio, F.; Barbosa, J.; Baron, S.; Caplan, C.; Leitao, P.; Porret, D.; Wyllie, K.; Pecoraro, C.

2017-01-01

The Versatile Link Demonstrator Board (VLDB) is the evaluation kit for the radiation-hard Optical Link ecosystem, which provides a 4.8 Gbps data transfer link for communication between front-end (FE) and back-end (BE) of the High Energy Physics experiments. It gathers the Versatile link main radiation-hard custom Application-Specific Integrated Circuits (ASICs) and modules: GBTx, GBT-SCA and VTRx/VTTx plus the FeastMP, a radiation-hard in-house designed DC-DC converter. This board is the first design allowing system-level tests of the Link with a complete interconnection of the constitutive components, allowing data acquisition, control and monitoring of FE devices with the GBT-SCA pair.

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

International Nuclear Information System (INIS)

Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

2014-01-01

Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

Two cell circuits of oriented adult hippocampal neurons on self-assembled monolayers for use in the study of neuronal communication in a defined system.

Science.gov (United States)

Edwards, Darin; Stancescu, Maria; Molnar, Peter; Hickman, James J

2013-08-21

In this study, we demonstrate the directed formation of small circuits of electrically active, synaptically connected neurons derived from the hippocampus of adult rats through the use of engineered chemically modified culture surfaces that orient the polarity of the neuronal processes. Although synaptogenesis, synaptic communication, synaptic plasticity, and brain disease pathophysiology can be studied using brain slice or dissociated embryonic neuronal culture systems, the complex elements found in neuronal synapses makes specific studies difficult in these random cultures. The study of synaptic transmission in mature adult neurons and factors affecting synaptic transmission are generally studied in organotypic cultures, in brain slices, or in vivo. However, engineered neuronal networks would allow these studies to be performed instead on simple functional neuronal circuits derived from adult brain tissue. Photolithographic patterned self-assembled monolayers (SAMs) were used to create the two-cell "bidirectional polarity" circuit patterns. This pattern consisted of a cell permissive SAM, N-1[3-(trimethoxysilyl)propyl] diethylenetriamine (DETA), and was composed of two 25 μm somal adhesion sites connected with 5 μm lines acting as surface cues for guided axonal and dendritic regeneration. Surrounding the DETA pattern was a background of a non-cell-permissive poly(ethylene glycol) (PEG) SAM. Adult hippocampal neurons were first cultured on coverslips coated with DETA monolayers and were later passaged onto the PEG-DETA bidirectional polarity patterns in serum-free medium. These neurons followed surface cues, attaching and regenerating only along the DETA substrate to form small engineered neuronal circuits. These circuits were stable for more than 21 days in vitro (DIV), during which synaptic connectivity was evaluated using basic electrophysiological methods.

Nucleic acids for the rational design of reaction circuits.

Science.gov (United States)

Padirac, Adrien; Fujii, Teruo; Rondelez, Yannick

2013-08-01

Nucleic acid-based circuits are rationally designed in vitro assemblies that can perform complex preencoded programs. They can be used to mimic in silico computations. Recent works emphasized the modularity and robustness of these circuits, which allow their scaling-up. Another new development has led to dynamic, time-responsive systems that can display emergent behaviors like oscillations. These are closely related to biological architectures and provide an in vitro model of in vivo information processing. Nucleic acid circuits have already been used to handle various processes for technological or biotechnological purposes. Future applications of these chemical smart systems will benefit from the rapidly growing ability to design, construct, and model nucleic acid circuits of increasing size. Copyright © 2012 Elsevier Ltd. All rights reserved.

Mouldable all-carbon integrated circuits.

Science.gov (United States)

Sun, Dong-Ming; Timmermans, Marina Y; Kaskela, Antti; Nasibulin, Albert G; Kishimoto, Shigeru; Mizutani, Takashi; Kauppinen, Esko I; Ohno, Yutaka

2013-01-01

A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm(2) V(-1) s(-1) and an ON/OFF ratio of 10(5). The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability.

Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

International Nuclear Information System (INIS)

Wang, W.; Kobayashi, T.; Chikushi, J.

2000-01-01

Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

Theory of Connectivity: Nature and Nurture of Cell Assemblies and Cognitive Computation.

Science.gov (United States)

Li, Meng; Liu, Jun; Tsien, Joe Z

2016-01-01

Richard Semon and Donald Hebb are among the firsts to put forth the notion of cell assembly-a group of coherently or sequentially-activated neurons-to represent percept, memory, or concept. Despite the rekindled interest in this century-old idea, the concept of cell assembly still remains ill-defined and its operational principle is poorly understood. What is the size of a cell assembly? How should a cell assembly be organized? What is the computational logic underlying Hebbian cell assemblies? How might Nature vs. Nurture interact at the level of a cell assembly? In contrast to the widely assumed randomness within the mature but naïve cell assembly, the Theory of Connectivity postulates that the brain consists of the developmentally pre-programmed cell assemblies known as the functional connectivity motif (FCM). Principal cells within such FCM is organized by the power-of-two-based mathematical principle that guides the construction of specific-to-general combinatorial connectivity patterns in neuronal circuits, giving rise to a full range of specific features, various relational patterns, and generalized knowledge. This pre-configured canonical computation is predicted to be evolutionarily conserved across many circuits, ranging from these encoding memory engrams and imagination to decision-making and motor control. Although the power-of-two-based wiring and computational logic places a mathematical boundary on an individual's cognitive capacity, the fullest intellectual potential can be brought about by optimized nature and nurture. This theory may also open up a new avenue to examining how genetic mutations and various drugs might impair or improve the computational logic of brain circuits.

Ordinary General Assembly

CERN Multimedia

Staff Association

2011-01-01

Tuesday 12 April at 14.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda   Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 20 April 2010 Presentation and approval of the Activity Report 2010 Presentation and approval of the Financial Report 2010 Presentation and approval of the Auditors Report 2010 Programme for 2011 Presentation et and approval of the draft budget and subscription rate 2012 Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda. Nevertheless, the Assembly ma...

Ordinary General Assembly

CERN Multimedia

Staff Association

2011-01-01

Tuesday 12 April at 14.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda   Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 20 April 2010 Presentation and approval of the Activity Report 2010 Presentation and approval of the Financial Report 2010 Presentation and approval of the Auditors Report 2010 Programme for 2011 Presentation and approval of the draft budget and subscription rate 2012 Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda. Nevertheless, the Assembly may r...

Ordinary General Assembly

CERN Multimedia

Staff Association

2010-01-01

Tuesday 20 April at 10.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda   Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 12 May 2009 Presentation and approval of the Activity Report 2009 Presentation and approval of the Financial Report 2009 Presentation and approval of the Auditors Report 2009 Programme for 2010 Presentation et and approval of the draft budget and subscription rate 2010 Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda. Nevertheless, the Assembly may require t...

Design parameters for voltage-controllable directed assembly of single nanoparticles

NARCIS (Netherlands)

Porter, Benjamin F.; Abelmann, Leon; Bhaskaran, Harish

2013-01-01

Techniques to reliably pick-and-place single nanoparticles into functional assemblies are required to incorporate exotic nanoparticles into standard electronic circuits. In this paper we explore the use of electric fields to drive and direct the assembly process, which has the advantage of being

A study on the development of an automatic fault diagnosis system for testing NPP digital electronic circuits

International Nuclear Information System (INIS)

Kim, Dae Sik

1993-02-01

This paper describes a study on the development of an automatic fault diagnosis system for testing digital electronic circuits of nuclear power plants. Compared with the other conventional fault diagnosis systems, the system described in this paper uses Artificial Intelligence technique of model based reasoning and corroboration, which makes fault diagnosis much more efficient. In order to reduce the testing time, an optimal testing set which means a minimal testing set to determine whether or not the circuit is fault-free and to locate the faulty gate was derived. Compared with the testing using an exhaustive testing set, the testing using the optimal testing set makes fault diagnosis much more fast. Since the system diagnoses the circuit boards bases only on input and output signals, it can be further developed for on-line testing. The system was implemented on a microprocessor and was applied for Universal Circuit board testing of the Solid State protection System in nuclear power plants

Component-Level Electronic-Assembly Repair (CLEAR) Spacecraft Circuit Diagnostics by Analog and Complex Signature Analysis

Science.gov (United States)

Oeftering, Richard C.; Wade, Raymond P.; Izadnegahdar, Alain

2011-01-01

The Component-Level Electronic-Assembly Repair (CLEAR) project at the NASA Glenn Research Center is aimed at developing technologies that will enable space-flight crews to perform in situ component-level repair of electronics on Moon and Mars outposts, where there is no existing infrastructure for logistics spares. These technologies must provide effective repair capabilities yet meet the payload and operational constraints of space facilities. Effective repair depends on a diagnostic capability that is versatile but easy to use by crew members that have limited training in electronics. CLEAR studied two techniques that involve extensive precharacterization of "known good" circuits to produce graphical signatures that provide an easy-to-use comparison method to quickly identify faulty components. Analog Signature Analysis (ASA) allows relatively rapid diagnostics of complex electronics by technicians with limited experience. Because of frequency limits and the growing dependence on broadband technologies, ASA must be augmented with other capabilities. To meet this challenge while preserving ease of use, CLEAR proposed an alternative called Complex Signature Analysis (CSA). Tests of ASA and CSA were used to compare capabilities and to determine if the techniques provided an overlapping or complementary capability. The results showed that the methods are complementary.

Modular assembly of optical nanocircuits

Science.gov (United States)

Shi, Jinwei; Monticone, Francesco; Elias, Sarah; Wu, Yanwen; Ratchford, Daniel; Li, Xiaoqin; Alù, Andrea

2014-05-01

A key element enabling the microelectronic technology advances of the past decades has been the conceptualization of complex circuits with versatile functionalities as being composed of the proper combination of basic ‘lumped’ circuit elements (for example, inductors and capacitors). In contrast, modern nanophotonic systems are still far from a similar level of sophistication, partially because of the lack of modularization of their response in terms of basic building blocks. Here we demonstrate the design, assembly and characterization of relatively complex photonic nanocircuits by accurately positioning a number of metallic and dielectric nanoparticles acting as modular lumped elements. The nanoparticle clusters produce the desired spectral response described by simple circuit rules and are shown to be dynamically reconfigurable by modifying the direction or polarization of impinging signals. Our work represents an important step towards extending the powerful modular design tools of electronic circuits into nanophotonic systems.

SVX Sequencer Board

International Nuclear Information System (INIS)

Utes, M.

1997-01-01

The SVX Sequencer boards are 9U by 280mm circuit boards that reside in slots 2 through 21 of each of eight Eurocard crates in the D0 Detector Platform. The basic purpose is to control the SVX chips for data acquisition and when a trigger occurs, to gather the SVX data and relay the data to the VRB boards in the Movable Counting House. Functions and features are as follows: (1) Initialization of eight SVX chip strings using the MIL-STD-1553 data bus; (2) Real time manipulation of the SVX control lines to effect data acquisition, digitization, and readout based on the NRZ/Clock signals from the Controller; (3) Conversion of 8-bit electrical SVX readout data to an optical signal operating at 1.062 Gbit/sec, sent to the VRB. Eight HDIs will be serviced per board; (4) Built-in logic analyzer which can record the most important control and data lines during a data acquisition cycle and put this recorded information onto the 1553 bus; (5) Identification header and end of data trailer tacked onto data stream; (6) 1553 register which can read the current values of the control and data lines; (7) 1553 register which can test the optical link; (8) 1553 registers for crossing pulse width, calibration pulse voltage, and calibration pipeline select; (9) 1553 register for reading the optical drivers status link; (10) 1553 register for power control of SVX chips and ignoring bad SVX strings; (11) Front panel displays and LEDs show the board status at a glance; (12) In-system programmable EPLDs are programmed via 1553 or Altera's 'Bitblaster'; (13) Automatic readout abort after 45us; (14) Supplies BUSY signal back to Trigger Framework; (15) Supports a heartbeat system to prevent excessive SVX current draw; and (16) Supports a SVX power trip feature if heartbeat failure occurs.

Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

Directory of Open Access Journals (Sweden)

Thomas Maciej

2017-12-01

Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

International Nuclear Information System (INIS)

Xiu Furong; Zhang Fushen

2009-01-01

An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

ONBORD (On-Board Navigation of Ballistic ORDnance): Gun-Launched Munitions Flight Controller

National Research Council Canada - National Science Library

Wilson, Michael

2004-01-01

.... The electronics consist of a single 1.4-inch printed circuit board that includes the Texas Instruments TMS320F2812 digital signal processor whose microcontroller-like capabilities reduce the amount of peripheral circuitry necessary...

Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

Science.gov (United States)

Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

2014-09-01

Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

Science.gov (United States)

Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

2016-08-01

Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

2013-10-01

The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

Theory of Connectivity: Nature and Nurture of Cell Assemblies and Cognitive Computation

Directory of Open Access Journals (Sweden)

Meng eLi

2016-04-01

Full Text Available Richard Semon and Donald Hebb are among the firsts to put forth the notion of cell assembly – a group of coherently or sequentially-activated neurons– to represent percept, memory, or concept. Despite the rekindled interest in this age-old idea, the concept of cell assembly still remains ill-defined and its operational principle is poorly understood. What is the size of a cell assembly? How should a cell assembly be organized? What is the computational logic underlying Hebbian cell assemblies? How might Nature vs Nurture interact at the level of a cell assembly? In contrast to the widely assumed local randomness within the mature but naïve cell assembly, the recent Theory of Connectivity postulates that the brain consists of the developmentally pre-programmed cell assemblies known as the functional connectivity motif (FCM. Principal cells within such FCM is organized by the power-of-two-based mathematical principle that guides the construction of specific-to-general combinatorial connectivity patterns in neuronal circuits, giving rise to a full range of specific features, various relational patterns, and generalized knowledge. This pre-configured canonical computation is predicted to be evolutionarily conserved across many circuits, ranging from these encoding memory engrams and imagination to decision-making and motor control. Although the power-of-two-based wiring and computational logic places a mathematical boundary on an individual’s cognitive capacity, the fullest intellectual potential can be brought about by optimized nature and nurture. This theory may also open up a new avenue to examining how genetic mutations and various drugs might impair or enhance the computational logic of brain circuits.

Nonlinear dynamic response of a 'flexible-and-heavy' printed circuit board (PCB) to an impact load applied to its support contour

International Nuclear Information System (INIS)

Suhir, E; Vujosevic, M; Reinikainen, T

2009-01-01

Based on the developed simple and physically meaningful analytical ('mathematical') stress model, we evaluate some major parameters (amplitude, frequency, maximum acceleration, stresses and strains) of the response of a 'flexible-and-heavy' square simply supported printed circuit board (PCB) to an impact drop load applied to its support contour. The analysis is restricted to the first mode of vibrations and is carried out in application to the PCB design employed in an advanced accelerated test setup (test vehicle). This setup is aimed at the assessment of the performance, in accelerated test conditions on the board level, of packaging materials (and, first of all, BGA solder joint interconnections) subjected to dynamic (drop or shock) loading. It is anticipated that heavy masses could be mounted on the PCB to accelerate its dynamic response to an impact load. These masses are expected to be small in size, so that while changing the total mass of the board and generating significant inertia forces, they do not affect the board's flexural rigidity or its stiffness with respect to the in-plane loading. The PCB's contour is considered non-deformable, which is indeed the case in many practical situations. This circumstance, if the drop height and/or the induced inertia forces are significant, leads to elevated in-plane ('membrane') stresses in the PCB and, as a result of that, to the nonlinear response of the board to the impact load: the relationship between the magnitude of the load (determined by the initial impact velocity) and the induced PCB deflections becomes geometrically nonlinear, with a rigid cubic characteristic of the restoring force. The carried out numerical example, although reflects the characteristics of the PCB and loading conditions in an actual experimental setup, is merely an illustration of the general concept and is intended to demonstrate the abilities of the suggested method. Predictions based on this method agree well with the finite element

Integrated electric circuit CAD system in Minolta Camera Co. Ltd

Energy Technology Data Exchange (ETDEWEB)

Nakagami, Tsuyoshi; Hirata, Sumiaki; Matsumura, Fumihiko

1988-08-26

Development background, fundamental concept, details and future plan of the integrated electric circuit CAD system for OA equipment are presented. The central integrated database is basically intended to store experiences or know-hows, to cover the wide range of data required for designs, and to provide a friendly interface. This easy-to-use integrated database covers the drawing data, parts information, design standards, know-hows and system data. The system contains the circuit design function to support drawing circuit diagrams, the wiring design function to support the wiring and arrangement of printed circuit boards and various parts integratedly, and the function to verify designs, to make full use of parts or technical information, to maintain the system security. In the future, as the system will be wholly in operation, the design period reduction, quality improvement and cost saving will be attained by this integrated design system. (19 figs, 2 tabs)

Laser direct fabrication of silver conductors on glass boards

International Nuclear Information System (INIS)

Li Xiangyou; Zeng Xiaoyan; Li Huiling; Qi Xiaojing

2005-01-01

Laser micro-cladding has been used to fabricate metal conductors, according to a designed electronic circuit, directly onto glass boards which had been coated with a silver-containing electronic paste. The electronic pastes, composed of silver powders, inorganic binders and organic medium, thus formed the conductive metal pattern (i.e. electric circuit) along the path of the laser allowing the rest of the layer to be removed subsequently by an organic solvent. Firing in a furnace at 600 deg. C resulted in conductive lines with resistivity of about 10 -5 Ω cm and with adhesive strength of the order of magnitude of megapascals

Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

2015-06-01

The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

2015-01-01

This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

Flexible circuits with integrated switches for robotic shape sensing

Science.gov (United States)

Harnett, C. K.

2016-05-01

Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

Renovating process for Pressurized Water Reactor control rod assemblies and corresponding control

International Nuclear Information System (INIS)

Jahnke, S.; Ple, P.

1989-01-01

In the first PWRs the control rods are moving by the intermediary of electromagnetic mechanisms where the power fed to the electromagnets is selected by a hard wired logic circuit connected to the controldesh by another logic control. For renovating the control rod assemblies each power assembly is replaced by an electronic assembly containing an ordinator and power supply interfaces [fr

Experimental Verification of Guided-Wave Lumped Circuits Using Waveguide Metamaterials

Science.gov (United States)

Li, Yue; Zhang, Zhijun

2018-04-01

Through the construction and characterization in microwave frequencies, we experimentally demonstrate our recently developed theory of waveguide lumped circuits, i.e., waveguide metatronics [Sci. Adv. 2, e1501790 (2016), 10.1126/sciadv.1501790], as a method to design subwavelength-scaled analog circuits. In the paradigm of waveguide metatronics, numbers of lumped inductors and capacitors are easily integrated functionally inside the waveguide, which is an irreplaceable transmission line in millimeter-wave and terahertz systems with the advantages of low radiation loss and low crosstalk. An example of multiple-ordered metatronic filters with layered structures is fabricated utilizing the technique of substrate integrated waveguides, which can be easily constructed by the printed-circuit-board process. The materials used in the construction are also typical microwave materials with positive permittivity, low loss, and negligible dispersion, imitating the plasmonic materials with negative permittivity in the optical domain. The results verify the theory of waveguide metatronics, which provides an efficient platform of functional lumped circuit design for guided-wave processing.

Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

Science.gov (United States)

Yang, Shuangqiao; Bai, Shibing; Wang, Qi

2016-11-01

In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

Experience with the Quality Assurance of the Superconducting Electrical Circuits of the LHC Machine

CERN Document Server

Bozzini, D; Kotarba, A; Mess, Karl Hubert; Olek, S; Russenschuck, Stephan

2006-01-01

The coherence between the powering reference database for the LHC and the Electrical Quality Assurance (ELQA) is guaranteed on the procedural level. However, a challenge remains the coherence between the database, the magnet test and assembly procedures, and the connection of all superconducting circuits in the LHC machine. In this paper, the methods, tooling, and procedures for the ELQA during the assembly phase of the LHC will be presented in view of the practical experience gained in the LHC tunnel. Some examples of detected polarity errors and electrical non-conformities will be presented. The parameters measured at ambient temperature, such as the dielectric insulation of circuits, will be discussed.

