Power Electronics Thermal Management | Transportation Research | NREL

Science.gov (United States)

Power Electronics Thermal Management Power Electronics Thermal Management A photo of water boiling in liquid cooling lab equipment. Power electronics thermal management research aims to help lower the investigates and develops thermal management strategies for power electronics systems that use wide-bandgap

Design of an RF window for L-band CW klystron based on thermal-stress analysis

International Nuclear Information System (INIS)

Yamaguchi, Seiya; Sato, Isamu; Konashi, Kenji; Ohshika, Junji.

1993-01-01

Design of klystron RF window has been performed based on a thermal-stress analysis for L-band CW electron linac for nuclear wastes transmutation. It was shown that the hoop stress for a modified disk is 46% of that of normal disk. Thermal load test has been done which indicated that the modified disk is proof against power twice as much as that for the normal disk. (author)

Thermal Transport in Diamond Films for Electronics Thermal Management

Science.gov (United States)

2018-03-01

AFRL-RY-WP-TR-2017-0219 THERMAL TRANSPORT IN DIAMOND FILMS FOR ELECTRONICS THERMAL MANAGEMENT Samuel Graham Georgia Institute of Technology MARCH... ELECTRONICS THERMAL MANAGEMENT 5a. CONTRACT NUMBER FA8650-15-C-7517 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 61101E 6. AUTHOR(S) Samuel...seeded sample (NRL 010516, Die A5). The NCD membrane and Al layer thicknesses, tNCD, were measured via transmission electron microscopy (TEM). The

Residual stress evolution regularity in thermal barrier coatings under thermal shock loading

Directory of Open Access Journals (Sweden)

Ximin Chen

2014-01-01

Full Text Available Residual stress evolution regularity in thermal barrier ceramic coatings (TBCs under different cycles of thermal shock loading of 1100°C was investigated by the microscopic digital image correlation (DIC and micro-Raman spectroscopy, respectively. The obtained results showed that, as the cycle number of the thermal shock loading increases, the evolution of the residual stress undergoes three distinct stages: a sharp increase, a gradual change, and a reduction. The extension stress near the TBC surface is fast transformed to compressive one through just one thermal cycle. After different thermal shock cycles with peak temperature of 1100°C, phase transformation in TBC does not happen, whereas the generation, development, evolution of the thermally grown oxide (TGO layer and micro-cracks are the main reasons causing the evolution regularity of the residual stress.

Non-uniform temperature gradients and thermal stresses produced ...

Indian Academy of Sciences (India)

thermally-induced stress distributions in a hollow steel sphere heated by a moving uniform ... models to evaluate temperatures according to the frictional heat generation, ... of these thermal effects include thermal stress, strain and deformation.

40 CFR 90.329 - Catalyst thermal stress test.

Science.gov (United States)

2010-07-01

... 40 Protection of Environment 20 2010-07-01 2010-07-01 false Catalyst thermal stress test. 90.329... Equipment Provisions § 90.329 Catalyst thermal stress test. (a) Oven characteristics. The oven used for thermally stressing the test catalyst must be capable of maintaining a temperature of 500 ±5 °C and 1000 ±10...

Thermal stresses in long prisms by relaxation methods

International Nuclear Information System (INIS)

Cummins, J.D.

1959-07-01

A general method is presented for calculating the elastic thermal stresses in long prisms which are producing heat and are not solvable by simple analytical methods. The problem of an inverted lattice i.e. an hexagonal coolant passage surrounded by hexagonal fuel elements is considered and the temperature and principal thermal stress distributions evaluated for the particular case of 20% coolant. The maximum thermal stress for this type of fuel element is about the same as the maximum thermal stress in a cylindrical fuel element surrounded by a sea of coolant assuming the existence of the same maximum temperature drop and material properties. (author)

Thermal stresses in long prisms by relaxation methods

Energy Technology Data Exchange (ETDEWEB)

Cummins, J D [Atomic Energy Establishment, Winfrith, Dorchester, Dorset (United Kingdom)

1959-07-15

A general method is presented for calculating the elastic thermal stresses in long prisms which are producing heat and are not solvable by simple analytical methods. The problem of an inverted lattice i.e. an hexagonal coolant passage surrounded by hexagonal fuel elements is considered and the temperature and principal thermal stress distributions evaluated for the particular case of 20% coolant. The maximum thermal stress for this type of fuel element is about the same as the maximum thermal stress in a cylindrical fuel element surrounded by a sea of coolant assuming the existence of the same maximum temperature drop and material properties. (author)

Modelling and Improvement of Thermal Cycling in Power Electronics for Motor Drive Applications

DEFF Research Database (Denmark)

Vernica, Ionut; Ma, Ke; Blaabjerg, Frede

2016-01-01

It is well known that the dynamical change of the thermal stress in the power devices is one of the major factors that have influences on the overall efficiency and reliability of power electronics. The main objective of this paper consists of identifying the main parameters that affect the thermal...... are identified during the acceleration and deceleration periods of the motor. The main causes for these adverse thermal cycles have been presented and, consequently, the influence of the deceleration slope, modulation technique and reactive current on the thermal cycles has been analyzed. Finally, the improved...

Power Electronics and Thermal Management | Transportation Research | NREL

Science.gov (United States)

Power Electronics and Thermal Management Power Electronics and Thermal Management This is the March Gearhart's testimony. Optical Thermal Characterization Enables High-Performance Electronics Applications New vehicle electronics systems are being developed at a rapid pace, and NREL is examining strategies to

Thermal stress analysis of a planar SOFC stack

Science.gov (United States)

Lin, Chih-Kuang; Chen, Tsung-Ting; Chyou, Yau-Pin; Chiang, Lieh-Kwang

The aim of this study is, by using finite element analysis (FEA), to characterize the thermal stress distribution in a planar solid oxide fuel cell (SOFC) stack during various stages. The temperature profiles generated by an integrated thermo-electrochemical model were applied to calculate the thermal stress distributions in a multiple-cell SOFC stack by using a three-dimensional (3D) FEA model. The constructed 3D FEA model consists of the complete components used in a practical SOFC stack, including positive electrode-electrolyte-negative electrode (PEN) assembly, interconnect, nickel mesh, and gas-tight glass-ceramic seals. Incorporation of the glass-ceramic sealant, which was never considered in previous studies, into the 3D FEA model would produce more realistic results in thermal stress analysis and enhance the reliability of predicting potential failure locations in an SOFC stack. The effects of stack support condition, viscous behavior of the glass-ceramic sealant, temperature gradient, and thermal expansion mismatch between components were characterized. Modeling results indicated that a change in the support condition at the bottom frame of the SOFC stack would not cause significant changes in thermal stress distribution. Thermal stress distribution did not differ significantly in each unit cell of the multiple-cell stack due to a comparable in-plane temperature profile. By considering the viscous characteristics of the glass-ceramic sealant at temperatures above the glass-transition temperature, relaxation of thermal stresses in the PEN was predicted. The thermal expansion behavior of the metallic interconnect/frame had a greater influence on the thermal stress distribution in the PEN than did that of the glass-ceramic sealant due to the domination of interconnect/frame in the volume of a planar SOFC assembly.

40 CFR 91.427 - Catalyst thermal stress resistance evaluation.

Science.gov (United States)

2010-07-01

... 40 Protection of Environment 20 2010-07-01 2010-07-01 false Catalyst thermal stress resistance... Procedures § 91.427 Catalyst thermal stress resistance evaluation. (a)(1) The purpose of the evaluation procedure specified in this section is to determine the effect of thermal stress on catalyst conversion...

40 CFR 90.427 - Catalyst thermal stress resistance evaluation.

Science.gov (United States)

2010-07-01

... 40 Protection of Environment 20 2010-07-01 2010-07-01 false Catalyst thermal stress resistance... Gaseous Exhaust Test Procedures § 90.427 Catalyst thermal stress resistance evaluation. (a) The purpose of... catalyst conversion efficiency for Phase 1 engines. The thermal stress is imposed on the test catalyst by...

Thermal stress-dependent dilation of concrete

International Nuclear Information System (INIS)

Pfeiffer, P.A.; Marchertas, A.H.

1984-01-01

Recent studies in nuclear fast reactor safety consider the possibility of concrete containment being subjected to extremely severe environmental conditions. Certain safety scenarios subject the concrete to very high temperatures hence raising the concern of containment integrity. Some of the main detrimental effects of high temperature on concrete are: reduction of strength, redistribution of moisture and etc. Consequently, analytical prediction of concrete response under the high temperature conditions becomes very complex. A rather simple but important experiment of concrete at high temperatures was conducted by Anderberg and Thelandersson. The test samples were small so that moisture was free to evaporate with no appreciable gradient as the temperature increased. Their results revealed that good correlation with analysis could be obtained if thermal expansion was made a function of both temperature and stress. The method of relating the thermal strain to temperature and stress has been integrated into the TEMP-STRESS code. Thus, high temperature concrete computational capability is now available for thermal-stress calculations

Theory of thermal stresses

CERN Document Server

Boley, Bruno A

1997-01-01

Highly regarded text presents detailed discussion of fundamental aspects of theory, background, problems with detailed solutions. Basics of thermoelasticity, heat transfer theory, thermal stress analysis, more. 1985 edition.

Adaptive Responses to Thermal Stress in Mammals

OpenAIRE

Yasser Lenis Sanin; Angélica María Zuluaga Cabrera; Ariel Marcel Tarazona Morales

2015-01-01

The environment animals have to cope with is a combination of natural factors such as temperature. Extreme changes in these factors can alter homeostasis, which can lead to thermal stress. This stress can be due to either high temperatures or low temperatures. Energy transference for thermoregulation in homoeothermic animals occurs through several mechanisms: conduction, convection, radiation and evaporation. When animals are subjected to thermal stress, physiological mechanisms are activated...

Thermally developing forced convection and the corresponding thermal stresses in a porous plate channel

Institute of Scientific and Technical Information of China (English)

YANG Xiao; LIU Xuemei

2007-01-01

Based on the Darcy fluid model, by considering the effects of viscous dissipation due to the interaction between solid skeleton and pore fluid flow and thermal conduction in the direction of the fluid flow, the thermally developing forced convection of the local thermal equili- brium and the corresponding thermal stresses in a semi- infmite saturated porous plate channel are investigated in this paper. The expressions of temperature, local Nusselt number and corresponding thermal stresses are obtained by means of the Fourier series, and the distributions of the same are also shown. Furthermore, influences of the Péclet number (Pe) and Brinkman number (Br) on temperature, Nusselt number (Nu) and thermal stress are revealed numerically.

Power Electronics Thermal Management R&D

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilbert; Bennion, Kevin

2016-06-08

This project will develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter designs). The use of WBG-based devices in automotive power electronics will improve efficiency and increase driving range in electric-drive vehicles; however, the implementation of this technology is limited, in part, due to thermal issues. This project will develop system-level thermal models to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

Passive thermal management system for downhole electronics in harsh thermal environments

International Nuclear Information System (INIS)

Shang, Bofeng; Ma, Yupu; Hu, Run; Yuan, Chao; Hu, Jinyan; Luo, Xiaobing

2017-01-01

Highlights: • A passive thermal management system is proposed for downhole electronics. • Electronics temperature can be maintained within 125 °C for six-hour operating time. • The result shows potential application for the logging tool in oil and gas industry. - Abstract: The performance and reliability of downhole electronics will degrade in high temperature environments. Various active cooling techniques have been proposed for thermal management of such systems. However, these techniques require additional power input, cooling liquids and other moving components which complicate the system. This study presents a passive Thermal Management System (TMS) for downhole electronics. The TMS includes a vacuum flask, Phase Change Material (PCM) and heat pipes. The thermal characteristics of the TMS is evaluated experimentally. The results show that the system maintains equipment temperatures below 125 °C for a six-hour operating period in a 200 °C downhole environment, which will effectively protect the downhole electronics.

Coatings influencing thermal stress in photonic crystal fiber laser

Science.gov (United States)

Pang, Dongqing; Li, Yan; Li, Yao; Hu, Minglie

2018-06-01

We studied how coating materials influence the thermal stress in the fiber core for three holding methods by simulating the temperature distribution and the thermal stress distribution in the photonic-crystal fiber laser. The results show that coating materials strongly influence both the thermal stress in the fiber core and the stress differences caused by holding methods. On the basis of the results, a two-coating PCF was designed. This design reduces the stress differences caused by variant holding conditions to zero, then the stability of laser operations can be improved.

Evaluation charts of thermal stresses in cylindrical vessels induced by thermal stratification of contained fluid

International Nuclear Information System (INIS)

Furuhashi, Ichiro; Kawasaki, Nobuchika; Kasahara, Naoto

2008-01-01

Temperature and thermal stress in cylindrical vessels were analysed for the thermal stratification of contained fluid. Two kinds of temperature analysis results were obtained such as the exact temperature solution of eigenfunction series and the simple approximate one by the temperature profile method. Furthermore, thermal stress shell solutions were obtained for the simple approximate temperatures. Through comparison with FEM analyses, these solutions were proved to be adequate. The simple temperature solution is described by one parameter that is the temperature decay coefficient. The thermal stress shell solutions are described by two parameters. One is the ratio between the temperature decay coefficient and the load decay coefficient. Another is the nondimensional width of stratification. These solutions are so described by few parameters that those are suitable for the simplified thermal stress evaluation charts. These charts enable quick and accurate thermal stress evaluations of cylindrical vessel of this problem compared with conventional methods. (author)

Evaluation charts of thermal stresses in cylindrical vessels induced by thermal stratification of contained fluid

International Nuclear Information System (INIS)

Furuhashi, Ichiro; Kawasaki, Nobuchika; Kasahara, Naoto

2007-01-01

Temperature and thermal stress in cylindrical vessels were analysed for the thermal stratification of contained fluid. Two kinds of temperature analysis results were obtained such as the exact temperature solution of eigen-function series and the simple approximate one by the temperature profile method. Furthermore, shell solutions of thermal stress were obtained for the simple approximate temperatures. Through comparison with FEM analyses, these solutions were proved to be adequate. The simple temperature solution is described by one parameter that is the temperature decay factor. The shell solutions of thermal stress are described by two parameters. One is the ratio between the temperature decay factor and the local decay factor. Another is the non-dimensional width of stratification. These solution are so described by few parameters that those are suitable for the simplified thermal stress evaluation charts. These charts enable quick and accurate thermal stress evaluations of cylindrical vessel of this problem compared with conventional methods. (author)

Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

Science.gov (United States)

Peter, Geoffrey John M.

With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect

Thermal stress effects in intermetallic matrix composites

Science.gov (United States)

Wright, P. K.; Sensmeier, M. D.; Kupperman, D. S.; Wadley, H. N. G.

1993-01-01

Intermetallic matrix composites develop residual stresses from the large thermal expansion mismatch (delta-alpha) between the fibers and matrix. This work was undertaken to: establish improved techniques to measure these thermal stresses in IMC's; determine residual stresses in a variety of IMC systems by experiments and modeling; and, determine the effect of residual stresses on selected mechanical properties of an IMC. X ray diffraction (XRD), neutron diffraction (ND), synchrotron XRD (SXRD), and ultrasonics (US) techniques for measuring thermal stresses in IMC were examined and ND was selected as the most promising technique. ND was demonstrated on a variety of IMC systems encompassing Ti- and Ni-base matrices, SiC, W, and Al2O3 fibers, and different fiber fractions (Vf). Experimental results on these systems agreed with predictions of a concentric cylinder model. In SiC/Ti-base systems, little yielding was found and stresses were controlled primarily by delta-alpha and Vf. In Ni-base matrix systems, yield strength of the matrix and Vf controlled stress levels. The longitudinal residual stresses in SCS-6/Ti-24Al-llNb composite were modified by thermomechanical processing. Increasing residual stress decreased ultimate tensile strength in agreement with model predictions. Fiber pushout strength showed an unexpected inverse correlation with residual stress. In-plane shear yield strength showed no dependence on residual stress. Higher levels of residual tension led to higher fatigue crack growth rates, as suggested by matrix mean stress effects.

40 CFR 91.329 - Catalyst thermal stress test.

Science.gov (United States)

2010-07-01

... 40 Protection of Environment 20 2010-07-01 2010-07-01 false Catalyst thermal stress test. 91.329....329 Catalyst thermal stress test. (a) Oven characteristics. The oven used for termally stressing the test catalyst must be capable of maintaining a temperature of 500 ±5 °C and 1000 ±10 °C. (b) Evaluation...

Bandgap tuning with thermal residual stresses induced in a quantum dot.

Science.gov (United States)

Kong, Eui-Hyun; Joo, Soo-Hyun; Park, Hyun-Jin; Song, Seungwoo; Chang, Yong-June; Kim, Hyoung Seop; Jang, Hyun Myung

2014-09-24

Lattice distortion induced by residual stresses can alter electronic and mechanical properties of materials significantly. Herein, a novel way of the bandgap tuning in a quantum dot (QD) by lattice distortion is presented using 4-nm-sized CdS QDs grown on a TiO2 particle as an application example. The bandgap tuning (from 2.74 eV to 2.49 eV) of a CdS QD is achieved by suitably adjusting the degree of lattice distortion in a QD via the tensile residual stresses which arise from the difference in thermal expansion coefficients between CdS and TiO2. The idea of bandgap tuning is then applied to QD-sensitized solar cells, achieving ≈60% increase in the power conversion efficiency by controlling the degree of thermal residual stress. Since the present methodology is not limited to a specific QD system, it will potentially pave a way to unexplored quantum effects in various QD-based applications. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Advanced thermal management technologies for defense electronics

Science.gov (United States)

Bloschock, Kristen P.; Bar-Cohen, Avram

2012-05-01

Thermal management technology plays a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. For the past decade, and particularly, the past 4 years, the Defense Advanced Research Projects Agency (DARPA) has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT). An overview of the TMT program will be presented with emphasis on the goals and status of these efforts relative to the current State-of-the-Art. The presentation will close with future challenges and opportunities in the thermal management of defense electronics.

Temperature distribution and thermal stress

Indian Academy of Sciences (India)

Abstract. Thermal effects of a double-end-pumped cubic Nd:YVO4 laser crystal are investigated in this paper. A detailed analysis of temperature distribution and thermal stress in cubic crystal with circular shape pumping is discussed. It has been shown that by considering the total input powers as constant, the ...

Thermal stress ratcheting analysis of a time-hardening structure

International Nuclear Information System (INIS)

Hada, Kazuhiko

1999-01-01

Thermal stress ratcheting and shakedown is analyzed for a time-hardening structure: the yield stress increases as time goes on under exposure to neutron irradiation or thermal aging. New three modes of ratcheting and shakedown are identified as transition to other deformation modes. Stress regimes and thermal ratchet strains are formulated as a function of time-increasing yield stress. Moreover, a new model of trouble occurrence frequency as a modification to a bath-tube curve is proposed for calculating a time period of a thermal cycle. Application of the proposed formulation tells us a benefit of taking into account the time hardening due to neutron irradiation. (author)

Calculation of the thermal stress and thermal resistance of anisotropic materials. II

Energy Technology Data Exchange (ETDEWEB)

Krivko, A I; Epishin, A I; Svetlov, I L; Samoilov, A I; Sukhanov, N N

1989-04-01

The stressed state in a wedge and in a family of plates cut from single-crystal ingots of 40 axial orientations is analyzed. It is shown that, in contrast to the case of the wedge, the value of the thermal stress tensor components in the plates depends substantially not only on the axial crystallographic orientation but also on the azimuthal orientation. Requirements on the crystallographic orientation of simple single-crystal parts of plate or wedge type are formulated with the aim of decreasing the detrimental effects of thermal stresses. The correctness of the calculations is confirmed by results of thermal fatigue tests of hollow prismatic specimens, i.e., blade simulators with 001, 011, and 111 axial orientations.

Cooled electronic system with thermal spreaders coupling electronics cards to cold rails

Science.gov (United States)

Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; Iyengar, Madhusudan K; Kamath, Vinod; Kochuparambil, Bejoy J; Schmidt, Roger R; Schultz, Mark D; Simco, Daniel P; Steinke, Mark E

2013-07-23

Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Transient stress control of aeroengine disks based on active thermal management

International Nuclear Information System (INIS)

Ding, Shuiting; Wang, Ziyao; Li, Guo; Liu, Chuankai; Yang, Liu

2016-01-01

Highlights: • The essence of cooling in turbine system is a process of thermal management. • Active thermal management is proposed to control transient stress of disks. • The correlation between thermal load and transient stress of disks is built. • Stress level can be declined by actively adjusting the thermal load distribution. • Artificial temperature gradient can be used to counteract stress from rotating. - Abstract: The physical essence of cooling in the turbine system is a process of thermal management. In order to overcome the limits of passive thermal management based on thermal protection, the concept of active thermal management based on thermal load redistribution has been proposed. On this basis, this paper focuses on a near real aeroengine disk during a transient process and studies the stress control mechanism of active thermal management in transient conditions by a semi-analytical method. Active thermal management is conducted by imposing extra heating energy on the disk hub, which is represented by the coefficient of extra heat flow η. The results show that the transient stress level can be effectively controlled by actively adjusting the thermal load distribution. The decline ratio of the peak equivalent stress of the disk hub can be 9.0% for active thermal management load condition (η = 0.2) compared with passive condition (η = 0), even at a rotation speed of 10,000 r/min. The reason may be that the temperature distribution of the disk turns into an artificial V-shape because of the extra heating energy on the hub, and the resulting thermal stresses induced by the negative temperature gradients counteract parts of the stress from rotating.

A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

Directory of Open Access Journals (Sweden)

Canras Batunlu

2015-11-01

Full Text Available Over the last two decades, various models have been developed to assess and improve the reliability of power electronic conversion systems (PECs with a focus on those used for wind turbines. However, only few studies have dealt with mitigating the PECs thermo-mechanical effects on their reliability taking into account variations in wind characteristics. This work critically investigates this issue and attempts to offer a mitigating technique by, first, developing realistic full scale (FS and partial scale (PS induction generator models combined with two level back-to-back PECs. Subsequently, deriving a driving algorithm, which reduces PEC’s operating temperature by controlling its switching patterns. The developed switching procedure ensures minimum temperature fluctuations by adapting the variable DC link and system’s frequency of operation. It was found for both FS and PS topologies, that the generator side converters have higher mean junction temperatures where the grid side ones have more fluctuations on their thermal profile. The FS and PS cycling temperatures were reduced by 12 °C and 5 °C, respectively. Moreover, this led to a significant improvement in stress; approximately 27 MPa stress reduction for the FS induction generator PEC.

Exploring the use of thermal infrared imaging in human stress research.

Directory of Open Access Journals (Sweden)

Veronika Engert

Full Text Available High resolution thermal infrared imaging is a pioneering method giving indices of sympathetic activity via the contact-free recording of facial tissues (thermal imprints. Compared to established stress markers, the great advantage of this method is its non-invasiveness. The goal of our study was to pilot the use of thermal infrared imaging in the classical setting of human stress research. Thermal imprints were compared to established stress markers (heart rate, heart rate variability, finger temperature, alpha-amylase and cortisol in 15 participants undergoing anticipation, stress and recovery phases of two laboratory stress tests, the Cold Pressor Test and the Trier Social Stress Test. The majority of the thermal imprints proved to be change-sensitive in both tests. While correlations between the thermal imprints and established stress markers were mostly non-significant, the thermal imprints (but not the established stress makers did correlate with stress-induced mood changes. Multivariate pattern analysis revealed that in contrast to the established stress markers the thermal imprints could not disambiguate anticipation, stress and recovery phases of both tests. Overall, these results suggest that thermal infrared imaging is a valuable method for the estimation of sympathetic activity in the stress laboratory setting. The use of this non-invasive method may be particularly beneficial for covert recordings, in the study of special populations showing difficulties in complying with the standard instruments of data collection and in the domain of psychophysiological covariance research. Meanwhile, the established stress markers seem to be superior when it comes to the characterization of complex physiological states during the different phases of the stress cycle.

Power Electronics Thermal Management

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilberto [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

2017-08-07

Thermal modeling was conducted to evaluate and develop thermal management strategies for high-temperature wide-bandgap (WBG)-based power electronics systems. WBG device temperatures of 175 degrees C to 250 degrees C were modeled under various under-hood temperature environments. Modeling result were used to identify the most effective capacitor cooling strategies under high device temperature conditions.

Adaptive Responses to Thermal Stress in Mammals

Directory of Open Access Journals (Sweden)

Yasser Lenis Sanin

2015-12-01

Full Text Available The environment animals have to cope with is a combination of natural factors such as temperature. Extreme changes in these factors can alter homeostasis, which can lead to thermal stress. This stress can be due to either high temperatures or low temperatures. Energy transference for thermoregulation in homoeothermic animals occurs through several mechanisms: conduction, convection, radiation and evaporation. When animals are subjected to thermal stress, physiological mechanisms are activated which may include endocrine, neuroendocrine and behavioral responses. Activation of the neuroendocrine system affects the secretion of hormones and neurotransmitters which act collectively as response mechanisms that allow them to adapt to stress. Mechanisms which have developed through evolution to allow animals to adapt to high environmental temperatures and to achieve thermo tolerance include physiological and physical changes in order to reduce food intake and metabolic heat production, to increase surface area of skin to dissipate heat, to increase blood flow to take heat from the body core to the skin and extremities to dissipate the heat, to increase numbers and activity of sweat glands, panting, water intake and color adaptation of integument system to reflect heat. Chronic exposure to thermal stress can cause disease, reduce growth, decrease productive and reproductive performance and, in extreme cases, lead to death. This paper aims to briefly explain the physical and physiological responses of mammals to thermal stress, like a tool for biological environment adaptation, emphasizing knowledge gaps and offering some recommendations to stress control for the animal production system.

An analytical study on the thermal stress of mass concrete

International Nuclear Information System (INIS)

Yoshida, H.; Sawada, T.; Yamazaki, M.; Miyashita, T.; Morikawa, H.; Hayami, Y.; Shibata, K.

1983-01-01

The thermal stress in mass concrete occurs as a result of the effect associated with the heat of hydration of the cement. Sometimes, the excessive stresses cause the cracking or other tensile failure in concrete. Therefore it is becoming necessary in the design and construction of mass concrete to predict the thermal stress. The thermal stress analysis of mass concrete requires to take account of the dependence of the elastic modulus on the age of concrete as well as the stress relaxation by creep effect. The studies of those phenomena and the analytical methods have been reported so far. The paper presents the analytical method and discusses its reliability through the application of the method to the actual structure, measuring the temperatures and the thermal stresses. The method is the time dependent thermal stress analysis based on the finite element method, which takes account of creep effect, the aging of concrete and the effect of temperature variation in time. (orig./HP)

Fatigue crack growth behavior under cyclic thermal transient stress

International Nuclear Information System (INIS)

Ueda, Masahiro; Kano, Takashi; Yoshitoshi, Atsushi.

1986-01-01

Thermal fatigue tests were performed using straight pipe specimens subjected to cyclic thermal shocks of liquid sodium, and crack growth behaviors were estimated using striation patterns observed clearly on any crack surface. Crack growth rate under cyclic thermal strain reaches the maximum at one depth, and after that it decreases gradually with crack depth. The peak location of crack growth rate becomes deeper by superposition of constant primary stress. Parallel cracks co-existing in the neighborhood move the peak to shallower location and decrease the maximum crack growth rate. The equivalent stress intensity factor range calculated by Walker's formula is successfully applied to the case of negative stress ratio. Fatigue crack growth rate under cyclic thermal strain agreed well with that under the constant temperature equal to the maximum value in the thermal cycle. Simplified methods for calculating the stress intensity factor and the crack interference factor have been developed. Crack growth behavior under thermal fatigue could be well predicted using numerical analysis results. (author)

Fatigue crack growth behavior under cyclic transient thermal stress

International Nuclear Information System (INIS)

Ueda, Masahiro; Kano, Takashi; Yoshitoshi, Atsushi.

1987-01-01

Thermal fatigue tests were performed using straight pipe specimens subjected to cyclic thermal shocks of liquid sodium, and crack growth behaviors were estimated using striation patterns observed clearly on any crack surface. Crack growth rate under cyclic thermal strain reaches the maximum at one depth, and after that it decreases gradually with crack depth. The peak location of crack growth rate becomes deeper by superposition of constant primary stress. Parallel cracks co-existing in the neighborhood move the peak to shallower location and decrease the maximum crack growth rate. The equivalent stress intensity factor range calculated by Walker's formula is successfully applied to the case of negative stress ratio. Fatigue crack growth rate under cyclic thermal strain agreed well with that under the constant temperature equal to the maximum value in the thermal cycle. Simplified methods for calculating the stress intensity factor and the crack interference factor have been developed. Crack growth behavior under thermal fatigue could be well predicted using numerical analysis results. (author)

Modelling and analysis of radial thermal stresses and temperature ...

African Journals Online (AJOL)

A theoretical investigation has been undertaken to study operating temperatures, heat fluxes and radial thermal stresses in the valves of a modern diesel engine with and without air-cavity. Temperatures, heat fluxes and radial thermal stresses were measured theoretically for both cases under all four thermal loading ...

Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

Energy Technology Data Exchange (ETDEWEB)

Neilsen, Michael K. (Kansas City Plant, Kansas City, MO); Austin, Kevin N.; Adolf, Douglas Brian; Spangler, Scott W.; Neidigk, Matthew Aaron; Chambers, Robert S.

2011-09-01

Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analyses of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.

Thermal-mechanical simulation of high-current pulsed electron beam surface modification process of pure aluminum

International Nuclear Information System (INIS)

Zou Jianxin; Qin Ying; Wu Aimin; Hao Shengzhi; Wang Xiaogang; Dong Chuang

2004-01-01

A mathematical physics model is established to describe the surface modification process of High Current Pulsed Electron Beams (HCPEB) of pure aluminum alloy. Computer simulation is used to reveal the phenomena of fast heating and cooling, melting, solidification, evaporation, and thermal stress wave associated with the HCPEB bombardment. The calculated melting depth is about 1-10 μm, which is close to the experimental results. The evaporated layer is at nanometer level, which can be omitted in the calculation of temperature field. The thermal stress wave, though as weak as about 0.1 MPa in peak amplitude (proportional to pulsed energy density), has strong impacts on material's structure and properties. (authors)

Temperature and Thermal Stress Analysis of Refractory Products

Directory of Open Access Journals (Sweden)

Shaoyang Shi

2013-05-01

Full Text Available Firstly current status of temperature and thermal stress research of refractory product at home and aboard are analyzed. Finite element model of two classical refractory products is building by using APDL language. Distribution law of temperature and thermal stress of two typical refractory products-ladles and tundish are analyzed and their structures are optimized. Stress of optimal structure is dropped obviously, and operation life is increased effectively.

An anisotropic thermal-stress model for through-silicon via

Science.gov (United States)

Liu, Song; Shan, Guangbao

2018-02-01

A two-dimensional thermal-stress model of through-silicon via (TSV) is proposed considering the anisotropic elastic property of the silicon substrate. By using the complex variable approach, the distribution of thermal-stress in the substrate can be characterized more accurately. TCAD 3-D simulations are used to verify the model accuracy and well agree with analytical results (model can be integrated into stress-driven design flow for 3-D IC , leading to the more accurate timing analysis considering the thermal-stress effect. Project supported by the Aerospace Advanced Manufacturing Technology Research Joint Fund (No. U1537208).

Role of high-temperature creep stress in thermally grown oxide growth of thermal barrier coatings

Energy Technology Data Exchange (ETDEWEB)

Ogawa, K.; Nakao, Y.; Seo, D.; Miura, H.; Shoji, T. [Tohoku Univ., Sendai (Japan)

2008-07-01

Thermally grown oxide (TGO) grows at the top / bond coating interface of the thermal barrier coating (TBC) in service. It is supposed that the failures of the TBC occur due to thermal stress and the decrease of adhesive strength caused by the TGO growth. Recently, large local stress has been found to change both the diffusion constant of oxygen through an existing oxide and the rate of chemical reaction at the oxide / oxidized material interface. Since high thermal stress occurs in the TBC, the volume expansion of the newly grown oxide, and centrifugal force, the growth rate of the TGO may change depending on not only temperature but also the stress. The aim of this study is to make clear the influence of stress on the growth rate of the TGO quantitatively. As a result, the thickness of the TGO clearly increases with increase of the amplitude of the applied stress and temperature. The increase rate of the TGO thickness is approximately 23% when the applied stress is increased from 0 to 205 MPa at 900 C, and approximately 29% when the stress is increased from 0 to 150 MPa at 950 C. (orig.)

Thermal stress analysis of sulfur deactivated solid oxide fuel cells

Science.gov (United States)

Zeng, Shumao; Parbey, Joseph; Yu, Guangsen; Xu, Min; Li, Tingshuai; Andersson, Martin

2018-03-01

Hydrogen sulfide in fuels can deactivate catalyst for solid oxide fuel cells, which has become one of the most critical challenges to stability. The reactions between sulfur and catalyst will cause phase changes, leading to increase in cell polarization and mechanical mismatch. A three-dimensional computational fluid dynamics (CFD) approach based on the finite element method (FEM) is thus used to investigate the polarization, temperature and thermal stress in a sulfur deactivated SOFC by coupling equations for gas-phase species, heat, momentum, ion and electron transport. The results indicate that sulfur in fuels can strongly affect the cell polarization and thermal stresses, which shows a sharp decrease in the vicinity of electrolyte when 10% nickel in the functional layer is poisoned, but they remain almost unchanged even when the poisoned Ni content was increased to 90%. This investigation is helpful to deeply understand the sulfur poisoning effects and also benefit the material design and optimization of electrode structure to enhance cell performance and lifetimes in various hydrocarbon fuels containing impurities.

Finite element analysis of thermal stress distribution in different ...

African Journals Online (AJOL)

Nigerian Journal of Clinical Practice. Journal Home ... Von Mises and thermal stress distributions were evaluated. Results: In all ... distribution. Key words: Amalgam, finite element method, glass ionomer cement, resin composite, thermal stress ...

Thermal stress analysis of space shuttle orbiter wing skin panel and thermal protection system

Science.gov (United States)

Ko, William L.; Jenkins, Jerald M.

1987-01-01

Preflight thermal stress analysis of the space shuttle orbiter wing skin panel and the thermal protection system (TPS) was performed. The heated skin panel analyzed was rectangular in shape and contained a small square cool region at its center. The wing skin immediately outside the cool region was found to be close to the state of elastic instability in the chordwise direction based on the conservative temperature distribution. The wing skin was found to be quite stable in the spanwise direction. The potential wing skin thermal instability was not severe enough to tear apart the strain isolation pad (SIP) layer. Also, the preflight thermal stress analysis was performed on the TPS tile under the most severe temperature gradient during the simulated reentry heating. The tensile thermal stress induced in the TPS tile was found to be much lower than the tensile strength of the TPS material. The thermal bending of the TPS tile was not severe enough to cause tearing of the SIP layer.

Calculation of thermal stresses in graphite fuel blocks

International Nuclear Information System (INIS)

Lejeail, Y.; Cabrillat, M.T.

2005-01-01

This paper presents a parametric study of temperature and thermal stress calculations inside a HTGR core graphite block, taking into account the effect of fluence on the thermal and mechanical properties, up to 4. 10 21 n/cm 2 . The Finite Element model, realized with Cast3M CEA code, includes the effects of irradiation creep, which tends to produce secondary stress relaxation. Then, the Weibull weakest link theory is recalled, evaluating the possible effects of volume, stress field distribution (loading factor), and multiaxiality for graphite-type materials, and giving the methodology to compare the stress to rupture for the structure to the one obtained from characterization, in the general case. The maximum of the Weibull stress in Finite Element calculations is compared to the value for tensile specimens. It is found that the maximum of the stress corresponds to the end of the irradiation cycle, after reactor shutdown, since both thermal conductivity and Young's modulus increase with time. However, this behaviour is partly counterbalanced by the increase of material strength with irradiation. (authors)

The relationship between bioclimatic thermal stress and subjective thermal sensation in pedestrian spaces

Science.gov (United States)

Pearlmutter, David; Jiao, Dixin; Garb, Yaakov

2014-12-01

Outdoor thermal comfort has important implications for urban planning and energy consumption in the built environment. To better understand the relation of subjective thermal experience to bioclimatic thermal stress in such contexts, this study compares micrometeorological and perceptual data from urban spaces in the hot-arid Negev region of Israel. Pedestrians reported on their thermal sensation in these spaces, whereas radiation and convection-related data were used to compute the Index of Thermal Stress (ITS) and physiologically equivalent temperature (PET). The former is a straightforward characterization of energy exchanges between the human body and its surroundings, without any conversion to an "equivalent temperature." Although the relation of ITS to subjective thermal sensation has been analyzed in the past under controlled indoor conditions, this paper offers the first analysis of this relation in an outdoor setting. ITS alone can account for nearly 60 % of the variance in pedestrians' thermal sensation under outdoor conditions, somewhat more than PET. A series of regressions with individual contextual variables and ITS identified those factors which accounted for additional variance in thermal sensation, whereas multivariate analyses indicated the considerable predictive power ( R-square = 0.74) of models including multiple contextual variables in addition to ITS. Our findings indicate that pedestrians experiencing variable outdoor conditions have a greater tolerance for incremental changes in thermal stress than has been shown previously under controlled indoor conditions, with a tapering of responses at high values of ITS. However, the thresholds of ITS corresponding to thermal "neutrality" and thermal "acceptability" are quite consistent regardless of context.

Nonlinear electron-acoustic rogue waves in electron-beam plasma system with non-thermal hot electrons

Science.gov (United States)

Elwakil, S. A.; El-hanbaly, A. M.; Elgarayh, A.; El-Shewy, E. K.; Kassem, A. I.

2014-11-01

The properties of nonlinear electron-acoustic rogue waves have been investigated in an unmagnetized collisionless four-component plasma system consisting of a cold electron fluid, non-thermal hot electrons obeying a non-thermal distribution, an electron beam and stationary ions. It is found that the basic set of fluid equations is reduced to a nonlinear Schrodinger equation. The dependence of rogue wave profiles on the electron beam and energetic population parameter are discussed. The results of the present investigation may be applicable in auroral zone plasma.

Coherent gradient sensing method for measuring thermal stress field of thermal barrier coating structures

Directory of Open Access Journals (Sweden)

Kang Ma

2017-01-01

Full Text Available Coherent gradient sensing (CGS method can be used to measure the slope of a reflective surface, and has the merits of full-field, non-contact, and real-time measurement. In this study, the thermal stress field of thermal barrier coating (TBC structures is measured by CGS method. Two kinds of powders were sprayed onto Ni-based alloy using a plasma spraying method to obtain two groups of film–substrate specimens. The specimens were then heated with an oxy-acetylene flame. The resulting thermal mismatch between the film and substrate led to out-of-plane deformation of the specimen. The deformation was measured by the reflective CGS method and the thermal stress field of the structure was obtained through calibration with the help of finite element analysis. Both the experiment and numerical results showed that the thermal stress field of TBC structures can be successfully measured by CGS method.

Verification of the thermal design of electronic equipment

Energy Technology Data Exchange (ETDEWEB)

Hienonen, R.; Karjalainen, M.; Lankinen, R. [VTT Automation, Espoo (Finland). ProTechno

1997-12-31

The project `Verification of the thermal design of electronic equipment` studied the methodology to be followed in the verification of thermal design of electronic equipment. This project forms part of the `Cool Electronics` research programme funded by TEKES, the Finnish Technology Development Centre. This project was carried out jointly by VTT Automation, Lappeenranta University of Technology, Nokia Research Center and ABB Industry Oy VSD-Technology. The thermal design of electronic equipment has a significant impact on the cost, reliability, tolerance to different environments, selection of components and materials, and ergonomics of the product. This report describes the method for verification of thermal design. It assesses the goals set for thermal design, environmental requirements, technical implementation of the design, thermal simulation and modelling, and design qualification testing and the measurements needed. The verification method covers all packaging levels of electronic equipment from the system level to the electronic component level. The method described in this report can be used as part of the quality system of a corporation. The report includes information about the measurement and test methods needed in the verification process. Some measurement methods for the temperature, flow and pressure of air are described. (orig.) Published in Finnish VTT Julkaisuja 824. 22 refs.

Thermal stratification and fatigue stress analysis for pressurizer surge line

International Nuclear Information System (INIS)

Yu Xiaofei; Zhang Yixiong

2011-01-01

Thermal stratification of pressurizer surge line induced by the inside fluid results in the global bending moments, local thermal stresses, unexpected displacements and support loadings of the pipe system. In order to avoid a costly three-dimensional computation, a combined 1D/2D technique has been developed and implemented to analyze the thermal stratification and fatigue stress of pressurize surge line of QINSHAN Phase II Extension Nuclear Power Project in this paper, using the computer codes SYSTUS and ROCOCO. According to the mechanical analysis results of stratification, the maximum stress and cumulative usage factor are obtained. The results indicate that the stress and fatigue intensity considering thermal stratification satisfies RCC-M criterion. (authors)

Modelling of thermal stress in vapor generator supports

International Nuclear Information System (INIS)

Halpert, S.; Vazquez, L.

1997-01-01

To assure safety and availability of a nuclear power plant components or equipment stress analysis are done. When thermal loads are involved it's necessary to know the temperature field of the component or equipment. This paper describes the structural analysis of a steam generator lug with thermal load including the model used for computer simulation and presents the evolution of the temperature profile, the stress intensity and principal stress during start up and shut down of a nuclear power reactor. Temperature field obtained from code calculation show good agreement with the experimental data while stress analysis results are in agreement with a preview estimation. (author) [es

Non-linear elastic thermal stress analysis with phase changes

International Nuclear Information System (INIS)

Amada, S.; Yang, W.H.

1978-01-01

The non-linear elastic, thermal stress analysis with temperature induced phase changes in the materials is presented. An infinite plate (or body) with a circular hole (or tunnel) is subjected to a thermal loading on its inner surface. The peak temperature around the hole reaches beyond the melting point of the material. The non-linear diffusion equation is solved numerically using the finite difference method. The material properties change rapidly at temperatures where the change of crystal structures and solid-liquid transition occur. The elastic stresses induced by the transient non-homogeneous temperature distribution are calculated. The stresses change remarkably when the phase changes occur and there are residual stresses remaining in the plate after one cycle of thermal loading. (Auth.)

Thermal electron heating rate: a derivation

International Nuclear Information System (INIS)

Hoegy, W.R.

1983-11-01

The thermal electron heating rate is an important heat source term in the ionospheric electron energy balance equation, representing heating by photoelectrons or by precipitating higher energy electrons. A formula for the thermal electron heating rate is derived from the kinetic equation using the electron-electron collision operator as given by the unified theory of Kihara and Aono. This collision operator includes collective interactions to produce a finite collision operator with an exact Coulomb logarithm term. The derived heating rate O(e) is the sum of three terms, O(e) O(p) + S + O(int), which are respectively: (1) primary electron production term giving the heating from newly created electrons that have not yet suffered collisions with the ambient electrons, (2) a heating term evaluated on the energy surface m(e)/2 E(T) at the transition between Maxwellian and tail electrons at E(T), and (3) the integral term representing heating of Maxwellian electrons by energetic tail electrons at energies ET. Published ionospheric electron temperature studies used only the integral term O(int) with differing lower integration limits. Use of the incomplete heating rate could lead to erroneous conclusions regarding electron heat balance, since O(e) is greater than O(int) by as much as a factor of two

Thermal properties of graphene under tensile stress

Science.gov (United States)

Herrero, Carlos P.; Ramírez, Rafael

2018-05-01

Thermal properties of graphene display peculiar characteristics associated to the two-dimensional nature of this crystalline membrane. These properties can be changed and tuned in the presence of applied stresses, both tensile and compressive. Here, we study graphene monolayers under tensile stress by using path-integral molecular dynamics (PIMD) simulations, which allows one to take into account quantization of vibrational modes and analyze the effect of anharmonicity on physical observables. The influence of the elastic energy due to strain in the crystalline membrane is studied for increasing tensile stress and for rising temperature (thermal expansion). We analyze the internal energy, enthalpy, and specific heat of graphene, and compare the results obtained from PIMD simulations with those given by a harmonic approximation for the vibrational modes. This approximation turns out to be precise at low temperatures, and deteriorates as temperature and pressure are increased. At low temperature, the specific heat changes as cp˜T for stress-free graphene, and evolves to a dependence cp˜T2 as the tensile stress is increased. Structural and thermodynamic properties display non-negligible quantum effects, even at temperatures higher than 300 K. Moreover, differences in the behavior of the in-plane and real areas of graphene are discussed, along with their associated properties. These differences show up clearly in the corresponding compressibility and thermal expansion coefficient.

