The extended Beer-Lambert theory for ray tracing modeling of LED chip-scaled packaging application with multiple luminescence materials

Science.gov (United States)

Yuan, Cadmus C. A.

2015-12-01

Optical ray tracing modeling applied Beer-Lambert method in the single luminescence material system to model the white light pattern from blue LED light source. This paper extends such algorithm to a mixed multiple luminescence material system by introducing the equivalent excitation and emission spectrum of individual luminescence materials. The quantum efficiency numbers of individual material and self-absorption of the multiple luminescence material system are considered as well. By this combination, researchers are able to model the luminescence characteristics of LED chip-scaled packaging (CSP), which provides simple process steps and the freedom of the luminescence material geometrical dimension. The method will be first validated by the experimental results. Afterward, a further parametric investigation has been then conducted.

Utilization of multi-band OFDM modulation to increase traffic rate of phosphor-LED wireless VLC.

Science.gov (United States)

Yeh, Chien-Hung; Chen, Hsing-Yu; Chow, Chi-Wai; Liu, Yen-Liang

2015-01-26

To increase the traffic rate in phosphor-LED visible light communication (VLC), a multi-band orthogonal frequency division multiplexed (OFDM) modulation is first proposed and demonstrated. In the measurement, we do not utilize optical blue filter to increase modulation bandwidth of phosphor-LED in the VLC system. In this proposed scheme, different bands of OFDM signals are applied to different LED chips in a LED lamp, this can avoid the power fading and nonlinearity issue by applying the same OFDM signal to all the LED chips in a LED lamp. Here, the maximum increase percentages of traffic rates are 41.1%, 17.8% and 17.8% under received illuminations of 200, 500 and 1000 Lux, respectively, when the proposed three-band OFDM modulation is used in the VLC system. In addition, the analysis and verification by experiments are also performed.

Study on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System

Directory of Open Access Journals (Sweden)

Kailin Pan

2014-10-01

Full Text Available Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging heat dissipation system, three kinds of thermal resistance calculation method including theoretical calculation, experimental testing and finite element simulation are developed respectively. Firstly, based on the thermal resistance network model and the principle of steady state heat transfer, the theoretical value of total thermal resistance is 6.111 K/W through sum of the thermal resistance of every material layer in the major direction of heat flow. Secondly, the thermal resistance experiment is carried out by T3Ster to obtain the experimental result of total thermal resistance, and the value is 6.729 K/W. Thirdly, a three-dimensional finite element model of MCM-LED packaging heat dissipation system is established, and the junction temperature experiment is also performed to calculated the finite element simulated result of total thermal resistance, the value is 6.99 K/W. Finally, by comparing the error of all the three kinds of result, the error of total thermal resistance between the theoretical value and experimental result is 9.2 %, and the error of total thermal resistance between the experimental result and finite element simulation is only about -3.9 %, meanwhile, the main reason of each error is discussed respectively.

Improved On-Chip Measurement of Delay in an FPGA or ASIC

Science.gov (United States)

Chen, Yuan; Burke, Gary; Sheldon, Douglas

2007-01-01

An improved design has been devised for on-chip-circuitry for measuring the delay through a chain of combinational logic elements in a field-programmable gate array (FPGA) or application-specific integrated circuit (ASIC). In the improved design, the delay chain does not include input and output buffers and is not configured as an oscillator. Instead, the delay chain is made part of the signal chain of an on-chip pulse generator. The duration of the pulse is measured on-chip and taken to equal the delay.

Freeform lens design for LED collimating illumination.

Science.gov (United States)

Chen, Jin-Jia; Wang, Te-Yuan; Huang, Kuang-Lung; Liu, Te-Shu; Tsai, Ming-Da; Lin, Chin-Tang

2012-05-07

We present a simple freeform lens design method for an application to LED collimating illumination. The method is derived from a basic geometric-optics analysis and construction approach. By using this method, a highly collimating lens with LED chip size of 1.0 mm × 1.0 mm and optical simulation efficiency of 86.5% under a view angle of ± 5 deg is constructed. To verify the practical performance of the lens, a prototype of the collimator lens is also made, and an optical efficiency of 90.3% with a beam angle of 4.75 deg is measured.

Packaging technology of LEDs for LCD backlights

International Nuclear Information System (INIS)

Fan Manning; Liang Meng; Wang Guohong

2009-01-01

We design a package patterned with red and green emitting phosphors excited by a blue LED to emit tri-basic mixing color. For high backlight display quality, we compare several phosphors. According to our measurements, green phosphors 0752G, 0753G and red phosphor 0763R are preferred for producing a good backlight source. Compared to RGB-LED backlight units, this frame typically benefits the lighting uniformity, and can simplify the structures. It also provides higher color render and better CCT than the traditional package method of a yellow phosphor with a blue chip. However, its light efficiency needs to be further improved for the use of backlights for LCDs.

Investigation of phosphor-LED lamp for real-time half-duplex wireless VLC system

International Nuclear Information System (INIS)

Yeh, Chien-Hung; Chow, Chi-Wai; Chen, Hsing-Yu; Liu, Yen-Liang; Hsu, Dar-Zu

2016-01-01

In this investigation, a 71.3 to 148.4 Mbit s −1 white phosphor-LED visible light communication (VLC) system is proposed and demonstrated under the practical transmission length of 140 to 210 cm. Here, a commercial white-light LED lamp with five cascaded phosphor-LED chips is utilized for illumination and communication simultaneously. In the measurement, we utilize the optical orthogonal frequency division multiplexing quadrature amplitude modulation (OFDM-QAM) with bit-loading algorithm and propose an optimal bias-tee circuit design to improve the modulation bandwidth from 1 MHz to 27 MHz. Moreover, a blue optical filter is not used on the client side. Finally, to realize and demonstrate the real-time transmission performance in the proposed LED VLC system, a commercial OFDM-based digital signal processor (DSP) chip is utilized on the LED lighting side and client side, respectively. Hence, the proposed real-time half-duplex VLC transmission could achieve the 70 Mbit s −1 downstream and upstream data throughputs, under a practical transmission length of 200 cm. (paper)

Multi-LED parallel transmission for long distance underwater VLC system with one SPAD receiver

Science.gov (United States)

Wang, Chao; Yu, Hong-Yi; Zhu, Yi-Jun; Wang, Tao; Ji, Ya-Wei

2018-03-01

In this paper, a multiple light emitting diode (LED) chips parallel transmission (Multi-LED-PT) scheme for underwater visible light communication system with one photon-counting single photon avalanche diode (SPAD) receiver is proposed. As the lamp always consists of multi-LED chips, the data rate could be improved when we drive these multi-LED chips parallel by using the interleaver-division-multiplexing technique. For each chip, the on-off-keying modulation is used to reduce the influence of clipping. Then a serial successive interference cancellation detection algorithm based on ideal Poisson photon-counting channel by the SPAD is proposed. Finally, compared to the SPAD-based direct current-biased optical orthogonal frequency division multiplexing system, the proposed Multi-LED-PT system could improve the error-rate performance and anti-nonlinearity performance significantly under the effects of absorption, scattering and weak turbulence-induced channel fading together.

Electron Spin Resonance Measurement with Microinductor on Chip

Directory of Open Access Journals (Sweden)

Akio Kitagawa

2011-01-01

Full Text Available The detection of radicals on a chip is demonstrated. The proposed method is based on electron spin resonance (ESR spectroscopy and the measurement of high-frequency impedance of the microinductor fabricated on the chip. The measurement was by using a frequency sweep of approximately 100 MHz. The ESR spectra of di(phenyl-(2,4,6-trinitrophenyliminoazanium (DPPH dropped on the microinductor which is fabricated with CMOS 350-nm technology were observed at room temperature. The volume of the DPPH ethanol solution was 2 μL, and the number of spins on the micro-inductor was estimated at about 1014. The sensitivity is not higher than that of the standard ESR spectrometers. However, the result indicates the feasibility of a near field radical sensor in which the microinductor as a probe head and ESR signal processing circuit are integrated.

[A novel biologic electricity signal measurement based on neuron chip].

Science.gov (United States)

Lei, Yinsheng; Wang, Mingshi; Sun, Tongjing; Zhu, Qiang; Qin, Ran

2006-06-01

Neuron chip is a multiprocessor with three pipeline CPU; its communication protocol and control processor are integrated in effect to carry out the function of communication, control, attemper, I/O, etc. A novel biologic electronic signal measurement network system is composed of intelligent measurement nodes with neuron chip at the core. In this study, the electronic signals such as ECG, EEG, EMG and BOS can be synthetically measured by those intelligent nodes, and some valuable diagnostic messages are found. Wavelet transform is employed in this system to analyze various biologic electronic signals due to its strong time-frequency ability of decomposing signal local character. Better effect is gained. This paper introduces the hardware structure of network and intelligent measurement node, the measurement theory and the signal figure of data acquisition and processing.

Design and implementation of a high dimming ratio LED drive controller

International Nuclear Information System (INIS)

Xu Xiaoru; Wu Xiaobo; Zhao Menglian; Yan Xiaolang

2009-01-01

This paper presents a high dimming ratio light emitting diode (LED) drive controller chip with digital mode dimming (DMD). The chip is composed of a boost power converter and a dimming control block. A novel constant on time (COT) control strategy is proposed for boost converter to achieve high dimming ratio. In addition, a fast enough load transient response of the converter power stage ensures its high dimming ratio. The COT control circuit operates mainly based on two current-capacitor timers and a finite state machine (FSM). The LED drive controller chip is designed and fabricated in 1.5 μm bipolar CMOS-DMOS (BCD) process with a die area of 1.31 x 1.43 mm 2 . Experimental results show that the proposed LED drive system works well. And, as expected, the minimum LED dimming on time of 1.0 μs and the corresponding dimming ratio of 1000:1 at 1 kHz dimming frequency are successfully achieved.

A new approach to preparation of standard LEDs for luminous intensity and flux measurement of LEDs

Science.gov (United States)

Park, Seung-Nam; Park, Seongchong; Lee, Dong-Hoon

2006-09-01

This work presents an alternative approach for preparing photometric standard LEDs, which is based on a novel functional seasoning method. The main idea of our seasoning method is simultaneously monitoring the light output and the junction voltage to obtain quantitative information on the temperature dependence and the aging effect of the LED emission. We suggested a general model describing the seasoning process by taking junction temperature variation and aging effect into account and implemented a fully automated seasoning facility, which is capable of seasoning 12 LEDs at the same time. By independent measurements of the temperature dependence, we confirmed the discrepancy of the theoretical model to be less than 0.5 % and evaluate the uncertainty contribution of the functional seasoning to be less than 0.5 % for all the seasoned samples. To demonstrate assigning the reference value to a standard LED, the CIE averaged LED intensity (ALI) of the seasoned LEDs was measured with a spectroradiometer-based instrument and the measurement uncertainty was analyzed. The expanded uncertainty of the standard LED prepared by the new approach amounts to be 4 % ~ 5 % (k=2) depending on color without correction of spectral stray light in the spectroradiometer.

Heat Transfer Characteristics in High Power LED Packaging

Directory of Open Access Journals (Sweden)

Chi-Hung Chung

2014-03-01

Full Text Available This study uses the T3Ster transient thermal resistance measuring device to investigate the effects to heat transfer performances from different LED crystal grains, packaging methods and heat-sink substrates through the experimental method. The experimental parameters are six different types of LED modules that are made alternatively with the crystal grain structure, the die attach method and the carrying substrate. The crystal grain structure includes the lateral type, flip chip type and vertical type. The die attach method includes silver paste and the eutectic structure. The carrying substrates are aluminum oxide (Alumina and aluminum nitride (AIN ceramic substrates and metal core PCB (MCPCB. The experimental results show that, under the conditions of the same crystal grain and die attach method, the thermal resistance values for the AIN substrate and the Alumina substrate are 2.1K/W and 5.1K/W, respectively and the total thermal resistance values are 7.3K/W and 10.8K/W. Compared to the Alumina substrate, the AIN substrate can effectively lower the total thermal resistance value by 32.4%. This is because the heat transfer coefficient of the AIN substrate is higher than that of the Alumina substrate, thus effectively increasing its thermal conductivity. In addition, under the conditions of the same crystal grain and the same substrate, the packaging methods are using silver paste and the eutectic structure for die attach. Their thermal resistance values are 5.7K/W and 2.7K/W, respectively, with a variance of 3K/W. Comparisons of the crystal grain structure show that the thermal resistance for the flip chip type is lower than that of the traditional lateral type by 0.9K/W. This is because the light emitting layer of the flip chip crystal grain is closer to the heat-sink substrate, shortening the heat dissipation route, and thus lowering the thermal resistance value. For the total thermal resistance, the crystal grain structure has a lesser

Coupling structure in LED System-In-Package design: a physical responses-based critical parameter sheet like approach

NARCIS (Netherlands)

Borst, de E.C.M.; Gielen, A.W.J.; Etman, L.F.P.

2012-01-01

Abstract This paper introduces an approach to study the coupling structure between the design parameters and design objectives of a LED system-in-package (SiP) design concept [1]. The LED SiP is an integrated device that combines the LED chip with driver chips and potential other components in a

Coupling structure in LED System-in-Package design: a physical responses-based critical parameter sheet like approach

NARCIS (Netherlands)

Borst, E.C.M. de; Gielen, A.W.J.; Etman, L.F.P.

2012-01-01

This paper introduces an approach to study the coupling structure between the design parameters and design objectives of a LED system-in-package (SiP) design concept [1]. The LED SiP is an integrated device that combines the LED chip with driver chips and potential other components in a single

White LED with High Package Extraction Efficiency

International Nuclear Information System (INIS)

Yi Zheng; Stough, Matthew

2008-01-01

The goal of this project is to develop a high efficiency phosphor converting (white) Light Emitting Diode (pcLED) 1-Watt package through an increase in package extraction efficiency. A transparent/translucent monolithic phosphor is proposed to replace the powdered phosphor to reduce the scattering caused by phosphor particles. Additionally, a multi-layer thin film selectively reflecting filter is proposed between blue LED die and phosphor layer to recover inward yellow emission. At the end of the project we expect to recycle approximately 50% of the unrecovered backward light in current package construction, and develop a pcLED device with 80 lm/W e using our technology improvements and commercially available chip/package source. The success of the project will benefit luminous efficacy of white LEDs by increasing package extraction efficiency. In most phosphor-converting white LEDs, the white color is obtained by combining a blue LED die (or chip) with a powdered phosphor layer. The phosphor partially absorbs the blue light from the LED die and converts it into a broad green-yellow emission. The mixture of the transmitted blue light and green-yellow light emerging gives white light. There are two major drawbacks for current pcLEDs in terms of package extraction efficiency. The first is light scattering caused by phosphor particles. When the blue photons from the chip strike the phosphor particles, some blue light will be scattered by phosphor particles. Converted yellow emission photons are also scattered. A portion of scattered light is in the backward direction toward the die. The amount of this backward light varies and depends in part on the particle size of phosphors. The other drawback is that yellow emission from phosphor powders is isotropic. Although some backward light can be recovered by the reflector in current LED packages, there is still a portion of backward light that will be absorbed inside the package and further converted to heat. Heat generated

Ascertainment biases in SNP chips affect measures of population divergence

DEFF Research Database (Denmark)

Albrechtsen, Anders; Nielsen, Finn Cilius; Nielsen, Rasmus

2010-01-01

Chip-based high-throughput genotyping has facilitated genome-wide studies of genetic diversity. Many studies have utilized these large data sets to make inferences about the demographic history of human populations using measures of genetic differentiation such as F(ST) or principal component...... on direct sequencing. In addition, we also analyze publicly available genome-wide data. We demonstrate that the ascertainment biases will distort measures of human diversity and possibly change conclusions drawn from these measures in some times unexpected ways. We also show that details of the genotyping...... analyses. However, the single nucleotide polymorphism (SNP) chip data suffer from ascertainment biases caused by the SNP discovery process in which a small number of individuals from selected populations are used as discovery panels. In this study, we investigate the effect of the ascertainment bias...

Quantification and analysis of color stability based on thermal transient behavior in white LED lamps.

Science.gov (United States)

Nisa Khan, M

2017-09-20

We present measurement and analysis of color stability over time for two categories of white LED lamps based on their thermal management scheme, which also affects their transient lumen depreciation. We previously reported that lumen depreciation in LED lamps can be minimized by properly designing the heat sink configuration that allows lamps to reach a thermal equilibrium condition quickly. Although it is well known that lumen depreciation degrades color stability of white light since color coordinates vary with total lumen power by definition, quantification and characterization of color shifts based on thermal transient behavior have not been previously reported in literature for LED lamps. Here we provide experimental data and analysis of transient color shifts for two categories of household LED lamps (from a total of six lamps in two categories) and demonstrate that reaching thermal equilibrium more quickly provides better stability for color rendering, color temperature, and less deviation of color coordinates from the Planckian blackbody locus line, which are all very important characterization parameters of color for white light. We report for the first time that a lamp's color degradation from the turn-on time primarily depends on thermal transient behavior of the semiconductor LED chip, which experiences a wavelength shift as well as a decrease in its dominant wavelength peak value with time, which in turn degrades the phosphor conversion. For the first time, we also provide a comprehensive quantitative analysis that differentiates color degradation due to the heat rise in GaN/GaInN LED chips and subsequently the boards these chips are mounted on-from that caused by phosphor heating in a white LED module. Finally, we briefly discuss why there are some inevitable trade-offs between omnidirectionality and color and luminous output stability in current household LED lamps and what will help eliminate these trade-offs in future lamp designs.

Monolithic blue LED series arrays for high-voltage AC operation

Energy Technology Data Exchange (ETDEWEB)

Ao, Jin-Ping [Satellite Venture Business Laboratory, University of Tokushima, Tokushima 770-8506 (Japan); Sato, Hisao; Mizobuchi, Takashi; Morioka, Kenji; Kawano, Shunsuke; Muramoto, Yoshihiko; Sato, Daisuke; Sakai, Shiro [Nitride Semiconductor Co. Ltd., Naruto, Tokushima 771-0360 (Japan); Lee, Young-Bae; Ohno, Yasuo [Department of Electrical and Electronic Engineering, University of Tokushima, Tokushima 770-8506 (Japan)

2002-12-16

Design and fabrication of monolithic blue LED series arrays that can be operated under high ac voltage are described. Several LEDs, such as 3, 7, and 20, are connected in series and in parallel to meet ac operation. The chip size of a single device is 150 {mu}m x 120 {mu}m and the total size is 1.1 mm x 1 mm for a 40(20+20) LED array. Deep dry etching was performed as device isolation. Two-layer interconnection and air bridge are utilized to connect the devices in an array. The monolithic series array exhibit the expected operation function under dc and ac bias. The output power and forward voltage are almost proportional to LED numbers connected in series. On-wafer measurement shows that the output power is 40 mW for 40(20+20) LED array under ac 72 V. (Abstract Copyright [2002], Wiley Periodicals, Inc.)

Generation of solar spectrum by using LEDs

Science.gov (United States)

Lu, Pengzhi; Yang, Hua; Pei, Yanrong; Li, Jing; Xue, Bin; Wang, Junxi; Li, Jinmin

2016-09-01

Light emitting diode (LED) has been recognized as an applicable light source for indoor and outdoor lighting, city beautifying, landscape facilities, and municipal engineering etc. Conventional LED has superior characteristics such as long life time, low power consumption, high contrast, and wide viewing angle. Recently, LED with high color-rendering index and special spectral characteristics has received more and more attention. This paper is intended to report a solar spectrum simulated by multichip LED light source. The typical solar spectrum of 5500k released by CIE was simulated as a reference. Four types of LEDs with different spectral power distributions would be used in the LED light source, which included a 430nm LED, a 480nm LED, a 500nm LED and a white LED. In order to obtain better simulation results, the white LED was achieved by a 450nm LED chip with the mixture of phosphor. The phosphor combination was prepared by mixing green phosphor, yellow phosphor and red phosphor in a certain proportion. The multichip LED light source could provide a high fidelity spectral match with the typical solar spectrum of 5500k by adjusting injection current to each device. The luminous flux, CIE chromaticity coordinate x, y, CCT, and Ra were 104.7 lm, 0.3337, 0.3681, 5460K, and 88.6, respectively. Because of high color-rendering index and highly match to the solar spectrum, the multichip LED light source is a competitive candidate for applications where special spectral is required, such as colorimetric measurements, visual inspection, gemstone identification and agriculture.

Floating Chip Mounting System Driven by Repulsive Force of Permanent Magnets for Multiple On-Site SPR Immunoassay Measurements

Science.gov (United States)

Horiuchi, Tsutomu; Tobita, Tatsuya; Miura, Toru; Iwasaki, Yuzuru; Seyama, Michiko; Inoue, Suzuyo; Takahashi, Jun-ichi; Haga, Tsuneyuki; Tamechika, Emi

2012-01-01

We have developed a measurement chip installation/removal mechanism for a surface plasmon resonance (SPR) immunoassay analysis instrument designed for frequent testing, which requires a rapid and easy technique for changing chips. The key components of the mechanism are refractive index matching gel coated on the rear of the SPR chip and a float that presses the chip down. The refractive index matching gel made it possible to optically couple the chip and the prism of the SPR instrument easily via elastic deformation with no air bubbles. The float has an autonomous attitude control function that keeps the chip parallel in relation to the SPR instrument by employing the repulsive force of permanent magnets between the float and a float guide located in the SPR instrument. This function is realized by balancing the upward elastic force of the gel and the downward force of the float, which experiences a leveling force from the float guide. This system makes it possible to start an SPR measurement immediately after chip installation and to remove the chip immediately after the measurement with a simple and easy method that does not require any fine adjustment. Our sensor chip, which we installed using this mounting system, successfully performed an immunoassay measurement on a model antigen (spiked human-IgG) in a model real sample (non-homogenized milk) that included many kinds of interfering foreign substances without any sample pre-treatment. The ease of the chip installation/removal operation and simple measurement procedure are suitable for frequent on-site agricultural, environmental and medical testing. PMID:23202030

A design of LED adaptive dimming lighting system based on incremental PID controller

Science.gov (United States)

He, Xiangyan; Xiao, Zexin; He, Shaojia

2010-11-01

As a new generation energy-saving lighting source, LED is applied widely in various technology and industry fields. The requirement of its adaptive lighting technology is more and more rigorous, especially in the automatic on-line detecting system. In this paper, a closed loop feedback LED adaptive dimming lighting system based on incremental PID controller is designed, which consists of MEGA16 chip as a Micro-controller Unit (MCU), the ambient light sensor BH1750 chip with Inter-Integrated Circuit (I2C), and constant-current driving circuit. A given value of light intensity required for the on-line detecting environment need to be saved to the register of MCU. The optical intensity, detected by BH1750 chip in real time, is converted to digital signal by AD converter of the BH1750 chip, and then transmitted to MEGA16 chip through I2C serial bus. Since the variation law of light intensity in the on-line detecting environment is usually not easy to be established, incremental Proportional-Integral-Differential (PID) algorithm is applied in this system. Control variable obtained by the incremental PID determines duty cycle of Pulse-Width Modulation (PWM). Consequently, LED's forward current is adjusted by PWM, and the luminous intensity of the detection environment is stabilized by self-adaptation. The coefficients of incremental PID are obtained respectively after experiments. Compared with the traditional LED dimming system, it has advantages of anti-interference, simple construction, fast response, and high stability by the use of incremental PID algorithm and BH1750 chip with I2C serial bus. Therefore, it is suitable for the adaptive on-line detecting applications.

ZnO-nanorods: A possible white LED phosphor

Science.gov (United States)

Sarangi, Sachindra Nath; T., Arun; Ray, Dinseh K.; Sahoo, Pratap Kumar; Nozaki, Shinji; Sugiyama, Noriyuki; Uchida, Kazuo

2017-05-01

The white light-emitting diodes (LEDs) have drawn much attention to replace conventional lighting sources because of low energy consumption, high light efficiency and long lifetime. Although the most common approach to produce white light is to combine a blue LED chip and a yellow phosphor, such a white LED cannot be used for a general lighting application, which requires a broad luminescence spectrum in the visible wavelength range. We have successfully chemically synthesized the ZnO nanorods showing intense broad luminescence in the visible wavelength range and made a white LED using the ZnO nanorods as phosphor excited with a blue LED. Their lengths and diameters were 2 - 10 μm and 200 - 800 nm, respectively. The wurtzite structure was confirmed by the x-ray diffraction measurement. The PL spectrum obtained by exciting the ZnO nanorods with the He-Cd laser has two peaks, one associated with the near band-edge recombination and the other with recombination via defects. The peak intensity of the near band-edge luminescence at 388 nm is much weaker than that of the defect-related luminescence. The latter luminescence peak ranges from 450 to 850 nm and broad enough to be used as a phosphor for a white LED. A white LED has been fabricated using a blue LED with 450 nm emission and ZnO nanorod powders. The LED performances show a white light emission and the electroluminescence measurement shows a stiff increase in white light intensity with increasing blue LED current. The Commission International de1'Eclairage (CIE) chromaticity colour coordinates of 450 nm LED pumped white emission shows a coordinate of (0.31, 0.32) for white LED at 350 mA. These results indicate that ZnO nanorods provides an alternate and effective approach to achieve high-performance white LEDs and also other optoelectronic devices.

Measuring the attenuation length of water in the CHIPS-M water Cherenkov detector

Energy Technology Data Exchange (ETDEWEB)

Amat, F.; Bizouard, P. [Aix Marseille University Saint-Jerome, 13013 Marseille (France); Bryant, J. [Department of Physics and Astronomy, UCL, Gower St, London WC1E 6BT (United Kingdom); Carroll, T.J.; Rijck, S. De [Department of Physics, University of Texas at Austin, Austin, TX 78712 (United States); Germani, S. [Department of Physics and Astronomy, UCL, Gower St, London WC1E 6BT (United Kingdom); Joyce, T. [School of Physics and Astronomy, University of Minnesota, Minneapolis, MN 55455 (United States); Kriesten, B. [Department of Physics, College of William & Mary, Williamsburg, VA 23187 (United States); Marshak, M.; Meier, J. [School of Physics and Astronomy, University of Minnesota, Minneapolis, MN 55455 (United States); Nelson, J.K. [Department of Physics, College of William & Mary, Williamsburg, VA 23187 (United States); Perch, A.J.; Pfützner, M.M. [Department of Physics and Astronomy, UCL, Gower St, London WC1E 6BT (United Kingdom); Salazar, R. [Department of Physics, University of Texas at Austin, Austin, TX 78712 (United States); Thomas, J., E-mail: jennifer.thomas@ucl.ac.uk [Department of Physics and Astronomy, UCL, Gower St, London WC1E 6BT (United Kingdom); Department of Physics, University of Wisconsin, Madison, WI 53706 (United States); Trokan-Tenorio, J. [Department of Physics, University of Wisconsin, Madison, WI 53706 (United States); Vahle, P. [Department of Physics, College of William & Mary, Williamsburg, VA 23187 (United States); Wade, R. [Avenir Consulting, Abingdon, Oxfordshire (United Kingdom); Wendt, C. [Department of Physics, University of Wisconsin, Madison, WI 53706 (United States); Whitehead, L.H. [Department of Physics and Astronomy, UCL, Gower St, London WC1E 6BT (United Kingdom); and others

2017-02-01

The water at the proposed site of the CHIPS water Cherenkov detector has been studied to measure its attenuation length for Cherenkov light as a function of filtering time. A scaled model of the CHIPS detector filled with water from the Wentworth 2W pit, proposed site of the CHIPS deployment, in conjunction with a 3.2 m vertical column filled with this water, was used to study the transmission of 405 nm laser light. Results consistent with attenuation lengths of up to 100 m were observed for this wavelength with filtration and UV sterilization alone.

Chip-scale white flip-chip light-emitting diode containing indium phosphide/zinc selenide quantum dots

Science.gov (United States)

Fan, Bingfeng; Yan, Linchao; Lao, Yuqin; Ma, Yanfei; Chen, Zimin; Ma, Xuejin; Zhuo, Yi; Pei, Yanli; Wang, Gang

2017-08-01

A method for preparing a quantum dot (QD)-white light-emitting diode (WLED) is reported. Holes were etched in the SiO2 layer deposited on the sapphire substrate of the flip-chip LED by inductively coupled plasma, and these holes were then filled with QDs. An ultraviolet-curable resin was then spin-coated on top of the QD-containing SiO2 layer, and the resin was cured to act as a protecting layer. The reflective sidewall structure minimized sidelight leakage. The fabrication of the QD-WLED is simple in preparation and compatible with traditional LED processes, which was the minimum size of the WLED chip-scale integrated package. InP/ZnS core-shell QDs were used as the converter in the WLED. A blue light-emitting diode with a flip-chip structure was used as the excitation source. The QD-WLED exhibited color temperatures from 5900 to 6400 K and Commission Internationale De L'Elcairage color coordinates from (0.315, 0.325) to (0.325, 0.317), under drive currents from 100 to 400 mA. The QD-WLED exhibited stable optoelectronic properties.

White LEDs with limit luminous efficacy

Energy Technology Data Exchange (ETDEWEB)

Lisitsyn, V. M.; Stepanov, S. A., E-mail: stepanovsa@tpu.ru; Yangyang, Ju [National Research Tomsk Polytechnic University, 30 Lenin Av., Tomsk, 634050 (Russian Federation); Lukash, V. S. [JSC Research Institute of Semiconductor Devices, 99a Krasnoarmeyskaja St., Tomsk, 634050 (Russian Federation)

2016-01-15

In most promising widespread gallium nitride based LEDs emission is generated in the blue spectral region with a maximum at about 450 nm which is converted to visible light with the desired spectrum by means of phosphor. The thermal energy in the conversion is determined by the difference in the energies of excitation and emission quanta and the phosphor quantum yield. Heat losses manifest themselves as decrease in the luminous efficacy. LED heating significantly reduces its efficiency and life. In addition, while heating, the emission generation output and the efficiency of the emission conversion decrease. Therefore, the reduction of the energy losses caused by heating is crucial for LED development. In this paper, heat losses in phosphor-converted LEDs (hereinafter chips) during spectrum conversion are estimated. The limit values of the luminous efficacy for white LEDs are evaluated.

CMOS On-Chip Optoelectronic Neural Interface Device with Integrated Light Source for Optogenetics

International Nuclear Information System (INIS)

Sawadsaringkarn, Y; Kimura, H; Maezawa, Y; Nakajima, A; Kobayashi, T; Sasagawa, K; Noda, T; Tokuda, T; Ohta, J

2012-01-01

A novel optoelectronic neural interface device is proposed for target applications in optogenetics for neural science. The device consists of a light emitting diode (LED) array implemented on a CMOS image sensor for on-chip local light stimulation. In this study, we designed a suitable CMOS image sensor equipped with on-chip electrodes to drive the LEDs, and developed a device structure and packaging process for LED integration. The prototype device produced an illumination intensity of approximately 1 mW with a driving current of 2.0 mA, which is expected to be sufficient to activate channelrhodopsin (ChR2). We also demonstrated the functions of light stimulation and on-chip imaging using a brain slice from a mouse as a target sample.

A 3 W High-Voltage Single-Chip Green Light-Emitting Diode with Multiple-Cells Network

Directory of Open Access Journals (Sweden)

W. Wang

2015-01-01

Full Text Available A parallel and series network structure was introduced into the design of the high-voltage single-chip (HV-SC light-emitting diode to inhibit the effect of current crowding and to improve the yield. Using such a design, a 6.6×5 mm2 large area LED chip of 24 parallel stages was demonstrated with 3 W light output power (LOP at the current of 500 mA. The forward voltage was measured to be 83 V with the same current injection, corresponding to 3.5 V for a single stage. The LED chip’s average thermal resistance was identified to be 0.28 K/W by using infrared thermography analysis.

Progress in the development of the DTMROC time measurement chip for the ATLAS transition radiation tracker (TRT)

CERN Document Server

Alexander, C; Dressnandt, N; Ekenberg, T; Farthouat, Philippe; Keener, P T; Lam, N; La Marra, D; Mann, J; Newcomer, F M; Ryzhov, V; Söderberg, M; Szczygiel, R; Van Berg, R; Williams, H H

2001-01-01

A 16-channel digital time-measurement readout chip (DTMROC) has been fabricated in the TEMIC/DM1LL left bracket 1 right bracket BI- CMOS radiation-hard process for the Large Hadron Collider's (LHC) Transition Radiation Tracker (ATLAS/TRT) at CERN left bracket 2 right bracket . The chip receives discriminated straw-drift-tube signals from bipolar amplifier-shaper-discriminator chips (ASDBLR). measures the arrival time in 3.125 ns increments ( plus or minus 1 ns), and stores the data in a pipeline for 3.3mus. A trigger signal (L1A) causes the data to be tagged with a time stamp and stored for readout- Up to 13 events may be stored in an on-chip buffer while data is being clocked out in a 40 MHz serial stream. The chip has been designed to function after exposure to 1x10**1**4 protons/cm**2 and 1 Mrad total dose. System beam-tests have demonstrated measurement of track positions with a resolution of 165mum and 85% efficiency at rates up to 18MHz. 6 Refs.

Photonic crystal and photonic quasicrystal patterned in PDMS surfaces and their effect on LED radiation properties

Energy Technology Data Exchange (ETDEWEB)

Suslik, Lubos [Dept. of Physics, Faculty of Electrical Engineering, University of Zilina, Univerzitna 1, 010 26, Zilina (Slovakia); Pudis, Dusan, E-mail: pudis@fyzika.uniza.sk [Dept. of Physics, Faculty of Electrical Engineering, University of Zilina, Univerzitna 1, 010 26, Zilina (Slovakia); Goraus, Matej [Dept. of Physics, Faculty of Electrical Engineering, University of Zilina, Univerzitna 1, 010 26, Zilina (Slovakia); Nolte, Rainer [Fakultät für Maschinenbau FG Lichttechnik Ilmenau University of Technology, Ilmenau (Germany); Kovac, Jaroslav [Inst. of Electronics and Photonics, Slovak University of Technology, Ilkovicova 3, 812 19, Bratislava (Slovakia); Durisova, Jana; Gaso, Peter [Dept. of Physics, Faculty of Electrical Engineering, University of Zilina, Univerzitna 1, 010 26, Zilina (Slovakia); Hronec, Pavol [Inst. of Electronics and Photonics, Slovak University of Technology, Ilkovicova 3, 812 19, Bratislava (Slovakia); Schaaf, Peter [Chair Materials for Electronics, Institute of Materials Engineering and Institute of Micro- and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau (Germany)

2017-02-15

Graphical abstract: Photonic quasicrystal patterned in the surface of polydimethylsiloxane membrane (left) and radiation pattern of light emitting diode with patterned membrane applied in the surface (right). - Highlights: • We presented fabrication technique of PDMS membranes with patterned surface by photonic crystal (PhC) and photonic quasi-crystal (PQC). • Presented technique is effective for preparation PhC and PQC PDMS membranes easily implementing in the LED chip. • From the goniophotometer measurements, the membranes document effective angular emission due to the diffraction on patterned surfaces. • 12 fold symmetry PQC structure shows homogeneous radiation pattern, while the 2 fold symmetry of square PhC shows evident diffraction lobes. - Abstract: We present results of fabrication and implementation of thin polydimethylsiloxane (PDMS) membranes with patterned surface for the light emitting diode (LED). PDMS membranes were patterned by using the interference lithography in combination with embossing technique. Two-dimensional photonic crystal and photonic quasicrystal structures with different period were patterned in the surface of thin PDMS membranes with depth up to 550 nm. Patterned PDMS membranes placed on the LED chip effectively diffracted light and increased angular emission of LED radiation pattern. We presented effective technique for fabrication of patterned PDMS membranes, which could modify the emission properties of optoelectronic devices and can be applied directly on surface LEDs and small optical devices.

A thermosyphon heat pipe cooler for high power LEDs cooling

Science.gov (United States)

Li, Ji; Tian, Wenkai; Lv, Lucang

2016-08-01

Light emitting diode (LED) cooling is facing the challenge of high heat flux more seriously with the increase of input power and diode density. The proposed unique thermosyphon heat pipe heat sink is particularly suitable for cooling of high power density LED chips and other electronics, which has a heat dissipation potential of up to 280 W within an area of 20 mm × 22 mm (>60 W/cm2) under natural air convection. Meanwhile, a thorough visualization investigation was carried out to explore the two phase flow characteristics in the proposed thermosyphon heat pipe. Implementing this novel thermosyphon heat pipe heat sink in the cooling of a commercial 100 W LED integrated chip, a very low apparent thermal resistance of 0.34 K/W was obtained under natural air convection with the aid of the enhanced boiling heat transfer at the evaporation side and the enhanced natural air convection at the condensation side.

Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

International Nuclear Information System (INIS)

Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung-hyun; Nah, Jae-Woong; Paik, Kyung-Wook; Kwon, Dongil

2004-01-01

Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 deg. C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA)

Conductive Polymer Microelectrodes for on-chip measurement of transmitter release from living cells

DEFF Research Database (Denmark)

Larsen, Simon Tylsgaard; Matteucci, Marco; Taboryski, Rafael J.

2012-01-01

driven cell trapping inside closed chip devices. Conductive polymer microelectrodes were used to measure transmitter release using electrochemical methods such as cyclic voltammetry and constant potential amperometry. By measuring the oxidation current at a cyclic voltammogram, the concentration...

XA readout chip characteristics and CdZnTe spectral measurements

International Nuclear Information System (INIS)

Barbier, L.M.; Birsa, F.; Odom, J.

1999-01-01

The authors report on the performance of a CdZnTe (CZT) array readout by an XA (X-ray imaging chip produced at the AMS foundry) application specific readout chip (ASIC). The array was designed and fabricated at NASA/Goddard Space Flight Center (GSFC) as a prototype for the Burst Arc-Second Imaging and Spectroscopy gamma-ray instrument. The XA ASIC was obtained from Integrated Detector and Electronics (IDE), in Norway. Performance characteristics and spectral data for 241 Am are presented both at room temperature and at -20 C. The measured noise (σ) was 2.5 keV at 60 keV at room temperature. This paper represents a progress report on work with the XA ASIC and CZT detectors. Work is continuing and in particular, larger arrays are planned for future NASA missions

A novel dimmable LED driver with soft-start and UVLO circuits

International Nuclear Information System (INIS)

Jiang Jinguang; Tan Gaojian; Zhou Xifeng; Zhang Zeyu

2015-01-01

A fully integrated LED driver based on a current mode PWM boost DC—DC converter with constant output current is proposed. In order to suppress the inrush of current and the overshoot voltage at the start up state, a soft-start circuit is adopted. Additionally, to adjust the LED brightness without color variation over the full dimming range and achieve high efficiency, a PWM dimming circuit is presented. Furthermore, to keep the loop stability of the LED driver, an internal slope compensation network is designed to avoid the sub-harmonic oscillation when the duty cycle exceeds 50%. Finally, a UVLO circuit is adopted to improve the reliability of the LED driver against the input voltage changing. The LED driver has been fabricated with a standard 0.5 μm CMOS process, and only occupies 1.21 × 0.76 mm 2 . Experimental results show that the brightness of the LED can be adjusted by an off-chip PWM signal with a wide adjusting range. The inductor current and output current increase smoothly over the whole load range. The chip is in the UVLO condition when the input voltage is below 2.18 V and has achieved about 137 μs typical start-up time. (semiconductor integrated circuits)

Study on the mechanism of color coordinate shift of LED package

Science.gov (United States)

Zhuang, Yunyi; Wang, Yong; Yang, Bobo; Li, Zhanguo; Yang, Lei; Zou, Jun

2017-07-01

In the paper, the influences of the chip, silicone and phosphors on the color coordinate shift of LED were studied. In the process of LED baking, it was found that the effect of the chip and silicone on the color coordinate drift is less than 3% through the analysis of each influencing factor. But the influence of the phosphors is large and accounted for 11.11% of the overall impact factors. Therefore, it is important to select the better green phosphors in thermal stability for the LED package and it has a guiding significance to the color coordinate of LED distribution. Project supported by the National Natural Science Foundation of China (No. 11474036), the Natural Science Foundation of Shanghai (No. 12ZR1430900), the Shanghai Institute of Technology Talents Scheme (No. YJ2014-04), the Shanghai Municipal Alliance Program (Nos. Lm201514, Lm201505, Lm201455), the Science and Technology Commission of Shanghai Municipality (CN) (No. 14500503300), the Shanghai Cooperative Project (No. ShanghaiCXY-2013-61), and the Jiashan County Technology Program (No. 20141316).

Optical pumping of deep traps in AlGaN/GaN-on-Si HEMTs using an on-chip Schottky-on-heterojunction light-emitting diode

International Nuclear Information System (INIS)

Li, Baikui; Tang, Xi; Chen, Kevin J.

2015-01-01

In this work, by using an on-chip integrated Schottky-on-heterojunction light-emitting diode (SoH-LED) which is seamlessly integrated with the AlGaN/GaN high electron mobility transistor (HEMT), we studied the effect of on-chip light illumination on the de-trapping processes of electrons from both surface and bulk traps. Surface trapping was generated by applying OFF-state drain bias stress, while bulk trapping was generated by applying positive substrate bias stress. The de-trapping processes of surface and/or bulk traps were monitored by measuring the recovery of dynamic on-resistance R on and/or threshold voltage V th of the HEMT. The results show that the recovery processes of both dynamic R on and threshold voltage V th of the HEMT can be accelerated by the on-chip SoH-LED light illumination, demonstrating the potentiality of on-chip hybrid opto-HEMTs to minimize the influences of traps during dynamic operation of AlGaN/GaN power HEMTs

An overview of LED applications for general illumination

Science.gov (United States)

Pelka, David G.; Patel, Kavita

2003-11-01

This paper begins by reviewing the current state of development of LEDs, their existing markets as well as their potential for energy conservation and their potential for gaining market share in the general illumination market. It discusses LED metrics such as chip size, lumens per watt, thermal resistance, and the recommended maximum current rating. The paper then goes on to consider the importance of non-imaging optics for both optically efficient and extremely compact LED lighting systems. Finally, microstructures useful for controlling the fields-of-view of LED lighting systems are considered and described in some detail. An extremely efficient and cost effective microstructure, called kinoform diffusers, is shown to have very unique properties that make this technology almost ideal for shaping the output beams of LED lighting systems. It concludes by illustrating some general illumination LED lighting systems

White LED visible light communication technology research

Science.gov (United States)

Yang, Chao

2017-03-01

Visible light communication is a new type of wireless optical communication technology. White LED to the success of development, the LED lighting technology is facing a new revolution. Because the LED has high sensitivity, modulation, the advantages of good performance, large transmission power, can make it in light transmission light signal at the same time. Use white LED light-emitting characteristics, on the modulation signals to the visible light transmission, can constitute a LED visible light communication system. We built a small visible optical communication system. The system composition and structure has certain value in the field of practical application, and we also research the key technology of transmitters and receivers, the key problem has been resolved. By studying on the optical and LED the characteristics of a high speed modulation driving circuit and a high sensitive receiving circuit was designed. And information transmission through the single chip microcomputer test, a preliminary verification has realized the data transmission function.

