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Sample records for wire bonding process

  1. FE modeling of Cu wire bond process and reliability

    NARCIS (Netherlands)

    Yuan, C.A.; Weltevreden, E.R.; Akker, P. van den; Kregting, R.; Vreugd, J. de; Zhang, G.Q.

    2011-01-01

    Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond

  2. Copper wire bonding

    CERN Document Server

    Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

    2014-01-01

    This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

  3. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  4. Thermosonic wire bonding of IC devices using palladium wire

    International Nuclear Information System (INIS)

    Shze, J.H.; Poh, M.T.; Tan, R.M.

    1996-01-01

    The feasibility of replacing gold wire by palladium wire in thermosonic wire bonding of CMOS and bipolar devices are studied in terms of the manufacturability, physical, electrical and assembly performance. The results that palladium wire is a viable option for bonding the bipolar devices but not the CMOS devices

  5. Body of Knowledge (BOK) for Copper Wire Bonds

    Science.gov (United States)

    Rutkowski, E.; Sampson, M. J.

    2015-01-01

    Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications

  6. 1 mil gold bond wire study.

    Energy Technology Data Exchange (ETDEWEB)

    Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W.; Rutherford, Brian Milne

    2013-05-01

    In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, the gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.

  7. Reliability Criteria for Thick Bonding Wire.

    Science.gov (United States)

    Dagdelen, Turker; Abdel-Rahman, Eihab; Yavuz, Mustafa

    2018-04-17

    Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

  8. Reliability Criteria for Thick Bonding Wire

    Directory of Open Access Journals (Sweden)

    Turker Dagdelen

    2018-04-01

    Full Text Available Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al and aluminum coated copper (CucorAl wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

  9. Reliability Criteria for Thick Bonding Wire

    Science.gov (United States)

    Yavuz, Mustafa

    2018-01-01

    Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. PMID:29673194

  10. Investigation of ball bond integrity for 0.8 mil (20 microns) diameter gold bonding wire on low k die in wire bonding technology

    Science.gov (United States)

    Kudtarkar, Santosh Anil

    Microelectronics technology has been undergoing continuous scaling to accommodate customer driven demand for smaller, faster and cheaper products. This demand has been satisfied by using novel materials, design techniques and processes. This results in challenges for the chip connection technology and also the package technology. The focus of this research endeavor was restricted to wire bond interconnect technology using gold bonding wires. Wire bond technology is often regarded as a simple first level interconnection technique. In reality, however, this is a complex process that requires a thorough understanding of the interactions between the design, material and process variables, and their impact on the reliability of the bond formed during this process. This research endeavor primarily focused on low diameter, 0.8 mil thick (20 mum) diameter gold bonding wire. Within the scope of this research, the integrity of the ball bond formed by 1.0 mil (25 mum) and 0.8 mil (20 mum) diameter wires was compared. This was followed by the evaluation of bonds formed on bond pads having doped SiO2 (low k) as underlying structures. In addition, the effect of varying the percentage of the wire dopant, palladium and bonding process parameters (bonding force, bond time, ultrasonic energy) for 0.8 mil (20 mum) bonding wire was also evaluated. Finally, a degradation empirical model was developed to understand the decrease in the wire strength. This research effort helped to develop a fundamental understanding of the various factors affecting the reliability of a ball bond from a design (low diameter bonding wire), material (low k and bonding wire dopants), and process (wire bonding process parameters) perspective for a first level interconnection technique, namely wire bonding. The significance of this research endeavor was the systematic investigation of the ball bonds formed using 0.8 mil (20 microm) gold bonding wire within the wire bonding arena. This research addressed low k

  11. Laser-heating wire bonding on MEMS packaging

    Directory of Open Access Journals (Sweden)

    Yuetao Liu

    2014-02-01

    Full Text Available Making connections is critical in fabrication of MEMS (Micro-Electro-Mechanical Systems. It is also complicated, because the temperature during joining affects both the bond produced and the structure and mechanical properties of the moving parts of the device. Specifications for MEMS packaging require that the temperature not exceed 240 °C. However, usually, temperatures can reach up to 300 °C during conventional thermosonic wire bonding. Such a temperature will change the distribution of dopants in CMOS (Complementary Metal Oxide Semiconductor circuits. In this paper we propose a new heating process. A semiconductor laser (wavelength 808 nm is suggested as the thermal source for wire bonding. The thermal field of this setup was analyzed, and specific mathematical models of the field were built. Experimental results show that the heating can be focused on the bonding pad, and that much lower heat conduction occurs, compared with that during the normal heating method. The bond strength increases with increasing laser power. The bond strengths obtained with laser heating are slightly lower than those obtained with the normal heating method, but can still meet the strength requirements for MEMS.

  12. Reliability improvement of wire bonds subjected to fatigue stresses.

    Science.gov (United States)

    Ravi, K. V.; Philofsky, E. M.

    1972-01-01

    The failure of wire bonds due to repeated flexure when semiconductor devices are operated in an on-off mode has been investigated. An accelerated fatigue testing apparatus was constructed and the major fatigue variables, aluminum alloy composition, and bonding mechanism, were tested. The data showed Al-1% Mg wires to exhibit superior fatigue characteristics compared to Al-1% Cu or Al-1% Si and ultrasonic bonding to be better than thermocompression bonding for fatigue resistance. Based on these results highly reliable devices were fabricated using Al-1% Mg wire with ultrasonic bonding which withstood 120,000 power cycles with no failures.

  13. Wire bond degradation under thermo- and pure mechanical loading

    DEFF Research Database (Denmark)

    Pedersen, Kristian Bonderup; Nielsen, Dennis Achton; Czerny, Bernhard

    2017-01-01

    This paper presents a fundamental study on degradation of heavy Al bond wires typically used in high power modules. Customized samples are designed to only consist of Al bond wires on standard Si diodes. These samples are subjected to pure mechanical and passive thermal cycling to investigate...

  14. Thermosonic wire bonding of gold wire onto copper pad using the saturated interfacial phenomena

    Science.gov (United States)

    Jeng, Yeau-Ren; Aoh, Jong-Hing; Wang, Chang-Ming

    2001-12-01

    Copper has been used to replace conventional aluminium interconnection to improve the performance of deep submicron integrated circuits. This study used the saturated interfacial phenomena found in thermosonic ball bonding of gold wire onto aluminium pad to investigate thermosonic ball bonding of gold wire onto copper pad. The effects of preheat temperatures and ultrasonic powers on the bonding force were investigated by using a thermosonic bonding machine and a shear tester. This work shows that under proper preheat temperatures, the bonding force of thermosonic wire bonding can be explained based on interfacial microcontact phenomena such as energy intensity, interfacial temperature and real contact area. It is clearly shown that as the energy intensity is increased, the shear force increases, reaches a maximum, and then decreases. After saturation, i.e. the establishment of maximum atomic bonding, any type of additional energy input will damage the bonding, decreasing the shear force. If the preheat temperature is not within the proper range, the interfacial saturation phenomenon does not exist. For a preload of 0.5 N and a welding time of 15 ms in thermosonic wire bonding of gold wire onto copper pads, a maximum shear force of about 0.33 N is found where the interfacial energy intensity equals 1.8×106 J m-2 for preheat temperatures of 150°C and 170°C. Moreover, the corresponding optimal ultrasonic power is about 110 units.

  15. Fine pitch thermosonic wire bonding: analysis of state-of-the-art manufacturing capability

    Science.gov (United States)

    Cavasin, Daniel

    1995-09-01

    A comprehensive process characterization was performed at the Motorola plastic package assembly site in Selangor, Malaysia, to document the current fine pitch wire bond process capability, using state-of-the-art equipment, in an actual manufacturing environment. Two machines, representing the latest technology from two separate manufacturers, were operated one shift per day for five days, bonding a 132 lead Plastic Quad Flat Pack. Using a test device specifically designed for fine pitch wire bonding, the bonding programs were alternated between 107 micrometers and 92 micrometers pad pitch, running each pitch for a total of 1600 units per machine. Wire, capillary type, and related materials were standardized and commercially available. A video metrology measurement system, with a demonstrated six sigma repeatability band width of 0.51 micrometers , was utilized to measure the bonded units for bond dimensions and placement. Standard Quality Assurance (QA) metrics were also performed. Results indicate that state-of-the-art thermosonic wire bonding can achieve acceptable assembly yields at these fine pad pitches.

  16. Comprehensive physical analysis of bond wire interfaces in power modules

    DEFF Research Database (Denmark)

    Popok, Vladimir; Pedersen, Kristian Bonderup; Kristensen, Peter Kjær

    2016-01-01

    causing failures. In this paper we present a review on the set of our experimental and theoretical studies allowing comprehensive physical analysis of changes in materials under active power cycling with focus on bond wire interfaces and thin metallisation layers. The developed electro-thermal and thermo...

  17. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    CERN Document Server

    Izen, Joseph; The ATLAS collaboration; Kurth, Matthew Glenn

    2015-01-01

    Unencapsulated aluminum wedge wire bonds are common in particle-physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent, source of tracking detector failure Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorenz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of PU-coated wire bonds and their resistance to periodic Lorenz forces will be described.

  18. Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

    Directory of Open Access Journals (Sweden)

    Nick Baker

    2017-03-01

    Full Text Available In fast switching power semiconductors, the use of a fourth terminal to provide the reference potential for the gate signal—known as a kelvin-source terminal—is becoming common. The introduction of this terminal presents opportunities for condition monitoring systems. This article demonstrates how the voltage between the kelvin-source and power-source can be used to specifically monitor bond-wire degradation. Meanwhile, the drain to kelvin-source voltage can be monitored to track defects in the semiconductor die or gate driver. Through an accelerated aging test on 20 A Silicon Carbide Metal-Oxide-Semiconductor-Field-Effect Transistors (MOSFETs, it is shown that there are opposing trends in the evolution of the on-state resistances of both the bond-wires and the MOSFET die. In summary, after 50,000 temperature cycles, the resistance of the bond-wires increased by up to 2 mΩ, while the on-state resistance of the MOSFET dies decreased by approximately 1 mΩ. The conventional failure precursor (monitoring a single forward voltage cannot distinguish between semiconductor die or bond-wire degradation. Therefore, the ability to monitor both these parameters due to the presence of an auxiliary-source terminal can provide more detailed information regarding the aging process of a device.

  19. Studies of IBL wire bonds operation in a ATLAS-like magnetic field.

    CERN Document Server

    Alvarez Feito, D; Mandelli, B

    2015-01-01

    At the Large Hadron Collider (LHC) experiments, most of silicon detectors use wire bonds to connect front-end chips and sensors to circuit boards for the data and service trans- missions. These wire bonds are operated in strong magnetic field environments and if time varying currents pass through them with frequencies close to their mechanical resonance frequency, strong resonant oscillations may occur. Under certain conditions, this effect can lead to fatigue stress and eventually breakage of wire bonds. During the first LHC Long Shutdown, the ATLAS Pixel Detector has been upgraded with the addition of a fourth innermost layer, the Insertable B-Layer (IBL), which has more than 50000 wire bonds operated in the ATLAS 2 T magnetic field. The results of systematic studies of operating wire bonds under IBL-like conditions are presented. Two different solutions have been investigated to minimize the oscillation amplitude of wire bonds.

  20. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    CERN Document Server

    INSPIRE-00092738; Kurth, Matthew; Boyd, Rusty

    2016-01-01

    Unencapsulated aluminum wedge wire bonds are common in particle physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent source of tracking-detector failure. Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorentz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of polyurethane-coated wire bonds and their resistance to periodic Lorentz forces are under study for use in a future High Luminosity Large Hadron Collider detector such as the ATLAS Inner Tracker upgrade.

  1. Investigation on cold-drawn gold bonding wire with serial and reverse-direction drawing

    International Nuclear Information System (INIS)

    Cho, Jae-Hyung; Rollett, A.D.; Cho, J.-S.; Park, Y.-J.; Park, S.-H.; Oh, K.H.

    2006-01-01

    Gold bonding wires have been manufactured through multiple drawing steps with serial and reverse-direction drawing. The texture and microstructure of the gold bonding wires were characterized with X-ray diffraction and EBSD and compared with the predictions of finite element (FE) simulation. Initial fiber decreases during drawing and is replaced by fiber. The oriented grains are concentrated in the center and surface regions, whereas the oriented grains are located throughout the cross-section of the wire. Regions near the surface often exhibit the complex textures. A simplified forward and backward drawing process was modeled by FE analysis with ABAQUS/Standard TM . The simple two-step drawing process results in severe variation in shear strain under the surface and displays the opposite behavior in the shear components of the deformation gradient. The texture evolution was predicted using the deformation gradient calculated in the FE simulations together with a model of polycrystal plasticity. The and fibers are predicted to develop in the center part of the wire where homogeneous deformation occurs. The regions near the surface that experience repeated shear strain exhibit complex textures that deviate from the standard and fibers. The {1 1 2} and {1 1 1} components are prevalent in the higher shear strain regions. The variations of the anisotropic elastic directional moduli with position were also calculated

  2. Modelling aluminium wire bond reliability in high power OMP devices

    NARCIS (Netherlands)

    Kregting, R.; Yuan, C.A.; Xiao, A.; Bruijn, F. de

    2011-01-01

    In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is

  3. Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip

    Energy Technology Data Exchange (ETDEWEB)

    Joseph Sahaya Anand, T., E-mail: anand@utem.edu.my [Faculty of Manufacturing Engineering, University Technical Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia); Yau, Chua Kok [Faculty of Manufacturing Engineering, University Technical Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia); University of Technical Malaysia Supported by Infineon Technology - Malaysia - Sdn. Bhd., Melaka (Malaysia); Huat, Lim Boon [Department of Innovation, Infineon Technology - Malaysia - Sdn. Bhd., FTZ Batu Berendam, 75350 Melaka (Malaysia)

    2012-10-15

    In this work, influence of Copper free air ball (FAB) oxidation towards Intermetallic Compound (IMC) at Copper wire-Aluminum bond pad metallization (Cu/Al) is studied. Samples are synthesized with different Copper FAB oxidation condition by turning Forming Gas supply ON and OFF. Studies are performed using Optical Microscope (OM), Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM) and line-scan Energy Dispersive X-ray (EDX). SEM result shows there is a cross-sectional position offset from center in sample synthesized with Forming Gas OFF. This is due to difficulty of determining the position of cross-section in manual grinding/polishing process and high occurrence rate of golf-clubbed shape of oxidized Copper ball bond. TEM inspection reveals that the Copper ball bond on sample synthesized with Forming Gas OFF is having intermediate oxidation. Besides, the presence of IMC at the bonding interface of Cu/Al for both samples is seen. TEM study shows voids form at the bonding interface of Forming Gas ON sample belongs to unbonded area; while that in Forming Gas OFF sample is due to volume shrinkage of IMC growth. Line-scan EDX shows the phases present in the interfaces of as-bonded samples are Al{sub 4}Cu{sub 9} ({approx}3 nm) for sample with Forming Gas ON and mixed CuAl and CuAl{sub 2} ({approx}15 nm) for sample with Forming Gas OFF. Thicker IMC in sample with Forming Gas OFF is due to cross-section is positioned at high stress area that is close to edge of ball bond. Mechanical ball shear test shows that shear strength of sample with Forming Gas OFF is about 19% lower than that of sample with Forming Gas ON. Interface temperature is estimated at 437 Degree-Sign C for as-bonded sample with Forming Gas ON by using empirical parabolic law of volume diffusion. -- Highlights: Black-Right-Pointing-Pointer 3 nm Al{sub 4}Cu{sub 9} are found in sample prepared with Forming Gas ON. Black-Right-Pointing-Pointer 15 nm mixed CuAl + CuAl{sub 2} are found

  4. Reliability Tests of Aluminium Wedge Wire Bonding on Auto-catalytic Silver Immersion Gold (ASIG) PCB Metallization

    CERN Document Server

    Drozd, A; Kaufmann, S; Manolescu, F; McGill, I

    2011-01-01

    The Auto-catalytic Silver Immersion Gold (ASIG) PCB metallization is a new process that has clear advantages for PCB assembly especially with regard to lead-free soldering. As it may become a popular process in the future for electronics used in physics experiments, the quality of this metallization for aluminium wire bonding has been studied. Aluminium wedge wire bonding continues to be the interconnection method of choice for many physics detector sensors, for high density signal routing and for unpackaged die. Although advertised as having good quality for aluminium wire bonding, this study was performed to verify this claim as well as to test the longer term reliability of the wire bonds taking into consideration the environmental conditions and life-expectancy of devices, in particular for high energy physics detector applications. The tests were performed on PCBs made with the ASIG and ENIG (Electro-less Nickel Immersion Gold) processes at the same time in order to make a comparison with the current ind...

  5. A new route to process diamond wires

    Directory of Open Access Journals (Sweden)

    Marcello Filgueira

    2003-06-01

    Full Text Available We propose an original route to process diamond wires, denominated In Situ Technology, whose fabrication involves mechanical conformation processes, such as rotary forging, copper tubes restacking, and thermal treatments, such as sintering and recrystallisation of a bronze 4 wt.% diamond composite. Tensile tests were performed, reaching an ultimate tensile strength (UTS of 230 MPa for the diameter of Æ = 1.84 mm. Scanning electron microscopy showed the diamond crystals distribution along the composite rope during its manufacture, as well as the diamond adhesion to the bronze matrix. Cutting tests were carried out with the processed wire, showing a probable performance 4 times higher than the diamond sawing discs, however its probable performance was about 5 to 8 times less than the conventional diamond wires (pearl system due to the low abrasion resistance of the bronze matrix, and low adhesion between the pair bronze-diamond due to the use of not metallised diamond single crystals.

  6. Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

    DEFF Research Database (Denmark)

    Baker, Nick; Luo, Haoze; Iannuzzo, Francesco

    2017-01-01

    the voltage between the kelvin-source and power-source can be used to specifically monitor bond-wire degradation. Meanwhile, the drain to kelvin-source voltage can be monitored to track defects in the semiconductor die or gate driver. Through an accelerated aging test on 20 A Silicon Carbide Metal......-Oxide-Semiconductor-Field-Effect Transistors (MOSFETs), it is shown that there are opposing trends in the evolution of the on-state resistances of both the bond-wires and the MOSFET die. In summary, after 50,000 temperature cycles, the resistance of the bond-wires increased by up to 2 mΩ, while the on-state resistance of the MOSFET dies...... decreased by approximately 1 mΩ. The conventional failure precursor (monitoring a single forward voltage) cannot distinguish between semiconductor die or bond-wire degradation. Therefore, the ability to monitor both these parameters due to the presence of an auxiliary-source terminal can provide more...

  7. Monotonic and cyclic bond behavior of confined concrete using NiTiNb SMA wires

    International Nuclear Information System (INIS)

    Choi, Eunsoo; Chung, Young-Soo; Kim, Yeon-Wook; Kim, Joo-Woo

    2011-01-01

    This study conducts bond tests of reinforced concrete confined by shape memory alloy (SMA) wires which provide active and passive confinement of concrete. This study uses NiTiNb SMA which usually shows wide temperature hysteresis; this is a good advantage for the application of shape memory effects. The aims of this study are to investigate the behavior of SMA wire under residual stress and the performance of SMA wire jackets in improving bond behavior through monotonic-loading tests. This study also conducts cyclic bond tests and analyzes cyclic bond behavior. The use of SMA wire jackets transfers the bond failure from splitting to pull-out mode and satisfactorily increases bond strength and ductile behavior. The active confinement provided by the SMA plays a major role in providing external pressure on the concrete because the developed passive confinement is much smaller than the active confinement. For cyclic behavior, slip and circumferential strain are recovered more with larger bond stress. This recovery of slip and circumferential strain are mainly due to the external pressure of the SMA wires since cracked concrete cannot provide any elastic recovery

  8. Wire Bonding on 2S Modules of the Phase-2 CMS Detector

    CERN Document Server

    AUTHOR|(CDS)2226525; Pooth, Oliver

    The LHC will be upgraded to the HL-LHC in the Long Shutdown 3 starting 2024. This upgrade will increase the collision rate and the overall number of colliding particles requiring high precision particle detectors which are able to cope with much higher radiation doses and numbers of particle interactions per bunch crossing. To fulfill these technical requirements the CMS detector will be upgraded in the so-called Phase-2 Upgrade. Among others the silicon tracking system will be completely replaced by a new system providing a higher acceptance, an improved granularity and the feature to include its tracking information into the level-1 trigger. The new outer-tracker will consist of so called 2S modules consisting of two strip sensors and PS modules with a macro-pixel sensor and a strip sensor. The electrical connection between the strip sensors and the front-end electronics is realized by thin aluminum wire bonds. In this thesis the process of wire bonding is introduced and its implementation in the 2S module ...

  9. The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

    International Nuclear Information System (INIS)

    Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao

    2012-01-01

    Highlights: ► Pd distribution in Pd-plated Cu wires reveals the whirlpool flow pattern of Cu. ► The mechanisms of the Cu flow behavior and Pd distribution are proposed. ► At Pd-rich phases, small voids formed and followed the direction of Cu flow. ► Nanoindentation studies show the Cu ball bond is harder in regions with Pd. - Abstract: The Pd plating on the 20 μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15 ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

  10. THERMO-MECHANICALLY PROCESSED ROLLED WIRE FOR HIGH-STRENGTH ON-BOARD WIRE

    Directory of Open Access Journals (Sweden)

    V. A. Lutsenko

    2011-01-01

    Full Text Available It is shown that at twisting of wire of diameter 1,83 mm, produced by direct wire drawing of thermomechanically processed rolled wire of diameter 5,5 mm of steel 90, metal stratification is completely eliminated at decrease of carbon, manganese and an additional alloying of chrome.

  11. Effect of iodine on the corrosion of Au-Al wire bonds

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Müller, Lutz; Jellesen, Morten Stendahl

    2015-01-01

    Corrosion study was performed on Au-Al wire bonds, thin layers of sputter deposited Au and Al, and Au-Al intermetallic nuggets. The test environment was iodine-vapour in air (1. mg/L) at 85 °C with varying relative humidity, and 500 mg/L of KI in water. GDOES, XRD, SEM EDS, wire bond shear......, and electrochemical testing were used to characterize the samples. Failures of Au-Al wire bonds were found to be primarily attributed to the corrosion of Al via formation of Al iodides and consequent formation of Al oxides and/or hydroxides. Most susceptible to corrosion are Al metallization and Al rich intermetallic...

  12. Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

    International Nuclear Information System (INIS)

    Kang, K.H.; Hara, K.; Higuchi, T.; Hyun, H.J.; Jeon, H.B.; Joo, C.W.; Kah, D.H.; Kim, H.J.; Mibe, T.; Onuki, Y.; Park, H.; Rao, K.K.; Sato, N.; Shimizu, N.; Tanida, K.; Tsuboyama, T.; Uozumi, S.

    2014-01-01

    This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout flex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out flex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 μm. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and 60 mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92±0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience the neck-broken type of break

  13. Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

    International Nuclear Information System (INIS)

    Xu Hui; Qin, Ivy; Clauberg, Horst; Chylak, Bob; Acoff, Viola L.

    2013-01-01

    This paper describes the behavior of palladium in palladium-coated Cu (PdCu) wire bonding and its impact on bond reliability by utilizing transmission electron microscopy (TEM). A Pd layer approximately 80 nm thick, which is coated on the surface of Cu wire, dissolves into the Cu matrix during ball formation (under N 2 gas protection) when the wire tip is melted to form a ball. As a result of dissolving the very thin Pd layer into the ball, Pd is almost undetectable along the entire bond interface between the ball and the Al pad. The behavior of Pd during thermal aging in air, however, is different for central and peripheral interfaces. At the central interface, less than 5 at.% Pd is present after 168 h aging at 175 °C. At the periphery, however, Pd diffuses back and congregates, reaching a level of ∼12 at.% after 24 h, and a Pd-rich (Cu,Pd) 9 Al 4 layer (>40 at.% Pd) forms after 168 h. Pd acts substitutionally in Cu 9 Al 4 but cannot penetrate into the CuAl 2 or CuAl. By comparison of intermetallic thickness and interfacial morphology between PdCu and bare Cu wire bonds, it is concluded that the presence of Pd reduces intermetallic growth rate, and is associated with numerous nanovoids in PdCu bonds.

  14. Processing of flexible high-Tc superconducting wires

    International Nuclear Information System (INIS)

    Lee, B.I.; Modi, V.

    1989-01-01

    Wires superconducting at temperatures above 77 K are produced by using YBa 2 Cu 3 O 7 materials. Flexibility was obtained by support from prefabricated fibers or a metallic coating on the extruded YBa 2 Cu 3 O 7 wires. The microstructure, the T c and the critical current densities of the wires were determined. Processing variables and steps are described

  15. Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

    Directory of Open Access Journals (Sweden)

    Christopher Breach

    2013-07-01

    Full Text Available A comparison study on the reliability of gold (Au and copper (Cu wire bonding is conducted to determine their corrosion and oxidation behavior in different environmental conditions. The corrosion and oxidation behaviors of Au and Cu wire bonding are determined through soaking in sodium chloride (NaCl solution and high temperature storage (HTS at 175 °C, 200 °C and 225 °C. Galvanic corrosion is more intense in Cu wire bonding as compared to Au wire bonding in NaCl solution due to the minimal formation of intermetallics in the former. At all three HTS annealing temperatures, the rate of Cu-Al intermetallic formation is found to be three to five times slower than Au-Al intermetallics. The faster intermetallic growth rate and lower activation energy found in this work for both Au/Al and Cu/Al as compared to literature could be due to the thicker Al pad metallization which removed the rate-determining step in previous studies due to deficit in Al material.

  16. Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

    International Nuclear Information System (INIS)

    Kim, Hyung Giun; Kim, Sang Min; Lee, Jae Young; Choi, Mi Ri; Choe, Si Hyun; Kim, Ki Hong; Ryu, Jae Sung; Kim, Sangshik; Han, Seung Zeon; Kim, Won Yong; Lim, Sung Hwan

    2014-01-01

    A comparative study on the difference in interfacial behavior of thermally aged Cu wire bonding with Al and Au pads was conducted using transmission electron microscopy. During high-temperature lifetime testing of Cu wire bonding with Al and Au pads at 175 °C for up to 2000 h, different growth rates and growth characteristics were investigated in the Cu–Al intermetallic compounds (IMCs), including CuAl 2 , CuAl and Cu 9 Al 4 , and in the Cu–Au IMCs, including (Au,Cu), Cu 3 Au and (Cu,Au). Because of the lower growth rates and greater ductility of Cu–Au IMCs compared to those of Cu–Al IMCs, the Cu wire bonding with the Au pad showed relatively better thermal aging properties of bond pull strength and ball shear strength than those with the Al pad counterpart. In this study, the coherent interfaces were found to retard the growth of IMCs, and a variety of orientation relationships between wire, pad and interfacial IMCs were identified

  17. Long-term effectiveness of canine-to-canine bonded flexible spiral wire lingual retainers

    NARCIS (Netherlands)

    Renkema, Anne-Marie; Renkema, Alianne; Bronkhorst, Ewald; Katsaros, Christos

    Introduction: The flexible spiral wire (FSW) canine-to-canine lingual retainer bonded to all 6 anterior teeth is a frequently used type of mandibular fixed retainer. This study aimed to assess the long-term effectiveness of FSW canine-to-canine lingual retainers in maintaining the alignment of the

  18. Long-term effectiveness of canine-to-canine bonded flexible spiral wire lingual retainers

    NARCIS (Netherlands)

    Renkema, A.M.; Bronkhorst, E.M.; Katsaros, C.

    2011-01-01

    INTRODUCTION: The flexible spiral wire (FSW) canine-to-canine lingual retainer bonded to all 6 anterior teeth is a frequently used type of mandibular fixed retainer. This study aimed to assess the long-term effectiveness of FSW canine-to-canine lingual retainers in maintaining the alignment of the

  19. Adhesive Properties of Bonded Orthodontic Retainers to Enamel : Stainless Steel Wire vs Fiber-reinforced Composites

    NARCIS (Netherlands)

    Foek, Dave Lie Sam; Krebs, Eliza; Sandham, John; Ozcan, Mutlu

    2009-01-01

    Purpose: The objectives of this study were to compare the bond strength of a stainless steel orthodontic wire vs various fiber-reinforced composites (FRC) used as orthodontic retainers on enamel, analyze the failure types after debonding, and investigate the influence of different application

  20. Spin transport in dangling-bond wires on doped H-passivated Si(100)

    International Nuclear Information System (INIS)

    Kepenekian, Mikaël; Robles, Roberto; Lorente, Nicolás; Rurali, Riccardo

    2014-01-01

    New advances in single-atom manipulation are leading to the creation of atomic structures on H-passivated Si surfaces with functionalities important for the development of atomic and molecular based technologies. We perform total-energy and electron-transport calculations to reveal the properties and understand the features of atomic wires crafted by H removal from the surface. The presence of dopants radically change the wire properties. Our calculations show that dopants have a tendency to approach the dangling-bond wires, and in these conditions, transport is enhanced and spin selective. These results have important implications in the development of atomic-scale spintronics showing that boron, and to a lesser extent phosphorous, convert the wires in high-quality spin filters. (paper)

  1. Mission-profile-based stress analysis of bond-wires in SiC power modules

    DEFF Research Database (Denmark)

    Bahman, Amir Sajjad; Iannuzzo, Francesco; Blaabjerg, Frede

    2016-01-01

    This paper proposes a novel mission-profile-based reliability analysis approach for stress on bond wires in Silicon Carbide (SiC) MOSFET power modules using statistics and thermo-mechanical FEM analysis. In the proposed approach, both the operational and environmental thermal stresses are taken...... into account. The approach uses a two-dimension statistical analysis of the operating conditions in a real one-year mission profile sampled at time frames 5 minutes long. For every statistical bin corresponding to a given operating condition, the junction temperature evolution is estimated by a thermal network...... and the mechanical stress on bond wires is consequently extracted by finite-element simulations. In the final step, the considered mission profile is translated in a stress sequence to be used for Rainflow counting calculation and lifetime estimation....

  2. Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections

    DEFF Research Database (Denmark)

    Elisseeva, O. V.; Bruhn, A.; Cerezo, J.

    2013-01-01

    A gold-aluminium material combination is typically employed as an interconnection for microelectronic devices. One of the reliability risks of such devices is that of corrosion of aluminium bond pads resulting from the galvanic coupling between an aluminium bond pad and a gold wire. The research...... presented in this manuscript focuses on studying bond pad corrosion by selecting an appropriate model system and a dedicated set of electrochemical and analytical experimental tools. Taking into account the complex three-dimensional structure and the small dimensions of Au-Al interconnections (around 50......-100 μm), a dedicated and novel experimental approach was developed. Au-Al covered silicon chips were developed under clean room conditions. Three-dimensional electrodes were mimicked as flat, two-dimensional bond pad model systems, allowing the use of microelectrochemical local probe techniques. Thin...

  3. The Analysis of the High Speed Wire Drawing Process of High Carbon Steel Wires Under Hydrodynamic Lubrication Conditions

    Directory of Open Access Journals (Sweden)

    Suliga M.

    2015-04-01

    Full Text Available In this work the analysis of the wire drawing process in hydrodynamic dies has been done. The drawing process of φ5.5 mm wire rod to the final wire of φ1.7 mm was conducted in 12 passes, in drawing speed range of 5-25 m/s. For final wires of φ1.7 mm the investigation of topography of wire surface, the amount of lubricant on the wire surface and the pressure of lubricant in hydrodynamic dies were determined. Additionally, in the work selected mechanical properties of the wires have been estimated.

  4. Magnetization processes in thin magnetic wires

    International Nuclear Information System (INIS)

    Varga, R.; Garcia, K.L.; Zhukov, A.; Vazquez, M.; Ipatov, M.; Gonzalez, J.; Zhukova, V.; Vojtanik, P.

    2006-01-01

    Amorphous magnetic microwires are novel materials, which are characterized by the unique magnetic properties. Their magnetization process runs through the depining and subsequent propagation of the single-domain wall. This allows us to study the magnetization processes of the single-domain wall either in static (when the domain wall lies in its potential) or dynamic (when the domain wall propagates along the wire) mode. In the given work, we present surprising results that were found during the single-domain wall switching and propagation in microwires. The negative critical propagation field during the propagation of the single-domain wall in microwires has been found. Moreover, new contribution (based on the structural relaxation) to the domain wall damping during its propagation in microwire was found. The complex shape of the single-domain wall potential, which consists of two contributions, has been found in microwires. The magnetoelastic one coming from the magnetoelastic interaction of the domain wall with the stresses applied on microwires and the stresses introduced during the microwire's production and stabilization one coming from the structural relaxation on atomic level

  5. Improvement of cold wire drawing process by electropulsing

    OpenAIRE

    Sánchez Egea, Antonio José; González Rojas, Hernan Alberto; Jorba Peiró, Jordi

    2015-01-01

    The electroplastic effects on wire drawing process assisted with different short time current pulses configurations are investigated experimentally. The current pulses were induced to a specimen during the drawing process. The studied material is the 308L stainless steel. Current densities of 185 A/mm2, frequencies range from 140 to 350 Hz and pulse duration range from 100 to 250 μs were used in the electrically‐assisted wire drawing process. Frequency and pulse duration are...

  6. Thermomechanical analysis of an electrically assisted wire drawing process

    OpenAIRE

    Sánchez Egea, Antonio José; González Rojas, Hernan Alberto; Celentano, Diego Javier; Jorba Peiró, Jordi; Cao, Jia

    2017-01-01

    Electrically-assisted wire drawing process is a hybrid manufacturing process characterized by enhancement of the formability, ductility and elongation of the wire drawn specimen. A thermomechanical model to describe the change of the mechanical response due to the thermal contribution is proposed in this work. Additionally, a numerical simulation was conducted to study the potential and limitations of this hybrid process by using two different hardening laws: a phenomenological and a dislocat...

  7. Evaluation of bond strength and load deflection rate of multi-stranded fixed retainer wires: An In-Vitro Study

    Directory of Open Access Journals (Sweden)

    Renu Sarah Samson

    2018-01-01

    Full Text Available Background: Fixed orthodontic retainers must be well retained on the tooth surfaces, allow physiologic movement of teeth and exert minimal forces on the teeth to be retained. Previous studies analyzed the bond strength and amount of deflection caused due to the debonding force but not the magnitude of force needed for unit deformation. Aims: This study aims to evaluate and compare the bond strength and load deflection rate (LDR of three different fixed retainer wires. Materials and Methods: The wires were divided into three Groups: A – three-stranded twisted ligature wire, B – Bond-A-Braid (Reliance Orthodontics, and C – three-stranded twisted lingual retainer wire (3M Unitek. Twenty models were prepared for each group with a passive 15 mm long lingual retainer wire bonded to two lower incisors. An occlusogingival force was applied to the wire until it debonded. For LDR, three-point bending test was done at 0.5 mm deflection. These forces were measured using a Universal Instron Testing Machine. Statistical Analysis: Mean bond strength/LDR and pairwise comparisons were analyzed with one-way ANOVA and Tukey's honest significant difference post hoc test, respectively. Results: Group C exhibited the highest mean bond strength and LDR of 101.17N and 1.84N, respectively. The intergroup comparisons were all statistically significant. Conclusion: Compared to the other two wire types, Group C might be better retained on the teeth due to its higher bond strength. With its relatively higher LDR value, it may resist deformation from occlusal forces, thereby reducing inadvertent tooth movement and yet remain flexible enough to allow physiologic tooth movements.

  8. Rectangular waveguide-to-coplanar waveguide transitions at U-band using e-plane probe and wire bonding

    DEFF Research Database (Denmark)

    Dong, Yunfeng; Johansen, Tom Keinicke; Zhurbenko, Vitaliy

    2016-01-01

    This paper presents rectangular waveguide-to-coplanar waveguide (CPW) transitions at U-band (40–60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguide-to-CPW trans......This paper presents rectangular waveguide-to-coplanar waveguide (CPW) transitions at U-band (40–60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguide......-to-CPW transitions using E-plane probe and wire bonding are designed. The proposed rectangular waveguide-to-CPW transition using wire bonding can provide 10 GHz bandwidth at U-band and does not require extra CPWs or connections between CPWs and chips. A single layer rectangular waveguide-to-CPW transition using E......-plane probe with aluminum package has been fabricated and measured to validate the proposed transitions. To the authors' best knowledge, this is the first time that a wire bonding is used as a probe for rectangular waveguide-to-CPW transition at U-band....

  9. Prediction of Bond Wire Fatigue of IGBTs in a PV Inverter Under a Long-Term Operation

    DEFF Research Database (Denmark)

    Reigosa, Paula Diaz; Wang, Huai; Yang, Yongheng

    2016-01-01

    consumption of bond wires of IGBT modules in a Photovoltaic (PV) inverter. The variations in IGBT parameters (e.g., on-state collector-emitter voltage), lifetime models, and environmental and operational stresses are taken into account in the lifetime prediction. The distribution of the annual lifetime...... consumption is estimated based on a long-term annual stress profile of solar irradiance and ambient temperature. The proposed method enables a more realistic lifetime prediction with a specified confidence level compared to the state-of-the-art approaches. A study case of IGBT modules in a 10 kW three......Bond wire fatigue is one of the dominant failure mechanisms in IGBT modules under cyclic stresses. However, there are still major challenges ahead to achieve a realistic bond wire lifetime prediction in field operation. This paper proposes a Monte Carlo based analysis method to predict the lifetime...

  10. Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

    International Nuclear Information System (INIS)

    Xu, H.; Liu, C.; Silberschmidt, V.V.; Pramana, S.S.; White, T.J.; Chen, Z.; Acoff, V.L.

    2011-01-01

    Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 deg. C to 250 deg. C was investigated by high resolution transmission electron microscopy (HRTEM). The native aluminum oxide film (∼5 nm thick) of the Al pad migrates towards the Cu ball during annealing. The formation of intermetallic compounds (IMC) is controlled by Cu diffusion, where the kinetics obey a parabolic growth law until complete consumption of the Al pad. The activation energies to initiate crystallization of CuAl 2 and Cu 9 Al 4 are 60.66 kJ mol -1 and 75.61 kJ mol -1 , respectively. During IMC development, Cu 9 Al 4 emerges as a second layer and grows together with the initial CuAl 2 . When Al is completely consumed, CuAl 2 transforms to Cu 9 Al 4 , which is the terminal product. Unlike the excessive void growth in Au-Al bonds, only a few voids nucleate in Cu-Al bonds after long-term annealing at high temperatures (e.g., 250 o C for 25 h), and their diameters are usually in the range of tens of nanometers. This is due to the lower oxidation rate and volumetric shrinkage of Cu-Al IMC compared with Au-Al IMC.

  11. Algorithm of automatic generation of technology process and process relations of automotive wiring harnesses

    Institute of Scientific and Technical Information of China (English)

    XU Benzhu; ZHU Jiman; LIU Xiaoping

    2012-01-01

    Identifying each process and their constraint relations from the complex wiring harness drawings quickly and accurately is the basis for formulating process routes. According to the knowledge of automotive wiring harness and the characteristics of wiring harness components, we established the model of wiring harness graph. Then we research the algorithm of identifying technology processes automatically, finally we describe the relationships between processes by introducing the constraint matrix, which is in or- der to lay a good foundation for harness process planning and production scheduling.

  12. Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials.

    Science.gov (United States)

    Jongsma, Marije A; Pelser, Floris D H; van der Mei, Henny C; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J; Ren, Yijin

    2013-05-01

    Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on different wires used for bonded retainers and the susceptibility of in vitro biofilms to oral antimicrobials. Orthodontic wires were exposed to saliva, and in vitro biofilm formation was evaluated using plate counting and live/dead staining, together with effects of exposure to toothpaste slurry alone or followed by antimicrobial mouthrinse application. Wires were also placed intra-orally for 72 h in human volunteers and undisturbed biofilm formation was compared by plate counting and live/dead staining, as well as by denaturing gradient gel electrophoresis for compositional differences in biofilms. Single-strand wires attracted only slightly less biofilm in vitro than multi-strand wires. Biofilms on stainless steel single-strand wires however, were much more susceptible to antimicrobials from toothpaste slurries and mouthrinses than on single-strand gold wires and biofilms on multi-strand wires. Also, in vivo significantly less biofilm was found on single-strand than on multi-strand wires. Microbial composition of biofilms was more dependent on the volunteer involved than on wire type. Biofilms on single-strand stainless steel wires attract less biofilm in vitro and are more susceptible to antimicrobials than on multi-strand wires. Also in vivo, single-strand wires attract less biofilm than multi-strand ones. Use of single-strand wires is preferred over multi-strand wires, not because they attract less biofilm, but because biofilms on single-strand wires are not protected against antimicrobials as in crevices and niches as on multi-strand wires.

  13. Scaleup of powder metallurgy processed Nb-Al multifilamentary wire

    International Nuclear Information System (INIS)

    Thieme, C.; Foner, S.; Otubo, J.; Pourrahimi, S.; Schwartz, B.; Zhang, H.

    1983-01-01

    Power metallurgy processed Nb-Al superconducting wires were fabricated from billets up to 45 mm o.d. with nominal areal reduction ratios, R, up to 2 X 10 5 , Nb powder sizes from 40 to 300 μm from various sources, Al powder sizes from 9 to 75 μm, Al concentrations from 3 to 25 wt % Al and with a wide range of heat treatments. All the compacts used tap density powder in a Cu tube and swaging and/or rod rolling and subsequent wire drawing. Both single strand and bundled wires were made. Overall critical current densities, J /SUB c/, of 2 X 10 4 A/cm 2 at 14 T and 10 4 A/cm 2 at 16 T were achieved for 6 to 8 wt % Al in Nb

  14. Electron beam additive manufacturing with wire - Analysis of the process

    Science.gov (United States)

    Weglowski, Marek St.; Błacha, Sylwester; Pilarczyk, Jan; Dutkiewicz, Jan; Rogal, Łukasz

    2018-05-01

    The electron beam additive manufacturing process with wire is a part of global trend to find fast and efficient methods for producing complex shapes elements from costly metal alloys such as stainless steels, nickel alloys, titanium alloys etc. whose production by other conventional technologies is unprofitable or technically impossible. Demand for additive manufacturing is linked to the development of new technologies in the automotive, aerospace and machinery industries. The aim of the presented work was to carried out research on electron beam additive manufacturing with a wire as a deposited (filler) material. The scope of the work was to investigate the influence of selected technological parameters such as: wire feed rate, beam current, travelling speed, acceleration voltage on stability of the deposition process and geometric dimensions of the padding welds. The research revealed that, at low beam currents, the deposition process is unstable. The padding weld reinforcement is non-uniform. Irregularity of the width, height and straightness of the padding welds can be observed. At too high acceleration voltage and beam current, burn-through of plate and excess penetration weld can be revealed. The achieved results and gained knowledge allowed to produce, based on EBAM with wire process, whole structure from stainless steel.

  15. Flux pinning in bronze-processed Nb3Sn wires

    International Nuclear Information System (INIS)

    Suenaga, M.; Welch, D.O.

    1980-01-01

    The scaling law derived by Kramer for magnetic flux pinning in high magnetic fields was examined for its applicability to the magnetic field dependence of critical-current densities in the bronze processed monofilamentary Nb 3 Sn wires. From this it was concluded that: (1) its prediction for the form of the dependence of critical current on magnetic field and grain size [/J vector /sub c/ x H vector/ approx. h/sup 1/2/(1-h) 2 (1-a 0 √rho) -2 ] was found to be very good in most cases including wires with very small Nb 3 Sn grains (approx. 400 A). It was found very useful in comparison of J/sub c/ for different wires and in extrapolating to obtain H/sub c2/ for these wires. (2) However, it could not account consistently for the anisotropy in critical current of a tape which was measured with H applied perpendicular and parallel to the tape face. (3) The values of kappa 1 which were determined with the scaling law were too small by a factor of 2 to 3, and the trend in the variation with heat-treating time was opposite to that which is reasonably to be expected. That the behavior of kappa 1 is thus seriously in contradiction with the expected behavior for Nb 3 Sn suggests basic faults in the derivation of the scaling equation for critical currents at high magnetic fields

  16. The effect of prior sandblasting of the wire on the shear bond strength of two different types of lingual retainers.

    Science.gov (United States)

    Kilinç, Delal Dara; Sayar, Gülşilay

    2018-04-07

    The aim of this study was to evaluate the effect of total surface sandblasting on the shear bond strength of two different retainer wires. The null hypothesis was that there is no difference in the bond strength of the two types of lingual retainer wires when they are sandblasted. One hundred and sixty human premolar teeth were equally divided into four groups (n=40). A pair of teeth was embedded in self-curing acrylic resin and polished. Retainer wires were applied on the etched and rinsed surfaces of the teeth. Four retainers were used: group 1: braided retainer (0.010×0.028″, Ortho Technology); group 2: sandblasted braided retainer (0.010×0.028″, Ortho Technology); group 3: coaxial retainer (0.0215″ Coaxial, 3M) and group 4: sandblasted coaxial retainer (0.0215″ Coaxial, 3M). The specimens were tested using a universal test machine in shear mode with a crosshead speed of one mm/min. One-way analysis of variance (Anova) was used to determine the significant differences among the groups. There was no significant difference (P=0.117) among the groups according to this test. The null hypothesis was accepted. There was no statistically significant difference among the shear bond strength values of the four groups. Copyright © 2018 CEO. Published by Elsevier Masson SAS. All rights reserved.

  17. Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials

    NARCIS (Netherlands)

    Jongsma, Marije A.; Pelser, Floris D. H.; van der Mei, Henny C.; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J.; Ren, Yijin

    OBJECTIVE: Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on

  18. Analysis of factors influencing the bond strength in roll bonding processes

    Science.gov (United States)

    Khaledi, Kavan; Wulfinghoff, Stephan; Reese, Stefanie

    2018-05-01

    Cold Roll Bonding (CRB) is recognized as an industrial technique in which the metal sheets are joined together in order to produce laminate metal composites. In this technique, a metallurgical bond resulting from severe plastic deformation is formed between the rolled metallic layers. The main objective of this paper is to analyse different factors which may affect the bond formation in rolling processes. To achieve this goal, first, an interface model is employed which describes both the bonding and debonding. In this model, the bond strength evolution between the metallic layers is calculated based on the film theory of bonding. On the other hand, the debonding process is modelled by means of a bilinear cohesive zone model. In the numerical section, different scenarios are taken into account to model the roll bonding process of metal sheets. The numerical simulation includes the modelling of joining during the roll bonding process followed by debonding in a Double Cantilever Beam (DCB) peeling test. In all simulations, the metallic layers are regarded as elastoplastic materials subjected to large plastic deformations. Finally, the effects of some important factors on the bond formation are numerically investigated.

  19. A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder

    International Nuclear Information System (INIS)

    Kratt, K; Badilita, V; Burger, T; Wallrabe, U; Korvink, J G

    2010-01-01

    We report the fabrication of 3D micro coils made with an automatic wire bonder. Using standard MEMS processes such as spin coating and UV lithography on silicon and Pyrex® wafers results in high aspect ratio SU-8 posts with diameters down to 100 µm that serve as mechanical stabilization yokes for the coils. The wire bonder is employed to wind 25 µm insulated gold wire around the posts in an arbitrary (e.g. solenoidal) path, yielding arrays of micro coils. Each micro coil is bonded directly on-chip, so that loose wire ends are avoided and, compared to other winding methods, coil re-soldering is unnecessary. The manufacturing time for a single coil is about 200 ms, and although the process is serial, it is batch fabrication compatible due to the high throughput of the machine. Despite the speed of manufacture we obtain high manufacturing precision and reliability. The micro air-core solenoids show an RF quality factor of over 50 when tested at 400 MHz. We present a flexible coil making method where the number of windings is only limited by the post height. The coil diameter is restricted by limits defined by lithography and the mechanical strength of the posts. Based on this technique we present coils ranging from 100 µm diameter and 1 winding up to 1000 µm diameter and 20 windings

  20. Prediction of multi performance characteristics of wire EDM process using grey ANFIS

    Science.gov (United States)

    Kumanan, Somasundaram; Nair, Anish

    2017-09-01

    Super alloys are used to fabricate components in ultra-supercritical power plants. These hard to machine materials are processed using non-traditional machining methods like Wire cut electrical discharge machining and needs attention. This paper details about multi performance optimization of wire EDM process using Grey ANFIS. Experiments are designed to establish the performance characteristics of wire EDM such as surface roughness, material removal rate, wire wear rate and geometric tolerances. The control parameters are pulse on time, pulse off time, current, voltage, flushing pressure, wire tension, table feed and wire speed. Grey relational analysis is employed to optimise the multi objectives. Analysis of variance of the grey grades is used to identify the critical parameters. A regression model is developed and used to generate datasets for the training of proposed adaptive neuro fuzzy inference system. The developed prediction model is tested for its prediction ability.

  1. Multi responses optimization of wire EDM process parameters using ...

    African Journals Online (AJOL)

    Taguchi approach coupled with principal component analysis methodology .... Wire EDM to perform trails; (2) Selection of material according to importance and .... manufacturing of oil and gases pipeline, springs, construction, automobiles and ...

  2. Ductile alloy and process for preparing composite superconducting wire

    Science.gov (United States)

    Verhoeven, J.D.; Finnemore, D.K.; Gibson, E.D.; Ostenson, J.E.

    An alloy for the commercial production of ductile superconducting wire is prepared by melting together copper and at least 15 weight percent niobium under non-oxygen-contaminating conditions, and rapidly cooling the melt to form a ductile composite consisting of discrete, randomly distributed and oriented dendritic-shaped particles of niobium in a copper matrix. As the wire is worked, the dendritic particles are realigned parallel to the longitudinal axis and when drawn form a plurality of very fine ductile superconductors in a ductile copper matrix. The drawn wire may be tin coated and wound into magnets or the like before diffusing the tin into the wire to react with the niobium. Impurities such as aluminum or gallium may be added to improve upper critical field characteristics.

  3. Influence of Wire Electrical Discharge Machining (WEDM) process parameters on surface roughness

    Science.gov (United States)

    Yeakub Ali, Mohammad; Banu, Asfana; Abu Bakar, Mazilah

    2018-01-01

    In obtaining the best quality of engineering components, the quality of machined parts surface plays an important role. It improves the fatigue strength, wear resistance, and corrosion of workpiece. This paper investigates the effects of wire electrical discharge machining (WEDM) process parameters on surface roughness of stainless steel using distilled water as dielectric fluid and brass wire as tool electrode. The parameters selected are voltage open, wire speed, wire tension, voltage gap, and off time. Empirical model was developed for the estimation of surface roughness. The analysis revealed that off time has a major influence on surface roughness. The optimum machining parameters for minimum surface roughness were found to be at a 10 V open voltage, 2.84 μs off time, 12 m/min wire speed, 6.3 N wire tension, and 54.91 V voltage gap.

  4. Investigations on the wire saw process on steels of selected geometries in the encircling process

    International Nuclear Information System (INIS)

    Knecht, Daniel

    2015-01-01

    This thesis illustrates a new and innovative model for the usual looping method to describe cutting time and wear. Several test series have been carried out to determine and analyze the various influencing factors. This new model now allows for exact predictions for cutting times and the resulting wear. A special test stand was planned and built. With the help of this test stand various influencing parameters were determined in preliminary tests. Due to the high correlation between these parameters, a matrix was created to rate them. From these results and the findings of the preliminary tests, the boundary conditions such as work piece size were defined and an experimental design was created. Eleven test series were conducted and each one consists of up to ten work pieces. In each test series, only one parameter was changed, the other influencing parameters remained unchanged. The parameter of the following characteristics were varied: the speed of the diamond wire, the feed pressure, the cutting angle, the geometry with respective cutting area, the work piece material, as well as the twisting of the diamond wire. By varying these parameters, the influence could be shown on the performance of the cutting process and also on the wear behavior of the diamond wire. A model was created from the obtained data which enables a cutting time prediction for rectangular work pieces. In addition to the model, a new criterion has been developed, with which it is possible to quantify the progress of wear and to be able to determine a necessary wire replacement. The classification of particle sizes of the accumulated chips has shown that a lower average cutting performance results in a decrease of the average particle size. From this circumstance a termination criterion of <150 μm has been established. When the particle size drops below this value, the cutting process becomes ineffective and should not be continued, or the diamond wire should be replaced, respectively

  5. The Effects of Operational Parameters on a Mono-wire Cutting System: Efficiency in Marble Processing

    Science.gov (United States)

    Yilmazkaya, Emre; Ozcelik, Yilmaz

    2016-02-01

    Mono-wire block cutting machines that cut with a diamond wire can be used for squaring natural stone blocks and the slab-cutting process. The efficient use of these machines reduces operating costs by ensuring less diamond wire wear and longer wire life at high speeds. The high investment costs of these machines will lead to their efficient use and reduce production costs by increasing plant efficiency. Therefore, there is a need to investigate the cutting performance parameters of mono-wire cutting machines in terms of rock properties and operating parameters. This study aims to investigate the effects of the wire rotational speed (peripheral speed) and wire descending speed (cutting speed), which are the operating parameters of a mono-wire cutting machine, on unit wear and unit energy, which are the performance parameters in mono-wire cutting. By using the obtained results, cuttability charts for each natural stone were created on the basis of unit wear and unit energy values, cutting optimizations were performed, and the relationships between some physical and mechanical properties of rocks and the optimum cutting parameters obtained as a result of the optimization were investigated.

  6. Multifilamentary MgB2 wires fracture behavior during the drawing process

    International Nuclear Information System (INIS)

    Shan, D.; Yan, G.; Zhou, L.; Li, J.S.; Li, C.S.; Wang, Q.Y.; Xiong, X.M.; Jiao, G.F.

    2012-01-01

    The fracture behavior of 6 + 1 filamentary MgB 2 superconductive wires is presented here. The composite wires were fabricated by in situ Powder-in-Tube method using Nb as a barrier and copper as a stabilizer. The microstructure of the material has a great influence on its fracture behavior. The microstructural aspects of crack nucleation and propagation are discussed. It shows that there are complicated correlations between fracture behavior and the main influencing parameters, which contain specific drawing conditions (drawing velocity, reduction in area per pass), materials properties (strength, yield stress, microstructure) as well as the extent of bonding between the metal sheaths at their interface.

  7. Reduction of tensile residual stresses during the drawing process of tungsten wires

    International Nuclear Information System (INIS)

    Rodriguez Ripoll, Manel; Weygand, Sabine M.; Riedel, Hermann

    2010-01-01

    Tungsten wires are commonly used in the lighting industry as filaments for lamps. During the drawing process, the inhomogeneous deformation imparted by the drawing die causes tensile residual stresses at the wire surface in circumferential direction. These stresses have a detrimental effect for the wire because they are responsible for driving longitudinal cracks, known as splits. This work proposes two methods for reducing the residual stresses during wire drawing, namely applying an advanced die geometry and performing an inexpensive post-drawing treatment based on targeted bending operations. These two methods are analyzed with finite element simulations using material parameters obtained by mechanical tests on tungsten wires at different temperatures as input data. The computed results predict a substantial reduction of the circumferential residual stresses, thus reducing the risk of splitting.

  8. Advanced Process Possibilities in Friction Crush Welding of Aluminum, Steel, and Copper by Using an Additional Wire

    Science.gov (United States)

    Besler, Florian A.; Grant, Richard J.; Schindele, Paul; Stegmüller, Michael J. R.

    2017-12-01

    Joining sheet metal can be problematic using traditional friction welding techniques. Friction crush welding (FCW) offers a high speed process which requires a simple edge preparation and can be applied to out-of-plane geometries. In this work, an implementation of FCW was employed using an additional wire to weld sheets of EN AW5754 H22, DC01, and Cu-DHP. The joint is formed by bringing together two sheet metal parts, introducing a wire into the weld zone and employing a rotating disk which is subject to an external force. The requirements of the welding preparation and the fundamental process variables are shown. Thermal measurements were taken which give evidence about the maximum temperature in the welding center and the temperature in the periphery of the sheet metals being joined. The high welding speed along with a relatively low heat input results in a minimal distortion of the sheet metal and marginal metallurgical changes in the parent material. In the steel specimens, this FCW implementation produces a fine grain microstructure, enhancing mechanical properties in the region of the weld. Aluminum and copper produced mean bond strengths of 77 and 69 pct to that of the parent material, respectively, whilst the steel demonstrated a strength of 98 pct. Using a wire offers the opportunity to use a higher-alloyed additional material and to precisely adjust the additional material volume appropriate for a given material alignment and thickness.

