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Sample records for pixel barrel detector

  1. CMS Barrel Pixel Detector Overview

    CERN Document Server

    Kästli, H C; Erdmann, W; Gabathuler, K; Hörmann, C; Horisberger, Roland Paul; König, S; Kotlinski, D; Meier, B; Robmann, P; Rohe, T; Streuli, S

    2007-01-01

    The pixel detector is the innermost tracking device of the CMS experiment at the LHC. It is built from two independent sub devices, the pixel barrel and the end disks. The barrel consists of three concentric layers around the beam pipe with mean radii of 4.4, 7.3 and 10.2 cm. There are two end disks on each side of the interaction point at 34.5 cm and 46.5 cm. This article gives an overview of the pixel barrel detector, its mechanical support structure, electronics components, services and its expected performance.

  2. Integration and installation of the CMS pixel barrel detector

    CERN Document Server

    Kastli, Hans-Christian

    2008-01-01

    A 66 million pixel detector has been installed in 2008 into the CMS experiment at CERN. The development and construction time took more than 10 years. In this paper the assembly of the barrel detector is described. A simple but effective method to accomplish a survey of the module positions during assembly is discussed. Furthermore the insertion and commissioning of the CMS pixel barrel detector which took place in July 2008 is illustrated.

  3. Mechanical design and material budget of the CMS barrel pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Amsler, C; Boesiger, K; Chiochia, V; Maier, R; Meyer, Hp; Robmann, P; Scherr, S; Schmidt, A; Steiner, S [Universitaet Zuerich, Physik-Institut, Winterthurerstr. 190, CH-8057 Zuerich (Switzerland); Erdmann, W; Gabathuler, K; Horisberger, R; Koenig, S; Kotlinski, D; Meier, B; Streuli, S [Paul Scherrer Institut, CH-5232 Villigen (Switzerland); Rizzi, A [ETH Zuerich, Institute for Particle Physics, CH-8093 Zuerich (Switzerland)], E-mail: Alexander.Schmidt@cern.ch

    2009-05-15

    The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged particles close to the primary interaction vertex. This paper gives an overview of the mechanical requirements and design choices for the barrel pixel detector. The distribution of material in the detector as well as its description in the Monte Carlo simulation are discussed in detail.

  4. Mechanical Design and Material Budget of the CMS Barrel Pixel Detector

    CERN Document Server

    Amsler, C; Chiochia, V; Erdmann, W; Gabathuler, K; Horisberger, R; König, S; Kotlinski, D; Maier, R; Meyer, H; Meier, B; Meyer, Hp; Rizzi, A; Robmann, P; Scherr, S; Schmidt, A; Steiner, S; Erdmann, W; Gabathuler, K; Horisberger, R; König, S; Kotlinski, D; Meier, B; Streuli, S; Rizzi, A

    2009-01-01

    The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged particles close to the primary interaction vertex. This paper gives an overview of the mechanical requirements and design choices for the barrel pixel detector. The distribution of material in the detector as well as its description in the Monte Carlo simulation are discussed in detail.

  5. Qualification of barrel pixel detector modules for the Phase 1 Upgrade of the CMS vertex detector

    CERN Document Server

    Kudella, Simon

    2016-01-01

    To withstand the higher particle rates of LHC Runs 2 and 3, with expected luminosities of up to $2\\times 10^{34}\\,\\mathrm{cm^{-2}s^{-1}}$, the current CMS pixel detector at the LHC will be replaced as part of the CMS Phase I Upgrade during the extended winter shutdown in 2016/17. The new pixel detector features a new geometry with one additional detector layer in the barrel region~(BPIX) and one pair of additional disks in the forward region~(FPIX), new digital readout chips as well as a new CO$_{2}$-based cooling system for both the barrel and forward region. The BPIX detector module production is summarized, with special focus on the different stages of quality assurance. The quality tests as well as the calibrations which all produced modules undergo in a temperature and humidity controlled environment are described. Exemplarily, the KIT/Aachen production line and its subprocesses are presented together with its quality and yields.

  6. Building CMS Pixel Barrel Detectur Modules

    CERN Document Server

    König, S; Horisberger, R.; Meier, B.; Rohe, T.; Streuli, S.; Weber, R.; Kastli, H.Chr.; Erdmann, W.

    2007-01-01

    For the barrel part of the CMS pixel tracker about 800 silicon pixel detector modules are required. The modules are bump bonded, assembled and tested at the Paul Scherrer Institute. This article describes the experience acquired during the assembly of the first ~200 modules.

  7. ATLAS ITk Pixel detector

    CERN Document Server

    Gemme, Claudia; The ATLAS collaboration

    2016-01-01

    The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenge to the ATLAS tracker. The current inner detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation level are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLA Pixel detector developments as well as the various layout options will be reviewed.

  8. Overview of the CMS Pixel Detector

    CERN Document Server

    Cerati, Giuseppe B

    2008-01-01

    The Compact Muon Solenoid Experiment (CMS) will start taking data at the Large Hadron Collider (LHC) in 2009. It will investigate the proton-proton collisions at $14~TeV$. A robust tracking combined with a precise vertex reconstruction is crucial to address the physics challenge of proton collisions at this energy. To this extent an all-silicon tracking system with very fine granularity has been built and now is in the final commissioning phase. It represents the largest silicon tracking detector ever built. The system is composed by an outer part, made of micro-strip detectors, and an inner one, made of pixel detectors. The pixel detector consists of three pixel barrel layers and two forward disks at each side of the interaction region. Each pixel sensor, both for the barrel and forward detectors, has $100 \\times 150$ $\\mu m^2$ cells for a total of 66 million pixels covering a total area of about $1~m^2$. The pixel detector will play a crucial role in the pattern recognition and the track reconstruction both...

  9. LHC-rate beam test of CMS pixel barrel modules

    International Nuclear Information System (INIS)

    Erdmann, W.; Hoermann, Ch.; Kotlinski, D.; Horisberger, R.; Kaestli, H. Chr.; Gabathuler, K.; Bertl, W.; Meier, B.; Langenegger, U.; Trueeb, P.; Rohe, T.

    2007-01-01

    Modules for the CMS pixel barrel detector have been operated in a high rate pion beam at PSI in order to verify under LHC-like conditions the final module design for the production. The test beam provided charged particle rates up to 10 8 cm -2 s -1 over the full module area. Bunch structure and randomized high trigger rates simulated realistic operation. A four layer telescope made of single pixel readout chip assemblies provided tracking needed for the determination of the modules hit reconstruction efficiency. The performance of the modules has been shown to be adequate for the CMS pixel barrel

  10. Upgrade of ATLAS ITk Pixel Detector

    CERN Document Server

    Huegging, Fabian; The ATLAS collaboration

    2017-01-01

    The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenges to the ATLAS tracker. The current inner detector will be replaced with an entirely-silicon inner tracker (ITk) which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation levels are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors and low mass global and local support structures. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the ITk ATLAS Pixel detector developments as well as different layout options will be reviewed.

  11. The ATLAS Pixel Detector

    CERN Document Server

    Huegging, Fabian

    2006-06-26

    The contruction of the ATLAS Pixel Detector which is the innermost layer of the ATLAS tracking system is prgressing well. Because the pixel detector will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability for all parts, combined with a low material budget. The final detector layout, new results from production modules and the status of assembly are presented.

  12. Current Status of the Pixel Phase I Upgrade in CMS: Barrel Module Production

    CERN Document Server

    Bartek, Rachel

    2016-01-01

    The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. Before 2018 the instantaneous luminosity of the LHC is expected to reach about 2~x~$10^{34}~\\rm{cm}^{-2}\\rm{s}^{-1}$, which will significantly increase the number of interactions per bunch crossing. To maintain a high tracking efficiency, CMS has planned to replace the current pixel system during phase I by a new lightweight detector, equipped with an additional 4th layer in the barrel, and one additional forward/backward disk. The present status of barrel modules production will be presented, including preliminary results from tests on the first production pixel modules of the new pixel tracker.

  13. CMS Pixel Detector Upgrade

    CERN Document Server

    INSPIRE-00038772

    2011-01-01

    The present Compact Muon Solenoid silicon pixel tracking system has been designed for a peak luminosity of 1034cm-2s-1 and total dose corresponding to two years of the Large Hadron Collider (LHC) operation. With the steady increase of the luminosity expected at the LHC, a new pixel detector with four barrel layers and three endcap disks is being designed. We will present the key points of the design: the new geometry, which minimizes the material budget and increases the tracking points, and the development of a fast digital readout architecture, which ensures readout efficiency even at high rate. The expected performances for tracking and vertexing of the new pixel detector are also addressed.

  14. ALICE Silicon Pixel Detector

    CERN Multimedia

    Manzari, V

    2013-01-01

    The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

  15. Results from the Commissioning of the ATLAS Pixel Detector

    CERN Document Server

    Strandberg, S

    2009-01-01

    The ATLAS pixel detector is a high resolution, silicon based, tracking detector with its innermost layer located only 5 cm away from the ATLAS interaction point. It is designed to provide good hit resolution and low noise, both important qualities for pattern recognition and for finding secondary vertices originating from decays of long-lived particles. The pixel detector has 80 million readout channels and is built up of three barrel layers and six disks, three on each side of the barrel. The detector was installed in the center of ATLAS in June 2007 and is currently being calibrated and commissioned. Details from the installation, commissioning and calibration are presented together with the current status.

  16. Qualification Procedures of the CMS Pixel Barrel Modules

    CERN Document Server

    Starodumov, A; Horisberger, R.; Kastli, H.Chr.; Kotlinski, D.; Langenegger, U.; Meier, B.; Rohe, T.; Trueb, P.

    2006-01-01

    The CMS pixel barrel system will consist of three layers built of about 800 modules. One module contains 66560 readout channels and the full pixel barrel system about 48 million channels. It is mandatory to test each channel for functionality, noise level, trimming mechanism, and bump bonding quality. Different methods to determine the bump bonding yield with electrical measurements have been developed. Measurements of several operational parameters are also included in the qualification procedure. Among them are pixel noise, gains and pedestals. Test and qualification procedures of the pixel barrel modules are described and some results are presented.

  17. Integration of the CMS Phase 1 Pixel Detector

    CERN Document Server

    Kornmayer, Andreas

    2018-01-01

    During the extended year-end technical stop 2016/17 the CMS Pixel Detector has been replaced. The new Phase 1 Pixel Detector is designed for a luminosity that could exceed $\\text{L} = 2x10^{34} cm^{−2}s^{−1}$. With one additional layer in the barrel and the forward region of the new detector, combined with the higher hit rates as the LHC luminosity increases, these conditions called for an upgrade of the data acquisition system, which was realised based on the $\\mu$TCA standard. This contribution focuses on the experiences with integration of the new detector readout and control system and reports on the operational performance of the CMS Pixel detector.

  18. Commissioning and first results from the CMS phase-1 upgrade pixel detector

    CERN Document Server

    Sonneveld, Jorine Mirjam

    2017-01-01

    The phase~1 upgrade of the CMS pixel detector has been designed to maintain the tracking performance at instantaneous luminosities of $2 \\times 10^{34} \\mathrm{~cm}^{-2} \\mathrm{~s}^{-1}$. Both barrel and endcap disk systems now feature one extra layer (4 barrel layers and 3 endcap disks), and a digital readout that provides a large enough bandwidth to read out its 124M pixel channels (87.7 percent more pixels compared to the previous system). The backend control and readout systems have been upgraded accordingly from VME-based to micro-TCA-based ones. The detector is now also fitted with a bi-phase CO$_2$ cooling system that reduces the material budget in the tracking region. The detector has been installed inside CMS at the start of 2017 and is now taking data. These proceedings discuss experiences in the commissioning and operation of the CMS phase~1 pixel detector. The first results from the CMS phase~1 pixel detector with this year's LHC proton-proton collision data are presented. ...

  19. A low mass pixel detector upgrade for CMS

    CERN Document Server

    Kästli, H C

    2010-01-01

    The CMS pixel detector has been designed for a peak luminosity of 10^34cm-2s-1 and a total dose corresponding to 2 years of LHC operation at a radius of 4 cm from the interaction region. Parts of the pixel detector will have to be replaced until 2015. The detector performance will be degraded for two reasons: radiation damage of the innermost layers and the planned increase of the LHC peak luminosity by a factor of 2-3. Based on the experience in planning, constructing and commissioning of the present pixel detector, we intend to upgrade the whole pixel detector in 2015. The main focus is on lowering the material budget and adding more tracking points. We will present the design of a new low mass pixel system consisting of 4 barrel layers and 3 end cap disks on each side. The design comprises of thin detector modules and a lightweight mechanical support structure using CO2 cooling. In addition, large efforts have been made to move material from the services out of the tracking region.

  20. Ultra-light and stable composite structure to support and cool the ATLAS pixel detector barrel electronics modules

    International Nuclear Information System (INIS)

    Olcese, M.; Caso, C.; Castiglioni, G.; Cereseto, R.; Cuneo, S.; Dameri, M.; Gemme, C.; Glitza, K.-W.; Lenzen, G.; Mora, F.; Netchaeva, P.; Ockenfels, W.; Piano, E.; Pizzorno, C.; Puppo, R.; Rebora, A.; Rossi, L.; Thadome, J.; Vernocchi, F.; Vigeolas, E.; Vinci, A.

    2004-01-01

    The design of an ultra light structure, the so-called 'stave', to support and cool the sensitive elements of the Barrel Pixel detector, the innermost part of the ATLAS detector to be installed on the new Large Hadron Collider at CERN (Geneva), is presented. Very high-dimensional stability, minimization of the material and ability of operating 10 years in a high radiation environment are the key design requirements. The proposed solution consists of a combination of different carbon-based materials (impregnated carbon-carbon, ultra high modulus carbon fibre composites) coupled to a thin aluminum tube to form a very light support with an integrated cooling channel. Our design has proven to successfully fulfil the requirements. The extensive prototyping and testing program to fully qualify the design and release the production are discussed

  1. Detector performance of the ALICE silicon pixel detector

    CERN Document Server

    Cavicchioli, C

    2011-01-01

    The ALICE Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). It consists of two barrel layers of hybrid silicon pixel detectors at radii of 39 and 76 mm. The physics targets of the ALICE experiment require that the material budget of the SPD is kept within approximate to 1\\%X(0) per layer. This has set some stringent constraints on the design and construction of the SPD. A unique feature of the ALICE SPD is that it is capable of providing a prompt trigger signal, called Fast-OR, which contributes to the L0 trigger decision. The pixel trigger system allows to apply a set of algorithms for the trigger selection, and its output is sent to the Central Trigger Processor (CTP). The detector has been installed in the experiment in summer 2007. During the first injection tests in June 2008 the SPD was able to record the very first sign of life of the LHC by registering secondary particles from the beam dumped upstream the ALICE experiment. In the following months the...

  2. Construction and Tests of Modules for the ATLAS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2068490

    2003-01-01

    The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the pixel detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The pre-production phase of such pixel modules has nearly finished, yielding fully functional modules. Results are presented of tests with these modules.

  3. System test and noise performance studies at the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Weingarten, J.

    2007-09-01

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  4. System test and noise performance studies at the ATLAS pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Weingarten, J.

    2007-09-15

    The central component of the ATLAS Inner Tracker is the pixel detector. It consists of three barrel layers and three disk-layers in the end-caps in both forward directions. The innermost barrel layer is mounted at a distance of about 5 cm from the interaction region. With its very high granularity, truly two-dimensional hit information, and fast readout it is well suited to cope with the high densities of charged tracks, expected this close to the interaction region. The huge number of readout channels necessitates a very complex services infrastructure for powering, readout and safety. After a description of the pixel detector and its services infrastructure, key results from the system test at CERN are presented. Furthermore the noise performance of the pixel detector, crucial for high tracking and vertexing efficiencies, is studied. Measurements of the single-channel random noise are presented together with studies of common mode noise and measurements of the noise occupancy using a random trigger generator. (orig.)

  5. Vertex measurement at a hadron collider. The ATLAS pixel detector

    International Nuclear Information System (INIS)

    Grosse-Knetter, J.

    2008-03-01

    The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the Pixel Detector near the interaction point requires excellent radiation hardness, fast read-out, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The new design concepts used to meet the challenging requirements are discussed with their realisation in the Pixel Detector, followed by a description of a refined and extensive set of measurements to assess the detector performance during and after its construction. (orig.)

  6. Performance of the CMS Phase 1 Pixel Detector

    CERN Document Server

    Akgun, Bora

    2018-01-01

    It is anticipated that the LHC accelerator will reach and exceed the luminosity of L = 2$\\times$10$^{34}$cm$^{-2}$s$^{-1}$ during the LHC Run 2 period until 2023. At this higher luminosity and increased hit occupancies the CMS phase-0 pixel detector would have been subjected to severe dead time and inefficiencies introduced by limited buffers in the analog read-out chip and effects of radiation damage in the sensors. Therefore a new pixel detector has been built and replaced the phase-0 detector in the 2016/17 LHC extended year-end technical stop. The CMS phase-1 pixel detector features four central barrel layers and three end-cap disks in forward and backward direction for robust tracking performance, and a significantly reduced overall material budget including new cooling and powering schemes. The design of the new front-end readout chip comprises larger data buffers, an increased transmission bandwidth, and low-threshold comparators. These improvements allow the new pixel detector to sustain and improve t...

  7. Testing and Integration of the Service Cylinders for the CMS Phase 1 pixel detector

    CERN Document Server

    Ngadiuba, Jennifer

    2016-01-01

    The present 3-layer CMS pixel detector will be replaced with a new 4-layer pixel system, referred to as Phase~1 upgrade, during the LHC extended technical stop in winter 2016/2017. The upgraded detector will allow to maintain the excellent tracking performance of CMS at the upcoming higher luminosity conditions at the LHC. The addition of an extra layer, closer to the beam pipe, demands a complete redesign of its services. The barrel pixel detector is attached to four half cylinders which carry the services along the beam pipe, accommodate the cooling lines and house the electronics for detector readout and control. The service cylinders are a complex system in design as well as in production due to the large number of channels and tight space requirements. In this document we present the design of the system and discuss the construction and testing of the service cylinders for the barrel pixel detector. Furthermore, we present results of the testing and calibrations carried out with a set of new digital dete...

  8. Low-cost bump-bonding processes for high energy physics pixel detectors

    CERN Document Server

    AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

    2016-01-01

    In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

  9. Studies of Inner Detector Layouts with 5 Pixel layers for the Phase-II Upgrade

    CERN Document Server

    Ludwig, A; The ATLAS collaboration; Garcia-Sciveres, M

    2013-01-01

    This note describes a study of Inner Detector layouts for the phase-II upgrade. Starting from the LOI layout the impact of adding a 5th pixel layer, and shortening the pixel and/or SCT barrel layers is studied.

  10. The ALICE silicon pixel detector front-end and read-out electronics

    CERN Document Server

    Kluge, A

    2006-01-01

    The ALICE silicon pixel detector (SPD) comprises the two innermost barrel layers of the ALICE inner tracker system. The SPD includes 120 half staves each of which consists of a linear array of 10 ALICE pixel chips bump bonded to two silicon sensors. Each pixel chip contains 8192 active cells, so the total number of pixel cells in the SPD is ≈107. The tight material budget and the limitation in physical dimensions required by the detector design introduce new challenges for the integration of the on-detector electronics. An essential part of the half stave is a low-mass multi-layer flex that carries power, ground, and signals to the pixel chips. Each half stave is read out using a multi-chip module (MCM). The MCM contains three radiation hard ASICs and an 800 Mbit/s custom developed optical link for the data transfer between the detector and the control room. The detector components are less than 3 mm thick. The production of the half-staves and MCMs is currently under way. Test results as well as on overvie...

  11. The construction of the phase 1 upgrade of the CMS pixel detector

    CERN Document Server

    Weber, Hannsjorg Artur

    2017-01-01

    The innermost layers of the original CMS tracker were built out of pixel detectors arranged in three barrel layers and two forward disks in each endcap. The original CMS detector was designed for the nominal instantaneous LHC luminosity of $1\\times10^{34}\\,\\text{cm}^{-2}\\text{s}^{-1}$. Under the conditions expected in the coming years, which will see an increase of a factor two of the instantaneous luminosity, the CMS pixel detector would have seen a dynamic inefficiency caused by data losses due to buffer overflows. For this reason the CMS collaboration has installed during the recent extended end of year shutdown a replacement pixel detector. The phase-1 upgrade of the CMS pixel detector will operate at high efficiency at an instantaneous luminosity of $2\\times10^{34}\\,\\text{cm}^{-2}\\text{s}^{-1}$ with increased detector acceptance and additional redundancy for the tracking, while at the same time reducing the material budget. These goals are achieved using a new read-out chip and modified powering and rea...

  12. Construction and commissioning of the Phase 1 upgrade of the CMS pixel detector

    CERN Document Server

    Bartek, Rachel

    2017-01-01

    The Phase 1 upgrade of the CMS pixel detector, installed by the CMS collaboration during the recent extended end-of-year technical stop, is built out of four barrel layers (BPIX) and three forward disks in each endcap (FPIX). It comprises a total of 124M pixel channels, in 1,856 modules and it is designed to withstand instantaneous luminosities of up to $2 \\rm{x} 10^{34} \\rm{cm}^{-2} \\rm{s}^{-1}$ with increased detector acceptance and additional redundancy for the tracking, while at the same time reducing the material budget. These goals are achieved using a new readout chip and modified powering and readout schemes, one additional tracking layer both in the barrel and in the disks, and new detector supports including a $\\rm{CO}_2$ based evaporative cooling system. Different parts of the detector have been assembled over the last year and later brought to CERN for installation inside the CMS tracker. At various stages during the assembly tests have been performed to ensure that the readout and power electro...

  13. Module Production and Qualification for the Phase I Upgrade of the CMS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2086689

    2015-01-01

    After consolidation of the LHC in 2013/14 its centre-of-mass energy will increase to 13TeV and the luminosity will reach $2 \\cdot 10^{34}\\, \\textnormal{cm}^{-2} \\textnormal{s}^{-1}$, which is twice the design luminosity. The latter will result in more simultaneous particle collisions, which would significantly increase the dead time of the current readout chip of the CMS pixel detector. Therefore the entire CMS pixel detector is replaced in 2016/17 and a new digital readout with larger buffers will be used to handle increasing pixel hit rates. An additional fourth barrel-layer provides more space points to improve track reconstruction. Half of the required modules for layer four is being produced at Karlsruhe Institute of Technology (KIT). This poster deals with the smallest discrete subunit of the pixel detector, the module and its assembly process. Moreover first production experience will be shown.

  14. Signal height in silicon pixel detectors irradiated with pions and protons

    International Nuclear Information System (INIS)

    Rohe, T.; Acosta, J.; Bean, A.; Dambach, S.; Erdmann, W.; Langenegger, U.; Martin, C.; Meier, B.; Radicci, V.; Sibille, J.; Trueb, P.

    2010-01-01

    Pixel detectors are used in the innermost part of multi-purpose experiments at the Large Hadron Collider (LHC) and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of the detectors has been tested thoroughly up to the fluences expected at the LHC. In case of an LHC upgrade the fluence will be much higher and it is not yet clear up to which radii the present pixel technology can be used. To establish such a limit, pixel sensors of the size of one CMS pixel readout chip (PSI46V2.1) have been bump bonded and irradiated with positive pions up to 6x10 14 n eq /cm 2 at PSI and with protons up to 5x10 15 n eq /cm 2 . The sensors were taken from production wafers of the CMS barrel pixel detector. They use n-type DOFZ material with a resistance of about 3.7kΩcm and an n-side read out. As the performance of silicon sensors is limited by trapping, the response to a Sr-90 source was investigated. The highly energetic beta-particles represent a good approximation to minimum ionising particles. The bias dependence of the signal for a wide range of fluences will be presented.

  15. The ALICE Silicon Pixel Detector Control and Calibration Systems

    CERN Document Server

    Calì, Ivan Amos; Manzari, Vito; Stefanini, Giorgio

    2008-01-01

    The work presented in this thesis was carried out in the Silicon Pixel Detector (SPD) group of the ALICE experiment at the Large Hadron Collider (LHC). The SPD is the innermost part (two cylindrical layers of silicon pixel detec- tors) of the ALICE Inner Tracking System (ITS). During the last three years I have been strongly involved in the SPD hardware and software development, construction and commissioning. This thesis is focused on the design, development and commissioning of the SPD Control and Calibration Systems. I started this project from scratch. After a prototyping phase now a stable version of the control and calibration systems is operative. These systems allowed the detector sectors and half-barrels test, integration and commissioning as well as the SPD commissioning in the experiment. The integration of the systems with the ALICE Experiment Control System (ECS), DAQ and Trigger system has been accomplished and the SPD participated in the experimental December 2007 commissioning run. The complex...

  16. A neural network for locating the primary vertex in a pixel detector

    International Nuclear Information System (INIS)

    Kantowski, R.; Marzban, C.

    1995-01-01

    Using simulated collider data for p+p→2Jets interactions in a two-barrel pixel detector, a neural network is trained to construct the coordinate of the primary vertex to a high degree of accuracy. Three other estimates of this coordinate are also considered and compared to that of the neural network. It is shown that the network can match the best of the traditional estimates. ((orig.))

  17. Radiation hardness of CMS pixel barrel modules

    CERN Document Server

    Rohe, T; Erdmann, W; Kästli, H C; Khalatyan, S; Meier, B; Radicci, V; Sibille, J

    2010-01-01

    Pixel detectors are used in the innermost part of the multi purpose experiments at LHC and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of all detector components has thoroughly been tested up to the fluences expected at the LHC. In case of an LHC upgrade, the fluence will be much higher and it is not yet clear how long the present pixel modules will stay operative in such a harsh environment. The aim of this study was to establish such a limit as a benchmark for other possible detector concepts considered for the upgrade. As the sensors and the readout chip are the parts most sensitive to radiation damage, samples consisting of a small pixel sensor bump-bonded to a CMS-readout chip (PSI46V2.1) have been irradiated with positive 200 MeV pions at PSI up to 6E14 Neq and with 21 GeV protons at CERN up to 5E15 Neq. After irradiation the response of the system to beta particles from a Sr-90 source w...

  18. ATLAS Pixel Detector Operational Experience

    CERN Document Server

    Di Girolamo, B; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.9% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  19. Pixel-Tilecal-MDT Combined Test Beam

    CERN Multimedia

    B. Di Girolamo

    A test with many expectations When an additional week of running (from September 11th to 18th) was allocated for the test-beam, it was decided to give priority to a combined run with the participation of the Pixel, Tilecal and MDT sub-detectors. The integration of these three sub-detectors was possible as they all use the baseline (DAQ-1/EF based) DAQ for test beams (as reported in a previous e-news). The tests and the addition of a common trigger and busy were organized in a short timescale by experts from the three sub-detectors and DAQ/EF. The expectations were many; both looking for problems and finding solutions. The setup The setup, shown in the figure, consisted of the Pixel telescope normally used during the sub-detector tests, two Tilecal barrel modules, two Tilecal extended barrel modules, and six MDT barrel chambers. This fully occupied a length of some 30 meters in the H8 line of the SPS North Area. Each sub-detector used their own specialized front-end electronics. The data collected by modu...

  20. Pixel Detector Trial Assembly Test in the SR1 building

    CERN Multimedia

    D. Giugni

    2004-01-01

    During the last two months the Pixel group [LBL, Milan and Wuppertal] made a successful integration test on the mechanics of the barrel. The scope of the test was to qualify the integration procedures and the various assembling tools. The test took place in the clean room of the SR1 building at CERN, where the detector has been assembled around a dummy beam pipe made of Stainless Steel. The process is rather complex: the shells come in two parts and they have to be clamped together to get the full shell. This operation is carried out by a dedicated tool which is shown to the right in the picture below. The layer 1 shell is clamped around a "service" pipe that will be used for moving the full layer to the integration tool [ITT] which is visible on the left. View of the tools devoted to the Pixel barrel integration in the SR1 building Also visible in the picture is the global frame that is actually held by the tool. It will engage the layers sliding onto the rails. The first two layers are sequentially...

  1. Diamond Pixel Detectors

    International Nuclear Information System (INIS)

    Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D'Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L.; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M.

    2001-01-01

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles

  2. Diamond Pixel Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D' Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L. E-mail: perera@physics.rutgers.edu; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M

    2001-06-01

    Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles.

  3. Radiation hardness of CMS pixel barrel modules

    International Nuclear Information System (INIS)

    Rohe, T.; Bean, A.; Erdmann, W.; Kaestli, H.-C.; Khalatyan, S.; Meier, B.; Radicci, V.; Sibille, J.

    2010-01-01

    Pixel detectors are used in the innermost part of the multi purpose experiments at the LHC and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of all detector components has been thoroughly tested up to the fluences expected at the LHC. In case of an LHC upgrade, the fluence will be much higher and it is not yet clear how long the present pixel modules will stay operative in such a harsh environment. The aim of this study was to establish such a limit as a benchmark for other possible detector concepts considered for the upgrade. As the sensors and the readout chip are the parts most sensitive to radiation damage, samples consisting of a small pixel sensor bump-bonded to a CMS-readout chip (PSI46V2.1) have been irradiated with positive 200 MeV pions at PSI up to 6x10 14 n eq /cm 2 and with 21 GeV protons at CERN up to 5x10 15 n eq /cm 2 . After irradiation the response of the system to beta particles from a 90 Sr source was measured to characterise the charge collection efficiency of the sensor. Radiation induced changes in the readout chip were also measured. The results show that the present pixel modules can be expected to be still operational after a fluence of 2.8x10 15 n eq /cm 2 . Samples irradiated up to 5x10 15 n eq /cm 2 still see the beta particles. However, further tests are needed to confirm whether a stable operation with high particle detection efficiency is possible after such a high fluence.

  4. The OPAL muon barrel detector

    International Nuclear Information System (INIS)

    Akers, R.J.; Allison, J.; Ashton, P.; Bahan, G.A.; Baines, J.T.M.; Banks, J.N.; Barlow, R.J.; Barnett, S.; Beeston, C.; Chrin, J.T.M.; Clowes, S.G.; Davies, O.W.; Duerdoth, I.P.; Hinde, P.S.; Hughes-Jones, R.E.; Lafferty, G.D.; Loebinger, F.K.; Macbeth, A.A.; McGowan, R.F.; Moss, M.W.; Murphy, P.G.; Nijjhar, B.; O'Dowd, A.J.P.; Pawley, S.J.; Phillips, P.D.; Richards, G.E.; Skillman, A.; Stephens, K.; Tresillian, N.J.; Wood, N.C.; Wyatt, T.R.

    1995-01-01

    The barrel part of the OPAL muon detector consists of 110 drift chambers forming four layers outside the hadron absorber. Each chamber covers an area of 1.2 m by up to 10.4 m and has two cells with wires parallel to the beam and a drift distance of 297 mm. A detailed description of the design, construction, operation and performance of the sub-detector is given. The system has been operating successfully since the start of LEP in 1989. ((orig.))

  5. Performance of silicon pixel detectors at small track incidence angles for the ATLAS Inner Tracker upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Viel, Simon, E-mail: sviel@lbl.gov [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Banerjee, Swagato [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States); Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Hard, Andrew Straiton; Kaplan, Laser Seymour; Kashif, Lashkar [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States); Pranko, Aliaksandr [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Rieger, Julia [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); II Physikalisches Institut, Georg-August-Universität, Göttingen (Germany); Wolf, Julian [Physics Division, Lawrence Berkeley National Laboratory and University of California, Berkeley, CA, United States of America (United States); Wu, Sau Lan; Yang, Hongtao [Department of Physics, University of Wisconsin, Madison, WI, United States of America (United States)

    2016-09-21

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN. - Highlights: • Extended inner pixel barrel layers are proposed for the ATLAS ITk upgrade. • Test beam results at small track incidence angles validate this ATLAS ITk design. • Long pixel clusters are reconstructed with high efficiency at low threshold values. • Excellent angular resolution is achieved using pixel cluster length information.

  6. Performance of silicon pixel detectors at small track incidence angles for the ATLAS Inner Tracker upgrade

    International Nuclear Information System (INIS)

    Viel, Simon; Banerjee, Swagato; Brandt, Gerhard; Carney, Rebecca; Garcia-Sciveres, Maurice; Hard, Andrew Straiton; Kaplan, Laser Seymour; Kashif, Lashkar; Pranko, Aliaksandr; Rieger, Julia; Wolf, Julian; Wu, Sau Lan; Yang, Hongtao

    2016-01-01

    In order to enable the ATLAS experiment to successfully track charged particles produced in high-energy collisions at the High-Luminosity Large Hadron Collider, the current ATLAS Inner Detector will be replaced by the Inner Tracker (ITk), entirely composed of silicon pixel and strip detectors. An extension of the tracking coverage of the ITk to very forward pseudorapidity values is proposed, using pixel modules placed in a long cylindrical layer around the beam pipe. The measurement of long pixel clusters, detected when charged particles cross the silicon sensor at small incidence angles, has potential to significantly improve the tracking efficiency, fake track rejection, and resolution of the ITk in the very forward region. The performance of state-of-the-art pixel modules at small track incidence angles is studied using test beam data collected at SLAC and CERN. - Highlights: • Extended inner pixel barrel layers are proposed for the ATLAS ITk upgrade. • Test beam results at small track incidence angles validate this ATLAS ITk design. • Long pixel clusters are reconstructed with high efficiency at low threshold values. • Excellent angular resolution is achieved using pixel cluster length information.

  7. Pixelated CdZnTe drift detectors

    DEFF Research Database (Denmark)

    Kuvvetli, Irfan; Budtz-Jørgensen, Carl

    2005-01-01

    A technique, the so-called Drift Strip Method (DSM), for improving the CdZnTe detector energy response to hard X-rays and gamma-rays was applied as a pixel geometry. First tests have confirmed that this detector type provides excellent energy resolution and imaging performance. We specifically...... report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

  8. A scintillating fibre detector for the Crystal Barrel experiment at ELSA

    International Nuclear Information System (INIS)

    Suft, G.; Anton, G.; Bogendoerfer, R.; Ehmanns, A.; Foesel, A.; Hoessl, J.; Kalinowsky, H.; Kueppersbusch, C.; Walther, D.

    2005-01-01

    A scintillating fibre detector with high spatial granularity was built for the Crystal Barrel experiment at ELSA (CB-ELSA) in Bonn. It consists of 513 scintillating fibres with 2mm in diameter, arranged in three layers with cylindrical geometry inside the Crystal Barrel detector surrounding the target cell. Two layers are wound in opposite directions, the third is parallel to the incident beam direction, resulting in an unambiguous hit reconstruction and a position resolution better than 1.6mm for charged particles. The read-out is done with 16-channel multi-anode photomultipliers. The detector was designed to cover the full angular acceptance of the Crystal Barrel detector with an angular range of 12 deg. ≤θ = 168 deg. and 0 deg. ≤φ≤360 deg. in the lab frame

  9. Operational experience of the ATLAS Pixel detector

    CERN Document Server

    Hirschbuehl, D; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  10. Operational experience of the ATLAS Pixel Detector

    CERN Document Server

    Marcisovsky, M; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  11. Gas pixel detectors

    International Nuclear Information System (INIS)

    Bellazzini, R.; Baldini, L.; Brez, A.; Cavalca, F.; Latronico, L.; Massai, M.M.; Minuti, M.; Omodei, N.; Pesce-Rollins, M.; Sgro, C.; Spandre, G.; Costa, E.; Soffitta, P.

    2007-01-01

    With the Gas Pixel Detector (GPD), the class of micro-pattern gas detectors has reached a complete integration between the gas amplification structure and the read-out electronics. To obtain this goal, three generations of application-specific integrated circuit of increased complexity and improved functionality has been designed and fabricated in deep sub-micron CMOS technology. This implementation has allowed manufacturing a monolithic device, which realizes, at the same time, the pixelized charge-collecting electrode and the amplifying, shaping and charge measuring front-end electronics of a GPD. A big step forward in terms of size and performances has been obtained in the last version of the 0.18 μm CMOS analog chip, where over a large active area of 15x15 mm 2 a very high channel density (470 pixels/mm 2 ) has been reached. On the top metal layer of the chip, 105,600 hexagonal pixels at 50 μm pitch have been patterned. The chip has customable self-trigger capability and includes a signal pre-processing function for the automatic localization of the event coordinates. In this way, by limiting the output signal to only those pixels belonging to the region of interest, it is possible to reduce significantly the read-out time and data volume. In-depth tests performed on a GPD built up by coupling this device to a fine pitch (50 μm) gas electron multiplier are reported. Matching of the gas amplification and read-out pitch has let to obtain optimal results. A possible application of this detector for X-ray polarimetry of astronomical sources is discussed

  12. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Djama, Fares; The ATLAS collaboration

    2017-01-01

    Run 2 of the LHC collider sets new challenges to track and vertex reconstruction because of its higher energy, pileup and luminosity. The ATLAS tracking performance relies critically on the Pixel Detector. Therefore, in view of Run 2, the ATLAS collaboration has constructed the first 4-layer pixel detector in Particle Physics by installing a new pixel layer, called Insertable B-Layer (IBL). Operational experience and performance of the 4-layer Pixel Detector during Run 2 are presented.

  13. The ALICE Silicon Pixel Detector System (SPD)

    CERN Document Server

    Kluge, A; Antinori, Federico; Burns, M; Cali, I A; Campbell, M; Caselle, M; Ceresa, S; Dima, R; Elias, D; Fabris, D; Krivda, Marian; Librizzi, F; Manzari, Vito; Morel, M; Moretto, Sandra; Osmic, F; Pappalardo, G S; Pepato, Adriano; Pulvirenti, A; Riedler, P; Riggi, F; Santoro, R; Stefanini, G; Torcato De Matos, C; Turrisi, R; Tydesjo, H; Viesti, G; PH-EP

    2007-01-01

    The ALICE silicon pixel detector (SPD) comprises the two innermost layers of the ALICE inner tracker system. The SPD includes 120 detector modules (half-staves) each consisting of 10 ALICE pixel chips bump bonded to two silicon sensors and one multi-chip read-out module. Each pixel chip contains 8192 active cells, so that the total number of pixel cells in the SPD is ≈ 107. The on-detector read-out is based on a multi-chip-module containing 4 ASICs and an optical transceiver module. The constraints on material budget and detector module dimensions are very demanding.

  14. Applying Statistical Mechanics to pixel detectors

    International Nuclear Information System (INIS)

    Pindo, Massimiliano

    2002-01-01

    Pixel detectors, being made of a large number of active cells of the same kind, can be considered as significant sets to which Statistical Mechanics variables and methods can be applied. By properly redefining well known statistical parameters in order to let them match the ones that actually characterize pixel detectors, an analysis of the way they work can be performed in a totally new perspective. A deeper understanding of pixel detectors is attained, helping in the evaluation and comparison of their intrinsic characteristics and performance

  15. Operational experience with the ATLAS Pixel Detector

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost element of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  16. Energy calibration of the barrel calorimeter of the CMD-3 detector

    International Nuclear Information System (INIS)

    Anisenkov, A.V.; Aulchenko, V.M.; Bashtovoy, N.S.; Bondar, A.E.; Grebenuk, A.A.; Epifanov, D.A.; Epshteyn, L.B.; Erofeev, A.L.; Kovalenko, O.A.; Kozyrev, A.N.; Kuzmin, A.S.; Mikhailov, K.Yu.; Logashenko, I.B.; Razuvaev, G.P.; Ruban, A.A.; Shebalin, V.E.; Shwartz, B.A.; Talyshev, A.A.; Titov, V.M.; Yudin, Yu.V.

    2017-01-01

    The VEPP-2000 e + e − collider has been operated in the Budker Institute of Nuclear Physics since 2010. Experiments are carried out with two detectors CMD-3 and SND. The calorimetry at the CMD-3 detector is based on three subsystems, two coaxial barrel calorimeters—Liquid Xenon calorimeter and crystal CsI calorimeter, and end cap calorimeter with BGO crystals. This paper describes the procedures of the energy calibration of the combined barrel calorimeter of the CMD-3 detector.

  17. Small Pixel Hybrid CMOS X-ray Detectors

    Science.gov (United States)

    Hull, Samuel; Bray, Evan; Burrows, David N.; Chattopadhyay, Tanmoy; Falcone, Abraham; Kern, Matthew; McQuaide, Maria; Wages, Mitchell

    2018-01-01

    Concepts for future space-based X-ray observatories call for a large effective area and high angular resolution instrument to enable precision X-ray astronomy at high redshift and low luminosity. Hybrid CMOS detectors are well suited for such high throughput instruments, and the Penn State X-ray detector lab, in collaboration with Teledyne Imaging Sensors, has recently developed new small pixel hybrid CMOS X-ray detectors. These prototype 128x128 pixel devices have 12.5 micron pixel pitch, 200 micron fully depleted depth, and include crosstalk eliminating CTIA amplifiers and in-pixel correlated double sampling (CDS) capability. We report on characteristics of these new detectors, including the best read noise ever measured for an X-ray hybrid CMOS detector, 5.67 e- (RMS).

  18. The Pixels find their way to the heart of ATLAS

    CERN Multimedia

    Kevin Einsweiler

    Since the last e-news article on the Pixel Detector in December 2006, there has been much progress. At that time, we were just about to receive the Beryllium beampipe, and to integrate the innermost layer of the Pixel Detector around it. This innermost layer is referred to as the B-layer because of the powerful role it plays in finding the secondary vertices that are the key signature for the presence of b-quarks, and with somewhat greater difficulty, c-quarks and tau leptons. The integration of the central 7m long beampipe into the Pixel Detector was completed in December, and the B-layer was successfully integrated around it. In January this year, we had largely completed the central 1.5m long detector, including the three barrel layers and the three disk layers on each end of the barrel. Although this region contains all of the 80 million readout channels, it cannot be integrated into the Inner Detector without additional services and infrastructure. Therefore, the next step was to add the Service Panels...

  19. The pin pixel detector--neutron imaging

    CERN Document Server

    Bateman, J E; Derbyshire, G E; Duxbury, D M; Marsh, A S; Rhodes, N J; Schooneveld, E M; Simmons, J E; Stephenson, R

    2002-01-01

    The development and testing of a neutron gas pixel detector intended for application in neutron diffraction studies is reported. Using standard electrical connector pins as point anodes, the detector is based on a commercial 100 pin connector block. A prototype detector of aperture 25.4 mmx25.4 mm has been fabricated, giving a pixel size of 2.54 mm which matches well to the spatial resolution typically required in a neutron diffractometer. A 2-Dimensional resistive divide readout system has been adapted to permit the imaging properties of the detector to be explored in advance of true pixel readout electronics. The timing properties of the device match well to the requirements of the ISIS-pulsed neutron source.

  20. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Djama, Fares; The ATLAS collaboration

    2017-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction imposed by the higher collision energy, pileup and luminosity that are being delivered. The ATLAS tracking performance relies critically on the Pixel Detector, therefore, in view of Run-2 of LHC, the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and an additional optical link per module was added to overcome in some layers the readout bandwidth limitation when LHC will exceed the nominal peak luminosity by almost a factor of 3. The key features and challenges met during the IBL project will be presented, as well as its operational experience and Pixel Detector performance in LHC.

  1. The PANDA Barrel DIRC detector

    International Nuclear Information System (INIS)

    Hoek, M.; Dzhygadlo, R.; Gerhardt, A.; Götzen, K.; Hohler, R.; Kalicy, G.; Kumawat, H.; Lehmann, D.; Lewandowski, B.; Patsyuk, M.; Peters, K.; Schepers, G.; Schmitt, L.; Schwarz, C.; Schwiening, J.; Traxler, M.; Zühlsdorf, M.; Dodokhov, V. Kh.; Britting, A.; Eyrich, W.

    2014-01-01

    The PANDA experiment at the new Facility for Antiproton and Ion Research in Europe (FAIR) at GSI, Darmstadt, will study fundamental questions of hadron physics and QCD using high-intensity cooled antiproton beams with momenta between 1.5 and 15 GeV/c. Efficient Particle Identification for a wide momentum range and the full solid angle is required for reconstructing the various physics channels of the PANDA program. Hadronic Particle Identification in the barrel region of the detector will be provided by a DIRC counter. The design is based on the successful BABAR DIRC with important improvements, such as focusing optics and fast photon timing. Several of these improvements, including different radiator geometries and optics, were tested in particle beams at GSI and at CERN. The evolution of the conceptual design of the PANDA Barrel DIRC and the performance of complex prototypes in test beam campaigns will be discussed

  2. The PANDA Barrel DIRC detector

    Energy Technology Data Exchange (ETDEWEB)

    Hoek, M., E-mail: matthias.hoek@uni-mainz.de [Institut für Kernphysik, Johannes Gutenberg University Mainz, Mainz (Germany); Dzhygadlo, R.; Gerhardt, A.; Götzen, K.; Hohler, R.; Kalicy, G.; Kumawat, H.; Lehmann, D.; Lewandowski, B.; Patsyuk, M.; Peters, K.; Schepers, G.; Schmitt, L.; Schwarz, C.; Schwiening, J.; Traxler, M.; Zühlsdorf, M. [GSI Helmholtzzentrum für Schwerionenforschung GmbH, Darmstadt (Germany); Dodokhov, V. Kh. [Joint Institute for Nuclear Research, Dubna (Russian Federation); Britting, A.; Eyrich, W. [Friedrich Alexander-University of Erlangen-Nuremberg, Erlangen (Germany); and others

    2014-12-01

    The PANDA experiment at the new Facility for Antiproton and Ion Research in Europe (FAIR) at GSI, Darmstadt, will study fundamental questions of hadron physics and QCD using high-intensity cooled antiproton beams with momenta between 1.5 and 15 GeV/c. Efficient Particle Identification for a wide momentum range and the full solid angle is required for reconstructing the various physics channels of the PANDA program. Hadronic Particle Identification in the barrel region of the detector will be provided by a DIRC counter. The design is based on the successful BABAR DIRC with important improvements, such as focusing optics and fast photon timing. Several of these improvements, including different radiator geometries and optics, were tested in particle beams at GSI and at CERN. The evolution of the conceptual design of the PANDA Barrel DIRC and the performance of complex prototypes in test beam campaigns will be discussed.

  3. Operational Experience with the ATLAS Pixel Detector

    CERN Document Server

    Lantzsch, Kerstin; The ATLAS collaboration

    2016-01-01

    Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

  4. The Phase II ATLAS ITk Pixel Upgrade

    CERN Document Server

    Terzo, Stefano; The ATLAS collaboration

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the "ITk" (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and and ring-shaped supports in the endcap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m$^2$ , depending on the final layout choice, which is expected to take place in early 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel-endcap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as $|\\eta| < 4$. Supporting structures will be ...

  5. The Phase-II ATLAS ITk Pixel Upgrade

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00349918; The ATLAS collaboration

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase~2 shutdown (foreseen to take place around 2025) by an all-silicon detector called the ``ITk'' (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and ring-shaped supports in the end-cap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation levels. The new pixel system could include up to 14 $\\mathrm{m^2}$ of silicon, depending on the final layout, which is expected to be decided in 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel end-cap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as |eta| $<4$. Supporting structures will be based on low mass, highly stabl...

  6. Barrel calorimeter of the CMD-3 detector

    Energy Technology Data Exchange (ETDEWEB)

    Shebalin, V. E., E-mail: V.E.Shebalin@inp.nsk.su; Anisenkov, A. V.; Aulchenko, V. M.; Bashtovoy, N. S. [Russian Academy of Sciences, Budker Institute of Nuclear Physics, Siberian Branch (Russian Federation); Epifanov, D. A. [University of Tokyo, Department of Physics (Japan); Epshteyn, L. B.; Grebenuk, A. A.; Ignatov, F. V.; Erofeev, A. L.; Kovalenko, O. A.; Kozyrev, A. N.; Kuzmin, A. S.; Logashenko, I. B.; Mikhailov, K. Yu.; Razuvaev, G. P.; Ruban, A. A.; Shwartz, B. A.; Talyshev, A. A.; Titov, V. M.; Yudin, Yu. V. [Russian Academy of Sciences, Budker Institute of Nuclear Physics, Siberian Branch (Russian Federation)

    2015-12-15

    The structure of the barrel calorimeter of the CMD-3 detector is presented in this work. The procedure of energy calibration of the calorimeter and the method of photon energy restoration are described. The distinctive feature of this barrel calorimeter is its combined structure; it is composed of two coaxial subsystems: a liquid xenon calorimeter and a crystalline CsI calorimeter. The calorimeter spatial resolution of the photon conversion point is about 2 mm, which corresponds to an angular resolution of ∼6 mrad. The energy resolution of the calorimeter is about 8% for photons with energy of 200 MeV and 4% for photons with energy of 1 GeV.

  7. Barrel calorimeter of the CMD-3 detector

    International Nuclear Information System (INIS)

    Shebalin, V. E.; Anisenkov, A. V.; Aulchenko, V. M.; Bashtovoy, N. S.; Epifanov, D. A.; Epshteyn, L. B.; Grebenuk, A. A.; Ignatov, F. V.; Erofeev, A. L.; Kovalenko, O. A.; Kozyrev, A. N.; Kuzmin, A. S.; Logashenko, I. B.; Mikhailov, K. Yu.; Razuvaev, G. P.; Ruban, A. A.; Shwartz, B. A.; Talyshev, A. A.; Titov, V. M.; Yudin, Yu. V.

    2015-01-01

    The structure of the barrel calorimeter of the CMD-3 detector is presented in this work. The procedure of energy calibration of the calorimeter and the method of photon energy restoration are described. The distinctive feature of this barrel calorimeter is its combined structure; it is composed of two coaxial subsystems: a liquid xenon calorimeter and a crystalline CsI calorimeter. The calorimeter spatial resolution of the photon conversion point is about 2 mm, which corresponds to an angular resolution of ∼6 mrad. The energy resolution of the calorimeter is about 8% for photons with energy of 200 MeV and 4% for photons with energy of 1 GeV

  8. A silicon pixel detector prototype for the CLIC vertex detector

    CERN Multimedia

    AUTHOR|(INSPIRE)INSPIRE-00714258

    2017-01-01

    A silicon pixel detector prototype for CLIC, currently under study for the innermost detector surrounding the collision point. The detector is made of a High-Voltage CMOS sensor (top) and a CLICpix2 readout chip (bottom) that are glued to each other. Both parts have a size of 3.3 x 4.0 $mm^2$ and consist of an array of 128 x 128 pixels of 25 x 25 $\\micro m^2$ size.

  9. Pixel Detectors for Particle Physics and Imaging Applications

    CERN Document Server

    Wermes, N

    2003-01-01

    Semiconductor pixel detectors offer features for the detection of radiation which are interesting for particle physics detectors as well as for imaging e.g. in biomedical applications (radiography, autoradiography, protein crystallography) or in Xray astronomy. At the present time hybrid pixel detectors are technologically mastered to a large extent and large scale particle detectors are being built. Although the physical requirements are often quite different, imaging applications are emerging and interesting prototype results are available. Monolithic detectors, however, offer interesting features for both fields in future applications. The state of development of hybrid and monolithic pixel detectors, excluding CCDs, and their different suitability for particle detection and imaging, is reviewed.

  10. Challenges of small-pixel infrared detectors: a review.

    Science.gov (United States)

    Rogalski, A; Martyniuk, P; Kopytko, M

    2016-04-01

    In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology-HgCdTe material systems and III-V materials (mainly barrier detectors)-have been investigated.

  11. Operational Experience with the ATLAS Pixel Detector at LHC

    CERN Document Server

    Keil, M

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus crucial for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via front-end chips bump-bonded to 1744 n-on-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, detector performance and measurements of radiation damage. The detector performance is excellent: more than 95% of the pixels are operational, noise occupancy and hit efficiency exceed the des...

  12. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  13. Deployment of the CMS Tracker AMC as Backend for the CMS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2079000

    2016-01-01

    The silicon pixel detector of the CMS experiment at CERN will be replaced with an upgraded version at the beginning of 2017 with the new detector featuring an additional barrel- and end-cap layer resulting in an increased number of fully digital read-out links running at 400Mb/s. New versions of the PSI46 Read-Out Chip and Token Bit Manager have been developed to operate at higher rates and reduce data loss. Front-End Controller and Front-End Driver boards, based on the {\\textmu}TCA compatible CMS Tracker AMC, a variant of the FC7 card, are being developed using different mezzanines to host the optical links for the digital read-out and control system. An overview of the system architecture is presented, with details on the implementation, and first results obtained from test systems.

  14. Rework of flip chip bonded radiation pixel detectors

    International Nuclear Information System (INIS)

    Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

    2008-01-01

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

  15. Rework of flip chip bonded radiation pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

    2008-06-11

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

  16. Semiconductor Pixel detectors and their applications in life sciences

    International Nuclear Information System (INIS)

    Jakubek, J

    2009-01-01

    Recent advances in semiconductor technology allow construction of highly efficient and low noise pixel detectors of ionizing radiation. Steadily improving quality of front end electronics enables fast digital signal processing in each pixel which offers recording of more complete information about each detected quantum (energy, time, number of particles). All these features improve an extend applicability of pixel technology in different fields. Some applications of this technology especially for imaging in life sciences will be shown (energy and phase sensitive X-ray radiography and tomography, radiography with heavy charged particles, neutron radiography, etc). On the other hand a number of obstacles can limit the detector performance if not handled. The pixel detector is in fact an array of individual detectors (pixels), each of them has its own efficiency, energy calibration and also noise. The common effort is to make all these parameters uniform for all pixels. However an ideal uniformity can be never reached. Moreover, it is often seen that the signal in one pixel can affect the neighbouring pixels due to various reasons (e.g. charge sharing). All such effects have to be taken into account during data processing to avoid false data interpretation. A brief view into the future of pixel detectors and their applications including also spectroscopy, tracking and dosimetry is given too. Special attention is paid to the problem of detector segmentation in context of the charge sharing effect.

  17. LISe pixel detector for neutron imaging

    Energy Technology Data Exchange (ETDEWEB)

    Herrera, Elan; Hamm, Daniel [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Wiggins, Brenden [Technology Development, Y-12 National Security Complex, Oak Ridge, TN (United States); Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Milburn, Rob [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Burger, Arnold [Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Department of Life and Physical Sciences, Fisk University, Nashville, TN (United States); Bilheux, Hassina [Chemical and Engineering Materials Division, Oak Ridge National Laboratory, Oak Ridge, TN (United States); Santodonato, Louis [Instrument and Source Division, Oak Ridge National Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN (United States); Chvala, Ondrej [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Stowe, Ashley [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Technology Development, Y-12 National Security Complex, Oak Ridge, TN (United States); Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Lukosi, Eric, E-mail: elukosi@utk.edu [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States)

    2016-10-11

    Semiconducting lithium indium diselenide, {sup 6}LiInSe{sub 2} or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of {sup 6}Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 µm pitch on a 5×5×0.56 mm{sup 3} LISe substrate. An experimentally verified spatial resolution of 300 µm was observed utilizing a super-sampling technique.

  18. Status of the CMS Phase I pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Spannagel, S., E-mail: simon.spannagel@desy.de

    2016-09-21

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  19. Status of the CMS Phase I Pixel Detector Upgrade

    CERN Document Server

    Spannagel, Simon

    2016-09-21

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  20. Diamond and silicon pixel detectors in high radiation environments

    Energy Technology Data Exchange (ETDEWEB)

    Tsung, Jieh-Wen

    2012-10-15

    Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

  1. Diamond and silicon pixel detectors in high radiation environments

    International Nuclear Information System (INIS)

    Tsung, Jieh-Wen

    2012-10-01

    Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10 16 particles per cm 2 , which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10 15 particles per cm 2 .

  2. Performance of the modules for layer 1 of the CMS phase 1 pixel detector upgrade

    CERN Document Server

    Meinhard, Maren Tabea; Berger, Pirmin; Starodumov, Andrey

    2017-01-01

    The instantaneous luminosity of the Large Hadron Collider will increase to up to 2x10$^{34}$\\;cm$^{-2}$s$^{-1}$ by 2023. In order to cope with such luminosities, the pixel detector of the CMS experiment has been replaced in January 2017. The upgraded detector features four sensitive layers in the barrel part. A designated readout chip (PROC600V2) is used for layer 1, which is closest to the interaction point and therefore has to handle larger particle fluxes. An irradiation campaign has been performed with PROC600V2 to verify its radiation tolerance up to the maximum expected dose for 2017 of 0.2\\;MGy. Modules for layer 1 have been built with PROC600V2 for the detector production. The quality of every inserted module was assessed in a number of tests, some of which were performed using X-radiation. The characteristics of the modules used in the detector as well as the main failure modes will be presented.