On-Chip Method to Measure Mechanical Characteristics of a Single Cell by Using Moiré Fringe

Directory of Open Access Journals (Sweden)

Hirotaka Sugiura

2015-06-01

Full Text Available We propose a method to characterize the mechanical properties of cells using a robot-integrated microfluidic chip (robochip and microscopy. The microfluidic chip is designed to apply the specified deformations to a single detached cell using an on-chip actuator probe. The reaction force is simultaneously measured using an on-chip force sensor composed of a hollow folded beam and probe structure. In order to measure the cellular characteristics in further detail, a sub-pixel level of resolution of probe position is required. Therefore, we utilize the phase detection of moiré fringe. Using this method, the experimental resolution of the probe position reaches 42 nm. This is approximately ten times smaller than the optical wavelength, which is the limit of sharp imaging with a microscope. Calibration of the force sensor is also important in accurately measuring cellular reaction forces. We calibrated the spring constant from the frequency response, by the proposed sensing method of the probe position. As a representative of mechanical characteristics, we measured the elastic modulus of Madin-Darby Cannie Kidney (MDCK cells. In spite of the rigid spring constant, the resolution and sensitivity were twice that achieved in our previous study. Unique cellular characteristics can be elucidated by the improvements in sensing resolution and accuracy.

Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method.

Science.gov (United States)

Qian, Cheng; Fan, Jiajie; Fang, Jiayi; Yu, Chaohua; Ren, Yi; Fan, Xuejun; Zhang, Guoqi

2017-10-16

By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample's rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs.

Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method

Science.gov (United States)

Yu, Chaohua; Fan, Xuejun; Zhang, Guoqi

2017-01-01

By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample’s rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs. PMID:29035300

MACSYM. Towards a system of measurement and control on a single chip

Energy Technology Data Exchange (ETDEWEB)

Zannoli, S

1984-03-01

Since it is now possible to produce A/D and D/A integrated circuits on a single chip at a remarkably low cost, the production of an entire system for the acquisition of measurements and control of data on a single chip can be foreseen. The MACSYM (measurement and control system), produced by Analog Devices Inc., contains all its components on a single circuit board. The MACSYM 150 is a multiprocessor with separate analogue and digital buses. Because it contains three CPUS with special functions, it has high operating speeds and can handle a number of programs simultaneously. Since this model is designed for on line and real time measurements of physical quantities it has a number of different stores, including a central store, a store for graphs in colour and fast output and input stores for metered data. The author describes the interface provided and the terminals to which data can be supplied and mentions the programming language used.

Far field measurements of phc led prepared by e-beam lithography

International Nuclear Information System (INIS)

Hronec, P.; Skriniarova, J.; Kovac, J.; Pudis, D.; Bencurova, A.; Nemec, P.

2014-01-01

The paper deals with optical characterization of the Al_0_._2_9_5Ga_0_._7_0_5As/GaAs multi quantum well light emitting diode (LED) structure with patterned photonic crystal (2D PhC). The 2D PhC was patterned on the top of the structure using Electron Beam Direct Write Lithography (EBDWL). The LEDs light-current characteristics were measured by using integrating sphere, where extracted light intensity increase was observed at 10 mA forward current as 24.2 %. Also far field measurements were performed at forward current of 10 mA. Comparison of reference LED and PhC LED far fields shows increase in whole emission area. As a complementary method for extracted light intensity increase evaluation, relative light intensity distributed in the far field was integrated in range of ±60 grad in both θ and φ coordinate of spherical coordinate system. This method shows increase of extracted light intensity as 35.6 %. We suggest this method as more suitable for evaluation of extracted light intensity increase because it omits emission from edges of the LED and thus light is measured only from the area where PhC is patterned. (authors)

Looking to the future of organs-on-chips: interview with Professor John Wikswo.

Science.gov (United States)

Wikswo, John P

2017-06-01

John Wikswo talks to Francesca Lake, Managing Editor: John is the founding Director of the Vanderbilt Institute for Integrative Biosystems Research and Education (VIIBRE). He is also the Gordon A Cain University Professor; a B learned Professor of Living State Physics; and a Professor of Biomedical Engineering, Molecular Physiology and Biophysics, and Physics. John earned his PhD in physics at Stanford University (CA, USA). After serving as a Research Fellow in Cardiology at Stanford, he joined the Department of Physics and Astronomy at Vanderbilt University (TN, USA), where he went on to make the first measurement of the magnetic field of an isolated nerve. He founded VIIBRE at Vanderbilt in 2001 in order to foster and enhance interdisciplinary research in the biophysical sciences, bioengineering and medicine. VIIBRE efforts have led to the development of devices integral to organ-on-chip research. He is focusing on the neurovascular unit-on-a-chip, heart-on-a-chip, a missing organ microformulator, and microfluidic pumps and valves to control and analyze organs-on-chips.

Quantized correlation coefficient for measuring reproducibility of ChIP-chip data

Directory of Open Access Journals (Sweden)

Kuroda Mitzi I

2010-07-01

Full Text Available Abstract Background Chromatin immunoprecipitation followed by microarray hybridization (ChIP-chip is used to study protein-DNA interactions and histone modifications on a genome-scale. To ensure data quality, these experiments are usually performed in replicates, and a correlation coefficient between replicates is used often to assess reproducibility. However, the correlation coefficient can be misleading because it is affected not only by the reproducibility of the signal but also by the amount of binding signal present in the data. Results We develop the Quantized correlation coefficient (QCC that is much less dependent on the amount of signal. This involves discretization of data into set of quantiles (quantization, a merging procedure to group the background probes, and recalculation of the Pearson correlation coefficient. This procedure reduces the influence of the background noise on the statistic, which then properly focuses more on the reproducibility of the signal. The performance of this procedure is tested in both simulated and real ChIP-chip data. For replicates with different levels of enrichment over background and coverage, we find that QCC reflects reproducibility more accurately and is more robust than the standard Pearson or Spearman correlation coefficients. The quantization and the merging procedure can also suggest a proper quantile threshold for separating signal from background for further analysis. Conclusions To measure reproducibility of ChIP-chip data correctly, a correlation coefficient that is robust to the amount of signal present should be used. QCC is one such measure. The QCC statistic can also be applied in a variety of other contexts for measuring reproducibility, including analysis of array CGH data for DNA copy number and gene expression data.

Quantized correlation coefficient for measuring reproducibility of ChIP-chip data.

Science.gov (United States)

Peng, Shouyong; Kuroda, Mitzi I; Park, Peter J

2010-07-27

Chromatin immunoprecipitation followed by microarray hybridization (ChIP-chip) is used to study protein-DNA interactions and histone modifications on a genome-scale. To ensure data quality, these experiments are usually performed in replicates, and a correlation coefficient between replicates is used often to assess reproducibility. However, the correlation coefficient can be misleading because it is affected not only by the reproducibility of the signal but also by the amount of binding signal present in the data. We develop the Quantized correlation coefficient (QCC) that is much less dependent on the amount of signal. This involves discretization of data into set of quantiles (quantization), a merging procedure to group the background probes, and recalculation of the Pearson correlation coefficient. This procedure reduces the influence of the background noise on the statistic, which then properly focuses more on the reproducibility of the signal. The performance of this procedure is tested in both simulated and real ChIP-chip data. For replicates with different levels of enrichment over background and coverage, we find that QCC reflects reproducibility more accurately and is more robust than the standard Pearson or Spearman correlation coefficients. The quantization and the merging procedure can also suggest a proper quantile threshold for separating signal from background for further analysis. To measure reproducibility of ChIP-chip data correctly, a correlation coefficient that is robust to the amount of signal present should be used. QCC is one such measure. The QCC statistic can also be applied in a variety of other contexts for measuring reproducibility, including analysis of array CGH data for DNA copy number and gene expression data.

Morphologies and optical and electrical properties of InGaN/GaN micro-square array light-emitting diode chips.

Science.gov (United States)

Han, Dan; Ma, Shufang; Jia, Zhigang; Liu, Peizhi; Jia, Wei; Shang, Lin; Zhai, Guangmei; Xu, Bingshe

2018-04-10

InGaN/GaN micro-square array light-emitting diode (LED) chips (micro-chips) have been prepared via the focused ion beam (FIB) etching technique, which can not only reduce ohmic contact degradation but also control the aspect ratio precisely in three-dimensional (3D) structure LED (3D-LED) device fabrication. The effects of FIB beam current and micro-square array depth on morphologies and optical and electrical properties of the micro-chips have been studied. Our results show that sidewall surface morphology and optical and electrical properties of the micro-chips degrade with increased beam current. After potassium hydroxide etching with different times, an optimal current-voltage and luminescence performance can be obtained. Combining the results of cathodoluminescence mappings and light output-current characteristics, the light extraction efficiency of the micro-chips is reduced as FIB etch depth increases. The mechanisms of micro-square depth on light extraction have been revealed by 3D finite difference time domain.

Testing a high-power LED based light source for hyperspectral imaging microscopy

Science.gov (United States)

Klomkaew, Phiwat; Mayes, Sam A.; Rich, Thomas C.; Leavesley, Silas J.

2017-02-01

Our lab has worked to develop high-speed hyperspectral imaging systems that scan the fluorescence excitation spectrum for biomedical imaging applications. Hyperspectral imaging can be used in remote sensing, medical imaging, reaction analysis, and other applications. Here, we describe the development of a hyperspectral imaging system that comprised an inverted Nikon Eclipse microscope, sCMOS camera, and a custom light source that utilized a series of high-power LEDs. LED selection was performed to achieve wavelengths of 350-590 nm. To reduce scattering, LEDs with low viewing angles were selected. LEDs were surface-mount soldered and powered by an RCD. We utilized 3D printed mounting brackets to assemble all circuit components. Spectraradiometric calibration was performed using a spectrometer (QE65000, Ocean Optics) and integrating sphere (FOIS-1, Ocean Optics). Optical output and LED driving current were measured over a range of illumination intensities. A normalization algorithm was used to calibrate and optimize the intensity of the light source. The highest illumination power was at 375 nm (3300 mW/cm2), while the lowest illumination power was at 515, 525, and 590 nm (5200 mW/cm2). Comparing the intensities supplied by each LED to the intensities measured at the microscope stage, we found there was a great loss in power output. Future work will focus on using two of the same LEDs to double the power and finding more LED and/or laser diodes and chips around the range. This custom hyperspectral imaging system could be used for the detection of cancer and the identification of biomolecules.

Miniature interferometer for refractive index measurement in microfluidic chip

Science.gov (United States)

Chen, Minghui; Geiser, Martial; Truffer, Frederic; Song, Chengli

2012-12-01

The design and development of the miniaturized interferometer for measurement of the refractive index or concentration of sub-microliter volume aqueous solution in microfludic chip is presented. It is manifested by a successful measurement of the refractive index of sugar-water solution, by utilizing a laser diode for light source and the small robust instrumentation for practical implementation. Theoretically, the measurement principle and the feasibility of the system are analyzed. Experimental device is constructed with a diode laser, lens, two optical plate and a complementary metal oxide semiconductor (CMOS). Through measuring the positional changes of the interference fringes, the refractive index change are retrieved. A refractive index change of 10-4 is inferred from the measured image data. The entire system is approximately the size of half and a deck of cards and can operate on battery power for long time.

Optical pumping of deep traps in AlGaN/GaN-on-Si HEMTs using an on-chip Schottky-on-heterojunction light-emitting diode

Energy Technology Data Exchange (ETDEWEB)

Li, Baikui; Tang, Xi; Chen, Kevin J., E-mail: eekjchen@ust.hk [Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon (Hong Kong)

2015-03-02

In this work, by using an on-chip integrated Schottky-on-heterojunction light-emitting diode (SoH-LED) which is seamlessly integrated with the AlGaN/GaN high electron mobility transistor (HEMT), we studied the effect of on-chip light illumination on the de-trapping processes of electrons from both surface and bulk traps. Surface trapping was generated by applying OFF-state drain bias stress, while bulk trapping was generated by applying positive substrate bias stress. The de-trapping processes of surface and/or bulk traps were monitored by measuring the recovery of dynamic on-resistance R{sub on} and/or threshold voltage V{sub th} of the HEMT. The results show that the recovery processes of both dynamic R{sub on} and threshold voltage V{sub th} of the HEMT can be accelerated by the on-chip SoH-LED light illumination, demonstrating the potentiality of on-chip hybrid opto-HEMTs to minimize the influences of traps during dynamic operation of AlGaN/GaN power HEMTs.

Injection molding of high precision optics for LED applications made of liquid silicone rubber

Energy Technology Data Exchange (ETDEWEB)

Hopmann, Christian; Röbig, Malte [Institute of Plastics Processing (IKV), RWTH Aachen University, Pontstraße 49, 52062 Aachen (Germany)

2016-03-09

Light Emitting Diodes (LED) conquer the growing global market of lighting technologies. Due to their advantages, they are increasingly used in consumer products, in lighting applications in the home and in the mobility sector as well as in industrial applications. Particularly, with regard to the increasing use of high-power LED (HP-LED) the materials in the surrounding area of the light emitting semiconductor chip are of utmost importance. While the materials behind the semiconductor chip are optimized for maximum heat dissipation, the materials currently used for the encapsulation of the semiconductor chip (primary optics) and the secondary optics encounter their limits due to the high temperatures. In addition certain amounts of blue UV radiation degrade the currently used materials such as epoxy resins or polyurethanes for primary optics. In the context of an ongoing joint research project with various partners from the industry, an innovative manufacturing method for high precision optics for LED applications made of liquid silicone rubber (LSR) is analyzed at the Institut of Plastics Processing (IKV), Aachen. The aim of this project is to utilize the material-specific advantages of high transparent LSR, especially the excellent high temperature resistance and the great freedom in design. Therefore, a high integrated injection molding process is developed. For the production of combined LED primary and secondary optics a LED board is placed in an injection mold and overmolded with LSR. Due to the integrated process and the reduction of subcomponents like the secondary optics the economics of the production process can be improved significantly. Furthermore combined LED optics offer an improved effectiveness, because there are no losses of the light power at the transition of the primary and secondary optics.

Quantitative measurements of intercellular adhesion between a macrophage and cancer cells using a cup-attached AFM chip.

Science.gov (United States)

Kim, Hyonchol; Yamagishi, Ayana; Imaizumi, Miku; Onomura, Yui; Nagasaki, Akira; Miyagi, Yohei; Okada, Tomoko; Nakamura, Chikashi

2017-07-01

Intercellular adhesion between a macrophage and cancer cells was quantitatively measured using atomic force microscopy (AFM). Cup-shaped metal hemispheres were fabricated using polystyrene particles as a template, and a cup was attached to the apex of the AFM cantilever. The cup-attached AFM chip (cup-chip) approached a murine macrophage cell (J774.2), the cell was captured on the inner concave of the cup, and picked up by withdrawing the cup-chip from the substrate. The cell-attached chip was advanced towards a murine breast cancer cell (FP10SC2), and intercellular adhesion between the two cells was quantitatively measured. To compare cell adhesion strength, the work required to separate two adhered cells (separation work) was used as a parameter. Separation work was almost 2-fold larger between a J774.2 cell and FP10SC2 cell than between J774.2 cell and three additional different cancer cells (4T1E, MAT-LyLu, and U-2OS), two FP10SC2 cells, or two J774.2 cells. FP10SC2 was established from 4T1E as a highly metastatic cell line, indicates separation work increased as the malignancy of cancer cells became higher. One possible explanation of the strong adhesion of macrophages to cancer cells observed in this study is that the measurement condition mimicked the microenvironment of tumor-associated macrophages (TAMs) in vivo, and J774.2 cells strongly expressed CD204, which is a marker of TAMs. The results of the present study, which were obtained by measuring cell adhesion strength quantitatively, indicate that the fabricated cup-chip is a useful tool for measuring intercellular adhesion easily and quantitatively. Copyright © 2017 Elsevier B.V. All rights reserved.

Measurements of UGR of LED light by a DSLR colorimeter

Science.gov (United States)

Hsu, Shau-Wei; Chen, Cheng-Hsien; Jiaan, Yuh-Der

2012-10-01

We have developed an image-based measurement method on UGR (unified glare rating) of interior lighting environment. A calibrated DSLR (digital single-lens reflex camera) with an ultra wide-angle lens was used to measure the luminance distribution, by which the corresponding parameters can be automatically calculated. A LED lighting was placed in a room and measured at various positions and directions to study the properties of UGR. The testing results are fitted with visual experiences and UGR principles. To further examine the results, a spectroradiometer and an illuminance meter were respectively used to measure the luminance and illuminance at the same position and orientation of the DSLR. The calculation of UGR by this image-based method may solve the problem of non-uniform luminance-distribution of LED lighting, and was studied on segmentation of the luminance graph for the calculations.

Pulseshape characteristics of a 300 $\\mu$m PR03 R-measuring VELO sensor read out with a Beetle1.3 chip

CERN Document Server

Palacios, A; Buytaert, J; Borel, J; Collins, P; Eckstein, D; Eklund, L; Ferro-Luzzi, M; Jans, E; Ketel, T; Petrie, D; Pivk, M; Tobin, M

2005-01-01

The signal-to-noise, overspill and undershoot characteristics of a VELO module equipped with Beetle1.3 read-out chips have been measured using 120 GeV pions from the SPS test beam facility at CERN. The module consists of a PR03 n-on-n 300 $\\mu$m R measuring prototype sensor and a fully populated K03 hybrid. Results are presented for a single Beetle1.3 chip with a variety of chip parameter settings controlling the pre-amplifier and shaper currents and feedback voltages, with the objective of establishing the performance of the module and understanding its dependence on the read-out chip settings.

Measurement of pO2 in a Pre-clinical Model of Rabbit Tumor Using OxyChip, a Paramagnetic Oxygen Sensor.

Science.gov (United States)

Hou, H; Khan, N; Kuppusamy, P

2017-01-01

The objective of this work was to establish a novel and robust technology, based on electron paramagnetic resonance (EPR) oximetry, as a practical tool for measurement of tumor oxygen. Previously, we have reported on the development of oxygen-sensing paramagnetic crystals (LiNc-BuO) encapsulated in a biocompatible polymer, called OxyChip. In this report we present our recent data on the use of OxyChip for pO 2 measurements in the tumor of a pre-clinical, large-animal rabbit model. The results establish that OxyChip is capable of noninvasive and repeated measurement of pO 2 in a large animal model.

Photoelectrochemical liftoff of LEDs grown on freestanding c-plane GaN substrates

KAUST Repository

Hwang, David

2016-09-23

We demonstrate a thin-film flip-chip (TFFC) process for LEDs grown on freestanding c-plane GaN substrates. LEDs are transferred from a bulk GaN substrate to a sapphire submount via a photoelectrochemical (PEC) undercut etch. This PEC liftoff method allows for substrate reuse and exposes the N-face of the LEDs for additional roughening. The LEDs emitted at a wavelength of 432 nm with a turn on voltage of ~3 V. Etching the LEDs in heated KOH after transferring them to a sapphire submount increased the peak external quantum efficiency (EQE) by 42.5% from 9.9% (unintentionally roughened) to 14.1% (intentionally roughened).

Measurement of extremely low level dose with LiF(Mg,Cu,P) TL chips

International Nuclear Information System (INIS)

Zha Ziying; Wang Shoushan; Wu Fang; Chen Guolong; Li Yuanfang; Zhu Jianhuan

1986-01-01

This paper presents some of the dosimetric characteristics of newly developed LiF(Mg,Cu,P) TL chips with high signal-to-noise ratio for measurement at the 10 -7 to 10 -4 Gy dose level. Measuring techniques and optimum procedures for annealing and readout are also presented. (author)

Numerical simulation and experimental research of the integrated high-power LED radiator

Science.gov (United States)

Xiang, J. H.; Zhang, C. L.; Gan, Z. J.; Zhou, C.; Chen, C. G.; Chen, S.

2017-01-01

The thermal management has become an urgent problem to be solved with the increasing power and the improving integration of the LED (light emitting diode) chip. In order to eliminate the contact resistance of the radiator, this paper presented an integrated high-power LED radiator based on phase-change heat transfer, which realized the seamless connection between the vapor chamber and the cooling fins. The radiator was optimized by combining the numerical simulation and the experimental research. The effects of the chamber diameter and the parameters of fin on the heat dissipation performance were analyzed. The numerical simulation results were compared with the measured values by experiment. The results showed that the fin thickness, the fin number, the fin height and the chamber diameter were the factors which affected the performance of radiator from primary to secondary.

Optimal selection of TLD chips

International Nuclear Information System (INIS)

Phung, P.; Nicoll, J.J.; Edmonds, P.; Paris, M.; Thompson, C.

1996-01-01

Large sets of TLD chips are often used to measure beam dose characteristics in radiotherapy. A sorting method is presented to allow optimal selection of chips from a chosen set. This method considers the variation

Magnetron sputtered diamond-like carbon microelectrodes for on-chip measurement of quantal catecholamine release from cells

OpenAIRE

Gao, Yuanfang; Chen, Xiaohui; Gupta, Sanju; Gillis, Kevin D.; Gangopadhyay, Shubhra

2008-01-01

Carbon electrodes are widely used in electrochemistry due to their low cost, wide potential window, and low and stable background noise. Carbon-fiber electrodes (CFE) are commonly used to electrochemically measure “quantal” catecholamine release via exocytosis from individual cells, but it is difficult to integrate CFEs into lab-on-a-chip devices. Here we report the development of nitrogen doped diamond-like carbon (DLC:N) microelectrodes on a chip to monitor quantal release of catecholamines...

Using Medicaid and CHIP claims data to support pediatric quality measurement: lessons from 3 centers of excellence in measure development.

Science.gov (United States)

Gidengil, Courtney; Mangione-Smith, Rita; Bailey, L Charles; Cawthon, Mary Lawrence; McGlynn, Elizabeth A; Nakamura, Mari M; Schiff, Jeffrey; Schuster, Mark A; Schneider, Eric C

2014-01-01

We sought to explore the claims data-related issues relevant to quality measure development for Medicaid and the Children's Health Insurance Program (CHIP), illustrating the challenges encountered and solutions developed around 3 distinct performance measure topics: care coordination for children with complex needs, quality of care for high-prevalence conditions, and hospital readmissions. Each of 3 centers of excellence presents an example that illustrates the challenges of using claims data for quality measurement. Our Centers of Excellence in pediatric quality measurement used innovative methods to develop algorithms that use Medicaid claims data to identify children with complex needs; overcome some shortcomings of existing data for measuring quality of care for common conditions such as otitis media; and identify readmissions after hospitalizations for lower respiratory infections. Our experience constructing quality measure specifications using claims data suggests that it will be challenging to measure key quality of care constructs for Medicaid-insured children at a national level in a timely and consistent way. Without better data to underpin pediatric quality measurement, Medicaid and CHIP will have difficulty using some existing measures for accountability, value-based purchasing, and quality improvement both across states and within states. Copyright © 2014 Academic Pediatric Association. Published by Elsevier Inc. All rights reserved.

Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

NARCIS (Netherlands)

Koladouz Esfahani, Z.; Tohidian, M.; van Zeijl, H.W.; Kolahdouz, Mohammadreza; Zhang, G.Q.

2017-01-01

Given the performance decay of high-power light-emitting diode (LED) chips over time and package condition changes, having a reliable output light for sensitive applications is a point of concern. In this study, a light feedback control circuit, including blue-selective photodiodes, for

Cerenkov radiation imaging as a method for quantitative measurements of beta particles in a microfluidic chip

International Nuclear Information System (INIS)

Cho, Jennifer S; Taschereau, Richard; Olma, Sebastian; Liu Kan; Chen Yichun; Shen, Clifton K-F; Van Dam, R Michael; Chatziioannou, Arion F

2009-01-01

It has been observed that microfluidic chips used for synthesizing 18 F-labeled compounds demonstrate visible light emission without nearby scintillators or fluorescent materials. The origin of the light was investigated and found to be consistent with the emission characteristics from Cerenkov radiation. Since 18 F decays through the emission of high-energy positrons, the energy threshold for beta particles, i.e. electrons or positrons, to generate Cerenkov radiation was calculated for water and polydimethylsiloxane (PDMS), the most commonly used polymer-based material for microfluidic chips. Beta particles emitted from 18 F have a continuous energy spectrum, with a maximum energy that exceeds this energy threshold for both water and PDMS. In addition, the spectral characteristics of the emitted light from 18 F in distilled water were also measured, yielding a broad distribution from 300 nm to 700 nm, with higher intensity at shorter wavelengths. A photograph of the 18 F solution showed a bluish-white light emitted from the solution, further suggesting Cerenkov radiation. In this study, the feasibility of using this Cerenkov light emission as a method for quantitative measurements of the radioactivity within the microfluidic chip in situ was evaluated. A detector previously developed for imaging microfluidic platforms was used. The detector consisted of a charge-coupled device (CCD) optically coupled to a lens. The system spatial resolution, minimum detectable activity and dynamic range were evaluated. In addition, the calibration of a Cerenkov signal versus activity concentration in the microfluidic chip was determined. This novel method of Cerenkov radiation measurements will provide researchers with a simple yet robust quantitative imaging tool for microfluidic applications utilizing beta particles.

Rapid and Low-Cost CRP Measurement by Integrating a Paper-Based Microfluidic Immunoassay with Smartphone (CRP-Chip)

Science.gov (United States)

Dong, Meili; Wu, Jiandong; Ma, Zimin; Peretz-Soroka, Hagit; Zhang, Michael; Komenda, Paul; Tangri, Navdeep; Liu, Yong; Rigatto, Claudio; Lin, Francis

2017-01-01

Traditional diagnostic tests for chronic diseases are expensive and require a specialized laboratory, therefore limiting their use for point-of-care (PoC) testing. To address this gap, we developed a method for rapid and low-cost C-reactive protein (CRP) detection from blood by integrating a paper-based microfluidic immunoassay with a smartphone (CRP-Chip). We chose CRP for this initial development because it is a strong biomarker of prognosis in chronic heart and kidney disease. The microfluidic immunoassay is realized by lateral flow and gold nanoparticle-based colorimetric detection of the target protein. The test image signal is acquired and analyzed using a commercial smartphone with an attached microlens and a 3D-printed chip–phone interface. The CRP-Chip was validated for detecting CRP in blood samples from chronic kidney disease patients and healthy subjects. The linear detection range of the CRP-Chip is up to 2 μg/mL and the detection limit is 54 ng/mL. The CRP-Chip test result yields high reproducibility and is consistent with the standard ELISA kit. A single CRP-Chip can perform the test in triplicate on a single chip within 15 min for less than 50 US cents of material cost. This CRP-Chip with attractive features of low-cost, fast test speed, and integrated easy operation with smartphones has the potential to enable future clinical PoC chronic disease diagnosis and risk stratification by parallel measurements of a panel of protein biomarkers. PMID:28346363

Synthesis and luminescence properties of glass ceramics containing MSiO3:Eu2+ (M=Ca, Sr, Ba) phosphors for white LED

International Nuclear Information System (INIS)

Cui Zhiguang; Jia Guohua; Deng Degang; Hua Youjie; Zhao Shilong; Huang Lihui; Wang Huanping; Ma Hongping; Xu Shiqing

2012-01-01

Eu 2+ doped silicate glasses were prepared of the system 52SiO 2 -48MO: xEu 2+ (in molar ratio, M=Ca, Sr, Ba; x=1, 3, 5, 7, 9) by a high temperature melt-quenching method in a reducing atmosphere. Glass ceramics containing MSiO 3 :Eu 2+ (M=Ca, Sr, Ba) nano-phosphors were obtained after the heat treatment of the glass samples. The excitation, emission spectra and lifetime decay curves of 4f 6 5d 1 →4f 7 of Eu 2+ were measured and interpreted with respect to their crystal structures and multi-site occupations of divalent europium in the hosts. Their excitation bands mainly extend from 450 to 250 nm, which is adaptable to the main emission region of the UV LED chip. With UV light excitation, the Eu 2+ emission in CaSiO 3 , SrSiO 3 and BaSiO 3 shows blue, green and yellow colors centered at 440, 505 and 555 nm, respectively. The critical Eu 2+ concentration was studied and determined to be x=5 for both CaSiO 3 and SrSiO 3 and x=7 for BaSiO 3 phosphors. The results show that the Eu 2+ doped glass ceramic phosphors containing MSiO 3 (M=Ca, Sr, Ba) nano-crystals can be used as potential matrix materials for a high power white LED pumped by the UV LED chip. - Highlights: → Glass ceramic containing MSiO 3 :Eu 2+ (M=Ca, Sr, Ba) phosphors prepared. → Derived phosphors emit intensively blue, green and yellow colors. → Their luminescence properties and crystal structures have been investigated. → Concentration quenching effects observed and analyzed. → Potential application for UV chip exciting white LED evaluated.

Advances in LEDs for automotive applications

Science.gov (United States)

Bhardwaj, Jy; Peddada, Rao; Spinger, Benno

2016-03-01

High power LEDs were introduced in automotive headlights in 2006-2007, for example as full LED headlights in the Audi R8 or low beam in Lexus. Since then, LED headlighting has become established in premium and volume automotive segments and beginning to enable new compact form factors such as distributed low beam and new functions such as adaptive driving beam. New generations of highly versatile high power LEDs are emerging to meet these application needs. In this paper, we will detail ongoing advances in LED technology that enable revolutionary styling, performance and adaptive control in automotive headlights. As the standards which govern the necessary lumens on the road are well established, increasing luminance enables not only more design freedom but also headlight cost reduction with space and weight saving through more compact optics. Adaptive headlighting is based on LED pixelation and requires high contrast, high luminance, smaller LEDs with high-packing density for pixelated Matrix Lighting sources. Matrix applications require an extremely tight tolerance on not only the X, Y placement accuracy, but also on the Z height of the LEDs given the precision optics used to image the LEDs onto the road. A new generation of chip scale packaged (CSP) LEDs based on Wafer Level Packaging (WLP) have been developed to meet these needs, offering a form factor less than 20% increase over the LED emitter surface footprint. These miniature LEDs are surface mount devices compatible with automated tools for L2 board direct attach (without the need for an interposer or L1 substrate), meeting the high position accuracy as well as the optical and thermal performance. To illustrate the versatility of the CSP LEDs, we will show the results of, firstly, a reflector-based distributed low beam using multiple individual cavities each with only 20mm height and secondly 3x4 to 3x28 Matrix arrays for adaptive full beam. Also a few key trends in rear lighting and impact on LED light

A Lab-on-a-Chip-Based Non-Invasive Optical Sensor for Measuring Glucose in Saliva

Directory of Open Access Journals (Sweden)

Dong Geon Jung

2017-11-01

Full Text Available A lab-on-a-chip (LOC-based non-invasive optical sensor for measuring glucose in saliva was fabricated. Existing glucose sensors utilizing blood require acquisition of a blood sample by pricking the finger, which is painful and inconvenient. To overcome these limitations, we propose a non-invasive glucose sensor with LOC, micro-electro-mechanical system and optical measurement technology. The proposed sensor for measuring glucose in saliva involves pretreatment, mixing, and measurement on a single tiny chip. Saliva containing glucose and glucose oxidase for glucose oxidation are injected through Inlets 1 and 2, respectively. Next, H2O2 is produced by the reaction between glucose and glucose oxidase in the pretreatment part. The saliva and generated H2O2 are mixed with a colorizing agent injected through Inlet 3 during the mixing part and the absorbance of the colorized mixture is measured in the measurement part. The absorbance of light increases as a function of glucose concentration at a wavelength of 630 nm. To measure the absorbance of the colorized saliva, a light-emitting diode with a wavelength of 630 nm and a photodiode were used during the measurement part. As a result, the measured output current of the photodiode decreased as glucose concentration in the saliva increased.

Development of LEDs-based microplate reader for bioanalytical assay measurements

International Nuclear Information System (INIS)

Alaruri, Sami D; Katzlinger, Michael; Schinwald, Bernhard; Kronberger, Georg; Atzler, Joseph

2013-01-01

The optical design for an LEDs-based microplate reader that can perform fluorescence intensity (top and bottom), absorbance, luminescence and time-resolved fluorescence measurements is described. The microplate reader is the first microplate reader in the marketplace that incorporates LEDs as excitation light sources. Absorbance measurements over the 0–3.5 optical density range for caffeine solution are presented. Additionally, fluorescence intensity readings collected at 535 and 625 nm from a green and a red RediPlate TM are reported. Furthermore, fluorescence decay lifetime measurements obtained for Eu (europium) and Sm (samarium) standard solutions using 370 nm excitation are presented. The microplate reader detection limits for the fluorescence intensity top, fluorescence intensity bottom, fluorescence polarization and time-resolved fluorescence modes are 1.5 fmol 100 µL −1 fluorescein (384-well plate), 25 fmol 100 µL −1 fluorescein (384-well plate), 5 mP at 10 nM fluorescein (black 384-well plate) and 30 amol 100 µL −1 europium solution (white 384-well plate), respectively. (paper)

Development of LEDs-based microplate reader for bioanalytical assay measurements

Science.gov (United States)

Alaruri, Sami D.; Katzlinger, Michael; Schinwald, Bernhard; Kronberger, Georg; Atzler, Joseph

2013-10-01

The optical design for an LEDs-based microplate reader that can perform fluorescence intensity (top and bottom), absorbance, luminescence and time-resolved fluorescence measurements is described. The microplate reader is the first microplate reader in the marketplace that incorporates LEDs as excitation light sources. Absorbance measurements over the 0-3.5 optical density range for caffeine solution are presented. Additionally, fluorescence intensity readings collected at 535 and 625 nm from a green and a red RediPlateTM are reported. Furthermore, fluorescence decay lifetime measurements obtained for Eu (europium) and Sm (samarium) standard solutions using 370 nm excitation are presented. The microplate reader detection limits for the fluorescence intensity top, fluorescence intensity bottom, fluorescence polarization and time-resolved fluorescence modes are 1.5 fmol 100 µL-1 fluorescein (384-well plate), 25 fmol 100 µL-1 fluorescein (384-well plate), 5 mP at 10 nM fluorescein (black 384-well plate) and 30 amol 100 µL-1 europium solution (white 384-well plate), respectively.

Measurement of g Using a Flashing LED

Science.gov (United States)

Terzella, T.; Sundermier, J.; Sinacore, J.; Owen, C.; Takai, H.

2008-10-01

In one of the classic free-fall experiments, a small mass is attached to a strip of paper tape and both are allowed to fall through a spark timer, where sparks are generated at regular time intervals. Students analyze marks (dots) left on the tape by the timer, thereby generating distance-versus-time data, which they analyze to extract the acceleration due to gravity g with good results. The apparatus, however, is cumbersome and often frustrating for students. High-tech versions of this experiment are done with an object dropped and followed by a motion sensor connected to a computer. The sensor relies on ultrasonic ranging to record distance and time data, which may then be displayed graphically. Students inspect the graphs to determine the value of g. Although the results are excellent, the emphasis on the computer's ability to collect and analyze data leaves little analysis for the students to perform.2 Furthermore, neither technique gives an intuitive display of what is happening. The motivation for our work was to overcome these issues by developing an innovative method for measuring g. In our version of the experiment, students drop a flashing LED at a known frequency and record its trajectory using long exposure photography with a digital camera. Proper choice of flashing LED timing parameters produces an image that allows for an accurate measurement of g and at the same time helps to explain what happens during free fall. The experiment remains high-tech in the sense that students learn to use updated equipment to record data and to carry out the analysis.

Polymer dispensing and embossing technology for the lens type LED packaging

Science.gov (United States)

Chien, Chien-Lin Chang; Huang, Yu-Che; Hu, Syue-Fong; Chang, Chung-Min; Yip, Ming-Chuen; Fang, Weileun

2013-06-01

This study presents a ring-type micro-structure design on the substrate and its corresponding micro fabrication processes for a lens-type light-emitting diode (LED) package. The dome-type or crater-type silicone lenses are achieved by a dispensing and embossing process rather than a molding process. Silicone with a high viscosity and thixotropy index is used as the encapsulant material. The ring-type micro structure is adopted to confine the dispensed silicone encapsulant so as to form the packaged lens. With the architecture and process described, this LED package technology herein has three merits: (1) the flexibility of lens-type LED package designs is enhanced; (2) a dome-type package design is used to enhance the intensity; (3) a crater-type package design is used to enhance the view angle. Measurement results show the ratio between the lens height and lens radius can vary from 0.4 to 1 by changing the volume of dispensed silicone. The view angles of dome-type and crater-type packages can reach 155° ± 5° and 175° ± 5°, respectively. As compared with the commercial plastic leaded chip carrier-type package, the luminous flux of a monochromatic blue light LED is improved by 15% by the dome-type package (improved by 7% by the crater-type package) and the luminous flux of a white light LED is improved by 25% by the dome-type package (improved by 13% by the crater-type package). The luminous flux of monochromatic blue light LED and white light LED are respectively improved by 8% and 12% by the dome-type package as compare with the crater-type package.

Red light emitting solid state hybrid quantum dot-near-UV GaN LED devices

International Nuclear Information System (INIS)

Song, Hongjoo; Lee, Seonghoon

2007-01-01

We produced core-shell (CdSe)ZnSe quantum dots by direct colloidal chemical synthesis and the surface-passivation method-an overcoating of the core CdSe with a larger-bandgap material ZnSe. The (CdSe)ZnSe quantum dots(QDs) play the role of a colour conversion centre. We call these quantum dots nanophosphors. We fabricated red light emitting hybrid devices of (CdSe)ZnSe QDs and a near-UV GaN LED by combining red light emitting (CdSe)ZnSe quantum dots (as a colour conversion centre) with a near-UV(NUV) GaN LED chip (as an excitation source). A few good red phosphors have been known for UV excitation wavelengths, and red phosphors for UV excitation have been sought for a long time. Here we tested the possibility of using (CdSe)ZnSe QDs as red nanophosphors for UV excitation. The fabricated red light emitting hybrid device of (CdSe)ZnSe and a NUV GaN LED chip showed a good luminance. We demonstrated that the (CdSe)ZnSe quantum dots were promising red nanophosphors for NUV excitation and that a red LED made of QDs and a NUV excitation source was a highly efficient hybrid device

Design of a cylindrical LED substrate without radiator

Science.gov (United States)

Tang, Fan; Guo, Zhenning

2017-12-01

To reduce the weight and production costs of light-emitting diode (LED) lamps, we applied the principle of the chimney effect to design a cylindrical LED substrate without a radiator. We built a 3D model by using Solidworks software and applied the flow simulation plug-in to conduct model simulation, thereby optimizing the heat source distribution and substrate thickness. The results indicate that the design achieved optimal cooling with a substrate with an upper extension length of 35 mm, a lower extension length of 8 mm, and a thickness of 1 mm. For a substrate of those dimensions, the highest LED chip temperature was 64.78 °C, the weight of the substrate was 35.09 g, and R jb = 7.00 K/W. If the substrate is powered at 8, 10, and 12 W, its temperature meets LED safety requirements. In physical tests, the highest temperature for a physical 8 W cylindrical LED substrate was 66 °C, which differed by only 1.22 °C from the simulation results, verifying the validity of the simulation. The designed cylindrical LED substrate can be used in high-power LED lamps that do not require radiators. This design is not only excellent for heat dissipation, but also for its low weight, low cost, and simplicity of manufacture.

Quantifying Asphalt Emulsion-Based Chip Seal Curing Times Using Electrical Resistance Measurements.

Science.gov (United States)

2017-04-15

Chip sealing typically consists of covering a pavement surface with asphalt emulsion into which aggregate chips are embedded. The asphalt emulsion cures through the evaporation of water, thus providing mechanical strength to adhere to the pavement wh...

Simultaneous detection of multiple HPV DNA via bottom-well microfluidic chip within an infra-red PCR platform.

Science.gov (United States)

Liu, Wenjia; Warden, Antony; Sun, Jiahui; Shen, Guangxia; Ding, Xianting

2018-03-01

Portable Polymerase Chain Reaction (PCR) devices combined with microfluidic chips or lateral flow stripes have shown great potential in the field of point-of-need testing (PoNT) as they only require a small volume of patient sample and are capable of presenting results in a short time. However, the detection for multiple targets in this field leaves much to be desired. Herein, we introduce a novel PCR platform by integrating a bottom-well microfluidic chip with an infra-red (IR) excited temperature control method and fluorescence co-detection of three PCR products. Microfluidic chips are utilized to partition different samples into individual bottom-wells. The oil phase in the main channel contains multi-walled carbon nanotubes which were used as a heat transfer medium that absorbs energy from the IR-light-emitting diode (LED) and transfers heat to the water phase below. Cyclical rapid heating and cooling necessary for PCR are achieved by alternative power switching of the IR-LED and Universal Serial Bus (USB) mini-fan with a pulse width modulation scheme. This design of the IR-LED PCR platform is economic, compact, and fully portable, making it a promising application in the field of PoNT. The bottom-well microfluidic chip and IR-LED PCR platform were combined to fulfill a three-stage thermal cycling PCR for 40 cycles within 90 min for Human Papilloma Virus (HPV) detection. The PCR fluorescent signal was successfully captured at the end of each cycle. The technique introduced here has broad applications in nucleic acid amplification and PoNT devices.

Spotting and validation of a genome wide oligonucleotide chip with duplicate measurement of each gene

International Nuclear Information System (INIS)

Thomassen, Mads; Skov, Vibe; Eiriksdottir, Freyja; Tan, Qihua; Jochumsen, Kirsten; Fritzner, Niels; Brusgaard, Klaus; Dahlgaard, Jesper; Kruse, Torben A.

2006-01-01

The quality of DNA microarray based gene expression data relies on the reproducibility of several steps in a microarray experiment. We have developed a spotted genome wide microarray chip with oligonucleotides printed in duplicate in order to minimise undesirable biases, thereby optimising detection of true differential expression. The validation study design consisted of an assessment of the microarray chip performance using the MessageAmp and FairPlay labelling kits. Intraclass correlation coefficient (ICC) was used to demonstrate that MessageAmp was significantly more reproducible than FairPlay. Further examinations with MessageAmp revealed the applicability of the system. The linear range of the chips was three orders of magnitude, the precision was high, as 95% of measurements deviated less than 1.24-fold from the expected value, and the coefficient of variation for relative expression was 13.6%. Relative quantitation was more reproducible than absolute quantitation and substantial reduction of variance was attained with duplicate spotting. An analysis of variance (ANOVA) demonstrated no significant day-to-day variation

Temperature measuring system based on ADuC812 MCU

International Nuclear Information System (INIS)

Zhou Dongmei; Ge Liangquan; Cheng Feng; Li Jinfeng

2009-01-01

This paper introduces a temperature measuring system which is composed of a single chip microcomputer ADuC812, new type digital temperature sensor TMP100,LED display circuit and based on I 2 C bus. I 2 C bus which is invented by PHILIPS company needs only two signal lines (SDA, SCL), can realized perfect duplex synchronous data transmission. Using the method of hardware setting of device address, can completely avoid the disadvantages of device selection addressing, thus can make hardware system has simplifier and more flexible extension method. The key part of the system is composed of a single chip microcomputer ADuC812 which is compatible with MCS-51 and is invented by AD company in america. The software is compiled with 8051 assembly language. The data acquisitin single chip microcomputer measurement system with I 2 C bus fully shows the features of flexibility, precise and high integration. Proposed high accuracy measurement method to realize environment temperature measure. (authors)

TID-dependent current measurements of IBL readout chips

Energy Technology Data Exchange (ETDEWEB)

Dette, Karola [TU Dortmund, Experimentelle Physik IV (Germany); CERN (Switzerland); Collaboration: ATLAS Pixel-Collaboration

2016-07-01

The ATLAS detector consists of several subsystems with a hybrid pixel detector as the innermost component of the tracking system. The pixel detector has been composed of three layers of silicon sensor assemblies during the first data taking run of the LHC and has been upgraded with a new 4th layer, the so-called Insertable B-Layer (IBL), in summer 2014. Each silicon sensor of the IBL is connected to a Front End readout chip (FE-I4) via bump bonds. During the first year of data taking an increase of the LV current produced by the readout chips was observed. This increase could be traced back to radiation damage inside the silicon. The dependence of the current on the Total Ionizing Dose (TID) and temperature has been tested with X-ray irradiations and will be presented in this talk.

On-chip antenna: Practical design and characterization considerations

KAUST Repository

Shamim, Atif; Salama, Khaled N.; Sedky, S.; Soliman, E. A.

2012-01-01

This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

On-chip antenna: Practical design and characterization considerations

KAUST Repository

Shamim, Atif

2012-07-28

This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

The GenoChip: a new tool for genetic anthropology.

Science.gov (United States)

Elhaik, Eran; Greenspan, Elliott; Staats, Sean; Krahn, Thomas; Tyler-Smith, Chris; Xue, Yali; Tofanelli, Sergio; Francalacci, Paolo; Cucca, Francesco; Pagani, Luca; Jin, Li; Li, Hui; Schurr, Theodore G; Greenspan, Bennett; Spencer Wells, R

2013-01-01

The Genographic Project is an international effort aimed at charting human migratory history. The project is nonprofit and nonmedical, and, through its Legacy Fund, supports locally led efforts to preserve indigenous and traditional cultures. Although the first phase of the project was focused on uniparentally inherited markers on the Y-chromosome and mitochondrial DNA (mtDNA), the current phase focuses on markers from across the entire genome to obtain a more complete understanding of human genetic variation. Although many commercial arrays exist for genome-wide single-nucleotide polymorphism (SNP) genotyping, they were designed for medical genetic studies and contain medically related markers that are inappropriate for global population genetic studies. GenoChip, the Genographic Project's new genotyping array, was designed to resolve these issues and enable higher resolution research into outstanding questions in genetic anthropology. The GenoChip includes ancestry informative markers obtained for over 450 human populations, an ancient human (Saqqaq), and two archaic hominins (Neanderthal and Denisovan) and was designed to identify all known Y-chromosome and mtDNA haplogroups. The chip was carefully vetted to avoid inclusion of medically relevant markers. To demonstrate its capabilities, we compared the FST distributions of GenoChip SNPs to those of two commercial arrays. Although all arrays yielded similarly shaped (inverse J) FST distributions, the GenoChip autosomal and X-chromosomal distributions had the highest mean FST, attesting to its ability to discern subpopulations. The chip performances are illustrated in a principal component analysis for 14 worldwide populations. In summary, the GenoChip is a dedicated genotyping platform for genetic anthropology. With an unprecedented number of approximately 12,000 Y-chromosomal and approximately 3,300 mtDNA SNPs and over 130,000 autosomal and X-chromosomal SNPs without any known health, medical, or phenotypic

The GenoChip: A New Tool for Genetic Anthropology

Science.gov (United States)

Elhaik, Eran; Greenspan, Elliott; Staats, Sean; Krahn, Thomas; Tyler-Smith, Chris; Xue, Yali; Tofanelli, Sergio; Francalacci, Paolo; Cucca, Francesco; Pagani, Luca; Jin, Li; Li, Hui; Schurr, Theodore G.; Greenspan, Bennett; Spencer Wells, R.

2013-01-01

The Genographic Project is an international effort aimed at charting human migratory history. The project is nonprofit and nonmedical, and, through its Legacy Fund, supports locally led efforts to preserve indigenous and traditional cultures. Although the first phase of the project was focused on uniparentally inherited markers on the Y-chromosome and mitochondrial DNA (mtDNA), the current phase focuses on markers from across the entire genome to obtain a more complete understanding of human genetic variation. Although many commercial arrays exist for genome-wide single-nucleotide polymorphism (SNP) genotyping, they were designed for medical genetic studies and contain medically related markers that are inappropriate for global population genetic studies. GenoChip, the Genographic Project’s new genotyping array, was designed to resolve these issues and enable higher resolution research into outstanding questions in genetic anthropology. The GenoChip includes ancestry informative markers obtained for over 450 human populations, an ancient human (Saqqaq), and two archaic hominins (Neanderthal and Denisovan) and was designed to identify all known Y-chromosome and mtDNA haplogroups. The chip was carefully vetted to avoid inclusion of medically relevant markers. To demonstrate its capabilities, we compared the FST distributions of GenoChip SNPs to those of two commercial arrays. Although all arrays yielded similarly shaped (inverse J) FST distributions, the GenoChip autosomal and X-chromosomal distributions had the highest mean FST, attesting to its ability to discern subpopulations. The chip performances are illustrated in a principal component analysis for 14 worldwide populations. In summary, the GenoChip is a dedicated genotyping platform for genetic anthropology. With an unprecedented number of approximately 12,000 Y-chromosomal and approximately 3,300 mtDNA SNPs and over 130,000 autosomal and X-chromosomal SNPs without any known health, medical, or phenotypic

Wood harvesting as chunkwood chips and multi-stage chipping; Puun korjuu palahakkeena ja monivaiheinen lastuaminen

Energy Technology Data Exchange (ETDEWEB)

Kaipainen, H; Seppaenen, V

1997-12-31

The task for the year 1995 was to define the preliminary results of the previous years, to measure the productivity of a harvester, designed for production of chunkwood, and the properties of the chunks. The costs of the PALAPUU method from the felling site to pulpwood chips were to be examined on this basis. Because the prototype of the harvester was not yet available for field tests, the costs were partially calculated on the basis of previous measurements, completed by productivity data obtained from the time-consumption measurements of a multi-tree harvester, applied with minor alteration for this purpose. According to the calculations the PALAPUU method cannot compete with partial-tree or shortwood methods. The profitability of the method could be improved by adding the transportation density and the productivity of the harvester. It is also possible to procure timber to the mill as partial-trees and to chunk it while feeding it into the drum. Chipping tests were made using the steel-frame-chipper owned by VTT Construction Technology. The blade construction of the chipper was changed so, that it was possible to adjust the cutting thickness of the chips to 4 mm, while in the previous mill-tests it had been 6 mm. The chips were used for cooking tests in the Department of Chemistry of the University of Jyvaeskylae. The results showed that the thinner chips were cooked further under the same cooking conditions. By using the chunkwood method it is possible to harvest 10-70 more biomass for the mills, than it is possible in the pulpwood harvesting

Wood harvesting as chunkwood chips and multi-stage chipping; Puun korjuu palahakkeena ja monivaiheinen lastuaminen

Energy Technology Data Exchange (ETDEWEB)

Kaipainen, H.; Seppaenen, V.

1996-12-31

The task for the year 1995 was to define the preliminary results of the previous years, to measure the productivity of a harvester, designed for production of chunkwood, and the properties of the chunks. The costs of the PALAPUU method from the felling site to pulpwood chips were to be examined on this basis. Because the prototype of the harvester was not yet available for field tests, the costs were partially calculated on the basis of previous measurements, completed by productivity data obtained from the time-consumption measurements of a multi-tree harvester, applied with minor alteration for this purpose. According to the calculations the PALAPUU method cannot compete with partial-tree or shortwood methods. The profitability of the method could be improved by adding the transportation density and the productivity of the harvester. It is also possible to procure timber to the mill as partial-trees and to chunk it while feeding it into the drum. Chipping tests were made using the steel-frame-chipper owned by VTT Construction Technology. The blade construction of the chipper was changed so, that it was possible to adjust the cutting thickness of the chips to 4 mm, while in the previous mill-tests it had been 6 mm. The chips were used for cooking tests in the Department of Chemistry of the University of Jyvaeskylae. The results showed that the thinner chips were cooked further under the same cooking conditions. By using the chunkwood method it is possible to harvest 10-70 more biomass for the mills, than it is possible in the pulpwood harvesting

Science Issues Associated with the Use of a Microfluidic Chip Designed Specifically for Protein Crystallization

Science.gov (United States)

Holmes, Anna M.; Monaco, Lisa; Barnes, Cindy; Spearing, Scott; Jenkins, Andy; Johnson, Todd; Mayer, Derek; Cole, Helen

2003-01-01

The Iterative Biological Crystallization team in partnership with Caliper Technologies has produced a prototype microfluidic chip for batch crystallization that has been designed and tested. The chip is designed for the mixing and dispensing of up to five solutions with possible variation of the recipe being delivered to two growth wells. Developments that have led to the successful on-chip crystallization of a few model proteins have required investigative insight into many different areas, including fluid mixing dynamics, surface treatments, quantification and fidelity of reagent delivery. This presentation will encompass the ongoing studies and data accumulated toward these efforts.

Silicon Chip-to-Chip Mode-Division Multiplexing

DEFF Research Database (Denmark)

Baumann, Jan Markus; Porto da Silva, Edson; Ding, Yunhong

2018-01-01

A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes.......A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes....

Design of an Oximeter Based on LED-LED Configuration and FPGA Technology

Directory of Open Access Journals (Sweden)

Radovan Stojanovic

2013-01-01

Full Text Available A fully digital photoplethysmographic (PPG sensor and actuator has been developed. The sensing circuit uses one Light Emitting Diode (LED for emitting light into human tissue and one LED for detecting the reflectance light from human tissue. A Field Programmable Gate Array (FPGA is used to control the LEDs and determine the PPG and Blood Oxygen Saturation (SpO2. The configurations with two LEDs and four LEDs are developed for measuring PPG signal and Blood Oxygen Saturation (SpO2. N-LEDs configuration is proposed for multichannel SpO2 measurements. The approach resulted in better spectral sensitivity, increased and adjustable resolution, reduced noise, small size, low cost and low power consumption.

Design of an oximeter based on LED-LED configuration and FPGA technology.

Science.gov (United States)

Stojanovic, Radovan; Karadaglic, Dejan

2013-01-04

A fully digital photoplethysmographic (PPG) sensor and actuator has been developed. The sensing circuit uses one Light Emitting Diode (LED) for emitting light into human tissue and one LED for detecting the reflectance light from human tissue. A Field Programmable Gate Array (FPGA) is used to control the LEDs and determine the PPG and Blood Oxygen Saturation (S(p)O(2)). The configurations with two LEDs and four LEDs are developed for measuring PPG signal and Blood Oxygen Saturation (S(p)O(2)). N-LEDs configuration is proposed for multichannel S(p)O(2) measurements. The approach resulted in better spectral sensitivity, increased and adjustable resolution, reduced noise, small size, low cost and low power consumption.

Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser

International Nuclear Information System (INIS)

Gu, E.; Jeon, C.W.; Choi, H.W.; Rice, G.; Dawson, M.D.; Illy, E.K.; Knowles, M.R.H.

2004-01-01

Gallium nitride (GaN) and sapphire are important materials for fabricating photonic devices such as high brightness light emitting diodes (LEDs). These materials are strongly resistant to wet chemical etching and also, low etch rates restrict the use of dry etching. Thus, to develop alternative high resolution processing and machining techniques for these materials is important in fabricating novel photonic devices. In this work, a repetitively pulsed UV copper vapour laser (255 nm) has been used to machine and dice sapphire, GaN and micro LED devices. Machining parameters were optimised so as to achieve controllable machining and high resolution. For sapphire, well-defined grooves 30 μm wide and 430 μm deep were machined. For GaN, precision features such as holes on a tens of micron length scale have been fabricated. By using this technique, compact micro LED chips with a die spacing 100 and a 430 μm thick sapphire substrate have been successfully diced. Measurements show that the performances of LED devices are not influenced by the UV laser machining. Our results demonstrate that the pulsed UV copper vapour laser is a powerful tool for micromachining and dicing of photonic materials and devices

Study of a novel cell lysis method with titanium dioxide for Lab-on-a-Chip devices.

Science.gov (United States)

Wan, Weijie; Yeow, John T W

2011-06-01

In this paper, a novel method is proposed and demonstrated to be able to lyse gram-negative (E. coli) bacteria cells for Lab-on-a-Chip applications. The proposed method incorporates using titanium dioxide particles as photocatalysts and a miniaturized UV LED array as an excitation light source to perform cell lysis on microchips. The experimental result demonstrates the feasibility of the proposed prototype device. The working device suggests an inexpensive, easy to be fabricated and effective way for microchip cell lysis. The miniaturized UV LED array and the microchip with a reaction chamber can be easily integrated with other functional components to form a customized whole Lab-on-a-Chip system.

Development of a cell microarray chip for detection of circulating tumor cells

Science.gov (United States)

Yamamura, S.; Yatsushiro, S.; Abe, K.; Baba, Y.; Kataoka, M.

2012-03-01

Detection of circulating tumor cells (CTCs) in the peripheral blood of metastatic cancer patients has clinical significance in earlier diagnosis of metastases. In this study, a novel cell microarray chip for accurate and rapid detection of tumor cells from human leukocytes was developed. The chip with 20,944 microchambers (105 μm diameter and 50 μm depth) was made from polystyrene, and the surface was rendered to hydrophilic by means of reactive-ion etching, which led to the formation of mono-layers of leukocytes on the microchambers. As the model of CTCs detection, we spiked human bronchioalveolar carcinoma (H1650) cells into human T lymphoblastoid leukemia (CEM) cells suspension and detected H1650 cells using the chip. A CEM suspension contained with H1650 cells was dispersed on the chip surface, followed by 10 min standing to allow the cells to settle down into the microchambers. About 30 CEM cells were accommodated in each microchamber, over 600,000 CEM cells in total being on a chip. We could detect 1 H1650 cell per 106 CEM cells on the microarray by staining with fluorescence-conjugated antibody (Anti-Cytokeratin) and cell membrane marker (DiD). Thus, this cell microarray chip has highly potential to be a novel tool of accurate and rapid detection of CTCs.

In-situ volumetric topography of IC chips for defect detection using infrared confocal measurement with active structured light

International Nuclear Information System (INIS)

Chen, Liang-Chia; Le, Manh-Trung; Phuc, Dao Cong; Lin, Shyh-Tsong

2014-01-01

The article presents the development of in-situ integrated circuit (IC) chip defect detection techniques for automated clipping detection by proposing infrared imaging and full-field volumetric topography. IC chip inspection, especially held during or post IC packaging, has become an extremely critical procedure in IC fabrication to assure manufacturing quality and reduce production costs. To address this, in the article, microscopic infrared imaging using an electromagnetic light spectrum that ranges from 0.9 to 1.7 µm is developed to perform volumetric inspection of IC chips, in order to identify important defects such as silicon clipping, cracking or peeling. The main difficulty of infrared (IR) volumetric imaging lies in its poor image contrast, which makes it incapable of achieving reliable inspection, as infrared imaging is sensitive to temperature difference but insensitive to geometric variance of materials, resulting in difficulty detecting and quantifying defects precisely. To overcome this, 3D volumetric topography based on 3D infrared confocal measurement with active structured light, as well as light refractive matching principles, is developed to detect defects the size, shape and position of defects in ICs. The experimental results show that the algorithm is effective and suitable for in-situ defect detection of IC semiconductor packaging. The quality of defect detection, such as measurement repeatability and accuracy, is addressed. Confirmed by the experimental results, the depth measurement resolution can reach up to 0.3 µm, and the depth measurement uncertainty with one standard deviation was verified to be less than 1.0% of the full-scale depth-measuring range. (paper)

ICP dry etching ITO to improve the performance of GaN-based LEDs

International Nuclear Information System (INIS)

Meng Lili; Chen Yixin; Ma Li; Liu Zike; Shen Guangdi

2011-01-01

In order to improve the light efficiency of the conventional GaN-based light-emitting diodes (LEDs), the indium tin oxide (ITO) film is introduced as the current spreading layer and the light anti-reflecting layer on the p-GaN surface. There is a big problem with the ITO thin film's corrosion during the electrode preparation. In this paper, at least, the edge of the ITO film was lateral corroded 3.5 μm width, i.e. 6.43%-1/3 of ITO film's area. An optimized simple process, i.e. inductively couple plasma (ICP), was introduced to solve this problem. The ICP process not only prevented the ITO film from lateral corrosion, but also improved the LED's light intensity and device performance. The edge of the ITO film by ICP dry etching is steep, and the areas of ITO film are whole. Compared with the chip by wet etching, the areas of light emission increase by 6.43% at least and the chip's lop values increase by 45.9% at most. (semiconductor devices)

Flip chip assembly of thinned chips for hybrid pixel detector applications

International Nuclear Information System (INIS)

Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

2014-01-01

There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

Designing low cost LED display for the billboard

Science.gov (United States)

Hong, Yi-Jian; Uang, Chii-Maw; Wang, Ping-Chieh; Ho, Zu-Sheng

2011-10-01

With quickly advance of the computer, microelectronics and photonics technologies, LED display panel becomes a new electronic advertising media. It can be used to show any information whatever characters or graphics. Most LED display panels are built of many Light-Emitting Diodes arranged in a matrix form. The display has many advantages such as low power, low cost, long life and high definition. Because the display panel is asked to show rich color, the LED display panel's driving system becomes very complex. The design methodology of LED display panel's driver becomes more and more important to meet the market requirements. Cost is always the most important issue in public market domain. In this paper, we report a design methodology of LED display panel's driver based on the microprocessor control unit (MCU) system and LED display controller IC, HT1632C, to control three colors, RGB, color LED display panel and the modular panel size is 24*16 in matrix form. The HT1632C is a memory mapping LED display controller, it can be used on many applications, such as digital clock, thermometer, counter, voltmeter or other instrumentation readouts. Three pieces of HT1632C are used to drive a 24*16 RGB LED display panel, in our design case. Each HT163C chip is used to control one of the R, G and B color. As the drive mode is driven in DC mode, the RGB display panel can create and totally of seven colors under the control of MCU. The MCU generates the control signal to drive HT1632C. In this study, the software design methodology is adopted with dynamic display principle. When the scan frequency is 60Hz, LED display panel will get the clear picture and be able to display seven colors.

A fast and reliable readout method for quantitative analysis of surface-enhanced Raman scattering nanoprobes on chip surface

Energy Technology Data Exchange (ETDEWEB)

Chang, Hyejin; Jeong, Sinyoung; Ko, Eunbyeol; Jeong, Dae Hong, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Department of Chemistry Education, Seoul National University, Seoul 151-742 (Korea, Republic of); Kang, Homan [Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-742 (Korea, Republic of); Lee, Yoon-Sik, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-742 (Korea, Republic of); School of Chemical and Biological Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Lee, Ho-Young, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Department of Nuclear Medicine, Seoul National University Bundang Hospital, Seongnam 463-707 (Korea, Republic of)

2015-05-15

Surface-enhanced Raman scattering techniques have been widely used for bioanalysis due to its high sensitivity and multiplex capacity. However, the point-scanning method using a micro-Raman system, which is the most common method in the literature, has a disadvantage of extremely long measurement time for on-chip immunoassay adopting a large chip area of approximately 1-mm scale and confocal beam point of ca. 1-μm size. Alternative methods such as sampled spot scan with high confocality and large-area scan method with enlarged field of view and low confocality have been utilized in order to minimize the measurement time practically. In this study, we analyzed the two methods in respect of signal-to-noise ratio and sampling-led signal fluctuations to obtain insights into a fast and reliable readout strategy. On this basis, we proposed a methodology for fast and reliable quantitative measurement of the whole chip area. The proposed method adopted a raster scan covering a full area of 100 μm × 100 μm region as a proof-of-concept experiment while accumulating signals in the CCD detector for single spectrum per frame. One single scan with 10 s over 100 μm × 100 μm area yielded much higher sensitivity compared to sampled spot scanning measurements and no signal fluctuations attributed to sampled spot scan. This readout method is able to serve as one of key technologies that will bring quantitative multiplexed detection and analysis into practice.

DAEDALUS: System-Level Design Methodology for Streaming Multiprocessor Embedded Systems on Chips

NARCIS (Netherlands)

Stefanov, T.; Pimentel, A.; Nikolov, H.; Ha, S.; Teich, J.

2017-01-01

The complexity of modern embedded systems, which are increasingly based on heterogeneous multiprocessor system-on-chip (MPSoC) architectures, has led to the emergence of system-level design. To cope with this design complexity, system-level design aims at raising the abstraction level of the design

Design of an Oximeter Based on LED-LED Configuration and FPGA Technology

OpenAIRE

Stojanovic, Radovan; Karadaglic, Dejan

2013-01-01

A fully digital photoplethysmographic (PPG) sensor and actuator has been developed. The sensing circuit uses one Light Emitting Diode (LED) for emitting light into human tissue and one LED for detecting the reflectance light from human tissue. A Field Programmable Gate Array (FPGA) is used to control the LEDs and determine the PPG and Blood Oxygen Saturation (SpO2). The configurations with two LEDs and four LEDs are developed for measuring PPG signal and Blood Oxygen Saturation (SpO2). N-LEDs...

Demonstration of 575-Mb/s downlink and 225-Mb/s uplink bi-directional SCM-WDM visible light communication using RGB LED and phosphor-based LED.

Science.gov (United States)

Wang, Yuanquan; Wang, Yiguang; Chi, Nan; Yu, Jianjun; Shang, Huiliang

2013-01-14

We propose and experimentally demonstrate a novel full-duplex bi-directional subcarrier multiplexing (SCM)-wavelength division multiplexing (WDM) visible light communication (VLC) system based on commercially available red-green-blue (RGB) light emitting diode (LED) and phosphor-based LED (P-LED) with 575-Mb/s downstream and 225-Mb/s upstream transmission, employing various modulation orders of quadrature amplitude modulation (QAM) orthogonal frequency division multiplexing (OFDM). For the downlink, red and green colors/wavelengths are assigned to carry useful information, while blue chip is just kept lighting to maintain the white color illumination, and for the uplink, the low-cost P-LED is implemented. In this demonstration, pre-equalization and post-equalization are also adopted to compensate the severe frequency response of LEDs. Using this scheme, 4-user downlink and 1-user uplink transmission can be achieved. Furthermore, it can support more users by adjusting the bandwidth of each sub-channel. Bit error rates (BERs) of all links are below pre-forward-error-correction (pre-FEC) threshold of 3.8x 10(-3) after 66-cm free-space delivery. The results show that this scheme has great potential in the practical VLC system.

Human iPSC-Derived Endothelial Cells and Microengineered Organ-Chip Enhance Neuronal Development

Directory of Open Access Journals (Sweden)

Samuel Sances

2018-04-01

Full Text Available Summary: Human stem cell-derived models of development and neurodegenerative diseases are challenged by cellular immaturity in vitro. Microengineered organ-on-chip (or Organ-Chip systems are designed to emulate microvolume cytoarchitecture and enable co-culture of distinct cell types. Brain microvascular endothelial cells (BMECs share common signaling pathways with neurons early in development, but their contribution to human neuronal maturation is largely unknown. To study this interaction and influence of microculture, we derived both spinal motor neurons and BMECs from human induced pluripotent stem cells and observed increased calcium transient function and Chip-specific gene expression in Organ-Chips compared with 96-well plates. Seeding BMECs in the Organ-Chip led to vascular-neural interaction and specific gene activation that further enhanced neuronal function and in vivo-like signatures. The results show that the vascular system has specific maturation effects on spinal cord neural tissue, and the use of Organ-Chips can move stem cell models closer to an in vivo condition. : Sances et al. combine Organ-Chip technology with human induced pluripotent stem cell-derived spinal motor neurons to study the maturation effects of Organ-Chip culture. By including microvascular cells also derived from the same patient line, the authors show enhancement of neuronal function, reproduction of vascular-neuron pathways, and specific gene activation that resembles in vivo spinal cord development. Keywords: organ-on-chip, spinal cord, iPSC, disease modeling, amyotrophic lateral sclerosis, microphysiological system, brain microvascular endothelial cells, spinal motor neurons, vasculature, microfluidic device

Phosphors for near UV-Emitting LED's for Efficacious Generation of White Light

Energy Technology Data Exchange (ETDEWEB)

McKittrick, Joanna [Univ. of California, San Diego, CA (United States)

2013-09-30

1) We studied phosphors for near-UV (nUV) LED application as an alternative to blue LEDs currently being used in SSL systems. We have shown that nUV light sources could be very efficient at high current and will have significantly less binning at both the chip and phosphor levels. We identified phosphor blends that could yield 4100K lamps with a CRI of approximately 80 and LPWnUV,opt equal to 179 for the best performing phosphor blend. Considering the fact that the lamps were not optimized for light coupling, the results are quite impressive. The main bottleneck is an optimum blue phosphor with a peak near 440 nm with a full width half maximum of about 25 nm and a quantum efficiency of >95%. Unfortunately, that may be a very difficult task when we want to excite a phosphor at ~400 nm with a very small margin for Stokes shift. Another way is to have all the phosphors in the blend having the excitation peak at 400 nm or slightly shorter wavelength. This could lead to a white light source with no body color and optimum efficacy due to no self-absorption effects by phosphors in the blend. This is even harder than finding an ideal blue phosphor, but not necessarily impossible. 2) With the phosphor blends identified, light sources using nUV LEDs at high current could be designed with comparable efficacy to those using blue LEDs. It will allow us to design light sources with multiple wattages using the same chips and phosphor blends simply by varying the input current. In the case of blue LEDs, this is not currently possible because varying the current will lower the efficacy at high current and alter the color point. With improvement of phosphor blends, control over CRI could improve. Less binning at the chip level and also at the phosphor blend level could reduce the cost of SSL light sources. 3) This study provided a deeper understanding of phosphor characteristics needed for LEDs in general and nUV LEDs in particular. Two students received Ph.D. degrees and three

Micromachined microphone array on a chip for turbulent boundary layer measurements

Science.gov (United States)

Krause, Joshua Steven

A surface micromachined microphone array on a single chip has been successfully designed, fabricated, characterized, and tested for aeroacoustic purposes. The microphone was designed to have venting through the diaphragm, 64 elements (8x8) on the chip, and used a capacitive transduction scheme. The microphone was fabricated using the MEMSCAP PolyMUMPs process (a foundry polysilicon surface micromachining process) along with facilities at Tufts Micro and Nano Fabrication Facility (TMNF) where a Parylene-C passivation layer deposition and release of the microstructures were performed. The devices are packaged with low profile interconnects, presenting a maximum of 100 mum of surface topology. The design of an individual microphone was completed through the use of a lumped element model (LEM) to determine the theoretical performance of the microphone. Off-chip electronics were created to allow the microphone array outputs to be redirected to one of two channels, allowing dynamic reconfiguration of the effective transducer shape in software and provide 80 dB off isolation. The characterization was completed through the use of laser Doppler vibrometry (LDV), acoustic plane wave tube and free-field calibration, and electrical noise floor testing in a Faraday cage. Measured microphone sensitivity is 0.15 mV/Pa for an individual microphone and 8.7 mV/Pa for the entire array, in close agreement with model predictions. The microphones and electronics operate over the 200--40 000 Hz band. The dynamic range extends from 60 dB SPL in a 1 Hz band to greater than 150 dB SPL. Element variability was +/-0.05 mV/Pa in sensitivity with an array yield of 95%. Wind tunnel testing at flow rates of up to 205.8 m/s indicates that the devices continue to operate in flow without damage, and can be successfully reconfigured on the fly. Care has been taken to systematically remove contaminating signals (acoustic, vibration, and noise floor) from the wind tunnel data to determine actual

Investigation of ESEM/EDX to measure liquor penetration and diffusion in Eucalyptus grandis wood chips during kraft pulping

CSIR Research Space (South Africa)

Grzeskowiak, V

2011-01-01

Full Text Available Environmental scanning electron microscopy coupled with energy dispersive x-ray (ESEM/EDX) was optimised to measure the penetration and diffusion of cooking liquor into Eucalyptus grandis wood chips during kraft pulping. The moisture content...

LED; Zum Thema LED

Energy Technology Data Exchange (ETDEWEB)

NONE

2010-07-01

This collection of articles on the subject of light emitting diodes (LED) provides technical information on LED technology, examines latest developments and provides examples of LED use in practice. An 'ABC' of LED technology is presented and fifteen common LED mistakes are noted. The chances and risks of LED use are discussed as is the retrofitting of lighting installations with LEDs. The use of LEDs in street lighting is examined. The journal also includes interviews with architects and a lighting designer. Practical examples of the use of LEDs include the refurbished parliamentary library in Berne, their use in the bird sanctuary headquarters in Sempach, Switzerland, as well as LED use in sales outlets. Also, the use of LED lighting in a spa gazebo in Lucerne is examined.

Lab-on-a-Chip Device for Rapid Measurement of Vitamin D Levels.

Science.gov (United States)

Peter, Harald; Bistolas, Nikitas; Schumacher, Soeren; Laurisch, Cecilia; Guest, Paul C; Höller, Ulrich; Bier, Frank F

2018-01-01

Lab-on-a-chip assays allow rapid analysis of one or more molecular analytes on an automated user-friendly platform. Here we describe a fully automated assay and readout for measurement of vitamin D levels in less than 15 min using the Fraunhofer in vitro diagnostics platform. Vitamin D (25-hydroxyvitamin D 3 [25(OH)D 3 ]) dilution series in buffer were successfully tested down to 2 ng/mL. This could be applied in the future as an inexpensive point-of-care analysis for patients suffering from a variety of conditions marked by vitamin D deficiencies.

An LED Approach for Measuring the Photocatalytic Breakdown of Crystal Violet Dye

Science.gov (United States)

Ryan, Robert E.; Underwood, Lauren W.; ONeal, Duane; Pagnutti, Mary; Davis, Bruce A.

2009-01-01

dye degradation on the slides over time, a temperature-stabilized white light LED was used to illuminate the opposite side of the slides. As the dye degraded, the amount of light from the white light LED transmitted through the slide was monitored with a spectrometer and subsequently analyzed to determine and compare the rate of dye degradation for photocatalytically coated versus uncoated slide surfaces. The long-term stability of the spectrometer/white light LED combination, which required only a single reference spectra to be taken for a time series sequence of several hours, enabled accurate measurements of transmitted light over time. Time series transmission curves were generated and results demonstrated that over time the transmission increased much more rapidly on the coated slides than on the control slides. This experimental configuration and methodology for photocatalytic activity measurement minimizes many external variable effects and allows low light level studies to be performed. This study also compares the advantages of this novel LED light source design to traditional mercury lamp systems and non-LED lamp approaches that have conventionally been used. The methodology and experimental design research summarized in this abstract is partly funded by the Department of Homeland Security, Science and Technology Directorate, and by the NASA Stennis Space Center Innovative Partnerships Program.

Chip cleaning and regeneration for electrochemical sensor arrays

Energy Technology Data Exchange (ETDEWEB)

Bhalla, Vijayender [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy); Carrara, Sandro, E-mail: sandro.carrara@epfl.c [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy); Stagni, Claudio [Department DEIS, University of Bologna, viale Risorgimento 2, 40136 Bologna (Italy); Samori, Bruno [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy)

2010-04-02

Sensing systems based on electrochemical detection have generated great interest because electronic readout may replace conventional optical readout in microarray. Moreover, they offer the possibility to avoid labelling for target molecules. A typical electrochemical array consists of many sensing sites. An ideal micro-fabricated sensor-chip should have the same measured values for all the equivalent sensing sites (or spots). To achieve high reliability in electrochemical measurements, high quality in functionalization of the electrodes surface is essential. Molecular probes are often immobilized by using alkanethiols onto gold electrodes. Applying effective cleaning methods on the chip is a fundamental requirement for the formation of densely-packed and stable self-assembly monolayers. However, the available well-known techniques for chip cleaning may not be so reliable. Furthermore, it could be necessary to recycle the chip for reuse. Also in this case, an effective recycling technique is required to re-obtain well cleaned sensing surfaces on the chip. This paper presents experimental results on the efficacy and efficiency of the available techniques for initial cleaning and further recycling of micro-fabricated chips. Piranha, plasma, reductive and oxidative cleaning methods were applied and the obtained results were critically compared. Some interesting results were attained by using commonly considered cleaning methodologies. This study outlines oxidative electrochemical cleaning and recycling as the more efficient cleaning procedure for electrochemical based sensor arrays.

Flip chip assembly of thinned chips for hybrid pixel detector applications

CERN Document Server

Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

2014-01-01

There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

FISH & CHIPS: Single Chip Silicon MEMS CTDL Salinity, Temperature, Pressure and Light sensor for use in fisheries research

DEFF Research Database (Denmark)

Hyldgård, Anders; Hansen, Ole; Thomsen, Erik Vilain

2005-01-01

A single-chip silicon MEMS CTDL multi sensor for use in aqueous environments is presented. The new sensor chip consists of a conductivity sensor based on platinum electrodes (C), an ion-implanted thermistor temperature sensor (T), a piezoresistive pressure sensor (D for depth/pressure) and an ion......-implanted p-n junction light sensor (L). The design and fabrication process is described. A temperature sensitivity of 0.8 × 10-3K-1 has been measured and detailed analysis of conductivity measurement data shows a cell constant of 81 cm-1....

In situ measurement of the junction temperature of light emitting diodes using a flexible micro temperature sensor.

Science.gov (United States)

Lee, Chi-Yuan; Su, Ay; Liu, Yin-Chieh; Fan, Wei-Yuan; Hsieh, Wei-Jung

2009-01-01

This investigation aimed to fabricate a flexible micro resistive temperature sensor to measure the junction temperature of a light emitting diode (LED). The junction temperature is typically measured using a thermal resistance measurement approach. This approach is limited in that no standard regulates the timing of data capture. This work presents a micro temperature sensor that can measure temperature stably and continuously, and has the advantages of being lightweight and able to monitor junction temperatures in real time. Micro-electro-mechanical-systems (MEMS) technologies are employed to minimize the size of a temperature sensor that is constructed on a stainless steel foil substrate (SS-304 with 30 μm thickness). A flexible micro resistive temperature sensor can be fixed between the LED chip and the frame. The junction temperature of the LED can be measured from the linear relationship between the temperature and the resistance. The sensitivity of the micro temperature sensor is 0.059 ± 0.004 Ω/°C. The temperature of the commercial CREE(®) EZ1000 chip is 119.97 °C when it is thermally stable, as measured using the micro temperature sensor; however, it was 126.9 °C, when measured by thermal resistance measurement. The micro temperature sensor can be used to replace thermal resistance measurement and performs reliably.

In Situ Measurement of the Junction Temperature of Light Emitting Diodes Using a Flexible Micro Temperature Sensor

Directory of Open Access Journals (Sweden)

Wei-Jung Hsieh

2009-06-01

Full Text Available This investigation aimed to fabricate a flexible micro resistive temperature sensor to measure the junction temperature of a light emitting diode (LED. The junction temperature is typically measured using a thermal resistance measurement approach. This approach is limited in that no standard regulates the timing of data capture. This work presents a micro temperature sensor that can measure temperature stably and continuously, and has the advantages of being lightweight and able to monitor junction temperatures in real time. Micro-electro-mechanical-systems (MEMS technologies are employed to minimize the size of a temperature sensor that is constructed on a stainless steel foil substrate (SS-304 with 30 μm thickness. A flexible micro resistive temperature sensor can be fixed between the LED chip and the frame. The junction temperature of the LED can be measured from the linear relationship between the temperature and the resistance. The sensitivity of the micro temperature sensor is 0.059 ± 0.004 Ω/°C. The temperature of the commercial CREE® EZ1000 chip is 119.97 °C when it is thermally stable, as measured using the micro temperature sensor; however, it was 126.9 °C, when measured by thermal resistance measurement. The micro temperature sensor can be used to replace thermal resistance measurement and performs reliably.

On-chip concentration of bacteria using a 3D dielectrophoretic chip and subsequent laser-based DNA extraction in the same chip

International Nuclear Information System (INIS)

Cho, Yoon-Kyoung; Kim, Tae-hyeong; Lee, Jeong-Gun

2010-01-01

We report the on-chip concentration of bacteria using a dielectrophoretic (DEP) chip with 3D electrodes and subsequent laser-based DNA extraction in the same chip. The DEP chip has a set of interdigitated Au post electrodes with 50 µm height to generate a network of non-uniform electric fields for the efficient trapping by DEP. The metal post array was fabricated by photolithography and subsequent Ni and Au electroplating. Three model bacteria samples (Escherichia coli, Staphylococcus epidermidis, Streptococcus mutans) were tested and over 80-fold concentrations were achieved within 2 min. Subsequently, on-chip DNA extraction from the concentrated bacteria in the 3D DEP chip was performed by laser irradiation using the laser-irradiated magnetic bead system (LIMBS) in the same chip. The extracted DNA was analyzed with silicon chip-based real-time polymerase chain reaction (PCR). The total process of on-chip bacteria concentration and the subsequent DNA extraction can be completed within 10 min including the manual operation time.

LED based opto-wetting platforms for micromixing

Science.gov (United States)

Thomas, Tony; Narayanan Unni, Harikrishnan

2018-02-01

The digital microfluidics utilizes the gradient in wettability for droplet transportation. This paper reports a novel technique of LED induced wetting ( Opto-wetting) where a single low power LED (Light emitting diode) emitting light of wavelength 395nm peak with luminous intensity of 300mcd (milli candela) is used to move two droplets of 20μL each on a photo responsive substrate of azobenzene (C12H10N2) coated PDMS (Poly Dimethyl Siloxane) substrate. The PDMS substrate of size 5cmx2cmx0.5cm were modified by thin film coating of Azobenzene dissolved in olive oil solution. The LED was aligned vertically on the top of the substrate. The pulsed operation of LED induces a spatial gradient of surface energy due to the reversible process of photo isomerization of Azobenzene molecules coated on the surface. The Photo-isomerization changes the conformation of the molecules thereby changing its surface energy .The change in surface energy of the substrate induces a change in contact angle of the droplet which initiates its movement. Two water droplets each of 20μL were dispensed on the substrate using micro syringe. Two droplets which were initially at a few cm distance apart were gradually moved towards the focus of light and merged together. The urine droplets (20μL) were moved and mixed with the red dye reagent (20μL) by controlling the light intensity of the LED. This concept provides a cost effective technique of droplet manipulation in the Lab on a chip domain where various multiplexed operations on proteins and DNA droplets can be done for point of care diagnostics.

Application of the DRS chip for fast waveform digitizing

Energy Technology Data Exchange (ETDEWEB)

Ritt, Stefan, E-mail: stefan.ritt@psi.c [PSI, CH-5232 Villigen (Switzerland); Dinapoli, Roberto; Hartmann, Ueli [PSI, CH-5232 Villigen (Switzerland)

2010-11-01

The high demands of modern experiments in fast waveform digitizing led to the development of a whole family of switched capacitor arrays (SCA), called the Domino Ring Sampler (DRS). The most recent version, DRS4, is produced in a radiation hard 0.25 {mu}m CMOS process, and is capable of digitizing 9 differential input channels at sampling rates of up to 6 Giga-samples per second (GSPS) with an analogue bandwidth of 950 MHz (-3 dB). The channel depth can be configured between 1024 and 8192 cells, and the signal-to-noise ratio allows a resolution equivalent to more than 11 bits. Using an interleaved sampling technique, sampling rates up to 48 GSPS are possible. Compared with the previous versions, the DRS4 chip contains several improvements such as an on-chip PLL for sampling-frequency stabilization and various mechanisms to reduce the read out dead-time. The high bandwidth, low power consumption and short readout time make this chip attractive for many experiments, replacing traditional ADCs and TDCs. This includes time-of-flight detectors, cosmic gamma ray observatories, PET scanners and industrial applications.