  9. ECAE-processed Cu-Nb and Cu-Ag nanocomposite wires for pulse magnet applications

    International Nuclear Information System (INIS)

    Edgecumbe Summers, T.S.; Walsh, R.P.; Pernambuco-Wise, P.

    1997-01-01

    Cu-Nb and Cu-Ag nanocomposites have recently become of interest to pulse magnet designers because of their unusual combination of high strength with reasonable conductivity. In the as-cast condition, these conductors consist of two phases, one of almost pure Nb (or Ag) and the other almost pure Cu. When these castings are cold worked as in a wire-drawing operation for example, the two phases are drawn into very fine filaments which produce considerable strengthening without an unacceptable decrease in conductivity. Unfortunately, any increase in strength with operations such as wire drawing is accompanied by a reduction in the cross section of the billet, and thus far, no wires with strengths on the order of 1.5 GPa or more have been produced with cross sections large enough to be useful in magnet applications. Equal Channel Angular Extrusion (ECAE) is an innovative technique which allows for the refinement of the as-cast ingot structure without a reduction in the cross sectional dimensions. Samples processed by the ECAE technique prior to wire drawing should be stronger at a given wire diameter than those processed by wire drawing alone. The tensile properties of wire-drawn Cu-18%Nb and Cu-25%Ag both with and without prior ECAE processing were tested and compared at both room temperature and 77K. All samples were found to have resistivities consistent with their strengths, and the strengths of the ECAE-processed wires were significantly higher than their as-cast and drawn counterparts. Therefore, with ECAE processing prior to wire drawing, it appears to be possible to make high-strength conductors with adequately large cross sections for pulse magnets

  10. Processing and critical currents of high-Tc superconductor wires

    International Nuclear Information System (INIS)

    Krauth, H.; Heine, K.; Tenbrink, J.

    1991-01-01

    High-Tc superconductors are expected to have a major impact on magnet and energy technology. For technical applications they have to fulfill the requirement of carrying sufficient current at a critical current density of the order of 10 5 A/cm 2 at operating temperature and magnetic field. At 77 K these values have not been achieved yet in bulk material or wires due to weak link problems and flux creep effects. Progress made so far and remaining problems will be discussed in detail concentrating on problems concerning development of technical wires. In Bi-based materials technically interesting critical current densities could be achieved at 4.2 K in fields above 20 T (1,2), rendering possible the use of such material for very high field application. (orig.)

  11. Breakdown processes in wire chambers, prevention and rate capability

    International Nuclear Information System (INIS)

    Atac, M.

    1983-01-01

    Breakdowns were optically and electronically observed in drift tubes and drift chambers. They occur at a critical gain for given intensity in a gas mixture when ultraviolet photons are not completely quenched. It was observed that the breakdowns depended critically on average current for a given gas mixture independent of the size of the drift tubes used. Using 4.6% ethyl alcohol vapor mixed into 50/50 argon ethane gas, breakdown are eliminated up to 7 /sub μ/A average current drawn by pulses on a 1 cm section of an anode wire under an intense source. Pulses with an avalanche size of 10 6 electron rates above 10 6 pulses per centimeter per wire may be obtained with the elimination of breakdowns

  12. Breakdown processes in wire chambers, prevention and rate capability

    International Nuclear Information System (INIS)

    Atac, M.

    1982-01-01

    Breakdowns were optically and electronically observed in drift tubes and drift chambers. They occur at a critical gain for given intensity in a gas mixture when ultraviolet photons are not completely quenched. It was observed that the breakdowns depended critically on average current for a given gas mixture independent of the size of the drift tubes used. Using 4.6% ethyl alcohol vapor mixed into 50/50 argon ethane gas, breakdowns are eliminated up to 7 μA average current drawn by pulses on a 1 cm section of an anode wire under an intense source. Pulses with an avalanche size of 10 6 electron rates above 10 6 pulses per centimeter per wire may be obtained with the elimination of breakdowns

  13. Study Of The Wet Multipass Drawing Process Applied On High Strength Thin Steel Wires

    Science.gov (United States)

    Thimont, J.; Felder, E.; Bobadilla, C.; Buessler, P.; Persem, N.; Vaubourg, JP.

    2011-05-01

    Many kinds of high strength thin steel wires are involved in so many applications. Most of the time, these wires are made of a pearlitic steel grade. The current developments mainly concern the wire last drawing operation: after a patenting treatment several reduction passes are performed on a slip-type multipass drawing machine. This paper focuses on modeling this multipass drawing process: a constitutive law based on the wire microstructure evolutions is created, a mechanical study is performed, a set of experiments which enables determining the process friction coefficients is suggested and finally the related analytical model is introduced. This model provides several general results about the process and can be used in order to set the drawing machines.

  14. Low-cost bump-bonding processes for high energy physics pixel detectors

    CERN Document Server

    AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

    2016-01-01

    In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

  15. On the use of OSL of wire-bond chip card modules for retrospective and accident dosimetry

    Energy Technology Data Exchange (ETDEWEB)

    Woda, Clemens [Helmholtz Zentrum Muenchen - German Research Centre for Environmental Health, Institute of Radiation Protection, Ingolstaedter Landstrasse 1, D-85764 Neuherberg (Germany)], E-mail: clemens.woda@helmholtz-muenchen.de; Spoettl, Thomas [Infineon Technologies AG, Wernerwerkstrasse 1, D-93049 Regensburg (Germany)

    2009-05-15

    The potential of optically stimulated luminescence of wire-bond chip card modules, used in health insurance, ID, cash and credit cards for retrospective and accident dosimetry is investigated. Chip card modules obtained directly from the producer, using a widely spread UV-cured epoxy product for encapsulation, are used as basis for the study. The radiation sensitivity is due to silica grains added to the epoxy for controlling the thixotropic properties. Luminescence properties are complex due to the presumed thermo-optical release of electrons from the epoxy and transfer into the silica. Best results and highest sensitivity are obtained by using no or only low preheat treatments. A high degree of fading of the OSL signal during storage at room temperature is observed, which is tentatively explained by the superposition of thermal decay of shallow OSL traps and athermal (anomalous) decay of deeper OSL traps. The dose response of the OSL signal shows exponentially saturating behaviour, with saturation doses of 77 Gy or 9.6 Gy, depending on pretreatment. Dose recovery tests show that given doses can be recovered within a deviation of {+-}14%, if measured signals are corrected for fading. The minimum detectable dose is estimated at {approx}3 mGy, {approx}10 mGy and {approx}20 mGy for readouts immediately, 1 day and 10 days after exposure, respectively.

  16. On the use of OSL of wire-bond chip card modules for retrospective and accident dosimetry

    International Nuclear Information System (INIS)

    Woda, Clemens; Spoettl, Thomas

    2009-01-01

    The potential of optically stimulated luminescence of wire-bond chip card modules, used in health insurance, ID, cash and credit cards for retrospective and accident dosimetry is investigated. Chip card modules obtained directly from the producer, using a widely spread UV-cured epoxy product for encapsulation, are used as basis for the study. The radiation sensitivity is due to silica grains added to the epoxy for controlling the thixotropic properties. Luminescence properties are complex due to the presumed thermo-optical release of electrons from the epoxy and transfer into the silica. Best results and highest sensitivity are obtained by using no or only low preheat treatments. A high degree of fading of the OSL signal during storage at room temperature is observed, which is tentatively explained by the superposition of thermal decay of shallow OSL traps and athermal (anomalous) decay of deeper OSL traps. The dose response of the OSL signal shows exponentially saturating behaviour, with saturation doses of 77 Gy or 9.6 Gy, depending on pretreatment. Dose recovery tests show that given doses can be recovered within a deviation of ±14%, if measured signals are corrected for fading. The minimum detectable dose is estimated at ∼3 mGy, ∼10 mGy and ∼20 mGy for readouts immediately, 1 day and 10 days after exposure, respectively.

  17. Two-Step Plasma Process for Cleaning Indium Bonding Bumps

    Science.gov (United States)

    Greer, Harold F.; Vasquez, Richard P.; Jones, Todd J.; Hoenk, Michael E.; Dickie, Matthew R.; Nikzad, Shouleh

    2009-01-01

    A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. The two-step plasma process makes it possible to remove surface indium oxide, without incurring the adverse effects of the acid etching process.

  18. Studies of implosion processes of nested tungsten wire-array Z-pinch

    International Nuclear Information System (INIS)

    Ning Cheng; Ding Ning; Liu Quan; Yang Zhenhua

    2006-01-01

    Nested wire-array is a kind of promising structured-load because it can improve the quality of Z-pinch plasma and enhance the radiation power of X-ray source. Based on the zero-dimensional model, the assumption of wire-array collision, and the criterion of optimized load (maximal load kinetic energy), optimization of the typical nested wire-array as a load of Z machine at Sandia Laboratory was carried out. It was shown that the load has been basically optimized. The Z-pinch process of the typical load was numerically studied by means of one-dimensional three-temperature radiation magneto-hydrodynamics (RMHD) code. The obtained results reproduce the dynamic process of the Z-pinch and show the implosion trajectory of nested wire-array and the transfer process of drive current between the inner and outer array. The experimental and computational X-ray pulse was compared, and it was suggested that the assumption of wire-array collision was reasonable in nested wire-array Z-pinch at least for the current level of Z machine. (authors)

  19. An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

    Science.gov (United States)

    Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

    2011-12-01

    A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

  20. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

    CERN Multimedia

    Saba, A

    2006-01-01

    2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

  1. A new wire fabrication processing using high Ga content Cu-Ga compound in V3Ga compound superconducting wire

    International Nuclear Information System (INIS)

    Hishinuma, Yoshimitsu; Nishimura, Arata; Kikuchi, Akihiro; Iijima, Yasuo; Takeuchi, Takao

    2007-01-01

    A superconducting magnet system is also one of the important components in an advanced magnetic confinement fusion reactor. Then it is required to have a higher magnetic field property to confine and maintain steady-sate burning deuterium (D)-tritium (T) fusion plasma in the large interspace during the long term operation. Burning plasma is sure to generate 14 MeV fusion neutrons during deuterium-tritium reaction, and fusion neutrons will be streamed and penetrated to superconducting magnet through large ports with damping neutron energy. Therefore, it is necessary to consider carefully not only superconducting property but also neutron irradiation property in superconducting materials for use in a future fusion reactor, and a 'low activation and high field superconducting magnet' will be required to realize the fusion power plant beyond International Thermonuclear Experimental Reactor (ITER). V-based superconducting material has a much shorter decay time of induced radioactivity compared with the Nb-based materials. We thought that the V 3 Ga compound was one of the most promising materials for the 'low activation and higher field superconductors' for an advanced fusion reactor. However, the present critical current density (J c ) property of V 3 Ga compound wire is insufficient for apply to fusion magnet applications. We investigated a new route PIT process using a high Ga content Cu-Ga compound in order to improve the superconducting property of the V 3 Ga compound wire. (author)

  2. Production of diamond wire by Cu15 v-% Nb 'in situ' process

    International Nuclear Information System (INIS)

    Filgueira, M.; Pinatti, D.G.

    2001-01-01

    Diamond wires are cutting tools used in the slabbing of dimension stones, such as marbles and granites, as well as in cutting of concrete structures. This tool consists of a steel cable on which diamond annular segments (pearls) are mounted with spacing between them. This work has developed a new technological route to obtain the diamond wires, whose fabrication involves metal forming processes such as rotary forging and wire drawing, copper tubes restacking, and thermal treatments of sintering and recrystallization. It was idealized the use of Cu 15v% Nb composite wires as the high tensile strength cable, covered with an external cutting rope made of bronze 4wt% diamond composite, along the overall wire surface. Investigations were carried out on the mechanical behavior and on the microstructural evolution of the Cu 15 vol % Nb wires, which showed ultimate tensile strength (UTS) of 960 MPa and deformation of approximately 3,0 %. The cutting external rope of 1.84 mm in diameter showed UTS = 230 MPa. On the microstructural side aspect it was observed that the diamond crystals were uniformly distributed throughout the tool bulk in the several processing steps. Cutting tests were carried out starting with an external diamond rope of 1.93 mm in diameter, which cut a marble sectional area of 1188 cm 2 , and the tool degraded to a final diameter of 1.23 mm. For marble the 'in situ' wire showed a probable performance 4 times higher than the diamond saws, however their probable performance was about 5 to 8 times less than the conventional diamond wires due to the low abrasion resistance of the bronze matrix and the low adhesion between the pair bronze-diamond. (author)

  3. Application of irradiation process for the production of thin wall wires

    International Nuclear Information System (INIS)

    Saito, E.

    1977-01-01

    The demand for thin wall crosslinked PVC or polyethylene insulated wires in Japan was about 15,000,000 dollars in value in 1975. Their annual sales in 1980 are estimated at about 40 million dollars which will account for approximately 20% of the sales of all thin wall thermoplastic insulated wires expected for the same year. A comparative study was made of the irradiation process and the chemical process for manufacture of wires with crosslinked PVC or polyethylene insulation. Having found the excellence of the irradiation process an accelerator (500 KeV, 65mA) was installed in 1973 and production was begun of several types of thin wall irradiation crosslinked PVC and polyethylene insulated wires ranging from 0.06 mm 2 to 2.0 mm 2 in the cross-sectional area of conductor, successfully putting them in extensive commercial application. This report compares the irradiation process and the chemical process, properties of several types of irradiation crosslinked PVC, and polyethylene insulated wires and their applications. (author)

  4. Large critical current density improvement in Bi-2212 wires through the groove-rolling process

    International Nuclear Information System (INIS)

    Malagoli, A; Bernini, C; Braccini, V; Romano, G; Putti, M; Chaud, X; Debray, F

    2013-01-01

    Recently there has been a growing interest in Bi-2212 superconductor round wire for high magnetic field use despite the fact that an increase of the critical current is still needed to boost its successful use in such applications. Recent studies have demonstrated that the main obstacle to current flow, especially in long wires, is the residual porosity inside these powder-in-tube processed conductors that develops from bubble agglomeration when the Bi-2212 melts. In this work we tried to overcome this issue affecting the wire densification by changing the deformation process. Here we show the effects of groove rolling versus the drawing process on the critical current density J C and on the microstructure. In particular, groove-rolled multifilamentary wires show a J C increased by a factor of about 3 with respect to drawn wires prepared with the same Bi-2212 powder and architecture. We think that this approach in the deformation process is able to produce the required improvements both because the superconducting properties are enhanced and because it makes the fabrication process faster and cheaper. (paper)

  5. Novel magnetic wire fabrication process by way of nanoimprint lithography for current induced magnetization switching

    Directory of Open Access Journals (Sweden)

    Tsukasa Asari

    2017-05-01

    Full Text Available Nanoimprint lithography (NIL is an effective method to fabricate nanowire because it does not need expensive systems and this process is easier than conventional processes. In this letter, we report the Current Induced Magnetization Switching (CIMS in perpendicularly magnetized Tb-Co alloy nanowire fabricated by NIL. The CIMS in Tb-Co alloy wire was observed by using current pulse under in-plane external magnetic field (HL. We successfully observed the CIMS in Tb-Co wire fabricated by NIL. Additionally, we found that the critical current density (Jc for the CIMS in the Tb-Co wire fabricated by NIL is 4 times smaller than that fabricated by conventional lift-off process under HL = 200Oe. These results indicate that the NIL is effective method for the CIMS.

  6. Novel magnetic wire fabrication process by way of nanoimprint lithography for current induced magnetization switching

    Science.gov (United States)

    Asari, Tsukasa; Shibata, Ryosuke; Awano, Hiroyuki

    2017-05-01

    Nanoimprint lithography (NIL) is an effective method to fabricate nanowire because it does not need expensive systems and this process is easier than conventional processes. In this letter, we report the Current Induced Magnetization Switching (CIMS) in perpendicularly magnetized Tb-Co alloy nanowire fabricated by NIL. The CIMS in Tb-Co alloy wire was observed by using current pulse under in-plane external magnetic field (HL). We successfully observed the CIMS in Tb-Co wire fabricated by NIL. Additionally, we found that the critical current density (Jc) for the CIMS in the Tb-Co wire fabricated by NIL is 4 times smaller than that fabricated by conventional lift-off process under HL = 200Oe. These results indicate that the NIL is effective method for the CIMS.

  7. Analytical methods to characterize heterogeneous raw material for thermal spray process: cored wire Inconel 625

    Science.gov (United States)

    Lindner, T.; Bonebeau, S.; Drehmann, R.; Grund, T.; Pawlowski, L.; Lampke, T.

    2016-03-01

    In wire arc spraying, the raw material needs to exhibit sufficient formability and ductility in order to be processed. By using an electrically conductive, metallic sheath, it is also possible to handle non-conductive and/or brittle materials such as ceramics. In comparison to massive wire, a cored wire has a heterogeneous material distribution. Due to this fact and the complex thermodynamic processes during wire arc spraying, it is very difficult to predict the resulting chemical composition in the coating with sufficient accuracy. An Inconel 625 cored wire was used to investigate this issue. In a comparative study, the analytical results of the raw material were compared to arc sprayed coatings and droplets, which were remelted in an arc furnace under argon atmosphere. Energy-dispersive X-ray spectroscopy (EDX) and X-ray fluorescence (XRF) analysis were used to determine the chemical composition. The phase determination was performed by X-ray diffraction (XRD). The results were related to the manufacturer specifications and evaluated in respect to differences in the chemical composition. The comparison between the feedstock powder, the remelted droplets and the thermally sprayed coatings allows to evaluate the influence of the processing methods on the resulting chemical and phase composition.

  8. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  9. The Analysis of Force Parameters in Drawing Process of High Carbon Steel Wires in Conventional and Hydrodynamic Dies

    Directory of Open Access Journals (Sweden)

    Suliga M.

    2017-12-01

    Full Text Available The paper analyzes force parameters in the process of multistage drawing of steel wires in conventional and hydrodynamic dies. The drawing process of the wire rod with a diameter of 5.5 mm for wires with a diameter of 1.70 mm was performed in 12 drafts with the usage of the multistage drawbench Koch KGT with the speed range of 5-25 m/s.

  10. Development and manufacturing of bronze-processed Ta-added Nb3Sn wires for the ITER

    International Nuclear Information System (INIS)

    Kikuchi, Kenichi; Seidou, Masahiro; Iwaki, Genzou; Sakai, Syuuji; Moriai, Hidezumi; Nishi, Masataka; Yoshida, Kiyoshi; Isono, Takaaki; Tsuji, Hiroshi.

    1997-01-01

    Development work to produce a high-performance Nb 3 Sn superconducting wire for the center solenoid coil of the ITER was carried out. The effects of concurrently adding Ti and Ta to bronze-processed Nb 3 Sn wires were examined. In addition, a high-Sn-concentration bronze matrix was applied. Then, the relation between hysteresis loss and filament diameter was examined. Moreover, the cause of wire breakage during processing was elucidated. As a result, a reliable manufacturing process for high-performance Nb 3 Sn superconducting wire was established. (author)

  11. Geometry characteristics modeling and process optimization in coaxial laser inside wire cladding

    Science.gov (United States)

    Shi, Jianjun; Zhu, Ping; Fu, Geyan; Shi, Shihong

    2018-05-01

    Coaxial laser inside wire cladding method is very promising as it has a very high efficiency and a consistent interaction between the laser and wire. In this paper, the energy and mass conservation law, and the regression algorithm are used together for establishing the mathematical models to study the relationship between the layer geometry characteristics (width, height and cross section area) and process parameters (laser power, scanning velocity and wire feeding speed). At the selected parameter ranges, the predicted values from the models are compared with the experimental measured results, and there is minor error existing, but they reflect the same regularity. From the models, it is seen the width of the cladding layer is proportional to both the laser power and wire feeding speed, while it firstly increases and then decreases with the increasing of the scanning velocity. The height of the cladding layer is proportional to the scanning velocity and feeding speed and inversely proportional to the laser power. The cross section area increases with the increasing of feeding speed and decreasing of scanning velocity. By using the mathematical models, the geometry characteristics of the cladding layer can be predicted by the known process parameters. Conversely, the process parameters can be calculated by the targeted geometry characteristics. The models are also suitable for multi-layer forming process. By using the optimized process parameters calculated from the models, a 45 mm-high thin-wall part is formed with smooth side surfaces.

  12. NUMERICAL SIMULATION OF RESIDUAL STRESSES GENERATED IN THE WIRE DRAWING PROCESS FOR DIFFERENT PROCESS PARAMETERS

    Directory of Open Access Journals (Sweden)

    Juliana Zottis

    2014-03-01

    Full Text Available The drawing process of steel bars is usually used to check better dimensional accuracy and mechanical properties to the material. In the other hand, the major concern found in manufacturing axes through this process is the appearance of distortion of shape. Such distortions are directly linked to the accumulation of residual stresses generated during the processes. As a result, this paper aims to study the influence of process parameters such as shape of puller, speed and lubrication used in wire drawing analyzing the accumulation of residual stress after the process. The stress analysis was performed by FEM being used two simulation software: Simufact.formingGP and DeformTM. Through these analyzes, it was found that the shape of how the bar is pulled causes a reduction of up to 100 MPa in residual stresses in the center of the bar, which represents an important factor in the study of the possible causes of the distortion. As well as factors speed and homogeneity of lubrication significantly altered the profile of residual stresses in the bar.

  13. Development of Powder-in-Tube Processed Iron Pnictide Wires and Tapes

    KAUST Repository

    Ma, Yanwei

    2011-06-01

    The development of PIT fabrication process of iron pnictide superconducting wires and tapes has been reviewed. Silver was found to be the best sheath material, since no reaction layer was observed between the silver sheath and the superconducting core. The grain connectivity of iron pnictide wires and tapes has been markedly improved by employing Ag or Pb as dopants. At present, critical current densities in excess of 3750 A /cm 2 (I c = 37.5 A) at 4.2 K have been achieved in Ag-sheathed SrKFeAs wires prepared with the above techniques, which is the highest value obtained in iron-based wires and tapes so far. Moreover, Ag-sheathed Sm-1111 superconducting tapes were successfully prepared by PIT method at temperatures as low as ̃ 900 °C, instead of commonly used temperatures of ̃ 1200 °C. These results demonstrate the feasibility of producing superconducting pnictide composite wires, even grain boundary properties require much more attention. © 2010 IEEE.

  14. Wire rod coating process of gas diffusion layers fabrication for proton exchange membrane fuel cells

    Energy Technology Data Exchange (ETDEWEB)

    Kannan, A.M.; Sadananda, S.; Parker, D.; Munukutla, L. [Electronic Systems Department, Arizona State University, 7001 E Williams Field Road, Mesa, AZ 85212 (United States); Wertz, J. [Hollingsworth and Vose Co., A.K. Nicholson Research Lab, 219 Townsend Road West Groton, MA 01472 (United States); Thommes, M. [Quantachrome Instruments, 1900 Corporate Drive, Boynton Beach, FL 33426 (United States)

    2008-03-15

    Gas diffusion layers (GDLs) were fabricated using non-woven carbon paper as a macro-porous layer substrate developed by Hollingsworth and Vose Company. A commercially viable coating process was developed using wire rod for coating micro-porous layer by a single pass. The thickness as well as carbon loading in the micro-porous layer was controlled by selecting appropriate wire thickness of the wire rod. Slurry compositions with solid loading as high as 10 wt.% using nano-chain and nano-fiber type carbons were developed using dispersion agents to provide cohesive and homogenous micro-porous layer without any mud-cracking. The surface morphology, wetting characteristics and pore size distribution of the wire rod coated GDLs were examined using FESEM, Goniometer and Hg porosimetry, respectively. The GDLs were evaluated in single cell PEMFC under various operating conditions (temperature and RH) using hydrogen and air as reactants. It was observed that the wire rod coated micro-porous layer with 10 wt.% nano-fibrous carbon based GDLs showed the highest fuel cell performance at 85 C using H{sub 2} and air at 50% RH, compared to all other compositions. (author)

  15. Composite superconducting MgB2 wires made by continuous process

    NARCIS (Netherlands)

    Kutukcu, Mehmet; Atamert, Serdar; Scandella, Jean Louis; Hopstock, Ron; Blackwood, Alexander C.; Dhulst, Chris; Mestdagh, Jan; Nijhuis, Arend; Glowacki, Bartek A.

    Previously developed manufacturing technology of a low-cost composite single core MgB2 superconductive wires has been investigated in details using monel sheath and titanium diffusion barrier. In this process Mg and nano-sized B as well as SiC dopant powders were fed continuously to a "U" shaped

  16. Composite superconducting MgB2 wires made by continuous process

    NARCIS (Netherlands)

    Kutukcu, Mehmet; Atamert, Serdar; Scandella, Jean Louis; Hopstock, Ron; Blackwood, Alexander C.; Dhulst, Chris; Mestdagh, Jan; Nijhuis, Arend; Glowacki, Bartek A.

    2018-01-01

    Previously developed manufacturing technology of a low-cost composite single core MgB2 superconductive wires has been investigated in details using monel sheath and titanium diffusion barrier. In this process Mg and nano-sized B as well as SiC dopant powders were fed continuously to a "U" shaped

  17. Modeling the wire-EDM process parameters for EN-8 carbon steel ...

    African Journals Online (AJOL)

    Modeling the wire-EDM process parameters for EN-8 carbon steel using .... The neural networks has been developed with the help of MATLAB 8.1 (R13) package .... Now, Simulation and Prediction will be performed using the trained network.

  18. Real-time monitoring of the laser hot-wire welding process

    Science.gov (United States)

    Liu, Wei; Liu, Shuang; Ma, Junjie; Kovacevic, Radovan

    2014-04-01

    The laser hot-wire welding process was investigated in this work. The dynamics of the molten pool during welding was visualized by using a high-speed charge-coupled device (CCD) camera assisted by a green laser as an illumination source. It was found that the molten pool is formed by the irradiation of the laser beam on the filler wire. The effect of the hot-wire voltage on the stability of the welding process was monitored by using a spectrometer that captured the emission spectrum of the laser-induced plasma plume. The spectroscopic study showed that when the hot-wire voltage is above 9 V a great deal of spatters occur, resulting in the instability of the plasma plume and the welding process. The effect of spatters on the plasma plume was shown by the identified spectral lines of the element Mn I. The correlation between the Fe I electron temperature and the weld-bead shape was studied. It was noted that the electron temperature of the plasma plume can be used to real-time monitor the variation of the weld-bead features and the formation of the weld defects.

  19. Investigation about the Chrome Steel Wire Arc Spray Process and the Resulting Coating Properties

    Science.gov (United States)

    Wilden, J.; Bergmann, J. P.; Jahn, S.; Knapp, S.; van Rodijnen, F.; Fischer, G.

    2007-12-01

    Nowadays, wire-arc spraying of chromium steel has gained an important market share for corrosion and wear protection applications. However, detailed studies are the basis for further process optimization. In order to optimize the process parameters and to evaluate the effects of the spray parameters DoE-based experiments had been carried out with high-speed camera shoots. In this article, the effects of spray current, voltage, and atomizing gas pressure on the particle jet properties, mean particle velocity and mean particle temperature and plume width on X46Cr13 wire are presented using an online process monitoring device. Moreover, the properties of the coatings concerning the morphology, composition and phase formation were subject of the investigations using SEM, EDX, and XRD-analysis. These deep investigations allow a defined verification of the influence of process parameters on spray plume and coating properties and are the basis for further process optimization.

  20. Comparison of optimization techniques for MRR and surface roughness in wire EDM process for gear cutting

    Directory of Open Access Journals (Sweden)

    K.D. Mohapatra

    2016-11-01

    Full Text Available The objective of the present work is to use a suitable method that can optimize the process parameters like pulse on time (TON, pulse off time (TOFF, wire feed rate (WF, wire tension (WT and servo voltage (SV to attain the maximum value of MRR and minimum value of surface roughness during the production of a fine pitch spur gear made of copper. The spur gear has a pressure angle of 20⁰ and pitch circle diameter of 70 mm. The wire has a diameter of 0.25 mm and is made of brass. Experiments were conducted according to Taguchi’s orthogonal array concept with five factors and two levels. Thus, Taguchi quality loss design technique is used to optimize the output responses carried out from the experiments. Another optimization technique i.e. desirability with grey Taguchi technique has been used to optimize the process parameters. Both the optimized results are compared to find out the best combination of MRR and surface roughness. A confirmation test was carried out to identify the significant improvement in the machining performance in case of Taguchi quality loss. Finally, it was concluded that desirability with grey Taguchi technique produced a better result than the Taguchi quality loss technique in case of MRR and Taguchi quality loss gives a better result in case of surface roughness. The quality of the wire after the cutting operation has been presented in the scanning electron microscopy (SEM figure.

  1. The wire rod superficial processing and the quality and environmental criterion

    OpenAIRE

    T. Karkoszka; D. Szewieczek

    2008-01-01

    Purpose: Purpose of the presented paper is meant to enlight the common points between the application ofpractically well-matched methods of investigation and opinion of quality and usage of the modern technical,technological or organizational solutions, in this issue in the technological processes of preparation the wire rodsurface to the plastic processing.Design/methodology/approach: Applied for the survey has comprised the adequate integrated expert methodsof technological processes’ analy...

  2. THE USE OF EXCHANGEABLE BONDS DURING THE PRIVATIZATION PROCESS

    Directory of Open Access Journals (Sweden)

    Damian Kaźmierczak

    2014-04-01

    Full Text Available In our article we present the use of hybrid securities in the privatization process. We show that exchangeable bonds may be successfully applied during privatization of state companies throughout the world. It may be profitable for many reasons. Firstly, the exchangeables offer a much lower coupon in comparison with the ordinary government bonds which may be crucial for highly indebted countries. Secondly, throughout the entire maturity period the state remains the owner of the privatized firm which means that the government can be a beneficiary of high dividends paid by the public enterprises and can actively manage them. Thirdly, in the case of unfavorable market conditions the authorities get an opportunity to wait for the end of economic turmoil in order to avoid selling the equity participations under their true value. Finally, the issue of certain types of exchangeables (e.g. callable exchangeables or mandatory exchangeables and adding several provisions (e.g. greenshoe option or clean-up call makes the instrument more flexible for the issuer. We also present a few examples of the privatization processes by means of exchangeable bonds i.a. in Germany and in Austria. Most of such operations, e.g. German Deutsche Post, Austrian Telekom Austria or Portuguese Galp Energia SGPS S.A. were completed with success.

  3. Simulation of Bimetallic Bush Hot Rolling Bonding Process

    Directory of Open Access Journals (Sweden)

    Yaqin Tian

    2015-01-01

    Full Text Available Three-dimensional model of bimetallic bush was established including the drive roller and the core roller. The model adopted the appropriate interface assumptions. Based on the bonding properties of bimetallic bush the hot rolling process was analyzed. The optimum reduction ratio of 28% is obtained by using the finite element simulation software MARC on the assumption of the bonding conditions. The stress-strain distribution of three dimensions was research assumptions to interface deformation of rolling. At the same time, based on the numerical simulation, the minimum reduction ratio 20% is obtained by using a double metal composite bush rolling new technology from the experiment research. The simulation error is not more than 8%.

  4. Arc Interference Behavior during Twin Wire Gas Metal Arc Welding Process

    Directory of Open Access Journals (Sweden)

    Dingjian Ye

    2013-01-01

    Full Text Available In order to study arc interference behavior during twin wire gas metal arc welding process, the synchronous acquisition system has been established to acquire instantaneous information of arc profile including dynamic arc length variation as well as relative voltage and current signals. The results show that after trailing arc (T-arc is added to the middle arc (M-arc in a stable welding process, the current of M arc remains unchanged while the agitation increases; the voltage of M arc has an obvious increase; the shape of M arc changes, with increasing width, length, and area; the transfer frequency of M arc droplet increases and the droplet itself becomes smaller. The wire extension length of twin arc turns out to be shorter than that of single arc welding.

  5. Effect of machining fluid on the process performance of wire electrical discharge machining of nanocomposite ceramic

    Directory of Open Access Journals (Sweden)

    Zhang Chengmao

    2015-01-01

    Full Text Available Wire electric discharge machining (WEDM promise to be effective and economical techniques for the production of tools and parts from conducting ceramic blanks. However, the manufacturing of nanocomposite ceramics blanks with these processes is a long and costly process. This paper presents a new process of machining nanocomposite ceramics using WEDM. WEDM uses water based emulsion, polyvinyl alcohol and distilled water as the machining fluid. Machining fluid is a primary factor that affects the material removal rate and surface quality of WEDM. The effects of emulsion concentration, polyvinyl alcohol concentration and distilled water of the machining fluid on the process performance have been investigated.

  6. Ways of improvement of technological process of copper wire rod production

    OpenAIRE

    Dvoryanyn, Hrystyna; Shvachco, Sergiy

    2015-01-01

    Copper is a unique chemical element which is used since ancient times due to its universal chemical properties. By means of the method of continuous founding, hundreds of items of rod-like billets of different cross-section shapes are manufactured from copper. The problem of production of defectfree copper wire rods is important nowadays, because the market of cable products still increases. As the deposits of cooper ore in the nature are being exhausted, the processing of copper scrap become...

  7. An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

    DEFF Research Database (Denmark)

    Wu, Rui; Iannuzzo, Francesco; Wang, Huai

    2014-01-01

    Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation...... approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT...

  8. Optimisation of wire-cut EDM process parameter by Grey-based response surface methodology

    Science.gov (United States)

    Kumar, Amit; Soota, Tarun; Kumar, Jitendra

    2018-03-01

    Wire electric discharge machining (WEDM) is one of the advanced machining processes. Response surface methodology coupled with Grey relation analysis method has been proposed and used to optimise the machining parameters of WEDM. A face centred cubic design is used for conducting experiments on high speed steel (HSS) M2 grade workpiece material. The regression model of significant factors such as pulse-on time, pulse-off time, peak current, and wire feed is considered for optimising the responses variables material removal rate (MRR), surface roughness and Kerf width. The optimal condition of the machining parameter was obtained using the Grey relation grade. ANOVA is applied to determine significance of the input parameters for optimising the Grey relation grade.

  9. Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

    Science.gov (United States)

    Huang, Y.; Kim, H. J.; McCracken, M.; Viswanathan, G.; Pon, F.; Mayer, M.; Zhou, Y. N.

    2011-06-01

    A 0.3- μm-thick electrolytic Pd layer was plated on 1 μm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values ( R a) of 0.08 μm and 0.5 μm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 800 h at 250°C by measuring the ball bond contact resistance, R c. The average value of R c of optimized ball bonds on the rough substrate was 1.96 mΩ which was about 40.0% higher than that on the smooth substrate. The initial bondability increased for the rougher surface, so that only half of the original ultrasonic level was required, but the reliability was not affected by surface roughness. For both substrate types, HTST caused bond healing, reducing the average R c by about 21% and 27%, respectively. Au diffusion into the Pd layer was observed in scanning transmission electron microscopy/ energy dispersive spectroscopy (STEM-EDS) line-scan analysis after HTST. It is considered that diffusion of Au or interdiffusion between Au and Pd can provide chemically strong bonding during HTST. This is supported by the R c decrease measured as the aging time increased. Cu migration was indicated in the STEM-EDS analysis, but its effect on reliability can be ignored. Au and Pd tend to form a complete solid solution at the interface and can provide reliable interconnection for high temperature (250°C) applications.

  10. Investigation of the degradation mechanism of catalytic wires during oxidation of ammonia process

    International Nuclear Information System (INIS)

    Pura, Jarosław; Wieciński, Piotr; Kwaśniak, Piotr; Zwolińska, Marta; Garbacz, Halina; Zdunek, Joanna; Laskowski, Zbigniew; Gierej, Maciej

    2016-01-01

    Highlights: • Degradation mechanisms of precious metal catalytic gauzes is proposed. • Significant change of gauzes morphology and chemical composition was observed. • Samples were analyzed using SEM, EDS and micro-XCT techniques. - Abstract: The most common catalysts for the ammonia oxidation process are 80 μm diameter platinum-rhodium wires knitted or woven into the form of a gauze. In an aggressive environment and under extreme conditions (temperature 800–900 °C, intensive gas flow, high pressure) precious elements are drained from the surface of the wires. Part of this separated material quickly decomposes on the surface in the form of characteristic “cauliflower-shape protrusions”. The rest of the platinum is captured by palladium-nickel catalytic-capture gauzes located beneath. In our investigation we focused on the effects of the degradation of gauzes from one industrial catalytic system. The aim of the study was to compare the degree and the mechanism of degradation of gauzes from a different part of the reactor. The study covered PtRh7 catalytic and PdNi5 catalytic-capture gauzes. X-ray computer microtomography investigation revealed that despite strong differences in morphology, each Pt-Rh wire has a similar specific surface area. This indicates that the oxidation process and morphological changes of the wires occur in a self-regulating balance, resulting in the value of the specific surface area of the catalyst. Microtomography analysis of Pd-Ni wires revealed strong redevelopment of the wires’ surface, which is related to the platinum capture phenomenon. Scanning electron microscope observations also revealed the nanostructure in the cauliflower-shape protrusions and large grains in the wires’ preserved cores. The high temperature in the reactor and the long-term nature of the process do not favor the occurrence of the nanostructure in this type of material. Further and detailed analysis of this phenomena will provide a better

  11. Investigation of the degradation mechanism of catalytic wires during oxidation of ammonia process

    Energy Technology Data Exchange (ETDEWEB)

    Pura, Jarosław, E-mail: jaroslawpura@gmail.com [Faculty of Material Science and Engineering, Warsaw University of Technology, Wołoska 141, 02-507 Warsaw (Poland); Wieciński, Piotr; Kwaśniak, Piotr; Zwolińska, Marta; Garbacz, Halina; Zdunek, Joanna [Faculty of Material Science and Engineering, Warsaw University of Technology, Wołoska 141, 02-507 Warsaw (Poland); Laskowski, Zbigniew; Gierej, Maciej [Precious Metal Mint, Weteranów 95, 05-250 Radzymin (Poland)

    2016-12-01

    Highlights: • Degradation mechanisms of precious metal catalytic gauzes is proposed. • Significant change of gauzes morphology and chemical composition was observed. • Samples were analyzed using SEM, EDS and micro-XCT techniques. - Abstract: The most common catalysts for the ammonia oxidation process are 80 μm diameter platinum-rhodium wires knitted or woven into the form of a gauze. In an aggressive environment and under extreme conditions (temperature 800–900 °C, intensive gas flow, high pressure) precious elements are drained from the surface of the wires. Part of this separated material quickly decomposes on the surface in the form of characteristic “cauliflower-shape protrusions”. The rest of the platinum is captured by palladium-nickel catalytic-capture gauzes located beneath. In our investigation we focused on the effects of the degradation of gauzes from one industrial catalytic system. The aim of the study was to compare the degree and the mechanism of degradation of gauzes from a different part of the reactor. The study covered PtRh7 catalytic and PdNi5 catalytic-capture gauzes. X-ray computer microtomography investigation revealed that despite strong differences in morphology, each Pt-Rh wire has a similar specific surface area. This indicates that the oxidation process and morphological changes of the wires occur in a self-regulating balance, resulting in the value of the specific surface area of the catalyst. Microtomography analysis of Pd-Ni wires revealed strong redevelopment of the wires’ surface, which is related to the platinum capture phenomenon. Scanning electron microscope observations also revealed the nanostructure in the cauliflower-shape protrusions and large grains in the wires’ preserved cores. The high temperature in the reactor and the long-term nature of the process do not favor the occurrence of the nanostructure in this type of material. Further and detailed analysis of this phenomena will provide a better

  12. Effect on deformation process of adding a copper core to multifilament MgB2 superconducting wire

    DEFF Research Database (Denmark)

    Hancock, Michael Halloway; Bay, Niels

    2007-01-01

    Using the PIT method, multifilament wire with different packing strategies has been manufactured. In all, three types of wire have been investigated, a 19-filament configuration using ex-situ powder in an Fe-matrix and two 8-filament configurations in an Fe-matrix applying a copper core, one using....... This finding is supported by numerical simulations of the deformation process which indicate that tensile stresses are. concentrated around the middle of the wire during the drawing process. As such, strategic packing of the multifilament configuration can reduce the need for annealing during the mechanical...

  13. Fuel Pellets from Biomass. Processing, Bonding, Raw Materials

    DEFF Research Database (Denmark)

    Stelte, Wolfgang

    in an increasing interest in biomass densification technologies, such as pelletization and briquetting. The global pellet market has developed quickly, and strong growth is to be expected for the coming years. Due to an increasing demand for biomass, the traditionally used wood residues from sawmills and pulp...... influence of the different processing parameters on the pressure built up in the press channel of a pellet mill. It showed that the major factor was the press channel length as well as temperature, moisture content, particle size and extractive content. Furthermore, extractive migration to the pellet...... surface at an elevated temperature played an important role. The second study presented a method of how key processing parameters can be estimated, based on a pellet model and a small number of fast and simple laboratory trials using a single pellet press. The third study investigated the bonding...

  14. Influence of the Manufacturing Process on Defects in the Galvanized Coating of High Carbon Steel Wires.

    Science.gov (United States)

    Gelfi, Marcello; Solazzi, Luigi; Poli, Sandro

    2017-03-06

    This study is a detailed failure analysis of galvanized high carbon steel wires, which developed coating cracks during the torsion test performed as a quality control at the end of the manufacturing process. Careful visual inspections showed that the cracks are already present in the coating before the torsion test. In order to explain the origin of these cracks, systematic metallographic investigations were performed by means of optical and scanning electron microscope on both the wires and the rods that have been cold drawn to produce the wire. The chemical composition of the galvanized coatings was evaluated by means of energy dispersive spectroscopy. Micro bidimensional X-ray diffraction experiments were also performed to measure the residual stresses in the galvanized coating. The results showed that the failure is related to two main factors: the relatively high content of silicon in the steel and the unsuitable cooling rate of the rods at the exit from the galvanizing bath. The mechanism proposed to explain the origin of the defects was supported by Finite Elements Methods simulations and verified with in-plant tests. The proper countermeasures were then applied and the problem successfully solved.

  15. Influence of the Manufacturing Process on Defects in the Galvanized Coating of High Carbon Steel Wires

    Directory of Open Access Journals (Sweden)

    Marcello Gelfi

    2017-03-01

    Full Text Available This study is a detailed failure analysis of galvanized high carbon steel wires, which developed coating cracks during the torsion test performed as a quality control at the end of the manufacturing process. Careful visual inspections showed that the cracks are already present in the coating before the torsion test. In order to explain the origin of these cracks, systematic metallographic investigations were performed by means of optical and scanning electron microscope on both the wires and the rods that have been cold drawn to produce the wire. The chemical composition of the galvanized coatings was evaluated by means of energy dispersive spectroscopy. Micro bidimensional X-ray diffraction experiments were also performed to measure the residual stresses in the galvanized coating. The results showed that the failure is related to two main factors: the relatively high content of silicon in the steel and the unsuitable cooling rate of the rods at the exit from the galvanizing bath. The mechanism proposed to explain the origin of the defects was supported by Finite Elements Methods simulations and verified with in-plant tests. The proper countermeasures were then applied and the problem successfully solved.

  16. Fuel pellets from biomass - Processing, bonding, raw materials

    Energy Technology Data Exchange (ETDEWEB)

    Stelte, W.

    2011-12-15

    The present study investigates several important aspects of biomass pelletization. Seven individual studies have been conducted and linked together, in order to push forward the research frontier of biomass pelletization processes. The first study was to investigate influence of the different processing parameters on the pressure built up in the press channel of a pellet mill. It showed that the major factor was the press channel length as well as temperature, moisture content, particle size and extractive content. Furthermore, extractive migration to the pellet surface at an elevated temperature played an important role. The second study presented a method of how key processing parameters can be estimated, based on a pellet model and a small number of fast and simple laboratory trials using a single pellet press. The third study investigated the bonding mechanisms within a biomass pellet, which indicate that different mechanisms are involved depending on biomass type and pelletizing conditions. Interpenetration of polymer chains and close intermolecular distance resulting in better secondary bonding were assumed to be the key factors for high mechanical properties of the formed pellets. The outcome of this study resulted in study four and five investigating the role of lignin glass transition for biomass pelletization. It was demonstrated that the softening temperature of lignin was dependent on species and moisture content. In typical processing conditions and at 8% (wt) moisture content, transitions were identified to be at approximately 53-63 deg. C for wheat straw and about 91 deg. C for spruce lignin. Furthermore, the effects of wheat straw extractives on the pelletizing properties and pellet stability were investigated. The sixth and seventh study applied the developed methodology to test the pelletizing properties of thermally pre-treated (torrefied) biomass from spruce and wheat straw. The results indicated that high torrefaction temperatures above 275 deg

  17. 77 FR 10621 - Changes to the In-Bond Process

    Science.gov (United States)

    2012-02-22

    ... submit in-bond applications electronically using a CBP-approved electronic data interchange (EDI) system... electronically submit the in-bond application to CBP via a CBP-approved EDI system. \\6\\ Due to the unique... as the CBP-approved EDI system for submitting the in-bond application and other information that is...

  18. Search for a metallic dangling-bond wire on n-doped H-passivated semiconductor surfaces

    DEFF Research Database (Denmark)

    Engelund, Mads; Papior, Nick Rübner; Brandimarte, Pedro

    2016-01-01

    We have theoretically investigated the electronic properties of neutral and n-doped dangling bond (DB) quasi-one-dimensional structures (lines) in the Si(001):H and Ge(001):H substrates with the aim of identifying atomic-scale interconnects exhibiting metallic conduction for use in on-surface cir...

  19. Mechanical Properties of Additive Manufactured Ti-6Al-4V Using Wire and Powder Based Processes

    International Nuclear Information System (INIS)

    Brandl, Erhard; Palm, Frank; Leyens, Christoph

    2011-01-01

    Since 1986 several techniques of building up geometries layer by layer have been developed and successfully commercialized under numerous trade names. Today, not only prototypes are realized by these techniques, but serial production parts are envisaged. To achieve this progress, the development activities have to focus on the reliability and output material quality. Particularly for aerospace applications, the material quality is an all-dominant factor. In this paper, an electron beam based powder-bed process and a laser based wire-feed process are investigated. Microstructure, chemical composition, static tensile and high cycle fatigue properties of Ti-6Al-4V samples are presented and evaluated from an aerospace application point of view. The static tensile properties resulting from both processes are mostly comparable to properties of cast or wrought material depending on post heat treatment and test direction. Fatigue limits of all samples are similar to those of wrought material. The impurity levels of oxygen, nitrogen, carbon and hydrogen are below the maximum level of plate material (AMS 4911L). The wire-feed process leads to a material with fewer impurities than the powder-bed process.

  20. Studies of the remagnetization process in cold drawn Fe-rich thin amorphous wires

    International Nuclear Information System (INIS)

    Gawronski, P.; Zhukov, A.P.; Blanco, J.M.; Gonzalez, J.; Zhukova, V.; Kulakowski, K.

    2007-01-01

    Results on local hysteresis loops for Fe-rich amorphous cold-drawn wires with the sample lengths of 30 mm and 70 mm under applied stress, σ, up to 1300 MPa are reported. For both lengths, the magnetization, M, increases with σ and the coercive field, H C , decreases. Near the wire end, M results to be larger than at the wire center, and H C sharply decreases. This reduction is eliminated if the applied stress is large enough. It is assumed, that the magnetic configuration at the wire end for the cold-drawn wires is different from the other wires families

  1. Influence of a cold deformation process by drawing on the electrical properties of copper wires

    Directory of Open Access Journals (Sweden)

    Rafael da Silva Bernardo

    Full Text Available Abstract This article presents a study of the drawing, deformation, hardening and heat treatment of copper wire, in order to investigate the influence of combinations of operating variables (annealing factor, oil emulsion temperature and machine speed during the drawing process on the electrical conductivity of copper wires. The results showed that when the metal is deformed, the value of electrical conductivity suffers a decrease due to the hardening phenomenon. Because of this, it is necessary to heat treat the material. So, it was observed that the annealing factor, which is associated with the thermal treatment temperature, showed a high degree of correlation with the electrical conductivity. This fact is explained by the annealing factor which is responsible for the intensity of the heat treatment. The speed at which the drawing occurs also showed a direct correlation with electric conductivity because the higher the value, the greater the heat treatment temperature and consequently, the greater the electrical conductivity of the material. On the other hand, it had not been possible to establish a conclusion about the correlation between the electrical conductivity and oil emulsion temperature during the drawing process.

  2. A jelly-roll process for high temperature superconducting tapes and wires

    International Nuclear Information System (INIS)

    Tsuei, C.C.; Chi, C.C.; Frey, T.; Mitzi, D.B.; Kazyaka, T.; Haugan, T.; Ye, J.; Patel, S.; Shaw, D.T.; Wu, M.K.

    1992-01-01

    As an alternative to the powder-in-tube method, a new technique called the jelly-roll process is proposed for making high-T c superconducting tapes and wires. A normal-metal sheet coated with high-T c cuprate is configured in a jelly-roll fashion and cold worked into tapes or wires made of alternating cuprate superconductor and normal metal layers. The feasibility of this new process is demonstrated for both the YBa 2 Cu 3 O 7 /Ag and Bi 2 Sr 2 CaCu 2 O 8 /Ag composite systems. The role of reduction in the cross-sectional area by cold-rolling, heat treatment and oxygenation in optimizing T c and J c has been studied. Preliminary results indicate that partialmelt texturing, in the Bi 2 Sr 2 CaCu 2 O 8 /Ag system, results in a relatively field independent J c (H c (H = 0) ∝5 X 10 4 A cm -2 at 4.2 K

  3. A jelly-roll process for high temperature superconducting tapes and wires

    Energy Technology Data Exchange (ETDEWEB)

    Tsuei, C C; Chi, C C; Frey, T; Mitzi, D B; Kazyaka, T [IBM Thomas J. Watson Research Center, Yorktown Heights, NY (United States); Haugan, T; Ye, J; Patel, S; Shaw, D T [New York State Inst. on Superconductivity, SUNY, Buffalo, Amherst, NY (United States); Wu, M K [Dept. of Physics, National Tsing Hua Univ., Hsinchu (Taiwan)

    1992-07-01

    As an alternative to the powder-in-tube method, a new technique called the jelly-roll process is proposed for making high-T[sub c] superconducting tapes and wires. A normal-metal sheet coated with high-T[sub c] cuprate is configured in a jelly-roll fashion and cold worked into tapes or wires made of alternating cuprate superconductor and normal metal layers. The feasibility of this new process is demonstrated for both the YBa[sub 2]Cu[sub 3]O[sub 7]/Ag and Bi[sub 2]Sr[sub 2]CaCu[sub 2]O[sub 8]/Ag composite systems. The role of reduction in the cross-sectional area by cold-rolling, heat treatment and oxygenation in optimizing T[sub c] and J[sub c] has been studied. Preliminary results indicate that partialmelt texturing, in the Bi[sub 2]Sr[sub 2]CaCu[sub 2]O[sub 8]/Ag system, results in a relatively field independent J[sub c] (H< or approx.7T) with J[sub c](H = 0) [proportional to]5 X 10[sup 4] A cm[sup -2] at 4.2 K.

  4. Influence of particle size of Mg powder on the microstructure and critical currents of in situ powder-in-tube processed MgB_2 wires

    International Nuclear Information System (INIS)

    Kumakura, Hiroaki; Ye, Shujun; Matsumoto, Akiyoshi; Nitta, Ryuji

    2016-01-01

    We fabricated in situ powder-in-tube(PIT) MgB_2 wires using three kinds of Mg powders with particle size of ∼45 μm, ∼150 μm and 212∼600 μm. Mg particles were elongated to filamentary structure in the wires during cold drawing process. Especially, long Mg filamentary structure was obtained for large Mg particle size of 212∼600 μm. Critical current density, J_c, increased with increasing Mg particle size for 1 mm diameter wires. This is due to the development of filamentary structure of high density MgB_2 superconducting layer along the wires. This MgB_2 structure is similar to that of the internal Mg diffusion (IMD) processed MgB_2 wires. However, J_c of the wires fabricated with 212∼600 μm Mg particle size decreased and the scattering of J_c increased with decreasing wire diameter, while the J_c of the wires with ∼45 μm Mg particle was almost independent of the wire diameter. The cross sectional area reduction of the Mg particles during the wire drawing is smaller than that of the wire. When using large size Mg particle, the number of Mg filaments in the wire cross section is small. These two facts statistically lead to the larger scattering of Mg areal fraction in the wire cross section with proceeding of wire drawing process, resulting in smaller volume fraction of MgB_2 in the wire and lower J_c with larger scattering along the wire. SiC nano powder addition is effective in increasing J_c for all Mg particle sizes. (author)

  5. Bonding Be to Cu alloys using a proprietary Brush Wellman process and new results for bonding Be to AlBeMet

    Energy Technology Data Exchange (ETDEWEB)

    Dombrowski, D.E. [Brush Wellman Inc., Cleveland, OH (United States)

    1998-01-01

    A novel process has been investigated for bonding of beryllium to copper alloys. The process is compatible with current manufacturing capabilities and can be readily scaled up from laboratory to production scale. The effect of process variations on the bond are shown. Also shown are several new approaches for direct bonding of beryllium to an AlBeMet interlayer. Bond strengths of Be/AlBeMet 162/Cu alloy couples are presented. (author)

  6. Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

    Science.gov (United States)

    Tseng, Yi-Wei; Hung, Fei-Yi; Lui, Truan-Sheng

    2016-01-01

    Traditional bath-plated gold contains a cyanide complex, which is an environmental hazard. In response, our study used a green plating process to produce cyanide-free gold-coated silver (cyanide-free ACA) bonding wire that has been proven to be a feasible alternative to gold bonding wire in semiconductor packaging. In this work, ACA wire annealed at 550°C was found to have stable microstructure and superior mechanical properties. Intermetallic compounds Ag2Al and AuAl2 grew from Ag-Au balls and Al pads after aging at 175°C for 500 h. After current testing, ACA wire was found to have improved electrical properties due to equiaxed grain growth. The gold nanolayer on the Ag surface increased the oxidation resistance. These results provide insights regarding the reliability of ACA wire in advanced bonding processes.

  7. Passivation process for superfine aluminum powders obtained by electrical explosion of wires

    International Nuclear Information System (INIS)

    Kwon, Young-Soon; Gromov, Alexander A.; Ilyin, Alexander P.; Rim, Geun-Hie

    2003-01-01

    The process of passivation of superfine aluminum powders (SFAPs) (a s ≤100 nm), obtained with the electrical explosion of wires (EEW) method, has been studied. The passivation coatings of different nature (oxides, stearic acid and aluminum diboride) were covered on the particle surface. The process of passivation and analysis of passivated powders was studied by X-ray photoelectron spectroscopy (XPS), XRD, TEM, infrared spectroscopy (IR), mass spectrometry (MS), thermocouple method and bomb calorimetry. After the comprehensive testing of coatings, a model of stabilization of the superfine aluminum particles was suggested, explaining the anomalous high content of aluminum metal in the electroexplosive powders. The main characteristic of the model is a formation of charged structures, which prevent metal oxidation

  8. Nonperfect synchronization of bond-forming and bond-rupturing processes in the reaction H + H2 → H2 + H

    International Nuclear Information System (INIS)

    Chandra, A.K.; Rao, V.S.

    1996-01-01

    The simplest prototypical hydrogen transfer reaction, i.e., H + H 2 → H 2 + H, is studied by the quantum-mechanical ab initio methods. Results reveal that during this reaction free valence which almost equals the square of the spin density develops on the migrating hydrogen atom. Bond orders are calculated using Mayer's formalism. Both the variations of bond orders and bond lengths along the reaction path are examined. This analysis reveals that the bond formation and bond cleavage processes in this reaction are not perfectly synchronous. The bond clevage process is slightly more advanced on the reaction path. 38 refs., 6 figs., 2 tabs

  9. Stress/strain characteristics of Cu alloy sheath in situ processed MgB2 superconducting wires

    International Nuclear Information System (INIS)

    Katagiri, Kazumune; Kasaba, Koichi; Shoji, Yoshitaka

    2005-01-01

    The mechanical properties of copper and copper alloy (Cu-Zr, Cu-Be and Cu-Cr) sheath in situ PIT-processed MgB 2 superconducting wires were studied at room temperature (RT) and 4.2 K. The effects of stress-strain on the critical current (I c ) of the wires have also been studied at 4.2 K and in magnetic fields up to 5 T. It has been clarified that alloying the Cu sheath significantly increases the yield and flow stresses of the wires at both RT and 4.2 K. The 0.5% flow stresses of the Cu alloy sheath wire were 147-237 MPa, whereas that of Cu was 55 MPa. At RT, serration corresponding to multiple cracking was observed around a strain of 0.4% and the stress-strain curves saturated beyond that point. The strain dependence of I c prior to the critical strain (ε irr ) was different depending on the magnetic field; being almost constant at 2 T and increasing with strain at 5 T. The I c decreased beyond ε irr , which is much larger for Cu alloy sheath wires as compared to Cu sheath wire. This is due to the difference in the residual compressive strain in the MgB 2 core during cooling from the heat-treatment temperature to 4.2 K, which is determined through relaxation by yielding in the sheath materials. The transverse compression tests revealed that the I c of the Cu alloy sheath wire did not degrade up to 314 MPa, which is also higher than that of Cu sheath wire. (author)

  10. Stress-strain effects in alumina-Cu reinforced Nb3Sn wires fabricated by the tube process

    International Nuclear Information System (INIS)

    Murase, Satoru; Nakayama, Shigeo; Masegi, Tamaki; Koyanagi, Kei; Nomura, Shunji; Shiga, Noriyuki; Kobayashi, Norio; Watanabe, Kazuo.

