WorldWideScience

Sample records for patterned wafer-level cu-cu

  1. Physical mechanisms of Cu-Cu wafer bonding

    International Nuclear Information System (INIS)

    Rebhan, B.

    2014-01-01

    Modern manufacturing processes of complex integrated semiconductor devices are based on wafer-level manufacturing of components which are subsequently interconnected. When compared with classical monolithic bi-dimensional integrated circuits (2D ICs), the new approach of three-dimensional integrated circuits (3D ICs) exhibits significant benefits in terms of signal propagation delay and power consumption due to the reduced metal interconnection length and allows high integration levels with reduced form factor. Metal thermo-compression bonding is a process suitable for 3D interconnects applications at wafer level, which facilitates the electrical and mechanical connection of two wafers even processed in different technologies, such as complementary metal oxide semiconductor (CMOS) and microelectromechanical systems (MEMS). Due to its high electrical conductivity, copper is a very attractive material for electrical interconnects. For Cu-Cu wafer bonding the process requires typically bonding for around 1 h at 400°C and high contact pressure applied during bonding. Temperature reduction below such values is required in order to solve issues regarding (i) throughput in the wafer bonder, (ii) wafer-to-wafer misalignment after bonding and (iii) to minimise thermo-mechanical stresses or device degradation. The aim of this work was to study the physical mechanisms of Cu-Cu bonding and based on this study to further optimise the bonding process for low temperatures. The critical sample parameters (roughness, oxide, crystallinity) were identified using selected analytical techniques and correlated with the characteristics of the bonded Cu-Cu interfaces. Based on the results of this study the impact of several materials and process specifications on the bonding result were theoretically defined and experimentally proven. These fundamental findings subsequently facilitated low temperature (LT) metal thermo-compression Cu-Cu wafer bonding and even room temperature direct

  2. Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

    Directory of Open Access Journals (Sweden)

    Koki Tanaka

    2016-12-01

    Full Text Available To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, the reduced pure Cu surface is treated by H2/Ar plasma, NH3 plasma and thiol solution, respectively, and is covered by Cu hydride, Cu nitride and a self-assembled monolayer (SAM accordingly. A pair of the treated wafers is then bonded by the thermo-compression bonding method, and evaluated by the tensile test. Results show that the bond strengths of the wafers treated by NH3 plasma and SAM are not sufficient due to the remaining surface protection layers such as Cu nitride and SAMs resulting from the pre-treatment. In contrast, the H2/Ar plasma–treated wafer showed the same strength as the one with formic acid vapor treatment, even when exposed to the atmosphere for 30 min. In the thermal desorption spectroscopy (TDS measurement of the H2/Ar plasma–treated Cu sample, the total number of the detected H2 was 3.1 times more than the citric acid–treated one. Results of the TDS measurement indicate that the modified Cu surface is terminated by chemisorbed hydrogen atoms, which leads to high bonding strength.

  3. Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

    International Nuclear Information System (INIS)

    Cao Yuhan; Luo Le

    2009-01-01

    A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu 6 Sn 5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 x 10 -9 atm cc/s are possible, meeting the demands of MIL-STD-883E. (semiconductor technology)

  4. Texturization of diamond-wire-sawn multicrystalline silicon wafer using Cu, Ag, or Ag/Cu as a metal catalyst

    Science.gov (United States)

    Wang, Shing-Dar; Chen, Ting-Wei

    2018-06-01

    In this work, Cu, Ag, or Ag/Cu was used as a metal catalyst to study the surface texturization of diamond-wire-sawn (DWS) multi-crystalline silicon (mc-Si) wafer by a metal-assisted chemical etching (MACE) method. The DWS wafer was first etched by standard HF-HNO3 acidic etching, and it was labeled as AE-DWS wafer. The effects of ratios of Cu(NO3)2:HF, AgNO3:HF, and AgNO3:Cu(NO3)2 on the morphology of AE-DWS wafer were investigated. After the process of MACE, the wafer was treated with a NaF/H2O2 solution. In this process, H2O2 etched the nanostructure, and NaF removed the oxidation layer. The Si {1 1 1} plane was revealed by etching the wafer in a mixture of 0.03 M Cu(NO3)2 and 1 M HF at 55 °C for 2.5 min. These parallel Si {1 1 1} planes replaced some parallel saw marks on the surface of AE-DWS wafers without forming a positive pyramid or an inverted pyramid structure. The main topography of the wafer is comprised of silicon nanowires grown in direction when Ag or Ag/Cu was used as a metal catalyst. When silicon is etched in a mixed solution of Cu(NO3)2, AgNO3, HF and H2O2 at 55 °C with a concentration ratio of [Cu2+]/[Ag+] of 50 or at 65 °C with a concentration ratio of [Cu2+]/[Ag+] of 33, a quasi-inverted pyramid structure can be obtained. The reflectivity of the AE-DWS wafers treated with MACE is lower than that of the multiwire-slurry-sawn (MWSS) mc-Si wafers treated with traditional HF + HNO3 etching.

  5. Material size effects on crack growth along patterned wafer-level Cu–Cu bonds

    DEFF Research Database (Denmark)

    Tvergaard, Viggo; Niordson, Christian Frithiof; Hutchinson, John W.

    2013-01-01

    together. Crack growth along the bond interface is here studied numerically using finite element analyses. The experiments have shown that plasticity in the Cu films makes a major contribution to the macroscopic interface toughness. To account for the size dependence of the plastic flow a strain gradient...... plasticity model is applied here for the metal. A cohesive zone model is applied to represent the crack growth along the bond between the two Cu films. This cohesive zone model incorporates the effect of higher order stresses in the continuum, such that the higher order tractions on the crack faces decay...... the toughness peak and the subsequent plateau level are highly sensitive to the value of the characteristic material length. A small material length, relative to the thickness of the Cu film, gives high toughness whereas a length comparable to the film thickness gives much reduced crack growth resistance...

  6. Preparation of conductive Cu patterns by directly writing using nano-Cu ink

    Energy Technology Data Exchange (ETDEWEB)

    Li, Wei [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China); Li, Wenjiang; Wei, Jun [School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384 (China); Tan, Junjun [School of Chemical and Materials and Engineering, Hubei University of Technology, Hubei 435003 (China); Chen, Minfang, E-mail: mfchentj@126.com [School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384 (China)

    2014-07-01

    Conductive and air-stable Cu patterns were directly made on ordinary photo paper using a roller pen filled with nano-Cu ink, which was mainly composed of metallic Cu nanoparticles (NPs) capped with poly(N-vinylpyrrolidone) (PVP). The nano-Cu NPs were obtained via the reduction of Cu{sup 2+} ions by using an excess of hydrazine and PVP. The low sintering temperature (160 °C) in Ar atmosphere played an important role for the preparation of air-stable Cu patterns. The conductivity of a radio-frequency identification antenna made from nano-Cu ink was tested by a lamp, and its resistivity achieved 13.4 ± 0.4 μΩ cm. The Cu NPs were confirmed by means of X-ray powder diffraction and X-ray photoelectron spectra, and the Cu patterns were characterized by scanning electron microscopy and energy dispersive X-ray spectrometry. A mechanism for the high conductivity of the Cu pattern made from Cu NPs is proposed. - Highlights: • The synthesis of pure Cu is related to the reducing agent and capping agent. • The sintering under Ar atmosphere prevents Cu pattern's rapid oxidation. • The formation of the bulk Cu decreases the resistivity of the Cu pattern.

  7. Effect of alkaline slurry on the electric character of the pattern Cu wafer

    International Nuclear Information System (INIS)

    Hu Yi; Liu Yuling; Liu Xiaoyan; He Yangang; Wang Liran; Zhang Baoguo

    2011-01-01

    For process integration considerations, we will investigate the impact of chemical mechanical polishing (CMP) on the electrical characteristics of the pattern Cu wafer. In this paper, we investigate the impacts of the CMP process with two kinds of slurry, one of which is acid slurry of SVTC and the other is FA/O alkaline slurry purchased from Tianjin Jingling Microelectronic Material Limited. Three aspects were investigated: resistance, capacitance and leakage current. The result shows that after polishing by the slurry of FA/O, the resistance is lower than the SVTC. After polishing by the acid slurry and FA/O alkaline slurry, the difference in capacitance is not very large. The values are 0.1 nF and 0.12 nF, respectively. The leakage current of the film polished by the slurry of FA/O is 0.01 nA, which is lower than the slurry of SVTC. The results show that the slurry of FA/O produced less dishing and oxide loss than the slurry of SVTC. (semiconductor technology)

  8. Room temperature Cu-Cu direct bonding using surface activated bonding method

    International Nuclear Information System (INIS)

    Kim, T.H.; Howlader, M.M.R.; Itoh, T.; Suga, T.

    2003-01-01

    Thin copper (Cu) films of 80 nm thickness deposited on a diffusion barrier layered 8 in. silicon wafers were directly bonded at room temperature using the surface activated bonding method. A low energy Ar ion beam of 40-100 eV was used to activate the Cu surface prior to bonding. Contacting two surface-activated wafers enables successful Cu-Cu direct bonding. The bonding process was carried out under an ultrahigh vacuum condition. No thermal annealing was required to increase the bonding strength since the bonded interface was strong enough at room temperature. The chemical constitution of the Cu surface was examined by Auger electron spectroscope. It was observed that carbon-based contaminations and native oxides on copper surface were effectively removed by Ar ion beam irradiation for 60 s without any wet cleaning processes. An atomic force microscope study shows that the Ar ion beam process causes no surface roughness degradation. Tensile test results show that high bonding strength equivalent to bulk material is achieved at room temperature. The cross-sectional transmission electron microscope observations reveal the presence of void-free bonding interface without intermediate layer at the bonded Cu surfaces

  9. Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

    Science.gov (United States)

    Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

    2018-03-01

    Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

  10. Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

    Science.gov (United States)

    Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

    2018-05-01

    Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

  11. Multilevel integration of patternable low-κ material into advanced Cu BEOL

    Science.gov (United States)

    Lin, Qinghuang; Chen, S. T.; Nelson, A.; Brock, P.; Cohen, S.; Davis, B.; Fuller, N.; Kaplan, R.; Kwong, R.; Liniger, E.; Neumayer, D.; Patel, J.; Shobha, H.; Sooriyakumaran, R.; Purushothaman, S.; Spooner, T.; Miller, R.; Allen, R.; Wisnieff, R.

    2010-04-01

    In this paper, we wish to report, for the first time, on a simple, low-cost, novel way to form dual-damascene copper (Cu) on-chip interconnect or Back-End-Of-the-Line (BEOL) structures using a patternable low dielectric constant (low-κ) dielectric material concept. A patternable low-κ dielectric material combines the functions of a traditional resist and a dielectric material into one single material. It acts as a traditional resist during patterning and is subsequently converted to a low-κ dielectric material during a post-patterning curing process. No sacrificial materials (separate resists or hardmasks) and their related deposition, pattern transfer (etch) and removal (strip) are required to form dual-damascene BEOL patterns. We have successfully demonstrated multi-level dual-damascene integration of a novel patternable low-κ dielectric material into advanced Cu BEOL. This κ=2.7 patternable low-κ material is based on the industry standard SiCOH-based (silsesquioxane polymer) material platform and is compatible with 248 nm optical lithography. Multilevel integration of this patternable low-κ material at 45 nm node Cu BEOL fatwire levels has been demonstrated with very high electrical yields using the current manufacturing infrastructure.

  12. Cu/Cu2O/CuO nanoparticles: Novel synthesis by exploding wire technique and extensive characterization

    Science.gov (United States)

    Sahai, Anshuman; Goswami, Navendu; Kaushik, S. D.; Tripathi, Shilpa

    2016-12-01

    In this article, we explore potential of Exploding Wire Technique (EWT) to synthesize the copper nanoparticles using the copper metal in a plate and wire geometry. Rietveld refinement of X-ray diffraction (XRD) pattern of prepared material indicates presence of mixed phases of copper (Cu) and copper oxide (Cu2O). Agglomerates of copper and copper oxide comprised of ∼20 nm average size nanoparticles observed through high resolution transmission electron microscope (HRTEM) and energy dispersive x-ray (EDX) spectroscopy. Micro-Raman (μR) and Fourier transform infrared (FTIR) spectroscopies of prepared nanoparticles reveal existence of additional minority CuO phase, not determined earlier through XRD and TEM analysis. μR investigations vividly reveal cubic Cu2O and monoclinic CuO phases based on the difference of space group symmetries. In good agreement with μRaman analysis, FTIR stretching modes corresponding to Cu2-O and Cu-O were also distinguished. Investigations of μR and FTIR vibrational modes are in accordance and affirm concurrence of CuO phases besides predominant Cu and Cu2O phase. Quantum confinement effects along with increase of band gaps for direct and indirect optical transitions of Cu/Cu2O/CuO nanoparticles are reflected through UV-vis (UV-vis) spectroscopy. Photoluminescence (PL) spectroscopy spots the electronic levels of each phase and optical transitions processes occurring therein. Iterative X-ray photoelectron spectroscopy (XPS) fitting of core level spectra of Cu (2p3/2) and O (1s), divulges presence of Cu2+ and Cu+ in the lattice with an interesting evidence of O deficiency in the lattice structure and surface adsorption. Magnetic analysis illustrates that the prepared nanomaterial demonstrates ferromagnetic behaviour at room temperature.

  13. The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

    International Nuclear Information System (INIS)

    Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao

    2012-01-01

    Highlights: ► Pd distribution in Pd-plated Cu wires reveals the whirlpool flow pattern of Cu. ► The mechanisms of the Cu flow behavior and Pd distribution are proposed. ► At Pd-rich phases, small voids formed and followed the direction of Cu flow. ► Nanoindentation studies show the Cu ball bond is harder in regions with Pd. - Abstract: The Pd plating on the 20 μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15 ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

  14. Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

    Science.gov (United States)

    Wu, Zijian; Cai, Jian; Wang, Junqiang; Geng, Zhiting; Wang, Qian

    2018-02-01

    Silver nanoparticles (Ag NPs) fabricated by physical vapor deposition (PVD) were introduced in Cu-Cu bonding as surface modification layer. The bonding structure consisted of a Ti adhesive/barrier layer and a Cu substrate layer was fabricated on the silicon wafer. Ag NPs were deposited on the Cu surface by magnetron sputtering in a high-pressure environment and a loose structure with NPs was obtained. Shear tests were performed after bonding, and the influences of PVD pressure, bonding pressure, bonding temperature and annealing time on shear strength were assessed. Cu-Cu bonding with Ag NPs was accomplished at 200°C for 3 min under the pressure of 30 MPa without a post-annealing process, and the average bonding strength of 13.99 MPa was reached. According to cross-sectional observations, a void-free bonding interface with an Ag film thickness of around 20 nm was achieved. These results demonstrated that a reliable low-temperature short-time Cu-Cu bonding was realized by the sintering process of Ag NPs between the bonding pairs, which indicated that this bonding method could be a potential candidate for future ultra-fine pitch 3D integration.

  15. Cu/Cu{sub 2}O/CuO nanoparticles: Novel synthesis by exploding wire technique and extensive characterization

    Energy Technology Data Exchange (ETDEWEB)

    Sahai, Anshuman [Department of Physics and Materials Science and Engineering, Jaypee Institute of Information Technology, A-10, Sector-62, Noida 201307 (India); Goswami, Navendu, E-mail: navendugoswami@gmail.com [Department of Physics and Materials Science and Engineering, Jaypee Institute of Information Technology, A-10, Sector-62, Noida 201307 (India); Kaushik, S.D. [UGC-DAE-Consortium for Scientific Research Mumbai Centre, R5 Shed, BARC, Mumbai 400085 (India); Tripathi, Shilpa [UGC-DAE Consortium for Scientific Research, Indore, M.P. (India)

    2016-12-30

    Highlights: The salient features of this research article are following: • Mixed phase synthesis of Cu/Cu{sub 2}O/CuO nanoparticles prepared by Exploding Wire Technique (EWT). • Predominant Cu/Cu{sub 2}O phases along with minor CuO phase revealed through XRD, TEM, Raman, FTIR, UV–Visible and PL analyses. • XPS analysis provided direct evidences of Cu{sup 2+} and Cu{sup +} along with O deficiency for prepared nanoparticles. • Room temperature weak ferromagnetic behaviour was demonstrated for Cu/Cu{sub 2}O/CuO nanoparticles. - Abstract: In this article, we explore potential of Exploding Wire Technique (EWT) to synthesize the copper nanoparticles using the copper metal in a plate and wire geometry. Rietveld refinement of X-ray diffraction (XRD) pattern of prepared material indicates presence of mixed phases of copper (Cu) and copper oxide (Cu{sub 2}O). Agglomerates of copper and copper oxide comprised of ∼20 nm average size nanoparticles observed through high resolution transmission electron microscope (HRTEM) and energy dispersive x-ray (EDX) spectroscopy. Micro-Raman (μR) and Fourier transform infrared (FTIR) spectroscopies of prepared nanoparticles reveal existence of additional minority CuO phase, not determined earlier through XRD and TEM analysis. μR investigations vividly reveal cubic Cu{sub 2}O and monoclinic CuO phases based on the difference of space group symmetries. In good agreement with μRaman analysis, FTIR stretching modes corresponding to Cu{sub 2}-O and Cu-O were also distinguished. Investigations of μR and FTIR vibrational modes are in accordance and affirm concurrence of CuO phases besides predominant Cu and Cu{sub 2}O phase. Quantum confinement effects along with increase of band gaps for direct and indirect optical transitions of Cu/Cu{sub 2}O/CuO nanoparticles are reflected through UV–vis (UV–vis) spectroscopy. Photoluminescence (PL) spectroscopy spots the electronic levels of each phase and optical transitions processes

  16. Influence of Cu Content on the Microstructure and Mechanical Properties of Cr-Cu-N Coatings

    Directory of Open Access Journals (Sweden)

    Ji Cheng Ding

    2018-01-01

    Full Text Available The Cr-Cu-N coatings with various Cu contents (0–25.18 (±0.17 at.% were deposited on Si wafer and stainless steel (SUS 304 substrates in reactive Ar+N2 gas mixture by a hybrid coating system combining pulsed DC and RF magnetron sputtering techniques. The influence of Cu content on the coating composition, microstructure, and mechanical properties was investigated. The microstructure of the coatings was significantly altered by the introduction of Cu. The deposited coatings exhibit solid solution structure with different compositions in all of the samples. Addition of Cu is intensively favored for preferred orientation growth along (200 direction by restricting in (111 direction. With increasing Cu content, the surface and cross-sectional morphology of coatings were changed from triangle cone-shaped, columnar feature to broccoli-like and compact glassy microstructure, respectively. The mechanical properties including the residual stress, nanohardness, and toughness of the coatings were explored on the basis of Cu content. The highest hardness was obtained at the Cu content of 1.49 (±0.10 at.%.

  17. Ab-initio atomic level stress and role of d-orbitals in CuZr, CuZn and CuY

    Science.gov (United States)

    Ojha, Madhusudan; Nicholson, Don M.; Egami, Takeshi

    2015-03-01

    Atomic level stress offers a new tool to characterize materials within the local approximation to density functional theory (DFT). Ab-initio atomic level stresses in B2 structures of CuZr, CuZn and CuY are calculated and results are explained on the basis of d-orbital contributions to Density of States (DOS). The overlap of d-orbital DOS plays an important role in the relative magnitude of atomic level stresses in these structures. The trends in atomic level stresses that we observed in these simple B2 structures are also seen in complex structures such as liquids, glasses and solid solutions. The stresses are however modified by the different coordination and relaxed separation distances in these complex structures. We used the Locally Self-Consistent Multiple Scattering (LSMS) code and Vienna Ab-initio Simulation Package (VASP) for ab-initio calculations.

  18. Microstructure, impurity and metal cap effects on Cu electromigration

    Energy Technology Data Exchange (ETDEWEB)

    Hu, C.-K.; Gignac, L. G.; Ohm, J.; Breslin, C. M.; Huang, E.; Bonilla, G.; Liniger, E.; Rosenberg, R. [IBM T. J. Watson Research Center, Yorktown Heights, NY 10598 (United States); Choi, S.; Simon, A. H. [IBM Microelectronic Division, Hopewell Junction, NY 12533 (United States)

    2014-06-19

    Electromigration (EM) lifetimes and void growth of pure Cu, Cu(Mn) alloy, and pure Cu damascene lines with a CoWP cap were measured as a function of grain structure (bamboo, near bamboo, and polycrystalline) and sample temperature. The bamboo grains in a bamboo-polycrystalline grained line play the key role in reducing Cu mass flow. The variation in Cu grain size distribution among the wafers was achieved by varying the metal line height and wafer annealing process step after electroplating Cu and before or after chemical mechanical polishing. The Cu grain size was found to have a large impact on Cu EM lifetime and activation energy, especially for the lines capped with CoWP. The EM activation energy for pure Cu with a CoWP cap from near-bamboo, bamboo-polycrystalline, mostly polycrystalline to polycrystalline only line grain structures was reduced from 2.2 ± 0.2 eV, to 1.7 ± 0.1 eV, to 1.5 ± 0.1 eV, to 0.72 ± 0.05 eV, respectively. The effect of Mn in Cu grain boundary diffusion was found to be dependent on Mn concentration in Cu. The depletion of Cu at the cathode end of the Cu(Mn) line is preceded by an incubation period. Unlike pure Cu lines with void growth at the cathode end and hillocks at the anode end of the line, the hillocks grew at a starting position roughly equal to the Blech critical length from the cathode end of the Cu(Mn) polycrystalline line. The effectiveness of Mn on Cu grain boundary migration can also be qualitatively accounted for by a simple trapping model. The free migration of Cu atoms at grain boundaries is reduced by the presence of Mn due to Cu-solute binding. A large binding energy of 0.5 ± 0.1 eV was observed.

  19. Application Of The SPV-based Surface Lifetime Technique To In-Line Monitoring Of Surface Cu Contamination

    Science.gov (United States)

    D'Amico, John; Savtchouk, Alexandre; Wilson, Matthew; Kim, Chul Hong; Yoo, Hyung Won; Lee, Chang Hwan; Kim, Tae Kyoung; Son, Sang Hoon

    2009-09-01

    Implementation of Cu interconnects into Silicon Integrated Circuits (IC's) has been instrumental in the continuing improvement of IC device performance. Copper as a well known Gate Oxide Integrity (GOI) killer [1, 2] requires extensive protocols to minimize the possibility of cross contamination. Despite such protocols the risk for cross contamination exists, and consequently there is the need for in-line Cu cross-contamination detection metrology. Preferably the metrology will be non-destructive, fast, and capable of mapping on product wafers. Up to now the most common approaches for monitoring Cu contamination in IC fabrication lines either measure Cu in the bulk Si, which is not applicable to Cu cross-contamination monitoring because Back-End-of-the-Line thermal budgets restrict the ability to diffuse the surface Cu into the bulk Si; or the techniques are not optimal for in-line monitoring due to their destructive, time-consuming, or costly nature. In this work we demonstrate for the first time the application of the ac-Surface Photo Voltage (ac-SPV) surface lifetime approach [3] to in-line, full wafer coverage mapping of low level (metrology system. Furthermore, because the metrology is non-contact (utilizing edge-grip handling) and non-destructive, it is directly applicable to measurement of production wafers. In-line fab data acquired using this metrology is presented and compared to data from Inductively Coupled Plasma Mass Spectroscopy (ICP-MS).

  20. Cu Pillar Low Temperature Bonding and Interconnection Technology of for 3D RF Microsystem

    Science.gov (United States)

    Shi, G. X.; Qian, K. Q.; Huang, M.; Yu, Y. W.; Zhu, J.

    2018-03-01

    In this paper 3D interconnects technologies used Cu pillars are discussed with respect to RF microsystem. While 2.5D Si interposer and 3D packaging seem to rely to cu pillars for the coming years, RF microsystem used the heterogeneous chip such as GaAs integration with Si interposers should be at low temperature. The pillars were constituted by Cu (2 micron) -Ni (2 micron) -Cu (3 micron) -Sn (1 micron) multilayer metal and total height is 8 micron on the front-side of the wafer by using electroplating. The wafer backside Cu pillar is obtained by temporary bonding, thinning and silicon surface etching. The RF interposers are stacked by Cu-Sn eutectic bonding at 260 °C. Analyzed the reliability of different pillar bonding structure.

  1. Low-lying isomeric levels in Cu75

    Science.gov (United States)

    Daugas, J. M.; Faul, T.; Grawe, H.; Pfützner, M.; Grzywacz, R.; Lewitowicz, M.; Achouri, N. L.; Angélique, J. C.; Baiborodin, D.; Bentida, R.; Béraud, R.; Borcea, C.; Bingham, C. R.; Catford, W. N.; Emsallem, A.; de France, G.; Grzywacz, K. L.; Lemmon, R. C.; Lopez Jimenez, M. J.; de Oliveira Santos, F.; Regan, P. H.; Rykaczewski, K.; Sauvestre, J. E.; Sawicka, M.; Stanoiu, M.; Sieja, K.; Nowacki, F.

    2010-03-01

    Isomeric low-lying states were identified and investigated in the Cu75 nucleus. Two states at 61.8(5)- and 128.3(7)-keV excitation energies with half-lives of 370(40)- and 170(15)-ns were assigned as Cu75m1 and Cu75m2, respectively. The measured half-lives combined with the recent spin assignment of the ground state allow one to deduce tentatively spin and parity of the two isomers and the dominant multipolarities of the isomeric transitions with respect to the systematics of the Cu isotopes. Shell-model calculations using an up-to-date effective interaction reproduce the evolution of the 1/2-, 3/2-, and 5/2- states for the neutron-rich odd-mass Cu isotopes when filling the νg9/2. The results indicate a significant change in the nuclear structure in this region, where a single-particle 5/2- state coexists with more and more collective 3/2- and 1/2- levels at low excitation energies.

  2. Probabilistically-Cued Patterns Trump Perfect Cues in Statistical Language Learning.

    Science.gov (United States)

    Lany, Jill; Gómez, Rebecca L

    2013-01-01

    Probabilistically-cued co-occurrence relationships between word categories are common in natural languages but difficult to acquire. For example, in English, determiner-noun and auxiliary-verb dependencies both involve co-occurrence relationships, but determiner-noun relationships are more reliably marked by correlated distributional and phonological cues, and appear to be learned more readily. We tested whether experience with co-occurrence relationships that are more reliable promotes learning those that are less reliable using an artificial language paradigm. Prior experience with deterministically-cued contingencies did not promote learning of less reliably-cued structure, nor did prior experience with relationships instantiated in the same vocabulary. In contrast, prior experience with probabilistically-cued co-occurrence relationships instantiated in different vocabulary did enhance learning. Thus, experience with co-occurrence relationships sharing underlying structure but not vocabulary may be an important factor in learning grammatical patterns. Furthermore, experience with probabilistically-cued co-occurrence relationships, despite their difficultly for naïve learners, lays an important foundation for learning novel probabilistic structure.

  3. Highly charged swelling mica reduces Cu bioavailability in Cu-contaminated soils

    Energy Technology Data Exchange (ETDEWEB)

    Stuckey, Jason W. [Department of Crop and Soil Sciences, Pennsylvania State University, 116 ASI Building, University Park, PA 16802 (United States); Neaman, Alexander [Facultad de Agronomia, P. Universidad Catolica de Valparaiso, Centro Regional de Estudios en Alimentos Saludables (Chile); Ravella, Ramesh; Komarneni, Sridhar [Department of Crop and Soil Sciences, Pennsylvania State University, 116 ASI Building, University Park, PA 16802 (United States); Martinez, Carmen Enid [Department of Crop and Soil Sciences, Pennsylvania State University, 116 ASI Building, University Park, PA 16802 (United States)], E-mail: cem17@psu.edu

    2009-01-15

    This is the first test of a highly charged swelling mica's (Na-2-mica) ability to reduce the plant-absorbed Cu in Cu-contaminated soils from Chile. Perennial ryegrass (Lolium perenne L.) was grown in two acid soils (Sector 2: pH 4.2, total Cu = 172 mg Cu kg{sup -1} and Sector 3: pH 4.2, total Cu = 112 mg Cu kg{sup -1}) amended with 0.5% and 1% (w/w) mica, and 1% (w/w) montmorillonite. At 10 weeks of growth, both mica treatments decreased the shoot Cu of ryegrass grown in Sector 2 producing shoot Cu concentrations above 21-22 mg Cu kg{sup -1} (the phytotoxicity threshold for that species), yet the mica treatments did not reduce shoot Cu concentrations when grown in Sector 3, which were at a typical level. The mica treatments improved shoot growth in Sector 3 by reducing free and extractable Cu to low enough levels where other nutrients could compete for plant absorption and translocation. In addition, the mica treatments improved root growth in both soils, and the 1% mica treatment reduced root Cu in both soils. This swelling mica warrants further testing of its ability to assist re-vegetation and reduce Cu bioavailability in Cu-contaminated surface soils. - In situ remediation of Cu-contaminated soils with a synthetic mica (Na-2-mica) will aid in re-vegetative efforts.

  4. ChloroMitoCU: Codon patterns across organelle genomes for functional genomics and evolutionary applications.

    Science.gov (United States)

    Sablok, Gaurav; Chen, Ting-Wen; Lee, Chi-Ching; Yang, Chi; Gan, Ruei-Chi; Wegrzyn, Jill L; Porta, Nicola L; Nayak, Kinshuk C; Huang, Po-Jung; Varotto, Claudio; Tang, Petrus

    2017-06-01

    Organelle genomes are widely thought to have arisen from reduction events involving cyanobacterial and archaeal genomes, in the case of chloroplasts, or α-proteobacterial genomes, in the case of mitochondria. Heterogeneity in base composition and codon preference has long been the subject of investigation of topics ranging from phylogenetic distortion to the design of overexpression cassettes for transgenic expression. From the overexpression point of view, it is critical to systematically analyze the codon usage patterns of the organelle genomes. In light of the importance of codon usage patterns in the development of hyper-expression organelle transgenics, we present ChloroMitoCU, the first-ever curated, web-based reference catalog of the codon usage patterns in organelle genomes. ChloroMitoCU contains the pre-compiled codon usage patterns of 328 chloroplast genomes (29,960 CDS) and 3,502 mitochondrial genomes (49,066 CDS), enabling genome-wide exploration and comparative analysis of codon usage patterns across species. ChloroMitoCU allows the phylogenetic comparison of codon usage patterns across organelle genomes, the prediction of codon usage patterns based on user-submitted transcripts or assembled organelle genes, and comparative analysis with the pre-compiled patterns across species of interest. ChloroMitoCU can increase our understanding of the biased patterns of codon usage in organelle genomes across multiple clades. ChloroMitoCU can be accessed at: http://chloromitocu.cgu.edu.tw/. © The Author 2017. Published by Oxford University Press on behalf of Kazusa DNA Research Institute.

  5. Physical mechanisms of copper-copper wafer bonding

    International Nuclear Information System (INIS)

    Rebhan, B.; Hingerl, K.

    2015-01-01

    The study of the physical mechanisms driving Cu-Cu wafer bonding allowed for reducing the bonding temperatures below 200 °C. Metal thermo-compression Cu-Cu wafer bonding results obtained at such low temperatures are very encouraging and suggest that the process is possible even at room temperature if some boundary conditions are fulfilled. Sputtered (PVD) and electroplated Cu thin layers were investigated, and the analysis of both metallization techniques demonstrated the importance of decreasing Cu surface roughness. For an equal surface roughness, the bonding temperature of PVD Cu wafers could be even further reduced due to the favorable microstructure. Their smaller grain size enhances the length of the grain boundaries (observed on the surface prior bonding), acting as efficient mass transfer channels across the interface, and hence the grains are able to grow over the initial bonding interface. Due to the higher concentration of random high-angle grain boundaries, this effect is intensified. The model presented is explaining the microstructural changes based on atomic migration, taking into account that the reduction of the grain boundary area is the major driving force to reduce the Gibbs free energy, and predicts the subsequent microstructure evolution (grain growth) during thermal annealing

  6. Doping mechanism in pure CuInSe{sub 2}

    Energy Technology Data Exchange (ETDEWEB)

    Werner, F.; Colombara, D.; Melchiorre, M.; Spindler, C.; Siebentritt, S. [Physics and Materials Science Research Unit, University of Luxembourg, Rue du Brill 41, L-4422 Belvaux (Luxembourg); Valle, N.; El Adib, B. [Materials Research and Technology Department, Luxembourg Institute of Science and Technology, Rue du Brill 41, L-4422 Belvaux (Luxembourg)

    2016-05-07

    We investigate the dopant concentration and majority carrier mobility in epitaxial CuInSe{sub 2} thin films for different copper-to-indium ratios and selenium excess during growth. We find that all copper-poor samples are n-type, and that hopping conduction in a shallow donor state plays a significant role for carrier transport. Annealing in sodium ambient enhances gallium in-diffusion from the substrate wafer and changes the net doping of the previously n-type samples to p-type. We suggest that sodium incorporation from the glass might be responsible for the observed p-type doping in polycrystalline Cu-poor CuInSe{sub 2} solar cell absorbers.

  7. Stress Dispersed Cu Metal Anode by Laser Multiscale Patterning for Lithium-Ion Batteries with High Capacity

    Directory of Open Access Journals (Sweden)

    Jin-Young So

    2018-06-01

    Full Text Available Electric power production continues to increase as the industry advances, and the demand for high-capacity batteries for efficient operation of the electric power produced is higher than ever before. Si has been attracting a great deal of attention recently as an anode electrode material because of its high theoretical capacity. However, it suffers from significant capacity-loss, resulting from the volume-expansion of Si during charge and discharge cycles. Inspired by the multiscale structures commonly found in nature, we attempt to solve this problem by patterning the surface of the Cu current-collector. To this end, we develop a direct, one-step method using laser patterning to manufacture a multiscale structure on the surface of the current-collector. The inherent exfoliation characteristic of the Cu current-collector allows the spontaneous formation of the multiscale structure while being irradiated with a laser. A micro/nano structure, with a different surface area, is fabricated by varying the laser output at three levels, and the batteries prepared with the fabricated Cu current-collector are tested to evaluate their charge-discharge characteristics and electrochemical impedance. The results show that the multiscale structure reduces mechanical stress. The initial capacity of the Cu current-collector is proportional to the laser output, and the initial capacity of the coin cell prepared with the Cu current-collector, fabricated at the highest laser output, is 396.7% higher than that of the coin cell prepared with a bare Cu current-collector. The impedance is inversely proportional to the laser output. The charge transfer resistance of the coin cell prepared with the Cu current-collector and irradiated with the highest laser output is 190.2% lower than that of the coin cell prepared with the bare Cu current-collector.

  8. Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering.

    Science.gov (United States)

    Wang, Byung-Yong; Yoo, Tae-Hee; Song, Yong-Won; Lim, Dae-Soon; Oh, Young-Jei

    2013-05-22

    Direct printing techniques that utilize nanoparticles to mitigate environmental pollution and reduce the processing time of the routing and formation of electrodes have received much attention lately. In particular, copper (Cu) nanoink using Cu nanoparticles offers high conductivity and can be prepared at low cost. However, it is difficult to produce homogeneous nanoparticles and ensure good dispersion within the ink. Moreover, Cu particles require a sintering process over an extended time at a high temperature due to high melting temperature of Cu. During this process, the nanoparticles oxidize quickly in air. To address these problems, the authors developed a Cu ion ink that is free of Cu particles or any other impurities. It consequently does not require separate dispersion stability. In addition, the developed ink is environmentally friendly and can be sintered even at low temperatures. The Cu ion ink was sintered on a flexible substrate using intense pulsed light (IPL), which facilitates large-area, high-speed calcination at room temperature and at atmospheric pressures. As the applied light energy increases, the Cu2O phase diminishes, leaving only the Cu phase. This is attributed to the influence of formic acid (HCOOH) on the Cu ion ink. Only the Cu phase was observed above 40 J cm(-2). The Cu-patterned film after sintering showed outstanding electrical resistivity in a range of 3.21-5.27 μΩ·cm at an IPL energy of 40-60 J cm(-2). A spiral-type micropattern with a line width of 160 μm on a PI substrate was formed without line bulges or coffee ring effects. The electrical resistivity was 5.27 μΩ·cm at an energy level of 40.6 J cm(-2).

  9. Wafer-level hermetic vacuum packaging by bonding with a copper-tin thin film sealing ring

    Science.gov (United States)

    Akashi, Teruhisa; Funabashi, Hirofumi; Takagi, Hideki; Omura, Yoshiteru; Hata, Yoshiyuki

    2018-04-01

    A wafer-level hermetic vacuum packaging technology intended for use with MEMS devices was developed based on a copper-tin (CuSn) thin film sealing ring. To allow hermetic packaging, the shear strength of the CuSn thin film bond was improved by optimizing the pretreatment conditions. As a result, an average shear strength of 72.3 MPa was obtained and a cavity that had been hermetically sealed using wafer-level packaging (WLP) maintained its vacuum for 1.84 years. The total pressures in the cavities and the partial pressures of residual gases were directly determined with an ultra-low outgassing residual gas analyzer (RGA) system. Hermeticity was evaluated based on helium leak rates, which were calculated from helium pressures determined with the RGA system. The resulting data showed that a vacuum cavity following 1.84 years storage had a total pressure of 83.1 Pa, contained argon as the main residual gas and exhibited a helium leak rate as low as 1.67  ×  10-17 Pa · m3 s-1, corresponding to an air leak rate of 6.19  ×  10-18 Pa · m3 s-1. The RGA data demonstrate that WLP using a CuSn thin film sealing ring permits ultra-high hermeticity in conjunction with long-term vacuum packaging that is applicable to MEMS devices.

  10. Oxidative fabrication of patterned, large, non-flaking CuO nanowire arrays

    International Nuclear Information System (INIS)

    Mumm, F; Sikorski, P

    2011-01-01

    We report a simple and fast approach to fabricate large, non-flaking arrays of CuO nanowires by oxidizing thin copper substrates in air. Oxidative CuO nanowire growth is commonly accompanied by oxide layer flaking due to stress at the copper-copper oxide interface. Using thin substrates is shown to prevent this flaking by introducing favourable material thickness ratios in the samples after oxidation. Additionally, thin foils allow larger scale topographic patterns to be transferred from an underlying mould to realize non-flat, nanowire-decorated surfaces. Further patterning is possible by electrodeposition of a nickel layer, which restricts nanowire growth to specific areas of the sample.

  11. Colloidal synthesis of Cu-ZnO and Cu@CuNi-ZnO hybrid nanocrystals with controlled morphologies and multifunctional properties

    Science.gov (United States)

    Zeng, Deqian; Gong, Pingyun; Chen, Yuanzhi; Zhang, Qinfu; Xie, Qingshui; Peng, Dong-Liang

    2016-06-01

    . The utilization of low-cost non-noble metals to construct novel metal-semiconductor hybrid nanocrystals is important and meaningful for their large-scale applications. In this study, a facile solution approach is developed for the synthesis of Cu-ZnO hybrid nanocrystals with well-controlled morphologies, including nanomultipods, core-shell nanoparticles, nanopyramids and core-shell nanowires. In the synthetic strategy, Cu nanocrystals formed in situ serve as seeds for the heterogeneous nucleation and growth of ZnO, and it eventually forms various Cu-ZnO hetero-nanostructures under different reaction conditions. These hybrid nanocrystals possess well-defined and stable heterostructure junctions. The ultraviolet-visible-near infrared spectra reveal morphology-dependent surface plasmon resonance absorption of Cu and the band gap absorption of ZnO. Furthermore, we construct a novel Cu@CuNi-ZnO ternary hetero-nanostructure by incorporating the magnetic metal Ni into the pre-synthesized colloidal Cu nanocrystals. Such hybrid nanocrystals possess a magnetic Cu-Ni intermediate layer between the ZnO shell and the Cu core, and exhibit ferromagnetic/superparamagnetic properties which expand their functionalities. Finally, enhanced photocatalytic activities are observed in the as-prepared non-noble metal-ZnO hybrid nanocrystals. This study not only provides an economical way to prepare high-quality morphology-controlled Cu-ZnO hybrid nanocrystals for potential applications in the fields of photocatalysis and photovoltaic devices, but also opens up new opportunities in designing ternary non-noble metal-semiconductor hybrid nanocrystals with multifunctionalities. Electronic supplementary information (ESI) available: Synthesis and TEM images of pure ZnO nanocrystals. Photocatalytic testing procedures and degradation curves. SEM and TEM images, SAED pattern and EDS spectra and maps of parts of Cu-ZnO hybrid samples. A schematic image of coincident lattice matching between Cu and Zn

  12. Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

    Science.gov (United States)

    Hsu, Kuo-Chung; Perng, Dung-Ching; Yeh, Jia-Bin; Wang, Yi-Chun

    2012-07-01

    A 5 nm thick Cr added Ru film has been extensively investigated as a seedless Cu diffusion barrier. High-resolution transmission electron microscopy micrograph, X-ray diffraction (XRD) pattern and Fourier transform-electron diffraction pattern reveal that a Cr contained Ru (RuCr) film has a glassy microstructure and is an amorphous-like film. XRD patterns and sheet resistance data show that the RuCr film is stable up to 650 °C, which is approximately a 200 °C improvement in thermal stability as compared to that of the pure Ru film. X-ray photoelectron spectroscopy depth profiles show that the RuCr film can successfully block Cu diffusion, even after a 30-min 650 °C annealing. The leakage current of the Cu/5 nm RuCr/porous SiOCH/Si stacked structure is about two orders of magnitude lower than that of a pristine Ru sample for electric field below 1 MV/cm. The RuCr film can be a promising Cu diffusion barrier for advanced Cu metallization.

  13. Simulation and experimental determination of the macro-scale layer thickness distribution of electrodeposited Cu-line patterns on a wafer substrate

    DEFF Research Database (Denmark)

    Pantleon, Karen; Bossche, Bart van den; Purcar, Marius

    2005-01-01

    The impact of adjacent patterned zones with different active area densities on the current density and electrodeposited layer thickness distribution over a wafer substrate is examined, both by experiment and numerical simulation. The experiments consist in running an acid copper plating process o......) approach to compute the current density distribution over the electrodes. Experimental and computed layer thickness distributions are in very good agreement.......The impact of adjacent patterned zones with different active area densities on the current density and electrodeposited layer thickness distribution over a wafer substrate is examined, both by experiment and numerical simulation. The experiments consist in running an acid copper plating process...... on the patterned wafer, and layer thickness measurements by means of X-ray fluorescence (XRF) and atomic force microscopy (AFM). The simulations are based on a potential model approach taking into account electrolyte ohmic drop and electrode polarization effects, combined to a boundary element method (BEM...

  14. Deuterium transport in Cu, CuCrZr, and Cu/Be

    Science.gov (United States)

    Anderl, R. A.; Hankins, M. R.; Longhurst, G. R.; Pawelko, R. J.

    This paper presents the results of deuterium implantation/permeation experiments and TMAP4 simulations for a CuCrZr alloy, for OFHC-Cu and for a Cu/Be bi-layered structure at temperatures from 700 to 800 K. Experiments used a mass-analyzed, 3-keV D 3+ ion beam with particle flux densities of 5 × 10 19 to 7 × 10 19 D/m 2 s. Effective diffusivities and surface molecular recombination coefficients were derived giving Arrhenius pre-exponentials and activation energies for each material: CuCrZr alloy, (2.0 × 10 -2 m 2/s, 1.2 eV) for diffusivity and (2.9 × x10 -14 m 4/s, 1.92 eV) for surface molecular recombination coefficients; OFHC Cu, (2.1 × 10 -6 m 2/s, 0.52 eV) for diffusivity and (9.1 × 10 -18 m 4/s, 0.99 eV) for surface molecular recombination coefficients. TMAP4 simulation of permeation data measured for a Cu/Be bi-layer sample was achieved using a four-layer structure (Cu/BeO interface/Be/BeO back surface) and recommended values for diffusivity and solubility in Be, BeO and Cu.

  15. Thermochemical properties of oxides in Y-Ba-Cu-O, Sr-Bi-O, Cu-Nb-O, Sr-Cu-O, Ca-Cu-O, Cu-O and Hg-Ba-Ca-Cu-O systems

    International Nuclear Information System (INIS)

    Moiseev, G.K.; Vatolin, N.A.; Il'inykh, N.I.

    2000-01-01

    Thermochemical properties (ΔH 0 298 , S 0 298 , H 0 298 -H 0 0 , C p (T), C p at T>T melt ) of complex oxides in Y-Ba-Cu-O, Sr-Bi-O, Cu-Nb-O, Sr-Cu-O, Ca-Cu-O, Cu-O and Hg-Ba-Ca-Cu-O systems obtained with application of calculation methods are presented. Nonexperimental methods of estimation, revision and correction of standard formation enthalpies of inorganic compounds are described [ru

  16. Benzotriazole removal on post-Cu CMP cleaning

    International Nuclear Information System (INIS)

    Tang Jiying; Liu Yuling; Sun Ming; Fan Shiyan; Li Yan

    2015-01-01

    This work investigates systematically the effect of FA/O II chelating agent and FA/O I surfactant in alkaline cleaning solutions on benzotriazole (BTA) removal during post-Cu CMP cleaning in GLSI under the condition of static etching. The best detergent formulation for BTA removal can be determined by optimization of the experiments of single factor and compound cleaning solution, which has been further confirmed experimentally by contact angle (CA) measurements. The resulting solution with the best formulation has been measured for the actual production line, and the results demonstrate that the obtained cleaning solution can effectively and efficiently remove BTA, CuO and abrasive SiO 2 without basically causing interfacial corrosion. This work demonstrates the possibility of developing a simple, low-cost and environmentally-friendly cleaning solution to effectively solve the issues of BTA removal on post-Cu CMP cleaning in a multi-layered copper wafer. (paper)

  17. Deep-level transient spectroscopy of TiO2/CuInS2 heterojunctions

    NARCIS (Netherlands)

    Nanu, M.; Boulch, F.; Schoonman, J.; Goossens, A.

    2005-01-01

    Deep-level transient spectroscopy (DLTS) has been used to measure the concentration and energy position of deep electronic states in CuInS2. Flat TiO2?CuInS2 heterojunctions as well as TiO2-CuInS2 nanocomposites have been investigated. Subband-gap electronic states in CuInS2 films are mostly due to

  18. A TEM study of D+-implanted Cu following Ar+-ion milling: Microstructure and epitaxial Cu2O formation

    International Nuclear Information System (INIS)

    Johnson, P.B.; Corfiatis, T.; Long, N.J.; Nelson, D.G.A.; Victoria Univ., Wellington; Thomson, R.W.

    1988-01-01

    In examining the microstructure of TEM specimens prepared from D + -implanted Cu for the presence of bubbles it was found that cuprous oxide (Cu 2 O) layers had formed over large areas of the specimen surfaces. The Cu was irradiated at normal incidence with 200 keV D + ions at a temperature of 120 K to a dose of ≅ 2x10 21 D + /m 2 . Ar + ion milling at 330 K was used to erode irradiated surfaces to various depths prior to chemical back-thinning in a jet electropolishing bath. There was no evidence for the formation in the Cu of bubbles of either deuterium or argon, but dislocations at high density and planar defects were evident. Lattice fringes from {110}, {111} and {200} planes in Cu 2 O and moire patterns formed by double diffraction in the Cu and overlaid Cu 2 O film were obvious features in bright-field micrographs. The moire patterns include examples of magnified images of lattice defects. (orig.)

  19. Compositional ratio effect on the surface characteristics of CuZn thin films

    Science.gov (United States)

    Choi, Ahrom; Park, Juyun; Kang, Yujin; Lee, Seokhee; Kang, Yong-Cheol

    2018-05-01

    CuZn thin films were fabricated by RF co-sputtering method on p-type Si(100) wafer with various RF powers applied on metallic Cu and Zn targets. This paper aimed to determine the morphological, chemical, and electrical properties of the deposited CuZn thin films by utilizing a surface profiler, atomic force microscopy (AFM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), UV photoelectron spectroscopy (UPS), and a 4-point probe. The thickness of the thin films was fixed at 200 ± 8 nm and the roughness of the thin films containing Cu was smaller than pure Zn thin films. XRD studies confirmed that the preferred phase changed, and this tendency is dependent on the ratio of Cu to Zn. AES spectra indicate that the obtained thin films consisted of Cu and Zn. The high resolution XPS spectra indicate that as the content of Cu increased, the intensities of Zn2+ decreased. The work function of CuZn thin films increased from 4.87 to 5.36 eV. The conductivity of CuZn alloy thin films was higher than pure metallic thin films.

  20. Graphitized silicon carbide microbeams: wafer-level, self-aligned graphene on silicon wafers

    International Nuclear Information System (INIS)

    Cunning, Benjamin V; Ahmed, Mohsin; Mishra, Neeraj; Kermany, Atieh Ranjbar; Iacopi, Francesca; Wood, Barry

    2014-01-01

    Currently proven methods that are used to obtain devices with high-quality graphene on silicon wafers involve the transfer of graphene flakes from a growth substrate, resulting in fundamental limitations for large-scale device fabrication. Moreover, the complex three-dimensional structures of interest for microelectromechanical and nanoelectromechanical systems are hardly compatible with such transfer processes. Here, we introduce a methodology for obtaining thousands of microbeams, made of graphitized silicon carbide on silicon, through a site-selective and wafer-scale approach. A Ni-Cu alloy catalyst mediates a self-aligned graphitization on prepatterned SiC microstructures at a temperature that is compatible with silicon technologies. The graphene nanocoating leads to a dramatically enhanced electrical conductivity, which elevates this approach to an ideal method for the replacement of conductive metal films in silicon carbide-based MEMS and NEMS devices. (paper)

  1. Benzotriazole removal on post-Cu CMP cleaning

    Science.gov (United States)

    Jiying, Tang; Yuling, Liu; Ming, Sun; Shiyan, Fan; Yan, Li

    2015-06-01

    This work investigates systematically the effect of FA/O II chelating agent and FA/O I surfactant in alkaline cleaning solutions on benzotriazole (BTA) removal during post-Cu CMP cleaning in GLSI under the condition of static etching. The best detergent formulation for BTA removal can be determined by optimization of the experiments of single factor and compound cleaning solution, which has been further confirmed experimentally by contact angle (CA) measurements. The resulting solution with the best formulation has been measured for the actual production line, and the results demonstrate that the obtained cleaning solution can effectively and efficiently remove BTA, CuO and abrasive SiO2 without basically causing interfacial corrosion. This work demonstrates the possibility of developing a simple, low-cost and environmentally-friendly cleaning solution to effectively solve the issues of BTA removal on post-Cu CMP cleaning in a multi-layered copper wafer. Project supported by the Major National Science and Technology Special Projects (No. 2009ZX02308).

  2. Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures

    International Nuclear Information System (INIS)

    Horváth, Barbara; Illés, Balázs; Shinohara, Tadashi

    2014-01-01

    Intermetallic growth mechanisms and rates are investigated in Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layer systems. An 8–10 μm thick Sn surface finish layer was electroplated onto a Cu substrate with a 1.5–2 μm thick Ni or Ag barrier layer. In order to induce intermetallic layer growth, the samples were aged in elevated temperatures: 50 °C and 125 °C. Intermetallic layer growth was checked by focused ion beam–scanning ion microscope. The microstructures and chemical compositions of the intermetallic layers were observed with a transmission electron microscope. It has been found that Ni barrier layers can effectively block the development of Cu 6 Sn 5 intermetallics. The intermetallic growth characteristics in the Sn/Cu and Sn/Ni/Cu systems are very similar. The intermetallic layer grows towards the Sn layer and forms a discrete layer. Differences were observed only in the growth gradients and surface roughness of the intermetallic layer which may explain the different tin whiskering properties. It was observed that the intermetallic layer growth mechanisms are completely different in the Ag barrier layers compared to the Ni layers. In the case of Sn/Ag/Cu systems, the Sn and Cu diffused through the Ag layer, formed Cu 6 Sn 5 intermetallics mainly at the Sn/Ag interface and consumed the Ag barrier layer. - Highlights: • Intermetallic growth was characterised in Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layer systems. • Intermetallic growth rates and roughness are similar in the Sn/Cu and Sn/Ni/Cu systems. • Sn/Ni/Cu system contains the following intermetallic layer structure Sn–Ni3Sn4–Ni3Sn2–Ni3Sn–Ni. • In the case of Sn/Ag/Cu systems the Sn and Cu diffusion consumes the Ag barrier layer. • When Cu reaches the Sn/Ag interface a large amount of Cu 6 Sn 5 forms above the Ag layer

  3. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    OpenAIRE

    Zhuhao Gong; Yulong Zhang; Xin Guo; Zewen Liu

    2018-01-01

    A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to gener...

  4. CuO reduction induced formation of CuO/Cu2O hybrid oxides

    Science.gov (United States)

    Yuan, Lu; Yin, Qiyue; Wang, Yiqian; Zhou, Guangwen

    2013-12-01

    Reduction of CuO nanowires results in the formation of a unique hierarchical hybrid nanostructure, in which the parent oxide phase (CuO) works as the skeleton while the lower oxide (Cu2O) resulting from the reduction reaction forms as partially embedded nanoparticles that decorate the skeleton of the parent oxide. Using in situ transmission electron microscopy observations of the reduction process of CuO nanowires, we demonstrate that the formation of such a hierarchical hybrid oxide structure is induced by topotactic nucleation and growth of Cu2O islands on the parent CuO nanowires.

  5. Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections

    NARCIS (Netherlands)

    Wierzbicka-Miernik, A.; Wojewoda-Budka, J.; Litynska-Dobrzynska, L.; Kodentsov, A.; Zieba, P.

    2012-01-01

    In the present paper, scanning and transmission electron microscopies as well as energy dispersive X-ray spectroscopy investigations were performed to describe the morphology and chemical composition of the intermetallic phases growing in Cu/Sn/Cu and Cu(Ni)/Sn/Cu(Ni) interconnections during the

  6. Cu-capped surface alloys of Pt/Cu left brace 100 right brace

    CERN Document Server

    Alshamaileh, E; Wander, A

    2003-01-01

    The room-temperature deposition of 0.5 monolayer (ML) Pt on Cu left brace 100 right brace followed by annealing to 525 K results in a sharp c(2 x 2) low-energy electron diffraction (LEED) pattern. The structure of this surface alloy is investigated by means of symmetrized automated tensor low-energy electron diffraction (SATLEED) analysis and ab initio plane wave density functional calculations. The results are then compared with those for the similar system 0.5 ML Pd/Cu left brace 100 right brace. SATLEED results for the Pt/Cu left brace 100 right brace show that it consists of an ordered c(2 x 2) Cu-Pt second layer alloy capped with a pure Cu first layer. The first and second interlayer spacings are found to be expanded by +5.1 +- 1.7 and +3.5 +- 1.7% respectively (relative to the bulk Cu interlayer spacing of 1.807 A) due to the insertion of the 8% larger Pt atoms into the second layer. The ordered mixed layer is found to be rippled by 0.08 +- 0.06 A with Pt atoms rippled outwards towards the solid-vacuum ...

  7. Synthesis, Characterization and Catalytic Activity of Cu/Cu2O Nanoparticles Prepared in Aqueous Medium

    Directory of Open Access Journals (Sweden)

    Sayed M. Badawy

    2015-07-01

    Full Text Available Copper/Copper oxide (Cu/Cu2O nanoparticles were synthesized by modified chemical reduction method in an aqueous medium using hydrazine as reducing agent and copper sulfate pentahydrate as precursor. The Cu/Cu2O nanoparticles were characterized by X-ray Diffraction (XRD, Energy Dispersive X-ray Fluorescence (EDXRF, Scanning Electron Microscope (SEM, and Transmission Electron Microscope (TEM. The analysis revealed the pattern of face-centered cubic (fcc crystal structure of copper Cu metal and cubic cuprites structure for Cu2O. The SEM result showed monodispersed and agglomerated particles with two micron sizes of about 180 nm and 800 nm, respectively. The TEM result showed few single crystal particles of face-centered cubic structures with average particle size about 11-14 nm. The catalytic activity of Cu/Cu2O nanoparticles for the decomposition of hydrogen peroxide was investigated and compared with manganese oxide MnO2. The results showed that the second-order equation provides the best correlation for the catalytic decomposition of H2O2 on Cu/Cu2O. The catalytic activity of hydrogen peroxide by Cu/Cu2O is less than the catalytic activity of MnO2 due to the presence of copper metal Cu with cuprous oxide Cu2O. © 2015 BCREC UNDIP. All rights reservedReceived: 6th January 2015; Revised: 14th March 2015; Accepted: 15th March 2015How to Cite: Badawy, S.M., El-Khashab, R.A., Nayl, A.A. (2015. Synthesis, Characterization and Catalytic Activity of Cu/Cu2O Nanoparticles Prepared in Aqueous Medium. Bulletin of Chemical Reaction Engineering & Catalysis, 10 (2: 169-174. (doi:10.9767/bcrec.10.2.7984.169-174 Permalink/DOI: http://dx.doi.org/10.9767/bcrec.10.2.7984.169-174  

  8. IR and TPD studies of the interaction of alkenes with Cu + sites in CuNaY and CuNaX zeolites of various Cu content. The heterogeneity of Cu + sites

    Science.gov (United States)

    Datka, J.; Kukulska-Zajaç, E.; Kozyra, P.

    2006-08-01

    Cu + ions in zeolites activate organic molecules containing π electrons by π back donation, which results in a distinct weakening of multiple bonds. In this study, we followed the activation of alkenes (ethene and propene) by Cu + ions in CuY and CuX zeolites of various Cu content. We also studied the strength of bonding of alkenes to Cu + ions. IR studies have shown that there are two kinds of Cu + sites of various electron donor properties. We suppose that they could be attributed to the presence of Cu + ions of various number of oxygen atoms surrounding the cation. IR studies have shown that Cu ions introduced into Y and X zeolites in the first-order (at low Cu content) form Cu + ions of stronger electron donor properties (i.e. activate alkenes to larger extend) than Cu ions introduced in the next order (at higher Cu content). IR and TPD studies of alkenes desorption evidenced that Cu + ions of stronger electron donor properties bond alkenes stronger than less electron donor ones. It suggests that π back donation has more important contribution to the strength of bonding alkenes to cation than π donation.

  9. Porous HKUST-1 derived CuO/Cu2O shell wrapped Cu(OH)2 derived CuO/Cu2O core nanowire arrays for electrochemical nonenzymatic glucose sensors with ultrahigh sensitivity

    Science.gov (United States)

    Yu, Cuiping; Cui, Jiewu; Wang, Yan; Zheng, Hongmei; Zhang, Jianfang; Shu, Xia; Liu, Jiaqin; Zhang, Yong; Wu, Yucheng

    2018-05-01

    Self-supported CuO/Cu2O@CuO/Cu2O core-shell nanowire arrays (NWAs) are successfully fabricated by a simple and efficient method in this paper. Anodized Cu(OH)2 NWAs could in-situ convert to HKUST-1 at room temperature easily. Cu(OH)2 NWAs cores and HKUST-1 shells transform into CuO/Cu2O simultaneously after calcinations and form CuO/Cu2O@CuO/Cu2O core-shell NWAs. This smart configuration of the core-shell structure not only avoids the agglomeration of the traditional MOF-derived materials in particle-shape, but also facilitates the ion diffusion and increases the active sites. This novel structure is employed as substrate to construct nonenzymatic glucose sensors. The results indicate that glucose sensor based on CuO/Cu2O@CuO/Cu2O core-shell NWAs presents ultrahigh sensitivity (10,090 μA mM-1 cm-2), low detection limit (0.48 μM) and wide linear range (0.99-1,330 μM). In addition, it also shows excellent anti-interference ability toward uric acid, ascorbic acid and L-Cysteine co-existing with glucose, good reproducibility and superior ability of real sample analysis.

  10. Effects of plasma cleaning of the Cu seed layer surface on Cu electroplating

    International Nuclear Information System (INIS)

    O, Jun Hwan; Lee, Seong Wook; Kim, Jae Bum; Lee, Chong Mu

    2001-01-01

    Effects of plasma pretreatment to Cu seed/tantalum nitride (TaN)/ borophosphosilicate glass (BPSG) samples on copper (Cu) electroplating were investigated. Copper seed layers were deposited by magnetron sputtering onto tantalum nitride barrier layers before electroplating copper in the forward pulsed mode. The Cu seed layer was cleaned by plasma H 2 and N 2 prior to electroplating a copper film. Cu films electroplated on the copper seed layer with plasma pretreatment showed better electrical and physical properties such as electrical resistivities, surface morphologies, levels of impurities, adhesion and surface roughness than those without plasma pretreatment. It is shown that carbon and metal oxide contaminants at the sputtered Cu seed/TaN surface could be effectively removed by plasma H 2 cleaning. The degree of the (111) prefered orientation of the Cu film with plasma H 2 pretreatment is as high as pulse plated Cu film without plasma pretreatment. Also, plasma H 2 precleaning is more effective in enhancing the Cu electroplating properties onto the Cu seed layer than plasma N 2 precleaning

  11. Comparative study of Cu-Zr and Cu-Ru alloy films for barrier-free Cu metallization

    International Nuclear Information System (INIS)

    Wang Ying; Cao Fei; Zhang Milin; Liu Yuntao

    2011-01-01

    The properties of Cu-Zr and Cu-Ru alloy films were comparatively studied to evaluate their potential use as alloying elements. Cu alloy films were deposited on SiO 2 /Si substrates by magnetron sputtering. Samples were subsequently annealed and analyzed by four-point probe measurement, X-ray diffraction, X-ray photoelectron spectroscopy, transmission electron microscopy and Auger electron spectroscopy. X-ray diffraction data suggest that Cu film has preferential (111) crystal orientation and no extra peak corresponding to any compound of Cu, Zr, Ru, and Si. According to transmission electron microscopy results, Cu grains grow in size for both systems but the grain sizes of the Cu alloy films are smaller than that of pure Cu films. These results indicate that Cu-Zr film is suitable for advanced barrier-free metallization in terms of interfacial stability and lower resistivity.

  12. CH{sub 4} dehydrogenation on Cu(1 1 1), Cu@Cu(1 1 1), Rh@Cu(1 1 1) and RhCu(1 1 1) surfaces: A comparison studies of catalytic activity

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Riguang; Duan, Tian [Key Laboratory of Coal Science and Technology of Ministry of Education and Shanxi Province, Taiyuan University of Technology, Taiyuan 030024, Shanxi (China); Ling, Lixia [Key Laboratory of Coal Science and Technology of Ministry of Education and Shanxi Province, Taiyuan University of Technology, Taiyuan 030024, Shanxi (China); Research Institute of Special Chemicals, Taiyuan University of Technology, Taiyuan 030024, Shanxi (China); Wang, Baojun, E-mail: wangbaojun@tyut.edu.cn [Key Laboratory of Coal Science and Technology of Ministry of Education and Shanxi Province, Taiyuan University of Technology, Taiyuan 030024, Shanxi (China)

    2015-06-30

    Highlights: • Adsorbed Rh atom on Cu catalyst exhibits better catalytic activity for CH{sub 4} dehydrogenation. • The adsorbed Rh atom is the reaction active center for CH{sub 4} dehydrogenation. • The morphology of Cu substrate has negligible effect on CH{sub 4} dehydrogenation. - Abstract: In the CVD growth of graphene, the reaction barriers of the dehydrogenation for hydrocarbon molecules directly decide the graphene CVD growth temperature. In this study, density functional theory method has been employed to comparatively probe into CH{sub 4} dehydrogenation on four types of Cu(1 1 1) surface, including the flat Cu(1 1 1) surface (labeled as Cu(1 1 1)) and the Cu(1 1 1) surface with one surface Cu atom substituted by one Rh atom (labeled as RhCu(1 1 1)), as well as the Cu(1 1 1) surface with one Cu or Rh adatom (labeled as Cu@Cu(1 1 1) and Rh@Cu(1 1 1), respectively). Our results show that the highest barrier of the whole CH{sub 4} dehydrogenation process is remarkably reduced from 448.7 and 418.4 kJ mol{sup −1} on the flat Cu(1 1 1) and Cu@Cu(1 1 1) surfaces to 258.9 kJ mol{sup −1} on RhCu(1 1 1) surface, and to 180.0 kJ mol{sup −1} on Rh@Cu(1 1 1) surface, indicating that the adsorbed or substituted Rh atom on Cu catalyst can exhibit better catalytic activity for CH{sub 4} complete dehydrogenation; meanwhile, since the differences for the highest barrier between Cu@Cu(1 1 1) and Cu(1 1 1) surfaces are smaller, the catalytic behaviors of Cu@Cu(1 1 1) surface are very close to the flat Cu(1 1 1) surface, suggesting that the morphology of Cu substrate does not obviously affect the dehydrogenation of CH{sub 4}, which accords with the reported experimental observations. As a result, the adsorbed or substituted Rh atom on Cu catalyst exhibit a better catalytic activity for CH{sub 4} dehydrogenation compared to the pure Cu catalyst, especially on Rh-adsorbed Cu catalyst, we can conclude that the potential of synthesizing high-quality graphene with the

  13. Species dependence of [64Cu]Cu-Bis(thiosemicarbazone) radiopharmaceutical binding to serum albumins

    International Nuclear Information System (INIS)

    Basken, Nathan E.; Mathias, Carla J.; Lipka, Alexander E.; Green, Mark A.

    2008-01-01

    Introduction: Interactions of three copper(II) bis(thiosemicarbazone) positron emission tomography radiopharmaceuticals with human serum albumin, and the serum albumins of four additional mammalian species, were evaluated. Methods: 64 Cu-labeled diacetyl bis(N 4 -methylthiosemicarbazonato)copper(II) (Cu-ATSM), pyruvaldehyde bis(N 4 -methylthiosemicarbazonato)copper(II) (Cu-PTSM) and ethylglyoxal bis(thiosemicarbazonato)copper(II) (Cu-ETS) were synthesized and their binding to human, canine, rat, baboon and porcine serum albumins quantified by ultrafiltration. Protein binding was also measured for each tracer in human, porcine, rat and mouse serum. Results: The interaction of these neutral, lipophilic copper chelates with serum albumin is highly compound- and species-dependent. Cu-PTSM and Cu-ATSM exhibit particularly high affinity for human serum albumin (HSA), while the albumin binding of Cu-ETS is relatively insensitive to species. At HSA concentrations of 40 mg/ml, '% free' (non-albumin-bound) levels of radiopharmaceutical were 4.0±0.1%, 5.3±0.2% and 38.6±0.8% for Cu-PTSM, Cu-ATSM and Cu-ETS, respectively. Conclusions: Species-dependent variations in radiopharmaceutical binding to serum albumin may need to be considered when using animal models to predict the distribution and kinetics of these compounds in humans

  14. CuO-Functionalized Silicon Photoanodes for Photoelectrochemical Water Splitting Devices.

    Science.gov (United States)

    Shi, Yuanyuan; Gimbert-Suriñach, Carolina; Han, Tingting; Berardi, Serena; Lanza, Mario; Llobet, Antoni

    2016-01-13

    One main difficulty for the technological development of photoelectrochemical (PEC) water splitting (WS) devices is the fabrication of active, stable and cost-effective photoelectrodes that ensure high performance. Here, we report the development of a CuO/Silicon based photoanode, which shows an onset potential for the water oxidation of 0.53 V vs SCE at pH 9, that is, an overpotential of 75 mV, and high stability above 10 h. These values account for a photovoltage of 420 mV due to the absorbed photons by silicon, as proven by comparing with analogous CuO/FTO electrodes that are not photoactive. The photoanodes have been fabricated by sputtering a thin film of Cu(0) on commercially available n-type Si wafers, followed by a photoelectrochemical treatment in basic pH conditions. The resulting CuO/Cu layer acts as (1) protective layer to avoid the corrosion of nSi, (2) p-type hole conducting layer for efficient charge separation and transportation, and (3) electrocatalyst to reduce the overpotential of the water oxidation reaction. The low cost, low toxicity, and good performance of CuO-based coatings can be an attractive solution to functionalize unstable materials for solar energy conversion.

  15. First-principles theory of short-range order in size-mismatched metal alloys: Cu-Au, Cu-Ag, and Ni-Au

    International Nuclear Information System (INIS)

    Wolverton, C.; Ozolins, V.; Zunger, A.

    1998-01-01

    We describe a first-principles technique for calculating the short-range order (SRO) in disordered alloys, even in the presence of large anharmonic atomic relaxations. The technique is applied to several alloys possessing large size mismatch: Cu-Au, Cu-Ag, Ni-Au, and Cu-Pd. We find the following: (i) The calculated SRO in Cu-Au alloys peaks at (or near) the left-angle 100 right-angle point for all compositions studied, in agreement with diffuse scattering measurements. (ii) A fourfold splitting of the X-point SRO exists in both Cu 0.75 Au 0.25 and Cu 0.70 Pd 0.30 , although qualitative differences in the calculated energetics for these two alloys demonstrate that the splitting in Cu 0.70 Pd 0.30 may be accounted for by T=0 K energetics while T≠0 K configurational entropy is necessary to account for the splitting in Cu 0.75 Au 0.25 . Cu 0.75 Au 0.25 shows a significant temperature dependence of the splitting, in agreement with recent in situ measurements, while the splitting in Cu 0.70 Pd 0.30 is predicted to have a much smaller temperature dependence. (iii) Although no measurements exist, the SRO of Cu-Ag alloys is predicted to be of clustering type with peaks at the left-angle 000 right-angle point. Streaking of the SRO peaks in the left-angle 100 right-angle and left-angle 1 (1) /(2) 0 right-angle directions for Ag- and Cu-rich compositions, respectively, is correlated with the elastically soft directions for these compositions. (iv) Even though Ni-Au phase separates at low temperatures, the calculated SRO pattern in Ni 0.4 Au 0.6 , like the measured data, shows a peak along the left-angle ζ00 right-angle direction, away from the typical clustering-type left-angle 000 right-angle point. (v) The explicit effect of atomic relaxation on SRO is investigated and it is found that atomic relaxation can produce significant qualitative changes in the SRO pattern, changing the pattern from ordering to clustering type, as in the case of Cu-Ag. copyright 1998 The American

  16. Efficient strategy to Cu/Si catalyst into vertically aligned carbon ...

    Indian Academy of Sciences (India)

    Abstract. Bamboo-shaped vertically aligned carbon nanotubes (bs-VACNTs) were fabricated on Cu/Si catalyst by ... on Si wafer material when compared to the other commer- ..... [3] Li H, Zhao N, He C, Shi C, Du X, Li J and Cui Q 2008 Mater.

  17. Tailoring Graphene Morphology and Orientation on Cu(100), Cu(110), and Cu(111)

    Science.gov (United States)

    Jacobberger, Robert; Arnold, Michael

    2013-03-01

    Graphene CVD on Cu is phenomenologically complex, yielding diverse crystal morphologies, such as lobes, dendrites, stars, and hexagons, of various orientations. We present a comprehensive study of the evolution of these morphologies as a function of Cu surface orientation, pressure, H2:CH4, and nucleation density. Growth was studied on ultra-smooth, epitaxial Cu films inside Cu enclosures to minimize factors that normally complicate growth. With low H2:CH4, Mullins-Sekerka instabilities propagate to form dendrites, indicating transport limited growth. In LPCVD, the dendrites extend hundreds of microns in the 100, 111, and 110 directions on Cu(100), (110), and (111) and are perturbed by twin boundaries. In APCVD, multiple preferred dendrite orientations exist. With increasing H2:CH4, the dendritic nature of growth is suppressed. In LPCVD, square, rectangle, and hexagon crystals form on Cu(100), (110) and (111), reflecting the Cu crystallography. In APCVD, the morphology becomes hexagonal on each surface. If given ample time, every growth regime yields high-quality monolayers with D:G Raman ratio rationally tailor the graphene crystal morphology and orientation.

  18. Cu-62, Cu-64 and Cu-66 production with 4.2 MeV deuterons

    International Nuclear Information System (INIS)

    Avila, Mario; Morales, J.R.; Riquelme, H.O.

    1996-01-01

    Full text: The natural copper irradiation with deuterons produces the Cu-62, Cu-64 and Cu-66 radionuclides. Of two radioisotopes, those with deficiencies in neutrons, are applied in nuclear medicine diagnostic processes, mainly for the nuclear characteristic of the decay modes. The positron emitters, of short life mean Cu-62 (9.1 min, β + ) and Cu(12.7 h), are radionuclides applied in radio pharmacological preparation for brain, core, blood flux studies. The radiochemical process consists in the de solution of the irradiated metallic copper target, in acid medium. The result solution, can be neutralized with a base or a buffer at wished pH. Using a deuteron beam of 4,2 ± 0,1 MeV energy has been obtained total yields of 1,103 ± 0,011 μCl/μAh medium for 62 Cu and of 0,148 ± 0,015 μCl/μAh for 64 Cu

  19. Proteomic response of mussels Mytilus galloprovincialis exposed to CuO NPs and Cu{sup 2+}: An exploratory biomarker discovery

    Energy Technology Data Exchange (ETDEWEB)

    Gomes, Tânia, E-mail: tania.gomes@niva.no; Chora, Suze; Pereira, Catarina G.; Cardoso, Cátia; Bebianno, Maria João

    2014-10-15

    Highlights: • Different protein expression patterns, tissue and Cu form dependent. • Different cellular mechanisms involved in CuO NPs and Cu{sup 2+} toxicity. • CuO NPs toxicity mediated by cell signalling cascades that result in apoptosis. • Caspase 3/7–1, catL, Zn-finger, precol-D as new molecular targets for both Cu forms in mussels. - Abstract: CuO NPs are one of the most used metal nanomaterials nowadays with several industrial and other commercial applications. Nevertheless, less is known about the mechanisms by which these NPs inflict toxicity in mussels and to what extent it differs from Cu{sup 2+}. The aim of this study was to investigate changes in protein expression profiles in mussels Mytilus galloprovincialis exposed for 15 days to CuO NPs and Cu{sup 2+} (10 μg L{sup −1}) using a proteomic approach. Results demonstrate that CuO NPs and Cu{sup 2+} induced major changes in protein expression in mussels’ showing several tissue and metal-dependent responses. CuO NPs showed a higher tendency to up-regulate proteins in the gills and down-regulate in the digestive gland, while Cu{sup 2+} showed the opposite tendency. Distinctive sets of differentially expressed proteins were found, either common or specific to each Cu form and tissue, reflecting different mechanisms involved in their toxicity. Fifteen of the differentially expressed proteins from both tissues were identified by MALDI-TOF-TOF. Identified proteins indicate common response mechanisms induced by CuO NPs and Cu{sup 2+}, namely in cytoskeleton and cell structure (actin, α-tubulin, paramyosin), stress response (heat shock cognate 71, putative C1q domain containing protein), transcription regulation (zinc-finger BED domain-containing protein 1, nuclear receptor subfamily 1G) and energy metabolism (ATP synthase F0 subunit 6). CuO NPs alone also had a marked effect on other biological processes, namely oxidative stress (GST), proteolysis (cathepsin L) and apoptosis (caspase 3/7-1). On

  20. Cu gettering by phosphorus-doped emitters in p-type silicon: Effect on light-induced degradation

    Science.gov (United States)

    Inglese, Alessandro; Laine, Hannu S.; Vähänissi, Ville; Savin, Hele

    2018-01-01

    The presence of copper (Cu) contamination is known to cause relevant light-induced degradation (Cu-LID) effects in p-type silicon. Due to its high diffusivity, Cu is generally regarded as a relatively benign impurity, which can be readily relocated during device fabrication from the wafer bulk, i.e. the region affected by Cu-LID, to the surface phosphorus-doped emitter. This contribution examines in detail the impact of gettering by industrially relevant phosphorus layers on the strength of Cu-LID effects. We find that phosphorus gettering does not always prevent the occurrence of Cu-LID. Specifically, air-cooling after an isothermal anneal at 800°C results in only weak impurity segregation to the phosphorus-doped layer, which turns out to be insufficient for effectively mitigating Cu-LID effects. Furthermore, we show that the gettering efficiency can be enhanced through the addition of a slow cooling ramp (-4°C/min) between 800°C and 600°C, resulting in the nearly complete disappearance of Cu-LID effects.

  1. Species dependence of [{sup 64}Cu]Cu-Bis(thiosemicarbazone) radiopharmaceutical binding to serum albumins

    Energy Technology Data Exchange (ETDEWEB)

    Basken, Nathan E. [Division of Nuclear Pharmacy, Department of Industrial and Physical Pharmacy, Purdue University, West Lafayette, IN 47907 (United States)], E-mail: nbasken@purdue.edu; Mathias, Carla J. [Division of Nuclear Pharmacy, Department of Industrial and Physical Pharmacy, Purdue University, West Lafayette, IN 47907 (United States); Lipka, Alexander E. [Department of Statistics, Purdue University, West Lafayette, IN 47907 (United States); Green, Mark A. [Division of Nuclear Pharmacy, Department of Industrial and Physical Pharmacy, Purdue University, West Lafayette, IN 47907 (United States)], E-mail: magreen@purdue.edu

    2008-04-15

    Introduction: Interactions of three copper(II) bis(thiosemicarbazone) positron emission tomography radiopharmaceuticals with human serum albumin, and the serum albumins of four additional mammalian species, were evaluated. Methods: {sup 64}Cu-labeled diacetyl bis(N{sup 4}-methylthiosemicarbazonato)copper(II) (Cu-ATSM), pyruvaldehyde bis(N{sup 4}-methylthiosemicarbazonato)copper(II) (Cu-PTSM) and ethylglyoxal bis(thiosemicarbazonato)copper(II) (Cu-ETS) were synthesized and their binding to human, canine, rat, baboon and porcine serum albumins quantified by ultrafiltration. Protein binding was also measured for each tracer in human, porcine, rat and mouse serum. Results: The interaction of these neutral, lipophilic copper chelates with serum albumin is highly compound- and species-dependent. Cu-PTSM and Cu-ATSM exhibit particularly high affinity for human serum albumin (HSA), while the albumin binding of Cu-ETS is relatively insensitive to species. At HSA concentrations of 40 mg/ml, '% free' (non-albumin-bound) levels of radiopharmaceutical were 4.0{+-}0.1%, 5.3{+-}0.2% and 38.6{+-}0.8% for Cu-PTSM, Cu-ATSM and Cu-ETS, respectively. Conclusions: Species-dependent variations in radiopharmaceutical binding to serum albumin may need to be considered when using animal models to predict the distribution and kinetics of these compounds in humans.

  2. Preparation and Optoelectrical Properties of p-CuO/n-Si Heterojunction by a Simple Sol-Gel Method

    Science.gov (United States)

    He, Bo; Xu, Jing; Ning, Huanpo; Zhao, Lei; Xing, Huaizhong; Chang, Chien-Cheng; Qin, Yuming; Zhang, Lei

    The Cuprous oxide (CuO) thin film was prepared on texturized Si wafer by a simple sol-gel method to fabricate p-CuO/n-Si heterojunction photoelectric device. The novel sol-gel method is very cheap and convenient. The structural, optical and electrical properties of the CuO film were studied by X-ray diffraction (XRD), Scanning Electron Microscope (SEM), X-ray photoelectron spectroscopy (XPS), UV-Vis spectrophotometer and Hall effect measurement. A good nonlinear rectifying behavior is obtained for the p-CuO/n-Si heterojunction. Under reverse bias, good photoelectric behavior is obtained.

  3. Cu-ZSM-5, Cu-ZSM-11, and Cu-ZSM-12 Catalysts for Direct NO Decomposition

    DEFF Research Database (Denmark)

    Kustova, Marina; Kustov, Arkadii; Christiansen, Sofie E.

    2006-01-01

    Cu-ZSM-5 has for many years been recognized as a unique catalyst for direct NO decomposition. Here, it is discovered that both Cu-ZSM-11 and Cu-ZSM-12 are about twice as active as Cu-ZSM-5. This difference is attributed to the active sites located almost exclusively in the straight zeolite pores...

  4. Electromigration in Cu(Al) and Cu(Mn) damascene lines

    Science.gov (United States)

    Hu, C.-K.; Ohm, J.; Gignac, L. M.; Breslin, C. M.; Mittal, S.; Bonilla, G.; Edelstein, D.; Rosenberg, R.; Choi, S.; An, J. J.; Simon, A. H.; Angyal, M. S.; Clevenger, L.; Maniscalco, J.; Nogami, T.; Penny, C.; Kim, B. Y.

    2012-05-01

    The effects of impurities, Mn or Al, on interface and grain boundary electromigration (EM) in Cu damascene lines were investigated. The addition of Mn or Al solute caused a reduction in diffusivity at the Cu/dielectric cap interface and the EM activation energies for both Cu-alloys were found to increase by about 0.2 eV as compared to pure Cu. Mn mitigated and Al enhanced Cu grain boundary diffusion; however, no significant mitigation in Cu grain boundary diffusion was observed in low Mn concentration samples. The activation energies for Cu grain boundary diffusion were found to be 0.74 ± 0.05 eV and 0.77 ± 0.05 eV for 1.5 μm wide polycrystalline lines with pure Cu and Cu (0.5 at. % Mn) seeds, respectively. The effective charge number in Cu grain boundaries Z*GB was estimated from drift velocity and was found to be about -0.4. A significant enhancement in EM lifetimes for Cu(Al) or low Mn concentration bamboo-polycrystalline and near-bamboo grain structures was observed but not for polycrystalline-only alloy lines. These results indicated that the existence of bamboo grains in bamboo-polycrystalline lines played a critical role in slowing down the EM-induced void growth rate. The bamboo grains act as Cu diffusion blocking boundaries for grain boundary mass flow, thus generating a mechanical stress-induced back flow counterbalancing the EM force, which is the equality known as the "Blech short length effect."

  5. Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

    Directory of Open Access Journals (Sweden)

    Atteq ur Rehman

    2014-02-01

    Full Text Available Developing a better method for the metallization of silicon solar cells is integral part of realizing superior efficiency. Currently, contact realization using screen printing is the leading technology in the silicon based photovoltaic industry, as it is simple and fast. However, the problem with metallization of this kind is that it has a lower aspect ratio and higher contact resistance, which limits solar cell efficiency. The mounting cost of silver pastes and decreasing silicon wafer thicknesses encourages silicon solar cell manufacturers to develop fresh metallization techniques involving a lower quantity of silver usage and not relying pressing process of screen printing. In recent times nickel/copper (Ni/Cu based metal plating has emerged as a metallization method that may solve these issues. This paper offers a detailed review and understanding of a Ni/Cu based plating technique for silicon solar cells. The formation of a Ni seed layer by adopting various deposition techniques and a Cu conducting layer using a light induced plating (LIP process are appraised. Unlike screen-printed metallization, a step involving patterning is crucial for opening the masking layer. Consequently, experimental procedures involving patterning methods are also explicated. Lastly, the issues of adhesion, back ground plating, process complexity and reliability for industrial applications are also addressed.