Optical Thermal Characterization Enables High-Performance Electronics Applications

Energy Technology Data Exchange (ETDEWEB)

2016-02-01

NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.

Bond strength and stress measurements in thermal barrier coatings

Energy Technology Data Exchange (ETDEWEB)

Gell, M.; Jordan, E. [Univ. of Connecticut, Storrs, CT (United States)

1995-10-01

Thermal barrier coatings have been used extensively in aircraft gas turbines for more than 15 years to insulate combustors and turbine vanes from the hot gas stream. Plasma sprayed thermal barrier coatings (TBCs) provide metal temperature reductions as much as 300{degrees}F, with improvements in durability of two times or more being achieved. The introduction of TBCs deposited by electron beam physical vapor deposition (EB-PVD) processes in the last five years has provided a major improvement in durability and also enabled TBCs to be applied to turbine blades for improved engine performance. To meet the aggressive Advanced Turbine Systems goals for efficiency, durability and the environment, it will be necessary to employ thermal barrier coatings on turbine airfoils and other hot section components. For The successful application of TBCs to ATS engines with 2600{degrees}F turbine inlet temperatures and required component lives 10 times greater than those for aircraft gas turbine engines, it is necessary to develop quantitative assessment techniques for TBC coating integrity with time and cycles in ATS engines. Thermal barrier coatings in production today consist of a metallic bond coat, such as an MCrAlY overlay coating or a platinum aluminide (Pt-Al) diffusion coating. During heat treatment, both these coatings form a thin, tightly adherent alumina (Al{sub 2}O{sub 3}) film. Failure of TBC coatings in engine service occurs by spallation of the ceramic coating at or near the bond coat to alumina or the alumina to zirconia bonds. Thus, it is the initial strength of these bonds and the stresses at the bond plane, and their changes with engine exposure, that determines coating durability. The purpose of this program is to provide, for the first time, a quantitative assessment of TBC bond strength and bond plane stresses as a function of engine time and cycles.

Thermal mechanical stress modeling of GCtM seals

Energy Technology Data Exchange (ETDEWEB)

Dai, Steve Xunhu [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Chambers, Robert [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

2015-09-01

Finite-element thermal stress modeling at the glass-ceramic to metal (GCtM) interface was conducted assuming heterogeneous glass-ceramic microstructure. The glass-ceramics were treated as composites consisting of high expansion silica crystalline phases dispersed in a uniform residual glass. Interfacial stresses were examined for two types of glass-ceramics. One was designated as SL16 glass -ceramic, owing to its step-like thermal strain curve with an overall coefficient of thermal expansion (CTE) at 16 ppm/ºC. Clustered Cristobalite is the dominant silica phase in SL16 glass-ceramic. The other, designated as NL16 glass-ceramic, exhibited clusters of mixed Cristobalite and Quartz and showed a near-linear thermal strain curve with a same CTE value.

A numerical analysis method on thermal and shrinkage stress of concrete

International Nuclear Information System (INIS)

Takiguchi, Katsuki; Hotta, Hisato

1991-01-01

Thermal stress often causes cracks in large scale concrete such as that for dam construction. The drying shrinkage of concrete causes cracks in concrete structures. These thermal stress and drying shrinkage stress may be the main reasons cracks occur in concrete, however there is few research which dealt with both stresses together. The problems on the thermal stress and the drying shrinkage are not independent, and should be dealt with together, because both temperature and water content of concrete affect hydration reaction, and the degree of hydration determines all the characteristics of concrete at early age. In this study, the degree of hydration is formulated experimentally, and a numerical stress analysis method taking the hydration reaction in consideration is presented. The formulation of the rate of hydration reaction, the method of analyzing thermal and drying shrinkage stresses, the analytical results for a concrete column and the influence that continuous load exerted to the tensile strength of concrete are reported. The relatively high stress nearly equal to the tensile strength of concrete arises near the surface. (K.I.)

Mechanics and thermal management of stretchable inorganic electronics.

Science.gov (United States)

Song, Jizhou; Feng, Xue; Huang, Yonggang

2016-03-01

Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics.

Mechanics and thermal management of stretchable inorganic electronics

Science.gov (United States)

Song, Jizhou; Feng, Xue; Huang, Yonggang

2016-01-01

Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics. PMID:27547485

The application of fracture mechanics in thermally stressed structures

International Nuclear Information System (INIS)

Cesari, F.; Maitan, A.; Hellen, T.K.

1981-03-01

There is considerable interest in calculating stress intensity factors at crack tips in thermally stressed structures, particularly in the power generation industry where the safe operation of both conventional and nuclear plant is founded on rigorous safety cases. Analytical methods to study such problems are of limited scope, although they can be extended by introducing numerical techniques. Purpose built numerical methods, however, offer a much greater and more accurate solution capability and in particular the finite element method is well advanced. Such methods are described, including how stress intensity factors can be obtained from the finite element results. They are then applied to a range of thermally stressed problems including plates with central cracks and cylinders with axial and circumferential cracks. Both steady state and transient temperature distributions arising from typical thermal shocks are considered. (author)

Mitigation method of thermal transient stress by thermalhydraulic-structure total analysis

International Nuclear Information System (INIS)

Kasahara, Naoto; Jinbo, Masakazu; Hosogai, Hiromi

2003-01-01

This study proposes a rational evaluation and mitigation method of thermal transient loads in fast reactor components by utilizing relationships among plant system parameters and stresses induced by thermal transients of plants. A thermalhydraulic-structure total analysis procedure helps us to grasp relationship among system parameters and thermal stresses. Furthermore, it enables mitigation of thermal transient loads by adjusting system parameters. In order to overcome huge computations, a thermalhydraulic-structure total analysis code and the Design of Experiments methodology are utilized. The efficiency of the proposed mitigation method is validated through thermal stress evaluation of an intermediate heat exchanger in Japanese demonstration fast reactor. (author)

Thermal stresses in composite tubes using complementary virtual work

Science.gov (United States)

Hyer, M. W.; Cooper, D. E.

1988-01-01

This paper addresses the computation of thermally induced stresses in layered, fiber-reinforced composite tubes subjected to a circumferential gradient. The paper focuses on using the principle of complementary virtual work, in conjunction with a Ritz approximation to the stress field, to study the influence on the predicted stresses of including temperature-dependent material properties. Results indicate that the computed values of stress are sensitive to the temperature dependence of the matrix-direction compliance and matrix-direction thermal expansion in the plane of the lamina. There is less sensitivity to the temperature dependence of the other material properties.

Lipid biomarkers in Symbiodinium dinoflagellates: new indicators of thermal stress

KAUST Repository

Kneeland, J.

2013-08-30

Lipid content and fatty acid profiles of corals and their dinoflagellate endosymbionts are known to vary in response to high-temperature stress. To better understand the heat-stress response in these symbionts, we investigated cultures of Symbiodinium goreauii type C1 and Symbiodinium sp. clade subtype D1 grown under a range of temperatures and durations. The predominant lipids produced by Symbiodinium are palmitic (C16) and stearic (C18) saturated fatty acids and their unsaturated analogs, the polyunsaturated fatty acid docosahexaenoic acid (C22:6, n-3; DHA), and a variety of sterols. Prolonged exposure to high temperature causes the relative amount of unsaturated acids within the C18 fatty acids in Symbiodinium tissue to decrease. Thermal stress also causes a decrease in abundance of fatty acids relative to sterols, as well as the more specific ratio of DHA to an algal 4-methyl sterol. These shifts in fatty acid unsaturation and fatty acid-to-sterol ratios are common to both types C1 and D1, but the apparent thermal threshold of lipid changes is lower for type C1. This work indicates that ratios among free fatty acids and sterols in Symbiodinium can be used as sensitive indicators of thermal stress. If the Symbiodinium lipid stress response is unchanged in hospite, the algal heat-stress biomarkers we have identified could be measured to detect thermal stress within the coral holobiont. These results provide new insights into the potential role of lipids in the overall Symbiodinium thermal stress response. © 2013 Springer-Verlag Berlin Heidelberg.

Advanced materials for thermal management of electronic packaging

CERN Document Server

Tong, Xingcun Colin

2011-01-01

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility

Power Electronics Thermal Management R&D (Presentation)

Energy Technology Data Exchange (ETDEWEB)

Waye, S.

2014-11-01

This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus on thermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxes which much be removed from a smaller footprint, requiring advanced cooling strategies.

Thermal stress in flexible interdigital transducers with anisotropic electroactive cellulose substrates

Science.gov (United States)

Yoon, Sean J.; Kim, Jung Woong; Kim, Hyun Chan; Kang, Jinmo; Kim, Jaehwan

2017-12-01

Thermal stress in flexible interdigital transducers a reliability concern in the development of flexible devices, which may lead to interface delamination, stress voiding and plastic deformation. In this paper, a mathematical model is presented to investigate the effect of material selections on the thermal stress in interdigital transducers. We modified the linear relationships in the composite materials theory with the effect of high curvature, anisotropic substrate and small substrate thickness. We evaluated the thermal stresses of interdigital transducers, fabricated with various electrodes, insulators and substrate materials for the comparison. The results show that, among various insulators, organic polymer developed the highest stress level while oxide showed the lowest stress level. Aluminium shows a higher stress level and curvature as an electrode than gold. As substrate materials, polyimide and electroactive cellulose show similar stress levels except the opposite sign convention to each other. Polyimide shows positive curvatures while electroactive cellulose shows negative curvatures, which is attributed to the stress and thermal expansion state of the metal/insulator composite. The results show that the insulator is found to be responsible for the confinement across the metal lines while the substrate is responsible for the confinement along the metal lines.

Coral thermal tolerance: tuning gene expression to resist thermal stress.

Directory of Open Access Journals (Sweden)

Anthony J Bellantuono

Full Text Available The acclimatization capacity of corals is a critical consideration in the persistence of coral reefs under stresses imposed by global climate change. The stress history of corals plays a role in subsequent response to heat stress, but the transcriptomic changes associated with these plastic changes have not been previously explored. In order to identify host transcriptomic changes associated with acquired thermal tolerance in the scleractinian coral Acropora millepora, corals preconditioned to a sub-lethal temperature of 3°C below bleaching threshold temperature were compared to both non-preconditioned corals and untreated controls using a cDNA microarray platform. After eight days of hyperthermal challenge, conditions under which non-preconditioned corals bleached and preconditioned corals (thermal-tolerant maintained Symbiodinium density, a clear differentiation in the transcriptional profiles was revealed among the condition examined. Among these changes, nine differentially expressed genes separated preconditioned corals from non-preconditioned corals, with 42 genes differentially expressed between control and preconditioned treatments, and 70 genes between non-preconditioned corals and controls. Differentially expressed genes included components of an apoptotic signaling cascade, which suggest the inhibition of apoptosis in preconditioned corals. Additionally, lectins and genes involved in response to oxidative stress were also detected. One dominant pattern was the apparent tuning of gene expression observed between preconditioned and non-preconditioned treatments; that is, differences in expression magnitude were more apparent than differences in the identity of genes differentially expressed. Our work revealed a transcriptomic signature underlying the tolerance associated with coral thermal history, and suggests that understanding the molecular mechanisms behind physiological acclimatization would be critical for the modeling of reefs

Thermal Stress Analysis of Medium-Voltage Converters for Smart Transformers

DEFF Research Database (Denmark)

Andresen, Markus; Ma, Ke; De Carne, Giovanni

2017-01-01

. To address this concern, this work conducts thermal stress analysis for a modular multilevel converter (MMC), which is a promising solution for the medium voltage stage of the ST. The focus is put on the mission profiles of the transformer and the impact on the thermal stress of power semiconductor devices......A smart transformer (ST) can take over an important managing role in the future electrical distribution grid system and can provide many advanced grid services compared to the traditional transformer. However, the risk is that the advanced functionality is balanced out by a lower reliability....... Normal operation at different power levels and medium voltage grid faults in a feeder fed by a traditional transformer are considered as well as the electrical and the thermal stress of the disconnection and the reconnection procedures. For the validation, the thermal stress of one MMC cell is reproduced...

Thermal stresses in hexagonal materials - heat treatment influence on their mechanical behaviour

International Nuclear Information System (INIS)

Gloaguen, D.; Freour, S.; Guillen, R.; Royer, J.; Francois, M.

2004-01-01

Internal stresses due to anisotropic thermal and plastic properties were investigated in rolled zirconium and titanium. The thermal stresses induced by a cooling process were predicted using a self-consistent model and compared with experimental results obtained by X-ray diffraction. The study of the elastoplastic response during uniaxial loading was performed along the rolling and the transverse direction of the sheet, considering the influence of the texture and the thermal stresses on the mechanical behaviour. An approach in order to determine the thermal behaviour of phases embedded in two-phase materials is also presented. For zirconium, the residual stresses due to thermal anisotropy are rather important (equivalent to 35% of the yield stress) and consequently they play an important role on the elastoplastic transition contrary to titanium. The study of two-phase material shows the influence and the interaction of the second phase on the thermal behaviour in the studied phase

Thermal-stress fatigue behavior of twenty-six superalloys

Science.gov (United States)

Bizon, P. T.; Spera, D. A.

1976-01-01

The comparative thermal-stress fatigue resistances of 26 nickeland cobalt-base alloys were determined by fluidized bed tests. Cycles to cracking differed by almost three orders of magnitude for these materials, with directional solidification and surface protection showing definite benefit. The alloy-coating combination with the highest thermal-stress fatigue resistance was directionally solidified NASA TAZ-8A with an RT-SP coating. Its oxidation resistance was also excellent, showing approximately a 1/2 percent weight loss after 14,000 fluidized bed cycles.

Stress relaxation of thermally bowed fuel pins

International Nuclear Information System (INIS)

Crossland, I.G.; Speight, M.V.

1983-01-01

The presence of cross-pin temperature gradients in nuclear reactor fuel pins produces differential thermal expansion which, in turn, causes the fuel pin to bow elastically. If the pin is restrained in any way, such thermal bowing causes the pin to be stressed. At high temperatures these stresses can relax by creep and it is shown here that this causes the pin to suffer an additional permanent deflection, so that when the cross-pin temperature difference is removed the pin remains bowed. By representing the cylindrical pin by an equivalent I-beam, the present work examines this effect when it takes place by secondary creep. Two restraint systems are considered, and it is demonstrated that the rate of relaxation depends mainly upon the creep equation, and hence the temperature, and also the magnitude of the initial stresses. (author)

Non-thermal Plasma and Oxidative Stress

Science.gov (United States)

Toyokuni, Shinya

2015-09-01

Thermal plasmas and lasers have been used in medicine to cut and ablate tissues and for coagulation. Non-equilibrium atmospheric pressure plasma (NEAPP; non-thermal plasma) is a recently developed, non-thermal technique with possible biomedical applications. Although NEAPP reportedly generates reactive oxygen/nitrogen species, electrons, positive ions, and ultraviolet radiation, few research projects have been conducted to merge this technique with conventional free radical biology. Recently, Prof. Masaru Hori's group (Plasma Nanotechnology Research Center, Nagoya University) developed a NEAPP device with high electron density. Here electron spin resonance revealed hydroxyl radicals as a major product. To merge non-thermal plasma biology with the preexisting free radical biology, we evaluated lipid peroxidation and DNA modifications in various in vitro and ex vivo experiments. Conjugated dienes increased after exposure to linoleic and alfa-linolenic acids. An increase in 2-thiobarbituric acid-reactive substances was also increased after exposure to phosphatidylcholine, liposomes or liver homogenate. Direct exposure to rat liver in medium produced immunohistochemical evidence of 4-hydroxy-2-nonenal- and acrolein-modified proteins. Exposure to plasmid DNA induced dose-dependent single/double strand breaks and increased the amounts of 8-hydroxy-2'-deoxyguanosine and cyclobutane pyrimidine dimers. These results indicate that oxidative biomolecular damage by NEAPP is dose-dependent and thus can be controlled in a site-specific manner. Simultaneous oxidative and UV-specific DNA damage may be useful in cancer treatment. Other recent advancements in the related studies of non-thermal plasma in Nagoya University Graduate School of Medicine will also be discussed.

Thermal stresses investigation of a gas turbine blade

Science.gov (United States)

Gowreesh, S.; Pravin, V. K.; Rajagopal, K.; Veena, P. H.

2012-06-01

The analysis of structural and thermal stress values that are produced while the turbine is operating are the key factors of study while designing the next generation gas turbines. The present study examines structural, thermal, modal analysis of the first stage rotor blade of a two stage gas turbine. The design features of the turbine segment of the gas turbine have been taken from the preliminary design of a power turbine for maximization of an existing turbojet engine with optimized dump gap of the combustion chamber, since the allowable temperature on the turbine blade dependents on the hot gas temperatures from the combustion chamber. In the present paper simplified 3-D Finite Element models are developed with governing boundary conditions and solved using the commercial FEA software ANSYS. As the temperature has a significant effect on the overall stress on the rotor blades, a detail study on mechanical and thermal stresses are estimated and evaluated with the experimental values.

Ascorbic Acid Alleviates Damage from Heat Stress in the Photosystem II of Tall Fescue in Both the Photochemical and Thermal Phases

Directory of Open Access Journals (Sweden)

Ke Chen

2017-08-01

Full Text Available L-Ascorbate (Asc plays important roles in plant development, hormone signaling, the cell cycle and cellular redox system, etc. The higher content of Asc in plant chloroplasts indicates its important role in the photosystem. The objective of this study was to study the roles of Asc in tall fescue leaves against heat stress. After a heat stress treatment, we observed a lower value of the maximum quantum yield for primary photochemistry (φPo, which reflects the inhibited activity of the photochemical phase of photosystem II (PSII. Moreover, we observed a higher value of efficiency of electron transfer from QB to photosystem I acceptors (δR0, which reflects elevated activity of the thermal phase of the photosystem of the tall fescue. The addition of Asc facilitate the behavior of the photochemical phase of the PSII by lowering the ROS content as well as that of the alternative electron donor to provide electron to the tyrosine residue of the D1 protein. Additionally, exogenous Asc reduces the activity of the thermal phase of the photosystem, which could contribute to the limitation of energy input into the photosystem in tall fescue against heat stress. Synthesis of the Asc increased under heat stress treatment. However, under heat stress this regulation does not occur at the transcription level and requires further study.

Power Electronics Thermal Management R&D: Annual Report

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilbert [National Renewable Energy Lab. (NREL), Golden, CO (United States)

2016-04-08

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Device- and system-level thermal analyses are conducted to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

Predicted thermal and stress environments in the vicinity of repository openings

International Nuclear Information System (INIS)

Bauer, S.J.; Hardy, M.P.; Lin, M.

1991-01-01

An understanding of the thermal and stress environment in the vicinity of repository openings is important for preclosure performance considerations and worker health and safety considerations for the proposed high-level radioactive waste repository at Yucca Mountain. This paper presents the results of two and three dimensional numerical analyses which have determined the thermal and stress environments for typical repository openings. In general, it is predicted that openings close to heat sources attain high temperatures and experience a significant stress increase. Openings away from heat sources experience more uniform temperature changes and experience a stress change which results in part from a far-field thermal loading

Three-dimensional modelling of thermal stress in floating zone silicon crystal growth

Science.gov (United States)

Plate, Matiss; Krauze, Armands; Virbulis, Jānis

2018-05-01

During the growth of large diameter silicon single crystals with the industrial floating zone method, undesirable level of thermal stress in the crystal is easily reached due to the inhomogeneous expansion as the crystal cools down. Shapes of the phase boundaries, temperature field and elastic material properties determine the thermal stress distribution in the solid mono crystalline silicon during cylindrical growth. Excessive stress can lead to fracture, generation of dislocations and altered distribution of intrinsic point defects. Although appearance of ridges on the crystal surface is the decisive factor of a dislocation-free growth, the influence of these ridges on the stress field is not completely clear. Here we present the results of thermal stress analysis for 4” and 5” diameter crystals using a quasi-stationary three dimensional mathematical model including the material anisotropy and the presence of experimentally observed ridges which cannot be addressed with axis-symmetric models. The ridge has a local but relatively strong influence on thermal stress therefore its relation to the origin of fracture is hypothesized. In addition, thermal stresses at the crystal rim are found to increase for a particular position of the crystal radiation reflector.

Temperature-induced physiological stress and reproductive characteristics of the migratory seahorse Hippocampus erectus during a thermal stress simulation.

Science.gov (United States)

Qin, Geng; Johnson, Cara; Zhang, Yuan; Zhang, Huixian; Yin, Jianping; Miller, Glen; Turingan, Ralph G; Guisbert, Eric; Lin, Qiang

2018-05-15

Inshore-offshore migration occurs frequently in seahorse species either because of prey opportunities or because it is driven by reproduction, and variations in water temperature may dramatically change migratory seahorse behavior and physiology. The present study investigated the behavioral and physiological responses of the lined seahorse Hippocampus erectus under thermal stress and evaluated the potential effects of different temperatures on its reproduction. The results showed that the thermal tolerance of the seahorses was time dependent. Acute thermal stress (30°C, 2-10 hours) increased the basal metabolic rate (breathing rate) and the expression of stress response genes ( Hsp genes) significantly and further stimulated seahorse appetite. Chronic thermal treatment (30°C, 4 weeks) led to a persistently higher basal metabolic rate, higher stress response gene expression, and higher mortality, indicating that the seahorses could not acclimate to chronic thermal stress and might experience massive mortality due to excessive basal metabolic rates and stress damage. Additionally, no significant negative effects on gonad development or reproductive endocrine regulation genes were observed in response to chronic thermal stress, suggesting that seahorse reproductive behavior could adapt to higher-temperature conditions during migration and within seahorse breeding grounds. In conclusion, this simulation experiment indicated that temperature variations during inshore-offshore migration have no effect on reproduction but promote basal metabolic rates and stress responses significantly. Therefore, we suggest that the high observed tolerance of seahorse reproduction was in line with the inshore-offshore reproductive migration pattern of lined seahorse. © 2018. Published by The Company of Biologists Ltd.

Laser cutting of triangular geometry into 2024 aluminum alloy: Influence of triangle size on thermal stress field

Energy Technology Data Exchange (ETDEWEB)

Yilbas, Bekir Sami; Akhtar, Syed Sohail [King Fahd University of Petroleum and Minerals, Dhahran (Saudi Arabia); Keles, Omer; Boran, Kurtulus [Gazi University, Ankara (Turkmenistan)

2015-08-15

Laser cutting of a triangular geometry into aluminum 2024 alloy is carried out. Thermal stress field in the cutting section is predicted using the finite element code ABAQUS. Surface temperature predictions are validated through the thermocouple data. Morphological changes in the cut section are examined incorporating optical and electron scanning microscopes. The effects of the size of the triangular geometry on thermal stress field are also examined. It is found that surface temperature predictions agree well with thermocouple data. von Mises stress remains high in the region close to the corners of the triangular geometry, which is more pronounced for the small size triangle. This behavior is associated with the occurrence of the high cooling rates in this region. Laser cut edges are free from large scale sideways burning and large size burr attachments. However, some locally scattered dross attachments are observed at the kerf exit.

Thermal Stress Behavior of Micro- and Nano-Size Aluminum Films

International Nuclear Information System (INIS)

Hanabusa, T.; Kusaka, K.; Nishida, M.

2008-01-01

In-situ observation of thermal stresses in thin films deposited on silicon substrate was made by X-ray and synchrotron radiation. Specimens prepared in this experiment were micro- and nano-size thin aluminum films with and without passivation film. The thickness of the film was 1 micrometer for micro-size films and 10, 20 and 50 nanometer for nano-size films. The stress measurement in micro-size films was made by X-ray radiation whereas the measurement of nano-size films was made by synchrotron radiation. Residual stress measurement revealed tensile stresses in all as-deposited films. Thermal stresses were measured in a series of heating- and cooling-stage. Thermal stress behavior of micro-size films revealed hysteresis loop during a heating and cooling process. The width of a hysteresis loop was larger in passivated film that unpassivated film. No hysteresis loops were observed in nano-size films with SiO 2 passivation. Strengthning mechanism in thin films was discussed on a passivation film and a film thickness

Effect of Thermal Stresses on the Failure Criteria of Fiber Composites

DEFF Research Database (Denmark)

Leong, Martin Klitgaard; Sankar, Bhavani V.

2010-01-01

, the latter, called micro-thermal stresses, has not been given much attention. In this paper the Direct Micromechanics Method is used to investigate the effects of micro-thermal stresses on the failure envelope of composites. Using FEA the unit-cell of the composite is analyzed. Assuming the failure criteria...... for the fiber and matrix are known, the exact failure envelope is developed. Using the micromechanics results, the Tsai-Wu failure envelope is modified to account for the micro-thermal stresses. The approach is demonstrated using two example structures at cryogenic temperature....

Cooling of electronic equipment

DEFF Research Database (Denmark)

A. Kristensen, Anders Schmidt

2003-01-01

Cooling of electronic equipment is studied. The design size of electronic equipment decrease causing the thermal density to increase. This affect the cooling which can cause for example failures of critical components due to overheating or thermal induced stresses. Initially a pin fin heat sink...

Thermal stress promotes host mitochondrial degradation in symbiotic cnidarians: are the batteries of the reef going to run out?

Directory of Open Access Journals (Sweden)

Simon R Dunn

Full Text Available The symbiotic relationship between cnidarians and their dinoflagellate symbionts, Symbiodinium spp, which underpins the formation of tropical coral reefs, can be destabilized by rapid changes to environmental conditions. Although some studies have concluded that a breakdown in the symbiosis begins with increased reactive oxygen species (ROS generation within the symbiont due to a decoupling of photosynthesis, others have reported the release of viable symbionts via a variety of host cell derived mechanisms. We explored an alternative model focused upon changes in host cnidarian mitochondrial integrity in response to thermal stress. Mitochondria are often likened to being batteries of the cell, providing energy in the form of ATP, and controlling cellular pathway activation and ROS generation. The overall morphology of host mitochondria was compared to that of associated symbionts under an experimental thermal stress using confocal and electron microscopy. The results demonstrate that hyperthermic stress induces the degradation of cnidarian host mitochondria that is independent of symbiont cellular deterioration. The potential sites of host mitochondrial disruption were also assessed by measuring changes in the expression of genes associated with electron transport and ATP synthesis using quantitative RT-PCR. The primary site of degradation appeared to be downstream of complex III of the electron transport chain with a significant reduction in host cytochrome c and ATP synthase expression. The consequences of reduced expression could limit the capacity of the host to mitigate ROS generation and maintain both organelle integrity and cellular energy supplies. The disruption of host mitochondria, cellular homeostasis, and subsequent cell death irrespective of symbiont integrity highlights the importance of the host response to thermal stress and in symbiosis dysfunction that has substantial implications for understanding how coral reefs will survive

Transient thermal stress wave and vibrational analyses of a thin diamond crystal for X-ray free-electron lasers under high-repetition-rate operation.

Science.gov (United States)

Yang, Bo; Wang, Songwei; Wu, Juhao

2018-01-01

High-brightness X-ray free-electron lasers (FELs) are perceived as fourth-generation light sources providing unprecedented capabilities for frontier scientific researches in many fields. Thin crystals are important to generate coherent seeds in the self-seeding configuration, provide precise spectral measurements, and split X-ray FEL pulses, etc. In all of these applications a high-intensity X-ray FEL pulse impinges on the thin crystal and deposits a certain amount of heat load, potentially impairing the performance. In the present paper, transient thermal stress wave and vibrational analyses as well as transient thermal analysis are carried out to address the thermomechanical issues for thin diamond crystals, especially under high-repetition-rate operation of an X-ray FEL. The material properties at elevated temperatures are considered. It is shown that, for a typical FEL pulse depositing tens of microjoules energy over a spot of tens of micrometers in radius, the stress wave emission is completed on the tens of nanoseconds scale. The amount of kinetic energy converted from a FEL pulse can reach up to ∼10 nJ depending on the layer thickness. Natural frequencies of a diamond plate are also computed. The potential vibrational amplitude is estimated as a function of frequency. Due to the decreasing heat conductivity with increasing temperature, a runaway temperature rise is predicted for high repetition rates where the temperature rises abruptly after ratcheting up to a point of trivial heat damping rate relative to heat deposition rate.

Thermal Electrons in Gamma-Ray Burst Afterglows

Energy Technology Data Exchange (ETDEWEB)

Ressler, Sean M.; Laskar, Tanmoy [Department of Astronomy, University of California, 501 Campbell Hall, Berkeley, CA 94720-3411 (United States)

2017-08-20

To date, nearly all multi-wavelength modeling of long-duration γ -ray bursts has ignored synchrotron radiation from the significant population of electrons expected to pass the shock without acceleration into a power-law distribution. We investigate the effect of including the contribution of thermal, non-accelerated electrons to synchrotron absorption and emission in the standard afterglow model, and show that these thermal electrons provide an additional source of opacity to synchrotron self-absorption, and yield an additional emission component at higher energies. The extra opacity results in an increase in the synchrotron self-absorption frequency by factors of 10–100 for fiducial parameters. The nature of the additional emission depends on the details of the thermal population, but is generally observed to yield a spectral peak in the optical brighter than radiation from the nonthermal population by similar factors a few seconds after the burst, remaining detectable at millimeter and radio frequencies several days later.

Thermal Super-Pixels for Bimodal Stress Recognition

DEFF Research Database (Denmark)

Irani, Ramin; Nasrollahi, Kamal; Dhall, Abhinav

2016-01-01

to be in touch with the body which is not always practical. Contact-free monitoring of the stress by a camera [1, 2] can be an alternative. These systems usually utilize only an RGB or a thermal camera to recognize stress. To the best of our knowledge, the only work on fusion of these two modalities for stress......Stress is a response to time pressure or negative environmental conditions. If its stimulus iterates or stays for a long time, it affects health conditions. Thus, stress recognition is an important issue. Traditional systems for this purpose are mostly contact-based, i.e., they require a sensor...

Concrete creep and thermal stresses:new creep models and their effects on stress development

OpenAIRE

Westman, Gustaf

1999-01-01

This thesis deals with the problem of creep in concrete and its influence on thermal stress development. New test frames were developed for creep of high performance concrete and for measurements of thermal stress development. Tests were performed on both normal strength and high performance concretes. Two new models for concrete creep are proposed. Firstly, a viscoelastic model, the triple power law, is supplemented with two additional functions for an improved modelling of the early age cre...

Theoretical study of lithium clusters by electronic stress tensor

International Nuclear Information System (INIS)

Ichikawa, Kazuhide; Nozaki, Hiroo; Komazawa, Naoya; Tachibana, Akitomo

2012-01-01

We study the electronic structure of small lithium clusters Li_n (n = 2 ∼ 8) using the electronic stress tensor. We find that the three eigenvalues of the electronic stress tensor of the Li clusters are negative and degenerate, just like the stress tensor of liquid. This leads us to propose that we may characterize a metallic bond in terms of the electronic stress tensor. Our proposal is that in addition to the negativity of the three eigenvalues of the electronic stress tensor, their degeneracy characterizes some aspects of the metallic nature of chemical bonding. To quantify the degree of degeneracy, we use the differential eigenvalues of the electronic stress tensor. By comparing the Li clusters and hydrocarbon molecules, we show that the sign of the largest eigenvalue and the differential eigenvalues could be useful indices to evaluate the metallicity or covalency of a chemical bond.

Gene Expression Dynamics Accompanying the Sponge Thermal Stress Response.

Science.gov (United States)

Guzman, Christine; Conaco, Cecilia

2016-01-01

Marine sponges are important members of coral reef ecosystems. Thus, their responses to changes in ocean chemistry and environmental conditions, particularly to higher seawater temperatures, will have potential impacts on the future of these reefs. To better understand the sponge thermal stress response, we investigated gene expression dynamics in the shallow water sponge, Haliclona tubifera (order Haplosclerida, class Demospongiae), subjected to elevated temperature. Using high-throughput transcriptome sequencing, we show that these conditions result in the activation of various processes that interact to maintain cellular homeostasis. Short-term thermal stress resulted in the induction of heat shock proteins, antioxidants, and genes involved in signal transduction and innate immunity pathways. Prolonged exposure to thermal stress affected the expression of genes involved in cellular damage repair, apoptosis, signaling and transcription. Interestingly, exposure to sublethal temperatures may improve the ability of the sponge to mitigate cellular damage under more extreme stress conditions. These insights into the potential mechanisms of adaptation and resilience of sponges contribute to a better understanding of sponge conservation status and the prediction of ecosystem trajectories under future climate conditions.

Stress and Displacement Analysis of Microreactors during Thermal and Vacuum Loading

Science.gov (United States)

2017-09-07

ARL-TR-8121 ● SEP 2017 US Army Research Laboratory Stress and Displacement Analysis of Microreactors during Thermal and Vacuum...is no longer needed. Do not return it to the originator. ARL-TR-8121 ● SEP 2017 US Army Research Laboratory Stress and...TITLE AND SUBTITLE Stress and Displacement Analysis of Microreactors during Thermal and Vacuum Loading 5a. CONTRACT NUMBER 5b. GRANT NUMBER

Thermal stresses in an orthotropic rectangular plate with a rigid ribbonlike inclusion

International Nuclear Information System (INIS)

Sumi, N.

1981-01-01

On the basis of the complex variable method for determining the stationary two-dimensional thermal stresses, the thermal stresses in an orthotropic rectangular plate with a rigid ribbonlike inclusion under a steady state temperature field is considered. The solution is found by the analytic continuation argument and the modified mapping-collocation technique. Numerical results indicate a dependence of the orthotropic stress intensity factors on the thermal, elastic and geometrical constants over a certain parameter range. (orig.)

Power Electronics Thermal Management Research: Annual Progress Report

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilberto [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

2017-10-19

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Reliable WBG devices are capable of operating at elevated temperatures (≥ 175 °Celsius). However, packaging WBG devices within an automotive inverter and operating them at higher junction temperatures will expose other system components (e.g., capacitors and electrical boards) to temperatures that may exceed their safe operating limits. This creates challenges for thermal management and reliability. In this project, system-level thermal analyses are conducted to determine the effect of elevated device temperatures on inverter components. Thermal modeling work is then conducted to evaluate various thermal management strategies that will enable the use of highly efficient WBG devices with automotive power electronic systems.

Stress hysteresis during thermal cycling of plasma-enhanced chemical vapor deposited silicon oxide films

Science.gov (United States)

Thurn, Jeremy; Cook, Robert F.

2002-02-01

The mechanical response of plasma-enhanced chemical vapor deposited SiO2 to thermal cycling is examined by substrate curvature measurement and depth-sensing indentation. Film properties of deposition stress and stress hysteresis that accompanied thermal cycling are elucidated, as well as modulus, hardness, and coefficient of thermal expansion. Thermal cycling is shown to result in major plastic deformation of the film and a switch from a compressive to a tensile state of stress; both athermal and thermal components of the net stress alter in different ways during cycling. A mechanism of hydrogen incorporation and release from as-deposited silanol groups is proposed that accounts for the change in film properties and state of stress.

Thermal stress analysis of gravity support system for ITER based on ANSYS

International Nuclear Information System (INIS)

Liang Shangming; Yan Xijiang; Huang Yufeng; Wang Xianzhou; Hou Binglin; Li Pengyuan; Jian Guangde; Liu Dequan; Zhou Caipin

2009-01-01

A method for building the finite element model of the gravity support system for International Thermonuclear Experimental Reactor (ITER) was proposed according to the characteristics of the gravity support system with the cyclic symmetry. A mesh dividing method, which has high precision and an acceptable calculating scale, was used, and a three dimensional finite element model for the toroidal 20 degree sector of the gravity support system was built by using ANSYS. Meantime, the steady-state thermal analysis and thermal-structural coupling analysis of the gravity support system were performed. The thermal stress distributions and the maximal thermal stress values of all parts of the gravity support system were obtained, and the stress intensity of parts of the gravity support system was analyzed. The results of thermal stress analysis lay the solid foundation for design and improvement for gravity supports system for ITER. (authors)

Development of thermal stress screening method. Application of green function method

International Nuclear Information System (INIS)

Furuhashi, Ichiro; Shibamoto, Hiroshi; Kasahara, Naoto

2004-01-01

This work was achieved for the development of the screening method of thermal transient stresses in FBR components. We proposed an approximation method for evaluations of thermal stress under variable heat transfer coefficients (non-linear problems) using the Green functions of thermal stresses with constant heat transfer coefficients (linear problems). Detailed thermal stress analyses provided Green functions for a skirt structure and a tube-sheet of Intermediate Heat Exchanger. The upper bound Green functions were obtained by the analyses using those upper bound heat transfer coefficients. The medium and the lower bound Green functions were got by the analyses of those under medium and the lower bound heat transfer coefficients. Conventional evaluations utilized the upper bound Green functions. On the other hand, we proposed a new evaluation method by using the upper bound, medium and the lower bound Green functions. The comparison of above results gave the results as follows. The conventional evaluations were conservative and appropriate for the cases under one fluid thermal transient structure such as the skirt. The conventional evaluations were generally conservative for the complicated structures under two or more fluids thermal transients such as the tube-sheet. But the danger locations could exists for the complicated structures under two or more fluids transients, namely the conventional evaluations were non-conservative. The proposed evaluations gave good estimations for these complicated structures. Though above results, we have made the basic documents of the screening method of thermal transient stresses using the conventional method and the new method. (author)

Stress assessment in piping under synthetic thermal loads emulating turbulent fluid mixing

Energy Technology Data Exchange (ETDEWEB)

Costa Garrido, Oriol, E-mail: oriol.costa@ijs.si; El Shawish, Samir, E-mail: samir.elshawish@ijs.si; Cizelj, Leon, E-mail: leon.cizelj@ijs.si

2015-03-15

Highlights: • Generation of complex space-continuous and time-dependent temperature fields. • 1D and 3D thermo-mechanical analyses of pipes under complex surface thermal loads. • Surface temperatures and stress fluctuations are highly linearly correlated. • 1D and 3D results agree for a wide range of Fourier and Biot numbers. • Global thermo-mechanical loading promotes non-equibiaxial stress state. - Abstract: Thermal fatigue assessment of pipes due to turbulent fluid mixing in T-junctions is a rather difficult task because of the existing uncertainties and variability of induced thermal stresses. In these cases, thermal stresses arise on three-dimensional pipe structures due to complex thermal loads, known as thermal striping, acting at the fluid-wall interface. A recently developed approach for the generation of space-continuous and time-dependent temperature fields has been employed in this paper to reproduce fluid temperature fields of a case study from the literature. The paper aims to deliver a detailed study of the three-dimensional structural response of piping under the complex thermal loads arising in fluid mixing in T-junctions. Results of three-dimensional thermo-mechanical analyses show that fluctuations of surface temperatures and stresses are highly linearly correlated. Also, surface stress fluctuations, in axial and hoop directions, are almost equi-biaxial. These findings, representative on cross sections away from system boundaries, are moreover supported by the sensitivity analysis of Fourier and Biot numbers and by the comparison with standard one-dimensional analyses. Agreement between one- and three-dimensional results is found for a wide range of studied parameters. The study also comprises the effects of global thermo-mechanical loading on the surface stress state. Implemented mechanical boundary conditions develop more realistic overall system deformation and promote non-equibiaxial stresses.

Mitochondrial terminal alternative oxidase and its enhancement by thermal stress in the coral symbiont Symbiodinium

Science.gov (United States)

Oakley, Clinton A.; Hopkinson, Brian M.; Schmidt, Gregory W.

2014-06-01

A terminal electron acceptor alternative to mitochondrial cytochrome c oxidase (COX), mitochondrial alternative oxidase (AOX), is ubiquitous in higher plants and represented in nearly every algal taxon but is poorly documented in dinoflagellates. AOX competes for electrons with the conventional COX and has been hypothesized to function as a means of reducing oxidative stress in mitochondria, as well as a potential mechanism for ameliorating thermal and other physiological stressors. Here, the presence of an active AOX in cultured Symbiodinium was assayed by the response of oxygen consumption to the AOX inhibitor salicylhydroxamic acid (SHAM) and the COX inhibitor cyanide (CN). CN-insensitive, SHAM-sensitive oxygen consumption was found to account for a large portion (26 %) of Symbiodinium dark respiration and is consistent with high levels of AOX activity. This experimental evidence of the existence of a previously unreported terminal oxidase was further corroborated by analysis of publicly available Symbiodinium transcriptome data. The potential for enhanced AOX expression to play a compensatory role in mediating thermal stress was supported by inhibitor assays of cultured Symbiodinium at low (18 °C), moderate (26 °C), and high (32 °C) temperature conditions. Maximum capacity of the putative AOX pathway as a proportion of total dark oxygen consumption was found to increase from 26 % at 26 °C to 45 % and 53 % at 18 °C and 32 °C, respectively, when cells were acclimated to the treatment temperatures. Cells assayed at 18 and 32 °C without acclimation exhibited either the same or lower AOX capacity as controls, suggesting that the AOX protein is upregulated under temperature stress. The physiological implications for the presence of AOX in the coral/algal symbiosis and its potential role in response to many forms of biotic and abiotic stress, particularly oxidative stress, are discussed.

Thermal stress analysis for fatigue damage evaluation at a mixing tee

International Nuclear Information System (INIS)

Kamaya, Masayuki; Nakamura, Akira

2011-01-01

Highlights: → Thermal stress and fatigue damage have been analyzed for a mixing tee. → Fatigue damage was accumulated near boundaries of the cold spot. → It was found that fatigue damage was brought about by fluctuation of cold spot. → Simple one-dimensional analysis could derive stress for fatigue evaluation. - Abstract: Fatigue cracks have been found at mixing tees where fluids of different temperature flow in. In this study, the thermal stress at a mixing tee was calculated by the finite element method using temperature transients obtained by a fluid dynamics simulation. The simulation target was an experiment for a mixing tee, in which cold water flowed into the main pipe from a branch pipe. The cold water flowed along the main pipe wall and caused a cold spot, at which the membrane stress was relatively large. Based on the evaluated thermal stress, the magnitude of the fatigue damage was assessed according to the linear damage accumulation rule and the rain-flow procedure. Precise distributions of the thermal stress and fatigue damage could be identified. Relatively large axial stress occurred downstream from the branch pipe due to the cold spot. The variation ranges of thermal stress and fatigue damage became large near the position 20 o from the symmetry line in the circumferential direction. The position of the cold spot changed slowly in the circumferential direction, and this was the main cause of the fatigue damage. The fatigue damage was investigated for various differences in the temperature between the main and branch pipes. Since the magnitude of accumulated damage increased abruptly when the temperature difference exceeded the value corresponding to the fatigue limit, it was suggested that the stress amplitude should be suppressed less than the fatigue limit. In the thermal stress analysis for fatigue damage assessment, it was found that the detailed three-dimensional structural analysis was not required. Namely, for the current case, a one

Simplified calculation of thermal stresses - on the reduction of effort in the stress analysis of reactor components

International Nuclear Information System (INIS)

Karow, K.

1984-01-01

The fatigue behaviour of reactor components is predominantly determined from the in-service thermal stresses. The calculation of such stresses for a number of temperature transients in the adjacent fluid may be expensive, particularly with complicated structures. Under certain conditions this expense can be reduced considerably with the aid of a rule, which permits interpolation of thermal stresses from known reference values instead of calculation. This paper presents the derivation and method of application of this interpolation rule. The derivation procedure is based on well-known proportionalities between thermal stress range Δsigma in the structure and temperature change ΔT and rate of change T of the fluid in the extreme cases of an ideal thermal shock and quasi-steady-state conditions, respectively. For the real transients in between the relationship Δsigma proportional (ΔT)sup(x) Tsup(1-x)αsup(y) is proposed, where x is the shock-degree and lies between 0 and 1, and, additionally, y designates the influence of the heat transfer coefficient α. This formula yields the interpolation rule. The rule permits interpolation of stress ranges for additional thermal transients from at least 3 reference stresses via x and y. The procedure is applicable to any metallic structure, reduces fatigue analysis effort considerably and yields excellent results. The paper is split up into 2 parts. In the following the derivation of the rule is presented. The second part describes its application and will be published shortly. (orig.)