    1997-01-01

    In order to fabricate a large-bore, high-field magnet which achieves a low coil weight and volume, a high strength compound superconducting wire is required. For those demands we have developed the reinforced Nb 3 Sn wire using alumina dispersion strengthened copper (alumina-Cu) as a reinforcement material and the tube process of the Nb 3 Sn wire fabrication. The ductility study of the composites which consisted of the reinforcement, Nb tube, Cu, and Cu clad Sn brought a 1 km long alumina-Cu reinforced Nb 3 Sn wire successfully. Using fabricated wires measurements and evaluations of critical current density as parameters of magnetic field, tensile stress, tensile strain, and transverse compressive stress, and those of stress-strain curves at 4.2 K were performed. They showed superior performance such as high 0.3% proof stress (240 MPa at 0.3% strain) and high maximum tolerance stress (320 MPa) which were two times as large as those of conventional Cu matrix Nb 3 Sn wire. The strain sensitivity parameters were obtained for the reinforced Nb 3 Sn wire and the Cu matrix one using the scaling law. Residual stress of the component materials caused by cooling down to 4.2 K from heat-treatment temperature was calculated using equivalent Young's modulus, equivalent yield strength, thermal expansion coefficient and other mechanical parameters. Calculated stress-strain curves at 4.2 K for the reinforced Nb 3 Sn wire and the Cu matrix one based on calculation of residual stress, had good agreement with the experimental values. (author)

  11. Tungsten - rhenium alloys wire: overview of thermomechanical processing and properties data

    International Nuclear Information System (INIS)

    Bryskin, B.

    2001-01-01

    The scope of this study encompasses the compositional modifications of the tungsten-rhenium dual system (W-3/5 Re up to W-27 Re) as well as some of the tungsten-molybdenum-rhenium ternary system. The alloys of interest are considered with a specific representation of powder metallurgy route based on doped or undoped tungsten vs. vacuum melted materials. This paper constitutes an in-depth review of structural and mechanical properties and systematic compilation of challenges necessary to provide the quality consistency of severely drawn filaments. The issue of thermomechanical processing trends is addressed as an important part of W-Re fabrication technology to achieve further improvement in design properties of rod and wire. (author)

  12. Multi response optimization of wire-EDM process parameters of ballistic grade aluminium alloy

    Directory of Open Access Journals (Sweden)

    Ravindranadh Bobbili

    2015-12-01

    Full Text Available In the current investigation, a multi response optimization technique based on Taguchi method coupled with Grey relational analysis is planned for wire-EDM operations on ballistic grade aluminium alloy for armour applications. Experiments have been performed with four machining variables: pulse-on time, pulse-off time, peak current and spark voltage. Experimentation has been planned as per Taguchi technique. Three performance characteristics namely material removal rate (MRR, surface roughness (SR and gap current (GC have been chosen for this study. Results showed that pulse-on time, peak current and spark voltage were significant variables to Grey relational grade. Variation of performance measures with process variables was modelled by using response surface method. The confirmation tests have also been performed to validate the results obtained by Grey relational analysis and found that great improvement with 6% error is achieved.

  13. Processing grounded-wire TEM signal in time-frequency-pseudo-seismic domain: A new paradigm

    Science.gov (United States)

    Khan, M. Y.; Xue, G. Q.; Chen, W.; Huasen, Z.

    2017-12-01

    Grounded-wire TEM has received great attention in mineral, hydrocarbon and hydrogeological investigations for the last several years. Conventionally, TEM soundings have been presented as apparent resistivity curves as function of time. With development of sophisticated computational algorithms, it became possible to extract more realistic geoelectric information by applying inversion programs to 1-D & 3-D problems. Here, we analyze grounded-wire TEM data by carrying out analysis in time, frequency and pseudo-seismic domain supported by borehole information. At first, H, K, A & Q type geoelectric models are processed using a proven inversion program (1-D Occam inversion). Second, time-to-frequency transformation is conducted from TEM ρa(t) curves to magneto telluric MT ρa(f) curves for the same models based on all-time apparent resistivity curves. Third, 1-D Bostick's algorithm was applied to the transformed resistivity. Finally, EM diffusion field is transformed into propagating wave field obeying the standard wave equation using wavelet transformation technique and constructed pseudo-seismic section. The transformed seismic-like wave indicates that some reflection and refraction phenomena appear when the EM wave field interacts with geoelectric interface at different depth intervals due to contrast in resistivity. The resolution of the transformed TEM data is significantly improved in comparison to apparent resistivity plots. A case study illustrates the successful hydrogeophysical application of proposed approach in recovering water-filled mined-out area in a coal field located in Ye county, Henan province, China. The results support the introduction of pseudo-seismic imaging technology in short-offset version of TEM which can also be an useful aid if integrated with seismic reflection technique to explore possibilities for high resolution EM imaging in future.

  14. Research on the drawing process with a large total deformation wires of AZ31 alloy

    International Nuclear Information System (INIS)

    Bajor, T; Muskalski, Z; Suliga, M

    2010-01-01

    Magnesium and their alloys have been extensively studied in recent years, not only because of their potential applications as light-weight engineering materials, but also owing to their biodegradability. Due to their hexagonal close-packed crystallographic structure, cold plastic processing of magnesium alloys is difficult. The preliminary researches carried out by the authors have indicated that the application of the KOBO method, based on the effect of cyclic strain path change, for the deformation of magnesium alloys, provides the possibility of obtaining a fine-grained structure material to be used for further cold plastic processing with large total deformation. The main purpose of this work is to present research findings concerning a detailed analysis of mechanical properties and changes occurring in the structure of AZ31 alloy wire during the multistage cold drawing process. The appropriate selection of drawing parameters and the application of multistep heat treatment operations enable the deformation of the AZ31 alloy in the cold drawing process with a total draft of about 90%.

  15. Modeling of electric and heat processes in spot resistance welding of cross-wire steel bars

    Science.gov (United States)

    Iatcheva, Ilona; Darzhanova, Denitsa; Manilova, Marina

    2018-03-01

    The aim of this work is the modeling of coupled electric and heat processes in a system for spot resistance welding of cross-wire reinforced steel bars. The real system geometry, dependences of material properties on the temperature, and changes of contact resistance and released power during the welding process have been taken into account in the study. The 3D analysis of the coupled AC electric and transient thermal field distributions is carried out using the finite element method. The novel feature is that the processes are modeled for several successive time stages, corresponding to the change of contact area, related contact resistance, and reduction of the released power, occurring simultaneously with the creation of contact between the workpieces. The values of contact resistance and power changes have been determined on the basis of preliminary experimental and theoretical investigations. The obtained results present the electric and temperature field distributions in the system. Special attention has been paid to the temperature evolution at specified observation points and lines in the contact area. The obtained information could be useful for clarification of the complicated nature of interrelated electric, thermal, mechanical, and physicochemical welding processes. Adequate modeling is also an opportunity for proper control and improvement of the system.

  16. Process for protecting bonded components from plating shorts

    Science.gov (United States)

    Tarte, Lisa A.; Bonde, Wayne L.; Carey, Paul G.; Contolini, Robert J.; McCarthy, Anthony M.

    2000-01-01

    A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

  17. submitter Comparison of microstructure, second phases and texture formation during melt processing of Bi-2212 mono- and multifilament wires

    CERN Document Server

    Kadar, J; Rikel, MO; Di Michiel, M; Huang, Y

    2016-01-01

    Based on simultaneous in situ high energy synchrotron micro-tomography and x-ray diffraction (XRD) measurements we compare the microstructural changes and the formation of second phases and texture during the processing of Bi-2212 round wires with 15 μm filament diameter (multifilament) and 650 μm filament diameter (monofilament) fabricated using identical Bi-2212 precursor. The monofilament tomograms show in unprecedented detail how the distributed porosity agglomerates well before Bi-2212 melting decomposition to form lenticular voids that completely interrupt the filament connectivity along the wire axis. When the Bi-2212 phase completely melts connectivity in the axial wire direction is established via the changes in the void morphology from the lenticular voids to bubbles that remain when Bi-2212 crystallises out of the melt. By measuring the attenuation of the monochromatic x-ray beam, the associated Bi-2212 mass density changes have been monitored during the entire heat cycle. The XRD results reveal ...

  18. Influence of the oxygen partial pressure on the phase evolution during Bi-2212 wire melt processing

    CERN Document Server

    Scheuerlein, C.; Rikel, M.O.; Kadar, J.; Doerrer, C.; Di Michiel, M.; Ballarino, A.; Bottura, L.; Jiang, J.; Kametani, F.; Hellstrom, E.E.; Larbalestier, D.C.

    2016-01-01

    We have studied the influence of the oxygen partial pressure pO2 up to 5.5 bar on the phase changes that occur during melt processing of a state-of-the-art Bi-2212 multifilamentary wire. Phase changes have been monitored in situ by high energy synchrotron X-ray diffraction (XRD). We found that the stability of Bi-2212 phase is reduced with increasing pO2. For pO2>1 bar a significant amount of Bi-2212 phase decomposes upon heating in the range 400 to 650 °C. The extent of decomposition strongly increases with increasing pO2, and at pO2=5.5 bar Bi-2212 decomposes completely in the solid state. Textured Bi-2212 can be formed during solidification when pO2 is reduced to 0.45 bar when the precursor is molten. Since the formation of current limiting second phases is very sensitive to pO2 when it exceeds 1 bar, we recommend to reduce the oxygen partial pressure below the commonly used pO2=1 bar, in order to increase the pO2 margins and to make the overpressure process more robust.

  19. Development of Statistical Process Control Methodology for an Environmentally Compliant Surface Cleaning Process in a Bonding Laboratory

    Science.gov (United States)

    Hutchens, Dale E.; Doan, Patrick A.; Boothe, Richard E.

    1997-01-01

    Bonding labs at both MSFC and the northern Utah production plant prepare bond test specimens which simulate or witness the production of NASA's Reusable Solid Rocket Motor (RSRM). The current process for preparing the bonding surfaces employs 1,1,1-trichloroethane vapor degreasing, which simulates the current RSRM process. Government regulations (e.g., the 1990 Amendments to the Clean Air Act) have mandated a production phase-out of a number of ozone depleting compounds (ODC) including 1,1,1-trichloroethane. In order to comply with these regulations, the RSRM Program is qualifying a spray-in-air (SIA) precision cleaning process using Brulin 1990, an aqueous blend of surfactants. Accordingly, surface preparation prior to bonding process simulation test specimens must reflect the new production cleaning process. The Bonding Lab Statistical Process Control (SPC) program monitors the progress of the lab and its capabilities, as well as certifies the bonding technicians, by periodically preparing D6AC steel tensile adhesion panels with EA-91 3NA epoxy adhesive using a standardized process. SPC methods are then used to ensure the process is statistically in control, thus producing reliable data for bonding studies, and identify any problems which might develop. Since the specimen cleaning process is being changed, new SPC limits must be established. This report summarizes side-by-side testing of D6AC steel tensile adhesion witness panels and tapered double cantilevered beams (TDCBs) using both the current baseline vapor degreasing process and a lab-scale spray-in-air process. A Proceco 26 inches Typhoon dishwasher cleaned both tensile adhesion witness panels and TDCBs in a process which simulates the new production process. The tests were performed six times during 1995, subsequent statistical analysis of the data established new upper control limits (UCL) and lower control limits (LCL). The data also demonstrated that the new process was equivalent to the vapor

  20. Metallurgical processing and properties of multifilamentary V3Ga composite wires

    International Nuclear Information System (INIS)

    Howe, D.G.; Weinman, L.S.

    1976-01-01

    Multifilamentary composite wires of V - 6.1 at. percent Ga filaments in a Cu-17.5 at. percent Ga matrix were fabricated. High purity V and Ga were arc melted and cast to form an alloy rod. High purity Cu and Ga were induction melted and also cast as an alloy rod. The alloy rods were reduced in diameter by swaging. The larger diameter Cu - Ga matrix rod was drilled with 19 holes which terminated within the matrix-rod. The holes served as receptacles for 19 V-Ga rods which were inserted into the matrix. The composite assembly was evacuated under high vacuum and sealed by an electron beam weld. The composite was then reduced in diameter through swaging and wire drawing to 0.032-in. dia wire. V 3 Ga layers at the filament/matrix interface were formed through an isothermal solid-state reaction. Growth rates for V 3 Ga are strongly influenced by alloy composition and formation temperature, with more rapid growth occurring in composite wires with higher Ga contents. Improved critical current densities (J/sub c/) resulted from lower formation temperatures, J/sub c/ values of over 1 x 10 6 A/cm 2 in a transverse magnetic field of 100 kG were obtained in the multifilamentary composite wire. 9 figs

  1. Design and fabrication of a 30 T superconducting solenoid using overpressure processed Bi2212 round wire

    Energy Technology Data Exchange (ETDEWEB)

    Flanagan, Gene [Muons, Inc., Batavia, IL (United States); Johnson, Rolland [Muons, Inc., Batavia, IL (United States)

    2016-02-18

    High field superconducting magnets are used in particle colliders, fusion energy devices, and spectrometers for medical imaging and advanced materials research. Magnets capable of generating fields of 20-30 T are needed by future accelerator facilities. A 20-30 T magnet will require the use of high-temperature superconductors (HTS) and therefore the challenges of high field HTS magnet development need to be addressed. Superconducting Bi2Sr2CaCu2Ox (Bi2212) conductors fabricated by the oxide-powder-in-tube (OPIT) technique have demonstrated the capability to carry large critical current density of 105 A/cm2 at 4.2 K and in magnetic fields up to 45 T. Available in round wire multi-filamentary form, Bi2212 may allow fabrication of 20-50 T superconducting magnets. Until recently the performance of Bi2212 has been limited by challenges in realizing high current densities (Jc ) in long lengths. This problem now is solved by the National High Magnetic Field Lab using an overpressure (OP) processing technique, which uses external pressure to process the conductor. OP processing also helps remove the ceramic leakage that results when Bi-2212 liquid leaks out from the sheath material and reacts with insulation, coil forms, and flanges. Significant advances have also been achieved in developing novel insulation materials (TiO2 coating) and Ag-Al sheath materials that have higher mechanical strengths than Ag-0.2wt.% Mg, developing heat treatment approaches to broadening the maximum process temperature window, and developing high-strength, mechanical reinforced Bi-2212 cables. In the Phase I work, we leveraged these new opportunities to prototype overpressure processed solenoids and test them in background fields of up to 14 T. Additionally a design of a fully superconducting 30 T solenoid was produced. This work in conjunction with the future path outlined in the Phase II proposal would

  2. Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

    Science.gov (United States)

    Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

    2017-12-01

    An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

  3. Signal Acquisition and Processing in the Magnetic Defectoscopy of Steel Wire Ropes

    Directory of Open Access Journals (Sweden)

    N. S. Jovičić

    2012-11-01

    Full Text Available The system that resolves the problem of wire rope defects using a magnetic method of inspection is presented in this paper. Implementation of the system should provide for full monitoring of wire rope condition, according to the prescribed international standards. The purpose of this system, in addition to identifying defects in the rope, is to determine to what extent damage has been done. The measurement procedure provides for a better understanding of the defects that occur, as well as the rejection criteria of used ropes, that way increasing their security. Hardware and software design of appliance for recording defects and test results are presented in this paper.

  4. Improvements of fabrication processes and enhancement of critical current densities in (Ba,K)Fe2As2 HIP wires and tapes

    Science.gov (United States)

    Pyon, Sunseng; Suwa, Takahiro; Tamegai, Tsuyoshi; Takano, Katsutoshi; Kajitani, Hideki; Koizumi, Norikiyo; Awaji, Satoshi; Zhou, Nan; Shi, Zhixiang

    2018-05-01

    We fabricated (Ba,K)Fe2As2 superconducting wires and tapes using the powder-in-tube method and hot isostatic pressing (HIP). HIP wires and tapes showed a high value of transport critical current density (J c) exceeding 100 kAcm‑2 at T = 4.2 K and the self-field. Transport J c in the HIP wire reached 38 kAcm‑2 in a high magnetic field of 100 kOe. This value is almost twice larger than the previous highest value of J c among round wires using iron-based superconductors. Enhancement of J c in the wires and tapes was caused by improvement of the drawing process, which caused degradation of the core, formation of microcracks, weak links between grains, and random orientation of grains. Details of the effect of the improved fabrication processes on the J c are discussed.

  5. Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

    Science.gov (United States)

    Stamoulis, Konstantinos; Tsau, Christine H.; Spearing, S. Mark

    2005-01-01

    Wafer-level, thermocompression bonding is a promising technique for MEMS packaging. The quality of the bond is critically dependent on the interaction between flatness deviations, the gold film properties and the process parameters and tooling used to achieve the bonds. The effect of flatness deviations on the resulting bond is investigated in the current work. The strain energy release rate associated with the elastic deformation required to overcome wafer bow is calculated. A contact yield criterion is used to examine the pressure and temperature conditions required to flatten surface roughness asperities in order to achieve bonding over the full apparent area. The results are compared to experimental data of bond yield and toughness obtained from four-point bend delamination testing and microscopic observations of the fractured surfaces. Conclusions from the modeling and experiments indicate that wafer bow has negligible effect on determining the variability of bond quality and that the well-bonded area is increased with increasing bonding pressure. The enhanced understanding of the underlying deformation mechanisms allows for a better controlled trade-off between the bonding pressure and temperature.

  6. Brazing and diffusion bonding processes as available repair techniques for gas turbine blades and nozzles

    International Nuclear Information System (INIS)

    Mazur, Z.

    1997-01-01

    The conventionally welding methods are not useful for repair of heavily damaged gas turbine blades and nozzles. It includes thermal fatigue and craze cracks, corrosion, erosion and foreign object damage, which extend to the large areas. Because of required extensive heat input and couponing, it can cause severe distortion of the parts and cracks in the heat affected zone, and can made the repair costs high. For these cases, the available repair methods of gas turbine blades and nozzles, include brazing and diffusion bonding techniques are presented. Detailed analysis of the brazing and diffusion bonding processes applied for gas turbine blades repair with all elements which presented. Detailed analysis of the brazing and diffusion bonding processes applied for gas turbine blades repair with all elements which have influence to get sound joint is carried out. Depend of kind of blades and nozzle damage or deterioration registered a different methods of brazing and diffusion bonding applicability is presented. (Author) 65 refs

  7. Survey of Processing Methods for High Strength High Conductivity Wires for High Field Magnet Applications

    Energy Technology Data Exchange (ETDEWEB)

    Han, K.; Embury, J.D.

    1998-10-01

    This paper will deal with the basic concepts of attaining combination of high strength and high conductivity in pure materials, in-situ composites and macrocomposites. It will survey current attainments, and outline where some future developments may lie in developing wire products that are close to the theoretical strength of future magnet applications.

  8. Survey of Processing Methods for High Strength High Conductivity Wires for High Field Magnet Applications

    International Nuclear Information System (INIS)

    Han, K.; Embury, J.D.

    1998-01-01

    This paper will deal with the basic concepts of attaining combination of high strength and high conductivity in pure materials, in-situ composites and macrocomposites. It will survey current attainments, and outline where some future developments may lie in developing wire products that are close to the theoretical strength of future magnet applications

  9. Conversion of electromagnetic energy in Z-pinch process of single planar wire arrays at 1.5 MA

    International Nuclear Information System (INIS)

    Liangping, Wang; Mo, Li; Juanjuan, Han; Ning, Guo; Jian, Wu; Aici, Qiu

    2014-01-01

    The electromagnetic energy conversion in the Z-pinch process of single planar wire arrays was studied on Qiangguang generator (1.5 MA, 100 ns). Electrical diagnostics were established to monitor the voltage of the cathode-anode gap and the load current for calculating the electromagnetic energy. Lumped-element circuit model of wire arrays was employed to analyze the electromagnetic energy conversion. Inductance as well as resistance of a wire array during the Z-pinch process was also investigated. Experimental data indicate that the electromagnetic energy is mainly converted to magnetic energy and kinetic energy and ohmic heating energy can be neglected before the final stagnation. The kinetic energy can be responsible for the x-ray radiation before the peak power. After the stagnation, the electromagnetic energy coupled by the load continues increasing and the resistance of the load achieves its maximum of 0.6–1.0 Ω in about 10–20 ns

  10. 49 CFR 594.9 - Fee for reimbursement of bond processing costs and costs for processing offers of cash deposits...

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 7 2010-10-01 2010-10-01 false Fee for reimbursement of bond processing costs and costs for processing offers of cash deposits or obligations of the United States in lieu of sureties on... indirect costs the agency incurs for receipt, processing, handling, and disbursement of cash deposits or...

  11. Forming Refractory Insulation On Copper Wire

    Science.gov (United States)

    Setlock, J.; Roberts, G.

    1995-01-01

    Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

  12. IEE wiring regulations explained and illustrated

    CERN Document Server

    Scaddan, Brian

    2013-01-01

    The IEE Wiring Regulations Explained and Illustrated, Second Edition discusses the recommendations of the IEE Regulations for the Electrical Equipment of Buildings for the safe selection or erection of wiring installations. The book emphasizes earthing, bonding, protection, and circuit design of electrical wirings. The text reviews the fundamental requirements for safety, earthing systems, the earth fault loop impedance, and supplementary bonding. The book also describes the different types of protection, such as protection against mechanical damage, overcurrent, under voltage (which prevents

  13. Effect of starting materials and processing variables for the production of discontinuous filament Nb3Sn wire

    International Nuclear Information System (INIS)

    Upadhyay, P.L.; Dew-Hughes, D.

    1986-01-01

    Discontinuous multifilamentary wires of Nb 3 Sn have been prepared from compacted mixtures of 30 wt. %Nb in Cu, extruded, drawn, annealed, tin plated and reacted. Processing variables include starting materials, extrusion ratio and extrusion temperature. Continuous lengths of wire could be satisfactorily produced from compacts of either ultra-pure Nb (VPN about 95 kg mm -2 ) and Cu powder or from centrifugal arc-cast Nb spheroids (VPN about 120 kg mm -2 ) and tough pitch Cu powder. After a total area reduction of 10 4 : 1, the latter materials resulted in long, unbroken, highly regular filaments of Nb about 6μm in diameter. The high degree of perfection of these filaments is due in part to the uniformity of the initial spheroids, compared to the highly irregular hydride-dehydride Nb powder. However their greater hardness requires that the spheroids be coprocessed in a less-pure Cu matrix. Critical currents were measured on helical specimens involving more than 1m length of wire, in fields up to 15T at 4.2 K, after reaction for various times at different temperatures. Overall current densities of 3 X 10 8 Am -2 were obtained at 12T in the best samples. Further reductions are expected to produce material with improved current densities

  14. Investigations on the wire saw process on steels of selected geometries in the encircling process; Untersuchungen zum Seilsaegeprozess an Staehlen ausgewaehlter Geometrien im umschlingenden Verfahren

    Energy Technology Data Exchange (ETDEWEB)

    Knecht, Daniel

    2015-01-26

    This thesis illustrates a new and innovative model for the usual looping method to describe cutting time and wear. Several test series have been carried out to determine and analyze the various influencing factors. This new model now allows for exact predictions for cutting times and the resulting wear. A special test stand was planned and built. With the help of this test stand various influencing parameters were determined in preliminary tests. Due to the high correlation between these parameters, a matrix was created to rate them. From these results and the findings of the preliminary tests, the boundary conditions such as work piece size were defined and an experimental design was created. Eleven test series were conducted and each one consists of up to ten work pieces. In each test series, only one parameter was changed, the other influencing parameters remained unchanged. The parameter of the following characteristics were varied: the speed of the diamond wire, the feed pressure, the cutting angle, the geometry with respective cutting area, the work piece material, as well as the twisting of the diamond wire. By varying these parameters, the influence could be shown on the performance of the cutting process and also on the wear behavior of the diamond wire. A model was created from the obtained data which enables a cutting time prediction for rectangular work pieces. In addition to the model, a new criterion has been developed, with which it is possible to quantify the progress of wear and to be able to determine a necessary wire replacement. The classification of particle sizes of the accumulated chips has shown that a lower average cutting performance results in a decrease of the average particle size. From this circumstance a termination criterion of <150 μm has been established. When the particle size drops below this value, the cutting process becomes ineffective and should not be continued, or the diamond wire should be replaced, respectively

  15. Enhanced J c property in nano-SiC doped thin MgB2/Fe wires by a modified in situ PIT process

    International Nuclear Information System (INIS)

    Jiang, C.H.; Nakane, T.; Hatakeyama, H.; Kumakura, H.

    2005-01-01

    A modified in situ PIT process, which included a short time pre-annealing and intermediate drawing step in the conventional in situ PIT process, was employed to fabricate thin round MgB 2 /Fe wires from MgH 2 and B powders. The pores and cracks resulted from the MgH 2 decomposition during the pre-annealing were effectively eliminated by the intermediate drawing step, which subsequently increased the core density and J c property of final heat treated wires. A higher reduction rate after the pre-annealing led to a larger enhancement in J c within this study. The reproducibility of our new process on the J c improvement in MgB 2 wires was confirmed in two series of wires doped with 5 mol% or 10 mol% nano-SiC particles separately

  16. Laser Indirect Shock Welding of Fine Wire to Metal Sheet.

    Science.gov (United States)

    Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

    2017-09-12

    The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent.

  17. Wire Chamber

    CERN Multimedia

    Magnetoscriptive readout wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  18. Wire chamber

    CERN Multimedia

    1967-01-01

    Magnetoscriptive readout wire chamber.Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  19. Mechanical characterization of Cu-Zn wire electrode base used in EDM and study of influence of the process of machining on its properties

    Energy Technology Data Exchange (ETDEWEB)

    Sedjal, H., E-mail: hasedjal@yahoo.fr; Amirat, B. [Département of Mechanical engineering, University of M.MAMMERI, Tizi Ouzou (Algeria); Aichour, M.; Marouf, T.; Chitroub, M. [Engineering and Material Sciences Laboratory, Department of Metallurgy, Polytechnic national school, Algiers (Algeria)

    2015-03-30

    This work is part of a Research National project (PNR) carried out by the group of research of the engineering and material sciences laboratory of the polytechnic national school at Algiers in collaboration with company BCR, which relates to “the characterization of the wire intended for the EDM of matrices metal. The goal of this work is to bring metallographic explanations on the wire electrode used by the machine ROBOFIL 290P, mechanically characterized this wire as of knowing of advantage about the process of its manufacturing (wiredrawing, .) The methods of studies used are it micro Vickers pyramid hardness, the tensile test, optical microscopy and scan electronic microscopy SEM.

  20. wire chamber

    CERN Multimedia

    Proportional multi-wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle. Proportional wire chambers allow a much quicker reading than the optical or magnetoscriptive readout wire chambers.

  1. Theoretical and Experimental Study on Vibration Propagation in PMMA Components in Ultrasonic Bonding Process

    Directory of Open Access Journals (Sweden)

    Yibo Sun

    2017-03-01

    Full Text Available Ultrasonic bonding has an increasing application in the micro assembly of polymeric micro-electro mechanical systems (MEMS with high requirements for fusion precision. In the ultrasonic bonding process, the propagation of ultrasonic vibration in polymer components is related to the interfacial fusion, which can be used as a monitoring parameter to control ultrasonic energy. To study the vibration propagation in viscoelastic polymer components, finite element analysis on the bonding of poly methyl methacrylate (PMMA micro connector to substrate for microfluidic system is carried out. Curves of propagated vibration amplitude corresponding to interfacial temperatures are obtained. The ultrasonic vibration propagated in PMMA components are measured through experiments. The theoretical and experimental results are contrasted to analyze the change mechanism of vibration propagation related to temperature. Based on the ultrasonic bonding process controlled by the feedback of vibration propagation, interfacial fusions at different vibration propagation states are obtained through experiments. Interfacial fusion behavior is contrasted to the propagated vibration amplitude in theoretical and experimental studies. The relation between vibration propagation and fusion degree is established with the proper parameter range for the obtained high quality bonding.

  2. PECULIARITIES OF FORMATION OF STRUCTURE AND PROPERTIES AT THERMO-MECHANICAL PROCESSING OF ROLLED WIRE OF NICKEL

    OpenAIRE

    V. A. Lutsenko

    2012-01-01

    There are results of researches of the mechanical properties and structure of the wire rod made of low-carbon nickel molybdenum steel after reduction to toughness thermomechanical treatment in the stream of high-speed wire mill.

  3. Experimental study on manufacturing of grits-spiral- distribution electroplated wire saw

    Directory of Open Access Journals (Sweden)

    Yufei GAO

    2016-12-01

    Full Text Available In order to obtain high performance electroplating diamond wire saw, experimental studies are conducted for development of grits-spiral-distribution electroplated diamond wire saw using sand-suspend electroplating method. The influences of pre-plating cathode current density, grits electro-embedding cathode current density and time on composite deposite coating appearance and grits distribution of wire saw are analyzed, and the sawing experiment is carried out by using the trial wire saw. The results show that good bonding strength between the coating and the steel wire can be obtained when the adopted cathode current density is 5.0 A/dm2 at pre-plating stage; good coating and girts distribution can be obtained when the adopted cathode current density is 5.0 A/dm2 and the electroplating time is 7~8 min at grits electro-embedding stage. By winding insulation wire on the surface of steel wire and reasonably selecting technological parameters before pre-plating can make the diamond wire saw with grits-spiral-distribution on surface, and the new type of wire saw has a better crumbs-clearing effect in wire sawing process.

  4. Superconducting properties of (Nb,Ta)3Sn wires fabricated by the bronze process

    International Nuclear Information System (INIS)

    Suenaga, M.; Aihara, K.; Kaiho, K.; Luhman, T.S.

    1979-01-01

    Measurements of the superconducting critical temperature T/sub c/, critical current density, J/sub c/ (8 3 Sn monofilamentary wires. Ta content in the Nb 3 Sn compound was varied by alloying the Nb core prior to a reaction heat treatment. Core compositions were 0, 3, 7, 10, and 20 wt% Ta and heat treatments for the reaction were 16, 64, and 120 h at 725 0 C. For the 120 h heat treatment T/sub c/ decreased monotonically with Ta content from 17.5 to 15.7K while H/sub c2/ increased from 19.8 to 24.6 T. With increasing Ta content J/sub c/ (16 T) increased from 0.7 x 10 5 A/cm 2 to a maximum value of 1.3 x 10 5 at 7 wt% Ta. Further increases in the Ta content produced a decrease in J/sub c/(16 T). At 10 T J/sub c/ decreased with increasing Ta content. An important aspect of this work is the observation that alloying with Ta did not hinder wire ductility during drawing. It appears therefore that the improvements in J/sub c/(16 T) can be incorporated into commercially manufactured conductors

  5. The influence of multiscale heterogeneity on recrystallization in nickel processed by accumulative roll bonding

    DEFF Research Database (Denmark)

    Mishin, Oleg; Zhang, Yubin; Godfrey, A.

    2017-01-01

    Microscopic and sample-scale heterogeneities have been characterized in nickel processed by accumulative roll bonding (ARB) to a von Mises strain of 4.8, and their influence on recrystallization have been analyzed. The microscopic deformation heterogeneities in this material are mostly associated...

  6. Processing and characterization of superconducting solenoids made of Bi-2212/Ag-alloy multifilament round wire for high field magnet applications

    Science.gov (United States)

    Chen, Peng

    between turns due to densification of wires (~4% wire diameter reduction) during 50-100 bar OP processing, and the diameter shrinking of conductors will potentially lead to coil sagging. So far, we have developed some methods to solve the issue of coil sagging, such as using flexible coil flange to allow smooth sagging of winding pack during OP processing. We have also investigated electrical joints between Bi-2212 RW conductors, which include resistive joints and superconducting joints. For resistive Bi-2212 joints, we evaluated conventional diffusion bonding method and soldering method. In general, the joints (with 42 mm joint length) resistances are below 200 nO at 4.2 K and magnetic fields up to 13.5 T, and the effect of magnetoresistance is clearly present. In addition to resistive joints, we successfully developed a superconducting joint between Bi-2212 RW conductors for persistent current mode (PCM) operations. (Abstract shortened by UMI.).

  7. Process Simulation of Resistance Weld Bonding and Automotive Light-weight Materials

    DEFF Research Database (Denmark)

    Zhang, Wenqi; Chergui, Azeddine; Nielsen, Chris Valentin

    of mechanical, electrical, thermal and metallurgical processes, which are essential for simulation of resistance welding process to predict the welding results and evaluate the weldability of materials. These functions have been further extended with new functions for optimization of welding process parameters...... and predicting welding process window, for weld planning with optimal welding parameter settings, and for modeling microstructures and hardness distribution after welding. Latest developments have been made on simulation of resistance welding with nonconductive materials for applications in weld bonding......This paper presents the latest developments in numerical simulation of resistance welding especially with the new functions for simulation of microstructures, weld bonding and spot welding of new light-weight materials. The fundamental functions in SORPAS® are built on coupled modeling...

  8. Wet-process Fabrication of Low-cost All-solid Wire-shaped Solar Cells on Manganese-plated Electrodes

    International Nuclear Information System (INIS)

    Fan, Xing; Zhang, Xiaoying; Zhang, Nannan; Cheng, Li; Du, Jun; Tao, Changyuan

    2015-01-01

    Highlights: • All-solid wire-shaped flexible solar cells are firstly assembled on low-cost Mn-plated fibers. • Energy efficiency improved by >27% after coating a layer of Mn on various substrates. • The cell is fabricated via wet process under low temperature and mild pH conditions. • Stable flexible solar cells are realized on lightweight and low-cost polymer fiber. - Abstract: All-solid wire-shaped flexible solar cells are assembled for the first time on low-cost Mn-plated wires through wet-process fabrication under low temperature and mild pH conditions. With a price cheap as the steel, metal Mn can be easily plated on almost any substrates, and evidently promote the photovoltaic efficiency of wire-shaped solar cells on various traditional metal wire substrates, such as Fe and Ti, by 27% and 65%, respectively. Flexible solar cell with much lower cost and weight is assembled on Mn-plated polymer substrate, and is still capable of giving better performance than that on Fe or Ti substrate. Both its mechanical and chemical stability are good for future weaving applications. Owing to the wire-type structure, such low-cost metals as Mn, which are traditionally regarded as unsuitable for solar cells, may provide new opportunities for highly efficient solar cells

  9. wire chamber

    CERN Multimedia

    1985-01-01

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  10. Wire chamber

    CERN Multimedia

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  11. wire chamber

    CERN Multimedia

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  12. wire chamber

    CERN Multimedia

    Was used in ISR (Intersecting Storage Ring) split field magnet experiment. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  13. Controlled rolling process for dual phase steels and application to rod, wire, sheet and other shapes

    Science.gov (United States)

    Thomas, Gareth; Ahn, Jae-Hwan; Kim, Nack-Joon

    1986-01-01

    An improved, energy efficient, hot rolling method for direct production of cold formable dual-phase steel is provided. The steel is heated to completely austenitize it and then continuously hot rolled and cooled down into the ferrite-austenite two phase region to a temperature which is just below the effective Ar.sub.3 temperature. The hot rolled steel is then rapidly quenched to provide an alloy containing strong, tough lath martensite (fibers) in a ductile soft ferrite matrix. The method is particularly useful for providing rods in which form the alloy is capable of being drawn into high strength wire or the like in a cold drawing operation without any intermediate annealing or patenting, and has excellent strength, ductility and fatigue characteristics.

  14. Binder Jetting: A Novel NdFeB Bonded Magnet Fabrication Process

    Science.gov (United States)

    Paranthaman, M. Parans; Shafer, Christopher S.; Elliott, Amy M.; Siddel, Derek H.; McGuire, Michael A.; Springfield, Robert M.; Martin, Josh; Fredette, Robert; Ormerod, John

    2016-07-01

    The goal of this research is to fabricate near-net-shape isotropic (Nd)2Fe14B-based (NdFeB) bonded magnets using a three dimensional printing process to compete with conventional injection molding techniques used for bonded magnets. Additive manufacturing minimizes the waste of critical materials and allows for the creation of complex shapes and sizes. The binder jetting process works similarly to an inkjet printer. A print-head passes over a bed of NdFeB powder and deposits a polymer binding agent to bind the layer of particles together. The bound powder is then coated with another layer of powder, building the desired shape in successive layers of bonded powder. Upon completion, the green part and surrounding powders are placed in an oven at temperatures between 100°C and 150°C for 4-6 h to cure the binder. After curing, the excess powder can be brushed away to reveal the completed "green" part. Green magnet parts were then infiltrated with a clear urethane resin to achieve the measured density of the magnet of 3.47 g/cm3 close to 46% relative to the NdFeB single crystal density of 7.6 g/cm3. Magnetic measurements indicate that there is no degradation in the magnetic properties. This study provides a new pathway for preparing near-net-shape bonded magnets for various magnetic applications.

  15. On the use of accumulative roll bonding process to develop nanostructured aluminum alloy 5083

    Energy Technology Data Exchange (ETDEWEB)

    Reza Toroghinejad, Mohammad; Ashrafizadeh, Fakhreddin [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Jamaati, Roohollah, E-mail: r.jamaatikenari@ma.iut.ac.ir [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Young Researchers Club, Ayatollah Amoli Branch, Islamic Azad University, Amol (Iran, Islamic Republic of)

    2013-01-20

    In the present study, the effect of accumulative roll bonding (ARB) process at room temperature on the microstructure and mechanical properties of AA5083 strip was investigated. Microstructural observations were done by transmission electron microscopy (TEM) and scanning electron microscopy (SEM). Also, mechanical properties were performed by tensile, hardness, and microhardness tests. It was observed that accumulative roll bonding is a promising process for production of nanostructured (80 nm) AA5083 strips. Nano shear bands were formed in the microstructure after the fourth cycles. When the number of cycles increased, the tensile strength and hardness of the accumulatively roll bonded strips increased. However, by increasing the number of cycles, the elongation value decreased except for the last (sixth) cycle. It was found that when the number of cycles increased, the distribution of microhardness values became more uniform. After the tensile test, debonding can be observed especially in the interface formed in the last cycle. Observations revealed that the failure mode in the accumulatively roll bonded AA5083 strip was a shear ductile rupture with elongated shallow shear dimples.

  16. Composite conductor containing superconductive wires

    Energy Technology Data Exchange (ETDEWEB)

    Larson, W.L.; Wong, J.

    1974-03-26

    A superconductor cable substitute made by coworking multiple rods of superconductive niobium--titanium or niobium--zirconium alloy with a common copper matrix to extend the copper and rods to form a final elongated product which has superconductive wires distributed in a reduced cross-section copper conductor with a complete metallurgical bond between the normal-conductive copper and the superconductor wires contained therein is described. The superconductor cable can be in the form of a tube.

  17. Constitutive hybrid processes: A process-algebraic semantics for hybrid bond graphs

    NARCIS (Netherlands)

    Cuijpers, P.J.L.; Broenink, J.F.; Mosterman, P.J.

    2008-01-01

    Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

  18. Constitutive Hybrid Processes: a Process-Algebraic Semantics for Hybrid Bond Graphs

    NARCIS (Netherlands)

    Cuijpers, P.J.L.; Broenink, Johannes F.; Mosterman, P.J.

    Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

  19. Constitutive Hybrid Processes: a Process-Algebraic Semantics for Hybrid Bond Graphs

    NARCIS (Netherlands)

    Cuijpers, Pieter J.L.; Broenink, Johannes F.; Mosterman, Pieter J.

    2008-01-01

    Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

  20. Modeling and optimization of process variables of wire-cut electric discharge machining of super alloy Udimet-L605

    Directory of Open Access Journals (Sweden)

    Somvir Singh Nain

    2017-02-01

    Full Text Available This paper presents the behavior of Udimet-L605 after wire electric discharge machining and evaluating the WEDM process using sophisticated machine learning approaches. The experimental work is depicted on the basis of Taguchi orthogonal L27 array, considering six input variables and three interactions. Three models such as support vector machine algorithms based on PUK kernel, non-linear regression and multi-linear regression have been proposed to examine the variance between experimental and predicted outcome and preferred the preeminent model based on its evaluation parameters performance and graph analysis. The grey relational analysis is the relevant approach to obtain the best grouping of input variables for maximum material removal rate and minimum surface roughness. Based on statistical analysis, it has been concluded that pulse-on time, interaction between pulse-on time x pulse-off time, spark-gap voltage and wire tension are the momentous variable for surface roughness while the pulse-on time, spark-gap voltage and pulse-off time are the momentous variables for material removal rate. The micro structural and compositional changes on the surface of work material were examined by means of SEM and EDX analysis. The thickness of the white layer and the recast layer formation increases with increases in the pulse-on time duration.

  1. HARM processing techniques for MEMS and MOEMS devices using bonded SOI substrates and DRIE

    Science.gov (United States)

    Gormley, Colin; Boyle, Anne; Srigengan, Viji; Blackstone, Scott C.

    2000-08-01

    Silicon-on-Insulator (SOI) MEMS devices (1) are rapidly gaining popularity in realizing numerous solutions for MEMS, especially in the optical and inertia application fields. BCO recently developed a DRIE trench etch, utilizing the Bosch process, and refill process for high voltage dielectric isolation integrated circuits on thick SOI substrates. In this paper we present our most recently developed DRIE processes for MEMS and MOEMS devices. These advanced etch techniques are initially described and their integration with silicon bonding demonstrated. This has enabled process flows that are currently being utilized to develop optical router and filter products for fiber optics telecommunications and high precision accelerometers.

  2. Fabrication of seven-core multi-filamentary MgB2 wires with high critical current density by an internal Mg diffusion process

    International Nuclear Information System (INIS)

    Togano, K; Hur, J M; Matsumoto, A; Kumakura, H

    2009-01-01

    We found that the reaction between a Mg core and a B powder layer in an internal Mg diffusion (IMD)-processed multi-filamentary wire can proceed rapidly even at a furnace temperature lower than the melting point of Mg (650 deg. C), resulting in the formation of a reacted layer with a fine composite structure and, hence, excellent in-field critical current properties. The multi-filamentary wire is composed of an outermost Cu-Ni sheath and seven filaments with a Ta sheath, a Mg core, and B+SiC powder filled in the space between the Ta sheath and the Mg core. Heat treatment at 645 deg. C for 1 h produced a reacted layer with dense composite structure along the inner wall of the Ta sheath and a hole at the center of each core. This reaction probably initiated from the heat generation at the B/Mg interface, resulting in a temperature rise of the Mg core and the occurrence of liquid Mg infiltration. The J c value at 4.2 K for the reacted layer exceeds 10 5 cm -2 at 9 T, which is the highest reported so far for MgB 2 wire, including powder-in-tube (PIT)-processed wires. These results indicate that the IMD process can compete in terms of practical wire fabrication with the conventional PIT process.

  3. Electron beam processing in wire and cables and heat shrinkable products

    International Nuclear Information System (INIS)

    Tikku, V.K.

    2001-01-01

    In this paper in a general manner the commercially successful E-beam crosslinking in wire and cable and heat shrinkable products being manufactured first time in India are illustrated. We at NICCO in India have established first industrial electron accelerator of 150 kW power with 3 MeV beam energy and 50 mA beam current, near Calcutta; the facility is likely to be commissioned by January, 2002. This facility was conceived and the developmental work was carried out with the active support of our R and D partners at Rubber Technology Centre, IIT, Kharagpur and Bhabha Atomic Research Centre, Mumbai. The polymeric compound developments, its extrusion on to the cable samples and radiation crosslinking were successfully achieved in this joint R and D efforts. We have already executed the developmental order with the know-how developed indigenously with our research partners and using the 2 MeV electron accelerator facility at Bhabha Atomic Research Centre, Mumbai. (author)

  4. Direct reciprocity in animals: The roles of bonding and affective processes.

    Science.gov (United States)

    Freidin, Esteban; Carballo, Fabricio; Bentosela, Mariana

    2017-04-01

    The presence of direct reciprocity in animals is a debated topic, because, despite its evolutionary plausibility, it is believed to be uncommon. Some authors claim that stable reciprocal exchanges require sophisticated cognition which has acted as a constraint on its evolution across species. In contrast, a more recent trend of research has focused on the possibility that direct reciprocity occurs within long-term bonds and relies on simple as well as more complex affective mechanisms such as emotional book-keeping, rudimentary and higher forms of empathy, and inequity aversion, among others. First, we present evidence supporting the occurrence of long-term reciprocity in the context of existing bonds in social birds and mammals. Second, we discuss the evidence for affective responses which, modulated by bonding, may underlie altruistic behaviours in different species. We conclude that the mechanisms that may underlie reciprocal exchanges are diverse, and that some act in interaction with bonding processes. From simple associative learning in social contexts, through emotional contagion and behavioural mimicry, to empathy and a sense of fairness, widespread and diverse social affective mechanisms may explain why direct reciprocity may not be a rare phenomenon among social vertebrates. © 2015 International Union of Psychological Science.

  5. Process and magnetic properties of cold pressed Ne Fe B bonded magnets

    International Nuclear Information System (INIS)

    Rodrigues, DAniel; Concilio, Gilberto Vicente; Landgraf, Fernando Jose Gomes; Zanchetta, Antonio Carlos

    1996-01-01

    Bonded magnets are polymer composites based on a mixture of a hard magnetic powder and a polymer. This mixture is processed as a traditional powder metallurgy material, cold pressed, or like a thermoplastic material, by injection molding. The polymeric phase to a large extent determines the mechanical properties of the composite, while magnetic powder determines its magnetic properties. They are less expensive and easier to produce, specially in the case of high complexity parts. This paper presents the relationship between process variables and magnetic properties of cold pressed Nd Fe B bonded magnets produced from melt spun flakes mixed with thermosetting resins. The experiments were done using Statistical Design of Experiments. The variables investigates were: uniaxial compaction pressure, binder type; binder content; size of Nd Fe B particles; addition of lubricant; and addition of small quantities of magnetic additives, particles of ferrites, iron, or alnico. (author)

  6. An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process

    OpenAIRE

    Eslami, P.; Taheri, A. Karimi

    2011-01-01

    A new method for production of bimetallic rods, utilizing the equal channel angular extrusion (ECAE) process has been introduced before by previous researchers, but no attempt has been made to assess the effect of different temperatures and holding times in order to achieve a diffusional bond between the mating surfaces. In present research copper sheathed aluminum rods have been ECAEed at room temperature and subsequently held at a constant ECAE pressure, at different temperatures and holdin...

  7. The use of wire mesh reactors to characterise solid fuels and provide improved understanding of larger scale thermochemical processes

    Energy Technology Data Exchange (ETDEWEB)

    Lu Gao; Long Wu; Nigel Paterson; Denis Dugwell; Rafael Kandiyoti [Imperial College London, London (United Kingdom). Department of Chemical Engineering

    2008-07-01

    Most reaction products from the pyrolysis and the early stages of gasification of solid fuels are chemically reactive. Secondary reactions between primary products and with heated fuel particles tend to affect the final product distributions. The extents and pathways of these secondary reactions are determined mostly by the heating rate and the size and shape of the reaction zone and of the sample itself. The wire-mesh reactor (WMR) configuration discussed in this paper allows products to be separated from reactants and enables the rapid quenching of products, allowing suppression of secondary reactions. This paper presents an overview of the development of wire-mesh reactors, describing several diverse applications. The first of these involves an analysis of the behaviour of injectant coal particles in blast furnace tuyeres and raceways. The data has offered explanations for helping to understand why, at high coal injection rates, problems can be encountered in the operation of blast furnaces. Another project focused on determining the extents of pyrolysis and gasification reactivities of a suite of Chinese coals under intense reaction conditions. The results showed variations in coal reactivities that were related to the C content. In another project demonstrating the versatility of the WMR configuration, the high pressure version of the reactor is being used for developing the Zero Emission Coal Alliance (ZECA) concept. The work aims to examine and explain the chemical and transport mechanisms underlying the pyrolysis, hydropyrolysis and hydrogasification stages of the process. The results obtained till date have shown the effects of the operating conditions on the extent of hydropyrolysis/gasification of a bituminous coal and two lignites. The lignites were more reactive than the coal, and the data suggests that high levels of conversion will be achievable under the anticipated ZECA process conditions. 29 refs., 15 figs., 7 tabs.

  8. Numerical investigations on the rebound phenomena and the bonding mechanisms in cold spray processes

    Science.gov (United States)

    Viscusi, A.

    2018-05-01

    Cold spray technology is a relatively new additive process allowing to create high quality metallic coatings, on both metallic and non-metallic substrates, without extensive heating of the powders sprayed. Upon impact with a target surface, conversion of kinetic energy to plastic deformation occurs, the solid particles deform and bond together. The actual bonding mechanism for cold spray particles is still not well understood, a high number of works has been carried out during the past two decades, several theories have been proposed to explain the adhesion/rebound mechanisms making the system ineffective for industrial applications. Therefore, the aim of this research activity is to better explain the complex adhesion/rebound phenomena into cold spray impact processes through numerical simulations; for this purpose, on the base of simplified hypothesis and results found in literature, an original 3D Finite Element Method (FEM) model of an aluminium particle impacting on an aluminium substrate was proposed. A cohesive behaviour algorithm was implemented in the particle-substrate contact regions aiming to simulate the bonding between the impacting particle and the substrate under specific working conditions. A rebound coefficient was also defined representing the particle residual energy. Different simulations were performed using a range of impact velocities and varying the interfacial cohesive strength. It was shown that at low impact velocities the rebound phenomenon is governed by the elastic energy stored in the system, meanwhile at high impact velocities, the rebound phenomenon is mainly due to the strain rate effects making the system mechanically stronger; therefore, a specific range of bonding velocities depending on substrate-particle contact area were found.

  9. Research on Melt Degassing Processes of High Conductivity Hard Drawn Aluminum Wire

    Science.gov (United States)

    Xu, Xuexia; Feng, Yanting; Wang, Qing; Li, Wenbin; Fan, Hui; Wang, Yong; Li, Guowei; Zhang, Daoqian

    2018-03-01

    Degassing effects of ultrasonic and vacuum processes on high conductivity hard drawn aluminum melt were studied. Results showed that the degassing efficiency improved with the increase of ultrasonic power within certain range, stabilizing at 70% with 240W. For vacuum degassing process, hydrogen content of aluminum melt decreased with the loading time and was linear with logarithm of vacuum degree. Comparison of degassing effects of ultrasonic, vacuum, vacuum-ultrasonic degassing process showed that vacuum-ultrasonic process presented optimal effect.

  10. PECULIARITIES OF FORMATION OF STRUCTURE AND PROPERTIES AT THERMO-MECHANICAL PROCESSING OF ROLLED WIRE OF NICKEL

    Directory of Open Access Journals (Sweden)

    V. A. Lutsenko

    2012-01-01

    Full Text Available There are results of researches of the mechanical properties and structure of the wire rod made of low-carbon nickel molybdenum steel after reduction to toughness thermomechanical treatment in the stream of high-speed wire mill.

  11. Application of continual annealing and roll bonding (CAR) process for manufacturing Al–Zn multilayered composites

    International Nuclear Information System (INIS)

    Dehsorkhi, Reza Nasiri; Qods, Fathallah; Tajally, Mohammad

    2012-01-01

    Highlights: ► CAR process was performed on Al–Zn composite. ► Good bonding between layers was achieved by increasing the number of CAR cycles. ► With increasing number of cycles, a good distribution of Zn fragmentations was achieved. ► The composites which were produced by CAR process, possess a higher tensile strength and elongation than ARB process. ► By EDX analysis it is proved that Al and Zn atoms would diffuse with each other. - Abstract: In this study, an aluminium–zinc composite was produced for the first time by using a continual annealing and roll-bonding (CAR) process. A composite with homogeneous distribution of fragmented zinc layers in aluminium matrix was produced after ten CAR cycles. The results demonstrate that tensile strength of the final composites increases up to 410 MPa, which is about 4 times higher than those of initial aluminium and zinc sheets. However, elongation of the composite reduced down to 4% after ten CAR cycles. The fracture surfaces of the tensile samples were observed by scanning electron microscope (SEM) to evaluate the failure mode. Observations reveal that the failure mode in CAR-processed composites is a typical ductile fracture which shows deep dimples in samples with few CAR cycles, while the failure mode was shear ductile fracture with shallow and elongated dimples in samples with ten CAR cycles.

  12. Progress in Effect of Nano-modified Coatings and Welding Process Parameters on Wear of Contact Tube for Non-copper Coated Solid Wires

    Directory of Open Access Journals (Sweden)

    LI Zhuo-xin

    2017-12-01

    Full Text Available Environment-friendly non-copper coated solid wire is the main developing trend for gas shielded solid wires, whereas wear of contact tube limits their wide application. The effect of nano-modified coatings and welding process parameters on wear of contact tube for non-copper coated solid wires was reviewed. It was found that the wear of contact tube can be reduced due to the formation of tribo-films on the rubbing surfaces of welding wires against contact tube; it is feasible to decrease contact tube wear when non-copper coated solid wires are coated with nano-modified lubricants, thereby displaying excellent lubricating and thermal or electrical conduction characteristics. The wear of contact tube increases with the increase of welding current. The wear of contact tube is worse in direct-current electrode positive (DCEP than in direct-current electrode negative (DCEN. Arc ablation and electrical erosion are the dominant wear mechanisms of contact tube.

  13. A statistical rationale for establishing process quality control limits using fixed sample size, for critical current verification of SSC superconducting wire

    International Nuclear Information System (INIS)

    Pollock, D.A.; Brown, G.; Capone, D.W. II; Christopherson, D.; Seuntjens, J.M.; Woltz, J.

    1992-01-01

    This work has demonstrated the statistical concepts behind the XBAR R method for determining sample limits to verify billet I c performance and process uniformity. Using a preliminary population estimate for μ and σ from a stable production lot of only 5 billets, we have shown that reasonable sensitivity to systematic process drift and random within billet variation may be achieved, by using per billet subgroup sizes of moderate proportions. The effects of subgroup size (n) and sampling risk (α and β) on the calculated control limits have been shown to be important factors that need to be carefully considered when selecting an actual number of measurements to be used per billet, for each supplier process. Given the present method of testing in which individual wire samples are ramped to I c only once, with measurement uncertainty due to repeatability and reproducibility (typically > 1.4%), large subgroups (i.e. >30 per billet) appear to be unnecessary, except as an inspection tool to confirm wire process history for each spool. The introduction of the XBAR R method or a similar Statistical Quality Control procedure is recommend for use in the superconducing wire production program, particularly when the program transitions from requiring tests for all pieces of wire to sampling each production unit

  14. Nanograined Ti–Nb microalloy steel achieved by Accumulative Roll Bonding (ARB) process

    International Nuclear Information System (INIS)

    Tohidi, A.A.; Ketabchi, M.; Hasannia, A.