  3. Characterization of the CMS Pixel Detectors

    CERN Document Server

    Gu, Weihua

    2002-01-01

    In 2005 the Large Hadron Collider (LHC) will start the pp collisions at a high luminosity and at a center of mass energy of 14 TeV. The primary goal of the experimental programme is the search of the Higgs boson(s) and the supersymmetric particles. The programme is also proposed to detect a range of diverse signatures in order to provide guidance for future physics. The pixel detector system makes up the innermost part of the CMS experiment, which is one of the two general purpose detectors at the LHC. The main tasks of the system are vertex detection and flavor tagging. The high luminosity and the high particle multiplicity as well as the small bunch spacing at the LHC impose great challenges on the pixel detectors: radiation hardness of sensors and electronics, fast signal processing and a high granularity are the essential requirements. This thesis concentrates on the study of the suitability of two test stands, which are implemented to characterize the CMS pixel detectors: one is con-cerned with test puls...

  4. First large DEPFET pixel modules for the Belle II Pixel Detector

    Energy Technology Data Exchange (ETDEWEB)

    Mueller, Felix; Avella, Paola; Kiesling, Christian; Koffmane, Christian; Moser, Hans-Guenther; Valentan, Manfred [Max-Planck-Institut fuer Physik, Muenchen (Germany); Andricek, Ladislav; Richter, Rainer [Halbleiterlabor der Max-Planck-Gesellschaft, Muenchen (Germany); Collaboration: Belle II-Collaboration

    2016-07-01

    DEPFET pixel detectors offer excellent signal to noise ratio, resolution and low power consumption with a low material budget. They will be used at Belle II and are a candidate for an ILC vertex detector. The pixels are integrated in a monolithic piece of silicon which also acts as PCB providing the signal and control routings for the ASICs on top. The first prototype DEPFET sensor modules for Belle II have been produced. The modules have 192000 pixels and are equipped with SMD components and three different kinds of ASICs to control and readout the pixels. The entire readout chain has to be studied; the metal layer interconnectivity and routings need to be verified. The modules are fully characterized, and the operation voltages and control sequences of the ASICs are investigated. An overview of the DEPFET concept and first characterization results is presented.

  5. ATLAS Pixel Detector Design For HL-LHC

    CERN Document Server

    Smart, Ben; The ATLAS collaboration

    2016-01-01

    The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

  6. CVD diamond pixel detectors for LHC experiments

    Energy Technology Data Exchange (ETDEWEB)

    Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

    1999-08-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

  7. CVD diamond pixel detectors for LHC experiments

    International Nuclear Information System (INIS)

    Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N.

    1999-01-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described

  8. The pin pixel detector--X-ray imaging

    CERN Document Server

    Bateman, J E; Derbyshire, G E; Duxbury, D M; Marsh, A S; Simmons, J E; Stephenson, R

    2002-01-01

    The development and testing of a soft X-ray gas pixel detector, which uses connector pins for the anodes is reported. Based on a commercial 100 pin connector block, a prototype detector of aperture 25.4 mm centre dot 25.4 mm can be economically fabricated. The individual pin anodes all show the expected characteristics of small gas detectors capable of counting rates reaching 1 MHz per pin. A 2-dimensional resistive divide readout system has been developed to permit the imaging properties of the detector to be explored in advance of true pixel readout electronics.

  9. CVD diamond pixel detectors for LHC experiments

    CERN Document Server

    Wedenig, R; Bauer, C; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Knöpfle, K T; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Pan, L S; Palmieri, V G; Pernicka, Manfred; Peitz, A; Pirollo, S; Polesello, P; Pretzl, Klaus P; Procario, M; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Runólfsson, O; Russ, J; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Vittone, E; Wagner, A; Walsh, A M; Weilhammer, Peter; White, C; Zeuner, W; Ziock, H J; Zöller, M

    1999-01-01

    This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described. (9 refs).

  10. Small-Scale Readout System Prototype for the STAR PIXEL Detector

    International Nuclear Information System (INIS)

    Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

    2008-01-01

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed

  11. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including calibration procedures, timing optimization and detector performance. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit efficiency e...

  12. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  13. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Hirschbuehl, D; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.7% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  14. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lapoire, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  15. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lapoire, C; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification.

  16. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Keil, M

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, timing optimization and detector performance. The detector performance is excellent: approximately 97% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  17. Operational experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Ince, T; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.8% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  18. Operational experience with the ATLAS Pixel detector at the LHC

    CERN Document Server

    Deluca, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5\\% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, ...

  19. Operational Experience with the ATLAS Pixel Detector at the LHC

    CERN Document Server

    Lange, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump- bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, a...

  20. Operational experience with the ATLAS Pixel detector at the LHC

    CERN Document Server

    Deluca, C; The ATLAS collaboration

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

  1. Charge sharing in silicon pixel detectors

    CERN Document Server

    Mathieson, K; Seller, P; Prydderch, M L; O'Shea, V; Bates, R L; Smith, K M; Rahman, M

    2002-01-01

    We used a pixellated hybrid silicon X-ray detector to study the effect of the sharing of generated charge between neighbouring pixels over a range of incident X-ray energies, 13-36 keV. The system is a room temperature, energy resolving detector with a Gaussian FWHM of 265 eV at 5.9 keV. Each pixel is 300 mu m square, 300 mu m deep and is bump bonded to matching read out electronics. The modelling packages MEDICI and MCNP were used to model the complete X-ray interaction and the subsequent charge transport. Using this software a model is developed which reproduces well the experimental results. The simulations are then altered to explore smaller pixel sizes and different X-ray energies. Charge sharing was observed experimentally to be 2% at 13 keV rising to 4.5% at 36 keV, for an energy threshold of 4 keV. The models predict that up to 50% of charge may be lost to the neighbouring pixels, for an X-ray energy of 36 keV, when the pixel size is reduced to 55 mu m.

  2. Precision tracking with a single gaseous pixel detector

    NARCIS (Netherlands)

    Tsigaridas, S.; van Bakel, N.; Bilevych, Y.; Gromov, V.; Hartjes, F.; Hessey, N.P.; de Jong, P.; Kluit, R.

    2015-01-01

    The importance of micro-pattern gaseous detectors has grown over the past few years after successful usage in a large number of applications in physics experiments and medicine. We develop gaseous pixel detectors using micromegas-based amplification structures on top of CMOS pixel readout chips.

  3. New pixelized Micromegas detector for the COMPASS experiment

    International Nuclear Information System (INIS)

    Neyret, D; Anfreville, M; Bedfer, Y; Burtin, E; D'Hose, N; Giganon, A; Kunne, F; Magnon, A; Marchand, C; Paul, B; Platchkov, S; Vandenbroucke, M; Ketzer, B; Konorov, I

    2009-01-01

    New Micromegas (Micro-mesh gaseous detectors) are being developed in view of the future physics projects planned by the COMPASS collaboration at CERN. Several major upgrades compared to present detectors are being studied: detectors standing five times higher luminosity with hadron beams, detection of beam particles (flux up to a few hundred of kHz/mm 2 , 10 times larger than for the present detectors) with pixelized read-out in the central part, light and integrated electronics, and improved robustness. Studies were done with the present detectors moved in the beam, and two first pixelized prototypes are being tested with muon and hadron beams in real conditions at COMPASS. We present here this new project and report on two series of tests, with old detectors moved into the beam and with pixelized prototypes operated in real data taking condition with both muon and hadron beams.

  4. Operational Experience with the CMS Pixel Detector

    CERN Document Server

    INSPIRE-00205212

    2015-05-15

    In the first LHC running period the CMS-pixel detector had to face various operational challenges and had to adapt to the rapidly changing beam conditions. In order to maximize the physics potential and the quality of the data, online and offline calibrations were performed on a regular basis. The detector performed excellently with an average hit efficiency above 99\\% for all layers and disks. In this contribution the operational challenges of the silicon pixel detector in the first LHC run and the current long shutdown are summarized and the expectations for 2015 are discussed.

  5. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    International Nuclear Information System (INIS)

    Mathes, Markus

    2008-12-01

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10 16 particles per cm 2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 μm 2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm 2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm 2 ). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  6. Monitoring radiation damage in the ATLAS pixel detector

    CERN Document Server

    Schorlemmer, André Lukas; Quadt, Arnulf; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

    2014-11-05

    Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

  7. Commissioning and Performance of the CMS Pixel Tracker with Cosmic Ray Muons

    CERN Document Server

    Chatrchyan, S; Abbaneo, D; Abbiendi, G; Abbrescia, M; Abdullin, S; Abelev, B; Acosta, D; Acosta, J G; Actis, O; Adam, N; Adams, M R; Adams, T; Adam, W; Adiguzel, A; Adler, V; Adolphi, R; Adzic, P; Afaq, M A; Agostino, L; Agram, J L; Aguilar-Benitez, M; Ahmad, M; Ahmed, I; Ahmed, W; Ahuja, S; Aisa, D; Aisa, S; Akchurin, N; Akgun, B; Akgun, U; Akimenko, S; Akin, I V; Alagoz, E; Alampi, G; Albajar, C; Albayrak, E A; Alberdi, J; Albergo, S; Albert, E; Albrow, M; Alcaraz Maestre, J; Aldaya Martin, M; Alexander, J; Alidra, M; Aliev, T; Allfrey, P; Almeida, N; Altenhöfer, G; Altsybeev, I; Alver, B; Alverson, G; Alves, G A; Amaglobeli, N; Amapane, N; Ambroglini, F; Amsler, C; Anagnostou, G; Ananthan, B; Anastassov, A; Andelin, D; Anderson, M; Andrea, J; Andreev, V; Andreev, Yu; Anghel, I M; Anguelov, T; Anisimov, A; Antillon, E; Antipov, P; Antonelli, L; Anttila, E; Antunes Pedro, L; Antunovic, Z; Apanasevich, L; Apollinari, G; Apresyan, A; Arce, P; Arcidiacono, R; Arenton, M W; Arfaei, H; Argiro, S; Arisaka, K; Arneodo, M; Arnold, B; Arora, S; Artamonov, A; Asaadi, J; Asghar, M I; Ashby, S; Askew, A; Atac, M; Atramentov, O; Auffray, E; Aurisano, A; Autermann, C; Avery, P; Avetisyan, A; Avila, C; Awan, M I M; Ayan, A S; Ayhan, A; Azhgirey, I; Aziz, T; Azman Gokce, A; Azzi, P; Azzurri, P; Baarmand, M M; Babb, J; Babucci, E; Baccaro, S; Bacchetta, N; Bacchi, W; Bachtis, M; Baden, D; Badgett, W; Baechler, J; Baer, H; Baesso, P; Baffioni, S; Bagby, L; Bagliesi, G; Bahk, S Y; Bailleux, D; Baillon, P; Bainbridge, R; Bakhshiansohi, H; Bakirci, M N; Bakken, J A; Balazs, M; Baldin, B; Ball, A H; Ball, G; Ballin, J; Bally, S L; Bandurin, D; Banerjee, S; Banerjee, S; Banicz, K; Bansal, S; Ban, Y; Banzuzi, K; Baquero Ruiz, M; Barashko, V; Barbagli, G; Barberis, E; Barbone, L; Barcala, J M; Barcellan, L; Bard, R; Bargassa, P; Baringer, P; Barnes, V E; Barnett, B A; Barney, D; Barone, L; Bartalini, P; Bartoloni, A; Bartz, E; Basegmez, S; Battilana, C; Baty, C; Baud, A; Bauerdick, L A T; Bauer, G; Bauer, J; Baur, U; Bawa, H S; Bazterra, V E; Bean, A; Beauceron, S; Beaudette, F; Beaumont, W; Bechtel, F; Bedjidian, M; Beetz, C P; Behrens, U; Belforte, S; Beliy, N; Bellan, P; Bellan, R; Bellato, M; Bellinger, J N; Bell, K W; Belotelov, I; Benaglia, A; Bencze, G; Bendavid, J; Bender, W; Benedetti, D; Benelli, G; Benettoni, M; Beni, N; Benucci, L; Benussi, L; Benvenuti, A C; Beretvas, A; Bergauer, H; Bergauer, T; Beri, S B; Bernardini, J; Bernardino Rodrigues, N; Bernet, C; Berntzon, L; Berretta, L; Berry, D; Berry, E; Berryhill, J; Bertani, M; Bertl, W; Bertoldi, M; Berzano, U; Besancon, M; Besson, A; Betchart, B; Betev, B; Betts, R R; Beuselinck, R; Bhatnagar, V; Bhat, P C; Bhattacharya, S; Bhattacharya, S; Bhatti, A; Biallass, P; Bianchini, L; Bianco, S; Biasini, M; Biasotto, M; Biery, K; Biino, C; Bilei, G M; Bilki, B; Bilmis, S; Binkley, M; Bisello, D; Bitioukov, S; Blaha, J; Blanco Otano, M; Blekman, F; Bloch, D; Bloch, I; Bloch, P; Bloom, K; Bluj, M; Blumenfeld, B; Blüm, P; Blyweert, S; Boccali, T; Bocci, A; Bockelman, B; Bodek, A; Bodin, D; Boeriu, O; Boldini, M; Boldizsar, L; Bolla, G; Bolognesi, S; Bolton, T; Bonacorsi, D; Bona, M; Bonato, A; Bondar, N; Bonnett Del Alamo, M; Bontenackels, M; Boos, E; Borcherding, F; Borgia, M A; Bornheim, A; Borras, K; Borrello, L; Borsato, E; Bortoletto, D; Bose, M; Bose, S; Bose, T; Bosi, F; Bos, J; Bostock, F; Botta, C; Boudoul, G; Bouhali, O; Bourgeois, N; Bourilkov, D; Bourrel, T; Boutemeur, M; Boutle, S; Braibant-Giacomelli, S; Branca, A; Branson, J G; Brauer, R; Braunschweig, W; Breedon, R; Brett, A M; Breuker, H; Brew, C; Bricola, S; Briggs, R; Brigljevic, V; Broccolo, G; Brom, J M; Brooke, J J; Brown, R M; Brun, H; Bruno, G; Buchmuller, O; Budd, H; Buege, V; Buehler, M; Bunin, P; Bunkowski, K; Bunn, J; Buontempo, S; Burgos Lazaro, C; Burkett, K; Burtovoy, V; Busson, P; Busza, W; Butler, J N; Butler, P H; Butt, J; Butz, E; Bylsma, B; Caballero Bejar, J; Cabrillo, I J; Cafaro, V D; Caiazza, S S; Cai, J; Cakir, A; Calderon, A; Calderon De La Barca Sanchez, M; Cali, I A; Callner, J; Calloni, M; Calvo, E; Calzolari, F; Camanzi, B; Caminada, L; Campagnari, C; Campbell, A; Campi, D; Camporesi, T; Cankocak, K; Cano, E; Capiluppi, P; Caponeri, B; Cardaci, M; Cardenas Montes, M; Carleton, M; Carlin, R; Carlsmith, D; Carrillo Montoya, C A; Carrillo Moreno, S; Carroll, R; Cartiglia, N; Carvalho, W; Case, M; Cassel, D; Castaldi, R; Castellani, L; Castello, R; Castilla Valdez, H; Castro, A; Castro, E; Castro, M A; Cattai, A; Caudron, J; Cavallari, F; Cavallo, F R; Cavallo, N; Cavanaugh, R; Cebra, D; Cepeda, M; Cerati, G B; Cerci, S; Cerizza, G; Cerminara, G; Ceron, C; Cerrada, M; Chabert, E C; Chamizo Llatas, M; Chandra, A; Chang, P; Chang, S; Chang, Y H; Chan, M; Chanon, N; Chao, Y; Charaf, O; Charlot, C; Chatelain, J P; Chatterjee, A; Chauhan, S; Chauvey, M; Checchia, P; Checcucci, B; Chekhovsky, V; Chen, E A; Chen, G M; Cheng, T L; Chen, H S; Chen, J; Chen, K F; Chen, M; Chen, W T; Chen, Z; Chertok, M; Chetluru, V; Cheung, H W K; Chien, C Y; Chierici, R; Chiochia, V; Chiorboli, M; Chipaux, R; Chiumarulo, F; Chlebana, F; Choi, M; Choi, S; Choi, Y; Choudhary, B C; Choudhury, R K; Chou, J P; Christian, G; Christiansen, T; Chtchipounov, L; Chuang, S H; Chung, J; Chung, K; Chung, Y S; Churin, I; Chwalek, T; Cihangir, S; Cimmino, A; Cirino, G; Cittolin, S; Ciulli, V; Civinini, C; Claes, D R; Clare, R; Clarida, W; Clemente, A; Clemente, F; Clerbaux, B; Cline, D; Coarasa Perez, J A; Cockerill, D J A; Codispoti, G; Colafranceschi, S; Colaleo, A; Cole, J E; Colino, N; Colling, D; Colonna, D; Conde Garcia, A; Conetti, S; Contardo, D; Conte, E; Conti, E; Conway, J; Cooper, S I; Cossutti, F; Costa, M; Costa, S; Coughlan, J A; Cousins, R; Covarelli, R; Cox, B; Cox, P T; Crawford, M; Creanza, D; Cremaldi, L M; Cripps, N; Crotty, I; Cuevas, J; Cuffiani, M; Cumalat, J P; Cuplov, V; Curé, B; Cuscela, G; Cushman, P; Cussans, D; Cutts, D; Cwiok, M; Czellar, S; Dabrowski, R; Dafinei, I; Dagenhart, W; Dahmes, B; 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Safonov, A; Safronov, G; Saha, A; Saini, L K; Sakharov, A; Sakulin, H; Sala, L; Sala, S; Salerno, R; Sampaio, S; Samyn, D; Sanabria, J C; Sanchez, A K; Sánchez Hernández, A; Sander, C; Sanders, D A; Sanders, S; Sani, M; Santacruz, N; Santanastasio, F; Santaolalla, J; Santocchia, A; Santoro, A; Sanzeni, C; Saout, C; Sarkar, S; Sartisohn, G; Sarycheva, L; Satpathy, A; Sauce, H; Sauerland, P; Savin, A; Savrin, V; Sawley, M C; Schael, S; Schäfer, C; Scheurer, A; Schieferdecker, P; Schilling, F P; Schlatter, W D; Schlein, P; Schleper, P; Schmid, S; Schmidt, A; Schmidt, I; Schmidt, R; Schmitt, M; Schmitt, M; Schmitz, S A; Schnetzer, S; Schoerner-Sadenius, T; Schöfbeck, R; Schott, G; Schreiner, T; Schröder, M; Schroeder, M; Schul, N; Schultz von Dratzig, A; Schümann, J; Schum, T; Schwering, G; Schwick, C; Sciaba, A; Sciacca, C; Scodellaro, L; Scurlock, B; Searle, M; Sedov, A; Seez, C; Segneri, G; Segoni, I; Seixas, J; Sekhri, V; Sekmen, S; Selvaggi, G; Selvaggi, M; Semenov, R; Semenov, S; Sengupta, S; Sen, S; Serban, A T; Serin, M; Servoli, L; Sever, R; Sexton-Kennedy, E; Sfiligoi, I; Sguazzoni, G; Shabalina, E; Shahzad, H; Sharma, A; Sharma, A; Sharma, S; Sharma, V; Sharp, P; Shaw, T M; Shcheglov, Y; Shchetkovskiy, A; Sheldon, P; Shen, B C; Shepherd-Themistocleous, C H; Shinde, Y; Shipsey, I; Shiu, J G; Shivpuri, R K; Shi, X; Shmatov, S; Shpakov, D; Shreyber, I; Shukla, P; Shumeiko, N; Siamitros, C; Sibille, J; Sidiropoulos, G; Siegrist, N; Siegrist, P; Signal, T; Sikler, F; Sill, A; Sillou, D; Silva Do Amaral, S M; Silva, J; Silva, P; Silvestris, L; Sim, K S; Simonetto, F; Simonis, H J; Simon, S; Sinanis, N; Singh, A; Singh, J B; Singh, S P; Singovsky, A; Sirois, Y; Siroli, G; Sirunyan, A M; Sknar, V; Skuja, A; Skup, E; Slabospitsky, S; Slaunwhite, J; Smiljkovic, N; Smirnov, I; Smirnov, V; Smith, J; Smith, K; Smith, R P; Smith, V J; Smith, W H; Smolin, D; Smoron, A; Snigirev, A; Snow, G R; Soares, D; Sobol, A; Sobrier, T; Sobron Sanudo, M; Sogut, K; Soha, A; Solano, A; Solin, A; Solovey, A; Somalwar, S; Son, D C; Song, S; Sonmez, N; Sonnek, P; Sonnenschein, L; Sordini, V; Soroka, D; Sourkov, A; Sousa, M; Souza, M H G; Sowa, M; Spagnolo, P; Spalding, W J; Spanier, S; Speck, J; Speer, T; Sphicas, P; Spiegel, L; Spiga, D; Spiropulu, M; Sprenger, D; Squires, M; Srivastava, A K; Stadie, H; Stahl, A; Staiano, A; Stark, R; Starodumov, A; Stefanovitch, R; Steggemann, J; Steinbrück, G; Steininger, H; Stenson, K; Stephans, G; Stettler, M; Stickland, D; Stieger, B; Stilley, J; Stober, F M; Stöckli, F; Stolin, V; Stone, R; Stoye, M; Stoykova, S; Stoynev, S; Strang, M; Strauss, J; Stringer, R; Stroiney, S; Stuart, D; Sturdy, J; Sturm, P; Suarez Gonzalez, J; Sudhakar, K; Sulak, L; Sulimov, V; Sultanov, G; Summers, D; Sumorok, K; Sung, K; Sun, W; Surat, U E; Suzuki, I; Svintradze, I; Swain, J; Swanson, J; Swartz, M; Sytine, A; Sytnik, V; Szabo, Z; Szczesny, H; Szekely, G; Szillasi, Z; Szleper, M; Sznajder, A; Tabarelli de Fatis, T; Takahashi, M; Tali, B; Tancini, V; Tanenbaum, W; Tan, P; Tao, J; Tapper, A; Tarakanov, V; Taroni, S; Taurok, A; Tauscher, L; Tavernier, S; Taylor, L; Taylor, R; Teischinger, F; Temple, J; Tenchini, R; Teng, H; Teodorescu, L; Teo, W D; Terentyev, N; Teyssier, D; Thea, A; Themel, T; Theofilatos, K; Thiebaux, C; Thomas, M; Thomas, S; Thom, J; Thomsen, J; Thyssen, F; Tikhonenko, E; Tikhonov, A; Timciuc, V; Timlin, C; Titov, M; Tkaczyk, S; Toback, D; Tokesi, K; Tolaini, S; Tomalin, I R; Tonelli, G; Toniolo, N; Tonjes, M B; Tonoiu, D; Tonwar, S C; Toole, T; Topakli, H; Topkar, A; Torassa, E; Tornier, D; Toropin, A; Torre, P; Torromeo, G; Tosi, M; Toteva, Z; Toth, N; Tourneur, S; Tourtchanovitch, L; To, W; Traczyk, P; Tran, N V; Trapani, P P; Travaglini, R; Trayanov, R; Treille, D; Trentadue, R; Triantis, F A; Tricomi, A; Triossi, A; Tripathi, M; Trocino, D; Trocsanyi, Z L; Troendle, D; Troitsky, S; Tropea, P; Tropiano, A; Troshin, S; Troska, J; Trüb, P; Trunov, A; Tsang, K V; Tsiakkouri, D; Tsirigkas, D; Tsirou, A; Tucker, J; Tully, C; Tumanov, A; Tuominen, E; Tuominiemi, J; Tupputi, S; Tuura, L; Tuuva, T; Tuve, C; Twedt, E; Tytgat, M; Tyurin, N; Tzeng, Y M; Ueno, K; Uhl, D; Ujvari, B; Ulmer, K; Ungaro, D; Uplegger, L; Uvarov, L; Uzun, D; Uzunian, A; Vaandering, E W; Valuev, V; Vander Donckt, M; Vander Velde, C; Van Doninck, W; Vanelderen, L; Van Haevermaet, H; Van Hove, P; Vanini, S; Vankov, I; Vanlaer, P; Van Mechelen, P; Van Mulders, P; Van Remortel, N; Vardanyan, I; Varela, J; Varelas, N; Vasil'ev, S; Vasquez Sierra, R; Vaughan, J; Vaurynovich, S; Vavilov, S; Vazquez Acosta, M; Vedaee, A; Veelken, C; Veillet, L; Velasco, M; Velichko, G; Velikzhanin, Y; Velthuis, J; Ventura, S; Venturi, A; Verdier, P; Verdini, P G; Veres, G I; Vergili, L N; Vergili, M; Verrecchia, P; Verwilligen, P; Veszpremi, V; Vesztergombi, G; Veverka, J; Vicini, A; Vidal, R; Vila, I; Vilar Cortabitarte, R; Vilela Pereira, A; Villanueva Munoz, C; Villella, I; Vinogradov, A; Virdee, T; Visca, L; Vishnevskiy, A; Vishnevskiy, D; Vitulo, P; Viviani, C; Vizan Garcia, J M; Vlasov, E; Vlimant, J R; Vodopiyanov, I; Vogel, H; Volkov, A; Volkov, S; Volobouev, I; Volodko, A; Volpe, R; Volyanskyy, D; Vorobiev, I; Vorobyev, A; Voutilainen, M; Wagner-Kuhr, J; Wagner, P; Wagner, S R; Wagner, W; Wakefield, S; Wallny, R; Waltenberger, W; Walton, R; Walzel, G; Wang, C C; Wang, D; Wang, J; Wang, M; Wang, Z; Wan, Z; Warchol, J; Wardrope, D; Washington, E; Watts, T L; Wayne, M; Weber, M; Weber, M; Wehrli, L; Weinberger, M; Weinberg, M; Wendland, L; Wenger, E A; Weng, J; Weng, Y; Wenman, D; Wensveen, M; Werner, J S; Wertelaers, P; Wetzel, J; White, A; Whitmore, J; Whyntie, T; Wickens, J; Wicklund, E; Widl, E; Wigmans, R; Wildish, T; Wilke, L; Wilken, R; Wilkinson, R; Williams, G; Williams, J C; Williams, J H; Willmott, C; Wimpenny, S; Wingham, M; Winn, D; Wissing, C; Witherell, M; Wittich, P; Wittmer, B; Wlochal, M; Wöhri, H K; Wolf, R; Womersley, W J; Won, S; Wood, J S; Worm, S D; Wright, D; Wrochna, G; Wulz, C E; Würthwein, F; Wu, S; Wu, W; Wyslouch, B; Xie, S; Xie, Z; Xue, Z; Yagil, A; Yang, X; Yang, Y; Yang, Z C; Yan, M; Yarba, J; Yaselli, I; Yazgan, E; Yelton, J; Yetkin, T; Yi, K; Yilmaz, Y; Yohay, R; Yoo, H D; Yoon, A S; York, A; Yumiceva, F; Yun, J C; Yuste, C; Zabi, A; Zabolotny, W; Zachariadou, A; Zalewski, P; Zampieri, A; Zanetti, M; Zang, S L; Zarubin, A; Zatzerklyany, A; Zeidler, C; Zeinali, M; Zeise, M; Zelepoukine, S; Zeuner, W D; Zeyrek, M; Zhang, J; Zhang, L; Zhang, Y; Zhang, Z; Zheng, Y; Zhiltsov, V; Zhokin, A; Zhu, B; Zhukova, V; Zhukov, V; Zhu, K; Zhu, R Y; Ziebarth, E B; Zielinski, M; Zilizi, G; Zinonos, Z; Zito, G; Zoeller, M H; Zotto, P; Zub, S; Zumerle, G; Zuranski, A; Zuyeuski, R; Zych, P

    2010-01-01

    The pixel detector of the Compact Muon Solenoid experiment consists of three barrel layers and two disks for each endcap. The detector was installed in summer 2008, commissioned with charge injections, and operated in the 3.8 T magnetic field during cosmic ray data taking. This paper reports on the first running experience and presents results on the pixel tracker performance, which are found to be in line with the design specifications of this detector. The transverse impact parameter resolution measured in a sample of high momentum muons is 18 microns.

  8. Simulation study of pixel detector charge digitization

    Science.gov (United States)

    Wang, Fuyue; Nachman, Benjamin; Sciveres, Maurice; Lawrence Berkeley National Laboratory Team

    2017-01-01

    Reconstruction of tracks from nearly overlapping particles, called Tracking in Dense Environments (TIDE), is an increasingly important component of many physics analyses at the Large Hadron Collider as signatures involving highly boosted jets are investigated. TIDE makes use of the charge distribution inside a pixel cluster to resolve tracks that share one of more of their pixel detector hits. In practice, the pixel charge is discretized using the Time-over-Threshold (ToT) technique. More charge information is better for discrimination, but more challenging for designing and operating the detector. A model of the silicon pixels has been developed in order to study the impact of the precision of the digitized charge distribution on distinguishing multi-particle clusters. The output of the GEANT4-based simulation is used to train neutral networks that predict the multiplicity and location of particles depositing energy inside one cluster of pixels. By studying the multi-particle cluster identification efficiency and position resolution, we quantify the trade-off between the number of ToT bits and low-level tracking inputs. As both ATLAS and CMS are designing upgraded detectors, this work provides guidance for the pixel module designs to meet TIDE needs. Work funded by the China Scholarship Council and the Office of High Energy Physics of the U.S. Department of Energy under contract DE-AC02-05CH11231.

  9. SiPM photosensors and fast timing readout for the Barrel Time-of-Flight detector in bar PANDA

    Science.gov (United States)

    Suzuki, K.

    2018-03-01

    The Barrel Time-of-Flight detector system will be installed in the upcoming bar PANDA experiment at FAIR in Germany. The detector has a barrel shape of phi=0.5 m and 1.8 m long, covering about 5 m2, which corresponds to the laboratory polar angle coverage of 22oPANDA Barrel Time-of-Flight detector are presented. The test shows that the current design fulfils satisfactorily the required timing performance (σt~ 56 ps) and the timing performance depends little on the hit position on the surface.

  10. The FPGA Pixel Array Detector

    International Nuclear Information System (INIS)

    Hromalik, Marianne S.; Green, Katherine S.; Philipp, Hugh T.; Tate, Mark W.; Gruner, Sol M.

    2013-01-01

    A proposed design for a reconfigurable x-ray Pixel Array Detector (PAD) is described. It operates by integrating a high-end commercial field programmable gate array (FPGA) into a 3-layer device along with a high-resistivity diode detection layer and a custom, application-specific integrated circuit (ASIC) layer. The ASIC layer contains an energy-discriminating photon-counting front end with photon hits streamed directly to the FPGA via a massively parallel, high-speed data connection. FPGA resources can be allocated to perform user defined tasks on the pixel data streams, including the implementation of a direct time autocorrelation function (ACF) with time resolution down to 100 ns. Using the FPGA at the front end to calculate the ACF reduces the required data transfer rate by several orders of magnitude when compared to a fast framing detector. The FPGA-ASIC high-speed interface, as well as the in-FPGA implementation of a real-time ACF for x-ray photon correlation spectroscopy experiments has been designed and simulated. A 16×16 pixel prototype of the ASIC has been fabricated and is being tested. -- Highlights: ► We describe the novelty and need for the FPGA Pixel Array Detector. ► We describe the specifications and design of the Diode, ASIC and FPGA layers. ► We highlight the Autocorrelation Function (ACF) for speckle as an example application. ► Simulated FPGA output calculates the ACF for different input bitstreams to 100 ns. ► Reduced data transfer rate by 640× and sped up real-time ACF by 100× other methods.

  11. Sensor development for the CMS pixel detector

    CERN Document Server

    Bölla, G; Horisberger, R P; Kaufmann, R; Rohe, T; Roy, A

    2002-01-01

    The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh radiation environment of the LHC, the technical realization of the pixel detector is extremely challenging. The readout chip as the most damageable part of the system is believed to survive a particle fluence of 6x10 sup 1 sup 4 n sub e sub q /cm sup 2 (All fluences are normalized to 1 MeV neutrons and therefore all components of the hybrid pixel detector have to perform well up to at least this fluence. As this requires a partially depleted operation of the silicon sensors after irradiation-induced type inversion of the substrate, an ''n in n'' concept has been chosen. In order to perform IV-tests on wafer level and to hold accidentally unconnected pixels close to ground potential, a resistive path between the pixe...

  12. SLHC upgrade plans for the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Sicho, Petr

    2009-01-01

    The ATLAS pixel detector is an 80 million channels silicon tracking system designed to detect charged tracks and secondary vertices with very high precision. An upgrade of the ATLAS pixel detector is presently being considered, enabling to cope with higher luminosity at Super Large Hadron Collider (SLHC). The increased luminosity leads to extremely high radiation doses in the innermost region of the ATLAS tracker. Options considered for a new detector are discussed, as well as some important R and D activities, such as investigations towards novel detector geometries and novel processes.

  13. Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mathes, Markus

    2008-12-15

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

  14. Electron imaging with Medipix2 hybrid pixel detector

    CERN Document Server

    McMullan, G; Chen, S; Henderson, R; Llopart, X; Summerfield, C; Tlustos, L; Faruqi, A R

    2007-01-01

    The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 μm×55 μm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 μm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach 85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach 35% of that expected for a perfect detector (4/π2). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/π). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected v...

  15. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

    CERN Document Server

    Ferrere, Didier; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  16. Studies of the ATLAS Inner Detector material using $\\sqrt{s}=$13 TeV $pp$ collision data

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    The ATLAS Inner Detector comprises three different technologies: the Pixel detector (Pixel), the silicon strip tracker (SCT), and the transition radiation drift tube tracker (TRT). The material in the ATLAS Inner Detector is studied with several methods, using the $pp$ collision sample collected at $\\sqrt{s}=$13 TeV in 2015. The material within the innermost barrel regions of the ATLAS Inner Detector is studied using reconstructed hadronic interaction and photon conversion vertices from samples of minimum bias events. It was found that the description of the Insertable B-Layer, which is the new, innermost Pixel layer installed in 2014, in the geometry model was missing some material components. After updating the model, data and simulation show good agreement at the barrel region. The Pixel services (cables, cooling pipes, support trays) were modified between the Pixel and SCT detectors in 2014. The material in this region is also studied by investigating the efficiency with which tracks reconstructed only in...

  17. The ATLAS Pixel Detector operation and performance

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2010-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately $80 imes 10^6$~electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region. The complete Pixel Detector has been taking part in cosmic-ray data-taking since 2008. Since November 2009 it has been operated with LHC colliding beams at $sqrt{s}=900$~GeV, 2.36~TeV and 7 TeV. The detector operated with an active fraction of 97.2% at a threshold of 3500~$e$, showing a noise occupancy rate better than $10^{-9}$~hit/pixel/BC and a track association efficiency of 99%. The Lorentz angle for electrons in silicon is measured to be $ heta_mathrm{L}=12.11^circ pm 0.09^circ$ and its temperature dependence has been verified. The pulse height information from the time-over-threshold technique allows to improve the point resolution using charge sharing and to perform parti...

  18. The Phase-2 ATLAS ITk Pixel Upgrade

    CERN Document Server

    Flick, Tobias; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the “ITk” (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m2, depending on the final layout choice, which is expected to take place in early 2017. Four layout options are being investigated at the moment, two with forward coverage to |eta| < 3.2 and two to |eta| < 4. For each coverage option, a layout with long barrel staves and a layout with novel inclined support structures in the barrel-endcap overlap region are considered. All potential layouts include modules mounted on ring-shaped supports in the endcap regions...

  19. Status and future of the ATLAS Pixel Detector at the LHC

    International Nuclear Information System (INIS)

    Rozanov, Alexandre

    2013-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of disks in each forward end-cap. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-on-n silicon substrates. Intensive calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. The record breaking instantaneous luminosities of 7.7×10 33 cm −2 s −1 recently surpassed at the LHC generated a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulated, the first effects of radiation damage became observable in the silicon sensors as an increase in the silicon leakage current and the change of the voltage required to fully deplete the sensor. A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014) together with the replacement of pixel services. A letter of intent was submitted for a completely new Pixel Detector after 2023, capable to take data with extremely high leveled luminosities of 5×10 34 cm −2 s −1 at the high luminosity LHC. -- Highlights: •The ATLAS Pixel Detector provides hermetic coverage with three layers with 80 million pixels. •Calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. •First effects of radiation damage became observable in the silicon sensors. •A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014). •Replacement of pixel services in 2013–2014. •A letter of intent was submitted for new Pixel Detector after 2023 for high luminosity LHC

  20. X-CSIT: a toolkit for simulating 2D pixel detectors

    Science.gov (United States)

    Joy, A.; Wing, M.; Hauf, S.; Kuster, M.; Rüter, T.

    2015-04-01

    A new, modular toolkit for creating simulations of 2D X-ray pixel detectors, X-CSIT (X-ray Camera SImulation Toolkit), is being developed. The toolkit uses three sequential simulations of detector processes which model photon interactions, electron charge cloud spreading with a high charge density plasma model and common electronic components used in detector readout. In addition, because of the wide variety in pixel detector design, X-CSIT has been designed as a modular platform so that existing functions can be modified or additional functionality added if the specific design of a detector demands it. X-CSIT will be used to create simulations of the detectors at the European XFEL, including three bespoke 2D detectors: the Adaptive Gain Integrating Pixel Detector (AGIPD), Large Pixel Detector (LPD) and DePFET Sensor with Signal Compression (DSSC). These simulations will be used by the detector group at the European XFEL for detector characterisation and calibration. For this purpose, X-CSIT has been integrated into the European XFEL's software framework, Karabo. This will further make it available to users to aid with the planning of experiments and analysis of data. In addition, X-CSIT will be released as a standalone, open source version for other users, collaborations and groups intending to create simulations of their own detectors.

  1. Pixel array detector for X-ray free electron laser experiments

    Energy Technology Data Exchange (ETDEWEB)

    Philipp, Hugh T., E-mail: htp2@cornell.edu [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Hromalik, Marianne [Electrical and Computer Engineering, SUNY Oswego, Oswego, NY 13126 (United States); Tate, Mark; Koerner, Lucas [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M. [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Wilson Laboratory, Cornell University, CHESS, Ithaca, NY 14853 (United States)

    2011-09-01

    X-ray free electron lasers (XFELs) promise to revolutionize X-ray science with extremely high peak brilliances and femtosecond X-ray pulses. This will require novel detectors to fully realize the potential of these new sources. There are many current detector development projects aimed at the many challenges of meeting the XFEL requirements . This paper describes a pixel array detector (PAD) that has been developed for the Coherent X-ray Imaging experiment at the Linac Coherent Light Source (LCLS) at the SLAC National Laboratory . The detector features 14-bit in-pixel digitization; a 2-level in-pixel gain setting that can be used to make an arbitrary 2-D gain pattern that is adaptable to a particular experiment; the ability to handle instantaneous X-ray flux rates of 10{sup 17} photons per second; and continuous frames rates in excess of 120 Hz. The detector uses direct detection of X-rays in a silicon diode. The charge produced by the diode is integrated in a pixilated application specific integrated circuit (ASIC) which digitizes collected holes with single X-ray photon capability. Each ASIC is 194x185 pixels, each pixel is 110{mu}mx110{mu}m on a side. Each pixel can detect up to 2500 X-rays per frame in low-gain mode, yet easily detects single photons at high-gain. Cooled, single-chip detectors have been built and meet all the required specifications. SLAC National Laboratory is engaged in constructing a tiled, multi-chip 1516x1516 pixel detector.

  2. The Belle II DEPFET pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Moser, Hans-Günther, E-mail: moser@mpp.mpg.de

    2016-09-21

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55–60) μm in the first layer and between 50 μm×(70–85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the ‘internal gate’ modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X{sub 0}). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO{sub 2} system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  3. Status of the digital pixel array detector for protein crystallography

    CERN Document Server

    Datte, P; Beuville, E; Endres, N; Druillole, F; Luo, L; Millaud, J E; Xuong, N H

    1999-01-01

    A two-dimensional photon counting digital pixel array detector is being designed for static and time resolved protein crystallography. The room temperature detector will significantly enhance monochromatic and polychromatic protein crystallographic through-put data rates by more than three orders of magnitude. The detector has an almost infinite photon counting dynamic range and exhibits superior spatial resolution when compared to present crystallographic phosphor imaging plates or phosphor coupled CCD detectors. The detector is a high resistivity N-type Si with a pixel pitch of 150x150 mu m, and a thickness of 300 mu m, and is bump bonded to an application specific integrated circuit. The event driven readout of the detector is based on the column architecture and allows an independent pixel hit rate above 1 million photons/s/pixel. The device provides energy discrimination and sparse data readout which yields minimal dead-time. This type of architecture allows a continuous (frameless) data acquisition, a f...

  4. Commissioning of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Golling, Tobias

    2008-01-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented

  5. ATLAS Pixel Detector Upgrade

    CERN Document Server

    Flick, T; The ATLAS collaboration

    2009-01-01

    The first upgrade for higher luminosity at LHC for the ATLAS pixel detector is the insertion of a forth layer, the IBL. The talk gives an overview about what the IBL is and how it will be set up, as well as to give a status of the research and develoment work.

  6. Development and Characterization of Diamond and 3D-Silicon Pixel Detectors with ATLAS-Pixel Readout Electronics

    CERN Document Server

    Mathes, Markus

    2008-01-01

    Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10^16 particles per cm^2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 × 50 um^2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm^2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 × 6 cm^2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection ...

  7. Online calibrations and performance of the ATLAS Pixel Detector

    CERN Document Server

    Keil, M; The ATLAS collaboration

    2010-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 M electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. The talk will give an overview of the calibration and performance of both the detector and its optical readout. The most basic parameter to be tuned and calibrated for the detector electronics is the readout threshold of the individual pixel channels. These need to be carefully tuned to optimise position resolution a...

  8. Wafer-scale pixelated detector system

    Science.gov (United States)

    Fahim, Farah; Deptuch, Grzegorz; Zimmerman, Tom

    2017-10-17

    A large area, gapless, detection system comprises at least one sensor; an interposer operably connected to the at least one sensor; and at least one application specific integrated circuit operably connected to the sensor via the interposer wherein the detection system provides high dynamic range while maintaining small pixel area and low power dissipation. Thereby the invention provides methods and systems for a wafer-scale gapless and seamless detector systems with small pixels, which have both high dynamic range and low power dissipation.

  9. Electron imaging with Medipix2 hybrid pixel detector

    International Nuclear Information System (INIS)

    McMullan, G.; Cattermole, D.M.; Chen, S.; Henderson, R.; Llopart, X.; Summerfield, C.; Tlustos, L.; Faruqi, A.R.

    2007-01-01

    The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 μmx55 μm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 μm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach ∼85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach ∼35% of that expected for a perfect detector (4/π 2 ). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/π). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected values for the MTF and DQE as a function of the threshold energy. The good agreement between theory and experiment allows suggestions for further improvements to be made with confidence. The present detector is already very useful for experiments that require a high DQE at very low doses

  10. Electron imaging with Medipix2 hybrid pixel detector.

    Science.gov (United States)

    McMullan, G; Cattermole, D M; Chen, S; Henderson, R; Llopart, X; Summerfield, C; Tlustos, L; Faruqi, A R

    2007-01-01

    The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 microm x 55 microm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 microm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach approximately 85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach approximately 35% of that expected for a perfect detector (4/pi(2)). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/pi). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected values for the MTF and DQE as a function of the threshold energy. The good agreement between theory and experiment allows suggestions for further improvements to be made with confidence. The present detector is already very useful for experiments that require a high DQE at very low doses.

  11. Algorithms for spectral calibration of energy-resolving small-pixel detectors

    International Nuclear Information System (INIS)

    Scuffham, J; Veale, M C; Wilson, M D; Seller, P

    2013-01-01

    Small pixel Cd(Zn)Te detectors often suffer from inter-pixel variations in gain, resulting in shifts in the individual energy spectra. These gain variations are mainly caused by inclusions and defects within the crystal structure, which affect the charge transport within the material causing a decrease in the signal pulse height. In imaging applications, spectra are commonly integrated over a particular peak of interest. This means that the individual pixels must be accurately calibrated to ensure that the same portion of the spectrum is integrated in every pixel. The development of large-area detectors with fine pixel pitch necessitates automated algorithms for this spectral calibration, due to the very large number of pixels. Algorithms for automatic spectral calibration require accurate determination of characteristic x-ray or photopeak positions on a pixelwise basis. In this study, we compare two peak searching spectral calibration algorithms for a small-pixel CdTe detector in gamma spectroscopic imaging. The first algorithm uses rigid search ranges to identify peaks in each pixel spectrum, based on the average peak positions across all pixels. The second algorithm scales the search ranges on the basis of the position of the highest-energy peak relative to the average across all pixels. In test spectra acquired with Tc-99m, we found that the rigid search algorithm failed to correctly identify the target calibraton peaks in up to 4% of pixels. In contrast, the scaled search algorithm failed in only 0.16% of pixels. Failures in the scaled search algorithm were attributed to the presence of noise events above the main photopeak, and possible non-linearities in the spectral response in a small number of pixels. We conclude that a peak searching algorithm based on scaling known peak spacings is simple to implement and performs well for the spectral calibration of pixellated radiation detectors

  12. Fully integrated CMOS pixel detector for high energy particles

    International Nuclear Information System (INIS)

    Vanstraelen, G.; Debusschere, I.; Claeys, C.; Declerck, G.

    1989-01-01

    A novel type of position and energy sensitive, monolithic pixel array with integrated readout electronics is proposed. Special features of the design are a reduction of the number of output channels and of the amount of output data, and the use of transistors on the high resistivity silicon. The number of output channels for the detector array is reduced by handling in parallel a number of pixels, chosen as a function of the time resolution required for the system, and by the use of an address decoder. A further reduction of data is achieved by reading out only those pixels which have been activated. The pixel detector circuit will be realized in a 3 μm p-well CMOS process, which is optimized for the full integration of readout electronics and detector diodes on high resistivity Si. A retrograde well is formed by means of a high energy implantation, followed by the appropriate temperature steps. The optimization of the well shape takes into account the high substrate bias applied during the detector operation. The design is largely based on the use of MOS transistors on the high resistivity silicon itself. These have proven to perform as well as transistors on standard doped substrate. The basic building elements as well as the design strategy of the integrated pixel detector are presented in detail. (orig.)

  13. Thermal Characterization and Optimization of the Pixel Module Support Structure for the Phase-1 Upgrade of the CMS Pixel Detector

    CERN Document Server

    AUTHOR|(CDS)2094386; Feld, Lutz Werner

    2015-01-01

    The CMS (Compact Muon Solenoid) pixel detector is used in CMS for the vertex reconstruction of events in high-energy proton-proton collisions produced by the Large Hadron Collider (LHC). It is planned for the future years that the LHC will deliver significantly higher instantaneous and integrated luminosities. Therefore, also the demands and requirements for the participating detectors rise. Thus the current CMS pixel detector will be replaced by the CMS Phase-1 Upgrade Pixel Detector in the extended year-end technical stop in winter 2016/2017. As a vertex detector, the pixel detector is the innermost detector component and it is located at a short distance to the proton-proton interaction point. Therefore it has to cope with high particle hit rates and high irradiation. The heat produced due to power consumption has to be removed while using a low-mass detector design. The low-mass design of the Phase-1 Upgrade Pixel Detector will be implemented by utilizing a new two-phase CO2 cooling concept and an ultra l...

  14. X-ray imaging with photon counting hybrid semiconductor pixel detectors

    CERN Document Server

    Manolopoulos, S; Campbell, M; Snoeys, W; Heijne, Erik H M; Pernigotti, E; Raine, C; Smith, K; Watt, J; O'Shea, V; Ludwig, J; Schwarz, C

    1999-01-01

    Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the OMEGA 3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

  15. 14C autoradiography with an energy-sensitive silicon pixel detector.

    Science.gov (United States)

    Esposito, M; Mettivier, G; Russo, P

    2011-04-07

    The first performance tests are presented of a carbon-14 ((14)C) beta-particle digital autoradiography system with an energy-sensitive hybrid silicon pixel detector based on the Timepix readout circuit. Timepix was developed by the Medipix2 Collaboration and it is similar to the photon-counting Medipix2 circuit, except for an added time-based synchronization logic which allows derivation of energy information from the time-over-threshold signal. This feature permits direct energy measurements in each pixel of the detector array. Timepix is bump-bonded to a 300 µm thick silicon detector with 256 × 256 pixels of 55 µm pitch. Since an energetic beta-particle could release its kinetic energy in more than one detector pixel as it slows down in the semiconductor detector, an off-line image analysis procedure was adopted in which the single-particle cluster of hit pixels is recognized; its total energy is calculated and the position of interaction on the detector surface is attributed to the centre of the charge cluster. Measurements reported are detector sensitivity, (4.11 ± 0.03) × 10(-3) cps mm(-2) kBq(-1) g, background level, (3.59 ± 0.01) × 10(-5) cps mm(-2), and minimum detectable activity, 0.0077 Bq. The spatial resolution is 76.9 µm full-width at half-maximum. These figures are compared with several digital imaging detectors for (14)C beta-particle digital autoradiography.

  16. Modeling of Pixelated Detector in SPECT Pinhole Reconstruction.

    Science.gov (United States)

    Feng, Bing; Zeng, Gengsheng L

    2014-04-10

    A challenge for the pixelated detector is that the detector response of a gamma-ray photon varies with the incident angle and the incident location within a crystal. The normalization map obtained by measuring the flood of a point-source at a large distance can lead to artifacts in reconstructed images. In this work, we investigated a method of generating normalization maps by ray-tracing through the pixelated detector based on the imaging geometry and the photo-peak energy for the specific isotope. The normalization is defined for each pinhole as the normalized detector response for a point-source placed at the focal point of the pinhole. Ray-tracing is used to generate the ideal flood image for a point-source. Each crystal pitch area on the back of the detector is divided into 60 × 60 sub-pixels. Lines are obtained by connecting between a point-source and the centers of sub-pixels inside each crystal pitch area. For each line ray-tracing starts from the entrance point at the detector face and ends at the center of a sub-pixel on the back of the detector. Only the attenuation by NaI(Tl) crystals along each ray is assumed to contribute directly to the flood image. The attenuation by the silica (SiO 2 ) reflector is also included in the ray-tracing. To calculate the normalization for a pinhole, we need to calculate the ideal flood for a point-source at 360 mm distance (where the point-source was placed for the regular flood measurement) and the ideal flood image for the point-source at the pinhole focal point, together with the flood measurement at 360 mm distance. The normalizations are incorporated in the iterative OSEM reconstruction as a component of the projection matrix. Applications to single-pinhole and multi-pinhole imaging showed that this method greatly reduced the reconstruction artifacts.

  17. Status of the CMS Phase 1 Pixel Upgrade

    CERN Document Server

    Mattig, Stefan

    2014-01-01

    The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. Before 2018 the instantaneous luminosity of the LHC is expected to reach 2\\,$\\times 10^{34}\\,{\\rm cm^{-2}s^{-1}}$, which will significantly increase the number of interactions per bunch crossing. The current pixel detector of CMS was not designed to work efficiently in such a high occupancy environment and will be degraded by substantial data-loss introduced by buffer filling in the analog Read-Out Chip (ROC) and effects of radiation damage in the sensors, built up over the operational period. To maintain a high tracking efficiency, CMS has planned to replace the current pixel system during ``Phase 1'' (2016/17) by a new lightweight detector, equipped with an additional 4th layer in the barrel, and one additional forward/backward disk. A new digital ROC has been designed, with increased buffers to minimize data-loss, and a digital read-out protoc...

  18. Calibration Analysis Software for the ATLAS Pixel Detector

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00372086; The ATLAS collaboration

    2016-01-01

    The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

  19. Technological aspects of gaseous pixel detectors fabrication

    NARCIS (Netherlands)

    Blanco Carballo, V.M.; Salm, Cora; Smits, Sander M.; Schmitz, Jurriaan; Melai, J.; Chefdeville, M.A.; van der Graaf, H.

    2007-01-01

    Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress

  20. Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

    CERN Document Server

    Nachman, Benjamin Philip; The ATLAS collaboration

    2017-01-01

    Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of $10^{15}$ 1 MeV $n_\\mathrm{eq}/\\mathrm{cm}^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This talk presents a digitization model that includes radiation damage effects to the ATLAS Pixel sensors for the first time. After a thorough description of the setup, predictions for basic Pixel cluster properties are presented alongside first validation studies with Run 2 collision data.

  1. The bar PANDA Barrel-TOF Detector at FAIR

    Science.gov (United States)

    Zimmermann, S.; Suzuki, K.; Steinschaden, D.; Chirita, M.; Ahmed, G.; Dutta, K.; Kalita, K.; Lehmann, A.; Böhm, M.; Schwarz, K.; Orth, H.; Brinkmann, K.-Th.

    2017-08-01

    The barrel-Time-of-Flight subdetector is one of the outer layers of the multi-layer design of the \\panda target spectrometer. It is designed with a minimal material budget in mind mainly consisting of 90×30×5 mm3 thin plastic scintillator tiles read out on each end by a serial connection of 4 SiPMs. 120 such tiles are placed on 16 2460 × 180 mm2 PCB boards forming a barrel covering an azimuthal angle from 22.5o to 150o. The detector is designed to achieve a time resolution below σ< 100 ps which allows to distinguish events in the constant stream of hits, as well as particle identification below the Cherenkov threshold via the time-of-flight; simultaneously providing the interaction times of events. The current prototype achieved a time resolution of ~54 ps, well below the design goal.

  2. Developments of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Andreazza, Attilio

    2004-01-01

    The ATLAS silicon pixel detector is the innermost tracking device of the ATLAS experiment at the Large Hardon Collider, consisting of more than 1700 modules for a total sensitive area of about 1.7m2 and over 80 million pixel cells. The concept is a hybrid of front-end chips bump bonded to the pixel sensor. The elementary pixel cell has 50μmx400μm size, providing pulse height information via the time over threshold technique. Prototype devices with oxygenated silicon sensor and rad-hard electronics built in the IBM 0.25μm process have been tested and maintain good resolution, efficiency and timing performances even after receiving the design radiation damage of 1015neq/cm2

  3. Detector Modules for the CMS Pixel Phase 1 Upgrade

    CERN Document Server

    Zhu, De Hua; Berger, Pirmin; Meinhard, Maren Tabea; Starodumov, Andrey; Tavolaro, Vittorio Raoul

    2017-01-01

    The CMS Pixel phase 1 upgrade detector consists of 1184 modules with new design. An important part of the production is the module qualification and calibration, ensuring their proper functionality within the detector. This paper summarizes the qualification and calibration results of modules used in the innermost two detector layers with focus on methods using module-internal calibration signals. Extended characterizations on pixel level such as electronic noise and bump bond connectivity, optimization of operational parameters, sensor quality and thermal stress resistance were performed using a customized setup with controlled environment. It could be shown that the selected modules have on average $0.55 \\mathrm{ {}^{0\\!}\\!/\\!_{00} }\\, \\pm \\, 0.01 \\mathrm{ {}^{0\\!}\\!/\\!_{00} }\\,$ defective pixels and that all performance parameters stay within their specifications.

  4. Synchrotron applications of pixel and strip detectors at Diamond Light Source

    International Nuclear Information System (INIS)

    Marchal, J.; Tartoni, N.; Nave, C.

    2009-01-01

    A wide range of position-sensitive X-ray detectors have been commissioned on the synchrotron X-ray beamlines operating at the Diamond Light Source in UK. In addition to mature technologies such as image-plates, CCD-based detectors, multi-wire and micro-strip gas detectors, more recent detectors based on semiconductor pixel or strip sensors coupled to CMOS read-out chips are also in use for routine synchrotron X-ray diffraction and scattering experiments. The performance of several commercial and developmental pixel/strip detectors for synchrotron studies are discussed with emphasis on the image quality achieved with these devices. Examples of pixel or strip detector applications at Diamond Light Source as well as the status of the commissioning of these detectors on the beamlines are presented. Finally, priorities and ideas for future developments are discussed.