ChemicalVia: a CERN-patented technology for use in high-density circuits

CERN Multimedia

Patrice Loïez

2003-01-01

High-density multilayer printed circuits such as those pictured here are found in miniaturized modern equipment from video cameras to mobile phones. Adjacent layers in these circuits are electrically connected by microvias, consisting of a small-diameter hole (usually 50 µm) with a thin metal-deposited surface covering their cylindrical walls to ensure local conductivity between the two layers. ChemicalVia is a new method, patented by CERN, to make microvias on high-density multilayer printed circuits using chemicals rather than complex laser, plasma or photoimaging technology. The process is compatible with all standard printed-circuit assembly lines, and has the advantages of low initial investment and reduced manufacturing costs. http://www.cern.ch/ttdatabase

Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

Science.gov (United States)

Li, Jia; Zhou, Quan; Xu, Zhenming

2014-12-01

Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

Science.gov (United States)

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

Science.gov (United States)

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Ordinary General Assembly

CERN Multimedia

Association du personnel

2010-01-01

Tuesday 20 April at 10.00 Council Chamber, Bldg 503 In conformity with the Statutes of the Staff Association, an ordinary General Assembly is organized once a year (article IV.2.1). Agenda Adoption of the Agenda Approval of the Draft Minutes of the Ordinary General Assembly of 12 May 2009 Presentation and approval of the Activity Report 2009 Presentation and approval of the Financial Report 2009 Presentation and approval of the Auditors Report 2009 Programme for 2010 Presentation et and approval of the draft budget and subscription rate 2010 Modifications to the statutes of the association Election of the Election Committee Election of the Board of Auditors Miscellaneous We remind members of article IV.3.4 in the Statutes of the Association which reads: “After having dealt with all the items on the agenda, the members may, with the consent of the Assembly, have other matters discussed, but decisions may be taken only on the items listed on the agenda...

Recycling of non-metallic fractions from waste printed circuit boards: A review

International Nuclear Information System (INIS)

Guo Jiuyong; Guo Jie; Xu Zhenming

2009-01-01

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Recycling of non-metallic fractions from waste printed circuit boards: A review

Energy Technology Data Exchange (ETDEWEB)

Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

2009-09-15

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

A resonant dc-dc power converter assembly

DEFF Research Database (Denmark)

2015-01-01

The present invention relates to a resonant DC-DC power converter assembly comprising a first resonant DC-DC power converter and a second resonant DC-DC power converter having identical circuit topologies. A first inductor of the first resonant DC-DC power converter and a second inductor of the s......The present invention relates to a resonant DC-DC power converter assembly comprising a first resonant DC-DC power converter and a second resonant DC-DC power converter having identical circuit topologies. A first inductor of the first resonant DC-DC power converter and a second inductor...... of the second resonant DC-DC power converter are configured for magnetically coupling the first and second resonant DC-DC power converters to each other to forcing substantially 180 degrees phase shift, or forcing substantially 0 degree phase shift, between corresponding resonant voltage waveforms of the first...

Network on chip master control board for neutron acquisition

International Nuclear Information System (INIS)

Ruiz-Martinez, E.; Mary, T.; Mutti, P.; Ratel, J.; Rey, F.

2012-01-01

The acquisition master control board is designed to assemble the various acquisition modes in use at the Institut Laue-Langevin (ILL). The main goal is to make the card common for all the ILL's instruments in a simple, modular and open way, giving the possibility to add new functionalities in order to follow the evolving demand. It has been necessary to define a central element to provide synchronization to the rest of the units. The backbone of the proposed acquisition control system is the denominated master acquisition board. The master board consists on a VME64X configurable high density I/O connection carrier board based on the latest Xilinx Virtex-6T FPGA. The internal architecture of the FPGA is designed as a Network on Chip (NoC) approach. The complete system also includes a display board and n histogram modules for live display of the data from the detectors. (authors)

Integrated optoelectronic materials and circuits for optical interconnects

International Nuclear Information System (INIS)

Hutcheson, L.D.

1988-01-01

Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

A microwave powered sensor assembly for microwave ovens

DEFF Research Database (Denmark)

2016-01-01

The present invention relates to a microwave powered sensor assembly for micro- wave ovens. The microwave powered sensor assembly comprises a microwave antenna for generating an RF antenna signal in response to microwave radiation at a predetermined excitation frequency. A dc power supply circuit...... of the microwave powered sensor assembly is operatively coupled to the RF antenna signal for extracting energy from the RF antenna signal and produce a power supply voltage. A sensor is connected to the power supply voltage and configured to measure a physical or chemical property of a food item under heating...... in a microwave oven chamber....

A novel readout integrated circuit for ferroelectric FPA detector

Science.gov (United States)

Bai, Piji; Li, Lihua; Ji, Yulong; Zhang, Jia; Li, Min; Liang, Yan; Hu, Yanbo; Li, Songying

2017-11-01

Uncooled infrared detectors haves some advantages such as low cost light weight low power consumption, and superior reliability, compared with cryogenically cooled ones Ferroelectric uncooled focal plane array(FPA) are being developed for its AC response and its high reliability As a key part of the ferroelectric assembly the ROIC determines the performance of the assembly. A top-down design model for uncooled ferroelectric readout integrated circuit(ROIC) has been developed. Based on the optical thermal and electrical properties of the ferroelectric detector the RTIA readout integrated circuit is designed. The noise bandwidth of RTIA readout circuit has been developed and analyzed. A novel high gain amplifier, a high pass filter and a low pass filter circuits are designed on the ROIC. In order to improve the ferroelectric FPA package performance and decrease of package cost a temperature sensor is designed on the ROIC chip At last the novel RTIA ROIC is implemented on 0.6μm 2P3M CMOS silicon techniques. According to the experimental chip test results the temporal root mean square(RMS)noise voltage is about 1.4mV the sensitivity of the on chip temperature sensor is 0.6 mV/K from -40°C to 60°C the linearity performance of the ROIC chip is better than 99% Based on the 320×240 RTIA ROIC, a 320×240 infrared ferroelectric FPA is fabricated and tested. Test results shows that the 320×240 RTIA ROIC meets the demand of infrared ferroelectric FPA.

Tomonaga-Luttinger physics in electronic quantum circuits.

Science.gov (United States)

Jezouin, S; Albert, M; Parmentier, F D; Anthore, A; Gennser, U; Cavanna, A; Safi, I; Pierre, F

2013-01-01

In one-dimensional conductors, interactions result in correlated electronic systems. At low energy, a hallmark signature of the so-called Tomonaga-Luttinger liquids is the universal conductance curve predicted in presence of an impurity. A seemingly different topic is the quantum laws of electricity, when distinct quantum conductors are assembled in a circuit. In particular, the conductances are suppressed at low energy, a phenomenon called dynamical Coulomb blockade. Here we investigate the conductance of mesoscopic circuits constituted by a short single-channel quantum conductor in series with a resistance, and demonstrate a proposed link to Tomonaga-Luttinger physics. We reformulate and establish experimentally a recently derived phenomenological expression for the conductance using a wide range of circuits, including carbon nanotube data obtained elsewhere. By confronting both conductance data and phenomenological expression with the universal Tomonaga-Luttinger conductance curve, we demonstrate experimentally the predicted mapping between dynamical Coulomb blockade and the transport across a Tomonaga-Luttinger liquid with an impurity.

Optoelectronic circuits in nanometer CMOS technology

CERN Document Server

Atef, Mohamed

2016-01-01

This book describes the newest implementations of integrated photodiodes fabricated in nanometer standard CMOS technologies. It also includes the required fundamentals, the state-of-the-art, and the design of high-performance laser drivers, transimpedance amplifiers, equalizers, and limiting amplifiers fabricated in nanometer CMOS technologies. This book shows the newest results for the performance of integrated optical receivers, laser drivers, modulator drivers and optical sensors in nanometer standard CMOS technologies. Nanometer CMOS technologies rapidly advanced, enabling the implementation of integrated optical receivers for high data rates of several Giga-bits per second and of high-pixel count optical imagers and sensors. In particular, low cost silicon CMOS optoelectronic integrated circuits became very attractive because they can be extensively applied to short-distance optical communications, such as local area network, chip-to-chip and board-to-board interconnects as well as to imaging and medical...

Gas microstrip detectors based on flexible printed circuit

International Nuclear Information System (INIS)

Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

1995-09-01

We have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. We describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. We also describe two new passivation materials, Tantalum and Niobium, which produce effective surfaces. (author)

RD53A Integrated Circuit Specifications

CERN Document Server

Garcia-Sciveres, Mauricio

2015-01-01

Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. The wafer scale production will permit the experiments to prototype bump bonding assembly with realistic sensors in this new technology and to measure the performance of hybrid assemblies. RD53A is not intended to be a final production IC for use in an experiment, and will contain design variations for testing purposes, making the pixel matrix non-uniform.

Primary circuit and reactor core T-H characteristics determination of WWER 440 reactors

International Nuclear Information System (INIS)

Hermansky, J.; Petenyi, V.; Zavodsky, M.

2010-01-01

The WWER-440 nuclear fuel vendor permanently improves the assortment of produced nuclear fuel assemblies for achieving better fuel cycle economy and reactor operation safety. During unit refuelling there also could be made some other changes in hydraulic parameters of primary circuit (change of impeller wheels, hydraulic resistance coefficient changes of internal parts of primary circuit, etc.). Therefore it is necessary to determine real coolant flow rate through the reactor during units start-up after their refuelling, and also to have the skilled methodology and computing code for analyzing factors, which affecting the inaccuracy of coolant flow redistribution determination through reactor on flows through separate parts of reactor core in any case of parallel operation of different assembly types. Computing code TH-VCR and CORFLO are used for reactor core characteristics determination for one type of fuel and control assemblies and also in case of parallel operation of different assembly types. The code TH-VCR is able to calculate coolant flow rate for different combinations of three different fuel assembly channel types and three different control assembly channel types. The CORFLO code deals the area of the reactor core which consists of 312 fuel assemblies and 37 control assemblies. Regarding the rotational 60 deg symmetry of reactor core only 1/6 of reactor core with 59 fuel assemblies is taken into account. Computing code CORFLO is verified and validated at this time. Paper presents some results from measurements of coolant flow rate through reactors during start-up after unit refuelling and short description of computing code TH-VCR and CORFLO with some calculated results. (Authors)

Computer aided production of manufacturing CAMAC-wired boards by the multiwire-technique

Energy Technology Data Exchange (ETDEWEB)

Martini, M; Brehmer, W

1975-10-01

The multiwire-technique is a computer controlled wiring method for the manufacturing of circuit boards with insulated conductors. The technical data for production are dimensional drawings of the board and a list of all points which are to be connected. The listing must be in absolute co-ordinates including a list of all soldering points for component parts and a reproducible print pattern for inscription. For this wiring method a CAMAC standard board, a layout plan with alpha-numeric symbols, and a computer program which produces the essential technical data were developed. A description of the alpha-numeric symbols, the quality of the program, recognition and checking of these symbols, and the produced technical data is presented. (auth)

Heat management in integrated circuits on-chip and system-level monitoring and cooling

CERN Document Server

Ogrenci-Memik, Seda

2016-01-01

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

Random On-Board Pixel Sampling (ROPS) X-Ray Camera

Energy Technology Data Exchange (ETDEWEB)

Wang, Zhehui [Los Alamos; Iaroshenko, O. [Los Alamos; Li, S. [Los Alamos; Liu, T. [Fermilab; Parab, N. [Argonne (main); Chen, W. W. [Purdue U.; Chu, P. [Los Alamos; Kenyon, G. [Los Alamos; Lipton, R. [Fermilab; Sun, K.-X. [Nevada U., Las Vegas

2017-09-25

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. Here we first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.

Annual Report of the United Nations Joint Staff Pension Board. The Report Made In 1974

Energy Technology Data Exchange (ETDEWEB)

NONE

1974-11-06

Pursuant to the requirement in Article 14(a) of the Regulations of the United Nations Joint Staff Pension Fund that the United Nations Joint Staff Pension Board present an annual report to the General Assembly of the United Nations and to the member organizations of the Fund, the United Nations has published the report presented by the Board in 1974 as Supplement No. 9 to the Official Records of the General Assembly: Twenty-Ninth Session (A/9609). The report has thus already been communicated to Governments. However, if any Member should require additional copies, the Secretariat is ready to obtain them.

Annual Report of the United Nations Joint Staff Pension Board. The Report made in 1975

Energy Technology Data Exchange (ETDEWEB)

NONE

1975-11-27

Pursuant to the requirement in Article 14(a) of the Regulations of the United Nations Joint Staff Pension Fund that the United Nations Joint Staff Pension Board present an annual report to the General Assembly of the United Nations and to the member organizations of the Fund, the United Nations has published the report presented by the Board in 1975 as Supplement No. 9 to the Official Records of the General Assembly: Thirtieth Session (A/10009). The report has thus already been communicated to Governments. However, if any Member should require additional copies, the Secretariat is ready to obtain them.

Annual Report of the United Nations Joint Staff Pension Board. The Report made in 1972

International Nuclear Information System (INIS)

1972-01-01

Pursuant to the requirement in Article 14 of the Regulations of the United Nations Joint Staff Pension Fund that the United Nations Joint Staff Pension Board present an annual report to the General Assembly of the United Nations and to the member organizations of the Fund, the United Nations has published the report presented by the Board in 1972 as Supplement No. 9 to the Official Records of the General Assembly: Twenty-Seventh Session (A/8709). The report has thus already been communicated to Governments. However, if any Member should require additional copies, the Secretariat is ready to obtain them

Annual Report of the United Nations Joint Staff Pension Board. The Report Made In 1974

International Nuclear Information System (INIS)

1974-01-01

Pursuant to the requirement in Article 14(a) of the Regulations of the United Nations Joint Staff Pension Fund that the United Nations Joint Staff Pension Board present an annual report to the General Assembly of the United Nations and to the member organizations of the Fund, the United Nations has published the report presented by the Board in 1974 as Supplement No. 9 to the Official Records of the General Assembly: Twenty-Ninth Session (A/9609). The report has thus already been communicated to Governments. However, if any Member should require additional copies, the Secretariat is ready to obtain them

Annual Report of the United Nations Joint Staff Pension Board. The Report made in 1975

International Nuclear Information System (INIS)

1975-01-01

Pursuant to the requirement in Article 14(a) of the Regulations of the United Nations Joint Staff Pension Fund that the United Nations Joint Staff Pension Board present an annual report to the General Assembly of the United Nations and to the member organizations of the Fund, the United Nations has published the report presented by the Board in 1975 as Supplement No. 9 to the Official Records of the General Assembly: Thirtieth Session (A/10009). The report has thus already been communicated to Governments. However, if any Member should require additional copies, the Secretariat is ready to obtain them

Annual Report of the United Nations Joint Staff Pension Board. The Report made in 1972

Energy Technology Data Exchange (ETDEWEB)

NONE

1972-11-28

Pursuant to the requirement in Article 14 of the Regulations of the United Nations Joint Staff Pension Fund that the United Nations Joint Staff Pension Board present an annual report to the General Assembly of the United Nations and to the member organizations of the Fund, the United Nations has published the report presented by the Board in 1972 as Supplement No. 9 to the Official Records of the General Assembly: Twenty-Seventh Session (A/8709). The report has thus already been communicated to Governments. However, if any Member should require additional copies, the Secretariat is ready to obtain them.

Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

Directory of Open Access Journals (Sweden)

Yi-Xuan Wang

2017-05-01

Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2015-06-15

Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

Science.gov (United States)

Zhan, Lu; Xu, Zhenming

2008-10-15

The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

Self-shielding flex-circuit drift tube, drift tube assembly and method of making

Science.gov (United States)

Jones, David Alexander

2016-04-26

The present disclosure is directed to an ion mobility drift tube fabricated using flex-circuit technology in which every other drift electrode is on a different layer of the flex-circuit and each drift electrode partially overlaps the adjacent electrodes on the other layer. This results in a self-shielding effect where the drift electrodes themselves shield the interior of the drift tube from unwanted electro-magnetic noise. In addition, this drift tube can be manufactured with an integral flex-heater for temperature control. This design will significantly improve the noise immunity, size, weight, and power requirements of hand-held ion mobility systems such as those used for explosive detection.

Hybrid circuit prototypes for the CMS Tracker upgrade front-end electronics

International Nuclear Information System (INIS)

Blanchot, G; Honma, A; Kovacs, M; Braga, D; Raymond, M

2013-01-01

New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic-based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip chip ASICs. A description of the function of the hybrid circuit in the tracker, the first prototype designs, results of some electrical and mechanical properties from the prototypes, and examples of the integration of the hybrids into detector modules are presented

Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

NARCIS (Netherlands)

Tereshchenko, O.V.

2015-01-01

Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates

Self-assembled nanogaps for molecular electronics.

Science.gov (United States)

Tang, Qingxin; Tong, Yanhong; Jain, Titoo; Hassenkam, Tue; Wan, Qing; Moth-Poulsen, Kasper; Bjørnholm, Thomas

2009-06-17

A nanogap for molecular devices was realized using solution-based self-assembly. Gold nanorods were assembled to gold nanoparticle-coated conducting SnO2:Sb nanowires via thiol end-capped oligo(phenylenevinylene)s (OPVs). The molecular gap was easily created by the rigid molecule itself during self-assembly and the gap length was determined by the molecule length. The gold nanorods and gold nanoparticles, respectively covalently bonded at the two ends of the molecule, had very small dimensions, e.g. a width of approximately 20 nm, and hence were expected to minimize the screening effect. The ultra-long conducting SnO2:Sb nanowires provided the bridge to connect one of the electrodes of the molecular device (gold nanoparticle) to the external circuit. The tip of the atomic force microscope (AFM) was contacted onto the other electrode (gold nanorod) for the electrical measurement of the OPV device. The conductance measurement confirmed that the self-assembly of the molecules and the subsequent self-assembly of the gold nanorods was a feasible method for the fabrication of the nanogap of the molecular devices.

Self-assembled nanogaps for molecular electronics

International Nuclear Information System (INIS)

Tang Qingxin; Tong Yanhong; Jain, Titoo; Hassenkam, Tue; Moth-Poulsen, Kasper; Bjoernholm, Thomas; Wan Qing

2009-01-01

A nanogap for molecular devices was realized using solution-based self-assembly. Gold nanorods were assembled to gold nanoparticle-coated conducting SnO 2 :Sb nanowires via thiol end-capped oligo(phenylenevinylene)s (OPVs). The molecular gap was easily created by the rigid molecule itself during self-assembly and the gap length was determined by the molecule length. The gold nanorods and gold nanoparticles, respectively covalently bonded at the two ends of the molecule, had very small dimensions, e.g. a width of ∼20 nm, and hence were expected to minimize the screening effect. The ultra-long conducting SnO 2 :Sb nanowires provided the bridge to connect one of the electrodes of the molecular device (gold nanoparticle) to the external circuit. The tip of the atomic force microscope (AFM) was contacted onto the other electrode (gold nanorod) for the electrical measurement of the OPV device. The conductance measurement confirmed that the self-assembly of the molecules and the subsequent self-assembly of the gold nanorods was a feasible method for the fabrication of the nanogap of the molecular devices.

A Theoretical and Experimental Study of DNA Self-assembly

Science.gov (United States)

Chandran, Harish

The control of matter and phenomena at the nanoscale is fast becoming one of the most important challenges of the 21st century with wide-ranging applications from energy and health care to computing and material science. Conventional top-down approaches to nanotechnology, having served us well for long, are reaching their inherent limitations. Meanwhile, bottom-up methods such as self-assembly are emerging as viable alternatives for nanoscale fabrication and manipulation. A particularly successful bottom up technique is DNA self-assembly where a set of carefully designed DNA strands form a nanoscale object as a consequence of specific, local interactions among the different components, without external direction. The final product of the self-assembly process might be a static nanostructure or a dynamic nanodevice that performs a specific function. Over the past two decades, DNA self-assembly has produced stunning nanoscale objects such as 2D and 3D lattices, polyhedra and addressable arbitrary shaped substrates, and a myriad of nanoscale devices such as molecular tweezers, computational circuits, biosensors and molecular assembly lines. In this dissertation we study multiple problems in the theory, simulations and experiments of DNA self-assembly. We extend the Turing-universal mathematical framework of self-assembly known as the Tile Assembly Model by incorporating randomization during the assembly process. This allows us to reduce the tile complexity of linear assemblies. We develop multiple techniques to build linear assemblies of expected length N using far fewer tile types than previously possible. We abstract the fundamental properties of DNA and develop a biochemical system, which we call meta-DNA, based entirely on strands of DNA as the only component molecule. We further develop various enzyme-free protocols to manipulate meta-DNA systems and provide strand level details along with abstract notations for these mechanisms. We simulate DNA circuits by

Glovebox with purification and pressure control of the neutral gas atmosphere in closed circuit

International Nuclear Information System (INIS)

Cadrot, J.