    2013-01-01

    Over the last decade, nanocrystalline and ultra-fine grained (UFG) materials with grain size less than 1 μm have aroused considerable interest due to their superior mechanical properties compared to conventionally grained materials. In this work Ti–Nb microalloy steel was processed by the severe plastic deformation (SPD) technique called Accumulative Roll Bonding (ARB) in order to produce an ultra-fine grained microstructure and improve the mechanical properties. After initial preparation to achieve good sheet bonding, 8 cycles of ARB at 550 °C were successfully performed. Observation of optical microstructure, scanning electron microscopy (SEM) micrographs, and X-Ray Diffraction (XRD) peak broadening analysis were used for the characterization of grain structure of the ARB processed sample. The mechanical attributes after rolling and cooling were examined. It was calculated that metal's yield and tensile strength increased by 334% and 215% respectively, while the ductility dropped from as-received value of 34% to 2.9%. Microhardness of the material was studied at room temperature. There was a continuous enhancement of hardness by increasing the pass number of the ARB process. At the 8th pass, the hardness values increased by 230%. The rolling process was stopped at 8th cycle when cracking of the edge became pronounced

  15. Physical features of the wire-array Z-pinch plasmas imploding process

    International Nuclear Information System (INIS)

    Gao Chunming; Feng Kaiming

    2001-01-01

    In the process of research on controlled fusion reactors, scientists found that the Z-pinch plasma can produce very strong X-rays, comparing with other X-ray sources. In researching the process of imploding, the snowplow model and Haines model are introduced and proved. About amassing X-rays, several ways of discharging X-rays are carefully analyzed and the relative theories are proved. In doing simulations, the one dimension model is used in writing codes, the match relationships are calculated and the process of imploding is also simulated. Some useful and reasonable results are obtained

  16. Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

    CERN Document Server

    Brönnimann, C; Gobrecht, J; Heising, S; Horisberger, M; Horisberger, R P; Kästli, H C; Lehmann, J; Rohe, T; Streuli, S; Broennimann, Ch.

    2006-01-01

    The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflown indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflown afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a seco...

  17. A voice from the high wire: Public involvement in a co-operative siting process

    International Nuclear Information System (INIS)

    Oates, D.J.L.

    1995-01-01

    The author is a public consultation and communications consultant to the Siting Task Force (STF), Low level Radioactive Waste Management. The STF is a Canadian government-appointed yet independent body implementing a voluntary, co-operative siting process for a long term storage or disposal facility for 1 million cubic metres of LLRW. The presentation will document the experiences of and lessons learned by the author during her role developing and implementing a public involvement program for the process. The Co-operative Siting Process is a new approach to siting controversial facilities. It is based on the belief that communities should accept such a facility in their backyard and not be forced against their will on technical or political grounds. A formal 'ground rules-up-front' process was developed and is now being carried out, with completion slated for April, 1995. Putting these rules and theories into practice has resulted in significant changes being made to the work plan for technical activities, and in a sober second look at the intricacies involved in planning and carrying out a thorough and efficient public involvement program that remain practical and cost-effective. There is a delicate balancing act between meaningful public participation that lays the foundation for trust, confidence and consensus, and public involvement that can result in the process being side-tracked and legitimate solutions and technical activities becoming mired in political and personal agendas

  18. Microstructural studies and wear assessments of Ti/TiC surface composite coatings on commercial pure Ti produced by titanium cored wires and TIG process

    Energy Technology Data Exchange (ETDEWEB)

    Monfared, A., E-mail: amirmonfared25@yahoo.com [Department of Materials Science and Engineering, Sharif University of Technology, Tehran (Iran, Islamic Republic of); Kokabi, A.H.; Asgari, S. [Department of Materials Science and Engineering, Sharif University of Technology, Tehran (Iran, Islamic Republic of)

    2013-01-15

    Tungsten Inert Gas (TIG) process and titanium cored wires filled with micro size TiC particles were employed to produce surface composite coatings on commercial pure Ti substrate for wear resistance improvement. Wire drawing process was utilized to produce several cored wires from titanium strips and titanium carbide powders. Subsequently, these cored wires were melted and coated on commercial pure Ti using TIG process. This procedure was repeated at different current intensities and welding travel speeds. Composite coating tracks were found to be affected by TIG heat input. The microstructural studies using optical and scanning electron microscopy supported by X-ray diffraction showed that the surface composite coatings consisted of {alpha} Prime -Ti, spherical and dendritic TiC particles. Also, greater volume fractions of TiC particles in the coatings were found at lower heat input. A maximum microhardness value of about 1100 HV was measured which is more than 7 times higher than the substrate material. Pin-on-disk wear tests exhibited a better performance of the surface composite coatings than the untreated material which was attributed to the presence of TiC particles in the microstructure. -- Highlights: Black-Right-Pointing-Pointer Ti/TiC composite coatings were produced on the CP-Ti. Black-Right-Pointing-Pointer Titanium cored wire and TIG process were employed for production of the coatings. Black-Right-Pointing-Pointer Decreasing heat input, increased the volume fraction of TiC in the coatings. Black-Right-Pointing-Pointer The maximum microhardness obtained in the lowest heat input. Black-Right-Pointing-Pointer The wear resistance of the coatings improved due to the formation of TiC particles.

  19. Pacemaker wires

    International Nuclear Information System (INIS)

    Fransson, S.G.

    1993-01-01

    Evaluation of pacemaker wires were performed by comparing Advanced Multiple Beam Equalization Radiography (AMBER) with conventional chest radiography. The scanning equalization technique of the AMBER unit makes it superior to conventional technique in the depiction of different structures in the mediastinum or in the pleural sinuses. So far motion artifacts have not been considered clinically important. The longer exposure time, however, may impair the assessment of pacemaker wires. The motion artifact described may not only make adequate evaluation impossible but may even give a false impression of a lead fracture. The difference between the two systems was significant. (orig.)

  20. A statistical rationale for establishing process quality control limits using fixed sample size, for critical current verification of SSC superconducting wire

    International Nuclear Information System (INIS)

    Pollock, D.A.; Brown, G.; Capone, D.W. II; Christopherson, D.; Seuntjens, J.M.; Woltz, J.

    1992-03-01

    The purpose of this paper is to demonstrate a statistical method for verifying superconducting wire process stability as represented by I c . The paper does not propose changing the I c testing frequency for wire during Phase 1 of the present Vendor Qualification Program. The actual statistical limits demonstrated for one supplier's data are not expected to be suitable for all suppliers. However, the method used to develop the limits and the potential for improved process through their use, may be applied equally. Implementing the demonstrated method implies that the current practice of testing all pieces of wire from each billet, for the purpose of detecting manufacturing process errors (i.e. missing a heat-treatment cycle for a part of the billet, etc.) can be replaced by other less costly process control measures. As used in this paper process control limits for critical current are quantitative indicators of the source manufacturing process uniformity. The limits serve as alarms indicating the need for manufacturing process investigation

  1. Bane of Hydrogen-Bond Formation on the Photoinduced Charge-Transfer Process in Donor–Acceptor Systems

    KAUST Repository

    Alsam, Amani Abdu

    2017-03-14

    Controlling the ultrafast dynamical process of photoinduced charge transfer at donor acceptor interfaces remains a major challenge for physical chemistry and solar cell communities. The process is complicated by the involvement of other complex dynamical processes, including hydrogen bond formation, energy transfer, and solvation dynamics occurring on similar time scales. In this study, we explore the remarkable impact of hydrogen-bond formation on the interfacial charge transfer between a negatively charged electron donating anionic porphyrin and a positively charged electron accepting pi-conjugated polymer, as a model system in solvents with different polarities and capabilities for hydiogen bonding using femtosecond transient absorption spectroscopy. Unlike the conventional understanding of the key role of hydrogen bonding in promoting the charge-transfer process, our steadystate and time-resolved results reveal that the intervening hydrogen-bonding environment and, consequently, the probable longer spacing between the donor and acceptor molecules significantly hinders the charge-transfer process between them. These results show that site-specific hydrogen bonding and geometric considerations between donor and acceptor can be exploited to control both the charge-transfer dynamics and its efficiency not only at donor acceptor interfaces but also in complex biological systems.

  2. Processing and Protection of Rare Earth Permanent Magnet Particulate for Bonded Magnet Applications

    Energy Technology Data Exchange (ETDEWEB)

    Sokolowski, Peter Kelly [Iowa State Univ., Ames, IA (United States)

    2007-01-01

    Rapid solidification of novel mixed rare earth-iron-boron, MRE2Fe14B (MRE = Nd, Y, Dy; currently), magnet alloys via high pressure gas atomization (HPGA) have produced similar properties and structures as closely related alloys produced by melt spinning (MS) at low wheel speeds. Recent additions of titanium carbide and zirconium to the permanent magnet (PM) alloy design in HPGA powder (using He atomization gas) have made it possible to achieve highly refined microstructures with magnetic properties approaching melt spun particulate at cooling rates of 105-106K/s. By producing HPGA powders with the desirable qualities of melt spun ribbon, the need for crushing ribbon was eliminated in bonded magnet fabrication. The spherical geometry of HPGA powders is more ideal for processing of bonded permanent magnets since higher loading fractions can be obtained during compression and injection molding. This increased volume loading of spherical PM powder can be predicted to yield a higher maximum energy product (BH)max for bonded magnets in high performance applications. Passivation of RE-containing powder is warranted for the large-scale manufacturing of bonded magnets in applications with increased temperature and exposure to humidity. Irreversible magnetic losses due to oxidation and corrosion of particulates is a known drawback of RE-Fe-B based alloys during further processing, e.g. injection molding, as well as during use as a bonded magnet. To counteract these effects, a modified gas atomization chamber allowed for a novel approach to in situ passivation of solidified particle surfaces through injection of a reactive gas, nitrogen trifluoride (NF3). The ability to control surface chemistry during atomization processing of fine spherical RE-Fe-B powders produced advantages over current processing methodologies. In particular, the capability to coat particles while 'in flight' may eliminate the

  3. AUTOMATED CONTROL AND REAL-TIME DATA PROCESSING OF WIRE SCANNER/HALO SCRAPER MEASUREMENTS

    International Nuclear Information System (INIS)

    Day, L.A.; Gilpatrick, J.D.

    2001-01-01

    The Low-Energy Demonstration Accelerator (LEDA), assembled and operating at Los Alamos National Laboratory, provides the platform for obtaining measurements of high-power proton beam-halo formation. Control system software and hardware have been integrated and customized to enable the production of real-time beam-halo profiles. The Experimental Physics and Industrial Control System (EPICS) hosted on a VXI platform, Interactive Data Language (IDL) programs hosted on UNIX platforms, and LabVIEW (LV) Virtual Instruments hosted on a PC platform have been integrated and customized to provide real-time, synchronous motor control, data acquisition, and data analysis of data acquired through specialized DSP instrumentation. These modules communicate through EPICS Channel Access (CA) communication protocol extensions to control and manage execution flow ensuring synchronous data acquisition and real-time processing of measurement data. This paper describes the software integration and management scheme implemented to produce these real-time beam profiles

  4. Processing, Structural Characterization and Comparative Studies on Uniaxial Tensile Properties of a New Type of Porous Twisted Wire Material

    Directory of Open Access Journals (Sweden)

    Fei Wu

    2015-08-01

    Full Text Available A self-developed rotary multi-cutter device cuts stainless steel wire ropes into segments to fabricate twisted wires. Stainless steel porous twisted wire materials (PTWMs with a spatial composite intertexture structure are produced by the compaction and subsequent vacuum solid-phase sintering of twisted wires. The stainless steel PTWMs show two types of typical uniaxial tensile failure modes, i.e., a 45° angle fracture mode and an auxetic failure mode (the PTWMs expand along the direction perpendicular to the tension. The effects of the sintering parameters, porosities, wire diameters, and sampling direction on the tensile properties of the PTWMs are carefully investigated. By increasing the sintering temperature from 1130 °C to 1330 °C, the tensile strength of the PTWMs with 70% target porosity increased from 7.7 MPa to 28.6 MPa and the total failure goes down to 50%. When increasing the sintering time from 90 min to 150 min, the tensile strength increases from 12.4 MPa to 19.1 MPa and the total failure elongation drops to 78.6%. The tensile strength of the PTWMs increases from 28.9 MPa to 112.7 MPa with decreasing porosity from 69.5% to 46.0%, and the total failure elongation also increases from 14.8% to 40.7%. The tensile strength and the failure strain of the PTWMs with fine wires are higher than those of the PTWMs with coarse wires under the same porosity. Sampling direction has a small influence on the tensile properties of the PTWMs.

  5. Development of ex situ processed MgB2 wires and their applications to magnets

    International Nuclear Information System (INIS)

    Braccini, Valeria; Nardelli, Davide; Penco, Roberto; Grasso, Giovanni

    2007-01-01

    In spite of the relatively short time dedicated to the development of magnesium diboride conductors since its discovery in early 2001, a substantial improvement was soon achieved in their manufacture and use. Unlike many others HTS and LTS materials, the MgB 2 conductor processing is more open to a number of improvements and modifications that help in making it more attractive for several DC and AC applications. Many kilometres of conductors were already produced throughout the world and it is now possible to start seriously thinking about a systematic industrial production of this material, as it is already possible to purchase it in reasonable lengths on the free market. These remarkable lengths of conductor were also wound in coils and their performance continuously improved in the past years. Here we will present a review of the recent results and a perspective for the future development of this 'new' superconductor, starting from the optimisation of the precursor powders needed to improve the magnetic field behaviour of the tapes, to the conductor development, i.e. the production of multifilamentary Cu-stabilized tapes in lengths up to 1.78 km, to the realization of the first large-scale application devices such as MRI magnets and fault current limiters

  6. Grain refinement and mechanical properties of CP-Ti processed by warm accumulative roll bonding

    International Nuclear Information System (INIS)

    Milner, Justin L.; Abu-Farha, Fadi; Bunget, Cristina; Kurfess, Thomas; Hammond, Vincent H.

    2013-01-01

    Accumulative roll bonding (ARB), a severe plastic deformation technique, was used in this study to process commercially pure titanium (CP-Ti) at 450 °C. Sheet samples were processed by seven consecutive ARB cycles, with an overall equivalent strain of 5.6. Mechanical characterization and microstructural examination were carried out on the processed material to track their changes and relationships with regard to one another. Electron microscopy, TEM in particular, revealed significant grain refinement in the material, with submicron microstructure achieved even after one cycle of warm processing. Further processing was shown to progressively fragment the highly elongated grains, ultimately producing a predominantly-equiaxed ultrafine grain structure with an average grain size of ∼100 nm. Tensile strength and microhardness of the material increased with the number of ARB cycles; the strength–grain size relationship followed the Hall–Petch equation. The overall grain refinement and strengthening levels observed here are close to those reported in the literature for ARB processing of CP-Ti at ambient temperatures. This demonstrates the ability of warm ARB can be as effective as cold ARB, while offering several advantages for industrial utilization.

  7. Recycling of Manganese Secondary Raw Material Via Cold-Bond Pelletizing Process

    International Nuclear Information System (INIS)

    Ahmed, Y.M.Z.; Mohamed, F.M.

    2004-01-01

    Large quantities of fines were produced during the shipping, transportation, handling and storage of manganese ore sinter imported from different countries to Sinai Company for ferromanganese production. These fines are generally considered as valuable secondary raw materials. Hence, they have a potential to be recycled back to the submerged arc furnace after having been agglomerated. For agglomerates to be considered as feed materials for submerged arc furnace they must have sufficient room temperature strength. Cold-bonded penalization process offers an economically attractive and environmentally viable method for achieving this. Ordinary Portland cement was used in this investigation for the purpose of producing a suitable cold-bonded pellet from such fines. In this investigation, the effect of adding different percentages of Portland cement on the mechanical properties of both green and pellet dried at room temperature for 1, 3, 7, 14, and 28 days of normal curing were studied. The results revealed that, although the compressive strength of green pellets improved with the increase of the amount of cement added. retardation in pellet drop strength was reported. Whereas, the increase in both the cement content and time of drying leads to increase in the mechanical properties of pellets normally cured at room temperature. pellets obtain with the addition of 9% cement shows reasonable mechanical properties to be charged in the submerged are furnace. ferromanganese alloy having a standard range composition was produced in a laboratory submerged are furnace using such pellets

  8. Non-hoop winding effect on bonding temperature of laser assisted tape winding process

    Science.gov (United States)

    Zaami, Amin; Baran, Ismet; Akkerman, Remko

    2018-05-01

    One of the advanced methods for production of thermoplastic composite methods is laser assisted tape winding (LATW). Predicting the temperature in LATW process is very important since the temperature at nip-point (bonding line through width) plays a pivotal role in a proper bonding and hence the mechanical performance. Despite the hoop-winding where the nip-point is the straight line, non-hoop winding includes a curved nip-point line. Hence, the non-hoop winding causes somewhat a different power input through laser-rays and-reflections and consequently generates unknown complex temperature profile on the curved nip-point line. Investigating the temperature at the nip-point line is the point of interest in this study. In order to understand this effect, a numerical model is proposed to capture the effect of laser-rays and their reflections on the nip-point temperature. To this end, a 3D optical model considering the objects in LATW process is considered. Then, the power distribution (absorption and reflection) from the optical analysis is used as an input (heat flux distribution) for the thermal analysis. The thermal analysis employs a fully-implicit advection-diffusion model to calculate the temperature on the surfaces. The results are examined to demonstrate the effect of winding direction on the curved nip-point line (tape width) which has not been considered in literature up to now. Furthermore, the results can be used for designing a better and more efficient setup in the LATW process.

  9. Fabrication and properties of multifilamentary MgB 2 wires by in-situ powder-in-tube process

    Science.gov (United States)

    Wang, Q. Y.; Jiao, G. F.; Liu, G. Q.; Xiong, X. M.; Yan, S. C.; Zhang, P. X.; Sulpice, A.; Mossang, E.; Feng, Y.; Yan, G.

    2010-11-01

    We have fabricated the long TiC-doped MgB2 wires with 6 filaments by in-situ powder-in-tube method using Nb as the barrier and copper as the stabilizer. To improve the strength of wires, the Nb-core was used as the central filament. The transport engineering critical current density (Jce) of the samples sintered at different temperature were measured, which reaches 2.5 × 104 A/cm2 at 4.2 K, 5 T. 100 m MgB2 wires with different diameter were wound into coils and the transport critical current (Ic) of the coil were measured at 30 K in self-field. The Jce value 100 m coil achieves 1.1 × 104 A/cm2 in 1.2 mm wire. The reasons leading to the enhancement of high field Jce were discussed. The results show a good potential to fabricate high performance MgB2 wires and tapes at ambient pressure on an industrial scale.

  10. Modern wiring practice

    CERN Document Server

    Steward, W E

    2012-01-01

    Continuously in print since 1952, Modern Wiring Practice has now been fully revised to provide an up-to-date source of reference to building services design and installation in the 21st century. This compact and practical guide addresses wiring systems design and electrical installation together in one volume, creating a comprehensive overview of the whole process for contractors and architects, as well as electricians and other installation engineers. Best practice is incorporated throughout, combining theory and practice with clear and accessible explanation, all

  11. Biofriendly bonding processes for nanoporous implantable SU-8 microcapsules for encapsulated cell therapy.

    Science.gov (United States)

    Nemani, Krishnamurthy; Kwon, Joonbum; Trivedi, Krutarth; Hu, Walter; Lee, Jeong-Bong; Gimi, Barjor

    2011-01-01

    Mechanically robust, cell encapsulating microdevices fabricated using photolithographic methods can lead to more efficient immunoisolation in comparison to cell encapsulating hydrogels. There is a need to develop adhesive bonding methods which can seal such microdevices under physiologically friendly conditions. We report the bonding of SU-8 based substrates through (i) magnetic self assembly, (ii) using medical grade photocured adhesive and (iii) moisture and photochemical cured polymerization. Magnetic self-assembly, carried out in biofriendly aqueous buffers, provides weak bonding not suitable for long term applications. Moisture cured bonding of covalently modified SU-8 substrates, based on silanol condensation, resulted in weak and inconsistent bonding. Photocured bonding using a medical grade adhesive and of acrylate modified substrates provided stable bonding. Of the methods evaluated, photocured adhesion provided the strongest and most stable adhesion.

  12. Wired vs. Wireless.

    Science.gov (United States)

    Fielding, Randall

    2000-01-01

    Presents a debate on which technology will be in tomorrow's classrooms and the pros and cons of wiring classrooms and using a wireless network. Concluding comments address the likelihood, and desirability, of placing computers throughout the entire educational process and what types of computers and capabilities are needed. (GR)

  13. Formation of porous surface layers in reaction bonded silicon nitride during processing

    Science.gov (United States)

    Shaw, N. J.; Glasgow, T. K.

    1979-01-01

    Microstructural examination of reaction bonded silicon nitride (RBSN) has shown that there is often a region adjacent to the as-nitrided surfaces that is even more porous than the interior of this already quite porous material. Because this layer of large porosity is considered detrimental to both the strength and oxidation resistance of RBSN, a study was undertaken to determine if its formation could be prevented during processing. All test bars studied were made from a single batch of Si powder which was milled for 4 hours in heptane in a vibratory mill using high density alumina cylinders as the grinding media. After air drying the powder, bars were compacted in a single acting die and hydropressed.

  14. Transport critical current density and microstructure in extruded YBa2Cu3O7-x wires processed by zone melting

    International Nuclear Information System (INIS)

    Shi, D.; Krishnan, H.; Hong, J.M.; Miller, D.; McGinn, P.J.; Chen, W.H.; Xu, M.; Chen, J.G.; Fang, M.M.; Welp, U.; Lanagan, M.T.; Goretta, K.C.; Dusek, J.T.; Picciolo, J.J.; Balachandran, U.

    1990-01-01

    YBa 2 Cu 3 O 7-x compounds were extruded into long wires with the diameter of 1 mm after sintering. The sintered wires were subsequently zone melted to develop a highly textured microstructure. Magnetization experiments at 77 K indicated a J c value of 1x10 5 A/cm 2 at 1 T. Transport measurements at 77 K showed a greatly enhanced field dependence of the critical current density. Transmission electron microscopy revealed an important grain-boundary feature which eliminated the weak-link behavior. Large amounts of dislocations have also been found in the zone-melted sample which may contribute to flux pinning in the system

  15. Magnetization reversal process and nonlinear magneto-impedance in Cu/NiFe and Nb/NiFe composite wires

    Energy Technology Data Exchange (ETDEWEB)

    Antonov, A.S.; Buznikov, N.A. E-mail: n_buznikov@mail.ru; Granovsky, A.B.; Iakubov, I.T.; Prokoshin, A.F.; Rakhmanov, A.L.; Yakunin, A.M

    2002-08-01

    The magnetization reversal of Cu/NiFe and Nb/NiFe composite wires carrying AC current is studied. The frequency spectrum of a voltage induced in a pick-up coil wound around the wire is analyzed. The frequency spectrum is shown to consist of even harmonics within a wide range of AC current amplitudes and longitudinal DC magnetic fields. The strong dependencies of the harmonic amplitudes on the DC field are found. The results obtained may be of importance for the design of weak magnetic field sensors.

  16. Magnetization reversal process and nonlinear magneto-impedance in Cu/NiFe and Nb/NiFe composite wires

    International Nuclear Information System (INIS)

    Antonov, A.S.; Buznikov, N.A.; Granovsky, A.B.; Iakubov, I.T.; Prokoshin, A.F.; Rakhmanov, A.L.; Yakunin, A.M.

    2002-01-01

    The magnetization reversal of Cu/NiFe and Nb/NiFe composite wires carrying AC current is studied. The frequency spectrum of a voltage induced in a pick-up coil wound around the wire is analyzed. The frequency spectrum is shown to consist of even harmonics within a wide range of AC current amplitudes and longitudinal DC magnetic fields. The strong dependencies of the harmonic amplitudes on the DC field are found. The results obtained may be of importance for the design of weak magnetic field sensors

  17. Attachment of lead wires to thin film thermocouples mounted on high temperature materials using the parallel gap welding process

    Science.gov (United States)

    Holanda, Raymond; Kim, Walter S.; Pencil, Eric; Groth, Mary; Danzey, Gerald A.

    1990-01-01

    Parallel gap resistance welding was used to attach lead wires to sputtered thin film sensors. Ranges of optimum welding parameters to produce an acceptable weld were determined. The thin film sensors were Pt13Rh/Pt thermocouples; they were mounted on substrates of MCrAlY-coated superalloys, aluminum oxide, silicon carbide and silicon nitride. The entire sensor system is designed to be used on aircraft engine parts. These sensor systems, including the thin-film-to-lead-wire connectors, were tested to 1000 C.

  18. Design process and instrumentation of a low NOx wire-mesh duct burner for micro-cogeneration unit

    Energy Technology Data Exchange (ETDEWEB)

    Ramadan, O.B.; Gauthier, J.E.D. [Carleton Univ., Ottawa, ON (Canada). Dept. of Mechanical and Aerospace Engineering; Hughes, P.M.; Brandon, R. [Natural Resources Canada, Ottawa, ON (Canada). CANMET Energy Technology Centre

    2007-07-01

    Air pollution and global climate change have become a serious environmental problem leading to increasingly stringent government regulations worldwide. New designs and methods for improving combustion systems to minimize the production of toxic emissions, like nitrogen oxides (NOx) are therefore needed. In order to control smog, acid rain, ozone depletion, and greenhouse-effect warming, a reduction of nitrogen oxide is necessary. One alternative for combined electrical power and heat generation (CHP) are micro-cogeneration units which use a micro-turbine as a prime mover. However, to increase the efficiencies of these units, micro-cogeneration technology still needs to be developed further. This paper described the design process, building, and testing of a new low NOx wire-mesh duct burner (WMDB) for the development of a more efficient micro-cogeneration unit. The primary goal of the study was to develop a practical and simple WMDB, which produces low emissions by using lean-premixed surface combustion concept and its objectives were separated into four phases which were described in this paper. Phase I involved the design and construction of the burner. Phase II involved a qualitative flow visualization study for the duct burner premixer to assist the new design of the burner by introducing an efficient premixer that could be used in this new application. Phase III of this research program involved non-reacting flow modeling on the burner premixer flow field using a commercial computational fluid dynamic model. In phase IV, the reacting flow experimental investigation was performed. It was concluded that the burner successfully increased the quantity and the quality of the heat released from the micro-CHP unit and carbon monoxide emissions of less than 9 ppm were reached. 3 refs., 3 figs.

  19. Influence of chemical bonding of chlorides with aluminates in cement hidratation process on corrosion steel bars in concrete

    Directory of Open Access Journals (Sweden)

    Bikić Farzet H.

    2010-01-01

    Full Text Available The presence of chlorides in concrete is a permanent subject of research because they cause corrosion of steel bars. Chlorides added to the concrete during preparation, as accelerators of the bonding of cement minerals process, enter into reaction with aluminates, creating a phase known as chloroaluminate hydrates. In everyday conditions the product of chemical bonding between chlorides and aluminates is usually monochloridealuminate C3A·CaCl2·Hx, better known as Friedel's salt. In this paper, the influence of chemical bonding of chlorides with aluminates during the process of cement hydration on corrosion of steel bars in concrete was investigated. The process of chlorides bonding with aluminates yielding monochloride aluminate is monitored by XRD analyses. It was found that the amount of chlorides bonding with aluminates increases with an increase of temperature, and as a result, reduces the amount of 'free' chlorides in concrete. Potentiodynamic measurements have shown that increase in temperature of the heat treatment of working electrodes by chlorides leads to a reduction of steel bars corrosion as a result of either the increase of the monochloride-aluminate content or the decrease of free chlorides amount. Chlorides bound in chloroaluminate hydrates do not cause activation of steel bars corrosion in concrete. It was also proven that the increase of free chlorides concentration in the concrete leads to intensification of steel bars corrosion. This additionally approves that free chlorides are only the activators of process of steel bars corrosion in the concrete.

  20. Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions

    Science.gov (United States)

    Ramesham, Rajeshuni; Kitiyakara, Amarit; Redick, Richard W., III; Sunada, Eric T.

    2011-01-01

    A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.

  1. Continuous wet-process growth of ZnO nanoarrays for wire-shaped photoanode of dye-sensitized solar cell.

    Science.gov (United States)

    Tao, Pan; Guo, Wanwan; Du, Jun; Tao, Changyuan; Qing, Shenglan; Fan, Xing

    2016-09-15

    Well-aligned ZnO nanorod arrays have been grown on metal-plated polymer fiber via a mild wet process in a newly-designed continuous reactor, aiming to provide wire-shaped photoanodes for wearable dye-sensitized solar cells. The growth conditions were systematically optimized with the help of computational flow-field simulation. The flow field in the reactor will not only affect the morphology of the ZnO nanorod⧹nanowire but also affect the pattern distribution of nanoarray on the electrode surface. Unlike the sectional structure from the traditional batch-type reactor, ZnO nanorods with finely-controlled length and uniform morphology could be grown from the continuous reactor. After optimization, the wire-shaped ZnO-type photoanode grown from the continuous reactor exhibited better photovoltaic performance than that from the traditional batch-type reactor. Copyright © 2016 Elsevier Inc. All rights reserved.

  2. Welding wire pressure sensor assembly

    Science.gov (United States)

    Morris, Timothy B. (Inventor); Milly, Peter F., Sr. (Inventor); White, J. Kevin (Inventor)

    1994-01-01

    The present invention relates to a device which is used to monitor the position of a filler wire relative to a base material being welded as the filler wire is added to a welding pool. The device is applicable to automated welding systems wherein nonconsumable electrode arc welding processes are utilized in conjunction with a filler wire which is added to a weld pool created by the electrode arc. The invention senses pressure deviations from a predetermined pressure between the filler wire and the base material, and provides electrical signals responsive to the deviations for actuating control mechanisms in an automatic welding apparatus so as to minimize the pressure deviation and to prevent disengagement of the contact between the filler wire and the base material.

  3. Void and Phase Evolution during the Processing of Bi-2212 Superconducting Wires monitored by combined fast Synchrotron Micro-tomography and X-Ray Diffraction

    CERN Document Server

    Scheuerlein, C; Scheel, M; Jiang, J; Kametani, F; Malagoli, A; Hellstrom, E E; Larbalestier, D C

    2011-01-01

    Recent study of the current-limiting mechanisms in Bi-2212 round wires has suggested that agglomeration of the residual Bi-2212 powder porosity into bubbles of filament-diameter size occurs on melting the Bi-2212 filaments. These pores introduce a major obstacle to current flow, which greatly reduces the critical current density (Jc). Here we present an in situ non-destructive tomographic and diffraction study of the changes occurring during the heat treatment of wires and starting powder, as well as a room temperature study of ex situ processed wires. The in situ through-process study shows that the agglomeration of residual porosity is more complex than previously seen. Filament changes start with coalescence of the quasi-uniform and finely divided powder porosity into lens-shaped defects at about 850 0C when the Bi-2201 impurity phase decomposes before the Bi-2212 starts to melt. These lens-shaped voids grow to bubbles of a filament diameter on melting of the Bi-2212 and continue to lengthen and then to ag...

  4. Bubble Formation within Filaments of Melt-Processed Bi2212 wires and its strongly negative effect on the Critical Current Density

    CERN Document Server

    Kametani, F; Jiang, J; Scheuerlein, C; Malagoli, A; Di Michiel, M; Huang, Y; Miao, H; Parrell, J A; Hellstrom, E E; Larbalestier, D C

    2011-01-01

    Most studies of Bi2Sr2CaCu2Ox (Bi2212) show that the critical current density Jc is limited by the connectivity of the filaments, but what determines the connectivity is still elusive. Here we report on the role played by filament porosity in limiting Jc. By a microstructural investigation of wires quenched from the melt state, we find that porosity in the unreacted wire agglomerates into bubbles that segment the Bi2212 melt within the filaments into discrete sections. These bubbles do not disappear during subsequent processing because they are only partially filled by Bi2212 grains as the Bi2212 forms on cooling. Correlating the microstructure of quenched wires to their final, fully processed Jc values shows an inverse relation between Jc and bubble density. Bubbles are variable between conductors and perhaps from sample to sample, but they occur frequently and almost completely fill the filament diameter, so they exert a strongly variable but always negative effect on Jc. Bubbles reduce the continuous Bi221...

  5. The impact of processing parameters on the properties of Zn-bonded Nd-Fe-B magnets

    Science.gov (United States)

    Kelhar, Luka; Zavašnik, Janez; McGuiness, Paul; Kobe, Spomenka

    2016-12-01

    We report on the effect of loading factor and pressure on the density and the magnetic properties of Zn-bonded Nd-Fe-B magnets produced by pulsed-electric-current sintering (PECS). The idea behind this study is to fabricate bonded magnets with a metallic binder in order for the bonded magnet to operate at temperatures higher than 180 °C: the current upper-limit for polymer-bonded magnets. These composites are made of hard-magnetic powder in the form of melt-spun ribbons bonded with the low-melting-point metal Zn. The binder additions were varied from 10 to 30 wt%, and pressures of 50 and 500 MPa were applied. The high-pressure mode with 20 wt% Zn resulted in a 24% increase of Jr, compared to the low-pressure mode. The magnetic measurements revealed a maximum remanence of 0.64 T for 10 wt% Zn, while the coercivity is largely unaffected by the processing conditions. The density of the composites was up to 7.0 g/cm3, corresponding to 94% of the theoretical density. Compared to commercial polymer-bonded magnets, the Zn-bonded counterparts exhibit a slightly lower Jr, but the coercivity is retained. We show that there is a minor diffusion of Zn into the Nd-Fe-B, forming a 1 μm thin transition layer, but it does not harm the magnetic properties. These metal-bonded Nd-Fe-B magnets are ideal for use in high-temperature automotive applications like under-the-hood sensors and other magnet-based devices that are close to the engine.

  6. New Bond Coat Materials for Thermal Barrier Coating Systems Processed Via Different Routes

    Science.gov (United States)

    Soare, A.; Csaki, I.; Sohaciu, M.; Oprea, C.; Soare, S.; Costina, I.; Petrescu, M. I.

    2017-06-01

    This paper aims at describing the development of new Ru-based Bond Coats (BC) as part of Thermal Barrier Coatings. The challenge of this research was to obtain an adherent and uniform layer of alumina protective layer after high temperature exposure. We have prepared a RuAl 50/50 at% alloy in an induction furnace which was subsequently subjected to oxidation in an electric furnace, in air, at 1100C, for 10h and 100h. Mechanical alloying of Ru and Al powders was another processing route used in an attempt to obtain a stoichiometric RuAl. The alloy was sintered by Spark Plasma Sintering (SPS) and then oxidized at 1100C for 1 and10h. The alloys obtained as such were analysed before and after oxidation using advanced microscopy techniques (SEM and TEM). The encouraging results in case of RuAl alloys prepared by induction melting reveal that we obtained an adherent and uniform layer of alumina, free of delta-Ru. The results for the samples processed by powder metallurgy were positive but need to be further investigated. We should note here the novelty of this method for this particular type of application - as a BC part of a TBC system.

  7. Films of covalently bonded gold nanoparticles synthesized by a sol–gel process

    International Nuclear Information System (INIS)

    Dell’Erba, Ignacio E.; Hoppe, Cristina E.; Williams, Roberto J. J.

    2012-01-01

    Gold nanoparticles (NPs) with a size close to 1.5 nm, coated with organic ligands bearing Si(OEt) 3 groups, were synthesized and used to obtain self-standing films by a sol–gel process catalyzed by formic acid. Using FESEM images, FTIR, and UV–visible spectra, it was observed that very small gold NPs self-assembled by Si–O–Si covalent bonds forming crosslinked clusters with sizes up to about 50 nm in which NPs preserve their individuality. The possibility of fixing very small gold NPs in a crosslinked film opens a variety of potential applications based on the specific properties of small-size particles. As an example, we illustrated the way in which one can take advantage of the low melting temperature of these NPs to generate tiny gold crystals partially embedded at the surface, a process that might be used for the development of catalysts or sensors. Besides, the shift and change in the intensity of the plasmon band produced by heating to 100 °C may be employed to develop an irreversible sensor of undesirable temperature excursions during the life-time of a specific product.

  8. Low-temperature bonding process for the fabrication of hybrid glass-membrane organ-on-a-chip devices

    Science.gov (United States)

    Pocock, Kyall J.; Gao, Xiaofang; Wang, Chenxi; Priest, Craig; Prestidge, Clive A.; Mawatari, Kazuma; Kitamori, Takehiko; Thierry, Benjamin

    2016-10-01

    The integration of microfluidics with living biological systems has paved the way to the exciting concept of "organs-on-a-chip," which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass-based devices have long been utilized in the field of microfluidics but the integration of alternative functional elements within multilayered glass microdevices, such as polymeric membranes, remains a challenge. To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimized on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650°C) and quartz/fused silica bonding (1050°C) processes, this method maintains the integrity and functionality of the membrane (Tg 150°C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 h, indicating sufficient bond strength for long-term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.

  9. Electrical wire explosion process of copper/silver hybrid nano-particle ink and its sintering via flash white light to achieve high electrical conductivity.

    Science.gov (United States)

    Chung, Wan-Ho; Hwang, Yeon-Taek; Lee, Seung-Hyun; Kim, Hak-Sung

    2016-05-20

    In this work, combined silver/copper nanoparticles were fabricated by the electrical explosion of a metal wire. In this method, a high electrical current passes through the metal wire with a high voltage. Consequently, the metal wire evaporates and metal nanoparticles are formed. The diameters of the silver and copper nanoparticles were controlled by changing the voltage conditions. The fabricated silver and copper nano-inks were printed on a flexible polyimide (PI) substrate and sintered at room temperature via a flash light process, using a xenon lamp and varying the light energy. The microstructures of the sintered silver and copper films were observed using a scanning electron microscope (SEM) and a transmission electron microscope (TEM). To investigate the crystal phases of the flash-light-sintered silver and copper films, x-ray diffraction (XRD) was performed. The absorption wavelengths of the silver and copper nano-inks were measured using ultraviolet-visible spectroscopy (UV-vis). Furthermore, the resistivity of the sintered silver and copper films was measured using the four-point probe method and an alpha step. As a result, the fabricated Cu/Ag film shows a high electrical conductivity (4.06 μΩcm), which is comparable to the resistivity of bulk copper (1.68 μΩcm). In addition, the fabricated Cu/Ag nanoparticle film shows superior oxidation stability compared to the Cu nanoparticle film.

  10. In-situ experimental evidence on R-phase related deformation processes in activated NiTi wires

    Czech Academy of Sciences Publication Activity Database

    Šittner, Petr; Sedlák, Petr; Landa, Michal; Novák, Václav; Lukáš, Petr

    438-440, - (2006), s. 579-584 ISSN 0921-5107 R&D Projects: GA AV ČR IAA1048107; GA ČR GA202/04/2016 Institutional research plan: CEZ:AV0Z10100520; CEZ:AV0Z10480505; CEZ:AV0Z20760514 Keywords : memory alloys * NiTi wires * ultrasonics * neutron diffraction Subject RIV: BM - Solid Matter Physics ; Magnetism

  11. The bonded in the chestnut-tree (Aesculus hippocastanum L.) bark water freezing process studied by means NMR method

    International Nuclear Information System (INIS)

    Haranczyk, H.; Weglarz, W.

    1994-01-01

    The bonded in the chestnut-tree (Aesculus hippocastanum L.) bark water freezing process was studied by means NMR method. The measured relaxation time (as a function of temperature) shows two compounds. First from solid state water (T 2 * 20 μs) and the second one from liquid water (T 2 * = 1 ms). This results are presented and discussed

  12. Application of irradiated wire

    International Nuclear Information System (INIS)

    Uda, I.; Kozima, K.; Suzuki, S.; Tada, S.; Torisu, S.; Veno, K.

    1984-01-01

    Rubber insulated wires are still useful for internal wiring in motor vehicles and electrical equipment because of flexibility and toughness. Irradiated cross-linked rubber materials have been successfully introduced for use with fusible link wire and helically coiled cord

  13. Noncontextual Wirings

    Science.gov (United States)

    Amaral, Barbara; Cabello, Adán; Cunha, Marcelo Terra; Aolita, Leandro

    2018-03-01

    Contextuality is a fundamental feature of quantum theory necessary for certain models of quantum computation and communication. Serious steps have therefore been taken towards a formal framework for contextuality as an operational resource. However, the main ingredient of a resource theory—a concrete, explicit form of free operations of contextuality—was still missing. Here we provide such a component by introducing noncontextual wirings: a class of contextuality-free operations with a clear operational interpretation and a friendly parametrization. We characterize them completely for general black-box measurement devices with arbitrarily many inputs and outputs. As applications, we show that the relative entropy of contextuality is a contextuality monotone and that maximally contextual boxes that serve as contextuality bits exist for a broad class of scenarios. Our results complete a unified resource-theoretic framework for contextuality and Bell nonlocality.

  14. A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles

    International Nuclear Information System (INIS)

    Hirose, Akio; Tatsumi, Hiroaki; Takeda, Naoya; Akada, Yusuke; Ogura, Tomo; Ide, Eiichi; Morita, Toshiaki

    2009-01-01

    The metal-to-metal bonding has been successfully achieved via the bonding process using Ag metallo-organic nanoparticles at a bonding temperature of around 300-, which can be alternative to the current microsoldering in electronics assembly using high-temperature solders. However, further reduction of bonding temperature and/or bonding pressure is needed. In the present research, a novel bonding process through in-situ formation of Ag nanoparticles instead of the filler material of the Ag metallo-organic nanoparticles has been developed. The Ag nanoparticles can form by the reduction of Ag 2 O particles. In this study, the Ag 2 O particles were mixed with triethylene glycol as a reducing agent to form a paste for bonding. The Au coated cylindrical specimens were bonded using the paste. The Ag nanoparticles formed at around 130 to 160 through the reduction process of Ag2O particles with triethylene glycol. The Ag nanoparticles were immediately sintered each other due to a great surface energy per volume. A transmission electron microscope observation revealed that the sintered Ag metallurgically bonded to the Au substrate at around 160 and a dense Ag layer formed after further heating. The tensile strength of the joint bonded at 250 under a bonding pressure of 5MPa was around 60MPa

  15. A process to fabricate fused silica nanofluidic devices with embedded electrodes using an optimized room temperature bonding technique

    Science.gov (United States)

    Boden, Seth; Karam, P.; Schmidt, A.; Pennathur, S.

    2017-05-01

    Fused silica is an ideal material for nanofluidic systems due to its extreme purity, chemical inertness, optical transparency, and native hydrophilicity. However, devices requiring embedded electrodes (e.g., for bioanalytical applications) are difficult to realize given the typical high temperature fusion bonding requirements (˜1000 °C). In this work, we optimize a two-step plasma activation process which involves an oxygen plasma treatment followed by a nitrogen plasma treatment to increase the fusion bonding strength of fused silica at room temperature. We conduct a parametric study of this treatment to investigate its effect on bonding strength, surface roughness, and microstructure morphology. We find that by including a nitrogen plasma treatment to the standard oxygen plasma activation process, the room temperature bonding strength increases by 70% (0.342 J/m2 to 0.578 J/m2). Employing this optimized process, we fabricate and characterize a nanofluidic device with an integrated and dielectrically separated electrode. Our results prove that the channels do not leak with over 1 MPa of applied pressure after a 24 h storage time, and the electrode exhibits capacitive behavior with a finite parallel resistance in the upper MΩ range for up to a 6.3Vdc bias. These data thus allow us to overcome the barrier that has barred nanofluidic progress for the last decade, namely, the development of nanometer scale well-defined channels with embedded metallic materials for far-reaching applications such as the exquisite manipulation of biomolecules.

  16. Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

    Science.gov (United States)

    Wu, Yuan-Yun

    In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a

  17. Modeling evolution of hydrogen bonding and stabilization of transition states in the process of cocaine hydrolysis catalyzed by human butyrylcholinesterase.

    Science.gov (United States)

    Gao, Daquan; Zhan, Chang-Guo

    2006-01-01

    Molecular dynamics (MD) simulations and quantum mechanical/molecular mechanical (QM/MM) calculations were performed on the prereactive enzyme-substrate complex, transition states, intermediates, and product involved in the process of human butyrylcholinesterase (BChE)-catalyzed hydrolysis of (-)-cocaine. The computational results consistently reveal a unique role of the oxyanion hole (consisting of G116, G117, and A199) in BChE-catalyzed hydrolysis of cocaine, compared to acetylcholinesterase (AChE)-catalyzed hydrolysis of acetylcholine. During BChE-catalyzed hydrolysis of cocaine, only G117 has a hydrogen bond with the carbonyl oxygen (O31) of the cocaine benzoyl ester in the prereactive BChE-cocaine complex, and the NH groups of G117 and A199 are hydrogen-bonded with O31 of cocaine in all of the transition states and intermediates. Surprisingly, the NH hydrogen of G116 forms an unexpected hydrogen bond with the carboxyl group of E197 side chain and, therefore, is not available to form a hydrogen bond with O31 of cocaine in the acylation. The NH hydrogen of G116 is only partially available to form a weak hydrogen bond with O31 of cocaine in some structures involved in the deacylation. The change of the estimated hydrogen-bonding energy between the oxyanion hole and O31 of cocaine during the reaction process demonstrates how the protein environment can affect the energy barrier for each step of the BChE-catalyzed hydrolysis of cocaine. These insights concerning the effects of the oxyanion hole on the energy barriers provide valuable clues on how to rationally design BChE mutants with a higher catalytic activity for the hydrolysis of (-)-cocaine. 2005 Wiley-Liss, Inc.

  18. Effects of Surface Treatment Processes of SiC Ceramic on Interfacial Bonding Property of SiC-AFRP

    Directory of Open Access Journals (Sweden)

    WEI Ru-bin

    2016-12-01

    Full Text Available To improve the interfacial bonding properties of SiC-aramid fiber reinforced polymer matrix composites (SiC-AFRP, the influences of etching process of SiC ceramic, coupling treatment process, and the adhesives types on the interfacial peel strength of SiC-AFRP were studied. The results show that the surface etching process and coupling treatment process of silicon carbide ceramic can effectively enhance interfacial bonding property of the SiC-AFRP. After soaked the ceramic in K3Fe(CN6 and KOH mixed etching solution for 2 hours, and coupled with vinyl triethoxy silane coupling agent, the interfacial peel strength of the SiC-AFRP significantly increases from 0.45kN/m to 2.20kN/m. EVA hot melt film with mass fraction of 15%VA is ideal for interface adhesive.

  19. Pulsed laser ablation of wire-shaped target in a thin water jet: effects of plasma features and bubble dynamics on the PLAL process

    International Nuclear Information System (INIS)

    Dell’Aglio, Marcella; De Giacomo, Alessandro; Kohsakowski, Sebastian; Barcikowski, Stephan; Wagener, Philipp; Santagata, Antonio

    2017-01-01

    In this paper, emission spectroscopy and fast imaging surveys during pulsed laser ablation in liquid (PLAL) for nanoparticles (NPs) production have been used, in order to provide further details about the process involved and the potentialities offered by a wire-shaped sample ablated in a flowing water jet. This kind of set-up has been explored because the laser ablation efficiency in water increases when a thin water layer and a wire-shaped target are used. In order to understand the physical processes causing the increasing ablation efficiency, both the laser-induced plasma and bubble dynamics generated in a flowing liquid jet have been analysed. The plasma parameters and the bubble behaviour in such a system have been compared with those observed in conventional PLAL experiments, where either a bulk or a wire-shaped target is immersed in bulk water. From the data presented here it is evidenced that the plasma and shockwave induced during the breakdown process can play a direct role in the ablation efficiency variation observed. With regard to the cavitation bubbles evolving near a free surface (the interface between water and air) it should be noted that these have to be treated with caution as a consequence of the strong influence played in these circumstances by the boundary of the water jet during its expansion dynamics. The effects due to the size of the liquid layer, the presence of the water/air interface, the liquid characteristics, the target shape, the plasma evolution and the bubble dynamics together with their outcomes on the NPs’ production, are presented and discussed. (paper)

  20. Plasma chemistry in wire chambers

    International Nuclear Information System (INIS)

    Wise, J.

    1990-05-01

    The phenomenology of wire chamber aging is discussed and fundamentals of proportional counters are presented. Free-radical polymerization and plasma polymerization are discussed. The chemistry of wire aging is reviewed. Similarities between wire chamber plasma (>1 atm dc-discharge) and low-pressure rf-discharge plasmas, which have been more widely studied, are suggested. Construction and use of a system to allow study of the plasma reactions occurring in wire chambers is reported. A proportional tube irradiated by an 55 Fe source is used as a model wire chamber. Condensable species in the proportional tube effluent are concentrated in a cryotrap and analyzed by gas chromatography/mass spectrometry. Several different wire chamber gases (methane, argon/methane, ethane, argon/ethane, propane, argon/isobutane) are tested and their reaction products qualitatively identified. For all gases tested except those containing methane, use of hygroscopic filters to remove trace water and oxygen contaminants from the gas resulted in an increase in the average molecular weight of the products, consistent with results from low-pressure rf-discharge plasmas. It is suggested that because water and oxygen inhibit polymer growth in the gas phase that they may also reduce polymer deposition in proportional tubes and therefore retard wire aging processes. Mechanistic implications of the plasma reactions of hydrocarbons with oxygen are suggested. Unresolved issues in this work and proposals for further study are discussed

  1. The impact of processing parameters on the properties of Zn-bonded Nd–Fe–B magnets

    Energy Technology Data Exchange (ETDEWEB)

    Kelhar, Luka, E-mail: luka.kelhar@ijs.si [Department for Nanostructured Materials, Jožef Stefan Institute, Jamova cesta 39, Ljubljana 1000 (Slovenia); Zavašnik, Janez [Centre for Electron Microscopy and Microanalysis (CEMM), Jamova cesta 39, Ljubljana 1000 (Slovenia); McGuiness, Paul; Kobe, Spomenka [Department for Nanostructured Materials, Jožef Stefan Institute, Jamova cesta 39, Ljubljana 1000 (Slovenia); Jožef Stefan International Postgraduate School, Jamova cesta 39, Ljubljana 1000 (Slovenia)

    2016-12-01

    We report on the effect of loading factor and pressure on the density and the magnetic properties of Zn-bonded Nd–Fe–B magnets produced by pulsed-electric-current sintering (PECS). The idea behind this study is to fabricate bonded magnets with a metallic binder in order for the bonded magnet to operate at temperatures higher than 180 °C: the current upper-limit for polymer-bonded magnets. These composites are made of hard-magnetic powder in the form of melt-spun ribbons bonded with the low-melting-point metal Zn. The binder additions were varied from 10 to 30 wt%, and pressures of 50 and 500 MPa were applied. The high-pressure mode with 20 wt% Zn resulted in a 24% increase of J{sub r}, compared to the low-pressure mode. The magnetic measurements revealed a maximum remanence of 0.64 T for 10 wt% Zn, while the coercivity is largely unaffected by the processing conditions. The density of the composites was up to 7.0 g/cm{sup 3}, corresponding to 94% of the theoretical density. Compared to commercial polymer-bonded magnets, the Zn-bonded counterparts exhibit a slightly lower J{sub r}, but the coercivity is retained. We show that there is a minor diffusion of Zn into the Nd–Fe–B, forming a 1 μm thin transition layer, but it does not harm the magnetic properties. These metal-bonded Nd–Fe–B magnets are ideal for use in high-temperature automotive applications like under-the-hood sensors and other magnet-based devices that are close to the engine. - Highlights: • Fabrication of Zn-bonded Nd–Fe–B magnets by pulsed electric current sintering. • Interesting for automotive applications with temperature exceeding 180 °C. • Variations of pressure and loading factor result in higher density and remanence. • Minor diffusion of Zn binder into the MQP-B ribbons is revealed, but does not decrease the magnetic properties. • More stable magnetic properties at high-temperature due to metallic Zn-binder.

  2. Concurrent growth of InSe wires and In2O3 tulip-like structures in the Au-catalytic vapour-liquid-solid process

    International Nuclear Information System (INIS)

    Taurino, A; Signore, M A

    2015-01-01

    In this work, the concurrent growth of InSe and In 2 O 3 nanostructures, obtained by thermal evaporation of InSe powders on Au-covered Si substrates, has been investigated by scanning and transmission electron microscopy techniques. The vapour-solid and Au catalytic vapour-liquid-solid growth mechanisms, responsible of the simultaneous development of the two different types of nanostructures, i.e. InSe wires and In 2 O 3 tulip-like structures respectively, are discussed in detail. The thermodynamic processes giving rise to the obtained morphologies and materials are explained. (paper)

  3. Concurrent growth of InSe wires and In2O3 tulip-like structures in the Au-catalytic vapour-liquid-solid process

    Science.gov (United States)

    Taurino, A.; Signore, M. A.

    2015-06-01

    In this work, the concurrent growth of InSe and In2O3 nanostructures, obtained by thermal evaporation of InSe powders on Au-covered Si substrates, has been investigated by scanning and transmission electron microscopy techniques. The vapour-solid and Au catalytic vapour-liquid-solid growth mechanisms, responsible of the simultaneous development of the two different types of nanostructures, i.e. InSe wires and In2O3 tulip-like structures respectively, are discussed in detail. The thermodynamic processes giving rise to the obtained morphologies and materials are explained.

  4. In-depth study of the mechanical properties for Fe{sub 3}Al based iron aluminide fabricated using the wire-arc additive manufacturing process

    Energy Technology Data Exchange (ETDEWEB)

    Shen, Chen; Pan, Zengxi, E-mail: zengxi@uow.edu.au; Cuiuri, Dominic; Dong, Bosheng; Li, Huijun

    2016-07-04

    An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate iron aluminide alloy in-situ, through separate feeding of pure Fe and Al wires into a molten pool that is generated by the gas tungsten arc welding (GTAW) process. This paper investigates the morphologies, chemical compositions and mechanical properties of the as-fabricated 30 at% Al iron aluminide wall components, and how these properties vary at different locations within the buildup wall. The tensile properties are also measured in different loading orientations; as epitaxial growth of large columnar grains is observed in the microstructures. Fe{sub 3}Al is the only phase detected in the middle buildup section of the wall structure, which constitutes the majority of the deposited material. The bottom section of the structure contains a dilution affected region where some acicular Fe{sub 3}AlC{sub 0.5} precipitates can be observed, induced by carbon from the steel substrate that was used for fabrication. The microhardness and chemical composition indicate relatively homogeneous material properties throughout the buildup wall. However, the tensile properties are very different in the longitudinal direction and normal directions, due to epitaxial growth of large columnar grains. In general, the results have demonstrated that the WAAM process is capable of producing full density in-situ-alloyed iron aluminide components with tensile properties that are comparable to powder metallurgy methods.

  5. In-depth study of the mechanical properties for Fe_3Al based iron aluminide fabricated using the wire-arc additive manufacturing process

    International Nuclear Information System (INIS)

    Shen, Chen; Pan, Zengxi; Cuiuri, Dominic; Dong, Bosheng; Li, Huijun

    2016-01-01

    An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate iron aluminide alloy in-situ, through separate feeding of pure Fe and Al wires into a molten pool that is generated by the gas tungsten arc welding (GTAW) process. This paper investigates the morphologies, chemical compositions and mechanical properties of the as-fabricated 30 at% Al iron aluminide wall components, and how these properties vary at different locations within the buildup wall. The tensile properties are also measured in different loading orientations; as epitaxial growth of large columnar grains is observed in the microstructures. Fe_3Al is the only phase detected in the middle buildup section of the wall structure, which constitutes the majority of the deposited material. The bottom section of the structure contains a dilution affected region where some acicular Fe_3AlC_0_._5 precipitates can be observed, induced by carbon from the steel substrate that was used for fabrication. The microhardness and chemical composition indicate relatively homogeneous material properties throughout the buildup wall. However, the tensile properties are very different in the longitudinal direction and normal directions, due to epitaxial growth of large columnar grains. In general, the results have demonstrated that the WAAM process is capable of producing full density in-situ-alloyed iron aluminide components with tensile properties that are comparable to powder metallurgy methods.

  6. PECULIARITIES OF FORMATION OF STRUCTURE AND PROPERTIES AT THERMO-MECHANICAL PROCESSING OF ROLLED WIRE OF NICKEL-MOLYBDENUM STEEL WITH WELDING FUNCTION

    OpenAIRE

    V. A. Lutsenko

    2012-01-01

    There are results of researches of the mechanical properties and structure of the wire rod made of low-carbon nickel molybdenum steel after reduction to toughness thermomechanical treatment in the stream of high-speed wire mill.