Thermal shock behavior of platinum aluminide bond coat/electron beam-physical vapor deposited thermal barrier coatings

Energy Technology Data Exchange (ETDEWEB)

Xu, Zhenhua, E-mail: zhxuciac@163.com [Beijing Institute of Aeronautical Materials, Department 5, P.O. Box 81-5, Beijing 100095 (China); Dai, Jianwei [Beijing Institute of Aeronautical Materials, Department 5, P.O. Box 81-5, Beijing 100095 (China); Niu, Jing [Shenyang Liming Aero-engine (Group) Corporation Ltd., Institute of Metallurgical Technology, Technical Center, Shengyang 110043 (China); Li, Na; Huang, Guanghong; He, Limin [Beijing Institute of Aeronautical Materials, Department 5, P.O. Box 81-5, Beijing 100095 (China)

2014-12-25

Highlights: • TBCs of (Ni, Pt)Al bond coat with grit blasting process and YSZ ceramic coating. • Grain boundary ridges are the sites for spallation damage initiation in TBCs. • Ridges removed, cavities formation appeared and the damage initiation deteriorated. • Damage initiation and progression at interface lead to a buckling failure. - Abstract: Thermal barrier coating systems (TBCs) including of chemical vapor deposited (Ni, Pt)Al bond coat with grit blasting process and electron beam physical vapor deposited Y{sub 2}O{sub 3}-stabilized-ZrO{sub 2} (YSZ) ceramic coating were investigated. The phase structures, surface and cross-sectional morphologies, thermal shock behaviors and residual stresses of the coatings were studied in detail. Grain boundary ridges still remain on the surface of bond coat prior to the deposition of the ceramic coating, which are shown to be the major sites for spallation damage initiation in TBCs. When these ridges are mostly removed, they appear some of cavities formation and then the damage initiation mode is deteriorated. Damage initiation and progression occurs at the bond coat to thermally grown oxide (TGO) interface leading to a buckling failure behavior. A buckle failure once started may be arrested when it runs into a region of high bond coat to TGO interface toughness. Thus, complete failure requires further loss in toughness of the bond coat to TGO interface during cooling. The suppressed cavities formation, the removed ridges at the grain boundaries, the relative high TGO to bond coat interface toughness, the uniform growth behavior of TGO thickening and the lower of the residual stress are the primary factors for prolonging the lifetime of TBCs.

Heat transfer and thermal stress analysis in fluid-structure coupled field

International Nuclear Information System (INIS)

Li, Ming-Jian; Pan, Jun-Hua; Ni, Ming-Jiu; Zhang, Nian-Mei

2015-01-01

In this work, three-dimensional simulation on conjugate heat transfer in a fluid-structure coupled field was carried out. The structure considered is from the dual-coolant lithium-lead (DCLL) blanket, which is the key technology of International Thermo-nuclear Experimental Reactor (ITER). The model was developed based on finite element-finite volume method and was employed to investigate mechanical behaviours of Flow Channel Insert (FCI) and heat transfer in the blanket under nuclear reaction. Temperature distribution, thermal deformation and thermal stresses were calculated in this work, and the effects of thermal conductivity, convection heat transfer coefficient and flow velocity were analyzed. Results show that temperature gradients and thermal stresses of FCI decrease when FCI has better heat conductivity. Higher convection heat transfer coefficient will result in lower temperature, thermal deformations and stresses in FCI. Analysis in this work could be a theoretical basis of blanket optimization. - Highlights: • We use FVM and FEM to investigate FCI structural safety considering heat transfer and FSI effects. • Higher convective heat transfer coefficient is beneficial for the FCI structural safety without much affect to bulk flow temperature. • Smaller FCI thermal conductivity can better prevent heat leakage into helium, yet will increase FCI temperature gradient and thermal stress. • Three-dimensional simulation on conjugate heat transfer in a fluid-structure coupled field was carried out

Numerical Study on the Thermal Stress and its Formation Mechanism of a Thermoelectric Device

Science.gov (United States)

Pan, Tao; Gong, Tingrui; Yang, Wei; Wu, Yongjia

2018-06-01

The strong thermo-mechanical stress is one of the most critical failure mechanisms that affect the durability of thermoelectric devices. In this study, numerical simulations on the formation mechanism of the maximum thermal stress inside the thermoelectric device have been performed by using finite element method. The influences of the material properties and the thermal radiation on the thermal stress have been examined. The results indicate that the maximum thermal stress was located at the contact position between the two materials and occurred due to differential thermal expansions and displacement constraints of the materials. The difference in the calculated thermal stress value between the constant and the variable material properties was between 3% and 4%. At a heat flux of 1 W·cm-2 and an emissivity of 0.5, the influence of the radiation heat transfer on the thermal stress was only about 5%; however, when the heat flux was 20 W·cm-2 and the emissivity was 0.7, the influence of the radiation heat transfer was more than 30%.

Dynamic characteristics of rotating pretwisted clamped-clamped beam under thermal stress

International Nuclear Information System (INIS)

Zhang, Bo; Li, Yueming; Lu, Wei Zhen

2016-01-01

Effects of thermal stress on the vibration characteristics, buckling limit and critical speed of a rotating pretwisted beam clamped to rigid hub at a stagger angle were investigated. By considering the work done by thermal stress, the thermal influence on stiffness matrix was introduced in the dynamic model. The motion equations were derived based on Lagrange equation by employing three pure Cartesian deformation variables combined with nonlinear von Karman strain formula. Numerical investigations studied the modal characteristics of the beam. Numerical results calculated from a commercial finite element code and obtained with the present modeling method were in good agreement with the previous results reported in the literature. The combined softening effects due to the thermal stress and the rotation motion were observed. Furthermore, it is shown that the inclusion of thermal stress is necessary for blades operating under a high temperature field. Buckling thermal loads and the critical rotating speed were calculated through solving the corresponding nonlinear equations numerically, and some pertinent conclusions are outlined. It is also found that the peak value position of the first mode shape approaches to the tip of blade with the increment of rotating speed and hub radius. However, the variation in the environment temperature causes only a slight alteration in the mode shape

Dynamic characteristics of rotating pretwisted clamped-clamped beam under thermal stress

Energy Technology Data Exchange (ETDEWEB)

Zhang, Bo; Li, Yueming [State Key Laboratory for Strength and Vibration of Mechanical Structures, Shaanxi Key Laboratory of Environment and Control for Flight Vehicle, School of Aerospace, Xi' an Jiaotong UniversityXi' an (China); Lu, Wei Zhen [Dept. of Civil and Architectural Engineering, City University of Hong Kong, Hong Kong (China)

2016-09-15

Effects of thermal stress on the vibration characteristics, buckling limit and critical speed of a rotating pretwisted beam clamped to rigid hub at a stagger angle were investigated. By considering the work done by thermal stress, the thermal influence on stiffness matrix was introduced in the dynamic model. The motion equations were derived based on Lagrange equation by employing three pure Cartesian deformation variables combined with nonlinear von Karman strain formula. Numerical investigations studied the modal characteristics of the beam. Numerical results calculated from a commercial finite element code and obtained with the present modeling method were in good agreement with the previous results reported in the literature. The combined softening effects due to the thermal stress and the rotation motion were observed. Furthermore, it is shown that the inclusion of thermal stress is necessary for blades operating under a high temperature field. Buckling thermal loads and the critical rotating speed were calculated through solving the corresponding nonlinear equations numerically, and some pertinent conclusions are outlined. It is also found that the peak value position of the first mode shape approaches to the tip of blade with the increment of rotating speed and hub radius. However, the variation in the environment temperature causes only a slight alteration in the mode shape.

Heat transfer and thermal stress analysis in grooved tubes

Indian Academy of Sciences (India)

ANSYS (1997) computer code has been used to analyse the thermal ... The numerical method is used succesfully to solve the governing equations ... thermal stress is an important criterion for consideration in the design of new compact heat.

Stress in film/substrate system due to diffusion and thermal misfit effects

International Nuclear Information System (INIS)

Shao Shanshan; Xuan Fuzhen; Wang Zhengdong; Tu Shantung

2009-01-01

The stress in film/substrate systems has been analysed taking into consideration the coupling effects of diffusion and thermal misfit within the framework of Fick's second law. The solution of diffusion-induced stress in a film/substrate system involving the thermal misfit stress feedback is developed. The effects of modulus ratios, diffusivity ratios, thickness ratios of the substrate and the film and the partial molar volume of the diffusing component on the stress distribution in the film/substrate system are then discussed with the help of the finite difference method. Results indicate that the stresses in the film/substrate system vary with diffusion time. Diffusion enhances the magnitudes of film stress when the thermal misfit stress is compressive in the film. Furthermore, the absolute values of stress in the film increase with the increasing modulus ratios of the substrate and film, while they reduce with the increasing partial molar volume of the diffusing component and the diffusivity ratio of the substrate and the film.

Effects of location, thermal stress and residual stress on corner cracks in nozzles with cladding

International Nuclear Information System (INIS)

McLean, J.L.; Cohen, L.M.; Besuner, P.M.

1979-01-01

The stress intensity factors (K 1 ) for corner cracks in a boiling water reactor feedwater nozzle with stainless steel cladding are obtained for loading by internal pressure and a fluid quench in the nozzle. Conditions both with and without residual stress in the component are considered. The residual stress is simulated by means of a reference temperature change. The stress distribution for the uncracked structure is obtained from a three-dimensional finite element model. A three-dimensional influence function (IF) method, in conjunction with the boundary-integral equation method for structural analysis, is employed to compute K 1 values from the uncracked stress distribution. For each type of loading K 1 values are given for cracks at 15 nozzle locations and for 6 crack depths. Reasonable agreement is noted between calculated and previously published pressure-induced K 1 values. Comparisons are made to determine the effect on K 1 of crack location, thermal stress and residual stress, as compared with pressure stress. For the thermal transient it is shown that K 1 for small crack depths is maximised early in the transient, while K 1 for large cracks is maximised later under steady state conditions. Computation should, therefore, be made for several transient time points and the maximum K 1 for a given crack depth should be used for design analysis. It is concluded that the effects on K 1 of location, thermal stresses and residual stresses are significant and generally too complex to evaluate without advanced numerical procedures. The utilised combination of finite element analysis of the uncracked structure and three-dimensional influence function analysis of the cracked structure is demonstrated and endorsed. (author)

Electrically and Thermally Conducting Nanocomposites for Electronic Applications

Directory of Open Access Journals (Sweden)

Daryl Santos

2010-02-01

Full Text Available Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i dispersion of carbon nanotubes in the polymer host, (ii carbon nanotube-polymer interaction and the nature of the interface, and (iii alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.

The thermal environment effect on the comfort of electronic factory worker

Science.gov (United States)

Nurul Huda, Listiani

2018-03-01

In this paper, thermal comfort issues of the operators working on one of the electronics companies in the evaporator area are observed. The objective of this study is to reduce Percentage of Dissatisfied (PD) of operators in an effort to improve the work productivity. PD is predicted using CBE Thermal Comfort Tool by measuring the thermal variables around the evaporator area and by calculating the Heat Stress Index (HSI). The operator productivity is analyzed by Wet Bulb Globe Thermometer (WBGT) Work-Rest Chart. The PD of operators before and after improvement is compared. The results showed that the average temperature around the operators area at evaporator station is high with average WBGT of 33,6°C. HSI value is 51.95 indicating that the effect of 8-h exposure is severe strain with work impact is health threat for unit operators and acclimatization is necessary. The PD value is 96% indicating that almost all operators feel uncomfortable at work. These indicate that the thermal environment should be improved. The proposed improvement is by installing water cooled and sprayed into the evaporator area. This installation is able to reduce HSI and PD by more 70% and more 60%, respectively. These findings indicate that improving the thermal environment will be able to improve working comfort which will further affect the level of work productivity.

Prior stress exposure increases pain behaviors in a rat model of full thickness thermal injury.

Science.gov (United States)

Nyland, Jennifer E; McLean, Samuel A; Averitt, Dayna L

2015-12-01

Thermal burns among individuals working in highly stressful environments, such as firefighters and military Service Members, are common. Evidence suggests that pre-injury stress may exaggerate pain following thermal injury; however current animal models of burn have not evaluated the potential influence of pre-burn stress. This sham-controlled study evaluated the influence of prior stress exposure on post-burn thermal and mechanical sensitivity in male Sprague-Dawley rats. Rats were exposed to 20 min of inescapable swim stress or sham stress once per day for three days. Exposure to inescapable swim stress (1) increased the intensity and duration of thermal hyperalgesia after subsequent burn and (2) accelerated the onset of thermal hyperalgesia and mechanical allodynia after subsequent burn. This stress-induced exacerbation of pain sensitivity was reversed by pretreatment and concurrent treatment with the serotonin-norepinephrine reuptake inhibitor (SNRI) duloxetine. These data suggest a better understanding of mechanisms by which prior stress augments pain after thermal burn may lead to improved pain treatments for burn survivors. Copyright © 2015 Elsevier Ltd and ISBI. All rights reserved.

3D numerical thermal stress analysis of the high power target for the SLC Positron Source

International Nuclear Information System (INIS)

Reuter, E.M.; Hodgson, J.A.

1991-05-01

The volumetrically nonuniform power deposition of the incident 33 GeV electron beam in the SLC Positron Source Target is hypothesized to be the most likely cause target failure. The resultant pulsed temperature distributions are known to generate complicated stress fields with no known closed-form analytical solution. 3D finite element analyses of these temperature distributions and associated thermal stress fields in the new High Power Target are described here. Operational guidelines based on the results of these analyses combined with assumptions made about the fatigue characteristics of the exotic target material are proposed. 6 refs., 4 figs

Universal treatment of plumes and stresses for pressurized thermal shock evaluations

International Nuclear Information System (INIS)

Theofanous, T.G.; Angelini, S.; Yan, H.

1991-01-01

Thermally-induced stresses in a reactor pressure vessel wall, as a result of high-pressure safety injection, are an essential component of integrated risk analyses of pressurized thermal shock transients. Limiting cooldowns arise when this injection occurs under stagnated loop conditions which, in turn, correspond to a rather narrow range (in size) of small-break loss-of-coolant accidents. Moreover, at these conditions, the flow is thermally stratified, and in addition to the global cooldown, one must be concerned about the additional cooling potential due to the downcomer plumes formed by the cold streams pouring out of the cold legs. In the Nuclear Regulatory Commission's Integrated Pressurized Thermal Shock (IPTS) study, this stratification was calculated with the codes REMIX/NEWMIX. A comprehensive comparison with all available experimental data has currently been compiled. The stress analysis using this input was carried out at Oak Ridge National Laboratory using a one-dimensional approximation with the intent to conservatively bound the magnitude of thermal stresses

Transport of runaway and thermal electrons due to magnetic microturbulence

International Nuclear Information System (INIS)

Mynick, H.E.; Strachan, J.D.

1981-01-01

The ratio of the runaway electron confinement to thermal electron energy confinement is derived for tokamaks where both processes are determined by free streaming along stochastic magnetic field lines. The runaway electron confinement is enhanced at high runaway electron energies due to phase averaging over the magnetic perturbations when the runaway electron drift surfaces are displaced from the magnetic surfaces. Comparison with experimental data from LT-3, Ormak, PLT, ST, and TM-3 indicates that magnetic stochasticity may explain the relative transport rates of runaways and thermal electron energy

Thermal stress relieving of dilute uranium alloys

International Nuclear Information System (INIS)

Eckelmeyer, K.H.

1981-01-01

The kinetics of thermal stress relieving of uranium - 2.3 wt % niobium, uranium - 2.0 wt % molybdenum, and uranium - 0.75 wt % titanium are reported and discussed. Two temperature regimes of stress relieving are observed. In the low temperature regime (T 0 C) the process appears to be controlled by an athermal microplasticity mechanism which can be completely suppressed by prior age hardening. In the high temperature regime (300 0 C 0 C) the process appears to be controlled by a classical diffusional creep mechanism which is strongly dependent on temperature and time. Stress relieving is accelerated in cases where it occurs simultaneously with age hardening. The potential danger of residual stress induced stress corrosion cracking of uranium alloys is discussed

Thermal stress evaluation of the Viking RTG heat shield

International Nuclear Information System (INIS)

Stadter, J.T.; Weiss, R.O.

1976-03-01

Thermal stress analyses of the Viking RTG heat shield are presented. The primary purpose of the analyses was to determine the effects of the end cap and the finite length of the heat shield on the peak tensile stress in the barrel wall. The SAAS III computer code was used to calculate the thermal stresses; axisymmetric and plane section analyses were performed for a variety of temperature distributions. The study consisted of three parts. In the first phase, the influence of the end cap on the barrel wall stresses was examined by parametrically varying the modulus of elasticity of the contact zone between the end cap and the barrel. The second phase was concerned with stresses occurring as a result of an orbital decay reentry trajectory, and the effects of the magnitude and shape of the axial temperature gradient. The final part of the study was concerned with the circumferentially nonuniform temperature distribution which develops during a side-on stable reentry. The last part includes a comparison of stresses generated for a hexagonal cross section with those generated for a circular cross section

Thermal Stress FE Analysis of Large-scale Gas Holder Under Sunshine Temperature Field

Science.gov (United States)

Li, Jingyu; Yang, Ranxia; Wang, Hehui

2018-03-01

The temperature field and thermal stress of Man type gas holder is simulated by using the theory of sunshine temperature field based on ASHRAE clear-sky model and the finite element method. The distribution of surface temperature and thermal stress of gas holder under the given sunshine condition is obtained. The results show that the thermal stress caused by sunshine can be identified as one of the important factors for the failure of local cracked oil leakage which happens on the sunny side before on the shady side. Therefore, it is of great importance to consider the sunshine thermal load in the stress analysis, design and operation of large-scale steel structures such as the gas holder.

Thermal Spray Applications in Electronics and Sensors: Past, Present, and Future

Science.gov (United States)

Sampath, Sanjay

2010-09-01

Thermal spray has enjoyed unprecedented growth and has emerged as an innovative and multifaceted deposition technology. Thermal spray coatings are crucial to the enhanced utilization of various engineering systems. Industries, in recognition of thermal spray's versatility and economics, have introduced it into manufacturing environments. The majority of modern thermal spray applications are "passive" protective coatings, and they rarely perform an electronic function. The ability to consolidate dissimilar material multilayers without substrate thermal loading has long been considered a virtue for thick-film electronics. However, the complexity of understanding/controlling materials functions especially those resulting from rapid solidification and layered assemblage has stymied expansion into electronics. That situation is changing: enhancements in process/material science are allowing reconsideration for novel electronic/sensor devices. This review critically examines past efforts in terms of materials functionality from a device perspective, along with ongoing/future concepts addressing the aforementioned deficiencies. The analysis points to intriguing future possibilities for thermal spray technology in the world of thick-film sensors.

Thermal stress measurement in continuous welded rails using the hole-drilling method

Science.gov (United States)

Zhu, Xuan; Lanza di Scalea, Francesco; Fateh, Mahmood

2016-04-01

The absence of expansion joints in Continuous Welded Rail (CWR) has created the need for the railroad industry to determine the in-situ level of thermal stresses so as to prevent train accidents caused by rail buckling in hot weather and by rail breakage in cold weather. The development of non-destructive or semi-destructive methods for determining the level of thermal stresses in rails is today a high research priority. This study explores the known hole-drilling method as a possible solution to this problem. A new set of calibration coefficients to compute the relieved stress field with the finer hole depth increments was determined by a 3D Finite Element Analysis that modeled the entire hole geometry, including the mechanics of the hole bottom and walls. To compensate the residual stress components, a linear relationship was experimentally established between the longitudinal and the vertical residual stresses of two common sizes of rails, the 136RE and the 141RE, with statistical significance. This result was then utilized to isolate the longitudinal thermal stress component in hole-drilling tests conducted on the 136RE and 141RE thermally-loaded rails at the Large-scale CWR Test-bed of UCSD's Powell Research Laboratories. The results from the Test-bed showed that the hole-drilling procedure, with the appropriate residual stress compensation, can indeed estimate the in-situ thermal stresses to achieve a +/-5°F accuracy of Neutral Temperature determination with a 90% statistical confidence, which is the desired industry gold standard.

Numerical Study of Thermal Stresses for the Semiconductor CdZnTe in Vertical Bridgman

OpenAIRE

Jamai , Hanen; El Ganaoui , M.; Sammouda , Habib; Pateyron , Bernard

2015-01-01

International audience; The aim of this work is to present a numerical simulation of thermal stress in directional solidification of CdZnTe in vertical Bridgman apparatus. Especial attention will be attributed to show the importance of cooling temperature and time's growth affecting the thermal stress. Furthermore, we will focus on investigating the thermal stress' components and their distribution in crystal, which gives a detailed about the stress distribution and consequently on the distri...

Spontaneous generation of electromagnetic waves in plasmas with electron thermal flux

International Nuclear Information System (INIS)

Okada, Toshio

1977-01-01

Spontaneous generation of propagating electromagnetic fields due to a microinstability is investigated for plasmas which convey electron thermal fluxes. The following two cases are examined: 1) Electromagnetic fields spontaneously excited by electrons in a velocity distribution of skewed Maxwellian type. 2) Electromagnetic waves generated by electrons in a velocity distribution which consists of a main part and a high energy part. In this case, the electron thermal flux can be very high. In both cases, induced electromagnetic waves with relatively low frequencies propagate parallel to the direction of Thermal flux. (auth.)

Numerical evaluation of stress intensity factor for vessel and pipe subjected to thermal shock

International Nuclear Information System (INIS)

Kim, Y.W.; Lee, H.Y.; Yoo, B.

1994-01-01

The thermal weight function method and the finite element method were employed in the numerical computation of the stress intensity factor for a cracked vessel and the cracked pipe subjected to thermal shock. A wall subjected to thermal shock was analyzed, and it has been shown that the effect of thermal shock on the stress intensity factor is dominant for the crack with small crack length to thickness ratio. Convection at the crack face had an influence on the stress intensity factor in the early stage of thermal shock. (Author)

Numerical simulations on the temperature gradient and thermal stress of a thermoelectric power generator

International Nuclear Information System (INIS)

Wu, Yongjia; Ming, Tingzhen; Li, Xiaohua; Pan, Tao; Peng, Keyuan; Luo, Xiaobing

2014-01-01

Highlights: • An appropriate ceramic plate thickness is effective in alleviating the thermal stress. • A smaller distance between thermo-pins can help prolong lifecycle of the TE module. • Either a thicker or a thinner copper conducting strip effectively reduces thermal stress. • A suitable tin soldering thickness will alleviate thermal stress intensity and increase thermal efficiency. - Abstract: Thermoelectric generator is a device taking advantage of the temperature difference in thermoelectric material to generate electric power, where the higher the temperature difference of the hot-cold ends, the higher the efficiency will be. However, higher temperature or higher heat flux upon the hot end will cause strong thermal stress which will negatively influence the lifecycle of the thermoelectric module. This phenomenon is very common in industrial applications but seldom has research work been reported. In this paper, numerical analysis on the thermodynamics and thermal stress performance of the thermoelectric module has been performed, considering the variation on the thickness of materials; the influence of high heat flux on thermal efficiency, power output, and thermal stress has been examined. It is found that under high heat flux imposing upon the hot end, the thermal stress is so strong that it has a decisive effect on the life expectation of the device. To improve the module’s working condition, different geometrical configurations are tested and the optimum sizes are achieved. Besides, the side effects on the efficiency, power output, and open circuit voltage output of the thermoelectric module are taken into consideration

Thermal shock behavior of W-ZrC/Sc2O3 composites under two different transient events by electron and laser irradiation

Science.gov (United States)

Chen, Hong-Yu; Luo, Lai-Ma; Zan, Xiang; Xu, Qiu; Tokunaga, Kazutoshi; Liu, Jia-Qin; Zhu, Xiao-Yong; Cheng, Ji-Gui; Wu, Yu-Cheng

2018-02-01

The transient thermal shock behaviors of W-ZrC/Sc2O3 composites with different ZrC contents were evaluated using transient thermal shock test by electron and laser beams. The effects of different ZrC doping contents on the surface morphology and thermal shock resistance of W-ZrC/Sc2O3 composites were then investigated. Similarity and difference between effects of electron and laser beam transient heat loading were also discussed in this study. Repeated heat loading resulted in thermal fatigue of the irradiated W-ZrC/Sc2O3 samples by thermal stress, leading to the rough surface morphologies with cracks. After different transient thermal tests, significant surface roughening, cracks, surface melting, and droplet ejection occurred. W-2vol.%Sc2O3 sample has superior thermal properties and greater resistance to surface modifications under transient thermal shock, and with the increasing ZrC content in W alloys, thermal shock resistance of W-Zr/Sc2O3 sample tends to be unsatisfied.

Model Comparison for Electron Thermal Transport

Science.gov (United States)

Moses, Gregory; Chenhall, Jeffrey; Cao, Duc; Delettrez, Jacques

2015-11-01

Four electron thermal transport models are compared for their ability to accurately and efficiently model non-local behavior in ICF simulations. Goncharov's transport model has accurately predicted shock timing in implosion simulations but is computationally slow and limited to 1D. The iSNB (implicit Schurtz Nicolai Busquet electron thermal transport method of Cao et al. uses multigroup diffusion to speed up the calculation. Chenhall has expanded upon the iSNB diffusion model to a higher order simplified P3 approximation and a Monte Carlo transport model, to bridge the gap between the iSNB and Goncharov models while maintaining computational efficiency. Comparisons of the above models for several test problems will be presented. This work was supported by Sandia National Laboratory - Albuquerque and the University of Rochester Laboratory for Laser Energetics.

Stress and phase changes in a low-thermal-expansion Al-3at.%Ge alloy film on oxidized silicon wafers

International Nuclear Information System (INIS)

Tu, K.N.; Rodbell, K.P.; Herd, S.R.; Mikalsen, D.J.

1993-01-01

The alloy of Al-3at.%Ge has been found to have a low thermal expansion and contraction in the temperature range of room temperature to 400 C. The reason for the low thermal contraction (or expansion) is the precipitation (or dissolution) of Ge in the alloy. The Ge precipitates have a diamond structure in which each Ge atom occupies a much larger atomic volume than a Ge atom dissolved substitutionally in Al. The volume difference compensates for the effect of thermal expansion and contraction with changing temperature which in turn reduces the thermal stress due to thermal mismatch. The technique of wafer bending was used to determine the stress of the alloy film on oxidized silicon wafers upon thermal cycling; indeed, it is much lower than that of pure Al on identical wafers. The morphology of precipitation and dissolution of Ge in Al has been studied by transmission and scanning electron microscopy. It is found that the precipitation follows a discontinuous mode and occurs predominantly along grain boundaries. In dissolving the Ge precipitates into Al, voids are left behind because of the volume difference. It is proposed that this may explain the enhancement of nucleation of voids in the alloy film upon thermal cycling. (orig.)

Effect of fin attachment on thermal stress reduction of exhaust manifold of an off road diesel engine

Institute of Scientific and Technical Information of China (English)

Ali; Akbar; Partoaa; Morteza; Abdolzadeh; Masoud; Rezaeizadeh

2017-01-01

The effect of fin attachment on the thermal stress reduction of exhaust manifold of an off road diesel engine(Komatsu HD325-6) was investigated.For doing this,coupled thermo-fluid-solid analysis of exhaust manifold of the off road diesel engine was carried out.The thermal analysis,including thermal flow,thermal stress,and the thermal deformation of the manifold was investigated.The flow inside the manifold was simulated and then its properties including velocity,pressure,and temperature were obtained.The flow properties were transferred to the solid model and then the thermal stresses and the thermal deformations of the manifold under different operating conditions were calculated.Finally,based on the predicted thermal stresses and thermal deformations of the manifold body shell,two fin types as well as body shell thickness increase were applied in the critical induced thermal stress area of the manifold to reduce the thermal stress and thermal deformation.The results of the above modifications show that the combined modifications,i.e.the thickness increase and the fin attachment,decrease the thermal stresses by up to 28% and the contribution of the fin attachment in this reduction is much higher compared to the shell thickness increase.

Investigation of effective factors of transient thermal stress of the MONJU-System components

Energy Technology Data Exchange (ETDEWEB)

Inoue, Masaaki; Hirayama, Hiroshi; Kimura, Kimitaka; Jinbo, M. [Toshiba Corp., Kawasaki, Kanagawa (Japan)

1999-03-01

Transient thermal stress of each system Component in the fast breeder reactor is an uncertain factor on it's structural design. The temperature distribution in a system component changes over a wide range in time and in space. An unified evaluation technique of thermal, hydraulic, and structural analysis, in which includes thermal striping, temperature stratification, transient thermal stress and the integrity of the system components, is required for the optimum design of tho fast reactor plant. Thermal boundary conditions should be set up by both the transient thermal stress analysis and the structural integrity evaluation of each system component. The reasonable thermal boundary conditions for the design of the MONJU and a demonstration fast reactor, are investigated. The temperature distribution analysis models and the thermal boundary conditions on the Y-piece structural parts of each system component, such as reactor vessel, intermediate heat exchanger, primary main circulation pump, steam generator, superheater and upper structure of reactor core, are illustrated in the report. (M. Suetake)

Thermally conductive, dielectric PCM-boron nitride nanosheet composites for efficient electronic system thermal management.

Science.gov (United States)

Yang, Zhi; Zhou, Lihui; Luo, Wei; Wan, Jiayu; Dai, Jiaqi; Han, Xiaogang; Fu, Kun; Henderson, Doug; Yang, Bao; Hu, Liangbing

2016-11-24

Phase change materials (PCMs) possessing ideal properties, such as superior mass specific heat of fusion, low cost, light weight, excellent thermal stability as well as isothermal phase change behavior, have drawn considerable attention for thermal management systems. Currently, the low thermal conductivity of PCMs (usually less than 1 W mK -1 ) greatly limits their heat dissipation performance in thermal management applications. Hexagonal boron nitride (h-BN) is a two-dimensional material known for its excellent thermally conductive and electrically insulating properties, which make it a promising candidate to be used in electronic systems for thermal management. In this work, a composite, consisting of h-BN nanosheets (BNNSs) and commercialized paraffin wax was developed, which inherits high thermally conductive and electrically insulating properties from BNNSs and substantial heat of fusion from paraffin wax. With the help of BNNSs, the thermal conductivity of wax-BNNS composites reaches 3.47 W mK -1 , which exhibits a 12-time enhancement compared to that of pristine wax (0.29 W mK -1 ). Moreover, an 11.3-13.3 MV m -1 breakdown voltage of wax-BNNS composites was achieved, which shows further improved electrical insulating properties. Simultaneously enhanced thermally conductive and electrically insulating properties of wax-BNNS composites demonstrate their promising application for thermal management in electronic systems.

TPX vacuum vessel transient thermal and stress conditions

International Nuclear Information System (INIS)

Feldshteyn, Y.; Dinkevich, S.; Feng, T.; Majumder, D.

1995-01-01

The TPX vacuum vessel provides the vacuum boundary for the plasma and the mechanical support for the internal components. Another function of the vacuum vessel is to contain neutron shielding water in the double wall space during normal operation. This double wall space serves as a heat reservoir for the entire vacuum vessel during bakeout. The vacuum vessel and the internal components are subjected to thermal stresses induced by a nonuniform temperature distribution within the structure during bakeout. A successful Conceptual Design Review in March 1993 has established superheated steam as the heating source of the vacuum vessel. A transient bakeout mode of the vacuum vessel and in-vessel components has been analyzed to evaluate transient period duration, proper temperature level, actual thermal stresses and performance of the steam equipment. Thermally, the vacuum vessel structure may be considered as an adiabatic system because it is perfectly insulated by the strong surrounding vacuum and multiple layers of superinsulation. Important aspects of the analysis are described herein

Cyclotron radiation from thermal and non-thermal electrons in the WEGA-stellarator

International Nuclear Information System (INIS)

Piekaar, H.W.; Rutgers, W.R.

1980-11-01

Electron cyclotron radiation measurements on the WEGA-stellarator are reported. Emission spectra around 2ωsub(ce) and 3ωsub(ce) were measured with a far-infra-red spectrometer and InSb detectors. When the plasma loop voltage is high, runaway electrons give rise to intense broad-band emission. Runaway particles can be removed by increasing the plasma density. For low loop voltage discharges the electron temperature profile was deduced from thermal emission around 2ωsub(ce). In spite of the low E-field, runaway particles are still created and pitch-angle scattered because ωsub(pe)/ωsub(ce) approximately 1. From non-thermal emission below 2ωsub(ce) and 3ωsub(ce) the energy and number of particles could be calculated, and was found to be in agreement with existing theories

Coupled transient thermo-fluid/thermal-stress analysis approach in a VTBM setting

International Nuclear Information System (INIS)

Ying, A.; Narula, M.; Zhang, H.; Abdou, M.

2008-01-01

A virtual test blanket module (VTBM) has been envisioned as a utility to aid in streamlining and optimizing the US ITER TBM design effort by providing an integrated multi-code, multi-physics modeling environment. Within this effort, an integrated simulation approach is being developed for TBM design calculations and performance evaluation. Particularly, integrated thermo-fluid/thermal-stress analysis is important for enabling TBM design and performance calculations. In this paper, procedures involved in transient coupled thermo-fluid/thermal-stress analysis are investigated. The established procedure is applied to study the impact of pulsed operational phenomenon on the thermal-stress response of the TBM first wall. A two-way coupling between the thermal strain and temperature field is also studied, in the context of a change in thermal conductivity of the beryllium pebble bed in a solid breeder blanket TBM due to thermal strain. The temperature field determines the thermal strain in beryllium, which in turn changes the temperature field. Iterative thermo-fluid/thermal strain calculations have been applied to both steady-state and pulsed operation conditions. All calculations have been carried out in three dimensions with representative MCAD models, including all the TBM components in their entirety

Thermal electron mobilities in low density gaseous mixtures

International Nuclear Information System (INIS)

Dmitriev, O.W.; Tchorzewska, W.; Szamrej, I.; Forys, M.

1992-01-01

A new method of obtaining thermal electron mobilities from experimental dependencies observed in the electron swarm is described; the method is suitable for both electron accepting and non-accepting systems. The electron mobilities for CO 2 , CH 4 C 2 H 6 as well as for N 2 , Ar, Xe, Kr and their mixtures with carbon dioxide are obtained. (Author)

The effects of location, thermal stress, and residual stress on corner cracks in nozzles with cladding

International Nuclear Information System (INIS)

Besuner, P.M.; Cohen, L.M.; McLean, J.L.

1977-01-01

The stress intensity factors (Ksub(I)) for corner cracks in a boiling water reactor feedwater nozzle with stainless steel cladding are obtained for loading by internal pressure, and a fluid quench in the nozzle. Conditions with and without residual stress in the component are considered. The residual stress is simulated by means of a reference temperature change. The stress distribution for the uncracked structure is obtained from a three-dimensional finite element model. A three-dimensional influence function (IF) method, in conjunction with the boundary-integral equation method for structural analysis, is employed to compute Ksub(I) values from the uncracked structure's stress distribution. For each type of loading Ksub(I) values are given for cracks at 15 nozzle locations and for six crack depths. Reasonable agreement is noted between calculated and previously published pressure-induced Ksub(I) values. Comparisons are made to determine the effect on Ksub(I) of crack location, thermal stress, and residual stress as compared to pressure stress. For the thermal transient it is shown that Ksub(I) for small crack depths is maximized early in the transient while Ksub(I) for large cracks is maximized later, under steady state conditions. Ksub(I) computations should, therefore, be made for several transient time points and the maximum Ksub(I) for a given crack depth should be used for design analysis. It is concluded that the effects on Ksub(I) of location, thermal stresses, and residual stresses are significant and generally too complex to evalute without advanced numerical procedures. The utilized combination of finite element analysis of the uncracked structure and three-dimensional influence function analysis of the cracked structure is demonstrated

Thermal stress analysis and operational characteristics of a bellows-seal globe valve

International Nuclear Information System (INIS)

Kim, Kwang Su; Kim, Youn Jae

2005-01-01

Because of design and manufacturing costs, it is important to predict an expected life of bellows with component stresses of bellows as its design factors and material characteristics. In this study, numerical analyses are carried out to elucidate the thermal and flow characteristics with 0.1 m (4 inch) bellows-seal globe valve for high temperature (max. 600 .deg. C) and for high pressure (max. 104 kgf/cm 2 , 10.2 MPa) conditions. Using commercial codes, FLUENT, which uses FVM and SIMPLE algorithm, and ANSYS, which uses FEM, the pressure and temperature fields are calculated and the results are graphically depicted. In addition, when bellows have an axial displacement, thermal stress affecting bellows life is studied. The pressure and temperature values obtained from the flow analyses are adopted as the boundary conditions for thermal stress analyses. As the result of this study, we get the reasonable coefficients for valve and thermal stress for bellows, compared with existing coefficients and calculated values

Thermal and mechanical stresses in a functionally graded thick sphere

International Nuclear Information System (INIS)

Eslami, M.R.; Babaei, M.H.; Poultangari, R.

2005-01-01

In this paper, a general solution for the one-dimensional steady-state thermal and mechanical stresses in a hollow thick sphere made of functionally graded material is presented. The temperature distribution is assumed to be a function of radius, with general thermal and mechanical boundary conditions on the inside and outside surfaces of the sphere. The material properties, except Poisson's ratio, are assumed to vary along the radius r according to a power law function. The analytical solution of the heat conduction equation and the Navier equation lead to the temperature profile, radial displacement, radial stress, and hoop stress as a function of radial direction

Analytical method for thermal stress analysis of plasma facing materials

Science.gov (United States)

You, J. H.; Bolt, H.

2001-10-01

The thermo-mechanical response of plasma facing materials (PFMs) to heat loads from the fusion plasma is one of the crucial issues in fusion technology. In this work, a fully analytical description of the thermal stress distribution in armour tiles of plasma facing components is presented which is expected to occur under typical high heat flux (HHF) loads. The method of stress superposition is applied considering the temperature gradient and thermal expansion mismatch. Several combinations of PFMs and heat sink metals are analysed and compared. In the framework of the present theoretical model, plastic flow and the effect of residual stress can be quantitatively assessed. Possible failure features are discussed.

Analytical method for thermal stress analysis of plasma facing materials

International Nuclear Information System (INIS)

You, J.H.; Bolt, H.

2001-01-01

The thermo-mechanical response of plasma facing materials (PFMs) to heat loads from the fusion plasma is one of the crucial issues in fusion technology. In this work, a fully analytical description of the thermal stress distribution in armour tiles of plasma facing components is presented which is expected to occur under typical high heat flux (HHF) loads. The method of stress superposition is applied considering the temperature gradient and thermal expansion mismatch. Several combinations of PFMs and heat sink metals are analysed and compared. In the framework of the present theoretical model, plastic flow and the effect of residual stress can be quantitatively assessed. Possible failure features are discussed

Transient thermal stresses in an orthotropic finite rectangular plate due to arbitrary surface heat-generations

International Nuclear Information System (INIS)

Sugano, Y.

1980-01-01

The transient thermal stresses in an orthotropic finite rectangular plate due to arbitrary surface heat-generations on two edges are studied by means of the Airy stress function. The purposes of this paper are to present a method of determing the transient thermal stresses in an orthographic rectangular plate with four edges of distinct thermal boundary condition of the third kind which exactly satisfy the traction-free conditions of shear stress over all boundaries including four corners of the plate, and to consider the effects of the anisotropies of material properties and the convective heat transfer on the upper and lower surfaces on the thermal stress distribution. (orig.)

Thermal stress relieving of dilute uranium alloys

International Nuclear Information System (INIS)

Eckelmeyer, K.H.

1980-01-01

The kinetics of thermal stress relieving of uranium - 2.3 wt. % niobium, uranium - 2.0 wt. % molybdenum, and uranium - 0.75 wt. % titanium are reported and discussed. Two temperature regimes of stress relieving are observed. In the low temperature regime (T 0 C) the process appears to be controlled by an athermal microplasticity mechanism which can be completely suppressed by prior age hardening. In the high temperature regime (300 0 C 0 C) the process appears to be controlled by a classical diffusional creep mechanism which is strongly dependent on temperature and time. Stress relieving is accelerated in cases where it occurs simultaneously with age hardening. The potential danger of residual stress induced stress corrosion cracking of uranium alloys is discussed. It is shown that the residual stress relief which accompanies age hardening of uranium - 0.75% titanium more than compensates for the reduction in K/sub ISCC/ caused by aging. As a result, age hardening actually decreases the susceptibility of this alloy to residual stress induced stress corrosion cracking

Pipe cracking due to thermal stresses produced by valve opening

International Nuclear Information System (INIS)

Sanchez Sarmiento, G.

1982-01-01

The thermal stresses produced in a tube whose internal surface is abrupt cooled during a valve opening so that the water volume increases linearly with time are studied. A general solution for these stresses and its stress intensity factors in terms of non-dimensional parameters is presented. (E.G.) [pt

The thermal and mechanical properties of electron beam-irradiated polylactide

International Nuclear Information System (INIS)

Kuk, In Seol; Jung, Chan Hee; Hwang, In Tae; Choi, Jae Hak; Nho, Young Chang

2010-01-01

The effect of electron beam irradiation on the thermal and mechanical properties of polylactide (PLA) was investigated in this research. PLA films were irradiated by electron beams at different absorption doses ranging from 20 to 200 kGy. The thermal and mechanical properties of the irradiated PLA films were investigated by means of differential scanning calorimeter, thermogravimetric analyzer, universal testing machine, dynamic mechanical analyzer, and thermal mechanical analyzer. The results revealed that the chain scission of the PLA predominated over the crosslinking during the irradiation, which considerably deteriorated the thermal and mechanical properties of the PLA

Temperature and thermal stress analysis of a switching tube anode

International Nuclear Information System (INIS)

Sutton, S.B.

1979-01-01

In the design of high power density switching tubes which are subjected to cyclic thermal loads, the temperature induced stresses must be minimized in order to maximize the life expectancy of the tube. Following are details of an analysis performed for the Magnetic Fusion Program at the Lawrence Livermore Laboratory on a proposed tube. The tube configuration is given. The problem was simplified to one-dimensional approximations for both the thermal and stress analyses. The underlying assumptions and their implications are discussed

Combined thermal and herbicide stress in functionally diverse coral symbionts

International Nuclear Information System (INIS)

Dam, J.W. van; Uthicke, S.; Beltran, V.H.; Mueller, J.F.; Negri, A.P.

2015-01-01

Most reef building corals rely on symbiotic microalgae (genus Symbiodinium) to supply a substantial proportion of their energy requirements. Functional diversity of different Symbiodinium genotypes, endorsing the host with physiological advantages, has been widely reported. Yet, the influence of genotypic specificity on the symbiont's susceptibility to contaminants or cumulative stressors is unknown. Cultured Symbiodinium of presumed thermal-tolerant clade D tested especially vulnerable to the widespread herbicide diuron, suggesting important free-living populations may be at risk in areas subjected to terrestrial runoff. Co-exposure experiments where cultured Symbiodinium were exposed to diuron over a thermal stress gradient demonstrated how fast-growing clade C1 better maintained photosynthetic capability than clade D. The mixture toxicity model of Independent Action, considering combined thermal stress and herbicide contamination, revealed response additivity for inhibition of photosynthetic yield in both tested cultures, emphasizing the need to account for cumulative stressor impacts in ecological risk assessment and resource management. - Highlights: • Water quality influences thermal stress thresholds in different Symbiodinium types. • Photosystem of clade D tested more sensitive than C1 to a common herbicide. • Increased thermal tolerance quickly countered in presence of herbicide. • Mixture toxicity approach demonstrated response additivity for combined stressors. • Symbiotic partnership may be compromised in areas subjected to terrestrial runoff. - Thermal-tolerant Symbiodinium type D tested especially vulnerable to a common herbicide, emphasizing the significance of cumulative stressors in ecological risk management

Damage assessment of low-cycle fatigue by crack growth prediction. Fatigue life under cyclic thermal stress

International Nuclear Information System (INIS)

Kamaya, Masayuki

2013-01-01

The number of cycles to failure of specimens in fatigue tests can be estimated by predicting crack growth. Under a cyclic thermal stress caused by fluctuation of fluid temperature, due to the stress gradient in the thickness direction, the estimated fatigue life differs from that estimated for mechanical fatigue tests. In this paper, the influence of crack growth under cyclic thermal loading on the fatigue life was investigated. First, the thermal stress was derived by superposing analytical solutions, and then, the stress intensity factor was obtained by the weight function method. It was shown that the thermal stress depended not on the rate of the fluid temperature change but on the rise time, and the magnitude of the stress was increased as the rise time was decreased. The stress intensity factor under the cyclic thermal stress was smaller than that under the uniform stress distribution. The change in the stress intensity factor with the crack depth was almost the same regardless of the rise time. The estimated fatigue life under the cyclic thermal loading could be 1.6 times longer than that under the uniform stress distribution. The critical size for the fatigue life determination was assumed to be 3 mm for fatigue test specimens of 10 mm diameter. By evaluating the critical size by structural integrity analyses, the fatigue life was increased and the effect of the critical size on the fatigue life was more pronounced for the cyclic thermal stress. (author)

Enhanced thermal stability of a polymer solar cell blend induced by electron beam irradiation in the transmission electron microscope

Energy Technology Data Exchange (ETDEWEB)

Bäcke, Olof, E-mail: obacke@chalmers.se [Department of Applied Physics, Chalmers University of Technology, 41296 Göteborg (Sweden); Lindqvist, Camilla; Diaz de Zerio Mendaza, Amaia [Department of Chemistry and Chemical Engineering, Chalmers University of Technology, 41296 Göteborg (Sweden); Gustafsson, Stefan [Department of Applied Physics, Chalmers University of Technology, 41296 Göteborg (Sweden); Wang, Ergang; Andersson, Mats R.; Müller, Christian [Department of Chemistry and Chemical Engineering, Chalmers University of Technology, 41296 Göteborg (Sweden); Kristiansen, Per Magnus [Institute of Polymer Nanotechnology (INKA), FHNW University of Applied Science and Arts Northwestern Switzerland, 5210 Windisch (Switzerland); Laboratory for Micro- and Nanotechnology, Paul Scherrer Institute, 5232 Villigen (Switzerland); Olsson, Eva, E-mail: eva.olsson@chalmers.se [Department of Applied Physics, Chalmers University of Technology, 41296 Göteborg (Sweden)

2017-05-15

We show by in situ microscopy that the effects of electron beam irradiation during transmission electron microscopy can be used to lock microstructural features and enhance the structural thermal stability of a nanostructured polymer:fullerene blend. Polymer:fullerene bulk-heterojunction thin films show great promise for use as active layers in organic solar cells but their low thermal stability is a hindrance. Lack of thermal stability complicates manufacturing and influences the lifetime of devices. To investigate how electron irradiation affects the thermal stability of polymer:fullerene films, a model bulk-heterojunction film based on a thiophene-quinoxaline copolymer and a fullerene derivative was heat-treated in-situ in a transmission electron microscope. In areas of the film that exposed to the electron beam the nanostructure of the film remained stable, while the nanostructure in areas not exposed to the electron beam underwent large phase separation and nucleation of fullerene crystals. UV–vis spectroscopy shows that the polymer:fullerene films are stable for electron doses up to 2000 kGy. - Highlights: • Thermal stability of a polymer: fullerne blend is increased using electron irradiation. • Using in-situ transmission electron microscopy the nanostructure is studied. • Electron irradiation stops phase separation between the polymer and fullerene. • Electron irradiation quenches the formation and nucleation of fullerene crystals.

