WorldWideScience

Sample records for wire bonding process

  1. FE modeling of Cu wire bond process and reliability

    NARCIS (Netherlands)

    Yuan, C.A.; Weltevreden, E.R.; Akker, P. van den; Kregting, R.; Vreugd, J. de; Zhang, G.Q.

    2011-01-01

    Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond

  2. Copper wire bonding

    CERN Document Server

    Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

    2014-01-01

    This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

  3. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  4. Thermosonic wire bonding of IC devices using palladium wire

    International Nuclear Information System (INIS)

    Shze, J.H.; Poh, M.T.; Tan, R.M.

    1996-01-01

    The feasibility of replacing gold wire by palladium wire in thermosonic wire bonding of CMOS and bipolar devices are studied in terms of the manufacturability, physical, electrical and assembly performance. The results that palladium wire is a viable option for bonding the bipolar devices but not the CMOS devices

  5. Body of Knowledge (BOK) for Copper Wire Bonds

    Science.gov (United States)

    Rutkowski, E.; Sampson, M. J.

    2015-01-01

    Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications

  6. 1 mil gold bond wire study.

    Energy Technology Data Exchange (ETDEWEB)

    Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W.; Rutherford, Brian Milne

    2013-05-01

    In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, the gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.

  7. Towards Unconventional Applications of Wire Bonding

    OpenAIRE

    Schröder, Stephan

    2018-01-01

    This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. Exploiting the advantages of state-of-the-art wire bo...

  8. Enhancing wire-composite bond strength of bonded retainers with wire surface treatment.

    Science.gov (United States)

    Oesterle, L J; Shellhart, W C; Henderson, S

    2001-06-01

    Bonded orthodontic retainers with wires embedded in composite resin are commonly used for orthodontic retention. The purpose of this study was to test, in vitro, various wire surface treatments to determine the optimal method of enhancing the wire-composite bond strength. Coaxial wires and stainless steel wires with different surface treatments were bonded to bovine enamel and then pulled along their long axes with an Instron universal testing machine. Wire surface treatments included placing a right-angle bend in the wire, microetching the wire, and treating the wire with adhesion promoters; combinations of treatments were also examined. The results demonstrated a 24-fold increase in the wire-composite bond strength of wire that was microetched (sandblasted), compared with that of untreated straight wire. The difference between the amount of force required to break the bond produced by microetching alone (246.1 +/- 46.0 MPa) and that required for the bonds produced by the retentive bend (87.8 +/- 16.3 MPa), the adhesion promoters (silane, 11.0 +/- 3.1 MPa; Metal Primer, 28.5 +/- 15.8 MPa), or for any combination of surface treatments, was statistically significant. Microetching a stainless steel wire produced a higher wire-composite bond strength than that obtained from a coaxial wire (113.5 +/- 27.5 MPa). The results of this study indicate that microetching or sandblasting a stainless steel wire significantly increases the strength of the wire-composite bond.

  9. Bonding of a niobium wire to a niobium thin film

    NARCIS (Netherlands)

    Jaszczuk, W.; Jaszczuk, W.; ter Brake, Hermanus J.M.; Flokstra, Jakob; Veldhuis, Dick; Stammis, R.; Rogalla, Horst

    1991-01-01

    A method for bonding a niobium wire to a niobium thin film is described. The bonds are to be used as superconducting connections between wire-wound gradiometers and thin-film coupling coils on DC SQUIDS. The method is characterized by two steps. Firstly, the hardness of the niobium wire is reduced

  10. Bandwidth improvement for germanium photodetector using wire bonding technology.

    Science.gov (United States)

    Chen, Guanyu; Yu, Yu; Deng, Shupeng; Liu, Lei; Zhang, Xinliang

    2015-10-05

    We demonstrate an ultrahigh speed germanium photodetector by introducing gold wires into the discrete ground electrodes with standard wire bonding technology. To engineer the parasitic parameter, the physical dimension of the gold wire used for wire bonding is specially designed with an inductance of about 450 pH. Simulation and experimental results show that the bandwidth of the photodetector can be effectively extended from less than 30 GHz to over 60 GHz.

  11. Laser-heating wire bonding on MEMS packaging

    Directory of Open Access Journals (Sweden)

    Yuetao Liu

    2014-02-01

    Full Text Available Making connections is critical in fabrication of MEMS (Micro-Electro-Mechanical Systems. It is also complicated, because the temperature during joining affects both the bond produced and the structure and mechanical properties of the moving parts of the device. Specifications for MEMS packaging require that the temperature not exceed 240 °C. However, usually, temperatures can reach up to 300 °C during conventional thermosonic wire bonding. Such a temperature will change the distribution of dopants in CMOS (Complementary Metal Oxide Semiconductor circuits. In this paper we propose a new heating process. A semiconductor laser (wavelength 808 nm is suggested as the thermal source for wire bonding. The thermal field of this setup was analyzed, and specific mathematical models of the field were built. Experimental results show that the heating can be focused on the bonding pad, and that much lower heat conduction occurs, compared with that during the normal heating method. The bond strength increases with increasing laser power. The bond strengths obtained with laser heating are slightly lower than those obtained with the normal heating method, but can still meet the strength requirements for MEMS.

  12. Thermosonic wire bonding of gold wire onto copper pad using the saturated interfacial phenomena

    Science.gov (United States)

    Jeng, Yeau-Ren; Aoh, Jong-Hing; Wang, Chang-Ming

    2001-12-01

    Copper has been used to replace conventional aluminium interconnection to improve the performance of deep submicron integrated circuits. This study used the saturated interfacial phenomena found in thermosonic ball bonding of gold wire onto aluminium pad to investigate thermosonic ball bonding of gold wire onto copper pad. The effects of preheat temperatures and ultrasonic powers on the bonding force were investigated by using a thermosonic bonding machine and a shear tester. This work shows that under proper preheat temperatures, the bonding force of thermosonic wire bonding can be explained based on interfacial microcontact phenomena such as energy intensity, interfacial temperature and real contact area. It is clearly shown that as the energy intensity is increased, the shear force increases, reaches a maximum, and then decreases. After saturation, i.e. the establishment of maximum atomic bonding, any type of additional energy input will damage the bonding, decreasing the shear force. If the preheat temperature is not within the proper range, the interfacial saturation phenomenon does not exist. For a preload of 0.5 N and a welding time of 15 ms in thermosonic wire bonding of gold wire onto copper pads, a maximum shear force of about 0.33 N is found where the interfacial energy intensity equals 1.8×106 J m-2 for preheat temperatures of 150°C and 170°C. Moreover, the corresponding optimal ultrasonic power is about 110 units.

  13. Rebond strength of bonded lingual wire retainers

    NARCIS (Netherlands)

    van Westing, K.; Algera, T.J.; Kleverlaan, C.J.

    2012-01-01

    There is no consensus in the literature concerning the rebonding procedure for orthodontic retainers. The aim of this in vitro study was to evaluate the bond and rebond strength of retainers bonded to enamel surfaces with and without composite remnants. The retainers were bonded with Excite and

  14. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    CERN Document Server

    Izen, Joseph; The ATLAS collaboration; Kurth, Matthew Glenn

    2015-01-01

    Unencapsulated aluminum wedge wire bonds are common in particle-physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent, source of tracking detector failure Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorenz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of PU-coated wire bonds and their resistance to periodic Lorenz forces will be described.

  15. Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

    Directory of Open Access Journals (Sweden)

    Nick Baker

    2017-03-01

    Full Text Available In fast switching power semiconductors, the use of a fourth terminal to provide the reference potential for the gate signal—known as a kelvin-source terminal—is becoming common. The introduction of this terminal presents opportunities for condition monitoring systems. This article demonstrates how the voltage between the kelvin-source and power-source can be used to specifically monitor bond-wire degradation. Meanwhile, the drain to kelvin-source voltage can be monitored to track defects in the semiconductor die or gate driver. Through an accelerated aging test on 20 A Silicon Carbide Metal-Oxide-Semiconductor-Field-Effect Transistors (MOSFETs, it is shown that there are opposing trends in the evolution of the on-state resistances of both the bond-wires and the MOSFET die. In summary, after 50,000 temperature cycles, the resistance of the bond-wires increased by up to 2 mΩ, while the on-state resistance of the MOSFET dies decreased by approximately 1 mΩ. The conventional failure precursor (monitoring a single forward voltage cannot distinguish between semiconductor die or bond-wire degradation. Therefore, the ability to monitor both these parameters due to the presence of an auxiliary-source terminal can provide more detailed information regarding the aging process of a device.

  16. Studies of IBL wire bonds operation in a ATLAS-like magnetic field.

    CERN Document Server

    Alvarez Feito, D; Mandelli, B

    2015-01-01

    At the Large Hadron Collider (LHC) experiments, most of silicon detectors use wire bonds to connect front-end chips and sensors to circuit boards for the data and service trans- missions. These wire bonds are operated in strong magnetic field environments and if time varying currents pass through them with frequencies close to their mechanical resonance frequency, strong resonant oscillations may occur. Under certain conditions, this effect can lead to fatigue stress and eventually breakage of wire bonds. During the first LHC Long Shutdown, the ATLAS Pixel Detector has been upgraded with the addition of a fourth innermost layer, the Insertable B-Layer (IBL), which has more than 50000 wire bonds operated in the ATLAS 2 T magnetic field. The results of systematic studies of operating wire bonds under IBL-like conditions are presented. Two different solutions have been investigated to minimize the oscillation amplitude of wire bonds.

  17. Comparison of three different orthodontic wires for bonded lingual retainer fabrication

    Science.gov (United States)

    Uysal, Tancan; Gul, Nisa; Alan, Melike Busra; Ramoglu, Sabri Ilhan

    2012-01-01

    Objective We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. Methods We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), 0.016 × 0.022-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III). To test detachment force, deformation, and fracture mode, we embedded 94 lower incisor teeth in acrylic blocks in pairs. Retainer wires were bonded to the teeth and vertically directed force was applied to the wire. To test pull-out force, wires were embedded in composite that was placed in a hole at the center of an acrylic block. Tensile force was applied along the long axis of the wire. Results Detachment force and mode of fracture were not different between groups. Deformation was significantly higher in groups II and III than in group I (p wires, but greater deformations were seen in dead-soft wires. Wire pull-out force was significantly higher for five-stranded coaxial wire than for the other wires tested. Five-stranded coaxial wires are suggested for use in bonded lingual retainers. PMID:23112930

  18. Finite Element Bond Modeling for Indented Wires in Pretensioned Concrete Crossties

    Science.gov (United States)

    2016-04-12

    Indented wires have been increasingly employed by : concrete crosstie manufacturers to improve the bond between : prestressing steel reinforcements and concrete, as bond can : affect several critical performance measures, including transfer : length,...

  19. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    CERN Document Server

    INSPIRE-00092738; Kurth, Matthew; Boyd, Rusty

    2016-01-01

    Unencapsulated aluminum wedge wire bonds are common in particle physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent source of tracking-detector failure. Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorentz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of polyurethane-coated wire bonds and their resistance to periodic Lorentz forces are under study for use in a future High Luminosity Large Hadron Collider detector such as the ATLAS Inner Tracker upgrade.

  20. Investigation on cold-drawn gold bonding wire with serial and reverse-direction drawing

    International Nuclear Information System (INIS)

    Cho, Jae-Hyung; Rollett, A.D.; Cho, J.-S.; Park, Y.-J.; Park, S.-H.; Oh, K.H.

    2006-01-01

    Gold bonding wires have been manufactured through multiple drawing steps with serial and reverse-direction drawing. The texture and microstructure of the gold bonding wires were characterized with X-ray diffraction and EBSD and compared with the predictions of finite element (FE) simulation. Initial fiber decreases during drawing and is replaced by fiber. The oriented grains are concentrated in the center and surface regions, whereas the oriented grains are located throughout the cross-section of the wire. Regions near the surface often exhibit the complex textures. A simplified forward and backward drawing process was modeled by FE analysis with ABAQUS/Standard TM . The simple two-step drawing process results in severe variation in shear strain under the surface and displays the opposite behavior in the shear components of the deformation gradient. The texture evolution was predicted using the deformation gradient calculated in the FE simulations together with a model of polycrystal plasticity. The and fibers are predicted to develop in the center part of the wire where homogeneous deformation occurs. The regions near the surface that experience repeated shear strain exhibit complex textures that deviate from the standard and fibers. The {1 1 2} and {1 1 1} components are prevalent in the higher shear strain regions. The variations of the anisotropic elastic directional moduli with position were also calculated

  1. The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

    Science.gov (United States)

    Huang, Wei-Hsiang; Lin, Kwang-Lung; Lin, Yu-Wei; Cheng, Yun-Kai

    2016-12-01

    Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of an interfacial intermetallic compound (IMC). This study is aimed to investigate the formation behavior of IMCs between an Al pad and Ag-Pd alloy wire with various Pd concentrations of 1.0-6.0% for the as-bonded commercial Ag/Al joint. The interfacial IMCs were investigated with scanning electron microscopy and energy-dispersive x-ray spectroscopy. The IMCs formed are separate (Ag, Pd)2Al and (Ag, Pd)3Al2 for a Ag6Pd wire bond, while (Ag, Pd)2Al and (Ag, Pd)3Al2 are mixed for the other Ag(1-4.5)Pd alloy wire bonds. The thickness of the total IMC layer varies from 0.65 μm for Ag1Pd to 0.91 μm for Ag6Pd, yet a minimum of 0.44 μm exists for Ag3.5Pd. The compound formation behavior was found to correspond with the Ag-Al phase diagram. After pressure cooker tests, a less stable IMC (Ag, Pd)3Al formed at the AgxPd/Al interface.

  2. Reliability Tests of Aluminium Wedge Wire Bonding on Auto-catalytic Silver Immersion Gold (ASIG) PCB Metallization

    CERN Document Server

    Drozd, A; Kaufmann, S; Manolescu, F; McGill, I

    2011-01-01

    The Auto-catalytic Silver Immersion Gold (ASIG) PCB metallization is a new process that has clear advantages for PCB assembly especially with regard to lead-free soldering. As it may become a popular process in the future for electronics used in physics experiments, the quality of this metallization for aluminium wire bonding has been studied. Aluminium wedge wire bonding continues to be the interconnection method of choice for many physics detector sensors, for high density signal routing and for unpackaged die. Although advertised as having good quality for aluminium wire bonding, this study was performed to verify this claim as well as to test the longer term reliability of the wire bonds taking into consideration the environmental conditions and life-expectancy of devices, in particular for high energy physics detector applications. The tests were performed on PCBs made with the ASIG and ENIG (Electro-less Nickel Immersion Gold) processes at the same time in order to make a comparison with the current ind...

  3. Finite element bond models for seven-wire prestressing strands in concrete crossties.

    Science.gov (United States)

    2015-03-23

    Seven-wire strands are commonly used in pretensioned : concrete ties, but its bonding mechanism with concrete needs : further examination to provide a better understanding of some : concrete tie failure modes. As a key component in the finite : eleme...

  4. Monotonic and cyclic bond behavior of confined concrete using NiTiNb SMA wires

    International Nuclear Information System (INIS)

    Choi, Eunsoo; Chung, Young-Soo; Kim, Yeon-Wook; Kim, Joo-Woo

    2011-01-01

    This study conducts bond tests of reinforced concrete confined by shape memory alloy (SMA) wires which provide active and passive confinement of concrete. This study uses NiTiNb SMA which usually shows wide temperature hysteresis; this is a good advantage for the application of shape memory effects. The aims of this study are to investigate the behavior of SMA wire under residual stress and the performance of SMA wire jackets in improving bond behavior through monotonic-loading tests. This study also conducts cyclic bond tests and analyzes cyclic bond behavior. The use of SMA wire jackets transfers the bond failure from splitting to pull-out mode and satisfactorily increases bond strength and ductile behavior. The active confinement provided by the SMA plays a major role in providing external pressure on the concrete because the developed passive confinement is much smaller than the active confinement. For cyclic behavior, slip and circumferential strain are recovered more with larger bond stress. This recovery of slip and circumferential strain are mainly due to the external pressure of the SMA wires since cracked concrete cannot provide any elastic recovery

  5. THERMO-MECHANICALLY PROCESSED ROLLED WIRE FOR HIGH-STRENGTH ON-BOARD WIRE

    Directory of Open Access Journals (Sweden)

    V. A. Lutsenko

    2011-01-01

    Full Text Available It is shown that at twisting of wire of diameter 1,83 mm, produced by direct wire drawing of thermomechanically processed rolled wire of diameter 5,5 mm of steel 90, metal stratification is completely eliminated at decrease of carbon, manganese and an additional alloying of chrome.

  6. Wire Bonding on 2S Modules of the Phase-2 CMS Detector

    CERN Document Server

    AUTHOR|(CDS)2226525; Pooth, Oliver

    The LHC will be upgraded to the HL-LHC in the Long Shutdown 3 starting 2024. This upgrade will increase the collision rate and the overall number of colliding particles requiring high precision particle detectors which are able to cope with much higher radiation doses and numbers of particle interactions per bunch crossing. To fulfill these technical requirements the CMS detector will be upgraded in the so-called Phase-2 Upgrade. Among others the silicon tracking system will be completely replaced by a new system providing a higher acceptance, an improved granularity and the feature to include its tracking information into the level-1 trigger. The new outer-tracker will consist of so called 2S modules consisting of two strip sensors and PS modules with a macro-pixel sensor and a strip sensor. The electrical connection between the strip sensors and the front-end electronics is realized by thin aluminum wire bonds. In this thesis the process of wire bonding is introduced and its implementation in the 2S module ...

  7. Effect of iodine on the corrosion of Au-Al wire bonds

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Müller, Lutz; Jellesen, Morten Stendahl

    2015-01-01

    , and electrochemical testing were used to characterize the samples. Failures of Au-Al wire bonds were found to be primarily attributed to the corrosion of Al via formation of Al iodides and consequent formation of Al oxides and/or hydroxides. Most susceptible to corrosion are Al metallization and Al rich intermetallic......Corrosion study was performed on Au-Al wire bonds, thin layers of sputter deposited Au and Al, and Au-Al intermetallic nuggets. The test environment was iodine-vapour in air (1. mg/L) at 85 °C with varying relative humidity, and 500 mg/L of KI in water. GDOES, XRD, SEM EDS, wire bond shear...

  8. The effects of Ca and Pd dopants on gold bonding wire and gold rod

    International Nuclear Information System (INIS)

    Saraswati, T.S.; Sritharan, T.; Pang, C.I.; Chew, Y.H.; Breach, C.D.; Wulff, F.; Mhaisalkar, S.G.; Wong, C.C.

    2004-01-01

    There is currently little information regarding the physiochemical effects of common bonding wire dopants such as Ca and Pd despite the use of gold bonding wire as an electrical interconnection in over 80% of semiconductor devices. This paper presents experimental results on the residual microstrains in 4 N gold bonding wires with different concentrations of Ca-Pd, measured using peak broadening in X-ray diffraction. The effect of Ca was found to be more prominent. In order to understand more about the physiochemical action of Ca and its effects on the microstructure, TEM and depth sensing nano-indentation (DSI) were used to study 2 mm Ca-doped hard-drawn rods

  9. Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

    OpenAIRE

    Cauchois, Romain; Saadaoui, Mohamed; Legeleux, Jacques; Malia, Thierry; Dubois-Bonvalot, Béatrice; Inal, Karim; Fidalgo, Jean-Christophe

    2010-01-01

    International audience; The nanoporous nature of the inkjet printed silver nanoparticles entail low hardness and surface effective contact area for being compatible with pads that are suitable for wire-bonding in electronic packaging. Electroless nickel plating is a selective metal deposition technique which can brings the required thickness and hardness for further pads processing. Here, a 1.7 μm thick nickel layer is deposited on top of 600 nm thick printed and sintered silver nanoparticles...

  10. Analysis in vitro of direct bonding system with cyanoacrylate ester and orthodontic wires.

    Science.gov (United States)

    Manfrin, Thais Mara; Poi, Wilson Roberto; de Mendonça, Marcos Rogério; Cardoso, Leandro Carvalho; Massa Sundefeld, Maria Lúcia Marçal; Sonoda, Celso Koogi; Panzarini, Sônia Regina

    2009-04-01

    The aim of this study was to evaluate the tensile strength of orthodontic wires bonded onto the enamel with cyanoacrylate ester. To obtain the specimens, 120 human premolars (extracted for orthodontic or periodontal reasons) were included in acrylic blocks of rapid polymerization with three teeth each. Four groups were formed with ten specimens each. In the specimens, a dental splint model was made with cyanoacrylate ester and round stainless steel wire. In groups I, II and III, cyanoacrylate ester was used with round steel wires, with variation in diameter: 0.014 inches; 0.016 inches and 0.018 inches, respectively. In group IV, round steel wire 0.018 inches was used with photo polymerizing resin composite with previous acid etching. The adhesive force of the materials was measured in two points under the action of the tensiometer (ETM-USA). The number of loose wires was counted along with those that remained fixed according to the different levels of force applied because of the direction of the tensile force (vertical or horizontal) and the diameter of the wire used. The data obtained were first submitted to a descriptive analysis and then submitted to a statistical analysis (Friedman's Test and Dunn's Test of Multiple Comparison - Epi-info 3.2). Within the limitations of the experimental conditions presented, the cyanoacrylate ester or 'Super Bonder' maintained bonded to enamel and steel wires (0.016 and 0.018 inches) during the tensile strength tests under different levels of applied forces.

  11. Mission-profile-based stress analysis of bond-wires in SiC power modules

    DEFF Research Database (Denmark)

    Bahman, Amir Sajjad; Iannuzzo, Francesco; Blaabjerg, Frede

    2016-01-01

    This paper proposes a novel mission-profile-based reliability analysis approach for stress on bond wires in Silicon Carbide (SiC) MOSFET power modules using statistics and thermo-mechanical FEM analysis. In the proposed approach, both the operational and environmental thermal stresses are taken...... and the mechanical stress on bond wires is consequently extracted by finite-element simulations. In the final step, the considered mission profile is translated in a stress sequence to be used for Rainflow counting calculation and lifetime estimation....

  12. Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

    International Nuclear Information System (INIS)

    Xu Hui; Qin, Ivy; Clauberg, Horst; Chylak, Bob; Acoff, Viola L.

    2013-01-01

    This paper describes the behavior of palladium in palladium-coated Cu (PdCu) wire bonding and its impact on bond reliability by utilizing transmission electron microscopy (TEM). A Pd layer approximately 80 nm thick, which is coated on the surface of Cu wire, dissolves into the Cu matrix during ball formation (under N 2 gas protection) when the wire tip is melted to form a ball. As a result of dissolving the very thin Pd layer into the ball, Pd is almost undetectable along the entire bond interface between the ball and the Al pad. The behavior of Pd during thermal aging in air, however, is different for central and peripheral interfaces. At the central interface, less than 5 at.% Pd is present after 168 h aging at 175 °C. At the periphery, however, Pd diffuses back and congregates, reaching a level of ∼12 at.% after 24 h, and a Pd-rich (Cu,Pd) 9 Al 4 layer (>40 at.% Pd) forms after 168 h. Pd acts substitutionally in Cu 9 Al 4 but cannot penetrate into the CuAl 2 or CuAl. By comparison of intermetallic thickness and interfacial morphology between PdCu and bare Cu wire bonds, it is concluded that the presence of Pd reduces intermetallic growth rate, and is associated with numerous nanovoids in PdCu bonds.

  13. Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

    International Nuclear Information System (INIS)

    Kang, K.H.; Hara, K.; Higuchi, T.; Hyun, H.J.; Jeon, H.B.; Joo, C.W.; Kah, D.H.; Kim, H.J.; Mibe, T.; Onuki, Y.; Park, H.; Rao, K.K.; Sato, N.; Shimizu, N.; Tanida, K.; Tsuboyama, T.; Uozumi, S.

    2014-01-01

    This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout flex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out flex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 μm. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and 60 mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92±0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience the neck-broken type of break

  14. Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

    Science.gov (United States)

    Gan, C. L.; Classe, F. C.; Chan, B. L.; Hashim, U.

    2014-04-01

    This paper discusses the influence of bonding wires and epoxy mold compounds (EMC) on intermetallic compound (IMC) diffusion kinetics and apparent activation energies ( E aa) of CuAl and AuAl IMCs in a fineline ball grid array package. The objective of this study is to study the CuAl and AuAl IMC growth rates with different epoxy mold compounds and to determine the apparent activation energies of different combination of package bills of materials. IMC thickness measurement has been carried out to estimate the coefficient of diffusion ( D o) and E aa various aging conditions of different EMCs and bonding wires. Apparent activation energies ( E aa) of both wire types were investigated after high temperature storage life tests (HTSL) for both molding compounds. Au bonds were identified to have faster IMC formation, compared to slower IMC growth of Cu. The E aa obtained for CuAl IMC diffusion kinetics are 1.08 and 1.04 eV with EMC A and EMC B, respectively. For AuAl IMC diffusion kinetics, the E aa obtained are 1.04 and 0.98 eV, respectively, on EMC A and EMC B. These values are close to previous HTSL studies conducted on Au and Cu ball bonds and are in agreement to the theory of HTSL performance of Au and Cu bonding wires.Overall, EMC B shows slightly lower apparent activation energy ( E aa) valueas in CuAl and AuAl IMCs. This proves that the different types of epoxy mold compounds have some influence on IMC growth rates.

  15. Long-term effectiveness of canine-to-canine bonded flexible spiral wire lingual retainers

    NARCIS (Netherlands)

    Renkema, A.M.; Bronkhorst, E.M.; Katsaros, C.

    2011-01-01

    INTRODUCTION: The flexible spiral wire (FSW) canine-to-canine lingual retainer bonded to all 6 anterior teeth is a frequently used type of mandibular fixed retainer. This study aimed to assess the long-term effectiveness of FSW canine-to-canine lingual retainers in maintaining the alignment of the

  16. Long-term effectiveness of canine-to-canine bonded flexible spiral wire lingual retainers

    NARCIS (Netherlands)

    Renkema, Anne-Marie; Renkema, Alianne; Bronkhorst, Ewald; Katsaros, Christos

    Introduction: The flexible spiral wire (FSW) canine-to-canine lingual retainer bonded to all 6 anterior teeth is a frequently used type of mandibular fixed retainer. This study aimed to assess the long-term effectiveness of FSW canine-to-canine lingual retainers in maintaining the alignment of the

  17. Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

    DEFF Research Database (Denmark)

    Baker, Nick; Luo, Haoze; Iannuzzo, Francesco

    2017-01-01

    the voltage between the kelvin-source and power-source can be used to specifically monitor bond-wire degradation. Meanwhile, the drain to kelvin-source voltage can be monitored to track defects in the semiconductor die or gate driver. Through an accelerated aging test on 20 A Silicon Carbide Metal-Oxide-Semiconductor-Field-Effect...

  18. Adhesive Properties of Bonded Orthodontic Retainers to Enamel : Stainless Steel Wire vs Fiber-reinforced Composites

    NARCIS (Netherlands)

    Foek, Dave Lie Sam; Krebs, Eliza; Sandham, John; Ozcan, Mutlu

    2009-01-01

    Purpose: The objectives of this study were to compare the bond strength of a stainless steel orthodontic wire vs various fiber-reinforced composites (FRC) used as orthodontic retainers on enamel, analyze the failure types after debonding, and investigate the influence of different application

  19. Wire bond degradation under thermo- and pure mechanical loading

    DEFF Research Database (Denmark)

    Pedersen, Kristian Bonderup; Nielsen, Dennis Achton; Czerny, Bernhard

    2017-01-01

    thermal test. To enable investigation of degradation rate a large number of bond interfaces is analyzed and they are found to follow conventional accepted fracture laws like Paris-Erdogan. With additional work this could enable the possibility of obtaining empirical parameters to be used in actual physics...... based lifetime laws....

  20. Spin transport in dangling-bond wires on doped H-passivated Si(100)

    International Nuclear Information System (INIS)

    Kepenekian, Mikaël; Robles, Roberto; Lorente, Nicolás; Rurali, Riccardo

    2014-01-01

    New advances in single-atom manipulation are leading to the creation of atomic structures on H-passivated Si surfaces with functionalities important for the development of atomic and molecular based technologies. We perform total-energy and electron-transport calculations to reveal the properties and understand the features of atomic wires crafted by H removal from the surface. The presence of dopants radically change the wire properties. Our calculations show that dopants have a tendency to approach the dangling-bond wires, and in these conditions, transport is enhanced and spin selective. These results have important implications in the development of atomic-scale spintronics showing that boron, and to a lesser extent phosphorous, convert the wires in high-quality spin filters. (paper)

  1. Comparison of subtransverse process wiring and sublaminar wiring in the treatment of idiopathic thoracic scoliosis.

    Science.gov (United States)

    Akmeşe, Ramazan; Kemal Us, Ali

    2013-04-01

    A retrospective study. The objectives of this study were to show the advantages of an alternative segmental spinal instrumentation technique, termed subtransverse process wiring, and compare it with a sublaminar wiring technique in the treatment of idiopathic thoracic scoliosis. High rates of neurological complications and the need for high experience limit the use of the sublaminar wiring technique, although it is an effective segmental spinal instrumentation technique in the treatment of scoliosis. This is the first study to correlate sublaminar wiring and subtransverse process wiring techniques clinically. In a retrospective study, 64 patients with idiopathic thoracic scoliosis were chosen randomly. Nineteen patients were treated with subtransverse process wires (group A), and 45 patients were treated with sublaminar wires (group B). The mean follow-up period was 50.9 months (25 to 90 mo) in group A and 57.9 months (26 to 108 mo) in group B. The average deformity correction was 26.5 degrees (52.9%) in group A and 28.9 degrees (54.1%) in group B. The average correction loss was 2.9 degrees (17.2%) in group A and 6.4 degrees (27%) in group B. None of the patients developed neurological complications in group A. In group B, 5 (11.1%) intraoperative dural tears, 4 (8.9%) neurological deficits, and 8 (14.4%) transient dysesthesia syndromes were seen. The average operation time was 3.6 hours (3 to 4 h) in group A and 4.9 hours (3.75 to 8 h) in group B. The average replacement of blood (erythrocyte suspension) was 2.9 U (2 to 5 U) in group A and 3.1 U (2 to 6 U) in group B. Sublaminar wiring is a time-consuming technique with high risks of neurological complications, whereas subtransverse process wiring is an easy and neurologically safe method, which maintains effective deformity correction and stability of the correction.

  2. Rectangular waveguide-to-coplanar waveguide transitions at U-band using e-plane probe and wire bonding

    DEFF Research Database (Denmark)

    Dong, Yunfeng; Johansen, Tom Keinicke; Zhurbenko, Vitaliy

    2016-01-01

    This paper presents rectangular waveguide-to-coplanar waveguide (CPW) transitions at U-band (40–60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguide......-to-CPW transitions using E-plane probe and wire bonding are designed. The proposed rectangular waveguide-to-CPW transition using wire bonding can provide 10 GHz bandwidth at U-band and does not require extra CPWs or connections between CPWs and chips. A single layer rectangular waveguide-to-CPW transition using E...

  3. Development of the Cylindrical Wire Electrical Discharge Machining Process.

    Energy Technology Data Exchange (ETDEWEB)

    McSpadden, SB

    2002-01-22

    Results of applying the wire Electrical Discharge Machining (EDM) process to generate precise cylindrical forms on hard, difficult-to-machine materials are presented. A precise, flexible, and corrosion-resistant underwater rotary spindle was designed and added to a conventional two-axis wire EDM machine to enable the generation of free-form cylindrical geometries. A detailed spindle error analysis identifies the major source of error at different frequency. The mathematical model for the material removal of cylindrical wire EDM process is derived. Experiments were conducted to explore the maximum material removal rate for cylindrical and 2D wire EDM of carbide and brass work-materials. Compared to the 2D wire EDM, higher maximum material removal rates may be achieved in the cylindrical wire EDM. This study also investigates the surface integrity and roundness of parts created by the cylindrical wire EDM process. For carbide parts, an arithmetic average surface roughness and roundness as low as 0.68 and 1.7 {micro}m, respectively, can be achieved. Surfaces of the cylindrical EDM parts were examined using Scanning Electron Microscopy (SEM) to identify the craters, sub-surface recast layers and heat-affected zones under various process parameters. This study has demonstrated that the cylindrical wire EDM process parameters can be adjusted to achieve either high material removal rate or good surface integrity.

  4. Solder extrusion pressure bonding process and bonded products produced thereby

    Science.gov (United States)

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  5. Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections

    DEFF Research Database (Denmark)

    Elisseeva, O. V.; Bruhn, A.; Cerezo, J.

    2013-01-01

    A gold-aluminium material combination is typically employed as an interconnection for microelectronic devices. One of the reliability risks of such devices is that of corrosion of aluminium bond pads resulting from the galvanic coupling between an aluminium bond pad and a gold wire. The research...... presented in this manuscript focuses on studying bond pad corrosion by selecting an appropriate model system and a dedicated set of electrochemical and analytical experimental tools. Taking into account the complex three-dimensional structure and the small dimensions of Au-Al interconnections (around 50......-100 μm), a dedicated and novel experimental approach was developed. Au-Al covered silicon chips were developed under clean room conditions. Three-dimensional electrodes were mimicked as flat, two-dimensional bond pad model systems, allowing the use of microelectrochemical local probe techniques. Thin...

  6. Multi responses optimization of wire EDM process parameters using ...

    African Journals Online (AJOL)

    The wire EDM was known as for its better efficiency to machining hardest material and give precise and accurate result comparing to other machining process. The intent of this experimental paper is to optimize the machining parameters of Wire Electrical Discharge Machining (WEDM) on En45A Alloy Steel with the ...

  7. Bond between smooth prestressing wires and concrete : finite element model and transfer length analysis for pretensioned concrete crossties.

    Science.gov (United States)

    2014-04-03

    Pretensioned concrete ties are increasingly employed in railroad high speed : and heavy haul applications. The bond between prestressing wires or strands and : concrete plays an important role in determining the transfer length of pretensioned : conc...

  8. Evaluation of bond strength and load deflection rate of multi-stranded fixed retainer wires: An In-Vitro Study

    Directory of Open Access Journals (Sweden)

    Renu Sarah Samson

    2018-01-01

    Full Text Available Background: Fixed orthodontic retainers must be well retained on the tooth surfaces, allow physiologic movement of teeth and exert minimal forces on the teeth to be retained. Previous studies analyzed the bond strength and amount of deflection caused due to the debonding force but not the magnitude of force needed for unit deformation. Aims: This study aims to evaluate and compare the bond strength and load deflection rate (LDR of three different fixed retainer wires. Materials and Methods: The wires were divided into three Groups: A – three-stranded twisted ligature wire, B – Bond-A-Braid (Reliance Orthodontics, and C – three-stranded twisted lingual retainer wire (3M Unitek. Twenty models were prepared for each group with a passive 15 mm long lingual retainer wire bonded to two lower incisors. An occlusogingival force was applied to the wire until it debonded. For LDR, three-point bending test was done at 0.5 mm deflection. These forces were measured using a Universal Instron Testing Machine. Statistical Analysis: Mean bond strength/LDR and pairwise comparisons were analyzed with one-way ANOVA and Tukey's honest significant difference post hoc test, respectively. Results: Group C exhibited the highest mean bond strength and LDR of 101.17N and 1.84N, respectively. The intergroup comparisons were all statistically significant. Conclusion: Compared to the other two wire types, Group C might be better retained on the teeth due to its higher bond strength. With its relatively higher LDR value, it may resist deformation from occlusal forces, thereby reducing inadvertent tooth movement and yet remain flexible enough to allow physiologic tooth movements.

  9. Process for producing fine and ultrafine filament superconductor wire

    Science.gov (United States)

    Kanithi, Hem C.

    1992-01-01

    A process for producing a superconductor wire made up of a large number of round monofilament rods is provided for, comprising assembling a multiplicity of round monofilaments inside each of a multiplicity of thin wall hexagonal tubes and then assembling a number of said thin wall hexagonal tubes within an extrusion can and subsequently consolidating, extruding and drawing the entire assembly down to the desired wire size.

  10. Evaluation of spinous process wiring techniques for accidental canal penetration.

    Science.gov (United States)

    Adeolu, Augustine A; Azeez, Abiodun L

    2013-04-01

    Accidental canal penetration with attendant complications constitutes one of the reasons for abandoning the use of wires for posterior spinal fusion techniques. However, there is dearth of information on this risk when the wire is introduced through the base of spinous process as against sublaminar passage. This study was designed to evaluate hardware-related postoperative complications, especially canal penetration, in our patients who had spinal process wiring in two types of posterior wiring techniques. Patients who had either of two spinous process wiring techniques formed the population for the study. The clinical records were reviewed and the following data were extracted: Age, sex, diagnosis, operation (fusion type), preoperative neurological status, postoperative neurologic deterioration, other postoperative complication and radiologic evidence of canal encroachment. One hundred and seventy four spinous processes were instrumented in 42 patients. The age of the patients ranged from 11 to 78 years while male to female ratio was 2.5:1. Majority of the spinal wiring were for trauma (29 patients; 69.0) while the remaining were tumor (6; 14.3%), degenerative diseases (4; 9.5%) and infections (3; 7.1%). The Rogers technique was performed in 16 (38.1%) patients while 26 (61.9%) underwent Adeolu et al. technique. One patient (2.3%) had neurologic deterioration while 5 patients (11.1%) had varying type of complications from wound infection to fracture of spinous processes. There was no patient with radiological or clinical evidence of canal compromise. Spinous process wiring techniques for posterior spinal stabilization appears to be safe as demonstrated in this study.

  11. Understanding the mechanism of nanoparticle formation in wire explosion process

    International Nuclear Information System (INIS)

    Bora, B.; Wong, C.S.; Bhuyan, H.; Lee, Y.S.; Yap, S.L.; Favre, M.

    2013-01-01

    The mechanism of nanoparticle formation by wire explosion process has been investigated by optical emission spectroscopy in Antony et al. 2010 [2] [J Quant Spectrosc Radiat Transfer 2010; 111:2509]. It was reported that the size of the nanoparticles formed in Ar ambience increases with increasing pressure, while an opposite trend was observed for the nanoparticles produced in N 2 and He ambiences. However, the physics behind this opposite trend seems unclear. In this work, we have investigated the probable mechanism behind the opposite trend in particle size with pressure of different gases and understand the mechanism of nanoparticle formation in wire explosion process. The experiment was carried out to investigate the effect of ambient gas species (Ar and N 2 ) and pressure on arc plasma formation and its corresponding effects on the characteristics of the produced nanoparticles in wire explosion process. Our results show that the arc plasma formation is probably the mechanism that may account for the opposite trend of particle size with pressure of different gases. -- Highlights: ► Cu nanoparticles have been synthesized by wire explosion technique. ► Investigate the effect of the ambient gas species and pressure. ► Arc plasma formation in wire explosion process is investigated. ► Arc plasma formation plays a crucial role in characteristic of the nanoparticles

  12. Separation Test Method for Investigation of Current Density Effects on Bond Wires of SiC Power MOSFET Modules

    DEFF Research Database (Denmark)

    Luo, Haoze; Iannuzzo, Francesco; Blaabjerg, Frede

    2017-01-01

    In this paper, a separation test method for eliminating the effects of different current densities on the bond wires is proposed. The separation test method makes it possible to study the effect of different current density on the fatigue damage of bond wires without changing the temperature swing...... and average temperature during the test. By analyzing the output characteristics of the linear region of MOSFET, the constraint relations among the gate voltage, on-state voltage drop and junction temperature are revealed in this paper. The one-to-one correspondence between gate voltage and conduction power...

  13. Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

    International Nuclear Information System (INIS)

    Xu, H.; Liu, C.; Silberschmidt, V.V.; Pramana, S.S.; White, T.J.; Chen, Z.; Acoff, V.L.

    2011-01-01

    Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 deg. C to 250 deg. C was investigated by high resolution transmission electron microscopy (HRTEM). The native aluminum oxide film (∼5 nm thick) of the Al pad migrates towards the Cu ball during annealing. The formation of intermetallic compounds (IMC) is controlled by Cu diffusion, where the kinetics obey a parabolic growth law until complete consumption of the Al pad. The activation energies to initiate crystallization of CuAl 2 and Cu 9 Al 4 are 60.66 kJ mol -1 and 75.61 kJ mol -1 , respectively. During IMC development, Cu 9 Al 4 emerges as a second layer and grows together with the initial CuAl 2 . When Al is completely consumed, CuAl 2 transforms to Cu 9 Al 4 , which is the terminal product. Unlike the excessive void growth in Au-Al bonds, only a few voids nucleate in Cu-Al bonds after long-term annealing at high temperatures (e.g., 250 o C for 25 h), and their diameters are usually in the range of tens of nanometers. This is due to the lower oxidation rate and volumetric shrinkage of Cu-Al IMC compared with Au-Al IMC.

  14. Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials.

    Science.gov (United States)

    Jongsma, Marije A; Pelser, Floris D H; van der Mei, Henny C; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J; Ren, Yijin

    2013-05-01

    Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on different wires used for bonded retainers and the susceptibility of in vitro biofilms to oral antimicrobials. Orthodontic wires were exposed to saliva, and in vitro biofilm formation was evaluated using plate counting and live/dead staining, together with effects of exposure to toothpaste slurry alone or followed by antimicrobial mouthrinse application. Wires were also placed intra-orally for 72 h in human volunteers and undisturbed biofilm formation was compared by plate counting and live/dead staining, as well as by denaturing gradient gel electrophoresis for compositional differences in biofilms. Single-strand wires attracted only slightly less biofilm in vitro than multi-strand wires. Biofilms on stainless steel single-strand wires however, were much more susceptible to antimicrobials from toothpaste slurries and mouthrinses than on single-strand gold wires and biofilms on multi-strand wires. Also, in vivo significantly less biofilm was found on single-strand than on multi-strand wires. Microbial composition of biofilms was more dependent on the volunteer involved than on wire type. Biofilms on single-strand stainless steel wires attract less biofilm in vitro and are more susceptible to antimicrobials than on multi-strand wires. Also in vivo, single-strand wires attract less biofilm than multi-strand ones. Use of single-strand wires is preferred over multi-strand wires, not because they attract less biofilm, but because biofilms on single-strand wires are not protected against antimicrobials as in crevices and niches as on multi-strand wires.

  15. Flux pinning in bronze-processed Nb3Sn wires

    International Nuclear Information System (INIS)

    Suenaga, M.; Welch, D.O.

    1980-01-01

    The scaling law derived by Kramer for magnetic flux pinning in high magnetic fields was examined for its applicability to the magnetic field dependence of critical-current densities in the bronze processed monofilamentary Nb 3 Sn wires. From this it was concluded that: (1) its prediction for the form of the dependence of critical current on magnetic field and grain size [/J vector /sub c/ x H vector/ approx. h/sup 1/2/(1-h) 2 (1-a 0 √rho) -2 ] was found to be very good in most cases including wires with very small Nb 3 Sn grains (approx. 400 A). It was found very useful in comparison of J/sub c/ for different wires and in extrapolating to obtain H/sub c2/ for these wires. (2) However, it could not account consistently for the anisotropy in critical current of a tape which was measured with H applied perpendicular and parallel to the tape face. (3) The values of kappa 1 which were determined with the scaling law were too small by a factor of 2 to 3, and the trend in the variation with heat-treating time was opposite to that which is reasonably to be expected. That the behavior of kappa 1 is thus seriously in contradiction with the expected behavior for Nb 3 Sn suggests basic faults in the derivation of the scaling equation for critical currents at high magnetic fields

  16. Process for Patterning Indium for Bump Bonding

    Science.gov (United States)

    Denis, Kevin

    2012-01-01

    An innovation was created for the Cosmology Large Angular Scale Surveyor for integration of low-temperature detector chips with a silicon backshort and a silicon photonic choke through flipchip bonding. Indium bumps are typically patterned using liftoff processes, which require thick resist. In some applications, it is necessary to locate the bumps close to high-aspect-ratio structures such as wafer through-holes. In those cases, liftoff processes are challenging, and require complicated and time-consuming spray coating technology if the high-aspect-ratio structures are delineated prior to the indium bump process. Alternatively, processing the indium bumps first is limited by compatibility of the indium with subsequent processing. The present invention allows for locating bumps arbitrarily close to multiple-level high-aspect-ratio structures, and for indium bumps to be formed without liftoff resist. The process uses the poor step coverage of indium deposited on a silicon wafer that has been previously etched to delineate the location of the indium bumps. The silicon pattern can be processed through standard lithography prior to adding the high-aspect-ratio structures. Typically, high-aspectratio structures require a thick resist layer so this layer can easily cover the silicon topography. For multiple levels of topography, the silicon can be easily conformally coated through standard processes. A blanket layer of indium is then deposited onto the full wafer; bump bonding only occurs at the high points of the topography.

  17. The processing of a practical oxide superconductor wire or tape

    International Nuclear Information System (INIS)

    Blaugher, R.D.

    1991-01-01

    There has been substantial progress in recent months in the realization of attractive current density in bulk oxide superconductors. Silver sheathed Bi oxide wire or tape has been produced in a number of laboratories with impressive current density exceeding 10 4 A/cm 2 at 4.2 K in magnetic fields as high as 30 T. This result easily eclipses the performance of conventional 4.2K conductors such as Nb-Ti and Nb 3 Sn, which presents a promise for using oxide conductors for high field magnets. At 77 K similar success have been achieved for Y-Ba-Cu-O bulk materials following various melt processing procedures with the observation of current density near 10 4 A/cm 2 at useful magnetic fields of 1-4 T. There is some question as to whether any of these materials can be formed in long lengths with sufficient mechanical strength and stability to allow operation at high fields in magnet applications. This paper reviews the current progress in producing oxide superconductor wire or tape and a prognosis as to when a practical oxide conductor is realized

  18. Use of beam deflection to control an electron beam wire deposition process

    Science.gov (United States)

    Taminger, Karen M. (Inventor); Hofmeister, William H. (Inventor); Hafley, Robert A. (Inventor)

    2013-01-01

    A method for controlling an electron beam process wherein a wire is melted and deposited on a substrate as a molten pool comprises generating the electron beam with a complex raster pattern, and directing the beam onto an outer surface of the wire to thereby control a location of the wire with respect to the molten pool. Directing the beam selectively heats the outer surface of the wire and maintains the position of the wire with respect to the molten pool. An apparatus for controlling an electron beam process includes a beam gun adapted for generating the electron beam, and a controller adapted for providing the electron beam with a complex raster pattern and for directing the electron beam onto an outer surface of the wire to control a location of the wire with respect to the molten pool.

  19. Efficacy of Esthetic Retainers: Clinical Comparison between Multistranded Wires and Direct-Bond Glass Fiber-Reinforced Composite Splints

    Directory of Open Access Journals (Sweden)

    Andrea Scribante

    2011-01-01

    Full Text Available The purpose of this longitudinal prospective randomized study was to evaluate the reliability of two different types of orthodontic retainers in clinical use: a multistrand stainless steel wire and a polyethylene ribbon-reinforced resin composite. Moreover the level of satisfaction of the patient about the esthetic result was also analyzed by means of a Visual Analogue Scale (VAS. 34 patients (9 boys and 25 girls, mean age 14.3, in the finishing phase of orthodontic treatment, were selected for the study. Since splints were applied the number, cause, and date of splint failures were recorded for each single tooth over 12 months. Statistical analysis was performed using a paired -test, Kaplan Meier survival estimates, and the log-rank test. Kruskal Wallis test was performed to analyze VAS recordings. Differences between the bond failure rates were not statistically significant. Esthetic result of VAS was significantly higher for polyethylene ribbon-reinforced resin retainers than for stainless steel wires.

  20. Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials

    NARCIS (Netherlands)

    Jongsma, Marije A.; Pelser, Floris D. H.; van der Mei, Henny C.; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J.; Ren, Yijin

    OBJECTIVE: Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on

  1. Prediction of Bond Wire Fatigue of IGBTs in a PV Inverter Under a Long-Term Operation

    DEFF Research Database (Denmark)

    Reigosa, Paula Diaz; Wang, Huai; Yang, Yongheng

    2016-01-01

    consumption is estimated based on a long-term annual stress profile of solar irradiance and ambient temperature. The proposed method enables a more realistic lifetime prediction with a specified confidence level compared to the state-of-the-art approaches. A study case of IGBT modules in a 10 kW three...... consumption of bond wires of IGBT modules in a Photovoltaic (PV) inverter. The variations in IGBT parameters (e.g., on-state collector-emitter voltage), lifetime models, and environmental and operational stresses are taken into account in the lifetime prediction. The distribution of the annual lifetime...

  2. Process water reduction in a wire milling operation. 1989 summer intern report

    Energy Technology Data Exchange (ETDEWEB)

    Alberg, J.

    1989-12-31

    Johnson Filtration Systems is a company located in New Brighton, Minnesota which employs 256 people. The focus of the project was to reduce the water usage of the wire milling operation. Water in the milling process is used to clean the wire and cool the mill components. Total annual water usage for this operation is six million gallons. The milling process changes the cross sectional shape of the wire by using flattening hammers and rollers. A synthetic coolant is used to enhance this process and remove heat. The coolant is removed from the wire as it is pulled through a squeegee, washed it with water and dried with an air knife.

  3. Prediction of multi performance characteristics of wire EDM process using grey ANFIS

    Science.gov (United States)

    Kumanan, Somasundaram; Nair, Anish

    2017-09-01

    Super alloys are used to fabricate components in ultra-supercritical power plants. These hard to machine materials are processed using non-traditional machining methods like Wire cut electrical discharge machining and needs attention. This paper details about multi performance optimization of wire EDM process using Grey ANFIS. Experiments are designed to establish the performance characteristics of wire EDM such as surface roughness, material removal rate, wire wear rate and geometric tolerances. The control parameters are pulse on time, pulse off time, current, voltage, flushing pressure, wire tension, table feed and wire speed. Grey relational analysis is employed to optimise the multi objectives. Analysis of variance of the grey grades is used to identify the critical parameters. A regression model is developed and used to generate datasets for the training of proposed adaptive neuro fuzzy inference system. The developed prediction model is tested for its prediction ability.

  4. Influence of Wire Electrical Discharge Machining (WEDM) process parameters on surface roughness

    Science.gov (United States)

    Yeakub Ali, Mohammad; Banu, Asfana; Abu Bakar, Mazilah

    2018-01-01

    In obtaining the best quality of engineering components, the quality of machined parts surface plays an important role. It improves the fatigue strength, wear resistance, and corrosion of workpiece. This paper investigates the effects of wire electrical discharge machining (WEDM) process parameters on surface roughness of stainless steel using distilled water as dielectric fluid and brass wire as tool electrode. The parameters selected are voltage open, wire speed, wire tension, voltage gap, and off time. Empirical model was developed for the estimation of surface roughness. The analysis revealed that off time has a major influence on surface roughness. The optimum machining parameters for minimum surface roughness were found to be at a 10 V open voltage, 2.84 μs off time, 12 m/min wire speed, 6.3 N wire tension, and 54.91 V voltage gap.

  5. 77 FR 10621 - Changes to the In-Bond Process

    Science.gov (United States)

    2012-02-22

    ... Process; Proposed Rule #0;#0;Federal Register / Vol. 77, No. 35 / Wednesday, February 22, 2012 / Proposed... [USCBP-2012-0002] RIN 1515-AD81 Changes to the In-Bond Process AGENCY: U.S. Customs and Border Protection... in-bond. This process allows imported merchandise to be entered at one U.S. port of entry without...

  6. Multifilamentary MgB2 wires fracture behavior during the drawing process

    International Nuclear Information System (INIS)

    Shan, D.; Yan, G.; Zhou, L.; Li, J.S.; Li, C.S.; Wang, Q.Y.; Xiong, X.M.; Jiao, G.F.

    2012-01-01

    The fracture behavior of 6 + 1 filamentary MgB 2 superconductive wires is presented here. The composite wires were fabricated by in situ Powder-in-Tube method using Nb as a barrier and copper as a stabilizer. The microstructure of the material has a great influence on its fracture behavior. The microstructural aspects of crack nucleation and propagation are discussed. It shows that there are complicated correlations between fracture behavior and the main influencing parameters, which contain specific drawing conditions (drawing velocity, reduction in area per pass), materials properties (strength, yield stress, microstructure) as well as the extent of bonding between the metal sheaths at their interface.

  7. Efficacy of Esthetic Retainers: Clinical Comparison between Multistranded Wires and Direct-Bond Glass Fiber-Reinforced Composite Splints

    Science.gov (United States)

    Scribante, Andrea; Sfondrini, Maria Francesca; Broggini, Simona; D'Allocco, Marina; Gandini, Paola

    2011-01-01

    The purpose of this longitudinal prospective randomized study was to evaluate the reliability of two different types of orthodontic retainers in clinical use: a multistrand stainless steel wire and a polyethylene ribbon-reinforced resin composite. Moreover the level of satisfaction of the patient about the esthetic result was also analyzed by means of a Visual Analogue Scale (VAS). 34 patients (9 boys and 25 girls, mean age 14.3), in the finishing phase of orthodontic treatment, were selected for the study. Since splints were applied the number, cause, and date of splint failures were recorded for each single tooth over 12 months. Statistical analysis was performed using a paired t-test, Kaplan Meier survival estimates, and the log-rank test. Kruskal Wallis test was performed to analyze VAS recordings. Differences between the bond failure rates were not statistically significant. Esthetic result of VAS was significantly higher for polyethylene ribbon-reinforced resin retainers than for stainless steel wires. PMID:22114597

  8. Development of laser bonding as a manufacturing process for inner-lead bonding

    Science.gov (United States)

    Hayward, James D.

    1991-12-01

    The conventional thermo-compression bonding processes for bonding tape-automated-bonding (TAB) leadframes to silicon die has inherent reliability drawbacks due to the high pressures and temperatures necessary to produce a good metallurgical joint. Whether tin- or gold-plated tape is used, the bonding process can cause damage to the underlying structure of the device which results in device failures. The use of a laser source for inner lead bonding (ILB) has the advantage of providing a very localized temperature input to the bonding site with minimal contact force. The resulting mechanical stresses on the device are consequently low and the overall temperature extreme to which the device is subjected is similarly low. Advanced Micro Devices, Inc., has undertaken a program to qualify a gold/tin laser bonded ILB process as a viable manufacturing alternative to thermo-compression bonding. The initial evaluation has defined thresholds for laser input energy necessary to produce a good fillet around the TAB beam and a void-free interface. This is the first necessary step to provide the degree of gold/tin alloying necessary to prevent Kirkendall voiding during subsequent high temperature storage. Among the parameters critical to the bonding process is the wafer bump surface topography. The quality of the bonding process has been monitored using bond strength data and visual examination before and after high temperature storage and temperature cycling tests. The test samples used were 154 and 160 lead production TAB tape and device designs with approximately equals 200 (mu) lead pitch and a 410 lead experimental tape with 102 (mu) lead pitch.

  9. Hydrogenated Nanocrystalline Silicon Thin Films Prepared by Hot-Wire Method with Varied Process Pressure

    Directory of Open Access Journals (Sweden)

    V. S. Waman

    2011-01-01

    Full Text Available Hydrogenated nanocrystalline silicon films were prepared by hot-wire method at low substrate temperature (200∘C without hydrogen dilution of silane (SiH4. A variety of techniques, including Raman spectroscopy, low angle X-ray diffraction (XRD, Fourier transform infrared (FTIR spectroscopy, atomic force microscopy (AFM, and UV-visible (UV-Vis spectroscopy, were used to characterize these films for structural and optical properties. Films are grown at reasonably high deposition rates (>15 Å/s, which are very much appreciated for the fabrication of cost effective devices. Different crystalline fractions (from 2.5% to 63% and crystallite size (3.6–6.0 nm can be achieved by controlling the process pressure. It is observed that with increase in process pressure, the hydrogen bonding in the films shifts from Si–H to Si–H2 and (Si–H2n complexes. The band gaps of the films are found in the range 1.83–2.11 eV, whereas the hydrogen content remains <9 at.% over the entire range of process pressure studied. The ease of depositing films with tunable band gap is useful for fabrication of tandem solar cells. A correlation between structural and optical properties has been found and discussed in detail.

  10. Reduction of tensile residual stresses during the drawing process of tungsten wires

    International Nuclear Information System (INIS)

    Rodriguez Ripoll, Manel; Weygand, Sabine M.; Riedel, Hermann

    2010-01-01

    Tungsten wires are commonly used in the lighting industry as filaments for lamps. During the drawing process, the inhomogeneous deformation imparted by the drawing die causes tensile residual stresses at the wire surface in circumferential direction. These stresses have a detrimental effect for the wire because they are responsible for driving longitudinal cracks, known as splits. This work proposes two methods for reducing the residual stresses during wire drawing, namely applying an advanced die geometry and performing an inexpensive post-drawing treatment based on targeted bending operations. These two methods are analyzed with finite element simulations using material parameters obtained by mechanical tests on tungsten wires at different temperatures as input data. The computed results predict a substantial reduction of the circumferential residual stresses, thus reducing the risk of splitting.