  7. Characterisation of the aqueous corrosion process in NdFeB melt spun ribbon and MQI bonded magnets

    Science.gov (United States)

    McCain, Stephen

    A major factor limiting the use and longevity of rare earth based magnetic materials is their susceptibility to aqueous corrosion and associated detrimental effects upon the magnetic properties of the material. This process was investigated through a combination of exposure to simulated environmental conditions and hydrogen absorption/desorption studies (HADS) in conjunction with magnetic characterisation. This study utilises NdFeB MQP-B melt-spun ribbon manufactured by Magnequench, in the form of MQI bonded magnets and also in its unbonded state as MQ powder. Specifically, it was concerned with how effective a variety of bonding media (epoxy resin,PTFE, zinc) and surface coatings (PTFE, Qsil, zinc LPPS, Dex-Cool) were at limiting the impact of aqueous corrosion in MQI bonded magnets. To characterise the effect of hydrogen absorption upon the magnetic properties of the MQP-B, hydrogen uptake was induced followed by a series of outgassing heat treatments with subsequent magnetic characterisation accompanied by HADS techniques performed after each outgas. This allowed comparisons to be made between the effects of aqueous corrosion process and hydrogen absorption upon the magnetic properties of the alloy.. This study has clearly demonstrated the link between the abundance of environmental moisture and rate of Hci losses in MQI bonded magnets. In addition to this the key mechanism responsible for the degradation of magnetic properties has been identified. These losses have been attributed to the absorption of hydrogen generated by the dissociation of water in the presence of NdFeB during the aqueous corrosion process. It has been shown that the use of a bonding media that is impermeable to water can limit the effects of aqueous corrosion by limiting water access to the Magnequench particles (MQP) and also the positive effects of the use of suitable surface coatings has been shown to be effective for the same reason..

  8. A real-time FPGA based monitoring and fault detection processing system for the Beam Wire Scanner instruments at CERN

    CERN Document Server

    AUTHOR|(CDS)2070252; Tognolini, Maurizio; Zamantzas, Christos

    The CERN Beam Instrumentation group (BE-BI) is designing a new generation of an instrument called Beam Wire Scanner (BWS). This system uses an actuator to move a very thin wire through a particle beams, back and forth with a movement stroke of pi [rad]. To achieve very fast speed when touching the particle beam with such a small stroke, large torque is applied while the expected smoothness of the displacement is crucial. This system relies on a resolver to determine the angular position and power correctly its Permanent Magnet Synchronous Motor (PMSM). In 2016, a failure of the position acquisition chain has highlighted the severe consequences of such problem, which resulted by 24 hours downtime of the Super Proton Synchrotron (SPS) accelerator with significant financial consequences. This work mitigates this single failure point by taking advantage of the existing redundancy in the sensors embedded on the system. The resolver is compared to two Incremental Optical Position Sensor (IOPS) developed in-house ...

  9. Nickel contaminated titanium weld wire study

    International Nuclear Information System (INIS)

    Coffin, G.R.; Sumstine, R.L.

    1979-01-01

    Attachment of thermocouples to fuel rod welding problems at Exxon Nuclear Company and INEL prompted an investigation study of the titanium filler wire material. It was found that the titanium filler wire was contaminated with nickel which was jacketed on the wire prior to the drawing process at the manufacturers. A method was developed to 100% inspect all filler wire for future welding application. This method not only indicates the presence of nickel contamination but indicates quantity of contamination. The process is capable of high speed inspection necessary for various high speed manufacturing processes

  10. Inhomogeneous wire explosion in water

    International Nuclear Information System (INIS)

    Hwangbo, C.K.; Kong, H.J.; Lee, S.S.

    1980-01-01

    Inhomogeneous processes are observed in underwater copper wire explosion induced by a condensed capacitor discharge. The wire used is 0.1 mm in diameter and 10 mm long, and the capacitor of 2 μF is charged to 5 KV. A N 2 laser is used for the diagnostic of spatial extension of exploding copper vapour. The photographs obtained in this experiment show unambiguously the inhomogeneous explosion along the exploding wire. The quenching of plasma by the surrounding water inhibits the expansion of the vapour. It is believed the observed inhomogeneous explosion along the wire is located and localized around Goronkin's striae, which was first reported by Goronkin and discussed by Froengel as a pre-breakdown phenomenon. (author)

  11. Attaching Copper Wires to Magnetic-Reed-Switch Leads

    Science.gov (United States)

    Kamila, Rudolf

    1987-01-01

    Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

  12. Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

    Science.gov (United States)

    Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

    2018-05-01

    Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

  13. Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

    Science.gov (United States)

    Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

    2018-03-01

    Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

  14. Evaluation and Optimization of a Hybrid Manufacturing Process Combining Wire Arc Additive Manufacturing with Milling for the Fabrication of Stiffened Panels

    Directory of Open Access Journals (Sweden)

    Fang Li

    2017-11-01

    Full Text Available This paper proposes a hybrid WAAM (wire arc additive manufacturing and milling process (HWMP, and highlights its application in the fabrication of stiffened panels that have wide applications in aviation, aerospace, and automotive industries, etc. due to their light weight and strong load-bearing capability. In contrast to existing joining or machining methods, HWMP only deposits stiffeners layer-by-layer onto an existing thin plate, followed by minor milling of the irregular surfaces, which provides the possibility to significantly improve material utilization and efficiency without any loss of surface quality. In this paper, the key performances of HWMP in terms of surface quality, material utilization and efficiency are evaluated systematically, which are the results of the comprehensive effects of the deposition parameters (e.g., travel speed, wire-feed rate and the milling parameters (e.g., spindle speed, tool-feed rate. In order to maximize its performances, the optimization is also performed to find the best combination of the deposition and the milling parameters. The case study shows that HWMP with the optimal process parameters improves the material utilization by 57% and the efficiency by 32% compared against the traditional machining method. Thus, HWMP is believed to be a more environmental friendly and sustainable method for the fabrication of stiffened panels or other similar structures.

  15. Piezoelectric and semiconducting coupled power generating process of a single ZnO belt/wire. A technology for harvesting electricity from the environment.

    Science.gov (United States)

    Song, Jinhui; Zhou, Jun; Wang, Zhong Lin

    2006-08-01

    This paper presents the experimental observation of piezoelectric generation from a single ZnO wire/belt for illustrating a fundamental process of converting mechanical energy into electricity at nanoscale. By deflecting a wire/belt using a conductive atomic force microscope tip in contact mode, the energy is first created by the deflection force and stored by piezoelectric potential, and later converts into piezoelectric energy. The mechanism of the generator is a result of coupled semiconducting and piezoelectric properties of ZnO. A piezoelectric effect is required to create electric potential of ionic charges from elastic deformation; semiconducting property is necessary to separate and maintain the charges and then release the potential via the rectifying behavior of the Schottky barrier at the metal-ZnO interface, which serves as a switch in the entire process. The good conductivity of ZnO is rather unique because it makes the current flow possible. This paper demonstrates a principle for harvesting energy from the environment. The technology has the potential of converting mechanical movement energy (such as body movement, muscle stretching, blood pressure), vibration energy (such as acoustic/ultrasonic wave), and hydraulic energy (such as flow of body fluid, blood flow, contraction of blood vessels) into electric energy that may be sufficient for self-powering nanodevices and nanosystems in applications such as in situ, real-time, and implantable biosensing, biomedical monitoring, and biodetection.

  16. Superconducting critical-current densities of commercial multifilamentary Nb3Sn(Ti) wires made by the bronze process

    International Nuclear Information System (INIS)

    Suenaga, M.; Tsuchiya, K.; Higuchi, N.; Tachikawa, K.

    1985-01-01

    Superconducting critical-current densities Jsub(c) in fields up to 24 T and at 4.2 and 1.8 K were measured for a number of commercial Nb 3 Sn wires which were alloyed with Ti. The best values of Jsub(c) at 20 T and at 4.2 and 1.8 K were 78 and 156 A mm -2 , respectively. In order to achieve these high current densities at H>20 T, it was shown that nonuniformity of the filaments had to be minimized. It was also shown that the grain size of Nb 3 Sn is not very important in determining Jsub(c) at these high magnetic fields, and that achieving high values of critical magnetic field Hsub(c2) is more important than small grain size. (author)

  17. Gold recovery from printed wiring board using bioleaching

    Energy Technology Data Exchange (ETDEWEB)

    Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

    2004-07-01

    In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

  18. Diffusion-bonded 16MND5-Inconel 690-316LN junction: elaboration and process residual stresses modeling

    International Nuclear Information System (INIS)

    Martinez, Michael

    1999-01-01

    The objective of this research thesis is, on the one hand, to elaborate and to characterise a bonded junction of 16MND5 and 316LN steels, and, on the other hand, to develop a simulation tool for the prediction of microstructures after bonding, as well as residual stresses related to this process. The author first reports the study of the use of diffusion bonding by hot isostatic pressing (HIP diffusion bonding) for the bonding of 16MND5 (steel used in French PWR vessel) and 316LN (austenitic stainless steel used in piping), in order to obtain junctions adapted to a use within PWRs. In this case, the use of an Inconel insert material appeared to be necessary to avoid stainless steel carburization. Thus, inserts in Inconel 600 and 690 have been tested. The objective has then been to develop a realistic calculation of residual stresses in this assembly. These stresses are stimulated by quenching. The author notably studied the simulation of temperature dependent phase transformations, and stress induced phase transformations. An existing model is validated and applied to HIP and quenching cycles. The last part reports the calculation of residual stresses by simulation of the mechanical response of the three-component material cooled from 900 C to room temperature and thus submitted to a loading of thermal origin (dilatation) and metallurgical origin (phase transformations in the 16MND5). The effect of carbon diffusion on mechanical properties has also been taken into account. The author discusses problems faced by existing models, and explains the choice of conventional macro-mechanical models. The three materials are supposed to have a plastic-viscoplastic behaviour with isotropic and kinematic strain hardening, and this behaviour is identified between 20 and 900 C [fr

  19. Wire breakage in SLC wire profile monitors

    International Nuclear Information System (INIS)

    Field, C.; McCormick, D.; Raimondi, P.; Ross, M.

    1998-05-01

    Wire scanning beam profile monitors are used at the Stanford Linear Collider (SLC) for emittance preservation control and beam optics optimization. Twenty such scanners have proven most useful for this purpose and have performed a total of 1.5 million scans in the 4 to 6 years since their installation. Most of the essential scanners are equipped with 20 to 40 microm tungsten wires. SLC bunch intensities and sizes often exceed 2 x 10 7 particles/microm 2 (3C/m 2 ). The authors believe that this has caused a number of tungsten wire failures that appear at the ends of the wire, near the wire support points, after a few hundred scans are accumulated. Carbon fibers, also widely used at SLAC, have been substituted in several scanners and have performed well. In this paper, the authors present theories for the wire failure mechanism and techniques learned in reducing the failures

  20. Analysis of the residual strain change of Bi2212, Ag alloy and Ag during the heating and cooling process in Bi2212/Ag/Ag alloy composite wire

    International Nuclear Information System (INIS)

    Shin, J K; Ochiai, S; Okuda, H; Mukai, Y; Sugano, M; Sato, M; Oh, S S; Ha, D W; Kim, S C

    2008-01-01

    The residual strain change of Bi2212 and Ag during the cooling and heating process in the Bi2212/Ag/Ag alloy composite superconductor was studied. First, the residual strain of Bi2212 filaments at room temperature was measured by the x-ray diffraction method. Then, the Young's moduli of the constituents (Bi2212 filaments, Ag and Ag alloy) and yield strains of Ag and Ag alloy were estimated from the analysis of the measured stress-strain curve, based on the rule of mixtures. Also, the coefficient of thermal expansion of the Bi2212 filaments was estimated from the analysis of the measured thermal expansion curve of the composite wire. From the modeling analysis using the estimated property values and the residual strain of Bi2212 filaments, the changes of residual strain of Bi2212, Ag alloy and Ag with temperature during the cooling and heating process were revealed

  1. Effect of process on the magnetic properties of bonded NdFeB magnet

    International Nuclear Information System (INIS)

    Li, J.; Liu, Y.; Gao, S.J.; Li, M.; Wang, Y.Q.; Tu, M.J.

    2006-01-01

    The effects of magnetic separation, coupling treatment, lubricating treatment, preform and biaxial molding on the density and magnetic properties of bonded NdFeB magnet were investigated. The results demonstrate that magnetic separation separates the powders with low coercive force; coupling treatment improves the interfaces between the powders and the binders; decrease in volume fraction of the binder increases magnetic properties of the magnet; granular arrangement improves both the magnetic and mechanical properties when powders are arranged in certain size; lubricating treatment improves the formability of the magnet and preform and biaxial molding improves both density and magnetic properties greatly. Combining these methods, the density of the bonded NdFeB magnet can reach 6.52 g/cm 3 and the maximum energy product can reach 114 kJ/m 3

  2. Effect of process on the magnetic properties of bonded NdFeB magnet

    Energy Technology Data Exchange (ETDEWEB)

    Li, J. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China); Liu, Y. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China)]. E-mail: liuying5536@163.com; Gao, S.J. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China); Li, M. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China); Wang, Y.Q. [South-West Magnetic Science and Technology Developing Company, Mianyang, 621600 (China); Tu, M.J. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China)

    2006-04-15

    The effects of magnetic separation, coupling treatment, lubricating treatment, preform and biaxial molding on the density and magnetic properties of bonded NdFeB magnet were investigated. The results demonstrate that magnetic separation separates the powders with low coercive force; coupling treatment improves the interfaces between the powders and the binders; decrease in volume fraction of the binder increases magnetic properties of the magnet; granular arrangement improves both the magnetic and mechanical properties when powders are arranged in certain size; lubricating treatment improves the formability of the magnet and preform and biaxial molding improves both density and magnetic properties greatly. Combining these methods, the density of the bonded NdFeB magnet can reach 6.52 g/cm{sup 3} and the maximum energy product can reach 114 kJ/m{sup 3}.

  3. Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Oh Young; Jung, Hoon Sun; Lee, Jung Hoon; Choa, Sung-Hoon [Seoul Nat’l Univ. of Science and Technology, Seoul (Korea, Republic of)

    2017-06-15

    In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

  4. MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

    NARCIS (Netherlands)

    Tang, J.

    2014-01-01

    The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400

  5. Base Information Transport Infrastructure Wired (BITI Wired)

    Science.gov (United States)

    2016-03-01

    2016 Major Automated Information System Annual Report Base Information Transport Infrastructure Wired (BITI Wired) Defense Acquisition Management...Combat Information Transport System program was restructured into two pre-Major Automated Information System (pre-MAIS) components: Information...Major Automated Information System MAIS OE - MAIS Original Estimate MAR – MAIS Annual Report MDA - Milestone Decision Authority MDD - Materiel

  6. Resistance microwelding of 316L stainless steel wire to block

    DEFF Research Database (Denmark)

    Friis, Kasper Storgaard; Khan, M.I.; Bay, Niels

    2011-01-01

    The excellent corrosion resistance of low carbon vacuum melted 316 stainless steel coupled with its non-magnetic properties makes it ideal for biomedical applications. The typical joint geometry for microcomponents, such as medical implants, includes joining of fine wire to a larger block. However......, this type of joint has received little attention in the current literature. The present study was conducted to examine the microstructure and mechanical properties of low carbon vacuum melted 316 stainless steel wire welded to a larger block. Results revealed solid state bonding occurring at low currents......, while fusion bonding occurred at higher currents. This was due to the highly asymmetrical heat generation resulting in almost complete melting of the wire before the initiation of interfacial melting. This is a distinctly different bonding mechanism compared to previous studies on crossed wire joints....

  7. On grouping individual wire segments into equivalent wires or chains, and introduction of multiple domain basis functions

    CSIR Research Space (South Africa)

    Lysko, AA

    2009-06-01

    Full Text Available The paper introduces a method to cover several wire segments with a single basis function, describes related practical algorithms, and gives some results. The process involves three steps: identifying chains of wire segments, splitting the chains...

  8. Water Desalination with Wires

    NARCIS (Netherlands)

    Porada, S.; Sales, B.B.; Hamelers, H.V.M.; Biesheuvel, P.M.

    2012-01-01

    We show the significant potential of water desalination using a novel capacitive wire-based technology in which anode/cathode wire pairs are constructed from coating a thin porous carbon electrode layer on top of electrically conducting rods (or wires). By alternately dipping an array of electrode

  9. Steer-by-wire innovations and demonstrator

    NARCIS (Netherlands)

    Lupker, H.A.; Zuurbier, J.; Verschuren, R.M.A.F.; Jansen, S.T.H.; Willemsen, D.M.C.

    2002-01-01

    Arguments for 'by-wire' systems include production costs, packaging and traffic safety. Innovations concern both product and development process e.g. combined virtual engineering and Hardware-in-the-loop testing. Three Steer-by-wire systems are discussed: a steering system simulator used as a

  10. Ultrasonic friction power during thermosonic Au and Cu ball bonding

    International Nuclear Information System (INIS)

    Shah, A; Mayer, M; Zhou, Y; Qin, I; Huynh, C; Meyer, M

    2010-01-01

    The ultrasonic friction power during thermosonic ball bonding with Au and Cu wires, both 25 μm in diameter, is derived with an improved method from experimental measurements during the bonding process. Experimental data include the current delivered to the ultrasonic transducer and the tangential force measured using piezoresistive microsensors integrated close to the Al bonding pad. The improvement results from a new, more accurate method to derive the mechanical compliance of the ultrasonic system. The method employs a bond process modification in which the ultrasonic current is ramped up sequentially in three steps. In the first two steps, the ultrasonic current is set to levels that are too low to cause sliding. The bonding takes place during the third step, when the current is ramped up to the optimum value required for making good quality bonds. The ultrasonic compliance values are derived from the first two steps and are 8.2 ± 0.5 μm N -1 and 7.7 ± 0.5 μm N -1 for the Au and Cu processes, respectively. These values are determined within an average error estimate of ±6%, substantially lower than the ±10% estimated with a previously reported method. The ultrasonic compliance in the case of Au is 6% higher due to the lower elastic modulus of Au compared with that of Cu. Typical maximum values of relative sliding amplitude of ultrasonic friction at the interface are 655 nm and 766 nm for the Au and Cu processes. These values are 81% of the free-air vibration amplitude of the bonding capillary tip for the respective ultrasonic current settings. Due to bond growth, which damps relative motion between the ball and the pad, the final relative amplitude at the bond interface is reduced to 4% of the equivalent free-air amplitude. Even though the maximum value of relative amplitude is 17% higher in the Cu process compared with the Au process, the average total interfacial sliding is 519 μm in the Cu process, which is 31% lower than that in the Au process (759

  11. EBSD characterization of an IF steel processed by Accumulative Roll Bonding

    International Nuclear Information System (INIS)

    Cruz-Gandarilla, F; Salcedo-Garrido, A M; Avalos, M; Bolmaro, R; Baudin, T; Cabañas-Moreno, J G; Dorantes-Rosales, H J

    2015-01-01

    The objective of this work is to study the texture and microstructure evolution of an IF steel deformed by Accumulative Roll Bonding (ARB) using Electron Backscatter Diffraction. Texture changes occur with increasing number of ARB cycles. For the early cycles, the main components are the α and γ fiber components characteristic of steels. With increasing the number of ARB cycles a tendency towards a random texture is obtained. In the initial state, the mean grain size is 30 μm and after 5 cycles it decreases to 1.2 μm. For the first ARB cycles, the fraction of high angle grain boundary is low but it increases with the number of cycles to about 80% for 5 cycles. The Kernel Average Misorientation (KAM) has no appreciable changes with the number of ARB cycles for all the texture components. (paper)

  12. Mechanical properties of intermetallics formed during thermal aging of Cu-Al ball bonds

    NARCIS (Netherlands)

    Kouters, M.H.M.; Gubbels, G.H.M.; O'Halloran, O.; Rongen, R.; Weltevreden, E.R.

    2011-01-01

    In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the

  13. Characterization of intermetallic compounds in Cu-Al ball bonds: layer growth, mechanical properties and oxidation

    NARCIS (Netherlands)

    Kouters, M.H.M.; Gubbels, G.H.M.; O'Halloran, O.; Rongen, R.

    2011-01-01

    In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1 st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the

  14. PECULIARITIES OF FORMATION OF STRUCTURE AND PROPERTIES AT THERMO-MECHANICAL PROCESSING OF ROLLED WIRE OF NICKEL-MOLYBDENUM STEEL WITH WELDING FUNCTION

    Directory of Open Access Journals (Sweden)

    V. A. Lutsenko

    2012-01-01

    Full Text Available There are results of researches of the mechanical properties and structure of the wire rod made of low-carbon nickel molybdenum steel after reduction to toughness thermomechanical treatment in the stream of high-speed wire mill.

  15. Sensitive and simple method for measuring wire tensions

    International Nuclear Information System (INIS)

    Atac, M.; Mishina, M.

    1982-08-01

    Measuring tension of wires in drift chambers and multiwire proportional chambers after construction is an important process because sometimes wires get loose after soldering, crimping or glueing. One needs to sort out wires which have tensions below a required minimum value to prevent electrostatic instabilities. There have been several methods reported on this subject in which the wires were excited either with sinusoidal current under magnetic field or with sinusoidal voltage electrostatically coupled to the wire, searching for a resonating frequency with which the wires vibrate mechanically. Then the vibration is detected either visually, optically or with magnetic pick-up directly touching the wires. Any of these is only applicable to the usual multiwire chamber which has open access to the wire plane. They also need fairly large excitation currents to induce a detectable vibration to the wires. Here we report a very simple method that can be used for any type of wire chamber or proportional tube system for measuring wire tension. Only a very small current is required for the wire excitation to obtain a large enough signal because it detects the induced emf voltage across a wire. A sine-wave oscillator and a digital voltmeter are sufficient devices aside from a permanent magnet to provide the magnetic field around the wire. A useful application of this method to a large system is suggested

  16. PS wire chamber

    CERN Multimedia

    1970-01-01

    A wire chamber used at CERN's Proton Synchrotron accelerator in the 1970s. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  17. Effect of wire shape on wire array discharge

    Energy Technology Data Exchange (ETDEWEB)

    Shimomura, N.; Tanaka, Y.; Yushita, Y.; Nagata, M. [University of Tokushima, Department of Electrical and Electronic Engineering, Tokushima (Japan); Teramoto, Y.; Katsuki, S.; Akiyama, H. [Kumamoto University, Department of Electrical and Computer Engineering, Kumamoto (Japan)

    2001-09-01

    Although considerable investigations have been reported on z-pinches to achieve nuclear fusion, little attention has been given from the point of view of how a wire array consisting of many parallel wires explodes. Instability existing in the wire array discharge has been shown. In this paper, the effect of wire shape in the wire array on unstable behavior of the wire array discharge is represented by numerical analysis. The claws on the wire formed in installation of wire may cause uniform current distribution on wire array. The effect of error of wire diameter in production is computed by Monte Carlo Method. (author)

  18. Effect of wire shape on wire array discharge

    International Nuclear Information System (INIS)

    Shimomura, N.; Tanaka, Y.; Yushita, Y.; Nagata, M.; Teramoto, Y.; Katsuki, S.; Akiyama, H.

    2001-01-01

    Although considerable investigations have been reported on z-pinches to achieve nuclear fusion, little attention has been given from the point of view of how a wire array consisting of many parallel wires explodes. Instability existing in the wire array discharge has been shown. In this paper, the effect of wire shape in the wire array on unstable behavior of the wire array discharge is represented by numerical analysis. The claws on the wire formed in installation of wire may cause uniform current distribution on wire array. The effect of error of wire diameter in production is computed by Monte Carlo Method. (author)

  19. Wiring Damage Analyses for STS OV-103

    Science.gov (United States)

    Thomas, Walter, III

    2006-01-01

    This study investigated the Shuttle Program s belief that Space Transportation System (STS) wiring damage occurrences are random, that is, a constant occurrence rate. Using Problem Reporting and Corrective Action (PRACA)-derived data for STS Space Shuttle OV-103, wiring damage was observed to increase over the vehicle s life. Causal factors could include wiring physical deterioration, maintenance and inspection induced damage, and inspection process changes resulting in more damage events being reported. Induced damage effects cannot be resolved with existent data. Growth analysis (using Crow-AMSAA, or CA) resolved maintenance/inspection effects (e.g., heightened awareness) on all wire damages and indicated an overall increase since Challenger Return-to-Flight (RTF). An increasing failure or occurrence rate per flight cycle was seen for each wire damage mode; these (individual) rates were not affected by inspection process effects, within statistical error.

  20. Modeling and simulation of the fluid flow in wire electrochemical machining with rotating tool (wire ECM)

    Science.gov (United States)

    Klocke, F.; Herrig, T.; Zeis, M.; Klink, A.

    2017-10-01

    Combining the working principle of electrochemical machining (ECM) with a universal rotating tool, like a wire, could manage lots of challenges of the classical ECM sinking process. Such a wire-ECM process could be able to machine flexible and efficient 2.5-dimensional geometries like fir tree slots in turbine discs. Nowadays, established manufacturing technologies for slotting turbine discs are broaching and wire electrical discharge machining (wire EDM). Nevertheless, high requirements on surface integrity of turbine parts need cost intensive process development and - in case of wire-EDM - trim cuts to reduce the heat affected rim zone. Due to the process specific advantages, ECM is an attractive alternative manufacturing technology and is getting more and more relevant for sinking applications within the last few years. But ECM is also opposed with high costs for process development and complex electrolyte flow devices. In the past, few studies dealt with the development of a wire ECM process to meet these challenges. However, previous concepts of wire ECM were only suitable for micro machining applications. Due to insufficient flushing concepts the application of the process for machining macro geometries failed. Therefore, this paper presents the modeling and simulation of a new flushing approach for process assessment. The suitability of a rotating structured wire electrode in combination with an axial flushing for electrodes with high aspect ratios is investigated and discussed.

  1. Experimental study on underwater electrical explosion of a copper wire

    International Nuclear Information System (INIS)

    Zhou Qing; Zhang Jun; Tan Xiangyu; Ren Baozhong; Zhang Qiaogen

    2010-01-01

    Through analyzing the physical process of underwater electrical wire explosion, electrical wire explosions with copper wires were investigated underwater using pulsed voltage in the time scale of a few microseconds. A self-integrating Rogowsky coil and a voltage divider were used for current and voltage at the wire load, respectively. The shock wave pressure is measured with a piezoelectric pressure probe at the same distance. The current rise rate was adjusted by changing the applied voltage, circuit inductance, length and diameter of copper wire. The change of the current rise rate had a great effect on the process of underwater electrical wire explosion with copper wires. At last, the effect of discharge voltage, circuit inductance, length and diameter of copper wire were obtained on the explosion voltage and current as well as shock wave pressure. (authors)

  2. Multi-Response Optimization and Regression Analysis of Process Parameters for Wire-EDMed HCHCr Steel Using Taguchi’s Technique

    Directory of Open Access Journals (Sweden)

    K. Srujay Varma

    2017-04-01

    Full Text Available In this study, effect of machining process parameters viz. pulse-on time, pulse-off time, current and servo-voltage for machining High Carbon High Chromium Steel (HCHCr using copper electrode in wire EDM was investigated. High Carbon High Chromium Steel is a difficult to machine alloy, which has many applications in low temperature manufacturing, and copper is chosen as electrode as it has good electrical conductivity and most frequently used electrode all over the world. Tool making culture of copper has made many shops in Europe and Japan to used copper electrode. Experiments were conducted according to Taguchi’s technique by varying the machining process parameters at three levels. Taguchi’s method based on L9 orthogonal array was followed and number of experiments was limited to 9. Experimental cost and time consumption was reduced by following this statistical technique. Targeted output parameters are Material Removal Rate (MRR, Vickers Hardness (HV and Surface Roughness (SR. Analysis of Variance (ANOVA and Regression Analysis was performed using Minitab 17 software to optimize the parameters and draw relationship between input and output process parameters. Regression models were developed relating input and output parameters. It was observed that most influential factor for MRR, Hardness and SR are Ton, Toff and SV.

  3. GaN microring waveguide resonators bonded to silicon substrate by a two-step polymer process.

    Science.gov (United States)

    Hashida, Ryohei; Sasaki, Takashi; Hane, Kazuhiro

    2018-03-20

    Using a polymer bonding technique, GaN microring waveguide resonators were fabricated on a Si substrate for future hybrid integration of GaN and Si photonic devices. The designed GaN microring consisted of a rib waveguide having a core of 510 nm in thickness, 1000 nm in width, and a clad of 240 nm in thickness. A GaN crystalline layer of 1000 nm in thickness was grown on a Si(111) substrate by metal organic chemical vapor deposition using a buffer layer of 300 nm in thickness for the compensation of lattice constant mismatch between GaN and Si crystals. The GaN/Si wafer was bonded to a Si(100) wafer by a two-step polymer process to prevent it from trapping air bubbles. The bonded GaN layer was thinned from the backside by a fast atom beam etching to remove the buffer layer and to generate the rib waveguides. The transmission characteristics of the GaN microring waveguide resonators were measured. The losses of the straight waveguides were measured to be 4.0±1.7  dB/mm around a wavelength of 1.55 μm. The microring radii ranged from 30 to 60 μm, where the measured free-spectral ranges varied from 2.58 to 5.30 nm. The quality factors of the microring waveguide resonators were from 1710 to 2820.

  4. Signals analysis of fluxgate array for wire rope defaults

    International Nuclear Information System (INIS)

    Gu Wei; Chu Jianxin

    2005-01-01

    In order to detecting the magnetic leakage fields of the wire rope defaults, a transducer made up of the fluxgate array is designed, and a series of the characteristic values of wire rope defaults signals are defined. By processing the characteristic signals, the LF or LMA of wire rope are distinguished, and the default extent is estimated. The experiment results of the new method for detecting the wire rope faults are introduced

  5. Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process

    Energy Technology Data Exchange (ETDEWEB)

    Fattah-alhosseini, A. [Department of Materials Engineering, Bu-Ali Sina University, Hamedan 65178-38695 (Iran, Islamic Republic of); Imantalab, O., E-mail: o.imantalab@gmail.com [Department of Materials Engineering, Bu-Ali Sina University, Hamedan 65178-38695 (Iran, Islamic Republic of); Mazaheri, Y. [Department of Materials Engineering, Bu-Ali Sina University, Hamedan 65178-38695 (Iran, Islamic Republic of); Keshavarz, M.K. [Department of Engineering Physics, Polytechnique Montreal, Montreal (Canada)

    2016-01-05

    In this study, the microstructural evolution, mechanical properties, and strain hardening behavior of commercial pure copper processed by the accumulative roll bonding (ARB) were investigated. Transmission electron microscopy (TEM) micrographs and atomic force microscopy (AFM) images indicated that with increasing the number of ARB cycles, the grain size of samples decreased. An Ultrafine grained (UFG) structure with an average grain size of about 200 nm was achieved after four cycles of ARB. The yield and ultimate tensile strength of pure copper with the UFG microstructure was reached about 360 MPa and 396 MPa (about 400% and 100% higher than that of the annealed state), respectively. All ARB-processed copper samples showed lower strain hardening exponent in comparison with the annealed state. Moreover, the strain hardening rate increased with increasing ARB cycles up to 3 cycles and then decreased.

  6. Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process

    International Nuclear Information System (INIS)

    Fattah-alhosseini, A.; Imantalab, O.; Mazaheri, Y.; Keshavarz, M.K.

    2016-01-01

    In this study, the microstructural evolution, mechanical properties, and strain hardening behavior of commercial pure copper processed by the accumulative roll bonding (ARB) were investigated. Transmission electron microscopy (TEM) micrographs and atomic force microscopy (AFM) images indicated that with increasing the number of ARB cycles, the grain size of samples decreased. An Ultrafine grained (UFG) structure with an average grain size of about 200 nm was achieved after four cycles of ARB. The yield and ultimate tensile strength of pure copper with the UFG microstructure was reached about 360 MPa and 396 MPa (about 400% and 100% higher than that of the annealed state), respectively. All ARB-processed copper samples showed lower strain hardening exponent in comparison with the annealed state. Moreover, the strain hardening rate increased with increasing ARB cycles up to 3 cycles and then decreased.

  7. Investigation of method for Stainless Steel Welding Wire as a Replacement for Arc Wire Comsumables

    Directory of Open Access Journals (Sweden)

    Koiprasert, H.

    2005-01-01

    Full Text Available Arc spraying as a coating method is being employed in various industrial applications as a part of maintenance service, and also as a surface engineering technique for many machine parts and components. The major cost in producing the arc spray coating is, however, based on the cost of the arc wire comsumables. This project was carried out to investigate the use of the commercially-available gas metal arc welding wire (GMAW wire as a cheaper alternative to the special-purpose arc wire comsumables. The wire material chosen for this early study is the 316L stainless steel, due to its popularity in many applications as a built-up coating for worn parts. The physical properties of the coatings produced from the two sets of 316L stainless steel wire were determined to be different in the percentage of porosity and the oxide content. The mechanical properties, including the tensile bond strength and the wear rate of the coatings produced from the two types of sprayed wire, were also different. This will, in turn, result in a slight difference in the performance of thecoatings.

  8. SPECIFIC FEATURES OF TECHNOLOGY OF MANUFACTURING A ZINC-COATED TUB WIRE FOR MUZZLE (BOTTLE’ HOOD WIRE

    Directory of Open Access Journals (Sweden)

    D. B. Zuev

    2016-01-01

    Full Text Available The paper presents the main technical specifications of galvanized low carbon wire for muzzles (bottle’hood wire, consistent with the exploitation requirements to the wire in the manufacture and use of muzzles. The main criteria when selecting the steel grade and upon selection of the technological processes are given. 

  9. Modeling of thin films growth processes in the early stage for atoms with covalent bonds

    International Nuclear Information System (INIS)

    Tupik, V A; Margolin, V I; Su, Chu Trong

    2017-01-01

    Computer simulation for obtaining thin film’s growth process at an early stage with the proposed model of atoms with isotropic and anisotropic interactions been considered. Carrying out the procedure for analyzing the problem on the basis of the program being implemented, computer simulation of thin film growth processes has been carried out on several examples. The results of computer simulation of the growth process of thin film on a given substrate and an aggregate in a vacuum condition are shown. Some characteristic distributions of the obtained structure have been carried out to evaluate the proposed adequate model and to reflect the high complexity of thin films growth process. (paper)

  10. In-situ X-ray photoelectron spectroscopy characterization of Si interlayer based surface passivation process for AlGaAs/GaAs quantum wire transistors

    Energy Technology Data Exchange (ETDEWEB)

    Akazawa, Masamichi; Hasegawa, Hideki; Jia, Rui [Research Center for Integrated Quantum Electronics and Graduate School of Information Science and Technology, Hokkaido University, N-13, W-8, Sapporo 060-8628 (Japan)

    2007-04-15

    Detailed properties of the Si interface control layer (Si ICL)-based surface passivation structure are characterized by in-situ X-ray photoelectron spectroscopy (XPS) in an ultra-high vacuum multi-chamber system. Si ICLs were grown by molecular beam epitaxy (MBE) on GaAs and AlGaAs(001) and (111)B surfaces, and were partially converted to SiN{sub x} by nitrogen radical beam. Freshly MBE-grown clean GaAs and AlGaAs surfaces showed strong Fermi level pinning. Large shifts of the surface Fermi level position corresponding to reduction of pinning took place after Si ICL growth, particularly on (111)B surface (around 500 meV). However, subsequent surface nitridation increased pinning again. Then, a significant reduction of pinning was obtained by changing SiN{sub x} to silicon oxynitride by intentional air-exposure and subsequent annealing. This has led to realization of a stable passivation structure with an ultrathin oxynitride/Si ICL structure which prevented subcutaneous oxidation during further device processing under air-exposure. The Si-ICL-based passivation process was applied to surface passivation of quantum wire (QWR) transistors where anomalously large side-gating phenomenon was completely eliminated. (copyright 2007 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  11. A processing enzyme cleaving avian progastrin at post-Phe bonds

    DEFF Research Database (Denmark)

    Jensen, H; Ørskov, C; Rehfeld, J F

    2001-01-01

    Neuroendocrine peptides mature partly through endoproteolytic processing of long precursor forms. Best characterised is cleavage at mono- and dibasic residues, but additional sites also exist. Among these is post-Phe cleavage, first suggested to participate in the processing of chicken progastrin...

  12. Interfacial layers evolution during annealing in Ti-Al multi-laminated composite processed using hot press and roll bonding

    Science.gov (United States)

    Assari, A. H.; Eghbali, B.

    2016-09-01

    Ti-Al multi-laminated composites have great potential in high strength and low weight structures. In the present study, tri-layer Ti-Al composite was synthesized by hot press bonding under 40 MPa at 570 °C for 1 h and subsequent hot roll bonding at about 450 °C. This process was conducted in two accumulative passes to 30% and to 67% thickness reduction in initial and final passes, respectively. Then, the final annealing treatments were done at 550, 600, 650, 700 and 750 °C for 2, 4 and 6 h. Investigations on microstructural evolution and thickening of interfacial layers were performed by scanning electron microscopes, energy dispersive spectrometer, X-ray diffraction and micro-hardness tests. The results showed that the thickening of diffusion layers corresponds to amount of deformation. In addition to thickening of the diffusion layers, the thickness of aluminum layers decreased and after annealing treatment at 750 °C for 6 h the aluminum layers were consumed entirely, which occurred because of the enhanced interdiffusion of Ti and Al elements. Scanning electron microscope equipped with energy dispersive spectrometer showed that the sequence of interfacial layers as Ti3Al-TiAl-TiAl2-TiAl3 which are believed to be the result of thermodynamic and kinetic of phase formation. Micro-hardness results presented the variation profile in accordance with the sequence of intermetallic phases and their different structures.

  13. A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist

    International Nuclear Information System (INIS)

    Vulto, Paul; Urban, G A; Huesgen, Till; Albrecht, Björn

    2009-01-01

    A full-wafer process is presented for fast and simple fabrication of glass microfluidic chips with integrated electroplated electrodes. The process employs the permanent dry film resist (DFR) Ordyl SY300 to create microfluidic channels, followed by electroplating of silver and subsequent chlorination. The dry film resist is bonded directly to a second substrate, without intermediate gluing layers, only by applying pressure and moderate heating. The process of microfluidic channel fabrication, electroplating and wafer bonding can be completed within 1 day, thus making it one of the fastest and simplest full-wafer fabrication processes. (note)

  14. Local reinforcement of magnesium components by friction processing. Determination of bonding mechanisms and assessment of joint properties

    Energy Technology Data Exchange (ETDEWEB)

    Pinheiro, G.A. [GKSS-Forschungszentrum Geesthacht GmbH (Germany). Inst. fuer Materialforschung

    2008-07-01

    The development of new creep-resistant and cost effective die casting magnesium alloys, such as AE, MRI, MEZ, ACM, AXJ, AJ, WE, have emerged as an alternative, to fulfil the modern demands in structurally relevant applications, such as engine blocks, gears and converter boxes. However, in most cases, magnesium components are screwed with aluminium and steel bolts, which lead the screwed joints to lose the preload force, due to relaxation. This barrier thereby limits the broad use of magnesium within this segment and should somehow find an adequate solution to help overcome this limitation. Furthermore, together with alloy development and the addition of reinforcement (MMCs), local material engineering processes have been conceived and are considered a method to improve the properties and therefore expand the number of potential applications for magnesium alloys. In this context, Friction Welding (FW) and particularly Friction Hydro Pillar Processing (FHPP), which can be described as a drill and fill process, appear to be an alternative to make the use of magnesium more widespread. For this reason, FHPP is intended to be used, to locally reinforce the mechanically fastened magnesium components. With this approach, regions submitted to the stresses imposed by tightening forces can be compensated by the use of a material with superior properties. It is not required to fabricate the whole structure from an expensive material, thus saving costs and thereby satisfying the economic pressures of an increasingly competitive global market. In the present work, a preliminary experimental matrix was defined and used to determine the optimal welding conditions for each specific material combination selected. Further, elaborate experimental techniques are used to describe the process parameters-microstructure-properties relationships and the consequent mechanisms leading to bonding in FHPP welds in similar and dissimilar configurations. The welds were performed using a hydraulic

  15. Fabrication of tungsten wire needles

    International Nuclear Information System (INIS)

    Roder, A.

    1983-02-01

    Fine point needles for field emissoin are conventionally produced by electrolytically or chemically etching tungsten wire. Points formed in this manner have a typical tip radius of about 0.5 microns and a cone angle of some 30 degrees. The construction of needle matrix detector chambers has created a need for tungsten needles whose specifications are: 20 mil tungsten wire, 1.5 inch total length, 3 mm-long taper (resulting in a cone angle of about 5 degrees), and 25 micron-radius point (similar to that found on sewing needles). In the process described here for producing such needles, tungsten wire, immersed in a NaOH solution and in the presence of an electrode, is connected first to an ac voltage and then to a dc supply, to form a taper and a point on the end of the wire immersed in the solution. The process parameters described here are for needles that will meet the above specifications. Possible variations will be discussed under each approprite heading

  16. Theory of phase-slip processes in thin and dirty current-carrying superconducting wires: Deviations from local equilibrium

    International Nuclear Information System (INIS)

    Kraehenbuehl, Y.

    1983-01-01

    Oscillatory phase-slip solution of a set of integrodifferential equations describing time-dependent processes in dirty superconductors in the Ginzburg-Landau regime are found numerically very near Tsub(c). Deviations from local equilibrium improve the agreement with observed V-I curves. (orig.)

  17. Process Optimization for High Efficiency Heterojunction c-Si Solar Cells Fabrication Using Hot-Wire Chemical Vapor Deposition: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Ai, Y.; Yuan, H. C.; Page, M.; Nemeth, W.; Roybal, L.; Wang, Q.

    2012-06-01

    The researchers extensively studied the effects of annealing or thermal history of cell process on the minority carrier lifetimes of FZ n-type c-Si wafers with various i-layer thicknesses from 5 to 60 nm, substrate temperatures from 100 to 350 degrees C, doped layers both p- and n-types, and transparent conducting oxide (TCO).

  18. R and D activities for the design of the MITICA Plasma Driver Plate manufacturing process via explosion bonding technique

    International Nuclear Information System (INIS)

    Pavei, M.; Dal Bello, S.; Groeneveld, H.; Rizzolo, A.

    2013-01-01

    Highlights: ► The work is focused on the manufacturing process of the Plasma Driver Plate of MITICA. ► A clad plate of molybdenum and copper has been manufactured. ► Simulations have been carried out to improve the design geometry of the component. ► The driver-hole rim have been machined and hot formed. ► No delamination were found in the molybdenum. -- Abstract: The back plate of the MITICA plasma source, named Plasma Driver Plate (PDP), will be protected from the impact of the highly energetic back-streaming positive ions (BSI+), generated inside the accelerator, by a 1.0 mm thick molybdenum layer that will be joined by Explosion Bonding (EB) technique to the copper heat sink. This technology has been investigated and used for manufacturing prototypes, demonstrating very high strength of the obtained molybdenum–copper interface. The production of the shaped edge profile of the driver-hole, after the EB, is an open point. In order to demonstrate the possibility to produce the PDP by explosion bonding, the manufacturing of a full scale prototype of the area just around one of the PDP driver-holes was identified as the road to address most of the manufacturing issues. Elasto-plastic finite element analyses have been carried out to improve the hole rim geometry and the process parameters of all the manufacturing steps. A full scale prototype of the PDP driver-hole has been manufactured and tested. This contribution gives an overview of the R and D activities carried out to address the main open issues, to define the PDP component detailed geometry and its manufacturing processes, via EB technique

  19. Acoustic Emission from Elevator Wire Ropes During Tensile Testing

    Science.gov (United States)

    Bai, Wenjie; Chai, Mengyu; Li, Lichan; Li, Yongquan; Duan, Quan

    The acoustic emission (AE) technique was used to monitor the tensile testing process for two kinds of elevator wire ropes in our work. The AE signals from wire breaks were obtained and analyzed by AE parameters and waveforms. The results showed that AE technique can be a useful tool to monitor wire break phenomenon of wire ropes and effectively capture information of wire break signal. The relationship between AE signal characteristics and wire breaks is investigated and it is found that the most effective acoustic signal discriminators are amplitude and absolute energy. Moreover, the wire break signal of two kinds of ropes is a type of burst signal and it is believed that the waveform and spectrum can be applied to analyze the AE wire break signals.

  20. Towards plant wires

    OpenAIRE

    Adamatzky, Andrew

    2014-01-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self...

  1. Dynamic breaking of a single gold bond

    DEFF Research Database (Denmark)

    Pobelov, Ilya V.; Lauritzen, Kasper Primdal; Yoshida, Koji

    2017-01-01

    While one might assume that the force to break a chemical bond gives a measure of the bond strength, this intuition is misleading. If the force is loaded slowly, thermal fluctuations may break the bond before it is maximally stretched, and the breaking force will be less than the bond can sustain...... of a single Au-Au bond and show that the breaking force is dependent on the loading rate. We probe the temperature and structural dependencies of breaking and suggest that the paradox can be explained by fast breaking of atomic wires and slow breaking of point contacts giving very similar breaking forces....

  2. Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

    Science.gov (United States)

    Lei, Jih-Fen; Kiser, J. Douglas; Singh, Mrityunjay; Cuy, Mike; Blaha, Charles A.; Androjna, Drago

    2000-01-01

    An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

  3. Behavior and effect of Ti2Ni phase during processing of NiTi shape memory alloy wire from cast ingot

    International Nuclear Information System (INIS)

    Bhagyaraj, J.; Ramaiah, K.V.; Saikrishna, C.N.; Bhaumik, S.K.; Gouthama

    2013-01-01

    Highlights: •Ti 2 Ni second phase particles forms in different sizes and shapes in cast ingot. •TEM evidences showed shearing/fragmentation of Ti 2 Ni during processing. •Matrix close to Ti 2 Ni experienced severe plastic deformation lead to amorphisation. •Ti 2 Ni interfaces were mostly faceted and assist in nucleation of martensite. •Heterogeneity of microstructure observed near to and away from Ti 2 Ni. -- Abstract: Binary NiTi alloy is one of the commercially successful shape memory alloys (SMAs). Generally, the NiTi alloy composition used for thermal actuator application is slightly Ti-rich. In the present study, vacuum arc melted alloy of 50.2Ti–Ni (at.%) composition was prepared and characterized using optical, scanning and transmission electron microcopy. Formation of second phase particles (SPPs) in the cast alloy and their influence on development of microstructure during processing of the alloy into wire form has been investigated. Results showed that the present alloy contained Ti 2 Ni type SPPs in the matrix. In the cast alloy, the Ti 2 Ni particles form in varying sizes (1–10 μm) and shapes. During subsequent thermo-mechanical processing, these SPPs get sheared/fragmented into smaller particles with low aspect ratio. The presence of SPPs plays a significant role in refinement of the microstructure during processing of the alloy. During deformation of the alloy, the matrix phase around the SPPs experiences conditions similar to that observed in severe plastic deformation of metallic materials, leading to localized amorphisation of the matrix phase

  4. SorCS2 Regulates Dopaminergic Wiring and Is Processed into an Apoptotic Two-Chain Receptor in Peripheral Glia

    DEFF Research Database (Denmark)

    Glerup, Simon; Olsen, Ditte; Vægter, Christian Bjerggaard

    2014-01-01

    Balancing trophic and apoptotic cues is critical for development and regeneration of neuronal circuits. Here we identify SorCS2 as a proneurotrophin (proNT) receptor, mediating both trophic and apoptotic signals in conjunction with p75NTR. CNS neurons, but not glia, express SorCS2 as a single-chain...... behavioral response to amphetamine reminiscent of ADHD. Contrary, in PNS glia, but not in neurons, proteolytic processing produced a two-chain SorCS2 isoform that mediated proNT-dependent Schwann cell apoptosis. Sciatic nerve injury triggered generation of two-chain SorCS2 in p75NTR-positive dying Schwann...... cells, with apoptosis being profoundly attenuated in Sorcs2−/− mice. In conclusion, we have demonstrated that two-chain processing of SorCS2 enables neurons and glia to respond differently to proneurotrophins....

  5. Photovoltaic Wire, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This Small Business Innovation Research Phase I project will investigate a new architecture for photovoltaic devices based on nanotechnology: photovoltaic wire. The...

  6. Charpak hemispherical wire chamber

    CERN Multimedia

    1970-01-01

    pieces. Mesures are of the largest one. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  7. Tailoring structures through two-step annealing process in nanostructured aluminum produced by accumulative roll-bonding

    DEFF Research Database (Denmark)

    Kamikawa, Naoya; Huang, Xiaoxu; Hansen, Niels

    2008-01-01

    temperature before annealing at high temperature. By this two-step process, the structure is homogenized and the stored energy is reduced significantly during the first annealing step. As an example, high-purity aluminum has been deformed to a total reduction of 98.4% (equivalent strain of 4.......8) by accumulative roll-bonding at room temperature. Isochronal annealing for 0.5 h of the deformed samples shows the occurrence of recrystallization at 200 °C and above. However, when introducing an annealing step for 6 h at 175 °C, no significant recrystallization is observed and relatively homogeneous structures...... are obtained when the samples afterwards are annealed at higher temperatures up to 300 °C. To underpin these observations, the structural evolution has been characterized by transmission electron microscopy, showing that significant annihilation of high-angle boundaries, low-angle dislocation boundaries...

  8. Extension of the lifetime of tantalum filaments in the hot-wire (Cat) 3 Chemical Vapor Deposition process

    CSIR Research Space (South Africa)

    Knoesen, D

    2008-01-01

    Full Text Available , the filament is again exposed to pure hydrogen for a minimum of 5 min, the chamber then again evacuated to a vacuum better than 8×10−8 mbar before cutting the power to the filament. This has resulted in a filament life of 11 months, with an accumulated... process only treated by annealing before a deposition run, did not last long, and typically broke after 3 to 5 h of accumulated deposition time. Silicide formation is found along the full length of these tantalum filaments, with severe structural...

  9. 1998 wire development workshop proceedings

    International Nuclear Information System (INIS)

    1998-04-01

    This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development

  10. 1998 wire development workshop proceedings

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1998-04-01

    This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development.

  11. Deformable wire array: fiber drawn tunable metamaterials

    DEFF Research Database (Denmark)

    Fleming, Simon; Stefani, Alessio; Tang, Xiaoli

    2017-01-01

    By fiber drawing we fabricate a wire array metamaterial, the structure of which can be actively modified. The plasma frequency can be tuned by 50% by compressing the metamaterial; recovers when released and the process can be repeated.......By fiber drawing we fabricate a wire array metamaterial, the structure of which can be actively modified. The plasma frequency can be tuned by 50% by compressing the metamaterial; recovers when released and the process can be repeated....

  12. Concerning the problem of polygraphic wire calculation: theoretical aspects, software, practical implementation

    Directory of Open Access Journals (Sweden)

    Selkina A. V.

    2016-05-01

    Full Text Available the article analyzes the problems arising while organizing the workflow in printing companies. We suggest to address these problems by means of implementing computer-based accounting systems. Online and offline calculators used by printing enterprises for accounting are discussed. The author outlined the functional and specified requirements to such software. They were considered in the calculation module of accounting polygraphic wire used for block bonding. The software allows to increase the calculation process speed, to reduce the amount of errors in calculation and to decrease the labour intensity of the accounting process.

  13. Theoretical study of C-C bond formation in the methanol to gasoline process

    NARCIS (Netherlands)

    Blaszkowski, S.R.; Santen, van R.A.

    1997-01-01

    Density functional theory is used to study one of the most successful routes to the production of synthetic fuels, the conversion of methanol to gasoline (MTG process) with an acidic zeolite. With our calculations we have determined transition states and adsorption complexes of reactants,

  14. Microstructure and mechanical properties of nickel processed by accumulative roll bonding

    DEFF Research Database (Denmark)

    Zhang, Yubin; Mishin, Oleg; Kamikawa, N.

    2013-01-01

    rolling to an identical nominal strain, the microstructure after ARB is more refined and contains a greater fraction of high angle boundaries. This enhanced refinement is attributed to the geometric accumulation of shear-strain influenced volumes as a result of the ARB process and large-draught rolling...

  15. Wire Array Photovoltaics

    Science.gov (United States)

    Turner-Evans, Dan

    Over the past five years, the cost of solar panels has dropped drastically and, in concert, the number of installed modules has risen exponentially. However, solar electricity is still more than twice as expensive as electricity from a natural gas plant. Fortunately, wire array solar cells have emerged as a promising technology for further lowering the cost of solar. Si wire array solar cells are formed with a unique, low cost growth method and use 100 times less material than conventional Si cells. The wires can be embedded in a transparent, flexible polymer to create a free-standing array that can be rolled up for easy installation in a variety of form factors. Furthermore, by incorporating multijunctions into the wire morphology, higher efficiencies can be achieved while taking advantage of the unique defect relaxation pathways afforded by the 3D wire geometry. The work in this thesis shepherded Si wires from undoped arrays to flexible, functional large area devices and laid the groundwork for multijunction wire array cells. Fabrication techniques were developed to turn intrinsic Si wires into full p-n junctions and the wires were passivated with a-Si:H and a-SiNx:H. Single wire devices yielded open circuit voltages of 600 mV and efficiencies of 9%. The arrays were then embedded in a polymer and contacted with a transparent, flexible, Ni nanoparticle and Ag nanowire top contact. The contact connected >99% of the wires in parallel and yielded flexible, substrate free solar cells featuring hundreds of thousands of wires. Building on the success of the Si wire arrays, GaP was epitaxially grown on the material to create heterostructures for photoelectrochemistry. These cells were limited by low absorption in the GaP due to its indirect bandgap, and poor current collection due to a diffusion length of only 80 nm. However, GaAsP on SiGe offers a superior combination of materials, and wire architectures based on these semiconductors were investigated for multijunction

  16. Investigation of the Bitumen Modification Process Regime Parameters Influence on Polymer-Bitumen Bonding Qualitative Indicators

    Science.gov (United States)

    Belyaev, P. S.; Mishchenko, S. V.; Belyaev, V. P.; Belousov, O. A.; Frolov, V. A.

    2018-04-01

    The objects of this study are petroleum road bitumen and polymeric bituminous binder for road surfaces obtained by polymer materials. The subject of the study is monitoring the polymer-bitumen binder quality changes as a result of varying the bitumen modification process. The purpose of the work is to identify the patterns of the modification process and build a mathematical model that provides the ability to calculate and select technological equipment. It is shown that the polymer-bitumen binder production with specified quality parameters can be ensured in apparatuses with agitators in turbulent mode without the colloidal mills use. Bitumen mix and modifying additives limiting indicators which can be used as restrictions in the form of mathematical model inequalities are defined. A mathematical model for the polymer-bitumen binder preparation has been developed and its adequacy has been confirmed.

  17. The Influence of the Coating Deposition Process on the Interdiffusion Behavior Between Nickel-Based Superalloys and MCrAlY Bond Coats

    Science.gov (United States)

    Elsaß, M.; Frommherz, M.; Oechsner, M.

    2018-02-01

    In this work, interdiffusion between two nickel-based superalloys and two MCrAlY bond coats is investigated. The MCrAlY bond coats were applied using two different spraying processes, high velocity oxygen fuel spraying (HVOF) and low-pressure plasma spraying. Of primary interest is the evolution of Kirkendall porosity, which can form at the interface between substrate and bond coat and depends largely on the chemical compositions of the coating and substrate. Experimental evidence further suggested that the formation of Kirkendall porosity depends on the coating deposition process. Formation of porosity at the interface causes a degradation of the bonding strength between substrate and coating. After coating deposition, the samples were annealed at 1050 °C for up to 2000 h. Microstructural and compositional analyses were performed to determine and evaluate the Kirkendall porosity. The results reveal a strong influence of both the coating deposition process and the chemical compositions. The amount of Kirkendall porosity formed, as well as the location of appearance, is largely influenced by the coating deposition process. In general, samples with bond coats applied by means of HVOF show accelerated element diffusion. It is hypothesized that recrystallization of the substrate material is a main root cause for these observations.

  18. Commercial and Industrial Wiring.

    Science.gov (United States)

    Kaltwasser, Stan; Flowers, Gary

    This module is the third in a series of three wiring publications, includes additional technical knowledge and applications required for job entry in the commercial and industrial wiring trade. The module contains 15 instructional units that cover the following topics: blueprint reading and load calculations; tools and equipment; service;…

  19. Plastic deformation of 2D crumpled wires

    International Nuclear Information System (INIS)

    Gomes, M A F; Donato, C C; Brito, V P; Coelho, A S O

    2008-01-01

    When a single long piece of elastic wire is injected through channels into a confining two-dimensional cavity, a complex structure of hierarchical loops is formed. In the limit of maximum packing density, these structures are described by several scaling laws. In this paper this packing process is investigated but using plastic wires which give rise to completely irreversible structures of different morphology. In particular, the plastic deformation from circular to oblate configurations of crumpled wires is experimentally studied, obtained by the application of an axial strain. Among other things, it is shown that in spite of plasticity, irreversibility and very large deformations, scaling is still observed.

  20. Fabrication of FFTF fuel pin wire wrap

    International Nuclear Information System (INIS)

    Epperson, E.M.