First wall thermal stress analysis for suddenly applied heat fluxes

International Nuclear Information System (INIS)

Dalessandro, J.A.

The failure criterion for a solid first wall of an inertial confinement reactor is investigated. Analytical expressions for induced thermal stresses in a plate are given. Two materials have been chosen for this investigation: grade H-451 graphite and chemically vapor deposited (CVD) β-silicon carbide. Structural failure can be related to either the maximum compressive stress produced on the surface or the maximum tensile stress developed in the interior of the plate; however, it is shown that compressive failure would predominate. A basis for the choice of the thermal shock figure of merit, k(1 - ν) sigma/E α kappa/sup 1/2/, is identified. The result is that graphite and silicon carbide rank comparably

Human power output during repeated sprint cycle exercise: the influence of thermal stress

NARCIS (Netherlands)

Ball, D.; Burrows, C.; Sargeant, A.J.

1999-01-01

Thermal stress is known to impair endurance capacity during moderate prolonged exercise. However, there is relatively little available information concerning the effects of thermal stress on the performance of high-intensity short-duration exercise. The present experiment examined human power output

Thermal residual stress evaluation based on phase-shift lateral shearing interferometry

Science.gov (United States)

Dai, Xiangjun; Yun, Hai; Shao, Xinxing; Wang, Yanxia; Zhang, Donghuan; Yang, Fujun; He, Xiaoyuan

2018-06-01

An interesting phase-shift lateral shearing interferometry system was proposed to evaluate the thermal residual stress distribution in transparent specimen. The phase-shift interferograms was generated by moving a parallel plane plate. Based on analyzing the fringes deflected by deformation and refractive index change, the stress distribution can be obtained. To verify the validity of the proposed method, a typical experiment was elaborately designed to determine thermal residual stresses of a transparent PMMA plate subjected to the flame of a lighter. The sum of in-plane stress distribution was demonstrated. The experimental data were compared with values measured by digital gradient sensing method. Comparison of the results reveals the effectiveness and feasibility of the proposed method.

Thermal stresses at nozzles of nuclear steel containments under LOCA-conditions

International Nuclear Information System (INIS)

Sanchez Sarmiento, G.; Bergmann, A.N.

1986-01-01

During a loss of coolant accident (LOCA) of a PWR-nuclear power plant, a considerable heating of the containment atmosphere is expected to occur. Transient thermal stresses will appear at the containment as a consequence of a non-uniform rise of its temperature. Applying computer codes based on the finite element method, dimensionless general thermal stresses at nozzles of spherical steel containment have been calculated, varying the principal geometrical parameters and the Biot number for the containment internal surface. Atmosphere temperature and Biot number are assumed constant after the accident. Several plots of the maximum principal stresses are provided, which constitute general results applicable to stress analysis of any particular containment of this kind. (orig.)

Rock properties and their effect on thermally-induced displacements and stresses

International Nuclear Information System (INIS)

Chan, T.; Hood, M.; Board, M.

1980-02-01

A discussion is given of the importance of material properties in the finite-element calculations for thermally induced displacements and stresses resulting from a heating experiment in an in-situ granitic rock, at Stripa, Sweden. Comparisons are made between field measurements and finite element method calculations using (1) temperature independent, (2) temperature dependent thermal and thermomechanical properties and (3) in-situ and laboratory measurements for Young's modulus. The calculations of rock displacements are influenced predominantly by the temperature dependence of the thermal expansion coefficient, whereas the dominant factor affecting predictions for rock stresses is the in-situ modulus

Thermal stress in the scanning tunneling microscopy of the metallic heterostructure lead on copper(111); Thermospannung bei der Rastertunnelmikroskopie der metallischen Heterostruktur Blei auf Kupfer(111)

Energy Technology Data Exchange (ETDEWEB)

Langenkamp, Winfried

2008-02-22

The thermal stress, which arises, when tip and sample of a scanning tunneling microscope have different temperatures, was studied in the system lead on copper(111). Thereby atomic resolution on the 4 x 4 superstructure of the lead atoms of the first layer was reached. The thermal stress of lead island was studied because the electronic density of states here is in the greatest part determined by quantum pot states. The density of states as function of the energy can by approached as step function und is by this available for a mathematical modelling. As sum of the influence of the substrates and the influence by the quantum pot states it bas possible to develop a model. in which the thermal stress for lead islands on copper(111) can be described also quantitatively.

Effects of thermal aging and stress triaxiality on PWSCC initiation susceptibility of nickel-based Alloy 600

Energy Technology Data Exchange (ETDEWEB)

Yoo, Seung Chang; Choi, Kyoung Joon; Kim, Tae Ho; Kim, Ji Hyun [Dept. of Nuclear Science and Engineering, School of Mechanical and Nuclear Engineering, Ulsan National Institute of Science and Technology, Ulsan (Korea, Republic of)

2016-10-15

In present study, effects of thermal aging and triaxial stress were investigated in terms of primary water stress corrosion cracking susceptibility. The thermal aging was applied via heat treatment at 400°C and triaxial stress was applied via notched tensile test specimen. The crack initiation time of each specimen were then measured by direct current potential drop method during slow strain rate test at primary water environment. Alloys with 10 years thermal aging exhibited the highest susceptibility to stress corrosion cracking and asreceived specimen shows lowest susceptibility. The trend was different with triaxial stress applied; 20 years thermal aging specimen shows highest susceptibility and as-received specimen shows lowest. It would be owing to change of precipitate morphology during thermal aging and different activated slip system in triaxial stress state.

Non-Contact Smartphone-Based Monitoring of Thermally Stressed Structures

Science.gov (United States)

Ozturk, Turgut; Mas, David; Rizzo, Piervincenzo

2018-01-01

The in-situ measurement of thermal stress in beams or continuous welded rails may prevent structural anomalies such as buckling. This study proposed a non-contact monitoring/inspection approach based on the use of a smartphone and a computer vision algorithm to estimate the vibrating characteristics of beams subjected to thermal stress. It is hypothesized that the vibration of a beam can be captured using a smartphone operating at frame rates higher than conventional 30 Hz, and the first few natural frequencies of the beam can be extracted using a computer vision algorithm. In this study, the first mode of vibration was considered and compared to the information obtained with a conventional accelerometer attached to the two structures investigated, namely a thin beam and a thick beam. The results show excellent agreement between the conventional contact method and the non-contact sensing approach proposed here. In the future, these findings may be used to develop a monitoring/inspection smartphone application to assess the axial stress of slender structures, to predict the neutral temperature of continuous welded rails, or to prevent thermal buckling. PMID:29670034

Transient thermal stresses of work roll by coupled thermoelasticity

Science.gov (United States)

Lai, W. B.; Chen, T. C.; Weng, C. I.

1991-01-01

A numerical method, based on a two-dimensional plane strain model, is developed to predict the transient responses (that include distributions of temperature, thermal deformation, and thermal stress) of work roll during strip rolling by coupled thermoelasticity. The method consists of discretizing the space domain of the problem by finite element method first, and then treating the time domain by implicit time integration techniques. In order to avoid the difficulty in analysis due to relative movement between work roll and its thermal boundary, the energy equation is formulated with respect to a fixed Eulerian reference frame. The effect of thermoelastic coupling term, that is generally disregarded in strip rolling, can be considered and assessed. The influences of some important process parameters, such as rotational speed of the roll and intensity of heat flux, on transient solutions are also included and discussed. Furthermore, since the stress history at any point of the roll in both transient and steady state could be accurately evaluated, it is available to perform the analysis of thermal fatigue for the roll by means of previous data.

Time-dependent analytical thermal model to investigate thermally induced stresses in quasi-CW-pumped laser rods

CSIR Research Space (South Africa)

Bernhardi, EH

2008-01-01

Full Text Available that determines the temperature and the thermally induced stresses in isotropic rods is presented. Even though the model is developed for isotropic rods, it is shown that it can also be used to accurately estimate the thermal effects in anisotropic rods...

Damage assessment of low-cycle fatigue by crack growth prediction. Fatigue life under cyclic thermal stress

International Nuclear Information System (INIS)

Kamaya, Masayuki

2013-01-01

The number of cycles to failure of specimens in fatigue tests can be estimated by predicting crack growth. Under a cyclic thermal stress caused by fluctuation of fluid temperature, due to the stress gradient in the thickness direction, the estimated fatigue life differs from that estimated for mechanical fatigue tests. In this paper, the influence of crack growth under cyclic thermal loading on the fatigue life was investigated. First, the thermal stress was derived by superposing analytical solutions, and then, the stress intensity factor was obtained by the weight function method. It was shown that the thermal stress depended not on the rate of the fluid temperature change but on the rise time, and the magnitude of the stress was increased as the rise time was decreased. The stress intensity factor under the cyclic thermal stress was smaller than that under the uniform stress distribution. The change in the stress intensity factor with the crack depth did not depend on the heat transfer coefficient and only slightly depended on the rise time. The estimated fatigue life under the cyclic thermal loading could be 1.6 times longer than that under the uniform stress distribution. The critical size for the fatigue life determination was assumed to be 3 mm for fatigue test specimens of 10 mm diameter. By evaluating the critical size by structural integrity analyses, the fatigue life was increased and the effect of the critical size on the fatigue life was more pronounced for the cyclic thermal stress. (author)

Study of the effect of neutron and electron irradiations on the low temperature thermal conductivity of germanium and silicon

International Nuclear Information System (INIS)

Vandevyver, M.

1967-06-01

The main results obtained from this work are the following: 1 Neutron irradiation (at 300 deg. K) produces lattice defects in germanium and silicon, and a corresponding very large lowering of the thermal conductivity is observed in the low temperature region (4-300 ). The results obtained have been explained with the help of the following hypotheses: for silicon a scattering of phonons by the stress fields produced by the defects; for germanium, a supplementary scattering of the electron phonon type. 2 Annealing treatments carried out on these materials above 373 deg. K restored the thermal conductivity over the whole temperature range of the measurements (4-300 deg. K); in the case of both germanium and silicon there were two steps in the annealing process. 3 A study of the thermal conductivity of germanium (initially P or N) after an electronic irradiation showed that the scattering of phonons could depend on the state of charge of the defects thus produced. (author) [fr

Thermal management of electronics: A review of literature

Directory of Open Access Journals (Sweden)

Anandan Sundaram Shanmuga

2008-01-01

Full Text Available Due to rapid growth in semiconductor technology, there is a continuous increase of the system power and the shrinkage of size. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper. .

Experimental studies of thermal and non-thermal electron cyclotron phenomena in tokamaks

International Nuclear Information System (INIS)

McDermott, F.S.

1984-12-01

A direct measurement of wave absorption in the ISX-B tokamak at the second harmonic of the electron cyclotron frequency is reported. Measurements of the absorption of a wave polarized in the extraordinary mode and propagating perpendicular to the toroidal magnetic field are in agreement with the absorption predicted by the linearized Vlasov equation for a thermal plasma. Agreement is found both for an analytic approximation to the wave absorption and for a numerical simulation of ray propagation in toroidal geometry. Observations are also reported on a non-linear, three-wave interaction process occurring during high power electron cyclotron resonance heating in the Versator II tokamak. The measured spectra and the threshold power are consistent with a model in which the incident power in the extraordinary mode of polarization decays at the upper hybrid resonance layer into a lower hybrid wave and an electron Bernstein wave. Finally, measurements of non-thermal emission at the second harmonic of the electron cyclotron frequency and below the electron plasma frequency are reported from low density, non-Maxwellian plasma in the Versator II tokamak. The emission spectra are in agreement with a model in which waves are driven unstable at the anomalous Doppler resonance, while only weakly damped at the Cerenkov resonance

Assessment of thermal fatigue damage caused by local fluid temperature fluctuation (part I: characteristics of constraint and stress caused by thermal striation and stratification)

International Nuclear Information System (INIS)

Kamaya, Masayuki

2014-01-01

Highlights: • The source of the membrane constraint due to local temperature fluctuation was shown. • Thermal fatigue that occurred at a mixing tee and branched elbow was analyzed. • Cracking occurrence was reasonably explained by the constraint and stress conditions. - Abstract: This study was aimed at identifying the constraint conditions under local temperature fluctuation by thermal striping at a mixing tee and by thermal stratification at an elbow pipe branched from the main pipe. Numerical and analytical approaches were made to derive the thermal stress and its fluctuation. It was shown that an inhomogeneous temperature distribution in a straight pipe caused thermal stress due to a membrane constraint even if an external membrane constraint did not act on the pipe. Although the membrane constraint increased the mean stress at the mixing tee, it did not contribute to fluctuation of the thermal stress. On the other hand, the membrane constraint played an important role in the fatigue damage accumulation near the stratification layer of the branched elbow. Based on the constraint and stress conditions analyzed, the characteristics of the cracking observed in actual nuclear power plants were reasonably explained. Namely, at the mixing tee, where thermal crazing has been found, the lack of contribution of the membrane constraint to stress fluctuation caused a stress gradient in the thickness direction and arrested crack growth. On the other hand, at the branched elbow, where axial through-wall cracks have been found, the relatively large hoop stress fluctuation was brought about by movement of the stratified layer together with the membrane constraint even under a relatively low frequency of stress fluctuation

Laboratory electron exposure of TSS-1 thermal control coating

Science.gov (United States)

Vaughn, J. A.; Mccollum, M.; Carruth, M. R., Jr.

1995-01-01

RM400, a conductive thermal control coating, was developed for use on the exterior shell of the tethered satellite. Testing was performed by the Engineering Physics Division to quantify effects of the space environment on this coating and its conductive and optical properties. Included in this testing was exposure of RM400 to electrons with energies ranging from 0.1 to 1 keV, to simulate electrons accelerated from the ambient space plasma when the tethered satellite is fully deployed. During this testing, the coating was found to luminesce, and a prolonged exposure of the coating to high-energy electrons caused the coating to darken. This report describes the tests done to quantify the degradation of the thermal control properties caused by electron exposure and to measure the luminescence as a function of electron energy and current density to the satellite.

Moderate Thermal Stress Causes Active and Immediate Expulsion of Photosynthetically Damaged Zooxanthellae (Symbiodinium from Corals.

Directory of Open Access Journals (Sweden)

Lisa Fujise

Full Text Available The foundation of coral reef biology is the symbiosis between corals and zooxanthellae (dinoflagellate genus Symbiodinium. Recently, coral bleaching, which often results in mass mortality of corals and the collapse of coral reef ecosystems, has become an important issue around the world as coral reefs decrease in number year after year. To understand the mechanisms underlying coral bleaching, we maintained two species of scleractinian corals (Acroporidae in aquaria under non-thermal stress (27°C and moderate thermal stress conditions (30°C, and we compared the numbers and conditions of the expelled Symbiodinium from these corals. Under non-thermal stress conditions corals actively expel a degraded form of Symbiodinium, which are thought to be digested by their host coral. This response was also observed at 30°C. However, while the expulsion rates of Symbiodinium cells remained constant, the proportion of degraded cells significantly increased at 30°C. This result indicates that corals more actively digest and expel damaged Symbiodinium under thermal stress conditions, likely as a mechanism for coping with environmental change. However, the increase in digested Symbiodinium expulsion under thermal stress may not fully keep up with accumulation of the damaged cells. There are more photosynthetically damaged Symbiodinium upon prolonged exposure to thermal stress, and corals release them without digestion to prevent their accumulation. This response may be an adaptive strategy to moderate stress to ensure survival, but the accumulation of damaged Symbiodinium, which causes subsequent coral deterioration, may occur when the response cannot cope with the magnitude or duration of environmental stress, and this might be a possible mechanism underlying coral bleaching during prolonged moderate thermal stress.

Moderate Thermal Stress Causes Active and Immediate Expulsion of Photosynthetically Damaged Zooxanthellae (Symbiodinium) from Corals.

Science.gov (United States)

Fujise, Lisa; Yamashita, Hiroshi; Suzuki, Go; Sasaki, Kengo; Liao, Lawrence M; Koike, Kazuhiko

2014-01-01

The foundation of coral reef biology is the symbiosis between corals and zooxanthellae (dinoflagellate genus Symbiodinium). Recently, coral bleaching, which often results in mass mortality of corals and the collapse of coral reef ecosystems, has become an important issue around the world as coral reefs decrease in number year after year. To understand the mechanisms underlying coral bleaching, we maintained two species of scleractinian corals (Acroporidae) in aquaria under non-thermal stress (27°C) and moderate thermal stress conditions (30°C), and we compared the numbers and conditions of the expelled Symbiodinium from these corals. Under non-thermal stress conditions corals actively expel a degraded form of Symbiodinium, which are thought to be digested by their host coral. This response was also observed at 30°C. However, while the expulsion rates of Symbiodinium cells remained constant, the proportion of degraded cells significantly increased at 30°C. This result indicates that corals more actively digest and expel damaged Symbiodinium under thermal stress conditions, likely as a mechanism for coping with environmental change. However, the increase in digested Symbiodinium expulsion under thermal stress may not fully keep up with accumulation of the damaged cells. There are more photosynthetically damaged Symbiodinium upon prolonged exposure to thermal stress, and corals release them without digestion to prevent their accumulation. This response may be an adaptive strategy to moderate stress to ensure survival, but the accumulation of damaged Symbiodinium, which causes subsequent coral deterioration, may occur when the response cannot cope with the magnitude or duration of environmental stress, and this might be a possible mechanism underlying coral bleaching during prolonged moderate thermal stress.

Transient thermal stress problem for a circumferentially cracked hollow cylinder

Science.gov (United States)

Nied, H. F.; Erdogan, F.

1982-01-01

The transient thermal stress problem for a hollow elasticity cylinder containing an internal circumferential edge crack is considered. It is assumed that the problem is axisymmetric with regard to the crack geometry and the loading, and that the inertia effects are negligible. The problem is solved for a cylinder which is suddenly cooled from inside. First the transient temperature and stress distributions in an uncracked cylinder are calculated. By using the equal and opposite of this thermal stress as the crack surface traction in the isothermal cylinder the crack problem is then solved and the stress intensity factor is calculated. The numerical results are obtained as a function of the Fourier number tD/b(2) representing the time for various inner-to-outer radius ratios and relative crack depths, where D and b are respectively the coefficient of diffusivity and the outer radius of the cylinder.

Thermal stress intensity factor for an axial crack in a clad cylinder

International Nuclear Information System (INIS)

Kuo, An Yu; Deardorf, A.F.; Riccardella, P.C.

1993-01-01

Many clad pressure vessels have been found to have cracks running through the inside surface cladding and into the base material. Although Young's moduli and Poisson's ratios of the clad and base materials are about the same for most of the industrial applications, coefficients of thermal expansion of the two dissimilar materials, clad and base materials, are usually quite different. For example, low alloy ferritic steel is a common base material for reactor pressure vessels (RPV) and the vessels are usually clad with austenitic stainless steel. Young's moduli for the low alloy steel and stainless steel at 350 F are 29,000 ksi and 28,000 ksi, respectively, while their coefficients of thermal expansion are 7.47x10 -6 in/in and 9.50x10 -6 in/in-degree F, respectively. The mismatch in coefficients of thermal expansion will cause high residual thermal stress even when the entire vessel is at a uniform temperature. This residual stress is one of the primary reasons why so many cracks have been found in the cladded components. In performing reactor pressure vessel integrity evaluation, such as computing probability of brittle fracture of the RPV, it is necessary to calculate stress intensity factors for cracks, which initiate from the clad material and run into the base metal. This paper presents a convenient method of calculating stress intensity factor for an axial crack emanating from the inside surface of a cladded cylinder under thermal loading. A J-integral like line integral was derived and used to calculate the stress intensity factors from finite element stress solutions of the problem

Rectification of electronic heat current by a hybrid thermal diode.

Science.gov (United States)

Martínez-Pérez, Maria José; Fornieri, Antonio; Giazotto, Francesco

2015-04-01

Thermal diodes--devices that allow heat to flow preferentially in one direction--are one of the key tools for the implementation of solid-state thermal circuits. These would find application in many fields of nanoscience, including cooling, energy harvesting, thermal isolation, radiation detection and quantum information, or in emerging fields such as phononics and coherent caloritronics. However, both in terms of phononic and electronic heat conduction (the latter being the focus of this work), their experimental realization remains very challenging. A highly efficient thermal diode should provide a difference of at least one order of magnitude between the heat current transmitted in the forward temperature (T) bias configuration (Jfw) and that generated with T-bias reversal (Jrev), leading to ℛ = Jfw/Jrev ≫ 1 or ≪ 1. So far, ℛ ≈ 1.07-1.4 has been reported in phononic devices, and ℛ ≈ 1.1 has been obtained with a quantum-dot electronic thermal rectifier at cryogenic temperatures. Here, we show that unprecedentedly high ratios of ℛ ≈ 140 can be achieved in a hybrid device combining normal metals tunnel-coupled to superconductors. Our approach provides a high-performance realization of a thermal diode for electronic heat current that could be successfully implemented in true low-temperature solid-state thermal circuits.

The effect of the ergodic divertor on electron thermal confinement

International Nuclear Information System (INIS)

Harris, G.R.; Capes, H.; Garbet, X.

1992-06-01

The thermal confinement within the confinement zone of Tore Supra ohmically heated deuterium plasmas bounded by the ergodic divertor (ED) configuration is studied in a 1 1/2D analysis of the local power balance. Although the edge electron temperature and mean electron density (n e ) are both on average halved with application of the ED, the mean electron thermal diffusivity χ e shows the same density dependence as exhibited by standard ohmic limiter discharges, i.e., an Alcator-like inverse dependence on (n e ) at low density and a saturation at high density. The ion thermal transport at low to medium densities in both limiter and ED discharges is between 10 to 20 times that predicted by neoclassical theory. Comparing ED and limiter plasmas of the same density, a strong plasma decontamination is observed, with a reduction, in Z eff by between 1.0 to 1.5. The effective decoupling of (n e ) and Z eff by the ED and the invariant behaviour of χ e imply that electron thermal transport is only weakly dependent on Z eff in ohmic Tore Supra discharges

Tasco®, a Product of Ascophyllum nodosum, Imparts Thermal Stress Tolerance in Caenorhabditis elegans

Directory of Open Access Journals (Sweden)

Franklin Evans

2011-11-01

Full Text Available Tasco®, a commercial product manufactured from the brown alga Ascophyllum nodosum, has been shown to impart thermal stress tolerance in animals. We investigated the physiological, biochemical and molecular bases of this induced thermal stress tolerance using the invertebrate animal model, Caenorhabiditis elegans. Tasco® water extract (TWE at 300 µg/mL significantly enhanced thermal stress tolerance as well as extended the life span of C. elegans. The mean survival rate of the model animals under thermal stress (35 °C treated with 300 µg/mL and 600 µg/mL TWE, respectively, was 68% and 71% higher than the control animals. However, the TWE treatments did not affect the nematode body length, fertility or the cellular localization of daf-16. On the contrary, TWE under thermal stress significantly increased the pharyngeal pumping rate in treated animals compared to the control. Treatment with TWE also showed differential protein expression profiles over control following 2D gel-electrophoresis analysis. Furthermore, TWE significantly altered the expression of at least 40 proteins under thermal stress; among these proteins 34 were up-regulated while six were down-regulated. Mass spectroscopy analysis of the proteins altered by TWE treatment revealed that these proteins were related to heat stress tolerance, energy metabolism and a muscle structure related protein. Among them heat shock proteins, superoxide dismutase, glutathione peroxidase, aldehyde dehydrogenase, saposin-like proteins 20, myosin regulatory light chain 1, cytochrome c oxidase RAS-like, GTP-binding protein RHO A, OS were significantly up-regulated, while eukaryotic translation initiation factor 5A-1 OS, 60S ribosomal protein L18 OS, peroxiredoxin protein 2 were down regulated by TWE treatment. These results were further validated by gene expression and reporter gene expression analyses. Overall results indicate that the water soluble components of Tasco® imparted thermal stress

Thermal expansion coefficients of obliquely deposited MgF2 thin films and their intrinsic stress.

Science.gov (United States)

Jaing, Cheng-Chung

2011-03-20

This study elucidates the effects of columnar angles and deposition angles on the thermal expansion coefficients and intrinsic stress behaviors of MgF2 films with columnar microstructures. The behaviors associated with temperature-dependent stresses in the MgF2 films are measured using a phase-shifting Twyman-Green interferometer with a heating stage and the application of a phase reduction algorithm. The thermal expansion coefficients of MgF2 films at various columnar angles were larger than those of glass substrates. The intrinsic stress in the MgF2 films with columnar microstructures was compressive, while the thermal stress was tensile. The thermal expansion coefficients of MgF2 films with columnar microstructures and their intrinsic stress evidently depended on the deposition angle and the columnar angle.

Electron cyclotron heating and supra-thermal electron dynamics in the TCV Tokamak

Energy Technology Data Exchange (ETDEWEB)

Gnesin, S.

2011-10-15

This thesis is concerned with the physics of supra-thermal electrons in thermonuclear, magnetically confined plasmas. Under a variety of conditions, in laboratory as well as space plasmas, the electron velocity distribution function is not in thermodynamic equilibrium owing to internal or external drives. Accordingly, the distribution function departs from the equilibrium Maxwellian, and in particular generally develops a high-energy tail. In tokamak plasmas, this occurs especially as a result of injection of high-power electromagnetic waves, used for heating and current drive, as well as a result of internal magnetohydrodynamic (MHD) instabilities. The physics of these phenomena is intimately tied to the properties and dynamics of this supra-thermal electron population. This motivates the development of instrumental apparatus to measure its properties as well as of numerical codes to simulate their dynamics. Both aspects are reflected in this thesis work, which features advanced instrumental development and experimental measurements as well as numerical modeling. The instrumental development consisted of the complete design of a spectroscopic and tomographic system of four multi-detector hard X-ray (HXR) cameras for the TCV tokamak. The goal is to measure bremsstrahlung emission from supra-thermal electrons with energies in the 10-300 keV range, with the ultimate aim of providing the first full tomographic reconstruction at these energies in a noncircular plasma. In particular, supra-thermal electrons are generated in TCV by a high-power electron cyclotron heating (ECH) system and are also observed in the presence of MHD events, such as sawtooth oscillations and disruptive instabilities. This diagnostic employs state-of-the-art solid-state detectors and is optimized for the tight space requirements of the TCV ports. It features a novel collimator concept that combines compactness and flexibility as well as full digital acquisition of the photon pulses, greatly

Electron cyclotron heating and supra-thermal electron dynamics in the TCV Tokamak

International Nuclear Information System (INIS)

Gnesin, S.

2011-10-01

This thesis is concerned with the physics of supra-thermal electrons in thermonuclear, magnetically confined plasmas. Under a variety of conditions, in laboratory as well as space plasmas, the electron velocity distribution function is not in thermodynamic equilibrium owing to internal or external drives. Accordingly, the distribution function departs from the equilibrium Maxwellian, and in particular generally develops a high-energy tail. In tokamak plasmas, this occurs especially as a result of injection of high-power electromagnetic waves, used for heating and current drive, as well as a result of internal magnetohydrodynamic (MHD) instabilities. The physics of these phenomena is intimately tied to the properties and dynamics of this supra-thermal electron population. This motivates the development of instrumental apparatus to measure its properties as well as of numerical codes to simulate their dynamics. Both aspects are reflected in this thesis work, which features advanced instrumental development and experimental measurements as well as numerical modeling. The instrumental development consisted of the complete design of a spectroscopic and tomographic system of four multi-detector hard X-ray (HXR) cameras for the TCV tokamak. The goal is to measure bremsstrahlung emission from supra-thermal electrons with energies in the 10-300 keV range, with the ultimate aim of providing the first full tomographic reconstruction at these energies in a noncircular plasma. In particular, supra-thermal electrons are generated in TCV by a high-power electron cyclotron heating (ECH) system and are also observed in the presence of MHD events, such as sawtooth oscillations and disruptive instabilities. This diagnostic employs state-of-the-art solid-state detectors and is optimized for the tight space requirements of the TCV ports. It features a novel collimator concept that combines compactness and flexibility as well as full digital acquisition of the photon pulses, greatly

Enhanced thermal stability of a polymer solar cell blend induced by electron beam irradiation in the transmission electron microscope.

Science.gov (United States)

Bäcke, Olof; Lindqvist, Camilla; de Zerio Mendaza, Amaia Diaz; Gustafsson, Stefan; Wang, Ergang; Andersson, Mats R; Müller, Christian; Kristiansen, Per Magnus; Olsson, Eva

2017-05-01

We show by in situ microscopy that the effects of electron beam irradiation during transmission electron microscopy can be used to lock microstructural features and enhance the structural thermal stability of a nanostructured polymer:fullerene blend. Polymer:fullerene bulk-heterojunction thin films show great promise for use as active layers in organic solar cells but their low thermal stability is a hindrance. Lack of thermal stability complicates manufacturing and influences the lifetime of devices. To investigate how electron irradiation affects the thermal stability of polymer:fullerene films, a model bulk-heterojunction film based on a thiophene-quinoxaline copolymer and a fullerene derivative was heat-treated in-situ in a transmission electron microscope. In areas of the film that exposed to the electron beam the nanostructure of the film remained stable, while the nanostructure in areas not exposed to the electron beam underwent large phase separation and nucleation of fullerene crystals. UV-vis spectroscopy shows that the polymer:fullerene films are stable for electron doses up to 2000kGy. Copyright © 2016 Elsevier B.V. All rights reserved.

Survival of juvenile fishes receiving thermal and mechanical stresses in a simulated power plant condenser

International Nuclear Information System (INIS)

Kedl, R.J.; Coutant, C.C.

Experiments were conducted in a water-recirculating loop to determine the effects of fluid-induced stresses (e.g., turbulence, pressure, and vacuum) on six species of larval fish and one species each of frog tadpoles and zooplankton. These stresses simulate the insults developed in the condenser portion, but not including the pump, of a steam power plant. Some experiments were conducted with thermal stresses superimposed on fluid-induced stresses. Fluid-induced stresses of the magnitude developed in these experiments were generally not fatal to the larval fish within the precision of the experiments, although some sublethal effects were noted. When thermal stress was superimposed on the fluid-induced stresses, the mortalities were equivalent to those resulting from thermal stress alone. Fluid-induced stresses of low magnitude were not fatal to Daphnia magna, but fluid-induced stresses of higher magnitude were responsible for significant mortalities. (U.S.)

On the Boltzmann Equation of Thermal Transport for Interacting Phonons and Electrons

Directory of Open Access Journals (Sweden)

Amelia Carolina Sparavigna

2016-05-01

Full Text Available The thermal transport in a solid can be determined by means of the Boltzmann equations regarding its distributions of phonons and electrons, when the solid is subjected to a thermal gradient. After solving the coupled equations, the related thermal conductivities can be obtained. Here we show how to determine the coupled equations for phonons and electrons.

Transient thermal stresses in composite hollow circular cylinder due to partial heat generation

International Nuclear Information System (INIS)

Goshima, Takahito; Miyao, Kaju

1979-01-01

Clad materials are adopted for the machines and structures used in contact with high temperature, corrosive atmosphere in view of their strength and economy. Large thermal stress sometimes arises in clad cylinders due to uneaven temperature field and the difference in linear thermal expansion. Vessels are often heated uneavenly, and shearing stress occurs, which is not observed in uniform heating. In this study, infinitely long, concentric cylinders of two layers were analyzed, when the internal heat changing in stepped state is generated in cylindrical form. The unsteady thermal stress occurred was determined, using thermo-elastic potential and stress functions, and assuming the thermal properties and elastic modulus of materials as constant regardless of the temperature. Laplace transformation was used, and the basic equations for thermo-elastic displacement were employed as the basis of calculation. The analysis of the temperature distribution and stress is explained. Numerical calculation was carried out on the example of an internal cylinder of SUS 304 stainless steel and an external cylinder of mild steel. The maximum shearing stress occurred in the direction of 40 deg from the heat source, and was affected largely by the position of heat generation. The effect became remarkable as time elapsed. (Kako, I.)

Significance of fundamental processes of radiation chemistry in hot atom chemical processes: electron thermalization

International Nuclear Information System (INIS)

Nishikawa, M.

1984-01-01

The author briefly reviews the current understanding of the course of electron thermalization. An outline is given of the physical picture without going into mathematical details. The analogy of electron thermalization with hot atom processes is taken as guiding principle in this paper. Content: secondary electrons (generation, track structure, yields); thermalization (mechanism, time, spatial distribution); behaviour of hot electrons. (Auth.)

Effect of thermal stresses on the mechanism of tooth pain.

Science.gov (United States)

Oskui, Iman Z; Ashtiani, Mohammed N; Hashemi, Ata; Jafarzadeh, Hamid

2014-11-01

Daily hot and cold thermal loadings on teeth may result in structural deformation, mechanical stress, and pain signaling. The aim of this study was to compare the adverse effects of hot and cold beverages on an intact tooth and, then, to provide physical evidence to support the hydrodynamic theory of tooth pain sensation mechanism. Three-dimensional finite element analysis was performed on a premolar model subjected to hot and cold thermal loadings. Elapsed times for heat diffusion and stress detection at the pulp-dentin junction were calculated as measures of the pain sensation. Extreme tensile stress within the enamel resulted in damage in cold loadings. Also, extreme values of stress at the pulpal wall occurred 21.6 seconds earlier than extreme temperatures in hot and cold loadings. The intact tooth was remarkably vulnerable to cold loading. Earlier changes in mechanical stress rather than temperature at the pulp-dentin junction indicate that the dental pain caused by hot or cold beverages may be based on the hydrodynamic theory. Copyright © 2014 American Association of Endodontists. Published by Elsevier Inc. All rights reserved.

Electronic processes in uniaxially stressed p-type germanium

Energy Technology Data Exchange (ETDEWEB)

Dubon, Jr., Oscar Danilo [Univ. of California, Berkeley, CA (United States)

1996-02-01

Effect of uniaxial stress on acceptor-related electronic processes in Ge single crystals doped with Ga, Be, and Cu were studied by Hall and photo-Hall effect measurements in conjunction with infrared spectroscopy. Stress dependence of hole lifetime in p-type Ge single crystals is used as a test for competing models of non-radiative capture of holes by acceptors. Photo-Hall effect shows that hole lifetime in Ga- and Be-doped Ge increases by over one order of magnitude with uniaxial stress at liq. He temps. Photo-Hall of Ge:Be shows a stress-induced change in the temperature dependence of hole lifetime. This is consistent with observed increase of responsivity of Ge:Ga detectors with uniaxial stress. Electronic properties of Ge:Cu are shown to change dramatically with uniaxial stress; the results provide a first explanation for the performance of uniaxially stressed, Cu-diffused Ge:Ga detectors which display a high conductivity in absence of photon signal and therefore have poor sensitivity.

Mosaic-shaped cathode for highly durable solid oxide fuel cell under thermal stress

Science.gov (United States)

Joo, Jong Hoon; Jeong, Jaewon; Kim, Se Young; Yoo, Chung-Yul; Jung, Doh Won; Park, Hee Jung; Kwak, Chan; Yu, Ji Haeng

2014-02-01

In this study, we propose a novel "mosaic structure" for a SOFC (solid oxide fuel cell) cathode with high thermal expansion to improve the stability against thermal stress. Self-organizing mosaic-shaped cathode has been successfully achieved by controlling the amount of binder in the dip-coating solution. The anode-supported cell with mosaic-shaped cathode shows itself to be highly durable performance for rapid thermal cycles, however, the performance of the cell with a non-mosaic cathode exhibits severe deterioration originated from the delamination at the cathode/electrolyte interface after 7 thermal cycles. The thermal stability of an SOFC cathode can be evidently improved by controlling the surface morphology. In view of the importance of the thermal expansion properties of the cathode, the effects of cathode morphology on the thermal stress stability are discussed.

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics.

Science.gov (United States)

Subramaniam, Chandramouli; Yasuda, Yuzuri; Takeya, Satoshi; Ata, Seisuke; Nishizawa, Ayumi; Futaba, Don; Yamada, Takeo; Hata, Kenji

2014-03-07

Increasing functional complexity and dimensional compactness of electronic devices have led to progressively higher power dissipation, mainly in the form of heat. Overheating of semiconductor-based electronics has been the primary reason for their failure. Such failures originate at the interface of the heat sink (commonly Cu and Al) and the substrate (silicon) due to the large mismatch in thermal expansion coefficients (∼300%) of metals and silicon. Therefore, the effective cooling of such electronics demands a material with both high thermal conductivity and a similar coefficient of thermal expansion (CTE) to silicon. Addressing this demand, we have developed a carbon nanotube-copper (CNT-Cu) composite with high metallic thermal conductivity (395 W m(-1) K(-1)) and a low, silicon-like CTE (5.0 ppm K(-1)). The thermal conductivity was identical to that of Cu (400 W m(-1) K(-1)) and higher than those of most metals (Ti, Al, Au). Importantly, the CTE mismatch between CNT-Cu and silicon was only ∼10%, meaning an excellent compatibility. The seamless integration of CNTs and Cu was achieved through a unique two-stage electrodeposition approach to create an extensive and continuous interface between the Cu and CNTs. This allowed for thermal contributions from both Cu and CNTs, resulting in high thermal conductivity. Simultaneously, the high volume fraction of CNTs balanced the thermal expansion of Cu, accounting for the low CTE of the CNT-Cu composite. The experimental observations were in good quantitative concurrence with the theoretically described 'matrix-bubble' model. Further, we demonstrated identical in-situ thermal strain behaviour of the CNT-Cu composite to Si-based dielectrics, thereby generating the least interfacial thermal strain. This unique combination of properties places CNT-Cu as an isolated spot in an Ashby map of thermal conductivity and CTE. Finally, the CNT-Cu composite exhibited the greatest stability to temperature as indicated by its low

Transient thermal stresses in multiple connected region exhibiting temperature dependence of material properties

International Nuclear Information System (INIS)

Sugano, Yoshihiro; Maekawa, Toshiya.

1983-01-01

The examples of the analysis of thermal stress in multiple connection regions such as heat exchangers, nuclear reactor cores, ingot cases and polygonal region with elliptic holes are not few, but the temperature dependence of material constants was neglected in these researches because of the difficulty of analysis though the industrial problems related to thermal stress are apt to occur in the condition of relatively large temperature gradient. Also, the analysis of heat conduction problems taking the temperature dependence of material constants into account was limited to one-dimensional problems for which Kirchhoff's transmission can be used. The purpose of this study is to derive the equation of condition which assures the one-value property of rotation and displacement, taking the temperature dependence of material constants into account, and to complete the formulation of the plane thermal stress problems in multiple connection regions by stress function method. Also the method of numerical analysis using difference method is shown to examine the effectiveness of various formulated equations and the effect of the temperature dependence of material constants on temperature and thermal stress. The example of numerical calculation on a thin rectangular plate with a rectangular hole is shown. (Kako, I.)

Coupling analysis of the target temperature and thermal stress due to pulsed ion beam

International Nuclear Information System (INIS)

Yan Jie; Liu Meng; Lin Jufang; An Li; Long Xinggui

2013-01-01

Background: Target temperature has an important effect on the target life for the sealed neutron generator without cooling system. Purpose: To carry out the thermal-mechanical coupling analysis of the film-substrate target bombarded by the pulsed ion beam. Methods: The indirect coupling Finite Element Method (FEM) with a 2-dimensional time-space Gaussian axisymmetric power density as heat source was used to simulate the target temperature and thermal stress fields. Results: The effects of the target temperature and thermal stress fields under difference pulse widths and beam sizes were analyzed in terms of the FEM results. Conclusions: Combining with the temperature requirement and the thermal stress inducing film thermal mechanical destruction effect of the sealed neutron generator film-substrate targets, an optimized pulsed ion beam work status was proposed. (authors)

Thermal stresses and cyclic creep-fatigue in fusion reactor blanket

International Nuclear Information System (INIS)

Liu, K.C.

1977-01-01

Thermal stresses in the first walls of fusion reactor blankets were studied in detail. ORNL multibucket modules are emphasized. Practicality of using the bucket module rather than other blanket designs is examined. The analysis shows that applying intelligent engineering judgment in design can reduce the thermal stresses significantly. Arrangement of coolant flow and distribution of temperature are reviewed. Creep-fatigue property requirements for a first wall are discussed on the basis of existing design rules and criteria. Some major questions are pointed out and experiments needed to resolve basic uncertainties relative to key design decisions are discussed

Cure Behavior and Thermal Properties of Diepoxidized Cardanol Resin Cured by Electron Beam Process

International Nuclear Information System (INIS)

Cho, Donghwan; Cheon, Jinsil

2013-01-01

Thermal curing of epoxy resin requires high temperature, time-consuming process and the volatilization of hardener. It has known that electron beam curing of epoxy resin is a fast process and occurs at low or room temperature that help reduce residual mechanical stresses in thermosetting polymers. Diepoxidized cardanol (DEC) can be synthesized by an enzymatic method from cashew nut shell liquid (CNSL), that constitutes nearly one-third of the total nut weight. A large amount of CNSL can be formed as a byproduct of the mechanical processes used to render the cashew kerneledible and its total production approaches one million tons annually, which can be bio-degradable and replace the industrial thermosetting plastics. It is expected that DEC may be cured as in an epoxy resin, which was constituted on two epoxide group and long alkyl chain, and two-types of onium salts (cationic initiator) were used as a photo-initiator. The experimental variables of this study are type and concentration of photo-initiators and electron beam dosage. In this study, the effects of initiator type and concentration on the cure behavior and the thermal properties of DEC resin processed by using electron beam technology were studied using FT-IR, TGA, TMA, DSC, and DMA. Figure 1 is the FT-IR results, showing the change of chemical structure of pure DEC and electron beam cured DEC. The characteristic absorption peak of epoxide group appeared at 850cm -1 . The shape and the height were reduced when the sample was irradiated with electron beam. From this result, the epoxide groups is DEC were opened by electron beam and cured. After then, electron beam cured DEC was investigated the effect of forming 3-dimensional network

Cure Behavior and Thermal Properties of Diepoxidized Cardanol Resin Cured by Electron Beam Process

Energy Technology Data Exchange (ETDEWEB)

Cho, Donghwan; Cheon, Jinsil [Kumoh National Institute of Technology, Gumi (Korea, Republic of)

2013-07-01

Thermal curing of epoxy resin requires high temperature, time-consuming process and the volatilization of hardener. It has known that electron beam curing of epoxy resin is a fast process and occurs at low or room temperature that help reduce residual mechanical stresses in thermosetting polymers. Diepoxidized cardanol (DEC) can be synthesized by an enzymatic method from cashew nut shell liquid (CNSL), that constitutes nearly one-third of the total nut weight. A large amount of CNSL can be formed as a byproduct of the mechanical processes used to render the cashew kerneledible and its total production approaches one million tons annually, which can be bio-degradable and replace the industrial thermosetting plastics. It is expected that DEC may be cured as in an epoxy resin, which was constituted on two epoxide group and long alkyl chain, and two-types of onium salts (cationic initiator) were used as a photo-initiator. The experimental variables of this study are type and concentration of photo-initiators and electron beam dosage. In this study, the effects of initiator type and concentration on the cure behavior and the thermal properties of DEC resin processed by using electron beam technology were studied using FT-IR, TGA, TMA, DSC, and DMA. Figure 1 is the FT-IR results, showing the change of chemical structure of pure DEC and electron beam cured DEC. The characteristic absorption peak of epoxide group appeared at 850cm{sup -1}. The shape and the height were reduced when the sample was irradiated with electron beam. From this result, the epoxide groups is DEC were opened by electron beam and cured. After then, electron beam cured DEC was investigated the effect of forming 3-dimensional network.

