SMT soldering handbook

National Research Council Canada - National Science Library

Strauss, Rudolf

1998-01-01

... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

Development of Nuclear Decontamination Technology Using Supercritical Fluid

Energy Technology Data Exchange (ETDEWEB)

Jung, Wonyoung; Park, Kwangheon; Park, Jihye; Lee, Donghee [Kyunghee Univ., Yongin (Korea, Republic of)

2014-05-15

Soil cleaning technologies that have been developed thus far increase treatment costs in contaminated soil recovery processes because they generate large amounts of secondary wastes. In this respect, this study is intended to develop soil decontamination methods using CO{sub 2}, which is a nontoxic, environmentally friendly substance, in order to fundamentally suppress the generation of secondary wastes from the decontamination process and to create high added values. In this study, to develop decontamination methods for uranium-contaminated soil using supercritical CO{sub 2}, a soil decontamination system using supercritical CO{sub 2} was constructed. In addition, the basic principle of supercritical CO{sub 2} decontamination using a TBP-HNO3 complex was explained. According to the results of the study, sea-sand samples having the same degree of contamination showed different results of decontamination according to the quantities of the TBP-HNO3 complex used as an extraction agent, which resulted in high extraction rates. Thus far, a most widely used method of extracting uranium has been the dissolving of uranium in acids. However, this method has the large adverse effect of generating strong acidic wastes that cannot be easily treated. On the other hand, supercritical CO{sub 2} requires critical conditions that are no more difficult to meet than those of other supercritical fluids, since its density can be changed from a very low state close to that of an ideal gas to a high state close to that of liquids. The critical gas conditions are a pressure of 71 bar and a temperature of 31 .deg. C, both of which are inexpensive to achieve. Moreover, CO{sub 2} is a solvent that is not harmful to the human body and few effects on environmental pollution. Therefore, nontoxic and environment friendly processes can be developed using supercritical CO{sub 2}. Supercritical CO{sub 2}'s advantages over prevailing methods suggest its potential for developing innovative

Development of Nuclear Decontamination Technology Using Supercritical Fluid

International Nuclear Information System (INIS)

Jung, Wonyoung; Park, Kwangheon; Park, Jihye; Lee, Donghee

2014-01-01

Soil cleaning technologies that have been developed thus far increase treatment costs in contaminated soil recovery processes because they generate large amounts of secondary wastes. In this respect, this study is intended to develop soil decontamination methods using CO 2 , which is a nontoxic, environmentally friendly substance, in order to fundamentally suppress the generation of secondary wastes from the decontamination process and to create high added values. In this study, to develop decontamination methods for uranium-contaminated soil using supercritical CO 2 , a soil decontamination system using supercritical CO 2 was constructed. In addition, the basic principle of supercritical CO 2 decontamination using a TBP-HNO3 complex was explained. According to the results of the study, sea-sand samples having the same degree of contamination showed different results of decontamination according to the quantities of the TBP-HNO3 complex used as an extraction agent, which resulted in high extraction rates. Thus far, a most widely used method of extracting uranium has been the dissolving of uranium in acids. However, this method has the large adverse effect of generating strong acidic wastes that cannot be easily treated. On the other hand, supercritical CO 2 requires critical conditions that are no more difficult to meet than those of other supercritical fluids, since its density can be changed from a very low state close to that of an ideal gas to a high state close to that of liquids. The critical gas conditions are a pressure of 71 bar and a temperature of 31 .deg. C, both of which are inexpensive to achieve. Moreover, CO 2 is a solvent that is not harmful to the human body and few effects on environmental pollution. Therefore, nontoxic and environment friendly processes can be developed using supercritical CO 2 . Supercritical CO 2 's advantages over prevailing methods suggest its potential for developing innovative decontamination methods, as demonstrated

Soldering in electronics assembly

CERN Document Server

Judd, Mike

2013-01-01

Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

Industrial applications and current trends in supercritical fluid technologies

Directory of Open Access Journals (Sweden)

Gamse Thomas

2005-01-01

Full Text Available Supercritical fluids have a great potential for wide fields of processes Although CO2 is still one of the most used supercritical gases, for special purposes propane or even fluorinated-chlorinated fluids have also been tested. The specific characteristics of supercritical fluids behaviour were analyzed such as for example the solubilities of different components and the phase equilibria between the solute and solvent. The application at industrial scale (decaffeinating of tea and coffee, hop extraction or removal of pesticides from rice, activity in supercritical extraction producing total extract from the raw material or different fractions by using the fractionated separation of beverages (rum, cognac, whisky, wine, beer cider, of citrus oils and of lipids (fish oils, tall oil were also discussed. The main interest is still for the extraction of natural raw materials producing food ingredients, nutraceuticals and phytopharmaceuticals but also cleaning purposes were tested such as the decontamination of soils the removal of residual solvents from pharmaceutical products, the extraction of flame retardants from electronic waste or precision degreasing and cleaning of mechanical and electronic parts. An increasing interest obviously exists for impregnation purposes based on supercritical fluids behaviour, as well as for the dying of fibres and textiles. The production of fine particles in the micron and submicron range, mainly for pharmaceutical products is another important application of supercritical fluids. Completely new products can be produced which is not possible under normal conditions. Supercritical fluid technology has always had to compete with the widespread opinion that these processes are very expensive due to very high investment costs in comparison with classical low-pressure equipment. Thus the opinion is that these processes should be restricted to high-added value products. A cost estimation for different plant sizes and

Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

Science.gov (United States)

Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

2004-10-01

It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

Soldering Technology (6th) Proceedings of Annual Seminar, 17-18 February 1982.

Science.gov (United States)

1982-02-01

aspect oF health and safety during this presentation. We are hoping that the work conducted by Van 2 Der Molen in the USA will clarify this issue. FLUX... Der Molen , PROC. OF 5th ANNUAL SEMINAR SOLDERING TECHNOLOGY, Naval Weapons Centre, China Lake, California, February 1981. 3. Burge, Perks, O’Brien...developed a new and innovative solution, which we believe to be a significant advance in the state of the art. In this new design (Fig.l) a FM DER

Technology with Supercritical Fluid. Part 2. Applications

International Nuclear Information System (INIS)

Marongiu, B.; De Giorgi, M. R.; Porcedda, S.; Cadoni, E.

1998-01-01

The present article is based on a bibliographical analysis of the main applications of the supercritical fluid in various fields, as: extraction from solid matrices, division of liquid charges, chromatography HPLC with supercritical eluent, chemical and biochemical reactions in supercritical solvents etc [it

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Czech Academy of Sciences Publication Activity Database

Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

2012-01-01

Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

Influence of solder joint length to the mechanical aspect during the thermal stress analysis

Science.gov (United States)

Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

2017-09-01

Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

Generic supercritical water technology; Generic technology to shite no chorinkaisui riyo gijutsu

Energy Technology Data Exchange (ETDEWEB)

Arai, K; Ajiri, M; Inomata, H; Smith, R; Hakuta, Y [Tohoku University, Sendai (Japan). Faculty of Engineering; Yokoyama, C [Tohoku University, Sendai (Japan). The Institute forChemical Reaction Science; Chin, L [New Energy and Industrial Technology Development Organization, Tokyo, (Japan)

1997-02-01

This paper describes the measurement and analysis for clarifying solution structure of supercritical water and exhibition mechanism of solvent functions. It also describes the development of new processes using supercritical water as reaction solvent. The PVT measurements were conducted in the supercritical region using pure water and NaCl aqueous solution, to confirm the reduction of molar volume of the electrolyte solution. The hydration structure was examined in the supercritical aqueous solution by the molecular dynamic simulation. As a result, presence of hydrogen bond structure, where the contribution of two branching hydrogen bond can not be ignored, was suggested under the supercritical condition. Characteristics of supercritical aqueous solutions are analyzed through in-situ Raman and scattered X-ray spectral measurements. Moreover, this paper introduces developments of some processes in the supercritical water, such as decomposition of wasted polymers, recovery of chemical materials, reforming of heavy hydrocarbons by contact hydrogenation, and synthesis of fine powders of metal oxide by reaction crystallization.

A novel method for direct solder bump pull testing using lead-free solders

Science.gov (United States)

Turner, Gregory Alan

This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

Lead free solder mechanics and reliability

CERN Document Server

Pang, John Hock Lye

2012-01-01

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

Laser beam soldering of micro-optical components

Science.gov (United States)

Eberhardt, R.

2003-05-01

MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

Automation of experimental research of waveguide paths induction soldering

Science.gov (United States)

Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

2018-05-01

The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

A review on solder reflow and flux application for flip chip

Science.gov (United States)

Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

2017-09-01

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

FY1995 generic supercritical water technology; 1995 nendo generic technology to shite no chorinkai riyo gijutsu

Energy Technology Data Exchange (ETDEWEB)

NONE

1997-03-01

For the establishment of the basis of supercritical fluid technology, we perform elucidation of the specific feature of the supercritical fluid as a reaction media and development of some new process. In this study, we first studied the fluid structure of SCF through in-situ spectroscopy and MD simulation. As a result, significant hydrogen bonding amongst water molecules and a solvation structure around the solute were observed in the supercritical state. This fluid structure has new features different from that of high temperature steam or liquid water. We found that this is closely related to the difference of bulk properties of SCF and local one around the solute. On the basis of these fundamental findings and with the better understanding of the specific features of SCF as a reaction media, development of some new process had been conducted more efficiently and successfully. The processes being developed in this study include 1) waste biomass and plastic conversion to recover chemicals, 2) hydrogenation of heavy oil for desulphurization through partial oxidation 1 and 3) hydrothermal synthesis of metal oxide fine particles. (NEDO)

Development of gold based solder candidates for flip chip assembly

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

Spontaneous soldering

International Nuclear Information System (INIS)

Percacci, R.

1984-01-01

It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

Supercritical fluids processing: emerging opportunities

International Nuclear Information System (INIS)

Kovaly, K.A.

1985-01-01

This publication on the emerging opportunities of supercritical fluids processing reveals the latest research findings and development trends in this field. These findings and development trends are highlighted, and the results of applications of technology to the business of supercritical fluids are reported. Applications of supercritical fluids to chemical intermediates, environmental applications, chemical reactions, food and biochemistry processing, and fuels processing are discussed in some detail

Soldering of Nanotubes onto Microelectrodes

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

Directory of Open Access Journals (Sweden)

Mohd Nizam Ab. Rahman

2014-12-01

Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

Science.gov (United States)

Lee, Sang-Yeob; Lee, Jong-Hyuk

2010-12-01

The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

Spectroscopic investigation of oxidized solder surfaces

International Nuclear Information System (INIS)

Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

2011-01-01

Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

Status of advanced ultra-supercritical pulverised coal technology

Energy Technology Data Exchange (ETDEWEB)

NONE

2013-12-01

In pulverised coal combustion (PCC) power plant, increasing the maximum temperature of the steam cycle increases the electrical efficiency, which in turn lowers both coal consumption and flue gas emissions. However, the maximum steam temperature is limited by materials that can operate at these conditions for practical service lifetimes without failure. The EU, USA, Japan, India and China all have material research programmes aiming for the next generation of increased steam temperatures and efficiency, known as advanced ultra-supercritical (AUSC) or 700°C technology. This report reviews developments and status of these major material research programmes.

Solderability study of RABiTS-based YBCO coated conductors

International Nuclear Information System (INIS)

Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

2011-01-01

Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

Optimal parameters for laser tissue soldering

Science.gov (United States)

McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

1998-07-01

Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

Effect of gamma radiation on micromechanical hardness of lead-free solder joint

Energy Technology Data Exchange (ETDEWEB)

Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

2015-09-25

Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

Design and technology development of solid breeder blanket cooled by supercritical water in Japan

Science.gov (United States)

Enoeda, M.; Kosaku, Y.; Hatano, T.; Kuroda, T.; Miki, N.; Honma, T.; Akiba, M.; Konishi, S.; Nakamura, H.; Kawamura, Y.; Sato, S.; Furuya, K.; Asaoka, Y.; Okano, K.

2003-12-01

This paper presents results of conceptual design activities and associated R&D of a solid breeder blanket system for demonstration of power generation fusion reactors (DEMO blanket) cooled by supercritical water. The Fusion Council of Japan developed the long-term research and development programme of the blanket in 1999. To make the fusion DEMO reactor more attractive, a higher thermal efficiency of more than 40% was strongly recommended. To meet this requirement, the design of the DEMO fusion reactor was carried out. In conjunction with the reactor design, a new concept of a solid breeder blanket cooled by supercritical water was proposed and design and technology development of a solid breeder blanket cooled by supercritical water was performed. By thermo-mechanical analyses of the first wall, the tresca stress was evaluated to be 428 MPa, which clears the 3Sm value of F82H. By thermal and nuclear analyses of the breeder layers, it was shown that a net TBR of more than 1.05 can be achieved. By thermal analysis of the supercritical water power plant, it was shown that a thermal efficiency of more than 41% is achievable. The design work included design of the coolant flow pattern for blanket modules, module structure design, thermo-mechanical analysis and neutronics analysis of the blanket module, and analyses of the tritium inventory and permeation. Preliminary integration of the design of a solid breeder blanket cooled by supercritical water was achieved in this study. In parallel with the design activities, engineering R&D was conducted covering all necessary issues, such as development of structural materials, tritium breeding materials, and neutron multiplier materials; neutronics experiments and analyses; and development of the blanket module fabrication technology. Upon developing the fabrication technology for the first wall and box structure, a hot isostatic pressing bonded F82H first wall mock-up with embedded rectangular cooling channels was

Industrial applications and current trends in supercritical fluid technologies

OpenAIRE

Gamse Thomas

2005-01-01

Supercritical fluids have a great potential for wide fields of processes Although CO2 is still one of the most used supercritical gases, for special purposes propane or even fluorinated-chlorinated fluids have also been tested. The specific characteristics of supercritical fluids behaviour were analyzed such as for example the solubilities of different components and the phase equilibria between the solute and solvent. The application at industrial scale (decaffeinating of tea and coffee, hop...

Drying of supercritical carbon dioxide with membrane processes

NARCIS (Netherlands)

Lohaus, Theresa; Scholz, Marco; Koziara, Beata; Benes, Nieck Edwin; Wessling, Matthias

2015-01-01

In supercritical extraction processes regenerating the supercritical fluid represents the main cost constraint. Membrane technology has potential for cost efficient regeneration of water-loaded supercritical carbon dioxide. In this study we have designed membrane-based processes to dehydrate

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Directory of Open Access Journals (Sweden)

Saliza Azlina O.

2016-01-01

Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

Photothermal effects of laser tissue soldering

International Nuclear Information System (INIS)

McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

1999-01-01

Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

Science.gov (United States)

Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

2018-03-01

In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Directory of Open Access Journals (Sweden)

Roman Koleňák

2018-04-01

Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

Comparative shear tests of some low temperature lead-free solder pastes

Science.gov (United States)

Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

2016-12-01

The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

Supercritical fluid technology in materials science and engineering: syntheses, properties, and applications

National Research Council Canada - National Science Library

Sun, Ya-Ping

2002-01-01

... and polymer preparations and as alternative solvent systems for materials processing. In fact, materials-related applications have emerged as a new frontier in the development of supercritical fluid technology. I hope that this book will be a timely contribution to this emerging research field by serving at least two purposes. One is to provide intere...

Interface between Sn-Sb-Cu solder and copper substrate

Energy Technology Data Exchange (ETDEWEB)

Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

2011-07-15

Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

Birch Bark Dry Extract by Supercritical Fluid Technology: Extract Characterisation and Use for Stabilisation of Semisolid Systems

Directory of Open Access Journals (Sweden)

Markus Armbruster

2017-03-01

Full Text Available Triterpene compounds like betulin, betulinic acid, erythrodiol, oleanolic acid and lupeol are known for many pharmacological effects. All these substances are found in the outer bark of birch. Apart from its pharmacological effects, birch bark extract can be used to stabilise semisolid systems. Normally, birch bark extract is produced for this purpose by extraction with organic solvents. Employing supercritical fluid technology, our aim was to develop a birch bark dry extract suitable for stabilisation of lipophilic gels with improved properties while avoiding the use of toxic solvents. With supercritical carbon dioxide, three different particle formation methods from supercritical solutions have been tested. First, particle deposition was performed from a supercritical solution in an expansion chamber. Second, the Rapid Expansion of Supercritical Solutions (RESS method was used for particle generation. Third, a modified RESS-procedure, forming the particles directly into the thereby gelated liquid, was developed. All three methods gave yields from 1% to 5.8%, depending on the techniques employed. The triterpene composition of the three extracts was comparable: all three gave more stable oleogels compared to the use of an extract obtained by organic solvent extraction. Characterizing the rheological behaviour of these gels, a faster gelling effect was seen together with a lower concentration of the extract required for the gel formation with the supercritical fluid (SCF-extracts. This confirms the superiority of the supercritical fluid produced extracts with regard to the oleogel forming properties.

An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

Energy Technology Data Exchange (ETDEWEB)

Vianco, P.T.

1998-10-15

A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

Economic Operation of Supercritical CO2 Refrigeration Energy Storage Technology

Science.gov (United States)

Hay, Ryan

With increasing penetration of intermittent renewable energy resources, improved methods of energy storage are becoming a crucial stepping stone in the path toward a smarter, greener grid. SuperCritical Technologies is a company based in Bremerton, WA that is developing a storage technology that can operate entirely on waste heat, a resource that is otherwise dispelled into the environment. The following research models this storage technology in several electricity spot markets around the US to determine if it is economically viable. A modification to the storage dispatch scheme is then presented which allows the storage unit to increase its profit in real-time markets by taking advantage of extreme price fluctuations. Next, the technology is modeled in combination with an industrial load profile on two different utility rate schedules to determine potential cost savings. The forecast of facility load has a significant impact on savings from the storage dispatch, so an exploration into this relationship is then presented.

High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

DEFF Research Database (Denmark)

High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

Laser-activated protein solder for peripheral nerve repair

Science.gov (United States)

Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

1995-05-01

A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

Features of soldering of molybdenum a lols

International Nuclear Information System (INIS)

Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

1980-01-01

Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

The constitutive response of three solder materials

International Nuclear Information System (INIS)

Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

2012-01-01

Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Microstructure evolution and thermomechanical fatigue of solder materials

NARCIS (Netherlands)

Matin, M.A.

2005-01-01

The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

Science.gov (United States)

Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

2004-04-01

Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

Laser assisted soldering: microdroplet accumulation with a microjet device.

Science.gov (United States)

Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

1998-01-01

We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

Thermomechanical fatigue life prediction for several solders

Science.gov (United States)

Wen, Shengmin

Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

Soldering of copper-clad niobium--titanium superconductor composite

International Nuclear Information System (INIS)

Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

1977-04-01

When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

Evaluation on the characteristics of tin-silver-bismuth solder

Science.gov (United States)

Xia, Z.; Shi, Y.; Chen, Z.

2002-02-01

Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

Supercritical fluid analytical methods

International Nuclear Information System (INIS)

Smith, R.D.; Kalinoski, H.T.; Wright, B.W.; Udseth, H.R.

1988-01-01

Supercritical fluids are providing the basis for new and improved methods across a range of analytical technologies. New methods are being developed to allow the detection and measurement of compounds that are incompatible with conventional analytical methodologies. Characterization of process and effluent streams for synfuel plants requires instruments capable of detecting and measuring high-molecular-weight compounds, polar compounds, or other materials that are generally difficult to analyze. The purpose of this program is to develop and apply new supercritical fluid techniques for extraction, separation, and analysis. These new technologies will be applied to previously intractable synfuel process materials and to complex mixtures resulting from their interaction with environmental and biological systems

The constitutive response of three solder materials

Energy Technology Data Exchange (ETDEWEB)

Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

2012-05-25

Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Characterization of lead-free solders for electronic packaging

Science.gov (United States)

Ma, Hongtao

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

Enhancing power cycle efficiency for a supercritical Brayton cycle power system using tunable supercritical gas mixtures

Science.gov (United States)

Wright, Steven A.; Pickard, Paul S.; Vernon, Milton E.; Radel, Ross F.

2017-08-29

Various technologies pertaining to tuning composition of a fluid mixture in a supercritical Brayton cycle power generation system are described herein. Compounds, such as Alkanes, are selectively added or removed from an operating fluid of the supercritical Brayton cycle power generation system to cause the critical temperature of the fluid to move up or down, depending upon environmental conditions. As efficiency of the supercritical Brayton cycle power generation system is substantially optimized when heat is rejected near the critical temperature of the fluid, dynamically modifying the critical temperature of the fluid based upon sensed environmental conditions improves efficiency of such a system.

Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Energy Technology Data Exchange (ETDEWEB)

Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

2016-04-15

Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

Development status and application prospect of supercritical-pressure light water cooled reactor

International Nuclear Information System (INIS)

Li Manchang; Wang Mingli

2006-01-01

The Supercritical-pressure Light Water Cooled Reactor (SCWR) is selected by the Generation IV International Forum (GIF) as one of the six Generation IV nuclear systems that will be developed in the future, and it is an innovative design based on the existing technologies used in LWR and supercritical coal-fired plants. Technically, SCWR may be based on the design, construction and operation experiences in existing PWR and supercritical coal-fired plants, which means that there is no insolvable technology difficulties. Since PWR technology will be adopted in the near term and medium term projects in China, and considering the sustainable development of the technology, it is an inevitable choice to research and develop the nuclear system of supercritical light water cooled reactor. (authors)

High Density Thermal Energy Storage with Supercritical Fluids

Science.gov (United States)

Ganapathi, Gani B.; Wirz, Richard

2012-01-01

A novel approach to storing thermal energy with supercritical fluids is being investigated, which if successful, promises to transform the way thermal energy is captured and utilized. The use of supercritical fluids allows cost-affordable high-density storage with a combination of latent heat and sensible heat in the two-phase as well as the supercritical state. This technology will enhance penetration of several thermal power generation applications and high temperature water for commercial use if the overall cost of the technology can be demonstrated to be lower than the current state-of-the-art molten salt using sodium nitrate and potassium nitrate eutectic mixtures.

ENGINEERING BULLETIN: SUPERCRITICAL WATER OXIDATION

Science.gov (United States)

This engineering bulletin presents a description and status of supercritical water oxidation technology, a summary of recent performance tests, and the current applicability of this emerging technology. This information is provided to assist remedial project managers, contractors...

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Mechanical properties of Bi-In-Zn/ Cu solder joint system

International Nuclear Information System (INIS)

Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

2009-01-01

Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

Directory of Open Access Journals (Sweden)

Molnar A.

2017-06-01

Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

Science.gov (United States)

Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

2018-01-01

Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

Efforts to Develop a 300°C Solder

Energy Technology Data Exchange (ETDEWEB)

Norann, Randy A [Perma Works LLC

2015-01-25

This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

Strength of joints brazed with two-phase solders

International Nuclear Information System (INIS)

Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

1976-01-01

Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

Science.gov (United States)

Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

2011-01-01

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Nanotechnology and supercritical fluids | Hamidreza | Journal of ...

African Journals Online (AJOL)

Supercritical fluid (SCF) technology has become an important tool of materials processing in the last two decades. Supercritical CO2 and H2O are extensively being used in the preparation of a great variety of nanomaterials. The interest in the preparation and application of nanometer size materials is increasing since they ...

using Supercritical Fluid Extraction

African Journals Online (AJOL)

Methods: Supercritical CO2 extraction technology was adopted in this experiment to study the process of extraction of volatile oil from Polygonatum odoratum while gas chromatograph-mass spectrometer ..... Saponin rich fractions from.

Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

Science.gov (United States)

Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

2018-03-01

The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

Energy Technology Data Exchange (ETDEWEB)

Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

2013-06-01

The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

Fatigue and thermal fatigue of Pb-Sn solder joints

International Nuclear Information System (INIS)

Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

1987-01-01

This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

Particle Formation by Supercritical Fluid Extraction and Expansion Process

Directory of Open Access Journals (Sweden)

Sujuan Pan

2013-01-01

Full Text Available Supercritical fluid extraction and expansion (SFEE patented technology combines the advantages of both supercritical fluid extraction (SFE and rapid expansion of supercritical solution (RESS with on-line coupling, which makes the nanoparticle formation feasible directly from matrix such as Chinese herbal medicine. Supercritical fluid extraction is a green separation technology, which has been developed for decades and widely applied in traditional Chinese medicines or natural active components. In this paper, a SFEE patented instrument was firstly built up and controlled by LABVIEW work stations. Stearic acid was used to verify the SFEE process at optimized condition; via adjusting the preexpansion pressure and temperature one can get different sizes of particles. Furthermore, stearic acid was purified during the SFEE process with HPLC-ELSD detecting device; purity of stearic acid increased by 19%, and the device can purify stearic acid.

A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

Directory of Open Access Journals (Sweden)

Enrico Mick

2015-07-01

Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

Simultaneous micronization and purification of bioactive fraction by supercritical antisolvent technology

Directory of Open Access Journals (Sweden)

Stevanus Hiendrawan

2017-01-01

Full Text Available Simultaneous micronization and purification of DLBS3233 bioactive fraction, a combination of two Indonesian herbals Lagerstroemia speciosa and Cinnamomum burmannii has been successfully performed via supercritical anti-solvent (SAS technology. The objective of the present study was to investigate the effectiveness of SAS technology to micronize and reduce coumarin content of DLBS3233. The effects of four SAS process parameters, i.e. pressure, temperature, concentration and solution flow rate on particle formation were investigated. In SAS process, DLBS3233 was dissolved in dimethylformamide (DMF as the liquid solvent. The solution was then pumped through a nozzle into a chamber simultaneously with supercritical carbon dioxide (SC-CO2 which acts as the anti-solvent, resulting in DLBS3233 precipitation. Physicochemical properties of unprocessed DLBS3233 and SAS-processed DLBS3233 particles were analyzed using scanning electron microscopy (SEM and high pressure liquid chromatography (HPLC. Total polyphenol content (TPC was also analyzed.Particles with mean particle size ranging from 0.107±0.028 μm to 0.298±0.138 μm were obtained by varying the process parameters. SAS-processed DLBS3233 particles showed no coumarin content in all experiments studied in this work. Results of TPC analysis revealed no significant change in SAS-processed DLBS3233 particles compared to unprocessed DLBS3233. Nano-sized DLBS3233 particles with no coumarin content have been successfully produced using SAS process. This study demonstrates the ability of SAS for processing herbal medicine in single step process.

Nano-soldering to single atomic layer

Science.gov (United States)

Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

2011-10-11

A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Soldering formalism in noncommutative field theory: a brief note

International Nuclear Information System (INIS)

Ghosh, Subir

2004-01-01

In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

A new method for soldering particle-reinforced aluminum metal matrix composites

Energy Technology Data Exchange (ETDEWEB)

Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

2012-12-01

Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

A new method for soldering particle-reinforced aluminum metal matrix composites

International Nuclear Information System (INIS)

Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

2012-01-01

Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

Directory of Open Access Journals (Sweden)

Shoudong Gu

2016-06-01

Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

A flip chip process based on electroplated solder bumps

Science.gov (United States)

Salonen, J.; Salmi, J.