  6. Effect of Cu Content on TiN-Cu Nanocomposite Film Properties: Structural and Hardness Studies

    Directory of Open Access Journals (Sweden)

    M. M. Larijani

    2013-06-01

    Full Text Available Titanium nitride-Copper (TiN-Cu nanocomposite films were deposited onto stainless steel substrate using hollow cathode discharge ion plating technique. The influence of Cu content in the range of 2-7 at.% on the microstructure, morphology and mechanical properties of deposited films were investigated. Structural properties of the films were studied by X-ray diffraction pattern. Topography of the deposited films was studied using atomic force microscopy. Film hardness was estimated by a triboscope nanoindentation system. However, X-ray photoelectron spectroscopy analysis was performed to study the surface chemical bonding states. It was found that addition of soft Cu phase above 2 at.% to TiN film drastically decreased the film hardness from 30 to 2.8 Gpa due to lubricant effect of segregated copper particles. X-ray photoelectron spectroscopy results showed that Cu and TiN phases grew separately. In our case,the formation of a solid solution or chemical bonding between Cu and Ti was rejected.

  7. Giant secondary grain growth in Cu films on sapphire

    Directory of Open Access Journals (Sweden)

    David L. Miller

    2013-08-01

    Full Text Available Single crystal metal films on insulating substrates are attractive for microelectronics and other applications, but they are difficult to achieve on macroscopic length scales. The conventional approach to obtaining such films is epitaxial growth at high temperature using slow deposition in ultrahigh vacuum conditions. Here we describe a different approach that is both simpler to implement and produces superior results: sputter deposition at modest temperatures followed by annealing to induce secondary grain growth. We show that polycrystalline as-deposited Cu on α-Al2O3(0001 can be transformed into Cu(111 with centimeter-sized grains. Employing optical microscopy, x-ray diffraction, and electron backscatter diffraction to characterize the films before and after annealing, we find a particular as-deposited grain structure that promotes the growth of giant grains upon annealing. To demonstrate one potential application of such films, we grow graphene by chemical vapor deposition on wafers of annealed Cu and obtain epitaxial graphene grains of 0.2 mm diameter.

  8. Cu-O network dependence of optical charge-transfer gaps and spin-pair excitations in single-CuO2-layer compounds

    International Nuclear Information System (INIS)

    Tokura, Y.; Koshihara, S.; Arima, T.; Takagi, H.; Ishibashi, S.; Ido, T.; Uchida, S.

    1990-01-01

    Spectra of optical conductivity and magnon Raman scattering have been investigated in single crystals of a parent family of cuprate superconductors with various types of Cu-O single-layer networks. The analysis of the spectra shows the systematic dependence of the charge-transfer gaps and covalent character of Cu-O bonds on the pattern of the Cu-O network, while the spin-exchange energy is rather convergent for all the single-CuO 2 -sheet compounds

  9. Carbon Supported Oxide-Rich Pd-Cu Bimetallic Electrocatalysts for Ethanol Electrooxidation in Alkaline Media Enhanced by Cu/CuOx

    Directory of Open Access Journals (Sweden)

    Zengfeng Guo

    2016-04-01

    Full Text Available Different proportions of oxide-rich PdCu/C nanoparticle catalysts were prepared by the NaBH4 reduction method, and their compositions were tuned by the molar ratios of the metal precursors. Among them, oxide-rich Pd0.9Cu0.1/C (Pd:Cu = 9:1, metal atomic ratio exhibits the highest electrocatalytic activity for ethanol oxidation reaction (EOR in alkaline media. X-ray photoelectron spectroscopy (XPS and high resolution transmission electron microscopy (HRTEM confirmed the existence of both Cu and CuOx in the as-prepared Pd0.9Cu0.1/C. About 74% of the Cu atoms are in their oxide form (CuO or Cu2O. Besides the synergistic effect of Cu, CuOx existed in the Pd-Cu bimetallic nanoparticles works as a promoter for the EOR. The decreased Pd 3d electron density disclosed by XPS is ascribed to the formation of CuOx and the spill-over of oxygen-containing species from CuOx to Pd. The low Pd 3d electron density will decrease the adsorption of CH3COads intermediates. As a result, the electrocatalytic activity is enhanced. The onset potential of oxide-rich Pd0.9Cu0.1/C is negative shifted 150 mV compared to Pd/C. The oxide-rich Pd0.9Cu0.1/C also exhibited high stability, which indicated that it is a candidate for the anode of direct ethanol fuel cells (DEFCs.

  10. Assessment of copper nanoparticles (Cu-NPs) and copper (II) oxide (CuO) induced hemato- and hepatotoxicity in Cyprinus carpio

    Science.gov (United States)

    Noureen, Aasma; Jabeen, Farhat; Tabish, Tanveer A.; Yaqub, Sajid; Ali, Muhammad; Shakoor Chaudhry, Abdul

    2018-04-01

    Recently, Cu-based nanoparticles have drawn considerable attention for their various fascinating roles in multiple biological systems. It is recognized that their frequent use can create compatibility challenges for the recipient systems. Nevertheless, it is unclear how various biological interactions affect the compatibility of Cu oxide II (CuO) and Cu oxide nanoparticles (Cu-NPs) for different organisms. Consequently, it has been difficult to perform structured risk assessments for their use in biological systems. Therefore, this study compared the effects of different doses of waterborne Cu-NPs and CuO on the blood and liver of selected groups of Cyprinus (C) carpio. These fish while housed in suitable water tanks were exposed to one of the following treatments for 14 d: control (no added Cu) or 0.5 or 1 or 1.5 mg Cu as Cu-NPs or CuO l-1 of water. We found significant changes in all assessed blood parameters of fish in response to increasing doses from 0 to 1.5 mg of Cu-NPs or CuO. Similarly, increased levels of lipid peroxide and reduced glutathione (GSH) were also observed in the livers of C. carpio in Cu-NPs or CuO treated groups. Enhanced levels of lipid peroxidation and GSH were also recorded in the Cu-NP treated groups compared with the CuO treated groups in a dose dependent manner. The lowest catalase activity was observed in the liver of C. carpio treated with the higer dose of Cu-NPs. Cu-NP or CuO exposure induced significant histological alterations in the liver of C. carpio including focal necrosis, cloudy swelling of hepatocytes, degenerative hepatocytes, vacuolization, pyknotic nuclei, damaged central vein, nuclear hypertrophy, dilated sinusoid, vacuolated degeneration, congestion, and complete degeneration in a dose dependent manner. Substantial alterations in blood and liver specimens were observed in the Cu-NP treated fish when compared with the CuO treated fish. It appeared that the Cu-NPs were more toxic than the CuO as shown by the hemato- and

  11. Properties of the CuGaSe2 and CuInSe2 (001) surface

    International Nuclear Information System (INIS)

    Deniozou, T.

    2005-01-01

    The main task of this work was to investigate the (001) CuGaSe 2 and CuInSe 2 surface in dependence of preparation and stoichiometry. The knowledge of the atomic structure as well as other surface properties is important in respect to optimization of novel thin film solar cells. For the characterization of the layers mainly Auger electron Spectroscopy, low-energy electron diffraction and photoelectron spectroscopy were implemented. The development of an appropriate procedure with Ar + sputtering and annealing combined with decapping enabled the preparation of clean and well-ordered surfaces. Different surface structures were observed in dependence of the layer preparation and composition. A (4 x 1) reconstruction was observed for the first time on CuGaSe 2 layers grown with a moderate Cu-excess after preparation by sputtering and annealing. Similarly a (4 x 2) reconstruction was detected on CuInSe2 surfaces of Cu-poor layers. A reconstruction could be also observed on Cu-poorer layers, however the facets/steps could not be completely removed. Cu-richer layers were facet-free, however the observed reconstruction was also weaker. Thus it was shown that in contrary to recent expectations, according to which only the (112) surface is stable, also the (001) can be stable under particular conditions. The appearance of facets or steps is correlated with the presence of CuIn 3 Se 5 or CuGa 3 Se 5 phases. This information is furthermore important for the understanding of grain boundaries in polycrystalline CuGaSe 2 and CuInSe 2 . Binding energy shifts were observed for the first time on all Se3d, In4d, Ga3d, Cu3d core levels of the reconstructed surfaces. By comparison with results from the literature from the similar ZnSe (100) surface a modell for the (4 x 2) reconstruction was proposed. The surface components in the Se3d, In4d and Cu3d emission were attributed to Se dimers or In and Cu adatoms respectively. The x 1 periodicity of the (4 x 1) reconstruction of CuGaSe 2 is

  12. Influence of body size on Cu bioaccumulation in zebra mussels Dreissena polymorpha exposed to different sources of particle-associated Cu

    Energy Technology Data Exchange (ETDEWEB)

    Zhong, Huan, E-mail: huanzhong1982@hotmail.com [Environmental and Resource Studies Program, Trent University, Peterborough, Ontario (Canada); Nanjing University, School of Environment, State Key Laboratory of Pollution Control and Resource Reuse, Nanjing, Jiangsu Province (China); Kraemer, Lisa; Evans, Douglas [Environmental and Resource Studies Program, Trent University, Peterborough, Ontario (Canada)

    2013-10-15

    Highlights: • Mussels exposed to algal/sediment-Cu have different size-related Cu accumulation. • Size-related Cu accumulation in mussels could be more dependant on algal-Cu uptake. • Importance of algal/sediment-Cu to Cu bioaccumulation varies with mussel body size. • Cu sources (algae and sediments) should be considered in “mussel watch” programs. • Cu stable isotope offers many advantages in Cu bioaccumulation studies. -- Abstract: Size of organisms is critical in controlling metal bioavailability and bioaccumulation, while mechanisms of size-related metal bioaccumulation are not fully understood. To investigate the influences of different sources of particle-associated Cu on body size-related Cu bioavailability and bioaccumulation, zebra mussels (Dreissena polymorpha) of different sizes were exposed to stable Cu isotope ({sup 65}Cu) spiked algae (Chlorella vulgaris) or sediments in the laboratory and the Cu tissue concentration-size relationships were compared with that in unexposed mussels. Copper tissue concentrations decreased with mussel size (tissue or shell dry weight) in both unexposed and algal-exposed mussels with similar decreasing patterns, but were independent of size in sediment-exposed mussels. Furthermore, the relative contribution of Cu uptake from algae (65–91%) to Cu bioaccumulation is always higher than that from sediments (9–35%), possibly due to the higher bioavailability of algal-Cu. Therefore, the size-related ingestion of algae could be more important in influencing the size-related variations in Cu bioaccumulation. However, the relative contribution of sediment-Cu to Cu bioaccumulation increased with body size and thus sediment ingestion may also affect the size-related Cu variations in larger mussels (tissue weight >7.5 mg). This study highlights the importance of considering exposure pathways in normalization of metal concentration variation when using bivalves as biomonitors.

  13. Punicalagin Green Functionalized Cu/Cu2O/ZnO/CuO Nanocomposite for Potential Electrochemical Transducer and Catalyst

    Science.gov (United States)

    Fuku, X.; Kaviyarasu, K.; Matinise, N.; Maaza, M.

    2016-09-01

    A novel ternary Punica granatum L-Cu/Cu2O/CuO/ZnO nanocomposite was successfully synthesised via green route. In this work, we demonstrate that the green synthesis of metal oxides is more viable and facile compare to other methods, i.e., physical and chemical routes while presenting a potential electrode for energy applications. The prepared nanocomposite was characterised by both microscopic and spectroscopic techniques. High-resolution scanning electron microscopy (HRSEM) and X-ray diffraction (XRD) techniques revealed different transitional phases with an average nanocrystallite size of 29-20 mm. It was observed that the nanocomposites changed from amorphous-slightly crystalline Cu/Cu2O to polycrystalline Cu/Cu2O/CuO/ZnO at different calcination temperatures (room temperature-RT- 600 °C). The Cu/Cu2O/ZnO/CuO metal oxides proved to be highly crystalline and showed irregularly distributed particles with different sizes. Meanwhile, Fourier transform infrared (FTIR) spectroscopy confirmed the purity while together with ultraviolet-visible (UV-Vis) spectroscopy proved the proposed mechanism of the synthesised nanocomposite. UV-Vis showed improved catalytic activity of the prepared metal oxides, evident by narrow band gap energy. The redox and electrochemical properties of the prepared nanocomposite were achieved by cyclic voltammetry (CV), electrochemical impedance (EIS) and galvanostatic charge-discharge (GCD). The maximum specific capacitance ( C s) was calculated to be 241 F g-1 at 50 mV s-1 for Cu/Cu2O/CuO/ZnO nanoplatelets structured electrode. Moreover, all the CuO nanostructures reveal better power performance, excellent rate as well as long term cycling stability. Such a study will encourages a new design for a wide spectrum of materials for smart electronic device applications.

  14. Bonding in d9 complexes derived from EPR: Application to CuCl2-4, CuBr2-4, and CdCl2:Cu2+

    Science.gov (United States)

    Aramburu, J. A.; Moreno, M.

    1985-12-01

    In this work are reported the theoretical expressions for the [g], hyperfine, and superhyperfine (shf) tensors of a d9 square-planar complex within a molecular orbital (MO) scheme. These expressions include contributions arising from crystal field and charge transfer excitations calculated up to third and second order perturbations, respectively. This makes the present framework more general than those previously used. Through those expressions we have derived from the experimental EPR and optical data the MO coefficients corresponding to the valence b1g(x2-y2), b2g(xy), and eg(xz,yz) levels and also the core polarization contribution K to the hyperfine tensor for the systems CuCl2-4, CuBr2-4, and CdCl2:Cu2+. The 3d charge obtained for CuCl2-4 is equal to 0.61, 0.83, and 0.85 for the antibonding 3b1g, 2b2g, and 2eg levels, respectively. These figures are much closer to the Xα results by Bencini and Gatteschi [J. Am. Chem. Soc. 105, 5535 (1983)] than to those by Desjardins et al. [J. Am. Chem. Soc. 105, 4590 (1983)]. The σ and π covalency for CuBr2-4 are both higher than for CuCl2-4 in accord to the lower electronegativity for bromine. However, only for the antibonding 3b1g level of CuBr2-4 have we obtained an electronic charge lying mainly on ligands. The covalency of CdCl2:Cu2+ is smaller than that found for CuCl2-4, a fact associated to a higher metal-ligand distance for the former. Evidence of this statement are also given from the analysis of crystal-field spectra and isotropic shf constant. The values of K derived for CuCl2-4 (128.1×10-4 cm-1), CuBr2-4 (103.6×10-4 cm-1), and CdCl2:Cu2+ (123.9×10-4 cm-1) point out the dependence of K on the equatorial covalency but also on the existence of axial ligands. The [g] tensor of CuBr2-4 is dominated by the charge transfer contribution while the crystal field one is negative. Finally an analysis of the importance of each one of the involved contributions to the spin-Hamiltonian parameters is reported for the

  15. Cu-62, Cu-64 and Cu-66 production with 4.2 MeV deuterons; Produccion de {sup 62} Cu y {sup 64} Cu con deuterones de 4,2 MeV

    Energy Technology Data Exchange (ETDEWEB)

    Avila, Mario; Morales, J R; Riquelme, H O [Chile Univ., Santiago (Chile). Facultad de Ciencias. Dept. de Fisica

    1997-12-31

    Full text: The natural copper irradiation with deuterons produces the Cu-62, Cu-64 and Cu-66 radionuclides. Of two radioisotopes, those with deficiencies in neutrons, are applied in nuclear medicine diagnostic processes, mainly for the nuclear characteristic of the decay modes. The positron emitters, of short life mean Cu-62 (9.1 min, {beta}{sup +}) and Cu(12.7 h), are radionuclides applied in radio pharmacological preparation for brain, core, blood flux studies. The radiochemical process consists in the de solution of the irradiated metallic copper target, in acid medium. The result solution, can be neutralized with a base or a buffer at wished pH. Using a deuteron beam of 4,2 {+-} 0,1 MeV energy has been obtained total yields of 1,103 {+-} 0,011 {mu}Cl/{mu}Ah medium for 62 Cu and of 0,148 {+-} 0,015 {mu}Cl/{mu}Ah for 64 Cu.

  16. Cu/Cu{sub 2}O/CuO loaded on the carbon layer derived from novel precursors with amazing catalytic performance

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Xiaoli, E-mail: zhaoxiaoli_zxl@126.com [State Key Laboratory of Environmental Criteria and Risk Assessment, Chinese Research Academy of Environmental Sciences, Beijing 100012 (China); Tan, Yixin [State Key Laboratory of Environmental Criteria and Risk Assessment, Chinese Research Academy of Environmental Sciences, Beijing 100012 (China); State Key Laboratory of Environmental Chemistry and Ecotoxicology, Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China); Wu, Fengchang, E-mail: wu_fengchang@126.com [State Key Laboratory of Environmental Criteria and Risk Assessment, Chinese Research Academy of Environmental Sciences, Beijing 100012 (China); Niu, Hongyun [State Key Laboratory of Environmental Chemistry and Ecotoxicology, Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China); Tang, Zhi [State Key Laboratory of Environmental Criteria and Risk Assessment, Chinese Research Academy of Environmental Sciences, Beijing 100012 (China); Cai, Yaqi [State Key Laboratory of Environmental Chemistry and Ecotoxicology, Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China); Giesy, John P. [State Key Laboratory of Environmental Criteria and Risk Assessment, Chinese Research Academy of Environmental Sciences, Beijing 100012 (China); Department of Veterinary Biomedical Sciences and Toxicology Centre, University of Saskatchewan, Saskatoon, Saskatchewan (Canada)

    2016-11-15

    A simple, novel method for synthesis of Cu/Cu{sub 2}O/CuO on surfaces of carbon (Cu/Cu{sub 2}O/CuO@C) as a non-noble-metal catalyst for reduction of organic compounds is presented. Compared with noble metals, Cu/Cu{sub 2}O/CuO@C particles are more efficient and less expensive. Characterization of the Cu/Cu{sub 2}O/CuO@C composites by high-resolution transmission electron microscope (HRTEM), x-ray diffraction (XRD), infrared spectroscopy and Raman analysis, revealed that it was composed of graphitized carbon with numerous nanoparticles (100 nm in diameter) of Cu/CuO/Cu{sub 2}O that were uniformly distributed on internal and external surfaces of the carbon support. Gallic acid (GA) has been used as both organic ligand and carbon precursor with metal organic frameworks (MOFs) as the sacrificial template and metal oxide precursor in this green synthesis. The material combined the advantages of MOFs and Cu-containing materials, the porous structure provided a large contact area and channels for the pollutions, which results in more rapid catalytic degradation of pollutants and leads to greater efficiency of catalysis. The material gave excellent catalytic performance for organic dyes and phenols. In this study, Cu/Cu{sub 2}O/CuO@C was used as catalytic to reduce 4-NP, which has been usually adopted as a model reaction to check the catalytic ability. Catalytic experiment results show that 4-NP was degraded approximately 3 min by use of 0.04 mg of catalyst and the conversion of pollutants can reach more than 99%. The catalyst exhibited little change in efficacy after being utilized five times. Rates of degradation of dyes, such as Methylene blue (MB) and Rhodamine B (RhB) and phenolic compounds such as O-Nitrophenol (O-NP) and 2-Nitroaniline (2-NA) were all similar. - Highlights: • We present an effective catalyst for reductive degradation of organic dyes and phenols in water. • Compared with noble metals, Cu/Cu{sub 2}O/CuO@C particles are more efficient and less

  17. /Cu-Al System

    Science.gov (United States)

    Kish, Orel; Froumin, Natalya; Aizenshtein, Michael; Frage, Nachum

    2014-05-01

    Wettability and interfacial interaction of the Ta2O5/Cu-Al system were studied. Pure Cu does not wet the Ta2O5 substrate, and improved spreading is achieved when relatively a high fraction of the active element (~40 at.% Al) was added. The Al2O3 and AlTaO4 phases were observed at the Ta2O5/Cu-Al interface. A thermodynamic evaluation allowed us to suggest that the lack of wetting bellow 40 at.% Al is due to the presence of a native oxide, which covers the drop. The conditions of the native oxide decomposition and the formation of the volatile Al2O suboxide strongly depend on the vacuum level during sessile drop experiments and the composition of the Cu-Al alloy. In our case, Al contents greater than 40% provides thermodynamic conditions for the formation of Al2O (as a result of Al reaction with Al2O3) and the drop spreading. It was suggested that the final contact angle in the Ta2O5/Cu-Al system (50°) is determined by Ta adsorption on the newly formed alumina interlayer.

  18. Electron tunneling measurements in LaSrCuO and YBaCuO

    International Nuclear Information System (INIS)

    Moreland, J.; Ekin, J.W.; Goodrich, L.F.; Capobianco, T.E.; Clark, A.F.

    1987-01-01

    The break junction technique whereby vacuum tunneling occurs within the fracture of a bulk sample is used to study the LaSrCuO and YBaCuO perovskite superconductors. Structure in the current versus voltage characteristics is reminiscent of previous quasiparticle curves obtained for BCS superconducting materials. Some curves have anomalous qualities, including large dips in the junction conductance with increasing voltage just above a well defined tunneling gap edge linearly increasing junction conductance with an applied bias, along with features occurring near the voltage intervals with the 1, 3, 5 pattern

  19. Influence of body size on Cu bioaccumulation in zebra mussels Dreissena polymorpha exposed to different sources of particle-associated Cu.

    Science.gov (United States)

    Zhong, Huan; Kraemer, Lisa; Evans, Douglas

    2013-10-15

    Size of organisms is critical in controlling metal bioavailability and bioaccumulation, while mechanisms of size-related metal bioaccumulation are not fully understood. To investigate the influences of different sources of particle-associated Cu on body size-related Cu bioavailability and bioaccumulation, zebra mussels (Dreissena polymorpha) of different sizes were exposed to stable Cu isotope ((65)Cu) spiked algae (Chlorella vulgaris) or sediments in the laboratory and the Cu tissue concentration-size relationships were compared with that in unexposed mussels. Copper tissue concentrations decreased with mussel size (tissue or shell dry weight) in both unexposed and algal-exposed mussels with similar decreasing patterns, but were independent of size in sediment-exposed mussels. Furthermore, the relative contribution of Cu uptake from algae (65-91%) to Cu bioaccumulation is always higher than that from sediments (9-35%), possibly due to the higher bioavailability of algal-Cu. Therefore, the size-related ingestion of algae could be more important in influencing the size-related variations in Cu bioaccumulation. However, the relative contribution of sediment-Cu to Cu bioaccumulation increased with body size and thus sediment ingestion may also affect the size-related Cu variations in larger mussels (tissue weight >7.5mg). This study highlights the importance of considering exposure pathways in normalization of metal concentration variation when using bivalves as biomonitors. Copyright © 2013 Elsevier B.V. All rights reserved.

  20. Electron irradiation induced nanocrystal formation in Cu-borosilicate glass

    Energy Technology Data Exchange (ETDEWEB)

    Sabri, Mohammed Mohammed; Möbus, Günter, E-mail: g.moebus@sheffield.ac.uk [University of Sheffield, Department of Materials Science and Engineering (United Kingdom)

    2016-03-15

    Nanoscale writing of Cu nanoparticles in glasses is introduced using focused electron irradiation by transmission electron microscopy. Two types of copper borosilicate glasses, one with high and another with low Cu loading, have been tested at energies of 200–300 keV, and formation of Cu nanoparticles in a variety of shapes and sizes using different irradiation conditions is achieved. Electron energy loss spectroscopy analysis, combined with high-resolution transmission electron microscopy imaging, confirmed the irradiation-induced precipitated nanoparticles as metallic, while furnace annealing of the glass triggered dendrite-shaped particles of copper oxide. Unusual patterns of nanoparticle rings and chains under focused electron beam irradiation are also presented. Conclusively, electron beam patterning of Cu-loaded glasses is a promising alternative route to well-established femtosecond laser photoreduction of Cu ions in glass.

  1. Hume-Rothery electron concentration rule across a whole solid solution range in a series of gamma-brasses in Cu-Zn, Cu-Cd, Cu-Al, Cu-Ga, Ni-Zn and Co-Zn alloy systems

    Science.gov (United States)

    Mizutani, U.; Noritake, T.; Ohsuna, T.; Takeuchi, T.

    2010-05-01

    The aim of the present work is to examine if the Hume-Rothery stabilisation mechanism holds across whole solid solution ranges in a series of gamma-brasses with especial attention to the role of vacancies introduced into the large unit cell. The concentration dependence of the number of atoms in the unit cell, N, for gamma-brasses in the Cu-Zn, Cu-Cd, Cu-Al, Cu-Ga, Ni-Zn and Co-Zn alloy systems was determined by measuring the density and lattice constants at room temperature. The number of itinerant electrons in the unit cell, e/uc, is evaluated by taking a product of N and the number of itinerant electrons per atom, e/a, for the transition metal element deduced earlier from the full-potential linearised augmented plane wave (FLAPW)-Fourier analysis. The results are discussed within the rigid-band model using as a host the density of states (DOS) derived earlier from the FLAPW band calculations for the stoichiometric gamma-brasses Cu5Zn8, Cu9Al4 and TM2Zn11 (TM = Co and Ni). A solid solution range of gamma-brasses in Cu-Zn, Cu-Cd, Cu-Al, Cu-Ga and Ni-Zn alloy systems is found to fall inside the existing pseudogap at the Fermi level. This is taken as confirmation of the validity of the Hume-Rothery stability mechanism for a whole solute concentration range of these gamma-brasses. An exception to this behaviour was found in the Co-Zn gamma-brasses, where orbital hybridisation effects are claimed to play a crucial role in stabilisation.

  2. A novel nonenzymatic amperometric hydrogen peroxide sensor based on CuO@Cu2O nanowires embedded into poly(vinyl alcohol).

    Science.gov (United States)

    Chirizzi, Daniela; Guascito, Maria Rachele; Filippo, Emanuela; Tepore, Antonio

    2016-01-15

    A new, very simple, rapid and inexpensive nonenzymatic amperometric sensor for hydrogen peroxide (H2O2) detection is proposed. It is based on the immobilization of cupric/cuprous oxide core shell nanowires (CuO@Cu2O-NWs) in a poly(vinyl alcohol) (PVA) matrix directly drop casted on a glassy carbon electrode surface to make a CuO@Cu2O core shell like NWs PVA embedded (CuO@Cu2O-NWs/PVA) sensor. CuO nanowires with mean diameters of 120-170nm and length in the range 2-5μm were grown by a simple catalyst-free thermal oxidation process based on resistive heating of pure copper wires at ambient conditions. The oxidation process of the copper wire surface led to the formation of a three layered structure: a thick Cu2O bottom layer, a CuO thin intermediate layer and CuO nanowires. CuO nanowires were carefully scratched from Cu2O layer with a sharp knife, dispersed into ethanol and sonicated. Then, the NWs were embedded in PVA matrix. The morphological and spectroscopic characterization of synthesized CuO-NWs and CuO@Cu2O-NWs/PVA were performed by transmission electron microscopy (TEM), selected area diffraction pattern (SAD), scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) analysis. Moreover a complete electrochemical characterization of these new CuO@Cu2O-NWs/PVA modified glassy carbon electrodes was performed by Cyclic Voltammetry (CV) and Cronoamperometry (CA) in phosphate buffer (pH=7; I=0.2) to investigate the sensing properties of this material against H2O2. The electrochemical performances of proposed sensors as high sensitivity, fast response, reproducibility and selectivity make them suitable for the quantitative determination of hydrogen peroxide substrate in batch analysis. Copyright © 2015 Elsevier B.V. All rights reserved.

  3. Stability of Cu-Precipitates in Al-Cu Alloys

    Directory of Open Access Journals (Sweden)

    Torsten E. M. Staab

    2018-06-01

    Full Text Available We present first principle calculations on formation and binding energies for Cu and Zn as solute atoms forming small clusters up to nine atoms in Al-Cu and Al-Zn alloys. We employ a density-functional approach implemented using projector-augmented waves and plane wave expansions. We find that some structures, in which Cu atoms are closely packed on {100}-planes, turn out to be extraordinary stable. We compare the results with existing numerical or experimental data when possible. We find that Cu atoms precipitating in the form of two-dimensional platelets on {100}-planes in the fcc aluminum are more stable than three-dimensional structures consisting of the same number of Cu-atoms. The preference turns out to be opposite for Zn in Al. Both observations are in agreement with experimental observations.

  4. Modeling and Measurement of Stress and Strain Evolution in Cu Interconnects

    International Nuclear Information System (INIS)

    Besser, Paul R.; Zhai, Charlie Jun

    2004-01-01

    The damascene fabrication method and the introduction of low-K dielectrics present a host of reliability challenges to Cu interconnects and fundamentally change the mechanical stress state of Cu lines used as interconnects for integrated circuits. In order to capture the effect of individual process steps on the stress evolution in the BEoL (Back End of Line), a process-oriented finite element modeling (FEM) approach was developed. In this model, the complete stress history at any step of BEoL can be simulated as a dual damascene Cu structure is fabricated. The model was calibrated with both wafer-curvature blanket film measurements and X-Ray diffraction (XRD) measurement of metal line stress. The Cu line stress evolution was simulated during the process of multi-step processing for dual damascene Cu/TEOS and Cu/low-k structures. The in-plane stress of Cu lines is nearly independent of subsequent processes, while the out-of-plane stress increases considerably with the subsequent process steps. The modeling results will be compared with recent XRD measurements and extended generically to illustrate the relative influence of the dielectric (ILD) modulus (E) and coefficient of thermal expansion (CTE) on strain/stress in the Cu lines. It will be shown that the stress magnitude and state (hydrostatic, deviatoric) depend on ILD properties. The stress along the line length (longitudinal) is substrate-dominated, while the transverse and normal stresses vary with both CTE and modulus of the dielectric. The hydrostatic stress is primarily determined by ILD modulus and is nearly independent of the ILD CTE, while the Von Mises stress depends on both CTE and E of the ILD. The stress of the Cu line tends to be more deviatoric with spin-on low K ILDs, and more hydrostatic with oxide encapsulation

  5. Self-Assembled Formation of Well-Aligned Cu-Te Nano-Rods on Heavily Cu-Doped ZnTe Thin Films

    Science.gov (United States)

    Liang, Jing; Cheng, Man Kit; Lai, Ying Hoi; Wei, Guanglu; Yang, Sean Derman; Wang, Gan; Ho, Sut Kam; Tam, Kam Weng; Sou, Iam Keong

    2016-11-01

    Cu doping of ZnTe, which is an important semiconductor for various optoelectronic applications, has been successfully achieved previously by several techniques. However, besides its electrical transport characteristics, other physical and chemical properties of heavily Cu-doped ZnTe have not been reported. We found an interesting self-assembled formation of crystalline well-aligned Cu-Te nano-rods near the surface of heavily Cu-doped ZnTe thin films grown via the molecular beam epitaxy technique. A phenomenological growth model is presented based on the observed crystallographic morphology and measured chemical composition of the nano-rods using various imaging and chemical analysis techniques. When substitutional doping reaches its limit, the extra Cu atoms favor an up-migration toward the surface, leading to a one-dimensional surface modulation and formation of Cu-Te nano-rods, which explain unusual observations on the reflection high energy electron diffraction patterns and apparent resistivity of these thin films. This study provides an insight into some unexpected chemical reactions involved in the heavily Cu-doped ZnTe thin films, which may be applied to other material systems that contain a dopant having strong reactivity with the host matrix.

  6. Influence of Cu content on the cell biocompatibility of Ti–Cu sintered alloys

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Erlin, E-mail: zhangel@atm.neu.edu.cn [Key Lab. for Anisotropy and Texture of Materials, Education Ministry of China, Northeastern University, Shenyang 110819 (China); Jiamusi University, Jiamusi 154007 (China); Zheng, Lanlan [Jiamusi University, Jiamusi 154007 (China); Liu, Jie [Key Lab. for Anisotropy and Texture of Materials, Education Ministry of China, Northeastern University, Shenyang 110819 (China); Dept. of Prosthodontics, The Affiliated Hospital of Medical College, Qingdao University, Qingdao 266003 (China); Bai, Bing [Dept. of Prosthodontics, School of Stomatology, China Medical University, Liaoning Institute of Dental Research, Shenyang 110001 (China); Liu, Cong [Jiamusi University, Jiamusi 154007 (China)

    2015-01-01

    The cell toxicity and the cell function of Ti–Cu sintered alloys with different Cu contents (2, 5, 10 and 25 wt.%, respectively) have been investigated in comparison with commercial pure titanium in order to assess the influence of Cu content on the cell biocompatibility of the Ti–Cu alloys. The cytotoxicity was studied by examining the MG63 cell response by CCK8 assessment. The cell morphology was evaluated by acridine orange/ethidium bromide (AO/EB) fluorescence and observed under scanning electronic microscopy (SEM). The cell function was monitored by measuring the AKP activity. It has been shown by the AO/EB morphology results that the cell death on both cp-Ti sample and Ti–Cu samples is due to apoptosis rather than necrosis. Although more apoptotic cells were found on the Ti–2Cu and Ti–5Cu samples, no evidence of Cu content dependent manner of apoptosis has been found. SEM observation indicated very good cell adhesion and spread on the cp-Ti sample and the Ti–Cu samples with different Cu contents. CCK8 results displayed that increase in the Cu content in Ti–Cu alloys does not bring about any difference in the cell viability. In addition, AKP test results indicated that no difference in the differentiation of MG63 was found between the cp-Ti and the Ti–Cu samples and among the Ti–Cu samples. All results indicated that Ti–Cu alloys exhibit very good cell biocompatibility and the Cu content up to 25 wt.% in the Ti–Cu alloys has no influence on the cell proliferation and differentiation. - Highlights: • The effect of Cu content on the cell biocompatibility has been investigated. • Cu content shows no influence on the cell proliferation. • Cu content shows no effect on the cell differentiation.

  7. Influence of Cu content on the cell biocompatibility of Ti–Cu sintered alloys

    International Nuclear Information System (INIS)

    Zhang, Erlin; Zheng, Lanlan; Liu, Jie; Bai, Bing; Liu, Cong

    2015-01-01

    The cell toxicity and the cell function of Ti–Cu sintered alloys with different Cu contents (2, 5, 10 and 25 wt.%, respectively) have been investigated in comparison with commercial pure titanium in order to assess the influence of Cu content on the cell biocompatibility of the Ti–Cu alloys. The cytotoxicity was studied by examining the MG63 cell response by CCK8 assessment. The cell morphology was evaluated by acridine orange/ethidium bromide (AO/EB) fluorescence and observed under scanning electronic microscopy (SEM). The cell function was monitored by measuring the AKP activity. It has been shown by the AO/EB morphology results that the cell death on both cp-Ti sample and Ti–Cu samples is due to apoptosis rather than necrosis. Although more apoptotic cells were found on the Ti–2Cu and Ti–5Cu samples, no evidence of Cu content dependent manner of apoptosis has been found. SEM observation indicated very good cell adhesion and spread on the cp-Ti sample and the Ti–Cu samples with different Cu contents. CCK8 results displayed that increase in the Cu content in Ti–Cu alloys does not bring about any difference in the cell viability. In addition, AKP test results indicated that no difference in the differentiation of MG63 was found between the cp-Ti and the Ti–Cu samples and among the Ti–Cu samples. All results indicated that Ti–Cu alloys exhibit very good cell biocompatibility and the Cu content up to 25 wt.% in the Ti–Cu alloys has no influence on the cell proliferation and differentiation. - Highlights: • The effect of Cu content on the cell biocompatibility has been investigated. • Cu content shows no influence on the cell proliferation. • Cu content shows no effect on the cell differentiation

  8. Renal Cu and Na excretion and hepatic Cu metabolism in both Cu acclimated and non acclimated rainbow trout (Oncorhynchus mykiss)

    DEFF Research Database (Denmark)

    Grosell, M.; Hogstrand, C.; Wood, C.M.

    1998-01-01

    protein depending on whether the Cu is derived from recent branchial uptake or is already present in the plasma prior to Cu-64 exposure. The plasma Cu pool derived from recent branchial uptake and the Cu pool present in the plasma prior to Cu-64 exposure is accessible to renal excretion to different...... Na+ efflux decreased by 40%, which was largely due to increased tubular Na+ reabsorption. Renal compensation for the impaired branchial Na+ uptake, seen during Cu exposure, thus seems to be involved in Cu acclimation in rainbow trout. (C) 1998 Elsevier Science B.V....

  9. Use of micro-PIXE to determine spatial distributions of copper in Brassica carinata plants exposed to CuSO4 or CuEDDS

    International Nuclear Information System (INIS)

    Cestone, Benedetta; Vogel-Mikuš, Katarina; Quartacci, Mike Frank; Rascio, Nicoletta; Pongrac, Paula; Pelicon, Primož; Vavpetič, Primož; Grlj, Nataša; Jeromel, Luka; Kump, Peter; Nečemer, Marijan; Regvar, Marjana; Navari-Izzo, Flavia

    2012-01-01

    A better understanding of the mechanisms that govern copper (Cu) uptake, distribution and tolerance in Brassica carinata plants in the presence of chelators is needed before significant progress in chelate-assisted Cu phytoextraction can be made. The aims of this study were therefore to characterise (S,S)-N,N′-ethylenediamine disuccinic acid (EDDS)-assisted Cu uptake, and to compare the spatial distribution patterns of Cu in the roots and leaves of B. carinata plants. The plants were treated with 30 μM or 150 μM CuSO 4 or CuEDDS in hydroponic solution. Quantitative Cu distribution maps and concentration profiles across root and leaf cross-sections of the desorbed plants were obtained by micro-proton induced X-ray emission. In roots, the 30 μM treatments with both CuSO 4 and CuEDDS resulted in higher Cu concentrations in epidermal/cortical regions. At 150 μM CuSO 4 , Cu was mainly accumulated in root vascular bundles, whereas with 150 μM CuEDDS, Cu was detected in endodermis and the adjacent inner cortical cell layer. Under all treatments, except with a H + -ATP-ase inhibitor, the Cu in leaves was localised mainly in vascular tissues. The incubation of plants with 150 μM CuEDDS enhanced metal translocation to shoots, in comparison to the corresponding CuSO 4 treatment. Inhibition of H + -ATPase activity resulted in reduced Cu accumulation in 30 μM CuEDDS-treated roots and 150 μM CuEDDS-treated leaves, and induced changes in Cu distribution in the leaves. This indicates that active mechanisms are involved in retaining Cu in the leaf vascular tissues, which prevent its transport to photosynthetically active tissues. The physiological significance of EDDS-assisted Cu uptake is discussed. - Highlights: ► We localised Cu in Brassica carinata treated with CuSO 4 or CuEDDS by micro-PIXE. ► EDDS-assisted Cu uptake and transport resulted in preserved root endodermis. ► EDDS enhanced Cu transport from roots to shoots. ► Cu sequestration within leaf veins

  10. Organic acids, amino acids compositions in the root exudates and Cu-accumulation in castor (Ricinus communis L.) Under Cu stress.

    Science.gov (United States)

    Huang, Guoyong; Guo, Guangguang; Yao, Shiyuan; Zhang, Na; Hu, Hongqing

    2016-01-01

    Ricinus communis L. is a hyperaccumulation plant newly discovered in an abandoned land of Cu mine in China. A hydroponic experiment was then carried out to determine the root exudates in the Cu-tolerant castor (Ricinus communis L.). Plants were grown in nutrient solution with increasing level of Cu doses (0, 100, 250, 500, and 750 μmol/L Cu) in the form of CuSO4. Cu accumulation in the roots and shoots of castor, and root exudates collected from the castor were measured. The results indicated that the castor had a high Cu accumulation capacity and the Cu concentrations in the shoots and roots of the castor treated with 750 μmol/L Cu were 177.1, 14586.7 mg/kg, respectively. Tartaric was the largest in the root exudates in terms of concentrations, which reached up to 329.13 μmol/g (dry plant) in the level of 750 μmol/L Cu. There was a significantly positive linear relationship between the Cu concentration in root and the concentration of succinic (R = 0.92, P < 0.05), tartaric (R = 0.96, P < 0.01), and citric (R = 0.89, P < 0.05). These results indicated that the difference in root exudation from castor could affect their Cu tolerance. What is more, significant is that the high tartaric and citric, the low oxalic and cysteine in the root exudation of castor contributed to toleration of high Cu concentrations.

  11. Cu-Zr-Ag bulk metallic glasses based on Cu8Zr5 icosahedron

    International Nuclear Information System (INIS)

    Xia Junhai; Qiang Jianbing; Wang Yingmin; Wang Qing; Dong Chuang

    2007-01-01

    Based on the cluster line criterion, the Ag addition into the Cu 8 Zr 5 cluster composition is investigated for the search of ternary Cu-Zr-Ag bulk metallic glasses with high glass forming abilities. Two initial binary compositions Cu 0.618 Zr 0.382 and Cu 0.64 Zr 0.36 are selected. The former one corresponds to a deep eutectic point; it is also the composition of the Cu 8 Zr 5 icosahedron, which is derived from the Cu 8 Zr 3 structure. The latter one, which can be regarded as the Cu 8 Zr 5 cluster plus a glue atom Cu, is the best glass-forming composition in the Cu-Zr binary system. Two composition lines (Cu 0.618 Zr 0.382 ) 1-x Ag x and (Cu 0.64 Zr 0.36 ) 1-x Ag x are thus constructed in the Cu-Zr-Ag system by linking these two compositions with the third constitute Ag. A series of Cu-Zr-Ag bulk metallic glasses are found with 2-8 at.% Ag contents in both composition lines. The optimum composition (Cu 0.618 Zr 0.382 ) 0.92 Ag 0.08 within the searched region with the highest T g /T l = 0.633, is located along the cluster line (Cu 0.618 Zr 0.382 ) 1-x Ag x , where the deep eutectic Cu 0.618 Zr 0.382 exactly corresponds to the dense packing cluster Cu 8 Zr 5 . The alloying mechanism is discussed in the light of atomic size and electron concentration factors

  12. Stability enhancement of Cu2S against Cu vacancy formation by Ag alloying

    Science.gov (United States)

    Barman, Sajib K.; Huda, Muhammad N.

    2018-04-01

    As a potential solar absorber material, Cu2S has proved its importance in the field of renewable energy. However, almost all the known minerals of Cu2S suffer from spontaneous Cu vacancy formation in the structure. The Cu vacancy formation causes the structure to possess very high p-type doping that leads the material to behave as a degenerate semiconductor. This vacancy formation tendency is a major obstacle for this material in this regard. A relatively new predicted phase of Cu2S which has an acanthite-like structure was found to be preferable than the well-known low chalcocite Cu2S. However, the Cu-vacancy formation tendency in this phase remained similar. We have found that alloying silver with this structure can help to reduce Cu vacancy formation tendency without altering its electronic property. The band gap of silver alloyed structure is higher than pristine acanthite Cu2S. In addition, Cu diffusion in the structure can be reduced with Ag doped in Cu sites. In this study, a systematic approach is presented within the density functional theory framework to study Cu vacancy formation tendency and diffusion in silver alloyed acanthite Cu2S, and proposed a possible route to stabilize Cu2S against Cu vacancy formations by alloying it with Ag.

  13. Characterization of p-CuI prepared by the SILAR technique on Cu-tape/n-CuInS2 for solar cells

    International Nuclear Information System (INIS)

    Sankapal, B.R.; Ennaoui, A.; Guminskaya, T.; Dittrich, Th.; Bohne, W.; Roehrich, J.; Strub, E.; Lux-Steiner, M.Ch.

    2005-01-01

    CuI has been synthesized at room temperature on Cu-tape/n-CuInS 2 by using the SILAR technique (successive ionic layer adsorption and reaction). The influence of wet chemical iodine treatment on the CuI has been investigated in more detail. The films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), elastic recoil detection analysis (ERDA) and surface photovoltage (SPV) techniques. The CuI films contain the no. gammano. -phase of the Zinkblende structure. The crystallites are preferentially oriented in the (111) direction. After wet chemical iodine treatment, the fibrous surface morphology changed to a more dense CuI film with larger crystallites. Oxides could not be detected on the CuI surface. The density of surface states of CIS decreased after the CuI deposition. The importance of the wet chemical iodine treatment for the performance of Cu-tape/n-CuInS 2 /p-CuI solar cells has been demonstrated

  14. Cu diffusion as an alternative method for nanopatterned CuTCNQ film growth

    International Nuclear Information System (INIS)

    Capitán, M J; Álvarez, J; Miranda, R; Navío, C

    2016-01-01

    In this paper we show by means of ‘in situ’ x-ray diffraction studies that CuTCNQ formation from Cu(solid)–TCNQ(solid tetracyanoquinodimethane) goes through Cu diffusion at room temperature. The film quality depends on the TCNQ evaporation rate. At low evaporation rate we get a single phase-I CuTCNQ film very well crystallized and well oriented. The film has a CuTCNQ(0 2 0) orientation. The film is formed by CuTCNQ nanorods of a very homogeneous size. The film homogeneity has also been seen by atomic force microscopy (AFM). The electronic properties of the film have been measured by x-ray photoelectron spectroscopy (XPS) and ultra-violet photoelectron spectroscopy (UPS). Thus, the Cu-diffusion method has arisen as a very simple, clean and efficient method to grow localized CuTCNQ nanorods on Cu, opening up new insights for technological applications. (paper)

  15. Complete Fabrication of a Traversable 3 µm Thick NbN Film Superconducting Coil with Cu plated layer of 42m in Length in a Spiral Three-Storied Trench Engraved in a Si Wafer of 76.2 mm in Diameter Formed by MEMS Technology for a Compact SMES with High Energy Storage Volume Density

    Science.gov (United States)

    Suzuki, Yasuhiro; Iguchi, Nobuhiro; Adachi, Kazuhiro; Ichiki, Akihisa; Hioki, Tatsumi; Hsu, Che-Wei; Sato, Ryoto; Kumagai, Shinya; Sasaki, Minoru; Noh, Joo-Hyong; Sakurahara, Yuuske; Okabe, Kyohei; Takai, Osamu; Honma, Hideo; Watanabe, Hideo; Sakoda, Hitoshi; Sasagawa, Hiroaki; Doy, Hideyuki; Zhou, Shuliang; Hori, H.; Nishikawa, Shigeaki; Nozaki, Toshihiro; Sugimoto, Noriaki; Motohiro, Tomoyoshi

    2017-09-01

    Based on the concept of a novel approach to make a compact SMES unit composed of a stack of Si wafers using MEMS process proposed previously, a complete fabrication of a traversable 3 µam thick NbN film superconducting coil lined with Cu plated layer of 42m in length in a spiral three-storied trench engraved in and extended over a whole Si-wafer of 76.2 mm in diameter was attained for the first time. With decrease in temperature, the DC resistivity showed a metallic decrease indicating the current pass was in the Cu plated layer and then made a sudden fall to residual contact resistance indicating the shift of current pass from the Cu plated layer to the NbN film at the critical temperature Tc of 15.5K by superconducting transition. The temperature dependence of I-V curve showed the increase in the critical current with decrease in the temperature and the highest critical current measured was 220 mA at 4K which is five times as large as that obtained in the test fabrication as the experimental proof of concept presented in the previous report. This completion of a one wafer superconducting NbN coil is an indispensable step for the next proof of concept of fabrication of series-connected two wafer coils via superconductive joint which will read to series connected 600 wafer coils finally, and for replacement of NbN by high Tc superconductor such as YBa2Cu3O7-x for operation under the cold energy of liquid hydrogen or liquid nitrogen.

  16. Controllable synthesis and enhanced photocatalytic properties of Cu2O/Cu31S16 composites

    International Nuclear Information System (INIS)

    Liu, Xueqin; Li, Zhen; Zhang, Qiang; Li, Fei

    2012-01-01

    Highlights: ► Facile sonochemical route. ► The content of Cu 31 S 16 in the Cu 2 O/Cu 31 S 16 can be easily controlled. ► Structure and optical properties of Cu 2 O/Cu 31 S 16 were discussed. ► Enhanced photocatalytic property of Cu 2 O/Cu 31 S 16 . ► Cu 2 O/Cu 31 S 16 core/shell structures were more stable than single Cu 2 O particles. -- Abstract: The controlled synthesis of Cu 2 O/Cu 31 S 16 microcomposites with hierarchical structures had been prepared via a convenient sonochemical route. Ultrasonic irradiation of a mixture of Cu 2 O and (NH 2 ) 2 CS in an aqueous medium yielded Cu 2 O/Cu 31 S 16 composites. The content of Cu 31 S 16 in the Cu 2 O/Cu 31 S 16 can be easily controlled by adjusting the synthesis time. The Cu 31 S 16 layer not only protected and stabilized Cu 2 O particles, but also prohibited the recombination of photogenerated electrons–holes pair between Cu 31 S 16 and Cu 2 O. X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), Fourier transform infrared spectroscopy (FTIR) spectra, ultraviolet–visible (UV–Vis) spectroscopy and photoluminescence (PL) spectroscopy were used to characterize the products. Photocatalytic performance of the Cu 2 O/Cu 31 S 16 hierarchical structures was evaluated by measuring the decomposition rate of methyl orange solution under natural light. To the best of our knowledge, this is the first report on the preparation and photocatalytic activity of Cu 2 O/Cu 31 S 16 microcomposite. Additionally, the Cu 2 O/Cu 31 S 16 core/shell structures were more stable than single Cu 2 O particles during photocatalytic process since the photocatalytic activity of the second reused architecture sample was much higher than that of pure Cu 2 O. The Cu 2 O/Cu 31 S 16 microcomposites may be a good promising candidate for wastewater treatment.

  17. Advances in Cost-Efficient Thin-Film Photovoltaics Based on Cu(In,Ga)Se2

    OpenAIRE

    Michael Powalla; Stefan Paetel; Dimitrios Hariskos; Roland Wuerz; Friedrich Kessler; Peter Lechner; Wiltraud Wischmann; Theresa Magorian Friedlmeier

    2017-01-01

    In this article, we discuss the leading thin-film photovoltaic (PV) technology based on the Cu(In,Ga)Se2 (CIGS) compound semiconductor. This contribution includes a general comparison with the conventional Si-wafer-based PV technology and discusses the basics of the CIGS technology as well as advances in world-record-level conversion efficiency, production, applications, stability, and future developments with respect to a flexible product. Once in large-scale mass production, the CIGS techno...

  18. Growth and characterisation of potentiostatically electrodeposited Cu2O and Cu thin films

    International Nuclear Information System (INIS)

    Wijesundera, R.P.; Hidaka, M.; Koga, K.; Sakai, M.; Siripala, W.

    2006-01-01

    Cuprous oxide and copper thin films were potentiostatically electrodeposited in an acetate bath. Voltammetric curves were used to investigate the growth parameters; deposition potential, pH and temperature of the bath. Deposition potential dependency on the structural, morphological, optical and electronic properties of the films were investigated by the X-ray diffraction measurements, scanning electron micrographs, absorption measurements and dark and light current-voltage characterisations. It was observed that single phase polycrystalline Cu 2 O can be deposited from 0 to - 300 mV Vs saturated calomel electrode (SCE) and co-deposition of Cu and Cu 2 O starts at - 400 mV Vs SCE. Further increase in deposition potential from - 700 mV Vs SCE produces single phase Cu thin films. Single phase polycrystalline Cu 2 O thin films with cubic grains of 1-2 μm can be possible within the very narrow potential domain around - 200 mV Vs SCE. Enhanced photoresponse in a photoelectrochemical cell is produced by the Cu 2 O thin film prepared at - 400 mV Vs SCE, where Cu is co-deposited with Cu 2 O with random distribution of Cu spheres on the Cu 2 O surface. This study reveals that a single deposition bath can be used to deposit both Cu and Cu 2 O separately and an admixture of Cu-Cu 2 O by controlling the deposition parameters

  19. Spectroscopic study of the CuO chains in YBa2Cu3O7-x

    International Nuclear Information System (INIS)

    Edwards, H.; Derro, D.J.; Barr, A.L.; Markert, J.T.; de Lozanne, A.L.

    1996-01-01

    We interpret our previously published results obtained using a technique called current-imaging tunneling spectroscopy (CITS) to study the detailed electronic structure of the CuO chains in the high-temperature superconductor YBa 2 Cu 3 O 7-x near the Fermi level. Our CITS data comprise sequences of 32 simultaneously obtained images taken at bias voltages ranging from -78 to 72 mV. Cross sections of the CITS data, normalized-conductance analysis, and logarithmic-derivative analysis allow us to examine in detail the behavior of electronic modulations along the CuO chains and the energy gap in the CuO chains of YBa 2 Cu 3 O 7-x . This new analysis lends a strong foundation to our previous interpretation of the CITS data [H. L. Edwards et al., Phys. Rev. Lett. 75, 1387 (1995)]. copyright 1996 American Vacuum Society

  20. Role of dopants in LiF:Mg,Cu, LiF:Mg,P and LiF:Mg,Cu,P detectors

    International Nuclear Information System (INIS)

    Mohammadi, Kh.; Moussavi Zarandi, A.; Afarideh, H.; Shahmaleki, S.

    2013-01-01

    In this study, electronic structure of LiF crystal doped with Mg,Cu,P impurities was studied with WIEN2k code on the basis of FPLAPW+lo method. Results show that in Mg-doped LiF composition, an electronic trap was created with impurity concentration of 1.56% and 3.125%. In this condition, the electronic trap with increasing the percentage of the impurities up to 4.687% is annihilated. It was found, that by doping of Mg and Cu or P simultaneously, a hole-trap is created in valence band. It was realized that in LiF:Mg,Cu, LiF:Mg,P and LiF:Mg,Cu,P, Cu impurity and Li atom, have a key role in creation of levels which lead to create electronic and hole traps. Mg impurity and F atom, only have a role in creation of electronic traps. In addition, P impurity has a main role in creation of the electronic and hole traps in LiF:Mg,Cu,P. The activation energy of electronic and hole trap in LiF:Mg,Cu, LiF:Mg,P and LiF:Mg,Cu,P crystalline lattice were obtained as 0.3 and 5.5 eV, 0.92 and 3.4 eV and 0.75 and 3.1 eV, respectively. - Graphical abstract: Figure (a) and (b) shows changes in electronic structure and band gap energy of LiF crystal due to presence of Mg and Cu, Mg and P ions respectively. - Highlights: • Electronic structure of LiF, LiF:Mg,Cu, LiF:Mg,P and LiF:Mg,Cu,P materials were studied with WIEN2K code. • In LiF:Mg,Cu and LiF:Mg,Cu,P, Li atom and Cu impurity have a key role in creation of levels. • F atom and Mg impurity only have a role in creation of electronic traps. • In LiF:Mg,Cu,P, P impurity has a main role in creation of electronic and hole traps

  1. Synthesis of Cu/Cu2O nanoparticles by laser ablation in deionized water and their annealing transformation into CuO nanoparticles

    KAUST Repository

    Gondal, M. A.; Qahtan, Talal F.; Dastageer, Mohamed Abdulkader; Maganda, Yasin W.; Anjum, Dalaver H.

    2013-01-01

    Nano-structured Cupric Oxide (CuO) has been synthesized using pulsed laser ablation of pure copper in water using Q-switched pulsed laser beam of 532 nm wavelength and, 5 nanosecond pulse duration and laser pulse energy of 100 mJ/pulse. In the initial unannealed colloidal suspension, the nanoparticles of Copper (Cu) and Cuprious oxide (Cu2O) were identified. Further the suspension was dried and annealed at different temperatures and we noticed the product (Cu/Cu2O) was converted predominantly into CuO at annealing temperature of 300 'C for 3 hours. As the annealing temperature was raised from 300 to 900 'C, the grain sizes of CuO reduced to the range of 9 to 26 nm. The structure and the morphology of the prepared samples were investigated using X-ray diffraction and Transmission Electron Microscope. Photoluminescence and UV absorption spectrometrystudies revealed that the band gap and other optical properties of nano-structured CuO were changed due to post annealing. Fourier transform spectrometry also confirmed the transformation of Cu/Cu2O into CuO. Copyright © 2013 American Scientific Publishers All rights reserved.

  2. Synthesis of Cu/Cu2O nanoparticles by laser ablation in deionized water and their annealing transformation into CuO nanoparticles

    KAUST Repository

    Gondal, M. A.

    2013-08-01

    Nano-structured Cupric Oxide (CuO) has been synthesized using pulsed laser ablation of pure copper in water using Q-switched pulsed laser beam of 532 nm wavelength and, 5 nanosecond pulse duration and laser pulse energy of 100 mJ/pulse. In the initial unannealed colloidal suspension, the nanoparticles of Copper (Cu) and Cuprious oxide (Cu2O) were identified. Further the suspension was dried and annealed at different temperatures and we noticed the product (Cu/Cu2O) was converted predominantly into CuO at annealing temperature of 300 \\'C for 3 hours. As the annealing temperature was raised from 300 to 900 \\'C, the grain sizes of CuO reduced to the range of 9 to 26 nm. The structure and the morphology of the prepared samples were investigated using X-ray diffraction and Transmission Electron Microscope. Photoluminescence and UV absorption spectrometrystudies revealed that the band gap and other optical properties of nano-structured CuO were changed due to post annealing. Fourier transform spectrometry also confirmed the transformation of Cu/Cu2O into CuO. Copyright © 2013 American Scientific Publishers All rights reserved.

  3. Chemical synthesis of flower-like hybrid Cu(OH)2/CuO electrode: Application of polyvinyl alcohol and triton X-100 to enhance supercapacitor performance.

    Science.gov (United States)

    Shinde, S K; Fulari, V J; Kim, D-Y; Maile, N C; Koli, R R; Dhaygude, H D; Ghodake, G S

    2017-08-01

    In this research article, we report hybrid nanomaterials of copper hydroxide/copper oxide (Cu(OH) 2 /CuO). A thin films were prepared by using a facile and cost-effective successive ionic layer adsorption and reaction (SILAR) method. As-synthesized and hybrid Cu(OH) 2 /CuO with two different surfactants polyvinyl alcohol (PVA) and triton-X 100 (TRX-100) was prepared having distinct morphological, structural, and supercapacitor properties. The surface of the thin film samples were examined by scanning electron microscopy (SEM). A nanoflower-like morphology of the Cu(OH) 2 /CuO nanostructures arranged vertically was evidenced on the stainless steel substrate. The surface was well covered by nanoflake-like morphology and formed a uniform Cu(OH) 2 /CuO nanostructures after treating with surfactants. X-ray diffraction patterns were used to confirm the hybrid phase of Cu(OH) 2 /CuO materials. The electrochemical properties of the pristine Cu(OH) 2 /CuO, PVA:Cu(OH) 2 /CuO, TRX-100:Cu(OH) 2 /CuO films were observed by cyclic voltammetry, galvanostatic charge/discharge, and electrochemical impedance spectroscopy technique. The electrochemical examination reveals that the Cu(OH) 2 /CuO electrode has excellent specific capacitance, 292, 533, and 443Fg -1 with pristine, PVA, and TRX-100, respectively in 1M Na 2 SO 4 electrolyte solution. The cyclic voltammograms (CV) of Cu(OH) 2 /CuO electrode shows positive role of the PVA and TRX-100 to enhance supercapacitor performance. Copyright © 2017 Elsevier B.V. All rights reserved.

  4. Local Environment Sensitivity of the Cu K-Edge XANES Features in Cu-SSZ-13: Analysis from First-Principles.

    Science.gov (United States)

    Zhang, Renqin; McEwen, Jean-Sabin

    2018-05-22

    Cu K-edge X-ray absorption near-edge spectra (XANES) have been widely used to study the properties of Cu-SSZ-13. In this Letter, the sensitivity of the XANES features to the local environment for a Cu + cation with a linear configuration and a Cu 2+ cation with a square-linear configuration in Cu-SSZ-13 is reported. When a Cu + cation is bonded to H 2 O or NH 3 in a linear configuration, the XANES has a strong peak at around 8983 eV. The intensity of this peak decreases as the linear configuration is broken. As for the Cu 2+ cations in a square-planar configuration with a coordination number of 4, two peaks at around 8986 and 8993 eV are found. An intensity decrease for both peaks at around 8986 and 8993 eV is found in an NH 3 _4_Z 2 Cu model as the N-Cu-N angle changes from 180 to 100°. We correlate these features to the variation of the 4p state by PDOS analysis. In addition, the feature peaks for both the Cu + cation and Cu 2+ cation do not show a dependence on the Cu-N bond length. We further show that the feature peaks also change when the coordination number of the Cu cation is varied, while these feature peaks are independent of the zeolite topology. These findings help elucidate the experimental XANES features at an atomic and an electronic level.

  5. TPD IR studies of CO desorption from zeolites CuY and CuX

    Science.gov (United States)

    Datka, Jerzy; Kozyra, Paweł

    2005-06-01

    The desorption of CO from zeolites CuY and CuX was followed by TPD-IR method. This is a combination of temperature programmed desorption and IR spectroscopy. In this method, the status of activated zeolite (before adsorption), the process of adsorption, and the status of adsorbed molecules can be followed by IR spectroscopy, and the process of desorption (with linear temperature increase) can be followed both by IR spectroscopy and by mass spectrometry. IR spectra have shown two kinds of Cu + sites in both CuY and CuX. Low frequency (l.f.) band (2140 cm -1 in CuY and 2130 cm -1 in CuX) of adsorbed CO represents Cu + sites for which π back donation is stronger and σ donation is weaker whereas high frequency h.f. band (2160 cm -1 in CuY and 2155 cm -1 in CuX) represent Cu + sites for which π back donation is weaker and σ donation is stronger. The TPD-IR experiments evidenced that the Cu + sites represented by l.f. band bond CO more weakly than those represented by h.f. one, indicating that σ donation has more important impact to the strength of Cu +-CO bonding. On the contrary, π back donation has bigger contribution to the activation of adsorbed molecules.

  6. High spin states in 62Cu

    International Nuclear Information System (INIS)

    Tsan Ung Chan; Agard, M.; Bruandet, J.F.; Giorni, A.; Glasser, F.; Longequeue, J.P.; Morand, C.

    1977-06-01

    The 62 Cu nucleus has been studied via the reactions 60 Ni(α,pnγ), 63 Cu(p,pnγ), 52 Cr( 14 N,2p2nγ) using different in beam γ-spectroscopy techniques. The intensity of the principal γ-lines observed in different reactions leading to the 62 Cu has been compared. A brief discussion is made in terms of the independent particle model. A level scheme including levels with spin up to 9 + is proposed [fr

  7. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  8. Changes in serum selenium, copper, zinc levels and cu/zn ratio in patients with pulmonary tuberculosis during therapy.

    Science.gov (United States)

    Ciftci, T Ulukavak; Ciftci, B; Yis, O; Guney, Y; Bilgihan, A; Ogretensoy, M

    2003-10-01

    The effectiveness and success of antituberculosis therapy is mainly measured by its ability to identify the organism in the sputum. In certain cases, available tuberculosis tests are not satisfactory and do not provide enough information on the effectiveness of antituberculosis therapy. Copper (Cu), zinc (Zn), and selenium (Se) are the essential elements that play a crucial role in the immune system. The serum levels of these elements vary in many diseases including tuberculosis. In this study, we investigate whether the serum levels of Cu, Zn, and Se change during antituberculosis therapy. We have included 22 pulmonary tuberculosis cases that were newly diagnosed with positive sputum and 18 healthy subjects. At the beginning and 2 mo after therapy, serum levels of Cu, Zn, and Se were measured by atomic absorption spectrometry. Despite Se and Cu levels not being affected during the treatment, we found that there was a significant increase in the levels of Zn and a decrease in the Cu/Zn ratio. Serum Zn levels and the Cu/Zn ratio could be used as a valuable laboratory tool for the clinicians to assess response to therapy or effectiveness of the ongoing antituberculosis therapy.

  9. Effect of 67Cu and 99Mo labeled tetrathiomolybdate on the distribution of 67Cu, Cu, and 99Mo in bile fractions in sheep

    International Nuclear Information System (INIS)

    Gooneratne, R.; Laarveld, B.; Christensen, D.

    1989-01-01

    The effect of intravenous administration of 67 Cu and 99 Mo labeled tetrathiomolybdate (TTM) on the appearance of 67 Cu, stable Cu, and 99 Mo in gel chromatographic fractions of bile was examined in sheep fed either 5 or 35 mg Cu kg-1 DM. Peak excretory periods of biliary 67 Cu, stable Cu, and 99 Mo were observed at 30 min-1.25 hr, 2-3 hr, and 11-13 hr after 67 Cu and after 99 Mo labeled TTM. Sephadex G-75 gel filtration of bile samples collected at 1, 3, and 12 hr after 67 Cu administration revealed two major protein peaks of molecular weights of greater than 80,000 (peak I) and 7,000 (peak II) containing both 67 Cu and Cu. But the ratio of 67 Cu in the two peaks varied with time of bile collection. The ratio of areas of peak I:II 1 hr after 67 Cu administration was approximately 0.48; at 3 hr, 0.62, and at 12 hr 1.35. Tetrathiomolybdate administration increased both 67 Cu and stable Cu in bile by severalfold and induced a major shift of Cu into the higher molecular weight protein fraction. The experiments confirm the effectiveness of TTM as a ''decoppering'' agent. Furthermore, TTM not only promoted bile Cu excretion, but it also increased the incorporation of Cu into the macromolecular fraction. This may limit enterohepatic circulation of biliary Cu and thereby cause an overall Cu depletion and a negative Cu balance

  10. Characterization of Cu-exchanged SSZ-13: a comparative FTIR, UV-Vis, and EPR study with Cu-ZSM-5 and Cu-β with similar Si/Al and Cu/Al ratios

    DEFF Research Database (Denmark)

    Giordanino, Filippo; Vennestrøm, Peter N. R.; Lundegaard, Lars Fahl

    2013-01-01

    concentration of reduced copper centres, i.e. isolated Cu+ ions located in different environments, able to form Cu+(N2), Cu+(CO)n (n = 1, 2, 3), and Cu+(NO)n (n = 1, 2) upon interaction with N2, CO and NO probe molecules, respectively. Low temperature FTIR, DRUV-Vis and EPR analysis on O2 activated samples...... an intense and finely structured d–d quadruplet, unique to Cu-SSZ-13, which is persistent under SCR conditions. This differs from the 22 700 cm−1 band of the mono(μ-oxo)dicopper species of the O2 activated Cu-ZSM-5, which disappears under SCR conditions. The EPR signal intensity sets Cu-β apart from...

  11. Characterization of p-CuI prepared by the SILAR technique on Cu-tape/n-CuInS{sub 2} for solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Sankapal, B.R. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany)]. E-mail: brsankapal@rediffmail.com; Ennaoui, A. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany); Guminskaya, T. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany); Dittrich, Th. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany); Bohne, W. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany); Roehrich, J. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany); Strub, E. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany); Lux-Steiner, M.Ch. [Hahn-Meitner-Institut, Glienicker Strasse 100, D-14109, Berlin (Germany)

    2005-06-01

    CuI has been synthesized at room temperature on Cu-tape/n-CuInS{sub 2} by using the SILAR technique (successive ionic layer adsorption and reaction). The influence of wet chemical iodine treatment on the CuI has been investigated in more detail. The films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), elastic recoil detection analysis (ERDA) and surface photovoltage (SPV) techniques. The CuI films contain the no. gammano. -phase of the Zinkblende structure. The crystallites are preferentially oriented in the (111) direction. After wet chemical iodine treatment, the fibrous surface morphology changed to a more dense CuI film with larger crystallites. Oxides could not be detected on the CuI surface. The density of surface states of CIS decreased after the CuI deposition. The importance of the wet chemical iodine treatment for the performance of Cu-tape/n-CuInS{sub 2}/p-CuI solar cells has been demonstrated.

  12. Direct Observation of Reduction of Cu(II) to Cu(I) by Terminal Alkynes

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Guanghui; Yi, Hong; Zhang, Guoting; Deng, Yi; Bai, Ruopeng; Zhang, Heng; Miller, Jeffrey T.; Kropf, Arthur J.; Bunel, Emilio E.; Lei, Aiwen

    2014-01-06

    ABSTRACT: X-ray absorption spectroscopy and in situ electron paramagnetic resonance evidence were provided for the reduction of Cu(II) to Cu(I) species by alkynes in the presence of tetramethylethylenediamine (TMEDA), in which TMEDA plays dual roles as both ligand and base. The structures of the starting Cu(II) species and the obtained Cu(I) species were determined as (TMEDA)- CuCl2 and [(TMEDA)CuCl]2 dimer, respectively.

  13. New Production Routes for Medical Isotopes 64Cu and 67Cu Using Accelerator Neutrons

    Science.gov (United States)

    Kin, Tadahiro; Nagai, Yasuki; Iwamoto, Nobuyuki; Minato, Futoshi; Iwamoto, Osamu; Hatsukawa, Yuichi; Segawa, Mariko; Harada, Hideo; Konno, Chikara; Ochiai, Kentaro; Takakura, Kosuke

    2013-03-01

    We have measured the activation cross sections producing 64Cu and 67Cu, promising medical radioisotopes for molecular imaging and radioimmunotherapy, by bombarding a natural zinc sample with 14 MeV neutrons. We estimated the production yields of 64Cu and 67Cu by fast neutrons from \\text{natC(d,n) with 40 MeV 5 mA deuterons. We used the present result together with the evaluated cross section of Zn isotopes. The calculated 64Cu yield is 1.8 TBq (175 g 64Zn) for 12 h of irradiation; the yields of 67Cu by 67Zn(n,p)67Cu and 68Zn(n,x)67Cu were 249 GBq (184 g 67Zn) and 287 GBq (186 g 68Zn) at the end of 2 days of irradiation, respectively. From the results, we proposed a new route to produce 67Cu with very little radionuclide impurity via the 68Zn(n,x)67Cu reaction, and showed the 64Zn(n,p)64Cu reaction to be a promising route to produce 64Cu. Both 67Cu and 64Cu are noted to be produced using fast neutrons.

  14. The influence of dietary Cu and diabetes on tissue 67Cu retention kinetics in rats

    International Nuclear Information System (INIS)

    Uriu-Hare, J.Y.; Rucker, R.B.; Keen, C.L.

    1991-01-01

    Compared to controls, diabetes results in higher plasma, liver and kidney Cu concentrations. Since alterations in Cu metabolism may be associated with diabetic pathology, the authors investigated how Cu metabolism is affected by diabetes and dietary Cu intake. Nondiabetic and STZ diabetic rats were fed Cu suppl. or Cu def. diets for 5 wks. Rats were intubated with 28 μCi 67 Cu and killed after 8, 16, 24, 32, 64, or 128 h. There were marked effects of both diet and diabetes on 67 Cu metabolism. Independent of diabetes, deficient rats had a higher % of retained 67 Cu, in liver, plasma, RBC, muscle, spleen, brain, lung, uterus, and intestine than adequate Cu rats. Independent of dietary Cu, diabetic rats had a lower % of retained 67 Cu in liver, plasma, RBC, muscle, spleen, lung, bone, pancreas, skin, uterus and heart than controls. Differential effects were noted for kidney; adequate Cu diabetic rats had a higher % of retained 67 Cu than all other groups. Marked effects of both diet and diabetes were evident when tissue Cu turnover was examined. Compared to Cu suppl. rats, Cu def. rats had a slower turnover of 67 Cu, in liver, plasma, intestine, pancreas, eye, brain, muscle, spleen, lung and heart. Diabetic rats had a slower turnover of 67 Cu than nondiabetic rats in liver, plasma, intestine, pancreas, eye, kidney, RBC and uterus. The data imply that a focus on Cu metabolism with regard to cellular Cu trafficking and pathology may be warranted

  15. Evaluation of [64Cu]Cu-DOTA and [64Cu]Cu-CB-TE2A Chelates for Targeted Positron Emission Tomography with an αvβ6-Specific Peptide

    Directory of Open Access Journals (Sweden)

    Sven H. Hausner

    2009-03-01

    Full Text Available Significant upregulation of the integrin αvβ6 has been described as a prognostic indicator in several cancers, making it an attractive target for tumor imaging. This study compares variants of a PEGylated αvβ6-targeting peptide, bearing either an [>18F]fluorobenzoyl prosthetic group ([18F]FBA-PEG-A20FMDV2 or different [64Cu]copper chelators (DOTA-PEG-A20FMDV2, CB-TE2A-PEG-A20FMDV2. The compounds were evaluated in vitro by enzyme-linked immunosorbent assay (against the integrin αvβ6 and the closely related integrin αvβ6 and by cell labeling (αvβ6-positive DX3puroβ6/αvβ6-negative DX3puro and in vivo using micro-positron emission tomography in a mouse model bearing paired DX3puroβ6/Dx3puro xenografts. In vitro, all three compounds showed excellent αvβ6-specific binding (50% inhibitory concentration [IC50](αvβ6 = 3 to g nmol/L; IC50(αvβ3 > 10 (μmol/L. In vivo, they displayed comparable, preferential uptake for the αvβ6-expressmg xenograft over the αvβ6-negative control (> 4:1 ratio at 4 hours postinjection. Whereas [64Cu]Cu-DOTA-PEG-A20FMDV2 resulted in increased levels of radioactivity in the liver, [64Cu]Cu-CB-TE2A-PEG-A20FMDV2 did not. Significantly, both 64Cu-labeled tracers showed unexpectedly high and persistent levels of radioactivity in the kidneys (> 40% injected dose/g at 4 and 12 hours postinjection. The findings underscore the potential influence of the prosthetic group on targeted in vivo imaging of clinically relevant markers such as αvβ6. Despite identical targeting peptide moiety and largely equal in vitro behavior, both 64Cu-labeled tracers displayed inferior pharmacokinetics, making them in their present form less suitable candidates than the 18F-labeled tracer for in vivo imaging of αvβ6

  16. Copper interactions in TlCu7S4 and TlCu7Se4

    International Nuclear Information System (INIS)

    Noren, L.; Delaplane, R.G.; Berger, R.

    1999-01-01

    Complete text of publication follows. The copper chalcogenides ACu 7 S 4 (A=NH 4 + , Tl + , Rb + ) are quasi-one-dimensional metals at ambient and higher temperatures which is due to the high mobility of copper in these structures. TlCu 7 S 4 and TlCu 7 Se 4 are isostructural compounds, space group I4/m, which can be described on the basis of a TlX 8 cube with two different Cu sites, Cu(1) and Cu(2). Cu(2)-Cu(2) zigzag chains run along the c axis with only 3/4 occupation of the Cu(2) sites. However, these two compounds differ in behaviour on cooling. The sulphide shows a polymorphic first-order transition to the CsAg 7 S 4 type (P4/n) owing to ordering of the vacancies in the Cu(2)-Cu(2) chains. In order to study the nature of the Cu(2) order/disorder in the two title compounds, a series of neutron diffraction measurements (both Bragg and diffuse scattering) were made at several temperatures from 40 to 713 K on the instrument SLAD at Studsvik. The structure at each temperature was modelled using RMC techniques. The resulting configuration show that as the temperature increases, there is a marked increase in the mobility of the Cu atoms in the Cu(2)-Cu(2) chains for TlCu 7 S 4 but not for TlCu 7 Se 4 . This is due to the initial difference in the Cu(2)-Cu(2) distances, only 2.2A for the thiocuprate, but 2.7A in the selenocuprate which explains the relative ease for Cu(2) ordering in the latter case. (author)

  17. Behavior of CuP and OFHC Cu anodes under electrodeposition conditions

    Energy Technology Data Exchange (ETDEWEB)

    Frankel, G.S.; Schrott, A.G.; Horkans, J.; Andricacos, P.C. (International Business Machines Corp., Yorktown Heights, NY (United States). Thomas J. Watson Research Center); Isaacs, H.S. (Brookhaven National Lab., Upton, NY (United States))

    1992-01-01

    Films formed on CuP (with 0.05 wt % P) and OFHC Cu anodes in electroplating solutions were studied by X-ray Photoelectron Spectroscopy, X-ray Absorption Spectroscopy, electrochemical methods, and a newly developed gravimetric technique. The black film formed on CuP in Cl-containing solutions was found to resemble a porous sponge composed of CuCl but laden/with concentrated CuSO{sub 4} solution. The difference between the buoyancy-corrected measured mass change and the charge-equivalent mass change was found to have two components: a reversible part that comes and goes as the current is turned on and off, and an irreversible part that remains on the surface and increase in mass with time. The irreversible part results from the anodic film, which increases linearly with charge density but independent of current density. The reversible part of the mass change arises from the weight of the diffusion layer. In contrast to CuP, OFHC Cu releases much more Cu{sup +1} during anodic polarization and forms a poorly-adherent anodic film that is considerably heavier than the black film for a given charge density.

  18. Behavior of CuP and OFHC Cu anodes under electrodeposition conditions

    Energy Technology Data Exchange (ETDEWEB)

    Frankel, G.S.; Schrott, A.G.; Horkans, J.; Andricacos, P.C. [International Business Machines Corp., Yorktown Heights, NY (United States). Thomas J. Watson Research Center; Isaacs, H.S. [Brookhaven National Lab., Upton, NY (United States)

    1992-08-01

    Films formed on CuP (with 0.05 wt % P) and OFHC Cu anodes in electroplating solutions were studied by X-ray Photoelectron Spectroscopy, X-ray Absorption Spectroscopy, electrochemical methods, and a newly developed gravimetric technique. The black film formed on CuP in Cl-containing solutions was found to resemble a porous sponge composed of CuCl but laden/with concentrated CuSO{sub 4} solution. The difference between the buoyancy-corrected measured mass change and the charge-equivalent mass change was found to have two components: a reversible part that comes and goes as the current is turned on and off, and an irreversible part that remains on the surface and increase in mass with time. The irreversible part results from the anodic film, which increases linearly with charge density but independent of current density. The reversible part of the mass change arises from the weight of the diffusion layer. In contrast to CuP, OFHC Cu releases much more Cu{sup +1} during anodic polarization and forms a poorly-adherent anodic film that is considerably heavier than the black film for a given charge density.

  19. In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints

    Science.gov (United States)

    Yao, Takafumi; Matsuda, Tomoki; Sano, Tomokazu; Morikawa, Chiaki; Ohbuchi, Atsushi; Yashiro, Hisashi; Hirose, Akio

    2018-04-01

    A bonding method utilizing redox reactions of metallic oxide microparticles achieves metal-to-metal bonding in air, which can be alternative to lead-rich high-melting point solder. However, it is known that the degree of the reduction of metallic oxide microparticles have an influence on the joint strength using this bonding method. In this paper, the reduction behavior of CuO paste and its effect on Cu-to-Cu joints were investigated through simultaneous microstructure-related x-ray diffraction and differential scanning calorimetry measurements. The CuO microparticles in the paste were gradually reduced to submicron Cu2O particles at 210-250°C. Subsequently, Cu nanoparticles were generated instantaneously at 300-315°C. There was a marked difference in the strengths of the joints formed at 300°C and 350°C. Thus, the Cu nanoparticles play a critical role in sintering-based bonding using CuO paste. Furthermore, once the Cu nanoparticles have formed, the joint strength increases with higher bonding temperature (from 350°C to 500°C) and pressure (5-15 MPa), which can exceed the strength of Pb-5Sn solder at higher temperature and pressure.

  20. CuGaTe2-CuAlTe2 system

    International Nuclear Information System (INIS)

    Bodnar', I.V.