Application of phase change materials in thermal management of electronics

International Nuclear Information System (INIS)

Kandasamy, Ravi; Wang Xiangqi; Mujumdar, Arun S.

2007-01-01

Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications

Transient thermal stresses in a transversely isotropic finite hollow circular cylinder due to arbitrary surface heat generations

International Nuclear Information System (INIS)

Sugano, Yoshihiro; Nakanishi, Takanori.

1980-01-01

The materials macroscopically regarded as anisotropic materials such as fiber-reinforced composite materials have become to be used for the structural elements at elevated temperature, and the studies on the problem of thermal stress in anisotropic bodies are carried out actively. The unsteady thermal stress in anisotropic finite circular cylinders has not been analyzed so far. In this study, the problem of unsteady thermal stress in an anisotropic finite circular cylinder having arbitrary surface heat generation in axial direction on the internal and external surfaces, and emitting heat from both ends and the internal and external surfaces, was analyzed. For the analysis of temperature distribution, generalized finite Fourier transformation and finite Hankel transformation were used, and thermal stress and thermal displacement were analyzed by the use of the stress function of Singh. By adopting the function used for the transformation nucleus in generalized finite Fourier transformation as the stress function, the analysis was made without separating symmetric and opposite symmetric problems. Numerical calculation was carried out on the basis of the analytical results, and the effects of the anisotropy in thermal conductivity, Young's modulus and linear expansion on unsteady temperature distribution, thermal stress and thermal displacement were quantitatively examined. (Kako, I.)

Preparation and thermal performance of paraffin/Nano-SiO2 nanocomposite for passive thermal protection of electronic devices

International Nuclear Information System (INIS)

Wang, Yaqin; Gao, Xuenong; Chen, Peng; Huang, Zhaowen; Xu, Tao; Fang, Yutang; Zhang, Zhengguo

2016-01-01

Highlights: • Three types of paraffin/nano-SiO 2 nanocomposites were prepared and characterized. • Thermo-physical properties of these composites were determined and compared. • One composite with lower thermal conductivity showed better thermal insulation properties. • This composite was identified as thermal insulation material for electronic components. - Abstract: In this paper, three grades of nano silicon dioxide (nano-SiO 2 ), NS1, NS2 and NS3, were mixed into paraffin to prepare nanocomposites as novel insulation materials for electronic passive thermal protection applications. The optimal mass percentages of paraffin for the three composites, NS1P, NS2P and NS3P, were determined to be 75%, 70% and 65%, respectively. Investigations by means of scanning electron micrographs (SEM), differential scanning calorimeter (DSC), thermogravimetric analysis (TG), hot disk analyzer and thermal protection performance tests were devoted to the morphology, thermal properties and thermal protection performance analysis of composites. Experimental results showed that paraffin uniformly distributed into the pores and on the surface of nano-SiO 2 . Melting points of composites declined and experimental latent heat became lower than the calculated values with the decrease of nano-SiO 2 pore size. The NS1P composite had larger thermal storage capacity, better reliability and stability compared with NS2P and NS3P. In addition, compared with 90% wt.% paraffin/EG composite, the incorporation of NS1 (25 wt.%) into paraffin caused not only 63.2% reduction in thermal conductivity, but also 21.8% increase in thermal protection time affected by the ambient temperature. Thus those good properties confirmed that NS1P (75 wt.%) composite was a viable candidate for protecting electronic devices under high temperature environment.

Simulation of electron thermal transport in H-mode discharges

International Nuclear Information System (INIS)

Rafiq, T.; Pankin, A. Y.; Bateman, G.; Kritz, A. H.; Halpern, F. D.

2009-01-01

Electron thermal transport in DIII-D H-mode tokamak plasmas [J. L. Luxon, Nucl. Fusion 42, 614 (2002)] is investigated by comparing predictive simulation results for the evolution of electron temperature profiles with experimental data. The comparison includes the entire profile from the magnetic axis to the bottom of the pedestal. In the simulations, carried out using the automated system for transport analysis (ASTRA) integrated modeling code, different combinations of electron thermal transport models are considered. The combinations include models for electron temperature gradient (ETG) anomalous transport and trapped electron mode (TEM) anomalous transport, as well as a model for paleoclassical transport [J. D. Callen, Nucl. Fusion 45, 1120 (2005)]. It is found that the electromagnetic limit of the Horton ETG model [W. Horton et al., Phys. Fluids 31, 2971 (1988)] provides an important contribution near the magnetic axis, which is a region where the ETG mode in the GLF23 model [R. E. Waltz et al., Phys. Plasmas 4, 2482 (1997)] is below threshold. In simulations of DIII-D discharges, the observed shape of the H-mode edge pedestal is produced when transport associated with the TEM component of the GLF23 model is suppressed and transport given by the paleoclassical model is included. In a study involving 15 DIII-D H-mode discharges, it is found that with a particular combination of electron thermal transport models, the average rms deviation of the predicted electron temperature profile from the experimental profile is reduced to 9% and the offset to -4%.

Monte Carlo studies of thermalization of electron-hole pairs in spin-polarized degenerate electron gas in monolayer graphene

Science.gov (United States)

Borowik, Piotr; Thobel, Jean-Luc; Adamowicz, Leszek

2018-02-01

Monte Carlo method is applied to the study of relaxation of excited electron-hole (e-h) pairs in graphene. The presence of background of spin-polarized electrons, with high density imposing degeneracy conditions, is assumed. To such system, a number of e-h pairs with spin polarization parallel or antiparallel to the background is injected. Two stages of relaxation: thermalization and cooling are clearly distinguished when average particles energy and its standard deviation σ _E are examined. At the very beginning of thermalization phase, holes loose energy to electrons, and after this process is substantially completed, particle distributions reorganize to take a Fermi-Dirac shape. To describe the evolution of and σ _E during thermalization, we define characteristic times τ _ {th} and values at the end of thermalization E_ {th} and σ _ {th}. The dependence of these parameters on various conditions, such as temperature and background density, is presented. It is shown that among the considered parameters, only the standard deviation of electrons energy allows to distinguish between different cases of relative spin polarizations of background and excited electrons.

Ultrafast Non-Thermal Electron Dynamics in Single Layer Graphene

Directory of Open Access Journals (Sweden)

Novoselov K.S.

2013-03-01

Full Text Available We study the ultrafast dynamics of non-thermal electron relaxation in graphene upon impulsive excitation. The 10-fs resolution two color pump-probe allows us to unveil the non-equilibrium electron gas decay at early times.

Low-stress photosensitive polyimide suspended membrane for improved thermal isolation performance

Science.gov (United States)

Fan, J.; Xing, R. Y.; Wu, W. J.; Liu, H. F.; Liu, J. Q.; Tu, L. C.

2017-11-01

In this paper, we introduce a method of isolating thermal conduction from silicon substrate for accommodating thermal-sensitive micro-devices. This method lies in fabrication of a low-stress photosensitive polyimide (PSPI) suspension structure which has lower thermal conductivity than silicon. First, a PSPI layer was patterned on a silicon wafer and hard baked. Then, a cavity was etched from the backside of the silicon substrate to form a membrane or a bridge-shape PSPI structure. After releasing, a slight deformation of about 20 nm was observed in the suspended structures, suggesting ultralow residual stress which is essential for accommodating micro-devices. In order to investigate the thermal isolation performance of the suspended PSPI structures, micro Pirani vacuum gauges, which are thermal-sensitive, had been fabricated on the PSPI structures. The measurement results illustrated that the Pirani gauges worked as expected in the range from 1- 470 Pa. Moreover, the results of the Pirani gauges based on the membrane and bridge structures were comparable, indicating that the commonly used bridge-shape structure for further reducing thermal conduction was unnecessary. Due to the excellent thermal isolation performance of PSPI, the suspended PSPI membrane is promising to be an outstanding candidate for thermal isolation applications.

Stress and reliability analyses of multilayered composite cylinder under thermal and mechanical loads

Science.gov (United States)

Wang, Xiaohua

The coupling resulting from the mutual influence of material thermal and mechanical parameters is examined in the thermal stress analysis of a multilayered isotropic composite cylinder subjected to sudden axisymmetric external and internal temperature. The method of complex frequency response functions together with the Fourier transform technique is utilized. Because the coupling parameters for some composite materials, such as carbon-carbon, are very small, the effect of coupling is neglected in the orthotropic thermal stress analysis. The stress distributions in multilayered orthotropic cylinders subjected to sudden axisymmetric temperature loading combined with dynamic pressure as well as asymmetric temperature loading are also obtained. The method of Fourier series together with the Laplace transform is utilized in solving the heat conduction equation and thermal stress analysis. For brittle materials, like carbon-carbon composites, the strength variability is represented by two or three parameter Weibull distributions. The 'weakest link' principle which takes into account both the carbon-carbon composite cylinders. The complex frequency response analysis is performed on a multilayered orthotropic cylinder under asymmetrical thermal load. Both deterministic and random thermal stress and reliability analyses can be based on the results of this frequency response analysis. The stress and displacement distributions and reliability of rocket motors under static or dynamic line loads are analyzed by an elasticity approach. Rocket motors are modeled as long hollow multilayered cylinders with an air core, a thick isotropic propellant inner layer and a thin orthotropic kevlar-epoxy case. The case is treated as a single orthotropic layer or a ten layered orthotropic structure. Five material properties and the load are treated as random variable with normal distributions when the reliability of the rocket motor is analyzed by the first-order, second-moment method (FOSM).

Effects of thermal residual stresses and fiber packing on deformation of metal-matrix composites

International Nuclear Information System (INIS)

Nakamura, T.; Suresh, S.

1993-01-01

The combined effects of thermal residual stresses and fiber spatial distribution on the deformation of a 6061 aluminum alloy containing a fixed concentration unidirectional boron fibers have been analyzed using detailed finite element models. The geometrical structure includes perfectly periodic, uniformly space fiber arrangements in square and hexagonal cells, as well as different cells in which either 30 or 60 fibers are randomly placed in the ductile matrix. The model involves an elastic-plastic matrix, elastic fibers, and mechanically bonded interfaces. The results indicate that both fiber packing and thermal residual stresses can have a significant effect on the stress-strain characteristics of the composite. The thermal residual stresses cause pronounced matrix yielding which also influences the apparent overall stiffness of the composite during the initial stages of subsequent far-field loading along the axial and transverse direction. Furthermore, the thermal residual stresses apparently elevate the flow stress of the composite during transverse tension. Such effects can be traced back to the level of constraint imposed on the matrix by local fiber spacing. The implications of the present results to the processing of the composites are also briefly addressed

Experiments and analysis of thermal stresses around the nozzle of the reactor vessel

International Nuclear Information System (INIS)

Song, D.H.; Oh, J.H.; Song, H.K.; Park, D.S.; Shon, K.H.

1981-01-01

This report describes the results of analysis and experiments on the thermal stress around the reactor vessel nozzle performed to establish a capability of thermal stress analysis of pressure vessel subjected to thermal loadings. Firstly, heat conduction analysis during reactor design transients and analysis on the experimental model were performed using computer code FETEM-1 for the purpose of verification of FETEM-1 which was developed in 1979 and will be used to obtain the temperature distribution in a solid body under the steady-state and the transient conditions. The results of the analysis was compared to the results in the Stress Report of Kori-1 reactor vessel and those from experiments on the model, respectively

Modelling and analysis of radial thermal stresses and temperature ...

African Journals Online (AJOL)

user

The temperature field, heat transfer rate and thermal stresses were investigated with numerical simulation models using FORTRAN FE (finite element) software. ...... specific heats, International Communications in Heat and Mass Transfer, Vol.

Residual stress determination in thermally sprayed metallic deposits by neutron diffraction

International Nuclear Information System (INIS)

Keller, Thomas; Margadant, Nikolaus; Pirling, Thilo; Riegert-Escribano, Maria J.; Wagner, Werner

2004-01-01

Neutron diffraction was used to obtain spatially resolved strain and stress profiles in thermally sprayed metallic 'NiCrAlY' deposits (chemical composition 67 wt.% Ni, 22 wt.% Cr, 10 wt.% Al, 1 wt.% Y) and the underlying steel substrates. Samples of four different spray techniques were analyzed: atmospheric and water stabilized plasma spraying (APS and WSP), flame spraying (FS) and wire arc spraying (WAS). The results are quantitatively compared with the average in-plane residual stress determined by complementary bending tests and the hole drilling technique. While the stress profiles from the surface to the interface in the deposits are similar for all investigated spray techniques, their absolute values and gradients vary strongly. This is attributed to different quenching stresses from the impinging particles, different thermal histories the deposit/substrate systems undergo during the spraying and subsequent cooling, and also to different coating properties. In the water stabilized plasma sprayed and the wire arc sprayed deposits, a gradient in the stress-free lattice parameter was observed. Crack formation is found to be a dominant mechanism for stress relaxation in the surface plane

Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling

Data.gov (United States)

National Aeronautics and Space Administration — A method has been developed for prognostication of accrued prior damage in electronics subjected to overlapping sequential environments of thermal aging and thermal...

Haemoglobin-mediated response to hyper-thermal stress in the keystone species Daphnia magna.

Science.gov (United States)

Cuenca Cambronero, Maria; Zeis, Bettina; Orsini, Luisa

2018-01-01

Anthropogenic global warming has become a major geological and environmental force driving drastic changes in natural ecosystems. Due to the high thermal conductivity of water and the effects of temperature on metabolic processes, freshwater ecosystems are among the most impacted by these changes. The ability to tolerate changes in temperature may determine species long-term survival and fitness. Therefore, it is critical to identify coping mechanisms to thermal and hyper-thermal stress in aquatic organisms. A central regulatory element compensating for changes in oxygen supply and ambient temperature is the respiratory protein haemoglobin (Hb). Here, we quantify Hb plastic and evolutionary response in Daphnia magna subpopulations resurrected from the sedimentary archive of a lake with known history of increase in average temperature and recurrence of heat waves. By measuring constitutive changes in crude Hb protein content among subpopulations, we assessed evolution of the Hb gene family in response to temperature increase. To quantify the contribution of plasticity in the response of this gene family to hyper-thermal stress, we quantified changes in Hb content in all subpopulations under hyper-thermal stress as compared to nonstressful temperature. Further, we tested competitive abilities of genotypes as a function of their Hb content, constitutive and induced. We found that Hb-rich genotypes have superior competitive abilities as compared to Hb-poor genotypes under hyper-thermal stress after a period of acclimation. These findings suggest that whereas long-term adjustment to higher occurrence of heat waves may require a combination of plasticity and genetic adaptation, plasticity is most likely the coping mechanism to hyper-thermal stress in the short term. Our study suggests that with higher occurrence of heat waves, Hb-rich genotypes may be favoured with potential long-term impact on population genetic diversity.

Electron diffraction patterns with thermal diffuse scattering maxima around Kikuchi lines

International Nuclear Information System (INIS)

Karakhanyan, R. K.; Karakhanyan, K. R.

2011-01-01

Transmission electron diffraction patterns of silicon with thermal diffuse maxima around Kikuchi lines, which are analogs of the maxima of thermal diffuse electron scattering around point reflections, have been recorded. Diffuse maxima are observed only around Kikuchi lines with indices that are forbidden for the silicon structure. The diffraction conditions for forming these maxima are discussed.

Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

Directory of Open Access Journals (Sweden)

Masaru Ishizuka

2011-01-01

Full Text Available In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

Thermal-stress analysis and testing of DIII-D armor tiles

International Nuclear Information System (INIS)

Baxi, C.B.; Anderson, P.M.; Reis, E.E.; Smith, J.P.; Smith, P.D.; Croesmann, C.; Watkins, J.; Whitley, J.

1987-10-01

It is planned to install about 1500 new armor tiles in the DIII-D tokamak. The armor tiles currently installed in DIII-D are made by brazing Poco AXF-5Q graphite onto Inconel X-750 stock. A small percentage of these have failed by breakage of graphite. These failures were believed to be related to significant residual stress remaining in graphite after brazing. Hence, an effort was undertaken to improve the design with all-graphite tiles. Three criteria must be satisfied by the armor tiles and the hardware used to attach the tiles to the vessel walls: tiles should not structurally fail, peak tile temperature must be less than 2500 K, and peak vessel stresses must be below acceptable levels. A number of alternate design concepts were first analyzed with the two-dimensional finite element codes TOPAZ2D and NIKE2D. Promising designs were optimized for best parameters such as thicknesses, etc. The two best designs were further analyzed for thermal stresses with the three-dimensional codes P/THERMAL and P/STRESS. Prototype tiles of a number of materials were fabricated by GA and tested at the Plasma Materials Test Facility of the Sandia National Laboratory at Albuquerque. The tests simulated the heat flux and cooling conditions in DIII-D. This paper describes the 2-D and 3-D thermal stress analyses, the test results and logic which led to the selected design of the DIII-D armor tiles. 5 refs., 7 figs., 3 tabs

Effect of electronic contribution on temperature-dependent thermal transport of antimony telluride thin film

Energy Technology Data Exchange (ETDEWEB)

Lee, Won-Yong; Park, No-Won [Department of Physics, Chung-Ang University, Seoul 156-756 (Korea, Republic of); Hong, Ji-Eun [Department of Materials Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of); Yoon, Soon-Gil, E-mail: sgyoon@cnu.ac.kr [Department of Materials Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of); Koh, Jung-Hyuk [School of Electrical and Electronics Engineering, Chung-Ang University, Seoul 156-756 (Korea, Republic of); Lee, Sang-Kwon, E-mail: sangkwonlee@cau.ac.kr [Department of Physics, Chung-Ang University, Seoul 156-756 (Korea, Republic of)

2015-01-25

Highlights: • We investigated thermal transport of the antimony telluride thin films. • The contribution of the electronic thermal conductivity increased up to ∼77% at 300 K. • We theoretically analyze and explain the high contribution of electronic component. - Abstract: We study the theoretical and experimental characteristics of thermal transport of 100 nm and 500 nm-thick antimony telluride (Sb{sub 2}Te{sub 3}) thin films prepared by radio frequency magnetron sputtering. The thermal conductivity was measured at temperatures ranging from 20 to 300 K, using four-point-probe 3-ω method. Out-of-plane thermal conductivity of the Sb{sub 2}Te{sub 3} thin film was much lesser in comparison to the bulk material in the entire temperature range, confirming that the phonon- and electron-boundary scattering are enhanced in thin films. Moreover, we found that the contribution of the electronic thermal conductivity (κ{sub e}) in total thermal conductivity (κ) linearly increased up to ∼77% at 300 K with increasing temperature. We theoretically analyze and explain the high contribution of electronic component of thermal conductivity towards the total thermal conductivity of the film by a modified Callaway model. Further, we find the theoretical model predictions to correspond well with the experimental results.

Photothermoelastic investigation of transient thermal stresses in circular plates with a hole heated by fluid

International Nuclear Information System (INIS)

Tsuji, Masatoshi; Tsujimura, Soichi; Oda, Masanobu.

1980-01-01

In this study, the practical use of the method of measuring the unsteady thermal stress in a body subjected to the thermal load due to fluid by photoelastic method and the improvement of accuracy were attempted. The internal wall of a hollow disk was heated with high temperature fluid, and the external wall was cooled with low temperature fluid or thermally insulated. The photoelastic experiment on this hollow disk was carried out in a vacuum tank to given axisymmetric temperature distribution and to prevent heat dissipation due to the convection from both surfaces of the disk, and the temperature distribution and thermal stress were measured. The experimental values were compared with the theoretical values, and the accuracy of the experimental method and measurement was examined. Moreover, the disk with an eccentric hole was tested by the same method, and the effects of the eccentricity and hole diameter on the maximum thermal stress were examined. The experimental apparatus and method, and the experimental results are described. By this method, the condition of thermal loading with fluid was almost attained, and the experimental values of unsteady thermal stress were in good agreement with the theoretical values. (Kako, I.)

Thermal and stress analyses in thermoelectric generator with tapered and rectangular pin configurations

International Nuclear Information System (INIS)

Yilbas, Bekir Sami; Akhtar, S.S.; Sahin, A.Z.

2016-01-01

Thermal stress developed in thermoelectric generators is critical for long service applications. High temperature gradients, due to a large temperature difference across the junctions, causes excessive stress levels developed in the device pins and electrodes at the interfaces. In the present study, a thermoelectric generator with horizontal pin configuration is considered and thermal stress analysis in the device is presented. Ceramic wafer is considered to resemble the high temperature plate and copper electrodes are introduced at the pin junctions to reduce the electrical resistance between the pins and the high and low temperature junction plates during the operation. Finite element code is used to simulate temperature and stress fields in the thermoelectric generator. In the simulations, convection and radiation losses from the thermoelectric pins are considered and bismuth telluride pin material with and without tapering is incorporated. It is found that von Mises stress attains high values at the interface between the hot and cold junctions and the copper electrodes. Thermal stress developed in tapered pin configuration attains lower values than that of rectangular pin cross-section. - Highlights: • Different cold junction temperatures improves thermoelectric generator performance. • von Mises stress remains high across copper electrodes and hot junction ceramics. • von Mises stress reduces along pin length towards cold junction. • Pin tapering lowers stress levels in thermoelectric generator.

Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds

Directory of Open Access Journals (Sweden)

Bajčičák Martin

2014-06-01

Full Text Available The paper is focused on the study of thermal stress of surface of mold cavities and parting line of silicone molds after pouring. The silicone mold White SD - THT was thermally stressed by pouring of ZnAl4Cu3 zinc alloy with pouring cycle 20, 30 and 40 seconds. The most thermally stressed part of surface at each pouring cycle is gating system and mold cavities. It could be further concluded that linear increase of the pouring cycle time leads to the exponential increasing of the maximum temperature of mold surface after its cooling. The elongated pouring cycle increases the temperature accumulated on the surface of cavities and the ability of silicone mold to conduct the heat on its surface decreases, because the low thermal conductivity of silicone molds enables the conduction of larger amount of heat into ambient environment.

A 3D graphene interface (Si-doped) of Ag matrix with excellent electronic transmission and thermal conductivity via nano-assembly modification

Science.gov (United States)

Ye, Xianzhu; Li, Ming; Zhang, Yafei

2018-04-01

The wide development of electronic materials requires higher load capacity and high temperature resistance. In this study, a novel architecture was fabricated consisting of a 3D reduced graphene oxide (rGO)-Si interface using a simple nano-assembly sintering to achieve high current capacity and excellent thermal features. Via the analysis of catalytic oxidation for methanol, the loading catalytic activity of nano-Ag still remained to a certain extent for the composite with 0.8 vol.% rGO. The final Ag-rGO composite apparently possesses a higher initial oxidation temperature and lower rate of oxidation for internal passing and shielding, and the thermal conductivity is significantly enhanced from 344 to 407 W m‑1 K‑1. Importantly, with a 3D synergistic transportation network, the resistivity of the Ag-rGO composite is much lower than pure Ag, and with a longer conductive time under a stress condition of current density of 6.0  ×  104 A cm‑2. Thermal-electronic features demonstrate that the dispersed graphene interface can efficiently suppress the primary failure pathways (high temperature) in Ag matrix and make it uniquely efficient for the advancement of microscale and thermal-management electronics.

Thermal conductivity of graphene with defects induced by electron beam irradiation

Science.gov (United States)

Malekpour, Hoda; Ramnani, Pankaj; Srinivasan, Srilok; Balasubramanian, Ganesh; Nika, Denis L.; Mulchandani, Ashok; Lake, Roger K.; Balandin, Alexander A.

2016-07-01

We investigate the thermal conductivity of suspended graphene as a function of the density of defects, ND, introduced in a controllable way. High-quality graphene layers are synthesized using chemical vapor deposition, transferred onto a transmission electron microscopy grid, and suspended over ~7.5 μm size square holes. Defects are induced by irradiation of graphene with the low-energy electron beam (20 keV) and quantified by the Raman D-to-G peak intensity ratio. As the defect density changes from 2.0 × 1010 cm-2 to 1.8 × 1011 cm-2 the thermal conductivity decreases from ~(1.8 +/- 0.2) × 103 W mK-1 to ~(4.0 +/- 0.2) × 102 W mK-1 near room temperature. At higher defect densities, the thermal conductivity reveals an intriguing saturation-type behavior at a relatively high value of ~400 W mK-1. The thermal conductivity dependence on the defect density is analyzed using the Boltzmann transport equation and molecular dynamics simulations. The results are important for understanding phonon - point defect scattering in two-dimensional systems and for practical applications of graphene in thermal management.We investigate the thermal conductivity of suspended graphene as a function of the density of defects, ND, introduced in a controllable way. High-quality graphene layers are synthesized using chemical vapor deposition, transferred onto a transmission electron microscopy grid, and suspended over ~7.5 μm size square holes. Defects are induced by irradiation of graphene with the low-energy electron beam (20 keV) and quantified by the Raman D-to-G peak intensity ratio. As the defect density changes from 2.0 × 1010 cm-2 to 1.8 × 1011 cm-2 the thermal conductivity decreases from ~(1.8 +/- 0.2) × 103 W mK-1 to ~(4.0 +/- 0.2) × 102 W mK-1 near room temperature. At higher defect densities, the thermal conductivity reveals an intriguing saturation-type behavior at a relatively high value of ~400 W mK-1. The thermal conductivity dependence on the defect density is

Thermal stresses in rectangular plates: variational and finite element solutions

International Nuclear Information System (INIS)

Laura, P.A.A.; Gutierrez, R.H.; Sanchez Sarmiento, G.; Basombrio, F.G.

1978-01-01

This paper deals with the development of an approximate method for the analysis of thermal stresses in rectangular plates (plane stress problem) and an evaluation of the relative accuracy of the finite element method. The stress function is expanded in terms of polynomial coordinate functions which identically satisfy the boundary conditions, and a variational approach is used to determine the expansion coefficients. The results are in good agreement with a finite element approach. (Auth.)

Thermal conductivity of electron-doped CaMnO3 perovskites: Local lattice distortions and optical phonon thermal excitation

International Nuclear Information System (INIS)

Wang Yang; Sui Yu; Wang Xianjie; Su Wenhui; Liu Xiaoyang; Fan, Hong Jin

2010-01-01

The thermal transport properties of a series of electron-doped CaMnO 3 perovskites have been investigated. Throughout the temperature range 5-300 K, phonon thermal conductivity is dominant, and both electron and spin wave contributions are negligible. The short phonon mean free paths in this system result in the relatively low thermal conductivities. The strong phonon scatterings stem from the A-site mismatch and bond-length fluctuations induced by local distortions of MnO 6 octahedra. The thermal conductivity in the magnetically ordered state is enhanced as a result of the decrease in spin-phonon scattering. The results also indicate that above the magnetic ordering temperature, observable thermal excitation of optical phonons occurs. The contribution of optical phonons to thermal conductivity becomes non-negligible and is proposed to play an important role in the glass-like thermal transport behavior (i.e. positive temperature dependence of the thermal conductivity) in the paramagnetic state. These features can be understood in terms of an expression of thermal conductivity that includes both acoustic and optical phonon terms.

A thermal analysis for the use of cooled rotating drums in electron processing

International Nuclear Information System (INIS)

Fletcher, P.M.; Williams, K.E.

1988-01-01

The thermal response of rotating drums under an electron beam has been analyzed using a finite difference thermal analysis computer code. Rotating drums are used to convey thin webs or films under the electron beams while controlling their temperature and, in some cases, in dissipating the exotherm involved in curing coatings applied to them. Each portion of the drum surface receives one heat pulse per rotation as it passes under the beam. The drum's thermal behavior shows both an immediate response to each heat pulse and a more gradual response to the average heat acquired over many pulses. After many rotations a steady state is reached where there is only an immediate response to each heat pulse but the gradual heating has tapered off. Nevertheless the steady state temperatures are strongly dependent on the gradual heating that led to them. Slow and fast speeds of rotation are compared showing the effects of both gradual and immediate heating components. The thermal analysis is extended to include the coolant fluid inside the drum shell and the web on the drum surface. The coolant's incoming temperature, volumetric flow rate, flow speed through the coolant channels and film coefficient between the outer shell and fluid are all included in the analysis. The small air gap between the web and drum, the convective cooling of the web to the ambient air, and the exothermic reaction of any chemical reactions on the web are included. The stresses produced in the drum shell (i.e. between the outer surface and the temperature-controlling fluid within the drum) are analyzed in order to define safe e-beam powers and rotating speeds. The analysis provides the basis for many design decisions and can give an end-user a full temperature history for his product for any set of conditions. (author)

Electron bulk acceleration and thermalization at Earth's quasi-perpendicular bow shock

Science.gov (United States)

Chen, L.-J.; Wang, S.; Wilson, L. B., III; Schwartz, S. J.; Bessho, N.; Moore, T. E.; Gershman, D. J.; Giles, B. L.; Malaspina, D. M.; Wilder, F. D.; Ergun, R. E.; Hesse, M.; Lai, H.; Russell, C. T.; Strangeway, R. J.; Torbert, R. B.; Vinas, A. F.-; Burch, J. L.; Lee, S.; Pollock, C.; Dorelli, J.; Paterson, W. R.; Ahmadi, N.; Goodrich, K. A.; Lavraud, B.; Le Contel, O.; Khotyaintsev, Yu. V.; Lindqvist, P.-A.; Boardsen, S.; Wei, H.; Le, A.; Avanov, L. A.

2018-05-01

Electron heating at Earth's quasiperpendicular bow shock has been surmised to be due to the combined effects of a quasistatic electric potential and scattering through wave-particle interaction. Here we report the observation of electron distribution functions indicating a new electron heating process occurring at the leading edge of the shock front. Incident solar wind electrons are accelerated parallel to the magnetic field toward downstream, reaching an electron-ion relative drift speed exceeding the electron thermal speed. The bulk acceleration is associated with an electric field pulse embedded in a whistler-mode wave. The high electron-ion relative drift is relaxed primarily through a nonlinear current-driven instability. The relaxed distributions contain a beam traveling toward the shock as a remnant of the accelerated electrons. Similar distribution functions prevail throughout the shock transition layer, suggesting that the observed acceleration and thermalization is essential to the cross-shock electron heating.

Thermal diffuse scattering in transmission electron microscopy

Energy Technology Data Exchange (ETDEWEB)

Forbes, B.D.; D' Alfonso, A.J. [School of Physics, University of Melbourne, Parkville, Victoria 3010 (Australia); Findlay, S.D. [School of Physics, Monash University, Victoria 3800 (Australia); Van Dyck, D. [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); LeBeau, J.M. [North Carolina State University, Raleigh, NC 27695-7907 (United States); Stemmer, S. [Materials Department, University of California, Santa Barbara, CA 93106-5050 (United States); Allen, L.J., E-mail: lja@unimelb.edu.au [School of Physics, University of Melbourne, Parkville, Victoria 3010 (Australia)

2011-12-15

In conventional transmission electron microscopy, thermal scattering significantly affects the image contrast. It has been suggested that not accounting for this correctly is the main cause of the Stobbs factor, the ubiquitous, large contrast mismatch found between theory and experiment. In the case where a hard aperture is applied, we show that previous conclusions drawn from work using bright field scanning transmission electron microscopy and invoking the principle of reciprocity are reliable in the presence of thermal scattering. In the aperture-free case it has been suggested that even the most sophisticated mathematical models for thermal diffuse scattering lack in their numerical implementation, specifically that there may be issues in sampling, including that of the contrast transfer function of the objective lens. We show that these concerns can be satisfactorily overcome with modest computing resources; thermal scattering can be modelled accurately enough for the purpose of making quantitative comparison between simulation and experiment. Spatial incoherence of the source is also investigated. Neglect or inadequate handling of thermal scattering in simulation can have an appreciable effect on the predicted contrast and can be a significant contribution to the Stobbs factor problem. -- Highlights: Black-Right-Pointing-Pointer We determine the numerical requirements for accurate simulation of TDS in CTEM. Black-Right-Pointing-Pointer TDS can be simulated to high precision using the Born-Oppenheimer model. Black-Right-Pointing-Pointer Such calculations establish the contribution of TDS to the Stobbs factor problem. Black-Right-Pointing-Pointer Treating spatial incoherence using envelope functions increases image contrast. Black-Right-Pointing-Pointer Rigorous treatment of spatial incoherence significantly reduces image contrast.

Thermal conductivity of electron-irradiated graphene

Science.gov (United States)

Weerasinghe, Asanka; Ramasubramaniam, Ashwin; Maroudas, Dimitrios

2017-10-01

We report results of a systematic analysis of thermal transport in electron-irradiated, including irradiation-induced amorphous, graphene sheets based on nonequilibrium molecular-dynamics simulations. We focus on the dependence of the thermal conductivity, k, of the irradiated graphene sheets on the inserted irradiation defect density, c, as well as the extent of defect passivation with hydrogen atoms. While the thermal conductivity of irradiated graphene decreases precipitously from that of pristine graphene, k0, upon introducing a low vacancy concentration, c reduction of the thermal conductivity with the increasing vacancy concentration exhibits a weaker dependence on c until the amorphization threshold. Beyond the onset of amorphization, the dependence of thermal conductivity on the vacancy concentration becomes significantly weaker, and k practically reaches a plateau value. Throughout the range of c and at all hydrogenation levels examined, the correlation k = k0(1 + αc)-1 gives an excellent description of the simulation results. The value of the coefficient α captures the overall strength of the numerous phonon scattering centers in the irradiated graphene sheets, which include monovacancies, vacancy clusters, carbon ring reconstructions, disorder, and a rough nonplanar sheet morphology. Hydrogen passivation increases the value of α, but the effect becomes very minor beyond the amorphization threshold.

Differential gene expression during thermal stress and bleaching in the Caribbean coral Montastraea faveolata.

Science.gov (United States)

DeSalvo, M K; Voolstra, C R; Sunagawa, S; Schwarz, J A; Stillman, J H; Coffroth, M A; Szmant, A M; Medina, M

2008-09-01

The declining health of coral reefs worldwide is likely to intensify in response to continued anthropogenic disturbance from coastal development, pollution, and climate change. In response to these stresses, reef-building corals may exhibit bleaching, which marks the breakdown in symbiosis between coral and zooxanthellae. Mass coral bleaching due to elevated water temperature can devastate coral reefs on a large geographical scale. In order to understand the molecular and cellular basis of bleaching in corals, we have measured gene expression changes associated with thermal stress and bleaching using a complementary DNA microarray containing 1310 genes of the Caribbean coral Montastraea faveolata. In a first experiment, we identified differentially expressed genes by comparing experimentally bleached M. faveolata fragments to control non-heat-stressed fragments. In a second experiment, we identified differentially expressed genes during a time course experiment with four time points across 9 days. Results suggest that thermal stress and bleaching in M. faveolata affect the following processes: oxidative stress, Ca(2+) homeostasis, cytoskeletal organization, cell death, calcification, metabolism, protein synthesis, heat shock protein activity, and transposon activity. These results represent the first medium-scale transcriptomic study focused on revealing the cellular foundation of thermal stress-induced coral bleaching. We postulate that oxidative stress in thermal-stressed corals causes a disruption of Ca(2+) homeostasis, which in turn leads to cytoskeletal and cell adhesion changes, decreased calcification, and the initiation of cell death via apoptosis and necrosis.

Three dimensional, thermal stress analysis of a welded plate

International Nuclear Information System (INIS)

Koening, H.A.; Lai, C.K.-F.; Morral, J.E.

1985-01-01

A general finite element thermal stress analysis has been developed. The analysis can be uncoupled to solve either the heat transfer problem or the stress problem independently and it can accommodate non-linear material behavior, initial states of stress and strain, and moving boundary conditions. A unique feature of the model it that it properly accounts for the latent heat effect during phase changes. Applying the moving heat flux boundary condition to simulate arc welding, the model has been used to predict the transient thermal mechanical response of a welded plate. It is the absorption and liberation of latent heat in the fusion zone of a weld which complicates numerical methods of treating welding. For pure materials and eutectic alloys the latent heat effect is less of a problem because phase changes take place at a specific temperature. But for most alloys, phase changes take place over a range of temperatures bounded by the solidus, T S , and liquidus, T L , and the latent heat effect occurs continuously over the temperature range. (author)

On thermalization of electron-positron-photon plasma

Energy Technology Data Exchange (ETDEWEB)

Siutsou, I. A., E-mail: siutsou@icranet.org [CAPES–ICRANet program, ICRANet–Rio, CBPF 22290-180, Rua Dr. Xavier Sigaud, 150, Urca, Rio de Janeiro, RJ (Brazil); Aksenov, A. G. [Institute for Computer-Aided Design, Russian Academy of Sciences 123056, 2nd Brestskaya st., 19/18, Moscow (Russian Federation); Vereshchagin, G. V. [ICRANet 65122, p.le della Republica, 10, Pescara (Italy)

2015-12-17

Recently a progress has been made in understanding thermalization mechanism of relativistic plasma starting from a non-equilibrium state. Relativistic Boltzmann equations were solved numerically for homogeneous isotropic plasma with collision integrals for two- and three-particle interactions calculated from the first principles by means of QED matrix elements. All particles were assumed to fulfill Boltzmann statistics. In this work we follow plasma thermalization by accounting for Bose enhancement and Pauli blocking in particle interactions. Our results show that particle in equilibrium reach Bose-Einstein distribution for photons, and Fermi-Dirac one for electrons, respectively.

On thermalization of electron-positron-photon plasma

Science.gov (United States)

Siutsou, I. A.; Aksenov, A. G.; Vereshchagin, G. V.

2015-12-01

Recently a progress has been made in understanding thermalization mechanism of relativistic plasma starting from a non-equilibrium state. Relativistic Boltzmann equations were solved numerically for homogeneous isotropic plasma with collision integrals for two- and three-particle interactions calculated from the first principles by means of QED matrix elements. All particles were assumed to fulfill Boltzmann statistics. In this work we follow plasma thermalization by accounting for Bose enhancement and Pauli blocking in particle interactions. Our results show that particle in equilibrium reach Bose-Einstein distribution for photons, and Fermi-Dirac one for electrons, respectively.

Oblique propagation of electron thermal modes below the electron plasma frequency without boundary effects

International Nuclear Information System (INIS)

Ohnuma, T.; Watanabe, T.; Sanuki, H.

1981-08-01

Propagation characteristics and refractive effects of an oblique electron thermal mode without boundary effects below the electron plasma frequency are studied experimentally and theoretically in an inhomogeneous magnetized plasma. The behavior of this mode observed experimentally was confirmed by the theoretical analysis based on a new type of ray theory. (author)

Energy loss and thermalization of low-energy electrons

International Nuclear Information System (INIS)

LaVerne, J.A.; Mozumder, A.; Notre Dame Univ., IN

1984-01-01

Various processes involved in the moderation of low-energy electrons (< 10 keV in energy) have been delineated in gaseous and liquid media. The discussion proceeds in two stages. The first stage ends and the second stage begins when the electron energy equals the first excitation potential of the medium. The second stage ends with thermalization. Cross sections for electronic excitation and for the excitation (and de-excitation) of sub-electronic processes have been evaluated and incorporated in suitable stopping power and transport theories. Comparison between experiment and theory and intercomparisons between theories and experiments have been provided where possible. (author)

Non-thermal particle acceleration in collisionless relativistic electron-proton reconnection

Science.gov (United States)

Werner, G. R.; Uzdensky, D. A.; Begelman, M. C.; Cerutti, B.; Nalewajko, K.

2018-02-01

Magnetic reconnection in relativistic collisionless plasmas can accelerate particles and power high-energy emission in various astrophysical systems. Whereas most previous studies focused on relativistic reconnection in pair plasmas, less attention has been paid to electron-ion plasma reconnection, expected in black hole accretion flows and relativistic jets. We report a comprehensive particle-in-cell numerical investigation of reconnection in an electron-ion plasma, spanning a wide range of ambient ion magnetizations σi, from the semirelativistic regime (ultrarelativistic electrons but non-relativistic ions, 10-3 ≪ σi ≪ 1) to the fully relativistic regime (both species are ultrarelativistic, σi ≫ 1). We investigate how the reconnection rate, electron and ion plasma flows, electric and magnetic field structures, electron/ion energy partitioning, and non-thermal particle acceleration depend on σi. Our key findings are: (1) the reconnection rate is about 0.1 of the Alfvénic rate across all regimes; (2) electrons can form concentrated moderately relativistic outflows even in the semirelativistic, small-σi regime; (3) while the released magnetic energy is partitioned equally between electrons and ions in the ultrarelativistic limit, the electron energy fraction declines gradually with decreased σi and asymptotes to about 0.25 in the semirelativistic regime; and (4) reconnection leads to efficient non-thermal electron acceleration with a σi-dependent power-law index, p(σ _i)˜eq const+0.7σ _i^{-1/2}. These findings are important for understanding black hole systems and lend support to semirelativistic reconnection models for powering non-thermal emission in blazar jets, offering a natural explanation for the spectral indices observed in these systems.

Thermal stress in the edge cladding of Nova glass laser disks

International Nuclear Information System (INIS)

Pitts, J.H.; Kong, M.K.; Gerhard, M.A.

1987-01-01

We calculated thermal stresses in Nova glass laser disks having light-absorbing edge cladding glass attached to the periphery with an epoxy adhesive. Our closed-form solutions indicated that, because the epoxy adhesive is only 25 μm across, it does not significantly affect the thermal stress in the disk or cladding glass. Our numerical results showed a peak tensile stress in the cladding glass of 24 MPa when the cladding glass had a uniform absorption coefficient of 7.5 cm -1 . This peak value is reduced to 19 MPa if surface parasitic oscillation heating is eliminated by tilting the disk edges. The peak tensile stresses exceed the typical 7 to 14-MPa working stress for glass; however, we have not observed any disk or cladding glass failures at peak Nova fluences of 20 J/cm 2 . We have observed delamination of the epoxy adhesive bond at fluences several times that which would occur on Nova. Replacement laser disks will incorporate cladding with a reduced absorption coefficient of 4.5 cm -1 . Recent experiments show that this reduced absorption coefficient is satisfactory

Residual stress determination in thermally sprayed metallic deposits by neutron diffraction

Energy Technology Data Exchange (ETDEWEB)

Keller, Thomas; Margadant, Nikolaus; Pirling, Thilo; Riegert-Escribano, Maria J.; Wagner, Werner

2004-05-25

Neutron diffraction was used to obtain spatially resolved strain and stress profiles in thermally sprayed metallic 'NiCrAlY' deposits (chemical composition 67 wt.% Ni, 22 wt.% Cr, 10 wt.% Al, 1 wt.% Y) and the underlying steel substrates. Samples of four different spray techniques were analyzed: atmospheric and water stabilized plasma spraying (APS and WSP), flame spraying (FS) and wire arc spraying (WAS). The results are quantitatively compared with the average in-plane residual stress determined by complementary bending tests and the hole drilling technique. While the stress profiles from the surface to the interface in the deposits are similar for all investigated spray techniques, their absolute values and gradients vary strongly. This is attributed to different quenching stresses from the impinging particles, different thermal histories the deposit/substrate systems undergo during the spraying and subsequent cooling, and also to different coating properties. In the water stabilized plasma sprayed and the wire arc sprayed deposits, a gradient in the stress-free lattice parameter was observed. Crack formation is found to be a dominant mechanism for stress relaxation in the surface plane.

Finite element analysis of thermal stress distribution in different ...