1994-01-01

Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

Thermal performance and efficiency of supercritical nuclear reactors

International Nuclear Information System (INIS)

Romney Duffey; Tracy Zhou; Hussam Khartabil

2009-01-01

The paper reviews the major advances and innovative aspects of the thermal performance of recent concepts for super-critical water-cooled nuclear reactors (SCWR). The concepts are based on the extensive experience in the thermal power industry with super and ultra-supercritical boilers and turbines. The challenges and goals of increased efficiency, reduced cost, enhanced safety and co-generation have been pursued over the last ten years, and have resulted both in viable concepts and a vibrant defined R and D effort. The supercritical concept has wide acceptance among industry, as it reflects standard engineering practices and current thermal plant technology that is being already deployed. The SCWR concept represents a continuous development of water-cooled reactor technology, which utilizes the best and latest advances made in the thermal power industry. (author)

Thermomechanical behavior of tin-rich (lead-free) solders

Science.gov (United States)

Sidhu, Rajen Singh

In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

Experimental study on the liquefaction of cellulose in supercritical ethanol

Science.gov (United States)

Peng, Jinxing; Liu, Xinyuan; Bao, Zhenbo

2018-03-01

Cellulose is the major composition of solid waste for producing biofuel; cellulose liquefaction is helpful for realizing biomass supercritical liquefaction process. This paper is taking supercritical ethanol as the medium, liquefied cellulose with the intermittence installation of high press cauldron. Experiments have studied technical condition and the technology parameter of cellulose liquefaction in supercritical ethanol, and the pyrolysis mechanism was analysed based on the pyrolysis product. Results show that cellulose can be liquefied, can get good effect through appropriate technology condition. Under not catalyst, highest liquefaction rate of cellulose can reach 73.5%. The composition of the pyrolysis product was determined by GC-MS.

Mechanical properties of soldered joints of niobium base alloys

International Nuclear Information System (INIS)

Grishin, V.L.

1980-01-01

Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

Supercritical Synthesis of Biodiesel

Directory of Open Access Journals (Sweden)

Michel Vaultier

2012-07-01

Full Text Available The synthesis of biodiesel fuel from lipids (vegetable oils and animal fats has gained in importance as a possible source of renewable non-fossil energy in an attempt to reduce our dependence on petroleum-based fuels. The catalytic processes commonly used for the production of biodiesel fuel present a series of limitations and drawbacks, among them the high energy consumption required for complex purification operations and undesirable side reactions. Supercritical fluid (SCF technologies offer an interesting alternative to conventional processes for preparing biodiesel. This review highlights the advances, advantages, drawbacks and new tendencies involved in the use of supercritical fluids (SCFs for biodiesel synthesis.

Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

Science.gov (United States)

2015-05-05

under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

Carotenoids Functionality, Sources, and Processing by Supercritical Technology: A Review

Directory of Open Access Journals (Sweden)

Natália Mezzomo

2016-01-01

Full Text Available Carotenoid is a group of pigments naturally present in vegetal raw materials that have biological properties. These pigments have been used mainly in food, pharmaceutical, and cosmetic industries. Currently, the industrial production is executed through chemical synthesis, but natural alternatives of carotenoid production/attainment are in development. The carotenoid extraction occurs generally with vegetal oil and organic solvents, but supercritical technology is an alternative technique to the recovery of these compounds, presenting many advantages when compared to conventional process. Brazil has an ample diversity of vegetal sources inadequately investigated and, then, a major development of optimization and validation of carotenoid production/attainment methods is necessary, so that the benefits of these pigments can be delivered to the consumer.

Characteristics of solder joints under fatigue loads using piezomechanical actuation

Science.gov (United States)

Shim, Dong-Jin; Spearing, S. Mark

2003-07-01

Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

Effect of Solder Flux Residues on Corrosion of Electronics

DEFF Research Database (Denmark)

Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

2009-01-01

Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

Directory of Open Access Journals (Sweden)

Nikolaj VIŠNIAKOV

2011-03-01

Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

Development of a soft-soldering system for aluminum

Science.gov (United States)

Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

1983-03-01

The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Directory of Open Access Journals (Sweden)

Fan Yang

2016-01-01

Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Physical properties of lead free solders in liquid and solid state

Energy Technology Data Exchange (ETDEWEB)

Mhiaoui, Souad

2007-04-17

The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

Science.gov (United States)

Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

2017-08-01

Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

National Research Council Canada - National Science Library

Reuse, Rolando

2005-01-01

.... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

Characteristics modeling for supercritical circulating fluidized bed boiler working in oxy-combustion technology

Directory of Open Access Journals (Sweden)

Balicki Adrian

2014-06-01

Full Text Available Among the technologies which allow to reduce greenhouse gas emission, mainly carbon dioxide, special attention deserves the idea of ‘zeroemission’ technology based on boilers working in oxy-combustion technology. In the paper the results of analyses of the influence of changing two quantities, namely oxygen share in oxidant produced in the air separation unit, and oxygen share in oxidant supplied to the furnace chamber on the selected characteristics of a steam boiler including the degree of exhaust gas recirculation, boiler efficiency and adiabatic flame temperature, was examined. Due to the possibility of the integration of boiler model with carbon dioxide capture, separation and storage installation, the subject of the analysis was also to determine composition of the flue gas at the outlet of a moisture condensation installation. Required calculations were made using a model of a supercritical circulating fluidized bed boiler working in oxy-combustion technology, which was built in a commercial software and in-house codes.

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Science.gov (United States)

Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

2006-10-01

Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

Tensile strength of two soldered alloys (Minalux and Verabond2

Directory of Open Access Journals (Sweden)

Mir Mohammad Rezaee S

2002-07-01

Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

Can supercritical oxidation of sewage sludge be an alternative for supercritical gasification?; Kan superkritische oxidatie van zuiveringsslib een alternatief zijn voor superkritische vergassing?

Energy Technology Data Exchange (ETDEWEB)

Rulkens, W. [Wageningen UR, Wageningen (Netherlands); Wentink, J. [Horizon Solutions, Leiden (Netherlands)

2013-05-15

In the context of the development of The Energy Factory a number of technologies has been identified that may be interesting to develop further. Two of these techniques relate to the conversion of sludge in supercritical water: supercritical gasification of sludge and supercritical oxidation of sludge [Dutch] In het kader van de ontwikkeling van De Energiefabriek is een aantal technologieen geidentificeerd die mogelijk interessant zijn om verder te ontwikkelen. Twee van deze technieken hebben betrekking op de conversie van slib in superkritisch water: superkritische slibvergassing en superkritische sliboxidatie.

Novel Supercritical Carbon Dioxide Power Cycle Utilizing Pressured Oxy-combustion in Conjunction with Cryogenic Compression

Energy Technology Data Exchange (ETDEWEB)

Brun, Klaus; McClung, Aaron; Davis, John

2014-03-31

The team of Southwest Research Institute® (SwRI) and Thar Energy LLC (Thar) applied technology engineering and economic analysis to evaluate two advanced oxy-combustion power cycles, the Cryogenic Pressurized Oxy-combustion Cycle (CPOC), and the Supercritical Oxy-combustion Cycle. This assessment evaluated the performance and economic cost of the two proposed cycles with carbon capture, and included a technology gap analysis of the proposed technologies to determine the technology readiness level of the cycle and the cycle components. The results of the engineering and economic analysis and the technology gap analysis were used to identify the next steps along the technology development roadmap for the selected cycle. The project objectives, as outlined in the FOA, were 90% CO{sub 2} removal at no more than a 35% increase in cost of electricity (COE) as compared to a Supercritical Pulverized Coal Plant without CO{sub 2} capture. The supercritical oxy-combustion power cycle with 99% carbon capture achieves a COE of $121/MWe. This revised COE represents a 21% reduction in cost as compared to supercritical steam with 90% carbon capture ($137/MWe). However, this represents a 49% increase in the COE over supercritical steam without carbon capture ($80.95/MWe), exceeding the 35% target. The supercritical oxy-combustion cycle with 99% carbon capture achieved a 37.9% HHV plant efficiency (39.3% LHV plant efficiency), when coupling a supercritical oxy-combustion thermal loop to an indirect supercritical CO{sub 2} (sCO{sub 2}) power block. In this configuration, the power block achieved 48% thermal efficiency for turbine inlet conditions of 650°C and 290 atm. Power block efficiencies near 60% are feasible with higher turbine inlet temperatures, however a design tradeoff to limit firing temperature to 650°C was made in order to use austenitic stainless steels for the high temperature pressure vessels and piping and to minimize the need for advanced turbomachinery features

Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

Energy Technology Data Exchange (ETDEWEB)

Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

1999-11-01

Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

Assessment of potential solder candidates for high temperature applications

DEFF Research Database (Denmark)

pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

Nano-soldering of magnetically aligned three-dimensional nanowire networks

International Nuclear Information System (INIS)

Gao Fan; Gu Zhiyong

2010-01-01

It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

International Nuclear Information System (INIS)

Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

1975-01-01

The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

Supercritical boiler material selection using fuzzy analytic network process

Directory of Open Access Journals (Sweden)

Saikat Ranjan Maity

2012-08-01

Full Text Available The recent development of world is being adversely affected by the scarcity of power and energy. To survive in the next generation, it is thus necessary to explore the non-conventional energy sources and efficiently consume the available sources. For efficient exploitation of the existing energy sources, a great scope lies in the use of Rankin cycle-based thermal power plants. Today, the gross efficiency of Rankin cycle-based thermal power plants is less than 28% which has been increased up to 40% with reheating and regenerative cycles. But, it can be further improved up to 47% by using supercritical power plant technology. Supercritical power plants use supercritical boilers which are able to withstand a very high temperature (650-720˚C and pressure (22.1 MPa while producing superheated steam. The thermal efficiency of a supercritical boiler greatly depends on the material of its different components. The supercritical boiler material should possess high creep rupture strength, high thermal conductivity, low thermal expansion, high specific heat and very high temperature withstandability. This paper considers a list of seven supercritical boiler materials whose performance is evaluated based on seven pivotal criteria. Given the intricacy and difficulty of this supercritical boiler material selection problem having interactions and interdependencies between different criteria, this paper applies fuzzy analytic network process to select the most appropriate material for a supercritical boiler. Rene 41 is the best supercritical boiler material, whereas, Haynes 230 is the worst preferred choice.

A Hodge dual for soldered bundles

International Nuclear Information System (INIS)

Lucas, Tiago Gribl; Pereira, J G

2009-01-01

In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

Characterization of the microstructure of tin-silver lead free solder

Energy Technology Data Exchange (ETDEWEB)

Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

2016-07-05

Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

Science.gov (United States)

Werden, Jesse

The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

Dye-enhanced protein solders and patches in laser-assisted tissue welding.

Science.gov (United States)

Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

1997-01-01

This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

Drinking Water Contamination Due To Lead-based Solder

Science.gov (United States)

Garcia, N.; Bartelt, E.; Cuff, K. E.

2004-12-01

The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

Science.gov (United States)

Buckley, John D. (Editor); Stein, Bland A. (Editor)

1986-01-01

A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

Horizon shells and BMS-like soldering transformations

Energy Technology Data Exchange (ETDEWEB)

Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

2016-03-07

We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

Study of silicon chip soldering in high-power transistor housing

Directory of Open Access Journals (Sweden)

Vasily S. Anosov

2017-09-01

We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

Science.gov (United States)

Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

2014-10-01

The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

Fiscal 1996 investigational research on the chemical process technology using supercritical fluids; 1996 nendo chorinkai ryutai wo riyoshita kagaku process gijutsu ni kansuru chosa kenkyu

Energy Technology Data Exchange (ETDEWEB)

NONE

1997-03-01

Importance was studied of making a research on the chemical process technology using the supercritical fluid. As for its effect on global warming, the amount of CO2 emission was compared during the operation between the conventional process and the process using the supercritical fluid, the CO2 reduction rate and amount were trially calculated, and a CO2 reduction of a several ten thousand ton scale in carbon conversion was predicted. As to hazardous materials and the reaction of waste retrieval, it was made clear that the process using the supercritical fluid was valid also for objects for which the chemical process used to be impossible, which indicates a possibility of the widening field of application. Concerning its effect on the energy conservation, energy reduction of several ten thousand tons in heavy oil conversion was predicted by replacing all the existing processes with supercritical fluids. Relating to the recycling, with the use of supercritical fluids, the process is possible which produces higher quality and yield and fewer unnecessary products such as char than the conventional process. 197 refs., 102 figs., 71 tabs.

Fiscal 1995 research investigation on chemical process technology using supercritical fluid; 1995 nendo chorinkai ryutai wo riyoshita kagaku process gijutsu ni kansuru chosa kenkyu

Energy Technology Data Exchange (ETDEWEB)

NONE

1996-03-01

With relation to the supercritical fluid utilization technology, conducted in fiscal 1995 were collection of basic data, extraction of R and D subjects and survey/analysis of application fields based on the literature survey and overseas field survey. From the research results, the following were selected as research subjects: as to the clean/recycling process technology, non-selection cascade treatment process of mixed waste plastics, hazardous waste treatment process, and radioactive waste treatment process. As to the unused resource utilization process technology, the supercritical submerged combustion power generation process, heavy hydrocarbon resource reutilization process, biomass synthetic utilization process, and carbon dioxide reutilization process. As to the next generation reaction process technology, the simple reaction process, de-organic solvent process, chemical materialization process for methane, and reaction separation combined process. As the innovative material process technology, the plastic forming process, high-functional materials, high-efficiency energy conversion materials, and heightening of function of solid wastes. 537 refs., 116 figs., 54 tabs.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Directory of Open Access Journals (Sweden)

Yee Mei Leong

2016-06-01

Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Science.gov (United States)

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Solvation in supercritical water

International Nuclear Information System (INIS)

Cochran, H.D.; Cummings, P.T.; Karaborni, S.

1991-01-01

The aim of this work is to determine the solvation structure in supercritical water composed with that in ambient water and in simple supercritical solvents. Molecular dynamics studies have been undertaken of systems that model ionic sodium and chloride, atomic argon, and molecular methanol in supercritical aqueous solutions using the simple point charge model of Berendsen for water. Because of the strong interactions between water and ions, ionic solutes are strongly attractive in supercritical water, forming large clusters of water molecules around each ion. Methanol is found to be a weakly-attractive solute in supercritical water. The cluster of excess water molecules surrounding a dissolved ion or polar molecule in supercritical aqueous solutions is comparable to the solvent clusters surrounding attractive solutes in simple supercritical fluids. Likewise, the deficit of water molecules surrounding a dissolved argon atom in supercritical aqueous solutions is comparable to that surrounding repulsive solutes in simple supercritical fluids. The number of hydrogen bonds per water molecule in supercritical water was found to be about one third the number in ambient water. The number of hydrogen bonds per water molecule surrounding a central particle in supercritical water was only mildly affected by the identify of the central particle--atom, molecule, or ion. These results should be helpful in developing a qualitative understanding of important processes that occur in supercritical water. 29 refs., 6 figs

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

International Nuclear Information System (INIS)

Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

2015-01-01

Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

The metallurgical approach on the solder voids behaviour in surface mount devices

International Nuclear Information System (INIS)

Mohabattul Zaman Bukhari

1996-01-01

Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

International Nuclear Information System (INIS)

Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-01-01

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

Energy Technology Data Exchange (ETDEWEB)

Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-11-25

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

Energy Technology Data Exchange (ETDEWEB)

Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

1995-06-01

The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

Laser Soldering of Rat Skin Using a Controlled Feedback System

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Mohammad Sadegh Nourbakhsh

2009-03-01

Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

Science.gov (United States)

Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

2015-12-01

Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

Science.gov (United States)

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Science.gov (United States)

Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

2017-10-01

Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

Science.gov (United States)

Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

2018-02-01

An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

International Nuclear Information System (INIS)

Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

2010-01-01

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

Energy Technology Data Exchange (ETDEWEB)

Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

2010-02-18

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Kinetic models for supercritical CO2 extraction of oilseeds - a review

Directory of Open Access Journals (Sweden)

B. Nagy

2011-01-01

Full Text Available The supercritical fluid extraction of oilseeds is gaining increasing interest in commercial application for the last few decades, most particularly thanks to technical and environmental advantages of supercritical fluid extraction technology compared to current extraction methods with organic solvents. Furthermore, CO2 as a solvent is generally recognized as safe (GRAS. At present moment, supercritical fluid extractions on a commercial scale are limited to decaffeination, production of soluble hops extracts, sesame seed oil production and extraction of certain petroleum products. When considering industrial application, it is essential to test the applicability of the appropriate model for supercritical fluid extraction of oilseeds used for scale up of laboratory data to industrial design purposes. The aim of this paper is to review the most significant kinetic models reported in the literature for supercritical fluid extraction.

Impurity Effects in Electroplated-Copper Solder Joints

Directory of Open Access Journals (Sweden)

Hsuan Lee

2018-05-01

Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

In vitro conjunctival incision repair by temperature-controlled laser soldering.

Science.gov (United States)

Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

2009-01-01

The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

International Nuclear Information System (INIS)

Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

2009-01-01

Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

Development of correlations for combustion modelling with supercritical surrogate jet fuels

Directory of Open Access Journals (Sweden)

Raja Sekhar Dondapati

2017-12-01

Full Text Available Supercritical fluid technology finds its application in almost all engineering aspects in one or other way. Technology of clean jet fuel combustion is also seeing supercritical fluids as one of their contender in order to mitigate the challenges related to global warming and health issues occurred due to unwanted emissions which are found to be the by-products in conventional jet engine combustion. As jet fuel is a blend of hundred of hydrocarbons, thus estimation of chemical kinetics and emission characteristics while simulation become much complex. Advancement in supercritical jet fuel combustion technology demands reliable property statistics of jet fuel as a function temperature and pressure. Therefore, in the present work one jet fuel surrogate (n-dodecane which has been recognized as the constituent of real jet fuel is studied and thermophysical properties of each is evaluated in the supercritical regime. Correlation has been developed for two transport properties namely density and viscosity at the critical pressure and over a wide range of temperatures (TC + 100 K. Further, to endorse the reliability of the developed correlation, two arithmetical parameters have been evaluated which illustrates an outstanding agreement between the data obtained from online NIST Web-Book and the developed correlation.

Application of supercritical fluid extraction in analytical science

International Nuclear Information System (INIS)

Kumar, Pradeep

2015-01-01

In the recent years, supercritical fluid extraction (SFE) has emerged as a promising alternative to conventional solvent extraction process owing to its potential to minimize the generation of the liquid volume and simplification of the extraction process.This technology is some times referred to as 'green technology' and 'clean technology'. Supercritical fluid extraction process assumes significance as it exhibits practical advantages such as enhanced extraction rate due to rapid mass transfer in supercritical fluid medium and change of solvent properties such as density by tuning pressure/temperature conditions. Supercritical fluids (SCF) offer faster, cleaner and efficient extraction owing to low viscosity, high density, low surface tension and better diffusivity properties. Higher diffusivity than liquids facilitates rapid mass transfer and faster completion of reaction. Due to low viscosity and surface tension, SCF can penetrate deep inside the material, extracting the component of interest. Liquid like solvating characteristics of SCFs enable dissolution of compounds whereas gas like diffusion characteristics provide conditions for high degree of extraction in shorter time duration. CO 2 has been widely employed as supercritical fluid owing to its moderate critical constants (Pc= 72.9 atm, Tc =304.3 K, ñ c = 0.47 g mL -1 ) and attractive properties such as being easily available, recyclable, non-toxic, chemically inert, non inflammable and radio-chemically stable. SCF finds application in variety of fields. In nuclear industry for separation and purification of actinides from liquids and solid matrices. In food industry, Decaffeination of coffee is done by SCF. Pharmaceutical industry, organic compounds can be extracted from plants by SC CO 2 avoiding liquid solvent usage. SCF may also be utilised for the production of fine powders. In polymer and plastics industries, examples of applications include the impregnation of medical material

Intermetallic compounds in 3D integrated circuits technology: a brief review.

Science.gov (United States)

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-01-01

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

Intermetallic compounds in 3D integrated circuits technology: a brief review

Science.gov (United States)

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-12-01

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

Energy Technology Data Exchange (ETDEWEB)

Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

2008-04-24

The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

DEFF Research Database (Denmark)

Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

2017-01-01

humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

Effects of Gravity on Supercritical Water Oxidation (SCWO) Processes

Science.gov (United States)

Hegde, Uday; Hicks, Michael

2013-01-01

The effects of gravity on the fluid mechanics of supercritical water jets are being studied at NASA to develop a better understanding of flow behaviors for purposes of advancing supercritical water oxidation (SCWO) technologies for applications in reduced gravity environments. These studies provide guidance for the development of future SCWO experiments in new experimental platforms that will extend the current operational range of the DECLIC (Device for the Study of Critical Liquids and Crystallization) Facility on board the International Space Station (ISS). The hydrodynamics of supercritical fluid jets is one of the basic unit processes of a SCWO reactor. These hydrodynamics are often complicated by significant changes in the thermo-physical properties that govern flow behavior (e.g., viscosity, thermal conductivity, specific heat, compressibility, etc), particularly when fluids transition from sub-critical to supercritical conditions. Experiments were conducted in a 150 ml reactor cell under constant pressure with water injections at various flow rates. Flow configurations included supercritical jets injected into either sub-critical or supercritical water. Profound gravitational influences were observed, particularly in the transition to turbulence, for the flow conditions under study. These results will be presented and the parameters of the flow that control jet behavior will be examined and discussed.

Supercritical carbon dioxide for textile applications and recent developments

Science.gov (United States)

Eren, H. A.; Avinc, O.; Eren, S.

2017-10-01

In textile industry, supercritical carbon dioxide (scCO2), possessing liquid-like densities, mostly find an application on textile dyeing processes such as providing hydrophobic dyes an advantage on dissolving. Their gas-like low viscosities and diffusion properties can result in shorter dyeing periods in comparison with the conventional water dyeing process. Supercritical carbon dioxide dyeing is an anhydrous dyeing and this process comprises the usage of less energy and chemicals when compared to conventional water dyeing processes leading to a potential of up to 50% lower operation costs. The advantages of supercritical carbon dioxide dyeing method especially on synthetic fiber fabrics hearten leading textile companies to alter their dyeing method to this privileged waterless dyeing technology. Supercritical carbon dioxide (scCO2) waterless dyeing is widely known and applied green method for sustainable and eco-friendly textile industry. However, not only the dyeing but also scouring, desizing and different finishing applications take the advantage of supercritical carbon dioxide (scCO2). In this review, not only the principle, advantages and disadvantages of dyeing in supercritical carbon dioxide but also recent developments of scCO2 usage in different textile processing steps such as scouring, desizing and finishing are explained and commercial developments are stated and summed up.

Thermal stability of biodiesel in supercritical methanol

Energy Technology Data Exchange (ETDEWEB)

Hiroaki Imahara; Eiji Minami; Shusaku Hari; Shiro Saka [Kyoto University, Kyoto (Japan). Department of Socio-Environmental Energy Science

2008-01-15

Non-catalytic biodiesel production technologies from oils/fats in plants and animals have been developed in our laboratory employing supercritical methanol. Due to conditions in high temperature and high pressure of the supercritical fluid, thermal stability of fatty acid methyl esters and actual biodiesel prepared from various plant oils was studied in supercritical methanol over a range of its condition between 270{sup o}C/17 MPa and 380{sup o}C/56 MPa. In addition, the effect of thermal degradation on cold flow properties was studied. As a result, it was found that all fatty acid methyl esters including poly-unsaturated ones were stable at 270{sup o}C/17 MPa, but at 350{sup o}C/43 MPa, they were partly decomposed to reduce the yield with isomerization from cis-type to trans-type. These behaviors were also observed for actual biodiesel prepared from linseed oil, safflower oil, which are high in poly-unsaturated fatty acids. Cold flow properties of actual biodiesel, however, remained almost unchanged after supercritical methanol exposure at 270{sup o}C/17 MPa and 350{sup o}C/43 MPa. For the latter condition, however, poly-unsaturated fatty acids were sacrificed to be decomposed and reduced in yield. From these results, it was clarified that reaction temperature in supercritical methanol process should be lower than 300{sup o}C, preferably 270{sup o}C with a supercritical pressure higher than 8.09 MPa, in terms of thermal stabilization for high-quality biodiesel production. 9 refs., 3 figs., 4 tabs.

Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

National Research Council Canada - National Science Library

Chung, Kohn C

2006-01-01

.... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

Interfacial reaction of Sn-based solder joint in the package system

Science.gov (United States)

Gu, Huandi

In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

Research on the Development of the Supercritical CO{sub 2} Dual Brayton Cycle

Energy Technology Data Exchange (ETDEWEB)

Baik, Young-Jin; Na, Sun Ik; Cho, Junhyun; Shin, Hyung-Ki; Lee, Gilbong [Korea Institute of Energy Research (KIER), Daejeon (Korea, Republic of)

2016-10-15

Because of the growing interest in supercritical carbon dioxide power cycle technology owing to its potential enhancement in compactness and efficiency, supercritical carbon dioxide cycles have been studied in the fields of nuclear power, concentrated solar power (CSP), and fossil fuel power generation. This study introduces the current status of the research project on the supercritical carbon dioxide power cycle by Korea Institute of Energy Research (KIER). During the first phase of the project, the un-recuperated supercritical Brayton cycle test loop was built and tested. In phase two, researchers are designing and building a supercritical carbon dioxide dual Brayton cycle, which utilizes two turbines and two recuperators. Under the simulation condition considered in this study, it was confirmed that the design parameter has an optimal value for maximizing the net power in the supercritical carbon dioxide dual cycle.

Surface modification of chitin using ultrasound-assisted and supercritical CO{sub 2} technologies for cobalt adsorption

Energy Technology Data Exchange (ETDEWEB)

Dotto, Guilherme L., E-mail: guilherme_dotto@yahoo.com.br; Cunha, Jeanine M., E-mail: jeaninecunha@gmail.com; Calgaro, Camila O., E-mail: camila.itepjr@gmail.com; Tanabe, Eduardo H., E-mail: edutanabe@yahoo.com.br; Bertuol, Daniel A., E-mail: dbertuol@gmail.com

2015-09-15

Highlights: • Chitin was modified by ultrasound-assisted (UA) and supercritical (SCO{sub 2}) technologies. • Chitin, UA-chitin and SCO{sub 2}-chitin were used as adsorbents for Co(II). • UA and SCO{sub 2} treatments provided increase of 20 and 3 times in chitin surface area. • The Co(II) adsorption capacity increased until 67.8%, using UA-chitin. - Abstract: Ultrasound-assisted (UA) and supercritical CO{sub 2} technologies (SCO{sub 2}) were used to modify the chitin surface and, improve its adsorption characteristics regarding to cobalt. Chitin, before and after the treatments, was characterized by N{sub 2} adsorption isotherms (BET), infrared spectroscopy (FT-IR), X-ray diffraction (XRD) and scanning electron microscopy (SEM). Unmodified and surface modified chitins were used as adsorbents to remove cobalt from aqueous solutions. The adsorption study was performed by equilibrium isotherms and kinetic curves. The chitin particle characteristics, such as, surface area, pore volume and porosity were improved by the UA and SCO{sub 2} treatments. The crystallinity index decreased after the UA and SCO{sub 2} treatments, and also, intense surface modifications were observed. Langmuir and Freundlich models were adequate to represent the adsorption equilibrium. The maximum adsorption capacities were 50.03, 83.94 and 63.08 mg g{sup −1} for unmodified chitin, UA surface modified chitin and SCO{sub 2} surface modified chitin. The adsorption kinetic curves were well represented by the pseudo-second order model. UA and SCO{sub 2} technologies are alternatives to modify the chitin surface and improve its adsorption characteristics.