Progress and prospects of GaN-based LEDs using nanostructures

Science.gov (United States)

Zhao, Li-Xia; Yu, Zhi-Guo; Sun, Bo; Zhu, Shi-Chao; An, Ping-Bo; Yang, Chao; Liu, Lei; Wang, Jun-Xi; Li, Jin-Min

2015-06-01

Progress with GaN-based light emitting diodes (LEDs) that incorporate nanostructures is reviewed, especially the recent achievements in our research group. Nano-patterned sapphire substrates have been used to grow an AlN template layer for deep-ultraviolet (DUV) LEDs. One efficient surface nano-texturing technology, hemisphere-cones-hybrid nanostructures, was employed to enhance the extraction efficiency of InGaN flip-chip LEDs. Hexagonal nanopyramid GaN-based LEDs have been fabricated and show electrically driven color modification and phosphor-free white light emission because of the linearly increased quantum well width and indium incorporation from the shell to the core. Based on the nanostructures, we have also fabricated surface plasmon-enhanced nanoporous GaN-based green LEDs using AAO membrane as a mask. Benefitting from the strong lateral SP coupling as well as good electrical protection by a passivation layer, the EL intensity of an SP-enhanced nanoporous LED was significantly enhanced by 380%. Furthermore, nanostructures have been used for the growth of GaN LEDs on amorphous substrates, the fabrication of stretchable LEDs, and for increasing the 3-dB modulation bandwidth for visible light communication. Project supported by the National Natural Science Foundation of China (Grant No. 61334009), the National High Technology Research and Development Program of China (Grant Nos. 2015AA03A101 and 2014BAK02B08), China International Science and Technology Cooperation Program (Grant No. 2014DFG62280), the “Import Outstanding Technical Talent Plan” and “Youth Innovation Promotion Association Program” of the Chinese Academy of Sciences.

Firing with wood chips in heating and cogeneration plants

International Nuclear Information System (INIS)

Kofman, P.D.

1992-01-01

The document was produced for use as detailed teaching material aimed at spreading information on the use of wood chips as fuel for heating and cogeneration plants. It includes information and articles on wood fuels generally, combustion values, chopping machines, suppliers, occupational health hazards connected with the handling of wood chips, measuring amounts, the selection of types, prices, ash, environmental aspects and information on the establishment of a wood-chip fired district heating plant. (AB)

Chips 2020

CERN Document Server

2016-01-01

The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising  Moore-like exponential g...

Emulation and Calibration of the SALT Read-out Chip for the Upstream Tracker for Modernised LHCb Detector

CERN Document Server

Dendek, Adam

2015-01-01

The LHCb is one of the four major experiments currently operating at CERN. The main reason for constructing the LHCb forward spectrometer was a precise measurement of the CP violation in heavy quarks section as well as search for a New Physics. To obtain interesting results, the LHCb is mainly focused on study of B meson decays. Unfortunately, due to the present data acquisition architecture, the LHCb experiment is statistically limited for collecting such events. This fact led the LHCb Collaboration to decide to perform far-reaching upgrade. Key part of this upgrade will be replacement of the TT detector. To perform this action, it was requited to design new tracking detector with entirely new front-end electronics. This detector will be called the Upstream Tracker (UT) and the read-out chip — SALT. This note presents an overall discussion on SALT chip. In particular, the emulation process of the SALT data preformed via the software written by the author.

Development and characterisation of a radiation hard readout chip for the LHCb outer tracker detector

International Nuclear Information System (INIS)

Stange, U.

2005-01-01

The reconstruction of charged particle tracks in the Outer Tracker detector of the LHCb experiment requires to measure the drift times of the straw tubes. A Time to Digital Converter (TDC) chip has been developed for this task. The chip integrates into the LHCb data acquisition schema and fulfils the requirements of the detector. The OTIS chip is manufactured in a commercial 0.25 μm CMOS process. A 32-channel TDC core drives the drift time measurement (25 ns measurement range, 390 ps nominal resolution) without introducing dead times. The resulting drift times are buffered until a trigger decision arrives after the fixed latency of 4 μs. In case of a trigger accept signal, the digital control core processes and transmits the corresponding data to the following data acquisition stage. Drift time measurement and data processing are independent from the detector occupancy. The digital control core of the OTIS chip has been developed within this doctoral thesis. It has been integrated into the TDC chip together with other constituents of the chip. Several test chips and prototype versions of the TDC chip have been characterised. The present version of the chip OTIS1.2 fulfils all requirements and is ready for mass production. (Orig.)

Flexure mechanism-based parallelism measurements for chip-on-glass bonding

International Nuclear Information System (INIS)

Jung, Seung Won; Yun, Won Soo; Jin, Songwan; Jeong, Young Hun; Kim, Bo Sun

2011-01-01

Recently, liquid crystal displays (LCDs) have played vital roles in a variety of electronic devices such as televisions, cellular phones, and desktop/laptop monitors because of their enhanced volume, performance, and functionality. However, there is still a need for thinner LCD panels due to the trend of miniaturization in electronic applications. Thus, chip-on-glass (COG) bonding has become one of the most important aspects in the LCD panel manufacturing process. In this study, a novel sensor was developed to measure the parallelism between the tooltip planes of the bonding head and the backup of the COG main bonder, which has previously been estimated by prescale pressure films in industry. The sensor developed in this study is based on a flexure mechanism, and it can measure the total pressing force and the inclination angles in two directions that satisfy the quantitative definition of parallelism. To improve the measurement accuracy, the sensor was calibrated based on the estimation of the total pressing force and the inclination angles using the least-squares method. To verify the accuracy of the sensor, the estimation results for parallelism were compared with those from prescale pressure film measurements. In addition, the influence of parallelism on the bonding quality was experimentally demonstrated. The sensor was successfully applied to the measurement of parallelism in the COG-bonding process with an accuracy of more than three times that of the conventional method using prescale pressure films

A homodyne detector integrated onto a photonic chip for measuring quantum states and generating random numbers

Science.gov (United States)

Raffaelli, Francesco; Ferranti, Giacomo; Mahler, Dylan H.; Sibson, Philip; Kennard, Jake E.; Santamato, Alberto; Sinclair, Gary; Bonneau, Damien; Thompson, Mark G.; Matthews, Jonathan C. F.

2018-04-01

Optical homodyne detection has found use as a characterisation tool in a range of quantum technologies. So far implementations have been limited to bulk optics. Here we present the optical integration of a homodyne detector onto a silicon photonics chip. The resulting device operates at high speed, up 150 MHz, it is compact and it operates with low noise, quantified with 11 dB clearance between shot noise and electronic noise. We perform on-chip quantum tomography of coherent states with the detector and show that it meets the requirements for characterising more general quantum states of light. We also show that the detector is able to produce quantum random numbers at a rate of 1.2 Gbps, by measuring the vacuum state of the electromagnetic field and applying off-line post processing. The produced random numbers pass all the statistical tests provided by the NIST test suite.

A Novel Analog Integrated Circuit Design Course Covering Design, Layout, and Resulting Chip Measurement

Science.gov (United States)

Lin, Wei-Liang; Cheng, Wang-Chuan; Wu, Chen-Hao; Wu, Hai-Ming; Wu, Chang-Yu; Ho, Kuan-Hsuan; Chan, Chueh-An

2010-01-01

This work describes a novel, first-year graduate-level analog integrated circuit (IC) design course. The course teaches students analog circuit design; an external manufacturer then produces their designs in three different silicon chips. The students, working in pairs, then test these chips to verify their success. All work is completed within…

Development of an atomic clock on an atom chip: Optimisation of the coherence time and preliminary characterisation

International Nuclear Information System (INIS)

Lacroute, Clement

2010-01-01

We describe the construction and preliminary characterization of an atomic clock on an atom chip. A sample of magnetically trapped 87 Rb atoms is cooled below 1 μK, close to Bose- Einstein condensation temperature. The trapped states |F = 1; m F = -1> and |F = 2;m F = 1> define our two-photon clock transition. Atoms are trapped around a field B0 = 3.23 G, where the clock frequency is first-order insensitive to magnetic field fluctuations. We have designed an atom chip that includes a microwave coplanar waveguide which drives the 6.835 GHz transition. The whole clock cycle is performed in the vicinity of the chip surface, making the physics package compact (5 cm) 3 . We first describe the experimental setup of the clock, and the optical bench that has been developed and characterized during this thesis. We then give the results obtained for atom cooling, which led to obtaining a 3 10 4 atoms Bose-Einstein condensate. We finally present the results obtained by Ramsey spectroscopy of the clock transition. We measure coherence times exceeding 10 seconds with our setup, dominated by atom losses. A preliminary measurement shows that the clock relative frequency stability is of 6 10 -12 at 1 s, limited by technical noise. Our goal is to reach a stability in the low 10 -13 at 1 s, i.e. better than commercial clocks and competitive with today's best compact clocks. (author)

LED lamp color control system and method

Science.gov (United States)

Gaines, James; Clauberg, Bernd; Van Erp, Josephus A.M.

2013-02-05

An LED lamp color control system and method including an LED lamp having an LED controller 58; and a plurality of LED channels 60 operably connected to the LED controller 58, each of the plurality of LED channels 60 having a channel switch 62 in series with at least one shunted LED circuit 83, the shunted LED circuit 83 having a shunt switch 68 in parallel with an LED source 80. The LED controller 58 determines whether the LED source 80 is in a feedback controllable range, stores measured optical flux for the LED source 80 when the LED source 80 is in the feedback controllable range, and bypasses storing the measured optical flux when the LED source 80 is not in the feedback controllable range.

On-chip measurements of Brownian relaxation vs. concentration of 40nm magnetic beads

DEFF Research Database (Denmark)

Østerberg, Frederik Westergaard; Rizzi, Giovanni; Hansen, Mikkel Fougt

2012-01-01

We present on-chip Brownian relaxation measurements on a logarithmic dilution series of 40 nm beads dispersed in water with bead concentrations between 16 mu g/ml and 4000 mu g/ml. The measurements are performed using a planar Hall effect bridge sensor at frequencies up to 1 MHz. No external fields...... are needed as the beads are magnetized by the field generated by the applied sensor bias current. We show that the Brownian relaxation frequency can be extracted from fitting the Cole-Cole model to measurements for bead concentrations of 64 mu g/ml or higher and that the measured dynamic magnetic response...... is proportional to the bead concentration. For bead concentrations higher than or equal to 500 mu g/ml, we extract a hydrodynamic diameter of 47(1) nm for the beads, which is close to the nominal bead size of 40 nm. Furthermore, we study the signal vs. bead concentration at a fixed frequency close to the Brownian...

Price of forest chips decreasing

International Nuclear Information System (INIS)

Hakkila, P.

2001-01-01

Use of forest chips was studied in 1999 in the national Puuenergia (Wood Energy) research program. Wood combusting heating plants were questioned about are the main reasons restricting the increment of the use of forest chips. Heating plants, which did not use forest chips at all or which used less than 250 m 3 (625 bulk- m 3 ) in 1999 were excluded. The main restrictions for additional use of forest chips were: too high price of forest chips; lack of suppliers and/or uncertainty of deliveries; technical problems of reception and processing of forest chips; insufficiency of boiler output especially in winter; and unsatisfactory quality of chips. The price of forest chips becomes relatively high because wood biomass used for production of forest chips has to be collected from wide area. Heavy equipment has to be used even though small fragments of wood are processed, which increases the price of chips. It is essential for forest chips that the costs can be pressed down because competition with fossil fuels, peat and industrial wood residues is hard. Low market price leads to the situation in which forest owner gets no price of the raw material, the entrepreneurs operate at the limit of profitability and renovation of machinery is difficult, and forest chips suppliers have to sell the chips at prime costs. Price of forest chips has decreased significantly during the past decade. Nominal price of forest chips is now lower than two decades ago. The real price of chips has decreased even more than the nominal price, 35% during the past decade and 20% during the last five years. Chips, made of small diameter wood, are expensive because the price includes the felling costs and harvesting is carried out at thinning lots. Price is especially high if chips are made of delimbed small diameter wood due to increased the work and reduced amount of chips. The price of logging residue chips is most profitable because cutting does not cause additional costs. Recovery of chips is

Building blocks for a polarimeter-on-a-chip

International Nuclear Information System (INIS)

Stevenson, Thomas R.; Hsieh, W.-T.; Schneider, Gideon; Travers, Douglas; Cao, Nga; Wollack, Edward; Limon, Michele; Kogut, Alan

2006-01-01

For the 'Primordial Anisotropy Polarization Pathfinder Array (PAPPA)' balloon flight project, we have designed and made thin-film niobium microstrip circuits as building blocks for a 'polarimeter-on-a-chip' in which superconducting transmission lines are used to couple millimeter wave signals from planar antennas to superconducting transition edge sensor (TES) detectors. Our goal is to demonstrate technology for precision measurements of the polarization of the cosmic microwave background. To enable characterization and verification of our microstrip components, we have incorporated waveguide probes on each chip that can bring millimeter wave signals from a room temperature vector network analyzer to the superconducting circuits on the chip and back again for S-parameter measurements. We have designed a planar antenna and RF choke on the probes to efficiently couple radiation between waveguide and thin-film microstrip. To support the probe antennas in waveguides, we sculpted thin silicon cantilevers that extend from an edge of each silicon chip into a pair of waveguides within a specially designed split-block mount. This technique will allow us to make calibrated measurements at low temperatures of the velocity, impedance, and loss properties of our niobium transmission lines, the frequency response of microstrip filters, hybrid couplers, or terminations, and the performance of integrated detectors

Synthesis, characteristics and luminescent properties of a new Tb(III) ternary complex applied in near UV-based LED

Science.gov (United States)

Sun, Naiqun; Li, Liping; Yang, Yamin; Zhang, Aiqin; Jia, Husheng; Liu, Xuguang; Xu, Bingshe

2015-11-01

A novel Tb(III) ternary complex, Tb(p-BBA)3UA, was synthesized with 4-benzoylbenzoic acid (p-BBA) as primary ligand and undecylenic acid (UA) as reactive ligand. Tb(III) complex exhibits high thermal stability and wide and strong excitation bands from 310 nm to 400 nm when monitored at 543 nm, which matches well with the 365 nm UV chip. The complex displays Tb(III) characteristic peaks at 488, 543, 584 and 619 nm under the excitation of 365 nm UV-light. The intramolecular energy transfer process was also discussed. Meanwhile, the complex has longer fluorescence lifetime (1.317 ms) and higher quantum yield (44.8%). When used in LED with 365 nm UV chip (power efficiency is 17.3 lm/W), the complex still maintained its qualified luminescent performance. All the results indicate that Tb(p-BBA)3UA can be applied as a green component for fabrication of near UV-based white LED.

Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits

Energy Technology Data Exchange (ETDEWEB)

Wenner, J; Neeley, M; Bialczak, Radoslaw C; Lenander, M; Lucero, Erik; O' Connell, A D; Sank, D; Wang, H; Weides, M; Cleland, A N; Martinis, John M, E-mail: martinis@physics.ucsb.edu [Department of Physics, University of California, Santa Barbara, CA 93106 (United States)

2011-06-15

We analyze the performance of a microwave chip mount that uses wirebonds to connect the chip and mount grounds. A simple impedance ladder model predicts that transmission crosstalk between two feedlines falls off exponentially with distance at low frequencies, but rises to near unity above a resonance frequency set by the chip to ground capacitance. Using SPICE simulations and experimental measurements of a scale model, the basic predictions of the ladder model were verified. In particular, by decreasing the capacitance between the chip and box grounds, the resonance frequency increased and transmission decreased. This model then influenced the design of a new mount that improved the isolation to - 65 dB at 6 GHz, even though the chip dimensions were increased to 1 cm x 1 cm, three times as large as our previous devices. We measured a coplanar resonator in this mount as preparation for larger qubit chips, and were able to identify cavity, slotline, and resonator modes.

Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits

International Nuclear Information System (INIS)

Wenner, J; Neeley, M; Bialczak, Radoslaw C; Lenander, M; Lucero, Erik; O'Connell, A D; Sank, D; Wang, H; Weides, M; Cleland, A N; Martinis, John M

2011-01-01

We analyze the performance of a microwave chip mount that uses wirebonds to connect the chip and mount grounds. A simple impedance ladder model predicts that transmission crosstalk between two feedlines falls off exponentially with distance at low frequencies, but rises to near unity above a resonance frequency set by the chip to ground capacitance. Using SPICE simulations and experimental measurements of a scale model, the basic predictions of the ladder model were verified. In particular, by decreasing the capacitance between the chip and box grounds, the resonance frequency increased and transmission decreased. This model then influenced the design of a new mount that improved the isolation to - 65 dB at 6 GHz, even though the chip dimensions were increased to 1 cm x 1 cm, three times as large as our previous devices. We measured a coplanar resonator in this mount as preparation for larger qubit chips, and were able to identify cavity, slotline, and resonator modes.

High-Voltage LED Light Engine with Integrated Driver

Energy Technology Data Exchange (ETDEWEB)

Soer, Wouter [Lumileds LLC, San Jose, CA (United States)

2016-02-29

LED luminaires have seen dramatic changes in cost breakdown over the past few years. The LED component cost, which until recently was the dominant portion of luminaire cost, has fallen to a level of the same order as the other luminaire components, such as the driver, housing, optics etc. With the current state of the technology, further luminaire performance improvement and cost reduction is realized most effectively by optimization of the whole system, rather than a single component. This project focuses on improving the integration between LEDs and drivers. Lumileds has developed a light engine platform based on low-cost high-power LEDs and driver topologies optimized for integration with these LEDs on a single substrate. The integration of driver and LEDs enables an estimated luminaire cost reduction of about 25% for targeted applications, mostly due to significant reductions in driver and housing cost. The high-power LEDs are based on Lumileds’ patterned sapphire substrate flip-chip (PSS-FC) technology, affording reduced die fabrication and packaging cost compared to existing technology. Two general versions of PSS-FC die were developed in order to create the desired voltage and flux increments for driver integration: (i) small single-junction die (0.5 mm²), optimal for distributed lighting applications, and (ii) larger multi-junction die (2 mm² and 4 mm²) for high-power directional applications. Two driver topologies were developed: a tapped linear driver topology and a single-stage switch-mode topology, taking advantage of the flexible voltage configurations of the new PSS-FC die and the simplification opportunities enabled by integration of LEDs and driver on the same board. A prototype light engine was developed for an outdoor “core module” application based on the multi-junction PSS-FC die and the single-stage switch-mode driver. The light engine meets the project efficacy target of 128 lm/W at a luminous flux

Reducing the Edge Chipping for Capillary End Face Grinding and Polishing

Directory of Open Access Journals (Sweden)

Hošek J.

2013-05-01

Full Text Available This paper presents results of glass capillary end face grinding and polishing by approach that reduces the edge chipping. Brittle materials have natural tendency for edge chipping what leads to beveling the sharp edges. Not beveled sharp edges on glass capillary are important for special applications like surface tension measurement of small liquid samples. We use common grinding and polishing process for capillary end face machining modified with gradual decreasing of grinding load based on the relation of the critical chipping load. Achieved surface roughness is measured using atomic force microscopy (AFM. Capillary inner edge quality is checked both with optical microscopes and electron microscope too. We achieved a non-chipped capillary inner edge with radius down to 100 nm.

STUDY OF CHIP IGNITION AND CHIP MORPHOLOGY AFTER MILLING OF MAGNESIUM ALLOYS

Directory of Open Access Journals (Sweden)

Ireneusz Zagórski

2016-12-01

Full Text Available The paper analyses the impact of specified technological parameters of milling (vc, fz, ap on time to ignition. Stages leading to chip ignition were analysed. Metallographic images of magnesium chip were presented. No significant difference was observed in time to ignition in different chip fractions. Moreover, the surface of chips was free of products of ignition and signs of strong oxidation.

Enhancement of Color Rendering Index for White Light LED Lamps by Red Y2O3:EU3+ Phosphor

Directory of Open Access Journals (Sweden)

Tran Hoang Quang Minh

2016-01-01

Full Text Available We present an application of the red Y2O3:Eu3+ dopant phosphor compound for reaching the color rendering index as high as 86. The Multi-Chip White LED lamps (MCW-LEDs with high Correlated Color Temperatures (CCTs including 7000 K and 8500 K are employed in this study. Besides, the impacts of the Y2O3:Eu3+ phosphor on the attenuation of light through phosphor layers of the various packages is also demonstrated based on the Beer-Lambert law. Simulation results provide important conclusion for selecting and developing the phosphor materials in MCW-LEDs manufacturing.

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Directory of Open Access Journals (Sweden)

Amlan Ganguly

2018-02-01

Full Text Available With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

A Novel Methodology for Measurements of an LED's Heat Dissipation Factor

Science.gov (United States)

Jou, R.-Y.; Haung, J.-H.

2015-12-01

Heat generation is an inevitable byproduct with high-power light-emitting diode (LED) lighting. The increase in junction temperature that accompanies the heat generation sharply degrades the optical output of the LED and has a significant negative influence on the reliability and durability of the LED. For these reasons, the heat dissipation factor, Kh, is an important factor in modeling and thermal design of LED installations. In this study, a methodology is proposed and experiments are conducted to determine LED heat dissipation factors. Experiments are conducted for two different brands of LED. The average heat dissipation factor of the Edixeon LED is 0.69, and is 0.60 for the OSRAM LED. By using the developed test method and comparing the results to the calculated luminous fluxes using theoretical equations, the interdependence of optical, electrical, and thermal powers can be predicted with a reasonable accuracy. The difference between the theoretical and experimental values is less than 9 %.

Fluorescein isothiocyanate and rhodamine B dye encapsulated mesoporous SiO2 for applications of blue LED excited white LED

Science.gov (United States)

Das, Sourav; Manam, J.

2018-05-01

In this work, the fluorescein isothiocyanate (FITC) and rhodamine B (RhB) dyes were encapsulated in mesoporous silica nanoparticles (MSNp). The MSNp-FITC-RhB nanohybrids phosphor showed a dichromatic PL emission at green region and orange region when excited at 460 nm. A Forster Resonance Energy Transfer (FRET) was observed from FITC to RhB. The materials were further characterized by XRD, FTIR, TEM, and temperature dependent photoluminescence. The CIE coordinates were tuned from greenish yellow to the orange region and quantum yield was reached 52.04% based on FRET. So by combining the MSNp-FITC-RhB nanohybrids phosphor with the blue LED chip, the white light emission with flexible Color Correlated Temperature and improved Color Rendering Index can be obtained.

Energy Harvesting Chip and the Chip Based Power Supply Development for a Wireless Sensor Network.

Science.gov (United States)

Lee, Dasheng

2008-12-02

In this study, an energy harvesting chip was developed to scavenge energy from artificial light to charge a wireless sensor node. The chip core is a miniature transformer with a nano-ferrofluid magnetic core. The chip embedded transformer can convert harvested energy from its solar cell to variable voltage output for driving multiple loads. This chip system yields a simple, small, and more importantly, a battery-less power supply solution. The sensor node is equipped with multiple sensors that can be enabled by the energy harvesting power supply to collect information about the human body comfort degree. Compared with lab instruments, the nodes with temperature, humidity and photosensors driven by harvested energy had variation coefficient measurement precision of less than 6% deviation under low environmental light of 240 lux. The thermal comfort was affected by the air speed. A flow sensor equipped on the sensor node was used to detect airflow speed. Due to its high power consumption, this sensor node provided 15% less accuracy than the instruments, but it still can meet the requirement of analysis for predicted mean votes (PMV) measurement. The energy harvesting wireless sensor network (WSN) was deployed in a 24-hour convenience store to detect thermal comfort degree from the air conditioning control. During one year operation, the sensor network powered by the energy harvesting chip retained normal functions to collect the PMV index of the store. According to the one month statistics of communication status, the packet loss rate (PLR) is 2.3%, which is as good as the presented results of those WSNs powered by battery. Referring to the electric power records, almost 54% energy can be saved by the feedback control of an energy harvesting sensor network. These results illustrate that, scavenging energy not only creates a reliable power source for electronic devices, such as wireless sensor nodes, but can also be an energy source by building an energy efficient

Energy Harvesting Chip and the Chip Based Power Supply Development for a Wireless Sensor Network

Science.gov (United States)

Lee, Dasheng

2008-01-01

In this study, an energy harvesting chip was developed to scavenge energy from artificial light to charge a wireless sensor node. The chip core is a miniature transformer with a nano-ferrofluid magnetic core. The chip embedded transformer can convert harvested energy from its solar cell to variable voltage output for driving multiple loads. This chip system yields a simple, small, and more importantly, a battery-less power supply solution. The sensor node is equipped with multiple sensors that can be enabled by the energy harvesting power supply to collect information about the human body comfort degree. Compared with lab instruments, the nodes with temperature, humidity and photosensors driven by harvested energy had variation coefficient measurement precision of less than 6% deviation under low environmental light of 240 lux. The thermal comfort was affected by the air speed. A flow sensor equipped on the sensor node was used to detect airflow speed. Due to its high power consumption, this sensor node provided 15% less accuracy than the instruments, but it still can meet the requirement of analysis for predicted mean votes (PMV) measurement. The energy harvesting wireless sensor network (WSN) was deployed in a 24-hour convenience store to detect thermal comfort degree from the air conditioning control. During one year operation, the sensor network powered by the energy harvesting chip retained normal functions to collect the PMV index of the store. According to the one month statistics of communication status, the packet loss rate (PLR) is 2.3%, which is as good as the presented results of those WSNs powered by battery. Referring to the electric power records, almost 54% energy can be saved by the feedback control of an energy harvesting sensor network. These results illustrate that, scavenging energy not only creates a reliable power source for electronic devices, such as wireless sensor nodes, but can also be an energy source by building an energy efficient

Energy Harvesting Chip and the Chip Based Power Supply Development for a Wireless Sensor Network

Directory of Open Access Journals (Sweden)

Dasheng Lee

2008-12-01

Full Text Available In this study, an energy harvesting chip was developed to scavenge energy from artificial light to charge a wireless sensor node. The chip core is a miniature transformer with a nano-ferrofluid magnetic core. The chip embedded transformer can convert harvested energy from its solar cell to variable voltage output for driving multiple loads. This chip system yields a simple, small, and more importantly, a battery-less power supply solution. The sensor node is equipped with multiple sensors that can be enabled by the energy harvesting power supply to collect information about the human body comfort degree. Compared with lab instruments, the nodes with temperature, humidity and photosensors driven by harvested energy had variation coefficient measurement precision of less than 6% deviation under low environmental light of 240 lux. The thermal comfort was affected by the air speed. A flow sensor equipped on the sensor node was used to detect airflow speed. Due to its high power consumption, this sensor node provided 15% less accuracy than the instruments, but it still can meet the requirement of analysis for predicted mean votes (PMV measurement. The energy harvesting wireless sensor network (WSN was deployed in a 24-hour convenience store to detect thermal comfort degree from the air conditioning control. During one year operation, the sensor network powered by the energy harvesting chip retained normal functions to collect the PMV index of the store. According to the one month statistics of communication status, the packet loss rate (PLR is 2.3%, which is as good as the presented results of those WSNs powered by battery. Referring to the electric power records, almost 54% energy can be saved by the feedback control of an energy harvesting sensor network. These results illustrate that, scavenging energy not only creates a reliable power source for electronic devices, such as wireless sensor nodes, but can also be an energy source by building an

MCMII and the TriP chip

Energy Technology Data Exchange (ETDEWEB)

Juan Estrada et al.

2003-12-19

We describe the development of the electronics that will be used to read out the Fiber Tracker and Preshower detectors in Run IIb. This electronics is needed for operation at 132ns bunch crossing, and may provide a measurement of the z coordinate of the Fiber Tracker hits when operating at 396ns bunch crossing. Specifically, we describe the design and preliminary tests of the Trip chip, MCM IIa, MCM IIb and MCM IIc. This document also serves as a user manual for the Trip chip and the MCM.

Chip-to-Chip Half Duplex Spiking Data Communication over Power Supply Rails

Science.gov (United States)

Hashida, Takushi; Nagata, Makoto

Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at more than 100Mbps. A pair of transceivers consumes 1.35mA from 3.3V, at 130Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by 30dB, purifying power supply current for internal circuits. Bi-directional spiking communication was successfully examined in a 90-nm CMOS prototype setup of on-chip waveform capturing. A micro controller forwards clock pulses to and receives data streams from a comparator based waveform capturer formed on a different chip, through a single pair of power and ground traces. The bit error rate is small enough not to degrade waveform acquisition capability, maintaining the spurious free dynamic range of higher than 50dB.

The Cutting Process, Chips and Cutting Forces in Machining CFRP

DEFF Research Database (Denmark)

Koplev, A.; Lystrup, Aage; Vorm, T.

1983-01-01

The cutting of unidirectional CFRP, perpendicular as well as parallel to the fibre orientation, is examined. Shaping experiments, ‘quick-stop’ experiments, and a new chip preparation technique are used for the investigation. The formation of the chips, and the quality of the machined surface...... is discussed. The cutting forces parallel and perpendicular to the cutting direction are measured for various parameters, and the results correlated to the formation of chips and the wear of the tool....

A proposed holistic approach to on-chip, off-chip, test, and package interconnections

Science.gov (United States)

Bartelink, Dirk J.

1998-11-01

The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

A scalable single-chip multi-processor architecture with on-chip RTOS kernel

NARCIS (Netherlands)

Theelen, B.D.; Verschueren, A.C.; Reyes Suarez, V.V.; Stevens, M.P.J.; Nunez, A.

2003-01-01

Now that system-on-chip technology is emerging, single-chip multi-processors are becoming feasible. A key problem of designing such systems is the complexity of their on-chip interconnects and memory architecture. It is furthermore unclear at what level software should be integrated. An example of a

Study of LED layout in indoor visible light communication and performance analysis

Science.gov (United States)

Wang, Jiaan; Che, Ying; Wang, Xinlan; Guo, Linyang; Li, Jing

2017-10-01

Light emitting diodes(LED) could provide both illumination and data communication in indoor visible light communication(VLC) that owns the modulation bandwith from several from several MHz to seneral hundreds of MHz. The layout of LED plays an important role in maintaining a steady optical power distribution over the receiving plane. The existing rectangular LED layout does not provide a full coverage on the receiving plane leaving receiving optical power outage area, which in turn affects the best performance of the VLC system. This paper design a circular layout scheme of LED in 5mX5mX3m room based on the criterion of the illumination minimum mean square deviation. The influence of the distribution of the intensity of illumination with the radius of 1m and 1.5m,for including the wall reflection and not including the wall reflection, and make a comparison with rectangular LED layout of illumination distribution, when the number of LEDs with rectangular layout as same as circular layout. Including the number of LEDs are 4 and 16.For a specific simulation parameters as following:height of receiving plane is 0.85m,a single LEDs is composed of 60X60 LED chips, the parameters of a single chip is that transmitting power is 20mW,center luminous intensity is 0.73cd.semiangle at half power is 70deg.The parameters of concentrator is that photodiode area is 1cm2,photodiode responsivity is 0.4,field of view at the receiver is 85deg.Other parameters are that reflective index of concentrator is 1.5,reflectivity of wall is 0.8.Circular layout and rectangular layout are analyzed through simulation of the received optical power distribution, signal noise ratio distribution in non line of sight(including the wall reflection) and line of sight(not including the wall reflection),when the number of the LED is different. It is clear from the results that the received optical power distribution of non line of sight is better than line of sight, when the number of the LED are same, but

Influence of interconnection on the long-term reliability of UV LED packages

Science.gov (United States)

Nieland, S.; Mitrenga, D.; Karolewski, D.; Brodersen, O.; Ortlepp, T.

2017-02-01

High power LEDs have conquered the mass market in recent years. Besides the main development focus to achieve higher productivity in the field of visible semiconductor LED processing, the wavelength range is further enhanced by active research and development in the direction of UVA / UVB / UVC. UVB and UVC LEDs are new and promising due to their numerous advantages. UV LEDs emit in a near range of one single emission peak with a width (FWHM) below 15 nm compared to conventional mercury discharge lamps and xenon sources, which show broad spectrums with many emission peaks over a wide range of wavelengths. Furthermore, the UV LED size is in the range of a few hundred microns and offers a high potential of significant system miniaturization. Of course, LED efficiency, lifetime and output power have to be increased [1]. Lifetime limiting issues of UVB/UVC-LED are the very high thermal stress in the chip resulting from the higher forward voltages (6-10 V @ 350 mA), the lower external quantum efficiency, below 10 % (most of the power disappears as heat), and the thermal resistance Rth of conventional LED packages being not able to dissipate these large amounts of heat for spreading. Beside the circuit boards and submounts which should have maximum thermal conductivity, the dimension of contacts as well as the interconnection of UV LED to the submount/package determinates the resolvable amount of heat [2]. In the paper different innovative interconnection techniques for UVC-LED systems will be discussed focused on the optimization of thermal conductivity in consideration of the assembly costs. Results on thermal simulation for the optimal contact dimensions and interconnections will be given. In addition, these theoretical results will be compared with results on electrical characterization as well as IR investigations on real UV LED packages in order to give recommendations for optimal UV LED assembly.

An inexpensive and stable LED Sun photometer for measuring the water vapor column over South Texas from 1990 to 2001

Science.gov (United States)

Mims, Forrest M.

2002-07-01

A Sun photometer that uses near-infrared light-emitting diodes (LEDs) as spectrally-selective photodetectors has measured total column water vapor in South Texas since February 1990. The 12 years of solar noon observations to date are correlated with upper air soundings at Del Rio, Texas (r2 = 0.75), and highly correlated with measurements by a Microtops II filter Sun photometer (r2 = 0.94). LEDs are inexpensive and have far better long term stability than the interference filters in conventional Sun photometers. The LED Sun photometer therefore provides an inexpensive, stable and portable means for measuring column water vapor.

On-chip sample preparation for complete blood count from raw blood.

Science.gov (United States)

Nguyen, John; Wei, Yuan; Zheng, Yi; Wang, Chen; Sun, Yu

2015-03-21

This paper describes a monolithic microfluidic device capable of on-chip sample preparation for both RBC and WBC measurements from whole blood. For the first time, on-chip sample processing (e.g. dilution, lysis, and filtration) and downstream single cell measurement were fully integrated to enable sample preparation and single cell analysis from whole blood on a single device. The device consists of two parallel sub-systems that perform sample processing and electrical measurements for measuring RBC and WBC parameters. The system provides a modular environment capable of handling solutions of various viscosities by adjusting the length of channels and precisely controlling mixing ratios, and features a new 'offset' filter configuration for increased duration of device operation. RBC concentration, mean corpuscular volume (MCV), cell distribution width, WBC concentration and differential are determined by electrical impedance measurement. Experimental characterization of over 100,000 cells from 10 patient blood samples validated the system's capability for performing on-chip raw blood processing and measurement.

Chip compacting press; Jido kirikuzu asshukuki

Energy Technology Data Exchange (ETDEWEB)

Oura, K. [Yuken Kogyo Co. Ltd., Kanagawa (Japan)

1998-08-15

The chips exhausted from various machine tools are massy, occupy much space and make working environment worse by staying added cutting oil to lower part. The chips are exhausted as a result of machining and have not constant quality. Even if used material is same the chips have various shapes and properties by kinds and machining methods of used machine tools, and are troublesome materials from a standpoint of their treatment. Pressing and solidification of the chips have frequently been tried. A chip compacting press introduced in this paper, a relatively cheap chip compacting press aimed for relatively small scale chip treatment, and has such characteristics and effects as follows. Chips are pressed and solidified by each raw material, so fractional management can be easily conducted. As casting metal chips and curled chips of iron and aluminum can be pressed to about 1/3 to 1/5 and about 1/40, respectively, space saving can be conducted. Chip compacting pressing upgrades its transporting efficiency to make possible to reduce its transporting cost. As chip solidification controls its oxidation and most cutting oil are removed, chips are easy to recycle. 2 figs., 1 tab.

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking.

Science.gov (United States)

Uddin, Ashfaque; Milaninia, Kaveh; Chen, Chin-Hsuan; Theogarajan, Luke

2011-12-01

This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers that are at most 5 µm larger than the chip on each side. The chip and the large area substrate are bonded onto a carrier such that the top surfaces of the two components are flush. The unique features of this technique enable the integration of macroscale components, such as leads and microfluidics. Furthermore, the integration process allows for MEMS micromachining after CMOS die-wafer integration. To demonstrate the capabilities of the proposed technology, a low-power integrated potentiostat chip for biosensing implemented in the AMI 0.5 µm CMOS technology is integrated in a silicon substrate. The horizontal gap and the vertical displacement between the chip and the large area substrate measured after the integration were 4 µm and 0.5 µm, respectively. A number of 104 interconnects are patterned with high-precision alignment. Electrical measurements have shown that the functionality of the chip is not affected by the integration process.

Chip-Based Measurements of Brownian Relaxation of Magnetic Beads Using a Planar Hall Effect Magnetic Field Sensor

DEFF Research Database (Denmark)

Østerberg, Frederik Westergaard; Dalslet, Bjarke Thomas; Snakenborg, Detlef

2010-01-01

using only the self-field arising from the bias current applied to the sensors as excitation field. We present measurements on a suspension of magnetic beads with a nominal diameter of 250 nm vs. temperature and find that the observations are consistent with the Cole-Cole model for Brownian relaxation...... with a constant hydrodynamic bead diameter when the temperature dependence of the viscosity of water is taken into account. These measurements demonstrate the feasibility of performing measurements of the Brownian relaxation response in a lab-on-a-chip system and constitute the first step towards an integrated...... biosensor based on the detection of the dynamic response of magnetic beads....

Medicaid/CHIP Program; Medicaid Program and Children's Health Insurance Program (CHIP); Changes to the Medicaid Eligibility Quality Control and Payment Error Rate Measurement Programs in Response to the Affordable Care Act. Final rule.

Science.gov (United States)

2017-07-05

This final rule updates the Medicaid Eligibility Quality Control (MEQC) and Payment Error Rate Measurement (PERM) programs based on the changes to Medicaid and the Children's Health Insurance Program (CHIP) eligibility under the Patient Protection and Affordable Care Act. This rule also implements various other improvements to the PERM program.

Co-design of on-chip antennas and circuits for a UNII band monolithic transceiver

KAUST Repository

Shamim, Atif; Arsalan, Muhammad; Roy, L; Salama, Khaled N.

2012-01-01

with two on-chip antennas. Both antennas are characterized for their radiation properties through an on-wafer custom measurement setup. The strategy to co-design on-chip antennas with circuits, resultant trade-offs and measurement challenges have also been

Optical characterization of ultrabright LEDs

International Nuclear Information System (INIS)

Benavides, Juan Manuel; Webb, Robert H.

2005-01-01

Ultrabright light emitting diodes (LEDs) are a new light source for visual psychophysics and microscopy. The new LEDs are intended primarily for room and exterior illumination, and the manufacturers' specifications are adequate for that. However, we use them as light sources in situations where a more complete characterization may be useful. For one set of LEDs we have measured the radiometric intensity and its distribution in space and wavelength, and we have tested for interactions of these variables and their dependence on driver configuration. We describe techniques for making these measurements and give a link to a simple calculator for converting among radiometric and photometric measures, as well as an evaluation of the safety considerations these very bright sources demand

On-chip electrochromic micro display for a disposable bio-sensor chip

Science.gov (United States)

Zhu, Yanjun; Tsukamoto, Takashiro; Tanaka, Shuji

2017-12-01

This paper reports an on-chip electrochromic micro display made of polyaniline (PANi) which can be easily made on a CMOS chip. Micro-patterned PANi thin films were selectively deposited on pre-patterned microelectrodes by using electrodeposition. The optimum conditions for deposition and electrochromism were investigated. An 8-pixel on-chip micro display was made on a Si chip. The color of each PANi film could be independently but simultaneously controlled, which means any 1-byte digital data could be displayed on the display. The PANi display had a response time as fast as about 100 ms, which means the transfer data rate was as fast as 80 bits per second.

Developing a reduced consumer-led lexicon to measure emotional response to beer

OpenAIRE

Chaya, Carolina; Eaton, Curtis; Hewson, Louise; Fernández Vázquezc, Rocío; Fernández-Ruiz, Virginia; Smart, Katherine A.; Hort, Joanne

2015-01-01

Previous researchers have recently recommended and utilised consumer-led lexicons to measure emotional response. This study further advances this approach by 1) making the lexicon generation process more efficient by using consumer focus groups as opposed to individual consumer interviews and 2) decreasing the number of responses required from each consumer by reducing the lexicon to categories of similar terms. In response to 10 lager samples which were manipulated in order to control select...

Wood chips procurement and research project at the Mikkeli region

International Nuclear Information System (INIS)

Saksa, T.; Auvinen, P.

1996-01-01

In 1993-94, a large-scale energywood production chain started as a co-operation project by the Mikkeli city forest office and local forestry societies. In 1995 over 115 000 m 3 (about 85 000 MWh of energy) of wood chips were delivered to Pursiala heat and power plant in Mikkeli. About 75 % of these chips was forest processed chips. About 70 % of the forest processed chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 45 FIM/m 3 (60 FIM/MWh) for the whole tree chips and 38 FIM/m 3 (50 FIM/MWh) for logging waste chips. The delivery costs of forest processed chips could meet the target of Bioenergy Research Programme (45 FIM/MWh) only in the most favourable cases. In an average the delivery costs were about 9 FIM/MWh more than the price obtained when sold to the heat and power plant. However the wood chip production created 27 new jobs and the increase of income to the local economy was about 2.2 milj. FIM /year. The local communities got new tax revenue about 3 FIM/MWh. The gain for the forestry was approximated to be 5 - 6 FIM/MWh. The resources of forest processed chips were studied on the basis of stand measurements. According to the study the most remarkable energywood resources were in young thinning stands on Oxalis-Myrtillus and Myrtillus forest site types. On Oxalis-Myrtillus type almost every and on Myrtillus type every second stand included energywood more than 40 m 3 /ha

Neural Cell Chip Based Electrochemical Detection of Nanotoxicity.