African Journals Online (AJOL)

Nigerian Journal of Clinical Practice • Jan-Feb 2016 • Vol 19 • Issue 1. Abstract ... Key words: Amalgam, finite element method, glass ionomer cement, resin composite, thermal stress ... applications for force analysis and assessment of different.

Regulation of apoptotic pathways by Stylophora pistillata (Anthozoa, Pocilloporidae to survive thermal stress and bleaching.

Directory of Open Access Journals (Sweden)

Hagit Kvitt

Full Text Available Elevated seawater temperatures are associated with coral bleaching events and related mortality. Nevertheless, some coral species are able to survive bleaching and recover. The apoptotic responses associated to this ability were studied over 3 years in the coral Stylophora pistillata from the Gulf of Eilat subjected to long term thermal stress. These include caspase activity and the expression profiles of the S. pistillata caspase and Bcl-2 genes (StyCasp and StyBcl-2-like cloned in this study. In corals exposed to thermal stress (32 or 34°C, caspase activity and the expression levels of the StyBcl-2-like gene increased over time (6-48 h and declined to basal levels within 72 h of thermal stress. Distinct transcript levels were obtained for the StyCasp gene, with stimulated expression from 6 to 48 h of 34°C thermal stress, coinciding with the onset of bleaching. Increased cell death was detected in situ only between 6 to 48 h of stress and was limited to the gastroderm. The bleached corals survived up to one month at 32°C, and recovered back symbionts when placed at 24°C. These results point to a two-stage response in corals that withstand thermal stress: (i the onset of apoptosis, accompanied by rapid activation of anti-oxidant/anti-apoptotic mediators that block the progression of apoptosis to other cells and (ii acclimatization of the coral to the chronic thermal stress alongside the completion of symbiosis breakdown. Accordingly, the coral's ability to rapidly curb apoptosis appears to be the most important trait affecting the coral's thermotolerance and survival.

Thermal stress resistance of ion implanted sapphire crystals

International Nuclear Information System (INIS)

Gurarie, V.N.; Jamieson, D.N.; Szymanski, R.; Orlov, A.V.; Williams, J.S.; Conway, M.

1999-01-01

Monocrystals of sapphire have been subjected to ion implantation with 86 keV Si - and 80 keV Cr - ions to doses in the range of 5x10 14 -5x10 16 cm -2 prior to thermal stress testing in a pulsed plasma. Above a certain critical dose ion implantation is shown to modify the near-surface structure of samples by introducing damage, which makes crack nucleation easier under the applied stress. The effect of ion dose on the stress resistance is investigated and the critical doses which produce a noticeable change in the stress resistance are determined. The critical dose for Si ions is shown to be much lower than that for Cr - ions. However, for doses exceeding 2x10 16 cm -2 the stress resistance parameter decreases to approximately the same value for both implants. The size of the implantation-induced crack nucleating centers and the density of the implantation-induced defects are considered to be the major factors determining the stress resistance of sapphire crystals irradiated with Si - and Cr - ions

Energetic electron propagation in the decay phase of non-thermal flare emission

Energy Technology Data Exchange (ETDEWEB)

Huang, Jing; Yan, Yihua [Key Laboratory of Solar Activities, National Astronomical Observatories, Chinese Academy of Sciences, Beijing 100012 (China); Tsap, Yuri T., E-mail: huangj@nao.cas.cn [Crimean Astrophysical Observatory of Kyiv National Taras Shevchenko University, 98409 Crimea, Nauchny (Ukraine)

2014-06-01

On the basis of the trap-plus-precipitation model, the peculiarities of non-thermal emission in the decay phase of solar flares have been considered. The calculation formulas for the escape rate of trapped electrons into the loss cone in terms of time profiles of hard X-ray (HXR) and microwave (MW) emission have been obtained. It has been found that the evolution of the spectral indices of non-thermal emission depend on the regimes of the pitch angle diffusion of trapped particles into the loss cone. The properties of non-thermal electrons related to the HXR and MW emission of the solar flare on 2004 November 3 are studied with Nobeyama Radioheliograph, Nobeyama Radio Polarimeters, RHESSI, and Geostationary Operational Environmental Satellite observations. The spectral indices of non-thermal electrons related to MW and HXR emission remained constant or decreased, while the MW escape rate as distinguished from that of the HXRs increased. This may be associated with different diffusion regimes of trapped electrons into the loss cone. New arguments in favor of an important role of the superstrong diffusion for high-energy electrons in flare coronal loops have been obtained.

Two-dimensional simulation of the thermal stress effect on static and dynamic VDMOS characteristics

International Nuclear Information System (INIS)

Alwan, M.; Beydoun, B.; Ketata, K.; Zoaeter, M.

2005-01-01

Using a two-dimensional simulator, the effect of the thermal stress on static and dynamic vertical double-diffusion metal oxide semiconductor (VDMOS) characteristics have been investigated. The use of the device under certain thermal stress conditions can produce modifications of its physical and electrical properties. Based on physics and 2D simulations, this paper proposes an analysis of this stress effect observed on the electrical characteristics of the device. Parameters responsible of these modifications are determined. Approximate expressions of the ionization coefficients and breakdown voltage in terms of temperature are proposed. Non-punch-through junction theory is used to express the breakdown voltage and the space charge extension with respect to the impurity concentration and the temperature. The capacitances of the device have been also studied. The effect of the stress on C-V characteristics is observed and analyzed. We notice that the drain-gate, drain-source and gate-source capacitances are shifted due to the degradation of device physical properties versus thermal stress

Transcriptome analysis and identification of significantly differentially expressed genes in Holstein calves subjected to severe thermal stress

Science.gov (United States)

Srikanth, Krishnamoorthy; Lee, Eunjin; Kwan, Anam; Lim, Youngjo; Lee, Junyep; Jang, Gulwon; Chung, Hoyoung

2017-11-01

RNA-Seq analysis was used to characterize transcriptome response of Holstein calves to thermal stress. A total of eight animals aged between 2 and 3 months were randomly selected and subjected to thermal stress corresponding to a temperature humidity index of 95 in an environmentally controlled house for 12 h consecutively for 3 days. A set of 15,787 unigenes were found to be expressed and after a threshold of threefold change, and a Q value physiological and metabolic processes to survive. Many of the genes identified in this study have not been previously reported to be involved in thermal stress response. The results of this study extend our understanding of the animal's response to thermal stress and some of the identified genes may prove useful in the efforts to breed Holstein cattle with superior thermotolerance, which might help in minimizing production loss due to thermal stress.

Local thermal conductivity of polycrystalline AlN ceramics measured by scanning thermal microscopy and complementary scanning electron microscopy techniques

International Nuclear Information System (INIS)

Zhang Yue-Fei; Wang Li; Wei Bin; Ji Yuan; Han Xiao-Dong; Zhang Ze; Heiderhoff, R.; Geinzer, A. K.; Balk, L. J.

2012-01-01

The local thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics is measured and imaged by using a scanning thermal microscope (SThM) and complementary scanning electron microscope (SEM) based techniques at room temperature. The quantitative thermal conductivity for the AlN sample is gained by using a SThM with a spatial resolution of sub-micrometer scale through using the 3ω method. A thermal conductivity of 308 W/m·K within grains corresponding to that of high-purity single crystal AlN is obtained. The slight differences in thermal conduction between the adjacent grains are found to result from crystallographic misorientations, as demonstrated in the electron backscattered diffraction. A much lower thermal conductivity at the grain boundary is due to impurities and defects enriched in these sites, as indicated by energy dispersive X-ray spectroscopy. (condensed matter: structural, mechanical, and thermal properties)

Stress analysis of thermal sprayed coatings using a semi-destructive hole-drilling strain gauge method

International Nuclear Information System (INIS)

Dolhof, V.; Musil, J.; Cepera, M.; Zeman, J.

1995-01-01

Residual stress is an important parameter in coating technology since it often relates to the maximum coating thickness which can be deposited without spallation, and this applies to coatings produced by different thermal spray and thin film technologies. Indeed, the mechanisms by which residual stress is built up or locked into a coating depends markedly on the deposition process and coating structure (growth structure, phase composition) in the same way too. Methods for determining residual stresses in materials include both destructive and non-destructive methods. This contribution describes semi-destructive hole-drilling strain gauge method modified for measurement of residual stresses in thermal sprayed coatings. This method of stress analysis was used for determination of stress levels in thermal sprayed WC-17% Co coatings onto 13% Cr steel substrates. Results show that deposition conditions and final coating structure influence directly the residual stress level in the coatings. It is proved that semi-destructive hole-tube drilling measurement is effective reproducible method of coating stress analysis and good solution for optimization of deposition process

Stochastic thermal stress analysis of clad cylindrical fuel elements

International Nuclear Information System (INIS)

Barrett, P.R.

1975-01-01

After a review of deterministic elastic thermal stress analysis by means of the displacement method for a cylindrical system in which the temperature distribution is not only radially variable but azimuthally and axially variable also, a method is shown for the determination of the statistical moments of the stress components when (a) the outer boundary of the cladding is a stochastic quantity, and (b) the uncertainties in the elastic and thermal constants of the materials and in the magnitude of the heat generation term are taken into account. A typical model is proposed for describing the statistics of the outer radius of the cladding which is a stochastic variable owing to uncertainties produced by the extrusion process. The theory is illustrated by means of a simple example by examining a meaningful reliability index and the relative importance of each of the uncertainties. (Auth.)

Thermal stresses in the space shuttle orbiter: Analysis versus test

International Nuclear Information System (INIS)

Grooms, H.R.; Gibson, W.F. Jr.; Benson, P.L.

1984-01-01

Significant temperature differences occur between the internal structure and the outer skin of the Space Shuttle Orbiter as it returns from space. These temperature differences cause important thermal stresses. A finite element model containing thousands of degrees of freedom is used to predict these stresses. A ground test was performed to verify the prediction method. The analysis and test results compare favorably. (orig.)

Early life thermal stress: Impact on future thermotolerance, stress response, behavior, and intestinal morphology in piglets exposed to a heat stress challenge during simulated transport

Science.gov (United States)

Study objectives were to evaluate the impact of early life thermal stress (ELTS) on thermoregulation, stress, and intestinal health of piglets subjected to a future heat stress (HS) challenge during simulated transport. Approximately 7 d after farrowing, 12 first parity gilts and their litters were ...

Geochemical characterisation of kerogen from the Boom Clay Formation (Mol, Belgium) and evolution under different thermal stress

International Nuclear Information System (INIS)

Deniau, I.

2002-12-01

The Boom clay formation in Belgium has been chosen as test site for the disposal of high level radioactive wastes. The organic matter present in the clay (kerogen) is sensible to the thermal stress and can generate a huge number of gaseous and liquid compounds leading to local pH changes and to fracturing processes. In particular, some polar compounds can complex radionuclides. The samples analyzed in this work were taken in the underground laboratory of Mol at a 223 m depth. They have been analyzed in detail using geochemical methods (Rock-Eval pyrolysis, element analysis, transmission and scanning electron microscopy), spectroscopic methods (Fourier transformation infrared spectroscopy, solid state 13 C NMR, Raman) and pyrolytic methods (off-line, on-line and in sealed tubes combined with coupled CG/SM analyses). The study of a representative sample of this formation has permitted to characterize the organic matter at the molecular scale, to determine its fossilization mechanisms and the nature of the organic compounds trapped inside the kerogen. The organic matter of the Boom clays comes mainly from phyto-planktonic matter with an important contribution of terrestrial and bacterial matter. The degradation-recondensation played an important role in its preservation but the presence of numerous oxygenated molecules implies that oxidative incorporation also participated to this preservation. Finally, various products (hydrocarbons, oxygenated and nitrogenous polar compounds) trapped in significant amount inside the macro-molecular structure are released under a relatively weak thermal stress. Moreover several small polar organic molecules are released and can play a significant role in the retention or migration of radionuclides inside the geologic barrier. A sample submitted to a in-situ thermal stress of 80 deg. C during 5 years (Cerberus experiment) do not show any significant change in its kerogen structure with respect to the non-heated reference sample

Influence of overelastic loading on the stress intensity factor under thermal fatigue conditions

International Nuclear Information System (INIS)

Stamm, H.; Munz, D.

1983-10-01

Thermal shock loading often creates high thermal stresses which may exceed yield strength of the material in a surface layer. In this report the application of the linear elastic ΔK-concept in the case of cyclic thermal loading within the shakedown region is discussed. To this K-factors for an edge crack in a linear elastic - perfectly plastic plate are calculated using the weight function method and are compared with results obtained with the Finite Element Method. It is shown, that rearrangement stresses during plastic flow in the first cycle must be taken into account developing conservative approximation procedures. (orig.) [de

Study on Stress Development in the Phase Transition Layer of Thermal Barrier Coatings

Directory of Open Access Journals (Sweden)

Yijun Chai

2016-09-01

Full Text Available Stress development is one of the significant factors leading to the failure of thermal barrier coating (TBC systems. In this work, stress development in the two phase mixed zone named phase transition layer (PTL, which grows between the thermally grown oxide (TGO and the bond coat (BC, is investigated by using two different homogenization models. A constitutive equation of the PTL based on the Reuss model is proposed to study the stresses in the PTL. The stresses computed with the proposed constitutive equation are compared with those obtained with Voigt model-based equation in detail. The stresses based on the Voigt model are slightly higher than those based on the Reuss model. Finally, a further study is carried out to explore the influence of phase transition proportions on the stress difference caused by homogenization models. Results show that the stress difference becomes more evident with the increase of the PTL thickness ratio in the TGO.

Transient thermal stresses in an orthotropic rectangular plate with convective heat transfer at upper and lower surfaces

International Nuclear Information System (INIS)

Sugano, Yoshihiro; Nakanishi, Takanori; Ito, Masahiko; Saito, Koichi.

1982-01-01

Recently, anisotropic materials have been used widely for reactor core elements and fast flying objects, therefore, the problem of thermal stress in anisotropic bodies has been studied actively. In this study, the unsteady plane thermal stress in an orthotropic rectangular thin plate heated by the temperature of ambient medium was analyzed, taking the heat transfer on both surfaces into account. The influence that the anisotropy of material constants and the heat transfer on both surfaces exert on the temperature and thermal stress of the plate was examined. Moreover, in order to investigate into the effect of the aspect ratio of the plate on the temperature and thermal stress, the unsteady distributions of temperature and thermal stress in an orthotropic semi-infinite band, of which the end surfaces are heated by ambient medium, were analyzed. The numerical calculation was carried out, and the results are shown. Before, it was difficult to satisfy the boundary condition related to shearing stress, accordingly, the analysis has not been performed, but in this study, it was shown that the analysis is possible. (Kako, I.)

Residual stress of particulate polymer composites with reduced thermal expansion

International Nuclear Information System (INIS)

Nishino, T; Kotera, M; Sugiura, Y

2009-01-01

Thermal expansion behavior was investigated for tangusten zirconium phosphate (Zr 2 (WO 4 )(PO 4 ) 2 (ZWP)) particulate filled poly(ether ether ketone) (PEEK) composite. ZWP is known as ceramic filler with a negative thermal expansion. By incorporating ZWP with 40 volume %, the linear thermal expansion coefficient of the PEEK composite was reduced to almost same value (2.53 X 10 -5 K -1 ) with that of aluminum. This decrease was found to be quite effective for the decrease of the residual stress at the interface between aluminum plate and the composite.

Human Thermal Comfort and Heat Stress in an Outdoor Urban Arid Environment: A Case Study

Directory of Open Access Journals (Sweden)

A. M. Abdel-Ghany

2013-01-01

Full Text Available To protect humans from heat stress risks, thermal comfort and heat stress potential were evaluated under arid environment, which had never been made for such climate. The thermal indices THI, WBGT, PET, and UTCI were used to evaluate thermal comfort and heat stress. RayMan software model was used to estimate the PET, and the UTCI calculator was used for UTCI. Dry and wet bulb temperatures (Td, Tw, natural wet bulb temperature (Tnw, and globe temperature (Tg were measured in a summer day to be used in the calculation. The results showed the following. (i The thermal sensation and heat stress levels can be evaluated by either the PET or UTCI scales, and both are valid for extremely high temperature in the arid environment. (ii In the comfort zone, around 75% of individuals would be satisfied with the surrounding environment and feel comfortable during the whole day. (iii Persons are exposed to strong heat stress and would feel uncomfortable most of the daytime in summer. (iv Heat fatigue is expected with prolonged exposure to sun light and activity. (v During the daytime, humans should schedule their activities according to the highest permissible values of the WBGT to avoid thermal shock.

Reflection of oblique electron thermal modes in an inhomogeneous plasma

International Nuclear Information System (INIS)

Ohnuma, T.; Watanabe, T.; Sanuki, H.

1980-04-01

In an inhomogeneous magnetoplasma, reflection of an oblique electron thermal mode radiated from a local source is investigated experimentally and theoretically near the electron plasma frequency layer. The experimental observation of reflection in the lower plasma density region than the f sub(p)-layer is found to be in qualitative accord with the theoretical reflection, which is obtained from a kinetic theory in an inhomogeneous magnetoplasma. The reflection of the thermal mode is also compared with that of an electromagnetic mode at the f sub(p)-layer. (author)

Temperature field and thermal stress analysis of the HT-7U vacuum vessel

International Nuclear Information System (INIS)

Song Yuntao; Yao Damao; Wu Songtao; Weng Peide

2000-01-01

The HT-7U vacuum vessel is an all-metal-welded double-wall interconnected with toroidal and poloidal stiffening ribs. The channels formed between the ribs and walls are filled with boride water as a nuclear shielding. On the vessel surface facing the plasma are installed cable-based Ohmic heaters. Prior to plasma operation the vessel is to be baked out and discharge cleaned at about 250 degree C. During baking out the non-uniformity of temperature distribution on the vacuum vessel will bring about serious thermal stress that can damage the vessel. In order to determine and optimize the design of the HT-7U vacuum vessel, a three-dimensional finite element model was performed to analyse its temperature field and thermal stress. the maximal thermal stress appeared on the round of lower vertical port and maximal deformation located just on the region between the upper vertical port and the horizontal port. The results show that the reinforced structure has a good capability of withstanding the thermal loads

Perceived Thermal Discomfort and Stress Behaviours Affecting Students’ Learning in Lecture Theatres in the Humid Tropics

Directory of Open Access Journals (Sweden)

Tamaraukuro Tammy Amasuomo

2016-04-01

Full Text Available The study investigated the relationship between students’ perceived thermal discomfort and stress behaviours affecting their learning in lecture theatres in the humid tropics. Two lecture theatres, LTH-2 and 3, at the Niger Delta University, Nigeria, were used for the study. Two groups of students from the Faculties of Agriculture and Engineering and the Department of Technology Education constituted the population. The sample size selected through random sampling for Groups A and B was 210 and 370 students, respectively. Objective and self-report instruments were used for data collection. The objective instrument involved physical measurement of the two lecture theatres and of the indoor temperature, relative humidity and air movement. The self-report instrument was a questionnaire that asked for the students perceived indoor thermal discomfort levels and the effect of indoor thermal comfort level on perceived stress behaviours affecting their learning. The objective indoor environmental data indicated thermal discomfort with an average temperature of 29–32 °C and relative humidity of 78% exceeding the ASHARE [1] and Olgyay [2].The students’ experienced a considerable level of thermal discomfort and also perceived that stress behaviours due to thermal discomfort affected their learning. Further, there were no significant differences in the perceived thermal discomfort levels of the two groups of students in LTH-2 and 3. Furthermore, stress behaviours affecting learning as perceived by the two groups of students did not differ significantly. In addition, no correlation existed between the perceived indoor thermal discomfort levels and stress behaviour levels affecting learning for students in LTH-2, because the arousal level of the students in the thermal environment was likely higher than the arousal level for optimal performance [3,4]. However, a correlation existed in the case of students in LTH-3, which was expected because it only

Renal sympathetic nerve, blood flow, and epithelial transport responses to thermal stress.

Science.gov (United States)

Wilson, Thad E

2017-05-01

Thermal stress is a profound sympathetic stress in humans; kidney responses involve altered renal sympathetic nerve activity (RSNA), renal blood flow, and renal epithelial transport. During mild cold stress, RSNA spectral power but not total activity is altered, renal blood flow is maintained or decreased, and epithelial transport is altered consistent with a sympathetic stress coupled with central volume loaded state. Hypothermia decreases RSNA, renal blood flow, and epithelial transport. During mild heat stress, RSNA is increased, renal blood flow is decreased, and epithelial transport is increased consistent with a sympathetic stress coupled with a central volume unloaded state. Hyperthermia extends these directional changes, until heat illness results. Because kidney responses are very difficult to study in humans in vivo, this review describes and qualitatively evaluates an in vivo human skin model of sympathetically regulated epithelial tissue compared to that of the nephron. This model utilizes skin responses to thermal stress, involving 1) increased skin sympathetic nerve activity (SSNA), decreased skin blood flow, and suppressed eccrine epithelial transport during cold stress; and 2) increased SSNA, skin blood flow, and eccrine epithelial transport during heat stress. This model appears to mimic aspects of the renal responses. Investigations of skin responses, which parallel certain renal responses, may aid understanding of epithelial-sympathetic nervous system interactions during cold and heat stress. Copyright © 2016 Elsevier B.V. All rights reserved.

An investigation of characteristics of thermal stress caused by fluid temperature fluctuation at a T-junction pipe

International Nuclear Information System (INIS)

Miyoshi, Koji; Nakamura, Akira; Utanohara, Yoichi

2014-01-01

Thermal fatigue cracking may initiate at a T-junction pipe where high and low temperature fluids flow in from different directions and mix. Thermal stress is caused by a temperature gradient in a structure and by its variation. It is possible to obtain stress distributions if the temperature distributions at the pipe inner surface are obtained by experiments. The wall temperature distributions at a T-junction pipe were measured by experiments. The thermal stress distributions were calculated using the experimental data. The circumferential and axial stress fluctuations were larger than the radial stress fluctuation range. The stress fluctuation at the position of the maximum stress fluctuation had 10sec period. The distribution of the stress fluctuation was similar to that of the temperature fluctuation. The large stress fluctuations were caused by the time variation of the heating region by the hot jet flow. (author)

Average thermal stress in the Al+SiC composite due to its manufacturing process

International Nuclear Information System (INIS)

Miranda, Carlos A.J.; Libardi, Rosani M.P.; Marcelino, Sergio; Boari, Zoroastro M.

2013-01-01

The numerical analyses framework to obtain the average thermal stress in the Al+SiC Composite due to its manufacturing process is presented along with the obtained results. The mixing of Aluminum and SiC powders is done at elevated temperature and the usage is at room temperature. A thermal stress state arises in the composite due to the different thermal expansion coefficients of the materials. Due to the particles size and randomness in the SiC distribution, some sets of models were analyzed and a statistical procedure used to evaluate the average stress state in the composite. In each model the particles position, form and size are randomly generated considering a volumetric ratio (VR) between 20% and 25%, close to an actual composite. The obtained stress field is represented by a certain number of iso stress curves, each one weighted by the area it represents. Systematically it was investigated the influence of: (a) the material behavior: linear x non-linear; (b) the carbide particles form: circular x quadrilateral; (c) the number of iso stress curves considered in each analysis; and (e) the model size (the number of particles). Each of above analyzed condition produced conclusions to guide the next step. Considering a confidence level of 95%, the average thermal stress value in the studied composite (20% ≤ VR ≤ 25%) is 175 MPa with a standard deviation of 10 MPa. Depending on its usage, this value should be taken into account when evaluating the material strength. (author)

Possible interaction between thermal electrons and vibrationally excited N2 in the lower E-region

Directory of Open Access Journals (Sweden)

K.-I. Oyama

2011-03-01

Full Text Available As one of the tasks to find the energy source(s of thermal electrons, which elevate(s electron temperature higher than neutral temperature in the lower ionosphere E-region, energy distribution function of thermal electron was measured with a sounding rocket at the heights of 93–131 km by the applying second harmonic method. The energy distribution function showed a clear hump at the energy of ~0.4 eV. In order to find the reason of the hump, we conducted laboratory experiment. We studied difference of the energy distribution functions of electrons in thermal energy range, which were measured with and without EUV radiation to plasma of N2/Ar and N2/O2 gas mixture respectively. For N2/Ar gas mixture plasma, the hump is not clearly identified in the energy distribution of thermal electrons. On the other hand for N2/O2 gas mixture, which contains vibrationally excited N2, a clear hump is found when irradiated by EUV. The laboratory experiment seems to suggest that the hump is produced as a result of interaction between vibrationally excited N2 and thermal electrons, and this interaction is the most probable heating source for the electrons of thermal energy range in the lower E-region. It is also suggested that energy distribution of the electrons in high energy part may not be Maxwellian, and DC probe measures the electrons which are non Maxwellian, and therefore "electron temperature" is calculated higher.

Coupled thermal stress analysis of a hollow circular cylinder with transversely isotropic properties

International Nuclear Information System (INIS)

Tanigawa, Y.; Ootao, Y.

1987-01-01

If we shall analyze the thermal stress problems exactly in a transient state in continuum media, discussed with both the coupling and inertia effect, it has be shown that the thermomechanical coupling term shows a significant role than the inertia term for the common commercial alloys. In the present paper, we have considered the continuum medium with transversely isotropic material property, which has an isotropic property in r-θ plane, and analyzed the transient thermal stress problem of an infinitely long hollow circular cylinder due to an axisymmetrical partial heating. In order to get the thermal and thermoelastic fundamental differential equations separated in each field, we have introduced a perturbation technique. And then, we have carried out numerical calculations for several values of thermal and thermoelastic orthotropical parameters. (orig./GL)

Active Cooling and Thermal Management of a Downhole Tool Electronics Section

DEFF Research Database (Denmark)

Soprani, Stefano; Engelbrecht, Kurt; Just Nørgaard, Anders

2015-01-01

combines active and passive cooling techniques, aiming at an efficient thermal management, preserving the tool compactness and avoiding the use of moving parts. Thermoelectric coolers were used to transfer the dissipated heat from the temperature-sensitive electronics to the external environment. Thermal...... contact resistances were minimized and thermally insulating foam protected the refrigerated microenvironment from the hot surroundings....

Heat transfer and thermal stress analysis in grooved tubes

Indian Academy of Sciences (India)

Heat transfer and thermal stresses, induced by temperature differencesin the internally grooved tubes of heat transfer equipment, have been analysed numerically. The analysis has been conducted for four different kinds of internally grooved tubes and three different mean inlet water velocities. Constant temperature was ...

STRESSES IN CEMENT-CONCRETE PAVEMENT SURFACING CAUSED BY THERMAL SHOCK

Directory of Open Access Journals (Sweden)

M. K. Pshembaev

2016-01-01

Full Text Available It is necessary to mention specially so-called thermal shock among various impacts on highway surface. Ice layer is formed on a concrete surface during the winter period of pavement surfacing operation. Sodium chloride which lowers temperature of water-ice transition temperature and causes ice thawing at negative temperature is usually used to remove ice from the pavement surface. Consequently, temperature in the concrete laying immediately under a thawing ice layer is coming down with a run that leads to significant stresses. Such phenomenon is known as a thermal shock with a meaning of local significant change in temperature. This process is under investigation, it has practical importance for an estimation of strength and longevity of a cement-concrete pavement surfacing and consequently it is considered as rather topical issue. The purpose of investigations is to develop a mathematical model and determination of shock blow permissible gradients for a cementconcrete road covering. Finite difference method has been used in order to determine stressed and deformed condition of the cement-concrete pavement surfacing of highways. A computer program has been compiled and it permits to carry out calculation of a road covering at various laws of temperature distribution in its depth. Regularities in distribution of deformation and stresses in the cement-concrete pavement surfacing of highways at thermal shock have been obtained in the paper. A permissible parameter of temperature distribution in pavement surfacing thickness has been determined in the paper. A strength criterion based on the process of micro-crack formation and development in concrete has been used for making calculations. It has been established that the thermal shock causes significant temperature gradients on the cement-concrete surfacing that lead to rather large normal stresses in the concrete surface layer. The possibility of micro-crack formation in a road covering is

First principles calculations of structural, electronic and thermal ...

Indian Academy of Sciences (India)

Administrator

2013-07-28

Jul 28, 2013 ... The structural, electronic and thermal properties of lead chalcogenides PbS, PbSe and BeTe using .... results for all the systems are presented in table 1, along ... as interatomic bonding, equations of state and phonon spectra.

Mucus sugar content shapes the bacterial community structure in thermally stressed Acropora muricata

Directory of Open Access Journals (Sweden)

Sonny T.M. Lee

2016-03-01

Full Text Available It has been proposed that the chemical composition of a coral’s mucus can influence the associated bacterial community. However, information on this topic is rare, and non-existent for corals that are under thermal stress. This study therefore compared the carbohydrate composition of mucus in the coral Acropora muricata when subjected to increasing thermal stress from 26°C to 31°C, and determined whether this composition correlated with any changes in the bacterial community. Results showed that, at lower temperatures, the main components of mucus were N-acetyl glucosamine and C6 sugars, but these constituted a significantly lower proportion of the mucus in thermally-stressed corals. The change in the mucus composition coincided with a shift from a γ-Proteobacteria- to a Verrucomicrobiae- and α-Proteobacteria-dominated community in the coral mucus. Bacteria in the class Cyanobacteria also started to become prominent in the mucus when the coral was thermally stressed. The increase in the relative abundance of the Verrucomicrobiae at higher temperature was strongly associated with a change in the proportion of fucose, glucose and mannose in the mucus. Increase in the relative abundance of α-Proteobacteria were associated with GalNAc and glucose, while the drop in relative abundance of γ-Proteobacteria at high temperature coincided with changes in fucose and mannose. Cyanobacteria were highly associated with arabinose and xylose. Changes in mucus composition and the bacterial community in the mucus layer occurred at 29°C, which were prior to visual signs of coral bleaching at 31°C. A compositional change in the coral mucus, induced by thermal stress could therefore be a key factor leading to a shift in the associated bacterial community. This, in turn, has the potential to impact the physiological function of the coral holobiont.

Thermal residual stresses in amorphous thermoplastic polymers

Science.gov (United States)

Grassia, Luigi; D'Amore, Alberto

2010-06-01

An attempt to calculate the internal stresses in a cylindrically shaped polycarbonate (LEXAN-GE) component, subjected to an arbitrary cooling rate, will be described. The differential volume relaxation arising as a result of the different thermal history suffered by each body point was considered as the primary source of stresses build up [1-3]. A numerical routine was developed accounting for the simultaneous stress and structural relaxation processes and implemented within an Ansys® environment. The volume relaxation kinetics was modeled by coupling the KAHR (Kovacs, Aklonis, Hutchinson, Ramos) phenomenological theory [4] with the linear viscoelastic theory [5-7]. The numerical algorithm translates the specific volume theoretical predictions at each body point as applied non-mechanical loads acting on the component. The viscoelastic functions were obtained from two simple experimental data, namely the linear viscoelastic response in shear and the PVT (pressure volume temperature) behavior. The dimensionless bulk compliance was extracted from PVT data since it coincides with the memory function appearing in the KAHR phenomenological theory [7]. It is showed that the residual stress scales linearly with the logarithm of the Biot's number.

Physiological Responses to Thermal Stress and Exercise

Science.gov (United States)

Iyota, Hiroyuki; Ohya, Akira; Yamagata, Junko; Suzuki, Takashi; Miyagawa, Toshiaki; Kawabata, Takashi

The simple and noninvasive measuring methods of bioinstrumentation in humans is required for optimization of air conditioning and management of thermal environments, taking into consideration the individual specificity of the human body as well as the stress conditions affecting each. Changes in human blood circulation were induced with environmental factors such as heat, cold, exercise, mental stress, and so on. In this study, the physiological responses of human body to heat stress and exercise were investigated in the initial phase of the developmental research. We measured the body core and skin temperatures, skin blood flow, and pulse wave as the indices of the adaptation of the cardiovascular system. A laser Doppler skin blood flowmetry using an optical-sensor with a small portable data logger was employed for the measurement. These results reveal the heat-stress and exercise-induced circulatory responses, which are under the control of the sympathetic nerve system. Furthermore, it was suggested that the activity of the sympathetic nervous system could be evaluated from the signals of the pulse wave included in the signals derived from skin blood flow by means of heart rate variability assessments and detecting peak heights of velocity-plethysmogram.

Finite element simulation of stress evolution in thermal barrier coating systems

Energy Technology Data Exchange (ETDEWEB)

Bednarz, P.

2007-07-01

Gas turbine materials exposed to extreme high temperature require protective coatings. To design reliable components, a better understanding of the coating failure mechanisms is required. Damage in Thermal Barrier Coating Systems (TBCs) is related to oxidation of the Bond Coat, sintering of the ceramic, thermal mismatch of the material constituents, complex shape of the BC/TGO/TBC interface, redistribution of stresses via creep and plastic deformation and crack resistance. In this work, experimental data of thermo-mechanical properties of CMSX-4, MCrAlY (Bond Coat) and APS-TBC (partially stabilized zirconia), were implemented into an FE-model in order to simulate the stress development at the metal/ceramic interface. The FE model reproduced the specimen geometry used in corresponding experiments. It comprises a periodic unit cell representing a slice of the cylindrical specimen, whereas the periodic length of the unit cell equals an idealized wavelength of the rough metal/ceramic interface. Experimental loading conditions in form of thermal cycling with a dwelltime at high temperature and consideration of continuous oxidation were simulated. By a stepwise consideration of various material properties and processes, a reference model was achieved which most realistically simulated the materials behavior. The influences of systematic parameter variations on the stress development and critical sites with respect to possible crack paths were shown. Additionally, crack initiation and propagation at the peak of asperity at BC/TGO interface was calculated. It can be concluded that a realistic modeling of stress development in TBCs requires at least reliable data of i) BC and TGO plasticity, ii) BC and TBC creep, iii) continuous oxidation including in particular lateral oxidation, and iv) critical energy release rate for interfaces (BC/TGO, TGO/TBC) and for each layer. The main results from the performed parametric studies of material property variations suggest that

FEM thermal and stress analysis of bonded GaN-on-diamond substrate

Science.gov (United States)

Zhai, Wenbo; Zhang, Jingwen; Chen, Xudong; Bu, Renan; Wang, Hongxing; Hou, Xun

2017-09-01

A three-dimensional thermal and stress analysis of bonded GaN on diamond substrate is investigated using finite element method. The transition layer thickness, thermal conductivity of transition layer, diamond substrate thickness and the area ratio of diamond and GaN are considered and treated appropriately in the numerical simulation. The maximum channel temperature of GaN is set as a constant value and its corresponding heat power densities under different conditions are calculated to evaluate the influences that the diamond substrate and transition layer have on GaN. The results indicate the existence of transition layer will result in a decrease in the heat power density and the thickness and area of diamond substrate have certain impact on the magnitude of channel temperature and stress distribution. Channel temperature reduces with increasing diamond thickness but with a decreasing trend. The stress is reduced by increasing diamond thickness and the area ratio of diamond and GaN. The study of mechanical and thermal properties of bonded GaN on diamond substrate is useful for optimal designs of efficient heat spreader for GaN HEMT.

Finite element formulation for thermal stress analysis of thin reactor structures

International Nuclear Information System (INIS)

Kulak, R.F.; Kennedy, J.M.; Belytschko, T.B.

1978-01-01

This paper describes the formulation of a finite-element procedure for the thermal stress analysis of thin wall reactor components. A general temperature-dependent constituent relationship is derived from a Gibbs potential function and a temperature-dependent yield surface. This form of constitutive relationship is applicable to problems of small strain. A similar form of a hypoelastic-plastic type is also developed for large strains. The variation of the yield surface with temperature is based upon a temperature-dependent, work-hardening model. The model uses a temperature-equivalent stress-plastic strain diagram which is generated from isothermal unaxial stress-strain data. The above constitutive relationships are incorporated into two computer codes and a previously developed numerical algorithm is used with minor modifications. A set of problems is presented validating the thermal analysis capability of the computer codes to a variety of problem types. (Auth.)

Electron-phonon thermalization in a scalable method for real-time quantum dynamics

Science.gov (United States)

Rizzi, Valerio; Todorov, Tchavdar N.; Kohanoff, Jorge J.; Correa, Alfredo A.

2016-01-01

We present a quantum simulation method that follows the dynamics of out-of-equilibrium many-body systems of electrons and oscillators in real time. Its cost is linear in the number of oscillators and it can probe time scales from attoseconds to hundreds of picoseconds. Contrary to Ehrenfest dynamics, it can thermalize starting from a variety of initial conditions, including electronic population inversion. While an electronic temperature can be defined in terms of a nonequilibrium entropy, a Fermi-Dirac distribution in general emerges only after thermalization. These results can be used to construct a kinetic model of electron-phonon equilibration based on the explicit quantum dynamics.

Stress recovery and cyclic behaviour of an Fe-Mn-Si shape memory alloy after multiple thermal activation

Science.gov (United States)

Hosseini, E.; Ghafoori, E.; Leinenbach, C.; Motavalli, M.; Holdsworth, S. R.

2018-02-01

The stress recovery and cyclic deformation behaviour of Fe-17Mn-5Si-10Cr-4Ni-1(V,C) shape memory alloy (Fe-SMA) strips, which are often used for pre-stressed strengthening of structural members, were studied. The evolution of recovery stress under different constraint conditions was studied. The results showed that the magnitude of the tensile stress in the Fe-SMA member during thermal activation can have a signification effect on the final recovery stress. The higher the tensile load in the Fe-SMA (e.g., caused by dead load or thermal expansion of parent structure during heating phase), the lower the final recovery stress. Furthermore, this study investigated the cyclic behaviour of the activated SMA followed by a second thermal activation. Although the magnitude of the recovery stress decreased during the cyclic loading, the second thermal activation could retrieve a significant part of the relaxed recovery stress. This observation suggests that the relaxation of recovery stress during cyclic loading is due to a reversible phase transformation-induced deformation (i.e., forward austenite-to-martensite transformation) rather than an irreversible dislocation-induced plasticity. Retrieval of the relaxed recovery stress by the reactivation process has important practical implications as the prestressing loss in pre-stressed civil structures can be simply recovered by reheating of the Fe-SMA elements.

A high average power beam dump for an electron accelerator

Energy Technology Data Exchange (ETDEWEB)

Liu, Xianghong, E-mail: xl66@cornell.edu [Cornell Laboratory of Accelerator-based Sciences and Education, Cornell University, Ithaca, NY 14853 (United States); Bazarov, Ivan; Dunham, Bruce M.; Kostroun, Vaclav O.; Li, Yulin; Smolenski, Karl W. [Cornell Laboratory of Accelerator-based Sciences and Education, Cornell University, Ithaca, NY 14853 (United States)

2013-05-01

The electron beam dump for Cornell University's Energy Recovery Linac (ERL) prototype injector was designed and manufactured to absorb 600 kW of electron beam power at beam energies between 5 and 15 MeV. It is constructed from an aluminum alloy using a cylindrical/conical geometry, with water cooling channels between an inner vacuum chamber and an outer jacket. The electron beam is defocused and its centroid is rastered around the axis of the dump to dilute the power density. A flexible joint connects the inner body and the outer jacket to minimize thermal stress. A quadrant detector at the entrance to the dump monitors the electron beam position and rastering. Electron scattering calculations, thermal and thermomechanical stress analysis, and radiation calculations are presented.

Effect of power history on the shape and the thermal stress of a large sapphire crystal during the Kyropoulos process

Science.gov (United States)

Nguyen, Tran Phu; Chuang, Hsiao-Tsun; Chen, Jyh-Chen; Hu, Chieh

2018-02-01

In this study, the effect of the power history on the shape of a sapphire crystal and the thermal stress during the Kyropoulos process are numerically investigated. The simulation results show that the thermal stress is strongly dependent on the power history. The thermal stress distributions in the crystal for all growth stages produced with different power histories are also studied. The results show that high von Mises stress regions are found close to the seed of the crystal, the highly curved crystal surface and the crystal-melt interface. The maximum thermal stress, which occurs at the crystal-melt interface, increases significantly in value as the crystal expands at the crown. After this, there is reduction in the maximum thermal stress as the crystal lengthens. There is a remarkable enhancement in the maximum von Mises stress when the crystal-melt interface is close to the bottom of the crucible. There are two obvious peaks in the maximum Von Mises stress, at the end of the crown stage and in the final stage, when cracking defects can form. To alleviate this problem, different power histories are considered in order to optimize the process to produce the lowest thermal stress in the crystal. The optimal power history is found to produce a significant reduction in the thermal stress in the crown stage.

Numerical methods for calculating thermal residual stresses and hydrogen diffusion

International Nuclear Information System (INIS)

Leblond, J.B.; Devaux, J.; Dubois, D.

1983-01-01

Thermal residual stresses and hydrogen concentrations are two major factors intervening in cracking phenomena. These parameters were numerically calculated by a computer programme (TITUS) using the FEM, during the deposition of a stainless clad on a low-alloy plate. The calculation was performed with a 2-dimensional option in four successive steps: thermal transient calculation, metallurgical transient calculation (determination of the metallurgical phase proportions), elastic-plastic transient (plain strain conditions), hydrogen diffusion transient. Temperature and phase dependence of hydrogen diffusion coefficient and solubility constant. The following results were obtained: thermal calculations are very consistent with experiments at higher temperatures (due to the introduction of fusion and solidification latent heats); the consistency is not as good (by 70 degrees) for lower temperatures (below 650 degrees C); this was attributed to the non-introduction of gamma-alpha transformation latent heat. The metallurgical phase calculation indicates that the heat affected zone is almost entirely transformed into bainite after cooling down (the martensite proportion does not exceed 5%). The elastic-plastic calculations indicate that the stresses in the heat affected zone are compressive or slightly tensile; on the other hand, higher tensile stresses develop on the boundary of the heat affected zone. The transformation plasticity has a definite influence on the final stress level. The return of hydrogen to the clad during the bainitic transformation is but an incomplete phenomenon and the hydrogen concentration in the heat affected zone after cooling down to room temperature is therefore sufficient to cause cold cracking (if no heat treatment is applied). Heat treatments are efficient in lowering the hydrogen concentration. These results enable us to draw preliminary conclusions on practical means to avoid cracking. (orig.)

Thermal Stress Analysis for Ceramics Stalk in the Low Pressure Die Casting Machine

Science.gov (United States)

Noda, Nao-Aki; Hendra, Nao-Aki; Takase, Yasushi; Li, Wenbin

Low pressure die casting (LPDC) is defined as a net shape casting technology in which the molten metal is injected at high speeds and pressure into a metallic die. The LPDC process is playing an increasingly important role in the foundry industry as a low-cost and high-efficiency precision forming technique. The LPDC process is that the permanent die and filling systems are placed over the furnace containing the molten alloy. The filling of the cavity is obtained by forcing the molten metal by means of a pressurized gas in order to rise into a ceramic tube, which connects the die to the furnace. The ceramics tube called stalk has high temperature resistance and high corrosion resistance. However, attention should be paid to the thermal stress when the stalk is dipped into the molten aluminum. It is important to develop the design of the stalk to reduce the risk of fracture because of low fracture toughness of ceramics. In this paper, therefore, the finite element method is applied to calculate the thermal stresses when the stalk is dipped into the crucible by varying the dipping speeds and dipping directions. It is found that the thermal stress can be reduced by dipping slowly if the stalk is dipped into the crucible vertically, while the thermal stress can be reduced by dipping fast if it is dipped horizontally.

Expression analysis of HSP70 in the testis of Octopus tankahkeei under thermal stress.

Science.gov (United States)

Long, Ling-Li; Han, Ying-Li; Sheng, Zhang; Du, Chen; Wang, You-Fa; Zhu, Jun-Quan

2015-09-01

The gene encoding heat shock protein 70 (HSP70) was identified in Octopus tankahkeei by homologous cloning and rapid amplification of cDNA ends (RACE). The full-length cDNA (2471 bp) consists of a 5'-untranslated region (UTR) (89 bp), a 3'-UTR (426 bp), and an open reading frame (1956 bp) that encodes 651 amino acid residues with a predicted molecular mass of 71.8 kDa and an isoelectric point of 5.34. Based on the amino acid sequence analysis and multiple sequence alignment, this cDNA is a member of cytoplasmic hsp70 subfamily of the hsp70 family and was designated as ot-hsp70. Tissue expression analysis showed that HSP70 expression is highest in the testes when all examined organs were compared. Immunohistochemistry analysis, together with hematoxylin-eosin staining, revealed that the HSP70 protein was expressed in all spermatogenic cells, but not in fibroblasts. In addition, O. tankahkeei were heat challenged by exposure to 32 °C seawater for 2 h, then returned to 13 °C for various recovery time (0-24 h). Relative expression of ot-hsp70 mRNA in the testes was measured at different time points post-challenge by quantitative real-time PCR. A clear time-dependent mRNA expression of ot-hsp70 after thermal stress indicates that the HSP70 gene is inducible. Ultrastructural changes of the heat-stressed testis were observed by transmission electron microscopy. We suggest that HSP70 plays an important role in spermatogenesis and testis protection against thermal stress in O. tankahkeei. Copyright © 2015 Elsevier Inc. All rights reserved.