The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

Science.gov (United States)

Mayappan, R.; Salleh, A.; Andas, J.

2017-09-01

Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Science.gov (United States)

Teverovsky, Alexander A.

2014-01-01

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

Applications of subcritical and supercritical water conditions for extraction, hydrolysis, gasification, and carbonization of biomass: a critical review

Directory of Open Access Journals (Sweden)

D. Lachos-Perez

2017-06-01

Full Text Available This review summarizes the recent essential aspects of subcritical and supercritical water technology applied tothe extraction, hydrolysis, carbonization, and gasification processes. These are clean and fast technologies which do not need pretreatment, require less reaction time, generate less corrosion and residues, do not usetoxic solvents, and reduce the synthesis of degradation byproducts. The equipment design, process parameters, and types of biomass used for subcritical and supercritical water process are presented. The benefits of catalysis to improve process efficiency are addressed. Bioactive compounds, reducing sugars, hydrogen, biodiesel, and hydrothermal char are the final products of subcritical and supercritical water processes. The present review also revisits advances of the research trends in the development of subcriticaland supercritical water process technologies.

Materials processing using supercritical fluids

Directory of Open Access Journals (Sweden)

Orlović Aleksandar M.

2005-01-01

Full Text Available One of the most interesting areas of supercritical fluids applications is the processing of novel materials. These new materials are designed to meet specific requirements and to make possible new applications in Pharmaceuticals design, heterogeneous catalysis, micro- and nano-particles with unique structures, special insulating materials, super capacitors and other special technical materials. Two distinct possibilities to apply supercritical fluids in processing of materials: synthesis of materials in supercritical fluid environment and/or further processing of already obtained materials with the help of supercritical fluids. By adjusting synthesis parameters the properties of supercritical fluids can be significantly altered which further results in the materials with different structures. Unique materials can be also obtained by conducting synthesis in quite specific environments like reversed micelles. This paper is mainly devoted to processing of previously synthesized materials which are further processed using supercritical fluids. Several new methods have been developed to produce micro- and nano-particles with the use of supercritical fluids. The following methods: rapid expansion of supercritical solutions (RESS supercritical anti-solvent (SAS, materials synthesis under supercritical conditions and encapsulation and coating using supercritical fluids were recently developed.

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

Science.gov (United States)

This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

Visual detection of defects in solder joints

Science.gov (United States)

Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

1995-03-01

The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

Integrated intelligent instruments using supercritical fluid technology for soil analysis

International Nuclear Information System (INIS)

Liebman, S.A.; Phillips, C.; Fitzgerald, W.; Levy, E.J.

1994-01-01

Contaminated soils pose a significant challenge for characterization and remediation programs that require rapid, accurate and comprehensive data in the field or laboratory. Environmental analyzers based on supercritical fluid (SF) technology have been designed and developed for meeting these global needs. The analyzers are designated the CHAMP Systems (Chemical Hazards Automated Multimedia Processors). The prototype instrumentation features SF extraction (SFE) and on-line capillary gas chromatographic (GC) analysis with chromatographic and/or spectral identification detectors, such as ultra-violet, Fourier transform infrared and mass spectrometers. Illustrations are given for a highly automated SFE-capillary GC/flame ionization (FID) configuration to provide validated screening analysis for total extractable hydrocarbons within ca. 5--10 min, as well as a full qualitative/quantitative analysis in 25--30 min. Data analysis using optional expert system and neural networks software is demonstrated for test gasoline and diesel oil mixtures in this integrated intelligent instrument approach to trace organic analysis of soils and sediments

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

Energy Technology Data Exchange (ETDEWEB)

Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

2008-07-14

Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

Processing of novel bioactive polymeric matrixes for tissue engineering using supercritical fluid technology

Energy Technology Data Exchange (ETDEWEB)

Duarte, Ana Rita C., E-mail: aduarte@dep.uminho.pt [3B' s Research Group, Biomaterials, Biodegradables and Biomimetics, University of Minho, Headquarters of the European Institute of Excellence on Tissue Engineering and Regenerative Medicine, AvePark, 4806-909 Taipas, Guimaraes (Portugal); IBB, Institute for Biotechnology and Bioengineering, PT Government Associated Laboratory, Guimaraes (Portugal); Caridade, Sofia G.; Mano, Joao F.; Reis, Rui L. [3B' s Research Group, Biomaterials, Biodegradables and Biomimetics, University of Minho, Headquarters of the European Institute of Excellence on Tissue Engineering and Regenerative Medicine, AvePark, 4806-909 Taipas, Guimaraes (Portugal); IBB, Institute for Biotechnology and Bioengineering, PT Government Associated Laboratory, Guimaraes (Portugal)

2009-08-31

The aim of this study was to develop a new process for the production of bioactive 3D scaffolds using a clean and environmentally friendly technology. The possibility of preparing composite scaffolds of Bioglass and a polymeric blend of starch and poly(L-lactic acid) (SPLA50) was evaluated. Supercritical phase-inversion technique was used to prepare inorganic particles loaded starch-based porous composite matrixes in a one-step process for bone tissue engineering purposes. Due to their osteoconductive properties some glasses and ceramics are interesting materials to be used for bone tissue engineering purposes; however their poor mechanical properties create the need of a polymeric support where the inorganic fraction can be dispersed. Samples impregnated with different concentrations of Bioglass (10 and 15% wt/wt polymer) were prepared at 200 bar and 55 deg. C. The presence of Bioglass did not affect the porosity or interconnectivity of the polymeric matrixes. Dynamic mechanical analysis has proven that the modulus of the SPLA50 scaffolds increases when glass particles are impregnated within the matrix. In vitro bioactivity studies were carried out using simulated body fluid and the results show that a calcium-phosphate layer started to be formed after only 1 day of immersion. Chemical analysis of the apatite layer formed on the surface of the scaffold was performed by different techniques, namely EDS and FTIR spectroscopy and X-ray diffraction (XRD). The ion concentration in the simulated body fluid was also carried out by ICP analysis. Results suggest that a bone-like apatite layer was formed. This study reports the feasibility of using supercritical fluid technology to process, in one step, a porous matrix loaded with a bioactive material for tissue engineering purposes.

Optimization of the soldering process by the DMAIC methodology

Directory of Open Access Journals (Sweden)

Michał Zasadzień

2016-06-01

Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Effects of rework on adhesion of Pb-In soldered gold thick films

International Nuclear Information System (INIS)

Gehman, R.W.; Becka, G.A.; Losure, J.A.

1982-02-01

The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

Manipulation and soldering of carbon nanotubes using atomic force microscope

International Nuclear Information System (INIS)

Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

2008-01-01

Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

Effect of temperature and flux concentration on soldering of base metal.

Science.gov (United States)

Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

2000-12-01

The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

Science.gov (United States)

Lee, Hwa-Teng; Huang, Kuo-Chen

2016-12-01

Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

Influence of economical variables on a supercritical biodiesel production process

International Nuclear Information System (INIS)

Marchetti, J.M.

2013-01-01

Highlights: • Biodiesel production from supercritical process. • Economical analysis. • Influence of market variables. - Abstract: Biodiesel has becoming more and more relevant in today’s society and economy due to its environmental advantages such as biodegradability, lower CO and CO 2 emissions as well as less particulate pollutants. In this work the study of market and economic variables is presented and their effects compared when biodiesel is being produced using a supercritical technology. The production process is based on a supercritical technology with no catalyst and no co-solvent. Price for the raw materials, such as price for the alcohol as well as the oil has been studied. Also, selling price for biodiesel as well as glycerin has been analyzed and compared with prices from other biodiesel production technologies. Economic decisions such as percentage of failure in the production process, investment in research and development, and advertisement have been evaluated; also it has been considered the influence of the tax incentives on the global economy of the production process. Small variations on some of the major market variables would produce significant effects over the global economy of the plant, making it non profitable in some cases

Pressure brazing of ceramics to metals with copper solder

International Nuclear Information System (INIS)

Pavlova, M.A.; Metelkin, I.I.

1986-01-01

The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

Phytosterols and their extraction from various plant matrices using supercritical carbon dioxide: a review.

Science.gov (United States)

Uddin, Md Salim; Sarker, Md Zaidul Islam; Ferdosh, Sahena; Akanda, Md Jahurul Haque; Easmin, Mst Sabina; Bt Shamsudin, Siti Hadijah; Bin Yunus, Kamaruzzaman

2015-05-01

Phytosterols provide important health benefits: in particular, the lowering of cholesterol. From environmental and commercial points of view, the most appropriate technique has been searched for extracting phytosterols from plant matrices. As a green technology, supercritical fluid extraction (SFE) using carbon dioxide (CO2) is widely used to extract bioactive compounds from different plant matrices. Several studies have been performed to extract phytosterols using supercritical CO2 (SC-CO2) and this technology has clearly offered potential advantages over conventional extraction methods. However, the efficiency of SFE technology fully relies on the processing parameters, chemistry of interest compounds, nature of the plant matrices and expertise of handling. This review covers SFE technology with particular reference to phytosterol extraction using SC-CO2. Moreover, the chemistry of phytosterols, properties of supercritical fluids (SFs) and the applied experimental designs have been discussed for better understanding of phytosterol solubility in SC-CO2. © 2014 Society of Chemical Industry.

Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

Science.gov (United States)

Sorg, Brian S.; Welch, Ashley J.

2001-05-01

Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

Science.gov (United States)

Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

2004-12-01

The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Study on interfacial reaction between lead-free solders and alternative surface finishes

International Nuclear Information System (INIS)

Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

2007-01-01

This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

The critical oxide thickness for Pb-free reflow soldering on Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

2012-06-01

Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

Effect of gap distance on tensile strength of preceramic base metal solder joints.

Science.gov (United States)

Fattahi, Farnaz; Motamedi, Milad

2011-01-01

In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

Science.gov (United States)

Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

2013-09-11

Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

FY 1998 'The New Sunshine Project' leading R and D. Report on the results of the leading R and D of supercritical fluid utilization technology; 1998 nendo 'New Sunshine Keikaku' sendo kenkyu kaihatsu. Chorinkai ryutai riyo gijutsu sendo kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

1999-03-01

The paper reported the FY 1998 achievement of the supercritical fluid utilization leading R and D which started in FY 1997 on a 3-year plan. In the R and D, solvolysis reaction, oxidation reaction and hydrogenation reaction were taken up in the chemical process using supercritical fluid. In the study of solvolysis reaction, the basic data were obtained on decomposition conditions of thermoplastic and thermosetting plastics in supercritical water. Further, concerning the synthesis of environmental friendly type carbonate using CO2, a conversion rate of almost 100% was obtained. About the oxidation reaction, conditions were found out for burning low grade coal in supercritical water without emitting acid gas. This is considered to lead to a possibility of the supercritical water power generation. Relating to the hydrogenation reaction, a study was made on lightening technology of heavy distillate using supercritical water, and the conditions for effective emission of methane and hydrogen were found out. As to the base technology, a study was made of metal materials with high corrosion resistance against supercritical water. (NEDO)

Supercritical Fluid Chromatography/Fourier Transform Infrared Spectroscopy Of Food Components

Science.gov (United States)

Calvey, Elizabeth M.; Page, Samuel W.; Taylor, Larry T.

1989-12-01

Supercritical fluid (SF) technologies are being investigated extensively for applications in food processing. The number of SF-related patents issued testifies to the level of interest. Among the properties of materials at temperatures and pressures above their critical points (supercritical fluids) is density-dependent solvating power. Supercritical CO2 is of particular interest to the food industry because of its low critical temperature (31.3°C) and low toxicity. Many of the components in food matrices react or degrade at elevated temperatures and may be adversely affected by high temperature extractions. Likewise, these components may not be amenable to GC analyses. Our SF research has been in the development of methods employing supercritical fluid chromatography (SFC) and extraction (SFE) coupled to a Fourier transform infrared (FT-IR) spectrometer to investigate food composition. The effects of processing techniques on the isomeric fatty acid content of edible oils and the analysis of lipid oxidation products using SFC/FT-IR with a flow-cell interface are described.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

2017-01-01

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan

2017-08-10

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

Kinetics and mechanism of methane oxidation in supercritical water

International Nuclear Information System (INIS)

Rofer, C.K.; Streit, G.E.

1988-10-01

This project, is a Hazardous Waste Remedial Actions Program (HAZWRAP) Research and Development task being carried out by the Los Alamos National Laboratory. Its objective is to achieve an understanding of the technology for use in scaling up and applying oxidation in supercritical water as a viable process for treating a variety of Department of Energy Defense Programs (DOE-DP) waste streams. This report presents experimental results for the kinetics of the oxidation of methane and methanol in supercritical water and computer modeling results for the oxidation of carbonmonoxide and methane in supercritical water. The experimental and modeling results obtained to date on these one-carbon model compounds indicate that the mechanism of oxidation in supercritical water can be represented by free-radical reactions with appropriate modifications for high pressure and the high water concentration. If these current trends are sustained, a large body of existing literature data on the kinetics of elementary reactions can be utilized to predict the behavior of other compounds and their mixtures. 7 refs., 4 figs., 3 tabs

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

International Nuclear Information System (INIS)

Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

2009-01-01

The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Energy Technology Data Exchange (ETDEWEB)

Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

2009-05-27

The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

Reaction kinetics of cellulose hydrolysis in subcritical and supercritical water

Science.gov (United States)

Olanrewaju, Kazeem Bode

The uncertainties in the continuous supply of fossil fuels from the crisis-ridden oil-rich region of the world is fast shifting focus on the need to utilize cellulosic biomass and develop more efficient technologies for its conversion to fuels and chemicals. One such technology is the rapid degradation of cellulose in supercritical water without the need for an enzyme or inorganic catalyst such as acid. This project focused on the study of reaction kinetics of cellulose hydrolysis in subcritical and supercritical water. Cellulose reactions at hydrothermal conditions can proceed via the homogeneous route involving dissolution and hydrolysis or the heterogeneous path of surface hydrolysis. The work is divided into three main parts. First, the detailed kinetic analysis of cellulose reactions in micro- and tubular reactors was conducted. Reaction kinetics models were applied, and kinetics parameters at both subcritical and supercritical conditions were evaluated. The second major task was the evaluation of yields of water soluble hydrolysates obtained from the hydrolysis of cellulose and starch in hydrothermal reactors. Lastly, changes in molecular weight distribution due to hydrothermolytic degradation of cellulose were investigated. These changes were also simulated based on different modes of scission, and the pattern generated from simulation was compared with the distribution pattern from experiments. For a better understanding of the reaction kinetics of cellulose in subcritical and supercritical water, a series of reactions was conducted in the microreactor. Hydrolysis of cellulose was performed at subcritical temperatures ranging from 270 to 340 °C (tau = 0.40--0.88 s). For the dissolution of cellulose, the reaction was conducted at supercritical temperatures ranging from 375 to 395 °C (tau = 0.27--0.44 s). The operating pressure for the reactions at both subcritical and supercritical conditions was 5000 psig. The results show that the rate-limiting step in

Final stage of first supercritical 460MW{sub e} CFB boiler construction. First experience

Energy Technology Data Exchange (ETDEWEB)

Goral, Damian [Foster Wheeler Energia Polska (Poland); Ostrowski, Waldemar [PKE (Poland)

2009-07-01

Circulating fluidized bed (CFB) boiler technology has been growing in size and number over the past two decades and it has established its position as utility scale boiler technology. Plant sizes up to 300 MW{sub e} are in operation today and designs for larger boilers are being developed. The next natural step for CFB technology is to go for supercritical steam parameters and larger boiler sizes. A Polish utility company Poludniowy Koncern Energetyczny SA (PKE) placed an order to Foster Wheeler Energia Oy for a 460 MW{sub e} supercritical CFB boiler for their Lagisza power plant. Contract was signed at the end of year 2002 and the engineering work is now ongoing. This will be the first supercritical once-through CFB boiler in the world. A modern power plant is designed for high efficiency not only for economical reasons but also for enhanced environmental performance in terms of reduced emissions and quantity of ash generated due to lower fuel consumption. Cutting CO{sub 2} emissions is one of the main drivers. To achieve these goals, supercritical steam parameters have been applied. Now this technology is available also for CFB technology. This combines a high plant efficiency with the other well known benefits of CFB technology, such as: fuel flexibility, low emissions and high availability. The boiler design for 460 MW{sub e} Lagisza power plant utilizes low mass flux BENSON Vertical once-through technology developed and licensed by Siemens AG, Germany. CFB boiler with low and uniform furnace heat flux is extremely well suited for the Benson technology providing a stable operation of the boiler also during load changes and abnormal operation conditions. The paper describes the 460 MW{sub e} supercritical CFB boiler concept and presents the technical solutions of the boiler design with auxiliary equipment, as well as first experiences from boiler erection period and commissioning. In spite of achieving this remarkable milestone the development of the CFB

Solid catalyzed isoparaffin alkylation at supercritical fluid and near-supercritical fluid conditions

Science.gov (United States)

Ginosar, Daniel M.; Fox, Robert V.; Kong, Peter C.

2000-01-01

This invention relates to an improved method for the alkylation reaction of isoparaffins with olefins over solid catalysts including contacting a mixture of an isoparaffin, an olefin and a phase-modifying material with a solid acid catalyst member under alkylation conversion conditions at either supercritical fluid, or near-supercritical fluid conditions, at a temperature and a pressure relative to the critical temperature(T.sub.c) and the critical pressure(P.sub.c) of the reaction mixture. The phase-modifying phase-modifying material is employed to promote the reaction's achievement of either a supercritical fluid state or a near-supercritical state while simultaneously allowing for decreased reaction temperature and longer catalyst life.

Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

Energy Technology Data Exchange (ETDEWEB)

Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

2017-07-27

Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

International Nuclear Information System (INIS)

Liu, X.W.; Plumbridge, W.J.

2003-01-01

The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

European supercritical water cooled reactor

International Nuclear Information System (INIS)

Schulenberg, T.; Starflinger, J.; Marsault, P.; Bittermann, D.; Maraczy, C.; Laurien, E.; Lycklama a Nijeholt, J.A.; Anglart, H.; Andreani, M.; Ruzickova, M.; Toivonen, A.

2011-01-01

Highlights: → The HPLWR reactor design is an example of a supercritical water cooled reactor. → Cladding material tests have started but materials are not yet satisfactory. → Numerical heat transfer predictions are promising but need further validation. → The research project is most suited for nuclear education and training. - Abstract: The High Performance Light Water Reactor (HPLWR), how the European Supercritical Water Cooled Reactor is called, is a pressure vessel type reactor operated with supercritical water at 25 MPa feedwater pressure and 500 o C average core outlet temperature. It is designed and analyzed by a European consortium of 10 partners and 3 active supporters from 8 Euratom member states in the second phase of the HPLWR project. Most emphasis has been laid on a core with a thermal neutron spectrum, consisting of small fuel assemblies in boxes with 40 fuel pins each and a central water box to improve the neutron moderation despite the low coolant density. Peak cladding temperatures of the fuel rods have been minimized by heating up the coolant in three steps with intermediate coolant mixing. The containment design with its safety and residual heat removal systems is based on the latest boiling water reactor concept, but with different passive high pressure coolant injection systems to cause a forced convection through the core. The design concept of the steam cycle is indicating the envisaged efficiency increase to around 44%. Moreover, it provides the constraints to design the components of the balance of the plant. The project is accompanied by numerical studies of heat transfer of supercritical water in fuel assemblies and by material tests of candidate cladding alloys, performed by the consortium and supported by additional tests of the Joint Research Centre of the European Commission. Besides the scientific and technical progress, the HPLWR project turned out to be most successful in training the young generation of nuclear engineers

Candidate Materials Evaluation for Supercritical Water-Cooled Reactor

International Nuclear Information System (INIS)

Allen, T.R.; Was, G.S.

2008-01-01

Final technical report on the corrosion, stress corrosion cracking, and radiation response of candidate materials for the supercritical water-cooled reactor concept. The objective of the proposed research was to investigate degradation of materials in the supercritical water environment (SCW). First, representative alloys from the important classes of candidate materials were studied for their corrosion and stress-corrosion cracking (SCC) resistance in supercritical water. These included ferritic/martensitic (F/M) steels, austenitic stainless steels, and Ni-base alloys. Corrosion and SCC tests were conducted at various temperatures and exposure times, as well as in various water chemistries. Second, emerging plasma surface modification and grain boundary engineering technologies were applied to modify the near surface chemistry, microstructure, and stress-state of the alloys prior to corrosion testing. Third, the effect of irradiation on corrosion and SCC of alloys in the as-received and modified/engineered conditions were examined by irradiating samples using high-energy protons and then exposing them to SCW

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

Energy Technology Data Exchange (ETDEWEB)

Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

2014-01-21

Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

Laser welding of vas deferens in rodents: initial experience with fluid solders.

Science.gov (United States)

Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

1998-01-01

This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

Comparison of implant-abutment interface misfits after casting and soldering procedures.

Science.gov (United States)

Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

2014-04-01

The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

Characterizing performances of solder paste printing process at flexible manufacturing lines

International Nuclear Information System (INIS)

Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

2015-01-01

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

Characterizing performances of solder paste printing process at flexible manufacturing lines

Energy Technology Data Exchange (ETDEWEB)

Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

2015-02-03

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

Once-through cycle, supercritical-pressure light water cooled reactor concept

Energy Technology Data Exchange (ETDEWEB)

Oka, Y.; Koshizuka, S. [Tokyo Univ., Tokai, Ibaraki (Japan). Nuclear Engineering Research Lab

2001-07-01

Concept of once-through cycle, supercritical-pressure light water cooled reactors was developed. The research covered major aspects of conceptual design such as cores of thermal and fast reactors, plant system and heat balance, safety system and criteria, accident and transient analysis, LOCA, PSA, plant control and start-up. The advantages of the reactor lie in the compactness of the plant from high specific enthalpy of supercritical water, the simplicity of the once-through cycle and the experiences of major component technologies which are based on supercritical fossil-fired power plants and LWRs. The operating temperatures of the major components are within the experience in spite of high coolant outlet temperature. The once-through cycle is compatible with the tight fuel lattice fast reactor because of high head pumps and small coolant flow rate. (author)

Once-through cycle, supercritical-pressure light water cooled reactor concept

International Nuclear Information System (INIS)

Oka, Y.; Koshizuka, S.

2001-01-01

Concept of once-through cycle, supercritical-pressure light water cooled reactors was developed. The research covered major aspects of conceptual design such as cores of thermal and fast reactors, plant system and heat balance, safety system and criteria, accident and transient analysis, LOCA, PSA, plant control and start-up. The advantages of the reactor lie in the compactness of the plant from high specific enthalpy of supercritical water, the simplicity of the once-through cycle and the experiences of major component technologies which are based on supercritical fossil-fired power plants and LWRs. The operating temperatures of the major components are within the experience in spite of high coolant outlet temperature. The once-through cycle is compatible with the tight fuel lattice fast reactor because of high head pumps and small coolant flow rate. (author)

Use and practice of achiral and chiral supercritical fluid chromatography in pharmaceutical analysis and purification.

Science.gov (United States)

Lemasson, Elise; Bertin, Sophie; West, Caroline

2016-01-01

The interest of pharmaceutical companies for complementary high-performance chromatographic tools to assess a product's purity or enhance this purity is on the rise. The high-throughput capability and economic benefits of supercritical fluid chromatography, but also the "green" aspect of CO2 as the principal solvent, render supercritical fluid chromatography very attractive for a wide range of pharmaceutical applications. The recent reintroduction of new robust instruments dedicated to supercritical fluid chromatography and the progress in stationary phase technology have also greatly benefited supercritical fluid chromatography. Additionally, it was shown several times that supercritical fluid chromatography could be orthogonal to reversed-phase high-performance liquid chromatography and could efficiently compete with it. Supercritical fluid chromatography is an adequate tool for small molecules of pharmaceutical interest: synthetic intermediates, active pharmaceutical ingredients, impurities, or degradation products. In this review, we first discuss about general chromatographic conditions for supercritical fluid chromatography analysis to better suit compounds of pharmaceutical interest. We also discuss about the use of achiral and chiral supercritical fluid chromatography for analytical purposes and the recent applications in these areas. The use of preparative supercritical fluid chromatography by pharmaceutical companies is also covered. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Science.gov (United States)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Science.gov (United States)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Extraction with supercritical gases

Energy Technology Data Exchange (ETDEWEB)

Schneider, G M; Wilke, G; Stahl, E

1980-01-01

The contents of this book derives from a symposium on the 5th and 6th of June 1978 in the ''Haus der Technik'' in Essen. Contributions were made to separation with supercritical gases, fluid extraction of hops, spices and tobacco, physicochemical principles of extraction, phase equilibria and critical curves of binary ammonia-hydrocarbon mixtures, a quick method for the microanalytical evaluation of the dissolving power of supercritical gases, chromatography with supercritical fluids, the separation of nonvolatile substances by means of compressed gases in countercurrent processes, large-scale industrial plant for extraction with supercritical gases, development and design of plant for high-pressure extraction of natural products.

New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

Directory of Open Access Journals (Sweden)

Rainer Bader

2013-09-01

Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

Science.gov (United States)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Science.gov (United States)

Wei, Helin; Wang, Kuisheng

2011-11-01

Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

Science.gov (United States)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

FY 1998 'The New Sunshine Project' leading R and D. Report on the results of the leading R and D of supercritical fluid utilization technology; 1998 nendo 'New Sunshine Keikaku' sendo kenkyu kaihatsu. Chorinkai ryutai riyo gijutsu sendo kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

1999-03-01

The paper reported the FY 1998 achievement of the supercritical fluid utilization leading R and D which started in FY 1997 on a 3-year plan. In the R and D, solvolysis reaction, oxidation reaction and hydrogenation reaction were taken up in the chemical process using supercritical fluid. In the study of solvolysis reaction, the basic data were obtained on decomposition conditions of thermoplastic and thermosetting plastics in supercritical water. Further, concerning the synthesis of environmental friendly type carbonate using CO2, a conversion rate of almost 100% was obtained. About the oxidation reaction, conditions were found out for burning low grade coal in supercritical water without emitting acid gas. This is considered to lead to a possibility of the supercritical water power generation. Relating to the hydrogenation reaction, a study was made on lightening technology of heavy distillate using supercritical water, and the conditions for effective emission of methane and hydrogen were found out. As to the base technology, a study was made of metal materials with high corrosion resistance against supercritical water. (NEDO)

Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

Science.gov (United States)

Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

2006-11-01

Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Science.gov (United States)

Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

2018-03-01

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

Science.gov (United States)

Tikale, Sanjay; Prabhu, K. Narayan

2018-05-01

The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

International Nuclear Information System (INIS)

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

2015-01-01

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

Energy Technology Data Exchange (ETDEWEB)

Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

2015-11-25

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Supercritical fluid carbon dioxide extraction of actinides

International Nuclear Information System (INIS)

Rao, Ankita; Tomar, B.S.

2016-01-01

Supercritical fluid extraction (SFE) is a process akin to liquid-liquid or solvent extraction where a Supercritical fluid (SCF) is contacted with a solid/ liquid matrix for the purpose of separating the component of interest from the original matrix. Carbon dioxide is a preferred choice as supercritical fluid (SCF) owing to its moderate critical parameter (P c = 7.38 MPa and T c = 304.1K) coupled with radiation and chemical stability, non toxic nature and low cost. Despite widespread applications for extraction of organic compounds and associated advantages especially liquid waste minimization, the SFE of metal ions was left unexplored for quite some time, as direct metal ion extraction is inefficient due charge neutralization requirement and weak solute-solvent interaction. Neutral SCF soluble metal-ligand complexation is imperative and SFE of actinides was reported only in 1994. Several studies have been carried out on SFE of uranium, thorium and plutonium from nitric acid medium employing different sets of ligands (organophosphorus, diketones, amides). Especially attractive is the possibility of direct dissolution and extraction of actinides employing ligand-acid adducts (like TBP.HNO 3 adduct) from solid matrices of different stages of nuclear fuel cycle viz. ores, spent nuclear fuels and radioactive wastes. Also, partitioning of actinides from fission products has been explored in spent nuclear fuel. These studies on supercritical fluid extraction of actinides indicate a more efficient and environmentally sustainable technology. (author)

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

DEFF Research Database (Denmark)

Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

2017-01-01

with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

Technoeconomic study of supercritical biodiesel production plant

International Nuclear Information System (INIS)

Marchetti, J.M.; Errazu, A.F.

2008-01-01

Over the last years, biodiesel has gained more market due to its benefits and because it appears as the natural substitute for diesel. However, the highest cost of this process is associated with the raw material employed, making it a less competitive and more expensive fuel. Therefore, research is being done in order to use low price raw material, such as acid oils, frying oils or soapstocks. In this work, a biodiesel production plant was developed using supercritical methanol and acid oils as raw materials. This technology was compared with some other alternatives previously described with the aim of making a comparative study, not only on the technical aspects but also on the economic results. A process simulator was employed to produce the conceptual design and simulate each technology. Using these models, it was possible to analyze different scenarios and to evaluate productivity, raw material consumption, economic competitiveness and environmental impacts of each process. Although the supercritical alternative appears as a good technical possibility to produce biodiesel, today, it is not an economic alternative due to its high operating costs

VOC reduction technology deveolpment as part of the U.S. Department of Energy, Industrial Waste Reduction Program

International Nuclear Information System (INIS)

Cranford, B.

1993-01-01

A strong industry is vital to U.S. Economic health and prosperity, but U.S. industry is facing serious challenges both domestically and internationally. One of these challenges is the reduction of volatile organic compounds emissions from industrial processes and products. To assist industry with these challenges, the U.S. Department of Energy established the Industrial Waste Reduction Program to improve energy efficiency and competitiveness to private industry through cost-effective waste material reduction. This paper describes the programs and the use of joint partnerships between the Department of Energy, industry, national laboratories, universities and others, in developing technologies which reduce VOC emissions while improving energy efficiency. This paper also describes the process and selection criteria for participation in the program, and briefly describes the following five VOC reduction technologies under development: Dual Cure Coatings, Solvent Reduction through use of a No-clean Soldering Process, Solvent Waste Minimization by Supercritical CO 2 Cleaning Process, ethanol Recovery Process, and Membrane Vapor Recovery Systems. The VOC reductions as well as the energy savings and other benefits to the U.S. are discussed

Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

Science.gov (United States)

Sorg, B S; Welch, A J

2001-01-01

Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

Energy Technology Data Exchange (ETDEWEB)

NONE

2000-03-01

To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

International Nuclear Information System (INIS)

Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

2009-01-01

Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

International Nuclear Information System (INIS)

Luay Hussain

2002-01-01

Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

TECHNIQUE AND TECHNOLOGY OF USING CARBON DIOXIDE IN SUB- AND SUPERCRITICAL STATE

Directory of Open Access Journals (Sweden)

G. I. Kasjanov

2014-01-01

Full Text Available Summary. Solving problems of deep processing of agricultural raw materials is largely dependent on the use of biotechnological methods of processing raw material components, the use of high-tech methods for the purpose of long-term storage of raw materials, preparative separation of the chemical components of raw materials, creation of natural food supplements based on secondary agricultural inputs. It is known that modern processes of agricultural raw materials are accompanied by changes in gas-liquid media in a wide range of humidity, temperature and pressure. Gas-liquid technology effectively influence the flow of raw materials, which acquires new characteristics or quality can be divided into separate classes of chemical compounds. Results of author’s researches in the area of agricultural raw material gas-liquid treatment are represented in the article. Idea of new scientific direction - unified system of carbon dioxide application in the branches of food industry for creation of principally new high technologies of various origin raw material. Technological opportunities vegetative and animal raw material gas-liquid treatment for production of highly concentrated natural food agents have been analyzed. Application of carbon dioxide as extraction agent in sub- and supercritical state made possible to solve several problems of vegetative raw material chemical components preparative separation, activate the activity of animal raw material inner enzymes, achieve the raw material hyperfine de-composition by method of gas-liquid explosion.

Thermal decomposition of solder flux activators under simulated wave soldering conditions

DEFF Research Database (Denmark)

Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

/methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

CO{sub 2}-based supercritical fluids as environmentally-friendly processing solvents

Energy Technology Data Exchange (ETDEWEB)

Rubin, J.B.; Davenhall, L.B.; Taylor, C.M.V.; Pierce, T. [Los Alamos National Lab., NM (United States). Physical Organic Chemistry Group; Tiefert, K. [Hewlett-Packard Co., Inc., Santa Clara, CA (United States)

1999-03-01

The production of integrated circuits involves a number of discrete steps that utilize hazardous or regulated solvents. Environmental, safety and health considerations associated with these chemicals have prompted a search for alternative, more environmentally benign, solvent systems. An emerging technology for conventional solvent replacement is the use of supercritical fluids based on carbon dioxide (CO{sub 2}). Supercritical CO{sub 2} (SCCO{sub 2}) is an excellent choice for IC manufacturing processes since it is non-toxic, non-flammable, inexpensive, and is compatible with all substrate and metallizations systems. Also, conditions of temperature and pressure needed to achieve the supercritical state are easily achievable with existing process equipment. The authors first describe the general properties of supercritical fluids, with particular emphasis on their application as alternative solvents. Next, they review some of the work which has been published involving the use of supercritical fluids, and particularly CO{sub 2}, as they may be applied to the various steps of IC manufacture, including wafer cleaning, thin film deposition, etching, photoresist stripping, and waste treatment. Next, they describe the research work conducted at Los Alamos, on behalf of Hewlett-Packard, on the use of SCCO{sub 2} in a specific step of the IC manufacturing process: the stripping of hard-baked photoresist.

Description of Supercritical CO{sub 2} Compressor Experiment Loop

Energy Technology Data Exchange (ETDEWEB)

Lee, Je Kyoung; Lee, Jeong Ik; Ahn, Yoonhan; Kim, Seong Gu [Korea Advanced Institute of Science and Technology, Daejeon (Korea, Republic of); Cha, Je Eun [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

2013-10-15

The full scope of SCIEL project is to demonstrate high efficiency with simple recuperated cycle layout or recompressing layout, which the final cycle layout will be determined by the obtained compressor performance data. As a part of SCIEL project, S-CO{sub 2} compressor experiment facility has been constructed in KAERI. In this paper, current status of S-CO{sub 2} compressor experiment loop will be reviewed. With the growing interest in developing an advanced nuclear power plant, power conversion cycle innovation has been the part of this effort to secure high economics and enhanced safety. One of the main activities of power conversion cycle innovation is the development of Supercritical CO{sub 2} Brayton cycle technology. S-CO{sub 2} Brayton cycle concept was suggested in 1960s but the development and realization of the technology has been delayed up to now. In Korea, KAIST, KAERI and POSTECH are conducting research and development of Korean S-CO{sub 2} Brayton cycle technology by erecting the Supercritical CO{sub 2} Integral Experiment Loop (SCIEL)

Development of high melting point, environmentally friendly solders, using the calphad approach

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2008-01-01

An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

Energy Technology Data Exchange (ETDEWEB)

Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

1997-10-01

Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

Science.gov (United States)

Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

2017-07-01

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

Enhanced oral bioavailability of silymarin using liposomes containing a bile salt: preparation by supercritical fluid technology and evaluation in vitro and in vivo

Science.gov (United States)

Yang, Gang; Zhao, Yaping; Zhang, Yongtai; Dang, Beilei; Liu, Ying; Feng, Nianping

2015-01-01

The aim of this investigation was to develop a procedure to improve the dissolution and bioavailability of silymarin (SM) by using bile salt-containing liposomes that were prepared by supercritical fluid technology (ie, solution-enhanced dispersion by supercritical fluids [SEDS]). The process for the preparation of SM-loaded liposomes containing a bile salt (SM-Lip-SEDS) was optimized using a central composite design of response surface methodology with the ratio of SM to phospholipids (w/w), flow rate of solution (mL/min), and pressure (MPa) as independent variables. Particle size, entrapment efficiency (EE), and drug loading (DL) were dependent variables for optimization of the process and formulation variables. The particle size, zeta potential, EE, and DL of the optimized SM-Lip-SEDS were 160.5 nm, −62.3 mV, 91.4%, and 4.73%, respectively. Two other methods to produce SM liposomes were compared to the SEDS method. The liposomes obtained by the SEDS method exhibited the highest EE and DL, smallest particle size, and best stability compared to liposomes produced by the thin-film dispersion and reversed-phase evaporation methods. Compared to the SM powder, SM-Lip-SEDS showed increased in vitro drug release. The in vivo AUC0−t of SM-Lip-SEDS was 4.8-fold higher than that of the SM powder. These results illustrate that liposomes containing a bile salt can be used to enhance the oral bioavailability of SM and that supercritical fluid technology is suitable for the preparation of liposomes. PMID:26543366

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

International Nuclear Information System (INIS)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-01-01

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

Science.gov (United States)

Han, Jing; Tan, Shihai; Guo, Fu

2018-01-01

Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Energy Technology Data Exchange (ETDEWEB)

Hamm, Randy; Peterson, Kenneth A.

2015-10-01

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

Improvement of the auto wire feeder machine in a de-soldering process

Directory of Open Access Journals (Sweden)

Niramon Nonkhukhetkhong

2016-10-01

Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

Supercritical Water Reactors

International Nuclear Information System (INIS)

Bouchter, J.C.; Dufour, P.; Guidez, J.; Latge, C.; Renault, C.; Rimpault, G.

2014-01-01

The supercritical water reactor (SCWR) is one of the 6 concepts selected for the 4. generation of nuclear reactors. SCWR is a new concept, it is an attempt to optimize boiling water reactors by using the main advantages of supercritical water: only liquid phase and a high calorific capacity. The SCWR requires very high temperatures (over 375 C degrees) and very high pressures (over 22.1 MPa) to operate which allows a high conversion yield (44% instead of 33% for a PWR). Low volumes of coolant are necessary which makes the neutron spectrum shift towards higher energies and it is then possible to consider fast reactors operating with supercritical water. The main drawbacks of supercritical water is the necessity to use very high pressures which has important constraints on the reactor design, its physical properties (density, calorific capacity) that vary strongly with temperatures and pressures and its very high corrosiveness. The feasibility of the concept is not yet assured in terms of adequate materials that resist to corrosion, reactor stability, reactor safety, and reactor behaviour in accidental situations. (A.C.)

The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

Science.gov (United States)

Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

2015-12-01

Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

Fluxless flip-chip bonding using a lead-free solder bumping technique

Science.gov (United States)

Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

2017-09-01

With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

Supercritical water oxidation data acquisition testing. Final report, Volume II

International Nuclear Information System (INIS)

1996-11-01

Supercritical Water Oxidation (SCWO) technology holds great promise for treating mixed wastes, in an environmentally safe and efficient manner. In the spring of 1994 the US Department of Energy (DOE), Idaho Operations Office awarded Stone ampersand Webster Engineering Corporation, of Boston Massachusetts and its sub-contractor MODAR, Inc. of Natick Massachusetts a Supercritical Water Oxidation Data Acquisition Testing (SCWODAT) program. The SCWODAT program was contracted through a Cooperative Agreement that was co-funded by the US Department of Energy and the Strategic Environmental Research and Development Program. The SCWODAT testing scope outlined by the DOE in the original Cooperative Agreement and amendments thereto was initiated in June 1994 and successfully completed in December 1995. The SCWODAT program provided further information and operational data on the effectiveness of treating both simulated mixed waste and typical Navy hazardous waste using the MODAR SCWO technology

Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

Energy Technology Data Exchange (ETDEWEB)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-10-31

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

Directory of Open Access Journals (Sweden)

Xiuyun Zhou

2015-10-01

Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

CERN Document Server

Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

2015-01-01

The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

Energy Technology Data Exchange (ETDEWEB)

Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

1997-10-01

Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

Review on plasmas in extraordinary media: plasmas in cryogenic conditions and plasmas in supercritical fluids

Science.gov (United States)

Stauss, Sven; Muneoka, Hitoshi; Terashima, Kazuo

2018-02-01

Plasma science and technology has enabled advances in very diverse fields: micro- and nanotechnology, chemical synthesis, materials fabrication and, more recently, biotechnology and medicine. While many of the currently employed plasma tools and technologies are very advanced, the types of plasmas used in micro- and nanofabrication pose certain limits, for example, in treating heat-sensitive materials in plasma biotechnology and plasma medicine. Moreover, many physical properties of plasmas encountered in nature, and especially outer space, i.e. very-low-temperature plasmas or plasmas that occur in high-density media, are not very well understood. The present review gives a short account of laboratory plasmas generated under ’extreme’ conditions: at cryogenic temperatures and in supercritical fluids. The fundamental characteristics of these cryogenic plasmas and cryoplasmas, and plasmas in supercritical fluids, especially supercritical fluid plasmas, are presented with their main applications. The research on such exotic plasmas is expected to lead to further understanding of plasma physics and, at the same time, enable new applications in various technological fields.

Laser tissue welding mediated with a protein solder

Science.gov (United States)

Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

1996-05-01

A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

Nanoparticles in Porous Microparticles Prepared by Supercritical Infusion and Pressure Quench Technology for Sustained Delivery of Bevacizumab

Science.gov (United States)

K.Yandrapu, Sarath; Upadhyay, Arun K.; Petrash, J. Mark; Kompella, Uday B.

2014-01-01

Nanoparticles in porous microparticles (NPinPMP), a novel delivery system for sustained delivery of protein drugs, was developed using supercritical infusion and pressure quench technology, which does not expose proteins to organic solvents or sonication. The delivery system design is based on the ability of supercritical carbon dioxide (SC CO2) to expand poly(lactic-co-glycolic) acid (PLGA) matrix but not polylactic acid (PLA) matrix. The technology was applied to bevacizumab, a protein drug administered once a month intravitreally to treat wet age related macular degeneration. Bevacizumab coated PLA nanoparticles were encapsulated into porosifying PLGA microparticles by exposing the mixture to SC CO2. After SC CO2 exposure, the size of PLGA microparticles increased by 6.9 fold. Confocal and scanning electron microscopy studies demonstrated the expansion and porosification of PLGA microparticles and infusion of PLA nanoparticles inside PLGA microparticles. In vitro release of bevacizumab from NPinPMP was sustained for 4 months. Size exclusion chromatography, fluorescence spectroscopy, circular dichroism spectroscopy, SDS-PAGE, and ELISA studies indicated that the released bevacizumab maintained its monomeric form, conformation, and activity. Further, in vivo delivery of bevacizumab from NPinPMP was evaluated using noninvasive fluorophotometry after intravitreal administration of Alexa Flour 488 conjugated bevacizumab in either solution or NPinPMP in a rat model. Unlike the vitreal signal from Alexa-bevacizumab solution, which reached baseline at 2 weeks, release of Alexa-bevacizumab from NPinPMP could be detected for 2 months. Thus, NPinPMP is a novel sustained release system for protein drugs to reduce frequency of protein injections in the therapy of back of the eye diseases. PMID:24131101

Nanoparticles in porous microparticles prepared by supercritical infusion and pressure quench technology for sustained delivery of bevacizumab.

Science.gov (United States)

Yandrapu, Sarath K; Upadhyay, Arun K; Petrash, J Mark; Kompella, Uday B

2013-12-02

Nanoparticles in porous microparticles (NPinPMP), a novel delivery system for sustained delivery of protein drugs, was developed using supercritical infusion and pressure quench technology, which does not expose proteins to organic solvents or sonication. The delivery system design is based on the ability of supercritical carbon dioxide (SC CO2) to expand poly(lactic-co-glycolic) acid (PLGA) matrix but not polylactic acid (PLA) matrix. The technology was applied to bevacizumab, a protein drug administered once a month intravitreally to treat wet age related macular degeneration. Bevacizumab coated PLA nanoparticles were encapsulated into porosifying PLGA microparticles by exposing the mixture to SC CO2. After SC CO2 exposure, the size of PLGA microparticles increased by 6.9-fold. Confocal and scanning electron microscopy studies demonstrated the expansion and porosification of PLGA microparticles and infusion of PLA nanoparticles inside PLGA microparticles. In vitro release of bevacizumab from NPinPMP was sustained for 4 months. Size exclusion chromatography, fluorescence spectroscopy, circular dichroism spectroscopy, SDS-PAGE, and ELISA studies indicated that the released bevacizumab maintained its monomeric form, conformation, and activity. Further, in vivo delivery of bevacizumab from NPinPMP was evaluated using noninvasive fluorophotometry after intravitreal administration of Alexa Fluor 488 conjugated bevacizumab in either solution or NPinPMP in a rat model. Unlike the vitreal signal from Alexa-bevacizumab solution, which reached baseline at 2 weeks, release of Alexa-bevacizumab from NPinPMP could be detected for 2 months. Thus, NPinPMP is a novel sustained release system for protein drugs to reduce frequency of protein injections in the therapy of back of the eye diseases.

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

Science.gov (United States)

Hasnine, M.; Tolla, B.; Vahora, N.

2018-04-01

This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

Science.gov (United States)

Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

2001-01-01

The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

Electrochemistry in supercritical fluids

Science.gov (United States)

Branch, Jack A.; Bartlett, Philip N.

2015-01-01

A wide range of supercritical fluids (SCFs) have been studied as solvents for electrochemistry with carbon dioxide and hydrofluorocarbons (HFCs) being the most extensively studied. Recent advances have shown that it is possible to get well-resolved voltammetry in SCFs by suitable choice of the conditions and the electrolyte. In this review, we discuss the voltammetry obtained in these systems, studies of the double-layer capacitance, work on the electrodeposition of metals into high aspect ratio nanopores and the use of metallocenes as redox probes and standards in both supercritical carbon dioxide–acetonitrile and supercritical HFCs. PMID:26574527

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

Fiscal 1997 report on the results of the introductory R and D of the New Sunshine Project under a consignment from NEDO. Introductory R and D of the supercritical fluid use technology; 1997 nendo `New Sunshine keikaku` sendo kenkyu kaihatsu Shin Energy Sangyo Gijutsu Sogo Kaihatsu Kiko itaku. Chorinkai ryutai riyo gijutsu sendo kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

1998-03-01

The R and D of chemical reaction using supercritical fluids started in fiscal 1997. In the R and D of solvent reaction, as the research on polymer decomposition with supercritical water, studies were conducted of the mechanism of conversion reaction to chemical materials, cleavage mechanism of stable chemical bonds, and synthetic reaction in the supercritical state reaction field. In the research on oxidation reaction, as the study of complete oxidation in supercritical water for high efficiency energy recovery, studies of complete oxidation of liquid fuels, and complete oxidation of solid fuels. In the research on hydrogenation, studies of lightening of heavy oil in supercritical water, etc. In the R and D of the basic technology, studies of corrosion mechanism of metals in supercritical water, construction of the basic framework for technical database of supercritical fluids, etc. In the survey of technical trends and new research themes, the introductory R and D of element technology, etc. were conducted, and the results were described of the survey of technical trends and new research themes and the trend survey of overseas technology. 314 refs., 87 figs., 81 tabs.

Supercritical CO2 Compressor with Active Magnetic Bearing

International Nuclear Information System (INIS)

Cha, Jae Eun; Cho, Seong Kuk; Lee, JeKyoung; Lee, Jeong Ik

2016-01-01

For the stable operation of the sCO 2 integral test facility SCIEL, KAERI prepared Active Magnetic Bearing sCO 2 compressor for the 70,000RPM operation. Power generation test with AMB compressor will be finished within first half year of 2016 under supercritical state. The principal advantages of the sCO 2 Cycle are high efficiency at moderate temperature range, compact components size, simple cycle configuration, and compatibility with various heat sources. The Supercritical CO 2 Brayton Cycle Integral Experiment Loop (SCIEL) has been installed in Korea Atomic Energy Research Institute (KAERI) to develop the base technologies for the sCO 2 cycle power generation system. The operation of the SCIEL has mainly focused on sCO 2 compressor development and establishing sCO 2 system control logic

State of the art on the heat transfer experiments under supercritical pressure condition

International Nuclear Information System (INIS)

Kim, Hwan Yeol; Song, Chul Hwa

2003-07-01

The SCWR(Super-Critical Water cooled Reactor) is one of the six reactor candidates selected in the Gen-IV project which aims at the development of new reactors with enhanced economy and safety. The SCWR is considered to be a feasible concept of new nuclear power plant if the existing technologies developed in fossil fuel fired plant and LWR technologies together with additional research on several disciplines such as materials, water chemistry and safety. As KAERI takes part in the GIF(Generation IV Forum) for the Gen-IV project, domestic concerns about the SCWR have been recently increased. In order to establish a foundation for the development of SCWR, efforts should be concentrated on the conceptual design of systems and the associated key experiments as well. Heat transfer experiments, among others, under supercritical condition are required for the proper prediction of thermal hydraulic phenomena, which are essential for the thermal hydraulic designs of reactor core. Nevertheless, the experiments have not been performed in Korea yet. This report deals with fundamental surveys on the heat transfer experiments under supercritical conditions, which are required for the understanding of heat transfer characteristics for the thermal hydraulic designs of supercritical reactor core. Investigations on the physical properties of water and CO 2 showed that the physical properties such as density, specific heat, viscosity and thermal conductivity are significantly changed near the pseudo-critical points. The state of the art on the heat transfer characteristics in relation with heat transfer deterioration and heat transfer coefficient is briefly described. In addition, previous experiments with supercritical water as well as supercritical CO 2 and Freon used for an alternating fluid are presented

State of the art on the heat transfer experiments under supercritical pressure condition

Energy Technology Data Exchange (ETDEWEB)

Kim, Hwan Yeol; Song, Chul Hwa

2003-07-01

The SCWR(Super-Critical Water cooled Reactor) is one of the six reactor candidates selected in the Gen-IV project which aims at the development of new reactors with enhanced economy and safety. The SCWR is considered to be a feasible concept of new nuclear power plant if the existing technologies developed in fossil fuel fired plant and LWR technologies together with additional research on several disciplines such as materials, water chemistry and safety. As KAERI takes part in the GIF(Generation IV Forum) for the Gen-IV project, domestic concerns about the SCWR have been recently increased. In order to establish a foundation for the development of SCWR, efforts should be concentrated on the conceptual design of systems and the associated key experiments as well. Heat transfer experiments, among others, under supercritical condition are required for the proper prediction of thermal hydraulic phenomena, which are essential for the thermal hydraulic designs of reactor core. Nevertheless, the experiments have not been performed in Korea yet. This report deals with fundamental surveys on the heat transfer experiments under supercritical conditions, which are required for the understanding of heat transfer characteristics for the thermal hydraulic designs of supercritical reactor core. Investigations on the physical properties of water and CO{sub 2} showed that the physical properties such as density, specific heat, viscosity and thermal conductivity are significantly changed near the pseudo-critical points. The state of the art on the heat transfer characteristics in relation with heat transfer deterioration and heat transfer coefficient is briefly described. In addition, previous experiments with supercritical water as well as supercritical CO{sub 2} and Freon used for an alternating fluid are presented.

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Directory of Open Access Journals (Sweden)

Benabou Lahouari

2014-06-01

Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

DEFF Research Database (Denmark)

Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

2009-01-01

of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

International Nuclear Information System (INIS)

Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

2014-01-01

With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

Dissolution ad uptake of cadmium from dental gold solder alloy implants

International Nuclear Information System (INIS)

Bergman, B.; Bergman, M.; Soeremark, R.

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

Dissolution and uptake of cadmium from dental gold solder alloy implants

Energy Technology Data Exchange (ETDEWEB)

Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

Science.gov (United States)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

Science.gov (United States)

Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

2005-04-01

Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

Novel micronisation β-carotene using rapid expansion supercritical solution with co-solvent

Science.gov (United States)

Kien, Le Anh

2017-09-01

Rapid expansion of supercritical solution (RESS) is the most common approach of pharmaceutical pacticle forming methods using supercritical fluids. The RESS method is a technology producing a small solid product with a very narrow particle size distribution, organic solvent-free particles. This process is also simple and easy to control the operating parameters in comparision with other ways based on supercritical techniques. In this study, β-carotene, a strongly colored red-orange pigment abundant in plants and fruits, has been forming by RESS. In addition, the size and morphology effect of four different RESS parameters including co-solvent, extraction temperature, and extraction pressure and expansion nozzle temperature has surveyed. The particle size distribution has been determined by using laser diffraction experiment. SEM has conducted to analyze the surface structure, DSC and FTIR for thermal and chemical structure analysis.

Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

International Nuclear Information System (INIS)

Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

2005-01-01

A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

Directory of Open Access Journals (Sweden)

D. Heinemann

2016-06-01

Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

Pharmaceutical production of nano particles using supercritical or dense gas technology

International Nuclear Information System (INIS)

Regtop, H.

2002-01-01

. Dense gas technology using fluids, near or above the critical point, as a solvent or antisolvent have been developed in recent years. Eiffel has considered various dense gas methods as in the production of nano particles. The first method is known as Rapid Expansion of Supercritical Solutions (RESS), and involves expanding a supercritical solution of the drug through a nozzle. Whilst providing very effective methods of producing fine particles, the application of the RESS method is limited by the low solubility of drugs in dense carbon dioxide (which is usually the gas of choice since it is operated at moderate critical temperature of 31.1 degrees centigrade). The second method, known as Gas Antisolvent Process (GAS), involves rapid precipitation of the drug from organic solutions, typically using carbon dioxide as the antisolvent. The third mode which is called the Aerosol Solvent Extraction System (ASES), involves continuous introduction of a solution containing the drug of interest through a nozzle into a flowing dense gas stream

PFC Performance Improvement of Ultra-supercritical Secondary Reheat Unit

Directory of Open Access Journals (Sweden)

Li Jun

2018-01-01

Full Text Available Ultra-supercritical secondary reheat unit has been widely used in the world because of its advantages of large capacity, low consumption and high efficiency etc., but rapid load change ability of the turbines to be weakened which caused by its system organization, cannot meet the requirements of power grid frequency modulation. Based on the analysis of the control characteristics of ultra-supercritical once-through reheat unit, the primary frequency control based on feed-water flow overshoot compensation is proposed. The main steam pressure generated by the feed-water is changed to improve the primary frequency control capability. The relevant control strategy has been applied to the 1000MW secondary reheating unit. The results show that the technology is feasible and has high economical efficiency.