  5. ATLAS SemiConductor Tracker and Pixel Detector: Status and Performance

    CERN Document Server

    Reeves, K; The ATLAS collaboration

    2012-01-01

    The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking devices in the Inner Detector of the ATLAS experiment at CERN LHC. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In the talk the current status of the SCT and Pixel Detector will be reviewed. We will report on the operation of the detectors including an overview of the issues we encountered and the observation of significant increases in leakage currents (as expected) from bulk ...

  6. Results from the commissioning of the ATLAS Pixel Detector

    CERN Document Server

    Masetti, L

    2008-01-01

    The Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It is an 80 million channel silicon tracking system designed to detect charged tracks and secondary vertices with very high precision. After connection of cooling and services and verification of their operation, the ATLAS Pixel Detector is now in the final stage of its commissioning phase. Calibration of optical connections, verification of the analog performance and special DAQ runs for noise studies have been performed and the first tracks in combined operation with the other subdetectors of the ATLAS Inner Detector were observed. The results from calibration tests on the whole detector and from cosmic muon data are presented.

  7. Charge collection and absorption-limited x-ray sensitivity of pixellated x-ray detectors

    International Nuclear Information System (INIS)

    Kabir, M. Zahangir; Kasap, S.O.

    2004-01-01

    The charge collection and absorption-limited x-ray sensitivity of a direct conversion pixellated x-ray detector operating in the presence of deep trapping of charge carriers is calculated using the Shockley-Ramo theorem and the weighting potential of the individual pixel. The sensitivity of a pixellated x-ray detector is analyzed in terms of normalized parameters; (a) the normalized x-ray absorption depth (absorption depth/photoconductor thickness), (b) normalized pixel width (pixel size/thickness), and (c) normalized carrier schubwegs (schubweg/thickness). The charge collection and absorption-limited sensitivity of pixellated x-ray detectors mainly depends on the transport properties (mobility and lifetime) of the charges that move towards the pixel electrodes and the extent of dependence increases with decreasing normalized pixel width. The x-ray sensitivity of smaller pixels may be higher or lower than that of larger pixels depending on the rate of electron and hole trapping and the bias polarity. The sensitivity of pixellated detectors can be improved by ensuring that the carrier with the higher mobility-lifetime product is drifted towards the pixel electrodes

  8. Strip detector for the ATLAS detector upgrade for the High-Luminosity LHC

    CERN Document Server

    Veloce, Laurelle Maria; The ATLAS collaboration

    2017-01-01

    The ATLAS experiment is currently preparing for an upgrade of the tracking system in the course of the High Luminosity LHC, scheduled for 2025. The expected radiation damage at an integrated luminosity of 3000fb-1 will require the tracking detectors to withstand hadron fluencies to over 1x1016 1 MeV neutron equivalent per cm2. With the addition of increased readout rates, the existing Inner Detector will have to be replaced by an all-silicon Inner Tracker (ITk) with a pixel detector surrounded by a strip detector. The ITk strip detector consists of a four-layer barrel and a forward region composed of six discs on each side of the barrel. The current prototyping phase has resulted in the ITk Strip Detector Technical Design Report (TDR), which starts the pre-production readiness phase at the involved institutes. In this contribution we present the design of the ITk Strip Detector and current status of R&D of various detector components.

  9. High-speed readout of high-Z pixel detectors with the LAMBDA detector

    International Nuclear Information System (INIS)

    Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

    2014-01-01

    High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ''high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ''continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan

  10. Studies on a 300 k pixel detector telescope

    Science.gov (United States)

    Middelkamp, Peter; Antinori, F.; Barberis, D.; Becks, K. H.; Beker, H.; Beusch, W.; Burger, P.; Campbell, M.; Cantatore, E.; Catanesi, M. G.; Chesi, E.; Darbo, G.; D'Auria, S.; Davia, C.; di Bari, D.; di Liberto, S.; Elia, D.; Gys, T.; Heijne, E. H. M.; Helstrup, H.; Jacholkowski, A.; Jæger, J. J.; Jakubek, J.; Jarron, P.; Klempt, W.; Krummenacher, F.; Knudson, K.; Kralik, I.; Kubasta, J.; Lasalle, J. C.; Leitner, R.; Lemeilleur, F.; Lenti, V.; Letheren, M.; Lopez, L.; Loukas, D.; Luptak, M.; Martinengo, P.; Meddeler, G.; Meddi, F.; Morando, M.; Munns, A.; Pellegrini, F.; Pengg, F.; Pospisil, S.; Quercigh, E.; Ridky, J.; Rossi, L.; Safarik, K.; Scharfetter, L.; Segato, G.; Simone, S.; Smith, K.; Snoeys, W.; Vrba, V.

    1996-02-01

    Four silicon pixel detector planes are combined to form a tracking telescope in the lead ion experiment WA97 at CERN with 290 304 sensitive elements each of 75 μm by 500 μm area. An electronic pulse processing circuit is associated with each individual sensing element and the response for ionizing particles is binary with an adjustable threshold. The noise rate for a threshold of 6000 e- has been measured to be less than 10-10. The inefficient area due to malfunctioning pixels is 2.8% of the 120 cm2. Detector overlaps within one plane have been used to determine the alignment of the components of the plane itself, without need for track reconstruction using external detectors. It is the first time that such a big surface covered with active pixels has been used in a physics experiment. Some aspects concerning inclined particle tracks and time walk have been measured separately in a beam test at the CERN SPS H6 beam.

  11. Studies on a 300 k pixel detector telescope

    International Nuclear Information System (INIS)

    Middelkamp, P.; Antinori, F.; Barberis, D.

    1996-01-01

    Four silicon pixel detector planes are combined to form a tracking telescope in the lead ion experiment WA97 at CERN with 290 304 sensitive elements each of 75 μm by 500 μm area. An electronic pulse processing circuit is associated with each individual sensing element and the response for ionizing particles is binary with an adjustable threshold. The noise rate for a threshold of 6000 e - has been measured to be less than 10 -10 . The inefficient area due to malfunctioning pixels is 2.8% of the 120 cm 2 . Detector overlaps within one plane have been used to determine the alignment of the components of the plane itself, without need for track reconstruction using external detectors. It is the first time that such a big surface covered with active pixels has been used in a physics experiment. Some aspects concerning inclined particle tracks and time walk have been measured separately in a beam test at the CERN SPS H6 beam. (orig.)

  12. Gamma Spectroscopy with Pixellated CdZnTe Gamma Detectors

    International Nuclear Information System (INIS)

    Shor, A.; Mardor, I.; Eisen, Y.

    2002-01-01

    Pixellated CdZnTe detectors are good candidates for room temperature gamma detection requiring spectroscopic performance with imaging capabilities. The CdZnTe materials possess high resistivity and good electron charge transport properties. The poor charge transport for the holes inherent in the CdZnTe material can be circumvented by fabricating the electrodes in any one of a number of structures designed for unipolar charge detection[1]. Recent interest in efficient gamma detection at relatively higher gamma energies has imposed more stringent demands on the CdZnTe material and on detector design and optimization. We developed at Soreq a technique where signals from all pixels and from the common electrode are processed, and then a correction is applied for improving the energy resolution and the photopeak efficiency. For illumination with an un-collimated 133 Ba source , we obtain a combined detector energy resolution of 5.0 % FWHM for the 81 keV peak, and 1.5 % FWHM for the 356 keV peak. We discuss the importance of detector material with high electron (μτ) e for thick Pixellated detectors

  13. Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

    CERN Document Server

    Ducourthial, Audrey; The ATLAS collaboration

    2017-01-01

    Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of $10^{15} n_{eq}/cm^2$ and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside...

  14. Modeling radiation damage to pixel sensors in the ATLAS detector

    CERN Document Server

    Ducourthial, Audrey; The ATLAS collaboration

    2017-01-01

    Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of $10^{15}n_{eq}/cm^2$ and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside ...

  15. Geneva University: Pixel Detectors – trends and options for the future

    CERN Multimedia

    Geneva University

    2012-01-01

    GENEVA UNIVERSITY École de physique Département de physique nucléaire et corspusculaire 24, quai Ernest-Ansermet 1211 Genève 4 Tél.: (022) 379 62 73 Fax: (022) 379 69 92   Wednesday 25 April 2012 SEMINAIRE DE PHYSIQUE CORPUSCULAIRE Science III, Auditoire 1S081 30Science III, Auditoire 1S081 30 Pixel Detectors – trends and options for the future Prof. Norbert Wermes - University of Bonn  Pixel detectors have been invented in the early 90s with the advancement of micro technologies. With the advent of the LHC, big vertex detectors have demonstrated that the pixel detector type is holding many of the promises it had made before. Meanwhile new, different or just improved variants of the pixel technology are being studied for their suitability for future experiments or experiment upgrades. The talk will address the various pro's and con's comparing hybrid and monolithic pixel technologies and their su...

  16. Development of a DC-DC conversion powering scheme for the CMS Phase-1 pixel upgrade

    CERN Document Server

    Feld, Lutz Werner; Karpinski, Waclaw; Klein, Katja; Lipinski, Martin; Preuten, Marius; Max Rauch; Rittich, David Michael; Sammet, Jan Domenik; Wlochal, Michael

    2014-01-01

    A novel powering scheme based on the DC-DC conversion technique will be exploited to power the CMS Phase-1 pixel detector. DC-DC buck converters for the CMS pixel project have been developed, based on the AMIS5 ASIC designed by CERN. The powering system of the Phase-1 pixel detector is described and the performance of the converter prototypes is detailed, including power efficiency, stability of the output voltage, shielding, and thermal management. Results from a test of the magnetic field tolerance of the DC-DC converters are reported. System tests with pixel modules using many components of the future pixel barrel system are summarized. Finally first impressions from a pre-series of 200 DC-DC converters are presented.

  17. X-ray micro-beam characterization of a small pixel spectroscopic CdTe detector

    Science.gov (United States)

    Veale, M. C.; Bell, S. J.; Seller, P.; Wilson, M. D.; Kachkanov, V.

    2012-07-01

    A small pixel, spectroscopic, CdTe detector has been developed at the Rutherford Appleton Laboratory (RAL) for X-ray imaging applications. The detector consists of 80 × 80 pixels on a 250 μm pitch with 50 μm inter-pixel spacing. Measurements with an 241Am γ-source demonstrated that 96% of all pixels have a FWHM of better than 1 keV while the majority of the remaining pixels have FWHM of less than 4 keV. Using the Diamond Light Source synchrotron, a 10 μm collimated beam of monochromatic 20 keV X-rays has been used to map the spatial variation in the detector response and the effects of charge sharing corrections on detector efficiency and resolution. The mapping measurements revealed the presence of inclusions in the detector and quantified their effect on the spectroscopic resolution of pixels.

  18. The hardware of the ATLAS Pixel Detector Control System

    International Nuclear Information System (INIS)

    Henss, T; Andreani, A; Boek, J; Boyd, G; Citterio, M; Einsweiler, K; Kersten, S; Kind, P; Lantzsch, K; Latorre, S; Maettig, P; Meroni, C; Sabatini, F; Schultes, J

    2007-01-01

    The innermost part of the ATLAS (A Toroidal LHC ApparatuS) experiment, which is currently under construction at the LHC (Large Hadron Collider), will be a silicon pixel detector comprised of 1744 individual detector modules. To operate these modules, the readout electronics, and other detector components, a complex power supply and control system is necessary. The specific powering and control requirements, as well as the custom made components of our power supply and control systems, are described. These include remotely programmable regulator stations, the power supply system for the optical transceivers, several monitoring units, and the Interlock System. In total, this comprises the Pixel Detector Control System (DCS)

  19. Tracking performance of a single-crystal and a polycrystalline diamond pixel-detector

    Energy Technology Data Exchange (ETDEWEB)

    Menasce, D.; et al.

    2013-06-01

    We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke$-$), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

  20. Angular resolution of the gaseous micro-pixel detector Gossip

    Science.gov (United States)

    Bilevych, Y.; Blanco Carballo, V.; van Dijk, M.; Fransen, M.; van der Graaf, H.; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S.; Rogers, M.; Romaniouk, A.; Veenhof, R.

    2011-06-01

    Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO 2 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

  1. Angular resolution of the gaseous micro-pixel detector Gossip

    Energy Technology Data Exchange (ETDEWEB)

    Bilevych, Y.; Blanco Carballo, V.; Dijk, M. van; Fransen, M.; Graaf, H. van der; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S. [Nikhef, P.O. Box 41882, 1009 DB Amsterdam (Netherlands); Rogers, M. [Radboud University, P.O. Box 9102, 6500HC Nijmegen (Netherlands); Romaniouk, A.; Veenhof, R. [CERN, CH-1211, Geneve 23 (Switzerland)

    2011-06-15

    Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO{sub 2} 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

  2. Angular resolution of the gaseous micro-pixel detector Gossip

    International Nuclear Information System (INIS)

    Bilevych, Y.; Blanco Carballo, V.; Dijk, M. van; Fransen, M.; Graaf, H. van der; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S.; Rogers, M.; Romaniouk, A.; Veenhof, R.

    2011-01-01

    Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO 2 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

  3. 3D silicon pixel detectors for the High-Luminosity LHC

    CERN Document Server

    Lange, J.

    2016-01-01

    3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.

  4. The Phase II ATLAS Pixel Upgrade: The Inner Tracker (ITk)

    CERN Document Server

    Flick, Tobias; The ATLAS collaboration

    2016-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the ITk (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. The total surface area of silicon in the new pixel system could measure up to 14 m^2, depending on the final layout choice, which is expected to take place in early 2017. Four layout options are being investigated at the moment, two with forward coverage to eta < 3.2 and two to eta < 4. For each coverage option, a layout with long barrel staves and a layout with novel inclined support structures in the barrel-endcap overlap region are considered. All potential layouts include modules mounted on ring-shaped supports in the endcap regions. Support...

  5. 3D track reconstruction capability of a silicon hybrid active pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri [Czech Technical University in Prague, Institute of Experimental and Applied Physics, Praha (Czech Republic); Burian, Petr; Broulim, Pavel [Czech Technical University in Prague, Institute of Experimental and Applied Physics, Praha (Czech Republic); University of West Bohemia, Faculty of Electrical Engineering, Pilsen (Czech Republic); Jakubek, Jan [Advacam s.r.o., Praha (Czech Republic)

    2017-06-15

    Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 x 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for ''4D'' particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation (x,y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm. (orig.)

  6. 3D track reconstruction capability of a silicon hybrid active pixel detector

    Science.gov (United States)

    Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri; Burian, Petr; Broulim, Pavel; Jakubek, Jan

    2017-06-01

    Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 × 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for "4D" particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation ( x, y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm.

  7. Si and gaas pixel detectors for medical imaging applications

    International Nuclear Information System (INIS)

    Bisogni, M. G.

    2001-01-01

    As the use of digital radiographic equipment in the morphological imaging field is becoming the more and more diffuse, the research of new and more performing devices from public institutions and industrial companies is in constant progress. Most of these devices are based on solid-state detectors as X-ray sensors. Semiconductor pixel detectors, originally developed in the high energy physics environment, have been then proposed as digital detector for medical imaging applications. In this paper a digital single photon counting device, based on silicon and GaAs pixel detector, is presented. The detector is a thin slab of semiconductor crystal where an array of 64 by 64 square pixels, 170- m side, has been built on one side. The data read-out is performed by a VLSI integrated circuit named Photon Counting Chip (PCC), developed within the MEDIPIX collaboration. Each chip cell geometrically matches the sensor pixel. It contains a charge preamplifier, a threshold comparator and a 15 bits pseudo-random counter and it is coupled to the detector by means of bump bonding. Most important advantages of such system, with respect to a traditional X-rays film/screen device, are the wider linear dynamic range (3x104) and the higher performance in terms of MTF and DQE. Besides the single photon counting architecture allows to detect image contrasts lower than 3%. Electronics read-out performance as well as imaging capabilities of the digital device will be presented. Images of mammographic phantoms acquired with a standard Mammographic tube will be compared with radiographs obtained with traditional film/screen systems

  8. A silicon pixel detector with routing for external VLSI read-out

    International Nuclear Information System (INIS)

    Thomas, S.L.; Seller, P.

    1988-07-01

    A silicon pixel detector with an array of 32 by 16 hexagonal pixels has been designed and is being built on high resistivity silicon. The detector elements are reverse biased diodes consisting of p-implants in an n-type substrate and are fully depleted from the front to the back of the wafer. They are intended to measure high energy ionising particles traversing the detector. The detailed design of the pixels, their layout and method of read-out are discussed. A number of test structures have been incorporated onto the wafer to enable measurements to be made on individual pixels together with a variety of active devices. The results will give a better understanding of the operation of the pixel array, and will allow testing of computer simulations of more elaborate structures for the future. (author)

  9. Modelling of the small pixel effect in gallium arsenide X-ray imaging detectors

    CERN Document Server

    Sellin, P J

    1999-01-01

    A Monte Carlo simulation has been carried out to investigate the small pixel effect in highly pixellated X-ray imaging detectors fabricated from semi-insulating gallium arsenide. The presence of highly non-uniform weighting fields in detectors with a small pixel geometry causes the majority of the induced signal to be generated when the moving charges are close to the pixellated contacts. The response of GaAs X-ray imaging detectors is further complicated by the presence of charge trapping, particularly of electrons. In this work detectors are modelled with a pixel pitch of 40 and 150 mu m, and with thicknesses of 300 and 500 mu m. Pulses induced in devices with 40 mu m pixels are due almost totally to the movement of the lightly-trapped holes and can exhibit significantly higher charge collection efficiencies than detectors with large electrodes, in which electron trapping is significant. Details of the charge collection efficiencies as a function of interaction depth in the detector and of the incident phot...

  10. Operational Experience and Performance with the ATLAS Pixel detector

    CERN Document Server

    Martin, Christopher Blake; The ATLAS collaboration

    2018-01-01

    The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of $1.3\\times10^{34}\\text{cm}^{{-2}}\\text{s}^{{-1}}$ recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarized, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described, with special emphasis to radiation damage experience.

  11. Operational Experience and Performance with the ATLAS Pixel detector

    CERN Document Server

    Martin, Christopher Blake; The ATLAS collaboration

    2018-01-01

    The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of 1.3 x 10^34 cm-2 s-1 recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described, with special emphasis to radiation damage experience.

  12. PROTON RADIOGRAPHY WITH THE PIXEL DETECTOR TIMEPIX

    Directory of Open Access Journals (Sweden)

    Václav Olšanský

    2016-12-01

    Full Text Available This article presents the processing of radiographic data acquired using the position-sensitive hybrid semiconductor pixel detector Timepix. Measurements were made on thin samples at the medical ion-synchrotron HIT [1] in Heidelberg (Germany with a 221 MeV proton beam. The charge is energy by the particles crossing the sample is registered for generation of image contrast. Experimental data from the detector were processed for derivation of the energy loss of each proton using calibration matrices. The interaction point of the protons on the detector were determined with subpixel resolution by model fitting of the individual signals in the pixelated matrix. Three methods were used for calculation of these coordinates: Hough transformation, 2D Gaussian fitting and estimate the 2D mean. Parameters of calculation accuracy and calculation time are compared for each method. The final image was created by method with best parameters.

  13. Modeling radiation damage to pixel sensors in the ATLAS detector

    Science.gov (United States)

    Ducourthial, A.

    2018-03-01

    Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC) . As the closest detector component to the interaction point, these detectors will be subject to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC) [1], the innermost layers will receive a fluence in excess of 1015 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is essential in order to make accurate predictions for current and future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects on the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside early studies with LHC Run 2 proton-proton collision data.

  14. Silicon Sensors for the Upgrades of the CMS Pixel Detector

    CERN Document Server

    Centis Vignali, Matteo; Schleper, Peter

    2015-01-01

    The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accel- erator and its injection chain. Two major upgrades will take place in the next years. The rst upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2 10 34 cm-2 s-1 A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5 10 34 cm-2 s1. As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The rst upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout elec- tronics that allow ecient data taking up to a luminosity of 2 10 34 cm-2s-1,twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at dierent institutes. Ham...

  15. Leakage current measurements on pixelated CdZnTe detectors

    International Nuclear Information System (INIS)

    Dirks, B.P.F.; Blondel, C.; Daly, F.; Gevin, O.; Limousin, O.; Lugiez, F.

    2006-01-01

    In the field of the R and D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9x0.9 mm 2 ) or 256 (0.5x0.5 mm 2 ) pixels, surrounded by a guard ring and operate in the energy ranging from several keV to 1 MeV, at temperatures between -20 and +20 o C. A critical parameter in the characterisation of these detectors is the leakage current per pixel under polarisation (∼50-500 V/mm). In operation mode each pixel will be read-out by an integrated spectroscopy channel of the multi-channel IDeF-X ASIC currently developed in our lab. The design and functionality of the ASIC depends directly on the direction and value of the current. A dedicated and highly insulating electronics circuit is designed to automatically measure the current in each individual pixel, which is in the order of tens of pico-amperes. Leakage current maps of different CdZnTe detectors of 2 and 6 mm thick and at various temperatures are presented and discussed. Defect density diagnostics have been performed by calculation of the activation energy of the material

  16. Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

    Energy Technology Data Exchange (ETDEWEB)

    Talla, Patrick Takoukam

    2011-04-07

    The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 {mu}m. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

  17. Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

    International Nuclear Information System (INIS)

    Talla, Patrick Takoukam

    2011-01-01

    The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 μm. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

  18. Geometry simulation and physics with the CMS forward pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Parashar, N [Purdue University Calumet, Hammond, Indiana (United States)], E-mail: Neeti@fnal.gov

    2008-06-15

    The Forward Pixel Detector of CMS is an integral part of the Tracking system, which will play a key role in addressing the full physics potential of the collected data. It has a very complex geometry that encompasses multilayer structure of its detector modules. This presentation describes the development of geometry simulation for the Forward Pixel Detector. A new geometry package has been developed, which uses the detector description database (DDD) interface for the XML (eXtensive Markup Language) to GEANT simulation. This is necessary for digitization and GEANT4 reconstruction software for tracking. The expected physics performance is also discussed.

  19. Geometry simulation and physics with the CMS forward pixel detector

    International Nuclear Information System (INIS)

    Parashar, N

    2008-01-01

    The Forward Pixel Detector of CMS is an integral part of the Tracking system, which will play a key role in addressing the full physics potential of the collected data. It has a very complex geometry that encompasses multilayer structure of its detector modules. This presentation describes the development of geometry simulation for the Forward Pixel Detector. A new geometry package has been developed, which uses the detector description database (DDD) interface for the XML (eXtensive Markup Language) to GEANT simulation. This is necessary for digitization and GEANT4 reconstruction software for tracking. The expected physics performance is also discussed

  20. STAR PIXEL detector mechanical design

    Energy Technology Data Exchange (ETDEWEB)

    Wieman, H H; Anderssen, E; Greiner, L; Matis, H S; Ritter, H G; Sun, X; Szelezniak, M [Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States)], E-mail: hhwieman@lbl.gov

    2009-05-15

    A high resolution pixel detector is being designed for the STAR [1] experiment at RHIC. This device will use MAPS as the detector element and will have a pointing accuracy of {approx}25 microns. We will be reporting on the mechanical design required to support this resolution. The radiation length of the first layer ({approx}0.3% X{sub 0}) and its distance from the interaction point (2.5 cm) determines the resolution. The design makes use of air cooling and thin carbon composite structures to limit the radiation length. The mechanics are being developed to achieve spatial calibrations and stability to 20 microns and to permit rapid detector replacement in event of radiation damage or other potential failures from operation near the beam.

  1. Optimization of detector pixel size for stent visualization in x-ray fluoroscopy

    International Nuclear Information System (INIS)

    Jiang Yuhao; Wilson, David L.

    2006-01-01

    Pixel size is of great interest in the flat-panel detector design because of its potential impact on image quality. In the particular case of angiographic x-ray fluoroscopy, small pixels are required in order to adequately visualize interventional devices such as guidewires and stents which have wire diameters as small as 200 and 50 μm, respectively. We used quantitative experimental and modeling techniques to investigate the optimal pixel size for imaging stents. Image quality was evaluated by the ability of subjects to perform two tasks: detect the presence of a stent and discriminate a partially deployed stent from a fully deployed one in synthetic images. With measurements at 50, 100, 200, and 300 μm, the 100 μm pixel size gave the maximum contrast sensitivity for the detection experiment with the idealized direct detector. For an idealized indirect detector with a scintillating layer, an optimal pixel size was obtained at 200 μm pixel size. A channelized human observer model predicted a peak at 150 and 170 μm, for the idealized direct and indirect detectors, respectively. With regard to the stent deployment task for both detector types, smaller pixel sizes are favored and there is a steep drop in performance with larger pixels. In general, with the increasing exposures, the model and measurements give the enhanced contrast sensitivities and a smaller optimal pixel size. The effects of electronic noise and fill factor were investigated using the model. We believe that the experimental results and human observer model predications can help guide the flat-panel detector design. In addition, the human observer model should work on the similar images and be applicable to the future model and actual flat-panel implementations

  2. Test-beam results of a SOI pixel detector prototype

    CERN Document Server

    Bugiel, Roma; Dannheim, Dominik; Fiergolski, Adrian; Hynds, Daniel; Idzik, Marek; Kapusta, P; Kucewicz, Wojciech; Munker, Ruth Magdalena; Nurnberg, Andreas Matthias

    2018-01-01

    This paper presents the test-beam results of a monolithic pixel-detector prototype fabricated in 200 nm Silicon-On-Insulator (SOI) CMOS technology. The SOI detector was tested at the CERN SPS H6 beam line. The detector is fabricated on a 500 μm thick high-resistivity float- zone n-type (FZ-n) wafer. The pixel size is 30 μm × 30 μm and its readout uses a source- follower configuration. The test-beam data are analysed in order to compute the spatial resolution and detector efficiency. The analysis chain includes pedestal and noise calculation, cluster reconstruction, as well as alignment and η-correction for non-linear charge sharing. The results show a spatial resolution of about 4.3 μm.

  3. A MCM-D-type module for the ATLAS pixel detector

    CERN Document Server

    Becks, K H; Ehrmann, O; Gerlach, P; Gregor, I M; Pieters, P; Topper, M; Truzzi, C; Wolf, J

    1999-01-01

    For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel $9 detector. A module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 read out IC's, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and $9 power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.

  4. Development of the MCM-D technique for pixel detector modules

    CERN Document Server

    Grah, Christian

    2005-01-01

    This thesis treats a copper--polymer based thin film technology, the MCM-D technique and its application when building hybrid pixel detector modules. The ATLAS experiment at the LHC will be equipped with a pixel detector system. The basic mechanical units of the pixel detector are multi chip modules. The main components of these modules are: 16 electronic chips, a controller chip and a large sensor tile, featuring more than 46000 sensor cells. MCM-D is a superior technique to build the necessary signal bus system and the power distribution system directly on the active sensor tile. In collaboration with the Fraunhofer Institute for Reliability and Microintegration, IZM, the thin film process is reviewed and enhanced. The multi layer system was designed and optimized for the interconnection system as well as for the 46000 pixel contacts. Laboratory measurements on prototypes prove that complex routing schemes for geometrically optimized single chips are suitable and have negligible influence on the front--end ...

  5. The Upgraded Pixel Detector of the ATLAS Experiment for Run-2 at the LHC

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00084948; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130 nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented using collision data.

  6. Online Calibration and Performance of the ATLAS Pixel Detector

    CERN Document Server

    Keil, M

    2011-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 million electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. This paper describes the tuning and calibration of the optical links and the detector modules, including measurements of threshold, noise, charge measurement, timing performance and the sensor leakage current.

  7. Alignment of the upgraded CMS pixel detector

    CERN Document Server

    Schroder, Matthias

    2018-01-01

    The all-silicon tracking system of the CMS experiment provides excellent resolution for charged tracks and an efficient tagging of heavy-flavour jets. After a new pixel detector has been installed during the LHC technical stop at the beginning of 2017, the positions, orientations, and surface curvatures of the sensors needed to be determined with a precision at the order of a few micrometres to ensure the required physics performance. This is far beyond the mechanical mounting precision but can be achieved using a track-based alignment procedure that minimises the track-hit residuals of reconstructed tracks. The results are carefully validated with data-driven methods. In this article, results of the CMS tracker alignment in 2017 from the early detector-commissioning phase and the later operation are presented, that were derived using several million reconstructed tracks in pp-collision and cosmic-ray data. Special emphasis is put on the alignment of the new pixel detector.

  8. ID Barrel installed in cryostat

    CERN Multimedia

    Apsimon, R.; Romaniouk, A.

    Wednesday 23rd August was a memorable day for the Inner Detector community as they witnessed the transport and installation of the central part of the inner detector (ID-barrel) into the ATLAS detector. Many members of the collaboration gathered to witness this moment at Point 1. After years of design, construction and commissioning, the outer two detectors (TRT and SCT) of the ID barrel were moved from the SR1 cleanroom to the ATLAS cavern. The barrel was moved across the car park from building 2175 to SX1. Although only a journey of about 100 metres, this required weeks of planning and some degree of luck as far as the weather was concerned. Accelerometers were fitted to the barrel to provide real-time monitoring and no values greater than 0.1 g were recorded, fully satisfying the transport specification for this extremely precise and fragile detector. Muriel, despite her fear of heights, bravely volunteered to keep a close eye on the detector. Swapping cranes to cross the entire parking lot, while Mur...

  9. The Dosepix detector—an energy-resolving photon-counting pixel detector for spectrometric measurements

    CERN Document Server

    Zang, A; Ballabriga, R; Bisello, F; Campbell, M; Celi, J C; Fauler, A; Fiederle, M; Jensch, M; Kochanski, N; Llopart, X; Michel, N; Mollenhauer, U; Ritter, I; Tennert, F; Wölfel, S; Wong, W; Michel, T

    2015-01-01

    The Dosepix detector is a hybrid photon-counting pixel detector based on ideas of the Medipix and Timepix detector family. 1 mm thick cadmium telluride and 300 μm thick silicon were used as sensor material. The pixel matrix of the Dosepix consists of 16 x 16 square pixels with 12 rows of (200 μm)2 and 4 rows of (55 μm)2 sensitive area for the silicon sensor layer and 16 rows of pixels with 220 μm pixel pitch for CdTe. Besides digital energy integration and photon-counting mode, a novel concept of energy binning is included in the pixel electronics, allowing energy-resolved measurements in 16 energy bins within one acquisition. The possibilities of this detector concept range from applications in personal dosimetry and energy-resolved imaging to quality assurance of medical X-ray sources by analysis of the emitted photon spectrum. In this contribution the Dosepix detector, its response to X-rays as well as spectrum measurements with Si and CdTe sensor layer are presented. Furthermore, a first evaluation wa...

  10. Pixellated thallium bromide detectors for gamma-ray spectroscopy and imaging

    Energy Technology Data Exchange (ETDEWEB)

    Onodera, T. E-mail: tosiyuki@smail.tohtech.ac.jp; Hitomi, K.; Shoji, T.; Hiratate, Y

    2004-06-01

    Recently, pixellated semiconductor detectors exhibit high-energy resolution, which have been studied actively and fabricated from CdTe, CZT and HgI{sub 2}. Thallium bromide (TlBr) is a compound semiconductor characterized with its high atomic numbers (Tl=81, Br=35) and high density (7.56 g/cm{sup 3}). Thus, TlBr exhibits higher photon stopping power than other semiconductor materials used for radiation detector fabrication such as CdTe, CZT and HgI{sub 2}. The wide band gap of TlBr (2.68 eV) permits the detectors low-noise operation at around room temperature. Our studies made an effort to fabricate pixellated TlBr detectors had sufficient detection efficiency and good charge collection efficiency. In this study, pixellated TlBr detectors were fabricated from the crystals purified by the multipass zone-refining method and grown by the horizontal traveling molten zone (TMZ) method. The TlBr detector has a continuous cathode over one crystal surface and 3x3 pixellated anodes (0.57x0.57 mm{sup 2} each) surrounded by a guard ring on the opposite surface. The electrodes were realized by vacuum evaporation of palladium through a shadow mask. Typical thickness of the detector was 2 mm. Spectrometric performance of the TlBr detectors was tested by irradiating them with {sup 241}Am (59.5 keV), {sup 57}Co (122 keV) and {sup 137}Cs (662 keV) gamma-ray sources at temperature of -20 deg. C. Energy resolutions (FWHM) were measured to be 4.0, 6.0 and 9.7 keV for 59.5, 122 and 662 keV gamma-rays, respectively.

  11. Gas filled prototype of a CdZnTe pixel detector

    International Nuclear Information System (INIS)

    Ramsey, B.; Sharma, D.; Sipila, H.; Gostilo, V.; Loupilov, A.

    2001-01-01

    CdZnTe pixel structures are currently the most promising detectors for the focal planes of hard X-ray telescopes, for astronomical observation in the range 5-100 keV. In Sharma et al. (Proc. SPIE 3765 (1999) 822) and Ramsey et al. (Nucl. Instrum. Methods A 458 (2001) 55) we presented preliminary results on the development of prototype 4x4 CdZnTe imaging detectors operated under vacuum. These pixel detectors were installed inside vacuum chambers on three-stage Peltier coolers providing detector temperatures down to -40 deg. C. A miniature sputter ion pump inside each chamber maintained the necessary vacuum of 10 -5 Torr. At a temperature of -20 deg. C we achieved an FWHM energy resolution of between 2% and 3% at 60 keV and ∼15% at 5.9 keV; however, the dependency on temperature was weak and at +20 deg. C the respective resolutions were 3% and 20%. As the detectors could be operated at room temperature without loss of their good characteristics it was possible to exclude the sputter ion pump and fill the chamber with dry nitrogen instead. We have tested a nitrogen-filled CdZnTe (5x5x1 mm 3 ) prototype having 0.65x0.65 mm 2 readout pads on a 0.75 mm pitch. The interpixel resistance at an applied voltage of 10 V was higher than 50 GΩ and the pixel leakage currents at room temperature with a bias of 200 V between each pad and the common electrode did not exceed 0.8 nA. The pixel detector inside the microassembly, which also contained the input stages of the preamplifiers, was installed on a Peltier cooler to maintain the detector temperature at +20 deg. C. To define real leakage currents of the pixels in their switched-on state we have checked the voltage on the preamplifiers feedback resistors. The resulting currents were 10-50 pA at a detector bias of 500 V. Under test, the typical energy resolution per pixel at +20 deg. C was ∼3% at energy 59.6 keV and ∼20% at energy 5.9 keV, which are similar to the values obtained in the vacuum prototype at room temperature

  12. Fabrication of ATLAS pixel detector prototypes at IRST

    International Nuclear Information System (INIS)

    Boscardin, M.; Betta, G.-F. Dalla; Gregori, P.; Zen, M.; Zorzi, N.

    2001-01-01

    We report on the development of a fabrication technology for n-on-n silicon pixel detectors oriented to the ATLAS experiment at LHC. The main processing issues and some selected results from the electrical characterization of detector prototypes and related test structures are presented and discussed

  13. arXiv Performance verification of the CMS Phase-1 Upgrade Pixel detector

    CERN Document Server

    Veszpremi, Viktor

    2017-12-04

    The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius and up to 280 cm along the beam axis. The pixel detector consists of 124 million pixels, corresponding to about 2 m 2 total area. It plays a vital role in the seeding of the track reconstruction algorithms and in the reconstruction of primary interactions and secondary decay vertices. It is surrounded by the strip tracker with 10 million read-out channels, corresponding to 200 m 2 total area. The tracker is operated in a high-occupancy and high-radiation environment established by particle collisions in the LHC . The current strip detector continues to perform very well. The pixel detector that has been used in Run 1 and in the first half of Run 2 was, however, replaced with the so-called Phase-1 Upgrade detector. The new system is better suited to match the increased inst...

  14. Design and Performance of the CMS Pixel Detector Readout Chip

    CERN Document Server

    Kästli, H C; Erdmann, W; Hörmann, C; Horisberger, R P; Kotlinski, D; Meier, B; Hoermann, Ch.

    2006-01-01

    The readout chip for the CMS pixel detector has to deal with an enormous data rate. On-chip zero suppression is inevitable and hit data must be buffered locally during the latency of the first level trigger. Dead-time must be kept at a minimum. It is dominated by contributions coming from the readout. To keep it low an analog readout scheme has been adopted where pixel addresses are analog coded. We present the architecture of the final CMS pixel detector readout chip with special emphasis on the analog readout chain. Measurements of its performance are discussed.

  15. Initial Measurements on Pixel Detector Modules for the ATLAS Upgrades

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2011-01-01

    Delicate conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel Detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming Pixel Detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation for silicon planar and 3D pixel sensors, which give a first impression on the charge collection properties of the different sensor technologies, are presented.

  16. ATLAS rewards two pixel detector suppliers

    CERN Multimedia

    2007-01-01

    Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

  17. Optical data links for the ATLAS SCT and Pixel Detector

    International Nuclear Information System (INIS)

    Gregor, I.M.; Weidberg, A.R.; Lee, S.C.; Chu, M.L.; Teng, P.K.

    2001-01-01

    ATLAS (The ATLAS Technical Proposal, CERN/LHCC 94-33) is one of the large electronic particle detectors at LHC (The LHC Conceptual Design, Report- The Yellow Book, CERN/AC/95-05(LHC)) which will become operational in 2005. It is planned to use radiation tolerant optical links for the data transfer from the SemiConductor Tracker (SCT) (ATLAS Inner Detector Technical Proposal, CERN/LHCC 97-16 and CERN/LHCC 97-17). and Pixel Detector (ATLAS Pixel Detector Technical Proposal, CERN/LHCC 98-13) systems to the acquisition electronics over a distance up to 140m. The overall architecture and the performance of these optical data links are described. One of the three candidate designs for an on-detector Opto-Package is presented

  18. Studies of mono-crystalline CVD diamond pixel detectors

    CERN Document Server

    Bartz, E; Atramentov, O; Yang, Z; Hall-Wilton, R; Schnetzer, S; Patel, R; Bugg, W; Hebda, P; Halyo, V; Hunt, A; Marlow, D; Steininger, H; Ryjov, V; Hits, D; Spanier, S; Pernicka, M; Johns, W; Doroshenko, J; Hollingsworth, M; Harrop, B; Farrow, C; Stone, R

    2011-01-01

    The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLTs mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope. Published by Elsevier B.V.

  19. Studies of mono-crystalline CVD diamond pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Bugg, W. [University of Tennessee, Knoxville (United States); Hollingsworth, M., E-mail: mhollin3@utk.edu [University of Tennessee, Knoxville (United States); Spanier, S.; Yang, Z. [University of Tennessee, Knoxville (United States); Bartz, E.; Doroshenko, J.; Hits, D.; Schnetzer, S.; Stone, R.; Atramentov, O.; Patel, R.; Barker, A. [Rutgers University, Piscataway (United States); Hall-Wilton, R.; Ryjov, V.; Farrow, C. [CERN, Geneva (Switzerland); Pernicka, M.; Steininger, H. [HEPHY, Vienna (Austria); Johns, W. [Vanderbilt University, Nashville (United States); Halyo, V.; Harrop, B. [Princeton University, Princeton (United States); and others

    2011-09-11

    The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLT's mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope.

  20. Silicon sensors for the upgrades of the CMS pixel detector

    International Nuclear Information System (INIS)

    Centis Vignali, Matteo

    2015-12-01

    The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accelerator and its injection chain. Two major upgrades will take place in the next years. The first upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2.10 34 cm -2 s -1 . A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5.10 34 cm -2 s -1 . As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The first upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout electronics that allow efficient data taking up to a luminosity of 2.10 34 cm -2 s -1 , twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at different institutes. Hamburg (University and DESY) is responsible for the production of 350 pixel modules. The second upgrade (phase II) of the pixel detector is foreseen for 2025. The innermost pixel layer of the upgraded detector will accumulate a radiation damage corresponding to an equivalent fluence of Φ eq =2.10 16 cm -2 and a dose of ∼10 MGy after an integrated luminosity of 3000 fb -1 . Several groups are investigating sensor designs and configurations able to withstand such high doses and fluences. This work is divided into two parts related to important aspects of the upgrades of the CMS pixel detector. For the phase I upgrade, a setup has been developed to provide an absolute energy calibration of the pixel modules that will constitute the detector. The calibration is obtained using monochromatic X-rays. The same setup is used to test the buffering capabilities of the modules' readout chip. The maximum rate experienced by the modules produced in

  1. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation.

    Science.gov (United States)

    Philipp, Hugh T; Tate, Mark W; Purohit, Prafull; Shanks, Katherine S; Weiss, Joel T; Gruner, Sol M

    2016-03-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8-12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10-100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.

  2. Performance verification of the CMS Phase-1 Upgrade Pixel detector

    Science.gov (United States)

    Veszpremi, V.

    2017-12-01

    The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius and up to 280 cm along the beam axis. The pixel detector consists of 124 million pixels, corresponding to about 2 m 2 total area. It plays a vital role in the seeding of the track reconstruction algorithms and in the reconstruction of primary interactions and secondary decay vertices. It is surrounded by the strip tracker with 10 million read-out channels, corresponding to 200 m 2 total area. The tracker is operated in a high-occupancy and high-radiation environment established by particle collisions in the LHC . The current strip detector continues to perform very well. The pixel detector that has been used in Run 1 and in the first half of Run 2 was, however, replaced with the so-called Phase-1 Upgrade detector. The new system is better suited to match the increased instantaneous luminosity the LHC would reach before 2023. It was built to operate at an instantaneous luminosity of around 2×1034 cm-2s-1. The detector's new layout has an additional inner layer with respect to the previous one; it allows for more efficient tracking with smaller fake rate at higher event pile-up. The paper focuses on the first results obtained during the commissioning of the new detector. It also includes challenges faced during the first data taking to reach the optimal measurement efficiency. Details will be given on the performance at high occupancy with respect to observables such as data-rate, hit reconstruction efficiency, and resolution.

  3. Development of the MCM-D technique for pixel detector modules

    International Nuclear Information System (INIS)

    Grah, C.

    2005-03-01

    This thesis treats a copper--polymer based thin film technology, the MCM-D technique and its application when building hybrid pixel detector modules. The ATLAS experiment at the LHC will be equipped with a pixel detector system. The basic mechanical units of the pixel detector are multi chip modules. The main components of these modules are: 16 electronic chips, a controller chip and a large sensor tile, featuring more than 46000 sensor cells. MCM-D is a superior technique to build the necessary signal bus system and the power distribution system directly on the active sensor tile. In collaboration with the Fraunhofer Institute for Reliability and Microintegration, IZM, the thin film process is reviewed and enhanced. The multi layer system was designed and optimized for the interconnection system as well as for the 46000 pixel contacts. Laboratory measurements on prototypes prove that complex routing schemes for geometrically optimized single chips are suitable and have negligible influence on the front--end chips performance. A full scale MCM-D module has been built and it is shown that the technology is suitable to build pixel detector modules. Further tests include the investigation of the impact of hadronic irradiation on the thin film layers. Single chip assemblies have been operated in a test beam environment and the feasibility of the optimization of the sensors could be shown. A review on the potential as well as the perspective for the MCM-D technique in future experiments is given

  4. Development of a High Dynamic Range Pixel Array Detector for Synchrotrons and XFELs

    Science.gov (United States)

    Weiss, Joel Todd

    Advances in synchrotron radiation light source technology have opened new lines of inquiry in material science, biology, and everything in between. However, x-ray detector capabilities must advance in concert with light source technology to fully realize experimental possibilities. X-ray free electron lasers (XFELs) place particularly large demands on the capabilities of detectors, and developments towards diffraction-limited storage ring sources also necessitate detectors capable of measuring very high flux [1-3]. The detector described herein builds on the Mixed Mode Pixel Array Detector (MM-PAD) framework, developed previously by our group to perform high dynamic range imaging, and the Adaptive Gain Integrating Pixel Detector (AGIPD) developed for the European XFEL by a collaboration between Deustsches Elektronen-Synchrotron (DESY), the Paul-Scherrer-Institute (PSI), the University of Hamburg, and the University of Bonn, led by Heinz Graafsma [4, 5]. The feasibility of combining adaptive gain with charge removal techniques to increase dynamic range in XFEL experiments is assessed by simulating XFEL scatter with a pulsed infrared laser. The strategy is incorporated into pixel prototypes which are evaluated with direct current injection to simulate very high incident x-ray flux. A fully functional 16x16 pixel hybrid integrating x-ray detector featuring several different pixel architectures based on the prototypes was developed. This dissertation describes its operation and characterization. To extend dynamic range, charge is removed from the integration node of the front-end amplifier without interrupting integration. The number of times this process occurs is recorded by a digital counter in the pixel. The parameter limiting full well is thereby shifted from the size of an integration capacitor to the depth of a digital counter. The result is similar to that achieved by counting pixel array detectors, but the integrators presented here are designed to tolerate a

  5. The simulation of charge sharing in semiconductor X-ray pixel detectors

    CERN Document Server

    Mathieson, K; O'Shea, V; Passmore, M S; Rahman, M; Smith, K M; Watt, J; Whitehill, C

    2002-01-01

    Two simulation packages were used to model the sharing of charge, due to the scattering and diffusion of carriers, between adjacent pixel elements in semiconductors X-ray detectors. The X-ray interaction and the consequent multiple scattering was modelled with the aid of the Monte Carlo package, MCNP. The resultant deposited charge distribution was then used to create the charge cloud profile in the finite element semiconductor simulation code MEDICI. The analysis of the current pulses induced on pixel electrodes for varying photon energies was performed for a GaAs pixel detector. For a pixel pitch of 25 mu m, the charge lost to a neighbouring pixel was observed to be constant, at 0.6%, through the energies simulated. Ultimately, a fundamental limit on the pixel element size for imaging and spectroscopic devices may be set due to these key physical principles.

  6. Development of a super B-factory monolithic active pixel detector-the Continuous Acquisition Pixel (CAP) prototypes

    International Nuclear Information System (INIS)

    Varner, G.; Barbero, M.; Bozek, A.; Browder, T.; Fang, F.; Hazumi, M.; Igarashi, A.; Iwaida, S.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanic, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.

    2005-01-01

    Over the last few years great progress has been made in the technological development of Monolithic Active Pixel Sensors (MAPS) such that upgrades to existing vertex detectors using this technology are now actively being considered. Future vertex detection at an upgraded KEK-B factory, already the highest luminosity collider in the world, will require a detector technology capable of withstanding the increased track densities and larger radiation exposures. Near the beam pipe the current silicon strip detectors have projected occupancies in excess of 100%. Deep sub-micron MAPS look very promising to address this problem. In the context of an upgrade to the Belle vertex detector, the major obstacles to realizing such a device have been concerns about radiation hardness and readout speed. Two prototypes implemented in the TSMC 0.35 μm process have been developed to address these issues. Denoted the Continuous Acquisition Pixel, or CAP, the two variants of this architecture are distinguished in that CAP2 includes an 8-deep sampling pipeline within each 22.5 μm 2 pixel. Preliminary test results and remaining R and D issues are presented

  7. Semiconductor pixel detectors for digital mammography

    International Nuclear Information System (INIS)

    Novelli, M.; Amendolia, S.R.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Venturelli, L.; Zucca, S.

    2003-01-01

    We present some results obtained with silicon and gallium arsenide pixel detectors to be applied in the field of digital mammography. Even though GaAs is suitable for medical imaging applications thanks to its atomic number, which allows a very good detection efficiency, it often contains an high concentrations of traps which decrease the charge collection efficiency (CCE). So we have analysed both electrical and spectroscopic performance of different SI GaAs diodes as a function of concentrations of dopants in the substrate, in order to find a material by which we can obtain a CCE allowing the detection of all the photons that interact in the detector. Nevertheless to be able to detect low contrast details, efficiency and CCE are not the only parameters to be optimized; also the stability of the detection system is fundamental. In the past we have worked with Si pixel detectors; even if its atomic number does not allow a good detection efficiency at standard thickness, it has a very high stability. So keeping in mind the need to increase the Silicon detection efficiency we performed simulations to study the behaviour of the electrical potential in order to find a geometry to avoid the risk of electrical breakdown

  8. Semiconductor pixel detectors for digital mammography

    Energy Technology Data Exchange (ETDEWEB)

    Novelli, M. E-mail: marzia.novelli@pi.infn.it; Amendolia, S.R.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Venturelli, L.; Zucca, S

    2003-08-21

    We present some results obtained with silicon and gallium arsenide pixel detectors to be applied in the field of digital mammography. Even though GaAs is suitable for medical imaging applications thanks to its atomic number, which allows a very good detection efficiency, it often contains an high concentrations of traps which decrease the charge collection efficiency (CCE). So we have analysed both electrical and spectroscopic performance of different SI GaAs diodes as a function of concentrations of dopants in the substrate, in order to find a material by which we can obtain a CCE allowing the detection of all the photons that interact in the detector. Nevertheless to be able to detect low contrast details, efficiency and CCE are not the only parameters to be optimized; also the stability of the detection system is fundamental. In the past we have worked with Si pixel detectors; even if its atomic number does not allow a good detection efficiency at standard thickness, it has a very high stability. So keeping in mind the need to increase the Silicon detection efficiency we performed simulations to study the behaviour of the electrical potential in order to find a geometry to avoid the risk of electrical breakdown.

  9. Defective pixel map creation based on wavelet analysis in digital radiography detectors

    International Nuclear Information System (INIS)

    Park, Chun Joo; Lee, Hyoung Koo; Song, William Y.; Achterkirchen, Thorsten Graeve; Kim, Ho Kyung

    2011-01-01

    The application of digital radiography detectors has attracted increasing attention in both medicine and industry. Since the imaging detectors are fabricated by semiconductor manufacturing process over large areas, defective pixels in the detectors are unavoidable. Moreover, the radiation damage due to the routine use of the detectors progressively increases the density of defective pixels. In this study, we present a method of identifying defective pixels in digital radiography detectors based on wavelet analysis. Artifacts generated due to wavelet transformations have been prevented by an additional local threshold method. The proposed method was applied to a sample digital radiography and the result was promising. The proposed method uses a single pair of dark and white images and does not require them to be corrected in gain-and-offset properties. This method will be helpful for the reliable use of digital radiography detectors through the working lifetime.

  10. Performance Studies of Pixel Hybrid Photon Detectors for the LHCb RICH Counters

    CERN Document Server

    Aglieri Rinella, G; Piedigrossi, D; Van Lysebetten, A

    2004-01-01

    The Pixel Hybrid Photon Detector is a vacuum tube with a multi-alkali photo cathode, high voltage cross-focused electron optics and an anode consisting of a silicon pixel detector bump-bonded to a readout CMOS electronic chip fully encapsulated in the device. The Pixel HPD fulfils the requirements of the Ring Imaging Cherenkov counters of the LHCb experiment at LHC. The performances of the Pixel HPD will be discussed with reference to laboratory measurements, Cherenkov light imaging in recent beam tests, image distortions due to a magnetic field.

  11. Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

    Energy Technology Data Exchange (ETDEWEB)

    Thil, Ch., E-mail: christophe.thil@ziti.uni-heidelberg.d [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Baron, A.Q.R. [RIKEN SPring-8 Center, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5148 (Japan); Fajardo, P. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France); Fischer, P. [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Graafsma, H. [DESY, Notkestrasse 85, 22607 Hamburg (Germany); Rueffer, R. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France)

    2011-02-01

    The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm{sup 2} active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280{mu}mx280{mu}m size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

  12. Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

    International Nuclear Information System (INIS)

    Thil, Ch.; Baron, A.Q.R.; Fajardo, P.; Fischer, P.; Graafsma, H.; Rueffer, R.

    2011-01-01

    The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm 2 active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280μmx280μm size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

  13. Hexagonal pixel detector with time encoded binary readout

    International Nuclear Information System (INIS)

    Hoedlmoser, H.; Varner, G.; Cooney, M.

    2009-01-01

    The University of Hawaii is developing continuous acquisition pixel (CAP) detectors for vertexing applications in lepton colliding experiments such as SuperBelle or ILC. In parallel to the investigation of different technology options such as MAPS or SOI, both analog and binary readout concepts have been tested. First results with a binary readout scheme in which the hit information is time encoded by means of a signal shifting mechanism have recently been published. This paper explains the hit reconstruction for such a binary detector with an emphasis on fake hit reconstruction probabilities in order to evaluate the rate capability in a high background environment such as the planned SuperB factory at KEK. The results show that the binary concept is at least comparable to any analog readout strategy if not better in terms of occupancy. Furthermore, we present a completely new binary readout strategy in which the pixel cells are arranged in a hexagonal grid allowing the use of three independent output directions to reduce reconstruction ambiguities. The new concept uses the same signal shifting mechanism for time encoding, however, in dedicated transfer lines on the periphery of the detector, which enables higher shifting frequencies. Detailed Monte Carlo simulations of full size pixel matrices including hit and BG generation, signal generation, and data reconstruction show that by means of multiple signal transfer lines on the periphery the pixel can be made smaller (higher resolution), the number of output channels and the data volume per triggered event can be reduced dramatically, fake hit reconstruction is lowered to a minimum and the resulting effective occupancies are less than 10 -4 . A prototype detector has been designed in the AMS 0.35μm Opto process and is currently under fabrication.

  14. Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

    International Nuclear Information System (INIS)

    Lehmann, N.; Kersten, S.; Zeitnitz, C.; Karagounis, M.

    2016-01-01

    The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

  15. Performance of the INTPIX6 SOI pixel detector

    International Nuclear Information System (INIS)

    Arai, Y.; Miyoshi, T.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Turala, M.; Kucewicz, W.

    2017-01-01

    Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ  m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241 Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e − . The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e − . The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

  16. Performance of the INTPIX6 SOI pixel detector

    Science.gov (United States)

    Arai, Y.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Kucewicz, W.; Miyoshi, T.; Turala, M.

    2017-01-01

    Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e-. The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e-. The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

  17. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Henss, Tobias

    2008-12-01

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts

  18. Characterization of active CMOS sensors for capacitively coupled pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Hirono, Toko; Gonella, Laura; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn (Germany); Peric, Ivan [Institut fuer Prozessdatenverarbeitung und Elektronik, Karlsruher Institut fuer Technologie, Karlsruhe (Germany)

    2015-07-01

    Active CMOS pixel sensor is one of the most attractive candidates for detectors of upcoming particle physics experiments. In contrast to conventional sensors of hybrid detectors, signal processing circuit can be integrated in the active CMOS sensor. The characterization and optimization of the pixel circuit are indispensable to obtain a good performance from the sensors. The prototype chips of the active CMOS sensor were fabricated in the AMS 180nm and L-Foundry 150 nm CMOS processes, respectively a high voltage and high resistivity technology. Both chips have a charge sensitive amplifier and a comparator in each pixel. The chips are designed to be glued to the FEI4 pixel readout chip. The signals from 3 pixels of the prototype chips are capacitively coupled to the FEI4 input pads. We have performed lab tests and test beams to characterize the prototypes. In this presentation, the measurement results of the active CMOS prototype sensors are shown.

  19. Development of a cylindrical tracking detector with multichannel scintillation fibers and pixelated photon detector readout

    Energy Technology Data Exchange (ETDEWEB)

    Akazawa, Y.; Miwa, K.; Honda, R.; Shiozaki, T.; Chiga, N.

    2015-07-01

    We are developing a cylindrical tracking detector for a Σp scattering experiment in J-PARC with scintillation fibers and the Pixelated Photon Detector (PPD) readout, which is called as cylindrical fiber tracker (CFT), in order to reconstruct trajectories of charged particles emitted inside CFT. CFT works not only as a tracking detector but also a particle identification detector from energy deposits. A prototype CFT consisting of two straight layers and one spiral layer was constructed. About 1100 scintillation fibers with a diameter of 0.75 mm (Kuraray SCSF-78 M) were used. Each fiber signal was read by Multi-Pixel Photon Counter (MPPC, HPK S10362-11-050P, 1×1 mm{sup 2}, 400 pixels) fiber by fiber. MPPCs were handled with Extended Analogue Silicon Photomultipliers Integrated ReadOut Chip (EASIROC) boards, which were developed for the readout of a large number of MPPCs. The energy resolution of one layer was 28% for a 70 MeV proton where the energy deposit in fibers was 0.7 MeV.

  20. Charge loss between contacts of CdZnTe pixel detectors

    International Nuclear Information System (INIS)

    Bolotnikov, A.E.; Cook, W.R.; Harrison, F.A.; Wong, A.-S.; Schindler, S.M.; Eichelberger, A.C.