Thermal effects of runaway electrons in an armoured divertor

International Nuclear Information System (INIS)

Stad, R.C.L. van der.

1993-12-01

This report describes the results of a numerical thermal analysis of the heat deposition of runaway electrons accompanying plasma disruptions in a armoured divertor. The divertor concepts studied are carbon on molybdenum and beryllium on copper. The conclusion is that the runaway electrons can cause melting of the armour as well as melting of the structure and can damage the divertor severely. (orig.)

Influence of quenching agent on microstructure, properties and thermal stress of SiC{sub p}/2009 composites

Energy Technology Data Exchange (ETDEWEB)

He, Tianbing, E-mail: tianbing_1988@sina.com [Beijing Institute of Aeronautic Materials, Beijing 100095 (China); Beijing Engineering Research Center of Advanced Aluminum Alloys and Application, Beijing 100095 (China); Li, Huiqu; Tang, Pengjun; He, Xiaolei; Li, Peiyong [Beijing Institute of Aeronautic Materials, Beijing 100095 (China); Beijing Engineering Research Center of Advanced Aluminum Alloys and Application, Beijing 100095 (China)

2016-08-15

15% vol. SiC{sub p}/2009 composites prepared by powder metallurgy were quenched in room temperature water and 20% polyethylene glycol (PEG) solution respectively, then aged naturally. The influence of quenching agent on microstructure, properties and thermal stress of SiC{sub p}/2009 composites were investigated by means of scanning/transmission electron microscope, hardness and tensile test. The results showed that the number of precipitated phase in water quenched composites increased, with much finer in size and more homogeneous in distribution compared with 20% PEG quenched one. Meanwhile, the density of dislocation in composites by water quenching was also much higher. Intergranular corrosion did not occur with the two quenching agents. The 20% PEG quenched composites exhibited slight lower hardness and higher electrical conductivity than that of water quenched one. The two quenched composites showed same level in tensile strength, but the yield strength of water-quenched composites was higher (8 MPa, 3%). The usage of 20% PEG reduced thermal stress and minimized warping deformation of the parts, it is a more suitable quenching agent for SiC{sub p}/2009 composites in engineering application fields. - Highlights: •SiC{sub p}/2009 composites quenched by water and 20% PEG solution were investigated. •Aging precipitation behavior of SiC{sub p}/2009 composites is sensitive to quenchant. •Influence of quenching agent on properties of SiC{sub p}/2009 composites are minimal. •Quenching with 20% PEG reduces thermal stress of SiC{sub p}/2009 composites remarkably. •20% PEG is a more suitable quenching agent for SiC{sub p}/2009 composites than water.

Metal/dielectric thermal interfacial transport considering cross-interface electron-phonon coupling: Theory, two-temperature molecular dynamics, and thermal circuit

Science.gov (United States)

Lu, Zexi; Wang, Yan; Ruan, Xiulin

2016-02-01

The standard two-temperature equations for electron-phonon coupled thermal transport across metal/nonmetal interfaces are modified to include the possible coupling between metal electrons with substrate phonons. The previous two-temperature molecular dynamics (TT-MD) approach is then extended to solve these equations numerically at the atomic scale, and the method is demonstrated using Cu/Si interface as an example. A key parameter in TT-MD is the nonlocal coupling distance of metal electrons and nonmetal phonons, and here we use two different approximations. The first is based on Overhauser's "joint-modes" concept, while we use an interfacial reconstruction region as the length scale of joint region rather than the phonon mean-free path as in Overhauser's original model. In this region, the metal electrons can couple to the joint phonon modes. The second approximation is the "phonon wavelength" concept where electrons couple to phonons nonlocally within the range of one phonon wavelength. Compared with the original TT-MD, including the cross-interface electron-phonon coupling can slightly reduce the total thermal boundary resistance. Whether the electron-phonon coupling within the metal block is nonlocal or not does not make an obvious difference in the heat transfer process. Based on the temperature profiles from TT-MD, we construct a new mixed series-parallel thermal circuit. We show that such a thermal circuit is essential for understanding metal/nonmetal interfacial transport, while calculating a single resistance without solving temperature profiles as done in most previous studies is generally incomplete. As a comparison, the simple series circuit that neglects the cross-interface electron-phonon coupling could overestimate the interfacial resistance, while the simple parallel circuit in the original Overhauser's model underestimates the total interfacial resistance.

Transient thermal stress distribution in a circular pipe heated externally with a periodically moving heat source

International Nuclear Information System (INIS)

Özışık, Gülşah; Genç, M. Serdar; Yapıcı, Hüseyin

2012-01-01

This study presents the effects of periodically moving heat source on a circular steel pipe heated partly from its outer surface under stagnant ambient conditions. While the pipe is heated with this heat source applied on a certain section having a thickness of heat flux, the water flows through it to transfer heat. It is assumed that the flow is a fully-developed laminar flow. The heat source moves along from one end of the outer to the other end with a constant speed and then returns to the first end with the same speed. It is assumed that the heat transfer rate has a constant value, and that the thermo-physical properties of the steel do not change with temperature (elastic analysis). The numerical calculations have been performed individually for a wide range of thermal conductivity of steel and for different thicknesses of heat flux. The moving heat source produces the non-uniform temperature gradient and the non-uniform effective thermal stress, and when it arrives at the ends of the pipe, the temperature and effective thermal stress ratio profiles rise more excessively. The tangential component is more dominant in the effective thermal stress than the radial component. Highlights: ► Moving heat source produces non-uniform temperature gradients and thermal stresses. ► When moving heat source arrives at ends of pipe, temperature gradients rise excessively. ► With increasing of heat flux thickness and thermal conductivity, the temperature gradients reduce. ► Temperature gradients in thermal boundary layers slightly increase. ► Tangential component is more dominant in thermal stress than radial component.

Simulation of thermal stress and buckling instability in Si/Ge and Ge/Si core/shell nanowires.

Science.gov (United States)

Das, Suvankar; Moitra, Amitava; Bhattacharya, Mishreyee; Dutta, Amlan

2015-01-01

The present study employs the method of atomistic simulation to estimate the thermal stress experienced by Si/Ge and Ge/Si, ultrathin, core/shell nanowires with fixed ends. The underlying technique involves the computation of Young's modulus and the linear coefficient of thermal expansion through separate simulations. These two material parameters are combined to obtain the thermal stress on the nanowires. In addition, the thermally induced stress is perceived in the context of buckling instability. The analysis provides a trade-off between the geometrical and operational parameters of the nanostructures. The proposed methodology can be extended to other materials and structures and helps with the prediction of the conditions under which a nanowire-based device might possibly fail due to elastic instability.

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Science.gov (United States)

Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E.

2018-03-27

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Rooting and early growth of red mangrove seedlings from thermally stressed trees

International Nuclear Information System (INIS)

Banus, M.D.; Kolehmainen, S.E.

At Guayanilla on the south coast of Puerto Rico a fossil fueled electric generating station of 1100 MW(e) discharges its cooling water into a nearly enclosed lagoon of about 25 hectares area. The plume and lagoon typically have water temperatures 10 0 C and 8 0 C above ambient so that the winter and summer lagoon temperatures are 34 and 39 0 C, respectively. The north, east, and south shores of this lagoon have extensive stands of red and black mangrove trees which are visibly stressed by the elevated temperatures. Ripe red mangrove seedlings from the bearing trees are significantly smaller than those from trees in Guayanilla Bay not thermally stressed and in unpolluted bays from western Puerto Rico. Seedlings from thermally stressed trees developed negative buoyancy and initial roots faster but first pair of leaves slower than seedlings from control areas. This behavior will be discussed in relation to the propagation of seedlings from non-stressed areas. (U.S.)

Study on application of green's function method in thermal stress rapid calculation

International Nuclear Information System (INIS)

Zhang Guihe; Duan Yuangang; Xu Xiao; Chen Rong

2013-01-01

This paper presents a quick and accuracy thermal stress calculation method, the Green's Function Method, which is a combination of finite element method and numerical algorithm method. Thermal stress calculation of Safe Injection Nozzle of Reactor Coolant Line of PWR plant is performed with Green's function method for heatup and cooldown thermal transients as a demonstration example, and the result is compared with finite element method to verify the rationality and accuracy of this method. The advantage and disadvantage of the Green's function method and the finite element method are also compared. (authors)

Uranyl soaps - thermal, electronic and infrared spectral study

International Nuclear Information System (INIS)

Solanki, A.K.; Bhandari, A.M.

1981-01-01

The electronic and infrared spectra and TGA thermogram of uranyl soaps (laurate, mystrate, palmitate and stearate) have been studied. The environment about the UO 2+ 2 ion would comprise two 'short bite' bidentate carboxylate groups and oxygen atoms bridging from adjacent carboxylic molecules. The uranyl soaps have UO 2+ 2 vibronic absorption (approx. equal to 22730 cm -1 ) in the range found for eight coordinate uranyl complexes. The greater resistance to thermal degradation (approx. equal to 300 0 C) of these soaps and their stepwise thermal degradation infer strong metal-ligand interaction. (orig.) [de

Preparation and thermal conductivity enhancement of composite phase change materials for electronic thermal management

International Nuclear Information System (INIS)

Wu, Weixiong; Zhang, Guoqing; Ke, Xiufang; Yang, Xiaoqing; Wang, Ziyuan; Liu, Chenzhen

2015-01-01

Highlights: • A kind of composite phase change material board (PCMB) is prepared and tested. • PCMB presents a large thermal storage capacity and enhanced thermal conductivity. • PCMB displays much better cooling effect in comparison to natural air cooling. • PCMB presents different cooling characteristics in comparison to ribbed radiator. - Abstract: A kind of phase change material board (PCMB) was prepared for use in the thermal management of electronics, with paraffin and expanded graphite as the phase change material and matrix, respectively. The as-prepared PCMB presented a large thermal storage capacity of 141.74 J/g and enhanced thermal conductivity of 7.654 W/(m K). As a result, PCMB displayed much better cooling effect in comparison to natural air cooling, i.e., much lower heating rate and better uniformity of temperature distribution. On the other hand, compared with ribbed radiator technology, PCMB also presented different cooling characteristics, demonstrating that they were suitable for different practical application

Effects of Thermal Exposure on Structures of DD6 Single Crystal Superalloy with Thermal Barrier Coatings

Directory of Open Access Journals (Sweden)

DONG Jianmin

2016-10-01

Full Text Available In order to investigate the effect of water grit-blasting and high temperature thermal exposure on the microstructures of DD6 alloy with TBCs, DD6 single crystal superalloy specimens were water grit-blasted with 0.3 MPa pressure, then the specimens were coated with thermal barrier coatings by electron beam physical vapor deposition (EB-PVD. Specimens with TBCs were exposed at 1100℃ for 50 and 100 hours in the air respectively, and then these specimens were subjected to stress-rupture tests under the condition of 1100℃/130 MPa. The results show that grit-blasting doesn't lead into the recrystallization, thermal exposure can induce element interdiffusion between the bond coat and alloy substrate, the residual stress and element diffusion lead into the changes of γ' phase coarsing direction. After stress rupture tests, the secondary reaction zone emerges into a local area.

Thermal and mechanical modelling of a mig-type electron gun

International Nuclear Information System (INIS)

Patire Junior, H.; Castro, J.J.B. de

1995-01-01

A thermal and mechanical modelling of a magnetron injection electron gun has been made to minimize the temperature distribution in the gun elements while keeping the required operating temperature at 1000 0 C of the emitter. Appropriate materials were selected to reduce thermal losses and to improve the gun design from a constructional point of view aiming at extending the capabilities of the gun. A software has been used to simulate a thermal model considering the three processes of thermal transfer and the influence of the physical properties of the materials used. (author). 8 refs., 2 figs, 2 tabs

Thermal protection of electronic devices with the Nylon6/66-PEG nanofiber membranes

OpenAIRE

Li Ya; Li Xue-Weis; He Ji-Huan; Wang Ping

2014-01-01

Phase change materials for thermal energy storage have been widely applied to clothing insulation, electronic products of heat energy storage. The thermal storage potential of the nanofiber membranes was analyzed using the differential scanning calorimetry. Effect of microstructure of the membrane on energy storage was analyzed, and its applications to electronic devices were elucidated.

Residual stress change by thermal annealing in amorphous Sm-Fe-B thin films

International Nuclear Information System (INIS)

Na, S.M.; Suh, S.J.; Kim, H.J.; Lim, S.H.

2002-01-01

The change in the residual stress and its effect on mechanical bending and magnetic properties of sputtered amorphous Sm-Fe-B thin films are investigated as a function of annealing temperature. Two stress components of intrinsic compressive stress and tensile stress due to the difference of the thermal expansion coefficients between the substrate and thin film are used to explain the stress state in as-deposited thin films, and the annealing temperature dependence of residual stress, mechanical bending and magnetic properties

Modelling of thermal shock experiments of carbon based materials in JUDITH

Science.gov (United States)

Ogorodnikova, O. V.; Pestchanyi, S.; Koza, Y.; Linke, J.

2005-03-01

The interaction of hot plasma with material in fusion devices can result in material erosion and irreversible damage. Carbon based materials are proposed for ITER divertor armour. To simulate carbon erosion under high heat fluxes, electron beam heating in the JUDITH facility has been used. In this paper, carbon erosion under energetic electron impact is modeled by the 3D thermomechanics code 'PEGASUS-3D'. The code is based on a crack generation induced by thermal stress. The particle emission observed in thermal shock experiments is a result of breaking bonds between grains caused by thermal stress. The comparison of calculations with experimental data from JUDITH shows good agreement for various incident power densities and pulse durations. A realistic mean failure stress has been found. Pre-heating of test specimens results in earlier onset of brittle destruction and enhanced particle loss in agreement with experiments.

Modelling of thermal shock experiments of carbon based materials in JUDITH

International Nuclear Information System (INIS)

Ogorodnikova, O.V.; Pestchanyi, S.; Koza, Y.; Linke, J.

2005-01-01

The interaction of hot plasma with material in fusion devices can result in material erosion and irreversible damage. Carbon based materials are proposed for ITER divertor armour. To simulate carbon erosion under high heat fluxes, electron beam heating in the JUDITH facility has been used. In this paper, carbon erosion under energetic electron impact is modeled by the 3D thermomechanics code 'PEGASUS-3D'. The code is based on a crack generation induced by thermal stress. The particle emission observed in thermal shock experiments is a result of breaking bonds between grains caused by thermal stress. The comparison of calculations with experimental data from JUDITH shows good agreement for various incident power densities and pulse durations. A realistic mean failure stress has been found. Pre-heating of test specimens results in earlier onset of brittle destruction and enhanced particle loss in agreement with experiments

Modelling of thermal shock experiments of carbon based materials in JUDITH

Energy Technology Data Exchange (ETDEWEB)

Ogorodnikova, O.V. [Forschungszentrum Juelich, EURATOM-Association, IWV-2, 52425 Juelich (Germany)]. E-mail: o.ogorodnikova@fz-juelich.de; Pestchanyi, S. [Forschungszentrum Karlsruhe, EURATOM-Associaton, IHM, 76021 Karlsruhe (Germany); Koza, Y. [Forschungszentrum Juelich, EURATOM-Association, IWV-2, 52425 Juelich (Germany); Linke, J. [Forschungszentrum Juelich, EURATOM-Association, IWV-2, 52425 Juelich (Germany)

2005-03-01

The interaction of hot plasma with material in fusion devices can result in material erosion and irreversible damage. Carbon based materials are proposed for ITER divertor armour. To simulate carbon erosion under high heat fluxes, electron beam heating in the JUDITH facility has been used. In this paper, carbon erosion under energetic electron impact is modeled by the 3D thermomechanics code 'PEGASUS-3D'. The code is based on a crack generation induced by thermal stress. The particle emission observed in thermal shock experiments is a result of breaking bonds between grains caused by thermal stress. The comparison of calculations with experimental data from JUDITH shows good agreement for various incident power densities and pulse durations. A realistic mean failure stress has been found. Pre-heating of test specimens results in earlier onset of brittle destruction and enhanced particle loss in agreement with experiments.

Effect of electron beam irradiation on the thermal properties of polycarbonate / polyester blend

International Nuclear Information System (INIS)

Zarie, K.A.

2007-01-01

The effect of electron beam irradiation on the thermal properties of Bayfol (polycarbonate/polyester blend) solid state nuclear track detector (SSNTD) was investigated. Non-isothermal studies were carried out using thermogravimetric analysis (TGA) and differential thermogravimetric (DTG) to obtain the activation energy of thermal decomposition for Bayfol detector. The thermogravimetric analysis (TGA) indicated that the Bayfol samples were decomposed in one main break down stage. Samples of 250 μm thickness sheets were exposed to electron beam irradiations in the dose range 20-600 KGy. The variation of melting temperatures with the electron dose was determined using differential thermal analysis (DTA). The results indicated that the electron irradiation in the dose range 200-600 KGy decreases the melting temperature of the Bayfol samples and this is most suitable for applications requiring the molding of this polymer at lower temperatures

A protocol for analysing thermal stress in insects using infrared thermography.

Science.gov (United States)

Gallego, Belén; Verdú, José R; Carrascal, Luis M; Lobo, Jorge M

2016-02-01

The study of insect responses to thermal stress has involved a variety of protocols and methodologies that hamper the ability to compare results between studies. For that reason, the development of a protocol to standardize thermal assays is necessary. In this sense, infrared thermography solves some of the problems allowing us to take continuous temperature measurements without handling the individuals, an important fact in cold-blooded organisms like insects. Here, we present a working protocol based on infrared thermography to estimate both cold and heat thermal stress in insects. We analyse both the change in the body temperature of individuals and their behavioural response. In addition, we used partial least squares regression for the statistical analysis of our data, a technique that solves the problem of having a large number of variables and few individuals, allowing us to work with rare or endemic species. To test our protocol, we chose two species of congeneric, narrowly distributed dung beetles that are endemic to the southeastern part of the Iberian Peninsula. With our protocol we have obtained five variables in the response to cold and twelve in the response to heat. With this methodology we discriminate between the two flightless species of Jekelius through their thermal response. In response to cold, Jekelius hernandezi showed a higher rate of cooling and reached higher temperatures of stupor and haemolymph freezing than Jekelius punctatolineatus. Both species displayed similar thermoregulation ranges before reaching lethal body temperature with heat stress. Overall, we have demonstrated that infrared thermography is a suitable method to assess insect thermal responses with a high degree of sensitivity, allowing for the discrimination between closely related species. Copyright © 2016 Elsevier Ltd. All rights reserved.

Contrasting Patterns of Coral Bleaching Susceptibility in 2010 Suggest an Adaptive Response to Thermal Stress

Science.gov (United States)

Guest, James R.; Baird, Andrew H.; Maynard, Jeffrey A.; Muttaqin, Efin; Edwards, Alasdair J.; Campbell, Stuart J.; Yewdall, Katie; Affendi, Yang Amri; Chou, Loke Ming

2012-01-01

Background Coral bleaching events vary in severity, however, to date, the hierarchy of susceptibility to bleaching among coral taxa has been consistent over a broad geographic range and among bleaching episodes. Here we examine the extent of spatial and temporal variation in thermal tolerance among scleractinian coral taxa and between locations during the 2010 thermally induced, large-scale bleaching event in South East Asia. Methodology/Principal Findings Surveys to estimate the bleaching and mortality indices of coral genera were carried out at three locations with contrasting thermal and bleaching histories. Despite the magnitude of thermal stress being similar among locations in 2010, there was a remarkable contrast in the patterns of bleaching susceptibility. Comparisons of bleaching susceptibility within coral taxa and among locations revealed no significant differences between locations with similar thermal histories, but significant differences between locations with contrasting thermal histories (Friedman = 34.97; pSingapore, where only 5% and 12% of colonies died. Conclusions/Significance The pattern of susceptibility among coral genera documented here is unprecedented. A parsimonious explanation for these results is that coral populations that bleached during the last major warming event in 1998 have adapted and/or acclimatised to thermal stress. These data also lend support to the hypothesis that corals in regions subject to more variable temperature regimes are more resistant to thermal stress than those in less variable environments. PMID:22428027

Electronic thermal conductivity of 2-dimensional circular-pore metallic nanoporous materials

International Nuclear Information System (INIS)

Huang, Cong-Liang; Lin, Zi-Zhen; Luo, Dan-Chen; Huang, Zun

2016-01-01

The electronic thermal conductivity (ETC) of 2-dimensional circular-pore metallic nanoporous material (MNM) was studied here for its possible applications in thermal cloaks. A simulation method based on the free-electron-gas model was applied here without considering the quantum effects. For the MNM with circular nanopores, there is an appropriate nanopore size for thermal conductivity tuning, while a linear relationship exists for this size between the ETC and the porosity. The appropriate nanopore diameter size will be about one times that of the electron mean free path. The ETC difference along different directions would be less than 10%, which is valuable when estimating possible errors, because the nanoscale-material direction could not be controlled during its application. Like nanoparticles, the ETC increases with increasing pore size (diameter for nanoparticles) while the porosity was fixed, until the pore size reaches about four times that of electron mean free path, at which point the ETC plateaus. The specular coefficient on the surface will significantly impact the ETC, especially for a high-porosity MNM. The ETC can be decreased by 30% with a tuning specular coefficient. - Highlights: • For metallic nanoporous materials, there is an appropriate pore size for thermal conductivity tuning. • ETC increases with increasing pore size until pore size reaches about four times EMFP. • The ETC difference between different directions will be less than 10%. • The ETC can be decreased by 30% with tuning specular coefficient.

Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment

Science.gov (United States)

Zhao, Xuewei; Ma, Limin; Wang, Yishu; Guo, Fu

2018-01-01

Through-silicon vias (TSV) are facing unexpected thermo-mechanical reliability problems due to the coefficient of thermal expansion (CTE) mismatch between various materials in TSVs. During applications, thermal stresses induced by CTE mismatch will have a negative impact on other devices connecting with TSVs, even leading to failure. Therefore, it is essential to investigate the stress distribution evolution in the TSV structure under thermal loads. In this report, TSVs were heated to 450°C at different heating rates, then cooled down to room temperature after a 30-min dwelling. After heating treatment, TSV samples exhibited different Cu deformation behaviors, including Cu intrusion and protrusion. Based on the different Cu deformation behaviors, stress in Si around Cu vias of these samples was measured and analyzed. Results analyzed by Raman spectrums showed that the stress distribution changes were associated with Cu deformation behaviors. In the area near the Cu via, Cu protrusion behavior might aggravate the stress in Si obtained from the Raman measurement, while Cu intrusion might alleviate the stress. The possible reason was that in this area, the compressive stress σ_{θ } induced by thermal loads might be the dominant stress. In the area far from the Cu via, thermal loads tended to result in a tensile stress state in Si.

Spalling stress in oxidized thermal barrier coatings evaluated by X-ray diffraction method

Energy Technology Data Exchange (ETDEWEB)

Suzuki, K. [Faculty of Education and Human Sciences, Niigata Univ., Niigata (Japan); Tanaka, K. [Dept. of Mechanical Engineering, Nagoya Univ., Furoh-cho, Chikusa-ku, Nagoya (Japan)

2005-07-01

The spallation of thermal barrier coatings (TBCs) is promoted by thermally grown oxide (TGO). To improve TBCs, it is very important to understand the influence of TGO on the spalling stress. In this study 'the TBCs were oxidized at 1373 K for four different periods: 0, 500,1000 and 2000 h. The distribution of the in-plane stress in oxidized TBCs, {sigma}{sub 1}, was obtained by repeating the X-ray stress measurement with low energy X-rays after successive removal of the surface layer. The distribution of the out-of-plane stress, {sigma}{sub 1} - {sigma}{sub 3}, was measured with hard synchrotron X-rays, because high energy X-rays have a large penetration depth. From the results by the low and high energy X-rays, the spalling stress in the oxidized TBCs, {sigma}{sub 3}, was evaluated. The evaluated value of the spalling stress for the oxidized TBC was a small tension beneath the surface, but steeply increased near the interface between the top and bond coating. This large tensile stress near the interface is responsible for the spalling of the top coating. (orig.)

Correlation between electron-irradiation defects and applied stress in graphene: A molecular dynamics study

Energy Technology Data Exchange (ETDEWEB)

Kida, Shogo; Yamamoto, Masaya; Kawata, Hiroaki; Hirai, Yoshihiko; Yasuda, Masaaki, E-mail: yasuda@pe.osakafu-u.ac.jp [Department of Physics and Electronics, Osaka Prefecture University, Sakai, Osaka 599-8531 (Japan); Tada, Kazuhiro [Department of Electrical and Control Systems Engineering, National Institute of Technology, Toyama College, Toyama 939-8630 (Japan)

2015-09-15

Molecular dynamics (MD) simulations are performed to study the correlation between electron irradiation defects and applied stress in graphene. The electron irradiation effect is introduced by the binary collision model in the MD simulation. By applying a tensile stress to graphene, the number of adatom-vacancy (AV) and Stone–Wales (SW) defects increase under electron irradiation, while the number of single-vacancy defects is not noticeably affected by the applied stress. Both the activation and formation energies of an AV defect and the activation energy of an SW defect decrease when a tensile stress is applied to graphene. Applying tensile stress also relaxes the compression stress associated with SW defect formation. These effects induced by the applied stress cause the increase in AV and SW defect formation under electron irradiation.

The effects of location, thermal stress, and residual stress on corner cracks in nozzles with cladding

International Nuclear Information System (INIS)

Besuner, P.M.; Cohen, L.M.; McLean, J.L.

1977-01-01

The stress intensity factors (Ksub(I)) for corner cracks in a boiling water reactor feedwater nozzle with stainless steel cladding are obtained for loading by internal pressure, and a fluid quench in the nozzle. Conditions with and without residual stress in the component are considered. The residual stress is simulated by means of a reference temperature change. The stress distribution for the uncracked structure is obtained from a three-dimensional finite element model. A three-dimensional influence function (IF) method, in conjunction with the boundary-integral equation method for structural analysis is employed to compute Ksub(I) values from the uncracked structure's stress distribution. It is concluded that the effects on Ksub(I) of location, thermal stresses, and residual stresses are significant and generally too complex to evaluate without advanced numerical procedures. The ulilized combination of finite element analysis of the uncracked structure and three-dimensional influence function analysis of the cracked structure is demonstrated and endorsed. (Auth.)

A study on the bonding residual thermal stress analysis of dissimilar materials using boundary element method

International Nuclear Information System (INIS)

Yi, Won; Yu, Yeong Chul; Jeong, Eui Seob; Lee, Chang Ho

1995-01-01

It is very important to evaluate the bonding residual thermal stress in dissimilar materials such as LSI package. In this study, the bonding residual thermal stress was calculated using the boundary element method, varing with the sub-element, geometry of specimen and adhesive thickness. The present results reveal a stress singularity at the edge of the interface, therefore the bonding strength of metal/resin interface can be estimated by taking into account it.

FEM thermal and stress analysis of bonded GaN-on-diamond substrate

Directory of Open Access Journals (Sweden)

Wenbo Zhai

2017-09-01

Full Text Available A three-dimensional thermal and stress analysis of bonded GaN on diamond substrate is investigated using finite element method. The transition layer thickness, thermal conductivity of transition layer, diamond substrate thickness and the area ratio of diamond and GaN are considered and treated appropriately in the numerical simulation. The maximum channel temperature of GaN is set as a constant value and its corresponding heat power densities under different conditions are calculated to evaluate the influences that the diamond substrate and transition layer have on GaN. The results indicate the existence of transition layer will result in a decrease in the heat power density and the thickness and area of diamond substrate have certain impact on the magnitude of channel temperature and stress distribution. Channel temperature reduces with increasing diamond thickness but with a decreasing trend. The stress is reduced by increasing diamond thickness and the area ratio of diamond and GaN. The study of mechanical and thermal properties of bonded GaN on diamond substrate is useful for optimal designs of efficient heat spreader for GaN HEMT.

Monte Carlo simulation of electron thermalization in scintillator materials: Implications for scintillator nonproportionality

Energy Technology Data Exchange (ETDEWEB)

Prange, Micah P. [Physical and Computational Sciences Directorate, Pacific Northwest National Laboratory, Richland, Washington 99352, USA; Xie, YuLong [Energy and Environment Directorate, Pacific Northwest National Laboratory, Richland, Washington 99352, USA; Campbell, Luke W. [National Security Directorate, Pacific Northwest National Laboratory, Richland, Washington 99352, USA; Gao, Fei [Department of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, Michigan 48109, USA; Kerisit, Sebastien [Physical and Computational Sciences Directorate, Pacific Northwest National Laboratory, Richland, Washington 99352, USA

2017-12-21

The lack of reliable quantitative estimates of the length and time scales associated with hot electron thermalization after a gamma-ray induced energy cascade obscures the interplay of various microscopic processes controlling scintillator performance and hampers the search for improved detector materials. We apply a detailed microscopic kinetic Monte Carlo model of the creation and subsequent thermalization of hot electrons produced by gamma irradiation of six important scintillating crystals to determine the spatial extent of the cloud of excitations produced by gamma rays and the time required for the cloud to thermalize with the host lattice. The main ingredients of the model are ensembles of microscopic track structures produced upon gamma excitation (including the energy distribution of the excited carriers), numerical estimates of electron-phonon scattering rates, and a calculated particle dispersion to relate the speed and energy of excited carriers. All these ingredients are based on first-principles density functional theory calculations of the electronic and phonon band structures of the materials. Details of the Monte Carlo model are presented along with results for thermalization time and distance distributions. These results are discussed in light of previous work. It is found that among the studied materials, calculated thermalization distances are positively correlated with measured nonproportionality. In the important class of halide scintillators, the particle dispersion is found to be more influential than the largest phonon energy in determining the thermalization distance.

An Optimized Thermal Analysis of Electronic Unit Used in Aircraft

International Nuclear Information System (INIS)

Shah, A.N.; Mir, F.; Farooq, M.; Farooq, M.

2014-01-01

In a field where change and growth is inevitable, new electronic packaging problems continuously arise. Smaller, but more powerful devices are prone to overheating causing intermittent system failures, corrupted signals and outright system failure. Current study is focused on the analysis of the optimized working of electronic equipment from thermal point of view. In order to achieve the objective, an approach was developed for the thermal analysis of Printed Circuit Board (PCB) including the heat dissipation of its electronic components and then removal of the heat in a sophisticated manner by considering the conduction and convection modes of heat transfer. Mathematical modeling was carried out for a certain problem to address the thermal design, and then a program was developed in MATLAB for the solution of model by using Newton-Raphson method. The proposed unit is to be mounted on an aircraft having suspected thermal characteristics owing to abrupt changes in pressure and temperature as aircraft moves quickly from a lower altitude to higher altitude. In current study, dominant mode of heat transfer was conduction revealing that the major portion of heat transfer takes place by copper cladding and that heat conduction along the length of PCB can be improved enormously by using even thin layer of copper. The results confirmed that temperatures of all the electronic components were within derated values. Meanwhile, it was known that convection also plays a significant role in the reduction of temperatures of the components. The reduction in nodal temperature was in the range of 13 to 42 %. Furthermore, altitude variation from sea level to 15240 m (above sea level) caused the reduction in pressure from 1atm to 0.1095 atm. Consequently, the temperature of the electronic components increased from 73.25 degree C to 83.83 degree C for first node 'a', and from 66.04 degree C to 68.47 degree C for last node 'n' because of the decrease in the convective heat transfer

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

DEFF Research Database (Denmark)

Bahman, Amir Sajjad; Iannuzzo, Francesco; Uhrenfeldt, Christian

2017-01-01

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely...... in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires....

Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

DEFF Research Database (Denmark)

Bahman, Amir Sajjad; Iannuzzo, Francesco; Uhrenfeldt, Christian

2016-01-01

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely...... in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires....

Reliability metrics extraction for power electronics converter stressed by thermal cycles

DEFF Research Database (Denmark)

Ma, Ke; Choi, Uimin; Blaabjerg, Frede

2017-01-01

Due to the continuous demands for highly reliable and cost-effective power conversion, the quantified reliability performances of the power electronics converter are becoming emerging needs. The existing reliability modelling approaches for the power electronics converter mainly focuses on the pr...... performance of power electronics system. The final predicted results showed good accuracy with much more reliability information compared to the existing approaches, and the quantified reliability correlation to the mission profiles of converter is mathematically established....

Thermal stress prediction in mirror and multilayer coatings.

Science.gov (United States)

Cheng, Xianchao; Zhang, Lin; Morawe, Christian; Sanchez Del Rio, Manuel

2015-03-01

Multilayer optics for X-rays typically consist of hundreds of periods of two types of alternating sub-layers which are coated on a silicon substrate. The thickness of the coating is well below 1 µm (tens or hundreds of nanometers). The high aspect ratio (∼10(7)) between the size of the optics and the thickness of the multilayer can lead to a huge number of elements (∼10(16)) for the numerical simulation (by finite-element analysis using ANSYS code). In this work, the finite-element model for thermal-structural analysis of multilayer optics has been implemented using the ANSYS layer-functioned elements. The number of meshed elements is considerably reduced and the number of sub-layers feasible for the present computers is increased significantly. Based on this technique, single-layer coated mirrors and multilayer monochromators cooled by water or liquid nitrogen are studied with typical parameters of heat-load, cooling and geometry. The effects of cooling-down of the optics and heating of the X-ray beam are described. It is shown that the influences from the coating on temperature and deformation are negligible. However, large stresses are induced in the layers due to the different thermal expansion coefficients between the layer and the substrate materials, which is the critical issue for the survival of the optics. This is particularly true for the liquid-nitrogen cooling condition. The material properties of thin multilayer films are applied in the simulation to predict the layer thermal stresses with more precision.

Investigation of abrupt degradation of drain current caused by under-gate crack in AlGaN/GaN high electron mobility transistors during high temperature operation stress

Energy Technology Data Exchange (ETDEWEB)

Zeng, Chang; Liao, XueYang; Li, RuGuan; Wang, YuanSheng; Chen, Yiqiang, E-mail: yiqiang-chen@hotmail.com; Su, Wei; Liu, Yuan; Wang, Li Wei; Lai, Ping; Huang, Yun; En, YunFei [Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The 5th Electronics Research Institute of the Ministry of Industry and Information Technology, 510610 Guangzhou (China)

2015-09-28

In this paper, we investigate the degradation mode and mechanism of AlGaN/GaN based high electron mobility transistors (HEMTs) during high temperature operation (HTO) stress. It demonstrates that there was abrupt degradation mode of drain current during HTO stress. The abrupt degradation is ascribed to the formation of crack under the gate which was the result of the brittle fracture of epilayer based on failure analysis. The origin of the mechanical damage under the gate is further investigated and discussed based on top-down scanning electron microscope, cross section transmission electron microscope and energy dispersive x-ray spectroscopy analysis, and stress simulation. Based on the coupled analysis of the failure physical feature and stress simulation considering the coefficient of thermal expansion (CTE) mismatch in different materials in gate metals/semiconductor system, the mechanical damage under the gate is related to mechanical stress induced by CTE mismatch in Au/Ti/Mo/GaN system and stress concentration caused by the localized structural damage at the drain side of the gate edge. These results indicate that mechanical stress induced by CTE mismatch of materials inside the device plays great important role on the reliability of AlGaN/GaN HEMTs during HTO stress.

A method of solution of the elastic-plastic thermal stress problem

International Nuclear Information System (INIS)

Rafalski, P.

1975-01-01

The purpose of the work is an improvement of the numerical technique for calculating the thermal stress distribution in an elastic-plastic structural element. The work consists of two parts. In the first a new method of solution of the thermal stress problem for the elastic-plastic body is presented. In the second a particular numerical technique, based on the above method, for calculating the stress and strain fields is proposed. A new mathematical approach consists in treating the stress and strain fields as mathematical objects defined in the space-time domain. The methods commonly applied use the stress and strain fields defined in the space domain and establish the relations between them at a given instant t. They reduce the problem to the system of ordinary differential equations with respect to time, which are usually solved with a step-by-step technique. The new method reduces the problem to the system of nonlinear algebraic equations. In the work the Hilbert space of admissible tensor fields is constructed. This space is the orthogonal sum of two subspaces: of statically admissible and kinematically admissible fields. Two alternative orthogonality conditions, which correspond to the equilibrium and compatibility equations with the appropriate boundary conditions, are derived. The results of the work are to be used for construction of the computer program for calculation the stress and strain fields in the elastic-plastic body with a prescribed temperature field in the interior and appropriate displacement and force conditions on the boundary

Initial assessment of the thermal stresses around a radioactive waste depository in hard rock

International Nuclear Information System (INIS)

Hodgkinson, D.P.; Bourke, P.J.

1980-01-01

The disposal of heat emitting radioactive waste into hard rock should result in temperature rises and thermal gradients over distances of several hundred metres for several centuries. The consequent constrained thermal expansion of the rock would induce stresses which have important implications for possible water-borne leakage of radionuclides and for depository design. These problems are assessed by considering a simplified mathematical model for which analytic solutions to the temperature and stress fields are derived. (author)

Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

Energy Technology Data Exchange (ETDEWEB)

DeVoto, D. J.; Paret, P. P.; Wereszczak, A. A.

2014-08-01

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.

Investigation of thermal management materials for automotive electronic control units

International Nuclear Information System (INIS)

Mallik, Sabuj; Ekere, Ndy; Best, Chris; Bhatti, Raj

2011-01-01

Today's electronics packages are smaller and more powerful than ever before. This leads to ever increasing thermal challenges for the systems designer. The automotive electronic control unit (ECU) package faces the same challenge of thermal management as the industry in general. This is coupled with the latest European Union legislation (Euro 6 standard) which forced the ECU manufacturers to completely re-design their ECU platform with improved hardware and software capability. This will result in increased power densities and therefore, the ability to dissipate heat will be a key factor. A higher thermal conductivity (TC) material for the ECU housing (than the currently used Aluminium) could improve heat dissipation from the ECU. This paper critically reviews the state-of-the-art in thermal management materials which may be applicable to an automotive ECU. This review shows that of the different materials currently available, the Al/SiC composites in particular have very good potential for automotive ECU application. In terms of metal composites processing, the liquid metal infiltration process is recommended as it has a lower processing cost and it also has the ability to produce near net-shape materials.

Thermal stress microfracturing of crystalline and sedimentary rock. Final report, September 16, 1987--September 15, 1991

International Nuclear Information System (INIS)

Wang, H.

1995-08-01

Slow uniform heating of crustal rocks is both a pervasive geologic process and an anticipated by-product of radioactive waste disposal. Such heating generates microcracks which alter the strength, elastic moduli, and transport properties of the rock. The research program was to understand mechanisms of thermal cracking in rocks. It included development of a theoretical understanding of cracking due to thermal stresses, laboratory work to characterize crack strain in rocks thermally stressed under different conditions (including natural thermal histories), microscopic work to count and catalog crack occurrences, and geologic application to determine paleostress history of granites from the midcontinent

Design of thermal neutron beam based on an electron linear accelerator for BNCT.

Science.gov (United States)

Zolfaghari, Mona; Sedaghatizadeh, Mahmood

2016-12-01

An electron linear accelerator (Linac) can be used for boron neutron capture therapy (BNCT) by producing thermal neutron flux. In this study, we used a Varian 2300 C/D Linac and MCNPX.2.6.0 code to simulate an electron-photoneutron source for use in BNCT. In order to decelerate the produced fast neutrons from the photoneutron source, which optimize the thermal neutron flux, a beam-shaping assembly (BSA) was simulated. After simulations, a thermal neutron flux with sharp peak at the beam exit was obtained in the order of 3.09×10 8 n/cm 2 s and 6.19×10 8 n/cm 2 s for uranium and enriched uranium (10%) as electron-photoneutron sources respectively. Also, in-phantom dose analysis indicates that the simulated thermal neutron beam can be used for treatment of shallow skin melanoma in time of about 85.4 and 43.6min for uranium and enriched uranium (10%) respectively. Copyright © 2016. Published by Elsevier Ltd.

Preparation of thermal resistant-enhanced separators for lithium ion battery by electron beam irradiation

Energy Technology Data Exchange (ETDEWEB)

Sohn, Joon Yong; Shin, Junhwa; Nho, Youngchang [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

2012-03-15

Micro-porous membrane made of polyethylene (PE) or polypropylene (PP) is most widely used as physical separators between the cathode and anode in lithium secondary batteries. However, the polymer membranes so soften or melt when the temperature reaches 130 .deg. C or higher because of thermal shrinkage of the polyolefin separators, and thaw low thermal stability may cause internal short circuiting or lead to thermal runaway. In this study, to realize a highly safe battery, we prepared three type separators as crosslinked PE separator, polymer-coated PE separator, and ceramic-coated PE separators, for lithium secondary battery by electron beam irradiation. We prepared crosslinked PE separators with the improved thermal stability by irradiating a commercial PE separator with an electron beam. A polymer-coated PE separator was prepared by a dip-coating of PVDF-HFP/PEGDMA on both sides of a PE separator followed by an electron beam irradiation. Ceramic-coated PE separator was prepared by coating ceramic particles on a PE separator followed by an electron beam irradiation. The prepared separators were characterized with FT-IR, SEM, electrolyte uptake, ion conductivity, thermal shrinkage and battery performance test.

Ultrafast carrier thermalization in lead iodide perovskite probed with two-dimensional electronic spectroscopy.

Science.gov (United States)

Richter, Johannes M; Branchi, Federico; Valduga de Almeida Camargo, Franco; Zhao, Baodan; Friend, Richard H; Cerullo, Giulio; Deschler, Felix

2017-08-29

In band-like semiconductors, charge carriers form a thermal energy distribution rapidly after optical excitation. In hybrid perovskites, the cooling of such thermal carrier distributions occurs on timescales of about 300 fs via carrier-phonon scattering. However, the initial build-up of the thermal distribution proved difficult to resolve with pump-probe techniques due to the requirement of high resolution, both in time and pump energy. Here, we use two-dimensional electronic spectroscopy with sub-10 fs resolution to directly observe the carrier interactions that lead to a thermal carrier distribution. We find that thermalization occurs dominantly via carrier-carrier scattering under the investigated fluences and report the dependence of carrier scattering rates on excess energy and carrier density. We extract characteristic carrier thermalization times from below 10 to 85 fs. These values allow for mobilities of 500 cm 2  V -1  s -1 at carrier densities lower than 2 × 10 19  cm -3 and limit the time for carrier extraction in hot carrier solar cells.Carrier-carrier scattering rates determine the fundamental limits of carrier transport and electronic coherence. Using two-dimensional electronic spectroscopy with sub-10 fs resolution, Richter and Branchi et al. extract carrier thermalization times of 10 to 85 fs in hybrid perovskites.

Modelling and analysis of radial thermal stresses and temperature ...

African Journals Online (AJOL)

user

it acts as an insulating medium and prevents the heat flow, hence the need of providing insulation coating on valves is ... geometry metal components (piston, liner and cylinder head) and found a satisfactory .... model. Step8: Find the radial thermal stress at all the nodal point with the use of temperature ..... Cast iron St. 70.

The stress and stress intensity factors computation by BEM and FEM combination for nozzle junction under pressure and thermal loads

International Nuclear Information System (INIS)

Du, Q.; Cen, Z.; Zhu, H.

1989-01-01

This paper reports linear elastic fracture analysis based upon the stress intensity factor evaluation successfully applied to safety assessments of cracked structures. The nozzle junction are usually subjected to high pressure and thermal loads simultaneously. In validity of linear elastic fracture analysis, K can be decomposed into K P (caused by mechanic loads) and K τ (caused by thermal loads). Under thermal transient loading, explicit analysis (say by the FEM or BEM) of K tracing an entire history respectively for a range of crack depth may be much more time consuming. The techniques of weight function provide efficient means for transforming the problem into the stress computation of the uncracked structure and generation of influence function (for the given structure and size of crack). In this paper, a combination of BE-FEM has been used for the analysis of the cracked nozzle structure by techniques of weight function. The influence functions are obtained by coupled BE-FEM and the uncracked structure stress are computed by finite element methods

High-temperature stability of yttria-stabilized zirconia thermal barrier ...