Science.gov (United States)

Kafi, Md Abdul; Cho, Hyeon-Yeol; Choi, Jeong Woo

2015-07-02

Development of a rapid, sensitive and cost-effective method for toxicity assessment of commonly used nanoparticles is urgently needed for the sustainable development of nanotechnology. A neural cell with high sensitivity and conductivity has become a potential candidate for a cell chip to investigate toxicity of environmental influences. A neural cell immobilized on a conductive surface has become a potential tool for the assessment of nanotoxicity based on electrochemical methods. The effective electrochemical monitoring largely depends on the adequate attachment of a neural cell on the chip surfaces. Recently, establishment of integrin receptor specific ligand molecules arginine-glycine-aspartic acid (RGD) or its several modifications RGD-Multi Armed Peptide terminated with cysteine (RGD-MAP-C), C(RGD)₄ ensure farm attachment of neural cell on the electrode surfaces either in their two dimensional (dot) or three dimensional (rod or pillar) like nano-scale arrangement. A three dimensional RGD modified electrode surface has been proven to be more suitable for cell adhesion, proliferation, differentiation as well as electrochemical measurement. This review discusses fabrication as well as electrochemical measurements of neural cell chip with particular emphasis on their use for nanotoxicity assessments sequentially since inception to date. Successful monitoring of quantum dot (QD), graphene oxide (GO) and cosmetic compound toxicity using the newly developed neural cell chip were discussed here as a case study. This review recommended that a neural cell chip established on a nanostructured ligand modified conductive surface can be a potential tool for the toxicity assessments of newly developed nanomaterials prior to their use on biology or biomedical technologies.

Neural Cell Chip Based Electrochemical Detection of Nanotoxicity

Directory of Open Access Journals (Sweden)

Md. Abdul Kafi

2015-07-01

Full Text Available Development of a rapid, sensitive and cost-effective method for toxicity assessment of commonly used nanoparticles is urgently needed for the sustainable development of nanotechnology. A neural cell with high sensitivity and conductivity has become a potential candidate for a cell chip to investigate toxicity of environmental influences. A neural cell immobilized on a conductive surface has become a potential tool for the assessment of nanotoxicity based on electrochemical methods. The effective electrochemical monitoring largely depends on the adequate attachment of a neural cell on the chip surfaces. Recently, establishment of integrin receptor specific ligand molecules arginine-glycine-aspartic acid (RGD or its several modifications RGD-Multi Armed Peptide terminated with cysteine (RGD-MAP-C, C(RGD4 ensure farm attachment of neural cell on the electrode surfaces either in their two dimensional (dot or three dimensional (rod or pillar like nano-scale arrangement. A three dimensional RGD modified electrode surface has been proven to be more suitable for cell adhesion, proliferation, differentiation as well as electrochemical measurement. This review discusses fabrication as well as electrochemical measurements of neural cell chip with particular emphasis on their use for nanotoxicity assessments sequentially since inception to date. Successful monitoring of quantum dot (QD, graphene oxide (GO and cosmetic compound toxicity using the newly developed neural cell chip were discussed here as a case study. This review recommended that a neural cell chip established on a nanostructured ligand modified conductive surface can be a potential tool for the toxicity assessments of newly developed nanomaterials prior to their use on biology or biomedical technologies.

Optically Transparent Thin-Film Electrode Chip for Spectroelectrochemical Sensing

Energy Technology Data Exchange (ETDEWEB)

Branch, Shirmir D.; Lines, Amanda M.; Lynch, John A.; Bello, Job M.; Heineman, William R.; Bryan, Samuel A.

2017-07-03

The electrochemical and spectroelectrochemical applications of an optically transparent thin film electrode chip are investigated. The working electrode is composed of indium tin oxide (ITO); the counter and quasi-reference electrodes are composed of platinum. The stability of the platinum quasi-reference electrode is modified by coating it with a planar, solid state Ag/AgCl layer. The Ag/AgCl reference is characterized with scanning electron microscopy and energy-dispersive X-ray spectroscopy. Open circuit potential measurements indicate that the potential of the planar Ag/AgCl electrode varies a maximum of 20 mV over four days. Cyclic voltammetry measurements show that the electrode chip is comparable to a standard electrochemical cell. Randles-Sevcik analysis of 10 mM K3[Fe(CN)6] in 0.1 M KCl using the electrode chip shows a diffusion coefficient of 1.59 × 10-6 cm2/s, in comparison to the standard electrochemical cell value of 2.38 × 10-6 cm2/s. By using the electrode chip in an optically transparent thin layer electrode (OTTLE), the spectroelectrochemical modulation of [Ru(bpy)3]2+ florescence was demonstrated, achieving a detection limit of 36 nM.

Commissioning and LED system tests of the engineering prototype of the analog hadronic calorimeter of the CALICE collaboration

International Nuclear Information System (INIS)

Hartbrich, Oskar

2012-10-01

This thesis describes measurements on the LED system and commissioning of the AHCAL EPT, to be used as an active layer in an upcoming hadron test beam. The performed tests of the integrated LED system prove, that it can be used to calibrate SiPM gains on the HBU. The performance of calibrating multiple channels at the same time suffers from inhomogeneities in the LED amplitude for different channels. This was initially suspected to be caused by part variances in the LED production process, but the spatial distribution of LED threshold voltages over the HBU suggest a systematic effect, probably depending on the signal distance between the driver OPAMPs and the LED circuit. Compensation of these differences in pulse amplitude via switchable capacities integrated onto the HBU helps to reduce the spread of threshold voltages, but does not fulfill the goal of one single V Calib value for the whole setup. Further tests on the LED system performed with an upgraded test stand at Wuppertal confirm the spatial distribution of LED amplitudes. Inspection of the trigger signals arriving at the channel pulser circuits show a degraded signal correlated to the observed pulse amplitude. The test stand setup also allows to measure the time offsets between LED pulses on different channels, which has to be incorporated into a possible TDC offset calibration using the LED system. The spatial distribution of timing offsets also shows similar characteristics as for the amplitudes. Ongoing measurements and research with the test stand aim to improve on these issues, yielding a calibration system that meets all performance requirements. From the commissioning phase of the EPT layer, many new insights about the HBU2 and the SPIROC chips arise. Many crucial parameters of the setup have to be calibrated for each channel separately, raising the need for efficient measurement procedures, optimised for automation and short measurement times. Such schemes are proposed for the input DAC setup and

Commissioning and LED system tests of the engineering prototype of the analog hadronic calorimeter of the CALICE collaboration

Energy Technology Data Exchange (ETDEWEB)

Hartbrich, Oskar

2012-10-15

This thesis describes measurements on the LED system and commissioning of the AHCAL EPT, to be used as an active layer in an upcoming hadron test beam. The performed tests of the integrated LED system prove, that it can be used to calibrate SiPM gains on the HBU. The performance of calibrating multiple channels at the same time suffers from inhomogeneities in the LED amplitude for different channels. This was initially suspected to be caused by part variances in the LED production process, but the spatial distribution of LED threshold voltages over the HBU suggest a systematic effect, probably depending on the signal distance between the driver OPAMPs and the LED circuit. Compensation of these differences in pulse amplitude via switchable capacities integrated onto the HBU helps to reduce the spread of threshold voltages, but does not fulfill the goal of one single V{sub Calib} value for the whole setup. Further tests on the LED system performed with an upgraded test stand at Wuppertal confirm the spatial distribution of LED amplitudes. Inspection of the trigger signals arriving at the channel pulser circuits show a degraded signal correlated to the observed pulse amplitude. The test stand setup also allows to measure the time offsets between LED pulses on different channels, which has to be incorporated into a possible TDC offset calibration using the LED system. The spatial distribution of timing offsets also shows similar characteristics as for the amplitudes. Ongoing measurements and research with the test stand aim to improve on these issues, yielding a calibration system that meets all performance requirements. From the commissioning phase of the EPT layer, many new insights about the HBU2 and the SPIROC chips arise. Many crucial parameters of the setup have to be calibrated for each channel separately, raising the need for efficient measurement procedures, optimised for automation and short measurement times. Such schemes are proposed for the input DAC setup

Chip based electroanalytical systems for cell analysis

DEFF Research Database (Denmark)

Spegel, C.; Heiskanen, A.; Skjolding, L.H.D.

2008-01-01

' measurements of processes related to living cells, i.e., systems without lysing the cells. The focus is on chip based amperometric and impedimetric cell analysis systems where measurements utilizing solely carbon fiber microelectrodes (CFME) and other nonchip electrode formats, such as CFME for exocytosis...

Optic nerve signals in a neuromorphic chip II: Testing and results.

Science.gov (United States)

Zaghloul, Kareem A; Boahen, Kwabena

2004-04-01

Seeking to match the brain's computational efficiency, we draw inspiration from its neural circuits. To model the four main output (ganglion) cell types found in the retina, we morphed outer and inner retina circuits into a 96 x 60-photoreceptor, 3.5 x 3.3 mm2, 0.35 microm-CMOS chip. Our retinomorphic chip produces spike trains for 3600 ganglion cells (GCs), and consumes 62.7 mW at 45 spikes/s/GC. This chip, which is the first silicon retina to successfully model inner retina circuitry, approaches the spatial density of the retina. We present experimental measurements showing that the chip's subthreshold current-mode circuits realize luminance adaptation, bandpass spatiotemporal filtering, temporal adaptation and contrast gain control. The four different GC outputs produced by our chip encode light onset or offset in a sustained or transient fashion, producing a quadrature-like representation. The retinomorphic chip's circuit design is described in a companion paper [Zaghloul and Boahen (2004)].

Photonics-on-a-chip: recent advances in integrated waveguides as enabling detection elements for real-world, lab-on-a-chip biosensing applications.

Science.gov (United States)

Washburn, Adam L; Bailey, Ryan C

2011-01-21

By leveraging advances in semiconductor microfabrication technologies, chip-integrated optical biosensors are poised to make an impact as scalable and multiplexable bioanalytical measurement tools for lab-on-a-chip applications. In particular, waveguide-based optical sensing technology appears to be exceptionally amenable to chip integration and miniaturization, and, as a result, the recent literature is replete with examples of chip-integrated waveguide sensing platforms developed to address a wide range of contemporary analytical challenges. As an overview of the most recent advances within this dynamic field, this review highlights work from the last 2-3 years in the areas of grating-coupled, interferometric, photonic crystal, and microresonator waveguide sensors. With a focus towards device integration, particular emphasis is placed on demonstrations of biosensing using these technologies within microfluidically controlled environments. In addition, examples of multiplexed detection and sensing within complex matrices--important features for real-world applicability--are given special attention.

In-chip optical CD measurements for non-volatile memory devices

Science.gov (United States)

Vasconi, Mauro; Kremer, Stephanie; Polli, M.; Severgnini, Ermes; Trovati, Silvia S.

2006-03-01

A potential limitation to a wider usage of the scatterometry technique for CD evaluation comes from its requirement of dedicated regular measurement gratings, located in wafer scribe lanes. In fact, the simplification of the original chip layout that is often requested to design these gratings may impact on their printed dimension and shape. Etched gratings might also suffer from micro-loading effects other than in the circuit. For all these reasons, measurements collected therein may not represent the real behavior of the device. On the other hand, memory devices come with large sectors that usually possess the characteristics required for a proper scatterometry evaluation. In particular, for a leading edge flash process this approach is in principle feasible for the most critical process steps. The impact of potential drawbacks, mainly lack of pattern regularity within the tool probe area, is investigated. More, a very large sampling plan on features with equal nominal CD and density spread over the same exposure shot becomes feasible, thus yielding a deeper insight of the overall lithographic process window and a quantitative method to evaluate process equipment performance along time by comparison to acceptance data and/or last preventive maintenance. All the results gathered in the device main array are compared to those collected in standard scatterometry targets, tailored to the characteristics of the considered layers in terms of designed CD, pitch, stack and orientation.

Materials Characterization of CIGS solar cells on Top of CMOS chips

NARCIS (Netherlands)

Lu, J.; Liu, W.; Kovalgin, A.Y.; Sun, Y.; Schmitz, J.; Venkatasubramanian, R.; Radousky, H.; Liang, H.

2011-01-01

In the current work, we present a detailed study on the material properties of the CIGS layers, fabricated on top of the CMOS chips, and compare the results with the fabrication on standard glass substrates. Almost identical elemental composition on both glass and CMOS chips (within measurement

Prototype detection unit for the CHIPS experiment

Science.gov (United States)

Pfützner, Maciej M.

2017-09-01

CHIPS (CHerenkov detectors In mine PitS) is an R&D project aiming to develop novel cost-effective neutrino detectors, focused on measuring the CP-violating neutrino mixing phase (δ CP). A single detector module, containing an enclosed volume of purified water, would be submerged in an existing lake, located in a neutrino beam. A staged approach is proposed with first detectors deployed in a flooded mine pit in Northern Minnesota, 7 mrad off-axis from the existing NuMI beam. A small proof-of-principle model (CHIPS-M) has already been tested and the first stage of a fully functional 10 kt module (CHIPS-10) is planned for 2018. One of the instruments submerged on board of CHIPS-M in autumn 2015 was a prototype detection unit, constructed at Nikhef. The unit contains hardware borrowed from the KM3NeT experiment, including 16 3 inch photomultiplier tubes and readout electronics. In addition to testing the mechanical design and data acquisition, the detector was used to record a large sample of cosmic ray muon events. The collected data is valuable for characterising the cosmic muon background and validating a Monte Carlo simulation used to optimise future designs. This paper introduces the CHIPS project, describes the design of the prototype unit, and presents the results of a preliminary data analysis.

Measuring progress towards a primary care-led NHS.

Science.gov (United States)

Miller, P; Craig, N; Scott, A; Walker, A; Hanlon, P

1999-07-01

The push towards a 'primary care-led' National Health Service (NHS) has far-reaching implications for the future structure of the NHS. The policy involves both a growing emphasis on the role of primary care practitioners in the commissioning of health services, and a change from hospital to primary and community settings for a range of services and procedures. Although the terminology has changed, this emphasis remains in the recent Scottish Health Service White Paper and its English counterpart. To consider three questions in relation to this policy goal. First, does the evidence base support the changes? Secondly, what is the scale of the changes that have occurred? Thirdly, what are the barriers to the development of a primary care-led NHS? Programme budgets were compiled to assess changes over time in the balance of NHS resource allocation with respect to primary and secondary care. Total NHS revenue expenditure for the 15 Scottish health boards was grouped into four blocks or 'programmes': primary care, secondary care, community services, and a residual. The study period was 1991/2 to 1995/6. Expenditure data were supplied by the Scottish Office. Ambiguity of definitions and the absence of good data cause methodological difficulties in evaluating the scale and the appropriateness of the shift. The data that are available suggest that, at the aggregate level, there have been changes over time in the balance of resource allocation between care settings: relative investment into primary care has increased. It would appear that this investment is relatively small and from growth money rather than a 'shift' from secondary care. In addition, the impact of GP-led commissioning is variable but limited. General practitioners' (GPs') attitudes to the policy suggest that progress towards a primary care-led NHS will continue to be patchy. The limited shift to date, alongside evidence of ambivalent attitudes to the shift on the part of GPs, suggest that this is a policy

Light-extraction enhancement of GaN-based 395  nm flip-chip light-emitting diodes by an Al-doped ITO transparent conductive electrode.

Science.gov (United States)

Xu, Jin; Zhang, Wei; Peng, Meng; Dai, Jiangnan; Chen, Changqing

2018-06-01

The distinct ultraviolet (UV) light absorption of indium tin oxide (ITO) limits the performance of GaN-based near-UV light-emitting diodes (LEDs). Herein, we report an Al-doped ITO with enhanced UV transmittance and low sheet resistance as the transparent conductive electrode for GaN-based 395 nm flip-chip near-UV LEDs. The thickness dependence of optical and electrical properties of Al-doped ITO films is investigated. The optimal Al-doped ITO film exhibited a transmittance of 93.2% at 395 nm and an average sheet resistance of 30.1  Ω/sq. Meanwhile, at an injection current of 300 mA, the forward voltage decreased from 3.14 to 3.11 V, and the light output power increased by 13% for the 395 nm near-UV flip-chip LEDs with the optimal Al-doped ITO over those with pure ITO. This Letter provides a simple and repeatable approach to further improve the light extraction efficiency of GaN-based near-UV LEDs.

Study on VCSEL laser heating chip in nuclear magnetic resonance gyroscope

Science.gov (United States)

Liang, Xiaoyang; Zhou, Binquan; Wu, Wenfeng; Jia, Yuchen; Wang, Jing

2017-10-01

In recent years, atomic gyroscope has become an important direction of inertial navigation. Nuclear magnetic resonance gyroscope has a stronger advantage in the miniaturization of the size. In atomic gyroscope, the lasers are indispensable devices which has an important effect on the improvement of the gyroscope performance. The frequency stability of the VCSEL lasers requires high precision control of temperature. However, the heating current of the laser will definitely bring in the magnetic field, and the sensitive device, alkali vapor cell, is very sensitive to the magnetic field, so that the metal pattern of the heating chip should be designed ingeniously to eliminate the magnetic field introduced by the heating current. In this paper, a heating chip was fabricated by MEMS process, i.e. depositing platinum on semiconductor substrates. Platinum has long been considered as a good resistance material used for measuring temperature The VCSEL laser chip is fixed in the center of the heating chip. The thermometer resistor measures the temperature of the heating chip, which can be considered as the same temperature of the VCSEL laser chip, by turning the temperature signal into voltage signal. The FPGA chip is used as a micro controller, and combined with PID control algorithm constitute a closed loop control circuit. The voltage applied to the heating resistor wire is modified to achieve the temperature control of the VCSEL laser. In this way, the laser frequency can be controlled stably and easily. Ultimately, the temperature stability can be achieved better than 100mK.

Forecasting forest chip energy production in Finland 2008-2014

International Nuclear Information System (INIS)

Linden, Mikael

2011-01-01

Energy policy measures aim to increase energy production from forest chips in Finland to 10 TWh by year 2010. However, on the regional level production differences are large, and the regional estimates of the potential base of raw materials for the production of forest chips are heterogeneous. In order to analyse the validity of the above target, two methods are proposed to derive forecasts for region-level energy production from forest chips in Finland in the years 2008-2014. The plant-level data from 2003-2007 gives a starting point for a detailed statistical analysis of present and future region-level forest chip production. Observed 2008 regional levels are above the estimated prediction 95% confidence intervals based on aggregation of plant-level time averages. A simple time trend model with fixed-region effects provides accurate forecasts for the years 2008-2014. Forest chip production forecast confidence intervals cover almost all regions for the 2008 levels and the estimates of potential production levels for 2014. The forecast confidence intervals are also derived with re-sampling methods, i.e. with bootstrap methods, to obtain more reliable results. Results confirm that a general materials shortfall is not expected in the near future for forest chip energy production in Finland.

Pixel detector readout chip

CERN Multimedia

1991-01-01

Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

Preservation of forest wood chips

Energy Technology Data Exchange (ETDEWEB)

Kofman, P.D.; Thomsen, I.M.; Ohlsson, C.; Leer, E.; Ravn Schmidt, E.; Soerensen, M.; Knudsen, P.

1999-01-01

As part of the Danish Energy Research Programme on biomass utilisation for energy production (EFP), this project concerns problems connected to the handling and storing of wood chips. In this project, the possibility of preserving wood chips of the Norway Spruce (Picea Abies) is addressed, and the potential improvements by anaerobic storage are tested. Preservation of wood chips aims at reducing dry matter losses from extensive heating during storage and to reduce production of fungal spores. Fungal spores pose a health hazards to workers handling the chips. Further the producers of wood chips are interested in such a method since it would enable them to give a guarantee for the delivery of homogeneous wood chips also during the winter period. Three different types of wood chips were stored airtight and further one of these was stored in accordance with normal practise and use as reference. The results showed that airtight storage had a beneficial impact on the quality of the chips: no redistribution of moisture, low dry matter losses, unfavourable conditions for microbial activity of most fungi, and the promotion of yeasts instead of fungi with airborne spores. Likewise the firing tests showed that no combustion problems, and no increased risk to the environment or to the health of staff is caused by anaerobic storage of wood chips. In all, the tests of the anaerobic storage method of forest wood chips were a success and a large-scale test of the method will be carried out in 1999. (au)

Methods for size classification of wood chips

Energy Technology Data Exchange (ETDEWEB)

Hartmann, Hans; Boehm, Thorsten [Technologie- und Foerderzentrum im Kompetenzzentrum fuer Nachwachsende Rohstoffe (TFZ), Schulgasse 18, D-94315 Straubing (Germany); Daugbjerg Jensen, Peter [Forest and Landscape FLD, The Royal Veterinary and Agricultural University, Rolighedsvej 23, DK-1958 Frederiksberg C (Denmark); Temmerman, Michaeel; Rabier, Fabienne [Centre wallon de Recherches agronomiques CRA-W Departement Genie rural, 146, Chaussee de Namur, B-5030 Gembloux (Belgium); Golser, Michael [Holzforschung Austria HFA Franz Grill-Stra beta e 7, A-1031 Wien (Austria)

2006-11-15

Methods for size classification of wood chips were analysed in an international round robin using 13 conventional wood chip samples and two specially prepared standard samples, one from wood chips and one from hog fuel. The true size distribution of these two samples (according to length, width and height) had been determined stereometrically (reference method) using a digital calliper gauge and by weighing each of the about 7000 wood particles per sample. Five different horizontal and three rotary screening devices were tested using five different screen hole diameters (3.15, 8, 16, 45, 63mm, round holes). These systems are compared to a commercially available continuously measuring image analysis equipment. The results show that among the devices of a measuring principle-horizontal and rotary screening-the results are quite comparable, while there is a severe incompatibility when distributions are determined by different measuring principles. Highest conformity with the reference values is given for measurements with an image analysis system, whereas for all machines with horizontal screens the median value of the size distribution only reached between one-third to half of the reference median value for the particle length distribution. These deviations can be attributed to a higher particle misplacement, which is particularly found in the larger fractions. Such differences decrease when the particle's shape is more roundish (i.e. sphericity closer to one). The median values of length distributions from screenings with a rotary classifier are between the measurements from an image analysis and horizontal screening devices. (author)

On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip

Directory of Open Access Journals (Sweden)

Jian Lu

2008-01-01

Full Text Available A novel concept of on-chip bondwire inductors and transformers with ferrite epoxy glob coating is proposed to offer a cost effective approach realizing power systems on chip (SOC. We have investigated the concept both experimentally and with finite element modeling. A Q factor of 30–40 is experimentally demonstrated for the bondwire inductors which represents an improvement by a factor of 3–30 over the state-of-the-art MEMS micromachined inductors. Transformer parameters including self- and mutual inductance and coupling factors are extracted from both modeled and measured S-parameters. More importantly, the bondwire magnetic components can be easily integrated into SOC manufacturing processes with minimal changes and open enormous possibilities for realizing cost-effective, high-current, high-efficiency power SOCs.

Rapid and simple half-quantitative measurement alpha-fetoprotein by poly(dimethylsiloxane) microfluidic chip immunochromatographic assay

Science.gov (United States)

Tong, Chao; Jin, Qinghui; Zhao, Jianlong

2008-03-01

In this article, a kind of microfluidic method based on MEMS technology combined with gold immunochromatographic assay (GICA) is developed and discussed. Compared to the traditional GICA, this method supplies us convenient, multi-channel, in-parallel, low cost and similar efficiency approach in the fields of alpha-fetopro-tei (AFP)detection. Firstly, we improved the adhesion between the model material SU-8 and Silicon wafer, optimized approaches of the fabrication of the SU-8 model systematically, and fabricate the PDMS micro fluid chip with good reproduction successfully. Secondly, Surface modification and antibody immobilization methods with the GICA on the PDMS micro fluid analysis chip are studied, we choose the PDMS material and transfer GICA to the PDMS micro fluid chip successfully after researching the antibody immobilization efficiency of different materials utilized in fabrication of the micro fluid chip. In order to improve the reaction efficiency of the immobilized antibody, we studied the characteristics of micro fluid without the gas drive, and the fluid velocity control in our design; we also design structure of grove to strengthen the ability of immobilizing the antibody. The stimulation of the structure shows that it achieves great improvement and experiments prove the design is feasible.

EDITORIAL: LED light sources (light for the future) LED light sources (light for the future)

Science.gov (United States)

Grandjean, N.

2010-09-01

comprehensive review of the different localization mechanisms and their implication for internal quantum efficiency (IQE) is proposed by Oliver and co-workers from Cambridge University. When discussing IQE in InGaN-based LEDs, the efficiency droop at high-current injection always emerges, which is a major concern for the future of SSL technology. Here, a collaborative work between Samsung and the Gwangju Institute of Science and Technology (Korea) proves that a specific design of the active region can limit this detrimental effect. Once the issue of the IQE is solved, one still has to let the photons out of the chip. Matioli and Weisbuch from the University of California at Santa Barbara introduce the use of photonic crystals (PhCs) to improve light extraction efficiency. They describe different approaches to overcoming the main limitation of LEDs when implementing surface PhCs. The technology of SSL, and in particular of colour rendering, is tackled by Zukauskas et al who studied in detail different white light sources. They show that extreme colour-fidelity indices need to cover the entire spectrum, with a broad-band at 530-610 nm and a component beyond 610 nm. Then, the reliability of GaN-based LEDs is discussed in the paper of Meneghesso and co-workers. The authors consider the most important physical mechanisms that are (i) the degradation of the active layer of LEDs, (ii) the degradation of the package/phosphor system, (iii) the failure of GaN-based LEDs against electrostatic discharge. Finally, GaN LEDs on silicon developed in the group of Egawa at the Nagoya Institute of Technology are presented. This technology could allow a significant decrease in the fabrication cost of white LEDs.

On-chip photonic system using suspended p-n junction InGaN/GaN multiple quantum wells device and multiple waveguides

International Nuclear Information System (INIS)

Wang, Yongjin; Zhu, Guixia; Gao, Xumin; Yang, Yongchao; Yuan, Jialei; Shi, Zheng; Zhu, Hongbo; Cai, Wei

2016-01-01

We propose, fabricate, and characterize the on-chip integration of suspended p-n junction InGaN/GaN multiple quantum wells (MQWs) device and multiple waveguides on the same GaN-on-silicon platform. The integrated devices are fabricated via a wafer-level process and exhibit selectable functionalities for diverse applications. As the suspended p-n junction InGaN/GaN MQWs device operates under a light emitting diode (LED) mode, part of the light emission is confined and guided by the suspended waveguides. The in-plane propagation along the suspended waveguides is measured by a micro-transmittance setup. The on-chip data transmission is demonstrated for the proof-of-concept photonic integration. As the suspended p-n junction InGaN/GaN MQWs device operates under photodiode mode, the light is illuminated on the suspended waveguides with the aid of the micro-transmittance setup and, thus, coupled into the suspended waveguides. The guided light is finally sensed by the photodiode, and the induced photocurrent trace shows a distinct on/off switching performance. These experimental results indicate that the on-chip photonic integration is promising for the development of sophisticated integrated photonic circuits in the visible wavelength region.

Design and Performance of the CMS Pixel Detector Readout Chip

CERN Document Server

Kästli, H C; Erdmann, W; Hörmann, C; Horisberger, R P; Kotlinski, D; Meier, B; Hoermann, Ch.

2006-01-01

The readout chip for the CMS pixel detector has to deal with an enormous data rate. On-chip zero suppression is inevitable and hit data must be buffered locally during the latency of the first level trigger. Dead-time must be kept at a minimum. It is dominated by contributions coming from the readout. To keep it low an analog readout scheme has been adopted where pixel addresses are analog coded. We present the architecture of the final CMS pixel detector readout chip with special emphasis on the analog readout chain. Measurements of its performance are discussed.

Fully integrated optical system for lab-on-a-chip applications

DEFF Research Database (Denmark)

Balslev, Søren; Olsen, Brian Bilenberg; Geschke, Oliver

2004-01-01

We present a lab-on-a-chip device featuring a microfluidic dye laser, wave-guides, microfluidic components and photo-detectors integrated on the chip. The microsystem is designed for wavelength selective absorption measurements in the visible range on a fluidic sample, which can be prepared....../mixed on-chip. The laser structures, wave-guides and micro-fluidic handling system are defined in a single UV-lithography step on a 10 μm thick SU-8 layer on top of the substrate. The SU-8 structures are sealed by a Borofloat glass lid, using polymethylmethacrylate (PMMA) adhesive bonding....

Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries

Directory of Open Access Journals (Sweden)

Shantonu Biswas

2016-03-01

Full Text Available This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical connection process is driven by the surface free energy of molten solder bumps where the authors have made a contribution. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current robotic pick and place and serial wire bonding concepts. The following parts will be discussed: (2 Single-step assembly of LED arrays containing a repetition of a single component type; (3 Multi-step assembly of more than one component type adding a sequence and geometrical shape confinement to the basic concept to build more complex structures; demonstrators contain (3.1 self-packaging surface mount devices, and (3.2 multi-chip assemblies with unique angular orientation. Subsequently, measures are discussed (4 to enable the assembly of microscopic chips (10 μm–1 mm; a different transport method is introduced; demonstrators include the assembly of photovoltaic modules containing microscopic silicon tiles. Finally, (5 the extension to enable large area assembly is presented; a first reel-to-reel assembly machine is realized; the machine is applied to the field of solid state lighting and the emerging field of stretchable electronics which requires the assembly and electrical connection of semiconductor devices over exceedingly large area substrates.

The impact of CHIP premium increases on insurance outcomes among CHIP eligible children.

Science.gov (United States)

Nikolova, Silviya; Stearns, Sally

2014-03-03

Within the United States, public insurance premiums are used both to discourage private health policy holders from dropping coverage and to reduce state budget costs. Prior research suggests that the odds of having private coverage and being uninsured increase with increases in public insurance premiums. The aim of this paper is to test effects of Children's Health Insurance Program (CHIP) premium increases on public insurance, private insurance, and uninsurance rates. The fact that families just below and above a state-specific income cut-off are likely very similar in terms of observable and unobservable characteristics except the premium contribution provides a natural experiment for estimating the effect of premium increases. Using 2003 Medical Expenditure Panel Survey (MEPS) merged with CHIP premiums, we compare health insurance outcomes for CHIP eligible children as of January 2003 in states with a two-tier premium structure using a cross-sectional regression discontinuity methodology. We use difference-in-differences analysis to compare longitudinal insurance outcomes by December 2003. Higher CHIP premiums are associated with higher likelihood of private insurance. Disenrollment from CHIP in response to premium increases over time does not increase the uninsurance rate. When faced with higher CHIP premiums, private health insurance may be a preferable alternative for CHIP eligible families with higher incomes. Therefore, competition in the insurance exchanges being formed under the Affordable Care Act could enhance choice.

Advanced flip chip packaging

CERN Document Server

Lai, Yi-Shao; Wong, CP

2013-01-01

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

UW VLSI chip tester

Science.gov (United States)

McKenzie, Neil

1989-12-01

We present a design for a low-cost, functional VLSI chip tester. It is based on the Apple MacIntosh II personal computer. It tests chips that have up to 128 pins. All pin drivers of the tester are bidirectional; each pin is programmed independently as an input or an output. The tester can test both static and dynamic chips. Rudimentary speed testing is provided. Chips are tested by executing C programs written by the user. A software library is provided for program development. Tests run under both the Mac Operating System and A/UX. The design is implemented using Xilinx Logic Cell Arrays. Price/performance tradeoffs are discussed.

Determining wood chip size: image analysis and clustering methods

Directory of Open Access Journals (Sweden)

Paolo Febbi

2013-09-01

Full Text Available One of the standard methods for the determination of the size distribution of wood chips is the oscillating screen method (EN 15149- 1:2010. Recent literature demonstrated how image analysis could return highly accurate measure of the dimensions defined for each individual particle, and could promote a new method depending on the geometrical shape to determine the chip size in a more accurate way. A sample of wood chips (8 litres was sieved through horizontally oscillating sieves, using five different screen hole diameters (3.15, 8, 16, 45, 63 mm; the wood chips were sorted in decreasing size classes and the mass of all fractions was used to determine the size distribution of the particles. Since the chip shape and size influence the sieving results, Wang’s theory, which concerns the geometric forms, was considered. A cluster analysis on the shape descriptors (Fourier descriptors and size descriptors (area, perimeter, Feret diameters, eccentricity was applied to observe the chips distribution. The UPGMA algorithm was applied on Euclidean distance. The obtained dendrogram shows a group separation according with the original three sieving fractions. A comparison has been made between the traditional sieve and clustering results. This preliminary result shows how the image analysis-based method has a high potential for the characterization of wood chip size distribution and could be further investigated. Moreover, this method could be implemented in an online detection machine for chips size characterization. An improvement of the results is expected by using supervised multivariate methods that utilize known class memberships. The main objective of the future activities will be to shift the analysis from a 2-dimensional method to a 3- dimensional acquisition process.

Effect of on-chip filter on Coulomb blockade thermometer

International Nuclear Information System (INIS)

Roschier, L; Penttilä, J S; Gunnarsson, D; Prunnila, M; Meschke, M; Savin, A

2012-01-01

Coulomb Blockade Thermometer (CBT) is a primary thermometer based on electric conductance of normal tunnel junction arrays. One limitation for CBT use at the lowest temperatures has been due to environmental noise heating. To improve on this limitation, we have done measurements on CBT sensors fabricated with different on-chip filtering structures in a dilution refrigerator with a base temperature of 10 mK. The CBT sensors were produced with a wafer scale tunnel junction process. We present how the different on-chip filtering schemes affect the limiting saturation temperatures and show that CBT sensors with proper on-chip filtering work at temperatures below 20 mK and are tolerant to noisy environment.

Cache-aware network-on-chip for chip multiprocessors

Science.gov (United States)

Tatas, Konstantinos; Kyriacou, Costas; Dekoulis, George; Demetriou, Demetris; Avraam, Costas; Christou, Anastasia

2009-05-01

This paper presents the hardware prototype of a Network-on-Chip (NoC) for a chip multiprocessor that provides support for cache coherence, cache prefetching and cache-aware thread scheduling. A NoC with support to these cache related mechanisms can assist in improving systems performance by reducing the cache miss ratio. The presented multi-core system employs the Data-Driven Multithreading (DDM) model of execution. In DDM thread scheduling is done according to data availability, thus the system is aware of the threads to be executed in the near future. This characteristic of the DDM model allows for cache aware thread scheduling and cache prefetching. The NoC prototype is a crossbar switch with output buffering that can support a cache-aware 4-node chip multiprocessor. The prototype is built on the Xilinx ML506 board equipped with a Xilinx Virtex-5 FPGA.

Results of irriadiating the APV5 chip

CERN Document Server

Raymond, M

1996-01-01

An APV5 chip has been irradiated in steps up to 16 Mrads using a Co-60 source in order to confirm the radiation hardness expected from individual transistor and sub-circuit measurements. Full functionality is preserved after irradiation and measurements of the amplifier pulse shape and noise are presented.

Experiment list: SRX122496 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available || chip antibody=Rel || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip ant...ibody catalog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc

Smart vision chips: An overview

Science.gov (United States)

Koch, Christof

1994-01-01

This viewgraph presentation presents four working analog VLSI vision chips: (1) time-derivative retina, (2) zero-crossing chip, (3) resistive fuse, and (4) figure-ground chip; work in progress on computing motion and neuromorphic systems; and conceptual and practical lessons learned.

Experiment list: SRX122465 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 6 || chip antibody=Relb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Bethyl || chip anti...body catalog number 1=A302-183A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2

Experiment list: SRX122555 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available chip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip anti...body catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-7

Co-design of on-chip antennas and circuits for a UNII band monolithic transceiver

KAUST Repository

Shamim, Atif

2012-07-28

The surge of highly integrated and multifunction wireless devices has necessitated the designers to think outside the box for solutions that are unconventional. The new trends have provided the impetus for low cost and compact RF System-on-Chip (SoC) approaches [1]. The major advantages of SoC are miniaturization and cost reduction. A major bottleneck to the true realization of monolithic RF SoC transceivers is the implementation of on-chip antennas with circuitry. Though complete integrated transceivers with on-chip antennas have been demonstrated, these designs are generally for high frequencies. Moreover, they either use non-standard CMOS processes or additional fabrication steps to enhance the antenna efficiency, which in turn adds to the cost of the system [2-3]. Another challenge related to the on-chip antennas is the characterization of their radiation properties. Most of the recently reported work (summarized in Table I) shows that very few on-chip antennas are characterized. Our previous work [4], demonstrated a Phase Lock Loop (PLL) based transmitter (TX) with an on-chip antenna. However, the radiation from the on-chip antenna experienced strong interference due to 1) some active circuitry on one side of the chip and 2) the PCB used to mount the chip in the anechoic chamber. This paper presents, for the first time, a complete 5.2 GHz (UNII band) transceiver with separate TX and receiver (RX) antennas. To the author\\'s best knowledge, its size of 3 mm2 is the smallest reported for a UNII band transceiver with two on-chip antennas. Both antennas are characterized for their radiation properties through an on-wafer custom measurement setup. The strategy to co-design on-chip antennas with circuits, resultant trade-offs and measurement challenges have also been discussed. © 2010 IEEE.

On-chip digital power supply control for system-on-chip applications

NARCIS (Netherlands)

Meijer, M.; Pineda de Gyvez, J.; Otten, R.H.J.M.

2005-01-01

The authors presented an on-chip, fully-digital, power-supply control system. The scheme consists of two independent control loops that regulate power supply variations due to semiconductor process spread, temperature, and chip's workload. Smart power-switches working as linear voltage regulators

Spectrally adjustable quasi-monochromatic radiance source based on LEDs and its application for measuring spectral responsivity of a luminance meter

International Nuclear Information System (INIS)

Hirvonen, Juha-Matti; Poikonen, Tuomas; Vaskuri, Anna; Kärhä, Petri; Ikonen, Erkki

2013-01-01

A spectrally adjustable radiance source based on light-emitting diodes (LEDs) has been constructed for spectral responsivity measurements of radiance and luminance meters. A 300 mm integrating sphere source with adjustable output port is illuminated using 30 thermally stabilized narrow-band LEDs covering the visible wavelength range of 380–780 nm. The functionality of the measurement setup is demonstrated by measuring the relative spectral responsivities of a luminance meter and a photometer head with cosine-corrected input optics. (paper)

A single chip with multiple talents

CERN Multimedia

Francesco Poppi

2010-01-01

The Medipix chips developed at CERN are being used in a variety of fields: from medicine to education and back to high-tech engineering. The scene is set for a bright future for this versatile technology.   The Medipix chip. It didn’t take long for a brilliant team of physicists and engineers who were working on pixel detectors for the LHC to realize that the technology had great potential in medical imaging. This was the birth of the Medipix project. Fifteen years later, with the collaboration of 18 research institutes, the team has produced an advanced version of the initial ideas: Medipix3 is a device that can measure very accurately the position and energy of the photons (one by one) that hit the associated detector. Radiography and computed tomography (CT) use X-ray photons to study the human body. The different energies of the photons in the beam can be thought of as the colours of the X-ray spectrum. This is why the use of Medipix3 chips in such diagnostic techniques is referred...

Monolithic integration of DUV-induced waveguides into plastic microfluidic chip for optical manipulation

DEFF Research Database (Denmark)

Khoury Arvelo, Maria; Vannahme, Christoph; Sørensen, Kristian Tølbøl

2014-01-01

A monolithic polymer optofluidic chip for manipulation of microbeads in flow is demonstrated. On this chip, polymer waveguides induced by Deep UV lithography are integrated with microfluidic channels. The optical propagation losses of the waveguides are measured to be 0.66±0.13 dB/mm at a wavelen......A monolithic polymer optofluidic chip for manipulation of microbeads in flow is demonstrated. On this chip, polymer waveguides induced by Deep UV lithography are integrated with microfluidic channels. The optical propagation losses of the waveguides are measured to be 0.66±0.13 d......B/mm at a wavelength of λ = 808 nm. An optimized bead tracking algorithm is implemented, allowing for determination of the optical forces acting on the particles. The algorithm features a spatio-temporal mapping of coordinates for uniting partial trajectories, without increased processing time. With an external laser...

Comparison of effect of TDS and Fe in uranium measurement in LED and Xe lamp based fluorimeter

International Nuclear Information System (INIS)

Sahoo, S.K.; Mohapatra, S.; Lenka, P.; Dubey, J.S.; Patra, A.C.; Thakur, V.K.; Ravi, P.M.; Tripathi, R.M.

2014-01-01

In the present study, the effect of TDS and Fe on uranium fluorescence in water samples is studied by fluorometric techniques based on LED and xenon lamp systems. Fluorimeters are calibrated with uranium standards to establish the relationship between concentration and fluorescence response. Known concentration of uranium standard solution is measured in both LED and Xe lamp based fluorimeter after spiking with a series of concentration of Fe and TDS solution. Most often high levels of TDS are caused by the presence of K, CI, Na, etc. Thus here the effect of TDS is studied with NaCI solution but the effect may differ with the presence other elements. Details of the optimization procedure and measurement of uranium concentration in fluorometric technique are given elsewhere. In LED based system, sodium pyrophosphate with phosphoric acid is used as the complexing agent while sodium polysilicate is used in Xe lamp based system. Fe standard solution of 0.1 to 10 ppm was spiked with known uranium standard and analysed in both the fluorimeters. The fluorescence response gradually decreased upto 50% with 10 ppm of Fe in the solution in the LED based system whereas there was a gradual decrease of fluorescence response with increase in Fe concentration and it was 60% with 10 ppm of Fe. Thus both the instruments show nearly equal response with the increasing concentration of Fe in sample solution. Therefore, in case of high TDS and Fe content in the sample, precautions should be taken during measurement of uranium in water samples directly by fluorimetric techniques

Implementation of a Low-Cost Automated LED Photometer for Enzymatic Reaction Detection to Teach Basic Bioelectronics Technologies in Vocational High Schools

Science.gov (United States)

Chen, Huai-Yi; Nieh, Hwa-Ming; Yang, Ming-Feng; Chou, Yu-Kung; Chung, Jui-Hsu; Liou, Je-Wen

2016-01-01

This study proposes a home-assembled, low-cost blue light-emitting diode (LED) photometer that uses simple and low-cost hardware and software, costing about US $150. This 425-nm wavelength photometer is controlled by an 89C51 microcontroller chip. Glucose concentration detection experiments involving enzyme coupling reactions were carried out to…

Rapid and label-free bioanalytical method of alpha fetoprotein detection using LSPR chip

Science.gov (United States)

Kim, Dongjoo; Kim, Jinwoon; Kwak, Cheol Hwan; Heo, Nam Su; Oh, Seo Yeong; Lee, Hoomin; Lee, Go-Woon; Vilian, A. T. Ezhil; Han, Young-Kyu; Kim, Woo-Sik; Kim, Gi-bum; Kwon, Soonjo; Huh, Yun Suk

2017-07-01

Alpha fetoprotein (AFP) is a cancer marker, particularly for hepatocellular carcinoma. Normal levels of AFP are less than 20 ng/mL; however, its levels can reach more than 400 ng/mL in patients with HCC. Enzyme linked immunosorbent assay (ELISA) and radioimmunoassay (RIA) have been employed for clinical diagnosis of AFP; however, these methods are time consuming and labor intensive. In this study, we developed a localized surface plasmon resonance (LSPR) based biosensor for simple and rapid detection of AFP. This biosensor consists of a UV-Vis spectrometer, a cuvette cell, and a biosensor chip nanopatterned with gold nanoparticles (AuNPs). In our LSPR biosensor, binding of AFP to the surface of the sensor chip led to an increasing magnitude of the LSPR signals, which was measured by an ultraviolet-visible (UV-Vis) spectrometer. Our LSPR biosensor showed sufficient detectability of AFP at concentrations of 1 ng/mL to 1 μg/mL. Moreover, the overall procedure for detection of AFP was completed within 20 min. This biosensor could also be utilized for a point of care test (POCT) by employing a portable UV-Vis spectrometer. Owing to the simplicity and rapidity of the detection process, our LSPR biosensor is expected to replace traditional diagnostic methods for the early detection of diseases.

Development, optimisation and characterisation of a radiation hard mixed-signal readout chip for LHCb

Energy Technology Data Exchange (ETDEWEB)

Loechner, S.

2006-07-26

The Beetle chip is a radiation hard, 128 channel pipelined readout chip for silicon strip detectors. The front-end consists of a charge-sensitive preamplifier followed by a CR-RC pulse shaper. The analogue pipeline memory is implemented as a switched capacitor array with a maximum latency of 4us. The 128 analogue channels are multiplexed and transmitted off chip in 900ns via four current output drivers. Beside the pipelined readout path, the Beetle provides a fast discrimination of the front-end pulse. Within this doctoral thesis parts of the radiation hard Beetle readout chip for the LHCb experiment have been developed. The overall chip performances like noise, power consumption, input charge rates have been optimised as well as the elimination of failures so that the Beetle fulfils the requirements of the experiment. Furthermore the characterisation of the chip was a major part of this thesis. Beside the detailed measurement of the chip performance, several irradiation tests and an Single Event Upset (SEU) test were performed. A long-time measurement with a silicon strip detector was also part of this work as well as the development and test of a first mass production test setup. The Beetle chip showed no functional failure and only slight degradation in the analogue performance under irradiation of up to 130Mrad total dose. The Beetle chip fulfils all requirements of the vertex detector (VELO), the trigger tracker (TT) and the inner tracker (IT) and is ready for the start of LHCb end of 2007. (orig.)

Development, optimisation and characterisation of a radiation hard mixed-signal readout chip for LHCb

International Nuclear Information System (INIS)

Loechner, S.

2006-01-01

The Beetle chip is a radiation hard, 128 channel pipelined readout chip for silicon strip detectors. The front-end consists of a charge-sensitive preamplifier followed by a CR-RC pulse shaper. The analogue pipeline memory is implemented as a switched capacitor array with a maximum latency of 4us. The 128 analogue channels are multiplexed and transmitted off chip in 900ns via four current output drivers. Beside the pipelined readout path, the Beetle provides a fast discrimination of the front-end pulse. Within this doctoral thesis parts of the radiation hard Beetle readout chip for the LHCb experiment have been developed. The overall chip performances like noise, power consumption, input charge rates have been optimised as well as the elimination of failures so that the Beetle fulfils the requirements of the experiment. Furthermore the characterisation of the chip was a major part of this thesis. Beside the detailed measurement of the chip performance, several irradiation tests and an Single Event Upset (SEU) test were performed. A long-time measurement with a silicon strip detector was also part of this work as well as the development and test of a first mass production test setup. The Beetle chip showed no functional failure and only slight degradation in the analogue performance under irradiation of up to 130Mrad total dose. The Beetle chip fulfils all requirements of the vertex detector (VELO), the trigger tracker (TT) and the inner tracker (IT) and is ready for the start of LHCb end of 2007. (orig.)

Measurement of the ratio h / e with a photomultiplier tube and a set of LEDs

International Nuclear Information System (INIS)

Loparco, F; Malagoli, M S; Rainò, S; Spinelli, P

2017-01-01

We propose a laboratory experience aimed at undergraduate physics students to understand the main features of the photoelectric effect and to perform a measurement of the ratio h / e , where h is Planck’s constant and e is the electron charge. The experience is based on the method developed by Millikan for his measurements of the photoelectric effect in the years from 1912 to 1915. The experimental setup consists of a photomultiplier tube (PMT) equipped with a voltage divider properly modified to set variable retarding potentials between the photocathode and the first dynode, and a set of LEDs emitting at different wavelengths. The photocathode is illuminated with the various LEDs and, for each wavelength of the incident light, the output anode current is measured as a function of the retarding potential applied between the cathode and the first dynode. From each measurement, a value of the stopping potential for the anode current is derived. Finally, the stopping potentials are plotted as a function of the frequency of the incident light, and a linear fit is performed. The slope and the intercept of the line allow one to respectively evaluate the ratio h / e and the ratio W / e , where W is the work function of the photocathode. (paper)

Supply chains of forest chip production in Finland

Energy Technology Data Exchange (ETDEWEB)

Kaerhae, Kalle (Metsaeteho Oy, Helsinki (Finland)), e-mail: kalle.karha@metsateho.fi

2010-07-15

The Metsaeteho study investigated how logging residue chips, stump wood chips, and chips from small sized thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2008. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2008 by these suppliers was 6.5 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected in March-May 2009. The majority of the logging residue chips and chips from small-sized thinning wood were produced using the roadside chipping supply chain in Finland in 2008. The chipping at plant supply chain was also significant in the production of logging residue chips. 70% of all stump wood chips consumed were comminuted at the plant and 29% at terminals. The role of the terminal chipping supply chain was also significant in the production of chips from logging residues and small-sized wood chips. When producing chips from large-sized (rotten) roundwood, nearly a half of chips were comminuted at plants and more than 40% at terminals

Supply systems of forest chip production in Finland

Energy Technology Data Exchange (ETDEWEB)

Kaerhae, K. (Metsaeteho Oy, Helsinki (Finland)), e-mail: kalle.karha@metsateho.fi

2010-07-01

The Metsaeteho study investigated how logging residue chips, stump wood chips, and chips from small-diameter thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2009. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2009 by these suppliers was 8,4 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected from March-May, 2010. The majority of the logging residue chips and chips from small-diameter thinning wood were produced using the roadside chipping supply system in Finland in 2009. The chipping at plant supply system was also significant in the production of logging residue chips. Nearly 70 % of all stump wood chips consumed were comminuted at the plant and 28 % at terminals. The role of the terminal chipping supply system was also significant in the production of chips from logging residues and small-diameter wood chips. When producing chips from large-sized (rotten) roundwood, similarly roughly 70 % of chips were comminuted at plants and 23 % at terminals. (orig.)

Supply chains of forest chip production in Finland

Energy Technology Data Exchange (ETDEWEB)

Kaerhae, K. (Metsaeteho Oy, Helsinki (Finland)), Email: kalle.karha@metsateho.fi

2009-07-01

The Metsaeteho study investigated how logging residue chips. stump wood chips, and chips from small-sized thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2008. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2008 by these suppliers was 6,5 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected in March-May 2009. The majority of the logging residue chips and chips from small-sized thinning wood were produced using the roadside chipping supply chain in Finland in 2008. The chipping at plant supply chain was also significant in the production of logging residue chips. 70% of all stump wood chips consumed were comminuted at the plant and 29% at terminals. The role of the terminal chipping supply chain was also significant in the production of chips from logging residues and small-sized wood chips. When producing chips from large-sized (rotten) roundwood, nearly a half of chips were comminuted at plants and more than 40 % at terminals. (orig.)

Automated, Miniaturized and Integrated Quality Control-on-Chip (QC-on-a-Chip for Advanced Cell Therapy Applications

Directory of Open Access Journals (Sweden)

David eWartmann

2015-09-01

Full Text Available The combination of microfabrication-based technologies with cell biology has laid the foundation for the development of advanced in vitro diagnostic systems capable of evaluating cell cultures under defined, reproducible and standardizable measurement conditions. In the present review we describe recent lab-on-a-chip developments for cell analysis and how these methodologies could improve standard quality control in the field of manufacturing cell-based vaccines for clinical purposes. We highlight in particular the regulatory requirements for advanced cell therapy applications using as an example dendritic cell-based cancer vaccines to describe the tangible advantages of microfluidic devices that overcome most of the challenges associated with automation, miniaturization and integration of cell-based assays. As its main advantage lab-on-a-chip technology allows for precise regulation of culturing conditions, while simultaneously monitoring cell relevant parameters using embedded sensory systems. State-of-the-art lab-on-a-chip platforms for in vitro assessment of cell cultures and their potential future applications for cell therapies and cancer immunotherapy are discussed in the present review.

Application of single-chip microcomputer to portable radon and radon daughters monitor

International Nuclear Information System (INIS)

Meng Yecheng; Huang Zhanyun; She Chengye

1992-01-01

Application of single-chip microcomputer to portable radon and radon daughters monitor is introduced in this paper. With the single-chip microcomputer automation comes into effect in the process from sampling to measuring of radon and radon daughters. The concentrations of radon and radon daughters can be easily shown when the conversion coefficients are pre-settled before the measurement. Moreover, the principle and design are briefly discussed according to the characteristics of the monitor

Single chip camera active pixel sensor

Science.gov (United States)

Shaw, Timothy (Inventor); Pain, Bedabrata (Inventor); Olson, Brita (Inventor); Nixon, Robert H. (Inventor); Fossum, Eric R. (Inventor); Panicacci, Roger A. (Inventor); Mansoorian, Barmak (Inventor)

2003-01-01

A totally digital single chip camera includes communications to operate most of its structure in serial communication mode. The digital single chip camera include a D/A converter for converting an input digital word into an analog reference signal. The chip includes all of the necessary circuitry for operating the chip using a single pin.

On-chip spin-controlled orbital angular momentum directional coupling

Science.gov (United States)

Xie, Zhenwei; Lei, Ting; Si, Guangyuan; Du, Luping; Lin, Jiao; Min, Changjun; Yuan, Xiaocong

2018-01-01

Optical vortex beams have many potential applications in the particle trapping, quantum encoding, optical orbital angular momentum (OAM) communications and interconnects. However, the on-chip compact OAM detection is still a big challenge. Based on a holographic configuration and a spin-dependent structure design, we propose and demonstrate an on-chip spin-controlled OAM-mode directional coupler, which can couple the OAM signal to different directions due to its topological charge. While the directional coupling function can be switched on/off by altering the spin of incident beam. Both simulation and experimental measurements verify the validity of the proposed approach. This work would benefit the on-chip OAM devices for optical communications and high dimensional quantum coding/decoding in the future.

Parametric resonance and cooling on an atom chip

International Nuclear Information System (INIS)

Yan Bo; Li Xiaolin; Ke Min; Wang Yuzhu

2008-01-01

This paper observes the parametric excitation on atom chip by measuring the trap loss when applying a parametric modulation. By modulating the current in chip wires, it modulates not only the trap frequency but also the trap position. It shows that the strongest resonance occurs when the modulation frequency equals to the trap frequency. The resonance amplitude increases exponentially with modulation depth. Because the Z-trap is an anharmonic trap, there exists energy selective excitation which would cause parametric cooling. We confirm this effect by observing the temperature of atom cloud dropping

An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.

Science.gov (United States)

Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin

2016-11-04

An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA-0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C-1.79 mV/°C in the range 20-300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(V excit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min) -0.1 in the tested range of 0-4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.

Ultra-thin chip technology and applications

CERN Document Server

2010-01-01

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

An economic evaluation of a chlorhexidine chip for treating chronic periodontitis: the CHIP (chlorhexidine in periodontitis) study.

Science.gov (United States)

Henke, C J; Villa, K F; Aichelmann-Reidy, M E; Armitage, G C; Eber, R M; Genco, R J; Killoy, W J; Miller, D P; Page, R C; Polson, A M; Ryder, M I; Silva, S J; Somerman, M J; Van Dyke, T E; Wolff, L F; Evans, C J; Finkelman, R D

2001-11-01

The authors previously suggested that an adjunctive, controlled-release chlorhexidine, or CHX, chip may reduce periodontal surgical needs at little additional cost. This article presents an economic analysis of the CHX chip in general dental practice. In a one-year prospective clinical trial, 484 chronic periodontitis patients in 52 general practices across the United States were treated with either scaling and root planing, or SRP, plus any therapy prescribed by treating, unblinded dentists; or SRP plus other therapy as above but including the CHX chip. Economic data were collected from bills, case report forms and 12-month treatment recommendations from blinded periodontist evaluators. Total dental charges were higher for SRP + CHX chip patients vs. SRP patients when CHX chip costs were included (P = .027) but lower when CHX chip costs were excluded (P = .012). About one-half of the CHX chip acquisition cost was offset by savings in other charges. SRP + CHX chip patients were about 50 percent less likely to undergo surgical procedures than were SRP patients (P = .021). At the end of the trial, periodontist evaluators recommended similar additional procedures for both groups: SRP, about 46 percent; maintenance, about 37 percent; surgery, 56 percent for SRP alone and 63 percent for SRP + CHX chip. Adjunctive CHX chip use for general-practice patients with periodontitis increased costs but reduced surgeries over one year. At study's end, periodontists recommended similar additional surgical treatment for both groups. In general practice, routine use of the CHX chip suggests that costs will be partially offset by reduced surgery over at least one year.

Photonic network-on-chip design

CERN Document Server

Bergman, Keren; Biberman, Aleksandr; Chan, Johnnie; Hendry, Gilbert

2013-01-01

This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing photonic network-on-chip architectures for future many-core high performance chip multiprocessors. The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and network-on-chip theory and existing research, and finishing with describing various architectures, their characteristics, and the impact they will have on a computing system. After acquainting

Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

DEFF Research Database (Denmark)

2000-01-01

towards diaphragm. Surface of the chip (2) has electrical conductors (14) to connect chip with IC chip (3). USE - For use in miniature electroacoustic devices such as hearing aid. ADVANTAGE - Since sound inlet is covered by filter, dust, moisture and other impurities do not obstruct interior and sound...... inlet of microphone. External electrical connection can be made economically reliable and the thermal stress is avoided with the small size solid state silicon based condenser microphone....

Experiment list: SRX214086 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available entiated || cell line=KH2 || chip antibody 1=none || chip antibody manufacturer 1=none || chip antibody 2=none || chip antibody manuf...acturer 2=none http://dbarchive.biosciencedbc.jp/kyushu-

Low-cost low-power UHF RFID tag with on-chip antenna

Energy Technology Data Exchange (ETDEWEB)

Xi Jingtian; Yan Na; Che Wenyi; Xu Conghui; Wang Xiao; Yang Yuqing; Jian Hongyan; Min Hao, E-mail: jtxi@fudan.edu.c [State Key Laboratory of ASIC and System, Auto-ID Laboratory, Fudan University, Shanghai 201203 (China)

2009-07-15

This paper presents an EPC Class 1 Generation 2 compatible tag with on-chip antenna implemented in the SMIC 0.18 {mu}m standard CMOS process. The UHF tag chip includes an RF/analog front-end, a digital baseband, and a 640-bit EEPROM memory. The on-chip antenna is optimized based on a novel parasitic-aware model. The rectifier is optimized to achieve a power conversion efficiency up to 40% by applying a self-bias feedback and threshold compensation techniques. A good match between the tag circuits and the on-chip antenna is realized by adjusting the rectifier input impedance. Measurements show that the presented tag can achieve a communication range of 1 cm with 1 W reader output power using a 1 x 1 cm{sup 2} single-turn loop reader antenna.

Optical lattice on an atom chip

DEFF Research Database (Denmark)

Gallego, D.; Hofferberth, S.; Schumm, Thorsten

2009-01-01

Optical dipole traps and atom chips are two very powerful tools for the quantum manipulation of neutral atoms. We demonstrate that both methods can be combined by creating an optical lattice potential on an atom chip. A red-detuned laser beam is retroreflected using the atom chip surface as a high......-quality mirror, generating a vertical array of purely optical oblate traps. We transfer thermal atoms from the chip into the lattice and observe cooling into the two-dimensional regime. Using a chip-generated Bose-Einstein condensate, we demonstrate coherent Bloch oscillations in the lattice....

Measurements of Ultra-Fast single photon counting chip with energy window and 75 μm pixel pitch with Si and CdTe detectors

International Nuclear Information System (INIS)

Maj, P.; Grybos, P.; Kasinski, K.; Koziol, A.; Krzyzanowska, A.; Kmon, P.; Szczygiel, R.; Zoladz, M.

2017-01-01

Single photon counting pixel detectors become increasingly popular in various 2-D X-ray imaging techniques and scientific experiments mainly in solid state physics, material science and medicine. This paper presents architecture and measurement results of the UFXC32k chip designed in a CMOS 130 nm process. The chip consists of about 50 million transistors and has an area of 9.64 mm × 20.15 mm. The core of the IC is a matrix of 128 × 256 pixels of 75 μm pitch. Each pixel contains a CSA, a shaper with tunable gain, two discriminators with correction circuits and two 14-bit ripple counters operating in a normal mode (with energy window), a long counter mode (one 28-bit counter) and a zero-dead time mode. Gain and noise performance were verified with X-ray radiation and with the chip connected to Si (320 μm thick) and CdTe (750 μ m thick) sensors.

Experiment list: SRX214071 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available Undifferentiated || treatment=Overexpress Sox2-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacturer 2=

Comparing genome-wide chromatin profiles using ChIP-chip or ChIP-seq

NARCIS (Netherlands)

Johannes, Frank; Wardenaar, Rene; Colomé Tatché, Maria; Mousson, Florence; de Graaf, Petra; Mokry, Michal; Guryev, Victor; Timmers, H. Th. Marc; Cuppen, Edwin; Jansen, Ritsert C.; Bateman, Alex

2010-01-01

Motivation: ChIP-chip and ChIP-seq technologies provide genomewide measurements of various types of chromatin marks at an unprecedented resolution. With ChIP samples collected from different tissue types and/ or individuals, we can now begin to characterize stochastic or systematic changes in

Experiment list: SRX214075 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available age=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

Experiment list: SRX214074 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ge=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

Experiment list: SRX214072 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available e=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

On-chip measurements of Brownian relaxation of magnetic beads with diameters from 10 nm to 250 nm

DEFF Research Database (Denmark)

Østerberg, Frederik Westergaard; Rizzi, Giovanni; Hansen, Mikkel Fougt

2013-01-01

We demonstrate the use of planar Hall effect magnetoresistive sensors for AC susceptibility measurements of magnetic beads with frequencies ranging from DC to 1 MHz. This wide frequency range allows for measuring Brownian relaxation of magnetic beads with diameters ranging from 10 nm to 250 nm....... Brownian relaxation is measured for six different magnetic bead types and their hydrodynamic diameters are determined. The hydrodynamic diameters are found to be within 40% of the nominal bead diameters. We discuss the applicability of the different bead types for volume-based biosensing with respect...... to sedimentation, magnetic trapping, and signal per bead. Among the investigated beads, we conclude that the beads with a nominal diameter of 80 nm are best suited for future on-chip volume-based biosensing experiments using planar Hall effect sensors....

Experiment list: SRX214067 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available fferentiated || cell line=F9 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufacture...r 1=Santa Cruz || chip antibody 2=none || chip antibody manufacturer 2=none http://dbarchive.bioscien

‘No Blue’ White LED

DEFF Research Database (Denmark)

Ou, Haiyan; Corell, Dennis Dan; Dam-Hansen, Carsten

2010-01-01

This paper explored the feasibility of making a white LED light source by color mixing method without using the blue color. This ‘no blue’ white LED has potential applications in photolithography room illumination, medical treatment and biophotonics research. A no-blue LED was designed......-2005. Even after 15 days of illumination, no effect was observed. So this LED-based solution was demonstrated to be a very promising light source for photolithography room illumination due to its better color rendering in addition to energy efficiency, long life time and design flexibility. Additionally......, and the prototype was fabricated. The spectral power distribution of both the LED bulb and the yellow fluorescent tube was measured. Based on that, colorimetric values were calculated and compared on terms of chromatic coordinates, correlated color temperature, color rendering index, and chromatic deviation...

Wax-bonding 3D microfluidic chips

KAUST Repository

Gong, Xiuqing; Yi, Xin; Xiao, Kang; Li, Shunbo; Kodzius, Rimantas; Qin, Jianhua; Wen, Weijia

2013-01-01

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

Wax-bonding 3D microfluidic chips

KAUST Repository

Gong, Xiuqing

2013-10-10

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

Experiment list: SRX122523 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Irf2 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

Experiment list: SRX122414 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Junb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

Experiment list: SRX214077 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available erentiated || treatment=Overexpress Sox17_V5 tagged || cell line=KH2 || chip antibody 1=Sox17 || chip antibody manufacture...r 1=R&D || chip antibody 2=V5 || chip antibody manufacturer 2=Invit

Experiment list: SRX122485 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100

Experiment list: SRX122521 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Irf2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

Experiment list: SRX122417 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Junb || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

Experiment list: SRX122520 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Irf2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

Experiment list: SRX122413 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Junb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http:/

Experiment list: SRX122412 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Junb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http:/

Experiment list: SRX122406 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Irf1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 http:/

Experiment list: SRX122415 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Junb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

Experiment list: SRX122416 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Junb || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

Experiment list: SRX122565 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat2 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 http:/

Measurement techniques using ultrashort optical pulses. Final report, February 9-September 30, 1983

International Nuclear Information System (INIS)

Siegman, A.E.

1983-12-01

The very great potential contactless, very high speed, very flexible, on-chip testing, diagnostics and measurement of very fast semiconductor circuits and devices has led us to initiate a small program to investigate such applications, using our own familiarity with picosecond pulse techniques, in conjunction with the integrated circuits skills present in Stanford's Integrated Circuit Laboratory (ICL), Solid State Laboratory (SSL), and the newly established Center for Integrated Systems. We plan to carry out first a rather straightforward set of picosecond pulse measurements on polysilicon photodetectors or photoswitches, such as can be very conveniently fabricated onto silicon integrated circuits using standard IC techniques, to serve as on-chip, optically addressable test or diagnostic points. (Such test points may in fact be fabricated directly into the active portion of the IC, or as test points in the disposable Kerr region between chips, for access during initial fabrication only). We are therefore assembling the necessary laser system for these measurements, and in addition beginning the fabrication of silicon test devices in collaboration with Professor Robert Dutton of the Integrated Circuit Laboratory and CIS. While making these preparations we have also carried out a literature review of the current state-of-the-art in such electrooptic devices. Some of the results of this study are summarized

Experiment list: SRX122510 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Egr1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-110 ht

Experiment list: SRX122519 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Irf2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http:

Experiment list: SRX122472 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Runx1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab61753 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-8564 http

Experiment list: SRX122473 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Runx1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab61753 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-8564

Experiment list: SRX122497 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Rel || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http:

Experiment list: SRX122410 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Junb || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog n...umber 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://db

Experiment list: SRX186172 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 1=YY1 || chip antibody manufacturer 1=Abcam || chip antibody 2=YY1 || chip antibody manufacturer 2=Santa Cru...ip-Seq; Mus musculus; ChIP-Seq source_name=Rag1 -/- pro-B cells || chip antibody

Experiment list: SRX122493 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Atf4 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab28830-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-200

Experiment list: SRX122571 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 http

Experiment list: SRX122411 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Junb || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog n...umber 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://db

Experiment list: SRX122498 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Rel || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http:

Experiment list: SRX122516 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Irf2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http:

Experiment list: SRX122495 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Rel || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody catal...og number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http://

Dry Matter Losses and Greenhouse Gas Emissions From Outside Storage of Short Rotation Coppice Willow Chip.

Science.gov (United States)

Whittaker, Carly; Yates, Nicola E; Powers, Stephen J; Misselbrook, Tom; Shield, Ian

This study examined the dry matter losses and the greenhouse gas (GHG) concentrations within two short rotation coppice (SRC) willow wood chip storage heaps. One heap was built on a grassland area (East Midlands) and the other (Rothamsted) on a concrete hard standing. A series of 1- and 3-m probes were embedded in the heaps in order to retrieve gas samples for analysis, and pre-weighed net bags were positioned in the core of the heap to detect dry matter losses. The bagged samples showed dry matter losses of 18 and 19 % in the East Midlands and Rothamsted heaps after 210 and 97 days storage, respectively. The Rothamsted heap showed a whole-heap dry matter loss of 21 %. During this time, the wood chips dried from 54 to 39 % moisture content in the East Midlands heap and 50 to 43 % at Rothamsted. The results from analysing the whole Rothamsted heap indicated an overall loss of 1.5 GJ per tonne stored, although measurements from bagged samples in the core suggested that the chips dried sufficiently to have a minimal energy loss from storage. The process of mixing the heap, however, led to incorporation of wet outer layers and hence the average moisture content was higher in an average sample of chip. After establishment of the heaps, the temperature rose rapidly and this correlated with a peak in carbon dioxide (CO 2 ) concentration within the heap. A peak in methane (CH 4 ) concentration was also detected in both heaps, though more noticeably in the East Midlands heap after around 55 days. In both instances, the peak CH 4 concentration occurred as CO 2 concentrations dropped, suggesting that after an active period of aerobic decomposition in the first 2 months of storage, the conditions in the heap became anaerobic. The results from this study suggest that outside wood chip storage is not an efficient method of storing biomass, though this may be location-specific as there are some studies showing lower dry matter losses. It is necessary to explore other

Adhesion strength of a living cell to various substrates measured using a cup-attached atomic force microscopy chip

Science.gov (United States)

Kim, Hyonchol; Ishibashi, Kenta; Matsuo, Kosuke; Kira, Atsushi; Onomura, Yui; Okada, Tomoko; Nakamura, Chikashi

2018-03-01

Cell adhesion strengths to various substrates were quantitatively measured using atomic force microscopy (AFM). A cup-shaped metal hemisphere was attached to the apex of the AFM cantilever, the “cup-chip” approached a cell (FP10SC2) to pick it up, the captured cell approached any one of six different substrates [gold (Au), nickel (Ni), bovine serum albumin (BSA), an amino group (NH2), poly(tetrafluoroethylene) (PTFE), and structured PTFE (sPTFE)], and the cell adhesion strength at the initial contact period was evaluated by detaching the cell from the substrate. The results obtained showed that the force needed to detach the cell from the NH2 substrate was more than 3-fold larger than that of metal substrates (Au and Ni), more than 15-fold larger than that of biochemically treated substrates (BSA), and more than 20-fold larger than that of hydrophobic substrates (PTFE and sPTFE). Using differences in adhesion strengths, a cell on a sPTFE substrate was picked up using a BSA-coated cup-chip, placed on a NH2 substrate, repeating this cell manipulation five times, and line patterning of cells was achieved. These results indicate that measurements of cell adhesion strength are fundamental to fabricate desired cell networks and the cup-chip is a useful tool for achieving easy cell manipulation.

Experiment list: SRX122563 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

Experiment list: SRX122564 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

Experiment list: SRX122488 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 h

Experiment list: SRX122491 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Atf3 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

Experiment list: SRX122548 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody... catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A

Experiment list: SRX122468 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Rela || treatment=LPS || time=0 min || chip antibody manufacturer 1=Bethyl || chip antibody catalo...g number 1=A301-824A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-372 htt

Experiment list: SRX122561 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

Experiment list: SRX122409 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Irf1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody cata...log number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 htt

Experiment list: SRX122487 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 h

Experiment list: SRX122552 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibo...dy catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753

Experiment list: SRX122408 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available p antibody=Irf1 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 http

Experiment list: SRX122513 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available p antibody=Egr1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-110

Experiment list: SRX122567 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available p antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 ht

Experiment list: SRX122490 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Atf3 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

Experiment list: SRX122558 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available hip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antib...ody catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-75

Experiment list: SRX122494 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available hip antibody=Atf4 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab28830-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-2

Experiment list: SRX122557 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available hip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antib...ody catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-75

Experiment list: SRX122492 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Atf3 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

Experiment list: SRX122549 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody... catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A

Experiment list: SRX122484 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ntibody=Atf3 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cata...log number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 http

Experiment list: SRX122514 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available tibody=Irf2 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog nu...mber 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://db

Experiment list: SRX122570 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available p antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 ht

Experiment list: SRX122569 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 h

Experiment list: SRX122511 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Egr1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-11

Experiment list: SRX122471 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Rela || treatment=LPS || time=60 min || chip antibody manufacturer 1=Bethyl || chip antibody cat...alog number 1=A301-824A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-372

Experiment list: SRX122554 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available ip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibo...dy catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753

Comparing genome-wide chromatin profiles using ChIP-chip or ChIP-seq

NARCIS (Netherlands)

Johannes, F.; Wardenaar, R.; Colome-Tatche, M.; Mousson, F.; de Graaf, P.; Mokry, M.; Guryev, V.; Timmers, H.T.; Cuppen, E.; Jansen, R.

2010-01-01

MOTIVATION: ChIP-chip and ChIP-seq technologies provide genome-wide measurements of various types of chromatin marks at an unprecedented resolution. With ChIP samples collected from different tissue types and/or individuals, we can now begin to characterize stochastic or systematic changes in

Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.

Science.gov (United States)

Li, Lin; Yin, Heyu; Mason, Andrew J

2018-04-01

The integration of biosensors, microfluidics, and CMOS instrumentation provides a compact lab-on-CMOS microsystem well suited for high throughput measurement. This paper describes a new epoxy chip-in-carrier integration process and two planar metalization techniques for lab-on-CMOS that enable on-CMOS electrochemical measurement with multichannel microfluidics. Several design approaches with different fabrication steps and materials were experimentally analyzed to identify an ideal process that can achieve desired capability with high yield and low material and tool cost. On-chip electrochemical measurements of the integrated assembly were performed to verify the functionality of the chip-in-carrier packaging and its capability for microfluidic integration. The newly developed CMOS-compatible epoxy chip-in-carrier process paves the way for full implementation of many lab-on-CMOS applications with CMOS ICs as core electronic instruments.

Experiment list: SRX122551 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ca...talog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A htt

Experiment list: SRX122546 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available p antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

Experiment list: SRX122547 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

Experiment list: SRX214084 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available turer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox17-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufac

Experiment list: SRX122544 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

Experiment list: SRX214082 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available facturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...age=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manu

Experiment list: SRX122466 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available p antibody=Relb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Bethyl || chip antibody cata...log number 1=A302-183A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-226 h

Experiment list: SRX122545 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

Experiment list: SRX214080 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available cturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufa

Experiment list: SRX214081 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available cturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufa

Experiment list: SRX214068 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available inoic acid || cell line=F9 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufacturer 1=Santa Cruz || chip... antibody 2=none || chip antibody manufacturer 2=none http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachDat

ALICE chip processor

CERN Multimedia

Maximilien Brice

2003-01-01

This tiny chip provides data processing for the time projection chamber on ALICE. Known as the ALICE TPC Read Out (ALTRO), this device was designed to minimize the size and power consumption of the TPC front end electronics. This single chip contains 16 low-power analogue-to-digital converters with six million transistors of digital processing and 8 kbits of data storage.

The LED monitoring system of the PHOENICS experiment

International Nuclear Information System (INIS)

Urban, D.

1991-07-01

The PHOENICS experiment at ELSA uses a LED monitoring system to control pulse height and time measurement with scintillation counters. A green LED is mounted at the light guide of each of the 304 involved photomultiplier tubes. The LEDs are driven by fast voltage pulses of 5 ns FWHM width and about 20 V amplitude. Simulation of single events is possible by computer controlled switching of individual LEDs. In order to correct for the temperature dependence of the LED intensity an automatic temperature recording system was coupled to the computer. This monitor system allows to control the pulse height and time measurement with an accuracy of about 2% and 100 ps respectively. (orig.) [de

Study on luminescence and thermal stability of blue-emitting Sr_5(PO_4)_3F: Eu"2"+phosphor for application in InGaN-based LEDs

International Nuclear Information System (INIS)

Liu, Jie; Zhang, Zhi-Ming; Wu, Zhan-Chao; Wang, Fang-Fang; Li, Zhen-Jiang

2017-01-01

Highlights: • A blue phosphor Sr_5(PO_4)_3F: Eu"2"+ was prepared at low temperature of 800 °C. • The broad excitation band of the phosphor matches well with NUV LED chips. • The phosphor shows high color purity and good color stability. • A bright blue-emitting LED was fabricated with this phosphor on an InGaN chip. - Abstract: A series of blue-emitting phosphors Sr_5(PO_4)_3F: Eu"2"+ were synthesized by traditional high temperature solid-state reaction method. The micro-morphology and photoluminescence properties of the phosphors were investigated. The Sr_5(PO_4)_3F: Eu"2"+ phosphors exhibit broad excitation spectra ranging from 250 to 420 nm, and an intense asymmetric blue emission band peaking at 435 nm. Two different Eu"2"+ emission centers in Sr_5(PO_4)_3F: Eu"2"+ phosphors were confirmed via their fluorescence properties. The concentration quenching mechanism, fluorescence lifetime and thermal stability of Sr_5(PO_4)_3F: Eu"2"+ phosphors were studied in detail. The thermal stability can be improved obviously by anion substitution. The CIE chromaticity coordinates of Sr_5(PO_4)_3F: Eu"2"+ phosphors with different Eu"2"+-doped concentrations were calculated. A blue light-emitting diode was fabricated by combination of a 370 nm InGaN chip and the prepared phosphor Sr_5(PO_4)_3F: Eu"2"+. The present work suggests that Sr_5(PO_4)_3F: Eu"2"+ is a potential phosphor applied in InGaN-based LEDs.

On-chip spectroscopy with thermally tuned high-Q photonic crystal cavities

Energy Technology Data Exchange (ETDEWEB)

Liapis, Andreas C., E-mail: andreas.liapis@gmail.com; Gao, Boshen; Siddiqui, Mahmudur R. [The Institute of Optics, University of Rochester, Rochester, New York 14627 (United States); Shi, Zhimin [Department of Physics, University of South Florida, Tampa, Florida 33620 (United States); Boyd, Robert W. [The Institute of Optics, University of Rochester, Rochester, New York 14627 (United States); Department of Physics and School of Electrical Engineering and Computer Science, University of Ottawa, Ottawa, Ontario K1N 6N5 (Canada)

2016-01-11

Spectroscopic methods are a sensitive way to determine the chemical composition of potentially hazardous materials. Here, we demonstrate that thermally tuned high-Q photonic crystal cavities can be used as a compact high-resolution on-chip spectrometer. We have used such a chip-scale spectrometer to measure the absorption spectra of both acetylene and hydrogen cyanide in the 1550 nm spectral band and show that we can discriminate between the two chemical species even though the two materials have spectral features in the same spectral region. Our results pave the way for the development of chip-size chemical sensors that can detect toxic substances.

Microfluidic mixing triggered by an external LED illumination.

Science.gov (United States)

Venancio-Marques, Anna; Barbaud, Fanny; Baigl, Damien

2013-02-27

The mixing of confined liquids is a central yet challenging operation in miniaturized devices. Microfluidic mixing is usually achieved with passive mixers that are robust but poorly flexible, or active mixers that offer dynamic control but mainly rely on electrical or mechanical transducers, which increase the fragility, cost, and complexity of the device. Here, we describe the first remote and reversible control of microfluidic mixing triggered by a light illumination simply provided by an external LED illumination device. The approach is based on the light-induced generation of water microdroplets acting as reversible stirrers of two continuous oil phase flows containing samples to be mixed. We demonstrate many cycles of reversible photoinduced transitions between a nonmixing behavior and full homogenization of the two oil phases. The method is cheap, portable, and adaptable to many device configurations, thus constituting an essential brick for the generation of future all-optofluidic chip.

Mega-pixel PQR laser chips for interconnect, display ITS, and biocell-tweezers OEIC

Science.gov (United States)

Kwon, O'Dae; Yoon, J. H.; Kim, D. K.; Kim, Y. C.; Lee, S. E.; Kim, S. S.

2008-02-01

We describe a photonic quantum ring (PQR) laser device of three dimensional toroidal whispering gallery cavity. We have succeeded in fabricating the first genuine mega-pixel laser chips via regular semiconductor technology. This has been realized since the present injection laser emitting surface-normal dominant 3D whispering gallery modes (WGMs) can be operated CW with extremely low operating currents (μA-nA per pixel), together with the lasing temperature stabilities well above 140 deg C with minimal redshifts, which solves the well-known integration problems facing the conventional VCSEL. Such properties unusual for quantum well lasers become usual because the active region, involving vertically confining DBR structure in addition to the 2D concave WGM geometry, induces a 'photonic quantum ring (PQR)-like' carrier distribution through a photonic quantum corral effect. A few applications of such mega-pixel PQR chips are explained as follows: (A) Next-generation 3D semiconductor technologies demand a strategy on the inter-chip and intra-chip optical interconnect schemes with a key to the high-density emitter array. (B) Due to mounting traffic problems and fatalities ITS technology today is looking for a revolutionary change in the technology. We will thus outline how 'SLEEP-ITS' can emerge with the PQR's position-sensing capability. (C) We describe a recent PQR 'hole' laser of convex WGM: Mega-pixel PQR 'hole' laser chips are even easier to fabricate than PQR 'mesa' lasers. Genuine Laguerre-Gaussian (LG) beam patterns of PQR holes are very promising for biocell manipulations like sorting mouse myeloid leukemia (M1s) cells. (D) Energy saving and 3D speckle-free POR laser can outdo LEDs in view of red GaAs and blue GaN devices fabricated recently.

Digital column readout architectures for hybrid pixel detector readout chips

International Nuclear Information System (INIS)

Poikela, T; Plosila, J; Westerlund, T; Buytaert, J; Campbell, M; Gaspari, M De; Llopart, X; Wyllie, K; Gromov, V; Kluit, R; Beuzekom, M van; Zappon, F; Zivkovic, V; Brezina, C; Desch, K; Fu, Y; Kruth, A

2014-01-01

In this paper, two digital column architectures suitable for sparse readout of data from a pixel matrix in trigger-less applications are presented. Each architecture reads out a pixel matrix of 256 x 256 pixels with a pixel pitch of 55 μm. The first architecture has been implemented in the Timepix3 chip, and this is presented together with initial measurements. Simulation results and measured data are compared. The second architecture has been designed for Velopix, a readout chip planned for the LHCb VELO upgrade. Unlike Timepix3, this has to be tolerant to radiation-induced single-event effects. Results from post-layout simulations are shown with the circuit architectures

Potential roughness near lithographically fabricated atom chips

DEFF Research Database (Denmark)

Krüger, Peter; Andersson, L. M.; Wildermuth, Stefan

2007-01-01

Potential roughness has been reported to severely impair experiments in magnetic microtraps. We show that these obstacles can be overcome as we measure disorder potentials that are reduced by two orders of magnitude near lithographically patterned high-quality gold layers on semiconductor atom chip...

Design and Development of a Portable Metal Chip Baler using A System Design Approach

Directory of Open Access Journals (Sweden)

Hassan Mohd Fahrul

2017-01-01

Full Text Available A large amount of metal chips at workplace will result in untidy and unsafe condition thus measurements of safety are needed in some industries, where the metal chips will be collected and put into a container until the volume is sufficient to be recycled. Due to that reason, the metal chips require a lot of spaces for storage before going to recycle. In this study, a portable metal chip baler as a device for compacting those metal chips is presented based on a system approach of engineering design. Basically, the system design evolves through four phases of development that are started from conceptual design, preliminary system design, detail design and development to system test and evaluation. The portable metal chip baler uses current technology such as pneumatic cylinder to compress the metal chips so that the system capable to operate efficiently. The output from this system is the metal chips are compacted into a block shape and a working prototype was developed to prove the concept of the system. As a summary, the conceptual design of portable metal chip baler was proven and was presented using the philosophy of the systems design approach. This tool may assists workers especially in the Small-Medium Enterprise (SME manufacturing industries, school or universities’ workshops for managing metal chips easily and systematically.

An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications †

Science.gov (United States)

Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin

2016-01-01

An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries. PMID:27827904

Pelly Crossing wood chip boiler

Energy Technology Data Exchange (ETDEWEB)

1985-03-11

The Pelly wood chip project has demonstrated that wood chips are a successful fuel for space and domestic water heating in a northern climate. Pelly Crossing was chosen as a demonstration site for the following reasons: its extreme temperatures, an abundant local supply of resource material, the high cost of fuel oil heating and a lack of local employment. The major obstacle to the smooth operation of the boiler system was the poor quality of the chip supply. The production of poor quality chips has been caused by inadequate operation and maintenance of the chipper. Dull knives and faulty anvil adjustments produced chips and splinters far in excess of the one centimetre size specified for the system's design. Unanticipated complications have caused costs of the system to be higher than expected by approximately $15,000. The actual cost of the project was approximately $165,000. The first year of the system's operation was expected to accrue $11,600 in heating cost savings. This estimate was impossible to confirm given the system's irregular operation and incremental costs. Consistent operation of the system for a period of at least one year plus the installation of monitoring devices will allow the cost effectiveness to be calculated. The wood chip system's impact on the environment was estimated to be minimal. Wood chip burning was considered cleaner and safer than cordwood burning. 9 refs., 6 figs., 6 tabs.

Application of wood chips for soil mulching in the cultivation of ornamental grasses

Directory of Open Access Journals (Sweden)

Henschke Monika

2016-12-01

Full Text Available A mulch is a layer of material applied to the surface of the soil. Mulching plays an important role in the maintenance of green spaces. Organic materials are still sought for the preparation of mulches. Recently interest in wood chips has grown. The aim of the study was to determine the effect of mulching with pine and birch chips on the contents of phenolic compounds in the soil, as well as on the growth and flowering of ornamental grasses – Bouteloua gracilis (Kunth. Lag. ex Griffiths, Panicum virgatum L. and Pennisetum alopecuroides L. The content of phenolic compounds in the soil steadily increased from spring to autumn. Mulching led to a substantial increase in the level of phenolic compounds. In the first year of cultivation more phenolic compounds were released by chips of pine than birch, while in the second year this difference did not occur. Mulching had a negative impact on the growth and flowering of ornamental grasses, especially in the first year of cultivation. Ornamental grass sensitivity to the substances released from mulches decreased with the age of the plants and was dependent on the species – Bouteloua gracilis was found to be particularly sensitive.

Practical lighting design with LEDs

CERN Document Server

Lenk, Ron

2016-01-01

The second edition of Practical Lighting Design with LEDs has been revised and updated to provide the most current information for developing light-emitting diodes products. The authors, noted authorities in the field, offer a review of the most relevant topics including optical performance, materials, thermal design, and modeling and measurement. Comprehensive in scope, the text covers all the information needed to design LEDs into end products.

Long-term stable stacked CsPbBr3 quantum dot films for highly efficient white light generation in LEDs.

Science.gov (United States)

Song, Young Hyun; Yoo, Jin Sun; Kang, Bong Kyun; Choi, Seung Hee; Ji, Eun Kyung; Jung, Hyun Suk; Yoon, Dae Ho

2016-12-01

We report highly efficient ethyl cellulose with CsPbBr 3 perovskite QD films for white light generation in LED application. Ethyl cellulose with CsPbBr 3 quantum dots is applied with Sr 2 Si 5 N 8  : Eu 2+ red phosphor on an InGaN blue chip, achieving a highly efficient luminous efficacy of 67.93 lm W -1 under 20 mA current.

Application of high voltage electric field (HVEF) drying technology in potato chips

International Nuclear Information System (INIS)

Bai, Yaxiang; Shi, Hua; Yang, Yaxin

2013-01-01

In order to improve the drying efficiency and qualities of vegetable by high voltage electric field (HVEF), potato chips as a representative of vegetable was dried using a high voltage electric drying systems at 20°C. The shrinkage rate, water absorption and rehydration ratio of dried potato chips were measured. The results indicated that the drying rate of potato chips was significantly improved in the high voltage electric drying systems. The shrinkage rate of potato chips dried by high voltage electric field was 1.1% lower than that by oven drying method. And the rehydration rate of high voltage electric field was 24.6% higher than that by oven drying method. High voltage electric field drying is very advantageous and can be used as a substitute for traditional drying method.

Harmonics Monitoring Survey on LED Lamps

Directory of Open Access Journals (Sweden)

Abdelrahman Ahmed Akila

2017-03-01

Full Text Available Light Emitting Diode (LED lamps are being increasingly used in many applications. These LED lamps operate using a driver, which is a switching device. Hence, LED lamps will be a source of harmonics in the power system. These harmonics if not well treated, may cause severe performance and operational problems. In this paper, harmonics (amplitude and phase angles generated by both LED lamps and conventional fluorescent lamps will be studied practically. Then they will be analyzed and evaluated. Compared to each other harmonics generated by both LED and conventional florescent lamps, self mitigation may occur based on the phase angle of these harmonics. All data will be measured using power analyzer and will be done on a sample of actual lamps.

Setup of a LED light-pulser system for the OLYMPUS experiment; Aufbau eines LED-Lichtpulsersystems fuer das OLYMPUS-Experiment

Energy Technology Data Exchange (ETDEWEB)

Rehman, Waqaas

2011-12-15

The aim of this thesis consists in the construction and test of an external light-calibration system based on light-emitting diodes (LED) for the application at the symmetric Moller/Bhabha (SYMB) luminosity monitor. In chapter 2 the theoretical foundations of the OLYMPUS experiment, especially of the SYMB luminosity monitor are explained. Thereafter in chapter 3 the details of the setup of the OLYMPUS experiment and the fundamental properties of the SYMB detectors are discussed. In chapter 4 the whole concept of the LED light-pulser system is treated. In chapter 5 then test measurements with the ready LED light-pulser system are described. Thereby the light source shall be optimized in the shape that thereafter light pulses with short signal width are producable. Also different measurements for the unique characterization of the systems are performed. In chapter 6 light-intensity measurements during the operation of the LED light-pulser system are described.

Rearrangeable and exchangeable optical module with system-on-chip for wearable functional near-infrared spectroscopy system.

Science.gov (United States)

Funane, Tsukasa; Numata, Takashi; Sato, Hiroki; Hiraizumi, Shinsuke; Hasegawa, Yuichi; Kuwabara, Hidenobu; Hasegawa, Kiyoshi; Kiguchi, Masashi

2018-01-01

We developed a system-on-chip (SoC)-incorporated light-emitting diode (LED) and avalanche photodiode (APD) modules to improve the usability and flexibility of a fiberless wearable functional near-infrared spectroscopy (fNIRS) system. The SoC has a microprocessing unit and programmable circuits. The time division method and the lock-in method were used for separately detecting signals from different positions and signals of different wavelengths, respectively. Each module autonomously works for this time-divided-lock-in measurement with a high sensitivity for haired regions. By supplying [Formula: see text] of power and base and data clocks, the LED module emits both 730- and 855-nm wavelengths of light, amplitudes of which are modulated in each lock-in frequency generated from the base clock, and the APD module provides the lock-in detected signals synchronizing with the data clock. The SoC provided many functions, including automatic-power-control of the LED, automatic judgment of detected power level, and automatic-gain-control of the programmable gain amplifier. The number and the arrangement of modules can be adaptively changed by connecting this exchangeable modules in a daisy chain and setting the parameters dependent on the probing position. Therefore, users can configure a variety of arrangements (single- or multidistance combinations) of them with this module-based system.

Low-power grating detection system chip for high-speed low-cost length and angle precision measurement

Science.gov (United States)

Hou, Ligang; Luo, Rengui; Wu, Wuchen

2006-11-01

This paper forwards a low power grating detection chip (EYAS) on length and angle precision measurement. Traditional grating detection method, such as resister chain divide or phase locked divide circuit are difficult to design and tune. The need of an additional CPU for control and display makes these methods' implementation more complex and costly. Traditional methods also suffer low sampling speed for the complex divide circuit scheme and CPU software compensation. EYAS is an application specific integrated circuit (ASIC). It integrates micro controller unit (MCU), power management unit (PMU), LCD controller, Keyboard interface, grating detection unit and other peripherals. Working at 10MHz, EYAS can afford 5MHz internal sampling rate and can handle 1.25MHz orthogonal signal from grating sensor. With a simple control interface by keyboard, sensor parameter, data processing and system working mode can be configured. Two LCD controllers can adapt to dot array LCD or segment bit LCD, which comprised output interface. PMU alters system between working and standby mode by clock gating technique to save power. EYAS in test mode (system action are more frequently than real world use) consumes 0.9mw, while 0.2mw in real world use. EYAS achieved the whole grating detection system function, high-speed orthogonal signal handling in a single chip with very low power consumption.

Invited Article: Terahertz microfluidic chips sensitivity-enhanced with a few arrays of meta-atoms

Directory of Open Access Journals (Sweden)

Kazunori Serita

2018-05-01

Full Text Available We present a nonlinear optical crystal (NLOC-based terahertz (THz microfluidic chip with a few arrays of split ring resonators (SRRs for ultra-trace and quantitative measurements of liquid solutions. The proposed chip operates on the basis of near-field coupling between the SRRs and a local emission of point like THz source that is generated in the process of optical rectification in NLOCs on a sub-wavelength scale. The liquid solutions flowing inside the microchannel modify the resonance frequency and peak attenuation in the THz transmission spectra. In contrast to conventional bio-sensing with far/near-field THz waves, our technique can be expected to compactify the chip design as well as realize high sensitive near-field measurement of liquid solutions without any high-power optical/THz source, near-field probes, and prisms. Using this chip, we have succeeded in observing the 31.8 fmol of ion concentration in actual amount of 318 pl water solutions from the shift of the resonance frequency. The technique opens the door to microanalysis of biological samples with THz waves and accelerates development of THz lab-on-chip devices.

Invited Article: Terahertz microfluidic chips sensitivity-enhanced with a few arrays of meta-atoms

Science.gov (United States)

Serita, Kazunori; Matsuda, Eiki; Okada, Kosuke; Murakami, Hironaru; Kawayama, Iwao; Tonouchi, Masayoshi

2018-05-01

We present a nonlinear optical crystal (NLOC)-based terahertz (THz) microfluidic chip with a few arrays of split ring resonators (SRRs) for ultra-trace and quantitative measurements of liquid solutions. The proposed chip operates on the basis of near-field coupling between the SRRs and a local emission of point like THz source that is generated in the process of optical rectification in NLOCs on a sub-wavelength scale. The liquid solutions flowing inside the microchannel modify the resonance frequency and peak attenuation in the THz transmission spectra. In contrast to conventional bio-sensing with far/near-field THz waves, our technique can be expected to compactify the chip design as well as realize high sensitive near-field measurement of liquid solutions without any high-power optical/THz source, near-field probes, and prisms. Using this chip, we have succeeded in observing the 31.8 fmol of ion concentration in actual amount of 318 pl water solutions from the shift of the resonance frequency. The technique opens the door to microanalysis of biological samples with THz waves and accelerates development of THz lab-on-chip devices.

Optical and Electric Multifunctional CMOS Image Sensors for On-Chip Biosensing Applications

Directory of Open Access Journals (Sweden)

Kiyotaka Sasagawa

2010-12-01

Full Text Available In this review, the concept, design, performance, and a functional demonstration of multifunctional complementary metal-oxide-semiconductor (CMOS image sensors dedicated to on-chip biosensing applications are described. We developed a sensor architecture that allows flexible configuration of a sensing pixel array consisting of optical and electric sensing pixels, and designed multifunctional CMOS image sensors that can sense light intensity and electric potential or apply a voltage to an on-chip measurement target. We describe the sensors’ architecture on the basis of the type of electric measurement or imaging functionalities.

LED-based UV source for monitoring spectroradiometer properties

Science.gov (United States)

Sildoja, Meelis-Mait; Nevas, Saulius; Kouremeti, Natalia; Gröbner, Julian; Pape, Sven; Pendsa, Stefan; Sperfeld, Peter; Kemus, Fabian

2018-06-01

A compact and stable UV monitoring source based on state-of-the-art commercially available ultraviolet light emitting diodes (UV-LEDs) has been developed. It is designed to trace the radiometric stability—both responsivity and wavelength scale—of array spectroradiometers measuring direct solar irradiance in the wavelength range between 300 nm and 400 nm. The spectral irradiance stability of the UV-LED-based light source observed in the laboratory after seasoning (burning-in) the individual LEDs was better than 0.3% over a 12 h period of continuous operation. The integral irradiance measurements of the source over a period of several months, where the UV-LED source was not operated continuously between the measurements, showed stability within 0.3%. In-field measurements of the source with an array spectroradiometer indicated the stability of the source to be within the standard uncertainty of the spectroradiometer calibration, which was within 1% to 2%.

Peer-led prenatal breast-feeding education: a viable alternative to nurse-led education.

Science.gov (United States)

Rempel, Lynn A; Moore, Katrina C J

2012-02-01

To evaluate a prenatal breast-feeding class developed and facilitated by peer Breast-feeding Buddies. Non-equivalent control group quasi-experimental study comparing participants of the peer-led class (PLC) to those attending an established hospital-based breast-feeding nurse-led class (NLC). A brief questionnaire was completed immediately prior to the class, and telephone interviews were conducted approximately one week following the class, and one and six months post partum. 54 expectant mothers who registered for the community PLC and 55 expectant mothers who registered for the NLC. Breast-feeding intentions were measured at all time-points. Class evaluations, breast-feeding experiences, and breast-feeding support were measured at all post-class interviews. Both classes were considered worthwhile, but the PLC class was rated as more helpful and participants appreciated learning from the peers' personal experiences. Mothers taught by peers were more likely to access peer breast-feeding support. PLC participants initially decreased their prenatal breast-feeding duration intentions but had significantly stronger intentions to continue breast feeding at six months than did NLC mothers. A peer-led prenatal breast-feeding class is as effective as a traditional model of breast-feeding education and is a valuable tool to promote and support successful breast feeding. RECOMMENDATIONS FOR PRACTICE: Peer-led breast-feeding classes should be provided to enhance the accessibility of breast-feeding education and support for expectant mothers. Copyright © 2010 Elsevier Ltd. All rights reserved.

Lab-on a-Chip

Science.gov (United States)

1999-01-01

Labs on chips are manufactured in many shapes and sizes and can be used for numerous applications, from medical tests to water quality monitoring to detecting the signatures of life on other planets. The eight holes on this chip are actually ports that can be filled with fluids or chemicals. Tiny valves control the chemical processes by mixing fluids that move in the tiny channels that look like lines, connecting the ports. Scientists at NASA's Marshall Space Flight Center (MSFC) in Huntsville, Alabama designed this chip to grow biological crystals on the International Space Station (ISS). Through this research, they discovered that this technology is ideally suited for solving the challenges of the Vision for Space Exploration. For example, thousands of chips the size of dimes could be loaded on a Martian rover looking for biosignatures of past or present life. Other types of chips could be placed in handheld devices used to monitor microbes in water or to quickly conduct medical tests on astronauts. The portable, handheld Lab-on-a Chip Application Development Portable Test System (LOCAD-PTS) made its debut flight aboard Discovery during the STS-116 mission launched December 9, 2006. The system allowed crew members to monitor their environment for problematic contaminants such as yeast, mold, and even E.coli, and salmonella. Once LOCAD-PTS reached the ISS, the Marshall team continued to manage the experiment, monitoring the study from a console in the Payload Operations Center at MSFC. The results of these studies will help NASA researchers refine the technology for future Moon and Mars missions. (NASA/MSFC/D.Stoffer)

Position-controlled MOVPE growth and electro-optical characterization of core-shell InGaN/GaN microrod LEDs

Science.gov (United States)

Schimpke, Tilman; Lugauer, H.-J.; Avramescu, A.; Varghese, T.; Koller, A.; Hartmann, J.; Ledig, J.; Waag, A.; Strassburg, M.

2016-03-01

Today's InGaN-based white LEDs still suffer from a significant efficiency reduction at elevated current densities, the so-called "Droop". Core-shell microrods, with quantum wells (QWs) covering their entire surface, enable a tremendous increase in active area scaling with the rod's aspect ratio. Enlarging the active area on a given footprint area is a viable and cost effective route to mitigate the droop by effectively reducing the local current density. Microrods were grown in a large volume metal-organic vapor phase epitaxy (MOVPE) reactor on GaN-on-sapphire substrates with a thin, patterned SiO2 mask for position control. Out of the mask openings, pencil-shaped n-doped GaN microrod cores were grown under conditions favoring 3D growth. In a second growth step, these cores are covered with a shell containing a quantum well and a p-n junction to form LED structures. The emission from the QWs on the different facets was studied using resonant temperature-dependent photoluminescence (PL) and cathodoluminescence (CL) measurements. The crystal quality of the structures was investigated by transmission electron microscopy (TEM) showing the absence of extended defects like threading dislocations in the 3D core. In order to fabricate LED chips, dedicated processes were developed to accommodate for the special requirements of the 3D geometry. The electrical and optical properties of ensembles of tens of thousands microrods connected in parallel are discussed.

EDGE EFFECT MODELING AND STUDY FOR THREE-CHIP RGB LIGHT-EMITTING DIODES

Directory of Open Access Journals (Sweden)

A. I. Podosinnikov

2015-03-01

Full Text Available Subject of study. The paper deals with light quality improvement of multi–chip RGB light-emitting diodes (LEDs and luminaries on their basis. In particular, we have studied the issues of the edge effect reducing, which is non–uniformity of color when observing the source of light under different angles as well as non-uniformity of color distribution on the illuminated surface. Methods. Experimental study of the edge effect has been performed, namely, the analysis of the halo at the periphery of the illuminated area and the non–uniformity of area at the surface of the screen illuminated with RGB LEDs with and without light concentrators. Modeling of illumination distribution at various distances from the source for the system containing four RGB LEDs with reflectors by ZEMAX software has been carried out. Assessment of the uniformity for light distribution via calculating the chromaticity coordinates has been performed. Main results. The possibility of modeling application at the stage of a luminary design is shown on the example of RGB LEDs for assessing the efficiency of light flux usage and colorimetric parameters. Suggested method simplifies significantly the design of luminaries and reduces associated costs. Practical relevance. The findings can be used in the design of luminaries based on RGB LEDs, including the ones with secondary optics elements.

Geotechnical properties of peat soil stabilised with shredded waste tyre chips

Directory of Open Access Journals (Sweden)

M.A. Rahgozar

2016-02-01

Full Text Available To accommodate major civil engineering projects in or in the vicinity of peatlands, it is essential to stabilise peat deposits. On the other hand, the accumulation of waste tyres in recent decades has caused environmental problems around the world. An effective remedy for both issues is to use scrap tyre material to stabilise problematic peat soils. This article reports an experimental investigation of the effects of adding shredded tyre chips on the stability and bearing capacity of peat soil. Peat soil samples from the Chaghakhor Wetland (Chaharmahal and Bakhtiari Province, Iran were mixed with sand at a constant dosage of 400 kg m-3 and different percentages (0 %, 5 %, 10 %, 15 % and 20 % by weight of shredded tyre chips. The unconfined compressive strength, effective cohesion, angle of internal friction and coefficient of permeability were measured for all of these mixtures. The results showed that adding shredded tyre chips significantly improved the geotechnical properties of the peat soil. The mixture with 10 % shredded tyre chips showed the highest unconfined compressive strength; the one with 15 % tyre chips exhibited the highest ductility; and adding 20 % shredded tyre chips provided the highest values for angle of internal friction, effective cohesion and coefficient of permeability. Scanning Electron Micrographs (SEM showed that the pore spaces in the stabilised peat were mostly filled with sand.

Determination of Apparent Amylose Content in Rice by Using Paper-Based Microfluidic Chips.

Science.gov (United States)

Hu, Xianqiao; Lu, Lin; Fang, Changyun; Duan, Binwu; Zhu, Zhiwei

2015-11-11

Determination of apparent amylose content in rice is a key function for rice research and the rice industry. In this paper, a novel approach with paper-based microfluidic chip is reported to determine apparent amylose content in rice. The conventional color reaction between amylose and iodine was employed. Blue color of amylose-iodine complex generated on-chip was converted to gray and measured with Photoshop after the colored chip was scanned. The method for preparation of the paper chip is described. In situ generation of iodine for on-chip color reaction was designed, and factors influencing color reaction were investigated in detail. Elimination of yellow color interference of excess iodine by exploiting color removal function of Photoshop was presented. Under the optimized conditions, apparent amylose content in rice ranging from 1.5 to 26.4% can be determined, and precision was 6.3%. The analytical results obtained with the developed approach were in good agreement with those with the continuous flow analyzer method.

Goniometric characterization of LED based greenhouse lighting

DEFF Research Database (Denmark)

Thorseth, Anders; Lindén, Johannes; Corell, Dennis Dan

2015-01-01

This paper describes a demonstration of goniospectroradiometry for characterizations of new light emitting diode (LED) based luminaries for enhanced photosynthesis in greenhouses. It highlights the differences between measurement of the traditional high pressure sodium (HPS) luminaries and the LED...

Deposition of chemically reactive and repellent sites on biosensor chips for reduced non-specific binding.

Science.gov (United States)

Gandhiraman, R P; Gubala, V; Le, N C H; Nam, Le Cao Hoai; Volcke, C; Doyle, C; James, B; Daniels, S; Williams, D E

2010-08-01

The performances of new polymeric materials with excellent optical properties and good machinability have led the biomedical diagnostics industry to develop cheap disposable biosensor platforms appropriate for point of care applications. Zeonor, a type of cycloolefin polymer (COP), is one such polymer that presents an excellent platform for biosensor chips. These polymer substrates have to be modified to have suitable physico-chemical properties for immobilizing proteins. In this work, we have demonstrated the amine functionalization of COP substrates, by plasma enhanced chemical vapour deposition (PECVD), through codeposition of ethylene diamine and 3-aminopropyltriethoxysilane precursors, for building chemistries on the plastic chip. The elemental composition, adhesion, ageing and reactivity of the plasma polymerized film were examined. The Si-O functionality present in amino silane contributed for a good interfacial adhesion of the coating to COP substrates and also acted as a network building layer for plasma polymerization. Wet chemical modification was then carried out on the amine functionalized chips to create chemically reactive isothiocyanate sites and protein repellent fluorinated sites on the same chip. The density of the reactive and repellent sites was altered by choosing appropriate mixtures of homofunctional phenyldiisothiocyanate (PDITC), pentafluoroisothiocyanate (5FITC) and phenylisothiocyanate (PITC) compounds. By tailoring the density of reactive binding sites and protein repellent sites, the non-specific binding of ssDNA has been decreased to a significant extent. Copyright 2010 Elsevier B.V. All rights reserved.

A long distance voice transmission system based on the white light LED

Science.gov (United States)

Tian, Chunyu; Wei, Chang; Wang, Yulian; Wang, Dachi; Yu, Benli; Xu, Feng

2017-10-01

A long distance voice transmission system based on a visible light communication technology (VLCT) is proposed in the paper. Our proposed system includes transmitter, receiver and the voice signal processing of single chip microcomputer. In the compact-sized LED transmitter, we use on-off-keying and not-return-to-zero (OOK-NRZ) to easily realize high speed modulation, and then systematic complexity is reduced. A voice transmission system, which possesses the properties of the low-noise and wide modulation band, is achieved by the design of high efficiency receiving optical path and using filters to reduce noise from the surrounding light. To improve the speed of the signal processing, we use single chip microcomputer to code and decode voice signal. Furthermore, serial peripheral interface (SPI) is adopted to accurately transmit voice signal data. The test results of our proposed system show that the transmission distance of this system is more than100 meters with the maximum data rate of 1.5 Mbit/s and a SNR of 30dB. This system has many advantages, such as simple construction, low cost and strong practicality. Therefore, it has extensive application prospect in the fields of the emergency communication and indoor wireless communication, etc.

Development of a Metal Cutting Tool Fase in Order to Create the Conditions of Ringed Chips Wrapping

OpenAIRE

Korchuganova, Mariya Anatolievna; Syrbakov, Andrey Pavlovich; Chernysheva, Tatiana Yurievna; Ivanov, G.; Korchuganov, Maksim Anatolievich

2016-01-01

When processing ductile metals with high cutting speed, there is a need to take additional measures for a comfortable and safe formation and removal of chips. In the conditions of large-scale manufacture, it is recommended to produce flow chips in the form of short fragments, while in the conditions of small-lot and single-piece manufacture, it is reasonable to wrap the chips spirally with a rather small turn radius. Such way of chips formation reduces the time of its removal from the working...

Experiment list: SRX110782 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available e3 (ab6002, abcam), Pol II (CTD4H8, Millipore) || chip antibody 1 manufacturer=ab...cam || chip antibody 2=Pol II (CTD4H8, Millipore) || chip antibody 2 manufacturer=Millipore http://dbarchive

Design of Elliptic Reflective LED Surgical Shadowless Lamps Using Mathematical Optical Tracing Algorithms

Directory of Open Access Journals (Sweden)

Cheng-Tang Pan

2014-01-01

Full Text Available Traditional surgical shadowless halogen lamps are generally designed as projection type with many light bulbs, which can produce not only mercury pollution but also heat radiation that are serious problems to patient. The study utilized Runge-Kutta methods and mathematical algorithms to design and optimize the freeform lens. The LED (light-emitting diode was adopted to replace the traditional halogen lamp. A uniform lens was designed and fabricated based on the energy conservation. At first, the light field of LED is concentrated through the freeform lens to improve the optical efficiency. Second, the three-shell elliptic curves are applied to the reflective surgical shadowless lamps, where only few LED chips are needed. Light rays emitting from different directions to the target plane can achieve the goal of shadowless. In this study, the LED’s luminance flux is 1,895 lm. The shadow dilution on the target plane is 54%. Ec (central illuminance is 114,900 lux, and the d50/d10 is 57% which is higher than the regulation by 7%, whereas the power consumption is only 20 W. The energy of reflective surgical shadowless lamps can save more than 50%, compared with the traditional projective one.

Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

Science.gov (United States)

Kremastiotis, I.

2017-12-01

The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial 180 nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of 128×128 square pixels with 25μm pitch. The sensor chip has been produced with the standard value for the substrate resistivity (~20 Ωcm) and it has been characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of ~20 ns for a power consumption of 5μW/pixel. Production of the C3PD HV-CMOS sensor chip with higher substrate resistivity wafers (~20, 80, 200 and 1000 Ωcm) is foreseen. The expected benefits of the higher substrate resistivity will be studied using future assemblies with the readout chip.

Quality evaluation of tortilla chips made with corn meal dough and cooked bean flour

Directory of Open Access Journals (Sweden)

Luz Araceli Ochoa-Martínez

2016-12-01

Full Text Available A mixture of cornmeal dough and cooked bean flour (BF was prepared at different ratios (50/50, 60/40, and 70/30 w/w, and processed to chips. Viscosity profile, temperature of gelatinization and enthalpy, texture, protein content, and in vitro digestibility were measured. Pasting temperature tended to be lower when the flour bean concentration was lower. Maximum viscosity increased significantly in both samples (dough mixture and chips when the BF concentration was lower. In general, gelatinization temperature remains constant, while the heating enthalpy was higher with lower BF concentration. The addition of BF was correlated with greater crispiness, suggesting improved chip texture at higher BF concentrations. The final protein content in the corn-bean chips was very similar, despite the concentration of BF used. Protein digestibility in the chips was affected by the proportion of BF added, being higher when the amount of the BF was lower.

Avaliação da aceitação de "chips" de mandioca Acceptance evaluation of cassava chips

Directory of Open Access Journals (Sweden)

Regina Kitagawa Grizotto

2003-12-01

Full Text Available Pré-tratamentos como o cozimento, a fermentação natural e a secagem parcial foram aplicados em raízes de mandioca, visando a obtenção de "chips" comestíveis. A avaliação sensorial foi feita com base na aceitação e aparência dos "chips" das variedades IAC Mantiqueira e IAC 576.70. Trinta consumidores potenciais do produto foram selecionados em função da disponibilidade e interesse em participar dos testes. Foi utilizada escala hedônica de 7 pontos, onde os provadores avaliaram as amostras delineadas em blocos casualizados. Os resultados obtidos mostraram que os "chips" controle e pré-cozidos foram aceitos sensorialmente, apresentado médias de 5,1 (gostei ligeiramente para IAC Mantiqueira e 6,0 (gostei moderadamente para IAC 576.70. Os "chips" pré-fermentados de ambas variedades foram rejeitados. Os termos de agrado mais comentados pelos provadores foram "sabor de mandioca", "crocância" e "textura". Os termos de desagrado mais citados incluem "textura dura", "falta sabor de mandioca" e "gosto de óleo". Os provadores consideraram adequada a aparência dos "chips" de ambas variedades, sendo ligeiramente preferida a aparência dos "chips" da IAC 576.70, com exceção dos "chips" cozidos por 8 minutos e os fermentados, rejeitados pelos consumidores. A cor amarela da polpa pode ter influenciado a aceitação da variedade IAC 576.70. A composição centesimal e o teor de fibras na mandioca in natura e, o teor de lipídeos em "chips" de mandioca, também foram apresentados.Pre-treatments such as cooking, natural fermentation and partial drying were applied to cassava roots, aimed at obtaining edible cassava chips. The sensory evaluation was based on the acceptance and appearance of the chips, using the varieties IAC Mantiqueira and IAC 576.70. Thirty potential consumers of the product were selected based on their availability and interest. A 7-point hedonic scale was used, all the judges evaluating all the samples using a randomised

Fully Automated On-Chip Imaging Flow Cytometry System with Disposable Contamination-Free Plastic Re-Cultivation Chip

Directory of Open Access Journals (Sweden)

Tomoyuki Kaneko

2011-06-01

Full Text Available We have developed a novel imaging cytometry system using a poly(methyl methacrylate (PMMA based microfluidic chip. The system was contamination-free, because sample suspensions contacted only with a flammable PMMA chip and no other component of the system. The transparency and low-fluorescence of PMMA was suitable for microscopic imaging of cells flowing through microchannels on the chip. Sample particles flowing through microchannels on the chip were discriminated by an image-recognition unit with a high-speed camera in real time at the rate of 200 event/s, e.g., microparticles 2.5 μm and 3.0 μm in diameter were differentiated with an error rate of less than 2%. Desired cells were separated automatically from other cells by electrophoretic or dielectrophoretic force one by one with a separation efficiency of 90%. Cells in suspension with fluorescent dye were separated using the same kind of microfluidic chip. Sample of 5 μL with 1 × 106 particle/mL was processed within 40 min. Separated cells could be cultured on the microfluidic chip without contamination. The whole operation of sample handling was automated using 3D micropipetting system. These results showed that the novel imaging flow cytometry system is practically applicable for biological research and clinical diagnostics.

An automatic single channel analyzer based on single-chip microcomputer

International Nuclear Information System (INIS)

Yan Xuekun; Jia Mingchun; Zhang Yan; Liu Mingjian; Luo Ming

2008-01-01

The hardware and software of an automatic single channel analyzer based on AT89C51RC single-chip microcomputer is described in this paper. The equipment takes a method of channel-width-adjusting symmetrically, and makes use of single-chip microcomputer to control the two DAC0832 so as to adjust the discriminating threshold and channel-width automatically. As a result, the auto-measuring of the single channel analyzer is realized. Its circuit configuration is simple, and the uniformity of its channel-width is well, too. (authors)

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

Science.gov (United States)

Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

2016-01-01

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Tractor performance monitor based on a single-chip microcomputer

Energy Technology Data Exchange (ETDEWEB)

Bedri, A.R.; Marley, S.J.; Buchelle, W.F.; Smay, T.A.

1981-01-01

A tractor performance monitor based on a single-chip microcomputer was developed to measure ground speed, slip, fuel consumption (rate and total), total area, theoretical time, and total time. Transducers used are presented in detail. 5 refs.

Characterization of AGIPD1.0: The full scale chip

Energy Technology Data Exchange (ETDEWEB)

Mezza, D., E-mail: davide.mezza@psi.ch [Paul-Scherrer-Institute (PSI), Villigen (Switzerland); Allahgholi, A.; Arino-Estrada, G.; Bianco, L.; Delfs, A. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Dinapoli, R. [Paul-Scherrer-Institute (PSI), Villigen (Switzerland); Goettlicher, P. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Graafsma, H. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Mid Sweden University, Sundsvall (Sweden); Greiffenberg, D. [Paul-Scherrer-Institute (PSI), Villigen (Switzerland); Hirsemann, H.; Jack, S. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Klanner, R. [University of Hamburg, Hamburg (Germany); Klyuev, A. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Krueger, H. [University of Bonn, Bonn (Germany); Marras, A. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Mozzanica, A. [Paul-Scherrer-Institute (PSI), Villigen (Switzerland); Poehlsen, J. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); Schmitt, B. [Paul-Scherrer-Institute (PSI), Villigen (Switzerland); Schwandt, J. [University of Hamburg, Hamburg (Germany); Sheviakov, I. [Deutsches Elektronensynchrotron DESY, Hamburg (Germany); and others

2016-12-01

The AGIPD (adaptive gain integrating pixel detector) detector is a high frame rate (4.5 MHz) and high dynamic range (up to 10{sup 4} ·12.4 keV photons) detector with single photon resolution (down to 4 keV taking 5σ as limit and lowest noise settings) developed for the European XFEL (XFEL.EU). This work is focused on the characterization of AGIPD1.0, which is the first full scale version of the chip. The chip is 64×64 pixels and each pixel has a size of 200×200 μm{sup 2}. Each pixel can store up to 352 images at a rate of 4.5 MHz (corresponding to 220 ns). A detailed characterization of the AGIPD1.0 chip has been performed in order to assess the main performance of the ASIC in terms of gain, noise, speed and dynamic range. From the measurements presented in this paper a good uniformity of the gain, a noise around 320 e{sup −} (rms) in standard mode and around 240 e{sup −} (rms) in high gain mode has been measured. Furthermore a detailed discussion about the non-linear behavior after the gain switching is presented with both experimental results and simulations.

On-chip magnetic bead-based DNA melting curve analysis using a magnetoresistive sensor

DEFF Research Database (Denmark)

Rizzi, Giovanni; Østerberg, Frederik Westergaard; Henriksen, Anders Dahl

2014-01-01

We present real-time measurements of DNA melting curves in a chip-based system that detects the amount of surface-bound magnetic beads using magnetoresistive magnetic field sensors. The sensors detect the difference between the amount of beads bound to the top and bottom sensor branches....... The beads are magnetized by the field arising from the bias current passed through the sensors. We demonstrate the first on-chip measurements of the melting of DNA hybrids upon a ramping of the temperature. This overcomes the limitation of using a single washing condition at constant temperature. Moreover...

Palladium-based on-wafer electroluminescence studies of GaN-based LED structures

Energy Technology Data Exchange (ETDEWEB)

Salcianu, C.O.; Thrush, E.J.; Humphreys, C.J. [Department of Materials Science and Metallurgy, University of Cambridge, Pembroke Street, Cambridge CB2 3QZ (United Kingdom); Plumb, R.G. [Centre for Photonic Systems, Department of Engineering, University of Cambridge, Cambridge CB3 0FD (United Kingdom); Boyd, A.R.; Rockenfeller, O.; Schmitz, D.; Heuken, M. [AIXTRON AG, Kackertstr. 15-17, 52072 Aachen (Germany)

2008-07-01

Electroluminescence (EL) testing of Light Emitting Diode (LED) structures is usually done at the chip level. Assessing the optical and electrical properties of LED structures at the wafer scale prior to their processing would improve the cost effectiveness of producing LED-lamps. A non-destructive method for studying the luminescence properties of the structure at the wafer-scale is photoluminescence (PL). However, the relationship between the on-wafer PL data and the final device EL can be less than straightforward (Y. H Aliyu et al., Meas. Sci. Technol. 8, 437 (1997)) as the two techniques employ different carrier injection mechanisms. This paper provides an overview of some different techniques in which palladium is used as a contact in order to obtain on-wafer electroluminescence information which could be used to screen wafers prior to processing into final devices. Quick mapping of the electrical and optical characteristics was performed using either palladium needle electrodes directly, or using the latter in conjunction with evaporated palladium contacts to inject both electrons and holes into the active region via the p-type capping layer of the structure. For comparison, indium was also used to make contact to the n-layer so that electrons could be directly injected into that layer. (copyright 2008 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

Development and Performance Assessment of White LED Dimmer

Science.gov (United States)

Maiti, Pradip Kr.; Roy, Biswanath

2017-10-01

A microcontroller based electronic dimmer is developed using pulse width modulation technique. This dimmer is controllable by infra-red remote within a distance of 4 m and can be electrically connected between LED module and its driver. The performance of a developed LED dimmer is assessed on basis of variation of the photometric parameters of commercially available warm white and cool white LED luminaire used in indoor lighting applications. Four equally spaced dimming levels are considered to measure luminous efficacy, spectral power distribution, CIE 1931 chromaticity coordinates, CIE 1976 CIELUV color difference, correlated color temperature, general color rendering index and one specific color rendering index for saturated red color sample. Variations of above parameters are found out with reference to the values measured at rated voltage without the developed dimmer. Analysis of experimentally measured data shows that the developed LED dimmer is capable to vary light output of the WLED luminaire within a range of 25-100% without appreciable variation of its photometric and color parameters. The only exception is observed for the luminous efficacy parameter where it shows about 17 and 14.7% reduction for warm white and cool white LED luminaire at 25% dimming level.

Chip-to-chip SnO2 nanowire network sensors for room temperature H2 detection

Science.gov (United States)

Köck, A.; Brunet, E.; Mutinati, G. C.; Maier, T.; Steinhauer, S.

2012-06-01

The employment of nanowires is a very powerful strategy to improve gas sensor performance. We demonstrate a gas sensor device, which is based on silicon chip-to-chip synthesis of ultralong tin oxide (SnO2) nanowires. The sensor device employs an interconnected SnO2 nanowire network configuration, which exhibits a huge surface-to-volume ratio and provides full access of the target gas to the nanowires. The chip-to-chip SnO2 nanowire device is able to detect a H2 concentration of only 20 ppm in synthetic air with ~ 60% relative humidity at room temperature. At an operating temperature of 300°C a concentration of 50 ppm H2 results in a sensitivity of 5%. At this elevated temperature the sensor shows a linear response in a concentration range between 10 ppm and 100 ppm H2. The SnO2-nanowire fabrication procedure based on spray pyrolysis and subsequent annealing is performed at atmospheric pressure, requires no vacuum and allows upscale of the substrate to a wafer size. 3D-integration with CMOS chips is proposed as viable way for practical realization of smart nanowire based gas sensor devices for the consumer market.

ChIP on SNP-chip for genome-wide analysis of human histone H4 hyperacetylation

Directory of Open Access Journals (Sweden)

Porter Christopher J

2007-09-01

Full Text Available Abstract Background SNP microarrays are designed to genotype Single Nucleotide Polymorphisms (SNPs. These microarrays report hybridization of DNA fragments and therefore can be used for the purpose of detecting genomic fragments. Results Here, we demonstrate that a SNP microarray can be effectively used in this way to perform chromatin immunoprecipitation (ChIP on chip as an alternative to tiling microarrays. We illustrate this novel application by mapping whole genome histone H4 hyperacetylation in human myoblasts and myotubes. We detect clusters of hyperacetylated histone H4, often spanning across up to 300 kilobases of genomic sequence. Using complementary genome-wide analyses of gene expression by DNA microarray we demonstrate that these clusters of hyperacetylated histone H4 tend to be associated with expressed genes. Conclusion The use of a SNP array for a ChIP-on-chip application (ChIP on SNP-chip will be of great value to laboratories whose interest is the determination of general rules regarding the relationship of specific chromatin modifications to transcriptional status throughout the genome and to examine the asymmetric modification of chromatin at heterozygous loci.

Simulating the Effect of Modulated Tool-Path Chip Breaking On Surface Texture and Chip Length

Energy Technology Data Exchange (ETDEWEB)

Smith, K.S.; McFarland, J.T.; Tursky, D. A.; Assaid, T. S.; Barkman, W. E.; Babelay, Jr., E. F.

2010-04-30

One method for creating broken chips in turning processes involves oscillating the cutting tool in the feed direction utilizing the CNC machine axes. The University of North Carolina at Charlotte and the Y-12 National Security Complex have developed and are refining a method to reliably control surface finish and chip length based on a particular machine's dynamic performance. Using computer simulations it is possible to combine the motion of the machine axes with the geometry of the cutting tool to predict the surface characteristics and map the surface texture for a wide range of oscillation parameters. These data allow the selection of oscillation parameters to simultaneously ensure broken chips and acceptable surface characteristics. This paper describes the machine dynamic testing and characterization activities as well as the computational method used for evaluating and predicting chip length and surface texture.

Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects

International Nuclear Information System (INIS)

Sangirov Jamshid; Ukaegbu Ikechi Augustine; Lee Tae-Woo; Park Hyo-Hoon; Sangirov Gulomjon

2013-01-01

A power-aware transceiver for half-duplex bidirectional chip-to-chip optical interconnects has been designed and fabricated in a 0.13 μm complementary metal–oxide–semiconductor (CMOS) technology. The transceiver can detect the presence and absence of received signals and saves 55% power in Rx enabled mode and 45% in Tx enabled mode. The chip occupies an area of 1.034 mm 2 and achieves a 3-dB bandwidth of 6 GHz and 7 GHz in Tx and Rx modes, respectively. The disabled outputs for the Tx and Rx modes are isolated with 180 dB and 139 dB, respectively, from the enabled outputs. Clear eye diagrams are obtained at 4.25 Gbps for both the Tx and Rx modes. (semiconductor integrated circuits)

Design and measurements of low power multichannel chip for recording and stimulation of neural activity.

Science.gov (United States)

Zoladz, M; Kmon, P; Grybos, P; Szczygiel, R; Kleczek, R; Otfinowski, P; Rauza, J

2012-01-01

A 64-channel Neuro-Stimulation-Recording chip named NRS64 for neural activity measurements has been designed and tested. The NRS64 occupies 5×5 mm² of silicon area and consumes only 25 µW/channel. A low cut-off frequency can be tuned in the 60 mHz-100 Hz range while a high cut-off frequency can be set to 4.7 kHz or 12 kHz. A voltage gain can be set to 139 V/V or 1100 V/V. A measured input referenced noise is 3.7 µV rms in 100 Hz-12 kHz band and 7.6 µV rms in 3 Hz-12 kHz band. A digital correction is used in each channel to tune the low cut-off frequency and offset voltage. Each channel is equipped additionally with a stimulation circuit with an artifact cancellation circuit. The stimulation circuit can be set with 8-bit resolution in six different ranges from 500 nA-512 µA range.