    1999-01-01

    The surface of Cd 1-x Zn x Te (CZT) material has high resistivity but is not a perfect dielectric. Even a small surface conductivity can affect the electric field distribution, and therefore, the charge collection efficiency of a CZT pixel detector. The paper describes studies of this phenomenon for several contact configurations made on a single CZT detector. We have determined the maximum inter-contact separation at which the surface inter-pixel charge loss can be neglected. (author)

  1. Development of pixel detectors for SSC vertex tracking

    International Nuclear Information System (INIS)

    Kramer, G.; Shapiro, S.L.; Arens, J.F.; Jernigan, J.G.; Skubic, P.

    1991-04-01

    A description of hybrid PIN diode arrays and a readout architecture for their use as a vertex detector in the SSC environment is presented. Test results obtained with arrays having 256 x 256 pixels, each 30 μm square, are also presented. The development of a custom readout for the SSC will be discussed, which supports a mechanism for time stamping hit pixels, storing their xy coordinates, and storing the analog information within the pixel. The peripheral logic located on the array, permits the selection of those pixels containing interesting data and their coordinates to be selectively read out. This same logic also resolves ambiguous pixel ghost locations and controls the pixel neighbor read out necessary to achieve high spatial resolution. The thermal design of the vertex tracker and the proposed signal processing architecture will also be discussed. 5 refs., 13 figs., 3 tabs

  2. A gas pixel detector for X-ray imaging

    International Nuclear Information System (INIS)

    Bateman, J.E.; Connolly, J.F.

    1991-11-01

    A simple, robust form of gas pixel detector is discussed which is based on the use of electronic connector pins as the gain elements. With a rate capability of >10 5 counts/s per pin, an X-ray imaging detector system capable of counting at global rates of the order of 10 10 counts/s is foreseen. (author)

  3. Operational experience of ATLAS SCT and Pixel Detector

    CERN Document Server

    Kocian, Martin; The ATLAS collaboration

    2017-01-01

    The ATLAS Inner Detector based on silicon sensors is consisting of a strip detector (SCT) and a pixel detector. It is the crucial component for vertexing and tracking in the ATLAS experiment. With the excellent performance of the LHC well beyond the original specification the silicon tracking detectors are facing substantial challenges in terms of data acquisition, radiation damage to the sensors, and SEUs in the readout ASICs. The approaches on how the detector systems cope with the demands of high luminosity operation while maintaining excellent performance through hardware upgrades, software and firmware algorithms, and operational settings, are presented.

  4. Work on a ATLAS tile calorimeter Barrel

    CERN Multimedia

    Laurent Guiraud

    2000-01-01

    The Tile Calorimeter is designed as one barrel and two extended barrel hadron parts. The calorimeter consists of a cylindrical structure with inner and outer radius of 2280 and 4230 mm respectively. The barrel part is 5640 mm in length along the beam axis, while each of the extended barrel cylinders is 2910 mm long. Each detector cylinder is built of 64 independent wedges along the azimuthal direction. Between the barrel and the extended barrels there is a gap of about 600 mm, which is needed for the Inner Detector and the Liquid Argon cables, electronics and services. The barrel covers the region -1.0barrels cover the region 0.8<|h|<1.7.

  5. Limits in point to point resolution of MOS based pixels detector arrays

    Science.gov (United States)

    Fourches, N.; Desforge, D.; Kebbiri, M.; Kumar, V.; Serruys, Y.; Gutierrez, G.; Leprêtre, F.; Jomard, F.

    2018-01-01

    In high energy physics point-to-point resolution is a key prerequisite for particle detector pixel arrays. Current and future experiments require the development of inner-detectors able to resolve the tracks of particles down to the micron range. Present-day technologies, although not fully implemented in actual detectors, can reach a 5-μm limit, this limit being based on statistical measurements, with a pixel-pitch in the 10 μm range. This paper is devoted to the evaluation of the building blocks for use in pixel arrays enabling accurate tracking of charged particles. Basing us on simulations we will make here a quantitative evaluation of the physical and technological limits in pixel size. Attempts to design small pixels based on SOI technology will be briefly recalled here. A design based on CMOS compatible technologies that allow a reduction of the pixel size below the micrometer is introduced here. Its physical principle relies on a buried carrier-localizing collecting gate. The fabrication process needed by this pixel design can be based on existing process steps used in silicon microelectronics. The pixel characteristics will be discussed as well as the design of pixel arrays. The existing bottlenecks and how to overcome them will be discussed in the light of recent ion implantation and material characterization experiments.

  6. Gas Pixel Detectors for low energy X-ray polarimetry

    International Nuclear Information System (INIS)

    Spandre, Gloria

    2007-01-01

    Gas Pixel Detectors are position-sensitive proportional counters in which a complete integration between the gas amplification structure and the read-out electronics has been reached. Various generation of Application-Specific Integrated Circuit (ASIC) have been designed in deep submicron CMOS technology to realize a monolithic device which is at the same time the charge collecting electrode and the analog amplifying and charge measuring front-end electronics. The experimental response of a detector with 22060 pixels at 80 μm pitch to polarized and un-polarized X-ray radiation is shown and the application of this device for Astronomical X-ray Polarimetry discussed

  7. Initial Measurements On Pixel Detector Modules For The ATLAS Upgrades

    CERN Document Server

    Gallrapp, C; The ATLAS collaboration

    2011-01-01

    Sophisticated conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming pixel detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation, which give a first impression on the charge collection properties of the different sensor technologies are presented.

  8. Radiation Damage Modeling for 3D Pixel Sensors in the ATLAS Detector

    CERN Document Server

    Wallangen, Veronica; The ATLAS collaboration

    2017-01-01

    Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

  9. Charge loss between contacts of CdZnTe pixel detectors

    CERN Document Server

    Bolotnikov, A E; Harrison, F A; Wong, A S; Schindler, S M; Eichelberger, A C

    1999-01-01

    The surface of Cd sub 1 sub - sub x Zn sub x Te (CZT) material has high resistivity but is not a perfect dielectric. Even a small surface conductivity can affect the electric field distribution, and therefore, the charge collection efficiency of a CZT pixel detector. The paper describes studies of this phenomenon for several contact configurations made on a single CZT detector. We have determined the maximum inter-contact separation at which the surface inter-pixel charge loss can be neglected. (author)

  10. Optical readout in a multi-module system test for the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Flick, Tobias; Becks, Karl-Heinz; Gerlach, Peter; Kersten, Susanne; Maettig, Peter; Nderitu Kirichu, Simon; Reeves, Kendall; Richter, Jennifer; Schultes, Joachim

    2006-01-01

    The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector, which is presently under construction. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. It consists of detector modules, optoboards, optical fibres, Back of Crate cards, Readout Drivers, and control computers. In this paper, the system test setup and the operation of the readout chain are described. Also, some results of tests using the final pixel detector readout chain are given

  11. A new generation of small pixel pitch/SWaP cooled infrared detectors

    Science.gov (United States)

    Espuno, L.; Pacaud, O.; Reibel, Y.; Rubaldo, L.; Kerlain, A.; Péré-Laperne, N.; Dariel, A.; Roumegoux, J.; Brunner, A.; Kessler, A.; Gravrand, O.; Castelein, P.

    2015-10-01

    Following clear technological trends, the cooled IR detectors market is now in demand for smaller, more efficient and higher performance products. This demand pushes products developments towards constant innovations on detectors, read-out circuits, proximity electronics boards, and coolers. Sofradir was first to show a 10μm focal plane array (FPA) at DSS 2012, and announced the DAPHNIS 10μm product line back in 2014. This pixel pitch is a key enabler for infrared detectors with increased resolution. Sofradir recently achieved outstanding products demonstrations at this pixel pitch, which clearly demonstrate the benefits of adopting 10μm pixel pitch focal plane array-based detectors. Both HD and XGA Daphnis 10μm products also benefit from a global video datapath efficiency improvement by transitioning to digital video interfaces. Moreover, innovative smart pixels functionalities drastically increase product versatility. In addition to this strong push towards a higher pixels density, Sofradir acknowledges the need for smaller and lower power cooled infrared detector. Together with straightforward system interfaces and better overall performances, latest technological advances on SWAP-C (Size, Weight, Power and Cost) Sofradir products enable the advent of a new generation of high performance portable and agile systems (handheld thermal imagers, unmanned aerial vehicles, light gimbals etc...). This paper focuses on those features and performances that can make an actual difference in the field.

  12. A pixel detector for the protein crystallography beamline at the SLS

    CERN Document Server

    Brönnimann, C; Eikenberry, E F; Fischer, P; Florin, S; Horisberger, R P; Lindner, Manfred; Schmitt, B; Schulze, C

    2002-01-01

    At the Paul Scherrer Institute a new synchrotron light source is currently under construction, the Swiss Light Source (SLS), which will be operational in summer 2001. Among the first beamlines is a high brightness, micro-focusing protein crystallography beamline. It will be equipped with a pixel detector, which has several features of interest for the next generation of protein crystallography detectors. The point spread function and the effect of charge sharing was measured with a prototype detector in a test experiment at the European Synchrotron Radiation Facility in Grenoble. The concepts of the SLS pixel detector is presented as well as test results from radiation hard prototype chips.

  13. Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

    CERN Document Server

    Rossini, Lorenzo; The ATLAS collaboration

    2018-01-01

    Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High- Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time and considers both planar and 3D sensor designs. In addition to thoroughly describing the setup, we compare predictions for basic...

  14. Development of a counting pixel detector for 'Digitales Roentgen'

    International Nuclear Information System (INIS)

    Lindner, M.

    2001-08-01

    The development of a single photon counting X-ray imaging detector for medical applications using hybrid pixel detectors is reported. The electronics development from the first prototype derived from detector development for particle physics experiments (ATLAS) to the imaging chip MPEC (multi picture element counters) for medical applications is described. This chip consists of 32 x 32 pixels of 200 μm x 200 μm size, each containing the complete read out electronics, i.e. an amplifier, two discriminators with adjustable thresholds and two 18-bit linear feedback shift-counters allowing energy windowing for contrast increase. Results on electronics performance are shown as well as measurements with several semiconductor materials (Si, GaAs, CdTe). Important aspects like detection efficiency, sensor homogeneity, linearity and spatial resolution are discussed. (orig.)

  15. Data acquisition at the front-end of the Mu3e pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Perrevoort, Ann-Kathrin [Physikalisches Institut, Universitaet Heidelberg (Germany); Collaboration: Mu3e-Collaboration

    2016-07-01

    The Mu3e experiment - searching for the lepton-flavour violating decay of the muon into three electrons at an unprecedented sensitivity of one in 10{sup 16} decays - is based on a pixel tracking detector. The sensors are High-Voltage Monolithic Active Pixel Sensors, a technology which allows for very fast and thin detectors, and thus is an ideal fit for Mu3e where the trajectories of low-momentum electrons at high rates are to be measured. The detector will consist of about 275 million pixels and will be operated at up to 10{sup 9} muon stops per second. Therefore, a fast and trigger-less data readout is required. The pixel sensors feature zero-suppressed data output via high-speed serial links. The data is then buffered and sorted by time on a FPGA on the front-end before being processed to the following readout stage. In this talk, the readout of the Mu3e pixel detector at the front-end is introduced. Furthermore, a first firmware implementation of this concept in a beam telescope consisting of the current pixel sensor prototype MuPix7 is presented.

  16. DEPFET active pixel detectors for a future linear $e^+e^-$ collider

    CERN Document Server

    Alonso, O; Dieguez, A; Dingfelder, J; Hemperek, T; Kishishita, T; Kleinohl, T; Koch, M; Krueger, H; Lemarenko, M; Luetticke, F; Marinas, C; Schnell, M; Wermes, N; Campbell, A; Ferber, T; Kleinwort, C; Niebuhr, C; Soloviev, Y; Steder, M; Volkenborn, R; Yaschenko, S; Fischer, P; Kreidl, C; Peric, I; Knopf, J; Ritzert, M; Curras, E; Lopez-Virto, A; Moya, D; Vila, I; Boronat, M; Esperante, D; Fuster, J; Garcia Garcia, I; Lacasta, C; Oyanguren, A; Ruiz, P; Timon, G; Vos, M; Gessler, T; Kuehn, W; Lange, S; Muenchow, D; Spruck, B; Frey, A; Geisler, C; Schwenker, B; Wilk, F; Barvich, T; Heck, M; Heindl, S; Lutz, O; Mueller, Th; Pulvermacher, C; Simonis, H.J; Weiler, T; Krausser, T; Lipsky, O; Rummel, S; Schieck, J; Schlueter, T; Ackermann, K; Andricek, L; Chekelian, V; Chobanova, V; Dalseno, J; Kiesling, C; Koffmane, C; Gioi, L.Li; Moll, A; Moser, H.G; Mueller, F; Nedelkovska, E; Ninkovic, J; Petrovics, S; Prothmann, K; Richter, R; Ritter, A; Ritter, M; Simon, F; Vanhoefer, P; Wassatsch, A; Dolezal, Z; Drasal, Z; Kodys, P; Kvasnicka, P; Scheirich, J

    2013-01-01

    The DEPFET collaboration develops highly granular, ultra-transparent active pixel detectors for high-performance vertex reconstruction at future collider experiments. The characterization of detector prototypes has proven that the key principle, the integration of a first amplification stage in a detector-grade sensor material, can provide a comfortable signal to noise ratio of over 40 for a sensor thickness of 50-75 $\\mathrm{\\mathbf{\\mu m}}$. ASICs have been designed and produced to operate a DEPFET pixel detector with the required read-out speed. A complete detector concept is being developed, including solutions for mechanical support, cooling and services. In this paper the status of DEPFET R & D project is reviewed in the light of the requirements of the vertex detector at a future linear $\\mathbf{e^+ e^-}$ collider.

  17. Operational experience with the CMS pixel detector in LHC Run II

    CERN Document Server

    Karancsi, Janos

    2016-01-01

    The CMS pixel detector was repaired successfully, calibrated and commissioned for the second run of Large Hadron Collider during the first long shutdown between 2013 and 2015. The replaced pixel modules were calibrated separately and show the expected behavior of an un-irradiated detector. In 2015, the system performed very well with an even improved spatial resolution compared to 2012. During this time, the operational team faced various challenges including the loss of a sector in one half shell which was only partially recovered. In 2016, the detector is expected to withstand instantaneous luminosities beyond the design limits and will need a combined effort of both online and offline teams in order to provide the high quality data that is required to reach the physics goals of CMS. We present the operational experience gained during the second run of the LHC and show the latest performance results of the CMS pixel detector.

  18. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gonella, Laura

    2013-10-15

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  19. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    International Nuclear Information System (INIS)

    Gonella, Laura

    2013-10-01

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

  20. Technology development for SOI monolithic pixel detectors

    International Nuclear Information System (INIS)

    Marczewski, J.; Domanski, K.; Grabiec, P.; Grodner, M.; Jaroszewicz, B.; Kociubinski, A.; Kucharski, K.; Tomaszewski, D.; Caccia, M.; Kucewicz, W.; Niemiec, H.

    2006-01-01

    A monolithic detector of ionizing radiation has been manufactured using silicon on insulator (SOI) wafers with a high-resistivity substrate. In our paper the integration of a standard 3 μm CMOS technology, originally designed for bulk devices, with fabrication of pixels in the bottom wafer of a SOI substrate is described. Both technological sequences have been merged minimizing thermal budget and providing suitable properties of all the technological layers. The achieved performance proves that fully depleted monolithic active pixel matrix might be a viable option for a wide spectrum of future applications

  1. Survey of the ATLAS Pixel Detector Components

    International Nuclear Information System (INIS)

    Andreazza, A.; Kostyukhim, V.; Madaras, R.

    2008-01-01

    This document provides a description of the survey performed on different components of the ATLAS Pixel Detector at different stages of its assembly. During the production of the ATLAS pixel detector great care was put in the geometrical survey of the location of the sensitive area of modules. This had a double purpose: (1) to provide a check of the quality of the assembly procedure and assure tolerances in the geometrical assembly were met; and (2) to provide an initial point for the alignment (the so called 'as-built detector'), better than the ideal geometry. Since direct access to the sensitive area becomes more and more difficult with the progress of the assembly, the survey needed to be performed at different stages: after module loading on the local supports (sectors and staves) and after assembly of the local supports in disks or halfshells. Different techniques were used, including both optical 2D and 3D surveys and mechanical survey. This document summarizes the survey procedures, the analysis done on the collected data and how survey data are stored in case they will need to be accessed in the future

  2. Advanced processing of CdTe pixel radiation detectors

    Science.gov (United States)

    Gädda, A.; Winkler, A.; Ott, J.; Härkönen, J.; Karadzhinova-Ferrer, A.; Koponen, P.; Luukka, P.; Tikkanen, J.; Vähänen, S.

    2017-12-01

    We report a fabrication process of pixel detectors made of bulk cadmium telluride (CdTe) crystals. Prior to processing, the quality and defect density in CdTe material was characterized by infrared (IR) spectroscopy. The semiconductor detector and Flip-Chip (FC) interconnection processing was carried out in the clean room premises of Micronova Nanofabrication Centre in Espoo, Finland. The chip scale processes consist of the aluminum oxide (Al2O3) low temperature thermal Atomic Layer Deposition (ALD), titanium tungsten (TiW) metal sputtering depositions and an electroless Nickel growth. CdTe crystals with the size of 10×10×0.5 mm3 were patterned with several photo-lithography techniques. In this study, gold (Au) was chosen as the material for the wettable Under Bump Metalization (UBM) pads. Indium (In) based solder bumps were grown on PSI46dig read out chips (ROC) having 4160 pixels within an area of 1 cm2. CdTe sensor and ROC were hybridized using a low temperature flip-chip (FC) interconnection technique. The In-Au cold weld bonding connections were successfully connecting both elements. After the processing the detector packages were wire bonded into associated read out electronics. The pixel detectors were tested at the premises of Finnish Radiation Safety Authority (STUK). During the measurement campaign, the modules were tested by exposure to a 137Cs source of 1.5 TBq for 8 minutes. We detected at the room temperature a photopeak at 662 keV with about 2 % energy resolution.

  3. Status of the ATLAS Pixel Detector and its performance after three years of operation

    CERN Document Server

    Favareto, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is very important for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, and a good alignment allows high quality track resolution

  4. Status of the ATLAS Pixel Detector and its performance after three years of operation

    CERN Document Server

    Favareto, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is very important for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. The detector performance is excellent: ~96% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, and a good alignment allows high quality track resolution.

  5. 50 μm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis.

    Science.gov (United States)

    Zhao, C; Konstantinidis, A C; Zheng, Y; Anaxagoras, T; Speller, R D; Kanicki, J

    2015-12-07

    Wafer-scale CMOS active pixel sensors (APSs) have been developed recently for x-ray imaging applications. The small pixel pitch and low noise are very promising properties for medical imaging applications such as digital breast tomosynthesis (DBT). In this work, we evaluated experimentally and through modeling the imaging properties of a 50 μm pixel pitch CMOS APS x-ray detector named DynAMITe (Dynamic Range Adjustable for Medical Imaging Technology). A modified cascaded system model was developed for CMOS APS x-ray detectors by taking into account the device nonlinear signal and noise properties. The imaging properties such as modulation transfer function (MTF), noise power spectrum (NPS), and detective quantum efficiency (DQE) were extracted from both measurements and the nonlinear cascaded system analysis. The results show that the DynAMITe x-ray detector achieves a high spatial resolution of 10 mm(-1) and a DQE of around 0.5 at spatial frequencies  CMOS APS x-ray detector, image aquisition geometry and image reconstruction techniques should be considered.

  6. 18F-FDG positron autoradiography with a particle counting silicon pixel detector.

    Science.gov (United States)

    Russo, P; Lauria, A; Mettivier, G; Montesi, M C; Marotta, M; Aloj, L; Lastoria, S

    2008-11-07

    We report on tests of a room-temperature particle counting silicon pixel detector of the Medipix2 series as the detector unit of a positron autoradiography (AR) system, for samples labelled with (18)F-FDG radiopharmaceutical used in PET studies. The silicon detector (1.98 cm(2) sensitive area, 300 microm thick) has high intrinsic resolution (55 microm pitch) and works by counting all hits in a pixel above a certain energy threshold. The present work extends the detector characterization with (18)F-FDG of a previous paper. We analysed the system's linearity, dynamic range, sensitivity, background count rate, noise, and its imaging performance on biological samples. Tests have been performed in the laboratory with (18)F-FDG drops (37-37 000 Bq initial activity) and ex vivo in a rat injected with 88.8 MBq of (18)F-FDG. Particles interacting in the detector volume produced a hit in a cluster of pixels whose mean size was 4.3 pixels/event at 11 keV threshold and 2.2 pixels/event at 37 keV threshold. Results show a sensitivity for beta(+) of 0.377 cps Bq(-1), a dynamic range of at least five orders of magnitude and a lower detection limit of 0.0015 Bq mm(-2). Real-time (18)F-FDG positron AR images have been obtained in 500-1000 s exposure time of thin (10-20 microm) slices of a rat brain and compared with 20 h film autoradiography of adjacent slices. The analysis of the image contrast and signal-to-noise ratio in a rat brain slice indicated that Poisson noise-limited imaging can be approached in short (e.g. 100 s) exposures, with approximately 100 Bq slice activity, and that the silicon pixel detector produced a higher image quality than film-based AR.

  7. Preliminary test of an imaging probe for nuclear medicine using hybrid pixel detectors

    International Nuclear Information System (INIS)

    Bertolucci, E.; Maiorino, M.; Mettivier, G.; Montesi, M.C.; Russo, P.

    2002-01-01

    We are investigating the feasibility of an intraoperative imaging probe for lymphoscintigraphy with Tc-99m tracer, for sentinel node radioguided surgery, using the Medipix series of hybrid detectors coupled to a collimator. These detectors are pixelated semiconductor detectors bump-bonded to the Medipix1 photon counting read-out chip (64x64 pixel, 170 μm pitch) or to the Medipix2 chip (256x256 pixel, 55 μm pitch), developed by the European Medipix collaboration. The pixel detector we plan to use in the final version of the probe is a semi-insulating GaAs detector or a 1-2 mm thick CdZnTe detector. For the preliminary tests presented here, we used 300-μm thick silicon detectors, hybridized via bump-bonding to the Medipix1 chip. We used a tungsten parallel-hole collimator (7 mm thick, matrix array of 64x64 100 μm circular holes with 170 μm pitch), and a 22, 60 and 122 keV point-like (1 mm diameter) radioactive sources, placed at various distances from the detector. These tests were conducted in order to investigate the general feasibility of this imaging probe and its resolving power. Measurements show the high resolution but low efficiency performance of the detector-collimator set, which is able to image the 122 keV source with <1 mm FWHM resolution

  8. The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    Giordani, MarioPaolo; The ATLAS collaboration

    2016-01-01

    Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

  9. Radiationhard components for the control system of a future ATLAS pixel detector

    International Nuclear Information System (INIS)

    Becker, K; Boek, J; Kersten, S; Kind, P; Maettig, P; Puellen, L; Zeitnitz, C

    2011-01-01

    The upgrade of the ATLAS experiment for the High Luminosity LHC (HL-LHC) will include a new pixel detector. A completely new detector control system (DCS) for this pixel detector will be required in order to cope with the substantial increase in radiation at the HL-LHC. The DCS has to have a very high reliability and all components installed within the detector volume have to be radiationhard. This will ensure a safe operation of the pixel detector and the experiment. A further design constraint is the minimization of the used material and cables in order to limit the impact on the tracking performance to a minimum. To meet these requirements we propose a DCS network which consists of a DCS chip and a DCS controller. In the following we present the development of the first prototypes for the DCS chip and the DCS controller with a special focus on the communication interface, radiation hardness and robustness against single event upsets.

  10. Versatile, reprogrammable area pixel array detector for time-resolved synchrotron x-ray applications

    Energy Technology Data Exchange (ETDEWEB)

    Gruner, Sol [Cornell Univ., Ithaca, NY (United States)

    2010-05-01

    The final technical report for DOE grant DE-SC0004079 is presented. The goal of the grant was to perform research, development and application of novel imaging x-ray detectors so as to effectively utilize the high intensity and brightness of the national synchrotron radiation facilities to enable previously unfeasible time-resolved x-ray research. The report summarizes the development of the resultant imaging x-ray detectors. Two types of detector platforms were developed: The first is a detector platform (called a Mixed-Mode Pixel Array Detector, or MM-PAD) that can image continuously at over a thousand images per second while maintaining high efficiency for wide dynamic range signals ranging from 1 to hundreds of millions of x-rays per pixel per image. Research on an even higher dynamic range variant is also described. The second detector platform (called the Keck Pixel Array Detector) is capable of acquiring a burst of x-ray images at a rate of millions of images per second.

  11. The first bump-bonded pixel detectors on CVD diamond

    International Nuclear Information System (INIS)

    Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G.

    1999-01-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 μm was observed, consistent with expectations given the detector pitch

  12. The first bump-bonded pixel detectors on CVD diamond

    CERN Document Server

    Adam, W; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Fried, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Palmieri, V G; Pan, L S; Peitz, A; Pernicka, Manfred; Pirollo, S; Polesello, P; Pretzl, Klaus P; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Steuerer, J; Stone, R; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Turchetta, R; Vittone, E; Wagner, A; Walsh, A M; Wedenig, R; Weilhammer, Peter; Zeuner, W; Ziock, H J; Zöller, M; Charles, E; Ciocio, A; Dao, K; Einsweiler, Kevin F; Fasching, D; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Milgrome, O; Palaio, N; Richardson, J; Sinervo, P K; Zizka, G

    1999-01-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98565544f the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 mu m was observed, consistent with expectations given the detector pitch. (13 refs).

  13. The first bump-bonded pixel detectors on CVD diamond

    Energy Technology Data Exchange (ETDEWEB)

    Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W. E-mail: william@physics.utoronto.ca; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G

    1999-11-01

    Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 {mu}m was observed, consistent with expectations given the detector pitch.

  14. A Front-End Readout Architecture for the CMS Barrel Muon Detector: A Feasibility Study

    International Nuclear Information System (INIS)

    Aguayo, P.; Alberdi, J.; Barcala, J.M.; Marin, J.; Molinero, A.; Navarrete, J.; Pablos, J.L. de; Romero, L.; Willmot, C.

    1995-01-01

    A feasibility study of a possible architecture for the CMS barrel muon detector readout electronics is presented. some aspects of system reliability are discussed. Values for the required FIFO's to store data during the first level trigger latency are given

  15. The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

    CERN Document Server

    Mullier, Geoffrey; The ATLAS collaboration

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

  16. Evaluation of Irradiated Barrel Detector Modules for the Upgrade of the CMS Pixel Detector

    CERN Document Server

    Sibille, Jennifer Ann

    2013-01-01

    Prototype detector modules comprising sensors and the new readout chips were assembled and irradiated with protons at the CERN PS, and readout chips without sensors have been irradiated with protons at the Karls...

  17. Exploration of Pixelated detectors for double beta decay searches within the COBRA experiment

    Energy Technology Data Exchange (ETDEWEB)

    Schwenke, M., E-mail: schwenke@asp.tu-dresden.de [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany); Zuber, K.; Janutta, B. [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany); He, Z.; Zeng, F. [Department of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, Michigan 48109-2104 (United States); Anton, G.; Michel, T.; Durst, J.; Lueck, F.; Gleixner, T. [Erlangen Centre for Astroparticle Physics, Friedrich-Alexander-Universitaet Erlangen-Nuernberg, Erwin-Rommel-Str. 1, 91058 Erlangen (Germany); Goessling, C.; Schulz, O.; Koettig, T. [Technische Universitaet Dortmund, Physik E IV, 44221 Dortmund (Germany); Krawczynski, H.; Martin, J. [Department of Physics, Washington University in St. Louis, Campus Box 1105, One Brookings Drive, St. Louis, MO 63130-4899 (United States); Stekl, I.; Cermak, P. [Institute of Experimental and Applied Physics, Czech Technical University in Prague, Horska 3a/22, 128 00 Prague (Czech Republic)

    2011-09-11

    The aim of the COBRA experiment is the search for neutrinoless double beta decay events in Cadmium Zinc Telluride (CdZnTe) room temperature semiconductor detectors. The development of pixelated detectors provides the potential for clear event identification and thus major background reduction. The tracking option of a semiconductor is a unique approach in this field. For initial studies, several possible detector systems are considered with a special regard for low background applications: the large volume system Polaris with a pixelated CdZnTe sensor, Timepix detectors with Si and enriched CdTe sensor material and a CdZnTe pixel system developed at the Washington University in St. Louis, USA. For all detector systems first experimental background measurements taken at underground laboratories (Gran Sasso Underground Laboratory in Italy, LNGS and the Niederniveau Messlabor Felsenkeller in Dresden, Germany) and additionally for the Timepix detectors simulation results are presented.

  18. MCC: the Module Controller Chip for the ATLAS Pixel Detector

    International Nuclear Information System (INIS)

    Beccherle, R.; Darbo, G.; Gagliardi, G.; Gemme, C.; Morettini, P.; Musico, P.; Osculati, B.; Oppizzi, P.; Pratolongo, F.; Ruscino, E.; Schiavi, C.; Vernocchi, F.; Blanquart, L.; Einsweiler, K.; Meddeler, G.; Richardson, J.; Comes, G.; Fischer, P.; Calvet, D.; Boyd, R.; Sicho, P.

    2002-01-01

    In this article we describe the architecture of the Module Controller Chip for the ATLAS Pixel Detector. The project started in 1997 with the definition of the system specifications. A first fully-working rad-soft prototype was designed in 1998, while a radiation hard version was submitted in 2000. The 1998 version was used to build pixel detector modules. Results from those modules and from the simulated performance in ATLAS are reported. In the article we also describe the hardware/software tools developed to test the MCC performance at the LHC event rate

  19. Simulated and experimental spectroscopic performance of GaAs X-ray pixel detectors

    International Nuclear Information System (INIS)

    Bisogni, M.G.; Cola, A.; Fantacci, M.E.

    2001-01-01

    In pixel detectors, the electrode geometry affects the signal shape and therefore the spectroscopic performance of the device. This effect is enhanced in semiconductors where carrier trapping is relevant. In particular, semi insulating (SI) GaAs crystals present an incomplete charge collection due to a high concentration of deep traps in the bulk. In the last few years, SI GaAs pixel detectors have been developed as soft X-ray detectors for medical imaging applications. In this paper, we present a numerical method to evaluate the local charge collection properties of pixel detectors. A bi-dimensional description has been used to represent the detector geometry. According to recent models, the active region of a reverse biased SI GaAs detector is almost neutral. Therefore, the electrostatic potential inside a full active detector has been evaluated using the Laplace equation. A finite difference method with a fixed step orthogonal mesh has been adopted. The photon interaction point has been generated with a Monte Carlo method according to the attenuation length of a monochromatic X-ray beam in GaAs. The number of photogenerated carriers for each interaction has been extracted using a gaussian distribution. The induced signal on the collecting electrode has been calculated according to the Ramo's theorem and the trapping effect has been modeled introducing electron and hole lifetimes. The noise of the charge preamplifier have been also taken into account. A comparison between simulated and experimental X-ray spectra from a 241 Am source acquired with different GaAs pixel detectors has been carried out

  20. Iterative local Chi2 alignment algorithm for the ATLAS Pixel detector

    CERN Document Server

    Göttfert, Tobias

    The existing local chi2 alignment approach for the ATLAS SCT detector was extended to the alignment of the ATLAS Pixel detector. This approach is linear, aligns modules separately, and uses distance of closest approach residuals and iterations. The derivation and underlying concepts of the approach are presented. To show the feasibility of the approach for Pixel modules, a simplified, stand-alone track simulation, together with the alignment algorithm, was developed with the ROOT analysis software package. The Pixel alignment software was integrated into Athena, the ATLAS software framework. First results and the achievable accuracy for this approach with a simulated dataset are presented.

  1. Neural network based cluster creation in the ATLAS silicon pixel detector

    CERN Document Server

    Selbach, K E; The ATLAS collaboration

    2012-01-01

    The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS pixel detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

  2. Neural network based cluster creation in the ATLAS silicon Pixel Detector

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2013-01-01

    The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

  3. Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

    CERN Document Server

    Rossini, Lorenzo; The ATLAS collaboration

    2018-01-01

    Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of 10^15 neq/cm^2 and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current and future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time and considers both planar and 3D sensor designs. In addition to thoroughly describing the setup, we compare predictions for b...

  4. Recent progress in the development of a B-factory monolithic active pixel detector

    International Nuclear Information System (INIS)

    Stanic, S.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Varner, G.; Yang, Q.

    2006-01-01

    Due to the need for precise vertexing at future higher luminosity B-factories with the expectedly increasing track densities and radiation exposures, upgrade of present silicon strip detectors with thin, radiation resistant pixel detectors is highly desired. Considerable progress in the technological development of thin CMOS based Monolithic Active Pixel Sensors (MAPS) in the last years makes them a realistic upgrade option and the feasibility studies of their application in Belle are actively pursued. The most serious concerns are their radiation hardness and their read-out speed. To address them, several prototypes denoted as Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25μm process with a 5-deep sample pair pipeline in each pixel. A setup with several CAP3 sensors will be used to assess the performance of a full scale pixel read-out system running at realistic read-out speed. The results and plans for the next stages of R and D towards a full Pixel Vertex Detector (PVD) are presented

  5. Design of readout drivers for ATLAS pixel detectors using field programmable gate arrays

    CERN Document Server

    Sivasubramaniyan, Sriram

    Microstrip detectors are an integral patt of high energy physics research . Special protocols are used to transmit the data from these detectors . To readout the data from such detectors specialized instrumentation have to be designed . To achieve this task, creative and innovative high speed algorithms were designed simulated and implemented in Field Programmable gate arrays, using CAD/CAE tools. The simulation results indicated that these algorithms would be able to perform all the required tasks quickly and efficiently. This thesis describes the design of data acquisition system called the Readout Drivers (ROD) . It focuses on the ROD data path for ATLAS Pixel detectors. The data path will be an integrated part of Readout Drivers setup to decode the data from the silicon micro strip detectors and pixel detectors. This research also includes the design of Readout Driver controller. This Module is used to control the operation of the ROD. This module is responsible for the operation of the Pixel decoders bas...

  6. Performance of the Insertable B-Layer for the ATLAS Pixel Detector during Quality Assurance and a Novel Pixel Detector Readout Concept based on PCIe

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00356268; Pernegger, Heinz

    2016-07-27

    During the first long shutdown of the LHC the Pixel detector has been upgraded with a new 4th innermost layer, the Insertable B-Layer (IBL). The IBL will increase the tracking performance and help with higher than nominal luminosity the LHC will produce. The IBL is made up of 14 staves and in total 20 staves have been produced for the IBL. This thesis presents the results of the final quality tests performed on these staves in an detector-like environment, in order to select the 14 best of the 20 staves for integration onto the detector. The test setup as well as the testing procedure is introduced and typical results of each testing stage are shown and discussed. The overall performance of all staves is presented in regards to: tuning performance, radioactive source measurements, and number of failing pixels. Other measurement, which did not directly impact the selection of staves, but will be important for the operation of the detector or production of a future detector, are included. Based on the experienc...

  7. An EUDET/AIDA Pixel Beam Telescope for Detector Development

    CERN Document Server

    Rubinskiy, I

    2015-01-01

    Ahigh resolution(σ< 2 μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. EUDET was a coordinated detector R&D programme for the future International Linear Collider providing test beam infrastructure to detector R&D groups. The telescope consists of six sensor planes with a pixel pitch of either 18.4 μm or 10 μmand canbe operated insidea solenoidal magnetic fieldofupto1.2T.Ageneral purpose cooling, positioning, data acquisition (DAQ) and offine data analysis tools are available for the users. The excellent resolution, readout rate andDAQintegration capabilities made the telescopea primary beam tests tool also for several CERN based experiments. In this report the performance of the final telescope is presented. The plans for an even more flexible telescope with three differentpixel technologies(ATLASPixel, Mimosa,Timepix) withinthenew European detector infrastructure project AIDA are presented.

  8. X-Ray Beam Studies of Charge Sharing in Small Pixel, Spectroscopic, CdZnTe Detectors

    Science.gov (United States)

    Allwork, Christopher; Kitou, Dimitris; Chaudhuri, Sandeep; Sellin, Paul J.; Seller, Paul; Veale, Matthew C.; Tartoni, Nicola; Veeramani, Perumal

    2012-08-01

    Recent advances in the growth of CdZnTe material have allowed the development of small pixel, spectroscopic, X-ray imaging detectors. These detectors have applications in a diverse range of fields such as medical, security and industrial sectors. As the size of the pixels decreases relative to the detector thickness, the probability that charge is shared between multiple pixels increases due to the non zero width of the charge clouds drifting through the detector. These charge sharing events will result in a degradation of the spectroscopic performance of detectors and must be considered when analyzing the detector response. In this paper charge sharing and charge loss in a 250 μm pitch CdZnTe pixel detector has been investigated using a mono-chromatic X-ray beam at the Diamond Light Source, U.K. Using a 20 μm beam diameter the detector response has been mapped for X-ray energies both above (40 keV) and below (26 keV) the material K-shell absorption energies to study charge sharing and the role of fluorescence X-rays in these events.

  9. Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

    CERN Document Server

    Giugliarelli, Gilberto; The ATLAS collaboration

    2017-01-01

    Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

  10. Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

    CERN Document Server

    Wallangen, Veronica; The ATLAS collaboration

    2017-01-01

    Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10$^{15}$ n$_\\mathrm{eq}$/cm$^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This work presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS detector.

  11. Silicon micro-fluidic cooling for NA62 GTK pixel detectors

    CERN Document Server

    Romagnoli, G; Brunel, B; Catinaccio, A; Degrange, J; Mapelli, A; Morel, M; Noel, J; Petagna, P

    2015-01-01

    Silicon micro-channel cooling is being studied for efficient thermal management in application fields such as high power computing and 3D electronic integration. This concept has been introduced in 2010 for the thermal management of silicon pixel detectors in high energy physics experiments. Combining the versatility of standard micro-fabrication processes with the high thermal efficiency typical of micro-fluidics, it is possible to produce effective thermal management devices that are well adapted to different detector configurations. The production of very thin cooling devices in silicon enables a minimization of material of the tracking sensors and eliminates mechanical stresses due to the mismatch of the coefficient of thermal expansion between detectors and cooling systems. The NA62 experiment at CERN will be the first high particle physics experiment that will install a micro-cooling system to perform the thermal management of the three detection planes of its Gigatracker pixel detector.

  12. X-ray Imaging Using a Hybrid Photon Counting GaAs Pixel Detector

    CERN Document Server

    Schwarz, C; Göppert, R; Heijne, Erik H M; Ludwig, J; Meddeler, G; Mikulec, B; Pernigotti, E; Rogalla, M; Runge, K; Smith, K M; Snoeys, W; Söldner-Rembold, S; Watt, J

    1999-01-01

    The performance of hybrid GaAs pixel detectors as X-ray imaging sensors were investigated at room temperature. These hybrids consist of 300 mu-m thick GaAs pixel detectors, flip-chip bonded to a CMOS Single Photon Counting Chip (PCC). This chip consists of a matrix of 64 x 64 identical square pixels (170 mu-m x 170 mu-m) and covers a total area of 1.2 cm**2. The electronics in each cell comprises a preamplifier, a discriminator with a 3-bit threshold adjust and a 15-bit counter. The detector is realized by an array of Schottky diodes processed on semi-insulating LEC-GaAs bulk material. An IV-charcteristic and a detector bias voltage scan showed that the detector can be operated with voltages around 200 V. Images of various objects were taken by using a standard X-ray tube for dental diagnostics. The signal to noise ratio (SNR) was also determined. The applications of these imaging systems range from medical applications like digital mammography or dental X-ray diagnostics to non destructive material testing (...

  13. Evaluation of a hybrid photon counting pixel detector for X-ray polarimetry

    International Nuclear Information System (INIS)

    Michel, T.; Durst, J.

    2008-01-01

    It has already been shown in literature that X-ray sensitive CCDs can be used to measure the degree of linear polarization of X-rays using the effect that photoelectrons are emitted with a non-isotropic angular distribution in respect to the orientation of the electric field vector of impinging photons. Up to now hybrid semiconductor pixel detectors like the Timepix-detector have never been used for X-ray polarimetry. The main reason for this is that the pixel pitch is large compared to CCDs which results in a much smaller analyzing power. On the other hand, the active thickness of the sensor layer can be larger than in CCDs leading to an increased efficiency. Therefore hybrid photon counting pixel detectors may be used for imaging and polarimetry at higher photon energies. For irradiation with polarized X-ray photons we were able to measure an asymmetry between vertical and horizontal double hit events in neighboring pixels of the hybrid photon counting Timepix-detector at room temperature. For the specific spectrum used in our experiment an average polarization asymmetry of (0.96±0.02)% was measured. Additionally, the Timepix-detector with its spectroscopic time-over-threshold-mode was used to measure the dependence of the polarization asymmetry on energy deposition in the detector. Polarization asymmetries between 0.2% at 29 keV and 3.4% at 78 keV energy deposition were determined. The results can be reproduced with our EGS4-based Monte-Carlo simulation

  14. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    International Nuclear Information System (INIS)

    Dalla Betta, Gian-Franco; Boscardin, Maurizio; Darbo, Giovanni; Gemme, Claudia; La Rosa, Alessandro; Pernegger, Heinz; Piemonte, Claudio; Povoli, Marco; Ronchin, Sabina; Zoboli, Andrea; Zorzi, Nicola

    2011-01-01

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

  15. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Boscardin, Maurizio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Darbo, Giovanni; Gemme, Claudia [INFN, Sezione di Genova, Via Dodecaneso 33, 16146 Genova (Italy); La Rosa, Alessandro; Pernegger, Heinz [CERN-PH, CH-1211 Geneve 23 (Switzerland); Piemonte, Claudio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Povoli, Marco [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Ronchin, Sabina [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Zoboli, Andrea [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Zorzi, Nicola [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy)

    2011-04-21

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

  16. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    CERN Document Server

    Betta, G -F Dalla; Darbo, G; Gemme, C; La Rosa, A; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N

    2011-01-01

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.

  17. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    Energy Technology Data Exchange (ETDEWEB)

    Backhaus, M., E-mail: malte.backhaus@cern.ch

    2016-09-21

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO{sub 2} based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

  18. Track parameter resolution study of a pixel only detector for LHC geometry and future high rate experiments

    Energy Technology Data Exchange (ETDEWEB)

    Blago, Michele Piero; Kar, Tamasi Rameshchandra; Schoening, Andre [Physikalisches Institut, Universitaet Heidelberg (Germany)

    2016-07-01

    Recent progress in pixel detector technology, for example using High Voltage-Monolithic Pixel Sensors (HV-MAPS), makes it feasible to construct an all-silicon pixel detector for large scale particle experiments like ATLAS and CMS or other future collider experiments. Preliminary studies have shown that nine layers of pixel sensors are sufficient to reliably reconstruct particle trajectories. The performance of such an all-pixel detector is studied based on a full GEANT simulation for high luminosity conditions at the upgraded LHC. Furthermore, the ability of an all-pixel detector to form trigger decisions using a special triplet pixel layer design is studied. Such a design could be used to reconstruct all tracks originating from the proton-proton interaction at the first hardware level at 40 MHz collision frequency.

  19. Detection of secondary electrons with pixelated hybrid semiconductor detectors

    International Nuclear Information System (INIS)

    Gebert, Ulrike Sonja

    2011-01-01

    Within the scope of this thesis, secondary electrons were detected with a pixelated semiconductor detector named Timepix. The Timepix detector consists of electronics and a sensor made from a semiconductor material. The connection of sensor and electronics is done for each pixel individually using bump bonds. Electrons with energies above 3 keV can be detected with the sensor. One electron produces a certain amount of electron-hole pairs according to its energy. The charge then drifts along an electric field to the pixel electronics, where it induces an electric signal. Even without a sensor it is possible to detect an electric signal from approximately 1000 electrons directly in the pixel electronics. Two different detector systems to detect secondary electrons using the Timepix detector were investigated during this thesis. First of all, a hybrid photon detector (HPD) was used to detect single photoelectrons. The HPD consists of a vacuum vessel with an entrance window and a cesium iodine photocathode at the inner surface of the window. Photoelectrons are released from the photocathode by incident light and are accelerated in an electric field towards the Timepix detector, where the point of interaction and the arrival time of the electron is determined. With a proximity focusing setup, a time resolution of 12 ns (with an acceleration voltage of 20 kV between photocathode and Timepix detector) was obtained. The HPD examined in this thesis showed a strong dependence of the dark rate form the acceleration voltage and the pressure in the vacuum vessel. At a pressure of few 10 -5 mbar and an acceleration voltage of 20 kV, the dark rate was about 800 Hz per mm 2 area of the read out photocathode. One possibility to reduce the dark rate is to identify ion feedback events. With a slightly modified setup it was possible to reduce the dark rate to 0.5 Hz/mm 2 . To achieve this, a new photocathode was mounted in a shorter distance to the detector. The measurements where

  20. The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

    2016-01-01

    Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

  1. Readout chip for the CMS pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Rossini, Marco, E-mail: marco.rossini@phys.ethz.ch

    2014-11-21

    For the CMS experiment a new pixel detector is planned for installation during the extended shutdown in winter 2016/2017. Among the changes of the detector modified front end electronics will be used for higher efficiency at peak luminosity of the LHC and faster readout. The first prototype versions of the new readout chip have been designed and produced. The results of qualification and calibration for the new chip are presented in this paper.

  2. Results from the Commissioning of the ATLAS Pixel Detector

    CERN Document Server

    Ibragimov, I

    2008-01-01

    The ATLAS pixel detector is the innermost tracking detector of the ATLAS experiment at the Large Hadron Collider (LHC) at CERN. It has a total active area of 1.7 m2 of silicon read out by approximately 80 million electronic channels, which will detect particle tracks and decay vertices with a very high precision. After more than 10 years of development and construction it is the first time ever the whole detector has been operated together. The paper will illustrate the detector performance and give first results from the combined ATLAS cosmics runs.

  3. 3D simulations and modeling of new low capacitance silicon pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Xiong, Bo; Li, Yu Yun [School of Materials Science and Engineering, Xiangtan University, Xiangtan 411105 (China); Center for Semiconductor Particle and photon Imaging Detector Development and Fabrication, Xiangtan University, Xiangtan 411105 (China); Li, Zheng, E-mail: zhengli58@gmail.com [School of Materials Science and Engineering, Xiangtan University, Xiangtan 411105 (China); Center for Semiconductor Particle and photon Imaging Detector Development and Fabrication, Xiangtan University, Xiangtan 411105 (China)

    2016-09-21

    With signal to noise ratio (S/N) being a key parameter of a high performance detector, reducing the detector noise has been one of the main tasks in detector development. A new low capacitance silicon pixel detector is proposed, which is based on a new electrode geometry with reduced effective electrode area while keeping the sensitive volume unchanged. Detector electrical characteristics including electrostatic potential, electric field, full depletion voltage, and capacitance have been simulated in detail using a 3D TCAD tool. From these simulations and calculations, we confirm that the new detector structure has a much reduced capacitance (by a factor of 3) as compared to the traditional pixel detectors with the same sensitive volume. This reduction in detector capacitance can certainly improve the detector signal to noise ratio. However, the full depletion voltage for the new structure is larger than that of the traditional one due to the small electrode effect.

  4. Leakage current measurements on pixelated CdZnTe detectors

    NARCIS (Netherlands)

    Dirks, B.; Blondel, C.; Daly, F.; Gevin, O.; Limousin, O.; Lugiez, F.

    2006-01-01

    In the field of the R&D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9×0.9 mm2) or 256 (0.5×0.5 mm2) pixels, surrounded by a guard ring and operate in the energy ranging from several

  5. Development of thin pixel detectors on epitaxial silicon for HEP experiments

    International Nuclear Information System (INIS)

    Boscardin, Maurizio; Calvo, Daniela; Giacomini, Gabriele; Wheadon, Richard; Ronchin, Sabina; Zorzi, Nicola

    2013-01-01

    The foreseen luminosity of the new experiments in High Energy Physics will require that the innermost layer of vertex detectors will be able to sustain fluencies up to 10 16 n eq /cm 2 . Moreover, in many experiments there is a demand for the minimization of the material budget of the detectors. Therefore, thin pixel devices fabricated on n-type silicon are a natural choice to fulfill these requirements due to their rad-hard performances and low active volume. We present an R and D activity aimed at developing a new thin hybrid pixel device in the framework of PANDA experiments. The detector of this new device is a p-on-n pixel sensor realized starting from epitaxial silicon wafers and back thinned up to 50–100 μm after process completion. We present the main technological steps and some electrical characterization on the fabricated devices before and after back thinning and after bump bonding to the front-end electronics

  6. Development of thin pixel detectors on epitaxial silicon for HEP experiments

    Energy Technology Data Exchange (ETDEWEB)

    Boscardin, Maurizio, E-mail: boscardi@fbk.eu [FBK, CMM, Via Sommarive 18, I-38123 Povo, Trento (Italy); Calvo, Daniela [INFN and Dipartimento di Fisica, Università di Torino, Via Pietro Giuria, I-10125 Torino (Italy); Giacomini, Gabriele [FBK, CMM, Via Sommarive 18, I-38123 Povo, Trento (Italy); Wheadon, Richard [INFN and Dipartimento di Fisica, Università di Torino, Via Pietro Giuria, I-10125 Torino (Italy); Ronchin, Sabina; Zorzi, Nicola [FBK, CMM, Via Sommarive 18, I-38123 Povo, Trento (Italy)

    2013-08-01

    The foreseen luminosity of the new experiments in High Energy Physics will require that the innermost layer of vertex detectors will be able to sustain fluencies up to 10{sup 16} n{sub eq}/cm{sup 2}. Moreover, in many experiments there is a demand for the minimization of the material budget of the detectors. Therefore, thin pixel devices fabricated on n-type silicon are a natural choice to fulfill these requirements due to their rad-hard performances and low active volume. We present an R and D activity aimed at developing a new thin hybrid pixel device in the framework of PANDA experiments. The detector of this new device is a p-on-n pixel sensor realized starting from epitaxial silicon wafers and back thinned up to 50–100 μm after process completion. We present the main technological steps and some electrical characterization on the fabricated devices before and after back thinning and after bump bonding to the front-end electronics.

  7. Pixel Detector Developments for Tracker Upgrades of the High Luminosity LHC

    CERN Document Server

    Meschini, Marco; Dalla Betta, G. F; Dinardo, Mauro; Giacomini, G; Menasce, Dario; Mendicino, R; Messineo, Alberto; Moroni, Luigi; Ronchin, S; Sultan, D.M.S; Uplegger, Lorenzo; Viliani, Lorenzo; Zoi, Irene; Zuolo, Davide

    2017-01-01

    and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and % make us confident support the conclusion that columnar devices are % 3D devices very good candidates for the inner layers of the upgrade pixel detectors.

  8. The power supply system for the DEPFET pixel detector at BELLE II

    International Nuclear Information System (INIS)

    Rummel, Stefan

    2013-01-01

    The upgrade of the KEKB accelerator towards 8×10 35 cm −2 s −1 poses several challenges for the BELLE II detector. Especially the innermost detector will be faced with a significant radiation of several MRad per year as well as a high hit density. To cope with this a silicon pixel detector will be used for the inner layers of the silicon tracker. The pixel detector (PXD) consists of two layers of DEPFET active pixel sensors. The DEPFET technology has an unique set of advantages like low power dissipation in the active area, flexible device size, radiation hardness and a thinning procedure allowing to adjust the thickness of the device over a wide range. The two layers close to the interaction point together with a low material budget will improve the IP resolution by a factor of 2 compared to the previous installed silicon detector. In addition silicon stand-alone pattern recognition will be possible together with the four layers of double sided strip detectors (DSSD) of the strip detector. The PXD detector system consists of the DEPFET modules with integrated readout chips, the data handling hybrid receiving the data and sending them to compute nodes performing an online pattern recognition. Moreover the power supply system provides the supply voltages for the DEPFET from a position outside of the detector. The power distribution is designed to provide low output impedance over all frequencies and transient response with appropriate overshoots. The PXD pose several challenges to the power distribution system—number of voltages, tight requirements on regulation and noise. -- Highlights: ► The KEKB accelerator receive a luminosity upgrade towards 8×10 35 cm −2 s −1 . ► A two layer pixel detector based on the DEPFET technology will be installed. ► An improvement of a factor of 2 in. impact parameter resolution is expected. ► The 34 A dedicated power supply system for the detector is under development which aims for low noise, low output impedance

  9. Finite-element simulations of coupling capacitances in capacitively coupled pixel detectors

    CERN Document Server

    AUTHOR|(SzGeCERN)755510

    2017-01-01

    Capacitively coupled hybrid silicon pixel-detector assemblies are under study for the vertex detector at the proposed future CLIC linear electron-positron collider. The assemblies consist of active CCPDv3 sensors, with 25 μm pixel pitch implemented in a 180 nm High- Voltage CMOS process, which are glued to the CLICpix readout ASIC, with the same pixel pitch and processed in a commercial 65 nm CMOS technology. The signal created in the silicon bulk of the active sensors passes a two-stage amplifier, in each pixel, and gets transferred as a voltage pulse to metal pads facing the readout chip (ROC). The coupling of the signal to the metal pads on the ROC side proceeds through the capacitors formed between the two chips by a thin layer of epoxy glue. The coupling strength and the amount of unwanted cross coupling to neighbouring pixels depends critically on the uniformity of the glue layer, its thickness and on the alignment precision during the flip-chip assembly process. Finite-element calculations of the coup...

  10. Characterization of a large-format, fine-pitch CdZnTe pixel detector for the HEFT balloon-Borne experiment

    OpenAIRE

    Chen, C. M. Hubert; Cook, Walter R.; Harrison, Fiona A.; Lin, Jiao Y. Y.

    2004-01-01

    We have developed a large-format CdZnTe pixel detector with custom, low-noise ASIC readout, for astrophysical applications. In particular, this detector is targeted for use in the High-Energy Focusing Telescope (HEFT), a balloon-borne experiment with focusing optics for 20-70 keV. The detector is a 24 X 44 pixel array of 498-µm pitch. As a focal plane detector, uniformity from pixel to pixel is very desirable. In this paper, we present the characterization of some detector properties for the ...

  11. Status of the ATLAS Pixel Detector at the LHC and its performance after three years of operation

    CERN Document Server

    Andreazza, A; The ATLAS collaboration

    2012-01-01

    The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit ...

  12. Silicon pixel-detector R&D for CLIC

    CERN Document Server

    AUTHOR|(SzGeCERN)718101

    2016-01-01

    The physics aims at the future CLIC high-energy linear e+e- collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of a few μm, ultra-low mass (∼ 0.2% X${}_0$ per layer for the vertex region and ∼ 1 % X${}_0$ per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ∼ 10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analog readout are explored. For the outer trac...

  13. The integration and engineering of the ATLAS SemiConductor Tracker Barrel

    Energy Technology Data Exchange (ETDEWEB)

    Abdesselam, A; Barr, A J [Department of Physics, Oxford University, Denys Wilkinson Building, Keble Road, Oxford OX1 3RH (United Kingdom); Allport, P P; Austin, N [Oliver Lodge Laboratory, University of Liverpool, P.O. Box 147, Oxford Street, Liverpool L69 3BX (United Kingdom); Anastopoulos, C [University of Sheffield, Department of Physics and Astronomy, Hounsfield Road, Sheffield S3 7RH (United Kingdom); Anderson, B; Attree, D J [Department of Physics and Astronomy, University College London (United Kingdom); Andricek, L; Bangert, A [Max-Planck-Institut fuer Physik, (Werner-Heisenberg-Institut), Foehringer Ring 6, 80805 Muenchen (Germany); Anghinolfi, F [CERN, CH - 1211 Geneva 23 (Switzerland); Apsimon, R; Barclay, P; Batchelor, L E [Rutherford Appleton Laboratory, Science and Technology Facilities Council, Harwell Science and Innovation Campus, Didcot OX11 0QX (United Kingdom); Atkinson, T [School of Physics, University of Melbourne, Parkville, Victoria 3010 (Australia); Barbier, G [Universite de Geneve, Section de Physique, 24 rue Ernest Ansermet, CH - 1211 Geneve 4 (Switzerland); Bates, R L; Bell, W H [University of Glasgow, Department of Physics and Astronomy, Glasgow G12 8QQ (United Kingdom); Batley, J R [Cavendish Laboratory, University of Cambridge, J J Thomson Avenue, Cambridge CB3 0HE (United Kingdom); Beck, G A [Department of Physics, Queen Mary, University of London, Mile End Road, London E1 4NS (United Kingdom); Bell, P J [School of Physics and Astronomy, University of Manchester, Manchester M13 9PL (United Kingdom)] (and others)

    2008-10-15

    The ATLAS SemiConductor Tracker (SCT) was built in three sections: a barrel and two end-caps. This paper describes the design, construction and final integration of the barrel section. The barrel is constructed around four nested cylinders that provide a stable and accurate support structure for the 2112 silicon modules and their associated services. The emphasis of this paper is directed at the aspects of engineering design that turned a concept into a fully-functioning detector, as well as the integration and testing of large sub-sections of the final SCT barrel detector. The paper follows the chronology of the construction. The main steps of the assembly are described with the results of intermediate tests. The barrel service components were developed and fabricated in parallel so that a flow of detector modules, cooling loops, opto-harnesses and Frequency-Scanning-Interferometry (FSI) alignment structures could be assembled onto the four cylinders. Once finished, each cylinder was conveyed to the next site for the mounting of modules to form a complete single barrel. Extensive electrical and thermal function tests were carried out on the completed single barrels. In the next stage, the four single barrels and thermal enclosures were combined into the complete SCT barrel detector so that it could be integrated with the Transition Radiation Tracker (TRT) barrel to form the central part of the ATLAS inner detector. Finally, the completed SCT barrel was tested together with the TRT barrel in noise tests and using cosmic rays.

  14. Operating characteristics of radiation-hardened silicon pixel detectors for the CMS experiment

    CERN Document Server

    Hyosung, Cho

    2002-01-01

    The Compact Muon Solenoid (CMS) experiment at the CERN Large Hadron Collider (LHC) will have forward silicon pixel detectors as its innermost tracking device. The pixel devices will be exposed to the harsh radiation environment of the LHC. Prototype silicon pixel detectors have been designed to meet the specification of the CMS experiment. No guard ring is required on the n/sup +/ side, and guard rings on the p/sup +/ side are always kept active before and after type inversion. The whole n/sup +/ side is grounded and connected to readout chips, which greatly simplifies detector assembling and improves the stability of bump-bonded readout chips on the n/sup +/ side. Operating characteristics such as the leakage current, the full depletion voltage, and the potential distributions over guard rings were tested using standard techniques. The tests are discussed in this paper. (9 refs).

  15. A review of advances in pixel detectors for experiments with high rate and radiation

    Science.gov (United States)

    Garcia-Sciveres, Maurice; Wermes, Norbert

    2018-06-01

    The large Hadron collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the high luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.

  16. The high dynamic range pixel array detector (HDR-PAD): Concept and design

    Energy Technology Data Exchange (ETDEWEB)

    Shanks, Katherine S.; Philipp, Hugh T.; Weiss, Joel T.; Becker, Julian; Tate, Mark W. [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M., E-mail: smg26@cornell.edu [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Cornell High Energy Synchrotron Source (CHESS), Cornell University, Ithaca, NY 14853 (United States)

    2016-07-27

    Experiments at storage ring light sources as well as at next-generation light sources increasingly require detectors capable of high dynamic range operation, combining low-noise detection of single photons with large pixel well depth. XFEL sources in particular provide pulse intensities sufficiently high that a purely photon-counting approach is impractical. The High Dynamic Range Pixel Array Detector (HDR-PAD) project aims to provide a dynamic range extending from single-photon sensitivity to 10{sup 6} photons/pixel in a single XFEL pulse while maintaining the ability to tolerate a sustained flux of 10{sup 11} ph/s/pixel at a storage ring source. Achieving these goals involves the development of fast pixel front-end electronics as well as, in the XFEL case, leveraging the delayed charge collection due to plasma effects in the sensor. A first prototype of essential electronic components of the HDR-PAD readout ASIC, exploring different options for the pixel front-end, has been fabricated. Here, the HDR-PAD concept and preliminary design will be described.

  17. ATLAS-TPX: a two-layer pixel detector setup for neutron detection and radiation field characterization

    International Nuclear Information System (INIS)

    Bergmann, B.; Caicedo, I.; Pospisil, S.; Vykydal, Z.; Leroy, C.

    2016-01-01

    A two-layer pixel detector setup (ATLAS-TPX), designed for thermal and fast neutron detection and radiation field characterization is presented. It consists of two segmented silicon detectors (256 × 256 pixels, pixel pitch 55 μm, thicknesses 300 μm and 500 μm) facing each other. To enhance the neutron detection efficiency a set of converter layers is inserted in between these detectors. The pixelation and the two-layer design allow a discrimination of neutrons against γs by pattern recognition and against charged particles by using the coincidence and anticoincidence information. The neutron conversion and detection efficiencies are measured in a thermal neutron field and fast neutron fields with energies up to 600 MeV. A Geant4 simulation model is presented, which is validated against the measured detector responses. The reliability of the coincidence and anticoincidence technique is demonstrated and possible applications of the detector setup are briefly outlined.

  18. New pixelized Micromegas detector with low discharge rate for the COMPASS experiment

    CERN Document Server

    Neyret, D.; Anfreville, M.; Bedfer, Y.; Burtin, E.; Coquelet, C.; d'Hose, N.; Desforge, D.; Giganon, A.; Jourde, D.; Kunne, F.; Magnon, A.; Makke, N.; Marchand, C.; Paul, B.; Platchkov, S.; Thibaud, F.; Usseglio, M.; Vandenbroucke, M.

    2012-01-01

    New Micromegas (Micro-mesh gaseous detectors) are being developed in view of the future physics projects planned by the COMPASS collaboration at CERN. Several major upgrades compared to present detectors are being studied: detectors standing five times higher luminosity with hadron beams, detection of beam particles (flux up to a few hundred of kHz/mm^{2}, 10 times larger than for the present Micromegas detectors) with pixelized read-out in the central part, light and integrated electronics, and improved robustness. Two solutions of reduction of discharge impact have been studied, with Micromegas detectors using resistive layers and using an additional GEM foil. Performance of such detectors has also been measured. A large size prototypes with nominal active area and pixelized read-out has been produced and installed at COMPASS in 2010. In 2011 prototypes featuring an additional GEM foil, as well as an resistive prototype, are installed at COMPASS and preliminary results from those detectors presented very go...

  19. CdTe hybrid pixel detector for imaging with thermal neutrons

    Czech Academy of Sciences Publication Activity Database

    Jakůbek, J.; Mettivier, G.; Montesi, M.C.; Pospíšil, S.; Russo, P.; Vacík, Jiří

    2006-01-01

    Roč. 563, č. 1 (2006), s. 238-241 ISSN 0168-9002 R&D Pro jects: GA MŠk 1P04LA211 Institutional research plan: CEZ:AV0Z10480505 Keywords : neutronography * pixel detector * semiconductor detector Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.185, year: 2006

  20. Studies on MCM-D pixel-detector-modules

    CERN Document Server

    Flick, T; Gerlach, P; Grah, C; Mättig, P; Rohe, T

    2003-01-01

    In the context of the development of the ATLAS-pixel-detector, a technology for building up the high density interconnects has been studied, the MCM-D (multichip module deposited) technology. Results of building up first assemblies have been reported. MCM-D technology allows to build up assemblies with uniformly segmented sensors. Especially the use of 'equal-sized(-bricked)' sensor geometry has been studied.

  1. The CMS Pixel Detector Upgrade and R\\&D for the High Luminosity LHC

    CERN Document Server

    Viliani, Lorenzo

    2017-01-01

    The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a centre-of-mass energy of 14\\,TeV and to reach an unprecedented peak instantaneous luminosity of $5 \\times 10^{34}\\,{\\rm cm}^{-2} {\\rm s}^{-1}$ with an average number of pileup events of 140. This will allow the ATLAS and CMS experiments to collect integrated luminosities of up to $3000\\,{\\rm fb}^{-1}$ during the project lifetime. To cope with this extreme scenario the CMS detector will be substantially upgraded before starting the HL-LHC, a plan known as CMS Phase-2 Upgrade. In the upgrade the entire CMS silicon pixel detector will be replaced and the new detector will feature increased radiation hardness, higher granularity and capability to handle higher data rate and longer trigger latency. In this report the Phase-2 Upgrade of the CMS silicon pixel detector will be reviewed, focusing on the features of the detector layout and on the development of new pixel devices.

  2. The Phase-2 ATLAS ITk Pixel Upgrade

    CERN Document Server

    Benoit, Mathieu; The ATLAS collaboration

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the “ITk” (Inner Tracker). The innermost portion of the ITk will consist of a pixel detector with stave-like support structures in the most central region and ring-shaped supports in the endcap regions; there may also be novel inclined support structures in the barrel-endcap overlap regions. The new detector could have as much as 14 m2 of sensitive silicon. Support structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide. The ITk will be instrumented with new sensors and readout electronics to provide improved tracking performance compared to the current detector. All the module components must be performant enough and robust enough to cope with the expected high particle multiplicity and severe radiation background of the High-Luminosity LHC. Readout...

  3. Development of a serial powering scheme and a versatile characterization system for the ATLAS pixel detector upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Filimonov, Viacheslav

    2017-08-15

    In order to increase the probability of new discoveries the LHC will be upgraded to the HL-LHC. The upgrade of the ATLAS detector is an essential part of this program. The entire ATLAS tracking system will be replaced by an all-silicon detector called Inner Tracker (ITk) which should be able to withstand the increased luminosity of 5 x 10{sup 34} cm{sup -2}s{sup -1}. The work presented in this thesis is focused on the ATLAS ITk pixel detector upgrade. Advanced silicon pixel detectors will be an essential part of the ITk pixel detector where they will be used for tracking and vertexing. Characterization of the pixel detectors is one of the required tasks for a successful ATLAS tracker upgrade. Therefore, the work presented in this thesis includes the development of a versatile and modular test system for advanced silicon pixel detectors for the HL-LHC. The performance of the system is verified. Single and quad FE-I4 modules functionalities are characterized with the developed system. The reduction of the material budget of the ATLAS ITk pixel detector is essential for a successful operation at high luminosity. Therefore, a low mass, efficient power distribution scheme to power detector modules (serial powering scheme) is investigated as well in the framework of this thesis. A serially powered pixel detector prototype is built with all the components that are needed for current distribution, data transmission, sensor biasing, bypassing and redundancy in order to prove the feasibility of implementing the serial powering scheme in the ITk. Detailed investigations of the electrical performance of the detector prototype equipped with FE-I4 quad modules are made with the help of the developed readout system.

  4. Development of a serial powering scheme and a versatile characterization system for the ATLAS pixel detector upgrade

    International Nuclear Information System (INIS)

    Filimonov, Viacheslav

    2017-08-01

    In order to increase the probability of new discoveries the LHC will be upgraded to the HL-LHC. The upgrade of the ATLAS detector is an essential part of this program. The entire ATLAS tracking system will be replaced by an all-silicon detector called Inner Tracker (ITk) which should be able to withstand the increased luminosity of 5 x 10 34 cm -2 s -1 . The work presented in this thesis is focused on the ATLAS ITk pixel detector upgrade. Advanced silicon pixel detectors will be an essential part of the ITk pixel detector where they will be used for tracking and vertexing. Characterization of the pixel detectors is one of the required tasks for a successful ATLAS tracker upgrade. Therefore, the work presented in this thesis includes the development of a versatile and modular test system for advanced silicon pixel detectors for the HL-LHC. The performance of the system is verified. Single and quad FE-I4 modules functionalities are characterized with the developed system. The reduction of the material budget of the ATLAS ITk pixel detector is essential for a successful operation at high luminosity. Therefore, a low mass, efficient power distribution scheme to power detector modules (serial powering scheme) is investigated as well in the framework of this thesis. A serially powered pixel detector prototype is built with all the components that are needed for current distribution, data transmission, sensor biasing, bypassing and redundancy in order to prove the feasibility of implementing the serial powering scheme in the ITk. Detailed investigations of the electrical performance of the detector prototype equipped with FE-I4 quad modules are made with the help of the developed readout system.

  5. Photon-counting hexagonal pixel array CdTe detector: Spatial resolution characteristics for image-guided interventional applications.

    Science.gov (United States)

    Vedantham, Srinivasan; Shrestha, Suman; Karellas, Andrew; Shi, Linxi; Gounis, Matthew J; Bellazzini, Ronaldo; Spandre, Gloria; Brez, Alessandro; Minuti, Massimo

    2016-05-01

    High-resolution, photon-counting, energy-resolved detector with fast-framing capability can facilitate simultaneous acquisition of precontrast and postcontrast images for subtraction angiography without pixel registration artifacts and can facilitate high-resolution real-time imaging during image-guided interventions. Hence, this study was conducted to determine the spatial resolution characteristics of a hexagonal pixel array photon-counting cadmium telluride (CdTe) detector. A 650 μm thick CdTe Schottky photon-counting detector capable of concurrently acquiring up to two energy-windowed images was operated in a single energy-window mode to include photons of 10 keV or higher. The detector had hexagonal pixels with apothem of 30 μm resulting in pixel pitch of 60 and 51.96 μm along the two orthogonal directions. The detector was characterized at IEC-RQA5 spectral conditions. Linear response of the detector was determined over the air kerma rate relevant to image-guided interventional procedures ranging from 1.3 nGy/frame to 91.4 μGy/frame. Presampled modulation transfer was determined using a tungsten edge test device. The edge-spread function and the finely sampled line spread function accounted for hexagonal sampling, from which the presampled modulation transfer function (MTF) was determined. Since detectors with hexagonal pixels require resampling to square pixels for distortion-free display, the optimal square pixel size was determined by minimizing the root-mean-squared-error of the aperture functions for the square and hexagonal pixels up to the Nyquist limit. At Nyquist frequencies of 8.33 and 9.62 cycles/mm along the apothem and orthogonal to the apothem directions, the modulation factors were 0.397 and 0.228, respectively. For the corresponding axis, the limiting resolution defined as 10% MTF occurred at 13.3 and 12 cycles/mm, respectively. Evaluation of the aperture functions yielded an optimal square pixel size of 54 μm. After resampling to 54

  6. Radiation damage monitoring in the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Seidel, Sally

    2013-01-01

    We describe the implementation of radiation damage monitoring using measurement of leakage current in the ATLAS silicon pixel sensors. The dependence of the leakage current upon the integrated luminosity is presented. The measurement of the radiation damage corresponding to an integrated luminosity 5.6 fb −1 is presented along with a comparison to a model. -- Highlights: ► Radiation damage monitoring via silicon leakage current is implemented in the ATLAS (LHC) pixel detector. ► Leakage currents measured are consistent with the Hamburg/Dortmund model. ► This information can be used to validate the ATLAS simulation model.

  7. Monte Carlo simulation of the response of a pixellated 3D photo-detector in silicon

    CERN Document Server

    Dubaric, E; Froejdh, C; Norlin, B

    2002-01-01

    The charge transport and X-ray photon absorption in three-dimensional (3D) X-ray pixel detectors have been studied using numerical simulations. The charge transport has been modelled using the drift-diffusion simulator MEDICI, while photon absorption has been studied using MCNP. The response of the entire pixel detector system in terms of charge sharing, line spread function and modulation transfer function, has been simulated using a system level Monte Carlo simulation approach. A major part of the study is devoted to the effect of charge sharing on the energy resolution in 3D-pixel detectors. The 3D configuration was found to suppress charge sharing much better than conventional planar detectors.

  8. Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip

    Energy Technology Data Exchange (ETDEWEB)

    Zorzi, N. [ITC-irst, Divisione Microsistemi, Via Sommarive 18, I-38050 Povo (Trento) (Italy)]. E-mail: zorzi@itc.it; Bisogni, M.G. [Dipartimento di Fisica, Universita di Pisa and Sezione INFN, Via Buonarroti 2, I-56127 Pisa (Italy); Boscardin, M. [ITC-irst, Divisione Microsistemi, Via Sommarive 18, I-38050 Povo (Trento) (Italy); Dalla Betta, G.-F. [Dipartimento di Informatica e Telecomunicazioni, Universita di Trento, Via Sommarive 14, I-38050 Povo (Trento) (Italy); Gregori, P. [ITC-irst, Divisione Microsistemi, Via Sommarive 18, I-38050 Povo (Trento) (Italy); Novelli, M. [Dipartimento di Fisica, Universita di Pisa and Sezione INFN, Via Buonarroti 2, I-56127 Pisa (Italy); Piemonte, C. [ITC-irst, Divisione Microsistemi, Via Sommarive 18, I-38050 Povo (Trento) (Italy); Quattrocchi, M. [Dipartimento di Fisica, Universita di Pisa and Sezione INFN, Via Buonarroti 2, I-56127 Pisa (Italy); Ronchin, S. [ITC-irst, Divisione Microsistemi, Via Sommarive 18, I-38050 Povo (Trento) (Italy); Rosso, V. [Dipartimento di Fisica, Universita di Pisa and Sezione INFN, Via Buonarroti 2, I-56127 Pisa (Italy)

    2005-07-01

    Pixel detectors for mammographic applications have been fabricated at ITC-irst on 800 {mu}m thick silicon wafers adopting a double side n{sup +}-on-n fabrication technology. The activity aims at increasing the X-ray detection efficiency in the energy range of interest minimizing the risk of electrical discharges in hybrid systems operating at high voltages. The detectors, having a layout compatible with the Medipix2 photon counting chip, feature two different design solutions for the p-isolation between neighboring n{sup +}-pixels. We report on the characterization of the fabrication process and on preliminary results of electrical measurements on full detectors and pixel test structures. In particular, we found that the detectors can be reliably operated above the full depletion voltage regardless of the isolation design, that however, impacts the performances in terms of current-voltage characteristics, single pixel currents, inter-pixel resistances and inter-pixel capacitances.

  9. Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip

    International Nuclear Information System (INIS)

    Zorzi, N.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.-F.; Gregori, P.; Novelli, M.; Piemonte, C.; Quattrocchi, M.; Ronchin, S.; Rosso, V.

    2005-01-01

    Pixel detectors for mammographic applications have been fabricated at ITC-irst on 800 μm thick silicon wafers adopting a double side n + -on-n fabrication technology. The activity aims at increasing the X-ray detection efficiency in the energy range of interest minimizing the risk of electrical discharges in hybrid systems operating at high voltages. The detectors, having a layout compatible with the Medipix2 photon counting chip, feature two different design solutions for the p-isolation between neighboring n + -pixels. We report on the characterization of the fabrication process and on preliminary results of electrical measurements on full detectors and pixel test structures. In particular, we found that the detectors can be reliably operated above the full depletion voltage regardless of the isolation design, that however, impacts the performances in terms of current-voltage characteristics, single pixel currents, inter-pixel resistances and inter-pixel capacitances

  10. Pixelated transmission-mode diamond X-ray detector.

    Science.gov (United States)

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-11-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60-100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼ 1 kHz, which leads to an image sampling rate of ∼ 30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5-15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10(-2) to 90 W mm(-2). Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  11. Test Beam Performance Measurements for the Phase I Upgrade of the CMS Pixel Detector

    CERN Document Server

    Dragicevic, M.; Hrubec, J.; Steininger, H.; Gädda, A.; Härkönen, J.; Lampén, T.; Luukka, P.; Peltola, T.; Tuominen, E.; Tuovinen, E.; Winkler, A.; Eerola, P.; Tuuva, T.; Baulieu, G.; Boudoul, G.; Caponetto, L.; Combaret, C.; Contardo, D.; Dupasquier, T.; Gallbit, G.; Lumb, N.; Mirabito, L.; Perries, S.; Donckt, M.Vander; Viret, S.; Bonnin, C.; Charles, L.; Gross, L.; Hosselet, J.; Tromson, D.; Feld, L.; Karpinski, W.; Klein, K.; Lipinski, M.; Pierschel, G.; Preuten, M.; Rauch, M.; Wlochal, M.; Aldaya, M.; Asawatangtrakuldee, C.; Beernaert, K.; Bertsche, D.; Contreras-Campana, C.; Eckerlin, G.; Eckstein, D.; Eichhorn, T.; Gallo, E.; Garcia, J.Garay; Hansen, K.; Haranko, M.; Harb, A.; Hauk, J.; Keaveney, J.; Kalogeropoulos, A.; Kleinwort, C.; Lohmann, W.; Mankel, R.; Maser, H.; Mittag, G.; Muhl, C.; Mussgiller, A.; Pitzl, D.; Reichelt, O.; Savitskyi, M.; Schütze, P.; Sola, V.; Spannagel, S.; Walsh, R.; Zuber, A.; Biskop, H.; Buhmann, P.; Centis-Vignali, M.; Garutti, E.; Haller, J.; Hoffmann, M.; Klanner, R.; Lapsien, T.; Matysek, M.; Perieanu, A.; Scharf, Ch.; Schleper, P.; Schmidt, A.; Schwandt, J.; Sonneveld, J.; Steinbrück, G.; Vormwald, B.; Wellhausen, J.; Abbas, M.; Amstutz, C.; Barvich, T.; Barth, Ch.; Boegelspacher, F.; Boer, W.De; Butz, E.; Casele, M.; Colombo, F.; Dierlamm, A.; Freund, B.; Hartmann, F.; Heindl, S.; Husemann, U.; Kornmeyer, A.; Kudella, S.; Muller, Th.; Simonis, H.J.; Steck, P.; Weber, M.; Weiler, Th.; Kiss, T.; Siklér, F.; Tölyhi, T.; Veszprémi, V.; Cariola, P.; Creanza, D.; Palma, M.De; Robertis, G.De; Fiore, L.; Franco, M.; Loddo, F.; Sala, G.; Silvestris, L.; Maggi, G.; My, S.; Selvaggi, G.; Albergo, S.; Cappello, G.; Costa, S.; Mattia, A.Di; Giordano, F.; Potenza, R.; Saizu, M.A.; Tricomi, A.; Tuve, C.; Focardi, E.; Dinardo, M.E.; Fiorendi, S.; Gennai, S.; Malvezzi, S.; Manzoni, R.A.; Menasce, D.; Moroni, L.; Pedrini, D.; Azzi, P.; Bacchetta, N.; Bisello, D.; Dall'Osso, M.; Pozzobon, N.; Tosi, M.; Solestizi, L.Alunni; Biasini, M.; Bilei, G.M.; Cecchi, C.; Checcucci, B.; Ciangottini, D.; Fanò, L.; Gentsos, C.; Ionica, M.; Leonardi, R.; Manoni, E.; Mantovani, G.; Marconi, S.; Mariani, V.; Menichelli, M.; Modak, A.; Morozzi, A.; Moscatelli, F.; Passeri, D.; Placidi, P.; Postolache, V.; Rossi, A.; Saha, A.; Santocchia, A.; Storchi, L.; Spiga, D.; Androsov, K.; Azzurri, P.; Bagliesi, G.; Basti, A.; Boccali, T.; Borrello, L.; Bosi, F.; Castaldi, R.; Ceccanti, M.; Ciocci, M.A.; Dell'Orso, R.; Donato, S.; Fedi, G.; Giassi, A.; Grippo, M.T.; Ligabue, F.; Magazzu, G.; Mammini, P.; Mariani, F.; Mazzoni, E.; Messineo, A.; Moggi, A.; Morsani, F.; Palla, F.; Palmonari, F.; Profeti, A.; Raffaelli, F.; Ragonesi, A.; Rizzi, A.; Soldani, A.; Spagnolo, P.; Tenchini, R.; Tonelli, G.; Venturi, A.; Verdini, P.G.; Abbaneo, D.; Ahmed, I.; Albert, E.; Auzinger, G.; Berruti, G.; Bonnaud, J.; Daguin, J.; D'Auria, A.; Detraz, S.; Dondelewski, O.; Engegaard, B.; Faccio, F.; Frank, N.; Gill, K.; Honma, A.; Kornmayer, A.; Labaza, A.; Manolescu, F.; McGill, I.; Mersi, S.; Michelis, S.; Onnela, A.; Ostrega, M.; Pavis, S.; Peisert, A.; Pernot, J.F.; Petagna, P.; Postema, H.; Rapacz, K.; Sigaud, C.; Tropea, P.; Troska, J.; Tsirou, A.; Vasey, F.; Verlaat, B.; Vichoudis, P.; Zwalinski, L.; Bachmair, F.; Becker, R.; di Calafiori, D.; Casal, B.; Berger, P.; Djambazov, L.; Donega, M.; Grab, C.; Hits, D.; Hoss, J.; Kasieczka, G.; Lustermann, W.; Mangano, B.; Marionneau, M.; Arbol, P.Martinez Ruiz del; Masciovecchio, M.; Meinhard, M.; Perozzi, L.; Roeser, U.; Starodumov, A.; Tavolaro, V.; Wallny, R.; Zhu, D.; Amsler, C.; Bösiger, K.; Caminada, L.; Canelli, F.; Chiochia, V.; de Cosa, A.; Galloni, C.; Hreus, T.; Kilminster, B.; Lange, C.; Maier, R.; Ngadiuba, J.; Pinna, D.; Robmann, P.; Taroni, S.; Yang, Y.; Bertl, W.; Deiters, K.; Erdmann, W.; Horisberger, R.; Kaestli, H.C.; Kotlinski, D.; Langenegger, U.; Meier, B.; Rohe, T.; Streuli, S.; Chen, P.H.; Dietz, C.; Fiori, F.; Grundler, U.; Hou, W.S.; Lu, R.S.; Moya, M.; Tsai, J.F.; Tzeng, Y.M.; Cussans, D.; Goldstein, J.; Grimes, M.; Newbold, D.; Hobson, P.; Reid, I.D.; Auzinger, G.; Bainbridge, R.; Dauncey, P.; Hall, G.; James, T.; Magnan, A.M.; Pesaresi, M.; Raymond, D.M.; Uchida, K.; Durkin, T.; Harder, K.; Shepherd-Themistocleous, C.; Chertok, M.; Conway, J.; Conway, R.; Flores, C.; Lander, R.; Pellett, D.; Ricci-Tam, F.; Squires, M.; Thomson, J.; Yohay, R.; Burt, K.; Ellison, J.; Hanson, G.; Olmedo, M.; Si, W.; Yates, B.R.; Dominguez, A.; Bartek, R.; Bentele, B.; Cumalat, J.P.; Ford, W.T.; Jensen, F.; Johnson, A.; Krohn, M.; Leontsinis, S.; Mulholland, T.; Stenson, K.; Wagner, S.R.; Apresyan, A.; Bolla, G.; Burkett, K.; Butler, J.N.; Canepa, A.; Cheung, H.W.K.; Christian, D.; Cooper, W.E.; Deptuch, G.; Derylo, G.; Gingu, C.; Grünendahl, S.; Hasegawa, S.; Hoff, J.; Howell, J.; Hrycyk, M.; Jindariani, S.; Johnson, M.; Kahlid, F.; Kwan, S.; Lei, C.M.; Lipton, R.; Sá, R.Lopes De; Liu, T.; Los, S.; Matulik, M.; Merkel, P.; Nahn, S.; Prosser, A.; Rivera, R.; Schneider, B.; Sellberg, G.; Shenai, A.; Siehl, K.; Spiegel, L.; Tran, N.; Uplegger, L.; Voirin, E.; Berry, D.R.; Chen, X.; Ennesser, L.; Evdokimov, A.; Gerber, C.E.; Makauda, S.; Mills, C.; Gonzalez, I.D.Sandoval; Alimena, J.; Antonelli, L.J.; Francis, B.; Hart, A.; Hill, C.S.; Parashar, N.; Stupak, J.; Bortoletto, D.; Bubna, M.; Hinton, N.; Jones, M.; Miller, D.H.; Shi, X.; Baringer, P.; Bean, A.; Khalil, S.; Kropivnitskaya, A.; Majumder, D.; Schmitz, E.; Wilson, G.; Ivanov, A.; Mendis, R.; Mitchell, T.; Skhirtladze, N.; Taylor, R.; Anderson, I.; Fehling, D.; Gritsan, A.; Maksimovic, P.; Martin, C.; Nash, K.; Osherson, M.; Swartz, M.; Xiao, M.; Acosta, J.G.; Cremaldi, L.M.; Oliveros, S.; Perera, L.; Summers, D.; Bloom, K.; Claes, D.R.; Fangmeier, C.; Suarez, R.Gonzalez; Monroy, J.; Siado, J.; Bartz, E.; Gershtein, Y.; Halkiadakis, E.; Kyriacou, S.; Lath, A.; Nash, K.; Osherson, M.; Schnetzer, S.; Stone, R.; Walker, M.; Malik, S.; Norberg, S.; Vargas, J.E.Ramirez; Alyari, M.; Dolen, J.; Godshalk, A.; Harrington, C.; Iashvili, I.; Kharchilava, A.; Nguyen, D.; Parker, A.; Rappoccio, S.; Roozbahani, B.; Alexander, J.; Chaves, J.; Chu, J.; Dittmer, S.; McDermott, K.; Mirman, N.; Rinkevicius, A.; Ryd, A.; Salvati, E.; Skinnari, L.; Soffi, L.; Tao, Z.; Thom, J.; Tucker, J.; Zientek, M.; Akgün, B.; Ecklund, K.M.; Kilpatrick, M.; Nussbaum, T.; Zabel, J.; D'Angelo, P.; Johns, W.; Rose, K.

    2017-05-30

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These upgrades allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. In this paper, comprehensive test beam studies are presented which have been conducted to verify the design and to quantify the performance of the new detector assemblies in terms of tracking efficiency and spatial resolution. Under optimal conditions, the tracking efficiency has been determined to be ($99.95 \\pm 0.05$) \\%, while the intrinsic spatial resolution has been measured to be ($4.80 \\pm 0.25$) $\\mu$m and ($7.99 \\pm 0.21$...

  12. Development of a customized SSC pixel detector readout for vertex tracking

    International Nuclear Information System (INIS)

    Barkan, O.; Atlas, E.L.; Marking, W.L.; Worley, S.; Yacoub, G.Y.; Kramer, G.; Arens, J.F.; Jernigan, J.G.; Shapiro, S.L.; Nygren, D.; Spieler, H.; Wright, M.

    1990-01-01

    The authors describe the readout architecture and progress to date in the development of hybrid PIN diode arrays for use as vertex detectors in the SSC environment. The architecture supports a self-timed mechanism for time stamping hit pixels, storing their xy coordinates and later selectively reading out only those pixels containing interesting data along with their coordinates. The peripheral logic resolves ambiguous pixel ghost locations and controls pixel neighbor readout to achieve high spatial resolution. A test lot containing 64 x 32 pixel arrays has been processed and is currently being tested. Each pixel contains 23 transistors and six capacitors consuming an area of 50μm by 150μm and dissipating about 20μW of power

  13. Monolithic active pixel radiation detector with shielding techniques

    Energy Technology Data Exchange (ETDEWEB)

    Deptuch, Grzegorz W.

    2018-03-20

    A monolithic active pixel radiation detector including a method of fabricating thereof. The disclosed radiation detector can include a substrate comprising a silicon layer upon which electronics are configured. A plurality of channels can be formed on the silicon layer, wherein the plurality of channels are connected to sources of signals located in a bulk part of the substrate, and wherein the signals flow through electrically conducting vias established in an isolation oxide on the substrate. One or more nested wells can be configured from the substrate, wherein the nested wells assist in collecting charge carriers released in interaction with radiation and wherein the nested wells further separate the electronics from the sensing portion of the detector substrate. The detector can also be configured according to a thick SOA method of fabrication.

  14. Research of high speed data readout and pre-processing system based on xTCA for silicon pixel detector

    International Nuclear Information System (INIS)

    Zhao Jingzhou; Lin Haichuan; Guo Fang; Liu Zhen'an; Xu Hao; Gong Wenxuan; Liu Zhao

    2012-01-01

    As the development of the detector, Silicon pixel detectors have been widely used in high energy physics experiments. It needs data processing system with high speed, high bandwidth and high availability to read data from silicon pixel detectors which generate more large data. The same question occurs on Belle II Pixel Detector which is a new style silicon pixel detector used in SuperKEKB accelerator with high luminance. The paper describes the research of High speed data readout and pre-processing system based on xTCA for silicon pixel detector. The system consists of High Performance Computer Node (HPCN) based on xTCA and ATCA frame. The HPCN consists of 4XFPs based on AMC, 1 AMC Carrier ATCA Board (ACAB) and 1 Rear Transmission Module. It characterized by 5 high performance FPGAs, 16 fiber links based on RocketIO, 5 Gbit Ethernet ports and DDR2 with capacity up to 18GB. In a ATCA frame, 14 HPCNs make up a system using the high speed backplane to achieve the function of data pre-processing and trigger. This system will be used on the trigger and data acquisition system of Belle II Pixel detector. (authors)

  15. Optical readout and control interface for the BTeV pixel vertex detector

    CERN Document Server

    Vergara-Limon, S; Sheaff, M; Vargas, M A

    2002-01-01

    Optical links will be used for sending data back and forth from the counting room to the detector in the data acquisition systems for future high energy physics experiments, including ATLAS and CMS in the LHC at CERN (Switzerland) and BTeV at Fermilab (USA). This is because they can be ultra-high speed and are relatively immune to electro-magnetic interference (EMI). The baseline design for the BTeV Pixel Vertex Detector includes two types of optical link, one to control and monitor and the other to read out the hit data from the multi-chip modules on each half-plane of the detector. The design and performance of the first prototype of the Optical Readout and Control Interface for the BTeV Pixel Vertex Detector is described.

  16. First operation of a hybrid photon detector prototype with electrostatic cross-focussing and integrated silicon pixel readout

    International Nuclear Information System (INIS)

    Alemi, M.; Campbell, M.; Gys, T.; Mikulec, B.; Piedigrossi, D.; Puertolas, D.; Rosso, E.; Schomaker, R.; Snoeys, W.; Wyllie, K.

    2000-01-01

    We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface

  17. First operation of a hybrid photon detector prototype with electrostatic cross-focussing and integrated silicon pixel readout

    Energy Technology Data Exchange (ETDEWEB)

    Alemi, M.; Campbell, M.; Gys, T. E-mail: thierry.gys@cern.ch; Mikulec, B.; Piedigrossi, D.; Puertolas, D.; Rosso, E.; Schomaker, R.; Snoeys, W.; Wyllie, K

    2000-07-11

    We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface.

  18. Evaluation of PET Imaging Resolution Using 350 mu{m} Pixelated CZT as a VP-PET Insert Detector

    Science.gov (United States)

    Yin, Yongzhi; Chen, Ximeng; Li, Chongzheng; Wu, Heyu; Komarov, Sergey; Guo, Qingzhen; Krawczynski, Henric; Meng, Ling-Jian; Tai, Yuan-Chuan

    2014-02-01

    A cadmium-zinc-telluride (CZT) detector with 350 μm pitch pixels was studied in high-resolution positron emission tomography (PET) imaging applications. The PET imaging system was based on coincidence detection between a CZT detector and a lutetium oxyorthosilicate (LSO)-based Inveon PET detector in virtual-pinhole PET geometry. The LSO detector is a 20 ×20 array, with 1.6 mm pitches, and 10 mm thickness. The CZT detector uses ac 20 ×20 ×5 mm substrate, with 350 μm pitch pixelated anodes and a coplanar cathode. A NEMA NU4 Na-22 point source of 250 μm in diameter was imaged by this system. Experiments show that the image resolution of single-pixel photopeak events was 590 μm FWHM while the image resolution of double-pixel photopeak events was 640 μm FWHM. The inclusion of double-pixel full-energy events increased the sensitivity of the imaging system. To validate the imaging experiment, we conducted a Monte Carlo (MC) simulation for the same PET system in Geant4 Application for Emission Tomography. We defined LSO detectors as a scanner ring and 350 μm pixelated CZT detectors as an insert ring. GATE simulated coincidence data were sorted into an insert-scanner sinogram and reconstructed. The image resolution of MC-simulated data (which did not factor in positron range and acolinearity effect) was 460 μm at FWHM for single-pixel events. The image resolutions of experimental data, MC simulated data, and theoretical calculation are all close to 500 μm FWHM when the proposed 350 μm pixelated CZT detector is used as a PET insert. The interpolation algorithm for the charge sharing events was also investigated. The PET image that was reconstructed using the interpolation algorithm shows improved image resolution compared with the image resolution without interpolation algorithm.

  19. LePix-A high resistivity, fully depleted monolithic pixel detector

    CERN Document Server

    Giubilato, P; Mugnier, H; Bisello, D; Marchioro, A; Snoeys, W; Denes, P; Pantano, D; Rousset, J; Mattiazzo, S; Kloukinas, K; Potenza, A; Rivetti, A; Chalmet, P

    2013-01-01

    The LePix project explores monolithic pixel sensors fabricated in a 90 nm CMOS technology built over a lightly doped substrate. This approach keeps the advantages usually offered by Monolithic Active Pixel Sensors (MAPS), like a low input capacitance, having a single piece detector and using a standard CMOS production line, and adds the benefit of charge collection by drift from a depleted region several tens of microns deep into the substrate, therefore providing an excellent signal to noise ratio and a radiation tolerance superior to conventional un-depleted MAPS. Such sensors are expected to offer significant cost savings and reduction of power consumption for the same performance, leading to the use of much less material in the detector (less cooling and less copper), addressing one of the main limitations of present day particle tracking systems. The latest evolution of the project uses detectors thinned down to 50 mu m to obtain back illuminated sensors operated in full depletion mode. By back processin...

  20. Energy Calibration of the Pixels of Spectral X-ray Detectors

    CERN Document Server

    Panta, Raj Kumar; Bell, Stephen T; Anderson, Nigel G; Butler, Anthony P; Butler, Philip H

    2015-01-01

    The energy information acquired using spectral X-ray detectors allows noninvasive identification and characterization of chemical components of a material. To achieve this, it is important that the energy response of the detector is calibrated. The established techniques for energy calibration are not practical for routine use in pre-clinical or clinical research environment. This is due to the requirements of using monochromatic radiation sources such as synchrotron, radio-isotopes, and prohibitively long time needed to set up the equipment and make measurements. To address these limitations, we have developed an automated technique for calibrating the energy response of the pixels in a spectral X-ray detector that runs with minimal user intervention. This technique uses the X-ray tube voltage (kVp) as a reference energy, which is stepped through an energy range of interest. This technique locates the energy threshold where a pixel transitions from not-counting (off) to counting (on). Similarly, we have deve...

  1. Study of run time errors of the ATLAS Pixel Detector in the 2012 data taking period

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00339072

    2013-05-16

    The high resolution silicon Pixel detector is critical in event vertex reconstruction and in particle track reconstruction in the ATLAS detector. During the pixel data taking operation, some modules (Silicon Pixel sensor +Front End Chip+ Module Control Chip (MCC)) go to an auto-disable state, where the Modules don’t send the data for storage. Modules become operational again after reconfiguration. The source of the problem is not fully understood. One possible source of the problem is traced to the occurrence of single event upset (SEU) in the MCC. Such a module goes to either a Timeout or Busy state. This report is the study of different types and rates of errors occurring in the Pixel data taking operation. Also, the study includes the error rate dependency on Pixel detector geometry.

  2. Monte Carlo simulation of the imaging properties of scintillator-coated X-ray pixel detectors

    International Nuclear Information System (INIS)

    Hjelm, M.; Norlin, B.; Nilsson, H.-E.; Froejdh, C.; Badel, X.

    2003-01-01

    The spatial resolution of scintillator-coated X-ray pixel detectors is usually limited by the isotropic light spread in the scintillator. One way to overcome this limitation is to use a pixellated scintillating layer on top of the semiconductor pixel detector. Using advanced etching and filling techniques, arrays of CsI columns have been successfully fabricated and characterized. Each CsI waveguide matches one pixel of the semiconductor detector, limiting the spatial spread of light. Another concept considered in this study is to detect the light emitted from the scintillator by diodes formed in the silicon pore walls. There is so far no knowledge regarding the theoretical limits for these two approaches, which makes the evaluation of the fabrication process difficult. In this work we present numerical calculations of the signal-to-noise ratio (SNR) for detector designs based on scintillator-filled pores in silicon. The calculations are based on separate Monte Carlo (MC) simulations of X-ray absorption and light transport in scintillator waveguides. The resulting data are used in global MC simulations of flood exposures of the detector array, from which the SNR values are obtained. Results are presented for two scintillator materials, namely CsI(Tl) and GADOX

  3. Development of Micromegas-like gaseous detectors using a pixel readout chip as collecting anode

    International Nuclear Information System (INIS)

    Chefdeville, M.

    2009-01-01

    This thesis reports on the fabrication and test of a new gaseous detector with a very large number of readout channels. This detector is intended for measuring the tracks of charged particles with an unprecedented sensitivity to single electrons of almost 100 %. It combines a metal grid for signal amplification called the Micromegas with a pixel readout chip as signal collecting anode and is dubbed GridPix. GridPix is a potential candidate for a sub-detector at a future electron linear collider (ILC) foreseen to work in parallel with the LHC around 2020--2030. The tracking capability of GridPix is best exploited if the Micromegas is integrated on the pixel chip. This integrated grid is called InGrid and is precisely fabricated by wafer post-processing. The various steps of the fabrication process and the measurements of its gain, energy resolution and ion back-flow property are reported in this document. Studies of the response of the complete detector formed by an InGrid and a TimePix pixel chip to X-rays and cosmic particles are also presented. In particular, the efficiency for detecting single electrons and the point resolution in the pixel plane are measured. Implications for a GridPix detector at ILC are discussed. (author)

  4. Photon-counting hexagonal pixel array CdTe detector: Spatial resolution characteristics for image-guided interventional applications

    Energy Technology Data Exchange (ETDEWEB)

    Vedantham, Srinivasan; Shrestha, Suman; Karellas, Andrew, E-mail: andrew.karellas@umassmed.edu; Shi, Linxi; Gounis, Matthew J. [Department of Radiology, University of Massachusetts Medical School, Worcester, Massachusetts 01655 (United States); Bellazzini, Ronaldo; Spandre, Gloria; Brez, Alessandro; Minuti, Massimo [Istituto Nazionale di Fisica Nucleare (INFN), Pisa 56127, Italy and Pixirad Imaging Counters s.r.l., L. Pontecorvo 3, Pisa 56127 (Italy)

    2016-05-15

    Purpose: High-resolution, photon-counting, energy-resolved detector with fast-framing capability can facilitate simultaneous acquisition of precontrast and postcontrast images for subtraction angiography without pixel registration artifacts and can facilitate high-resolution real-time imaging during image-guided interventions. Hence, this study was conducted to determine the spatial resolution characteristics of a hexagonal pixel array photon-counting cadmium telluride (CdTe) detector. Methods: A 650 μm thick CdTe Schottky photon-counting detector capable of concurrently acquiring up to two energy-windowed images was operated in a single energy-window mode to include photons of 10 keV or higher. The detector had hexagonal pixels with apothem of 30 μm resulting in pixel pitch of 60 and 51.96 μm along the two orthogonal directions. The detector was characterized at IEC-RQA5 spectral conditions. Linear response of the detector was determined over the air kerma rate relevant to image-guided interventional procedures ranging from 1.3 nGy/frame to 91.4 μGy/frame. Presampled modulation transfer was determined using a tungsten edge test device. The edge-spread function and the finely sampled line spread function accounted for hexagonal sampling, from which the presampled modulation transfer function (MTF) was determined. Since detectors with hexagonal pixels require resampling to square pixels for distortion-free display, the optimal square pixel size was determined by minimizing the root-mean-squared-error of the aperture functions for the square and hexagonal pixels up to the Nyquist limit. Results: At Nyquist frequencies of 8.33 and 9.62 cycles/mm along the apothem and orthogonal to the apothem directions, the modulation factors were 0.397 and 0.228, respectively. For the corresponding axis, the limiting resolution defined as 10% MTF occurred at 13.3 and 12 cycles/mm, respectively. Evaluation of the aperture functions yielded an optimal square pixel size of 54

  5. Last Few Metres for the Barrel Calorimeter

    CERN Multimedia

    Nyman, T.

    On Friday 4th November, the ATLAS Barrel Calorimeter was moved from its assembly point at the side of the ATLAS cavern to the centre of the toroidal magnet system. The detector was finally aligned, to the precision of within a millimetre, on Wednesday 9th November. The ATLAS installation team, led by Tommi Nyman, after having positioned the Barrel Calorimeter in its final location in the ATLAS experimental cavern UX15. The Barrel Calorimeter which will absorb and measure the energy of photons, electrons and hadrons at the core of the ATLAS detector is 8.6 meters in diameter, 6.8 meters long, and weighs over 1600 Tonnes. It consists of two concentric cylindrical detector elements. The innermost comprises aluminium pressure vessels containing the liquid argon electromagnetic calorimeter and the solenoid magnet. The outermost is an assembly of 64 hadron tile calorimeter sectors. Assembled 18 meters away from its final position, the Barrel Calorimeter was relocated with the help of a railway, which allows ...

  6. Development of Small-Pixel CZT Detectors for Future High-Resolution Hard X-ray Missions

    Science.gov (United States)

    Beilicke, Matthias

    Owing to recent breakthroughs in grazing incidence mirror technology, next-generation hard X-ray telescopes will achieve angular resolutions of between 5 and 10 arc seconds - about an order of magnitude better than that of the NuSTAR hard X-ray telescope. As a consequence, the next generation of hard X-ray telescopes will require pixelated hard X- ray detectors with pixels on a grid with a lattice constant of between 120 and 240 um. Additional detector requirements include a low energy threshold of less than 5 keV and an energy resolution of less than 1 keV. The science drivers for a high angular-resolution hard X-ray mission include studies and measurements of black hole spins, the cosmic evolution of super-massive black holes, AGN feedback, and the behavior of matter at very high densities. We propose a R&D research program to develop, optimize and study the performance of 100-200 um pixel pitch CdTe and Cadmium Zinc Telluride (CZT) detectors of 1-2 mm thickness. Our program aims at a comparison of the performance achieved with CdTe and CZT detectors, and the optimization of the pixel, steering grid, and guard ring anode patterns. Although these studies will use existing ASICs (Application Specific Integrated Circuits), our program also includes modest funds for the development of an ultra-low noise ASIC with a 2-D grid of readout pads that can be directly bonded to the 100-200 um pixel pitch CdTe and CZT detectors. The team includes the Washington University group (Prof. M. Beilicke and Co-I Prof. H.S.W. Krawczynski et al.), and co-investigator G. De Geronimo at Brookhaven National Laboratory (BNL). The Washington University group has a 10 year track record of innovative CZT detector R&D sponsored by the NASA Astronomy and Physics Research and Analysis (APRA) program. The accomplishments to date include the development of CZT detectors with pixel pitches between 350 um and 2.5 mm for the ProtoExist, EXIST, and X-Calibur hard X-ray missions with some of the best

  7. Pixel detectors for x-ray imaging spectroscopy in space

    International Nuclear Information System (INIS)

    Treis, J; Andritschke, R; Hartmann, R; Herrmann, S; Holl, P; Lauf, T; Lechner, P; Lutz, G; Meidinger, N; Porro, M; Richter, R H; Schopper, F; Soltau, H; Strueder, L

    2009-01-01

    Pixelated semiconductor detectors for X-ray imaging spectroscopy are foreseen as key components of the payload of various future space missions exploring the x-ray sky. Located on the platform of the new Spectrum-Roentgen-Gamma satellite, the eROSITA (extended Roentgen Survey with an Imaging Telescope Array) instrument will perform an imaging all-sky survey up to an X-ray energy of 10 keV with unprecedented spectral and angular resolution. The instrument will consist of seven parallel oriented mirror modules each having its own pnCCD camera in the focus. The satellite born X-ray observatory SIMBOL-X will be the first mission to use formation-flying techniques to implement an X-ray telescope with an unprecedented focal length of around 20 m. The detector instrumentation consists of separate high- and low energy detectors, a monolithic 128 x 128 DEPFET macropixel array and a pixellated CdZTe detector respectively, making energy band between 0.5 to 80 keV accessible. A similar concept is proposed for the next generation X-ray observatory IXO. Finally, the MIXS (Mercury Imaging X-ray Spectrometer) instrument on the European Mercury exploration mission BepiColombo will use DEPFET macropixel arrays together with a small X-ray telescope to perform a spatially resolved planetary XRF analysis of Mercury's crust. Here, the mission concepts and their scientific targets are briefly discussed, and the resulting requirements on the detector devices together with the implementation strategies are shown.

  8. Pixel detectors for x-ray imaging spectroscopy in space

    Science.gov (United States)

    Treis, J.; Andritschke, R.; Hartmann, R.; Herrmann, S.; Holl, P.; Lauf, T.; Lechner, P.; Lutz, G.; Meidinger, N.; Porro, M.; Richter, R. H.; Schopper, F.; Soltau, H.; Strüder, L.

    2009-03-01

    Pixelated semiconductor detectors for X-ray imaging spectroscopy are foreseen as key components of the payload of various future space missions exploring the x-ray sky. Located on the platform of the new Spectrum-Roentgen-Gamma satellite, the eROSITA (extended Roentgen Survey with an Imaging Telescope Array) instrument will perform an imaging all-sky survey up to an X-ray energy of 10 keV with unprecedented spectral and angular resolution. The instrument will consist of seven parallel oriented mirror modules each having its own pnCCD camera in the focus. The satellite born X-ray observatory SIMBOL-X will be the first mission to use formation-flying techniques to implement an X-ray telescope with an unprecedented focal length of around 20 m. The detector instrumentation consists of separate high- and low energy detectors, a monolithic 128 × 128 DEPFET macropixel array and a pixellated CdZTe detector respectively, making energy band between 0.5 to 80 keV accessible. A similar concept is proposed for the next generation X-ray observatory IXO. Finally, the MIXS (Mercury Imaging X-ray Spectrometer) instrument on the European Mercury exploration mission BepiColombo will use DEPFET macropixel arrays together with a small X-ray telescope to perform a spatially resolved planetary XRF analysis of Mercury's crust. Here, the mission concepts and their scientific targets are briefly discussed, and the resulting requirements on the detector devices together with the implementation strategies are shown.

  9. Pixel detectors for x-ray imaging spectroscopy in space

    Energy Technology Data Exchange (ETDEWEB)

    Treis, J; Andritschke, R; Hartmann, R; Herrmann, S; Holl, P; Lauf, T; Lechner, P; Lutz, G; Meidinger, N; Porro, M; Richter, R H; Schopper, F; Soltau, H; Strueder, L [MPI Semiconductor Laboratory, Otto-Hahn-Ring 6, D-81739 Munich (Germany)], E-mail: jft@hll.mpg.de

    2009-03-15

    Pixelated semiconductor detectors for X-ray imaging spectroscopy are foreseen as key components of the payload of various future space missions exploring the x-ray sky. Located on the platform of the new Spectrum-Roentgen-Gamma satellite, the eROSITA (extended Roentgen Survey with an Imaging Telescope Array) instrument will perform an imaging all-sky survey up to an X-ray energy of 10 keV with unprecedented spectral and angular resolution. The instrument will consist of seven parallel oriented mirror modules each having its own pnCCD camera in the focus. The satellite born X-ray observatory SIMBOL-X will be the first mission to use formation-flying techniques to implement an X-ray telescope with an unprecedented focal length of around 20 m. The detector instrumentation consists of separate high- and low energy detectors, a monolithic 128 x 128 DEPFET macropixel array and a pixellated CdZTe detector respectively, making energy band between 0.5 to 80 keV accessible. A similar concept is proposed for the next generation X-ray observatory IXO. Finally, the MIXS (Mercury Imaging X-ray Spectrometer) instrument on the European Mercury exploration mission BepiColombo will use DEPFET macropixel arrays together with a small X-ray telescope to perform a spatially resolved planetary XRF analysis of Mercury's crust. Here, the mission concepts and their scientific targets are briefly discussed, and the resulting requirements on the detector devices together with the implementation strategies are shown.

  10. Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

    International Nuclear Information System (INIS)

    Krzywda, A.; Alagoz, E.; Bubna, M.; Obertino, M.; Solano, A.; Arndt, K.; Uplegger, L.; Betta, G.F. Dalla; Boscardin, M.; Ngadiuba, J.; Rivera, R.; Menasce, D.; Moroni, L.; Terzo, S.; Bortoletto, D.; Prosser, A.; Adreson, J.; Kwan, S.; Osipenkov, I.; Bolla, G.

    2014-01-01

    In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10 15 n eq /cm 2

  11. PixTrig: a Level 2 track finding algorithm based on pixel detector

    CERN Document Server

    Baratella, A; Morettini, P; Parodi, F

    2000-01-01

    This note describes an algorithm for track search at Level 2 based on pixel detector. Using three pixel clusters we can produce a reconstruction of the track parameter in both z and R-phi plane. These track segments can be used as seed for more sophisticated track finding algorithms or used directly, especially when impact parameter resolution is crucial. The algorithm efficiency is close to 90% for pt > 1 GeV/c and the processing time is small enough to allow a complete detector reconstruction (non RoI guided) within the Level 2 processing.

  12. 50 μm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis

    International Nuclear Information System (INIS)

    Zhao, C; Kanicki, J; Konstantinidis, A C; Zheng, Y; Speller, R D; Anaxagoras, T

    2015-01-01

    Wafer-scale CMOS active pixel sensors (APSs) have been developed recently for x-ray imaging applications. The small pixel pitch and low noise are very promising properties for medical imaging applications such as digital breast tomosynthesis (DBT). In this work, we evaluated experimentally and through modeling the imaging properties of a 50 μm pixel pitch CMOS APS x-ray detector named DynAMITe (Dynamic Range Adjustable for Medical Imaging Technology). A modified cascaded system model was developed for CMOS APS x-ray detectors by taking into account the device nonlinear signal and noise properties. The imaging properties such as modulation transfer function (MTF), noise power spectrum (NPS), and detective quantum efficiency (DQE) were extracted from both measurements and the nonlinear cascaded system analysis. The results show that the DynAMITe x-ray detector achieves a high spatial resolution of 10 mm −1 and a DQE of around 0.5 at spatial frequencies  <1 mm −1 . In addition, the modeling results were used to calculate the image signal-to-noise ratio (SNR i ) of microcalcifications at various mean glandular dose (MGD). For an average breast (5 cm thickness, 50% glandular fraction), 165 μm microcalcifications can be distinguished at a MGD of 27% lower than the clinical value (∼1.3 mGy). To detect 100 μm microcalcifications, further optimizations of the CMOS APS x-ray detector, image aquisition geometry and image reconstruction techniques should be considered. (paper)

  13. Test Beam Results of Geometry Optimized Hybrid Pixel Detectors

    CERN Document Server

    Becks, K H; Grah, C; Mättig, P; Rohe, T

    2006-01-01

    The Multi-Chip-Module-Deposited (MCM-D) technique has been used to build hybrid pixel detector assemblies. This paper summarises the results of an analysis of data obtained in a test beam campaign at CERN. Here, single chip hybrids made of ATLAS pixel prototype read-out electronics and special sensor tiles were used. They were prepared by the Fraunhofer Institut fuer Zuverlaessigkeit und Mikrointegration, IZM, Berlin, Germany. The sensors feature an optimized sensor geometry called equal sized bricked. This design enhances the spatial resolution for double hits in the long direction of the sensor cells.

  14. Silicon pixel R&D for the CLIC detector

    CERN Document Server

    AUTHOR|(SzGeCERN)674552

    2017-01-01

    The physics aims at the future CLIC high-energy linear $e^{+}e^{−}$ collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The main challenges are: a point resolution of a few microns, ultra-low mass (~0.2% X$_{0}$ per layer for the vertex region and ~1% X$_{0}$ per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ~10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analogue readout are explored. For the outer tra...