Indian Academy of Sciences (India)

The coatings before and after IR heating were investigated by scanning electron microscopy, X-ray diffraction, electron probe microanalysis, microhardness and residual stress measurements in order to understand the effect of thermal shock on the properties of the TBC. On account of these high-temperature properties, ...

Determine variation of poisson ratios and thermal creep stresses and strain rates in an isotropic disc

Directory of Open Access Journals (Sweden)

Gupta Nishi

2016-01-01

Full Text Available Seth's transition theory is applied to the problem of thermal creep transition stresses and strain rates in a thin rotating disc with shaft having variable density by finite deformation. Neither the yield criterion nor the associated flow rule is assumed here. The results obtained here are applicable to compressible materials. If the additional condition of incompressibility is imposed, then the expression for stresses corresponds to those arising from Tresca yield condition. Thermal effect decreased value of radial stress at the internal surface of the rotating isotropic disc made of compressible material as well as incompressible material and this value of radial stress further much increases with the increase in angular speed. With the introduction of thermal effects, the maximum value of strain rates further increases at the internal surface for compressible materials as compare to incompressible material.

High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

Energy Technology Data Exchange (ETDEWEB)

Waye, Scot [National Renewable Energy Lab. (NREL), Golden, CO (United States)

2016-08-01

Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.

Transient thermal stresses in a circular cylinder with constrained ends

International Nuclear Information System (INIS)

Goshima, Takahito; Miyao, Kaju

1986-01-01

This paker deals with the transient thermal stresses in a finite circular cylinder constrained at both end surfaces and subjected to axisymmetric temperature distribution on the lateral surface. The thermoelastic problem is formulated in terms of a thermoelastic displacement potential and three harmonic stress functions. Numerical calculations are carried out for the case of the uniform temperature distribution on the lateral surface. The stress distributions on the constrained end and the free suface are shown graphically, and the singularity in stresses appearing at the circumferencial edge is considered. Moreover, the approximate solution based upon the plane strain theory is introduced in order to compare the rigorous one, and it is considered how the length of the cylinder and the time proceeds affect on the accuracy of the approximation. (author)

Thermal and stress analysis of a fuel rod research project 277

International Nuclear Information System (INIS)

1975-04-01

The purpose of this investigation was to perform an analytical evaluation of a postulated loss of coolant incident in a large pressurized water reactor. A coupled thermal and stress finite element analysis of a fuel rod subjected to a hypothetical blow-down transient was carried out. The effect of two gap conditions and two initial stress states on the response of the fuel rod was studied. Both one-dimensional and three-dimensional models were investigated. To study the heat transfer in the gap region one assumes a conductive mode of heat transfer in the gap characterized by an equivalent thermal conductivity, which is dependent on the current gap width. Accordingly, coupled analysis procedure and computational scheme were established. A mesh generation computer program was developed for the three-dimensional model

Numerical Analysis of Thermal Stresses around Fasteners in Composite Metal Foils

Science.gov (United States)

Nammi, S. K.; Butt, J.; –L Mauricette, J.; Shirvani, H.

2017-12-01

The process of composite metal foil manufacturing (CMFM) has reduced a number of limitations associated with commercial additive manufacturing (AM) methods. The existing metal AM machines are restricted by their build envelope and there is a growing market for the manufacture of large parts using AM. These parts are subsequently manufactured in fragments and are fastened together. This paper analyses the thermal stresses around cylindrical fasteners for three layered metal composite parts consisting of aluminium foil, brazing paste and copper foil layers. The investigation aims to examine the mechanical integrity of the metallurgically bonded aluminium/copper foils of 100 micron thickness manufactured in a disc shape. A cylindrical fastener set at an elevated temperature of 100 °C is fitted in the middle of the disc which results in a steady-state thermal distribution. Radial and shear stresses are computed using finite element method which shows that non-zero shear stresses developed by the copper layer inhibit the axial slippage of the fastener and thereby establishing the suitability of rivet joints for CMFM parts.

Perturbation of baseline thermal stress in the Mound 9516 Shipping Package primary containment vessel

International Nuclear Information System (INIS)

Sansalone, K.H.F.

1995-01-01

Full-capacity loading of heat sources into the Mound 9516 Shipping Package primary containment vessel (PCV) results in temperature gradients which are symmetric, due to the axisymmetry of the package design. Concern over the change in thermal gradients (and therefore, stress) in the PCV due to sub-capacity loading led to the analytical examination of this phenomenon. The PCVs are cylindrical in shape and are loaded into the package such that they and all containment components are concentrically arranged along a common longitudinal axis. If the design full-capacity loading of the PCVs in this package assumes the axisymmetric (or more precisely, cyclicly symmetric) arrangement of its heat-producing contents, then sub-capacity loading implies that in many cases, the load arrangement could be asymmetric with respect to the longitudinal axis. It is then feasible that the departure from heat load axisymmetry could perturb the nominal thermal gradients so that thermally-induced stress within the PCV might increase to levels deemed unacceptable. This study applies Finite Element analysis (FEA) to the problem and demonstrates that no such unacceptable thermal stress increase occurs in the PCV material due to the asymmetric arrangement of contents. copyright 1995 American Institute of Physics

Thermal modeling and design of electronic systems and devices

International Nuclear Information System (INIS)

Wirtz, R.A.; Lehmann, G.L.

1990-01-01

The thermal control electronic devices, particularly those in complex systems with high heat flux density, continues to be of interest to engineers involved in system cooling design and analysis. This volume contains papers presented at the 1990 ASME Winter Annual Meeting in two K-16 sponsored sessions: Empirical Modeling of Heat Transfer in Complex Electronic Systems and Design and Modeling of Heat Transfer Devices in High-Density Electronics. The first group deals with understanding the heat transfer processes in these complex systems. The second group focuses on the use of analysis techniques and empirically determined data in predicting device and system operating performance

Feeding sustains photosynthetic quantum yield of a scleractinian coral during thermal stress.

Science.gov (United States)

Borell, Esther M; Bischof, Kai

2008-10-01

Thermal resistance of the coral-zooxanthellae symbiosis has been associated with chronic photoinhibition, increased antioxidant activity and protein repair involving high demands of nitrogen and energy. While the relative importance of heterotrophy as a source of nutrients and energy for cnidarian hosts, and as a means of nitrogen acquisition for their zooxanthellae, is well documented, the effect of feeding on the thermal sensitivity of the symbiotic association has been so far overlooked. Here we examine the effect of zooplankton feeding versus starvation on the bleaching susceptibility and photosynthetic activity of photosystem II (PSII) of zooxanthellae in the scleractinian coral Stylophora pistillata in response to thermal stress (daily temperature rises of 2-3 degrees C) over 10 days, employing pulse-amplitude-modulated chlorophyll fluorometry. Fed and starved corals displayed a decrease in daily maximum potential quantum yield (F (v)/F (m)) of PSII, effective quantum yield (F/F (m)') and relative electron transport rates over the course of 10 days. However after 10 days of exposure to elevated temperature, F (v)/F (m) of fed corals was still 50-70% higher than F (v)/F (m) of starved corals. Starved corals showed strong signs of chronic photoinhibition, which was reflected in a significant decline in nocturnal recovery rates of PSII relative to fed corals. This was paralleled by the progressive inability to dissipate excess excitation energy via non-photochemical quenching (NPQ). After 10 days, NPQ of starved corals had decreased by about 80% relative to fed corals. Feeding treatment had no significant effect on chlorophyll a and c (2) concentrations and zooxanthellae densities, but the mitotic indices were significantly lower in starved than in fed corals. Collectively the results indicate that exogenous food may reduce the photophysiological damage of zooxanthellae that typically leads to bleaching and could therefore play an important role in mediating the

Hot electron formation in thermal barrier region of tandem mirror GAMMA 10

International Nuclear Information System (INIS)

Katanuma, I.; Kiwamoto, Y.; Sawada, K.; Miyoshi, S.

1987-01-01

We have studied the hot electron build-up by the second harmonic electron cyclotron resonance heating in the thermal barrier region of tandem mirror GAMMA 10 by using a Fokker-Planck code with self-consistent potential profile taken into account. We have found two phases in the evolution of hot electron population and the potential profile. In the first phase where the RF diffusion is dominant quick increase of the hot electron density and that of the mean energy are observed. No further increase in the mean energy is observed thereafter. The potential is the deepest during the first phase. The second phase starts in the mean-free-time of the pitch angle scattering of hot electrons on cold electrons and ions. In this phase the hot electron population increases in the rate of the pitch angle scattering. The potential dip shallows due to the accumulation of pitch angle scattered passing ions. This observation indicates the necessity of the ion pumping for maintaining the negative potential at the thermal barrier. (author)

Transient thermal stresses in circular cylinder under intermittently sudden heat generation

International Nuclear Information System (INIS)

Sugano, Y.; Saito, K.; Takeuti, Y.

1975-01-01

The thermal stresses associated with the transient temperature distribution arising in a circular cylinder under intermittently changing sudden heat generation over a finite band and with heat loss to a surrounding medium on the remainder of the cylinder surface are exactly analysed. For the first time the temperature field in a circular cylinder under sudden heat generation over a finite band of the cylinder surface is determined by combined use of Fourier cosine, Laplace transforms in axial position and time, respectively. Secondly it is assumed that the temperature fields in a circular cylinder subjected to heat generation Qsub(i) (i=0, 1, 2, ...) independently over a finite band are given by T 0 (r,z,t), T 1 (r,z,t), T 2 (r,z,t),... respectively. Tsub(i)(r,z,t) indicates the temperature field before the i-th heat generation Qsub(i). The thermal stresses associated with the temperature field described above are analysed by using the Hoyle stress functions. Numerical calculations are carried out for the extensive case of the ratio of the heat-generating length to the diameter of cylinder. It is found that the time in which the maximum stresses occur on the cylinder surface does not depend on the heat-generating length-to-diameter ratio

First principles calculations of structural, electronic and thermal ...

Indian Academy of Sciences (India)

Home; Journals; Bulletin of Materials Science; Volume 37; Issue 5. First principles calculations of structural, electronic and thermal properties of lead chalcogenides PbS, PbSe and PbTe compounds. N Boukhris H Meradji S Amara Korba S Drablia S Ghemid F El Haj Hassan. Volume 37 Issue 5 August 2014 pp 1159-1166 ...

Cemented carbide cutting tool: Laser processing and thermal stress analysis

Energy Technology Data Exchange (ETDEWEB)

Yilbas, B.S. [Mechanical Engineering Department, KFUPM, Box 1913, Dhahran 31261 (Saudi Arabia)]. E-mail: bsyilbas@kfupm.edu.sa; Arif, A.F.M. [Mechanical Engineering Department, KFUPM, Box 1913, Dhahran 31261 (Saudi Arabia); Karatas, C. [Engineering Faculty, Hacettepe University, Ankara (Turkey); Ahsan, M. [Mechanical Engineering Department, KFUPM, Box 1913, Dhahran 31261 (Saudi Arabia)

2007-04-15

Laser treatment of cemented carbide tool surface consisting of W, C, TiC, TaC is examined and thermal stress developed due to temperature gradients in the laser treated region is predicted numerically. Temperature rise in the substrate material is computed numerically using the Fourier heating model. Experiment is carried out to treat the tool surfaces using a CO{sub 2} laser while SEM, XRD and EDS are carried out for morphological and structural characterization of the treated surface. Laser parameters were selected include the laser output power, duty cycle, assisting gas pressure, scanning speed, and nominal focus setting of the focusing lens. It is found that temperature gradient attains significantly high values below the surface particularly for titanium and tantalum carbides, which in turn, results in high thermal stress generation in this region. SEM examination of laser treated surface and its cross section reveals that crack initiation below the surface occurs and crack extends over the depth of the laser treated region.

Simulasi Thermal Stress Pada Tube Superheater Package Boiler

OpenAIRE

Hamdani

2013-01-01

This project investigates the thermal stress behavior and the mechanisms of superheater tube failure with experimental method and numerical analysis. First of all the procedures for failure analysis were applied to determine the root cause of them. A visual assessment of boiler critical pressure parts was carried out, and then the failed tube is examined by nondestructive evaluation. For the numerical domain, initially the elastic solution for a superheater tube subjected to an internal press...

Effect of the Modification of the Start-Up Sequence on the Thermal Stresses for a Microgas Turbine

Directory of Open Access Journals (Sweden)

Oscar Tenango-Pirin

2016-01-01

Full Text Available Microgas turbines (MGT are an alternative for small-scale energy production; however, their small size becomes a drawback since it enhances the heat transfer among their components. Moreover, heat transfer drives to temperature gradients which become higher during transient cycles like start-up. The influence of different start-up curves on temperature and thermal stresses of a microgas turbine was investigated. Stationary and rotational blades of the turbine were numerically simulated using CFD and FEM commercial codes. Conjugated heat transfer cases were solved for obtaining heat transfer from fluid toward the blades. Changes of temperature gradients within the blades during the start-ups were calculated under transient state with boundary conditions according to each curve to assess accurate thermal stresses calculations. Results showed that the modification of the start-up curves had an impact on the thermal stresses levels and on the time when highest stresses appeared on each component. Furthermore, zones highly stressed were located near the constraints of blades where thermal strains are restricted. It was also found that the curve that had a warming period at the beginning of the start-up allowed reducing the peaks of stresses making it more feasible and safer for the turbine start-up operation.

Thermal expansion model for multiphase electronic packaging materials

International Nuclear Information System (INIS)

Allred, B.E.; Warren, W.E.

1991-01-01

Control of thermal expansion is often necessary in the design and selection of electronic packages. In some instances, it is desirable to have a coefficient of thermal expansion intermediate between values readily attainable with single or two phase materials. The addition of a third phase in the form of fillers, whiskers, or fibers can be used to attain intermediate expansions. To help design the thermal expansion of multiphase materials for specific applications, a closed form model has been developed that accurately predicts the effective elastic properties of isotropic filled materials and transversely isotropic lamina. Properties of filled matrix materials are used as inputs to the lamina model to obtain the composite elastic properties as a function of the volume fraction of each phase. Hybrid composites with two or more fiber types are easily handled with this model. This paper reports that results for glass, quartz, and Kevlar fibers with beta-eucryptite filled polymer matrices show good agreement with experimental results for X, Y, and Z thermal expansion coefficients

Laser-induced cracks in ice due to temperature gradient and thermal stress

Science.gov (United States)

Yang, Song; Yang, Ying-Ying; Zhang, Jing-Yuan; Zhang, Zhi-Yan; Zhang, Ling; Lin, Xue-Chun

2018-06-01

This work presents the experimental and theoretical investigations on the mechanism of laser-induce cracks in ice. The laser-induced thermal gradient would generate significant thermal stress and lead to the cracking without thermal melting in the ice. The crack density induced by a pulsed laser in the ice critically depends on the laser scanning speed and the size of the laser spot on the surface, which determines the laser power density on the surface. A maximum of 16 cracks within an area of 17 cm × 10 cm can be generated when the laser scanning speed is at 10 mm/s and the focal point of the laser is right on the surface of the ice with a laser intensity of ∼4.6 × 107 W/cm2. By comparing the infrared images of the ice generated at various experimental conditions, it was found that a larger temperature gradient would result in more laser-induced cracks, while there is no visible melting of the ice by the laser beam. The data confirm that the laser-induced thermal stress is the main cause of the cracks created in the ice.

A study on thermal residual stresses in the matrix and fiber of a misoriented short fiber composite

International Nuclear Information System (INIS)

Son, Bong Jin; Lee, Joon Hyun

1994-01-01

An elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two special cases of fiber misorientation; two-dimensional in-plane and three-dimensional axisymmetric. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is unique in that it is able to account for interactions among fibers. The model is more general than past models and it is able to treat prior analyses of the simpler composite systems as extream cases. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for both in-plane and axisymmetric fiber misorientation. Fiber volume fraction, aspect ratio, and disturbution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stresses than fiber distrubution type for both in-plane and axisymmetric misorientation.

Metal-Organic-Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances.

Science.gov (United States)

Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui; King, Charles; Catalano, Massimo; Oh, Jun Kyun; Talib, Ansam J; Scholar, Ethan A; Verkhoturov, Stanislav V; Cagin, Tahir; Sokolov, Alexei V; Kim, Moon J; Matin, Kaiser; Narumanchi, Sreekant; Akbulut, Mustafa

2017-03-22

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix-which are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2-28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38-0.56 mm 2 K/W for a typical bond-line thickness of 30-50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

Heat Transfer and Thermal Stress Analysis of a Mandibular Molar Tooth Restored by Different Indirect Restorations Using a Three-Dimensional Finite Element Method.

Science.gov (United States)

Çelik Köycü, Berrak; İmirzalıoğlu, Pervin

2017-07-01

Daily consumption of food and drink creates rapid temperature changes in the oral cavity. Heat transfer and thermal stress caused by temperature changes in restored teeth may damage the hard and soft tissue components, resulting in restoration failure. This study evaluates the temperature distribution and related thermal stress on mandibular molar teeth restored via three indirect restorations using three-dimensional (3D) finite element analysis (FEA). A 3D finite element model was constructed of a mandibular first molar and included enamel, dentin, pulp, surrounding bone, and indirect class 2 restorations of type 2 dental gold alloy, ceramic, and composite resin. A transient thermal FEA was performed to investigate the temperature distribution and the resulting thermal stress after simulated temperature changes from 36°C to 4 or 60°C for a 2-second time period. The restoration models had similar temperature distributions at 2 seconds in both the thermal conditions. Compared with 60°C exposure, the 4°C condition resulted in thermal stress values of higher magnitudes. At 4ºC, the highest stress value observed was tensile stress (56 to 57 MPa), whereas at 60°C, the highest stress value observed was compressive stress (42 to 43 MPa). These stresses appeared at the cervical region of the lingual enamel. The thermal stress at the restoration surface and resin cement showed decreasing order of magnitude as follows: composite > gold > ceramic, in both thermal conditions. The properties of the restorative materials do not affect temperature distribution at 2 seconds in restored teeth. The pulpal temperature is below the threshold for vital pulp tissue (42ºC). Temperature changes generate maximum thermal stress at the cervical region of the enamel. With the highest thermal expansion coefficient, composite resin restorations exhibit higher stress patterns than ceramic and gold restorations. © 2015 by the American College of Prosthodontists.

Thermally activated low temperature creep and primary water stress corrosion cracking of NiCrFe alloys

International Nuclear Information System (INIS)

Hall, M.M. Jr.

1993-01-01

A phenomenological SCC-CGR model is developed based on an apriori assumption that the SCC-CGR is controlled by low temperature creep (LTC). This mode of low temperature time dependent deformation occurs at stress levels above the athermal flow stress by a dislocation glide mechanism that is thermally activated and may be environmentally assisted. The SCC-CGR model equations developed contain thermal activation parameters descriptive of the dislocation creep mechanism. Thermal activation parameters are obtained by fitting the CGR model to SCC-CGR data obtained on Alloy 600 and Alloy X-750. These SCC-CGR activation parameters are compared to LTC activation parameters obtained from stress relaxation tests. When the high concentration of hydrogen at the tip of an SCC crack is considered, the SCC-CGR activation energies and rate sensitivities are shown to be quantitatively consistent with hydrogen reducing the activation energy and increasing the strain rate sensitivity in LTC stress relaxation tests. Stress dependence of SCC-CGR activation energy consistent with that found for the LTC activation energy. Comparisons between temperature dependence of the SCC-CGR stress sensitivity and LTC stress sensitivity provide a basis for speculation on effects of hydrogen and solute carbon on SCC crack growth rates

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2013-01-01

Full Text Available The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.

Temperature-time distribution and thermal stresses on the RTG fins and shell during water cooling

Science.gov (United States)

Turner, R. H.

1983-01-01

Radioisotope thermoelectric generator (RTG) packages designed for space missions generally do not require active cooling. However, the heat they generate cannot remain inside of the launch vehicle bay and requires active removal. Therefore, before the Shuttle bay door is closed, the RTG coolant tubes attached to the heat rejection fins must be filled with water, which will circulate and remove most of the heat from the cargo bay. There is concern that charging a system at initial temperature around 200 C with water at 24 C can cause unacceptable thermal stresses in the RTG shell and fins. A computer model is developed to estimate the transient temperature distribution resulting from such charging. The thermal stresses resulting from the temperature gradients do not exceed the elastic deformation limit for the material. Since the simplified mathematical model for thermal stresses tends to overestimate stresses, it is concluded that the RTG can be cooled by introducing water at 24 C to the initially hot fin coolant tubes while the RTG is in the Shuttle cargo bay.

Ion Thermalization and Electron Heating across Quasi-Perpendicular Shocks Observed by the MMS Mission

Science.gov (United States)

Chen, L. J.; Wilson, L. B., III; Wang, S.; Bessho, N.; Figueroa-Vinas, A.; Lai, H.; Russell, C. T.; Schwartz, S. J.; Hesse, M.; Moore, T. E.; Burch, J.; Gershman, D. J.; Giles, B. L.; Torbert, R. B.; Ergun, R.; Dorelli, J.; Strangeway, R. J.; Paterson, W. R.; Lavraud, B.; Khotyaintsev, Y. V.

2017-12-01

Collisionless shocks often involve intense plasma heating in space and astrophysical systems. Despite decades of research, a number of key questions concerning electron and ion heating across collisionless shocks remain unanswered. We `image' 20 supercritical quasi-perpendicular bow shocks encountered by the Magnetospheric Multiscale (MMS) spacecraft with electron and ion distribution functions to address how ions are thermalized and how electrons are heated. The continuous burst measurements of 3D plasma distribution functions from MMS reveal that the primary thermalization phase of ions occurs concurrently with the main temperature increase of electrons as well as large-amplitude wave fluctuations. Approaching the shock from upstream, the ion temperature (Ti) increases due to the reflected ions joining the incoming solar wind population, as recognized by prior studies, and the increase of Ti precedes that of the electrons. Thermalization in the form of merging between the decelerated solar wind ions and the reflected component often results in a decrease in Ti. In most cases, the Ti decrease is followed by a gradual increase further downstream. Anisotropic, energy-dependent, and/or nongyrotropic electron energization are observed in association with large electric field fluctuations in the main electron temperature (Te) gradient, motivating a renewed scrutiny of the effects from the electrostatic cross-shock potential and wave fluctuations on electron heating. Particle-in-cell (PIC) simulations are carried out to assist interpretations of the MMS observations. We assess the roles of instabilities and the cross-shock potential in thermalizing ions and heating electrons based on the MMS measurements and PIC simulation results. Challenges will be posted for future computational studies and laboratory experiments on collisionless shocks.

High electron thermal conductivity of chiral carbon nanotubes

International Nuclear Information System (INIS)

Mensah, S.Y.; Allotey, F.K.A.; Nkrumah, George; Mensah, N.G.

2003-11-01

Solving the Boltzmann kinetic equation with energy dispersion relation obtained in the tight binding approximation, the carrier thermal conductivity κ e of a chiral carbon nanotube (CCNT) was determined. The dependence of κ e on temperature T, chiral geometric angle φ h and overlap integrals Δ z and Δ s were obtained. The results were numerically analysed. Unusually high values of κ e were observed suggesting that ne is nontrivial in the calculation of the thermal conductivity κ of CCNT. More interestingly we noted also that at 104 K and for Δ z and Δ s values of 0.020 eV and 0.0150 eV respectively the κ e value is about 41000 W/mK as reported for a 99.9% pure 12 C crystal. We predict that the electron thermal conductivity of CCNT should exceed 200,000 W/mK at ∼ 80 K. (author)

Thermal shock fracture of graphite armor plate under the heat load of plasma disruption

International Nuclear Information System (INIS)

Horie, Tomoyoshi; Seki, Masahiro; Ohmori, Junji

1989-01-01

Experiments on the thermal shock brittle fracture of graphite plates were performed. Thermal loading which simulated a plasma disruption was produced by an electron beam facility. Pre-cracks produced on the surface propagated to the inside of the specimen even if the thermal stress on the surface was compressive. Two mechanisms are possible to produce tensile stress around the crack tip under thermal shock conditions. Temperature, thermal stress, and the stress intensity factor for the specimen were analyzed based on the finite element method for various heating conditions. The trend of experimental results under the asymmetric heating agrees qualitatively with the analytical results. This phenomenon is important for the design of plasma facing components made of graphite. Establishment of a lifetime prediction procedure including fatigue, fatigue crack growth, and brittle fracture is needed for graphite armors. (orig.)

Phenomena of non-thermal electrons from the X-ray imaging crystal spectrometer on J-TEXT tokamak

International Nuclear Information System (INIS)

Yan, W.; Chen, Z.Y.; Jin, W.; Huang, D.W.; Lee, S.G.; Shi, Y.J.; Tong, R.H.; Wang, S.Y.; Wei, Y.N.; Ma, T.K.; Zhuang, G.

2016-01-01

Highlights: • Some lines from X-ray imaging crystal spectrometer (XICS) can be enhanced by non-thermal electrons, such as q, r satellite lines and z lines. • Analyze the non-thermal phenomena can reduce the error of electron temperature deduced from the intensity ratio of different lines of the He-like argon spectra from XICS. • XICS can be a tool to measure the non-thermal phenomena from these enhanced lines. - Abstract: A high spectra resolution X-ray imaging crystal spectrometer has been implemented on J-TEXT Tokamak for the measurements of K_α spectra of helium-like argon and its satellite lines. The wavelength range of K_α spectra of helium-like argon is from 3.9494 Å to 3.9944 Å that includes the resonance line w, intercombination lines x and y, forbidden line z and numerous satellite lines, referenced using standard Gabriel notation. In low-density discharge, the intensity of q, r satellite lines and z lines can be significantly enhanced by non-thermal electrons. Non-thermal electrons are produced due to the low plasma density. The high hard X-ray flux from NaI detector and significant downshift electron cyclotron emissions from energetic runaway electrons also indicated that there is a large population of runaway electrons in the low-density discharge. The non-thermal part of electrons can affect the excitation/transition equilibrium or ionization/recombination equilibrium. The q line is mainly produced by inner-shell excitation of lithium-like argon, and the r line is partially produced by inner-shell excitation of lithium-like argon and dielectronic recombination of helium-like argon.

Phenomena of non-thermal electrons from the X-ray imaging crystal spectrometer on J-TEXT tokamak

Energy Technology Data Exchange (ETDEWEB)

Yan, W. [State Key Laboratory of Advanced Electromagnetic Engineering and Technology, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan (China); Chen, Z.Y., E-mail: zychen@hust.edu.cn [State Key Laboratory of Advanced Electromagnetic Engineering and Technology, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan (China); Jin, W. [Center of Interface Dynamics for Sustainability, China Academy of Engineering Physics, Chengdu 610200, Sichuan (China); Huang, D.W. [State Key Laboratory of Advanced Electromagnetic Engineering and Technology, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan (China); Lee, S.G.; Shi, Y.J. [National Fusion Research Institute, Daejeon 305-333 (Korea, Republic of); Tong, R.H.; Wang, S.Y.; Wei, Y.N.; Ma, T.K.; Zhuang, G. [State Key Laboratory of Advanced Electromagnetic Engineering and Technology, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan (China)

2016-11-01

Highlights: • Some lines from X-ray imaging crystal spectrometer (XICS) can be enhanced by non-thermal electrons, such as q, r satellite lines and z lines. • Analyze the non-thermal phenomena can reduce the error of electron temperature deduced from the intensity ratio of different lines of the He-like argon spectra from XICS. • XICS can be a tool to measure the non-thermal phenomena from these enhanced lines. - Abstract: A high spectra resolution X-ray imaging crystal spectrometer has been implemented on J-TEXT Tokamak for the measurements of K{sub α} spectra of helium-like argon and its satellite lines. The wavelength range of K{sub α} spectra of helium-like argon is from 3.9494 Å to 3.9944 Å that includes the resonance line w, intercombination lines x and y, forbidden line z and numerous satellite lines, referenced using standard Gabriel notation. In low-density discharge, the intensity of q, r satellite lines and z lines can be significantly enhanced by non-thermal electrons. Non-thermal electrons are produced due to the low plasma density. The high hard X-ray flux from NaI detector and significant downshift electron cyclotron emissions from energetic runaway electrons also indicated that there is a large population of runaway electrons in the low-density discharge. The non-thermal part of electrons can affect the excitation/transition equilibrium or ionization/recombination equilibrium. The q line is mainly produced by inner-shell excitation of lithium-like argon, and the r line is partially produced by inner-shell excitation of lithium-like argon and dielectronic recombination of helium-like argon.

Study by X-ray diffraction and mechanical analysis of the residual stress generation during thermal spraying

International Nuclear Information System (INIS)

Pina, J.; Dias, A.; Lebrun, J.L.

2003-01-01

Thermally sprayed coatings are formed by the deposition of molten or partially molten particles, propelled onto a substrate where they impact, spread and solidify rapidly. Residual stresses are expected within the sprayed deposit as a consequence of the release of thermal and kinetic energies. A wide range of materials and two spraying techniques are considered in this study, namely atmospheric plasma spraying (APS) and high-velocity oxygen fuel. Stresses were determined by the X-ray diffraction (XRD) method. The results were compared with those calculated by mechanical analysis of stress relief in coatings detached from the substrate. Comparison of the results for adherent and free-standing coatings shows that the residual stress state can be resolved in terms of the components suggested by models that propose two stages of stress generation: quenching stresses and secondary-cooling stresses. The in-depth distribution of residual stresses, through the coating thickness, is discussed in terms of the nature of the coating system

Development of residual thermal stress-relieving structure of CFC monoblock target for JT-60SA divertor

Energy Technology Data Exchange (ETDEWEB)

Tsuru, Daigo, E-mail: tsuru.daigo@jaea.go.jp; Sakurai, Shinji; Nakamura, Shigetoshi; Ozaki, Hidetsugu; Seki, Yohji; Yokoyama, Kenji; Suzuki, Satoshi

2015-10-15

Highlights: • We carried out numerical simulations on residual thermal stress of targets for the JT-60SA divertor. • We developed three measures to reduce residual thermal stress. • We proposed two structures of CFC monoblock target for the JT-60SA divertor. • We confirmed the effectiveness of the structure by infrared thermography inspection and high heat flux test. - Abstract: Carbon fibre-reinforced carbon composite (CFC) monoblock target for JT-60SA divertor is under development towards the mass-production. CFC monoblocks, WCu interlayers and a CuCrZr cooling tube at the centre of the monoblocks were bonded by vacuum brazing in a high temperature, to a target. If residual thermal stress due to difference of thermal expansions between CFC and CuCrZr exceeds the maximum allowable stress of the CFC after the bonding, cracks are generated in the CFC monoblock and heat removal capacity of the target degrades. In this paper, new structures of the targets were proposed, to reduce residual thermal stress and to mitigate the degradation of heat removal capacity of the targets. Some measures, including slitting of the CFC monoblock aside of the cooling tube, replacement of the interlayer material and shifting the position of the cooling tube, were implemented. The effectiveness of the measures was evaluated by numerical simulations. Target mock-ups with the proposed structures were manufactured. Infrared thermography inspection and high heat flux test were carried out on the mock-ups in order to evaluate the heat removal capacity.

Crop water-stress assessment using an airborne thermal scanner

Science.gov (United States)

Millard, J. P.; Jackson, R. D.; Reginato, R. J.; Idso, S. B.; Goettelman, R. C.

1978-01-01

An airborne thermal scanner was used to measure the temperature of a wheat crop canopy in Phoenix, Arizona. The results indicate that canopy temperatures acquired about an hour and a half past solar noon were well correlated with presunrise plant water tension, a parameter directly related to plant growth and development. Pseudo-colored thermal images reading directly in stress degree days, a unit indicative of crop irrigation needs and yield potential, were produced. The aircraft data showed significant within-field canopy temperature variability, indicating the superiority of the synoptic view provided by aircraft over localized ground measurements. The standard deviation between airborne and ground-acquired canopy temperatures was 2 C or less.

Theory of thermal conductivity in the disordered electron liquid

International Nuclear Information System (INIS)

Schwiete, G.; Finkel’stein, A. M.

2016-01-01

We study thermal conductivity in the disordered two-dimensional electron liquid in the presence of long-range Coulomb interactions. We describe a microscopic analysis of the problem using the partition function defined on the Keldysh contour as a starting point. We extend the renormalization group (RG) analysis developed for thermal transport in the disordered Fermi liquid and include scattering processes induced by the long-range Coulomb interaction in the sub-temperature energy range. For the thermal conductivity, unlike for the electrical conductivity, these scattering processes yield a logarithmic correction that may compete with the RG corrections. The interest in this correction arises from the fact that it violates the Wiedemann–Franz law. We checked that the sub-temperature correction to the thermal conductivity is not modified either by the inclusion of Fermi liquid interaction amplitudes or as a result of the RG flow. We therefore expect that the answer obtained for this correction is final. We use the theory to describe thermal transport on the metallic side of the metal–insulator transition in Si MOSFETs.

Theory of thermal conductivity in the disordered electron liquid

Energy Technology Data Exchange (ETDEWEB)

Schwiete, G., E-mail: schwiete@uni-mainz.de [Johannes Gutenberg Universität, Spin Phenomena Interdisciplinary Center (SPICE) and Institut für Physik (Germany); Finkel’stein, A. M. [Texas A& M University, Department of Physics and Astronomy (United States)

2016-03-15

We study thermal conductivity in the disordered two-dimensional electron liquid in the presence of long-range Coulomb interactions. We describe a microscopic analysis of the problem using the partition function defined on the Keldysh contour as a starting point. We extend the renormalization group (RG) analysis developed for thermal transport in the disordered Fermi liquid and include scattering processes induced by the long-range Coulomb interaction in the sub-temperature energy range. For the thermal conductivity, unlike for the electrical conductivity, these scattering processes yield a logarithmic correction that may compete with the RG corrections. The interest in this correction arises from the fact that it violates the Wiedemann–Franz law. We checked that the sub-temperature correction to the thermal conductivity is not modified either by the inclusion of Fermi liquid interaction amplitudes or as a result of the RG flow. We therefore expect that the answer obtained for this correction is final. We use the theory to describe thermal transport on the metallic side of the metal–insulator transition in Si MOSFETs.

Proposal on the mitigation methods of thermal stress near the sodium

International Nuclear Information System (INIS)

Ando, Masanori; Kasahara, Naoto

2003-09-01

A Reactor vessel of fast rector plants contains high temperature liquid sodium in its inside and its upper end is supported by a low temperature structures. Therefore, a significant temperature gradient will arise at the vessel wall near the sodium surface. For this reason, a large thermal stress will be generated around this part. To lower this stress and to protect the vessel, a number of methods have been applied the plants. Generally, these mitigation methods by protection equipments for thermal stress also have some problems such as, increase a mount of materials or to be complicate for control, hard to maintenance and so on. In this research, authors suggested another simple methods for thermal stress, and evaluated their effects using computer analysis. The results obtained in this research are as follows. Authors suggested one method, circulate high temperature gas around outside of the vessel and evaluated the effects of this method by analysis. In case of using this method, Sn (one of index values of design) value might be getting lower about 45%. Authors also suggested another method by setting up a heat transfer plate outside of the vessel and evaluated the effects of this method by analysis. Effects of this method depend on material of the plate. In case of using Carbon as material of plate, Sn value might be 27% lower and in case of using 12Cr steel as material of plate, Sn value might be 15% lower. Authors also suggested another method by changing material of the guard vessel to be the one which has good ability of heat transfer and evaluated the effects of this method by analysis. In case of changing material of guard vessel to 12Cr steel, Sn value might be lower about 12%. (author)

Investigations on the effect of creep stress on the thermal properties of metallic materials

International Nuclear Information System (INIS)

Radtke, U.; Crostack, H.A.; Winschuh, E.

1995-01-01

Using thermal wave analysis with front side infrared detection on sample material damaged by creep, one examines whether the creep stress has an effect on the thermal material properties and to what effect this can be used to estimate the remaining service life. (orig.) [de

Ion Streaming Instabilities in Pair Ion Plasma and Localized Structure with Non-Thermal Electrons

Science.gov (United States)

Nasir Khattak, M.; Mushtaq, A.; Qamar, A.

2015-12-01

Pair ion plasma with a fraction of non-thermal electrons is considered. We investigate the effects of the streaming motion of ions on linear and nonlinear properties of unmagnetized, collisionless plasma by using the fluid model. A dispersion relation is derived, and the growth rate of streaming instabilities with effect of streaming motion of ions and non-thermal electrons is calculated. A qausi-potential approach is adopted to study the characteristics of ion acoustic solitons. An energy integral equation involving Sagdeev potential is derived during this process. The presence of the streaming term in the energy integral equation affects the structure of the solitary waves significantly along with non-thermal electrons. Possible application of the work to the space and laboratory plasmas are highlighted.

Ion streaming instabilities in pair ion plasma and localized structure with non-thermal electrons

Energy Technology Data Exchange (ETDEWEB)

Khattak, M. Nasir; Qamar, A., E-mail: mnnasirphysics@gmail.com [Department of Physics, University of Peshawar (Pakistan); Mushtaq, A. [Department of Physics, Abdul Wali Khan University Mardan, National Center for Physics, Mardan (Pakistan)

2015-12-15

Pair ion plasma with a fraction of non-thermal electrons is considered. We investigate the effects of the streaming motion of ions on linear and nonlinear properties of unmagnetized, collisionless plasma by using the fluid model. A dispersion relation is derived, and the growth rate of streaming instabilities with effect of streaming motion of ions and non-thermal electrons is calculated. A quasi-potential approach is adopted to study the characteristics of ion acoustic solitons. An energy integral equation involving Sagdeev potential is derived during this process. The presence of the streaming term in the energy integral equation affects the structure of the solitary waves significantly along with non-thermal electrons. Possible application of the work to the space and laboratory plasmas are highlighted. (author)

Theoretical basis for a transient thermal elastic-plastic stress analysis of nuclear reactor fuel elements

International Nuclear Information System (INIS)

Hsu, T.R.; Bertels, A.W.M.; Banerjee, S.; Harrison, W.C.

1976-07-01

This report presents the theoretical basis for a transient thermal elastic-plastic stress analysis of a nuclear reactor fuel element subject to severe transient thermo-mechanical loading. A finite element formulation is used for both the non-linear stress analysis and thermal analysis. These two major components are linked together to form an integrated program capable of predicting fuel element transient behaviour in two dimensions. Specific case studies are presented to illustrate capabilities of the analysis. (author)

Quantifying Cyclic Thermal Stresses Due to Solar Exposure in Rock Fragments in Gale Crater, Mars

Science.gov (United States)

Hallet, B.; Mackenzie-Helnwein, P.; Sletten, R. S.

2017-12-01

Curiosity and earlier rovers on Mars have revealed in detail rocky landscapes with decaying outcrops, rubble, stone-littered regolith, and bedrock exposures that reflect the weathering processes operating on rock exposed to Mars' cold and hyperarid environment. Evidence from diverse sources points to the importance of thermal stresses driven by cyclic solar exposure in contributing to the mechanical weathering of exposed rock and generation of regolith in various settings on Earth [1,2,3], and even more so on extraterrestrial bodies where large, rapid cyclic temperature variations are frequent (e.g. Mars [4], as well as comets [5], asteroids [6] and other airless bodies [7]). To study these thermal stresses, we use a 3d finite element (FE) model constrained by ground-based surface temperature measurements from Curiosity's Environmental Monitoring Station (REMS). The numerical model couples radiation and conduction with elastic response to determine the temperature and stress fields in individual rocks on the surface of Mars based on rock size and thermo-mechanical properties. We provide specific quantitative results for boulder-size basalt rocks resting on the ground using a realistic thermal forcing that closely matches the REMS temperature observations, and related thermal inertia data. Moreover, we introduce analytical studies showing that these numerical results can readily be generalized. They are quite universal, informing us about thermal stresses due to cyclic solar exposure in general, for rock fragments of different sizes, lithologies, and fracture- thermal- and mechanical-properties. Using Earth-analogue studies to gain insight, we also consider how the shapes, fractures, and surface details of rock fragments imaged by Curiosity likely reflect the importance of rock breakdown due to thermal stresses relative to wind-driven rock erosion and other surface processes on Mars. References:[1] McFadden L et al. (2005) Geol. Soc.Am. Bull. 117(1-2): 161-173 [2

Qinshan phase II extension nuclear power project thermal stratification and fatigue stress analysis for pressurizer surge line

International Nuclear Information System (INIS)

Yu Xiaofei; Zhang Yixiong; Ai Honglei

2010-01-01

Thermal stratification of pressurizer surge line induced by the inside fluid brings on global bending moments, local thermal stresses, unexpected displacements and support loadings of the pipe system. In order to avoid a costly three-dimensional computation, a combined 1D/2D technique has been developed and implemented to analyze the thermal stratification and fatigue stress of pressurize surge line of QINSHAN Phase II Extension Nuclear Power Project in this paper, using the computer codes SYSTUS and ROCOCO. According to the mechanical analysis results of stratification, the maximum stress and cumulative usage factor, the loadings at connections of surge line to main pipe and RCP and the displacements of surge line at supports are obtained. (authors)

A prediction method of temperature distribution and thermal stress for the throttle turbine rotor and its application

Directory of Open Access Journals (Sweden)

Yang Yu

2017-01-01

Full Text Available In this paper, a prediction method of the temperature distribution for the thermal stress for the throttle-regulated steam turbine rotor is proposed. The rotor thermal stress curve can be calculated according to the preset power requirement, the operation mode and the predicted critical parameters. The results of the 660 MW throttle turbine rotor show that the operators are able to predict the operation results and to adjust the operation parameters in advance with the help of the inertial element method. Meanwhile, it can also raise the operation level, thus providing the technical guarantee for the thermal stress optimization control and the safety of the steam turbine rotor under the variable load operation.

X-ray diffraction study of thermally and stress-induced phase transformations in single crystalline Ni-Mn-Ga alloys

International Nuclear Information System (INIS)

Martynov, V.V.

1995-01-01

Using in-situ single crystal X-ray diffraction methods, thermally- and stress-induced crystal structure evolution was investigated in two Ni-Mn-Ga Heusler-type alloys. For the 51at.%Ni-24at.%Mn-25at.%Ga alloy it was found that application of external stress in a temperature range ∼20 C above the M s at first causes intensity changes of X-ray diffuse scattering peaks in β-phase. Further stressing results in stress-induced phase transformations and under the appropriate conditions three successive martensitic transformations (one is parent-to-martensite and two are martensite-to-martensite transformations) can be stress induced. Of these only the parent-to-martensite transformation can be thermally-induced. Two successive structural transformations (thermally-induced parent-to-martensite and stress-induced martensite-to-martensite transformations) were found in 52at.%Ni-25at.%Mn-23at.%Ga alloy. Crystal structure, lattice parameters, type of modulation, and the length of modulation period for all martensites were identified. (orig.)

Contrasting patterns of coral bleaching susceptibility in 2010 suggest an adaptive response to thermal stress.

Science.gov (United States)

Guest, James R; Baird, Andrew H; Maynard, Jeffrey A; Muttaqin, Efin; Edwards, Alasdair J; Campbell, Stuart J; Yewdall, Katie; Affendi, Yang Amri; Chou, Loke Ming

2012-01-01

Coral bleaching events vary in severity, however, to date, the hierarchy of susceptibility to bleaching among coral taxa has been consistent over a broad geographic range and among bleaching episodes. Here we examine the extent of spatial and temporal variation in thermal tolerance among scleractinian coral taxa and between locations during the 2010 thermally induced, large-scale bleaching event in South East Asia. Surveys to estimate the bleaching and mortality indices of coral genera were carried out at three locations with contrasting thermal and bleaching histories. Despite the magnitude of thermal stress being similar among locations in 2010, there was a remarkable contrast in the patterns of bleaching susceptibility. Comparisons of bleaching susceptibility within coral taxa and among locations revealed no significant differences between locations with similar thermal histories, but significant differences between locations with contrasting thermal histories (Friedman = 34.97; pBleaching was much less severe at locations that bleached during 1998, that had greater historical temperature variability and lower rates of warming. Remarkably, Acropora and Pocillopora, taxa that are typically highly susceptible, although among the most susceptible in Pulau Weh (Sumatra, Indonesia) where respectively, 94% and 87% of colonies died, were among the least susceptible in Singapore, where only 5% and 12% of colonies died. The pattern of susceptibility among coral genera documented here is unprecedented. A parsimonious explanation for these results is that coral populations that bleached during the last major warming event in 1998 have adapted and/or acclimatised to thermal stress. These data also lend support to the hypothesis that corals in regions subject to more variable temperature regimes are more resistant to thermal stress than those in less variable environments.

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications