Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

CERN Document Server

Brönnimann, C; Gobrecht, J; Heising, S; Horisberger, M; Horisberger, R P; Kästli, H C; Lehmann, J; Rohe, T; Streuli, S; Broennimann, Ch.

2006-01-01

The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflown indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflown afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a seco...

Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

Science.gov (United States)

Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

2016-01-01

In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

The first bump-bonded pixel detectors on CVD diamond

International Nuclear Information System (INIS)

Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G.

1999-01-01

Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 μm was observed, consistent with expectations given the detector pitch

The first bump-bonded pixel detectors on CVD diamond

CERN Document Server

Adam, W; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Fried, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Palmieri, V G; Pan, L S; Peitz, A; Pernicka, Manfred; Pirollo, S; Polesello, P; Pretzl, Klaus P; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Steuerer, J; Stone, R; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Turchetta, R; Vittone, E; Wagner, A; Walsh, A M; Wedenig, R; Weilhammer, Peter; Zeuner, W; Ziock, H J; Zöller, M; Charles, E; Ciocio, A; Dao, K; Einsweiler, Kevin F; Fasching, D; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Milgrome, O; Palaio, N; Richardson, J; Sinervo, P K; Zizka, G

1999-01-01

Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98565544f the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 mu m was observed, consistent with expectations given the detector pitch. (13 refs).

The first bump-bonded pixel detectors on CVD diamond

Energy Technology Data Exchange (ETDEWEB)

Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W. E-mail: william@physics.utoronto.ca; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G

1999-11-01

Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 {mu}m was observed, consistent with expectations given the detector pitch.

Solder bond requirement for large, built-up, high-performance conductors

International Nuclear Information System (INIS)

Willig, R.L.

1981-01-01

Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

Directory of Open Access Journals (Sweden)

Enrico Mick

2015-07-01

Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

Science.gov (United States)

2015-05-05

under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs

International Nuclear Information System (INIS)

Unno, Y.; Hanagaki, K.; Hori, R.; Ikegami, Y.; Nakamura, K.; Takubo, Y.; Kamada, S.; Yamamura, K.; Yamamoto, H.; Takashima, R.; Tojo, J.; Kono, T.; Nagai, R.; Saito, S.; Sugibayashi, K.; Hirose, M.; Jinnouchi, O.; Sato, S.; Sawai, H.; Hara, K.

2017-01-01

We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n + -in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in wafer. Variation in readout connection for the pixels at the boundary of ASICs is implemented in the design of quadsensors. Bump bonding technology is developed for four ASICs onto one quadsensor. Both sensors and ASICs are thinned to 150 μm before bump bonding, and are held flat with vacuum chucks. Using lead-free SnAg solder bumps, we encounter deficiency with large areas of disconnected bumps after thermal stress treatment, including irradiation. Surface oxidation of the solder bumps is identified as a critical source of this deficiency after bump bonding trials, using SnAg bumps with solder flux, indium bumps, and SnAg bumps with a newly-introduced hydrogen-reflow process. With hydrogen-reflow, we establish flux-less bump bonding technology with SnAg bumps, appropriate for mass production of the flip-chip modules with thin sensors and thin ASICs.

Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

DEFF Research Database (Denmark)

Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

2018-01-01

and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

DEFF Research Database (Denmark)

Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

1998-01-01

: (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Directory of Open Access Journals (Sweden)

Shuye Zhang

2018-01-01

Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

Science.gov (United States)

Abdelhadi, Ousama Mohamed Omer

Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

Non-contact estimation of the bond quality in soldered thin laminate by laser generated lamb waves; Laser reiki ramuha ni yoru handazuke sekisohaku no setsugo seijo no hisesshoku hyoka

Energy Technology Data Exchange (ETDEWEB)

Kasama, H.; Futatsugi, T.; Cho, H.; Takemoto, M. [Aoyama-Gakuin University, Tokyo (Japan). Faculty of Science and Engineering

1998-03-20

The bond quality of a solder-bonded copper laminated plate was modeled into rigid contact (rc) and slip contact (sc) to calculate the velocity dispersion of lamb waves. The velocity dispersion of laser generated lamb waves was measured, and the bond quality or the thickness of a solder layer was evaluated by non-contact. In the model whose bond surface is rc, the velocity dispersion of lamb waves can be calculated under conditions where the stress and displacement in an interface are continuous. In the model whose bond surface is sc, it can be calculated under conditions where an interface slips freely. Weak bond indicates the velocity dispersion between rc and sc. In this model, the velocity dispersion can also be calculated by a change in the thickness of a solder layer and used for quantitative evaluation of a bond interface. A three-layer solder bond manufactured for trial could be evaluated from the velocity dispersion of laser lamb waves. At the room temperature, the change in bond quality near the solder melting point of bond laminate that was judged as rc was investigated. When the solidus temperature is exceeded, the amplitude of lamb waves and the velocity dispersion changed largely. The amplitude of lamb waves increases as the liquid phase ratio increases. The bond quality near the solder melting point can be evaluated using lamb waves. 9 refs., 10 figs., 2 tabs.

Soldering of Nanotubes onto Microelectrodes

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Directory of Open Access Journals (Sweden)

Roman Koleňák

2018-04-01

Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

Photothermal effects of laser tissue soldering

International Nuclear Information System (INIS)

McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

1999-01-01

Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

Fatigue damage modeling in solder interconnects using a cohesive zone approach

NARCIS (Netherlands)

Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

2005-01-01

The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

International joint research project of venture seeds excavating type in fiscal 1999 (revised) - venture seeds No.3. Report on achievements in developing bump forming technologies for high-density semiconductor connection; 1999 nendo (hosei) venture seeds hakkutsugata kokusai kyodo kenkyu jigyo - venture seeds No.3. Komitsudo handotai setsuzokuyo bump gata keisei gijutsu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

2001-03-01

Development has been advanced on a new flip chip technology with high efficiency and reliability to mount on lead frames and substrates the semiconductor devices that have been made higher in density and function and smaller in size. Specifically, discussions were given on a bump forming technology using micro balls with high accuracy and sphericity. With this technology, bumps are formed with high accuracy and efficiency by transferring and bonding the micro balls onto electrodes. Activities were taken in the following five areas: 1) discussions on the micro ball arranging technology, 2) optimization and evaluation on bed films, 3) manufacture and evaluation on micro balls, 4) overall evaluation and improvement discussion on quality and cost, and 5) analysis of thermal stress on soldered balls. In Item 1), micro balls are transferred onto pads after removing excess balls by sucking them into a suction head while having the micro balls float in a container by means of vibration. The suction arrangement plates were discussed and the suction system was optimized, whereas it was verified that balls with diameter of 100 {mu} m can be transferred and bonded onto pads of the chips without excess and insufficiency. (NEDO)

Optimal parameters for laser tissue soldering

Science.gov (United States)

McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

1998-07-01

Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

Science.gov (United States)

Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

2017-08-01

Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

Efforts to Develop a 300°C Solder

Energy Technology Data Exchange (ETDEWEB)

Norann, Randy A [Perma Works LLC

2015-01-25

This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

TRACKING TESTS FOR THE SNS FAST INJECTION BUMP POWER SUPPLY

International Nuclear Information System (INIS)

ENG, W.; CUTLER, R.; DEWAN, S.

2004-01-01

The tracking requirement of the SNS Fast Injection Bump power supplies is described. In addition to the usual tracking between the load current and the input reference of a power supply, these power supplies must also track between pairs of units under slightly different loads. This paper describes the use of a current-null test to measure tracking performances. For the actual tests, a single dummy magnet load was used to measure the tracking between the first two production units at the manufacturer's facility. Using the Yokogawa WE7000 waveform. PC-based measurement instrument, input and output waveforms are digitized and stored in data files. A program written for this application is then used to extract data from these files to construct, analyze the waveforms and characterize the power supply performance. Results of the measurements of two SNS Fast Injection Bump power supplies will be presented in this paper

Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging

Science.gov (United States)

Shih, T. I.; Duh, J. G.

2008-06-01

The decapsulation of flip chips bonded to ceramic substrates is a challenging task in the packaging industry owing to the vulnerability of the chip surface during the process. In conventional methods, such as manual grinding and polishing, the solder bumps are easily damaged during the removal of underfill, and the thin chip may even be crushed due to mechanical stress. An efficient and reliable decapsulation method consisting of thermal and chemical processes was developed in this study. The surface quality of chips after solder removal is satisfactory for the existing solder rework procedure as well as for die-level failure analysis. The innovative processes included heat-sink and ceramic substrate removal, solder bump separation, and solder residue cleaning from the chip surface. In the last stage, particular temperatures were selected for the removal of eutectic Pb-Sn, high-lead, and lead-free solders considering their respective melting points.

Characteristics of solder joints under fatigue loads using piezomechanical actuation

Science.gov (United States)

Shim, Dong-Jin; Spearing, S. Mark

2003-07-01

Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

New magic angle bumps and magic translation bumps

International Nuclear Information System (INIS)

Seeman, J.

1983-01-01

SLC beams of opposite charge can be transversely deflected in the same direction by RF fields in the accelerating cavities caused by girder tilts, coupler-asymmetries, or manufacturing errors. A symmetric deflection can be corrected by a magic angle bump if the deflection is located adjacent to one of the linac quadrupoles. However, if the deflection is located between quadrupoles, two magic angle bumps or a magic angle bump and a magic translation bump are needed for the correction. Several examples of translation bumps are included. A new magic angle bump is also presented which is longitudinally compressed and has significantly reduced particle excursions. Finally, if new correctors are added midway along the girders so that the number of correctors are doubled, then the longitudinal extent and the maximum particle excursion of these new magic bumps can be further reduced

Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

Science.gov (United States)

Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

2015-12-01

Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

CERN Document Server

Karadzhinova, Aneliya; Härkönen, Jaakko; Luukka, Panja-riina; Mäenpää, Teppo; Tuominen, Eija; Haeggstrom, Edward; Kalliopuska, Juha; Vahanen, Sami; Kassamakov, Ivan

2014-01-01

In contemporary high energy physics experiments, silicon detectors are essential for recording the trajectory of new particles generated by multiple simultaneous collisions. Modern particle tracking systems may feature 100 million channels, or pixels, which need to be individually connected to read-out chains. Silicon pixel detectors are typically connected to readout chips by flip-chip bonding using solder bumps. High-quality electro-mechanical flip-chip interconnects minimizes the number of dead read-out channels in the particle tracking system. Furthermore, the detector modules must endure handling during installation and withstand heat generation and cooling during operation. Silicon pixel detector modules were constructed by flip-chip bonding 16 readout chips to a single sensor. Eutectic SnPb solder bumps were deposited on the readout chips and the sensor chips were coated with TiW/Pt thin film UBM (under bump metallization). The modules were assembled at Advacam Ltd, Finland. We studied the uniformity o...

A new method for soldering particle-reinforced aluminum metal matrix composites

Energy Technology Data Exchange (ETDEWEB)

Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

2012-12-01

Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

A new method for soldering particle-reinforced aluminum metal matrix composites

International Nuclear Information System (INIS)

Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

2012-01-01

Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

New results on diamond pixel sensors using ATLAS frontend electronics

International Nuclear Information System (INIS)

Keil, M.; Adam, W.; Berdermann, E.; Bergonzo, P.; Boer, W. de; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D'Angelo, P.; Dabrowski, W.; Delpierre, P.; Dulinski, W.; Doroshenko, J.; Doucet, M.; Eijk, B. van; Fallou, A.; Fischer, P.; Fizzotti, F.; Kania, D.; Gan, K.K.; Grigoriev, E.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kaplon, J.; Kass, R.; Knoepfle, K.T.; Koeth, T.; Krammer, M.; Logiudice, A.; Mac Lynne, L.; Manfredotti, C.; Meier, D.; Menichelli, D.; Meuser, S.; Mishina, M.; Moroni, L.; Noomen, J.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L.; Riester, J.L.; Roe, S.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Trischuk, W.; Tromson, D.; Vittone, E.; Weilhammer, P.; Wermes, N.; Wetstein, M.; Zeuner, W.; Zoeller, M.

2003-01-01

Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented

New results on diamond pixel sensors using ATLAS frontend electronics

CERN Document Server

Keil, Markus; Berdermann, E; Bergonzo, P; de Boer, Wim; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; D'Angelo, P; Dabrowski, W; Delpierre, P A; Dulinski, W

2003-01-01

Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented.

New results on diamond pixel sensors using ATLAS frontend electronics

Energy Technology Data Exchange (ETDEWEB)

Keil, M. E-mail: markus.keil@cern.ch; Adam, W.; Berdermann, E.; Bergonzo, P.; Boer, W. de; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D' Angelo, P.; Dabrowski, W.; Delpierre, P.; Dulinski, W.; Doroshenko, J.; Doucet, M.; Eijk, B. van; Fallou, A.; Fischer, P.; Fizzotti, F.; Kania, D.; Gan, K.K.; Grigoriev, E.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kaplon, J.; Kass, R.; Knoepfle, K.T.; Koeth, T.; Krammer, M.; Logiudice, A.; Mac Lynne, L.; Manfredotti, C.; Meier, D.; Menichelli, D.; Meuser, S.; Mishina, M.; Moroni, L.; Noomen, J.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L.; Riester, J.L.; Roe, S.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Trischuk, W.; Tromson, D.; Vittone, E.; Weilhammer, P.; Wermes, N.; Wetstein, M.; Zeuner, W.; Zoeller, M

2003-03-21

Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented.

New results on diamond pixel sensors using ATLAS frontend electronics

Science.gov (United States)

Keil, M.; Adam, W.; Berdermann, E.; Bergonzo, P.; de Boer, W.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D'Angelo, P.; Dabrowski, W.; Delpierre, P.; Dulinski, W.; Doroshenko, J.; Doucet, M.; van Eijk, B.; Fallou, A.; Fischer, P.; Fizzotti, F.; Kania, D.; Gan, K. K.; Grigoriev, E.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kaplon, J.; Kass, R.; Knöpfle, K. T.; Koeth, T.; Krammer, M.; Logiudice, A.; mac Lynne, L.; Manfredotti, C.; Meier, D.; Menichelli, D.; Meuser, S.; Mishina, M.; Moroni, L.; Noomen, J.; Oh, A.; Pan, L. S.; Pernicka, M.; Perera, L.; Riester, J. L.; Roe, S.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Trischuk, W.; Tromson, D.; Vittone, E.; Weilhammer, P.; Wermes, N.; Wetstein, M.; Zeuner, W.; Zoeller, M.

2003-03-01

Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented.

Dye-enhanced protein solders and patches in laser-assisted tissue welding.

Science.gov (United States)

Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

1997-01-01

This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Science.gov (United States)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Development of a soft-soldering system for aluminum

Science.gov (United States)

Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

1983-03-01

The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

Thin hybrid pixel assembly fabrication development with backside compensation layer

Energy Technology Data Exchange (ETDEWEB)

Bates, R., E-mail: richard.bates@glasgow.ac.uk [Experimental Particle Physics Group, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ (United Kingdom); Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F. [Experimental Particle Physics Group, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ (United Kingdom); Pares, G.; Vignoud, L.; Kholti, B. [CEA Leti, MINATEC, 17 rue des Martyrs, F38054, Grenoble (France); Vahanen, S. [Advacam Oy, Tietotie 3, 02150 Espoo (Finland)

2017-02-11

The ATLAS and CMS experiments will both replace their entire tracking systems for operation at the HL-LHC in 2026. This will include a significantly larger pixel systems, for example, for ATLAS approximately 15 m{sup 2}. To keep the tracker material budget low it is crucial to minimize the mass of the pixel modules via thinning both the sensor and readout chip to about 150 μm each. The bump yield of thin module assemblies using solder based bump bonding can be problematic due to wafer bowing during solder reflow at high temperature. A new bump-bonding process using backside compensation on the readout chip to address the issue of low yield will be presented. The objective is to compensate dynamically the stress of the front side stack by adding a compensating layer to the backside of the wafer. A SiN and Al:Si stack has been chosen for the backside layer. The bow reducing effect of applying a backside compensation layer will be demonstrated using the FE-I4 wafer. The world's first results from assemblies produced from readout wafers thinned to 100 μm with a stress compensation layer are presented with bond yields close to 100% measured using the FE-I4 readout chip.

Soldering handbook

CERN Document Server

Vianco, Paul T

1999-01-01

Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

On the problem of soldering refractory metals with silver-containing solders

International Nuclear Information System (INIS)

Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

1981-01-01

The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

SMT soldering handbook

National Research Council Canada - National Science Library

Strauss, Rudolf

1998-01-01

... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

ICHEP 2016: to b(ump) or not to b(ump)

CERN Multimedia

2016-01-01

This week I’m in Chicago for the 38th International Conference on High Energy Physics, ICHEP 2016, hosted this year by the US particle physics community. While it became clear at the conference that the famous 750 GeV bump has flatlined, there’s been a wealth of physics from CERN and around the world.   Everyone in their heart felt that the bump would turn out to be no more than a statistical fluctuation, while secretly hoping that it would be something new. Even the designer of the ICHEP 2016 logo cleverly hid a bump with a subtle question mark in the Chicago skyline – appropriately enough in Anish Kapoor’s mysterious ‘Cloud Gate’ sculpture. That question mark has now been resolved. Kapoor’s sculpture returns to being just that, and the search for new physics goes on albeit further constrained as theorists revealed in the 400+ papers in the wake of the bump discussion. The highlight from CERN was undoubtedly the spectacular pe...

Soldering in electronics assembly

CERN Document Server

Judd, Mike

2013-01-01

Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

ES-2 Dummy Biomechanical Responses.

Science.gov (United States)

Byrnes, Katie; Abramczyk, Joseph; Berliner, Jeff; Irwin, Annette; Jensen, Jack; Kowsika, Murthy; Mertz, Harold J; Rouhana, Stephen W; Scherer, Risa; Shi, Yibing; Sutterfield, Aleta; Xu, Lan; Tylko, Suzanne; Dalmotas, Dainius

2002-11-01

This technical paper presents the results of biomechanical testing conducted on the ES-2 dummy by the Occupant Safety Research Partnership and Transport Canada. The ES-2 is a production dummy, based on the EuroSID-1 dummy, that was modified to further improve testing capabilities as recommended by users of the EuroSID-1 dummy. Biomechanical response data were obtained by completing a series of drop, pendulum, and sled tests that are outlined in the International Organization of Standardization Technical Report 9790 that describes biofidelity requirements for the midsize adult male side impact dummy. A few of the biofidelity tests were conducted on both sides of the dummy to evaluate the symmetry of its responses. Full vehicle crash tests were conducted to verify if the changes in the EuroSID-1, resulting in the ES-2 design, did improve the dummy's testing capability. In addition to the biofidelity testing, the ES-2 dummy repeatability, reproducibility and durability are discussed. Finally, this technical paper will compare the biofidelity ratings of the current adult side impact dummies with the ES-2 dummy, which received an overall dummy biofidelity rating of 4.6.

Development of high data readout rate pixel module and detector hybridization at Fermilab

International Nuclear Information System (INIS)

Zimmermann, Sergio

2001-01-01

This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology

Vehicle speed control using road bumps

Directory of Open Access Journals (Sweden)

T. A. O. Salau

2004-06-01

Full Text Available Road bumps play a crucial role in enforcing speed limits, thereby preventing overspeeding of vehicles. It significantly contributes to the overall road safety objective through the prevention of accidents that lead to deaths of pedestrians and damage of vehicles. Despite the importance of road bumps, very little research has been done to investigate into their design. While documentation exists on quantitative descriptions of road bumps, they offer little guidance to decision making. This work presents a unique approach to solving road bumps design problems. The results of our study reveal three important road bumps variables that influence the control of vehicle speeds. The key variables are bump height, bump width, and effective distance between two consecutive road bumps. Since vehicle speed control is the ultimate aim of this study the relationship between vehicle speed and other variables earlier mentioned is established. Vehicle speed is defined as the product of frequency at which a vehicle is moving over road bumps and the sum of effective distance between two consecutive road bumps. In the determination of bump height we assume a conical shaped curve for analysis as a matter of research strategy. Based on this, two stages of motion were analysed. The first concerns the motion over the bump itself while the second relates to the motion between two consecutive road bumps. Fourier series was then used to formulate a holistic equation that combines these two stages. We used trigonometric functions to model the behaviour of the first stage while with the second stage giving a functional value of zero since no changes in height are observed. We carried out vibration analysis to determine the effect of road bumps on a vehicular system. Arising from this a model component is referred to as an isolation factor. This offers guidance to the safe frequency at which vehicles could travel over road bumps. The work appears to contribute to knowledge

Processing and characterization of device solder interconnection and module attachment for power electronics modules

Science.gov (United States)

Haque, Shatil

This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

Development of gold based solder candidates for flip chip assembly

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

Science.gov (United States)

Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

2004-10-01

It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

Science.gov (United States)

Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

2006-11-01

Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

WorldSID Prototype Dummy Biomechanical Responses.

Science.gov (United States)

Cesari, D; Compigne, S; Scherer, R; Xu, L; Takahashi, N; Page, M; Asakawa, K; Kostyniuk, G; Hautmann, E; Bortenschlager, K; Sakurai, M; Harigae, T

2001-11-01

The results of biomechanical testing of the WorldSID prototype dummy are presented in this paper. The WorldSID dummy is a new, advanced Worldwide Side Impact Dummy that has the anthropometry of a mid-sized adult male. The first prototype of this dummy has been evaluated by the WorldSID Task Group against previously established corridors for its critical body regions. The response corridors are defined in the International Organization of Standardization (ISO) Technical Report 9790. The prototype is the first version of the WorldSID dummy to be built and tested. This dummy has been subjected to a rigorous program of testing to evaluate, first and foremost its biofidelity, but also its repeatability. Following this initial evaluation, any required modifications will be incorporated into a pre-production version of the WorldSID dummy so that it rates "good" to "excellent" on the ISO dummy biofidelity scale - a rating exceeding that of all current side impact dummies. Also, the overall WorldSID repeatability must not exceed a coefficient of variation of 7% at injury assessment level and this has to be verified for the different body regions. The dummy's head, neck, thorax, abdomen and pelvis were evaluated against the ISO technical report requirements. Testing included drop tests, pendulum impacts, and sled tests. The biofidelity rating of the WorldSID prototype was calculated using the weighted biomechanical test response procedure developed by ISO. The paper presents the results of the testing, which give a very positive indication of the dummy's potential. Based on this evaluation of the dummy biofidelity, the WorldSID prototype dummy exhibits a biofidelity rating of 6.15 that corresponds to an ISO biofidelity classification of "fair". In addition, the dummy shows good repeatability with a global coefficient of variation of 3.30% for the pendulum and rigid sled tests.

Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

International Nuclear Information System (INIS)

Duran, J.; Amo, J. M.; Duran, C. M.

2001-01-01

It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

Laser beam soldering of micro-optical components

Science.gov (United States)

Eberhardt, R.

2003-05-01

MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

Science.gov (United States)

Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

2018-02-01

An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

The reminiscence bump reconsidered: Children's prospective life stories show a bump in young adulthood

DEFF Research Database (Denmark)

Bohn, Annette; Berntsen, Dorthe

2011-01-01

showed a clear bump in young adulthood. In Study 2, children were prompted by word cues to write down events from their future lives. The events generated consisted mostly of non-life-script events, and those events did not show a bump in young adulthood. Our findings challenge prevailing explanations...

Lead free solder mechanics and reliability

CERN Document Server

Pang, John Hock Lye

2012-01-01

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

International Nuclear Information System (INIS)

Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

2009-01-01

Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

The reminiscence bump reconsidered: children's prospective life stories show a bump in young adulthood.

Science.gov (United States)

Bohn, Annette; Berntsen, Dorthe

2011-02-01

The reminiscence bump-the reporting of more memories from young adulthood than from other stages of life-is considered a hallmark of autobiographical memory research. The most prevalent explanations for this effect assume that events in young adulthood are favored because of the way they are encoded and maintained in long-term memory. Here we show that a similar increase of events in early adulthood is found when children narrate their personal futures. In Study 1, children wrote their future life stories. The events in these life stories were mostly life-script events, and their distribution showed a clear bump in young adulthood. In Study 2, children were prompted by word cues to write down events from their future lives. The events generated consisted mostly of non-life-script events, and those events did not show a bump in young adulthood. Our findings challenge prevailing explanations of the reminiscence bump and suggest that the cultural life script forms an overarching organizational principle for autobiographical memories and future representations across the life span.

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

OpenAIRE

Koo, Ja-Myeong; Jung, Seung-Boo

2007-01-01

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

Numeracy Tests For Dummies

CERN Document Server

Beveridge, Colin

2012-01-01

The easy way to get practice and excel at numeracy tests Whether you're looking for a new job, applying to certain university courses, or attempting to join the military, you're increasingly likely to face a numeracy test as part of the screening process. And the only way to prepare for a numeracy test is practise. Numeracy Tests For Dummies is an accessible one-stop guide to pass these test. Featuring expert advice, instruction, review, and plenty of practise, Numeracy Tests For Dummies will help you succeed. Numeracy Tests For Dummies contains instruction and revision on:Basic mathematical k

Recent advances in understanding the reminiscence bump

DEFF Research Database (Denmark)

Koppel, Jonathan; Rubin, David C.

2016-01-01

The reminiscence bump is the increased proportion of autobiographical memories from youth and early adulthood observed in adults over 40. It is one of the most robust findings in autobiographical-memory research. Although described as a single period from which there are more memories, a recent...... meta-analysis that reported the beginning and ending ages of the bump from individual studies found that different classes of cues produce distinct bumps that vary in size and temporal location. The bump obtained in response to cue words is both smaller and located earlier in the life span than...

HANFORD WASTE TANK BUMP ACCIDENT & CONSEQUENCE ANALYSIS

Energy Technology Data Exchange (ETDEWEB)

MEACHAM, J.E.

2005-02-22

Postulated physical scenarios leading to tank bumps were examined. A combination of a substantial supernatant layer depth, supernatant temperatures close to saturation, and high sludge temperatures are required for a tank bump to occur. Scenarios postulated at various times for sludge layers lacking substantial supernatant, such as superheat within the layer and fumarole formation leading to a bump were ruled out.

Tin-Silver Alloys for Flip-Chip Bonding Studied with a Rotating Cylinder Electrode

DEFF Research Database (Denmark)

Tang, Peter Torben; Pedersen, E.H.; Bech-Nielsen, G.

1999-01-01

Electrodeposition of solder for flip-chip bonding is studied in the form of a pyrophosphate/iodide tin-silver alloy bath. The objective is to obtain a uniform alloy composition, with 3.8 At.% silver, over a larger area. This specific alloy will provide an eutectic solder melting at 221°C (or 10°C...... photoresist, have shown a stable and promising alternative to pure tin and tin-lead alloys for flip-chip bonding applications....

Tank Bump Accident Potential and Consequences During Waste Retrieval

International Nuclear Information System (INIS)

BRATZEL, D.R.

2000-01-01

This report provides an evaluation of Hanford tank bump accident potential and consequences during waste retrieval operations. The purpose of this report is to consider the best available new information to support recommendations for safety controls. A new tank bump accident analysis for safe storage (Epstein et al. 2000) is extended for this purpose. A tank bump is a postulated event in which gases, consisting mostly of water vapor, are suddenly emitted from the waste and cause tank headspace pressurization. Tank bump scenarios, physical models, and frequency and consequence methods are fully described in Epstein et al. (2000). The analysis scope is waste retrieval from double-shell tanks (DSTs) including operation of equipment such as mixer pumps and air lift circulators. The analysis considers physical mechanisms for tank bump to formulate criteria for bump potential during retrieval, application of the criteria to the DSTs, evaluation of bump frequency, and consequence analysis of a bump. The result of the consequence analysis is the mass of waste released from tanks; radiological dose is calculated using standard methods (Cowley et al. 2000)

Solder joint technology materials, properties, and reliability

CERN Document Server

Tu, King-Ning

2007-01-01

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Nonlinear calculations for bump Cepheids

International Nuclear Information System (INIS)

Hodson, S.W.; Cox, A.N.

1979-01-01

Hydrodynamic calculations to find strictly periodic solutions for the fundamental mode pulsations of 7 M/sub sun/ models were made using the von Sengbusch--Stellingwerf relaxation method. The models have a helium enrichment in the surface convection zones to Y = 0.78, which from the linear theory period ratio π 2 /π 0 and the Simon and Schmidt resonance hypothesis, should give the observed Hertzsprung progression of light and velocity curve bump phase with period. These surface helium enhanced models show the proper nonlinear bump phase behavior without resort to any mass loss before or during the blue loop phases of yellow giant evolution. At 6000 K and the evolution theory luminosity of 4744 L/sub sun/ for 7 M/sub sun/, that is, at a fundamental mode period of 8.5 day, the velocity curve bump is well after the maximum expansion velocity. At 5400 K and at the same luminosity (period of 12.5 days), there is a bump on the velocity curve well before maximum expansion velocity time. The latter case seems to exhibit the Christy echos but not the former. The echo interpretation may not be appropriate for these masses which are larger than the anomalous masses used by Christy, Stobie, and Adams. Resonance of the fundamental and second overtone modes should not necessarily show echos of surface disturbances from the center. The conclusion is that helium enrichment in the surface convection zones can adequately explain observations of bump Cepheids at evolution theory masses. 12 references

Single bumps in a 2-population homogenized neuronal network model

Science.gov (United States)

Kolodina, Karina; Oleynik, Anna; Wyller, John

2018-05-01

We investigate existence and stability of single bumps in a homogenized 2-population neural field model, when the firing rate functions are given by the Heaviside function. The model is derived by means of the two-scale convergence technique of Nguetseng in the case of periodic microvariation in the connectivity functions. The connectivity functions are periodically modulated in both the synaptic footprint and in the spatial scale. The bump solutions are constructed by using a pinning function technique for the case where the solutions are independent of the local variable. In the weakly modulated case the generic picture consists of two bumps (one narrow and one broad bump) for each admissible set of threshold values for firing. In addition, a new threshold value regime for existence of bumps is detected. Beyond the weakly modulated regime the number of bumps depends sensitively on the degree of heterogeneity. For the latter case we present a configuration consisting of three coexisting bumps. The linear stability of the bumps is studied by means of the spectral properties of a Fredholm integral operator, block diagonalization of this operator and the Fourier decomposition method. In the weakly modulated regime, one of the bumps is unstable for all relative inhibition times, while the other one is stable for small and moderate values of this parameter. The latter bump becomes unstable as the relative inhibition time exceeds a certain threshold. In the case of the three coexisting bumps detected in the regime of finite degree of heterogeneity, we have at least one stable bump (and maximum two stable bumps) for small and moderate values of the relative inhibition time.

Spontaneous soldering

International Nuclear Information System (INIS)

Percacci, R.

1984-01-01

It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

Energy Technology Data Exchange (ETDEWEB)

Macchiolo, A., E-mail: Anna.Macchiolo@mpp.mpg.de [Max-Planck-Institut for Physics, Föhringer Ring 6, D-80805 Munich (Germany); Andricek, L. [Semiconductor Laboratory of the Max-Planck-Society, Otto Hahn Ring 6, D-81739 Munich (Germany); Moser, H.-G.; Nisius, R. [Max-Planck-Institut for Physics, Föhringer Ring 6, D-80805 Munich (Germany); Richter, R.H. [Semiconductor Laboratory of the Max-Planck-Society, Otto Hahn Ring 6, D-81739 Munich (Germany); Terzo, S.; Weigell, P. [Max-Planck-Institut for Physics, Föhringer Ring 6, D-80805 Munich (Germany)

2014-11-21

We present an R and D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5×10{sub 15}n{sub eq}/cm{sup 2}. We will also report on the R and D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding.

Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

Science.gov (United States)

Reinl, S.

Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

Matlab for dummies

CERN Document Server

Sizemore, Jim

2014-01-01

Plot graphs, solve equations, and write code in a flash! If you work in a STEM field, chances are you'll be using MATLAB on a daily basis. MATLAB is a popular and powerful computational tool and this book provides everything you need to start manipulating and plotting your data. MATLAB has rapidly become the premier data tool, and MATLAB For Dummies is a comprehensive guide to the fundamentals. MATLAB For Dummies guides you through this complex computational language from installation to visualization to automation.Learn MATLAB's language fundamentals including syntax, operators, and data type

Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

Directory of Open Access Journals (Sweden)

Mohd Nizam Ab. Rahman

2014-12-01

Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

Eyelid bump

Science.gov (United States)

... It appears as a red, swollen bump that looks like a pimple. It is often tender to the touch. Causes A stye is caused by a blockage of one of the oil glands in the eyelids. This allows bacteria to grow inside the blocked gland. Styes are ...

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

Science.gov (United States)

Lee, Sang-Yeob; Lee, Jong-Hyuk

2010-12-01

The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

Spectroscopic investigation of oxidized solder surfaces

International Nuclear Information System (INIS)

Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

2011-01-01

Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

The reminiscence bump in autobiographical memory and for public events

DEFF Research Database (Denmark)

Koppel, Jonathan; Berntsen, Dorthe

2016-01-01

of public events. We did so between-subjects, through two cueing methods administered within-subjects, the cue word method and the important memories method. For word-cued memories, we found a similar bump from ages 5 to 19 for both types of memories. However, the bump was more pronounced...... for autobiographical memories. For most important memories, we found a bump from ages 20 to 29 in autobiographical memory, but little discernible age pattern for public events. Rather, specific public events (e.g., the Fall of the Berlin Wall) dominated recall, producing a chronological distribution characterised......The reminiscence bump has been found for both autobiographical memories and memories of public events. However, there have been few comparisons of the bump across each type of event. In the current study, therefore, we compared the bump for autobiographical memories versus the bump for memories...

Solderability study of RABiTS-based YBCO coated conductors

International Nuclear Information System (INIS)

Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

2011-01-01

Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

Solidworks for dummies

CERN Document Server

Jankowski, Greg

2013-01-01

Whether it's your first venture into 3D technical drawing software or you're switching to SolidWorks from something else, you're probably excited about what this CAD program has to offer.   Chances are, you figure it's going to take awhile to get the hang of it before you can begin cranking out those perfectly precise 3D designs. SolidWorks For Dummies, 2nd Edition, can help you dramatically shorten that get-acquainted period! SolidWorks For Dummies, 2nd Edition will help you get up and running quickly on the leading 3D technical drawing software. You'll s

Scrivener for dummies

CERN Document Server

Hernandez, Gwen

2012-01-01

No matter what you want to write, Scrivener makes it easier. Whether you’re a planner, a seat-of-the-pants writer, or something in between, Scrivener provides tools for every stage of the writing process. Scrivener For Dummies walks you step-by-step through this popular writing software’s best features. This friendly For Dummies  guide starts with the basics, but even experienced scriveners will benefit from the helpful tips for getting more from their favourite writing software. Walks you through customizing project templates for your

C++ for dummies

CERN Document Server

Davis , Stephen R

2014-01-01

The best-selling C++ For Dummies book makes C++ easier! C++ For Dummies, 7th Edition is the best-selling C++ guide on the market, fully revised for the 2014 update. With over 60% new content, this updated guide reflects the new standards, and includes a new Big Data focus that highlights the use of C++ among popular Big Data software solutions. The book provides step-by-step instruction from the ground up, helping beginners become programmers and allowing intermediate programmers to sharpen their skills. The companion website provides all code mentioned in the text, an updated GNU_C++, the new

Handbook of machine soldering SMT and TH

CERN Document Server

Woodgate, Ralph W

1996-01-01

A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

Effect of surfactant on electrodeposited Ni-P layer as an under bump metallization

International Nuclear Information System (INIS)

Lin, Yung-Chi; Duh, Jenq-Gong

2007-01-01

In the microelectronic industry, the nickel plating has been used as the under bump metallization (UBM). The electroplated process was demonstrated to be a favorable alternative approach to produce the Ni-P layer as UBM. In this study, the role of sodium dodecylsulfate (SDS) addition in electrodeposition was investigated. The variations on surface morphology and surface roughness in the SDS-added process of electroplated Ni-P were revealed with both field emission scanning electronic microscope and atomic force microscope. The influence of SDS addition process in wettability of several commercial solder pastes, including Sn-37Pb, Sn-3.5Ag, and Sn-3.0Ag-0.5Cu, on electroplated Ni-P with various phosphorous contents was evaluated. The surface morphology and the surface roughness of Ni-P layer were affected by SDS addition. It was demonstrated that modified surface morphology and surface roughness acted to enhance the wettability of electroplated Ni-P. In addition, the interfacial reactions between Sn-3.0Ag-0.5Cu and electroplated Ni-P UBM with SDS addition during deposition was also probed and discussed

Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

Science.gov (United States)

Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

2001-01-01

The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

SQL for dummies

CERN Document Server

Taylor, Allen G

2010-01-01

Learn SQL the fun and easy way – no programming experience needed!. SQL For Dummies, 7th Edition , shows programmers and web developers how to use SQL to build relational databases and get valuable information from them. This book covers the core features of the SQL language. Topics covered include how to use SQL to structure a DBMS and implement a database design; secure a database; and retrieve information from a database. This edition will be revised to reflect the new enhancements of SQL/XML:2008. The latest update of the perennial bestselling SQL For Dummies, which has sold more than 21

Circuit analysis for dummies

CERN Document Server

Santiago, John

2013-01-01

Circuits overloaded from electric circuit analysis? Many universities require that students pursuing a degree in electrical or computer engineering take an Electric Circuit Analysis course to determine who will ""make the cut"" and continue in the degree program. Circuit Analysis For Dummies will help these students to better understand electric circuit analysis by presenting the information in an effective and straightforward manner. Circuit Analysis For Dummies gives you clear-cut information about the topics covered in an electric circuit analysis courses to help

Fluxless Sn-Ag bonding in vacuum using electroplated layers

International Nuclear Information System (INIS)

Kim, Jongsung; Lee, Chin C.

2007-01-01

A fluxless bonding process in vacuum environment using newly developed electroplated Sn-Ag multilayer structure at eutectic composition is presented. The new bonding process is entirely fluxless, or flux-free. It is performed in vacuum (100 mTorr), in which the oxygen content is reduced by a factor of 7600 comparing to air, to inhibit solder oxidation. In the design, Cr/Au dual layer is employed as the UBM as well as the plating seed layer. This UBM design, seldom used in the electronic industry, is explained in some details. To realize the fluxless possibility, a proper layer design of the solder structure is needed. In this connection, we wish to point out that it is hard to achieve fluxless bonding using Sn-rich alloys because these alloys have numerous Sn atoms on the surface that are easily oxidized. To prevent Sn oxidation, a thin Ag layer is plated immediately over Sn layer. XRD results confirm that this thin Ag layer does act as a barrier to prevent oxidation of the inner Sn layer. The resulting solder joints are void free as examined by a scanning acoustic microscope (SAM). SEM and EDX studies on the cross section of the joint indicate a homogeneous Sn-rich phase. The melting temperature is measured to be between 219 and 226 deg. C. This new fluxless bonding process is valuable in many applications where the use of flux is prohibited

French grammar for dummies

CERN Document Server

Mazet, Veronique

2013-01-01

The easy way to master French grammar French Grammar For Dummies is a logical extension and complement to the successful language learning book, French For Dummies. In plain English, it teaches you the grammatical rules of the French language, including parts of speech, sentence construction, pronouns, adjectives, punctuation, stress and verb tenses, and moods. Throughout the book, you get plenty of practice opportunities to help you on your goal of mastering basic French grammar and usage. Grasp the grammatical rules of French including parts of speech, sentenc

Dreamweaver CC for dummies

CERN Document Server

Warner, Janine

2013-01-01

Turn your wonderful website dreams into robust realities with the help of Dreamweaver CC For Dummies! Creating dynamic websites is easy with Dreamweaver CC and this friendly, full-color guide. Updated for the latest version of Adobe's world-renowned web development tool, Dreamweaver CC For Dummies covers all aspects of creating websites, from understanding web design basics to using style sheets, integrating multimedia, implementing responsive design, testing and publishing your sites, and more. With the professional guidance of Web design expert Jan

Eutectic-based wafer-level-packaging technique for piezoresistive MEMS accelerometers and bond characterization using molecular dynamics simulations

Science.gov (United States)

Aono, T.; Kazama, A.; Okada, R.; Iwasaki, T.; Isono, Y.

2018-03-01

We developed a eutectic-based wafer-level-packaging (WLP) technique for piezoresistive micro-electromechanical systems (MEMS) accelerometers on the basis of molecular dynamics analyses and shear tests of WLP accelerometers. The bonding conditions were experimentally and analytically determined to realize a high shear strength without solder material atoms diffusing to adhesion layers. Molecular dynamics (MD) simulations and energy dispersive x-ray (EDX) spectrometry done after the shear tests clarified the eutectic reaction of the solder materials used in this research. Energy relaxation calculations in MD showed that the diffusion of solder material atoms into the adhesive layer was promoted at a higher temperature. Tensile creep MD simulations also suggested that the local potential energy in a solder material model determined the fracture points of the model. These numerical results were supported by the shear tests and EDX analyses for WLP accelerometers. Consequently, a bonding load of 9.8 kN and temperature of 300 °C were found to be rational conditions because the shear strength was sufficient to endure the polishing process after the WLP process and there was little diffusion of solder material atoms to the adhesion layer. Also, eutectic-bonding-based WLP was effective for controlling the attenuation of the accelerometers by determining the thickness of electroplated solder materials that played the role of a cavity between the accelerometers and lids. If the gap distance between the two was less than 6.2 µm, the signal gains for x- and z-axis acceleration were less than 20 dB even at the resonance frequency due to air-damping.

Light and velocity curve bumps for BW Vulpeculae

International Nuclear Information System (INIS)

Pesnell, W.D.; Cox, A.N.

1980-01-01

Bumps in the light and radial velocity curves of the Beta Cephei star BW Vulpeculae were modeled. Two mechanisms, a resonance phenomena and non-linear pulsations, were investigated. The resonance condition was clearly not fulfilled, the calculated period ratio being approximately 0.60, where a value of 0.50 L +- 0.03 is required for resonance. In the non-linear calculation, the bump appears, with the correct phase, but was found at an amplitude that is too large. Further, the light curve does not show any bump-like feature. The cause of the bump is the large spurious boost given the star's velocity field by the solution methods. The calculated periods of the stellar models are shorter than those of previous calculations, enhancing the possibility that these stars pulsate in a radial fundamental mode

Interface between Sn-Sb-Cu solder and copper substrate

Energy Technology Data Exchange (ETDEWEB)

Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

2011-07-15

Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

Soldering of Mg Joints Using Zn-Al Solders

Science.gov (United States)

Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

2018-04-01

Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

Statistics & probaility for dummies

CERN Document Server

Rumsey, Deborah J

2013-01-01

Two complete eBooks for one low price! Created and compiled by the publisher, this Statistics I and Statistics II bundle brings together two math titles in one, e-only bundle. With this special bundle, you'll get the complete text of the following two titles: Statistics For Dummies, 2nd Edition  Statistics For Dummies shows you how to interpret and critique graphs and charts, determine the odds with probability, guesstimate with confidence using confidence intervals, set up and carry out a hypothesis test, compute statistical formulas, and more. Tra

Structural integrity of power generating speed bumps made of concrete foam composite

Science.gov (United States)

Syam, B.; Muttaqin, M.; Hastrino, D.; Sebayang, A.; Basuki, W. S.; Sabri, M.; Abda, S.

2018-02-01

In this paper concrete foam composite speed bumps were designed to generate electrical power by utilizing the movements of commuting vehicles on highways, streets, parking gates, and drive-thru station of fast food restaurants. The speed bumps were subjected to loadings generated by vehicles pass over the power generating mechanical system. In this paper, we mainly focus our discussion on the structural integrity of the speed bumps and discuss the electrical power generating speed bumps in another paper. One aspect of structural integrity is its ability to support designed loads without breaking and includes the study of past structural failures in order to prevent failures in future designs. The concrete foam composites were used for the speed bumps; the reinforcement materials are selected from empty fruit bunch of oil palm. In this study, the speed bump materials and structure were subjected to various tests to obtain its physical and mechanical properties. To analyze the structure stability of the speed bumps some models were produced and tested in our speed bump test station. We also conduct a FEM-based computer simulation to analyze stress responses of the speed bump structures. It was found that speed bump type 1 significantly reduced the radial voltage. In addition, the speed bump is equipped with a steel casing is also suitable for use as a component component in generating electrical energy.

An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

Energy Technology Data Exchange (ETDEWEB)

Vianco, P.T.

1998-10-15

A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

Decomposing the sales promotion bump with store data

NARCIS (Netherlands)

van Heerde, H.J.; Leeflang, P.S.H.; Wittink, D.R.

2004-01-01

Sales promotions generate substantial short-term sales increases. To determine whether the sales promotion bump is truly beneficial from a managerial perspective, we propose a system of store-level regression models that decomposes the sales promotion bump into three parts: cross-brand effects

Physics II for dummies

CERN Document Server

Holzner, Steven

2010-01-01

A plain-English guide to advanced physics. Does just thinking about the laws of motion make your head spin? Does studying electricity short your circuits? Physics II For Dummies walks you through the essentials and gives you easy-to-understand and digestible guidance on this often intimidating course. Thanks to this book, you don?t have to be Einstein to understand physics. As you learn about mechanical waves and sound, forces and fields, electric potential and electric energy, and much more, you?ll appreciate the For Dummies law: The easier we make it, the faster you'll understand it!

Physics Essentials For Dummies

CERN Document Server

Holzner, Steven

2010-01-01

For students who just need to know the vital concepts of physics, whether as a refresher, for exam prep, or as a reference, Physics Essentials For Dummies is a must-have guide. Free of ramp-up and ancillary material, Physics Essentials For Dummies contains content focused on key topics only. It provides discrete explanations of critical concepts taught in an introductory physics course, from force and motion to momentum and kinetics. This guide is also a perfect reference for parents who need to review critical physics concepts as they help high school students with homework assignments, as we

Kindle Paperwhite for dummies

CERN Document Server

Nicoll, Leslie H

2014-01-01

Get the inside story on the all-new Kindle Paperwhite with help from For Dummies It reads like a book, but it's so much more. The Kindle Paperwhite is the ultimate e-reader, and this updated edition of Kindle Paperwhite For Dummies is your ultimate guide to getting more from this one-of-a-kind device. You'll learn to set up your Paperwhite, adjust the font to your liking, find your favorite books, magazines, and newspapers, and sync your Kindle content across devices before moving on to new Paperwhite features like Kindle FreeTime, Goodreads integration, Vocabulary Builder, In-line Footnotes

High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

DEFF Research Database (Denmark)

High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

Thermohydrodynamic analysis of airfoil bearing based on bump foil structure

Directory of Open Access Journals (Sweden)

S.Y. Maraiy

2016-09-01

Full Text Available The load carrying capacity of the gas foil bearing depends on the material properties and the configuration of the underlying bump strip’s structure. This paper presents three different cases for selecting the dimensions of the foil bearing to guarantee the highest possible load carrying capacity. It focuses on three main parameters that affect the compliance number; these parameters are the length of bump in θ direction, the pitch of bump foil, and the thickness of bump foil. It also studies the effect of changing these parameters on load carrying capacity according to both isothermal and thermohydrodynamic approaches.

Laser-activated protein solder for peripheral nerve repair

Science.gov (United States)

Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

1995-05-01

A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

Shrinking of bumps by drawing scintillating fibres through a hot conical tool

CERN Document Server

Rodrigues Cavalcante, Ana Barbara; Gavardi, Laura; Joram, Christian; Kristic, Robert; Pierschel, Gerhard; Schneider, Thomas

2016-01-01

The LHCb SciFi tracker will be based on scintillating fibres with a nominal diameter of 250 $\\mu$m. A small length fraction of these fibres shows millimetre-scale fluctuations of the diameter, also known as bumps and necks. In particular, bumps exceeding a diameter of about 350 $\\mu$m are problematic as they can distort the winding pattern of the fibre mats over more extended regions. We present a method to reduce the diameter of large bumps to a diameter of 350 $\\mu$m by locally heating and pulling the fibre through a conical tool. The method has been proven to work for bumps up to 450 – 500 $\\mu$m diameter. Larger bumps need to be treated manually by a cut-and-glue technique which relies on UV-curing instant glue. The bump shrinking and cut-and-glue processes were integrated in a fibre diameter scanner at CERN. The central scanning and bump shrinking of all fibres is expected to minimise bump related issues at the four mat winding centres of the SciFi project.

Features of soldering of molybdenum a lols

International Nuclear Information System (INIS)

Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

1980-01-01

Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

The constitutive response of three solder materials

International Nuclear Information System (INIS)

Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

2012-01-01

Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Microstructure evolution and thermomechanical fatigue of solder materials

NARCIS (Netherlands)

Matin, M.A.

2005-01-01

The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

Laser assisted soldering: microdroplet accumulation with a microjet device.

Science.gov (United States)

Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

1998-01-01

We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

Windows 10 for dummies

CERN Document Server

Rathbone, Andy

2015-01-01

The fast and easy way to get up and running with Windows 10 Windows 10 For Dummies covers the latest version of Windows and gets you up and running with the changes and new features you'll find in this updated operating system. Packed with time-saving tips to help you get the most out of the software, this helpful Windows 10 guide shows you how to manage Windows tasks like navigating the interface with a mouse or touchscreen, connecting to the web, and troubleshooting problems and making quick fixes. Assuming no prior knowledge of the software, Windows 10 For Dummies addresses the updates to

Thermomechanical fatigue life prediction for several solders

Science.gov (United States)

Wen, Shengmin

Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

Soldering of copper-clad niobium--titanium superconductor composite

International Nuclear Information System (INIS)

Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

1977-04-01

When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

Evaluation on the characteristics of tin-silver-bismuth solder

Science.gov (United States)

Xia, Z.; Shi, Y.; Chen, Z.

2002-02-01

Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

Bump masses for BL Her stars

International Nuclear Information System (INIS)

Davis, C.G.

1982-01-01

The masses of classical Cepheids can be determined by using the phase of the Hertzsprung bump on the light or velocity curve, Cox-Stewart opacities, and nonlinear pulsation theory. The fact that these bump masses are some 60% lower than the evolutionary masses raises some questions about this approach. In support of our method, we calculate the light curve for BL Her, a population II Cepheid, with an observed bump on the declining portion of its light curve. The nonlinear hydrodynamic model we use (Davis and Davison - 1978) resolves the light curve by dynamic zoning and allows us the opportunity to make a direct comparison of the calculated light curve to the observations, using a prescribed mass, luminosity and effective temperature. The parameters for BL Her are from a linear model (Hodson, Cox, and King - 1982) that has nearly the correct period (1./sup d/2) and the correct period ratio from resonance theory (π 2 /π 0 = 0.53) for a bump to appear on the declining portion of the light curve as observed. These parameters are: M = 0.55 M, L = 95.0 L, and T/sub eff/ = 6500 K. This mass is near the evolutionary mass as described by Schwartzschild and Haerm (1970). The model results agree well with the observations and the color-T/sub eff/ relation has the same slope as that observed for RR Lyrae stars by the Oke, Giver and Searle (1965) relationship

The Effects of Campus Bump on Drivers’ Fixation Dispersion and Speed Reduction

Directory of Open Access Journals (Sweden)

Qian Xu

2015-01-01

Full Text Available To evaluate the effects of campus speed bumps on drivers’ speed and fixation distribution, a quasinaturalistic driving test was conducted on a Chinese campus. Seven randomly selected drivers, wearing the Dikablis eye tracking devices, were required to drive an OPEL SUV passing the speed bumps. The area close to the bump was divided into ten subsegments (15 m for each one. The degree of fixation dispersion within each subsegment was defined as the distance from each subcenter to the whole fixation center. All traffic data were recorded using mounted camera, and the trajectories were extracted in Matlab. The speed and trajectory data was divided into two groups: the before group for bump-free case and the after group for a 5 cm bump case. The observational before-after analysis shows statistical significance between the two cases. The individual vehicular speed analysis reveals that bump reduces nearly 60% of vehicles’ speeds to a certain extent within the distance from 30 m upstream to 15 m downstream. The drivers’ fixation points begin to disperse 30–45 m before they see the bump, and it falls back to normal level 15–30 m downstream of the bump. These findings will help engineers install speed bumps at the most appropriate locations.

The Physics of Bump Drafting in Car Racing

Science.gov (United States)

Fiolhais, Miguel C. N.; Amor dos Santos, Susana

2014-01-01

The technique of bump drafting, also known as two-car drafting in motorsports, is analysed in the framework of Newtonian mechanics and simple aerodynamic drag forces. As an apparent unnatural effect that often pleases the enthusiasts of car racing, bump drafting provides a unique pedagogical opportunity for students to gain insights into the…

The constitutive response of three solder materials

Energy Technology Data Exchange (ETDEWEB)

Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

2012-05-25

Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Characterization of lead-free solders for electronic packaging

Science.gov (United States)

Ma, Hongtao

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

Pre-Algebra Essentials For Dummies

CERN Document Server

Zegarelli, Mark

2010-01-01

Many students worry about starting algebra. Pre-Algebra Essentials For Dummies provides an overview of critical pre-algebra concepts to help new algebra students (and their parents) take the next step without fear. Free of ramp-up material, Pre-Algebra Essentials For Dummies contains content focused on key topics only. It provides discrete explanations of critical concepts taught in a typical pre-algebra course, from fractions, decimals, and percents to scientific notation and simple variable equations. This guide is also a perfect reference for parents who need to review critical pre-algebra

Signals and systems for dummies

CERN Document Server

Wickert, Mark

2013-01-01

Getting mixed signals in your signals and systems course? The concepts covered in a typical signals and systems course are often considered by engineering students to be some of the most difficult to master. Thankfully, Signals & Systems For Dummies is your intuitive guide to this tricky course, walking you step-by-step through some of the more complex theories and mathematical formulas in a way that is easy to understand. From Laplace Transforms to Fourier Analyses, Signals & Systems For Dummies explains in plain English the difficult concepts that can trip you up

iMac for dummies

CERN Document Server

Chambers, Mark L

2014-01-01

Do it all with your iMac and this bestselling For Dummies guide! You're still a little giddy from finally scoring your new iMac, and you can't wait to get started. Even if you're already in love with your iMac, it helps to have a little guidance to really get the most out of this ultimate all-in-one computer. This updated edition of iMac For Dummies is the ideal way to learn the iMac fundamentals from setting up and personalizing your machine to importing files, making FaceTime video calls, surfing the web, using your favorite programs and apps, and everything in between. Trusted Mac guru Mark

Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Energy Technology Data Exchange (ETDEWEB)

Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

2016-04-15

Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Mechanical properties of Bi-In-Zn/ Cu solder joint system

International Nuclear Information System (INIS)

Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

2009-01-01

Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

Directory of Open Access Journals (Sweden)

Molnar A.

2017-06-01

Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

Science.gov (United States)

Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

2018-01-01

Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

Integration of environmentally compatible soldering technologies for waste minimization

International Nuclear Information System (INIS)

Hosking, F.M.

1992-01-01

There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

Visual Analysis of Speeding Bumps Using Floating Car Dataset

DEFF Research Database (Denmark)

Kveladze, Irma; Agerholm, Niels

2018-01-01

measures, and also their influence on the driving behaviour of vehicles from a temporal perspective. To fill this gap and understand these aspects, in this research we propose visual analytics techniques. To explore the influence of the bumps on speed change behavior of vehicles, several use case studies...... in three different cities were selected with close cooperation of a traffic domain expert. The aim was first to study influence of the bumps on vehicle volume and speeding from a time perspective. And then, establish any connection between speed bump intervals and vehicle speeding in the selected use cases...

Strength of joints brazed with two-phase solders

International Nuclear Information System (INIS)

Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

1976-01-01

Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

Influences of pre-crash braking induced dummy - forward displacements on dummy behaviour during EuroNCAP frontal crashtest.

Science.gov (United States)

Woitsch, Gernot; Sinz, Wolfgang

2014-01-01

Combination of active and passive safety systems is a future key to further improvement in vehicle safety. Autonomous braking systems are able to reduce collision speeds, and therefore severity levels significantly. Passengers change their position due to pre-impact vehicle motion, a fact, which has not yet been considered in common crash tests. For this paper, finite elements simulations of crash tests were performed to show that forward displacements due to pre-crash braking do not necessarily increase dummy load levels. So the influence of different pre-crash scenarios, all leading to equal closing speeds in the crash phase, are considered in terms of vehicle motion (pitching, deceleration) and restraint system configurations (belt load limiter, pretensioner). The influence is evaluated by dummy loads as well as contact risk between the dummy and the interior. Copyright © 2013 Elsevier Ltd. All rights reserved.

Microsoft Expression Web for dummies

CERN Document Server

Hefferman, Linda

2013-01-01

Expression Web is Microsoft's newest tool for creating and maintaining dynamic Web sites. This FrontPage replacement offers all the simple ""what-you-see-is-what-you-get"" tools for creating a Web site along with some pumped up new features for working with Cascading Style Sheets and other design options. Microsoft Expression Web For Dummies arrives in time for early adopters to get a feel for how to build an attractive Web site. Author Linda Hefferman teams up with longtime FrontPage For Dummies author Asha Dornfest to show the easy way for first-time Web designers, FrontPage ve

Safer Soldering Guidelines and Instructional Resources

Science.gov (United States)

Love, Tyler S.; Tomlinson, Joel

2018-01-01

Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

Lead-free solder technology transfer from ASE Americas

Energy Technology Data Exchange (ETDEWEB)

FTHENAKIS,V.

1999-10-19

To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

Science.gov (United States)

Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

2018-03-01

The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

Energy Technology Data Exchange (ETDEWEB)

Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

2013-06-01

The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

Single Point Incremental Forming using a Dummy Sheet

DEFF Research Database (Denmark)

Skjødt, Martin; Silva, Beatriz; Bay, Niels

2007-01-01

A new version of single point incremental forming (SPIF) is presented. This version includes a dummy sheet on top of the work piece, thus forming two sheets instead of one. The dummy sheet, which is in contact with the rotating tool pin, is discarded after forming. The new set-up influences....... The possible influence of friction between the two sheets is furthermore investigated. The results show that the use of a dummy sheet reduces wear of the work piece to almost zero, but also causes a decrease in formability. Bulging of the planar sides of the pyramid is reduced and surface roughness...

Fatigue and thermal fatigue of Pb-Sn solder joints

International Nuclear Information System (INIS)

Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

1987-01-01

This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology

Energy Technology Data Exchange (ETDEWEB)

Beimforde, M; Andricek, L; Macchiolo, A; Moser, H-G; Nisius, R; Richter, R H; Weigell, P, E-mail: Michael.Beimforde@mpp.mpg.de [Max-Planck-Institut fuer Physik, Foehringer Ring 6, D-80805, Muenchen (Germany)

2010-12-15

The presented R and D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 {mu}m and 150 {mu}m has been produced using a thinning technique developed at the Max-Planck-Institut fuer Physik (MPP) and the MPI Semiconductor Laboratory (HLL). Charge Collection Efficiency (CCE) measurements of these sensors irradiated with 26 MeV protons up to a particle fluence of 10{sup 16}n{sub eq}cm{sup -2} have been performed, yielding higher values than expected from the present radiation damage models. The novel integration technology, developed by the Fraunhofer Institut EMFT, consists of the Solid-Liquid InterDiffusion (SLID) interconnection, being an alternative to the standard solder bump-bonding, and Inter-Chip Vias (ICVs) for routing signals vertically through electronics. This allows for extracting the digitized signals from the back side of the readout chips, avoiding wire-bonding cantilevers at the edge of the devices and thus increases the active area fraction. First interconnections have been performed with wafers containing daisy chains to investigate the efficiency of SLID at wafer-to-wafer and chip-to-wafer level. In a second interconnection process the present ATLAS FE-I3 readout chips were connected to dummy sensor wafers at chip-to-wafer level. Preparations of ICV within the ATLAS readout chips for back side contacting and the future steps towards a full demonstrator module will be presented.

A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology

International Nuclear Information System (INIS)

Beimforde, M; Andricek, L; Macchiolo, A; Moser, H-G; Nisius, R; Richter, R H; Weigell, P

2010-01-01

The presented R and D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 μm and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut fuer Physik (MPP) and the MPI Semiconductor Laboratory (HLL). Charge Collection Efficiency (CCE) measurements of these sensors irradiated with 26 MeV protons up to a particle fluence of 10 16 n eq cm -2 have been performed, yielding higher values than expected from the present radiation damage models. The novel integration technology, developed by the Fraunhofer Institut EMFT, consists of the Solid-Liquid InterDiffusion (SLID) interconnection, being an alternative to the standard solder bump-bonding, and Inter-Chip Vias (ICVs) for routing signals vertically through electronics. This allows for extracting the digitized signals from the back side of the readout chips, avoiding wire-bonding cantilevers at the edge of the devices and thus increases the active area fraction. First interconnections have been performed with wafers containing daisy chains to investigate the efficiency of SLID at wafer-to-wafer and chip-to-wafer level. In a second interconnection process the present ATLAS FE-I3 readout chips were connected to dummy sensor wafers at chip-to-wafer level. Preparations of ICV within the ATLAS readout chips for back side contacting and the future steps towards a full demonstrator module will be presented.

iPad mini for dummies

CERN Document Server

Baig, Edward C

2014-01-01

Find out why the iPad mini has never been bigger This new edition of iPad mini For Dummies covers all the latest tips and tricks for getting an even bigger bang out of your iPad mini. Presented in full-color and written in the straightforward but fun language that has defined the For Dummies brand for more than twenty years, this friendly guide walks you through the multitouch interface, going online, getting connected, packing your iPad mini with apps, games, e-books, photos, music, and movies, synchronizing your data, texting with iMessage, working with Siri, importing pictures and launching

AutoCAD 2010 For Dummies

CERN Document Server

Byrnes, David

2009-01-01

AutoCAD is the hot computer-aided design software known for both its powerful tools and its complexity. AutoCAD 2010 for Dummies is the bestselling guide that walks you through this complicated program so you can build complex 3D technical drawings, edit like a pro, enter new dimensions, and plot with style. AutoCAD 2010 for Dummies helps you navigate the program, use the AutoCAD Design Center, create a basic layout and work with dimension, and put your drawings on the Internet. You'll soon be setting up the AutoCAD environment, using the AutoCAD Ribbon, creating annotation and dimension drawi

Excel data analysis for dummies

CERN Document Server

Nelson, Stephen L

2014-01-01

Harness the power of Excel to discover what your numbers are hiding Excel Data Analysis For Dummies, 2nd Edition is the ultimate guide to getting the most out of your data. Veteran Dummies author Stephen L. Nelson guides you through the basic and not-so-basic features of Excel to help you discover the gems hidden in your rough data. From input, to analysis, to visualization, the book walks you through the steps that lead to superior data analysis. Excel is the number-one spreadsheet application, with ever-expanding capabilities. If you're only using it to balance the books, you're missing out

iPad & Siri for dummies

CERN Document Server

Baig, Edward C

2012-01-01

Two complete e-books on using iPad and Siri for one low price! This unique value-priced e-book set brings together two bestselling For Dummies books in a single e-book file. Including a comprehensive table of contents and the full text of each book, complete with cover, this e-book set helps you get the most out of your iPad and Siri, its artificial intelligence personal assistant. Best of all, you'll pay less than the cost of each book purchased separately. You'll get the complete text of: iPad For Dummies, which helps you toSet up your iPad, browse the

Nano-soldering to single atomic layer

Science.gov (United States)

Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

2011-10-11

A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Soldering formalism in noncommutative field theory: a brief note

International Nuclear Information System (INIS)

Ghosh, Subir

2004-01-01

In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

Basic math and pre-algebra practice problems for dummies

CERN Document Server

Zegarelli, Mark

2013-01-01

1001 Basic Math & Pre- Algebra Practice Problems For  Dummies   Practice makes perfect-and helps deepen your understanding of basic math and pre-algebra 1001 Basic Math & Pre-Algebra Practice Problems For Dummies, with free access to online practice problems, takes you beyond the instruction and guidance offered in Basic Math & Pre-Algebra For Dummies, giving you 1,001 opportunities to practice solving problems from the major topics in your math course. You begin with some basic arithmetic practice, move on to fractions, decimals, and per

Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

Science.gov (United States)

Buckley, John D. (Editor); Stein, Bland A. (Editor)

1986-01-01

A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

Comparison of Off-Line IR Bump and Action-Angle Kick Minimization

CERN Document Server

Luo, Yun; Ptitsyn, Vadim; Trbojevic, Dejan; Wei, Jie

2005-01-01

The interaction region bump (IR bump) nonlinear correction method has been used for the sextupole and octupole field error on-line corrections in the Relativistic Heavy Ion Collider (RHIC). Some differences were found for the sextupole and octupole corrector strengths between the on-line IR bump correction and the predictions from the action-angle kick minimization. In this report we compare the corrector strengths from these two methods based on the RHIC Blue ring lattice with the IR nonlinear modeling. The comparison confirms the differences between resulting corrector strengths. And the reason for the differences is found and discussed. It is followed by a further discussion of the operational IR bump applications to the octupole, and skew sextupole and skew quadrupole field error corrections.

How Robust Is Linear Regression with Dummy Variables?

Science.gov (United States)

Blankmeyer, Eric

2006-01-01

Researchers in education and the social sciences make extensive use of linear regression models in which the dependent variable is continuous-valued while the explanatory variables are a combination of continuous-valued regressors and dummy variables. The dummies partition the sample into groups, some of which may contain only a few observations.…

Linux all-in-one for dummies

CERN Document Server

Dulaney, Emmett

2014-01-01

Eight minibooks in one volume cover every important aspect of Linux and everything you need to know to pass level-1 certification Linux All-in-One For Dummies explains everything you need to get up and running with the popular Linux operating system. Written in the friendly and accessible For Dummies style, the book ideal for new and intermediate Linux users, as well as anyone studying for level-1 Linux certification. The eight minibooks inside cover the basics of Linux, interacting with it, networking issues, Internet services, administration, security, scripting, and level-1 certification. C

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

Science.gov (United States)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is

The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

Science.gov (United States)

Sona, Mrunali; Prabhu, K. Narayan

2017-09-01

The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

Ceramic ball grid array package stress analysis

Science.gov (United States)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

Cross-Validation of Survival Bump Hunting by Recursive Peeling Methods.

Science.gov (United States)

Dazard, Jean-Eudes; Choe, Michael; LeBlanc, Michael; Rao, J Sunil

2014-08-01

We introduce a survival/risk bump hunting framework to build a bump hunting model with a possibly censored time-to-event type of response and to validate model estimates. First, we describe the use of adequate survival peeling criteria to build a survival/risk bump hunting model based on recursive peeling methods. Our method called "Patient Recursive Survival Peeling" is a rule-induction method that makes use of specific peeling criteria such as hazard ratio or log-rank statistics. Second, to validate our model estimates and improve survival prediction accuracy, we describe a resampling-based validation technique specifically designed for the joint task of decision rule making by recursive peeling (i.e. decision-box) and survival estimation. This alternative technique, called "combined" cross-validation is done by combining test samples over the cross-validation loops, a design allowing for bump hunting by recursive peeling in a survival setting. We provide empirical results showing the importance of cross-validation and replication.

Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

International Nuclear Information System (INIS)

Han, Jung Kyu; Choi, Daechul; Fujiyoshi, Masaru; Chiwata, Nobuhiko; Tu, King-Ning

2012-01-01

In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation indicate that there is a transition from no current crowding to current crowding, caused by void growth at the cathode. An analysis of the electromigration-induced failure mechanism in solder joints having a very thick Cu layer is presented. It is a unique failure mechanism, different from that in flip chip technology. Moreover, the study of marker displacement shows two different stages of drift velocity, which clearly demonstrates the back-stress effect and the development of compressive stress.

Thermomechanical behavior of tin-rich (lead-free) solders

Science.gov (United States)

Sidhu, Rajen Singh

In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

Adhesive-Bonded Tab Attaches Thermocouples to Titanium

Science.gov (United States)

Cook, C. F.

1982-01-01

Mechanical strength of titanium-alloy structures that support thermocouples is preserved by first spotwelding thermocouples to titanium tabs and then attaching tabs to titanium with a thermosetting adhesive. In contrast to spot welding, a technique previously used for thermocouples, fatigue strength of the titanium is unaffected by adhesive bonding. Technique is also gentler than soldering or attaching thermocouples with a tap screw.

Quantum physics for dummies

CERN Document Server

Holzner, Steve

2013-01-01

Quantum Physics For Dummies, Revised Edition helps make quantum physics understandable and accessible. From what quantum physics can do for the world to understanding hydrogen atoms, readers will get complete coverage of the subject, along with numerous examples to help them tackle the tough equations. Compatible with classroom text books and courses, Quantum Physics For Dummies, Revised Edition lets students study at their own paces and helps them prepare for graduate or professional exams. Coverage includes: The Schrodinger Equation and its Applications The Foundations of Quantum Physics Vector Notation Spin Scattering Theory, Angular Momentum, and more From the Back Cover Your plain-English guide to understanding and working with the micro world Quantum physics -- also called quantum mechanics or quantum field theory -- can be daunting for even the most dedicated student or enthusiast of science, math, or physics. This friendly, concise guide makes this challenging subject understandable and accessible, fr...

Mechanical properties of soldered joints of niobium base alloys

International Nuclear Information System (INIS)

Grishin, V.L.

1980-01-01

Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

A Corrosion Investigation of Solder Candidates for High-Temperature Applications

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Ambat, Rajan

2009-01-01

The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

Windows 8 & Office 2010 for dummies

CERN Document Server

Rathbone, Andy

2012-01-01

Two complete e-books covering Windows and Office for one low price! This unique value-priced e-book set brings together two bestselling For Dummies books in a single e-book file. Including a comprehensive table of contents and the full text of each book, complete with cover, this e-book set gives you in-depth information on the leading PC productivity tools: Windows 8 and Office 2010. Best of all, you'll pay less than the cost of each book purchased separately. You'll get the complete text of: Windows 8 For Dummies, which covers The core component

Stability of bumps in piecewise smooth neural fields with nonlinear adaptation

KAUST Repository

Kilpatrick, Zachary P.

2010-06-01

We study the linear stability of stationary bumps in piecewise smooth neural fields with local negative feedback in the form of synaptic depression or spike frequency adaptation. The continuum dynamics is described in terms of a nonlocal integrodifferential equation, in which the integral kernel represents the spatial distribution of synaptic weights between populations of neurons whose mean firing rate is taken to be a Heaviside function of local activity. Discontinuities in the adaptation variable associated with a bump solution means that bump stability cannot be analyzed by constructing the Evans function for a network with a sigmoidal gain function and then taking the high-gain limit. In the case of synaptic depression, we show that linear stability can be formulated in terms of solutions to a system of pseudo-linear equations. We thus establish that sufficiently strong synaptic depression can destabilize a bump that is stable in the absence of depression. These instabilities are dominated by shift perturbations that evolve into traveling pulses. In the case of spike frequency adaptation, we show that for a wide class of perturbations the activity and adaptation variables decouple in the linear regime, thus allowing us to explicitly determine stability in terms of the spectrum of a smooth linear operator. We find that bumps are always unstable with respect to this class of perturbations, and destabilization of a bump can result in either a traveling pulse or a spatially localized breather. © 2010 Elsevier B.V. All rights reserved.

Chemical wiring and soldering toward all-molecule electronic circuitry.

Science.gov (United States)

Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

2011-06-01

Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

Two-Dimensional Bumps in Piecewise Smooth Neural Fields with Synaptic Depression

KAUST Repository

Bressloff, Paul C.; Kilpatrick, Zachary P.

2011-01-01

instability leads to the formation of a traveling spot. The local stability of a bump is determined by solutions to a system of pseudolinear equations that take into account the sign of perturbations around the circular bump boundary. © 2011 Society

Pain over speed bumps in diagnosis of acute appendicitis: diagnostic accuracy study.

Science.gov (United States)

Ashdown, Helen F; D'Souza, Nigel; Karim, Diallah; Stevens, Richard J; Huang, Andrew; Harnden, Anthony

2012-12-14

To assess the diagnostic accuracy of pain on travelling over speed bumps for the diagnosis of acute appendicitis. Prospective questionnaire based diagnostic accuracy study. Secondary care surgical assessment unit at a district general hospital in the UK. 101 patients aged 17-76 years referred to the on-call surgical team for assessment of possible appendicitis. Sensitivity, specificity, positive and negative predictive values, and positive and negative likelihood ratios for pain over speed bumps in diagnosing appendicitis, with histological diagnosis of appendicitis as the reference standard. The analysis included 64 participants who had travelled over speed bumps on their journey to hospital. Of these, 34 had a confirmed histological diagnosis of appendicitis, 33 of whom reported increased pain over speed bumps. The sensitivity was 97% (95% confidence interval 85% to 100%), and the specificity was 30% (15% to 49%). The positive predictive value was 61% (47% to 74%), and the negative predictive value was 90% (56% to 100%). The likelihood ratios were 1.4 (1.1 to 1.8) for a positive test result and 0.1 (0.0 to 0.7) for a negative result. Speed bumps had a better sensitivity and negative likelihood ratio than did other clinical features assessed, including migration of pain and rebound tenderness. Presence of pain while travelling over speed bumps was associated with an increased likelihood of acute appendicitis. As a diagnostic variable, it compared favourably with other features commonly used in clinical assessment. Asking about speed bumps may contribute to clinical assessment and could be useful in telephone assessment of patients.

Stability of bumps in piecewise smooth neural fields with nonlinear adaptation

KAUST Repository

Kilpatrick, Zachary P.; Bressloff, Paul C.

2010-01-01

associated with a bump solution means that bump stability cannot be analyzed by constructing the Evans function for a network with a sigmoidal gain function and then taking the high-gain limit. In the case of synaptic depression, we show that linear stability

Effect of Solder Flux Residues on Corrosion of Electronics

DEFF Research Database (Denmark)

Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

2009-01-01

Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

Influence of solder joint length to the mechanical aspect during the thermal stress analysis

Science.gov (United States)

Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

2017-09-01

Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

Directory of Open Access Journals (Sweden)

Nikolaj VIŠNIAKOV

2011-03-01

Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

Samsung Galaxy S5 for dummies

CERN Document Server

Hughes, Bill

2014-01-01

Explore Samsung's next generation Galaxy smartphone Do you want an easy-to-follow guide to everything your new Galaxy S5 smartphone can do? From the basics of texting and accessing the Internet to the most advanced features and new software apps, Samsung Galaxy S5 For Dummies makes the need for tech support obsolete. The Galaxy S5 is designed to be faster and more powerful than ever. This latest release in the market-leading line of smartphones is full of new features for you to explore with the help of Samsung Galaxy S5 For Dummies. With over 1 million apps available for the Google Android o

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Directory of Open Access Journals (Sweden)

Fan Yang

2016-01-01

Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Physical properties of lead free solders in liquid and solid state

Energy Technology Data Exchange (ETDEWEB)

Mhiaoui, Souad

2007-04-17

The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Directory of Open Access Journals (Sweden)

Liu Mei Lee

2013-01-01

Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

Welding, Bonding and Fastening, 1984

Science.gov (United States)

Buckley, J. D. (Editor); Stein, B. A. (Editor)

1985-01-01

A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Soceity, and Society of Manufacturing Engineers conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

Bonding techniques for hybrid active pixel sensors (HAPS)

Energy Technology Data Exchange (ETDEWEB)

Bigas, M. [Centre Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universitat Autonoma de Barcelona, 08193 Bellaterra, Barcelona (Spain)]. E-mail: Marc.Bigas@cnm.es; Cabruja, E. [Centre Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universitat Autonoma de Barcelona, 08193 Bellaterra, Barcelona (Spain)]. E-mail: Enric.Cabruja@cnm.es; Lozano, M. [Centre Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universitat Autonoma de Barcelona, 08193 Bellaterra, Barcelona (Spain)

2007-05-01

A hybrid active pixel sensor (HAPS) consists of an array of sensing elements which is connected to an electronic read-out unit. The most used way to connect these two different devices is bump bonding. This interconnection technique is very suitable for these systems because it allows a very fine pitch and a high number of I/Os. However, there are other interconnection techniques available such as direct bonding. This paper, as a continuation of a review [M. Lozano, E. Cabruja, A. Collado, J. Santander, M. Ullan, Nucl. Instr. and Meth. A 473 (1-2) (2001) 95-101] published in 2001, presents an update of the different advanced bonding techniques available for manufacturing a hybrid active pixel detector.

On the persistence of unstable bump-on-tail electron velocity distributions in the earth's foreshock

International Nuclear Information System (INIS)

Klimas, A.J.; Fitzenreiter, R.J.

1988-01-01

Further evidence for the persistence of bump-on-tail unstable reduced velocity distribution in the Earth's electron foreshock is presented. This persistence contradicts our understanding of quasi-linear saturation of the bump-on-tail instability; the distributions should be stabilized through velocity space diffusion too quickly to allow an observation of their unstable form. A modified theory for the saturation of the bump-on-tail instability in the Earth's foreshock is proposed and examined using numerical simulation and quasi-linear theoretical techniques. It is argued the mechanism due to Filbert and Kellogg and to Cairns which is responsible for the creation of the bump-on-tail velocity distribution in the foreshock is still operative during the evolution of the bump-on-tail instability. The saturated state of the plasma must represent a balance between this creation mechanism and velocity space diffusion; the saturated state is not determined by velocity space diffusion alone. Thus the velocity distribution of the saturated stat may still appear bump-on-tail unstable to standard linear analysis which does not take the creation mechanism into account. The bump-on-tail velocity distributions in the foreshock would then represent the state of the plasma after saturation of the bump-on-tail instability, not before

Stress Distribution in a Coal Seam before and after Bump Initiation

Directory of Open Access Journals (Sweden)

J. Vacek

2001-01-01

Full Text Available This paper deals with to the behaviour of open rock that occurs, for example, during longwall mining in coal mines, in deep tunnel, or shaft excavation.Longwall instability leads to extrusion of rock mass into an open space. This effect is mostly referred to as a bump, or a rock burst. For bumps to occur, the rock has to possess certain particular rock burst properties leading to accumulation of energy and the potential to release this energy. Such materials may be brittle, or the bumps may arise at the interfacial zones of two parts of the rock, that have principally different material properties.The solution is based on experimental and mathematical modelling. These two methods have to allow the problem to be studied on the basis of three presumptions: – the solution must be time dependent – the solution must allow the creation of crack in the rock mass – the solution must allow an extrusion of rock into an open space (bump effect

Two-Dimensional Bumps in Piecewise Smooth Neural Fields with Synaptic Depression

KAUST Repository

Bressloff, Paul C.

2011-01-01

We analyze radially symmetric bumps in a two-dimensional piecewise-smooth neural field model with synaptic depression. The continuum dynamics is described in terms of a nonlocal integrodifferential equation, in which the integral kernel represents the spatial distribution of synaptic weights between populations of neurons whose mean firing rate is taken to be a Heaviside function of local activity. Synaptic depression dynamically reduces the strength of synaptic weights in response to increases in activity. We show that in the case of a Mexican hat weight distribution, sufficiently strong synaptic depression can destabilize a stationary bump solution that would be stable in the absence of depression. Numerically it is found that the resulting instability leads to the formation of a traveling spot. The local stability of a bump is determined by solutions to a system of pseudolinear equations that take into account the sign of perturbations around the circular bump boundary. © 2011 Society for Industrial and Applied Mathematics.

Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

National Research Council Canada - National Science Library

Reuse, Rolando

2005-01-01

.... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

Injection Bump Synchronization Study for the CERN PS

CERN Document Server

Serluca, Maurizio; Gilardoni, Simone; CERN. Geneva. ATS Department

2016-01-01

In the framework of the LHC Injector Upgrade (LIU) project the CERN PS injection kinetic energy will be upgraded from 1.4 to 2 GeV. The present injection bump is made by four bumpers in Straight Section (SS) 40, 42, 43, 44 and it will be converted in a five bumpers system to allow additional flexibility in the bump shape with a reduction of the proton losses during the bump closure. The injection section SS42 has being redesigned to accommodate a new eddy current septum which will host a new bumper magnet in the same vacuum vessel due to reduced longitudinal space availability. The synchronization and amplitude variation of the power converter of the in-vacuum bumper 42 with respect to the remaining outside vacuum bumpers 40, 41, 43, 44 can lead to orbit distortion and consequent losses during injection. In this note we present the experimental results from Machine Development (MD) studies along with simulations for the present system at 1.4 GeV to quantify the acceptable orbit distortion and the performance ...

Injury risk curves for the WorldSID 50th male dummy.

Science.gov (United States)

Petitjean, Audrey; Trosseille, Xavier; Petit, Philippe; Irwin, Annette; Hassan, Joe; Praxl, Norbert

2009-11-01

The development of the WorldSID 50th percentile male dummy was initiated in 1997 by the International Organisation for Standardisation (ISO/SC12/TC22/WG5) with the objective of developing a more biofidelic side impact dummy and supporting the adoption of a harmonised dummy into regulations. More than 45 organizations from all around the world have contributed to this effort including governmental agencies, research institutes, car manufacturers and dummy manufacturers. The first production version of the WorldSID 50th male dummy was released in March 2004 and demonstrated an improved biofidelity over existing side impact dummies. Full scale vehicle tests covering a wide range of side impact test procedures were performed worldwide with the WorldSID dummy. However, the vehicle safety performance could not be assessed due to lack of injury risk curves for this dummy. The development of these curves was initiated in 2004 within the framework of ISO/SC12/TC22/WG6 (Injury criteria). In 2008, the ACEA- Dummy Task Force (TFD) decided to contribute to this work and offered resources for a project manager to coordinate of the effort of a group of volunteer biomechanical experts from international institutions (ISO, EEVC, VRTC/NHTSA, JARI, Transport Canada), car manufacturers (ACEA, Ford, General Motors, Honda, Toyota, Chrysler) and universities (Wayne State University, Ohio State University, John Hopkins University, Medical College of Wisconsin) to develop harmonized injury risk curves. An in-depth literature review was conducted. All the available PMHS datasets were identified, the test configurations and the quality of the results were checked. Criteria were developed for inclusion or exclusion of PMHS tests in the development of the injury risk curves. Data were processed to account for differences in mass and age of the subjects. Finally, injury risk curves were developed using the following statistical techniques, the certainty method, the Mertz/Weber method, the

Tensile strength of two soldered alloys (Minalux and Verabond2

Directory of Open Access Journals (Sweden)

Mir Mohammad Rezaee S

2002-07-01

Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

High-capacity hollow porous dummy molecular imprinted polymers using ionic liquid as functional monomer for selective recognition of salicylic acid.

Science.gov (United States)

Xiang, Haiyan; Peng, Mijun; Li, Hui; Peng, Sheng; Shi, Shuyun

2017-01-30

The existence of strong intramolecular hydrogen bond in salicylic acid (SA) weakens its intermolecular hydrogen bonding with functional monomer, then it is a challenge work to fabricate molecularly imprinted polymers (MIPs) for SA recognition with high capacity and good selectivity. Here, hollow porous dummy MIPs (HPDMIPs) were prepared using benzoic acid (BA) as dummy template, ionic liquid (i.e. 1-vinyl-3-methylimidazolium chloride) as functional monomer, and MCM-48 as sacrificial support. Factors that affected adsorption, such as type of template and porogen, mole ratio of template-functional monomer-cross-linker and type of binding solvent, were optimized in detail. Multiple strong interactions between SA and ionic liquid in HPDMIPs deduced higher binding capacity (29.75mg/g), imprinting factor (5.61) and selectivity than any previously reported MIPs by traditional or surface imprinting technology. The large surface area (543.9m 2 /g) with hollow porous structure resulted in faster kinetic binding (25min). The equilibrium data fitted well to Freundlich equation and the adsorption process could be described by pseudo-second order model. Finally, HPDMIPs were successfully applied to selectively extract and enrich SA from Actinidia chinensis with a relatively high recovery (84.6-94.5%). Copyright © 2016 Elsevier B.V. All rights reserved.

iPhone Application Development For Dummies

CERN Document Server

Goldstein, Neal

2009-01-01

Here's the fun and easy way to learn how to create your own iPhone applications. Whether you're a professional developer or an iPhone user with a knack for technology, this plain English guide shows you how easy it can be to create your own cool iPhone and iPod touch apps. The open iPhone SDK offers a world of opportunities, and with the information in iPhone Application Development For Dummies , you can get in on the fun and profit. You don't need high-level programming skills to create iPhone apps. iPhone Application Development For Dummies walks you through the fundamentals for building a v

iPhone for seniors for dummies

CERN Document Server

Muir, Nancy C

2013-01-01

The fun and friendly full-color guide to finding your way around your iPhone Everywhere you look it seems like someone is using an iPhone. If you're feeling left out of the fun, don't despair. For Dummies to the rescue! Written in the accessible For Dummies style and packed with colorful illustrations, this book shows you how to use your iPhone to make and receive calls, send text messages and e-mails, read e-books, watch movies, play games, surf the web, and so much more. By the time you're through with this all-new edition of this perennial bestseller, you'll be completely comfortable down

Determinants of the Government Bond Yield in Spain: A Loanable Funds Model

Directory of Open Access Journals (Sweden)

Yu Hsing

2015-07-01

Full Text Available This paper applies demand and supply analysis to examine the government bond yield in Spain. The sample ranges from 1999.Q1 to 2014.Q2. The EGARCH model is employed in empirical work. The Spanish government bond yield is positively associated with the government debt/GDP ratio, the short-term Treasury bill rate, the expected inflation rate, the U.S. 10 year government bond yield and a dummy variable representing the debt crisis and negatively affected by the GDP growth rate and the expected nominal effective exchange rate.

Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

Energy Technology Data Exchange (ETDEWEB)

Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

1999-11-01

Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

Electromigration kinetics and critical current of Pb-free interconnects

Energy Technology Data Exchange (ETDEWEB)

Lu, Minhua; Rosenberg, Robert [IBM T. J. Watson Research Center, Yorktown Heights, New York 10598 (United States)

2014-04-07

Electromigration kinetics of Pb-free solder bump interconnects have been studied using a single bump parameter sweep technique. By removing bump to bump variations in structure, texture, and composition, the single bump sweep technique has provided both activation energy and power exponents that reflect atomic migration and interface reactions with fewer samples, shorter stress time, and better statistics than standard failure testing procedures. Contact metallurgies based on Cu and Ni have been studied. Critical current, which corresponds to the Blech limit, was found to exist in the Ni metallurgy, but not in the Cu metallurgy. A temperature dependence of critical current was also observed.

Assessment of potential solder candidates for high temperature applications

DEFF Research Database (Denmark)

pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

Running bumps from stealth bosons

Science.gov (United States)

Aguilar-Saavedra, J. A.

2018-03-01

For the `stealth bosons' S, light boosted particles with a decay S → A A → q \\bar{q} q \\bar{q} into four quarks and reconstructed as a single fat jet, the groomed jet mass has a strong correlation with groomed jet substructure variables. Consequently, the jet mass distribution is strongly affected by the jet substructure selection cuts when applied on the groomed jet. We illustrate this fact by recasting a CMS search for low-mass dijet resonances and show a few representative examples. The mass distributions exhibit narrow and wide bumps at several locations in the 100-300 GeV range, between the masses of the daughter particles A and the parent particle S, depending on the jet substructure selection. This striking observation introduces several caveats when interpreting and comparing experimental results, for the case of non-standard signatures. The possibility that a single boosted particle decaying hadronically produces multiple bumps, at quite different jet masses, and depending on the event selection, brings the anomaly chasing game to the next level.

Running bumps from stealth bosons

International Nuclear Information System (INIS)

Aguilar-Saavedra, J.A.

2018-01-01

For the 'stealth bosons' S, light boosted particles with a decay S → AA → q anti qq anti q into four quarks and reconstructed as a single fat jet, the groomed jet mass has a strong correlation with groomed jet substructure variables. Consequently, the jet mass distribution is strongly affected by the jet substructure selection cuts when applied on the groomed jet. We illustrate this fact by recasting a CMS search for low-mass dijet resonances and show a few representative examples. The mass distributions exhibit narrow and wide bumps at several locations in the 100-300 GeV range, between the masses of the daughter particles A and the parent particle S, depending on the jet substructure selection. This striking observation introduces several caveats when interpreting and comparing experimental results, for the case of non-standard signatures. The possibility that a single boosted particle decaying hadronically produces multiple bumps, at quite different jet masses, and depending on the event selection, brings the anomaly chasing game to the next level. (orig.)

ATLAS pixel IBL modules construction experience and developments for future upgrade

Energy Technology Data Exchange (ETDEWEB)

Gaudiello, A.

2015-10-01

The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

Nano-soldering of magnetically aligned three-dimensional nanowire networks

International Nuclear Information System (INIS)

Gao Fan; Gu Zhiyong

2010-01-01

It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

International Nuclear Information System (INIS)

Peng, Y; Inkson, B J; Cullis, A G

2010-01-01

This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

International Nuclear Information System (INIS)

Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

1975-01-01

The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

A Hodge dual for soldered bundles

International Nuclear Information System (INIS)

Lucas, Tiago Gribl; Pereira, J G

2009-01-01

In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

Home Networking Do-It-Yourself For Dummies

CERN Document Server

Miller, Lawrence C

2011-01-01

Step by step guide to connecting all your electronic devices into one network A home network allows you to share Internet connections, photos, video, music, game consoles, printers, and other electronic gadgets. This do-it-yourself guide shows you step by step how to create a wired or wireless network in your home. In the For Dummies tradition of making technology less intimidating, Home Networking Do-It-Yourself For Dummies breaks down the process into easy steps with clear instructions.Increasing broadband speeds, cellular technology, the explosive growth of iPhone sales, and the new Home Gr

The origins of the universe for dummies

CERN Document Server

Pincock, Stephen

2007-01-01

Do you want to learn about the physical origin of the Universe, but don't have the rest of eternity to read up on it? Do you want to know what scientists know about where you and your planet came from, but without the science blinding you? 'Course you do - and who better than For Dummies to tackle the biggest, strangest and most wonderful question there is! The Origins of the Universe For Dummies covers: Early ideas about our universeModern cosmologyBig Bang theoryDark matter and gravityGalaxies and solar systemsLife on earthFi

Characterization of the microstructure of tin-silver lead free solder

Energy Technology Data Exchange (ETDEWEB)

Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

2016-07-05

Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

On the persistence of unstable bump-on-tail electron velocity distributions in the earth's foreshock

Science.gov (United States)

Klimas, Alexander J.; Fitzenreiter, Richard J.

1988-01-01

This paper presents further evidence for the persistence of bump-on-tail unstable reduced velocity distributions in the earth's electron foreshock, which contradicts the understanding of quasi-linear saturation of the bump-on-tail instability. A modified theory for the saturation of the bump-on-tail instability in the earth's foreshock is proposed to explain the mechanism of this persistence, and the predictions are compared to the results of a numerical simulation of the electron plasma in the foreshock. The results support the thesis that quasi-linear saturation of the bump-on-tail instability is modified in the foreshock, due to the driven nature of the region, so that at saturation the stabilized velocity distribution still appears bump-on-tail unstable to linear plasma analysis.

Effect of wettability and topological features of Namib beetle inspired bumps on dropwise condensation

Science.gov (United States)

Ahmad, Shakeel; Tang, Hui; Yao, Haimin

2017-11-01

The Stenocara beetle lives in arid desert environment where the only available source of water is fog droplets. The beetle contains many hydrophobic/hydrophilic bumps on its back. Water collection occurs on the hydrophilic patches. Once the droplet reaches the critical volume, it sheds down due to gravity. Although a number of studies on condensation and water collection on beetle inspired structures have been reported in literature, most of them were on micro/nano scale textures. However, in nature the beetle bumps are in millimeter scale. At this scale the role of topological features and gravity becomes crucial for early droplet shedding. Therefore, in this work we numerically investigated the effects of bump shape, wettability contrast, surface slope and hydrophilic patch to total area ratio on droplet shedding volume and time. A three-dimensional lattice Boltzmann method (LBM) based numerical framework was used for the simulations. Compared with bumps of other shapes such a cube or a circular cylinder, faster droplet shedding was obtained over a hemispherical bump. Furthermore, it was found that larger hydrophilic patch to total area ratio for the hemispherical bump significantly increased the droplet shedding time.

Development of a dummy load and waveguide components for 1 MW CW gyrotron

Energy Technology Data Exchange (ETDEWEB)

Ioki, Kimihiro, E-mail: ioki@toyama-jp.com [Toyama Company Limited, 3816-1 Kishi, Ymakita-machi, Ashigarakami-gun, Kanagawa 258-0112 (Japan); Hiranai, Shinichi; Moriyama, Shinichi [Naka Fusion Institute, JAEA, 801-1, Mukoyama, Naka-shi, Ibaraki 311-0193 (Japan); Tanaka, Suguru [Toyama Company Limited, 3816-1 Kishi, Ymakita-machi, Ashigarakami-gun, Kanagawa 258-0112 (Japan)

2016-11-01

Highlights: • A dummy load is a required component for the electron cyclotron heating system to test and adjust a gyrotron or a transmission line in ITER and JT60SA. • A new design concept was developed considering reliable durability and long lifetime. • Linear movement is used as a main mechanism for the reflector to mitigate the heat deposition concentration instead of rotating reflector, and the vacuum boundary for the linear movement is simply made with bellows. • The distribution of the ceramic coating thickness is carefully optimized considering the heat deposition rate. • A prototypical dummy load will be manufactured and tested, following the design phase. - Abstract: A dummy load dissipates the radiofrequency power and is required for the electron cyclotron heating system to test and adjust a gyrotron or a transmission line in ITER and JT60SA. The dummy load is comprised of a water-cooled vacuum chamber and a reflector. The vacuum chamber has intensive cooling and the inside surface has a ceramic coating layer. It is important that the dummy load has reliable durability and long lifetime. Linear movement is used as a main mechanism for the reflector to mitigate the heat deposition concentration instead of rotating reflector. The vacuum boundary for the linear movement is simply made with bellows and the bellows is accessible from the outside. The distribution of the ceramic coating thickness is carefully optimized considering the heat deposition rate. Another critical issue is to minimize the back reflection of the RF power from the dummy load. However, it is desired to design the dummy load without the pre-dummy-load. A prototypical dummy load will be manufactured and tested, following the design phase.

Drinking Water Contamination Due To Lead-based Solder

Science.gov (United States)

Garcia, N.; Bartelt, E.; Cuff, K. E.

2004-12-01

The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

Horizon shells and BMS-like soldering transformations

Energy Technology Data Exchange (ETDEWEB)

Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

2016-03-07

We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

Science.gov (United States)

Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

2014-10-01

The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Directory of Open Access Journals (Sweden)

Yee Mei Leong

2016-06-01

Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Science.gov (United States)

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

International Nuclear Information System (INIS)

Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

2015-01-01

Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

The metallurgical approach on the solder voids behaviour in surface mount devices

International Nuclear Information System (INIS)

Mohabattul Zaman Bukhari

1996-01-01

Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

International Nuclear Information System (INIS)

Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-01-01

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

Energy Technology Data Exchange (ETDEWEB)

Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-11-25

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

Energy Technology Data Exchange (ETDEWEB)

Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

1995-06-01

The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

The peaks of life: The differential temporal locations of the reminiscence bump across disparate cueing methods

DEFF Research Database (Denmark)

Koppel, Jonathan Mark; Berntsen, Dorthe

2015-01-01

The reminiscence bump has generally been assessed through either (1) the cue word method, or (2) several related methods which we refer to under the umbrella of the important memories method. Here we provide a review of the literature demonstrating that the temporal location of the bump varies...... systematically according to cueing method, with the mean range of the bump located from 8.7 to 22.5 years of age for word-cued memories, versus 15.1 to 27.9 for important memories. This finding has hitherto been under-acknowledged, as existing theoretical accounts of the bump generally hold its location...... to be stable across cueing methods. We therefore re-evaluate existing theoretical accounts of the bump in light of these varying locations, addressing each account’s consistency with (1) the respective bumps found through each method taken individually, and (2) the sensitivity of the bump’s location to cueing...

Development of a shear force measurement dummy for seat comfort.

Science.gov (United States)

Kim, Seong Guk; Ko, Chang-Yong; Kim, Dong Hyun; Song, Ye Eun; Kang, Tae Uk; Ahn, Sungwoo; Lim, Dohyung; Kim, Han Sung

2017-01-01

Seat comfort is one of the main factors that consumers consider when purchasing a car. In this study, we develop a dummy with a shear-force sensor to evaluate seat comfort. The sensor has dimensions of 25 mm × 25 mm × 26 mm and is made of S45C. Electroless nickel plating is employed to coat its surface in order to prevent corrosion and oxidation. The proposed sensor is validated using a qualified load cell and shows high accuracy and precision (measurement range: -30-30 N; sensitivity: 0.1 N; linear relationship: R = 0.999; transverse sensitivity: <1%). The dummy is manufactured in compliance with the SAE standards (SAE J826) and incorporates shear sensors into its design. We measure the shear force under four driving conditions and at five different speeds using a sedan; results showed that the shear force increases with speed under all driving conditions. In the case of acceleration and deceleration, shear force significantly changes in the lower body of the dummy. During right and left turns, it significantly changes in the upper body of the dummy.

Laser Soldering of Rat Skin Using a Controlled Feedback System

Directory of Open Access Journals (Sweden)

Mohammad Sadegh Nourbakhsh

2009-03-01

Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

HTML5 eLearning kit for dummies

CERN Document Server

Boumphrey, Frank

2012-01-01

Helping self-directed learners of all levels learn HTML5 If you want to develop and structure pages for the web, HTML5 is one of the tools you need. This invaluable eLearning kit steps you through learning HTML5, CSS3, and JavaScript. With this dynamic combination of a full-color printed book and a Dummies interactive eLearning course on CD, you'll find a wealth of information on HTML5. Featuring both written and animated step-by-step how-tos, practice labs, helpful videos, numerous examples, and a host of Dummies hints and tips, this package makes your learning process easier. Follow the mate

New Pulsed Orbit Bump Magnets for the Fermilab Booster Synchrotron

CERN Document Server

Lackey, James; John, Carson; Kashikhin, Vladimir; Makarov, Alexander; Prebys, Eric

2005-01-01

The beam from the Fermilab Linac is injected onto a bump in the closed orbit of the Booster Synchrotron where a carbon foil strips the electrons from the Linac’s negative ion hydrogen beam. Although the Booster itself runs at 15Hz, heat dissipation in the orbit bump magnets has been one limitation to the fraction of the cycles that can be used for beam. New, 0.28T pulsed window frame dipole magnets have been constructed that will fit into the same space as the old ones, run at the full repetition rate of the Booster, and provide a larger bump to allow a cleaner injection orbit. The new magnets use a high saturation flux density Ni-Zn ferrite in the yoke rather than laminated steel. The presented magnetic design includes two and three dimensional magnetic field calculations with eddy currents and ferrite nonlinear effects.

NOOKcolor for dummies

CERN Document Server

Sandler, Corey

2011-01-01

NOOKcolor For Dummies provides readers with all the information they need in order to get the most out of their NOOKcolor e-reader. Key topics covered include: Introducing the ebook and e-reader concept Navigating the technical aspects of The NOOKcolor, including touchscreen technology, wireless access, software updates Downloading and shopping for e-books Listening to music on your NOOKcolor Powering the NOOKcolor Formats Reading an e-book on an e-reader, including lighting, font adjustments, and so on Using th

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

Science.gov (United States)

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Science.gov (United States)

Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

2017-10-01

Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

Fundamentals of lead-free solder interconnect technology from microstructures to reliability

CERN Document Server

Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

2015-01-01

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

International Nuclear Information System (INIS)

Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

2010-01-01

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

Energy Technology Data Exchange (ETDEWEB)

Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

2010-02-18

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

In vitro conjunctival incision repair by temperature-controlled laser soldering.

Science.gov (United States)

Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

2009-01-01

The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

International Nuclear Information System (INIS)

Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

2009-01-01

Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

Effectiveness of Emittance Bumps in the NLC and US Cold LC Main Linear Accelerators (LCC-0138)

International Nuclear Information System (INIS)

Tenenbaum, P

2004-01-01

We report on a series of studies on the effectiveness of closed orbit bumps in the linacs of the NLC and the USColdLC. In the first study, emittance dilutions of a pure-wakefield or pure-dispersion character are introduced in each linac, and a set of emittance bumps is tested to determine the most effective bump location in the linac, and the net effectiveness. In the second study, a more realistic set of dilutions are introduced and the wakefield bumps used in the first study are applied

NOOK for dummies

CERN Document Server

Sandler, Corey

2011-01-01

NOOK For Dummies provides readers with all the information they need in order to get the most out of their NOOK e-reader. Key topics covered include: Introducing the ebook and e-reader concept Navigating the technical aspects of The NOOK including touchscreen technology, wireless access, software updates Downloading and shopping for e-books Listening to music on your NOOK Powering the NOOK Formats Reading an e-book on an e-reader, including lighting, font adjustments, and so on Using the Android-based applicatio

SPSS for Dummies

CERN Document Server

Griffith, Arthur

2010-01-01

The fun and friendly guide to the world's leading statistical software. Predictive Analysis Software (PASW), formerly SPSS software, is the leading statistical software used by commerical, government, and academic organizations around the world to solve business and research problems. It allows you to quickly and easily discover new insights from data, test hypotheses, and build powerful predictive models. PASW Statistics For Dummies covers everything you need to know to get up and running with this efficient and practical software. *: *; PASW Statistics is the leading statistical software use

Optics for dummies

CERN Document Server

Duree, Galen C

2011-01-01

The easy way to shed light on Optics In general terms, optics is the science of light. More specifically, optics is a branch of physics that describes the behavior and properties of light?including visible, infrared, and ultraviolet?and the interaction of light with matter. Optics For Dummies gives you an approachable introduction to optical science, methods, and applications. You'll get plain-English explanations of the nature of light and optical effects; reflection, refraction, and diffraction; color dispersion; optical devices, industrial, medical, and military applicatio

Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

Energy Technology Data Exchange (ETDEWEB)

Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

2008-04-24

The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

Development of a shear force measurement dummy for seat comfort.

Directory of Open Access Journals (Sweden)

Seong Guk Kim

Full Text Available Seat comfort is one of the main factors that consumers consider when purchasing a car. In this study, we develop a dummy with a shear-force sensor to evaluate seat comfort. The sensor has dimensions of 25 mm × 25 mm × 26 mm and is made of S45C. Electroless nickel plating is employed to coat its surface in order to prevent corrosion and oxidation. The proposed sensor is validated using a qualified load cell and shows high accuracy and precision (measurement range: -30-30 N; sensitivity: 0.1 N; linear relationship: R = 0.999; transverse sensitivity: <1%. The dummy is manufactured in compliance with the SAE standards (SAE J826 and incorporates shear sensors into its design. We measure the shear force under four driving conditions and at five different speeds using a sedan; results showed that the shear force increases with speed under all driving conditions. In the case of acceleration and deceleration, shear force significantly changes in the lower body of the dummy. During right and left turns, it significantly changes in the upper body of the dummy.

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

DEFF Research Database (Denmark)

Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

2017-01-01

humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

National Research Council Canada - National Science Library

Chung, Kohn C

2006-01-01

.... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

Bump formation in a binary attractor neural network

International Nuclear Information System (INIS)

Koroutchev, Kostadin; Korutcheva, Elka

2006-01-01

The conditions for the formation of local bumps in the activity of binary attractor neural networks with spatially dependent connectivity are investigated. We show that these formations are observed when asymmetry between the activity during the retrieval and learning is imposed. An analytical approximation for the order parameters is derived. The corresponding phase diagram shows a relatively large and stable region where this effect is observed, although critical storage and information capacities drastically decrease inside that region. We demonstrate that the stability of the network, when starting from the bump formation, is larger than the stability when starting even from the whole pattern. Finally, we show a very good agreement between the analytical results and the simulations performed for different topologies of the network

What's new in Windows 8.1 for dummies

CERN Document Server

Underdahl, Brian

2013-01-01

What's New in Windows 8.1 For Dummies Pocket Edition provides a brief, inexpensive, and focused guide for Windows 8 users upgrading to 8.1. Chapters include:It's all about you: An exploration of the customization features, from flexible sizing on icons to shared wallpaper to boot options.We can build it better: Review of the updates to applications with special emphaisis on communications and media appsShiny new toys: Walkthroughs of the new features added to Windows 8.1, including the start button and search functionTen reasons you were smart to upgrade: In the spirit of the For Dummies Part

Far infrared through millimeter backshort-under-grid arrays

Science.gov (United States)

Allen, Christine A.; Abrahams, John; Benford, Dominic J.; Chervenak, James A.; Chuss, David T.; Staguhn, Johannes G.; Miller, Timothy M.; Moseley, S. Harvey; Wollack, Edward J.

2006-06-01

We are developing a large-format, versatile, bolometer array for a wide range of infrared through millimeter astronomical applications. The array design consists of three key components - superconducting transition edge sensor bolometer arrays, quarter-wave reflective backshort grids, and Superconducting Quantum Interference Device (SQUID) multiplexer readouts. The detector array is a filled, square grid of bolometers with superconducting sensors. The backshort arrays are fabricated separately and are positioned in the etch cavities behind the detector grid. The grids have unique three-dimensional interlocking features micromachined into the walls for positioning and mechanical stability. The ultimate goal of the program is to produce large-format arrays with background-limited sensitivity, suitable for a wide range of wavelengths and applications. Large-format (kilopixel) arrays will be directly indium bump bonded to a SQUID multiplexer circuit. We have produced and tested 8×8 arrays of 1 mm detectors to demonstrate proof of concept. 8×16 arrays of 2 mm detectors are being produced for a new Goddard Space Flight Center instrument. We have also produced models of a kilopixel detector grid and dummy multiplexer chip for bump bonding development. We present detector design overview, several unique fabrication highlights, and assembly technologies.

Interfacial reaction of Sn-based solder joint in the package system

Science.gov (United States)

Gu, Huandi

In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

Cascading reminiscence bumps in popular music.

Science.gov (United States)

Krumhansl, Carol Lynne; Zupnick, Justin Adam

2013-10-01

Autobiographical memories are disproportionately recalled for events in late adolescence and early adulthood, a phenomenon called the reminiscence bump. Previous studies on music have found autobiographical memories and life-long preferences for music from this period. In the present study, we probed young adults' personal memories associated with top hits over 5-and-a-half decades, as well as the context of their memories and their recognition of, preference for, quality judgments of, and emotional reactions to that music. All these measures showed the typical increase for music released during the two decades of their lives. Unexpectedly, we found that the same measures peaked for the music of participants' parents' generation. This finding points to the impact of music in childhood and suggests that these results reflect the prevalence of music in the home environment. An earlier peak occurred for 1960s music, which may be explained by its quality or by its transmission through two generations. We refer to this pattern of musical cultural transmission over generations as cascading reminiscence bumps.

The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

Science.gov (United States)

Mayappan, R.; Salleh, A.; Andas, J.

2017-09-01

Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

Reminiscence bump in memory for public events

NARCIS (Netherlands)

Janssen, S.M.J.; Murre, J.M.J.; Meeter, M.

2008-01-01

People tend to recall more personal events from adolescence and early adulthood than from other lifetime periods. Most evidence suggests that differential encoding causes this reminiscence bump. However, the question why personal events are encoded better in those periods is still unanswered. To

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Science.gov (United States)

Teverovsky, Alexander A.

2014-01-01

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

Statistics For Dummies

CERN Document Server

Rumsey, Deborah

2011-01-01

The fun and easy way to get down to business with statistics Stymied by statistics? No fear ? this friendly guide offers clear, practical explanations of statistical ideas, techniques, formulas, and calculations, with lots of examples that show you how these concepts apply to your everyday life. Statistics For Dummies shows you how to interpret and critique graphs and charts, determine the odds with probability, guesstimate with confidence using confidence intervals, set up and carry out a hypothesis test, compute statistical formulas, and more.Tracks to a typical first semester statistics cou

SQL for dummies

CERN Document Server

Taylor, Allen G

2013-01-01

Uncover the secrets of SQL and start building better relational databases today!This fun and friendly guide will help you demystify database management systems so you can create more powerful databases and access information with ease. Updated for the latest SQL functionality, SQL For Dummies, 8th Edition covers the core SQL language and shows you how to use SQL to structure a DBMS, implement a database design, secure your data, and retrieve information when you need it. Includes new enhancements of SQL:2011, including temporal data functionality which a

Electronics for dummies

CERN Document Server

Shamieh

2015-01-01

Explore the basic concepts of electronics, build your electronics workbench, and begin creating fun electronics projects right away! Electronics For Dummies, 3rd Edition is your guide to the world of electronics. Spanning circuitry, wiring, robotics, transmitters, amplifiers, and more, this book demystifies electricity basics and beyond. The third edition offers new content revised to reflect the latest advancements in the electronics field, and it offers full color project examples to spark your creativity and inspire you to put your new skills to use! Packed with projects that can be comple

Leadership For Dummies

CERN Document Server

Cole, Kris

2012-01-01

Created especially for the Australian customer! Improve your leadership skills and bring out the best in the people you lead People may join organisations, but they stay because of good leaders. Find out how inspiring and bringing out the best in the people you lead helps you fulfil your organisation's visions and key priorities. Leadership For Dummies, Australian and New Zealand Edition, quickly gets you up to speed on the latest leadership theories, providing practical strategies and surefire techniques to ensure you and your followers are working in the same direction. Discover how to: D

UX for dummies

CERN Document Server

Nichols, Kevin

2014-01-01

Get up to speed quickly on the latest in user experience strategy and design UX For Dummies is a hands-on guide to developing and implementing user experience strategy. Written by globally-recognized UX consultants, this essential resource provides expert insight and guidance on using the tools and techniques that create a great user experience, along with practical advice on implementing a UX strategy that aligns with your organisation's business goals and philosophy. You'll learn how to integrate web design, user research, business planning and data analysis to focus your company's web prese

CO2 laser-induced bump formation and growth on polystyrene for multi-depth soft lithography molds

International Nuclear Information System (INIS)

Li, Huawei; Fan, Yiqiang; Conchouso, David; Foulds, Ian G

2012-01-01

This paper reports the process of creating bumps on the surface of polystyrene (PS) induced by a CO 2 laser at low powers. The paper also outlines the procedure for growing bumps induced by multiple laser scans on the aforementioned bumps. These bumps result from the net volume gain of the laser heat-affected zone on the PS rather than from a deposition process, and the expansion of the heat-affected zone on PS was verified by measuring the hardness change using nanoindentation. The bumps have a much smoother surface than microchannels fabricated with laser cutting; depending on the laser power, they have heights ranging from hundreds of nanometers to 42 µm. The laser scanning speed and scan times along with this technique offer a fast and low-cost alternative for fabricating molds for multi-depth PDMS microfluidic devices. (paper)

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

Science.gov (United States)

This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

Visual detection of defects in solder joints

Science.gov (United States)

Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

1995-03-01

The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Directory of Open Access Journals (Sweden)

Saliza Azlina O.

2016-01-01

Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

Science.gov (United States)

Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

2018-01-01

This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

Energy Technology Data Exchange (ETDEWEB)

Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

2008-07-14

Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

CO2laser-induced bump formation and growth on polystyrene for multi-depth soft lithography molds

KAUST Repository

Li, Huawei

2012-10-19

This paper reports the process of creating bumps on the surface of polystyrene (PS) induced by a CO2laser at low powers. The paper also outlines the procedure for growing bumps induced by multiple laser scans on the aforementioned bumps. These bumps result from the net volume gain of the laser heat-affected zone on the PS rather than from a deposition process, and the expansion of the heat-affected zone on PS was verified by measuring the hardness change using nanoindentation. The bumps have a much smoother surface than microchannels fabricated with laser cutting; depending on the laser power, they have heights ranging from hundreds of nanometers to 42m. The laser scanning speed and scan times along with this technique offer a fast and low-cost alternative for fabricating molds for multi-depth PDMS microfluidic devices. © 2012 IOP Publishing Ltd.

Automation of experimental research of waveguide paths induction soldering

Science.gov (United States)

Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

2018-05-01

The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

Optimization of the soldering process by the DMAIC methodology

Directory of Open Access Journals (Sweden)

Michał Zasadzień

2016-06-01

Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Effects of rework on adhesion of Pb-In soldered gold thick films

International Nuclear Information System (INIS)

Gehman, R.W.; Becka, G.A.; Losure, J.A.

1982-02-01

The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

Effect of gamma radiation on micromechanical hardness of lead-free solder joint

Energy Technology Data Exchange (ETDEWEB)

Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

2015-09-25

Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

Comparative shear tests of some low temperature lead-free solder pastes

Science.gov (United States)

Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

2016-12-01

The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

Manipulation and soldering of carbon nanotubes using atomic force microscope

International Nuclear Information System (INIS)

Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

2008-01-01

Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

Effect of temperature and flux concentration on soldering of base metal.

Science.gov (United States)

Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

2000-12-01

The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

Science.gov (United States)

Lee, Hwa-Teng; Huang, Kuo-Chen

2016-12-01

Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

Design of the dummy coil for magnet power supply

International Nuclear Information System (INIS)

Kim, Chang-Hwan; Choi, Jae-Hoon; Jin, Jong-Kook; Lee, Dong-Keun; Kong, Jong-Dea; Joung, Nam-Young; Kim, Sang-Tae; Kim, Young-Jin; Kim, Yang-Soo; Kwon, Myeun

2013-01-01

Highlights: • It is necessary to confirm safety of the MPS on a dummy coil before the operating it. • We selected and designed the water cooling type dummy coil to test on the MPS's rating (12.5 kA) test. • For the design of the dummy coil, we considered requirements about electrical, structural and water cooling. • We will test as the rating power after MPS upgrade and that test will do before every KSTAR campaign. -- Abstract: It is necessary to test it on a dummy coil, before using a magnet power supply (MPS) to energize a Poloidal Field (PF) coil in the Korea Superconducting Tokamak Advanced Research (KSTAR) device. The dummy coil should accept the same large current from the MPS as the PF coil and be within the capability of the utilities located at the KSTAR site. Therefore a coil design based on the characteristics of the MPS and other restrictive conditions needed to be made. There are three requirements to be met in the design: an electrical requirement, a structural requirement, and a water cooling requirement. The electrical requirement was that the coil should have an inductance of 40 mH. For the structural requirement, the material should be non magnetic. The coil support structure and water cooling manifold were made of SUS 304. The water cooling requirement was that there should be sufficient flow rate so that the temperature rise ΔT should not exceed 12 °C for operation at 12.5 kA for 5 min. Square cross-section hollow conductor with dimensions of 38.1 mm × 38.1 mm was used with a 25.4 mm center hole for cooling water. However, as a result of tests, it was found that the electrical and structural requirements were satisfied but that the water cooling was over designed. It is imperative that the verification will be redone for a test with 12.5 kA for 5 min

Design of the dummy coil for magnet power supply

Energy Technology Data Exchange (ETDEWEB)

Kim, Chang-Hwan, E-mail: kch2004@nfri.re.kr; Choi, Jae-Hoon; Jin, Jong-Kook; Lee, Dong-Keun; Kong, Jong-Dea; Joung, Nam-Young; Kim, Sang-Tae; Kim, Young-Jin; Kim, Yang-Soo; Kwon, Myeun

2013-11-15

Highlights: • It is necessary to confirm safety of the MPS on a dummy coil before the operating it. • We selected and designed the water cooling type dummy coil to test on the MPS's rating (12.5 kA) test. • For the design of the dummy coil, we considered requirements about electrical, structural and water cooling. • We will test as the rating power after MPS upgrade and that test will do before every KSTAR campaign. -- Abstract: It is necessary to test it on a dummy coil, before using a magnet power supply (MPS) to energize a Poloidal Field (PF) coil in the Korea Superconducting Tokamak Advanced Research (KSTAR) device. The dummy coil should accept the same large current from the MPS as the PF coil and be within the capability of the utilities located at the KSTAR site. Therefore a coil design based on the characteristics of the MPS and other restrictive conditions needed to be made. There are three requirements to be met in the design: an electrical requirement, a structural requirement, and a water cooling requirement. The electrical requirement was that the coil should have an inductance of 40 mH. For the structural requirement, the material should be non magnetic. The coil support structure and water cooling manifold were made of SUS 304. The water cooling requirement was that there should be sufficient flow rate so that the temperature rise ΔT should not exceed 12 °C for operation at 12.5 kA for 5 min. Square cross-section hollow conductor with dimensions of 38.1 mm × 38.1 mm was used with a 25.4 mm center hole for cooling water. However, as a result of tests, it was found that the electrical and structural requirements were satisfied but that the water cooling was over designed. It is imperative that the verification will be redone for a test with 12.5 kA for 5 min.

Validation of an instrumented dummy to assess mechanical aspects of discomfort during load carriage.

Directory of Open Access Journals (Sweden)

Patrick D Wettenschwiler

Full Text Available Due to the increasing load in backpacks and other load carriage systems over the last decades, load carriage system designs have to be adapted accordingly to minimize discomfort and to reduce the risk of injury. As subject studies are labor-intensive and include further challenges such as intra-subject and inter-subject variability, we aimed to validate an instrumented dummy as an objective laboratory tool to assess the mechanical aspects of discomfort. The validation of the instrumented dummy was conducted by comparison with a recent subject study. The mechanical parameters that characterize the static and dynamic interaction between backpack and body during different backpack settings were compared. The second aim was to investigate whether high predictive power (coefficient of determination R2>0.5 in assessing the discomfort of load carriage systems could be reached using the instrumented dummy. Measurements were conducted under static conditions, simulating upright standing, and dynamic conditions, simulating level walking. Twelve different configurations of a typical load carriage system, a commercially available backpack with a hip belt, were assessed. The mechanical parameters were measured in the shoulder and the hip region of the dummy and consisted of average pressure, peak pressure, strap force and relative motion between the system and the body. The twelve configurations consisted of three different weights (15kg, 20kg, and 25kg, combined with four different hip belt tensions (30N, 60N, 90N, and 120N. Through the significant (p<0.05 correlation of the mechanical parameters measured on the dummy with the corresponding values of the subject study, the dummy was validated for all static measurements and for dynamic measurements in the hip region to accurately simulate the interaction between the human body and the load carriage system. Multiple linear regressions with the mechanical parameters measured on the dummy as independent

Spotify For Dummies

CERN Document Server

Gilmour, Kim

2011-01-01

The ultimate beginner guide to the groundbreaking music service, Spotify! Spotify is a free online streaming music platform that allows users to listen to songs on demand over the Internet--without having to buy or own the actual tracks. This fun and friendly guide walks you through how best to use this sweet-sounding service. Covering everything from using Spotify on selected mobile phones to creating and sharing your own playlists, Spotify For Dummies has it all. Experienced author Kim Gilmour details the ins and outs of this revolutionary music, from installing and setup to discovering new

Swift for dummies

CERN Document Server

Feiler, Jesse

2015-01-01

Get up and running with Swift-swiftly Brimming with expert advice and easy-to-follow instructions,Swift For Dummies shows new and existing programmers how toquickly port existing Objective-C applications into Swift and getinto the swing of the new language like a pro. Designed from theground up to be a simpler programming language, it's never beeneasier to get started creating apps for the iPhone or iPad, orapplications for Mac OS X. Inside the book, you'll find out how to set up Xcode for a newSwift application, use operators, objects, and data types, andcontrol program flow with conditiona

Coding for dummies

CERN Document Server

Abraham, Nikhil

2015-01-01

Hands-on exercises help you learn to code like a pro No coding experience is required for Coding For Dummies,your one-stop guide to building a foundation of knowledge inwriting computer code for web, application, and softwaredevelopment. It doesn't matter if you've dabbled in coding or neverwritten a line of code, this book guides you through the basics.Using foundational web development languages like HTML, CSS, andJavaScript, it explains in plain English how coding works and whyit's needed. Online exercises developed by Codecademy, a leading online codetraining site, help hone coding skill

CISSP for dummies

CERN Document Server

Miller, Lawrence C

2012-01-01

A fully updated guide to CISSP certification CISSP certification is the most prestigious and highly valued of the security certifications. This is the book you need to approach the exam with confidence and become CISSP certified! The CISSP Body of Knowledge underwent many changes in 2012, and this book covers them all. With a down-to-earth approach, it provides all the information covered in the exam plus numerous self-assessment tools, Quick Assessment and Prep tests to give you practice, a sample exam, and hundreds of randomly generated review questions on the Dummies Test Engine, availab

Perl for dummies

CERN Document Server

Hoffman, Paul

2011-01-01

In the days before personal computers, BASIC was the easy programming language to learn, and serious programmers learned FORTRAN or COBOL to do "real work." Today, many people have discovered that Perl is both a great beginning programming language and one that enables them to write powerful programs with little effort. If you're interested in discovering how to program (or how others program), Perl For Dummies, 4th Edition, is for you. If you already know something about programming (but not about Perl), this book is also for you. If you're already an expert programmer, you're still w

Calculus for dummies

CERN Document Server

Ryan, Mark

2014-01-01

Slay the calculus monster with this user-friendly guide Calculus For Dummies, 2nd Edition makes calculus manageable-even if you're one of the many students who sweat at the thought of it. By breaking down differentiation and integration into digestible concepts, this guide helps you build a stronger foundation with a solid understanding of the big ideas at work. This user-friendly math book leads you step-by-step through each concept, operation, and solution, explaining the ""how"" and ""why"" in plain English instead of math-speak. Through relevant instruction and practical examples, you'll s

Prezi for Dummies

CERN Document Server

Diamond, Stephanie

2010-01-01

A one-stop resource for an exciting new Web-based, slide-free presentation tool!. People who have been seeking a flashier version of PowerPoint have found it—and it's Prezi. A Web-based, slide-free presentation tool, Prezi allows users to create and give rich, Web-based presentations complete with dynamic content, contextual layouts, and eye-catching visuals. Prezi For Dummies gets you rapidly up to speed, including how to think outside the traditional slide, create your project, insert Flash and other graphic files, and publish your presentation to a public domain. You'll also learn valuable

Hudl for dummies

CERN Document Server

Hattersley, Rosemary

2014-01-01

The essential beginner's guide to the UK's most popular new tablet Hudl For Dummies is the indispensible guide to Tesco's highly successful Android tablet. With hands-on instruction tailored to the entry-level user, this book provides expert guidance in clear, concise language to help you get the most out of this great new device. Seasoned technology author Rosie Hattersley walks you through each step, from opening the box to setting up e-mail, accessing Blinkbox, shopping online and more. Even if you're a newcomer to tablet technology, this book will have you up and running in a flash! By uti

Condensation on Slippery Asymmetric Bumps

Science.gov (United States)

Park, Kyoo-Chul; Kim, Philseok; Aizenberg, Joanna

2016-11-01

Controlling dropwise condensation by designing surfaces that enable droplets to grow rapidly and be shed as quickly as possible is fundamental to water harvesting systems, thermal power generation, distillation towers, etc. However, cutting-edge approaches based on micro/nanoscale textures suffer from intrinsic trade-offs that make it difficult to optimize both growth and transport at once. Here we present a conceptually different design approach based on principles derived from Namib desert beetles, cacti, and pitcher plants that synergistically couples both aspects of condensation and outperforms other synthetic surfaces. Inspired by an unconventional interpretation of the role of the beetle's bump geometry in promoting condensation, we show how to maximize vapor diffusion flux at the apex of convex millimetric bumps by optimizing curvature and shape. Integrating this apex geometry with a widening slope analogous to cactus spines couples rapid drop growth with fast directional transport, by creating a free energy profile that drives the drop down the slope. This coupling is further enhanced by a slippery, pitcher plant-inspired coating that facilitates feedback between coalescence-driven growth and capillary-driven motion. We further observe an unprecedented six-fold higher exponent in growth rate and much faster shedding time compared to other surfaces. We envision that our fundamental understanding and rational design strategy can be applied to a wide range of phase change applications.

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Czech Academy of Sciences Publication Activity Database

Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

2012-01-01

Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

Science.gov (United States)

Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

2018-03-01

In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

Science.gov (United States)

Sorg, Brian S.; Welch, Ashley J.

2001-05-01

Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

Science.gov (United States)

Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

2004-12-01

The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

Integrated optical MEMS using through-wafer vias and bump-bonding.

Energy Technology Data Exchange (ETDEWEB)

McCormick, Frederick Bossert; Frederick, Scott K.

2008-01-01

This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Study on interfacial reaction between lead-free solders and alternative surface finishes

International Nuclear Information System (INIS)

Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

2007-01-01

This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

The critical oxide thickness for Pb-free reflow soldering on Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

2012-06-01

Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

Effect of gap distance on tensile strength of preceramic base metal solder joints.

Science.gov (United States)

Fattahi, Farnaz; Motamedi, Milad

2011-01-01

In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

2017-01-01

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan

2017-08-10

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

International Nuclear Information System (INIS)

Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

2008-01-01

The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

Energy Technology Data Exchange (ETDEWEB)

Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

2008-09-01

The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

International Nuclear Information System (INIS)

Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

2009-01-01

The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

Hanford Waste Tank Bump Accident and Consequence Analysis

International Nuclear Information System (INIS)

BRATZEL, D.R.

2000-01-01

This report provides a new evaluation of the Hanford tank bump accident analysis and consequences for incorporation into the Authorization Basis. The analysis scope is for the safe storage of waste in its current configuration in single-shell and double-shell tanks

Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Energy Technology Data Exchange (ETDEWEB)

Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

2009-05-27

The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

C++ for dummies

CERN Document Server

Davis, Stephen Randy

2009-01-01

Enter the world of computer programming with this step-by-step guide to the C++ language! C++ is a great introduction to object-oriented programming, and this friendly guide covers everything you need to know and nothing you don't. You'll write your first program by the end of Chapter 1. C++ For Dummies, 6th Edition, helps you understand C++ programming from the ground up. It's full of examples to show you how things work, and it even explains "why", so you understand how the pieces fit together. And the bonus CD includes a special code editor, an update GNU compiler, and all source code from

Blogging For Dummies

CERN Document Server

Gardner, Susannah

2012-01-01

This proven bestseller is fully updated and better than ever! Now in its fourth edition, Blogging For Dummies is fully updated and more practical than ever for today's bloggers. Whether you're just beginning or are already a full-tilt blogging maven, you'll find the up-to-date information you need in these friendly pages. Want to integrate your blog with social media? Jump into the fast-moving world of microblogging on Twitter or Tumblr? Choose which blogging software to use? Optimize your current blog for search? This detailed book guide covers it all, and then some. Buy the book, build a bet

Surface for dummies

CERN Document Server

Rathbone, Andy

2014-01-01

Make Microsoft's Surface work-and play-just the way you want it to Microsoft's Surface tablet has the features and personality you're looking for, with a robust environment for business computing that doesn't skimp on fun. Surface for Dummies, 2nd Edition explains how Windows 8.1 Pro and Windows RT differ, and helps you decide which Surface model is best for you. Step by step, this book walks you through both the hardware and software features of the Surface, including the touch cover and type cover, Windows RT and Windows 8.1 Pro operating systems, and the coveted Office Home & Student 2013 s

Ajax for dummies

CERN Document Server

Holzner, Steve

2006-01-01

Ajax is short for "Asynchronous JavaScript+CSS+DOM+XMLHttpRequest." Even if you weren't intimidated before, that tidbit is probably enough to make you reach for the Excedrin. Just reach for Ajax For Dummies instead. With screen shots, actual code and explanations, and live Web sites where you can see Ajax applications doing their thing, it will have you using Ajax to create Web applications that look an act like desktop applications in no time. With Ajax, you can speed up and clean up your Web applications. Shoppers at your online store can fill their carts without waiting for multiple page re

French For Dummies

CERN Document Server

Erotopoulos; Williams, Michelle M; Wenzel, Dominique

2011-01-01

The fast, informal way to learn to speak French French is known as perhaps the most beautiful of all languages. Listen to someone speak French-sure, you don't have a clue what they're saying, but aren't you enraptured by the sound of it? French is a beautiful language but quite difficult to learn. Whether you need to learn the language for a French class, or you travel overseas for business or leisure, this revised edition of French for Dummies can help. Written in an easy-to-follow format, it gives you just what you need for basic communication in FrenchExpanded coverage of necessary grammar,

Macs for dummies

CERN Document Server

Baig, Edward C

2014-01-01

Get the most out of your Mac with this comprehensive guide Macs For Dummies, 13th Edition is the ultimate guide to your Mac, fully updated to include information about the latest updates. The book walks you through troubleshooting, syncing mobile devices, integrating Windows, and more, so you can take advantage of everything Macs have to offer. Whether you're a new user, a recent convert, or you just want to get the most out of your Mac, this book puts all the information you need in one place. Discover what makes Macs superior computing machines. Learn the basics, from mastering the Dock and

Load Express Analysis of the Car Running Against the Bumps in the Road

Directory of Open Access Journals (Sweden)

Yu. N. Baryshnikov

2014-01-01

Full Text Available In many fields of technology when calculating the strength there are options available to choose design cases and loads in compliance with different operating conditions. In the automotive industry there are no such standards yet. This is due to both a variety of operating conditions, and a complexity of calculating the actual loads.K. Ert`s article is considered to be a pioneering work in this regard. There the author makes a hypothesis of the linear dependence of torque acting on the car, and of the height of bumps in the road. All formulas were obtained for vehicles with the leaf spring suspensions. An appearing entire class of new cars made it necessary to generalize the experience.This paper proposes an engineering method for calculating the vertical loads acting on the car when bumping in the road. We derive general formulas to calculate the height of the road bumps (irregularities on the way of a running car with various types of suspension. A dump truck BELAZ with various types nonlinear of suspension has been used to test the obtained formulas. The results analysis has shown that under equal conditions a car with dependent rear suspension will bear the lower loads than its prototype with a different type of suspension.The paper presents the relationships between the hights of bumps, which cause an equivalent load when different wheels bump against them. It shows a relation between the loads acting on the car when bumping against the same road irregularity by different wheels. The practical significance of the equations is the possibility to calculate loads in various cases in the road using the one-test results. A comparative results analysis of analytical calculation of loads and numerical experiments is based on the nonlinear model of the vehicle.The proposed method is an effective tool for the rapid analysis of loads in the design and fine-tuning the car.

Business statistics for dummies

CERN Document Server

Anderson, Alan

2013-01-01

Score higher in your business statistics course? Easy. Business statistics is a common course for business majors and MBA candidates. It examines common data sets and the proper way to use such information when conducting research and producing informational reports such as profit and loss statements, customer satisfaction surveys, and peer comparisons. Business Statistics For Dummies tracks to a typical business statistics course offered at the undergraduate and graduate levels and provides clear, practical explanations of business statistical ideas, techniques, formulas, and calculations, w

The 1600 Å Emission Bump in Protoplanetary Disks: A Spectral Signature of H2O Dissociation

Science.gov (United States)

France, Kevin; Roueff, Evelyne; Abgrall, Hervé

2017-08-01

The FUV continuum spectrum of many accreting pre-main sequence stars, Classical T Tauri Stars (CTTSs), does not continue smoothly from the well-studied Balmer continuum emission in the NUV, suggesting that additional processes contribute to the short-wavelength emission in these objects. The most notable spectral feature in the FUV continuum of some CTTSs is a broad emission approximately centered at 1600 Å, which has been referred to as the “1600 Å Bump.” The origin of this feature remains unclear. In an effort to better understand the molecular properties of planet-forming disks and the UV spectral properties of accreting protostars, we have assembled archival FUV spectra of 37 disk-hosting systems observed by the Hubble Space Telescope-Cosmic Origins Spectrograph. Clear 1600 Å Bump emission is observed above the smooth, underlying 1100-1800 Å continuum spectrum in 19/37 Classical T Tauri disks in the HST-COS sample, with the detection rate in transition disks (8/8) being much higher than that in primordial or non-transition sources (11/29). We describe a spectral deconvolution analysis to separate the Bump (spanning 1490-1690 Å) from the underlying FUV continuum, finding an average Bump luminosity L(Bump) ≈ 7 × 1029 erg s-1. Parameterizing the Bump with a combination of Gaussian and polynomial components, we find that the 1600 Å Bump is characterized by a peak wavelength λ o = 1598.6 ± 3.3 Å, with FWHM = 35.8 ± 19.1 Å. Contrary to previous studies, we find that this feature is inconsistent with models of H2 excited by electron -impact. We show that this Bump makes up between 5%-50% of the total FUV continuum emission in the 1490-1690 Å band and emits roughly 10%-80% of the total fluorescent H2 luminosity for stars with well-defined Bump features. Energetically, this suggests that the carrier of the 1600 Å Bump emission is powered by Lyα photons. We argue that the most likely mechanism is Lyα-driven dissociation of H2O in the inner disk, r �

Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

CERN Document Server

INSPIRE-00219560; Moser, H.-G.; Nisius, R.; Richter, R.H.; Terzo, S.; Weigell, P.

2014-01-01

We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\\mu$m thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of $5\\times 10^{15}$ \

Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

Energy Technology Data Exchange (ETDEWEB)

Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

2017-07-27

Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

International Nuclear Information System (INIS)

Liu, X.W.; Plumbridge, W.J.

2003-01-01

The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

Life story chapters, specific memories and the reminiscence bump

DEFF Research Database (Denmark)

Thomsen, Dorthe Kirkegaard; Pillemer, David B.; Ivcevic, Zorana

2011-01-01

Theories of autobiographical memory posit that extended time periods (here termed chapters) and memories are organised hierarchically. If chapters organise memories and guide their recall, then chapters and memories should show similar temporal distributions over the life course. Previous research...... are over-represented at the beginning of chapters. Potential connections between chapters and the cultural life script are also examined. Adult participants first divided their life story into chapters and identified their most positive and most negative chapter. They then recalled a specific memory from...... demonstrates that positive but not negative memories show a reminiscence bump and that memories cluster at the beginning of extended time periods. The current study tested the hypotheses that (1) ages marking the beginning of positive but not negative chapters produce a bump, and that (2) specific memories...

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

Energy Technology Data Exchange (ETDEWEB)

Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

2014-01-21

Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

Innovative presentations for dummies

CERN Document Server

Anthony, Ray

2014-01-01

Be the speaker they follow with breakthrough innovative presentations Innovative Presentations For Dummies is a practical guide to engaging your audience with superior, creative, and ultra-compelling presentations. Using clear language and a concise style, this book goes way beyond PowerPoint to enable you to reimagine, reinvent, and remake your presentations. Learn how to stimulate, capture, and hold your audience in the palm of your hand with sound, sight, and touch, and get up to speed on the latest presentation design methods that make you a speaker who gets audiences committed and acting

Data science for dummies

CERN Document Server

Pierson, Lillian

2015-01-01

Discover how data science can help you gain in-depth insight into your business - the easy way! Jobs in data science abound, but few people have the data science skills needed to fill these increasingly important roles in organizations. Data Science For Dummies is the perfect starting point for IT professionals and students interested in making sense of their organization's massive data sets and applying their findings to real-world business scenarios. From uncovering rich data sources to managing large amounts of data within hardware and software limitations, ensuring consistency in report

Access 2013 for dummies

CERN Document Server

Ulrich Fuller, Laurie

2013-01-01

The easy guide to Microsoft Access returns with updates on the latest version! Microsoft Access allows you to store, organize, view, analyze, and share data; the new Access 2013 release enables you to build even more powerful, custom database solutions that integrate with the web and enterprise data sources. Access 2013 For Dummies covers all the new features of the latest version of Accessand serves as an ideal reference, combining the latest Access features with the basics of building usable databases. You'll learn how to create an app from the Welcome screen, get support

Business Plans For Dummies

CERN Document Server

Tiffany, Paul; Barrow, Colin

2011-01-01

A full updated and extended second edition of an established UK bestseller Business Plans For Dummies 2nd Edition features new and updated information on formulating a solid business plan to build a secure business - even in an economic downturn. Complete with a brand new business plan template to get you started this expert guide offers fresh advice on reading the competitive marketplace and assessing your business in the current economic climate. It walks you step-by-step through every aspect of planning achievable business goals and diversification strategies, identifying trends, exploring

Geometry essentials for dummies

CERN Document Server

Ryan, Mark

2011-01-01

Just the critical concepts you need to score high in geometry This practical, friendly guide focuses on critical concepts taught in a typical geometry course, from the properties of triangles, parallelograms, circles, and cylinders, to the skills and strategies you need to write geometry proofs. Geometry Essentials For Dummies is perfect for cramming or doing homework, or as a reference for parents helping kids study for exams. Get down to the basics - get a handle on the basics of geometry, from lines, segments, and angles, to vertices, altitudes, and diagonals Conque

Calculus II For Dummies

CERN Document Server

Zegarelli, Mark

2012-01-01

An easy-to-understand primer on advanced calculus topics Calculus II is a prerequisite for many popular college majors, including pre-med, engineering, and physics. Calculus II For Dummies offers expert instruction, advice, and tips to help second semester calculus students get a handle on the subject and ace their exams. It covers intermediate calculus topics in plain English, featuring in-depth coverage of integration, including substitution, integration techniques and when to use them, approximate integration, and improper integrals. This hands-on guide also covers sequences and series, wit

French essentials for dummies

CERN Document Server

Lawless, Laura K

2011-01-01

Just the core concepts you need to write and speak French correctly If you have some knowledge of French and want to polish your skills, French Essentials For Dummies focuses on just the core concepts you need to communicate effectively. From conjugating verbs to understanding tenses, this easy-to-follow guide lets you skip the suffering and score high at exam time. French 101 - get the lowdown on the basics, from expressing dates and times to identifying parts of speech Gender matters - see how a noun's gender determines the articles, adjectives, and pronouns y

Access 2010 for dummies

CERN Document Server

Ulrich Fuller, Laurie

2010-01-01

A friendly, step-by-step guide to the Microsoft Office database application Access may be the least understood and most challenging application in the Microsoft Office suite. This guide is designed to help anyone who lacks experience in creating and managing a database learn to use Access 2010 quickly and easily. In the classic For Dummies tradition, the book provides an education in Access, the interface, and the architecture of a database. It explains the process of building a database, linking information, sharing data, generating reports, and much more.As the Micr

English Grammar For Dummies

CERN Document Server

Ward, Lesley J

2009-01-01

If you're confused by commas, perplexed by pronouns, and plain terrified by tenses, English Grammar For Dummies will put your fears to rest. Packed with expert guidance, it covers everything from sentence basics to rules even your English teacher didn't know - if you want to brush up on your grammar, this is the only guide you'll ever need. Discover how to: avoid common grammatical errors; get to grips with apostrophes; structure sentences correctly; use verbs and find the right tense; and decide when to use slang or formal English.  

The AGB bump: a calibrator for core mixing

Directory of Open Access Journals (Sweden)

Bossini Diego

2015-01-01

Full Text Available The efficiency of convection in stars affects many aspects of their evolution and remains one of the key-open questions in stellar modelling. In particular, the size of the mixed core in core-He-burning low-mass stars is still uncertain and impacts the lifetime of this evolutionary phase and, e.g., the C/O profile in white dwarfs. One of the known observables related to the Horizontal Branch (HB and Asymptotic Giant Branch (AGB evolution is the AGB bump. Its luminosity depends on the position in mass of the helium-burning shell at its first ignition, that is affected by the extension of the central mixed region. In this preliminary work we show how various assumptions on near-core mixing and on the thermal stratification in the overshooting region affect the luminosity of the AGB bump, as well as the period spacing of gravity modes in core-He-burning models.

Laser welding of vas deferens in rodents: initial experience with fluid solders.

Science.gov (United States)

Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

1998-01-01

This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

Interfacial stresses in a bi-material assembly with a compliant bonding layer

International Nuclear Information System (INIS)

Suhir, E; Vujosevic, M

2008-01-01

We examine an elongated bi-material adhesively bonded or soldered assembly with a continuous compliant attachment (bonding layer). The assembly is subjected to external tensile forces or to bending moments applied to one of the assembly components. We develop simple predictive analytical ('mathematical') models for the evaluation of interfacial shearing (in the case of external tensile forces) and peeling (in the case of external bending moments) stresses and strains in the bonding material. The developed models can be helpful in stress-strain analyses of assemblies of the type in question and particularly for printed-circuit-board (PCB)/surface-mounted-device (SMD) assemblies employed in electronic packaging. These models enable one to particularly evaluate the maximum interfacial stresses in the bonding material from the predicted or measured strains in the PCB in the vicinity of but still outside the surface-mounted package

Comparison of implant-abutment interface misfits after casting and soldering procedures.

Science.gov (United States)

Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

2014-04-01

The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

Characterizing performances of solder paste printing process at flexible manufacturing lines

International Nuclear Information System (INIS)

Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

2015-01-01

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

Characterizing performances of solder paste printing process at flexible manufacturing lines

Energy Technology Data Exchange (ETDEWEB)

Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

2015-02-03

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

Science.gov (United States)

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook

2009-01-01

A thick Cu column based double-bump flip chip structure is one of the promising alternatives for fine pitch flip chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip chip assemblies was investigated, and the failure mechanism was analyzed through the correlation of T/C test and the finite element analysis (FEA) results. After 1000 thermal cycles, T/C failures occurred at some Cu/SnAg bumps located at the edge and corner of chips. Scanning acoustic microscope analysis and scanning electron microscope observations indicated that the failure site was the Cu column/Si chip interface. It was identified by a FEA where the maximum stress concentration was located during T/C. During T/C, the Al pad between the Si chip and a Cu column bump was displaced due to thermomechanical stress. Based on the low cycle fatigue model, the accumulation of equivalent plastic strain resulted in thermal fatigue deformation of the Cu column bumps and ultimately reduced the thermal cycling lifetime. The maximum equivalent plastic strains of some bumps at the chip edge increased with an increased number of thermal cycles. However, equivalent plastic strains of the inner bumps did not increase regardless of the number of thermal cycles. In addition, the z-directional normal plastic strain ɛ22 was determined to be compressive and was a dominant component causing the plastic deformation of Cu/SnAg double bumps. As the number of thermal cycles increased, normal plastic strains in the perpendicular direction to the Si chip and shear strains were accumulated on the Cu column bumps at the chip edge at low temperature region. Thus it was found that the Al pad at the Si chip/Cu column interface underwent thermal fatigue deformation by compressive normal strain and the contact loss by displacement failure of the Al pad, the main T/C failure mode of the Cu/SnAg flip chip assembly, then occurred at the Si chip/Cu column interface shear strain deformation

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Science.gov (United States)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

Blender For Dummies

CERN Document Server

van Gumster, Jason

2011-01-01

The exciting new book on the exciting new Blender 2.5! If you want to design 3D animation, here's your chance to jump in with both feet, free software, and a friendly guide at your side! Blender For Dummies, 2nd Edition is the perfect introduction to the popular, open-source, Blender 3D animation software, specifically the revolutionary new Blender 2.5. Find out what all the buzz is about with this easy-access guide. Even if you?re just beginning, you'll learn all the Blender 2.5 ropes, get the latest tips, and soon start creating 3D animation that dazzles.Walks you through what you need to kn

Thermal stress in a bi-material assembly with a 'piecewise-continuous' bonding layer: theorem of three axial forces

International Nuclear Information System (INIS)

Suhir, E

2009-01-01

interfacial stresses). The maximum interfacial shearing stress in the assembly with the inhomogeneous bonding layer turned out to be only about 30% of the maximum shearing stress in an assembly with a homogeneous bonding layer having throughout its length the same modulus as the bonding material in the mid-portion of an assembly with an inhomogeneous bond. We would like to emphasize that the inhomogeneous bonding material addressed in this analysis does not necessarily have to be an epoxy one. Many other bonding materials with different moduli in the mid-portion and at the peripheral portions of the assembly could be considered for various practical applications. For instance, a high-modulus solder material such as, say, a tin-silver-copper (SAC) solder can be employed in the mid-portion of an assembly and a low-modulus solder (e.g. an indium-based alloy) at its peripheral portions. In other applications a high-modulus solder material could be considered for the mid-portion of the assembly and a low-modulus epoxy adhesive at its peripheral portions. We would also like to point out that the developed concept can be easily generalized for the situations when the bonding material is not a continuous one, but is of the ball-grid-array (BGA) or a pad-grid-array (PGA) type. Our concept could also be easily generalized for a two-dimensional case, for the situation when bending deformations should be accounted for, for non-uniform distribution of temperature (i.e. for assemblies with temperature gradients in the through-thickness and/or in the longitudinal direction), for situations when time-dependent effects (visco-elasticity, creep, stress relaxation) in the bonding material are important and for numerous other more complicated and practically important situations that might be encountered in engineering practice.

Aqueous-based thick photoresist removal for bumping applications

Science.gov (United States)

Moore, John C.; Brewer, Alex J.; Law, Alman; Pettit, Jared M.

2015-03-01

Cleaning processes account for over 25% of processing in microelectronic manufacturing [1], suggesting electronics to be one of the most chemical intensive markets in commerce. Industry roadmaps exist to reduce chemical exposure, usage, and waste [2]. Companies are encouraged to create a safer working environment, or green factory, and ultimately become certified similar to LEED in the building industry [3]. A significant step in this direction is the integration of aqueous-based photoresist (PR) strippers which eliminate regulatory risks and cut costs by over 50%. One of the largest organic solvent usages is based upon thick PR removal during bumping processes [4-6]. Using market projections and the benefits of recycling, it is estimated that over 1,000 metric tons (mt) of residuals originating from bumping processes are incinerated or sent to a landfill. Aqueous-based stripping would eliminate this disposal while also reducing the daily risks to workers and added permitting costs. Positive-tone PR dissolves in aqueous strippers while negative-tone systems are lifted-off from the substrate, bumps, pillars, and redistribution layers (RDL). While the wafers are further processed and rinsed, the lifted-off PR is pumped from the tank, collected onto a filter, and periodically back-flushed to the trash. The PR solids become a non-hazardous plastic waste while the liquids are mixed with the developer stream, neutralized, filtered, and in most cases, disposed to the sewer. Regardless of PR thickness, removal processes may be tuned to perform in <15min, performing at rates nearly 10X faster than solvents with higher bath lives. A balanced formula is safe for metals, dielectrics, and may be customized to any fab.

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

Science.gov (United States)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Science.gov (United States)

Wei, Helin; Wang, Kuisheng

2011-11-01

Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

Do You Hear a Bump or a Hole?

DEFF Research Database (Denmark)

Serafin, Stefania; Turchet, Luca; Nordahl, Rolf

2010-01-01

In this paper, we present a preliminary experiment whose goal is to assess the role of temporal aspects in sonically simulating the act of walking on a bump or a hole. In particular, we investigate whether the timing between heel and toe and the timing between footsteps affects the perception...

Dropwise condensation on hydrophobic bumps and dimples

Science.gov (United States)

Yao, Yuehan; Aizenberg, Joanna; Park, Kyoo-Chul

2018-04-01

Surface topography plays an important role in promoting or suppressing localized condensation. In this work, we study the growth of water droplets on hydrophobic convex surface textures such as bumps and concave surface textures such as dimples with a millimeter scale radius of curvature. We analyze the spatio-temporal droplet size distribution under a supersaturation condition created by keeping the uniform surface temperature below the dew point and show its relationship with the sign and magnitude of the surface curvature. In particular, in contrast to the well-known capillary condensation effect, we report an unexpectedly less favorable condensation on smaller, millimeter-scale dimples where the capillary condensation effect is negligible. To explain these experimental results, we numerically calculated the diffusion flux of water vapor around the surface textures, showing that its magnitude is higher on bumps and lower on dimples compared to a flat surface. We envision that our understanding of millimetric surface topography can be applied to improve the energy efficiency of condensation in applications such as water harvesting, heating, ventilation, and air conditioning systems for buildings and transportation, heat exchangers, thermal desalination plants, and fuel processing systems.

The 1600 Å Emission Bump in Protoplanetary Disks: A Spectral Signature of H{sub 2}O Dissociation

Energy Technology Data Exchange (ETDEWEB)

France, Kevin [Laboratory for Atmospheric and Space Physics, University of Colorado, 600 UCB, Boulder, CO 80309 (United States); Roueff, Evelyne; Abgrall, Hervé, E-mail: kevin.france@colorado.edu [LERMA, Observatoire de Paris, PSL Research University, CNRS, Sorbonne Universités, UPMC Univ. Paris 06, F-92190, Meudon (France)

2017-08-01

The FUV continuum spectrum of many accreting pre-main sequence stars, Classical T Tauri Stars (CTTSs), does not continue smoothly from the well-studied Balmer continuum emission in the NUV, suggesting that additional processes contribute to the short-wavelength emission in these objects. The most notable spectral feature in the FUV continuum of some CTTSs is a broad emission approximately centered at 1600 Å, which has been referred to as the “1600 Å Bump.” The origin of this feature remains unclear. In an effort to better understand the molecular properties of planet-forming disks and the UV spectral properties of accreting protostars, we have assembled archival FUV spectra of 37 disk-hosting systems observed by the Hubble Space Telescope -Cosmic Origins Spectrograph. Clear 1600 Å Bump emission is observed above the smooth, underlying 1100–1800 Å continuum spectrum in 19/37 Classical T Tauri disks in the HST -COS sample, with the detection rate in transition disks (8/8) being much higher than that in primordial or non-transition sources (11/29). We describe a spectral deconvolution analysis to separate the Bump (spanning 1490–1690 Å) from the underlying FUV continuum, finding an average Bump luminosity L (Bump) ≈ 7 × 10{sup 29} erg s{sup −1}. Parameterizing the Bump with a combination of Gaussian and polynomial components, we find that the 1600 Å Bump is characterized by a peak wavelength λ {sub o} = 1598.6 ± 3.3 Å, with FWHM = 35.8 ± 19.1 Å. Contrary to previous studies, we find that this feature is inconsistent with models of H{sub 2} excited by electron -impact. We show that this Bump makes up between 5%–50% of the total FUV continuum emission in the 1490–1690 Å band and emits roughly 10%–80% of the total fluorescent H{sub 2} luminosity for stars with well-defined Bump features. Energetically, this suggests that the carrier of the 1600 Å Bump emission is powered by Ly α photons. We argue that the most likely mechanism

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

Science.gov (United States)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Science.gov (United States)

Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

2018-03-01

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

Science.gov (United States)

Tikale, Sanjay; Prabhu, K. Narayan

2018-05-01

The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

International Nuclear Information System (INIS)

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

2015-01-01

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

Energy Technology Data Exchange (ETDEWEB)

Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

2015-11-25

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Excel 2003 for dummies

CERN Document Server

Harvey, Greg

2013-01-01

Every time you turn around, you run into Excel. It's on yourPC at work. It's on your PC at home. You get Excel files fromyour boss. Wouldn't you like to understand this powerfulMicrosoft Office spreadsheet program, once and for all? Now, youcan crunch financial data, add sparkle to presentations, convertstatic lists of numbers into impressive charts, and discover whatall the shouting's about regarding databases, formulas, andcells. You may even decide that getting organized with a goodspreadsheet is downright useful and fun! Flip open Excel 2003 For Dummies, and you'llquickly start getting th

Office 2013 for dummies

CERN Document Server

Wang, Wallace

2013-01-01

Office 2013 For Dummies is the key to your brand new Office! Packed with straightforward, friendly instruction, this update to one of the bestselling Office books of all time gets you thoroughly up to speed and helps you learn how to take full advantage of the new features in Office 2013. After coverage of the fundamentals, you'll discover how to spice up your Word documents, edit Excel spreadsheets and create formulas, add pizazz to your PowerPoint presentation, and much more.Helps you harness the power of all five Office 2013 applications: Word, Excel, PowerPoint,

StumbleUpon for dummies

CERN Document Server

Olenski, Steve

2013-01-01

Discover new and interesting online content based on your interests! StumbleUpon helps you discover new and interesting content on the Internet based on your specific interests. With this helpful For Dummies guide, you will learn to complete a profile that alerts StumbleUpon what topics interest you and assists in making your online perusing interesting and productive. Coverage explains how the Stumble button allows StumbleUpon to learn more about you and what type of content you like to view and it also helps that particular piece of content turn up higher in other users' searches.Gets you s

Data mining for dummies

CERN Document Server

Brown, Meta S

2014-01-01

Delve into your data for the key to success Data mining is quickly becoming integral to creating value and business momentum. The ability to detect unseen patterns hidden in the numbers exhaustively generated by day-to-day operations allows savvy decision-makers to exploit every tool at their disposal in the pursuit of better business. By creating models and testing whether patterns hold up, it is possible to discover new intelligence that could change your business''s entire paradigm for a more successful outcome. Data Mining for Dummies shows you why it doesn''t take a data scientist to gain

Pre-Calculus For Dummies

CERN Document Server

Kuang, Yang

2012-01-01

The fun and easy way to learn pre-calculus Getting ready for calculus but still feel a bit confused? Have no fear. Pre-Calculus For Dummies is an un-intimidating, hands-on guide that walks you through all the essential topics, from absolute value and quadratic equations to logarithms and exponential functions to trig identities and matrix operations. With this guide's help you'll quickly and painlessly get a handle on all of the concepts - not just the number crunching - and understand how to perform all pre-calc tasks, from graphing to tackling proofs. You'll also get a new appreciation for

TypePad For Dummies

CERN Document Server

Nelson, Melanie

2010-01-01

TypePad for Dummies will be on guiding readers through the technical tasks necessary for starting, using and customizing a TypePad blog. It will comprehensively explain choosing the right TypePad membership plan, singing up, configuring, using and customizing a blog using the TypePad system. It will also include: Illustrations from real-world blogs with screenshots and specific examples that bring the book's concepts and ideas to life.; Step-by-step tutorials that will walk readers through the process of signing up for a new TypePad blog and getting down the business of publishing their conten

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

DEFF Research Database (Denmark)

Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

2017-01-01

with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

Speed Bump Detection Using Accelerometric Features: A Genetic Algorithm Approach.

Science.gov (United States)

Celaya-Padilla, Jose M; Galván-Tejada, Carlos E; López-Monteagudo, F E; Alonso-González, O; Moreno-Báez, Arturo; Martínez-Torteya, Antonio; Galván-Tejada, Jorge I; Arceo-Olague, Jose G; Luna-García, Huizilopoztli; Gamboa-Rosales, Hamurabi

2018-02-03

Among the current challenges of the Smart City, traffic management and maintenance are of utmost importance. Road surface monitoring is currently performed by humans, but the road surface condition is one of the main indicators of road quality, and it may drastically affect fuel consumption and the safety of both drivers and pedestrians. Abnormalities in the road, such as manholes and potholes, can cause accidents when not identified by the drivers. Furthermore, human-induced abnormalities, such as speed bumps, could also cause accidents. In addition, while said obstacles ought to be signalized according to specific road regulation, they are not always correctly labeled. Therefore, we developed a novel method for the detection of road abnormalities (i.e., speed bumps). This method makes use of a gyro, an accelerometer, and a GPS sensor mounted in a car. After having the vehicle cruise through several streets, data is retrieved from the sensors. Then, using a cross-validation strategy, a genetic algorithm is used to find a logistic model that accurately detects road abnormalities. The proposed model had an accuracy of 0.9714 in a blind evaluation, with a false positive rate smaller than 0.018, and an area under the receiver operating characteristic curve of 0.9784. This methodology has the potential to detect speed bumps in quasi real-time conditions, and can be used to construct a real-time surface monitoring system.

Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

International Nuclear Information System (INIS)

Li, Yi; Lim, Adeline B.Y.; Luo, Kaiming; Chen, Zhong; Wu, Fengshun; Chan, Y.C.

2016-01-01

The evolution of microstructure in Cu/In–48Sn/Cu solder bump interconnects at a current density of 0.7 × 10"4 A/cm"2 and ambient temperature of 55 °C has been investigated. During electromigration, tin (Sn) atoms migrated from cathode to anode, while indium (In) atoms migrated from anode to cathode. As a result, the segregation of the Sn-rich phase and the In-rich phase occurred. A Sn-rich layer and an In-rich layer were formed at the anode and the cathode, respectively. The accumulation rate of the Sn-rich layer was 1.98 × 10"−"9 cm/s. The atomic flux of Sn was calculated to be approximately 1.83 × 10"1"3 atoms/cm"2s. The product of the diffusivity and the effective charge number of Sn was determined to be approximately 3.13 × 10"−"1"0 cm"2/s. The In–48Sn/Cu IMC showed a two layer structure of Cu_6(Sn,In)_5, adjacent to the Cu, and Cu(In,Sn)_2, adjacent to the solder. Both the cathode IMC and the anode IMC thickened with increasing electromigration time. The IMC evolution during electromigration was strongly influenced by the migration of Cu atoms from cathode to anode and the accumulation of Sn-rich and In-rich layers. During electromigration, the Cu(In,Sn)_2 at the cathode interface thickened significantly, with a spalling characteristic, due to the accumulation of In-rich layer and the migration of Cu atoms - while the Cu(In,Sn)_2 at the anode interface reduced obviously, due to the accumulation of Sn-rich layer. The mechanism of electromigration-induced failure in Cu/In–48Sn/Cu interconnects was the cathode Cu dissolution-induced solder melt, which led to the rapid consumption of Cu in the cathode pad during liquid-state electromigration and this finally led to the failure. - Highlights: • Sn migrates to the anode, while In migrates to the cathode, during EM in Cu/In–48Sn/Cu. • The atomic flux of Sn has been calculated. • The interfacial IMCs were identified as: Cu_6(Sn,In)_5 + Cu(In,Sn)_2. • The interface evolution is strongly

Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

Science.gov (United States)

Sorg, B S; Welch, A J

2001-01-01

Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

3D Printing of Ball Grid Arrays

Science.gov (United States)

Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

International Nuclear Information System (INIS)

Luay Hussain

2002-01-01

Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

Thermal decomposition of solder flux activators under simulated wave soldering conditions

DEFF Research Database (Denmark)

Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

/methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

Development of high melting point, environmentally friendly solders, using the calphad approach

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2008-01-01

An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

Energy Technology Data Exchange (ETDEWEB)

Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

1997-10-01

Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

Science.gov (United States)

Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

2017-07-01

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

International Nuclear Information System (INIS)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-01-01

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

Science.gov (United States)

Han, Jing; Tan, Shihai; Guo, Fu

2018-01-01

Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

WorldSID - an international project for the harmonisation and improvement of side impact dummies

Energy Technology Data Exchange (ETDEWEB)

Page, M. [Centre Europeen d' Etudes de Securite et d' Analyse des Risques (France); Cesari, D. [Institut National de Recherche sur les Transports et leur Securite, Arcueil (France); Hautmann, E. [BMW Group, Muenchen (Germany); Scherer, R. [Ford-Werke AG, Koeln (Germany); Uchimura, Takahiko [Nissan Motor Co. Ltd., Tokyo (Japan); Kostyniuk, G.W. [DaimlerChrysler (United States); Asakawa, Kazuhito [JAMA (Japan); Bortenschlager, K. [Audi AG, Ingoldstadt (Germany)

2001-07-01

In order to substantiate the efficiency of side impact protection measures, various side impact dummies are legally required in various countries. Moreover, these side impact dummies do not meet the currently requested bio-fidelity requirements. The target of the WorldSID project is to develop a new 50 per cent side impact dummy with at least good to excellent biofidelity, which will be used all over the world in all side impact test procedures, and thus will considerably contribute to harmonisation. Contents of the lecture: (a) Intention, initialisation, organisation of the project. (b) Technical and bio-mechanical specifications, design. (c) Prototype - first impressions of test, handling.. (d) Further project plans, targets. (orig.)

Fabrication of the wing and vertical target dummy armour prototypes of the ITER divertor

Energy Technology Data Exchange (ETDEWEB)

Grattarola, M. E-mail: gratta@ari.ansaldo.it; Bet, M.; Biagiotti, B.; Gandini, G.; Merola, M.; Ottonello, G.B.; Riccardi, B.; Vieider, G.; Zacchia, F

2000-11-01

The dummy armour prototypes are identical to the reference components in terms of geometry, cooling circuit and material except for the armour material, which is replaced by an equivalent thickness of copper alloy. The main objectives of the dummy armour prototypes are the demonstration of the overall engineering concept of the Divertor, the integration in a 3 deg. cassette together with components manufactured by the other ITER Home Teams and the successive thermo-hydraulic tests on the whole Divertor module. This paper describes the realization of both the wing and the vertical target dummy armour prototypes focusing on the critical aspects of the fabrication and their impact on a further industrialization of the components.

Fabrication of the wing and vertical target dummy armour prototypes of the ITER divertor

International Nuclear Information System (INIS)

Grattarola, M.; Bet, M.; Biagiotti, B.; Gandini, G.; Merola, M.; Ottonello, G.B.; Riccardi, B.; Vieider, G.; Zacchia, F.

2000-01-01

The dummy armour prototypes are identical to the reference components in terms of geometry, cooling circuit and material except for the armour material, which is replaced by an equivalent thickness of copper alloy. The main objectives of the dummy armour prototypes are the demonstration of the overall engineering concept of the Divertor, the integration in a 3 deg. cassette together with components manufactured by the other ITER Home Teams and the successive thermo-hydraulic tests on the whole Divertor module. This paper describes the realization of both the wing and the vertical target dummy armour prototypes focusing on the critical aspects of the fabrication and their impact on a further industrialization of the components

NSRL Extraction Bump Control in the Booster

International Nuclear Information System (INIS)

Brennan, L.

2008-01-01

Due to inadequacies in the user interface of the booster orbit control system, a number of new tools were developed. The first priority was an accurate calculation of the winding currents given specific displacements at each extraction septa. Next, the physical limits of the power supplies (±600 amps) needed to be taken into account. In light of this limit, a system is developed that indicates to the user what the allowed values of one bump parameter are once the other two have been specified. Finally, techniques are developed to account for the orbit behavior once power supplies are requested to exceed their ±600 amp limit. This includes a recalculation of bump parameters and a calculation of the amplitude of the residuals. Following this, possible areas for further development are outlined. These techniques were computationally developed in Mathematica and tested in the Methodical Accelerator Design (MAD) program before they were implemented into the control system. At the end, a description of the implementation of these techniques in a new interface is described. This includes a depiction of the appearance and functionality of the graphical user interface, a description of the input and output flow, and an outline of how each important calculation is performed

Revised masses for the double-mode and bump Cepheids

International Nuclear Information System (INIS)

Cox, A.N.; Deupree, R.G.; King, D.S.; Hodson, S.W.

1977-01-01

We consider Population I Cepheids with two pulsation modes and those with a bump in the light and velocity curves. Model envelopes for these Cepheids have been altered in several ways in an attempt in remove the discrepancy between masses predicted from the evolution theory mass-luminosity relation an th masses predicted from pulsation theory. One of these ways, the inclusion of rotation, does not change the period ratio of the first overtone mode to the fundamental mode enough to resolve this mass discrepancy. Another way, the inclusion of a helium- (or metal-) rich layer mixed by convection and pulsation between the stellar surface and 70,000 K decreases this period ratio appreciably. The ratio of the second overtone period to the fundamental period is also reduced with this structure. The masses of the double-mode Cepheids U TrA and V367 Sct and the bump Cepheids U Sgr and β Dor are found to be much closer to the masses derived from stellar evolution theory

Biomimetic Water-Collecting Fabric with Light-Induced Superhydrophilic Bumps.

Science.gov (United States)

Wang, Yuanfeng; Wang, Xiaowen; Lai, Chuilin; Hu, Huawen; Kong, Yeeyee; Fei, Bin; Xin, John H

2016-02-10

To develop an efficient water-collecting surface that integrates both fast water-capturing and easy drainage properties is of high current interest for addressing global water issues. In this work, a superhydrophobic surface was fabricated on cotton fabric via manipulation of both the surface roughness and surface energy. This was followed by a subsequent spray coating of TiO2 nanosol that created light-induced superhydrophilic bumps with a unique raised structure as a result of the interfacial tension of the TiO2 nanosol sprayed on the superhydrophobic fiber surface. These raised TiO2 bumps induce both a wettability gradient and a shape gradient, synergistically accelerating water coalescence and water collection. The in-depth study revealed that the quantity and the distribution of the TiO2 had a significant impact on the final water collection efficiency. This inexpensive and facilely fabricated fabric biomimicks the desert beetle's back and spider silk, which are capable of fog harvesting without additional energy consumption.

Photoshop CS5 for dummies

CERN Document Server

Bauer, Peter

2010-01-01

The bestselling guide to the leading image-editing software, fully updated Previous editions of this For Dummies guide have sold more 650,000 copies. Richly illustrated in full color, this edition covers all the updates in the newest version of Photoshop, the gold standard for image-editing programs. Used by professional photographers, graphic designers, and Web designers as well as hobbyists, Photoshop has more than four million users worldwide.Photoshop is the image-editing software preferred by professional photographers and designers around the world; the latest ver

Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Energy Technology Data Exchange (ETDEWEB)

Hamm, Randy; Peterson, Kenneth A.

2015-10-01

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

Improvement of the auto wire feeder machine in a de-soldering process

Directory of Open Access Journals (Sweden)

Niramon Nonkhukhetkhong

2016-10-01

Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

iMac for dummies

CERN Document Server

Chambers, Mark L

2012-01-01

The bestselling guide to the ultimate all-in-one computer—now updated and revised throughout! If you're looking for speed, performance, and power, the iMac is the ultimate all-in-one computer. From its superior performance, powerful operating system, and amazing applications, the iMac is one awesome machine, and the fun, friendly, and approachable style of iMac For Dummies is an ideal way to get started with the basics. You'll learn the fundamentals of the iMac including setting up and customizing your iMac and the software that comes with it, importing files from your old computer, send

AARP laptops for dummies

CERN Document Server

Gookin, Dan

2011-01-01

Take technology with you wherever you go! Get a move on and learn to roam free with this mini guide to choosing and using a laptop. Packed with useful advice on picking a laptop, setting it up, managing power and peripherals, going online, and hitting the road, you'll learn to love your laptop with help from For Dummies. Whether this is your first laptop or a recent upgrade, you'll get the advice you need from laptop to lap-bottom here. Open the book and find:Tips for buying the right laptop for youA tour of your laptop and its featuresExp

Semantic web for dummies

CERN Document Server

Pollock, Jeffrey T

2009-01-01

Semantic Web technology is already changing how we interact with data on the Web. By connecting random information on the Internet in new ways, Web 3.0, as it is sometimes called, represents an exciting online evolution. Whether you're a consumer doing research online, a business owner who wants to offer your customers the most useful Web site, or an IT manager eager to understand Semantic Web solutions, Semantic Web For Dummies is the place to start! It will help you:Know how the typical Internet user will recognize the effects of the Semantic WebExplore all the benefits the data Web offers t

Flip Video for Dummies

CERN Document Server

Hutsko, Joe

2010-01-01

The full-color guide to shooting great video with the Flip Video camera. The inexpensive Flip Video camera is currently one of the hottest must-have gadgets. It's portable and connects easily to any computer to transfer video you shoot onto your PC or Mac. Although the Flip Video camera comes with a quick-start guide, it lacks a how-to manual, and this full-color book fills that void! Packed with full-color screen shots throughout, Flip Video For Dummies shows you how to shoot the best possible footage in a variety of situations. You'll learn how to transfer video to your computer and then edi

Apple Watch for dummies

CERN Document Server

Saltzman, Marc

2015-01-01

Your all-encompassing guide to the Apple Watch Are you an Apple Watch enthusiast and want to master all of its features to impress friends and intimidate enemies? Or perhaps you're a less-than-tech-savvy newcomer to the ""wearable"" craze and want to get the most out of it? In Apple Watch For Dummies, you'll discover how this incredible device does way more than simply tell time. Through hands-on, easy-to-follow instruction, you'll find out how to send and receive text messages and emails, use Siri, find movie times, access your favorite apps and get directions]. Plus, you'll get a handle on

CSS3 for dummies

CERN Document Server

Mueller, John Paul

2013-01-01

Get the most out of the new features in CSS3 Cascading Style Sheets (CSS3) boasts many new features that designers love. Things like better mobility, cleaner code, less maintenance, and basic interactivity without JavaScript are just a few. Get thoroughly up to speed on CSS3 with CSS3 For Dummies. Whether you're a web developer or designer with a lot or very little experience in HTML and CSS, or just want assistance applying it to multiple browser and mobile apps, this book delivers. Explore in depth how CSS3 effects and transforms work and how to use them for animation and interactivity. E

jQuery For Dummies

CERN Document Server

Beighley, Lynn

2010-01-01

Learn how jQuery can make your Web page or blog stand out from the crowd!. jQuery is free, open source software that allows you to extend and customize Joomla!, Drupal, AJAX, and WordPress via plug-ins. Assuming no previous programming experience, Lynn Beighley takes you through the basics of jQuery from the very start. You'll discover how the jQuery library separates itself from other JavaScript libraries through its ease of use, compactness, and friendliness if you're a beginner programmer. Written in the easy-to-understand style of the For Dummies brand, this book demonstrates how you can a

Technical Math For Dummies

CERN Document Server

Schoenborn, Barry

2010-01-01

Technical Math For Dummies is your one-stop, hands-on guide to acing the math courses you’ll encounter as you work toward getting your degree, certifacation, or�license in the skilled trades. You’ll get easy-to-follow, plain-English guidance on mathematical formulas and methods that professionals use every day in the automotive, health, construction, licensed trades, maintenance, and other trades. You’ll learn how to apply concepts of algebra, geometry, and trigonometry and their formulas related to occupational areas of study. Plus, you’ll find out how to perform basic arithmetic

Nexus One For Dummies

CERN Document Server

Gookin, Dan

2010-01-01

Exploit the full power of the revolutionary Google Nexus One superphone. Nexus One is Google's answer to Apple's iPhone and RIM's BlackBerry. Covering a range of how-to topics, from the most useful Nexus One features and tricks of the core applications, to techniques to get the most out of the device, Nexus One For Dummies is the practical user's guide to the Google Nexus One smartphone.: Uses full-color to showcase all the features of the Nexus One, approaching each from the point of view of the user who is new to the technology or discouraged with the scant documentation and online support;

Word 2013 for dummies

CERN Document Server

Gookin, Dan

2013-01-01

This bestselling guide to Microsoft Word is the first and last word on Word 2013 It's a whole new Word, so jump right into this book and learn how to make the most of it. Bestselling For Dummies author Dan Gookin puts his usual fun and friendly candor back to work to show you how to navigate the new features of Word 2013. Completely in tune with the needs of the beginning user, Gookin explains how to use Word 2013 quickly and efficiently so that you can spend more time working on your projects and less time trying to figure it all out. Walks you through the capabilit

NoSQL for dummies

CERN Document Server

Fowler, Adam

2015-01-01

Get up to speed on the nuances of NoSQL databases and what they mean for your organization This easy to read guide to NoSQL databases provides the type of no-nonsense overview and analysis that you need to learn, including what NoSQL is and which database is right for you. Featuring specific evaluation criteria for NoSQL databases, along with a look into the pros and cons of the most popular options, NoSQL For Dummies provides the fastest and easiest way to dive into the details of this incredible technology. You'll gain an understanding of how to use NoSQL databases for mission-critical enter

The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

Science.gov (United States)

Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

2015-12-01

Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

Speed Bump Detection Using Accelerometric Features: A Genetic Algorithm Approach

Directory of Open Access Journals (Sweden)

Jose M. Celaya-Padilla

2018-02-01

Full Text Available Among the current challenges of the Smart City, traffic management and maintenance are of utmost importance. Road surface monitoring is currently performed by humans, but the road surface condition is one of the main indicators of road quality, and it may drastically affect fuel consumption and the safety of both drivers and pedestrians. Abnormalities in the road, such as manholes and potholes, can cause accidents when not identified by the drivers. Furthermore, human-induced abnormalities, such as speed bumps, could also cause accidents. In addition, while said obstacles ought to be signalized according to specific road regulation, they are not always correctly labeled. Therefore, we developed a novel method for the detection of road abnormalities (i.e., speed bumps. This method makes use of a gyro, an accelerometer, and a GPS sensor mounted in a car. After having the vehicle cruise through several streets, data is retrieved from the sensors. Then, using a cross-validation strategy, a genetic algorithm is used to find a logistic model that accurately detects road abnormalities. The proposed model had an accuracy of 0.9714 in a blind evaluation, with a false positive rate smaller than 0.018, and an area under the receiver operating characteristic curve of 0.9784. This methodology has the potential to detect speed bumps in quasi real-time conditions, and can be used to construct a real-time surface monitoring system.

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

Energy Technology Data Exchange (ETDEWEB)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-10-31

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

Directory of Open Access Journals (Sweden)

Xiuyun Zhou

2015-10-01

Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

CERN Document Server

Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

2015-01-01

The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

Energy Technology Data Exchange (ETDEWEB)

Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

1997-10-01

Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

Data driven marketing for dummies

CERN Document Server

Semmelroth, David

2013-01-01

Embrace data and use it to sell and market your products Data is everywhere and it keeps growing and accumulating. Companies need to embrace big data and make it work harder to help them sell and market their products. Successful data analysis can help marketing professionals spot sales trends, develop smarter marketing campaigns, and accurately predict customer loyalty. Data Driven Marketing For Dummies helps companies use all the data at their disposal to make current customers more satisfied, reach new customers, and sell to their most important customer segments more efficiently. Identifyi

PowerPoint 2007 for Dummies

CERN Document Server

Lowe, Doug

2007-01-01

New and inexperienced PowerPoint users will discover how to use the latest enhancements to PowerPoint 2007 quickly and efficiently so that they can produce unique and informative presentations PowerPoint continues to be the world's most popular presentation software This updated For Dummies guide shows users different ways to create powerful and effective slideshow presentations that incorporate data from other applications in the form of charts, clip art, sound, and video Shares the key features of PowerPoint 2007 including creating and editing slides, working with hyperlinks and action butt

English Grammar Workbook For Dummies

CERN Document Server

O'Sullivan, Nuala

2010-01-01

English Grammar Workbook For Dummies, UK Edition is grammar First Aid for anyone wanting to perfect their English and develop the practical skills needed to write and speak correctly. Each chapter focuses on key grammatical principles, with easy-to-follow theory and examples as well as practice questions and explanations. From verbs, prepositions and tenses, to style, expressions and tricky word traps, this hands-on workbook is essential for both beginners looking to learn and practise the basics of English grammar, and those who want to brush up skills they already have - quickly, easily, and

The Leadership Brain for Dummies

CERN Document Server

Sprenger, Marilee B

2010-01-01

Discover how scientific knowledge of the brain can make you a better leader. Based upon the latest breakthroughs in neuroscience and advances in brain-based education, Leadership Brain For Dummies gives you the edge to influence, lead, and transform any team or organization. Drawing concrete connections between the growing scientific knowledge of the brain and leadership, this book gives you the skills to assess your strengths and weaknesses as a leader, adopt a style of leadership that suits your characteristics, determine the learning styles of individual employees, and conduct training sess

500 French verbs for dummies

CERN Document Server

Erotopoulos

2013-01-01

Vexed by French verbs? Fear no more! In 500 French Verbs For Dummies, beginning French language learners can find a quick reference for verbs in the basic present tenses. More advanced French speakers can utilize this book to learn more complex verb tenses and conjugations as well as advanced verbs with irregular endings. One page for each of the 500 most commonly used verbs in the French language -alphabetically arranged and numbered for easy referenceSpecial designation of the 50 most essential French verbsA summary of basic French grammar that incl

Agile Project Management For Dummies

CERN Document Server

Layton, Mark C

2012-01-01

Be flexible and faster with Agile project management As mobile and web technologies continue to evolve rapidly, there is added pressure to develop and implement software projects in weeks instead of months. Agile Project Management For Dummies can make that happen. This is the first book to provide a simple, step-by-step guide to Agile Project Management approaches, tools, and techniques. With the fast pace of mobile and web technology development, software project development must keep pace; Agile Project Management enables developers to complete and implement projects more quickly and this b

Laser tissue welding mediated with a protein solder

Science.gov (United States)

Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

1996-05-01

A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

CERN Document Server

Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

2011-01-01

The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

Science.gov (United States)

Hasnine, M.; Tolla, B.; Vahora, N.

2018-04-01

This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

The reminiscence bump for public events: A review of its prevalence and taxonomy of alternative age distributions

DEFF Research Database (Denmark)

Koppel, Jonathan Mark

2013-01-01

a legitimate effect, and (ii) the alternative age distributions that are otherwise seen in recall for public events. I conclude that, though the bump is frequently found, the legitimacy of the effect is contingent upon the strictness of the standard one employs. I also find significant exceptions to the bump...

GIANT X-RAY BUMP IN GRB 121027A: EVIDENCE FOR FALL-BACK DISK ACCRETION

Energy Technology Data Exchange (ETDEWEB)

Wu Xuefeng [Purple Mountain Observatory, Chinese Academy of Sciences, Nanjing 210008 (China); Hou Shujin [Department of Astronomy and Institute of Theoretical Physics and Astrophysics, Xiamen University, Xiamen, Fujian 361005 (China); Lei Weihua, E-mail: xfwu@pmo.ac.cn, E-mail: leiwh@hust.edu.cn [School of Physics, Huazhong University of Science and Technology, Wuhan 430074 (China)

2013-04-20

A particularly interesting discovery in observations of GRB 121027A is that of a giant X-ray bump detected by the Swift/X-Ray Telescope. The X-ray afterglow re-brightens sharply at {approx}10{sup 3} s after the trigger by more than two orders of magnitude in less than 200 s. This X-ray bump lasts for more than 10{sup 4} s. It is quite different from typical X-ray flares. In this Letter we propose a fall-back accretion model to interpret this X-ray bump within the context of the collapse of a massive star for a long-duration gamma-ray burst. The required fall-back radius of {approx}3.5 Multiplication-Sign 10{sup 10} cm and mass of {approx}0.9-2.6 M{sub Sun} imply that a significant part of the helium envelope should survive through the mass loss during the last stage of the massive progenitor of GRB 121027A.

Troubleshooting and Maintaining Your PC All-in-One Desk Reference For Dummies

CERN Document Server

Gookin, Dan

2009-01-01

Maintaining a PC is important, and troubleshooting a PC can be a challenge. Dan Gookin is great at explaining how to handle common PC problems, and he's provided a complete, plain-English manual in Troubleshooting & Maintaining Your PC All-in-One For Dummies. Liberally laced with Dan's famous humor and clear instructions, Troubleshooting & Maintaining Your PC All-in-One For Dummies is divided into six minibooks covering hardware, software, laptops, Internet, networking, and maintenance. Each one gives you some background on what causes common problems, to help you understand what's wrong as we

Eutectic and solid-state wafer bonding of silicon with gold

International Nuclear Information System (INIS)

Abouie, Maryam; Liu, Qi; Ivey, Douglas G.

2012-01-01

Highlights: ► Eutectic and solid-state Au-Si bonding are compared for both a-Si and c-Si samples. ► Exchange of a-Si and Au layer was observed in both types of bonded samples. ► Use of c-Si for bonding resulted in formation of craters at the Au/c-Si interface. ► Solid-state Au-Si bonding produces better bonds in terms of microstructure. - Abstract: The simple Au-Si eutectic, which melts at 363 °C, can be used to bond Si wafers. However, faceted craters can form at the Au/Si interface as a result of anisotropic and non-uniform reaction between Au and crystalline silicon (c-Si). These craters may adversely affect active devices on the wafers. Two possible solutions to this problem were investigated in this study. One solution was to use an amorphous silicon layer (a-Si) that was deposited on the c-Si substrate to bond with the Au. The other solution was to use solid-state bonding instead of eutectic bonding, and the wafers were bonded at a temperature (350 °C) below the Au-Si eutectic temperature. The results showed that the a-Si layer prevented the formation of craters and solid-state bonding not only required a lower bonding temperature than eutectic bonding, but also prevented spill out of the solder resulting in strong bonds with high shear strength in comparison with eutectic bonding. Using amorphous silicon, the maximum shear strength for the solid-state Au-Si bond reached 15.2 MPa, whereas for the eutectic Au-Si bond it was 13.2 MPa.

Differential equations for dummies

CERN Document Server

Holzner, Steven

2008-01-01

The fun and easy way to understand and solve complex equations Many of the fundamental laws of physics, chemistry, biology, and economics can be formulated as differential equations. This plain-English guide explores the many applications of this mathematical tool and shows how differential equations can help us understand the world around us. Differential Equations For Dummies is the perfect companion for a college differential equations course and is an ideal supplemental resource for other calculus classes as well as science and engineering courses. It offers step-by-step techniques, practical tips, numerous exercises, and clear, concise examples to help readers improve their differential equation-solving skills and boost their test scores.

Development and validation of a modified Hybrid-III six-year-old dummy model for simulating submarining in motor-vehicle crashes.

Science.gov (United States)

Hu, Jingwen; Klinich, Kathleen D; Reed, Matthew P; Kokkolaras, Michael; Rupp, Jonathan D

2012-06-01

In motor-vehicle crashes, young school-aged children restrained by vehicle seat belt systems often suffer from abdominal injuries due to submarining. However, the current anthropomorphic test device, so-called "crash dummy", is not adequate for proper simulation of submarining. In this study, a modified Hybrid-III six-year-old dummy model capable of simulating and predicting submarining was developed using MADYMO (TNO Automotive Safety Solutions). The model incorporated improved pelvis and abdomen geometry and properties previously tested in a modified physical dummy. The model was calibrated and validated against four sled tests under two test conditions with and without submarining using a multi-objective optimization method. A sensitivity analysis using this validated child dummy model showed that dummy knee excursion, torso rotation angle, and the difference between head and knee excursions were good predictors for submarining status. It was also shown that restraint system design variables, such as lap belt angle, D-ring height, and seat coefficient of friction (COF), may have opposite effects on head and abdomen injury risks; therefore child dummies and dummy models capable of simulating submarining are crucial for future restraint system design optimization for young school-aged children. Copyright © 2011 IPEM. Published by Elsevier Ltd. All rights reserved.

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

Abdominal Twin Pressure Sensors for the assessment of abdominal injuries in Q dummies: in-dummy evaluation and performance in accident reconstructions.

Science.gov (United States)

Beillas, Philippe; Alonzo, François; Chevalier, Marie-Christine; Lesire, Philippe; Leopold, Franck; Trosseille, Xavier; Johannsen, Heiko

2012-10-01

The Abdominal Pressure Twin Sensors (APTS) for Q3 and Q6 dummies are composed of soft polyurethane bladders filled with fluid and equipped with pressure sensors. Implanted within the abdominal insert of child dummies, they can be used to detect abdominal loading due to the belt during frontal collisions. In the present study - which is part of the EC funded CASPER project - two versions of APTS (V1 and V2) were evaluated in abdominal belt compression tests, torso flexion test (V1 only) and two series of sled tests with degraded restraint conditions. The results suggest that the two versions have similar responses, and that the pressure sensitivity to torso flexion is limited. The APTS ability to detect abdominal loading in sled tests was also confirmed, with peak pressures typically below 1 bar when the belt loaded only the pelvis and the thorax (appropriate restraint) and values above that level when the abdomen was loaded directly (inappropriate restraint). Then, accident reconstructions performed as part of CASPER and previous EC funded projects were reanalyzed. Selected data from 19 dummies (12 Q6 and 7 Q3) were used to plot injury risk curves. Maximum pressure, maximum pressure rate and their product were all found to be injury predictors. Maximum pressure levels for a 50% risk of AIS3+ were consistent with the levels separating appropriate and inappropriate restraint in the sled tests (e.g. 50% risk of AIS3+ at 1.09 bar for pressure filtered CFC180). Further work is needed to refine the scaling techniques between ages and confirm the risk curves.

Reading in Middle School: Bumps in the Literacy Crossroads

Science.gov (United States)

Hall, Katrina Willard

2008-01-01

Certainly a major bump in the literacy road today is the apparent conflict between school literacies and the preferred literacy activities of students outside of school. After family conversation about a nephew who was getting poor grades in language arts, Hall shares her thinking on the dilemmas of what constitutes literacy, how literacies kids…

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Directory of Open Access Journals (Sweden)

Benabou Lahouari

2014-06-01

Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

Decomposing the sales promotion bump accounting for cross-category effects

NARCIS (Netherlands)

Leeflang, Peter S. H.; Selva, Josefa Parreno; Wittink, Dick R.; Dijk, Albertus Alard van

Extant research on the decomposition of unit sales bumps due to price promotions considers these effects only within a single product category. This article introduces a framework that accommodates specific cross-category effects. Empirical results based on daily data measured at the item/SKU level

Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

Science.gov (United States)

Wu, Yuan-Yun

In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a

Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

DEFF Research Database (Denmark)

Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

2009-01-01

of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

International Nuclear Information System (INIS)

Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

2014-01-01

With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

Dissolution ad uptake of cadmium from dental gold solder alloy implants

International Nuclear Information System (INIS)

Bergman, B.; Bergman, M.; Soeremark, R.

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

Dissolution and uptake of cadmium from dental gold solder alloy implants

Energy Technology Data Exchange (ETDEWEB)

Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

Science.gov (United States)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

The BUMP model of response planning: intermittent predictive control accounts for 10 Hz physiological tremor.

Science.gov (United States)

Bye, Robin T; Neilson, Peter D

2010-10-01

Physiological tremor during movement is characterized by ∼10 Hz oscillation observed both in the electromyogram activity and in the velocity profile. We propose that this particular rhythm occurs as the direct consequence of a movement response planning system that acts as an intermittent predictive controller operating at discrete intervals of ∼100 ms. The BUMP model of response planning describes such a system. It forms the kernel of Adaptive Model Theory which defines, in computational terms, a basic unit of motor production or BUMP. Each BUMP consists of three processes: (1) analyzing sensory information, (2) planning a desired optimal response, and (3) execution of that response. These processes operate in parallel across successive sequential BUMPs. The response planning process requires a discrete-time interval in which to generate a minimum acceleration trajectory to connect the actual response with the predicted future state of the target and compensate for executional error. We have shown previously that a response planning time of 100 ms accounts for the intermittency observed experimentally in visual tracking studies and for the psychological refractory period observed in double stimulation reaction time studies. We have also shown that simulations of aimed movement, using this same planning interval, reproduce experimentally observed speed-accuracy tradeoffs and movement velocity profiles. Here we show, by means of a simulation study of constant velocity tracking movements, that employing a 100 ms planning interval closely reproduces the measurement discontinuities and power spectra of electromyograms, joint-angles, and angular velocities of physiological tremor reported experimentally. We conclude that intermittent predictive control through sequential operation of BUMPs is a fundamental mechanism of 10 Hz physiological tremor in movement. Copyright © 2010 Elsevier B.V. All rights reserved.

Oracle 12c for dummies

CERN Document Server

Ruel, Chris

2013-01-01

Demystifying the power of the Oracle 12c database The Oracle database is the industry-leading relational database management system (RDMS) used from small companies to the world's largest enterprises alike for their most critical business and analytical processing. Oracle 12c includes industry leading enhancements to enable cloud computing and empowers users to manage both Big Data and traditional data structures faster and cheaper than ever before. Oracle 12c For Dummies is the perfect guide for a novice database administrator or an Oracle DBA who is new to Oracle 12c. The book covers what

Photoshop Elements 10 For Dummies

CERN Document Server

Obermeier, Barbara

2011-01-01

Perfect your photos and images with this "focused" guide to the latest version of Photoshop Elements For most of us, the professional-level Photoshop is overkill for our needs. Amateur photographers and photo enthusiasts turn to Photoshop Elements for a powerful but simpler way to edit and retouch their snapshots. Photoshop Elements 10 For Dummies, fully updated and revised for the latest release of this software product, helps you navigate Elements to create, edit, fix, share, and organize the high-quality images you desire. Full color pages bring the techniques to life and make taking great

SharePoint 2013 for dummies

CERN Document Server

Withee, Ken

2013-01-01

The bestselling guide on running SharePoint, now updated to cover all the new features of SharePoint 2013 SharePoint Portal Server is an essential part of the enterprise infrastructure for many businesses. Building on the success of previous versions of SharePoint For Dummies, this new edition covers all the latest features of SharePoint 2013 and provides you with an easy-to-understand resource for making the most of all that this version has to offer. You'll learn how to get a site up and running, branded, and populated with content, workflow, and management. In addition, t

PowerPoint 2013 for dummies

CERN Document Server

Lowe, Doug

2013-01-01

Get up and running with this full-color guide to PowerPoint 2013! PowerPoint, the number one presentation software, has been revised and improved with the introduction of Microsoft Office 2013. With this all-new, full-color book by your side, you will learn how to take full advantage of all of PowerPoint's powerful and dynamic capabilities. Bestselling veteran For Dummies, author Doug Lowe breaks it all down so that you can create a powerful and effective slideshow presentation with the new wide-screen theme and variant that incorporates videos, pictures, and shapes, and all

Java for dummies quick reference

CERN Document Server

Lowe, Doug

2012-01-01

A reference that answers your questions as you move through your coding The demand for Android programming and web apps continues to grow at an unprecedented pace and Java is the preferred language for both. Java For Dummies Quick Reference keeps you moving through your coding while you solve a problem, look up a command or syntax, or search for a programming tip. Whether you're a Java newbie or a seasoned user, this fast reference offers you quick access to solutions without requiring that you wade through pages of tutorial material. Leverages the true reference format that is organized with

Protecting yourself online for dummies

CERN Document Server

Muir, Nancy C

2014-01-01

Protect your privacy and use the internet safely! Don't let news about internet risks deter you from taking full advantage of its benefits! The web is such an amazing and useful resource for connecting with friends and family, shopping, banking, catching up on current events, and getting help in a myriad of ways. Let AARP's Protecting Yourself Online For Dummies arm you with the information you need to use the internet with confidence. You'll learn: How and why risks can occurSteps to protect yourself from identity theft, fraud, and e-mail scamsExpert tips for creating strong passwords and s

AutoCAD 2014 for dummies

CERN Document Server

Fane, Bill

2013-01-01

Find your way around AutoCAD 2014 with this full-color, For Dummies guide!Put away that pencil and paper and start putting the power of AutoCAD 2014 to work in your CAD projects and designs. From setting up your drawing environment to using text, dimensions, hatching, and more, this guide walks you through AutoCAD basics and provides you with a solid understanding of the latest CAD tools and techniques. You'll also benefit from the full-color illustrations that mirror exactly what you'll see on your AutoCAD 2014 screen and highlight the importance of AutoCAD's Mode

Android app development for dummies

CERN Document Server

Burton, Michael

2015-01-01

The updated edition of the bestselling guide to Android app development If you have ambitions to build an Android app, this hands-on guide gives you everything you need to dig into the development process and turn your great idea into a reality! In this new edition of Android App Development For Dummies, you'll find easy-to-follow access to the latest programming techniques that take advantage of the new features of the Android operating system. Plus, two programs are provided: a simple program to get you started and an intermediate program that uses more advanced aspects of the Android plat

Kindle Fire HDX for dummies

CERN Document Server

Muir, Nancy C

2013-01-01

Spark your interest in Kindle Fire HDX and start burning through books, movies, music, and more with this bestselling guide! The Kindle Fire HDX is Amazon's premiere tablet. With its new, more powerful Android operating system, this latest version has some exciting bells and whistles along with the features that have made the Fire a tablet fan favorite: access to the amazing Amazon Appstore, online music storage, a large music and video store, a huge e-book library, and easy one-step ordering from Amazon. This full-color, For Dummies guide shows you how to take advantage of all the Kindle Fi

Algebra II workbook for dummies

CERN Document Server

Sterling, Mary Jane

2014-01-01

To succeed in Algebra II, start practicing now Algebra II builds on your Algebra I skills to prepare you for trigonometry, calculus, and a of myriad STEM topics. Working through practice problems helps students better ingest and retain lesson content, creating a solid foundation to build on for future success. Algebra II Workbook For Dummies, 2nd Edition helps you learn Algebra II by doing Algebra II. Author and math professor Mary Jane Sterling walks you through the entire course, showing you how to approach and solve the problems you encounter in class. You'll begin by refreshing your Algebr

PRINCE2 For Dummies 2009

CERN Document Server

Graham, Nick

2010-01-01

Whatever your project - no matter how big or small - PRINCE2 For Dummies, 2009 Edition is the perfect guide to using this project management method to help ensure its success. Fully updated with the 2009 practice guidelines, this book will take you through every step of a project - from planning and establishing roles to closing and reviewing - offering practical and easy-to-understand advice on using PRINCE2. It also shows how to use the method when approaching the key concerns of project management, including setting up effective controls, managing project risk, managing quality and controll

Pre-calculus workbook for dummies

CERN Document Server

Kuang, Yang

2011-01-01

Get the confidence and math skills you need to get started with calculus Are you preparing for calculus? This hands-on workbook helps you master basic pre-calculus concepts and practice the types of problems you'll encounter in the course. You'll get hundreds of valuable exercises, problem-solving shortcuts, plenty of workspace, and step-by-step solutions to every problem. You'll also memorize the most frequently used equations, see how to avoid common mistakes, understand tricky trig proofs, and much more. Pre-Calculus Workbook For Dummies is the perfect tool for anyone who wa

CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

Science.gov (United States)

Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

2005-04-01

Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

Directory of Open Access Journals (Sweden)

D. Heinemann

2016-06-01

Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

Trapping saturation of the bump-on-tail instability and electrostatic harmonic excitation in Earth's foreshock

International Nuclear Information System (INIS)

Klimas, A.J.

1990-01-01

Trapping saturation of the bump-on-tail instability is discussed using electron plasma Vlasov simulation results. The role of electrostatic harmonic excitation is considered in detail and shown to play a decisive role in the saturation of the instability. An extensive discussion of the simulation results is given to show that the results are not significantly limited by the finite number of Fourier modes used nor by the discrete distribution of those modes in wave number. It is argued that in the leading edge of Earth's electron foreshock a narrow wave number band of unstable field modes leads to trapping saturation of the bump-on-tail instability while simultaneously exciting electrostatic plasma waves at harmonics of the plasma frequency in simialr narrow bands of shorter wavelengths. The argument is based (1) on the observations of Lacombe et al. (1985), who found intense plasma waves at the leading edge of the foreshock with a spectral distribution sufficiently narrow to trap particles in resonance with the waves, and (2) on numerical simulations of the foreshock electron plasma which indicate that trapping saturation of the bump-on-tail instability leads to phase space vortex formation with consequent excitation of electrostatic harmonics. Thus it is suggested that observations of electrostatic harmonics in the leading edge of the foreshock would strongly implicate trapping as the saturation mechanism for the bump-on-tail instability in that region

The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

Directory of Open Access Journals (Sweden)

Zoltán Weltsch

2012-11-01

Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

Planetesimal formation by an axisymmetric radial bump of the column density of the gas in a protoplanetary disk

Science.gov (United States)

Onishi, Isamu K.; Sekiya, Minoru

2017-04-01

We investigate the effect of a radial pressure bump in a protoplanetary disk on planetesimal formation. We performed the two-dimensional numerical simulation of the dynamical interaction of solid particles and gas with an initially defined pressure bump under the assumption of axisymmetry. The aim of this work is to elucidate the effects of the stellar vertical gravity that were omitted in a previous study. Our results are very different from the previous study, which omitted the vertical gravity. Because dust particles settle toward the midplane because of the vertical gravity to form a thin dust layer, the regions outside of the dust layer are scarcely affected by the back-reaction of the dust. Hence, the gas column density keeps its initial profile with a bump, and dust particles migrate toward the bump. In addition, the turbulence due to the Kelvin-Helmholtz instability caused by the difference of the azimuthal velocities between the inside and outside of the dust layer is suppressed where the radial pressure gradient is reduced by the pressure bump. The dust settling proceeds further where the turbulence is weak, and a number of dust clumps are formed. The dust density in some clumps exceeds the Roche density. Planetesimals are considered to be formed from these clumps owing to the self-gravity.[Figure not available: see fulltext.

Bumps, breathers, and waves in a neural network with spike frequency adaptation

International Nuclear Information System (INIS)

Coombes, S.; Owen, M.R.

2005-01-01

We introduce a continuum model of neural tissue that includes the effects of spike frequency adaptation (SFA). The basic model is an integral equation for synaptic activity that depends upon nonlocal network connectivity, synaptic response, and the firing rate of a single neuron. We consider a phenomenological model of SFA via a simple state-dependent threshold firing rate function. As without SFA, Mexican-hat connectivity allows for the existence of spatially localized states (bumps). Importantly recent Evans function techniques are used to show that bumps may destabilize leading to the emergence of breathers and traveling waves. Moreover, a similar analysis for traveling pulses leads to the conditions necessary to observe a stable traveling breather. Simulations confirm our theoretical predictions and illustrate the rich behavior of this model

Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

NARCIS (Netherlands)

Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

2009-01-01

The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Science.gov (United States)

Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

2012-07-01

Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

Science.gov (United States)

Werden, Jesse

The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

Trapping saturation of the bump-on-tail instability and electrostatic harmonic excitation in earth's foreshock

Science.gov (United States)

Klimas, Alexander J.

1990-01-01

The Vlasov simulation is used to examine the trapping saturation of the bump-on-tail instability both with and without mode-mode coupling and subsequent harmonic excitation. It is found that adding the pumped harmonic modes leads to a significant difference in the behavior of the phase-space distribution function near the unstable bump at the saturation time of the instability. The pumped modes permit rapid plateau formation on the space-averaged velocity distribution, in effect preventing the onset of the quasi-linear velocity-diffusion saturation mechanism.

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Energy Technology Data Exchange (ETDEWEB)

Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

2015-03-15

Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

Ship Track for Investigating the Charleston Bump 2003 - Office of Ocean Exploration

Data.gov (United States)

National Oceanic and Atmospheric Administration, Department of Commerce — Ship track of the R/V Seward Johnson during the "Investigating the Charleston Bump 2003" expedition sponsored by the National Oceanic and Atmospheric Administration...

OS X Mavericks for dummies

CERN Document Server

LeVitus, Bob

2013-01-01

Coast through OS X Mavericks with help from Dr. Mac and For Dummies Ready to make friends with Mavericks? Then, Dr. Mac's your man. Author and longtime Mac guru, Bob "Dr. Mac" LeVitus shares his witty insights and helpful tips in this full-color update to his bestselling OS X guide. You'll learn the basics of working with the Dock, Launchpad, and Mission Control before moving on to setting up your e-mail, surfing with Safari, organizing your files, and customizing OS X Mavericks for all you need your Mac to do. Familiarizes you with OS X essentials like navigating the desktop, connecting to

Network Access Control For Dummies

CERN Document Server

Kelley, Jay; Wessels, Denzil

2009-01-01

Network access control (NAC) is how you manage network security when your employees, partners, and guests need to access your network using laptops and mobile devices. Network Access Control For Dummies is where you learn how NAC works, how to implement a program, and how to take real-world challenges in stride. You'll learn how to deploy and maintain NAC in your environment, identify and apply NAC standards, and extend NAC for greater network security. Along the way you'll become familiar with what NAC is (and what it isn't) as well as the key business drivers for deploying NAC.Learn the step

SketchUp 2014 for dummies

CERN Document Server

Chopra, Aidan

2014-01-01

Start building your 3D model today with a comprehensive guide to SketchUp 2014 SketchUp 2014 For Dummies is a user-friendly guide to creating 3D models, adding textures, creating animated walkthroughs, and more, using one of the most popular 3D modeling programs on the market. Fully updated to align with the release of SketchUp, the book guides you through the interface, tools, techniques, and tricks in SketchUp and SketchUp Pro, on both Windows and Mac platforms. Written for designers with no prior 3D modeling experience, the book provides beginner- to intermediate-level instruction in this p

Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

CERN Document Server

Strand, Frode Sneve

2015-01-01

An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

Misuse of speed-bumps on two-lane main rural roads. A generalized practice in Venezuela

Energy Technology Data Exchange (ETDEWEB)

Calderas Volcanes, R.J.; Moreno Gonzalez, E.G.

2016-07-01

Settlements of uncontrolled population on side of road in Venezuela originate the excessive use of traffic speed reducers to mitigate accidents. Misuse of these speed control devices generate problem of functionality in the two-lane main rural roads which requires to be studied to demonstrate its effect on the capacity and level of service. Although other factors may occur (i.e, environmental problems and health), the disproportionate use of speed-bumps worsens circulation quality by increase of travel time as most sensitive parameter. Where this effect not can be reversed it should be made efforts to mitigate speed using another traffic-calming device. The studied stretches are selected according to particular characteristics such as: urban settlement, isolated speed-bump and its installation in series, including case without speed-bumps which guarantees the proper contrast. Video cameras to detect the travel time of vehicles are used in each road section, it allow the measures of other parameters. The travel time distribution with or without speed-bumps and probability distribution that characterizes vehicle movement in each stretch allows the simulation and modeling with the ARENA software. Travel time allows obtain the speed which, together with the volume of traffic, determines the level of service according to the Highway Capacity Manual criterion. The economic cost of substitute measures versus travel time is evaluated and may be useful in decision-making or implementation of better policies by transport governmental institutions. (Author)

Pressure bump instability in very large cold bore storage rings

International Nuclear Information System (INIS)

Limon, P.

1983-12-01

Calculations have been done to estimate the circulating current necessary to induce the onset of a pressure bump instability in a cold bore storage ring. For a wide range of storage ring parameters, the instability threshold current is more than an order of magnitude higher than the operating current. 4 references, 2 tables

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

International Nuclear Information System (INIS)

Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

2017-01-01

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

2017-02-15

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

Science.gov (United States)

Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

2017-10-01

Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Conflict Resolution at Work for Dummies

CERN Document Server

Scott, Vivian

2010-01-01

A practical workplace guide to handling conflict effectively. Managing employees and encouraging them to work together toward a common goal is an essential skill that all leaders should possess. Conflict Resolution at Work For Dummies provides the tools and advice you need to restore peace, train your colleagues to get along better with others, prevent conflicts from ever starting, and maintain better productivity while boosting morale.: One of the only trade publications that takes the manager's perspective on how to address conflicts, resolve disputes, and restore peace and productivity to t

Beginning programming with C for dummies

CERN Document Server

Gookin, Dan

2013-01-01

Learn the basics of programming with C with this fun and friendly guide! C offers a reliable, strong foundation for programming and serves as a stepping stone upon which to expand your knowledge and learn additional programming languages. Written by veteran For Dummies author Dan Gookin, this straightforward-but-fun beginner's guide covers the fundamentals of using C and gradually walks you through more advanced topics including pointers, linked lists, file I/O, and debugging. With a special focus on the subject of an Integrated Development Environment, it gives you a solid understanding of

Electronics all-in-one for dummies

CERN Document Server

Ross, Dickon

2013-01-01

Your one-stop UK shop for clear, concise explanations to all the important concepts in electronics and tons of direction for building simple, fun electronic projects. The 8 mini-books in this 1 volume include: Getting Started with ElectronicsWorking with Basic ComponentsWorking with Integrated CircuitsGetting into Alternating CurrentWorking with Radio and InfraredDoing Digital ElectronicsWorking with Basic Stamp ProcessorsBuilding Special Effects With nearly 900 pages of instruction, Electronics All-in-One For Dummies covers all the bases and provides a fascinating hands-on exploration of el

Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

International Nuclear Information System (INIS)

Olesinska, W.; Kesik, J.

2003-01-01

The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

Surgical dummy: a surrogate to live animal in teaching Veterinary ...

African Journals Online (AJOL)

The ethos of the course veterinary surgery is to install core surgical skills at the very start of a ... 2d to 4d nail gauges with large nail head. Cadaver ... Teaching model. Virtual surgery. Dummy. Cadaver. Live animal. Motor skill. -. ++. ++. ++.

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Directory of Open Access Journals (Sweden)

Soares D.

2007-01-01

Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

Development of Pb-Free Nanocomposite Solder Alloys

Directory of Open Access Journals (Sweden)

Animesh K. Basak

2018-04-01

Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

Application of the adjoint optimisation of shock control bump for ONERA-M6 wing

Science.gov (United States)

Nejati, A.; Mazaheri, K.

2017-11-01

This article is devoted to the numerical investigation of the shock wave/boundary layer interaction (SWBLI) as the main factor influencing the aerodynamic performance of transonic bumped airfoils and wings. The numerical analysis is conducted for the ONERA-M6 wing through a shock control bump (SCB) shape optimisation process using the adjoint optimisation method. SWBLI is analyzed for both clean and bumped airfoils and wings, and it is shown how the modified wave structure originating from upstream of the SCB reduces the wave drag, by improving the boundary layer velocity profile downstream of the shock wave. The numerical simulation of the turbulent viscous flow and a gradient-based adjoint algorithm are used to find the optimum location and shape of the SCB for the ONERA-M6 airfoil and wing. Two different geometrical models are introduced for the 3D SCB, one with linear variations, and another with periodic variations. Both configurations result in drag reduction and improvement in the aerodynamic efficiency, but the periodic model is more effective. Although the three-dimensional flow structure involves much more complexities, the overall results are shown to be similar to the two-dimensional case.

A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

Science.gov (United States)

Tucker, Jonathon P.

As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

Directory of Open Access Journals (Sweden)

Shoudong Gu

2016-06-01

Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

Detection of bump-on-tail reduced electron velocity distributions at the electron foreshock boundary

International Nuclear Information System (INIS)

Fitzenreiter, R.J.; Klimas, A.J.; Scudder, J.D.

1984-02-01

Reduced velocity distributions are derived from three-dimensional measurements of the velocity distribution of electrons in the 7 to 500 eV range in the electron foreshock. Bump-on-tail reduced distributions are presented for the first time at the foreshock boundary consistent with Filbert and Kellogg's proposed time-of-flight mechanism for generating the electron beams. In a significant number of boundary crossings, bump-on-tail reduced distributions were found in consecutive 3 sec measurements made 9 sec apart. It is concluded that, although the beams are linearly unstable to plasma waves according to the Penrose criterion, they persist on a time scale of 3 to 15 sec

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

DEFF Research Database (Denmark)

Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2016-01-01

No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Science.gov (United States)

Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

2011-09-01

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.