    1980-06-01

    Lateral spacing between FFTF fuel pins is required to provide a passageway for the sodium coolant to flow over each pin to remove heat generated by the fission process. This spacing is provided by wrapping each fuel pin with type 316 stainless steel wire. This wire has a 1.435mm (0.0565 in.) to 1.448mm (0.0570 in.) diameter, contains 17 +- 2% cold work and was fabricated and tested to exacting RDT Standards. About 500 kg (1100 lbs) or 39 Km (24 miles) of fuel pin wrap wire is used in each core loading. Fabrication procedures and quality assurance tests are described

  1. Processes linking cultural ingroup bonds and mental health: the roles of social connection and emotion regulation.

    Science.gov (United States)

    Roberts, Nicole A; Burleson, Mary H

    2013-01-01

    Cultural and ethnic identities influence the relationships individuals seek out and how they feel and behave in these relationships, which can strongly affect mental and physical health through their impacts on emotions, physiology, and behavior. We proposed and tested a model in which ethnocultural identifications and ingroup affiliations were hypothesized explicitly to enhance social connectedness, which would in turn promote expectancy for effective regulation of negative emotions and reduce self-reported symptoms of depression and anxiety. Our sample comprised women aged 18-30 currently attending college in the Southwestern US, who self-identified as Hispanic of Mexican descent (MAs; n = 82) or as non-Hispanic White/European American (EAs; n = 234) and who completed an online survey. In the full sample and in each subgroup, stronger ethnocultural group identity and greater comfort with mainstream American culture were associated with higher social connectedness, which in turn was associated with expectancy for more effective regulation of negative emotions, fewer depressive symptoms, and less anxiety. Unexpectedly, preference for ingroup affiliation predicted lower social connectedness in both groups. In addition to indirect effects through social connection, direct paths from mainstream comfort and preference for ingroup affiliation to emotion regulation expectancy were found for EAs. Models of our data underscore that social connection is a central mechanism through which ethnocultural identities-including with one's own group and the mainstream cultural group-relate to mental health, and that emotion regulation may be a key aspect of this linkage. We use the term ethnocultural social connection to make explicit a process that, we believe, has been implied in the ethnic identity literature for many years, and that may have consequential implications for mental health and conceptualizations of processes underlying mental disorders.

  2. Processes linking cultural ingroup bonds and mental health: the roles of social connection and emotion regulation

    Science.gov (United States)

    Roberts, Nicole A.; Burleson, Mary H.

    2013-01-01

    Cultural and ethnic identities influence the relationships individuals seek out and how they feel and behave in these relationships, which can strongly affect mental and physical health through their impacts on emotions, physiology, and behavior. We proposed and tested a model in which ethnocultural identifications and ingroup affiliations were hypothesized explicitly to enhance social connectedness, which would in turn promote expectancy for effective regulation of negative emotions and reduce self-reported symptoms of depression and anxiety. Our sample comprised women aged 18–30 currently attending college in the Southwestern US, who self-identified as Hispanic of Mexican descent (MAs; n = 82) or as non-Hispanic White/European American (EAs; n = 234) and who completed an online survey. In the full sample and in each subgroup, stronger ethnocultural group identity and greater comfort with mainstream American culture were associated with higher social connectedness, which in turn was associated with expectancy for more effective regulation of negative emotions, fewer depressive symptoms, and less anxiety. Unexpectedly, preference for ingroup affiliation predicted lower social connectedness in both groups. In addition to indirect effects through social connection, direct paths from mainstream comfort and preference for ingroup affiliation to emotion regulation expectancy were found for EAs. Models of our data underscore that social connection is a central mechanism through which ethnocultural identities—including with one's own group and the mainstream cultural group—relate to mental health, and that emotion regulation may be a key aspect of this linkage. We use the term ethnocultural social connection to make explicit a process that, we believe, has been implied in the ethnic identity literature for many years, and that may have consequential implications for mental health and conceptualizations of processes underlying mental disorders. PMID:23450647

  3. Processes linking cultural ingroup bonds and mental health: The roles of social connection and emotion regulation

    Directory of Open Access Journals (Sweden)

    Nicole A Roberts

    2013-02-01

    Full Text Available Cultural and ethnic identities influence the relationships individuals seek out and how they feel and behave in these relationships, which can strongly affect mental and physical health through their impacts on emotions, physiology, and behavior. We proposed and tested a model in which ethnocultural identifications and ingroup affiliations were hypothesized explicitly to enhance social connectedness, which would in turn promote expectancy for effective regulation of negative emotions and reduce self-reported symptoms of depression and anxiety. Our sample comprised women aged 18 to 30 currently attending college in the Southwestern US, who self-identified as Hispanic of Mexican descent (n=82; MAs or as non-Hispanic White/European American (EAs; n=234 and who completed an online survey. In the full sample and in each subgroup, stronger ethnocultural group identity and greater comfort with mainstream American culture were associated with higher social connectedness, which in turn was associated with expectancy for more effective regulation of negative emotions, fewer depressive symptoms, and less anxiety. Unexpectedly, preference for ingroup affiliation predicted lower social connectedness in both groups. In addition to indirect effects through social connection, direct paths from mainstream comfort and preference for ingroup affiliation to emotion regulation expectancy were found for EAs. Models of our data underscore that social connection is a central mechanism through which ethnocultural identities—including with one’s own group and the mainstream cultural group—relate to mental health, and that emotion regulation may be a key aspect of this linkage. We use the term ethnocultural social connection to make explicit a process that, we believe, has been implied in the ethnic identity literature for many years, and that may have consequential implications for mental health and conceptualizations of processes underlying mental disorders.

  4. BONDING ALUMINUM METALS

    Science.gov (United States)

    Noland, R.A.; Walker, D.E.

    1961-06-13

    A process is given for bonding aluminum to aluminum. Silicon powder is applied to at least one of the two surfaces of the two elements to be bonded, the two elements are assembled and rubbed against each other at room temperature whereby any oxide film is ruptured by the silicon crystals in the interface; thereafter heat and pressure are applied whereby an aluminum-silicon alloy is formed, squeezed out from the interface together with any oxide film, and the elements are bonded.

  5. Characterization of intermetallic compounds in Cu-Al ball bonds: thermo-mechanical properties, interface delamination and corrosion

    NARCIS (Netherlands)

    Gubbels, G.H.M.; Kouters, M.H.M.; Dos Santos Ferreira, O.

    2012-01-01

    In high power automotive electronics copper wire bonding is regarded as the most promising alternative for gold wire bonding in 1st level interconnects. In the Cu-Al ball bond interface the growth of intermetallic compounds can deteriorate the electrical and mechanical properties of the

  6. Filament to filament bridging and its influence on developing high critical current density in multifilamentary Bi2Sr2CaCu2Ox round wires

    International Nuclear Information System (INIS)

    Shen, T; Jiang, J; Kametani, F; Trociewitz, U P; Larbalestier, D C; Schwartz, J; Hellstrom, E E

    2010-01-01

    Increasing the critical current density (J c ) of the multifilamentary round wire Ag/Bi 2 Sr 2 CaCu 2 O x (2212) requires understanding its complicated microstructure, in which extensive bridges between filaments are prominent. In this first through-process quench study of 2212 round wire, we determined how its microstructure develops during a standard partial-melt process and how filament bridging occurs. We found that filaments can bond together in the melt state. As 2212 starts to grow on subsequent cooling, we observed that two types of 2212 bridges form. One type, which we call Type-A bridges, forms within filaments that bonded in the melt; Type-A bridges are single grains that span multiple bonded filaments. The other type, called Type-B bridges, form between discrete filaments through 2212 outgrowths that penetrate into the Ag matrix and intersect with other 2212 outgrowths from adjacent filaments. We believe the ability of these two types of bridges to carry inter-filament current is intrinsically different: Type-A bridges are high- J c inter-filament paths whereas Type-B bridges contain high-angle grain boundaries and are typically weak linked. Slow cooling leads to more filament bonding, more Type-A bridges and a doubling of J c without changing the flux pinning. We suggest that Type-A bridges create a 3D current flow that is vital to developing high J c in multifilamentary 2212 round wire.

  7. Using wire shaping techniques and holographic optics to optimize deposition characteristics in wire-based laser cladding.

    Science.gov (United States)

    Goffin, N J; Higginson, R L; Tyrer, J R

    2016-12-01

    In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, although wire-based methods have been shown to be capable of superior quality results, the wire-based process is more difficult to control. In this work, the potential for wire shaping techniques, combined with existing holographic optical element knowledge, is investigated in order to further improve the processing characteristics. Experiments with pre-placed wire showed the ability of shaped wire to provide uniformity of wire melting compared with standard round wire, giving reduced power density requirements and superior control of clad track dilution. When feeding with flat wire, the resulting clad tracks showed a greater level of quality consistency and became less sensitive to alterations in processing conditions. In addition, a 22% increase in deposition rate was achieved. Stacking of multiple layers demonstrated the ability to create fully dense, three-dimensional structures, with directional metallurgical grain growth and uniform chemical structure.

  8. Tensile test and interface retention forces between wires and composites in lingual fixed retainers.

    Science.gov (United States)

    Paolone, Maria Giacinta; Kaitsas, Roberto; Obach, Patricia; Kaitsas, Vasilios; Benedicenti, Stefano; Sorrenti, Eugenio; Barberi, Fabrizio

    2015-06-01

    In daily orthodontic clinical practice retention is very important, and lingual retainers are part of this challenge. The failure of lingual retainers may be due to many factors. The aim of this study was to assess the retention forces and mechanical behavior of different types of wires matched with different kinds of composites in lingual retainers. A tensile test was performed on cylindrical composite test specimens bonded to orthodontic wires. The specimens were constructed using four different wires: a straight wire (Remanium .016×.022″ Dentaurum), two round twisted wires (Penta One .0215″ Masel, Gold Penta Twisted .0215″ Gold N'braces) and a rectangular braided wire (D-Rect .016×.022″ Ormco); and three composites: two micro-hybrids (Micro-Hybrid Enamel Plus HFO Micerium, and Micro-Hybrid SDR U Dentsply) and a micro-nano-filled composite (Micro-Nano-Filled Transbond LR 3M). The test was performed at a speed of 10mm/min on an Inström device. The wire was fixed with a clamp. The results showed that the bonding between wires and composites in lingual fixed retainers seemed to be lowest for rectangular smooth wires and increased in round twisted and rectangular twisted wires where the bonding was so strong that the maximum tension/bond strength was greater than the ultimate tensile strength of the wire. The highest values were in rectangular twisted wires. Concerning the composites, hybrid composites had the lowest interface bonding values and broke very quickly, while the nano- and micro-composites tolerated stronger forces and displayed higher bonding values. The best results were observed with the golden twisted wire and reached 21.46 MPa with the Transbond composite. With the rectangular braided wire the retention forces were so high that the Enamel Plus composite fractured when the load exceeded 154.6 N/MPa. When the same wire was combined with the Transbond LR either the wire or the composite broke when the force exceeded 240 N. The results of this

  9. Pin Wire Coating Trip Report

    International Nuclear Information System (INIS)

    Spellman, G P

    2004-01-01

    A meeting to discuss the current pin wire coating problems was held at the Reynolds plant in Los Angeles on 2MAR04. The attendance list for Reynolds personnel is attached. there was an initial presentation which gave a brief history and the current status of pin wire coating at Reynolds. There was a presentation by Lori Primus on the requirements and issues for the coating. There was a presentation by Jim Smith of LANL on the chemistry and to some extent process development done to date. There was a long session covering what steps should be taken in the short term and, to a lesser extent, the long term. The coating currently being used is a blend of two polymers, polyethersulfone and polyparabanic acid (PPA) and some TiO2 filler. This system was accepted and put into production when the pin wire coating was outsourced to another company in 1974. When that company no longer was interested, the wire coating was brought in-house to Reynolds. At that time polyparabanic acid was actually a commercial product available from Exxon under the trade name Tradlon. However, it appears that the material used at Reynolds was synthesized locally. Also, it appears that a single large batch was synthesized in that time period and used up to 1997 when the supply ran out. The reason for the inclusion of TiO2 is not known although it does act as a rheological thickener. However, a more controlled thickening can be obtained with materials such as fumed silica. This material would have less likelihood of causing point imperfections in the coatings. Also, the mixing technique being used for all stages of the process is a relatively low shear ball mill process and the author recommends a high shear process such as a three roll paint mill, at least for the final mixing. Since solvent is added to the powder at Reynolds, it may be that they need to have the paint mill there

  10. Improvement of the bending fatigue resistance of the hyper-eutectoid steel wires used for tire cords by a post-processing annealing

    International Nuclear Information System (INIS)

    Yang, Y.S.; Bae, J.G.; Park, C.G.

    2008-01-01

    In this study, the effects of annealing at a low temperature on the bending fatigue resistance have been investigated in the hyper-eutectoid steel wires drawn to an extreme strain of 4.12. The annealing temperature was varied from 100 to 500 deg. C. The bending fatigue resistance of the steel wires was measured by a Hunter rotating beam tester specially designed for thin-sized steel wires. The results showed that fatigue resistance as well as tensile strength improved as the annealing temperature increased up to 200 deg. C (Region I) and gradually decreased after annealing above 200 deg. C (Region II). In order to elucidate this behavior, residual stress was measured by dual beam FIB, surface defects observed by an optical 3D profiler and the microstructure in terms of lamellar spacing (λ p ) and cementite thickness (t c ) was observed by TEM

  11. Magnetization reversal processes in bonded magnets made from a mixture of Nd-(Fe,Co)-B and strontium ferrite powders

    Science.gov (United States)

    Dospial, M.; Plusa, D.

    2013-03-01

    Isotropic epoxy-resin bonded magnets composed of different amounts of Magnequench MQP-B and strontium ferrite powders have been prepared using a compression molding technique. The magnetic parameters for magnets with different amounts of strontium ferrite and magnetization reversal processes have been studied by the measurement of the initial magnetization curves, the major hysteresis loops measured at a field up to 14 T and sets of recoil loops. The enhancement of μ0MR and μ0HC is observed in comparison with the calculated values. From the recoil loops the field dependences of the reversible, irreversible and total magnetization components and the differential susceptibilities were derived. From the dependence of the irreversible magnetization component versus an applied field it was deduced that the main mechanism of magnetization reversal process is the pinning of domain walls in MQP-B and strontium ferrite grains. The interactions between the magnetic particles and grains have been examined by the analysis of the δM plot. The δM behavior of magnets with ferrite has been interpreted as being composed of magnetizing exchange coupling and demagnetizing dipolar interactions.

  12. Reliability testing of wire-bond at high temperature storage: Abstract for HITEN 2007, The International Conference on High Temperature Electronics, 17-19 September 2007 in Oxford, United Kingdom

    OpenAIRE

    Schelle, B.; Arik, B.; Klieber, R.; Trieu, H.-K.

    2007-01-01

    In integrated circuits chips are connected to the substrate with an electrical bonding. Generally Au bondwires are used on Al chip-pads with a Ni substrate; - denoted as an Al/Au/Ni system. The system can be used up to 150°C. At higher temperatures up to 250°C the system fails due to intermetallic phase growth also known as 'purple pest'. In this talk we present an alternative to the Au/Au/Au system for high temperature assembly, as a gold metallization on the chip side is expensive and not c...

  13. Bond Issues.

    Science.gov (United States)

    Pollack, Rachel H.

    2000-01-01

    Notes trends toward increased borrowing by colleges and universities and offers guidelines for institutions that are considering issuing bonds to raise money for capital projects. Discussion covers advantages of using bond financing, how use of bonds impacts on traditional fund raising, other cautions and concerns, and some troubling aspects of…

  14. Towards plant wires.

    Science.gov (United States)

    Adamatzky, Andrew

    2014-08-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self-growing wetware circuits and devices, and integration of plant-based electronic components into future and emergent bio-hybrid systems. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

  15. Nuclear reactor fuel structure containing uranium alloy wires embedded in a metallic matrix plate

    International Nuclear Information System (INIS)

    Travelli, A.

    1988-01-01

    A nuclear fuel-containing plate structure for a nuclear reactor is described; such structure comprising a pair of malleable metallic non-fissionable matrix plates having confronting surfaces which are pressure bonded together and fully united to form a bonded surface, and elongated malleable wire-like fissionable fuel members separately confined and fully enclosed between the matrix plates along the interface to afford a high fuel density as well as structural integrity and effective retention of fission products. The plates have separate recesses formed in the confronting surfaces for closely receiving the wire-like fissionable fuel members. The wire-like fissionable fuel members are made of a maleable uranium alloy capable of being formed into elongated wire-like members and capable of withstanding pressure bonding. The wire-like fissionable fuel members are completely separated and isolated by fully united portions of the interface

  16. Chemistry of radiation damage to wire chambers

    International Nuclear Information System (INIS)

    Wise, J.

    1992-08-01

    Proportional counters are used to study aspects of radiation damage to wire chambers (wire aging). Principles of low-pressure, rf plasma chemistry are used to predict the plasma chemistry in electron avalanches (1 atm, dc). (1) Aging is studied in CF 4 /iC 4 H 10 gas mixtures. Wire deposits are analyzed by Auger electron spectroscopy. An apparent cathode aging process resulting in loss of gain rather than in a self-sustained current is observed in CF 4 -rich gases. A four-part model considering plasma polymerization of the hydrocarbon, etching of wire deposits by CF 4 , acceleration of deposition processes in strongly etching environments, and reactivity of the wire surface is developed to understand anode wire aging in CF 4 /iC 4 H 10 gases. Practical guidelines suggested by the model are discussed. (2) Data are presented to suggest that trace amounts of Freons do not affect aging rates in either dimethyl ether or Ar/C 2 H 6 . Apparent loss of gain is explained by attachment of primary electrons to a continuously increasing concentration of Freon 11 (CCl 3 F) in the counter gas. An increase in the concentration of Freon 11 in dimethyl ether is caused by a distillation process in the gas supply bottle and is a natural consequence of the unequal volatilities of the two compounds

  17. Concentration-dependent multiple chirality transition in halogen-bond-driven 2D self-assembly process

    Science.gov (United States)

    Miao, Xinrui; Li, Jinxing; Zha, Bao; Miao, Kai; Dong, Meiqiu; Wu, Juntian; Deng, Wenli

    2018-03-01

    The concentration-dependent self-assembly of iodine substituted thienophenanthrene derivative (5,10-DITD) is investigated at the 1-octanic acid/graphite interface using scanning tunneling microscopy. Three kinds of chiral arrangement and transition of 2D molecular assembly mainly driven by halogen bonding is clearly revealed. At high concentration the molecules self-assembled into a honeycomb-like chiral network. Except for the interchain van der Waals forces, this pattern is stabilized by intermolecular continuous Cdbnd O⋯I⋯S halogen bonds in each zigzag line. At moderate concentration, a chiral kite-like nanoarchitecture are observed, in which the Cdbnd O⋯I⋯S and I⋯Odbnd C halogen bonds, along with the molecule-solvent Cdbnd O⋯I⋯H halogen bonds are the dominated forces to determine the structural formation. At low concentration, the molecules form a chiral cyclic network resulting from the solvent coadsorption mainly by molecule-molecule Cdbnd O⋯I⋯S halogen bonds and molecule-solvent Cdbnd O⋯I⋯H halogen bonds. The density of molecular packing becomes lower with the decreasing of the solution concentration. The solution-concentration dependent self-assembly of thienophenanthrene derivative with iodine and ester chain moieties reveals that the type of intermolecular halogen bond and the number of the co-adsorbing 1-octanic acids by molecule-solvent Cdbnd O⋯I⋯H halogen bonds determine the formation and transformation of chirality. This research emphasizes the role of different types of halogen (I) bonds in the controllable supramolecular structures and provides an approach for the fabrication of chirality.

  18. Knudsen pump produced via silicon deep RIE, thermal oxidation, and anodic bonding processes for on-chip vacuum pumping

    Science.gov (United States)

    Van Toan, Nguyen; Inomata, Naoki; Trung, Nguyen Huu; Ono, Takahito

    2018-05-01

    This work describes the fabrication and evaluation of the Knudsen pump for on-chip vacuum pumping that works based on the principle of a thermal transpiration. Three AFM (atomic force microscope) cantilevers are integrated into small chambers with a size of 5 mm  ×  3 mm  ×  0.4 mm for the pump’s evaluation. Knudsen pump is fabricated using deep RIE (reactive ion etching), wet thermal oxidation and anodic bonding processes. The fabricated device is evaluated by monitoring the quality (Q) factor of the integrated cantilevers. The Q factor of the cantilever is increased from 300 -1150 in cases without and with a temperature difference approximately 25 °C between the top (the hot side at 40 °C) and bottom (the cold side at 15 °C) sides of the fabricated device, respectively. The evacuated chamber pressure of around 10 kPa is estimated from the Q factor of the integrated cantilevers.

  19. Processing and Characterization of Liquid-Phase Sintered NiTi Woven Structures

    Science.gov (United States)

    Erdeniz, Dinc; Weidinger, Ryan P.; Sharp, Keith W.; Dunand, David C.

    2018-03-01

    Porous NiTi is of interest for bone implants because of its unique combination of biocompatibility (encouraging osseointegration), high strength (to prevent fracture), low stiffness (to reduce stress shielding), and shape memory or superelasticity (to deploy an implant). A promising method for creating NiTi structures with regular open channels is via 3D weaving of NiTi wires. This paper presents a processing method to bond woven NiTi wire structures at contact points between wires to achieve structural integrity: (i) a slurry consisting of a blend of NiTi and Nb powders is deposited on the surface of the NiTi wires after the weaving operation; (ii) the powders are melted to create a eutectic liquid phase which collects at contact points; and (iii) the liquid is solidified and binds the NiTi woven structures. The bonded NiTi wire structures exhibited lower transformation temperatures compared to the as-woven NiTi wires because of Nb diffusion into the NiTi wires. A bonded woven sample was deformed in bending and showed near-complete recovery up to 6% strain and recovered nearly half of the deformation up to 19% strain.

  20. Investigation of material removal rate (MRR) and wire wear ratio (WWR) for alloy Ti6Al4 V exposed to heat treatment processing in WEDM and optimization of parameters using Grey relational analysis

    Energy Technology Data Exchange (ETDEWEB)

    Altug, Mehmet [Inonu Univ., Malatya (Turkey). Dept. of Machine and Metal Technologies

    2016-11-01

    The study examines the changes of the microstructural, mechanical and conductivity characteristics of the titanium alloy Ti6Al4 V as a result of heat treatment using wire electrical discharge machining, and their effect on machinability. By means of optical microscopy and scanning electron microscopy (SEM), analyses have been performed to determine various characteristics and additionally, microhardness and conductivity measurements have been conducted. Material removal rate (MRR) and wire wear ratio (WWR) values have been determined by using L18 Taguchi test design. The microstructures of the samples have been changed by thermal procedures. Results have been obtained by using the Grey relational analysis (GRA) optimization technique to solve the maximum MRR and minimum WWR values. The best (highest) MRR value is obtained from sample E which was water quenched in dual phase processing. The microstructure of this sample is composed of primary α and α' phases. The best (lowest) WWR value is obtained from sample A.

  1. Investigation of material removal rate (MRR) and wire wear ratio (WWR) for alloy Ti6Al4 V exposed to heat treatment processing in WEDM and optimization of parameters using Grey relational analysis

    International Nuclear Information System (INIS)

    Altug, Mehmet

    2016-01-01

    The study examines the changes of the microstructural, mechanical and conductivity characteristics of the titanium alloy Ti6Al4 V as a result of heat treatment using wire electrical discharge machining, and their effect on machinability. By means of optical microscopy and scanning electron microscopy (SEM), analyses have been performed to determine various characteristics and additionally, microhardness and conductivity measurements have been conducted. Material removal rate (MRR) and wire wear ratio (WWR) values have been determined by using L18 Taguchi test design. The microstructures of the samples have been changed by thermal procedures. Results have been obtained by using the Grey relational analysis (GRA) optimization technique to solve the maximum MRR and minimum WWR values. The best (highest) MRR value is obtained from sample E which was water quenched in dual phase processing. The microstructure of this sample is composed of primary α and α' phases. The best (lowest) WWR value is obtained from sample A.

  2. Wire chambers: Trends and alternatives

    Energy Technology Data Exchange (ETDEWEB)

    Regler, Meinhard

    1992-05-15

    The subtitle of this year's Vienna Wire Chamber Conference - 'Recent Trends and Alternative Techniques' - signalled that it covered a wide range of science and technology. While an opening Vienna talk by wire chamber pioneer Georges Charpak many years ago began 'Les funerailles des chambres a fils (the burial of wire chambers)', the contrary feeling this year was that wire chambers are very much alive!.

  3. Peculiar features of metallurgical processes at plasma-arc spraying of coatings, made of steel wire with powder fillers B4C and B4C+ZrO2

    Directory of Open Access Journals (Sweden)

    Георгій Михайлович Григоренко

    2016-11-01

    Full Text Available The interaction of metallurgical processes occurring in plasma-arc spraying between the steel shell and the carbide fillers of B4C and B4C cored wires with the addition of nanocrystalline ZrO2 powder has been analyzed. Iron-boron compounds alloyed with carbon are formed in ingots as a result of ferritiс coating of wire interacrion with fillers while the ferritic matrix contains boride and carboboride eutectics. Average microhardness of the carboboride compounds and the matrix is high – 17,78; 16,40 and 8,69; 9,95 GPa for the ingots with с B4C and B4C+ZrO2 respectively. The best quality coatings with low porosity (~1%, lamellar structure consisting of ferrite matrix reinforced with dispersed Fe borides, were obtained at a higher heat input (plasmatron current 240-250 A. The average amount of oxides in the coatings makes 15%. 0,5% addition of nanopowder ZrO2 accelerates dispersed iron-boron compounds forming, promotes their uniform distribution in the structure and improves coating microhardness up to 7,0 GPa. Application of the differential thermal analysis method to simulate the interaction processes between the steel shell and the filler during the heating of wire in the shielding gas makes it possible to promote formation of new phases (borides and carboborides of iron and to predict the phase composition of the coatings

  4. SAFARI digital processing unit: performance analysis of the SpaceWire links in case of a LEON3-FT based CPU

    Science.gov (United States)

    Giusi, Giovanni; Liu, Scige J.; Di Giorgio, Anna M.; Galli, Emanuele; Pezzuto, Stefano; Farina, Maria; Spinoglio, Luigi

    2014-08-01

    SAFARI (SpicA FAR infrared Instrument) is a far-infrared imaging Fourier Transform Spectrometer for the SPICA mission. The Digital Processing Unit (DPU) of the instrument implements the functions of controlling the overall instrument and implementing the science data compression and packing. The DPU design is based on the use of a LEON family processor. In SAFARI, all instrument components are connected to the central DPU via SpaceWire links. On these links science data, housekeeping and commands flows are in some cases multiplexed, therefore the interface control shall be able to cope with variable throughput needs. The effective data transfer workload can be an issue for the overall system performances and becomes a critical parameter for the on-board software design, both at application layer level and at lower, and more HW related, levels. To analyze the system behavior in presence of the expected SAFARI demanding science data flow, we carried out a series of performance tests using the standard GR-CPCI-UT699 LEON3-FT Development Board, provided by Aeroflex/Gaisler, connected to the emulator of the SAFARI science data links, in a point-to-point topology. Two different communication protocols have been used in the tests, the ECSS-E-ST-50-52C RMAP protocol and an internally defined one, the SAFARI internal data handling protocol. An incremental approach has been adopted to measure the system performances at different levels of the communication protocol complexity. In all cases the performance has been evaluated by measuring the CPU workload and the bus latencies. The tests have been executed initially in a custom low level execution environment and finally using the Real- Time Executive for Multiprocessor Systems (RTEMS), which has been selected as the operating system to be used onboard SAFARI. The preliminary results of the carried out performance analysis confirmed the possibility of using a LEON3 CPU processor in the SAFARI DPU, but pointed out, in agreement

  5. In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens

    NARCIS (Netherlands)

    Jongsma, Marije A.; van der Mei, Henny C.; Atema-Smit, Jelly; Busscher, Henk I.; Ren, Yijin

    2015-01-01

    Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased

  6. Modeling birds on wires.

    Science.gov (United States)

    Aydoğdu, A; Frasca, P; D'Apice, C; Manzo, R; Thornton, J M; Gachomo, B; Wilson, T; Cheung, B; Tariq, U; Saidel, W; Piccoli, B

    2017-02-21

    In this paper we introduce a mathematical model to study the group dynamics of birds resting on wires. The model is agent-based and postulates attraction-repulsion forces between the interacting birds: the interactions are "topological", in the sense that they involve a given number of neighbors irrespective of their distance. The model is first mathematically analyzed and then simulated to study its main properties: we observe that the model predicts birds to be more widely spaced near the borders of each group. We compare the results from the model with experimental data, derived from the analysis of pictures of pigeons and starlings taken in New Jersey: two different image elaboration protocols allow us to establish a good agreement with the model and to quantify its main parameters. We also discuss the potential handedness of the birds, by analyzing the group organization features and the group dynamics at the arrival of new birds. Finally, we propose a more refined mathematical model that describes landing and departing birds by suitable stochastic processes. Copyright © 2016 Elsevier Ltd. All rights reserved.

  7. A preliminary study of laser cladding of AISI 316 stainless steel using preplaced NiTi wire

    International Nuclear Information System (INIS)

    Cheng, F.T.; Lo, K.H.; Man, H.C.

    2004-01-01

    NiTi wire of diameter 1 mm was preplaced on AISI 316 stainless steel samples by using a binder. Melting of the NiTi wire to form a clad track on the steel substrate was achieved by means of a high-power CW Nd:YAG laser using different processing parameters. The geometry and microstructure of the clad deposit were studied by optical microscopy and scanning electron microscopy (SEM), respectively. The hardness and compositional profiles along the depth of the deposit were acquired by microhardness testing and energy-dispersive spectroscopy (EDS), respectively. The elastic behavior of the deposit was analyzed using nanoindentation, and compared with that of the NiTi wire. The dilution of the NiTi clad by the substrate material beneath was substantial in single clad tracks, but could be successively reduced in multiple clad layers. A strong fusion bonding with tough interface could be obtained as evidenced by the integrity of Vickers indentations in the interfacial region. In comparison with the NiTi cladding on AISI 316 using the tungsten inert gas (TIG) process, the laser process was capable of producing a much less defective cladding with a more homogeneous microstructure, which is an essential cladding quality with respect to cavitation erosion and corrosion resistance. Thus, the present preliminary study shows that laser cladding using preplaced wire is a feasible method to obtain a thick and homogeneous NiTi-based alloy layer on AISI 316 stainless steel substrate

  8. Parental Bonding

    Directory of Open Access Journals (Sweden)

    T. Paul de Cock

    2014-08-01

    Full Text Available Estimating the early parent–child bonding relationship can be valuable in research and practice. Retrospective dimensional measures of parental bonding provide a means for assessing the experience of the early parent–child relationship. However, combinations of dimensional scores may provide information that is not readily captured with a dimensional approach. This study was designed to assess the presence of homogeneous groups in the population with similar profiles on parental bonding dimensions. Using a short version of the Parental Bonding Instrument (PBI, three parental bonding dimensions (care, authoritarianism, and overprotection were used to assess the presence of unobserved groups in the population using latent profile analysis. The class solutions were regressed on 23 covariates (demographics, parental psychopathology, loss events, and childhood contextual factors to assess the validity of the class solution. The results indicated four distinct profiles of parental bonding for fathers as well as mothers. Parental bonding profiles were significantly associated with a broad range of covariates. This person-centered approach to parental bonding has broad utility in future research which takes into account the effect of parent–child bonding, especially with regard to “affectionless control” style parenting.

  9. Anodic Aluminum Oxide Templates for Nano wires Array Fabrication

    International Nuclear Information System (INIS)

    Nur Ubaidah Saidin; Kok, K.Y.; Ng, I.K.

    2011-01-01

    This paper reports on the process developed to fabricate anodic aluminium oxide (AAO) templates suitable for the fabrication of nano wire arrays. Anodization process has been used to fabricate the AAO templates with pore diameters ranging from 15 nm to 30 nm. Electrodeposition of parallel arrays of high aspect ratio nickel nano wires were demonstrated using these fabricated AAO templates. The nano wires produced were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that the orientations of the electrodeposited nickel nano wires were governed by the deposition current and electrolyte conditions. (author)

  10. Ferromagnetic artificial pinning centers in multifilamentary superconducting wires

    International Nuclear Information System (INIS)

    Wang, J.Q.; Rizzo, N.D.; Prober, D.E.

    1997-01-01

    The authors fabricated multifilamentary NbTi wires with ferromagnetic (FM) artificial pinning centers (APCs) to enhance the critical current density (J c ) in magnetic fields. They used a bundle and draw technique to process the APC wires with either Ni or Fe as the pinning centers. Both wires produced higher J c in the high field range (5-9 T) than previous non-magnetic APC wires similarly processed, even though the authors have not yet optimized pin percentage. Using a magnetometer they found that the pins remained ferromagnetic for the wires with maximum J c . However, they did observe a substantial loss of FM material for the wires where the pin diameter approached 3 nm. Thus, they expect further enhancement of J c with better pin quality

  11. RESEARCH OF PROCESS OF AN ALLOYING OF THE FUSED COATINGS RECEIVED FROM THE SUPERFICIAL ALLOYED WIRE BY BORON WITH IN ADDITIONALLY APPLIED ELECTROPLATED COATING OF CHROME AND COPPER

    Directory of Open Access Journals (Sweden)

    V. A. Stefanovich

    2015-01-01

    Full Text Available Researches on distribution of chrome and copper in the fused coating received from the superficial alloyed wire by boron with in additionally applied electroplated coating of chrome and copper were executed. The structure of the fused coating consists of dendrites on which borders the boride eutectic is located. It is established that the content of chrome in dendrites is 1,5– 1,6 times less than in the borid; distribution of copper on structure is uniformed. Coefficients of digestion of chrome and copper at an argon-arc welding from a wire electrode with electroplated coating are established. The assimilation coefficient for chrome is equal to 0,9–1,0; for copper – 0,6–0,75.

  12. Investigation of the fabrication process of hot-worked stainless-steel and Mo sheathed PbMo6 S8 wires

    International Nuclear Information System (INIS)

    Yamasaki, H.; Kimura, Y.

    1988-01-01

    Stainless-steel and Mo sheathed PbMo 6 S 8 wires have been fabricated by hot working from modified PbS, Mo, and MoS 2 mixed powders which were prepared by reacting Pb, Mo, and S at 530 0 C. Critical current densities were investigated for different preparation conditions, and it is revealed that obtaining continuous current path between PbMo 6 S 8 grains is the most important factor to achieve high critical current density. The J/sub c/ value of 2.8 x 10 4 Acm 2 (8 T), 7.8 x 10 3 Acm 2 (15 T), and 1.3 x 10 3 Acm 2 (23 T) was observed for the PbMo 6 S/sub 7.0/ wire heat treated at 700 0 C.copic

  13. Si Wire-Array Solar Cells

    Science.gov (United States)

    Boettcher, Shannon

    2010-03-01

    Micron-scale Si wire arrays are three-dimensional photovoltaic absorbers that enable orthogonalization of light absorption and carrier collection and hence allow for the utilization of relatively impure Si in efficient solar cell designs. The wire arrays are grown by a vapor-liquid-solid-catalyzed process on a crystalline (111) Si wafer lithographically patterned with an array of metal catalyst particles. Following growth, such arrays can be embedded in polymethyldisiloxane (PDMS) and then peeled from the template growth substrate. The result is an unusual photovoltaic material: a flexible, bendable, wafer-thickness crystalline Si absorber. In this paper I will describe: 1. the growth of high-quality Si wires with controllable doping and the evaluation of their photovoltaic energy-conversion performance using a test electrolyte that forms a rectifying conformal semiconductor-liquid contact 2. the observation of enhanced absorption in wire arrays exceeding the conventional light trapping limits for planar Si cells of equivalent material thickness and 3. single-wire and large-area solid-state Si wire-array solar cell results obtained to date with directions for future cell designs based on optical and device physics. In collaboration with Michael Kelzenberg, Morgan Putnam, Joshua Spurgeon, Daniel Turner-Evans, Emily Warren, Nathan Lewis, and Harry Atwater, California Institute of Technology.

  14. A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices

    Science.gov (United States)

    Feng, Hongliang; Huang, Jihua; Yang, Jian; Zhou, Shaokun; Zhang, Rong; Chen, Shuhai

    2017-07-01

    A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the reactive system. The results show that the bonding layer is composed of Ni3Sn4 and residual fine Ni particles with a small amount of Ni3Sn2 at 340°C for 240 min, which has a heat-resistant temperature higher than 790°C. The microstructural evolution and thermal characteristic of the bonding layer for various times at 300°C and 340°C were also studied, respectively. This reveals that, after isothermally holding for 240 min at 300°C and for 180 min at 340°C, Sn has been completely transformed into Ni-Sn intermetallic compounds (IMCs) and the bonding layer is mainly composed of Ni3Sn4 and residual Ni particles. The analysis result for the mechanical properties of the joint shows that the hardness of the bonding layer at 340°C for 240 min is uniform and that the average value reaches 3.66 GPa, which is close to that of the Ni3Sn4 block material. The shear test shows that, as the holding time increases from 60 min to 180 min at 340°C, because of the existence of Sn, the disparity of shear strength between room temperature and 350°C is large. But when the holding time is 180 min or longer, Sn has been completely transformed into Ni-Sn IMCs. Their performances are very similar whether at room temperature or 350°C.

  15. Prediction of grain deformation in drawn copper wire

    OpenAIRE

    Chang Chao-Cheng; Wang Zi-Wei; Huang Chien-Kuo; Wu Hsu-Fu

    2015-01-01

    Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copp...

  16. Preparation of the Wire of ZChSnSb11-6 Used for Remanufacturing Thermal Spraying

    Science.gov (United States)

    Zhang, B.; Yang, Z. Y.; Fu, D. X.; Li, X. F.; Chen, W.

    Tin base Babbitt alloy widely used in bearing bush production and repair, the performance of ZChSnSb11-6 is better than ZChSnSb8-4.But as a result of as-cast structure of ZChSnSb11-6 is rich in big hard phase, its processing performance is bad, in this paper, through the optimization of smelting, casting, extrusion, drawing and other processes we have been successfully prepared ZChSnSb11-6 wire suitable for thermal spraying. Through metallographic examination, micro hardness, bond strength and porosity testing, it was proved that the wire meet the requirements of bearing manufacturing thermal spraying.

  17. Ultrasonic cleaning of electrodes of wire chambers

    International Nuclear Information System (INIS)

    Krasnov, V.A.; Kurepin, A.B.; Razin, V.I.

    1980-01-01

    A technological process of cleaning electrodes and working volume surfaces of wire chambers from contaminations by the simultaneous mechanical action of the energy of ultrasonic oscillations and the chemical action of detergents is discussed. A device for cleaning wire electrodes of proportional chambers of 0.3x0.4 m is described. The device uses two ultrasonic generators with a total power of 0.5 kW. As a detergent use is made of a mixture of ethyl alcohol, gasoline and freon. In the process of cleaning production defects can be detected in the wire chambers which makes it possible to timely remove the defects. Measurements of the surface resistance of fiberglass laminate of printed drift chamber electrodes at a voltage of 2 kV showed that after completing the cleaning process the resistance increases 15-20%

  18. Micro Wire-Drawing: Experiments And Modelling

    International Nuclear Information System (INIS)

    Berti, G. A.; Monti, M.; Bietresato, M.; D'Angelo, L.

    2007-01-01

    In the paper, the authors propose to adopt the micro wire-drawing as a key for investigating models of micro forming processes. The reasons of this choice arose in the fact that this process can be considered a quasi-stationary process where tribological conditions at the interface between the material and the die can be assumed to be constant during the whole deformation. Two different materials have been investigated: i) a low-carbon steel and, ii) a nonferrous metal (copper). The micro hardness and tensile tests performed on each drawn wire show a thin hardened layer (more evident then in macro wires) on the external surface of the wire and hardening decreases rapidly from the surface layer to the center. For the copper wire this effect is reduced and traditional material constitutive model seems to be adequate to predict experimentation. For the low-carbon steel a modified constitutive material model has been proposed and implemented in a FE code giving a better agreement with the experiments

  19. Wire core reactor for NTP

    International Nuclear Information System (INIS)

    Harty, R.B.

    1991-01-01

    The development of the wire core system for Nuclear Thermal Propulsion (NTP) that took place from 1963 to 1965 is discussed. A wire core consists of a fuel wire with spacer wires. It's an annular flow core having a central control rod. There are actually four of these, with beryllium solid reflectors on both ends and all the way around. Much of the information on the concept is given in viewgraph form. Viewgraphs are presented on design details of the wire core, the engine design, engine weight vs. thrust, a technique used to fabricate the wire fuel element, and axial temperature distribution

  20. Effect of resin cement, aging process and root level on the bond strength of the resin-fiber posts

    Science.gov (United States)

    Almuhim, Khalid Salman

    Background. Little is known about the long-term clinical bonding effectiveness of the Fiber-reinforced composite (FRC) posts cemented with self-etch adhesive systems. Bond stability and longevity of the cemented post are adversely affected by physical and chemical factors over time, such as expansion and contraction stresses caused by thermal changes and occlusal load. This clinical condition can be simulated in vitro by thermocyclic loading; and bonding effectiveness can be evaluated by applying the micropush out test. Therefore, more in vitro studies are needed to evaluate the bond strength of the fiber posts cemented with different resin cement systems after simulating the artificial aging induced by thermocycling. The aim of this study was to compare the microtensile bond strength of two different resin cement systems (total etch, and self-etch resin cement system) used for cementation of fiber reinforced composite posts in three different aging periods using thermocycling. Methods. Following IRB approval, sixty freshly extracted bicuspid single rooted natural teeth were endodontically treated, and the post-spaces were prepared to receive a fiber-post cemented with either a total etch resin cement (Rely-X Ultimate) or with a self-etch resin cement (Rely-X Unicem). No thermocycling, 20,000 and 40,000 cycles was used to age the specimens. Teeth were randomly allocated into six different groups: G1 - Control: Rely-X Ultimate cement with no thermocycling. G2: Rely-X Ultimate cement with 20,000 thermocycling. G3: Rely-X Ultimate cement with 40,000 thermocycling. G4: Rely-X Unicem cement. G5: Rely-X Unicem cement. G6: Rely-X Unicem cement. Microtensile bond strength determined using a micropush out test on a universal testing machine (MTS). Additionally, the failure mode of each specimen was observed under a stereomicroscope (Olympus) at 40x magnification. Finally, one representative sample was randomly selected from each of the five failure modes for scanning

  1. Wired to freedom

    DEFF Research Database (Denmark)

    Jepsen, Kim Sune Karrasch; Bertilsson, Margareta

    2017-01-01

    dimension of life science through a notion of public politics adopted from the political theory of John Dewey. We show how cochlear implantation engages different social imaginaries on the collective and individual levels and we suggest that users share an imaginary of being “wired to freedom” that involves...... new access to social life, continuous communicative challenges, common practices, and experiences. In looking at their lives as “wired to freedom,” we hope to promote a wider spectrum of civic participation in the benefit of future life science developments within and beyond the field of Cochlear...

  2. Electric wiring domestic

    CERN Document Server

    Coker, A J

    1992-01-01

    Electric Wiring: Domestic, Tenth Edition, is a clear and reliable guide to the practical aspects of domestic electric wiring. Intended for electrical contractors, installation engineers, wiremen and students, its aim is to provide essential up to date information on modern methods and materials in a simple, clear, and concise manner. The main changes in this edition are those necessary to bring the work into line with the 16th Edition of the Regulations for Electrical Installations issued by the Institution of Electrical Engineers. The book begins by introducing the basic features of domestic

  3. Unexpected complications of bonded mandibular lingual retainers.

    NARCIS (Netherlands)

    Katsaros, C.; Livas, C.; Renkema, A.M.

    2007-01-01

    INTRODUCTION: The flexible spiral wire (FSW) retainer is the most frequently used type of fixed retainer bonded on all 6 anterior teeth. Our aim in this article was to demonstrate unexpected posttreatment changes in the labiolingual position of the mandibular anterior teeth associated with the use

  4. Failure analysis of the fractured wires in sternal perichronal loops.

    Science.gov (United States)

    Chao, Jesús; Voces, Roberto; Peña, Carmen

    2011-10-01

    We report failure analysis of sternal wires in two cases in which a perichronal fixation technique was used to close the sternotomy. Various characteristics of the retrieved wires were compared to those of unused wires of the same grade and same manufacturer and with surgical wire specifications. In both cases, wire fracture was un-branched and transgranular and proceeded by a high cycle fatigue process, apparently in the absence of corrosion. However, stress anlysis indicates that the effective stress produced during strong coughing is lower than the yield strength. Our findings suggest that in order to reduce the risk for sternal dehiscence, the diameter of the wire used should be increased. Copyright © 2011 Elsevier Ltd. All rights reserved.

  5. Evaluation of the shear bond strength of lingual brackets manufactured by three different processes using two different adhesive primers: An in vitro study

    Directory of Open Access Journals (Sweden)

    Shrinivas Ashtekar

    2016-01-01

    Full Text Available Objective: To compare and evaluate the shear bond strength (SBS of lingual brackets, manufactured by three different processes, that is, laser sintering, milling, and casting, bonded with two different adhesive primers. Materials and Methods: One hundred and twenty premolars were selected, and three types of lingual brackets were used, namely, STB (milling, 7th Generation (casting, and lingualmatrix (laser sintering. Forty brackets per system were used half of which were sandblasted while the other half were used as available. Further, these were subdivided and bonded with Transbond XT primer and adhesive and 3M ESPE Primer and Transbond XT adhesive. Customization of STB and 7th Generation was done by Torque Angulation Reference Guide, Lingualmatrix had bases customized by Computer-aided design/computer-aided manufacturing. SBS was tested with universal testing machine and evaluated for adhesive remnant index (ARI. Results: Statistical analysis showed that surface treatment, use of different primers, method of customization influenced the SBS, and ARI suggested that the fracture occurred between composite and bracket interface. Conclusion: Lingualmatrix bracket showed greater SBS as compared to STB and 7th Generation, sandblasting increased SBS. 3M ESPE primer group showed increased SBS as that bonded with Transbond XT primer. The fracture was between the composite bracket interface.

  6. Electron transport in quantum wires: possible current instability mechanism

    International Nuclear Information System (INIS)

    Sablikov, V.A.

    2001-01-01

    The electrons nonlinear and dynamic transition in quantum wires connecting the electron reservoirs, are studies with an account of the Coulomb interaction distribution of electron density between the reservoirs and the wire. It is established that there exist two processes, leading to electrical instability in such structure. One of them is expressed in form of multistability of the charge accumulated in the wire, and negative differential conductivity. The other one is connected with origination of negative dynamic conductivity in the narrow frequency range near the resonance frequency of the charge waves on the wire length [ru

  7. Evaluation of mechanical properties in metal wire mesh supported selective catalytic reduction (SCR) catalyst structures

    Science.gov (United States)

    Rajath, S.; Siddaraju, C.; Nandakishora, Y.; Roy, Sukumar

    2018-04-01

    The objective of this research is to evaluate certain specific mechanical properties of certain stainless steel wire mesh supported Selective catalytic reduction catalysts structures wherein the physical properties of the metal wire mesh and also its surface treatments played vital role thereby influencing the mechanical properties. As the adhesion between the stainless steel wire mesh and the catalyst material determines the bond strength and the erosion resistance of catalyst structures, surface modifications of the metal- wire mesh structure in order to facilitate the interface bonding is therefore very important to realize enhanced level of mechanical properties. One way to enhance such adhesion properties, the stainless steel wire mesh is treated with the various acids, i.e., chromic acid, phosphoric acid including certain mineral acids and combination of all those in various molar ratios that could generate surface active groups on metal surface that promotes good interface structure between the metal- wire mesh and metal oxide-based catalyst material and then the stainless steel wire mesh is dipped in the glass powder slurry containing some amount of organic binder. As a result of which the said catalyst material adheres to the metal-wire mesh surface more effectively that improves the erosion profile of supported catalysts structure including bond strength.

  8. Voltage-assisted polymer wafer bonding

    International Nuclear Information System (INIS)

    Varsanik, J S; Bernstein, J J

    2012-01-01

    Polymer wafer bonding is a widely used process for fabrication of microfluidic devices. However, best practices for polymer bonds do not achieve sufficient bond strength for many applications. By applying a voltage to a polymer bond in a process called voltage-assisted bonding, bond strength is shown to improve dramatically for two polymers (Cytop™ and poly(methyl methacrylate)). Several experiments were performed to provide a starting point for further exploration of this technique. An optimal voltage range is experimentally observed with a reduction in bonding strength at higher voltages. Additionally, voltage-assisted bonding is shown to reduce void diameter due to bond defects. An electrostatic force model is proposed to explain the improved bond characteristics. This process can be used to improve bond strength for most polymers. (paper)

  9. A World without Wires

    Science.gov (United States)

    Panettieri, Joseph C.

    2006-01-01

    The wireless bandwagon is rolling across Mississippi, picking up a fresh load of converts and turning calamity into opportunity. Traditional wired school networks, many of which unraveled during Hurricane Katrina, are giving way to advanced wireless mesh networks that frequently include voice-over-IP (VoIP) capabilities. Vendor funding is helping…

  10. 3D Wire 2015

    DEFF Research Database (Denmark)

    Jordi, Moréton; F, Escribano; J. L., Farias

    This document is a general report on the implementation of gamification in 3D Wire 2015 event. As the second gamification experience in this event, we have delved deeply in the previous objectives (attracting public areas less frequented exhibition in previous years and enhance networking) and have...

  11. Wire chamber conference

    International Nuclear Information System (INIS)

    Bartl, W.; Neuhofer, G.; Regler, M.

    1986-02-01

    This booklet contains program and the abstracts of the papers presented at the conference, most of them dealing with performance testing of various types of wire chambers. The publication of proceedings is planned as a special issue of 'Nuclear instruments and methods' later on. All abstracts are in English. An author index for the book of abstracts is given. (A.N.)

  12. Wire EDM for Refractory Materials

    Science.gov (United States)

    Zellars, G. R.; Harris, F. E.; Lowell, C. E.; Pollman, W. M.; Rys, V. J.; Wills, R. J.

    1982-01-01

    In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.

  13. Practical wiring in SI units

    CERN Document Server

    Miller, Henry A

    2013-01-01

    Practical Wiring, Volume 1 is a 13-chapter book that first describes some of the common hand tools used in connection with sheathed wiring. Subsequent chapters discuss the safety in wiring, cables, conductor terminations, insulating sheathed wiring, conductor sizes, and consumer's control equipments. Other chapters center on socket outlets, plugs, lighting subcircuits, lighting accessories, bells, and primary and secondary cells. This book will be very valuable to students involved in this field of interest.

  14. Wire chambers: Trends and alternatives

    International Nuclear Information System (INIS)

    Regler, Meinhard

    1992-01-01

    The subtitle of this year's Vienna Wire Chamber Conference - 'Recent Trends and Alternative Techniques' - signalled that it covered a wide range of science and technology. While an opening Vienna talk by wire chamber pioneer Georges Charpak many years ago began 'Les funerailles des chambres a fils (the burial of wire chambers)', the contrary feeling this year was that wire chambers are very much alive!

  15. Model-Based Testability Assessment and Directed Troubleshooting of Shuttle Wiring Systems

    Science.gov (United States)

    Deb, Somnath; Domagala, Chuck; Shrestha, Roshan; Malepati, Venkatesh; Cavanaugh, Kevin; Patterson-Hine, Ann; Sanderfer, Dwight; Cockrell, Jim; Norvig, Peter (Technical Monitor)

    2000-01-01

    We have recently completed a pilot study on the Space shuttle wiring system commissioned by the Wiring Integrity Research (WIRe) team at NASA Ames Research Center, As the space shuttle ages, it is experiencing wiring degradation problems including arcing, chaffing insulation breakdown and broken conductors. A systematic and comprehensive test process is required to thoroughly test and quality assure (QA) the wiring systems. The NASA WIRe team recognized the value of a formal model based analysis for risk-assessment and fault coverage analysis. However. wiring systems are complex and involve over 50,000 wire segments. Therefore, NASA commissioned this pilot study with Qualtech Systems. Inc. (QSI) to explore means of automatically extracting high fidelity multi-signal models from wiring information database for use with QSI's Testability Engineering and Maintenance System (TEAMS) tool.

  16. Shape memory alloy wire-based smart natural rubber bearing

    International Nuclear Information System (INIS)

    Hedayati Dezfuli, F; Shahria Alam, M

    2013-01-01

    In this study, two types of smart elastomeric bearings are presented using shape memory alloy (SMA) wires. Due to the unique characteristics of SMAs, such as the superelastic effect and the recentering capability, the residual deformation in SMA-based natural rubber bearings (SMA-NRBs) is significantly reduced whereas the energy dissipation capacity is increased. Two different configurations of SMA wires incorporated in elastomeric bearings are considered. The effect of several parameters, including the shear strain amplitude, the type of SMA, the aspect ratio of the base isolator, the thickness of SMA wire, and the amount of pre-strain in the wires on the performance of SMA-NRBs is investigated. Rubber bearings are composed of natural rubber layers bonded to steel shims as reinforcement. Results show that ferrous SMA wire, FeNiCuAlTaB, with 13.5% superelastic strain and a very low austenite finish temperature (−62 °C), is the best candidate to be used in SMA-NRBs subjected to high shear strain amplitudes. In terms of the lateral flexibility and wire strain level, the smart rubber bearing with a cross configuration of SMA wires is more efficient. Moreover, the cross configuration can be implemented in high-aspect-ratio elastomeric bearings since the strain induced in the wire does not exceed the superelastic range. When cross SMA wires with 2% pre-strain are used in a smart NRB, the dissipated energy is increased by 74% and the residual deformation is decreased by 15%. (paper)

  17. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    International Nuclear Information System (INIS)

    Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

    2011-01-01

    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

  18. Quantum conductance in silicon quantum wires

    CERN Document Server

    Bagraev, N T; Klyachkin, L E; Malyarenko, A M; Gehlhoff, W; Ivanov, V K; Shelykh, I A

    2002-01-01

    The results of investigations of electron and hole quantum conductance staircase in silicon quantum wires are presented. The characteristics of self-ordering quantum wells of n- and p-types, which from on the silicon (100) surface in the nonequilibrium boron diffusion process, are analyzed. The results of investigations of the quantum conductance as the function of temperature, carrier concentration and modulation degree of silicon quantum wires are given. It is found out, that the quantum conductance of the one-dimensional channels is observed, for the first time, at an elevated temperature (T >= 77 K)

  19. Numerical Simulation of Wire-Coating

    DEFF Research Database (Denmark)

    Wapperom, Peter; Hassager, Ole

    1999-01-01

    A finite element program has been used to analyze the wire-coating process of an MDPE melt. The melt is modeled by a nonisothermal Carreau model. The emphasis is on predicting an accurate temperature field. Therefore, it is necessary to include the heat conduction in the metal parts. A comparison...

  20. Feasibility studies on the direct wire readout on wire scanners in electron accelerators

    International Nuclear Information System (INIS)

    Markert, Michael

    2010-10-01

    This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

  1. Vienna Wire Chamber Conference

    International Nuclear Information System (INIS)

    Anon.

    1983-01-01

    After those of 1978 and 1980, a third Wire Chamber Conference was held from 15-18 February in the Technical University of Vienna. Eight invited speakers covered the field from sophisticated applications in biology and medicine, via software, to the state of the art of gaseous detectors. In some forty other talks the speakers tackled in more detail the topics of gaseous detectors, calorimetry and associated electronics and software

  2. The Micro Wire Detector

    International Nuclear Information System (INIS)

    Adeva, B.; Gomez, F.; Pazos, A.; Pfau, R.; Plo, M.; Rodriguez, J.M.; Vazquez, P.; Labbe, J.C.

    1999-01-01

    We present the performance of a new proportional gas detector. Its geometry consists of a cathode plane with 70x70 μm 2 apertures, crossed by 25 μm anode strips to which it is attached by 50 μm kapton spacers. In the region where the avalanche takes place, the anode strips are suspended in the gas mixture as in a standard wire chamber. This detector exhibits high rate capability and large gains, introducing very little material. (author)

  3. Superconducting magnet wire

    Science.gov (United States)

    Schuller, Ivan K.; Ketterson, John B.; Banerjee, Indrajit

    1986-01-01

    A superconducting tape or wire with an improved critical field is formed of alternating layers of a niobium-containing superconductor such as Nb, NbTi, Nb.sub.3 Sn or Nb.sub.3 Ge with a thickness in the range of about 0.5-1.5 times its coherence length, supported and separated by layers of copper with each copper layer having a thickness in the range of about 170-600 .ANG..

  4. Twisting wire scanner

    Energy Technology Data Exchange (ETDEWEB)

    Gharibyan, V.; Delfs, A.; Koruptchenkov, I.; Noelle, D.; Tiessen, H.; Werner, M.; Wittenburg, K.

    2012-11-15

    A new type of 'two-in-one' wire scanner is proposed. Recent advances in linear motors' technology make it possible to combine translational and rotational movements. This will allow to scan the beam in two perpendicular directions using a single driving motor and a special fork attached to it. Vertical or horizontal mounting will help to escape problems associated with the 45 deg scanners. Test results of the translational part with linear motors is presented.

  5. Twisting wire scanner

    International Nuclear Information System (INIS)

    Gharibyan, V.; Delfs, A.; Koruptchenkov, I.; Noelle, D.; Tiessen, H.; Werner, M.; Wittenburg, K.

    2012-11-01

    A new type of 'two-in-one' wire scanner is proposed. Recent advances in linear motors' technology make it possible to combine translational and rotational movements. This will allow to scan the beam in two perpendicular directions using a single driving motor and a special fork attached to it. Vertical or horizontal mounting will help to escape problems associated with the 45 deg scanners. Test results of the translational part with linear motors is presented.

  6. Wire chamber gases

    International Nuclear Information System (INIS)

    Va'vra, J.

    1992-04-01

    In this paper, we describe new developments in gas mixtures which have occurred during the last 3--4 years. In particular, we discuss new results on the measurement and modeling of electron drift parameters, the modeling of drift chamber resolution, measurements of primary ionization and the choice of gas for applications such as tracking, single electron detection, X-ray detection and visual imaging. In addition, new results are presented on photon feedback, breakdown and wire aging

  7. A study on the development of high-Tc superconducting wire

    International Nuclear Information System (INIS)

    Won, Dong Yeon; Chang, In Soon; Lee, Jong Min; Um, Tae Yoon; Hong, Kyae Won; Lee, Ho Jin; Lee, Hee Kwun; Kim, Chan Joong; Park, Soon Dong; Kim, Woo Gon; Kim, Ki Baek; Kwon, Sun Chil

    1992-10-01

    On this study Y-Ba-Cu-O was prepared by partial melt process and superconducting wire was fabricated by powder-in-tube method. First, mechancial properties, electrical properties, microstructure and oxygen diffusion behavior were observed. Second, through fabricated superconducting wire, conceptual design, composition and plasticity of filament superconducting wire were investigated. (Author)

  8. Technology development of fabrication NbTi and Nb3 Sn superconducting wires

    International Nuclear Information System (INIS)

    Rodrigues Junior, D.; Bormio, C.; Baldan, C.A.; Ramos, M.J.; Pinatti, D.G.

    1988-01-01

    The technology development of NbTi and Nb 3 Sn superconducting wires are studied, mentioning the use of fluxes capture theory in the sizing of wires fabrication. The fabrication process, the thermal treatment and the experimental datas of critical temperature and current of Nb 3 Sn wires are described. (C.G.C.) [pt

  9. Recent development of drastically innovative BSCCO wire (DI-BISCCO)

    International Nuclear Information System (INIS)

    Kikuchi, M.; Kato, T.; Ohkura, K.; Ayai, N.; Fujikami, J.; Fujino, K.; Kobayashi, S.; Ueno, E.; Yamazaki, K.; Yamade, S.; Hayashi, K.; Sato, K.; Nagai, T.; Matsui, Y.

    2006-01-01

    Up to this day, Ag-sheathed Bi2223 superconducting wires have been widely investigated and the long wires about 1000 m have been produced by using powder-in-tube (PIT) method on a commercial basis in the various facilities or companies. Although the wires are used for some applications such as HTS cables, magnets, motor and so on, the Bi2223 wires not only require much more improvements of the superconducting properties such as critical current, mechanical properties, but also longer and more uniform wires. Recently, the performances of Bi2223 wires have been drastically improved by using Controlled Over Pressure (CT-OP) sintering process. CT-OP process increased critical current (I c ) by more than 60% at 77 K and self field and improved the mechanical strength by more than 70%. The maximum I c was increased up to 166 A. These drastic improvements were caused by the higher density of Bi2223 filament up to almost 100% and better connectivity of the Bi2223 grains. The dense structure of the Bi2223 filaments prevents the ballooning phenomenon which is caused by the gasification of the trapped liquid nitrogen during temperature rise. Additionally, higher uniformity and higher production yield of long length wire were also achieved by exterminating defects during sintering. These high performance levels in CT-OP wires have contributed commercial level applications. We call as Drastically Innovative BSCCO (DI-BSCCO)

  10. High-strength high-conductivity Cu-Nb microcomposite sheet fabricated via multiple roll bonding

    International Nuclear Information System (INIS)

    Jha, S.C.; Delagi, R.G.; Forster, J.A.; Krotz, P.D.

    1993-01-01

    Copper-niobium microcomposites are a new class of high-strength high-conductivity materials that have attractive properties for room- and elevated-temperature applications. Since Nb has little solid solubility in Cu, addition of Nb to Cu does not affect its conductivity. Copper-niobium microcomposites are melted and cast so that the microstructure of cast Cu-Nb ingots consists of 1- to 10 μm Nb dendrites uniformly distributed within the copper matrix. Extensive wire drawing with a true processing strain (η> 12) of Cu-Nb alloy leads to refinement and elongation of Nb dendrites into 1- to 10 nm-thick filaments. The presence of such fine Nb filaments causes a significant increase in the strength of Cu-Nb wires. The tensile strength of heavily drawn Cu-Nb wires was determined to be significantly higher than the values predicted by the rule of mixtures. This article reports the fabrication of high-strength Cu-Nb microcomposite sheet by multiple roll bonding. It is difficult and impractical to attain high processing strains (η>3) by simple cold rolling. In most practical cold-rolling operation, the thickness reduction does not exceed 90 pct (η ≅2). Therefore, innovative processing is required to generate high strength in Cu-Nb microcomposite sheet. Multiple roll bonding of Cu-Nb has been utilized to store high processing strain ( η>10) in the material and refine the Nb particle size within the copper matrix. This article describes the microstructure, mechanical properties, and thermal stability of roll-bonded Cu-Nb microcomposite sheet

  11. Dual wire welding torch and method

    Science.gov (United States)

    Diez, Fernando Martinez; Stump, Kevin S.; Ludewig, Howard W.; Kilty, Alan L.; Robinson, Matthew M.; Egland, Keith M.

    2009-04-28

    A welding torch includes a nozzle with a first welding wire guide configured to orient a first welding wire in a first welding wire orientation, and a second welding wire guide configured to orient a second welding wire in a second welding wire orientation that is non-coplanar and divergent with respect to the first welding wire orientation. A method of welding includes moving a welding torch with respect to a workpiece joint to be welded. During moving the welding torch, a first welding wire is fed through a first welding wire guide defining a first welding wire orientation and a second welding wire is fed through a second welding wire guide defining a second welding wire orientation that is divergent and non-coplanar with respect to the first welding wire orientation.

  12. Bonds Boom.

    Science.gov (United States)

    Reynolds, Cathryn

    1989-01-01

    The combined effect of the "Serrano" decision and Proposition 13 left California school districts with aging, overcrowded facilities. Chico schools won a $18.5 million general obligation bond election for facilities construction. With $11 billion needed for new school construction, California will need to tap local sources. A sidebar…

  13. An expert fault diagnosis system for auto wire bond machine

    NARCIS (Netherlands)

    Tan, C.F.

    2007-01-01

    In the modern world, computing is essential in all aspects of manufacturing activity. Computers have brought to life terms like artificial intelligence, and have played a critical role in reinvention of manufacturing industry. In continuing quest to decrease the interval time between

  14. Right wire in orthodontics: a review

    OpenAIRE

    Ali, Hashim

    2015-01-01

    Quality of orthodontic wire such as stiffness, hardness, resiliency, elasticity and working range are important determinants of the effectivenes of tooth movement. Commonly used types of orthodontic arch wire:1) stainless steel(ss) wire, 2) conventional nickel- titanium (NiTi)alloy wire,3) improved super elastic NiTi- alloy wire( also called low hysteresis(LH)wire), and titanium molybdenum alloy(TMA) wire.

  15. Process for improving the separation efficiency in the isolation of radioactive isotopes in elementary or chemically bonded form from liquids and gases

    International Nuclear Information System (INIS)

    Schmidberger, R.; Kirch, R.; Kock, W.

    1986-01-01

    In the process for the improvement of the separation efficiency in the isolation of radioactive isotopes in elementary or chemically bonded form from liquids or gases by ion exchange and adsorption, non-radioactive isotopes of the element to be isolated are added to the fluid before the isolation, whereas at the same time a large surplus of the non-radioactive isotopes to the radioactive isotopes is achieved by addition of only small quantities of compounds of the non-radioactive isotopes. (orig./RB) [de

  16. Effect of strain path on microstructure, deformation texture and mechanical properties of nano/ultrafine grained AA1050 processed by accumulative roll bonding (ARB)

    Energy Technology Data Exchange (ETDEWEB)

    Naseri, M.; Reihanian, M. [Department of Materials Science and Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz (Iran, Islamic Republic of); Borhani, E., E-mail: e.borhani@semnan.ac.ir [Department of Nano Technology, Nano Materials Group, Semnan University, Semnan (Iran, Islamic Republic of)

    2016-09-15

    Commercial pure Al sheets were severe plastically deformed at room temperature by accumulative roll bonding (ARB) and cross accumulative roll bonding (CARB). Change in strain path was imposed during CARB by rotating the sheets with 90° around the normal direction axis between each cycle. Microstructural evolution of processed sheets was studied by electron back scattered diffraction (EBSD) analysis and revealed that nano/ultrafine grains (NG/UFG) with the average grain size of 380 nm and 155 nm were formed by both processing routes after eight cycles, respectively. The fraction of high angle grain boundaries and mean misorientation angle of the boundaries in the CARB were 49% and 40.20°, respectively, in comparison to that of ARB sample (41% and 37.37°). Deformation texture evolution demonstrated that the change in strain path leads to the formation of strong orientation along the β-fiber. The major texture components for ARB specimens were Brass {011}<211> and S {123}<634> while those for CARB were Brass {011}<211> and Goss {011}<100>. The CARB processed specimen exhibited the tensile strength, microhardness and elongation of about 230 MPa, 92 HV and 13% compared with ARB sample (180 MPa, 80 HV and 10.5%) after eight cycles. Scanning electron microscopy (SEM) observations of tensile fracture surface of specimens revealed ductile type fracture.

  17. Novel manufacturing process of nanoparticle/Al composite filler metals of tungsten inert gas welding by accumulative roll bonding

    Energy Technology Data Exchange (ETDEWEB)

    Fattahi, M., E-mail: fattahi.put@gmail.com [Technical Inspection Engineering Department, Petroleum University of Technology, Abadan (Iran, Islamic Republic of); Noei Aghaei, V. [Aerospace Engineering Department, Sharif University of Technology, Tehran (Iran, Islamic Republic of); Dabiri, A.R. [Technical Inspection Engineering Department, Petroleum University of Technology, Abadan (Iran, Islamic Republic of); Amirkhanlou, S. [Young Researchers and Elite Club, Najafabad Branch, Islamic Azad University, Najafabad (Iran, Islamic Republic of); Akhavan, S.; Fattahi, Y. [Materials Engineering Department, Isfahan University of Technology, Isfahan (Iran, Islamic Republic of)

    2015-11-11

    In the present work, accumulative roll bonding (ARB) was used as an effective method for manufacturing nanoparticle/Al composite filler metals of tungsten inert gas (TIG) welding. After welding, the distribution of ceramic nanoparticles and mechanical properties of welds were investigated. By applying ARB, ceramic nanoparticles were uniformly dispersed in the composite filler metals. Consequently, the welds produced by these filler metals had a uniform dispersion of ceramic nanoparticles in their compositions. The test results showed that the yield strength of welds was greatly increased when using the nanoparticle/Al composite filler metals. The improvement in the yield strength was attributed to the coefficient of thermal expansion mismatch and Orowan strengthening mechanisms. Therefore, according to the results presented in this paper, it can be concluded that the nanoparticle/Al composite filler metals can serve as a novel filler metal for TIG welding of aluminum and its alloys.

  18. Single Wire Detector Performance Over One Year of Operation

    CERN Document Server

    Hervas Aguilar, David Alberto

    2014-01-01

    Abstract When ionizing radiation passes through gas chambers in single wire detectors gas molecules separate into ions and electrons. By applying a strong localized electric field near the single wire an avalanche of electrons is created and it can be collected. The current produced in the wire is then proportional to the energy of the particle detected. Nevertheless, many factors can contribute to detector aging effects which are visible in a loss of gain caused by deposition of contaminants on the collecting wire. This study consists on novel data analysis techniques used to process large amounts of data produced by two simultaneously running single wire detectors. Aging effects are analyzed while environmental fluctuations are corrected for. A series of scripts carry out data filtering, data matching, corrections, and finally trend plotting by using ROOT’s extensive libraries developed at CERN.

  19. Development of environmental-friendly wire and cable

    International Nuclear Information System (INIS)

    Ueno, Keiji

    1996-01-01

    The electron beam technology has been used in many industrial fields as a method of conventional polymer modification or optimum processability. The main industrial fields of radiation crosslinking are wire and cable, heat shrinkable tubings, plastic foams, precuring of tires, floppy disk curing, foods packaging films, and so on. The radiation crosslinking of wire and cable was started in 1961 in Japan and 15 wire and cable companies are now using electron beam accelerators for production or R and D. The dominant characteristics of crosslinking of insulation materials are application at high temperature, good oil and chemical resistibility and high mechanical properties. These radiation crosslinking wire and cable are applied widely in electronics equipments and automobiles. Recently, electronics manufacturers have indicated deep concern over the effects on the environment. Wire and cable also are required to be applicable for environmental preservation. (J.P.N.)

  20. Note: Recombination of H+ and OH− ions along water wires

    International Nuclear Information System (INIS)

    Lee, Song Hi; Rasaiah, Jayendran C.

    2013-01-01

    Transport and recombination of hydrogen and hydroxide ions along a hydrogen-bonded water wire are studied by molecular dynamics simulation using a dissociating model for water. The results are compared with a recent CP-MD study of neutralization in bulk water [A. Hassanali, M. K. Prakrash, H. Eshet, and M. Parrinello, Proc. Natl. Acad. Sci. U.S.A. 108, 20410 (2011)]. The translocation of H + and OH − along the wire is faster than in the bulk water, followed by compression of the water wire when two water molecules separate the transported ions. Neutralization occurs with the concerted transfer of three protons as in the bulk water, followed by energy dissipation along the water chain

  1. Review of wire chamber aging

    International Nuclear Information System (INIS)

    Va'Vra, J.

    1986-02-01

    This paper makes an overview of the wire chamber aging problems as a function of various chamber design parameters. It emphasizes the chemistry point of view and many examples are drawn from the plasma chemistry field as a guidance for a possible effort in the wire chamber field. The paper emphasizes the necessity of variable tuning, the importance of purity of the wire chamber environment, as well as it provides a practical list of presently known recommendations. In addition, several models of the wire chamber aging are qualitatively discussed. The paper is based on a summary talk given at the Wire Chamber Aging Workshop held at LBL, Berkeley on January 16-17, 1986. Presented also at Wire Chamber Conference, Vienna, February 25-28, 1986. 74 refs., 18 figs., 11 tabs

  2. Effects of magnetostatic interaction on the magnetization processes in Fe73.5Cu1Nb3Si13.5B9 nanocrystalline wires

    International Nuclear Information System (INIS)

    Li, Y.F.; Vazquez, M.; Chen, D.X.; Hernando, A.

    2002-01-01

    Fe 73.5 Cu 1 Nb 3 Si 13.5 B 9 amorphous wire was annealed at different temperatures (T a =400-700 deg. C, for 30 min) that result in partial devitrification and subsequently, the quasi-saturated hysteresis loop was measured. It is found that the loops are not symmetric, exhibiting two coercive fields, H c1 and H c2 , on descending and ascending branches, respectively. Moreover, the asymmetry degree is modified when the sample is previously magnetized under a field of 60 kA m -1 . The dependence on both maximum measured field, H m , and temperature, T, of the displaced loop has been determined. With increasing H m , the shift H sh =(H c2 +H c1 )/2 decreases and the coercivity H c =(H c2 -H c1 )/2 increases, but H sh -H c H c1 remains constant. Both H sh and the magnetic polarization, μ 0 M m , at maximum field decreases with elevating T. The loop of this sample also shows a remarkable time-effect. The H m - and T-dependent H sh is discussed considering the existence of an effective bias-field generated from the magnetostatic interaction between the nanocrystalline particles and residual soft matrix, and the time-effect could be ascribed to the dipolar interaction among the particles. (author)

  3. Optimization of arc-start performance by wire-feeding control for GMA welding

    Energy Technology Data Exchange (ETDEWEB)

    Kang, Jong Gu; Ryu, Gyeong Su; Rhee, Se Hun [Hanyang University, Seoul (Korea, Republic of); Kim, Dong Cheol; Kang, Mun Jin [Korea Institute of Industrial Technology, Incheon (Korea, Republic of); Park, Young Whan [Pukyong National University, Busan (Korea, Republic of)

    2013-02-15

    The wire feeding system for gas metal arc welding usually consists of a wire feeder and a torch. In many industries, the distance between the wire feeder and the torch is generally 3 m to 5 m. In a conventional wire feeder, a direct current (DC) motor is used for wire feeding. However, a significant problem with this system is the impossibility of feedback control because of inner or outer impedance. In this paper, a digital wire feeder was developed by using a DC encoder motor and a push-pull torch. An optimized wire-feeding system was also developed by experiment. The welding process was observed using a high-speed camera. The resulting wire-feeding system exhibits low spatter generation and arc stability.

  4. The use of a neodymium-iron-boron magnet device for positioning a multi-stranded wire retainer in lingual retention--a pilot study in humans.

    Science.gov (United States)

    Hahn, Wolfram; Fricke, Julia; Fricke-Zech, Susanne; Zapf, Antonia; Gruber, Rudolf; Sadat-Khonsari, Reza

    2008-10-01

    The aim of this study was to evaluate the time requirement of a newly developed device made of neodymium-iron-boron (NdFeB) magnets for positioning a multi-stranded, canine-to-canine retainer during bonding compared with dental floss and a transfer tray. Forty-five patients aged between 12 and 33 years (26 male, 19 female) previously treated with fixed appliances were enrolled in the study. The patients were randomly allocated to three groups (15 per group). For each group a mandibular canine-to-canine retainer of 0.018 inch Dentaflex multi-stranded wire (Dentaurum) was prefabricated for each patient on a cast. The bonding procedure was identical, except for the method of positioning the wire during adhesive fixation: group A dental floss, group B a small prefabricated transfer tray of dental resin and group C the NdFeB magnet device. For each group, the time required for the complete bonding process was measured. Kruskal-Wallis and Wilcoxon-Mann-Whitney tests were used for group and pairwise comparisons, respectively. The three methods required statistically significant different times (P NdFeB magnet device is a timesaving appliance for positioning a multi-stranded, canine-to-canine retainer during bonding when compared with dental floss and an individually prefabricated transfer tray.

  5. SpaceWire: IP, Components, Development Support and Test Equipment

    Science.gov (United States)

    Parkes, S.; McClements, C.; Mills, S.; Martin, I.

    SpaceWire is a communications network for use onboard spacecraft. It is designed to connect high data-rate sensors, large solid-state memories, processing units and the downlink telemetry subsystem providing an integrated data-handling network. SpaceWire links are serial, high-speed (2 Mbits/sec to 400 Mbits/sec), bi-directional, full-duplex, pointto- point data links which connect together SpaceWire equipment. Application information is sent along a SpaceWire link in discrete packets. Control and time information can also be sent along SpaceWire links. SpaceWire is defined in the ECSS-E50-12A standard [1]. With the adoption of SpaceWire on many space missions the ready availability of intellectual property (IP) cores, components, software drivers, development support, and test equipment becomes a major issue for those developing satellites and their electronic subsystems. This paper describes the work being done at the University of Dundee and STAR-Dundee Ltd with ESA, BNSC and internal funding to make these essential items available. STAR-Dundee is a spin-out company of the University of Dundee set up specifically to support users of SpaceWire.

  6. Composite interlayer for diffusion bonding

    International Nuclear Information System (INIS)

    1976-01-01

    A ductile interlayer is described, which is useful for transient liquid phase diffusion bonding of metallic articles; the interlayer consisting of a melting point depressant and a plurality of ductile lamellae which are free from carbides, aluminides and borides. The composition and fabrication of the lamellae, and the process for bonding the metallic articles, depend on the composition of the metals to be bonded, and are exemplified in the specification. (U.K.)

  7. Wire communication engineering

    International Nuclear Information System (INIS)

    Son, Byeong Tae

    1997-02-01

    This book describes wire telecommunication engineering/ It is divided into eleven chapter, which deal with Introduction with development of telecommunication, voice and sound wave and communication network, Telegraphy with summary of telegraphy, code of telegraphy, communication speed, morse and telex, Telephone on structure, circuit and image telephone, Traffic on telecommunication traffic, transmission of line about theory, cable line and loaded cable, carrier communication with carrier telegraphy and carrier telephone, optical communication with types, structure, specialty, laser and equipment, DATA, Mobile telecommunication on summary, mobile telephone, radio paging and digital mobile telecommunication, ISDN with channel of ISDN, and service of ISDN, and design of telecommunication.

  8. The Micro Wire Detector

    Energy Technology Data Exchange (ETDEWEB)

    Adeva, B.; Gomez, F.; Pazos, A.; Pfau, R.; Plo, M. E-mail: maximo.plo@cern.ch; Rodriguez, J.M.; Vazquez, P.; Labbe, J.C

    1999-10-11

    We present the performance of a new proportional gas detector. Its geometry consists of a cathode plane with 70x70 {mu}m{sup 2} apertures, crossed by 25 {mu}m anode strips to which it is attached by 50 {mu}m kapton spacers. In the region where the avalanche takes place, the anode strips are suspended in the gas mixture as in a standard wire chamber. This detector exhibits high rate capability and large gains, introducing very little material. (author)

  9. Wiring regulations in brief

    CERN Document Server

    Tricker, Ray

    2012-01-01

    Tired of trawling through the Wiring Regs?Perplexed by Part P?Confused by cables, conductors and circuits?Then look no further! This handy guide provides an on-the-job reference source for Electricians, Designers, Service Engineers, Inspectors, Builders, Students, DIY enthusiastsTopic-based chapters link areas of working practice - such as cables, installations, testing and inspection, special locations - with the specifics of the Regulations themselves. This allows quick and easy identification of the official requirements relating to the situati

  10. Stabilized superconductive wires

    International Nuclear Information System (INIS)

    Randall, R.N.; Wong, J.

    1976-01-01

    A stable, high field, high current conductor is produced by packing multiple, multi-layer rods of a bronze core and niobium or vanadium inner jacket and copper outer jacket into a pure copper tube or other means for forming a pure copper matrix, sealing, working the packed tube to a wire, and by diffusion, heat treating to form a type II superconducting, Beta-Wolfram structure, intermetallic compound as a layer within each of several filaments derived from the rods. The layer of Beta-Wolfram structure compound may be formed in less than 2 h of diffusion heat treatment in a thickness of 0.5--2μ

  11. Inventory Management in Delta Allied Wire Industries Limited Asaba ...

    African Journals Online (AJOL)

    A good inventory system reduces production cost and consequently increases profit. Optimum management of inventory in the Delta – Allied Wire Industries ... under review and customers' handling processes equally studied for improvement.

  12. Diagnostics for exploding wires (abstract)

    International Nuclear Information System (INIS)

    Moosman, B.; Bystritskii, V.; Wessel, F.J.; Van Drie, A.

    1999-01-01

    Two diagnostics, capable of imaging fast, high temperature, plasmas were used on exploding wire experiments at UC Irvine. An atmospheric pressure nitrogen laser (λ=337.1 nm) was used to generate simultaneous shadow and shearing interferogram images with a temporal resolution of ∼1 ns and a spatial resolution of 10 μm. An x-ray backlighter imaged the exploding wire 90 degree with respect to the laser and at approximately the same instant in time. The backlighter spatial resolution as determined by geometry and film resolution was 25 μm. Copper wires of diameters (25, 50, and 100 μm) and steel wire d=25 μm were exploded in vacuum (10 -5 Torr) at a maximum current level of 12 kA, by a rectified marx bank at a voltage of 50 kV and a current rise time (quarter period) of 900 ns. Copper wires which were cleaned and then resistively heated under vacuum to incandescence for several hours prior to high current initiation, exhibited greater expansion velocities at peak current than wires which had not been heated prior to discharge. Axial variations on the surface of the wire observed with the laser were found to correlate with bulk axial mass differences from x-ray backlighting. High electron density, measured near the opaque surface of the exploding wire, suggests that much of the current is shunted outward away from the bulk of the wire. copyright 1999 American Institute of Physics

  13. Diffusion bonding

    International Nuclear Information System (INIS)

    Anderson, R.C.

    1976-01-01

    A method is described for joining beryllium to beryllium by diffusion bonding. At least one surface portion of at least two beryllium pieces is coated with nickel. A coated surface portion is positioned in a contiguous relationship with another surface portion and subjected to an environment having an atmosphere at a pressure lower than ambient pressure. A force is applied on the beryllium pieces for causing the contiguous surface portions to abut against each other. The contiguous surface portions are heated to a maximum temperature less than the melting temperature of the beryllium, and the applied force is decreased while increasing the temperature after attaining a temperature substantially above room temperature. A portion of the applied force is maintained at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions

  14. The influnece of the partial single reduction on mechanical properties wires made from trip steel with 0,43 % C

    Directory of Open Access Journals (Sweden)

    S. Wiewiórowska

    2015-01-01

    Full Text Available Large strain inhomogeneity is caused by the shape of deformation zone of die and by the friction between tool and deformed wire for multistage wire drawing processes. The influence on the value of the redundant strain by the use of different partial single reductions during all wire drawing process was observed. This problem is particularly important for TRIP steel wires drawing processes because the strain intensity influences on the speed of retained austenite transformation into martensite.

  15. Research on the Effects of Process Parameters on Surface Roughness in Wet-Activated Silicon Direct Bonding Base on Orthogonal Experiments

    Directory of Open Access Journals (Sweden)

    Lei NIE

    2015-11-01

    Full Text Available Surface roughness is a very important index in silicon direct bonding and it is affected by processing parameters in the wet-activated process. These parameters include the concentration of activation solution, holding time and treatment temperature. The effects of these parameters were investigated by means of orthogonal experiments. In order to analyze the wafer roughness more accurately, the bear ratio of the surface was used as the evaluation index. From the results of the experiments, it could be concluded that the concentration of the activation solution affected the roughness directly and the higher the concentration, the lower the roughness. Holding time did not affect the roughness as acutely as that of the concentration, but a reduced activation time decreased the roughness perceptibly. It was also discovered that the treatment temperature had a weak correlation with the surface roughness. Based on these conclusions, the parameters of concentration, temperature and holding time were optimized respectively as NH4OH:H2O2=1:1 (without water, 70 °C and 5 min. The results of bonding experiments proved the validity of the conclusions of orthogonal experiments.DOI: http://dx.doi.org/10.5755/j01.ms.21.4.9711

  16. Vibration of signal wires in wire detectors under irradiation

    International Nuclear Information System (INIS)

    Bojko, I.R.; Shelkov, G.A.; Dodonov, V.I.; Ignatenko, M.A.; Nikolenko, M.Yu.

    1995-01-01

    Radiation-induced vibration of signal wires in wire detectors is found and explained. The phenomenon is based on repulsion of a signal wire with a positive potential and a cloud of positive ions that remains after neutralization of the electron part of the avalanche formed in the course of gas amplification. Vibration with a noticeable amplitude may arise from fluctuations of repulsive forces, which act on the wire and whose sources are numerous ion clusters. A formula is obtained which allows wire oscillations to be estimated for all types of wire detectors. Calculation shows that oscillations of signal wires can be substantial for the coordinate accuracy of a detector working in the limited streamer mode at fluxes over 10 5 particles per second per wire. In the proportional mode an average oscillation amplitude can be as large as 20-30 μm at some detector parameters and external radiation fluxes over 10 5 . The experimental investigations show that the proposed model well describes the main features of the phenomenon. 6 refs., 8 figs

  17. Corrosion of Wires on Wooden Wire-Bound Packaging Crates

    Science.gov (United States)

    Samuel L. Zelinka; Stan Lebow

    2015-01-01

    Wire-bound packaging crates are used by the US Army to transport materials. Because these crates may be exposed to harsh environments, they are dip-treated with a wood preservative (biocide treatment). For many years, zinc-naphthenate was the most commonly used preservative for these packaging crates and few corrosion problems with the wires were observed. Recently,...

  18. Bane of Hydrogen-Bond Formation on the Photoinduced Charge-Transfer Process in Donor–Acceptor Systems

    KAUST Repository

    Alsam, Amani Abdu; Adhikari, Aniruddha; Parida, Manas R.; Aly, Shawkat Mohammede; Bakr, Osman; Mohammed, Omar F.

    2017-01-01

    Controlling the ultrafast dynamical process of photoinduced charge transfer at donor acceptor interfaces remains a major challenge for physical chemistry and solar cell communities. The process is complicated by the involvement of other complex

  19. Improved superconducting magnet wire

    Science.gov (United States)

    Schuller, I.K.; Ketterson, J.B.

    1983-08-16

    This invention is directed to a superconducting tape or wire composed of alternating layers of copper and a niobium-containing superconductor such as niobium of NbTi, Nb/sub 3/Sn or Nb/sub 3/Ge. In general, each layer of the niobium-containing superconductor has a thickness in the range of about 0.05 to 1.5 times its coherence length (which for Nb/sub 3/Si is 41 A) with each copper layer having a thickness in the range of about 170 to 600 A. With the use of very thin layers of the niobium composition having a thickness within the desired range, the critical field (H/sub c/) may be increased by factors of 2 to 4. Also, the thin layers of the superconductor permit the resulting tape or wire to exhibit suitable ductility for winding on a magnet core. These compositions are also characterized by relatively high values of critical temperature and therefore will exhibit a combination of useful properties as superconductors.

  20. Diffusionless bonding of aluminum to Zircaloy-2

    International Nuclear Information System (INIS)

    Watson, R.D.

    1965-04-01

    Aluminum can be bonded to zirconium without difficulty even when a thin layer of oxide is present on the surface of the zirconium . No detectable diffusion takes place during the bonding process. The bond layer can be stretched as much. as 8% without affecting the bond. The bond can be heated for 1000 hours at 260 o C (500 o F), and can be water quenched from 260 o C (500 o F) without any noticeable change in the bond strength. An extrusion technique has been devised for making transition sections of aluminum bonded to zirconium which can then be used to join these metals by conventional welding. Welding can be done close to the bond zone without seriously affecting the integrity of the bond. This method of bonding aluminum to Zircaloy-2 is covered by Canadian patent 702,438 January 26, 1965. (author)

  1. Modelling of drawing and rolling of high carbon flat wires

    International Nuclear Information System (INIS)

    Bobadilla, C.; Persem, N.; Foissey, S.

    2007-01-01

    In order to meet customer requirements, it is necessary to develop new flat wires with a high tensile strength and a high width/thickness ratio. These products are manufactured from wire rod. The first step is to draw the wire until we have the required mechanical properties and required surface area of the section. After this, the wire is rolled from a round to a rectangular section. During the flat rolling process it can be reduced by more than 50%. Then the wire is exposed to a high level of stress during this process. Modelling allows us to predetermine this stress level, taking into account the final dimensions and the mechanical properties, thus optimising both rolling and drawing process. Forge2005 was used in order to simulate these processes. The aim of this study is to determine the value of residual stresses after drawing and so to optimise rolling. Indeed, the highest stress values are reached at this step of the process by changing the section of the wire from a round to a rectangular one. In order to evaluate the stress value accuracy for high strain levels, a behaviour law has been identified. This is a result of tensile tests carried out at each step of the drawing process. Finally, a multi-axial damage criterion was implemented using Forge2005. The optimisation of the rolling is directly linked to the minimisation of this criterion

  2. Development of Nb3Sn AC superconducting wire. Pt. 2

    International Nuclear Information System (INIS)

    Kasahara, Hobun; Torii, Shinji; Akita, Shirabe; Ueda, Kiyotaka; Kubota, Yoji; Yasohama, Kazuhiko; Kobayashi, Hisayasu; Ogasawara, Takeshi.

    1993-01-01

    For the realization of superconducting power apparatus, it is important that the development of highly stable superconducting cables. Nb 3 Sn wire has higher critical temperature than NbTi wire. Therefore, it is possible to make highly stable superconducting wires. In this report, we examine a manufacturing process of Ac Nb 3 Sn wire. This manufacturing process has four times higher critical current density than conventional processes. We have made a 400 kVA class AC coil with React and Wind method. The loss density of this coil was 20MW/m 3 at just before the quench. In this case, the temperature of cable increased about 3.8 K. This means that the Nb 3 Sn coil has a very high stability. (author)

  3. Recrystallization texture in nickel heavily deformed by accumulative roll bonding

    Science.gov (United States)

    Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

    2017-07-01

    The recrystallization behavior of Ni processed by accumulative roll bonding to a total accumulated von Mises strain of 4.8 has been examined, and analyzed with respect to heterogeneity in the deformation microstructure. The regions near the bonding interface are found to be more refined and contain particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different. These heterogeneities affect the progress of recrystallization. While the subsurface and near-interface regions typically contain lower frequencies of cube-oriented grains than anywhere else in the sample, a strong cube texture forms in the sample during recrystallization, attributed to both a high nucleation rate and fast growth rate of cube-oriented grains. The observations highlight the sensitivity of recrystallization to heterogeneity in the deformation microstructure and demonstrate the importance of characterizing this heterogeneity over several length scales.

  4. Hot fuel examination facility element spacer wire-wrap machine

    International Nuclear Information System (INIS)

    Tobias, D.A.; Sherman, E.K.

    1989-01-01

    Nondestructive examinations of irradiated experimental fuel elements conducted in the Argonne National Laboratory Hot Fuel Examination Facility/North (HFEF/N) at the Idaho National Engineering Laboratory include laser and contact profilometry (element diameter measurements), electrical eddy-current testing for cladding and thermal bond defects, bow and length measurements, neutron radiography, gamma scanning, remote visual exam, and photography. Profilometry was previously restricted to spiral profilometry of the element to prevent interference with the element spacer wire wrapped in a helix about the Experimental Breeder Reactor II (EBR-II)-type fuel element from end to end. By removing the spacer wire prior to conducting profilometry examination, axial profilometry techniques may be used, which are considerably faster than spiral techniques and often result in data acquisition more important to experiment sponsors. Because the element must often be reinserted into the nuclear reactor (EBR-II) for additional irradiation, however, the spacer wire must be reinstalled on the highly irradiated fuel element by remote means after profilometry of the wireless elements. The element spacer wire-wrap machine developed at HFEF is capable of helically wrapping fuel elements with diameters up to 1.68 cm (0.660 in.) and 2.44-m (96-in.) lengths. The machine can accommodate almost any desired wire pitch length by simply inserting a new wrapper gear module

  5. Tunable smart digital structure (SDS) to modularly assemble soft actuators with layered adhesive bonding

    Science.gov (United States)

    Jin, Hu; Dong, Erbao; Xu, Min; Xia, Qirong; Liu, Shuai; Li, Weihua; Yang, Jie

    2018-01-01

    Many shape memory alloy (SMA)-based soft actuators have specific composite structures and manufacture processes, and are therefore unique. However, these exclusive characteristics limit their capabilities and applications, so in this article a soft and smart digital structure (SDS) is proposed that acts like a modular unit to assemble soft actuators by a layered adhesive bonding process. The SDS is a fully soft structure that encapsulates a digital skeleton consisting of four groups of parallel and independently actuated SMA wires capable of outputting a four-channel tunable force. The layered adhesive bonding process modularly bonds several SDSs with an elastic backbone to fabricate a layered soft actuator where the elastic backbone is used to recover the SDSs in a cooling process using the SMA wires. Two kinds of SDS-based soft actuators were modularly assembled, an actuator, SDS-I, with a two-dimensional reciprocal motion, and an actuator, SDS-II, capable of bi-directional reciprocal motion. The thermodynamics and phase transformation modeling of the SDS-based actuator were analyzed. Several extensional soft actuators were also assembled by bonding the SDS with an anomalous elastic backbone or modularly assembling the SDS-Is and SDS-IIs. These modularly assembled soft actuators delivered more output channels and a complicated motion, e.g., an actinomorphic soft actuator with four SDS-Is jumps in a series of hierarchical heights and directional movement by tuning the input channels of the SDSs. This result showed that the SDS can modularly assemble multifarious soft actuators with diverse capabilities, steerability and tunable outputs.

  6. Romanian government bond market

    Directory of Open Access Journals (Sweden)

    Cornelia POP

    2012-12-01

    Full Text Available The present paper aims to present the level of development reached by Romanian government bond market segment, as part of the country financial market. The analysis will be descriptive (the data series available for Romania are short, based on the secondary data offered by the official bodies involved in the process of issuing and trading the Romanian government bonds (Romanian Ministry of Public Finance, Romanian National Bank and Bucharest Stock Exchange, and also on secondary data provided by the Federation of European Stock Exchanges.To enhance the market credibility as a benchmark, a various combination of measures is necessary; among these measures are mentioned: the extension of the yield curve; the issuance calendars in order to improve transparency; increasing the disclosure of information on public debt issuance and statistics; holding regular meetings with dealers, institutional investors and rating agencies; introducing a system of primary dealers; establishing a repurchase (repo market in the government bond market. These measures will be discussed based on the evolution presented inside the paper.The paper conclude with the fact that, until now, the Romanian government bond market did not provide a benchmark for the domestic financial market and that further efforts are needed in order to increase the government bond market transparency and liquidity.

  7. Interstellar hydrogen bonding

    Science.gov (United States)

    Etim, Emmanuel E.; Gorai, Prasanta; Das, Ankan; Chakrabarti, Sandip K.; Arunan, Elangannan

    2018-06-01

    This paper reports the first extensive study of the existence and effects of interstellar hydrogen bonding. The reactions that occur on the surface of the interstellar dust grains are the dominant processes by which interstellar molecules are formed. Water molecules constitute about 70% of the interstellar ice. These water molecules serve as the platform for hydrogen bonding. High level quantum chemical simulations for the hydrogen bond interaction between 20 interstellar molecules (known and possible) and water are carried out using different ab-intio methods. It is evident that if the formation of these species is mainly governed by the ice phase reactions, there is a direct correlation between the binding energies of these complexes and the gas phase abundances of these interstellar molecules. Interstellar hydrogen bonding may cause lower gas abundance of the complex organic molecules (COMs) at the low temperature. From these results, ketenes whose less stable isomers that are more strongly bonded to the surface of the interstellar dust grains have been observed are proposed as suitable candidates for astronomical observations.

  8. The role of oxide structure on copper wire to the rubber adhesion

    Science.gov (United States)

    Su, Yea-Yang; Shemenski, Robert M.

    2000-07-01

    Most metals have an oxide layer on the surface. However, the structure of the oxide varies with the matrix composition, and depends upon the environmental conditions. A bronze coating, nominal composition of 98.5% Cu and balance of Sn, is applied to steel wire for reinforcing pneumatic tire beads and to provide adhesion to rubber. This work studied the influence of copper oxides on the bronze coating on adhesion during vulcanization. To emphasize the oxide structures, electrolytic tough pitch (ETP) copper wire was used instead of the traditional bronze-coated tire bead wire. Experimental results confirmed the hypothesis that cuprous oxide (Cu 2O) could significantly improve bonding between copper wire and rubber, and demonstrated that the interaction between rubber and oxide layer on wire is an electrochemical reaction.

  9. X-ray backlighting of two-wire Z-pinch plasma using X-pinch

    International Nuclear Information System (INIS)

    Tong, Zhao; Xiao-Bing, Zou; Ran, Zhang; Xin-Xin, Wang

    2010-01-01

    Two 50-μm Mo wires in parallel used as a Z-pinch load are electrically exploded with a pulsed current rising to 275 kA in 125 ns and their explosion processes are backlighted using an X-pinch as an x-ray source. The backlighting images show clearly the processes similar to those occurring in the initial stages of a cylindrical wire-array Z-pinch, including the electric explosion of single wires characterised by the dense wire cores surrounded by a low-density coronal plasma, the expansion of the exploding wire, the sausage instability (m = 0) in the coronal plasma around each wire, the motion of the coronal plasma as well as the wire core toward the current centroid, the formation of the precursor plasma column with a twist structure something like that of higher mode instability, especially the kink instability (m = 1). (fluids, plasmas and electric discharges)

  10. Formation of plasma around wire fragments created by electrically exploded copper wire

    International Nuclear Information System (INIS)

    Taylor, Michael J.

    2002-01-01

    The physical processes occurring during the electrical explosion of metallic conductors has attracted interest for many years. Applications include circuit breakers, segmented lightning divertor strips for aircraft radomes, disruption of metallic shaped charge jets, plasma armatures for electromagnetic railguns and plasma generators for electrothermal-chemical guns. Recent work has cited the phenomenology of the fragmentation processes, particularly the development of a plasma around the lower resistance condensed fragments. An understanding of both the fragmentation process and the development of the accompanying formation of plasma is essential for the optimization of devices that utilize either of these phenomena. With the use of x-radiography and fast photography, this paper explores the wire explosion process, in particular the relationship between the fragmentation, plasma development and resistance rise that occurs during this period. A hypothesis is put forward to account for the development of plasma around the condensed wire fragments. Experimental parameters used in this study are defined. Wires studied were typically copper, with a diameter of 1 mm and length in excess of 150 mm. Circuit inductance used were from 26 to 800 μH. This relatively high circuit inductance gave circuit rise times less than 180 MA s -1 , slow with respect to many other exploding wire studies. Discharge duration ranged from 0.8 to 10 ms. (author)

  11. Recent developments in wire chamber tracking at SSC

    International Nuclear Information System (INIS)

    Ogren, H.

    1990-01-01

    All of the major SSC proposed detectors use wire chambers in their tracking systems. The feasibility of wire chambers in an SSC detector has now been established by a number of groups planning detectors at SSC. The major advances during the past year in understanding straw tube drift chambers are presented and several innovations in gaseous wire chambers are discussed. The R and D section will concentrate on progress in drift cell design, electronics and signal processing, and engineering aspects of the tracking designs

  12. Control wiring diagrams

    International Nuclear Information System (INIS)

    McCauley, T.M.; Eskinazi, M.; Henson, L.L.

    1989-01-01

    This paper discusses the changes in electrical document requirements that occur when construction is complete and a generating station starts commercial operation. The needs of operations and maintenance (O and M) personnel are analyzed and contrasted with those of construction to illustrate areas in which the construction documents (drawings, diagrams, and databases) are difficult to use for work at an operating station. The paper discusses the O and M electrical documents that the Arizona Nuclear Power Project (ANPP) believes are most beneficial for the three operating units at Palo Verde; these are control wiring diagrams and an associated document cross-reference list. The benefits offered by these new, station O and M-oriented documents are weighted against the cost of their creation and their impact on drawing maintenance

  13. Electroplated superconducting wire

    International Nuclear Information System (INIS)

    Peger, C.H.

    1991-01-01

    A hard chromium solution has been considered the least efficient of all plating solutions. This is not exactly true if the correct plating conditions are used. The accepted efficiency is only 12% but that is only true for the parameters that were used long ago to make the determination. At 12% efficiency it would be impossible to plate Superconductor wire. The world's chromium plating shops have been plating at a .001 (.025u) per hour rate since the turn of the century. Shops in the Cleveland, Ohio area have been limiting their plating rate to .006 (152u) since 1935. A few have used .012 (304u) to .030 (762u) per hour for specialized jobs. These figures would indicate the apparent efficiency of the old 100 to 1 chromium, sulfate solution can be higher than 60%. The industry uses a 3 bus bar tank with wide spacing between anode and cathode. This results in high solution resistance and high heat generation and consequently slow plating rates. The Reversible Rack 2 Bus Bar System uses very close anode to cathode spacings. This results in the high plating rates with improved quality deposits. When first asked to chromium plate pure nickel wire reel to reel in long lengths, companies making reel to reel machines were asked if chromium plating was practical. In every case, the answer was it couldn't be done. Gold, tin and zinc plating was being done reel to reel. Using the same parameters that were used to determine a chromium solution efficiency was only 12%, these other metal solutions check out close to 100%

  14. Research on Lessening of Bonding Effects Between the Metallic and Non-Metallic Surfaces Through the Graphite Films Deposited with Pulsed Electrical Discharges Process

    Science.gov (United States)

    Marin, L.; Topala, P.

    2017-06-01

    The paper presents the results of experimental research on the physics of natural graphite film formation, the establishment of chemical composition and functional properties of the graphite films, formed on metal surfaces, as a result of the action of plasma in the air environment, at a normal pressure, under the electrical discharge in impulse conditions (EDI). The researchings were performed in the frame of doctoral thesis “Research on lessening of the bonding effects between the metallic and nonmetallic surfaces through the graphite films” and aimed to identify the phenomena that occur at the interface metal/ film of graphite, and to identify also the technological applications that it may have the surface treatment for submitting the films of graphite on metallic surfaces achieved through an innovative process of electrical pulsed discharges. After the research works from the PhD theme above mentioned, a number of interesting properties of graphite pellicle have been identified ie reducing of metal surface polarity. This led to drastic decreases for the values of adhesion when bonding of metal surfaces was performed using a structural polyurethane adhesive designed by ICECHIM. Following the thermo-gravimetric analysis, performed of the graphite film obtained by process of electrical pulsed discharges, have been also discovered other interesting properties for this, ie reversible mass additions at specific values of the working temperature Chemical and scanning electron microscopy analysis have revealed that on the metallic surface subjected to electrical pulsed discharges process, outside the graphite film, it is also obtained a series of spatial formation composed of carbon atoms fullerenes type which are responsible for the phenomenon of addition of mass.

  15. Mechanical and Microstructure Study of Nickel-Based ODS Alloys Processed by Mechano-Chemical Bonding and Ball Milling

    Science.gov (United States)

    Amare, Belachew N.

    Due to the need to increase the efficiency of modern power plants, land-based gas turbines are designed to operate at high temperature creating harsh environments for structural materials. The elevated turbine inlet temperature directly affects the materials at the hottest sections, which includes combustion chamber, blades, and vanes. Therefore, the hottest sections should satisfy a number of material requirements such as high creep strength, ductility at low temperature, high temperature oxidation and corrosion resistance. Such requirements are nowadays satisfied by implementing superalloys coated by high temperature thermal barrier coating (TBC) systems to protect from high operating temperature required to obtain an increased efficiency. Oxide dispersive strengthened (ODS) alloys are being considered due to their high temperature creep strength, good oxidation and corrosion resistance for high temperature applications in advanced power plants. These alloys operating at high temperature are subjected to different loading systems such as thermal, mechanical, and thermo-mechanical combined loads at operation. Thus, it is critical to study the high temperature mechanical and microstructure properties of such alloys for their structural integrity. The primary objective of this research work is to investigate the mechanical and microstructure properties of nickel-based ODS alloys produced by combined mechano-chemical bonding (MCB) and ball milling subjected to high temperature oxidation, which are expected to be applied for high temperature turbine coating with micro-channel cooling system. Stiffness response and microstructure evaluation of such alloy systems was studied along with their oxidation mechanism and structural integrity through thermal cyclic exposure. Another objective is to analyze the heat transfer of ODS alloy coatings with micro-channel cooling system using finite element analysis (FEA) to determine their feasibility as a stand-alone structural

  16. Confining jackets for concrete cylinders using NiTiNb and NiTi shape memory alloy wires

    Energy Technology Data Exchange (ETDEWEB)

    Choi, Eunsoo; Yoon, Soon-Jong [Department of Civil Engineering, Hongik University, Seoul 121-791 (Korea, Republic of); Nam, Tae-Hyun [School of Materials Science and Engineering and ERI, Gyeongsang National University, Jinju, Gyeongnam 600-701 (Korea, Republic of); Cho, Sun-Kyu [School of Civil Engineering, Seoul National University of Technology, Seoul 139-743 (Korea, Republic of); Park, Joonam, E-mail: eunsoochoi@hongik.ac.k [Department of Railroad Structure Research, Korea Railroad Research Institute, Uiwang 437-050, Korea (Korea, Republic of)

    2010-05-01

    This study used prestrained NiTiNb and NiTi shape memory alloy (SMA) wires to confine concrete cylinders. The recovery stress of the wires was measured with respect to the maximal prestrain of the wires. SMA wires were preelongated during the manufacturing process and then wrapped around concrete cylinders of 150 mmx300 mm ({phi}xL). Unconfined concrete cylinders were tested for compressive strength and the results were compared to those of cylinders confined by SMA wires. NiTiNb SMA wires increased the compressive strength and ductility of the cylinders due to the confining effect. NiTiNb wires were found to be more effective in increasing the peak strength of the cylinders and dissipating energy than NiTi wires. This study showed the potential of the proposed method to retrofit reinforced concrete columns using SMA wires to protect them from earthquakes.

  17. Nano-powder production by electrical explosion of wires

    International Nuclear Information System (INIS)

    Mao Zhiguo; Zou Xiaobing; Wang Xinxin; Jiang Weihua

    2010-01-01

    A device for nano-powder production by electrical explosion of wires was designed and built. Eight wires housed in the discharge chamber are exploded one by one before opening the chamber for the collection of the produced nano-powder. To increase the rate of energy deposition into a wire, the electrical behavior of the discharge circuit including the exploding wire was simulated. The results showed that both reducing the circuit inductance and reducing the capacitance of the energy-storage capacitor (keeping the storage energy constant) can increase the energy deposition rate. To better understand the physical processes of the nano-powder formation by the wire vapor, a Mach-Zehnder interferometer was used to record the time evolution of the wire vapor as well as the plasma. A thermal expansion lag of the dense vapor core as well as more than one times of the vapor burst was observed for the first time. Finally, nano-powders of titanium nitride, titanium dioxide, copper oxides and zinc oxide were produced by electrical explosion of wires. (authors)

  18. Composite ceramic superconducting wires for electric motor applications

    Science.gov (United States)

    Halloran, John W.

    1990-07-01

    Several types of HTSC wire have been produced and two types of HTSC motors are being built. Hundreds of meters of Ag- clad wire were fabricated from YBa2Cu3O(7-x) (Y-123) and Bi2Ca2Sr2Cu3O10 (BiSCCO). The dc homopolar motor coils are not yet completed, but multiple turns of wire have been wound on the coil bobbins to characterize the superconducting properties of coiled wire. Multifilamentary conductors were fabricated as cables and coils. The sintered polycrystalline wire has self-field critical current densities (Jc) as high as 2800 A/sq cm, but the Jc falls rapidly with magnetic field. To improve Jc, sintered YBCO wire is melt textured with a continuous process which has produced textures wire up to 0.5 meters long with 77K transport Jc above 11, 770 A/sq cm2 in self field and 2100 A/sq cm2 at 1 telsa. The Emerson Electric dc homopolar HTSC motor has been fabricated and run with conventional copper coils. A novel class of potential very powerful superconducting motors have been designed to use trapped flux in melt textures Y-123 as magnet replicas in an new type of permanent magnet motor. The stator element and part of the rotor of the first prototype machine exist, and the HTSC magnet replica segments are being fabricated.

  19. Microstructure Evolution and Mechanical Properties of Al-TiB2/TiC In Situ Aluminum-Based Composites during Accumulative Roll Bonding (ARB Process

    Directory of Open Access Journals (Sweden)

    Jinfeng Nie

    2017-01-01

    Full Text Available In this study, a kind of Al-TiB2/TiC in situ composite was successfully prepared using the melt reaction method and the accumulative roll-bonding (ARB technique. The microstructure evolution of the composites with different deformation treatments was characterized using field emission scanning electron microscopy (FESEM and a transmission electron microscope (TEM. The mechanical properties of the Al-TiB2/TiC in situ composite were also studied with tensile and microhardness tests. It was found that the distribution of reinforcement particles becomes more homogenous with an increasing ARB cycle. Meanwhile, the mechanical properties showed great improvement during the ARB process. The ultimate tensile strength (UTS and microhardness of the composites were increased to 173.1 MPa and 63.3 Hv after two ARB cycles, respectively. Furthermore, the strengthening mechanism of the composite was analyzed based on its fracture morphologies.

  20. Hot wire TIG temper bead welding for nuclear repairs

    International Nuclear Information System (INIS)

    Lambert, J.A.; Gilston, P.F.

    1989-08-01

    A preliminary assessment has been carried out to determine the suitability of the hot wire tungsten inert gas (TIG) welding process for the repair of thick section, ferritic steel nuclear pressure vessels. The objective has been to identify a hot wire TIG temper bead procedure, suitable for repairs without post weld heat treatment. This procedure involves depositing two weld layers with carefully selected welding parameters such that overlapping thermal cycles produce a refined and tempered heat affected zone, HAZ, microstructure. (author)

  1. Locating the displacement of the steel wire implantation with the stereotactic mammography

    International Nuclear Information System (INIS)

    Ma Jie; Xu Jianmin; Sun Guomin; Sun Guoping; Zang Da; Zhou Dongxian; Mai Peicheng

    2007-01-01

    Objective: To analyze the manifestation, reason, the processing method of the steel wire implantation with the stereotactic mammography to improve the accuracy of the preoperative positioning. Methods: Seventy-nine cases which got the stereotactic steel wire implantation. In 96 lesions, 13 had steel wire displacement. Among them, 5 cases got steel wire displacement during the stereotactic process, 5 cases got steel wire displacement after the stereotactic process, 2 cases got steel wire displacement during the operation, one case did not show the calcification on the postoperative radiography. Results: The steel wire displacement occurred in 5 cases during the stereotactic process came from the patients and doctors respectively and the repositioning was needed. The steel wire displacement after the stereoscopic positioning was attributed to the overdose injection of local anesthesia, which led to the mismatch between the depth of Z axis of the mammary gland and the actual depth the computer given, the incorrect method for needle placement, and, neglecting whether the steel wire have got the lesion anchored when pulling out the needle set of steel wire hood, besides, these three kinds of instances above were all exaggerated by the accordion effect. For the displacement within 2 cm, the lesion can be excised toward the pathological change direction according to the position that steel wire prompted and re-place the second steel wire, putting the J-shaped steel wire into the needle hood and taking it out of the body. After repositioning, 2 cases had the steel wire prolapse during operation, which resulted from the over-lifting of the steel wire. After placing the steel wire, the radiologist should give an accurate description on the depth and direction to the surgeon and the notch should be taken for incision from the steel wire head end which is proximate to skin. The postoperative specimen from one case had no calcification, which might be related to the condition

  2. Heat resistant wire and cable and heat shrinkable tubes

    Energy Technology Data Exchange (ETDEWEB)

    Ueno, Keiji [Sumitomo Electric Industries Ltd. (Japan)

    1994-12-31

    Radiation processes have been used in industrial fields (e.g. wire and cable, heat shrinkable tubes) for about 30 years. In Japan, 60 electron beam accelerators were used in R and D, 54 in wire and cable, 24 in tire rubber, 16 in paint curing, 14 in PE foam and 9 accelerators were used in heat shrinkable tubes in 1993. Many properties (e.g. solder resistance, thermal deformation, and solven resistance) of wire and cable are improved by using radiation processes, and many kinds of radiation crosslinked wire and cable are used in the consumer market (TV sets, VTR`s, audio disc players, etc.), automobiles (automobile wire harnesses, fusible link wires, sensor cables etc.), and the industrial market (computer cables, cables for keyboards, coaxial cables, etc.). Another important industrial application of E{beta} radiation process is heat shrinkable tubes. Heat shinkable tubes, heated by a hot gun, shrink 1/2 {approx} 1/3 of their inner diameters. Heat shrinkable tubes are used for covers of distributing line terminals, joint covers of telecommunication lines, protection of fuel pipe lines and so on. In this seminar, actual applications and characteristic properties of radiation crosslinked materials are presented.

  3. Heat resistant wire and cable and heat shrinkable tubes

    International Nuclear Information System (INIS)

    Keiji Ueno

    1994-01-01

    Radiation processes have been used in industrial fields (e.g. wire and cable, heat shrinkable tubes) for about 30 years. In Japan, 60 electron beam accelerators were used in R and D, 54 in wire and cable, 24 in tire rubber, 16 in paint curing, 14 in PE foam and 9 accelerators were used in heat shrinkable tubes in 1993. Many properties (e.g. solder resistance, thermal deformation, and solven resistance) of wire and cable are improved by using radiation processes, and many kinds of radiation crosslinked wire and cable are used in the consumer market (TV sets, VTR's, audio disc players, etc.), automobiles (automobile wire harnesses, fusible link wires, sensor cables etc.), and the industrial market (computer cables, cables for keyboards, coaxial cables, etc.). Another important industrial application of Eβ radiation process is heat shrinkable tubes. Heat shinkable tubes, heated by a hot gun, shrink 1/2 ∼ 1/3 of their inner diameters. Heat shrinkable tubes are used for covers of distributing line terminals, joint covers of telecommunication lines, protection of fuel pipe lines and so on. In this seminar, actual applications and characteristic properties of radiation crosslinked materials are presented

  4. Modeling Evolution of Hydrogen Bonding and Stabilization of Transition States in the Process of Cocaine Hydrolysis Catalyzed by Human Butyrylcholinesterase

    OpenAIRE

    Gao, Daquan; Zhan, Chang-Guo

    2006-01-01

    Molecular dynamics (MD) simulations and quantum mechanical/molecular mechanical (QM/MM) calculations were performed on the prereactive enzyme-substrate complex, transition states, intermediates, and product involved in the process of human butyrylcholinesterase (BChE)-catalyzed hydrolysis of (−)-cocaine. The computational results consistently reveal a unique role of the oxyanion hole (consisting of G116, G117, and A199) in BChE-catalyzed hydrolysis of cocaine, as compared to acetylcholinester...

  5. SIMULACIÓN EXPERIMENTAL Y NUMÉRICA DE UN PROCESO DE TREFILADO HÚMEDO DE UN ALAMBRE DE ACERO AL CARBONO EXPERIMENTAL AND NUMERICAL SIMULATION OF THE DAMP WIRE DRAWING PROCESS OF A CARBON STEEL

    Directory of Open Access Journals (Sweden)

    Ennio L Rojas

    2008-06-01

    Full Text Available En este trabajo se presenta un análisis experimental y numérico para la descripción del comportamiento mecánico de un alambre de acero al carbono durante un proceso industrial de trefilado húmedo. En primer lugar, se hizo una campaña experimental de mediciones de fuerza de trefilado de las doce reducciones presentes en el proceso. En segundo lugar, se llevaron a cabo ensayos de tracción con objeto de caracterizar el comportamiento mecánico del material en cada etapa de reducción. En estos ensayos se obtuvieron curvas de tensión-deformación que, en conjunto a las respuestas calculadas a partir de la simulación de los ensayos, permitieron derivar la evolución de los parámetros elásticos y plásticos característicos del material a medida que se reduce su diámetro. De dicha evolución se constató el gran endurecimiento que experimenta el material durante el proceso el que, a su vez, condiciona fuertemente su trefilabilidad. Las simulaciones se realizaron por medio de un modelo elastoplástico de grandes deformaciones implementado en un programa de cálculo preexistente, basado en el método de elementos finitos, denominado VULCAN. Luego, los parámetros del material obtenidos en los ensayos de tracción fueron considerados en la simulación del proceso de deformación que ocurre durante el paso del alambre a través de los dados. Los resultados de la simulación se consideran aceptables y representativos del comportamiento del alambre en el proceso.This paper presents an experimental and numerical analysis for the description of the mechanical behaviour of a carbon steel wire during an industrial process of damp drawing. Firstly, an experimental procedure aimed at measuring wire drawing forces in the twelve reductions present in the process was performed. Secondly, tensile tests were carried out in order to characterize the mechanical behavior of the material for each reduction step. The resulting stress-strain curves together with

  6. Mechanical and metallurgical changes on 308L wires drawn by electropulses

    OpenAIRE

    Sánchez Egea, Antonio José; González Rojas, Hernan Alberto; Celentano, Diego Javier; Jorba Peiró, Jordi

    2015-01-01

    The electroplastic effects resulting from different electropulses configurations on a wire drawing process are investigated experimentally and numerically. Electropulses are induced into 308L stainless steel while it is simultaneously wire drawn. A current density of 185 A/mm2, a frequency range from 140 to 355 Hz and a pulse duration range from 100 to 250 µs are combined to electrically assist the wire drawing process. The electropulsing influence is studied in several mechanical parameters,...

  7. Manufacturing study of beryllium bonded structures

    International Nuclear Information System (INIS)

    Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

    2004-01-01

    Manufacturing study has been conducted on Be-bonded structures employed in the first-wall panel of the blanket system for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating process has been used to bond the three materials. First, Cu-alloy and SS materials are bonded diffusively. Then, Be tiles are bonded to the pre-bonded structure under 20 MPa and at 560 degree C. An Al-Si base interlayer has been used to bond Be to the Cu-Alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. Using the above bonding techniques, a partial mockup of a blanket first-wall panel with 16 Be tiles (with 50 mm in size) has been successfully manufactured. (author)

  8. Effects of a diamond-like carbon coating on the frictional properties of orthodontic wires.

    Science.gov (United States)

    Muguruma, Takeshi; Iijima, Masahiro; Brantley, William A; Mizoguchi, Itaru

    2011-01-01

    To test the hypothesis that a diamond-like carbon coating does not affect the frictional properties of orthodontic wires. Two types of wires (nickel-titanium and stainless steel) were used, and diamond-like carbon (DLC) films were deposited on the wires. Three types of brackets, a conventional stainless steel bracket and two self-ligating brackets, were used for measuring static friction. DLC layers were observed by three-dimensional scanning electron microscopy (3D-SEM), and the surface roughness was measured. Hardness and elastic modulus were obtained by nanoindentation testing. Frictional forces and surface roughness were compared by the Kruskal-Wallis and Mann-Whitney U-tests. The hardness and elastic modulus of the wires were compared using Student's t-test. When angulation was increased, the DLC-coated wires showed significantly less frictional force than the as-received wires, except for some wire/bracket combinations. Thin DLC layers were observed on the wire surfaces by SEM. As-received and DLC-coated wires had similar surface morphologies, and the DLC-coating process did not affect the surface roughness. The hardness of the surface layer of the DLC-coated wires was much higher than for the as-received wires. The elastic modulus of the surface layer of the DLC-coated stainless steel wire was less than that of the as-received stainless steel wire, whereas similar values were found for the nickel-titanium wires. The hypothesis is rejected. A DLC-coating process does reduce the frictional force.

  9. Non-destructive testing of assemblies by welding, brazing or bonding, and material to use for this process

    International Nuclear Information System (INIS)

    Benoit, J.

    1983-01-01

    The process consists in doing a neutron photography of the pieces assembled with the aid of a joining material containing a neutrophage element, such as gadolinium, samarium, europium, boron, cadmium. The neutrophage element, e.g. gadolinium, is dispersed in the joining material with contents between 0,5 and 7,5% of weight. Its granulometry must be less than 1000 MESH. The incorporation of a neutrophage element in the joining material of metallic pieces by welding or brazing, allows to visualize, among others, the following defects: blistering, cracks, slag inclusions, undercuts, bad distribution of the successive passes [fr

  10. Flooded homes, broken bonds, the meaning of home, psychological processes and their impact on psychological health in a disaster.

    Science.gov (United States)

    Carroll, Bob; Morbey, Hazel; Balogh, Ruth; Araoz, Gonzalo

    2009-06-01

    In 2005, Carlisle suffered severe flooding and 1600 houses were affected. A qualitative research project to study the social and health impacts was undertaken. People whose homes had been flooded and workers who had supported them were interviewed. The findings showed that there was severe disruption to people's lives and severe damage to their homes, and many suffered from psychological health issues. Phenomenological and transactional perspectives are utilised to analyse the psychological processes (identity, attachment, alienation and dialectics) underlying the meaning of home and their impact on psychological health. Proposals for policy and practice are made.

  11. Molecular dynamics modeling of bonding two materials by atomic scale friction stir welding at different process parameters

    Science.gov (United States)

    Konovalenko S., Iv.; Psakhie, S. G.

    2017-12-01

    Using the molecular dynamics method, we simulated the atomic scale butt friction stir welding on two crystallites and varied the onset FSW tool plunge depth. The effects of the plunge depth value on the thermomechanical evolution of nanosized crystallites and mass transfer in the course of FSW have been studied. The increase of plunge depth values resulted in more intense heating and reducing the plasticized metal resistance to the tool movement. The mass transfer intensity was hardly dependent on the plunge depth value. The plunge depth was recommended to be used as a FSW process control parameter in addition to the commonly used ones.

  12. Synergistic effect of displacement damage, helium and hydrogen on microstructural change of SiC/SiC composites fabricated by reaction bonding process

    Energy Technology Data Exchange (ETDEWEB)

    Taguchi, T.; Igawa, N.; Wakai, E.; Jitsukawa, S. [Japan Atomic Energy Agency, Naga-gun, Ibaraki-ken (Japan); Hasegawa, A. [Tohoku Univ., Dept. of Quantum Science and Energy Engr., Sendai (Japan)

    2007-07-01

    Full text of publication follows: Continuous silicon carbide (SiC) fiber reinforced SiC matrix (SiC/SiC) composites are known to be attractive candidate materials for first wall and blanket components in fusion reactors. In the fusion environment, helium and hydrogen are produced and helium bubbles can be formed in the SiC by irradiation of 14-MeV neutrons. Authors reported the synergistic effect of helium and hydrogen as transmutation products on swelling behavior and microstructural change of the SiC/SiC composites fabricated by chemical vapor infiltration (CVI) process. Authors also reported about the fabrication of high thermal conductive SiC/SiC composites by reaction bonding (RB) process. The matrix fabricated by RB process has different microstructures such as bigger grain size of SiC and including Si phase as second phase from that by CVI process. It is, therefore, investigated the synergistic effect of displacement damage, helium and hydrogen as transmutation products on the microstructure of SiC/SiC composite by RB process in this study. The SiC/SiC composites by RB process were irradiated by the simultaneous triple ion irradiation (Si{sup 2+}, He{sup +} and H{sup +}) at 800 and 1000 deg. C. The displacement damage was induced by 6.0 MeV Si{sup 2+} ion irradiation up to 10 dpa. The microstructures of irradiated SiC/SiC composites by RB process were observed by TEM. The double layer of carbon and SiC as interphase between fiber and matrix by a chemical vapor deposition (CVD) was coated on SiC fibers in the SiC/SiC composites by RB process. The TEM observation revealed that He bubbles were formed both in the matrix by RB and SiC interphase by CVD process. Almost all He bubbles were formed at the grain boundary in SiC interphase by CVD process. On the other hand, He bubbles were formed both at the grain boundary and in Si grain of the matrix by RB process. The average size of He bubbles in the matrix by RB was smaller than that in SiC interphase by CVD

  13. Variables process effect in the pure ferritic metal contribution deposited with an tubular metal-cored E111T5-K3 wire

    International Nuclear Information System (INIS)

    Svoboda, Hernan G; Ramini de Rissone, N.M; Surian, E; De Vedia, L

    2004-01-01

    The welding deposit performed with an ANSI-AWS E111T5-K3 type from the system C-Mn-Ni-Mo metal coring tubular welding, with a low slag generation was studied. Different operatives configurations with two thermal contribution levels (1 kJ and 1.5 kJ) and two types of protector gases (CO 2 and Ar-20%CO 2 ) at two welding position (under hand and ascendant vertical) were analyzed. The resulting pure contributor metal from the different process configurations was chemical, mechanically and structural characterized and the effect of the different process conditions was evaluated. The microstructure is fundamentally composed by FS(NA) and AF. For similar values of hardness and strength, good values of tenacity were observed and they show little variation with the process variables studied (AG)

  14. Processive pectin methylesterases: the role of electrostatic potential, breathing motions and bond cleavage in the rectification of Brownian motions.

    Directory of Open Access Journals (Sweden)

    Davide Mercadante

    Full Text Available Pectin methylesterases (PMEs hydrolyze the methylester groups that are found on the homogalacturonan (HG chains of pectic polysaccharides in the plant cell wall. Plant and bacterial PMEs are especially interesting as the resulting de-methylesterified (carboxylated sugar residues are found to be arranged contiguously, indicating a so-called processive nature of these enzymes. Here we report the results of continuum electrostatics calculations performed along the molecular dynamics trajectory of a PME-HG-decasaccharide complex. In particular it was observed that, when the methylester groups of the decasaccharide were arranged in order to mimic the just-formed carboxylate product of de-methylesterification, a net unidirectional sliding of the model decasaccharide was subsequently observed along the enzyme's binding groove. The changes that occurred in the electrostatic binding energy and protein dynamics during this translocation provide insights into the mechanism by which the enzyme rectifies Brownian motions to achieve processivity. The free energy that drives these molecular motors is thus demonstrated to be incorporated endogenously in the methylesterified groups of the HG chains and is not supplied exogenously.

  15. Submerged-arc wire electrodes with nickel-plated surfaces

    International Nuclear Information System (INIS)

    Hagen, H. vom.

    1976-01-01

    The article reports on the development of SANWELD welding rods at GARHYTTAN's which is a wire free of impurities, copper, and hydrogen with a nickel surface. It is producted according to the SANBOND process. The wire has an optimum of mechanical quality grades depending on the powder used for welding, especially an improvement of notch impact strength. The elongation, especially the long-time values, are improved, hydrogen cracks are excluded depending on the correct powder or protective gas, and the low-temparature values are improved. An attendant phenomenon, which is not unimportant, is that the wires are practically corrosion-resistant in the non-welded state. The wire is suitable for submerged-arc welding in steam boilers and pressure vessels. (IHoe) [de

  16. Low temperature annealing of cold-drawn pearlitic steel wire

    DEFF Research Database (Denmark)

    Zhang, Xiaodan; Bech, Jakob Ilsted; Hansen, Niels

    2015-01-01

    Cold-drawn pearlitic steel wires are nanostructured and the flow stress at room temperature can reach values above 6 GPa. A typical characteristic of the nanostructured metals, is the low ductility and thermal stability. In order to optimize both the processing and application of the wires......, the thermal behaviour is of interest. This has been studied by annealing the wires for 1h at temperatures from ambient temperature to 300 ℃ (573 K). It is expected that a raising temperature may lead to structural changes and a reduction in strength. The change in strength is however not expected to be large....... For this reason we have applied a very precise technique to measure the tensile properties of the wires from a strain of 10-4 to the maximum strain of about 1-2%. The structural changes have also been followed to estimate and relate strength changes to changes in structural parameters and morphology....

  17. Crosslinking of wire and cable insulation using electron accelerators

    International Nuclear Information System (INIS)

    Feng Yongxiang; Ma Zueteh

    1992-01-01

    Radiation crosslinking of wire and cable insulation is a well-established technology that is widely used in industry. The advantages of radiation crosslinking over chemical crosslinking have helped maintain its steady growth. Since successful utilization of electron beam processing relies on the formulation of compounds used in insulation, the radiation crosslinking of various polymers is reviewed. The handling technology for crosslinking wire and cable insulation and the throughput capacity of electron beam processors are also discussed. More than 30% of the industrial electron accelerators in the world are used for the radiation crosslinking of wire and cable insulation. Prospects of increased use of electron accelerators for crosslinking of wire and cable insulation are very good. (orig.)

  18. ONLINE TECHNOLOGICAL MONITORING OF INSULATION DEFECTS IN ENAMELED WIRES

    Directory of Open Access Journals (Sweden)

    V. M. Zolotaryov

    2017-08-01

    Full Text Available In this paper the authors used non-destructive technological monitoring of defects insulation enameled wire with poliimid polymer. The paper is devoted to the statistical method for processing, comparison and analysis of results of measurements of parameters of insulation of enameled wire because of mathematical model of trend for application in active technological monitoring is developed; the recommendations for parameters of such monitoring are used. It is theoretically justified and the possibility of determination of dependence of the error on the velocity of movement of a wire for want of quantifying of defects in enameled insulation by non-destructive tests by high voltage. The dependence of average value of amount of defects for enameled wire with two-sheeted poliimid insulation in a range of nominal diameter 0.56 mm is experimentally determined. The technological monitoring purpose is to reduce the quantifying defects of enameled insulation.

  19. Researching on Control Device of Prestressing Wire Reinforcement

    Science.gov (United States)

    Si, Jianhui; Guo, Yangbo; Liu, Maoshe

    2017-06-01

    This paper mainly introduces a device for controlling prestress and its related research methods, the advantage of this method is that the reinforcement process is easy to operate and control the prestress of wire rope accurately. The relationship between the stress and strain of the steel wire rope is monitored during the experiment, and the one - to - one relationship between the controllable position and the pretightening force of the steel wire rope is confirmed by the 5mm steel wire rope, and the results are analyzed theoretically by the measured elastic modulus. The results show that the method can effectively control the prestressing force, and the result provides a reference method for strengthening the concrete column with prestressed steel strand.

  20. The National Shipbuilding Research Program, Proceedings of the REAPS Technical Symposium Paper No. 16: The Navy's Cabling and Wiring Computer Program

    National Research Council Canada - National Science Library

    Mellis, James

    1976-01-01

    ... of the naval shipbuilding process. After the aerospace industry's success in developing a productive wiring data system and an in-depth NAVSEC sponsored study at three designated naval shipyards of the cabling/wiring flow process...

  1. Wire Array Solar Cells: Fabrication and Photoelectrochemical Studies

    Science.gov (United States)

    Spurgeon, Joshua Michael

    Despite demand for clean energy to reduce our addiction to fossil fuels, the price of these technologies relative to oil and coal has prevented their widespread implementation. Solar energy has enormous potential as a carbon-free resource but is several times the cost of coal-produced electricity, largely because photovoltaics of practical efficiency require high-quality, pure semiconductor materials. To produce current in a planar junction solar cell, an electron or hole generated deep within the material must travel all the way to the junction without recombining. Radial junction, wire array solar cells, however, have the potential to decouple the directions of light absorption and charge-carrier collection so that a semiconductor with a minority-carrier diffusion length shorter than its absorption depth (i.e., a lower quality, potentially cheaper material) can effectively produce current. The axial dimension of the wires is long enough for sufficient optical absorption while the charge-carriers are collected along the shorter radial dimension in a massively parallel array. This thesis explores the wire array solar cell design by developing potentially low-cost fabrication methods and investigating the energy-conversion properties of the arrays in photoelectrochemical cells. The concept was initially investigated with Cd(Se, Te) rod arrays; however, Si was the primary focus of wire array research because its semiconductor properties make low-quality Si an ideal candidate for improvement in a radial geometry. Fabrication routes for Si wire arrays were explored, including the vapor-liquid-solid growth of wires using SiCl4. Uniform, vertically aligned Si wires were demonstrated in a process that permits control of the wire radius, length, and spacing. A technique was developed to transfer these wire arrays into a low-cost, flexible polymer film, and grow multiple subsequent arrays using a single Si(111) substrate. Photoelectrochemical measurements on Si wire array

  2. Topology Optimized Photonic Wire Splitters

    DEFF Research Database (Denmark)

    Frandsen, Lars Hagedorn; Borel, Peter Ingo; Jensen, Jakob Søndergaard

    2006-01-01

    Photonic wire splitters have been designed using topology optimization. The splitters have been fabricated in silicon-on-insulator material and display broadband low-loss 3dB splitting in a bandwidth larger than 100 nm.......Photonic wire splitters have been designed using topology optimization. The splitters have been fabricated in silicon-on-insulator material and display broadband low-loss 3dB splitting in a bandwidth larger than 100 nm....

  3. Hybrid Cat Bonds

    OpenAIRE

    Barrieu, Pauline; Louberge, Henri

    2009-01-01

    Natural catastrophes attract regularly the attention of media and have become a source of public concern. From a financial viewpoint, natural catastrophes represent idiosyncratic risks, diversifiable at the world level. But for reasons analyzed in this paper reinsurance markets are unable to cope with this risk completely. Insurance-linked securities, such as cat bonds, have been issued to complete the international risk transfer process, but their development is disappointing so far. This pa...

  4. PMMA to Polystyrene bonding for polymer based microfluidic systems

    KAUST Repository

    Fan, Yiqiang

    2013-03-29

    A thermal bonding technique for Poly (methylmethacrylate) (PMMA) to Polystyrene (PS) is presented in this paper. The PMMA to PS bonding was achieved using a thermocompression method, and the bonding strength was carefully characterized. The bonding temperature ranged from 110 to 125 C with a varying compression force, from 700 to 1,000 N (0.36-0.51 MPa). After the bonding process, two kinds of adhesion quantification methods were used to measure the bonding strength: the double cantilever beam method and the tensile stress method. The results show that the bonding strength increases with a rising bonding temperature and bonding force. The results also indicate that the bonding strength is independent of bonding time. A deep-UV surface treatment method was also provided in this paper to lower the bonding temperature and compression force. Finally, a PMMA to PS bonded microfluidic device was fabricated successfully. © 2013 Springer-Verlag Berlin Heidelberg.

  5. HTS Wire Development Workshop: Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    1994-07-01

    The 1994 High-Temperature Superconducting Wire Development Workshop was held on February 16--17 at the St. Petersburg Hilton and Towers in St. Petersburg, Florida. The meeting was hosted by Florida Power Corporation and sponsored by the US Department of Energy`s Superconductivity Program for Electric Power Systems. The meeting focused on recent high-temperature superconducting wire development activities in the Department of Energy`s Superconductivity Systems program. The meeting opened with a general discussion on the needs and benefits of superconductivity from a utility perspective, the US global competitiveness position, and an outlook on the overall prospects of wire development. The meeting then focused on four important technology areas: Wire characterization: issues and needs; technology for overcoming barriers: weak links and flux pinning; manufacturing issues for long wire lengths; and physical properties of HTS coils. Following in-depth presentations, working groups were formed in each technology area to discuss the most important current research and development issues. The working groups identified research areas that have the potential for greatly enhancing the wire development effort. These areas are discussed in the summary reports from each of the working groups. This document is a compilation of the workshop proceedings including all general session presentations and summary reports from the working groups.

  6. Wire Scanner Motion Control Card

    CERN Document Server

    Forde, S E

    2006-01-01

    Scientists require a certain beam quality produced by the accelerator rings at CERN. The discovery potential of LHC is given by the reachable luminosity at its interaction points. The luminosity is maximized by minimizing the beam size. Therefore an accurate beam size measurement is required for optimizing the luminosity. The wire scanner performs very accurate profile measurements, but as it can not be used at full intensity in the LHC ring, it is used for calibrating other profile monitors. As the current wire scanner system, which is used in the present CERN accelerators, has not been made for the required specification of the LHC, a new design of a wire scanner motion control card is part of the LHC wire scanner project. The main functions of this card are to control the wire scanner motion and to acquire the position of the wire. In case of further upgrades at a later stage, it is required to allow an easy update of the firmware, hence the programmable features of FPGAs will be used for this purpose. The...

  7. Bond strength of masonry

    NARCIS (Netherlands)

    Pluijm, van der R.; Vermeltfoort, A.Th.

    1992-01-01

    Bond strength is not a well defined property of masonry. Normally three types of bond strength can be distinguished: - tensile bond strength, - shear (and torsional) bond strength, - flexural bond strength. In this contribution the behaviour and strength of masonry in deformation controlled uniaxial

  8. Hybrid microcircuit technology handbook materials, processes, design, testing and production

    CERN Document Server

    Licari, James J

    1998-01-01

    The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will

  9. Covalent Bonding of Thermoplastics to Rubbers for Printable, Reel-to-Reel Processing in Soft Robotics and Microfluidics.

    Science.gov (United States)

    Taylor, Jay M; Perez-Toralla, Karla; Aispuro, Ruby; Morin, Stephen A

    2018-02-01

    The lamination of mechanically stiff structures to elastic materials is prevalent in biological systems and popular in many emerging synthetic systems, such as soft robotics, microfluidics, stretchable electronics, and pop-up assemblies. The disparate mechanical and chemical properties of these materials have made it challenging to develop universal synthetic procedures capable of reliably adhering to these classes of materials together. Herein, a simple and scalable procedure is described that is capable of covalently laminating a variety of commodity ("off-the-shelf") thermoplastic sheets to silicone rubber films. When combined with laser printing, the nonbonding sites can be "printed" onto the thermoplastic sheets, enabling the direct fabrication of microfluidic systems for actuation and liquid handling applications. The versatility of this approach in generating thin, multifunctional laminates is demonstrated through the fabrication of milliscale soft actuators and grippers with hinged articulation and microfluidic channels with built-in optical filtering and pressure-dependent geometries. This method of fabrication offers several advantages, including technical simplicity, process scalability, design versatility, and material diversity. The concepts and strategies presented herein are broadly applicable to the soft robotics, microfluidics, and advanced and additive manufacturing communities where hybrid rubber/plastic structures are prevalent. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  10. Ignition and spread of electrical wire fires

    OpenAIRE

    Huang, Xinyan

    2012-01-01

    Ignition of electrical wires by external heating is investigated in order to gain a better understanding of the initiation of electrical-wire fires. An ignition-to- spread model is developed to systematically explain ignition and the following transition to spread. The model predicts that for a higher-conductance wire it is more difficult to achieve ignition and the weak flame may extinguish during the transition phase because of a large conductive heat loss along the wire core. Wires with tw...

  11. Recrystallization texture in nickel heavily deformed by accumulative roll bonding

    DEFF Research Database (Denmark)

    Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

    2017-01-01

    particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different...

  12. The Quantum Socket: Wiring for Superconducting Qubits - Part 2

    Science.gov (United States)

    Bejanin, J. H.; McConkey, T. G.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

    Quantum computing research has reached a level of maturity where quantum error correction (QEC) codes can be executed on linear arrays of superconducting quantum bits (qubits). A truly scalable quantum computing architecture, however, based on practical QEC algorithms, requires nearest neighbor interaction between qubits on a two-dimensional array. Such an arrangement is not possible with techniques that rely on wire bonding. To address this issue, we have developed the quantum socket, a device based on three-dimensional wires that enables the control of superconducting qubits on a two-dimensional grid. In this talk, we present experimental results characterizing this type of wiring. We will show that the quantum socket performs exceptionally well for the transmission and reflection of microwave signals up to 10 GHz, while minimizing crosstalk between adjacent wires. Under realistic conditions, we measured an S21 of -5 dB at 6 GHz and an average crosstalk of -60 dB. We also describe time domain reflectometry results and arbitrary pulse transmission tests, showing that the quantum socket can be used to control superconducting qubits.

  13. Transport properties of different BSCCO wires

    International Nuclear Information System (INIS)

    Metra, P.; Gherardi, L.; Vellego, G.; Masini, R.; Zannella, S.

    1990-01-01

    This paper reports on two classes of solver sheathed BSCCO wires and laminates were prepared from 2223 (Pb substituted) and 2212 powders, respectively, by the powder in tube method. By suitable heat treatments (sintering and annealing below the melting temperature for 2223, melting + annealing for 2212), we obtained sample wires with Tc of ∼110 and ∼85 K respectively, comparable Jc at 77 K (∼10 3 A/cm 2 ), and dramatically different transport behavior. Measurements of critical current at different temperatures and as a function of applied magnetic field were carried out, to characterize the two classes of samples, together with other electrical testing (e.g. d.c. susceptibility) and structural analyses. The granular nature of the higher Tc BSCCO, qualitatively similar to the one of YBCO, was well documented. The melt-processed material showed no apparent granularity, but very strong field dependence of Jc at high temperature. The effect of mechanical deformation on Jc was also investigated by bending samples on different diameters before and after heat treatment. Wires and tapes with 2212 were found to be bendable on very small diameters before treatment, but also the 2223 filled samples were shown to accept significant deformation before sintering

  14. Reliability of the wire drawing dies

    International Nuclear Information System (INIS)

    Sheikh, A.K.; Khany, S.E.

    1993-01-01

    A wear based model is proposed for the dies used in wire drawing process. Using this wear model, it is possible to predict life of the die corresponding to a wear limit criterion. Since various quantities in the model are random in nature the resulting die life will also be random quantity characterized by an appropriate distribution. Using a probabilistic characterization of the parameters of the predictive model, Monte Carlo simulations were conducted to establish the die life distribution. To asses the sensitivity of life distribution with respect to various contributing variables (parameters), the simulation runs were conducted at different levels of these variables (parameters). It is shown that wire drawing die life is Weibull distributed. To compare the simulated results with actual time to failure, data of dies was obtained from a large wire drawing company and was compared with corresponding scenario generated by Monte Carlo simulation. Results obtained by Monte Carlo simulations were very close to the actual time to failure data. (author)

  15. Effects of Wire EDM on the Microstructure of P/M Titanium Samples.

    Science.gov (United States)

    Viskić, Joško; Schauperl, Zdravko; Ćatić, Amir; Balog, Martin; Krizik, Peter; Gržeta, Biserka; Popović, Jasminka; Ortolan, Slađana Milardović; Mehulić, Ketij

    2014-12-01

    Commercially pure titanium (CP Ti) has been recognized in dentistry for its biocompatibility, good mechanical properties and corrosion resistance. Conventional manufacturing processes can affect surface quality and result in poor bonding of dental ceramics to CP Ti. This is why powder metallurgy (P/M) and wire electro-discharge machining (WEDM) are being introduced in the manufacturing process. The aim of this study was to evaluate the effect of WEDM on the surface composition and microstructure of P/M CP Ti samples produced for bond strength testing according to ISO 9693. Eight samples of P/M CP Ti, dimensions according to ISO 9693, were made using WEDM and divided in two groups (untreated and grinded). Microanalyses of chemical composition and microstructure of both groups were made using SEM, EDS and XDR. SEM and EDS analysis of untreated samples showed a thin layer on surfaces with fractures in it. Grinded samples showed homogenous structure with no layer and no fractures. XDR analysis showed high level of oxides on the surface of untreated samples, while after grinding only pure α-phase was found. WEDM is a suitable method of sample production for ISO 9693 if accompanied by grinding with silicon carbide papers P320-P4000.

  16. The influence of drawing speed on surface topography of high carbon steel wires

    Directory of Open Access Journals (Sweden)

    M. Suliga

    2017-01-01

    Full Text Available In this work the influence of the drawing speed on surface topography of high carbon steel wires has been assessed. The drawing process of f 5,5 mm wire rod to the final wire of f 1,7 mm was conducted in 12 passes by means of a modern Koch multi-die drawing machine. The drawing speeds in the last passes were: 5, 10, 15, 20 and 25 m/s. For final wires f 1,7 mm the three-dimensional analysis of the wire surface topography investigation was determined. It has been proved that the wire topography in the drawing process is characterized by a random anisotropy and the amount of directing the geometrical structure of the surface depends on the drawing speed.

  17. Corrosion resistance of premodeled wires made of stainless steel used for heart electrotherapy leaders

    International Nuclear Information System (INIS)

    Przondziono, J; Szatka, W; Walke, W; Młynarski, R

    2012-01-01

    The purpose of the study is to evaluate resistance to electrochemical corrosion of wire made of X10CrNi18-8 stainless steel designed for use in cardiology treatment. The influence of strain formed in the premodeling process and methods of wire surface preparation to corrosive resistance in artificial plasma solution were analysed. Wire corrosion tests were carried out in the solution of artificial plasma. Resistance to electrochemical corrosion was evaluated on the ground of recorded curves of anodic polarization by means of potentiodynamic method. Potentiodynamic tests carried out enabled to determine how the resistance to pitting corrosion of wire changes, depending on strain formed in the premodeling process as well as on the method of wire surface preparation. For evaluation of phenomena occurring on the surface of tested steel, electrochemical impedance spectroscopy (EIS) was applied. Deterioration of corrosive properties of wire along with the increase in the formed strain hardening was observed.

  18. Dynamical analysis of surface-insulated planar wire array Z-pinches

    Science.gov (United States)

    Li, Yang; Sheng, Liang; Hei, Dongwei; Li, Xingwen; Zhang, Jinhai; Li, Mo; Qiu, Aici

    2018-05-01

    The ablation and implosion dynamics of planar wire array Z-pinches with and without surface insulation are compared and discussed in this paper. This paper first presents a phenomenological model named the ablation and cascade snowplow implosion (ACSI) model, which accounts for the ablation and implosion phases of a planar wire array Z-pinch in a single simulation. The comparison between experimental data and simulation results shows that the ACSI model could give a fairly good description about the dynamical characteristics of planar wire array Z-pinches. Surface insulation introduces notable differences in the ablation phase of planar wire array Z-pinches. The ablation phase is divided into two stages: insulation layer ablation and tungsten wire ablation. The two-stage ablation process of insulated wires is simulated in the ACSI model by updating the formulas describing the ablation process.

  19. Understanding Bonds - Denmark

    DEFF Research Database (Denmark)

    Rimmer, Nina Røhr

    2016-01-01

    Undervisningsmateriale. A bond is a debt security, similar to an ”I Owe You document” (IOU). When you purchase a bond, you are lending money to a government, municipality, corporation, federal agency or other entity known as the issuer. In return for the loan, the issuer promises to pay you...... a specified rate of interest during the life of the bond and to repay the face value of the bond (the principal) when it “matures,” or comes due. Among the types of bonds you can choose from are: Government securities, municipal bonds, corporate bonds, mortgage and asset-backed securities, federal agency...... securities and foreign government bonds....

  20. Study of process of trueing diamond grinding wheels on metal bonds by method of free abrasive after processing of leucosapphire blanks

    Science.gov (United States)

    Fedonin, O. N.; Handozhko, A. V.; Fedukov, A. G.

    2018-03-01

    The problem of mechanical processing, in particular, grinding products from leucosapphire, is considered. The main problem with this treatment is the need to adjust the diamond tool. One of the methods of tool trueing using loose abrasive technique is considered. The results of a study on restoring the tool cutting ability, its shape and profile after straightening are given.

  1. Technical innovation: Wire guided ductography

    International Nuclear Information System (INIS)

    Aslam, Muhammad Ovais; Ramadan, Salwa; Al-Adwani, Muneera

    2012-01-01

    To introduce an easy and improved technique for performing ductography using inexpensive easily available intravenous cannula. Guide wire: Prolene/Surgipro 3-0 (Polypropylene mono filament non-absorbable surgical suture). A plastic 26 G intravenous cannula. Disposable syringe 2 ml. Non-ionic contrast (low density like Omnipaque 240 mg I/I). The guide wire (Prolene 3-0) is introduced into the orifice of the duct heaving discharge and 26 G intravenous plastic cannula is then passed over the guide wire. The cannula is advanced in the duct over guide wire by spinning around it. When the cannula is in place the guide wire is removed. Any air bubbles present in the hub of the cannula can be displaced by filling the hub from bottom upwards with needle attached to contrast filled syringe. 0.2–0.4 ml non-ionic contrast is gently injected. Injection is stopped if the patient has pain or burning. Magnified cranio-caudal view is obtained with cannula tapped in place and gentle compression is applied with the patient sitting. If duct filling is satisfactory a 90* lateral view is obtained. A successful adaptation of the technique for performing ductography is presented. The materials required for the technique are easily available in most radiology departments and are inexpensive, thus making the procedure comfortable for the patient and radiologist with considerable cost effectiveness.

  2. Californium Recovery from Palladium Wire

    Energy Technology Data Exchange (ETDEWEB)

    Burns, Jon D. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2014-08-01

    The recovery of 252Cf from palladium-252Cf cermet wires was investigated to determine the feasibility of implementing it into the cermet wire production operation at Oak Ridge National Laboratory’s Radiochemical Engineering Development Center. The dissolution of Pd wire in 8 M HNO3 and trace amounts of HCl was studied at both ambient and elevated temperatures. These studies showed that it took days to dissolve the wire at ambient temperature and only 2 hours at 60°C. Adjusting the ratio of the volume of solvent to the mass of the wire segment showed little change in the kinetics of dissolution, which ranged from 0.176 mL/mg down to 0.019 mL/mg. A successful chromatographic separation of 153Gd, a surrogate for 252Cf, from Pd was demonstrated using AG 50x8 cation exchange resin with a bed volume of 0.5 mL and an internal diameter of 0.8 cm.

  3. Mechanical behavior of M-Wire and conventional NiTi wire used to manufacture rotary endodontic instruments.

    Science.gov (United States)

    Pereira, Erika S J; Gomes, Renata O; Leroy, Agnès M F; Singh, Rupinderpal; Peters, Ove A; Bahia, Maria G A; Buono, Vicente T L

    2013-12-01

    Comparison of physical and mechanical properties of one conventional and a new NiTi wire, which had received an additional thermomechanical treatment. Specimens of both conventional (NiTi) and the new type of wire, called M-Wire (MW), were subjected to tensile and three-point bending tests, Vickers microhardness measurements, and to rotating-bending fatigue tests at a strain-controlled level of 6%. Fracture surfaces were observed by scanning electron microscopy and the non-deformed microstructures by transmission electron microscopy. The thermomechanical treatment applied to produce the M-Wire apparently increased the tensile strength and Vickers microhardness of the material, but its apparent Young modulus was smaller than that of conventionally treated NiTi. The three-point bending tests showed a higher flexibility for MW which also exhibited a significantly higher number of cycles to failure. M-Wire presented mechanical properties that can render endodontic instruments more flexible and fatigue resistant than those made with conventionally processed NiTi wires. Copyright © 2013 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

  4. Review of effects of dielectric coatings on electrical exploding wires and Z pinches

    Science.gov (United States)

    Wu, Jian; Li, Xingwen; Li, Mo; Li, Yang; Qiu, Aici

    2017-10-01

    As the most powerful x-ray source in the laboratories, the wire array Z pinches have been of great relevance to inertial confinement fusions, laboratory astrophysics, and other high-energy density applications. In order to produce x-ray with greater power and higher efficiency, the dynamics of wire array has been investigated extensively, and various methods have been proposed to improve the implosion quality of the wire array. This review focuses on the experimental and theoretical investigations regarding the effects of the dielectric coatings on electrical exploding wires and Z pinches. Since the early 2000, the electrical wire explosion related to the first stage of the wire array Z pinches has been studied extensively, and the results indicated that the dielectric coatings can significantly increase the joule energy deposition into a wire in the initial stage, and even the corona free explosion of tungsten wires can be achieved. Recently, there is an increasing interest in the dynamics of insulated wire array Z pinches. By applying dielectric coatings, the ablation process is suppressed, the x-ray start time is delayed, and the possibility of multi-peak radiation is decreased. This review is organized by the evolution dynamics of wire array Z pinches, and a broad introduction to relevant scientific concepts and various other applications are presented. According to the current research status, the challenges, opportunities and further developments of Z pinch loads using dielectric coatings are proposed to further promote the researches and their applications.

  5. Review of effects of dielectric coatings on electrical exploding wires and Z pinches

    International Nuclear Information System (INIS)

    Wu, Jian; Li, Mo; Li, Yang; Li, Xingwen; Qiu, Aici

    2017-01-01

    As the most powerful x-ray source in the laboratories, the wire array Z pinches have been of great relevance to inertial confinement fusions, laboratory astrophysics, and other high-energy density applications. In order to produce x-ray with greater power and higher efficiency, the dynamics of wire array has been investigated extensively, and various methods have been proposed to improve the implosion quality of the wire array. This review focuses on the experimental and theoretical investigations regarding the effects of the dielectric coatings on electrical exploding wires and Z pinches. Since the early 2000, the electrical wire explosion related to the first stage of the wire array Z pinches has been studied extensively, and the results indicated that the dielectric coatings can significantly increase the joule energy deposition into a wire in the initial stage, and even the corona free explosion of tungsten wires can be achieved. Recently, there is an increasing interest in the dynamics of insulated wire array Z pinches. By applying dielectric coatings, the ablation process is suppressed, the x-ray start time is delayed, and the possibility of multi-peak radiation is decreased. This review is organized by the evolution dynamics of wire array Z pinches, and a broad introduction to relevant scientific concepts and various other applications are presented. According to the current research status, the challenges, opportunities and further developments of Z pinch loads using dielectric coatings are proposed to further promote the researches and their applications. (topical review)

  6. Effect of forming process by using external magnetic field of bonded magnet made from NdFeB flakes to microstructure and magnetic properties

    Science.gov (United States)

    Suprapedi; Sardjono, P.; Muljadi; Djauhari, N. R.; Ramlan

    2018-03-01

    Research of fabricated bonded magnets NdFeB made from NdFeB flakes with variation of external magnetic field has been done. The materials preparation process begins with milling NdFeB flakes using High Energy Milling (HEM) for 60 minutes and mixing it with 5 wt % celuna binder and performing compaction to form pellet with a pressure of 40 Kgf/cm2 and then applying external magnetic field (0, 2000, 5000, 8000 and 11000 Gauss). The pellet samples were then dried using vacuum dryer with temperature of 100 °C for 1 hour. Characterization includes bulk density, measurement of magnetic properties with gauss meter, and Vibrating Sample Magnetometer (VSM). From the characterization results the best value was obtained on the external magnetic field orientation of 8000 to 11000 Gauss with a density value of 5.38 g/cm3, flux magnetic value of 465.9 – 467.1 Gauss, remanence value of 2.63–2.776 kGauss, and coercivity value of 1.905–1.925 kOe.

  7. High Temperature Life Testing of 80Ni-20Cr Wire in a Simulated Mars Atmosphere for the Sample Analysis at Mars (SAM) Instrument Suit Gas Processing System (GPS) Carbon Dioxide Scrubber

    Science.gov (United States)

    Gundersen, Cynthia; Hoffman, Christopher; Munoz, Bruno; Steohenson, Timothy; Thomas, Walter

    2008-01-01

    In support of the GPS for the SAM instrument suite built by GSFC, a life test facility was developed to test the suitability of 80Ni-20Cr wire, 0.0056 inches in diameter, for use as a heater element for the carbon dioxide scrubber. The wire would be required to operate at 1000 C in order to attain the 800 C required for regeneration of the getter. The wire also would need to operate in the Mars atmosphere, which consists mostly of CO2 at pressures between 4 and 12 torr. Data on the high temperature degradation mechanism of 80Ni-20Cr in low pressure CO2, together with the effects of thermal cycling, were unknown. In addition, the influence of work hardening of the wire during assembly and the potential for catastrophic grain growth also were unknown. Verification of the wire reliability as defined by the mission goals required the construction of a test facility that would accurately simulate the duty cycles in a simulated Mars atmosphere. The experimental set-up, along with the test protocol and results will be described.

  8. Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites.

    Science.gov (United States)

    Florián-Algarín, David; Marrero, Raúl; Li, Xiaochun; Choi, Hongseok; Suárez, Oscar Marcelo

    2018-03-10

    This study sought to characterize aluminum nanocomposite wires that were fabricated through a cold-rolling process, having potential applications in TIG (tungsten inert gas) welding of aluminum. A206 (Al-4.5Cu-0.25Mg) master nanocomposites with 5 wt % γAl₂O₃ nanoparticles were first manufactured through a hybrid process combining semi-solid mixing and ultrasonic processing. A206/1 wt % γAl₂O₃ nanocomposites were fabricated by diluting the prepared master nanocomposites with a monolithic A206 alloy, which was then added to a pure aluminum melt. The fabricated Al-γAl₂O₃ nanocomposite billet was cold-rolled to produce an Al nanocomposite wire with a 1 mm diameter and a transverse area reduction of 96%. Containing different levels of nanocomposites, the fabricated samples were mechanically and electrically characterized. The results demonstrate a significantly higher strength of the aluminum wires with the nanocomposite addition. Further, the addition of alumina nanoparticles affected the wires' electrical conductivity compared with that of pure aluminum and aluminum-copper alloys. The overall properties of the new material demonstrate that these wires could be an appealing alternative for fillers intended for aluminum welding.

  9. Magnetization reversal processes in bonded magnets made from a mixture of Nd–(Fe,Co)–B and strontium ferrite powders

    International Nuclear Information System (INIS)

    Dospial, M.; Plusa, D.

    2013-01-01

    Isotropic epoxy-resin bonded magnets composed of different amounts of Magnequench MQP-B and strontium ferrite powders have been prepared using a compression molding technique. The magnetic parameters for magnets with different amounts of strontium ferrite and magnetization reversal processes have been studied by the measurement of the initial magnetization curves, the major hysteresis loops measured at a field up to 14 T and sets of recoil loops. The enhancement of μ 0 M R and μ 0 H C is observed in comparison with the calculated values. From the recoil loops the field dependences of the reversible, irreversible and total magnetization components and the differential susceptibilities were derived. From the dependence of the irreversible magnetization component versus an applied field it was deduced that the main mechanism of magnetization reversal process is the pinning of domain walls in MQP-B and strontium ferrite grains. The interactions between the magnetic particles and grains have been examined by the analysis of the δM plot. The δM behavior of magnets with ferrite has been interpreted as being composed of magnetizing exchange coupling and demagnetizing dipolar interactions. - Highlights: ► SrFe 12 O 19 addition causes a decrease in the H c , J R and (BH) max . ► H c and J R changes are not in agreement with dilution law. ► Main mechanism of the coercivity is the pinning of domain walls. ► In both magnets from pure powders dominant role plays long range dipolar interactions. ► Dipolar and exchange interaction are simultaneously present in hybrids but the dipolar are weaker.

  10. Gold Wire-networks: Particle Array Guided Evaporation Lithograpy

    KAUST Repository

    Lone, Saifullah

    2015-06-29

    We exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.

  11. Electron Raman scattering in quantum well wires

    International Nuclear Information System (INIS)

    Zhao Xiangfu; Liu Cuihong

    2007-01-01

    Electron Raman scattering (ERS) is investigated in a semiconductor quantum well wire (QWW) of cylindrical geometry for T=0K and neglecting phonon-assisted transitions. The differential cross-section (DCS) involved in this process is calculated as a function of a scattering frequency and the cylindrical radius. Electron states are confined within a QWW. Single parabolic conduction and valence bands are assumed. The selection rules are studied. Singularities in the spectra are interpreted for various cylindrical radii. ERS discussed here can provide direct information about the electron band structure of the system

  12. In-Situ Wire Damage Detection System

    Science.gov (United States)

    Williams, Martha K. (Inventor); Roberson, Luke B. (Inventor); Tate, Lanetra C. (Inventor); Smith, Trent M. (Inventor); Gibson, Tracy L. (Inventor); Jolley, Scott T. (Inventor); Medelius, Pedro J. (Inventor)

    2014-01-01

    An in-situ system for detecting damage in an electrically conductive wire. The system includes a substrate at least partially covered by a layer of electrically conductive material forming a continuous or non-continuous electrically conductive layer connected to an electrical signal generator adapted to delivering electrical signals to the electrically conductive layer. Data is received and processed to identify damage to the substrate or electrically conductive layer. The electrically conductive material may include metalized carbon fibers, a thin metal coating, a conductive polymer, carbon nanotubes, metal nanoparticles or a combination thereof.

  13. Modifications on the hydrogen bond network by mutations of Escherichia coli copper efflux oxidase affect the process of proton transfer to dioxygen leading to alterations of enzymatic activities

    Energy Technology Data Exchange (ETDEWEB)

    Kajikawa, Takao; Kataoka, Kunishige [Graduate School of Natural Science and Technology, Kanazawa University, Kakuma, Kanazawa 920-1192 (Japan); Sakurai, Takeshi, E-mail: tsakurai@se.kanazawa-u.ac.jp [Graduate School of Natural Science and Technology, Kanazawa University, Kakuma, Kanazawa 920-1192 (Japan)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer Proton transfer pathway to dioxygen in CueO was identified. Black-Right-Pointing-Pointer Glu506 is the key amino acid to transport proton. Black-Right-Pointing-Pointer The Ala mutation at Glu506 formed a compensatory proton transfer pathway. Black-Right-Pointing-Pointer The Ile mutation at Glu506 shut down the hydrogen bond network. -- Abstract: CueO has a branched hydrogen bond network leading from the exterior of the protein molecule to the trinuclear copper center. This network transports protons in the four-electron reduction of dioxygen. We replaced the acidic Glu506 and Asp507 residues with the charged and uncharged amino acid residues. Peculiar changes in the enzyme activity of the mutants relative to the native enzyme indicate that an acidic amino acid residue at position 506 is essential for effective proton transport. The Ala mutation resulted in the formation of a compensatory hydrogen bond network with one or two extra water molecules. On the other hand, the Ile mutation resulted in the complete shutdown of the hydrogen bond network leading to loss of enzymatic activities of CueO. In contrast, the hydrogen bond network without the proton transport function was constructed by the Gln mutation. These results exerted on the hydrogen bond network in CueO are discussed in comparison with proton transfers in cytochrome oxidase.

  14. Pull-pull position control of dual motor wire rope transmission.

    Science.gov (United States)

    Guo, Quan; Jiao, Zongxia; Yan, Liang; Yu, Qian; Shang, Yaoxing

    2016-08-01

    Wire rope transmission is very efficient because of the small total moving object mass. The wire rope could only transmit pulling force. Therefore it has to be kept in a tightened state during transmission; in high speed applications the dynamic performance depends on the rope's stiffness, which can be adjusted by the wire rope tension. To improve the system dynamic performance output, this paper proposes a novel pull-pull method based on dual motors connected by wire ropes, for precise, high speed position control applications. The method can regulate target position and wire rope tension simultaneously. Wire ropes remain in a pre-tightening state at all times, which prevents the influence of elasticity and reduces the position tracking error in the changing direction process. Simulations and experiments were conducted; the results indicate that both position precision and superior dynamic performance can be synchronously achieved. The research is relevant to space craft precision pointing instruments.

  15. Synthesis of Commercial Products from Copper Wire-Drawing Waste

    Science.gov (United States)

    Ayala, J.; Fernández, B.

    2014-06-01

    Copper powder and copper sulfate pentahydrate were obtained from copper wire-drawing scale. The hydrometallurgical recycling process proposed in this article yields a high-purity copper powder and analytical grade copper sulfate pentahydrate. In the first stage of this process, the copper is dissolved in sulfuric acid media via dismutation of the scale. In the second stage, copper sulfate pentahydrate is precipitated using ethanol. Effects such as pH, reaction times, stirring speed, initial copper concentration, and ethanol/solution volume ratio were studied during the precipitation from solution reaction. The proposed method is technically straightforward and provides efficient recovery of Cu from wire-drawing scale.

  16. The influence of the manufacturing method on the microstructure and drawing properties of copper wires

    International Nuclear Information System (INIS)

    Gruber, A.; Jeglitsch, F.

    1982-01-01

    Copper is the third most important common metal from production figures after iron and aluminium and is largely used as pure metal in the electroindustry mainly here in the form of wires of different sizes due to its excellent electrical properties. Therefore all factors influencing the drawing ability are very important. The following work deals with the influence of impurity measurements as well as of the microstructure on the deformation or recrystallization behaviour in manufacturing continuous casting and rolling wire and dip-forming wire, and gives a rupture cause specific to each manufacturing method in the wire drawing process. (orig.) [de

  17. Calculation of energy transfer by fission fragments from plane uranium layer to thin wire

    International Nuclear Information System (INIS)

    Pikulev, A.A.

    2006-01-01

    Energy transfer from a flat fissile uranium slab to a fine wire via fission fragments is calculated. The rate of energy transfer versus the thicknesses of the slab and protecting aluminum film, as well as the wire-slab gap, is found. An expression for the absorption coefficient of the wire is derived, and the effect the thickness of the wire has on the energy transfer process is studied. The amount of the edge effect for a finite-size uranium slab is demonstrated with calculations for vacuum conditions and for argon under a pressure of 0.25 atm [ru

  18. High conductivity carbon nanotube wires from radial densification and ionic doping

    Science.gov (United States)

    Alvarenga, Jack; Jarosz, Paul R.; Schauerman, Chris M.; Moses, Brian T.; Landi, Brian J.; Cress, Cory D.; Raffaelle, Ryne P.

    2010-11-01

    Application of drawing dies to radially densify sheets of carbon nanotubes (CNTs) into bulk wires has shown the ability to control electrical conductivity and wire density. Simultaneous use of KAuBr4 doping solution, during wire drawing, has led to an electrical conductivity in the CNT wire of 1.3×106 S/m. Temperature-dependent electrical measurements show that conduction is dominated by fluctuation-assisted tunneling, and introduction of KAuBr4 significantly reduces the tunneling barrier between individual nanotubes. Ultimately, the concomitant doping and densification process leads to closer packed CNTs and a reduced charge transfer barrier, resulting in enhanced bulk electrical conductivity.

  19. Optimization of electron beam crosslinking of wire and cable insulation

    International Nuclear Information System (INIS)

    Zimek, Zbigniew; Przybytniak, Grażyna; Nowicki, Andrzej

    2012-01-01

    The computer simulations based on Monte Carlo (MC) method and the ModeCEB software were carried out in connection with electron beam (EB) radiation set-up for crosslinking of electric wire and cable insulation. The theoretical predictions for absorbed dose distribution in irradiated electric insulation induced by scanned EB were compared to the experimental results of irradiation that was carried out in the experimental set-up based on ILU 6 electron accelerator with electron energy 0.5–2.0 MeV. The computer simulation of the dose distributions in two-sided irradiation system by a scanned electron beam in multilayer circular objects was performed for various process parameters, namely electric wire and cable geometry (thickness of insulation layers and copper wire diameter), type of polymer insulation, electron energy, energy spread and geometry of electron beam, electric wire and cable layout in irradiation zone. The geometry of electron beam distribution in the irradiation zone was measured using CTA and PVC foil dosimeters for available electron energy range. The temperature rise of the irradiated electric wire and irradiation homogeneity were evaluated for different experimental conditions to optimize technological process parameters. The results of computer simulation are consistent with the experimental data of dose distribution evaluated by gel-fraction measurements. Such conformity indicates that ModeCEB computer simulation is reliable and sufficient for optimization absorbed dose distribution in the multi-layer circular objects irradiated with scanned electron beams. - Highlights: ► We model wire and cables irradiation process by Monte Carlo simulations. ► We optimize irradiation configuration for various process parameters. ► Temperature rise and irradiation homogeneity were evaluated. ► Calculation (dose) and experimental (gel-fraction) results were compared. ► Computer simulation was found reliable and sufficient for process optimization.

  20. An Alternative Low-Cost Process for Deposition of MCrAlY Bond Coats for Advanced Syngas/Hydrogen Turbine Applications

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Ying [Tennessee Technological Univ., Cookeville, TN (United States)

    2015-09-11

    The objective of this project was to develop and optimize MCrAlY bond coats for syngas/hydrogen turbine applications using a low-cost electrolytic codeposition process. Prealloyed CrAlY-based powders were codeposited into a metal matrix of Ni, Co or Ni-Co during the electroplating process, and a subsequent post-deposition heat treatment converted it to the MCrAlY coating. Our research efforts focused on: (1) investigation of the effects of electro-codeposition configuration and parameters on the CrAlY particle incorporation in the NiCo-CrAlY composite coatings; (2) development of the post-deposition heat treating procedure; (3) characterization of coating properties and evaluation of coating oxidation performance; (4) exploration of a sulfurfree electroplating solution; (5) cost analysis of the present electrolytic codeposition process. Different electro-codeposition configurations were investigated, and the rotating barrel system demonstrated the capability of depositing NiCo-CrAlY composite coatings uniformly on the entire specimen surface, with the CrAlY particle incorporation in the range 37-42 vol.%. Post-deposition heat treatment at 1000-1200 °C promoted interdiffusion between the CrAlY particles and the Ni-Co metal matrix, resulting in β/γ’/γ or β/γ’ phases in the heat-treated coatings. The results also indicate that the post-deposition heat treatment should be conducted at temperatures ≤1100 °C to minimize Cr evaporation and outward diffusion of Ti. The electro-codeposited NiCrAlY coatings in general showed lower hardness and surface roughness than thermal spray MCrAlY coatings. Coating oxidation performance was evaluated at 1000-1100 °C in dry and wet air environments. The initial electro-codeposited NiCoCrAlY coatings containing relatively high sulfur did not show good oxidation resistance. After modifications of the coating process, the cleaner NiCoCrAlY coating exhibited good oxidation performance at 1000 °C during the 2,000 1-h cyclic