  15. Testbeam and laboratory test results of irradiated 3D CMS pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Bubna, Mayur [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Purdue University, School of Electrical and Computer Engineering, West Lafayette, IN 47907-1396 (United States); Alagoz, Enver, E-mail: enver.alagoz@cern.ch [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Cervantes, Mayra; Krzywda, Alex; Arndt, Kirk [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Obertino, Margherita; Solano, Ada [Istituto Nazionale di Fisica Nucleare, Sezione di Torino, 10125 Torino (Italy); Dalla Betta, Gian-Franco [INFN Padova (Gruppo Collegato di Trento) (Italy); Dipartimento di Ingegneria e Scienzadella Informazione, Universitá di Trento, I-38123 Povo di Trento (Italy); Menace, Dario; Moroni, Luigi [Istituto Nazionale di Fisica Nucleare, Sezione di Milano Bicocca (Italy); Universitá degli Studi di Milano Bicocca, 20126 Milano (Italy); Uplegger, Lorenzo; Rivera, Ryan [Fermi National Accelerator Laboratory, Batavia, IL 60510-0500 (United States); Osipenkov, Ilya [Texas A and M University, Department of Physics, College Station, TX 77843-4242 (United States); Andresen, Jeff [Fermi National Accelerator Laboratory, Batavia, IL 60510-0500 (United States); Bolla, Gino; Bortoletto, Daniela [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Boscardin, Maurizio [Centro per i Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Trento, I-38123 Povo di Trento (Italy); Marie Brom, Jean [Strasbourg IPHC, Institut Pluriedisciplinaire Hubert Curien, F-67037 Strasbourg Cedex (France); Brosius, Richard [State University of New York at Buffalo (SUNY), Department of Physics, Buffalo, NY 14260-1500 (United States); Chramowicz, John [Fermi National Accelerator Laboratory, Batavia, IL 60510-0500 (United States); and others

    2013-12-21

    The CMS silicon pixel detector is the tracking device closest to the LHC p–p collisions, which precisely reconstructs the charged particle trajectories. The planar technology used in the current innermost layer of the pixel detector will reach the design limit for radiation hardness at the end of Phase I upgrade and will need to be replaced before the Phase II upgrade in 2020. Due to its unprecedented performance in harsh radiation environments, 3D silicon technology is under consideration as a possible replacement of planar technology for the High Luminosity-LHC or HL-LHC. 3D silicon detectors are fabricated by the Deep Reactive-Ion-Etching (DRIE) technique which allows p- and n-type electrodes to be processed through the silicon substrate as opposed to being implanted through the silicon surface. The 3D CMS pixel devices presented in this paper were processed at FBK. They were bump bonded to the current CMS pixel readout chip, tested in the laboratory, and testbeams carried out at FNAL with the proton beam of 120 GeV/c. In this paper we present the laboratory and beam test results for the irradiated 3D CMS pixel devices. -- Highlights: •Pre-irradiation and post-irradiation electrical properties of 3D sensors and 3D diodes from various FBK production batches were measured and analyzed. •I–T measurements of gamma irradiated diodes were analyzed to understand leakage current generation mechanism in 3D diodes. •Laboratory measurements: signal to noise ratio and charge collection efficiency of 3D sensors before and after irradiation. •Testbeam measurements: pre- and post-irradiation pixel cell efficiency and position resolution of 3D sensors.

  16. The upgraded Pixel Detector of the ATLAS Experiment for Run-II at the Large Hadron Collider

    CERN Document Server

    AUTHOR|(INSPIRE)INSPIRE-00407702

    2016-01-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the LHC. Taking advantage of the detector development period 2013 – 2014, the detector was extracted from the experiment and brought to surface to equip it with new service panels and to repair modules furthermore this helped with the installation of the Insertable B-Layer (IBL), fourth layer of pixel, installed in between the existing Pixel Detector and a new beam-pipe at a radius of 3.3 cm. To cope with the high radiation and increased pixel occupancy due to the proximity to the interaction point, two different silicon sensor technologies (planar and 3D) have been used. A new readout chip has been designed with CMOS 130nm technology with larger area, smaller pixel size and faster readout capability. Dedicated design features in combination with a new composite material were considered and used in order to reduce the material budget of the support structure while keeping the optimal thermo-mechanical perfor...

  17. Neutron irradiation test of depleted CMOS pixel detector prototypes

    International Nuclear Information System (INIS)

    Mandić, I.; Cindro, V.; Gorišek, A.; Hiti, B.; Kramberger, G.; Mikuž, M.; Zavrtanik, M.; Hemperek, T.; Daas, M.; Hügging, F.; Krüger, H.; Pohl, D.-L.; Wermes, N.; Gonella, L.

    2017-01-01

    Charge collection properties of depleted CMOS pixel detector prototypes produced on p-type substrate of 2 kΩ cm initial resistivity (by LFoundry 150 nm process) were studied using Edge-TCT method before and after neutron irradiation. The test structures were produced for investigation of CMOS technology in tracking detectors for experiments at HL-LHC upgrade. Measurements were made with passive detector structures in which current pulses induced on charge collecting electrodes could be directly observed. Thickness of depleted layer was estimated and studied as function of neutron irradiation fluence. An increase of depletion thickness was observed after first two irradiation steps to 1 · 10 13 n/cm 2 and 5 · 10 13 n/cm 2 and attributed to initial acceptor removal. At higher fluences the depletion thickness at given voltage decreases with increasing fluence because of radiation induced defects contributing to the effective space charge concentration. The behaviour is consistent with that of high resistivity silicon used for standard particle detectors. The measured thickness of the depleted layer after irradiation with 1 · 10 15 n/cm 2 is more than 50 μm at 100 V bias. This is sufficient to guarantee satisfactory signal/noise performance on outer layers of pixel trackers in HL-LHC experiments.

  18. Performance of hybrid photon detector prototypes with encapsulated silicon pixel detector and readout for the RICH counters of LHCb

    International Nuclear Information System (INIS)

    Campbell, M.; George, K.A.; Girone, M.; Gys, T.; Jolly, S.; Piedigrossi, D.; Riedler, P.; Rozema, P.; Snoeys, W.; Wyllie, K.

    2003-01-01

    These proceedings report on the performance of the latest prototype pixel hybrid photon detector in preparation for the LHCb Ring Imaging Cherenkov detectors. The prototype encapsulates a silicon pixel detector bump-bonded to a binary read-out chip with short (25 ns) peaking time and low ( - ) detection threshold. A brief description of the prototype is given, followed by the preliminary results of the characterisation of the prototype behaviour when tested using a low intensity pulsed light emitting diode. The results obtained are in good agreement with those obtained using previous prototypes. The proceedings conclude with a summary of the current status and future plans

  19. Planar sensors for the upgrade of the CMS pixel detector

    International Nuclear Information System (INIS)

    Rohe, T.; Bean, A.; Radicci, V.; Sibille, J.

    2011-01-01

    A replacement of the present CMS pixel detector with a better performing light weight four-layer system is foreseen in 2016. In the lifetime of this new system the LHC will reach and exceed its nominal luminosity of 10 34 cm -2 s -1 . Therefore the radiation hardness of all parts of the pixel system has to be reviewed. For the construction of the much larger four-layer pixel system, the replacement of the present double sided sensors by much cheaper single sided ones is considered. However, the construction of pixel modules with such sensors is challenging due to the small geometrical distance of the sensor high voltage and the ground of the readout electronics. This small distance limits the sensor bias to about 500 V in the tested samples.

  20. An EUDET/AIDA Pixel Beam Telescope for Detector Development

    CERN Document Server

    Perrey, Hanno

    2013-01-01

    A high resolution ($\\sigma 2 \\sim \\mu$) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. The telescope consists of six sensor planes using Mimosa26 MAPS with a pixel pitch of $18.4 \\mu$ and thinned down to $50 \\mu$. The excellent resolution, readout rate and DAQ integration capabilities made the telescope a primary test beam tool for many groups including several CERN based experiments. Within the new European detector infrastructure project AIDA the test beam telescope will be further extended in terms of cooling infrastructure, readout speed and precision. In order to provide a system optimized for the different requirements by the user community, a combination of various pixel technologies is foreseen. In this report the design of this even more flexible telescope with three different pixel technologies (TimePix, Mimosa, ATLAS FE-I4) will be presented. First test beam results with the HitOR signal provided by the FE-I4 integrated into the trigger...

  1. Monitoring the Radiation Damage of the ATLAS Pixel Detector

    CERN Document Server

    Cooke, M; The ATLAS collaboration

    2012-01-01

    The Pixel Detector is the innermost charged particle tracking component employed by the ATLAS experiment at the CERN Large Hadron Collider (LHC). The instantaneous luminosity delivered by the LHC, now routinely in excess of 5x10^{33} cm^{-2} s^{-1}, results in a rapidly increasing accumulated radiation dose to the detector. Methods based on the sensor depletion properties and leakage current are used to monitor the evolution of the radiation damage, and results from the 2011 run are presented.

  2. Monitoring the radiation damage of the ATLAS pixel detector

    International Nuclear Information System (INIS)

    Cooke, M.

    2013-01-01

    The pixel detector is the innermost charged particle tracking component employed by the ATLAS experiment at the CERN Large Hadron Collider (LHC). The instantaneous luminosity delivered by the LHC, now routinely in excess of 5×10 33 cm −2 s −1 , results in a rapidly increasing accumulated radiation dose to the detector. Methods based on the sensor depletion properties and leakage current are used to monitor the evolution of the radiation damage, and results from the 2011 run are presented

  3. ATLAS ITk Strip Detector for High-Luminosity LHC

    CERN Document Server

    Kroll, Jiri; The ATLAS collaboration

    2017-01-01

    The ATLAS experiment is currently preparing for an upgrade of the tracking system in the course of the High-Luminosity LHC that is scheduled for 2026. The expected peak instantaneous luminosity up to 7.5E34 per second and cm2 corresponding to approximately 200 inelastic proton-proton interactions per beam crossing, radiation damage at an integrated luminosity of 3000/fb and hadron fluencies over 1E16 1 MeV neutron equivalent per cm2, as well as fast hardware tracking capability that will bring Level-0 trigger rate of a few MHz down to a Level-1 trigger rate below 1 MHz require a replacement of existing Inner Detector by an all-silicon Inner Tracker (ITk) with a pixel detector surrounded by a strip detector. The current prototyping phase, that is working with ITk Strip Detector consisting of a four-layer barrel and a forward region composed of six discs on each side of the barrel, has resulted in the ATLAS ITk Strip Detector Technical Design Report (TDR), which starts the pre-production readiness phase at the ...

  4. ATLAS ITk Strip Detector for High-Luminosity LHC

    CERN Document Server

    Kroll, Jiri; The ATLAS collaboration

    2017-01-01

    The ATLAS experiment is currently preparing for an upgrade of the tracking system in the course of the High-Luminosity LHC that is scheduled for 2026. The expected peak instantaneous luminosity up to $7.5\\times10^{34}\\;\\mathrm{cm}^{-2}\\mathrm{s}^{-1}$ corresponding to approximately 200 inelastic proton-proton interactions per beam crossing, radiation damage at an integrated luminosity of $3000\\;\\mathrm{fb}^{-1}$ and hadron fluencies over $2\\times10^{16}\\;\\mathrm{n}_{\\mathrm{eq}}/\\mathrm{cm}^{2}$, as well as fast hardware tracking capability that will bring Level-0 trigger rate of a few MHz down to a Level-1 trigger rate below 1 MHz require a replacement of existing Inner Detector by an all-silicon Inner Tracker with a pixel detector surrounded by a strip detector. The current prototyping phase, that is working with ITk Strip Detector consisting of a four-layer barrel and a forward region composed of six disks on each side of the barrel, has resulted in the ATLAS Inner Tracker Strip Detector Technical Design R...

  5. Analysis of 3D stacked fully functional CMOS Active Pixel Sensor detectors

    International Nuclear Information System (INIS)

    Passeri, D; Servoli, L; Meroli, S

    2009-01-01

    The IC technology trend is to move from 3D flexible configurations (package on package, stacked dies) to real 3D ICs. This is mainly due to i) the increased electrical performances and ii) the cost of 3D integration which may be cheaper than to keep shrinking 2D circuits. Perspective advantages for particle tracking and vertex detectors applications in High Energy Physics can be envisaged: in this work, we will focus on the capabilities of the state-of-the-art vertical scale integration technologies, allowing for the fabrication of very compact, fully functional, multiple layers CMOS Active Pixel Sensor (APS) detectors. The main idea is to exploit the features of the 3D technologies for the fabrication of a ''stack'' of very thin and precisely aligned CMOS APS layers, leading to a single, integrated, multi-layers pixel sensor. The adoption of multiple-layers single detectors can dramatically reduce the mass of conventional, separated detectors (thus reducing multiple scattering issues), at the same time allowing for very precise measurements of particle trajectory and momentum. As a proof of concept, an extensive device and circuit simulation activity has been carried out, aiming at evaluate the suitability of such a kind of CMOS active pixel layers for particle tracking purposes.

  6. Charge sharing and charge loss in a cadmium-zinc-telluride fine-pixel detector array

    International Nuclear Information System (INIS)

    Gaskin, J.A.; Sharma, D.P.; Ramsey, B.D.

    2003-01-01

    Because of its high atomic number, room temperature operation, low noise, and high spatial resolution a cadmium-zinc-telluride multi-pixel detector is ideal for hard X-ray astrophysical observation. As part of on-going research at MSFC to develop multi-pixel CdZnTe detectors for this purpose, we have measured charge sharing and charge loss for a 4x4 (750 μm pitch), 1 mm thick pixel array and modeled these results using a Monte-Carlo simulation. This model was then used to predict the amount of charge sharing for a much finer pixel array (with a 300 μm pitch). Future work will enable us to compare the simulated results for the finer array to measured values

  7. Optimization of CZT Detectors with Sub-mm Pixel Pitches Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose to develop and optimize 0.5 cm thick Cadmium Zinc Telluride (CZT) detectors with very small pixel pitches, i.e. 350 micron and 600 micron. The proposed...

  8. Development of a readout technique for the high data rate BTeV pixel detector at Fermilab

    International Nuclear Information System (INIS)

    Hall, Bradley K.

    2001-01-01

    The pixel detector for the BTeV experiment at Fermilab provides digitized data from approximately 22 million silicon pixel channels. Portions of the detector are six millimeters from the beam providing a substantial hit rate and high radiation dose. The pixel detector data will be employed by the lowest level trigger system for track reconstruction every beam crossing. These requirements impose a considerable constraint on the readout scheme. This paper presents a readout technique that provides the bandwidth that is adequate for high hit rates, minimizes the number of radiation hard components, and satisfies all other design constraints

  9. Prototype test for the PANDA barrel DIRC

    Energy Technology Data Exchange (ETDEWEB)

    Dzhygadlo, Roman; Gerhardt, Andreas; Kalicy, Grzegorz; Krebs, Marvin; Lehmann, Dorothe; Schwarz, Carsten; Schwiening, Jochen; Belias, Anastasios; Traxler, Michael [GSI Helmholtzzentrum fur Schwerionenforschung GmbH, Darmstadt (Germany); Peters, Klaus [GSI Helmholtzzentrum fur Schwerionenforschung GmbH, Darmstadt (Germany); Goethe-Universitaet Frankfurt (Germany); Collaboration: PANDA-Collaboration

    2016-07-01

    The Barrel DIRC (Detector of Internally Reflected Cherenkov light) is designed to provide particle identification (PID) for the PANDA experiment at the new Facility for Antiproton and Ion Research in Europe (FAIR) at GSI, Darmstadt. It is based on the successful BABAR DIRC detector with several key improvements, such as focusing optics, fast timing, and a compact expansion volume. A large prototype was constructed and tested in a hadronic particle beam at CERN during the summer of 2015 to test the PID performance of different design options. The prototype included a fused silica radiator (either a narrow bar or a wide plate), an optional focusing lens, and a prism-shaped fused silica expansion volume. An array of microchannel-plate photomultiplier tubes measured the location and arrival time of the Cherenkov photons on 960 pixels. Data were collected for two radiator geometries and several types of focusing lenses at different beam momenta and polar angles. Results of the analysis as well as a comparison to the Geant4 simulation are presented.

  10. CMS Pixel Upgrade for the Phase I: Module Production and Qualification

    CERN Document Server

    AUTHOR|(CDS)2078028

    2016-01-01

    The present CMS pixel detector has been designed to be fully efficient up to a LHC luminosity of $10^{34}~\\mathrm{cm}^{-2}~\\mathrm{s}^{-1}$. However, the luminosity will increase by a factor of two in the coming years. Therefore it is planned to build and install a new detector in the extended year-end technical stop (YETS) in 2016-17. Barrel pixel modules are in production since Spring/Summer 2015 in five different centers. Module production requires bump bonding, wire bonding and gluing processes to finally assemble a full module. To have a uniform performance of all modules standard qualification procedures have been developed. All modules will be subjected to 10 termal cycles between +$17^{\\circ}$C and -$25^{\\circ }$C and then electrically tested. In addition, module performance will be verified under high rate X-rays, and internal calibrate signals used for electrical tests will be calibrated in units of electrons using well defined X-ray fluorescence lines from different target materials. The qualifica...

  11. Development of carbon fiber staves for the strip part of the PANDA micro vertex detector

    Energy Technology Data Exchange (ETDEWEB)

    Quagli, Tommaso; Brinkmann, Kai-Thomas [II. Physikalisches Institut, Justus-Liebig Universitaet Giessen (Germany); Fracassi, Vincenzo; Grunwald, Dirk; Rosenthal, Eberhard [ZEA-1, Forschungszentrum Juelich GmbH, Juelich (Germany); Collaboration: PANDA-Collaboration

    2015-07-01

    PANDA is a key experiment of the future FAIR facility, under construction in Darmstadt, Germany. It will study the collisions between an antiproton beam and a fixed proton or nuclear target. The Micro Vertex Detector (MVD) is the innermost detector of the apparatus and is composed of four concentric barrels and six forward disks, instrumented with silicon hybrid pixel detectors and double-sided silicon microstrip detectors; its main task is the identification of primary and secondary vertices. The central requirements include high spatial and time resolution, trigger-less readout with high rate capability, good radiation tolerance and low material budget. Because of the compact layout of the system, its integration poses significant challenges. The detectors in the strip barrels will be supported by a composite structure of carbon fiber and carbon foam; a water-based cooling system embedded in the mechanical supports will be used to remove the excess heat from the readout electronics. In this contribution the design of the barrel stave and the ongoing development of some hardware components related to its integration will be presented.

  12. Low mass hybrid pixel detectors for the high luminosity LHC upgrade

    CERN Document Server

    Gonella, Laura; Desch, Klaus

    2013-11-11

    Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are dis...

  13. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    Energy Technology Data Exchange (ETDEWEB)

    Puellen, Lukas

    2015-02-10

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  14. Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    Puellen, Lukas

    2015-01-01

    In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

  15. Right and left support feet of the Central Barrel Yoke of the CMS Detector

    CERN Multimedia

    Franz Leher, DWE

    2000-01-01

    Fully loaded the Central Barrel will weigh 3000 tonnes. Those feet have tosupport this weight. Therefore they are made of 120 mm thick steel plates.To guarantee a maximum coverage for the muon detctor they will house a muon detector just benaeth the top plate. Weight of 1 foot is 35 tonnes.Its height is 3.5 m and it is 2.5 m large

  16. High bandwidth pixel detector modules for the ATLAS Insertable B-Layer

    International Nuclear Information System (INIS)

    Backhaus, Malte

    2014-01-01

    The investigation of the nature of the recently discovered electro-weak symmetry breaking mechanism of the standard model of particle physics as well as the search for physics beyond the standard model with the LHC require to collect even more data. To achieve this goal, the luminosity of the LHC will be increased in two steps. The increased luminosity results in serious challenges for the inner tracking systems of the experiments at the LHC. The ATLAS pixel detector will also be upgraded in a two stage program. During the shutdown in 2013 and 2014 a fourth hybrid pixel detector layer, the socalled Insertable B-Layer (IBL) is inserted inside the existing pixel detector. This thesis focuses on the characterization, performance measurement, and production quality assurance of the central sensitive elements of the IBL, the modules. This includes a full characterization of the readout chip (FE-I4) and of the assembled modules. A completely new inner tracking system is mandatory in ATLAS after the second luminosity increase in the shutdown of 2022 and 2023. The final chapter of this thesis introduces a new module concept that uses an industrial high voltage CMOS technology as sensor layer, which is capacitively coupled to the FE-I4 readout chip.

  17. Display of cosmic ray event going through the pixel detector taken on October 18th 2008

    CERN Multimedia

    ATLAS, Experiment

    2014-01-01

    Shown are the XY view (of SCT and pixels and of pixels alone) and an RZ view. The track has a hit in each of the layers in both the upper and the lower hemisphere. In the bottom of L0 there are even two hits due to a module overlap. Apart from the signal hits there is only one other hit in the pixel detector demonstrating the very low noise level in the detector.

  18. Design Studies of a CZT-based Detector Combined with a Pixel-Geometry-Matching Collimator for SPECT Imaging.

    Science.gov (United States)

    Weng, Fenghua; Bagchi, Srijeeta; Huang, Qiu; Seo, Youngho

    2013-10-01

    Single Photon Emission Computed Tomography (SPECT) suffers limited efficiency due to the need for collimators. Collimator properties largely decide the data statistics and image quality. Various materials and configurations of collimators have been investigated in many years. The main thrust of our study is to evaluate the design of pixel-geometry-matching collimators to investigate their potential performances using Geant4 Monte Carlo simulations. Here, a pixel-geometry-matching collimator is defined as a collimator which is divided into the same number of pixels as the detector's and the center of each pixel in the collimator is a one-to-one correspondence to that in the detector. The detector is made of Cadmium Zinc Telluride (CZT), which is one of the most promising materials for applications to detect hard X-rays and γ -rays due to its ability to obtain good energy resolution and high light output at room temperature. For our current project, we have designed a large-area, CZT-based gamma camera (20.192 cm×20.192 cm) with a small pixel pitch (1.60 mm). The detector is pixelated and hence the intrinsic resolution can be as small as the size of the pixel. Materials of collimator, collimator hole geometry, detection efficiency, and spatial resolution of the CZT detector combined with the pixel-matching collimator were calculated and analyzed under different conditions. From the simulation studies, we found that such a camera using rectangular holes has promising imaging characteristics in terms of spatial resolution, detection efficiency, and energy resolution.

  19. The ALICE silicon pixel detector system

    International Nuclear Information System (INIS)

    Kapusta, S.

    2009-01-01

    The Large Hadron Collider (LHC) is again reaching its startup phase at the European Organization for Particle Physics (CERN). The LHC started its operation on the 10 th of September, 2008 with huge success managing to sent the the first beam successfully around the entire ring in less than an hour after the first injection in one direction, and later that day in the opposite direction. Unfortunately, on the 19 th of September, an accident occurred during the 5.5 TeV magnet commissioning in Sector 34, which will significantly delay the operation of the LHC. The ALICE experiment will exploit the collisions of accelerated ions produced at the LHC to study strongly interacting matter at extreme densities and high temperatures. e ALICE Silicon Pixel Detector (SPD) represents the two innermost layers of the ALICE Inner Traing System (ITS) located at radii of 3.9 cm and 7.6 cm from the Interaction Point (IP). One of the main tasks of the SPD is to provide precise traing information. is information is fundamental for the study of weak decays of heavy flavor particles, since the corresponding signature is a secondary vertex separated from the primary vertex only by a few hundred micrometers. e tra density could be as high as 80 tracks per cm 2 in the innermost SPD layer as a consequence of a heavy ion collision. The SPD will provide a spatial resolution of around ≅12 μm in the rφ direction and ≅70 μm in the z direction. The expected occupancy of the SPD ranges from 0.4% to 1.5% which makes it an excellent charged particle multiplicity detector in the pseudorapidity region |η| < 2. Furthermore, by combining all possible hits in the SPD, one can get a rough estimate of the position of the primary interaction. One of the challenges is the tight material budget constraint (<1% radiation length per layer) in order to limit the scattering of the traversing particles. e silicon sensor and its readout chip have a total thickness of only 350 μm and the signal lines from the

  20. Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector

    CERN Document Server

    Caselle, M; Antinori, F; Burns, M; Campbell, M; Chochula, P; Dinapoli, R; Elia, D; Formenti, F; Fini, R A; Ghidini, B; Kluge, A; Lenti, V; Manzari, V; Meddi, F; Morel, M; Navach, F; Nilsson, P; Pepato, Adriano; Riedler, P; Santoro, R; Stefanini, G; Viesti, G; Wyllie, K

    2004-01-01

    The Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, respectively. Low-mass solutions are implemented for the bus and the mechanical support. In this contribution, we describe the basic module (half-stave) of the two SPD layers and we give an overview of its assembly procedure.

  1. Frequency-multiplexed bias and readout of a 16-pixel superconducting nanowire single-photon detector array

    Science.gov (United States)

    Doerner, S.; Kuzmin, A.; Wuensch, S.; Charaev, I.; Boes, F.; Zwick, T.; Siegel, M.

    2017-07-01

    We demonstrate a 16-pixel array of microwave-current driven superconducting nanowire single-photon detectors with an integrated and scalable frequency-division multiplexing architecture, which reduces the required number of bias and readout lines to a single microwave feed line. The electrical behavior of the photon-sensitive nanowires, embedded in a resonant circuit, as well as the optical performance and timing jitter of the single detectors is discussed. Besides the single pixel measurements, we also demonstrate the operation of a 16-pixel array with a temporal, spatial, and photon-number resolution.

  2. Three-dimensional cascaded system analysis of a 50 µm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis.

    Science.gov (United States)

    Zhao, C; Vassiljev, N; Konstantinidis, A C; Speller, R D; Kanicki, J

    2017-03-07

    High-resolution, low-noise x-ray detectors based on the complementary metal-oxide-semiconductor (CMOS) active pixel sensor (APS) technology have been developed and proposed for digital breast tomosynthesis (DBT). In this study, we evaluated the three-dimensional (3D) imaging performance of a 50 µm pixel pitch CMOS APS x-ray detector named DynAMITe (Dynamic Range Adjustable for Medical Imaging Technology). The two-dimensional (2D) angle-dependent modulation transfer function (MTF), normalized noise power spectrum (NNPS), and detective quantum efficiency (DQE) were experimentally characterized and modeled using the cascaded system analysis at oblique incident angles up to 30°. The cascaded system model was extended to the 3D spatial frequency space in combination with the filtered back-projection (FBP) reconstruction method to calculate the 3D and in-plane MTF, NNPS and DQE parameters. The results demonstrate that the beam obliquity blurs the 2D MTF and DQE in the high spatial frequency range. However, this effect can be eliminated after FBP image reconstruction. In addition, impacts of the image acquisition geometry and detector parameters were evaluated using the 3D cascaded system analysis for DBT. The result shows that a wider projection angle range (e.g.  ±30°) improves the low spatial frequency (below 5 mm -1 ) performance of the CMOS APS detector. In addition, to maintain a high spatial resolution for DBT, a focal spot size of smaller than 0.3 mm should be used. Theoretical analysis suggests that a pixelated scintillator in combination with the 50 µm pixel pitch CMOS APS detector could further improve the 3D image resolution. Finally, the 3D imaging performance of the CMOS APS and an indirect amorphous silicon (a-Si:H) thin-film transistor (TFT) passive pixel sensor (PPS) detector was simulated and compared.

  3. LePix—A high resistivity, fully depleted monolithic pixel detector

    International Nuclear Information System (INIS)

    Giubilato, P.; Bisello, D.; Chalmet, P.; Denes, P.; Kloukinas, K.; Mattiazzo, S.; Marchioro, A.; Mugnier, H.; Pantano, D.; Potenza, A.; Rivetti, A.; Rousset, J.; Snoeys, W.; Tindall, C.

    2013-01-01

    The LePix project explores monolithic pixel sensors fabricated in a 90 nm CMOS technology built over a lightly doped substrate. This approach keeps the advantages usually offered by Monolithic Active Pixel Sensors (MAPS), like a low input capacitance, having a single piece detector and using a standard CMOS production line, and adds the benefit of charge collection by drift from a depleted region several tens of microns deep into the substrate, therefore providing an excellent signal to noise ratio and a radiation tolerance superior to conventional un-depleted MAPS. Such sensors are expected to offer significant cost savings and reduction of power consumption for the same performance, leading to the use of much less material in the detector (less cooling and less copper), addressing one of the main limitations of present day particle tracking systems. The latest evolution of the project uses detectors thinned down to 50 μm to obtain back illuminated sensors operated in full depletion mode. By back-processing the chip and collecting the charge from the full substrate it is hence possible to efficiently detect soft X-rays up to 10 keV. Test results from first successfully processed detectors will be presented and discussed

  4. NEW LENSLET BASED IFS WITH HIGH DETECTOR PIXEL EFFICIENCY

    Science.gov (United States)

    Gong, Qian

    2018-01-01

    Three IFS types currently used for optical design are: lenslet array, imager slicer, and lenslet array and fiber combined. Lenslet array based Integral Field Spectroscopy (IFS) is very popular for many astrophysics applications due to its compactness, simplicity, as well as cost and mass savings. The disadvantage of lenslet based IFS is its low detector pixel efficiency. Enough spacing is needed between adjacent spectral traces in cross dispersion direction to avoid wavelength cross-talk, because the same wavelength is not aligned to the same column on detector. Such as on a recent exoplanet coronagraph instrument study to support the coming astrophysics decadal survey (LUVOIR), to cover a 45 λ/D Field of View (FOV) with a spectral resolving power of 200 at shortest wavelength, a 4k x 4k detector array is needed. This large format EMCCD pushes the detector into technology development area with a low TRL. Besides the future mission, it will help WFIRST coronagraph IFS by packing all spectra into a smaller area on detector, which will reduce the chance for electrons to be trapped in pixels, and slow the detector degradation during the mission.The innovation we propose here is to increase the detector packing efficiency by grouping a number of lenslets together to form many mini slits. In other words, a number of spots (Point Spread Function at lenslet focus) are aligned into a line to resemble a mini slit. Therefore, wavelength cross-talk is no longer a concern anymore. This combines the advantage of lenslet array and imager slicer together. The isolation rows between spectral traces in cross dispersion direction can be reduced or removed. So the packing efficiency is greatly increased. Furthermore, the today’s microlithography and etching technique is capable of making such a lenslet array, which will relax the detector demand significantly. It will finally contribute to the habitable exoplanets study to analyzing their spectra from direct images. Detailed theory

  5. Development of monolithic pixel detector with SOI technology for the ILC vertex detector

    Science.gov (United States)

    Yamada, M.; Ono, S.; Tsuboyama, T.; Arai, Y.; Haba, J.; Ikegami, Y.; Kurachi, I.; Togawa, M.; Mori, T.; Aoyagi, W.; Endo, S.; Hara, K.; Honda, S.; Sekigawa, D.

    2018-01-01

    We have been developing a monolithic pixel sensor for the International Linear Collider (ILC) vertex detector with the 0.2 μm FD-SOI CMOS process by LAPIS Semiconductor Co., Ltd. We aim to achieve a 3 μm single-point resolution required for the ILC with a 20×20 μm2 pixel. Beam bunch crossing at the ILC occurs every 554 ns in 1-msec-long bunch trains with an interval of 200 ms. Each pixel must record the charge and time stamp of a hit to identify a collision bunch for event reconstruction. Necessary functions include the amplifier, comparator, shift register, analog memory and time stamp implementation in each pixel, and column ADC and Zero-suppression logic on the chip. We tested the first prototype sensor, SOFIST ver.1, with a 120 GeV proton beam at the Fermilab Test Beam Facility in January 2017. SOFIST ver.1 has a charge sensitive amplifier and two analog memories in each pixel, and an 8-bit Wilkinson-type ADC is implemented for each column on the chip. We measured the residual of the hit position to the reconstructed track. The standard deviation of the residual distribution fitted by a Gaussian is better than 3 μm.

  6. International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL2016)

    CERN Document Server

    Rossi, Leonardo; PIXEL2016

    2016-01-01

    The workshop will cover various topics related to pixel detector technology. Development and applications will be discussed for charged particle tracking in High Energy Physics, Nuclear Physics and Astrophysics, and for X-ray imaging in Astronomy, Biology, Medicine and Material Science. The conference program will also include reports on front and back end electronics, radiation effects, low mass mechanics, environmental control and construction techniques. Emerging technologies, such as monolithic and HV&HR CMOS, will also be treated. Will be published in: http://pos.sissa.it/

  7. Characterization of Si pixel detectors of different thickness

    International Nuclear Information System (INIS)

    Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Gregori, P.; Linsalata, S.; Novelli, M.; Piemonte, C.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Zorzi, N.; Zucca, S.

    2004-01-01

    Tests on silicon pixel detector in the mammographic energy range have shown good imaging performances so, in order to improve the efficiency in this energy range, we have designed thicker detectors of the p + /n type. The detectors have been fabricated by ITC-IRST (Trento, Italy) in high resistivity silicon substrates (300 and 525 μm thick). A TCAD simulation work has been carried out to optimize the electric field distribution and to enhance the breakdown voltage. Very low leakage current and high breakdown voltage characteristics have been measured on detectors in preliminary on-wafer tests. After that, detectors have been bump-bonded to a dedicated VLSI electronic chips, realizing an assembly. Choosing the best set-up condition and using a standard mammographic tube, we have acquired a large area image (8x8 cm 2 ) of the RMI 156 phantom, recommended for mammographic quality checks. In order to cover the whole surface, we have acquired different images translating the phantom over the assembly. We present some selected results for these assemblies both for the electrical characteristics and for the imaging performances

  8. Charge amplitude distribution of the Gossip gaseous pixel detector

    NARCIS (Netherlands)

    Blanco Carballo, V.M.; Chefdeville, M.A.; Colas, P.; Giomataris, Y.; van der Graaf, H.; Gromov, V.; Hartjes, F.; Kluit, R.; Koffeman, E.; Salm, Cora; Schmitz, Jurriaan; Smits, Sander M.; Timmermans, J.; Timmermans, J.; Visschers, J.L.

    2007-01-01

    The Gossip gaseous pixel detector is being developed for the detection of charged particles in extreme high radiation environments as foreseen close to the interaction point of the proposed super LHC. The detecting medium is a thin layer of gas. Because of the low density of this medium, only a few

  9. Pixel electronics for the ATLAS experiment

    International Nuclear Information System (INIS)

    Fischer, P.

    2001-01-01

    The ATLAS experiment at LHC will use 3 barrel layers and 2x5 disks of silicon pixel detectors as the innermost elements of the semiconductor tracker. The basic building blocks are pixel modules with an active area of 16.4 mmx60.8 mm which include an n + on n-type silicon sensor and 16 VLSI front-end (FE) chips. Every FE chip contains a low power, high speed charge sensitive preamplifier, a fast discriminator, and a readout system which operates at the 40 MHz rate of LHC. The addresses of hit pixels (as well as a low resolution pulse height information) are stored on the FE chips until arrival of a level 1 trigger signal. Hits are then transferred to a module controller chip (MCC) which collects the data of all 16 FE chips, builds complete events and sends the data through two optical links to the data acquisition system. The MCC receives clock and data through an additional optical link and provides timing and configuration information for the FE chips. Two additional chips are used to amplify and decode the pin diode signal and to drive the VCSEL laser diodes of the optical links

  10. 18k Channels single photon counting readout circuit for hybrid pixel detector

    International Nuclear Information System (INIS)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e − and the equivalent noise charge is 168 e − rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  11. 18k Channels single photon counting readout circuit for hybrid pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Maj, P., E-mail: piotr.maj@agh.edu.pl [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Grybos, P.; Szczygiel, R.; Zoladz, M. [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Sakumura, T.; Tsuji, Y. [X-ray Analysis Division, Rigaku Corporation, Matsubara, Akishima, Tokyo 196-8666 (Japan)

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm Multiplication-Sign 20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96 Multiplication-Sign 192 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 {mu}W/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 {mu}V/e{sup -} and the equivalent noise charge is 168 e{sup -} rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  12. SCT Barrel Assembly Complete

    CERN Multimedia

    L. Batchelor

    As reported in the April 2005 issue of the ATLAS eNews, the first of the four Semiconductor Tracker (SCT) barrels, complete with modules and services, arrived safely at CERN in January of 2005. In the months since January, the other three completed barrels arrived as well, and integration of the four barrels into the entire barrel assembly commenced at CERN, in the SR1 building on the ATLAS experimental site, in July. Assembly was completed on schedule in September, with the addition of the innermost layer to the 4-barrel assembly. Work is now underway to seal the barrel thermal enclosure. This is necessary in order to enclose the silicon tracker in a nitrogen atmosphere and provide it with faraday-cage protection, and is a delicate and complicated task: 352 silicon module powertapes, 352 readout-fibre bundles, and over 400 Detector Control System sensors must be carefully sealed into the thermal enclosure bulkhead. The team is currently verifying the integrity of the low mass cooling system, which must be d...

  13. CMOS Active Pixel Sensors as energy-range detectors for proton Computed Tomography

    International Nuclear Information System (INIS)

    Esposito, M.; Waltham, C.; Allinson, N.M.; Anaxagoras, T.; Evans, P.M.; Poludniowski, G.; Green, S.; Parker, D.J.; Price, T.; Manolopoulos, S.; Nieto-Camero, J.

    2015-01-01

    Since the first proof of concept in the early 70s, a number of technologies has been proposed to perform proton CT (pCT), as a means of mapping tissue stopping power for accurate treatment planning in proton therapy. Previous prototypes of energy-range detectors for pCT have been mainly based on the use of scintillator-based calorimeters, to measure proton residual energy after passing through the patient. However, such an approach is limited by the need for only a single proton passing through the energy-range detector in a read-out cycle. A novel approach to this problem could be the use of pixelated detectors, where the independent read-out of each pixel allows to measure simultaneously the residual energy of a number of protons in the same read-out cycle, facilitating a faster and more efficient pCT scan. This paper investigates the suitability of CMOS Active Pixel Sensors (APSs) to track individual protons as they go through a number of CMOS layers, forming an energy-range telescope. Measurements performed at the iThemba Laboratories will be presented and analysed in terms of correlation, to confirm capability of proton tracking for CMOS APSs

  14. CMOS Active Pixel Sensors as energy-range detectors for proton Computed Tomography.

    Science.gov (United States)

    Esposito, M; Anaxagoras, T; Evans, P M; Green, S; Manolopoulos, S; Nieto-Camero, J; Parker, D J; Poludniowski, G; Price, T; Waltham, C; Allinson, N M

    2015-06-03

    Since the first proof of concept in the early 70s, a number of technologies has been proposed to perform proton CT (pCT), as a means of mapping tissue stopping power for accurate treatment planning in proton therapy. Previous prototypes of energy-range detectors for pCT have been mainly based on the use of scintillator-based calorimeters, to measure proton residual energy after passing through the patient. However, such an approach is limited by the need for only a single proton passing through the energy-range detector in a read-out cycle. A novel approach to this problem could be the use of pixelated detectors, where the independent read-out of each pixel allows to measure simultaneously the residual energy of a number of protons in the same read-out cycle, facilitating a faster and more efficient pCT scan. This paper investigates the suitability of CMOS Active Pixel Sensors (APSs) to track individual protons as they go through a number of CMOS layers, forming an energy-range telescope. Measurements performed at the iThemba Laboratories will be presented and analysed in terms of correlation, to confirm capability of proton tracking for CMOS APSs.

  15. A DAQ system for pixel detectors R and D

    International Nuclear Information System (INIS)

    Battaglia, M.; Bisello, D.; Contarato, D.; Giubilato, P.; Pantano, D.; Tessaro, M.

    2009-01-01

    Pixel detector R and D for HEP and imaging applications require an easily configurable and highly versatile DAQ system able to drive and read out many different chip designs in a transparent way, with different control logics and/or clock signals. An integrated, real-time data collection and analysis environment is essential to achieve fast and reliable detector characterization. We present a DAQ system developed to fulfill these specific needs, able to handle multiple devices at the same time while providing a convenient, ROOT based data display and online analysis environment.

  16. Test-beam activities and results for the ATLAS ITk pixel detector

    Science.gov (United States)

    Bisanz, T.

    2017-12-01

    The Phase-II upgrade of the LHC aims at an increase of the instantaneous luminosity up to about 5×1034 cm-2 s-1. To cope with the resulting challenges the current Inner Detector will be replaced by an all-silicon Inner Tracker (ITk) system. The Pixel Detector will have to deal with occupancies of about 300 hits/FE/s as well as a fluence of around 2×1016 neq cm-2. Various sensor layouts are under development, aiming at providing a high performance, cost effective pixel instrumentation to cover an active area of about 10 m2. These range from thin planar silicon, 3D silicon, to active CMOS sensors. After extensive characterization of the sensors in the lab, their charge collection properties and hit efficiency are measured in common testbeam campaigns, which provide valuable feedback for improvements of the layout. Testbeam measurements of the final prototypes will be used for the decision of which sensor types will be installed in ITk. The setups used in the ITk Pixel testbeam campaigns will be presented, including the common track reconstruction and analysis software. Results from the latest measurements will be shown, highlighting some of the developments and challenges for the ITk Pixel sensors.

  17. 3-D Spatial Resolution of 350 μm Pitch Pixelated CdZnTe Detectors for Imaging Applications.

    Science.gov (United States)

    Yin, Yongzhi; Chen, Ximeng; Wu, Heyu; Komarov, Sergey; Garson, Alfred; Li, Qiang; Guo, Qingzhen; Krawczynski, Henric; Meng, Ling-Jian; Tai, Yuan-Chuan

    2013-02-01

    We are currently investigating the feasibility of using highly pixelated Cadmium Zinc Telluride (CdZnTe) detectors for sub-500 μ m resolution PET imaging applications. A 20 mm × 20 mm × 5 mm CdZnTe substrate was fabricated with 350 μ m pitch pixels (250 μ m anode pixels with 100 μ m gap) and coplanar cathode. Charge sharing among the pixels of a 350 μ m pitch detector was studied using collimated 122 keV and 511 keV gamma ray sources. For a 350 μ m pitch CdZnTe detector, scatter plots of the charge signal of two neighboring pixels clearly show more charge sharing when the collimated beam hits the gap between adjacent pixels. Using collimated Co-57 and Ge-68 sources, we measured the count profiles and estimated the intrinsic spatial resolution of 350 μ m pitch detector biased at -1000 V. Depth of interaction was analyzed based on two methods, i.e., cathode/anode ratio and electron drift time, in both 122 keV and 511 keV measurements. For single-pixel photopeak events, a linear correlation between cathode/anode ratio and electron drift time was shown, which would be useful for estimating the DOI information and preserving image resolution in CdZnTe PET imaging applications.

  18. Test-beam activities and results for the ATLAS ITk pixel detector

    CERN Document Server

    Bisanz, Tobias; The ATLAS collaboration

    2017-01-01

    The Phase-II upgrade of the LHC will result in an increase of the instantaneous luminosity up to about 5×1034 cm−2s−1. To cope with the challenges the current Inner Detector will be replaced by an all-silicon Inner Tracker (ITk) system. The Pixel Detector will have to deal with occupancies of about 300~hits/FE/s as well as a fluence of 2×1016neqcm−2. Various sensor layouts are under development, aiming at providing a high performance, cost effective pixel instrumentation to cover an active area of about 10~m2. These range from thin planar silicon, over 3D silicon, to active CMOS sensors. After extensive characterization of the sensors in the lab, their charge collection properties and hit efficiency are measured in common testbeam campaigns, which provide valuable feedback for improvements of the layout. Testbeam measurements of the final prototypes will be used for the decision of which sensor types will be installed in ITk. The setups used in the ITk Pixel testbeam campaigns will be presented, inclu...

  19. Semiconductor micropattern pixel detectors a review of the beginnings

    CERN Document Server

    Heijne, Erik H M

    2001-01-01

    The innovation in monolithic and hybrid semiconductor 'micropattern' or 'reactive' pixel detectors for tracking in particle physics was actually to fit logic and pulse processing electronics with µW power on a pixel area of less than 0.04 mm2, retaining the characteristics of a traditional nuclear amplifier chain. The ns timing precision in conjunction with local memory and logic operations allowed event selection at > 10 MHz rates with unambiguous track reconstruction even at particle multiplicities > 10 cm-2. The noise in a channel was ~100 e- r.m.s. and enabled binary operation with random noise 'hits' at a level 30 Mrad, respectively.

  20. Studies for the detector control system of the ATLAS pixel at the HL-LHC

    International Nuclear Information System (INIS)

    Püllen, L; Becker, K; Boek, J; Kersten, S; Kind, P; Mättig, P; Zeitnitz, C

    2012-01-01

    In the context of the LHC upgrade to the HL-LHC the inner detector of the ATLAS experiment will be replaced completely. As part of this redesign there will also be a new pixel detector. This new pixel detector requires a control system which meets the strict space requirements for electronics in the ATLAS experiment. To accomplish this goal we propose a DCS (Detector Control System) network with the smallest form factor currently available. This network consists of a DCS chip located in close proximity to the interaction point and a DCS controller located in the outer regions of the ATLAS detector. These two types of chips form a star shaped network with several DCS chips being controlled by one DCS controller. Both chips are manufactured in deep sub-micron technology. We present prototypes with emphasis on studies concerning single event upsets.

  1. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    Energy Technology Data Exchange (ETDEWEB)

    Gallrapp, Christian

    2015-07-01

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ATLAS Pixel Detector as well as for applications in the ATLAS Experiment at HL-LHC conditions. The sensors considered in this work include various designs based on silicon and diamond as sensor material. The investigated designs include a planar silicon pixel design currently used in the ATLAS Experiment as well as a 3D pixel design which uses electrodes penetrating the entire sensor material. The diamond designs implement electrodes similar to the design used by the planar technology with diamond sensors made out of single- and poly-crystalline material. To investigate the sensor properties characterization tests are performed before and after irradiation with protons or neutrons. The measurements are used to determine the interaction between the read-out electronics and the sensors to ensure the signal transfer after irradiation. Further tests focus on the sensor performance itself which includes the analysis of the leakage current behavior and the charge

  2. Studies on irradiated pixel detectors for the ATLAS IBL and HL-LHC upgrade

    International Nuclear Information System (INIS)

    Gallrapp, Christian

    2015-01-01

    The constant demand for higher luminosity in high energy physics is the reason for the continuous effort to adapt the accelerators and the experiments. The upgrade program for the experiments and the accelerators at CERN already includes several expansion stages of the Large Hadron Collider (LHC) which will increase the luminosity and the energy of the accelerator. Simultaneously the LHC experiments prepare the individual sub-detectors for the increasing demands in the coming years. Especially the tracking detectors have to cope with fluence levels unprecedented for high energy physics experiments. Correspondingly to the fluence increases the impact of the radiation damage which reduces the life time of the detectors by decreasing the detector performance and efficiency. To cope with this effect new and more radiation hard detector concepts become necessary to extend the life time. This work concentrates on the impact of radiation damage on the pixel sensor technologies to be used in the next upgrade of the ATLAS Pixel Detector as well as for applications in the ATLAS Experiment at HL-LHC conditions. The sensors considered in this work include various designs based on silicon and diamond as sensor material. The investigated designs include a planar silicon pixel design currently used in the ATLAS Experiment as well as a 3D pixel design which uses electrodes penetrating the entire sensor material. The diamond designs implement electrodes similar to the design used by the planar technology with diamond sensors made out of single- and poly-crystalline material. To investigate the sensor properties characterization tests are performed before and after irradiation with protons or neutrons. The measurements are used to determine the interaction between the read-out electronics and the sensors to ensure the signal transfer after irradiation. Further tests focus on the sensor performance itself which includes the analysis of the leakage current behavior and the charge

  3. Applications of pixellated GaAs X-ray detectors in a synchrotron radiation beam

    CERN Document Server

    Watt, J; Campbell, M; Mathieson, K; Mikulec, B; O'Shea, V; Passmore, M S; Schwarz, C; Smith, K M; Whitehill, C

    2001-01-01

    Hybrid semiconductor pixel detectors are being investigated as imaging devices for radiography and synchrotron radiation beam applications. Based on previous work in the CERN RD19 and the UK IMPACT collaborations, a photon counting GaAs pixel detector (PCD) has been used in an X-ray powder diffraction experiment. The device consists of a 200 mu m thick SI-LEC GaAs detector patterned in a 64*64 array of 170 mu m pitch square pixels, bump-bonded to readout electronics operating in single photon counting mode. Intensity peaks in the powder diffraction pattern of KNbO/sub 3/ have been resolved and compared with results using the standard scintillator, and a PCD predecessor (the Omega 3). The PCD shows improved speed, dynamic range, 2-D information and comparable spatial resolution to the standard scintillator based systems. It also overcomes the severe dead time limitations of the Omega 3 by using a shutter based acquisition mode. A brief demonstration of the possibilities of the system for dental radiography and...

  4. High-speed imaging at high x-ray energy: CdTe sensors coupled to charge-integrating pixel array detectors

    Energy Technology Data Exchange (ETDEWEB)

    Becker, Julian; Tate, Mark W.; Shanks, Katherine S.; Philipp, Hugh T.; Weiss, Joel T.; Purohit, Prafull [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Chamberlain, Darol [Cornell High Energy Synchrotron Source (CHESS), Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M., E-mail: smg26@cornell.edu [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Cornell High Energy Synchrotron Source (CHESS), Cornell University, Ithaca, NY 14853 (United States)

    2016-07-27

    Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray imaging requirements. Here we describe the hybridization of CdTe sensors to two different charge-integrating readout chips, the Keck PAD and the Mixed-Mode PAD (MM-PAD), both developed previously in our laboratory. The charge-integrating architecture of each of these PADs extends the instantaneous counting rate by many orders of magnitude beyond that obtainable with photon counting architectures. The Keck PAD chip consists of rapid, 8-frame, in-pixel storage elements with framing periods <150 ns. The second detector, the MM-PAD, has an extended dynamic range by utilizing an in-pixel overflow counter coupled with charge removal circuitry activated at each overflow. This allows the recording of signals from the single-photon level to tens of millions of x-rays/pixel/frame while framing at 1 kHz. Both detector chips consist of a 128×128 pixel array with (150 µm){sup 2} pixels.

  5. PIXEL 2010 - A Resume

    International Nuclear Information System (INIS)

    Wermes, N.

    2011-01-01

    The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also using the hybrid pixel technology, have greatly advanced the experimental possibilities for diffraction experiments. Monolithic or semi-monolithic devices like CMOS active pixels and DEPFET pixels have now reached a state such that complete vertex detectors for RHIC and superKEKB are being built with these technologies. Finally, new advances towards fully monolithic active pixel detectors, featuring full CMOS electronics merged with efficient signal charge collection, exploiting standard CMOS technologies, SOI and/or 3D integration, show the path for the future. This resume attempts to extract the main statements of the results and developments presented at this conference.

  6. Pixel detector modules using MCM-D technology

    CERN Document Server

    Grah, C

    2001-01-01

    For the upcoming ATLAS-experiment at CERN it is planned to build a large area pixel detector, providing more than 100*10/sup 6/ sensor cells. For the innermost layer, the B-physics layer, it is planned to use MCM-D technology to perform the signal interconnections and power distribution on the modules. Focus of this paper is to give an introduction to this technology and present measurements on single chip MCM-D assemblies and a full scale MCM-D module prototype. (10 refs).

  7. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Gabrielli, Alessandro; The ATLAS collaboration; Balbi, Gabriele; Bindi, Marcello; Chen, Shaw-pin; Falchieri, Davide; Flick, Tobias; Hauck, Scott Alan; Hsu, Shih-Chieh; Kretz, Moritz; Kugel, Andreas; Lama, Luca; Travaglini, Riccardo; Wensing, Marius; ATLAS Pixel Collaboration

    2015-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data pat...

  8. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    CERN Document Server

    Balbi, G; The ATLAS collaboration; Gabrielli, A; Lama, L; Travaglini, R; Backhaus, M; Bindi, M; Chen, S-P; Flick, T; Kretz, M; Kugel, A; Wensing, M

    2014-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBLROD firmware development was three-fold: keeping as much of the PixelROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBLDAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBLROD data path im...

  9. Tests of UFXC32k chip with CdTe pixel detector

    Science.gov (United States)

    Maj, P.; Taguchi, T.; Nakaye, Y.

    2018-02-01

    The paper presents the performance of the UFXC32K—a hybrid pixel detector readout chip working with CdTe detectors. The UFXC32K has a pixel pitch of 75 μm and can cope with both input signal polarities. This functionality allows operating with widely used silicon sensors collecting holes and CdTe sensors collecting electrons. This article describes the chip focusing on solving the issues connected to high-Z sensor material, namely high leakage currents, slow charge collection time and thick material resulting in increased charge-sharring effects. The measurements were conducted with higher X-ray energies including 17.4 keV from molybdenum. Conclusions drawn inside the paper show the UFXC32K's usability for CdTe sensors in high X-ray energy applications.

  10. The electro-mechanical integration of the NA62 GigaTracker time tagging pixel detector

    CERN Document Server

    Morel, M; Aglieri Rinella, G; Carassiti, V; Ceccucci, A; Daguin, J; Fiorini, M; Jarron, P; Kaplon, J; Mapelli, A; Marchetto, F; Noy, M; Nuessle, G; Perktold, L; Petagna, P; Riedler, P

    2010-01-01

    The NA62 GigaTracker is a low mass time tagging hybrid pixel detector operating in a beam with a particle rate of 750 MHz. It consists of three stations with a sensor size of 60 × 27mm2 containing 18000 pixels, each 300 × 300μm2. The active area is connected to a matrix of 2 × 5 pixel ASICs, which time tag the arrival of the particles with a binning of 100 ps. The detector operates in vacuum at -20 to 0°C and the material budget per station must be below 0.5% X0. Due to the high radiation environment of 2 × 1014 1 MeV neutron equivalent cm−2/yr−1 it is planned to exchange the detector modules regularly. The low material budget, cooling requirements and the request for easy module access has driven the electro-mechanical integration of the GigaTracker, which is presented in this paper

  11. Operational Experience and Performance with the ATLAS Pixel detector

    CERN Document Server

    Yang, Hongtao; The ATLAS collaboration

    2018-01-01

    In this presentation, I will discuss the operation of ATLAS Pixel Detector during Run 2 proton-proton data-taking at √s=13 TeV in 2017. The topics to be covered include 1) the bandwidth issue and how it is mitigated through readout upgrade and threshold adjustment; 2) the auto-corrective actions; 3) monitoring of radiation effects.

  12. On the basic mechanism of Pixelized Photon Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Otono, H. [Department of Physics, School of Science, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan)], E-mail: otono@icepp.s.u-tokyo.ac.jp; Oide, H. [Department of Physics, School of Science, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan); Yamashita, S. [International Center for Elementary Particle Physics, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan); Yoshioka, T. [Neutron Science Laboratory, High Energy Accelerator Research Organization (KEK), 1-1 Oho, Tsukuba, Ibaraki 305-0801 (Japan)

    2009-10-21

    A Pixelized Photon Detector (PPD) is a generic name for the semiconductor devices operated in the Geiger-mode, such as Silicon PhotoMultiplier and Multi-Pixel Photon Counter, which has high photon counting capability. While the internal mechanisms of the PPD have been intensively studied in recent years, the existing models do not include the avalanche process. We have simulated the multiplication and quenching of the avalanche process and have succeeded in reproducing the output waveform of the PPD. Furthermore our model predicts the existence of dead-time in the PPD which has never been numerically predicted. For searching the dead-time, we also have developed waveform analysis method using deconvolution which has the potential to distinguish neighboring pulses precisely. In this paper, we discuss our improved model and waveform analysis method.

  13. The data acquisition system of the Belle II Pixel Detector

    Science.gov (United States)

    Münchow, D.; Dingfelder, J.; Geßler, T.; Konorov, I.; Kühn, W.; Lange, S.; Lautenbach, K.; Levit, D.; Liu, Z.; Marinas, C.; Schnell, M.; Spruck, B.; Zhao, J.

    2014-08-01

    At the future Belle II experiment the DEPFET (DEPleted Field Effect Transistor) pixel detector will consist of about 8 million channels and is placed as the innermost detector. Because of its small distance to the interaction region and the high luminosity in Belle II, for a trigger rate of about 30 kHz with an estimated occupancy of about 3 % a data rate of about 22 GB/s is expected. Due to the high data rate, a data reduction factor higher than 30 is needed in order to stay inside the specifications of the event builder. The main hardware to reduce the data rate is a xTCA based Compute Node (CN) developed in cooperation between IHEP Beijing and University Giessen. Each node has as main component a Xilinx Virtex-5 FX70T FPGA and is equipped with 2 × 2 GB RAM , GBit Ethernet and 4 × 6.25 Gb/s optical links. An ATCA carrier board is able to hold up to four CN and supplies high bandwidth connections between the four CNs and to the ATCA backplane. To achieve the required data reduction on the CNs, regions of interest (ROI) are used. These regions are calculated in two independent systems by projecting tracks back to the pixel detector. One is the High Level Trigger (HLT) which uses data from the Silicon Vertex Detector (SVD), a silicon strip detector, and outer detectors. The other is the Data Concentrator (DATCON) which calculates ROIs based on SVD data only, in order to get low momentum tracks. With this information, only PXD data inside these ROIs will be forwarded to the event builder, while data outside of these regions will be discarded. First results of the test beam time in January 2014 at DESY with a Belle II vertex detector prototype and full DAQ chain will be presented.