  11. ECAE-processed Cu-Nb and Cu-Ag nanocomposite wires for pulse magnet applications

    International Nuclear Information System (INIS)

    Edgecumbe Summers, T.S.; Walsh, R.P.; Pernambuco-Wise, P.

    1997-01-01

    Cu-Nb and Cu-Ag nanocomposites have recently become of interest to pulse magnet designers because of their unusual combination of high strength with reasonable conductivity. In the as-cast condition, these conductors consist of two phases, one of almost pure Nb (or Ag) and the other almost pure Cu. When these castings are cold worked as in a wire-drawing operation for example, the two phases are drawn into very fine filaments which produce considerable strengthening without an unacceptable decrease in conductivity. Unfortunately, any increase in strength with operations such as wire drawing is accompanied by a reduction in the cross section of the billet, and thus far, no wires with strengths on the order of 1.5 GPa or more have been produced with cross sections large enough to be useful in magnet applications. Equal Channel Angular Extrusion (ECAE) is an innovative technique which allows for the refinement of the as-cast ingot structure without a reduction in the cross sectional dimensions. Samples processed by the ECAE technique prior to wire drawing should be stronger at a given wire diameter than those processed by wire drawing alone. The tensile properties of wire-drawn Cu-18%Nb and Cu-25%Ag both with and without prior ECAE processing were tested and compared at both room temperature and 77K. All samples were found to have resistivities consistent with their strengths, and the strengths of the ECAE-processed wires were significantly higher than their as-cast and drawn counterparts. Therefore, with ECAE processing prior to wire drawing, it appears to be possible to make high-strength conductors with adequately large cross sections for pulse magnets

  12. Advanced Process Possibilities in Friction Crush Welding of Aluminum, Steel, and Copper by Using an Additional Wire

    Science.gov (United States)

    Besler, Florian A.; Grant, Richard J.; Schindele, Paul; Stegmüller, Michael J. R.

    2017-12-01

    Joining sheet metal can be problematic using traditional friction welding techniques. Friction crush welding (FCW) offers a high speed process which requires a simple edge preparation and can be applied to out-of-plane geometries. In this work, an implementation of FCW was employed using an additional wire to weld sheets of EN AW5754 H22, DC01, and Cu-DHP. The joint is formed by bringing together two sheet metal parts, introducing a wire into the weld zone and employing a rotating disk which is subject to an external force. The requirements of the welding preparation and the fundamental process variables are shown. Thermal measurements were taken which give evidence about the maximum temperature in the welding center and the temperature in the periphery of the sheet metals being joined. The high welding speed along with a relatively low heat input results in a minimal distortion of the sheet metal and marginal metallurgical changes in the parent material. In the steel specimens, this FCW implementation produces a fine grain microstructure, enhancing mechanical properties in the region of the weld. Aluminum and copper produced mean bond strengths of 77 and 69 pct to that of the parent material, respectively, whilst the steel demonstrated a strength of 98 pct. Using a wire offers the opportunity to use a higher-alloyed additional material and to precisely adjust the additional material volume appropriate for a given material alignment and thickness.

  13. Breakdown processes in wire chambers, prevention and rate capability

    International Nuclear Information System (INIS)

    Atac, M.

    1983-01-01

    Breakdowns were optically and electronically observed in drift tubes and drift chambers. They occur at a critical gain for given intensity in a gas mixture when ultraviolet photons are not completely quenched. It was observed that the breakdowns depended critically on average current for a given gas mixture independent of the size of the drift tubes used. Using 4.6% ethyl alcohol vapor mixed into 50/50 argon ethane gas, breakdown are eliminated up to 7 /sub μ/A average current drawn by pulses on a 1 cm section of an anode wire under an intense source. Pulses with an avalanche size of 10 6 electron rates above 10 6 pulses per centimeter per wire may be obtained with the elimination of breakdowns

  14. Study Of The Wet Multipass Drawing Process Applied On High Strength Thin Steel Wires

    Science.gov (United States)

    Thimont, J.; Felder, E.; Bobadilla, C.; Buessler, P.; Persem, N.; Vaubourg, JP.

    2011-05-01

    Many kinds of high strength thin steel wires are involved in so many applications. Most of the time, these wires are made of a pearlitic steel grade. The current developments mainly concern the wire last drawing operation: after a patenting treatment several reduction passes are performed on a slip-type multipass drawing machine. This paper focuses on modeling this multipass drawing process: a constitutive law based on the wire microstructure evolutions is created, a mechanical study is performed, a set of experiments which enables determining the process friction coefficients is suggested and finally the related analytical model is introduced. This model provides several general results about the process and can be used in order to set the drawing machines.

  15. Process for Nondestructive Evaluation of the Quality of a Crimped Wire Connector

    Science.gov (United States)

    Yost, William T. (Inventor); Cramer, Karl E. (Inventor); Perey, Daniel F. (Inventor); Williams, Keith A. (Inventor)

    2014-01-01

    A process and apparatus for collecting data for nondestructive evaluation of the quality of a crimped wire connector are provided. The process involves providing a crimping tool having an anvil and opposing jaw for crimping a terminal onto a stranded wire, moving the jaw relative to the anvil to close the distance between the jaw and the anvil and thereby compress the terminal against the wire, while transmitting ultrasonic waves that are propagated through the terminal-wire combination and received at a receiving ultrasonic transducer as the jaw is moved relative to the anvil, and detecting and recording the position of the jaw relative to the anvil as a function of time and detecting and recording the amplitude of the ultrasonic wave that is received at the receiving ultrasonic transducer as a function of time as the jaw is moved relative to the anvil.

  16. Studies of implosion processes of nested tungsten wire-array Z-pinch

    International Nuclear Information System (INIS)

    Ning Cheng; Ding Ning; Liu Quan; Yang Zhenhua

    2006-01-01

    Nested wire-array is a kind of promising structured-load because it can improve the quality of Z-pinch plasma and enhance the radiation power of X-ray source. Based on the zero-dimensional model, the assumption of wire-array collision, and the criterion of optimized load (maximal load kinetic energy), optimization of the typical nested wire-array as a load of Z machine at Sandia Laboratory was carried out. It was shown that the load has been basically optimized. The Z-pinch process of the typical load was numerically studied by means of one-dimensional three-temperature radiation magneto-hydrodynamics (RMHD) code. The obtained results reproduce the dynamic process of the Z-pinch and show the implosion trajectory of nested wire-array and the transfer process of drive current between the inner and outer array. The experimental and computational X-ray pulse was compared, and it was suggested that the assumption of wire-array collision was reasonable in nested wire-array Z-pinch at least for the current level of Z machine. (authors)

  17. Low-cost bump-bonding processes for high energy physics pixel detectors

    CERN Document Server

    AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

    2016-01-01

    In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

  18. On the use of OSL of wire-bond chip card modules for retrospective and accident dosimetry

    Energy Technology Data Exchange (ETDEWEB)

    Woda, Clemens [Helmholtz Zentrum Muenchen - German Research Centre for Environmental Health, Institute of Radiation Protection, Ingolstaedter Landstrasse 1, D-85764 Neuherberg (Germany)], E-mail: clemens.woda@helmholtz-muenchen.de; Spoettl, Thomas [Infineon Technologies AG, Wernerwerkstrasse 1, D-93049 Regensburg (Germany)

    2009-05-15

    The potential of optically stimulated luminescence of wire-bond chip card modules, used in health insurance, ID, cash and credit cards for retrospective and accident dosimetry is investigated. Chip card modules obtained directly from the producer, using a widely spread UV-cured epoxy product for encapsulation, are used as basis for the study. The radiation sensitivity is due to silica grains added to the epoxy for controlling the thixotropic properties. Luminescence properties are complex due to the presumed thermo-optical release of electrons from the epoxy and transfer into the silica. Best results and highest sensitivity are obtained by using no or only low preheat treatments. A high degree of fading of the OSL signal during storage at room temperature is observed, which is tentatively explained by the superposition of thermal decay of shallow OSL traps and athermal (anomalous) decay of deeper OSL traps. The dose response of the OSL signal shows exponentially saturating behaviour, with saturation doses of 77 Gy or 9.6 Gy, depending on pretreatment. Dose recovery tests show that given doses can be recovered within a deviation of {+-}14%, if measured signals are corrected for fading. The minimum detectable dose is estimated at {approx}3 mGy, {approx}10 mGy and {approx}20 mGy for readouts immediately, 1 day and 10 days after exposure, respectively.

  19. The influence of multiscale heterogeneity on recrystallization in nickel processed by accumulative roll bonding

    DEFF Research Database (Denmark)

    Mishin, Oleg; Zhang, Yubin; Godfrey, A.

    2017-01-01

    with regions near the bonding interface, which are more refined and thus possess a higher stored energy than other regions. These regions also contain characteristic particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. The sample-scale heterogeneities...

  20. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

    CERN Multimedia

    Saba, A

    2006-01-01

    2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

  1. Two-Step Plasma Process for Cleaning Indium Bonding Bumps

    Science.gov (United States)

    Greer, Harold F.; Vasquez, Richard P.; Jones, Todd J.; Hoenk, Michael E.; Dickie, Matthew R.; Nikzad, Shouleh

    2009-01-01

    A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. The two-step plasma process makes it possible to remove surface indium oxide, without incurring the adverse effects of the acid etching process.

  2. An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

    Science.gov (United States)

    Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

    2011-12-01

    A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

  3. Novel magnetic wire fabrication process by way of nanoimprint lithography for current induced magnetization switching

    Directory of Open Access Journals (Sweden)

    Tsukasa Asari

    2017-05-01

    Full Text Available Nanoimprint lithography (NIL is an effective method to fabricate nanowire because it does not need expensive systems and this process is easier than conventional processes. In this letter, we report the Current Induced Magnetization Switching (CIMS in perpendicularly magnetized Tb-Co alloy nanowire fabricated by NIL. The CIMS in Tb-Co alloy wire was observed by using current pulse under in-plane external magnetic field (HL. We successfully observed the CIMS in Tb-Co wire fabricated by NIL. Additionally, we found that the critical current density (Jc for the CIMS in the Tb-Co wire fabricated by NIL is 4 times smaller than that fabricated by conventional lift-off process under HL = 200Oe. These results indicate that the NIL is effective method for the CIMS.

  4. Novel magnetic wire fabrication process by way of nanoimprint lithography for current induced magnetization switching

    Science.gov (United States)

    Asari, Tsukasa; Shibata, Ryosuke; Awano, Hiroyuki

    2017-05-01

    Nanoimprint lithography (NIL) is an effective method to fabricate nanowire because it does not need expensive systems and this process is easier than conventional processes. In this letter, we report the Current Induced Magnetization Switching (CIMS) in perpendicularly magnetized Tb-Co alloy nanowire fabricated by NIL. The CIMS in Tb-Co alloy wire was observed by using current pulse under in-plane external magnetic field (HL). We successfully observed the CIMS in Tb-Co wire fabricated by NIL. Additionally, we found that the critical current density (Jc) for the CIMS in the Tb-Co wire fabricated by NIL is 4 times smaller than that fabricated by conventional lift-off process under HL = 200Oe. These results indicate that the NIL is effective method for the CIMS.

  5. Analytical methods to characterize heterogeneous raw material for thermal spray process: cored wire Inconel 625

    Science.gov (United States)

    Lindner, T.; Bonebeau, S.; Drehmann, R.; Grund, T.; Pawlowski, L.; Lampke, T.

    2016-03-01

    In wire arc spraying, the raw material needs to exhibit sufficient formability and ductility in order to be processed. By using an electrically conductive, metallic sheath, it is also possible to handle non-conductive and/or brittle materials such as ceramics. In comparison to massive wire, a cored wire has a heterogeneous material distribution. Due to this fact and the complex thermodynamic processes during wire arc spraying, it is very difficult to predict the resulting chemical composition in the coating with sufficient accuracy. An Inconel 625 cored wire was used to investigate this issue. In a comparative study, the analytical results of the raw material were compared to arc sprayed coatings and droplets, which were remelted in an arc furnace under argon atmosphere. Energy-dispersive X-ray spectroscopy (EDX) and X-ray fluorescence (XRF) analysis were used to determine the chemical composition. The phase determination was performed by X-ray diffraction (XRD). The results were related to the manufacturer specifications and evaluated in respect to differences in the chemical composition. The comparison between the feedstock powder, the remelted droplets and the thermally sprayed coatings allows to evaluate the influence of the processing methods on the resulting chemical and phase composition.

  6. Modeling the wire-EDM process parameters for EN-8 carbon steel ...

    African Journals Online (AJOL)

    Accompanying the evolution of mechanical industry, the need for alloy materials and ceramics as well, having high toughness, hardness & impact resistance are also increasing. Wire-EDM process is a quick fix to this box. As this WEDM process is proficient in machining these materials meticulously, regardless to their ...

  7. Carbon Nanotube Bonding Strength Enhancement Using Metal "Wicking" Process

    Science.gov (United States)

    Lamb, James L.; Dickie, Matthew R.; Kowalczyk, Robert S.; Liao, Anna; Bronikowski, Michael J.

    2012-01-01

    Carbon nanotubes grown from a surface typically have poor bonding strength at the interface. A process has been developed for adding a metal coat to the surface of carbon nano tubes (CNTs) through a wicking process, which could lead to an enhanced bonding strength at the interface. This process involves merging CNTs with indium as a bump-bonding enhancement. Classical capillary theory would not normally allow materials that do not wet carbon or graphite to be drawn into the spacings by capillary action because the contact angle is greater than 90 degrees. However, capillary action can be induced through JPL's ability to fabricate oriented CNT bundles to desired spacings, and through the use of deposition techniques and temperature to control the size and mobility of the liquid metal streams and associated reservoirs. A reflow and plasma cleaning process has also been developed and demonstrated to remove indium oxide, and to obtain smooth coatings on the CNT bundles.

  8. Manufacturing Process Development to Produce Depleted Uranium Wire for EBAM Feedstock

    Energy Technology Data Exchange (ETDEWEB)

    Alexander, David John [Los Alamos National Laboratory; Clarke, Kester Diederik [Los Alamos National Laboratory; Coughlin, Daniel Robert [Los Alamos National Laboratory; Scott, Jeffrey E. [Los Alamos National Laboratory

    2015-06-30

    Wire produced from depleted uranium (DU) is needed as feedstock for the Electron-Beam Additive Manufacturing (EBAM) process. The goal is to produce long lengths of DU wire with round or rectangular cross section, nominally 1.5 mm (0.060 inches). It was found that rolling methods, rather than swaging or drawing, are preferable for production of intermediate quantities of DU wire. Trials with grooveless rolling have shown that it is suitable for initial reductions of large stock. Initial trials with grooved rolling have been successful, for certain materials. Modified square grooves (square round-bottom vee grooves) with 12.5 % reduction of area per pass have been selected for the reduction process.

  9. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  10. The Analysis of Force Parameters in Drawing Process of High Carbon Steel Wires in Conventional and Hydrodynamic Dies

    Directory of Open Access Journals (Sweden)

    Suliga M.

    2017-12-01

    Full Text Available The paper analyzes force parameters in the process of multistage drawing of steel wires in conventional and hydrodynamic dies. The drawing process of the wire rod with a diameter of 5.5 mm for wires with a diameter of 1.70 mm was performed in 12 drafts with the usage of the multistage drawbench Koch KGT with the speed range of 5-25 m/s.

  11. NUMERICAL SIMULATION OF RESIDUAL STRESSES GENERATED IN THE WIRE DRAWING PROCESS FOR DIFFERENT PROCESS PARAMETERS

    Directory of Open Access Journals (Sweden)

    Juliana Zottis

    2014-03-01

    Full Text Available The drawing process of steel bars is usually used to check better dimensional accuracy and mechanical properties to the material. In the other hand, the major concern found in manufacturing axes through this process is the appearance of distortion of shape. Such distortions are directly linked to the accumulation of residual stresses generated during the processes. As a result, this paper aims to study the influence of process parameters such as shape of puller, speed and lubrication used in wire drawing analyzing the accumulation of residual stress after the process. The stress analysis was performed by FEM being used two simulation software: Simufact.formingGP and DeformTM. Through these analyzes, it was found that the shape of how the bar is pulled causes a reduction of up to 100 MPa in residual stresses in the center of the bar, which represents an important factor in the study of the possible causes of the distortion. As well as factors speed and homogeneity of lubrication significantly altered the profile of residual stresses in the bar.

  12. Effects of filament size on critical current density in overpressure processed Bi-2212 round wire.

    Science.gov (United States)

    Jiang, Jianyi; Francis, Ashleigh; Alicea, Ryan; Matras, Maxime; Kametani, Fumitake; Trociewitz, Ulf P; Hellstrom, Eric E; Larbalestier, David C

    2017-06-01

    Bi 2 Sr 2 CaCu 2 O x (Bi-2212) conductor is the only high temperature superconductor manufactured as a round wire and is a very promising conductor for very high field applications. One of the key design parameters of Bi-2212 wire is its filament size, which has been previously reported to affect the critical current density ( J c ) and ac losses. Work with 1 bar heat treatment showed that the optimal filament diameter was about 15 μm but it was not well understood at that time that gas bubbles were the main current limiting mechanism. Here we investigated a recent Bi-2212 wire with a 121×18 filament architecture with varying wire diameter (1.0 to 1.5 mm) using 50 bar overpressure processing. This wire is part of a 1.2 km piece length of 1.0 mm diameter made by Oxford Superconducting Technology. We found that J c is independent of the filament size in the range from 9 to 14 μm, although the n value increased with increasing filament size. A new record J c (4.2 K, 15 T) of 4200 A/mm 2 and J E (4.2 K, 15 T) of 830 A/mm 2 were achieved.

  13. Development of Powder-in-Tube Processed Iron Pnictide Wires and Tapes

    KAUST Repository

    Ma, Yanwei

    2011-06-01

    The development of PIT fabrication process of iron pnictide superconducting wires and tapes has been reviewed. Silver was found to be the best sheath material, since no reaction layer was observed between the silver sheath and the superconducting core. The grain connectivity of iron pnictide wires and tapes has been markedly improved by employing Ag or Pb as dopants. At present, critical current densities in excess of 3750 A /cm 2 (I c = 37.5 A) at 4.2 K have been achieved in Ag-sheathed SrKFeAs wires prepared with the above techniques, which is the highest value obtained in iron-based wires and tapes so far. Moreover, Ag-sheathed Sm-1111 superconducting tapes were successfully prepared by PIT method at temperatures as low as ̃ 900 °C, instead of commonly used temperatures of ̃ 1200 °C. These results demonstrate the feasibility of producing superconducting pnictide composite wires, even grain boundary properties require much more attention. © 2010 IEEE.

  14. Composite superconducting MgB2 wires made by continuous process

    NARCIS (Netherlands)

    Kutukcu, Mehmet; Atamert, Serdar; Scandella, Jean Louis; Hopstock, Ron; Blackwood, Alexander C.; Dhulst, Chris; Mestdagh, Jan; Nijhuis, Arend; Glowacki, Bartek A.

    2018-01-01

    Previously developed manufacturing technology of a low-cost composite single core MgB2 superconductive wires has been investigated in details using monel sheath and titanium diffusion barrier. In this process Mg and nano-sized B as well as SiC dopant powders were fed continuously to a "U" shaped

  15. Understanding metallic bonding: Structure, process and interaction by Rasch analysis

    Science.gov (United States)

    Cheng, Maurice M. W.; Oon, Pey-Tee

    2016-08-01

    This paper reports the results of a survey of 3006 Year 10-12 students on their understandings of metallic bonding. The instrument was developed based on Chi's ontological categories of scientific concepts and students' understanding of metallic bonding as reported in the literature. The instrument has two parts. Part one probed into students' understanding of metallic bonding as (a) a submicro structure of metals, (b) a process in which individual metal atoms lose their outermost shell electrons to form a 'sea of electrons' and octet metal cations or (c) an all-directional electrostatic force between delocalized electrons and metal cations, that is, an interaction. Part two assessed students' explanation of malleability of metals, for example (a) as a submicro structural rearrangement of metal atoms/cations or (b) based on all-directional electrostatic force. The instrument was validated by the Rasch Model. Psychometric assessment showed that the instrument possessed reasonably good properties of measurement. Results revealed that it was reliable and valid for measuring students' understanding of metallic bonding. Analysis revealed that the structure, process and interaction understandings were unidimensional and in an increasing order of difficulty. Implications for the teaching of metallic bonding, particular through the use of diagrams, critiques and model-based learning, are discussed.

  16. Investigation about the Chrome Steel Wire Arc Spray Process and the Resulting Coating Properties

    Science.gov (United States)

    Wilden, J.; Bergmann, J. P.; Jahn, S.; Knapp, S.; van Rodijnen, F.; Fischer, G.

    2007-12-01

    Nowadays, wire-arc spraying of chromium steel has gained an important market share for corrosion and wear protection applications. However, detailed studies are the basis for further process optimization. In order to optimize the process parameters and to evaluate the effects of the spray parameters DoE-based experiments had been carried out with high-speed camera shoots. In this article, the effects of spray current, voltage, and atomizing gas pressure on the particle jet properties, mean particle velocity and mean particle temperature and plume width on X46Cr13 wire are presented using an online process monitoring device. Moreover, the properties of the coatings concerning the morphology, composition and phase formation were subject of the investigations using SEM, EDX, and XRD-analysis. These deep investigations allow a defined verification of the influence of process parameters on spray plume and coating properties and are the basis for further process optimization.

  17. Multi responses optimization of wire EDM process parameters using ...

    African Journals Online (AJOL)

    1,2 Department of Mechanical Engineering, Madhav Institute of Technology & Science Gwalior (M.P.), 474005 INDIA. Corresponding ... process of operation for IC engine, with the help grey relational analysis coupled with principal component analysis. Gopalsamy et al. ... Paul and Sumam (2012) this research paper they ...

  18. Olecranon Process Fracture in a Radial Club Hand Treated with Tension Band Wiring: A Case Report.

    Science.gov (United States)

    Biradar, Ramanagouda; Pillai, Arravind; Shetty, Ullas

    2016-01-01

    Radial club hand is rare deformity, and many patients do not receive treatment due to lack of awareness. None of the treatment options available can restore normality. Fractures of the olecranon process in radial club hand are rare probably due to limited use of the limb. We report the case of a 35-year-old male with radial club hand who presented with a transverse fracture of the olecranon process. The patient underwent open reduction and tension band wiring for the fracture. At 6 months follow-up, the fracture had united and the patient had a complete functional recovery. Tension band wiring is an excellent option for treating olecranon fractures in patients with radial club hand despite the deformity and the absence of radius.

  19. Arc Interference Behavior during Twin Wire Gas Metal Arc Welding Process

    Directory of Open Access Journals (Sweden)

    Dingjian Ye

    2013-01-01

    Full Text Available In order to study arc interference behavior during twin wire gas metal arc welding process, the synchronous acquisition system has been established to acquire instantaneous information of arc profile including dynamic arc length variation as well as relative voltage and current signals. The results show that after trailing arc (T-arc is added to the middle arc (M-arc in a stable welding process, the current of M arc remains unchanged while the agitation increases; the voltage of M arc has an obvious increase; the shape of M arc changes, with increasing width, length, and area; the transfer frequency of M arc droplet increases and the droplet itself becomes smaller. The wire extension length of twin arc turns out to be shorter than that of single arc welding.

  20. Effect of machining fluid on the process performance of wire electrical discharge machining of nanocomposite ceramic

    Directory of Open Access Journals (Sweden)

    Zhang Chengmao

    2015-01-01

    Full Text Available Wire electric discharge machining (WEDM promise to be effective and economical techniques for the production of tools and parts from conducting ceramic blanks. However, the manufacturing of nanocomposite ceramics blanks with these processes is a long and costly process. This paper presents a new process of machining nanocomposite ceramics using WEDM. WEDM uses water based emulsion, polyvinyl alcohol and distilled water as the machining fluid. Machining fluid is a primary factor that affects the material removal rate and surface quality of WEDM. The effects of emulsion concentration, polyvinyl alcohol concentration and distilled water of the machining fluid on the process performance have been investigated.

  1. THE USE OF EXCHANGEABLE BONDS DURING THE PRIVATIZATION PROCESS

    Directory of Open Access Journals (Sweden)

    Damian Kaźmierczak

    2014-04-01

    Full Text Available In our article we present the use of hybrid securities in the privatization process. We show that exchangeable bonds may be successfully applied during privatization of state companies throughout the world. It may be profitable for many reasons. Firstly, the exchangeables offer a much lower coupon in comparison with the ordinary government bonds which may be crucial for highly indebted countries. Secondly, throughout the entire maturity period the state remains the owner of the privatized firm which means that the government can be a beneficiary of high dividends paid by the public enterprises and can actively manage them. Thirdly, in the case of unfavorable market conditions the authorities get an opportunity to wait for the end of economic turmoil in order to avoid selling the equity participations under their true value. Finally, the issue of certain types of exchangeables (e.g. callable exchangeables or mandatory exchangeables and adding several provisions (e.g. greenshoe option or clean-up call makes the instrument more flexible for the issuer. We also present a few examples of the privatization processes by means of exchangeable bonds i.a. in Germany and in Austria. Most of such operations, e.g. German Deutsche Post, Austrian Telekom Austria or Portuguese Galp Energia SGPS S.A. were completed with success.

  2. Optimisation of wire-cut EDM process parameter by Grey-based response surface methodology

    Science.gov (United States)

    Kumar, Amit; Soota, Tarun; Kumar, Jitendra

    2018-03-01

    Wire electric discharge machining (WEDM) is one of the advanced machining processes. Response surface methodology coupled with Grey relation analysis method has been proposed and used to optimise the machining parameters of WEDM. A face centred cubic design is used for conducting experiments on high speed steel (HSS) M2 grade workpiece material. The regression model of significant factors such as pulse-on time, pulse-off time, peak current, and wire feed is considered for optimising the responses variables material removal rate (MRR), surface roughness and Kerf width. The optimal condition of the machining parameter was obtained using the Grey relation grade. ANOVA is applied to determine significance of the input parameters for optimising the Grey relation grade.

  3. Influence of Thermal Boundary Effects on the Process of Creating Recovery Stresses in a SMA Wire Activated by Joule Heating

    Science.gov (United States)

    Debska, Aleksandra; Balandraud, Xavier; Destrebecq, Jean-François; Gwozdziewicz, Piotr; Seruga, Andrzej

    2017-07-01

    The study deals with the influence of thermal boundary effects on the process of creating recovery stresses in a SMA wire activated by Joule heating, during a thermal cycle (up to the return to ambient temperature). First, a thermal characterization is performed using infrared thermography for temperature profile measurements along the wire in a steady-state regime. Second, recovery stress tests are performed using a uniaxial testing machine. Finally, tests are analyzed using a thermomechanical model, taking the inhomogeneous temperature distribution along the wire into account. The influence of the initial distribution of martensite (before thermal activation of the memory effect) is discussed, as well as the influence of the wire length. It is shown that the thermal boundary effects at the contact with the grips of the testing machine significantly influence the response of the wire. For instance, during the heating of the wire, an austenite-to-martensite transformation may occur in the zones near the wire ends (where the temperature remains close to ambient) due to the increased stress. A length of influence of the thermal boundary effects on the overall wire response is defined, and a condition to neglect this influence is proposed. The study highlights the importance of taking thermal boundary effects into account for practical applications of SMAs based on Joule heating.

  4. Investigation of the degradation mechanism of catalytic wires during oxidation of ammonia process

    Energy Technology Data Exchange (ETDEWEB)

    Pura, Jarosław, E-mail: jaroslawpura@gmail.com [Faculty of Material Science and Engineering, Warsaw University of Technology, Wołoska 141, 02-507 Warsaw (Poland); Wieciński, Piotr; Kwaśniak, Piotr; Zwolińska, Marta; Garbacz, Halina; Zdunek, Joanna [Faculty of Material Science and Engineering, Warsaw University of Technology, Wołoska 141, 02-507 Warsaw (Poland); Laskowski, Zbigniew; Gierej, Maciej [Precious Metal Mint, Weteranów 95, 05-250 Radzymin (Poland)

    2016-12-01

    Highlights: • Degradation mechanisms of precious metal catalytic gauzes is proposed. • Significant change of gauzes morphology and chemical composition was observed. • Samples were analyzed using SEM, EDS and micro-XCT techniques. - Abstract: The most common catalysts for the ammonia oxidation process are 80 μm diameter platinum-rhodium wires knitted or woven into the form of a gauze. In an aggressive environment and under extreme conditions (temperature 800–900 °C, intensive gas flow, high pressure) precious elements are drained from the surface of the wires. Part of this separated material quickly decomposes on the surface in the form of characteristic “cauliflower-shape protrusions”. The rest of the platinum is captured by palladium-nickel catalytic-capture gauzes located beneath. In our investigation we focused on the effects of the degradation of gauzes from one industrial catalytic system. The aim of the study was to compare the degree and the mechanism of degradation of gauzes from a different part of the reactor. The study covered PtRh7 catalytic and PdNi5 catalytic-capture gauzes. X-ray computer microtomography investigation revealed that despite strong differences in morphology, each Pt-Rh wire has a similar specific surface area. This indicates that the oxidation process and morphological changes of the wires occur in a self-regulating balance, resulting in the value of the specific surface area of the catalyst. Microtomography analysis of Pd-Ni wires revealed strong redevelopment of the wires’ surface, which is related to the platinum capture phenomenon. Scanning electron microscope observations also revealed the nanostructure in the cauliflower-shape protrusions and large grains in the wires’ preserved cores. The high temperature in the reactor and the long-term nature of the process do not favor the occurrence of the nanostructure in this type of material. Further and detailed analysis of this phenomena will provide a better

  5. Influence of the Manufacturing Process on Defects in the Galvanized Coating of High Carbon Steel Wires.

    Science.gov (United States)

    Gelfi, Marcello; Solazzi, Luigi; Poli, Sandro

    2017-03-06

    This study is a detailed failure analysis of galvanized high carbon steel wires, which developed coating cracks during the torsion test performed as a quality control at the end of the manufacturing process. Careful visual inspections showed that the cracks are already present in the coating before the torsion test. In order to explain the origin of these cracks, systematic metallographic investigations were performed by means of optical and scanning electron microscope on both the wires and the rods that have been cold drawn to produce the wire. The chemical composition of the galvanized coatings was evaluated by means of energy dispersive spectroscopy. Micro bidimensional X-ray diffraction experiments were also performed to measure the residual stresses in the galvanized coating. The results showed that the failure is related to two main factors: the relatively high content of silicon in the steel and the unsuitable cooling rate of the rods at the exit from the galvanizing bath. The mechanism proposed to explain the origin of the defects was supported by Finite Elements Methods simulations and verified with in-plant tests. The proper countermeasures were then applied and the problem successfully solved.

  6. Influence of the Manufacturing Process on Defects in the Galvanized Coating of High Carbon Steel Wires

    Directory of Open Access Journals (Sweden)

    Marcello Gelfi

    2017-03-01

    Full Text Available This study is a detailed failure analysis of galvanized high carbon steel wires, which developed coating cracks during the torsion test performed as a quality control at the end of the manufacturing process. Careful visual inspections showed that the cracks are already present in the coating before the torsion test. In order to explain the origin of these cracks, systematic metallographic investigations were performed by means of optical and scanning electron microscope on both the wires and the rods that have been cold drawn to produce the wire. The chemical composition of the galvanized coatings was evaluated by means of energy dispersive spectroscopy. Micro bidimensional X-ray diffraction experiments were also performed to measure the residual stresses in the galvanized coating. The results showed that the failure is related to two main factors: the relatively high content of silicon in the steel and the unsuitable cooling rate of the rods at the exit from the galvanizing bath. The mechanism proposed to explain the origin of the defects was supported by Finite Elements Methods simulations and verified with in-plant tests. The proper countermeasures were then applied and the problem successfully solved.

  7. An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

    DEFF Research Database (Denmark)

    Wu, Rui; Iannuzzo, Francesco; Wang, Huai

    2014-01-01

    Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation...... approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT...

  8. Fuel pellets from biomass - Processing, bonding, raw materials

    Energy Technology Data Exchange (ETDEWEB)

    Stelte, W.

    2011-12-15

    The present study investigates several important aspects of biomass pelletization. Seven individual studies have been conducted and linked together, in order to push forward the research frontier of biomass pelletization processes. The first study was to investigate influence of the different processing parameters on the pressure built up in the press channel of a pellet mill. It showed that the major factor was the press channel length as well as temperature, moisture content, particle size and extractive content. Furthermore, extractive migration to the pellet surface at an elevated temperature played an important role. The second study presented a method of how key processing parameters can be estimated, based on a pellet model and a small number of fast and simple laboratory trials using a single pellet press. The third study investigated the bonding mechanisms within a biomass pellet, which indicate that different mechanisms are involved depending on biomass type and pelletizing conditions. Interpenetration of polymer chains and close intermolecular distance resulting in better secondary bonding were assumed to be the key factors for high mechanical properties of the formed pellets. The outcome of this study resulted in study four and five investigating the role of lignin glass transition for biomass pelletization. It was demonstrated that the softening temperature of lignin was dependent on species and moisture content. In typical processing conditions and at 8% (wt) moisture content, transitions were identified to be at approximately 53-63 deg. C for wheat straw and about 91 deg. C for spruce lignin. Furthermore, the effects of wheat straw extractives on the pelletizing properties and pellet stability were investigated. The sixth and seventh study applied the developed methodology to test the pelletizing properties of thermally pre-treated (torrefied) biomass from spruce and wheat straw. The results indicated that high torrefaction temperatures above 275 deg

  9. Stress-strain effects in alumina-Cu reinforced Nb3Sn wires fabricated by the tube process

    International Nuclear Information System (INIS)

    Murase, Satoru; Nakayama, Shigeo; Masegi, Tamaki; Koyanagi, Kei; Nomura, Shunji; Shiga, Noriyuki; Kobayashi, Norio; Watanabe, Kazuo.

    1997-01-01

    In order to fabricate a large-bore, high-field magnet which achieves a low coil weight and volume, a high strength compound superconducting wire is required. For those demands we have developed the reinforced Nb 3 Sn wire using alumina dispersion strengthened copper (alumina-Cu) as a reinforcement material and the tube process of the Nb 3 Sn wire fabrication. The ductility study of the composites which consisted of the reinforcement, Nb tube, Cu, and Cu clad Sn brought a 1 km long alumina-Cu reinforced Nb 3 Sn wire successfully. Using fabricated wires measurements and evaluations of critical current density as parameters of magnetic field, tensile stress, tensile strain, and transverse compressive stress, and those of stress-strain curves at 4.2 K were performed. They showed superior performance such as high 0.3% proof stress (240 MPa at 0.3% strain) and high maximum tolerance stress (320 MPa) which were two times as large as those of conventional Cu matrix Nb 3 Sn wire. The strain sensitivity parameters were obtained for the reinforced Nb 3 Sn wire and the Cu matrix one using the scaling law. Residual stress of the component materials caused by cooling down to 4.2 K from heat-treatment temperature was calculated using equivalent Young's modulus, equivalent yield strength, thermal expansion coefficient and other mechanical parameters. Calculated stress-strain curves at 4.2 K for the reinforced Nb 3 Sn wire and the Cu matrix one based on calculation of residual stress, had good agreement with the experimental values. (author)

  10. Understanding Metallic Bonding: Structure, Process and Interaction by Rasch Analysis

    Science.gov (United States)

    Cheng, Maurice M. W.; Oon, Pey-Tee

    2016-01-01

    This paper reports the results of a survey of 3006 Year 10-12 students on their understandings of metallic bonding. The instrument was developed based on Chi's ontological categories of scientific concepts and students' understanding of metallic bonding as reported in the literature. The instrument has two parts. Part one probed into students'…

  11. Multi response optimization of wire-EDM process parameters of ballistic grade aluminium alloy

    Directory of Open Access Journals (Sweden)

    Ravindranadh Bobbili

    2015-12-01

    Full Text Available In the current investigation, a multi response optimization technique based on Taguchi method coupled with Grey relational analysis is planned for wire-EDM operations on ballistic grade aluminium alloy for armour applications. Experiments have been performed with four machining variables: pulse-on time, pulse-off time, peak current and spark voltage. Experimentation has been planned as per Taguchi technique. Three performance characteristics namely material removal rate (MRR, surface roughness (SR and gap current (GC have been chosen for this study. Results showed that pulse-on time, peak current and spark voltage were significant variables to Grey relational grade. Variation of performance measures with process variables was modelled by using response surface method. The confirmation tests have also been performed to validate the results obtained by Grey relational analysis and found that great improvement with 6% error is achieved.

  12. Bonding Be to Cu alloys using a proprietary Brush Wellman process and new results for bonding Be to AlBeMet

    Energy Technology Data Exchange (ETDEWEB)

    Dombrowski, D.E. [Brush Wellman Inc., Cleveland, OH (United States)

    1998-01-01

    A novel process has been investigated for bonding of beryllium to copper alloys. The process is compatible with current manufacturing capabilities and can be readily scaled up from laboratory to production scale. The effect of process variations on the bond are shown. Also shown are several new approaches for direct bonding of beryllium to an AlBeMet interlayer. Bond strengths of Be/AlBeMet 162/Cu alloy couples are presented. (author)

  13. Search for a metallic dangling-bond wire on n-doped H-passivated semiconductor surfaces

    DEFF Research Database (Denmark)

    Engelund, Mads; Papior, Nick Rübner; Brandimarte, Pedro

    2016-01-01

    We have theoretically investigated the electronic properties of neutral and n-doped dangling bond (DB) quasi-one-dimensional structures (lines) in the Si(001):H and Ge(001):H substrates with the aim of identifying atomic-scale interconnects exhibiting metallic conduction for use in on...... band structure which is remarkably insensitive to the doping level, and thus, it is possible to manipulate the position of the Fermi level, moving it away from the gap. Transport calculations demonstrate that the metallic conduction in the DB-dimer line can survive thermally induced disorder...... but is more sensitive to imperfect patterning. In conclusion, the DB-dimer line shows remarkable stability to doping and could serve as a one-dimensional metallic conductor on n-doped samples....

  14. Comparison between neutron diffraction measurements and numerical simulation of residual stresses of a wire-drawing process

    OpenAIRE

    Souza, Tomaz Fantin de; Soares, Carla Adriana Theis; Zottis, Juliana; Nunes, Rafael Menezes; Rocha, Alexandre da Silva; Hirsch, Thomas

    2013-01-01

    In this work, a drawing processed was simulated to calculate forces and the resulting residual stresses in the material. The calculated residual stresses were compared with experimentally measured residual stresses by the Neutron Diffraction Method. The modeled process was the Wire Drawing. The necessary parameters to model the process were taken from an industrial currently used process. Rods of an AISI 1045 steel with nominal diameters of 21.46 mm were reduced to 20.25 mm by drawing with an...

  15. Processing grounded-wire TEM signal in time-frequency-pseudo-seismic domain: A new paradigm

    Science.gov (United States)

    Khan, M. Y.; Xue, G. Q.; Chen, W.; Huasen, Z.

    2017-12-01

    Grounded-wire TEM has received great attention in mineral, hydrocarbon and hydrogeological investigations for the last several years. Conventionally, TEM soundings have been presented as apparent resistivity curves as function of time. With development of sophisticated computational algorithms, it became possible to extract more realistic geoelectric information by applying inversion programs to 1-D & 3-D problems. Here, we analyze grounded-wire TEM data by carrying out analysis in time, frequency and pseudo-seismic domain supported by borehole information. At first, H, K, A & Q type geoelectric models are processed using a proven inversion program (1-D Occam inversion). Second, time-to-frequency transformation is conducted from TEM ρa(t) curves to magneto telluric MT ρa(f) curves for the same models based on all-time apparent resistivity curves. Third, 1-D Bostick's algorithm was applied to the transformed resistivity. Finally, EM diffusion field is transformed into propagating wave field obeying the standard wave equation using wavelet transformation technique and constructed pseudo-seismic section. The transformed seismic-like wave indicates that some reflection and refraction phenomena appear when the EM wave field interacts with geoelectric interface at different depth intervals due to contrast in resistivity. The resolution of the transformed TEM data is significantly improved in comparison to apparent resistivity plots. A case study illustrates the successful hydrogeophysical application of proposed approach in recovering water-filled mined-out area in a coal field located in Ye county, Henan province, China. The results support the introduction of pseudo-seismic imaging technology in short-offset version of TEM which can also be an useful aid if integrated with seismic reflection technique to explore possibilities for high resolution EM imaging in future.

  16. Effect of ammonia on Ta filaments in the hot wire CVD process

    NARCIS (Netherlands)

    Verlaan, V.; van der Werf, C.H.M.; Oliphant, C.J.; Bakker, R.; Houweling, Z.S.; Schropp, R.E.I.

    2009-01-01

    The exposure of Ta filaments to a pure NH3 ambient in a hot wire chemical vapour deposition (HWCVD) reactor affects the resistance of the wires. For filament temperatures below 1950 °C the resistance increases over time, which is probably caused by in-diffusion of N atoms. Using the filaments in a

  17. Modeling of electric and heat processes in spot resistance welding of cross-wire steel bars

    Science.gov (United States)

    Iatcheva, Ilona; Darzhanova, Denitsa; Manilova, Marina

    2018-03-01

    The aim of this work is the modeling of coupled electric and heat processes in a system for spot resistance welding of cross-wire reinforced steel bars. The real system geometry, dependences of material properties on the temperature, and changes of contact resistance and released power during the welding process have been taken into account in the study. The 3D analysis of the coupled AC electric and transient thermal field distributions is carried out using the finite element method. The novel feature is that the processes are modeled for several successive time stages, corresponding to the change of contact area, related contact resistance, and reduction of the released power, occurring simultaneously with the creation of contact between the workpieces. The values of contact resistance and power changes have been determined on the basis of preliminary experimental and theoretical investigations. The obtained results present the electric and temperature field distributions in the system. Special attention has been paid to the temperature evolution at specified observation points and lines in the contact area. The obtained information could be useful for clarification of the complicated nature of interrelated electric, thermal, mechanical, and physicochemical welding processes. Adequate modeling is also an opportunity for proper control and improvement of the system.

  18. Spinous process wiring versus lateral mass fixation for the treatment of anterior cervical pseudarthrosis: a biomechanical comparison.

    Science.gov (United States)

    Murakami, Hideki; Jarrett, Claude; Rhee, John M; Tsai, Luke; Hutton, William

    2011-01-01

    Our objective was to compare the stiffness of lateral mass screws versus two different spinous process wiring constructs in a cadaveric model of plated anterior cervical pseudoarthrosis. When treating an anterior plated pseudoarthrosis via a posterior approach, it is unclear whether the added expense, muscle exposure, and risk of lateral mass fixation are justified biomechanically versus a simpler, cheaper, and potentially less morbid wiring technique, because the presence of the anterior plate likely reduces motion over the unplated situation. Seven cadaveric cervical spines were loaded in compression, flexion, extension, lateral bending, and torsion. Each load sequence was applied to: 1) the intact spine; 2) after application of a plated ACDF construct (pACDF); and 3) after the insertion of lateral mass (LM) screws, ``modified'' triple wiring (TW), or Roger's wiring (RW), in alternating order for each specimen. For each sequence, load deformation curves and stiffness were obtained. Supplemental LM fixation significantly (p ≤ 0.05) increased stiffness versus pACDF in all six modes tested. TW significantly increased stiffness versus pACDF in compression, flexion, and torsion, but not in extension, or lateral bending. RW significantly increased stiffness versus pACDF only in axial torsion. When comparing LM to the wiring constructs, LM fixation was significantly stiffer than RW in flexion, extension, and lateral bending; LM fixation was stiffer than TW in lateral bending. LM fixation produced the stiffest overall constructs in stabilizing a plated pseudarthrosis ACDF model. It was significantly stiffer in more modes versus RW than TW.

  19. Controlled-Growth of ZnO Nano wires with Different Processing Temperature

    International Nuclear Information System (INIS)

    Yap Chi Chin; Muhammad Yahaya; Muhamad Mat Salleh; Dee Chang Fu

    2008-01-01

    ZnO nano wires have been synthesized using a catalyst-free carbothermal reduction approach on SiO 2 -coated Si substrates in a flowing nitrogen atmosphere with a mixture of ZnO and graphite as reactants. The collected ZnO nano wires have been characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy and photoluminescence spectroscopy. Controlled growth of the ZnO nano wires was achieved by manipulating the reactants heating temperature from 700 to 1000 degree Celsius. It was found that the optimum temperature to synthesize high density and long ZnO nano wires was about 800 degree Celsius. The possible growth mechanism of ZnO nano wires is also proposed. (author)

  20. submitter Comparison of microstructure, second phases and texture formation during melt processing of Bi-2212 mono- and multifilament wires

    CERN Document Server

    Kadar, J; Rikel, MO; Di Michiel, M; Huang, Y

    2016-01-01

    Based on simultaneous in situ high energy synchrotron micro-tomography and x-ray diffraction (XRD) measurements we compare the microstructural changes and the formation of second phases and texture during the processing of Bi-2212 round wires with 15 μm filament diameter (multifilament) and 650 μm filament diameter (monofilament) fabricated using identical Bi-2212 precursor. The monofilament tomograms show in unprecedented detail how the distributed porosity agglomerates well before Bi-2212 melting decomposition to form lenticular voids that completely interrupt the filament connectivity along the wire axis. When the Bi-2212 phase completely melts connectivity in the axial wire direction is established via the changes in the void morphology from the lenticular voids to bubbles that remain when Bi-2212 crystallises out of the melt. By measuring the attenuation of the monochromatic x-ray beam, the associated Bi-2212 mass density changes have been monitored during the entire heat cycle. The XRD results reveal ...

  1. Influence of the oxygen partial pressure on the phase evolution during Bi-2212 wire melt processing

    CERN Document Server

    Scheuerlein, C.; Rikel, M.O.; Kadar, J.; Doerrer, C.; Di Michiel, M.; Ballarino, A.; Bottura, L.; Jiang, J.; Kametani, F.; Hellstrom, E.E.; Larbalestier, D.C.

    2016-01-01

    We have studied the influence of the oxygen partial pressure pO2 up to 5.5 bar on the phase changes that occur during melt processing of a state-of-the-art Bi-2212 multifilamentary wire. Phase changes have been monitored in situ by high energy synchrotron X-ray diffraction (XRD). We found that the stability of Bi-2212 phase is reduced with increasing pO2. For pO2>1 bar a significant amount of Bi-2212 phase decomposes upon heating in the range 400 to 650 °C. The extent of decomposition strongly increases with increasing pO2, and at pO2=5.5 bar Bi-2212 decomposes completely in the solid state. Textured Bi-2212 can be formed during solidification when pO2 is reduced to 0.45 bar when the precursor is molten. Since the formation of current limiting second phases is very sensitive to pO2 when it exceeds 1 bar, we recommend to reduce the oxygen partial pressure below the commonly used pO2=1 bar, in order to increase the pO2 margins and to make the overpressure process more robust.

  2. Process optimization for diffusion bonding of tungsten with EUROFER97 using a vanadium interlayer

    Science.gov (United States)

    Basuki, Widodo Widjaja; Aktaa, Jarir

    2015-04-01

    Solid-state diffusion bonding is a selected joining technology to bond divertor components consisting of tungsten and EUROFER97 for application in fusion power plants. Due to the large mismatch in their coefficient of thermal expansions, which leads to serious thermally induced residual stresses after bonding, a thin vanadium plate is introduced as an interlayer. However, the diffusion of carbon originated from EUROFER97 in the vanadium interlayer during the bonding process can form a vanadium carbide layer, which has detrimental influences on the mechanical properties of the joint. For optimal bonding results, the thickness of this layer and the residual stresses has to be decreased sufficiently without a significant reduction of material transport especially at the vanadium/tungsten interface, which can be achieved by varying the diffusion bonding temperature and duration. The investigation results show that at a sufficiently low bonding temperature of 700 °C and a bonding duration of 4 h, the joint reaches a reasonable high ductility and toughness especially at elevated test temperature of 550 °C with elongation to fracture of 20% and mean absorbed Charpy impact energy of 2 J (using miniaturized Charpy impact specimens). The strength of the bonded materials is about 332 MPa at RT and 291 MPa at 550 °C. Furthermore, a low bonding temperature of 700 °C can also help to avoid the grain coarsening and the alteration of the grain structure especially of the EUROFER97 close to the bond interface.

  3. Process optimization for diffusion bonding of tungsten with EUROFER97 using a vanadium interlayer

    Energy Technology Data Exchange (ETDEWEB)

    Basuki, Widodo Widjaja; Aktaa, Jarir

    2015-04-15

    Solid-state diffusion bonding is a selected joining technology to bond divertor components consisting of tungsten and EUROFER97 for application in fusion power plants. Due to the large mismatch in their coefficient of thermal expansions, which leads to serious thermally induced residual stresses after bonding, a thin vanadium plate is introduced as an interlayer. However, the diffusion of carbon originated from EUROFER97 in the vanadium interlayer during the bonding process can form a vanadium carbide layer, which has detrimental influences on the mechanical properties of the joint. For optimal bonding results, the thickness of this layer and the residual stresses has to be decreased sufficiently without a significant reduction of material transport especially at the vanadium/tungsten interface, which can be achieved by varying the diffusion bonding temperature and duration. The investigation results show that at a sufficiently low bonding temperature of 700 °C and a bonding duration of 4 h, the joint reaches a reasonable high ductility and toughness especially at elevated test temperature of 550 °C with elongation to fracture of 20% and mean absorbed Charpy impact energy of 2 J (using miniaturized Charpy impact specimens). The strength of the bonded materials is about 332 MPa at RT and 291 MPa at 550 °C. Furthermore, a low bonding temperature of 700 °C can also help to avoid the grain coarsening and the alteration of the grain structure especially of the EUROFER97 close to the bond interface.

  4. Process for protecting bonded components from plating shorts

    Science.gov (United States)

    Tarte, Lisa A.; Bonde, Wayne L.; Carey, Paul G.; Contolini, Robert J.; McCarthy, Anthony M.

    2000-01-01

    A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

  5. Life cycle assessment of bio-based, waterborne PU adhesives for fast industrial bonding processes

    OpenAIRE

    Maga, Daniel; Melchiors, Martin; Henneken, Hartmut; Taden, Andreas

    2017-01-01

    Aqueous PU dispersion adhesives based on high molecular weight, semi-crystalline polyurethane polymers have long demonstrated their outstanding performance and are a well-established bonding technology in several industrial applications. Due to their thermal activation properties and sharp melting area, these adhesives allow for efficient bonding processes with short bond strength build-up times. State-of-the-art is the use of polyester building blocks from fossil raw material resources to sy...

  6. Multiresponse optimization of process variables of power mixed wire electrical discharge machining on AISI 304 stainless steel

    Directory of Open Access Journals (Sweden)

    Sivakumar M.

    2015-01-01

    Full Text Available Wire Electrical Discharge Machining (WEDM is widely used for machining conductive materials which are of great importance in several industrial applications. In this work, process variables optimization of Powder Mixed Wire Electrical Discharge Machining (PMWEDM of AISI 304 stainless steel (SS is studied using molybdenum wire as the tool material. This work illustrate the implementation of Taguchi technique and Genetic Algorithm (GA to identify the optimal process variables of WEDM using dielectric medium mixed with Silicon Carbide(SiC powder. Selection of optimum process variables for obtaining higher cutting efficiency and accuracy is a difficult task in WEDM due to presence of large number of control variables and complicated stochastic process mechanisms. In general, there is no perfect combination that can simultaneously result in both the maximum material removal rate (MRR and the minimal surface roughness (Rq. The present work attempts to develop an appropriate machining strategy for a maximum process yield. MRR and Rq have been considered as measure of the machining performance with four different control parameters such as pulse on time, pulse off time, current and voltage. Experiments were conducted by Taguchi L18 mixed orthogonal array. A multiple linear regression model is developed to relate the input and output variables and GA is used to optimize WEDM process variables. The optimized results for maximum MRR and minimum Rq are compared with and without powder mixed dielectric and confirmation tests were conducted.

  7. Mechanical and Electrical Properties of Palladium-Coated Copper Wires with Flash Gold

    Science.gov (United States)

    Chang, Chia-Yun; Hung, Fei-Yi; Lui, Truan-Sheng

    2017-07-01

    Palladium-coated copper wire with flash gold (PCA) is a fine wire with an oxidation resistance layer. A new sulfidation test has been assessed in this work, confirming that PCA wires show better sulfidation corrosion resistance than either palladium-coated or bare copper wires. The sulfided surface of PCA was analyzed, along with its bonding strength and electrical properties. The metallurgic mechanism for formation of free air balls during the electric flame-off (EFO) process was identified. The flash gold layer of PCA wires can improve certain shortcomings, including: (1) efficiently promoting sulfidation corrosion resistance, (2) solving the problem of palladium segregation during the EFO process, (3) reducing the starting voltage, and (4) stabilizing the electrical resistivity of the bonding interface.

  8. Meeting the multiscale challenge: representing physiology processes over ApiNATOMY circuits using bond graphs.

    Science.gov (United States)

    de Bono, B; Safaei, S; Grenon, P; Hunter, P

    2018-02-06

    We introduce, and provide examples of, the application of the bond graph formalism to explicitly represent biophysical processes between and within modular biological compartments in ApiNATOMY. In particular, we focus on modelling scenarios from acid-base physiology to link distinct process modalities as bond graphs over an ApiNATOMY circuit of multiscale compartments. The embedding of bond graphs onto ApiNATOMY compartments provides a semantically and mathematically explicit basis for the coherent representation, integration and visualisation of multiscale physiology processes together with the compartmental topology of those biological structures that convey these processes.

  9. High-step-coverage Cu-lateral interconnections over 100 µm thick chips on a polymer substrate—an alternative method to wire bonding

    International Nuclear Information System (INIS)

    Murugesan, M; Fukushima, T; Kiyoyama, K; Bea, J C; Tanaka, T; Koyanagi, M

    2012-01-01

    We propose a novel chip in the polymer board interconnect method for packaging different kinds of chips on a wafer level, where conventional wire bonding may not be possible due to either space or mechanical constraints. High-step-coverage copper (Cu)-lateral interconnects formed over 100 µm thick Si chips by the electroplating method have been investigated for their microstructure and electrical characteristics, using the field emission scanning electron microscope and semiconductor parameter analyzer (Agilent, 4156C). The obtained coverage ratios (i.e. the layer thickness on the chip surface to the sidewall of the chip) for each formed layer, i.e. the tantalum barrier layer, Cu seed layer, SiO 2 dielectric layer and electroplated Cu layer, were 3:1, 3:1, 1.5:1 and 1:1, respectively. The measured mean electrical resistances for 36 µm × 2000 µm and 58 µm × 2000 µm interconnect lines were respectively 31.1 and 24 mΩ, and the difference between measured and calculated resistance values was less than 5%. The good quality of as-fabricated Cu-lateral interconnects was evidenced from the observed low resistance values for isolated interconnects and the linear change in daisy chain resistance with the number of interconnects. More importantly, even at a high operating temperature of 150 °C, the resistance value of the Cu-lateral interconnect over the integrated chip was very close to that of the resistance value of interconnect on the plain wafer. The suitability of this technique in integrating various chips heterogeneously was validated from the no observed change in transistor behavior due to this technique. Since this is a CMOS compatible interconnection method between the polymer substrate and chip, it can readily be scaled up to the wafer level. (paper)

  10. Bond layer for a solid oxide fuel cell, and related processes and devices

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Jian; Striker, Todd-Michael; Renou, Stephane; Gaunt, Simon William

    2017-03-21

    An electrically-conductive layer of material having a composition comprising lanthanum and strontium is described. The material is characterized by a microstructure having bimodal porosity. Another concept in this disclosure relates to a solid oxide fuel cell attached to at least one cathode interconnect by a cathode bond layer. The bond layer includes a microstructure having bimodal porosity. A fuel cell stack which incorporates at least one of the cathode bond layers is also described herein, along with related processes for forming the cathode bond layer.