    2003-01-01

    The results of studies on the chemical interaction in the CuGaTe 2 -CuAlTe 2 as well as on the thermal and optical properties of the formed solid solutions are presented. It is shown, that continuous number of solid solutions are formed in the CuGaTe 2 -CuAlTe 2 system, which crystallize in the chalcopyrite structure. The diagram of state of this system is plotted. The thermal expansion of these materials is studied through the dilatometric method. The linear dependence of the thermal expansion coefficient on the composition is established. The concentration dependences of the forbidden zone width diverge from the linearity [ru

  1. The effect of inducing uniform Cu growth on formation of electroless Cu seed layer

    International Nuclear Information System (INIS)

    Lim, Taeho; Kim, Myung Jun; Park, Kyung Ju; Kim, Kwang Hwan; Choe, Seunghoe; Lee, Young-Soo; Kim, Jae Jeong

    2014-01-01

    The uniformity of Cu growth on Pd nanocatalysts was controlled by using organic additives in the formation of electroless Cu seed layers. Polyethylene glycol (PEG, Mw. 8000) not only reduced the deposition rate but also improved the uniformity of Cu growth on each Pd nanocatalyst during the seed layer formation. The stronger suppression effect of PEG on Cu than on Pd reduced the difference in the deposition rate between the two surfaces, resulting in the uniform deposition. Meanwhile, bis(3-sulfopropyl) disulfide degraded the uniformity by strong and nonselective suppression. The sheet resistance measurement and atomic force microscopy imaging revealed that the uniform Cu growth by PEG was more advantageous for the formation of a thin and smooth Cu seed layer than the non-uniform growth. The uniform Cu growth also had a positive influence on the subsequent Cu electrodeposition: the 60-nm-thick electrodeposited Cu film on the Cu seed layer showed low resistivity (2.70 μΩ·cm), low surface roughness (6.98 nm), and good adhesion strength. - Highlights: • Uniform Cu growth on Pd was achieved in formation of electroless Cu seed layer. • PEG addition to electroless bath improved the uniformity of Cu growth on Pd. • A thin, smooth and continuous Cu seed layer was obtained with PEG. • Adhesion strength of the Cu seed layer was also improved with PEG. • The uniformity improvement positively affected subsequent Cu electrodeposition

  2. Use of micro-PIXE to determine spatial distributions of copper in Brassica carinata plants exposed to CuSO{sub 4} or CuEDDS

    Energy Technology Data Exchange (ETDEWEB)

    Cestone, Benedetta, E-mail: benedettacestone@yahoo.it [Department of Biology of Crop Plants, University of Pisa, Via del Borghetto 80, 56121 Pisa (Italy); Vogel-Mikus, Katarina [Department of Biology, Biotechnical Faculty, University of Ljubljana, Vecna pot 111, S1-1000 Ljubljana (Slovenia); Quartacci, Mike Frank [Department of Biology of Crop Plants, University of Pisa, Via del Borghetto 80, 56121 Pisa (Italy); Rascio, Nicoletta [Department of Biology, University of Padova, Via Ugo Bassi 58/B, 35121 Padova (Italy); Pongrac, Paula [Department of Biology, Biotechnical Faculty, University of Ljubljana, Vecna pot 111, S1-1000 Ljubljana (Slovenia); Pelicon, Primoz; Vavpetic, Primoz; Grlj, Natasa; Jeromel, Luka; Kump, Peter; Necemer, Marijan [Jozef Stefan Institute, Jamova 39, 1000 Ljubljana (Slovenia); Regvar, Marjana [Department of Biology, Biotechnical Faculty, University of Ljubljana, Vecna pot 111, S1-1000 Ljubljana (Slovenia); Navari-Izzo, Flavia [Department of Biology of Crop Plants, University of Pisa, Via del Borghetto 80, 56121 Pisa (Italy)

    2012-06-15

    A better understanding of the mechanisms that govern copper (Cu) uptake, distribution and tolerance in Brassica carinata plants in the presence of chelators is needed before significant progress in chelate-assisted Cu phytoextraction can be made. The aims of this study were therefore to characterise (S,S)-N,N Prime -ethylenediamine disuccinic acid (EDDS)-assisted Cu uptake, and to compare the spatial distribution patterns of Cu in the roots and leaves of B. carinata plants. The plants were treated with 30 {mu}M or 150 {mu}M CuSO{sub 4} or CuEDDS in hydroponic solution. Quantitative Cu distribution maps and concentration profiles across root and leaf cross-sections of the desorbed plants were obtained by micro-proton induced X-ray emission. In roots, the 30 {mu}M treatments with both CuSO{sub 4} and CuEDDS resulted in higher Cu concentrations in epidermal/cortical regions. At 150 {mu}M CuSO{sub 4}, Cu was mainly accumulated in root vascular bundles, whereas with 150 {mu}M CuEDDS, Cu was detected in endodermis and the adjacent inner cortical cell layer. Under all treatments, except with a H{sup +}-ATP-ase inhibitor, the Cu in leaves was localised mainly in vascular tissues. The incubation of plants with 150 {mu}M CuEDDS enhanced metal translocation to shoots, in comparison to the corresponding CuSO{sub 4} treatment. Inhibition of H{sup +}-ATPase activity resulted in reduced Cu accumulation in 30 {mu}M CuEDDS-treated roots and 150 {mu}M CuEDDS-treated leaves, and induced changes in Cu distribution in the leaves. This indicates that active mechanisms are involved in retaining Cu in the leaf vascular tissues, which prevent its transport to photosynthetically active tissues. The physiological significance of EDDS-assisted Cu uptake is discussed. - Highlights: Black-Right-Pointing-Pointer We localised Cu in Brassica carinata treated with CuSO{sub 4} or CuEDDS by micro-PIXE. Black-Right-Pointing-Pointer EDDS-assisted Cu uptake and transport resulted in preserved root

  3. Positive XPS binding energy shift of supported Cu{sub N}-clusters governed by initial state effects

    Energy Technology Data Exchange (ETDEWEB)

    Peters, S.; Peredkov, S. [Technische Universität Berlin, IOAP, Strasse des 17. Juni 135, 10623 Berlin (Germany); Al-Hada, M. [Department of Physics, College of Education and Linguistics, University of Amran (Yemen); Neeb, M., E-mail: matthias.neeb@helmholtz-berlin.de [Helmholtz-Zentrum Berlin, Wilhelm-Conrad-Röntgen-Campus Adlershof, Elektronenspeicherring BESSY II, Albert-Einstein-Straße 15, 12489 Berlin (Germany); Eberhardt, W. [Technische Universität Berlin, IOAP, Strasse des 17. Juni 135, 10623 Berlin (Germany); DESY, Center for Free Electron Laser Science (CFEL), Notkestr. 85, 22607 Hamburg (Germany)

    2014-01-01

    Highlights: • Size dependent initial and final state effects of mass-selected deposited clusters. • Initial state effect dominates positive XPS shift in supported Cu-clusters. • Size dependent Coulomb correlation shift in the Auger final state of Cu cluster. • Size-dependent Auger parameter analysis. • Positive XPS shift differs from negative surface core level shift in crystalline copper. - Abstract: An initial state effect is established as origin for the positive 2p core electron binding energy shift found for Cu{sub N}-clusters supported by a thin silica layer of a p-doped Si(1 0 0) wafer. Using the concept of the Auger parameter and taking into account the usually neglected Coulomb correlation shift in the Auger final state (M{sub 4,5}M{sub 4,5}) it is shown that the initial state shift is comparable to the measured XPS shift while the final state relaxation shift contributes only marginally to the binding energy shift. The cluster results differ from the negative surface core-level shift of crystalline copper which has been explained in terms of a final state relaxation effect.

  4. Subcellular differences in handling Cu excess in three freshwater fish species contributes greatly to their differences in sensitivity to Cu

    International Nuclear Information System (INIS)

    Eyckmans, Marleen; Blust, Ronny; De Boeck, Gudrun

    2012-01-01

    Since changes in metal distribution among tissues and subcellular fractions can provide insights in metal toxicity and tolerance, we investigated this partitioning of Cu in gill and liver tissue of rainbow trout (Oncorhynchus mykiss), common carp (Cyprinus carpio) and gibel carp (Carassius auratus gibelio). These fish species are known to differ in their sensitivity to Cu exposure with gibel carp being the most tolerant and rainbow trout the most sensitive. After an exposure to 50 μg/l (0.79 μM) Cu for 24 h, 3 days, 1 week and 1 month, gills and liver of control and exposed fish were submitted to a differential centrifugation procedure. Interestingly, there was a difference in accumulated Cu in the three fish species, even in control fishes. Where the liver of rainbow trout showed extremely high Cu concentrations under control conditions, the amount of Cu accumulated in their gills was much less than in common and gibel carp. At the subcellular level, the gills of rainbow trout appeared to distribute the additional Cu exclusively in the biologically active metal pool (BAM; contains heat-denaturable fraction and organelle fraction). A similar response could be seen in gill tissue of common carp, although the percentage of Cu in the BAM of common carp was lower compared to rainbow trout. Gill tissue of gibel carp accumulated more Cu in the biologically inactive metal pool (BIM compared to BAM; contains heat-stable fraction and metal-rich granule fraction). The liver of rainbow trout seemed much more adequate in handling the excess Cu (compared to its gills), since the storage of Cu in the BIM increased. Furthermore, the high % of Cu in the metal-rich granule fraction and heat-stable fraction in the liver of common carp and especially gibel carp together with the better Cu handling in gill tissue, pointed out the ability of the carp species to minimize the disadvantages related to Cu stress. The differences in Cu distribution at the subcellular level of gills and

  5. Subcellular differences in handling Cu excess in three freshwater fish species contributes greatly to their differences in sensitivity to Cu

    Energy Technology Data Exchange (ETDEWEB)

    Eyckmans, Marleen, E-mail: marleen.eyckmans@ua.ac.be [Laboratory for Ecophysiology, Biochemistry and Toxicology, University of Antwerp, Groenenborgerlaan 171, 2020 Antwerp (Belgium); Blust, Ronny; De Boeck, Gudrun [Laboratory for Ecophysiology, Biochemistry and Toxicology, University of Antwerp, Groenenborgerlaan 171, 2020 Antwerp (Belgium)

    2012-08-15

    Since changes in metal distribution among tissues and subcellular fractions can provide insights in metal toxicity and tolerance, we investigated this partitioning of Cu in gill and liver tissue of rainbow trout (Oncorhynchus mykiss), common carp (Cyprinus carpio) and gibel carp (Carassius auratus gibelio). These fish species are known to differ in their sensitivity to Cu exposure with gibel carp being the most tolerant and rainbow trout the most sensitive. After an exposure to 50 {mu}g/l (0.79 {mu}M) Cu for 24 h, 3 days, 1 week and 1 month, gills and liver of control and exposed fish were submitted to a differential centrifugation procedure. Interestingly, there was a difference in accumulated Cu in the three fish species, even in control fishes. Where the liver of rainbow trout showed extremely high Cu concentrations under control conditions, the amount of Cu accumulated in their gills was much less than in common and gibel carp. At the subcellular level, the gills of rainbow trout appeared to distribute the additional Cu exclusively in the biologically active metal pool (BAM; contains heat-denaturable fraction and organelle fraction). A similar response could be seen in gill tissue of common carp, although the percentage of Cu in the BAM of common carp was lower compared to rainbow trout. Gill tissue of gibel carp accumulated more Cu in the biologically inactive metal pool (BIM compared to BAM; contains heat-stable fraction and metal-rich granule fraction). The liver of rainbow trout seemed much more adequate in handling the excess Cu (compared to its gills), since the storage of Cu in the BIM increased. Furthermore, the high % of Cu in the metal-rich granule fraction and heat-stable fraction in the liver of common carp and especially gibel carp together with the better Cu handling in gill tissue, pointed out the ability of the carp species to minimize the disadvantages related to Cu stress. The differences in Cu distribution at the subcellular level of gills

  6. Phase relationships in Cu-rich corner of the Cu-Cr-Zr phase diagram

    International Nuclear Information System (INIS)

    Zeng, K.J.; Haemaelaeinen, M.; Lilius, K.

    1995-01-01

    In the available experimental information on the Cu-Cr-Zr ternary system, there exist different opinions concerning the phase relationships in the Cu-rich corner of Cu-Cr-Zr phase diagram. Glazov et al. and Zakharov et al. investigated the Cu-rich corner of the Cu-Cr-Zr phase diagram within the composition range up to 3.5 Cr and 3.5 Zr (wt. %). A quasi-eutectic reaction L → (Cu) + αCr 2 Zr was observed to occur at 1,020 C and several isothermal sections were constructed within the temperature range from 600 to 1,000 C to show the (Cu)-αCr 2 Zr two phase equilibrium. Therefore, a pseudobinary Cu-Cr 2 Zr system was supposed. Afterwards, Dawakatsu et al, Fedorov et al, and Kuznetsov et al studied the cu-rich corner of the phase diagram in a wider composition range up to 5 Cr and 20 Zr (at.%). Contrary to Glazov et al. and Zakharov et al., they found no Cr 2 Zr phase in their samples. Hence, the pseudobinary Cu-Cr 2 Zr system does not exist. In this study an experimental investigation is presented on the phase relationships in Cu-rich corner of the Cu-Cr-Zr phase diagram at 940 C in order to clear up the confusion

  7. Hydrodynamic evolution and jet energy loss in Cu + Cu collisions

    International Nuclear Information System (INIS)

    Schenke, Bjoern; Jeon, Sangyong; Gale, Charles

    2011-01-01

    We present results from a hybrid description of Cu + Cu collisions using (3 + 1)-dimensional hydrodynamics (music) for the bulk evolution and a Monte Carlo simulation (martini) for the evolution of high-momentum partons in the hydrodynamical background. We explore the limits of this description by going to small system sizes and determine the dependence on different fractions of wounded nucleon and binary collisions scaling of the initial energy density. We find that Cu + Cu collisions are well described by the hybrid description at least up to 20% central collisions.

  8. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

    Science.gov (United States)

    Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

    2012-04-01

    The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

  9. Cu and Cu-Based Nanoparticles: Synthesis and Applications in Catalysis.

    Science.gov (United States)

    Gawande, Manoj B; Goswami, Anandarup; Felpin, François-Xavier; Asefa, Tewodros; Huang, Xiaoxi; Silva, Rafael; Zou, Xiaoxin; Zboril, Radek; Varma, Rajender S

    2016-03-23

    The applications of copper (Cu) and Cu-based nanoparticles, which are based on the earth-abundant and inexpensive copper metal, have generated a great deal of interest in recent years, especially in the field of catalysis. The possible modification of the chemical and physical properties of these nanoparticles using different synthetic strategies and conditions and/or via postsynthetic chemical treatments has been largely responsible for the rapid growth of interest in these nanomaterials and their applications in catalysis. In addition, the design and development of novel support and/or multimetallic systems (e.g., alloys, etc.) has also made significant contributions to the field. In this comprehensive review, we report different synthetic approaches to Cu and Cu-based nanoparticles (metallic copper, copper oxides, and hybrid copper nanostructures) and copper nanoparticles immobilized into or supported on various support materials (SiO2, magnetic support materials, etc.), along with their applications in catalysis. The synthesis part discusses numerous preparative protocols for Cu and Cu-based nanoparticles, whereas the application sections describe their utility as catalysts, including electrocatalysis, photocatalysis, and gas-phase catalysis. We believe this critical appraisal will provide necessary background information to further advance the applications of Cu-based nanostructured materials in catalysis.

  10. Changes in urinary Cu, Zn, and Se levels in cancer patients after treatment with Sha Shen Mai Men Dong Tang

    Directory of Open Access Journals (Sweden)

    Tung-Yuan Lai

    2016-04-01

    Full Text Available Sha Shen Mai Men Dong Tang (SMD-2; 沙參麥冬湯 shā shēn mài dōng tāng is a Chinese medicinal herb (CMH; 中草藥 zhōng cǎo yào used to treat symptoms associated with cancer therapy. The objective of this study was to assess the effect of SMD-2 on the levels of urinary copper (Cu, zinc (Zn, and selenium (Se in lung cancer patients and head and neck cancer patients receiving chemoradiotherapy. Forty-two head and neck cancer patients and 10 lung cancer patients participated in our clinical trial. Each patient received chemoradiotherapy for 4 weeks. In addition, each patient was treated with SMD-2 for 8 weeks, including 2 weeks prior to and after the chemoradiotherapy treatment. Comparison of urinary Cu, Zn, and Se levels and the ratios of Zn to Cu and Se to Cu at three time points in the two types of cancer were assessed using the generalized estimating equations (GEEs. After the patients received chemoradiotherapy for 4 weeks, SMD-2 treatment was found to be associated with a significant decrease in urinary Cu levels, whereas urinary Zn and Se levels increased significantly. In addition, the ratios of Zn to Cu and Se to Cu in the urine samples of these patients also increased significantly. Both the urinary Zn levels and the ratio of Zn to Cu in head and neck cancer patients were significantly higher than in lung cancer patients. Urinary Zn and Se levels and the ratios of Zn to Cu and Se to Cu, but not urinary Cu levels, increased significantly during and after treatment when assessed using the GEE model. The SMD-2 treatments significantly increased Zn and Se levels in the urine of head and neck cancer patients. Increased Zn and Se levels in urine strengthened immune system.

  11. Cu uptake and turnover in both Cu-acclimated and non-acclimated rainbow trout (Oncorhynchus mykiss)

    DEFF Research Database (Denmark)

    Grosell, M.; Hogstrand, C.; Wood, C.M.

    1997-01-01

    -acclimation clearly involves changes in copper accumulation kinetics in the plasma. The acclimated fish showed a 65% reduced Cu-64 accumulation after 65 h and an increased turnover of Cu in the plasma compared to the non-acclimated fish. Total Cu in the plasma increased by 59% after 3 h of exposure in the non...... aortic catheter. By measuring both Cu-64 accumulation and total Cu concentrations, we were able to analyse the ongoing uptake and turnover of ambient Cu, independent of any Cu already present in the fish. Plasma accounted for at least 90% of the Cu-64 labelled Cu present in the blood and Cu...... h of exposure. Acclimation did not have an unambiguous effect on branchial Cu uptake and differences in branchial uptake could not explain the reduced accumulation in the plasma. The rapidly exchangeable Cu pools were 54% in the gills and 33% in the liver, suggesting a considerable hepatic Cu...

  12. The crystal structure of (Nb$_{0.75}$Cu$_{0.25}$)Sn$_{2}$ in the Cu-Nb-Sn system

    CERN Document Server

    Martin, Stefan; Nolze, Gert; Leineweber, Andreas; Leaux, Floriane; Scheuerlein, Christian

    2017-01-01

    During the processing of superconducting Nb$_{3}$Sn wire, several intermediate intermetallic phases including a previously encountered Cu-Nb-Sn phase show up. The yet unknown crystal structure of this phase is now identified by a combination of different experimental techniques and database search to be of the hexagonal NiMg2 type with a proposed composition of about (Nb0.75Cu0.25)Sn2. The structure determination started from an evaluation of the lattice parameters from EBSD Kikuchi patterns from quenched material suggesting hexagonal or orthorhombic symmetry. A database search then led to the hexagonal NiMg2 type structure, the presence of which was confirmed by a Rietveld analysis on the basis of high energy synchrotron X-ray powder diffraction data. Assuming a partial substitution of Nb in orthorhombic NbSn2 by Cu, the change of the valence electron concentration provokes a structural transformation from the CuMg2 type for NbSn2 to the NiMg2 type for (Nb0.75Cu0.25)Sn2. In the previous literature the (Nb0.7...

  13. CuO cauliflowers for supercapacitor application: Novel potentiodynamic deposition

    International Nuclear Information System (INIS)

    Dubal, Deepak P.; Gund, Girish S.; Lokhande, Chandrakant D.; Holze, Rudolf

    2013-01-01

    Graphical abstract: Schematic experimental setup used for the potentiodynamic mode of electrodeposition for the synthesis of CuO cauliflower onto stainless steel substrate. Highlights: ► Synthesis of CuO using potentiodynamic mode of electrodeposition. ► Uniformly spread cauliflower-like nanostructure. ► CuO cauliflowers provide high specific capacitance with good stability. ► CuO cauliflowers show high power and energy density values. -- Abstract: In present investigation, synthesis and characterization of novel cauliflower-like copper oxide (CuO) and its electrochemical properties have been performed. The utilized CuO cauliflowers were prepared by potentiodyanamic mode from an aqueous alkaline bath. X-ray diffraction pattern confirm the formation of monoclinic CuO cauliflowers. Scanning electron micrograph analysis reveals that CuO cauliflowers are uniformly spread all over the substrate surface with the surface area of 49 m 2 g −1 with bimodal pore size distribution. Electrochemical analysis shows that CuO cauliflower exhibits high specific capacitance of 179 Fg −1 in 1 M Na 2 SO 4 electrolyte with 81% capacity retention after 2000 cycles. The Ragone plot discovers better power and energy densities of cauliflowers-like CuO sample. Present investigation illustrates that the potentiodynamic approach for the direct growth of cauliflower-like CuO is simple and cost-effective and can be applied for synthesis of other metal oxides, polymers etc.

  14. Bimetallic AgCu/Cu2O hybrid for the synergetic adsorption of iodide from solution.

    Science.gov (United States)

    Mao, Ping; Liu, Ying; Liu, Xiaodong; Wang, Yuechan; Liang, Jie; Zhou, Qihang; Dai, Yuexuan; Jiao, Yan; Chen, Shouwen; Yang, Yi

    2017-08-01

    To further improve the capacity of Cu 2 O to absorb I - anions from solution, and to understand the difference between the adsorption mechanisms of Ag/Cu 2 O and Cu/Cu 2 O adsorbents, bimetallic AgCu was doped into Cu 2 O through a facile solvothermal route. Samples were characterized and employed to adsorb I - anions under different experimental conditions. The results show that the Cu content can be tuned by adding different volumes of Ag sols. After doping bimetallic AgCu, the adsorption capacity of the samples can be increased from 0.02 mmol g -1 to 0.52 mmol g -1 . Moreover, the optimal adsorption is reached within only 240 min. Meanwhile, the difference between the adsorption mechanisms of Ag/Cu 2 O and Cu/Cu 2 O adsorbents was verified, and the cooperative adsorption mechanism of the AgCu/Cu 2 O hybrid was proposed and verified. In addition, the AgCu/Cu 2 O hybrid showed excellent selectivity, e.g., its adsorption efficiencies are 85.1%, 81.9%, 85.9% and 85.7% in the presence of the Cl - , CO 3 2- , SO 4 2- and NO 3 - competitive anions, respectively. Furthermore, the AgCu/Cu 2 O hybrid can worked well in other harsh environments (e.g., acidic, alkaline and seawater environments). Therefore, this study is expected to promote the development of Cu 2 O into a highly efficient adsorbent for the removal of iodide from solution. Copyright © 2017 Elsevier Ltd. All rights reserved.

  15. Detection of trace contamination of copper on a silicon wafer with TXRF

    International Nuclear Information System (INIS)

    Yamada, T.; Matsuo, M.; Kohno, H.; Mori, Y.

    2000-01-01

    The element copper on silicon wafers is one of the most important metals to be detected among the contamination in semiconductor industries. When W-Lβ 1 (9.67 keV) line is used for the excitation in TXRF instrument and when Si(Li) is used as its detector, an escape peak appears at 7.93 keV which is close to the energy of Cu-Kα line(8.04 keV). When the concentration of copper is lower than 10 10 atoms/cm 2 , accurate quantitative analysis is difficult because of the overlapping of the peaks. When Au-Lβ 1 line(11.44 keV) is used for the excitation, the escape peak appears at 9.70 keV which is far enough from the energy of Cu-Ka line. We prepared silicon wafers intentionally contaminated with copper in a low concentration range of 10 8 to 10 10 atoms/cm 2 and measured them with a TXRF instrument having Au-Lβ 1 line for excitation. The contaminated samples were made with IAP method and their Cu concentrations were calibrated with VPD-AAS method (recovery solution: 2 % HF + 2 % H 2 O 2 ). A figure shows the correlation between the results with TXRF and those with AAS. The horizontal axis is the value of concentration decided by AAS and the vertical axis is the intensity of Cu-Kα line measured with the TXRF. Six wafers of different concentration were used and five points on each wafer including the center were measured with TXRF. Five points at each concentration in the figure correspond to the results measured on one wafer. Intensities of Cu-Kα line are weak in these low concentration ranges but the background of them are also very small (less than 0.05 cps). Therefore the peak of Cu-Kα line can be distinguished from the background. It can be said that a calibration curve can be drawn to the middle range of 10 9 atoms/cm 2 . The same samples were measured with another TXRF instrument having W-Lβ 1 line for excitation. It was difficult to draw a calibration curve in this case. We will present both results taken with Au-Lβ 1 line and with W-Lβ 1 line. (author)

  16. Preparation and characterization of CuO nanowire arrays

    International Nuclear Information System (INIS)

    Yu Dongliang; Ge Chuannan; Du Youwei

    2009-01-01

    CuO nanowire arrays were prepared by oxidation of copper nanowires embedded in anodic aluminum oxide (AAO) membranes. The AAO was fabricated in an oxalic acid at a constant voltage. Copper nanowires were formed in the nanopores of the AAO membranes in an electrochemical deposition process. The oxidized copper nanowires at different temperatures were studied. X-ray diffraction patterns confirmed the formation of a CuO phase after calcining at 500 0 C in air for 30 h. A transmission electron microscopy was used to characterize the nanowire morphologies. Raman spectra were performed to study the CuO nanowire arrays. After measuring, we found that the current-voltage curve of the CuO nanowires is nonlinear.

  17. Crystallization and electrical resistivity of Cu2O and CuO obtained by thermal oxidation of Cu thin films on SiO2/Si substrates

    International Nuclear Information System (INIS)

    De Los Santos Valladares, L.; Salinas, D. Hurtado; Dominguez, A. Bustamante; Najarro, D. Acosta; Khondaker, S.I.; Mitrelias, T.; Barnes, C.H.W.; Aguiar, J. Albino; Majima, Y.

    2012-01-01

    In this work, we study the crystallization and electrical resistivity of the formed oxides in a Cu/SiO 2 /Si thin film after thermal oxidation by ex-situ annealing at different temperatures up to 1000 °C. Upon increasing the annealing temperature, from the X ray diffractogram the phase evolution CuCu + Cu 2 O → Cu 2 O → Cu 2 O + CuO → CuO was detected. Pure Cu 2 O films are obtained at 200 °C, whereas uniform CuO films without structural surface defects such as terraces, kinks, porosity or cracks are obtained in the temperature range 300–550 °C. In both oxides, crystallization improves with annealing temperature. A resistivity phase diagram, which is obtained from the current–voltage response, is presented here. The resistivity was expected to increase linearly as a function of the annealing temperature due to evolution of oxides. However, anomalous decreases are observed at different temperatures ranges, this may be related to the improvement of the crystallization and crystallite size when the temperature increases. - Highlights: ► The crystallization and electrical resistivity of oxides in a Cu films are studied. ► In annealing Cu films, the phase evolution Cu + Cu 2 O → Cu 2 O → Cu 2 O + CuO → CuO occurs. ► A resistivity phase diagram, obtained from the current–voltage response, is presented. ► Some decreases in the resistivity may be related to the crystallization.

  18. Monte Carlo Study of the Fish-like Patterns of Anthracenes on Cu(111)

    Science.gov (United States)

    Kim, Kwangmoo; Einstein, T. L.; Sun, Dezheng; Kim, Dae-Ho; Bartels, Ludwig

    2011-03-01

    Using Monte Carlo calculations of the two-dimensional triangular lattice with a 2-component 3-state Potts model, we demonstrate a mechanism for the spontaneous formation of fish-like patterns of anthracene (AC) molecules on Cu(111) by sputtering and annealing, then cooling to ~ 80 K. The two components are an AC on a hollow site and another on a bridge site of Cu(111). The liquid crystal model with two separate parts, positional and orientational, only explains a part of the fish-like pattern, not the whole regular pattern. Our model fixes the positional order of AC's into the triangular lattice and the orientational order into three angles as observed in the experiments. The variation of the coverages of AC's is reflected in the change of the ratio of two components in our model. We also try to understand the compression of AC's with the introduction of Gaussian dispersion of AC's about their triangular lattice sites. Supported primarily by NSF Grants CHE 07-50334 with a secondary support from NSF-MRSEC at the University of Maryland, DMR05-20471. Work at UCR supported primarily by NSF CHE 07-49949.

  19. Synthesis and characterization of Chitosan-CuO-MgO polymer nanocomposites

    Science.gov (United States)

    Praffulla, S. R.; Bubbly, S. G.

    2018-05-01

    In the present work, we have synthesized Chitosan-CuO-MgO nanocomposites by incorporating CuO and MgO nanoparticles in chitosan matrix. Copper oxide and magnesium oxide nanoparticles synthesized by precipitation method were characterized by X-ray diffraction and the diffraction patterns confirmed the monoclinic and cubic crystalline structures of CuO and MgO nanoparticles respectively. Chitosan-CuO-MgO composite films were prepared using solution- cast method with different concentrations of CuO and MgO nanoparticles (15 - 50 wt % with respect to chitosan) and characterized by XRD, FTIR and UV-Vis spectroscopy. The X-ray diffraction pattern shows that the crystallinity of the chitosan composite increases with increase in nanoparticle concentration. FTIR spectra confirm the chemical interaction between chitosan and metal oxide nanoparticles (CuO and MgO). UV absorbance of chitosan nanocomposites were up to 17% better than pure chitosan, thus confirming its UV shielding properties. The mechanical and electrical properties of the prepared composites are in progress.

  20. Adsorption and desorption of Cu2+ on paddy soil aggregates pretreated with different levels of phosphate.

    Science.gov (United States)

    Dai, Jun; Wang, Wenqin; Wu, Wenchen; Gao, Jianbo; Dong, Changxun

    2017-05-01

    Interactions between anions and cations are important for understanding the behaviors of chemical pollutants and their potential risks in the environment. Here we prepared soil aggregates of a yellow paddy soil from the Taihu Lake region, and investigated the effects of phosphate (P) pretreatment on adsorption-desorption of Cu 2+ of soil aggregates, free iron oxyhydrates-removed soil aggregates, goethite, and kaolinite with batch adsorption method. The results showed that Cu 2+ adsorption was reduced on the aggregates pretreated with low concentrations of P, and promoted with high concentrations of P, showing a V-shaped change. Compared with the untreated aggregates, the adsorption capacity of Cu 2+ was reduced when P application rates were lower than 260, 220, 130 and 110mg/kg for coarse, clay, silt and fine sand fractions, respectively. On the contrary, the adsorption capacity of Cu 2+ was higher on P-pretreated soil aggregates than on the control ones when P application rates were greater than those values. However, the desorption of Cu 2+ was enhanced at low levels of P, but suppressed at high levels of P, displaying an inverted V-shaped change over P adsorption. The Cu 2+ adsorption by the aggregate particles with and without P pretreatments was well described by the Freundlich equation. Similar results were obtained on P-pretreated goethite. However, such P effects on Cu 2+ adsorption-desorption were not observed on kaolinite and free iron oxyhydrates-removed soil aggregates. The present results indicate that goethite is one of the main soil substances responsible for the P-induced promotion and inhibition of Cu 2+ adsorption. Copyright © 2016. Published by Elsevier B.V.

  1. Approaching the limit of Cu(II)/Cu(I) mixed valency in a Cu(I)Br2-N-methylquinoxalinium hybrid compound.

    Science.gov (United States)

    Leblanc, Nicolas; Sproules, Stephen; Pasquier, Claude; Auban-Senzier, Pascale; Raffy, Helene; Powell, Annie K

    2015-08-18

    A novel 1D hybrid salt (MQ)[CuBr2]∞ (MQ = N-methylquinoxalinium) is reported. Structural, spectroscopic and magnetic investigations reveal a minimal Cu(II) doping of less than 0.1%. However it is not possible to distinguish Cu(I) and Cu(II). The unusually close packing of the organic moieties and the dark brown colour of the crystals suggest a defect electronic structure.

  2. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  3. Inelastic Neutron Scattering Cross Sections of Cu-63 and Cu-65 in the Energy Region 0.7 to 1.4 MeV

    Energy Technology Data Exchange (ETDEWEB)

    Holmqvist, B; Wiedling, T

    1964-08-15

    The gamma ray spectra from, the {sup 63}Cu (n, n'{gamma}) and {sup 65}Cu (n, n'{gamma}) reactions have been studied for seven neutron energies in the energy range 0.7 - 1.4 MeV using a Nal(Tl) scintillation spectrometer and time-of-flight techniques. Scatterers of natural copper have been used. Experimental excitation curves have been obtained for the two lowest excited levels in each of the Cu and Cu isotopes. The experimental (n, n') cross sections for the individual levels at 668 keV and 961 keV in {sup 63}Cu and 764 keV and 1114 keV in {sup 65}Cu have been compared to a modified Hauser-Feshbach theory for inelastic neutron scattering. This experiment has confirmed by other methods determined spins of these levels, i.e. 1/2{sup -} and 5/2{sup -} respectively.

  4. High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes

    Science.gov (United States)

    Ho, C. E.; Hsieh, W. Z.; Lee, P. T.; Huang, Y. H.; Kuo, T. T.

    2018-03-01

    Thermal reliability of Au/Pd/Cu and Au/Pd(4-6 wt.% P)/Cu trilayers in the isothermal annealing at 180 °C were investigated by X-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectrometry (TOF-SIMS), and transmission electron microscopy (TEM). The pure Pd film possessed a nanocrystalline structure with numerous grain boundaries, thereby facilitating the interdiffusion between Au and Cu. Out-diffusion of Cu through Pd and Au grain boundaries yielded a significant amount of Cu oxides (CuO and Cu2O) over the Au surface and gave rise to void formation in the Cu film. By contrast, the Pd(P) film was amorphous and served as a good diffusion barrier against Cu diffusion. The results of this study indicated that amorphous Pd(P) possessed better oxidation resistance and thermal reliability than crystalline Pd.

  5. Computer simulation of the structure of liquid metal halides RbBr, CuCl, CuBr, CuI, and AgBr

    International Nuclear Information System (INIS)

    Belashchenko, D.K.; Ostrovskij, O.I.

    2003-01-01

    The computerized models of the RbBr, AgBr, CuCl, CuBr and CuI liquid ion systems of 498 ions dimension are simulated at the temperatures of 753-960 K on the basis of the known diffraction data through the BELION algorithm. Good agreement of diffraction and model partial pair correlation functions (PPCF), excluding the PPCF first peaks heights, is obtained in all the cases. The simulation is carried out by the varied ion charges (the atomization energy values, close to the real ones, are obtained by ion charges ±1.00 for the RbBr, ±1.15 for AgBr, ±1.20 for CuCl, ±1.48 for CuBr and ±1.367 for CuI). The noncoulomb contributions in the interparticle potentials are calculated [ru

  6. Cu and Cu2O films with semi-spherical particles grown by electrochemical deposition

    International Nuclear Information System (INIS)

    Zheng, Jin You; Jadhav, Abhijit P.; Song, Guang; Kim, Chang Woo; Kang, Young Soo

    2012-01-01

    Cu and Cu 2 O films can be prepared on indium-doped tin oxide glass substrates by simple electrodeposition in a solution containing 0.1 M Cu(NO 3 ) 2 and 3 M lactic acid at different pH values. At low pH (pH = 1.2), the uniform Cu films were obtained; when pH ≥ 7, the pure Cu 2 O films can be deposited. Especially, at pH = 11, the deposited Cu 2 O films exhibited cubic surface morphology exposing mainly {100} plane; in contrast, the films consisting of semi-spherical particles were obtained when the solution was being stirred for 2 weeks prior to use. The possible growth process and mechanism were comparatively discussed. - Highlights: ► Cu and Cu 2 O films were prepared by facile electrodeposition. ► Electrodeposition was preformed in electrolyte at different pH values. ► Dendritic Cu films were obtained at 1.2 pH with relatively high deposition potential. ► Semi-spherical Cu 2 O films were obtained with solution at 11 pH and stirred for 2 weeks. ► The possible growth mechanism of semi-spherical Cu 2 O films was discussed.

  7. Comparison of trace element contamination levels (Cu, Zn, Fe, Cd ...

    African Journals Online (AJOL)

    Comparison of trace element contamination levels (Cu, Zn, Fe, Cd and Pb) in the soft tissues of the gastropods Tympanotonus fuscatus fuscatus and Tf radula collected in the Ebrié Lagoon (Côte d'Ivoire): Evidence of the risks linked to linked to lead and.

  8. The activation energy for loop growth in Cu and Cu-Ni alloys

    International Nuclear Information System (INIS)

    Barlow, P.; Leffers, T.; Singh, B.N.

    1978-08-01

    The apparent activation energy for the growth of interstitial dislocation loops in copper, Cu-1%Ni, Cu-2%Ni, and Cu-5%Ni during high voltage electron microscope irradiation was determined. The apparent activation energy for loop growth in all these materials can be taken to be 0.34eV+-0.02eV. This value together with the corresponding value of 0.44eV+-0.02eV determined earlier for Cu-10%Ni is discussed with reference to the void growth rates observed in these materials. The apparent activation energy for loop growth in copper (and in Cu-1%Ni that has a void growth rate similar to that in pure copper) is interpreted as twice the vacancy migration energy (indicating that divacancies do not play any significant role). For the materials with higher Ni content (in which the void growth rate is much lower than that in Cu and Cu-1%Ni) the measured apparent activation energy is interpreted to be characteristic of loops positioned fairly close to the foil surface and not of loops in ''bulk material''. From the present results in combination with the earlier results for Cu-10%Ni it is concluded that interstitial trapping is the most likely explanation of the reduced void growth rate in Cu-Ni alloys. (author)

  9. Giant Cu 2p Resonances in CuO Valence-Band Photoemission

    NARCIS (Netherlands)

    Tjeng, L.H.; Chen, C.T.; Ghijsen, J.; Rudolf, P.; Sette, F.

    1991-01-01

    We report the observation of a giant resonance in the Cu 2p resonant-photoemission spectra of CuO. The study allows the unambiguous identification of the local Cu 3d8 configuration in the valence-band photoemission spectrum, providing conclusive evidence for the charge-transfer nature of the

  10. CuO cauliflowers for supercapacitor application: Novel potentiodynamic deposition

    Energy Technology Data Exchange (ETDEWEB)

    Dubal, Deepak P., E-mail: deepak.dubal@chemie.tu-chemnitz.de [Technische Universität Chemnitz, Institut für Chemie, AG Elektrochemie, D-09107 Chemnitz (Germany); Gund, Girish S.; Lokhande, Chandrakant D. [Thin Film Physics Laboratory, Department of Physics, Shivaji University, Kolhapur, 416004 (M.S) (India); Holze, Rudolf, E-mail: rudolf.holze@chemie.tu-chemnitz.de [Technische Universität Chemnitz, Institut für Chemie, AG Elektrochemie, D-09107 Chemnitz (Germany)

    2013-02-15

    Graphical abstract: Schematic experimental setup used for the potentiodynamic mode of electrodeposition for the synthesis of CuO cauliflower onto stainless steel substrate. Highlights: ► Synthesis of CuO using potentiodynamic mode of electrodeposition. ► Uniformly spread cauliflower-like nanostructure. ► CuO cauliflowers provide high specific capacitance with good stability. ► CuO cauliflowers show high power and energy density values. -- Abstract: In present investigation, synthesis and characterization of novel cauliflower-like copper oxide (CuO) and its electrochemical properties have been performed. The utilized CuO cauliflowers were prepared by potentiodyanamic mode from an aqueous alkaline bath. X-ray diffraction pattern confirm the formation of monoclinic CuO cauliflowers. Scanning electron micrograph analysis reveals that CuO cauliflowers are uniformly spread all over the substrate surface with the surface area of 49 m{sup 2} g{sup −1} with bimodal pore size distribution. Electrochemical analysis shows that CuO cauliflower exhibits high specific capacitance of 179 Fg{sup −1} in 1 M Na{sub 2}SO{sub 4} electrolyte with 81% capacity retention after 2000 cycles. The Ragone plot discovers better power and energy densities of cauliflowers-like CuO sample. Present investigation illustrates that the potentiodynamic approach for the direct growth of cauliflower-like CuO is simple and cost-effective and can be applied for synthesis of other metal oxides, polymers etc.

  11. Diffusion of Cu+ in β-phase CuI

    International Nuclear Information System (INIS)

    Johansson, J.X.M.Z.; Skoeld, K.; Joergensen, J.E.

    1992-01-01

    Measurements of ionic diffusion of Cu + in solid CuI in the β-phase is carried out with a non-destructive radioactive tracer technique, utilizing coincidence counting of the annihilation gammas from the positron decay of 64 Cu. The diffusion coefficient and the activation energy for the diffusion are evaluated. The experimental results show distinct diffusion character in the β-phase which differs from those in the γ- and α-phases. The β-phase diffusion properties together with the previous results for γ-and α-phases will provide valuable guidance for MD calculations, in which the diffusion coefficients and activation energies have been overestimated and the γ-β phase transition does not appear. The ionic conductivity of CuI estimated from tracer diffusion results and the Nernst-Einstein relation are compared with values from electro-chemical methods. In all three phases the conductivities obtained from electro-chemical methods are much lower than those calculated from the measured tracer diffusion coefficients. (author). 7 refs.; 4 figs.; 2 tabs

  12. Self-assembled monolayer structures of hexadecylamine on Cu surfaces: density-functional theory.

    Science.gov (United States)

    Liu, Shih-Hsien; Balankura, Tonnam; Fichthorn, Kristen A

    2016-12-07

    We used dispersion-corrected density-functional theory to probe possible structures for adsorbed layers of hexadecylamine (HDA) on Cu(100) and Cu(111). HDA forms self-assembled layers on these surfaces, analogous to alkanethiols on various metal surfaces, and it binds by donating electrons in the amine group to the Cu surface atoms, consistent with experiment. van der Waals interactions between the alkyl tails of HDA molecules are stronger than the interaction between the amine group and the Cu surfaces. Strong HDA-tail interactions lead to coverage-dependent tilting of the HDA layers, such that the tilt angle is larger for lower coverages. At full monolayer coverage, the energetically preferred binding configuration for HDA on Cu(100) is a (5 × 3) pattern - although we cannot rule out incommensurate structures - while the pattern is preferred on Cu(111). A major motivation for this study is to understand the experimentally observed capability of HDA as a capping agent for producing {100}-faceted Cu nanocrystals. Consistent with experiment, we find that HDA binds more strongly to Cu(100) than to Cu(111). This strong binding stems from the capability of HDA to form more densely packed layers on Cu(100), which leads to stronger HDA-tail interactions, as well as the stronger binding of the amine group to Cu(100). We estimate the surface energies of HDA-covered Cu(100) and Cu(111) surfaces and find that these surfaces are nearly isoenergetic. By drawing analogies to previous theoretical work, it seems likely that HDA-covered Cu nanocrystals could have kinetic shapes that primarily express {100} facets, as is seen experimentally.

  13. Crystal structure, Raman scattering and magnetic properties of CuCr2-xZrxSe4 and CuCr2-xSnxSe4 selenospinels

    Science.gov (United States)

    Pinto, C.; Galdámez, A.; Barahona, P.; Moris, S.; Peña, O.

    2018-06-01

    Selenospinels, CuCr2-xMxSe4 (M = Zr and Sn), were synthesized via conventional solid-state reactions. The crystal structure of CuCr1.5Sn0.5Se4, CuCr1.7Sn0.3Se4, CuCr1.5Zr0.5Se4, and CuCr1.8Zr0.2Se4 were determined using single-crystal X-ray diffraction. All the phases crystallized in a cubic spinel-type structure. The chemical compositions of the single-crystals were examined using energy-dispersive X-ray analysis (EDS). Powder X-ray diffraction patterns of CuCr1.3Sn0.7Se4 and CuCr1.7Sn0.3Se4 were consistent with phases belonging to the Fd 3 bar m Space group. An analysis of the vibrational properties on the single-crystals was performed using Raman scattering measurements. The magnetic properties showed a spin glass behavior with increasing Sn content and ferromagnetic order for CuCr1.7Sn0.3Se4.

  14. Effect of Cu concentration on the formation of Cu{sub 1−x} Zn{sub x} shape memory alloy thin films

    Energy Technology Data Exchange (ETDEWEB)

    Karahan, İsmail Hakkı [Department of Physics, Mustafa Kemal University, Hatay 31000 (Turkey); Özdemir, Rasim, E-mail: ihkarahan@gmail.com [Department of Physics, Mustafa Kemal University, Hatay 31000 (Turkey); Kilis Vocational High School, Kilis 7 Aralık University, 79000 Kilis (Turkey)

    2014-11-01

    Highlights: • 3 different composition of Cu–Zn deposits successfully deposited from the non-cyanide sulphate electrolyte. • The homogeneous metal films and Cu–Zn alloys were electrodeposited on Al substrate. • The effect of Cu content was strongly effected structural and the electrical resistivity of Cu–Zn alloys. • The average crystallite size of the samples varied from 66 to 100 nm and decreased when Cu content in the electrolyte. • Microstrain has been decreased with increasing crystallite size. • Cyclic voltammetry of the electrolyte explained the characters of the baths. - Abstract: The Cu{sub x}Zn1−x (x = 0.06, 0.08, 0.1) deposits were fabricated by a electrodeposition method. The structural and electrical properties of the films were investigated by cyclic voltammetry (CV), X-ray diffraction (XRD), Scanning electron micrograph (SEM), and DC resistivity measurements. Phase identification of the samples was studied by the XRD patterns. XRD patterns shows the characteristics XRD peaks corresponding to the, β, and γ phases. The grain sizes of the samples were decreased whereas microstrain increased with the increase in Cu{sup 2+} substitution. The SEM study reveals the fine particle nature of the samples with increasing Cu content. DC resistivity indicates the metallic nature of the prepared samples. It has been found that the Cu ions have a critical influence on the resultant structure and resistivity properties of the Cu–Zn samples.

  15. Optical properties of CuCdTeO thin films sputtered from CdTe-CuO composite targets

    Energy Technology Data Exchange (ETDEWEB)

    Mendoza-Galván, A., E-mail: amendoza@qro.cinvestav.mx [Cinvestav-IPN, Unidad Querétaro, Libramiento Norponiente 2000, 76230 Querétaro (Mexico); Laboratory of Applied Optics, Department of Physics, Chemistry and Biology, Linköping University, SE-581 83 Linköping (Sweden); Arreola-Jardón, G. [Cinvestav-IPN, Unidad Querétaro, Libramiento Norponiente 2000, 76230 Querétaro (Mexico); Karlsson, L.H.; Persson, P.O.Å. [Thin Film Physics Division, Department of Physics, Chemistry and Biology, Linköping University, SE-581 83 Linköping (Sweden); Jiménez-Sandoval, S. [Cinvestav-IPN, Unidad Querétaro, Libramiento Norponiente 2000, 76230 Querétaro (Mexico)

    2014-11-28

    The effective complex dielectric function (ε) of Cu and O containing CdTe thin films is reported in the spectral range of 0.05 to 6 eV. The films were fabricated by rf sputtering from targets comprised by a mixture of CdTe and CuO powders with nominal Cu and O concentrations in the range of 2–10 at.%. Low concentration levels improved the crystalline quality of the films. Spectroscopic ellipsometry and transmittance measurements were used to determine ε. The critical point energies E{sub 1}, E{sub 1} + Δ{sub 1}, and E{sub 2} of CdTe are red-shifted with the incorporation of Cu and O. Also, an absorption band is developed in the infrared range which is associated with a mixture of CdTe and low resistivity phases Cu{sub 2−x}Te according to an effective medium analysis. The elemental distribution of the films was mapped by energy dispersive X-ray spectroscopy using scanning transmission electron microscopy. - Highlights: • Incorporation of 2 to 10 at.% of Cu and O atoms in CdTe films • Improved crystalline quality with 2 and 3 at.% of Cu and O • Complex dielectric function of Cu and O containing CdTe thin films • Effective medium modeling of below band-gap absorption.

  16. Soil solution dynamics of Cu and Zn in a Cu- and Zn-polluted soil as influenced by gamma-irradiation and Cu-Zn interaction.

    Science.gov (United States)

    Luo, Y M; Yan, W D; Christie, P

    2001-01-01

    A pot experiment was conducted to study soil solution dynamics of Cu and Zn in a Cu/Zn-polluted soil as influenced by gamma-irradiation and Cu-Zn interaction. A slightly acid sandy loam was amended with Cu and Zn (as nitrates) either singly or in combination (100 mg Cu and 150 mg Zn kg(-1) soil) and was then gamma-irradiated (10 kGy). Unamended and unirradiated controls were included, and spring barley (Hordeum vulgare L. cv. Forrester) was grown for 50 days. Soil solution samples obtained using soil moisture samplers immediately before transplantation and every ten days thereafter were used directly for determination of Cu, Zn, pH and absorbance at 360 nm (A360). Cu and Zn concentrations in the solution of metal-polluted soil changed with time and were affected by gamma-irradiation and metal interaction. gamma-Irradiation raised soil solution Cu substantially but generally decreased soil solution Zn. These trends were consistent with increased dissolved organic matter (A360) and solution pH after gamma-irradiation. Combined addition of Cu and Zn usually gave higher soil solution concentrations of Cu or Zn compared with single addition of Cu or Zn in gamma-irradiated and non-irradiated soils, indicating an interaction between Cu and Zn. Cu would have been organically complexed and consequently maintained a relatively high concentration in the soil solution under higher pH conditions. Zn tends to occur mainly as free ion forms in the soil solution and is therefore sensitive to changes in pH. The extent to which gamma-irradiation and metal interaction affected solubility and bioavailability of Cu and Zn was a function of time during plant growth. Studies on soil solution metal dynamics provide very useful information for understanding metal mobility and bioavailability.

  17. Spin dynamics in CuO and Cu[sub 1[minus][ital x

    Energy Technology Data Exchange (ETDEWEB)

    Carretta, P.; Corti, M.; Rigamonti, A. (Department of Physics Alessandro Volta,' ' University of Pavia, Via Bassi 6, 27100 Pavia (Italy))

    1993-08-01

    [sup 63]Cu nuclear quadrupole resonance (NQR), nuclear antiferromagnetic resonance (AFNMR), and spin-lattice relaxation, as well as [sup 7]Li NMR and relaxation measurements in CuO and in Cu[sub 1[minus][ital x

  18. Novel CuCr_2O_4 embedded CuO nanocomposites for efficient photodegradation of organic dyes

    International Nuclear Information System (INIS)

    Mageshwari, K.; Sathyamoorthy, R.; Lee, Jeong Yong; Park, Jinsub

    2015-01-01

    Graphical abstract: - Highlights: • Novel CuO–CuCr_2O_4 nanocomposites synthesized by reflux condensation method. • Methyl orange and methylene blue dye degradation studied under UV light irradiation. • Nanocomposites characterized by XRD, FESEM, TEM, EDX, UV–vis DRS and PL. • CuCr_2O_4 loading effectively enhanced the catalytic activity of CuO. - Abstract: Novel photocatalyst based on CuO–CuCr_2O_4 nanocomposites was synthesized for different Cr"3"+ concentration by reflux condensation method, and their photocatalytic activity was evaluated by monitoring the photodegradation of methyl orange (MO) and methylene blue dyes (MB) under UV light irradiation. Phase evolution by X-ray diffraction showed monoclinic CuO and tetragonal CuCr_2O_4 as the components of the prepared nanocomposites. Morphological analysis by scanning electron microscope and transmission electron microscope revealed that the incorporation of Cr"3"+ in CuO lattice alters the morphology of CuO from microsphere to cluster shape. Photoluminescence spectra of CuO–CuCr_2O_4 nanocomposites exhibited reduced PL emissions compared to pure CuO, indicating the low recombination rate of photogenerated electrons and holes. As expected, the CuCr_2O_4 loaded CuO showed enhanced photocatalytic activity for MO and MB dyes, and the kinetic studies suggest that the degradation follows pseudo-first-order kinetics. The enhanced photocatalytic activity of CuO–CuCr_2O_4 nanocomposites can be attributed to the presence of CuCr_2O_4 as an electron acceptor, which improves the effective charge separation in CuO.

  19. Fabrication of Cu-riched W–Cu composites by combustion synthesis and melt-infiltration in ultrahigh-gravity field

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Pei [Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190 (China); Graduate School of the Chinese Academy of Sciences, Beijing 100039 (China); Guo, Shibin; Liu, Guanghua; Chen, Yixiang [Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190 (China); Li, Jiangtao, E-mail: ljt0012@vip.sina.com [Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190 (China)

    2013-10-15

    Unadulterated Cu-riched W–Cu composites of W27–Cu73, W34–Cu66, W40–Cu60, W49–Cu51 and W56–Cu44 have been prepared by a novel method called combustion synthesis and melt-infiltration in ultrahigh-gravity field, of which W27–Cu73 and W34–Cu66 showed good ductility and W40–Cu60, W49–Cu51 and W56–Cu44 were brittle. In this technique, Cu melt accompanied with a great amount of heat was produced by thermit reaction and infiltrated into W–Cu powder bed. When the powder bed was Cu-riched powder bed such as W50–Cu50 or W60–Cu40, Cu melt would go through the powder bed, reach the bottom of the graphite crucible and then form a heat dissipation channel. Thus the cooling rate was so fast that the product was mixed up with impurity. The problem can be solved by putting some W powders under W50–Cu50 or W60–Cu40 powder bed to prevent the formation of heat dissipation channel.

  20. Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Ying; Liang, Shuhua, E-mail: liangxaut@gmail.com; Yang, Qing; Wang, Xianhui

    2016-11-30

    Highlights: • Nano- or micro-scale fractal dendritic copper (FDC) was synthesized by electroless immersing of Cu-Al alloys in CuCl{sub 2} + HCl. • FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. • Nanoscale Cu{sub 2}O was found at the edge of FDC. Nanoporous copper (NPC) can also be obtained by using Cu{sub 17}Al{sub 83} alloy. • The potential difference between CuAl{sub 2} and α-Al phase and the replacement reaction in multiphase solution are key factors. - Abstract: Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. Compared to Cu{sub 40}Al{sub 60} and Cu{sub 45}Al{sub 55} alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu{sub 17}Al{sub 83} alloy as the starting alloy. The growth direction of the FDC is <110>, and all angles between the trunks and branches are 60°. Nanoscale Cu{sub 2}O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu{sub 17}Al{sub 83} alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl{sub 2} intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

  1. Wafer-Level Membrane-Transfer Process for Fabricating MEMS

    Science.gov (United States)

    Yang, Eui-Hyeok; Wiberg, Dean

    2003-01-01

    A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.

  2. Effect of Ag film thickness on the optical and the electrical properties in CuAlO2/Ag/CuAlO2 multilayer films grown on glass substrates

    International Nuclear Information System (INIS)

    Oh, Dohyun; No, Young Soo; Kim, Su Youn; Cho, Woon Jo; Kwack, Kae Dal; Kim, Tae Whan

    2011-01-01

    Research highlights: The CuAlO 2 /Ag/CuAlO 2 multilayer films were grown on glass substrates using radio-frequency magnetron sputtering at room temperature. Effects of Ag film thickness on the optical and the electrical properties in CuAlO 2 /Ag/CuAlO 2 multilayer films grown on glass substrates were investigated. X-ray diffraction patterns showed that the phase of the CuAlO 2 layer was amorphous. Atomic force microscopy images showed that Ag films with a thickness of a few nanometers had island structures. The morphology Ag films with a thickness of 8 nm was uniform. The morphology of the Ag films inserted in the CuAlO 2 films significantly affected the optical transmittance and the resistivity of the CuAlO 2 films deposited on glass substrates. The maximum transmittance of the CuAlO 2 /Ag/CuAlO 2 multilayer films with a thickness of 8 nm was 89.16%. The resistivity of the CuAlO 2 /Ag/CuAlO 2 multilayer films with an Ag film thickness of 18 nm was as small as about 2.8 x 10 -5 Ω cm. The resistivity of the CuAlO 2 /Ag/CuAlO 2 multilayer films was decreased as a result of the thermal annealing treatment. These results indicate that CuAlO 2 /Ag/CuAlO 2 multilayer films grown on glass substrates hold promise for potential applications as TCO films in solar cells. - Abstract: Effects of Ag film thickness on the optical and the electrical properties in CuAlO 2 /Ag/CuAlO 2 multilayer films grown on glass substrates were investigated. Atomic force microscopy images showed that Ag films with a thickness of a few nanometers had island structures. X-ray diffraction patterns showed that the phase of the CuAlO 2 layer was amorphous. The resistivity of the 40 nm-CuAlO 2 /18 nm-Ag/40 nm-CuAlO 2 multilayer films was 2.8 x 10 -5 Ω cm, and the transmittance of the multilayer films with an Ag film thickness of 8 nm was approximately 89.16%. These results indicate that CuAlO 2 /Ag/CuAlO 2 multilayer films grown on glass substrates hold promise for potential applications as

  3. Gelsolin-Cu/ZnSOD interaction alters intracellular reactive oxygen species levels to promote cancer cell invasion

    KAUST Repository

    Tochhawng, Lalchhandami; Deng, Shuo; Ganesan, Pugalenthi; Kumar, Alan Prem; Lim, Kiat Hon; Yang, Henry; Hooi, Shing Chuan; Goh, Yaw Chong; Maciver, Sutherland K.; Pervaiz, Shazib; Yap, Celestial T.

    2016-01-01

    , and this is mediated via gelsolin's effects in elevating intracellular superoxide (O2 .-) levels. We also provide evidence for a novel physical interaction between gelsolin and Cu/ZnSOD, that inhibits the enzymatic activity of Cu/ZnSOD, thereby resulting in a sustained

  4. Electronic structures of the YBa2Cu3O7-x surface and its modification by sputtering and adatoms of Ti and Cu

    Science.gov (United States)

    Meyer, H. M., III; Hill, D. M.; Wagener, T. J.; Gao, Y.; Weaver, J. H.; Capone, D. W., II; Goretta, K. C.

    1988-10-01

    We present x-ray and inverse photoemission results for fractured surfaces of YBa2Cu3O6.9 before and after surface modification by Ar ion bombardment and the deposition of adatoms of Ti and Cu. Representative results are compared for samples prepared in three different ways. Two of the sample types exhibit substantial emission from grain-boundary phases because of both intergranular and transgranular fracture; they produce results that are very similar to those presented thus far in the literature. A third type was nearly free of contamination and clearly showed spectral features characteristic of the superconductor. Comparison of these nearly contamination-free valence-band results to those for clean La1.85Sr0.15CuO4 shows remarkably similar x-ray photoemission spectroscopy densities of states, with subtle differences near the Fermi level and at 3 eV. Inverse photoemission results show the top of the Cu-O hybrid orbitals to be 2 eV above EF and the empty states of Y and Ba at higher energy. Comparison with one-electron densities of states shows reasonable agreement, but there are large differences within the set of calculated results, and it is unclear from the valence bands alone how to account for final-state Cu d-d Coulomb correlation effects (satellite features show these effects very clearly). Argon sputtering for both types of samples shows destruction of the superconductor, with differences that can be related to sample surface quality. The deposition of adatoms of Ti and Cu results in reaction associated with oxygen withdrawal from the near-surface region. Studies of the Cu 2p3/2 line shape show that the deposition of as little as ~1 monolayer equivalent of Ti or Cu reduces the formal Cu2+ emission within the probed volume (30-50 Å deep). Core-level analysis shows that this chemical reduction of Cu is accompanied by crystal-structure modifications as well. Studies of Cu adatom interactions reveal the progression from Cu2+ to Cu1+ and ultimately, to Cu

  5. Synthesis of stable ultra-small Cu nanoparticles for direct writing flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    Li, Wei [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China); School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384 (China); Chen, Minfang, E-mail: mfchentj@126.com [School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384 (China)

    2014-01-30

    In this study, pure Cu nanoparticles (NPs) have been successfully synthesized and the Cu nano-ink was prepared for direct writing on photo paper using a roller pen. The tri-sodium citrate was used as initial reducing-cum-surfactant agent followed by hydrazine as a second massive reducing agent and cetyltrimethylammonium bromide (CTAB) as extra surfactant agent. From the XRD, TEM, and HR-TEM analyses, the synthesized particles are confirmed to be Cu in spherical shape with sizes range of 2.5 ± 1.0 nm. By analyzing the FT-IR spectroscopy and TGA curves, it was found that the obtained particles capped with tri-sodium citrate and CTAB layers are stable to oxidation up to the temperature 228 °C. The reduced size and enhanced air-stability of the Cu NPs result in an improved particle density upon sintering, which is mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered in Ar at 160 °C for 2 h is 7.2 ± 0.6 μΩ cm, which is 4.40 times the bulk Cu resistivity. The drawn Cu lines exhibited excellent integrity and good conductivity, which were experimentally tested. Moreover, a Cu electrode and a sample RFID antenna were successfully made.

  6. Separations on a cellulose exchanger with salicylic acid as functional group. [Fe/sup 3//sup+//Cu/sup 2//sup+/, Cu/sup 2//sup+//Ni/sup 2//sup+//, and Cu/sup 2//sup+//Cu complex separations

    Energy Technology Data Exchange (ETDEWEB)

    Burba, P; Lieser, K H [Technische Hochschule Darmstadt (F.R. Germany). Fachbereich Anorganische Chemie und Kernchemie

    1976-07-01

    The use of a cellulose compound containing salicylic acid as functional group (capacity 0.6 mequ./g) for different problems is described. The seperations Fe/sup 3 +//Cu/sup 2 +/ and Cu/sup 2 +//Ni/sup 2 +/ in aqueous solutions are achieved smoothly at pH 2 and 2.5 resp. In organic solvents (pyridine) copper ions are separated from copper complexes as shown by the examples Cu/sup 2 +//(Cu(mnt)/sub 2/)/sup 2 -/ (mnt = maleonitril-1,2-dithiolate) and Cu/sup 2 +//dibenzo(b.i.)(5.9.14.18)tetraazacyclotetradecene-copper (Cu(chel)). The complex (Cu(mnt)/sub 2/)/sup 2 -/ can be labelled with Cu-64 on a separation column, whereas (Cu-(chel)) is substition inert.

  7. Laser Photolytic Approach to Cu/polymer Sols and Cu/polymer Nanocomposites with Amorphous Cu Phase.

    Czech Academy of Sciences Publication Activity Database

    Pola, Josef; Ouchi, A.; Bakardjieva, Snejana; Urbanová, Markéta; Boháček, Jaroslav; Šubrt, Jan

    2007-01-01

    Roč. 192, 2-3 (2007) , s. 84-92 ISSN 1010-6030 Institutional research plan: CEZ:AV0Z40720504; CEZ:AV0Z40320502 Keywords : Cu-polymer nanocomposite * laser solution photolysis * amorphous Cu phase Subject RIV: CH - Nuclear ; Quantum Chemistry Impact factor: 1.911, year: 2007

  8. Real-time in-situ monitoring of the topotactic transformation of TlCu3Se2 into TlCu2Se2

    International Nuclear Information System (INIS)

    Ångström, J.; Sahlberg, M.; Berger, R.

    2015-01-01

    Highlights: • Topotactic transition from TlCu 3 Se 2 to TlCu 2 Se 2 followed in situ. • Synchrotron radiation X-ray powder diffraction enabled short scans. • Relative abundance of phases refined from powder data. • Opens up for studying similar systems in the same manner. - Abstract: The solid state transformation of monoclinic TlCu 3 Se 2 into tetragonal TlCu 2 Se 2 by oxidative copper leaching in concentrated ammonia solution has been studied in situ by the use of synchrotron radiation. The diffraction patterns of parent and daughter phase are both sharp, indicating a strong topotactic relationship between them that effectuates a rapid change by “chimie douce” performed at +19 °C. The transformation rate is strongly connected to the access of oxygen from the surrounding air. The transformation was followed in a real-time mode, being almost complete after 2.5 h with 1 h incubation due to low oxygen content, as shown from refining the diffraction patterns by Rietveld profile technique

  9. Advances in Cost-Efficient Thin-Film Photovoltaics Based on Cu(In,Ga)Se2

    Institute of Scientific and Technical Information of China (English)

    Michael Powalla; Stefan Paetel; Dimitrios Hariskos; Roland Wuerz; Friedrich Kessler; Peter Lechner; Wiltraud Wischmann; Theresa Magorian Friedlmeier

    2017-01-01

    In this article,we discuss the leading thin-film photovoltaic (PV) technology based on the Cu(In,Ga)Se2 (CIGS)compound semiconductor.This contribution includes a general comparison with the conventional Si-wafer-based PV technology and discusses the basics of the CIGS technology as well as advances in worldrecord-level conversion efficiency,production,applications,stability,and future developments with respect to a flexible product.Once in large-scale mass production,the CIGS technology has the highest potential of all PV technologies for cost-efficient clean energy generation.

  10. Advances in Cost-Efficient Thin-Film Photovoltaics Based on Cu(In,GaSe2

    Directory of Open Access Journals (Sweden)

    Michael Powalla

    2017-08-01

    Full Text Available In this article, we discuss the leading thin-film photovoltaic (PV technology based on the Cu(In,GaSe2 (CIGS compound semiconductor. This contribution includes a general comparison with the conventional Si-wafer-based PV technology and discusses the basics of the CIGS technology as well as advances in world-record-level conversion efficiency, production, applications, stability, and future developments with respect to a flexible product. Once in large-scale mass production, the CIGS technology has the highest potential of all PV technologies for cost-efficient clean energy generation.

  11. Deep level centers in electron-irradiated silicon crystals doped with copper at different temperatures

    Energy Technology Data Exchange (ETDEWEB)

    Yarykin, Nikolai [Institute of Microelectronics Technology, RAS, Chernogolovka (Russian Federation); Weber, Joerg [Technische Universitaet Dresden (Germany)

    2017-07-15

    The effect of bombardment with energetic particles on the deep-level spectrum of copper-contaminated silicon wafers is studied by space charge spectroscopy methods. The p-type FZ-Si wafers were doped with copper in the temperature range of 645-750 C and then irradiated with the 10{sup 15} cm{sup -2} fluence of 5 MeV electrons at room temperature. Only the mobile Cu{sub i} species and the Cu{sub PL} centers are detected in significant concentrations in the non-irradiated Cu-doped wafers. The properties of the irradiated samples are found to qualitatively depend on the copper in-diffusion temperature T{sub diff}. For T{sub diff} > 700 C, the irradiation partially reduces the Cu{sub i} concentration and introduces additional Cu{sub PL} centers while no standard radiation defects are detected. If T{sub diff} was below ∝700 C, the irradiation totally removes the mobile Cu{sub i} species. Instead, the standard radiation defects and their complexes with copper appear in the deep-level spectrum. A model for the defects reaction scheme during the irradiation is derived and discussed. DLTS spectrum of the Cu-contaminated and then irradiated silicon qualitatively depends on the copper in-diffusion temperature. (copyright 2017 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  12. Synthesis of Cu2O from CuO thin films: Optical and electrical properties

    Directory of Open Access Journals (Sweden)

    Dhanya S. Murali

    2015-04-01

    Full Text Available Hole conducting, optically transparent Cu2O thin films on glass substrates have been synthesized by vacuum annealing (5×10−6 mbar at 700 K for 1 hour of magnetron sputtered (at 300 K CuO thin films. The Cu2O thin films are p-type and show enhanced properties: grain size (54.7 nm, optical transmission 72% (at 600 nm and Hall mobility 51 cm2/Vs. The bulk and surface Valence band spectra of Cu2O and CuO thin films are studied by temperature dependent Hall effect and Ultra violet photo electron Spectroscopy (UPS. CuO thin films show a significant band bending downwards (due to higher hole concentration than Cu2O thin films.

  13. Infiltrated TiC/Cu composites

    International Nuclear Information System (INIS)

    Frage, N.; Froumin, N.; Rubinovich, L.; Dariel, M.P.

    2001-01-01

    One approach for the fabrication of ceramic-metal composites is based on the pressureless impregnation of a porous ceramic preform by a molten metal. Molten Cu does not react with TiC and the wetting angle is close to 90 o . Nonetheless, molten Cu readily impregnates partially sintered TiC preforms. A model that describes the dependence of the critical contact angle for spontaneous impregnation by molten metals in partially sintered preforms on the level of densification and on the morphology of the particles was developed. For high aspect ratios of the particles forming the preform, wetting angles close to 90 o still allow impregnation by the molten metal. The results of the model were confirmed by infiltration of partially sintered TiC preforms with molten Cu and by fabrication of the TiC/Cu composites with various ceramic-to metal ratios. Decreasing of the metal content in the composite from 50 vol.% to 10 vol.% leads to a hardness increase from 250 to 1800 HV, and to the decrease of the bending strength from 960 to 280 MPa. The resistivity of these TiC/Cu composites decreases from 142 ohm cm to 25 ohm cm. (author)

  14. Direct synthesis of RGO/Cu{sub 2}O composite films on Cu foil for supercapacitors

    Energy Technology Data Exchange (ETDEWEB)

    Dong, Xiangmao; Wang, Kun [Key Laboratory for Ultrafine Materials of the Ministry of Education, Shanghai Key Laboratory of Advanced Polymeric Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237 (China); Zhao, Chongjun, E-mail: chongjunzhao@ecust.edu.cn [Key Laboratory for Ultrafine Materials of the Ministry of Education, Shanghai Key Laboratory of Advanced Polymeric Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237 (China); Institute for Superconducting and Electronic Materials, University of Wollongong, Wollongong 2500 (Australia); Qian, Xiuzhen [Key Laboratory for Ultrafine Materials of the Ministry of Education, Shanghai Key Laboratory of Advanced Polymeric Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237 (China); Chen, Shi [School of Information Engineering, Wuhan University of Technology, Wuhan 430070 (China); Li, Zhen, E-mail: zhenl@uow.edu.au [Institute for Superconducting and Electronic Materials, University of Wollongong, Wollongong 2500 (Australia); Liu, Huakun; Dou, Shixue [Institute for Superconducting and Electronic Materials, University of Wollongong, Wollongong 2500 (Australia)

    2014-02-15

    Graphical abstract: RGO/Cu{sub 2}O/Cu composites were synthesized by simple hydrothermal treatment of copper foils with graphene oxide, in which the reduction of graphene oxide and the formation of Cu{sub 2}O nanoparticles simultaneously happened in one-pot reaction. These composites can be directly used as electrodes of supercapacitors with the highest specific capacitance of 98.5 F/g at 1 A g{sup −1}, which is much better than that of CuO or Cu{sub 2}O electrodes. -- Highlights: • The RGO/Cu{sub 2}O/Cu composites were obtained by a friendly method in one step. • Improved capacitance performance is realized by the hydrothermal treatment of graphene oxides with Cu foils. • RGO/Cu{sub 2}O/Cu-200 composites exhibit the largest specific capacitance of 98.5 F g{sup −1} at 1 A g{sup −1}. -- Abstract: Reduced graphene oxide/cuprous oxide (RGO/Cu{sub 2}O) composite films were directly synthesized on the surface of copper foil substrates through a straight redox reaction between GO and Cu foil via a hydrothermal approach. Characterization of the resultant composites with X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy, and field emission scanning electron microscope (FESEM) confirms the formation of Cu{sub 2}O and reduction of GO, in which Cu{sub 2}O nanoparticles were well covered by RGO. The resultant composites (referred to as RGO/Cu{sub 2}O/Cu) were directly used as electrodes for supercapacitors, and their electrochemical performance was assessed by cyclic voltammetry (CV), galvanostatic charge–discharge (GCD), and electrochemical impedance spectrometry (EIS) in 1 M KOH aqueous solution. A specific capacitance of 98.5 F g{sup −1} at 1 A g{sup −1} was obtained, which is much higher than that of pure Cu{sub 2}O prepared under the same conditions, due to the presence of RGO.

  15. 64Cu-ATSM Reflects pO2 Levels in Human Head and Neck Cancer Xenografts but Not in Colorectal Cancer Xenografts: Comparison with 64CuCl2.

    Science.gov (United States)

    Li, Fan; Jørgensen, Jesper T; Forman, Julie; Hansen, Anders E; Kjaer, Andreas

    2016-03-01

    The hypoxia PET tracer (64)Cu-diacetyl-bis(N(4)-methylthiosemicarbazonate) ((64)Cu-ATSM) has shown promising results in clinical studies. However, concerns have been raised with regard to the possible effect of copper metabolism and free copper on tumor uptake and thereby the robustness of (64)Cu-ATSM as a hypoxia marker. In this study, accumulation and distribution of (64)Cu-ATSM and (64)CuCl2 in tumor tissue were compared with partial pressure of oxygen (pO2) probe measurements. One-hour dynamic PET scans were performed on nude mice bearing subcutaneous human head and neck tumors (FaDu) and human colorectal tumors (HT29) after administration of either (64)Cu-ATSM or (64)CuCl2. Subsequently, tracks were generated and track markers were positioned in tumors to allow for registration of their exact location on the high-resolution CT scan. After completion of the CT scan, pO2 probe measurements were performed along each track. PET and CT images were coregistered and ROIs drawn on the basis of the location of track markers and pO2 probe measurement depth. A linear mixed model for repeated measures was applied for the comparison of PET tracer uptake to corresponding pO2 values. Comparable uptake of (64)Cu-ATSM and (64)CuCl2 was found in the kidney, muscle, and liver of all animals, but (64)CuCl2 showed a higher uptake 10-60 min after injection in both tumor models. Significant differences were also found for both tumor-to-muscle and tumor-to-liver ratios. The intratumoral distribution of (64)Cu-ATSM, but not (64)CuCl2, showed a significant negative relationship with pO2 measurements in FaDu tumors. However, this relationship was not found in HT29 tumors. (64)Cu-ATSM and (64)CuCl2 displayed different uptake in tumors. In human head and neck xenografts, (64)Cu-ATSM but not (64)CuCl2 reflected pO2 measurements, indicating that (64)Cu-ATSM is a hypoxia-specific marker in this tumor type. However, data from colorectal cancer xenografts indicated that (64)Cu-ATSM may not be

  16. Basic characterization of 64Cu-ATSM as a radiotherapy agent

    International Nuclear Information System (INIS)

    Obata, Atsushi; Kasamatsu, Shingo; Lewis, Jason S.; Furukawa, Takako; Takamatsu, Shinji; Toyohara, Jun; Asai, Tatsuya; Welch, Michael J.; Adams, Susan G.; Saji, Hideo; Yonekura, Yoshiharu; Fujibayashi, Yasuhisa

    2005-01-01

    64 Cu-diacetyl-bis(N 4 -methylthiosemicarbazone) ( 64 Cu-ATSM) is a promising radiotherapy agent for the treatment of hypoxic tumors. In an attempt to elucidate the radiobiological basis of 64 Cu-ATSM radiotherapy, we have investigated the cellular response patterns in vitro cell line models. Cells were incubated with 64 Cu-ATSM, and the dose-response curves were obtained by performing a clonogenic survival assay. Radiation-induced damage in DNA was evaluated using the alkali comet assay and apoptotic cells were detected using Annexin V-FITC and propidium iodide staining methods. Washout rate and subcellular distribution of 64 Cu in cells were investigated to further assess the effectiveness of 64 Cu-ATSM therapy on a molecular basis. A direct comparison of subcellular localization of Cu-ATSM was made with the flow tracer analog Cu-pyruvladehyde-bis(N 4 -methylthiosemicarbazone). In this study, 64 Cu-ATSM was shown to reduce the clonogenic survival rate of tumor cells in a dose-dependent manner. Under hypoxic conditions, cells took up 64 Cu-ATSM and radioactive 64 Cu was highly accumulated in the cells. In the 64 Cu-ATSM-treated cells, DNA damage by the radiation emitted from 64 Cu was detected, and inhibition of cell proliferation and induction of apoptosis was observed at 24 and 36 h after the treatment. The typical features of postmitotic apoptosis induced by radiation were observed following 64 Cu-ATSM treatment. The majority of the 64 Cu taken up into the cells remained in the postmitochondrial supernatant (the cellular residue after removal of the nuclei and mitochondria), which indicates that the β - particle emitted from 64 Cu may be as effective as the Auger electrons in 64 Cu-ATSM therapy. These data allow us to postulate that 64 Cu-ATSM will be able to attack the hypoxic tumor cells directly, as well as potentially affecting the peripheral nonhypoxic regions indirectly by the β - particle decay of 64 Cu

  17. Operations and Performance of RHIC as a Cu-Cu Collider

    CERN Document Server

    Pilat, Fulvia Caterina; Bai, Mei; Barton, Donald; Beebe-Wang, Joanne; Blaskiewicz, Michael; Brennan, Joseph M; Bruno, Donald; Cameron, Peter; Connolly, Roger; De Long, Joseph; Drees, Angelika; Fischer, Wolfram; Ganetis, George; Gardner, Chris J; Glenn, Joseph; Harvey, Margaret; Hayes, Thomas; Hseuh Hsiao Chaun; Huang, Haixin; Ingrassia, Peter; Iriso, Ubaldo; Lee, Roger C; Litvinenko, Vladimir N; Luo, Yun; MacKay, William W; Marr, Gregory J; Marusic, Al; Michnoff, Robert; Montag, Christoph; Morris, John; Nicoletti, Tony; Oerter, Brian; Ptitsyn, Vadim; Roser, Thomas; Russo, Thomas; Sandberg, Jon; Satogata, Todd; Schultheiss, Carl; Tepikian, Steven; Tomas, Rogelio; Trbojevic, Dejan; Tsoupas, Nicholaos; Tuozzolo, Joseph; Vetter, Kurt; Zaltsman, Alex; Zeno, Keith; Zhang, S Y; Zhang, Wu

    2005-01-01

    The 5th year of RHIC operations, started in November 2004 and expected to last till June 2005, consists of a physics run with Cu-Cu collisions at 100 GeV/u followed by one with polarized protons at 100 GeV. We will address here overall performance of the RHIC complex used for the first time as a Cu-Cu collider, and compare it with previous operational experience with Au, PP and asymmetric d-Au collisions. We will also discuss operational improvements, such as a ?* squeeze to 85cm in the high luminosity interaction regions from the design value of 1m, system improvements and machine performance limitations, such as vacuum pressure rise, intra-beam scattering, and beam beam interaction.

  18. Effect of Cu Salt Molarity on the Nanostructure of CuO Prolate Spheroid

    Science.gov (United States)

    Sabeeh, Sabah H.; Hussein, Hashim Abed; Judran, Hadia Kadhim

    Copper sulfate pentahydrate was used as a source of Cu ion with five different molarities (0.02, 0.05, 0.1, 0.15, 2 and 0.25M). XRD, FE-SEM and TEM techniques all showed that CuO samples have polycrystalline monoclinic structure. CuO prolate spheroid is assembled from nanoparticles as building units. It was demonstrated that the purity, morphology, size range of prolate spheroid and density of nano building units are significantly influenced by Cu precursor’s molarity. The pure phase of CuO prolate spheroid was produced via molarity of 0.2M with crystallite size of 15.1565nm while the particle size of building units ranges from 16nm to 21nm. The stability of CuO nanosuspension or nanofluid was evaluated by zeta potential analysis. The obtained properties of specific structure with large surface area of CuO prolate spheroid make it a promising candidate for wide range of potential applications as in nanofluids for cooling purposes.

  19. Synthesis of Cu Nanoparticles Using Copper Carbonate as Cu Source Toward Versatile Applications.

    Science.gov (United States)

    Yano, Kazuhisa; Ishizaki, Toshitaka; Sugiyama, Hidehiko

    2018-07-01

    Cu nanoparticles (NPs) coated with polyvinylpyrrolidone (PVP) were fabricated by polyol method using copper carbonate as a raw material. To increase the reaction temperature, glycol multimers such as diethylene glycol, triethylene glycol, or tetraethylene glycol were examined as a solvent. With increasing degree of multimerization, average diameter of Cu NPs decreased. The synthesis of Cu NPs was further investigated by changing reaction temperature, the amount and molecular weight of PVP in triethylene glycol as a solvent. Average diameter and standard deviation of Cu NPs were found to be highly dependent on those factors. As a result, fine Cu NPs ranging from 28 to 67 nm in average size with narrow size distribution (standard deviation: 16-28%) were obtained. The obtained Cu NPs were applied to a nanofluid, which showed higher thermal conductivity than the theoretical value. The antibacterial activity of Cu NPs was also demonstrated, and found to have strong antibacterial activity.

  20. Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

    OpenAIRE

    Qian, Suxin; Geng, Yunlong; Wang, Yi; Pillsbury, Thomas E.; Hada, Yoshiharu; Yamaguchi, Yuki; Fujimoto, Kenjiro; Hwang, Yunho; Radermacher, Reinhard; Cui, Jun; Yuki, Yoji; Toyotake, Koutaro; Takeuchi, Ichiro

    2016-01-01

    This paper reports the elastocaloric effect of two Cu-based shape memory alloys: Cu68Al16Zn16 (CuAlZn) and Cu73Al15Mn12 (CuAlMn), under compression at ambient temperature. The compression tests were conducted at two different rates to approach isothermal and adiabatic conditions. Upon unloading at a strain rate of 0.1 s−1 (adiabatic condition) from 4% strain, the highest adiabatic temperature changes (ΔTad) of 4.0 K for CuAlZn and 3.9 K for CuAlMn were obtained. The maximum stress and hystere...

  1. [b][/b]Impact of copper (Cu at the dose of 50 mg on haematological and biochemical blood parameters in turkeys, and level of Cu accumulation in the selected tissues as a source of information on product safety for consumers

    Directory of Open Access Journals (Sweden)

    Bogusław Makarski

    2014-09-01

    Full Text Available Introduction. The current state-of the art points to a positive impact of copper (Cu supplements on the general health status in poultry. Copper induces beneficial changes in the haematological and biochemical blood parameters. It also displays immunostimulating properties and helps maintain a proper microbiological balance in the digestive tract. [b]Objective[/b]. The objective of this study was to investigate the impact of Cu at the dose of 50 mg/kg BW, administered in organic and inorganic form, on the haematological and biochemical blood parameters and level of Cu bioaccumulation in the liver and pectoral muscle. [b]Materials and method[/b]. The study was carried out on 45 BUT-9 turkeys which had been were reared for 16 weeks. They were divided into 3 experimental groups: I – the control group; II – fed with CuSO[sub]4[/sub] at the dose of 50 mg Cu•dm [sup]-3 [/sup]H[sub]2[/sub]O; III – received a Cu chelate with lysine at the same dose. [b]Results[/b]. The administration of Cu at the dose exceeding the nutritional recommendations did not induce beneficial changes in the examined birds. This indicates that it is not necessary to administer Cu doses higher than the recommended levels. The extent of Cu accumulation in the pectoral muscle increased by 40% compared to the control group, whereas in the liver it was higher by 30–35% than in the birds without Cu administration. The level of Cu in tissues does not pose a risk to consumers. [b]Conclusions[/b]. The supplementation of Cu at the dose of 50 mg has a negative impact on the level of the analyzed parameters. The results of the presented study indicate that the administered Cu dose exceeds birds’ demand for this element.

  2. Humidity sensing performance of in-situ fabricated Cu/Cu2O/Cu2S-polymer nanocomposite via polyphenylene sulphide cyclisation route.

    Science.gov (United States)

    Adkar, Dattatraya; Hake, Abhay; Jadkar, Sandesh; Adhyapak, Parag; Mulik, Uttamrao; Amalnerkar, Dinesh

    2011-08-01

    We herein report the feasibility of novel polymer-inorganic solid state reaction route for simultaneous in situ generation of Cu2S and Cu nanostructures in polymer network. Polyphenylene Sulphide (PPS) which is engineering thermoplastic acts as chalcogen source as well as stabilizing matrix for the resultant nano products. Typical solid state reaction was accomplished by simply heating the physical admixtures of the two reactants i.e., copper acetate and PPS by varying molar ratios mainly 1:1, 1:5, 1:10, 1:15, 1:20 at the crystalline melting temperature (285 degrees C) of PPS. The synthesized products were characterized using various physicochemical characterization techniques like X-ray Diffractometry, Field emission Scanning Electron Microscopy, Transmission Electron Microscopy, UV-Visible spectroscopy and X-ray photoelectron spectroscopy. The prima facie observations suggest occurrence of nanocrystalline Cu2S in case of product obtained with equimolar ratio, whereas remaining samples show mixture of Cu and Cu2O. The TEM analysis reveals nanoscale polydispersity (5-60 nm) and prevalence of mainly spherical morphological features in all the cases with occasional indications of plate like and cubical morphological features depending upon the molar ratio of the reactants. The humidity sensing characterization of these nanocomposites was also performed. The resistivity response with the level of humidity (20 to 70% RH) was compared for these nanocomposites. The linear response is obtained for all the samples. The sensitivity of 1:1 molar ratio sample was found to be maximum among all the samples.

  3. Synthesis and photocatalytic activity of carbon spheres loaded Cu2O/Cu composites

    International Nuclear Information System (INIS)

    Li, Yinhui; Zhao, Mengyao; Zhang, Na; Li, Ruijuan; Chen, Jianxin

    2015-01-01

    Highlights: • Carbon spheres loaded Cu 2 O/Cu composites are obtained by hydrothermal process. • Cu 2 O/Cu nanocrystals grow on the surface of carbon spheres. • The composites with core–shell structure show highly photo-catalytic activity. • The composites can degrade methyl orange under simulated solar light irradiation. • The composites can be used to treat dye wastewater or organic pollutants. - Abstract: In this work, using amylose as carbon source and cupric acetate as copper source, carbon spheres loaded Cu 2 O/Cu composites were obtained by hydrothermal synthesis. The effects of the molar ratios between glucose and Cu(II), and hydrothermal time on the morphology and sizes of the composites were investigated. The result of photocatalytic experiments demonstrated that the composites could degrade methyl orange in aqueous solution under simulated solar light irradiation. The highest degradation rate was achieved to 93.83% when the composites were prepared by hydrothermal synthesis at 180 °C for 16 h and the molar ratio between glucose and Cu(II) was 10/1. The composites, as new and promising materials, can be used to treat dye wastewater or other organic pollutants

  4. Investigation of Cu-poor and Cu-rich Cu(In,Ga)Se{sub 2}/CdS interfaces using hard X-ray photoelectron spectroscopy

    Energy Technology Data Exchange (ETDEWEB)

    Ümsür, B., E-mail: buenyamin.uemsuer@helmholtz-berlin.de [Helmholtz-Zentrum-Berlin, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Calvet, W.; Höpfner, B.; Steigert, A.; Lauermann, I.; Gorgoi, M.; Prietzel, K.; Navirian, H.A.; Kaufmann, C.A.; Unold, T. [Helmholtz-Zentrum-Berlin, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Lux-Steiner, M. Ch. [Helmholtz-Zentrum-Berlin, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Freie Universität Berlin, Department of Physics, Arnimallee 14, D-14195 Berlin (Germany)

    2015-05-01

    Cu-poor and Cu-rich Cu(In,Ga)Se{sub 2} (CIGSe) absorbers were used as substrates for the chemical bath deposition of ultrathin CdS buffer layers in the thickness range of a few nanometers in order to make the CIGSe/CdS interface accessible by hard X-ray photo-emission spectroscopy. The composition of both, the absorber and the buffer layer as well as the energetics of the interface was investigated at room temperature and after heating the samples to elevated temperatures (200 °C, 300 °C and 400 °C). It was found that the amount of Cd after the heating treatment depends on the near surface composition of the CIGSe absorber. No Cd was detected on the Cu-poor surface after the 400 °C treatment due to its diffusion into the CIGSe layer. In contrast, Cd was still present on the Cu-rich surface after the same treatment at 400 °C. - Highlights: • Cd diffusion into Cu(In,Ga)Se{sub 2} (CIGSe) absorber is investigated. • Cu-poor and Cu-rich CIGSe samples are compared. • Cd diffusion into CIGSe is found to be dependent on the surface composition of CIGSe.

  5. A facile and low cost synthesis of earth abundant element Cu{sub 2}ZnSnS{sub 4} (CZTS) nanocrystals: Effect of Cu concentrations

    Energy Technology Data Exchange (ETDEWEB)

    Shin, Seung Wook; Han, Jun Hee [Department of Materials Science and Engineering, KAIST, 335 Gwahangno, Yuseong-gu, Daejeon 305-701 (Korea, Republic of); Park, Chan Yeong; Kim, Sae-Rok; Park, Yeon Chan; Agawane, G.L. [Photonics Technology Research Institute, Department of Materials Science and Engineering, Chonnam National University, 300 Yongbong-Dong, Buk-Gu, Gwangju 500-757 (Korea, Republic of); Moholkar, A.V. [Electrochemical Mat. Lab, Department of Physics, Shivaji University, Kolhapur 416-004 (India); Yun, Jae Ho [Photovoltaic Research Group, Korea Institute of Energy Research, 71-2 Jang-Dong, Yuseong-Gu, Daejeon 305-343 (Korea, Republic of); Jeong, Chae Hwan [Solar City Center, Development of Advanced Components and Materials Korea Institute of Industrial Technology, Gwangju 500-480 (Korea, Republic of); Lee, Jeong Yong, E-mail: j.y.lee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, 335 Gwahangno, Yuseong-gu, Daejeon 305-701 (Korea, Republic of); Kim, Jin Hyeok, E-mail: jinhyeok@chonnam.ac.kr [Photonics Technology Research Institute, Department of Materials Science and Engineering, Chonnam National University, 300 Yongbong-Dong, Buk-Gu, Gwangju 500-757 (Korea, Republic of)

    2012-11-15

    Highlights: Black-Right-Pointing-Pointer Cu{sub 2}ZnSnS{sub 4} (CZTS) nanocrystals (NCs) were prepared by sulfurization of microwave assisted precursor without toxic chemicals. Black-Right-Pointing-Pointer Effect of Cu concentration on the properties of CZTS NCs was investigated using various analysis methods. Black-Right-Pointing-Pointer The properties of CZTS NCs was strongly related to the Cu concentrations. - Abstract: Cu{sub 2}ZnSnS{sub 4} (CZTS) nanocrystals (NCs) were synthesized by sulfurization of microwave assisted precursor powders without toxic chemicals. The effects of different Cu concentration from 0.01 to 0.025 M on the structural, morphological, compositional, chemical and optical properties of CZTS NCs were investigated. X-ray diffraction patterns, X-ray photoelectron spectroscopy and transmission electron microscopy results showed that the precursor powder contains several broad peaks that could not be assigned to CZTS, ZnS, Cu{sub 2-x}S, Sn{sub 2}S{sub 3} and Cu{sub 2}SnS{sub 3}. However, the sulfurized NCs showed both kesterite CZTS and Cu- and Sn-based secondary phases except for that formed at Cu concentration of 0.02 M. Inductively coupled plasma (ICP) results showed that the presence of Cu in the sulfurized CZTS NCs increased with increasing Cu concentration from 16.57 to 32.94 at.% while Zn and Sn in the sulfurized CZTS NCs decreased with increasing Cu concentration. UV-Vis spectroscopy results showed that the absorption coefficient of the sulfurized NCs was over 10{sup 4} cm{sup -1} in the visible region and band gap energy of the sulfurized CZTS NCs decreased from 1.65 to 1.28 eV with increasing Cu concentration.

  6. Cu-Doping Effects in CdI(2) Nanocrystals: The Role of Cu-Agglomerates.

    Science.gov (United States)

    Miah, M Idrish

    2008-11-22

    Cu-doping effects in CdI(2) nanocrystals are studied experimentally. We use the photostimulated second harmonic generation (PSSHG) as a tool to investigate the effects. It is found that the PSSHG increases with increasing Cu content up to 0.6% and then decreases due to the formation of the Cu-agglomerates. The PSSHG for the crystal with Cu content higher than 1% reduces to that for the undoped CdI(2) crystal. The results suggest that a crucial role of the Cu-metallic agglomerates is involved in the processes as responsible for the observed effects.

  7. Cu-Doping Effects in CdI2Nanocrystals: The Role of Cu-Agglomerates

    Directory of Open Access Journals (Sweden)

    Miah M

    2008-01-01

    Full Text Available Abstract Cu-doping effects in CdI2nanocrystals are studied experimentally. We use the photostimulated second harmonic generation (PSSHG as a tool to investigate the effects. It is found that the PSSHG increases with increasing Cu content up to 0.6% and then decreases due to the formation of the Cu-agglomerates. The PSSHG for the crystal with Cu content higher than 1% reduces to that for the undoped CdI2crystal. The results suggest that a crucial role of the Cu-metallic agglomerates is involved in the processes as responsible for the observed effects.

  8. Crystallization and electrical resistivity of Cu{sub 2}O and CuO obtained by thermal oxidation of Cu thin films on SiO{sub 2}/Si substrates

    Energy Technology Data Exchange (ETDEWEB)

    De Los Santos Valladares, L., E-mail: ld301@cam.ac.uk [Cavendish Laboratory, University of Cambridge, J.J Thomson Av., Cambridge CB3 0HE (United Kingdom); Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan); Departamento de Fisica, Universidade Federal de Pernambuco, 50670-901, Recife-Pe (Brazil); Salinas, D. Hurtado [Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan); Laboratorio de Ceramicos y Nanomateriales, Facultad de Ciencias Fisicas, Universidad Nacional Mayor de San Marcos, Ap. Postal 14-0149, Lima (Peru); Dominguez, A. Bustamante [Laboratorio de Ceramicos y Nanomateriales, Facultad de Ciencias Fisicas, Universidad Nacional Mayor de San Marcos, Ap. Postal 14-0149, Lima (Peru); Najarro, D. Acosta [Instituto de Fisica, Departamento de Materia Condensada, Universidad Nacional Autonoma de Mexico, Ap. Postal 20-364, CP 01000 (Mexico); Khondaker, S.I. [NanoScience Technology Centre and Department of Physics, University of Central Florida, Orlando, FL 32826 (United States); Mitrelias, T.; Barnes, C.H.W. [Cavendish Laboratory, University of Cambridge, J.J Thomson Av., Cambridge CB3 0HE (United Kingdom); Aguiar, J. Albino [Departamento de Fisica, Universidade Federal de Pernambuco, 50670-901, Recife-Pe (Brazil); Majima, Y. [Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan); CREST, Japan Science and Technology Agency (JST), 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan)

    2012-08-01

    In this work, we study the crystallization and electrical resistivity of the formed oxides in a Cu/SiO{sub 2}/Si thin film after thermal oxidation by ex-situ annealing at different temperatures up to 1000 Degree-Sign C. Upon increasing the annealing temperature, from the X ray diffractogram the phase evolution Cu {yields} Cu + Cu{sub 2}O {yields} Cu{sub 2}O {yields} Cu{sub 2}O + CuO {yields} CuO was detected. Pure Cu{sub 2}O films are obtained at 200 Degree-Sign C, whereas uniform CuO films without structural surface defects such as terraces, kinks, porosity or cracks are obtained in the temperature range 300-550 Degree-Sign C. In both oxides, crystallization improves with annealing temperature. A resistivity phase diagram, which is obtained from the current-voltage response, is presented here. The resistivity was expected to increase linearly as a function of the annealing temperature due to evolution of oxides. However, anomalous decreases are observed at different temperatures ranges, this may be related to the improvement of the crystallization and crystallite size when the temperature increases. - Highlights: Black-Right-Pointing-Pointer The crystallization and electrical resistivity of oxides in a Cu films are studied. Black-Right-Pointing-Pointer In annealing Cu films, the phase evolution Cu + Cu{sub 2}O {yields} Cu{sub 2}O {yields} Cu{sub 2}O + CuO {yields} CuO occurs. Black-Right-Pointing-Pointer A resistivity phase diagram, obtained from the current-voltage response, is presented. Black-Right-Pointing-Pointer Some decreases in the resistivity may be related to the crystallization.

  9. Facile synthesis of Cu2O/CuO/RGO nanocomposite and its superior cyclability in supercapacitor

    International Nuclear Information System (INIS)

    Wang, Kun; Dong, Xiangmao; Zhao, Chongjun; Qian, Xiuzhen; Xu, Yunlong

    2015-01-01

    A reduced graphene oxide (RGO)-based nanocomposite of redox counterpart of the oxides of Cu(I)-Cu(II) pair for Faradaic reaction, Cu 2 O/CuO/RGO, was controllably synthesized through a facile, eco-friendly one-step hydrothermal-assisted redox reaction of elemental Cu and graphene oxide (GO) without the addition of any other reagents. The resultant Cu 2 O/CuO/RGO nanocomposites were characterized by X-ray diffraction (XRD), Raman spectroscopy, Thermogravimetric analysis (TG), X-ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM), and transmission electron microscopy (TEM). It is found that, when dealloyed nanoporous Cu was used as a Cu source, the uniform spherical Cu 2 O/CuO nanoparticles with double size scales (∼25 nm and ∼5 nm) were anchored on RGO sheets. This Cu 2 O/CuO/RGO nanocomposite redox counterpart exhibits improved rate capability and excellent cycling stability, i.e., only ca. 21.4% of the capacity was lost when the discharge current density increases from 1 A g −1 (173.4 F g −1 ) to 10 A g −1 (136.3 F g −1 ). Especially, the capacity remains almost unchanged (98.2%) after 100,000 cycles at 10 A g −1 . The good electrochemical performance and simple accessibility prove that this Cu 2 O/CuO/RGO composite consisting of a pair of redox counterparts is a promising material for supercapacitor applications

  10. Based on Cu as framework constructed nanoporous CuO/Cu composites by a dealloy method for sodium-ion battery anode

    Science.gov (United States)

    Zheng, Tian; Li, Guangda; Li, Deming; Meng, Xiangeng

    2018-05-01

    Nanoporous CuO/Cu composites with a continuous channel structure were fabricated through a corroding Cu-Al alloy process. The width of the continuous channels was about 20 50 nm. Nanoporous structure could effectively sustain the volume expansion during the Na+ insertion/extraction process and shorten the Na+ diffusion length as well, which thus helps improve the Na+ storage performance. Moreover, the nanoporous structure can improve the contact area between the electrolyte and the electrode, leading to an increment in the number of Na+ insertion/extraction sites. When used as the anode for sodium-ion batteries, the CuO/Cu exhibited an initial capacity of 580 mAh g-1, and the capacity is maintained at 200 mAh g-1 after 200 cycles at a current density of 500 mA g-1.

  11. Highly stable carbon-doped Cu films on barrierless Si

    International Nuclear Information System (INIS)

    Zhang, X.Y.; Li, X.N.; Nie, L.F.; Chu, J.P.; Wang, Q.; Lin, C.H.; Dong, C.

    2011-01-01

    Electrical resistivities and thermal stabilities of carbon-doped Cu films on silicon have been investigated. The films were prepared by magnetron sputtering using a Cu-C alloy target. After annealing at 400 deg. C for 1 h, the resistivity maintains a low level at 2.7 μΩ-cm and no Cu-Si reaction is detected in the film by X-ray diffraction (XRD) and transmission electron microscopy (TEM) observations. According to the secondary ion mass spectroscopy (SIMS) results, carbon is enriched near the interfacial region of Cu(C)/Si, and is considered responsible for the growth of an amorphous Cu(C)/Si interlayer that inhibits the Cu-Si inter-diffusion. Fine Cu grains, less than 100 nm, were present in the Cu(C) films after long-term and high-temperature annealings. The effect of C shows a combination of forming a self-passivated interface barrier layer and maintaining a fine-grained structure of Cu. A low current leakage measured on this Cu(C) film also provides further evidence for the carbon-induced diffusion barrier interlayer performance.

  12. Brazing of Cu with Pd-based metallic glass filler

    Energy Technology Data Exchange (ETDEWEB)

    Terajima, Takeshi [Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047 (Japan)], E-mail: terajima@jwri.osaka-u.ac.jp; Nakata, Kazuhiro [Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047 (Japan); Matsumoto, Yuji [Materials and Structures Laboratory, Tokyo Institute of Technology (Japan); Zhang, Wei; Kimura, Hisamichi; Inoue, Akihisa [Institute for Materials Research, Tohoku University (Japan)

    2008-02-25

    Metallic glass has several unique properties, including high mechanical strength, small solidification shrinkage, small elastic modulus and supercooling state, all of which are well suited as a residual stress buffer for metal and ceramic joining. In the present preliminary study, we demonstrated brazing of Cu rods with Pd{sub 40}Cu{sub 30}Ni{sub 10}P{sub 20} metallic glass filler. The brazing was carried out at 873 K for 1 min in a vacuum atmosphere (1 x 10{sup -3} Pa), and then the specimens were quenched at the rate of 30 K/s by blowing He. The metallic glass brazing of Cu using Pd{sub 40}Cu{sub 30}Ni{sub 10}P{sub 20} filler was successful, with the exception that several voids remained in the filler. According to micro-focused X-ray diffraction, no diffraction patterns were observed at both the center of the Pd{sub 40}Cu{sub 30}Ni{sub 10}P{sub 20} filler and the Cu/Pd{sub 40}Cu{sub 30}Ni{sub 10}P{sub 20} interface. The result showed that the Cu specimens were joined with Pd{sub 40}Cu{sub 30}Ni{sub 10}P{sub 20} filler in the glassy state. The tensile fracture strength of the brazed specimens ranged from 20 to 250 MPa. The crack extension from the voids in the Pd{sub 40}Cu{sub 30}Ni{sub 10}P{sub 20} filler may have caused the results to be uneven and very low compared to the strength of Pd-based bulk metallic glass.

  13. Atomistic models of Cu diffusion in CuInSe2 under variations in composition

    Science.gov (United States)

    Sommer, David E.; Dunham, Scott T.

    2018-03-01

    We construct an analytic model for the composition dependence of the vacancy-mediated Cu diffusion coefficient in undoped CuInSe2 using parameters from density functional theory. The applicability of this model is supported numerically with kinetic lattice Monte Carlo and Onsager transport tensors. We discuss how this model relates to experimental measurements of Cu diffusion, arguing that our results can account for significant contributions to the bulk diffusion of Cu tracers in non-stoichiometric CuInSe2.

  14. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  15. Magnetron sputtered Cu{sub 3}N/NiTiCu shape memory thin film heterostructures for MEMS applications

    Energy Technology Data Exchange (ETDEWEB)

    Kaur, Navjot; Choudhary, Nitin [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India); Goyal, Rajendra N. [Indian Institute of Technology, Roorkee, Department of Chemistry (India); Viladkar, S. [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India); Matai, I.; Gopinath, P. [Indian Institute of Technology, Roorkee, Centre for Nanotechnology (India); Chockalingam, S. [Indian Institute of Technology, Guwahati, Department of Biotechnology (India); Kaur, Davinder, E-mail: dkaurfph@iitr.ernet.in [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India)

    2013-03-15

    In the present study, for the first time, Cu{sub 3}N/NiTiCu/Si heterostructures were successfully grown using magnetron sputtering technique. Nanocrystalline copper nitride (Cu{sub 3}N with thickness {approx}200 nm) thin films and copper nanodots were subsequently deposited on the surface of 2-{mu}m-thick NiTiCu shape memory thin films in order to improve the surface corrosion and nickel release properties of NiTiCu thin films. Interestingly, the phase transformation from martensite phase to austenite phase has been observed in Cu{sub 3}N/NiTiCu heterostructures with corresponding change in texture and surface morphology of top Cu{sub 3}N films. Field emission scanning electron microscopy and atomic force microscope images of the heterostructures reveals the formation of 20-nm-sized copper nanodots on NiTiCu surface at higher deposition temperature (450 Degree-Sign C) of Cu{sub 3}N. Cu{sub 3}N passivated NiTiCu films possess low corrosion current density with higher corrosion potential and, therefore, better corrosion resistance as compared to pure NiTiCu films. The concentration of Ni released from the Cu{sub 3}N/NiTiCu samples was observed to be much less than that of pure NiTiCu film. It can be reduced to the factor of about one-ninth after the surface passivation resulting in smooth, homogeneous and highly corrosion resistant surface. The antibacterial and cytotoxicity of pure and Cu{sub 3}N coated NiTiCu thin films were investigated through green fluorescent protein expressing E. coli bacteria and human embryonic kidney cells. The results show the strong antibacterial property and non cytotoxicity of Cu{sub 3}N/NiTiCu heterostructure. This work is of immense technological importance due to variety of BioMEMS applications.

  16. The structure of molten CuCl, CuI and their mixtures as investigated by using neutron diffraction

    International Nuclear Information System (INIS)

    Drewitt, James W E; Salmon, Philip S; Takeda, Shin'ichi; Kawakita, Yukinobu

    2009-01-01

    The structure of molten CuCl, CuI and their mixtures (CuCl) x (CuI) 1-x with x = 0.294, 0.576, 0.801 was studied by using neutron diffraction. The results are discussed by reference to the information that is available on the structure of CuCl and CuI from experiment, theory and computer simulation. The comparison points to a need for more realistic models for the CuCl-CuI system which should take into account the presence of chemical bonds that have been found in CuI by the application of ab initio molecular dynamics methods.

  17. Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

    Science.gov (United States)

    Wang, Ying; Liang, Shuhua; Yang, Qing; Wang, Xianhui

    2016-11-01

    Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl2 + HCl solution. Compared to Cu40Al60 and Cu45Al55 alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu17Al83 alloy as the starting alloy. The growth direction of the FDC is , and all angles between the trunks and branches are 60°. Nanoscale Cu2O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu17Al83 alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl2 intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

  18. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  19. Recycled tetrahedron-like CuCl from waste Cu scraps for lithium ion battery anode.

    Science.gov (United States)

    Hou, Hongying; Yao, Yuan; Liu, Song; Duan, Jixiang; Liao, Qishu; Yu, Chengyi; Li, Dongdong; Dai, Zhipeng

    2017-07-01

    The wide applications of metal Cu inevitably resulted in a large quantity of waste Cu materials. In order to recover the useful Cu under the mild conditions and reduce the environmental emission, waste Cu scraps were recycled in the form of CuCl powders with high economic value added (EVA) via the facile hydrothermal route. The recycled CuCl powders were characterized in terms of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD). The results suggested that the recycled CuCl powders consisted of many regular tetrahedron-like micro-particles. Furthermore, in order to reduce the cost of lithium ion battery (LIB) anode and build the connection of waste Cu scraps and LIB, the recycled CuCl powders were evaluated as the anode active material of LIB. As expected, the reversible discharge capacity was about 171.8mAh/g at 2.0C even after 50 cycles, implying the satisfactory cycle stability. Clearly, the satisfactory results may open a new avenue to develop the circular economy and the sustainable energy industry, which would be very important in terms of both the resource recovery and the environmental protection. Copyright © 2017. Published by Elsevier Ltd.

  20. Effect of Cu content on wear resistance and mechanical behavior of Ti-Cu binary alloys

    Science.gov (United States)

    Yu, Feifei; Wang, Hefeng; Yuan, Guozheng; Shu, Xuefeng

    2017-04-01

    Arc melting with nonconsumable tungsten electrode and water-cooled copper crucible was used to fabricate Ti-Cu binary alloys with different Cu contents in an argon atmosphere. The compositions and phase structures of the fabricated alloys were investigated by glow discharge optical emission spectroscopy (GDOES) and X-ray diffraction (XRD). Nanoindentation tests through continuous stiffness measurement were then performed at room temperature to analyze the mechanical behaviors of the alloys. Results indicated that the composition of each Ti-Cu binary alloy was Ti(100- x) Cu x ( x = 43, 60, 69, and 74 at.%). The XRD analysis results showed that the alloys were composed of different phases, indicating that different Cu contents led to the variations in alloy hardness. The wear tests results revealed that elemental Cu positively affects the wear resistance properties of the Ti-Cu alloys. Nanoindentation testing results showed that the moduli of the Ti-Cu alloys were minimally changed at increasing Cu content, whereas their hardness evidently increased according to the wear test results.

  1. CuAlO2 and CuAl2O4 thin films obtained by stacking Cu and Al films using physical vapor deposition

    Science.gov (United States)

    Castillo-Hernández, G.; Mayén-Hernández, S.; Castaño-Tostado, E.; DeMoure-Flores, F.; Campos-González, E.; Martínez-Alonso, C.; Santos-Cruz, J.

    2018-06-01

    CuAlO2 and CuAl2O4 thin films were synthesized by the deposition of the precursor metals using the physical vapor deposition technique and subsequent annealing. Annealing was carried out for 4-6 h in open and nitrogen atmospheres respectively at temperatures of 900-1000 °C with control of heating and cooling ramps. The band gap measurements ranged from 3.3 to 4.5 eV. Electrical properties were measured using the van der Pauw technique. The preferred orientations of CuAlO2 and CuAl2O4 were found to be along the (1 1 2) and (3 1 1) planes, respectively. The phase percentages were quantified using a Rietveld refinement simulation and the energy dispersive X-ray spectroscopy indicated that the composition is very close to the stoichiometry of CuAlO2 samples and with excess of aluminum and deficiency of copper for CuAl2O4 respectively. High resolution transmission electron microscopy identified the principal planes in CuAlO2 and in CuAl2O4. Higher purities were achieved in nitrogen atmosphere with the control of the cooling ramps.

  2. Calculation of diffraction patterns associated with electron irradiation induced amorphization of CuTi

    International Nuclear Information System (INIS)

    Devanathan, R.; Meshii, M.; Sabochik, M.J.

    1990-11-01

    A new approach that uses the multislice method in conjunction with molecular dynamics simulations to study electron irradiation induced amorphisation is presented. Diffraction patterns were calculated for CuTi and found to be more sensitive than the pair correlation function to the structural changes preceding amorphisation. The results from this approach and from a study of long range order are presented. 16 refs., 8 figs

  3. Assembly of a check-patterned CuS{sub x}–TiO{sub 2} film with an electron-rich pool and its application for the photoreduction of carbon dioxide to methane

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Homin; Kwak, Byeong Sub [Department of Chemistry, College of Science, Yeungnam University, Gyeongsan, Gyeongbuk 38541 (Korea, Republic of); Park, No-Kuk [School of Chemical Engineering, Yeungnam University, Gyeongsan, Gyeongbuk 38541 (Korea, Republic of); Baek, Jeom-In [KEPCO Research Institute, Korea Electric Power Corporation, 105 Munji-ro, Yuseong-gu, Daejeon 34056 (Korea, Republic of); Ryu, Ho-Jung [Korea Institute of Energy Research, 152 Gajeong-ro, Yuseong-gu, Daejeon 34129 (Korea, Republic of); Kang, Misook, E-mail: mskang@ynu.ac.kr [Department of Chemistry, College of Science, Yeungnam University, Gyeongsan, Gyeongbuk 38541 (Korea, Republic of)

    2017-01-30

    Highlights: • A new check-patterned CuS{sub x}–TiO{sub 2} film was prepared by the squeeze printing method. • Significantly increased amounts of CO{sub 2} were adsorbed on the CuS{sub x}–TiO{sub 2} film. • High amounts of CH{sub 4} (53.2 μmolg{sub cat}{sup −1} L{sup −1}) were produced over the CuS{sub x}–TiO{sub 2} film. • An electron-rich pool was supposedly formed at the boundary between TiO{sub 2} and CuS{sub x}. - Abstract: A new check-patterned CuS{sub x}–TiO{sub 2} film was designed to improve the photoreduction of CO{sub 2} to CH{sub 4}. The check-patterned CuS{sub x}–TiO{sub 2} film with a 3D-network microstructure was fabricated by a facile squeeze method. The as-synthesized TiO{sub 2} and CuS{sub x} powders, as well as the patterned film, were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), UV–visible spectroscopy, cyclic voltammetry (CV), and photoluminescence (PL) spectroscopy, as well as photocurrent density and CO{sub 2} temperature-programmed desorption (TPD) measurements. Compared to pure CuS{sub x} and TiO{sub 2}, the check-patterned CuS{sub x}–TiO{sub 2} film exhibited significantly increased adsorption of CO{sub 2} on its networked microstructure, attributed to the enlarged interfaces between the microparticles. The check-patterned CuS{sub x}–TiO{sub 2} film exhibited superior photocatalytic behavior, with 53.2 μmolg{sub cat}{sup −1} L{sup −1} of CH{sub 4} produced after 8 h of reaction, whereas 18.1 and 7.3 μmolg{sub cat}{sup −1} L{sup −1} of CH{sub 4} were produced from pure TiO{sub 2} and CuS{sub x} films under the same reaction conditions, respectively. A model for enhanced photoactivity over the check-patterned CuS{sub x} − TiO{sub 2} film was proposed. Results indicated that the check-patterned CuS–TiO{sub 2} material is quite promising as a photocatalyst for the reduction of CO{sub 2} to CH{sub 4}.

  4. Thermal gravimetric analysis of the CsCuCl3, Cs2CuCl4 and Cs2CuCl4x2H2O crystals

    International Nuclear Information System (INIS)

    Soboleva, L.V.; Vasil'eva, M.G.

    1977-01-01

    The thermal characteristics of crystals of Cs 2 CuCl 4 , Cs 2 CuCl 4 x2H 2 O, and CsCuCl 3 were investigated thermogravimetrically. The derivatogram of the Cs 2 CuCl 4 crystal is characterized by the presence of a single endothermal effect at 505 deg C. The derivatogram of the Cs 2 CuCl 4 x2H 2 O crystal contains three endothermal effects: at 40, 135, and 480 deg C. The derivatogram of the CsCuCl 3 crystal shows the presence of two endothermal effects at 142 and 455 deg C. The thermogravimetric data on Cs 2 CuCl 4 and CsCuCl 3 crystals reveal crystal decomposition on melting; hence, these crystals cannot be grown from melts

  5. Stark broadening in the laser-induced Cu I and Cu II spectra

    International Nuclear Information System (INIS)

    Skočić, M; Burger, M; Nikolić, Z; Bukvić, S; Djeniže, S

    2013-01-01

    In this work we present the Stark widths (W) of 22 neutral (Cu I) and 100 singly ionized (Cu II) copper spectral lines that have been measured at 18 400 K and 19 300 K electron temperatures and 6.3 × 10  22 m −3 and 2.1 × 10  23 m −3 electron densities, respectively. The experiment is conducted in the laser-induced plasma—the Nd:YAG laser, operating at 532 nm, was used to produce plasma from the copper sample in the residual air atmosphere at a pressure of 8 Pa. The electron temperature and density were estimated by the Boltzmann-plot method and from the Saha equation. The investigated Cu I lines belong to the 4s–4p′, 4s  2 –4p″ and 4p′–4d′ transitions while Cu II spectral lines belong to the 4s–4p, 4p–5s, 4p–4d, 4p–4s  2 , 4d–4f and 4d–v transitions. Comparison with existing experimental data was possible only in the case of 17 Cu II lines due to a lack of experimental and theoretical values. The rest of the data, Stark widths of 22 Cu I and 83 Cu II lines are published for the first time. (paper)

  6. Growth and magnetic properties dependence of the Co–Cu/Cu films electrodeposited under high magnetic fields

    Energy Technology Data Exchange (ETDEWEB)

    Franczak, Agnieszka, E-mail: agnieszka.franczak@mtm.kuleuven.be [Laboratoire d’Ingénierie et Sciences des Matériaux (LISM EA 4695), Université de Reims Champagne-Ardenne, UFR Sciences et Naturelles, Bat. 6, Moulin de la Housse, BP 1039, 51687 Reims Cedex 2 (France); Department of Materials Science (MTM), KU Leuven, Kasteelpark Arenberg 44, 3001 Haverlee (Leuven) (Belgium); Levesque, Alexandra [Laboratoire d’Ingénierie et Sciences des Matériaux (LISM EA 4695), Université de Reims Champagne-Ardenne, UFR Sciences et Naturelles, Bat. 6, Moulin de la Housse, BP 1039, 51687 Reims Cedex 2 (France); Zabinski, Piotr [Laboratory of Physical Chemistry and Electrochemistry, Faculty of Non-Ferrous Metals, AGH University of Science and Technology, al. A. Mickiewicza 30, 30059 Krakow (Poland); Li, Donggang [Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, 314 Box, 110004 Shenyang (China); Czapkiewicz, Maciej [Department of Electronics, AGH University of Science and Technology, al. A. Mickiewicza 30, 30059 Krakow (Poland); Kowalik, Remigiusz [Laboratory of Physical Chemistry and Electrochemistry, Faculty of Non-Ferrous Metals, AGH University of Science and Technology, al. A. Mickiewicza 30, 30059 Krakow (Poland); Bohr, Frédéric [Laboratoire d’Ingénierie et Sciences des Matériaux (LISM EA 4695), Université de Reims Champagne-Ardenne, UFR Sciences et Naturelles, Bat. 6, Moulin de la Housse, BP 1039, 51687 Reims Cedex 2 (France); and others

    2015-07-15

    The present work is focused on the investigations of magnetic properties dependence on microstructure of Co–Cu/Cu films electrodeposited under superimposed high magnetic field. The experimental results indicate a strong effect of an external magnetic field on the morphology of deposited films, more precisely on the Co:Cu ratio that determines the film growth. It is shown that the Co–Cu/Cu films electrodeposited without superimposed magnetic field consisted of two clearly visible features: compact film with incorporated granular particles. Under a superimposed external high magnetic field the privilege growth of the particles was induced. As a consequence, development of the well-defined branched structure of Co–Cu/Cu film was observed. In contrary, the phase compositional investigations do not reveal any changes in the phase formation during electrodeposition under magnetic field conditions. Thus, it is assumed that a strong growth of Co–Cu/Cu films in (111) direction under magnetic or non-magnetic electrodeposition conditions is related with the growth of Cu (111) plane and embedded into it some of the Co fcc atoms of same (111) orientation, as well as the Co hcp atoms that grows in the (002) direction. This non-equilibrium growth of Co–Cu/Cu films under magnetic deposition conditions affects strongly the magnetic properties of deposited films, revealing that films obtained under magnetic fields higher than 3 T were no more magnetic materials. - Highlights: • Co–Cu/Cu electrodeposits were obtained at elevated temperature under HMFs. • The effects of HMFs on microstructure and magnetic properties were investigated. • Interesting morphological changes due to HMFs has been observed. • Changes in Co:Cu ratio due to HMFs modified the magnetic properties of deposits.

  7. Growth and magnetic properties dependence of the Co–Cu/Cu films electrodeposited under high magnetic fields

    International Nuclear Information System (INIS)

    Franczak, Agnieszka; Levesque, Alexandra; Zabinski, Piotr; Li, Donggang; Czapkiewicz, Maciej; Kowalik, Remigiusz; Bohr, Frédéric

    2015-01-01

    The present work is focused on the investigations of magnetic properties dependence on microstructure of Co–Cu/Cu films electrodeposited under superimposed high magnetic field. The experimental results indicate a strong effect of an external magnetic field on the morphology of deposited films, more precisely on the Co:Cu ratio that determines the film growth. It is shown that the Co–Cu/Cu films electrodeposited without superimposed magnetic field consisted of two clearly visible features: compact film with incorporated granular particles. Under a superimposed external high magnetic field the privilege growth of the particles was induced. As a consequence, development of the well-defined branched structure of Co–Cu/Cu film was observed. In contrary, the phase compositional investigations do not reveal any changes in the phase formation during electrodeposition under magnetic field conditions. Thus, it is assumed that a strong growth of Co–Cu/Cu films in (111) direction under magnetic or non-magnetic electrodeposition conditions is related with the growth of Cu (111) plane and embedded into it some of the Co fcc atoms of same (111) orientation, as well as the Co hcp atoms that grows in the (002) direction. This non-equilibrium growth of Co–Cu/Cu films under magnetic deposition conditions affects strongly the magnetic properties of deposited films, revealing that films obtained under magnetic fields higher than 3 T were no more magnetic materials. - Highlights: • Co–Cu/Cu electrodeposits were obtained at elevated temperature under HMFs. • The effects of HMFs on microstructure and magnetic properties were investigated. • Interesting morphological changes due to HMFs has been observed. • Changes in Co:Cu ratio due to HMFs modified the magnetic properties of deposits

  8. Effects of Cu content on the photoelectrochemistry of Cu2ZnSnS4 nanocrystal thin films

    International Nuclear Information System (INIS)

    Khoshmashrab, Saghar; Turnbull, Matthew J.; Vaccarello, Daniel; Nie, Yuting; Martin, Spencer; Love, David A.; Lau, Po K.; Sun, Xuhui; Ding, Zhifeng

    2015-01-01

    Highlights: • Two compositions of CZTS were synthesized, one yielding Cu-poor and the other Cu-stoichiometric nanocrystals (NCs). • Physical and electronic properties of both films were probed using various analytical techniques. • Films comprised of Cu-poor CZTS showed tighter packing with less defects compared to those of stoichiometric-Cu. • Photoelectrochemical measurements exhibited increased photoconversion and increased photostability of the Cu-poor films. • Intensity modulated photocurrent spectroscopy showed that the Cu-deficient NCs had half the recombination rate as that of stoichiometric-Cu films. - Abstract: Cu 2 ZnSnS 4 (CZTS) nanocrystals (NCs) were prepared via a one-pot solvothermal method. Given that the composition affects the electronic properties of this p-type semiconductor, two compositional ratios were chosen from 10 designed and synthesized analogues, one yielding Cu-poor and the other Cu-stoichiometric CZTS. NCs in which the Cu concentration was slightly below stoichiometric yielded more uniform films with greater photovoltaic performance. The lower Cu content also lead to slightly better crystallinity within the film, as demonstrated by XRD, Raman spectroscopy and transmission electron microscopy. Chronophotoelectrochemical measurements indicated that both types of NC films displayed good stability; however, with a decrease in potential, an increase in resistance for the Cu-stoichiometric film was observed. As determined by intensity modulated photocurrent spectroscopy, the product separation rate of the photoinduced holes and electrons in the Cu-poor films were more than 3 times that of the Cu-stoichiometric, confirming that the lower Cu content led to an improved photoperformance

  9. Quarternair CuGaSeTe and CuGa0.5In 0.5Te2 Thin Films Fabrication Using Flash Evaporation

    Directory of Open Access Journals (Sweden)

    A Harsono Soepardjo

    2010-10-01

    Full Text Available Quarternair materials CuGaSeTe and CuGa0.5In 0.5Te2 are the basic materials to solar cell fabrication. These materials have high absorption coefficients around 103 - 105 cm-1 and band gap energy in the range of 1-5 eV. In this research, the films were made by flash evaporation method using quarternair powder materials of CuGaSeTe and CuGa0.5In 0.5Te2 to adhere in a glass substrate. After the films were obtained, the properties of these films will be characterized optically and electrically. The lattice parameter of the films and the crystalline film structure were obtained using X-Ray Diffraction (XRD spectroscopy. The XRD results show that the quarternair CuGaSeTe and CuGa0.5In 0.5Te2 films have a chalcopyrite structure. The absorption coefficient and the  band gap energy of the films were calculated using transmittance and reflectance patterns that measured using UV-VIS Difractometer. The films composition can be detected by using the Energy Dispersive Spectroscopy (EDS, while the films resistivity, mobility and the majority carrier of the films were obtained from Hall Effect experiments.

  10. Enhancement in visible light photocatalytic activity by embedding Cu nanoparticles over CuS/MCM-41 nanocomposite

    Science.gov (United States)

    Sohrabnezhad, Sh.; Karamzadeh, M.

    2017-07-01

    This article indicate the biogenic synthesis of copper nanoparticles (Cu NPs) using the borage flowers extract of Borago officinalis over CuS/MCM-41 nanocomposite (NC). No external reducing was utilized in the developed method. The CuS-MCM-41 NC was used as stabilizing agent. The synthesis of CuS nanostructure in MCM-41 material has been realized by hydrothermal method. Their physiochemical properties have been characterized by X-ray diffraction, transmission electron microscopy (TEM), UV-Visible diffuse reflectance spectroscopy, and Fourier transform infrared spectroscopy. On the basis of TEM images, a layer of Cu NPs has been located over CuS/MCM-41 NC with average diameter of 60-80 nm. The results revealed the spherical nature of the prepared Cu NPs with diameter less than 10 nm. The DR spectra of Cu NPs in MCM-41 and CuS-MCM-41 NCs showed surface plasmon resonance bands at 570 and 500-600 nm, respectively. The photocatalytic activity was evaluated under visible light irradiation using the photocatalytic degradation of methylene blue (MB) as a model reaction. The prepared Cu/CuS/MCM-41 nanocomposite microspheres showed higher photodegradation ability for MB than CuS/MCM-41. The degradation of MB achieved up to 80% after 60 min and the nanocomposite could be recycled and reused.

  11. Diffusion and adhesion properties of Cu films on polyimide substrates

    International Nuclear Information System (INIS)

    Liang, T.X.; Liu, Y.Q.; Fu, Z.Q.; Luo, T.Y.; Zhang, K.Y.

    2005-01-01

    Copper thin films were prepared on polyimide (PI) substrates by physical vapor deposition (PVD) and chemical vapor deposition (CVD). Titanium nitride (TiN) diffusion barrier layers were deposited between the copper films and the PI substrates by PVD. Auger electron spectroscopy compositional depth profile showed that TiN barrier layer was very effective in preventing copper diffusion into PI substrate even after the Cu/TiN/PI samples were annealed at 300 deg. C for 5 h. For the as-deposited CVD-Cu/PI, CVD-Cu/TiN/PI, and as-deposited PVD-Cu/PI samples, the residual stress in Cu films was very small. Relatively larger residual stress existed in Cu films for PVD-Cu/TiN/PI samples. For PVD-Cu/TiN/PI samples, annealing can increase the peeling strength to the level observed without a diffusion barrier. The adhesion improvement of Cu films by annealing treatment can be attributed to lowering of the residual tensile stress in Cu films

  12. The crystal structure of paramagnetic copper(ii) oxalate (CuC2O4):

    DEFF Research Database (Denmark)

    Christensen, Axel Nørlund; Lebech, Bente; Andersen, Niels Hessel

    2014-01-01

    Synthetic copper(ii) oxalate, CuC2O4, was obtained in a precipitation reaction between a copper(ii) solution and an aqueous solution of oxalic acid. The product was identified from its conventional X-ray powder patterns which match that of the copper mineral Moolooite reported to have...... the composition CuC2O4·0.44H2O. Time resolved in situ investigations of the thermal decomposition of copper(ii) oxalate using synchrotron X-ray powder diffraction showed that in air the compound converts to Cu2O at 215 °C and oxidizes to CuO at 345 °C. Thermo gravimetric analysis performed in an inert Ar....... The crystal structure consists of a random stacking of CuC2O4 micro-crystallites where half the Cu-atoms are placed at (2a) and the other half at (2b) positions with the corresponding oxalate molecules centred around the corresponding (2b) and (2a) site positions, respectively. The diffraction patterns...

  13. Growth and characterization of NixCu1-x alloy films, NixCu1-x/NiyCu1-y multilayers, and nanowires

    International Nuclear Information System (INIS)

    Kazeminezhad, I.

    2001-12-01

    It was found that it is possible to grow Ni x Cu 1-x alloy systems of arbitrary composition by electrodepositing well-defined sub-monolayer quantities of Ni and Cu in alternation using a new method based on that used previously to prepare potentiostatically deposited magnetic multilayers from a single sulphamate-based electrolyte. Following growth, the chemical composition of Ni x Cu 1-x alloy films was obtained by ZAF-corrected energy dispersive X-Ray (EDX) analysis and less than a 4% difference between the nominal and actual composition was observed. The structure of the films was investigated by high-angle X-ray diffractometry (HAXRD) and transmission electron microscopy (TEM). The films grown on polycrystalline Cu substrates had (100) texture, while those grown on Au-coated glass had (111) texture. Some evidence of Ni clustering was obtained by vibrating sample magnetometry (VSM). Self-organisation of the deposited metal was suggested for Ni potentials more positive than ∼-1.4V. The transition from a Ni/Cu multilayer to a Ni x Cu 1-x alloy was also studied and an interesting aspect, namely a plateau region in a plot of magnetisation as a function of Ni layer thickness was observed, suggesting a preferred Ni cluster size in these alloy films. Anisotropic magnetoresistance (AMR) of the films decreased with increasing Cu content at 300K and 77K. SQUID measurements for Ni 0.52 Cu 0.48 and Ni 0.62 CU 0.38 films showed that they become much more strongly ferromagnetic at low temperatures. Evidence for blocked -superparamagnetic behaviour above a blocking temperature (T B ) of the films was obtained from zero-field-cooled (ZFC) and field-cooled (FC) magnetic susceptibility measurements. Ni x Cu 1-x /Ni y Cu 1-y alloy/alloy multilayer films with short repeat distance were successfully fabricated using this method. Up to third order satellite peaks observed in HAXRD showed that the interface is sharp. Room temperature longitudinal magnetoresistance measurements showed

  14. First-principles study of electronic structure of CuSbS{sub 2} and CuSbSe{sub 2} photovoltaic semiconductors

    Energy Technology Data Exchange (ETDEWEB)

    Maeda, T., E-mail: tmaeda@ad.ryukoku.ac.jp; Wada, T.

    2015-05-01

    We studied the features of CuSbS{sub 2} (CAS) and CuSbSe{sub 2} (CASe), two proposed photovoltaic compounds, and clarified their electronic structures by first-principles calculations and compared them to the chalcopyrite-type CuInSe{sub 2} results. For both CAS and CASe, the calculated enthalpies of formation of the chalcostibite phases were considerably lower than those of the chalcopyrite phases. Therefore, we considered that the chalcostibite phase is more stable for CAS and CASe. In their band structure calculated with the HSE06 hybrid functional, the valence band maxima of CAS and CASe were located at the Γ-point, and the conduction band minima were located at the R-point. Their second lowest conduction band was located at the Γ-point, whose energy level nearly equaled the R-point. For CAS (CASe), the partial density of the states shows the character of the Cu 3d and S 3p (Se 4p) orbitals at the top of the valence bands and the Sb 5p and S 3p (Se 4p) orbitals at the bottom of the conduction bands. The conduction bands of CAS and CASe have a p-orbital character (Sb 5p) that differs from the s-orbital character (In 5s) of CuInSe{sub 2}. It is for the reason that CAS and CASe do not have a chalcopyrite structure but a chalcostibite-type structure. The calculated absorption coefficient of CuSbS{sub 2} (10{sup 4}-10{sup 5} cm{sup −1}) is comparable to that of CuInSe{sub 2}. - Highlights: • We studied the features of CuSbS{sub 2} and CuSbSe{sub 2}, newly proposed photovoltaic compounds. • Chalcostibite phase is more stable in CuSbS{sub 2} and CuSbSe{sub 2}. • Band structures of CuSbS{sub 2} and CuSbS{sub 2} were calculated with HSE06 hybrid functional. • Absorption coefficient of chalcostibite-type CuSbS{sub 2} is comparable to that of CuInSe{sub 2}.

  15. Preparation of CuS nanoparticles embedded in poly(vinyl alcohol ...

    Indian Academy of Sciences (India)

    WINTEC

    ray diffraction (XRD) analyses and electron diffraction pattern also revealed the forming of CuS crystal structure in the PVA fibres. Keywords. CuS nanoparticles; electrospinning; poly(vinyl alcohol). 1. Introduction. In the past decade, the preparation of low-dimensional semiconductor nanostructures has become a hotspot of.

  16. Self-assembled magnetic nitride dots on Cu(100) surfaces

    NARCIS (Netherlands)

    Gallego, JM; Grachev, SY; Passeggi, MCG; Sacharowitz, F; Ecija, D; Miranda, R; Boerma, DO

    We describe here a procedure for the direct fabrication of a self-organized, ordered pattern of Fe4N magnetic dots on an otherwise clean Cu(100) surface. It is based on the evaporation of Fe in a flux of atomic N produced by a plasma source onto a Cu(100) surface kept at 700 K. The large-scale

  17. Treatment of reverse osmosis (RO) concentrate by the combined Fe/Cu/air and Fenton process (1stFe/Cu/air-Fenton-2ndFe/Cu/air).

    Science.gov (United States)

    Ren, Yi; Yuan, Yue; Lai, Bo; Zhou, Yuexi; Wang, Juling

    2016-01-25

    To decompose or transform the toxic and refractory reverse osmosis (RO) concentrate and improve the biodegradability, 1stFe/Cu/air-Fenton-2ndFe/Cu/air were developed to treat RO concentrate obtained from an amino acid production plant in northern China. First, their operating conditions were optimized thoroughly. Furthermore, 5 control experiments were setup to confirm the superiority of 1stFe/Cu/air-Fenton-2ndFe/Cu/air and synergistic reaction between Fe/Cu/air and Fenton. The results suggest that the developed method could obtain high COD removal (65.1%) and BOD5/COD ratio (0.26) due to the synergistic reaction between Fe/Cu/air and Fenton. Under the optimal conditions, the influent and effluent of 1stFe/Cu/air-Fenton-2ndFe/Cu/air and 5 control experiments were analyzed by using UV, FTIR, EEM and LC, which confirm the superiority of 1stFe/Cu/air-Fenton-2ndFe/Cu/air. Therefore, the developed method in this study is a promising process for treatment of RO concentrate. Copyright © 2015 Elsevier B.V. All rights reserved.

  18. Magnetic dipole moments of 58Cu and 59Cu by in-source laser spectroscopy

    International Nuclear Information System (INIS)

    Stone, N. J.; Koester, U.; Stone, J. Rikovska; Fedorov, D. V.; Fedoseyev, V. N.; Flanagan, K. T.; Hass, M.; Lakshmi, S.

    2008-01-01

    Online measurements of the magnetic dipole moments and isotope shifts of 58 Cu and 59 Cu by the in-source laser spectroscopy method are reported. The results for the magnetic moments are μ ( 58 Cu) =+0.52(8) μ N ,μ( 59 Cu) =+1.84(3) μ N and for the isotope shifts δν 59,65 =1.72(22) GHz and δν 58,65 =1.99(30) GHz in the transition from the 3d 10 4s 2 S 1/2 ground state to the 3d 10 4p 2 P 1/2 state in Cu I. The magnetic moment of 58 Cu is discussed in the context of the strength of the subshell closure at 56 Ni, additivity rules and large-scale shell model calculations

  19. Development of cold sprayed Cu coating for canister

    International Nuclear Information System (INIS)

    Kim, Hyung Jun; Kang, Yoon Ha

    2010-01-01

    Cold sprayed Cu deposition was studied for the application of outer part of canister for high level nuclear waste. Five commercially available pure Cu powders were analyzed and sprayed by high pressure cold spray system. Electrochemical corrosion test using potentiostat in 3.5% NaCl solution was conducted as well as microstructural analysis including hardness and oxygen content measurements. Overall evaluation of corrosion performance of cold sprayed Cu deposition is inferior to forged and extruded Cu plates, but some of Cu depositions are comparable to Cu plates. The simulated corrosion test in 200m underground cave is still in progress. The effect of cold spray process parameters was also studied and the results show that the type of nozzle is the most important other than powder feed rate, spray distance, and scan speed. 1/10 scale miniature of canister was manufactured confirming that the production of full scale canister is possible

  20. Copper isotopic zonation in the Northparkes porphyry Cu-Au deposit, SE Australia

    Science.gov (United States)

    Li, Weiqiang; Jackson, Simon E.; Pearson, Norman J.; Graham, Stuart

    2010-07-01

    Significant, systematic Cu isotopic variations have been found in the Northparkes porphyry Cu-Au deposit, NSW, Australia, which is an orthomagmatic porphyry Cu deposit. Copper isotope ratios have been measured in sulfide minerals (chalcopyrite and bornite) by both solution and laser ablation multi-collector inductively coupled plasma-mass spectrometry (MC-ICP-MS). The results from both methods show a variation in δ 65Cu of hypogene sulfide minerals of greater than 1‰ (relative to NIST976). Significantly, the results from four drill holes through two separate ore bodies show strikingly similar patterns of Cu isotope variation. The patterns are characterized by a sharp down-hole decrease from up to 0.8‰ (0.29 ± 0.56‰, 1 σ, n = 20) in the low-grade peripheral alteration zones (phyllic-propylitic alteration zone) to a low of ˜-0.4‰ (-0.25 ± 0.36‰, 1 σ, n = 30) at the margins of the most mineralized zones (Cu grade >1 wt%). In the high-grade cores of the systems, the compositions are more consistent at around 0.2‰ (0.19 ± 0.14‰, 1 σ, n = 40). The Cu isotopic zonation may be explained by isotope fractionation of Cu between vapor, solution and sulfides at high temperature, during boiling and sulfide precipitation processes. Sulfur isotopes also show an isotopically light shell at the margins of the high-grade ore zones, but these are displaced from the low δ 65Cu shells, such that there is no correlation between the Cu and S isotope signatures. Fe isotope data do not show any discernable variation along the drill core. This work demonstrates that Cu isotopes show a large response to high-temperature porphyry mineralizing processes, and that they may act as a vector to buried mineralization.

  1. Cu{sup 2+}-modified physical properties of Cobalt-Nickel ferrite

    Energy Technology Data Exchange (ETDEWEB)

    Rajasekhar Babu, K.; Rao, K. Rama [Department of Physics, Andhra University, Visakhapatnam, Andhra Pradesh 530003 (India); Rajesh Babu, B., E-mail: rajeshbabu.bitra@gmail.com [Department of Physics, GVP College of Engineering for Women, Visakhapatnam, Andhra Pradesh 530048 (India)

    2017-07-15

    Highlights: • In this work, Influence of Cu and cation redistribution is discussed in detail. • Theoretical and experimental results related to distribution, lattice constant are found to be consistent. • Substitution of Cu significantly modifies the magnetization, permeability, grain size and resistivity. - Abstract: The present study focused on structural, magnetic and electrical properties of Cu substituted Co-Ni ferrite nanoparticles synthesized by sol-gel combustion method. X-ray diffraction, Fourier Transform infra-red spectroscopy (FTIR), magnetization, magnetic permeability and resistivity measurements were carried out to study the structural, magnetic and electrical properties. X-ray diffraction pattern confirms single phase spinel formation. Crystallite size determined from Scherer’s method increases with Cu concentration. Distribution of cations was estimated from X-ray line intensity calculations, suggest that the majority of Cu{sup 2+} ions occupy octahedral (B) site. Saturation magnetization exhibit increasing trend from 40 emu/g (x = 0.0) to 60 emu/g (x = 0.4) with Cu concentration, though higher magnetic moment Ni ions are replaced by lower magnetic moment Cu ions. Magnetic permeability increases with increasing Cu concentration and shows a flat profile in the frequency range 1–50 MHz. Significant modification in DC electrical resistivity and activation energy are explained on the basis of hopping mechanism.

  2. Nanostructured CuO thin film electrodes prepared by spray pyrolysis: a simple method for enhancing the electrochemical performance of CuO in lithium cells

    International Nuclear Information System (INIS)

    Morales, Julian; Sanchez, Luis; Martin, Francisco; Ramos-Barrado, Jose R.; Sanchez, Miguel

    2004-01-01

    Nanostructured CuO thin films were prepared by using a spray pyrolysis method, copper acetate as precursor and stainless steel as substrate. The textural and structural properties of the films were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The SEM images revealed thorough coating of the substrate and thickness of 450-1250 nm; the average particle size as determined from the AFM images ranged from 30 to 160 nm. The XRD patterns revealed the formation of CuO alone and the XPS spectra confirmed the presence of Cu 2+ as the main oxidation state on the surface. The films were tested as electrodes in lithium cells and their electrochemical properties evaluated from galvanostatic and step potential electrochemical spectroscopy (SPES) measurements. The discharge STEP curves exhibited various peaks consistent with the processes CuO Cu 2 O Cu and with decomposition of the electrolyte, a reversible process in the light of the AFM images. The best electrode exhibited capacity values of 625 Ah kg -1 over more than 100 cycles. This value, which involves a CuO Cu reversible global reaction, is ca. 50% higher than that reported for bulk CuO. The nanosize of the particles and the good adherence of the active material to the substrate are thought to be the key factors accounting for the enhanced electrochemical activity found

  3. The decay of 61Cu nucleus

    International Nuclear Information System (INIS)

    Zheng Wanhui; Gu Jiahui; Zhu Jiabi; Wang Gongqing

    1988-01-01

    The decay of 61 Cu nucleus has been investigated with Ge(Li) and H p Ge detector, semiconductor electron spectrometer and Ge(Li)-NaI γ-γ coincidence spectrometer. 35 γrays from 12 excited levels have been found. The single and coincidence spectra show that 545 keV, 1019keV γ fays and 1019keV energy level are wrong which appear in the 61 Cu decay scheme carried in > (the 7th edition 1978). the halflife time of 61 Cu nucleus and the internal conversion coefficient for 67 keV γ-transition are found to be T 1/2 =207.7±1.6min and α=0.12±0.01 respectively and then a decay scheme is proposed. In this paper more attention ia paid to discussing the energy levels of 1014, 1019, and 1997 keV as well as some weak γ rays

  4. Spatially Correlated, Single Nanomaterial-Level Structural and Optical Profiling of Cu-Doped ZnO Nanorods Synthesized via Multifunctional Silicides

    Directory of Open Access Journals (Sweden)

    Johnson Truong

    2018-04-01

    Full Text Available We demonstrate a straightforward and effective method to synthesize vertically oriented, Cu-doped ZnO nanorods (NRs using a novel multipurpose platform of copper silicide nanoblocks (Cu3Si NBs preformed laterally in well-defined directions on Si. The use of the surface-organized Cu3Si NBs for ZnO NR growth successfully results in densely assembled Cu-doped ZnO NRs on each NB platform, whose overall structures resemble thick bristles on a brush head. We show that Cu3Si NBs can uniquely serve as a catalyst for ZnO NRs, a local dopant source of Cu, and a prepatterned guide to aid the local assembly of the NRs on the growth substrate. We also ascertain the crystalline structures, optical properties, and spectroscopic signatures of the Cu-doped ZnO NRs produced on the NBs, both at each module of NRs/NB and at their ensemble level. Subsequently, we determine their augmented properties relative to the pristine form of undoped ZnO NRs and the source material of Cu3Si NBs. We provide spatially correlated structural and optical data for individual modules of Cu-doped ZnO NRs assembled on a Cu3Si NB by resolving them along the different positions on the NB. Ensemble-averaged versus individual behaviors of Cu-doped ZnO NRs on Cu3Si NBs are then compared. We further discuss the potential impact of such ZnO-derived NRs on their relatively unexplored biological and biomedical applications. Our efforts will be particularly useful when exploiting each integrated module of self-aligned, Cu-doped ZnO NRs on a NB as a discretely addressable, active element in solid-state sensors and miniaturized luminescent bioprobes.

  5. On the intrinsic gettering in Cu-contaminated Cz-Si

    International Nuclear Information System (INIS)

    Schmalz, K.; Kirscht, F.G.; Babanskaja, I.; Kittler, M.; Richter, H.; Seifert, W.

    1985-01-01

    NAA, TEM, DLTS, and EBIC investigations of Cu-contaminated Cz-Si with an intrinsic-gettering procedure realized by a multistep heat treatment demonstrate the efficiency of intrinsic gettering concerning redistribution to volume defects for Cu-contamination up to 10 16 cm -3 . The Cu-precipitation at the surface can still be suppressed for such contamination due to volume defects. However, in this case the concentration of contamination induced deep level centers at the surface is independent of the volume defect density. Only for Cu-contamination of about 10 15 cm -3 the gettering effect is strong enough to prevent the introduction of contamination induced deep levels at the surface. (author)

  6. Calculation of Gibbs energy of Zr-Al-Ni, Zr-Al-Cu, Al-Ni-Cu and Zr-Al-Ni-Cu liquid alloys based on quasiregular solution model

    International Nuclear Information System (INIS)

    Li, H.Q.; Yang, Y.S.; Tong, W.H.; Wang, Z.Y.

    2007-01-01

    With the effects of electronic structure and atomic size being introduced, the mixing enthalpy as well as the Gibbs energy of the ternary Zr-Al-Cu, Ni-Al-Cu, Zr-Ni-Al and quaternary Zr-Al-Ni-Cu systems are calculated based on quasiregular solution model. The computed results agree well with the experimental data. The sequence of Gibbs energies of different systems is: G Zr-Al-Ni-Cu Zr-Al-Ni Zr-Al-Cu Cu-Al-Ni . To Zr-Al-Cu, Ni-Al-Cu and Zr-Ni-Al, the lowest Gibbs energy locates in the composition range of X Zr 0.39-0.61, X Al = 0.38-0.61; X Ni = 0.39-0.61, X Al = 0.38-0.60 and X Zr = 0.32-0.67, X Al = 0.32-0.66, respectively. And to the Zr-Ni-Al-Cu system with 66.67% Zr, the lowest Gibbs energy is obtained in the region of X Al = 0.63-0.80, X Ni = 0.14-0.24

  7. Studies of the development and characterization of the Cu-Ni-Pt and Cu-Ni-Sn alloys for electro-electronic uses; Estudos do desenvolvimento e caracterizacao das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletronicos

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Luis Carlos Elias da

    2006-07-01

    The Cu and its alloys have different applications in the owed modern society the excellent electric properties, thermal conductivity, resistance to the corrosion and other properties. These applications can be in valves, pipes, pots for absorption of solar energy, radiators for automobiles, current driver, electronic driver, thermostats elements and structural parts of nuclear reactors, as, for example, reels for field toroidal for a reactor of nuclear coalition. The alloys used in nuclear reactors, we can highlight Cu-Be, Cu-Sn and Cu-Pt. Ni and Co frequently are added to the Cu alloys so that the solubility is moved for temperatures more elevated with relationship to the binary systems of Cu-Sn and Cu-Pt. The addition of Ni-Pt or Ni-Sn to the Cu in the same or inferior percentages to 1,5% plus thermomechanical treatments changes the properties of the copper. We studied the electric conductivity and hardness Vickers of the Cu-Ni-Pt and Cu-Ni-Sn and compared with the electrolytic Cu. In the proposed flowcharts, breaking of the obtaining of the ingot, we proceeded with thermo mechanical treatments. (author)

  8. Radiolabeling and biodistribution of 62Cu-dithiocarbamate

    International Nuclear Information System (INIS)

    Matsumoto, Kazuya; Fujibayashi, Yasuhisa; Yokoyama, Akira; Konishi, Junji.

    1990-01-01

    The newly developed 62 Zn/ 62 Cu generator system has made available the production of the short-lived 62 Cu (T 1/2 = 9.8 min) positron radionuclide, eluted as 62 Cu-glycine. In the search for 62 Cu labeled radiopharmaceuticals for positron CT (PET) brain diagnostic studies, two ligands N,N-diethyl- and N,N-dimethyl-dithiocarbamic acid (DDC and DmDC) were selected, based on their Cu chelating abilities and the neutral lipophilic character of their copper chelates. In the present work, an in vitro study with non-radioactive Cu-glycine showed that both ligands easily formed the stable, neutral Cu-DDC and Cu-DmDC chelates (1:2 metal-ligand complexes) based on the ligand exchange reaction. Then the 62 Zn/ 62 Cu generator eluate, the 62 Cu-glycine was used for the radiolabeling of DDC and DmDC. The following HPLC analysis revealed that the ligand exchange reaction proceeded rapidly; the radiochemical purities of 62 Cu-DDC and 62 Cu-DmDC were extremely high (non-detectable 62 Cu-glycine) and both chelates were more lipophilic than 62 Cu-glycine. The mouse biodistribution of both radiolabeled compounds, 62 Cu-DDC and 62 Cu-DmDC indicated a brain accumlation of 2.8 and 5.3 times higher than 62 Cu-glycine, 15 min post injection, respectively. The brain accumulation observed with both 62 Cu-DDC and 62 Cu-DmDC might be due to their stable, neutral and lipophilic character; the latter enhanced by the presence of the methylated side chains. The gathered results indicated the applicability of dithiocarbamic acid derivatives in the production of new 62 Cu-labeled compounds using the 62 Zn/ 62 Cu generator system based on the ligand exchange reaction with 62 Cu-glycine eluate. Further studies with Cu-dithiocarbamic acid derivatives for development of new generator-produced 62 Cu positron radiopharmaceuticals can be recalled. (author)

  9. Corrosion and runoff rates of Cu and three Cu-alloys in marine environments with increasing chloride deposition rate.

    Science.gov (United States)

    Odnevall Wallinder, Inger; Zhang, Xian; Goidanich, Sara; Le Bozec, Nathalie; Herting, Gunilla; Leygraf, Christofer

    2014-02-15

    Bare copper sheet and three commercial Cu-based alloys, Cu15Zn, Cu4Sn and Cu5Al5Zn, have been exposed to four test sites in Brest, France, with strongly varying chloride deposition rates. The corrosion rates of all four materials decrease continuously with distance from the coast, i.e. with decreasing chloride load, and in the following order: Cu4Sn>Cu sheet>Cu15Zn>Cu5Al5Zn. The patina on all materials was composed of two main layers, Cu2O as the inner layer and Cu2(OH)3Cl as the outer layer, and with a discontinuous presence of CuCl in between. Additional minor patina constituents are SnO2 (Cu4Sn), Zn5(OH)6(CO3)2 (Cu15Zn and Cu5Al5Zn) and Zn6Al2(OH)16CO3·4H2O/Zn2Al(OH)6Cl·2H2O/Zn5Cl2(OH)8·H2O and Al2O3 (Cu5Al5Zn). The observed Zn- and Zn/Al-containing corrosion products might be important factors for the lower sensitivity of Cu15Zn and Cu5Al5Zn against chloride-induced atmospheric corrosion compared with Cu sheet and Cu4Sn. Decreasing corrosion rates with exposure time were observed for all materials and chloride loads and attributed to an improved adherence with time of the outer patina to the underlying inner oxide. Flaking of the outer patina layer was mainly observed on Cu4Sn and Cu sheet and associated with the gradual transformation of CuCl to Cu2(OH)3Cl of larger volume. After three years only Cu5Al5Zn remains lustrous because of a patina compared with the other materials that appeared brownish-reddish. Significantly lower release rates of metals compared with corresponding corrosion rates were observed for all materials. Very similar release rates of copper from all four materials were observed during the fifth year of marine exposure due to an outer surface patina that with time revealed similar constituents and solubility properties. Copyright © 2013 The Authors. Published by Elsevier B.V. All rights reserved.

  10. Solid phase selective separation and preconcentration of Cu(II) by Cu(II)-imprinted polymethacrylic microbeads.

    Science.gov (United States)

    Dakova, Ivanka; Karadjova, Irina; Ivanov, Ivo; Georgieva, Ventsislava; Evtimova, Bisera; Georgiev, George

    2007-02-12

    Ion-imprinted polymer (IIP) particles are prepared by copolymerization of methacrylic acid as monomer, trimethylolpropane trimethacrylate as crosslinking agent and 2,2'-azo-bis-isobutyronitrile as initiator in the presence of Cu(II), a Cu(II)-4-(2-pyridylazo)resorcinol (Cu(II)-PAR) complex, and PAR only. A batch procedure is used for the determination of the characteristics of the Cu(II) solid phase extraction from the IIP produced. The results obtained show that the Cu(II)-PAR IIP has the greatest adsorption capacity (37.4 micromol g(-1) of dry copolymer) among the IIPs investigated. The optimal pH value for the quantitative preconcentration is 7, and full desorption is achieved by 1 M HNO(3). The selectivity coefficients (S(Cu/Me)) for Me=Ni(II), Co(II) are 45.0 and 38.5, respectively. It is established that Cu(II)-PAR IIPs can be used repeatedly without a considerable adsorption capacity loss. The determination of Cu(II) ions in seawater shows that the interfering matrix does not influence the preconcentration and selectivity values of the Cu(II)-PAR IIPs. The detection and quantification limits are 0.001 micromol L(-1) (3sigma) and 0.003 micromol L(-1) (6sigma), respectively.

  11. Highly absorbing Cu-In-O thin films for photovoltaic applications

    International Nuclear Information System (INIS)

    Khemiri, N.; Chaffar Akkari, F.; Kanzari, M.; Rezig, B.

    2008-01-01

    We report in this paper on the preparation and characterization of improved quality Cu-In-O films for use as a high-efficiency solar cell absorber. Samples were prepared via sequential thermal vacuum deposition of Cu and In or In and Cu (at 10 -5 mbar) on glass substrates heated at 150 deg. C. After what, the obtained binary systems (Cu/In or In/Cu) were annealed in air at 400 deg. C for 3h. These films were characterized for their structural, electrical and optical properties by using X-ray diffraction (XRD), electrical resistivity and optical (transmittance and reflectance) measurement techniques. The X-ray diffraction (XRD) patterns revealed the presence of CuO and In 2 O 3 phases. The absorption coefficient of Cu-In-O thin films (4.10 5 cm -1 ) is larger than 10 5 cm -1 for the In/Cu case and in the range of 10 4 -10 5 cm -1 for the Cu/In case in the visible spectral range. Direct optical band gaps of 1.40 and 1.52eV were found for the In/Cu and Cu/In cases, respectively. The complex dielectric constants of the Cu-In-O films have been calculated. It was found that the refractive index dispersion data obeyed the Wemple-Di Domenico single oscillator model, from which the dispersion parameters and the high-frequency dielectric constant were determined. The electric free carrier susceptibility and the ratio of the carrier concentration to the effective mass were estimated according to the model of Spitzer and Fan. The electrical measurements show a conversion from a metallic phase to the semiconductor phase by a switching in the electrical resistivity values at an annealing temperature of 275 deg. C. In both cases the samples were highly compensated

  12. Coupled growth of Al-Al2Cu eutectics in Al-Cu-Ag alloys

    International Nuclear Information System (INIS)

    Hecht, U; Witusiewicz, V; Drevermann, A

    2012-01-01

    Coupled eutectic growth of Al and Al 2 Cu was investigated in univariant Al-Cu-Ag alloys during solidification with planar and cellular morphology. Experiments reveal the dynamic selection of small spacings, below the minimum undercooling spacing and show that distinct morphological features pertain to nearly isotropic or anisotropic Al-Al 2 Cu interfaces.

  13. Bioaccumulation, toxicokinetics, and effects of copper from sediment spiked with aqueous Cu, nano-CuO, or micro-CuO in the deposit-feeding snail, Potamopyrgus antipodarum

    DEFF Research Database (Denmark)

    Pang, Chengfang; Selck, Henriette; Banta, Gary Thomas

    2013-01-01

    The present study examined the relative importance of copper (aqueous Cu and CuO particles of different sizes) added to sediment to determine the bioaccumulation, toxicokinetics, and effects in the deposit feeder Potamopyrgus antipodarum. In experiment 1, the bioaccumulation of Cu (240 mg Cu/g dr...

  14. Local atomic structure of Zr-Cu and Zr-Cu-Al amorphous alloys investigated by EXAFS method

    International Nuclear Information System (INIS)

    Antonowicz, J.; Pietnoczka, A.; Zalewski, W.; Bacewicz, R.; Stoica, M.; Georgarakis, K.; Yavari, A.R.

    2011-01-01

    Research highlights: → Coordination number, interatomic distances and mean square atomic displacement in Zr-Cu and Zr-Cu-Al glasses. → Icosahedral symmetry in local atomic structure. → Deviation from random mixing behavior resulting from Al addition. - Abstract: We report on extended X-ray absorption fine structure (EXAFS) study of rapidly quenched Zr-Cu and Zr-Cu-Al glassy alloys. The local atomic order around Zr and Cu atoms was investigated. From the EXAFS data fitting the values of coordination number, interatomic distances and mean square atomic displacement were obtained for wide range of compositions. It was found that icosahedral symmetry rather than that of corresponding crystalline analogs dominates in the local atomic structure of Zr-Cu and Zr-Cu-Al amorphous alloys. Judging from bonding preferences we conclude that addition of Al as an alloying element results in considerable deviation from random mixing behavior observed in binary Zr-Cu alloys.

  15. Resistance to high level of Cu (Copper) by arbuscular mycorrhizal, saprobe Fungi and Eucalyptus globules

    International Nuclear Information System (INIS)

    Arriagada, C.; Pereira, G.; Machuca, A.; Alvear, M.; Martin, J.; Ocampo, J.

    2009-01-01

    The effects of saprobe and arbuscular mycorrhizal (AM) fungi on growth, chorophyll, root length colonization and succinate dehydrogenase (SDH) activity was measured in Eucalyptus globulus Labill., plants growing in soil with high level of Cu were investigated. The application of Cu inhibited the development of mycelia of the saprobe fungi Fusarium concolor and Trichoderma koningii and the hyphal length of the arbuscular mycorrhizal fungi (AM) Glomus mosseae and G. deserticola in vitro. (Author)

  16. Resistance to high level of Cu (Copper) by arbuscular mycorrhizal, saprobe Fungi and Eucalyptus globules

    Energy Technology Data Exchange (ETDEWEB)

    Arriagada, C.; Pereira, G.; Machuca, A.; Alvear, M.; Martin, J.; Ocampo, J.

    2009-07-01

    The effects of saprobe and arbuscular mycorrhizal (AM) fungi on growth, chorophyll, root length colonization and succinate dehydrogenase (SDH) activity was measured in Eucalyptus globulus Labill., plants growing in soil with high level of Cu were investigated. The application of Cu inhibited the development of mycelia of the saprobe fungi Fusarium concolor and Trichoderma koningii and the hyphal length of the arbuscular mycorrhizal fungi (AM) Glomus mosseaae and G. deserticola in vitro. (Author)

  17. Cu-Cr Literature Review

    Energy Technology Data Exchange (ETDEWEB)

    Need, Ryan F. [Los Alamos National Laboratory

    2012-08-09

    Cu-Cr alloys are part of a class of face-centered cubic (FCC)-body-centered cubic (BCC) composites that includes similar alloys, such as Cu-Nb and Cu-Ta. When heavily deformed, these FCC-BCC materials create 'in situ' composites with a characteristic structure-nanoscale BCC filaments in a ductile FCC matrix. The strength of these composites is vastly greater than predicted by the rule of mixtures, and has been shown to be inversely proportional to the filament spacing. Lower raw materials costs suggest that Cu-Cr alloys may offer more economical solution to high-strength, high-conductivity wire than either their Nb or Ta counterparts. However, Cr is also more brittle and soluble in Cu than Nb or Ta. These qualities necessitate thermal treatments to remove solute atoms from the Cu matrix, improve conductivity, and maintain the ductility of the Cr filaments. Through the use of different thermomechanical processing routes or the addition of select dopants, alloys with strength in excess of 1 GPa at 70% IACS have been achieved. To date, previous research on Cu-Cr alloys has focused on a relatively small number of alloy compositions and processing methods while the effects of dopants and ageing treatments have only been studied independently. Consequently, there remains considerable opportunity for the development and optimization of these alloys as a leading high-strength, high-conductivity material.

  18. Spatial part-set cuing facilitation.

    Science.gov (United States)

    Kelley, Matthew R; Parasiuk, Yuri; Salgado-Benz, Jennifer; Crocco, Megan

    2016-07-01

    Cole, Reysen, and Kelley [2013. Part-set cuing facilitation for spatial information. Journal of Experimental Psychology: Learning, Memory, & Cognition, 39, 1615-1620] reported robust part-set cuing facilitation for spatial information using snap circuits (a colour-coded electronics kit designed for children to create rudimentary circuit boards). In contrast, Drinkwater, Dagnall, and Parker [2006. Effects of part-set cuing on experienced and novice chess players' reconstruction of a typical chess midgame position. Perceptual and Motor Skills, 102(3), 645-653] and Watkins, Schwartz, and Lane [1984. Does part-set cuing test for memory organization? Evidence from reconstructions of chess positions. Canadian Journal of Psychology/Revue Canadienne de Psychologie, 38(3), 498-503] showed no influence of part-set cuing for spatial information when using chess boards. One key difference between the two procedures was that the snap circuit stimuli were explicitly connected to one another, whereas chess pieces were not. Two experiments examined the effects of connection type (connected vs. unconnected) and cue type (cued vs. uncued) on memory for spatial information. Using chess boards (Experiment 1) and snap circuits (Experiment 2), part-set cuing facilitation only occurred when the stimuli were explicitly connected; there was no influence of cuing with unconnected stimuli. These results are potentially consistent with the retrieval strategy disruption hypothesis, as well as the two- and three-mechanism accounts of part-set cuing.

  19. Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

    Directory of Open Access Journals (Sweden)

    Youqing Sun

    2018-05-01

    Full Text Available Dissimilar CuNiCrSi and CuCrZr butt joints were successfully frictionstirwelded at constant welding speed of 150 mm/min and rotational speed of 1400 rpm with the CuCrZr alloy or the CuNiCrSi alloy located on the advancing side (AS. The microstructure and mechanical properties of joints were investigated. When the CuCrZr alloy was located on the AS, the area of retreating material in the nugget zone was a little bigger. The Cr solute-rich particles were found in the nugget zone on CuCrZr side (CuCrZr-NZ while a larger density of solute-rich particles identified as the concentration of Cr and Si element was found in the nugget zone on CuNiCrSi side (CuNiCrSi-NZ. The Cr precipitates and δ-Ni2Si precipitates were found in the base metal on CuNiCrSi side (CuNiCrSi-BM but only Cr precipitates can be observed in the base metal on CuCrZr side (CuCrZr-BM. Precipitates were totally dissolved into Cu matrix in both CuCrZr-NZ and CuNiCrSi-NZ, which led to a sharp decrease in both micro-hardness and tensile strength from BM to NZ. When the CuNiCrSi was located on the AS, the tensile testing results showed the fracture occurred at the CuCrZr-NZ, while the fracture was found at the mixed zone of CuNiCrSi-NZ and CuCrZr-NZ for the other case.

  20. Toward Rational Design of Cu/SSZ-13 Selective Catalytic Reduction Catalysts: Implications from Atomic-Level Understanding of Hydrothermal Stability

    Energy Technology Data Exchange (ETDEWEB)

    Song, James [Institute; The; amp, Linda Voiland School of Chemical Engineering and Bioengineering, Washington State University, P.O. Box 646515, Pullman, Washington 99164, United States; Wang, Yilin [Institute; Walter, Eric D. [Environmental; Washton, Nancy M. [Environmental; Mei, Donghai [Institute; Kovarik, Libor [Environmental; Engelhard, Mark H. [Environmental; Prodinger, Sebastian [Institute; Wang, Yong [Institute; The; amp, Linda Voiland School of Chemical Engineering and Bioengineering, Washington State University, P.O. Box 646515, Pullman, Washington 99164, United States; Peden, Charles H. F. [Institute; Gao, Feng [Institute

    2017-11-03

    The hydrothermal stability of Cu/SSZ-13 SCR catalysts has been extensively studied, yet atomic level understanding of changes to the zeolite support and the Cu active sites during hydrothermal aging are still lacking. In this work, via the utilization of spectroscopic methods including solid-state 27Al and 29Si NMR, EPR, DRIFTS, and XPS, together with imaging and elemental mapping using STEM, detailed kinetic analyses, and theoretical calculations with DFT, various Cu species, including two types of isolated active sites and CuOx clusters, were precisely quantified for samples hydrothermally aged under varying conditions. This quantification convincingly confirms the exceptional hydrothermal stability of isolated Cu2+-2Z sites, and the gradual conversion of [Cu(OH)]+-Z to CuOx clusters with increasing aging severity. This stability difference is rationalized from the hydrolysis activation barrier difference between the two isolated sites via DFT. Discussions are provided on the nature of the CuOx clusters, and their possible detrimental roles on catalyst stability. Finally, a few rational design principles for Cu/SSZ-13 are derived rigorously from the atomic-level understanding of this catalyst obtained here. The authors gratefully acknowledge the US Department of Energy (DOE), Energy Efficiency and Renewable Energy, Vehicle Technologies Office for the support of this work. Computing time was granted by a user proposal at the William R. Wiley Environmental Molecular Sciences Laboratory (EMSL) and by the National Energy Research Scientific Computing Center (NERSC). The experimental studies described in this paper were performed in the EMSL, a national scientific user facility sponsored by the DOE’s Office of Biological and Environmental Research and located at Pacific Northwest National Laboratory (PNNL). PNNL is operated for the US DOE by Battelle.

  1. Identification of levels above 6{sup -} isomeric state in {sup 66}Cu

    Energy Technology Data Exchange (ETDEWEB)

    Singh, Purnima; Palit, R.; Biswas, S.; Saha, S. [Tata Institute of Fundamental Research, Department of Nuclear and Atomic Physics, Mumbai (India); Choudhury, D. [Horia Hulubei National Institute for Physics and Nuclear Engineering, ELI-NP, Magurele (Romania); Srivastava, P.C. [Indian Institute of Technology Roorkee, Department of Physics, Roorkee (India); Sethi, J. [Tata Institute of Fundamental Research, Department of Nuclear and Atomic Physics, Mumbai (India); University of Maryland, Department of Chemistry and Biochemistry, College Park, MD (United States)

    2017-04-15

    Excited states in odd-odd {sup 66}Cu were investigated in a reaction between a 136 MeV {sup 30}Si beam and a {sup 65}Cu target with the Indian National Gamma Array. Six new transitions have been identified including four transitions feeding the 600 ns 6{sup -} isomeric state from an investigation of prompt-prompt and prompt-delayed coincidence events. The results of the present work have extended the level structure of this nucleus up to I{sup π} = (9{sup -}). In addition, new information on the set of πp{sub 3/2}νg{sub 9/2} multiplets in this nucleus have been added. Shell model calculations were performed within the fpg{sub 9/2} and f{sub 5/2}pg{sub 9/2} model spaces. The results of shell model calculations using the fpg{sub 9/2} model space have been observed to be in better agreement with experimental excitation energies up to the highest spin observed. The results of the present work highlight the necessity of f{sub 7/2} proton holes to describe the positive as well as negative parity states in {sup 66}Cu. (orig.)

  2. Cu ion disordering in high ionic conductor Rb4Cu16I7Cl13

    International Nuclear Information System (INIS)

    Kawaji, Hitoshi; Atake, Tooru; Kanno, Ryoji; Izumi, Fujio; Yamamoto, Osamu.

    1993-01-01

    The properties of a high ionic conductor Rb 4 Cu 16 I 7+x Cl 13-x were studied by neutron and X-ray diffraction, and heat capacity measurements. The structure parameters of Rb 4 Cu 16 I 7.2 Cl 12.8 were obtained by the Rietveld analysis of TOF neutron diffraction data between 50 and 300 K, which showed gradual excitation of migration of Cu ions from Cu(3) site into Cu(2) site with increasing temperature from about 100 K to room temperature. The heat capacity was measured between 10 and 300 K using a high precision adiabatic calorimeter. An abnormal increase was observed in the heat capacity curve above about 100 K. The excess heat capacity showed a broad anomaly with a maximum at about 190 K. The measurements were also made of Rb 4 Cu 16 I 7 Cl 13 which showed slight different properties from Rb 4 Cu 16 I 7.2 Cl 12.8 . (author)

  3. Cu k-edge studies of the charge carries in Th-doped cuprate system R2-xThxCuO4-δ (R = Nd, Sm and Gd)

    International Nuclear Information System (INIS)

    Liang, G.; Yi, Y.; Jardim, R.F.; Wang, L.V.

    1999-01-01

    To further study the charge carrier concentration in electron doped cuprate superconductors, a systematic x-ray absorption near edge structure (XANES) measurement has been carried out on Th-doped superconductor system R 2-x Th x CuO 4-δ (R = Nd, Sm, and Gd). The XANES results show that, similar to the Ce-doped compounds, while the intensity of the Cu 1+ 4p π feature increase with the increase of the Th doping level x, the intensities of the Cu 2+ 4p π and 4p σ features decreases. This clearly indicates that the electrons doped by the Th atoms are injected into the local Cu 3d-orbitals. The normalized Cu 1+ 4p π intensity data show that the Cu 1+ concentration in the Th-doped compound series with different R-elements is linearly proportional to the Th doping-level x. The data suggest that both Ce and Th donate the same fraction of electrons into the Cu sites

  4. Physics of bandgap formation in Cu-Sb-Se based novel thermoelectrics: the role of Sb valency and Cu d levels.

    Science.gov (United States)

    Do, Dat; Ozolins, Vidvuds; Mahanti, S D; Lee, Mal-Soon; Zhang, Yongsheng; Wolverton, C

    2012-10-17

    In this paper we discuss the results of ab initio electronic structure calculations for Cu(3)SbSe(4) (Se4) and Cu(3)SbSe(3) (Se3), two narrow bandgap semiconductors of thermoelectric interest. We find that Sb is trivalent in both the compounds, in contrast to a simple nominal valence (ionic) picture which suggests that Sb should be 5 + in Se4. The gap formation in Se4 is quite subtle, with hybridization between Sb 5s and the neighboring Se 4s, 4p orbitals, position of Cu d states, and non-local exchange interaction, each playing significant roles. Thermopower calculations show that Se4 is a better p-type system. Our theoretical results for Se4 agree very well with recent experimental results obtained by Skoug et al (2011 Sci. Adv. Mater. 3 602).