  14. Characterization of Si pixel detectors of different thickness

    Energy Technology Data Exchange (ETDEWEB)

    Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Gregori, P.; Linsalata, S.; Novelli, M. E-mail: marzia.novelli@pi.infn.it; Piemonte, C.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Zorzi, N.; Zucca, S

    2004-02-01

    Tests on silicon pixel detector in the mammographic energy range have shown good imaging performances so, in order to improve the efficiency in this energy range, we have designed thicker detectors of the p{sup +}/n type. The detectors have been fabricated by ITC-IRST (Trento, Italy) in high resistivity silicon substrates (300 and 525 {mu}m thick). A TCAD simulation work has been carried out to optimize the electric field distribution and to enhance the breakdown voltage. Very low leakage current and high breakdown voltage characteristics have been measured on detectors in preliminary on-wafer tests. After that, detectors have been bump-bonded to a dedicated VLSI electronic chips, realizing an assembly. Choosing the best set-up condition and using a standard mammographic tube, we have acquired a large area image (8x8 cm{sup 2}) of the RMI 156 phantom, recommended for mammographic quality checks. In order to cover the whole surface, we have acquired different images translating the phantom over the assembly. We present some selected results for these assemblies both for the electrical characteristics and for the imaging performances.

  15. TCAD simulations of High-Voltage-CMOS Pixel structures for the CLIC vertex detector

    CERN Document Server

    Buckland, Matthew Daniel

    2016-01-01

    The requirements for precision physics and the experimental conditions at CLIC result in stringent constraints for the vertex detector. Capacitively coupled active pixel sensors with 25 μm pitch implemented in a commercial 180 nm High-Voltage CMOS (HV-CMOS) process are currently under study as a candidate technology for the CLIC vertex detector. Laboratory calibration measurements and beam tests with prototypes are complemented by detailed TCAD and electronic circuit simulations, aiming for a comprehensive understanding of the signal formation in the HV-CMOS sensors and subsequent readout stages. In this note 2D and 3D TCAD simulation results of the prototype sensor, the Capacitively Coupled Pixel Detector version three (CCPDv3), will be presented. These include the electric field distribution, leakage current, well capacitance, transient response to minimum ionising particles and charge-collection.

  16. Operational Experience of the ATLAS SemiConductor Tracker and Pixel Detector

    CERN Document Server

    Robinson, Dave; The ATLAS collaboration

    2016-01-01

    The tracking performance of the ATLAS detector relies critically on the silicon and gaseous tracking subsystems that form the ATLAS Inner Detector. Those subsystems have undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the LHC during Run2. The key status and performance metrics of the Pixel Detector and the Semi Conductor Tracker are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described.

  17. Robustness of the Artificial Neural Networks Used for Clustering in the ATLAS Pixel Detector

    CERN Document Server

    The ATLAS collaboration

    2015-01-01

    A study of the robustness of the ATLAS pixel neural network clustering algorithm is presented. The sensitivity to variations to its input is evaluated. These variations are motivated by potential discrepancies between data and simulation due to uncertainties in the modelling of pixel clusters in simulation, as well as uncertainties from the detector calibration. Within reasonable variation magnitudes, the neural networks prove to be robust to most variations. The neural network used to identify pixel clusters created by multiple charged particles, is most sensitive to variations affecting the total amount of charge collected in the cluster. Modifying the read-out threshold has the biggest effect on the clustering's ability to estimate the position of the particle's intersection with the detector.

  18. Study of the Material within the Run-2 ATLAS Inner Detector

    CERN Document Server

    Cairo, Valentina; The ATLAS collaboration

    2017-01-01

    The material in the ATLAS Inner Detector (ID) is studied with several methods, using a sample of \\sqrt{s}=13 TeV pp collisions collected in 2015 during Run II of the LHC. The material within the innermost barrel regions of the ID is studied using reconstructed secondary vertices from hadronic interactions and photon conversions. The layout of the cables, cooling p ipes and support structures (services) associated with the Pixel detector, in the region in front of the Silicon Microstrip detector (SCT), was modified in 2014. The material in this region was studied by measuring the efficiency with which tracks reconstructed only in the Pixel detector can be matched to tracks reconstructed in the full ID (track extension efficiency). The results of these studies are presented together with a comparison to previous measurements and a description of their impact on physics analyses and Monte Carlo simulation.

  19. CMOS Pixel Sensors for High Precision Beam Telescopes and Vertex Detectors

    International Nuclear Information System (INIS)

    Masi, R. de; Baudot, J.; Fontaine, J.-Ch.

    2009-01-01

    CMOS sensors of the MIMOSA (standing for Minimum Ionising particle MOS Active pixel sensor) series are developed at IPHC since a decade and have ended up with full scale devices used in beam telescopes and in demonstrators of future vertex detectors. The sensors deliver analogue, unfiltered, signals and are therefore limited to read-out frequencies of ∼ 1 kframe/s. Since a few years, a fast architecture is being developed in collaboration with IRFU, which aims to speed up the read-out by 1-2 orders of magnitude. The first full scale sensor based on this architecture was fabricated recently and is being tested. Made of 660,000 pixels (18 μm pitch) covering an active area of ∼ 2 cm 2 , it delivers zero-suppressed binary signals, which allow running at ∼ 10 kframes/s. It will equip the beam telescope of the E.U. project EUDET and serve as a forerunner of the sensor equipping the 2 layers of the PIXEL detector of the STAR experiment at RHIC. The contribution to the conference will overview the main features and test results of this pioneering sensor. It will next describe its evolution towards read-out frequencies approaching 100 kframes/s, as required for the vertex detectors of the CBM experiment at FAIR and at the ILC. Finally, the issue of radiation tolerance will be addressed, in the context of a newly available CMOS process using a depleted substrate. A prototype sensor was fabricated in a such CMOS process. The talk will summarise beam test results showing, for the first time, that fluences of 10 14 n eq /cm 2 may be tolerable for CMOS sensors. Overall, the talk provides an overview of the status and plans of CMOS pixel sensors at the frontier of their achievements and outreach. (author)

  20. TRT Barrel milestones passed

    CERN Multimedia

    Ogren, H

    2004-01-01

    The barrel TRT detector passed three significant milestones this spring. The Barrel Support Structure (BSS) was completed and moved to the SR-1 building on February 24th. On March 12th the first module passed the quality assurance testing in Building 154 and was transported to the assembly site in the SR-1 building for barrel assembly. Then on April 21st the final production module that had been scanned at Hampton University was shipped to CERN. TRT Barrel Module Production The production of the full complement of barrel modules (96 plus 9 total spares) is now complete. This has been a five-year effort by Duke University, Hampton University, and Indiana University. Actual construction of the modules in the United States was completed in the first part of 2004. The production crews at each of the sites in the United States have now completed their missions. They are shown in the following pictures. Duke University: Production crew with the final completed module. Indiana University: Module producti...

  1. Verification of Dosimetry Measurements with Timepix Pixel Detectors for Space Applications

    Science.gov (United States)

    Kroupa, M.; Pinsky, L. S.; Idarraga-Munoz, J.; Hoang, S. M.; Semones, E.; Bahadori, A.; Stoffle, N.; Rios, R.; Vykydal, Z.; Jakubek, J.; hide

    2014-01-01

    The current capabilities of modern pixel-detector technology has provided the possibility to design a new generation of radiation monitors. Timepix detectors are semiconductor pixel detectors based on a hybrid configuration. As such, the read-out chip can be used with different types and thicknesses of sensors. For space radiation dosimetry applications, Timepix devices with 300 and 500 microns thick silicon sensors have been used by a collaboration between NASA and University of Houston to explore their performance. For that purpose, an extensive evaluation of the response of Timepix for such applications has been performed. Timepix-based devices were tested in many different environments both at ground-based accelerator facilities such as HIMAC (Heavy Ion Medical Accelerator in Chiba, Japan), and at NSRL (NASA Space Radiation Laboratory at Brookhaven National Laboratory in Upton, NY), as well as in space on board of the International Space Station (ISS). These tests have included a wide range of the particle types and energies, from protons through iron nuclei. The results have been compared both with other devices and theoretical values. This effort has demonstrated that Timepix-based detectors are exceptionally capable at providing accurate dosimetry measurements in this application as verified by the confirming correspondence with the other accepted techniques.

  2. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    Püllen, Lukas; Boek, Jennifer; Kersten, Susanne; Kind, Peter; Mättig, Peter; Zeitnitz, Christian

    2013-01-01

    In the years around 2020 an upgrade of the LHC to the HL-LHC is scheduled, which will increase the accelerator's instantaneous luminosity by a factor of 5 and the integrated luminosity by a factor of 10. In the context of this upgrade, the inner detector (including the pixel detector) of the ATLAS experiment will be replaced. This new pixel detector requires a specific control system which complies with strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University of Wuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4×4 DCS chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub-micron technology. We present results from reliability measurements under irradiation from new prototypes of components for the DCS network.

  3. Prototypes for components of a control system for the ATLAS pixel detector at the HL-LHC

    International Nuclear Information System (INIS)

    Boek, J; Kersten, S; Kind, P; Mättig, P; Püllen, L; Zeitnitz, C

    2013-01-01

    In the years around 2020 an upgrade of the LHC to the HL-LHC is scheduled, which will increase the accelerators luminosity by a factor of 10. In the context of this upgrade, the inner detector of the ATLAS experiment will be replaced entirely including the pixel detector. This new pixel detector requires a specific control system which complies with the strict requirements in terms of radiation hardness, material budget and space for the electronics in the ATLAS experiment. The University of Wuppertal is developing a concept for a DCS (Detector Control System) network consisting of two kinds of ASICs. The first ASIC is the DCS Chip which is located on the pixel detector, very close to the interaction point. The second ASIC is the DCS Controller which is controlling 4x4 DCS Chips from the outer regions of ATLAS via differential data lines. Both ASICs are manufactured in 130 nm deep sub micron technology. We present results from measurements from new prototypes of components for the DCS network.

  4. Reduction of ring artifacts in CBCT: Detection and correction of pixel gain variations in flat panel detectors

    International Nuclear Information System (INIS)

    Altunbas, Cem; Lai, Chao-Jen; Zhong, Yuncheng; Shaw, Chris C.

    2014-01-01

    Purpose: In using flat panel detectors (FPD) for cone beam computed tomography (CBCT), pixel gain variations may lead to structured nonuniformities in projections and ring artifacts in CBCT images. Such gain variations can be caused by change in detector entrance exposure levels or beam hardening, and they are not accounted by conventional flat field correction methods. In this work, the authors presented a method to identify isolated pixel clusters that exhibit gain variations and proposed a pixel gain correction (PGC) method to suppress both beam hardening and exposure level dependent gain variations. Methods: To modulate both beam spectrum and entrance exposure, flood field FPD projections were acquired using beam filters with varying thicknesses. “Ideal” pixel values were estimated by performing polynomial fits in both raw and flat field corrected projections. Residuals were calculated by taking the difference between measured and ideal pixel values to identify clustered image and FPD artifacts in flat field corrected and raw images, respectively. To correct clustered image artifacts, the ratio of ideal to measured pixel values in filtered images were utilized as pixel-specific gain correction factors, referred as PGC method, and they were tabulated as a function of pixel value in a look-up table. Results: 0.035% of detector pixels lead to clustered image artifacts in flat field corrected projections, where 80% of these pixels were traced back and linked to artifacts in the FPD. The performance of PGC method was tested in variety of imaging conditions and phantoms. The PGC method reduced clustered image artifacts and fixed pattern noise in projections, and ring artifacts in CBCT images. Conclusions: Clustered projection image artifacts that lead to ring artifacts in CBCT can be better identified with our artifact detection approach. When compared to the conventional flat field correction method, the proposed PGC method enables characterization of nonlinear

  5. DEPFET: A silicon pixel detector for future colliders. Fundamentals, characterization and performance

    CERN Document Server

    Marinas Pardo, Carlos Manuel; Vos, Marcel Andre

    2011-01-01

    The future electron-positron colliders, either breaking the energy frontier (like ILC or CLIC) or the luminosity frontier (SuperKEKB), impose unprecedented constraints over the new generation of detectors that will be operated in those facilities. In particular, the vertex detectors must be designed for an efficient flavour tagging and excellent vertex reconstruction. To cope with these requirements, highly pixelated sensors with a fast readout, very low material budget and low power consumption must be developed. Although the combination of these factors is a substantial challenge, the DEPFET Collaboration has developed a new generation of sensors that can be operated in such a harsh environment. The DEpleted P-channel Field Effect Transistor (DEPFET) is a pixel sensor that combines detection and internal amplification at the same time. With such configuration, thin detectors with good signal-to-noise ratio and low power consumption can be produced. In this thesis, the optimization and performance of two gen...

  6. Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

    CERN Document Server

    Giugliarelli, Gilberto; The ATLAS collaboration

    2018-01-01

    Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS experiment. They constitute the part of ATLAS closest to the interaction point and for this reason they will be exposed – over their lifetime – to a significant amount of radiation: prior to the HL-LHC, the innermost layers will receive a fluence of 10^15 neq/cm2 and their HL–LHC upgrades will have to cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

  7. Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

    CERN Document Server

    Karadzhinova, Aneliya; Härkönen, Jaakko; Luukka, Panja-riina; Mäenpää, Teppo; Tuominen, Eija; Haeggstrom, Edward; Kalliopuska, Juha; Vahanen, Sami; Kassamakov, Ivan

    2014-01-01

    In contemporary high energy physics experiments, silicon detectors are essential for recording the trajectory of new particles generated by multiple simultaneous collisions. Modern particle tracking systems may feature 100 million channels, or pixels, which need to be individually connected to read-out chains. Silicon pixel detectors are typically connected to readout chips by flip-chip bonding using solder bumps. High-quality electro-mechanical flip-chip interconnects minimizes the number of dead read-out channels in the particle tracking system. Furthermore, the detector modules must endure handling during installation and withstand heat generation and cooling during operation. Silicon pixel detector modules were constructed by flip-chip bonding 16 readout chips to a single sensor. Eutectic SnPb solder bumps were deposited on the readout chips and the sensor chips were coated with TiW/Pt thin film UBM (under bump metallization). The modules were assembled at Advacam Ltd, Finland. We studied the uniformity o...

  8. Performance comparison of small-pixel CdZnTe radiation detectors with gold contacts formed by sputter and electroless deposition

    Science.gov (United States)

    Bell, S. J.; Baker, M. A.; Duarte, D. D.; Schneider, A.; Seller, P.; Sellin, P. J.; Veale, M. C.; Wilson, M. D.

    2017-06-01

    Recent improvements in the growth of wide-bandgap semiconductors, such as cadmium zinc telluride (CdZnTe or CZT), has enabled spectroscopic X/γ-ray imaging detectors to be developed. These detectors have applications covering homeland security, industrial analysis, space science and medical imaging. At the Rutherford Appleton Laboratory (RAL) a promising range of spectroscopic, position sensitive, small-pixel Cd(Zn)Te detectors have been developed. The challenge now is to improve the quality of metal contacts on CdZnTe in order to meet the demanding energy and spatial resolution requirements of these applications. The choice of metal deposition method and fabrication process are of fundamental importance. Presented is a comparison of two CdZnTe detectors with contacts formed by sputter and electroless deposition. The detectors were fabricated with a 74 × 74 array of 200 μm pixels on a 250 μm pitch and bump-bonded to the HEXITEC ASIC. The X/γ-ray emissions from an 241Am source were measured to form energy spectra for comparison. It was found that the detector with contacts formed by electroless deposition produced the best uniformity and energy resolution; the best pixel produced a FWHM of 560 eV at 59.54 keV and 50% of pixels produced a FWHM better than 1.7 keV . This compared with a FWHM of 1.5 keV for the best pixel and 50% of pixels better than 4.4 keV for the detector with sputtered contacts.

  9. Spatial resolution of Medipix-2 device as neutron pixel detector

    Czech Academy of Sciences Publication Activity Database

    Jakůbek, J.; Holý, T.; Lehmann, E.; Pospíšil, S.; Uher, J.; Vacík, Jiří; Vavřík, D.

    2005-01-01

    Roč. 546, - (2005), s. 164-169 ISSN 0168-9002 R&D Projects: GA MŠk(CZ) 1P04LA211 Institutional research plan: CEZ:AV0Z10480505 Keywords : neutron detection * pixel detectors * neutronography Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.224, year: 2005

  10. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    International Nuclear Information System (INIS)

    Gabrielli, A.; Balbi, G.; Falchieri, D.; Lama, L.; Travaglini, R.; Backhaus, M.; Bindi, M.; Chen, S.P.; Hauck, S.; Hsu, S.C.; Flick, T.; Wensing, M.; Kretz, M.; Kugel, A.

    2015-01-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014

  11. Time-resolved and position-resolved X-ray spectrometry with a pixelated detector

    Energy Technology Data Exchange (ETDEWEB)

    Sievers, Peter

    2012-12-07

    The aim of the work presented here was to measure X-ray spectra with a pixelated detector. Due to effects in the sensor the spectrum cannot be measured directly and has to be calculated by a deconvolution of the measured data. In the scope of this work the deconvolution of the measured spectra could be enhanced considerably by - amongst other things - the introduction of the Bayesian deconvolution method. Those improvements opened the possibilities for further measurements. For the measurements the detectors of the Medipix family have been used. They are nowadays used for a wide range of applications and scientific research. Their main advantage is the very high position resolution gained by a pixel pitch of 55 μm and a high number of 65536 pixels. The Timepix detector has, in particular, two special possibilities of measurement: the ToA mode and the ToT mode. In ToA mode the arrival time of an impinging photon is measured and in ToT mode the amount of deposited charge is measured. The most common method of operation is counting the number of impinging photons that release a charge higher than a preset threshold in each pixel. As this released charge is proportional to the energy deposition of the impinging photon, one can perform energy-sensitive measurements. To perform the deconvolution of the measured energy distribution there is a need of an energy response matrix describing the detector response on radiation. For some detectors it is possible to obtain an analytic model of the response functions. Due to the high discrepancy between the impinging spectrum and the measured spectrum in case of detectors of the Medipix family, there is so far no analytic model. Thus, the detector response has to be simulated. As I could improve the precision of the measurement quite extensively, I also intended to tune the simulation with more accurate and appropriate models to gain the same level of accuracy. The results of measurement and simulation have then been compared and

  12. Time-resolved and position-resolved X-ray spectrometry with a pixelated detector

    International Nuclear Information System (INIS)

    Sievers, Peter

    2012-01-01

    The aim of the work presented here was to measure X-ray spectra with a pixelated detector. Due to effects in the sensor the spectrum cannot be measured directly and has to be calculated by a deconvolution of the measured data. In the scope of this work the deconvolution of the measured spectra could be enhanced considerably by - amongst other things - the introduction of the Bayesian deconvolution method. Those improvements opened the possibilities for further measurements. For the measurements the detectors of the Medipix family have been used. They are nowadays used for a wide range of applications and scientific research. Their main advantage is the very high position resolution gained by a pixel pitch of 55 μm and a high number of 65536 pixels. The Timepix detector has, in particular, two special possibilities of measurement: the ToA mode and the ToT mode. In ToA mode the arrival time of an impinging photon is measured and in ToT mode the amount of deposited charge is measured. The most common method of operation is counting the number of impinging photons that release a charge higher than a preset threshold in each pixel. As this released charge is proportional to the energy deposition of the impinging photon, one can perform energy-sensitive measurements. To perform the deconvolution of the measured energy distribution there is a need of an energy response matrix describing the detector response on radiation. For some detectors it is possible to obtain an analytic model of the response functions. Due to the high discrepancy between the impinging spectrum and the measured spectrum in case of detectors of the Medipix family, there is so far no analytic model. Thus, the detector response has to be simulated. As I could improve the precision of the measurement quite extensively, I also intended to tune the simulation with more accurate and appropriate models to gain the same level of accuracy. The results of measurement and simulation have then been compared and

  13. Prototyping of larger structures for the Phase-II upgrade of the pixel detector of the ATLAS experiment

    CERN Document Server

    Alvarez Feito, Diego; The ATLAS collaboration

    2017-01-01

    For the high luminosity era of the Large Hadron Collider (HL-LHC) it is forseen to replace the current inner tracker of the ATLAS experiment with a new detector to cope with the occuring increase in occupancy, bandwidth and radiation damage. It will consist of an inner pixel and outer strip detector aiming to provide tracking coverage up to |η|<4. The layout of the pixel detector is foreseen to consist of five layers of pixel silicon sensor modules in the central region and several ring-shaped layers in the forward region. It results in up to 14 m² of silicon depending on the selected layout. Beside the challenge of radiation hardness and high-rate capable silicon sensors and readout electronics many system aspects have to be considered for a fully functional detector. Both stable and low mass mechanical structures and services are important. Within the collaboration a large effort is started to prototype larger detector structures for both the central and forward region of the detector. The aspect of sy...

  14. A 65 nm CMOS analog processor with zero dead time for future pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Gaioni, L., E-mail: luigi.gaioni@unibg.it [Università di Bergamo, I-24044 Dalmine (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Braga, D.; Christian, D.C.; Deptuch, G.; Fahim, F. [Fermi National Accelerator Laboratory, Batavia IL (United States); Nodari, B. [Università di Bergamo, I-24044 Dalmine (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Centre National de Recherche Scientifique, APC/IN2P3, Paris (France); Ratti, L. [Università di Pavia, I-27100 Pavia (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Re, V. [Università di Bergamo, I-24044 Dalmine (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Zimmerman, T. [Fermi National Accelerator Laboratory, Batavia IL (United States)

    2017-02-11

    Next generation pixel chips at the High-Luminosity (HL) LHC will be exposed to extremely high levels of radiation and particle rates. In the so-called Phase II upgrade, ATLAS and CMS will need a completely new tracker detector, complying with the very demanding operating conditions and the delivered luminosity (up to 5×10{sup 34} cm{sup −2} s{sup −1} in the next decade). This work is concerned with the design of a synchronous analog processor with zero dead time developed in a 65 nm CMOS technology, conceived for pixel detectors at the HL-LHC experiment upgrades. It includes a low noise, fast charge sensitive amplifier featuring a detector leakage compensation circuit, and a compact, single ended comparator that guarantees very good performance in terms of channel-to-channel dispersion of threshold without needing any pixel-level trimming. A flash ADC is exploited for digital conversion immediately after the charge amplifier. A thorough discussion on the design of the charge amplifier and the comparator is provided along with an exhaustive set of simulation results.

  15. Fluorocarbon evaporative cooling developments for the ATLAS pixel and semiconductor tracking detectors

    CERN Document Server

    Anderssen, E; Berry, S; Bonneau, P; Bosteels, Michel; Bouvier, P; Cragg, D; English, R; Godlewski, J; Górski, B; Grohmann, S; Hallewell, G D; Hayler, T; Ilie, S; Jones, T; Kadlec, J; Lindsay, S; Miller, W; Niinikoski, T O; Olcese, M; Olszowska, J; Payne, B; Pilling, A; Perrin, E; Sandaker, H; Seytre, J F; Thadome, J; Vacek, V

    1999-01-01

    Heat transfer coefficients 2-5.103 Wm-2K-1 have been measured in a 3.6 mm I.D. heated tube dissipating 100 Watts - close to the full equivalent power (~110 W) of a barrel SCT detector "stave" - over a range of power dissipations and mass flows in the above fluids. Aspects of full-scale evaporative cooling circulator design for the ATLAS experiment are discussed, together with plans for future development.

  16. The color of X-rays: Spectral X-ray computed tomography using energy sensitive pixel detectors

    NARCIS (Netherlands)

    Schioppa, E.J.

    2014-01-01

    Energy sensitive X-ray imaging detectors are produced by connecting a semiconductor sensor to a spectroscopic pixel readout chip. In this thesis, the applicability of such detectors to X-ray Computed Tomography (CT) is studied. A prototype Medipix based silicon detector is calibrated using X-ray

  17. MCC:the Module Controller Chip for the ATLAS Pixel Detector

    Czech Academy of Sciences Publication Activity Database

    Beccherle, R.; Darbo, G.; Gagliardi, G.; Šícho, Petr

    2002-01-01

    Roč. 492, 1-2 (2002), s. 117-133 ISSN 0168-9002 R&D Projects: GA MPO RP-4210/69 Institutional research plan: CEZ:AV0Z1010920 Keywords : ASIC * radiation hardness * silicon pixel detectors * ATLAS * LHC Subject RIV: BF - Elementary Particles and High Energy Physics Impact factor: 1.167, year: 2002

  18. Characterisation of edgeless technologies for pixellated and strip silicon detectors with a micro-focused X-ray beam

    Science.gov (United States)

    Bates, R.; Blue, A.; Christophersen, M.; Eklund, L.; Ely, S.; Fadeyev, V.; Gimenez, E.; Kachkanov, V.; Kalliopuska, J.; Macchiolo, A.; Maneuski, D.; Phlips, B. F.; Sadrozinski, H. F.-W.; Stewart, G.; Tartoni, N.; Zain, R. M.

    2013-01-01

    Reduced edge or ``edgeless'' detector design offers seamless tileability of sensors for a wide range of applications from particle physics to synchrotron and free election laser (FEL) facilities and medical imaging. Combined with through-silicon-via (TSV) technology, this would allow reduced material trackers for particle physics and an increase in the active area for synchrotron and FEL pixel detector systems. In order to quantify the performance of different edgeless fabrication methods, 2 edgeless detectors were characterized at the Diamond Light Source using an 11 μm FWHM 15 keV micro-focused X-ray beam. The devices under test were: a 150 μm thick silicon active edge pixel sensor fabricated at VTT and bump-bonded to a Medipix2 ROIC; and a 300 μm thick silicon strip sensor fabricated at CIS with edge reduction performed by SCIPP and the NRL and wire bonded to an ALiBaVa readout system. Sub-pixel resolution of the 55 μm active edge pixels was achieved. Further scans showed no drop in charge collection recorded between the centre and edge pixels, with a maximum deviation of 5% in charge collection between scanned edge pixels. Scans across the cleaved and standard guard ring edges of the strip detector also show no reduction in charge collection. These results indicate techniques such as the scribe, cleave and passivate (SCP) and active edge processes offer real potential for reduced edge, tiled sensors for imaging detection applications.

  19. First experiences with the ATLAS pixel detector control system at the combined test beam 2004

    International Nuclear Information System (INIS)

    Imhaeuser, Martin; Becks, Karl-Heinz; Henss, Tobias; Kersten, Susanne; Maettig, Peter; Schultes, Joachim

    2006-01-01

    Detector control systems (DCS) include the readout, control and supervision of hardware devices as well as the monitoring of external systems like cooling system and the processing of control data. The implementation of such a system in the final experiment also has to provide the communication with the trigger and data acquisition system (TDAQ). In addition, conditions data which describe the status of the pixel detector modules and their environment must be logged and stored in a common LHC wide database system. At the combined test beam all ATLAS subdetectors were operated together for the first time over a longer period. To ensure the functionality of the pixel detector, a control system was set up. We describe the architecture chosen for the pixel DCS, the interfaces to hardware devices, the interfaces to the users and the performance of our system. The embedding of the DCS in the common infrastructure of the combined test beam and also its communication with surrounding systems will be discussed in some detail

  20. Optimization of ADC transfer curves for the Belle II pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Haidl, Jakob; Mueller, Felix; Moser, Hans-Guenther; Kiesling, Christian; Valentan, Manfred [Max-Planck-Institut fuer Physik, Muenchen (Germany); Koffmane, Christian [Halbleiterlabor der Max-Planck-Gesellschaft, Muenchen (Germany); Collaboration: Belle II-Collaboration

    2016-07-01

    The Super-KEKB accelerator at the KEK high energy research center in Tsukuba in Japan will provide a 40 times higher luminosity. To cope with this high luminosity the Belle detector is improved to Belle II, which includes the integration of a two layer DEPFET pixel detector (PXD) resulting in a higher vertex resolution. The task of the read-out electronics is to process the high data rate of the PXD. To fulfill these requirements three different types of ASICs were designed. The foremost of them called Drain Current Digitizer (DCD) converts the drain currents of the DEPFET pixel sensors into digital code. Since the PXD will be equipped with 160 DCDs automatic testing of the chips is needed. Analog to digital transfer curves are an appropriate tool for error recognition and optimization of the digitization process within the DCD. An overview of measurements and optimization strategies is presented.

  1. Diamond Pixel Detectors and 3D Diamond Devices

    International Nuclear Information System (INIS)

    Venturi, N.

    2016-01-01

    Results from detectors of poly-crystalline chemical vapour deposited (pCVD) diamond are presented. These include the first analysis of data of the ATLAS Diamond Beam Monitor (DBM). The DBM module consists of pCVD diamond sensors instrumented with pixellated FE-I4 front-end electronics. Six diamond telescopes, each with three modules, are placed symmetrically around the ATLAS interaction point. The DBM tracking capabilities allow it to discriminate between particles coming from the interaction point and background particles passing through the ATLAS detector. Also, analysis of test beam data of pCVD DBM modules are presented. A new low threshold tuning algorithm based on noise occupancy was developed which increases the DBM module signal to noise ratio significantly. Finally first results from prototypes of a novel detector using pCVD diamond and resistive electrodes in the bulk, forming a 3D diamond device, are discussed. 3D devices based on pCVD diamond were successfully tested with test beams at CERN. The measured charge is compared to that of a strip detector mounted on the same pCVD diamond showing that the 3D device collects significantly more charge than the planar device.

  2. Results from a 64-pixel PIN-diode detector system for low-energy beta-electrons

    Energy Technology Data Exchange (ETDEWEB)

    Wuestling, Sascha, E-mail: sascha.wuestling@kit.ed [Forschungszentrum Karlsruhe, Institut fuer Prozessdatenverarbeitung und Elektronik, Postfach 3640, 76021 Karlsruhe (Germany); Fraenkle, F.; Habermehl, F.; Renschler, P. [Universitaet Karlsruhe - TH, Institut fuer Experimentelle Kernphysik, Postfach 6980, 76128 Karlsruhe (Germany); Steidl, M [Forschungszentrum Karlsruhe, Institut fuer Kernphysik, Postfach 3640, 76021 Karlsruhe (Germany)

    2010-12-11

    The KATRIN neutrino mass experiment is based on a precise energy measurement ({Delta}E/E=5x10{sup -5}) of electrons emerging from tritium beta decay (E{sub max}=18.6 keV). This is done by a large electrostatic retarding spectrometer (MAC-E Filter), which is followed by an electron detector. Key requirements for this detector are a large sensitive area ({approx}80 cm{sup 2}), a certain energy resolution ({Delta}E=600 eV - 18.6 keV) but also a certain spatial resolution ({approx}3 mm), which leads to a multi-pixel design. As a tentative design on the way to the final detector, but also for operational service on the so-called pre-spectrometer experiment, a detector system with a reduced size (16 cm{sup 2}) and a reduced pixel number (64), making use of a monolithic segmented silicon PIN diode, was designed and built. While the design and very first measurements have been presented in Wuestling et al. , this publication shows the operational performance of the detector system. The robust concept of the electronics allowed adaptation to mechanically different experimental setups. The spacial resolution of the detector system proved to be essential in examining Penning trap induced background and other effects in the pre-spectrometer experiment. The detector performance test runs include energy resolution and calibration, background rates, correlation between pixels (crosstalk), spatially resolved rate analysis, and a dead-layer measurement . The detector allows for background searches with a sensitivity as low as 1.3x10{sup -3} cps/cm{sup 2} in the energy range of 20 keV. This allows the pre-spectrometer to be characterized with e-gun illumination with a signal to background ratio of better than 10{sup 5} and the search for ultra low Penning discharge emissions.

  3. Results from a 64-pixel PIN-diode detector system for low-energy beta-electrons

    Science.gov (United States)

    Wuestling, Sascha; Fraenkle, F.; Habermehl, F.; Renschler, P.; Steidl, M.

    2010-12-01

    The KATRIN neutrino mass experiment is based on a precise energy measurement (Δ E/ E=5×10 -5) of electrons emerging from tritium beta decay ( Emax=18.6 keV). This is done by a large electrostatic retarding spectrometer (MAC-E Filter), which is followed by an electron detector. Key requirements for this detector are a large sensitive area (˜80 cm 2), a certain energy resolution (Δ E=600 eV @ 18.6 keV) but also a certain spatial resolution (˜3 mm), which leads to a multi-pixel design. As a tentative design on the way to the final detector, but also for operational service on the so-called pre-spectrometer experiment, a detector system with a reduced size (16 cm 2) and a reduced pixel number (64), making use of a monolithic segmented silicon PIN diode, was designed and built. While the design and very first measurements have been presented in Wuestling et al. [6], this publication shows the operational performance of the detector system. The robust concept of the electronics allowed adaptation to mechanically different experimental setups. The spacial resolution of the detector system proved to be essential in examining Penning trap induced background and other effects in the pre-spectrometer experiment. The detector performance test runs include energy resolution and calibration, background rates, correlation between pixels (crosstalk), spatially resolved rate analysis, and a dead-layer measurement [7]. The detector allows for background searches with a sensitivity as low as 1.3×10 -3 cps/cm 2 in the energy range of 20 keV. This allows the pre-spectrometer to be characterized with e-gun illumination with a signal to background ratio of better than 10 5 and the search for ultra low Penning discharge emissions.

  4. Design and realization of a fast low noise electronics for a hybrid pixel X-ray detector dedicated to small animal imaging

    International Nuclear Information System (INIS)

    Chantepie, B.

    2008-12-01

    Since the invention of computerized tomography (CT), charge integration detector were widely employed for X-ray biomedical imaging applications. Nevertheless, other options exist. A new technology of direct detection using semiconductors has been developed for high energy physics instrumentation. This new technology, called hybrid pixel detector, works in photon counting mode and allows for selecting the minimum energy of the counted photons. The ImXgam research team at CPPM develops the PIXSCAN demonstrator, a CT-scanner using the hybrid pixel detector XPAD. The aim of this project is to evaluate the improvement in image quality and in dose delivered during X-ray examinations of a small animal. After a first prototype of a hybrid pixel detector XPAD1 proving the feasibility of the project, a complete imager XPAD2 was designed and integrated in the PIXSCAN demonstrator. Since then, with the evolution of microelectronic industry, important improvements are conceivable. To reducing the size of pixels and to improving the energy resolution of detectors, a third design XPAD3 was conceived and will be soon integrated in a second generation of PIXSCAN demonstrator. In this project, my thesis work consisted in taking part to the design of the detector readout electronics, to the characterization of the chips and of the hybrid pixel detectors, and also to the definition of a auto-zeroing architecture for pixels. The first and second chapters present X-ray medical imaging and particle detection with semi-conductors and its modelling. The third chapter deals with the specifications of electronic circuits for imaging applications first for analog pixels then for digital pixels and describes the general architecture of the integrated circuits. The validation tests are presented in the fourth chapter while the last chapter gives an account of expected changes in pixel electronics

  5. TSV last for hybrid pixel detectors: Application to particle physics and imaging experiments

    CERN Document Server

    Henry, D; Berthelot, A; Cuchet, R; Chantre, C; Campbell, M

    Hybrid pixel detectors are now widely used in particle physics experiments and at synchrotron light sources. They have also stimulated growing interest in other fields and, in particular, in medical imaging. Through the continuous pursuit of miniaturization in CMOS it has been possible to increase the functionality per pixel while maintaining or even shrinking pixel dimensions. The main constraint on the more extensive use of the technology in all fields is the cost of module building and the difficulty of covering large areas seamlessly [1]. On another hand, in the field of electronic component integration, a new approach has been developed in the last years, called 3D Integration. This concept, based on using the vertical axis for component integration, allows improving the global performance of complex systems. Thanks to this technology, the cost and the form factor of components could be decreased and the performance of the global system could be enhanced. In the field of radiation imaging detectors the a...

  6. Test-beam Results from a RICH Detector Prototype Using Aerogel Radiator and Pixel Hybrid Photon Detectors

    CERN Document Server

    Aglieri-Rinella, G; Van Lysebetten, A; Piedigrossi, D; Wyllie, K; Bellunato, T F; Calvi, M; Matteuzzi, C; Musy, M; Perego, D L; Somerville, L P; Newby, C; Easo, S; Wotton, S

    2006-01-01

    A test-beam study was performed at CERN with a Ring Imaging Cherenkov (RICH) prototype using three pixel Hybrid Photon Detectors. Results on the photon yield and Cherenkov angle resolution are presented here, for the Aerogel radiator and also for reference runs taken with Nitrogen radiator.

  7. A stacked CdTe pixel detector for a compton camera

    International Nuclear Information System (INIS)

    Oonuki, Kousuke; Tanaka, Takaaki; Watanabe, Shin; Takeda, Shin'ichiro; Nakazawa, Kazuhiro; Ushio, Masayoshi; Mitani, Takefumi; Takahashi, Tadayuki; Tajima, Hiroyasu

    2007-01-01

    We are developing a semiconductor Compton telescope to explore the universe in the energy band from several tens of keV to a few MeV. A detector material of combined Si strip and CdTe pixel is used to cover the energy range around 60keV. For energies above several hundred keV, in contrast, the higher detection efficiency of CdTe semiconductor in comparison with Si is expected to play an important role as both an absorber and a scatterer. In order to demonstrate the spectral and imaging capability of a CdTe-based Compton camera, we developed a Compton telescope consisting of a stack of CdTe pixel detectors as a small scale prototype. With this prototype, we succeeded in reconstructing images and spectra by solving the Compton kinematics within the energy band from 122 to 662keV. The energy resolution (FWHM) of reconstructed spectra is 7.3keV at 511keV. The angular resolution obtained at 511keV is measured to be 12.2 deg. (FWHM)

  8. Design and realization of a fast low noise electronics for a hybrid pixel X-ray detector dedicated to small animal imaging

    International Nuclear Information System (INIS)

    Chantepie, Benoit

    2008-01-01

    Since the invention of computerized tomography (CT), charge integration detector were widely employed for X-ray biomedical imaging applications. Nevertheless, other options exist. A new technology of direct detection using semiconductors has been developed for high energy physics instrumentation. This new technology, called hybrid pixel detector, works in photon counting mode and allows for selecting the minimum energy of the counted photons. The imXgam research team at CPPM develops the PIXSCAN demonstrator, a CT-scanner using the hybrid pixel detector XPAD. The aim of this project is to evaluate the improvement on image quality and on dose delivered during X-ray examinations of a small animal. After a first prototype of hybrid pixel detector XPAD1 proving the feasibility of the project, a complete imager XPAD2 was designed and integrated in the PIXSCAN demonstrator. Since then, with the evolution of microelectronic industry, important improvements are conceivable. To reducing the size of pixels and to improving the energy resolution of detectors, a third design XPAD3 was conceived and will be soon integrated in a second generation of PIXSCAN demonstrator. In this project, my thesis's work consisted in taking part to the design of the detector readout electronics, to the characterization of the chips and of the hybrid pixel detectors, and also to the definition of an auto-zeroing architecture for pixels. (author) [fr

  9. Charge-sensitive poly-silicon TFT amplifiers for a-Si:H pixel particle detectors

    International Nuclear Information System (INIS)

    Cho, G.; Perez-Mendez, V.; Hack, M.; Lewis, A.

    1992-04-01

    Prototype charge-sensitive poly-Si TFT amplifiers have been made for the amplification of signals (from an a-Si:H pixel diode used as an ionizing particle detector). They consist of a charge-sensitive gain stage, a voltage gain stage and a source follower output stage. The gain-bandwidth product of the amplifier is ∼ 300 MHz. When the amplifier is connected to a pixel detector of 0.2 pF, it gives a charge-to-voltage gain of ∼ 0.02 mV/electrons with a pulse rise time less than 100 nsec. An equivalent noise charge of the front-end TFT is ∼ 1000 electrons for a shaping time of 1 μsec

  10. Energy loss and online directional track visualization of fast electrons with the pixel detector Timepix

    Czech Academy of Sciences Publication Activity Database

    Granja, C.; Krist, Pavel; Chvátil, David; Šolc, J.; Pospíšil, S.; Jakubek, J.; Opalka, L.

    2013-01-01

    Roč. 59, DEC (2013), s. 245-261 ISSN 1350-4487 Institutional support: RVO:61389005 Keywords : interaction of radiation with matter * dE/dx detectors * particle tracking detectors * hybrid pixel detectors * active nuclear emulsion * energy loss Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.140, year: 2013

  11. The Belle II DEPFET pixel vertex detector. Development of a full-scale module prototype

    International Nuclear Information System (INIS)

    Lemarenko, Mikhail

    2013-11-01

    The Belle II experiment, which will start after 2015 at the SuperKEKB accelerator in Japan, will focus on the precision measurement of the CP-violation mechanism and on the search for physics beyond the Standard Model. A new detection system with an excellent spatial resolution and capable of coping with considerably increased background is required. To address this challenge, a pixel detector based on DEPFET technology has been proposed. A new all silicon integrated circuit, called Data Handling Processor (DHP), is implemented in 65 nm CMOS technology. It is designed to steer the detector and preprocess the generated data. The scope of this thesis covers DHP tests and optimization as well the development of its test environment, which is the first Full-Scale Module Prototype of the DEPFET Pixel Vertex detector.

  12. PantherPix hybrid pixel γ-ray detector for radio-therapeutic applications

    Science.gov (United States)

    Neue, G.; Benka, T.; Havránek, M.; Hejtmánek, M.; Janoška, Z.; Kafka, V.; Korchak, O.; Lednický, D.; Marčišovská, M.; Marčišovský, M.; Popule, J.; Şmarhák, J.; Şvihra, P.; Tomášek, L.; Vrba, V.; Konček, O.; Semmler, M.

    2018-02-01

    This work focuses on the design of a semiconductor pixelated γ-ray camera with a pixel size of 1 mm2. The cost of semiconductor manufacturing is mainly driven by economies of scale, which makes silicon the cheapest semiconductor material due to its widespread utilization. The energy of γ-photons used in radiation therapy are in a range, in which the dominant interaction mechanism is Compton scattering in every conceivable sensor material. Since the Compton scattering cross section is linearly dependent upon Z, it is less rewarding to utilize high Z sensor materials, than it is in the case of X-ray detectors (X-rays interact also via the photoelectric effect whose cross section scales proportional to Zn, where n is ≈ 4,5). For the stated reasons it was decided to use the low Z material silicon (Z = 14) despite its worse detection efficiency. The proposed detector is designed as a portal detector to be used in radiation cancer therapy. The purpose of the detector is to ensure correct patient alignment, spatial dose monitoring and to provide the feedback necessary for an emergency shutdown should the spatial dose rate profile deviate from the treatment plan. Radiation therapy equipment is complex and thus failure prone and the consequences of malfunction are often life threatening. High spatial resolution and high detection efficiency are not a high design priority. The detector design priorities are focused up on radiation hardness, robustness and the ability to cover a large area cost efficiently. The quintessential idea of the PanterPix detector exploits the relaxed spatial resolution requirement to achieve the stated goals. The detector is composed of submodules, each submodule consisting of a Si sensor with an array of fully depleted detection diodes and 8 miniature custom design readout ASICs collecting and measuring the minuscule charge packets generated due to ionization in the PN junctions.

  13. Construction and Performance of the ATLAS SCT Barrels and Cosmic Tests

    CERN Document Server

    Demirkoz, Bilge Melahat

    2007-01-01

    ATLAS is a multi-purpose detector for the LHC and will detect proton-proton collisions with center of mass energy of $14$TeV. Part of the central inner detector, the Semi-Conductor Tracker (SCT) barrels, were assembled and tested at Oxford University and later integrated at CERN with the TRT (Transition Radiation Tracker) barrel. The barrel SCT is composed of 4 layers of silicon strip modules with two sensor layers with $80 \\mu$m channel width. The design of the modules and the barrels has been optimized for low radiation length while maintaining mechanical stability, bringing services to the detector, and ensuring a cold and dry environment. The high granularity, high detector efficiency and low noise occupancy ($ < 5 \\times 10^{-4}$) of the SCT will enable ATLAS to have an efficient pattern recognition capability. Due to the binary nature of the SCT read-out, a stable read-out system and the calibration system is of critical importance. SctRodDaq is the online software framework for the calibration and a...

  14. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric,I et al.

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 1015 neq=cm2 , nearly 100% detection efficiency and a spatial resolution of about 3 μm were demonstrated. Since 2011 the HV detectors have first applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process.

  15. Charge Gain, Voltage Gain, and Node Capacitance of the SAPHIRA Detector Pixel by Pixel

    Science.gov (United States)

    Pastrana, Izabella M.; Hall, Donald N. B.; Baker, Ian M.; Jacobson, Shane M.; Goebel, Sean B.

    2018-01-01

    The University of Hawai`i Institute for Astronomy has partnered with Leonardo (formerly Selex) in the development of HgCdTe linear mode avalanche photodiode (L-APD) SAPHIRA detectors. The SAPHIRA (Selex Avalanche Photodiode High-speed Infra-Red Array) is ideally suited for photon-starved astronomical observations, particularly near infrared (NIR) adaptive optics (AO) wave-front sensing. I have measured the stability, and linearity with current, of a 1.7-um (10% spectral bandpass) infrared light emitting diode (IR LED) used to illuminate the SAPHIRA and have then utilized this source to determine the charge gain (in e-/ADU), voltage gain (in uV/ADU), and node capacitance (in fF) for each pixel of the 320x256@24um SAPHIRA. These have previously only been averages over some sub-array. Determined from the ratio of the temporal averaged signal level to variance under constant 1.7-um LED illumination, I present the charge gain pixel-by-pixel in a 64x64 sub-array at the center of the active area of the SAPHIRA (analyzed separately as four 32x32 sub-arrays) to be about 1.6 e-/ADU (σ=0.5 e-/ADU). Additionally, the standard technique of varying the pixel reset voltage (PRV) in 10 mV increments and recording output frames for the same 64x64 subarray found the voltage gain per pixel to be about 11.7 uV/ADU (σ=0.2 uV/ADU). Finally, node capacitance was found to be approximately 23 fF (σ=6 fF) utilizing the aforementioned charge and voltage gain measurements. I further discuss the linearity measurements of the 1.7-um LED used in the charge gain characterization procedure.

  16. Electrical characterization of CdTe pixel detectors with Al Schottky anode

    International Nuclear Information System (INIS)

    Turturici, A.A.; Abbene, L.; Gerardi, G.; Principato, F.

    2014-01-01

    Pixelated Schottky Al/p-CdTe/Pt detectors are very attractive devices for high-resolution X-ray spectroscopic imaging, even though they suffer from bias-induced time instability (polarization). In this work, we present the results of the electrical characterization of a (4×4) pixelated Schottky Al/p-CdTe/Pt detector. Current–voltage (I–V) characteristics and current transients were investigated at different temperatures. The results show deep levels that play a dominant role in the charge transport mechanism. The conduction mechanism is dominated by the space charge limited current (SCLC) both under forward bias and at high reverse bias. Schottky barrier height of the Al/CdTe contact was estimated by using the thermionic-field emission model at low reverse bias voltages. Activation energy of the deep levels was measured through the analysis of the reverse current transients at different temperatures. Finally, we employed an analytical method to determine the density and the energy distribution of the traps from SCLC current–voltage characteristics

  17. Semiconductor tracker final integration and commissioning in the ATLAS detector

    International Nuclear Information System (INIS)

    Robichaud-Veronneau, Andree

    2008-01-01

    The SemiConductor Tracker (SCT) is part of the Inner Detector of the ATLAS experiment at the LHC. It is located between the Pixel detector and the Transition Radiation Tracker (TRT). During 2006 and 2007, the SCT was installed in its final position inside the ATLAS detector. The SCT barrel was lowered in 2006 and was tested for connectivity and noise. Common tests with the TRT to look for pick-up noise and grounding issues were also performed. The SCT end-caps were installed during summer 2007 and will undergo similar checks. The results from the various tests done before and after installation will be presented here.

  18. Charge amplitude distribution of the Gossip gaseous pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Blanco Carballo, V.M. [Twente University, Enschede (Netherlands); Chefdeville, M. [NIKHEF, P.B. 41882, 1009DB Amsterdam (Netherlands); Colas, P.; Giomataris, Y. [Saclay, Gif-sur-Yvette (France); Graaf, H. van der; Gromov, V. [NIKHEF, P.B. 41882, 1009DB Amsterdam (Netherlands); Hartjes, F. [NIKHEF, P.B. 41882, 1009DB Amsterdam (Netherlands)], E-mail: F.Hartjes@nikhef.nl; Kluit, R.; Koffeman, E. [NIKHEF, P.B. 41882, 1009DB Amsterdam (Netherlands); Salm, C.; Schmitz, J.; Smits, S.M. [Twente University, Enschede (Netherlands); Timmermans, J.; Visschers, J.L. [NIKHEF, P.B. 41882, 1009DB Amsterdam (Netherlands)

    2007-12-11

    The Gossip gaseous pixel detector is being developed for the detection of charged particles in extreme high radiation environments as foreseen close to the interaction point of the proposed super LHC. The detecting medium is a thin layer of gas. Because of the low density of this medium, only a few primary electron/ion pairs are created by the traversing particle. To get a detectable signal, the electrons drift towards a perforated metal foil (Micromegas) whereafter they are multiplied in a gas avalanche to provide a detectable signal. The gas avalanche occurs in the high field between the Micromegas and the pixel readout chip (ROC). Compared to a silicon pixel detector, Gossip features a low material budget and a low cooling power. An experiment using X-rays has indicated a possible high radiation tolerance exceeding 10{sup 16} hadrons/cm{sup 2}. The amplified charge signal has a broad amplitude distribution due to the limited statistics of the primary ionization and the statistical variation of the gas amplification. Therefore, some degree of inefficiency is inevitable. This study presents experimental results on the charge amplitude distribution for CO{sub 2}/DME (dimethyl-ether) and Ar/iC{sub 4}H{sub 10} mixtures. The measured curves were fitted with the outcome of a theoretical model. In the model, the physical Landau distribution is approximated by a Poisson distribution that is convoluted with the variation of the gas gain and the electronic noise. The value for the fraction of pedestal events is used for a direct calculation of the cluster density. For some gases, the measured cluster density is considerably lower than given in literature.

  19. Charge amplitude distribution of the Gossip gaseous pixel detector

    Science.gov (United States)

    Blanco Carballo, V. M.; Chefdeville, M.; Colas, P.; Giomataris, Y.; van der Graaf, H.; Gromov, V.; Hartjes, F.; Kluit, R.; Koffeman, E.; Salm, C.; Schmitz, J.; Smits, S. M.; Timmermans, J.; Visschers, J. L.

    2007-12-01

    The Gossip gaseous pixel detector is being developed for the detection of charged particles in extreme high radiation environments as foreseen close to the interaction point of the proposed super LHC. The detecting medium is a thin layer of gas. Because of the low density of this medium, only a few primary electron/ion pairs are created by the traversing particle. To get a detectable signal, the electrons drift towards a perforated metal foil (Micromegas) whereafter they are multiplied in a gas avalanche to provide a detectable signal. The gas avalanche occurs in the high field between the Micromegas and the pixel readout chip (ROC). Compared to a silicon pixel detector, Gossip features a low material budget and a low cooling power. An experiment using X-rays has indicated a possible high radiation tolerance exceeding 10 16 hadrons/cm 2. The amplified charge signal has a broad amplitude distribution due to the limited statistics of the primary ionization and the statistical variation of the gas amplification. Therefore, some degree of inefficiency is inevitable. This study presents experimental results on the charge amplitude distribution for CO 2/DME (dimethyl-ether) and Ar/iC 4H 10 mixtures. The measured curves were fitted with the outcome of a theoretical model. In the model, the physical Landau distribution is approximated by a Poisson distribution that is convoluted with the variation of the gas gain and the electronic noise. The value for the fraction of pedestal events is used for a direct calculation of the cluster density. For some gases, the measured cluster density is considerably lower than given in literature.

  20. Charge amplitude distribution of the Gossip gaseous pixel detector

    International Nuclear Information System (INIS)

    Blanco Carballo, V.M.; Chefdeville, M.; Colas, P.; Giomataris, Y.; Graaf, H. van der; Gromov, V.; Hartjes, F.; Kluit, R.; Koffeman, E.; Salm, C.; Schmitz, J.; Smits, S.M.; Timmermans, J.; Visschers, J.L.

    2007-01-01

    The Gossip gaseous pixel detector is being developed for the detection of charged particles in extreme high radiation environments as foreseen close to the interaction point of the proposed super LHC. The detecting medium is a thin layer of gas. Because of the low density of this medium, only a few primary electron/ion pairs are created by the traversing particle. To get a detectable signal, the electrons drift towards a perforated metal foil (Micromegas) whereafter they are multiplied in a gas avalanche to provide a detectable signal. The gas avalanche occurs in the high field between the Micromegas and the pixel readout chip (ROC). Compared to a silicon pixel detector, Gossip features a low material budget and a low cooling power. An experiment using X-rays has indicated a possible high radiation tolerance exceeding 10 16 hadrons/cm 2 . The amplified charge signal has a broad amplitude distribution due to the limited statistics of the primary ionization and the statistical variation of the gas amplification. Therefore, some degree of inefficiency is inevitable. This study presents experimental results on the charge amplitude distribution for CO 2 /DME (dimethyl-ether) and Ar/iC 4 H 10 mixtures. The measured curves were fitted with the outcome of a theoretical model. In the model, the physical Landau distribution is approximated by a Poisson distribution that is convoluted with the variation of the gas gain and the electronic noise. The value for the fraction of pedestal events is used for a direct calculation of the cluster density. For some gases, the measured cluster density is considerably lower than given in literature

  1. Efficient phase contrast imaging in STEM using a pixelated detector. Part 1: Experimental demonstration at atomic resolution

    Energy Technology Data Exchange (ETDEWEB)

    Pennycook, Timothy J., E-mail: tpennycook@gmail.com [EPSRC SuperSTEM Facility, Daresbury Laboratory, Warrington WA4 4AD (United Kingdom); Department of Materials, University of Oxford, Parks Road, Oxford OX1 3PH (United Kingdom); Lupini, Andrew R. [Oak Ridge National Laboratory, Materials Science and Technology Division, Oak Ridge, TN 37830 (United States); Yang, Hao [Department of Materials, University of Oxford, Parks Road, Oxford OX1 3PH (United Kingdom); Murfitt, Matthew F. [Nion Co., 1102 8th St., Kirkland, WA 98033 (United States); Jones, Lewys [Department of Materials, University of Oxford, Parks Road, Oxford OX1 3PH (United Kingdom); Nellist, Peter D. [EPSRC SuperSTEM Facility, Daresbury Laboratory, Warrington WA4 4AD (United Kingdom); Department of Materials, University of Oxford, Parks Road, Oxford OX1 3PH (United Kingdom)

    2015-04-15

    We demonstrate a method to achieve high efficiency phase contrast imaging in aberration corrected scanning transmission electron microscopy (STEM) with a pixelated detector. The pixelated detector is used to record the Ronchigram as a function of probe position which is then analyzed with ptychography. Ptychography has previously been used to provide super-resolution beyond the diffraction limit of the optics, alongside numerically correcting for spherical aberration. Here we rely on a hardware aberration corrector to eliminate aberrations, but use the pixelated detector data set to utilize the largest possible volume of Fourier space to create high efficiency phase contrast images. The use of ptychography to diagnose the effects of chromatic aberration is also demonstrated. Finally, the four dimensional dataset is used to compare different bright field detector configurations from the same scan for a sample of bilayer graphene. Our method of high efficiency ptychography produces the clearest images, while annular bright field produces almost no contrast for an in-focus aberration-corrected probe. - Highlights: • Ptychographic high efficiency phase contrast imaging is demonstrated in STEM. • We rely on a hardware aberration corrector to eliminate aberrations. • High efficiency is achieved by collecting all the relevant interference. • Use of a pixelated detector allows comparison of bright field modes post acquisition. • Ptychography provides the clearest images among the STEM bright field modes tested.