  11. Basic Wiring.

    Science.gov (United States)

    Kaltwasser, Stan; And Others

    This module is the first in a series of three wiring publications; it serves as the foundation for students enrolled in a wiring program. It is a prerequisite to either "Residential Wiring" or "Commercial and Industrial Wiring." The module contains 16 instructional units that cover the following topics: occupational…

  12. Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

    Science.gov (United States)

    Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

    2017-12-01

    An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

  13. Design and fabrication of a 30 T superconducting solenoid using overpressure processed Bi2212 round wire

    Energy Technology Data Exchange (ETDEWEB)

    Flanagan, Gene [Muons, Inc., Batavia, IL (United States); Johnson, Rolland [Muons, Inc., Batavia, IL (United States)

    2016-02-18

    High field superconducting magnets are used in particle colliders, fusion energy devices, and spectrometers for medical imaging and advanced materials research. Magnets capable of generating fields of 20-30 T are needed by future accelerator facilities. A 20-30 T magnet will require the use of high-temperature superconductors (HTS) and therefore the challenges of high field HTS magnet development need to be addressed. Superconducting Bi2Sr2CaCu2Ox (Bi2212) conductors fabricated by the oxide-powder-in-tube (OPIT) technique have demonstrated the capability to carry large critical current density of 105 A/cm2 at 4.2 K and in magnetic fields up to 45 T. Available in round wire multi-filamentary form, Bi2212 may allow fabrication of 20-50 T superconducting magnets. Until recently the performance of Bi2212 has been limited by challenges in realizing high current densities (Jc ) in long lengths. This problem now is solved by the National High Magnetic Field Lab using an overpressure (OP) processing technique, which uses external pressure to process the conductor. OP processing also helps remove the ceramic leakage that results when Bi-2212 liquid leaks out from the sheath material and reacts with insulation, coil forms, and flanges. Significant advances have also been achieved in developing novel insulation materials (TiO2 coating) and Ag-Al sheath materials that have higher mechanical strengths than Ag-0.2wt.% Mg, developing heat treatment approaches to broadening the maximum process temperature window, and developing high-strength, mechanical reinforced Bi-2212 cables. In the Phase I work, we leveraged these new opportunities to prototype overpressure processed solenoids and test them in background fields of up to 14 T. Additionally a design of a fully superconducting 30 T solenoid was produced. This work in conjunction with the future path outlined in the Phase II proposal would

  14. Molecular dynamics study on nano-sized wiredrawing: possible atomistic process and application to pearlitic steel wire

    Science.gov (United States)

    Saitoh, K.; Yoshida, K.; Oda, K.; Sato, T.; Takuma, M.; Takahashi, Y.

    2018-02-01

    The process of nano-sized wiredrawing is investigated by using molecular dynamics (MD) simulation in this study. The authors have constructed novel computation models of wiredrawing, in which a single wire of just a several nanometers in diameter is smoothly drawn through a perfectly rigid die together with lubrication mechanism and is forced to be shaped into thinner one. Interatomic potentials used in MD simulation is a conventional pairwise type useable for iron-carbon binary system (for pearlitic steel). For MD model of pearlite steel wire, it is recognized that ferrite-cementite interface effectively offers high-speed diffusion path for carbon atoms from cementite side to ferrite side (elementary mechanism of cementite decomposition). As conclusion, we showed by using atomistic simulation that nano-sized wiredrawing process is theoretically quite possible.

  15. Signal Acquisition and Processing in the Magnetic Defectoscopy of Steel Wire Ropes

    Directory of Open Access Journals (Sweden)

    N. S. Jovičić

    2012-11-01

    Full Text Available The system that resolves the problem of wire rope defects using a magnetic method of inspection is presented in this paper. Implementation of the system should provide for full monitoring of wire rope condition, according to the prescribed international standards. The purpose of this system, in addition to identifying defects in the rope, is to determine to what extent damage has been done. The measurement procedure provides for a better understanding of the defects that occur, as well as the rejection criteria of used ropes, that way increasing their security. Hardware and software design of appliance for recording defects and test results are presented in this paper.

  16. Development of Statistical Process Control Methodology for an Environmentally Compliant Surface Cleaning Process in a Bonding Laboratory

    Science.gov (United States)

    Hutchens, Dale E.; Doan, Patrick A.; Boothe, Richard E.

    1997-01-01

    Bonding labs at both MSFC and the northern Utah production plant prepare bond test specimens which simulate or witness the production of NASA's Reusable Solid Rocket Motor (RSRM). The current process for preparing the bonding surfaces employs 1,1,1-trichloroethane vapor degreasing, which simulates the current RSRM process. Government regulations (e.g., the 1990 Amendments to the Clean Air Act) have mandated a production phase-out of a number of ozone depleting compounds (ODC) including 1,1,1-trichloroethane. In order to comply with these regulations, the RSRM Program is qualifying a spray-in-air (SIA) precision cleaning process using Brulin 1990, an aqueous blend of surfactants. Accordingly, surface preparation prior to bonding process simulation test specimens must reflect the new production cleaning process. The Bonding Lab Statistical Process Control (SPC) program monitors the progress of the lab and its capabilities, as well as certifies the bonding technicians, by periodically preparing D6AC steel tensile adhesion panels with EA-91 3NA epoxy adhesive using a standardized process. SPC methods are then used to ensure the process is statistically in control, thus producing reliable data for bonding studies, and identify any problems which might develop. Since the specimen cleaning process is being changed, new SPC limits must be established. This report summarizes side-by-side testing of D6AC steel tensile adhesion witness panels and tapered double cantilevered beams (TDCBs) using both the current baseline vapor degreasing process and a lab-scale spray-in-air process. A Proceco 26 inches Typhoon dishwasher cleaned both tensile adhesion witness panels and TDCBs in a process which simulates the new production process. The tests were performed six times during 1995, subsequent statistical analysis of the data established new upper control limits (UCL) and lower control limits (LCL). The data also demonstrated that the new process was equivalent to the vapor

  17. Survey of Processing Methods for High Strength High Conductivity Wires for High Field Magnet Applications

    International Nuclear Information System (INIS)

    Han, K.; Embury, J.D.

    1998-01-01

    This paper will deal with the basic concepts of attaining combination of high strength and high conductivity in pure materials, in-situ composites and macrocomposites. It will survey current attainments, and outline where some future developments may lie in developing wire products that are close to the theoretical strength of future magnet applications

  18. Survey of Processing Methods for High Strength High Conductivity Wires for High Field Magnet Applications

    Energy Technology Data Exchange (ETDEWEB)

    Han, K.; Embury, J.D.

    1998-10-01

    This paper will deal with the basic concepts of attaining combination of high strength and high conductivity in pure materials, in-situ composites and macrocomposites. It will survey current attainments, and outline where some future developments may lie in developing wire products that are close to the theoretical strength of future magnet applications.

  19. Different processes for different therapies: therapist actions, therapeutic bond, and outcome.

    Science.gov (United States)

    Ulvenes, Pål G; Berggraf, Lene; Hoffart, Asle; Stiles, Tore C; Svartberg, Martin; McCullough, Leigh; Wampold, Bruce E

    2012-09-01

    Therapeutic bond, as a component of the alliance, is considered a common factor in psychotherapy; however, it may operate differently in various treatments. This article investigates therapist actions, particularly affect focus, in the formation of the bond and on reduction of symptoms in short-term dynamic psychotherapy (STDP) and cognitive therapy (CT) for cluster C patients. Forty-six cases (23 STDP and 23 CT) were assessed using the Psychotherapy Process Q-Sort, the Helping Alliance Questionnaire, and the Symptom Checklist 90. These scores were used to determine (a) therapist actions that predict formation of the bond, (b) the relation of the bond to symptom reduction, and (c) how therapist actions and bond interacted to reduce symptoms. Multiple regressions were applied to the total sample and to the STDP and CT cases. Psychotherapy Process Q-Sort items describing avoidance of affects were positively related to the bond in the total sample, STDP and CT. However, the relation between therapist actions, bond, and symptom reduction differed for the two treatments. For STDP, avoidance of affect suppressed the relation of bond to symptom reduction and also negatively influenced symptom reduction. On the other hand, in CT, avoidance of affect was positively related to both the formation of the bond and to symptom reduction. Although the bond is a common factor and important component of the alliance, it appears to operate differently in STDP and CT. A focus on affect is important to the benefits of STDP but interferes with the benefits of CT. PsycINFO Database Record (c) 2012 APA, all rights reserved.

  20. Effect of starting materials and processing variables for the production of discontinuous filament Nb3Sn wire

    International Nuclear Information System (INIS)

    Upadhyay, P.L.; Dew-Hughes, D.

    1986-01-01

    Discontinuous multifilamentary wires of Nb 3 Sn have been prepared from compacted mixtures of 30 wt. %Nb in Cu, extruded, drawn, annealed, tin plated and reacted. Processing variables include starting materials, extrusion ratio and extrusion temperature. Continuous lengths of wire could be satisfactorily produced from compacts of either ultra-pure Nb (VPN about 95 kg mm -2 ) and Cu powder or from centrifugal arc-cast Nb spheroids (VPN about 120 kg mm -2 ) and tough pitch Cu powder. After a total area reduction of 10 4 : 1, the latter materials resulted in long, unbroken, highly regular filaments of Nb about 6μm in diameter. The high degree of perfection of these filaments is due in part to the uniformity of the initial spheroids, compared to the highly irregular hydride-dehydride Nb powder. However their greater hardness requires that the spheroids be coprocessed in a less-pure Cu matrix. Critical currents were measured on helical specimens involving more than 1m length of wire, in fields up to 15T at 4.2 K, after reaction for various times at different temperatures. Overall current densities of 3 X 10 8 Am -2 were obtained at 12T in the best samples. Further reductions are expected to produce material with improved current densities

  1. The Assessment Of The Structure And Properties Of High-Carbon Steel Wires After The Process Of Patenting With Induction Heating

    Directory of Open Access Journals (Sweden)

    Wiewiórowska S.

    2015-06-01

    Full Text Available One of the most important types of heat treatment that high-carbon steel wires are subjected to is the patenting treatment. This process is conducted with the aim of obtaining a fine-grained uniform pearlitic structure which will be susceptible to plastic deformation in drawing processes. Patenting involves two-stage heat treatment that includes heating the wire up to the temperature above Ac3 in a continuous heating furnace (in the temperature range of 850÷1050°C followed by a rapid cooling in a tank with a lead bath down to the temperature range of 450÷550°C. The patenting process is most significantly influenced by the chemistry of the steel being treated, as well as by the temperature and the rate of heating and cooling of the wire rod or wire being patented.

  2. IEE wiring regulations explained and illustrated

    CERN Document Server

    Scaddan, Brian

    2013-01-01

    The IEE Wiring Regulations Explained and Illustrated, Second Edition discusses the recommendations of the IEE Regulations for the Electrical Equipment of Buildings for the safe selection or erection of wiring installations. The book emphasizes earthing, bonding, protection, and circuit design of electrical wirings. The text reviews the fundamental requirements for safety, earthing systems, the earth fault loop impedance, and supplementary bonding. The book also describes the different types of protection, such as protection against mechanical damage, overcurrent, under voltage (which prevents

  3. Mechanical characterization of Cu-Zn wire electrode base used in EDM and study of influence of the process of machining on its properties

    Energy Technology Data Exchange (ETDEWEB)

    Sedjal, H., E-mail: hasedjal@yahoo.fr; Amirat, B. [Département of Mechanical engineering, University of M.MAMMERI, Tizi Ouzou (Algeria); Aichour, M.; Marouf, T.; Chitroub, M. [Engineering and Material Sciences Laboratory, Department of Metallurgy, Polytechnic national school, Algiers (Algeria)

    2015-03-30

    This work is part of a Research National project (PNR) carried out by the group of research of the engineering and material sciences laboratory of the polytechnic national school at Algiers in collaboration with company BCR, which relates to “the characterization of the wire intended for the EDM of matrices metal. The goal of this work is to bring metallographic explanations on the wire electrode used by the machine ROBOFIL 290P, mechanically characterized this wire as of knowing of advantage about the process of its manufacturing (wiredrawing, .) The methods of studies used are it micro Vickers pyramid hardness, the tensile test, optical microscopy and scan electronic microscopy SEM.

  4. Wire Chamber

    CERN Multimedia

    Magnetoscriptive readout wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  5. Wire chamber

    CERN Multimedia

    1967-01-01

    Magnetoscriptive readout wire chamber.Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  6. Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment

    Directory of Open Access Journals (Sweden)

    Jianfeng Yan

    2016-01-01

    Full Text Available Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrifuging. The sintering bonding process using Ag nanoparticle paste at different bonding pressures is studied. The joint strengths are increased as the bonding pressure increases from 0 MPa to 7.5 MPa. This is due to the fact that the higher assistant bonding pressure is beneficial to the growth of neck size between the adjacent particles and forms denser sintered Ag layers. The joint strength bonded under 10 MPa is lower than that bonded under 7.5 MPa, which may be due to the residue of organic component in the sintered Ag layer. The joint properties bonded with Ag nanoparticle paste in high temperature environment are evaluated by heat treatments at temperatures ranges of 200–350°C for 50 hours. The results show that the mechanical properties of joint with Ag nanoparticle paste are better than the joint with Pb95Sn5 solder after storage at high temperatures.

  7. Wiring and lighting

    CERN Document Server

    Kitcher, Chris

    2013-01-01

    Wiring and Lighting provides a comprehensive guide to DIY wiring around the home. It sets out the regulations and legal requirements surrounding electrical installation work, giving clear guidelines that will enable the reader to understand what electrical work they are able to carry out, and what the testing and certification requirements are once the work is completed. Topics covered include: Different types of circuits; Types of cables and cable installation under floors and through joists; Isolating, earthing and bonding; Accessory boxes and fixings; Voltage bands; Detailed advice on safe

  8. wire chamber

    CERN Multimedia

    Proportional multi-wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle. Proportional wire chambers allow a much quicker reading than the optical or magnetoscriptive readout wire chambers.

  9. Structural and superconducting properties of PIT processed sintered MgB{sub 2}/Fe wires

    Energy Technology Data Exchange (ETDEWEB)

    Balamurugan, S.; Nakamura, T.; Osamura, K.; Muta, I.; Hoshino, T

    2004-10-01

    In this paper, we report the structural and superconducting properties of MgB{sub 2}/Fe wires that are produced by different sintering conditions. Good quality MgB{sub 2}/Fe wires are fabricated by the powder-in-tube (PIT) method using commercially available MgB{sub 2} powder at ambient pressure. In order to check the annealing effect, the different pieces of the as-rolled wires are sintered at 1323 K for 0.30-1.20 ks. XRD data confirms that they are hexagonal MgB{sub 2} structure. All the sintered samples show higher T{sub c} values in the range of 38.2-38.4 K with high J{sub c} than the as-rolled sample. No significant change in T{sub c} is seen among the annealed samples. On the other hand, the annealed samples show significant change in the J{sub c} values as well as in micro-structural features due to variable sintering time. On annealing at 1323 K for 0.60 ks, we obtain the best quality sample with a J{sub c} of 372 A/mm{sup 2} at 33.1 K in self-field with a maximum T{sub c} of 38.4 K. Among the annealed samples, 1.20 ks sample shows lower J{sub c}. Longer annealing time reduced J{sub c}, indicating a possible interfacial reaction between the Fe sheath and the MgB{sub 2} core.

  10. Diffusion Bonding Beryllium to Reduced Activation Ferritic Martensitic Steel: Development of Processes and Techniques

    Science.gov (United States)

    Hunt, Ryan Matthew

    Only a few materials are suitable to act as armor layers against the thermal and particle loads produced by magnetically confined fusion. These candidates include beryllium, tungsten, and carbon fiber composites. The armor layers must be joined to the plasma facing components with high strength bonds that can withstand the thermal stresses resulting from differential thermal expansion. While specific joints have been developed for use in ITER (an experimental reactor in France), including beryllium to CuCrZr as well as tungsten to stainless steel interfaces, joints specific to commercially relevant fusion reactors are not as well established. Commercial first wall components will likely be constructed front Reduced Activation Ferritic Martensitic (RAFM) steel, which will need to be coating with one of the three candidate materials. Of the candidates, beryllium is particularly difficult to bond, because it reacts during bonding with most elements to form brittle intermetallic compounds. This brittleness is unacceptable, as it can lead to interface crack propagation and delamination of the armor layer. I have attempted to overcome the brittle behavior of beryllium bonds by developing a diffusion bonding process of beryllium to RAFM steel that achieves a higher degree of ductility. This process utilized two bonding aids to achieve a robust bond: a. copper interlayer to add ductility to the joint, and a titanium interlayer to prevent beryllium from forming unwanted Be-Cu intermetallics. In addition, I conducted a series of numerical simulations to predict the effect of these bonding aids on the residual stress in the interface. Lastly, I fabricated and characterized beryllium to ferritic steel diffusion bonds using various bonding parameters and bonding aids. Through the above research, I developed a process to diffusion bond beryllium to ferritic steel with a 150 M Pa tensile strength and 168 M Pa shear strength. This strength was achieved using a Hot Isostatic

  11. Processing and characterization of superconducting solenoids made of Bi-2212/Ag-alloy multifilament round wire for high field magnet applications

    Science.gov (United States)

    Chen, Peng

    between turns due to densification of wires (~4% wire diameter reduction) during 50-100 bar OP processing, and the diameter shrinking of conductors will potentially lead to coil sagging. So far, we have developed some methods to solve the issue of coil sagging, such as using flexible coil flange to allow smooth sagging of winding pack during OP processing. We have also investigated electrical joints between Bi-2212 RW conductors, which include resistive joints and superconducting joints. For resistive Bi-2212 joints, we evaluated conventional diffusion bonding method and soldering method. In general, the joints (with 42 mm joint length) resistances are below 200 nO at 4.2 K and magnetic fields up to 13.5 T, and the effect of magnetoresistance is clearly present. In addition to resistive joints, we successfully developed a superconducting joint between Bi-2212 RW conductors for persistent current mode (PCM) operations. (Abstract shortened by UMI.).

  12. Processing and properties of FeAl-bonded composites

    Energy Technology Data Exchange (ETDEWEB)

    Schneibel, J.H.; Subramanian, R.; Alexander, K.B.; Becher, P.F. [Oak Ridge National Lab., TN (United States). Metals and Ceramics Div.

    1996-12-31

    Iron aluminides are thermodynamically compatible with a wide range of ceramics such as carbides, borides, oxides, and nitrides, which makes them suitable as the matrix in composites or cermets containing fine ceramic particulates. For ceramic contents varying from 30 to 60 vol.%, composites of Fe-40 at. % Al with WC, TiC, TiB{sub 2}, and ZrB{sub 2} were fabricated by conventional liquid phase sintering of powder mixtures. For ceramic contents from 70 to 85 vol.%, pressureless melt infiltration was found to be a more suitable processing technique. In FeAl-60 vol.% WC, flexure strengths of up to 1.8 GPa were obtained, even though processing defects consisting of small oxide clusters were present. Room temperature fracture toughnesses were determined by flexure testing of chevron-notched specimens. FeAl/WC and FeAl/TiC composites containing 60 vol.% carbide particles exhibited K{sub Q} values around 20 MPa m{sup 1/2}. Slow crack growth measurements carried out in water and in dry oxygen suggest a relatively small influence of water-vapor embrittlement. It appears therefore that the mechanical properties of iron aluminides in the form of fine ligaments are quite different from their bulk properties. Measurements of the oxidation resistance, dry wear resistance, and thermal expansion of iron aluminide composites suggest many potential applications for these new materials.

  13. Informed Consent Process: Foundation of the Researcher-participant Bond.

    Science.gov (United States)

    Sil, Amrita; Das, Nilay Kanti

    2017-01-01

    Consenting to participate in a clinical research study after being properly and correctly informed upholds the basic ethical principle of "autonomy" in human research. The informed consent is a process by which the physician sensitizes the patient about the nature, procedures, risks benefits, treatment schedules, etc of the study in a language that is non-technical and understandable by the study participant. Informed consent document (ICD) has got two parts: the 'Subject Information Sheet' and the 'Informed Consent Form' (ICF); and they have to be approved by the Institutional Ethics Committee (IEC) before administration. Consent should be obtained without any coercion. In case of a situation where a participant is not able to give informed consent (e.g. unconscious, minor or those suffering from severe mental illness or disability) or is illiterate, it has be obtained from a legally acceptable representative (LAR). If the participant or LAR is unable to read/write, then an impartial witness should be present during the entire informed consent process and must append his/her signatures to the consent form. For children consent is essential and for mature minors (age group 7 to 18 years) informed assent should be obtained.

  14. Non-abelian anyons and topological quantum information processing in 1D wire networks

    Science.gov (United States)

    Alicea, Jason

    2012-02-01

    Topological quantum computation provides an elegant solution to decoherence, circumventing this infamous problem at the hardware level. The most basic requirement in this approach is the ability to stabilize and manipulate particles exhibiting non-Abelian exchange statistics -- Majorana fermions being the simplest example. Curiously, Majorana fermions have been predicted to arise both in 2D systems, where non-Abelian statistics is well established, and in 1D, where exchange statistics of any type is ill-defined. An important question then arises: do Majorana fermions in 1D hold the same technological promise as their 2D counterparts? In this talk I will answer this question in the affirmative, describing how one can indeed manipulate and harness the non-Abelian statistics of Majoranas in a remarkably simple fashion using networks formed by quantum wires or topological insulator edges.

  15. wire chamber

    CERN Multimedia

    Was used in ISR (Intersecting Storage Ring) split field magnet experiment. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  16. Wire chamber

    CERN Multimedia

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  17. wire chamber

    CERN Multimedia

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  18. wire chamber

    CERN Multimedia

    1985-01-01

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  19. [Effect of different surface processes on the bond strength between zirconia framework and veneering ceramic].

    Science.gov (United States)

    Qi, Gong; Huiqiang, Sun; Yijun, Hu; Jia, Chen; Weishan, Ding

    2017-12-01

    To compare the effect of different surface processes on bond strength and microscopic structure using a scanning electron microscope (SEM) and an energy distribution spectrum (EDS) at the bonding interface between zirconia framework and veneering ceramic. WIELAND zirconia core material was cut into 33 rectangular specimens and fired on into rectangular specimens (10 mm×5 mm×5 mm). The specimens were randomly divided into three groups (n=
11). The sandblasting group was sandblasted before firing. The sandblasting and liner coverage group was sandblasted before firing and then sintered with liner coverage after firing. The control group was not processed. All the veneering ceramics (5 mm×
5 mm×5 mm) were fired on into the zirconia substructure by slip-casting technique. One bilayered specimen in each group was prepared for SEM and EDS to examine the bonding conditions. The other specimens were measured for shear force using an electronic universal dynamometer. The data obtained were analyzed by using the statistical software SPSS 17.0. The values of the shear bond strength test were (13.80±1.54) MPa for the control group, (18.06±0.59) MPa for the sandblasting group, and (21.04±1.23) MPa for the sandblasting and liner coverage group. Significant differences existed among the three groups (Pveneering porcelain. The use of porcelain combined with liner increases the shear bond strength.

  20. Modeling and optimization of process variables of wire-cut electric discharge machining of super alloy Udimet-L605

    Directory of Open Access Journals (Sweden)

    Somvir Singh Nain

    2017-02-01

    Full Text Available This paper presents the behavior of Udimet-L605 after wire electric discharge machining and evaluating the WEDM process using sophisticated machine learning approaches. The experimental work is depicted on the basis of Taguchi orthogonal L27 array, considering six input variables and three interactions. Three models such as support vector machine algorithms based on PUK kernel, non-linear regression and multi-linear regression have been proposed to examine the variance between experimental and predicted outcome and preferred the preeminent model based on its evaluation parameters performance and graph analysis. The grey relational analysis is the relevant approach to obtain the best grouping of input variables for maximum material removal rate and minimum surface roughness. Based on statistical analysis, it has been concluded that pulse-on time, interaction between pulse-on time x pulse-off time, spark-gap voltage and wire tension are the momentous variable for surface roughness while the pulse-on time, spark-gap voltage and pulse-off time are the momentous variables for material removal rate. The micro structural and compositional changes on the surface of work material were examined by means of SEM and EDX analysis. The thickness of the white layer and the recast layer formation increases with increases in the pulse-on time duration.

  1. A squatter community as the keeper of cultural heritage: interaction between spatial and social bonding processes

    NARCIS (Netherlands)

    Dam, van R.I.; Termeer, C.J.A.M.; Zande, van der A.N.

    2013-01-01

    In this article, an analysis is made of the social and spatial bonding processes affecting a squatter community who lived at Fort Pannerden in the Netherlands for about seven years. Besides describing the relation between the squatters and the fort, the article analyses the influence of the

  2. Composite conductor containing superconductive wires

    Energy Technology Data Exchange (ETDEWEB)

    Larson, W.L.; Wong, J.

    1974-03-26

    A superconductor cable substitute made by coworking multiple rods of superconductive niobium--titanium or niobium--zirconium alloy with a common copper matrix to extend the copper and rods to form a final elongated product which has superconductive wires distributed in a reduced cross-section copper conductor with a complete metallurgical bond between the normal-conductive copper and the superconductor wires contained therein is described. The superconductor cable can be in the form of a tube.

  3. Wiring design for the control of electromagnetic interference (EMI)

    Science.gov (United States)

    Kopasakis, George

    1995-01-01

    Wiring design is only one important aspect of EMI control. Other important areas for EMI are: circuit design, filtering, grounding, bonding, shielding, lighting, electrostatic discharge (ESD), transient suppression, and electromagnetic pulse (EMP). Topics covered include: wire magnetic field emissions at low frequencies; wire radiated magnetic field emissions at frequencies; wire design guidelines for EMI control; wire design guidelines for EMI control; high frequency emissions from cables; and pulse frequency spectra.

  4. Constitutive Hybrid Processes: a Process-Algebraic Semantics for Hybrid Bond Graphs

    NARCIS (Netherlands)

    Cuijpers, Pieter J.L.; Broenink, Johannes F.; Mosterman, Pieter J.

    2008-01-01

    Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

  5. Constitutive Hybrid Processes: a Process-Algebraic Semantics for Hybrid Bond Graphs

    NARCIS (Netherlands)

    Cuijpers, P.J.L.; Broenink, Johannes F.; Mosterman, P.J.

    Models of physical systems have to be based on physical principles such as conservation of energy and continuity of power. These principles are inherently enforced by the bond graph modeling formalism. Often, however, physical components may be best modeled as piecewise continuous with discrete mode

  6. Binder Jetting: A Novel NdFeB Bonded Magnet Fabrication Process

    Science.gov (United States)

    Paranthaman, M. Parans; Shafer, Christopher S.; Elliott, Amy M.; Siddel, Derek H.; McGuire, Michael A.; Springfield, Robert M.; Martin, Josh; Fredette, Robert; Ormerod, John

    2016-07-01

    The goal of this research is to fabricate near-net-shape isotropic (Nd)2Fe14B-based (NdFeB) bonded magnets using a three dimensional printing process to compete with conventional injection molding techniques used for bonded magnets. Additive manufacturing minimizes the waste of critical materials and allows for the creation of complex shapes and sizes. The binder jetting process works similarly to an inkjet printer. A print-head passes over a bed of NdFeB powder and deposits a polymer binding agent to bind the layer of particles together. The bound powder is then coated with another layer of powder, building the desired shape in successive layers of bonded powder. Upon completion, the green part and surrounding powders are placed in an oven at temperatures between 100°C and 150°C for 4-6 h to cure the binder. After curing, the excess powder can be brushed away to reveal the completed "green" part. Green magnet parts were then infiltrated with a clear urethane resin to achieve the measured density of the magnet of 3.47 g/cm3 close to 46% relative to the NdFeB single crystal density of 7.6 g/cm3. Magnetic measurements indicate that there is no degradation in the magnetic properties. This study provides a new pathway for preparing near-net-shape bonded magnets for various magnetic applications.

  7. Wire Rupture Optimization in Wire Electrical Discharge Machining using Taguchi Approach

    Directory of Open Access Journals (Sweden)

    Maher Ibrahem

    2017-01-01

    Full Text Available Wire electrical discharge machining (WEDM is one of the most important nontraditional machining process that is well-known for cutting difficult to machine materials. The wire electrode along with machining parameters control the WEDM process. This research work focuses on optimizing WEDM parameters using Taguchi technique to minimize wire rupture. Experiments have been done using the L18 orthogonal array. Each experiment is repeated three times to ensure accurate readings of the wire rupture. The statistical methods of signal to noise ratio (S/N ratio is applied to study effects of peak current, pulse width, charging time, wire speed, and wire tension on wire rupture. As a results, the peak current, pulse width, and wire tension have the most significant effect on wire rupture followed by charging time and wire speed. The developed analysis can be used in the metal cutting field to identify the optimum machining parameters for less wire rupture.

  8. Micro-CT evaluation of in vivo osteogenesis at implants processed by wire-type electric discharge machining.

    Science.gov (United States)

    Yamaki, Koichi; Kataoka, Yu; Ohtsuka, Fukunaga; Miyazaki, Takashi

    2012-01-01

    Titanium surfaces processed by wire-type electric discharge machining (EDM) are microfabricated surfaces with an irregular morphology, and they exhibited excellent in vitro bone biocompatibility. In this study, the efficiency of in vivo osteogenesis on EDM surfaces was investigated by surgically placing screw-shaped EDM-processed and machined-surface implants into the femurs of four Japanese white rabbits. The volume and process of new bone formation were evaluated by an X-ray micro-CT scanner, coupled with histopathological observations at 1, 2, and 4 weeks post-implantation. Before surgical implantation, the surface topography and contact angle of each implant surface were examined. Bone formation increased over time on both implant surfaces, with both implant types yielding statistically equivalent bone volume at 4 weeks post-implementation. However, at 1 week post-implantation, amount of new bone at EDM-processed implant was markedly greater than that at machined-surface implant. Moreover, new bone appeared to initiate directly from the EDM surfaces, while new bone appeared to generate from pre-existing host bone to the machined surfaces. Thus, EDM seemed to be a promising method for surface modification of titanium implants to support enhanced osteogenesis.

  9. Comparison between Neutron Diffraction measurements and numerical simulation of residual stresses of a Wire-Drawing process

    Directory of Open Access Journals (Sweden)

    Tomaz Fantin de Souza

    2013-04-01

    Full Text Available In this work, a drawing processed was simulated to calculate forces and the resulting residual stresses in the material. The calculated residual stresses were compared with experimentally measured residual stresses by the Neutron Diffraction Method. The modeled process was the Wire Drawing. The necessary parameters to model the process were taken from an industrial currently used process. Rods of an AISI 1045 steel with nominal diameters of 21.46 mm were reduced to 20.25 mm by drawing with an drawing angle of 15°. Compression tests were used to determinate flow curves of the real material an used in the simulation models. The possibility to estimate drawing forces by numerical simulation was evaluated by comparing simulated results with values from empirical equations given by the literature. The results have shown a sufficient accuracy for the calculation of forces, but the comparison of residual stresses has shown differences to the experimentally determined ones that can be minimized by the consideration of high strain rates in the compression tests, anisotropy of the material and kinematic hardening.

  10. Research on Melt Degassing Processes of High Conductivity Hard Drawn Aluminum Wire

    Science.gov (United States)

    Xu, Xuexia; Feng, Yanting; Wang, Qing; Li, Wenbin; Fan, Hui; Wang, Yong; Li, Guowei; Zhang, Daoqian

    2018-03-01

    Degassing effects of ultrasonic and vacuum processes on high conductivity hard drawn aluminum melt were studied. Results showed that the degassing efficiency improved with the increase of ultrasonic power within certain range, stabilizing at 70% with 240W. For vacuum degassing process, hydrogen content of aluminum melt decreased with the loading time and was linear with logarithm of vacuum degree. Comparison of degassing effects of ultrasonic, vacuum, vacuum-ultrasonic degassing process showed that vacuum-ultrasonic process presented optimal effect.

  11. Progress in Effect of Nano-modified Coatings and Welding Process Parameters on Wear of Contact Tube for Non-copper Coated Solid Wires

    Directory of Open Access Journals (Sweden)

    LI Zhuo-xin

    2017-12-01

    Full Text Available Environment-friendly non-copper coated solid wire is the main developing trend for gas shielded solid wires, whereas wear of contact tube limits their wide application. The effect of nano-modified coatings and welding process parameters on wear of contact tube for non-copper coated solid wires was reviewed. It was found that the wear of contact tube can be reduced due to the formation of tribo-films on the rubbing surfaces of welding wires against contact tube; it is feasible to decrease contact tube wear when non-copper coated solid wires are coated with nano-modified lubricants, thereby displaying excellent lubricating and thermal or electrical conduction characteristics. The wear of contact tube increases with the increase of welding current. The wear of contact tube is worse in direct-current electrode positive (DCEP than in direct-current electrode negative (DCEN. Arc ablation and electrical erosion are the dominant wear mechanisms of contact tube.

  12. Direct Mechanism of the First Carbon-Carbon Bond Formation in the Methanol-to-Hydrocarbons Process.

    Science.gov (United States)

    Wu, Xinqiang; Xu, Shutao; Zhang, Wenna; Huang, Jindou; Li, Jinzhe; Yu, Bowen; Wei, Yingxu; Liu, Zhongmin

    2017-07-24

    In the past two decades, the reaction mechanism of C-C bond formation from either methanol or dimethyl ether (DME) in the methanol-to-hydrocarbons (MTH) process has been a highly controversial issue. Described here is the first observation of a surface methyleneoxy analogue, originating from the surface-activated DME, by in situ solid-state NMR spectroscopy, a species crucial to the first C-C bond formation in the MTH process. New insights into the first C-C bond formation were provided, thus suggesting DME/methanol activation and direct C-C bond formation by an interesting synergetic mechanism, involving C-H bond breakage and C-C bond coupling during the initial methanol reaction within the chemical environment of the zeolite catalyst. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

  13. Photocatalytic Properties of Silver Core/Titania Shell Nano-Wires Grown on a Glass Substrate Using a Glycothermal Process Assisted by a Photochemical Reaction.

    Science.gov (United States)

    Song, Duck-Hyun; Hirato, Tetsuji

    2015-07-01

    A silver core/titania shell nano-wire film was successfully prepared on a glass substrate via a glycothermal process that was assisted by a photochemical reaction using tetra-n-butyl titanate as the titanium source and silver nitrate as the silver source in an autoclave with ethylene glycol as a solvent. The morphology, diameter, length, and density of the core/shell nano-wires that were synthesized could be varied by changing the silver/titanium molar ratio of the starting materials. The samples produced were characterized by X-ray diffraction and scanning electron microscopy. The photocatalytic activity of the silver core/titania shell nano-wire film was investigated by measuring the photodegradation rate of rhodamine B in aqueous solution.

  14. Design of an empirical process model and algorithm for the Tungsten Inert Gas wire+arc additive manufacture of TI-6AL-4V components

    OpenAIRE

    Martina, Filomeno; Williams, Stewart; Colegrove, Paul

    2013-01-01

    In the wire+arc additive manufacture process parameters can be varied to achieve a wide range of deposit widths, as well as layer heights. Pulsed Tungsten Inert Gas was chosen as the deposition process. A working envelope was developed, which ensures unfeasible parameters combinations are excluded from the algorithm. Thanks to an extensive use of a statistically designed experiment, it was possible to produce process equations through linear regression, for both wall width and ...

  15. Novel corrosion experiments using the wire beam electrode: (II) Monitoring the effects of ions transportation on electrochemical corrosion processes

    International Nuclear Information System (INIS)

    Aung, Naing Naing; Tan, Yong-Jun; Liu, Tie

    2006-01-01

    An electrochemically integrated multi-electrode system namely the wire beam electrode (WBE) has been applied for the first time to study the effects of the transportation of electrochemically active species on the process, rate and pattern of electrochemical corrosion. The objective of this work is to demonstrate the applicability of the WBE method for investigating ion transportation related corrosion processes. A series of experiments have been carried out using WBEs made from mild steel and stainless steel wires. The WBE working surfaces were exposed to simulated diffusion-controlled corrosion environments where there were diffusion induced ions concentration gradients (termed diffusion-corrosion environment). Corrosion potential and current distribution maps (CPCD maps) were measured from WBE surfaces in continuous bases. Typical patterns have been identified from CPCD maps and the characteristics of these patterns have been found to depend heavily upon the type of electrode material and the type of corrosive ion. For mild steel WBE surface exposed to a diffusion-corrosion environment containing NiSO 4 or FeCl 3 , the characteristic pattern in CPCD maps was found to emulate NiSO 4 or FeCl 3 concentration gradients, suggesting an ion-concentration controlled corrosion behaviour. However, when the mild steel WBE surface was exposed to a diffusion-corrosion environment containing NaCl, the characteristic pattern was found to show higher cathodic currents along the WBE edges with the magnitude decreasing in a contour-like manner towards the centre of the WBE surface, suggesting an oxygen concentration-controlled corrosion behaviour. When a stainless steel (SS316L) WBE surface was exposed to a diffusion-corrosion environment containing NiSO 4 or NaCl, the corrosion pattern appeared to be mainly determined by the random distribution of weak sites in passive film. When the SS316L WBE was exposed to a diffusion-corrosion environment containing FeCl 3 , the CPCD map

  16. Recovery of Metallic Materials from Printed Wiring Boards by Green Pyrolysis Process

    Directory of Open Access Journals (Sweden)

    Alex LUYIMA

    2012-09-01

    Full Text Available Currently, the main options for the treatment of electronic waste are involved in reuse, remanufacturing, and recycling, as well as incineration and land filling. Recycling of e-waste can be broadly divided into three major steps: (a disassembly: selectively disassembly, targeting on singling out hazardous or valuable components for special treatment, is an indispensable process in recycling of e-waste; (b upgrading: using mechanical processing and/or metallurgical processing to up-grade desirable materials content, i. e. preparing materials for refining process; (c refining: in the last step, recovered materials are retreated or purified by using chemical (metallurgical processing so as to be acceptable for their original usage. To investigate an environmentally friendly process to recycle PWBs, the milled PWB powder samples with and without additives were pyrolyzed. Liquid, gas and solid products were achieved with different conversion fraction. PWB powders were pyrolyzed and in a thermo-gravimetric analysis, differential thermal analysis (TG/DTA and exhausted gases were analyzed by mass spectrometer (MS. Analysis of the exhaust gases from the experiments using TG-DTA-MS showed that without CaCO3 additives poisonous gases such as C6H6 and HBr were produced which were adequately controlled if CaCO3 was added.DOI: http://dx.doi.org/10.5755/j01.ms.18.3.2432

  17. Application of continual annealing and roll bonding (CAR) process for manufacturing Al–Zn multilayered composites

    International Nuclear Information System (INIS)

    Dehsorkhi, Reza Nasiri; Qods, Fathallah; Tajally, Mohammad

    2012-01-01

    Highlights: ► CAR process was performed on Al–Zn composite. ► Good bonding between layers was achieved by increasing the number of CAR cycles. ► With increasing number of cycles, a good distribution of Zn fragmentations was achieved. ► The composites which were produced by CAR process, possess a higher tensile strength and elongation than ARB process. ► By EDX analysis it is proved that Al and Zn atoms would diffuse with each other. - Abstract: In this study, an aluminium–zinc composite was produced for the first time by using a continual annealing and roll-bonding (CAR) process. A composite with homogeneous distribution of fragmented zinc layers in aluminium matrix was produced after ten CAR cycles. The results demonstrate that tensile strength of the final composites increases up to 410 MPa, which is about 4 times higher than those of initial aluminium and zinc sheets. However, elongation of the composite reduced down to 4% after ten CAR cycles. The fracture surfaces of the tensile samples were observed by scanning electron microscope (SEM) to evaluate the failure mode. Observations reveal that the failure mode in CAR-processed composites is a typical ductile fracture which shows deep dimples in samples with few CAR cycles, while the failure mode was shear ductile fracture with shallow and elongated dimples in samples with ten CAR cycles.

  18. Laser dressing process of porous cast-iron bonded diamond grinding wheels for machining ceramics

    International Nuclear Information System (INIS)

    Jodan, K.; Funakoshi, H.; Matsumaru, K.; Ishizaki, K.

    2000-01-01

    Dressing using Yttrium Aluminum Garnet-Second Harmonic Generation (YAG-SHG) laser for porous cast-iron bonded diamond grinding wheels is a unique method. Diamond as an abrasive grain shows transparency with the laser, while cast-iron employed as a bonding and bridging material for the present diamond grinding wheels absorbs it. Hence, it is possible for laser to remove cast-iron selectively with a minimal damage on diamond so that dressing can be optimized. In this investigation a newly proposed dressing process using YAG-SHG laser with the wavelength of 532 nm was conducted upon porous cast-iron bonded diamond grinding wheels with fine grains. It revealed that application of laser for dressing evaporates cast-iron and the amount of evaporation increases with laser flux densities, resulting in an increment of protrusion heights. The wheel dressed with laser allows about six times of removal volume rate on ZrO 2 at the maximum rather than the same wheel mechanically dressed. It also achieves 90 times less specific grinding energy. With the increase of laser flux density, the removal volume of ground work pieces can be increased or the specific grinding energy decreased. The laser dressed wheels can also achieve the same surface roughness on ground surfaces as mechanically dressed wheels. Copyright (2000) AD-TECH - International Foundation for the Advancement of Technology Ltd

  19. Microstructure and mechanical properties of nickel processed by accumulative roll bonding

    DEFF Research Database (Denmark)

    Zhang, Yubin; Mishin, Oleg; Kamikawa, N.

    2013-01-01

    A detailed investigation of the microstructure and mechanical properties has been conducted in pure nickel deformed to high strains using accumulative roll bonding (ARB). Samples have been investigated after different numbers of ARB cycles and the results have been compared with data for nickel...... processed by other deformation techniques, with particular focus on conventional rolling. It is found that the structural evolution in ARB-processed nickel is rapid at low strains followed by a slower evolution as the strain approaches ultrahigh levels. Comparing samples processed by ARB and by conventional...... rolling to an identical nominal strain, the microstructure after ARB is more refined and contains a greater fraction of high angle boundaries. This enhanced refinement is attributed to the geometric accumulation of shear-strain influenced volumes as a result of the ARB process and large-draught rolling...

  20. A Comprehensive Wiring Diagram of the Protocerebral Bridge for Visual Information Processing in the Drosophila Brain

    Directory of Open Access Journals (Sweden)

    Chih-Yung Lin

    2013-05-01

    Full Text Available How the brain perceives sensory information and generates meaningful behavior depends critically on its underlying circuitry. The protocerebral bridge (PB is a major part of the insect central complex (CX, a premotor center that may be analogous to the human basal ganglia. Here, by deconstructing hundreds of PB single neurons and reconstructing them into a common three-dimensional framework, we have constructed a comprehensive map of PB circuits with labeled polarity and predicted directions of information flow. Our analysis reveals a highly ordered information processing system that involves directed information flow among CX subunits through 194 distinct PB neuron types. Circuitry properties such as mirroring, convergence, divergence, tiling, reverberation, and parallel signal propagation were observed; their functional and evolutional significance is discussed. This layout of PB neuronal circuitry may provide guidelines for further investigations on transformation of sensory (e.g., visual input into locomotor commands in fly brains.

  1. High-performance MgB2 superconducting wires for use under liquid-helium-free conditions fabricated using an internal Mg diffusion process

    Science.gov (United States)

    Ye, ShuJun; Song, Minghui; Matsumoto, Akiyoshi; Togano, Kazumasa; Takeguchi, Masaki; Ohmura, Takahito; Kumakura, Hiroaki

    2013-12-01

    MgB2 has a superconducting transition temperature (Tc) of 39 K, which is much higher than that for practical metallic superconductors. Thus, it is hoped that MgB2 can not only replace metallic superconductors, but can be used under liquid-helium-free conditions, for example, at temperatures of 10-20 K that can easily be achieved using cryocooling systems. However, to date, the reported critical current density (Jc) for MgB2 wires is not high enough for large-scale applications in liquid-helium-free conditions. In the present study, successful fabrication of high-performance MgB2 superconducting wires was carried out using an internal Mg diffusion (IMD) process, involving a p-dimethylbenzene (C8H10) pre-treatment of carbon-coated B powder with nanometer-sized particles. The resulting wires exhibited the highest ever Jc of 1.2 × 105 A cm-2 at 4.2 K and 10 T, and an engineering critical current density (Je) of about 1 × 104 A cm-2. Not only in 4.2 K, but also in 10 K, the Jc values for the wires fabricated in the present study are in fact higher than that for Nb-Ti wires at 4.2 K for the magnetic fields at which the measurements were carried out. At 20 K and 5 T, the Jc and Je were about 7.6 × 105 A cm-2 and 5.3 × 103 A cm-2, respectively, which are the highest values reported for MgB2 wires to date. The results of a detailed microstructural analysis suggested that the main reason for the superior electrical performance was the high density of the MgB2 layer rather than just the small grain size, and that the critical current could be further increased by suitable control of the microstructure. These high-performance IMD-processed MgB2 wires are thus promising superconductors for applications such as magnetic resonance imaging and maglev trains that can operate under liquid-helium-free conditions.

  2. Processing, Structural Characterization and Comparative Studies on Uniaxial Tensile Properties of a New Type of Porous Twisted Wire Material

    Directory of Open Access Journals (Sweden)

    Fei Wu

    2015-08-01

    Full Text Available A self-developed rotary multi-cutter device cuts stainless steel wire ropes into segments to fabricate twisted wires. Stainless steel porous twisted wire materials (PTWMs with a spatial composite intertexture structure are produced by the compaction and subsequent vacuum solid-phase sintering of twisted wires. The stainless steel PTWMs show two types of typical uniaxial tensile failure modes, i.e., a 45° angle fracture mode and an auxetic failure mode (the PTWMs expand along the direction perpendicular to the tension. The effects of the sintering parameters, porosities, wire diameters, and sampling direction on the tensile properties of the PTWMs are carefully investigated. By increasing the sintering temperature from 1130 °C to 1330 °C, the tensile strength of the PTWMs with 70% target porosity increased from 7.7 MPa to 28.6 MPa and the total failure goes down to 50%. When increasing the sintering time from 90 min to 150 min, the tensile strength increases from 12.4 MPa to 19.1 MPa and the total failure elongation drops to 78.6%. The tensile strength of the PTWMs increases from 28.9 MPa to 112.7 MPa with decreasing porosity from 69.5% to 46.0%, and the total failure elongation also increases from 14.8% to 40.7%. The tensile strength and the failure strain of the PTWMs with fine wires are higher than those of the PTWMs with coarse wires under the same porosity. Sampling direction has a small influence on the tensile properties of the PTWMs.

  3. Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

    CERN Document Server

    Brönnimann, C; Gobrecht, J; Heising, S; Horisberger, M; Horisberger, R P; Kästli, H C; Lehmann, J; Rohe, T; Streuli, S; Broennimann, Ch.

    2006-01-01

    The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflown indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflown afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a seco...

  4. Friction Melt Bonding: An innovative process for aluminium-steel lap joints

    Directory of Open Access Journals (Sweden)

    Simar Aude

    2013-11-01

    Full Text Available A new process based on Friction Stir Welding has been developed to weld dissimilar metals, particularly steel and aluminum, in a lap-joint configuration. In this Friction Melt Bonding process, frictional heat generated by the rotating and translating tool brings about local and transient melting (Figure 1. Welding then occurs owing to controlled reactivity and solidification at the interface between the two plates. With an adequate choice of the welding parameters, low alloy steel and aluminium alloys have been successfully welded. Characterisation of the microstructure was systematically performed to highlight the influence of the process parameters, particularly the temperature cycle, on the steel-Al interface. The thickness of the intermetallic layer varies from a couple of micrometers to tens of micrometers depending on the advancing speed of the tool (Fig. 2. The lap shear properties of the joints were also investigated and analysed based on the morphology of the intermetallic layer.

  5. Investigation of the impact of cleaning on the adhesive bond and the process implications

    Energy Technology Data Exchange (ETDEWEB)

    EMERSON,JOHN A.; GUESS,TOMMY R.; ADKINS,CAROL L. JONES; CURRO,JOHN G.; REEDY JR.,EARL DAVID; LOPEZ,EDWIN P.; LEMKE,PAUL A.

    2000-05-01

    While surface cleaning is the most common process step in DOE manufacturing operations, the link between a successful adhesive bond and the surface clean performed before adhesion is not well understood. An innovative approach that combines computer modeling expertise, fracture mechanics understanding, and cleaning experience to address how to achieve a good adhesive bond is discussed here to develop a capability that would result in reduced cleaning development time and testing, improved bonds, improved manufacturability, and even an understanding that leads to improved aging. A simulation modeling technique, polymer reference interaction site model applied near wall (Wall PRISM), provided the capability to include contaminants on the surface. Calculations determined an approximately 8% reduction in the work of adhesion for 1% by weight of ethanol contamination on the structure of a silicone adhesive near a surface. The demonstration of repeatable coatings and quantitative analysis of the surface for deposition of controlled amounts of contamination (hexadecane and mineral oil) was based on three deposition methods. The effect of the cleaning process used on interfacial toughness was determined. The measured interfacial toughness of samples with a Brulin cleaned sandblasted aluminum surface was found to be {approximately} 15% greater than that with a TCE cleaned aluminum surface. The sensitivity of measured fracture toughness to various test conditions determined that both interfacial toughness and interface corner toughness depended strongly on surface roughness. The work of adhesion value for silicone/silicone interface was determined by a contact mechanics technique known as the JKR method. Correlation with fracture data has allowed a better understanding between interfacial fracture parameters and surface energy.

  6. Modern wiring practice

    CERN Document Server

    Steward, W E

    2012-01-01

    Continuously in print since 1952, Modern Wiring Practice has now been fully revised to provide an up-to-date source of reference to building services design and installation in the 21st century. This compact and practical guide addresses wiring systems design and electrical installation together in one volume, creating a comprehensive overview of the whole process for contractors and architects, as well as electricians and other installation engineers. Best practice is incorporated throughout, combining theory and practice with clear and accessible explanation, all

  7. Effect of two abrasive systems on resin bonding to laboratory-processed indirect resin composite restorations.

    Science.gov (United States)

    Bouschlicher, M R; Cobb, D S; Vargas, M A

    1999-01-01

    This study compared two methods of surface roughening or preparation, with or without the use of proprietary surface wetting agents, to evaluate their effect on resin cement adhesion to the following laboratory-processed, indirect restorations: Artglass (AG), belleGlass HP (BG), Concept (C), and Targis (T). Methods of surface roughening or preparation included microetching with aluminum oxide (AO): 50 microns at 34 psi and silanized silica coating, CoJet-Sand (CJ): 30 microns at 34 psi. Artglass and Concept were tested with and without the use of their respective surface wetting agents: Artglass Liquid (AGL) and Special Bond II (SB). One hundred twenty specimens, each consisting of a pair of cylinders (7.0 x 3 mm and 4.3 x 3 mm) were fabricated. The larger cylinder or base was embedded in self-curing resin in a phenolic ring, and bonding surfaces were finished with 320-grit silicon carbide paper. Specimen pairs for each restorative material were randomly assigned to treatment groups (n = 10) and received the following surface treatments prior to cementation: group 1 (AG/AO/+AGL), group 2 (AG/AO/-AGL), group 3 (AG/CJ/+AGL), group 4 (AG/CJ/-AGL), group 5 (BG/AO), group 6 (BG/CJ), group 7 (C/AO/+SB), group 8 (C/AO/-SB), group 9 (C/CJ/+SB), group 10 (C/CJ/-SB), group 11 (T/AO), and group 12 (T/CJ). Specimen pairs were cemented with a dual-cure resin cement (Dual) and a standardized force of 1 MPa. Specimens were light-cured 40 seconds per side (80 s total), then thermocycled 300 times at between 5 degrees and 55 degrees C. Shear bond strengths (MPa) were determined using a Zwick Materials Testing Machine at a crosshead speed of 5 mm per minute. One-way analysis of variance (ANOVA) and Duncan's multiple range test (alpha = 0.05) by restoration type indicated no significant differences in shear bond strength between BG group 5 (29.8 +/- 5.8), BG group 6 (28.3 +/- 4.3), T group 11 (29.3 +/- 4.9), and T group 12 (29.0 +/- 4.4). Shear bond strength in AG group 3 (35.9 +/- 3

  8. Bane of Hydrogen-Bond Formation on the Photoinduced Charge-Transfer Process in Donor–Acceptor Systems

    KAUST Repository

    Alsam, Amani Abdu

    2017-03-14

    Controlling the ultrafast dynamical process of photoinduced charge transfer at donor acceptor interfaces remains a major challenge for physical chemistry and solar cell communities. The process is complicated by the involvement of other complex dynamical processes, including hydrogen bond formation, energy transfer, and solvation dynamics occurring on similar time scales. In this study, we explore the remarkable impact of hydrogen-bond formation on the interfacial charge transfer between a negatively charged electron donating anionic porphyrin and a positively charged electron accepting pi-conjugated polymer, as a model system in solvents with different polarities and capabilities for hydiogen bonding using femtosecond transient absorption spectroscopy. Unlike the conventional understanding of the key role of hydrogen bonding in promoting the charge-transfer process, our steadystate and time-resolved results reveal that the intervening hydrogen-bonding environment and, consequently, the probable longer spacing between the donor and acceptor molecules significantly hinders the charge-transfer process between them. These results show that site-specific hydrogen bonding and geometric considerations between donor and acceptor can be exploited to control both the charge-transfer dynamics and its efficiency not only at donor acceptor interfaces but also in complex biological systems.

  9. Processing and Protection of Rare Earth Permanent Magnet Particulate for Bonded Magnet Applications

    Energy Technology Data Exchange (ETDEWEB)

    Sokolowski, Peter Kelly [Iowa State Univ., Ames, IA (United States)

    2007-01-01

    Rapid solidification of novel mixed rare earth-iron-boron, MRE2Fe14B (MRE = Nd, Y, Dy; currently), magnet alloys via high pressure gas atomization (HPGA) have produced similar properties and structures as closely related alloys produced by melt spinning (MS) at low wheel speeds. Recent additions of titanium carbide and zirconium to the permanent magnet (PM) alloy design in HPGA powder (using He atomization gas) have made it possible to achieve highly refined microstructures with magnetic properties approaching melt spun particulate at cooling rates of 105-106K/s. By producing HPGA powders with the desirable qualities of melt spun ribbon, the need for crushing ribbon was eliminated in bonded magnet fabrication. The spherical geometry of HPGA powders is more ideal for processing of bonded permanent magnets since higher loading fractions can be obtained during compression and injection molding. This increased volume loading of spherical PM powder can be predicted to yield a higher maximum energy product (BH)max for bonded magnets in high performance applications. Passivation of RE-containing powder is warranted for the large-scale manufacturing of bonded magnets in applications with increased temperature and exposure to humidity. Irreversible magnetic losses due to oxidation and corrosion of particulates is a known drawback of RE-Fe-B based alloys during further processing, e.g. injection molding, as well as during use as a bonded magnet. To counteract these effects, a modified gas atomization chamber allowed for a novel approach to in situ passivation of solidified particle surfaces through injection of a reactive gas, nitrogen trifluoride (NF3). The ability to control surface chemistry during atomization processing of fine spherical RE-Fe-B powders produced advantages over current processing methodologies. In particular, the capability to coat particles while 'in flight' may eliminate the

  10. Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

    International Nuclear Information System (INIS)

    Yan, Jianfeng; Zou, Guisheng; Wu, Ai-ping; Ren, Jialie; Yan, Jiuchun; Hu, Anming; Zhou, Y.

    2012-01-01

    We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.

  11. Recycling of Manganese Secondary Raw Material Via Cold-Bond Pelletizing Process

    International Nuclear Information System (INIS)

    Ahmed, Y.M.Z.; Mohamed, F.M.

    2004-01-01

    Large quantities of fines were produced during the shipping, transportation, handling and storage of manganese ore sinter imported from different countries to Sinai Company for ferromanganese production. These fines are generally considered as valuable secondary raw materials. Hence, they have a potential to be recycled back to the submerged arc furnace after having been agglomerated. For agglomerates to be considered as feed materials for submerged arc furnace they must have sufficient room temperature strength. Cold-bonded penalization process offers an economically attractive and environmentally viable method for achieving this. Ordinary Portland cement was used in this investigation for the purpose of producing a suitable cold-bonded pellet from such fines. In this investigation, the effect of adding different percentages of Portland cement on the mechanical properties of both green and pellet dried at room temperature for 1, 3, 7, 14, and 28 days of normal curing were studied. The results revealed that, although the compressive strength of green pellets improved with the increase of the amount of cement added. retardation in pellet drop strength was reported. Whereas, the increase in both the cement content and time of drying leads to increase in the mechanical properties of pellets normally cured at room temperature. pellets obtain with the addition of 9% cement shows reasonable mechanical properties to be charged in the submerged are furnace. ferromanganese alloy having a standard range composition was produced in a laboratory submerged are furnace using such pellets

  12. Continuous wet-process growth of ZnO nanoarrays for wire-shaped photoanode of dye-sensitized solar cell.

    Science.gov (United States)

    Tao, Pan; Guo, Wanwan; Du, Jun; Tao, Changyuan; Qing, Shenglan; Fan, Xing

    2016-09-15

    Well-aligned ZnO nanorod arrays have been grown on metal-plated polymer fiber via a mild wet process in a newly-designed continuous reactor, aiming to provide wire-shaped photoanodes for wearable dye-sensitized solar cells. The growth conditions were systematically optimized with the help of computational flow-field simulation. The flow field in the reactor will not only affect the morphology of the ZnO nanorod⧹nanowire but also affect the pattern distribution of nanoarray on the electrode surface. Unlike the sectional structure from the traditional batch-type reactor, ZnO nanorods with finely-controlled length and uniform morphology could be grown from the continuous reactor. After optimization, the wire-shaped ZnO-type photoanode grown from the continuous reactor exhibited better photovoltaic performance than that from the traditional batch-type reactor. Copyright © 2016 Elsevier Inc. All rights reserved.