  5. Bonding in [CuNRR′]4 type clusters

    Institute of Scientific and Technical Information of China (English)

    WANG Bingwu; XU Guangxian; CHEN Zhida

    2004-01-01

    Many polynuclear Cu(I) compounds have been synthesized, but the problem whether there is direct or no direct Cu-Cu bonding in these compounds is not clear. The electronic structure of [CuNRR′]4 type clusters was investigated by using density functional methods. The results of geometrical optimization are in good agreement with experiment, and the localization of MO's shows that there are four Cu-Cu ( bonds to form the square Cu4 ring in addition to the four bridging Cu-N-Cu bonds. A concept of the covalence of molecular fragments is proposed to describe the bonding in these clusters.

  6. Valence-band and core-level photoemission study of single-crystal Bi2CaSr2Cu2O8 superconductors

    International Nuclear Information System (INIS)

    Shen, Z.; Lindberg, P.A.P.; Wells, B.O.; Mitzi, D.B.; Lindau, I.; Spicer, W.E.; Kapitulnik, A.

    1988-01-01

    High-quality single crystals of Bi 2 CaSr 2 Cu 2 O 8 superconductors have been prepared and cleaved in ultrahigh vacuum. Low-energy electron diffraction measurements show that the surface structure is consistent with the bulk crystal structure. Ultraviolet photoemission and x-ray photoemission experiments were performed on these well-characterized sample surfaces. The valence-band and the core-level spectra obtained from the single-crystal surfaces are in agreement with spectra recorded from polycrystalline samples, justifying earlier results from polycrystalline samples. Cu satellites are observed both in the valence band and Cu 2p core level, signaling the strong correlation among the Cu 3d electrons. The O 1s core-level data exhibit a sharp, single peak at 529-eV binding energy without any clear satellite structures

  7. Electroluminescent Cu-doped CdS quantum dots

    NARCIS (Netherlands)

    Stouwdam, J.W.; Janssen, R.A.J.

    2009-01-01

    Incorporating Cu-doped CdS quantum dots into a polymer host produces efficient light-emitting diodes. The Cu dopant creates a trap level that aligns with the valence band of the host, enabling the direct injection of holes into the quantum dots, which act as emitters. At low current densities, the

  8. Virtual thermal expansion coefficient of Cu precipitated in the Fe95Cu5 alloy

    International Nuclear Information System (INIS)

    Koeszegi, L.; Somogyvari, Z.

    1999-01-01

    Complete text of publication follows. Precipitations on grain boundaries play very important role in the formation of material's characteristics like embrittlement, durability etc. It was already shown [1] that Cu precipitations are under different stress conditions than the bulk material. The situation is more complicated in the case when a construction is exposed to temperature changes as well. In that case not only the residual stresses during the fabrication but the different thermal expansion coefficients can produce additional problems. This situation was modelled using Fe 95 Cu 5 alloy where Cu precipitates on the grain boundaries. The alloy was produced by high-frequency melting and an extra heat treatment was used to produce a quasi-equilibrium state. Pure Cu was also measured to compare the behaviours. Cu(111) Bragg peak was measured at different temperatures by high resolution neutron diffraction. The measurements were carried out on the G5-2 spectrometer at LLB in Saclay. Measurements show that not only residual stress can be recognised on the Cu precipitates but the thermal expansion coefficient of these precipitates definitly differ from the ones of pure Cu. (author)

  9. Loss of reserves of Cu in liver when Cu supplements are withdrawn from dairy herds in the Waikato region.

    Science.gov (United States)

    Hittmann, A R; Grace, N D; Knowles, S O

    2012-03-01

    To monitor the consequences of withdrawing mineral Cu supplements from two dairy herds with initially high concentrations of Cu in liver. Two herds were selected from dairy farms in the Waikato region of New Zealand that participated in an earlier survey of Cu supplementation practices and Cu status of dairy cows. The herds were fed pasture, grass and maize silage, plus palm kernel expeller (PKE) containing 25-30 mg Cu/kg dry matter (DM) fed at 2-4 kg/cow/day. No mineral Cu supplements were supplied from January 2009. Pasture samples were collected for mineral analysis in September 2008 and April 2009. Concentration of Cu in liver biopsies from the same 9-10 cows per herd was measured on three occasions between April 2009 and May 2010. Pastures on both farms contained 10 mg Cu/kg DM, 0.1-0.5 mg Mo/kg DM and 3.5-4.0 g S/kg DM. The initial herd mean concentrations of Cu in liver were 1,500 (SD 590) and 1,250 (SD 640) μmol Cu/kg fresh tissue. In the absence of mineral Cu supplements, those mean concentrations decreased over 12 months to 705 (SD 370) and 1,120 (SD 560) μmol Cu/kg fresh tissue, respectively. For cows in the first herd, the rate of depletion of liver Cu reserves was influenced by initial concentration of Cu, such that high concentration led to faster loss according to first-order kinetics. Mineral Cu supplementation was not necessary over 12 months for two dairy herds with mean concentrations of Cu in liver >1,250 μmol Cu/kg fresh tissue, grazing pastures containing 10 mg Cu/kg DM and concentrations of Mo <1 mg/kg DM. The quantity and particularly the duration of feeding PKE appeared to be a factor in whether or not the herd lost substantial reserves of Cu in liver during the year. However, the Cu status of both herds in this study was more than adequate to support late pregnancy and mating. CLINICAL REVELANCE: Copper status of the herd should be monitored and on-farm management of Cu nutrition should take into account all sources contributing to

  10. Thermodynamic optimization of the Cu-Nd system

    International Nuclear Information System (INIS)

    Wang Peisheng; Zhou Liangcai; Du Yong; Xu Honghui; Liu Shuhong; Chen Li; Ouyang Yifang

    2011-01-01

    Research highlights: → The enthalpies of formation of the compounds Cu 6 Nd, Cu 5 Nd, Cu 2 Nd and αCuNd were calculated using DFT. → The thermodynamic constraints to eliminate the artificial phase relations were imposed during the thermodynamic optimization procedure. → The Cu-Nd system was optimized under the thermodynamic constraints. - Abstract: The thermodynamic constraints to eliminate artificial phase relations were introduced with the Cu-Nd system as an example. The enthalpies of formation of the compounds Cu 6 Nd, Cu 5 Nd, Cu 2 Nd and αCuNd are calculated using density functional theory. Taking into account all the experimental data and the first-principles calculated enthalpies of formation of these compounds, the thermodynamic optimization of the Cu-Nd system was performed under the proposed thermodynamic constraints. It is demonstrated that the thermodynamic constraints are critical to obtain a set of thermodynamic parameters for the Cu-Nd system, which can avoid the appearance of all the artificial phase relations.

  11. Cu-segregation at the Q'/α-Al interface in Al-Mg-Si-Cu alloy

    International Nuclear Information System (INIS)

    Matsuda, Kenji; Teguri, Daisuke; Uetani, Yasuhiro; Sato, Tatsuo; Ikeno, Susumu

    2002-01-01

    Cu segregation was detected at the Q ' /α-Al interface in an Al-Mg-Si-Cu alloy by energy-filtered transmission electron microscopy. By contrast, in a Cu-free Al-Mg-Si alloy no segregation was observed at the interface between the matrix and Type-C precipitate

  12. Cu and Cu(Mn) films deposited layer-by-layer via surface-limited redox replacement and underpotential deposition

    Energy Technology Data Exchange (ETDEWEB)

    Fang, J.S., E-mail: jsfang@nfu.edu.tw [Department of Materials Science and Engineering, National Formosa University, Huwei 63201, Taiwan (China); Sun, S.L. [Department of Materials Science and Engineering, National Formosa University, Huwei 63201, Taiwan (China); Cheng, Y.L. [Department of Electrical Engineering, National Chi-Nan University, Nan-Tou 54561, Taiwan (China); Chen, G.S.; Chin, T.S. [Department of Materials Science and Engineering, Feng Chia University, Taichung 40724, Taiwan (China)

    2016-02-28

    Graphical abstract: - Abstract: The present paper reports Cu and Cu(Mn) films prepared layer-by-layer using an electrochemical atomic layer deposition (ECALD) method. The structure and properties of the films were investigated to elucidate their suitability as Cu interconnects for microelectronics. Previous studies have used primarily a vacuum-based atomic layer deposition to form a Cu metallized film. Herein, an entirely wet chemical process was used to fabricate a Cu film using the ECALD process by combining underpotential deposition (UPD) and surface-limited redox replacement (SLRR). The experimental results indicated that an inadequate UPD of Pb affected the subsequent SLRR of Cu and lead to the formation of PbSO{sub 4}. A mechanism is proposed to explain the results. Layer-by-layer deposition of Cu(Mn) films was successfully performed by alternating the deposition cycle-ratios of SLRR-Cu and UPD-Mn. The proposed self-limiting growth method offers a layer-by-layer wet chemistry-based deposition capability for fabricating Cu interconnects.

  13. Reaction pathways of furfural, furfuryl alcohol and 2-methylfuran on Cu(111) and NiCu bimetallic surfaces

    Science.gov (United States)

    Xiong, Ke; Wan, Weiming; Chen, Jingguang G.

    2016-10-01

    Hydrodeoxygenation (HDO) is an important reaction for converting biomass-derived furfural to value-added 2-methylfuran, which is a promising fuel additive. In this work, the HDO of furfural to produce 2-methylfuran occurred on the NiCu bimetallic surfaces prepared on either Ni(111) or Cu(111). The reaction pathways of furfural were investigated on Cu(111) and Ni/Cu(111) surfaces using density functional theory (DFT) calculations, temperature-programmed desorption (TPD) and high-resolution electron energy loss spectroscopy (HREELS) experiments. These studies provided mechanistic insights into the effects of bimetallic formation on enhancing the HDO activity. Specifically, furfural weakly adsorbed on Cu(111), while it strongly adsorbed on Ni/Cu(111) through an η2(C,O) configuration, which led to the HDO of furfural on Ni/Cu(111). The ability to dissociate H2 on Ni/Cu(111) is also an important factor for enhancing the HDO activity over Cu(111).

  14. Substrate type < 111 >-Cu{sub 2}O/<0001 >-ZnO photovoltaic device prepared by photo-assisted electrodeposition

    Energy Technology Data Exchange (ETDEWEB)

    Zamzuri, Mohd, E-mail: zamzuri@tf.me.tut.ac.jp [Department of Mechanical Eng., Toyohashi University of Technology, 1-1 Hibari Gaoka, Tempaku, Toyohashi, Aichi 441-8580 (Japan); School of Manufacturing Eng., Universiti Malaysia Perlis, Kampus Tetap Pauh Putra, Jln Arau-Changlun, 02600 Arau, Perlis (Malaysia); Sasano, Junji [Department of Mechanical Eng., Toyohashi University of Technology, 1-1 Hibari Gaoka, Tempaku, Toyohashi, Aichi 441-8580 (Japan); Mohamad, Fariza Binti [Faculty of Electrical & Electronic Eng., University Tun Hussein Onn Malaysia, 86400, Parit Raja, Batu Pahat, Johor (Malaysia); Izaki, Masanobu [Department of Mechanical Eng., Toyohashi University of Technology, 1-1 Hibari Gaoka, Tempaku, Toyohashi, Aichi 441-8580 (Japan)

    2015-11-30

    The substrate-type < 0001 > ZnO/<111 > Cu{sub 2}O photovoltaic (PV) device has been constructed by electrodeposition of a < 111 >-p-Cu{sub 2}O layer on an Au(111)/Si wafer substrate followed by stacking the n-ZnO layer by electrodeposition during light irradiation in aqueous solutions. The PV device was fabricated by stacking the Al:ZnO-window by sputtering and the top Al electrode by vacuum evaporation. The < 0001 >-ZnO layer was composed of aggregates of hexagonal columnar grains grown in the direction normal to the surface, and pores could be observed between the ZnO grains at the deposition time last 1800 s. The < 0001 >-ZnO/<111 >-Cu{sub 2}O PV device showed a photovoltaic performance under AM1.5 illumination, and showed the improved short-circuit current density of 5.87 mA cm{sup −2} by stacking the AZO-TCO due to the increase in the diffusion length of the carrier. - Highlights: • Substrate type ZnO/Cu{sub 2}O photovoltaic devices only by electrodeposition • ZnO layer was stacked on the Cu{sub 2}O layer by photo-assisted electrodeposition. • AZO/ZnO/Cu{sub 2}O photovoltaic devices with a short-circuit current density of 5.87 mA cm{sup −2}.

  15. Photocatalytic property and structural stability of CuAl-based layered double hydroxides

    International Nuclear Information System (INIS)

    Lv, Ming; Liu, Haiqiang

    2015-01-01

    Three types of CuMAl layered double hydroxides (LDHs, M=Mg, Zn, Ni) were successfully synthesized by coprecipitation. Powder X-ray diffraction (XRD), inductively coupled plasma atomic emission spectrometry (ICP-AES) and UV–Vis diffuse reflectance spectrum (UV–vis) were used to confirm the formation of as-synthesized solids with good crystal structure. The photocatalytic activity of those LDH materials for CO 2 reduction under visible light was investigated. The experimental results show that CuNiAl-LDHs with narrowest band gap and largest surface areas behave highest efficiency for methanol generation under visible light compared with CuMgAl-LDHs and CuZnAl-LDHs. The CuNiAL-LDH showed high yield for methanol production i.e. 0.210 mmol/g h, which was high efficient. In addition, the influence of the different M 2+ on the structures and stability of the CuMAl-LDHs was also investigated by analyzing the geometric parameters, electronic arrangement, charge populations, hydrogen-bonding, and binding energies by density functional theory (DFT) analysis. The theoretical calculation results show that the chemical stability of LDH materials followed the order of CuMgAl-LDHs>CuZnAl-LDHs>CuNiAl-LDHs, which is just opposite with the photocatalytic activity and band gaps of three materials. - Graphical abstract: The host–guest calculation models and XRD patterns of CuMAl-LDHs: CuMgAl-LDHs (a), CuZnAl-LDHs (b) and CuNiAl-LDHs (c). - Highlights: • Three types of CuMAl layered double hydroxides (LDHs, M=Mg, Zn, Ni) has been synthesized. • CuMgNi shows narrower band gap and more excellent textural properties than other LDHs. • The band gap: CuMgAlNiAl based on result from UV–vis analysis. • CuMgAl shows the highest stability and lowest photocatalytic activity, while CuNiAl just opposite

  16. Modeling of direct wafer bonding: Effect of wafer bow and etch patterns

    Science.gov (United States)

    Turner, K. T.; Spearing, S. M.

    2002-12-01

    Direct wafer bonding is an important technology for the manufacture of silicon-on-insulator substrates and microelectromechanical systems. As devices become more complex and require the bonding of multiple patterned wafers, there is a need to understand the mechanics of the bonding process. A general bonding criterion based on the competition between the strain energy accumulated in the wafers and the surface energy that is dissipated as the bond front advances is developed. The bonding criterion is used to examine the case of bonding bowed wafers. An analytical expression for the strain energy accumulation rate, which is the quantity that controls bonding, and the final curvature of a bonded stack is developed. It is demonstrated that the thickness of the wafers plays a large role and bonding success is independent of wafer diameter. The analytical results are verified through a finite element model and a general method for implementing the bonding criterion numerically is presented. The bonding criterion developed permits the effect of etched features to be assessed. Shallow etched patterns are shown to make bonding more difficult, while it is demonstrated that deep etched features can facilitate bonding. Model results and their process design implications are discussed in detail.

  17. Cu-Si bilayers as storage medium in optical recording

    International Nuclear Information System (INIS)

    Kuiper, A.E. T.; Vullers, R.J.M.; Pasquariello, D.; Naburgh, E.P.

    2005-01-01

    Instead of a phase change or a dye layer, a Cu/Si bilayer can be applied as the recording medium in a write-once Blu-ray Disc. The write process basically comprises the formation of a CuSi alloy containing 25-30 at. % Si, while any excess of Si is left behind as unreacted film. Auger analyses of the laser-written layers indicate that recording consists primarily of the diffusion of Si into Cu. The data allow for discrimination between the various models presented in literature for Cu/Si-based recording and to optimize the stack. Very low jitter levels of typically 4% proved to be achievable with equally thick films of Cu and Si as recording medium

  18. Sulfur induced Cu4 tetramers on Cu(111)

    DEFF Research Database (Denmark)

    Foss, M.; Feidenhans'l, R.; Nielsen, M.

    1997-01-01

    The structures of the Cu(111) and the Cu(111)(root 7 x root 7)R19.1 degrees-S reconstructions have been studied by surface X-ray diffraction and two new structural models are proposed. Although the unit cells for the two structures are quite different, a high degree of similarity has been reveale...

  19. Diffusion characteristics in the Cu-Ti system

    Energy Technology Data Exchange (ETDEWEB)

    Laik, Arijit; Kale, Gajanan Balaji [Bhabha Atomic Reseach Centre, Mumbai (India). Materials Science Div.; Bhanumurthy, Karanam [Bhabha Atomic Reseach Centre, Mumbai (India). Scientific Information Resource Div.; Kashyap, Bhagwati Prasad [Indian Institute of Technology Bombay, Mumbai (India). Dept. of Metallurgical Engineering

    2012-06-15

    The formation and growth of intermetallic compounds by diffusion reaction of Cu and Ti were investigated in the temperature range 720 - 860 C using bulk diffusion couples. Only four, out of the seven stable intermediate compounds of the Cu-Ti system, were formed in the diffusion reaction zone in the sequence CuTi, Cu{sub 4}Ti, Cu{sub 4}Ti{sub 3} and CuTi{sub 2}. The activation energies required for the growth of these compounds were determined. The diffusion characteristics of Cu{sub 4}Ti, CuTi and Cu{sub 4}Ti{sub 3} and Cu(Ti) solid solution were evaluated. The activation energies for diffusion in these compounds were 192.2, 187.7 and 209.2 kJ mol{sup -1} respectively, while in Cu(Ti), the activation energy increased linearly from 201.0 kJ mol{sup -1} to 247.5 kJ mol{sup -1} with increasing concentration of Ti, in the range 0.5 - 4.0 at.%. The impurity diffusion coefficient of Ti in Cu and its temperature dependence were also estimated. A correlation between the impurity diffusion parameters for several elements in Cu matrix has been established. (orig.)

  20. Wafer-Level Patterned and Aligned Polymer Nanowire/Micro- and Nanotube Arrays on any Substrate

    KAUST Repository

    Morber, Jenny Ruth

    2009-05-25

    A study was conducted to fabricate wafer-level patterned and aligned polymer nanowire (PNW), micro- and nanotube arrays (PNT), which were created by exposing the polymer material to plasma etching. The approach for producing wafer-level aligned PNWs involved a one-step inductively coupled plasma (ICP) reactive ion etching process. The polymer nanowire array was fabricated in an ICP reactive ion milling chamber with a pressure of 10mTorr. Argon (Ar), O 2, and CF4 gases were released into the chamber as etchants at flow rates of 15 sccm, 10 sccm, and 40 sccm. Inert gasses, such as Ar-form positive ions were incorporated to serve as a physical component to assist in the material degradation process. One power source (400 W) was used to generate dense plasma from the input gases, while another power source applied a voltage of approximately 600V to accelerate the plasma toward the substrate.

  1. Synthesis of Cu-coated Graphite Powders Using a Chemical Reaction Process

    Energy Technology Data Exchange (ETDEWEB)

    Jang, Jun-Ho; Park, Hyun-Kuk; Oh, Ik-Hyun [Korea Institute of Industrial Technology (KITECH), Gwangju (Korea, Republic of); Lim, Jae-Won [Chonbuk National University, Jeonju (Korea, Republic of)

    2017-05-15

    In this paper, Cu-coated graphite powders for a low thermal expansion coefficient and a high thermal conductivity are fabricated using a chemical reaction process. The Cu particles adhere to the irregular graphite powders and they homogeneously disperse in the graphite matrix. Cu-coated graphite powders are coarser at approximately 3-4 μm than the initial graphite powders; furthermore, their XRD patterns exhibit a low intensity in the oxide peak with low Zn powder content. For the passivation powders, the transposition solvent content has low values, and the XRD pattern of the oxide peaks is almost non-existent, but the high transposition solvent content does not exhibit a difference to the non-passivation treated powders.

  2. Syntheses, structures, and properties of imidazolate-bridged Cu(II)-Cu(II) and Cu(II)-Zn(II) dinuclear complexes of a single macrocyclic ligand with two hydroxyethyl pendants.

    Science.gov (United States)

    Li, Dongfeng; Li, Shuan; Yang, Dexi; Yu, Jiuhong; Huang, Jin; Li, Yizhi; Tang, Wenxia

    2003-09-22

    The imidazolate-bridged homodinuclear Cu(II)-Cu(II) complex, [(CuimCu)L]ClO(4).0.5H(2)O (1), and heterodinuclear Cu(II)-Zn(II) complex, [(CuimZnL(-)(2H))(CuimZnL(-)(H))](ClO(4))(3) (2), of a single macrocyclic ligand with two hydroxyethyl pendants, L (L = 3,6,9,16,19,22-hexaaza-6,19-bis(2-hydroxyethyl)tricyclo[22,2,2,2(11,14)]triaconta-1,11,13,24,27,29-hexaene), have been synthesized as possible models for copper-zinc superoxide dismutase (Cu(2),Zn(2)-SOD). Their crystal structures analyzed by X-ray diffraction methods have shown that the structures of the two complexes are markedly different. Complex 1 crystallizes in the orthorhombic system, containing an imidazolate-bridged dicopper(II) [Cu-im-Cu](3+) core, in which the two copper(II) ions are pentacoordinated by virtue of an N4O environment with a Cu.Cu distance of 5.999(2) A, adopting the geometry of distorted trigonal bipyramid and tetragonal pyramid, respectively. Complex 2 crystallizes in the triclinic system, containing two similar Cu-im-Zn cores in the asymmetric unit, in which both the Cu(II) and Zn(II) ions are pentacoordinated in a distorted trigonal bipyramid geometry, with the Cu.Zn distance of 5.950(1)/5.939(1) A, respectively. Interestingly, the macrocyclic ligand with two arms possesses a chairlike (anti) conformation in complex 1, but a boatlike (syn) conformation in complex 2. Magnetic measurements and ESR spectroscopy of complex 1 have revealed the presence of an antiferromagnetic exchange interaction between the two Cu(II) ions. The ESR spectrum of the Cu(II)-Zn(II) heterodinuclear complex 2 displayed a typical signal for mononuclear trigonal bipyramidal Cu(II) complexes. From pH-dependent ESR and electronic spectroscopic studies, the imidazolate bridges in the two complexes have been found to be stable over broad pH ranges. The cyclic voltammograms of the two complexes have been investigated. Both of the two complexes can catalyze the dismutation of superoxide and show rather high activity.

  3. ZrCu2P2 and HfCu2P2 phosphides and their crystal structure

    International Nuclear Information System (INIS)

    Lomnitskaya, Ya.F.

    1986-01-01

    Isostructural ZrCu 2 P 2 and HfCu 2 P 2 compounds are prepared for the first time. X-ray diffraction analysis (of powder, DRON-2.0 diffractometer, FeKsub(α) radiation) was used to study crystal structure of HfCu 2 P 2 phosphide belonging to the CaAl 2 Si 2 structural type (sp. group P anti 3 m 1, R=0.095). Lattice parameters the compounds are as follows: for ZrCu 2 P 2 a=0.3810(1), c=0.6184(5); for HfCu 2 P 2 a=0.3799(1), c=0.6160(2) (nm). Atomic parameters in the HfCu 2 P 2 structure and interatomic distances are determined

  4. Photoelectron and computational studies of the copper-nucleoside anionic complexes, Cu-(cytidine) and Cu-(uridine)

    Science.gov (United States)

    Li, Xiang; Ko, Yeon-Jae; Wang, Haopeng; Bowen, Kit H.; Guevara-García, Alfredo; Martínez, Ana

    2011-02-01

    The copper-nucleoside anions, Cu-(cytidine) and Cu-(uridine), have been generated in the gas phase and studied by both experimental (anion photoelectron spectroscopy) and theoretical (density functional calculations) methods. The photoelectron spectra of both systems are dominated by single, intense, and relatively narrow peaks. These peaks are centered at 2.63 and 2.71 eV for Cu-(cytidine) and Cu-(uridine), respectively. According to our calculations, Cu-(cytidine) and Cu-(uridine) species with these peak center [vertical detachment energy (VDE)] values correspond to structures in which copper atomic anions are bound to the sugar portions of their corresponding nucleosides largely through electrostatic interactions; the observed species are anion-molecule complexes. The combination of experiment and theory also reveal the presence of a slightly higher energy, anion-molecule complex isomer in the case of the Cu-(cytidine). Furthermore, our calculations found that chemically bond isomers of these species are much more stable than their anion-molecule complex counterparts, but since their calculated VDE values are larger than the photon energy used in these experiments, they were not observed.

  5. Photoelectron and computational studies of the copper-nucleoside anionic complexes, Cu(-)(cytidine) and Cu(-)(uridine).

    Science.gov (United States)

    Li, Xiang; Ko, Yeon-Jae; Wang, Haopeng; Bowen, Kit H; Guevara-García, Alfredo; Martínez, Ana

    2011-02-07

    The copper-nucleoside anions, Cu(-)(cytidine) and Cu(-)(uridine), have been generated in the gas phase and studied by both experimental (anion photoelectron spectroscopy) and theoretical (density functional calculations) methods. The photoelectron spectra of both systems are dominated by single, intense, and relatively narrow peaks. These peaks are centered at 2.63 and 2.71 eV for Cu(-)(cytidine) and Cu(-)(uridine), respectively. According to our calculations, Cu(-)(cytidine) and Cu(-)(uridine) species with these peak center [vertical detachment energy (VDE)] values correspond to structures in which copper atomic anions are bound to the sugar portions of their corresponding nucleosides largely through electrostatic interactions; the observed species are anion-molecule complexes. The combination of experiment and theory also reveal the presence of a slightly higher energy, anion-molecule complex isomer in the case of the Cu(-)(cytidine). Furthermore, our calculations found that chemically bond isomers of these species are much more stable than their anion-molecule complex counterparts, but since their calculated VDE values are larger than the photon energy used in these experiments, they were not observed.

  6. Phase diagrams of aluminium alloys of Al-Cu-Mg, Al-Mg-Si-Cu, and Al-Mg-Li system

    International Nuclear Information System (INIS)

    Ber, L.B.; Kaputkin, E.Ya.

    2001-01-01

    Isothermal diagrams of phase transformations (DPT) and temperature-time charts (TTC) of variation of electric conductivity and of mechanical features at tension were plotted following thermal treatment according to the pattern of direct hardening and ageing and according to the pattern of normal aging for D16 commercial alloy, Al-Cu-Mg model alloy of the same system, AD37 commercial alloys of Al-Mg-Si-Cu and 1424 one of Al-Li-Mg system. Phase transformations were studied by means of fluorescence electron microscopy, micro-X-ray spectral analysis, X-ray phase analysis of single crystals and polycrystals and differential scanning calorimetry. For every alloy comparison of TTC and DPT enables to clarity the mechanism of phase composition effect on features and to optimize conditions of hardening cooling and ageing [ru

  7. Impact parameter dependence of K-shell ionization in Cu-Cu collisions

    International Nuclear Information System (INIS)

    Frank, W.; Jaracz, P.; Kaun, K.-H.; Lenk, M.; Rudiger, J.; Stachura, Z.

    1980-01-01

    The impact parameter dependence of the yield of K-shell vacancy production in 1 MeV/ a.m.u. Cu-Cu collisions has been studied in an X-ray-scattered ion coincidence experiment. The results are compared with existing models for K-vacancy production

  8. Patterned YBa2Cu3O7-x thin films from photopolymerizable precursors

    International Nuclear Information System (INIS)

    Hung, Y.; Agostinelli, J.A.

    1990-01-01

    A technique which combines the fabrication and patterning of thin films of the high T c superconductor YBa 2 Cu 3 O 7-x has been developed. The technique possesses the essential features of the metalorganic decomposition method with the additional attribute that the metalorganic precursor is photopolymerizable. Patterns are generated directly in the precursor film using optical exposure through a mask followed by development in a solvent. A subsequent thermal treatment transforms the patterned precursor film to the oriented superconducting phase with c axis perpendicular to the substrate surface. Resistivity measurements for such a patterned film on a single crystal (100)MgO substrate show an onset to the superconducting state occurring at 85 K with zero resistivity below 67 K

  9. Real-time in-situ monitoring of the topotactic transformation of TlCu{sub 3}Se{sub 2} into TlCu{sub 2}Se{sub 2}

    Energy Technology Data Exchange (ETDEWEB)

    Ångström, J.; Sahlberg, M.; Berger, R.

    2015-07-15

    Highlights: • Topotactic transition from TlCu{sub 3}Se{sub 2} to TlCu{sub 2}Se{sub 2} followed in situ. • Synchrotron radiation X-ray powder diffraction enabled short scans. • Relative abundance of phases refined from powder data. • Opens up for studying similar systems in the same manner. - Abstract: The solid state transformation of monoclinic TlCu{sub 3}Se{sub 2} into tetragonal TlCu{sub 2}Se{sub 2} by oxidative copper leaching in concentrated ammonia solution has been studied in situ by the use of synchrotron radiation. The diffraction patterns of parent and daughter phase are both sharp, indicating a strong topotactic relationship between them that effectuates a rapid change by “chimie douce” performed at +19 °C. The transformation rate is strongly connected to the access of oxygen from the surrounding air. The transformation was followed in a real-time mode, being almost complete after 2.5 h with 1 h incubation due to low oxygen content, as shown from refining the diffraction patterns by Rietveld profile technique.

  10. Modifikasi Zeolit Dengan Tembaga (Cu) Dan Uji Sifat Katalitiknya Pada Reaksi Esterifikasi

    OpenAIRE

    Arjek, Orien Claudia Handayani; Fatimah, Is

    2017-01-01

    Zeolite modification with Cu has been conducted. Material modification is done by impregnating Cu through a zeolite powder reflux process with CuSO4.5H2O solution so that theoretical Cu concentration is 5% followed by oxidation and reduction of solids. Material characterization was performed by x-ray diffraction analysis (XRD), Fourier Transform Infra-Red (FTIR) and acidity testing of Cu/Zeolite catalyst.The results showed that the crystallinity level of Cu/Zeolite did not change significantl...

  11. Thermal stability of Py/Cu and Co/Cu giant magnetoresistance (GMR) multilayer systems

    Energy Technology Data Exchange (ETDEWEB)

    Vovk, Vitaliy

    2007-07-01

    NiFe/Cu and Co/Cu multilayer systems have been studied regarding the mechanisms of thermal degradation of the giant magnetoresistance effect (GMR). The different thermodynamics of the studied systems results in different mechanisms of the GMR degradation as shown by highest resolution nanoanalysis using the three dimensional wide angle tomographic atom probe. According to the TAP analysis, GMR deterioration in Py/Cu system occurs due to the broadening of the layer interfaces observed at 250 C. In contrast, due to the strong demixing tendency, Co/Cu multilayers remain stable up to 450 C. At higher temperatures ferromagnetic bridging of the neighboring Co layers takes place leading to the GMR breakdown. In both Py/Cu and Co/Cu systems recrystallization is induced at 350-450 C, which is accompanied by a change in the crystallographic orientation from <111> to <100> wire texture. The reaction may be utilized to produce GMR sensor layers of remarkable thermal stability. Although the systems of interest are equivalent in respect of the observed phenomenon, the Ni{sub x}Fe{sub 1-x}/Cu system is chosen for a detailed analysis because it allows a precise control of the lattice constant by varying the Fe content in the Ni{sub x}Fe{sub 1-x} layer. It is shown that the crystallographic reorientation is triggered by the minimization of lattice mismatch elastic energy. Moreover, the counteraction between the elastic and interfacial energy minimizations exerts a critical influence on the recrystallization probability. (orig.)

  12. Mechanochemical synthesis of Cu-Al and methyl orange intercalated Cu-Al layered double hydroxides

    International Nuclear Information System (INIS)

    Qu, Jun; He, Xiaoman; Chen, Min; Hu, Huimin; Zhang, Qiwu; Liu, Xinzhong

    2017-01-01

    In this study, a mechanochemical route to synthesize a Cu-Al layered double hydroxide (LDH) and a methyl orange (MO) intercalated one (MO-LDH) was introduced, in which basic cupric carbonate (Cu_2(OH)_2CO_3) and aluminum hydroxide (Al(OH)_3) with Cu/Al molar ratio at 2/1 was first dry ground for 2 h and then agitated in water or methyl orange solution for another 4 h to obtain the LDH and MO-LDH products without any heating operation. The prepared samples were characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), Thermogravimetry (TG), Differential scanning calorimetry (DSC) and Scanning electron microscopy (SEM). The products showed high crystallinity phase of Cu-Al and MO intercalated Cu-Al LDH with no evident impurities, proving that the craft introduced here was facile and effective. The new idea can be applied in other fields to produce organic-inorganic composites. - Highlights: • A facile mechanochemical route to synthesize Cu-Al and MO intercalated Cu-Al LDH. • The products possesses high crystalline of LDH phase with no impure phases. • The dry milling process induces the element substitution between the raw materials. • The agitation operation helps the grain growth of LDH.

  13. Mechanochemical synthesis of Cu-Al and methyl orange intercalated Cu-Al layered double hydroxides

    Energy Technology Data Exchange (ETDEWEB)

    Qu, Jun, E-mail: forsjun@whut.edu.cn [School of Resources and Environmental Engineering, Wuhan University of Technology, Luoshi Road 122, Wuhan, Hubei 430070 (China); He, Xiaoman; Chen, Min; Hu, Huimin [School of Resources and Environmental Engineering, Wuhan University of Technology, Luoshi Road 122, Wuhan, Hubei 430070 (China); Zhang, Qiwu, E-mail: zhangqw@whut.edu.cn [School of Resources and Environmental Engineering, Wuhan University of Technology, Luoshi Road 122, Wuhan, Hubei 430070 (China); Liu, Xinzhong [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350118 China (China)

    2017-04-15

    In this study, a mechanochemical route to synthesize a Cu-Al layered double hydroxide (LDH) and a methyl orange (MO) intercalated one (MO-LDH) was introduced, in which basic cupric carbonate (Cu{sub 2}(OH){sub 2}CO{sub 3}) and aluminum hydroxide (Al(OH){sub 3}) with Cu/Al molar ratio at 2/1 was first dry ground for 2 h and then agitated in water or methyl orange solution for another 4 h to obtain the LDH and MO-LDH products without any heating operation. The prepared samples were characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), Thermogravimetry (TG), Differential scanning calorimetry (DSC) and Scanning electron microscopy (SEM). The products showed high crystallinity phase of Cu-Al and MO intercalated Cu-Al LDH with no evident impurities, proving that the craft introduced here was facile and effective. The new idea can be applied in other fields to produce organic-inorganic composites. - Highlights: • A facile mechanochemical route to synthesize Cu-Al and MO intercalated Cu-Al LDH. • The products possesses high crystalline of LDH phase with no impure phases. • The dry milling process induces the element substitution between the raw materials. • The agitation operation helps the grain growth of LDH.

  14. The roles of Al2Cu and of dendritic refinement on surface corrosion resistance of hypoeutectic Al-Cu alloys immersed in H2SO4

    International Nuclear Information System (INIS)

    Osorio, Wislei R.; Spinelli, Jose E.; Freire, Celia M.A.; Cardona, Margarita B.; Garcia, Amauri

    2007-01-01

    Al-Cu alloys castings can exhibit different corrosion responses at different locations due to copper content and to the resulting differences on microstructural features and on Al 2 Cu fractions. The aim of this study was to investigate the influence of Al 2 Cu intermetallic particles associated to the dendritic arm spacings on the general corrosion resistance of three different hypoeutectic Al-Cu alloys samples in sulfuric acid solution. The cast samples were produced using a non-consumable tungsten electrode furnace with a water-cooled copper hearth under argon atmosphere. The typical microstructural pattern was examined by using electronic microscopy techniques. In order to evaluate the surface corrosion behavior of such Al-Cu alloys, corrosion tests were performed in a 0.5 M sulfuric acid solution at 25 deg. C by using an electrochemical impedance spectroscopy (EIS) technique and potentiodynamic polarization curves. An equivalent circuit was also used to provide quantitative support for the discussions and understanding of the corrosion behavior. It was found that Al 2 Cu has a less noble corrosion potential than that of the Al-rich phase. Despite that, dendrite fineness has proved to be more influent on corrosion resistance than the increase on alloy copper content with the consequent increase on Al 2 Cu fraction

  15. Elemental separation in nanocrystalline Cu-Al alloys

    Science.gov (United States)

    Wang, Y. B.; Liao, X. Z.; Zhao, Y. H.; Cooley, J. C.; Horita, Z.; Zhu, Y. T.

    2013-06-01

    Nanocrystallization by high-energy severe plastic deformation has been reported to increase the solubility of alloy systems and even to mix immiscible elements to form non-equilibrium solid solutions. In this letter, we report an opposite phenomenon—nanocrystallization of a Cu-Al single-phase solid solution by high-pressure torsion separated Al from the Cu matrix when the grain sizes are refined to tens of nanometers. The Al phase was found to form at the grain boundaries of nanocrystalline Cu. The level of the separation increases with decreasing grain size, which suggests that the elemental separation was caused by the grain size effect.

  16. DO22-(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures

    International Nuclear Information System (INIS)

    Liu Lilin; Huang, Haiyou; Fu Ran; Liu Deming; Zhang Tongyi

    2009-01-01

    The present work conducts crystal characterization by High Resolution Transmission Electron Microscopy (HRTEM) on Cu/Sn-nanolayer/Ni sandwich structures associated with the use of Energy Dispersive X-ray (EDX) analysis. The results show that DO 22 -(Cu,Ni) 3 Sn intermetallic compound (IMC) ordered structure is formed in the sandwich structures at the as-electrodeposited state. The formed DO 22 -(Cu,Ni) 3 Sn IMC is a homogeneous layer with a thickness about 10 nm. The DO 22 -(Cu,Ni) 3 Sn IMC nanolayer is stable during annealing at 250 deg. C for 810 min. The formation and stabilization of the metastable DO 22 -(Cu,Ni) 3 Sn IMC nanolayer are attributed to the less strain energy induced by lattice mismatch between the DO 22 IMC and fcc Cu crystals in comparison with that between the equilibrium DO 3 IMC and fcc Cu crystals.

  17. Electronic states of the θ' phase in Cu-Al alloys as compared to C16-CuAl2: Cu Lα emission excited directly by undulator radiation

    Science.gov (United States)

    Dallera, C.; de Michelis, B.; Puppin, E.; Braicovich, L.; Brookes, N. B.

    1996-01-01

    The electronic states of the θ' phase formed by thermal aging in the Al-Cu (0.5 at. %) alloy are compared with those in C16-CuAl2, which is the final phase separated at equilibrium. This is done by means of Cu Lα fluorescence spectroscopy. The high brilliance of undulator radiation used as an excitation source is exploited. The spectra are taken using the first harmonic of the undulator at 1.7 keV, with a full width half maximum of ~250 eV. A narrowing of around 0.5 eV of the Cu Lα spectra in the θ' phase is found. This is explained in terms of the differences in the Cu 3d-Cu 3d interaction in the two phases and of the hybridization between Cu 3d and the nearly free-electron-like electrons. The results demonstrate the future possibilities of fluorescence spectroscopy of minority species in inhomogeneous systems.

  18. Moisture barrier properties of single-layer graphene deposited on Cu films for Cu metallization

    Science.gov (United States)

    Gomasang, Ploybussara; Abe, Takumi; Kawahara, Kenji; Wasai, Yoko; Nabatova-Gabain, Nataliya; Thanh Cuong, Nguyen; Ago, Hiroki; Okada, Susumu; Ueno, Kazuyoshi

    2018-04-01

    The moisture barrier properties of large-grain single-layer graphene (SLG) deposited on a Cu(111)/sapphire substrate are demonstrated by comparing with the bare Cu(111) surface under an accelerated degradation test (ADT) at 85 °C and 85% relative humidity (RH) for various durations. The change in surface color and the formation of Cu oxide are investigated by optical microscopy (OM) and X-ray photoelectron spectroscopy (XPS), respectively. First-principle simulation is performed to understand the mechanisms underlying the barrier properties of SLG against O diffusion. The correlation between Cu oxide thickness and SLG quality are also analyzed by spectroscopic ellipsometry (SE) measured on a non-uniform SLG film. SLG with large grains shows high performance in preventing the Cu oxidation due to moisture during ADT.

  19. Preparation of Uniform Hexapod Cu{sub 2}O and Hollow Hexapod CuO

    Energy Technology Data Exchange (ETDEWEB)

    Cho, Youngsik; Huh, Youngduk [Dankook Univ., Yongin (Korea, Republic of)

    2013-10-15

    The filled hexapod Cu{sub 2}O precursors were also prepared under microwave irradiation for only 120 s using a commercial microwave oven. The optimal experimental conditions for the perfect and uniform hexapod-like Cu{sub 2}O precursors were examined. The control of the cooling rate by adding cold water was also examined for the elimination of further crystal growth at the end of the arm of the hexapod Cu{sub 2}O precursors due to the thermal diffusion in reaction medium. The uniform hollow structure and hexapod CuO products were also prepared from the direct thermal oxidation of the filled hexapod Cu{sub 2}O precursors. The morphology-dependent properties of inorganic materials, such as magnetic, photocatalytic, and antibacterial activities, is one of the most important experimental issues in inorganic technology. Many researchers have prepared uniform and specific shaped inorganic oxides to understand the morphology-dependent properties of inorganic oxides.

  20. Modeling Photoelectron Spectra of CuO, Cu2O, and CuO2 Anions with Equation-of-Motion Coupled-Cluster Methods: An Adventure in Fock Space.

    Science.gov (United States)

    Orms, Natalie; Krylov, Anna I

    2018-04-12

    The experimental photoelectron spectra of di- and triatomic copper oxide anions have been reported previously. We present an analysis of the experimental spectra of the CuO - , Cu 2 O - , and CuO 2 - anions using equation-of-motion coupled-cluster (EOM-CC) methods. The open-shell electronic structure of each molecule demands a unique combination of EOM-CC methods to achieve an accurate and balanced representation of the multiconfigurational anionic- and neutral-state manifolds. Analysis of the Dyson orbitals associated with photodetachment from CuO - reveals the strong non-Koopmans character of the CuO states. For the lowest detachment energy, a good agreement between theoretical and experimental values is obtained with CCSD(T) (coupled-cluster with single and double excitations and perturbative account of triple excitations). The (T) correction is particularly important for Cu 2 O - . Use of a relativistic pseudopotential and matching basis set improves the quality of results in most cases. EOM-DIP-CCSD analysis of the low-lying states of CuO 2 - reveals multiple singlet and triplet anionic states near the triplet ground state, adding an extra layer of complexity to the interpretation of the experimental CuO 2 - photoelectron spectrum.

  1. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  2. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  3. Nanoporous Al sandwich foils using size effect of Al layer thickness during Cu/Al/Cu laminate rolling

    Science.gov (United States)

    Yu, Hailiang; Lu, Cheng; Tieu, A. Kiet; Li, Huijun; Godbole, Ajit; Kong, Charlie

    2018-06-01

    The roll bonding technique is one of the most widely used methods to produce metal laminate sheets. Such sheets offer interesting research opportunities for both scientists and engineers. In this paper, we report on an experimental investigation of the 'thickness effect' during laminate rolling for the first time. Using a four-high multifunction rolling mill, Cu/Al/Cu laminate sheets were fabricated with a range of thicknesses (16, 40, 70 and 130 μm) of the Al layer. The thickness of the Cu sheets was a constant 300 μm. After rolling, TEM images show good bonding quality between the Cu and Al layers. However, there are many nanoscale pores in the Al layer. The fraction of nanoscale pores in the Al layer increases with a reduction in the Al layer thickness. The finite element method was used to simulate the Cu/Al/Cu rolling process. The simulation results reveal the effect of the Al layer thickness on the deformation characteristics of the Cu/Al/Cu laminate. Finally, we propose that the size effect of the Al layer thickness during Cu/Al/Cu laminate rolling may offer a method to fabricate 'nanoporous' Al sandwich laminate foils. Such foils can be used in electromagnetic shielding of electrical devices and noisy shielding of building.

  4. Tolerance of spermatogonia to oxidative stress is due to high levels of Zn and Cu/Zn superoxide dismutase.

    Directory of Open Access Journals (Sweden)

    Fritzie T Celino

    Full Text Available BACKGROUND: Spermatogonia are highly tolerant to reactive oxygen species (ROS attack while advanced-stage germ cells such as spermatozoa are much more susceptible, but the precise reason for this variation in ROS tolerance remains unknown. METHODOLOGY/PRINCIPAL FINDINGS: Using the Japanese eel testicular culture system that enables a complete spermatogenesis in vitro, we report that advanced-stage germ cells undergo intense apoptosis and exhibit strong signal for 8-hydroxy-2'-deoxyguanosine, an oxidative DNA damage marker, upon exposure to hypoxanthine-generated ROS while spermatogonia remain unaltered. Activity assay of antioxidant enzyme, superoxide dismutase (SOD and Western blot analysis using an anti-Copper/Zinc (Cu/Zn SOD antibody showed a high SOD activity and Cu/Zn SOD protein concentration during early spermatogenesis. Immunohistochemistry showed a strong expression for Cu/Zn SOD in spermatogonia but weak expression in advanced-stage germ cells. Zn deficiency reduced activity of the recombinant eel Cu/Zn SOD protein. Cu/Zn SOD siRNA decreased Cu/Zn SOD expression in spermatogonia and led to increased oxidative damage. CONCLUSIONS/SIGNIFICANCE: These data indicate that the presence of high levels of Cu/Zn SOD and Zn render spermatogonia resistant to ROS, and consequently protected from oxidative stress. These findings provide the biochemical basis for the high tolerance of spermatogonia to oxidative stress.

  5. Study of properties of Cu-Y and Cu-Y-Al system alloys

    International Nuclear Information System (INIS)

    Shparo, N.B.; Nikolaev, A.K.; Rozenberg, V.M.

    1978-01-01

    Investigated were the strength properties of alloys Cu(0-1.2)% Y and Cu-(10-0.5)% Al-(0-0.5)% Y after being treated under various heat conditions and tested at temperatures of 20, 400 and 600 deg C. Yttrium additions raise the temperature of recrystallization of copper and of copper-aluminium alloys. Small additions of yttrium (0.05%) increase considerably strength of Cu-Al alloys without increasing their electric resistance. Optimum properties are attained after hardening, deformation and ageing at 400 deg C

  6. Dissolved trace metal (Cu, Cd, Co, Ni, and Ag) distribution and Cu speciation in the southern Yellow Sea and Bohai Sea, China

    Science.gov (United States)

    Li, Li; Xiaojing, Wang; Jihua, Liu; Xuefa, Shi

    2017-02-01

    Trace metals play an important role in biogeochemical cycling in ocean systems. However, because the use of trace metal clean sampling and analytical techniques has been limited in coastal China, there are few accurate trace metal data for that region. This work studied spatial distribution of selected dissolved trace metals (Ag, Cu, Co, Cd, and Ni) and Cu speciation in the southern Yellow Sea (SYS) and Bohai Sea (BS). In general, the average metal (Cu, Co, Cd, and Ni) concentrations found in the SYS were lower by a factor of two than those in BS, and they are comparable to dissolved trace metal concentrations in coastal seawater of the United States and Europe. Possible sources and sinks and physical and biological processes that influenced the distribution of these trace metals in the study region were further examined. Close relationships were found between the trace metal spatial distribution with local freshwater discharge and processes such as sediment resuspension and biological uptake. Ag, owing to its extremely low concentrations, exhibited a unique distribution pattern that magnified the influences from the physical and biological processes. Cu speciation in the water column showed that, in the study region, Cu was strongly complexed with organic ligands and concentrations of free cupric ion were in the range of 10-12.6-10-13.2 mol L-1. The distribution of Cu-complexing ligand, indicated by values of the side reaction coefficient α', was similar to the Chl a distribution, suggesting that in situ biota production may be one main source of Cu-complexing organic ligand.

  7. Formation of layered microstructure in the Y-Ba-Cu-O and Bi-Sr-Ca-Cu-O superconductors

    International Nuclear Information System (INIS)

    Jin, S.; Kammlott, G.W.; Tiefel, T.H.; Chen, S.K.

    1992-01-01

    The layered grain microstructure is essential for overcoming the weak link problem and ensuring high transport critical currents in the cuprate superconductors. In this paper we discuss the processing and the mechanisms for layer information in Y-Ba-Cu-O and Bi-Sr-Ca-Cu-O. In melt-processed Y-Ba-Cu-O, sympathetic nucleation on previously nucleated YBa 2 Cu 3 O 7-δ plates during solidification appears to be dominant mechanism for the formation of parallel plate-shaped grains. In the Y-Ba-Cu-O and Bi-Sr-Ca-Cu-O ribbons, the interface reaction between the superconductor layer and the silvers substrate seems to be the main mechanism for the c-axis texturing of the layered grains. The drastically different critical current behavior in the c-axis textured Y-Ba-Cu-O and Bi-Sr-Ca-Cu-O ribbons is discussed in terms of possible differences in the nature of the twist and tilt grain boundaries. (orig.)

  8. Experimental Liquidus Studies of the Pb-Cu-Si-O System in Equilibrium with Metallic Pb-Cu Alloys

    Science.gov (United States)

    Shevchenko, M.; Nicol, S.; Hayes, P. C.; Jak, E.

    2018-03-01

    Phase equilibria of the Pb-Cu-Si-O system have been investigated in the temperature range from 1073 K to 1673 K (800 °C to 1400 °C) for oxide liquid (slag) in equilibrium with solid Cu metal and/or liquid Pb-Cu alloy, and solid oxide phases: (a) quartz or tridymite (SiO2) and (b) cuprite (Cu2O). High-temperature equilibration on silica or copper substrates was performed, followed by quenching, and direct measurement of Pb, Cu, and Si concentrations in the liquid and solid phases using the electron probe X-ray microanalysis has been employed to accurately characterize the system in equilibrium with Cu or Pb-Cu metal. All results are projected onto the PbO-"CuO0.5"-SiO2 plane for presentation purposes. The present study is the first-ever systematic investigation of this system to describe the slag liquidus temperatures in the silica and cuprite primary phase fields.

  9. Superconductivity in the U(Th)-Y-Ba-Cu-O systems

    International Nuclear Information System (INIS)

    Qin Qizong; He Adi; Jia Weijie; Ma Lidun; Cheng Huansheng; Hua Zhongyi

    1989-01-01

    High T c superconductivity has been observed both resistively and magnetically in the new U(Th)-Y-Ba-Cu-O systems. The zero resistance temperature of the three samples with nominal composition of U 0.1 Y 1.1 Ba 0.8 Cu O 4-z , U 0.15 Y 1.05 Ba 0.8 Cu 4-z and Th 0.3 Y 0.8 Ba 0.8 Cu 4-z is 87K, 79K and 74K, respectively. The result of ac magnetic susceptibility measurement implies that the superconducting state is realized in the U-doped samples below 90K. The stoichimetry of the U-Y-Ba-Cu O superconductors has the aid of Rutherford backscattering and nuclear reaction 16 O(d, p) 17 O. The analytical results show that the 'real composition' of somples may be different from that of the nomial composition. The X ray diffraction analysis of the U-Y-Ba-Cu-O system shows that none of the peaks can be fitted to the uranium oxides and the other raw materiale structure, and its pattern may be attributed to new multiple phases with structure different from the known singlephase superconducting oxides

  10. Magnetic Moment of $^{59}$Cu

    CERN Multimedia

    2002-01-01

    Experiment IS358 uses the intense and pure beams of copper isotopes provided by the ISOLDE RILIS (resonance ionization laser ion source). The isotopes are implanted and oriented in the low temperature nuclear orientation set-up NICOLE. Magnetic moments are measured by $\\beta$-NMR. Copper (Z=29), with a single proton above the proton-magic nickel isotopes provides an ideal testground for precise shell model calculations of magnetic moments and their experimental verification. In the course of our experiments we already determined the magnetic moments of $^{67}$Ni, $^{67}$Cu, $^{68g}$Cu, $^{69}$Cu and $^{71}$Cu which provide important information on the magicity of the N=40 subshell closure. In 2001 we plan to conclude our systematic investigations by measuring the magnetic moment of the neutron-deficient isotope $^{59}$Cu. This will pave the way for a subsequent study of the magnetic moment of $^{57}$Cu with a complementary method.

  11. Free standing CuO-MnO2 nanocomposite for room temperature ammonia sensing

    Science.gov (United States)

    Bhuvaneshwari, S.; Papachan, Seethal; Gopalakrishnan, N.

    2017-05-01

    CuO nanostructures and CuO-MnO2 nanocomposite were successfully synthesized using hydrothermal method without any aid of growth controlling agents. The synthesized CuO nanostructures have monoclinic structure. The XRD pattern of CuO-MnO2 observed with mixed phases of monoclinic CuO and birnessite-type MnO2 which confirms the formation of nanocomposite. SEM images revealed the turmeric-like morphology for CuO and intercalated sheets with flowers on the surface for CuO-MnO2. The length and breadth of turmeric-like structure is about 642.2 nm and 141.8 nm, respectively. The band gap of 1.72 eV for CuO nanostructure and 1.9 eV for CuO-MnO2 nanocomposite were observed from the absorption spectra. The free standing devices of CuO-MnO2 showed nearly a 3 fold increase sensing response to ammonia at room temperature when compared to the constituent CuO. The composite sensor showed response time of 120 s and recovered within 600 s. This enhanced response can be asserted to the peculiar morphology of the composite that provides more adsorption site for gas diffusion to take place.

  12. Optical constants of Cu(In, Ga)Se{sub 2} for arbitrary Cu and Ga compositions

    Energy Technology Data Exchange (ETDEWEB)

    Minoura, Shota; Kodera, Keita; Nakane, Akihiro; Fujiwara, Hiroyuki, E-mail: fujiwara@gifu-u.ac.jp [Center of Innovative Photovoltaic Systems (CIPS), Gifu University, 1-1 Yanagido, Gifu 501-1193 (Japan); Maekawa, Takuji [Research and Development Headquarters, ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585 (Japan); Niki, Shigeru [Research Center for Photovoltaic Technologies, National Institute of Advanced Industrial Science and Technology (AIST), Central2, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568 (Japan)

    2015-05-21

    The optical constants of Cu(In, Ga)Se{sub 2} (CIGS)-based polycrystalline layers with different Cu and Ga compositions are parameterized completely up to a photon energy of 6.5 eV assuming several Tauc-Lorentz transition peaks. Based on the modeled optical constants, we establish the calculation procedure for the CIGS optical constants in a two-dimensional compositional space of (Cu, Ga) by taking the composition-induced shift of the critical point energies into account. In particular, we find that the variation of the CIGS optical constants with the Cu composition can be modeled quite simply by a spectral-averaging method in which the dielectric function of the target Cu composition is estimated as a weighted average of the dielectric functions with higher and lower Cu compositions. To express the effect of the Ga composition, on the other hand, an energy shift model reported earlier is adopted. Our model is appropriate for a wide variety of CIGS-based materials having different Cu and Ga compositions, although the modeling error increases slightly at lower Cu compositions [Cu/(In + Ga) < 0.69]. From our model, the dielectric function, refractive index, extinction coefficient, and absorption coefficient for the arbitrary CIGS composition can readily be obtained. The optical database developed in this study is applied further for spectroscopic ellipsometry analyses of CIGS layers fabricated by single and multi-stage coevaporation processes. We demonstrate that the compositional and structural characterizations of the CIGS-based layers can be performed from established analysis methods.

  13. Fabrication and sulfurization of Cu{sub 2}SnS{sub 3} thin films with tuning the concentration of Cu-Sn-S precursor ink

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Chi-Jie [Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Taiwan (China); Shei, Shih-Chang, E-mail: scshei@mail.nutn.edu.tw [Department of Electrical Engineering, Nation University of Tainan, Taiwan (China); Chang, Shih-Chang [Department of Electrical Engineering, Nation University of Tainan, Taiwan (China); Chang, Shoou-Jinn [Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Taiwan (China)

    2016-12-01

    Highlights: • Tuning the relative reaction rate of component phases proved to be beneficial in controlling the reaction process. • Low-concentration samples display closely packed Cu{sub 2}SnS{sub 3} grains with a flat morphology. • Optical band-gap energy measured at 1.346 eV suitable for thin-film solar cell applications. - Abstract: In this study, Cu-Sn-S nanoinks were synthesized by combining chelating polyetheramine to Cu, Sn, S powders of various concentrations. X-ray diffraction patterns indicate that nanoinks synthesized at low concentrations are composed almost entirely of binary phases SnS and Cu{sub 2}S. Synthesizing nanoinks at higher concentrations decreased the quantity of binary phase and led to the appearance of ternary phase Cu{sub 4}SnS{sub 4}. Following sulfurization, single phase Cu{sub 2}SnS{sub 3} (CTS) thin film was obtained from nanoinks of low concentration; however, impurities, such as Cu{sub 2}S were detected in the thin film obtained from nanoinks of high concentration. This can be attributed to the fact that lower concentrations reduce the reactivity of all the elements. As a result, the SnS phase reacted more readily and more rapidly, resulting in the early formation of a stoichiometric CTS thin film during sulfurization. Under these reaction conditions, Cu{sub 2}S and SnS transform into CTS and thereby prevent the formation of unwanted phases of Cu{sub 2}S and Cu{sub 4}SnS{sub 4}. Raman spectra revealed that second phase Cu{sub 2}S phase remained in the high-concentration samples, due to an increase in reactivity due to the participation of a greater proportion of the copper in the reaction. The surface microstructure of low-concentration samples display closely packed Cu{sub 2}SnS{sub 3} grains with a flat morphology and an atomic composition ratio of Cu:Sn:S = 34.69:15.90:49.41, which is close to stoichiometric. Hall measurement revealed that low-concentration sample has superior electrical properties; i.e., a hole

  14. Influence of Cu Content on the Structure, Mechanical, Friction and Wear Properties of VCN–Cu Films

    Directory of Open Access Journals (Sweden)

    Fanjing Wu

    2018-03-01

    Full Text Available VCN–Cu films with different Cu contents were deposited by reactive magnetron sputtering technique. The films were evaluated in terms of their microstructure, elemental composition, mechanical, and tribological properties by X-ray diffraction (XRD, energy-dispersive X-ray spectroscopy (EDS, high resolution transmission electron microscopy (HR-TEM, Raman spectrometry, nano-indentation, field emission scanning electron microscope (FE-SEM, Bruker three-dimensional (3D profiler, and high-temperature ball on disc tribo-meter. The results showed that face-centered cubic (fcc VCN, hexagonal close-packed (hcp V2CN, fcc-Cu, amorphous graphite and CNx phases co-existed in VCN–Cu films. After doping with 0.6 at.% Cu, the hardness reached a maximum value of ~32 GPa. At room temperature (RT, the friction coefficient and wear rate increased with increasing Cu content. In the temperature range of 100–500 °C, the friction coefficient decreased, but the wear rate increased with the increase of Cu content.

  15. First-principles study of point defects in solar cell semiconductor CuI

    International Nuclear Information System (INIS)

    Chen, Hui; Wang, Chong-Yu; Wang, Jian-Tao; Wu, Ying; Zhou, Shao-Xiong

    2013-01-01

    Hybrid density functional theory is used to study the formation energies and transition levels of point defects V Cu , V I , I Cu , Cu I , and O I in CuI. It is shown that the Heyd–Scuseria–Ernzerhof (HSE06) method can accurately describe the band gap of bulk CuI. As a solar cell material, we find that p-type semiconductor CuI can be obtained under the iodine-rich and copper-poor conditions. Our results are in good agreement with experiment and provide an excellent account for tuning the structural and electronic properties of CuI

  16. Mechanical, electronic and thermal properties of Cu{sub 5}Zr and Cu{sub 5}Hf by first-principles calculations

    Energy Technology Data Exchange (ETDEWEB)

    Yi, Guohui [State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao 066004 (China); Zhang, Xinyu, E-mail: xyzhang@ysu.edu.cn [State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao 066004 (China); Qin, Jiaqian, E-mail: jiaqianqin@gmail.com [Metallurgy and Materials Science Research Institute, Chulalongkorn University, Bangkok 10330 (Thailand); Ning, Jinliang; Zhang, Suhong; Ma, Mingzhen; Liu, Riping [State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao 066004 (China)

    2015-08-15

    Highlights: • The mechanical and fundamental thermal data of Cu{sub 5}Zr and Cu{sub 5}Hf are determined. • The technologically important elastic anisotropy is obtained and discussed according to its industrial applications. • The brittle/ductile and bonding nature of Cu{sub 5}Zr and Cu{sub 5}Hf are analyzed in details. - Abstract: The structural, elastic, electronic and thermodynamic properties of Cu{sub 5}Zr and Cu{sub 5}Hf compounds are investigated by first-principles calculations combined with the quasi-harmonic Debye model. The calculated lattice parameters of cubic AuBe{sub 5}-type Cu{sub 5}Zr and Cu{sub 5}Hf agree well with available experimental and other theoretical results and the formation enthalpy calculations show that AuBe{sub 5}-type Cu{sub 5}Hf is more energetically stable than the competing hexagonal CaCu{sub 5}-type phase. The mechanical properties such as mechanical stabilities, anisotropy character, ductility (estimated from the value of B/G, Poisson’s ratio υ and Cauchy pressures C{sub 12}–C{sub 44}) and thermodynamic properties such as volume change under temperature and pressure (V/V{sub 0}), heat capacity (C{sub v}), Debye temperature (Θ), thermal expansion coefficient (α) of AuBe{sub 5}-type Cu{sub 5}Zr and Cu{sub 5}Hf are calculated together. Cu{sub 5}Hf has better performances than Cu{sub 5}Zr with higher hardness and better resistance to fracture which are rationalized from the calculated electronic structure (including density of states, charge density distributions, Mulliken’s population analysis) and we find that all ionic, covalent and metallic components exist in bonding of Cu{sub 5}Zr and Cu{sub 5}Hf but the covalent bonding in Cu{sub 5}Hf is stronger.

  17. Decomposition of NO on Cu-loaded zeolites

    Energy Technology Data Exchange (ETDEWEB)

    Sepulveda-Escribano, A; Marquez-Alvarez, C; Rodriquez-Ramos, I; Fierro, J L.G. [Instituto de Catalisis y Petroleoquimica, Madrid (Spain); Guerrero-Ruiz, A [Departamento de Quimica Inorganica, UNED, Madrid (Spain)

    1993-05-26

    Two copper ion-exchanged zeolites, Cu/NaY and Cu/NaZSM-5 have been studied by several techniques (TPR, TPD of NO, IR spectroscopy of adsorbed NO and XPS) and their catalytic activity for NO-decomposition have been determined under dynamic conditions. The results obtained here show that copper is stabilized as Cu[sup +] in Cu/NaZSM-5 after calcination in air at 673K, while in Cu/NaY the initial Cu[sup +]-ions are easier oxidized to Cu[sup 2+], this leading to a completely different catalytic behavior in the reaction of NO-decomposition. So, whereas the Cu/NaZSM-5 exhibits a high NO-conversion at the reaction temperatures (573 and 873K), the parent Cu/NaY zeolite becomes deactivated in the first stages of reaction.

  18. Preparation and characterization of Y-Ba-Cu-O-F superconductors

    Energy Technology Data Exchange (ETDEWEB)

    Yokoyama, Yuko; Okumura, Tomoyuki; Sugise, Ryoji; Matsubara, Toshiya; Koshizuka, Naoki; Hirabayashi, Masayuki; Terada, Norio; Ihara, Hideo

    1988-04-01

    Samples were prepared by powder composition method which uses fluoride for annealing and by the method which anneals YBa/sub 2/Cu/sub 3/O/sub x/ in fluorine to elucidate fluorine substitution effects on the superconducting properties of YBa/sub 2/Cu/sub 3/O/sub/x/F/sub/y/. Their structures, magnetic properties and electrical conductivities were investigated. The samples were prepared with the appropriate mixture of BaCO/sub 3/, Y/sub 2/O/sub 3/, CuO, and fluoride such as CuF/sub 2/. Since the samples had strong peaks of BaF/sub 2/ phase together with the perovskite phase in the X-ray diffraction patterns, it was difficult to obtain information on the fluorine substitution effects on the physical properties. Next, the samples were prepared by annealing YBa/sub 2/CuO/sub/x/ sintred pellets and CoF/sub 3/ powder in a sealed quartz tube. In this case, the diffraction patterns showed that the crystalline state of the samples was a single phase of the orthorohombic perovskite structure. The behaviors against the changes in magnetic field and temperature can be considered to be substantially identical. It is hard to consider that the fluorine substitution will play a direct role in attaining higher Tc. (6 figs, 2 refs)

  19. Synthesis, characterization and catalytic property of CuO and Ag/CuO nanoparticles for the epoxidation of styrene

    Energy Technology Data Exchange (ETDEWEB)

    Lashanizadegan, Maryam; Erfaninia, Nasrin [Alzahra University, Tehran (Iran, Islamic Republic of)

    2013-11-15

    CuO nanorodes, CuO nanoplates and Ag/CuO nanoparticles were synthesized in the presence of polyethylene glycol by depositional in alkaline environment. Oxide nanoparticles were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and Fourier transform infrared absorption spectra (FT-IR). CuO and Ag/CuO nanoparticles show high catalytic activity for the selective epoxidation of styrene to styrene oxide by TBHP. Under the optimized reaction condition, the oxidation of styrene catalyzed by CuO nanorods gave 100% conversion with 60 and 35% styrene oxide and benzaldehyde, respectively. Ag/CuO gave 99% conversion and styrene oxide (71%) and benzaldehyde (12%) being the major product.

  20. Structure and magnetic properties of CoxCu1−x nanowires in self-assembled arrays

    International Nuclear Information System (INIS)

    Almasi Kashi, M.; Ramazani, A.; Adelnia Najafabadi, F.

    2012-01-01

    Highlights: ► Role of non-magnetic Cu on the microstructure and magnetic properties of Co x Cu 1−x nanowires. ► Composition variation through ac pulse electrodeposition. ► Replacement of Co with Cu by electroless phenomenon during the off-time between pulses. - Abstract: CoCu alloy nanowire arrays were ac-pulse electrodeposited into porous anodic aluminum oxide. The effect of off-time between pulses and Cu concentration on the magnetic properties, crystalline structure and weight percentage of Co x Cu 1−x alloy nanowires have been studied by alternating gradient force magnetometer (AGFM), X-ray diffraction pattern (XRD) and energy dispersed spectrometry (EDS), respectively. Increasing the off-time between pulses decreased the weight percentage of Co in the range of (x = 0.84 − 0.24). Results of EDS were in accordance with saturation magnetization per unit area of the samples. Coexistence of a moderate off-time and Cu concentration provided excellent conditions for fabrication of the composite nanowires which were proved by XRD patterns.

  1. Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

    International Nuclear Information System (INIS)

    Hsu, Kuo-Chung; Perng, Dung-Ching; Wang, Yi-Chun

    2012-01-01

    Highlights: ► A 5 nm-thick Mo added Ru film has been investigated as a Cu diffusion barrier layer. ► RuMo film provides over 175 °C improvement in thermal stability than that of pure Ru layer. ► The 5 nm-thick RuMo film shows excellent barrier performance against Cu diffusion upon 725 °C. - Abstract: This study investigated the properties of 5 nm-thick RuMo film as a Cu diffusion barrier. The sheet resistance variation and X-ray diffraction patterns show that the RuMo alloy film has excellent barrier performance and that it is stable upon annealing at 725 °C against Cu. The transmission electron microscopy micrograph and diffraction patterns show that the RuMo film is an amorphous-like structure, whereas pure Ru film is a nano-crystalline structure. The elements’ depth profiles, analyzed by X-ray photoelectron spectroscopy, indicate no inter-diffusion behavior between the Cu and Si layer, even annealing at 700 °C. Lower leakage current has been achieved from the Cu/barrier/insulator/Si test structure using RuMo film as the barrier layer. A 5 nm ultrathin RuMo film provided two orders of magnitude improvement in leakage current and also exhibited a 175 °C improvement in thermal stability than that of the pure Ru film. It is a potential candidate as a seedless Cu diffusion barrier for advanced Cu interconnects.

  2. Antimicrobial Cu-bearing stainless steel scaffolds

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Qiang, E-mail: mfqwang@163.com [School of Stomatology, China Medical University, Shenyang 110002 (China); Ren, Ling [Institute of Metal Research, Chinese Academy of Sciences (China); Li, Xiaopeng [School of Mechanical and Chemical Engineering, The University of Western Australia (Australia); Zhang, Shuyuan [Institute of Metal Research, Chinese Academy of Sciences (China); Sercombe, Timothy B., E-mail: tim.sercombe@uwa.edu.au [School of Mechanical and Chemical Engineering, The University of Western Australia (Australia); Yang, Ke, E-mail: kyang@imr.ac.cn [Institute of Metal Research, Chinese Academy of Sciences (China)

    2016-11-01

    Copper-bearing stainless steel scaffolds with two different structures (Body Centered Cubic and Gyroid labyrinth) at two solid fractions (25% and 40%) were fabricated from both 316L powder and a mixture of 316L and elemental Cu powder using selective laser melting, and relative 316L scaffolds were served as control group. After processing, the antimicrobial testing demonstrated that the 316L-Cu scaffolds presented excellent antimicrobial activity against Escherichia coli and Staphylococcus aureus, and the cell viability assay indicated that there was no cytotoxic effect of 316L-Cu scaffolds on rat marrow mesenchymal stem cells. As such, these have the potential to reduce implant-associated infections. The Cu was also found to homogeneously distribute within the microstructure by scanning electronic microcopy. The addition of Cu would not significantly affect its strength and stiffness compared to 316L scaffold, and the stiffness of all the scaffolds (3-20GPa) is similar to that of bone and much less than that of bulk stainless steel. Consequently, fabrication of such low stiffness porous structures, especially coupled with the addition of antimicrobial Cu, may provide a new direction for medical stainless steels. - Highlights: • 316L-Cu scaffolds were fabricated by using selective laser melting (SLM). • 316L-Cu scaffolds showed satisfied antimicrobial activities. • 316L-Cu scaffolds have no cytotoxic effect on normal cells. • Other properties of 316L-Cu scaffolds were similar to 316L scaffolds. • 316L-Cu scaffolds have the potential to be used in orthopedic applications.

  3. Antimicrobial Cu-bearing stainless steel scaffolds

    International Nuclear Information System (INIS)

    Wang, Qiang; Ren, Ling; Li, Xiaopeng; Zhang, Shuyuan; Sercombe, Timothy B.; Yang, Ke

    2016-01-01

    Copper-bearing stainless steel scaffolds with two different structures (Body Centered Cubic and Gyroid labyrinth) at two solid fractions (25% and 40%) were fabricated from both 316L powder and a mixture of 316L and elemental Cu powder using selective laser melting, and relative 316L scaffolds were served as control group. After processing, the antimicrobial testing demonstrated that the 316L-Cu scaffolds presented excellent antimicrobial activity against Escherichia coli and Staphylococcus aureus, and the cell viability assay indicated that there was no cytotoxic effect of 316L-Cu scaffolds on rat marrow mesenchymal stem cells. As such, these have the potential to reduce implant-associated infections. The Cu was also found to homogeneously distribute within the microstructure by scanning electronic microcopy. The addition of Cu would not significantly affect its strength and stiffness compared to 316L scaffold, and the stiffness of all the scaffolds (3-20GPa) is similar to that of bone and much less than that of bulk stainless steel. Consequently, fabrication of such low stiffness porous structures, especially coupled with the addition of antimicrobial Cu, may provide a new direction for medical stainless steels. - Highlights: • 316L-Cu scaffolds were fabricated by using selective laser melting (SLM). • 316L-Cu scaffolds showed satisfied antimicrobial activities. • 316L-Cu scaffolds have no cytotoxic effect on normal cells. • Other properties of 316L-Cu scaffolds were similar to 316L scaffolds. • 316L-Cu scaffolds have the potential to be used in orthopedic applications.

  4. Conducting mechanisms of forming-free TiW/Cu{sub 2}O/Cu memristive devices

    Energy Technology Data Exchange (ETDEWEB)

    Yan, P.; Li, Y.; Hui, Y. J.; Zhong, S. J.; Zhou, Y. X.; Xu, L.; Liu, N.; Qian, H.; Sun, H. J., E-mail: shj@mail.hust.edu.cn; Miao, X. S. [Wuhan National Laboratory for Optoelectronics (WNLO), Huazhong University of Science and Technology (HUST), Wuhan 430074 (China); School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074 (China)

    2015-08-24

    P-type Cu{sub 2}O is a promising CMOS-compatible candidate to fabricate memristive devices for next-generation memory, logic and neuromorphic computing. In this letter, the microscopic switching and conducting mechanisms in TiW/Cu{sub 2}O/Cu memristive devices have been thoroughly investigated. The bipolar resistive switching behaviors without an electro-forming process are ascribed to the formation and rupture of the conducting filaments composed of copper vacancies. In the low resistive state, the transport of electrons in the filaments follows Mott's variable range hopping theory. When the devices switch back to high resistive state, the coexistence of Schottky emission at the Cu/Cu{sub 2}O interface and electron hopping between the residual filaments is found to dominate the conducting process. Our results will contribute to the further understanding and optimization of p-type memristive materials.

  5. Wrinkle-Free Single-Crystal Graphene Wafer Grown on Strain-Engineered Substrates.

    Science.gov (United States)

    Deng, Bing; Pang, Zhenqian; Chen, Shulin; Li, Xin; Meng, Caixia; Li, Jiayu; Liu, Mengxi; Wu, Juanxia; Qi, Yue; Dang, Wenhui; Yang, Hao; Zhang, Yanfeng; Zhang, Jin; Kang, Ning; Xu, Hongqi; Fu, Qiang; Qiu, Xiaohui; Gao, Peng; Wei, Yujie; Liu, Zhongfan; Peng, Hailin

    2017-12-26

    Wrinkles are ubiquitous for graphene films grown on various substrates by chemical vapor deposition at high temperature due to the strain induced by thermal mismatch between the graphene and substrates, which greatly degrades the extraordinary properties of graphene. Here we show that the wrinkle formation of graphene grown on Cu substrates is strongly dependent on the crystallographic orientations. Wrinkle-free single-crystal graphene was grown on a wafer-scale twin-boundary-free single-crystal Cu(111) thin film fabricated on sapphire substrate through strain engineering. The wrinkle-free feature of graphene originated from the relatively small thermal expansion of the Cu(111) thin film substrate and the relatively strong interfacial coupling between Cu(111) and graphene, based on the strain analyses as well as molecular dynamics simulations. Moreover, we demonstrated the transfer of an ultraflat graphene film onto target substrates from the reusable single-crystal Cu(111)/sapphire growth substrate. The wrinkle-free graphene shows enhanced electrical mobility compared to graphene with wrinkles.

  6. A-site ordered perovskite CaCu3Cu2Ir2O12−δ with square-planar and octahedral coordinated Cu ions

    International Nuclear Information System (INIS)

    Zhao Qing; Wang Qing-Tao; Yin Yun-Yu; Dai Jian-Hong; Shen Xi; Yang Jun-Ye; Yu Ri-Cheng; Long You-Wen; Hu Zhi-Wei; Li Xiao-Dong

    2016-01-01

    A novel CaCu 3 Cu 2 Ir 2 O 12−δ polycrystalline sample was synthesized at 8 GPa and 1373 K. Rietveld structural analysis shows that this compound crystallizes in an -type A-site ordered perovskite structure with space group Im-3. X-ray absorption spectra reveal a +2-charge state for both the square-planar and octahedral coordinated Cu ions, and the valence state of Ir is found to be about +5. Although the A-site Ca and the A′-site Cu 2+ are 1:3 ordered at fixed atomic positions, the distribution of B-site Cu 2+ and Ir 5+ is disorderly. As a result, no long-range magnetic ordering is observed at temperatures down to 2 K. Electrical transport and heat capacity measurements demonstrate itinerant electronic behavior. The crystal structure is stable with pressure up to 35.7 GPa at room temperature. (paper)

  7. Origin of nondetectable x-ray diffraction peaks in nanocomposite CuTiZr alloys

    DEFF Research Database (Denmark)

    Jiang, Jianzhong; Kato, H.; Ohsuna, T.

    2003-01-01

    Microscopic structures of Cu60Ti10+xZr30-x (x=0 and 10) alloys have been investigated by transmission electron microscopy, x-ray diffraction (XRD) and differential scanning calorimeter (DSC). In the Cu60Ti10Zr30 samples annealed at 708 K for times ranging from 0 to 130 min, where the enthalpy...... of the first exothermic peak decreases by 80%, the corresponding XRD patterns still look similar to that for the as-prepared sample. However, the simulated XRD patterns for the pure Cu51Zr14 phase, which is the crystalline phase formed during the first exothermic reaction, with small grain sizes and defects...... clearly show a broadened amorphous-like feature. This might be the reason that no diffraction peaks from the nanocrystalline component were detected in the XRD patterns recorded for the as-cast or as-spun Cu60Ti10+xZr30-x (x=0 and 10) alloys and for the alloys annealed at lower temperatures, in which...

  8. The interaction between dietary Fe, Cu and stress in Cu-67 retention and serum ceruloplasmin (Cp) activity in rats

    International Nuclear Information System (INIS)

    Pellett, L.; Kattelmann, K.; Zinn, K.; Trokey, D.; Forrester, I.; Gordon, D.T.

    1991-01-01

    The objectives of the study were to determine the effects of dietary Fe and stress on Cu-67 retention and serum Cp activity in the rat. A 2 x 2 x 2 factorial arrangement of treatments was utilized. Male Sprague Dawley weanling rats were fed AIN-76 diets ad lib containing 0.8 ppm Cu (CuD) or 5.7 ppm Cu (CuA) with 22.5 ppm Fe (FeA) or 280 ppm Fe (FeE). After 19 days, one-half of the animals of each treatment were stressed by an intramuscular injection of 0.1 ml turpentine/100 gm body weight. Forty-eight hours later, animals were gavaged with Cu-67 and counted over a 7 day period in a whole body high resolution gamma counter. Cu-67 retention was 20% higher in CuD rats compared to CuA rats. There were no significant effects caused by Fe or stress or the interaction between these variables on Cu-67 retention. In rats fed FeE-CuA diets, serum Cp activity was significantly depressed compared to rats fed FeA-CuA diets. These reductions in the acute phase protein Cp, were 85% and 70% in nonstressed and stressed rats, respectively. The results of this study suggest that the negative interaction effects of excess Fe on Cu utilization does not occur at the site of Cu absorption, but within the body and specifically in the liver

  9. Exploring Cu2O/Cu cermet as a partially inert anode to produce aluminum in a sustainable way

    International Nuclear Information System (INIS)

    Feng, Li-Chao; Xie, Ning; Shao, Wen-Zhu; Zhen, Liang; Ivanov, V.V.

    2014-01-01

    Highlights: • Cu 2 O/Cu cermet was used as a candidate partially inert anode material to produce aluminum alloys. • The thermal corrosion behavior of Cu 2 O/Cu was investigated in molten salt at 960 °C. • The corrosion rate is largely governed by the geometrical structures of Cu in the prepared samples. • The corrosion rate increases with decreasing sizes and increasing filling contents of Cu phase. • The corrosion rate was 1.8–9 cm/y and the Cu contents is less than 6.2 wt.% in the produced aluminum. - Abstract: As an energy-intensive process, aluminum production by the Hall–Héroult method accounts for significant emissions of CO 2 and some toxic greenhouse gases. The utilization of an inert anode in place of a carbon anode was considered as a revolutionary technique to solve most of the current environmental problems resulting from the Hall–Héroult process. However, the critical property requirements of the inert anode materials significantly limit the application of this technology. In light of the higher demand for aluminum alloys than for pure aluminum, a partially inert anode was designed to produce aluminum alloys in a more sustainable way. Here, Cu 2 O/Cu cermet was chosen as the material of interest. The thermal corrosion behavior of Cu 2 O/Cu was investigated in Na 3 AlF 6 –CaF 2 –Al 2 O 3 electrolyte at 960 °C to elucidate the corrosion mechanisms of this type of partially inert anode for the production of aluminum or aluminum alloys. Furthermore, the effects of the geometrical structure of the Cu phase on the thermal corrosion behavior of Cu 2 O/Cu cermet in the electrolyte were investigated as well. The thermal corrosion rate was evaluated by the weight loss method and the results show that the samples prepared with branch-like Cu have higher thermal corrosion rate than those prepared with spherical Cu, and the corrosion rate increases with decreasing size and increasing filling content of Cu phase. The calculated corrosion rate

  10. Effects of the molecule-electrode interface on the low-bias conductance of Cu-H2-Cu single-molecule junctions.

    Science.gov (United States)

    Jiang, Zhuoling; Wang, Hao; Shen, Ziyong; Sanvito, Stefano; Hou, Shimin

    2016-07-28

    The atomic structure and electronic transport properties of a single hydrogen molecule connected to both symmetric and asymmetric Cu electrodes are investigated by using the non-equilibrium Green's function formalism combined with the density functional theory. Our calculations show that in symmetric Cu-H2-Cu junctions, the low-bias conductance drops rapidly upon stretching, while asymmetric ones present a low-bias conductance spanning the 0.2-0.3 G0 interval for a wide range of electrode separations. This is in good agreement with experiments on Cu atomic contacts in a hydrogen environment. Furthermore, the distribution of the calculated vibrational energies of the two hydrogen atoms in the asymmetric Cu-H2-Cu junction is also consistent with experiments. These findings provide clear evidence for the formation of asymmetric Cu-H2-Cu molecular junctions in breaking Cu atomic contacts in the presence of hydrogen and are also helpful for the design of molecular devices with Cu electrodes.