  2. New Generation GridPix: Development and characterisation of pixelated gaseous detectors based on the Timepix3 chip

    CERN Document Server

    AUTHOR|(CDS)2082958; Hessey, Nigel

    Due to the increasing demands of high energy physics experiments there is a need for particle detectors which enable high precision measurements. In this regard, the GridPix detector is a novel detector concept which combines the benefits of a pixel chip with an integrated gas amplification structure. The resulting unit is a detector sensitive to single electrons with a great potential for particle tracking and energy loss measurements. This thesis is focusing on the development of a new generation of GridPix detectors based on the Timepix3 chip, which implements a high resolution Time to Digital Converter (TDC) in each pixel. After an introductory chapter describing the motivation behind GridPix, the manuscript presents the physics of gaseous detectors in chapter 2 along with the gaseous detectors used for particle tracking in chapter 3. Chapters 4 and 5 are focusing on the tracking performance of GridPix detectors. Chapter 4 presents results obtained with a GridPix detector based on a small scale prototy...

  3. Four-layer DOI PET detectors using a multi-pixel photon counter array and the light sharing method

    Energy Technology Data Exchange (ETDEWEB)

    Nishikido, Fumihiko, E-mail: funis@nirs.go.jp; Inadama, Naoko; Yoshida, Eiji; Murayama, Hideo; Yamaya, Taiga

    2013-11-21

    Silicon photomultipliers (SiPMs) provide many advantages for PET detectors, such as their high internal gain, high photon detection efficiency and insensitivity to magnetic fields. The number of detectable scintillation photons of SiPMs, however, is limited by the number of microcells. Therefore, pulse height of PET detectors using SiPMs is saturated when large numbers of scintillation photons enter the SiPM pixels. On the other hand, we previously presented a depth-of-interaction (DOI) encoding method that is based on the light sharing method. Since our encoding method detects scintillation photons with multiple readout pixels, the saturation effect can be suppressed. We constructed two prototype four-layer DOI detectors using a SiPM array and evaluated their performances. The two prototype detectors consisted of four layers of a 6×6 array of Lu{sub 2(1−x)}Y{sub 2x}SiO{sub 5} (LYSO) crystals and a SiPM (multi-pixel photon detector, MPPC, Hamamatsu Photonics K.K.) array of 4×4 pixels. The size of each LYSO crystal element was 1.46 mm×1.46 mm×4.5 mm and all surfaces of the crystal elements were chemically etched. We used two types of MPPCs. The first one had 3600 microcells and high photon detection efficiency (PDE). The other one had 14,400 microcells and lower PDE. In the evaluation experiment, all the crystals of the detector using the MPPC which had the high PDE were clearly identified. The respective energy and timing resolutions of lower than 15% and 1.0 ns were achieved for each crystal element. No saturation of output signals was observed in the 511 keV energy region due to suppression of the saturation effect by detecting scintillation photons with several MPPC pixels by the light sharing method. -- Highlights: •We constructed and evaluated four-layer DOI detectors by the light sharing method using a MPPC array. •The detectors using two types of the MPPC array were compared. •The energy and timing resolutions of lower than 15% and 1.0 ns were

  4. Four-layer DOI PET detectors using a multi-pixel photon counter array and the light sharing method

    International Nuclear Information System (INIS)

    Nishikido, Fumihiko; Inadama, Naoko; Yoshida, Eiji; Murayama, Hideo; Yamaya, Taiga

    2013-01-01

    Silicon photomultipliers (SiPMs) provide many advantages for PET detectors, such as their high internal gain, high photon detection efficiency and insensitivity to magnetic fields. The number of detectable scintillation photons of SiPMs, however, is limited by the number of microcells. Therefore, pulse height of PET detectors using SiPMs is saturated when large numbers of scintillation photons enter the SiPM pixels. On the other hand, we previously presented a depth-of-interaction (DOI) encoding method that is based on the light sharing method. Since our encoding method detects scintillation photons with multiple readout pixels, the saturation effect can be suppressed. We constructed two prototype four-layer DOI detectors using a SiPM array and evaluated their performances. The two prototype detectors consisted of four layers of a 6×6 array of Lu 2(1−x) Y 2x SiO 5 (LYSO) crystals and a SiPM (multi-pixel photon detector, MPPC, Hamamatsu Photonics K.K.) array of 4×4 pixels. The size of each LYSO crystal element was 1.46 mm×1.46 mm×4.5 mm and all surfaces of the crystal elements were chemically etched. We used two types of MPPCs. The first one had 3600 microcells and high photon detection efficiency (PDE). The other one had 14,400 microcells and lower PDE. In the evaluation experiment, all the crystals of the detector using the MPPC which had the high PDE were clearly identified. The respective energy and timing resolutions of lower than 15% and 1.0 ns were achieved for each crystal element. No saturation of output signals was observed in the 511 keV energy region due to suppression of the saturation effect by detecting scintillation photons with several MPPC pixels by the light sharing method. -- Highlights: •We constructed and evaluated four-layer DOI detectors by the light sharing method using a MPPC array. •The detectors using two types of the MPPC array were compared. •The energy and timing resolutions of lower than 15% and 1.0 ns were achieved for

  5. Design studies on sensors for the ATLAS Pixel Detector

    CERN Document Server

    Hügging, F G

    2002-01-01

    For the ATLAS Pixel Detector, prototype sensors have been successfully developed. For the sensors design, attention was given to survivability of the harsh LHC radiation environment leading to the need to operate them at several hundreds of volts, while maintaining a good charge collection efficiency, small cell size and minimal multiple scattering. For a cost effective mass production, a bias grid is implemented to test the sensors before assembly under full bias. (6 refs).

  6. submitter Development of the readout for the IBL upgrade project of the ATLAS Pixel Detector

    CERN Document Server

    Krieger, Nina

    The LHC luminosity is upgraded in several phases until 2022. The resulting higher occupancy degrades the detector performance of the current Pixel Detector. To provide a good performance during the LHC luminosity upgrade, a fourth pixel layer is inserted into the existing ATLAS Pixel Detector. A new FE-I4 readout chip and a new data acquisition chain are required to cope with the higher track rate and the resulting increased bandwidth. Among others, this includes a new readout board: the IBL ROD. One component of this board is the DSP which creates commands for the FE-I4 chip and has to be upgraded as well. In this thesis, the first tests of the IBL ROD prototype are presented. A correct communication of the DSP to its external memory is verified. Moreover, the implementations for an IBL DSP code are described and tested. This includes the first configuration of the FE-I4 with an IBL ROD. In addition, a working communication with the Histogrammer SDRAM and the Input FIFO on the IBL ROD are demonstrated.

  7. Conception and characterization of a virtual coplanar grid for a 11×11 pixelated CZT detector

    Energy Technology Data Exchange (ETDEWEB)

    Espagnet, Romain; Frezza, Andrea [Department of Physics, Engineering Physics and Optics and Cancer Research Center, Université Laval, Quebec city, QC, Canada G1R 0A6 (Canada); Martin, Jean-Pierre; Hamel, Louis-André [Department of Physics, Université de Montréal, C.P. 6128 Montréal QC, Canada H3C 3J7 (Canada); Després, Philippe, E-mail: philippe.despres@phy.ulaval.ca [Department of Physics, Engineering Physics and Optics and Cancer Research Center, Université Laval, Quebec city, QC, Canada G1R 0A6 (Canada); Department of Radiation Oncology and Research Center of CHU de Québec - Université Laval, Quebec city, QC Canada G1R 2J6 (Canada)

    2017-07-11

    Due to the low mobility of holes in CZT, commercially available detectors with a relatively large volume typically use a pixelated anode structure. They are mostly used in imaging applications and often require a dense electronic readout scheme. These large volume detectors are also interesting for high-sensitivity applications and a CZT-based blood gamma counter was developed from a 20×20×15 mm{sup 3} crystal available commercially and having a 11×11 pixelated readout scheme. A method is proposed here to reduce the number of channels required to use the crystal in a high-sensitivity counting application, dedicated to pharmacokinetic modelling in PET and SPECT. Inspired by a classic coplanar anode, an implementation of a virtual coplanar grid was done by connecting the 121 pixels of the detector to form intercalated bands. The layout, the front-end electronics and the characterization of the detector in this 2-channel anode geometry is presented. The coefficients required to compensate for electron trapping in CZT were determined experimentally to improve the performance. The resulting virtual coplanar detector has an intrinsic efficiency of 34% and an energy resolution of 8% at 662 keV. The detector's response was linear between 80 keV and 1372 keV. This suggests that large CZT crystals offer an excellent alternative to scintillation detectors for some applications, especially those where high-sensitivity and compactness are required.

  8. Semiconductor micropattern pixel detectors: a review of the beginnings

    International Nuclear Information System (INIS)

    Heijne, E.H.M.

    2001-01-01

    The innovation in monolithic and hybrid semiconductor 'micropattern' or 'reactive' pixel detectors for tracking in particle physics was actually to fit logic and pulse processing electronics with μW power on a pixel area of less than 0.04 mm 2 , retaining the characteristics of a traditional nuclear amplifier chain. The ns timing precision in conjunction with local memory and logic operations allowed event selection at >10 MHz rates with unambiguous track reconstruction even at particle multiplicities >10 cm -2 . The noise in a channel was ∼100e - rms and enabled binary operation with random noise 'hits' at a level -8 . Rectangular pixels from 75 μmx500 μm down to 34 μmx125 μm have been used by different teams. In binary mode a tracking precision from 6 to 14 μm was obtained, and using analog interpolation one came close to 1 μm. Earlier work, still based on charge integrating imaging circuits, provided a starting point. Two systems each with more than 1 million sensor + readout channels have been built, for WA97-NA57 and for the Delphi very forward tracker. The use of 0.5 μm and 0.25 μm CMOS and enclosed geometry for the transistors in the pixel readout chips resulted in radiation hardness of ∼2 Mrad, respectively, >30 Mrad

  9. Success and failure of dead-time models as applied to hybrid pixel detectors in high-flux applications

    International Nuclear Information System (INIS)

    Sobott, B. A.; Broennimann, Ch.; Schmitt, B.; Trueb, P.; Schneebeli, M.; Lee, V.; Peake, D. J.; Elbracht-Leong, S.; Schubert, A.; Kirby, N.; Boland, M. J.; Chantler, C. T.; Barnea, Z.; Rassool, R. P.

    2013-01-01

    Detector response functionals are found to have useful but also limited application to synchrotron studies where bunched fills are becoming common. By matching the detector response function to the source temporal structure, substantial improvements in efficiency, count rate and linearity are possible. The performance of a single-photon-counting hybrid pixel detector has been investigated at the Australian Synchrotron. Results are compared with the body of accepted analytical models previously validated with other detectors. Detector functionals are valuable for empirical calibration. It is shown that the matching of the detector dead-time with the temporal synchrotron source structure leads to substantial improvements in count rate and linearity of response. Standard implementations are linear up to ∼0.36 MHz pixel −1 ; the optimized linearity in this configuration has an extended range up to ∼0.71 MHz pixel −1 ; these are further correctable with a transfer function to ∼1.77 MHz pixel −1 . This new approach has wide application both in high-accuracy fundamental experiments and in standard crystallographic X-ray fluorescence and other X-ray measurements. The explicit use of data variance (rather than N 1/2 noise) and direct measures of goodness-of-fit (χ r 2 ) are introduced, raising issues not encountered in previous literature for any detector, and suggesting that these inadequacies of models may apply to most detector types. Specifically, parametrization of models with non-physical values can lead to remarkable agreement for a range of count-rate, pulse-frequency and temporal structure. However, especially when the dead-time is near resonant with the temporal structure, limitations of these classical models become apparent. Further, a lack of agreement at extreme count rates was evident

  10. First SCT Barrel arrives at CERN

    CERN Multimedia

    Apsimon, R

    Mid-January saw the arrival at CERN of Barrel #3, the first of four SCT barrels. The barrels are formed as low-mass cylinders of carbon fibre skins on a honeycomb carbon core. They are manufactured in industry and then have all the final precision supports added and the final geometric metrology carried out at Geneva University. Barrel #3, complete with its 384 silicon detector modules, arrived by road from Oxford University in England where the modules were mounted using a purpose-built robot. The modules had been selected from the output of all four barrel module building clusters (in Japan, Scandinavia, USA and the UK). Since Barrel #3 will be exposed to high radiation levels within the tracker volume, these modules, representing over half a million readout channels, have been extensively tested at their operational temperature of around -25 degrees Celcius and at voltages of up to 500V. The dangers of shipping such a fragile component of ATLAS were apparent to all and considerable attention was focused...

  11. Development of a pixel sensor with fine space-time resolution based on SOI technology for the ILC vertex detector

    Energy Technology Data Exchange (ETDEWEB)

    Ono, Shun, E-mail: s-ono@champ.hep.sci.osaka-u.ac.jp [Osaka University, 1-1 Machikaneyama, Toyonaka (Japan); Togawa, Manabu; Tsuji, Ryoji; Mori, Teppei [Osaka University, 1-1 Machikaneyama, Toyonaka (Japan); Yamada, Miho; Arai, Yasuo; Tsuboyama, Toru; Hanagaki, Kazunori [Institute of Particle and Nuclear Studies, High Energy Accelerator Research Org. (KEK), 1-1 Oho, Tsukuba (Japan)

    2017-02-11

    We have been developing a new monolithic pixel sensor with silicon-on-insulator (SOI) technology for the International Linear Collider (ILC) vertex detector system. The SOI monolithic pixel detector is realized using standard CMOS circuits fabricated on a fully depleted sensor layer. The new SOI sensor SOFIST can store both the position and timing information of charged particles in each 20×20 μm{sup 2} pixel. The position resolution is further improved by the position weighted with the charges spread to multiple pixels. The pixel also records the hit timing with an embedded time-stamp circuit. The sensor chip has column-parallel analog-to-digital conversion (ADC) circuits and zero-suppression logic for high-speed data readout. We are designing and evaluating some prototype sensor chips for optimizing and minimizing the pixel circuit.

  12. Tests of the gated mode for Belle II pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Prinker, Eduard [Max-Planck-Institute for Physics, Munich (Germany); Collaboration: Belle II-Collaboration

    2015-07-01

    DEPFET pixel detectors offer intrinsic amplification and very high signal to noise ratio. They form an integral building block for the vertex detector system of the Belle II experiment, which will start data taking in the year 2017 at the SuperKEKB Collider in Japan. A special Test board (Hybrid4) is used, which contains a small version of the DEPFET sensor with a read-out (DCD) and a steering chip (Switcher) attached, both controlled by a field-programmable gate array (FPGA) as the central interface to the computer. In order to keep the luminosity of the collider constant over time, the particle bunch currents have to be topped off by injecting additional bunches at a rate of 50 Hz. The particles in the daughter bunches produce a high rate of background (noisy bunches) for a short period of time, saturating the occupancy of the sensor. Operating the DEPFET sensor in a Gated Mode allows preserving the signals from collisions of normal bunches while protecting the pixels from background signals of the passing noisy bunches. An overview of the Gated Mode and first results is presented.

  13. Development of a cadmium telluride pixel detector for astrophysical applications

    Science.gov (United States)

    Miyasaka, Hiromasa; Harrison, Fiona A.; Cook, Walter R.; Mao, Peter H.; Rana, Vikram R.; Ishikawa, Shin-Nosuke; Ushio, Masayoshi; Aono, Hiroyuki; Watanabe, Shin; Sato, Goro; Kokubun, Motohide; Takahashi, Tadayuki

    2009-08-01

    We are developing imaging Cadmium Telluride (CdTe) pixel detectors optimized for astrophysical hard X-ray applications. Our hybrid detector consist of a CdTe crystal 1mm thick and 2cm × 2cm in area with segmented anode contacts directly bonded to a custom low-noise application specific integrated circuit (ASIC). The CdTe sensor, fabricated by ACRORAD (Okinawa, Japan), has Schottky blocking contacts on a 605 micron pitch in a 32 × 32 array, providing low leakage current and enabling readout of the anode side. The detector is bonded using epoxy-gold stud interconnects to a custom low noise, low power ASIC circuit developed by Caltech's Space Radiation Laboratory. We have achieved very good energy resolution over a wide energy range (0.62keV FWHM @ 60keV, 10.8keV FWHM @ 662keV). We observe polarization effects at room temperature, but they are suppressed if we operate the detector at or below 0°C degree. These detectors have potential application for future missions such as the International X-ray Observatory (IXO).

  14. Evaluation of the charge-sharing effects on spot intensity in XRD setup using photon-counting pixel detectors

    International Nuclear Information System (INIS)

    Nilsson, H.-E.; Mattsson, C.G.; Norlin, B.; Froejdh, C.; Bethke, K.; Vries, R. de

    2006-01-01

    In this study, we examine how charge loss due to charge sharing in photon-counting pixels detectors affects the recording of spot intensity in an X-ray diffraction (XRD) setup. In the photon-counting configuration, the charge from photons that are absorbed at the boarder of a pixel will be shared between two pixels. If the threshold is high enough, these photons will not be counted whereas if it is low enough, they will be counted twice. In an XRD setup, the intensity and position of various spots should be recorded. Thus, the intensity measure will be affected by the setting of the threshold. In this study, we used a system level Monte Carlo simulator to evaluate the variations in the intensity signals for different threshold settings and spot sizes. The simulated setup included an 8keV mono-chromatic source (providing a Gaussian shaped spot) and the MEDIPIX2 photon-counting pixel detector (55 μm x 55 μm pixel size with 300μm silicon) at various detector biases. Our study shows that the charge-sharing distortion can be compensated by numerical post processing and that high resolution in both charge distribution and position can be achieved

  15. High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

    CERN Document Server

    Peric, Ivan; Backhaus, Malte; Barbero, Marlon; Benoit, Mathieu; Berger, Niklaus; Bompard, Frederic; Breugnon, Patrick; Clemens, Jean-Claude; Dannheim, Dominik; Dierlamm, Alexander; Feigl, Simon; Fischer, Peter; Fougeron, Denis; Garcia-Sciveres, Maurice; Heim, Timon; Hügging, Fabian; Kiehn, Moritz; Kreidl, Christian; Krüger, Hans; La Rosa, Alessandro; Liu, Jian; Lütticke, Florian; Mariñas, Carlos; Meng, Lingxin; Miucci, Antonio; Münstermann, Daniel; Nguyen, Hong Hanh; Obermann, Theresa; Pangaud, Patrick; Perrevoort, Ann-Kathrin; Rozanov, Alexandre; Schöning, André; Schwenker, Benjamin; Wiedner, Dirk

    2013-01-01

    High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 10 15 n eq = cm 2 , nearly 100% detection ef fi ciency and a spatial resolution of about 3 μ m were demonstrated. Since 2011 the HV detectors have fi rst applications: the technology is presently the main option for the pixel detector of the planned Mu3e experiment at PSI (Switzerland). Several prototype sensors have been designed in a standard 180 nm HV CMOS process and successfully tested. Thanks to its high radiation tolerance, the HV detectors are also seen at CERN as a promising alternative to the standard options for ATLAS upgrade and CLIC. In order to test the concept, within ATLAS upgrade R/D, we are currently exploring an active pixel detector demonstrator HV2FEI4; also implemented in the 180 nm HV process

  16. Development and characterization of a DEPFET pixel prototype system for the ILC vertex detector

    Energy Technology Data Exchange (ETDEWEB)

    Kohrs, Robert

    2008-09-15

    For the future TeV-scale linear collider ILC (International Linear Collider) a vertex detector of unprecedented performance is needed to fully exploit its physics potential. By incorporating a field effect transistor into a fully depleted sensor substrate the DEPFET (Depleted Field Effect Transistor) sensor combines radiation detection and in-pixel amplification. For the operation at a linear collider the excellent noise performance of DEPFET pixels allows building very thin detectors with a high spatial resolution and a low power consumption. With this thesis a prototype system consisting of a 64 x 128 pixels sensor, dedicated steering and readout ASICs and a data acquisition board has been developed and successfully operated in the laboratory and under realistic conditions in beam test environments at DESY and CERN. A DEPFET matrix has been successfully read out using the on-chip zero-suppression of the readout chip CURO 2. The results of the system characterization and beam test results are presented. (orig.)

  17. Development and characterization of a DEPFET pixel prototype system for the ILC vertex detector

    International Nuclear Information System (INIS)

    Kohrs, Robert

    2008-09-01

    For the future TeV-scale linear collider ILC (International Linear Collider) a vertex detector of unprecedented performance is needed to fully exploit its physics potential. By incorporating a field effect transistor into a fully depleted sensor substrate the DEPFET (Depleted Field Effect Transistor) sensor combines radiation detection and in-pixel amplification. For the operation at a linear collider the excellent noise performance of DEPFET pixels allows building very thin detectors with a high spatial resolution and a low power consumption. With this thesis a prototype system consisting of a 64 x 128 pixels sensor, dedicated steering and readout ASICs and a data acquisition board has been developed and successfully operated in the laboratory and under realistic conditions in beam test environments at DESY and CERN. A DEPFET matrix has been successfully read out using the on-chip zero-suppression of the readout chip CURO 2. The results of the system characterization and beam test results are presented. (orig.)

  18. An investigation of performance characteristics of a pixellated room-temperature semiconductor detector for medical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Guerra, P; Santos, A [Centro de Investigacion Biomedica de Bioningenieria, Biomateriales y Nanomedicina, CEEI-Modulo 3, C/ Maria de Luna, 11, 50018 Zaragoza (United States); Darambara, D G, E-mail: pguerra@ciber-bbn.e [Joint Department of Physics, Royal Marsden NHS Foundation Trust and Institute of Cancer Research, Fulham Road, London SW3 6JJ (United Kingdom)

    2009-09-07

    The operation of any semiconductor detector depends on the movement of the charge carriers, which are created within the material when radiation passes through, as a result of energy deposition. The carrier movement in the bulk semiconductor induces charges on the metal electrodes, and therefore a current on the electrodes and the external circuit. The induced charge strongly depends on the material transport parameters as well as the geometrical dimensions of a pixellated semiconductor detector. This work focuses on the performance optimization in terms of energy resolution, detection efficiency and intrinsic spatial resolution of a room-temperature semiconductor pixellated detector based on CdTe/CdZnTe. It analyses and inter-relates these performance figures for various dimensions of CdTe and CdZnTe detectors and for an energy range spanning from x-ray (25 keV) to PET (511 keV) imaging. Monte Carlo simulations, which integrate a detailed and accurate noise model, are carried out to investigate several CdTe/CdZnTe configurations and to determine possible design specifications. Under the considered conditions, the simulations demonstrate the superiority of the CdZnTe over the CdTe in terms of energy resolution and sensitivity in the photopeak. Further, according to the results, the spatial resolution is maximized at high energies and the energy resolution at low energies, while a reasonable detection efficiency is achieved at high energies, with a 1 x 1 x 6 mm{sup 3} CdZnTe pixellated detector.

  19. An investigation of performance characteristics of a pixellated room-temperature semiconductor detector for medical imaging

    International Nuclear Information System (INIS)

    Guerra, P; Santos, A; Darambara, D G

    2009-01-01

    The operation of any semiconductor detector depends on the movement of the charge carriers, which are created within the material when radiation passes through, as a result of energy deposition. The carrier movement in the bulk semiconductor induces charges on the metal electrodes, and therefore a current on the electrodes and the external circuit. The induced charge strongly depends on the material transport parameters as well as the geometrical dimensions of a pixellated semiconductor detector. This work focuses on the performance optimization in terms of energy resolution, detection efficiency and intrinsic spatial resolution of a room-temperature semiconductor pixellated detector based on CdTe/CdZnTe. It analyses and inter-relates these performance figures for various dimensions of CdTe and CdZnTe detectors and for an energy range spanning from x-ray (25 keV) to PET (511 keV) imaging. Monte Carlo simulations, which integrate a detailed and accurate noise model, are carried out to investigate several CdTe/CdZnTe configurations and to determine possible design specifications. Under the considered conditions, the simulations demonstrate the superiority of the CdZnTe over the CdTe in terms of energy resolution and sensitivity in the photopeak. Further, according to the results, the spatial resolution is maximized at high energies and the energy resolution at low energies, while a reasonable detection efficiency is achieved at high energies, with a 1 x 1 x 6 mm 3 CdZnTe pixellated detector.

  20. Study of prototypes of LFoundry active CMOS pixels sensors for the ATLAS detector

    Science.gov (United States)

    Vigani, L.; Bortoletto, D.; Ambroz, L.; Plackett, R.; Hemperek, T.; Rymaszewski, P.; Wang, T.; Krueger, H.; Hirono, T.; Caicedo Sierra, I.; Wermes, N.; Barbero, M.; Bhat, S.; Breugnon, P.; Chen, Z.; Godiot, S.; Pangaud, P.; Rozanov, A.

    2018-02-01

    Current high energy particle physics experiments at the LHC use hybrid silicon detectors, in both pixel and strip configurations, for their inner trackers. These detectors have proven to be very reliable and performant. Nevertheless, there is great interest in depleted CMOS silicon detectors, which could achieve a similar performance at lower cost of production. We present recent developments of this technology in the framework of the ATLAS CMOS demonstrator project. In particular, studies of two active sensors from LFoundry, CCPD_LF and LFCPIX, are shown.

  1. Study of prototypes of LFoundry active CMOS pixels sensors for the ATLAS detector

    CERN Document Server

    Vigani, L.; Ambroz, L.; Plackett, R.; Hemperek, T.; Rymaszewski, P.; Wang, T.; Krueger, H.; Hirono, T.; Caicedo Sierra, I.; Wermes, N.; Barbero, M.; Bhat, S.; Breugnon, P.; Chen, Z.; Godiot, S.; Pangaud, P.; Rozanov, A.

    2018-01-01

    Current high energy particle physics experiments at the LHC use hybrid silicon detectors, in both pixel and strip configurations, for their inner trackers. These detectors have proven to be very reliable and performant. Nevertheless, there is great interest in depleted CMOS silicon detectors, which could achieve a similar performance at lower cost of production. We present recent developments of this technology in the framework of the ATLAS CMOS demonstrator project. In particular, studies of two active sensors from LFoundry, CCPD_LF and LFCPIX, are shown.

  2. Ion-ion coincidence imaging at high event rate using an in-vacuum pixel detector

    Science.gov (United States)

    Long, Jingming; Furch, Federico J.; Durá, Judith; Tremsin, Anton S.; Vallerga, John; Schulz, Claus Peter; Rouzée, Arnaud; Vrakking, Marc J. J.

    2017-07-01

    A new ion-ion coincidence imaging spectrometer based on a pixelated complementary metal-oxide-semiconductor detector has been developed for the investigation of molecular ionization and fragmentation processes in strong laser fields. Used as a part of a velocity map imaging spectrometer, the detection system is comprised of a set of microchannel plates and a Timepix detector. A fast time-to-digital converter (TDC) is used to enhance the ion time-of-flight resolution by correlating timestamps registered separately by the Timepix detector and the TDC. In addition, sub-pixel spatial resolution (principle experiment on strong field dissociative double ionization of carbon dioxide molecules (CO2), using a 400 kHz repetition rate laser system. The experimental results demonstrate that the spectrometer can detect multiple ions in coincidence, making it a valuable tool for studying the fragmentation dynamics of molecules in strong laser fields.

  3. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector; Entwurf und Implementation eines Expertensystems fuer das Detektorkontrollsystem des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Henss, Tobias

    2008-12-15

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts.

  4. ATLAS silicon microstrip detector system (SCT)

    International Nuclear Information System (INIS)

    Unno, Y.

    2003-01-01

    The S CT together with the pixel and the transition radiation tracker systems and with a central solenoid forms the central tracking system of the ATLAS detector at LHC. Series production of SCT Silicon microstrip sensors is near completion. The sensors have been shown to be robust against high voltage operation to the 500 V required after fluences of 3x10 14 protons/cm 2 . SCT barrel modules are in series production. A low-noise CCD camera has been used to debug the onset of leakage currents

  5. Test-beam activities and results for the ATLAS ITk pixel detector

    CERN Document Server

    Bisanz, Tobias; The ATLAS collaboration

    2017-01-01

    The Phase-II upgrade of the LHC will result in an increase of the instantaneous luminosity up to about $5\\times10^{34}~\\text{cm}^{-2}\\text{s}^{-1}$. To cope with the resulting challenges the current Inner Detector will be replaced by an all-silicon Inner Tracker (ITk) system. The Pixel Detector will have to deal with occupancies of about 300~hits/FE/s as well as a fluence of $2\\times10^{16}~\\text{n}_\\text{eq}\\text{cm}^{-2}$. Various sensor layouts are under development, aiming at providing a high performance, cost effective pixel instrumentation to cover an active area of about $10~\\text{m}^2$. These range from thin planar silicon, over 3D silicon, to active CMOS sensors.\\par After extensive characterization of the sensors in the lab, their charge collection properties and hit efficiency are measured in common testbeam campaigns, which provide valuable feedback for improvements of the layout. Testbeam measurements of the final prototypes will be used for the decision of which sensor types will be installed in...

  6. A new technique of characterization of the intra-pixel response of astronomical detectors

    International Nuclear Information System (INIS)

    Ketchazo, C.; Boulade, O.; Moreau, V.; Dubreuil, D.; Ronayette, S.; Berthe, M.

    2014-01-01

    This paper is devoted to the presentation of a new technique of characterization of the Intra-Pixel Sensitivity Variations (IPSVs) of astronomical detectors. The IPSV is the spatial variation of the sensitivity within a pixel and it was demonstrated that this variation can contribute to the instrument global error. Then IPSV has not to be neglected especially in the case of under-sampled instruments for high quality imaging and accurate photometry. The common approaches to measure the IPSV consist in determining the pixel response function (PRF) by scanning an optical probe through the detector. These approaches require high-aperture optics, high precision mechanical devices and are time consuming. The original approach we will present in this paper consists in projecting high-resolution periodic patterns onto the whole sensor without classic optics but using the self-imaging property (the Talbot effect) of a Continuously Self Imaging Grating (CSIG) illuminated by a plane wave. This paper describes the test bench and its design rules. The methodology of the measurement is also presented. Two measurement procedures are available: global and local. In the global procedure, the mean PRF corresponding to the whole Focal Plane Array (FPA) or a sub-area of the FPA is evaluated. The results obtained applying this procedure on e2v CCD 204 are presented and discussed in detail. In the local procedure, a CSIG is moved in front of each pixel and a pixel PRF is reconstructed by resolving the inverse problem. The local procedure is presented and validated by simulations. (authors)

  7. Tracking and b-tagging with pixel vertex detector in ATLAS experiment at LHC

    International Nuclear Information System (INIS)

    Vacavant, L.

    1997-06-01

    The capability of the ATLAS detector to tag b-jets is studied, using the impact parameter of charged tracks. High b-tagging performance is needed at LHC, especially during the first years of running, in order to see evidence of the Higgs boson if its mass lies between 80 and 120 GeV/c 2 . A pattern-recognition algorithm has been developed for this purpose, using a detailed simulation of the ATLAS inner detector. Track-finding starts from the pixel detector layers. A 'hyper-plane' concept allows the use of a simple tracking algorithm though the complex geometry. High track-finding efficiency and reconstruction quality ensure the discrimination of b-jets from other kinds of jets. After full simulation and reconstruction of H → bb-bar, H → gg, H → uu-bar, H → ss-bar and H → cc-bar events (m H = 100 GeV/c 2 ), the mean rejections achieved against non-b-jets for a 50% b-jet tagging efficiency are as follows: R g =39±5 R u = 60 ± 9 R s = 38 ± 5 R c = 9 ± 1 The analysis of data from the first radiation-hard pixel detector prototypes justifies the potential of these detectors for track-finding and high-precision impact parameter measurement at LHC. (author)

  8. Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector; Entwurf und Implementation eines Expertensystems fuer das Detektorkontrollsystem des ATLAS-Pixeldetektors

    Energy Technology Data Exchange (ETDEWEB)

    Henss, Tobias

    2008-12-15

    In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts.

  9. Work on the ATLAS semiconductor tracker barrel

    CERN Multimedia

    Maximilien Brice

    2005-01-01

    Precision work is performed on the semiconductor tracker barrel of the ATLAS experiment. All work on these delicate components must be performed in a clean room so that impurities in the air, such as dust, do not contaminate the detector. The semiconductor tracker will be mounted in the barrel close to the heart of the ATLAS experiment to detect the path of particles produced in proton-proton collisions.

  10. Characterisation of the high dynamic range Large Pixel Detector (LPD) and its use at X-ray free electron laser sources

    Science.gov (United States)

    Veale, M. C.; Adkin, P.; Booker, P.; Coughlan, J.; French, M. J.; Hart, M.; Nicholls, T.; Schneider, A.; Seller, P.; Pape, I.; Sawhney, K.; Carini, G. A.; Hart, P. A.

    2017-12-01

    The STFC Rutherford Appleton Laboratory have delivered the Large Pixel Detector (LPD) for MHz frame rate imaging at the European XFEL. The detector system has an active area of 0.5 m × 0.5 m and consists of a million pixels on a 500 μm pitch. Sensors have been produced from 500 μm thick Hammamatsu silicon tiles that have been bump bonded to the readout ASIC using a silver epoxy and gold stud technique. Each pixel of the detector system is capable of measuring 105 12 keV photons per image readout at 4.5 MHz. In this paper results from the testing of these detectors at the Diamond Light Source and the Linac Coherent Light Source (LCLS) are presented. The performance of the detector in terms of linearity, spatial uniformity and the performance of the different ASIC gain stages is characterised.

  11. Operational Experience and Performance with the ATLAS Pixel Detector at the Large Hadron Collider

    CERN Document Server

    Grummer, Aidan; The ATLAS collaboration

    2018-01-01

    The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of 2 x 10^34 cm-2 s-1 recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency will be described, with special emphasis to radiation damage experience. In particular, radiation damage effects will be showed and signs of degradation which are visible but which are not impacting yet the tracking performance (but will): dE/dX, occupancy reduction with integrated luminosity, under-depletion effects with IBL in 2016, effects of annealing that is not insignificant for the inner-most layers. Therefore the offline software strat...

  12. Characterisation of the NA62 GigaTracker End of Column Demonstrator Hybrid Pixel Detector

    Science.gov (United States)

    Noy, M.; Aglieri Rinella, G.; Cotta Ramusino, A.; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Perktold, L.; Poltorak, K.; Riedler, P.

    2011-11-01

    The architecture and characterisation of the NA62 GigaTracker End of Column Demonstrator Hybrid Pixel Detector (HPD) are presented. This detector must perform time stamping to 200 ps (RMS) or better, provide 300 μm pitch position information and operate with a dead time of 1% or less for 800 MHz-1 GHz beam rate. The demonstrator HPD Assembly comprises a readout chip with a test column of 45 pixels, alongside other test structures, bump bonded to a p-in-n detector 200 μm in thickness. Validation of the performance of the HPD and the time-over-threshold timewalk compensation mechanism with both beam particles and a high precision laser system was performed and is presented. Confirmation of better than the required time stamping precision has been demonstrated and subsequent work on the design of the full-scale ASIC, dubbed TDCPix, is underway. An overview of the TDCPix architecure is given.

  13. The micro vertex detector for the anti PANDA experiment

    Energy Technology Data Exchange (ETDEWEB)

    Esch, Simone [Forschungszentrum Juelich (Germany); Collaboration: PANDA-Collaboration

    2015-07-01

    The anti PANDA detector is one of the main experiments at the upcoming Facility for Antiproton and Ion Research (FAIR), which is under construction in Darmstadt, Germany. The fixed-target experiment will explore anti pp annihilations with intense, phase space-cooled beams with momenta between 1.5 and 15 GeV/c. One aim of the detector is to perform high precision measurements of particles like excited charmonium and D mesons. Essential for background suppression is the tagging of D mesons by measuring their decay point. Therefore, a Micro Vertex Detector (MVD) is planned at anti PANDA as the innermost tracking detector. The MVD aims to reconstruct vertices with a resolution better than 100 μm to cope with the decay length of the D{sup ±} mesons (cτ=315 μm) produced with a mean βγ=2. The detector consists of silicon pixel and double-sided silicon strip detectors, arranged in four barrel layers and six disk layers. An overview of the MVD is given in this talk. Recent developments like laboratory and testbeam results of the current pixel front-end ASIC prototype ToPix 4 are shown. The concept of the newly developed strip front-end ASIC PASTA is presented.

  14. Characterization of a pixelated CdTe Timepix detector operated in ToT mode

    International Nuclear Information System (INIS)

    Billoud, T.; Leroy, C.; Papadatos, C.; Roux, J.S.; Pichotka, M.; Pospisil, S.

    2017-01-01

    A 1 mm thick CdTe sensor bump-bonded to a Timepix readout chip operating in Time-over-Threshold (ToT) mode has been characterized in view of possible applications in particle and medical physics. The CdTe sensor layer was segmented into 256 × 256 pixels, with a pixel pitch of 55  μm. This CdTe Timepix device, of ohmic contact type, has been exposed to alpha-particles and photons from an 241 Am source, photons from a 137 Cs source, and protons of different energies (0.8–10 MeV) delivered by the University of Montreal Tandem Accelerator. The device was irradiated on the negatively biased backside electrode. An X-ray per-pixel calibration commonly used for this type of detector was done and its accuracy and resolution were assessed and compared to those of a 300  μm thick silicon Timepix device. The electron mobility-lifetime product (μ e τ e ) of CdTe for protons of low energy has been obtained from the Hecht equation. Possible polarization effects have been also investigated. Finally, information about the homogeneity of the detector was obtained from X-ray irradiation.

  15. Study of planar pixel sensors hardener to radiations for the upgrade of the ATLAS vertex detector

    International Nuclear Information System (INIS)

    Benoit, M.

    2011-05-01

    In this work, we present a study, using TCAD (Technology Computer-Assisted Design) simulation, of the possible methods of designing planar pixel sensors by reducing their inactive area and improving their radiation hardness for use in the Insertable B-Layer (IBL) project and for SLHC upgrade phase for the ATLAS experiment. Different physical models available have been studied to develop a coherent model of radiation damage in silicon that can be used to predict silicon pixel sensor behavior after exposure to radiation. The Multi-Guard Ring Structure, a protection structure used in pixel sensor design was studied to obtain guidelines for the reduction of inactive edges detrimental to detector operation while keeping a good sensor behavior through its lifetime in the ATLAS detector. A campaign of measurement of the sensor process parameters and electrical behavior to validate and calibrate the TCAD simulation models and results are also presented. A model for diode charge collection in highly irradiated environment was developed to explain the high charge collection observed in highly irradiated devices. A simple planar pixel sensor digitization model to be used in test beam and full detector system is detailed. It allows for easy comparison between experimental data and prediction by the various radiation damage models available. The digitizer has been validated using test beam data for unirradiated sensors and can be used to produce the first full scale simulation of the ATLAS detector with the IBL that include sensor effects such as slim edge and thinning of the sensor. (author)

  16. The NA62 Gigatracker: Detector properties and pixel read-out architectures

    International Nuclear Information System (INIS)

    Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Noy, M.; Petrucci, F.; Riedler, P.; Rivetti, A.; Tiuraniemi, S.

    2010-01-01

    The beam spectrometer of the NA62 experiment, named Gigatracker, has to perform single track reconstruction with unprecedented time resolution (150 ps rms) in a harsh radiation environment. To meet these requirements, and in order to reduce material budget to a minimum, three hybrid silicon pixel detector stations will be installed in vacuum. An adequate strategy to compensate for the discriminator time-walk must be implemented and R and D investigating two different options is ongoing. Two read-out chip prototypes have been designed in order to compare their performance: one approach is based on the use of a constant-fraction discriminator followed by an on-pixel TDC, while the other one is based on the use of a time-over-threshold circuit followed by a TDC shared by a group of pixels. This paper describes the Gigatracker system, presents the global architectures of both read-out ASICs and reviews the current status of the R and D project.

  17. High-speed x-ray imaging with the Keck pixel array detector (Keck PAD) for time-resolved experiments at synchrotron sources

    Energy Technology Data Exchange (ETDEWEB)

    Philipp, Hugh T., E-mail: htp2@cornell.edu; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T. [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY (United States); Chamberlain, Darol; Gruner, Sol M. [Laboratory of Atomic and Solid State Physics, Cornell University, Ithaca, NY (United States); Cornell High Energy Synchrotron Source (CHESS), Cornell University, Ithaca, NY (United States)

    2016-07-27

    Modern storage rings are readily capable of providing intense x-ray pulses, tens of picoseconds in duration, millions of times per second. Exploiting the temporal structure of these x-ray sources opens avenues for studying rapid structural changes in materials. Many processes (e.g. crack propagation, deformation on impact, turbulence, etc.) differ in detail from one sample trial to the next and would benefit from the ability to record successive x-ray images with single x-ray sensitivity while framing at 5 to 10 MHz rates. To this end, we have pursued the development of fast x-ray imaging detectors capable of collecting bursts of images that enable the isolation of single synchrotron bunches and/or bunch trains. The detector technology used is the hybrid pixel array detector (PAD) with a charge integrating front-end, and high-speed, in-pixel signal storage elements. A 384×256 pixel version, the Keck-PAD, with 150 µm × 150 µm pixels and 8 dedicated in-pixel storage elements is operational, has been tested at CHESS, and has collected data for compression wave studies. An updated version with 27 dedicated storage capacitors and identical pixel size has been fabricated.

  18. Optimization of the thermal performances of the Alpine Pixel Detector

    CERN Document Server

    Zhang, Zhan; Di Ciaccio, Lucia

    The ATLAS (A Toroidal LHC ApparatuS) detector is the largest detector of the Large Hadron Collider (LHC). One of the most important goals of ATLAS was to search for the missing piece of the Standard Model, the Higgs boson that had been found in 2012. In order to keep looking for the unknowns, it is planned to upgrade the LHC. The High Luminosity LHC (HL-LHC) is a novel configuration of the accelerator, aiming at increasing the luminosity by a factor five or more above the nominal LHC design. In parallel with the accelerator upgrade also the ATLAS will be upgraded to cope with detector aging and to achieve the same or better performance under increased event rate and radiation dose expected at the HL-LHC. This thesis discusses a novel design for the ATLAS Pixel Detector called the "Alpine" layout for the HL-LHC. To support this design, a local support structure is proposed, optimized and tested with an advanced CO2 evaporative cooling system. A numerical program called “CoBra” simulating the twophase heat ...

  19. High-dynamic-range coherent diffractive imaging: ptychography using the mixed-mode pixel array detector

    Energy Technology Data Exchange (ETDEWEB)

    Giewekemeyer, Klaus, E-mail: klaus.giewekemeyer@xfel.eu [European XFEL GmbH, Hamburg (Germany); Philipp, Hugh T. [Cornell University, Ithaca, NY (United States); Wilke, Robin N. [Georg-August-Universität Göttingen, Göttingen (Germany); Aquila, Andrew [European XFEL GmbH, Hamburg (Germany); Osterhoff, Markus [Georg-August-Universität Göttingen, Göttingen (Germany); Tate, Mark W.; Shanks, Katherine S. [Cornell University, Ithaca, NY (United States); Zozulya, Alexey V. [Deutsches Elektronen-Synchrotron DESY, Hamburg (Germany); Salditt, Tim [Georg-August-Universität Göttingen, Göttingen (Germany); Gruner, Sol M. [Cornell University, Ithaca, NY (United States); Cornell University, Ithaca, NY (United States); Kavli Institute of Cornell for Nanoscience, Ithaca, NY (United States); Mancuso, Adrian P. [European XFEL GmbH, Hamburg (Germany)

    2014-08-07

    The advantages of a novel wide dynamic range hard X-ray detector are demonstrated for (ptychographic) coherent X-ray diffractive imaging. Coherent (X-ray) diffractive imaging (CDI) is an increasingly popular form of X-ray microscopy, mainly due to its potential to produce high-resolution images and the lack of an objective lens between the sample and its corresponding imaging detector. One challenge, however, is that very high dynamic range diffraction data must be collected to produce both quantitative and high-resolution images. In this work, hard X-ray ptychographic coherent diffractive imaging has been performed at the P10 beamline of the PETRA III synchrotron to demonstrate the potential of a very wide dynamic range imaging X-ray detector (the Mixed-Mode Pixel Array Detector, or MM-PAD). The detector is capable of single photon detection, detecting fluxes exceeding 1 × 10{sup 8} 8-keV photons pixel{sup −1} s{sup −1}, and framing at 1 kHz. A ptychographic reconstruction was performed using a peak focal intensity on the order of 1 × 10{sup 10} photons µm{sup −2} s{sup −1} within an area of approximately 325 nm × 603 nm. This was done without need of a beam stop and with a very modest attenuation, while ‘still’ images of the empty beam far-field intensity were recorded without any attenuation. The treatment of the detector frames and CDI methodology for reconstruction of non-sensitive detector regions, partially also extending the active detector area, are described.

  20. A GEANT4 based simulation for pixelated X-ray hybrid detectors

    International Nuclear Information System (INIS)

    Marinho, F.; Akiba, K.

    2015-01-01

    In this letter we present a detailed Monte Carlo approach to simulate pixelated detectors for X-ray applications. It allows us to fully characterize quantities such as interaction probability and reconstructed energy deposits according to beam energy as to evaluate energy and position resolution for comparisons with experimental results. The implementation and use of Monte Carlo truth information is also discussed

  1. Sensor Development for the CMS Pixel Detector

    CERN Document Server

    Rohe, T; Chiochia, V; Cremaldi, L M; Cucciarelli, S; Dorkhov, A; Konecki, M; Prokofiev, K; Regenfus, C; Sanders, D A; Son, S; Speer, T; Swartz, M

    2003-01-01

    This paper reports on a current R&D activity for the sensor part of the CMS pixel detector. Devices featuring several design and technology options have been irradiated up to a proton fluence of 1E15 (1MeV Neutron)/cm**2 at the CERN PS. Afterwards they have been bump bonded to unirradiated readout chips. The chip allows a non zero suppressed full analogue readout and therefore a good characterization of the sensors in terms of noise and charge collection properties. The samples have been tested using high energy pions in the H2 beam line of the CERN SPS in June and September 2003. The results of this test beam are presented and the differences between the sensor options are discussed.

  2. The Design and Implementation in $0.13\\mu m$ CMOS of an Algorithm Permitting Spectroscopic Imaging with High Spatial Resolution for Hybrid Pixel Detectors

    CERN Document Server

    Ballabriga, Rafael; Vilasís-Cardona, Xavier

    2009-01-01

    Advances in pixel detector technology are opening up new possibilities in many fields of science. Modern High Energy Physics (HEP) experiments use pixel detectors in tracking systems where excellent spatial resolution, precise timing and high signal-to-noise ratio are required for accurate and clean track reconstruction. Many groups are working worldwide to adapt the hybrid pixel technology to other fields such as medical X-ray radiography, protein structure analysis or neutron imaging. The Medipix3 chip is a 256x256 channel hybrid pixel detector readout chip working in Single Photon Counting Mode. It has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture neighbouring pixels communicate with one another. Charges can be summed event-by-event and the incoming quantum can be assigned as a single hit to the pixel with the biggest charge deposit. In the case where incoming X-...

  3. The ALPIDE pixel sensor chip for the upgrade of the ALICE Inner Tracking System

    Energy Technology Data Exchange (ETDEWEB)

    Aglieri Rinella, Gianluca, E-mail: gianluca.aglieri.rinella@cern.ch

    2017-02-11

    The ALPIDE chip is a CMOS Monolithic Active Pixel Sensor being developed for the Upgrade of the ITS of the ALICE experiment at the CERN Large Hadron Collider. The ALPIDE chip is implemented with a 180 nm CMOS Imaging Process and fabricated on substrates with a high-resistivity epitaxial layer. It measures 15 mm×30 mm and contains a matrix of 512×1024 pixels with in-pixel amplification, shaping, discrimination and multi-event buffering. The readout of the sensitive matrix is hit driven. There is no signaling activity over the matrix if there are no hits to read out and power consumption is proportional to the occupancy. The sensor meets the experimental requirements of detection efficiency above 99%, fake-hit probability below 10{sup −5} and a spatial resolution of 5 μm. The capability to read out Pb–Pb interactions at 100 kHz is provided. The power density of the ALPIDE chip is projected to be less than 35 mW/cm{sup 2} for the application in the Inner Barrel Layers and below 20 mW/cm{sup 2} for the Outer Barrel Layers, where the occupancy is lower. This contribution describes the architecture and the main features of the final ALPIDE chip, planned for submission at the beginning of 2016. Early results from the experimental qualification of full scale prototype predecessors are also reported. - Highlights: • The ALPIDE chip, an innovative CMOS pixel particle detector is described. • It achieves excellent detection performance figures and very low power consumption. • The characterization of prototypes confirms the achievement of the specifications.

  4. The TDCpix readout ASIC: A 75 ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Kluge, A., E-mail: alexander.kluge@cern.ch; Aglieri Rinella, G.; Bonacini, S.; Jarron, P.; Kaplon, J.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

    2013-12-21

    The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm{sup 2} for a total rate of about 0.75 GHz. Ten TDCpix chips will be bump-bonded to every silicon pixel sensor. Each chip shall perform time stamping of 100 M particle hits per second with a detection efficiency above 99% and a timing accuracy better than 200 ps rms for an overall three-station-setup time resolution of better than 150 ps. The TDCpix chip has been designed in a 130 nm CMOS technology. It will feature 45×40 square pixels of 300×300μm{sup 2} and a complex End of Column peripheral region including an array of TDCs based on DLLs, four high speed serializers, a low-jitter PLL, readout and control circuits. This contribution will describe the complete design of the final TDCpix ASIC. It will discuss design choices, the challenges faced and some of the lessons learned. Furthermore, experimental results from the testing of circuit prototypes will be presented. These demonstrate the achievement of key performance figures such as a time resolution of the processing chain of 75 ps rms with a laser sent to the center of the pixel and the capability of time stamping charged particles with an overall resolution below 200 ps rms. -- Highlights: • Feasibility demonstration of a silicon pixel detector with sub-ns time tagging capability. • Demonstrator detector assembly with a time resolution of 75 ps RMS with laser charge injection; 170 ps RMS with particle beam. • Design of trigger-less TDCpix ASIC with 1800 pixels, 720 TDC channels and 4 3.2 Gbit/s serializers.

  5. Detection of secondary electrons with pixelated hybrid semiconductor detectors; Sekundaerelektronennachweis mit pixelierten hybriden Halbleiterdetektoren

    Energy Technology Data Exchange (ETDEWEB)

    Gebert, Ulrike Sonja

    2011-09-14

    Within the scope of this thesis, secondary electrons were detected with a pixelated semiconductor detector named Timepix. The Timepix detector consists of electronics and a sensor made from a semiconductor material. The connection of sensor and electronics is done for each pixel individually using bump bonds. Electrons with energies above 3 keV can be detected with the sensor. One electron produces a certain amount of electron-hole pairs according to its energy. The charge then drifts along an electric field to the pixel electronics, where it induces an electric signal. Even without a sensor it is possible to detect an electric signal from approximately 1000 electrons directly in the pixel electronics. Two different detector systems to detect secondary electrons using the Timepix detector were investigated during this thesis. First of all, a hybrid photon detector (HPD) was used to detect single photoelectrons. The HPD consists of a vacuum vessel with an entrance window and a cesium iodine photocathode at the inner surface of the window. Photoelectrons are released from the photocathode by incident light and are accelerated in an electric field towards the Timepix detector, where the point of interaction and the arrival time of the electron is determined. With a proximity focusing setup, a time resolution of 12 ns (with an acceleration voltage of 20 kV between photocathode and Timepix detector) was obtained. The HPD examined in this thesis showed a strong dependence of the dark rate form the acceleration voltage and the pressure in the vacuum vessel. At a pressure of few 10{sup -5} mbar and an acceleration voltage of 20 kV, the dark rate was about 800 Hz per mm{sup 2} area of the read out photocathode. One possibility to reduce the dark rate is to identify ion feedback events. With a slightly modified setup it was possible to reduce the dark rate to 0.5 Hz/mm{sup 2}. To achieve this, a new photocathode was mounted in a shorter distance to the detector. The

  6. Testing, installation and development of hardware and software components for the forward pixel detector of CMS

    CERN Document Server

    Florez Bustos, Carlos Andres

    2007-01-01

    The LHC (Large Hadron Collider) will be the particle accelerator with the highest collision energy ever. CMS (Compact Muon Solenoid) is one of the two largest experiments at the LHC. A main goal of CMS is to elucidate the electroweak symmetry breaking and determine if the Higgs mechanism is responsible for it. The pixel detector in CMS is the closest detector to the interaction point and is part of the tracker system. This thesis presents four different projects related to the forward pixel detector, performed as part of the testing and development of its hardware and software components. It presents the methods, implementation and results for the data acquisition and installation of the detector control system at the Meson Test Beam Facility of Fermilab for the beam test of the detector; the study of the C.A.E.N power supply and the multi service cable; the layout of the test stands for the assembly of the half-disk and half-service cylinder and the development of a software interface to the data acquisition...

  7. Pixel 2010: A résumé

    CERN Document Server

    Wermes, Norbert

    2011-01-01

    The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also using the hybrid pixel technology, have greatly advanced the experimental possibilities for diffraction experiments. Monolithic or semi-monolithic devices like CMOS active pixels and DEPFET pixels have now reached a state such that complete vertex detectors for RHIC and superKEKB are being built with these technologies. Finally, new advances towards fully monolithic active pixel detectors, featuring full CMOS electronics merged with efficient signal charge collection, exploiting standard CMOS technologies, SOI and/or 3D integration, show the path for the future. This résumé attempts to extract the main statements of the results and developments presented at this conference.

  8. Four-layer depth-of-interaction PET detector for high resolution PET using a multi-pixel S8550 avalanche photodiode

    Energy Technology Data Exchange (ETDEWEB)

    Nishikido, Fumihiko, E-mail: funis@nirs.go.j [Molecular Imaging Center, National Institute of Radiological Sciences, 4-9-1 Anagawa, Inage-ku, Chiba 263-8555 (Japan); Inadama, Naoko [Molecular Imaging Center, National Institute of Radiological Sciences, 4-9-1 Anagawa, Inage-ku, Chiba 263-8555 (Japan); Oda, Ichiro [Shimadzu Corporation, Nishinokyo Kuwabaracho 1 Nakagyo-ku, Kyoto-shi, Kyoto 604-8511 (Japan); Shibuya, Kengo; Yoshida, Eiji; Yamaya, Taiga [Molecular Imaging Center, National Institute of Radiological Sciences, 4-9-1 Anagawa, Inage-ku, Chiba 263-8555 (Japan); Kitamura, Keishi [Shimadzu Corporation, Nishinokyo Kuwabaracho 1 Nakagyo-ku, Kyoto-shi, Kyoto 604-8511 (Japan); Murayama, Hideo [Molecular Imaging Center, National Institute of Radiological Sciences, 4-9-1 Anagawa, Inage-ku, Chiba 263-8555 (Japan)

    2010-09-21

    Avalanche photodiodes (APDs) are being used as photodetectors in positron emission tomography (PET) because they have many advantages over photomultipliers (PMTs) typically used in PET detectors. We have developed a PET detector that consists of a multi-pixel APD and a 6x6x4 array of 1.46x1.46 mm{sup 2}x4.5 m LYSO crystals for a small animal PET scanner. The detector can identify four-layer depth of interaction (DOI) with a position-sensitive APD coupled to the backside of a crystal array by just an optimized reflector arrangement. Since scintillation lights are shared among many pixels by the method, weaker signals in APD pixels far from the interacting crystals are affected by noise. To evaluate the performance of the four-layer DOI detector with the APD and the influence of electrical noise on our method, we constructed a prototype DOI detector and tested its performance. We found, except for crystal elements on the edge of the crystal array, all crystal elements could be identified from the 2D position histogram. An energy resolution of 16.9% was obtained for the whole crystal array of the APD detector. The results of noise dependence of detector performances indicated that the DOI detector using the APD could achieve sufficient performance even when using application-specific integrated circuits.

  9. Four-layer depth-of-interaction PET detector for high resolution PET using a multi-pixel S8550 avalanche photodiode

    International Nuclear Information System (INIS)

    Nishikido, Fumihiko; Inadama, Naoko; Oda, Ichiro; Shibuya, Kengo; Yoshida, Eiji; Yamaya, Taiga; Kitamura, Keishi; Murayama, Hideo

    2010-01-01

    Avalanche photodiodes (APDs) are being used as photodetectors in positron emission tomography