1990-01-01

In the gas main are placed 2 series of specific gas purifiers in parallel. Pressure is controlled with a buffer tank two three way solenoid value upstream and down stream a compressor and a supercharger. A checking board allows continuous monitoring of circuit tightness [fr

Effect of kicker circuit inductance on the transmission-line discharging

International Nuclear Information System (INIS)

Feng Deren; Wang Xiangqi; Shang Lei; Pei Yuanji; Fan Kuanjun

2004-01-01

Circuit inductance exists at discharging circuit of transmission-line, it includes the inductance at the main switch of thyratron when conducts, the linking inductance between the linking cables, the matching resistance inductance and the load inductance. When a long pulse is generated by transmission-line, the circuit inductance can be omitted. However, when the pulse is short (such as shorter than 200 ns), especially when ferromagnetic core kicker acts as the load, the effect is obvious. The short pulse current is needed in order to generate long time interval synchronous radiation light pulses by using online assembly of pulse convex orbit and DC convex orbit. This paper analyses the effect and presents several experimental results. It also supposes two practical cases to decrease the rise time of the pulse

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

Science.gov (United States)

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

Science.gov (United States)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

RD53A Integrated Circuit Specifications

OpenAIRE

Garcia-Sciveres, Mauricio

2015-01-01

Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. The wafer scale production will permit the experiments to prototype bump bonding assembly with...

Minor actinide transmutation in a board type sodium cooled breed and burn reactor core

International Nuclear Information System (INIS)

Zheng, Meiyin; Tian, Wenxi; Zhang, Dalin; Qiu, Suizheng; Su, Guanghui

2015-01-01

Highlights: • A 1250 MWt board type sodium cooled breed and burn reactor core is further designed. • MCNP–ORIGEN coupled code MCORE is applied to perform neutronics and depletion calculation. • Transmutation efficiency and neutronic safety parameters are compared under different MA weight fraction. - Abstract: In this paper, a board type sodium cooled breed and burn reactor core is further designed and applied to perform minor actinide (MA) transmutation. MA is homogeneously loaded in all the fuel sub-assemblies with a weight fraction of 2.0 wt.%, 4.0 wt.%, 6.0 wt.%, 8.0 wt.%, 10.0 wt.% and 12.0 wt.%, respectively. The transmutation efficiency, transmutation amount, power density distribution, neutron fluence distribution and neutronic safety parameters, such as reactivity, Doppler feedback, void worth and delayed neutron fraction, are compared under different MA weight fraction. Neutronics and depletion calculations are performed based on the self-developed MCNP–ORIGEN coupled code with the ENDF/B-VII data library. In the breed and burn reactor core, a number of breeding sub-assemblies are arranged in the inner core in a board type way (scatter load) to breed, and a number of absorbing sub-assemblies are arranged in the inner side of the outer core to absorb neutrons and reduce power density in this area. All the fuel sub-assemblies (ignition and breeding sub-assemblies) are shuffled from outside in. The core reached asymptotically steady state after about 22 years, and the average and maximum discharged burn-up were about 17.0% and 35.3%, respectively. The transmutation amount increased linearly with the MA weight fraction, while the transmutation rate parabolically varied with the MA weight fraction. Power density in ignition sub-assembly positions increased with the MA weight fraction, while decreased in breeding sub-assembly positions. Neutron fluence decreased with the increase of MA weight fraction. Generally speaking, the core reactivity and void

Agent-based services for B2B electronic commerce

Science.gov (United States)

Fong, Elizabeth; Ivezic, Nenad; Rhodes, Tom; Peng, Yun

2000-12-01

The potential of agent-based systems has not been realized yet, in part, because of the lack of understanding of how the agent technology supports industrial needs and emerging standards. The area of business-to-business electronic commerce (b2b e-commerce) is one of the most rapidly developing sectors of industry with huge impact on manufacturing practices. In this paper, we investigate the current state of agent technology and the feasibility of applying agent-based computing to b2b e-commerce in the circuit board manufacturing sector. We identify critical tasks and opportunities in the b2b e-commerce area where agent-based services can best be deployed. We describe an implemented agent-based prototype system to facilitate the bidding process for printed circuit board manufacturing and assembly. These activities are taking place within the Internet Commerce for Manufacturing (ICM) project, the NIST- sponsored project working with industry to create an environment where small manufacturers of mechanical and electronic components may participate competitively in virtual enterprises that manufacture printed circuit assemblies.

Design and Verification of Application Specific Integrated Circuits in a Network of Online Labs

Directory of Open Access Journals (Sweden)

A.Y. Al-Zoubi

2009-08-01

Full Text Available A solution to implement a remote laboratory for testing and designing analog Application-Specific Integrated Circuits of the type (ispPAC10 is presented. The application allows electrical engineering students to access and perform measurements and conduct analog electronics experiments over the internet. PAC-Designer software, running on a Citrix server, is used in the circuit design in which the signals are generated and the responses are acquired by a data acquisition board controlled by LabVIEW. Three interconnected remote labs located in three different continents will be implementing the proposed system.

Electronics calibration board for the ATLAS liquid argon calorimeters

International Nuclear Information System (INIS)

Colas, J.; Dumont-Dayot, N.; Marchand, J.F.; Massol, N.; Perrodo, P.; Wingerter-Seez, I.; De La Taille, C.; Imbert, P.; Richer, J.P.; Seguin Moreau, N.; Serin, L.

2008-01-01

To calibrate the energy response of the ATLAS liquid argon calorimeter, an electronics calibration board has been designed; it delivers a signal whose shape is close to the calorimeter ionization current signal with amplitude up to 100 mA in 50 Ω with 16 bit dynamic range. The amplitude of this signal is designed to be uniform over all calorimeters channels, stable in time and with an integral linearity much better that the electronics readout. The various R and D phases and most of the difficulties met are discussed and illustrated by many measurements. The custom design circuits are described and the layout of the ATLAS calibration board presented. The procedure used to qualify the boards is explained and the performance obtained illustrated: a dynamic range up to 3 TeV in three energy scales with an integral linearity better than 0.1% in each of them, a response uniformity better than 0.2% and a stability better than 0.1%. The performance of the board is well within the ATLAS requirements. Finally, in situ measurements done on the ATLAS calorimeter are shown to validate these performances

Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principle

OpenAIRE

Degraeve, Andy; Pissoort, Davy; Armstrong, Keith

2015-01-01

This paper discusses the shielding performance or shielding effectiveness of a board-level shield in function of its bonding method. Improved shielding performance at board-level in order to harden integrated circuits against unintentional and intentional electromagnetic interference, and this under harsh environmental conditions, is getting more and more important to achieve the desired levels of functional performance and operational reliability despite an ever more aggressive electromagnet...

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits.

Science.gov (United States)

Nam, SungWoo; Jiang, Xiaocheng; Xiong, Qihua; Ham, Donhee; Lieber, Charles M

2009-12-15

Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arsenide (n-InAs) and p-type germanium/silicon core/shell (p-Ge/Si) nanowire (NW) field-effect transistors (FETs). The DC voltage output (V(out)) versus input (V(in)) response of vertically interconnected CMOS inverters showed sharp switching at close to the ideal value of one-half the supply voltage and, moreover, exhibited substantial DC gain of approximately 45. The gain and the rail-to-rail output switching are consistent with the large noise margin and minimal static power consumption of CMOS. Vertically interconnected, three-stage CMOS ring oscillators were also fabricated by using layer-1 InAs NW n-FETs and layer-2 Ge/Si NW p-FETs. Significantly, measurements of these circuits demonstrated stable, self-sustained oscillations with a maximum frequency of 108 MHz, which represents the highest-frequency integrated circuit based on chemically synthesized nanoscale materials. These results highlight the flexibility of bottom-up assembly of distinct nanoscale materials and suggest substantial promise for 3D integrated circuits.

Manufacturing experience and test results of the PS prototype flexible hybrid circuit for the CMS Tracker Upgrade

CERN Document Server

Kovacs, Mark Istvan; Gadek, Tomasz; Honma, Alan; Vasey, Francois

2017-01-01

The CMS Tracker Phase-2 Upgrade for HL-LHC requires High Density Interconnect (HDI) flexible hybrid circuits to build modules with low mass and high granularity. The hybrids are carbon fibre reinforced flexible circuits with flip-chips and passives. Three different manufacturers produced prototype hybrids for the Pixel-Strip type modules. The first part of the presentation will focus on the design challenges of this state of the art circuit. Afterwards, the difficulties and experience related to the circuit manufacturing and assembly are presented. The description of quality inspection methods with comprehensive test results will lead to the conclusion.

Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages

Science.gov (United States)

Vaughn, Mark R.; Montague, Stephen

2017-05-16

A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.

Circuit board accident--organizational dimension hidden by prescribed safety.

Science.gov (United States)

de Almeida, Ildeberto Muniz; Buoso, Eduardo; do Amaral Dias, Maria Dionísia; Vilela, Rodolfo Andrade Gouveia

2012-01-01

This study analyzes an accident in which two maintenance workers suffered severe burns while replacing a circuit breaker panel in a steel mill, following model of analysis and prevention of accidents (MAPA) developed with the objective of enlarging the perimeter of interventions and contributing to deconstruction of blame attribution practices. The study was based on materials produced by a health service team in an in-depth analysis of the accident. The analysis shows that decisions related to system modernization were taken without considering their implications in maintenance scheduling and creating conflicts of priorities and of interests between production and safety; and also reveals that the lack of a systemic perspective in safety management was its principal failure. To explain the accident as merely non-fulfillment of idealized formal safety rules feeds practices of blame attribution supported by alibi norms and inhibits possible prevention. In contrast, accident analyses undertaken in worker health surveillance services show potential to reveal origins of these events incubated in the history of the system ignored in practices guided by the traditional paradigm.

Agile Multi-Parallel Micro Manufacturing Using a Grid of Equiplets

NARCIS (Netherlands)

Leo van Moergestel; Ing. Erik Puik

2010-01-01

Abstract: Unlike manufacturing technology for semiconductors and printed circuit boards, the market for traditional micro assembly lacks a clear public roadmap. More agile manufacturing strategies are needed in an environment in which dealing with change becomes a rule instead of an exception. In

Automatic recloser circuit breaker integrated with GSM technology for power system notification

Science.gov (United States)

Lada, M. Y.; Khiar, M. S. A.; Ghani, S. A.; Nawawi, M. R. M.; Rahim, N. H.; Sinar, L. O. M.

2015-05-01

Lightning is one type of transient faults that usually cause the circuit breaker in the distribution board trip due to overload current detection. The instant tripping condition in the circuit breakers clears the fault in the system. Unfortunately most circuit breakers system is manually operated. The power line will be effectively re-energized after the clearing fault process is finished. Auto-reclose circuit is used on the transmission line to carry out the duty of supplying quality electrical power to customers. In this project, an automatic reclose circuit breaker for low voltage usage is designed. The product description is the Auto Reclose Circuit Breaker (ARCB) will trip if the current sensor detects high current which exceeds the rated current for the miniature circuit breaker (MCB) used. Then the fault condition will be cleared automatically and return the power line to normal condition. The Global System for Mobile Communication (GSM) system will send SMS to the person in charge if the tripping occurs. If the over current occurs in three times, the system will fully trip (open circuit) and at the same time will send an SMS to the person in charge. In this project a 1 A is set as the rated current and any current exceeding a 1 A will cause the system to trip or interrupted. This system also provides an additional notification for user such as the emergency light and warning system.

A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

International Nuclear Information System (INIS)

Broadbent, H A; Ketterl, T P; Reid, C S

2010-01-01

The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

Adaptive Signal Processing Testbed: VME-based DSP board market survey

Science.gov (United States)

Ingram, Rick E.

1992-04-01

The Adaptive Signal Processing Testbed (ASPT) is a real-time multiprocessor system utilizing digital signal processor technology on VMEbus based printed circuit boards installed on a Sun workstation. The ASPT has specific requirements, particularly as regards to the signal excision application, with respect to interfacing with current and planned data generation equipment, processing of the data, storage to disk of final and intermediate results, and the development tools for applications development and integration into the overall EW/COM computing environment. A prototype ASPT was implemented using three VME-C-30 boards from Applied Silicon. Experience gained during the prototype development led to the conclusions that interprocessor communications capability is the most significant contributor to overall ASPT performance. In addition, the host involvement should be minimized. Boards using different processors were evaluated with respect to the ASPT system requirements, pricing, and availability. Specific recommendations based on various priorities are made as well as recommendations concerning the integration and interaction of various tools developed during the prototype implementation.

Introductory Statement to Board of Governors, 2 June 2014, Vienna, Austria

International Nuclear Information System (INIS)

Amano, Y.

2014-01-01

Since the last meeting of the Board, two countries have applied for membership of the Agency: the Republic of Djibouti and the Union of the Comoros. A number of important reports are on the agenda of this meeting. The Agency's Annual Report for 2013 serves as the Board's report to the General Conference, as well as the Agency's report to the United Nations General Assembly and the general public. As the report shows, the Agency's programme continues to make a real difference to the lives of many people throughout the world

Reconfigurable On-Board Vision Processing for Small Autonomous Vehicles

Directory of Open Access Journals (Sweden)

James K. Archibald

2006-12-01

Full Text Available This paper addresses the challenge of supporting real-time vision processing on-board small autonomous vehicles. Local vision gives increased autonomous capability, but it requires substantial computing power that is difficult to provide given the severe constraints of small size and battery-powered operation. We describe a custom FPGA-based circuit board designed to support research in the development of algorithms for image-directed navigation and control. We show that the FPGA approach supports real-time vision algorithms by describing the implementation of an algorithm to construct a three-dimensional (3D map of the environment surrounding a small mobile robot. We show that FPGAs are well suited for systems that must be flexible and deliver high levels of performance, especially in embedded settings where space and power are significant concerns.

Reconfigurable On-Board Vision Processing for Small Autonomous Vehicles

Directory of Open Access Journals (Sweden)

Fife WadeS

2007-01-01

Full Text Available This paper addresses the challenge of supporting real-time vision processing on-board small autonomous vehicles. Local vision gives increased autonomous capability, but it requires substantial computing power that is difficult to provide given the severe constraints of small size and battery-powered operation. We describe a custom FPGA-based circuit board designed to support research in the development of algorithms for image-directed navigation and control. We show that the FPGA approach supports real-time vision algorithms by describing the implementation of an algorithm to construct a three-dimensional (3D map of the environment surrounding a small mobile robot. We show that FPGAs are well suited for systems that must be flexible and deliver high levels of performance, especially in embedded settings where space and power are significant concerns.

An optimized routing algorithm for the automated assembly of standard multimode ribbon fibers in a full-mesh optical backplane

Science.gov (United States)

Basile, Vito; Guadagno, Gianluca; Ferrario, Maddalena; Fassi, Irene

2018-03-01

In this paper a parametric, modular and scalable algorithm allowing a fully automated assembly of a backplane fiber-optic interconnection circuit is presented. This approach guarantees the optimization of the optical fiber routing inside the backplane with respect to specific criteria (i.e. bending power losses), addressing both transmission performance and overall costs issues. Graph theory has been exploited to simplify the complexity of the NxN full-mesh backplane interconnection topology, firstly, into N independent sub-circuits and then, recursively, into a limited number of loops easier to be generated. Afterwards, the proposed algorithm selects a set of geometrical and architectural parameters whose optimization allows to identify the optimal fiber optic routing for each sub-circuit of the backplane. The topological and numerical information provided by the algorithm are then exploited to control a robot which performs the automated assembly of the backplane sub-circuits. The proposed routing algorithm can be extended to any array architecture and number of connections thanks to its modularity and scalability. Finally, the algorithm has been exploited for the automated assembly of an 8x8 optical backplane realized with standard multimode (MM) 12-fiber ribbons.

Short- circuit tests of circuit breakers

OpenAIRE

Chorovský, P.

2015-01-01

This paper deals with short-circuit tests of low voltage electrical devices. In the first part of this paper, there are described basic types of short- circuit tests and their principles. Direct and indirect (synthetic) tests with more details are described in the second part. Each test and principles are explained separately. Oscilogram is obtained from short-circuit tests of circuit breakers at laboratory. The aim of this research work is to propose a test circuit for performing indirect test.

The Assembly of the LHC Short Straight Sections (SSS) at CERN Project Status and Lessons Learned

CERN Document Server

Parma, Vittorio; Dos Santos de Campos, Paulo M; Feitor, Rogerio C; Gandel, Makcim; López, R; Schmidlkofer, Martin; Slits, Ivo

2005-01-01

The series production of the LHC SSS has started in the beginning of 2004 and is foreseen to last until end 2006. The production consists in the assembly of 474 cold masses housing superconducting quadrupoles and corrector magnets within their cryostats. 87 cold mass variants, resulting from various combinations of main quadrupole and corrector magnets, have to be assembled in 55 cryostat types, depending on the specific cryogenic and electrical powering schemes required by the collider topology. The assembly activity features the execution of more than 5 km of leak-tight welding of stainless steel and aluminium cryogenic lines, designed for 20-bar pressure, according to high qualification standards and undergoing severe QA inspections. Some 2500 leak detection tests, using He mass spectrometry, are required to check the tightness of the cryogenic circuits. Extensive electrical control work, to check the integrity of the magnet instrumentation and electrical circuits throughout the assembly of the SSS, is als...

Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

Energy Technology Data Exchange (ETDEWEB)

Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

2015-07-15

Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

International Nuclear Information System (INIS)

Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

2015-01-01

Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets

Schenkel circuit and its characteristics. DC power source for NHV ion accelerator

Energy Technology Data Exchange (ETDEWEB)

Kimura, Toshio; Yamada, Masahiro; Nakazawa, Makoto; Iwamoto, Eiji [Nissin - High Voltage Co. Ltd., Kyoto (Japan)

1996-12-01

For DC high voltage source, it is necessary to have sufficient power capacity to suit for electric current capacity required for operational load and further sufficient power stability when adapting it to an ion accelerator. In this paper, outlines of various DC high voltage forming circuits using generally and characteristics of Schenkel type DC source adapted to ion accelerator were described. Characteristics of the NHV Schenkel type DC electric source on actual circuit construction is shown as follows; (1) Whole circuit construction is intended to improve its discharge resistance by assembly with gaps and resistors. (2) Stability caused by geometric shape specific to the Schenkel circuit is improved by adopting integral moldings of aluminum for its structural material. And, (3) Upgrading of cooling effect, and miniaturization and forming heat loss reduction of system are intended by adopting all aluminum to increasing pressure transformer storing tank for countermeasure of vortex current. (G.K.)

Schenkel circuit and its characteristics. DC power source for NHV ion accelerator

International Nuclear Information System (INIS)

Kimura, Toshio; Yamada, Masahiro; Nakazawa, Makoto; Iwamoto, Eiji

1996-01-01

For DC high voltage source, it is necessary to have sufficient power capacity to suit for electric current capacity required for operational load and further sufficient power stability when adapting it to an ion accelerator. In this paper, outlines of various DC high voltage forming circuits using generally and characteristics of Schenkel type DC source adapted to ion accelerator were described. Characteristics of the NHV Schenkel type DC electric source on actual circuit construction is shown as follows; 1) Whole circuit construction is intended to improve its discharge resistance by assembly with gaps and resistors. 2) Stability caused by geometric shape specific to the Schenkel circuit is improved by adopting integral moldings of aluminum for its structural material. And, 3) Upgrading of cooling effect, and miniaturization and forming heat loss reduction of system are intended by adopting all aluminum to increasing pressure transformer storing tank for countermeasure of vortex current. (G.K.)

Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

Science.gov (United States)

Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

2008-05-01

The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

Science.gov (United States)

Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

2014-01-01

Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple.

Progress in complementary metal–oxide–semiconductor silicon photonics and optoelectronic integrated circuits

International Nuclear Information System (INIS)

Chen Hongda; Zhang Zan; Huang Beiju; Mao Luhong; Zhang Zanyun

2015-01-01

Silicon photonics is an emerging competitive solution for next-generation scalable data communications in different application areas as high-speed data communication is constrained by electrical interconnects. Optical interconnects based on silicon photonics can be used in intra/inter-chip interconnects, board-to-board interconnects, short-reach communications in datacenters, supercomputers and long-haul optical transmissions. In this paper, we present an overview of recent progress in silicon optoelectronic devices and optoelectronic integrated circuits (OEICs) based on a complementary metal–oxide–semiconductor-compatible process, and focus on our research contributions. The silicon optoelectronic devices and OEICs show good characteristics, which are expected to benefit several application domains, including communication, sensing, computing and nonlinear systems. (review)

On-chip enzymatic microbiofuel cell-powered integrated circuits.

Science.gov (United States)

Mark, Andrew G; Suraniti, Emmanuel; Roche, Jérôme; Richter, Harald; Kuhn, Alexander; Mano, Nicolas; Fischer, Peer

2017-05-16

A variety of diagnostic and therapeutic medical technologies rely on long term implantation of an electronic device to monitor or regulate a patient's condition. One proposed approach to powering these devices is to use a biofuel cell to convert the chemical energy from blood nutrients into electrical current to supply the electronics. We present here an enzymatic microbiofuel cell whose electrodes are directly integrated into a digital electronic circuit. Glucose oxidizing and oxygen reducing enzymes are immobilized on microelectrodes of an application specific integrated circuit (ASIC) using redox hydrogels to produce an enzymatic biofuel cell, capable of harvesting electrical power from just a single droplet of 5 mM glucose solution. Optimisation of the fuel cell voltage and power to match the requirements of the electronics allow self-powered operation of the on-board digital circuitry. This study represents a step towards implantable self-powered electronic devices that gather their energy from physiological fluids.