Synthesis of alumina nano-sheets via supercritical fluid technology with high uranyl adsorptive capacity

International Nuclear Information System (INIS)

Jing Yu; Jun Wang; Zhanshuang Li; Qi Liu; Milin Zhang; Hongbin Bai; Caishan Jiao; Jun Wang; Lianhe Liu

2012-01-01

Supercritical carbon dioxide is beneficial to the synthesis of superior ultrafine and uniform materials due to its high chemical stability, low viscosity, high diffusivity, and 'zero' surface tension. γ-Alumina nano-sheets were obtained by a simple hydrothermal route in the presence of supercritical carbon dioxide. XRD, FTIR, SEM, TEM and nitrogen sorption isotherm were employed to characterize the samples. Alumina as-prepared has a high specific surface area of up to 200 ± 6 m 2 g -1 , which presents a high adsorption capacity (4.66 ± 0.02 mg g -1 ) for uranyl ions from aqueous solution. Furthermore, the adsorption process was found to be endothermic and spontaneous in nature. (authors)

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

Science.gov (United States)

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

Features of supercritical carbon dioxide Brayton cycle coupled with reactor

International Nuclear Information System (INIS)

Duan Chengjie; Wang Jie; Yang Xiaoyong

2010-01-01

In order to obtain acceptable cycle efficiency, current helium gas turbine power cycle technology needs high cycle temperature which means that the cycle needs high core-out temperature. The technology has high requirements on reactor structure and fuel elements materials, and also on turbine manufacture. While utilizing CO 2 as cycle working fluid, it can guarantee to lower the cycle temperature and turbo machine Janume but achieve the same cycle efficiency, so as to enhance the safety and economy of reactor. According to the laws of thermodynamics, a calculation model of supercritical CO 2 power cycle was established to analyze the feature, and the decisive parameters of the cycle and also investigate the effect of each parameter on the cycle efficiency in detail were obtained. The results show that supercritical CO 2 power cycle can achieve quite satisfied efficiency at a lower cycle highest temperature than helium cycle, and CO 2 is a promising working fluid. (authors)

The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

Directory of Open Access Journals (Sweden)

Zoltán Weltsch

2012-11-01

Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

NARCIS (Netherlands)

Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

2009-01-01

The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Science.gov (United States)

Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

2012-07-01

Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

Advanced Thermal Storage for Central Receivers with Supercritical Coolants

Energy Technology Data Exchange (ETDEWEB)

Kelly, Bruce D.

2010-06-15

The principal objective of the study is to determine if supercritical heat transport fluids in a central receiver power plant, in combination with ceramic thermocline storage systems, offer a reduction in levelized energy cost over a baseline nitrate salt concept. The baseline concept uses a nitrate salt receiver, two-tank (hot and cold) nitrate salt thermal storage, and a subcritical Rankine cycle. A total of 6 plant designs were analyzed, as follows: Plant Designation Receiver Fluid Thermal Storage Rankine Cycle Subcritical nitrate salt Nitrate salt Two tank nitrate salt Subcritical Supercritical nitrate salt Nitrate salt Two tank nitrate salt Supercritical Low temperature H2O Supercritical H2O Two tank nitrate salt Supercritical High temperature H2O Supercritical H2O Packed bed thermocline Supercritical Low temperature CO2 Supercritical CO2 Two tank nitrate salt Supercritical High temperature CO2 Supercritical CO2 Packed bed thermocline Supercritical Several conclusions have been drawn from the results of the study, as follows: 1) The use of supercritical H2O as the heat transport fluid in a packed bed thermocline is likely not a practical approach. The specific heat of the fluid is a strong function of the temperatures at values near 400 °C, and the temperature profile in the bed during a charging cycle is markedly different than the profile during a discharging cycle. 2) The use of supercritical CO2 as the heat transport fluid in a packed bed thermocline is judged to be technically feasible. Nonetheless, the high operating pressures for the supercritical fluid require the use of pressure vessels to contain the storage inventory. The unit cost of the two-tank nitrate salt system is approximately $24/kWht, while the unit cost of the high pressure thermocline system is nominally 10 times as high. 3) For the supercritical fluids, the outer crown temperatures of the receiver tubes are in the range of 700 to 800 °C. At temperatures of 700 °C and above

Supercritical transitiometry of polymers.

Science.gov (United States)

Randzio, S L; Grolier, J P

1998-06-01

Employing supercritical fluids (SCFs) during polymers processing allows the unusual properties of SCFs to be exploited for making polymer products that cannot be obtained by other means. A new supercritical transitiometer has been constructed to permit study of the interactions of SCFs with polymers during processing under well-defined conditions of temperature and pressure. The supercritical transitiometer allows pressure to be exerted by either a supercritical fluid or a neutral medium and enables simultaneous determination of four basic parameters of a transition, i.e., p, T, Δ(tr)H and Δ(tr)V. This permits determination of the SCF effect on modification of the polymer structure at a given pressure and temperature and defines conditions to allow reproducible preparation of new polymer structures. Study of a semicrystalline polyethylene by this method has defined conditions for preparation of new microfoamed phases with good mechanical properties. The low densities and microporous structures of the new materials may make them useful for applications in medicine, pharmacy, or the food industry, for example.

Pressure drop and friction factor correlations of supercritical flow

International Nuclear Information System (INIS)

Fang Xiande; Xu Yu; Su Xianghui; Shi Rongrong

2012-01-01

Highlights: ► Survey and evaluation of friction factor models for supercritical flow. ► Survey of experimental study of supercritical flow. ► New correlation of friction factor for supercritical flow. - Abstract: The determination of the in-tube friction pressure drop under supercritical conditions is important to the design, analysis and simulation of transcritical cycles of air conditioning and heat pump systems, nuclear reactor cooling systems and some other systems. A number of correlations for supercritical friction factors have been proposed. Their accuracy and applicability should be examined. This paper provides a comprehensive survey of experimental investigations into the pressure drop of supercritical flow in the past decade and a comparative study of supercritical friction factor correlations. Our analysis shows that none of the existing correlations is completely satisfactory, that there are contradictions between the existing experimental results and thus more elaborate experiments are needed, and that the tube roughness should be considered. A new friction factor correlation for supercritical tube flow is proposed based on 390 experimental data from the available literature, including 263 data of supercritical R410A cooling, 45 data of supercritical R404A cooling, 64 data of supercritical carbon dioxide (CO 2 ) cooling and 18 data of supercritical R22 heating. Compared with the best existing model, the new correlation increases the accuracy by more than 10%.

Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

Degradation Characteristics of Wood Using Supercritical Alcohols

Directory of Open Access Journals (Sweden)

Jeeban Poudel

2012-11-01

Full Text Available In this work, the characteristics of wood degradation using supercritical alcohols have been studied. Supercritical ethanol and supercritical methanol were used as solvents. The kinetics of wood degradation were analyzed using the nonisothermal weight loss technique with heating rates of 3.1, 9.8, and 14.5 °C/min for ethanol and 5.2, 11.3, and 16.3 °C/min for methanol. Three different kinetic analysis methods were implemented to obtain the apparent activation energy and the overall reaction order for wood degradation using supercritical alcohols. These were used to compare with previous data for supercritical methanol. From this work, the activation energies of wood degradation in supercritical ethanol were obtained as 78.0–86.0, 40.1–48.1, and 114 kJ/mol for the different kinetic analysis methods used in this work. The activation energies of wood degradation in supercritical ethanol were obtained as 78.0–86.0, 40.1–48.1, and 114 kJ/mol. This paper also includes the analysis of the liquid products obtained from this work. The characteristic analysis of liquid products on increasing reaction temperature and time has been performed by GC-MS. The liquid products were categorized according to carbon numbers and aromatic/aliphatic components. It was found that higher conversion in supercritical ethanol occurs at a lower temperature than that of supercritical methanol. The product analysis shows that the majority of products fall in the 2 to 15 carbon number range.

Delocalized organic pollutant destruction through a self-sustaining supercritical water oxidation process

International Nuclear Information System (INIS)

Lavric, E.D.; Weyten, H.; Ruyck, J. de; Plesu, V.; Lavric, V.

2005-01-01

Supercritical water oxidation (SCWO) is a recent development aiming at the destruction of organic pollutants present with low concentrations in waste waters. The present paper focuses on the process simulation of SCWO with emphasis on the proper modelling of supercritical thermodynamic conditions and on the possibility to make the SCWO process self-sufficient from the energetic viewpoint. Self-sufficiency may be of interest to encourage more delocalization of waste water treatment. The process of SCWO for dilute waste water (no more than 5 wt.%) is modelled through the ASPEN Plus copyright process simulator. Studies were made to search for energetic self-sufficiency conditions using various technologies for power production from the heat of reaction, like supercritical water expansion in a turbine, use of a closed Brayton cycle (CBC) and use of an organic Rankine cycle (ORC). The results obtained showed that the process is energetically self-sufficient using either a small supercritical turbine, or an ORC. In less restrictive conditions regarding the component efficiencies, the CBC, in theory, also leads to self-sufficiency, but from the analysis, it appears that this solution is less realistic

Preparation of acellular scaffold for corneal tissue engineering by supercritical carbon dioxide extraction technology.

Science.gov (United States)

Huang, Yi-Hsun; Tseng, Fan-Wei; Chang, Wen-Hsin; Peng, I-Chen; Hsieh, Dar-Jen; Wu, Shu-Wei; Yeh, Ming-Long

2017-08-01

In this study, we developed a novel method using supercritical carbon dioxide (SCCO 2 ) to prepare acellular porcine cornea (APC). Under gentle extraction conditions using SCCO 2 technology, hematoxylin and eosin staining showed that cells were completely lysed, and cell debris, including nuclei, was efficiently removed from the porcine cornea. The SCCO 2 -treated corneas exhibited intact stromal structures and appropriate mechanical properties. Moreover, no immunological reactions and neovascularization were observed after lamellar keratoplasty in rabbits. All transplanted grafts and animals survived without complications. The transplanted APCs were opaque after the operation but became transparent within 2weeks. Complete re-epithelialization of the transplanted APCs was observed within 4weeks. In conclusion, APCs produced by SCCO 2 extraction technology could be an ideal and useful scaffold for corneal tissue engineering. We decellularized the porcine cornea using SCCO 2 extraction technology and investigated the characteristics, mechanical properties, and biocompatibility of the decellularized porcine cornea by lamellar keratoplasty in rabbits. To the best of our knowledge, this is the first report describing the use of SCCO 2 extraction technology for preparation of acellular corneal scaffold. We proved that the cellular components of porcine corneas had been efficiently removed, and the biomechanical properties of the scaffold were well preserved by SCCO 2 extraction technology. SCCO 2 -treated corneas maintained optical transparency and exhibited appropriate strength to withstand surgical procedures. In vivo, the transplanted corneas showed no evidence of immunological reactions and exhibited good biocompatibility and long-term stability. Our results suggested that the APCs developed by SCCO 2 extraction technology could be an ideal and useful scaffold for corneal replacement and corneal tissue engineering. Copyright © 2017 Acta Materialia Inc. Published by

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Energy Technology Data Exchange (ETDEWEB)

Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

2015-03-15

Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

Supercritical fluids in ionic liquids

NARCIS (Netherlands)

Kroon, M.C.; Peters, C.J.; Plechkova, N.V.; Seddon, K.R.

2014-01-01

Ionic liquids and supercritical fluids are both alternative environmentally benign solvents, but their properties are very different. Ionic liquids are non-volatile but often considered highly polar compounds, whereas supercritical fluids are non-polar but highly volatile compounds. The combination

PULSE RADIOLYSIS IN SUPERCRITICAL RARE GAS FLUIDS

International Nuclear Information System (INIS)

HOLROYD, R.

2007-01-01

Recently, supercritical fluids have become quite popular in chemical and semiconductor industries for applications in chemical synthesis, extraction, separation processes, and surface cleaning. These applications are based on: the high dissolving power due to density build-up around solute molecules, and the ability to tune the conditions of a supercritical fluid, such as density and temperature, that are most suitable for a particular reaction. The rare gases also possess these properties and have the added advantage of being supercritical at room temperature. Information about the density buildup around both charged and neutral species can be obtained from fundamental studies of volume changes in the reactions of charged species in supercritical fluids. Volume changes are much larger in supercritical fluids than in ordinary solvents because of their higher compressibility. Hopefully basic studies, such as discussed here, of the behavior of charged species in supercritical gases will provide information useful for the utilization of these solvents in industrial applications

Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

CERN Document Server

Strand, Frode Sneve

2015-01-01

An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

Supercritical fluid chromatography

Science.gov (United States)

Vigdergauz, M. S.; Lobachev, A. L.; Lobacheva, I. V.; Platonov, I. A.

1992-03-01

The characteristic features of supercritical fluid chromatography (SCFC) are examined and there is a brief historical note concerning the development of the method. Information concerning the use of supercritical fluid chromatography in the analysis of objects of different nature is presented in the form of a table. The roles of the mobile and stationary phases in the separation process and the characteristic features of the apparatus and of the use of the method in physicochemical research are discussed. The bibliography includes 364 references.

Development of ultra supercritical (USC) power plant

Energy Technology Data Exchange (ETDEWEB)

Chang, Sung Ho; Kim, Bum Soo [KEPCO Research Institute, Daejeon (Korea, Republic of); Min, Taek Ki [Chung Nat' l Univ., Cheongwon (Korea, Republic of)

2012-02-15

For environmental reasons and because of our limited energy resources, high efficiency power generation technology will be necessary in the future. Ultra supercritical (USC) power generation technology is the key to managing the greenhouse gas problems and energy resource problems discussed in the Kyoto Protocol to the United Nations Framework Convention on Climate Change. Other countries and manufacturers are trying to build commercial power plants. In this paper, an efficient method of achieving near zero emission operation of a high efficiency fossil power plant using USC power generation is discussed. Development of USC power generation in Korea has been supported by the Korean government in two phases: Phase I was USC key technology development from 2002 to 2008, and Phase II is USC development and technology optimization from 2010 to 2017.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

International Nuclear Information System (INIS)

Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

2017-01-01

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

2017-02-15

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

Science.gov (United States)

Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

2017-10-01

Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Correlation of supercritical-fluid extraction recoveries with supercritical-fluid chromatographic retention data: A fundamental study

NARCIS (Netherlands)

Lou, X.W.; Janssen, J.G.M.; Cramers, C.A.M.G.

1995-01-01

The possibility of using supercritical-fluid chromatographic retention data for examining the effects of operational parameters, such as pressure and flow rate, on the extraction characteristics in supercritical-fluid extraction (SFE) was investigated. A model was derived for calculating the

Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

International Nuclear Information System (INIS)

Olesinska, W.; Kesik, J.

2003-01-01

The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

Green biodiesel production: a review on feedstock, catalyst, monolithic reactor, and supercritical fluid technology

Directory of Open Access Journals (Sweden)

Rizo Edwin Gumba

2016-09-01

Full Text Available The advancement of alternative energy is primarily catalyzed by the negative environmental impacts and energy depletion caused by the excessive usage of fossil fuels. Biodiesel has emerged as a promising substitute to petrodiesel because it is biodegradable, less toxic, and reduces greenhouse gas emission. Apart from that, biodiesel can be used as blending component or direct replacements for diesel fuel in automotive engines. A diverse range of methods have been reported for the conversion of renewable feedstocks (vegetable oil or animal fat into biodiesel with transesterification being the most preferred method. Nevertheless, the cost of producing biodiesel is higher compared to fossil fuel, thus impeding its commercialization potentials. The limited source of reliable feedstock and the underdeveloped biodiesel production route have prevented the full-scale commercialization of biodiesel in many parts of the world. In a recent development, a new technology that incorporates monoliths as support matrices for enzyme immobilization in supercritical carbon dioxide (SC-CO2 for continuous biodiesel production has been proposed to solve the problem. The potential of SC-CO2 system to be applied in enzymatic reactors is not well documented and hence the purpose of this review is to highlight the previous studies conducted as well as the future direction of this technology.

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

Science.gov (United States)

Jang, Guh-Yaw; Duh, Jenq-Gong

2005-01-01

The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Directory of Open Access Journals (Sweden)

Soares D.

2007-01-01

Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

An Energy Analysis on Gasification of Sewage Sludge by a Direct Injection in Supercritical Water

NARCIS (Netherlands)

Yukananto, Riza; Louwes, Alexander Charnchai; Bramer, Eduard A.; Brem, Gerrit

2017-01-01

Supercritical Water Gasification is an efficient technology in converting wet biomass into H2 and CH4 in comparison to other conventional thermochemical processes. Coke deposition, however, remains as a major challenge in this technology. Coke formation is the result of polymerization reactions that

Development of Pb-Free Nanocomposite Solder Alloys

Directory of Open Access Journals (Sweden)

Animesh K. Basak

2018-04-01

Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

Science.gov (United States)

Tucker, Jonathon P.

As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

DEFF Research Database (Denmark)

Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2016-01-01

No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Science.gov (United States)

Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

2011-09-01

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

Directory of Open Access Journals (Sweden)

Mohammad Sadegh Nourbakhsh

2010-12-01

Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

Supercritical water natural circulation flow stability experiment research

Energy Technology Data Exchange (ETDEWEB)

Ma, Dongliang; Zhou, Tao; Li, Bing [North China Electric Power Univ., Beijing (China). School of Nuclear Science and Engineering; North China Electric Power Univ., Beijing (China). Inst. of Nuclear Thermalhydraulic Safety and Standardization; North China Electric Power Univ., Beijing (China). Beijing Key Lab. of Passive Safety Technology for Nuclear Energy; Huang, Yanping [Nuclear Power Institute of China, Chengdu (China). Science and Technology on Reactor System Design Technology Lab.

2017-12-15

The Thermal hydraulic characteristics of supercritical water natural circulation plays an important role in the safety of the Generation-IV supercritical water-cooled reactors. Hence it is crucial to conduct the natural circulation heat transfer experiment of supercritical water. The heat transfer characteristics have been studied under different system pressures in the natural circulation systems. Results show that the fluctuations in the subcritical flow rate (for natural circulation) is relatively small, as compared to the supercritical flow rate. By increasing the heating power, it is observed that the amplitude (and time period) of the fluctuation tends to become larger for the natural circulation of supercritical water. This tends to show the presence of flow instability in the supercritical water. It is possible to observe the flow instability phenomenon when the system pressure is suddenly reduced from the supercritical pressure state to the subcritical state. At the test outlet section, the temperature is prone to increase suddenly, whereas the blocking effect may be observed in the inlet section of the experiment.

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

Science.gov (United States)

Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

2014-01-01

A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

Numerical Investigation on Supercritical Heat Transfer of RP3 Kerosene Flowing inside a Cooling Channel of Scramjet

Directory of Open Access Journals (Sweden)

Ning Wang

2014-06-01

Full Text Available Supercritical convective heat transfer characteristics of hydrocarbon fuel play a fundamental role in the active cooling technology of scramjet. In this paper, a 2D-axisymmetric numerical study of supercritical heat transfer of RP3 flowing inside the cooling channels of scramjet has been conducted. The main thermophysical properties of RP3, including density, specific heat, and thermal conductivity, are obtained from experimental data, while viscosity is evaluated from a commercial code with a ten-species surrogate. Effects of heat flux, mass flow rate, and inlet temperature on supercritical heat transfer processes have been investigated. Results indicate that when the wall temperature rises above the pseudocritical temperature of RP3, heat transfer coefficient decreases as a result of drastic decrease of the specific heat. The conventional heat transfer correlations, that is, Gnielinski formula, are no longer proper for the supercritical heat transfer of RP3. The modified Jackson and Hall formula, which was proposed for supercritical CO2 and water, gives good prediction except when the wall temperature is near or higher than the pseudocritical temperature.

THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

Directory of Open Access Journals (Sweden)

N. V. Astredinova

2014-01-01

Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

Science.gov (United States)

Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

1998-07-01

Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

Supercritical CO{sub 2} Compressor with Active Magnetic Bearing

Energy Technology Data Exchange (ETDEWEB)

Cha, Jae Eun [KAERI, Daejeon (Korea, Republic of); Cho, Seong Kuk; Lee, JeKyoung; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

2016-05-15

For the stable operation of the sCO{sub 2} integral test facility SCIEL, KAERI prepared Active Magnetic Bearing sCO{sub 2} compressor for the 70,000RPM operation. Power generation test with AMB compressor will be finished within first half year of 2016 under supercritical state. The principal advantages of the sCO{sub 2} Cycle are high efficiency at moderate temperature range, compact components size, simple cycle configuration, and compatibility with various heat sources. The Supercritical CO{sub 2} Brayton Cycle Integral Experiment Loop (SCIEL) has been installed in Korea Atomic Energy Research Institute (KAERI) to develop the base technologies for the sCO{sub 2} cycle power generation system. The operation of the SCIEL has mainly focused on sCO{sub 2} compressor development and establishing sCO{sub 2} system control logic.

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

International Nuclear Information System (INIS)

Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

2014-01-01

Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

2014-01-05

Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

Effects of Supercritical Environment on Hydrocarbon-fuel Injection

Institute of Scientific and Technical Information of China (English)

Bongchul Shin; Dohun Kim; Min Son; Jaye Koo

2017-01-01

In this study,the effects of environment conditions on decane were investigated.Decane was injected in subcritical and supercritical ambient conditions.The visualization chamber was pressurized to 1.68 MPa by using nitrogen gas at a temperature of 653 K for subcritical ambient conditions.For supercritical ambient conditions,the visualization chamber was pressurized to 2.52 MPa by using helium at a temperature of 653 K.The decane injection in the pressurized chamber was visualized via a shadowgraph technique and gradient images were obtained by a post processing method.A large variation in density gradient was observed at jet interface in the case of subcritical injection in subcritical ambient conditions.Conversely,for supercritical injection in supercritical ambient conditions,a small density gradient was observed at the jet interface.In a manner similar to that observed in other cases,supercritical injection in subcritical ambient conditions differed from supercritical ambient conditions such as sphere shape liquid.Additionally,there were changes in the interface,and the supercritical injection core width was thicker than that in the subcritical injection.Furthermore,in cases with the same injection conditions,the change in the supercritical ambient normalized core width was smaller than the change in the subcritical ambient normalized core width owing to high specific heat at the supercritical injection and small phase change at the interface.Therefore,the interface was affected by the changing ambient condition.Given that the effect of changing the thermodynamic properties of propellants could be essential for a variable thrust rocket engine,the effects of the ambient conditions were investigated experimentally.

Effects of supercritical environment on hydrocarbon-fuel injection

Science.gov (United States)

Shin, Bongchul; Kim, Dohun; Son, Min; Koo, Jaye

2017-04-01

In this study, the effects of environment conditions on decane were investigated. Decane was injected in subcritical and supercritical ambient conditions. The visualization chamber was pressurized to 1.68 MPa by using nitrogen gas at a temperature of 653 K for subcritical ambient conditions. For supercritical ambient conditions, the visualization chamber was pressurized to 2.52 MPa by using helium at a temperature of 653 K. The decane injection in the pressurized chamber was visualized via a shadowgraph technique and gradient images were obtained by a post processing method. A large variation in density gradient was observed at jet interface in the case of subcritical injection in subcritical ambient conditions. Conversely, for supercritical injection in supercritical ambient conditions, a small density gradient was observed at the jet interface. In a manner similar to that observed in other cases, supercritical injection in subcritical ambient conditions differed from supercritical ambient conditions such as sphere shape liquid. Additionally, there were changes in the interface, and the supercritical injection core width was thicker than that in the subcritical injection. Furthermore, in cases with the same injection conditions, the change in the supercritical ambient normalized core width was smaller than the change in the subcritical ambient normalized core width owing to high specific heat at the supercritical injection and small phase change at the interface. Therefore, the interface was affected by the changing ambient condition. Given that the effect of changing the thermodynamic properties of propellants could be essential for a variable thrust rocket engine, the effects of the ambient conditions were investigated experimentally.

Prediction of supercritical carbon dioxide drying of food products in packed beds

NARCIS (Netherlands)

Almeida-Rivera, C.; Khalloufi, S.; Bongers, P.M.M.

2010-01-01

Drying assisted by supercritical carbon dioxide is foreseen to become a promising technology for sensitive food products. In this contribution, a mathematical model is derived to describe the changes in water concentration in both a solid food matrix and a fluid carrier during drying. Finite

Geothermal energy production with supercritical fluids

Science.gov (United States)

Brown, Donald W.

2003-12-30

There has been invented a method for producing geothermal energy using supercritical fluids for creation of the underground reservoir, production of the geothermal energy, and for heat transport. Underground reservoirs are created by pumping a supercritical fluid such as carbon dioxide into a formation to fracture the rock. Once the reservoir is formed, the same supercritical fluid is allowed to heat up and expand, then is pumped out of the reservoir to transfer the heat to a surface power generating plant or other application.

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Science.gov (United States)

Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

2015-09-01

Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

Effects of PCB thickness on adjustable fountain wave soldering

Indian Academy of Sciences (India)

hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

Bio-oil production from biomass via supercritical fluid extraction

Energy Technology Data Exchange (ETDEWEB)

Durak, Halil, E-mail: halildurak@yyu.edu.tr [Yuzuncu Yıl University, Vocational School of Health Services, 65080, Van (Turkey)

2016-04-18

Supercritical fluid extraction is used for producing bio-fuel from biomass. Supercritical fluid extraction process under supercritical conditions is the thermally disruption process of the lignocellulose or other organic materials at 250-400 °C temperature range under high pressure (4-5 MPa). Supercritical fluid extraction trials were performed in a cylindrical reactor (75 mL) in organic solvents (acetone, ethanol) under supercritical conditions with (calcium hydroxide, sodium carbonate) and without catalyst at the temperatures of 250, 275 and 300 °C. The produced liquids at 300 °C in supercritical liquefaction were analyzed and characterized by elemental, GC-MS and FT-IR. 36 and 37 different types of compounds were identified by GC-MS obtained in acetone and ethanol respectively.

Bio-oil production from biomass via supercritical fluid extraction

International Nuclear Information System (INIS)

Durak, Halil

2016-01-01

Supercritical fluid extraction is used for producing bio-fuel from biomass. Supercritical fluid extraction process under supercritical conditions is the thermally disruption process of the lignocellulose or other organic materials at 250-400 °C temperature range under high pressure (4-5 MPa). Supercritical fluid extraction trials were performed in a cylindrical reactor (75 mL) in organic solvents (acetone, ethanol) under supercritical conditions with (calcium hydroxide, sodium carbonate) and without catalyst at the temperatures of 250, 275 and 300 °C. The produced liquids at 300 °C in supercritical liquefaction were analyzed and characterized by elemental, GC-MS and FT-IR. 36 and 37 different types of compounds were identified by GC-MS obtained in acetone and ethanol respectively.

Nanospot soldering polystyrene nanoparticles with an optical fiber probe laser irradiating a metallic AFM probe based on the near-field enhancement effect.

Science.gov (United States)

Cui, Jianlei; Yang, Lijun; Wang, Yang; Mei, Xuesong; Wang, Wenjun; Hou, Chaojian

2015-02-04

With the development of nanoscience and nanotechnology for the bottom-up nanofabrication of nanostructures formed from polystyrene nanoparticles, joining technology is an essential step in the manufacturing and assembly of nanodevices and nanostructures in order to provide mechanical integration and connection. To study the nanospot welding of polystyrene nanoparticles, we propose a new nanospot-soldering method using the near-field enhancement effect of a metallic atomic force microscope (AFM) probe tip that is irradiated by an optical fiber probe laser. On the basis of our theoretical analysis of the near-field enhancement effect, we set up an experimental system for nanospot soldering; this approach is carried out by using an optical fiber probe laser to irradiate the AFM probe tip to sinter the nanoparticles, providing a promising technical approach for the application of nanosoldering in nanoscience and nanotechnology.

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

International Nuclear Information System (INIS)

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

Fundamental R and D program on water chemistry of supercritical pressure water under radiation field

International Nuclear Information System (INIS)

Katsumura, Yosuke; Kiuchi, Kiyoshi; Wada, Yoichi; Yotsuyanagi, Tadasu

2003-01-01

In a supercritical water-cooled reactor, property of water changes significantly around the critical point. It is expected that irradiation and change of water property will affect the chemistry and material corrosion. Deep understanding of interactions between supercritical water and materials under irradiation is important. However, comprehensive data on radiolysis, kinetics, corrosion and thermodynamics have not been obtained due to the severe experimental condition. To get such data by experiments and computer simulations, a national program funded by Ministry of Education, Culture, Sports, Science and Technology (MEXT) has been started since December 2002. (author)

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

DEFF Research Database (Denmark)

Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

1998-01-01

: (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

Supercritical Fluids Processing of Biomass to Chemicals and Fuels

Energy Technology Data Exchange (ETDEWEB)

Olson, Norman K. [Iowa State Univ., Ames, IA (United States)

2011-09-28

The main objective of this project is to develop and/or enhance cost-effective methodologies for converting biomass into a wide variety of chemicals, fuels, and products using supercritical fluids. Supercritical fluids will be used both to perform reactions of biomass to chemicals and products as well as to perform extractions/separations of bio-based chemicals from non-homogeneous mixtures. This work supports the Biomass Program’s Thermochemical Platform Goals. Supercritical fluids are a thermochemical approach to processing biomass that, while aligned with the Biomass Program’s interests in gasification and pyrolysis, offer the potential for more precise and controllable reactions. Indeed, the literature with respect to the use of water as a supercritical fluid frequently refers to “supercritical water gasification” or “supercritical water pyrolysis.”

Transport properties of supercritical carbon dioxide

NARCIS (Netherlands)

Lavanchy, F.; Fourcade, E.; de Koeijer, E.A.; Wijers, J.G.; Meyer, T.; Keurentjes, J.T.F.; Kemmere, M.F.; Meyer, T.

2005-01-01

Recently, supercritical fluids have emerged as more sustainable alternatives for the organic solvents often used in polymer processes. This is the first book emphasizing the potential of supercritical carbon dioxide for polymer processes from an engineering point of view. It develops a

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Science.gov (United States)

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

Thermodynamic analysis of a directly heated oxyfuel supercritical power system

International Nuclear Information System (INIS)

Chowdhury, A.S.M. Arifur; Bugarin, Luz; Badhan, Antara; Choudhuri, Ahsan; Love, Norman

2016-01-01

Highlights: • A thermodynamic analysis of a supercritical power cycle is presented. • The supercritical power cycle is modeled using ASPEN HYSYS®. • A liquid methane and oxygen feed system is more efficient than a gaseous system. • CO_2 recirculated in gas form is 10.6% more efficient than when in liquid form. • Commercially available technologies permit liquid feed system delivery. - Abstract: Directly heated supercritical oxy-fuel gas turbines have potential to provide a higher thermal efficiency and lower pollutant emissions compared to current gas turbine systems. Motivated by the advantages of an oxyfuel-based directly heated supercritical power system, this paper presents an analysis of different operating conditions using ASPEN HYSYS®. This study first investigates the efficiency of gaseous or liquid methane and oxygen feed systems. T-s and P-v diagrams are generated and compared to each other to determine which is more efficient. The analysis revealed that the entropy generated during the combustion process for a liquid feed system is approximately three times higher than when methane and oxygen are compressed in gaseous form and delivered to the combustor and burned. To mitigate the high temperatures (3300 K) of the methane and oxygen combustion reaction, carbon dioxide is recirculated. For this portion of the system, the use of gaseous and liquid carbon dioxide recirculation loops and their corresponding efficiencies are determined. The investigation shows that the system yielded a higher net efficiency of 55.1% when gaseous carbon dioxide is recirculated as a diluent with liquid methane and oxygen delivery to the combustor.

Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

Directory of Open Access Journals (Sweden)

Abdoul-Aziz Bogno

2015-01-01

Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

Science.gov (United States)

Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

2015-08-01

The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

Recovery of cobalt from spent lithium-ion batteries using supercritical carbon dioxide extraction.

Science.gov (United States)

Bertuol, Daniel A; Machado, Caroline M; Silva, Mariana L; Calgaro, Camila O; Dotto, Guilherme L; Tanabe, Eduardo H

2016-05-01

Continuing technological development decreases the useful lifetime of electronic equipment, resulting in the generation of waste and the need for new and more efficient recycling processes. The objective of this work is to study the effectiveness of supercritical fluids for the leaching of cobalt contained in lithium-ion batteries (LIBs). For comparative purposes, leaching tests are performed with supercritical CO2 and co-solvents, as well as under conventional conditions. In both cases, sulfuric acid and H2O2 are used as reagents. The solution obtained from the supercritical leaching is processed using electrowinning in order to recover the cobalt. The results show that at atmospheric pressure, cobalt leaching is favored by increasing the amount of H2O2 (from 0 to 8% v/v). The use of supercritical conditions enable extraction of more than 95wt% of the cobalt, with reduction of the reaction time from 60min (the time employed in leaching at atmospheric pressure) to 5min, and a reduction in the concentration of H2O2 required from 8 to 4% (v/v). Electrowinning using a leach solution achieve a current efficiency of 96% and a deposit with cobalt concentration of 99.5wt%. Copyright © 2016 Elsevier Ltd. All rights reserved.

Transected sciatic nerve repair by diode laser protein soldering.

Science.gov (United States)

Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

2017-08-01

Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Directory of Open Access Journals (Sweden)

Shuye Zhang

2018-01-01

Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

Energy Technology Data Exchange (ETDEWEB)

Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

2012-02-15

This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

Supercritical fluid extraction of positron-emitting radioisotopes from solid target matrices

International Nuclear Information System (INIS)

Schlyer, D.

2000-01-01

Supercritical fluids are attractive as media for both chemical reactions, as well as process extraction, since their physical properties can be manipulated by small changes in pressure and temperature near the critical point of the fluid. Such changes can result in drastic effects on density-dependent properties such as solubility, refractive index, dielectric constant, viscosity and diffusivity of the fluid. This suggests that pressure tuning of a pure supercritical fluid may be a useful means to manipulate chemical reactions on the basis of a thermodynamic solvent effect. It also means that the solvation properties of the fluid can be precisely controlled to enable selective component extraction from a matrix. In recent years there has been a growing interest in applying supercritical fluid extraction to the selective removal of trace metals from solid samples. Much of the work has been done on simple systems comprised of inert matrices such as silica or cellulose. Recently, this process as been expanded to environmental samples as well. However, very little is understood about the exact mechanism of the extraction process. Of course, the widespread application of this technology is highly dependent on the ability of scientists to model and predict accurate phase equilibria in complex systems. In this project, we plan to explore the feasibility of utilizing supercritical fluids as solvents for reaction and extraction of radioisotopes produced from solid enriched targets. The reason for this work is that many of these enriched target materials used for radioisotope production are expensive

Thermodynamic Optimization of Supercritical CO{sub 2} Brayton Cycles

Energy Technology Data Exchange (ETDEWEB)

Rhim, Dong-Ryul; Park, Sung-Ho; Kim, Su-Hyun; Yeom, Choong-Sub [Institute for Advanced Engineering, Yongin (Korea, Republic of)

2015-05-15

The supercritical CO{sub 2} Brayton cycle has been studied for nuclear applications, mainly for one of the alternative power conversion systems of the sodium cooled fast reactor, since 1960's. Although the supercritical CO{sub 2} Brayton cycle has not been expected to show higher efficiency at lower turbine inlet temperature over the conventional steam Rankine cycle, the higher density of supercritical CO{sub 2} like a liquid in the supercritical region could reduce turbo-machinery sizes, and the potential problem of sodium-water reaction with the sodium cooled fast reactor might be solved with the use of CO{sub 2} instead of water. The supercritical CO{sub 2} recompression Brayton cycle was proposed for the better thermodynamic efficiency than for the simple supercritical CO{sub 2} Brayton cycle. Thus this paper presents the efficiencies of the supercritical CO{sub 2} recompression Brayton cycle along with several decision variables for the thermodynamic optimization of the supercritical CO{sub 2} recompression Brayton cycle. The analytic results in this study show that the system efficiency reaches its maximum value at a compressor outlet pressure of 200 bars and a recycle fraction of 30 %, and the lower minimum temperature approach at the two heat exchangers shows higher system efficiency as expected.

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Science.gov (United States)

Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

2012-04-01

The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

Supercritical Fluid Chromatographic Separation of Dimethylpolysiloxane Polymer

Energy Technology Data Exchange (ETDEWEB)

Pyo, Dong Jin; Lim, Chang Hyun [Kangwon National University, Chuncheon (Korea, Republic of)

2005-02-15

Water was used as a polar modifier and a μ-porasil column as a saturator column. The μ-porasil column was inserted between the pump outlet and the injection valve. During the passage of the supercritical fluid mobile phase through the silica column, a polar modifier (water) can be dissolved in the pressurized supercritical fluid. Dimethylpolysiloxane polymer has been known as more polar polymer than polystyrene polymer. Dimethylpolysiloxane polymer has never been separated using water modified mobile phase. In this paper, using a μ-porasil column as a saturator column, excellent supercritical fluid chromatograms of dimethylpolysiloxane oligomers were obtained. The use of compressed (dense) gases and supercritical fluids as chromatographic mobile phases in conjunction with liquid chromatographic (LC)-type packed columns was first reported by Klesper et al. in 1962. During its relatively short history, supercritical fluid chromatography (SFC) has become an attractive alternative to GC and LC in certain industrially important applications. SFC gives the advantage of high efficiency and allows the analysis of nonvolatile or thermally labile mixtures.

Supercritical Fluid Chromatographic Separation of Dimethylpolysiloxane Polymer

International Nuclear Information System (INIS)

Pyo, Dong Jin; Lim, Chang Hyun

2005-01-01

Water was used as a polar modifier and a μ-porasil column as a saturator column. The μ-porasil column was inserted between the pump outlet and the injection valve. During the passage of the supercritical fluid mobile phase through the silica column, a polar modifier (water) can be dissolved in the pressurized supercritical fluid. Dimethylpolysiloxane polymer has been known as more polar polymer than polystyrene polymer. Dimethylpolysiloxane polymer has never been separated using water modified mobile phase. In this paper, using a μ-porasil column as a saturator column, excellent supercritical fluid chromatograms of dimethylpolysiloxane oligomers were obtained. The use of compressed (dense) gases and supercritical fluids as chromatographic mobile phases in conjunction with liquid chromatographic (LC)-type packed columns was first reported by Klesper et al. in 1962. During its relatively short history, supercritical fluid chromatography (SFC) has become an attractive alternative to GC and LC in certain industrially important applications. SFC gives the advantage of high efficiency and allows the analysis of nonvolatile or thermally labile mixtures

Introduction to supercritical fluids a spreadsheet-based approach

CERN Document Server

Smith, Richard; Peters, Cor

2013-01-01

This text provides an introduction to supercritical fluids with easy-to-use Excel spreadsheets suitable for both specialized-discipline (chemistry or chemical engineering student) and mixed-discipline (engineering/economic student) classes. Each chapter contains worked examples, tip boxes and end-of-the-chapter problems and projects. Part I covers web-based chemical information resources, applications and simplified theory presented in a way that allows students of all disciplines to delve into the properties of supercritical fluids and to design energy, extraction and materials formation systems for real-world processes that use supercritical water or supercritical carbon dioxide. Part II takes a practical approach and addresses the thermodynamic framework, equations of state, fluid phase equilibria, heat and mass transfer, chemical equilibria and reaction kinetics of supercritical fluids. Spreadsheets are arranged as Visual Basic for Applications (VBA) functions and macros that are completely (source code) ...

Systems design of direct-cycle supercritical-water-cooled fast reactors

International Nuclear Information System (INIS)

Oka, Yoshiaki; Koshizuka, Seiichi; Jevremovic, Tatjana; Okano, Yashushi

1995-01-01

The system design of a direct-cycle supercritical-water-cooled fast reactor is presented. The supercritical water does not exhibit a change of phase. the recirculation system, steam separator, and dryer of a boiling water reactor (BWR) are unnecessary. Roughly speaking, the reactor pressure vessel and control rods are similar to those of a pressurized water reactor, the containment and emergency core cooling system are similar to a BWR, and the balance of plant is similar to a supercritical-pressure fossil-fired power plant (FPP). the electric power of the fast converter is 1,508 MW(electric). The number of coolant loops is only two because of the high coolant enthalpy. Containment volume is much reduced. The thermal efficiency is improved 24% over a BWR. The coolant void reactivity is negative by placing thin zirconium-hydride layers between seeds and blankets. The power costs would be much reduced compared with those of a light water reactor (LWR) and a liquid-metal fast breeder reactor. The concept is based on the huge amount of experience with the water coolant technology of LWRs and FPPs. The oxidation of stainless steel cladding is avoided by adopting a much lower coolant temperature than that of the FPP

An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

International Nuclear Information System (INIS)

Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

2006-01-01

The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

International Nuclear Information System (INIS)

Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

1988-01-01

Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

Aging treatment characteristics of solder bump joint for high reliability optical module

International Nuclear Information System (INIS)

Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

2004-01-01

The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

Simulation of Thermal Hydraulic at Supercritical Pressures with APROS

Energy Technology Data Exchange (ETDEWEB)

Kurki, Joona [VTT Technical Research Centre of Finland, P.O. Box 1000, FI02044 VTT (Finland)

2008-07-01

The proposed concepts for the fourth generation of nuclear reactors include a reactor operating with water at thermodynamically supercritical state, the Supercritical Water Reactor (SCWR). For the design and safety demonstrations of such a reactor, the possibility to accurately simulate the thermal hydraulics of the supercritical coolant is an absolute prerequisite. For this purpose, the one-dimensional two-phase thermal hydraulics solution of APROS process simulation software was developed to function at the supercritical pressure region. Software modifications included the redefinition of some parameters that have physical significance only at the subcritical pressures, improvement of the steam tables, and addition of heat transfer and friction correlations suitable for the supercritical pressure region. (author)

An Approach for Impression Creep of Lead Free Microelectronic Solders

Science.gov (United States)

Anastasio, Onofrio A.

2002-06-01

Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

CERN Document Server

Delsante, M L; Arnau-Izquierdo, G

2004-01-01

The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

2015-08-15

Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

International Nuclear Information System (INIS)

Cao Yuhan; Luo Le

2009-01-01

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu 6 Sn 5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 x 10 -9 atm cc/s are possible, meeting the demands of MIL-STD-883E. (semiconductor technology)

Measurement of erosion of stainless steel by molten lead-free solder using micro-focus x-ray CT system

International Nuclear Information System (INIS)

Nishikawa, Hiroshi; Takemoto, Tadashi; Kang, Songai

2009-01-01

The severe erosion damage, which is caused by a molten lead-free solder, of wave solder equipment made into stainless steel has been encountered in operation. Then, the higher maintenance frequency and reduced life time of wave solder machine component is a serious issue in a manufacturing process. In this study, the evaluation method of erosion of stainless steel by molten lead-free solders was investigated using micro-focus X-ray systems for fluoroscopic and computed tomography (CT). As a result, it was found that the fluoroscopic image could truly reconstruct the cross-shape of the stainless steel sample after immersion test without destruction. In the case of X-ray systems for fluoroscopic and CT used in this study, three-dimensional data can be obtained. Therefore, it was possible to easily check the whole picture of the test sample after immersion test and to decide the maximum erosion depth of test sample. (author)

Supercritical Water Oxidation Program (SCWOP)

International Nuclear Information System (INIS)

1994-02-01

Purpose of SCWOP is to develop and demonstrate supercritical water oxidation as a viable technology for treating DOE hazardous and mixed wastes and to coordinate SCWO research, development, demonstration, testing, and evaluation activities. The process involves bringing together organic waste, water, and an oxidant (air, O 2 , etc.) to temperatures and pressures above water's critical point (374 C, 22.1 MPa); organic destruction is >99.99% efficient, and the resulting effluents (mostly water, CO 2 ) are relatively benign. Pilot-scale (300--500 gallons/day) SCWO units are to be constructed and demonstrated. Two phases will be conducted: hazardous waste pilot plant demonstration and mixed waste pilot demonstration. Contacts for further information and for getting involved are given

Review of the coal-fired, over-supercritical and ultra-supercritical steam power plants

Science.gov (United States)

Tumanovskii, A. G.; Shvarts, A. L.; Somova, E. V.; Verbovetskii, E. Kh.; Avrutskii, G. D.; Ermakova, S. V.; Kalugin, R. N.; Lazarev, M. V.

2017-02-01

The article presents a review of developments of modern high-capacity coal-fired over-supercritical (OSC) and ultra-supercritical (USC) steam power plants and their implementation. The basic engineering solutions are reported that ensure the reliability, economic performance, and low atmospheric pollution levels. The net efficiency of the power plants is increased by optimizing the heat balance, improving the primary and auxiliary equipment, and, which is the main thing, by increasing the throttle conditions. As a result of the enhanced efficiency, emissions of hazardous substances into the atmosphere, including carbon dioxide, the "greenhouse" gas, are reduced. To date, the exhaust steam conditions in the world power industry are p 0 ≈ 30 MPa and t 0 = 610/620°C. The efficiency of such power plants reaches 47%. The OSC plants are being operated in Germany, Denmark, Japan, China, and Korea; pilot plants are being developed in Russia. Currently, a project of a power plant for the ultra-supercritical steam conditions p 0 ≈ 35 MPa and t 0 = 700/720°C with efficiency of approximately 50% is being studied in the EU within the framework of the Thermie AD700 program, project AD 700PF. Investigations in this field have also been launched in the United States, Japan, and China. Engineering solutions are also being sought in Russia by the All-Russia Thermal Engineering Research Institute (VTI) and the Moscow Power Engineering Institute. The stated steam parameter level necessitates application of new materials, namely, nickel-base alloys. Taking into consideration high costs of nickel-base alloys and the absence in Russia of technologies for their production and manufacture of products from these materials for steam-turbine power plants, the development of power plants for steam parameters of 32 MPa and 650/650°C should be considered to be the first stage in creating the USC plants as, to achieve the above parameters, no expensive alloys are require. To develop and

New dimension of slow food movement using supercritical fluid technology and methods to influence society by effective marketing strategies.

Science.gov (United States)

Uzel, Ruhan Aşkın

2016-07-01

Although slow food movement is a well-known movement nowadays, in order to make it more widespread to the society, necessity to develop and to adapt new techniques has become inevitable for healthier consumption age. For this purpose, possibility of increased usage of healthy foods with addition of natural extracts using new techniques came out from relevant questionaries applied to people of different age groups. In this study, specific properties of supercritical carbon dioxide at distinct temperatures and water in subcritical conditions were used to obtain extracts rich in water-soluble organic compounds. Experiments were carried out at pressures of 10, 20, 30, and 40 MPa and temperatures ranging from 40 to 200 ℃ with and without modifier for 2 h of extraction time. The flow rate was kept at 4 and 1 ml/min for CO2 and water, respectively. The highest water-soluble organic compound recovery yield was 78.10%. Results were supported by marketing strategies to announce this new application and products to the society. Group of sample questions was prepared to investigate (a) frequency of staple food usage, (b) the brand names and relevant reasons that bring up consumers to buy specifically same branded products, (c) knowledge about the ingredients and how advertising effects purchasing decision, etc. Finally, efficiency increase in slow food consumption was proved with supercritical fluid technology to draw attention to the health of consumers with newer and functional healthy foods. © The Author(s) 2015.

Oxidation of oily sludge in supercritical water

International Nuclear Information System (INIS)

Cui Baochen; Cui Fuyi; Jing Guolin; Xu Shengli; Huo Weijing; Liu Shuzhi

2009-01-01

The oxidation of oily sludge in supercritical water is performed in a batch reactor at reaction temperatures between 663 and 723 K, the reaction times between 1 and 10 min and pressure between 23 and 27 MPa. Effect of reaction parameters such as reaction time, temperature, pressure, O 2 excess and initial COD on oxidation of oily sludge is investigated. The results indicate that chemical oxygen demand (COD) removal rate of 92% can be reached in 10 min. COD removal rate increases as the reaction time, temperature and initial COD increase. Pressure and O 2 excess have no remarkable affect on reaction. By taking into account the dependence of reaction rate on COD concentration, a global power-law rate expression was regressed from experimental data. The resulting pre-exponential factor was 8.99 x 10 14 (mol L -1 ) -0.405 s -1 ; the activation energy was 213.13 ± 1.33 kJ/mol; and the reaction order for oily sludge (based on COD) is 1.405. It was concluded that supercritical water oxidation (SCWO) is a rapidly emerging oily sludge processing technology.

In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

International Nuclear Information System (INIS)

Nourbakhsh, M. S.; Etrati Khosroshahi, M.

2011-01-01

Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

Extraction fatty acid as a source to produce biofuel in microalgae Chlorella sp. and Spirulina sp. using supercritical carbon dioxide

Science.gov (United States)

Tai, Do Chiem; Hai, Dam Thi Thanh; Vinh, Nguyen Hanh; Phung, Le Thi Kim

2016-06-01

In this research, the fatty acids of isolated microalgae were extracted by some technologies such as maceration, Soxhlet, ultrasonic-assisted extraction and supercritical fluid extraction; and analyzed for biodiesel production using GC-MS. This work deals with the extraction of microalgae oil from dry biomass by using supercritical fluid extraction method. A complete study at laboratory of the influence of some parameters on the extraction kinetics and yields and on the composition of the oil in terms of lipid classes and profiles is proposed. Two types of microalgae were studied: Chlorella sp. and Spirulina sp. For the extraction of oil from microalgae, supercritical CO2 (SC-CO2) is regarded with interest, being safer than n-hexane and offering a negligible environmental impact, a short extraction time and a high-quality final product. Whilst some experimental papers are available on the supercritical fluid extraction (SFE) of oil from microalgae, only limited information exists on the kinetics of the process. These results demonstrate that supercritical CO2 extraction is an efficient method for the complete recovery of the neutral lipid phase.

Design and analysis on super-critical water cooled power reactors

International Nuclear Information System (INIS)

Ishiwatari, Yuki

2005-01-01

The Super-Critical Water Cooled Power Reactors (SCPR) is cooled by 25 MPa supercritical water of 280degC at reactor inlet and greater than 500degC at reactor outlet and directly connected with turbine/generators with high energy conversion efficiency. This corresponds to the deletion of recirculation system and steam-water separation system of BWR type reactors or of pressurizer and steam generator of PWR type reactors. In addition to the design study of the university of Tokyo, technology development of the SCPR for practical use has started under the collaboration of industry and academia since 2000. Mockup single tube and bundle tests for heat transfer/fluid flow characteristics of the design have been conducted with 3D heat transfer analysis. Materials compatible with coolant conditions for fuel cans and reactor internals are also assessed. Overall evaluation of the reactor concept is under way. (T. Tanaka)

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Directory of Open Access Journals (Sweden)

Yulong Li

2018-01-01

Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

Destruction of DOE/DP surrogate wastes with supercritical water oxidation technology

International Nuclear Information System (INIS)

Bramlette, T.T.; Mills, B.E.; Hencken, K.R.; Brynildson, M.E.; Johnston, S.C.; Hruby, J.M.; Freemster, H.C.; Odegard, B.C.; Modell, M.

1990-11-01

Surrogate wastes of specific interest to DOE/DP production facilities (Hanford and Rocky Flats), and the electronics industry have been successfully processed in a laboratory-scale, supercritical water oxidation flow reactor. In all cases, the observed destruction/reduction efficiencies for the organic components were in excess of 99.9%, limited by instrumentation detection capability. Separation of the inorganic components of the Hanford process stream was more difficult to accomplish than destruction of the organic component. Large fractions of all metals contained in this stream were found both in the solids separator effluent and in deposits removed from the reactor. Mass closure was not achieved. Of the process stream's non-metallic, inorganic components, the sulfates and phosphates precipitated, while the nitrates tended to stay in solution. The inorganic material that did precipitate from the simulated Hanford mixed waste accumulated in zones that may be associated with changes in the chemical and physical properties of the supercritical fluid. Corrosion is expected to be a significant problem. Witness wires of Inconel 625, Hastalloy C-276, and titanium placed in the preheater, reactor and cooldown exchanger indicated selective dissolution of chromium, nickel, and molybdenum for some conditions, and non-selective dissolution for others. While these results are very promising, further research is required to evaluate the scalability, reliability, and economics of SCWO reactor components and systems, particularly for mixed wastes. Future research must explore a parameter space (temperature, pressure, pH, residence time, etc.) focused on selecting conditions and materials for specific process streams

Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

DEFF Research Database (Denmark)

Kostandyan, Erik; Sørensen, John Dalsgaard

2012-01-01

description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

Supercritical Airfoil Coordinates

Data.gov (United States)

National Aeronautics and Space Administration — Rectangular Supercritical Wing (Ricketts) - design and measured locations are provided in an Excel file RSW_airfoil_coordinates_ricketts.xls . One sheet is with Non...

A Review of Enzymatic Transesterification of Microalgal Oil-Based Biodiesel Using Supercritical Technology

Science.gov (United States)

Taher, Hanifa; Al-Zuhair, Sulaiman; Al-Marzouqi, Ali H.; Haik, Yousef; Farid, Mohammed M.

2011-01-01

Biodiesel is considered a promising replacement to petroleum-derived diesel. Using oils extracted from agricultural crops competes with their use as food and cannot realistically satisfy the global demand of diesel-fuel requirements. On the other hand, microalgae, which have a much higher oil yield per hectare, compared to oil crops, appear to be a source that has the potential to completely replace fossil diesel. Microalgae oil extraction is a major step in the overall biodiesel production process. Recently, supercritical carbon dioxide (SC-CO2) has been proposed to replace conventional solvent extraction techniques because it is nontoxic, nonhazardous, chemically stable, and inexpensive. It uses environmentally acceptable solvent, which can easily be separated from the products. In addition, the use of SC-CO2 as a reaction media has also been proposed to eliminate the inhibition limitations that encounter biodiesel production reaction using immobilized enzyme as a catalyst. Furthermore, using SC-CO2 allows easy separation of the product. In this paper, conventional biodiesel production with first generation feedstock, using chemical catalysts and solvent-extraction, is compared to new technologies with an emphasis on using microalgae, immobilized lipase, and SC-CO2 as an extraction solvent and reaction media. PMID:21915372

Theoretical models for supercritical fluid extraction.

Science.gov (United States)

Huang, Zhen; Shi, Xiao-Han; Jiang, Wei-Juan

2012-08-10

For the proper design of supercritical fluid extraction processes, it is essential to have a sound knowledge of the mass transfer mechanism of the extraction process and the appropriate mathematical representation. In this paper, the advances and applications of kinetic models for describing supercritical fluid extraction from various solid matrices have been presented. The theoretical models overviewed here include the hot ball diffusion, broken and intact cell, shrinking core and some relatively simple models. Mathematical representations of these models have been in detail interpreted as well as their assumptions, parameter identifications and application examples. Extraction process of the analyte solute from the solid matrix by means of supercritical fluid includes the dissolution of the analyte from the solid, the analyte diffusion in the matrix and its transport to the bulk supercritical fluid. Mechanisms involved in a mass transfer model are discussed in terms of external mass transfer resistance, internal mass transfer resistance, solute-solid interactions and axial dispersion. The correlations of the external mass transfer coefficient and axial dispersion coefficient with certain dimensionless numbers are also discussed. Among these models, the broken and intact cell model seems to be the most relevant mathematical model as it is able to provide realistic description of the plant material structure for better understanding the mass-transfer kinetics and thus it has been widely employed for modeling supercritical fluid extraction of natural matters. Copyright © 2012 Elsevier B.V. All rights reserved.

Purification of radioactive waste oil by a supercritical fluid

International Nuclear Information System (INIS)

Yoo, Jaeryong; Sung, Jinhyun; Park, Kwangheon; Kim, Hongdoo; Kim, Hakwon; Lim, Taeyoon; Yim, Sanghak; Yoon, Weonseob

2006-01-01

The radioactive waste oil from the nuclear industry is potentially hazardous due to its possibility to contaminate soil and underwater. Pollutants in waste oil are generally radioactive heavy metals or organo-metals. Radioactive waste oils are highly viscous fluids that are similar to used-motor oils. Several processes have been developed to regenerated used motor oil, such as acid clay treatment, chemical addition, vacuum distillation, thermal cracking and hydrofinishing. However, these technologies are difficult to apply to separating radioactive nuclides from radioactive waste oils. In recent years, our laboratory developed a membrane method for the regeneration of used motor oils. We applied supercritical Co2 (scCO2) as a viscosity reducing additive to waste oils at a lower process temperature in order to improve membrane permeability and thus the energy saving. However, the membrane cannot filter the contaminants in radioactive waste oil that are not particles, such as radioactive ions in impurity water in the oil. In this paper, we suggest a method extracting clean oil from the radioactive waste oil rather than filtering by a supercritical fluid. We selected R22, a refrigerant, as a solvent for extraction. R22 has a mild critical point - 96.1 .deg. and 49.9bar. Regeneration of waste oils by extracting clean oil using a supercritical fluid such as R22 is easy to handle and reduce secondary wastes. In this paper, we examine the feasibility of R22 in extracting clean oil from radioactive waste oils

Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

Science.gov (United States)

Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

2018-06-01

With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

Energy Technology Data Exchange (ETDEWEB)

Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

2012-01-30

Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

International Nuclear Information System (INIS)

Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

2012-01-01

Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

Investigation of the precipitation of Na2SO4 in supercritical water

DEFF Research Database (Denmark)

Voisin, T.; Erriguible, A.; Philippot, G.

2017-01-01

solubility in sub-and supercritical water is determined on a wide temperature range using a continuous set-up. Crystallite sizes formed after precipitation are measured with in situ synchrotron wide angle X-ray scattering (WAXS). Combining these experimental results, a numerical modeling of the precipitation......SuperCritical Water Oxidation process (SCWO) is a promising technology for treating toxic and/or complex chemical wastes with very good efficiency. Above its critical point (374 degrees C, 22.1 MPa), water exhibits particular properties and organic compounds can be easily dissolved and degraded...... with the addition of oxidizing agents. But these interesting properties imply a main drawback regarding inorganic compounds. Highly soluble at ambient temperature in water, these inorganics (such as salts) are no longer soluble in supercritical water and precipitate into solids, creating plugs in SCWO processes...

Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

Energy Technology Data Exchange (ETDEWEB)

Wolfe, Larry

2009-04-22

Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

Science.gov (United States)

Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

2011-01-01

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

Directory of Open Access Journals (Sweden)

Zaihua Li

2017-07-01

Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

International Nuclear Information System (INIS)

Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

2010-01-01

The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

Advanced Supercritical Carbon Dioxide Brayton Cycle Development

Energy Technology Data Exchange (ETDEWEB)

Anderson, Mark [Univ. of Wisconsin, Madison, WI (United States); Sienicki, James [Argonne National Lab. (ANL), Argonne, IL (United States); Moisseytsev, Anton [Argonne National Lab. (ANL), Argonne, IL (United States); Nellis, Gregory [Univ. of Wisconsin, Madison, WI (United States); Klein, Sanford [Univ. of Wisconsin, Madison, WI (United States)

2015-10-21

Fluids operating in the supercritical state have promising characteristics for future high efficiency power cycles. In order to develop power cycles using supercritical fluids, it is necessary to understand the flow characteristics of fluids under both supercritical and two-phase conditions. In this study, a Computational Fluid Dynamic (CFD) methodology was developed for supercritical fluids flowing through complex geometries. A real fluid property module was implemented to provide properties for different supercritical fluids. However, in each simulation case, there is only one species of fluid. As a result, the fluid property module provides properties for either supercritical CO₂ (S-CO₂) or supercritical water (SCW). The Homogeneous Equilibrium Model (HEM) was employed to model the two-phase flow. HEM assumes two phases have same velocity, pressure, and temperature, making it only applicable for the dilute dispersed two-phase flow situation. Three example geometries, including orifices, labyrinth seals, and valves, were used to validate this methodology with experimental data. For the first geometry, S-CO₂ and SCW flowing through orifices were simulated and compared with experimental data. The maximum difference between the mass flow rate predictions and experimental measurements is less than 5%. This is a significant improvement as previous works can only guarantee 10% error. In this research, several efforts were made to help this improvement. First, an accurate real fluid module was used to provide properties. Second, the upstream condition was determined by pressure and density, which determines supercritical states more precise than using pressure and temperature. For the second geometry, the flow through labyrinth seals was studied. After a successful validation, parametric studies were performed to study geometric effects on the leakage rate. Based on these parametric studies, an optimum design strategy for the see

Review and proposal for heat transfer predictions at supercritical water conditions using existing correlations and experiments

Energy Technology Data Exchange (ETDEWEB)

Jaeger, Wadim, E-mail: wadim.jaeger@kit.edu [Karlsruhe Institute of Technology, Institute for Neutron Physics and Reactor Technology, DE-76344 Eggenstein-Leopoldshafen (Germany); Sanchez Espinoza, Victor Hugo [Karlsruhe Institute of Technology, Institute for Neutron Physics and Reactor Technology, DE-76344 Eggenstein-Leopoldshafen (Germany); Hurtado, Antonio [Technical University of Dresden, Institute of Power Engineering, DE-01062 Dresden (Germany)

2011-06-15

Highlights: > Implementation of heat transfer correlations for supercritical water into TRACE. > Simulation of several heat transfer experiments with modified TRACE version. > Most correlations are not able to reproduce the experimental results. > Bishop, Sandberg and Tong correlation is most suitable for TRACE applications. - Abstract: This paper summarizes the activities of the TRACE code validation at the Institute for Neutron Physics and Reactor Technology related to supercritical water conditions. In particular, the providing of the thermo physical properties and its appropriate use in the wall-to-fluid heat transfer models in the frame of the TRACE code is the object of this investigation. In a first step, the thermo physical properties of the original TRACE code were modified in order to account for supercritical conditions. In a second step, existing Nusselt correlations were reviewed and implemented into TRACE and available experiments were simulated to identify the most suitable Nusselt correlation(s).

Supercritical fluid processing: a new dry technique for photoresist developing

Science.gov (United States)

Gallagher-Wetmore, Paula M.; Wallraff, Gregory M.; Allen, Robert D.

1995-06-01

Supercritical fluid (SCF) technology is investigated as a dry technique for photoresist developing. Because of their unique combination of gaseous and liquid-like properties, these fluids offer comparative or improved efficiencies over liquid developers and, particularly carbon dioxide, would have tremendous beneficial impact on the environment and on worker safety. Additionally, SCF technology offers the potential for processing advanced resist systems which are currently under investigation as well as those that may have been abandoned due to problems associated with conventional developers. An investigation of various negative and positive photoresist systems is ongoing. Initially, supercritical carbon dioxide (SC CO2) as a developer for polysilane resists was explored because the exposure products, polysiloxanes, are generally soluble in this fluid. These initial studies demonstrated the viability of the SCF technique with both single layer and bilayer systems. Subsequently, the investigation focused on using SC CO2 to produce negative images with polymers that would typically be considered positive resists. Polymers such as styrenes and methacrylates were chemically modified by fluorination and/or copolymerization to render them soluble in SC CO2. Siloxane copolymers and siloxane-modified methacrylates were examined as well. The preliminary findings reported here indicate the feasibility of using SC CO2 for photoresist developing.

Fast infrared spectroscopy in supercritical fluids

International Nuclear Information System (INIS)

Sun, X.

2000-05-01

Chapter 1: Introduction. A brief introduction to supercritical fluids is given, illustrating why supercritical fluids are unique solvents and why there is a wide application of supercritical fluids in industry and laboratories. Potential ways for solvation in supercritical fluids to affect reactivity are briefly reviewed. A general introduction to the photochemistry of organometallic complexes is also given. Chapter 2: Time resolved vibrational spectroscopy. Time resolved resonance Raman is introduced and compared with Time-resolved infrared spectroscopy (TRIR). The different approaches of TRIR, including microsecond, nanosecond, and ultrafast (picosecond and femtosecond) systems are discussed. The advantages and disadvantages of these systems are also compared. The TRIR apparatus using an IR diode laser used for work in this thesis are described in detail. Experimental procedures for supercritical fluid TRIR experiments are described with emphasis on handling the IR cell for supercritical fluids and preparation of supercritical fluid solutions. Chapter 3: Photochemistry of group VIB hexacarbonyl compounds in supercritical noble gases and CO 2 solutions. A systematic TRIR study of the photolysis of M(CO) 6 in supercritical Ar, Kr, Xe, and CO 2 and the observation of M(CO) 5 L (M = Cr, Mo, and W; L = Ar (W only), Kr, Xe, and CO 2 ) is described. The second-order rate constants for the reaction of M(CO) 5 L with CO have been evaluated and the reactivity for each metal is Kr > Xe ∼ CO 2 . For M(CO) 5 Kr, M(CO) 5 Xe, or M(CO) 5 (CO 2 ), the reactivity is Cr ∼ Mo > W. In supercritical Kr doped with either Xe or CO 2 , the M(CO) 5 moiety interacts with Xe or CO 2 in preference to Kr. The effect of solvent density on the rate of the reaction of W(CO) 5 (CO 2 ) with CO has been investigated. The reaction of W(CO) 5 (CO 2 ) with CO in scCO 2 is predominantly a dissociative process. The activation energies for the reaction of W(CO) 5 Xe and W(CO) 5 (CO 2 ) with CO and

Removal of common organic solvents from aqueous waste streams via supercritical C02 extraction: a potential green approach to sustainable waste management in the pharmaceutical industry.

Science.gov (United States)

Leazer, Johnnie L; Gant, Sean; Houck, Anthony; Leonard, William; Welch, Christopher J

2009-03-15

Supercritical CO2 extraction of aqueous streams is a convenient and effective method to remove commonly used solvents of varying polarities from aqueous waste streams. The resulting aqueous layers can potentially be sewered; whereas the organic layer can be recovered for potential reuse. Supercritical fluid extraction (SFE) is a technology that is increasingly being used in commercial processes (1). Supercritical fluids are well suited for extraction of a variety of media, including solids, natural products, and liquid products. Many supercritical fluids have low critical temperatures, allowing for extractions to be done at modestly low temperatures, thus avoiding any potential thermal decomposition of the solutes under study (2). Furthermore, the CO2 solvent strength is easily tuned by adjusting the density of the supercritical fluid (The density is proportional to the pressure of the extraction process). Since many supercritical fluids are gases at ambient temperature, the extract can be concentrated by simply venting the reaction mixture to a cyclone collection vessel, using appropriate safety protocols.

Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

Science.gov (United States)

Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

2016-07-01

Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

Development of a test facility for analyzing supercritical fluid blowdown

International Nuclear Information System (INIS)

Roberto, Thiago D.; Alvim, Antonio C.M.

2015-01-01

The generation IV nuclear reactors under development mostly use supercritical fluids as the working fluid because higher temperatures improve the thermal efficiency. Supercritical fluids are used by modern nuclear power plants to achieve thermal efficiencies of around 45%. With water as the supercritical working fluid, these plants operate at a high temperature and pressure. However, experiments on supercritical water are limited by technical and financial difficulties. These difficulties can be overcome by using model fluids, which have more feasible supercritical conditions and exhibit a lower critical pressure and temperature. Experimental research is normally used to determine the conditions under which model fluids represent supercritical fluids under steady-state conditions. A fluid-to-fluid scaling approach has been proposed to determine model fluids that can represent supercritical fluids in a transient state. This paper presents an application of fractional scale analysis to determine the simulation parameters for a depressurization test facility. Carbon dioxide (CO 2 ) and R134a gas were considered as the model fluids because their critical point conditions are more feasible than those of water. The similarities of water (prototype), CO 2 (model) and R134a (model) for depressurization in a pressure vessel were analyzed. (author)

Solder bond requirement for large, built-up, high-performance conductors

International Nuclear Information System (INIS)

Willig, R.L.

1981-01-01

Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

27.12 MHz plasma generation in supercritical carbon dioxide

International Nuclear Information System (INIS)

Kawashima, Ayato; Toyota, Hiromichi; Nomura, Shinfuku; Takemori, Toshihiko; Mukasa, Shinobu; Maehara, Tsunehiro; Yamashita, Hiroshi

2007-01-01

An experiment was conducted for generating high-frequency plasma in supercritical carbon dioxide; it is expected to have the potential for applications in various types of practical processes. It was successfully generated at 6-20 MPa using electrodes mounted in a supercritical cell with a gap of 1 mm. Emission spectra were then measured to investigate the physical properties of supercritical carbon dioxide plasma. The results indicated that while the emission spectra for carbon dioxide and carbon monoxide could be mainly obtained at a low pressure, the emission spectra for atomic oxygen could be obtained in the supercritical state, which increased with the pressure. The temperature of the plasma in supercritical state was estimated to be approximately 6000-7000 K on the assumption of local thermodynamic equilibrium and the calculation results of thermal equilibrium composition in this state showed the increase of atomic oxygen by the decomposition of CO 2

Radiolytic and electron-transfer reactions in supercritical CO2

International Nuclear Information System (INIS)

Bartels, D. M.; Dimitrijevic, N. M.; Jonah, C. D.; Takahashi, K.

2000-01-01

Using supercritical fluids as solvents is useful for both practical and theoretical reasons. It has been proposed to use supercritical CO 2 as a solvent for synthesis because it eliminates the air pollution arising from other solvents. The properties of supercritical fluids can be easily varied with only modest changes in temperature and density, so they provide a way of testing theories of chemical reactions. It has also been proposed to use supercritical fluids for the treatment of hazardous mixed waste. For these reasons the authors have studied the production of radiolytic species in supercritical CO 2 and have measured their reactivity as a function of density. They have shown that the C 2 O 4 + is formed. They also have shown that the electron transfer reactions of dimethylaniline to C 2 O 4 + and CO 2 (e - ) to benzoquinone are diffusion controlled over a considerable density range

Supercritical fields and bald black holes

Energy Technology Data Exchange (ETDEWEB)

Irvine, J M

1975-01-01

The instability of a many-fermion ground state against particle-hole excitations is reviewed and the existence of supercritical electromagnetic and strong interaction fields is briefly discussed. The nature of associated phase changes and in particular the change in conservation laws which accompanies the phase changes is outlined. Finally, the supercritical gravitational field is considered and weight given to the argument that ''black holes have no hair.''

Supercritical CO2 fluid radiochromatography system used to purify [11C]toluene for PET

International Nuclear Information System (INIS)

Muller, Ryan D.; Ferrieri, Richard A.; Gerasimov, Madina; Garza, Victor

2002-01-01

Abuse of inhalants in today's society has become such a widespread problem among today's adolescents that in many parts of the world their use exceeds that of many other illicit drugs or alcohol. Even so, little is known how such inhalants affect brain function to an extent that can lead to an abuse liability. While methodologies exist for radiolabeling certain inhalants of interest with short-lived positron emitting radioisotopes that would allow their investigation in human subjects using positron emission tomography (PET), the purification methodologies necessary to separate these volatile substances from the organic starting materials have not been developed. We've adapted supercritical fluid technology to this specific PET application by building a preparative-scale supercritical CO 2 fluid radiochromatograph, and applied it to the purification of [ 11 C]toluene. We've demonstrated that [ 11 C]toluene can be separated from the starting materials using a conventional C 18 HPLC column and pure supercritical CO 2 fluid as the mobile phase operating at 2000 psi and 40 deg. C. We've also shown that the purified radiotracer can be quantitatively captured on Tenax GR, a solid support material, as it exits the supercritical fluid stream, thus allowing for later desorption into a 1.5% cyclodextrin solution that is suitable for human injection, or into a breathing tube for direct inhalation

Supercritical heat transfer phenomena in nuclear system

International Nuclear Information System (INIS)

Seo, Kyoung Woo; Kim, Moo Hwan; Anderson, Mark H.; Corradini, Michael L.

2005-01-01

A supercritical water (SCW) power cycle has been considered as one of the viable candidates for advanced fission reactor designs. However, the dramatic variation of thermo-physical properties with a modest change of temperature near the pseudo-critical point make existing heat transfer correlations such as the Dittus-Boelter correlation not suitably accurate to calculate the heat transfer in supercritical fluid. Several other correlations have also been suggested but none of them are able to predict the heat transfer over a parameter range, needed for reactor thermal-hydraulics simulation and design. This has prompted additional research to understand the characteristic of supercritical fluid heat transfer

Effect of supercritical fluid density on nanoencapsulated drug particle size using the supercritical antisolvent method.

Science.gov (United States)

Kalani, Mahshid; Yunus, Robiah

2012-01-01

The reported work demonstrates and discusses the effect of supercritical fluid density (pressure and temperature of supercritical fluid carbon dioxide) on particle size and distribution using the supercritical antisolvent (SAS) method in the purpose of drug encapsulation. In this study, paracetamol was encapsulated inside L-polylactic acid, a semicrystalline polymer, with different process parameters, including pressure and temperature, using the SAS process. The morphology and particle size of the prepared nanoparticles were determined by scanning electron microscopy and transmission electron microscopy. The results revealed that increasing temperature enhanced mean particle size due to the plasticizing effect. Furthermore, increasing pressure enhanced molecular interaction and solubility; thus, particle size was reduced. Transmission electron microscopy images defined the internal structure of nanoparticles. Thermal characteristics of nanoparticles were also investigated via differential scanning calorimetry. Furthermore, X-ray diffraction pattern revealed the changes in crystallinity structure during the SAS process. In vitro drug release analysis determined the sustained release of paracetamol in over 4 weeks.

In situ investigation of SnAgCu solder alloy microstructure

International Nuclear Information System (INIS)

Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

2011-01-01

Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

Review and proposal for heat transfer predictions at supercritical water conditions using existing correlations and experiments

International Nuclear Information System (INIS)

Jaeger, Wadim; Sanchez Espinoza, Victor Hugo; Hurtado, Antonio

2011-01-01

Highlights: → Implementation of heat transfer correlations for supercritical water into TRACE. → Simulation of several heat transfer experiments with modified TRACE version. → Most correlations are not able to reproduce the experimental results. → Bishop, Sandberg and Tong correlation is most suitable for TRACE applications. - Abstract: This paper summarizes the activities of the TRACE code validation at the Institute for Neutron Physics and Reactor Technology related to supercritical water conditions. In particular, the providing of the thermo physical properties and its appropriate use in the wall-to-fluid heat transfer models in the frame of the TRACE code is the object of this investigation. In a first step, the thermo physical properties of the original TRACE code were modified in order to account for supercritical conditions. In a second step, existing Nusselt correlations were reviewed and implemented into TRACE and available experiments were simulated to identify the most suitable Nusselt correlation(s).

Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

Science.gov (United States)

Reinl, S.

Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

Science.gov (United States)

Gadag, Shiva P.; Patra, Susant

2000-12-01

Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Science.gov (United States)

Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

2016-12-01

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

Selective chelation and extraction of lanthanides and actinides with supercritical fluids

International Nuclear Information System (INIS)

Brauer, R.D.; Carleson, T.E.; Harrington, J.D.; Jean, F.; Jiang, H.; Lin, Y.; Wai, C.M.

1994-01-01

This report is made up of three independent papers: (1) Supercritical Fluid Extraction of Thorium and Uranium with Fluorinated Beta-Diketones and Tributyl Phosphate, (2) Supercritical Fluid Extraction of Lanthanides with Beta-Diketones and Mixed Ligands, and (3) A Group Contribution Method for Predicting the Solubility of Solid Organic Compounds in Supercritical Carbon Dioxide. Experimental data are presented demonstrating the successful extraction of thorium and uranium using fluorinated beta-diketones to form stable complexes that are extracted with supercritical carbon dioxide. The conditions for extracting the lanthanide ions from liquid and solid materials using supercritical carbon dioxide are presented. In addition, the Peng-Robison equation of state and thermodynamic equilibrium are used to predict the solubilities of organic solids in supercritical carbon dioxide from the sublimation pressure, critical properties, and a centric factor of the solid of interest

Reinforcement of high-risk anastomoses using laser-activated protein solders: a clinical study

Science.gov (United States)

Libutti, Steven K.; Bessler, Marc; Chabot, J.; Bass, Lawrence S.; Oz, Mehmet C.; Auteri, Joseph S.; Kirsch, Andrew J.; Nowygrod, Roman; Treat, Michael R.

1993-07-01

Anastomotic leakage or breakdown can result in catastrophic complications and significantly increased post-operative morbidity and mortality. Certain anastomoses are subject to a higher incidence of disruption and are therefore termed high risk. In an attempt to decrease the risk of anastomotic leaks, we reinforced sutured anastomoses with a laser activated protein solder in patients undergoing esophagojejunostomies (n equals 2), lung transplantation (n equals 2), and pancreaticojejunostomies (Whipple procedure, n equals 5). The protein solder was composed of 1.0 ml of a 25% human albumin solution, 1.0 ml of sodium hyaluronate, and 0.1 ml of Cardiogreen dye. This composition was applied to the sutured anastomosis and activated with an 860 nm pulsed diode laser. Drains were placed when appropriate and patients were followed for up to 10 months post-operatively and assessed for clinical signs of anastomotic leaks. Results to data demonstrated that there were no immediate complications as a result of the procedure. Operative time was not significantly lengthened. There were no cases of clinically significant leakage from any of the reinforced anastomoses. Laser activated protein solders may help to reduce the incidence of leakage in high risk anastomoses. Large numbers of patients and longer follow-up is needed however, to draw significant conclusions.

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Energy Technology Data Exchange (ETDEWEB)

Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

2016-04-15

Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

International Nuclear Information System (INIS)

Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

2011-01-01

Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

International Nuclear Information System (INIS)

Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

2015-01-01

Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

International Nuclear Information System (INIS)

He Hongwen; Xu Guangchen; Guo Fu

2009-01-01

Electromigration (EM) behavior of Cu/Sn 3.5 Ag/Cu solder reaction couple was investigated with a high current density of 5 x 10 3 A/cm 2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu 6 Sn 5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu 6 Sn 5 at the cathode interface due to the thermal stress.

Liver repair and hemorrhage control by using laser soldering of liquid albumin in a porcine model.

Science.gov (United States)

Wadia, Y; Xie, H; Kajitani, M

2000-01-01

We evaluated laser soldering by using liquid albumin for welding liver injuries. Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. Eight laceration (6 x 2 cm) and eight nonanatomic resection injuries (raw surface, 6 x 2 cm) were repaired. An 805-nm laser was used to weld 50% liquid albumin-indocyanine green solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. All 16 soldering repairs were evaluated at 3 hours. All 16 laser mediated liver repairs had minimal blood loss as compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. Laser fusion repair of the liver is a reliable technique to gain hemostasis on the raw surface as well as weld lacerations. Copyright 2000 Wiley-Liss, Inc.

Structural behavior of supercritical fluids under confinement

Science.gov (United States)

Ghosh, Kanka; Krishnamurthy, C. V.

2018-01-01

The existence of the Frenkel line in the supercritical regime of a Lennard-Jones (LJ) fluid shown through molecular dynamics (MD) simulations initially and later corroborated by experiments on argon opens up possibilities of understanding the structure and dynamics of supercritical fluids in general and of the Frenkel line in particular. The location of the Frenkel line, which demarcates two distinct physical states, liquidlike and gaslike within the supercritical regime, has been established through MD simulations of the velocity autocorrelation (VACF) and radial distribution function (RDF). We, in this article, explore the changes in the structural features of supercritical LJ fluid under partial confinement using atomistic walls. The study is carried out across the Frenkel line through a series of MD simulations considering a set of thermodynamics states in the supercritical regime (P =5000 bar, 240 K ≤T ≤1500 K ) of argon well above the critical point. Confinement is partial, with atomistic walls located normal to z and extending to "infinity" along the x and y directions. In the "liquidlike" regime of the supercritical phase, particles are found to be distributed in distinct layers along the z axis with layer spacing less than one atomic diameter and the lateral RDF showing amorphous-like structure for specific spacings (packing frustration) and non-amorphous-like structure for other spacings. Increasing the rigidity of the atomistic walls is found to lead to stronger layering and increased structural order. For confinement with reflective walls, layers are found to form with one atomic diameter spacing and the lateral RDF showing close-packed structure for the smaller confinements. Translational order parameter and excess entropy assessment confirms the ordering taking place for atomistic wall and reflective wall confinements. In the "gaslike" regime of the supercritical phase, particle distribution along the spacing and the lateral RDF exhibit features

A review of typical thermal fatigue failure models for solder joints of electronic components

Science.gov (United States)

Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

2017-09-01

For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Energy Technology Data Exchange (ETDEWEB)

Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

2017-03-01

In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

Oxidation stability of biodiesel fuel as prepared by supercritical methanol

Energy Technology Data Exchange (ETDEWEB)

Jiayu Xin; Hiroaki Imahara; Shiro Saka [Kyoto University, Kyoto (Japan). Department of Socio-Environmental Energy Science, Graduate School of Energy Science

2008-08-15

A non-catalytic supercritical methanol method is an attractive process to convert various oils/fats efficiently into biodiesel. To evaluate oxidation stability of biodiesel, biodiesel produced by alkali-catalyzed method was exposed to supercritical methanol at several temperatures for 30 min. As a result, it was found that the tocopherol in biodiesel is not stable at a temperature higher than 300{sup o}C. After the supercritical methanol treatment, hydroperoxides were greatly reduced for biodiesel with initially high in peroxide value, while the tocopherol slightly decreased in its content. As a result, the biodiesel prepared by the supercritical methanol method was enhanced for oxidation stability when compared with that prepared by alkali-catalyzed method from waste oil. Therefore, supercritical methanol method is useful especially for oils/fats having higher peroxide values. 32 refs., 8 figs., 3 tabs.

Supercritical fluid extraction of bi & multi-layer graphene sheets from graphite by using exfoliation technique

Science.gov (United States)

Xavier, Gauravi; Dave, Bhoomi; Khanna, Sakshum

2018-05-01

In recent times, researchers have turned to explore the possibility of using Supercritical Fluid (SCFs) system to penetrate into the inert-gaping of graphite and exfoliate it into a number of layer graphene sheets. The supercritical fluid holds excellent wetting surfaces with low interfacial tension and high diffusion coefficients. Although SCFs exfoliation approach looks promising to developed large scale & low-cost graphene sheet but has not received much attention. To arouse interest and reflection on this approach, this review is organized to summarize the recent progress in graphene production by SCF technology. Here we present the simplest route to obtained layers of graphene sheets by intercalating and exfoliating graphite using supercritical CO2 processing. The layers graphene nano-sheets were collected in dichloromethane (DCM) solution which prevents the restocking of sheets. The obtained graphene sheets show the desired characteristics and thus can be used in physical, chemical and biological sciences. Thus this method provides an effortless and eco-friendly approach for the synthesis of layers of graphene sheets.

The influence of radiative transfer on the turbulent flow inside solar absorbers operating with supercritical CO

NARCIS (Netherlands)

Pecnik, R.; Smit, S.H.H.J.; Patel, A.; Roekaerts, D.J.E.M.

2016-01-01

In this paper we investigate and compare two dierent solar receiver technologies for concentrated solar power plants operating with supercritical CO2. The rst receiver is based on conventional surface absorbers, while the second receiver is based on an innovative idea to use volumetric receivers

Operation and Performance of the Supercritical Fluids Reactor (SFR)

National Research Council Canada - National Science Library

Hanush, R

1996-01-01

The Supercritical Fluids Reactor (SFR) at Sandia National Laboratories, CA has been developed to examine and solve engineering, process, and fundamental chemistry issues regarding the development of supercritical water oxidation (SCWO...

Nitrate conversion and supercritical fluid extraction of UO2-CeO2 solid solution prepared by an electrolytic reduction-coprecipitation method

International Nuclear Information System (INIS)

Zhu, L.Y.; Duan, W.H.; Wen, M.F.; Xu, J.M.; Zhu, Y.J.

2014-01-01

A low-waste technology for the reprocessing of spent nuclear fuel (SNF) has been developed recently, which involves the conversion of actinide and lanthanide oxides with liquid N 2 O 4 into their nitrates followed by supercritical fluid extraction of the nitrates. The possibility of the reprocessing of SNF from high-temperature gas-cooled reactors (HTGRs) with nitrate conversion and supercritical fluid extraction is a current area of research in China. Here, a UO 2 -CeO 2 solid solution was prepared as a surrogate for a UO 2 -PuO 2 solid solution, and the recovery of U and Ce from the UO 2 -CeO 2 solid solution with liquid N 2 O 4 and supercritical CO 2 containing tri-n-butyl phosphate (TBP) was investigated. The UO 2 -CeO 2 solid solution prepared by electrolytic reduction-coprecipitation method had square plate microstructures. The solid solution after heat treatment was completely converted into nitrates with liquid N 2 O 4 . The XRD pattern of the nitrates was similar to that of UO 2 (NO 3 ) 2 . 3H 2 O. After 120 min of online extraction at 25 MPa and 50 , 99.98% of the U and 98.74% of the Ce were recovered from the nitrates with supercritical CO 2 containing TBP. The results suggest a promising potential technology for the reprocessing of SNF from HTGRs. (orig.)

Numerical investigation of flow instability in parallel channels with supercritical water

International Nuclear Information System (INIS)

Shitsi, Edward; Debrah, Seth Kofi; Agbodemegbe, Vincent Yao; Ampomah-Amoako, Emmanuel

2017-01-01

Highlights: •Supercritical flow instability in parallel channels is investigated. •Flow dynamics and heat transfer characteristics are analyzed. •Mass flow rate, pressure, heating power, and axial power shape have significant effects on flow instability. •Numerical results are validated with experimental results. -- Abstract: SCWR is one of the selected Gen IV reactors purposely for electricity generation in the near future. It is a promising technology with higher efficiency compared to current LWRs but without the challenges of heat transfer and its associated flow instability. Supercritical flow instability is mainly caused by sharp change in the coolant properties around the pseudo-critical point of the working fluid and research into this phenomenon is needed to address concerns of flow instability at supercritical pressures. Flow instability in parallel channels at supercritical pressures is investigated in this paper using a three dimensional (3D) numerical tool (STAR-CCM+). The dynamics characteristics such as amplitude and period of out-of-phase inlet mass flow oscillation at the heated channel inlet, and heat transfer characteristic such as maximum outlet temperature of the heated channel outlet temperature oscillation are discussed. Influences of system parameters such as axial power shape, pressure, mass flow rate, and gravity are discussed based on the obtained mass flow and temperature oscillations. The results show that the system parameters have significant effect on the amplitude of the mass flow oscillation and maximum temperature of the heated outlet temperature oscillation but have little effect on the period of the mass flow oscillation. The amplitude of mass flow oscillation and maximum temperature of the heated channel outlet temperature oscillation increase with heating power. The numerical results when compared to experiment data show that the 3D numerical tool (STAR-CCM+) could capture dynamics and heat transfer characteristics of

Determination of major aromatic constituents in vanilla using an on-line supercritical fluid extraction coupled with supercritical fluid chromatography.

Science.gov (United States)

Liang, Yanshan; Liu, Jiaqi; Zhong, Qisheng; Shen, Lingling; Yao, Jinting; Huang, Taohong; Zhou, Ting

2018-04-01

An on-line supercritical fluid extraction coupled with supercritical fluid chromatography method was developed for the determination of four major aromatic constituents in vanilla. The parameters of supercritical fluid extraction were systematically investigated using single factor optimization experiments and response surface methodology by a Box-Behnken design. The modifier ratio, split ratio, and the extraction temperature and pressure were the major parameters which have significant effects on the extraction. While the static extraction time, dynamic extraction time, and recycle time had little influence on the compounds with low polarity. Under the optimized conditions, the relative extraction efficiencies of all the constituents reached 89.0-95.1%. The limits of quantification were in the range of 1.123-4.747 μg. The limits of detection were in the range of 0.3368-1.424 μg. The recoveries of the four analytes were in the range of 76.1-88.9%. The relative standard deviations of intra- and interday precision ranged from 4.2 to 7.6%. Compared with other off-line methods, the present method obtained higher extraction yields for all four aromatic constituents. Finally, this method has been applied to the analysis of vanilla from different sources. On the basis of the results, the on-line supercritical fluid extraction-supercritical fluid chromatography method shows great promise in the analysis of aromatic constituents in natural products. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

DEFF Research Database (Denmark)

Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

2018-01-01

and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

Heat Transfer Phenomena of Supercritical Fluids

Energy Technology Data Exchange (ETDEWEB)

Krau, Carmen Isabella; Kuhn, Dietmar; Schulenberg, Thomas [Forschungszentrum Karlsruhe, Institute for Nuclear and Energy Technologies, 76021 Karlsruhe (Germany)

2008-07-01

In concepts for supercritical water cooled reactors, the reactor core is cooled and moderated by water at supercritical pressures. The significant temperature dependence of the fluid properties of water requires an exact knowledge of the heat transfer mechanism to avoid fuel pin damages. Near the pseudo-critical point a deterioration of heat transfer might happen. Processes, that take place in this case, are not fully understood and are due to be examined systematically. In this paper a general overview on the properties of supercritical water is given, experimental observations of different authors will be reviewed in order to identify heat transfer phenomena and onset of occurrence. The conceptional design of a test rig to investigate heat transfer in the boundary layer will be discussed. Both, water and carbon dioxide, may serve as operating fluids. The loop, including instrumentation and safety devices, is shown and suitable measuring methods are described. (authors)

Upgrading of bitumen using supercritical water

Energy Technology Data Exchange (ETDEWEB)

Kayukawa, T. [JGC Corp., Ibaraki (Japan)

2009-07-01

This presentation outlined the technical and economic aspects of thermal cracking by supercritical water. Supercritical water (SCW) is a commonly used method for upgrading heavy oil to produce pipeline-transportable oil from high-viscous bitumen. The process uses water and does not require hydrogen nor catalysts. Pre-heated bitumen and water enter a vertical reactor with flows of counter current at the supercritical point of water. The upgraded synthetic crude oil (SCO) and pitch are obtained from the top of the reactor when the bitumen is thermally cracked. Bench-scale studies have shown that Canadian oil sands bitumen can be converted to 80 volume per cent of SCO and 20 volume per cent of pitch. The SCO has satisfied Canadian pipeline specifications in terms of API gravity and kinetic viscosity. The kinetic viscosity of the pitch has also satisfied boiler fuel specifications. tabs., figs.

Heat Transfer Behaviour and Thermohydraulics Code Testing for Supercritical Water Cooled Reactors (SCWRs)

International Nuclear Information System (INIS)

2014-08-01

The supercritical water cooled reactor (SCWR) is an innovative water cooled reactor concept which uses water pressurized above its thermodynamic critical pressure as the reactor coolant. This concept offers high thermal efficiencies and a simplified reactor system, and is hence expected to help to improve economic competitiveness. Various kinds of SCWR concepts have been developed, with varying combinations of reactor type (pressure vessel or pressure tube) and core spectrum (thermal, fast or mixed). There is great interest in both developing and developed countries in the research and development (R&D) and conceptual design of SCWRs. Considering the high interest shown in a number of Member States, the IAEA established in 2008 the Coordinated Research Project (CRP) on Heat Transfer Behaviour and Thermo-hydraulics Code Testing for SCWRs. The aim was to foster international collaboration in the R&D of SCWRs in support of Member States’ efforts and under the auspices of the IAEA Nuclear Energy Department’s Technical Working Groups on Advanced Technologies for Light Water Reactors (TWG-LWR) and Heavy Water Reactors (TWG-HWR). The two key objectives of the CRP were to establish accurate databases on the thermohydraulics of supercritical pressure fluids and to test analysis methods for SCWR thermohydraulic behaviour to identify code development needs. In total, 16 institutes from nine Member States and two international organizations were involved in the CRP. The thermohydraulics phenomena investigated in the CRP included heat transfer and pressure loss characteristics of supercritical pressure fluids, development of new heat transfer prediction methods, critical flow during depressurization from supercritical conditions, flow stability and natural circulation in supercritical pressure systems. Two code testing benchmark exercises were performed for steady state heat transfer and flow stability in a heated channel. The CRP was completed with the planned outputs in

Heat Transfer Behaviour and Thermohydraulics Code Testing for Supercritical Water Cooled Reactors (SCWRs)

Energy Technology Data Exchange (ETDEWEB)

NONE

2014-08-15

The supercritical water cooled reactor (SCWR) is an innovative water cooled reactor concept which uses water pressurized above its thermodynamic critical pressure as the reactor coolant. This concept offers high thermal efficiencies and a simplified reactor system, and is hence expected to help to improve economic competitiveness. Various kinds of SCWR concepts have been developed, with varying combinations of reactor type (pressure vessel or pressure tube) and core spectrum (thermal, fast or mixed). There is great interest in both developing and developed countries in the research and development (R&D) and conceptual design of SCWRs. Considering the high interest shown in a number of Member States, the IAEA established in 2008 the Coordinated Research Project (CRP) on Heat Transfer Behaviour and Thermo-hydraulics Code Testing for SCWRs. The aim was to foster international collaboration in the R&D of SCWRs in support of Member States’ efforts and under the auspices of the IAEA Nuclear Energy Department’s Technical Working Groups on Advanced Technologies for Light Water Reactors (TWG-LWR) and Heavy Water Reactors (TWG-HWR). The two key objectives of the CRP were to establish accurate databases on the thermohydraulics of supercritical pressure fluids and to test analysis methods for SCWR thermohydraulic behaviour to identify code development needs. In total, 16 institutes from nine Member States and two international organizations were involved in the CRP. The thermohydraulics phenomena investigated in the CRP included heat transfer and pressure loss characteristics of supercritical pressure fluids, development of new heat transfer prediction methods, critical flow during depressurization from supercritical conditions, flow stability and natural circulation in supercritical pressure systems. Two code testing benchmark exercises were performed for steady state heat transfer and flow stability in a heated channel. The CRP was completed with the planned outputs in

Operation Test of the Supercritical CO{sub 2} Compressor Supported with Active Magnetic Bearing

Energy Technology Data Exchange (ETDEWEB)

Cha, Jae Eun [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Cho, Seong Kuk; Lee, Jeong IK [KAIST, Daejeon (Korea, Republic of)

2016-10-15

In this paper, the operation test status of the SCIEL sCO{sub 2} AMB Compressor is briefly described. The Supercritical CO{sub 2} Brayton Cycle Integral Experiment Loop (SCIEL) has been installed in Korea Atomic Energy Research Institute (KAERI) to develop the element technologies for the sCO{sub 2} cycle power generation system. The operation of the SCIEL has mainly focused on sCO{sub 2} compressor development and establishing sCO{sub 2} system control logic. The installation of the SCIEL low compression loop was finished in December 2014 and research team succeeded in generating electric power on the supercritical state of the CO{sub 2} in May 2015. The SCIEL has been built in KAERI to develop the element technologies and the system control logics for the sCO{sub 2} cycle power conversion unit of the next generation reactor. For the stable operation of the sCO{sub 2} compressor under high rotational speed, the AMB sCO{sub 2} compressor was developed and achieved the maximum 40,000 rpm.

Updated heat transfer correlations for supercritical water-cooled reactor applications

International Nuclear Information System (INIS)

Mokry, S.J.; Pioro, I.L.; Farah, A.; King, K.

2011-01-01

In support of the development of SuperCritical Water-cooled Reactors (SCWRs), research is currently being conducted for heat-transfer at supercritical conditions. Currently, there are no experimental datasets for heat transfer from power reactor fuel bundles to the fuel coolant (Water) available in open literature. Therefore, for preliminary calculations, heat-transfer correlations obtained with bare tube data can be used as a conservative approach. A large set of experimental data, for supercritical water was analyzed and an updated heat-transfer correlation for forced-convective heat-transfer, in the normal heat transfer regime, was developed. This experimental dataset was obtained within conditions similar to those for proposed SCWR concepts. Thus, this new correlation can be used for preliminary heat-transfer calculations in SCWR fuel channels. It has demonstrated a good fit for the analyzed dataset. Experiments with SuperCritical Water (SCW) are very expensive. Therefore, a number of experiments are performed in modeling fluids, such as carbon dioxide and refrigerants. However, there is no common opinion if SC modeling fluids' correlations can be applied to SCW and vice versa. Therefore, a correlation for supercritical carbon dioxide heat transfer was developed as a less expensive alternative to using supercritical water. The conducted analysis also meets the objective of improving our fundamental knowledge of the transport processes and handling of supercritical fluids. These correlations can be used for supercritical water heat exchangers linked to indirect-cycle concepts and the cogeneration of hydrogen, for future comparisons with other independent datasets, with bundle data, for the verification of computer codes for SCWR core thermalhydraulics and for the verification of scaling parameters between water and modeling fluids. (author)

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Energy Technology Data Exchange (ETDEWEB)

Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

2015-11-15

The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

Directory of Open Access Journals (Sweden)

Soares D.

2006-01-01

Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

Commentary: Photothermal effects of laser tissue soldering

International Nuclear Information System (INIS)

Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

1999-01-01

Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

Circuit reliability boosted by soldering pins of disconnect plugs to sockets

Science.gov (United States)

Pierce, W. B.

1964-01-01

Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

A finite-dimensional reduction method for slightly supercritical elliptic problems

Directory of Open Access Journals (Sweden)

Riccardo Molle

2004-01-01

Full Text Available We describe a finite-dimensional reduction method to find solutions for a class of slightly supercritical elliptic problems. A suitable truncation argument allows us to work in the usual Sobolev space even in the presence of supercritical nonlinearities: we modify the supercritical term in such a way to have subcritical approximating problems; for these problems, the finite-dimensional reduction can be obtained applying the methods already developed in the subcritical case; finally, we show that, if the truncation is realized at a sufficiently large level, then the solutions of the approximating problems, given by these methods, also solve the supercritical problems when the parameter is small enough.

Electrodeposition of germanium from supercritical fluids.

Science.gov (United States)

Ke, Jie; Bartlett, Philip N; Cook, David; Easun, Timothy L; George, Michael W; Levason, William; Reid, Gillian; Smith, David; Su, Wenta; Zhang, Wenjian

2012-01-28

Several Ge(II) and Ge(IV) compounds were investigated as possible reagents for the electrodeposition of Ge from liquid CH(3)CN and CH(2)F(2) and supercritical CO(2) containing as a co-solvent CH(3)CN (scCO(2)) and supercritical CH(2)F(2) (scCH(2)F(2)). For Ge(II) reagents the most promising results were obtained using [NBu(n)(4)][GeCl(3)]. However the reproducibility was poor and the reduction currents were significantly less than the estimated mass transport limited values. Deposition of Ge containing films was possible at high cathodic potential from [NBu(n)(4)][GeCl(3)] in liquid CH(3)CN and supercritical CO(2) containing CH(3)CN but in all cases they were heavily contaminated by C, O, F and Cl. Much more promising results were obtained using GeCl(4) in liquid CH(2)F(2) and supercritical CH(2)F(2). In this case the reduction currents were consistent with mass transport limited reduction and bulk electrodeposition produced amorphous films of Ge. Characterisation by XPS showed the presence of low levels of O, F and C, XPS confirmed the presence of Ge together with germanium oxides, and Raman spectroscopy showed that the as deposited amorphous Ge could be crystallised by the laser used in obtaining the Raman measurements.

Computational fluid dynamic model for glycerol gasification in supercritical water in a tee junction shaped cylindrical reactor

NARCIS (Netherlands)

Yukananto, Riza; Pozarlik, Artur K.; Brem, Gerrit

2018-01-01

Gasification in supercritical water is a very promising technology to process wet biomass into a valuable gas. Providing insight of the process behavior is therefore very important. In this research a computational fluid dynamic model is developed to investigate glycerol gasification in

Chemical deposition methods using supercritical fluid solutions

Science.gov (United States)

Sievers, Robert E.; Hansen, Brian N.

1990-01-01

A method for depositing a film of a desired material on a substrate comprises dissolving at least one reagent in a supercritical fluid comprising at least one solvent. Either the reagent is capable of reacting with or is a precursor of a compound capable of reacting with the solvent to form the desired product, or at least one additional reagent is included in the supercritical solution and is capable of reacting with or is a precursor of a compound capable of reacting with the first reagent or with a compound derived from the first reagent to form the desired material. The supercritical solution is expanded to produce a vapor or aerosol and a chemical reaction is induced in the vapor or aerosol so that a film of the desired material resulting from the chemical reaction is deposited on the substrate surface. In an alternate embodiment, the supercritical solution containing at least one reagent is expanded to produce a vapor or aerosol which is then mixed with a gas containing at least one additional reagent. A chemical reaction is induced in the resulting mixture so that a film of the desired material is deposited.

Optimization of metals extraction using cyanex series and NaDDC reagents in liquid/supercritical CO{sub 2}

Energy Technology Data Exchange (ETDEWEB)

Ko, M. S.; Kim, S. H.; Park, K. H.; Kim, H. D.; Kim, H. W. [Kyunghee Univ., Youngin (Korea, Republic of)

2002-05-01

In this research, extraction of small fraction of radioactive elements from mixed contaminated working dress has been conducted by organic solvent extraction, but use of organic solvents has created secondary wastes. In this study, liquid/supercritical fluid CO{sub 2}, an environmentally friendly solvent, was used to extract five metals(Co, Cu, Pb, Cd, Zn). Using five metals selective ligand Cyanex-272 and NaDDC, the most optimized extraction conditions were founded 20 .deg. C, 100atm and complexed ratio(Cyanex-272: 100mg, NaDDC:5mg). The results suggest the possibility of utilizing supercritical fluid technology for extraction of metals from contaminated working dress.

Optical wave microphone measurements of laser ablation of copper in supercritical carbon dioxide

Energy Technology Data Exchange (ETDEWEB)

Mitsugi, Fumiaki, E-mail: mitsugi@cs.kumamoto-u.ac.jp [Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555 (Japan); Ikegami, Tomoaki [Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555 (Japan); Nakamiya, Toshiyuki; Sonoda, Yoshito [Graduate School of Industrial Engineering, Tokai University, 9-1-1 Toroku, Kumamoto 862-8652 (Japan)

2013-11-29

Laser ablation plasma in a supercritical fluid has attracted much attention recently due to its usefulness in forming nanoparticles. Observation of the dynamic behavior of the supercritical fluid after laser irradiation of a solid is necessary for real-time monitoring and control of laser ablation. In this study, we utilized an optical wave microphone to monitor pulsed laser irradiation of a solid in a supercritical fluid. The optical wave microphone works based on Fraunhofer diffraction of phase modulation of light by changes in refractive index. We hereby report on our measurements for pulsed laser irradiation of a Cu target in supercritical carbon dioxide using an optical wave microphone. Photothermal acoustic waves which generated after single pulsed laser irradiation of a Cu target were detectable in supercritical carbon dioxide. The speed of sound around the critical point of supercritical carbon dioxide was clearly slower than that in gas. The optical wave microphone detected a signal during laser ablation of Cu in supercritical carbon dioxide that was caused by shockwave degeneration. - Highlights: • Photothermal acoustic wave in supercritical fluid was observed. • Sound speed around the critical point was slower than that in gas. • Optical wave microphone detected degeneration of a shockwave. • Ablation threshold of a solid in supercritical fluid can be estimated. • Generation of the second shockwave in supercritical phase was suggested.

Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

Science.gov (United States)

Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

2018-05-01

Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Directory of Open Access Journals (Sweden)

Jinhua Mi

2014-01-01

Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

Integration between direct steam generation in linear solar collectors and supercritical carbon dioxide Brayton power cycles

OpenAIRE

Coco Enríquez, Luis; Muñoz Antón, Javier; Martínez-Val Peñalosa, José María

2015-01-01

Direct Steam Generation in Parabolic Troughs or Linear Fresnel solar collectors is a technology under development since beginning of nineties (1990's) for replacing thermal oils and molten salts as heat transfer fluids in concentrated solar power plants, avoiding environmental impacts. In parallel to the direct steam generation technology development, supercritical Carbon Dioxide Brayton power cycles are maturing as an alternative to traditional Rankine cycles for increasing net plant efficie...

Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

Directory of Open Access Journals (Sweden)

Georgiana PADURARU

2016-03-01

Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

Selective free radical reactions using supercritical carbon dioxide.

Science.gov (United States)

Cormier, Philip J; Clarke, Ryan M; McFadden, Ryan M L; Ghandi, Khashayar

2014-02-12

We report herein a means to modify the reactivity of alkenes, and particularly to modify their selectivity toward reactions with nonpolar reactants (e.g., nonpolar free radicals) in supercritical carbon dioxide near the critical point. Rate constants for free radical addition of the light hydrogen isotope muonium to ethylene, vinylidene fluoride, and vinylidene chloride in supercritical carbon dioxide are compared over a range of pressures and temperatures. Near carbon dioxide's critical point, the addition to ethylene exhibits critical speeding up, while the halogenated analogues display critical slowing. This suggests that supercritical carbon dioxide as a solvent may be used to tune alkene chemistry in near-critical conditions.

Fatigue damage modeling in solder interconnects using a cohesive zone approach

NARCIS (Netherlands)

Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

2005-01-01

The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

OpenAIRE

Koo, Ja-Myeong; Jung, Seung-Boo

2007-01-01

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

Catalyst retention in continuous flow with supercritical carbon dioxide

NARCIS (Netherlands)

Stouten, S.C.; Noel, T.; Wang, Q.; Hessel, V.

2014-01-01

This review discusses the retention of organometallic catalysts in continuous flow processes utilizing supercritical carbon dioxide. Due to its innovative properties, supercritical carbon dioxide offers interesting possibilities for process intensification. As a result of safety and cost

Pushing the speed limit in enantioselective supercritical fluid chromatography.

Science.gov (United States)

Regalado, Erik L; Welch, Christopher J

2015-08-01

Chromatographic enantioseparations on the order of a few seconds can be achieved by supercritical fluid chromatography using short columns packed with chiral stationary phases. The evolution of 'world record' speeds for the chromatographic separation of enantiomers has steadily dropped from an industry standard of 20-40 min just two decades ago, to a current ability to perform many enantioseparations in well under a minute. Improvements in instrument and column technologies enabled this revolution, but the ability to predict optimal separation time from an initial method development screening assay using the t(min cc) predictor greatly simplifies the development and optimization of high-speed chiral chromatographic separations. In this study, we illustrate how the use of this simple tool in combination with the workhorse technique of supercritical fluid chromatography on customized short chiral columns (1-2 cm length) allows us to achieve ultrafast enantioseparations of pharmaceutically relevant compounds on the 5-20 s scale, bringing the technique of high-throughput enantiopurity analysis out of the specialist realm and into the laboratories of most researchers. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

Science.gov (United States)

Darbandi, Payam

Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

Directory of Open Access Journals (Sweden)

Mitovski Aleksandra M.

2009-01-01

Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

Destruction of polyphasic systems in supercritical water reaction media

International Nuclear Information System (INIS)

Leybros, A.

2009-12-01

Spent ion exchange resins (IER) are, hence, radioactive process wastes for which there is no satisfactory industrial treatment. Supercritical water oxidation offers a viable alternative treatment to destroy the organic structure of resins by using supercritical water properties. The reactor used in Supercritical Fluids and Membranes Laboratory is a double shell stirred reactor. Total Organic Carbon reduction rates higher than 99% were obtained thanks to POSCEA2 experimental set-up when using a co-fuel, isopropyl alcohol. Influence of operating parameters was studied. A detailed reactional mechanism for cationic and anionic resins is created. For the solubilization of the particles in supercritical water, a mechanism has been created with the identified rate determining species and implemented into Fluent software through the EDC approach. Experimental temperature profiles are well represented by EDC model. Reaction rates are hence controlled by the chemical species mixing. (author)

Sutureless liver repair and hemorrhage control using laser-mediated fusion of human albumin as a solder.

Science.gov (United States)

Wadia, Y; Xie, H; Kajitani, M

2001-07-01

Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. We evaluated laser soldering using liquid albumin for welding liver injuries. Fourteen lacerations (6 x 2 cm) and 13 nonanatomic resection injuries (raw surface, 8 x 2 cm) were repaired. An 805-nm laser was used to weld 53% liquid albumin-indocyanine green solder to the liver surface, reinforcing it by welding a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, 16 soldering repairs were evaluated acutely at 3 hours. Eleven animals were evaluated chronically, two at 2 weeks and nine at 4 weeks. All 27 laser mediated-liver repairs had minimal blood loss compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. All 11 chronic repairs healed without complication. This modality effectively seals the liver surface, joins lacerations with minimal thermal injury, and works independently of the patient's coagulation status.

Blended polymer materials extractable with supercritical carbon dioxide

Science.gov (United States)