  13. Void and Phase Evolution during the Processing of Bi-2212 Superconducting Wires monitored by combined fast Synchrotron Micro-tomography and X-Ray Diffraction

    CERN Document Server

    Scheuerlein, C; Scheel, M; Jiang, J; Kametani, F; Malagoli, A; Hellstrom, E E; Larbalestier, D C

    2011-01-01

    Recent study of the current-limiting mechanisms in Bi-2212 round wires has suggested that agglomeration of the residual Bi-2212 powder porosity into bubbles of filament-diameter size occurs on melting the Bi-2212 filaments. These pores introduce a major obstacle to current flow, which greatly reduces the critical current density (Jc). Here we present an in situ non-destructive tomographic and diffraction study of the changes occurring during the heat treatment of wires and starting powder, as well as a room temperature study of ex situ processed wires. The in situ through-process study shows that the agglomeration of residual porosity is more complex than previously seen. Filament changes start with coalescence of the quasi-uniform and finely divided powder porosity into lens-shaped defects at about 850 0C when the Bi-2201 impurity phase decomposes before the Bi-2212 starts to melt. These lens-shaped voids grow to bubbles of a filament diameter on melting of the Bi-2212 and continue to lengthen and then to ag...

  14. Bubble Formation within Filaments of Melt-Processed Bi2212 wires and its strongly negative effect on the Critical Current Density

    CERN Document Server

    Kametani, F; Jiang, J; Scheuerlein, C; Malagoli, A; Di Michiel, M; Huang, Y; Miao, H; Parrell, J A; Hellstrom, E E; Larbalestier, D C

    2011-01-01

    Most studies of Bi2Sr2CaCu2Ox (Bi2212) show that the critical current density Jc is limited by the connectivity of the filaments, but what determines the connectivity is still elusive. Here we report on the role played by filament porosity in limiting Jc. By a microstructural investigation of wires quenched from the melt state, we find that porosity in the unreacted wire agglomerates into bubbles that segment the Bi2212 melt within the filaments into discrete sections. These bubbles do not disappear during subsequent processing because they are only partially filled by Bi2212 grains as the Bi2212 forms on cooling. Correlating the microstructure of quenched wires to their final, fully processed Jc values shows an inverse relation between Jc and bubble density. Bubbles are variable between conductors and perhaps from sample to sample, but they occur frequently and almost completely fill the filament diameter, so they exert a strongly variable but always negative effect on Jc. Bubbles reduce the continuous Bi221...

  15. Low-Cost, Manufacturable, 6-Inch Wafer Bonding Process for Next-Generation 5-Junction IMM+Ge Photovoltaic Devices Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose the development of a 6-inch wafer bonding process to allow bonding of a multi-junction inverted metamorphic (IMM) tandem solar cell structure to an...

  16. Molecular wires, switches and memories

    Science.gov (United States)

    Chen, Jia

    Molecular electronics, an emerging field, makes it possible to build individual molecules capable of performing functions identical or analogous to present- day conductors, switches, or memories. These individual molecules, with a nano-meter scale characteristic length, can be designed and chemically synthesized with specific atoms, geometries and charge distribution. This thesis focuses on the design, and measurements of molecular wires, and related strategically engineered structures-molecular switches and memories. The experimental system relies on a thermodynamically driven self-assembling process to attach molecules onto substrate surfaces without intervention from outside. The following topics will be discussed: directed nanoscale manipulation of self-assembled molecules using scanning tunneling microscope; investigation on through-bond transport of nanoscale symmetric metal/conjugated self- assembled monolayers (SAM)/metal junctions, where non- Ohmic thermionic emission was observed to be the dominant process, with isocyanide-Pd contacts showing the lowest thermionic barrier of 0.22 eV; the first realization of robust and large reversible switching behavior in an electronic device that utilizes molecules containing redox centers as the active component, exhibiting negative differential resistance (NDR) and large on-off peak-to-valley ratio (PVR); observation of erasable storage of higher conductivity states in these redox- center containing molecular devices, and demonstration of a two-terminal electronically programmable and erasable molecular memory cell with long bit retention time.

  17. Mechanical and superconducting properties of PIT-processed MgB{sub 2} wire after heat treatment

    Energy Technology Data Exchange (ETDEWEB)

    Yamamoto, K [Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Yoshida-Honmachi, Kyoto 606-8501 (Japan); Osamura, K [Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Yoshida-Honmachi, Kyoto 606-8501 (Japan); Balamurugan, S [Department of Electrical Engineering, Kyoto University, Sakyo-ku, Yoshida-Honmachi, Kyoto 606-8501 (Japan); Nakamura, T [Department of Electrical Engineering, Kyoto University, Sakyo-ku, Yoshida-Honmachi, Kyoto 606-8501 (Japan); Hoshino, T [Department of Electrical Engineering, Kyoto University, Sakyo-ku, Yoshida-Honmachi, Kyoto 606-8501 (Japan); Muta, I [Department of Electrical Engineering, Kyoto University, Sakyo-ku, Yoshida-Honmachi, Kyoto 606-8501 (Japan)

    2003-09-01

    The mechanical and superconducting properties of MgB{sub 2} wires heat treated at various conditions have been investigated. Superconducting MgB{sub 2} wires, fabricated by the powder-in-tube (PIT) method, show a transition temperature T{sub c} at 32.4 K for the as-rolled wire as shown by dc-resistivity measurement. It is found that the T{sub c} is improved (37.3-38.4 K) by subsequent Ar annealing treatment under various sintering temperatures and times. Remarkably, the annealed samples show significant improvement in the overall quality of the samples. On annealing at 1323 K for 0.6 ks, we obtained the best quality sample with a J{sub c} of 470 A mm{sup -2} at 2.0 T. In order to find out the irreversible field (B{sub irr}), the technique of the Kramer plot was applied. The B{sub irr} obtained was 7.6 and 9.6 T, for the as-rolled as well as the annealed samples at 1073 K for 3.6 ks, respectively. The mechanical properties were measured under tensile load. The yield stress was 450 MPa for the as-rolled sample and decreased by annealing at 1323 K for 0.6 ks to 110 MPa. After the wires were heat treated at temperatures between 1073 and 1323 K and tensile-stressed up to their yield stress at room temperature. The critical current measurements were carried on such samples at 4.2 K under applied magnetic fields of 2 and 5 T. The stress level for the 95% tolerance of critical current was determined to 97 MPa.

  18. In-situ experimental evidence on R-phase related deformation processes in activated NiTi wires

    Czech Academy of Sciences Publication Activity Database

    Šittner, Petr; Sedlák, Petr; Landa, Michal; Novák, Václav; Lukáš, Petr

    438-440, - (2006), s. 579-584 ISSN 0921-5107 R&D Projects: GA AV ČR IAA1048107; GA ČR GA202/04/2016 Institutional research plan: CEZ:AV0Z10100520; CEZ:AV0Z10480505; CEZ:AV0Z20760514 Keywords : memory alloys * NiTi wires * ultrasonics * neutron diffraction Subject RIV: BM - Solid Matter Physics ; Magnetism

  19. In vitro tensile bond strength of denture repair acrylic resins to primed base metal alloys using two different processing techniques.

    Science.gov (United States)

    Banerjee, Sarmistha; Engelmeier, Robert L; O'Keefe, Kathy L; Powers, John M

    2009-12-01

    Approximately 38% of removable partial denture (RPD) failures involve fracture at the alloy/acrylic interface. Autopolymerizing resin is commonly used to repair RPDs. Poor chemical bonding of repair acrylic to base metal alloys can lead to microleakage and failure of the bond. Therefore, ideal repair techniques should provide a strong, adhesive bond. This investigation compared the tensile bond strength between cobalt-chromium (Super Cast, Pentron Laboratory Technologies, Llc., Wallingford, CT) and nickel-chromium (Rexalloy, Pentron Laboratory Technologies, Llc.) alloys and autopolymerized acrylic resin (Dentsply Repair Material, Dentsply Int, Inc, York, Pa) using three primers containing different functional monomers [UBar (UB), Sun Medical Co., Ltd., Shiga, Japan: Alloy Primer (AP) Kuraray Medical Inc., Okayama, Japan; and MR Bond (MRB) Tokyuyama Dental Corp., Tokyo, Japan] and two processing techniques (bench cure and pressure-pot cure). One hundred and twenty eight base metal alloy ingots were polished, air abraded, and ultrasonically cleaned. The control group was not primed. Specimens in the test groups were primed with one of the three metal primers. Autopolymerized acrylic resin material was bonded to the metal surfaces. Half the specimens were bench cured, and the other half were cured in a pressure pot. All specimens were stored in distilled water for 24 hours at 37 degrees C. The specimens were debonded under tension at a crosshead speed of 0.05 cm/min. The forces at which the bond failed were noted. Data were analyzed using ANOVA. Fisher's PLSD post hoc test was used to determine significant differences (p alloys. Primed sandblasted specimens that were pressure-pot-cured had significantly higher bond strengths than primed sandblasted bench-cured specimens. The pressure-pot-curing method had a significant effect on bond strength of all specimens except Co-Cr alloy primed with UB. The highest bond strength was observed for both Co-Cr and Ni-Cr alloys that

  20. A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding.

    Science.gov (United States)

    Yamaner, F Yalçın; Zhang, Xiao; Oralkan, Ömer

    2015-05-01

    This paper introduces a simplified fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using anodic bonding. Anodic bonding provides the established advantages of wafer-bondingbased CMUT fabrication processes, including process simplicity, control over plate thickness and properties, high fill factor, and ability to implement large vibrating cells. In addition to these, compared with fusion bonding, anodic bonding can be performed at lower processing temperatures, i.e., 350°C as opposed to 1100°C; surface roughness requirement for anodic bonding is more than 10 times more relaxed, i.e., 5-nm rootmean- square (RMS) roughness as opposed to 0.5 nm for fusion bonding; anodic bonding can be performed on smaller contact area and hence improves the fill factor for CMUTs. Although anodic bonding has been previously used for CMUT fabrication, a CMUT with a vacuum cavity could not have been achieved, mainly because gas is trapped inside the cavities during anodic bonding. In the approach we present in this paper, the vacuum cavity is achieved by opening a channel in the plate structure to evacuate the trapped gas and subsequently sealing this channel by conformal silicon nitride deposition in the vacuum environment. The plate structure of the fabricated CMUT consists of the single-crystal silicon device layer of a silicon-on-insulator wafer and a thin silicon nitride insulation layer. The presented fabrication approach employs only three photolithographic steps and combines the advantages of anodic bonding with the advantages of a patterned metal bottom electrode on an insulating substrate, specifically low parasitic series resistance and low parasitic shunt capacitance. In this paper, the developed fabrication scheme is described in detail, including process recipes. The fabricated transducers are characterized using electrical input impedance measurements in air and hydrophone measurements in immersion. A representative

  1. Dental Arch Wire

    Science.gov (United States)

    1979-01-01

    Straightening teeth is an arduous process requiring months, often years, of applying corrective pressure by means of arch wires-better known as brace-which may have to be changed several times in the course of treatment. A new method has been developed by Dr. George Andreasen, orthodontist and dental scientist at the University of Iowa. The key is a new type of arch wire material, called Nitinol, with exceptional elasticity which helps reduce the required number of brace changes. An alloy of nickel and titanium, Nitinol was originally developed for aerospace applications by the Naval Ordnance Laboratory, now the Naval Surface Weapons Laboratory, White Oaks, Maryland. NASA subsequently conducted additional research on the properties of Nitinol and on procedures for processing the metal.

  2. Noncontextual Wirings

    Science.gov (United States)

    Amaral, Barbara; Cabello, Adán; Cunha, Marcelo Terra; Aolita, Leandro

    2018-03-01

    Contextuality is a fundamental feature of quantum theory necessary for certain models of quantum computation and communication. Serious steps have therefore been taken towards a formal framework for contextuality as an operational resource. However, the main ingredient of a resource theory—a concrete, explicit form of free operations of contextuality—was still missing. Here we provide such a component by introducing noncontextual wirings: a class of contextuality-free operations with a clear operational interpretation and a friendly parametrization. We characterize them completely for general black-box measurement devices with arbitrarily many inputs and outputs. As applications, we show that the relative entropy of contextuality is a contextuality monotone and that maximally contextual boxes that serve as contextuality bits exist for a broad class of scenarios. Our results complete a unified resource-theoretic framework for contextuality and Bell nonlocality.

  3. Plasma chemistry in wire chambers

    International Nuclear Information System (INIS)

    Wise, J.

    1990-05-01

    The phenomenology of wire chamber aging is discussed and fundamentals of proportional counters are presented. Free-radical polymerization and plasma polymerization are discussed. The chemistry of wire aging is reviewed. Similarities between wire chamber plasma (>1 atm dc-discharge) and low-pressure rf-discharge plasmas, which have been more widely studied, are suggested. Construction and use of a system to allow study of the plasma reactions occurring in wire chambers is reported. A proportional tube irradiated by an 55 Fe source is used as a model wire chamber. Condensable species in the proportional tube effluent are concentrated in a cryotrap and analyzed by gas chromatography/mass spectrometry. Several different wire chamber gases (methane, argon/methane, ethane, argon/ethane, propane, argon/isobutane) are tested and their reaction products qualitatively identified. For all gases tested except those containing methane, use of hygroscopic filters to remove trace water and oxygen contaminants from the gas resulted in an increase in the average molecular weight of the products, consistent with results from low-pressure rf-discharge plasmas. It is suggested that because water and oxygen inhibit polymer growth in the gas phase that they may also reduce polymer deposition in proportional tubes and therefore retard wire aging processes. Mechanistic implications of the plasma reactions of hydrocarbons with oxygen are suggested. Unresolved issues in this work and proposals for further study are discussed

  4. Concurrent growth of InSe wires and In2O3 tulip-like structures in the Au-catalytic vapour-liquid-solid process

    International Nuclear Information System (INIS)

    Taurino, A; Signore, M A

    2015-01-01

    In this work, the concurrent growth of InSe and In 2 O 3 nanostructures, obtained by thermal evaporation of InSe powders on Au-covered Si substrates, has been investigated by scanning and transmission electron microscopy techniques. The vapour-solid and Au catalytic vapour-liquid-solid growth mechanisms, responsible of the simultaneous development of the two different types of nanostructures, i.e. InSe wires and In 2 O 3 tulip-like structures respectively, are discussed in detail. The thermodynamic processes giving rise to the obtained morphologies and materials are explained. (paper)

  5. Concurrent growth of InSe wires and In2O3 tulip-like structures in the Au-catalytic vapour-liquid-solid process

    Science.gov (United States)

    Taurino, A.; Signore, M. A.

    2015-06-01

    In this work, the concurrent growth of InSe and In2O3 nanostructures, obtained by thermal evaporation of InSe powders on Au-covered Si substrates, has been investigated by scanning and transmission electron microscopy techniques. The vapour-solid and Au catalytic vapour-liquid-solid growth mechanisms, responsible of the simultaneous development of the two different types of nanostructures, i.e. InSe wires and In2O3 tulip-like structures respectively, are discussed in detail. The thermodynamic processes giving rise to the obtained morphologies and materials are explained.

  6. Low-temperature bonding process for the fabrication of hybrid glass-membrane organ-on-a-chip devices

    Science.gov (United States)

    Pocock, Kyall J.; Gao, Xiaofang; Wang, Chenxi; Priest, Craig; Prestidge, Clive A.; Mawatari, Kazuma; Kitamori, Takehiko; Thierry, Benjamin

    2016-10-01

    The integration of microfluidics with living biological systems has paved the way to the exciting concept of "organs-on-a-chip," which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass-based devices have long been utilized in the field of microfluidics but the integration of alternative functional elements within multilayered glass microdevices, such as polymeric membranes, remains a challenge. To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimized on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650°C) and quartz/fused silica bonding (1050°C) processes, this method maintains the integrity and functionality of the membrane (Tg 150°C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 h, indicating sufficient bond strength for long-term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.

  7. A real-time FPGA based monitoring and fault detection processing system for the Beam Wire Scanner instruments at CERN

    CERN Document Server

    AUTHOR|(CDS)2070252; Tognolini, Maurizio; Zamantzas, Christos

    The CERN Beam Instrumentation group (BE-BI) is designing a new generation of an instrument called Beam Wire Scanner (BWS). This system uses an actuator to move a very thin wire through a particle beams, back and forth with a movement stroke of pi [rad]. To achieve very fast speed when touching the particle beam with such a small stroke, large torque is applied while the expected smoothness of the displacement is crucial. This system relies on a resolver to determine the angular position and power correctly its Permanent Magnet Synchronous Motor (PMSM). In 2016, a failure of the position acquisition chain has highlighted the severe consequences of such problem, which resulted by 24 hours downtime of the Super Proton Synchrotron (SPS) accelerator with significant financial consequences. This work mitigates this single failure point by taking advantage of the existing redundancy in the sensors embedded on the system. The resolver is compared to two Incremental Optical Position Sensor (IOPS) developed in-house ...

  8. A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles

    International Nuclear Information System (INIS)

    Hirose, Akio; Tatsumi, Hiroaki; Takeda, Naoya; Akada, Yusuke; Ogura, Tomo; Ide, Eiichi; Morita, Toshiaki

    2009-01-01

    The metal-to-metal bonding has been successfully achieved via the bonding process using Ag metallo-organic nanoparticles at a bonding temperature of around 300-, which can be alternative to the current microsoldering in electronics assembly using high-temperature solders. However, further reduction of bonding temperature and/or bonding pressure is needed. In the present research, a novel bonding process through in-situ formation of Ag nanoparticles instead of the filler material of the Ag metallo-organic nanoparticles has been developed. The Ag nanoparticles can form by the reduction of Ag 2 O particles. In this study, the Ag 2 O particles were mixed with triethylene glycol as a reducing agent to form a paste for bonding. The Au coated cylindrical specimens were bonded using the paste. The Ag nanoparticles formed at around 130 to 160 through the reduction process of Ag2O particles with triethylene glycol. The Ag nanoparticles were immediately sintered each other due to a great surface energy per volume. A transmission electron microscope observation revealed that the sintered Ag metallurgically bonded to the Au substrate at around 160 and a dense Ag layer formed after further heating. The tensile strength of the joint bonded at 250 under a bonding pressure of 5MPa was around 60MPa

  9. Piezoelectric and semiconducting coupled power generating process of a single ZnO belt/wire. A technology for harvesting electricity from the environment.

    Science.gov (United States)

    Song, Jinhui; Zhou, Jun; Wang, Zhong Lin

    2006-08-01

    This paper presents the experimental observation of piezoelectric generation from a single ZnO wire/belt for illustrating a fundamental process of converting mechanical energy into electricity at nanoscale. By deflecting a wire/belt using a conductive atomic force microscope tip in contact mode, the energy is first created by the deflection force and stored by piezoelectric potential, and later converts into piezoelectric energy. The mechanism of the generator is a result of coupled semiconducting and piezoelectric properties of ZnO. A piezoelectric effect is required to create electric potential of ionic charges from elastic deformation; semiconducting property is necessary to separate and maintain the charges and then release the potential via the rectifying behavior of the Schottky barrier at the metal-ZnO interface, which serves as a switch in the entire process. The good conductivity of ZnO is rather unique because it makes the current flow possible. This paper demonstrates a principle for harvesting energy from the environment. The technology has the potential of converting mechanical movement energy (such as body movement, muscle stretching, blood pressure), vibration energy (such as acoustic/ultrasonic wave), and hydraulic energy (such as flow of body fluid, blood flow, contraction of blood vessels) into electric energy that may be sufficient for self-powering nanodevices and nanosystems in applications such as in situ, real-time, and implantable biosensing, biomedical monitoring, and biodetection.

  10. Evaluation and Optimization of a Hybrid Manufacturing Process Combining Wire Arc Additive Manufacturing with Milling for the Fabrication of Stiffened Panels

    Directory of Open Access Journals (Sweden)

    Fang Li

    2017-11-01

    Full Text Available This paper proposes a hybrid WAAM (wire arc additive manufacturing and milling process (HWMP, and highlights its application in the fabrication of stiffened panels that have wide applications in aviation, aerospace, and automotive industries, etc. due to their light weight and strong load-bearing capability. In contrast to existing joining or machining methods, HWMP only deposits stiffeners layer-by-layer onto an existing thin plate, followed by minor milling of the irregular surfaces, which provides the possibility to significantly improve material utilization and efficiency without any loss of surface quality. In this paper, the key performances of HWMP in terms of surface quality, material utilization and efficiency are evaluated systematically, which are the results of the comprehensive effects of the deposition parameters (e.g., travel speed, wire-feed rate and the milling parameters (e.g., spindle speed, tool-feed rate. In order to maximize its performances, the optimization is also performed to find the best combination of the deposition and the milling parameters. The case study shows that HWMP with the optimal process parameters improves the material utilization by 57% and the efficiency by 32% compared against the traditional machining method. Thus, HWMP is believed to be a more environmental friendly and sustainable method for the fabrication of stiffened panels or other similar structures.

  11. Fabrication of extremely thermal-stable GaN template on Mo substrate using double bonding and step annealing process

    Science.gov (United States)

    Qing, Wang; Yang, Liu; Yongjian, Sun; Yuzhen, Tong; Guoyi, Zhang

    2016-08-01

    A new layer transfer technique which comprised double bonding and a step annealing process was utilized to transfer the GaN epilayer from a sapphire substrate to a Mo substrate. Combined with the application of the thermal-stable bonding medium, the resulting two-inch-diameter GaN template showed extremely good stability under high temperature and low stress state. Moreover, no cracks and winkles were observed. The transferred GaN template was suitable for homogeneous epitaxial, thus could be used for the direct fabrication of vertical LED chips as well as power electron devices. It has been confirmed that the double bonding and step annealing technique together with the thermal-stable bonding layer could significantly improve the bonding strength and stress relief, finally enhancing the thermal stability of the transferred GaN template. Project supported by the Guangdong Innovative Research Team Program (No. 2009010044), the China Postdoctoral Science Foundation (No. 2014M562233), the National Natural Science Foundation of Guangdong, China (No. 2015A030312011), and the Opened Fund of the State Key Laboratory on Integrated Optoelectronics (No. IOSKL2014KF17).

  12. The Tensile and Shear Bond Strengths of Poly (Methyl Methacrylate) Processed on Electrolytically Etched Ticonium.

    Science.gov (United States)

    1986-05-01

    CLASSIFICATION OF THIS PAGE (4ihen Data Entered) , .. ’ .’ " -’, , :-.. ~ -., , I .. 2 INTRODUCTION The rtention of acrylic denture resins to metal based...the electrochemical etching of base metals, normally associated with metal-etched resin-bonded restorations, as a retentive system for denture acrylic ...While these bond strengths have been high, the retentive strength of denture acrylic resin to electrochemically etched base metals has not been

  13. Stretched Wire Mechanics

    Energy Technology Data Exchange (ETDEWEB)

    Bowden, Gordon; /SLAC

    2005-09-06

    Stretched wires are beginning to play an important role in the alignment of accelerators and synchrotron light sources. Stretched wires are proposed for the alignment of the 130 meter long LCLS undulator. Wire position technology has reached sub-micron resolution yet analyses of perturbations to wire straightness are hard to find. This paper considers possible deviations of stretched wire from the simple 2-dimensional catenary form.

  14. The impact of processing parameters on the properties of Zn-bonded Nd–Fe–B magnets

    Energy Technology Data Exchange (ETDEWEB)

    Kelhar, Luka, E-mail: luka.kelhar@ijs.si [Department for Nanostructured Materials, Jožef Stefan Institute, Jamova cesta 39, Ljubljana 1000 (Slovenia); Zavašnik, Janez [Centre for Electron Microscopy and Microanalysis (CEMM), Jamova cesta 39, Ljubljana 1000 (Slovenia); McGuiness, Paul; Kobe, Spomenka [Department for Nanostructured Materials, Jožef Stefan Institute, Jamova cesta 39, Ljubljana 1000 (Slovenia); Jožef Stefan International Postgraduate School, Jamova cesta 39, Ljubljana 1000 (Slovenia)

    2016-12-01

    We report on the effect of loading factor and pressure on the density and the magnetic properties of Zn-bonded Nd–Fe–B magnets produced by pulsed-electric-current sintering (PECS). The idea behind this study is to fabricate bonded magnets with a metallic binder in order for the bonded magnet to operate at temperatures higher than 180 °C: the current upper-limit for polymer-bonded magnets. These composites are made of hard-magnetic powder in the form of melt-spun ribbons bonded with the low-melting-point metal Zn. The binder additions were varied from 10 to 30 wt%, and pressures of 50 and 500 MPa were applied. The high-pressure mode with 20 wt% Zn resulted in a 24% increase of J{sub r}, compared to the low-pressure mode. The magnetic measurements revealed a maximum remanence of 0.64 T for 10 wt% Zn, while the coercivity is largely unaffected by the processing conditions. The density of the composites was up to 7.0 g/cm{sup 3}, corresponding to 94% of the theoretical density. Compared to commercial polymer-bonded magnets, the Zn-bonded counterparts exhibit a slightly lower J{sub r}, but the coercivity is retained. We show that there is a minor diffusion of Zn into the Nd–Fe–B, forming a 1 μm thin transition layer, but it does not harm the magnetic properties. These metal-bonded Nd–Fe–B magnets are ideal for use in high-temperature automotive applications like under-the-hood sensors and other magnet-based devices that are close to the engine. - Highlights: • Fabrication of Zn-bonded Nd–Fe–B magnets by pulsed electric current sintering. • Interesting for automotive applications with temperature exceeding 180 °C. • Variations of pressure and loading factor result in higher density and remanence. • Minor diffusion of Zn binder into the MQP-B ribbons is revealed, but does not decrease the magnetic properties. • More stable magnetic properties at high-temperature due to metallic Zn-binder.

  15. Gold recovery from printed wiring board using bioleaching

    Energy Technology Data Exchange (ETDEWEB)

    Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

    2004-07-01

    In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

  16. Unraveling the degradation of artificial amide bonds in nylon oligomer hydrolase: from induced-fit to acylation processes.

    Science.gov (United States)

    Baba, Takeshi; Boero, Mauro; Kamiya, Katsumasa; Ando, Hiroyuki; Negoro, Seiji; Nakano, Masayoshi; Shigeta, Yasuteru

    2015-02-14

    To elucidate how the nylon oligomer hydrolase (NylB) acquires its peculiar degradation activity towards non-biological amide bonds, we inspected the underlying enzymatic processes going from the induced-fit upon substrate binding to acylation. Specifically we investigated the mutational effects of two mutants, Y170F and D181G, indicated in former experiments as crucial systems because of their specific amino acid residues. Therefore, by adopting first-principles molecular dynamics complemented with metadynamics we provide a detailed insight into the underlying acylation mechanism. Our results show that while in the wild type (WT) the Tyr170 residue points the NH group towards the proton-acceptor site of an artificial amide bond, hence ready to react, in the Y170F this does not occur. The reason is ascribed to the absence of Tyr170 in the mutant, which is replaced by phenylalanine, which is unable to form hydrogen bond with the amide bond; thus, resulting in an increase in the activation barrier of more than 10 kcal mol(-1). Nonetheless, despite the lack of hydrogen bonding between the Y170F and the substrate, the highest free energy barrier for the induced-fit is similar to that of WT. This seems to suggest that in the induced-fit process, kinetics is little affected by the mutation. On the basis of additional structural homology analyses on the enzymes of the same family, we suggest that natural selection is responsible for the development of the peculiar hydrolytic activity of Arthrobacter sp. KI72.

  17. Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

    Science.gov (United States)

    Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

    2018-03-01

    Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

  18. Mechanical properties and formation mechanisms of a wire of single gold atoms

    DEFF Research Database (Denmark)

    Rubio-Bollinger, G.; Bahn, Sune Rastad; Agrait, N.

    2001-01-01

    A scanning tunneling microscope supplemented with a force sensor is used to study the mechanical properties of a novel metallic nanostructure: a freely suspended chain of single gold atoms. We find that the bond strength of the nanowire is about twice that of a bulk metallic bond. We perform ab i...... stiffness of the nanostructure is strongly affected by the detailed local atomic arrangement at the chain bases.......A scanning tunneling microscope supplemented with a force sensor is used to study the mechanical properties of a novel metallic nanostructure: a freely suspended chain of single gold atoms. We find that the bond strength of the nanowire is about twice that of a bulk metallic bond. We perform ab...... initio calculations of the force at chain fracture and compare quantitatively with experimental measurements. The observed mechanical failure and nanoelastic processes involved during atomic wire fabrication are investigated using molecular dynamics simulations, and we find that the total effective...

  19. Process Simulation of Resistance Weld Bonding and Automotive Light-weight Materials

    DEFF Research Database (Denmark)

    Zhang, Wenqi; Chergui, Azeddine; Nielsen, Chris Valentin

    This paper presents the latest developments in numerical simulation of resistance welding especially with the new functions for simulation of microstructures, weld bonding and spot welding of new light-weight materials. The fundamental functions in SORPAS® are built on coupled modeling of mechani...

  20. Modeling, simulation and parametric optimization of wire EDM ...

    African Journals Online (AJOL)

    In the present work, quadratic mathematical models have been derived to represent the process behavior of wire electrical discharge machining (WEDM) operation. Experiments have been conducted with six process parameters: discharge current, pulse duration, pulse frequency, wire speed, wire tension and dielectric flow ...

  1. Adhesive wafer bonding

    Science.gov (United States)

    Niklaus, F.; Stemme, G.; Lu, J.-Q.; Gutmann, R. J.

    2006-02-01

    Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robust, and low cost. This article reviews the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications.

  2. Diffusion-bonded 16MND5-Inconel 690-316LN junction: elaboration and process residual stresses modeling

    International Nuclear Information System (INIS)

    Martinez, Michael

    1999-01-01

    The objective of this research thesis is, on the one hand, to elaborate and to characterise a bonded junction of 16MND5 and 316LN steels, and, on the other hand, to develop a simulation tool for the prediction of microstructures after bonding, as well as residual stresses related to this process. The author first reports the study of the use of diffusion bonding by hot isostatic pressing (HIP diffusion bonding) for the bonding of 16MND5 (steel used in French PWR vessel) and 316LN (austenitic stainless steel used in piping), in order to obtain junctions adapted to a use within PWRs. In this case, the use of an Inconel insert material appeared to be necessary to avoid stainless steel carburization. Thus, inserts in Inconel 600 and 690 have been tested. The objective has then been to develop a realistic calculation of residual stresses in this assembly. These stresses are stimulated by quenching. The author notably studied the simulation of temperature dependent phase transformations, and stress induced phase transformations. An existing model is validated and applied to HIP and quenching cycles. The last part reports the calculation of residual stresses by simulation of the mechanical response of the three-component material cooled from 900 C to room temperature and thus submitted to a loading of thermal origin (dilatation) and metallurgical origin (phase transformations in the 16MND5). The effect of carbon diffusion on mechanical properties has also been taken into account. The author discusses problems faced by existing models, and explains the choice of conventional macro-mechanical models. The three materials are supposed to have a plastic-viscoplastic behaviour with isotropic and kinematic strain hardening, and this behaviour is identified between 20 and 900 C [fr

  3. MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

    NARCIS (Netherlands)

    Tang, J.

    2014-01-01

    The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400

  4. Effect of process on the magnetic properties of bonded NdFeB magnet

    International Nuclear Information System (INIS)

    Li, J.; Liu, Y.; Gao, S.J.; Li, M.; Wang, Y.Q.; Tu, M.J.

    2006-01-01

    The effects of magnetic separation, coupling treatment, lubricating treatment, preform and biaxial molding on the density and magnetic properties of bonded NdFeB magnet were investigated. The results demonstrate that magnetic separation separates the powders with low coercive force; coupling treatment improves the interfaces between the powders and the binders; decrease in volume fraction of the binder increases magnetic properties of the magnet; granular arrangement improves both the magnetic and mechanical properties when powders are arranged in certain size; lubricating treatment improves the formability of the magnet and preform and biaxial molding improves both density and magnetic properties greatly. Combining these methods, the density of the bonded NdFeB magnet can reach 6.52 g/cm 3 and the maximum energy product can reach 114 kJ/m 3

  5. Effect of process on the magnetic properties of bonded NdFeB magnet

    Energy Technology Data Exchange (ETDEWEB)

    Li, J. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China); Liu, Y. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China)]. E-mail: liuying5536@163.com; Gao, S.J. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China); Li, M. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China); Wang, Y.Q. [South-West Magnetic Science and Technology Developing Company, Mianyang, 621600 (China); Tu, M.J. [School of Materials Science and Engineering, Sichuan University, Chengdu, 610065 (China)

    2006-04-15

    The effects of magnetic separation, coupling treatment, lubricating treatment, preform and biaxial molding on the density and magnetic properties of bonded NdFeB magnet were investigated. The results demonstrate that magnetic separation separates the powders with low coercive force; coupling treatment improves the interfaces between the powders and the binders; decrease in volume fraction of the binder increases magnetic properties of the magnet; granular arrangement improves both the magnetic and mechanical properties when powders are arranged in certain size; lubricating treatment improves the formability of the magnet and preform and biaxial molding improves both density and magnetic properties greatly. Combining these methods, the density of the bonded NdFeB magnet can reach 6.52 g/cm{sup 3} and the maximum energy product can reach 114 kJ/m{sup 3}.

  6. Water Desalination with Wires

    NARCIS (Netherlands)

    Porada, S.; Sales, B.B.; Hamelers, H.V.M.; Biesheuvel, P.M.

    2012-01-01

    We show the significant potential of water desalination using a novel capacitive wire-based technology in which anode/cathode wire pairs are constructed from coating a thin porous carbon electrode layer on top of electrically conducting rods (or wires). By alternately dipping an array of electrode

  7. Special Advanced Studies for Pollution Prevention. Delivery Order 0016: Investigation of Sol-Gel Processing for Titanium Bonding and On-aircraft Aluminum Bonding

    National Research Council Canada - National Science Library

    1998-01-01

    Our objective was to conduct specific studies in the development of an environmentally acceptable metal surface treatment for structural adhesive bonding using sol-gel technology with epoxy-based adhesives...

  8. PS wire chamber

    CERN Document Server

    1970-01-01

    A wire chamber used at CERN's Proton Synchrotron accelerator in the 1970s. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  9. Effects of Different Surface Treatments on the Tensile Bond Strength of Polymethyl Methacrylate Processed against Chemically Etched Ticonium 100

    Science.gov (United States)

    1988-01-01

    Co., Clemson, S.C.) which was attached to a loop of 0.32 in. 1x3 twisted orthodontic wire (Unitek, Monrovia, CA) which was, in turn, attached to a...IntonMchn 𔃾-V 51 0 FIGURE 12 -----Aluminum Holding Plates 0 ---------------- --------- Swivel ----------- 0.32 in. IX3 twisted orthodontic wire

  10. Modeling and simulation of the fluid flow in wire electrochemical machining with rotating tool (wire ECM)

    Science.gov (United States)

    Klocke, F.; Herrig, T.; Zeis, M.; Klink, A.

    2017-10-01

    Combining the working principle of electrochemical machining (ECM) with a universal rotating tool, like a wire, could manage lots of challenges of the classical ECM sinking process. Such a wire-ECM process could be able to machine flexible and efficient 2.5-dimensional geometries like fir tree slots in turbine discs. Nowadays, established manufacturing technologies for slotting turbine discs are broaching and wire electrical discharge machining (wire EDM). Nevertheless, high requirements on surface integrity of turbine parts need cost intensive process development and - in case of wire-EDM - trim cuts to reduce the heat affected rim zone. Due to the process specific advantages, ECM is an attractive alternative manufacturing technology and is getting more and more relevant for sinking applications within the last few years. But ECM is also opposed with high costs for process development and complex electrolyte flow devices. In the past, few studies dealt with the development of a wire ECM process to meet these challenges. However, previous concepts of wire ECM were only suitable for micro machining applications. Due to insufficient flushing concepts the application of the process for machining macro geometries failed. Therefore, this paper presents the modeling and simulation of a new flushing approach for process assessment. The suitability of a rotating structured wire electrode in combination with an axial flushing for electrodes with high aspect ratios is investigated and discussed.

  11. Multi-Response Optimization and Regression Analysis of Process Parameters for Wire-EDMed HCHCr Steel Using Taguchi’s Technique

    Directory of Open Access Journals (Sweden)

    K. Srujay Varma

    2017-04-01

    Full Text Available In this study, effect of machining process parameters viz. pulse-on time, pulse-off time, current and servo-voltage for machining High Carbon High Chromium Steel (HCHCr using copper electrode in wire EDM was investigated. High Carbon High Chromium Steel is a difficult to machine alloy, which has many applications in low temperature manufacturing, and copper is chosen as electrode as it has good electrical conductivity and most frequently used electrode all over the world. Tool making culture of copper has made many shops in Europe and Japan to used copper electrode. Experiments were conducted according to Taguchi’s technique by varying the machining process parameters at three levels. Taguchi’s method based on L9 orthogonal array was followed and number of experiments was limited to 9. Experimental cost and time consumption was reduced by following this statistical technique. Targeted output parameters are Material Removal Rate (MRR, Vickers Hardness (HV and Surface Roughness (SR. Analysis of Variance (ANOVA and Regression Analysis was performed using Minitab 17 software to optimize the parameters and draw relationship between input and output process parameters. Regression models were developed relating input and output parameters. It was observed that most influential factor for MRR, Hardness and SR are Ton, Toff and SV.

  12. Signals analysis of fluxgate array for wire rope defaults

    International Nuclear Information System (INIS)

    Gu Wei; Chu Jianxin

    2005-01-01

    In order to detecting the magnetic leakage fields of the wire rope defaults, a transducer made up of the fluxgate array is designed, and a series of the characteristic values of wire rope defaults signals are defined. By processing the characteristic signals, the LF or LMA of wire rope are distinguished, and the default extent is estimated. The experiment results of the new method for detecting the wire rope faults are introduced

  13. Characterization of intermetallic compounds in Cu-Al ball bonds: layer growth, mechanical properties and oxidation

    NARCIS (Netherlands)

    Kouters, M.H.M.; Gubbels, G.H.M.; O'Halloran, O.; Rongen, R.

    2011-01-01

    In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1 st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the

  14. Analysis of the tin diffusion step in Nb3Sn-Cu superconducting wire produced by the external tin process

    International Nuclear Information System (INIS)

    Verhoeven, J.D.; Heimes, K.; Efron, A.; Department of Materials Science and Engineering, Iowa State University, Ames, Iowa 50011)

    1986-01-01

    Assuming volume diffusion is dominant, an analysis has been presented which allows one to analytically describe the three stages of the solid-state diffusion process for adding Sn in the external tin method for preparing Nb 3 Sn/Cu superconducting material. It is shown that one obtains a maximum intermetallic compound layer thickness in stage III which then decreases to zero thickness. Important practical questions in utilizing this process are the times required to complete stages I and II of the process, and this analysis predicts that the times required to complete stage I are on the order of days while stage II is completed in a matter of hours. The roles of grain-boundary diffusion and sample geometry are discussed and it is concluded that the analysis may be regarded as an upper bound for determining the times required to complete stages I and II of the solid state Sn diffusion process

  15. Ultrasonic friction power during thermosonic Au and Cu ball bonding

    International Nuclear Information System (INIS)

    Shah, A; Mayer, M; Zhou, Y; Qin, I; Huynh, C; Meyer, M

    2010-01-01

    The ultrasonic friction power during thermosonic ball bonding with Au and Cu wires, both 25 μm in diameter, is derived with an improved method from experimental measurements during the bonding process. Experimental data include the current delivered to the ultrasonic transducer and the tangential force measured using piezoresistive microsensors integrated close to the Al bonding pad. The improvement results from a new, more accurate method to derive the mechanical compliance of the ultrasonic system. The method employs a bond process modification in which the ultrasonic current is ramped up sequentially in three steps. In the first two steps, the ultrasonic current is set to levels that are too low to cause sliding. The bonding takes place during the third step, when the current is ramped up to the optimum value required for making good quality bonds. The ultrasonic compliance values are derived from the first two steps and are 8.2 ± 0.5 μm N -1 and 7.7 ± 0.5 μm N -1 for the Au and Cu processes, respectively. These values are determined within an average error estimate of ±6%, substantially lower than the ±10% estimated with a previously reported method. The ultrasonic compliance in the case of Au is 6% higher due to the lower elastic modulus of Au compared with that of Cu. Typical maximum values of relative sliding amplitude of ultrasonic friction at the interface are 655 nm and 766 nm for the Au and Cu processes. These values are 81% of the free-air vibration amplitude of the bonding capillary tip for the respective ultrasonic current settings. Due to bond growth, which damps relative motion between the ball and the pad, the final relative amplitude at the bond interface is reduced to 4% of the equivalent free-air amplitude. Even though the maximum value of relative amplitude is 17% higher in the Cu process compared with the Au process, the average total interfacial sliding is 519 μm in the Cu process, which is 31% lower than that in the Au process (759

  16. Investigation of method for Stainless Steel Welding Wire as a Replacement for Arc Wire Comsumables

    Directory of Open Access Journals (Sweden)

    Koiprasert, H.

    2005-01-01

    Full Text Available Arc spraying as a coating method is being employed in various industrial applications as a part of maintenance service, and also as a surface engineering technique for many machine parts and components. The major cost in producing the arc spray coating is, however, based on the cost of the arc wire comsumables. This project was carried out to investigate the use of the commercially-available gas metal arc welding wire (GMAW wire as a cheaper alternative to the special-purpose arc wire comsumables. The wire material chosen for this early study is the 316L stainless steel, due to its popularity in many applications as a built-up coating for worn parts. The physical properties of the coatings produced from the two sets of 316L stainless steel wire were determined to be different in the percentage of porosity and the oxide content. The mechanical properties, including the tensile bond strength and the wear rate of the coatings produced from the two types of sprayed wire, were also different. This will, in turn, result in a slight difference in the performance of thecoatings.

  17. Multiple hydrogen bond interactions in the processing of functionalized multi-walled carbon nanotubes.

    Science.gov (United States)

    Quintana, Mildred; Traboulsi, Hassan; Llanes-Pallas, Anna; Marega, Riccardo; Bonifazi, Davide; Prato, Maurizio

    2012-01-24

    In a set of unprecedented experiments combining "bottom-up" and "top-down" approaches, we report the engineering of patterned surfaces in which functionalized MWCNTs have been selectively adsorbed on polymeric matrices as obtained by microlithographic photo-cross-linking of polystyrene polymers bearing 2,6-di(acetylamino)-4-pyridyl moieties (PS1) deposited on glass or Si. All patterned surfaces have been characterized by optical, fluorescence, and SEM imaging techniques, showing the local confinement of the CNTs materials on the polymeric microgrids. These results open new possibilities toward the controlled manipulation of CNTs on surfaces, using H-bonding self-assembly as the main driving force. © 2011 American Chemical Society

  18. Selective Activation of C−H Bonds in a Cascade Process Combining Photochemistry and Biocatalysis

    Science.gov (United States)

    Zhang, Wuyuan; Burek, Bastien O.; Fernández‐Fueyo, Elena; Alcalde, Miguel

    2017-01-01

    Abstract Selective oxyfunctionalizations of inert C−H bonds can be achieved under mild conditions by using peroxygenases. This approach, however, suffers from the poor robustness of these enzymes in the presence of hydrogen peroxide as the stoichiometric oxidant. Herein, we demonstrate that inorganic photocatalysts such as gold–titanium dioxide efficiently provide H2O2 through the methanol‐driven reductive activation of ambient oxygen in amounts that ensure that the enzyme remains highly active and stable. Using this approach, the stereoselective hydroxylation of ethylbenzene to (R)‐1‐phenylethanol was achieved with high enantioselectivity (>98 % ee) and excellent turnover numbers for the biocatalyst (>71 000). PMID:28994504

  19. EBSD characterization of an IF steel processed by Accumulative Roll Bonding

    International Nuclear Information System (INIS)

    Cruz-Gandarilla, F; Salcedo-Garrido, A M; Avalos, M; Bolmaro, R; Baudin, T; Cabañas-Moreno, J G; Dorantes-Rosales, H J

    2015-01-01

    The objective of this work is to study the texture and microstructure evolution of an IF steel deformed by Accumulative Roll Bonding (ARB) using Electron Backscatter Diffraction. Texture changes occur with increasing number of ARB cycles. For the early cycles, the main components are the α and γ fiber components characteristic of steels. With increasing the number of ARB cycles a tendency towards a random texture is obtained. In the initial state, the mean grain size is 30 μm and after 5 cycles it decreases to 1.2 μm. For the first ARB cycles, the fraction of high angle grain boundary is low but it increases with the number of cycles to about 80% for 5 cycles. The Kernel Average Misorientation (KAM) has no appreciable changes with the number of ARB cycles for all the texture components. (paper)

  20. Process Optimization for High Efficiency Heterojunction c-Si Solar Cells Fabrication Using Hot-Wire Chemical Vapor Deposition: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Ai, Y.; Yuan, H. C.; Page, M.; Nemeth, W.; Roybal, L.; Wang, Q.

    2012-06-01

    The researchers extensively studied the effects of annealing or thermal history of cell process on the minority carrier lifetimes of FZ n-type c-Si wafers with various i-layer thicknesses from 5 to 60 nm, substrate temperatures from 100 to 350 degrees C, doped layers both p- and n-types, and transparent conducting oxide (TCO).

  1. SorCS2 Regulates Dopaminergic Wiring and Is Processed into an Apoptotic Two-Chain Receptor in Peripheral Glia

    DEFF Research Database (Denmark)

    Glerup, Simon; Olsen, Ditte; Vægter, Christian Bjerggaard

    2014-01-01

    behavioral response to amphetamine reminiscent of ADHD. Contrary, in PNS glia, but not in neurons, proteolytic processing produced a two-chain SorCS2 isoform that mediated proNT-dependent Schwann cell apoptosis. Sciatic nerve injury triggered generation of two-chain SorCS2 in p75NTR-positive dying Schwann...

  2. Behavior and effect of Ti2Ni phase during processing of NiTi shape memory alloy wire from cast ingot

    International Nuclear Information System (INIS)

    Bhagyaraj, J.; Ramaiah, K.V.; Saikrishna, C.N.; Bhaumik, S.K.; Gouthama

    2013-01-01

    Highlights: •Ti 2 Ni second phase particles forms in different sizes and shapes in cast ingot. •TEM evidences showed shearing/fragmentation of Ti 2 Ni during processing. •Matrix close to Ti 2 Ni experienced severe plastic deformation lead to amorphisation. •Ti 2 Ni interfaces were mostly faceted and assist in nucleation of martensite. •Heterogeneity of microstructure observed near to and away from Ti 2 Ni. -- Abstract: Binary NiTi alloy is one of the commercially successful shape memory alloys (SMAs). Generally, the NiTi alloy composition used for thermal actuator application is slightly Ti-rich. In the present study, vacuum arc melted alloy of 50.2Ti–Ni (at.%) composition was prepared and characterized using optical, scanning and transmission electron microcopy. Formation of second phase particles (SPPs) in the cast alloy and their influence on development of microstructure during processing of the alloy into wire form has been investigated. Results showed that the present alloy contained Ti 2 Ni type SPPs in the matrix. In the cast alloy, the Ti 2 Ni particles form in varying sizes (1–10 μm) and shapes. During subsequent thermo-mechanical processing, these SPPs get sheared/fragmented into smaller particles with low aspect ratio. The presence of SPPs plays a significant role in refinement of the microstructure during processing of the alloy. During deformation of the alloy, the matrix phase around the SPPs experiences conditions similar to that observed in severe plastic deformation of metallic materials, leading to localized amorphisation of the matrix phase

  3. Towards plant wires

    OpenAIRE

    Adamatzky, Andrew

    2014-01-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self...

  4. Photovoltaic Wire, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This Small Business Innovation Research Phase I project will investigate a new architecture for photovoltaic devices based on nanotechnology: photovoltaic wire. The...

  5. Photovoltaic Wire Project

    Data.gov (United States)

    National Aeronautics and Space Administration — This Small Business Innovation Research Phase I project will investigate a new architecture for photovoltaic devices based on nanotechnology: photovoltaic wire. The...

  6. Charpak hemispherical wire chamber

    CERN Document Server

    1970-01-01

    pieces. Mesures are of the largest one. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  7. 1998 wire development workshop proceedings

    International Nuclear Information System (INIS)

    1998-04-01

    This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development

  8. Concerning the problem of polygraphic wire calculation: theoretical aspects, software, practical implementation

    Directory of Open Access Journals (Sweden)

    Selkina A. V.

    2016-05-01

    Full Text Available the article analyzes the problems arising while organizing the workflow in printing companies. We suggest to address these problems by means of implementing computer-based accounting systems. Online and offline calculators used by printing enterprises for accounting are discussed. The author outlined the functional and specified requirements to such software. They were considered in the calculation module of accounting polygraphic wire used for block bonding. The software allows to increase the calculation process speed, to reduce the amount of errors in calculation and to decrease the labour intensity of the accounting process.

  9. Wire Array Photovoltaics

    Science.gov (United States)

    Turner-Evans, Dan

    Over the past five years, the cost of solar panels has dropped drastically and, in concert, the number of installed modules has risen exponentially. However, solar electricity is still more than twice as expensive as electricity from a natural gas plant. Fortunately, wire array solar cells have emerged as a promising technology for further lowering the cost of solar. Si wire array solar cells are formed with a unique, low cost growth method and use 100 times less material than conventional Si cells. The wires can be embedded in a transparent, flexible polymer to create a free-standing array that can be rolled up for easy installation in a variety of form factors. Furthermore, by incorporating multijunctions into the wire morphology, higher efficiencies can be achieved while taking advantage of the unique defect relaxation pathways afforded by the 3D wire geometry. The work in this thesis shepherded Si wires from undoped arrays to flexible, functional large area devices and laid the groundwork for multijunction wire array cells. Fabrication techniques were developed to turn intrinsic Si wires into full p-n junctions and the wires were passivated with a-Si:H and a-SiNx:H. Single wire devices yielded open circuit voltages of 600 mV and efficiencies of 9%. The arrays were then embedded in a polymer and contacted with a transparent, flexible, Ni nanoparticle and Ag nanowire top contact. The contact connected >99% of the wires in parallel and yielded flexible, substrate free solar cells featuring hundreds of thousands of wires. Building on the success of the Si wire arrays, GaP was epitaxially grown on the material to create heterostructures for photoelectrochemistry. These cells were limited by low absorption in the GaP due to its indirect bandgap, and poor current collection due to a diffusion length of only 80 nm. However, GaAsP on SiGe offers a superior combination of materials, and wire architectures based on these semiconductors were investigated for multijunction

  10. Carenium—Calkyl Bond Making and Breaking: Key Process in the Platinum-Mediated Caryl—Calkyl Bond Formation. Analogies to Organic Electrophilic Aromatic Substitution

    NARCIS (Netherlands)

    Koten, G. van; Albrecht, M.A.; Spek, A.L.

    2001-01-01

    The reaction of cationic platinum aqua complexes 2 [Pt(C6H2{CH2NMe2}2-E-4)(OH2)](X') (X' = SO3CF3, BF4) with alkyl halides RX gave various air-stable arenium complexes 3-5 containing a new C-C bond (R = Me, 3; Et, 4; Bn, 5). Electron-releasing oxo-substituents on the aromatic ligand (E = e.g., OH,

  11. A processing enzyme cleaving avian progastrin at post-Phe bonds

    DEFF Research Database (Denmark)

    Jensen, H; Ørskov, C; Rehfeld, J F

    2001-01-01

    Neuroendocrine peptides mature partly through endoproteolytic processing of long precursor forms. Best characterised is cleavage at mono- and dibasic residues, but additional sites also exist. Among these is post-Phe cleavage, first suggested to participate in the processing of chicken progastrin...

  12. Local reinforcement of magnesium components by friction processing. Determination of bonding mechanisms and assessment of joint properties

    Energy Technology Data Exchange (ETDEWEB)

    Pinheiro, G.A. [GKSS-Forschungszentrum Geesthacht GmbH (Germany). Inst. fuer Materialforschung

    2008-07-01

    The development of new creep-resistant and cost effective die casting magnesium alloys, such as AE, MRI, MEZ, ACM, AXJ, AJ, WE, have emerged as an alternative, to fulfil the modern demands in structurally relevant applications, such as engine blocks, gears and converter boxes. However, in most cases, magnesium components are screwed with aluminium and steel bolts, which lead the screwed joints to lose the preload force, due to relaxation. This barrier thereby limits the broad use of magnesium within this segment and should somehow find an adequate solution to help overcome this limitation. Furthermore, together with alloy development and the addition of reinforcement (MMCs), local material engineering processes have been conceived and are considered a method to improve the properties and therefore expand the number of potential applications for magnesium alloys. In this context, Friction Welding (FW) and particularly Friction Hydro Pillar Processing (FHPP), which can be described as a drill and fill process, appear to be an alternative to make the use of magnesium more widespread. For this reason, FHPP is intended to be used, to locally reinforce the mechanically fastened magnesium components. With this approach, regions submitted to the stresses imposed by tightening forces can be compensated by the use of a material with superior properties. It is not required to fabricate the whole structure from an expensive material, thus saving costs and thereby satisfying the economic pressures of an increasingly competitive global market. In the present work, a preliminary experimental matrix was defined and used to determine the optimal welding conditions for each specific material combination selected. Further, elaborate experimental techniques are used to describe the process parameters-microstructure-properties relationships and the consequent mechanisms leading to bonding in FHPP welds in similar and dissimilar configurations. The welds were performed using a hydraulic

  13. Automating wiring formboard design

    NARCIS (Netherlands)

    Van den Berg, T.

    2013-01-01

    Increase in aircraft wiring complexity call for manufacturing design improvements to reduce cost and lead-time. To achieve such improvements, a joint research project was performed by the Flight Performance and Propulsion (FPP) group and Fokker Elmo BV, the second largest aircraft wiring harness

  14. Deposition of composite materials using a wire-bar coater for achieving processability and air-stability in Organic Field-Effect Transistors (OFETs)

    Science.gov (United States)

    Del Pozo, Freddy G.; Galindo, Sergi; Pfattner, Raphael; Rovira, Concepció; Mas-Torrent, Marta

    2015-08-01

    Organic thin films based on composite materials of semiconducting dibenzo-tetrathiafulvalene (DB-TTF) and insulating styrenic matrices (Polystyrene (PS10k) and Poly-alpha methylstyrene (PAMS10k) ) have been fabricated by the wire-bar coating technique in ambient conditions (air, light, humidity) and contrasted with the ones prepared by thermally evaporating the organic semiconductor. The transistors fabricated with DB-TTF:PS10k composites show a clear fieldeffect behavior with p-type characteristics, exhibiting charge carriers mobilities in the range of 0.01 cm2/Vs, fully comparable with the films obtained by thermal evaporation. However, while the thermally evaporated films show poor stability in air, the wire-bar coated composites films and devices are highly reproducible and exhibit lower threshold voltage values. Thus, we demonstrate the suitability of the wire-bar technique for manufacturing large area devices.

  15. Pin Wire Coating Trip Report

    International Nuclear Information System (INIS)

    Spellman, G P

    2004-01-01

    A meeting to discuss the current pin wire coating problems was held at the Reynolds plant in Los Angeles on 2MAR04. The attendance list for Reynolds personnel is attached. there was an initial presentation which gave a brief history and the current status of pin wire coating at Reynolds. There was a presentation by Lori Primus on the requirements and issues for the coating. There was a presentation by Jim Smith of LANL on the chemistry and to some extent process development done to date. There was a long session covering what steps should be taken in the short term and, to a lesser extent, the long term. The coating currently being used is a blend of two polymers, polyethersulfone and polyparabanic acid (PPA) and some TiO2 filler. This system was accepted and put into production when the pin wire coating was outsourced to another company in 1974. When that company no longer was interested, the wire coating was brought in-house to Reynolds. At that time polyparabanic acid was actually a commercial product available from Exxon under the trade name Tradlon. However, it appears that the material used at Reynolds was synthesized locally. Also, it appears that a single large batch was synthesized in that time period and used up to 1997 when the supply ran out. The reason for the inclusion of TiO2 is not known although it does act as a rheological thickener. However, a more controlled thickening can be obtained with materials such as fumed silica. This material would have less likelihood of causing point imperfections in the coatings. Also, the mixing technique being used for all stages of the process is a relatively low shear ball mill process and the author recommends a high shear process such as a three roll paint mill, at least for the final mixing. Since solvent is added to the powder at Reynolds, it may be that they need to have the paint mill there

  16. Tensile test and interface retention forces between wires and composites in lingual fixed retainers.

    Science.gov (United States)

    Paolone, Maria Giacinta; Kaitsas, Roberto; Obach, Patricia; Kaitsas, Vasilios; Benedicenti, Stefano; Sorrenti, Eugenio; Barberi, Fabrizio

    2015-06-01

    In daily orthodontic clinical practice retention is very important, and lingual retainers are part of this challenge. The failure of lingual retainers may be due to many factors. The aim of this study was to assess the retention forces and mechanical behavior of different types of wires matched with different kinds of composites in lingual retainers. A tensile test was performed on cylindrical composite test specimens bonded to orthodontic wires. The specimens were constructed using four different wires: a straight wire (Remanium .016×.022″ Dentaurum), two round twisted wires (Penta One .0215″ Masel, Gold Penta Twisted .0215″ Gold N'braces) and a rectangular braided wire (D-Rect .016×.022″ Ormco); and three composites: two micro-hybrids (Micro-Hybrid Enamel Plus HFO Micerium, and Micro-Hybrid SDR U Dentsply) and a micro-nano-filled composite (Micro-Nano-Filled Transbond LR 3M). The test was performed at a speed of 10mm/min on an Inström device. The wire was fixed with a clamp. The results showed that the bonding between wires and composites in lingual fixed retainers seemed to be lowest for rectangular smooth wires and increased in round twisted and rectangular twisted wires where the bonding was so strong that the maximum tension/bond strength was greater than the ultimate tensile strength of the wire. The highest values were in rectangular twisted wires. Concerning the composites, hybrid composites had the lowest interface bonding values and broke very quickly, while the nano- and micro-composites tolerated stronger forces and displayed higher bonding values. The best results were observed with the golden twisted wire and reached 21.46 MPa with the Transbond composite. With the rectangular braided wire the retention forces were so high that the Enamel Plus composite fractured when the load exceeded 154.6 N/MPa. When the same wire was combined with the Transbond LR either the wire or the composite broke when the force exceeded 240 N. The results of this

  17. Use of a CCD camera for the thermographic study of a transient liquid phase bonding process in steel

    Science.gov (United States)

    Castro, Eduardo H.; Epelbaum, Carlos; Carnero, Angel; Arcondo, Bibiana

    2001-03-01

    The bonding of steel pieces and the development of novel soldering methods, appropriate to the extended variety of applications of steels nowadays, bring the sensing of temperature an outstanding role in any metallurgical process. Transient liquid phase bonding (TLPB) processes have been successfully employed to join metals, among them steels. A thin layer of metal A, with a liquids temperature TLA, is located between two pieces of metal B, with a liquids temperature TLB higher than TLA. The joining zone is heated up to a temperature T(TLAsteel is performed in a 30 Kw induction furnace at temperatures in the range 800 degree(s)C to 1400 degree(s)C depending on the layer metal. A small window was opened between the central loops of the coil in order to observe the radiation emitted by the hot steel zone. A low price black and white CCD camera with 752x582 pixels has been adapted for temperature measurements through the coil of the furnace. The output of the camera is digitized and visualized in a 14-inch monitor. The temperature is calculated using the correlation with the gray tone present in the monitor, which is measured by means of suitable software. The technical specifications of the camera and the modifications introduced to adapt it for this work are presented. The calibration of the camera and the method employed in the measurements are described. The measured temperatures are corrected by the effect of emissivity of the materials surfaces and the environment radiation reflected. Thermographs obtained are shown and results are discussed. We conclude that a low priced camera may be used to measure temperature in this range with acceptable accuracy.

  18. Evaluation of Sandwich Structure Bonding In Out-of-Autoclave Processing

    Science.gov (United States)

    Hou, Tan-Hung; Baughman, James M.; Zimmerman, Thomas J.; Sutter, James K.; Gardner, John M.

    2010-01-01

    The out-of-autoclave-vacuum-bag-only (OOA-VBO) process is low in capital expenditures compared to the traditional autoclave, however, the material challenges for OOA-VBO workable material systems are high. Presently there are few such aerospace grade prepreg materials available commercially. In this study, we evaluated processing and properties of honeycomb sandwich structure (HC/SS) panels fabricated by co-curing composite face sheet with adhesives by the OOA-VBO process in an oven. The prepreg materials were IM7/MTM 45-1 and T40-800B/5320. Adhesives studied were AF-555M, XMTA-241/PM15, FM-309-1M and FM-300K. Aluminum H/C cores with and without perforations were included. It was found that adhesives in IM7/MTM 45-1/AF-555M, T40-800B/5320/FM 309-1M and T40-800B/5320/FM-300K panels all foamed but yielded high flatwise tensile (FWT) strength values above 8,275 kPA (1,200 psi). IM7/MTM 45-1/XMTA-241/PM15 did not foam, yet yielded a low FWT strength. SEM photomicrographs revealed that the origin of this low strength was poor adhesion in the interfaces between the adhesive and face sheet composite due to poor wetting associated with the high initial viscosity of the XMTA-241/PM15 adhesive.

  19. Needleless electrospinning with twisted wire spinneret

    International Nuclear Information System (INIS)

    Holopainen, Jani; Penttinen, Toni; Santala, Eero; Ritala, Mikko

    2015-01-01

    A needleless electrospinning setup named ‘Needleless Twisted Wire Electrospinning’ was developed. The polymer solution is electrospun from the surface of a twisted wire set to a high voltage and collected on a cylindrical collector around the wire. Multiple Taylor cones are simultaneously self-formed on the downward flowing solution. The system is robust and simple with no moving parts aside from the syringe pump used to transport the solution to the top of the wire. The structure and process parameters of the setup and the results on the preparation of polyvinyl pyrrolidone (PVP), hydroxyapatite (HA) and bioglass fibers with the setup are presented. PVP fiber sheets with areas of 40 × 120 cm 2 and masses up to 1.15 g were prepared. High production rates of 5.23 g h −1 and 1.40 g h −1 were achieved for PVP and HA respectively. The major limiting factor of the setup is drying of the polymer solution on the wire during the electrospinning process which will eventually force to interrupt the process for cleaning of the wire. Possible solutions to this problem and other ways to develop the setup are discussed. The presented system provides a simple way to increase the production rate and area of fiber sheet as compared with the conventional needle electrospinning. (paper)

  20. Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles

    Science.gov (United States)

    Yan, Jianfeng; Zou, Guisheng; Wu, Aiping; Ren, Jialie; Hu, Anming; Zhou, Y. Norman

    2012-07-01

    Low-temperature bonding by sintering of Ag nanoparticles (NPs) is a promising lead-free bonding technique used in the electronic packaging industry. In this work, we prepare Ag nanoparticle (NP) paste using both an aqueous method and a polyol method. Sintering bonding trials were then conducted using different forms of Ag NPs. The results showed that use of the aqueous-based Ag NP paste led to inhomogeneous distribution of NPs, known as the "coffee-ring effect." This led to low strength of fabricated joints. We investigated the influence of the coffee-ring effect and ways to depress it by changing the bonding material composition. Our results show that, when using polyol-based Ag NP paste as the bonding material, the coffee-ring effect was successfully depressed due to increased Marangoni flow. The corresponding shear strength of joints was increased significantly to 50 MPa at bonding temperature of 250°C.

  1. Fundamentals of fiber bonding in thermally point-bonded nonwovens

    Science.gov (United States)

    Chidambaram, Aparna

    Thermal point bonding (TPB) uses heat and pressure to bond a web of fibers at discrete points imparting strength to the manufactured fabric. This process significantly reduces the strength and elongation of the bridging fibers between bond points while strengthening the web. Single fiber experiments were performed with four structurally different polypropylene fibers to analyze the inter-relationships between fiber structure, fiber properties and bonding process. Two fiber types had a low birefringence sheath or surface layer while the remaining had uniform birefringence profiles through their thickness. Bonds were formed between isolated pairs of fibers by subjecting the fibers to a calendering process and simulating TPB process conditions. The dependence of bond strength on bonding temperature and on the type of fiber used was evaluated. Fiber strengths before and after bonding were measured and compared to understand the effect of bonding on fiber strength. Additionally, bonded fiber strength was compared to the strength of single fibers which had experienced the same process conditions as the bonded pairs. This comparison estimated the effect of mechanical damage from pressing fibers together with steel rolls while creating bonds in TPB. Interfiber bond strength increased with bonding temperature for all fiber types. Fiber strength decreased with increasing bonding temperature for all fiber types except for one type of low birefringent sheath fibers. Fiber strength degradation was unavoidable at temperatures required for successful bonding. Mechanical damage from compression of fibers between rolls was an insignificant factor in this strength loss. Thermal damage during bonding was the sole significant contributor to fiber strength degradation. Fibers with low birefringence skins formed strong bonds with minimal fiber strength loss and were superior to fibers without such surface layers in TPB performance. A simple model to predict the behavior of a two-bond

  2. Characteristic of Core Manufacturing Process with Use of Sand, Bonded by Ecological Friendly Nonorganic Binders

    Directory of Open Access Journals (Sweden)

    Fedoryszyn A.

    2013-09-01

    Full Text Available Mechanization of the process of core making with the use of inorganic and organic binders is based, almost solely, on core blowing machines. Presently the core blowing machines are equipped with tools and devices that allow for application of different technologies of core making. Cold-box, hot-box and warm-air technologies require that core blowing machines shall be additionally equipped with either core-box pre-heating system or gas purging and neutralization system, or hot air purging systems.

  3. Towards plant wires.

    Science.gov (United States)

    Adamatzky, Andrew

    2014-08-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self-growing wetware circuits and devices, and integration of plant-based electronic components into future and emergent bio-hybrid systems. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

  4. Processes linking cultural ingroup bonds and mental health: The roles of social connection and emotion regulation

    Directory of Open Access Journals (Sweden)

    Nicole A Roberts

    2013-02-01

    Full Text Available Cultural and ethnic identities influence the relationships individuals seek out and how they feel and behave in these relationships, which can strongly affect mental and physical health through their impacts on emotions, physiology, and behavior. We proposed and tested a model in which ethnocultural identifications and ingroup affiliations were hypothesized explicitly to enhance social connectedness, which would in turn promote expectancy for effective regulation of negative emotions and reduce self-reported symptoms of depression and anxiety. Our sample comprised women aged 18 to 30 currently attending college in the Southwestern US, who self-identified as Hispanic of Mexican descent (n=82; MAs or as non-Hispanic White/European American (EAs; n=234 and who completed an online survey. In the full sample and in each subgroup, stronger ethnocultural group identity and greater comfort with mainstream American culture were associated with higher social connectedness, which in turn was associated with expectancy for more effective regulation of negative emotions, fewer depressive symptoms, and less anxiety. Unexpectedly, preference for ingroup affiliation predicted lower social connectedness in both groups. In addition to indirect effects through social connection, direct paths from mainstream comfort and preference for ingroup affiliation to emotion regulation expectancy were found for EAs. Models of our data underscore that social connection is a central mechanism through which ethnocultural identities—including with one’s own group and the mainstream cultural group—relate to mental health, and that emotion regulation may be a key aspect of this linkage. We use the term ethnocultural social connection to make explicit a process that, we believe, has been implied in the ethnic identity literature for many years, and that may have consequential implications for mental health and conceptualizations of processes underlying mental disorders.

  5. Investigation of material removal rate (MRR) and wire wear ratio (WWR) for alloy Ti6Al4 V exposed to heat treatment processing in WEDM and optimization of parameters using Grey relational analysis

    Energy Technology Data Exchange (ETDEWEB)

    Altug, Mehmet [Inonu Univ., Malatya (Turkey). Dept. of Machine and Metal Technologies

    2016-11-01

    The study examines the changes of the microstructural, mechanical and conductivity characteristics of the titanium alloy Ti6Al4 V as a result of heat treatment using wire electrical discharge machining, and their effect on machinability. By means of optical microscopy and scanning electron microscopy (SEM), analyses have been performed to determine various characteristics and additionally, microhardness and conductivity measurements have been conducted. Material removal rate (MRR) and wire wear ratio (WWR) values have been determined by using L18 Taguchi test design. The microstructures of the samples have been changed by thermal procedures. Results have been obtained by using the Grey relational analysis (GRA) optimization technique to solve the maximum MRR and minimum WWR values. The best (highest) MRR value is obtained from sample E which was water quenched in dual phase processing. The microstructure of this sample is composed of primary α and α' phases. The best (lowest) WWR value is obtained from sample A.

  6. Peculiar features of metallurgical processes at plasma-arc spraying of coatings, made of steel wire with powder fillers B4C and B4C+ZrO2

    Directory of Open Access Journals (Sweden)

    Георгій Михайлович Григоренко

    2016-11-01

    Full Text Available The interaction of metallurgical processes occurring in plasma-arc spraying between the steel shell and the carbide fillers of B4C and B4C cored wires with the addition of nanocrystalline ZrO2 powder has been analyzed. Iron-boron compounds alloyed with carbon are formed in ingots as a result of ferritiс coating of wire interacrion with fillers while the ferritic matrix contains boride and carboboride eutectics. Average microhardness of the carboboride compounds and the matrix is high – 17,78; 16,40 and 8,69; 9,95 GPa for the ingots with с B4C and B4C+ZrO2 respectively. The best quality coatings with low porosity (~1%, lamellar structure consisting of ferrite matrix reinforced with dispersed Fe borides, were obtained at a higher heat input (plasmatron current 240-250 A. The average amount of oxides in the coatings makes 15%. 0,5% addition of nanopowder ZrO2 accelerates dispersed iron-boron compounds forming, promotes their uniform distribution in the structure and improves coating microhardness up to 7,0 GPa. Application of the differential thermal analysis method to simulate the interaction processes between the steel shell and the filler during the heating of wire in the shielding gas makes it possible to promote formation of new phases (borides and carboborides of iron and to predict the phase composition of the coatings

  7. Processing and Characterization of Liquid-Phase Sintered NiTi Woven Structures

    Science.gov (United States)

    Erdeniz, Dinc; Weidinger, Ryan P.; Sharp, Keith W.; Dunand, David C.

    2018-03-01

    Porous NiTi is of interest for bone implants because of its unique combination of biocompatibility (encouraging osseointegration), high strength (to prevent fracture), low stiffness (to reduce stress shielding), and shape memory or superelasticity (to deploy an implant). A promising method for creating NiTi structures with regular open channels is via 3D weaving of NiTi wires. This paper presents a processing method to bond woven NiTi wire structures at contact points between wires to achieve structural integrity: (i) a slurry consisting of a blend of NiTi and Nb powders is deposited on the surface of the NiTi wires after the weaving operation; (ii) the powders are melted to create a eutectic liquid phase which collects at contact points; and (iii) the liquid is solidified and binds the NiTi woven structures. The bonded NiTi wire structures exhibited lower transformation temperatures compared to the as-woven NiTi wires because of Nb diffusion into the NiTi wires. A bonded woven sample was deformed in bending and showed near-complete recovery up to 6% strain and recovered nearly half of the deformation up to 19% strain.

  8. Highly stretchable wrinkled gold thin film wires.

    Science.gov (United States)

    Kim, Joshua; Park, Sun-Jun; Nguyen, Thao; Chu, Michael; Pegan, Jonathan D; Khine, Michelle

    2016-02-08

    With the growing prominence of wearable electronic technology, there is a need to improve the mechanical reliability of electronics for more demanding applications. Conductive wires represent a vital component present in all electronics. Unlike traditional planar and rigid electronics, these new wearable electrical components must conform to curvilinear surfaces, stretch with the body, and remain unobtrusive and low profile. In this paper, the piezoresistive response of shrink induced wrinkled gold thin films under strain demonstrates robust conductive performance in excess of 200% strain. Importantly, the wrinkled metallic thin films displayed negligible change in resistance of up to 100% strain. The wrinkled metallic wires exhibited consistent performance after repetitive strain. Importantly, these wrinkled thin films are inexpensive to fabricate and are compatible with roll to roll manufacturing processes. We propose that these wrinkled metal thin film wires are an attractive alternative to conventional wires for wearable applications.

  9. Cryogenic Pressure Seal for Wires

    Science.gov (United States)

    Ciana, J. J.

    1984-01-01

    High-pressure-seal formed by forcing polyurethane into space surrounding wire or cable in special fitting. Wire or cable routed through fitting then through a tightly fitting cap. Wire insulation left intact. Cap filled with sealant and forced onto the fitting: this pushes sealant into fitting so it seals wire or cable in fitting as well as in cap.

  10. Modeling birds on wires.

    Science.gov (United States)

    Aydoğdu, A; Frasca, P; D'Apice, C; Manzo, R; Thornton, J M; Gachomo, B; Wilson, T; Cheung, B; Tariq, U; Saidel, W; Piccoli, B

    2017-02-21

    In this paper we introduce a mathematical model to study the group dynamics of birds resting on wires. The model is agent-based and postulates attraction-repulsion forces between the interacting birds: the interactions are "topological", in the sense that they involve a given number of neighbors irrespective of their distance. The model is first mathematically analyzed and then simulated to study its main properties: we observe that the model predicts birds to be more widely spaced near the borders of each group. We compare the results from the model with experimental data, derived from the analysis of pictures of pigeons and starlings taken in New Jersey: two different image elaboration protocols allow us to establish a good agreement with the model and to quantify its main parameters. We also discuss the potential handedness of the birds, by analyzing the group organization features and the group dynamics at the arrival of new birds. Finally, we propose a more refined mathematical model that describes landing and departing birds by suitable stochastic processes. Copyright © 2016 Elsevier Ltd. All rights reserved.

  11. RESEARCH OF PROCESS OF AN ALLOYING OF THE FUSED COATINGS RECEIVED FROM THE SUPERFICIAL ALLOYED WIRE BY BORON WITH IN ADDITIONALLY APPLIED ELECTROPLATED COATING OF CHROME AND COPPER

    Directory of Open Access Journals (Sweden)

    V. A. Stefanovich

    2015-01-01

    Full Text Available Researches on distribution of chrome and copper in the fused coating received from the superficial alloyed wire by boron with in additionally applied electroplated coating of chrome and copper were executed. The structure of the fused coating consists of dendrites on which borders the boride eutectic is located. It is established that the content of chrome in dendrites is 1,5– 1,6 times less than in the borid; distribution of copper on structure is uniformed. Coefficients of digestion of chrome and copper at an argon-arc welding from a wire electrode with electroplated coating are established. The assimilation coefficient for chrome is equal to 0,9–1,0; for copper – 0,6–0,75.

  12. Si Wire-Array Solar Cells

    Science.gov (United States)

    Boettcher, Shannon

    2010-03-01

    Micron-scale Si wire arrays are three-dimensional photovoltaic absorbers that enable orthogonalization of light absorption and carrier collection and hence allow for the utilization of relatively impure Si in efficient solar cell designs. The wire arrays are grown by a vapor-liquid-solid-catalyzed process on a crystalline (111) Si wafer lithographically patterned with an array of metal catalyst particles. Following growth, such arrays can be embedded in polymethyldisiloxane (PDMS) and then peeled from the template growth substrate. The result is an unusual photovoltaic material: a flexible, bendable, wafer-thickness crystalline Si absorber. In this paper I will describe: 1. the growth of high-quality Si wires with controllable doping and the evaluation of their photovoltaic energy-conversion performance using a test electrolyte that forms a rectifying conformal semiconductor-liquid contact 2. the observation of enhanced absorption in wire arrays exceeding the conventional light trapping limits for planar Si cells of equivalent material thickness and 3. single-wire and large-area solid-state Si wire-array solar cell results obtained to date with directions for future cell designs based on optical and device physics. In collaboration with Michael Kelzenberg, Morgan Putnam, Joshua Spurgeon, Daniel Turner-Evans, Emily Warren, Nathan Lewis, and Harry Atwater, California Institute of Technology.

  13. In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens

    NARCIS (Netherlands)

    Jongsma, Marije A.; van der Mei, Henny C.; Atema-Smit, Jelly; Busscher, Henk I.; Ren, Yijin

    2015-01-01

    Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased

  14. Concentration-dependent multiple chirality transition in halogen-bond-driven 2D self-assembly process

    Science.gov (United States)

    Miao, Xinrui; Li, Jinxing; Zha, Bao; Miao, Kai; Dong, Meiqiu; Wu, Juntian; Deng, Wenli

    2018-03-01

    The concentration-dependent self-assembly of iodine substituted thienophenanthrene derivative (5,10-DITD) is investigated at the 1-octanic acid/graphite interface using scanning tunneling microscopy. Three kinds of chiral arrangement and transition of 2D molecular assembly mainly driven by halogen bonding is clearly revealed. At high concentration the molecules self-assembled into a honeycomb-like chiral network. Except for the interchain van der Waals forces, this pattern is stabilized by intermolecular continuous Cdbnd O⋯I⋯S halogen bonds in each zigzag line. At moderate concentration, a chiral kite-like nanoarchitecture are observed, in which the Cdbnd O⋯I⋯S and I⋯Odbnd C halogen bonds, along with the molecule-solvent Cdbnd O⋯I⋯H halogen bonds are the dominated forces to determine the structural formation. At low concentration, the molecules form a chiral cyclic network resulting from the solvent coadsorption mainly by molecule-molecule Cdbnd O⋯I⋯S halogen bonds and molecule-solvent Cdbnd O⋯I⋯H halogen bonds. The density of molecular packing becomes lower with the decreasing of the solution concentration. The solution-concentration dependent self-assembly of thienophenanthrene derivative with iodine and ester chain moieties reveals that the type of intermolecular halogen bond and the number of the co-adsorbing 1-octanic acids by molecule-solvent Cdbnd O⋯I⋯H halogen bonds determine the formation and transformation of chirality. This research emphasizes the role of different types of halogen (I) bonds in the controllable supramolecular structures and provides an approach for the fabrication of chirality.

  15. Flexible, polymer-supported, Si wire array photoelectrodes

    Energy Technology Data Exchange (ETDEWEB)

    Spurgeon, Joshua M.; Boettcher, Shannon W.; Brunschwig, Bruce S.; Lewis, Nathan S. [California Institute of Technology, Division of Chemistry and Chemical Engineering, Pasadena, CA (United States); Kelzenberg, Michael D.; Atwater, Harry A. [California Institute of Technology, Division of Engineering and Applied Science, Pasadena, CA (United States)

    2010-08-10

    Arrays of oriented, crystalline Si wires are transferred into flexible, transparent polymer films. The polymer-supported Si wire arrays in liquid-junction photoelectrochemical cells yield current-potential behavior similar to the Si wires attached to the brittle growth substrate. These systems offer the potential for attaining high solar energy-conversion efficiencies using modest diffusion length, readily grown, crystalline Si in a flexible, processable form. (Abstract Copyright [2010], Wiley Periodicals, Inc.)

  16. Ultra-stable Molecule-Surface Architectures at Metal Oxides: Structure, Bonding, and Electron-transfer Processes

    Energy Technology Data Exchange (ETDEWEB)

    Hamers, Robert John

    2013-12-07

    Research funded by this project focused on the development of improved strategies for functionalization of metal oxides to enhance charge-transfer processes relevant to solar energy conversion. Initial studies included Fe2O3, WO3, TiO2, SnO2, and ZnO as model oxide systems; these systems were chosen due to differences in metal oxidation state and chemical bonding types in these oxides. Later studies focused largely on SnO2 and ZnO, as these materials show particularly promising surface chemistry, have high electron mobility, and can be readily grown in both spherical nanoparticles and as elongated nanorods. New molecules were synthesized that allowed the direct chemical assembly of novel nanoparticle ?dyadic? structures in which two different oxide materials are chemically joined, leading to an interface that enhances the separation of of charge upon illumination. We demonstrated that such junctions enhance photocatalytic efficiency using model organic compounds. A separate effort focused on novel approaches to linking dye molecules to SnO2 and ZnO as a way to enhance solar conversion efficiency. A novel type of surface binding through

  17. Bonded Invar Clip Removal Using Foil Heaters

    Science.gov (United States)

    Pontius, James T.; Tuttle, James G.

    2009-01-01

    A new process uses local heating and temperature monitoring to soften the adhesive under Invar clips enough that they can be removed without damaging the composite underneath or other nearby bonds. Two 1x1 in. (approx.2.5x2.5 cm), 10-W/sq in. (approx.1.6-W/sq cm), 80-ohm resistive foil Kapton foil heaters, with pressure-sensitive acrylic adhesive backing, are wired in parallel to a 50-V, 1-A limited power supply. At 1 A, 40 W are applied to the heater pair. The temperature is monitored in the clip radius and inside the tube, using a dual thermocouple readout. Several layers of aluminum foil are used to speed the heat up, allowing clips to be removed in less than five minutes. The very local heating via the foil heaters allows good access for clip removal and protects all underlying and adjacent materials.

  18. Applications of surface analysis in the wire industry

    Science.gov (United States)

    Stout, David A.

    The quality of wire is judged not only by its physical properties such as tensile strength and fatigue resistance, but also by its surface finish. The surface roughness, oxide formation, cleanliness, and plating homogeneity and porosity are just a few of the surface properties than can influence the performance of a wire product. Coupled to this is the large amount of surface area generated in drawing wire. For example, a ten pound spool holds nine miles of 0.006″ diameter stainless steel wire. For these reasons surface analysis has become important both to the manufacturer and consumer of wire products. When surface analysis equipment such as AES, ESCA, and SIMS was first becoming commercially available in the late sixties and early seventies, the wire industry was beginning to enter a phase of technological development for many of its products. Wire manufacturers and users began using surface analysis to investigate such topics as adhesion of brass plated automobile tire cord to rubber and diffusion of layered deposits. Examples of surface analysis used for process control, problem solving, and project development include discoloration problems on stainless steel wire, welding problems with composite wires, diffusion formed brass coatings, and diffusion problems with solder coated and Cu plated steel wire.

  19. Wired to freedom

    DEFF Research Database (Denmark)

    Jepsen, Kim Sune Karrasch; Bertilsson, Margareta

    2017-01-01

    dimension of life science through a notion of public politics adopted from the political theory of John Dewey. We show how cochlear implantation engages different social imaginaries on the collective and individual levels and we suggest that users share an imaginary of being “wired to freedom” that involves...... new access to social life, continuous communicative challenges, common practices, and experiences. In looking at their lives as “wired to freedom,” we hope to promote a wider spectrum of civic participation in the benefit of future life science developments within and beyond the field of Cochlear...

  20. Electric wiring domestic

    CERN Document Server

    Coker, A J

    1992-01-01

    Electric Wiring: Domestic, Tenth Edition, is a clear and reliable guide to the practical aspects of domestic electric wiring. Intended for electrical contractors, installation engineers, wiremen and students, its aim is to provide essential up to date information on modern methods and materials in a simple, clear, and concise manner. The main changes in this edition are those necessary to bring the work into line with the 16th Edition of the Regulations for Electrical Installations issued by the Institution of Electrical Engineers. The book begins by introducing the basic features of domestic

  1. Evaluation of mechanical properties in metal wire mesh supported selective catalytic reduction (SCR) catalyst structures

    Science.gov (United States)

    Rajath, S.; Siddaraju, C.; Nandakishora, Y.; Roy, Sukumar

    2018-04-01

    The objective of this research is to evaluate certain specific mechanical properties of certain stainless steel wire mesh supported Selective catalytic reduction catalysts structures wherein the physical properties of the metal wire mesh and also its surface treatments played vital role thereby influencing the mechanical properties. As the adhesion between the stainless steel wire mesh and the catalyst material determines the bond strength and the erosion resistance of catalyst structures, surface modifications of the metal- wire mesh structure in order to facilitate the interface bonding is therefore very important to realize enhanced level of mechanical properties. One way to enhance such adhesion properties, the stainless steel wire mesh is treated with the various acids, i.e., chromic acid, phosphoric acid including certain mineral acids and combination of all those in various molar ratios that could generate surface active groups on metal surface that promotes good interface structure between the metal- wire mesh and metal oxide-based catalyst material and then the stainless steel wire mesh is dipped in the glass powder slurry containing some amount of organic binder. As a result of which the said catalyst material adheres to the metal-wire mesh surface more effectively that improves the erosion profile of supported catalysts structure including bond strength.

  2. A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices

    Science.gov (United States)

    Feng, Hongliang; Huang, Jihua; Yang, Jian; Zhou, Shaokun; Zhang, Rong; Chen, Shuhai

    2017-07-01

    A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the reactive system. The results show that the bonding layer is composed of Ni3Sn4 and residual fine Ni particles with a small amount of Ni3Sn2 at 340°C for 240 min, which has a heat-resistant temperature higher than 790°C. The microstructural evolution and thermal characteristic of the bonding layer for various times at 300°C and 340°C were also studied, respectively. This reveals that, after isothermally holding for 240 min at 300°C and for 180 min at 340°C, Sn has been completely transformed into Ni-Sn intermetallic compounds (IMCs) and the bonding layer is mainly composed of Ni3Sn4 and residual Ni particles. The analysis result for the mechanical properties of the joint shows that the hardness of the bonding layer at 340°C for 240 min is uniform and that the average value reaches 3.66 GPa, which is close to that of the Ni3Sn4 block material. The shear test shows that, as the holding time increases from 60 min to 180 min at 340°C, because of the existence of Sn, the disparity of shear strength between room temperature and 350°C is large. But when the holding time is 180 min or longer, Sn has been completely transformed into Ni-Sn IMCs. Their performances are very similar whether at room temperature or 350°C.

  3. Practical wiring in SI units

    CERN Document Server

    Miller, Henry A

    2013-01-01

    Practical Wiring, Volume 1 is a 13-chapter book that first describes some of the common hand tools used in connection with sheathed wiring. Subsequent chapters discuss the safety in wiring, cables, conductor terminations, insulating sheathed wiring, conductor sizes, and consumer's control equipments. Other chapters center on socket outlets, plugs, lighting subcircuits, lighting accessories, bells, and primary and secondary cells. This book will be very valuable to students involved in this field of interest.

  4. Wire EDM for Refractory Materials

    Science.gov (United States)

    Zellars, G. R.; Harris, F. E.; Lowell, C. E.; Pollman, W. M.; Rys, V. J.; Wills, R. J.

    1982-01-01

    In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.

  5. Wire chambers: Trends and alternatives

    International Nuclear Information System (INIS)

    Regler, Meinhard

    1992-01-01

    The subtitle of this year's Vienna Wire Chamber Conference - 'Recent Trends and Alternative Techniques' - signalled that it covered a wide range of science and technology. While an opening Vienna talk by wire chamber pioneer Georges Charpak many years ago began 'Les funerailles des chambres a fils (the burial of wire chambers)', the contrary feeling this year was that wire chambers are very much alive!

  6. Command Wire Sensor Measurements

    Science.gov (United States)

    2012-09-01

    CFAR Constant False Alarm Rate CWIE Command Wire-Improvised Explosive Device EMI Electromagnetic Induction GPR Ground Penetrating Radar...this, some type of constant false alarm rate ( CFAR ) receiver is required. CFAR automatically raises the threshold level to keep clutter echoes and

  7. Transport in quantum wires

    Indian Academy of Sciences (India)

    Transport in quantum wires. SIDDHARTHA LAL, SUMATHI RAO£ and DIPTIMAN SEN. Centre for Theoretical Studies, Indian Institute of Science, Bangalore 560 012, India. £ Harish-chandra Research Institute, Chhatnag Road, Jhusi, Allahabad 211 019, India. Abstract. With a brief introduction to one-dimensional channels ...

  8. Wire chamber conference

    International Nuclear Information System (INIS)

    Bartl, W.; Neuhofer, G.; Regler, M.

    1986-02-01

    This booklet contains program and the abstracts of the papers presented at the conference, most of them dealing with performance testing of various types of wire chambers. The publication of proceedings is planned as a special issue of 'Nuclear instruments and methods' later on. All abstracts are in English. An author index for the book of abstracts is given. (A.N.)

  9. A KBE Application for Automatic Aircraft Wire Harness Routing

    NARCIS (Netherlands)

    Zhu, Z.; Van Tooren, M.J.L.; La Rocca, G.

    2012-01-01

    Wire harness design is an increasingly complex task. Knowledge Based Engineering (KBE) and optimization techniques can be used to support designers in handling this complexity. The wire harness design process can be divided in three main parts, namely electrical design, configuration design and

  10. Low temperature annealing of cold-drawn pearlitic steel wire

    DEFF Research Database (Denmark)

    Zhang, Xiaodan; Bech, Jakob Ilsted; Hansen, Niels

    2015-01-01

    Cold-drawn pearlitic steel wires are nanostructured and the flow stress at room temperature can reach values above 6 GPa. A typical characteristic of the nanostructured metals, is the low ductility and thermal stability. In order to optimize both the processing and application of the wires, the t...

  11. Parental Bonding

    Directory of Open Access Journals (Sweden)

    T. Paul de Cock

    2014-08-01

    Full Text Available Estimating the early parent–child bonding relationship can be valuable in research and practice. Retrospective dimensional measures of parental bonding provide a means for assessing the experience of the early parent–child relationship. However, combinations of dimensional scores may provide information that is not readily captured with a dimensional approach. This study was designed to assess the presence of homogeneous groups in the population with similar profiles on parental bonding dimensions. Using a short version of the Parental Bonding Instrument (PBI, three parental bonding dimensions (care, authoritarianism, and overprotection were used to assess the presence of unobserved groups in the population using latent profile analysis. The class solutions were regressed on 23 covariates (demographics, parental psychopathology, loss events, and childhood contextual factors to assess the validity of the class solution. The results indicated four distinct profiles of parental bonding for fathers as well as mothers. Parental bonding profiles were significantly associated with a broad range of covariates. This person-centered approach to parental bonding has broad utility in future research which takes into account the effect of parent–child bonding, especially with regard to “affectionless control” style parenting.

  12. Shape memory alloy wire-based smart natural rubber bearing

    International Nuclear Information System (INIS)

    Hedayati Dezfuli, F; Shahria Alam, M

    2013-01-01

    In this study, two types of smart elastomeric bearings are presented using shape memory alloy (SMA) wires. Due to the unique characteristics of SMAs, such as the superelastic effect and the recentering capability, the residual deformation in SMA-based natural rubber bearings (SMA-NRBs) is significantly reduced whereas the energy dissipation capacity is increased. Two different configurations of SMA wires incorporated in elastomeric bearings are considered. The effect of several parameters, including the shear strain amplitude, the type of SMA, the aspect ratio of the base isolator, the thickness of SMA wire, and the amount of pre-strain in the wires on the performance of SMA-NRBs is investigated. Rubber bearings are composed of natural rubber layers bonded to steel shims as reinforcement. Results show that ferrous SMA wire, FeNiCuAlTaB, with 13.5% superelastic strain and a very low austenite finish temperature (−62 °C), is the best candidate to be used in SMA-NRBs subjected to high shear strain amplitudes. In terms of the lateral flexibility and wire strain level, the smart rubber bearing with a cross configuration of SMA wires is more efficient. Moreover, the cross configuration can be implemented in high-aspect-ratio elastomeric bearings since the strain induced in the wire does not exceed the superelastic range. When cross SMA wires with 2% pre-strain are used in a smart NRB, the dissipated energy is increased by 74% and the residual deformation is decreased by 15%. (paper)

  13. Additive Manufacturing of H11 with Wire-Based Laser Metal Deposition

    Directory of Open Access Journals (Sweden)

    Stella Holzbach Oliari

    2017-12-01

    Full Text Available Abstract Laser additive manufacturing (LAM is a near-net-shape production technique by which a part can be built up from 3D CAD model data, without material removal. Recently, these production processes gained attention due to the spreading of polymer-based processes in private and commercial applications. However, due to the insufficient development of metal producing processes regarding design, process information and qualification, resistance on producing functional components with this technology is still present. To overcome this restriction further studies have to be undertaken. The present research proposes a parametric study of additive manufacturing of hot work tool steel, H11. The selected LAM process is wire-based laser metal deposition (LMD-W. The study consists of parameters optimization for single beads (laser power, travel speed and wire feed rate as well as lateral and vertical overlap for layer-by-layer technique involved in LMD process. Results show that selection of an ideal set of parameters affects substantially the surface quality, bead uniformity and bond between substrate and clad. Discussion includes the role of overlapping on the soundness of parts based on the height homogeneity of each layer, porosity and the presence of gaps. For the conditions tested it was shown that once the deposition parameters are selected, lateral and vertical overlapping determines the integrity and quality of parts processed by LAM.

  14. Effect of resin cement, aging process and root level on the bond strength of the resin-fiber posts

    Science.gov (United States)

    Almuhim, Khalid Salman

    Background. Little is known about the long-term clinical bonding effectiveness of the Fiber-reinforced composite (FRC) posts cemented with self-etch adhesive systems. Bond stability and longevity of the cemented post are adversely affected by physical and chemical factors over time, such as expansion and contraction stresses caused by thermal changes and occlusal load. This clinical condition can be simulated in vitro by thermocyclic loading; and bonding effectiveness can be evaluated by applying the micropush out test. Therefore, more in vitro studies are needed to evaluate the bond strength of the fiber posts cemented with different resin cement systems after simulating the artificial aging induced by thermocycling. The aim of this study was to compare the microtensile bond strength of two different resin cement systems (total etch, and self-etch resin cement system) used for cementation of fiber reinforced composite posts in three different aging periods using thermocycling. Methods. Following IRB approval, sixty freshly extracted bicuspid single rooted natural teeth were endodontically treated, and the post-spaces were prepared to receive a fiber-post cemented with either a total etch resin cement (Rely-X Ultimate) or with a self-etch resin cement (Rely-X Unicem). No thermocycling, 20,000 and 40,000 cycles was used to age the specimens. Teeth were randomly allocated into six different groups: G1 - Control: Rely-X Ultimate cement with no thermocycling. G2: Rely-X Ultimate cement with 20,000 thermocycling. G3: Rely-X Ultimate cement with 40,000 thermocycling. G4: Rely-X Unicem cement. G5: Rely-X Unicem cement. G6: Rely-X Unicem cement. Microtensile bond strength determined using a micropush out test on a universal testing machine (MTS). Additionally, the failure mode of each specimen was observed under a stereomicroscope (Olympus) at 40x magnification. Finally, one representative sample was randomly selected from each of the five failure modes for scanning

  15. Dynamic breaking of a single gold bond

    DEFF Research Database (Denmark)

    Pobelov, Ilya V.; Lauritzen, Kasper Primdal; Yoshida, Koji

    2017-01-01

    of a single Au-Au bond and show that the breaking force is dependent on the loading rate. We probe the temperature and structural dependencies of breaking and suggest that the paradox can be explained by fast breaking of atomic wires and slow breaking of point contacts giving very similar breaking forces....

  16. Integrated Electrical Wire Insulation Repair System

    Science.gov (United States)

    Williams, Martha; Jolley, Scott; Gibson, Tracy; Parks, Steven

    2013-01-01

    An integrated system tool will allow a technician to easily and quickly repair damaged high-performance electrical wire insulation in the field. Low-melt polyimides have been developed that can be processed into thin films that work well in the repair of damaged polyimide or fluoropolymer insulated electrical wiring. Such thin films can be used in wire insulation repairs by affixing a film of this low-melt polyimide to the damaged wire, and heating the film to effect melting, flow, and cure of the film. The resulting repair is robust, lightweight, and small in volume. The heating of this repair film is accomplished with the use of a common electrical soldering tool that has been modified with a special head or tip that can accommodate the size of wire being repaired. This repair method can furthermore be simplified for the repair technician by providing replaceable or disposable soldering tool heads that have repair film already "loaded" and ready for use. The soldering tool heating device can also be equipped with a battery power supply that will allow its use in areas where plug-in current is not available

  17. Evaluation of the shear bond strength of lingual brackets manufactured by three different processes using two different adhesive primers: An in vitro study

    Directory of Open Access Journals (Sweden)

    Shrinivas Ashtekar

    2016-01-01

    Full Text Available Objective: To compare and evaluate the shear bond strength (SBS of lingual brackets, manufactured by three different processes, that is, laser sintering, milling, and casting, bonded with two different adhesive primers. Materials and Methods: One hundred and twenty premolars were selected, and three types of lingual brackets were used, namely, STB (milling, 7th Generation (casting, and lingualmatrix (laser sintering. Forty brackets per system were used half of which were sandblasted while the other half were used as available. Further, these were subdivided and bonded with Transbond XT primer and adhesive and 3M ESPE Primer and Transbond XT adhesive. Customization of STB and 7th Generation was done by Torque Angulation Reference Guide, Lingualmatrix had bases customized by Computer-aided design/computer-aided manufacturing. SBS was tested with universal testing machine and evaluated for adhesive remnant index (ARI. Results: Statistical analysis showed that surface treatment, use of different primers, method of customization influenced the SBS, and ARI suggested that the fracture occurred between composite and bracket interface. Conclusion: Lingualmatrix bracket showed greater SBS as compared to STB and 7th Generation, sandblasting increased SBS. 3M ESPE primer group showed increased SBS as that bonded with Transbond XT primer. The fracture was between the composite bracket interface.

  18. Quantum conductance in silicon quantum wires

    CERN Document Server

    Bagraev, N T; Klyachkin, L E; Malyarenko, A M; Gehlhoff, W; Ivanov, V K; Shelykh, I A

    2002-01-01

    The results of investigations of electron and hole quantum conductance staircase in silicon quantum wires are presented. The characteristics of self-ordering quantum wells of n- and p-types, which from on the silicon (100) surface in the nonequilibrium boron diffusion process, are analyzed. The results of investigations of the quantum conductance as the function of temperature, carrier concentration and modulation degree of silicon quantum wires are given. It is found out, that the quantum conductance of the one-dimensional channels is observed, for the first time, at an elevated temperature (T >= 77 K)

  19. Numerical Simulation of Wire-Coating

    DEFF Research Database (Denmark)

    Wapperom, Peter; Hassager, Ole

    1999-01-01

    A finite element program has been used to analyze the wire-coating process of an MDPE melt. The melt is modeled by a nonisothermal Carreau model. The emphasis is on predicting an accurate temperature field. Therefore, it is necessary to include the heat conduction in the metal parts. A comparison...... is made with the results of a simulation that models the heat conduction in the metal head by means of a Biot boundary condition. The influence of the wire velocity, inlet temperature and power-law index will be examined....

  20. Analysis of electrical explosion of wire systems for the production of ...

    Indian Academy of Sciences (India)

    With the intention of developing better exploding wire system for the produc- ... the emphasise has been given to explain the process involved to produce nano phase material by EEW method experimentally. 2. Theory. For a wire of length 'l' and ... One exploder is a cage type open system (set-up I) where wires are mounted ...

  1. A study on the development of high-Tc superconducting wire

    International Nuclear Information System (INIS)

    Won, Dong Yeon; Chang, In Soon; Lee, Jong Min; Um, Tae Yoon; Hong, Kyae Won; Lee, Ho Jin; Lee, Hee Kwun; Kim, Chan Joong; Park, Soon Dong; Kim, Woo Gon; Kim, Ki Baek; Kwon, Sun Chil

    1992-10-01

    On this study Y-Ba-Cu-O was prepared by partial melt process and superconducting wire was fabricated by powder-in-tube method. First, mechancial properties, electrical properties, microstructure and oxygen diffusion behavior were observed. Second, through fabricated superconducting wire, conceptual design, composition and plasticity of filament superconducting wire were investigated. (Author)

  2. Recent development of drastically innovative BSCCO wire (DI-BISCCO)

    International Nuclear Information System (INIS)

    Kikuchi, M.; Kato, T.; Ohkura, K.; Ayai, N.; Fujikami, J.; Fujino, K.; Kobayashi, S.; Ueno, E.; Yamazaki, K.; Yamade, S.; Hayashi, K.; Sato, K.; Nagai, T.; Matsui, Y.

    2006-01-01

    Up to this day, Ag-sheathed Bi2223 superconducting wires have been widely investigated and the long wires about 1000 m have been produced by using powder-in-tube (PIT) method on a commercial basis in the various facilities or companies. Although the wires are used for some applications such as HTS cables, magnets, motor and so on, the Bi2223 wires not only require much more improvements of the superconducting properties such as critical current, mechanical properties, but also longer and more uniform wires. Recently, the performances of Bi2223 wires have been drastically improved by using Controlled Over Pressure (CT-OP) sintering process. CT-OP process increased critical current (I c ) by more than 60% at 77 K and self field and improved the mechanical strength by more than 70%. The maximum I c was increased up to 166 A. These drastic improvements were caused by the higher density of Bi2223 filament up to almost 100% and better connectivity of the Bi2223 grains. The dense structure of the Bi2223 filaments prevents the ballooning phenomenon which is caused by the gasification of the trapped liquid nitrogen during temperature rise. Additionally, higher uniformity and higher production yield of long length wire were also achieved by exterminating defects during sintering. These high performance levels in CT-OP wires have contributed commercial level applications. We call as Drastically Innovative BSCCO (DI-BSCCO)

  3. Wire chamber gases

    International Nuclear Information System (INIS)

    Va'vra, J.

    1992-04-01

    In this paper, we describe new developments in gas mixtures which have occurred during the last 3--4 years. In particular, we discuss new results on the measurement and modeling of electron drift parameters, the modeling of drift chamber resolution, measurements of primary ionization and the choice of gas for applications such as tracking, single electron detection, X-ray detection and visual imaging. In addition, new results are presented on photon feedback, breakdown and wire aging

  4. Vienna Wire Chamber Conference

    International Nuclear Information System (INIS)

    Anon.

    1983-01-01

    After those of 1978 and 1980, a third Wire Chamber Conference was held from 15-18 February in the Technical University of Vienna. Eight invited speakers covered the field from sophisticated applications in biology and medicine, via software, to the state of the art of gaseous detectors. In some forty other talks the speakers tackled in more detail the topics of gaseous detectors, calorimetry and associated electronics and software

  5. Water-wire catalysis in photoinduced acid-base reactions.

    Science.gov (United States)

    Kwon, Oh-Hoon; Mohammed, Omar F

    2012-07-07

    The pronounced ability of water to form a hyperdense hydrogen (H)-bond network among itself is at the heart of its exceptional properties. Due to the unique H-bonding capability and amphoteric nature, water is not only a passive medium, but also behaves as an active participant in many chemical and biological reactions. Here, we reveal the catalytic role of a short water wire, composed of two (or three) water molecules, in model aqueous acid-base reactions synthesizing 7-hydroxyquinoline derivatives. Utilizing femtosecond-resolved fluorescence spectroscopy, we tracked the trajectories of excited-state proton transfer and discovered that proton hopping along the water wire accomplishes the reaction more efficiently compared to the transfer occurring with bulk water clusters. Our finding suggests that the directionality of the proton movements along the charge-gradient H-bond network may be a key element for long-distance proton translocation in biological systems, as the H-bond networks wiring acidic and basic sites distal to each other can provide a shortcut for a proton in searching a global minimum on a complex energy landscape to its destination.

  6. Dual wire welding torch and method

    Science.gov (United States)

    Diez, Fernando Martinez; Stump, Kevin S.; Ludewig, Howard W.; Kilty, Alan L.; Robinson, Matthew M.; Egland, Keith M.

    2009-04-28

    A welding torch includes a nozzle with a first welding wire guide configured to orient a first welding wire in a first welding wire orientation, and a second welding wire guide configured to orient a second welding wire in a second welding wire orientation that is non-coplanar and divergent with respect to the first welding wire orientation. A method of welding includes moving a welding torch with respect to a workpiece joint to be welded. During moving the welding torch, a first welding wire is fed through a first welding wire guide defining a first welding wire orientation and a second welding wire is fed through a second welding wire guide defining a second welding wire orientation that is divergent and non-coplanar with respect to the first welding wire orientation.

  7. Numerical model for electrical explosion of copper wires in water

    Science.gov (United States)

    Chung, Kyoung-Jae; Lee, Kern; Hwang, Y. S.; Kim, Deok-Kyu

    2016-11-01

    This paper presents a simple but quite accurate numerical model for analyzing electrical explosion of copper wires in water. The numerical model solves a circuit equation coupled with one-dimensional magneto-hydrodynamic (MHD) equations with the help of appropriate wide-range equation of state (EOS) and electrical conductivity for copper. The MHD equations are formulated in a Lagrangian form to identify the interface between the wire and surrounding water clearly. A quotidian EOS (QEOS) that is known as the simplest form of EOS is utilized to build wide-range EOS for copper. In the QEOS, we consider the liquid-vapor phase transition, which is critical in analyzing the wire explosion system. For the electrical conductivity of copper, a semi-empirical set of equations covering from solid state to partially ionized plasma state are employed. Experimental validation has been performed with copper wires of various diameters, which are exploded by a microsecond timescale pulsed capacitive discharge. The simulation results show excellent agreements with the experimental results in terms of temporal motions of a plasma channel boundary and a shock front as well as current and voltage waveforms. It is found that the wire explodes (vaporizes) along the liquid branch of a binodal curve irrespective of wire dimension and operating voltage. After the explosion, the wire becomes a plasma state right away or after the current pause (dwell), depending on the operating conditions. It is worth noting that such a peculiar characteristic of wire explosion, i.e., current pause and restrike, is well simulated with the present numerical model. In particular, it is shown that the wire cools down along the vapor branch of the binodal curve during the current dwell, due to a significant difference of thermodynamic characteristics across the binodal curve. The influence of radiation for studying nonideal plasmas with a wire explosion technique and a physical process for shock wave formation

  8. Single Wire Detector Performance Over One Year of Operation

    CERN Document Server

    Hervas Aguilar, David Alberto

    2014-01-01

    Abstract When ionizing radiation passes through gas chambers in single wire detectors gas molecules separate into ions and electrons. By applying a strong localized electric field near the single wire an avalanche of electrons is created and it can be collected. The current produced in the wire is then proportional to the energy of the particle detected. Nevertheless, many factors can contribute to detector aging effects which are visible in a loss of gain caused by deposition of contaminants on the collecting wire. This study consists on novel data analysis techniques used to process large amounts of data produced by two simultaneously running single wire detectors. Aging effects are analyzed while environmental fluctuations are corrected for. A series of scripts carry out data filtering, data matching, corrections, and finally trend plotting by using ROOT’s extensive libraries developed at CERN.

  9. Method and apparatus for diamond wire cutting of metal structures

    Science.gov (United States)

    Parsells, Robert; Gettelfinger, Geoff; Perry, Erik; Rule, Keith

    2005-04-19

    A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO.sub.2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

  10. Development of environmental-friendly wire and cable

    International Nuclear Information System (INIS)

    Ueno, Keiji

    1996-01-01

    The electron beam technology has been used in many industrial fields as a method of conventional polymer modification or optimum processability. The main industrial fields of radiation crosslinking are wire and cable, heat shrinkable tubings, plastic foams, precuring of tires, floppy disk curing, foods packaging films, and so on. The radiation crosslinking of wire and cable was started in 1961 in Japan and 15 wire and cable companies are now using electron beam accelerators for production or R and D. The dominant characteristics of crosslinking of insulation materials are application at high temperature, good oil and chemical resistibility and high mechanical properties. These radiation crosslinking wire and cable are applied widely in electronics equipments and automobiles. Recently, electronics manufacturers have indicated deep concern over the effects on the environment. Wire and cable also are required to be applicable for environmental preservation. (J.P.N.)

  11. Metering Wheel-Wire Track Wire Boom Deployment Mechanism

    Science.gov (United States)

    Granoff, Mark S.

    2014-01-01

    The NASA MMS Spin Plane Double Probe (SDP) Deployer utilizes a helical path, rotating Metering Wheel and a spring loaded Wire "Holding" Track to pay out a "fixed end" 57 meter x 1.5 mm diameter Wire Boom stored between concentric storage cylinders. Unlike rotating spool type storage devices, the storage cylinders remain stationary, and the boom wire is uncoiled along the length of the cylinder via the rotation of the Metering Wheel. This uncoiling action avoids the need for slip-ring contacts since the ends of the wire can remain stationary. Conventional fixed electrical connectors (Micro-D type) are used to terminate to operational electronics.

  12. Effects of magnetostatic interaction on the magnetization processes in Fe73.5Cu1Nb3Si13.5B9 nanocrystalline wires

    International Nuclear Information System (INIS)

    Li, Y.F.; Vazquez, M.; Chen, D.X.; Hernando, A.

    2002-01-01

    Fe 73.5 Cu 1 Nb 3 Si 13.5 B 9 amorphous wire was annealed at different temperatures (T a =400-700 deg. C, for 30 min) that result in partial devitrification and subsequently, the quasi-saturated hysteresis loop was measured. It is found that the loops are not symmetric, exhibiting two coercive fields, H c1 and H c2 , on descending and ascending branches, respectively. Moreover, the asymmetry degree is modified when the sample is previously magnetized under a field of 60 kA m -1 . The dependence on both maximum measured field, H m , and temperature, T, of the displaced loop has been determined. With increasing H m , the shift H sh =(H c2 +H c1 )/2 decreases and the coercivity H c =(H c2 -H c1 )/2 increases, but H sh -H c H c1 remains constant. Both H sh and the magnetic polarization, μ 0 M m , at maximum field decreases with elevating T. The loop of this sample also shows a remarkable time-effect. The H m - and T-dependent H sh is discussed considering the existence of an effective bias-field generated from the magnetostatic interaction between the nanocrystalline particles and residual soft matrix, and the time-effect could be ascribed to the dipolar interaction among the particles. (author)

  13. Note: Recombination of H+ and OH− ions along water wires

    International Nuclear Information System (INIS)

    Lee, Song Hi; Rasaiah, Jayendran C.

    2013-01-01

    Transport and recombination of hydrogen and hydroxide ions along a hydrogen-bonded water wire are studied by molecular dynamics simulation using a dissociating model for water. The results are compared with a recent CP-MD study of neutralization in bulk water [A. Hassanali, M. K. Prakrash, H. Eshet, and M. Parrinello, Proc. Natl. Acad. Sci. U.S.A. 108, 20410 (2011)]. The translocation of H + and OH − along the wire is faster than in the bulk water, followed by compression of the water wire when two water molecules separate the transported ions. Neutralization occurs with the concerted transfer of three protons as in the bulk water, followed by energy dissipation along the water chain

  14. The role of temperature in copper wire drawing

    Science.gov (United States)

    Noseda, Corrado

    Wire is produced by drawing, which consists of pulling a rod of the material to be processed through a series of funnel-shaped holes, or dies, of decreasing size. Drawing involves plastic deformation and friction within the contact zone between the wire and the die. These occurrences contribute to the generation of heat in the wire, which may affect its final properties. High drawing speeds and the use of several dies in one production line---to improve productivity---may accentuate heating to a point where recrystallization of the wire material sets in and its properties are affected. Also, excessive temperatures may lead to an accelerated deterioration of the lubricants used, to the point that the optimum lubrication mechanism is no longer prevailing, with consequent negative effects on the surface quality of the processed wire. A number of analytical models estimating the temperature increase in drawn wires, due to the dissipation of plastic deformation energy and to the friction between wire and die, were reviewed. While all models agree on the contribution of plastic deformation to heating, some discrepancies exist as to the effect of friction. The original treatment, developed in Germany in 1943, provided slightly higher peak temperature values than other models for the parameters used in the calculations, which are simulative of commercial practice on copper wire. A finite element study conducted in the framework of this research showed that the axial heat flow within the wire, which was assumed to be negligible in the reviewed analytical theories, could, in fact, not be disregarded. It also showed that a purely isothermal process cannot be obtained in practice, whatever adjustment of the process parameters is undertaken. In order to unequivocally correlate the effects of heating on the properties of wire and the temperature it experiences during commercial drawing, electrolytic tough pitch copper wire was drawn under independently controlled, quasi

  15. Tailoring structures through two-step annealing process in nanostructured aluminum produced by accumulative roll-bonding

    DEFF Research Database (Denmark)

    Kamikawa, Naoya; Huang, Xiaoxu; Hansen, Niels

    2008-01-01

    Due to structural and textural heterogeneities and a high content of stored energy, annealing of nanostructured metals is difficult to control in order to avoid non-uniform coarsening and recrystallization. The present research demonstrates a method to homogenize the structure by annealing at low.......8) by accumulative roll-bonding at room temperature. Isochronal annealing for 0.5 h of the deformed samples shows the occurrence of recrystallization at 200 °C and above. However, when introducing an annealing step for 6 h at 175 °C, no significant recrystallization is observed and relatively homogeneous structures...

  16. The influnece of the partial single reduction on mechanical properties wires made from trip steel with 0,43 % C

    Directory of Open Access Journals (Sweden)

    S. Wiewiórowska

    2015-01-01

    Full Text Available Large strain inhomogeneity is caused by the shape of deformation zone of die and by the friction between tool and deformed wire for multistage wire drawing processes. The influence on the value of the redundant strain by the use of different partial single reductions during all wire drawing process was observed. This problem is particularly important for TRIP steel wires drawing processes because the strain intensity influences on the speed of retained austenite transformation into martensite.

  17. Wire communication engineering

    International Nuclear Information System (INIS)

    Son, Byeong Tae

    1997-02-01

    This book describes wire telecommunication engineering/ It is divided into eleven chapter, which deal with Introduction with development of telecommunication, voice and sound wave and communication network, Telegraphy with summary of telegraphy, code of telegraphy, communication speed, morse and telex, Telephone on structure, circuit and image telephone, Traffic on telecommunication traffic, transmission of line about theory, cable line and loaded cable, carrier communication with carrier telegraphy and carrier telephone, optical communication with types, structure, specialty, laser and equipment, DATA, Mobile telecommunication on summary, mobile telephone, radio paging and digital mobile telecommunication, ISDN with channel of ISDN, and service of ISDN, and design of telecommunication.

  18. Wiring regulations in brief

    CERN Document Server

    Tricker, Ray

    2012-01-01

    Tired of trawling through the Wiring Regs?Perplexed by Part P?Confused by cables, conductors and circuits?Then look no further! This handy guide provides an on-the-job reference source for Electricians, Designers, Service Engineers, Inspectors, Builders, Students, DIY enthusiastsTopic-based chapters link areas of working practice - such as cables, installations, testing and inspection, special locations - with the specifics of the Regulations themselves. This allows quick and easy identification of the official requirements relating to the situati

  19. The Micro Wire Detector

    Energy Technology Data Exchange (ETDEWEB)

    Adeva, B.; Gomez, F.; Pazos, A.; Pfau, R.; Plo, M. E-mail: maximo.plo@cern.ch; Rodriguez, J.M.; Vazquez, P.; Labbe, J.C

    1999-10-11

    We present the performance of a new proportional gas detector. Its geometry consists of a cathode plane with 70x70 {mu}m{sup 2} apertures, crossed by 25 {mu}m anode strips to which it is attached by 50 {mu}m kapton spacers. In the region where the avalanche takes place, the anode strips are suspended in the gas mixture as in a standard wire chamber. This detector exhibits high rate capability and large gains, introducing very little material. (author)

  20. Epitaxial semiconductor quantum wires.

    Science.gov (United States)

    Wu, J; Chen, Y H; Wang, Z G

    2008-07-01

    The investigation on the direct epitaxial quantum wires (QWR) using MBE or MOCVD has been persuited for more than two decades, more lengthy in history as compared with its quantum dot counterpart. Up to now, QWRs with various structural configurations have been produced with different growth methods. This is a reviewing article consisting mainly of two parts. The first part discusses QWRs of various configurations, together with laser devices based on them, in terms of the two growth mechanisms, self-ordering and self-assembling. The second part gives a brief review of the electrical and optical properties of QWRs.

  1. The use of a neodymium-iron-boron magnet device for positioning a multi-stranded wire retainer in lingual retention--a pilot study in humans.

    Science.gov (United States)

    Hahn, Wolfram; Fricke, Julia; Fricke-Zech, Susanne; Zapf, Antonia; Gruber, Rudolf; Sadat-Khonsari, Reza

    2008-10-01

    The aim of this study was to evaluate the time requirement of a newly developed device made of neodymium-iron-boron (NdFeB) magnets for positioning a multi-stranded, canine-to-canine retainer during bonding compared with dental floss and a transfer tray. Forty-five patients aged between 12 and 33 years (26 male, 19 female) previously treated with fixed appliances were enrolled in the study. The patients were randomly allocated to three groups (15 per group). For each group a mandibular canine-to-canine retainer of 0.018 inch Dentaflex multi-stranded wire (Dentaurum) was prefabricated for each patient on a cast. The bonding procedure was identical, except for the method of positioning the wire during adhesive fixation: group A dental floss, group B a small prefabricated transfer tray of dental resin and group C the NdFeB magnet device. For each group, the time required for the complete bonding process was measured. Kruskal-Wallis and Wilcoxon-Mann-Whitney tests were used for group and pairwise comparisons, respectively. The three methods required statistically significant different times (P NdFeB magnet device is a timesaving appliance for positioning a multi-stranded, canine-to-canine retainer during bonding when compared with dental floss and an individually prefabricated transfer tray.

  2. 46 CFR 111.60-11 - Wire.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Wire. 111.60-11 Section 111.60-11 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Wiring Materials and Methods § 111.60-11 Wire. (a) Wire must be in an enclosure. (b) Wire must be...

  3. Comprehensive physical analysis of bond wire interfaces in power modules

    DEFF Research Database (Denmark)

    Popok, Vladimir; Pedersen, Kristian Bonderup; Kristensen, Peter Kjær

    2016-01-01

    -sectioning combined with optical microscopy and scanning electron microscopy assisted by focused ion beam milling. These experimental results show very good agreement with wear out effects predicted by simulations. Additionally, measurements of resistance using four-point probe method are demonstrated to be a very...

  4. Corrosion of Wires on Wooden Wire-Bound Packaging Crates

    Science.gov (United States)

    Samuel L. Zelinka; Stan Lebow

    2015-01-01

    Wire-bound packaging crates are used by the US Army to transport materials. Because these crates may be exposed to harsh environments, they are dip-treated with a wood preservative (biocide treatment). For many years, zinc-naphthenate was the most commonly used preservative for these packaging crates and few corrosion problems with the wires were observed. Recently,...

  5. Modelling of drawing and rolling of high carbon flat wires

    International Nuclear Information System (INIS)

    Bobadilla, C.; Persem, N.; Foissey, S.

    2007-01-01

    In order to meet customer requirements, it is necessary to develop new flat wires with a high tensile strength and a high width/thickness ratio. These products are manufactured from wire rod. The first step is to draw the wire until we have the required mechanical properties and required surface area of the section. After this, the wire is rolled from a round to a rectangular section. During the flat rolling process it can be reduced by more than 50%. Then the wire is exposed to a high level of stress during this process. Modelling allows us to predetermine this stress level, taking into account the final dimensions and the mechanical properties, thus optimising both rolling and drawing process. Forge2005 was used in order to simulate these processes. The aim of this study is to determine the value of residual stresses after drawing and so to optimise rolling. Indeed, the highest stress values are reached at this step of the process by changing the section of the wire from a round to a rectangular one. In order to evaluate the stress value accuracy for high strain levels, a behaviour law has been identified. This is a result of tensile tests carried out at each step of the drawing process. Finally, a multi-axial damage criterion was implemented using Forge2005. The optimisation of the rolling is directly linked to the minimisation of this criterion

  6. Improved superconducting magnet wire

    Science.gov (United States)

    Schuller, I.K.; Ketterson, J.B.

    1983-08-16

    This invention is directed to a superconducting tape or wire composed of alternating layers of copper and a niobium-containing superconductor such as niobium of NbTi, Nb/sub 3/Sn or Nb/sub 3/Ge. In general, each layer of the niobium-containing superconductor has a thickness in the range of about 0.05 to 1.5 times its coherence length (which for Nb/sub 3/Si is 41 A) with each copper layer having a thickness in the range of about 170 to 600 A. With the use of very thin layers of the niobium composition having a thickness within the desired range, the critical field (H/sub c/) may be increased by factors of 2 to 4. Also, the thin layers of the superconductor permit the resulting tape or wire to exhibit suitable ductility for winding on a magnet core. These compositions are also characterized by relatively high values of critical temperature and therefore will exhibit a combination of useful properties as superconductors.

  7. A DFT Study of R-X Bond Dissociation Enthalpies of Relevance to the Initiation Process of Atom Transfer Radical Polymerization

    DEFF Research Database (Denmark)

    Gillies, Malcolm Bjørn; Matyjaszewski, Krzysztof; Norrby, Per-Ola

    2003-01-01

    DFT calculations at the B3P86/6-31G** level have been carried out to derive the bond dissociation energies (BDE) and free energies for a number of R-X systems (X ) Cl, Br, I, N3, and S2-CNMe2) that have been or can potentially be used as initiators for atom transfer radical polymerization (ATRP...... with the equilibrium constants that have been determined from ATRP polymerization rates and from model studies of activation-deactivation-termination processes in the absence of monomer. These comparisons reveal the effectiveness of the DFT-computed BDEs for predicting polymerization rates for new monomers in ATRP...

  8. Novel manufacturing process of nanoparticle/Al composite filler metals of tungsten inert gas welding by accumulative roll bonding

    Energy Technology Data Exchange (ETDEWEB)

    Fattahi, M., E-mail: fattahi.put@gmail.com [Technical Inspection Engineering Department, Petroleum University of Technology, Abadan (Iran, Islamic Republic of); Noei Aghaei, V. [Aerospace Engineering Department, Sharif University of Technology, Tehran (Iran, Islamic Republic of); Dabiri, A.R. [Technical Inspection Engineering Department, Petroleum University of Technology, Abadan (Iran, Islamic Republic of); Amirkhanlou, S. [Young Researchers and Elite Club, Najafabad Branch, Islamic Azad University, Najafabad (Iran, Islamic Republic of); Akhavan, S.; Fattahi, Y. [Materials Engineering Department, Isfahan University of Technology, Isfahan (Iran, Islamic Republic of)

    2015-11-11

    In the present work, accumulative roll bonding (ARB) was used as an effective method for manufacturing nanoparticle/Al composite filler metals of tungsten inert gas (TIG) welding. After welding, the distribution of ceramic nanoparticles and mechanical properties of welds were investigated. By applying ARB, ceramic nanoparticles were uniformly dispersed in the composite filler metals. Consequently, the welds produced by these filler metals had a uniform dispersion of ceramic nanoparticles in their compositions. The test results showed that the yield strength of welds was greatly increased when using the nanoparticle/Al composite filler metals. The improvement in the yield strength was attributed to the coefficient of thermal expansion mismatch and Orowan strengthening mechanisms. Therefore, according to the results presented in this paper, it can be concluded that the nanoparticle/Al composite filler metals can serve as a novel filler metal for TIG welding of aluminum and its alloys.

  9. Wire and Packing Tape Sandwiches

    Science.gov (United States)

    Rabinowitz, Sandy

    2009-01-01

    In this article, the author describes how students can combine craft wire with clear packing tape to create a two-dimensional design that can be bent and twisted to create a three-dimensional form. Students sandwich wire designs between two layers of tape. (Contains 1 online resource.)

  10. Wire metamaterials: physics and applications.

    Science.gov (United States)

    Simovski, Constantin R; Belov, Pavel A; Atrashchenko, Alexander V; Kivshar, Yuri S

    2012-08-16

    The physics and applications of a broad class of artificial electromagnetic materials composed of lattices of aligned metal rods embedded in a dielectric matrix are reviewed. Such structures are here termed wire metamaterials. They appear in various settings and can operate from microwaves to THz and optical frequencies. An important group of these metamaterials is a wire medium possessing extreme optical anisotropy. The study of wire metamaterials has a long history, however, most of their important and useful properties have been revealed and understood only recently, especially in the THz and optical frequency ranges where the wire media correspond to the lattices of microwires and nanowires, respectively. Another group of wire metamaterials are arrays and lattices of nanorods of noble metals whose unusual properties are driven by plasmonic resonances. Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  11. Spot-Bonding and Full-Bonding Techniques for Fiber Reinforced Composite (FRC) and Metallic Retainers

    Science.gov (United States)

    Gandini, Paola; Tessera, Paola; Vallittu, Pekka K.; Lassila, Lippo; Sfondrini, Maria Francesca

    2017-01-01

    Fiber reinforced Composite (FRC) retainers have been introduced as an aesthetic alternative to conventional metallic splints, but present high rigidity. The purpose of the present investigation was to evaluate bending and fracture loads of FRC splints bonded with conventional full-coverage of the FRC with a composite compared with an experimental bonding technique with a partial (spot-) resin composite cover. Stainless steel rectangular flat, stainless steel round, and FRC retainers were tested at 0.2 and 0.3 mm deflections and at a maximum load. Both at 0.2 and 0.3 mm deflections, the lowest load required to bend the retainer was recorded for spot-bonded stainless steel flat and round wires and for spot-bonded FRCs, and no significant differences were identified among them. Higher force levels were reported for full-bonded metallic flat and round splints and the highest loads were recorded for full-bonded FRCs. At the maximum load, no significant differences were reported among spot- and full-bonded metallic splints and spot-bonded FRCs. The highest loads were reported for full bonded FRCs. The significant decrease in the rigidity of spot-bonded FRC splints if compared with full-bonded retainers suggests further tests in order to propose this technique for clinical use, as they allow physiologic tooth movement, thus presumably reducing the risk of ankylosis. PMID:28976936

  12. Spot-Bonding and Full-Bonding Techniques for Fiber Reinforced Composite (FRC and Metallic Retainers

    Directory of Open Access Journals (Sweden)

    Andrea Scribante

    2017-10-01

    Full Text Available Fiber reinforced Composite (FRC retainers have been introduced as an aesthetic alternative to conventional metallic splints, but present high rigidity. The purpose of the present investigation was to evaluate bending and fracture loads of FRC splints bonded with conventional full-coverage of the FRC with a composite compared with an experimental bonding technique with a partial (spot- resin composite cover. Stainless steel rectangular flat, stainless steel round, and FRC retainers were tested at 0.2 and 0.3 mm deflections and at a maximum load. Both at 0.2 and 0.3 mm deflections, the lowest load required to bend the retainer was recorded for spot-bonded stainless steel flat and round wires and for spot-bonded FRCs, and no significant differences were identified among them. Higher force levels were reported for full-bonded metallic flat and round splints and the highest loads were recorded for full-bonded FRCs. At the maximum load, no significant differences were reported among spot- and full-bonded metallic splints and spot-bonded FRCs. The highest loads were reported for full bonded FRCs. The significant decrease in the rigidity of spot-bonded FRC splints if compared with full-bonded retainers suggests further tests in order to propose this technique for clinical use, as they allow physiologic tooth movement, thus presumably reducing the risk of ankylosis.

  13. Spot-Bonding and Full-Bonding Techniques for Fiber Reinforced Composite (FRC) and Metallic Retainers.

    Science.gov (United States)

    Scribante, Andrea; Gandini, Paola; Tessera, Paola; Vallittu, Pekka K; Lassila, Lippo; Sfondrini, Maria Francesca

    2017-10-04

    Fiber reinforced Composite (FRC) retainers have been introduced as an aesthetic alternative to conventional metallic splints, but present high rigidity. The purpose of the present investigation was to evaluate bending and fracture loads of FRC splints bonded with conventional full-coverage of the FRC with a composite compared with an experimental bonding technique with a partial (spot-) resin composite cover. Stainless steel rectangular flat, stainless steel round, and FRC retainers were tested at 0.2 and 0.3 mm deflections and at a maximum load. Both at 0.2 and 0.3 mm deflections, the lowest load required to bend the retainer was recorded for spot-bonded stainless steel flat and round wires and for spot-bonded FRCs, and no significant differences were identified among them. Higher force levels were reported for full-bonded metallic flat and round splints and the highest loads were recorded for full-bonded FRCs. At the maximum load, no significant differences were reported among spot- and full-bonded metallic splints and spot-bonded FRCs. The highest loads were reported for full bonded FRCs. The significant decrease in the rigidity of spot-bonded FRC splints if compared with full-bonded retainers suggests further tests in order to propose this technique for clinical use, as they allow physiologic tooth movement, thus presumably reducing the risk of ankylosis.

  14. Research on the Effects of Process Parameters on Surface Roughness in Wet-Activated Silicon Direct Bonding Base on Orthogonal Experiments

    Directory of Open Access Journals (Sweden)

    Lei NIE

    2015-11-01

    Full Text Available Surface roughness is a very important index in silicon direct bonding and it is affected by processing parameters in the wet-activated process. These parameters include the concentration of activation solution, holding time and treatment temperature. The effects of these parameters were investigated by means of orthogonal experiments. In order to analyze the wafer roughness more accurately, the bear ratio of the surface was used as the evaluation index. From the results of the experiments, it could be concluded that the concentration of the activation solution affected the roughness directly and the higher the concentration, the lower the roughness. Holding time did not affect the roughness as acutely as that of the concentration, but a reduced activation time decreased the roughness perceptibly. It was also discovered that the treatment temperature had a weak correlation with the surface roughness. Based on these conclusions, the parameters of concentration, temperature and holding time were optimized respectively as NH4OH:H2O2=1:1 (without water, 70 °C and 5 min. The results of bonding experiments proved the validity of the conclusions of orthogonal experiments.DOI: http://dx.doi.org/10.5755/j01.ms.21.4.9711

  15. 3D Wire 2015

    DEFF Research Database (Denmark)

    Jordi, Moréton; F, Escribano; J. L., Farias

    , therefore, we’ve drawn conclusions and recommendations for future editions of the event, also generalizable to other experiences of gamification especially in events. This report details the methodology and working elements from the design phase, human resources and organization of production......This document is a general report on the implementation of gamification in 3D Wire 2015 event. As the second gamification experience in this event, we have delved deeply in the previous objectives (attracting public areas less frequented exhibition in previous years and enhance networking) and have...... proposed new ones (viralization of the event on social networks and improvement of the integration of international attendees). On the other hand we defined a set of research objectives related to the study of gamification in an eminently social place like an event. Most of the goals have been met and...

  16. Composite interlayer for diffusion bonding

    International Nuclear Information System (INIS)

    1976-01-01

    A ductile interlayer is described, which is useful for transient liquid phase diffusion bonding of metallic articles; the interlayer consisting of a melting point depressant and a plurality of ductile lamellae which are free from carbides, aluminides and borides. The composition and fabrication of the lamellae, and the process for bonding the metallic articles, depend on the composition of the metals to be bonded, and are exemplified in the specification. (U.K.)

  17. Flexural magneto-elastic vibrations of thin metal wires

    International Nuclear Information System (INIS)

    Lukyanov, A; Molokov, S

    2004-01-01

    Flexural vibrations of thin metal wires owing to a high, pulsed electric current have been investigated. The current is sufficiently low to inhibit melting but sufficiently high to induce stresses, leading to the wire fragmentation. The problem is treated numerically on the basis of the theory of three-dimensional linear elasticity. The model has been verified on the well-known exact, eigenmode solution for the flexural vibrations of an infinite wire. The agreement is excellent. Further, the model has been used to study vibrations owing to two sources. The first one is perturbations of wires owing to the Lorentz force leading to a kink-type instability similar to that in plasmas. As the main cause of the wire fragmentation has been previously found to be the thermal expansion of material owing to Joule heating, this problem mainly serves to compare results between the three-dimensional and the one-dimensional, thin-rod models. Comparison of the growth rate of the instability obtained by the two models has shown an excellent agreement. The second source of vibrations is the magnetic fields induced in the external electric circuit. The results show that depending on the shape of the circuit, the induced stresses may exceed 20 MPa for the aluminium wires used in the low-current experiments. Although the external fields are not the main source of the wire fragmentation, these values alone may cause the fracture process at elevated temperatures

  18. Composite ceramic superconducting wires for electric motor applications

    Science.gov (United States)

    Halloran, John W.

    1990-07-01

    Several types of HTSC wire have been produced and two types of HTSC motors are being built. Hundreds of meters of Ag- clad wire were fabricated from YBa2Cu3O(7-x) (Y-123) and Bi2Ca2Sr2Cu3O10 (BiSCCO). The dc homopolar motor coils are not yet completed, but multiple turns of wire have been wound on the coil bobbins to characterize the superconducting properties of coiled wire. Multifilamentary conductors were fabricated as cables and coils. The sintered polycrystalline wire has self-field critical current densities (Jc) as high as 2800 A/sq cm, but the Jc falls rapidly with magnetic field. To improve Jc, sintered YBCO wire is melt textured with a continuous process which has produced textures wire up to 0.5 meters long with 77K transport Jc above 11, 770 A/sq cm2 in self field and 2100 A/sq cm2 at 1 telsa. The Emerson Electric dc homopolar HTSC motor has been fabricated and run with conventional copper coils. A novel class of potential very powerful superconducting motors have been designed to use trapped flux in melt textures Y-123 as magnet replicas in an new type of permanent magnet motor. The stator element and part of the rotor of the first prototype machine exist, and the HTSC magnet replica segments are being fabricated.

  19. Hot wire TIG temper bead welding for nuclear repairs

    International Nuclear Information System (INIS)

    Lambert, J.A.; Gilston, P.F.

    1989-08-01

    A preliminary assessment has been carried out to determine the suitability of the hot wire tungsten inert gas (TIG) welding process for the repair of thick section, ferritic steel nuclear pressure vessels. The objective has been to identify a hot wire TIG temper bead procedure, suitable for repairs without post weld heat treatment. This procedure involves depositing two weld layers with carefully selected welding parameters such that overlapping thermal cycles produce a refined and tempered heat affected zone, HAZ, microstructure. (author)

  20. Tunable smart digital structure (SDS) to modularly assemble soft actuators with layered adhesive bonding

    Science.gov (United States)

    Jin, Hu; Dong, Erbao; Xu, Min; Xia, Qirong; Liu, Shuai; Li, Weihua; Yang, Jie

    2018-01-01

    Many shape memory alloy (SMA)-based soft actuators have specific composite structures and manufacture processes, and are therefore unique. However, these exclusive characteristics limit their capabilities and applications, so in this article a soft and smart digital structure (SDS) is proposed that acts like a modular unit to assemble soft actuators by a layered adhesive bonding process. The SDS is a fully soft structure that encapsulates a digital skeleton consisting of four groups of parallel and independently actuated SMA wires capable of outputting a four-channel tunable force. The layered adhesive bonding process modularly bonds several SDSs with an elastic backbone to fabricate a layered soft actuator where the elastic backbone is used to recover the SDSs in a cooling process using the SMA wires. Two kinds of SDS-based soft actuators were modularly assembled, an actuator, SDS-I, with a two-dimensional reciprocal motion, and an actuator, SDS-II, capable of bi-directional reciprocal motion. The thermodynamics and phase transformation modeling of the SDS-based actuator were analyzed. Several extensional soft actuators were also assembled by bonding the SDS with an anomalous elastic backbone or modularly assembling the SDS-Is and SDS-IIs. These modularly assembled soft actuators delivered more output channels and a complicated motion, e.g., an actinomorphic soft actuator with four SDS-Is jumps in a series of hierarchical heights and directional movement by tuning the input channels of the SDSs. This result showed that the SDS can modularly assemble multifarious soft actuators with diverse capabilities, steerability and tunable outputs.

  1. A DFT Study of R-X Bond Dissociation Enthalpies of Relevance to the Initiation Process of Atom Transfer Radical Polymerization

    DEFF Research Database (Denmark)

    Gillies, Malcolm Bjørn; Matyjaszewski, Krzysztof; Norrby, Per-Ola

    2003-01-01

    DFT calculations at the B3P86/6-31G** level have been carried out to derive the bond dissociation energies (BDE) and free energies for a number of R-X systems (X ) Cl, Br, I, N3, and S2-CNMe2) that have been or can potentially be used as initiators for atom transfer radical polymerization (ATRP...... energies are in good agreement with the experimentally available BDEs and reveal a small weakening effect caused by the substitution of an R-H atom with a CH3 group. The free energies are used to derive the relative equilibrium constant for the ATRP activation/deactivation process. These are compared...... with the equilibrium constants that have been determined from ATRP polymerization rates and from model studies of activation-deactivation-termination processes in the absence of monomer. These comparisons reveal the effectiveness of the DFT-computed BDEs for predicting polymerization rates for new monomers in ATRP...

  2. Recrystallization texture in nickel heavily deformed by accumulative roll bonding

    Science.gov (United States)

    Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

    2017-07-01

    The recrystallization behavior of Ni processed by accumulative roll bonding to a total accumulated von Mises strain of 4.8 has been examined, and analyzed with respect to heterogeneity in the deformation microstructure. The regions near the bonding interface are found to be more refined and contain particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different. These heterogeneities affect the progress of recrystallization. While the subsurface and near-interface regions typically contain lower frequencies of cube-oriented grains than anywhere else in the sample, a strong cube texture forms in the sample during recrystallization, attributed to both a high nucleation rate and fast growth rate of cube-oriented grains. The observations highlight the sensitivity of recrystallization to heterogeneity in the deformation microstructure and demonstrate the importance of characterizing this heterogeneity over several length scales.

  3. Heat resistant wire and cable and heat shrinkable tubes

    International Nuclear Information System (INIS)

    Keiji Ueno

    1994-01-01

    Radiation processes have been used in industrial fields (e.g. wire and cable, heat shrinkable tubes) for about 30 years. In Japan, 60 electron beam accelerators were used in R and D, 54 in wire and cable, 24 in tire rubber, 16 in paint curing, 14 in PE foam and 9 accelerators were used in heat shrinkable tubes in 1993. Many properties (e.g. solder resistance, thermal deformation, and solven resistance) of wire and cable are improved by using radiation processes, and many kinds of radiation crosslinked wire and cable are used in the consumer market (TV sets, VTR's, audio disc players, etc.), automobiles (automobile wire harnesses, fusible link wires, sensor cables etc.), and the industrial market (computer cables, cables for keyboards, coaxial cables, etc.). Another important industrial application of Eβ radiation process is heat shrinkable tubes. Heat shinkable tubes, heated by a hot gun, shrink 1/2 ∼ 1/3 of their inner diameters. Heat shrinkable tubes are used for covers of distributing line terminals, joint covers of telecommunication lines, protection of fuel pipe lines and so on. In this seminar, actual applications and characteristic properties of radiation crosslinked materials are presented

  4. Diffusion bonding

    International Nuclear Information System (INIS)

    Anderson, R.C.

    1976-01-01

    A method is described for joining beryllium to beryllium by diffusion bonding. At least one surface portion of at least two beryllium pieces is coated with nickel. A coated surface portion is positioned in a contiguous relationship with another surface portion and subjected to an environment having an atmosphere at a pressure lower than ambient pressure. A force is applied on the beryllium pieces for causing the contiguous surface portions to abut against each other. The contiguous surface portions are heated to a maximum temperature less than the melting temperature of the beryllium, and the applied force is decreased while increasing the temperature after attaining a temperature substantially above room temperature. A portion of the applied force is maintained at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions

  5. SIMULACIÓN EXPERIMENTAL Y NUMÉRICA DE UN PROCESO DE TREFILADO HÚMEDO DE UN ALAMBRE DE ACERO AL CARBONO EXPERIMENTAL AND NUMERICAL SIMULATION OF THE DAMP WIRE DRAWING PROCESS OF A CARBON STEEL

    Directory of Open Access Journals (Sweden)

    Ennio L Rojas

    2008-06-01

    Full Text Available En este trabajo se presenta un análisis experimental y numérico para la descripción del comportamiento mecánico de un alambre de acero al carbono durante un proceso industrial de trefilado húmedo. En primer lugar, se hizo una campaña experimental de mediciones de fuerza de trefilado de las doce reducciones presentes en el proceso. En segundo lugar, se llevaron a cabo ensayos de tracción con objeto de caracterizar el comportamiento mecánico del material en cada etapa de reducción. En estos ensayos se obtuvieron curvas de tensión-deformación que, en conjunto a las respuestas calculadas a partir de la simulación de los ensayos, permitieron derivar la evolución de los parámetros elásticos y plásticos característicos del material a medida que se reduce su diámetro. De dicha evolución se constató el gran endurecimiento que experimenta el material durante el proceso el que, a su vez, condiciona fuertemente su trefilabilidad. Las simulaciones se realizaron por medio de un modelo elastoplástico de grandes deformaciones implementado en un programa de cálculo preexistente, basado en el método de elementos finitos, denominado VULCAN. Luego, los parámetros del material obtenidos en los ensayos de tracción fueron considerados en la simulación del proceso de deformación que ocurre durante el paso del alambre a través de los dados. Los resultados de la simulación se consideran aceptables y representativos del comportamiento del alambre en el proceso.This paper presents an experimental and numerical analysis for the description of the mechanical behaviour of a carbon steel wire during an industrial process of damp drawing. Firstly, an experimental procedure aimed at measuring wire drawing forces in the twelve reductions present in the process was performed. Secondly, tensile tests were carried out in order to characterize the mechanical behavior of the material for each reduction step. The resulting stress-strain curves together with

  6. Diffusionless bonding of aluminum to Zircaloy-2

    International Nuclear Information System (INIS)

    Watson, R.D.

    1965-04-01

    Aluminum can be bonded to zirconium without difficulty even when a thin layer of oxide is present on the surface of the zirconium . No detectable diffusion takes place during the bonding process. The bond layer can be stretched as much. as 8% without affecting the bond. The bond can be heated for 1000 hours at 260 o C (500 o F), and can be water quenched from 260 o C (500 o F) without any noticeable change in the bond strength. An extrusion technique has been devised for making transition sections of aluminum bonded to zirconium which can then be used to join these metals by conventional welding. Welding can be done close to the bond zone without seriously affecting the integrity of the bond. This method of bonding aluminum to Zircaloy-2 is covered by Canadian patent 702,438 January 26, 1965. (author)

  7. Effects of a diamond-like carbon coating on the frictional properties of orthodontic wires.

    Science.gov (United States)

    Muguruma, Takeshi; Iijima, Masahiro; Brantley, William A; Mizoguchi, Itaru

    2011-01-01

    To test the hypothesis that a diamond-like carbon coating does not affect the frictional properties of orthodontic wires. Two types of wires (nickel-titanium and stainless steel) were used, and diamond-like carbon (DLC) films were deposited on the wires. Three types of brackets, a conventional stainless steel bracket and two self-ligating brackets, were used for measuring static friction. DLC layers were observed by three-dimensional scanning electron microscopy (3D-SEM), and the surface roughness was measured. Hardness and elastic modulus were obtained by nanoindentation testing. Frictional forces and surface roughness were compared by the Kruskal-Wallis and Mann-Whitney U-tests. The hardness and elastic modulus of the wires were compared using Student's t-test. When angulation was increased, the DLC-coated wires showed significantly less frictional force than the as-received wires, except for some wire/bracket combinations. Thin DLC layers were observed on the wire surfaces by SEM. As-received and DLC-coated wires had similar surface morphologies, and the DLC-coating process did not affect the surface roughness. The hardness of the surface layer of the DLC-coated wires was much higher than for the as-received wires. The elastic modulus of the surface layer of the DLC-coated stainless steel wire was less than that of the as-received stainless steel wire, whereas similar values were found for the nickel-titanium wires. The hypothesis is rejected. A DLC-coating process does reduce the frictional force.

  8. Research on Lessening of Bonding Effects Between the Metallic and Non-Metallic Surfaces Through the Graphite Films Deposited with Pulsed Electrical Discharges Process

    Science.gov (United States)

    Marin, L.; Topala, P.

    2017-06-01

    The paper presents the results of experimental research on the physics of natural graphite film formation, the establishment of chemical composition and functional properties of the graphite films, formed on metal surfaces, as a result of the action of plasma in the air environment, at a normal pressure, under the electrical discharge in impulse conditions (EDI). The researchings were performed in the frame of doctoral thesis “Research on lessening of the bonding effects between the metallic and nonmetallic surfaces through the graphite films” and aimed to identify the phenomena that occur at the interface metal/ film of graphite, and to identify also the technological applications that it may have the surface treatment for submitting the films of graphite on metallic surfaces achieved through an innovative process of electrical pulsed discharges. After the research works from the PhD theme above mentioned, a number of interesting properties of graphite pellicle have been identified ie reducing of metal surface polarity. This led to drastic decreases for the values of adhesion when bonding of metal surfaces was performed using a structural polyurethane adhesive designed by ICECHIM. Following the thermo-gravimetric analysis, performed of the graphite film obtained by process of electrical pulsed discharges, have been also discovered other interesting properties for this, ie reversible mass additions at specific values of the working temperature Chemical and scanning electron microscopy analysis have revealed that on the metallic surface subjected to electrical pulsed discharges process, outside the graphite film, it is also obtained a series of spatial formation composed of carbon atoms fullerenes type which are responsible for the phenomenon of addition of mass.

  9. Researching on Control Device of Prestressing Wire Reinforcement

    Science.gov (United States)

    Si, Jianhui; Guo, Yangbo; Liu, Maoshe

    2017-06-01

    This paper mainly introduces a device for controlling prestress and its related research methods, the advantage of this method is that the reinforcement process is easy to operate and control the prestress of wire rope accurately. The relationship between the stress and strain of the steel wire rope is monitored during the experiment, and the one - to - one relationship between the controllable position and the pretightening force of the steel wire rope is confirmed by the 5mm steel wire rope, and the results are analyzed theoretically by the measured elastic modulus. The results show that the method can effectively control the prestressing force, and the result provides a reference method for strengthening the concrete column with prestressed steel strand.

  10. Variables process effect in the pure ferritic metal contribution deposited with an tubular metal-cored E111T5-K3 wire

    International Nuclear Information System (INIS)

    Svoboda, Hernan G; Ramini de Rissone, N.M; Surian, E; De Vedia, L

    2004-01-01

    The welding deposit performed with an ANSI-AWS E111T5-K3 type from the system C-Mn-Ni-Mo metal coring tubular welding, with a low slag generation was studied. Different operatives configurations with two thermal contribution levels (1 kJ and 1.5 kJ) and two types of protector gases (CO 2 and Ar-20%CO 2 ) at two welding position (under hand and ascendant vertical) were analyzed. The resulting pure contributor metal from the different process configurations was chemical, mechanically and structural characterized and the effect of the different process conditions was evaluated. The microstructure is fundamentally composed by FS(NA) and AF. For similar values of hardness and strength, good values of tenacity were observed and they show little variation with the process variables studied (AG)

  11. Wire Array Solar Cells: Fabrication and Photoelectrochemical Studies

    Science.gov (United States)

    Spurgeon, Joshua Michael

    Despite demand for clean energy to reduce our addiction to fossil fuels, the price of these technologies relative to oil and coal has prevented their widespread implementation. Solar energy has enormous potential as a carbon-free resource but is several times the cost of coal-produced electricity, largely because photovoltaics of practical efficiency require high-quality, pure semiconductor materials. To produce current in a planar junction solar cell, an electron or hole generated deep within the material must travel all the way to the junction without recombining. Radial junction, wire array solar cells, however, have the potential to decouple the directions of light absorption and charge-carrier collection so that a semiconductor with a minority-carrier diffusion length shorter than its absorption depth (i.e., a lower quality, potentially cheaper material) can effectively produce current. The axial dimension of the wires is long enough for sufficient optical absorption while the charge-carriers are collected along the shorter radial dimension in a massively parallel array. This thesis explores the wire array solar cell design by developing potentially low-cost fabrication methods and investigating the energy-conversion properties of the arrays in photoelectrochemical cells. The concept was initially investigated with Cd(Se, Te) rod arrays; however, Si was the primary focus of wire array research because its semiconductor properties make low-quality Si an ideal candidate for improvement in a radial geometry. Fabrication routes for Si wire arrays were explored, including the vapor-liquid-solid growth of wires using SiCl4. Uniform, vertically aligned Si wires were demonstrated in a process that permits control of the wire radius, length, and spacing. A technique was developed to transfer these wire arrays into a low-cost, flexible polymer film, and grow multiple subsequent arrays using a single Si(111) substrate. Photoelectrochemical measurements on Si wire array

  12. 49 CFR 393.28 - Wiring systems.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 5 2010-10-01 2010-10-01 false Wiring systems. 393.28 Section 393.28... NECESSARY FOR SAFE OPERATION Lamps, Reflective Devices, and Electrical Wiring § 393.28 Wiring systems. Electrical wiring shall be installed and maintained to conform to SAE J1292—Automobile, Truck, Truck-Tractor...

  13. Topology Optimized Photonic Wire Splitters

    DEFF Research Database (Denmark)

    Frandsen, Lars Hagedorn; Borel, Peter Ingo; Jensen, Jakob Søndergaard

    2006-01-01

    Photonic wire splitters have been designed using topology optimization. The splitters have been fabricated in silicon-on-insulator material and display broadband low-loss 3dB splitting in a bandwidth larger than 100 nm.......Photonic wire splitters have been designed using topology optimization. The splitters have been fabricated in silicon-on-insulator material and display broadband low-loss 3dB splitting in a bandwidth larger than 100 nm....

  14. 30 CFR 75.701-4 - Grounding wires; capacity of wires.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Grounding wires; capacity of wires. 75.701-4... SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Grounding § 75.701-4 Grounding wires; capacity of wires. Where grounding wires are used to ground metallic sheaths, armors, conduits, frames...

  15. Microstructure Evolution and Mechanical Properties of Al-TiB2/TiC In Situ Aluminum-Based Composites during Accumulative Roll Bonding (ARB) Process

    Science.gov (United States)

    Nie, Jinfeng; Wang, Fang; Li, Yusheng; Cao, Yang; Liu, Xiangfa; Zhao, Yonghao; Zhu, Yuntian

    2017-01-01

    In this study, a kind of Al-TiB2/TiC in situ composite was successfully prepared using the melt reaction method and the accumulative roll-bonding (ARB) technique. The microstructure evolution of the composites with different deformation treatments was characterized using field emission scanning electron microscopy (FESEM) and a transmission electron microscope (TEM). The mechanical properties of the Al-TiB2/TiC in situ composite were also studied with tensile and microhardness tests. It was found that the distribution of reinforcement particles becomes more homogenous with an increasing ARB cycle. Meanwhile, the mechanical properties showed great improvement during the ARB process. The ultimate tensile strength (UTS) and microhardness of the composites were increased to 173.1 MPa and 63.3 Hv after two ARB cycles, respectively. Furthermore, the strengthening mechanism of the composite was analyzed based on its fracture morphologies. PMID:28772467

  16. A Study of Wire Breakup and In-Flight Particle Behavior During Wire Flame Spraying of Aluminum

    Science.gov (United States)

    Lunn, G. D.; Riley, M. A.; McCartney, D. G.

    2017-12-01

    Although wire flame spraying has been used for many years, there has been relatively little attention given to understanding the process dynamics. In this work, imaging of the molten wire tip, particle imaging using the Oseir SprayWatch system and particle capture (wipe tests) have all been employed to quantify plume behavior. Aluminum wire feedstock is melted and then breaks up close to the exit of the spray nozzle in a non-axisymmetric manor. The mean velocity and diameter of the particles detected by the SprayWatch system change little with standoff distance with values of approximately 280 m/s and 70 µm, respectively, for the spray parameters employed. The particle diagnostic system could not detect particles ⪅45 µm in diameter, and it is estimated that these account for no more than 53% of the sprayed material. Overall, wire flame spraying generates a surprisingly stable particle stream.

  17. HTS Wire Development Workshop: Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    1994-07-01

    The 1994 High-Temperature Superconducting Wire Development Workshop was held on February 16--17 at the St. Petersburg Hilton and Towers in St. Petersburg, Florida. The meeting was hosted by Florida Power Corporation and sponsored by the US Department of Energy`s Superconductivity Program for Electric Power Systems. The meeting focused on recent high-temperature superconducting wire development activities in the Department of Energy`s Superconductivity Systems program. The meeting opened with a general discussion on the needs and benefits of superconductivity from a utility perspective, the US global competitiveness position, and an outlook on the overall prospects of wire development. The meeting then focused on four important technology areas: Wire characterization: issues and needs; technology for overcoming barriers: weak links and flux pinning; manufacturing issues for long wire lengths; and physical properties of HTS coils. Following in-depth presentations, working groups were formed in each technology area to discuss the most important current research and development issues. The working groups identified research areas that have the potential for greatly enhancing the wire development effort. These areas are discussed in the summary reports from each of the working groups. This document is a compilation of the workshop proceedings including all general session presentations and summary reports from the working groups.

  18. Hybrid microcircuit technology handbook materials, processes, design, testing and production

    CERN Document Server

    Licari, James J

    1998-01-01

    The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will

  19. 49 CFR 587.16 - Adhesive bonding procedure.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 7 2010-10-01 2010-10-01 false Adhesive bonding procedure. 587.16 Section 587.16... Adhesive bonding procedure. Immediately before bonding, aluminum sheet surfaces to be bonded are thoroughly... the abrading process are removed, as these can adversely affect bonding. The adhesive is applied to...

  20. Reliability of the wire drawing dies

    International Nuclear Information System (INIS)

    Sheikh, A.K.; Khany, S.E.

    1993-01-01

    A wear based model is proposed for the dies used in wire drawing process. Using this wear model, it is possible to predict life of the die corresponding to a wear limit criterion. Since various quantities in the model are random in nature the resulting die life will also be random quantity characterized by an appropriate distribution. Using a probabilistic characterization of the parameters of the predictive model, Monte Carlo simulations were conducted to establish the die life distribution. To asses the sensitivity of life distribution with respect to various contributing variables (parameters), the simulation runs were conducted at different levels of these variables (parameters). It is shown that wire drawing die life is Weibull distributed. To compare the simulated results with actual time to failure, data of dies was obtained from a large wire drawing company and was compared with corresponding scenario generated by Monte Carlo simulation. Results obtained by Monte Carlo simulations were very close to the actual time to failure data. (author)

  1. Corrosion resistance of premodeled wires made of stainless steel used for heart electrotherapy leaders

    Science.gov (United States)

    Przondziono, J.; Walke, W.; Młynarski, R.; Szatka, W.

    2012-05-01

    The purpose of the study is to evaluate resistance to electrochemical corrosion of wire made of X10CrNi18-8 stainless steel designed for use in cardiology treatment. The influence of strain formed in the premodeling process and methods of wire surface preparation to corrosive resistance in artificial plasma solution were analysed. Wire corrosion tests were carried out in the solution of artificial plasma. Resistance to electrochemical corrosion was evaluated on the ground of recorded curves of anodic polarization by means of potentiodynamic method. Potentiodynamic tests carried out enabled to determine how the resistance to pitting corrosion of wire changes, depending on strain formed in the premodeling process as well as on the method of wire surface preparation. For evaluation of phenomena occurring on the surface of tested steel, electrochemical impedance spectroscopy (EIS) was applied. Deterioration of corrosive properties of wire along with the increase in the formed strain hardening was observed.

  2. Present status of PIT round wires of 122-type iron-based superconductors

    Science.gov (United States)

    Tamegai, T.; Suwa, T.; Pyon, S.; Kajitani, H.; Takano, K.; Koizumi, N.; Awaji, S.; Watanabe, K.

    2017-12-01

    Outstanding characteristics with high T c and H c2 and small anisotropy in iron-based superconductors (IBSs) have triggered the development of superconducting wires and tapes using these novel superconductors. In this short article, developments and present status of round wires of 122-type IBSs are reviewed. By introducing hot-isostatic pressing (HIP) technique, J c in round wires of 122-type IBSs has been improved significantly. Further improvements have been realized by refining the fabrication process of the core material and introducing partial texturing of the wire core. The largest transport J c for round wires at 4.2 K at self-field and 100 kOe are 2.0x105 A/cm2 and 3.8x104 A/cm2, respectively. We also compare the J c characteristics of wires and tapes processed by HIP.

  3. NUMERICAL MODELING AND INVESTIGATION OF CONTACT FRICTION INFLUENCE ON THERMAL FIELDS DISTRIBUTION AND DEFLECTED MODE IN STEEL WIRE AT HIGH-SPEED WIRE DRAWING

    Directory of Open Access Journals (Sweden)

    M. N. Vereshchagin

    2009-01-01

    Full Text Available The appraisal of  character of  the temperature fields distribution in dies at their interactions in the processes of  wire drawing in dependence on contact friction in conditions of  the system wire-die is given.

  4. Oblique incidence type resistance wire proportional position detector

    International Nuclear Information System (INIS)

    Iwatani, Kazuo

    1977-01-01

    A high resistance wire, proportional counter is being developed for the use as the position detector to be installed at the focal plane of the magnet of high resolution, reaction particle analyzer for SF cyclotron. One of the difficulties to attain the target performance is its low positional resolution in case of the oblique incidence of particles with small energy loss in the counter in case of so-called single wire proportional counter. Adopting one of the solutions, proposed by Markham et al. of Michigan State University, that processes signals by ingenious cathode read-out and makes the detector into an equivalent ''thin'' counter, a high resistance wire detector still having simple read-out has been devised. The oblique incidence effect seems to be caused by the fluctuation (Landau distribution) of particle energy loss in counter gas. As a result of some discussion on this matter, the detector having increased five resistance wires instead of single wire, and having guard wires so as to make the electric field intensity in the vicinity of the cathode weak, has been manufactured to obtain the ''thin'' counter without considerably changing the overall thickness of the counter. Signal read-out is carried out by charge division method. As a result of the test, the positional resolution of Δx=1.0 mm has been attained when incidence angle was 35 deg and the collimation of particles was about 0.5 mm diameter for protons of 50 meV. (Wakatsuki, Y.)

  5. Molecular dynamics modeling of bonding two materials by atomic scale friction stir welding at different process parameters

    Science.gov (United States)

    Konovalenko S., Iv.; Psakhie, S. G.

    2017-12-01

    Using the molecular dynamics method, we simulated the atomic scale butt friction stir welding on two crystallites and varied the onset FSW tool plunge depth. The effects of the plunge depth value on the thermomechanical evolution of nanosized crystallites and mass transfer in the course of FSW have been studied. The increase of plunge depth values resulted in more intense heating and reducing the plasticized metal resistance to the tool movement. The mass transfer intensity was hardly dependent on the plunge depth value. The plunge depth was recommended to be used as a FSW process control parameter in addition to the commonly used ones.

  6. Non-destructive testing of assemblies by welding, brazing or bonding, and material to use for this process

    International Nuclear Information System (INIS)

    Benoit, J.

    1983-01-01

    The process consists in doing a neutron photography of the pieces assembled with the aid of a joining material containing a neutrophage element, such as gadolinium, samarium, europium, boron, cadmium. The neutrophage element, e.g. gadolinium, is dispersed in the joining material with contents between 0,5 and 7,5% of weight. Its granulometry must be less than 1000 MESH. The incorporation of a neutrophage element in the joining material of metallic pieces by welding or brazing, allows to visualize, among others, the following defects: blistering, cracks, slag inclusions, undercuts, bad distribution of the successive passes [fr

  7. Flooded homes, broken bonds, the meaning of home, psychological processes and their impact on psychological health in a disaster.

    Science.gov (United States)

    Carroll, Bob; Morbey, Hazel; Balogh, Ruth; Araoz, Gonzalo

    2009-06-01

    In 2005, Carlisle suffered severe flooding and 1600 houses were affected. A qualitative research project to study the social and health impacts was undertaken. People whose homes had been flooded and workers who had supported them were interviewed. The findings showed that there was severe disruption to people's lives and severe damage to their homes, and many suffered from psychological health issues. Phenomenological and transactional perspectives are utilised to analyse the psychological processes (identity, attachment, alienation and dialectics) underlying the meaning of home and their impact on psychological health. Proposals for policy and practice are made.

  8. Effects of Wire EDM on the Microstructure of P/M Titanium Samples.

    Science.gov (United States)

    Viskić, Joško; Schauperl, Zdravko; Ćatić, Amir; Balog, Martin; Krizik, Peter; Gržeta, Biserka; Popović, Jasminka; Ortolan, Slađana Milardović; Mehulić, Ketij

    2014-12-01

    Commercially pure titanium (CP Ti) has been recognized in dentistry for its biocompatibility, good mechanical properties and corrosion resistance. Conventional manufacturing processes can affect surface quality and result in poor bonding of dental ceramics to CP Ti. This is why powder metallurgy (P/M) and wire electro-discharge machining (WEDM) are being introduced in the manufacturing process. The aim of this study was to evaluate the effect of WEDM on the surface composition and microstructure of P/M CP Ti samples produced for bond strength testing according to ISO 9693. Eight samples of P/M CP Ti, dimensions according to ISO 9693, were made using WEDM and divided in two groups (untreated and grinded). Microanalyses of chemical composition and microstructure of both groups were made using SEM, EDS and XDR. SEM and EDS analysis of untreated samples showed a thin layer on surfaces with fractures in it. Grinded samples showed homogenous structure with no layer and no fractures. XDR analysis showed high level of oxides on the surface of untreated samples, while after grinding only pure α-phase was found. WEDM is a suitable method of sample production for ISO 9693 if accompanied by grinding with silicon carbide papers P320-P4000.

  9. Processive pectin methylesterases: the role of electrostatic potential, breathing motions and bond cleavage in the rectification of Brownian motions.

    Directory of Open Access Journals (Sweden)

    Davide Mercadante

    Full Text Available Pectin methylesterases (PMEs hydrolyze the methylester groups that are found on the homogalacturonan (HG chains of pectic polysaccharides in the plant cell wall. Plant and bacterial PMEs are especially interesting as the resulting de-methylesterified (carboxylated sugar residues are found to be arranged contiguously, indicating a so-called processive nature of these enzymes. Here we report the results of continuum electrostatics calculations performed along the molecular dynamics trajectory of a PME-HG-decasaccharide complex. In particular it was observed that, when the methylester groups of the decasaccharide were arranged in order to mimic the just-formed carboxylate product of de-methylesterification, a net unidirectional sliding of the model decasaccharide was subsequently observed along the enzyme's binding groove. The changes that occurred in the electrostatic binding energy and protein dynamics during this translocation provide insights into the mechanism by which the enzyme rectifies Brownian motions to achieve processivity. The free energy that drives these molecular motors is thus demonstrated to be incorporated endogenously in the methylesterified groups of the HG chains and is not supplied exogenously.

  10. Mechanical behavior of M-Wire and conventional NiTi wire used to manufacture rotary endodontic instruments.

    Science.gov (United States)

    Pereira, Erika S J; Gomes, Renata O; Leroy, Agnès M F; Singh, Rupinderpal; Peters, Ove A; Bahia, Maria G A; Buono, Vicente T L

    2013-12-01

    Comparison of physical and mechanical properties of one conventional and a new NiTi wire, which had received an additional thermomechanical treatment. Specimens of both conventional (NiTi) and the new type of wire, called M-Wire (MW), were subjected to tensile and three-point bending tests, Vickers microhardness measurements, and to rotating-bending fatigue tests at a strain-controlled level of 6%. Fracture surfaces were observed by scanning electron microscopy and the non-deformed microstructures by transmission electron microscopy. The thermomechanical treatment applied to produce the M-Wire apparently increased the tensile strength and Vickers microhardness of the material, but its apparent Young modulus was smaller than that of conventionally treated NiTi. The three-point bending tests showed a higher flexibility for MW which also exhibited a significantly higher number of cycles to failure. M-Wire presented mechanical properties that can render endodontic instruments more flexible and fatigue resistant than those made with conventionally processed NiTi wires. Copyright © 2013 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

  11. Manufacturing study of beryllium bonded structures

    International Nuclear Information System (INIS)

    Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

    2004-01-01

    Manufacturing study has been conducted on Be-bonded structures employed in the first-wall panel of the blanket system for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating process has been used to bond the three materials. First, Cu-alloy and SS materials are bonded diffusively. Then, Be tiles are bonded to the pre-bonded structure under 20 MPa and at 560 degree C. An Al-Si base interlayer has been used to bond Be to the Cu-Alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. Using the above bonding techniques, a partial mockup of a blanket first-wall panel with 16 Be tiles (with 50 mm in size) has been successfully manufactured. (author)

  12. High Temperature Life Testing of 80Ni-20Cr Wire in a Simulated Mars Atmosphere for the Sample Analysis at Mars (SAM) Instrument Suit Gas Processing System (GPS) Carbon Dioxide Scrubber

    Science.gov (United States)

    Gundersen, Cynthia; Hoffman, Christopher; Munoz, Bruno; Steohenson, Timothy; Thomas, Walter

    2008-01-01

    In support of the GPS for the SAM instrument suite built by GSFC, a life test facility was developed to test the suitability of 80Ni-20Cr wire, 0.0056 inches in diameter, for use as a heater element for the carbon dioxide scrubber. The wire would be required to operate at 1000 C in order to attain the 800 C required for regeneration of the getter. The wire also would need to operate in the Mars atmosphere, which consists mostly of CO2 at pressures between 4 and 12 torr. Data on the high temperature degradation mechanism of 80Ni-20Cr in low pressure CO2, together with the effects of thermal cycling, were unknown. In addition, the influence of work hardening of the wire during assembly and the potential for catastrophic grain growth also were unknown. Verification of the wire reliability as defined by the mission goals required the construction of a test facility that would accurately simulate the duty cycles in a simulated Mars atmosphere. The experimental set-up, along with the test protocol and results will be described.

  13. Core-electron excitation and fragmentation processes of hydrogen bonded acetic-acid clusters in the oxygen K-edge region

    Energy Technology Data Exchange (ETDEWEB)

    Tabayashi, K., E-mail: kiyotaba@hiroshima-u.ac.jp [Hiroshima University, Higashi-Hiroshima 739-8526 (Japan); Yamamoto, K.; Maruyama, T.; Yoshida, H.; Okada, K. [Hiroshima University, Higashi-Hiroshima 739-8526 (Japan); Tamenori, Y. [JASRI/Spring-8, Hyogo 679-5198 (Japan); Suzuki, I.H. [Photon Factory (PF), KEK, Tsukuba 305-0801 (Japan); Gejo, T.; Honma, K. [University of Hyogo, Hyogo 678-1297 (Japan)

    2011-04-15

    Research highlights: {yields} Core-electron excitation spectra and fragmentation processes of acetic-acid clusters. {yields} O1s(CO) {yields} {pi}*{sub CO} transitions shift by +0.37/-0.92 eV upon cluster formation. {yields} Hydrogen-bond strength of RCOOH clusters determines the cluster-band shift. {yields} We propose 'local-fragmentation' and 'low-energy M{sub n}X{sup +} formation' mechanisms. {yields} Fragmentation after electronic relaxation follows either of these two mechanisms. - Abstract: In order to examine inner-shell electron excitation and induced chemical processes of hydrogen-bonded (HB) molecular clusters, time-of-flight (TOF) fragment-mass and excitation spectra of deuterium-labeled acetic-acid-d (AAD) have been studied under the effusive and cluster beam conditions. With O1s(CO) {yields} {pi}*{sub CO} excitation at 532 eV, the TOF spectra of AAD clusters were compared with those of the free molecule. Transient intensity-enhancement of CH{sub 3}{sup +}/CH{sub 3}CO{sup +} fragments and growth of mixed-cluster cations, M{sub n}D{sup +}/M{sub n}CH{sub 3}CO{sup +} could be ascertained in the cluster beams, where AAD molecule is denoted by M. Cluster-specific excitation spectra have been generated by monitoring partial-ion-yields of the mixed-cluster cations. Resonance transitions of O1s(CO/OH) {yields} {pi}*{sub CO} were found to shift in energy by +0.37/-0.92 eV upon cluster formation. The production of M{sub n}D{sup +} can be attributed to a low-energy pathway of deuteron (proton) transfer following fast electronic decays within the clusters made up of a stable dimer-unit with doubly-bridged HBs. The CH{sub 3}{sup +}/CH{sub 3}CO{sup +} intensity variation in beam stagnation pressure clearly shows that a local-fragmentation mechanism as previously proposed is also applicable to the fragmentation processes of the small AAD clusters.

  14. Electronic structures of one-dimension carbon nano wires and rings

    International Nuclear Information System (INIS)

    Ding, H; Maier, J P

    2007-01-01

    The electronic structures of one-dimension carbon nano wires, nano rings of C 10 to C 22 and hydrogen end-capped carbon nano wires of HC 2n H (n 8-13) have been investigated based on time-of-flight (TOF) mass spectroscopy, laser spectroscopy and first principle ab initio calculations. The size-selected carbon nano molecular wires and rings were investigated on-line using a two-color laser spectroscopic method. The ab initio predicts that the linear structures of the pure carbon nano molecular wires are about 3 eV higher in energy compared to those of the ring structures with similar size. The ring structure with bond length alternation (Peierls'dimerization) is unstable at size up to C 22 ring. The optical transition energies were calculated using the timedependent density functional theory (TD-DFT) and the CASSCF approach. For longer wires, it seems that the C 4n+2 wires are metallic and the hydrogen end-capped carbon wires could be semiconductors

  15. PMMA to Polystyrene bonding for polymer based microfluidic systems

    KAUST Repository

    Fan, Yiqiang

    2013-03-29

    A thermal bonding technique for Poly (methylmethacrylate) (PMMA) to Polystyrene (PS) is presented in this paper. The PMMA to PS bonding was achieved using a thermocompression method, and the bonding strength was carefully characterized. The bonding temperature ranged from 110 to 125 C with a varying compression force, from 700 to 1,000 N (0.36-0.51 MPa). After the bonding process, two kinds of adhesion quantification methods were used to measure the bonding strength: the double cantilever beam method and the tensile stress method. The results show that the bonding strength increases with a rising bonding temperature and bonding force. The results also indicate that the bonding strength is independent of bonding time. A deep-UV surface treatment method was also provided in this paper to lower the bonding temperature and compression force. Finally, a PMMA to PS bonded microfluidic device was fabricated successfully. © 2013 Springer-Verlag Berlin Heidelberg.

  16. Development of Bi-2212/Ag round-shaped wire and magnet application

    International Nuclear Information System (INIS)

    Okada, M.

    2000-01-01

    Recent achievements in the newly-developed Bi-2212/Ag round-shaped wire with tape-shaped multifilaments are summarized. The new round-shaped wire includes 126-1320 tape-shaped filaments with triple rotation symmetry, having a good crystal alignment of Bi-2212 in each filament. We refer to the new wire as ROSATwire, (ROtation-Symmetric Arranged Tape-in-tube wire). The ROSATwire fabrication process markedly improved productivity and lowered the cost, and also improved the transport J c of the wire. The I c and J c reached values greater than 340 A and 1000 A mm -2 , respectively, at 28 T and 4 K. Insulated wires of over 400 m length, 2 mm in diameter, are now available and ready for magnet winding. Several solenoid magnets with a 130-160 mm outer diameter and 100-600 mm height are now under fabrication. (author)

  17. Gold Wire-networks: Particle Array Guided Evaporation Lithograpy

    KAUST Repository

    Lone, Saifullah

    2015-06-29

    We exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.

  18. A thermo-electro-mechanical simulation model for hot wire cutting of EPS foam

    DEFF Research Database (Denmark)

    Petkov, Kiril; Hattel, Jesper Henri

    2016-01-01

    A one-dimensional thermo-electro-mechanical mathematical model describing the effects taking place within a Ni-Cr20% wire used in a hot-wire cutting process for free forming and rapid prototyping of expanded polystyrene (EPS) is investigated and simulated. The model implements and solves three semi...... cutting of EPS in contact with a cutting tool made of an electrically heated metal wire attached to a robot device. The finite difference method is used to solve the coupled equations in the two environments (domains) in which the hot-wire operates, namely air and EPS. The model is calibrated against...

  19. The influence of the manufacturing method on the microstructure and drawing properties of copper wires

    International Nuclear Information System (INIS)

    Gruber, A.; Jeglitsch, F.

    1982-01-01

    Copper is the third most important common metal from production figures after iron and aluminium and is largely used as pure metal in the electroindustry mainly here in the form of wires of different sizes due to its excellent electrical properties. Therefore all factors influencing the drawing ability are very important. The following work deals with the influence of impurity measurements as well as of the microstructure on the deformation or recrystallization behaviour in manufacturing continuous casting and rolling wire and dip-forming wire, and gives a rupture cause specific to each manufacturing method in the wire drawing process. (orig.) [de

  20. In-Situ Wire Damage Detection System

    Science.gov (United States)

    Williams, Martha K. (Inventor); Roberson, Luke B. (Inventor); Tate, Lanetra C. (Inventor); Smith, Trent M. (Inventor); Gibson, Tracy L. (Inventor); Jolley, Scott T. (Inventor); Medelius, Pedro J. (Inventor)

    2014-01-01

    An in-situ system for detecting damage in an electrically conductive wire. The system includes a substrate at least partially covered by a layer of electrically conductive material forming a continuous or non-continuous electrically conductive layer connected to an electrical signal generator adapted to delivering electrical signals to the electrically conductive layer. Data is received and processed to identify damage to the substrate or electrically conductive layer. The electrically conductive material may include metalized carbon fibers, a thin metal coating, a conductive polymer, carbon nanotubes, metal nanoparticles or a combination thereof.

  1. Optimization of electron beam crosslinking of wire and cable insulation

    International Nuclear Information System (INIS)

    Zimek, Zbigniew; Przybytniak, Grażyna; Nowicki, Andrzej

    2012-01-01

    The computer simulations based on Monte Carlo (MC) method and the ModeCEB software were carried out in connection with electron beam (EB) radiation set-up for crosslinking of electric wire and cable insulation. The theoretical predictions for absorbed dose distribution in irradiated electric insulation induced by scanned EB were compared to the experimental results of irradiation that was carried out in the experimental set-up based on ILU 6 electron accelerator with electron energy 0.5–2.0 MeV. The computer simulation of the dose distributions in two-sided irradiation system by a scanned electron beam in multilayer circular objects was performed for various process parameters, namely electric wire and cable geometry (thickness of insulation layers and copper wire diameter), type of polymer insulation, electron energy, energy spread and geometry of electron beam, electric wire and cable layout in irradiation zone. The geometry of electron beam distribution in the irradiation zone was measured using CTA and PVC foil dosimeters for available electron energy range. The temperature rise of the irradiated electric wire and irradiation homogeneity were evaluated for different experimental conditions to optimize technological process parameters. The results of computer simulation are consistent with the experimental data of dose distribution evaluated by gel-fraction measurements. Such conformity indicates that ModeCEB computer simulation is reliable and sufficient for optimization absorbed dose distribution in the multi-layer circular objects irradiated with scanned electron beams. - Highlights: ► We model wire and cables irradiation process by Monte Carlo simulations. ► We optimize irradiation configuration for various process parameters. ► Temperature rise and irradiation homogeneity were evaluated. ► Calculation (dose) and experimental (gel-fraction) results were compared. ► Computer simulation was found reliable and sufficient for process optimization.

  2. Understanding Bonds - Denmark

    DEFF Research Database (Denmark)

    Rimmer, Nina Røhr

    2016-01-01

    a specified rate of interest during the life of the bond and to repay the face value of the bond (the principal) when it “matures,” or comes due. Among the types of bonds you can choose from are: Government securities, municipal bonds, corporate bonds, mortgage and asset-backed securities, federal agency...

  3. A Stochastic Analysis of the Transient Current Induced along the Thin Wire Scatterer Buried in a Lossy Medium

    Directory of Open Access Journals (Sweden)

    Silvestar Šesnić

    2016-01-01

    Full Text Available The paper deals with the stochastic collocation analysis of a time domain response of a straight thin wire scatterer buried in a lossy half-space. The wire is excited either by a plane wave transmitted through the air-ground interface or by an equivalent current source representing direct lightning strike pulse. Transient current induced at the center of the wire, governed by corresponding Pocklington integrodifferential equation, is determined analytically. This antenna configuration suffers from uncertainties in various parameters, such as ground properties, wire dimensions, and position. The statistical processing of the results yields additional information, thus enabling more accurate and efficient analysis of buried wire configurations.

  4. Shear bond strength of precoated orthodontic brackets: an in vivo study

    Directory of Open Access Journals (Sweden)

    Ali H Hassan

    2010-06-01

    Full Text Available Ali H HassanDepartment of Preventive Dental Sciences, Faculty of Dentistry, King Abdulaziz University, Jeddah, Saudi ArabiaObjective: To evaluate the shear bond strength of precoated orthodontic brackets bonded with self-etching primer relative to that of noncoated conventionally-bonded brackets at two different time intervals.Methods: Twenty-one subjects were selected for randomized split-mouth bonding of two types of brackets to the maxillary arch. Half of the teeth had precoated brackets bonded using selfetching adhesive, and the other half had regular brackets bonded using Transbond XT adhesive. Nitinol wires were tied to the upper arch and were left until the time of debonding. The patients were randomly divided into two groups: one debonded after one hour and the other debonded two weeks after the initial wire placement. The shear bond strength was directly recorded from the patients’ mouths using an in vivo debonding device.Results: There were no significant differences in shear bond strength between the precoated and conventional groups or within each group at different time intervals. There were significant differences between anterior and posterior teeth in both the precoated and conventional groups. Conclusion: Pre-coated brackets bonded with self-etching adhesive have the same bonding strength as the conventionally bonded brackets.Keywords: shear bond, bonding, orthodontics, precoated, brackets, self-etching adhesive

  5. Put Your Cable Wiring to the Test.

    Science.gov (United States)

    Day, C. William

    2001-01-01

    Discusses why schools and universities should use testing procedures in any wire bid specification for cable wiring and also know how experienced the installers are in testing and installing structured cabling systems. Key cabling terms are included. (GR)

  6. Clinical experience with direct-bonded orthodontic retainers.

    Science.gov (United States)

    Zachrisson, B U

    1977-04-01

    The experience obtained in clinical evaluation of forty-three direct-bonded mandibular canine-to-canine retainers after a minimum observation period of 1 year (range, 1 to 2.5 years) is summarized. Results indicate that the bonded retainer has all the advantages of a fixed soldered retainer, in addition to being invisible. Patient acceptance was excellent, and the failure rate in terms of loose retainers was low. Also, for a number of other retention problems, direct bonding with different types of lingual wire seems to open up a range of promising new possibilities.

  7. Effect of forming process by using external magnetic field of bonded magnet made from NdFeB flakes to microstructure and magnetic properties

    Science.gov (United States)

    Suprapedi; Sardjono, P.; Muljadi; Djauhari, N. R.; Ramlan

    2018-03-01

    Research of fabricated bonded magnets NdFeB made from NdFeB flakes with variation of external magnetic field has been done. The materials preparation process begins with milling NdFeB flakes using High Energy Milling (HEM) for 60 minutes and mixing it with 5 wt % celuna binder and performing compaction to form pellet with a pressure of 40 Kgf/cm2 and then applying external magnetic field (0, 2000, 5000, 8000 and 11000 Gauss). The pellet samples were then dried using vacuum dryer with temperature of 100 °C for 1 hour. Characterization includes bulk density, measurement of magnetic properties with gauss meter, and Vibrating Sample Magnetometer (VSM). From the characterization results the best value was obtained on the external magnetic field orientation of 8000 to 11000 Gauss with a density value of 5.38 g/cm3, flux magnetic value of 465.9 – 467.1 Gauss, remanence value of 2.63–2.776 kGauss, and coercivity value of 1.905–1.925 kOe.

  8. Competition of electron transfer, dissociation, and bond-forming processes in the reaction of the CO(2)(2+) dication with neutral CO(2).

    Science.gov (United States)

    Ricketts, Claire L; Schröder, Detlef; Roithová, Jana; Schwarz, Helmut; Thissen, Roland; Dutuit, Odile; Zabka, Jan; Herman, Zdenek; Price, Stephen D

    2008-09-01

    The bimolecular reactivity of the CO(2)(2+) dication with neutral CO(2) is investigated using triple quadrupole and ion-ion coincidence mass spectrometry. Crucial for product analysis is the use of appropriate isotope labelling in the quadrupole experiments in order to distinguish the different reactive pathways. The main reaction corresponds to single-electron transfer from the neutral reagent to the dication, i.e. CO(2)(2+) + CO(2) --> 2CO(2)(+); this process is exothermic by almost 10 eV, if ground state monocations are formed. Interestingly, the results indicate that the CO(2)(+) ion formed when the dication accepts an electron dissociates far more readily than the CO(2)(+) ion formed from the neutral CO(2) molecule. This differentiation of the two CO(2)(+) products is rationalized by showing that the population of the key dissociative states of the CO(2)(+) monocation will be favoured from the CO(2)(2+) dication rather than from neutral CO(2). In addition, two bond-forming reactions are observed as minor channels, one of which leads to CO(+) and O(2)(+) as ionic products and the other affords a long-lived C(2)O(3)(2+) dication.

  9. Novel Wiring Technologies for Aerospace Applications

    Science.gov (United States)

    Gibson, Tracy L.; Parrish, Lewis M.

    2014-01-01

    Because wire failure in aerospace vehicles could be catastrophic, smart wiring capabilities have been critical for NASA. Through the years, researchers at Kennedy Space Center (KSC) have developed technologies, expertise, and research facilities to meet this need. In addition to aerospace applications, NASA has applied its knowledge of smart wiring, including self-healing materials, to serve the aviation industry. This webinar will discuss the development efforts of several wiring technologies at KSC and provide insight into both current and future research objectives.

  10. Clinical bending of nickel titanium wires

    OpenAIRE

    Stephen Chain; Priyank Seth; Namrata Rastogi; Kenneth Tan; Mayank Gupta; Richa Singh

    2015-01-01

    Since the evolution and the involvement of Nickel Titanium wires in the field of Orthodontics. The treatment plan has evolved with the use of low force Nickel Titanium wires. Because of their high springback, low stiffness, they are the key initial wires in leveling and alignment but have poor formability. Since poor formability limits its ability to create variable arch forms thus; limits the form of treatment. We have devised a method to bend the Nickel Titanium wires to help in our invento...

  11. Different mechanical properties in Seldinger guide wires

    Directory of Open Access Journals (Sweden)

    Wolfram Schummer

    2015-01-01

    Full Text Available Background and Aims: Most central venous catheters are placed using Seldinger guide wires. EN ISO 11070 is the guideline for testing guide wire flexing performance and tensile strength, and we can safely assume that guide wires in use meet these requirements. Unfortunately, EN ISO 11070 guidelines do not reflect the clinical requirements and we continue to see mechanical failures and their associated complications. Material and Methods: This in vitro study was performed in an accredited laboratory. With regard to flexing, we: (1 Established the minimum flexing performance needed to meet clinical requirements, (2 developed flexing performance tests which mimic clinical requirement, and (3 evaluated the mechanical properties of various guide wires relative to these requirements. With regard to tensile strength, we used the testing method prescribed in ISO 11070, but did not end the test at 5 Newton (N. We continued until the guide wire was damaged, or we reached maximum tractive force. We then did a wire-to-wire comparison. We examined two basic wire constructions, monofil and core and coil. Results: Tensile strength: All wires tested, except one, met EN ISO 11070 requirements for 5 N tensile strength. The mean of the wire types tested ranged from 15.06 N to 257.76 N. Flexing performance: None of the wires kinked. The monofil had no evidence of bending. Two core/coil wires displayed minor bending (angle 1.5°. All other wires displayed bending angles between 22.5° and 43.0°. Conclusion: We recommend that: (1 Clinicians use guide wires with high-end mechanical properties, (2 EN ISO 11070 incorporate our flexing test into their testing method, raise the flexing requirement to kink-proof, (3 and raise the tensile strength requirement to a minimum of 30 N, and (3 all manufacturers and suppliers be required to display mechanical properties of all guide wire, and guide wire kits sold.

  12. Tensile Characteristics of Bond of Stainless Steel Overlay Weld after Absorption of Hydrogen : Study on a Stainless Steel Overlay Welding Process for Superior Resistance to Disbonding (Report 4)

    OpenAIRE

    Akiyoshi, FUJI; Etsuo, KUDO; Tomoyuki, TAKAHASHI; The Japan Steel Works, Ltd., Muroran Plant; The Japan Steel Works, Ltd., Muroran; The Japan Steel Works, Ltd., Muroran Plant

    1987-01-01

    The tensile characteristics of the bond of the disbanding-resistant overlay weld after absorption of hydrogen were studied and compared with those of the conventional overlay weld. It was found that the tensile strength of the bond of the conventional overlay weld was lower than that of the disbanding-resistant overlay weld. This is due to existence of the coarse planar grains in first layer overlay weld metal adjacent to the bond. The coarse planar grains strongly reduce the resistance to hy...

  13. Vocational Preparation Curriculum: Electrical Wiring.

    Science.gov (United States)

    Usoro, Hogan

    This document is a curriculum guide for instructors teaching vocational preparation for electrical wiring to special needs students. The purpose of the curriculum guide is to provide minimum skills for disadvantaged and handicapped students entering the mainstream; to supplement vocational skills of those students already in a regular training…

  14. Transparency in nanophotonic quantum wires

    International Nuclear Information System (INIS)

    Singh, Mahi R

    2009-01-01

    We have studied the quantum optics of a photonic quantum nanowire doped with an ensemble of three-level nanoparticles. The wire is made from two photonic crystals A and B. Crystal A is embedded within crystal B and acts as a photonic nanowire. It is considered that the conduction band of crystal A lies below that of crystal B. As a result, photons are confined in crystal A and are reflected from crystal B. The bound states of the confined photons are calculated using the transfer matrix method. It is found that the number of bound states in the wire depends on the size of the wire and the energy difference between the conduction band extrema of crystals A and B. The absorption coefficient of the system has also been calculated using the Schroedinger equation method. It is considered that the nanoparticles interact with the photonic bound states. Numerical simulations show that when one of the resonance energies lies near the bound state, the system becomes transparent. However, when the resonance energy lies away from the bound state the crystal reverts to an absorbing state. Similarly, when the radius of the dielectric spheres is changed the location of the transparency peak is shifted. This means that the present system can be switched between two states by changing the size of the wire and the transition energy. These findings can be used to make new types of optical devices.

  15. Health care's 100 most wired.

    Science.gov (United States)

    Solovy, A; Serb, C

    1999-02-01

    They're wired all right, and America's 100 most techno-savvy hospitals and health systems share one more thing: a commitment to using technology to link with employees, patients, suppliers, and insurers. "We want to be a health care travel agency for our community," says one chief information officer. "And we see Internet technology as a key."

  16. Electromagnetic Nondestructive Evaluation of Wire Insulation and Models of Insulation Material Properties

    Science.gov (United States)

    Bowler, Nicola; Kessler, Michael R.; Li, Li; Hondred, Peter R.; Chen, Tianming

    2012-01-01

    Polymers have been widely used as wiring electrical insulation materials in space/air-craft. The dielectric properties of insulation polymers can change over time, however, due to various aging processes such as exposure to heat, humidity and mechanical stress. Therefore, the study of polymers used in electrical insulation of wiring is important to the aerospace industry due to potential loss of life and aircraft in the event of an electrical fire caused by breakdown of wiring insulation. Part of this research is focused on studying the mechanisms of various environmental aging process of the polymers used in electrical wiring insulation and the ways in which their dielectric properties change as the material is subject to the aging processes. The other part of the project is to determine the feasibility of a new capacitive nondestructive testing method to indicate degradation in the wiring insulation, by measuring its permittivity.

  17. Preparation of Cu, Ag, Fe and Al nanoparticles by the exploding wire ...

    Indian Academy of Sciences (India)

    We describe a novel process for the production of nanoparticles of Cu, Ag, Fe and Al which involves exploding their respective wires, triggered by large current densities in the wires. The particles are characterised by X-ray diffraction (XRD) and atomic force microscopy (AFM). Particle sizes in the range 20-100nm were ...

  18. Fast pyrolysis in a novel wire-mesh reactor: decomposition of pine wood and model compounds

    NARCIS (Netherlands)

    Hoekstra, E.; van Swaaij, Willibrordus Petrus Maria; Kersten, Sascha R.A.; Hogendoorn, Kees

    2012-01-01

    In fast pyrolysis, biomass decomposition processes are followed by vapor phase reactions. Experimental results were obtained in a unique wire-mesh reactor using pine wood, KCl impregnated pine wood and several model compounds (cellulose, xylan, lignin, levoglucosan, glucose). The wire-mesh reactor

  19. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

    Directory of Open Access Journals (Sweden)

    C. L. Gan

    2013-01-01

    Full Text Available Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with bias and UHAST (unbiased HAST wearout reliability performance of Au and PdCu wires used in fine pitch BGA packages. In-depth failure analysis has been carried out to identify the failure mechanism under various wearout conditions. Intermetallic compound (IMC diffusion constants and apparent activation energies (Eaa of both wire types were investigated after high temperature storage life test (HTSL. Au bonds were identified to have faster IMC formation, compared to slower IMC growth of PdCu. PdCu wire was found to exhibit equivalent or better wearout reliability margin compared to conventional Au wire bonds. Failure mechanisms of Au, Cu ball bonds post-HAST and UHAST tests are been proposed, and both Au and PdCu IMC diffusion kinetics and their characteristics are discussed in this paper.

  20. Multi-anode wire straw tube tracker

    International Nuclear Information System (INIS)

    Oh, S.H.; Ebenstein, W.L.; Wang, C.W.

    2011-01-01

    We report on a test of a straw tube detector design having several anode (sense) wires inside a straw tube. The anode wires form a circle inside the tube and are read out independently. This design could solve several shortcomings of the traditional single wire straw tube design such as double hit capability and stereo configuration.

  1. Home and School Technology: Wired versus Wireless.

    Science.gov (United States)

    Van Horn, Royal

    2001-01-01

    Presents results of informal research on smart homes and appliances, structured home wiring, whole-house audio/video distribution, hybrid cable, and wireless networks. Computer network wiring is tricky to install unless all-in-one jacketed cable is used. Wireless phones help installers avoid pre-wiring problems in homes and schools. (MLH)

  2. On the preparation of superconducting wires

    International Nuclear Information System (INIS)

    Topare, R.J.; Chinchure, A.D.; Shah, S.S.; Hadole, G.B.

    1993-01-01

    The different methods of preparation of superconducting wires have been discussed. The powder-in-tube technique is followed for the preparation of YBCO and BISCCO superconducting wires. The results are discussed. The present status of the industries in preparing the superconducting wires having the maximum J c values is discussed. (author). 30 refs., 6 figs., 2 tabs

  3. Pre-wired systems prove their worth.

    Science.gov (United States)

    2012-03-01

    The 'new generation' of modular wiring systems from Apex Wiring Solutions have been specified for two of the world's foremost teaching hospitals - the Royal London and St Bartholomew's Hospital, as part of a pounds sterling 1 billion redevelopment project, to cut electrical installation times, reduce on-site waste, and provide a pre-wired, factory-tested, power and lighting system. HEJ reports.

  4. 75 FR 4584 - Wire Decking From China

    Science.gov (United States)

    2010-01-28

    ... COMMISSION Wire Decking From China AGENCY: United States International Trade Commission. ACTION: Scheduling... retarded, by reason of subsidized and less-than-fair-value imports from China of wire decking, provided for..., producers, or exporters in China of wire decking, and that such ] products are being sold in the United...

  5. In-situ transmission electron microscopy observation of electromigration in Au thin wires.

    Science.gov (United States)

    Murakami, Yosuke; Arita, Masashi; Hamada, Kouichi; Takahashi, Yasuo

    2012-11-01

    Electromigration of thin Au wire is studied by the use of in-situ transmission electron microscopy (TEM) techniques from the viewpoint of nanogap formation. We use a relatively wide Au wire as a starting material because the position-dependent structure change in the wire provides information of the thermal effect caused by the current flow. In-situ TEM observation, in which current measurements of the Au wire are simultaneously performed, reveals the process of the growth of voids and grains. Finally the formation of a nanogap by electromigration is observed doing with current measurements. All the results observed by in-situ TEM indicate the fact that the thermal effects or temperature increase in the wire region take an important role for the structure change caused by electromigration of Au in the wire. It is suggested that the position of the nanogap can roughly be arranged by setting the wire structure and current direction even though a relatively wide wire was used. The detailed observation by in-situ TEM also suggests that the control of heat generation in the wire makes the nanogap sharp because of the well-controlled recrystallization of Au nanowires.

  6. Shape of a clamped stiff harpsichord wire driven at a resonant frequency

    Science.gov (United States)

    Hanson, Roger J.; Macomber, Hilliard Kent; Boucher, Mathew A.

    2002-05-01

    A wire transversely driven by a sinusoidal force at the resonant frequency of a vibrational mode vibrates at the driving frequency and at harmonics generated by nonlinear processes in the wire. If the amplitude of a harmonic is measured as a function of position along the wire, its shape is revealed. It differs significantly from a sinusoid in the vicinity of either end of the wire because the ends are clamped and the wire has significant stiffness. The shapes of various harmonics have been determined for a brass harpsichord wire, 70 cm long, from optical detector measurements made at different distances from a clamped end. Knowledge of shape facilitates the determination of antinode amplitudes of harmonics when the gross motion of the wire is so large that the detectors must be positioned near an end of the wire because of their very limited dynamic range. Some observations of harmonics and related phenomena were reported previously [Hanson et al., J. Acoust Soc. Am. 108, 2592 (2000); 106, 2141 (1999)]. The shape information is also needed to help separate nonlinear effects possibly occurring in the detectors from those of interest, occurring in the wire itself.

  7. Hot drawn Fe–6.5 wt.%Si wires with good ductility

    International Nuclear Information System (INIS)

    Yang, W.; Li, H.; Yang, K.; Liang, Y.F.; Yang, J.; Ye, F.

    2014-01-01

    Highlights: • Fe–6.5wt%Si steel wire with diameter of 1.6 mm can be successfully obtained by hot drawing process. • The ductility of Fe–6.5wt%Si alloy can be improved significantly when it is fabricated in the form of wire. • The Dc magnetic property of Fe–6.5wt%Si steel wire 1.6 mm in diameter is excellent, which is close to that of 0.3 mm thick cold-rolling sheet. - Abstract: Fe–6.5 wt.%Si high silicon steel wires with a diameter of 1.6 mm are fabricated successfully by hot drawing. The high silicon steel wires show much better ductility than sheets. The tensile strength and elongation of the wires at the room temperature can reach 1.31 GPa and 1.4%, respectively. The tensile strength and elongation of the rolling sheet at the room temperature are 0.8 GPa and 0, respectively. The microstructure analyses show that the elongated grains after drawing and reduced ordering phases by deformation in the wires might contribute to its good ductility. Bs value of 1.437 T and Hc value of 16.96 A/m are obtained for the wire after proper heat treatment for the wires

  8. Hot drawn Fe–6.5 wt.%Si wires with good ductility

    Energy Technology Data Exchange (ETDEWEB)

    Yang, W.; Li, H.; Yang, K.; Liang, Y.F.; Yang, J.; Ye, F., E-mail: yefeng@skl.ustb.edu.cn

    2014-08-01

    Highlights: • Fe–6.5wt%Si steel wire with diameter of 1.6 mm can be successfully obtained by hot drawing process. • The ductility of Fe–6.5wt%Si alloy can be improved significantly when it is fabricated in the form of wire. • The Dc magnetic property of Fe–6.5wt%Si steel wire 1.6 mm in diameter is excellent, which is close to that of 0.3 mm thick cold-rolling sheet. - Abstract: Fe–6.5 wt.%Si high silicon steel wires with a diameter of 1.6 mm are fabricated successfully by hot drawing. The high silicon steel wires show much better ductility than sheets. The tensile strength and elongation of the wires at the room temperature can reach 1.31 GPa and 1.4%, respectively. The tensile strength and elongation of the rolling sheet at the room temperature are 0.8 GPa and 0, respectively. The microstructure analyses show that the elongated grains after drawing and reduced ordering phases by deformation in the wires might contribute to its good ductility. Bs value of 1.437 T and Hc value of 16.96 A/m are obtained for the wire after proper heat treatment for the wires.

  9. Nanopowder production by gas-embedded electrical explosion of wire

    International Nuclear Information System (INIS)

    Zou Xiao-Bing; Wang Xin-Xin; Jiang Wei-Hua; Mao Zhi-Guo

    2013-01-01

    A small electrical explosion of wire (EEW) setup for nanopowder production is constructed. It consists of a low inductance capacitor bank of 2 μF–4 μF typically charged to 8 kV−30 kV, a triggered gas switch, and a production chamber housing the exploding wire load and ambient gas. With the EEW device, nanosize powders of titanium oxides, titanium nitrides, copper oxides, and zinc oxides are successfully synthesized. The average particle size of synthesized powders under different experimental conditions is in a range of 20 nm−80 nm. The pressure of ambient gas or wire vapor can strongly affect the average particle size. The lower the pressure, the smaller the particle size is. For wire material with relatively high resistivity, such as titanium, whose deposited energy W d is often less than sublimation energy W s due to the flashover breakdown along the wire prematurely ending the Joule heating process, the synthesized particle size of titanium oxides or titanium nitrides increases with overheat coefficient k (k = W d /W s ) increasing. (physics of gases, plasmas, and electric discharges)

  10. Nanopowder production by gas-embedded electrical explosion of wire

    Science.gov (United States)

    Zou, Xiao-Bing; Mao, Zhi-Guo; Wang, Xin-Xin; Jiang, Wei-Hua

    2013-04-01

    A small electrical explosion of wire (EEW) setup for nanopowder production is constructed. It consists of a low inductance capacitor bank of 2 μF-4 μF typically charged to 8 kV-30 kV, a triggered gas switch, and a production chamber housing the exploding wire load and ambient gas. With the EEW device, nanosize powders of titanium oxides, titanium nitrides, copper oxides, and zinc oxides are successfully synthesized. The average particle size of synthesized powders under different experimental conditions is in a range of 20 nm-80 nm. The pressure of ambient gas or wire vapor can strongly affect the average particle size. The lower the pressure, the smaller the particle size is. For wire material with relatively high resistivity, such as titanium, whose deposited energy Wd is often less than sublimation energy Ws due to the flashover breakdown along the wire prematurely ending the Joule heating process, the synthesized particle size of titanium oxides or titanium nitrides increases with overheat coefficient k (k = Wd/Ws) increasing.

  11. Stepwise vs concerted excited state tautomerization of 2-hydroxypyridine: Ammonia dimer wire mediated hydrogen/proton transfer

    Energy Technology Data Exchange (ETDEWEB)

    Esboui, Mounir, E-mail: mounir.esboui@fst.rnu.tn [Laboratoire de Spectroscopie Atomique, Moléculaire et Applications, Département de Physique, Faculté des Sciences de Tunis, 2092 Tunis (Tunisia); Technical and Vocational Training Corporation, Hail College of Technology, P.O. Box 1960, Hail 81441 (Saudi Arabia)

    2015-07-21

    The stepwise and concerted excited state intermolecular proton transfer (PT) and hydrogen transfer (HT) reactions in 2-hydroxypyridine-(NH{sub 3}){sub 2} complex in the gas phase under Cs symmetry constraint and without any symmetry constraints were performed using quantum chemical calculations. It shows that upon excitation, the hydrogen bonded in 2HP-(NH{sub 3}){sub 2} cluster facilitates the releasing of both hydrogen and proton transfer reactions along ammonia wire leading to the formation of the 2-pyridone tautomer. For the stepwise mechanism, it has been found that the proton and the hydrogen may transfer consecutively. These processes are distinguished from each other through charge translocation analysis and the coupling between the motion of the proton and the electron density distribution along ammonia wire. For the complex under Cs symmetry, the excited state HT occurs on the A″({sup 1}πσ{sup ∗}) and A′({sup 1}nσ{sup ∗}) states over two accessible energy barriers along reaction coordinates, and excited state PT proceeds mainly through the A′({sup 1}ππ{sup ∗}) and A″({sup 1}nπ{sup ∗}) potential energy surfaces. For the unconstrained complex, potential energy profiles show two {sup 1}ππ{sup ∗}-{sup 1}πσ{sup ∗} conical intersections along enol → keto reaction path indicating that proton and H atom are localized, respectively, on the first and second ammonia of the wire. Moreover, the concerted excited state PT is competitive to take place with the stepwise process, because it proceeds over low barriers of 0.14 eV and 0.11 eV with respect to the Franck-Condon excitation of enol tautomer, respectively, under Cs symmetry and without any symmetry constraints. These barriers can be probably overcome through tunneling effect.

  12. An Alternative Low-Cost Process for Deposition of MCrAlY Bond Coats for Advanced Syngas/Hydrogen Turbine Applications

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Ying [Tennessee Technological Univ., Cookeville, TN (United States)

    2015-09-11

    The objective of this project was to develop and optimize MCrAlY bond coats for syngas/hydrogen turbine applications using a low-cost electrolytic codeposition process. Prealloyed CrAlY-based powders were codeposited into a metal matrix of Ni, Co or Ni-Co during the electroplating process, and a subsequent post-deposition heat treatment converted it to the MCrAlY coating. Our research efforts focused on: (1) investigation of the effects of electro-codeposition configuration and parameters on the CrAlY particle incorporation in the NiCo-CrAlY composite coatings; (2) development of the post-deposition heat treating procedure; (3) characterization of coating properties and evaluation of coating oxidation performance; (4) exploration of a sulfurfree electroplating solution; (5) cost analysis of the present electrolytic codeposition process. Different electro-codeposition configurations were investigated, and the rotating barrel system demonstrated the capability of depositing NiCo-CrAlY composite coatings uniformly on the entire specimen surface, with the CrAlY particle incorporation in the range 37-42 vol.%. Post-deposition heat treatment at 1000-1200 °C promoted interdiffusion between the CrAlY particles and the Ni-Co metal matrix, resulting in β/γ’/γ or β/γ’ phases in the heat-treated coatings. The results also indicate that the post-deposition heat treatment should be conducted at temperatures ≤1100 °C to minimize Cr evaporation and outward diffusion of Ti. The electro-codeposited NiCrAlY coatings in general showed lower hardness and surface roughness than thermal spray MCrAlY coatings. Coating oxidation performance was evaluated at 1000-1100 °C in dry and wet air environments. The initial electro-codeposited NiCoCrAlY coatings containing relatively high sulfur did not show good oxidation resistance. After modifications of the coating process, the cleaner NiCoCrAlY coating exhibited good oxidation performance at 1000 °C during the 2,000 1-h cyclic

  13. Clinical bending of nickel titanium wires

    Directory of Open Access Journals (Sweden)

    Stephen Chain

    2015-01-01

    Full Text Available Since the evolution and the involvement of Nickel Titanium wires in the field of Orthodontics. The treatment plan has evolved with the use of low force Nickel Titanium wires. Because of their high springback, low stiffness, they are the key initial wires in leveling and alignment but have poor formability. Since poor formability limits its ability to create variable arch forms thus; limits the form of treatment. We have devised a method to bend the Nickel Titanium wires to help in our inventory but also customized the wire according to the treatment.

  14. Emittance growth due to Tevatron flying wires

    Energy Technology Data Exchange (ETDEWEB)

    Syphers, M; Eddy, Nathan

    2004-06-01

    During Tevatron injection, Flying Wires have been used to measure the transverse beam size after each transfer from the Main Injector in order to deduce the transverse emittances of the proton and antiproton beams. This amounts to 36 + 9 = 45 flies of each of 3 wire systems, with an individual wire passing through each beam bunch twice during a single ''fly''. below they estimate the emittance growth induced by the interaction of the wires with the particles during these measurements. Changes of emittance from Flying Wire measurements conducted during three recent stores are compared with the estimations.

  15. Synthesis of Boron Nano wires, Nano tubes, and Nano sheets

    International Nuclear Information System (INIS)

    Patel, R.B.; Chou, T.; Iqbal, Z.

    2014-01-01

    The synthesis of boron nano wires, nano tubes, and nano sheets using a thermal vapor deposition process is reported. This work confirms previous research and provides a new method capable of synthesizing boron nano materials. The materials were made by using various combinations of MgB 2 , Mg(BH 4 ) 2 , MCM-41, NiB, and Fe wire. Unlike previously reported methods, a nanoparticle catalyst and a silicate substrate are not required for synthesis. Two types of boron nano wires, boron nano tubes, and boron nano sheets were made. Their morphology and chemical composition were determined through the use of scanning electron microscopy, transmission electron microscopy, and electron energy loss spectroscopy. These boron-based materials have potential for electronic and hydrogen storage applications.

  16. Clinical effectiveness of 2 orthodontic retainer wires on mandibular arch retention.

    Science.gov (United States)

    Gunay, Firdevs; Oz, Abdullah Alper

    2018-02-01

    The aim of this study was to evaluate and compare the clinical success of 2 lingual retainer wires. The 120 patients included in the study were divided into 2 groups randomly. In group 1, 0.0175-in 6-strand stainless steel wire (Ortho Technology, Lutz, Fla) was used, the lingual retainers were fabricated on plaster models, and a silicon transfer key was used. In group 2, 0.0195-in dead-soft coaxial wire (Respond; Ormco, Orange, Calif) was used, and the lingual retainers were fabricated directly in the patient's mandibular arch without a study model. Pretreatment, posttreatment, and posttreatment 3-month, 6-month, 9-month, and 12-month 3-dimensional orthodontic models were evaluated. Failure rates, mandibular arch irregularity values, intercanine distances, and arch lengths were compared. The clinical bond failure rates were 13.2% for the 0.0175-in 6-strand stainless steel wire and 18.9% for the 0.0195-in dead-soft wire. The difference in bond failures between the 2 groups was not statistically significant. There was a statistically significant increase in mandibular arch irregularity in both groups during the 12-month follow-up. However, the increase was significantly higher in the second group than in the first one. Furthermore, the intercanine distance decreased over time in the second group. Our findings regarding mandibular arch measurements indicate that fabrication of lingual retainers can be more safely accomplished with 0.0175-in 6-strand stainless steel wire than with 0.0195-in dead-soft coaxial wire. Copyright © 2017 American Association of Orthodontists. Published by Elsevier Inc. All rights reserved.

  17. AIR EMISSIONS FROM LASER DRILLING OF PRINTED WIRING BOARD MATERIALS

    Science.gov (United States)

    The paper gives results of a study to characterize gases generated during laser drilling of printed wiring board (PWB) material and identifies the pollutants and generation rates found during the drilling process. Typically found in the missions stream were trace amounts of carbo...

  18. Method of making Nb3Sn composite wires and cables

    International Nuclear Information System (INIS)

    Scanlan, R.M.; Fietz, W.A.

    1977-01-01

    By providing a nickel or copper overcoat to a tin coating on a niobium-copper multifilamentary composite wire, one can avoid the necessity for choosing between poor superconducting properties due to tin droplet formation and substantially increasing production costs by adding a number of special processing steps. 9 claims, 1 figure

  19. Remotely replaceable jumpers and embedded wiring for the DWPF

    International Nuclear Information System (INIS)

    Heckendorn, F.M. II.

    1984-01-01

    The Defense Waste Processing Facility (DWPF) for radioactive waste vitrification at the Savannah River Plant (SRP) is now under construction. Development of specialized electrical/instrument inter-connectors, or jumpers, is now complete. Remote replacement of the associated through-wall wiring using a standard canyon crane has also been demonstrated. 8 figures

  20. Optimization of electron beam crosslinking of wire and cable insulation

    International Nuclear Information System (INIS)

    Zimek, Z.; Przybytniak, G.; Nowicki, A.

    2011-01-01

    Complete text of publication follows. The computer simulations based on Monte Carlo method and the ModeCEB software program were carried out in connection with EB radiation set-up for crosslinking of electrical wire and cable insulation, located at the Center for Radiation Research and Technology of the Institute of Nuclear Chemistry and Technology. The theoretical predictions for absorbed dose distribution in irradiated electrical wire and cable insulation caused by scanned EB were compared to the experimental results of irradiation which were carried out in the experimental set-up based on ILU 6 electron accelerator, which is characterized by the following parameters: Electron energy 0.5-2.0 MeV; Average beam current 40-10 mA, pulse duration 400 μs; Width of scanning up to 80 cm; Scan frequency up to 50 Hz. The computer simulation of the dose distributions in two-sided irradiation system by a scanned electron beam in multilayer circular objects was performed for different process parameters; electrical wire and cable geometry (thickness of insulation layers and cupper wire diameter), type of polymer isolation, electron energy, energy spread, geometry of electron beam and electrical wire and cable distribution at irradiation zone. The geometry of electron beam distribution in irradiation zone was measured using TVA and PVC foil dosimeters for electron energy range available in ILU 6 accelerator. The temperature rise of irradiated electrical wire and irradiation homogeneity were evaluated for different experimental conditions to optimize process parameters. The obtained results of computer simulation were supported by experimental data of dose distribution based on gel-fraction measurements. Such agreement indicates that computer simulation ModeCEB is correct and sufficient for modelling of absorbed dose distribution in multi-layer circular objects irradiated with scanned electron beams. Acknowledgement: The R and D activities are supported by the European

  1. High-speed micro electrode tool fabrication by a twin-wire EDM system

    International Nuclear Information System (INIS)

    Sheu, Dong-Yea

    2008-01-01

    This paper describes a new machining process which combines twin-electro-wire together with two electro discharge circuits to rapidly fabricate micro electrode tools. The results show that transistor electro discharge and RC electro discharge circuits coexist to fabricate micro tools with rough and finish machining both on the same machine. Compared to conventional wire electro discharge grinding (WEDG) technology, a twin-wire EDM system that combines rough and finish machining into one process allows the efficient fabrication of micro tools. This high-speed micro tool fabrication process can be applied not only to micro electrode machining but also to micro punching tool and micro probing tips machining

  2. Progress in AMSC scale-up of second generation HTS wire

    International Nuclear Information System (INIS)

    Zhang, W.; Rupich, M.W.; Schoop, U.; Verebelyi, D.T.; Thieme, C.L.H.; Li, X.; Kodenkandath, T.; Huang, Y.; Siegal, E.; Buczek, D.; Carter, W.; Nguyen, N.; Schreiber, J.; Prasova, M.; Lynch, J.; Tucker, D.; Fleshler, S.

    2007-01-01

    American Superconductor has successfully scaled up its low-cost, high volume second generation (2G) HTS wire process into pre-pilot scale production, with performance approaching first generation (1G) HTS wire. AMSC's manufacturing approach is based on RABiTS TM /MOD wide strip technology, with metal organic deposition (MOD) process for the YBCO layer and the Rolling Assisted Biaxially Textured Substrate (RABiTS) process for the template. In this paper, we review the status of the 2G manufacturing scale up at AMSC and describe the properties and architecture of the 2G wire being manufactured and developed for various applications

  3. Progress in AMSC scale-up of second generation HTS wire

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, W. [American Superconductor Corporation, 2 Technology Drive, Westborough, MA 01545 (United States)], E-mail: wzhang@amsuper.com; Rupich, M.W.; Schoop, U.; Verebelyi, D.T.; Thieme, C.L.H.; Li, X.; Kodenkandath, T.; Huang, Y.; Siegal, E.; Buczek, D.; Carter, W.; Nguyen, N.; Schreiber, J.; Prasova, M.; Lynch, J.; Tucker, D.; Fleshler, S. [American Superconductor Corporation, 2 Technology Drive, Westborough, MA 01545 (United States)

    2007-10-01

    American Superconductor has successfully scaled up its low-cost, high volume second generation (2G) HTS wire process into pre-pilot scale production, with performance approaching first generation (1G) HTS wire. AMSC's manufacturing approach is based on RABiTS{sup TM}/MOD wide strip technology, with metal organic deposition (MOD) process for the YBCO layer and the Rolling Assisted Biaxially Textured Substrate (RABiTS) process for the template. In this paper, we review the status of the 2G manufacturing scale up at AMSC and describe the properties and architecture of the 2G wire being manufactured and developed for various applications.

  4. Vibrating wire for beam profile scanning

    Directory of Open Access Journals (Sweden)

    S. G. Arutunian

    1999-12-01

    Full Text Available A method that measures the transverse profile (emittance of the bunch by detecting radiation arising at the scattering of the bunch on scanning wire is widely used. In this work information about bunch scattering is obtained by measuring the oscillation frequency of the tightened scanning wire. In such a way, the system of radiation (or secondary particles extraction and measurement can be removed. The entire unit consists of a compact fork with tightened wire and a scanning system. Normal oscillation frequency of a wire depends on wire tension, its geometric parameters, and, in a second approximation, its elastic characteristics. Normal oscillations are generated by interaction of an alternating current through the wire with magnetic field of a permanent magnet. In this case, it is suggested that the magnetic field of the accelerator (field of dipole magnets or quadrupole magnets be used for excitation of oscillations. The dependence of oscillation frequency on beam scattering is determined by several factors, including changes of wire tension caused by transverse force of the beam and influence of beam self-field. Preliminary calculations show that the influence of wire heating will dominate. We have studied strain gauges on the basis of vibrating wire from various materials (tungsten, beryl bronze, and niobium zirconium alloys. A scheme of normal oscillation generation by alternating current in autogeneration circuit with automatic frequency adjustment was selected. A special method of wire fixation and elimination of transverse degrees of freedom allows us to achieve relative stability better than 10^{-5} during several days at a relative resolution of 10^{-6}. Experimental results and estimates of wire heating of existing scanners show that the wire heats up to a few hundred grades, which is enough for measurements. The usage of wire of micrometer thickness diminishes the problem of wire thermalization speed during the scanning of the bunch.

  5. X hydrogen bonds

    Indian Academy of Sciences (India)

    sigma electrons, can be hydrogen bond acceptors.11–14. The recent IUPAC report and recommendation on hydro gen bond have recognised the diverse nature of hydro- gen bond donors and acceptors.13,14. Unlike methane, hydrogen bonding by higher alkanes has not received much attention. One of the earlier works.

  6. Modifications in straight wire treatment.

    Science.gov (United States)

    Cardona, Alvin

    2010-01-01

    Orthodontic treatments have been modified with each new generation of clinicians. Today the emphasis is on facial esthetics and healthy temporomandibular joints. With orthopedic treatment, we can develop dental arches to get the necessary space to align the teeth and we can reach adequate function and esthetics, all within relatively good stability. By combining two-phase treatment with low friction fixed orthodontics and super elastic wires we produce light but continuous forces and we can provide better treatment than before. These types of forces cause physiological and functional orthopedic orthodontic reactions. The purpose of this article is to demonstrate our fixed orthopedic and orthodontic approach called "Modified Straight Wire" or "Physiologic Arch Technique." This technique is very successful with our patients because it can exert slow and continuous forces with minimal patient cooperation.

  7. Sintered wire cesium dispenser photocathode

    Science.gov (United States)

    Montgomery, Eric J; Ives, R. Lawrence; Falce, Louis R

    2014-03-04

    A photoelectric cathode has a work function lowering material such as cesium placed into an enclosure which couples a thermal energy from a heater to the work function lowering material. The enclosure directs the work function lowering material in vapor form through a low diffusion layer, through a free space layer, and through a uniform porosity layer, one side of which also forms a photoelectric cathode surface. The low diffusion layer may be formed from sintered powdered metal, such as tungsten, and the uniform porosity layer may be formed from wires which are sintered together to form pores between the wires which are continuous from the a back surface to a front surface which is also the photoelectric surface.

  8. Slice of LHC dipole wiring

    CERN Multimedia

    Dipole model slice made in 1994 by Ansaldo. The high magnetic fields needed for guiding particles around the Large Hadron Collider (LHC) ring are created by passing 12’500 amps of current through coils of superconducting wiring. At very low temperatures, superconductors have no electrical resistance and therefore no power loss. The LHC is the largest superconducting installation ever built. The magnetic field must also be extremely uniform. This means the current flowing in the coils has to be very precisely controlled. Indeed, nowhere before has such precision been achieved at such high currents. 50’000 tonnes of steel sheets are used to make the magnet yokes that keep the wiring firmly in place. The yokes constitute approximately 80% of the accelerator's weight and, placed side by side, stretch over 20 km!

  9. A New Superconducting Wire for Future Accelerators

    CERN Multimedia

    2006-01-01

    The CARE/NED project has developed a new superconducting wire that can achieve very high currents (1400 amps) at high magnetic fields (12 teslas). Cross-section of the CARE/NED wire produced by SMI. As we prepare to enter a new phase of particle physics with the LHC, technological development is a continuous process to ensure the demands of future research are met. The next generation of colliders and upgrades of the present ones will require significantly larger magnetic fields for bending and focusing the particle beams. NED (Next European Dipole) is one of the projects taking on this challenge to push technology beyond the present limit (see: More about NED). The magnets in the LHC rely on niobium titanium (NbTi) as the superconducting material, with a maximum magnetic field of 8 to 10T (tesla). In order to exceed this limitation, a different material together with the corresponding technology needs to be developed. NED is assessing the suitability of niobium tin (Nb3Sn), which has the potential to at le...

  10. Wear of dragline wire ropes

    Energy Technology Data Exchange (ETDEWEB)

    Dayawansa, D.; Kuruppu, M.; Mashiri, F.; Bartosiewicz, H. [Monash University (Caulfield Campus), Caulfield East, Vic. (Australia). Department of Mechanical Engineering,

    2005-07-01

    Wire ropes are one of the most heavily used components in a dragline. Hoist ropes are subjected to fatigue due to the cyclic nature of load handling as well as due to rope bending over the sheaves and the drum under load. This leads to wire breaks due to fatigue. Accumulation of a number of wire breaks close to each other can have a detrimental effect on the rope. Furthermore, to allow for the increasing demand for higher load capacity coupled with the inconvenience of having very large ropes, the factor of safety is often compromised, which increases the wear rate. Drag ropes are also subjected to heavy loads. More importantly, they are allowed to drag along the rough mine surface subjecting them to external physical abrasion. This makes the life of drag ropes one of the lowest among those used in a dragline. Suspension and IBS ropes are relatively uniformly loaded during their regular usage although they need to withstand dynamic load cycles as well as bending. Hence they tend to last for a number of years on average. The paper analyses the wear types and their severity of each of these rope applications, and suggests methods to determine rope wear rates and the resulting rope life. The paper further gives suggestions for good operating and maintenance practice that can extend the rope life and help reduce the large expenditure associated with every major rope change in a dragline. 6 refs., 8 figs., 1 tab.

  11. Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites

    Directory of Open Access Journals (Sweden)

    David Florián-Algarín

    2018-03-01

    Full Text Available This study sought to characterize aluminum nanocomposite wires that were fabricated through a cold-rolling process, having potential applications in TIG (tungsten inert gas welding of aluminum. A206 (Al-4.5Cu-0.25Mg master nanocomposites with 5 wt % γAl2O3 nanoparticles were first manufactured through a hybrid process combining semi-solid mixing and ultrasonic processing. A206/1 wt % γAl2O3 nanocomposites were fabricated by diluting the prepared master nanocomposites with a monolithic A206 alloy, which was then added to a pure aluminum melt. The fabricated Al–γAl2O3 nanocomposite billet was cold-rolled to produce an Al nanocomposite wire with a 1 mm diameter and a transverse area reduction of 96%. Containing different levels of nanocomposites, the fabricated samples were mechanically and electrically characterized. The results demonstrate a significantly higher strength of the aluminum wires with the nanocomposite addition. Further, the addition of alumina nanoparticles affected the wires’ electrical conductivity compared with that of pure aluminum and aluminum–copper alloys. The overall properties of the new material demonstrate that these wires could be an appealing alternative for fillers intended for aluminum welding.

  12. Experimental study on titanium wire drawing with ultrasonic vibration.

    Science.gov (United States)

    Liu, Shen; Shan, Xiaobiao; Guo, Kai; Yang, Yuancai; Xie, Tao

    2018-02-01

    Titanium and its alloys have been widely used in aerospace and biomedical industries, however, they are classified as difficult-to-machine materials. In this paper, ultrasonic vibration is imposed on the die to overcome the difficulties during conventional titanium wire drawing processes at the room temperature. Numerical simulations were performed to investigate the variation of axial stress within the contacting region and study the change of the drawing stress with several factors in terms of the longitudinal amplitude and frequency of the applied ultrasonic vibration, the diameter reduction ratio, and the drawing force. An experimental testing equipment was established to measure the drawing torque and rotational velocity of the coiler drum during the wire drawing process. The result indicates the drawing force increases with the growth of the drawing velocity and the reduction ratio, whether with or without vibrations. Application of either form of ultrasonic vibrations contributes to the further decrease of the drawing force, especially the longitudinal vibration with larger amplitude. SEM was employed to detect the surface morphology of the processed wires drawn under the three circumstances. The surface quality of the drawn wires with ultrasonic vibrations was apparently improved compared with those using conventional method. In addition, the longitudinal and torsional composite vibration was more effective for surface quality improvement than pure longitudinal vibration, however, at the cost of weakened drawing force reduction effect. Copyright © 2017 Elsevier B.V. All rights reserved.

  13. Interlaminar toughness of fusion bonded thermoplastic composites

    NARCIS (Netherlands)

    Sacchetti, Francisco R.

    2017-01-01

    Thermoplastic composites are of increasing interest to the aerospace industry. The melt-processability of the thermoplastic matrix allows for fast manufacturing and assembling techniques, such as thermoforming and fusion bonding, which are also highly suitable for process automation. Fusion bonding

  14. Parents’ expectations of staff in the early bonding process with their premature babies in the intensive care setting: a qualitative multicenter study with 60 parents

    Directory of Open Access Journals (Sweden)

    Guillaume Sonia

    2013-02-01

    Full Text Available Abstract Background During the first weeks of hospitalization, premature babies and their parents encounter difficulties in establishing early bonds and interactions. Only a few studies have explored what caregivers can do to meet parents' needs in relation to these interactions and help optimize them. This study sought to explore parents' perception of these first interactions and to identify the actions of caregivers that help or hinder its development. Methods Prospective study, qualitative discourse analysis of 60 face-to-face interviews conducted with 30 mothers and 30 fathers of infants born before 32 weeks of gestation (mean ± SD: 27 ± 2 weeks of gestational age, during their child's stay in one out of three NICUs in France. Interviews explored parental experience, from before birth up to the first month of life. Results Data analysis uncovered two main themes, which were independent of parents' geographical or cultural origin but differed between mothers and fathers. First, fathers described the bond with their child as composed more of words and looks and involving distance, while mothers experienced the bond more physically. Secondly, two aspects of the caregivers' influence were decisive: nurses' caring attitude towards baby and parents, and their communication with parents, which reduced stress and made interactions with the baby possible. This communication appeared to be the locus of a supportive and fulfilling encounter between parents and caregivers that reinforced parents' perception of a developing bond. Conclusions At birth and during the first weeks in the NICU, the creation of a bond between mothers and fathers and their premature baby is rooted in their relationship with the caregivers. Nurses' caring attitude and regular communication adapted to specific needs are perceived by parents as necessary preconditions for parents' interaction and development of a bond with their baby. These results might allow NICU staff to

  15. Wire-shaped perovskite solar cell based on TiO2 nanotubes

    Science.gov (United States)

    Wang, Xiaoyan; Kulkarni, Sneha A.; Li, Zhen; Xu, Wenjing; Batabyal, Sudip K.; Zhang, Sam; Cao, Anyuan; Wong, Lydia Helena

    2016-05-01

    In this work, a wire-shaped perovskite solar cell based on TiO2 nanotube (TNT) arrays is demonstrated for the first time by integrating a perovskite absorber on TNT-coated Ti wire. Anodization was adopted for the conformal growth of TNTs on Ti wire, together with the simultaneous formation of a compact TiO2 layer. A sequential step dipping process is employed to produce a uniform and compact perovskite layer on top of TNTs with conformal coverage as the efficient light absorber. Transparent carbon nanotube film is wrapped around Ti wire as the hole collector and counter electrode. The integrated perovskite solar cell wire by facile fabrication approaches shows a promising future in portable and wearable textile electronics.

  16. Signal analysis approach to ultrasonic evaluation of diffusion bond quality

    International Nuclear Information System (INIS)

    Thomas, Graham; Chinn, Diane

    1999-01-01

    Solid state bonds like the diffusion bond are attractive techniques for joining dissimilar materials since they are not prone to the defects that occur with fusion welding. Ultrasonic methods can detect the presence of totally unbonded regions but have difficulty sensing poor bonded areas where the substrates are in intimate contact. Standard ultrasonic imaging is based on amplitude changes in the signal reflected from the bond interface. Unfortunately, amplitude alone is not sensitive to bond quality. We demonstrated that there is additional information in the ultrasonic signal that correlates with bond quality. In our approach, we interrogated a set of dissimilar diffusion bonded samples with broad band ultrasonic signals. The signals were digitally processed and the characteristics of the signals that corresponded to bond quality were determined. These characteristics or features were processed with pattern recognition algorithms to produce predictions of bond quality. The predicted bond quality was then compared with the destructive measurement to assess the classification capability of the ultrasonic technique

  17. A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength

    International Nuclear Information System (INIS)

    Yin, Zhifu; Zou, Helin; Sun, Lei; Xu, Shenbo; Qi, Liping

    2015-01-01

    Plastic planar nanofluidic chips are becoming increasingly important for biological and chemical applications. However, the majority of the present bonding methods for planar nanofluidic chips suffer from high dimension loss and low bonding strength. In this work, a novel thermal bonding technique based on O 2 plasma and ethanol treatment was proposed. With the assistance of O 2 plasma and ethanol, the PET (polyethylene terephthalate) planar nanofluidic chip can be bonded at a low bonding temperature of 50 °C. To increase the bonding rate and bonding strength, the O 2 plasma parameters and thermal bonding parameters were optimized during the bonding process. The tensile test indicates that the bonding strength of the PET planar nanofluidic chip can reach 0.954 MPa, while the auto-fluorescence test demonstrates that there is no leakage or blockage in any of the bonded micro- or nanochannels. (paper)

  18. A Vibrating Wire System For Quadrupole Fiducialization

    Energy Technology Data Exchange (ETDEWEB)

    Wolf, Zachary

    2010-12-13

    A vibrating wire system is being developed to fiducialize the quadrupoles between undulator segments in the LCLS. This note provides a detailed analysis of the system. The LCLS will have quadrupoles between the undulator segments to keep the electron beam focused. If the quadrupoles are not centered on the beam axis, the beam will receive transverse kicks, causing it to deviate from the undulator axis. Beam based alignment will be used to move the quadrupoles onto a straight line, but an initial, conventional alignment must place the quadrupole centers on a straight line to 100 {micro}m. In the fiducialization step of the initial alignment, the position of the center of the quadrupole is measured relative to tooling balls on the outside of the quadrupole. The alignment crews then use the tooling balls to place the magnet in the tunnel. The required error on the location of the quadrupole center relative to the tooling balls must be less than 25 {micro}m. In this note, we analyze a system under construction for the quadrupole fiducialization. The system uses the vibrating wire technique to position a wire onto the quadrupole magnetic axis. The wire position is then related to tooling balls using wire position detectors. The tooling balls on the wire position detectors are finally related to tooling balls on the quadrupole to perform the fiducialization. The total 25 {micro}m fiducialization error must be divided between these three steps. The wire must be positioned onto the quadrupole magnetic axis to within 10 {micro}m, the wire position must be measured relative to tooling balls on the wire position detectors to within 15 {micro}m, and tooling balls on the wire position detectors must be related to tooling balls on the quadrupole to within 10 {micro}m. The techniques used in these three steps will be discussed. The note begins by discussing various quadrupole fiducialization techniques used in the past and discusses why the vibrating wire technique is our method

  19. Role of thermal spray processing method on the microstructure, residual stress and properties of coatings:an integrated study for Ni-5wt.% Al bond coats

    Czech Academy of Sciences Publication Activity Database

    Sampath, S.; Jiang, X.; Matějíček, Jiří; Prchlík, L.; Kulkarni, A.; Vaidya, A.