  11. Organic/inorganic nanocomposites of ZnO/CuO/chitosan with improved properties

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Xingfa, E-mail: xingfamazju@aliyun.com [School of Environmental and Material Engineering, Center of Advanced Functional Materials, Yantai University, Yantai, 264005 (China); State Key Laboratory of Silicon Materials, Zhejiang University, Hangzhou, 310027 (China); Zhang, Bo; Cong, Qin; He, Xiaochun; Gao, Mingjun [School of Environmental and Material Engineering, Center of Advanced Functional Materials, Yantai University, Yantai, 264005 (China); Li, Guang [National Laboratory of Industrial Control Technology, Institute of Cyber-Systems and Control, Zhejiang University, Hangzhou, 310027 (China)

    2016-08-01

    To extend the visible light response of ZnO, ZnO/CuO heterostructured nanocomposite was synthesized by a hydrothermal approach. At the same time, chitosan (Ch) is considered as a very promising natural polymer. It holds not only abundant resource and low cost, but also has excellent adsorption properties to a broad range of organic pollutants and some heavy metal ions. To improve the adsorption properties of ZnO/CuO nanocomposite, ZnO/CuO/chitosan organic-inorganic composites were prepared with precipitation method. The as-prepared nanocomposites were characterized by TEM (Transmission electron microscopy), SAED pattern (Selected Area Electron Diffraction), SEM (scanning electron microscopy), UV–Vis (Ultraviolet–visible spectroscopy), PL (Photoluminescence), XRD (X-ray diffraction), TGA (Thermo Gravimetric Analyzer), Fourier transform infrared spectroscopy spectra (FTIR) et al. To examine the surface and interface properties of nanocomposites, chemical prototype sensor arrays were constructed based on ZnO, ZnO/CuO, ZnO/Cu{sub 2}O, ZnO/CuO/chitosan, ZnO/Cu{sub 2}O/chitosan nanocomposites and QCM (quartz crystal microbalance) arrays devices. The adsorption response behaviors of the sensor arrays to some typical volatile compounds were examined under similar conditions. The results indicated that with comparison to ZnO nanostructure, the ZnO/CuO nanocomposite exhibited enhanced adsorption properties to some typical volatile compounds greatly, and the adsorption properties of ZnO/CuO/chitosan are much better than that of ZnO/CuO nanocomposite. The adsorption of ZnO/CuO system is super to that of ZnO/Cu{sub 2}O. Therefore, ZnO/CuO/chitosan nanocomposite not only showed broadening visible light response, but also possessed of excellent adsorption properties, and has good potential applications in photocatalysts, chemical sensors, biosensors, self-cleaning coating fields et al. - Highlights: • ZnO/CuO nanocomposites exhibited good response in near whole visible

  12. Effects of CuO nanoparticles on Lemna minor.

    Science.gov (United States)

    Song, Guanling; Hou, Wenhua; Gao, Yuan; Wang, Yan; Lin, Lin; Zhang, Zhiwei; Niu, Qiang; Ma, Rulin; Mu, Lati; Wang, Haixia

    2016-12-01

    Copper dioxide nanoparticles (NPs), which is a kind of important and widely used metal oxide NP, eventually reaches a water body through wastewater and urban runoff. Ecotoxicological studies of this kind of NPs effects on hydrophyte are very limited at present. Lemna minor was exposed to media with different concentrations of CuO NPs, bulk CuO, and two times concentration of Cu 2+ released from CuO NPs in culture media. The changes in plant growth, chlorophyll content, antioxidant defense enzyme activities [i.e., peroxidase (POD), catalase (CAT), superoxide dismutase (SOD) activities], and malondialdehyde (MDA) content were measured in the present study. The particle size of CuO NPs and the zeta potential of CuO NPs and bulk CuO in the culture media were also analyzed to complementally evaluate their toxicity on duckweed. Results showed that CuO NPs inhibited the plant growth at lower concentration than bulk CuO. L. minor roots were easily broken in CuO NPs media under the experimental condition, and the inhibition occurred only partly because CuO NPs released Cu 2+ in the culture media. The POD, SOD, and CAT activities of L. minor increased when the plants were exposed to CuO NPs, bulk CuO NPs and two times the concentration of Cu 2+ released from CuO NPs in culture media, but the increase of these enzymes were the highest in CuO NPs media among the three kinds of materials. The MDA content was significantly increased compared with that of the control from 50 mg L -1 CuO NP concentration in culture media. CuO NPs has more toxicity on L. minor compared with that of bulk CuO, and the inhibition occurred only partly because released Cu 2+ in the culture media. The plant accumulated more reactive oxygen species in the CuO NP media than in the same concentration of bulk CuO. The plant cell encountered serious damage when the CuO NP concentration reached 50 mg L -1 in culture media. The toxicology of CuO NP on hydrophytes must be considered because that hydrophytes

  13. Rapid thermal annealing of FePt and FePt/Cu thin films

    Energy Technology Data Exchange (ETDEWEB)

    Brombacher, Christoph

    2011-01-10

    Chemically ordered FePt is one of the most promising materials to reach the ultimate limitations in storage density of future magnetic recording devices due to its high uniaxial magnetocrystalline anisotropy and a corrosion resistance superior to rare-earth based magnets. In this study, FePt and FePt/Cu bilayers have been sputter deposited at room temperature onto thermally oxidized silicon wafers, glass substrates and self-assembled arrays of spherical SiO{sub 2} particles with diameters down to 10 nm. Millisecond flash lamp annealing, as well as conventional rapid thermal annealing was employed to induce the phase transformation from the chemically disordered A1 phase into the chemically ordered L1{sub 0} phase. The influence of the annealing temperature, annealing time and the film thickness on the ordering transformation and (001) texture evolution of FePt films with near equiatomic composition was studied. Whereas flash lamp annealed FePt films exhibit a polycrystalline morphology with high chemical L1{sub 0} order, rapid thermal annealing can lead to the formation of chemically ordered FePt films with (001) texture on amorphous SiO{sub 2}/Si substrates. The resultant high perpendicular magnetic anisotropy and large coercivities up to 40 kOe are demonstrated. Simultaneously to the ordering transformation, rapid thermal annealing to temperatures exceeding 600 C leads to a break up of the continuous FePt film into separated islands. This dewetting behavior was utilized to create regular arrays of FePt nanostructures on SiO{sub 2} particle templates with periods down to 50 nm. The addition of Cu improves the (001) texture formation and chemical ordering for annealing temperatures T{sub a} {<=}600 C. In addition, the magnetic anisotropy and the coercivity of the ternary FePtCu alloy can be effectively tailored by adjusting the Cu content. The prospects of FePtCu based exchange spring media, as well as the magnetic properties of FePtCu nanostructures fabricated

  14. Defect properties of CuCrO2: A density functional theory calculation

    International Nuclear Information System (INIS)

    Fang Zhi-Jie; Zhu Ji-Zhen; Zhou Jiang; Mo Man

    2012-01-01

    Using the first-principles methods, we study the formation energetics properties of intrinsic defects, and the charge doping properties of extrinsic defects in transparent conducting oxides CuCrO 2 . Intrinsic defects, some typical acceptor-type, and donor-type extrinsic defects in their relevant charge state are considered. By systematically calculating the formation energies and transition energy, the results of calculation show that, V Cu , O i , and O Cu are the relevant intrinsic defects in CuCrO 2 ; among these intrinsic defects, V Cu is the most efficient acceptor in CuCrO 2 . It is found that all the donor-type extrinsic defects have difficulty in inducing n-conductivity in CuCrO 2 because of their deep transition energy level. For all the acceptor-type extrinsic defects, substituting Mg for Cr is the most prominent doping acceptor with relative shallow transition energy levels in CuCrO 2 . Our calculation results are expected to be a guide for preparing promising n-type and p-type materials in CuCrO 2 . (condensed matter: electronic structure, electrical, magnetic, and optical properties)

  15. NiTiCu/AlN/NiTiCu shape memory thin film heterostructures for vibration damping in MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Kaur, Navjot; Kaur, Davinder, E-mail: dkaurfph@iitr.ernet.in

    2014-03-25

    Highlights: • Fabrication of NiTiCu/AlN/NiTiCu heterostructure using dc/rf magnetron sputtering. • Exhibits highest hardness (38 GPa) and elastic modulus (187 GPa). • Enhanced dissipation of mechanical energy (E{sub d} = 5.7 N J). • High damping capacity (0.052) and figure of merit (∼0.62). • Can be applied for vibration damping in MEMS. -- Abstract: Shape memory alloy (NiTiCu) thin films coupled with piezoelectric AlN layer produce an intelligent material for vibration damping. In the present study pure NiTiCu, NiTiCu/AlN and NiTiCu/AlN/NiTiCu heterostructures have been deposited on Si substrate using magnetron sputtering technique. By the use of the interfaces and shape memory effect provided by NiTiCu layers, the damping capacity can be increased along with increase in stiffness and mechanical hardness. The heterostructures were characterized in terms of structural, electrical, morphological and mechanical properties by X-ray diffraction (XRD), four probe resistivity method, atomic force microscopy, field emission scanning electron microscopy, and nanoindentation. The NiTiCu/AlN/NiTiCu heterostructure exhibit enhanced mechanical and damping properties as compared to NiTiCu/AlN and pure NiTiCu. This enhancement in hardness and damping of the heterostructure could be attributed to the shape memory effect of NiTiCu, intrinsic piezoelectricity of AlN and increased number of interfaces in heterostructure that help in dissipation of mechanical vibrations. The findings of this work provide additional impetus for the application of these heterostructures in emerging fields of nanotechnology and microelectro mechanical (MEMS) devices.

  16. NiTiCu/AlN/NiTiCu shape memory thin film heterostructures for vibration damping in MEMS

    International Nuclear Information System (INIS)

    Kaur, Navjot; Kaur, Davinder

    2014-01-01

    Highlights: • Fabrication of NiTiCu/AlN/NiTiCu heterostructure using dc/rf magnetron sputtering. • Exhibits highest hardness (38 GPa) and elastic modulus (187 GPa). • Enhanced dissipation of mechanical energy (E d = 5.7 N J). • High damping capacity (0.052) and figure of merit (∼0.62). • Can be applied for vibration damping in MEMS. -- Abstract: Shape memory alloy (NiTiCu) thin films coupled with piezoelectric AlN layer produce an intelligent material for vibration damping. In the present study pure NiTiCu, NiTiCu/AlN and NiTiCu/AlN/NiTiCu heterostructures have been deposited on Si substrate using magnetron sputtering technique. By the use of the interfaces and shape memory effect provided by NiTiCu layers, the damping capacity can be increased along with increase in stiffness and mechanical hardness. The heterostructures were characterized in terms of structural, electrical, morphological and mechanical properties by X-ray diffraction (XRD), four probe resistivity method, atomic force microscopy, field emission scanning electron microscopy, and nanoindentation. The NiTiCu/AlN/NiTiCu heterostructure exhibit enhanced mechanical and damping properties as compared to NiTiCu/AlN and pure NiTiCu. This enhancement in hardness and damping of the heterostructure could be attributed to the shape memory effect of NiTiCu, intrinsic piezoelectricity of AlN and increased number of interfaces in heterostructure that help in dissipation of mechanical vibrations. The findings of this work provide additional impetus for the application of these heterostructures in emerging fields of nanotechnology and microelectro mechanical (MEMS) devices

  17. Synthesis and characterization of hollow spherical copper phosphide (Cu 3P) nanopowders

    Science.gov (United States)

    Liu, Shuling; Qian, Yitai; Xu, Liqiang

    2009-03-01

    In this paper, hollow spherical Cu 3P nanopowders were synthesized by using copper sulfate pentahydrate (CuSO 4ṡ5H 2O) and yellow phosphorus in a mixed solvent of glycol, ethanol and water at 140-180 ∘C for 12 h. X-ray powder diffraction (XRD), energy dispersive X-ray spectroscopy (EDX), electron diffraction pattern (ED) and transmission electronic microscopy (TEM) studies show that the as-synthesized nanocrystal is pure hexagonal phase Cu 3P with a hollow spherical morphology. Based on the TEM observations, a possible aggregation growth mechanism was proposed for the formation of Cu 3P hollow structures. Meanwhile, the effects of some key factors such as solvents, reaction temperature and reaction time on the final formation of the Cu 3P hollow structure were also discussed.

  18. Long-Lived Termite Queens Exhibit High Cu/Zn-Superoxide Dismutase Activity

    Directory of Open Access Journals (Sweden)

    Eisuke Tasaki

    2018-01-01

    Full Text Available In most organisms, superoxide dismutases (SODs are among the most effective antioxidant enzymes that regulate the reactive oxygen species (ROS generated by oxidative energy metabolism. ROS are considered main proximate causes of aging. However, it remains unclear if SOD activities are associated with organismal longevity. The queens of eusocial insects, such as termites, ants, and honeybees, exhibit extraordinary longevity in comparison with the nonreproductive castes, such as workers. Therefore, the queens are promising candidates to study the underlying mechanisms of aging. Here, we found that queens have higher Cu/Zn-SOD activity than nonreproductive individuals of the termite Reticulitermes speratus. We identified three Cu/Zn-SOD sequences and one Mn-SOD sequence by RNA sequencing in R. speratus. Although the queens showed higher Cu/Zn-SOD activity than the nonreproductive individuals, there were no differences in their expression levels of the Cu/Zn-SOD genes RsSOD1 and RsSOD3A. Copper (Cu2+ and Cu+ is an essential cofactor for Cu/Zn-SOD enzyme activity, and the queens had higher concentrations of copper than the workers. These results suggest that the high Cu/Zn-SOD activity of termite queens is related to their high levels of the cofactor rather than gene expression. This study highlights that Cu/Zn-SOD activity contributes to extraordinary longevity in termites.

  19. Measurements of low photon doses using LiF:Mg,Cu,P and CaF{sub 2}:Cu dosimeters

    Energy Technology Data Exchange (ETDEWEB)

    Prokert, K [Dresden Univ. of Technology (Germany). Inst. of Radiation Protection Physics; Mann, G [Dresden Univ. of Technology (Germany). Inst. of Radiation Protection Physics

    1997-03-01

    The new thermoluminophors LiF:Mg, Cu, P and CaF{sub 2}:Cu in form of pellets exhibit a significantly higher TL-response than the well-known dosimeters of the types TLD-100 (LiF:Mg, Ti), TLD-400 (CaF{sub 2}:Mn), TLD-900 (CaSO{sub 4}:Dy), etc. Furthermore, the thermoluminophor LiF:Mg, Cu, P shows besides its high sensitivity a good tissue equivalence and therefore, only a small variation of the dose response with the photon energy. The lower limits of detection of these new materials are about 5 {mu}Gy and 0.2 {mu}Gy resp. Therefore, short term measurements of absorbed dose can be realised in radiation fields at very low dose rates (environmental radiation, scattering radiation at medical equipment`s etc.) with an accuracy of {+-}10%. In the field of environmental monitoring the period of exposure can be limited to about 10 days. Using CaF{sub 2}:Cu detectors an exposure of 24 hours is sufficient for dose measurements with lower accuracy. The reusability of CaF{sub 2}:Cu pellets is guaranteed without loss of sensitivity independently of the application of different reading and annealing procedures. In the case of LiF:Mg, Cu, P detectors special procedures are needed in order to keep constant TL-properties. The results of dose measurements at low dose levels in different radiation fields demonstrate the advantages of these detector types. (orig.)

  20. Recycled hierarchical tripod-like CuCl from Cu-PCB waste etchant for lithium ion battery anode

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Song [Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093 China (China); Hou, Hongying, E-mail: hongyinghou@kmust.edu.cn [Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093 China (China); Liu, Xianxi [Faculty of Mechanical and Electronic Engineering, Kunming University of Science and Technology, Kunming 650093 China (China); Duan, Jixiang; Yao, Yuan; Liao, Qishu; Li, Jing; Yang, Yunzhen [Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093 China (China)

    2017-02-15

    Highlights: • High EVA CuCl was recycled with 85% recovery from Cu-PCB waste etchant. • The recycled CuCl displayed a hierarchical tripod-like morphology. • The evolution mechanism of the recycled hierarchical CuCl crystal was proposed. • The corresponding discharge capacity in LIB was 201.4 mAh/g after 100 cycles. • The results shed a new light on resource recovery and environmental protection. - Abstract: Hierarchical CuCl with high economic value added (EVA) was successfully recycled with 85% recovery from the acid Cu printed circuit board (Cu-PCB) waste etchant via facile liquid chemical reduction. The micro-structure and morphology of the recycled hierarchical CuCl were systematically characterized in terms of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD), transmission electron microscopy (TEM) and Brunauer-Emmett-Teller (BET). Furthermore, the corresponding electrochemical performances as lithium ion battery (LIB) anode were also investigated in terms of galvanostatic charge/discharge, cyclic voltammetry (CV) and AC impedance. As expected, the recycled CuCl displayed a hierarchical tripod-like structure and large specific surface area of 21.2 m{sup 2}/g. As the anode in LIB, the reversible discharge capacity was about 201.4 mAh/g even after 100 cycles, implying the satisfactory cycle performance. Clearly, the satisfactory results may open a new avenue to develop the sustainable industry, which is very important in terms of both the resource recovery and the environmental protection.

  1. Electrochemical preparation of uniform CuO/Cu2O heterojunction on β-cyclodextrin-modified carbon fibers

    KAUST Repository

    Chen, Fang-Ping

    2016-01-18

    Abstract: In this work, a uniform heterojunction of cupric oxide/cuprous oxide was decorated on the surface of carbon fibers by electrochemical method (CuO/Cu2O/CDs/CFs). Methyl-β-cyclodextrin was first grafted on the surface of carbon fibers (CDs/CFs). Cubic cuprous oxide was electrodeposited on the surface of (Cu2O/CDs/CFs) in 0.1 M KNO3, the cuprous oxide was then partly anodized to cupric oxide to form a heterojunction of cupric oxide/cuprous oxide with a burr shape (CuO/Cu2O/CDs/CFs). The obtained materials were characterized by field emission scanning electron microscopy, X-ray diffraction, Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, and electrochemical techniques. The potential application in pollution treatment was further investigated, and the prepared CuO/Cu2O/CDs/CFs could be a promising adsorbent/photocatalyst toward the uptake and degradation of 2, 6-dichlorophenol (2, 6-DCP). Graphical Abstract: [Figure not available: see fulltext.] © 2016 Springer Science+Business Media Dordrecht

  2. Computer simulations of nanoindentation in Mg-Cu and Cu-Zr metallic glasses

    DEFF Research Database (Denmark)

    Paduraru, Anca; Andersen, Ulrik Grønbjerg; Thyssen, Anders

    2010-01-01

    The formation of shear bands during plastic deformation of Cu0.50Zr0.50 and Mg0.85Cu0.15 metallic glasses is studied using atomic-scale computer simulations. The atomic interactions are described using realistic many-body potentials within the effective medium theory, and are compared with similar...... simulations using a Lennard-Jones description of the material. The metallic glasses are deformed both in simple shear and in a simulated nanoindentation experiment. Plastic shear localizes into shear bands with a width of approximately 5 nm in CuZr and 8 nm in MgCu. In simple shear, the shear band formation...... is very clear, whereas only incipient shear bands are seen in nanoindentation. The shear band formation during nanoindentation is sensitive to the indentation velocity, indenter radius and the cooling rate during the formation of the metallic glass. For comparison, a similar nanoindentation simulation...

  3. Formation and evolution of nanoporous bimetallic Ag-Cu alloy by electrochemically dealloying Mg-(Ag-Cu)-Y metallic glass

    International Nuclear Information System (INIS)

    Li, Ran; Wu, Na; Liu, Jijuan; Jin, Yu; Chen, Xiao-Bo; Zhang, Tao

    2017-01-01

    Highlights: • Uniform nanoporous Ag-Cu alloy was fabricated by dealloying Mg-based metallic glass. • The nanoporous structure was built up with numerous Ag-Cu ligaments. • The nanoporous ligaments show two-stage coarsening behavior with dealloying time. • The formation and evolution mechanisms of the nanoporous structure were clarified. • It could provide new guidance to the synthesis of nanoporous multi-component alloys. - Abstract: A three-dimensional nanoporous bimetallic Ag-Cu alloy with uniform chemical composition has been fabricated by dealloying Mg_6_5Ag_1_2_._5Cu_1_2_._5Y_1_0 metallic glass in dilute (0.04 M) H_2SO_4 aqueous solution under free-corrosion conditions. The nanoporous Ag-Cu evolves through two distinct stages. First, ligaments of the nanoporous structure, consisting of supersaturated Ag(Cu) solid solution with a constant Ag/Cu mole ratio of 1:1, are yielded. Second, with excessive immersion, some Cu atoms separate from the metastable nanoporous matrix and form spherical Cu particles on the sample surface. Formation and evolution mechanisms of the nanoporous structure are proposed.

  4. Surface studies by low energy ion beams: Cu/Ru(0001) and Cu/O/Ru(0001)

    Energy Technology Data Exchange (ETDEWEB)

    Shen, Y.G.; O`Connor, D.J.; MacDonald, R.J. [Newcastle Univ., NSW (Australia). Dept. of Physics; Wandelt, H. [Institut fur Physikalische und Theoretische Chemie der Universitat Bonn, Bonn (Germany).; Zee, H. van [Eindhoven University of Technology, Eindhoven (Netherlands) Dept. of Physics

    1993-12-31

    The surface structure of Cu on Ru(OOO1) has been studied by low energy Li{sup +} ion scattering. It was found that Cu forms pseudomorphic islands for two layers. The effects of Cu on an O-precovered RU(OOO1) surface has also been investigated using keV He{sup +} ions. The results show that during the deposition of Cu, O is displaced from the Ru surface and migrated onto the top of the surface of the growing overlayer. The floated out O has been tested, showing a disordered overlayer. 5 refs., 3 figs.

  5. Surface studies by low energy ion beams: Cu/Ru(0001) and Cu/O/Ru(0001)

    Energy Technology Data Exchange (ETDEWEB)

    Shen, Y G; O` Connor, D J; MacDonald, R J [Newcastle Univ., NSW (Australia). Dept. of Physics; Wandelt, H [Institut fur Physikalische und Theoretische Chemie der Universitat Bonn, Bonn (Germany).; Zee, H van [Eindhoven University of Technology, Eindhoven (Netherlands) Dept. of Physics

    1994-12-31

    The surface structure of Cu on Ru(OOO1) has been studied by low energy Li{sup +} ion scattering. It was found that Cu forms pseudomorphic islands for two layers. The effects of Cu on an O-precovered RU(OOO1) surface has also been investigated using keV He{sup +} ions. The results show that during the deposition of Cu, O is displaced from the Ru surface and migrated onto the top of the surface of the growing overlayer. The floated out O has been tested, showing a disordered overlayer. 5 refs., 3 figs.

  6. Toxic effects of Cu2+ on growth, nutrition, root morphology, and distribution of Cu in roots of Sabi grass

    International Nuclear Information System (INIS)

    Kopittke, P.M.; Asher, C.J.; Blamey, F.P.C.; Menzies, N.W.

    2009-01-01

    Sabi grass (Urochloa mosambicensis (Hack.) Dandy) (a C4 species of Poaceae) is commonly used to revegetate disturbed sites in low-rainfall environments, but comparatively little is known regarding copper (Cu) toxicity in this species. A dilute nutrient solution culture experiment was conducted for 10 d to examine the effects of elevated Cu 2+ activities ({Cu 2+ }) on the growth of Sabi grass. Growth was inhibited by high Cu in solution, with a 50% reduction in the relative fresh mass occurring at 1.0 μM {Cu 2+ } for the roots and 1.2 μM {Cu 2+ } for the shoots. In solutions containing 1.2-1.9 μM {Cu 2+ }, many of the roots ruptured due to the tearing and separation of the rhizodermis and outer cortex from the underlying tissues. Transmission electron microscopy revealed that Cu-rich deposits were found to accumulate predominantly within vacuoles. Due to limited translocation of Cu from the roots to the shoots, phytotoxicity is likely to be more of a problem in remediation of Cu-toxic sites than is Cu toxicity of fauna consuming the above-ground biomass.

  7. Development of Cu-Hf-Al ternary systems and tungsten wire/particle reinforced Cu48Hf43Al9 bulk metallic glass composites for strengthening

    International Nuclear Information System (INIS)

    Park, Joyoung; An, Jihye; Choi-Yim, Haein

    2010-01-01

    Stable bulk glass forming alloys can be developed over a wide range of compositions in Cu-Hf-Al ternary systems starting from the Cu 49 Hf 42 Al 9 bulk metallic glass. Ternary Cu-Hf-Al alloys can be cast directly from the melt into copper molds to form fully amorphous strips with thicknesses of 1 to 6 mm. The maximum critical diameter of the new Cu-Hf-Al ternary alloy was 6 mm. X-ray diffraction patterns were used to confirm the amorphous nature of the ternary Cu-Hf-Al alloys. To increase the toughness of these metallic glasses, we reinforced the Cu 48 Hf 43 Al 9 bulk metallic glass-forming liquid with a 50% volume fraction of tungsten particles and an 80% volume fraction of tungsten wires with diameters of 242.4 μm. Composites with a critical diameter of 7 mm and length 70 mm were synthesized. The structure of the composites was confirmed by using X-ray diffraction (XRD), and the scanning electron microscopy (SEM). The mechanical properties of the composites were studied in compression tests. The thermal stability and the crystallization processes of the Cu-Hf-Al alloys and composites were investigated by using differential scanning calorimetry (DSC). Values of the glass transition temperature (T g ), the crystallization temperature (T x ), and the supercooled liquid region (ΔT = T x - T g ) are given in this paper.

  8. Determination of the some electronic parameters of nanostructure copper selenide and Cu/Cu3Se2/n-GaAs/In structure

    International Nuclear Information System (INIS)

    Güzeldir, B.; Sağlam, M.; Ateş, A.; Türüt, A.

    2015-01-01

    Highlights: • Introducing to a new degree of freedom in the control of effective barrier height by using Cu. • We want to experimentally observe whether or not the diode continues the ideality in the temperature range of 60–400 K. • We have modified the Richardson’s plot using the temperature dependent values of effective area of the patches. - Abstract: The nanostructure copper selenide thin film has been grown on n-type gallium arsenide substrate by Successive Ionic Layer Adsorption and Reaction (SILAR) method. The film has been characterized by X-ray Diffraction (XRD), Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM) measurements. X-ray diffraction analysis of the film confirms a polycrystalline with preferred orientation. The AFM and SEM micrographs of the film reveal smooth and uniform surface pattern without any dark pits, pinholes and microcracks. The Cu/Cu 3 Se 2 /n-GaAs/In structure has been thermally formed in evaporating system after the SILAR process. The electrical analysis of Cu/Cu 3 Se 2 /n-GaAs/In structure has been investigated by means of current–voltage (I–V) measurements in the temperature range of 60–400 K in dark conditions. The values of barrier height (BH) and ideality factor (n) ranged from 0.21 eV and 4.97 (60 K) to 0.83 eV and 1.14 (400 K), respectively. In the calculations, the electrical parameters of the experimental forward bias I–V characteristics of the Cu/Cu 3 Se 2 /n-GaAs/In with the homogeneity in the 60–400 K range have been explained by means of the thermionic emission (TE), considering Gaussian distribution (GD) of BH with linear bias dependence

  9. Nuclear hyperfine structure of muonium in CuCl resolved by means of avoided level crossing

    International Nuclear Information System (INIS)

    Schneider, J.W.; Celio, M.; Keller, H.; Kuendig, W.; Odermatt, W.; Puempin, B.; Savic, I.M.; Simmler, H.; Estle, T.L.; Schwab, C.; Kiefl, R.F.; Renker, D.

    1990-01-01

    We report detailed avoided-level-crossing spectra of a muonium center (Mu II ) in single-crystal CuCl in a magnetic field range of 4--5 T and at a temperature of 100 K. The hyperfine parameters of the muon and the closest two shells of nuclei indicate that this center consists of muonium at a tetrahedral interstice with four Cu nearest neighbors and six Cl next-nearest neighbors and that the spin density is appreciable on the muon and on the ten neighboring nuclei but negligible elsewhere

  10. Enhancement of oxidation resistance in Cu and Cu(Al) thin layers

    International Nuclear Information System (INIS)

    Horvath, Z.E.; Peto, G.; Paszti, Z.; Zsoldos, E.; Szilagyi, E.; Battistig, G.; Lohner, T.; Molnar, G.L.; Gyulai, J.

    1999-01-01

    High conductivity and good resistance to electromigration makes copper a promising interconnect material in microelectronics. However, one of its disadvantages is the poor corrosion resistance. Two methods of passivation are investigated and compared: Al alloying and BF 2 + ion implantation. X-ray diffraction (XRD) and Rutherford Backscattering Spectrometry (RBS) show the oxidation inhibition of both methods, but the different ratio of CuO 2 to CuO phases suggests different mechanisms of passivation. There are no definite oxide lines in the XRD spectrum of the implanted and annealed Cu(Al) sample, so the presence of Al and the implantation together give increased protection against oxidation. The difference between the two mechanisms of oxidation inhibition is discussed briefly

  11. Time-dependent of characteristics of Cu/CuS/n-GaAs/In structure produced by SILAR method

    Energy Technology Data Exchange (ETDEWEB)

    Sağlam, M.; Güzeldir, B., E-mail: msaglam@atauni.edu.tr

    2016-09-15

    Highlights: • The CuS thin film used at Cu/n-GaAs structure is grown by SILAR method. • There has been no report on ageing of characteristics of this junction in the literature. • The properties of Cu/CuS/n-GaAs/In structure are examined with different methods. • It has been shown that Cu/CuS/n-GaAs/In structure has a stable interface. - Abstract: The aim of this study is to explain effects of the ageing on the electrical properties of Cu/n-GaAs Shottky barrier diode with Copper Sulphide (CuS) interfacial layer. CuS thin films are deposited on n-type GaAs substrate by Successive Ionic Layer Adsorption and Reaction (SILAR) method at room temperature. The structural and the morphological properties of the films have been carried out by Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD) techniques. The XRD analysis of as-grown films showed the single-phase covellite, with hexagonal crystal structure built around two preferred orientations corresponding to (102) and (108) atomic planes. The ageing effects on the electrical properties of Cu/CuS/n-GaAs/In structure have been investigated. The current–voltage (I–V) measurements at room temperature have been carried out to study the change in electrical characteristics of the devices as a function of ageing time. The main electrical parameters, such as ideality factor (n), barrier height (Φ{sub b}), series resistance (R{sub s}), leakage current (I{sub 0}), and interface states (N{sub ss}) for this structure have been calculated. The results show that the main electrical parameters of device remained virtually unchanged.

  12. Time-dependent of characteristics of Cu/CuS/n-GaAs/In structure produced by SILAR method

    International Nuclear Information System (INIS)

    Sağlam, M.; Güzeldir, B.

    2016-01-01

    Highlights: • The CuS thin film used at Cu/n-GaAs structure is grown by SILAR method. • There has been no report on ageing of characteristics of this junction in the literature. • The properties of Cu/CuS/n-GaAs/In structure are examined with different methods. • It has been shown that Cu/CuS/n-GaAs/In structure has a stable interface. - Abstract: The aim of this study is to explain effects of the ageing on the electrical properties of Cu/n-GaAs Shottky barrier diode with Copper Sulphide (CuS) interfacial layer. CuS thin films are deposited on n-type GaAs substrate by Successive Ionic Layer Adsorption and Reaction (SILAR) method at room temperature. The structural and the morphological properties of the films have been carried out by Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD) techniques. The XRD analysis of as-grown films showed the single-phase covellite, with hexagonal crystal structure built around two preferred orientations corresponding to (102) and (108) atomic planes. The ageing effects on the electrical properties of Cu/CuS/n-GaAs/In structure have been investigated. The current–voltage (I–V) measurements at room temperature have been carried out to study the change in electrical characteristics of the devices as a function of ageing time. The main electrical parameters, such as ideality factor (n), barrier height (Φ_b), series resistance (R_s), leakage current (I_0), and interface states (N_s_s) for this structure have been calculated. The results show that the main electrical parameters of device remained virtually unchanged.

  13. Degradation of contaminants by Cu{sup +}-activated molecular oxygen in aqueous solutions: Evidence for cupryl species (Cu{sup 3+})

    Energy Technology Data Exchange (ETDEWEB)

    Feng, Yong, E-mail: fengy@hku.hk [Department of Civil Engineering, The University of Hong Kong, Pokfulam Road (Hong Kong); Lee, Po-Heng, E-mail: phlee@polyu.edu.hk [Department of Civil and Environmental Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon (Hong Kong); Wu, Deli, E-mail: wudeli@tongji.edu.cn [State Key Laboratory of Pollution Control and Resources Reuse, School of Environmental Science & Engineering, Tongji University, Shanghai 200092 (China); Zhou, Zhengyuan, E-mail: zzy247@hku.hk [Department of Civil Engineering, The University of Hong Kong, Pokfulam Road (Hong Kong); Li, Hangkong, E-mail: hangkong@hku.hk [Department of Civil Engineering, The University of Hong Kong, Pokfulam Road (Hong Kong); Shih, Kaimin, E-mail: kshih@hku.hk [Department of Civil Engineering, The University of Hong Kong, Pokfulam Road (Hong Kong)

    2017-06-05

    Highlights: • Sulfadiazine and methylene blue were nearly completely degraded by Cu{sup +}-O{sub 2} oxidation. • Reaction of Cu{sup +} and hydrogen peroxide produced Cu{sup 3+} as the major active species. • 5,5-dimethyl-2-hydroxypyrrolidine-N-oxyl (DMPO-OH) was found in the reaction process. • Benzoic acid and electron paramagnetic resonance are not capable to differentiate Cu{sup 3+} and ·OH. - Abstract: Copper ions (Cu{sup 2+} and Cu{sup +}) have shown potential as Fenton-like activators for the circumneutral removal of organic contaminants from aqueous solutions. However, the major active species (cupryl species (Cu{sup 3+}) versus hydroxyl radical (·OH)) produced during the activation of hydrogen peroxide by Cu{sup +} remain unclear. In this study, Cu{sup +}-O{sub 2} oxidation, in which hydrogen peroxide is produced via the activated decomposition of dissolved molecular oxygen, was used to degrade sulfadiazine, methylene blue, and benzoic acid. The results showed that both sulfadiazine and methylene blue could be efficiently degraded by Cu{sup +}-O{sub 2} oxidation in a wide effective pH range from 2.0 to 10.0. Quenching experiments with different alcohols and the effect of Br{sup −} suggested that Cu{sup 3+} rather than ·OH was the major active species. Electron paramagnetic resonance detected 5,5-dimethyl-2-hydroxypyrrolidine-N-oxyl (DMPO-OH), which was probably produced by the oxidation of DMPO by Cu{sup 3+} or ·OH formed as a product of Cu{sup 3+} decomposition. 4-hydroxybenzoic acid was produced during the degradation of benzoic acid by Cu{sup 3+}. The findings of this study may help to explain the inconsistency regarding the dominant active species produced by the interaction of Cu{sup +} and hydrogen peroxide.

  14. Gelsolin-Cu/ZnSOD interaction alters intracellular reactive oxygen species levels to promote cancer cell invasion

    KAUST Repository

    Tochhawng, Lalchhandami

    2016-07-07

    The actin-binding protein, gelsolin, is a well known regulator of cancer cell invasion. However, the mechanisms by which gelsolin promotes invasion are not well established. As reactive oxygen species (ROS) have been shown to promote cancer cell invasion, we investigated on the hypothesis that gelsolin-induced changes in ROS levels may mediate the invasive capacity of colon cancer cells. Herein, we show that increased gelsolin enhances the invasive capacity of colon cancer cells, and this is mediated via gelsolin\\'s effects in elevating intracellular superoxide (O2 .-) levels. We also provide evidence for a novel physical interaction between gelsolin and Cu/ZnSOD, that inhibits the enzymatic activity of Cu/ZnSOD, thereby resulting in a sustained elevation of intracellular O2 .-. Using microarray data of human colorectal cancer tissues from Gene Omnibus, we found that gelsolin gene expression positively correlates with urokinase plasminogen activator (uPA), an important matrix-degrading protease invovled in cancer invasion. Consistent with the in vivo evidence, we show that increased levels of O2 .- induced by gelsolin overexpression triggers the secretion of uPA. We further observed reduction in invasion and intracellular O2 .- levels in colon cancer cells, as a consequence of gelsolin knockdown using two different siRNAs. In these cells, concurrent repression of Cu/ ZnSOD restored intracellular O2 .- levels and rescued invasive capacity. Our study therefore identified gelsolin as a novel regulator of intracellular O2 .- in cancer cells via interacting with Cu/ZnSOD and inhibiting its enzymatic activity. Taken together, these findings provide insight into a novel function of gelsolin in promoting tumor invasion by directly impacting the cellular redox milieu.

  15. Copper Selenidophosphates Cu4P2Se6, Cu4P3Se4, Cu4P4Se3, and CuP2Se, Featuring Zero-, One-, and Two-Dimensional Anions.

    Science.gov (United States)

    Kuhn, Alexander; Schoop, Leslie M; Eger, Roland; Moudrakovski, Igor; Schwarzmüller, Stefan; Duppel, Viola; Kremer, Reinhard K; Oeckler, Oliver; Lotsch, Bettina V

    2016-08-15

    Five new compounds in the Cu/P/Se phase diagram have been synthesized, and their crystal structures have been determined. The crystal structures of these compounds comprise four previously unreported zero-, one-, and two-dimensional selenidophosphate anions containing low-valent phosphorus. In addition to two new modifications of Cu4P2Se6 featuring the well-known hexaselenidohypodiphosphate(IV) ion, there are three copper selenidophosphates with low-valent P: Cu4P3Se4 contains two different new anions, (i) a monomeric (zero-dimensional) selenidophosphate anion [P2Se4](4-) and (ii) a one-dimensional selenidophosphate anion [Formula: see text], which is related to the well-known gray-Se-like [Formula: see text] Zintl anion. Cu4P4Se3 contains one-dimensional [Formula: see text] polyanions, whereas CuP2Se contains the 2D selenidophosphate [Formula: see text] polyanion. It consists of charge-neutral CuP2Se layers separated by a van der Waals gap which is very rare for a Zintl-type phase. Hence, besides black P, CuP2Se constitutes a new possible source of 2D oxidized phosphorus containing layers for intercalation or exfoliation experiments. Additionally, the electronic structures and some fundamental physical properties of the new compounds are reported. All compounds are semiconducting with indirect band gaps of the orders of around 1 eV. The phases reported here add to the structural diversity of chalcogenido phosphates. The structural variety of this family of compounds may translate into a variety of tunable physical properties.

  16. Tailoring oxides of copper-Cu_2O and CuO nanoparticles and evaluation of organic dyes degradation

    International Nuclear Information System (INIS)

    Raghav, Ragini; Aggarwal, Priyanka; Srivastava, Sudha

    2016-01-01

    We report a simple one-pot colloidal synthesis strategy tailoring cuprous or cupric nano-oxides in pure state. NaOH provided alkaline conditions (pH 12.5 -13) for nano-oxides formation, while its concentration regulated the oxidation state of the nano-oxides. The morphological, structural and optical properties of synthesized Cu_2O and CuO nanoparticles were studied by transmission electron microscopy (TEM), X-Ray diffraction (XRD) and UV-vis spectroscopy. Dye degradation capability of CuO and Cu2O nanoparticles was evaluated using four organic dyes - Malachite green, Methylene blue, Methyl orange and Methyl red. The results demonstrate effective degradation of all four dyes employing with almost comparable activity both Cu_2O and CuO nanoparticles.

  17. Charge transport properties of graphene: Effects of Cu-based gate electrode

    Energy Technology Data Exchange (ETDEWEB)

    Tang, Qide [School of Physics and Optoelectronics, Xiangtan University, Xiangtan 411105 (China); Zhang, C. X., E-mail: zhangchunxiao@xtu.edu.cn; Tang, Chao, E-mail: tang-chao@xtu.edu.cn; Zhong, Jianxin [School of Physics and Optoelectronics, Xiangtan University, Xiangtan 411105 (China); Hunan Provincial Key Laboratory of Micro-Nano Energy Materials and Devices, Xiangtan University, Hunan 411105 (China); He, Chaoyu [Hunan Provincial Key Laboratory of Micro-Nano Energy Materials and Devices, Xiangtan University, Hunan 411105 (China)

    2016-07-21

    Using the first-principles nonequilibrium Green's function method, we study effects of Cu and Ni@Cu used as the Cu-based gate electrode on the charge transport of graphene in the field effect transistors (FET). We find that the transmission of graphene decreases with both Cu and Ni@Cu absorbed in the scatter region. Especially, noticeable transmission gaps are present around the Femi level. The transmission gaps are still effective, and considerable cut-off regions are found under the non-equilibrium environment. The Ni@Cu depresses the transmission of graphene more seriously than the Cu and enlarges the transmission gap in armchair direction. The effects on the charge transport are attributed to the redistribution of electronic states of graphene. Both Cu and Ni@Cu induce the localization of states, so as to block the electronic transport. The Ni@Cu transforms the interaction between graphene and gate electrode from the physisorption to the chemisorption, and then induces more localized states, so that the transmission decreases further. Our results suggest that besides being used to impose gate voltage, the Cu-based gate electrode itself will have a considerable effect on the charge transport of graphene and induces noticeable transmission gap in the FET.

  18. Structure and properties of (Sr, Ca)CuO2-BaCuO2 superlattices grown by pulsed laser interval deposition

    NARCIS (Netherlands)

    Koster, Gertjan; Verbist, Karen; Rijnders, Augustinus J.H.M.; Rogalla, Horst; van Tendeloo, Gustaav; Blank, David H.A.

    2001-01-01

    We report on the preparation of CuBa2(SrxCa1¿x)nCun¿1Oy compounds by fabrication of (Ba,Sr,Ca)CuO2 superlattices with pulsed laser deposition (PLD). A technique called interval deposition is used to suppress multi-level or island growth resulting in high-quality superlattice structures. Both, the

  19. Cu-Al alloy formation by thermal annealing of Cu/Al multilayer films deposited by cyclic metal organic chemical vapor deposition

    Science.gov (United States)

    Moon, Hock Key; Yoon, Jaehong; Kim, Hyungjun; Lee, Nae-Eung

    2013-05-01

    One of the most important issues in future Cu-based interconnects is to suppress the resistivity increase in the Cu interconnect line while decreasing the line width below 30 nm. For the purpose of mitigating the resistivity increase in the nanoscale Cu line, alloying Cu with traces of other elements is investigated. The formation of a Cu alloy layer using chemical vapor deposition or electroplating has been rarely studied because of the difficulty in forming Cu alloys with elements such as Al. In this work, Cu-Al alloy films were successfully formed after thermal annealing of Cu/Al multilayers deposited by cyclic metal-organic chemical vapor deposition (C-MOCVD). After the C-MOCVD of Cu/Al multilayers without gas phase reaction between the Cu and Al precursors in the reactor, thermal annealing was used to form Cu-Al alloy films with a small Al content fraction. The resistivity of the alloy films was dependent on the Al precursor delivery time and was lower than that of the aluminum-free Cu film. No presence of intermetallic compounds were detected in the alloy films by X-ray diffraction measurements and transmission electron spectroscopy.

  20. Fundamental absorption edge in CuIn5Se8 and CuGa3Se5 single crystals

    International Nuclear Information System (INIS)

    Leon, M.; Merino, J.M.; Levcenko, S.; Nateprov, A.; Tezlevan, V.; Arushanov, E.; Syrbu, N.N.

    2006-01-01

    Optical absorption spectra of CuIn 5 Se 8 and CuGa 3 Se 5 single crystals have been investigated. The energy gap E g for CuIn 5 Se 8 (CuGa 3 Se 5 ) was found to be varied from 1.27(1.79) to 1.21(1.71) eV in the temperature range between 10 and 300 K. The temperature dependence of E g was studied by means of the Einstein model and the Paessler model. The Einstein temperature {222(267)K}, the Debye temperature {310(380)K}, a dimensionless constant related to the electron-phonon coupling {1.62(2.65)} as well as an effective energy {20 (24) meV} and a cut-off phonon energy {35(39) meV} have been estimated for CuIn 5 Se 8 (CuGa 3 Se 5 ). It was also found that the major contribution of phonons to the shift of E g versus temperature in CuIn 5 Se 8 (CuGa 3 Se 5 ) is mainly from optical phonons. (copyright 2006 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (Abstract Copyright [2006], Wiley Periodicals, Inc.)

  1. Measurements of the electric field gradient at cadmium in YBa2Cu3Ox, Y2BaCuO5 and Y2Cu2O5

    International Nuclear Information System (INIS)

    Saitovitch, H.; Silva, P.R.J.

    1990-01-01

    The electric Field Gradient (EFG) at diluted Cd sup(111) in YBa sub(2)Cu sub(3)O sub(x) was measured by Angular Correlation (AC). In order to determine the atom-probe localization, AC measurements were also, performed on Y sub(2)BaCuO sub(5). A nuclear electric quadrupole interaction frequency (NQIF) was associated with Cd sup(111) in YBa sub(2)Cu sub(3) O sub(x) Cu(1) site. (author)

  2. Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

    Science.gov (United States)

    Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

    2013-09-01

    Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

  3. CO interaction with Cu(I)-MCM-22 zeolite: density function theory investigation

    International Nuclear Information System (INIS)

    Viet Thang Ho; Petr Nachtigall

    2014-01-01

    MCM-22 zeolite has been widely used in many applications for catalysis and adsorption. Especially, this material exchanged with Cu + cation (Cu(I)-MCM-22) is an active catalyst in green chemical reaction, such as decomposition of NO and N 2 O. The local geometry of Cu + in vicinity of Al (III) replacement in six different Si (IV) sites and CO interaction with the most stable Cu + in each Al site were explored using periodic density functional theory (DFT) method. Th CO stretching frequencies were computed applying the ω/r scaling method in which frequencies were determined at high quantum level (couple cluster) and CO bond length calculated at DFT level. The results showed that Cu + cation located in the channel wall position and intersection position coordinated with 3 or 2 framework oxygen atoms, respectively, before CO adsorption and Cu + cation coordinated with 2 framework oxygen atoms after CO adsorption. The interaction energies between CO and Cu + cation were in range -148 to -195 kJ/mol -1 and CO frequencies exhibit two peak at 2151 and 2159 cm -1 in good agreement with experimental data. This investigation allows to understand the Cu + location in MCM-22 and CO adsorption in Cu(I)-MCM-22 zeolite. (author)

  4. Temporal variations of Cu in Jiaozhou Bay 1982-1986

    Science.gov (United States)

    Yang, Dongfang; Zhu, Sixi; Wang, Zhikang; Su, Chunhua; Wang, Qiang

    2017-12-01

    This paper analyzed the temporal variations of Cu in Jiaozhou Bay during 1982-1986. Results showed that Cu contents in study years were 0.15-5.31 μg L-1, 0.77-20.60 μg L-1, 0.11-4.00 μg L-1, 0.10-0.43 μg L-1 and 0.18-0.77 μg L-1, respectively. The Cu pollution level in this bay was moderate during 1982-1983, yet for temporal variations Cu contents in surface waters were showing decreasing trend. Cu contents in spring, summer and autumn were 0.11-20.60 μg L-1, 0.10-4.86 μg L-1 and 0.11-3.56 μg L-1, respectively. This bay was moderate pollution in spring in 1982-1983, while in other seasons in study years was still slight. These indicated that the temporal variations of Cu pollution in this bay should be taken in to account in decision-making of pollution control practice.

  5. The tin-rich copper lithium stannides: Li3Cu6Sn4 and Li2CuSn2

    International Nuclear Information System (INIS)

    Fuertauer, Siegfried; Flandorfer, Hans; Effenberger, Herta S.

    2015-01-01

    The Sn rich ternary intermetallic compounds Li 3 Cu 6 Sn 4 (CSD-427097) and Li 2 CuSn 2 (CSD-427098) were synthesized from the pure elements by induction melting and annealing at 400 C. Structural investigations were performed by powder- and single-crystal XRD. Li 3 Cu 6 Sn 4 crystallizes in space group P6/mmm; it is structurally related to but not isotypic with MgFe 6 Ge 6 (a = 5.095(2) Aa, c = 9.524(3) Aa; wR 2 = 0.059; 239 unique F 2 -values, 17 free variables). Li 3 Cu 6 Sn 4 is characterized by two sites with a mixed Cu:Sn occupation. In contrast to all other Cu-Li-Sn compounds known so far, any mixed occupation was found for Cu-Li pairs only. In addition, one Li site is only half occupied. The second Sn rich phase is Li 2 CuSn 2 (space group I4 1 /amd, a = 4.4281(15) Aa, c = 19.416(4) Aa; wR 2 = 0.033; 213 unique F 2 -values, 12 atom free variables); it is the only phase in the Cu-Li-Sn system which is noted for full ordering. Both crystal structures exhibit 3D-networks which host Li atoms in channels. They are important for understanding the lithiation mechanism in Cu-Sn electrodes for Li-ion batteries.

  6. Structural and electrical properties of co-evaporated Cu(In,Ga)Se{sub 2} thin films with varied Cu contents

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Min Young; Kim, Girim; Kim, Jongwan; Park, Jae Hwan; Lim, Donggun, E-mail: dglim@ut.ac.kr

    2013-11-01

    Cu(In,Ga)Se{sub 2} (CIGS) thin films were fabricated with varying Cu contents. Cu/(Ga + In) ratios were varied between 0.4 and 1.02. Solar cells were then fabricated by co-evaporation using the CIGS layers as absorbers. The influences of Cu content on the cells' structural, optical and electrical properties were studied. The CIGS thin films were characterized by X-ray diffractometer, scanning electron microscopy, energy-dispersive spectroscopy, four-point probe measurement and Hall measurement. Grain size in the films increased with increasing Cu content. At a Cu/(Ga + In) ratio of 0.86, the (220/204) peak was stronger than the (112) peak and carrier concentration was 1.49 × 10{sup 16} cm{sup −3}. Optimizing the Cu content resulted in a CIGS solar cell with an efficiency of 16.5%. - Highlights: • Improvement of technique to form Cu(In,Ga)Se{sub 2} (CIGS) film by co-evaporation method • Cu/(In + Ga) ratio to improve the efficiency for CIGS thin film solar cell • Cu content effects have been analyzed. • Optimum condition of CIGS layer as an absorber of thin film solar cells.

  7. Cu-filled through-hole electrode for ZnS using high adhesive strength Ni–P thin film

    International Nuclear Information System (INIS)

    Okamoto, Naoki; Miyamoto, Megumi; Saito, Takeyasu; Kondo, Kazuo; Fukumoto, Takafumi; Hirota, Masaki

    2012-01-01

    Zinc sulfide (ZnS) and related materials are important for applications in ultraviolet light emitting diodes, cathode ray tubes, flat panel displays and infrared ray (IR) windows. In order to utilize these optoelectronics devices in electronic products, 3D-packaging as well as wafer level packaging (WLP) are needed. The two methods used to achieve this are physical vapor deposition (PVD) and conventional electroless deposition processes. However, both these methods have problems. Films made by PVD are not always of uniform thickness if the substrate is not flat. On the other hand, films made by conventional electroless deposition have weak adhesive strength to substrates. In order to overcome these limitations, we developed a new electroless deposition process to form nickel–phosphorus (Ni–P) films. This process combines catalyzation (Cu deposition) and electroless deposition processes. The films made using the new process show high adhesive strength in tensile tests and also very uniform thickness. In addition, conformal Cu filling of through-holes was achieved by using this new electroless deposition process.

  8. Enhancement of oxidation resistance in Cu and Cu(Al) thin layers

    Energy Technology Data Exchange (ETDEWEB)

    Horvath, Z.E.; Peto, G. E-mail: peto@mfa.kfki.hu; Paszti, Z.; Zsoldos, E.; Szilagyi, E.; Battistig, G.; Lohner, T.; Molnar, G.L.; Gyulai, J

    1999-01-02

    High conductivity and good resistance to electromigration makes copper a promising interconnect material in microelectronics. However, one of its disadvantages is the poor corrosion resistance. Two methods of passivation are investigated and compared: Al alloying and BF{sub 2}{sup +} ion implantation. X-ray diffraction (XRD) and Rutherford Backscattering Spectrometry (RBS) show the oxidation inhibition of both methods, but the different ratio of CuO{sub 2} to CuO phases suggests different mechanisms of passivation. There are no definite oxide lines in the XRD spectrum of the implanted and annealed Cu(Al) sample, so the presence of Al and the implantation together give increased protection against oxidation. The difference between the two mechanisms of oxidation inhibition is discussed briefly.

  9. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  10. Diffusivities and atomic mobilities in Cu-rich fcc Al-Cu-Mn alloys

    Energy Technology Data Exchange (ETDEWEB)

    Yin, Ming; Du, Yong; Cui, Senlin; Xu, Honghui; Liu, Shuhong [Central South Univ., Changsha (China). State Key Laboratory of Powder Metallurgy; Zhang, Lijun [Bochum Univ. (DE). Interdisciplinary Centre for Advanced Materials Simulation (ICAMS)

    2012-07-15

    Via solid-solid diffusion couples, electron probe microanalysis and the Whittle and Green method, interdiffusivities in fcc Al-Cu-Mn alloys at 1 123 K were measured. The reliability of the obtained diffusivities is validated by comparing the computed diffusivities with literature data plus constraints among the diffusivities. Through assessments of experimentally determined diffusion coefficients by means of a diffusion-controlled transformations simulation package, the atomic mobilities of Al, Cu, and Mn in fcc Al-Cu-Mn alloys are obtained. Comprehensive comparisons between the model-predicted and the experimental data indicate that the presently obtained atomic mobilities can reproduce most of the diffusivities, concentration profiles, and diffusion paths reasonably. (orig.)

  11. Synthesis and magnetic properties of multilayer Ni/Cu and NiFe/Cu ...

    Indian Academy of Sciences (India)

    The diameter of wires can be easily varied by pore size of alumina, ranging ... saturated HgCl2 solution to remove the remaining Al, and then dipped in 5 wt% ... for NiFe alloy it is 1.3 V, that is higher than for Ni/Cu nanowires to diminish Cu.

  12. Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

    International Nuclear Information System (INIS)

    Li, Yi; Lim, Adeline B.Y.; Luo, Kaiming; Chen, Zhong; Wu, Fengshun; Chan, Y.C.

    2016-01-01

    The evolution of microstructure in Cu/In–48Sn/Cu solder bump interconnects at a current density of 0.7 × 10"4 A/cm"2 and ambient temperature of 55 °C has been investigated. During electromigration, tin (Sn) atoms migrated from cathode to anode, while indium (In) atoms migrated from anode to cathode. As a result, the segregation of the Sn-rich phase and the In-rich phase occurred. A Sn-rich layer and an In-rich layer were formed at the anode and the cathode, respectively. The accumulation rate of the Sn-rich layer was 1.98 × 10"−"9 cm/s. The atomic flux of Sn was calculated to be approximately 1.83 × 10"1"3 atoms/cm"2s. The product of the diffusivity and the effective charge number of Sn was determined to be approximately 3.13 × 10"−"1"0 cm"2/s. The In–48Sn/Cu IMC showed a two layer structure of Cu_6(Sn,In)_5, adjacent to the Cu, and Cu(In,Sn)_2, adjacent to the solder. Both the cathode IMC and the anode IMC thickened with increasing electromigration time. The IMC evolution during electromigration was strongly influenced by the migration of Cu atoms from cathode to anode and the accumulation of Sn-rich and In-rich layers. During electromigration, the Cu(In,Sn)_2 at the cathode interface thickened significantly, with a spalling characteristic, due to the accumulation of In-rich layer and the migration of Cu atoms - while the Cu(In,Sn)_2 at the anode interface reduced obviously, due to the accumulation of Sn-rich layer. The mechanism of electromigration-induced failure in Cu/In–48Sn/Cu interconnects was the cathode Cu dissolution-induced solder melt, which led to the rapid consumption of Cu in the cathode pad during liquid-state electromigration and this finally led to the failure. - Highlights: • Sn migrates to the anode, while In migrates to the cathode, during EM in Cu/In–48Sn/Cu. • The atomic flux of Sn has been calculated. • The interfacial IMCs were identified as: Cu_6(Sn,In)_5 + Cu(In,Sn)_2. • The interface evolution is strongly

  13. Synthesis, Crystal Structure, and Electroconducting Properties of a 1D Mixed-Valence Cu(I–Cu(II Coordination Polymer with a Dicyclohexyl Dithiocarbamate Ligand

    Directory of Open Access Journals (Sweden)

    Kenji Nakatani

    2015-04-01

    Full Text Available A new mixed-valence Cu(I–Cu(II 1D coordination polymer, [CuI4CuIIBr4(Cy2dtc2]n, with an infinite chain structure is synthesized by the reaction of Cu(Cy2dtc2 (Cy2dtc− = dicyclohexyl dithiocarbamate, C13H22NS2 with CuBr·S(CH32. The as-synthesized polymer consists of mononuclear copper(II units of CuII(Cy2dtc2 and tetranuclear copper(I cluster units, CuI4Br4. In the cluster unit, all the CuI ions have distorted trigonal pyramidal coordination geometries, and the CuI–CuI or CuI–CuII distances between the nearest copper ions are shorter than the sum of van der Waals radii for Cu–Cu.

  14. Investigation of CuGaSe2/CuInSe2 double heterojunction interfaces grown by molecular beam epitaxy

    Directory of Open Access Journals (Sweden)

    Sathiabama Thiru

    2015-02-01

    Full Text Available In-situ reflection high-energy electron diffraction (RHEED observation and X-ray diffraction measurements were performed on heterojunction interfaces of CuGaSe2/CnInSe2/CuGaSe2 grown on GaAs (001 using migration-enhanced epitaxy. The streaky RHEED pattern and persistent RHEED intensity oscillations caused by the alternate deposition of migration-enhanced epitaxy sequence are observed and the growths of smooth surfaces are confirmed. RHEED observation results also confirmed constituent material interdiffusion at the heterointerface. Cross-sectional transmission electron microscopy showed a flat and abrupt heterointerface when the substrate temperature is as low as 400 °C. These have been confirmed even by X-ray diffraction and photoluminescence measurements.

  15. Preparation of three-dimensional porous Cu film supported on Cu foam and its electrocatalytic performance for hydrazine electrooxidation in alkaline medium

    International Nuclear Information System (INIS)

    Liu, Ran; Ye, Ke; Gao, Yinyi; Long, Ziyao; Cheng, Kui; Zhang, Wenping; Wang, Guiling; Cao, Dianxue

    2016-01-01

    Highlights: • A binder-free Cu/Cu foam electrode is prepared by an electrochemical method. • The electrode owns a novel three-dimensional porous structure. • The electrode exhibits superior catalytic activity for hydrazine electrooxidation. - Abstract: A three-dimensional porous copper film is directly deposited on Cu foam by an electrodeposition method using hydrogen bubbles as dynamic template (denoted as Cu/Cu foam). Its electrocatalytic activity toward hydrazine electrooxidation is tested by linear sweep voltammetry, chronoamperometry and electrochemical impedance spectroscopy. Compared with Cu foam, hydrazine electrooxidation on the Cu/Cu foam electrode shows that the onset oxidation potential displays a ~100 mV negative shift, the current density at −0.6 V raises about 14 times, the apparent activation energy and the charge transfer resistance reduce significantly. The increasing electrocatalytic performance for hydrazine electrooxidation is mainly caused by the highly porous structure of the Cu/Cu foam electrode which can provide a large surface area and make electrolyte access the electrocatalyst surfaces more easily. Hydrazine electrooxidation on the Cu/Cu foam electrode proceeds through a near 4-electron process.

  16. Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study

    Science.gov (United States)

    Zhou, Wei; Liu, Lijuan; Li, Baoling; Wu, Ping

    2009-06-01

    Electromigration phenomena in a one-dimensional Cu/SnAg3.0Cu0.5/Cu joint were investigated with current stressing. The special effect of intermetallic compound (IMC) layers on the formation of serious electromigration damage induced by nonuniform current density distribution was discussed based on experimental results. Meanwhile, hillocks were observed both at the anode and near the cathode of the joint, and they were described as the result of diffusion of atoms and compressive stress released along grain boundaries to the relatively free surface. Moreover, the diffusion behavior of Cu at the cathode was analyzed with the electromigration equation, and the stability of Ag atoms in the solder during electromigration was evaluated with a first-principles method.

  17. Interplay of Cu and oxygen vacancy in optical transitions and screening of excitons in ZnO:Cu films

    International Nuclear Information System (INIS)

    Darma, Yudi; Rusydi, Andrivo; Seng Herng, Tun; Marlina, Resti; Fauziah, Resti; Ding, Jun

    2014-01-01

    We study room temperature optics and electronic structures of ZnO:Cu films as a function of Cu concentration using a combination of spectroscopic ellipsometry, photoluminescence, and ultraviolet-visible absorption spectroscopy. Mid-gap optical states, interband transitions, and excitons are observed and distinguishable. We argue that the mid-gap states are originated from interactions of Cu and oxygen vacancy (Vo). They are located below conduction band (Zn4s) and above valence band (O2p) promoting strong green emission and narrowing optical band gap. Excitonic states are screened and its intensities decrease upon Cu doping. Our results show the importance of Cu and Vo driving the electronic structures and optical transitions in ZnO:Cu films

  18. Interplay of Cu and oxygen vacancy in optical transitions and screening of excitons in ZnO:Cu films

    Science.gov (United States)

    Darma, Yudi; Seng Herng, Tun; Marlina, Resti; Fauziah, Resti; Ding, Jun; Rusydi, Andrivo

    2014-02-01

    We study room temperature optics and electronic structures of ZnO:Cu films as a function of Cu concentration using a combination of spectroscopic ellipsometry, photoluminescence, and ultraviolet-visible absorption spectroscopy. Mid-gap optical states, interband transitions, and excitons are observed and distinguishable. We argue that the mid-gap states are originated from interactions of Cu and oxygen vacancy (Vo). They are located below conduction band (Zn4s) and above valence band (O2p) promoting strong green emission and narrowing optical band gap. Excitonic states are screened and its intensities decrease upon Cu doping. Our results show the importance of Cu and Vo driving the electronic structures and optical transitions in ZnO:Cu films.

  19. Inkjet printed Cu(In,Ga)S2 nanoparticles for low-cost solar cells

    KAUST Repository

    Barbe, Jeremy; Eid, Jessica; Ahlswede, Erik; Spiering, Stefanie; Powalla, Michael; Agrawal, Rakesh; Del Gobbo, Silvano

    2016-01-01

    Cu(In,Ga)Se2 (CIGSe) thin film solar cells were fabricated by direct inkjet printing of Cu(In,Ga)S2 (CIGS) nanoparticles followed by rapid thermal annealing under selenium vapor. Inkjet printing is a low-cost, low-waste, and flexible patterning

  20. Titulações potenciométricas de cátions metálicos tendo como eletrodo indicador o sistema Cu/Cu(II-EDTA Potentiometric titrations of metal cations with edta using the Cu/Cu(II-EDTA system as indicator electrode

    Directory of Open Access Journals (Sweden)

    Paulo H. Pereira da Silva

    2008-01-01

    Full Text Available In potentiometric titrations of metal cations with EDTA the Hg/HgY2- system is usually used to detect the end point. However, the use of mercury has been discouraged in analytical procedures due to its toxicity. In this work the Cu/CuY2- system was used as indicator electrode for potentiometric titrations of some metal cations with EDTA. The solutions of Cu2+, Cd2+, Mn2+, Co2+ and Zn2+ were titrated with Na2EDTA solution in the presence of a small concentration of the CuY2- complex using a copper wire as indicator electrode. The potentiometric titrations with the Cu/CuY2- system showed good correlation when compared with an Hg/HgY2- system.

  1. R&D of CuCrZr tubes for W/Cu monoblock components

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Sixiang, E-mail: sxzhao@impcas.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences (ASIPP), P.O. Box 1126, Hefei 230031 (China); Ma, Linsheng [State Nuclear Bao Ti Zirconium Industry Company, 206 Hi-Tech Avenue, Baoji 721013 (China); Peng, Lingjian [Advanced Technology & Materials Co., Ltd. - AT& M, Beijing 100081 (China); Gao, Bo [State Nuclear Bao Ti Zirconium Industry Company, 206 Hi-Tech Avenue, Baoji 721013 (China); Li, Chun [Laboratory of Advanced materials, School of Materials Science & Engineering, Tsinghua University, Beijing 100084 (China); Li, Qiang; Wang, Wanjing; Wei, Ran; Xu, Yuping [Institute of Plasma Physics, Chinese Academy of Sciences (ASIPP), P.O. Box 1126, Hefei 230031 (China); Pan, Ningjie; Qin, Sigui; Shi, Yingli; Liu, Guohui; Wang, Tiejun [Advanced Technology & Materials Co., Ltd. - AT& M, Beijing 100081 (China); Luo, Guang-Nan, E-mail: gnluo@ipp.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences (ASIPP), P.O. Box 1126, Hefei 230031 (China); Hefei Center for Physical Science and Technology, Hefei 230031 (China); Hefei Science Center of CAS, Hefei 230031 (China)

    2016-11-15

    Highlights: • CuCrZr tubes with excellent HIP performance and good resistance to grain growth have been developed. • A circumferential ductility testing manner for small-diameter tubes has been utilized in this study. • The evolution of microstructures has been revealed throughout the new tube forming processes. - Abstract: In order to avoid the occurrence of two types of longitudinal defects (strain localization and folding flaws), which were observed in the CuCrZr tubes of EAST W/Cu upper divertor components, in the future manufacturing of monoblock components using hot isostatic pressing (HIP), a new CuCrZr tube forming protocol is proposed. The evolution of Cu grains and Cr-rich particles is monitored by scanning electron microscopy throughout the new tube forming processes. The final microstructures of the newly developed tubes are totally different from those of the EAST project previously chosen tubes and the elongation of Cr-rich precipitates has been substantially suppressed by using the new tube forming protocol. The newly developed tubes show better HIP performance than the EAST previously chosen ones. Since circumferential mechanical properties, especially ductility, are of great importance, a circumferential ductility testing manner for small-diameter tubes, which might be a supplement to longitudinal tensile testing, has been utilized and the preliminary testing results are given. The recrystallization behavior of the newly developed tubes is also investigated.

  2. Studies of the development and characterization of the Cu-Ni-Pt and Cu-Ni-Sn alloys for electro-electronic uses

    International Nuclear Information System (INIS)

    Silva, Luis Carlos Elias da

    2006-01-01

    The Cu and its alloys have different applications in the owed modern society the excellent electric properties, thermal conductivity, resistance to the corrosion and other properties. These applications can be in valves, pipes, pots for absorption of solar energy, radiators for automobiles, current driver, electronic driver, thermostats elements and structural parts of nuclear reactors, as, for example, reels for field toroidal for a reactor of nuclear coalition. The alloys used in nuclear reactors, we can highlight Cu-Be, Cu-Sn and Cu-Pt. Ni and Co frequently are added to the Cu alloys so that the solubility is moved for temperatures more elevated with relationship to the binary systems of Cu-Sn and Cu-Pt. The addition of Ni-Pt or Ni-Sn to the Cu in the same or inferior percentages to 1,5% plus thermomechanical treatments changes the properties of the copper. We studied the electric conductivity and hardness Vickers of the Cu-Ni-Pt and Cu-Ni-Sn and compared with the electrolytic Cu. In the proposed flowcharts, breaking of the obtaining of the ingot, we proceeded with thermo mechanical treatments. (author)

  3. INTERSITE INTERACTIONS IN CU L-EDGE XPS, XAS, AND XES OF DOPED AND UNDOPED CU COMPOUNDS

    NARCIS (Netherlands)

    VANVEENENDAAL, MA; SAWATZKY, GA

    1994-01-01

    The effect of interaction between different Cu atoms is studied by calculations on clusters with more Cu atoms for various kinds of spectroscopy, using a multiband Hubbard Hamiltonian. It is found that the inclusion of more Cu sites often leads to final states lower in energy than those that would

  4. CuAlTe{sub 2}: A promising bulk thermoelectric material

    Energy Technology Data Exchange (ETDEWEB)

    Gudelli, Vijay Kumar [Department of Physics, Indian Institute of Technology Hyderabad, Ordnance Factory Estate, Yeddumailaram 502 205, Telangana (India); Kanchana, V., E-mail: kanchana@iith.ac.in [Department of Physics, Indian Institute of Technology Hyderabad, Ordnance Factory Estate, Yeddumailaram 502 205, Telangana (India); Vaitheeswaran, G. [Advanced Centre of Research in High Energy Materials (ACRHEM), University of Hyderabad, Prof. C. R. Rao Road, Gachibowli, Hyderabad 500 046, Telangana (India)

    2015-11-05

    Transport properties of Cu-based chalcopyrite materials are presented using the full potential linear augmented plane wave method and Boltzmann Semi-classical theory. All the studied compounds appear to be direct band gap semiconductors evaluated based on the Tran-Blaha modified Becke-Johnson potential. The heavy and light band combination found near the valence band maximum (VBM) drive these materials to possess good thermoelectric properties. Among the studied compounds, CuAlTe{sub 2} is found to be more promising, in comparison with CuGaTe{sub 2}, which is reported to be an efficient thermoelectric material with appreciable figure of merit. Another interesting fact about CuAlTe{sub 2} is the comparable thermoelectric properties possessed by both n- type and p-type carriers, which might attract good device applications and are explained in detail using the electronic structure calculations. - Highlights: • Band structure calculation of Cu(Al,Ga)Ch{sub 2} compounds with the TB-mBJ functional. • Mixed heavy-light bands near Fermi level might favour good thermoelectric properties. • Among the investigated compounds CuAlTe{sub 2} appears to be more promising. • Thermoelectric properties of CuAlTe{sub 2} are almost comparable with CuGaTe{sub 2}. • Both n,p-type thermoelectric properties of CuAlTe{sub 2} can attract device applications.

  5. The Effect of Different Levels of Cu, Zn and Mn Nanoparticles in Hen Turkey Diet on the Activity of Aminopeptidases.

    Science.gov (United States)

    Jóźwik, Artur; Marchewka, Joanna; Strzałkowska, Nina; Horbańczuk, Jarosław Olav; Szumacher-Strabel, Małgorzata; Cieślak, Adam; Lipińska-Palka, Paulina; Józefiak, Damian; Kamińska, Agnieszka; Atanasov, Atanas G

    2018-05-11

    The aim of the study was to estimate the influence of the different levels of Cu, Zn, and Mn nanoparticles on the activity of aminopeptidases in turkey. An experiment was carried out on 144 turkey hen Hybrid Converter. The birds were divided into groups given standard- and nanoparticle-supplementation of different level of copper (Cu 20, 10, 2 mg/kg), zinc (Zn 100, 50, 10 ppm), and manganese (Mn 100, 50, 10 ppm), covering respectively 100%, 50%, and 10% of the physiological demands for those minerals in the diet. The activity of aminopeptidases (alanyl: AlaAP, leucyl: LeuAP and arginyl: ArgAP) after supplementation of minerals was determined in the breast and thigh turkey muscle. The strongest effect of interaction among minerals supplementation form and dose on the activity levels of the aminopeptidases in thigh muscle was observed for nano-Cu already at the lowest dose of 2 mg/kg. In this dose (covering 10% of the birds’ demand) nano form of supplementation significantly increased the activity of Ala-, Leu-, and ArgAP (877, 201, and 719, respectively), compared to standard form of supplementation (461, 90.5, and 576, respectively). In turn, in breast muscle, after supplementation covering 10% of the demand with the nano-Cu, nano-Zn, and nano-Mn compared to the standard form, we did not observe any significant difference in the activity levels of any of the investigated aminopeptidases, except for AlaAP under Zn supplementation. Supplementation with the 20 mg/kg of Nano-Cu (100% of demand) and with 10 mg/kg of Nano-Cu (50% of demand) inhibited the activity of all of the three aminopeptidases in thigh muscle. Supplementation of the minerals in nano form into the diet, especially of Cu and Zn in the dose covering 10% of the demand is relevant to maintain homeostasis in turkey muscles, as indicated by the activity of the aminopeptidases.

  6. Electrodeposition of Cu-In alloys for preparing CuInS sub 2 thin films

    Energy Technology Data Exchange (ETDEWEB)

    Herrero, J; Ortega, J [Inst. de Energias Renovables (CIEMAT), Madrid (Spain)

    1990-01-01

    Copper-indium alloys were prepared by electroplating from citric acid (C{sub 6}H{sub 8}O{sub 7}.H{sub 2}O) baths onto Ti substrate. Formation of the alloys was carried out by direct codeposition of the elements and by sequential electrodeposition of copper and indium. Studies of the alloy formation by electrochemical measurements and X-ray diffraction were performed. The presence of Cu{sub 7}In{sub 4} in direct deposit as well as in sequentially electrodeposited material was observed during the alloy formation. The as-deposited layers were heated in H{sub 2}S. X-ray diffraction showed the annealed layers to be CuInS{sub 2} with the chalcopyrite structure, where the CuIn{sub 5}S{sub 8} phase was included during the annealing process. Photoelectrochemical characterization of the samples allowed us to determine the photoconductivity which is related with the Cu/In ratio in the samples. The energy gap for CuInS{sub 2} photoelectrodes in polysulphide solution was 1.57 Ev. (orig.).

  7. Structural and optical studies of CuO nanostructures

    Energy Technology Data Exchange (ETDEWEB)

    Chand, Prakash, E-mail: KK-PC2006@yahoo.com; Gaur, Anurag, E-mail: KK-PC2006@yahoo.com; Kumar, Ashavani, E-mail: KK-PC2006@yahoo.com [Department of Physics, National Institute of Technology, Kurukshetra-136119 (India)

    2014-04-24

    In the present study, copper oxide (CuO) nanostructures have been synthesized at 140 °C for different aging periods, 1, 24, 48 and 96 hrs by hydrothermal method to investigate their effects on structural and optical properties. The X-ray diffractometer (XRD) pattern indicates the pure phase formation of CuO and the particle size, calculated from XRD data, has been found to be increasing from 21 to 36 nm for the samples synthesized at different aging periods. Field emission scanning electron microscope (FESEM) analysis also shows that the average diameter and length of these rectangular nano flakes increases with increasing the aging periods. Moreover Raman spectrums also confirm the phase formation of CuO. The optical band gaps calculated through UV-visible spectroscopy are found to be decreasing from 2.92 to 2.69 eV with increase in aging periods, 1 to 96 hrs, respectively.

  8. Structural and optical studies of CuO nanostructures

    International Nuclear Information System (INIS)

    Chand, Prakash; Gaur, Anurag; Kumar, Ashavani

    2014-01-01

    In the present study, copper oxide (CuO) nanostructures have been synthesized at 140 °C for different aging periods, 1, 24, 48 and 96 hrs by hydrothermal method to investigate their effects on structural and optical properties. The X-ray diffractometer (XRD) pattern indicates the pure phase formation of CuO and the particle size, calculated from XRD data, has been found to be increasing from 21 to 36 nm for the samples synthesized at different aging periods. Field emission scanning electron microscope (FESEM) analysis also shows that the average diameter and length of these rectangular nano flakes increases with increasing the aging periods. Moreover Raman spectrums also confirm the phase formation of CuO. The optical band gaps calculated through UV-visible spectroscopy are found to be decreasing from 2.92 to 2.69 eV with increase in aging periods, 1 to 96 hrs, respectively

  9. Structural and optical studies of CuO nanostructures

    Science.gov (United States)

    Chand, Prakash; Gaur, Anurag; Kumar, Ashavani

    2014-04-01

    In the present study, copper oxide (CuO) nanostructures have been synthesized at 140 °C for different aging periods, 1, 24, 48 and 96 hrs by hydrothermal method to investigate their effects on structural and optical properties. The X-ray diffractometer (XRD) pattern indicates the pure phase formation of CuO and the particle size, calculated from XRD data, has been found to be increasing from 21 to 36 nm for the samples synthesized at different aging periods. Field emission scanning electron microscope (FESEM) analysis also shows that the average diameter and length of these rectangular nano flakes increases with increasing the aging periods. Moreover Raman spectrums also confirm the phase formation of CuO. The optical band gaps calculated through UV-visible spectroscopy are found to be decreasing from 2.92 to 2.69 eV with increase in aging periods, 1 to 96 hrs, respectively.

  10. Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

    Directory of Open Access Journals (Sweden)

    Simon J. Bleiker

    2016-10-01

    Full Text Available Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based on low-temperature adhesive wafer bonding, which ensures full complementary metal-oxide-semiconductor (CMOS compatibility. All necessary fabrication steps for the wafer bonding, such as cavity formation and deposition of the adhesive, are performed on the capping substrate. The polymer adhesive is deposited by spray-coating on the capping wafer containing the cavities. Thus, no lithographic patterning of the polymer adhesive is needed, and material waste is minimized. Furthermore, this process does not require any additional fabrication steps on the device wafer, which lowers the process complexity and fabrication costs. We demonstrate the proposed capping method by packaging two different MEMS devices. The two MEMS devices include a vibration sensor and an acceleration switch, which employ two different electrical interconnection schemes. The experimental results show wafer-level capping with excellent bond quality due to the re-flow behavior of the polymer adhesive. No impediment to the functionality of the MEMS devices was observed, which indicates that the encapsulation does not introduce significant tensile nor compressive stresses. Thus, we present a highly versatile, robust, and cost-efficient capping method for components such as MEMS and imaging sensors.

  11. Effect of the ITO substrate on the growth of Cu(In,Ga)Se{sub 2}, CuGa{sub 3}Se{sub 5}, CuGa{sub 5}Se{sub 8} and CuIn{sub 3}Se{sub 5} thin films by flash evaporation

    Energy Technology Data Exchange (ETDEWEB)

    Friedrich, E J; Merino, J M; Leon, M [Department of Applied Physics, Universidad Autonoma de Madrid (UAM), Cantoblanco, 28049 Madrid (Spain); Trigo, J F; Guillen, C [Department of Energy, CIEMAT, Avda Complutense, 22, 28040 Madrid (Spain); Ramiro, J, E-mail: josue.friedrich@uam.e [Department of Theory of Signal and Communications, URJC, Campus Fuenlabrada, 122, 28943 Madrid (Spain)

    2009-04-21

    Structural, compositional, electrical and morphological properties of CuIn{sub 1-x}Ga{sub x}Se{sub 2} (x = 0.15, 0.30) and ordered defect compounds (ODC) CuGa{sub 3}Se{sub 5}, CuGa{sub 5}Se{sub 8}, CuIn{sub 3}Se{sub 5} thin films grown by flash evaporation onto soda lime glass substrates (SLG) and ITO/SLG have been studied. Polycrystalline thin films with accentuated preferential orientation in the (1 1 2) plane of the tetragonal structure have been obtained. Annealing in Se atmosphere improves the structural, morphological, electrical and optical properties of the evaporated films, but provokes the formation of a CuIn{sub x}Se{sub y} phase on the surface of the films. Band gap values ranging between 1.01 and 1.21 eV have been obtained for the as-grown CuIn{sub 1-x}Ga{sub x}Se{sub 2} thin films and between 1.09 and 2.01 eV for the CuGa{sub 3}Se{sub 5}, CuGa{sub 5}Se{sub 8} and CuIn{sub 3}Se{sub 5} thin films.

  12. Cu(2) dynamical correlations in YBa2Cu3Ox studied by Moessbauer spectroscopy on substituted 170Yb3+

    International Nuclear Information System (INIS)

    Hodges, J.A.; Bonville, P.; Imbert, P.; Jehanno, G.

    1990-01-01

    Using Moessbauer spectroscopy, we follow the thermal dependence of the fluctuation rate of the Cu(2) internal (molecular) field acting on a 170 Yb 3+ probe diluted at the Y 3+ sites. We use the fluctuations of this field to track the collective fluctuations of the nearest neighbour correlated Cu(2) moments. Results are presented for oxygen levels x = 6.0 and 6.35 and for T ≤ 80K

  13. New alternative methods of analyzing human behavior in cued target acquisition.

    Science.gov (United States)

    Maltz, Masha; Shinar, David

    2003-01-01

    Target acquisition tasks in natural environments are often augmented by cuing systems that advise human observers during the decision process. With present technological limitations, cuing systems are imperfect, so the question arises whether cuing aids should be implemented under all conditions. We examined target acquisition performance under different levels of task complexity and cuing system reliability. We introduce here two new methods to help define observer behavior trends in cued target acquisition: a quantitative measure of observer search behavior in a temporal sense and a measure of the extent of observer reliance on the cue. We found that observer reliance on the cue correlated with task difficulty and the perceived reliability of the cue. Cuing was generally helpful in complex tasks, whereas cuing reduced performance in easy tasks. Consequently, cuing systems should be implemented only when the task is difficult enough to warrant the intrusion of a cue into the task. Actual or potential applications of this research include the design and implementation of imperfect automated aids dealing with augmented reality.

  14. The roles of Al{sub 2}Cu and of dendritic refinement on surface corrosion resistance of hypoeutectic Al-Cu alloys immersed in H{sub 2}SO{sub 4}

    Energy Technology Data Exchange (ETDEWEB)

    Osorio, Wislei R. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Spinelli, Jose E. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Freire, Celia M.A. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Cardona, Margarita B. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Garcia, Amauri [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil)]. E-mail: amaurig@fem.unicamp.br

    2007-09-27

    Al-Cu alloys castings can exhibit different corrosion responses at different locations due to copper content and to the resulting differences on microstructural features and on Al{sub 2}Cu fractions. The aim of this study was to investigate the influence of Al{sub 2}Cu intermetallic particles associated to the dendritic arm spacings on the general corrosion resistance of three different hypoeutectic Al-Cu alloys samples in sulfuric acid solution. The cast samples were produced using a non-consumable tungsten electrode furnace with a water-cooled copper hearth under argon atmosphere. The typical microstructural pattern was examined by using electronic microscopy techniques. In order to evaluate the surface corrosion behavior of such Al-Cu alloys, corrosion tests were performed in a 0.5 M sulfuric acid solution at 25 deg. C by using an electrochemical impedance spectroscopy (EIS) technique and potentiodynamic polarization curves. An equivalent circuit was also used to provide quantitative support for the discussions and understanding of the corrosion behavior. It was found that Al{sub 2}Cu has a less noble corrosion potential than that of the Al-rich phase. Despite that, dendrite fineness has proved to be more influent on corrosion resistance than the increase on alloy copper content with the consequent increase on Al{sub 2}Cu fraction.

  15. Briefly Cuing Memories Leads to Suppression of Their Neural Representations

    Science.gov (United States)

    Norman, Kenneth A.

    2014-01-01

    Previous studies have linked partial memory activation with impaired subsequent memory retrieval (e.g., Detre et al., 2013) but have not provided an account of this phenomenon at the level of memory representations: How does partial activation change the neural pattern subsequently elicited when the memory is cued? To address this question, we conducted a functional magnetic resonance imaging (fMRI) experiment in which participants studied word-scene paired associates. Later, we weakly reactivated some memories by briefly presenting the cue word during a rapid serial visual presentation (RSVP) task; other memories were more strongly reactivated or not reactivated at all. We tested participants' memory for the paired associates before and after RSVP. Cues that were briefly presented during RSVP triggered reduced levels of scene activity on the post-RSVP memory test, relative to the other conditions. We used pattern similarity analysis to assess how representations changed as a function of the RSVP manipulation. For briefly cued pairs, we found that neural patterns elicited by the same cue on the pre- and post-RSVP tests (preA–postA; preB–postB) were less similar than neural patterns elicited by different cues (preA–postB; preB–postA). These similarity reductions were predicted by neural measures of memory activation during RSVP. Through simulation, we show that our pattern similarity results are consistent with a model in which partial memory activation triggers selective weakening of the strongest parts of the memory. PMID:24899722

  16. NMR and NQR study of the electronic and structural properties of Al-Cu-Fe and Al-Cu-Ru quasicrystals

    International Nuclear Information System (INIS)

    Shastri, A.; Borsa, F.; Torgeson, D.R.; Shield, J.E.; Goldman, A.I.

    1994-01-01

    27 Al and 63,65 Cu NMR is reported for powdered stable Al-Cu-Fe and Al-Cu-Ru icosahedral quasicrystals and crystalline approximants, and for an Al-Pd-Mn single-grain quasicrystal. 27 Al NQR spectra at 4.2 K were observed in Al-Cu-Fe and Al-Cu-Ru samples. From quadrupole-perturbed NMR spectra at different magnetic fields, and from zero-field NQR spectra, a wide distribution of local electric-field gradient (EFG) tensor components and principal-axis-system orientations was found at the Al site. A model EFG calculation based on a 1/1 Al-Cu-Fe approximant successfully explained the observed NQR spectra. The average local gradient is largely determined by the p-electron wave function at the Al site, while the width of the distribution is due to EFG lattice contribution. Comparison of 63 Cu and 27 Al NMR shows the EFG distribution at the two sites is similar, but the electronic contribution to the EFG is considerably smaller at the Cu site, in agreement with a more s-type wave function of the conduction electrons. Overall spread of EFG values is well reproduced by calculation based on the approximant. However, the experimental spectra indicate a much larger number of nonequivalent sites when compared with the simulated NQR spectra based on the 1/1 approximant. The short-range, local chemical order is well represented by the approximant, but differences in coordination must be included at intermediate range in the quasicrystal. Measured 27 Al Knight shift, magnetic susceptibility, and nuclear spin-lattice relaxation time as a function of temperature indicate reduced density of states at the Fermi level by a factor of 7 or 8 from the value in Al metal, consistent with the notion of a pseudogap for these quasicrystals. No differences in measured parameters were detected as a function of composition of the quasicrystalline alloys

  17. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

    International Nuclear Information System (INIS)

    Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

    2011-01-01

    Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

  18. Magnetic and structural properties of Cu0.85Fe0.15O system synthesized by co-precipitation

    International Nuclear Information System (INIS)

    Colorado, H. D.; Pérez Alcázar, G. A.

    2011-01-01

    Cu 0.94 Fe 0.06 O and Cu 0.85 Fe 0.15 O samples were synthesized by using the co-precipitation chemical method. Starting from aqueous solutions of copper nitrate, CuO (NO 3 ) 2 3H 2 O, iron nitrate, Fe (NO 3 ) 3 9H 2 O and sodium hydroxide as precipitating agent, NaOH. The precipitate of three samples for Cu 0.94 Fe 0.06 O and five for Cu 0.85 Fe 0.15 O of fine powder were calcined for 5 h at different temperatures. The obtained X rays diffraction patterns refined by the Rietveld method show the CuO characteristic pattern, showing that the Fe atoms enter to replace Cu atoms. Furthermore, it was obtained that the crystallite size decreases with calcination temperatures for Cu 0.94 Fe 0.06 O. The transmission Mössbauer spectroscopy showed that the samples present a disordered paramagnetic behavior due to the big value of the half-width of line of the quadrupolar splitting. Vibrating sample magnetometry confirms the paramagnetic character. The XRD results indicate that the material is nanostructured, due that the crystallite sizes are of the order of 10 nm for Cu 0.94 Fe 0.06 O and 40 nm for Cu 0.85 Fe 0.15 O.

  19. Formation of closely packed Cu nanoparticle films by capillary immersion force for preparing low-resistivity Cu films at low temperature

    Energy Technology Data Exchange (ETDEWEB)

    Yokoyama, Shun, E-mail: shun.yokoyama.c2@tohoku.ac.jp; Motomiya, Kenichi; Takahashi, Hideyuki; Tohji, Kazuyuki [Tohoku University, Graduate School of Environmental Studies (Japan)

    2016-11-15

    Films made of closely packed Cu nanoparticles (NPs) were obtained by drop casting Cu NP inks. The capillary immersion force exerted during the drying of the inks caused the Cu NPs to attract each other, resulting in closely packed Cu NP films. The apparent density of the films was found to depend on the type of solvent in the ink because the capillary immersion force is affected by the solvent surface tension and dispersibility of Cu NPs in the solvent. The closely packed particulate structure facilitated the sintering of Cu NPs even at low temperature, leading to low-resistivity Cu films. The sintering was also enhanced with a decrease in the size of NPs used. We demonstrated that a closely packed particulate structure using Cu NPs with a mean diameter 61.7 nm showed lower resistivity (7.6 μΩ cm) than a traditionally made Cu NP film (162 μΩ cm) after heat treatment.

  20. Synthesis of core-shell heterostructured Cu/Cu2O nanowires monitored by in situ XRD as efficient visible-light photocatalysts

    KAUST Repository

    Chen, Wei

    2013-01-01

    Core-shell heterostructured Cu/Cu2O nanowires with a high aspect ratio were synthesized from Cu foam using a novel oxidation/reduction process. In situ XRD was used as an efficient tool to acquire phase transformation details during the temperature-programmed oxidation of Cu foam and the subsequent reduction process. Based on knowledge of the crucial phase transformation, optimal synthesis conditions for producing high-quality CuO and core-shell Cu/Cu2O nanowires were determined. In favor of efficient charge separation induced by the special core-shell heterostructure and the advanced three-dimensional spatial configuration, Cu/Cu2O nanowires exhibited superior visible-light activity in the degradation of methylene blue. The present study illustrates a novel strategy for fabricating efficiently core-shell heterostructured nanowires and provides the potential for developing their applications in electronic devices, for environmental remediation and in solar energy utilization fields. This journal is © The Royal Society of Chemistry.

  1. Toxicity Action of Cu2+ on Lemna minor%Cu2+对浮萍的毒性作用

    Institute of Scientific and Technical Information of China (English)

    王爱丽; 宋志慧; 程守敬

    2004-01-01

    Cu2+作为胁迫因子研究了Cu2+对浮萍叶片数、叶绿素含量和过氧化物酶活性的影响.结果表明,Cu2+浓度低于200μg@L-1时,能刺激浮萍生长,对浮萍叶绿素含量影响不大;Cu2+浓度再增加时会抑制浮萍的生长;当Cu2+浓度为400 μg@L-1时,会严重影响浮萍的生长,对浮萍叶绿素含量的影响十分明显.Cu2+对浮萍过氧化物酶活性的影响随Cu2+浓度的升高逐渐增加.

  2. DO{sub 22}-(Cu,Ni){sub 3}Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures

    Energy Technology Data Exchange (ETDEWEB)

    Liu Lilin [School of Physics and Engineering, Sun Yat-Sen University, Guangzhou 510275 (China); Huang, Haiyou [Department of Mechanical Engineering, Hong Kong University of Science and Technology (HKUST) (Hong Kong); Hong Kong - Beijing Joint Research Center, HKUST Fok Ying Tung Graduate School, Nansha, Guangzhou (China); Fu Ran; Liu Deming [ASM Assembly Automation Ltd. (Hong Kong); Zhang Tongyi, E-mail: mezhangt@ust.h [Department of Mechanical Engineering, Hong Kong University of Science and Technology (HKUST) (Hong Kong); Hong Kong - Beijing Joint Research Center, HKUST Fok Ying Tung Graduate School, Nansha, Guangzhou (China)

    2009-11-03

    The present work conducts crystal characterization by High Resolution Transmission Electron Microscopy (HRTEM) on Cu/Sn-nanolayer/Ni sandwich structures associated with the use of Energy Dispersive X-ray (EDX) analysis. The results show that DO{sub 22}-(Cu,Ni){sub 3}Sn intermetallic compound (IMC) ordered structure is formed in the sandwich structures at the as-electrodeposited state. The formed DO{sub 22}-(Cu,Ni){sub 3}Sn IMC is a homogeneous layer with a thickness about 10 nm. The DO{sub 22}-(Cu,Ni){sub 3}Sn IMC nanolayer is stable during annealing at 250 deg. C for 810 min. The formation and stabilization of the metastable DO{sub 22}-(Cu,Ni){sub 3}Sn IMC nanolayer are attributed to the less strain energy induced by lattice mismatch between the DO{sub 22} IMC and fcc Cu crystals in comparison with that between the equilibrium DO{sub 3} IMC and fcc Cu crystals.

  3. Surface structure and morphology of Cu-free and Cu-covered Au(100) and Au(111) electrodes in alkaline solution

    Energy Technology Data Exchange (ETDEWEB)

    Schlaup, Christian [Technical University of Denmark, Department of Physics, Fysikvey, DK-2800 Kongens Lyngby (Denmark); Friebel, Daniel [Stanford Synchrotron Radiation Lightsource, SLAC National Accelerator Laboratory, 2575 Sand Hill Rd, Menlo Park, CA 94025 (United States); Wandelt, Klaus [University of Bonn, Institute for Physical und Theoretical Chemistry, Wegelerstr. 12, D-53115 Bonn (Germany)

    2011-07-01

    For both Cu-free Au-electrodes three different phases were observed as a function of the applied electrode potential. While at low potentials the onset of surface reconstruction points towards an apparently adsorbate free surface and, thus, a weak interaction with species from the electrolyte, a Au-hydroxide and a Au-oxide phase are formed subsequently during potential increase. A similar phase behavior was also found for Cu-covered Au-electrodes, while at low potentials an apparently adsorbate free Cu layer is observed, a Cu-hydroxide coadsorbate phase and a Cu-oxide phase are formed under increased potential conditions. In addition the apparently adsorbate free Cu-film tends to form a Cu-Au alloy phase while keeping the electrode for a sufficient long time at low potential conditions.

  4. Deposition of Cu-doped PbS thin films with low resistivity using DC sputtering

    Science.gov (United States)

    Soetedjo, Hariyadi; Siswanto, Bambang; Aziz, Ihwanul; Sudjatmoko

    2018-03-01

    Investigation of the electrical resistivity of Cu-doped PbS thin films has been carried out. The films were prepared using a DC sputtering technique. The doping was achieved by introducing the Cu dopant plate material directly on the surface of the PbS sputtering target plate. SEM-EDX data shows the Cu concentration in the PbS film to be proportional to the Cu plate diameter. The XRD pattern indicates the film is in crystalline cubic form. The Hall effect measurement shows that Cu doping yields an increase in the carrier concentration to 3.55 × 1019 cm-3 and a significant decrease in electrical resistivity. The lowest resistivity obtained was 0.13 Ωcm for a Cu concentration of 18.5%. Preferential orientation of (1 1 1) and (2 0 0) occurs during deposition.

  5. Proximity effect of Pb on CeCu6 and La0.05Ce0.95Cu6

    International Nuclear Information System (INIS)

    Chen, T.P.; Tipparachi, U.; Yang, H.D.; Wang, J.T.; Chen, B.; Chen, J.C.J.

    1999-01-01

    Heavy fermion materials have attracted a great deal of attention since 1979. These materials which contain a rare earth (U, or Ce, etc.) element exhibit unusual behavior at low temperature. The effective mass m* of the Landau quasiparticles is found to be orders of magnitude higher than that of a bare electron. Some of the Heavy Fermion materials become superconductors at low temperature. The pairing of electrons in these superconductors may not be of s symmetry like those in BCS type superconductors. The mismatch in electronic mass and the difference in pairing state between the light conventional superconducting electrons and the heavy fermion electrons have brought the coupling between light electrons (BCS type) and the heavy fermion electrons into question. Proximity effect of Pb on CeCu 6 , Pb on La 0.05 Ce 0.95 Cu 6 , and Pb on Cu was used to investigate the coupling between the conventional superconducting electrons of Pb and the heavy electrons in CeCu 6 or La 0.05 Ce 0.95 Cu 6 . In this experiment proximity effect was found between Pb and CeCu 6 , as well as between Pb and La 0.05 Ce 0.95 Cu 6 . However, the proximity effect is small when compared with that between Pb and Cu. This indicates a much shorter extrapolation length in the heavy fermion materials than in Cu. Such a phenomenon can be explained by the mismatch in effective mass between the superconducting Pb electrons and the heavy fermion electrons

  6. Magnetic Properties and Structural Study of Ni-Co/Cu Multilayers Prepared by Electrodeposition Method

    Directory of Open Access Journals (Sweden)

    M. Jafari Fesharaki

    2015-07-01

    Full Text Available Ni-Co/Cu multilayers have been grown by electrodeposition method from a single electrolyte (based on Ni(SO4.6H2O, Co(SO4.7H2O, Cu(SO4 and H3BO3 using galvanostatic control on titanium sublayers. The X-ray diffraction (XRD patterns confirmed the multilayered structure with the nanometer thicknesses. Also, electron diffraction x-ray (EDX  analysis confirmed the purity of deposited samples. The morphology of the samples was estimated by scanning electron microscope (SEM. Magnetoresistance (MR measurements were carried out at room temperature for the Ni-Co/Cu multilayers by measuring the resistivity in a magnetic fields varying between ±6kOe as a function of the Ni-Co and Cu layer thicknesses; (1 dCu(nm 4 and 3 dNi-Cu(nm 5. The Maximum value of giant magnetoresistance (GMR was obtained when the Ni-Co and Cu thicknesses were 4.0nm and 4.0nm respectively. The hysteresis loop of the samples at room temperature was studied using an alternating gradient force magnetometer (AGFM. Finally, the temperature dependence of magnetization for Ni-Co/Cu multilayers; (dNi-Cu(4nm/dCu(2nm and dNi-Cu(3nm/dCu(3nm measured by Faraday balance and decreasing the magnetization with increasing the temperature discussed according to electron scattering due to spin fluctuation.

  7. Solidified structure of Al-Pb-Cu alloys

    International Nuclear Information System (INIS)

    Ikeda, Tetsuyuki; Nishi, Seiki; Kumeuchi, Hiroyuki; Tatsuta, Yoshinori.

    1986-01-01

    Al-Pb-Cu alloys were cast into bars or plates in different two metal mold casting processes in order to suppress gravity segregation of Pb and to achieve homogeneous dispersion of Pb phase in the alloys. Solidified structures were analyzed by a video-pattern-analyzer. Plate castings 15 to 20 mm in thickness of Al-Pb-1 % Cu alloy containing Pb up to 5 % in which Pb phase particles up to 10 μm disperse are achieved through water cooled metal mold casting. The plates up to 5 mm in thickness containing Pb as much as 8 to 10 % cast in this process have dispersed Pb particles up to 5 μm in diameter in the surface layer. Al-8 % Pb-1 % Cu alloy bars 40 mm in diameter and 180 mm in height in which gravity segregation of Pb is prevented can be cast by movable and water sprayed metal mold casting at casting temperature 920 deg C and mold moving speed 1.0 mm/s. Pb phase particles 10 μm in mean size are dispersed in the bars. (author)

  8. Cu2O/CuO Bilayered Composite as a High-Efficiency Photocathode for Photoelectrochemical Hydrogen Evolution Reaction

    Science.gov (United States)

    Yang, Yang; Xu, Di; Wu, Qingyong; Diao, Peng

    2016-10-01

    Solar powered hydrogen evolution reaction (HER) is one of the key reactions in solar-to-chemical energy conversion. It is desirable to develop photocathodic materials that exhibit high activity toward photoelectrochemical (PEC) HER at more positive potentials because a higher potential means a lower overpotential for HER. In this work, the Cu2O/CuO bilayered composites were prepared by a facile method that involved an electrodeposition and a subsequent thermal oxidation. The resulting Cu2O/CuO bilayered composites exhibited a surprisingly high activity and good stability toward PEC HER, expecially at high potentials in alkaline solution. The photocurrent density for HER was 3.15 mA·cm-2 at the potential of 0.40 V vs. RHE, which was one of the two highest reported at the same potential on copper-oxide-based photocathode. The high photoactivity of the bilayered composite was ascribed to the following three advantages of the Cu2O/CuO heterojunction: (1) the broadened light absorption band that made more efficient use of solar energy, (2) the large space-charge-region potential that enabled a high efficiency for electron-hole separation, and (3) the high majority carrier density that ensured a faster charge transportation rate. This work reveals the potential of the Cu2O/CuO bilayered composite as a promising photocathodic material for solar water splitting.

  9. The Triple Roles of Glutathione for a DNA-Cleaving DNAzyme and Development of a Fluorescent Glutathione/Cu2+-Dependent DNAzyme Sensor for Detection of Cu2+ in Drinking Water.

    Science.gov (United States)

    Wang, Shijin; Liu, Chengcheng; Li, Guiying; Sheng, Yongjie; Sun, Yanhong; Rui, Hongyue; Zhang, Jin; Xu, Jiacui; Jiang, Dazhi

    2017-03-24

    Pistol-like DNAzyme (PLDz) is an oxidative DNA-cleaving catalytic DNA with ascorbic acid as cofactor. Herein, glutathione was induced into the reaction system to maintain reduced ascorbic acid levels for higher efficient cleavage. However, data indicated that glutathione played triple roles in PLDz-catalyzed reactions. Glutathione alone had no effect on PLDz, and showed inhibitory effect on ascorbic acid-induced PLDz catalysis, but exhibited stimulating effect on Cu 2+ -promoted self-cleavage of PLDz. Further analysis of the effect of glutathione/Cu 2+ on PLDz indicated that H 2 O 2 played a key role in PLDz catalysis. Finally, we developed a fluorescent Cu 2+ sensor (PL-Cu 1.0) based on the relationship between glutathione/Cu 2+ and catalytic activity of PLDz. The fluorescent intensity showed a linear response toward the logarithm concentration of Cu 2+ over the range from 80 nM to 30 μM, with a detection limit of 21.1 nM. PL-Cu 1.0 provided only detection of Cu 2+ over other divalent metal ions. Ca 2+ and Mg 2+ could not interfere with Cu 2+ detection even at a 1000-fold concentration. We further applied PL-Cu 1.0 for Cu 2+ detection in tap and bottled water. Water stored in copper taps overnight had relatively high Cu 2+ concentrations, with a maximum 22.3 μM. Trace Cu 2+ (52.2 nM) in deep spring was detected among the tested bottled water. Therefore, PL-Cu 1.0 is feasible to detect Cu 2+ in drinking water, with a practical application.

  10. Grindability of cast Ti-Cu alloys.

    Science.gov (United States)

    Kikuchi, Masafumi; Takada, Yukyo; Kiyosue, Seigo; Yoda, Masanobu; Woldu, Margaret; Cai, Zhuo; Okuno, Osamu; Okabe, Toru

    2003-07-01

    The purpose of the present study was to evaluate the grindability of a series of cast Ti-Cu alloys in order to develop a titanium alloy with better grindability than commercially pure titanium (CP Ti), which is considered to be one of the most difficult metals to machine. Experimental Ti-Cu alloys (0.5, 1.0, 2.0, 5.0, and 10.0 mass% Cu) were made in an argon-arc melting furnace. Each alloy was cast into a magnesia mold using a centrifugal casting machine. Cast alloy slabs (3.5 mm x 8.5 mm x 30.5 mm), from which the hardened surface layer (250 microm) was removed, were ground using a SiC abrasive wheel on an electric handpiece at four circumferential speeds (500, 750, 1000, or 1250 m/min) at 0.98 N (100 gf). Grindability was evaluated by measuring the amount of metal volume removed after grinding for 1min. Data were compared to those for CP Ti and Ti-6Al-4V. For all speeds, Ti-10% Cu alloy exhibited the highest grindability. For the Ti-Cu alloys with a Cu content of 2% or less, the highest grindability corresponded to an intermediate speed. It was observed that the grindability increased with an increase in the Cu concentration compared to CP Ti, particularly for the 5 or 10% Cu alloys at a circumferential speed of 1000 m/min or above. By alloying with copper, the cast titanium exhibited better grindability at high speed. The continuous precipitation of Ti(2)Cu among the alpha-matrix grains made this material less ductile and facilitated more effective grinding because small broken segments more readily formed.

  11. Improvement of the field-trapping capabilities of bulk Nd Ba Cu O superconductors using Ba Cu O substrates

    Science.gov (United States)

    Matsui, Motohide; Nariki, Shinya; Sakai, Naomichi; Iwafuchi, Kengo; Murakami, Masato

    2006-07-01

    We used Ba-Cu-O substrates to fabricate bulk Nd-Ba-Cu-O superconductors using a top-seeded melt-growth method. There were several advantages for the use of Ba-Cu-O substrate compared to conventional substrate materials such as MgO, ZrO2, Al2O3, RE123 and RE211 (RE = rare earth). The Ba-Cu-O did not react with the precursor and minimized liquid loss. Accordingly, the introduction of large-sized cracks was suppressed. We also found that Tc values were high at the bottom regions, which was ascribed to the beneficial effect of Ba-Cu-O in suppressing Nd/Ba substitution. As a result, we obtained bulk Nd-Ba-Cu-O superconductors that exhibited fairly good field-trapping capabilities, even at the bottom surfaces.

  12. Multishelled Si@Cu Microparticles Supported on 3D Cu Current Collectors for Stable and Binder-free Anodes of Lithium-Ion Batteries.

    Science.gov (United States)

    Zhang, Zailei; Wang, Zhong Lin; Lu, Xianmao

    2018-04-24

    Silicon has proved to be a promising anode material of high-specific capacity for the next-generation lithium ion batteries (LIBs). However, during repeated discharge/charge cycles, Si-based electrodes, especially those in microscale size, pulverize and lose electrical contact with the current collectors due to large volume expansion. Here, we introduce a general method to synthesize Cu@M (M = Si, Al, C, SiO 2 , Si 3 N 4 , Ag, Ti, Ta, SnIn 2 O 5 , Au, V, Nb, W, Mg, Fe, Ni, Sn, ZnO, TiN, Al 2 O 3 , HfO 2 , and TiO 2 ) core-shell nanowire arrays on Cu substrates. The resulting Cu@Si nanowire arrays were employed as LIB anodes that can be reused via HCl etching and H 2 -reduction. Multishelled Cu@Si@Cu microparticles supported on 3D Cu current collectors were further prepared as stable and binder-free LIB anodes. This 3D Cu@Si@Cu structure allows the interior conductive Cu network to effectively accommodate the volume expansion of the electrode and facilitates the contact between the Cu@Si@Cu particles and the current collectors during the repeated insertion/extraction of lithium ions. As a result, the 3D Cu@Si@Cu microparticles at a high Si-loading of 1.08 mg/cm 2 showed a capacity retention of 81% after 200 cycles. In addition, charging tests of 3D Cu@Si@Cu-LiFePO 4 full cells by a triboelectric nanogenerator with a pulsed current demonstrated that LIBs with silicon anodes can effectively store energy delivered by mechanical energy harvesters.

  13. Copper-adapted Suillus luteus, a symbiotic solution for pines colonizing Cu mine spoils.

    Science.gov (United States)

    Adriaensen, K; Vrålstad, T; Noben, J-P; Vangronsveld, J; Colpaert, J V

    2005-11-01

    Natural populations thriving in heavy-metal-contaminated ecosystems are often subjected to selective pressures for increased resistance to toxic metals. In the present study we describe a population of the ectomycorrhizal fungus Suillus luteus that colonized a toxic Cu mine spoil in Norway. We hypothesized that this population had developed adaptive Cu tolerance and was able to protect pine trees against Cu toxicity. We also tested for the existence of cotolerance to Cu and Zn in S. luteus. Isolates from Cu-polluted, Zn-polluted, and nonpolluted sites were grown in vitro on Cu- or Zn-supplemented medium. The Cu mine isolates exhibited high Cu tolerance, whereas the Zn-tolerant isolates were shown to be Cu sensitive, and vice versa. This indicates the evolution of metal-specific tolerance mechanisms is strongly triggered by the pollution in the local environment. Cotolerance does not occur in the S. luteus isolates studied. In a dose-response experiment, the Cu sensitivity of nonmycorrhizal Pinus sylvestris seedlings was compared to the sensitivity of mycorrhizal seedlings colonized either by a Cu-sensitive or Cu-tolerant S. luteus isolate. In nonmycorrhizal plants and plants colonized by the Cu-sensitive isolate, root growth and nutrient uptake were strongly inhibited under Cu stress conditions. In contrast, plants colonized by the Cu-tolerant isolate were hardly affected. The Cu-adapted S. luteus isolate provided excellent insurance against Cu toxicity in pine seedlings exposed to elevated Cu levels. Such a metal-adapted Suillus-Pinus combination might be suitable for large-scale land reclamation at phytotoxic metalliferous and industrial sites.

  14. In-situ STM study of phosphate adsorption on Cu(111), Au(111) and Cu/Au(111) electrodes

    DEFF Research Database (Denmark)

    Schlaup, Christian; Horch, Sebastian

    2013-01-01

    The interaction of Cu(111), Au(111) and Cu-covered Au(111) electrodes with a neutral phosphate buffer solution has been studied by means of cyclic voltammetry (CV) and in situ electrochemical scanning tunneling microscopy (EC-STM). Under low potential conditions, both the Cu(111) and the Au(111......) surface appear apparently adsorbate free, indicated by the presence of a (4×4) structure and the herringbone surface reconstruction, respectively. Upon potential increase, phosphate anions adsorb on both surfaces and for Cu(111) the formation of a (√3×√3)R30° structure is found, whereas on Au(111) a "(√3......×√7)" structure is formed. For a Cu-submonolayer on Au(111), coadsorption of phosphate anions leads to the formation of a (2×2) vacancy structure within an assumed pseudomorphic structure of the Cu-submonolayer with the phosphate anions occupying the vacancies. When desorbing the phosphate anions at low...

  15. Dielectric properties of (CuO,CaO2, and BaO)y/CuTl-1223 composites

    International Nuclear Information System (INIS)

    Mumtaz, M.; Kamran, M.; Nadeem, K.; Jabbar, Abdul; Khan, Nawazish A.; Saleem, Abida; Hussain, S.Tajammul; Kamran, M.

    2013-01-01

    We synthesized (CuO, CaO 2 , and BaO) y /Cu 0.5 Tl 0.5 Ba 2 Ca 2 Cu 3 O 10-δ (y = 0, 5%, 10%, 15%) composites by solid-state reaction and characterized by x-ray diffraction, scanning electron microscopy, dc-resistivity, and Fourier transform infrared spectroscopy. Frequency and temperature dependent dielectric properties such as real and imaginary part of dielectric constant, dielectric loss, and ac-conductivity of these composites are studied by capacitance and conductance measurement as a function of frequency (10 kHz to 10 MHz) and temperature (78 to 300 K). The x-ray diffraction analysis reveals that the characteristic behavior of Cu 0.5 Tl 0.5 Ba 2 Ca 2 Cu 3 O 10-δ superconductor phase and its structure is nearly undisturbed by doping of nanoparticles. The scanning electron microscopy images show the improvement in the intergranular links among the superconducting grains with increasing nanoparticles concentration. Microcracks are healed up with the inclusion of these nanoparticles and superconducting volume fraction is also increased. The dielectric properties of these composites strongly depend upon the frequency and temperature. The zero resistivity critical temperature and dielectric properties show opposite trend with the addition of nanoparticles in Cu 0.5 Tl 0.5 Ba 2 Ca 2 Cu 3 O 10-δ superconductor matrix.

  16. CFA-13 - a bifunctional perfluorinated metal-organic framework featuring active Cu(i) and Cu(ii) sites.

    Science.gov (United States)

    Fritzsche, J; Denysenko, D; Grzywa, M; Volkmer, D

    2017-11-07

    The synthesis and crystal structure of the mixed-valent perfluorinated metal-organic framework (Me 2 NH 2 )[CFA-13] (Coordination Framework Augsburg University-13), (Me 2 NH 2 )[CuCu(tfpc) 4 ] (H 2 -tfpc = 3,5-bis(trifluoromethyl)-1H-pyrazole-4-carboxylic acid) is described. The copper-containing MOF crystallizes in the monoclinic crystal system within the space group P2 1 /n (no. 14) and the unit cell parameters are as follows: a = 22.3887(19), b = 13.6888(8), c = 21.1804(13) Å, β = 90.495(3)°, V = 6491.0(8) Å 3 . (Me 2 NH 2 )[CFA-13] features a porous 3-D structure constructed from two types of secondary building units (SBUs). Besides novel trinuclear [Cu(pz) 4 ] - coordination units, the network also exhibits Cu(ii) paddle-wheel SBUs. (Me 2 NH 2 )[CFA-13] is fully characterized by single crystal X-ray diffraction, thermogravimetric analysis, variable temperature powder X-ray diffraction, IR spectroscopy, photoluminescence, gas sorption measurements and pulse chemisorption experiments. M[CFA-13] (M = K + , Cs + ) frameworks were prepared by postsynthetic exchange of interchannel dimethylammonium cations. Moreover, it was shown that CO molecules can be selectively bound at Cu(i) sites of [Cu(pz) 4 ] - units, whereas Cu(ii) paddle-wheel units bind selectively NH 3 molecules.

  17. Effects of Cu Pollution on the Expansion of an Amphibious Clonal Herb in Aquatic-Terrestrial Ecotones.

    Directory of Open Access Journals (Sweden)

    Liang Xu

    Full Text Available Physiological integration can enhance the performance of clonal plants in aquatic and terrestrial heterogeneous habitats and associated ecotones. Similar to nutrients, pollutants may be transported among connected ramets via physiological integration. Few studies have examined the expansion of amphibious clonal plants from terrestrial to aquatic environments, particularly when the local water supply is polluted with heavy metals. A greenhouse experiment was conducted using the amphibious plant Alternanthera philoxeroides to determine whether Cu can spread among clonal plants and examine the corresponding effects of this pollution on the expansion of clonal plants in aquatic-terrestrial ecotones. Ramets from the same clonal fragments were rooted in unpolluted soil and polluted water at five different levels. The responses of the ramets in terrestrial and aquatic habitats were quantified via traits associated with growth, morphology and Cu accumulation. The results indicated that ramets in soil and water significantly differed in nearly all of these traits. The expansion of populations from terrestrial to polluted aquatic habitats was facilitated by stem elongation rather than new ramet production. The accumulated Cu in polluted ramets can be horizontally transported to other ramets in soil via connected stolons. In terms of clonal growth patterns, variations in Cu pollution intensity were negatively correlated with variations in the morphological and growth traits of ramets in polluted aquatic habitats and unpolluted soil. We concluded that Cu ions are distributed among the clones and accumulated in different ramet tissues in heterogeneous habitats. Therefore, we suggest that Cu pollution of aquatic-terrestrial ecotones, especially at high levels, can affect the growth and expansion of the whole clones because Cu ions are shared between integrated ramets.

  18. Effects of Cu Pollution on the Expansion of an Amphibious Clonal Herb in Aquatic-Terrestrial Ecotones.

    Science.gov (United States)

    Xu, Liang; Zhou, Zhen-Feng

    2016-01-01

    Physiological integration can enhance the performance of clonal plants in aquatic and terrestrial heterogeneous habitats and associated ecotones. Similar to nutrients, pollutants may be transported among connected ramets via physiological integration. Few studies have examined the expansion of amphibious clonal plants from terrestrial to aquatic environments, particularly when the local water supply is polluted with heavy metals. A greenhouse experiment was conducted using the amphibious plant Alternanthera philoxeroides to determine whether Cu can spread among clonal plants and examine the corresponding effects of this pollution on the expansion of clonal plants in aquatic-terrestrial ecotones. Ramets from the same clonal fragments were rooted in unpolluted soil and polluted water at five different levels. The responses of the ramets in terrestrial and aquatic habitats were quantified via traits associated with growth, morphology and Cu accumulation. The results indicated that ramets in soil and water significantly differed in nearly all of these traits. The expansion of populations from terrestrial to polluted aquatic habitats was facilitated by stem elongation rather than new ramet production. The accumulated Cu in polluted ramets can be horizontally transported to other ramets in soil via connected stolons. In terms of clonal growth patterns, variations in Cu pollution intensity were negatively correlated with variations in the morphological and growth traits of ramets in polluted aquatic habitats and unpolluted soil. We concluded that Cu ions are distributed among the clones and accumulated in different ramet tissues in heterogeneous habitats. Therefore, we suggest that Cu pollution of aquatic-terrestrial ecotones, especially at high levels, can affect the growth and expansion of the whole clones because Cu ions are shared between integrated ramets.

  19. Determination of the some electronic parameters of nanostructure copper selenide and Cu/Cu{sub 3}Se{sub 2}/n-GaAs/In structure

    Energy Technology Data Exchange (ETDEWEB)

    Güzeldir, B.; Sağlam, M. [Department of Physics, Faculty of Sciences, Atatürk University, 25240 Erzurum (Turkey); Ateş, A. [Department of Material Engineering, Faculty of Engineering and Natural Sciences, Yıldırım Beyazıt University, Ankara (Turkey); Türüt, A. [Department of Physics Engineering, Faculty of Sciences, Istanbul Medeniyet University, 34000 Istanbul (Turkey)

    2015-04-05

    Highlights: • Introducing to a new degree of freedom in the control of effective barrier height by using Cu. • We want to experimentally observe whether or not the diode continues the ideality in the temperature range of 60–400 K. • We have modified the Richardson’s plot using the temperature dependent values of effective area of the patches. - Abstract: The nanostructure copper selenide thin film has been grown on n-type gallium arsenide substrate by Successive Ionic Layer Adsorption and Reaction (SILAR) method. The film has been characterized by X-ray Diffraction (XRD), Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM) measurements. X-ray diffraction analysis of the film confirms a polycrystalline with preferred orientation. The AFM and SEM micrographs of the film reveal smooth and uniform surface pattern without any dark pits, pinholes and microcracks. The Cu/Cu{sub 3}Se{sub 2}/n-GaAs/In structure has been thermally formed in evaporating system after the SILAR process. The electrical analysis of Cu/Cu{sub 3}Se{sub 2}/n-GaAs/In structure has been investigated by means of current–voltage (I–V) measurements in the temperature range of 60–400 K in dark conditions. The values of barrier height (BH) and ideality factor (n) ranged from 0.21 eV and 4.97 (60 K) to 0.83 eV and 1.14 (400 K), respectively. In the calculations, the electrical parameters of the experimental forward bias I–V characteristics of the Cu/Cu{sub 3}Se{sub 2}/n-GaAs/In with the homogeneity in the 60–400 K range have been explained by means of the thermionic emission (TE), considering Gaussian distribution (GD) of BH with linear bias dependence.

  20. The Paramagnetism of Small Amounts of Mn Dissolved in Cu-Al and Cu-Ge Alloys

    Energy Technology Data Exchange (ETDEWEB)

    Myers, H P; Westin, R

    1963-06-15

    Previous measurements of the valency of Mn in Cu-Zn alloys have been confirmed by measurements with the isoelectronic Cu-Al and Cu-Ge alloys as matrices for Mn. The valency, having the value i in pure copper, decreases slightly with increasing electron to atom ratio attaining the values 0. 9 and 0. 8 at the limiting composition in the Al and Ge alloys respectively. The apparent size of Mn in these alloys is discussed.

  1. The Paramagnetism of Small Amounts of Mn Dissolved in Cu-Al and Cu-Ge Alloys

    International Nuclear Information System (INIS)

    Myers, H.P.; Westin, R.

    1963-06-01

    Previous measurements of the valency of Mn in Cu-Zn alloys have been confirmed by measurements with the isoelectronic Cu-Al and Cu-Ge alloys as matrices for Mn. The valency, having the value i in pure copper, decreases slightly with increasing electron to atom ratio attaining the values 0. 9 and 0. 8 at the limiting composition in the Al and Ge alloys respectively. The apparent size of Mn in these alloys is discussed

  2. Control of segregation in squeeze cast Al-4.5Cu binary alloy

    Energy Technology Data Exchange (ETDEWEB)

    Durrant, G. [Oxford Univ. (United Kingdom). Dept. of Materials; Gallerneault, M. [Alcan International Ltd., Kingston, ON (Canada); Cantor, B. [Oxford Univ. (United Kingdom). Dept. of Materials

    1997-10-01

    The high pressure applied in squeeze casting allows Al alloys of wrought composition to be cast to near net-shape, although their long freezing range leads to the segregation of alloying elements. In this paper we present results on the squeeze casting and gravity casting of a model Al-4.5 wt%Cu alloy. Squeeze cast Al-4.5Cu has a normal segregation pattern with eutectic macrosegregates towards the centre of the billet, whereas gravity cast material has a typical inverse segregation pattern. Normal segregation in squeeze cast Al-4.5Cu is due to large temperature gradients during solidification. Segregation can be minimized by releasing the applied pressure during solidification to allow backflow of the interdendritic fluid, or by the addition of grain refiner to remove the large columnar dendritic growth structure. (orig.)

  3. Molecular characterization of two CuZn-superoxide dismutases in a sea anemone.

    Science.gov (United States)

    Plantivaux, Amandine; Furla, Paola; Zoccola, Didier; Garello, Ginette; Forcioli, Didier; Richier, Sophie; Merle, Pierre-Laurent; Tambutté, Eric; Tambutté, Sylvie; Allemand, Denis

    2004-10-15

    Cnidarians living in symbiosis with photosynthetic cells--called zooxanthellae--are submitted to high oxygen levels generated by photosynthesis. To cope with this hyperoxic state, symbiotic cnidarians present a high diversity of superoxide dismutases (SOD) isoforms. To understand better the mechanism of resistance of cnidarian hosts to hyperoxia, we studied copper- and zinc-containing SOD (CuZnSOD) from Anemonia viridis, a temperate symbiotic sea anemone. We cloned two CuZnSOD genes that we call AvCuZnSODa and AvCuZnSODb. Their molecular analysis suggests that the AvCuZnSODa transcript encodes an extracellular form of CuZnSOD, whereas the AvCuZnSODb transcript encodes an intracellular form. Using in situ hybridization, we showed that both AvCuZnSODa and AvCuZnSODb transcripts are expressed in the endodermal and ectodermal cells of the sea anemone, but not in the zooxanthellae. The genomic flanking sequences of AvCuZnSODa and AvCuZnSODb revealed different putative binding sites for transcription factors, suggesting different modes of regulation for the two genes. This study represents a first step in the understanding of the molecular mechanisms of host animal resistance to permanent hyperoxia status resulting from the photosynthetic symbiosis. Moreover, AvCuZnSODa and AvCuZnSODb are the first SODs cloned from a diploblastic animal, contributing to the evolutionary understanding of SODs.

  4. Effect of annealing process on the heterostructure CuO/Cu2O as a highly efficient photocathode for photoelectrochemical water reduction

    Science.gov (United States)

    Du, Fan; Chen, Qing-Yun; Wang, Yun-Hai

    2017-05-01

    CuO/Cu2O photocathodes were successfully prepared via simply annealing the electrodeposited Cu2O on fluoride doped tin oxide (FTO) substrate. They were characterized by X-ray diffraction, scanning electron microscopy (SEM), transmission electron microscope (TEM), UV-vis absorption spectra and X-ray photoelectron spectroscopy (XPS). The results showed that the heterojunction of CuO/Cu2O was formed during the annealing process and presented the nature of p-type semiconductor. The photocurrent density and photoelectrochemical (PEC) stability of the p-type heterostructure CuO/Cu2O photocathode was improved greatly compared with the pure Cu2O, which was greatly affected by annealing time and temperature. The highest photo current density of -0.451 mA/cm2 and highest stability was obtained via annealing at 650 °C for 15 min (at -0.3 V vs. Ag/AgCl), which gave a remarkable improvement than the as-deposited Cu2O (-0.08 mA/cm2). This suggested that the CuO/Cu2O heterojunction facilitated the electron-hole pair separation and improved the photocathode's current and stability.

  5. Highly stable acyclic bifunctional chelator for {sup 64}Cu PET imaging

    Energy Technology Data Exchange (ETDEWEB)

    Abada, S.; Lecointre, A.; Christine, C.; Charbonniere, L. [CNRS/UDS, EPCM, Strasbourg (France). Lab. d' Ingenierie Appliquee a l' Analyse; Dechamps-Olivier, I. [Univ. de Reims Champagne Ardenne, Reims (France). Group Chimie de Coordination; Platas-Iglesias, C. [Univ. da Coruna (Spain). Dept. de Quimica Fundamental; Elhabiri, M. [CNRS/UDS, EPCM, Strasbourg (France). Lab. de Physico-Chimie Bioinorganique

    2011-07-01

    Ligand L{sup 1}, based on a pyridine scaffold, functionalized by two bis(methane phosphonate)aminomethyl groups, was shown to display a very high affinity towards Cu(II) (log K{sub CuL}=22.7) and selectivity over Ni(II), Co(II), Zn(II) and Ga(III) ({delta} log K{sub ML}>4) as shown by the values of the stability constants obtained from potentiometric measurements. Insights into the coordination mode of the ligand around Cu(II) cation were obtained by UV-Vis absorption and EPR spectroscopies as well as density functional theory (DFT) calculations (B3LYP model) performed in aqueous solution. The results point to a pentacoordination pattern of the metal ion in the fully deprotonated [CuL{sup 1}]{sup 6-} species. Considering the beneficial thermodynamic parameters of this ligand, kinetic experiments were run to follow the formation of the copper(II) complexes, indicating a very rapid formation of the complex, appropriate for {sup 64}Cu complexation. As L{sup 1} represents a particularly interesting target within the frame of {sup 64}Cu PET imaging, a synthetic protocol was developed to introduce a labeling function on the pyridyl moiety of L{sup 1}, thereby affording L{sup 2}, a potential bifunctional chelator (BFC) for PET imaging.

  6. Preparation of Cu@Cu2O Nanocatalysts by Reduction of HKUST-1 for Oxidation Reaction of Catechol

    OpenAIRE

    Seongwan Jang; Chohye Yoon; Jae Myung Lee; Sungkyun Park; Kang Hyun Park

    2016-01-01

    HKUST-1, a copper-based metal organic framework (MOF), has been investigated as a catalyst in various reactions. However, the HKUST-1 shows low catalytic activity in the oxidation of catechol. Therefore, we synthesized Fe3O4@HKUST-1 by layer-by layer assembly strategy and Cu@Cu2O by reduction of HKUST-1 for enhancement of catalytic activity. Cu@Cu2O nanoparticles exhibited highly effective catalytic activity in oxidation of 3,5-di-tert-butylcatechol. Through this method, MOF can maintain the ...

  7. Current transport and electronic states in a,b-axis-oriented YBa2Cu3O7/PrBa2Cu3O7/YBa2Cu3O7 sandwich-type junctions

    International Nuclear Information System (INIS)

    Yoshida, J.; Nagano, T.; Hashimoto, T.

    1996-01-01

    Precise measurement of the temperature and voltage dependence of junction conductance has been carried out for a,b-axis-oriented YBa 2 Cu 3 O 7 /PrBa 2 Cu 3 O 7 /YBa 2 Cu 3 O 7 sandwich-type junctions to investigate the possible origin of Josephson coupling in these junctions. Regardless of the presence or absence of the Josephson effect, most of the junctions exhibited a dip in conductance around zero voltage in their dI/dV profiles at low temperatures. This dI/dV anomaly was attributed to the existence of a minimum in the density of states due to electron-electron interaction in disordered metals in the vicinity of a tunneling barrier within the junctions. The complex temperature dependence of junction conductance was reproduced well by a theoretical model in which both tunneling conduction paths and variable range hopping paths were assumed to exist within the PrBa 2 Cu 3 O 7 barrier layer. No definite evidence of current transport through a small number of localized levels or a metallic conduction path in PrBa 2 Cu 3 O 7 has been confirmed, even for junctions with a 20-nm-thick barrier layer. copyright 1996 The American Physical Society

  8. Flux line patterns in Bi2Sr2Ca1Cu2Ox

    International Nuclear Information System (INIS)

    Weiss, F.; Hardy, V.; Provost, J.; Ruyter, A.; Simon, C.

    1994-01-01

    Results of the defect influence on the flux line lattice in Bi 2 Sr 2 Ca 1 Cu 2 O x single crystals are presented. These crystals, non irradiated or irradiated at GANIL with heavy ions (Pb 56+ , 6 GeV) have been decorated with Ni particles in the superconducting state using the Bitter technique. The defects involved are columnar defects. Resulting decorated flux line patterns have been characterized using scanning electron microscopy and computer image analysis. Disorder of the decorated flux line networks has been found to be strongly dependent on the defect density, which results from the irradiation. In order to characterize this disorder, a method for determining elastic energy terms in the deformation of flux line patterns has been investigated. This method can be applied if Fourier transforms of the decorated flux line patterns exhibit distinct reflections. (orig.)

  9. Safe-by-Design CuO Nanoparticles via Fe-Doping, Cu-O Bond Length Variation, and Biological Assessment in Cells and Zebrafish Embryos.

    Science.gov (United States)

    Naatz, Hendrik; Lin, Sijie; Li, Ruibin; Jiang, Wen; Ji, Zhaoxia; Chang, Chong Hyun; Köser, Jan; Thöming, Jorg; Xia, Tian; Nel, Andre E; Mädler, Lutz; Pokhrel, Suman

    2017-01-24

    The safe implementation of nanotechnology requires nanomaterial hazard assessment in accordance with the material physicochemical properties that trigger the injury response at the nano/bio interface. Since CuO nanoparticles (NPs) are widely used industrially and their dissolution properties play a major role in hazard potential, we hypothesized that tighter bonding of Cu to Fe by particle doping could constitute a safer-by-design approach through decreased dissolution. Accordingly, we designed a combinatorial library in which CuO was doped with 1-10% Fe in a flame spray pyrolysis reactor. The morphology and structural properties were determined by XRD, BET, Raman spectroscopy, HRTEM, EFTEM, and EELS, which demonstrated a significant reduction in the apical Cu-O bond length while simultaneously increasing the planar bond length (Jahn-Teller distortion). Hazard screening was performed in tissue culture cell lines and zebrafish embryos to discern the change in the hazardous effects of doped vs nondoped particles. This demonstrated that with increased levels of doping there was a progressive decrease in cytotoxicity in BEAS-2B and THP-1 cells, as well as an incremental decrease in the rate of hatching interference in zebrafish embryos. The dissolution profiles were determined and the surface reactions taking place in Holtfreter's solution were validated using cyclic voltammetry measurements to demonstrate that the Cu + /Cu 2+ and Fe 2+ /Fe 3+ redox species play a major role in the dissolution process of pure and Fe-doped CuO. Altogether, a safe-by-design strategy was implemented for the toxic CuO particles via Fe doping and has been demonstrated for their safe use in the environment.

  10. Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment

    Science.gov (United States)

    Zhao, Xuewei; Ma, Limin; Wang, Yishu; Guo, Fu

    2018-01-01

    Through-silicon vias (TSV) are facing unexpected thermo-mechanical reliability problems due to the coefficient of thermal expansion (CTE) mismatch between various materials in TSVs. During applications, thermal stresses induced by CTE mismatch will have a negative impact on other devices connecting with TSVs, even leading to failure. Therefore, it is essential to investigate the stress distribution evolution in the TSV structure under thermal loads. In this report, TSVs were heated to 450°C at different heating rates, then cooled down to room temperature after a 30-min dwelling. After heating treatment, TSV samples exhibited different Cu deformation behaviors, including Cu intrusion and protrusion. Based on the different Cu deformation behaviors, stress in Si around Cu vias of these samples was measured and analyzed. Results analyzed by Raman spectrums showed that the stress distribution changes were associated with Cu deformation behaviors. In the area near the Cu via, Cu protrusion behavior might aggravate the stress in Si obtained from the Raman measurement, while Cu intrusion might alleviate the stress. The possible reason was that in this area, the compressive stress σ_{θ } induced by thermal loads might be the dominant stress. In the area far from the Cu via, thermal loads tended to result in a tensile stress state in Si.

  11. New insight on the local structure of Cu2+ ion in the solution of CuBr2 by EXAFS studies

    International Nuclear Information System (INIS)

    Yu Meijuan; Chu Wangsheng; Chen Xing; Wu Ziyu

    2009-01-01

    CuBr 2 solutions at different concentrations were studied by extended X-ray absorption fine structure (EXAFS) at the Cu K edge. In the saturated solution Cu 2+ ions have chemical bonds with 3.0 oxygen atoms and 0.9 Br ion at about 1.96 A and 2.42 A, respectively. It indicates that the CuBr 4 -2 configuration exists with a ratio of 25% under this condition. In the dilute solutions no evidence of Br ions contributions in the first shell around Cu 2+ ions occurs. The almost identical X-ray absorption near edge structure (XANES) and EXAFS characters address similar local environments around Cu 2+ in agreement with results of the EXAFS fit taking into account only the contributions of Cu-O bonds.

  12. Screened coulomb hybrid DFT investigation of band gap and optical absorption predictions of CuVO3, CuNbO3 and Cu 5Ta11O30 materials

    KAUST Repository

    Harb, Moussab

    2014-01-01

    We present a joint theoretical and experimental investigation of the optoelectronic properties of CuVO3, CuNbO3 and Cu 5Ta11O30 materials for potential photocatalytic and solar cell applications. In addition to the experimental results obtained by powder X-ray diffraction and UV-Vis spectroscopy of the materials synthesized under flowing N2 gas at atmospheric pressure via solid-state reactions, the electronic structure and the UV-Vis optical absorption coefficient of these compounds are predicted with high accuracy using advanced first-principles quantum methods based on DFT (including the perturbation theory approach DFPT) within the screened coulomb hybrid HSE06 exchange-correlation formalism. The calculated density of states are found to be in agreement with the UV-Vis diffuse reflectance spectra, predicting a small indirect band gap of 1.4 eV for CuVO3, a direct band gap of 2.6 eV for CuNbO3, and an indirect (direct) band gap of 2.1 (2.6) eV for Cu5Ta 11O30. It is confirmed that the Cu(i)-based multi-metal oxides possess a strong contribution of filled Cu(i) states in the valence band and of empty d0 metal states in the conduction band. Interestingly, CuVO3 with its predicted small indirect band gap of 1.4 eV shows the highest absorption coefficient in the visible range with a broad absorption edge extending to 886 nm. This novel result offers a great opportunity for this material to be an excellent candidate for solar cell applications. © the Partner Organisations 2014.

  13. Evaluation of (64)Cu-labeled DOTA-D-Phe(1)-Tyr (3)-octreotide ((64)Cu-DOTA-TOC) for imaging somatostatin receptor-expressing tumors.

    Science.gov (United States)

    Hanaoka, Hirofumi; Tominaga, Hideyuki; Yamada, Keiich; Paudyal, Pramila; Iida, Yasuhiko; Watanabe, Shigeki; Paudyal, Bishnuhari; Higuchi, Tetsuya; Oriuchi, Noboru; Endo, Keigo

    2009-08-01

    In-111 ((111)In)-labeled octreotide has been clinically used for imaging somatostatin receptor-positive tumors, and radiolabeled octreotide analogs for positron emission tomography (PET) have been developed. Cu-64 ((64)Cu; half-life, 12.7 h) is an attractive radionuclide for PET imaging and is produced with high specific activity using a small biomedical cyclotron. The aim of this study is to produce and fundamentally examine a (64)Cu-labeled octreotide analog, (64)Cu-1,4,7,10-tetraazacyclododecane-1,4,7,10-tetraacetic acid-D: -Phe(1)-Tyr(3)-octreotide ((64)Cu-DOTA-TOC). (64)Cu produced using a biomedical cyclotron was reacted with DOTA-TOC for 30 min at 45 degrees C. The stability of (64)Cu-DOTA-TOC was evaluated in vitro (incubated with serum) and in vivo (blood collected after administration) by HPLC analysis. Biodistribution studies were performed in normal mice by administration of mixed solution of (64)Cu-DOTA-TOC and (111)In-DOTA-TOC and somatostatin receptor-positive U87MG tumor-bearing mice by administration of (64)Cu-DOTA-TOC or (64)Cu-1,4,8,11-tetraazacyclotetradecane-1,4,8,11-tetraacetic acid-octreotide ((64)Cu-TETA-OC). The tumor was imaged using (64)Cu-DOTA-TOC, (64)Cu-TETA-OC, and FDG with an animal PET scanner. (64)Cu-DOTA-TOC can be produced in amounts sufficient for clinical study with high radiochemical yield. (64)Cu-DOTA-TOC was stable in vitro, but time-dependent transchelation to protein was observed after injection into mice. In biodistribution studies, the radioactivity of (64)Cu was higher than that of (111)In in all organs except kidney. In tumor-bearing mice, (64)Cu-DOTA-TOC showed a high accumulation in the tumor, and the tumor-to-blood ratio reached as high as 8.81 +/- 1.17 at 6 h after administration. (64)Cu-DOTA-TOC showed significantly higher accumulation in the tumor than (64)Cu-TETA-OC. (64)Cu-DOTA-TOC PET showed a very clear image of the tumor, which was comparable to that of (18)F-FDG PET and very similar to that of (64)Cu

  14. Evaluation of 64Cu-labeled DOTA-D-Phe1-Tyr3-octreotide (64Cu-DOTA-TOC) for imaging somatostatin receptor-expressing tumors

    International Nuclear Information System (INIS)

    Hanaoka, Hirofumi; Tominaga, Hideyuki; Yamada, Keiich

    2009-01-01

    In-111 ( 111 In)-labeled octreotide has been clinically used for imaging somatostatin receptor-positive tumors, and radiolabeled octreotide analogs for positron emission tomography (PET) have been developed. Cu-64 ( 64 Cu; half-life, 12.7 h) is an attractive radionuclide for PET imaging and is produced with high specific activity using a small biomedical cyclotron. The aim of this study is to produce and fundamentally examine a 64 Cu-labeled octreotide analog, 64 Cu-1,4,7,10-tetraazacyclododecane-1,4,7,10-tetraacetic acid-D-Phe 1 -Tyr 3 -octreotide ( 64 Cu-DOTA-TOC). 64 Cu produced using a biomedical cyclotron was reacted with DOTA-TOC for 30 min at 45 deg C. The stability of 64 Cu-DOTA-TOC was evaluated in vitro (incubated with serum) and in vivo (blood collected after administration) by high performance liquid chromatography (HPLC) analysis. Biodistribution studies were performed in normal mice by administration of mixed solution of 64 Cu-DOTA-TOC and 111 In-DOTA-TOC and somatostatin receptor-positive U87MG tumor-bearing mice by administration of 64 Cu-DOTA-TOC or 64 Cu-1,4,8,11-tetraazacyclotetradecane-1,4,8,11-tetraacetic acid-octreotide ( 64 Cu-TETA-OC). The tumor was imaged using 64 Cu-DOTA-TOC, 64 Cu-TETA-OC, and fluorodeoxyglucose (FDG) with an animal PET scanner. 64 Cu-DOTA-TOC can be produced in amounts sufficient for clinical study with high radiochemical yield. 64 Cu-DOTA-TOC was stable in vitro, but time-dependent transchelation to protein was observed after injection into mice. In biodistribution studies, the radioactivity of 64 Cu was higher than that of 111 In in all organs except kidney. In tumor-bearing mice, 64 Cu-DOTA-TOC showed a high accumulation in the tumor, and the tumor-to-blood ratio reached as high as 8.81±1.17 at 6 h after administration. 64 Cu-DOTA-TOC showed significantly higher accumulation in the tumor than 64 Cu-TETA-OC. 64 Cu-DOTA-TOC PET showed a very clear image of the tumor, which was comparable to that of 18 F-FDG PET and

  15. Effect of cupric salts (Cu (NO{sub 3}){sub 2}, CuSO4{sub ,} Cu(CH{sub 3}COO){sub 2}) on Cu{sub 2}(OH)PO{sub 4} morphology for photocatalytic degradation of 2,4-dichlorophenol under near-infrared light irradiation

    Energy Technology Data Exchange (ETDEWEB)

    Hu, Chao; Li, Pei; Zhang, Wei; Che, Yanhao; Sun, Yaxin; Chi, Fangli; Ran, Songlin; Liu, Xianguo; Lv, Yaohui, E-mail: yaohui2015@163.com [School of Materials Science and Engineering, Anhui Key Laboratory of Metal Materials and Processing, Anhui University of Technology (China)

    2017-03-15

    Cu{sub 2}(OH)PO{sub 4} microstructures were synthesized by the hydrothermal method using three different types cupric salts (Cu (NO{sub 3}){sub 2}, CuSO{sub 4}, Cu(CH{sub 3}COO){sub 2}) as raw materials. The X-ray diffraction (XRD), scanning electron microscopy (SEM) and UV-visible-NIR absorption spectra were used to characterize the as-obtained products. The different anions (SO{sub 4}{sup 2-}, CH{sub 3}COO-, NO{sub 3-}) have different shapes and polarities, which can generate different interactions in reaction bath, induced the difference of structure and morphology of the prepared Cu{sub 2}(OH)PO{sub 4}. The Cu{sub 2}(OH)PO{sub 4} microstructures prepared form Cu(NO{sub 3}){sub 2} ·3H{sub 2}O showed the best photocatalytic activity induced by near-infrared light to degrade 2,4-dichlorophenol (2,4-DCP) solution. Our work suggests that the active morphological surfaces as well as different coordination environments for the metal ions has an important influence on the photocatalytic performance of Cu{sub 2}(OH)PO{sub 4} microstructure. (author)

  16. Deposition of CuIn(Se,S)2 thin films by sulfurization of selenized Cu/In alloys

    International Nuclear Information System (INIS)

    Sheppard, C.J.; Alberts, V.; Bekker, W.J.

    2004-01-01

    The relatively small band gap values (close to 1eV) of CuInSe 2 thin films limits the conversion efficiencies of completed CuInSe 2 /CdS/ZnO solar cell devices. In the case of traditional two-stage growth techniques, limited success has been achieved to increase the band gap by substituting indium with gallium. In this study, sputtered copper-indium alloys were exposed to a H 2 Se/Ar atmosphere under defined conditions in order to produce partially reacted CuInSe 2 structures. These films were subsequently exposed to a H 2 S/Ar atmosphere to produce monophasic CuIn(Se, S) 2 quaternary alloys. The homogeneous incorporation of S into CuInSe 2 led to a systematic shift in the lattice parameters and band gap of the ab- sorber films. From these studies optimum selenization/sulfurization conditions were determined for the deposition of homogeneous CuIn(Se,S) 2 thin films with an optimum band gap values between 1.15 and 1.2 eV. (copyright 2004 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  17. Potential thermoelectric performance of hole-doped Cu2O

    International Nuclear Information System (INIS)

    Chen, Xin; Parker, David; Du, Mao-Hua; Singh, David J

    2013-01-01

    High thermoelectric performance in oxides requires stable conductive materials that have suitable band structures. Here we show, based on an analysis of the thermopower and related properties using first-principles calculations and Boltzmann transport theory in the relaxation time approximation, that hole-doped Cu 2 O may be such a material. We find that hole-doped Cu 2 O has a high thermopower of above 200 μV K −1 even with doping levels as high as 5.2 × 10 20 cm −3 at 500 K, mainly attributed to the heavy valence bands of Cu 2 O. This is reminiscent of the cobaltate family of high-performance oxide thermoelectrics and implies that hole-doped Cu 2 O could be an excellent thermoelectric material if suitably doped. (paper)

  18. Deciphering ligands' interaction with Cu and Cu2O nanocrystal surfaces by NMR solution tools.

    Science.gov (United States)

    Glaria, Arnaud; Cure, Jérémy; Piettre, Kilian; Coppel, Yannick; Turrin, Cédric-Olivier; Chaudret, Bruno; Fau, Pierre

    2015-01-12

    The hydrogenolysis of [Cu2{(iPrN)2(CCH3)}2] in the presence of hexadecylamine (HDA) or tetradecylphosphonic acid (TDPA) in toluene leads to 6-9 nm copper nanocrystals. Solution NMR spectroscopy has been used to describe the nanoparticle surface chemistry during the dynamic phenomenon of air oxidation. The ligands are organized as multilayered shells around the nanoparticles. The shell of ligands is controlled by both their intermolecular interactions and their bonding strength on the nanocrystals. Under ambient atmosphere, the oxidation rate of colloidal copper nanocrystals closely relies on the chemical nature of the employed ligands (base or acid). Primary amine molecules behave as soft ligands for Cu atoms, but are even more strongly coordinated on surface Cu(I) sites, thus allowing a very efficient corrosion protection of the copper core. On the contrary, the TDPA ligands lead to a rapid oxidation rate of Cu nanoparticles and eventually to the re-dissolution of Cu(II) species at the expense of the nanocrystals. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  19. Thermoluminescence dosimetry properties of new Cu doped CaF(2) nanoparticles.

    Science.gov (United States)

    Zahedifar, M; Sadeghi, E

    2013-12-01

    Nanoparticles of Cu-doped calcium fluoride were synthesised by using the hydrothermal method. The structure of the prepared nanomaterial was characterised by the X-ray diffraction (XRD) pattern and energy dispersive spectrometer. The particle size of 36 nm was calculated from the XRD data. Its shape and size were also observed by scanning electron microscope. Thermoluminescence (TL) and photoluminescence of the produced phosphor were also considered. The computerised glow curve deconvolution procedure was used to identify the number of glow peaks included in the TL glow curve of the CaF2:Cu nanoparticles. The TL glow curve contains two overlapping glow peaks at ∼413 and 451 K. The TL response of this phosphor was studied for different Cu concentrations and the maximum sensitivity was found at 1 mol% of Cu impurity. Other dosimetric characteristics of the synthesised nanophosphor are also presented and discussed.

  20. Controlled Synthesis of Heterostructured SnO2-CuO Composite Hollow Microspheres as Efficient Cu-Based Catalysts for the Rochow Reaction

    Directory of Open Access Journals (Sweden)

    Hezhi Liu

    2018-04-01

    Full Text Available In this work, we report the design and synthesis of a series of heterostructured SnO2-CuO hollow microspherical catalysts (H-SnO2(x-CuO, x is the weight ratio of Sn/Cu for the Rochow reaction. The microspherical catalysts with nanosheets and nanoparticles as building blocks were prepared by a facile one-pot hydrothermal method coupled with calcination. When tested for the Rochow reaction, the prepared H-SnO2(0.2-CuO composite exhibited higher dimethyldichlorosilane selectivity (88.2% and Si conversion (36.7% than the solid CuO, hollow CuO and other H-SnO2(x-CuO microspherical samples, because in the former there is a stronger synergistic interaction between CuO and SnO2.

  1. Interaction of RBa sub 2 Cu sub 3 O sub x (R = Y or Nd) coatings with alumina and zirconia substrates. [YBaCuO; NdBaCuO

    Energy Technology Data Exchange (ETDEWEB)

    Moreau, C; Parent, L; Champagne, B; Dallaire, S [National Research Council of Canada, Industrial Materials Research Inst., Boucherville, PQ (Canada)

    1989-12-10

    As-deposited YBa{sub 2}Cu{sub 3}O{sub x} coatings by plasma spraying are not superconducting because of their inadequate crystalline structure and low oxygen content. A post-deposition heat treatment in oxygen is required to restore the appropriate superconducting YBa{sub 2}Cu{sub 3}O{sub x} structure. During heat treatment, deterimental reactions between coatings and substrates may occur and lead to the degradation or destruction of the coating superconducting properties. In the present paper, interactions of RBa{sub 2}Cu{sub 3}O{sub x} (R = Y, Nd) coatings with alumina and zirconia substrates are examined. The modifications of the coating electrical properties and microstructure are studied using X-ray diffraction, energy dispersive X-ray analysis and resistivity measurements. Coating degradation is shown to occur by diffusion of the barium atoms out of the coating leading to the formation of Y{sub 2}BaCuO{sub 5} and CuO in yttrium-based coatings, and to the formation of nonstoichiometric Nd{sub 1+y}Ba{sub 2-y}Cu{sub 3}O{sub x} and CuO in neodymium-based coatings. The coating degradation is more important on alumina substrates that on zirconia substrates for both yttrium- and neodymium-based coatings. (orig.).

  2. Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects

    DEFF Research Database (Denmark)

    Brincker, Mads; Söhl, Stefan; Eisele, Ronald

    2017-01-01

    As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems...

  3. Initial stages of benzotriazole adsorption on the Cu(111) surface

    Science.gov (United States)

    Grillo, Federico; Tee, Daniel W.; Francis, Stephen M.; Früchtl, Herbert; Richardson, Neville V.

    2013-05-01

    Benzotriazole (BTAH) has been used as a copper corrosion inhibitor since the 1950s; however, the molecular level detail of how inhibition occurs remains a matter of debate. The onset of BTAH adsorption on a Cu(111) single crystal was investigated via scanning tunnelling microscopy (STM), vibrational spectroscopy (RAIRS) and supporting DFT modelling. BTAH adsorbs as anionic (BTA-), CuBTA is a minority species, while Cu(BTA)2, the majority of the adsorbed species, form chains, whose sections appear to diffuse in a concerted manner. The copper surface appears to reconstruct in a (2 × 1) fashion.Benzotriazole (BTAH) has been used as a copper corrosion inhibitor since the 1950s; however, the molecular level detail of how inhibition occurs remains a matter of debate. The onset of BTAH adsorption on a Cu(111) single crystal was investigated via scanning tunnelling microscopy (STM), vibrational spectroscopy (RAIRS) and supporting DFT modelling. BTAH adsorbs as anionic (BTA-), CuBTA is a minority species, while Cu(BTA)2, the majority of the adsorbed species, form chains, whose sections appear to diffuse in a concerted manner. The copper surface appears to reconstruct in a (2 × 1) fashion. Electronic supplementary information (ESI) available: Calculated IR spectra, RAIRS assignments, modeling details, statistics on diffusion, experimental details, additional STM images, movie low coverage diffusing species. See DOI: 10.1039/c3nr00724c

  4. Structural, dynamical & electronic properties of CaCuO{sub 2}

    Energy Technology Data Exchange (ETDEWEB)

    Agrawal, B.K.; Agrawal, S. [Allahabad Univ. (India)

    1994-12-31

    The scalar relativistic version of an accurate first principles full potential self- consistent linearized muffin tin orbital (LMTO) method has been employed for describing the physical properties of the parent system of the high-Tc oxide superconductors, i.e., CaCuO2. The presently employed modified version of the LMTO method is quite fast and goes beyond the usual LMTO-ASA method in the sense that it permits a completely general shape of the potential and the charge density. Also, in contrast to LMTO-ASA, the present method is also capable of treating distorted lattice structures accurately. The calculated values of the lattice parameters of pure CaCuO2 lie within 3% of the experimentally measured values for the Sr-doped system Ca(.86)Sr(.14)CuO(2). The computed electronic structures and the density of states is quite similar to those of the other oxide superconductors, except of their three- dimensional character because of the presence of strong coupling between the closely spaced CuO2 layers. The van Hove singularity peak appears slightly below the Fermi level and a small concentration of oxygenation /or/ substitutional doping may pin it as the Fermi level. The calculated frequencies for some symmetric frozen phonons for undoped CaCuO2 are quite near to the measured data for the Sr-doped CaCuO2.

  5. Resistive switching of Cu/Cu2O junction fabricated using simple thermal oxidation at 423 K for memristor application

    Science.gov (United States)

    Ani, M. H.; Helmi, F.; Herman, S. H.; Noh, S.

    2018-01-01

    Recently, extensive researches have been done on memristor to replace current memory storage technologies. Study on active layer of memristor mostly involving n-type semiconductor oxide such as TiO2 and ZnO. This paper highlight a simple water vapour oxidation method at 423 K to form Cu/Cu2O electronic junction as a new type of memristor. Cu2O is a p-type semiconductor oxide, was used as the active layer of memristor. Cu/Cu2O/Au memristor was fabricated by thermal oxidation of copper foil, followed by sputtering of gold. Structural, morphological and memristive properties were characterized using XRD, FESEM, and current-voltage, I-V measurement respectively. Its memristivity was indentified by pinch hysteresis loop and measurement of high resistance state (HRS) and low resistance state (LRS) of the sample. The Cu/Cu2O/Au memristor demonstrates comparable performances to previous studies using other methods.

  6. Non-destructive testing of CFC/Cu joints

    International Nuclear Information System (INIS)

    Casalegno, V.; Ferraris, M.; Salvo, M.; Vesprini, R.; Merola, M.

    2006-01-01

    Reliable non-destructive tests (NDT) are fundamental for the manufacturing of ITER components, especially for high heat flux plasma facing components. NDT include various techniques, which allow inspection of a component without impairing serviceability; it's important to detect and characterize defects (type, size and position) as well as the set-up of acceptance standards in order to predict their influence on the component performance in service conditions. The present study shows a description of NDT used to assess the manufacturing quality of CFC (carbon fibre reinforced carbon matrix composites)/Cu/CuCrZr joints. In the ITER divertor, armor tiles made of CFC are joined to the cooling structure made of precipitation hardened copper alloy CuCrZr; a soft pure Cu interlayer is required between the heat sink and the armour in order to mitigate the stresses at the joint interface. NDT on CFC/Cu joint are difficult because of the different behavior of CFC and copper with regard to physical excitations (e.g. ultrasonic wave) used to test the component; furthermore the response to this input must be accurately studied to identify the detachment of CFC tiles from Cu alloy. The inspected CFC/Cu/CuCrZr joints were obtained through direct casting of pure Cu on modified CFC surface and subsequently through brazing of CFC/Cu joints to CuCrZr by a Cu-based alloy. Different non-destructive methods were used for inspecting these joints: lock-in thermography, ultrasonic inspections, microtomography and microradiography. The NDT tests were followed by metallographic investigation on the samples, since the reliability of a certain non destructive test can be only validated by morphological evidence of the detected defects. This study will undertake a direct comparison of NDT used on CFC/Cu joints in terms of real flaws presence. The purpose of this work is to detect defects at the joining interface as well as in the cast copper ( for instance voids). The experimental work was

  7. Development of a Low-Cost TiO2/CuO/Cu Solar Cell by using Combined Spraying and Electroplating Method

    Directory of Open Access Journals (Sweden)

    Mamat Rokhmat

    2018-03-01

    Full Text Available A simple method is proposed to develop a low-cost TiO2/CuO/Cu based solar cell. The cell is made by employing a lower grade (technical grade of TiO2 as the active material. CuO powder is synthesized using a wet chemical method and mixed with TiO2 powder to give impurity to the TiO2. A layer of TiO2/CuO is then deposited onto fluorin-doped tin oxide (FTO by spraying. Copper particles are grown on the spaces between the TiO2 and/or CuO particles by electroplating for more feasible electron migration. The TiO2/CuO/Cu solar cell is finalized by sandwiching a polymer electrolyte between the film and the counter electrode. Current-voltage measurement was performed for various parameters, such as the molarity of NaOH for producing CuO particles, the weight ratio of CuO over TiO2, and the current in the electroplating process. A highest efficiency of 1.40% and a fill factor of 0.37 were achieved by using this combined spray and electroplating method.

  8. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    Directory of Open Access Journals (Sweden)

    Zhuhao Gong

    2018-02-01

    Full Text Available A radio-frequency micro-electro-mechanical system (RF MEMS wafer-level packaging (WLP method using pre-patterned benzo-cyclo-butene (BCB polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to generate the housing cavity, the BCB sealing ring was protected by a sputtered Cr/Au (chromium/gold layer. The average measured thickness of the BCB layer was 5.9 μm. In contrast to the conventional methods of spin-coating BCB after fabricating cavities, the pre-patterned BCB method presented BCB bonding layers with better quality on severe topography surfaces in terms of increased uniformity of thickness and better surface flatness. The observation of the bonded layer showed that no void or gap formed on the protruding coplanar waveguide (CPW lines. A shear strength test was experimentally implemented as a function of the BCB widths in the range of 100–400 μm. The average shear strength of the packaged device was higher than 21.58 MPa. A RF MEMS switch was successfully packaged using this process with a negligible impact on the microwave characteristics and a significant improvement in the lifetime from below 10 million to over 1 billion. The measured insertion loss of the packaged RF MEMS switch was 0.779 dB and the insertion loss deterioration caused by the package structure was less than 0.2 dB at 30 GHz.

  9. Numerical study of the enhancement of heat transfer for hybrid CuO-Cu Nanofluids flowing in a circular pipe.

    Science.gov (United States)

    Balla, Hyder H; Abdullah, Shahrir; Mohdfaizal, Wan; Zulkifli, Rozli; Sopian, Kamaruzaman

    2013-01-01

    A numerical simulation model for laminar flow of nanofluids in a pipe with constant heat flux on the wall was built to study the effect of the Reynolds number on convective heat transfer and pressure loss. The investigation was performed for hybrid nanofluids consisting of CuO-Cu nanoparticles and compared with CuO and Cu in which the nanoparticles have a spherical shape with size 50, 50, 50nm respectively. The nanofluids were prepared, following which the thermal conductivity and dynamic viscosity were measured for a range of temperatures (10 -60°C). The numerical results obtained were compared with the existing well-established correlation. The prediction of the Nusselt number for nanofluids agrees well with the Shah correlation. The comparison of heat transfer coefficients for CuO, Cu and CuO-Cu presented an increase in thermal conductivity of the nanofluid as the convective heat transfer coefficient increased. It was found that the pressure loss increases with an increase in the Reynolds number, nanoparticle density and particle volume fraction. However, the flow demonstrates enhancement in heat transfer which becomes greater with an increase in the Reynolds number for the nanofluid flow.

  10. Insight on a novel layered semiconductors: CuTlS and CuTlSe

    Energy Technology Data Exchange (ETDEWEB)

    Aliev, Ziya S., E-mail: ziyasaliev@gmail.com [Institute of Catalysis and Inorganic Chemistry, ANAS, H.Javid ave. 113, AZ1143 Baku (Azerbaijan); Institute of Physics, ANAS, H.Javid ave. 131, AZ1143 Baku (Azerbaijan); Donostia International Physics Center (DIPC), 20080 San Sebastian (Spain); Zúñiga, Fco. Javier [Departamento de Física de la Materia Condensada, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Apdo. 644, 48080 Bilbao (Spain); Koroteev, Yury M. [Institute of Strength Physics and Materials Science, Russian Academy of Sciences, Siberian Branch, 634055 Tomsk (Russian Federation); Tomsk State University, Tomsk, 634050 (Russian Federation); Breczewski, Tomasz [Departamento de Física de la Materia Condensada, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Apdo. 644, 48080 Bilbao (Spain); Babanly, Nizamaddin B. [Institute of Catalysis and Inorganic Chemistry, ANAS, H.Javid ave. 113, AZ1143 Baku (Azerbaijan); Amiraslanov, Imamaddin R. [Institute of Physics, ANAS, H.Javid ave. 131, AZ1143 Baku (Azerbaijan); Politano, Antonio [Department of Physics, University of Calabria, 87036 Rende (CS) (Italy); Madariaga, Gotzon [Departamento de Física de la Materia Condensada, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Apdo. 644, 48080 Bilbao (Spain); Babanly, Mahammad B. [Institute of Catalysis and Inorganic Chemistry, ANAS, H.Javid ave. 113, AZ1143 Baku (Azerbaijan); and others

    2016-10-15

    Single crystals of the ternary copper compounds CuTlS and CuTlSe have been successfully grown from stoichiometric melt by using vertical Bridgman-Stockbarger method. The crystal structure of the both compounds has been determined by powder and single crystal X-Ray diffraction. They crystallize in the PbFCl structure type with two formula units in the tetragonal system, space group P4/nmm, a=3.922(2); c=8.123(6); Z=2 and a=4.087(6); c=8.195(19) Å; Z=2, respectively. The band structure of the reported compounds has been analyzed by means of full-potential linearized augmented plane-wave (FLAPW) method based on the density functional theory (DFT). Both compounds have similar band structures and are narrow-gap semiconductors with indirect band gap. The resistivity measurements agree with a semiconductor behavior although anomalies are observed at low temperature. - Graphical abstract: The crystal structures of CuTl and CuTlSe are isostructural with the PbFCl-type and the superconductor LiFeAs-type tetragonal structure. The band structure calculations confirmed that they are narrow-gap semiconductors with indirect band gaps of 0.326 and 0.083 eV. The resistivity measurements, although confirming the semiconducting behavior of both compounds exhibit unusual anomalies at low temperatures. - Highlights: • Single crystals of CuTlS and CuTlSe have been successfully grown by Bridgman-Stockbarger method. • The crystal structure of the both compounds has been determined by single crystal XRD. • The band structure of the both compounds has been analyzed based on the density functional theory (DFT). • The resistivity measurements have been carried out from room temperature down to 10 K.

  11. Role of Cu During Sintering of Fe0.96Cu0.04 Nanoparticles

    Science.gov (United States)

    Sivaprahasam, D.; Sriramamurthy, A. M.; Bysakh, S.; Sundararajan, G.; Chattopadhyay, K.

    2018-04-01

    Nanoparticle agglomerates of passivated Fe ( n-Fe) and Fe0.96Cu0.04 ( n-Fe0.96Cu0.04), synthesized through the levitational gas condensation (LGC) process, were compacted and sintered using the conventional powder metallurgy method. The n-Fe0.96Cu0.04 agglomerates produced lower green density than n-Fe, and when compacted under pressure beyond 200 MPa, they underwent lateral cracking during ejection attributed to the presence of a passive oxide layer. Sintering under dynamic hydrogen atmosphere can produce a higher density of compact in n-Fe0.96Cu0.04 in comparison to n-Fe. Both the results of dilatometry and thermogravimetric (TG) measurements of the samples under flowing hydrogen revealed enhancement of the sintering process as soon as the reduction of oxide layers could be accomplished. The shrinkage rate of n-Fe0.96Cu0.04 reached a value three times higher than n-Fe at a low temperature of 723 K (450 °C) during heating. This enhanced shrinkage rate was the manifestation of accumulation of Cu at the surface of the particles. The formation of a thin-surface melted layer enriched with copper during heating to isothermal holding facilitated as a medium of transport for diffusion of the elements. The compacts produced by sintering at 773 K (500 °C), with relative density 82 pct, were found to be unstable and oxidized instantly when exposed to ambient atmosphere. The stable compacts of density more than 92 pct with 300- to 450-nm grain size could only be produced when sintering was carried out at 973 K (700 °C) and beyond. The 0.22 wt pct residual oxygen obtained in the sintered compact is similar to what is used for conventional ferrous powder metallurgy products.

  12. Cu{sub x}Y compounds as thin films: crystallographic and compositional analyses of yttrium rich phases

    Energy Technology Data Exchange (ETDEWEB)

    Engels, J.M.; Blaise, G. [Paris-11 Univ., 91 - Orsay (France). Lab. de Physique des Solides; Gasgnier, M. [Laboratoire des Ractions Slectives sur Support, Bt. 410, Universit Paris-Sud, 91405, Orsay CEDEX (France)

    1998-03-06

    The interdiffusion of Y films deposited onto Cu substrate by flash evaporation and sputtering was studied (concentration profiles, X-ray and electron diffraction patterns) in the temperature range 373-553 K. In samples deposited by flash evaporation the first phase to be detected is CuY at 393 K. At higher temperatures an intermediate phase, close to the Cu{sub 3}Y{sub 2} compound, is formed before the Cu{sub 2}Y stoichiometric phase is produced at 513 K. Crystallographic data confirm the formation of this intermediate Cu{sub 3}Y{sub 2} phase (orthorhombic unit-cell) as resulting from the reaction CuY+Cu{sub 2}Y{yields}Cu{sub 3}Y{sub 2}. The results are identical for sputtered Y films deposited under a cryogenic vacuum (2-5 x 10{sup -7} Pa). When Y is deposited under a standard vacuum (2-5 x 10{sup -6} Pa), the influence of a diffusion barrier at the Cu-Y interface is noticed. This influence is characterized in the concentration profiles by an Y concentration hump at the Cu-Y interface and a depletion of Y at the front of the profile. Three main phases are observed. They correspond to the Cu{sub 5}Y{sub 2}, Cu{sub 2}Y and Cu{sub 3}Y{sub 2} compounds. (orig.) 24 refs.

  13. Levels of Processing with Free and Cued Recall and Unilateral Temporal Lobe Epilepsy

    Science.gov (United States)

    Lespinet-Najib, Veronique; N'Kaoua, Bernard; Sauzeon, Helene; Bresson, Christel; Rougier, Alain; Claverie, Bernard

    2004-01-01

    This study investigates the role of the temporal lobes in levels-of-processing tasks (phonetic and semantic encoding) according to the nature of recall tasks (free and cued recall). These tasks were administered to 48 patients with unilateral temporal epilepsy (right ''RTLE''=24; left ''LTLE''=24) and a normal group (n=24). The results indicated…

  14. Synthesis and Characterization of Nano-Crystalline Cu and Pb0.5-Cu0.5- ferrites by Mechanochemical Method and Their Electrical and Gas Sensing Properties

    Directory of Open Access Journals (Sweden)

    V. B. GAIKWAD

    2011-11-01

    Full Text Available In the present communication, we have reported the synthesis of nanocrystalline ferrites of the type CuFe2O4 and Pb0.5Cu0.5Fe2O4 by mechanochemical alloying at 960 0C. The samples prepared were characterized by X-ray diffraction (XRD, VSM, FT-IR, UV-DRS, and SEM. The average particle size was determined by XRD pattern using Scherrer equation and it is 7.295 nm, 4.484 nm for CuFe2O4, and Pb0.5Cu0.5Fe2O4. The surface morphology of the samples is characterized by scanning electron microscopy (SEM. Magnetic studies were carried out using vibrating sample magnetometer (VSM and shows very high coercive field for the mixed ferrite. UV-DRS studies were performed to investigate the band gap of synthesized nanocrystalline material. Electrical properties show semiconducting nature of synthesized ferrites. The thick films of the material were prepared by screen printing method. The gas sensing properties were studied towards reducing gases like CO, NH3 and H2S and it was revealed that CuFe2O4 is the most sensitive and selective to H2S gas at relatively lower operating temperature 200 0C. Furthermore Pb0.5Cu0.5Fe2O4 also shows the response to H2S at operating temperature 300 0C.

  15. Exchange correlation length and magnetoresistance in Fe-Cu and Fe-Cu-Ni melt-spun ribbons

    International Nuclear Information System (INIS)

    El Ghannami, M.; Gomez-Polo, C.; Rivero, G.; Hernando, A.

    1994-01-01

    The magnetic properties of Fe 30 Cu 70 melt-spun ribbons are reported for the first time. In the as-cast state, the microstructure consists of b.c.c.-Fe grains immersed in a Cu-rich matrix. However, the addition of a small percentage of Ni gives rise to the appearance of new Cu-Fe-Ni phases. Under suitable thermal treatments, the microstructure of both alloys evolves towards a complete phase segregation in b.c.c-Fe and f.c.c.-Cu immiscibles phases. The temperature dependence of the magnetic properties is analysed and related to the microstructural changes produced during the thermal treatments. Remarkable magneto-resistance effects have been observed in both as-cast alloys, with maximum values of the order of 6% at low measuring temperatures. (orig.)

  16. Magneto-optical response of Cu/NiFe/Cu nanostructure under surface plasmon resonance

    Energy Technology Data Exchange (ETDEWEB)

    Mahmoodi, S. [Institute of Nanoscience and Nanotechnology, University of Kashan, Kashan, 87317 (Iran, Islamic Republic of); Moradi, M., E-mail: m.moradi@kashanu.ac.ir [Institute of Nanoscience and Nanotechnology, University of Kashan, Kashan, 87317 (Iran, Islamic Republic of); Mohseni, S.M. [Department of Physics, Shahid Beheshti University, Evin, Tehran, 19839 (Iran, Islamic Republic of)

    2016-12-15

    In this paper, we present theoretical and experimental studies about the surface plasmon resonance effects on the magneto-optical activity of Cu/NiFe/Cu nanostructures as a function of layers thickness and light incident angle. Device fabrication was done by an oblique deposition technique with RF magnetron sputtering to carefully cover fine step thickness variation of all constituted layers. Angular dependent transverse Kerr response of samples was measured in the Kretschmann configuration at a fixed wavelength of 632 nm. At an optimum layer thickness and incident angle, significant amplification of the transverse Kerr effect was observed. Enhancement in the transverse Kerr effect can be realized by hybridization of surface plasmon excitation and cavity resonance in the plasmonic nanostructure. Experimental results were in qualitative agreement with modeling based on the 4×4 transfer matrix formalism. - Highlights: • Large magneto-optical response in Cu/NiFe/Cu multilayer nanostructure is achieved. • Layer thickness and sequence are studied to find large transverse Kerr signal. • Hybridization of surface plasmon excitation and cavity resonance were done.

  17. Glass-formation and hardness of Cu-Y alloys

    International Nuclear Information System (INIS)

    Satta, Marta; Rizzi, Paola; Baricco, Marcello

    2009-01-01

    Metallic glasses exhibit particularly attractive mechanical properties, like high stresses to fracture and large elastic strain (up to 2%), but they show generally low plasticity. Aim of this work is to investigate the glass forming range in the Cu-Y system, in order to form the ductile CuY phase (CsCl structure) upon crystallization. Cu 58 Y 42 , Cu 50 Y 50 and Cu 33 Y 67 alloys have been prepared by rapid solidification and copper mould casting, obtaining ribbons and cylindrical shaped ingots, with diameter of 2 mm. Fully amorphous, partially amorphous and fully crystalline samples have been obtained for different compositions and quenching conditions. In some cases, the X-ray diffraction results, analysed using the Rietveld method, showed CuY nanocrystals embedded in an amorphous matrix. The microstructure was studied by transmission electron microscopy (TEM) and the presence of nanocrystals of the ductile phase CuY has been confirmed. Microhardness results showed a softening of the amorphous phase due to the presence of CuY nanocrystals and a hardening due to the Cu 2 Y phase.

  18. Annealing effect on thermal conductivity and microhardness of carbon nanotube containing Se80Te16Cu4 glassy composites

    Science.gov (United States)

    Upadhyay, A. N.; Tiwari, R. S.; Singh, Kedar

    2018-02-01

    This study deals with the effect of thermal annealing on structural/microstructural, thermal and mechanical behavior of pristine Se80Te16Cu4 and carbon nanotubes (CNTs) containing Se80Te16Cu4 glassy composites. Pristine Se80Te16Cu4, 3 and 5 wt%CNTs-Se80Te16Cu4 glassy composites are annealed in the vicinity of glass transition temperature to onset crystallization temperature (340-380 K). X-ray diffraction (XRD) pattern revealed formation of polycrystalline phases of hexagonal CuSe and trigonal selenium. The indexed d-values in XRD patterns are in well conformity with the d-values obtained after the indexing of the ring pattern of selected area electron diffraction pattern of TEM images. The SEM investigation exhibited that the grain size of the CNTs containing Se80Te16Cu4 glassy composites increased with increasing annealing temperature and decreased at further higher annealing temperature. Thermal conductivity, microhardness exhibited a substantial increase with increasing annealing temperature of 340-360 K and slightly decreases for 380 K. The variation of thermal conductivity and microhardness can be explained by cross-linking formation and voids reduction.

  19. Synthesis of Cu and Ce co-doped ZnO nanoparticles: crystallographic, optical, molecular, morphological and magnetic studies

    Directory of Open Access Journals (Sweden)

    Rawat Mohit

    2017-07-01

    Full Text Available In the present research work, crystallographic, optical, molecular, morphological and magnetic properties of Zn1-xCuxO (ZnCu and Zn1-x-yCeyCuxO (ZnCeCu nanoparticles have been investigated. Polyvinyl alcohol (PVA coated ZnCu and ZnCeCu nanoparticles have been synthesized by chemical sol-gel method and thoroughly studied using various characterization techniques. X-ray diffraction pattern indicates the wurtzite structure of the synthesized ZnCu and ZnCeCu particles. Transmission electron microscopy analysis shows that the synthesized ZnCu and ZnCeCu particles are of spherical shape, having average sizes of 27 nm and 23 nm, respectively. The incorporation of Cu and Ce in the ZnO lattice has been confirmed through Fourier transform infrared spectroscopy. Room temperature photoluminescence spectra of the ZnO doped with Cu and co-doped Ce display two emission bands, predominant ultra-violet near-band edge emission at 409.9 nm (3 eV and a weak green-yellow emission at 432.65 nm (2.27 eV. Room temperature magnetic study confirms the diamagnetic behavior of ZnCu and ferromagnetic behavior of ZnCeCu.

  20. Resolved nuclear hyperfine structure of muonium in CuCl by means of muon level-crossing resonance

    International Nuclear Information System (INIS)

    Schneider, J.W.; Keller, H.; Odermatt, W.; Puempin, B.; Savic, I.M.; Simmler, H.; Dodds, S.A.; Estle, T.L.; Duvarney, R.C.; Chow, K.; Kadono, R.; Kiefl, R.F.; Li, Q.; Riseman, T.M.; Zhou, H.; Lichti, R.L.; Schwab, C.

    1991-01-01

    Detailed muon level-crossing resonance measurements of Mu I and Mu II centres in single crystals of CuCl are presented. The hyperfine and nuclear hyperfine parameters of the closest two shells of nuclei are remarkably similar for the two centres, indicating that both are located at the same tetrahedral interstitial site with four Cu nearest neighbours and six Cl next-nearest neighbours. About 30% of the total unpaired-electron spin density is located on the muon, about 60% on the four nearest neighbours and the rest on the six next-nearest neighbours, with nothing observable for any other shell. (orig.)

  1. Antimicrobial activities of CuO films deposited on Cu foils by solution chemistry

    Energy Technology Data Exchange (ETDEWEB)

    Ekthammathat, Nuengruethai [Department of Chemistry, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Thongtem, Titipun, E-mail: ttpthongtem@yahoo.com [Department of Chemistry, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Materials Science Research Center, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Thongtem, Somchai, E-mail: schthongtem@yahoo.com [Department of Physics and Materials Science, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Materials Science Research Center, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand)

    2013-07-15

    Monoclinic CuO thin films on Cu foils were successfully synthesized by a simple wet chemical method in alkaline solution with the pH of 13 at room temperature for different lengths of time. The as-synthesized thin films were characterized by X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM) and selected area electron diffraction (SAED). Formation mechanism of the phase and morphologies was also discussed according to the experimental results. In this research, assemblies of pure CuO nanospindles with different orientations containing in the thin film synthesized for 2 weeks with 400 nm and 413 nm violet emissions showed better antimicrobial activity against S. aureus than E. coli.

  2. Antimicrobial activities of CuO films deposited on Cu foils by solution chemistry

    International Nuclear Information System (INIS)

    Ekthammathat, Nuengruethai; Thongtem, Titipun; Thongtem, Somchai

    2013-01-01

    Monoclinic CuO thin films on Cu foils were successfully synthesized by a simple wet chemical method in alkaline solution with the pH of 13 at room temperature for different lengths of time. The as-synthesized thin films were characterized by X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM) and selected area electron diffraction (SAED). Formation mechanism of the phase and morphologies was also discussed according to the experimental results. In this research, assemblies of pure CuO nanospindles with different orientations containing in the thin film synthesized for 2 weeks with 400 nm and 413 nm violet emissions showed better antimicrobial activity against S. aureus than E. coli.

  3. Deposition of Cu-doped PbS thin films with low resistivity using DC sputtering

    Directory of Open Access Journals (Sweden)

    Hariyadi Soetedjo

    2018-03-01

    Full Text Available Investigation of the electrical resistivity of Cu-doped PbS thin films has been carried out. The films were prepared using a DC sputtering technique. The doping was achieved by introducing the Cu dopant plate material directly on the surface of the PbS sputtering target plate. SEM-EDX data shows the Cu concentration in the PbS film to be proportional to the Cu plate diameter. The XRD pattern indicates the film is in crystalline cubic form. The Hall effect measurement shows that Cu doping yields an increase in the carrier concentration to 3.55 × 1019 cm−3 and a significant decrease in electrical resistivity. The lowest resistivity obtained was 0.13 Ωcm for a Cu concentration of 18.5%. Preferential orientation of (1 1 1 and (2 0 0 occurs during deposition. Keywords: Thin films, Lead sulfide, Sputtering, Resistivity, Semiconductor, Infrared

  4. Fabrication and characterization of a CuO/ITO heterojunction with a graphene transparent electrode

    Science.gov (United States)

    Mageshwari, K.; Han, Sanghoo; Park, Jinsub

    2016-05-01

    In this paper, we investigate the electrical properties of a CuO-ITO heterojunction diode with the use of a graphene transparent electrode by current-voltage (I-V) characteristics. CuO thin films were deposited onto an ITO substrate by a simple sol-gel spin coating method and annealed at 500 °C. The x-ray diffraction pattern of the CuO thin films revealed the polycrystalline nature of CuO and exhibited a monoclinic crystal structure. FESEM images showed a uniform and densely packed particulate morphology. The optical band gap of CuO thin films estimated using UV-vis absorption spectra was found to be 2.50 eV. The I-V characteristics of the fabricated CuO-ITO heterojunction showed a well-defined rectifying behavior with improved electrical properties after the insertion of graphene. The electronic parameters of the heterostructure such as barrier height, ideality factor and series resistance were determined from the I-V measurements, and the possible current transport mechanism was discussed.

  5. Cu-64-pyruvaldehyde-bis-(N4-methylthiosemicarbazide) or Cu-64-PTSM as tracer for brain positron emission tomography

    International Nuclear Information System (INIS)

    Torres, E.A.; Lago Fernandez, J.L.; Casale, G.A.; Arguelles, M.G.

    1993-01-01

    Synthesis of pyruvaldehyde-bis-(N 4 -methylthiosemicarbazide) (PTSM), used for medical investigation and diagnosis, has been carried out in our Radiopharmaceutical Division in C.A.E. (Ezeiza Atomic Center). PTSM has been obtained introducing modifications to a previous synthesis published by H.G. Petering. (M.P. 236-238 degrees C). TLC, HPLC and IR spectrum controls have been performed. Cu-64 can be obtained by the Cu-63(n,α) and Zn-64(n,p) reactions. This last reaction has been chosen for the production in the RA-3 reactor since it leads to Cu-64 of high specific activity. Two different assays have been performed to obtain the chelate PTSM-Cu-64. The first one has been obtained by buffering the Cu-64 to pH 3-4; adding the PTSM solution to ethanol. The second assay has been carried out by buffering the Cu-64 solution with sodium acetate 3M and adding 100 μl of PTSM solution. Biodistribution studies have been carried out on NIH and rats showing a brain uptake of 4%, 30 minutes after injection. Thus, PTSM-Cu-64 proves a good brain diagnosis agent. (author). 1 ref

  6. Growth of CuPd nanoalloys encapsulated in carbon-shell

    Energy Technology Data Exchange (ETDEWEB)

    Kang, H. Y.; Wang, H. P., E-mail: wanghp@mail.ncku.edu.tw [National Cheng Kung University, Department of Environmental Engineering (China)

    2013-05-15

    Preparation of nanostructured copper-palladium (CuPd) alloys is getting more attention because specific catalytic properties can be tuned by controlling their composition, size, and shape. Thus, a better understanding especially in the formation mechanism of the CuPd nanoalloys is of great importance in designing the catalysts. Growth of CuPd nanoalloys encapsulated in carbon-shell (CuPd-C) was, therefore, studied by in situ synchrotron small-angle X-ray scattering during temperature-programed carbonization (TPC) of the Cu{sup 2+}- and Pd{sup 2+}-{beta}-cyclodextrin complexes. A rapid reduction of Cu{sup 2+} and Pd{sup 2+} with nucleation is found at the temperatures of <423 K, followed by coalescence at 453-573 K. The well-dispersed CuPd nanoalloys having the sizes of 7.6-7.9 nm in diameter are encapsulated in carbon-shell of 1.4-1.8 nm in thickness. The refined extended X-ray absorption fine structure spectra indicate that the bond distances of the first-shell Cu-Pd are 2.61-2.64 A with the coordination numbers of 5.1-5.6. A homogeneous CuPd alloy at the Cu/Pd atomic ratio of 1 is observed. Note that at the high Cu/Pd ratio, Cu is enriched on the CuPd nanoalloy surfaces, attributable to the relatively low surface free energy of Cu.

  7. Submillimeter and microwave residual losses in epitaxial films of Y-Ba-Cu-O and Tl-Ca-Ba-Cu-O

    International Nuclear Information System (INIS)

    Miller, D.; Richards, P.L.; Eom, C.B.; Geballe, T.H.; Etemad, S.; Inam, A.; Venkatesan, T.; Martens, J.S.; Lee, W.Y.

    1992-12-01

    We have used a novel bolometric technique and a resonant technique to obtain accurate submillimeter and microwave residual loss data for epitaxial thin films of YBa 2 Cu 3 O 7 , Tl 2 Ca 2 Ba 2 Cu 3 O 10 and Tl 2 CaBa 2 Cu 2 O 8 . For all films we obtain good agreement between the submillimeter and microwave data, with the residual losses in both the Y-Ba-Cu-O and Tl-Ca-Ba-Cu-O films scaling approximately as frequency squared below ∼ 1 THz. We are able to fit the losses in the Y-Ba-Cu-O films to a two fluid and a weakly coupled grain model for the a-b planeconductivity, in good agreement with results from a Kramers-Kronig analysis of the loss data

  8. The Y-Cu-Al system

    International Nuclear Information System (INIS)

    Krachan, T.; Stel'makhovych, B.; Kuz'ma, Yu.

    2003-01-01

    The phase diagram of the Y-Cu-Al system at 820 K has been constructed using X-ray powder diffraction. The existence of earlier known ternary aluminides has been confirmed and their homogeneity regions and atomic distributions in the structures have been determined: YCu 4.6-4.0 Al 7.4-8.0 (ThMn 12 -type R I =0.049), Y 2 Cu 12.0-10.5 Al 5.0-6.5 (Th 2 Zn 17 -type R I =0.092), YCu 1.0-1.1 Al 1.0-0.9 (Fe 2 P-type R I =0.068). It has been shown that the structure of Y(Cu,Al) 3 is characterized by an ordered distribution of the Cu and Al atoms and it should be referred as Ca 3 Cu 2 Al 7 structure type (R I =0.060) besides the PuNi 3 structure type with statistical occupancies of the smaller atoms. At the investigated temperature the compound YCu 1.0-0.25 Al 3.0-3.75 (BaAl 4 -type) was not observed. However, we found the ternary aluminide with composition Y 3 Cu 2.7-2.0 Al 8.3-9.0 and related La 3 Al 11 -type (space group Immm, a=0.4192-0.4228, b=1.2423-1.2557, c=0.9812-0.9895 nm, R I =0.069). The compounds YCu 6.8 Al 4.2 (space group Fddd, Tb(Cu 0.58 Al 0.42 ) 11 -type, a=1.42755, b=1.48587, c=0.65654 nm, R I =0.062) and YCu 6.5 Al 4.5 (space group I4 1 /amd, BaCd 11 -type, a=1.02774, c=0.65838 nm, R I =0.071) have been found and structurally refined for the first time

  9. A first-principles study of the structural, mechanical and electronic properties of precipitates of Al2Cu in Al-Cu alloys.

    Science.gov (United States)

    Ouyang, Y F; Chen, H M; Tao, X M; Gao, F; Peng, Q; Du, Y

    2018-01-03

    The properties of precipitates are important in understanding the strengthening mechanism via precipitation during heat treatment and the aging process in Al-Cu based alloys, where the formation of precipitates is sensitive to temperature and pressure. Here we report a first-principles investigation of the effect of temperature and pressure on the structural stability, elastic constants and formation free energy for precipitates of Al 2 Cu, as well as their mechanical properties. Based on the formation enthalpy of Guinier-Preston (GP(I)) zones, the size of the GP(I) zone is predicted to be about 1.4 nm in diameter, which is in good agreement with experimental observations. The formation enthalpies of the precipitates are all negative, suggesting that they are all thermodynamically stable. The present calculations reveal that entropy plays an important role in stabilizing θ-Al 2 Cu compared with θ C '-Al 2 Cu. The formation free energies of θ''-Al 3 Cu, θ C '-Al 2 Cu, θ D '-Al 5 Cu 3 and θ t '-Al 11 Cu 7 increase with temperature, while those of θ'-Al 2 Cu, θ O '-Al 2 Cu and θ-Al 2 Cu decrease. The same trend is observed with the effect of pressure. The calculated elastic constants for the considered precipitation phases indicate that they are all mechanically stable and anisotropic, except θ C '-Al 2 Cu. θ D '-Al 5 Cu 3 has the highest Vicker's hardness. The electronic structures are also calculated to gain insight into the bonding characteristics. The present results can help in understanding the formation of precipitates by different treatment processes.

  10. Electronic structure of TlBa2CaCu2O7-δ

    Science.gov (United States)

    Vasquez, R. P.; Novikov, D. L.; Freeman, A. J.; Siegal, M. P.

    1997-06-01

    The core levels of TlBa2CaCu2O7-δ (Tl-1212) epitaxial films have been measured with x-ray photoelectron spectroscopy (XPS). The valence electronic structure has been determined using the full-potential linear muffin-tin-orbital band-structure method and measured with XPS. The calculations show that a van Hove singularity (VHS) lies above the Fermi level (EF) for the stoichiometric compound (δ=0), while for 50% oxygen vacancies in the Tl-O layer (δ=0.5) EF is in close proximity to the VHS. Samples annealed in nitrogen (to reduce the hole overdoping by the removal of oxygen) exhibit higher core-level binding energies and a higher Tc, consistent with a shift of EF closer to the VHS. Comparisons are made to the core levels and valence bands of Tl2Ba2CaCu2O8+δ (Tl-2212) and HgBa2CaCu2O6+δ (Hg-1212). The similarity of the Cu 2p3/2 spectra for Tl-1212 and Tl-2212 indicates that the number of Tl-O layers has little effect on the Cu-O bonding. However, the Tl-1212 and Hg-1212 Cu 2p3/2 signals exhibit differences which suggest that the replacement of Tl3+ with Hg2+ results in a decrease in the O 2p-->Cu 3d charge-transfer energy and differences in the probabilities of planar vs apical oxygen charge transfer and/or Zhang-Rice singlet-state formation. Differences between the Tl-1212 and the Tl-2212 and Hg-1212 measured valence bands are consistent with the calculated Cu 3d and (Tl,Hg) 6s/5d partial densities of states.

  11. Electronic structure of TlBa2CaCu2O7-δ

    International Nuclear Information System (INIS)

    Vasquez, R.P.; Novikov, D.L.; Freeman, A.J.; Siegal, M.P.

    1997-01-01

    The core levels of TlBa 2 CaCu 2 O 7-δ (Tl-1212) epitaxial films have been measured with x-ray photoelectron spectroscopy (XPS). The valence electronic structure has been determined using the full-potential linear muffin-tin-orbital band-structure method and measured with XPS. The calculations show that a van Hove singularity (VHS) lies above the Fermi level (E F ) for the stoichiometric compound (δ=0), while for 50% oxygen vacancies in the Tl-O layer (δ=0.5) E F is in close proximity to the VHS. Samples annealed in nitrogen (to reduce the hole overdoping by the removal of oxygen) exhibit higher core-level binding energies and a higher T c , consistent with a shift of E F closer to the VHS. Comparisons are made to the core levels and valence bands of Tl 2 Ba 2 CaCu 2 O 8+δ (Tl-2212) and HgBa 2 CaCu 2 O 6+δ (Hg-1212). The similarity of the Cu 2p 3/2 spectra for Tl-1212 and Tl-2212 indicates that the number of Tl-O layers has little effect on the Cu-O bonding. However, the Tl-1212 and Hg-1212 Cu 2p 3/2 signals exhibit differences which suggest that the replacement of Tl 3+ with Hg 2+ results in a decrease in the O 2p→Cu 3d charge-transfer energy and differences in the probabilities of planar vs apical oxygen charge transfer and/or Zhang-Rice singlet-state formation. Differences between the Tl-1212 and the Tl-2212 and Hg-1212 measured valence bands are consistent with the calculated Cu 3d and (Tl,Hg) 6s/5d partial densities of states. copyright 1997 The American Physical Society

  12. Electronic Structure of TlBa2CaCu2O(7-Delta)

    Science.gov (United States)

    Vasquez, R. P.; Novikov, D. L.; Freeman, A. J.; Siegal, M. P.

    1997-01-01

    The core levels of TlBa2CaCu2O(7-delta) (Tl-1212) epitaxial films have been measured with X-ray photoelectron spectroscopy (XPS). The valence electronic structure has been determined using the full-potential linear muffin-tin-orbital band-structure method and measured with XPS. The calculations show that a van Hove singularity (VHS) lies above the Fermi level (E(sub F)) for the stoichiometric compound (delta = 0.5), while for 50% oxygen vacancies in the Tl-O layer (delta = 0.5) E(sub F) is in close proximity to the VHS. Samples annealed in nitrogen (to reduce the hole overdoping by the removal of oxygen) exhibit higher core-level binding energies and a higher T(sub c), consistent with a shift of E(sub F) closer to the VHS. Comparisons are made to the core levels and valence bands of Tl2Ba2CaCu2O(8 + delta)(Tl-2212) and HgBa2CaCu2O)6 + delta) (Hg- 1212). The similarity of the Cu 2p(sub 3/2) spectra for Tl-1212 and Tl-2212 indicates that the number of Tl-O layers has little effect on the Cu-O bonding. However, the Tl-1212 and Hg-1212 Cu 2p(sub 3/2) signals exhibit differences which suggest that the replacement of T(sup 3+) with Hg(sup 2+) results in a decrease in the O 2p right arrow Cu 3d charge-transfer energy and differences in the probabilities of planar vs apical oxygen charge transfer and/or Zhang-Rice singlet-state formation. Differences between the Tl-1212 and the Tl-2212 and Hg-1212 measured valence bands are consistent with the calculated Cu 3d and (Tl,Hg) 6s/5d partial densities of states.

  13. The effect of Cu on the properties of CdO/Cu/CdO multilayer films for transparent conductive electrode applications

    Energy Technology Data Exchange (ETDEWEB)

    Raaif, M.; Mohamed, S.H. [Sohag University, Physics Department, Faculty of Science, Sohag (Egypt)

    2017-06-15

    Transparent conductive CdO/Cu/CdO multilayer films were prepared using rf plasma magnetron sputtering and electron beam evaporation techniques. The CdO layers were prepared using rf plasma magnetron sputtering, while the Cu interlayer was prepared by electron beam evaporation technique. The Cu layer thickness was varied between 1 and 10 nm. The structural and optical properties as well as the sheet resistance of the multilayer films were studied. X-ray diffraction measurements revealed the presence of cubic CdO structure and the Cu peak was only observed for the multilayers prepared with 10 nm of Cu. It has been observed that the Cu interlayer thickness has a great influence on the optical and electrical properties of the multilayers. The transmittance of the multilayer films decreased while the reflectance increased with increasing Cu interlayer thickness. The refractive index and the extinction coefficient of the multilayer films were calculated. The estimated optical band gap values were found to be decreased from 2.75 ± 0.02 to 2.40 ± 0.02 eV as the Cu interlayer thickness increased from 1 to 10 nm. The sheet resistance was sensitive to the Cu interlayer thickness and it decreased with increasing Cu interlayer thickness. A sheet resistSSance of 21.7 Ω/sq, an average transmittance (between 700 and 1000 nm) of 77%, and an optical band gap of 2.5 ± 0.02 eV were estimated for the multilayer film with 2 nm Cu layer. The multilayer film with 2 nm Cu layer has the highest figure of merit value of 3.2 x 10{sup -3} Ω{sup -1}. This indicates that the properties of this multilayer film are suitable for transparent conductive electrode applications. (orig.)

  14. Macrocyclic effects upon isomeric Cu M and M Cu cores. Formation ...

    Indian Academy of Sciences (India)

    Administrator

    from the iminic site to the aminic site in the synthesis of 10 is explained by ... Our previous studies suggest that isomeric MIICuII ... Calcd. for C24H27Br2ClCuN4NiO8: C 35⋅28; H 3⋅33; N 6⋅86; Cu 7⋅78; Ni .... Electronic absorption spectra in .... 3. 1497(1). 1452. ⋅3(5). 2992(1). 1860(2). 3206(1). Z. 2. 2. 4. 2. 4. D calcd. /g.

  15. Surface chemistry of 2-butanol and furfural on Cu, Au and Cu/Au single crystals

    OpenAIRE

    Megginson, Rory

    2016-01-01

    In this study, the adsorption of 2-butanol and furfural was investigated on Au (111), Cu (111) and Cu/Au (111) surfaces. It was hoped that by studying how these species adsorbed on these surfaces , insight would be provided into the roles of Cu and Au in the “hydrogen free” hydrogenation of furfural to furfuryl alcohol. This is a valuable process as currently furfuryl alcohol is derived from crude oil but it is possible to derive furfural from corn husk making it a greener process...

  16. TiO2 and Cu/TiO2 Thin Films Prepared by SPT

    Directory of Open Access Journals (Sweden)

    S. S. Roy

    2015-12-01

    Full Text Available Titanium oxide (TiO2 and copper (Cu doped titanium oxide (Cu/TiO2 thin films have been prepared by spray pyrolysis technique. Titanium chloride (TiCl4 and copper acetate (Cu(CH3COO2.H2O were used as source of Ti and Cu. The doping concentration of Cu was varied from 1-10 wt. %. The X-ray diffraction studies show that TiO2 thin films are tetragonal structure and Cu/TiO2 thin films implies CuO has present with monoclinic structure. The optical properties of the TiO2 thin films have been investigated as a function of Cu-doping level. The optical transmission of the thin films was found to increase from 88 % to 94 % with the addition of Cu up to 8 % and then decreases for higher percentage of Cu doping. The optical band gap (Eg for pure TiO2 thin film is found to be 3.40 eV. Due to Cu doping, the band gap is shifted to lower energies and then increases further with increasing the concentration of Cu. The refractive index of the TiO2 thin films is found to be 2.58 and the variation of refractive index is observed due to Cu doped. The room temperature resistivity of the films decreases with increasing Cu doping and is found to be 27.50 - 23.76 W·cm. It is evident from the present study that the Cu doping promoted the thin film morphology and thereby it is aspect for various applications.

  17. Processing and characterization of composite CuO/CuO/Cu-CGO obtained by a chemical synthesis route in one step

    International Nuclear Information System (INIS)

    Sousa, A.R.O. de; Menezes, A.J.; Souza, G.S.; Lima, C.G.M. de; Souza, G.S.; Dutra, R.P.S.; Macedo, D.A.

    2016-01-01

    This paper deals with the processing and characterization of composite CuO / ceria doped with 10 mol% gadolinia (CuO-Ce0,9Gd0,1O1,95) obtained by a chemical synthesis route in one step. It was varied CuO content at 40, 50 and 60% by weight, resulting in resin precursor, which was mixed with the CGO and then heat treated at 350 ° C and subsequently calcined at 1050 deg C. The particulate materials were characterized by X-ray diffractometry using powders, it was possible to synthesize and deposit, by serigraphy, films of the anodes of the three compositions CGO electrolyte. The technique of impedance spectroscopy allowed the analysis of the electrical properties of the material, as well as the understanding of their behavior when subjected to different atmospheres of hydrogen and methane. (author)

  18. An Amidochlorin-Based Colorimetric Fluorescent Probe for Selective Cu2+ Detection

    Directory of Open Access Journals (Sweden)

    Wenting Li

    2016-01-01

    Full Text Available The design and synthesis of selective and sensitive chemosensors for the quantification of environmentally and biologically important ionic species has attracted widespread attention. Amidochlorin p6 (ACP; an effective colorimetric and fluorescent probe for copper ions (Cu2+ in aqueous solution derived from methyl pheophorbide-a (MPa was designed and synthesized. A remarkable color change from pale yellow to blue was easily observed by the naked eye upon addition of Cu2+; and a fluorescence quenching was also determined. The research of fluorescent quenching of ACP-Cu2+ complexation showed the detection limit was 7.5 × 10−8 mol/L; which suggested that ACP can act as a high sensitive probe for Cu2+ and can be used to quantitatively detect low levels of Cu2+ in aqueous solution. In aqueous solution the probe exhibits excellent selectivity and sensitivity toward Cu2+ ions over other metal ions (M = Zn2+; Ni2+; Ba2+; Ag+; Co2+; Na+; K+; Mg2+; Cd2+; Pb2+; Mn2+; Fe3+; and Ca2+. The obvious change from pale yellow to blue upon the addition of Cu2+ could make it a suitable “naked eye” indicator for Cu2+.

  19. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  20. Electrodeposition and properties of Zn, Cu, and Cu{sub 1−x} Zn{sub x} thin films

    Energy Technology Data Exchange (ETDEWEB)

    Özdemir, Rasim [Kilis Vocational High School, Kilis 7 Aralık University, 79000 Kilis (Turkey); Karahan, İsmail Hakkı, E-mail: ihkarahan@gmail.com [Department of Metallurgical and Materials Engineering, Faculty of Technology, Mustafa Kemal University, 31040 Hatay (Turkey)

    2014-11-01

    Highlights: • Cu, Zn and Cu–Zn deposits successfully deposited from the non-cyanide sulphate electrolyte. • The effect of alloying element was investigated on the electrical resistivity and the structure of Cu–Zn alloy. • The average crystallite size of the samples varied from 66 to 161 nm and decreased when the Zn and Cu combined in Cu–Zn. • Microstrain has been decreased with increasing crystallite size. • Electrical resistivity of alloy was obtained between the Zn and Cu films. - Abstract: The electrodeposition of Cu, Zn and Cu–Zn deposits from the non-cyanide Zn sulphate and Cu sulphate reduced by citrate at constant stirring speed has been investigated. The composition of the Cu–Zn bath was shown to influence the morphology, electrical resistivity, phase composition, and Cu and Zn content of the Cu–Zn deposits. Their structural and electrical properties have been investigated by X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDAX), cyclic voltammeter (CV) and current–voltage measurements against the temperature for electrical resistivity, respectively. XRD shows that Cu–Zn samples are polycrystalline phase. Resistivity results show that the copper film exhibits bigger residual resistivity than both the zinc and the Cu–Zn alloy. Theoretical calculations of the XRD peaks demonstrate that the average crystallite size of the Cu–Zn alloy decreased and microstrain increased when the Cu alloyed with zinc.

  1. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  2. Secondary ordering in ternary alloy CuMnPt6

    International Nuclear Information System (INIS)

    Takahashi, Miwako; Das, Ananda Kumar; Nakamura, Reo; Ohshima, Ken-ichi; Iwasaki, Hiroshi; Shishido, Toetsu

    2006-01-01

    Using the pulsed-neutron diffraction technique, we performed in situ measurements of structural ordering in the ternary alloy CuMnPt 6 . The diffraction patterns at various temperatures give a direct observation of a double-step ordering: disorder to Cu 3 Au type order as an ordering within the fundamental face-centered cubic lattice to subdivide the lattice into two sublattices formed by face-centered sites (first sublattice) and corner sites (second sublattice) at 968degC; and Cu 3 Au type order to ABC 6 type order as an ordering within the second to subdivide the lattice further into two sublattices formed by alternating (111) planes at 746degC. The order parameters for the ABC 6 type structure experimentally estimated by the method of static concentration waves indicate that the primary ordering developed almost completely, but the secondary ordering remained incomplete. (author)

  3. Cu-Ti Formation in Nb-Ti/Cu Superconducting Strand Monitored by in situ Techniques

    CERN Document Server

    Pong, I; Pong, Ian; Gerardin, Alexandre; Scheuerlein, Christian; Bottura, Luca

    2010-01-01

    In order to investigate the high temperature exposure effect on Nb-Ti/Cu superconducting strands, as might be encountered in joining by soldering and in cabling annealing, X-ray diffraction and resistometry measurements were performed in situ during heat treatment, and complemented by conventional metallography, mechanical tests and superconducting properties measurements. Changes of the Nb-Ti nanostructure at temperatures above 300 degrees C are manifested in the degradation of critical current in an applied external magnetic field, although degradation at self field was insignificant up to 400 degrees C for several minutes. Above 500 degrees C, the formation of various Cu-Ti intermetallic compounds, due to Ti diffusion from Nb-Ti into Cu, is detected by in situ XRD albeit not resolvable by SEM-EDS. There is a ductile to brittle transition near 600 degrees C, and liquid formation is observed below 900 degrees C. The formation of Cu-Ti causes a delayed reduction of the residual resistivity ratio (RRR) and adv...

  4. Small changes in Cu redox state and speciation generate large isotope fractionation during adsorption and incorporation of Cu by a phototrophic biofilm

    Science.gov (United States)

    Coutaud, Margot; Méheut, Merlin; Glatzel, Pieter; Pokrovski, Gleb S.; Viers, Jérôme; Rols, Jean-Luc; Pokrovsky, Oleg S.

    2018-01-01

    Despite the importance of phototrophic biofilms in metal cycling in freshwater systems, metal isotope fractionation linked to metal adsorption and uptake by biofilm remains very poorly constrained. Here, copper isotope fractionation by a mature phototrophic biofilm during Cu surface adsorption and incorporation was studied in batch reactor (BR) and open drip flow reactor (DFR) systems at ambient conditions. X-ray Absorption Spectroscopy (both Near Edge Structure, XANES, and Extended Fine Structure, EXAFS) at Cu K-edge of the biofilm after its interaction with Cu in BR experiments allowed characterizing the molecular structure of assimilated Cu and quantifying the degree of CuII to CuI reduction linked to Cu assimilation. For both BR and DFR experiments, Cu adsorption caused enrichment in heavy isotope at the surface of the biofilm relative to the aqueous solution, with an apparent enrichment factor for the adsorption process, ε65Cuads, of +1.1 ± 0.3‰. In contrast, the isotope enrichment factor during copper incorporation into the biofilm (ε65Cuinc) was highly variable, ranging from -0.6 to +0.8‰. This variability of the ε65Cuinc value was likely controlled by Cu cellular uptake via different transport pathways resulting in contrasting fractionation. Specifically, the CuII storage induced enrichment in heavy isotope, whereas the toxicity response of the biofilm to Cu exposure resulted in reduction of CuII to CuI, thus yielding the biofilm enrichment in light isotope. EXAFS analyses suggested that a major part of the Cu assimilated by the biofilm is bound to 5.1 ± 0.3 oxygen or nitrogen atoms, with a small proportion of Cu linked to sulfur atoms (NS biofilm exhibited a similar trend over time of exposure. Our study demonstrates the complexity of biological processes associated with live phototrophic biofilms, which produce large and contrasting isotope fractionations following rather small Cu redox and speciation changes during uptake, storage or release of

  5. Local Seebeck coefficient near the boundary in touching Cu/Bi-Te/Cu composites

    International Nuclear Information System (INIS)

    Yamashita, O.; Odahara, H.

    2007-01-01

    The thermo-emf ΔV and temperature difference ΔT across the boundary were measured as a function of r for the touching p- and n-type Cu/Bi-Te/Cu composites composed of a combination of t Bi-Te =2.0 mm and t Cu =0.3 mm, where ΔT is produced by imposing a constant voltage of 1.7 V on two Peltier modules connected in series and r is the distance from the boundary that corresponds to the interval s between two thermocouples. The resultant Seebeck coefficient α across the boundary was obtained from the relation α=ΔV/ΔT. As a result, the resultant α of the touching p- and n-type composites have surprisingly great local maximum values of 1330 and -1140 μV/K at r∼0.03 mm, respectively, and decreased rapidly with an increase of r to approach the Seebeck coefficients of the intrinsic Bi-Te compounds. The resultant maximum α of the touching p- and n-type Cu/Bi-Te/Cu composites are approximately 5.4 and 5.5 times higher in absolute value than those of the intrinsic Bi-Te compounds, respectively. It was thus clarified for the first time that the local Seebeck coefficient is enhanced most strongly in the Bi-Te region where there is an approximately 30-μm distance from the boundary, not at the boundary between Bi-Te compounds and copper. (orig.)

  6. Attempting to realize n-type BiCuSeO

    Science.gov (United States)

    Zhang, Xiaoxuan; Feng, Dan; He, Jiaqing; Zhao, Li-Dong

    2018-02-01

    As an intrinsic p-type semiconductor, BiCuSeO has been widely researched in the thermoelectric community, however, n-type BiCuSeO has not been reported so far. In this work, we successfully realized n-type BiCuSeO through carrying out several successive efforts. Seebeck coefficient of BiCuSeO was increased through introducing extra Bi/Cu to fill the Bi/Cu vacancies that may produce holes, and the maximum Seebeck coefficient was increase from +447 μVK-1 for undoped BiCuSeO to +638 μVK-1 for Bi1.04Cu1.05SeO. The Seebeck coefficient of Bi1.04Cu1.05SeO was changed from p-type to n-type through electron doping through introducing Br/I in Se sites, the maximum negative Seebeck coefficient can reach ∼ -465 μVK-1 and -543 μVK-1 for Bi1.04Cu1.05Se1-xIxO and Bi1.04Cu1.05Se1-xBrxO, respectively. Then, after compositing Bi1.04Cu1.05Se0.99Br0.01O with Ag, n-type BiCuSeO can be absolutely obtained in the whole temperature range of 300-873 K, the maximum ZT 0.05 was achieved at 475 K in the Bi1.04Cu1.05Se0.99Br0.01O+15% Ag. Our report indicates that it is possible to realize n-type conducting behaviors in BiCuSeO system.

  7. Observations of a Cast Cu-Cr-Zr Alloy

    Science.gov (United States)

    Ellis, David L.

    2006-01-01

    Prior work has demonstrated that Cu-Cr-Nb alloys have considerable advantages over the copper alloys currently used in regeneratively cooled rocket engine liners. Observations indicated that Zr and Nb have similar chemical properties and form very similar compounds. Glazov and Zakharov et al. reported the presence of Cr2Zr in Cu-Cr-Zr alloys with up to 3.5 wt% Cr and Zr though Zeng et al. calculated that Cr2Zr could not exist in a ternary Cu-Cr-Zr alloy. A cast Cu-6.15 wt% Cr-5.25 wt% Zr alloy was examined to determine if the microstructure developed would be similar to GRCop-84 (Cu-6.65 wt% Cr-5.85 wt% Nb). It was observed that the Cu-Cr-Zr system did not form any Cr2Zr even after a thermal exposure at 875 C for 176.5 h. Instead the alloy consisted of three phases: Cu, Cu5Zr, and Cr.

  8. Effect of Cu2O morphology on photocatalytic hydrogen generation and chemical stability of TiO2/Cu2O composite.

    Science.gov (United States)

    Zhu, Lihong; Zhang, Junying; Chen, Ziyu; Liu, Kejia; Gao, Hong

    2013-07-01

    Improving photocatalytic activity and stability of TiO2/Cu2O composite is a challenge in generating hydrogen from water. In this paper, the TiO2 film/Cu2O microgrid composite was prepared via a microsphere lithography technique, which possesses a remarkable performance of producing H2 under UV-vis light irradiation, in comparison with pure TiO2 film, Cu2O film and TiO2 film/Cu2O film. More interesting is that in TiO2 film/Cu2O microgrid, photo-corrosion of Cu2O can be retarded. After deposition of Pt on its surface, the photocatalytic activity of TiO2/Cu2O microgrid in producing H2 is improved greatly.

  9. Axial strain localization of CuCrZr tubes during manufacturing of ITER-like mono-block W/Cu components using HIP

    International Nuclear Information System (INIS)

    Zhao, S.X.; Peng, L.J.; Li, Q.; Wang, W.J.; Wei, R.; Qin, S.G.; Shi, Y.L.; Chang, S.P.; Xu, Y.; Liu, G.H.; Wang, T.J.; Luo, G.-N.

    2014-01-01

    Highlights: • Axial cracking and denting of CuCrZr tubes were observed. • Annealing the as-received tubes can alleviate cracking. • Denting results in the formation bonding flaws at the Cu/CuCrZr interfaces. - Abstract: Two forms of axial strain localization of CuCrZr tubes, i.e., cracking and denting, were observed during the manufacturing of ITER-like mono-block W/Cu components for EAST employing hot isostatic pressing (HIP). Microscopic investigations indicate that the occurrence of axial strain localization correlates to the heavily deformed Cu grains and elongated Cr-rich precipitates as well as highly anisotropic microstructures, which impair the circumferential ductility. Annealing the as-received tubes at 600 °C alleviates cracking due to partial recrystallization of Cu grains. However, the annealed tubes are still sensitive to wall thinning (caused by non-uniform polishing or tube bending), which results in denting. Denting may cause bonding flaws at CuCrZr/Cu interfaces and the underlying mechanisms are discussed. To some extent, denting seems do not affect the high heat flux performance of components. In this paper, we demonstrate that testing only the axial mechanical properties is not enough for manufacturers who use HIP or hot radial pressing technologies, especially for those anisotropic tubes

  10. Synthesis and characterization of micrometer Cu/PVP architectures

    International Nuclear Information System (INIS)

    Luo, Huajuan; Zhao, Yanbao; Sun, Lei

    2011-01-01

    Graphical abstract: A simple method for the synthesis of novel micrometer flower-like Cu/PVP architectures was introduced. Highlights: → Micrometer flower-like copper/polyvinylpyrrolidone architectures were obtained by a simple chemical route. → The amount of N 2 H 4 ·H 2 O, the reaction temperature, the molar ratio of CuCl 2 to PVP and different molecular weights of PVP play an important role in the controlling the morphology of the Cu/PVP architectures. → A possible mechanism of the formation of Cu/PVP architectures was discussed. -- Abstract: Micrometer-sized flower-like Cu/polyvinylpyrrolidone (PVP) architectures are synthesized by the reduction of copper (II) salt with hydrazine hydrate in aqueous solution in the presence of PVP capping agent. The resulting Cu/PVP architectures are investigated by UV-vis spectroscopy, transmission electron microscopy (TEM), X-ray powder diffraction (XRD), and scanning electron microscopy (SEM). The Cu/PVP flowers have uniform morphologies with an average diameter of 10 μm, made of several intercrossing plates. The formation of Cu/PVP flowers is a new kinetic control process, and the factors such as the amount of N 2 H 4 ·H 2 O, reaction temperature, molar ratio of CuCl 2 to PVP and molecular weight of PVP have significant effect on the morphology of Cu/PVP architectures. A possible mechanism of the formation of micrometer Cu/PVP architectures was discussed.

  11. Synthesis, structure and magnetic properties of the one-dimensional bimetallic oxide [Cu(terpy)Mo2O7

    International Nuclear Information System (INIS)

    Burkholder, Eric; Gabriel Armatas, N.; Golub, Vladimir; O'Connor, Charles J.; Zubieta, Jon

    2005-01-01

    The hydrothermal reaction of Cu(CH 3 CO 2 ) 2 .H 2 O, Na 2 MoO 4 and terpyridine at 140 deg. C for 48 h yields [Cu(terpy)Mo 2 O 7 ] (1), a bimetallic one-dimensional oxide. The structure consists of ruffled chains of edge- and corner-sharing {MoO 5 } square pyramids, decorated with {CuN 3 O 2 } '4+1' axially distorted square pyramids. The Cu(II) polyhedra are disposed so as to produce an alternating pattern of Cu-Cu distances across the {Mo 2 O 2 } rhombi of the chain of 6.25 and 6.82 A. This structural feature is reflected in the magnetic properties which are characteristic of a dimer rather than a linear chain, consistent with an alternating antiferromagnetic Heisenberg chain. -- Graphical abstract: Hydrothermal synthesis provided the one-dimensional bimetallic oxide [Cu(terpy)Mo 2 O 7 ], a material consisting of a zig-zag {Mo 2 O 7 } n 2 n - chain, decorated with {Cu(terpy)} 2+ groups exhibiting alternating short-long Cu-Cu distances between copper sites

  12. Study On Nanohardness Of Phases Occurring In ZnAl22Cu3 And ZnAl40Cu3 Alloys

    Directory of Open Access Journals (Sweden)

    Michalik R.

    2015-06-01

    Full Text Available Zn-Al alloys are mainly used due to their high tribological and damping properties. A very important issue is determination of the hardness of the phases present in the Zn-Al-Cu alloys. Unfortunately, in literature there is lack of studies on the hardness of the phases present in the alloys Zn-Al-Cu. The aim of this research was to determine the hardness of the phases present in the ZnAl22Cu3Si and ZnAl40Cu3Si alloys. The scope of the research included examination of the structure, chemical composition of selected micro-regions and hardness of phases present in the examined alloys. The research carried out has shown, that CuZn4 phase is characterized by a similar hardness as the hardness of the interdendritic areas. The phases present in the structure of ZnAl40Cu3 and ZnAl22Cu3 alloys after soaking at the temperature of 185 °C are characterized by lower hardness than the phase present in the structure of the as-cast alloys.

  13. SURFACE MODIFICATION OF SEMICONDUCTOR THIN FILM OF TiO2 ON GRAPHITE SUBSTRATE BY Cu-ELECTRODEPOSITION

    Directory of Open Access Journals (Sweden)

    Fitria Rahmawati

    2010-06-01

    Full Text Available Surface modification of graphite/TiO2 has been done by mean of Cu electrodeposition. This research aims to study the effect of Cu electrodeposition on photocatalytic enhancing of TiO2. Electrodeposition has been done using CuSO4 0,4 M as the electrolyte at controlled current. The XRD pattern of modified TiO2 thin film on graphite substrate exhibited new peaks at 2θ= 43-44o and 2θ= 50-51o that have been identified as Cu with crystal cubic system, face-centered crystal lattice and crystallite size of 26-30 nm. CTABr still remains in the material as impurities. Meanwhile, based on morphological analysis, Cu particles are dissipated in the pore of thin film. Graphite/TiO2/Cu has higher photoconversion efficiency than graphite/TiO2.   Keywords: semiconductor, graphite/TiO2, Cu electrodeposition

  14. The crystallisation of Cu2ZnSnS4 thin film solar cell absorbers from co-electroplated Cu-Zn-Sn precursors

    International Nuclear Information System (INIS)

    Schurr, R.; Hoelzing, A.; Jost, S.; Hock, R.; Voss, T.; Schulze, J.; Kirbs, A.; Ennaoui, A.; Lux-Steiner, M.; Weber, A.; Koetschau, I.; Schock, H.-W.

    2009-01-01

    The best CZTS solar cell so far was produced by co-sputtering continued with vapour phase sulfurization method. Efficiencies of up to 5.74% were reached by Katagiri et al. The one step electrochemical deposition of copper, zinc, tin and subsequent sulfurization is an alternative fabrication technique for the production of Cu 2 ZnSnS 4 based thin film solar cells. A kesterite based solar cell (size 0.5 cm 2 ) with a conversion efficiency of 3.4% (AM1.5) was produced by vapour phase sulfurization of co-electroplated Cu-Zn-Sn films. We report on results of in-situ X-ray diffraction (XRD) experiments during crystallisation of kesterite thin films from electrochemically co-deposited metal films. The kesterite crystallisation is completed by the solid state reaction of Cu 2 SnS 3 and ZnS. The measurements show two different reaction paths depending on the metal ratios in the as deposited films. In copper-rich metal films Cu 3 Sn and CuZn were found after electrodeposition. In copper-poor or near stoichiometric precursors additional Cu 6 Sn 5 and Sn phases were detected. The formation mechanism of Cu 2 SnS 3 involves the binary sulphides Cu 2-x S and SnS 2 in the absence of the binary precursor phase Cu 6 Sn 5 . The presence of Cu 6 Sn 5 leads to a preferred formation of Cu 2 SnS 3 via the reaction educts Cu 2-x S and SnS 2 in the presence of a SnS 2 (Cu 4 SnS 6 ) melt. The melt phase may be advantageous in crystallising the kesterite, leading to enhanced grain growth in the presence of a liquid phase

  15. Cu2Se and Cu Nanocrystals as Local Sources of Copper in Thermally Activated In Situ Cation Exchange

    KAUST Repository

    Casu, Alberto; Genovese, Alessandro; Manna, Liberato; Longo, Paolo; Buha, Joka; Botton, Gianluigi A.; Lazar, Sorin; Kahaly, M. Upadhyay; Schwingenschlö gl, Udo; Prato, Mirko; Li, Hongbo; Ghosh, Sandeep; Palazon, Francisco; De Donato, Francesco; Lentijo Mozo, Sergio; Zuddas, Efisio; Falqui, Andrea

    2016-01-01

    Among the different synthesis approaches to colloidal nanocrystals a recently developed toolkit is represented by cation exchange reactions, where the use of template nanocrystals gives access to materials that would be hardly attainable via direct synthesis. Besides, post-synthetic treatments, such as thermally activated solid state reactions, represent a further flourishing route to promote finely controlled cation exchange. Here, we report that, upon in situ heating in a transmission electron microscope, Cu2Se nanocrystals deposited on an amorphous solid substrate undergo partial loss of Cu atoms, which are then engaged in local cation exchange reactions with Cu “acceptors” phases represented by rod- and wire- shaped CdSe nanocrystals. This thermal treatment slowly transforms the initial CdSe nanocrystals into Cu2-xSe nanocrystals, through the complete sublimation of Cd and the partial sublimation of Se atoms. Both Cu “donor” and “acceptor” particles were not always in direct contact with each other, hence the gradual transfer of Cu species from Cu2Se or metallic Cu to CdSe nanocrystals was mediated by the substrate and depended on the distance between the donor and acceptor nanostructures. Differently from what happens in the comparably faster cation exchange reactions performed in liquid solution, this study shows that slow cation exchange reactions can be performed at the solid state, and helps to shed light on the intermediate steps involved in such reactions.

  16. Cu2Se and Cu Nanocrystals as Local Sources of Copper in Thermally Activated In Situ Cation Exchange

    KAUST Repository

    Casu, Alberto

    2016-01-27

    Among the different synthesis approaches to colloidal nanocrystals a recently developed toolkit is represented by cation exchange reactions, where the use of template nanocrystals gives access to materials that would be hardly attainable via direct synthesis. Besides, post-synthetic treatments, such as thermally activated solid state reactions, represent a further flourishing route to promote finely controlled cation exchange. Here, we report that, upon in situ heating in a transmission electron microscope, Cu2Se nanocrystals deposited on an amorphous solid substrate undergo partial loss of Cu atoms, which are then engaged in local cation exchange reactions with Cu “acceptors” phases represented by rod- and wire- shaped CdSe nanocrystals. This thermal treatment slowly transforms the initial CdSe nanocrystals into Cu2-xSe nanocrystals, through the complete sublimation of Cd and the partial sublimation of Se atoms. Both Cu “donor” and “acceptor” particles were not always in direct contact with each other, hence the gradual transfer of Cu species from Cu2Se or metallic Cu to CdSe nanocrystals was mediated by the substrate and depended on the distance between the donor and acceptor nanostructures. Differently from what happens in the comparably faster cation exchange reactions performed in liquid solution, this study shows that slow cation exchange reactions can be performed at the solid state, and helps to shed light on the intermediate steps involved in such reactions.

  17. Glass-formation and hardness of Cu-Y alloys

    Energy Technology Data Exchange (ETDEWEB)

    Satta, Marta; Rizzi, Paola [Dipartimento di Chimica IFM and NIS/INSTM/CNISM, Universita di Torino, v. Giuria 9, I-10125 Torino (Italy); Baricco, Marcello, E-mail: marcello.baricco@unito.i [Dipartimento di Chimica IFM and NIS/INSTM/CNISM, Universita di Torino, v. Giuria 9, I-10125 Torino (Italy)

    2009-08-26

    Metallic glasses exhibit particularly attractive mechanical properties, like high stresses to fracture and large elastic strain (up to 2%), but they show generally low plasticity. Aim of this work is to investigate the glass forming range in the Cu-Y system, in order to form the ductile CuY phase (CsCl structure) upon crystallization. Cu{sub 58}Y{sub 42}, Cu{sub 50}Y{sub 50} and Cu{sub 33}Y{sub 67} alloys have been prepared by rapid solidification and copper mould casting, obtaining ribbons and cylindrical shaped ingots, with diameter of 2 mm. Fully amorphous, partially amorphous and fully crystalline samples have been obtained for different compositions and quenching conditions. In some cases, the X-ray diffraction results, analysed using the Rietveld method, showed CuY nanocrystals embedded in an amorphous matrix. The microstructure was studied by transmission electron microscopy (TEM) and the presence of nanocrystals of the ductile phase CuY has been confirmed. Microhardness results showed a softening of the amorphous phase due to the presence of CuY nanocrystals and a hardening due to the Cu{sub 2}Y phase.

  18. Assessment of Ni, Cu, Zn and Pb levels in beach and dune sands from Havana resorts, Cuba.

    Science.gov (United States)

    Díaz Rizo, Oscar; Buzón González, Fran; Arado López, Juana O

    2015-11-15

    Concentrations of nickel (Ni), copper (Cu), zinc (Zn) and lead (Pb) in beach and dune sands from thirteen Havana (Cuba) resorts were estimated by X-ray fluorescence analysis. Determined mean metal contents (in mg·kg(-1)) in beach sand samples were 28±12 for Ni, 35±12 for Cu, 31±11 for Zn and 6.0±1.8 for Pb, while for dune sands were 30±15, 38±22, 37±15 and 6.8±2.9, respectively. Metal-to-iron normalization shows moderately severe and severe enrichment by Cu. The comparison with sediment quality guidelines shows that dune sands from various resorts must be considered as heavily polluted by Cu and Ni. Almost in every resort, the Ni and Cu contents exceed their corresponding TEL values and, in some resorts, the Ni PEL value. The comparison with a Havana topsoil study indicates the possible Ni and Cu natural origin. Copyright © 2015 Elsevier Ltd. All rights reserved.

  19. A novel patterning control strategy based on real-time fingerprint recognition and adaptive wafer level scanner optimization

    Science.gov (United States)

    Cekli, Hakki Ergun; Nije, Jelle; Ypma, Alexander; Bastani, Vahid; Sonntag, Dag; Niesing, Henk; Zhang, Linmiao; Ullah, Zakir; Subramony, Venky; Somasundaram, Ravin; Susanto, William; Matsunobu, Masazumi; Johnson, Jeff; Tabery, Cyrus; Lin, Chenxi; Zou, Yi

    2018-03-01

    In addition to lithography process and equipment induced variations, processes like etching, annealing, film deposition and planarization exhibit variations, each having their own intrinsic characteristics and leaving an effect, a `fingerprint', on the wafers. With ever tighter requirements for CD and overlay, controlling these process induced variations is both increasingly important and increasingly challenging in advanced integrated circuit (IC) manufacturing. For example, the on-product overlay (OPO) requirement for future nodes is approaching process induced variance to become extremely small. Process variance control is seen as an bottleneck to further shrink which drives the need for more sophisticated process control strategies. In this context we developed a novel `computational process control strategy' which provides the capability of proactive control of each individual wafer with aim to maximize the yield, without introducing a significant impact on metrology requirements, cycle time or productivity. The complexity of the wafer process is approached by characterizing the full wafer stack building a fingerprint library containing key patterning performance parameters like Overlay, Focus, etc. Historical wafer metrology is decomposed into dominant fingerprints using Principal Component Analysis. By associating observed fingerprints with their origin e.g. process steps, tools and variables, we can give an inline assessment of the strength and origin of the fingerprints on every wafer. Once the fingerprint library is established, a wafer specific fingerprint correction recipes can be determined based on its processing history. Data science techniques are used in real-time to ensure that the library is adaptive. To realize this concept, ASML TWINSCAN scanners play a vital role with their on-board full wafer detection and exposure correction capabilities. High density metrology data is created by the scanner for each wafer and on every layer during the

  20. Influence of Cu diffusion conditions on the switching of Cu-SiO2-based resistive memory devices

    International Nuclear Information System (INIS)

    Thermadam, S. Puthen; Bhagat, S.K.; Alford, T.L.; Sakaguchi, Y.; Kozicki, M.N.; Mitkova, M.

    2010-01-01

    This paper presents a study of Cu diffusion at various temperatures in thin SiO 2 films and the influence of diffusion conditions on the switching of Programmable Metallization Cell (PMC) devices formed from such Cu-doped films. Film composition and diffusion products were analyzed using secondary ion mass spectroscopy, Rutherford backscattering spectrometry, X-ray diffraction and Raman spectroscopy methods. We found a strong dependence of the diffused Cu concentration, which varied between 0.8 at.% and 10 -3 at.%, on the annealing temperature. X-ray diffraction and Raman studies revealed that Cu does not react with the SiO 2 network and remains in elemental form after diffusion for the annealing conditions used. PMC resistive memory cells were fabricated with such Cu-diffused SiO 2 films and device performance, including the stability of the switching voltage, is discussed in the context of the material characteristics.

  1. Levels Of Mn, Fe, Ni, Cu, Zn And Cd, In Effluent From A Sewage ...

    African Journals Online (AJOL)

    This study reports the results of preliminary investigation of heavy metal levels-Ni, Cd, Fe, Zn, Cu and Mn; pH; temperature and electrical conductivity in effluents from a sewage treatment oxidation pond and its receiving stream. The heavy metal concentrations were determined with Inductively Coupled Plasma-Mass ...

  2. Measurement of extremely low level dose with LiF(Mg,Cu,P) TL chips

    International Nuclear Information System (INIS)

    Zha Ziying; Wang Shoushan; Wu Fang; Chen Guolong; Li Yuanfang; Zhu Jianhuan

    1986-01-01

    This paper presents some of the dosimetric characteristics of newly developed LiF(Mg,Cu,P) TL chips with high signal-to-noise ratio for measurement at the 10 -7 to 10 -4 Gy dose level. Measuring techniques and optimum procedures for annealing and readout are also presented. (author)

  3. Selective synthesis of clinoatacamite Cu2(OH)3Cl and tenorite CuO nanoparticles by pH control

    DEFF Research Database (Denmark)

    Engelbrekt, Christian; Malcho, Phillip; Andersen, Jonas

    2014-01-01

    , it directed the growth of Cu2(OH)3Cl to provide pure clinoatacamite without the presence of related poly- morphs. The products were characterized by transmission electron microscopy, infrared spectroscopy, ultraviolet–visible light spectroscopy, X-ray powder diffraction (XRD), scanning transmission X......-ray microscopy and atomic force microscopy. Infrared spectroscopy was essential for characterization of closely related polymorphs of Cu2(OH)3Cl indistinguishable by XRD. A plausible mechanism has been proposed and discussed for the formation of the CuO and Cu2(OH)3Cl nanostructures....

  4. BiCuSeO Thermoelectrics: An Update on Recent Progress and Perspective

    Directory of Open Access Journals (Sweden)

    Xiaoxuan Zhang

    2017-02-01

    Full Text Available A BiCuSeO system has been reported as a promising thermoelectric material and has attracted great attention in the thermoelectric community since 2010. Recently, several remarkable studies have been reported and the ZT of BiCuSeO was pushed to a higher level. It motivates us to systematically summarize the recent reports on the BiCuSeO system. In this short review, we start with several attempts to optimize thermoelectric properties of BiCuSeO. Then, we introduce several opinions to explore the origins of low thermal conductivity for BiCuSeO. Several approaches to enhance thermoelectric performance are also summarized, including modulation doping, introducing dual-vacancies, and dual-doping, etc. At last, we propose some possible strategies for enhancing thermoelectric performance of BiCuSeO in future research.

  5. Preparation of Cu@Cu2O Nanocatalysts by Reduction of HKUST-1 for Oxidation Reaction of Catechol

    Directory of Open Access Journals (Sweden)

    Seongwan Jang

    2016-11-01

    Full Text Available HKUST-1, a copper-based metal organic framework (MOF, has been investigated as a catalyst in various reactions. However, the HKUST-1 shows low catalytic activity in the oxidation of catechol. Therefore, we synthesized Fe3O4@HKUST-1 by layer-by layer assembly strategy and Cu@Cu2O by reduction of HKUST-1 for enhancement of catalytic activity. Cu@Cu2O nanoparticles exhibited highly effective catalytic activity in oxidation of 3,5-di-tert-butylcatechol. Through this method, MOF can maintain the original core-shell structure and be used in various other reactions with enhanced catalytic activity.

  6. Formation of uniform carrot-like Cu31S16-CuInS2 heteronanostructures assisted by citric acid at the oil/aqueous interface.

    Science.gov (United States)

    Li, Yongjie; Tang, Aiwei; Liu, Zhenyang; Peng, Lan; Yuan, Yi; Shi, Xifeng; Yang, Chunhe; Teng, Feng

    2018-01-07

    A simple two-phase strategy was developed to prepare Cu 31 S 16 -CuInS 2 heterostructures (HNS) at the oil/aqueous interface, in which the In(OH) 3 phase was often obtained in the products due to the reaction between indium ions and hydroxyl ions in the aqueous phase. To prevent the formation of the In(OH) 3 phase, citric acid was incorporated into the aqueous phase to assist in the synthesis of uniform carrot-like Cu 31 S 16 -CuInS 2 semiconductor HNS at the oil/aqueous interface for the first time. By manipulating the dosage of citric acid and Cu/In precursor ratios, the morphology of the Cu 31 S 16 -CuInS 2 HNS could be tailored from mushroom to carrot-like, and the presence of citric acid played a critical role in the synthesis of high-quality Cu 31 S 16 -CuInS 2 HNS, which inhibited the formation of the In(OH) 3 phase due to the formation of the indium(iii)-citric acid complex. The formation mechanism was studied by monitoring the morphology and phase evolution of the Cu 31 S 16 -CuInS 2 HNS with reaction time, which revealed that the Cu 31 S 16 seeds were first formed and then the cation-exchange reaction directed the subsequent anisotropic growth of the Cu 31 S 16 -CuInS 2 HNS.

  7. Compound cuing in free recall.

    Science.gov (United States)

    Lohnas, Lynn J; Kahana, Michael J

    2014-01-01

    According to the retrieved context theory of episodic memory, the cue for recall of an item is a weighted sum of recently activated cognitive states, including previously recalled and studied items as well as their associations. We show that this theory predicts there should be compound cuing in free recall. Specifically, the temporal contiguity effect should be greater when the 2 most recently recalled items were studied in contiguous list positions. A meta-analysis of published free recall experiments demonstrates evidence for compound cuing in both conditional response probabilities and interresponse times. To help rule out a rehearsal-based account of these compound cuing effects, we conducted an experiment with immediate, delayed, and continual-distractor free recall conditions. Consistent with retrieved context theory but not with a rehearsal-based account, compound cuing was present in all conditions, and was not significantly influenced by the presence of interitem distractors.

  8. Corrosion behavior of Cu during graphene growth by CVD

    International Nuclear Information System (INIS)

    Dong, Yuhua; Liu, Qingqing; Zhou, Qiong

    2014-01-01

    Highlights: • Graphene films were deposited on the Cu by chemical vapor deposition method. • Annealing affects the corrosion property of Cu. • Graphene films improve corrosion performance of Cu for a short period of time. - Abstract: The corrosion performance of Cu samples may be affected by annealing at high temperatures during graphene growth via the chemical vapor deposition method. In this study, multiple graphene films were deposited on Cu and characterized by Raman spectroscopy and transmission electron microscopy. The corrosion behavior of Cu immersed in 3.5 wt.% NaCl solution was investigated using electrochemical impedance spectroscopy. The Cu morphology was observed by optical microscopy and scanning electron microscopy. Results indicated that annealing affects the corrosion process of Cu. The presence of graphene films on the Cu substrate improved the corrosion performance of the material for a short period of time

  9. Influence of surface oxygenated groups on the formation of active Cu species and the catalytic activity of Cu/AC catalyst for the synthesis of dimethyl carbonate

    Science.gov (United States)

    Zhang, Guoqiang; Li, Zhong; Zheng, Huayan; Hao, Zhiqiang; Wang, Xia; Wang, Jiajun

    2016-12-01

    Activated carbon (AC) supported Cu catalysts are employed to study the influence of surface oxygenated groups on the formation of active Cu species and the catalytic activity of Cu/AC catalyst for oxidative carbonylation of methanol to dimethyl carbonate (DMC). The AC supports are thermal treated under different temperatures in order to adjust the levels of surface oxygenated groups. The AC supports are characterized by BET, TPD-MS and XRD, and the Cu/AC catalysts are characterized by BET, XRD, TEM, XPS, AAS, CH3OH-TPD and N2O chemisorption. The results show that as the treatment temperature is below 800 °C, the BET surface area of the corresponding AC supports are nearly unchanged and close to that of the original AC (1529.6 m2/g). But as the thermal treatment temperature is elevated from 1000 to 1600 °C, the BET surface area of AC supports gradually decreases from 1407.6 to 972.2 m2/g. After loading of Cu, the BET surface area of copper catalysts is in the range of 834.4 to 1545.3 m2/g, which is slightly less than that of the respective supports. When AC is thermal treated at 400 and 600 °C, the unstable carboxylic acid and anhydrides groups are selectively removed, which has weakened the mobility and agglomeration of Cu species during the calcination process, and thus improve the Cu species dispersion over AC support. But as the treatment temperature is elevated from 600 °C to 1200 °C, the Cu species dispersion begins to decline suggesting further removal of stable surface oxygenated groups is unfavorable for Cu species dispersion. Moreover, higher thermal treatment temperature (above 1200 °C) promotes the graphitization degree of AC and leds to the decrease of Cu loading on AC support. Meanwhile, the removal of surface oxygenated groups by thermal treatment is conducive to the formation of more π-sites, and thus promote the reduction of Cu2+ to Cu+ and Cu0 as active centers. The specific surface area of (Cu+ + Cu0) is improved by thermal treatment of AC

  10. Magnetic Excitations in Cu2Fe2Ge4O13

    International Nuclear Information System (INIS)

    Masuda, Takatsugu; Zheludev, Andrey I.; Sales, Brian C.; Imai, S.; Uchinokura, K.

    2005-01-01

    Magnetic excitations in the cooperative ordered state in a weakly coupled Fe chains and Cu dimers compound Cu 2 Fe 2 Ge 4 O 13 is studied by thermal neutron scattering technique. We show that the low energy excitations up to 10 meV in wide q range are well described by spin wave theory of weakly coupled Fe chains. In higher energy range a narrow band excitation that can be associated with Cu dimers is observed at ℎω-24 meV. Both types of excitations can be understood by treating the weak coupling between Fe chains and Cu dimers at the level of Mean Field/Random Phase Approximation.

  11. Study of Cu and Pb partitioning in mine tailings using the Tessier sequential extraction scheme

    Energy Technology Data Exchange (ETDEWEB)

    Andrei, Mariana Lucia, E-mail: marianaluciaandrei@yahoo.com [National Institute for Research and Development of Isotopic and Molecular Technologies, 65-103 Donath, 400293 Cluj-Napoca (Romania); Babes-Bolyai University, Environmental Science and Engineering Faculty, 30 Fantanele, 400294, Cluj-Napoca (Romania); Senila, Marin; Hoaghia, Maria Alexandra; Levei, Erika-Andrea [INCDO-INOE 2000, Research Institute for Analytical Instrumentation, 67 Donath, 400293, Cluj-Napoca (Romania); Borodi, Gheorghe [National Institute for Research and Development of Isotopic and Molecular Technologies, 65-103 Donath, 400293 Cluj-Napoca (Romania)

    2015-12-23

    The Cu and Pb partitioning in nonferrous mine tailings was investigated using the Tessier sequential extraction scheme. The contents of Cu and Pb found in the five operationally defined fractions were determined by inductively coupled plasma optical emission spectrometry. The results showed different partitioning patterns for Cu and Pb in the studied tailings. The total Cu and Pb contents were higher in tailings from Brazesti than in those from Saliste, while the Cu contents in the first two fractions considered as mobile were comparable and the content of mobile Pb was the highest in Brazesti tailings. In the tailings from Saliste about 30% of Cu and 3% of Pb were found in exchangeable fraction, while in those from Brazesti no metals were found in the exchangeable fraction, but the percent of Cu and Pb found in the bound to carbonate fraction were high (20% and 26%, respectively). The highest Pb content was found in the residual fraction in Saliste tailings and in bound to Fe and Mn oxides fraction in Brazesti tailings, while the highest Cu content was found in the fraction bound to organic matter in Saliste tailings and in the residual fraction in Brazesti tailings. In case of tailings of Brazesti medium environmental risk was found both for Pb and Cu, while in case of Saliste tailings low risk for Pb and high risk for Cu were found.

  12. Study of Cu and Pb partitioning in mine tailings using the Tessier sequential extraction scheme

    International Nuclear Information System (INIS)

    Andrei, Mariana Lucia; Senila, Marin; Hoaghia, Maria Alexandra; Levei, Erika-Andrea; Borodi, Gheorghe

    2015-01-01

    The Cu and Pb partitioning in nonferrous mine tailings was investigated using the Tessier sequential extraction scheme. The contents of Cu and Pb found in the five operationally defined fractions were determined by inductively coupled plasma optical emission spectrometry. The results showed different partitioning patterns for Cu and Pb in the studied tailings. The total Cu and Pb contents were higher in tailings from Brazesti than in those from Saliste, while the Cu contents in the first two fractions considered as mobile were comparable and the content of mobile Pb was the highest in Brazesti tailings. In the tailings from Saliste about 30% of Cu and 3% of Pb were found in exchangeable fraction, while in those from Brazesti no metals were found in the exchangeable fraction, but the percent of Cu and Pb found in the bound to carbonate fraction were high (20% and 26%, respectively). The highest Pb content was found in the residual fraction in Saliste tailings and in bound to Fe and Mn oxides fraction in Brazesti tailings, while the highest Cu content was found in the fraction bound to organic matter in Saliste tailings and in the residual fraction in Brazesti tailings. In case of tailings of Brazesti medium environmental risk was found both for Pb and Cu, while in case of Saliste tailings low risk for Pb and high risk for Cu were found

  13. Evidence of icosahedral short-range order in Zr70Cu30 and Zr70Cu29Pd1 metallic glasses

    DEFF Research Database (Denmark)

    Saksl, K.; Franz, H.; Jovari, P.

    2003-01-01

    Change in local atomic environment during crystallization of Zr-based glassy alloys was studied by extended x-ray absorption fine structure (EXAFS) spectroscopy. The formation of icosahedral quasicrystalline phase followed by crystallization of tetragonal CuZr2 has been observed in the Zr70Cu29Pd1...... glassy alloy during annealing up to 850 K. On the other hand, the binary Zr70Cu30 alloy shows a single glassy to crystalline CuZr2 phase transformation. The local atomic environment of as-quenched Zr70Cu30 alloy is matched to an icosahedral local atomic configuration, which is similar to that of the as......-quenched Zr70Cu29Pd1 alloy and the alloy annealed at 593 K containing icosahedral phase. Considering that the supercooled liquid region appears prior to crystallization in the Zr70Cu30 glassy alloy, the observed results support the theory claiming a strong correlation between the existence of local...

  14. A study of angle-resolved photoemission extended fine structure as applied to the Ni 3p, Cu 3s, and Cu 3p core levels of the respective clean (111) surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Huff, W.R.A.; Moler, E.J.; Kellar, S.A. [Lawrence Berkeley National Lab., CA (United States)] [and others

    1997-04-01

    The first non-s initial state angle-resolved photoemission extended fine structure (ARPEFS) study of clean surfaces for the purpose of further understanding the technique is reported. The surface structure sensitivity of ARPEFS applied to clean surfaces and to arbitrary initial states is studied using normal photoemission data taken from the Ni 3p core levels of a Ni(111) single crystal and the Cu 3s and the Cu 3p core-levels of a Cu(111) single crystal. The Fourier transforms of these clean surface data are dominated by backscattering. Unlike the s initial state data, the p initial state data show a peak in the Fourier transform corresponding to in-plane scattering from the six nearest-neighbors to the emitter. Evidence was seen for single-scattering events from in the same plane as the emitters and double-scattering events. Using a newly developed, multiple-scattering calculation program, ARPEFS data from clean surfaces and from p initial states can be modeled to high precision. Although there are many layers of emitters when measuring photoemission from a clean surface, test calculations show that the ARPEFS signal is dominated by photoemission from atoms in the first two crystal layers. Thus, ARPEFS applied to clean surfaces is sensitive to surface reconstruction. The known contraction of the first two Cu(111) layers is confirmed. The best-fit calculation for clean Ni(111) indicates an expansion of the first two layers. To better understand the ARPEFS technique, the authors studied s and non-s initial state photoemission from clean metal surfaces.

  15. Synthesis of Cu(In,Ga)Se{sub 2} crystals using a crank ball mill

    Energy Technology Data Exchange (ETDEWEB)

    Yamada, Suzuka; Noji, Hideki; Akaki, Yoji [Miyakonojo National College of Technology, 473-1 Yoshio, Miyakonojo Miyazaki 885-8567 (Japan); Okamoto, Tomoichiro [Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Niigata 940-2188 (Japan)

    2015-06-15

    Cu(In,Ga)Se{sub 2} (CIGS) crystals were synthesized by a mechanochemical (MC) process using a crank ball mill. The molar ratios of starting materials were Cu:In:Ga:Se=1:1-x:x:2 (0≤x≤1) and Cu:In:Ga:Se=1:0.7:0.3:y (2≤y≤3). The reaction time reduced with decreasing Se and Ga molar ratios. The collection rate decreased with longer reaction times. From XRD patterns, we confirmed that the CuInSe{sub 2} and/or CuGaSe{sub 2}crystals were successfully grown when the powders reacted. Although the crystals grown with a selenium molar ration of 2 were Se-poor, those grown at a molar ratio of 3 were Se-rich. When Se increasing molar ratio, Cu, In, and Ga were away from the stoichiometric. With a molar ratio of Cu:In:Ga:Se=1:0.7:0.3:2.5∝2.7, their composition became stoichiometric. Crystal morphology was varied. CIGS crystals were thus successfully synthesized using a crank ball mill. (copyright 2015 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  16. Structural and electronic properties of Cu2Q and CuQ (Q = O, S, Se, and Te) studied by first-principles calculations

    Science.gov (United States)

    Zhao, Ting; Wang, Yu-An; Zhao, Zong-Yan; Liu, Qiang; Liu, Qing-Ju

    2018-01-01

    In order to explore the similarity, difference, and tendency of binary copper-based chalcogenides, the crystal structure, electronic structure, and optical properties of eight compounds of Cu2Q and CuQ (Q = O, S, Se, and Te) have been calculated by density functional theory with HSE06 method. According to the calculated results, the electronic structure and optical properties of Cu2Q and CuQ present certain similarities and tendencies, with the increase of atomic number of Q elements: the interactions between Cu-Q, Cu-Cu, and Q-Q are gradually enhancing; the value of band gap is gradually decreasing, due to the down-shifting of Cu-4p states; the covalent feature of Cu atoms is gradually strengthening, while their ionic feature is gradually weakening; the absorption coefficient in the visible-light region is also increasing. On the other hand, some differences can be found, owing to the different crystal structure and component, for example: CuO presents the characteristics of multi-band gap, which is very favorable to absorb infrared-light; the electron transfer in CuQ is stronger than that in Cu2Q; the absorption peaks and intensity are very strong in the ultraviolet-light region and infrared-light region. The findings in the present work will help to understand the underlying physical mechanism of binary copper-based chalcogenides, and available to design novel copper-based chalcogenides photo-electronics materials and devices.

  17. A simple route to Cu{sub x}Sn{sub (100−x)} intermetallic nanoparticle catalyst for ultra-phenol hydroxylation

    Energy Technology Data Exchange (ETDEWEB)

    Pithakratanayothin, Sakollapath [The Petroleum and Petrochemical College and Center of Excellence on Petrochemical and Materials Technology, Chulalongkorn University, Bangkok 10330 (Thailand); Tongsri, Ruangdaj [Powder Metallurgy Research and Development Unit - PM-RDU, National Metal and Materials Technology Center, Pathum Thani 12120 (Thailand); Chaisuwan, Thanyalak [The Petroleum and Petrochemical College and Center of Excellence on Petrochemical and Materials Technology, Chulalongkorn University, Bangkok 10330 (Thailand); Wongkasemjit, Sujitra, E-mail: dsujitra@chula.ac.th [The Petroleum and Petrochemical College and Center of Excellence on Petrochemical and Materials Technology, Chulalongkorn University, Bangkok 10330 (Thailand)

    2016-09-15

    A practical methodology and novel, economical materials were proposed to successfully prepare nanoparticle catalysts for phenol hydroxylation. The preparation was carried out via mechanical alloying (MA) of Cu{sub x}Sn{sub (100−x)} powder mixtures (where x = 30, 50, 70, and 100%wt). The mechanical alloyed nanoparticles were characterized using various techniques. X-ray diffraction patterns indicated that η-Cu{sub 6}Sn{sub 5}, ε-Cu{sub 3}Sn, and CuSn phases could be formed in the mechanical alloyed Cu{sub x}Sn{sub (100−x)} materials. Transmission electron micrographs and selected area electron diffraction patterns confirmed the presence of η-Cu{sub 6}Sn{sub 5}, ε-Cu{sub 3}Sn, and CuSn phases. Activity of the catalysts, using the optimal conditions of 70 °C reaction temperature for 1 h, 50 mg of Cu{sub 0.5}Sn{sub 0.5}, and 1:3 phenol:H{sub 2}O{sub 2} ratio, provided more than 98% conversion with 70% catechol (CAT) and 29% hydroquinone (HQ). Experimental results suggested that the presence of the ε-Cu{sub 3}Sn phase gave higher activity while Sn reduced benzoquinone (BQ) to HQ. The catalyst maintained its stability with no structural collapse for more than 24 h. - Highlights: • Cu{sub x}Sn{sub y} intermetallic as a catalyst was successfully synthesized via mechanical alloying. • Cu{sub x}Sn{sub y} intermetallics promoted impressive phenol hydroxylation. • 98% conversion was achieved with high selectivity of catechol.

  18. Preparation of Cu Nanoclusters within Dendrimer Templates

    National Research Council Canada - National Science Library

    Zhao, M

    1998-01-01

    ... (16-atom Cu cluster in G4 and 64-atom Cu cluster in G6 dendrimers). The clusters remain trapped within the dendrimers for extended periods of time, do not agglomerate, and do not precipitate. The clusters can also be oxidized to yield dendrimer-encapsulated Cu(2+).

  19. Heating induced microstructural changes in graphene/Cu nanocomposites

    International Nuclear Information System (INIS)

    Solá, F; Niu, J; Xia, Z H

    2013-01-01

    Dynamic heating experiments on graphene/Cu nanocomposites by in situ scanning electron microscopy were conducted to observe the evolution of the morphology and size of the Cu nanoparticles. Microstructural characterization showed that the graphene/Cu nanocomposites system consists of graphene sheets decorated with Cu-based nanoparticles with different chemistries (Cu, Cu 2 O), shapes (cube, rod, triangle, etc) and sizes. Evidence of neck evolution, coalescence, sublimation and Ostwald ripening were observed. Interestingly, some of the events occurred at the edges of the graphene sheets. The quantitative data of necking evolution deviates from the classical continuum theory indicating that intrinsic faceting and the shape of the nanoparticles played an important role in the necking process. This was supported by molecular dynamics simulations. Experimental data of liquid-spherical nanoparticles on graphene suggested that Cu did not wet graphene. Based on sublimation experiments and surface stability, we propose that graphene decorated with Cu nanoparticles enclosed by {111} facets are the most stable nanocomposite at high temperatures. The growth mechanism of nanoparticles on graphene is discussed.

  20. (Cu,C)Ba2Ca3Cu4Ox (LiF)y: addition of LiF—an effective way to synthesize overdoped superconductor

    Science.gov (United States)

    Badica, P.; Iyo, A.; Aldica, G.; Kito, H.; Crisan, A.; Tanaka, Y.

    2004-03-01

    (Cu,C)Ba2Ca3Cu4Ox superconductor with addition of y mol LiF has been synthesized by a high-pressure method. For the same synthesis conditions it was found that (almost) single-phase Cu, C-1234 samples can be synthesized for yLiF = 0-0.1 if the amount of z mol AgO oxidizer is increased linearly from zAgO = 0.45 to 0.73 and for yLiF = 0.1-0.2 if zAgO = 0.73 = constant. Transport measurements (rgr(T) and room-temperature Seebeck coefficient) have shown that these samples are overdoped: LiF is an effective addition for synthesis of overdoped Cu, C-1234 with a controlled level of carriers. LiF addition continuously decreases Tc. The critical point at yLiF = 0.1 is discussed as the solubility limit of LiF and/or the point where the doping mechanism changes. It is proposed that the reason is the reaction of extra Li with C and O to form Li2CO3, inducing a lower concentration of C in Cu, C-1234/LiF crystals, and at the same time a possible substitution of Li not only for the Cu site but also for the Ca site, resulting in formation of a higher amount of residual Ca0.828CuO2 (for yLiF>0.1). LiF induces the formation of a liquid phase and acts as a flux promoting the formation of Cu,C-12 (n-1)n with n \\ge 4 . LiF modifies to some degree the grain growth from a 3D to a 2D type (thinner platelike grains have been observed in the LiF added samples).