75 FR 56124 - Notice of Issuance of Final Determination Concerning APC InfraStruXure® Solutions and of Certain...

Science.gov (United States)

2010-09-15

...: Power, intelligence, battery, and bypass. Its architecture can scale power and runtime as demand grows... units are manufactured in the Philippines and India and have printed circuit board (PCB) and sheet metal... UPS units (power, intelligence, battery, and bypass/static switch modules) must be assembled together...

Gas microstrip detectors based on flexible printed circuit

International Nuclear Information System (INIS)

Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

1995-09-01

Microstrip Gas Detectors (MSGC's) were introduced some years ago as position sensitive detectors capable of operating at very high rates. The authors have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. They describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. They also describe two new passivation materials, tantalum and niobium, which produce effective surfaces

Commutation circuit for an HVDC circuit breaker

Science.gov (United States)

Premerlani, William J.

1981-01-01

A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components.

Measure Guideline: Three High Performance Mineral Fiber Insulation Board Retrofit Solutions

Energy Technology Data Exchange (ETDEWEB)

Neuhauser, K. [Building Science Corporation, Westford, MA (United States)

2015-01-01

This Measure Guideline describes a high performance enclosure retrofit package that uses mineral fiber insulation board, and is intended to serve contractors and designers seeking guidance for non-foam exterior insulation retrofit processes. The guideline describes retrofit assembly and details for wood frame roof and walls and for cast concrete foundations.

Design and development of improved ballscrew and control circuit for reactivity mechanisms of 220 MWe PHWR operating stations

International Nuclear Information System (INIS)

Jain, A.K.; Rama Mohan, N.; Mathew, Jimmy; Mathur, M.K.; Roy, S.; Ingle, V.J.; Ghoshal, B.; Ashok Kumar, B.; Patil, D.C.; Dwivedi, K.P.; Bhambra, H.S.

2006-01-01

There has been persistent failure of Ballscrews used for Reactivity Mechanism in standardised 220 MWe PHWR units. The detailed review of failures indicated that on one hand the number of demands for operation of Absorber Rod and Regulating Rod had increased due to use of digital circuit in the drive control system as compared analog circuits used earlier. On the other hand, the existing design of ballscrew had some inherent weaknesses to withstand the loads generated during starting and stopping of the regulating rods. To solve these problems two-pronged approach was adopted. The control problem was traced to overshooting of the servomotor of Absorber Rod and Regulating Rod to the full speed at the time of starting and thereafter, settling to the required speed. This sudden overshooting produces a jerk in the drive mechanism. A modified circuit has been evolved to solve this problem. Also, Changing the dead band and gain of control circuits have reduced the number of rod movements. A 'new design' of Ballscrew assembly was finalised by NPCIL with a view to withstand the severe loads generated during starting and stopping of the regulating rods and to achieve enhanced service life under water-lubrication condition. Based on this design, prototype assemblies were successfully manufactured by two Indian manufacturers. The design was cleared for manufacturing of the bulk production of Ballscrew assemblies after evaluation of its performance during rigorous 'Acceptance Testing'. Two ballscrews of new design were installed in the KGS-1 reactor and are operating since July 2005. This paper covers operational feedback including ballscrew failures in various units, Design/Development of Modified Reactivity Mechanism Ballscrews and Control Circuit based on analysis of underlying causes of failures and feedback on performance of new design. (author)

WHO: World Health Assembly.

Science.gov (United States)

McGregor, A

1992-05-23

1200 delegates from 175 member countries attended the 45th World Health Assembly in Geneva. Everyone at the Assembly ratified measures to prevent and control AIDS. 12 countries intended to do long term planning for community based care for AIDS patients. Further the Assembly denounced instances where countries and individuals denied the gravity of the AIDS pandemic. In fact, it expressed the importance for urgent and intensive action against HIV/AIDS. The assembly backed proposals to prevent and control sexually transmitted diseases that affect AIDS patients, especially hepatitis B. For example, in countries with hepatitis B prevalence 8% (many countries in Sub-Sahara Africa, Asia, the Pacific region, and South America), health officials should introduce hepatitis B vaccine into their existing immunization programs by 1995. By 1997, this vaccine should be part of all immunization programs. The Assembly was aware of the obstacles of establishing reliable cold chains for nationwide distribution, however. Delegates in Committee A objected to the fact that 50% of the populations of developing countries continued to have limited access to essential drugs. They also expressed disapproval in implementation of WHO's 1988 ethical criteria for promotion of drugs which WHO entrusted to the Council for International Organisations of Medical Sciences (CIOMS). CIOMS lacked WHO's status and thus could not effectively monitor drug advertising. In fact, the pharmaceutical industry as well as WHO provided the funds for a meeting of 25 experts to discuss principles included in the ethical criteria. At least 4 countries insisted that WHO have the ultimate authority in monitoring drug advertising. Delegates did adopt a compromise resolution on this topic which required that industry promotion methods be reported to the 1994 Assembly via the Executive Board. The Assembly requested WHO to establish an international advisory committee on nursing and midwifery and to improve the network of

Oscillator circuits

CERN Document Server

Graf, Rudolf F

1996-01-01

This series of circuits provides designers with a quick source for oscillator circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listing

Measuring circuits

CERN Document Server

Graf, Rudolf F

1996-01-01

This series of circuits provides designers with a quick source for measuring circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listings

Measure Guideline: Three High Performance Mineral Fiber Insulation Board Retrofit Solutions

Energy Technology Data Exchange (ETDEWEB)

Neuhauser, Ken [Building Science Corporation, Westford, MA (United States)

2015-01-01

This Measure Guideline describes a high performance enclosure retrofit package that uses mineral fiber insulation board. The Measure Guideline describes retrofit assembly and details for wood frame roof and walls and for cast concrete foundations. This Measure Guideline is intended to serve contractors and designers seeking guidance for non-foam exterior insulation retrofit.

The Planck-LFI Radiometer Electronics Box Assembly

Science.gov (United States)

Herreros, J. M.; Gómez, M. F.; Rebolo, R.; Chulani, H.; Rubiño-Martin, J. A.; Hildebrandt, S. R.; Bersanelli, M.; Butler, R. C.; Miccolis, M.; Peña, A.; Pereira, M.; Torrero, F.; Franceschet, C.; López, M.; Alcalá, C.

2009-12-01

The Radiometer Electronics Box Assembly (REBA) is the control and data processing on board computer of the Low Frequency Instrument (LFI) of the Planck mission (ESA). The REBA was designed and built incorporating state of the art processors, communication interfaces and real time operating system software in order to meet the scientific performance of the LFI. We present a technical summary of the REBA, including a physical, functional, electrical, mechanical and thermal description. Aspects of the design and development, the assembly, the integration and the verification of the equipment are provided. A brief description of the LFI on board software is given including the Low-Level Software and the main functionalities and architecture of the Application Software. The compressor module, which has been developed as an independent product, later integrated in the application, is also described in this paper. Two identical engineering models EM and AVM, the engineering qualification model EQM, the flight model FM and flight spare have been manufactured and tested. Low-level and Application software have been developed. Verification activities demonstrated that the REBA hardware and software fulfil all the specifications and perform as required for flight operation.

The Planck-LFI Radiometer Electronics Box Assembly

International Nuclear Information System (INIS)

Herreros, J M; Gomez, M F; Rebolo, R; Chulani, H; Rubino-Martin, J A; Hildebrandt, S R; Bersanelli, M; Franceschet, C; Butler, R C; Miccolis, M; Pena, A; Pereira, M; Torrero, F; Lopez, M; Alcala, C

2009-01-01

The Radiometer Electronics Box Assembly (REBA) is the control and data processing on board computer of the Low Frequency Instrument (LFI) of the Planck mission (ESA). The REBA was designed and built incorporating state of the art processors, communication interfaces and real time operating system software in order to meet the scientific performance of the LFI. We present a technical summary of the REBA, including a physical, functional, electrical, mechanical and thermal description. Aspects of the design and development, the assembly, the integration and the verification of the equipment are provided. A brief description of the LFI on board software is given including the Low-Level Software and the main functionalities and architecture of the Application Software. The compressor module, which has been developed as an independent product, later integrated in the application, is also described in this paper. Two identical engineering models EM and AVM, the engineering qualification model EQM, the flight model FM and flight spare have been manufactured and tested. Low-level and Application software have been developed. Verification activities demonstrated that the REBA hardware and software fulfil all the specifications and perform as required for flight operation.

The Planck-LFI Radiometer Electronics Box Assembly

Energy Technology Data Exchange (ETDEWEB)

Herreros, J M; Gomez, M F; Rebolo, R; Chulani, H; Rubino-Martin, J A; Hildebrandt, S R [Instituto de Astrofisica de Canarias (IAC), 38200 La Laguna, Tenerife (Spain); Bersanelli, M; Franceschet, C [Universita di Milano, Dipartamento di Fisica, Via G. Celoria 16, 20133 Milano (Italy); Butler, R C [INAF-IASF Bologna, Via P. Gobetti 101, 40129 Bologna (Italy); Miccolis, M [Thales Alenia Space Italia S.p.A., IUEL - Scientific Instruments, S.S. Padana Superiore 290, 20090 Vimodrone (Italy); Pena, A; Pereira, M; Torrero, F; Lopez, M; Alcala, C, E-mail: rrl@iac.e [EADS Astrium CRISA, C/Torres Quevedo, 9, 28760 Tres Cantos (Spain)

2009-12-15

The Radiometer Electronics Box Assembly (REBA) is the control and data processing on board computer of the Low Frequency Instrument (LFI) of the Planck mission (ESA). The REBA was designed and built incorporating state of the art processors, communication interfaces and real time operating system software in order to meet the scientific performance of the LFI. We present a technical summary of the REBA, including a physical, functional, electrical, mechanical and thermal description. Aspects of the design and development, the assembly, the integration and the verification of the equipment are provided. A brief description of the LFI on board software is given including the Low-Level Software and the main functionalities and architecture of the Application Software. The compressor module, which has been developed as an independent product, later integrated in the application, is also described in this paper. Two identical engineering models EM and AVM, the engineering qualification model EQM, the flight model FM and flight spare have been manufactured and tested. Low-level and Application software have been developed. Verification activities demonstrated that the REBA hardware and software fulfil all the specifications and perform as required for flight operation.

Trends in integrated circuit design for particle physics experiments

International Nuclear Information System (INIS)

Atkin, E V

2017-01-01

Integrated circuits are one of the key complex units available to designers of multichannel detector setups. A whole number of factors makes Application Specific Integrated Circuits (ASICs) valuable for Particle Physics and Astrophysics experiments. Among them the most important ones are: integration scale, low power dissipation, radiation tolerance. In order to make possible future experiments in the intensity, cosmic, and energy frontiers today ASICs should provide new level of functionality at a new set of constraints and trade-offs, like low-noise high-dynamic range amplification and pulse shaping, high-speed waveform sampling, low power digitization, fast digital data processing, serialization and data transmission. All integrated circuits, necessary for physical instrumentation, should be radiation tolerant at an earlier not reached level (hundreds of Mrad) of total ionizing dose and allow minute almost 3D assemblies. The paper is based on literary source analysis and presents an overview of the state of the art and trends in nowadays chip design, using partially own ASIC lab experience. That shows a next stage of ising micro- and nanoelectronics in physical instrumentation. (paper)

Alternative Design Concepts for Multi-Circuit HTS Link Systems

CERN Document Server

Ballarino, A

2011-01-01

Superconducting cables for power transmission usually contain two conductors for DC application, or three conductors for AC, with high voltage insulation. In contrast, for some applications related to accelerators it is convenient to transfer high currents via superconducting links feeding a number of circuits at relatively low voltage, of the order of a kilovolt, over distances of up to a few hundred meters. For power transmission applications based on cooling via sub-cooled liquid nitrogen, suitable HTS conductors are only available in the form of tape, and a multi-layer variant can be envisaged for the multi-circuit links. However, where cooling to temperatures of the order of 20 K is feasible, MgB2 conductor, available in the form of both tape and wire, can also be envisaged and in the latter case used to assemble round cables. There are, therefore, two distinct topologies - based on the use of wires or tapes - that can be envisaged for use in applications to multi-circuit link systems. In this paper the ...

SPRINT - An Interactive System for Printed Circuit Board Design User’s Guide.

Science.gov (United States)

1977-06-01

effect as decreasing the time limit - your priority and turnaround time are improved. B) You have a very large circuit and an error message says...previous segment. If no path is found, a message is printed to that effect . If HIWIRE thinks the failure may have been due to too small a value of...USAF Academy, Colorado 80840 AUL/LSE-9663 Maxwell AFB, Alabama 36112 AFETR Technical Library P.O. Box 4608, MU 5650 Patrick AFB

Resonance circuits for adiabatic circuits

Directory of Open Access Journals (Sweden)

C. Schlachta

2003-01-01

Full Text Available One of the possible techniques to reduces the power consumption in digital CMOS circuits is to slow down the charge transport. This slowdown can be achieved by introducing an inductor in the charging path. Additionally, the inductor can act as an energy storage element, conserving the energy that is normally dissipated during discharging. Together with the parasitic capacitances from the circuit a LCresonant circuit is formed.

Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

Science.gov (United States)

Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

2015-11-01

In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

FPGA development board for applications in cosmic rays physics

International Nuclear Information System (INIS)

Angelov, Ivo; Damov, Krasimir; Dimitrova, Svetla

2013-01-01

The modern experiments in cosmic rays and particle physics are usually performed with large number of detectors and signal processing have to be done by complex electronics. The analog signals from the detectors are converted to digital (by discriminators or fast ADC) and connected to different type of logic implemented in FPGA (Field Programmable Gate Arrays). A FPGA development board based on Xilinx XC3S50AN was designed, assembled and tested. The board will be used for developing a modern registering controller (to replace the existing now) for the muon telescope in the University and can be used for other experiments in cosmic rays physics when fast digital pulses have to be processed. Keywords: FPGA, Spartan3A, muon telescope, cosmic rays variations

A new model for simulating microbial cyanide production and optimizing the medium parameters for recovering precious metals from waste printed circuit boards.

Science.gov (United States)

Yuan, Zhihui; Ruan, Jujun; Li, Yaying; Qiu, Rongliang

2018-04-10

Bioleaching is a green recycling technology for recovering precious metals from waste printed circuit boards (WPCBs). However, this technology requires increasing cyanide production to obtain desirable recovery efficiency. Luria-Bertani medium (LB medium, containing tryptone 10 g/L, yeast extract 5 g/L, NaCl 10 g/L) was commonly used in bioleaching of precious metal. In this study, results showed that LB medium did not produce highest yield of cyanide. Under optimal culture conditions (25 °C, pH 7.5), the maximum cyanide yield of the optimized medium (containing tryptone 6 g/L and yeast extract 5 g/L) was 1.5 times as high as that of LB medium. In addition, kinetics and relationship of cell growth and cyanide production was studied. Data of cell growth fitted logistics model well. Allometric model was demonstrated effective in describing relationship between cell growth and cyanide production. By inserting logistics equation into allometric equation, we got a novel hybrid equation containing five parameters. Kinetic data for cyanide production were well fitted to the new model. Model parameters reflected both cell growth and cyanide production process. Copyright © 2018 Elsevier B.V. All rights reserved.

Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

Science.gov (United States)

Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

2014-01-01

Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

Development of FPGA-Based Control Board

Energy Technology Data Exchange (ETDEWEB)

Lee, Yoon Hee; Jeong, See Chae; Choi, Woong Seock; Lee, Chang Jae; Jeong, Jin Kwon; Ha, Jae Hong [Korea Power Engineering Company Inc., Daejeon (Korea, Republic of)

2009-10-15

It is well known that existing nuclear power plant (NPP) control systems contain many components which are becoming obsolete at an increasing rate. Various studies have been conducted to address control system hardware obsolescence. Obsolete analog and digital control systems in non-nuclear power plants are commonly replaced with modern digital control systems, programmable logic controllers (PLC) and distributed control systems (DCS). Field Programmable Gate Arrays (FPGAs) are highlighted as an alternative means for obsolete control systems. FPGAs are advanced digital integrated circuits (ICs) that contain configurable (programmable) blocks of logic along with configurable interconnects between these blocks. Designers can configure (program) such devices to perform a tremendous variety of tasks. FPGAs have been evolved from the technology of Programmable Logic Device (PLD). Nowadays they can contain millions of logic gates by nanotechnology and so be used to implement extremely large and complex functions that previously could be realized only using Application-Specific Integrated Circuits (ASICs). This paper is to present the development of a FPGAbased control board performing user-defined control functions. An Actel ProASIC{sup plus} FPGA platform is implemented as the comparator of Plant Protection System (PPS). Functional simulation is implemented for the comparator.

Selective joining technique for high power electronics; Selektive Verbindungstechnik fuer die Leistungselektronik

Energy Technology Data Exchange (ETDEWEB)

Fehrenbach, Manfred [EUTECT GmbH, Dusslingen (Germany)

2012-11-01

Stringent demands are placed on the quality, reliability and workmanship of electronic components in modern automotive electronics, high-performance LEDs (HLEDs) and regenerative electrical power generation. Automated selective integrated circuit packaging processes are increasingly becoming irreplaceable. Integrated circuit packing can be performed by means of mini-wave, laser, iron or hot-bar soldering, as well as the micro welding process. In addition to the modification of existing technologies, this also requires new joining technologies and test strategies for quality assurance. Interdisciplinary expertise with regard to process technology and system function is therefore essential for sound process assurance, maximum effectiveness and added value in the joining process. This article addresses the processing of THT electronics assemblies in the areas of printed-circuit boards, LEDs, flex foils, leadframes, hybrids and special types. Using high-power LED processes as examples, integrated circuit packaging is described for IMS, Osram Philips, Samsung and further LED designs, as well as printed-circuit board, flex-foil and jumper connections to the associated LED heat sinks. (orig.)

Development of reconfigurable analog and digital circuits for plasma diagnostics measurement systems

International Nuclear Information System (INIS)

Srivastava, Amit Kumar; Sharma, Atish; Raval, Tushar

2009-01-01

In long pulse discharge tokamak, a large number of diagnostic channels are being used to understand the complex behavior of plasma. Different diagnostics demand different types of analog and digital processing for plasma parameters measurement. This leads to variable requirements of signal processing for diagnostic measurement. For such types of requirements, we have developed hardware with reconfigurable electronic devices, which provide flexible solution for rapid development of measurement system. Here the analog processing is achieved by Field Programmable Analog Array (FPAA) integrated circuit while reconfigurable digital devices (CPLD/FPGA) achieve digital processing. FPAA's provide an ideal integrated platform for implementing low to medium complexity analog signal processing. With dynamic reconfigurability, the functionality of the FPAA can be reconfigured in-system by the designer or on the fly by a microprocessor. This feature is quite useful to manipulate the tuning or the construction of any part of the analog circuit without interrupting operation of the FPAA, thus maintaining system integrity. The hardware operation control logic circuits are configured in the reconfigurable digital devices (CPLD/FPGA) to control proper hardware functioning. These reconfigurable devices provide the design flexibility and save the component space on the board. It also provides the flexibility for various setting through software. The circuit controlling commands are either issued by computer/processor or generated by circuit itself. (author)

Integrated electric circuit engineering system in LSI design center, Konami Kogyo Co. Ltd

Energy Technology Data Exchange (ETDEWEB)

Kamitsuki, Kagehiko; Tanaka, Tomiaki

1988-08-26

Development of the integrated engineering system is presented which designs and manufactures the hardwares, softwares and cases of electronic game products with LSI integratedly as an experiment. The system is intended to reduce the number of each development of the parts, to verify each other by comparing each parts with the product concept during the development, to reduce modifications, and to shorten development periods. The main subsystems are an electric circuit CAD for LSI designs and a mechanical CAD for case or printed circuit board designs. The LSI development period has been shortened up to one month by a larger capacity computer and higher speed simulator, and the electric circuit engineering system capable of keeping step with the software development has been approximately completed. In the future, the system will be intended to introduce an expert system or a visual system capable of predicting the final product during a logical design period. (10 figs, 1 photo)

Governing Board of the Pension Fund

CERN Multimedia

2004-01-01

All members and beneficiaries of the Pension Fund are invited to attend the Annual General Asssembly to be held in the CERN Auditorium on Wednesday 6 October 2004 at 14.30 hrs The Agenda comprises: Opening Remarks (J. Bezemer) Results and presentation of the Annual Report 2003, and global situation of provident institutions (C. Cuénoud) Copies of the 2003 Report are available from departmental secretariats. The 2004 Actuarial Study (J.-P. Matheys) Questions from members and beneficiaries Persons wishing to ask questions are encouraged to submit them, where possible, in writing in advance, addressed to Mr C. Cuénoud, Administrator of the Fund. Conclusions (J. Bezemer) As usual, participants are invited to drinks after the assembly. NB The minutes of the 2003 General Assembly are available from the Administration of the Fund (tel.(+4122)767 27 42; e-mail Sophia.Revol@cern.ch) SOME ASPECTS OF THE FUND'S ACTIVITIES IN 2003 The Governing Board (at 31 December 2003) Members Appointed by J. Be...

Project Circuits in a Basic Electric Circuits Course

Science.gov (United States)

Becker, James P.; Plumb, Carolyn; Revia, Richard A.

2014-01-01

The use of project circuits (a photoplethysmograph circuit and a simple audio amplifier), introduced in a sophomore-level electric circuits course utilizing active learning and inquiry-based methods, is described. The development of the project circuits was initiated to promote enhanced engagement and deeper understanding of course content among…

Monolithic Microwave Integrated Circuit (MMIC) technology for space communications applications

Science.gov (United States)

Connolly, Denis J.; Bhasin, Kul B.; Romanofsky, Robert R.

1987-01-01

Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMIC's to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMIC's is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. For the more distant future pseudomorphic indium gallium arsenide (InGaAs) and other advanced III-V materials offer the possibility of MMIC subsystems well up into the millimeter wavelength region. All of these technology elements are in NASA's MMIC program. Their status is reviewed.

 The Assembly of Lean Production: An Analysis of Doing Production Improvements

OpenAIRE

Andersson, Gunnar

2011-01-01

This thesis is an analysis of the assembly of the zero-defects project at Glomma Papp AS, a company on manufacture of paper, corrugated board, solid board and display, in Sarpsborg Norway. The zero-defects project was a local production improvement project based on approaches, tools and methods known as Lean. The project is seen as an actor-network, which means that its reality, and the understandings and practices of it, are effects of the web of people, structures, technologies and others w...

Syntactic sequencing in Hebbian cell assemblies.

Science.gov (United States)

Wennekers, Thomas; Palm, Günther

2009-12-01

Hebbian cell assemblies provide a theoretical framework for the modeling of cognitive processes that grounds them in the underlying physiological neural circuits. Recently we have presented an extension of cell assemblies by operational components which allows to model aspects of language, rules, and complex behaviour. In the present work we study the generation of syntactic sequences using operational cell assemblies timed by unspecific trigger signals. Syntactic patterns are implemented in terms of hetero-associative transition graphs in attractor networks which cause a directed flow of activity through the neural state space. We provide regimes for parameters that enable an unspecific excitatory control signal to switch reliably between attractors in accordance with the implemented syntactic rules. If several target attractors are possible in a given state, noise in the system in conjunction with a winner-takes-all mechanism can randomly choose a target. Disambiguation can also be guided by context signals or specific additional external signals. Given a permanently elevated level of external excitation the model can enter an autonomous mode, where it generates temporal grammatical patterns continuously.

Multi-gigabit optical interconnects for next-generation on-board digital equipment

Science.gov (United States)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2017-11-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

Advances in gallium arsenide monolithic microwave integrated-circuit technology for space communications systems

Science.gov (United States)

Bhasin, K. B.; Connolly, D. J.

1986-01-01

Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMIC's to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMIC's is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. In this paper, current developments in GaAs MMIC technology are described, and the status and prospects of the technology are assessed.

High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

NARCIS (Netherlands)

Kouters, M.H.M.; Ubachs, R.; Wiel, H.J. van de; Waal, A. van der; Veer, J. van der

2011-01-01

Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic

Simulation and experimental study on lithium ion battery short circuit

International Nuclear Information System (INIS)

Zhao, Rui; Liu, Jie; Gu, Junjie

2016-01-01

Highlights: • Both external and internal short circuit tests were performed on Li-ion batteries. • An electrochemical–thermal model with an additional nail site heat source is presented. • The model can accurately simulate the temperature variations of non-venting batteries. • The model is reliable in predicting the occurrence and start time of thermal runaway. • A hydrogel cooling system proves its strength in preventing battery thermal runaway. - Abstract: Safety is the first priority in lithium ion (Li-ion) battery applications. A large portion of electrical and thermal hazards caused by Li-ion battery is associated with short circuit. In this paper, both external and internal short circuit tests are conducted. Li-ion batteries and battery packs of different capacities are used. The results indicate that external short circuit is worse for smaller size batteries due to their higher internal resistances, and this type of short can be well managed by assembling fuses. In internal short circuit tests, higher chance of failure is found on larger capacity batteries. A modified electrochemical–thermal model is proposed, which incorporates an additional heat source from nail site and proves to be successful in depicting temperature changes in batteries. Specifically, the model is able to estimate the occurrence and approximate start time of thermal runaway. Furthermore, the effectiveness of a hydrogel based thermal management system in suppressing thermal abuse and preventing thermal runaway propagation is verified through the external and internal short tests on batteries and battery packs.

Application of drive circuit based on L298N in direct current motor speed control system

Science.gov (United States)

Yin, Liuliu; Wang, Fang; Han, Sen; Li, Yuchen; Sun, Hao; Lu, Qingjie; Yang, Cheng; Wang, Quanzhao

2016-10-01

In the experiment of researching the nanometer laser interferometer, our design of laser interferometer circuit system is up to the wireless communication technique of the 802.15.4 IEEE standard, and we use the RF TI provided by Basic to receive the data on speed control system software. The system's hardware is connected with control module and the DC motor. However, in the experiment, we found that single chip microcomputer control module is very difficult to drive the DC motor directly. The reason is that the DC motor's starting and braking current is larger than the causing current of the single chip microcomputer control module. In order to solve this problem, we add a driving module that control board can transmit PWM wave signal through I/O port to drive the DC motor, the driving circuit board can come true the function of the DC motor's positive and reversal rotation and speed adjustment. In many various driving module, the L298N module's integrated level is higher compared with other driver module. The L298N model is easy to control, it not only can control the DC motor, but also achieve motor speed control by modulating PWM wave that the control panel output. It also has the over-current protection function, when the motor lock, the L298N model can protect circuit and motor. So we use the driver module based on L298N to drive the DC motor. It is concluded that the L298N driver circuit module plays a very important role in the process of driving the DC motor in the DC motor speed control system.

The on-board tailpipe emissions measurement system (TOTEMS) : proof\\0x2010 of\\0x2010concept.

Science.gov (United States)

2009-06-03

An on-board tailpipe emissions instrumentation system was designed, assembled and tested as proof-of-concept : for the University of Vermonts Transportation Research Center (TRC) Signature Project #2 real-world vehicle : emissions data colle...

An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

CERN Document Server

Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

2004-01-01

The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

Design parameters for voltage-controllable directed assembly of single nanoparticles

International Nuclear Information System (INIS)

Porter, Benjamin F; Bhaskaran, Harish; Abelmann, Leon

2013-01-01

Techniques to reliably pick-and-place single nanoparticles into functional assemblies are required to incorporate exotic nanoparticles into standard electronic circuits. In this paper we explore the use of electric fields to drive and direct the assembly process, which has the advantage of being able to control the nano-assembly process at the single nanoparticle level. To achieve this, we design an electrostatic gating system, thus enabling a voltage-controllable nanoparticle picking technique. Simulating this system with the nonlinear Poisson–Boltzmann equation, we can successfully characterize the parameters required for single particle placement, the key being single particle selectivity, in effect designing a system that can achieve this controllably. We then present the optimum design parameters required for successful single nanoparticle placement at ambient temperature, an important requirement for nanomanufacturing processes. (paper)

Circuit designs for measuring reactor period, peak power, and pulse fluence on TRIGA and other pulse reactor

International Nuclear Information System (INIS)

Meyer, R.D.; Thome, F.V.; Williams, R.L.

1976-01-01

Inexpensive circuits for use in evaluating reactor pulse prompt period, peak power, and pulse fluence (NVT) are presented. In addition to low cost, these circuits are easily assembled and calibrated and operate with a high degree of accuracy. The positive period measuring system has been used in evaluating reactivity additions as small as 5 cents (with an accuracy of ±0.1 cents) and as large as $4.50 (accuracy ±2 cents). Reactor peak power is measured digitally with a system accuracy of ±0.04% of a 10 Volt input (±4 mV). The NVT circuit measures over a 2-1/2 decade range, has 3 place resolution and an accuracy of better than 1%. (author)

Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

Energy Technology Data Exchange (ETDEWEB)

Stuhlpfarrer, Philipp, E-mail: philipp-johannes.stuhlpfarrer@stud.unileoben.ac.at; Luidold, Stefan; Antrekowitsch, Helmut

2016-04-15

Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution.

Science.gov (United States)

Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

2016-04-15

The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400°C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200°C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones. Copyright © 2015 Elsevier B.V. All rights reserved.

Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

International Nuclear Information System (INIS)

Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

2016-01-01

Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

Science.gov (United States)

Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

2018-02-01

The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

Energy Technology Data Exchange (ETDEWEB)

Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

2016-09-05

Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu{sub 2}O, CuO, and SnO{sub 2} were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu{sup 0} → Cu{sup +} → Cu{sup 2+}) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu{sup +} and Cu{sup 2+}. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

International Nuclear Information System (INIS)

Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

2016-01-01

Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu_2O, CuO, and SnO_2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu"0 → Cu"+ → Cu"2"+) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu"+ and Cu"2"+. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

Ultra-low power integrated circuit design circuits, systems, and applications

CERN Document Server

Li, Dongmei; Wang, Zhihua

2014-01-01

This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.

Fast assembly of ordered block copolymer nanostructures through microwave annealing.

Science.gov (United States)

Zhang, Xiaojiang; Harris, Kenneth D; Wu, Nathanael L Y; Murphy, Jeffrey N; Buriak, Jillian M

2010-11-23

Block copolymer self-assembly is an innovative technology capable of patterning technologically relevant substrates with nanoscale precision for a range of applications from integrated circuit fabrication to tissue interfacing, for example. In this article, we demonstrate a microwave-based method of rapidly inducing order in block copolymer structures. The technique involves the usage of a commercial microwave reactor to anneal block copolymer films in the presence of appropriate solvents, and we explore the effect of various parameters over the polymer assembly speed and defect density. The approach is applied to the commonly used poly(styrene)-b-poly(methyl methacrylate) (PS-b-PMMA) and poly(styrene)-b-poly(2-vinylpyridine) (PS-b-P2VP) families of block copolymers, and it is found that the substrate resistivity, solvent environment, and anneal temperature all critically influence the self-assembly process. For selected systems, highly ordered patterns were achieved in less than 3 min. In addition, we establish the compatibility of the technique with directed assembly by graphoepitaxy.

A new method of assembling large magnetic blocks from permanent NdFeB magnets

Czech Academy of Sciences Publication Activity Database

Žežulka, Václav; Straka, Pavel

2007-01-01

Roč. 4, č. 3 (2007), 75-83 ISSN 1214-9705 Institutional research plan: CEZ:AV0Z30460519 Keywords : magnet assembly * magnet ic circuits * magnet ic separation Subject RIV: BM - Solid Matter Physics ; Magnet ism www.irsm.cas.cz

Optimal replacement and inspection periods of safety and control boards in Wolsung nuclear power plant unit 1

International Nuclear Information System (INIS)

Mok, Jin Il

1993-02-01

In nuclear power plants, the safety and control systems are important for operating and maintaining safety of nuclear power plants. Due to the failure of the instrument and control devices of nuclear power plants caused by aging, nuclear power plants occasionally trip. Since the start of first commercial operation of Kori nuclear power plant (NPP) unit 1, the trips caused by instrument and control systems account for 28% of total trips of NPPs in Korea. Even a single trip of a nuclear power plant causes an extravagant economical loss and deteriorates public acceptance of nuclear power plants. Therefore, the replacement of the instrument and control devices with proper consideration of the aging effect is necessary in order to prevent the inadvertent trip. In this work we investigated the optimal replacement periods of the digital control computer's (DCC) and the programmable digital comparator's (PDC) electronic circuit boards of Wolsung nuclear power plant Unit 1. We first derived mathematical models which calculate optimal replacement periods for electronic circuit boards of digital control computer (DCC) and for those of the programmable digital comparator (PDC) in Wolsung NPP unit 1. And we analytically obtained the optimal replacement periods of electronic circuit boards by using these models. We compared these periods with the replacement periods currently used at Wolsung NPP Unit. The periods used at Wolsung is not based on mathematical analysis, but on empirical knowledge. As a consequence, the optimal replacement periods analytically obtained for the electronic circuit boards of DCC and those used in the field shown small difference : the optimal replacement periods analytically obtained for the electronic circuit boards of PDC are shorter than those used in the field in general. The engineered safeguards of Wolsung nuclear power plant unit 1 contains redundant systems of 2-out-of-3 logic which are not operating under normal conditions but they are called

Au–Sn bonding material for the assembly of power integrated circuit module

Energy Technology Data Exchange (ETDEWEB)

Zhu, Z.X.; Li, C.C. [Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan (China); Liao, L.L.; Liu, C.K. [Electronic and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan (China)

2016-06-25

Insulated gate bipolar transistor (IGBT) chips are the key components in high-temperature power electronic modules, which have to efficiently convert electricity between direct and alternating current. In this study, the eutectic Au–Sn (20 wt.% Sn) is successfully used to assemble IGBT chips and direct-bond-copper substrates by using solid liquid interdiffusion (SLID) bonding. During subsequent isothermal aging at 150, 200, and 240 °C, the microstructure evolution and growth kinetics of intermetallic compounds are investigated. Excellent thermal stability and mechanical strength are observed. It is concluded that the eutectic Au–Sn solder is ideal to assemble high-temperature IGBT by using the SLID process. - Highlights: • Au–20Sn serves as a promising bonding material for IGBT operating at T < 519 °C. • The Au–20Sn reacted with Ni to form (Ni,Au){sub 3}Sn{sub 2}/(Au{sub 5}Sn + AuSn)/(Ni,Au){sub 3}Sn{sub 2}. • Once the AuSn was nearly exhausted, the whole joint could withstand higher temperatures. • A cost-effective way for long-term operations at high temperature.

Electronic circuit encyclopedia 2

Energy Technology Data Exchange (ETDEWEB)

Park, Sun Ho

1992-10-15

This book is composed of 15 chapters, which are amplification of weak signal and measurement circuit audio control and power amplification circuit, data transmission and wireless system, forwarding and isolation, signal converting circuit, counter and comparator, discriminator circuit, oscillation circuit and synthesizer, digital and circuit on computer image processing circuit, sensor drive circuit temperature sensor circuit, magnetic control and application circuit, motor driver circuit, measuring instrument and check tool and power control and stability circuit.

Electronic circuit encyclopedia 2

International Nuclear Information System (INIS)

Park, Sun Ho

1992-10-01

This book is composed of 15 chapters, which are amplification of weak signal and measurement circuit audio control and power amplification circuit, data transmission and wireless system, forwarding and isolation, signal converting circuit, counter and comparator, discriminator circuit, oscillation circuit and synthesizer, digital and circuit on computer image processing circuit, sensor drive circuit temperature sensor circuit, magnetic control and application circuit, motor driver circuit, measuring instrument and check tool and power control and stability circuit.

Solid-state circuits

CERN Document Server

Pridham, G J

2013-01-01

Solid-State Circuits provides an introduction to the theory and practice underlying solid-state circuits, laying particular emphasis on field effect transistors and integrated circuits. Topics range from construction and characteristics of semiconductor devices to rectification and power supplies, low-frequency amplifiers, sine- and square-wave oscillators, and high-frequency effects and circuits. Black-box equivalent circuits of bipolar transistors, physical equivalent circuits of bipolar transistors, and equivalent circuits of field effect transistors are also covered. This volume is divided

Wiring Together Synthetic Bacterial Consortia to Create a Biological Integrated Circuit.

Science.gov (United States)

Perry, Nicolas; Nelson, Edward M; Timp, Gregory

2016-12-16

The promise of adapting biology to information processing will not be realized until engineered gene circuits, operating in different cell populations, can be wired together to express a predictable function. Here, elementary biological integrated circuits (BICs), consisting of two sets of transmitter and receiver gene circuit modules with embedded memory placed in separate cell populations, were meticulously assembled using live cell lithography and wired together by the mass transport of quorum-sensing (QS) signal molecules to form two isolated communication links (comlinks). The comlink dynamics were tested by broadcasting "clock" pulses of inducers into the networks and measuring the responses of functionally linked fluorescent reporters, and then modeled through simulations that realistically captured the protein production and molecular transport. These results show that the comlinks were isolated and each mimicked aspects of the synchronous, sequential networks used in digital computing. The observations about the flow conditions, derived from numerical simulations, and the biofilm architectures that foster or silence cell-to-cell communications have implications for everything from decontamination of drinking water to bacterial virulence.

The design of infrared information collection circuit based on embedded technology

Science.gov (United States)

Liu, Haoting; Zhang, Yicong

2013-07-01

S3C2410 processor is a 16/32 bit RISC embedded processor which based on ARM920T core and AMNA bus, and mainly for handheld devices, and high cost, low-power applications. This design introduces a design plan of the PIR sensor system, circuit and its assembling, debugging. The Application Circuit of the passive PIR alarm uses the invisibility of the infrared radiation well into the alarm system, and in order to achieve the anti-theft alarm and security purposes. When the body goes into the range of PIR sensor detection, sensors will detect heat sources and then the sensor will output a weak signal. The Signal should be amplified, compared and delayed; finally light emitting diodes emit light, playing the role of a police alarm.

A resonant dc-dc power converter assembly

OpenAIRE

Madsen, Mickey Pierre

2015-01-01

The present invention relates to a resonant DC-DC power converter assembly comprising a first resonant DC-DC power converter and a second resonant DC-DC power converter having identical circuit topologies. A first inductor of the first resonant DC-DC power converter and a second inductor of the second resonant DC-DC power converter are configured for magnetically coupling the first and second resonant DC-DC power converters to each other to forcing substantially 180 degrees phase shift, or fo...

GOVERNING BOARD OF THE PENSION FUND

CERN Multimedia

2002-01-01

All members and beneficiaries of the Pension Fund are invited to attend the Annual General Asssembly to be held in the CERN Auditorium on Wednesday 2 October 2002 at 14.30 hrs The Agenda comprises: Opening Remarks (P. Levaux) Recent trends in the technical balance of pension funds (C. Cuénoud) Annual Report 2001: Presentation and results (C. Cuénoud) Copies of the Report are available from divisional secretariats. Position of the CERN Pension Fund with respect to market developments (G. Maurin) Questions from members and beneficiaries Persons wishing to ask questions are encouraged to submit them, where possible, in writing in advance, addressed to Mr C. Cuénoud, Administrator of the Fund. Conclusions (P. Levaux) As usual, participants are invited to drinks after the assembly. NB The minutes of the 2001 General Assembly are available from the Administration of the Fund (tel.(+4122)767 9194; e-mail Graziella.Praire@cern.ch) SOME ASPECTS OF THE FUND'S ACTIVITIES IN 2001 The Governing Board (at 31 De...

Collective of mechatronics circuit

International Nuclear Information System (INIS)

1987-02-01

This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

Collective of mechatronics circuit

Energy Technology Data Exchange (ETDEWEB)

NONE

1987-02-15

This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

Microcomputer based test system for charge coupled devices

International Nuclear Information System (INIS)

Sidman, S.

1981-02-01

A microcomputer based system for testing analog charge coupled integrated circuits has been developed. It measures device performance for three parameters: dynamic range, baseline shift due to leakage current, and transfer efficiency. A companion board tester has also been developed. The software consists of a collection of BASIC and assembly language routines developed on the test system microcomputer

Experimental Device for Learning of Logical Circuit Design using Integrated Circuits

OpenAIRE

石橋, 孝昭

2012-01-01

This paper presents an experimental device for learning of logical circuit design using integrated circuits and breadboards. The experimental device can be made at a low cost and can be used for many subjects such as logical circuits, computer engineering, basic electricity, electrical circuits and electronic circuits. The proposed device is effective to learn the logical circuits than the usual lecture.

Doubling-resolution analog-to-digital conversion based on PIC18F45K80

Directory of Open Access Journals (Sweden)

Yueyang Yuan

2014-08-01

Full Text Available Aiming at the analog signal being converted into the digital with a higher precision, a method to improve the analog-to-digital converter (ADC resolution is proposed and described. Based on the microcomputer PIC18F45K80 in which the internal ADC modules are embedded, a circuit is designed for doubling the resolution of ADC. According to the circuit diagram, the mathematical formula for calculating this resolution is derived. The corresponding software and print circuit board assembly is also prepared. With the experiment, a 13 bit ADC is achieved based on the 12 bit ADC module predesigned in the PIC18F45K80.

Low-level software for the pentek 6510 digital receiver board applied to the new AD beam measurement system

CERN Document Server

Angoletta, Maria Elena

2002-01-01

The new beam measurement system for the CERN Antiproton Decelerator heavily relies on a Pentek 6510 Digital Receiver (DRX) board. The new system goal is to extract beam parameters from pickup signals. Its digital implementation allows for higher precision, easier management of the hardware as well as modification and improvement with no hardware change. In this scheme, this innovative VME DRX board is responsible for parallel data acquisition, independent digital down conversion and processing of up to 4 digitised inputs. The in-house- developed low-level code (LLC), running on the board, takes care of several tasks, such as interfacing with the Real Time Task (RTT), data processing and board managing. The RTT runs on a PowerPC VME board and controls the DRX board as a master. The LLC is a state machine developed in C and Assembler, which services several interrupts and performs the FFT of complex input data. The DRX low-level system developed is highly modular and easily adaptable to other processing scenari...

Simulation of high SNR photodetector with L-C coupling and transimpedance amplifier circuit and its verification

Science.gov (United States)

Wang, Shaofeng; Xiang, Xiao; Zhou, Conghua; Zhai, Yiwei; Quan, Runai; Wang, Mengmeng; Hou, Feiyan; Zhang, Shougang; Dong, Ruifang; Liu, Tao

2017-01-01

In this paper, a model for simulating the optical response and noise performances of photodetectors with L-C coupling and transimpedance amplification circuit is presented. To verify the simulation, two kinds of photodetectors, which are based on the same printed-circuit-board (PCB) designing and PIN photodiode but different operational amplifiers, are developed and experimentally investigated. Through the comparisons between the numerical simulation results and the experimentally obtained data, excellent agreements are achieved, which show that the model provides a highly efficient guide for the development of a high signal to noise ratio photodetector. Furthermore, the parasite capacitances on the developed PCB, which are always hardly measured but play a non-negligible influence on the photodetectors' performances, are estimated.

Self-Assembly of Hierarchical DNA Nanotube Architectures with Well-Defined Geometries.

Science.gov (United States)

Jorgenson, Tyler D; Mohammed, Abdul M; Agrawal, Deepak K; Schulman, Rebecca

2017-02-28

An essential motif for the assembly of biological materials such as actin at the scale of hundreds of nanometers and beyond is a network of one-dimensional fibers with well-defined geometry. Here, we demonstrate the programmed organization of DNA filaments into micron-scale architectures where component filaments are oriented at preprogrammed angles. We assemble L-, T-, and Y-shaped DNA origami junctions that nucleate two or three micron length DNA nanotubes at high yields. The angles between the nanotubes mirror the angles between the templates on the junctions, demonstrating that nanoscale structures can control precisely how micron-scale architectures form. The ability to precisely program filament orientation could allow the assembly of complex filament architectures in two and three dimensions, including circuit structures, bundles, and extended materials.

Color Coding of Circuit Quantities in Introductory Circuit Analysis Instruction

Science.gov (United States)

Reisslein, Jana; Johnson, Amy M.; Reisslein, Martin

2015-01-01

Learning the analysis of electrical circuits represented by circuit diagrams is often challenging for novice students. An open research question in electrical circuit analysis instruction is whether color coding of the mathematical symbols (variables) that denote electrical quantities can improve circuit analysis learning. The present study…

Gold recovery from printed wiring board using bioleaching

Energy Technology Data Exchange (ETDEWEB)

Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

2004-07-01

In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

Design of an improved RCD buffer circuit for full bridge circuit

Science.gov (United States)

Yang, Wenyan; Wei, Xueye; Du, Yongbo; Hu, Liang; Zhang, Liwei; Zhang, Ou

2017-05-01

In the full bridge inverter circuit, when the switch tube suddenly opened or closed, the inductor current changes rapidly. Due to the existence of parasitic inductance of the main circuit. Therefore, the surge voltage between drain and source of the switch tube can be generated, which will have an impact on the switch and the output voltage. In order to ab sorb the surge voltage. An improve RCD buffer circuit is proposed in the paper. The peak energy will be absorbed through the buffer capacitor of the circuit. The part energy feedback to the power supply, another part release through the resistor in the form of heat, and the circuit can absorb the voltage spikes. This paper analyzes the process of the improved RCD snubber circuit, According to the specific parameters of the main circuit, a reasonable formula for calculating the resistance capacitance is given. A simulation model will be modulated in Multisim, which compared the waveform of tube voltage and the output waveform of the circuit without snubber circuit with the improved RCD snubber circuit. By comparing and analyzing, it is proved that the improved buffer circuit can absorb surge voltage. Finally, experiments are demonstrated to validate that the correctness of the RC formula and the improved RCD snubber circuit.

Analog circuit design designing dynamic circuit response

CERN Document Server

Feucht, Dennis

2010-01-01

This second volume, Designing Dynamic Circuit Response builds upon the first volume Designing Amplifier Circuits by extending coverage to include reactances and their time- and frequency-related behavioral consequences.

Simplified thermal-hydraulic analysis of single phase natural circulation circuit with two heat exchangers

Energy Technology Data Exchange (ETDEWEB)

Pinheiro, Larissa Cunha; Su, Jian, E-mail: larissa@lasme.coppe.ufrj.br, E-mail: sujian@lasme.coppe.ufrj.br [Coordenacao dos Programas de Pos-Graduacao em Engenharia (COPPE/UFRJ), Rio de Janeiro, RJ (Brazil). Programa de Engenhraria Nuclear; Cotta, Renato Machado, E-mail: cotta@mecanica.coppe.ufrj.br [Coordenacao dos Programas de Pos-Graduacao em Engenharia (POLI/COPPE/UFRJ), Rio de Janeiro, RJ (Brazil). Dept. de Engenharia Mecanica

2015-07-01

Single phase natural circulation circuits composed of two convective heat exchangers and connecting tubes are important for the passive heat removal from spent fuel pools (SFP). To keep the structural integrity of the stored spent fuel assemblies, continuously cooling has to be provided in order to avoid increase at the pool temperature and subsequent uncovering of the fuel and enhanced reaction between water and metal releasing hydrogen. Decay heat can achieve considerably high amounts of energy e.g. in the AP1000, considering the emergency fuel assemblies, the maximum heat decay will reach 13 MW in the 15th day (Westinghouse Electric Company, 2010). A highly efficient alternative to do so is by means of natural circulation, which is cost-effective compared to active cooling systems and is inherently safer since presents less associated devices and no external work is required. Many researchers have investigated safety and stability aspects of natural circulation loops (NCL). However, there is a lack of literature concerning the improvement of NCL through a standard unified methodology, especially for natural circulation circuits with two heat exchangers. In the present study, a simplified thermal-hydraulic analysis of single phase natural circulation circuit with two heat exchanges is presented. Relevant dimensionless key groups were proposed to for the design and safety analysis of a scaled NCL for the cooling of spent fuel storage pool with convective cooling and heating. (author)

Analysis of a PCB In-Circuit Test and Its Optimized Cycle

International Nuclear Information System (INIS)

Chi, Moon Goo; Lee, Eun Chan; Bae, Yeon Kyoung

2011-01-01

KHNP performs subcomponent performance tests of the PCBs (Printed Circuit Boards) installed in safety-related systems or plant trip-related systems with every outage. The characteristics of each subcomponent are measured by test equipment. The tests are known as an ICT (In-Circuit Test). If a degraded condition is detected by this test, the affected subcomponents are replaced. This test has been conducted for 17 years, since 1994, and its results have been compiled into a test system database. As part of the reliability improvement plan of critical PCBs, KHNP developed a program that analyzes the performance of various key PCBs based on this test data. Thus, it became possible to evaluate the performance trends related to PCBs by tracing the test history of the PCB subcomponents through the ICT over many years. The present study also estimates an optimized ICT cycle that can be implemented to prevent the degradation of PCBs before they fail due to aging

Circuit Bending Videogame Consoles as a Form of Applied Media Studies

Directory of Open Access Journals (Sweden)

Nina Belojevic

2014-07-01

Full Text Available This article raises a number of questions: Where do the parts on gaming circuit boards come from? Whose hands made them? Under what conditions? What happens to the materials in a device once we discard it? Perhaps predictably, these questions do not commonly come up when videogames are studied diegetically, based solely on what is expressed on the screen (Montfort; Kirschenbaum 27-28. However, the material study of hardware offers an approach that highlights material traces that may otherwise go unnoticed by gamers and scholars alike. Furthermore, it prompts an important question in the context of game studies: What do gamers and scholars tend to ignore when they are at once enthralled and distracted by the experiences afforded by the video, audio, and textual elements of games? As I argue below, circuit bending encourages a deep engagement with hardware that offers a materials-first approach and brings awareness to issues of exploitation not commonly raised and recorded by screen-centric analysis alone.

Opto-mechanical design of the MTG FCI spectral separation assembly

Science.gov (United States)

Riguet, François; Brousse, Emmanuel; Carel, Jean-Louis; Cottenye, Justine; Harmann, David; Joncour, Marc; Makhlouf, Houssine; Mouricaud, Daniel; Oussalah, Meihdi; Rodolfo, Jacques

2015-09-01

The Spectral Separation Assembly is a key component of the Flexible Combined Imager, an instrument that will be on-board Meteosat Third Generation. It splits the input beam coming from the telescope into five spectral groups, for a total of 16 channels, from 0.4 to 13.3 μm. It comprises a set of four dichroics separators followed by four collimating optics for the infrared spectral groups, which feed the cold imaging optics. The visible spectral group is directly imaged on a detector. This paper presents the optical design of the assembly, the mechanical mounting of the optical components, and the coatings developed for the dichroics, mirrors and lenses.

An educational laboratory virtual instrumentation suite assisted experiment for studying fundamentals of series resistance-inductance-capacitance circuit

Science.gov (United States)

Rana, K. P. S.; Kumar, Vineet; Mendiratta, Jatin

2017-11-01

One of the most elementary concepts in freshmen Electrical Engineering subject comprises the Resistance-Inductance-Capacitance (RLC) circuit fundamentals, that is, their time and frequency domain responses. For a beginner, generally, it is difficult to understand and appreciate the step and the frequency responses, particularly the resonance. This paper proposes a student-friendly teaching and learning approach by inculcating the multifaceted versatile software LabVIEWTM along with the educational laboratory virtual instrumentation suite hardware, for studying the RLC circuit time and frequency domain responses. The proposed approach has offered an interactive laboratory experiment where students can model circuits in simulation and hardware circuits on prototype board, and then compare their performances. The theoretical simulations and the obtained experimental data are found to be in very close agreement, thereby enhancing the conviction of students. Finally, the proposed methodology was also subjected to the assessment of learning outcomes based on student feedback, and an average score of 8.05 out of 10 with a standard deviation of 0.471 was received, indicating the overall satisfaction of the students.

Process development for automated solar-cell and module production. Task 4. Automated array assembly. Quarterly report No. 3

Energy Technology Data Exchange (ETDEWEB)

Hagerty, J. J.; Gifford, M.

1981-04-15

The Automated Lamination Station is mechanically complete and is currently undergoing final wiring. The high current driver and isolator boards have been completed and installed, and the main interface board is under construction. The automated vacuum chamber has had a minor redesign to increase stiffness and improve the cover open/close mechanism. Design of the Final Assembly Station has been completed and construction is underway.

Assembly of gamma radiation detection with directivity properties

International Nuclear Information System (INIS)

Stoica, M.; Talpalariu, C.

2016-01-01

An assembly of gamma radiation detection with directivity properties and small size enables the development of portable equipment or robots specialized in finding and signaling radioactively contaminated areas in case of nuclear incidents or decommissioning of nuclear installations. Directivity characteristic of the assembly of gamma radiation detection is very important when aiming to build an equipment for searching radioactively contaminated areas. In order to obtain a suitable directivity characteristics in terms of detection of gamma rays, it was necessary to construct a lead collimator with a cylindrical shape. The detector, preamplifier and amplifier pulse were placed inside the collimator and pulse discriminator circuit and power source were placed beside the collimator, all being disposed within the housing cylindrical experimental. A PIN photodiode type was used as a detector of gamma radiation. (authors)

A study of switch circuits for use as safety devices in nuclear reactors; Etude de circuits de commutation destines a la securite des reacteurs nucleaires

Energy Technology Data Exchange (ETDEWEB)

Hantcherian, V [Commissariat a l' Energie Atomique, Saclay (France). Centre d' Etudes Nucleaires

1960-12-15

The author reviews briefly a few basic assemblies using electromagnetic relays for safety circuits in nuclear reactors; he then studies the use of static relays with a shorter time of response, based on impedance changes in a self-inductance consisting of a coil with a magnetic core having a rectangular hysteresis cycle. The author examines in particular the way in which it functions and the method of determining the parameters. (author) [French] L'auteur apres avoir examine sommairement en revue quelques montages de base des circuits de securite des reacteurs nucleaires utilisant des relais electromecaniques, etudie l'emploi des relais statiques a plus grande vitesse de reponse bases sur la variation d'impedance que presente une self-inductance realisee a l'aide d'une bobine enroulee autour d'un noyau magnetique a cycle d'hysteresis rectangulaire. En particulier, il en examine le mode de fonctionnement et la determination des parametres. (auteur)

Board Task Performance

DEFF Research Database (Denmark)

Minichilli, Alessandro; Zattoni, Alessandro; Nielsen, Sabina

2012-01-01

identify three board processes as micro-level determinants of board effectiveness. Specifically, we focus on effort norms, cognitive conflicts and the use of knowledge and skills as determinants of board control and advisory task performance. Further, we consider how two different institutional settings....... The findings show that: (i) Board processes have a larger potential than demographic variables to explain board task performance; (ii) board task performance differs significantly between boards operating in different contexts; and (iii) national context moderates the relationships between board processes...... and board task performance....

A space-qualified experiment integrating HTS digital circuits and small cryocoolers

International Nuclear Information System (INIS)

Silver, A.; Akerling, G.; Auten, R.

1996-01-01

High temperature superconductors (HTS) promise to achieve electrical performance superior to that of conventional electronics. For application in space systems, HTS systems must simultaneously achieve lower power, weight, and volume than conventional electronics, and meet stringent space qualification and reliability requirements. Most effort to date has focused on passive RF/microwave applications. However, incorporation of active microwave components such as amplifiers, mixers, and phase shifters, and on-board high data rate digital signal processing is limited by the power and weight of their spacecraft electronic and support modules. Absence of data on active HTS components will prevent their utilization in space. To validate the feasibility in space of HTS circuits and components based on Josephson junctions, one needs to demonstrate HTS circuits and critical supporting technologies, such as space-qualified packaging and interconnects, closed-cycle cryocooling, and interface electronics. This paper describes the packaging, performance, and space test plan of an integrated, space-qualified experimental package consisting of HTS Josephson junction circuits and all the supporting components for NRL's high temperature superconductor space experiment (HTSSE-II). Most of the technical challenges and approaches are equally applicable to passive and active RF/microwave and digital electronic components, and this experiment will provide valuable validation data

Development of an anti-flood board to protect the interiors and exteriors of the infrastructure

Science.gov (United States)

Petru, Michal; Srb, Pavel; Sevcik, Ladislav; Martinec, Tomas; Kulhavy, Petr

2018-06-01

This article deals with the development of an anti-flood board to protect the interior and exterior of various infrastructures, such a houses, cottages or industrial buildings. It was designed prototypes and assembled numerical simulations. In Central Europe and in particular in the Czech Republic, floods are an integral part of the natural water cycle and cause great loss of life and great property damage. The development of new types of mobile anti-flood boards is very important as the design solution is developed for flood protection with regard to minimizing weight, cost of production, easy manipulation, simplicity and speed of installation.

Organic printed photonics: From microring lasers to integrated circuits.

Science.gov (United States)

Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

2015-09-01

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

Smart Power: New power integrated circuit technologies and their applications

Science.gov (United States)

Kuivalainen, Pekka; Pohjonen, Helena; Yli-Pietilae, Timo; Lenkkeri, Jaakko

1992-05-01

Power Integrated Circuits (PIC) is one of the most rapidly growing branches of the semiconductor technology. The PIC markets has been forecast to grow from 660 million dollars in 1990 to 1658 million dollars in 1994. It has even been forecast that at the end of the 1990's the PIC markets would correspond to the value of the whole semiconductor production in 1990. Automotive electronics will play the leading role in the development of the standard PIC's. Integrated motor drivers (36 V/4 A), smart integrated switches (60 V/30 A), solenoid drivers, integrated switch-mode power supplies and regulators are the latest standard devices of the PIC manufactures. ASIC (Application Specific Integrated Circuits) PIC solutions are needed for the same reasons as other ASIC devices: there are no proper standard devices, a company has a lot of application knowhow, which should be kept inside the company, the size of the product must be reduced, and assembly costs are wished to be reduced by decreasing the number of discrete devices. During the next few years the most probable ASIC PIC applications in Finland will be integrated solenoid and motor drivers, an integrated electronic lamp ballast circuit and various sensor interface circuits. Application of the PIC technologies to machines and actuators will strongly be increased all over the world. This means that various PIC's, either standard PIC's or full custom ASIC circuits, will appear in many products which compete with the corresponding Finnish products. Therefore the development of the PIC technologies must be followed carefully in order to immediately be able to apply the latest development in the smart power technologies and their design methods.

Multi-channel control circuit for real-time control of events in Aditya tokamak

Energy Technology Data Exchange (ETDEWEB)

Edappala, Praveenlal, E-mail: praveen@ipr.res.in; Shah, Minsha; Rajpal, Rachana; Tanna, R.L.; Ghosh, Joydeep; Chattopadhyay, P.K.; Jha, R.

2016-11-15

Highlights: • Low cost microcontroller based control circuit. • The control hardware can be programmed/configured very easily for different applications. • Microcontroller programming is done in assembly language so that precise timing can be achieved with micro seconds resolution. • Successful implementation of this circuit in noisy tokamak environment. • Efficient noise and burst elimination. • Can be integrated in to the other subsystems. • Low cost solution for implementing feedback control in small and medium size tokamaks and other experiments requiring feedback control. - Abstract: Tokamak plasma is prone to many random events having potential for causing severe damages to the machine, such as disruptions, production and elimination of high-energy runaway electrons etc. These events can be mitigated by obtaining pre-cursor signal leading to these events and then taking proper measures just before their onset to avoid their happenings, like disruptions can be mitigated by massive gas injection or putting a bias voltage on an electrode placed inside the plasma, the runaways can be mitigated by gas injection and by applying specific magnetic fields. Hence for real time control of these events, the pre-cursors should be electronically recorded and the mitigation techniques should be initiated by sending triggers to their individual operational systems. To implement these methodologies of real-time controlling of events in Aditya Tokamak, a low cost multi-channel Micro-Controller based timing circuit is designed and developed in-house. This circuit first compares the precursor signals fed into it with the pre-set values and gives a trigger output whenever the signals overshoot the pre-set values. The circuit readies itself for operation along with start of the tokamak discharge and waits up to an initial pre-determined delay and then initiates a trigger at the time of overshooting of precursor signal. The circuit is fully integrated and assembled in

Performance of the AMBFTK board for the FastTracker processor for the ATLAS detector upgrade

International Nuclear Information System (INIS)

Alberti, F; Citterio, M; Liberali, V; Meroni, C; Andreani, A; Stabile, A; Annovi, A; Beretta, M; Crescioli, F; Dell'Orso, M; Piendibene, M; Volpi, G; Giannetti, P; Lanza, A; Magalotti, D; Sacco, I

2013-01-01

Modern experiments at hadron colliders search for extremely rare processes hidden in a very large background. As the experiment complexity and the accelerator backgrounds and luminosity increase we need increasingly complex and exclusive selections. The FastTracker (FTK) processor for the ATLAS experiment offers extremely powerful, very compact and low power consumption processing units for the future, which is essential for increased efficiency and purity in the Level 2 trigger selection through the intensive use of tracking. Pattern recognition is performed with Associative Memories (AM). The AMBFTK board and the AMchip04 integrated circuit have been designed specifically for this purpose. We report on the preliminary test results of the first prototypes of the AMBFTK board and of the AMchip04.

Board effectiveness: Investigating payment asymmetry between board members and shareholders

Directory of Open Access Journals (Sweden)

Wuchun Chi

2008-01-01

Full Text Available Board members may well be responsible for dissension between themselves and shareholders since they are simultaneously the setters and receivers of both board remuneration and dividends. They may act out of their own personal interests at the expense of external shareholders. We investigate the impact of ownership structure, board structure and control deviation on payment asymmetry, where excessively high remuneration is paid to board members but considerably lower dividends are distributed to shareholders. We find strong evidence confirming that the smaller the shareholdings of board members and outside blockholders are, the more asymmetric the payments are. With controlling family members on the board and a higher percentage of seats held by independent board members, there is a slight reduction in the likelihood and severity of payment asymmetry. In addition, it is abundantly clear that the larger the board seat-control deviation is, the greater is the likelihood and severity of payment asymmetry. While prior research has primarily focused on board-manager agency issues, the board-shareholder perspective could be even more important in that it is the board that is the most directly delegated agent of shareholders, not the managers

Board of Directors or Supervisory Board

DEFF Research Database (Denmark)

Werlauff, Erik

2009-01-01

The article analyses the legal consequences of the choice now available to Danish public limited companies, which can now opt for a two-tier management structure, in which the management board undertakes both the day-to-day and the overall management, while a supervisory board exercises control...... over the management board, including its appointment and dismissal. The article considers which companies a two-tier structure may be relevant for, and reviews the consequences for the composition, election and functioning of the company organs....

SiGe Integrated Circuit Developments for SQUID/TES Readout

Science.gov (United States)

Prêle, D.; Voisin, F.; Beillimaz, C.; Chen, S.; Piat, M.; Goldwurm, A.; Laurent, P.

2018-03-01

SiGe integrated circuits dedicated to the readout of superconducting bolometer arrays for astrophysics have been developed since more than 10 years at APC. Whether for Cosmic Microwave Background (CMB) observations with the QUBIC ground-based experiment (Aumont et al. in astro-ph.IM, 2016. arXiv:1609.04372) or for the Hot and Energetic Universe science theme with the X-IFU instrument on-board of the ATHENA space mission (Barret et al. in SPIE 9905, space telescopes & instrumentation 2016: UV to γ Ray, 2016. https://doi.org/10.1117/12.2232432), several kinds of Transition Edge Sensor (TES) (Irwin and Hilton, in ENSS (ed) Cryogenic particle detection, Springer, Berlin, 2005) arrays have been investigated. To readout such superconducting detector arrays, we use time or frequency domain multiplexers (TDM, FDM) (Prêle in JINST 10:C08015, 2016. https://doi.org/10.1088/1748-0221/10/08/C08015) with Superconducting QUantum Interference Devices (SQUID). In addition to the SQUID devices, low-noise biasing and amplification are needed. These last functions can be obtained by using BiCMOS SiGe technology in an Application Specific Integrated Circuit (ASIC). ASIC technology allows integration of highly optimised circuits specifically designed for a unique application. Moreover, we could reach very low-noise and wide band amplification using SiGe bipolar transistor either at room or cryogenic temperatures (Cressler in J Phys IV 04(C6):C6-101, 1994. https://doi.org/10.1051/jp4:1994616). This paper discusses the use of SiGe integrated circuits for SQUID/TES readout and gives an update of the last developments dedicated to the QUBIC telescope and to the X-IFU instrument. Both ASIC called SQmux128 and AwaXe are described showing the interest of such SiGe technology for SQUID multiplexer controls.

A Genetic Toolkit for Dissecting Dopamine Circuit Function in Drosophila

Directory of Open Access Journals (Sweden)

Tingting Xie

2018-04-01

Full Text Available Summary: The neuromodulator dopamine (DA plays a key role in motor control, motivated behaviors, and higher-order cognitive processes. Dissecting how these DA neural networks tune the activity of local neural circuits to regulate behavior requires tools for manipulating small groups of DA neurons. To address this need, we assembled a genetic toolkit that allows for an exquisite level of control over the DA neural network in Drosophila. To further refine targeting of specific DA neurons, we also created reagents that allow for the conversion of any existing GAL4 line into Split GAL4 or GAL80 lines. We demonstrated how this toolkit can be used with recently developed computational methods to rapidly generate additional reagents for manipulating small subsets or individual DA neurons. Finally, we used the toolkit to reveal a dynamic interaction between a small subset of DA neurons and rearing conditions in a social space behavioral assay. : The rapid analysis of how dopaminergic circuits regulate behavior is limited by the genetic tools available to target and manipulate small numbers of these neurons. Xie et al. present genetic tools in Drosophila that allow rational targeting of sparse dopaminergic neuronal subsets and selective knockdown of dopamine signaling. Keywords: dopamine, genetics, behavior, neural circuits, neuromodulation, Drosophila

THERMAL DIAGNOSTICS WITH THE ATMOSPHERIC IMAGING ASSEMBLY ON BOARD THE SOLAR DYNAMICS OBSERVATORY: A VALIDATED METHOD FOR DIFFERENTIAL EMISSION MEASURE INVERSIONS

Energy Technology Data Exchange (ETDEWEB)

Cheung, Mark C. M.; Boerner, P.; Schrijver, C. J.; Malanushenko, A. [Lockheed Martin Solar and Astrophysics Laboratory, 3251 Hanover Street Bldg. 252, Palo Alto, CA 94304 (United States); Testa, P. [Harvard-Smithsonian Center for Astrophysics, 60 Garden Street, Cambridge, MA 02138 (United States); Chen, F.; Peter, H., E-mail: cheung@lmsal.com [Max Planck Institute for Solar System Research, Justus-von-Liebig-Weg 3, D-37077 Göttingen (Germany)

2015-07-10

We present a new method for performing differential emission measure (DEM) inversions on narrow-band EUV images from the Atmospheric Imaging Assembly (AIA) on board the Solar Dynamics Observatory. The method yields positive definite DEM solutions by solving a linear program. This method has been validated against a diverse set of thermal models of varying complexity and realism. These include (1) idealized Gaussian DEM distributions, (2) 3D models of NOAA Active Region 11158 comprising quasi-steady loop atmospheres in a nonlinear force-free field, and (3) thermodynamic models from a fully compressible, 3D MHD simulation of active region (AR) corona formation following magnetic flux emergence. We then present results from the application of the method to AIA observations of Active Region 11158, comparing the region's thermal structure on two successive solar rotations. Additionally, we show how the DEM inversion method can be adapted to simultaneously invert AIA and Hinode X-ray Telescope data, and how supplementing AIA data with the latter improves the inversion result. The speed of the method allows for routine production of DEM maps, thus facilitating science studies that require tracking of the thermal structure of the solar corona in time and space.

Circuit analysis for dummies

CERN Document Server

Santiago, John

2013-01-01

Circuits overloaded from electric circuit analysis? Many universities require that students pursuing a degree in electrical or computer engineering take an Electric Circuit Analysis course to determine who will ""make the cut"" and continue in the degree program. Circuit Analysis For Dummies will help these students to better understand electric circuit analysis by presenting the information in an effective and straightforward manner. Circuit Analysis For Dummies gives you clear-cut information about the topics covered in an electric circuit analysis courses to help

Defense Business Board

Science.gov (United States)

Skip to main content (Press Enter). Toggle navigation Defense Business Board Search Search Defense Business Board: Search Search Defense Business Board: Search Defense Business Board Business Excellence in Defense of the Nation Defense Business Board Home Charter Members Meetings Studies Contact Us The Defense

A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications

Directory of Open Access Journals (Sweden)

Shuai Shao

2017-02-01

Full Text Available Reliability risks for two different types of through-silicon-vias (TSVs are discussed in this paper. The first is a partially-filled copper TSV, if which the copper layer covers the side walls and bottom. A polymer is used to fill the rest of the cavity. Stresses in risk sites are studied and ranked for this TSV structure by FEA modeling. Parametric studies for material properties (modulus and thermal expansion of TSV polymer are performed. The second type is a high aspect ratio TSV filled by polycrystalline silicon (poly Si. Potential risks of the voids in the poly Si due to filling defects are studied. Fracture mechanics methods are utilized to evaluate the risk for two different assembly conditions: package assembled to printed circuit board (PCB and package assembled to flexible substrate. The effect of board/substrate/die thickness and the size and location of the void are discussed.

Current limiter circuit system

Science.gov (United States)

Witcher, Joseph Brandon; Bredemann, Michael V.

2017-09-05

An apparatus comprising a steady state sensing circuit, a switching circuit, and a detection circuit. The steady state sensing circuit is connected to a first, a second and a third node. The first node is connected to a first device, the second node is connected to a second device, and the steady state sensing circuit causes a scaled current to flow at the third node. The scaled current is proportional to a voltage difference between the first and second node. The switching circuit limits an amount of current that flows between the first and second device. The detection circuit is connected to the third node and the switching circuit. The detection circuit monitors the scaled current at the third node and controls the switching circuit to limit the amount of the current that flows between the first and second device when the scaled current is greater than a desired level.

Designing learning apparatus to promote twelfth grade students’ understanding of digital technology concept: A preliminary studies

Science.gov (United States)

Marlius; Kaniawati, I.; Feranie, S.

2018-05-01

A preliminary learning design using relay to promote twelfth grade student’s understanding of logic gates concept is implemented to see how well it’s to adopted by six high school students, three male students and three female students of twelfth grade. This learning design is considered for next learning of digital technology concept i.e. data digital transmition and analog. This work is a preliminary study to design the learning for large class. So far just a few researches designing learning design related to digital technology with relay. It may due to this concept inserted in Indonesian twelfth grade curriculum recently. This analysis is focus on student difficulties trough video analysis to learn the concept. Based on our analysis, the recommended thing for redesigning learning is: students understand first about symbols and electrical circuits; the Student Worksheet is made in more detail on the assembly steps to the project board; mark with symbols at points in certain places in the circuit for easy assembly; assembly using relays by students is enough until is the NOT’s logic gates and the others that have been assembled so that effective time. The design of learning using relays can make the relay a liaison between the abstract on the digital with the real thing of it, especially in the circuit of symbols and real circuits. Besides it is expected to also enrich the ability of teachers in classroom learning about digital technology.

The voltage—current relationship and equivalent circuit implementation of parallel flux-controlled memristive circuits

International Nuclear Information System (INIS)

Bao Bo-Cheng; Feng Fei; Dong Wei; Pan Sai-Hu

2013-01-01

A flux-controlled memristor characterized by smooth cubic nonlinearity is taken as an example, upon which the voltage—current relationships (VCRs) between two parallel memristive circuits — a parallel memristor and capacitor circuit (the parallel MC circuit), and a parallel memristor and inductor circuit (the parallel ML circuit) — are investigated. The results indicate that the VCR between these two parallel memristive circuits is closely related to the circuit parameters, and the frequency and amplitude of the sinusoidal voltage stimulus. An equivalent circuit model of the memristor is built, upon which the circuit simulations and experimental measurements of both the parallel MC circuit and the parallel ML circuit are performed, and the results verify the theoretical analysis results

Multispectral Thermal Imager Optical Assembly Performance and Integration of the Flight Focal Plane Assembly

International Nuclear Information System (INIS)

Blake, Dick; Byrd, Don; Christensen, Wynn; Henson, Tammy; Krumel, Les; Rappoport, William; Shen, Gon-Yen

1999-01-01

The Multispectral Thermal Imager Optical Assembly (OA) has been fabricated, assembled, successfully performance tested, and integrated into the flight payload structure with the flight Focal Plane Assembly (FPA) integrated and aligned to it. This represents a major milestone achieved towards completion of this earth observing E-O imaging sensor that is to be operated in low earth orbit. The OA consists of an off-axis three mirror anastigmatic (TMA) telescope with a 36 cm unobscured clear aperture, a wide-field-of-view (WFOV) of 1.82 along the direction of spacecraft motion and 1.38 across the direction of spacecraft motion. It also contains a comprehensive on-board radiometric calibration system. The OA is part of a multispectral pushbroom imaging sensor which employs a single mechanically cooled focal plane with 15 spectral bands covering a wavelength range from 0.45 to 10.7 m. The OA achieves near diffraction-limited performance from visible to the long-wave infrared (LWIR) wavelengths. The two major design drivers for the OA are 80% enpixeled energy in the visible bands and radiometric stability. Enpixeled energy in the visible bands also drove the alignment of the FPA detectors to the OA image plane to a requirement of less than 20 m over the entire visible detector field of view (FOV). Radiometric stability requirements mandated a cold Lyot stop for stray light rejection and thermal background reduction. The Lyot stop is part of the FPA assembly and acts as the aperture stop for the imaging system. The alignment of the Lyot stop to the OA drove the centering and to some extent the tilt alignment requirements of the FPA to the OA

Patients overwhelmingly prefer inpatient boarding to emergency department boarding.

Science.gov (United States)

Viccellio, Peter; Zito, Joseph A; Sayage, Valerie; Chohan, Jasmine; Garra, Gregory; Santora, Carolyn; Singer, Adam J

2013-12-01

Boarding of admitted patients in the emergency department (ED) is a major cause of crowding. One alternative to boarding in the ED, a full-capacity protocol where boarded patients are redeployed to inpatient units, can reduce crowding and improve overall flow. Our aim was to compare patient satisfaction with boarding in the ED vs. inpatient hallways. We performed a structured telephone survey regarding patient experiences and preferences for boarding among admitted ED patients who experienced boarding in the ED hallway and then were subsequently transferred to inpatient hallways. Demographic and clinical characteristics, as well as patient preferences, including items related to patient comfort and safety using a 5-point scale, were recorded and descriptive statistics were used to summarize the data. Of 110 patients contacted, 105 consented to participate. Mean age was 57 ± 16 years and 52% were female. All patients were initially boarded in the ED in a hallway before their transfer to an inpatient hallway bed. The overall preferred location after admission was the inpatient hallway in 85% (95% confidence interval 75-90) of respondents. In comparing ED vs. inpatient hallway boarding, the following percentages of respondents preferred inpatient boarding with regard to the following 8 items: rest, 85%; safety, 83%; confidentiality, 82%; treatment, 78%; comfort, 79%; quiet, 84%; staff availability, 84%; and privacy, 84%. For no item was there a preference for boarding in the ED. Patients overwhelmingly preferred the inpatient hallway rather than the ED hallway when admitted to the hospital. Copyright © 2013 Elsevier Inc. All rights reserved.

An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

International Nuclear Information System (INIS)

Isakson, K.; Vessell, A.L.

1994-07-01

Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ''best alternatives'': Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases

IEEE Std 317-1972: IEEE standard for electric penetration assemblies in containment structures for nuclear power generating stations

International Nuclear Information System (INIS)

Anon.

1992-01-01

This standard prescribes the mechanical, electrical, and test requirements for the design, construction, and installation of electric penetration assemblies in containment structures for stationary nuclear power generating stations. The electric conductor and insulation characteristics of external circuits which connect to penetration assemblies are beyond the scope of these criteria. If there should be any conflict between this standard and those documents referenced herein, this standard shall take precedence over the referenced documents

Design and experimental results of coaxial circuits for gyroklystron amplifiers

International Nuclear Information System (INIS)

Flaherty, M.K.E.; Lawson, W.; Cheng, J.; Calame, J.P.; Hogan, B.; Latham, P.E.; Granatstein, V.L.

1994-01-01

At the University of Maryland high power microwave source development for use in linear accelerator applications continues with the design and testing of coaxial circuits for gyroklystron amplifiers. This presentation will include experimental results from a coaxial gyroklystron that was tested on the current microwave test bed, and designs for second harmonic coaxial circuits for use in the next generation of the gyroklystron program. The authors present test results for a second harmonic coaxial circuit. Similar to previous second harmonic experiments the input cavity resonated at 9.886 GHz and the output frequency was 19.772 GHz. The coaxial insert was positioned in the input cavity and drift region. The inner conductor consisted of a tungsten rod with copper and ceramic cylinders covering its length. Two tungsten rods that bridged the space between the inner and outer conductors supported the whole assembly. The tube produced over 20 MW of output power with 17% efficiency. Beam interception by the tungsten rods resulted in minor damage. Comparisons with previous non-coaxial circuits showed that the coaxial configuration increased the parameter space over which stable operation was possible. Future experiments will feature an upgraded modulator and beam formation system capable of producing 300 MW of beam power. The fundamental frequency of operation is 8.568 GHz. A second harmonic coaxial gyroklystron circuit was designed for use in the new system. A scattering matrix code predicts a resonant frequency of 17.136 GHz and Q of 260 for the cavity with 95% of the outgoing microwaves in the desired TE032 mode. Efficiency studies of this second harmonic output cavity show 20% expected efficiency. Shorter second harmonic output cavity designs are also being investigated with expected efficiencies near 34%

30 CFR 75.518 - Electric equipment and circuits; overload and short circuit protection.

Science.gov (United States)

2010-07-01

... short circuit protection. 75.518 Section 75.518 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION... Equipment-General § 75.518 Electric equipment and circuits; overload and short circuit protection... installed so as to protect all electric equipment and circuits against short circuit and overloads. Three...

Implementing the board of directors’ mechanism – An empirical study of the listed firms in Libya

Directory of Open Access Journals (Sweden)

Jill Atkins

2018-01-01

Full Text Available This paper aims to investigate the extent to which board of directors’ mechanism is implemented in Libyan listed companies. This includes a consideration of composition, duties and responsibilities of the board directors. This study employed a questionnaire survey to collect required data from four key stakeholder groups: Boards of Directors (BD, Executive Managers (EM, Regulators and External Auditors (RE and Other Stakeholders (OS. The results of this study provided evidence that Libyan listed companies generally comply with the Libyan Corporate Governance Code (LCGC requirements regarding the board composition: the findings assert that most boards have between three and eleven members, the majority of whom are non-executives and at least two or one-third of whom (whichever is greater are independent. Moreover, the results indicate that general assemblies in Libyan listed companies are practically committed to the LCGC’s requirements regarding the appointment of board members and their length of tenure. The findings provide evidence that boards in Libyan listed companies are carrying out their duties and responsibilities in accordance with internal regulations and laws, as well as the stipulations of the LCGC (2007. Furthermore, the stakeholder groups were broadly satisfied that board members are devoting sufficient time and effort to discharge these duties and responsibilities properly. This study helps to enrich our understanding and knowledge of the current practice of corporate boards as a significant mechanism of corporate governance (CG by being the first to address the board of directors’ mechanism in Libyan listed companies.

A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid

International Nuclear Information System (INIS)

Zhu, P.; Chen, Y.; Wang, L.Y.; Qian, G.Y.; Zhou, M.; Zhou, J.

2012-01-01

Highlights: ► WPCBs were heated in [EMIM + ][BF 4 − ] for recovering solider at 240 °C. ► The bromine epoxy resins in WPCBs were all dissolved in [EMIM + ][BF 4 − ] at 260 °C. ► Used [EMIM + ][BF 4 − ] is treated by water to obtain regeneration. - Abstract: Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM + ][BF 4 − ]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM + ][BF 4 − ] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM + ][BF 4 − ] was treated by water to generate a solid–liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM + ][BF 4 − ] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

30 CFR 77.506 - Electric equipment and circuits; overload and short-circuit protection.

Science.gov (United States)

2010-07-01

... short-circuit protection. 77.506 Section 77.506 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION... circuits; overload and short-circuit protection. Automatic circuit-breaking devices or fuses of the correct type and capacity shall be installed so as to protect all electric equipment and circuits against short...

A Synthetic Circuit for Mercury Bioremediation Using Self-Assembling Functional Amyloids.

Science.gov (United States)

Tay, Pei Kun R; Nguyen, Peter Q; Joshi, Neel S

2017-10-20

Synthetic biology approaches to bioremediation are a key sustainable strategy to leverage the self-replicating and programmable aspects of biology for environmental stewardship. The increasing spread of anthropogenic mercury pollution into our habitats and food chains is a pressing concern. Here, we explore the use of programmed bacterial biofilms to aid in the sequestration of mercury. We demonstrate that by integrating a mercury-responsive promoter and an operon encoding a mercury-absorbing self-assembling extracellular protein nanofiber, we can engineer bacteria that can detect and sequester toxic Hg 2+ ions from the environment. This work paves the way for the development of on-demand biofilm living materials that can operate autonomously as heavy-metal absorbents.

Prototype board development for the validation of the VMM ASICs for the New Small Wheel ATLAS upgrade project

CERN Document Server

Gkountoumis, Panagiotis; The ATLAS collaboration

2018-01-01

The VMM is a custom Application Specific Integrated Circuit (ASIC) which was designed to be used in the front-end readout electronics of both micromegas (MM) and small Thin Gap Chambers (sTGC) detectors of the New Small Wheel (NSW) Phase-I upgrade project of the ATLAS experiment. A new version of the VMM was recently fabricated and for that reason various prototype boards, the micromegas Front-End (MMFE1) and the General Purpose VMM (GPVMM), have been fabricated and extensively tested in order to validate the functionality of the ASIC. These boards use commercial Field Programmable Gate Arrays (FPGAs) for direct communication with computers which is achieved through 10/100/1000 Mbps Ethernet and UDP/IP protocols. The low noise performance of these boards gave the opportunity to be used in various test beams with micromegas detectors for validating the VMM and for performance studies of the sTGC detectors. A detailed description of the boards along with the results of the test beam and the detector studies wi...

Prototype board development for the validation of the VMM ASICs for the New Small Wheel ATLAS upgrade project

CERN Document Server

Gkountoumis, Panagiotis; The ATLAS collaboration

2018-01-01

The VMM is a custom Application Specific Integrated Circuit (ASIC) which was designed to be used in the frontend readout electronics of both micromegas (MM) and small Thin Gap Chambers (sTGC) detectors of the New Small Wheel (NSW) Phase-I upgrade project of the ATLAS experiment. A new version of the VMM was recently fabricated and for that reason various prototype boards, the micromegas Front-End (MMFE1) and the General Purpose VMM (GPVMM), have been fabricated and extensively tested in order to validate the functionality of the ASIC. These boards use commercial Field Programmable Gate Arrays (FPGAs) for direct communication with computers which is achieved through 10=100=1000 Mbps Ethernet and UDP/IP protocols. The low noise performance of these boards gave the opportunity to be used in various test beams with micormegas detectors for validating the VMM and for performance studies of the sTGC detectors. A detailed description of the boards along with the results of the test beam and the detector studies will...

Recent progress with the Transition Radiation Tracker

CERN Multimedia

Froidevaux, D

Start-up of end-cap assembly in Russia On July 2nd at PNPI (first photo) and on August 1st at JINR Dubna (second photo), the first straws were inserted into the first 4-plane end-cap wheels, each containing 3072 straws. The straws were glued, the radiator stacks were installed and the PNPI wheel was tested for gas leaks. An initial large leak rate was observed and fixed by increasing somewhat the amount of glue around each straw end-piece and improving the leak-tightness of the testing equipment itself. PNPI will assemble a total of 48 4-plane wheels of type A using two assembly lines. JINR Dubna will assemble a total of 32 4-plane wheels of type B using a single assembly line. The next steps are the gluing of the so-called active webs (printed circuit boards connecting high voltage and signal lines from straw/wire to HV supply and front-end boards), followed by wiring, and will take place in November. PNPI and JINR Dubna should start mass production in February-March next year. Barrel module produc...

Scalable fabrication of self-aligned graphene transistors and circuits on glass.

Science.gov (United States)

Liao, Lei; Bai, Jingwei; Cheng, Rui; Zhou, Hailong; Liu, Lixin; Liu, Yuan; Huang, Yu; Duan, Xiangfeng

2012-06-13

Graphene transistors are of considerable interest for radio frequency (rf) applications. High-frequency graphene transistors with the intrinsic cutoff frequency up to 300 GHz have been demonstrated. However, the graphene transistors reported to date only exhibit a limited extrinsic cutoff frequency up to about 10 GHz, and functional graphene circuits demonstrated so far can merely operate in the tens of megahertz regime, far from the potential the graphene transistors could offer. Here we report a scalable approach to fabricate self-aligned graphene transistors with the extrinsic cutoff frequency exceeding 50 GHz and graphene circuits that can operate in the 1-10 GHz regime. The devices are fabricated on a glass substrate through a self-aligned process by using chemical vapor deposition (CVD) grown graphene and a dielectrophoretic assembled nanowire gate array. The self-aligned process allows the achievement of unprecedented performance in CVD graphene transistors with a highest transconductance of 0.36 mS/μm. The use of an insulating substrate minimizes the parasitic capacitance and has therefore enabled graphene transistors with a record-high extrinsic cutoff frequency (> 50 GHz) achieved to date. The excellent extrinsic cutoff frequency readily allows configuring the graphene transistors into frequency doubling or mixing circuits functioning in the 1-10 GHz regime, a significant advancement over previous reports (∼20 MHz). The studies open a pathway to scalable fabrication of high-speed graphene transistors and functional circuits and represent a significant step forward to graphene based radio frequency devices.

From the drawing board to the test bench

CERN Multimedia

Katarina Anthony

2014-01-01

After seven years of design, prototyping and manufacturing, the Linac4 Drift Tube Linac (DTL) is being assembled in CERN's Building 181. In fact, the first DTL tank is just a few tests away from installation into the Linac4 tunnel. Let's check in on how this essential element of the accelerator complex has - at last - come into being.   A peek inside a Linac4 DTL tank. The Linac4 DTL is designed to take the new linear accelerator's H- ion beams from 3 to 50 MeV. Divided into three tanks, holding a total of 108 drift tubes in vacuum, each made from a dozen parts, and assembled with ancillary elements, cooling circuits and hundreds of bolts and screws, it’s no surprise it has been nicknamed a 'puzzle with thousands of pieces'. A trying tale Although the first tank will soon be ready for installation, constructing the DTLs has been a trying tale for the Linac4 team. “Not only were we tasked to design CERN's first drift tube lin...

Volumetric and chemical control auxiliary circuit for a PWR primary circuit

International Nuclear Information System (INIS)

Costes, D.

1990-01-01

The volumetric and chemical control circuit has an expansion tank with at least one water-steam chamber connected to the primary circuit by a sampling pipe and a reinjection pipe. The sampling pipe feeds jet pumps controlled by valves. An action on these valves and pumps regulates the volume of the water in the primary circuit. A safety pipe controlled by a flap automatically injects water from the chamber into the primary circuit in case of ruptures. The auxiliary circuit has also systems for purifying the water and controlling the boric acid and hydrogen content [fr

Biomedical implementation of liquid metal ink as drawable ECG electrode and skin circuit.

Directory of Open Access Journals (Sweden)

Yang Yu

Full Text Available BACKGROUND: Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs. METHODS: Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. RESULTS: With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as -0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs were lit and emitted colorful lights. CONCLUSIONS: The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and

Board members’ contribution to strategy: The mediating role of board internal processes

Directory of Open Access Journals (Sweden)

Carmen Barroso-Castro

2017-05-01

Full Text Available This study aims to explore what directors do on the board, to what extent the processes occurring in the board allow the sharing and integrating of the existing knowledge, thus facilitating the board members’ contributions to strategy. We adopt the view that the internal board processes increase the impact of the cognitive resources on board performance. Using survey data from 200 large Spanish companies we demonstrate that directors’ level of knowledge of the firm and board job-related diversity positively influence the degree of the board's strategic involvement. Additionally, the internal processes that take place within the board – particularly Cognitive Conflict, the Critical and Independent Approach and the Comprehensive Discussion Process – influence the board's strategic involvement and play a partial mediating role on the aforementioned relationships. However, our results show no evidence for a positive relationship between Board Meeting Dynamics and the board's strategic involvement.

Intuitive analog circuit design

CERN Document Server

Thompson, Marc

2013-01-01

Intuitive Analog Circuit Design outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject. In this book, Dr. Thompson describes intuitive and ""back-of-the-envelope"" techniques for designing and analyzing analog circuits, including transistor amplifi

The circuit designer's companion

CERN Document Server

Williams, Tim

1991-01-01

The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

Electronic devices and circuits

CERN Document Server

Pridham, Gordon John

1972-01-01

Electronic Devices and Circuits, Volume 3 provides a comprehensive account on electronic devices and circuits and includes introductory network theory and physics. The physics of semiconductor devices is described, along with field effect transistors, small-signal equivalent circuits of bipolar transistors, and integrated circuits. Linear and non-linear circuits as well as logic circuits are also considered. This volume is comprised of 12 chapters and begins with an analysis of the use of Laplace transforms for analysis of filter networks, followed by a discussion on the physical properties of

Retrofitting the instrumentation and control system of primary cooling circuit from TRIGA INR 14 MW reactor

International Nuclear Information System (INIS)

Preda, M.; Ciocanescu, M.; Ana, E. M.; Cristea, D.

2008-01-01

Activities of retrofitting the instrumentation and control system from TRIGA INR primary cooling circuit consists in replacement of actual system for: - parameter measurement; - safety; - reactor external scramming; - protection, command and supply for electrical elements of the system. This retrofitting project is designed to ensure the necessary features of reactor external safety and for technological parameter measurement. The new safety system of main cooling circuit is completely separated from its operating system and is arranged in a panel assembly in reactor control room. The operating system has the following features: - data acquisition; - parameter value and state of command elements displaying; - command elements on hierarchical levels; - operator information through visual and acoustic alarm. (authors)

Signal sampling circuit

NARCIS (Netherlands)

Louwsma, S.M.; Vertregt, Maarten

2011-01-01

A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital

Signal sampling circuit

NARCIS (Netherlands)

Louwsma, S.M.; Vertregt, Maarten

2010-01-01

A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital

Electric circuits essentials

CERN Document Server

REA, Editors of

2012-01-01

REA's Essentials provide quick and easy access to critical information in a variety of different fields, ranging from the most basic to the most advanced. As its name implies, these concise, comprehensive study guides summarize the essentials of the field covered. Essentials are helpful when preparing for exams, doing homework and will remain a lasting reference source for students, teachers, and professionals. Electric Circuits I includes units, notation, resistive circuits, experimental laws, transient circuits, network theorems, techniques of circuit analysis, sinusoidal analysis, polyph

Approximate circuits for increased reliability

Science.gov (United States)

Hamlet, Jason R.; Mayo, Jackson R.

2015-08-18

Embodiments of the invention describe a Boolean circuit having a voter circuit and a plurality of approximate circuits each based, at least in part, on a reference circuit. The approximate circuits are each to generate one or more output signals based on values of received input signals. The voter circuit is to receive the one or more output signals generated by each of the approximate circuits, and is to output one or more signals corresponding to a majority value of the received signals. At least some of the approximate circuits are to generate an output value different than the reference circuit for one or more input signal values; however, for each possible input signal value, the majority values of the one or more output signals generated by the approximate circuits and received by the voter circuit correspond to output signal result values of the reference circuit.

Short-circuit logic

NARCIS (Netherlands)

Bergstra, J.A.; Ponse, A.

2010-01-01

Short-circuit evaluation denotes the semantics of propositional connectives in which the second argument is only evaluated if the first argument does not suffice to determine the value of the expression. In programming, short-circuit evaluation is widely used. A short-circuit logic is a variant of

Neuromorphic Implementation of Attractor Dynamics in a Two-Variable Winner-Take-All Circuit with NMDARs: A Simulation Study.

Science.gov (United States)

You, Hongzhi; Wang, Da-Hui

2017-01-01

Neural networks configured with winner-take-all (WTA) competition and N-methyl-D-aspartate receptor (NMDAR)-mediated synaptic dynamics are endowed with various dynamic characteristics of attractors underlying many cognitive functions. This paper presents a novel method for neuromorphic implementation of a two-variable WTA circuit with NMDARs aimed at implementing decision-making, working memory and hysteresis in visual perceptions. The method proposed is a dynamical system approach of circuit synthesis based on a biophysically plausible WTA model. Notably, slow and non-linear temporal dynamics of NMDAR-mediated synapses was generated. Circuit simulations in Cadence reproduced ramping neural activities observed in electrophysiological recordings in experiments of decision-making, the sustained activities observed in the prefrontal cortex during working memory, and classical hysteresis behavior during visual discrimination tasks. Furthermore, theoretical analysis of the dynamical system approach illuminated the underlying mechanisms of decision-making, memory capacity and hysteresis loops. The consistence between the circuit simulations and theoretical analysis demonstrated that the WTA circuit with NMDARs was able to capture the attractor dynamics underlying these cognitive functions. Their physical implementations as elementary modules are promising for assembly into integrated neuromorphic cognitive systems.

All-fiber hybrid photon-plasmon circuits: integrating nanowire plasmonics with fiber optics.

Science.gov (United States)

Li, Xiyuan; Li, Wei; Guo, Xin; Lou, Jingyi; Tong, Limin

2013-07-01

We demonstrate all-fiber hybrid photon-plasmon circuits by integrating Ag nanowires with optical fibers. Relying on near-field coupling, we realize a photon-to-plasmon conversion efficiency up to 92% in a fiber-based nanowire plasmonic probe. Around optical communication band, we assemble an all-fiber resonator and a Mach-Zehnder interferometer (MZI) with Q-factor of 6 × 10(6) and extinction ratio up to 30 dB, respectively. Using the MZI, we demonstrate fiber-compatible plasmonic sensing with high sensitivity and low optical power.

78 FR 66384 - Membership of the Merit Systems Protection Board's Performance Review Board

Science.gov (United States)

2013-11-05

... MERIT SYSTEMS PROTECTION BOARD Membership of the Merit Systems Protection Board's Performance Review Board AGENCY: Merit Systems Protection Board. ACTION: Notice. SUMMARY: Notice is hereby given of the members of the Merit Systems Protection Board's Performance Review Board. DATES: November 5, 2013...

Load testing circuit

DEFF Research Database (Denmark)

2009-01-01

A load testing circuit a circuit tests the load impedance of a load connected to an amplifier. The load impedance includes a first terminal and a second terminal, the load testing circuit comprising a signal generator providing a test signal of a defined bandwidth to the first terminal of the load...

Timergenerator circuits manual

CERN Document Server

Marston, R M

2013-01-01

Timer/Generator Circuits Manual is an 11-chapter text that deals mainly with waveform generator techniques and circuits. Each chapter starts with an explanation of the basic principles of its subject followed by a wide range of practical circuit designs. This work presents a total of over 300 practical circuits, diagrams, and tables.Chapter 1 outlines the basic principles and the different types of generator. Chapters 2 to 9 deal with a specific type of waveform generator, including sine, square, triangular, sawtooth, and special waveform generators pulse. These chapters also include pulse gen

CMOS circuits manual

CERN Document Server

Marston, R M

1995-01-01

CMOS Circuits Manual is a user's guide for CMOS. The book emphasizes the practical aspects of CMOS and provides circuits, tables, and graphs to further relate the fundamentals with the applications. The text first discusses the basic principles and characteristics of the CMOS devices. The succeeding chapters detail the types of CMOS IC, including simple inverter, gate and logic ICs and circuits, and complex counters and decoders. The last chapter presents a miscellaneous collection of two dozen useful CMOS circuits. The book will be useful to researchers and professionals who employ CMOS circu

30 CFR 75.601-1 - Short circuit protection; ratings and settings of circuit breakers.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Short circuit protection; ratings and settings... Trailing Cables § 75.601-1 Short circuit protection; ratings and settings of circuit breakers. Circuit breakers providing short circuit protection for trailing cables shall be set so as not to exceed the...

The Agency's Annual Report to the General Assembly of the United Nations for the Year 1969-70. Explanatory Note

Energy Technology Data Exchange (ETDEWEB)

NONE

1970-11-13

By Resolution GC(XIV)/RES/268 the General Conference requested the Board of Governors to arrange for the preparation of a supplement to the Board's annual report to the General Conference for 1969-70 which, together with that report, constitutes the Agency's report to the General Assembly of the United Nations for that year. The present document contains the supplement, which deals briefly with some developments in the Agency's work during the period 1 July to 1 October 1970.

The Agency's Annual Report to the General Assembly of the United Nations for the Year 1969-70. Explanatory Note

International Nuclear Information System (INIS)

1970-01-01

By Resolution GC(XIV)/RES/268 the General Conference requested the Board of Governors to arrange for the preparation of a supplement to the Board's annual report to the General Conference for 1969-70 which, together with that report, constitutes the Agency's report to the General Assembly of the United Nations for that year. The present document contains the supplement, which deals briefly with some developments in the Agency's work during the period 1 July to 1 October 1970.

Hospital board effectiveness: relationships between board training and hospital financial viability.

Science.gov (United States)

Molinari, C; Morlock, L; Alexander, J; Lyles, C A

1992-01-01

This study examined whether hospital governing boards that invest in board education and training are more informed and effective decision-making bodies. Measures of hospital financial viability (i.e., selected financial ratios and outcomes) are used as indicators of hospital board effectiveness. Board participation in educational programs was significantly associated with improved profitability, liquidity, and occupancy levels, suggesting that investment in the education of directors is likely to enhance hospital viability and thus increase board effectiveness.

Comparison of three resistor network division circuits for the readout of 4×4 pixel SiPM arrays

International Nuclear Information System (INIS)

Stratos, David; Maria, Georgiou; Eleftherios, Fysikopoulos; George, Loudos

2013-01-01

The purpose of this study is to investigate the behavior of a flexible SensL's silicon photomultiplier array (SPMArray4) photodetector for possible applications in PET imaging. We have designed and evaluated three different resistor network division circuits to read out the signal outputs of a 4×4 pixel SiPM array. We have applied firstly (i) a symmetric resistive voltage division circuit, secondly (ii) a symmetric resistive charge division circuit and thirdly (iii) a charge division multiplexing resistor network reducing the 16 pixel outputs to 4 position signals. In the first circuit the SensL SPMArray4-A0 preamplification electronics and a SPMArray4-A1 evaluation board providing the 16 pixels voltage outputs were used, before the symmetric resistive voltage network. We reduced the 16 voltage signals firstly to 4X and 4Y coordinate signals. Then those signals were further reduced to 2X and 2Y position signals connected via a resistor network. In the second readout circuit we have used the same technique but without the preamplification stage. The third circuit is based on a discretized positioning circuit, which multiplexes the 16 signals from the SiPM array to 4 position signals. The 4 position signals (Xa, Xb, Yc and Yd) were digitized using a free running sampling technique. An FPGA (Spartan 6 LX16) was used for triggering and signal processing of the pulses. We acquired raw images and energy histograms of a BGO and a CsI:Na pixilated scintillator under 22 Na excitation. A clear visualization of the discrete 2×2×5 mm 3 pixilated BGO scintillator elements as well as the 1×1×5 mm 3 pixilated CsI:Na crystal array was achieved with all applied readout circuits. The symmetric resistive charge division circuit provides higher peak to valley ratio than the other readout circuits. Τhe sensitivity and the energy resolution remained almost constant for the three circuits

Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

Science.gov (United States)

Rodenbeck, Christopher T; Girardi, Michael

2015-04-21

Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

International Nuclear Information System (INIS)

Hannaman, G. Willia; Wilkinson, C. Dan

2005-01-01

The report describes potentially useful techniques for monitoring the aging of I and C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation

Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

Energy Technology Data Exchange (ETDEWEB)

G. William Hannaman; C. Dan Wilkinson

2005-05-15

The report describes potentially useful techniques for monitoring the aging of I&C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation.

Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

Science.gov (United States)

Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

2015-07-01

Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. Copyright © 2015 Elsevier Ltd. All rights reserved.

Sequential circuit design for radiation hardened multiple voltage integrated circuits

Science.gov (United States)

Clark, Lawrence T [Phoenix, AZ; McIver, III, John K.

2009-11-24

The present invention includes a radiation hardened sequential circuit, such as a bistable circuit, flip-flop or other suitable design that presents substantial immunity to ionizing radiation while simultaneously maintaining a low operating voltage. In one embodiment, the circuit includes a plurality of logic elements that operate on relatively low voltage, and a master and slave latches each having storage elements that operate on a relatively high voltage.

Multi-level Simulation of a Real Time Vibration Monitoring System Component

Science.gov (United States)

Robertson, Bryan A.; Wilkerson, Delisa

2005-01-01

This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by Marshall Space Flight Center (MSFC) Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data fiom two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMC-IRA design has completed all engineering and deliverable unit testing. P

Low latency asynchronous interface circuits

Science.gov (United States)

Sadowski, Greg

2017-06-20

In one form, a logic circuit includes an asynchronous logic circuit, a synchronous logic circuit, and an interface circuit coupled between the asynchronous logic circuit and the synchronous logic circuit. The asynchronous logic circuit has a plurality of asynchronous outputs for providing a corresponding plurality of asynchronous signals. The synchronous logic circuit has a plurality of synchronous inputs corresponding to the plurality of asynchronous outputs, a stretch input for receiving a stretch signal, and a clock output for providing a clock signal. The synchronous logic circuit provides the clock signal as a periodic signal but prolongs a predetermined state of the clock signal while the stretch signal is active. The asynchronous interface detects whether metastability could occur when latching any of the plurality of the asynchronous outputs of the asynchronous logic circuit using said clock signal, and activates the stretch signal while the metastability could occur.

Design and flight performance evaluation of the Mariners 6, 7, and 9 short-circuit current, open-circuit voltage transducers

Science.gov (United States)

Patterson, R. E.

1973-01-01

The purpose of the short-circuit voltage transducer is to provide engineering data to aid the evaluation of array performance during flight. The design, fabrication, calibration, and in-flight performance of the transducers onboard the Mariner 6, 7 and 9 spacecrafts are described. No significant differences were observed in the in-flight electrical performance of the three transducers. The transducers did experience significant losses due to coverslides or adhesive darkening, increased surface reflection, or spectral shifts within coverslide assembly. Mariner 6, 7 and 9 transducers showed non-cell current degradations of 3-1/2%, 3%, and 4%, respectively at Mars encounter and 6%, 3%, and 4-12%, respectively at end of mission. Mariner 9 solar Array Test 2 showed 3-12% current degradation while the transducer showed 4-12% degradation.

Test of ATLAS RPCs Front-End electronics

International Nuclear Information System (INIS)

Aielli, G.; Camarri, P.; Cardarelli, R.; Di Ciaccio, A.; Di Stante, L.; Liberti, B.; Paoloni, A.; Pastori, E.; Santonico, R.

2003-01-01