    2004-01-01

    Roč. 364, 1-2 (2004), s. 216-231 ISSN 0921-5093 Grant - others:NSF(US) DMR9632570 Institutional research plan: CEZ:AV0Z2043910 Keywords : bond coats, thermal spraying, microstructure Subject RIV: JG - Metallurgy Impact factor: 1.445, year: 2004

  20. Development of Ti-sheathed MgB2 wires with high critical current density

    International Nuclear Information System (INIS)

    Liang, G; Fang, H; Hanna, M; Yen, F; Lv, B; Alessandrini, M; Keith, S; Hoyt, C; Tang, Z; Salama, K

    2006-01-01

    Working towards developing lightweight superconducting magnets for future space and other applications, we have successfully fabricated mono-core Ti-sheathed MgB 2 wires by the powder-in-tube method. The wires were characterized by magnetization, electrical resistivity, x-ray diffraction, scanning electron microscopy, and energy dispersive spectrometry measurements. The results indicate that the Ti sheath does not react with the magnesium and boron, and the present wire rolling process can produce MgB 2 wires with a superconducting volume fraction of at least 64% in the core. Using the Bean model, it was found that at 5 K, the magnetic critical current densities, J c , measured in magnetic fields of 0, 5, and 8 T are about 4.2 x 10 5 , 3.6 x 10 4 , and 1.4 x 10 4 A cm -2 , respectively. At 20 K and 0 T, the magnetic J c is about 2.4 x 10 5 A cm -2 . These results show that at zero and low fields, the values of the magnetic J c for Ti-sheathed MgB 2 wires are comparable with the best results available for the Fe-sheathed MgB 2 wires. At high fields, however, the J c for Ti-sheathed MgB 2 wires appears higher than that for the Fe-sheathed MgB 2 wires

  1. Investigation of surface treatment of conductive wire in cylindrical atmospheric pressure plasmas

    International Nuclear Information System (INIS)

    Ye Rubin; Kagohashi, Tsutomu; Zheng Wei

    2009-01-01

    Polyethylene insulated electric wire was treated in He and Ar dielectric barrier discharge atmospheric pressure plasmas generated in a quartz tube wound with tubular electrodes. The wire was put penetrating through the high voltage and the grounded electrodes, improving the discharge and facilitating uniform surface treatment. In this work, the influences of conductivity of the wire on the effects of surface treatment and discharge behavior were investigated. Surface properties of the wire samples were analyzed by means of surface energy measurement and X-ray photoelectron spectroscopy. In order to reveal the mechanism for treating the conductive wire, I-V discharge waveforms were measured and time-resolved plasma images were taken. It was demonstrated that the conductive wire was involved in the discharge process, reducing the breakdown voltage significantly and enhancing the discharge. It shows that the discharge mode was strongly dependent on the conductivity of a wire. Intensive surface discharges developed along the conductive wire were found to be mainly responsible for noticeable improvement in the treatment effect.

  2. Simulating the Wire Compensation of LHC Long-Range Beam-beam Effects.

    CERN Document Server

    Rijoff, T

    2012-01-01

    The performance of the Large Hadron Collider (LHC) and its minimum crossing angle are limited by long-range beam-beam collisions. Wire compensators can mitigate part of the long-range effects. We perform simulations to explore the efficiency of the compensation at possible wire locations by examining the tune footprint and the dynamic aperture. Starting from the weak-strong simulation code BBTrack we developed a new Lyapunov calculation tool, which seems to better diagnose regular or chaotic particle behavior. We also developed faster ways to execute the simulation and the post-processing. These modifications have allowed us to study different wire positions (longitudinal and transverse), varying wire currents, several wire shapes, and a range of beam-beam crossing angles, in view of a prototype wire installation in the LHC foreseen for 2014/15. Our simulations demonstrate that the wire can provide a good compensation, including for reduced crossing angle. Among the benefits of an LHC wire compensator are a b...

  3. Pressureless Bonding Using Sputtered Ag Thin Films

    Science.gov (United States)

    Oh, Chulmin; Nagao, Shijo; Suganuma, Katsuaki

    2014-12-01

    To improve the performance and reliability of power electronic devices, particularly those built around next-generation wide-bandgap semiconductors such as SiC and GaN, the bonding method used for packaging must change from soldering to solderless technology. Because traditional solders are problematic in the harsh operating conditions expected for emerging high-temperature power devices, we propose a new bonding method in this paper, namely a pressureless, low-temperature bonding process in air, using abnormal grain growth on sputtered Ag thin films to realize extremely high temperature resistance. To investigate the mechanisms of this bonding process, we characterized the microstructural changes in the Ag films over various bonding temperatures and times. We measured the bonding properties of the specimens by a die-shear strength test, as well as by x-ray diffraction measurements of the residual stress in the Ag films to show how the microstructural developments were essential to the bonding technology. Sound bonds with high die strength can be achieved only with abnormal grain growth at optimum bonding temperature and time. Pressureless bonding allows for production of reliable high-temperature power devices for a wide variety of industrial, energy, and environmental applications.

  4. Electro-mechanics of drift tube wires

    International Nuclear Information System (INIS)

    Milburn, R.H.

    1997-01-01

    The position and stability of the sense wires in very long drift tubes are affected by both gravitational and electrostatic forces, as well as by the wire tension. For a tube to be used as an element of a high-resolution detector all these forces and their effects must be understood in appropriately precise detail. In addition, the quality control procedures applied during manufacture and detector installation must be adequate to ensure that the internal wire positions remain within tolerances. It may be instructive to practitioners to review the simple theory of a taut wire in the presence of anisotropic gravitational and electrostatic fields to illustrate the conditions for stability, the equilibrium wire displacement from straightness, and the effect of the fields on the mechanical vibration frequencies. These last may be used to monitor the wire configuration externally. A number of practical formulae result and these are applied to illustrative examples. (orig.)

  5. Electromagnetic Behaviour of Metallic Wire Structures

    CERN Document Server

    Chui, S T

    2013-01-01

    Despite the recent development and interest in the photonics of metallic wire structures, the relatively simple concepts and physics often remain obscured or poorly explained to those who do not specialize in the field. Electromagnetic Behaviour of Metallic Wire Structures provides a clear and coherent guide to understanding these phenomena without excessive numerical calculations.   Including both background material and detailed derivations of the various different formulae applied, Electromagnetic Behaviour of Metallic Wire Structures describes how to extend basic circuit theory relating to voltages, currents, and resistances of metallic wire networks to include situations where the currents are no longer spatially uniform along the wire. This lays a foundation for a deeper understanding of the many new phenomena observed in meta-electromagnetic materials.   Examples of applications are included to support this new approach making Electromagnetic Behaviour of Metallic Wire Structures a comprehensive and ...

  6. Phosphorus in antique iron music wire.

    Science.gov (United States)

    Goodway, M

    1987-05-22

    Harpsichords and other wire-strung musical instruments were made with longer strings about the beginning of the 17th century. This change required stronger music wire. Although these changes coincided with the introduction of the first mass-produced steel (iron alloyed with carbon), carbon was not found in samples of antique iron harpsichord wire. The wire contained an amount of phosphorus sufficient to have impeded its conversion to steel, and may have been drawn from iron rejected for this purpose. The method used to select pig iron for wire drawing ensured the highest possible phosphorus content at a time when its presence in iron was unsuspected. Phosphorus as an alloying element has had the reputation for making steel brittle when worked cold. Nevertheless, in replicating the antique wire, it was found that lowcarbon iron that contained 0.16 percent phosphorus was easily drawn to appropriate gauges and strengths for restringing antique harpsichords.

  7. Stress-strain effects on powder-in-tube MgB2 tapes and wires

    International Nuclear Information System (INIS)

    Katagiri, Kazumune; Takaya, Ryuya; Kasaba, Koichi; Tachikawa, Kyoji; Yamada, Yutaka; Shimura, Satoshi; Koshizuka, Naoki; Watanabe, Kazuo

    2005-01-01

    The effects of stress-strain on the critical current, I c , of ex situ powder-in-tube (PIT)-processed Ni-sheathed MgB 2 tapes and round wires as well as in situ PIT-processed Cu-sheathed wires at 4.2 K in a magnetic field up to 5 T have been studied. The effect of In powder addition on the Ni-sheathed MgB 2 wire was not so clear compared with that in the tape, in which the irreversible strain, ε irr , for the I c degradation onset increases significantly by the addition. This is attributed to the difference in the microstructure of the core associated with cold workings. A peak and gradual degradation behaviour of I c with strain beyond ε irr was found in the wire, whereas no evident peak and a steep degradation behaviour was found in the tape. As a possible reason, the difference in the triaxial residual stress state at 4.2 K due to the difference in geometry of the cross-section is suspected. The transverse compression tests revealed that I c of the wire did not degrade up to 270 MPa. Again, the effect of In addition was minimal. The Young's modulus of MgB 2 , 31-41 GPa, at room temperature was estimated by a tensile test of Cu sheath wire using a high-accuracy extensometer and the law of mixtures. The tensile strain dependence of I c in the Cu sheath wire was similar to that in the Ni-sheathed wire, ε irr being 0.4%. However, the stress corresponding to ε irr , 50 MPa, was about 1/10 of that for the Ni-sheath wire and the irreversible transverse compressive stress, 150 MPa, was also lower. The effect of bending strain on the I c in Cu-sheathed wire was compared with that of the tensile strain

  8. Wire Position Monitoring with FPGA based Electronics

    International Nuclear Information System (INIS)

    Eddy, N.; Lysenko, O.

    2009-01-01

    This fall the first Tesla-style cryomodule cooldown test is being performed at Fermilab. Instrumentation department is preparing the electronics to handle the data from a set of wire position monitors (WPMs). For simulation purposes a prototype pipe with a WMP has been developed and built. The system is based on the measurement of signals induced in pickups by 320 MHz signal carried by a wire through the WPM. The wire is stretched along the pipe with a tensioning load of 9.07 kg. The WPM consists of four 50 (Omega) striplines spaced 90 o apart. FPGA based digitizer scans the WPM and transmits the data to a PC via VME interface. The data acquisition is based on the PC running LabView. In order to increase the accuracy and convenience of the measurements some modifications were required. The first is implementation of an average and decimation filter algorithm in the integrator operation in the FPGA. The second is the development of alternative tool for WPM measurements in the PC. The paper describes how these modifications were performed and test results of a new design. The last cryomodule generation has a single chain of seven WPMs (placed in critical positions: at each end, at the three posts and between the posts) to monitor a cold mass displacement during cooldown. The system was developed in Italy in collaboration with DESY. Similar developments have taken place at Fermilab in the frame of cryomodules construction for SCRF research. This fall preliminary cryomodule cooldown test is being performed. In order to prepare an appropriate electronic system for the test a prototype pipe with a WMP has been developed and built, figure 1. The system is based on the measurement of signals induced in pickups by 320 MHz signal carried by a wire through the WPM. The 0.5 mm diameter Cu wire is stretched along the pipe with a tensioning load of 9.07 kg and has a length of 1.1 m. The WPM consists of four 50 (Omega) striplines spaced 90 o apart. An FPGA based digitizer

  9. Steer-by-wire system for the Motor-Kart vehicle of FH Cologne University; Steer-by-Wire-Lenkung fuer den Motor-Kart der FH Koeln

    Energy Technology Data Exchange (ETDEWEB)

    Baum, H. [Fluidon GmbH, Aachen (Germany); Ulrich, H. [FH Koeln (Germany). Inst. fuer Fahrzeugtechnik; Hermanns, O. [LMS Deutschland GmbH, Kaiserslautern (Germany)

    2005-12-01

    In the course of semester projects, students of FH Cologne, Institute of Motor Car Engineering, get their first experience with the increasingly complex development processes of modern vehicle systems. Using the example of a steer-by-wire system, the contribution outlines the steps taken by the students. One of the key elements of the project was the development of the steer-by-wire control by coupling the control unit to the detailed simulation model of the Motor-Kart vehicle. (orig.)

  10. THE MAIN CHARACTERISTICS OF LUBRICATION FOR WIRE DRAWING FOR METAL CORD, THEIR INFLUENCE ON DRAWING QUALITY

    Directory of Open Access Journals (Sweden)

    A. A. Truhanovich

    2008-01-01

    Full Text Available The physical-chemical characteristics of lubrications for dry wiredrawing are examined. The connection of some parameters with quality of both the drawing process and finished wire is shown.

  11. Radiofrequency Wire Recanalization of Chronically Thrombosed TIPS

    Energy Technology Data Exchange (ETDEWEB)

    Majdalany, Bill S., E-mail: bmajdala@med.umich.edu [University of Michigan Health System, Division of Interventional Radiology, Department of Radiology (United States); Elliott, Eric D., E-mail: eric.elliott@osumc.edu [The Ohio State University Wexner Medical Center, Division of Interventional Radiology, Department of Radiology (United States); Michaels, Anthony J., E-mail: Anthony.michaels@osumc.edu; Hanje, A. James, E-mail: James.Hanje@osumc.edu [The Ohio State University Wexner Medical Center, Division of Gastroenterology and Hepatology, Department of Medicine (United States); Saad, Wael E. A., E-mail: wsaad@med.umich.edu [University of Michigan Health System, Division of Interventional Radiology, Department of Radiology (United States)

    2016-07-15

    Radiofrequency (RF) guide wires have been applied to cardiac interventions, recanalization of central venous thromboses, and to cross biliary occlusions. Herein, the use of a RF wire technique to revise chronically occluded transjugular intrahepatic portosystemic shunts (TIPS) is described. In both cases, conventional TIPS revision techniques failed to revise the chronically thrombosed TIPS. RF wire recanalization was successfully performed through each of the chronically thrombosed TIPS, demonstrating initial safety and feasibility in this application.

  12. Magnetic properties of amorphous glass-covered wires

    International Nuclear Information System (INIS)

    Chiriac, H.; Ovari, T.-A.

    2002-01-01

    Magnetic properties of ferromagnetic amorphous glass-covered wires with positive, negative, and nearly zero magnetostriction are reviewed. It is shown that their peculiar magnetic characteristics originate during the specific preparation process through dimensions and induced internal stresses. The role of the magnetoelastic coupling on the domain structure formation and subsequently on the magnetization process is discussed, together with the tailoring possibilities of such magnetic materials

  13. Minimisation of the wire position uncertainties of the new CERN vacuum wire scanner

    CERN Document Server

    AUTHOR|(CDS)2069346; Barjau Condomines, A

    In the next years the luminosity of the LHC will be significantly increased. This will require a much higher accuracy of beam profile measurement than actually achievable by the current wire scanner. The new fast wire scanner is foreseen to measure small emittance beams throughout the LHC injector chain, which demands a wire travelling speed up to 20 ms-1 and position measurement accuracy of the order of a few microns. The vibrations of the mechanical parts of the system, and particularly the vibrations of the thin carbon wire, were identified as the major error sources of wire position uncertainty. Therefore the understanding of the wire vibrations is a high priority for the design and operation of the new device. This document presents the work performed to understand the main causes of the wire vibrations observed in one of the existing wire scanner and the new proposed design.

  14. Aircraft Wiring Support Equipment Integration Laboratory (AWSEIL)

    Data.gov (United States)

    Federal Laboratory Consortium — Purpose:The Aircraft Wiring Support Equipment Integration Laboratory (AWSEIL) provides a variety of research, design engineering and prototype fabrication services...

  15. submitter Dynamical Models of a Wire Scanner

    CERN Document Server

    Barjau, Ana; Dehning, Bernd

    2016-01-01

    The accuracy of the beam profile measurements achievable by the current wire scanners at CERN is limited by the vibrations of their mechanical parts. In particular, the vibrations of the carbon wire represent the major source of wire position uncertainty which limits the beam profile measurement accuracy. In the coming years, due to the Large Hadron Collider (LHC) luminosity upgrade, a wire traveling speed up to 20 $m s^{−1}$ and a position measurement accuracy of the order of 1 μm will be required. A new wire scanner design based on the understanding of the wire vibration origin is therefore needed. We present the models developed to understand the main causes of the wire vibrations observed in an existing wire scanner. The development and tuning of those models are based on measurements and tests performed on that CERN proton synchrotron (PS) scanner. The final model for the (wire + fork) system has six degrees-of-freedom (DOF). The wire equations contain three different excitation terms: inertia...

  16. Wavelet transform of signal for enhancement of SNR in wire rope inspection

    Science.gov (United States)

    Lunin, V.; Barat, V.

    2002-05-01

    In magnetic testing of steel wire rope the MFL signals of broken wires may be corrupted by background noise arising from the probe lift-off, vibration and white noise, resulting in unreliable detection and inaccurate characterization of rope weakness. In this paper, a signal processing technique is presented to reduce this background noise by the use of a wavelet transform. The results of processing signals from testing rope pieces show that proposed technique is effective for extracting defect signals.

  17. 47 CFR 76.804 - Disposition of home run wiring.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 4 2010-10-01 2010-10-01 false Disposition of home run wiring. 76.804 Section... MULTICHANNEL VIDEO AND CABLE TELEVISION SERVICE Cable Inside Wiring § 76.804 Disposition of home run wiring. (a) Building-by-building disposition of home run wiring. (1) Where an MVPD owns the home run wiring in an MDU...

  18. Intra-wire resistance and AC loss in multi-filamentary MgB2 wires

    NARCIS (Netherlands)

    Zhou, Chao; Offringa, Wietse; Bergen, Anne-Henriette; Wessel, Wilhelm A.J.; Krooshoop, Hendrikus J.G.; Dhalle, Marc M.J.; Sumption, M.D.; Collings, E.W.; Rindfleisch, M.; Tomsic, M.; ten Kate, Herman H.J.; Nijhuis, Arend

    2013-01-01

    Intra-wire resistance and AC loss of various multi-filamentary MgB2 wires with filaments surrounded by Nb barriers have been measured and analyzed. The intra-wire resistance is measured with a direct four-probe voltage–current method at various temperatures. The AC loss is acquired by both vibrating

  19. New technique for wiring SSC superconducting sextupole corrector coils

    International Nuclear Information System (INIS)

    Leon, B.

    1985-01-01

    There exists in the electronics industry, a technology for the manufacture of printed circuit (PC) boards which is directly transferable into the creation of highly controlled coils, such as the SSC sextupole superconducting corrector coils. This technology, which uses a process of laying down insulated wire in highly controlled patterns has heretofore been confined exclusively to the manufacture of high density printed circuit (PC) boards, possibly due to an ignorance of its utility in the field of precision winding of coils. This ability to fix wires in a well defined location can be used to produce precision wound coils in a very cost-effective manner. These coils may be superior in quality to conventionally made coils. Before describing what can be created with this technology, it is necessary to take a look at this coil winding process, the MULTIWIRE process, and the industry which has utilized this technology

  20. A new technique for wiring SSC superconducting sextupole corrector coils

    International Nuclear Information System (INIS)

    Leon, B.

    1985-01-01

    There exists in the electronics industry, a technology for the manufacture of printed circuit (PC) boards which is directly transferable into the creation of highly controlled coils, such as the SSC sextupole superconducting corrector coils. This technology, which uses a process of laying down insulated wire in highly controlled patterns, has heretofore been confined excusively to the manufacture of high density printed circuit (PC) boards, possibly due to an ignorance of its utility in the field of precision winding of coils. This ability to fix wires in a well defined location can be used to produce precision wound coils in a very cost-effective manner. These coils may be superior in quality to conventionally made coils. Before describing what can be created with this technology, it is necessary to take a look at this coil winding process, the MULTIWIRE process, and the industry which has utilized this technology

  1. Progress in second-generation HTS wire development and manufacturing

    International Nuclear Information System (INIS)

    Selvamanickam, V.; Chen, Y.; Xiong, X.; Xie, Y.; Zhang, X.; Rar, A.; Martchevskii, M.; Schmidt, R.; Lenseth, K.; Herrin, J.

    2008-01-01

    2007 has marked yet another year of continued rapid progress in developing and manufacturing high-performance, long-length second-generation (2G) HTS wires at high speeds. Using ion beam assisted deposition (IBAD) MgO and associated buffer sputtering processes, SuperPower has now exceeded piece lengths of 1000 m of fully buffered tape reproducibly with excellent in-plane texture of 6-7 degrees and uniformity of about 2%. These kilometer lengths are produced at high speeds of about 350 m/h of 4 mm wide tape. In combination with metal organic chemical vapor deposition (MOCVD), 2G wires up to single piece lengths to 790 m with a minimum critical current value of 190 A/cm corresponding to a Critical current x Length performance of 150,100 Am have been achieved. Tape speeds up to 180 m/h have been reached MOCVD while maintaining critical currents above 200 A/cm in 100+ m lengths. Thick film MOCVD technology has been transitioned to Pilot manufacturing system where a minimum critical current of 320 A/cm has been demonstrated over a length of 155 m processed at a speed of 70 m/h in 4 mm width. Finally, nearly 10,000 m of 2G wire has been produced, exhaustively tested, and delivered to the Albany Cable project. The average minimum critical current of the wire delivered in 225 segments of 43-44 m is 70 A in 4 mm widths. A 30 m cable has been fabricated with this wire by Sumitomo Electric and has been installed in the power grid of National Grid in downtown Albany and is the world's first 2G device installed in the grid

  2. Progress in second-generation HTS wire development and manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Selvamanickam, V. [SuperPower, Inc., 450 Duane Avenue, Schenectady, NY 12304 (United States)], E-mail: vselva@superpower-inc.com; Chen, Y.; Xiong, X.; Xie, Y.; Zhang, X.; Rar, A.; Martchevskii, M.; Schmidt, R.; Lenseth, K.; Herrin, J. [SuperPower, Inc., 450 Duane Avenue, Schenectady, NY 12304 (United States)

    2008-09-15

    2007 has marked yet another year of continued rapid progress in developing and manufacturing high-performance, long-length second-generation (2G) HTS wires at high speeds. Using ion beam assisted deposition (IBAD) MgO and associated buffer sputtering processes, SuperPower has now exceeded piece lengths of 1000 m of fully buffered tape reproducibly with excellent in-plane texture of 6-7 degrees and uniformity of about 2%. These kilometer lengths are produced at high speeds of about 350 m/h of 4 mm wide tape. In combination with metal organic chemical vapor deposition (MOCVD), 2G wires up to single piece lengths to 790 m with a minimum critical current value of 190 A/cm corresponding to a Critical current x Length performance of 150,100 Am have been achieved. Tape speeds up to 180 m/h have been reached MOCVD while maintaining critical currents above 200 A/cm in 100+ m lengths. Thick film MOCVD technology has been transitioned to Pilot manufacturing system where a minimum critical current of 320 A/cm has been demonstrated over a length of 155 m processed at a speed of 70 m/h in 4 mm width. Finally, nearly 10,000 m of 2G wire has been produced, exhaustively tested, and delivered to the Albany Cable project. The average minimum critical current of the wire delivered in 225 segments of 43-44 m is 70 A in 4 mm widths. A 30 m cable has been fabricated with this wire by Sumitomo Electric and has been installed in the power grid of National Grid in downtown Albany and is the world's first 2G device installed in the grid.

  3. Australia's Bond Home Bias

    OpenAIRE

    Anil V. Mishra; Umaru B. Conteh

    2014-01-01

    This paper constructs the float adjusted measure of home bias and explores the determinants of bond home bias by employing the International Monetary Fund's high quality dataset (2001 to 2009) on cross-border bond investment. The paper finds that Australian investors' prefer investing in countries with higher economic development and more developed bond markets. Exchange rate volatility appears to be an impediment for cross-border bond investment. Investors prefer investing in countries with ...

  4. Progress on MOD/RABiTSTM 2G HTS wire

    International Nuclear Information System (INIS)

    Rupich, M.W.; Zhang, W.; Li, X.; Kodenkandath, T.; Verebelyi, D.T.; Schoop, U.; Thieme, C.; Teplitsky, M.; Lynch, J.; Nguyen, N.; Siegal, E.; Scudiere, J.; Maroni, V.; Venkataraman, K.; Miller, D.; Holesinger, T.G.

    2004-01-01

    The development of the second generation (2G) high temperature superconducting wire has advanced beyond initial laboratory demonstrations and is now focused on developing and testing high critical current conductor designs required for commercial applications. The approach pursued at American Superconductor for 2G wire manufacturing is based on the combination of the RABiTS TM substrate-buffer technology with metal organic deposition (MOD) of the YBCO layer. This MOD/RABiTS TM approach has been demonstrated in 10 m lengths with critical currents of up to 184 A/cm-width (∼2.3 MA/cm 2 ) and in short length with critical currents of up to 270 A/cm-width (∼3.4 MA/cm 2 ). In addition to a high critical current, the superconducting wire must also meet stringent mechanical and electrical stability requirements that vary by application. Commercially viable architectures designed to meet these specifications have been fabricated and tested. Wires manufactured by this process have been successfully tested in prototype cable and coil applications

  5. Catalytic constructive deoxygenation of lignin-derived phenols: new C-C bond formation processes from imidazole-sulfonates and ether cleavage reactions.

    Science.gov (United States)

    Leckie, Stuart M; Harkness, Gavin J; Clarke, Matthew L

    2014-10-09

    As part of a programme aimed at exploiting lignin as a chemical feedstock for less oxygenated fine chemicals, several catalytic C-C bond forming reactions utilising guaiacol imidazole sulfonate are demonstrated. These include the cross-coupling of a Grignard, a non-toxic cyanide source, a benzoxazole, and nitromethane. A modified Meyers reaction is used to accomplish a second constructive deoxygenation on a benzoxazole functionalised anisole.

  6. Weld bonding of stainless steel

    DEFF Research Database (Denmark)

    Santos, I. O.; Zhang, Wenqi; Goncalves, V.M.

    2004-01-01

    This paper presents a comprehensive theoretical and experimental investigation of the weld bonding process with the purpose of evaluating its relative performance in case of joining stainless steel parts, against alternative solutions based on structural adhesives or conventional spot-welding. Th...

  7. Solid-state Bonding of Superplastic Aluminum Alloy 7475 Sheet

    Science.gov (United States)

    Byun, T. D. S.; Vastava, R. B.

    1985-01-01

    Experimental works were carried out to study the feasibility of solid state bonding of superplastic aluminum 7475 sheet. Amount of deformation, bonding time, surface cleaning method and intermediate layer were the process parameters investigated. Other parameters, held constant by the superplastic forming condition which is required to obtain a concurrent solid state bonding, are bonding temperature, bonding pressure and atmosphere. Bond integrity was evaluated through metallographic examination, X-ray line scan analysis, SEM fractographic analysis and lap shear tests. The early results of the development program indicated that sound solid state bonding was accomplished for this high strength 7475 alloy with significant amounts of deformation. A thin intermediate layer of the soft 5052 aluminum alloy aided in achieving a solid state bonding by reducing the required amount of plastic deformation at the interface. Bond strength was substantially increased by a post bond heat treatment.

  8. High Temperature Life Testing of 80Ni-20Cr Wire in a Simulated Mars Atmosphere for the Sample Analysis at Mars (SAM) Instrument Suite Gas Processing System (GPS) Carbon Dioxide Scrubber

    Science.gov (United States)

    Hoffman, Christopher; Munoz, Bruno; Gundersen, Cynthia; Thomas, Walter, III; Stephenson, Timothy

    2008-01-01

    In support of the GPS for the SAM instrument suite built by NASA/GSFC, a life test facility was developed to test the suitability of 80Ni-20Cr alloy wire, 0.0142 cm diameter, for use as a heater element for the carbon dioxide scrubber. The element would be required to operate at 1000 C in order to attain the 800 C required for regeneration of the getter. The element also would need to operate in the Mars atmosphere, which consists mostly of CO2 at pressures between 4 and 12 torr. Data on the high temperature degradation mechanism of 80Ni- 20Cr in low pressure CO2, coupled with the effects of thermal cycling, were unknown. In addition, the influence of work hardening of the wire during assembly and the potential for catastrophic grain growth also were unknown. Verification of the element reliability as defined by the mission goals required the construction of a test facility that would accurately simulate the duty cycles in a simulated Mars atmosphere. The experimental set-up, along with the test protocol and results will be described.

  9. Formation quality optimization of laser hot wire cladding for repairing martensite precipitation hardening stainless steel

    Science.gov (United States)

    Wen, Peng; Feng, Zhenhua; Zheng, Shiqing

    2015-01-01

    Laser cladding is an advantaged repairing technology due to its low heat input and high flexibility. With preheating wire by resistance heat, laser hot wire cladding shows better process stability and higher deposition efficiency compared to laser cold wire/powder cladding. Multi-pass layer were cladded on the surface of martensite precipitation hardening stainless steel FV520B by fiber laser with ER410NiMo wire. Wire feed rate and preheat current were optimized to obtain stable wire transfer, which guaranteed good formation quality of single pass cladding. Response surface methodology (RSM) was used to optimize processing parameters and predict formation quality of multi-pass cladding. Laser power P, scanning speed Vs, wire feed rate Vf and overlap ratio η were selected as the input variables, while flatness ratio, dilution and incomplete fusion value as the responses. Optimal clad layer with flat surface, low dilution and no incomplete fusion was obtained by appropriately reducing Vf, and increasing P, Vs and η. No defect like pore or crack was found. The tensile strength and impact toughness of the clad layer is respectively 96% and 86% of those of the substrate. The clad layer showed nonuniform microstructure and was divided into quenched areas with coarse lath martensite and tempered areas with tempered martensite due to different thermal cycles in adjacent areas. The tempered areas showed similar hardness to the substrate.

  10. Chemical bond fundamental aspects of chemical bonding

    CERN Document Server

    Frenking, Gernot

    2014-01-01

    This is the perfect complement to ""Chemical Bonding - Across the Periodic Table"" by the same editors, who are two of the top scientists working on this topic, each with extensive experience and important connections within the community. The resulting book is a unique overview of the different approaches used for describing a chemical bond, including molecular-orbital based, valence-bond based, ELF, AIM and density-functional based methods. It takes into account the many developments that have taken place in the field over the past few decades due to the rapid advances in quantum chemica

  11. Zinc and resin bonded NdFeB magnets

    International Nuclear Information System (INIS)

    Leonowicz, M.; Kaszuwara, W.

    2002-01-01

    Zinc and resin bonded NdFeB magnets were processed. Basic magnetic parameters as well as compressive strength were evaluated versus annealing temperature and volume fraction of the bonding agent. For the zinc bonded magnets phase composition was investigated. The additional NdZn 5 phase was found in the Zn bonded magnets after annealing. Comparison of the Zn and resin bonded magnets reveals higher remanence for the former and higher coercivity for the latter. For the Zn and resin bonded magnets, 15 wt.% Zn / 370 o C and 7-10 wt.% resin were chosen as the optimal processing parameters. (author)

  12. Construction of C(sp2)-X (X = Br, Cl) Bonds through a Copper-Catalyzed Atom-Transfer Radical Process: Application for the 1,4-Difunctionalization of Isoquinolinium Salts.

    Science.gov (United States)

    Sun, Qiu; Zhang, Yuan-Yuan; Sun, Jing; Han, Ying; Jia, Xiaodong; Yan, Chao-Guo

    2018-02-16

    A highly efficient Cu-catalyzed 1,4-difunctionalization of isoquinolinium salts was developed with ether and X - (X = Br, Cl) as the halogen source under mild conditions. This transformation involves the combination of oxidative coupling and copper-catalyzed halogen atom-transfer radical processes. This method not only provides an efficient way to prepare various substituted azaarenes but also achieves the selective construction of C(sp 2 )-X (X = Br, Cl) bonds from a halogen anion and nucleophilic carbon atom via a free-radical process.

  13. Nondestructive testing of thermocompression bonds. Final report

    International Nuclear Information System (INIS)

    Hale, G.M.

    1981-02-01

    A Scanning Laser Acoustic Microscope (SLAM) was used to characterize hybrid microcircuit beam lead bonds formed on thin film networks by a thermocompression process. Results from subsequent pull testing show that the SLAM offered no significant advantage over visual inspection for detecting bad bonds. Infrared microscopy and resistance measurements were also reviewed and rejected as being ineffective inspection methods

  14. Diffusion bonding from antiquity to present times

    CERN Document Server

    Mathot, S

    2004-01-01

    This paper describes attempts made to improve diffusion bonding procedures based on antique processes as granulation and filigree. Two modern procedures implying diffusion of cadmium and silicon respectively are reported. The results obtained with PIXE and NRA using nuclear microprobe are discussed. This paper concludes with a comparison of these bonding techniques and some other modern methods with the antique procedures.

  15. Multicellular computing using conjugation for wiring.

    Science.gov (United States)

    Goñi-Moreno, Angel; Amos, Martyn; de la Cruz, Fernando

    2013-01-01

    Recent efforts in synthetic biology have focussed on the implementation of logical functions within living cells. One aim is to facilitate both internal "re-programming" and external control of cells, with potential applications in a wide range of domains. However, fundamental limitations on the degree to which single cells may be re-engineered have led to a growth of interest in multicellular systems, in which a "computation" is distributed over a number of different cell types, in a manner analogous to modern computer networks. Within this model, individual cell type perform specific sub-tasks, the results of which are then communicated to other cell types for further processing. The manner in which outputs are communicated is therefore of great significance to the overall success of such a scheme. Previous experiments in distributed cellular computation have used global communication schemes, such as quorum sensing (QS), to implement the "wiring" between cell types. While useful, this method lacks specificity, and limits the amount of information that may be transferred at any one time. We propose an alternative scheme, based on specific cell-cell conjugation. This mechanism allows for the direct transfer of genetic information between bacteria, via circular DNA strands known as plasmids. We design a multi-cellular population that is able to compute, in a distributed fashion, a Boolean XOR function. Through this, we describe a general scheme for distributed logic that works by mixing different strains in a single population; this constitutes an important advantage of our novel approach. Importantly, the amount of genetic information exchanged through conjugation is significantly higher than the amount possible through QS-based communication. We provide full computational modelling and simulation results, using deterministic, stochastic and spatially-explicit methods. These simulations explore the behaviour of one possible conjugation-wired cellular computing

  16. Long-Wearing Wire Guide For Welding Torch

    Science.gov (United States)

    Gutow, David A.; Burley, Richard K.; Gilbert, Jeffrey L.; Fogel, Irving

    1992-01-01

    Insert for wire-guide tube on tungsten/inert-gas welding apparatus extends life of guide tube and increases accuracy of weld. Hardened insert resists wear by sliding tungsten wire. Chamfer guides wire into insert.

  17. 29 CFR 1919.79 - Wire rope.

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 7 2010-07-01 2010-07-01 false Wire rope. 1919.79 Section 1919.79 Labor Regulations Relating to Labor (Continued) OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR (CONTINUED... recommended by the equipment or the wire rope manufacturer due to actual working condition requirements. In...

  18. Automatic inspection of railway overhead wires

    NARCIS (Netherlands)

    Smorenburg, C.; Valkenburg, A.L.G. van

    1988-01-01

    For the Netherlands railway company a system for inspection of the degree of wear of the contact wires is being developed. With an active sensor the reflective under-surface of the overhead wire is illuminated with a laserbeam and reflected radiation is detected by fast CCD detectors. With the

  19. Wire compensation: Performance, SPS MDs, pulsed system

    CERN Document Server

    Dorda, U

    2008-01-01

    A wire compensation (BBLR) scheme has been proposed in order to improve the long range beam-beam performance of the nominal LHC and its phase 1 and phase 2 upgrades[1]. In this paper we present experimental experience of the CERN SPS wires (BBLR) and report on progress with the RF BBLR.

  20. WIRED magazine announces rave awards nominees

    CERN Multimedia

    2002-01-01

    WIRED Magazine has anounced the nominees for its fourth annual WIRED Rave Awards, celebrating innovation and the individuals transforming commerce and culture. Jeffrey Hangst of the University of Aarhus has been nominated in the science category, for his work on the ATHENA Experiment, CERN (1/2 page).

  1. Kirschner Wire Breakage during Removal Requiring Retrieval

    Directory of Open Access Journals (Sweden)

    Kai Yuen Wong

    2016-01-01

    Full Text Available Kirschner wires (K-wires are widely used for fixation of fractures and dislocations in the hand as they are readily available, reliable, and cost-effective. Complication rates of up to 18% have been reported. However, K-wire breakage during removal is rare. We present one such case illustrating a simple technique for retrieval. A 35-year-old male presented with a distal phalanx fracture of his right middle finger. This open fracture was treated with K-wire fixation. Postoperatively, he developed a pin site infection with associated finger swelling. The K-wire broke during removal with the proximal piece completely retained in his middle phalanx. To minimise risk of osteomyelitis, the K-wire was removed with a novel surgical technique. He had full return of hand function. Intraoperative K-wire breakage has a reported rate of 0.1%. In our case, there was no obvious cause of breakage and the patient denied postoperative trauma. On the other hand, pin site infections are much more common with reported rates of up to 7% in the hand or wrist. K-wire fixation is a simple method for bony stabilisation but can be a demanding procedure with complications often overlooked. It is important to be aware of the potential sequelae.

  2. Hot-wire anemometer for spirography.

    Science.gov (United States)

    Plakk, P; Liik, P; Kingisepp, P H

    1998-01-01

    The use of a constant temperature hot-wire anemometer flow sensor for spirography is reported. The construction, operating principles and calibration procedure of the apparatus are described, and temperature compensation method is discussed. Frequency response is studied. It is shown that this hot-wire flow transducer satisfies common demands with respect to accuracy, response time and temperature variations.

  3. Two-layer synchronized ternary quantum-dot cellular automata wire crossings

    Science.gov (United States)

    2012-01-01

    Quantum-dot cellular automata are an interesting nanoscale computing paradigm. The introduction of the ternary quantum-dot cell enabled ternary computing, and with the recent development of a ternary functionally complete set of elementary logic primitives and the ternary memorizing cell design of complex processing structures is becoming feasible. The specific nature of the ternary quantum-dot cell makes wire crossings one of the most problematic areas of ternary quantum-dot cellular automata circuit design. We hereby present a two-layer wire crossing that uses a specific clocking scheme, which ensures the crossed wires have the same effective delay. PMID:22507371

  4. Upgrading PABX Infra System and Wiring for Communication System in Selected Block

    International Nuclear Information System (INIS)

    Sahirudden Mohd Nor; Khairiah Yazid; Lojius Lombigit; Zainuddin Jaafar; Abd Aziz Mhd Ramli

    2015-01-01

    Infra phone system in Nuclear Malaysia has been operating since its inception. Infra phone system is used to enable the communications process run smoothly. There are two mains phone system which are mannex analog system in the main complex and MD110 systems in Dengkil complex. This system was responsibilities and monitored by Automation and Instrumentation Center, Technical Support Division. Infra phone system and its wiring in the main complexes have not been upgraded and there are a lot of faulty wiring. This phone system requires new wiring system with the addition of new buildings in Nuclear Malaysia. The system also requires new parts to ensure smooth communication system in future. (author)

  5. Influence of tensile stress and frequency on the longitudinal magnetic hysteresis of amorphous wires

    International Nuclear Information System (INIS)

    Torres, Carlos; Maria Munoz, Jose; Hernandez-Gomez, Pablo; Francisco, Carlos de

    2010-01-01

    This work studies the longitudinal magnetic hysteresis of amorphous wires with different Fe or Co compositions through an external magnetic field in the axial direction. Measurements have been carried out with the help of a digitally processed system in the 50 Hz-1 kHz frequency range. In addition, the influence of different tensile stresses has been also analyzed. The results show that both parameters change considerably the magnetic hysteresis of the wires but in a different way depending on their composition. This behaviour has been interpreted in terms of the different domain distribution associated with the opposite sign of the magnetostriction for Fe and Co-based wires, respectively.

  6. Guide Wire Entrapment during Central Venous Catheterization

    Directory of Open Access Journals (Sweden)

    Kyung Woo Kim

    2014-05-01

    Full Text Available We experienced a case of venous vessel wall entrapment between the introducer needle and the guide wire during an attempt to perform right internal jugular vein (IJV catheterization. The guide wire was introduced with no resistance but could not be withdrawn. We performed ultrasonography and C-arm fluoroscopy to confirm the entrapment location. We assumed the introducer needle penetrated the posterior vessel wall during the puncture and that only the guide wire entered the vein; an attempt to retract the wire pinched the vein wall between the needle tip and the guide wire. Careful examination with various diagnostic tools to determine the exact cause of entrapment is crucial for reducing catastrophic complications and achieving better outcomes during catheterization procedures.

  7. Modified tension band wiring technique for olecranon fractures: where and how should the K-wires be inserted to avoid articular penetration?

    Science.gov (United States)

    Özsoy, Mehmet Hakan; Kızılay, Onur; Günenç, Ceren; Özsoy, Arzu; Demiryürek, Deniz; Hayran, Mutlu; Erçakmak, Burcu; Sakaoğulları, Abdurrahman

    2015-01-01

    Articular penetration of K-wires is a possible complication of the modified tension band wiring technique. However, there is no clear information or evidence regarding the entry point or introduction angle for K-wires to avoid this complication. The aim of this experimental study was to evaluate the effect of varying K-wire insertion points and angles on the risk for articular penetration during modified tension band wiring for olecranon fractures. All anatomical measurements were made on 50 cadaveric ulnas, and all other measurements were performed on exact foam replications of the 50 cadaveric ulnas. Morphometric measurements, including olecranon height and heights of the central, radial and ulnar facets of the semilunar notch, were taken. In the sagittal plane, articular angle and tubercle angle were measured. Two 1.6-mm parallel K-wires were inserted from 0, 5 and 8 mm anterior to the dorsal cortex of the olecranon process at angles of 20° and 30°. K-wire articular penetration was evaluated both visually and radiographically. The mean central, radial and ulnar heights of the semilunar notch were 17.3 mm (14.7-20.0), 16.2 mm (12.0-21.0) and 15.8 mm (13.30-20.5), respectively. We observed no articular penetration at the 0-mm level at 20° and 30° (0 mm 20° and 0 mm 30°, respectively) or at 5 mm 20°. At 8 mm 30° wire introduction, more than 64% articular penetration was observed on either facet. The sequence from least to most likely to cause articular penetration was: 0 mm = 5 mm 20° > 5 mm 30° = 8 mm 20° > 8 mm 30°. The radial height of the semilunar notch was negatively correlated to the risk of articular penetration, when the wire was introduced at 8 mm 30°, 8 mm 20° and 5 mm 30° (all pwiring technique to prevent articular penetration, K-wires should be inserted in the first 5 mm from dorsal cortex of the olecranon process at a maximum angle of 20°. Moreover, if the wires are required to be inserted more anteriorly because of the anatomical

  8. The Installation for Fatigue and Destruction Tests of Thin Wires

    Directory of Open Access Journals (Sweden)

    D. V. Prosvirin

    2015-01-01

    Full Text Available The fatigue strength of high-strength materials such as wire is, essentially, dependent on the surface state, stress concentrators, non-metal inclusions, etc. Multifactorial process of damage accumulation and fracture under cyclic loading makes it difficult to predict the durability of structural materials. So fatigue tests, taking into account the operating conditions of stress exposure as much as possible, are of special importance.A feature of the wire fatigue tests is that it is complicated to secure the samples and create the alternate stresses. Currently, there is no equipment to study the fatigue strength of the wire in accordance with GOST 1579-93. Partly the problem of the wire fatigue tests was solved owing to using the installation developed in IMET RAS and considered as the base case. However, the installation has significant disadvantages, namely: a complicated for implementing in practice method to control stresses in the sample; an imperfect system to count cycles; an incapability to change the engine speed of the motor and thus, the frequency of loading.In developing the new design all the basic blocks of installation were upgraded such as drive unit; unit to control stress in the sample; unit for determining the number of cycles to failure.To change the stresses in the sample the paper offers to use the platform from polymethylmethacrylate with slotted curved channels of different radii. The stresses in the sample are dependent on the channel radius R, the wire diameter d and the modulus of elasticity E of the material and may vary in the range of 200 - 1200 MPa. The use of CNC machines in cutting the channels allows stress adjustment within ± 0,1 MPa.The developed design is used to drive the rotation of the wire and makes it possible to change the frequency of loading in the range of 0 - 100 Hz. It is shown that the use of the closing relay in drive design and the transition to an electronic system of determining the number of

  9. Comparative Evaluation of Tensile Bond Strength between Silicon Soft Liners and Processed Denture Base Resin Conditioned by Three Modes of Surface Treatment: An Invitro Study.

    Science.gov (United States)

    Surapaneni, Hemchand; Ariga, Padma; Haribabu, R; Ravi Shankar, Y; Kumar, V H C; Attili, Sirisha

    2013-09-01

    Soft denture liners act as a cushion for the denture bearing mucosa through even distribution of functional load, avoiding local stress concentrations and improving retention of dentures there by providing comfort to the patient. The objective of the present study was to compare and evaluate the tensile bond strengths of silicone-based soft lining materials (Ufi Gel P and GC Reline soft) with different surface pre treatments of heat cure PMMA denture base acrylic resin. Stainless steel dies measuring 40 mm in length; 10 mm in width and 10 mm in height (40 × 10 × 10) were machined to prepare standardized for the polymethyl methacrylate resin blocks. Stainless steel dies (spacer for resilient liner) measuring 3 mm thick; 10 mm long and 10 mm wide were prepared as spacers to ensure uniformity of the soft liner being tested. Two types of Addition silicone-based soft lining materials (room temperature polymerised soft lining materials (RTPSLM): Ufi Gel P and GC Reline soft) were selected. Ufi Gel P (VOCO, Germany), GC Reline soft (GC America) are resilient, chairside vinyl polysiloxane denture reliners of two different manufacturers. A total of 80 test samples were prepared of which 40 specimens were prepared for Group A (Ufi Gel P) and 40 specimens for Group B (GC Reline soft). In these groups, based on Pre-treatment of acrylic resin specimens each group was subdivided into four sub groups of 10 samples each. Sub-group I-without any surface treatment. Sub-group II-sand blasted Sub-group III-treated with Methyl Methacrylate monomer Sub-group IV-treated with chemical etchant Acetone. The results were statistically analysed by Kruscal Wallis test, Mann-Whitney U test, and Independent t test. The specimens treated with MMA monomer wetting showed superior and significant bond strength than those obtained by other surface treatments. The samples belonging to subgroups of GC Reline soft exhibit superior tensile bond strength than subgroups of Ufi Gel P. The modes

  10. Single wire drift chamber design

    Energy Technology Data Exchange (ETDEWEB)

    Krider, J.

    1987-03-30

    This report summarizes the design and prototype tests of single wire drift chambers to be used in Fermilab test beam lines. The goal is to build simple, reliable detectors which require a minimum of electronics. Spatial resolution should match the 300 ..mu..m rms resolution of the 1 mm proportional chambers that they will replace. The detectors will be used in beams with particle rates up to 20 KHz. Single track efficiency should be at least 99%. The first application will be in the MT beamline, which has been designed for calibration of CDF detectors. A set of four x-y modules will be used to track and measure the momentum of beam particles.

  11. One Step Preparation of Fe–FeO–Graphene Nanocomposite through Pulsed Wire Discharge

    Directory of Open Access Journals (Sweden)

    Xin Gao

    2018-02-01

    Full Text Available The Fe–FeO–graphene nanocomposite material was produced successfully by pulsed wire discharge in graphene oxide (GO suspension. Pure iron wires with a diameter of 0.25 mm and a length of 100 mm were used in the experiments. The discharge current and voltage were recorded to analyze the process of the pulsed wire discharge. The as-prepared samples—under different charging voltages—were recovered and characterized by X-ray diffraction (XRD, scanning electron microscopy (SEM, Raman spectroscopy, and transmission electron microscopy (TEM. Curved and loose graphene films that were anchored with spherical Fe and FeO nanoparticles were obtained at the charging voltage of 8–10 kV. The present study discusses the mechanism by which the Fe–FeO–graphene nanocomposite material was formed during the pulsed wire discharge process.

  12. Polyimide weld bonding for titanium alloy joints

    Science.gov (United States)

    Vaughan, R. W.; Kurland, R. M.

    1974-01-01

    Two weld bonding processes were developed for joining titanium alloy; one process utilizes a weld-through technique and the other a capillary-flow technique. The adhesive used for the weld-through process is similar to the P4/A5F system. A new polyimide laminating resin, BFBI/BMPM, was used in the capillary-flow process. Static property information was generated for weld-bonded joints over the temperature range of 219 K (-65 F) to 561 K (+550 F) and fatigue strength information was generated at room temperature. Significant improvement in fatigue strength was demonstrated for weld-bonded joints over spot-welded joints. A demonstration was made of the applicability of the weld-through weld-bonding process for fabricating stringer stiffened skin panels.

  13. High speed photographic study of hot wire dynamic behavior

    Science.gov (United States)

    Sernas, V.; Murphy, A. J.

    1974-01-01

    Investigation of hot wire dynamic behavior under high-current heating aimed at a better understanding of the ignition process, using high-speed photographic techniques for visual observation of the bridgewire itself during high current heating. Tests were conducted with Tophet A bridgewires in an air environment, as well as in a cell of distilled water at room temperature, and with a boron-potassium perchlorate-Viton pyrotechnic against the bridgewire behind a Plexiglas window.

  14. Wear out Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nano scale Device Packaging

    International Nuclear Information System (INIS)

    Gan, C.L.; Ng, E.K.; Chan, B.L.; Gan, C.L.; Hashim, U.; Classe, F.C.; Kwuanjai, T.

    2013-01-01

    Wear out reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nano scale semiconductor device packaging. This paper discusses the HAST (with bias) and UHAST (unbiased HAST) wear out reliability performance of Au and PdCu wires used in fine pitch BGA packages. In-depth failure analysis has been carried out to identify the failure mechanism under various wear out conditions. Intermetallic compound (IMC) diffusion constants and apparent activation energies (E a a) of both wire types were investigated after high temperature storage life test (HTSL). Au bonds were identified to have faster IMC formation, compared to slower IMC growth of PdCu. PdCu wire was found to exhibit equivalent or better wear out reliability margin compared to conventional Au wire bonds. Failure mechanisms of Au, Cu ball bonds post-HAST and UHAST tests are been proposed, and both Au and PdCu IMC diffusion kinetics and their characteristics are discussed in this paper.

  15. Rodent Zic Genes in Neural Network Wiring.

    Science.gov (United States)

    Herrera, Eloísa

    2018-01-01

    The formation of the nervous system is a multistep process that yields a mature brain. Failure in any of the steps of this process may cause brain malfunction. In the early stages of embryonic development, neural progenitors quickly proliferate and then, at a specific moment, differentiate into neurons or glia. Once they become postmitotic neurons, they migrate to their final destinations and begin to extend their axons to connect with other neurons, sometimes located in quite distant regions, to establish different neural circuits. During the last decade, it has become evident that Zic genes, in addition to playing important roles in early development (e.g., gastrulation and neural tube closure), are involved in different processes of late brain development, such as neuronal migration, axon guidance, and refinement of axon terminals. ZIC proteins are therefore essential for the proper wiring and connectivity of the brain. In this chapter, we review our current knowledge of the role of Zic genes in the late stages of neural circuit formation.

  16. STRENGTHENING OF A REINFORCED CONCRETE BRIDGE WITH PRESTRESSED STEEL WIRE ROPES

    Directory of Open Access Journals (Sweden)

    Kexin Zhang

    2017-10-01

    Full Text Available This paper describes prestressed steel wire ropes as a way to strengthen a 20-year-old RC T-beam bridge. High strength, low relaxation steel wire ropes with minor radius, high tensile strain and good corrosion resistance were used in this reinforcement. The construction process for strengthening with prestressed steel wire ropes—including wire rope measuring, extruding anchor heads making, anchorage installing, tensioning steel wire ropes and pouring mortar was described. Ultimate bearing capacity of the bridge after strengthening was discussed based on the concrete structure theory. The flexural strength of RC T-beam bridges strengthened with prestressed steel wire ropes was governed by the failure of concrete crushing. To investigate effectiveness of the strengthening method, fielding-load tests were carried out before and after strengthening. The results of concrete strain and deflection show that the flexural strength and stiffness of the strengthened beam are improved. The crack width measurement also indicates that this technique could increase the durability of the bridge. Thus, this strengthened way with prestressed steel wire rope is feasible and effective.

  17. Grism manufacturing by low temperature mineral bonding

    Science.gov (United States)

    Kalkowski, G.; Grabowski, K.; Harnisch, G.; Flügel-Paul, T.; Zeitner, U.; Risse, S.

    2017-09-01

    By uniting a grating with a prism to a GRISM compound, the optical characteristics of diffractive and refractive elements can be favorably combined to achieve outstanding spectral resolution features. Ruling the grating structure into the prism surface is common for wavelengths around 1 μm and beyond, while adhesive bonding of two separate parts is generally used for shorter wavelengths and finer structures. We report on a manufacturing approach for joining the corresponding glass elements by the technology of hydrophilic direct bonding. This allows to manufacture the individual parts separately and subsequently combine them quasimonolithically by generating stiff and durable bonds of vanishing thickness, high strength and excellent transmission. With this approach for GRISM bonding, standard direct-write- or mask-lithography equipment may be used for the fabrication of the grating structure and the drawbacks of adhesive bonding (thermal mismatch, creep, aging) are avoided. The technology of hydrophilic bonding originates from "classical" optical contacting [1], but has been much improved and perfected during the last decades in the context of 3-dimensinal stacking Si-wafers for microelectronic applications [2]. It provides joins through covalent bonds of the Si-O-Si type at the nanometer scale, i.e. the elementary bond type in many minerals and glasses. The mineral nature of the bond is perfectly adapted to most optical materials and the extremely thin bonding layers generated with this technology are well suited for transmission optics. Creeping under mechanical load, as commonly observed with adhesive bonding, is not an issue. With respect to diffusion bonding, which operates at rather high temperatures close to the glass transition or crystal melting point, hydrophilic bonding is a low temperature process that needs only moderate heating. This facilitates provision of handling and alignment means for the individual parts during the set-up stages and greatly

  18. Feasibility studies on the direct wire readout on wire scanners in electron accelerators; Durchfuehrbarkeitsstudien zur direkten Drahtauslese an Wirescannern in Elektronen-Beschleunigern

    Energy Technology Data Exchange (ETDEWEB)

    Markert, Michael

    2010-10-15

    This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

  19. Preliminary study of Rayleigh-Taylor instability in wire-array Z-pinch

    International Nuclear Information System (INIS)

    He Kaihui; Feng Kaiming; Li Qiang; Gao Chunming

    2000-01-01

    It is important to research into the MHD Rayleigh-Taylor instability developed in Z-pinch implosion. A snowplough model of the single wire Z-pinch is presented. The perturbation amplitude of Rayleigh-Taylor instability in the wire-array Z-pinch is analyzed quantitatively. Sheared axial flow is put forward to mitigate and reduce the Rayleigh-Taylor instability. And other approaches used to mitigate MHD instability in such a super-fast process are explored

  20. Method for wiring allocation and switch configuration in a multiprocessor environment

    Science.gov (United States)

    Aridor, Yariv [Zichron Ya'akov, IL; Domany, Tamar [Kiryat Tivon, IL; Frachtenberg, Eitan [Jerusalem, IL; Gal, Yoav [Haifa, IL; Shmueli, Edi [Haifa, IL; Stockmeyer, legal representative, Robert E.; Stockmeyer, Larry Joseph [San Jose, CA

    2008-07-15

    A method for wiring allocation and switch configuration in a multiprocessor computer, the method including employing depth-first tree traversal to determine a plurality of paths among a plurality of processing elements allocated to a job along a plurality of switches and wires in a plurality of D-lines, and selecting one of the paths in accordance with at least one selection criterion.