Integration of Curved D-Type Optical Fiber Sensor with Microfluidic Chip.

Science.gov (United States)

Sun, Yung-Shin; Li, Chang-Jyun; Hsu, Jin-Cherng

2016-12-30

A curved D-type optical fiber sensor (OFS) combined with a microfluidic chip is proposed. This OFS, based on surface plasmon resonance (SPR) of the Kretchmann's configuration, is applied as a biosensor to measure the concentrations of different bio-liquids such as ethanol, methanol, and glucose solutions. The SPR phenomenon is attained by using the optical fiber to guide the light source to reach the side-polished, gold-coated region. Integrating this OFS with a polymethylmethacrylate (PMMA)-based microfluidic chip, the SPR spectra for liquids with different refractive indices are recorded. Experimentally, the sensitivity of the current biosensor was calculated to be in the order of 10 -5 RIU. This microfluidic chip-integrated OFS could be valuable for monitoring subtle changes in biological samples such as blood sugar, allergen, and biomolecular interactions.

130 LPW 1000 Lm Warm White LED for Illumination

Energy Technology Data Exchange (ETDEWEB)

Soer, Wouter [Philips Lumileds Lighting Company LLC, San Jose, CA (United States)

2012-12-21

An illumination-grade warm-white LED, having correlated color temperature (CCT) between 2700 and 3500 K and capable of producing 1000 lm output at over 130 lm/W at room temperature, has been developed in this program. The high-power warm-white LED is an ideal source for use in indoor and outdoor lighting applications. Over the two year period, we have made the following accomplishments: • Developed a low-cost high-power white LED package and commercialized a series of products with CCT ranging from 2700 to 5700 K under the product name LUXEON M; • Demonstrated a record efficacy of 124.8 lm/W at a flux of 1023 lm, CCT of 3435 K and color rendering index (CRI) over 80 at room temperature in the productized package; • Demonstrated a record efficacy of 133.1 lm/W at a flux of 1015 lm, CCT of 3475 K and CRI over 80 at room temperature in an R&D package. The new high-power LED package is a die-on-ceramic surface mountable LED package. It has four 2 mm2 InGaN pump dice, flip-chip attached to a ceramic submount in a 2x2 array configuration. The submount design utilizes a design approach that combines a high-thermal- conductivity ceramic core for die attach and a low-cost and low-thermal-conductivity ceramic frame for mechanical support and as optical lens carrier. The LED package has a thermal resistance of less than 1.25 K/W. The white LED fabrication also adopts a new batch level (instead of die-by-die) phosphor deposition process with precision layer thickness and composition control, which provides not only tight color control, but also low cost. The efficacy performance goal was achieved through the progress in following key areas: (1) high-efficiency royal blue pump LED development through active region design and epitaxial growth quality improvement (funded by internal programs); (2) improvement in extraction efficiency from the LED package through improvement of InGaN-die-level and package-level optical extraction efficiency; and (3) improvement in phosphor

Multipass comminution process to produce precision wood particles of uniform size and shape with disrupted grain structure from wood chips

Science.gov (United States)

Dooley, James H; Lanning, David N

2014-05-27

A process of comminution of wood chips (C) having a grain direction to produce a mixture of wood particles (P), wherein the wood chips are characterized by an average length dimension (L.sub.C) as measured substantially parallel to the grain, an average width dimension (W.sub.C) as measured normal to L.sub.C and aligned cross grain, and an average height dimension (H.sub.C) as measured normal to W.sub.C and L.sub.C, and wherein the comminution process comprises the step of feeding the wood chips in a direction of travel substantially randomly to the grain direction one or more times through a counter rotating pair of intermeshing arrays of cutting discs (D) arrayed axially perpendicular to the direction of wood chip travel.

Experiment list: SRX485203 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346544: Rhino ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq ...source_name=Rhino ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult ||... Sex=female || tissue=ovary || germline knock-down=control || chip antibody=custo

Experiment list: SRX485202 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346543: Rhino ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq ...source_name=Rhino ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult ||... Sex=female || tissue=ovary || germline knock-down=control || chip antibody=custo

Experiment list: SRX485210 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 6551: Deadlock ChIP from deadlock germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name...=Deadlock ChIP from deadlock germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=deadlock || chip antibody=custom-made

Experiment list: SRX485211 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346552: Cutoff ChIP from control germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=...Cutoff ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female... || tissue=ovary || germline knock-down=control || chip antibody=custom-made rabb

Highly efficient and reliable high power LEDs with patterned sapphire substrate and strip-shaped distributed current blocking layer

Energy Technology Data Exchange (ETDEWEB)

Zhou, Shengjun [School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072 (China); State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Yuan, Shu; Liu, Yingce [Quantum Wafer Inc., Foshan 528251 (China); Guo, L. Jay [Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109 (United States); Liu, Sheng, E-mail: victor_liu63@126.com [School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072 (China); Ding, Han [State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China)

2015-11-15

Graphical abstract: - Highlights: • TEM is used to characterize threading dislocation existing in GaN epitaxial layer. • Effect of threading dislocation on optical and electrical of LEDs is discussed. • Strip-shaped SiO{sub 2} DCBL is designed to improve current spreading performance of LEDs. - Abstract: We demonstrated that the improvement in optical and electrical performance of high power LEDs was achieved using cone-shaped patterned sapphire substrate (PSS) and strip-shaped SiO{sub 2} distributed current blocking layer (DCBL). We found through transmission electron microscopy (TEM) observation that densities of both the screw dislocation and edge dislocation existing in GaN epitaxial layer grown on PSS were much less than that of GaN epitaxial layer grown on flat sapphire substrate (FSS). Compared to LED grown on FSS, LED grown on PSS showed higher sub-threshold forward-bias voltage and lower reverse leakage current, resulting in an enhancement in device reliability. We also designed a strip-shaped SiO{sub 2} DCBL beneath a strip-shaped p-electrode, which prevents the current from being concentrated on regions immediately adjacent the strip-shaped p-electrode, thereby facilitating uniform current spreading into the active region. By implementing strip-shaped SiO{sub 2} DCBL, light output power of high power PSS-LED chip could be further increased by 13%.

High colour purity single-phased full colour emitting white LED phosphor Sr2V2O7:Eu3+

International Nuclear Information System (INIS)

Zhou Zhi; Zhou Nan; He Zhangxing; Liu Suqin; Liu Younian; Tian Ziwei; Wang Nanfang; Mao Zhiyong; Hintzen, H T

2013-01-01

Single-phased white-light-emitting phosphor Sr 2 V 2 O 7 :Eu 3+ was successfully synthesized by the solid-state method. The result of x-ray diffraction analysis indicated that the obtained phosphor has the same crystal structure as that of Sr 2 V 2 O 7 . The synthesized Sr 2 V 2 O 7 :Eu 3+ was combined with near-UV light (365 nm) chips and then assembled into ligtht-emitting diodes (LED) devices, which generated white light with colour coordinates of (0.324, 0.317). The white light was generated from yellow-green and red emissions, which should be attributed to the host Sr 2 V 2 O 7 and dopant Eu ions, respectively. The effects of the concentration of Eu ions and charge compensation on the emission intensity were carefully investigated. The results show that the energy migrates from the host to the dopant and also that Li 2 CO 3 should be the best charge compensator for this single-phased phosphor. In addition, the colour rendering index and luminescence efficiency of the fabricated LED devices with Sr 1.90 V 2 O 7 :0.10Eu 3+ phosphor were 91 and 32 lm W -1 , respectively, suggesting that Sr 1.90 V 2 O 7 :0.10Eu 3+ phosphor is a potential candidate for the phosphor-converted white-light-emitting diodes with near-UV chips.

Measurement of low-LET radiation dose aboard the chinese scientific experiment satellite (1988) by highly sensitive LiF (Mg, Cu, P) TL chips

International Nuclear Information System (INIS)

Zhang Zhonglun; Zheng Yanzhen.

1989-01-01

Low-LET radiation dose is an important portion of spaceflight dose. It is a new application that highly sensitive LiF(Mg, Cu, P) TL chips are used in measurement of low-LET dose aboard the chinese scientific experiment satellite. Avarage dose rate in satellite is 9.2 mrad/day and on the ground is about 0.32 mrad/day

Influence of passivation process on chip performance

NARCIS (Netherlands)

Lu, J.; Kovalgin, Alexeij Y.; Schmitz, Jurriaan

2009-01-01

In this work, we have studied the performance of CMOS chips before and after a low temperature post-processing step. In order to prevent damage to the IC chips by the post-processing steps, a first passivation layers is needed on top of the IC chips. Two different passivation layer deposition

Experiment list: SRX485205 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 46546: Rhino ChIP from deadlock germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=R...hino ChIP from deadlock germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female ...|| tissue=ovary || germline knock-down=deadlock || chip antibody=custom-made rabb

Experiment list: SRX485212 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346553: Cutoff ChIP from cutoff germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=C...utoff ChIP from cutoff germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female |...| tissue=ovary || germline knock-down=cutoff || chip antibody=custom-made rabbit

Experiment list: SRX485206 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346547: Rhino ChIP from cutoff germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=Rh...ino ChIP from cutoff germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female || ...tissue=ovary || germline knock-down=cutoff || chip antibody=custom-made rabbit po

Experiment list: SRX485209 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346550: Deadlock ChIP from control germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_nam...e=Deadlock ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=control || chip antibody=custom-made

The use of forest chips in Finland

International Nuclear Information System (INIS)

Hakkila, P.

2001-01-01

International commitments require the industrial world to restrict their greenhouse gas emissions. In Finland, where the annual timber cut per capita is more than ten times the average cut in the other EU countries, the primary means to reduce CO 2 emissions is to replace fossil fuels with forest biomass. The annual consumption of wood-based energy corresponds to 6 million tonnes of oil equivalent (toe) or almost 20% of the total primary energy consumption. The goal is to rise the annual production of wood-based energy to 7.8 million toe by 2010. Substantial part of the targeted increase could be obtained by forest chips produced of unmerchantable small-diameter trees and logging residues. The goal for 2010 is to use 5 million solid m 3 of forest chips, which equals to 0.9 million toe. The use of forest chips is increasing. About 474 000 solid m 3 of forest chips were used as fuel in 1999. At the moment, the growth is rapid especially in cogeneration plants producing both heat and electricity. The growth is based primarily on chips obtained from logging residues. The price of forest chips decreased considerably during the 1990s but the price range remained wide. Chips made of logging residues are cheaper than those made of small trees. The average price of forest chips at the plant, VAT excluded, is about 53 FIM per MWh. In Sweden, the average price is more than 40% higher

Construction and test of the first Belle II SVD ladder implementing the origami chip-on-sensor design

International Nuclear Information System (INIS)

Irmler, C.; Bauer, A.; Bergauer, T.; Adamczyk, K.; Bacher, S.; Aihara, H.; Angelini, C.; Batignani, G.; Bettarini, S.; Bosi, F.; Aziz, T.; Babu, V.; Bahinipati, S.; Barberio, E.; Baroncelli, Ti.; Baroncelli, To.; Basith, A.K.; Behera, P.K.; Bhuyan, B.; Bilka, T.

2016-01-01

The Belle II Silicon Vertex Detector comprises four layers of double-sided silicon strip detectors (DSSDs), consisting of ladders with two to five sensors each. All sensors are individually read out by APV25 chips with the Origami chip-on-sensor concept for the central DSSDs of the ladders. The chips sit on flexible circuits that are glued on the top of the sensors. This concept allows a low material budget and an efficient cooling of the chips by a single pipe per ladder. We present the construction of the first SVD ladders and results from precision measurements and electrical tests

Precise delay measurement through combinatorial logic

Science.gov (United States)

Burke, Gary R. (Inventor); Chen, Yuan (Inventor); Sheldon, Douglas J. (Inventor)

2010-01-01

A high resolution circuit and method for facilitating precise measurement of on-chip delays for FPGAs for reliability studies. The circuit embeds a pulse generator on an FPGA chip having one or more groups of LUTS (the "LUT delay chain"), also on-chip. The circuit also embeds a pulse width measurement circuit on-chip, and measures the duration of the generated pulse through the delay chain. The pulse width of the output pulse represents the delay through the delay chain without any I/O delay. The pulse width measurement circuit uses an additional asynchronous clock autonomous from the main clock and the FPGA propagation delay can be displayed on a hex display continuously for testing purposes.

Design of the control system for full-color LED display based on MSP430 MCU

Science.gov (United States)

Li, Xue; Xu, Hui-juan; Qin, Ling-ling; Zheng, Long-jiang

2013-08-01

The LED display incorporate the micro electronic technique, computer technology and information processing as a whole, it becomes the most preponderant of a new generation of display media with the advantages of bright in color, high dynamic range, high brightness and long operating life, etc. The LED display has been widely used in the bank, securities trading, highway signs, airport and advertising, etc. According to the display color, the LED display screen is divided into monochrome screen, double color display and full color display. With the diversification of the LED display's color and the ceaseless rise of the display demands, the LED display's drive circuit and control technology also get the corresponding progress and development. The earliest monochrome screen just displaying Chinese characters, simple character or digital, so the requirements of the controller are relatively low. With the widely used of the double color LED display, the performance of its controller will also increase. In recent years, the full color LED display with three primary colors of red, green, blue and grayscale display effect has been highly attention with its rich and colorful display effect. Every true color pixel includes three son pixels of red, green, blue, using the space colour mixture to realize the multicolor. The dynamic scanning control system of LED full-color display is designed based on MSP430 microcontroller technology of the low power consumption. The gray control technology of this system used the new method of pulse width modulation (PWM) and 19 games show principle are combining. This method in meet 256 level grayscale display conditions, improves the efficiency of the LED light device, and enhances the administrative levels feels of the image. Drive circuit used 1/8 scanning constant current drive mode, and make full use of the single chip microcomputer I/O mouth resources to complete the control. The system supports text, pictures display of 256 grayscale

Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package

International Nuclear Information System (INIS)

Wang, Jing; Zhao, Xin-Jie; Cai, Yi-Xi; Zhang, Chun; Bao, Wei-Wei

2015-01-01

Highlights: • A novel TEC cooling system for multi-chip LED module was successfully developed. • Influences of liquid velocity on the system thermal performance were investigated. • TEC system is more sensitive to the input current than that of the mere air cooling. • The junction temperature can be maintained below 61.8 °C (liquid cooling & TEC). - Abstract: In view of the characteristics of high power light-emitting diodes (LEDs), such as strict junction temperature (T j ) control, the enhanced cooling models based on the thermoelectric cooler (TEC) were presented to meet the thermal demand of high-power LED headlight. The cooling performance of different devices (air cooling & TEC, liquid cooling & TEC) was evaluated and compared by measuring the LED case temperature. Details of the heat transfer performance, particularly, the start-up performances of the TEC cooler, as well as the influence of the fan rotate speed or liquid velocity on the system thermal performance were obtained. It was found that the thermal performance had been elevated dramatically due to the reduction of the hot side temperature, and the thermoelectric cooler was more sensitive to the external fan speed or liquid velocity than purely air cooling or liquid cooling. In addition, the optimal current for air cooling & TEC was 3A, and 5A for liquid cooling + TEC. Investigations of the simulated ambient temperature on junction temperature, forward voltage, and output light were conducted. Results indicated that the case temperature changed linear basically with the increase in heating power or the simulated ambient temperature. When the ambient temperature was within its severe level (60–65 °C), the junction temperature could be calculated to 59.5 °C, and the corresponding output light was 1607.3 lm

Children with Special Health Care Needs in CHIP: Access, Use, and Child and Family Outcomes.

Science.gov (United States)

Zickafoose, Joseph S; Smith, Kimberly V; Dye, Claire

2015-01-01

To assess how the Children's Health Insurance Program (CHIP) affects outcomes for children with special health care needs (CSHCN). We used data from a survey of parents of recent and established CHIP enrollees conducted from January 2012 through March 2013 as part of a congressionally mandated evaluation of CHIP. We identified CSHCN in the sample using the Child and Adolescent Health Measurement Initiative's CSHCN screener. We compared the health care experiences of established CHIP enrollees to the pre-enrollment experiences of previously uninsured and privately insured recent CHIP enrollees, controlling for observable characteristics. Parents of 4142 recent enrollees and 5518 established enrollees responded to the survey (response rates, 46% recent enrollees and 51% established enrollees). In the 10 survey states, about one-fourth of CHIP enrollees had a special health care need. Compared to being uninsured, parents of CSHCN who were established CHIP enrollees reported greater access to and use of medical and dental care, less difficulty meeting their child's health care needs, fewer unmet needs, and better dental health status for their child. Compared to having private insurance, parents of CSHCN who were established CHIP enrollees reported similar levels of access to and use of medical and dental care and unmet needs, and less difficulty meeting their child's health care needs. CHIP has significant benefits for eligible CSHCN and their families compared to being uninsured and appears to have some benefits compared to private insurance. Copyright © 2015 Academic Pediatric Association. All rights reserved.

Experiment list: SRX485220 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 53 GSM1346561: RNA Polymerase II ChIP from rhino germline knock-down ovaries; Drosophila melanogaster; ChIP-...Seq source_name=RNA Polymerase II ChIP from rhino germline knock-down ovaries || developmental stage=4-6 day...s old adult || Sex=female || tissue=ovary || germline knock-down=rhino || chip an

Experiment list: SRX485204 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346545: Rhino ChIP from rhino germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=Rhi...no ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female || ti...ssue=ovary || germline knock-down=rhino || chip antibody=custom-made rabbit polyc

Experiment list: SRX485208 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 346549: Rhino ChIP from piwi germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq sou...rce_name=Rhino ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=piwi || chip antibody=custom-made ra

Pre-clinical evaluation of OxyChip for long-term EPR oximetry.

Science.gov (United States)

Hou, Huagang; Khan, Nadeem; Gohain, Sangeeta; Kuppusamy, M Lakshmi; Kuppusamy, Periannan

2018-03-16

Tissue oxygenation is a critical parameter in various pathophysiological situations including cardiovascular disease and cancer. Hypoxia can significantly influence the prognosis of solid malignancies and the efficacy of their treatment by radiation or chemotherapy. Electron paramagnetic resonance (EPR) oximetry is a reliable method for repeatedly assessing and monitoring oxygen levels in tissues. Lithium octa-n-butoxynaphthalocyanine (LiNc-BuO) has been developed as a probe for biological EPR oximetry, especially for clinical use. However, clinical applicability of LiNc-BuO crystals is hampered by potential limitations associated with biocompatibility, biodegradation, or migration of individual bare crystals in tissue. To overcome these limitations, we have embedded LiNc-BuO crystals in polydimethylsiloxane (PDMS), an oxygen-permeable biocompatible polymer and developed an implantable/retrievable form of chip, called OxyChip. The chip was optimized for maximum spin density (40% w/w of LiNc-BuO in PDMS) and fabricated in a form suitable for implantation using an 18-G syringe needle. In vitro evaluation of the OxyChip showed that it is robust and highly oxygen sensitive. The dependence of its EPR linewidth to oxygen was linear and highly reproducible. In vivo efficacy of the OxyChip was evaluated by implanting it in rat femoris muscle and following its response to tissue oxygenation for up to 12 months. The results revealed preservation of the integrity (size and shape) and calibration (oxygen sensitivity) of the OxyChip throughout the implantation period. Further, no inflammatory or adverse reaction around the implantation area was observed thereby establishing its biocompatibility and safety. Overall, the results demonstrated that the newly-fabricated high-sensitive OxyChip is capable of providing long-term measurements of oxygen concentration in a reliable and repeated manner under clinical conditions.

METAL CHIP HEATING PROCESS INVESTIGATION (Part I

Directory of Open Access Journals (Sweden)

O. M. Dyakonov

2007-01-01

Full Text Available The main calculation methods for heat- and mass transfer in porous heterogeneous medium have been considered. The paper gives an evaluation of the possibility to apply them for calculation of metal chip heating process. It has been shown that a description of transfer processes in a chip has its own specific character that is attributed to difference between thermal and physical properties of chip material and lubricant-coolant components on chip surfaces. It has been determined that the known expressions for effective heat transfer coefficients can be used as basic ones while approaching mutually penetrating continuums. A mathematical description of heat- and mass transfer in chip medium can be considered as a basis of mathematical modeling, numerical solution and parameter optimization of the mentioned processes.

A contact-lens-shaped IC chip technology

International Nuclear Information System (INIS)

Liu, Ching-Yu; Yang, Frank; Teng, Chih-Chiao; Fan, Long-Sheng

2014-01-01

We report on novel contact-lens-shaped silicon integrated circuit chip technology for applications such as forming a conforming retinal prosthesis. This is achieved by means of patterning thin films of high residual stress on top of a shaped thin silicon substrate. Several strategies are employed to achieve curvatures of various amounts. Firstly, high residual stress on a thin film makes a thin chip deform into a designed three-dimensional shape. Also, a series of patterned stress films and ‘petal-shaped’ chips were fabricated and analyzed. Large curvatures can also be formed and maintained by the packaging process of bonding the chips to constraining elements such as thin-film polymer ring structures. As a demonstration, a complementary metal oxide semiconductor transistor (CMOS) image-sensing retina chip is made into a contact-lens shape conforming to a human eyeball 12.5 mm in radius. This non-planar and flexible chip technology provides a desirable device surface interface to soft tissues or non-planar bio surfaces and opens up many other possibilities for biomedical applications. (paper)

Person-centred care in nurse-led outpatient rheumatology clinics: Conceptualization and initial development of a measurement instrument.

Science.gov (United States)

Bala, Sidona-Valentina; Forslind, Kristina; Fridlund, Bengt; Samuelson, Karin; Svensson, Björn; Hagell, Peter

2018-06-01

Person-centred care (PCC) is considered a key component of effective illness management and high-quality care. However, the PCC concept is underdeveloped in outpatient care. In rheumatology, PCC is considered an unmet need and its further development and evaluation is of high priority. The aim of the present study was to conceptualize and operationalize PCC, in order to develop an instrument for measuring patient-perceived PCC in nurse-led outpatient rheumatology clinics. A conceptual outpatient PCC framework was developed, based on the experiences of people with rheumatoid arthritis (RA), person-centredness principles and existing PCC frameworks. The resulting framework was operationalized into the PCC instrument for outpatient care in rheumatology (PCCoc/rheum), which was tested for acceptability and content validity among 50 individuals with RA attending a nurse-led outpatient clinic. The conceptual framework focuses on the meeting between the person with RA and the nurse, and comprises five interrelated domains: social environment, personalization, shared decision-making, empowerment and communication. Operationalization of the domains into a pool of items generated a preliminary PCCoc/rheum version, which was completed in a mean (standard deviation) of 5.3 (2.5) min. Respondents found items easy to understand (77%) and relevant (93%). The Content Validity Index of the PCCoc/rheum was 0.94 (item level range, 0.87-1.0). About 80% of respondents considered some items redundant. Based on these results, the PCCoc/rheum was revised into a 24-item questionnaire. A conceptual outpatient PCC framework and a 24-item questionnaire intended to measure PCC in nurse-led outpatient rheumatology clinics were developed. The extent to which the questionnaire represents a measurement instrument remains to be tested. Copyright © 2018 John Wiley & Sons, Ltd.

Wood chip delivery and research project at Mikkeli region

International Nuclear Information System (INIS)

Saksa, T.; Auvinen, P.

1995-01-01

In 1994, a large-scale energywood production chain was started as a co-operation project by the Mikkeli city forest office and local forestry societies. Over 60 000 m 3 (about 46 000 MWh of energy) of forest processed chips were delivered to Pursiala heat and power plant in Mikkeli. About 60 % of these chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 51 FIM/m 3 (68 FIM/MWh) for the whole tree chips and 40 FIM/m 3 (53 FIM/MWh) for logging waste chips. The delivery costs of wood chips could compete with those of fuel peat only in the most favourable cases. The resources of forest processed chips were studied on the basis of forestry plans. According to the study, there is enough raw material for permanent, large-scale delivery of forest processed chips (up to 250 000 m 3 /a) in the forests located at a distance of under 40 road kilometers from the Pursiala heat and power plant. The following project stages will involve further development of the wood chip delivery chain logistics, as well as improvement of logging and chipping equipment and methods in energywood and logging waste production. Also the effects of wood energy production on the economy and environment of the whole Mikkeli region will be studied. (author)

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

Directory of Open Access Journals (Sweden)

Niina Halonen

2016-11-01

Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Preliminary investigations of piezoelectric based LED luminary

DEFF Research Database (Denmark)

Nielsen, Dennis; Andersen, Michael A. E.; Meyer, Kaspar Sinding

2011-01-01

, modulation schemes, LEDs and LED driving conditions are analyzed. A prototype radial mode PT optimized for ZVS (Zero Voltage Switching) is designed. FEM (Final Element Method) and measurements validates the PT design. A prototype PT based AC/DC converter operating from european mains is proposed......This paper presents a preliminary study of PT (Piezoelectric Transformer) based SMPS’s (Switch Mode Power Supplies) for LED luminary. The unique properties of PTs (efficiency, power density and EMI) make them highly suitable for this application. Power stage topologies, rectifiers circuits...

Optimization of high frequency flip-chip interconnects for digital superconducting circuits

International Nuclear Information System (INIS)

Rafique, M R; Engseth, H; Kidiyarova-Shevchenko, A

2006-01-01

This paper presents the results of theoretical optimization of the multi-chip-module (MCM) contact and driver circuitries for gigabit chip-to-chip communication. Optimization has been done using 3D electromagnetic (EM) simulations of MCM contacts and time domain simulations of drivers and receivers. A single optimized MCM contact has a signal reflection of less than -20 dB for more than 400 GHz bandwidth. The MCM data link with the optimized SFQ driver, receiver and two MCM contacts has operational margins on the global bias current of ± 30% at 30 Gbit s -1 speedand can operate above 100 Gbit s -1 speed. Wide bandwidth transmission requires the realization of an advanced flip-chip process with a small dimension of the MCM contact (less than 30 μm diameter of the contact pad) and small height of the flip-chip contact bumps of the order of 2 μm. Current processes with about 7 μm height of the bumps require the application of a double-flux-quantum (DFQ) driver. The data link with the DFQ driver was also simulated. It has operational margins on the global bias current of ± 30% at 30 Gbit s -1 ; however, the maximum speed of operation is 61 Gbit s -1 . Several test structures have been designed for measurements of signal reflection, bit error rate and operational margins of the data link

Experiment list: SRX485222 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 4me2 ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_na...me=H3K4me2 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=control || chip antibody=Anti-dimethy

Experiment list: SRX485221 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available K4me2 ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_n...ame=H3K4me2 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=control || chip antibody=Anti-dimeth

Integration of Curved D-Type Optical Fiber Sensor with Microfluidic Chip

Directory of Open Access Journals (Sweden)

Yung-Shin Sun

2016-12-01

Full Text Available A curved D-type optical fiber sensor (OFS combined with a microfluidic chip is proposed. This OFS, based on surface plasmon resonance (SPR of the Kretchmann’s configuration, is applied as a biosensor to measure the concentrations of different bio-liquids such as ethanol, methanol, and glucose solutions. The SPR phenomenon is attained by using the optical fiber to guide the light source to reach the side-polished, gold-coated region. Integrating this OFS with a polymethylmethacrylate (PMMA-based microfluidic chip, the SPR spectra for liquids with different refractive indices are recorded. Experimentally, the sensitivity of the current biosensor was calculated to be in the order of 10−5 RIU. This microfluidic chip-integrated OFS could be valuable for monitoring subtle changes in biological samples such as blood sugar, allergen, and biomolecular interactions.

Exposure rate measurements on TV monitors LiF:Mg, Cu, P (GR- 200A) chips

International Nuclear Information System (INIS)

Sanaye, S.S.; Sadagopan, Geetha; Bhatt, B.C.

2004-01-01

For measuring exposure rate on black and white TV monitor screen, LiF:Mg,Cu,P (GR-200A) TLD chips were used. The samples were kept on TV monitor screen and exposed for 560 hrs with TV in 'ON' condition. The exposure rate on TV monitor screen was determined from integrated TL measurements and it varied from 0.081μGy/hr to 0.106 μGy/hr. Thus it was observed that the exposure levels were well below the prescribed limits (i.e. 5 μGy/h at 5 cm from the surface). LiF:Mg,Cu,P (GR-200A) TLD discs were also used to estimate the dose level on the surface of two types of TV monitors. The samples were kept at five different locations on the two (14 C PT AND 20 C PT) models of TV monitors and exposed for 622 hrs. From the measurement of TL, integrated dose on the screen were in the range 3.86 mR to 12.34 mR, the corresponding dose rate being 6.206 mR/hr to 19.839 mR/hr. This ensures that doses were well below the recommended limit of 0.5 mR/hr at 5cm. (author)

A Baseband Ultra-Low Noise SiGe:C BiCMOS 0.25 µm Amplifier And Its Application For An On-Chip Phase-Noise Measurement Circuit

OpenAIRE

Godet , Sylvain; Tournier , Éric; Llopis , Olivier; Cathelin , Andreia; Juyon , Julien

2009-01-01

4 pages; International audience; The design and realization of an ultra-low noise operational amplifier is presented. Its applications are integrated low-frequency noise measurements in electronic devices and on-chip phase-noise measurement circuit. This paper discusses the SiGe:C BiCMOS 0.25 µm design improvements used for low noise applications. The proposed three-stage operational amplifier uses parallel bipolar transistor connection as input differential pair for low noise behavior. This ...

Rework of flip chip bonded radiation pixel detectors

International Nuclear Information System (INIS)

Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

2008-01-01

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

Rework of flip chip bonded radiation pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

2008-06-11

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

Multimedia-Based Chip Design Education.

Science.gov (United States)

Catalkaya, Tamer; Golze, Ulrich

This paper focuses on multimedia computer-based training programs on chip design. Their development must be fast and economical, in order to be affordable by technical university institutions. The self-produced teaching program Illusion, which demonstrates a monitor controller as an example of a small but complete chip design, was implemented to…

Reliability and validity of the Spanish version of the Child Health and Illness Profile (CHIP Child-Edition, Parent Report Form (CHIP-CE/PRF

Directory of Open Access Journals (Sweden)

Tebé Cristian

2010-08-01

Full Text Available Abstract Background The objectives of the study were to assess the reliability, and the content, construct, and convergent validity of the Spanish version of the CHIP-CE/PRF, to analyze parent-child agreement, and compare the results with those of the original U.S. version. Methods Parents from a representative sample of children aged 6-12 years were selected from 9 primary schools in Barcelona. Test-retest reliability was assessed in a convenience subsample of parents from 2 schools. Parents completed the Spanish version of the CHIP-CE/PRF. The Achenbach Child Behavioural Checklist (CBCL was administered to a convenience subsample. Results The overall response rate was 67% (n = 871. There was no floor effect. A ceiling effect was found in 4 subdomains. Reliability was acceptable at the domain level (internal consistency = 0.68-0.86; test-retest intraclass correlation coefficients = 0.69-0.85. Younger girls had better scores on Satisfaction and Achievement than older girls. Comfort domain score was lower (worse in children with a probable mental health problem, with high effect size (ES = 1.45. The level of parent-child agreement was low (0.22-0.37. Conclusions The results of this study suggest that the parent version of the Spanish CHIP-CE has acceptable psychometric properties although further research is needed to check reliability at sub-domain level. The CHIP-CE parent report form provides a comprehensive, psychometrically sound measure of health for Spanish children 6 to 12 years old. It can be a complementary perspective to the self-reported measure or an alternative when the child is unable to complete the questionnaire. In general, the results are similar to the original U.S. version.

Fiber-optic voltage measuring system

Science.gov (United States)

Ye, Miaoyuan; Nie, De-Xin; Li, Yan; Peng, Yu; Lin, Qi-Qing; Wang, Jing-Gang

1993-09-01

A new fibre optic voltage measuring system has been developed based on the electrooptic effect of bismuth germanium oxide (Bi4Ge3O12)crystal. It uses the LED as the light source. The light beam emitted from the light source is transmitted to the sensor through the optic fibre and the intensity of the output beam is changed by the applied voltage. This optic signal is transmitted to the PIN detector and converted to an electric signal which is processed by the electronic circuit and 8098 single chip microcomputer the output voltage signal obtained is directly proportional to the applied voltage. This paper describes the principle the configuration and the performance parameters of the system. Test results are evaluated and discussed.

Enhancement of heat dissipation of LED module with cupric-oxide composite coating on aluminum-alloy heat sink

International Nuclear Information System (INIS)

Kim, Donghyun; Lee, Junghoon; Kim, Junho; Choi, Chang-Hwan; Chung, Wonsub

2015-01-01

Highlights: • We fabricate the CuO/resin composite coating layer on aluminum alloy heat sink. • CuO/resin coating considerably improved the surface emissivity. • The LED junction temperature was reduced by CuO/resin coated heat sink. • The thermal resistance of heat sink was decreased by CuO/resin composite coating at 200 μm thickness. - Abstract: A composite coating composed of cupric oxide (CuO) and silicon-based resin was applied to an aluminum-alloy heat sink for a light emitting diode (LED) module. The purpose of the composite coating is to improve the heat dissipation performance of heat sink by enhancing thermal radiation emission. The heat dissipation performance was investigated in terms of LED junction temperature and thermal resistance using a thermal transient method. The CuO and silicon-based resin composite coating showed higher emissivity, and the lower junction temperature and thermal resistance of the heat sink was achieved. In addition, a continuous operation test of the LED chip with the heat sink revealed that the surface treated with the CuO composite coating stably dissipated heat without degradation. In conclusion, the composite coating proposed here showed a significant improvement of the heat dissipation performance of the aluminum-alloy heat sink due to the enhanced thermal radiation property.

Experiment list: SRX485218 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available K9me3 ChIP from piwi germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_name...=H3K9me3 ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female ...|| tissue=ovary || germline knock-down=piwi || chip antibody=Histone H3K9me3 anti

Experiment list: SRX485213 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available K9me3 ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_n...ame=H3K9me3 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=control || chip antibody=Histone H3K

Experiment list: SRX485214 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available K9me3 ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_n...ame=H3K9me3 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=control || chip antibody=Histone H3K

75 FR 16149 - Medicaid and CHIP Programs; Meeting of the CHIP Working Group-April 26, 2010

Science.gov (United States)

2010-03-31

... DEPARTMENT OF HEALTH AND HUMAN SERVICES Centers for Medicare & Medicaid Services [CMS-2312-N] DEPARTMENT OF LABOR Employee Benefits Security Administration Medicaid and CHIP Programs; Meeting of the CHIP Working Group-- April 26, 2010 AGENCIES: Centers for Medicare & Medicaid Services (CMS), Department of...

Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

CERN Document Server

AUTHOR|(SzGeCERN)756402

2017-01-01

The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial 180 nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of 128 × 128 square pixels with 25 μm pitch. The sensor chip has been produced with the standard value for the substrate resistivity (∼ 20 Ωcm) and it has been characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of ∼ 20 ns for a power consumption of 5 μW/pixel. Production of the C3PD HV-CMOS sensor chip with higher substrate resistivity wafers (∼ 20, 80, 200 and 1000 Ωcm) is foreseen. The expected benefits of the higher substrate resistivity will be studied using...

Comminution process to produce precision wood particles of uniform size and shape with disrupted grain structure from wood chips

Science.gov (United States)

Dooley, James H; Lanning, David N

2013-08-13

A process of comminution of wood chips (C) having a grain direction to produce a mixture of wood particles (P), wherein the wood chips are characterized by an average length dimension (L.sub.C) as measured substantially parallel to the grain, an average width dimension (W.sub.C) as measured normal to L.sub.C and aligned cross grain, and an average height dimension (H.sub.C) as measured normal to W.sub.C and L.sub.C, and wherein the comminution process comprises the step of feeding the wood chips in a direction of travel substantially randomly to the grain direction through a counter rotating pair of intermeshing arrays of cutting discs (D) arrayed axially perpendicular to the direction of wood chip travel, wherein the cutting discs have a uniform thickness (T.sub.D), and wherein at least one of L.sub.C, W.sub.C, and H.sub.C is greater than T.sub.D.

Analyses of test beam data for the ATLAS upgrade readout chip (ABC130)

Energy Technology Data Exchange (ETDEWEB)

Peschke, Richard [DESY, Hamburg (Germany); Collaboration: ATLAS-Collaboration

2015-07-01

As part of the ATLAS phase II upgrade it is planned to replace the current tracker with an all silicon tracker. The outer part of the new tracker will consist of silicon strip detectors. For the readout of the strip detector a new Analog to Binary Converter chip (ABC130) was designed. The chip is processed in the 130 nm technology. In laboratory measurements the preamplifier of the new ABC130 showed a significant lower gain than expected. From the measurements in the laboratory it was not possible to distinguish if the malfunction is in the preamplifier or in the test circuit. Therefore an unbiased test was mandatory. Among other measurements, one was a test beam campaign at the Stanford Linear Accelerator Collider (SLAC). The result of measurement is shown in the presentation.

Wood chips procurement and research project at the Mikkeli region; Puuhakkeen hankinta- ja tutkimusprojekti Mikkelin seudulla

Energy Technology Data Exchange (ETDEWEB)

Saksa, T [Finnish Forest Research Inst., Suonenjoki (Finland). Suonenjoki Research Station; Auvinen, P [Mikkeli city (Finland). Dept. of Agriculture and Forestry

1997-12-31

In 1993-94, a large-scale energywood production chain started as a co-operation project by the Mikkeli city forest office and local forestry societies. In 1995 over 115 000 m{sup 3} (about 85 000 MWh of energy) of wood chips were delivered to Pursiala heat and power plant in Mikkeli. About 75 % of these chips was forest processed chips. About 70 % of the forest processed chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 45 FIM/m{sup 3} (60 FIM/MWh) for the whole tree chips and 38 FIM/m{sup 3} (50 FIM/MWh) for logging waste chips. The delivery costs of forest processed chips could meet the target of Bioenergy Research Programme (45 FIM/MWh) only in the most favourable cases. In an average the delivery costs were about 9 FIM/MWh more than the price obtained when sold to the heat and power plant. However the wood chip production created 27 new jobs and the increase of income to the local economy was about 2.2 milj. FIM /year. The local communities got new tax revenue about 3 FIM/MWh. The gain for the forestry was approximated to be 5 - 6 FIM/MWh. The resources of forest processed chips were studied on the basis of stand measurements. According to the study the most remarkable energywood resources were in young thinning stands on Oxalis-Myrtillus and Myrtillus forest site types. On Oxalis-Myrtillus type almost every and on Myrtillus type every second stand included energywood more than 40 m{sup 3}/ha

Wood chips procurement and research project at the Mikkeli region; Puuhakkeen hankinta- ja tutkimusprojekti Mikkelin seudulla

Energy Technology Data Exchange (ETDEWEB)

Saksa, T. [Finnish Forest Research Inst., Suonenjoki (Finland). Suonenjoki Research Station; Auvinen, P. [Mikkeli city (Finland). Dept. of Agriculture and Forestry

1996-12-31

In 1993-94, a large-scale energywood production chain started as a co-operation project by the Mikkeli city forest office and local forestry societies. In 1995 over 115 000 m{sup 3} (about 85 000 MWh of energy) of wood chips were delivered to Pursiala heat and power plant in Mikkeli. About 75 % of these chips was forest processed chips. About 70 % of the forest processed chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 45 FIM/m{sup 3} (60 FIM/MWh) for the whole tree chips and 38 FIM/m{sup 3} (50 FIM/MWh) for logging waste chips. The delivery costs of forest processed chips could meet the target of Bioenergy Research Programme (45 FIM/MWh) only in the most favourable cases. In an average the delivery costs were about 9 FIM/MWh more than the price obtained when sold to the heat and power plant. However the wood chip production created 27 new jobs and the increase of income to the local economy was about 2.2 milj. FIM /year. The local communities got new tax revenue about 3 FIM/MWh. The gain for the forestry was approximated to be 5 - 6 FIM/MWh. The resources of forest processed chips were studied on the basis of stand measurements. According to the study the most remarkable energywood resources were in young thinning stands on Oxalis-Myrtillus and Myrtillus forest site types. On Oxalis-Myrtillus type almost every and on Myrtillus type every second stand included energywood more than 40 m{sup 3}/ha

Integration of organic LEDs with inorganic LEDs for a hybrid lighting system

Science.gov (United States)

Kong, H. J.; Park, J. W.; Kim, Y. M.

2013-01-01

We demonstrate that a surface-emitting hybrid light source can be realized by a combination of organic and inorganic light-emitting devices (LEDs). To this end, a blue inorganic LED bar is deployed at one side of a transparent light guide plate (LGP), and a yellow organic LED (OLED) is in contact with the rear surface of the LGP. In such a configuration, it is found that the overall luminance is almost equivalent to the sum of the luminances measured from each light source, and the overall luminance uniformity is determined mainly by the luminance uniformity of the OLED panel at high luminances. We have achieved a white color showing the Commission Internationale d'Eclairage (CIE) chromaticity coordinates of (x = 0.34, y = 0.33), the power efficiency of 9.3 lm/W, the luminance uniformity of 63% at the luminance of 3100 cd m-2, the color rendering index as high as 89.3, and the correlated color temperature finely tunable within the range between 3000 and 8000 K. Such a system facilitates color tuning by adjusting their luminous intensities and hence the implementation of the emotional lighting system.

Integration of organic LEDs with inorganic LEDs for a hybrid lighting system

International Nuclear Information System (INIS)

Kong, H J; Kim, Y M; Park, J W

2013-01-01

We demonstrate that a surface-emitting hybrid light source can be realized by a combination of organic and inorganic light-emitting devices (LEDs). To this end, a blue inorganic LED bar is deployed at one side of a transparent light guide plate (LGP), and a yellow organic LED (OLED) is in contact with the rear surface of the LGP. In such a configuration, it is found that the overall luminance is almost equivalent to the sum of the luminances measured from each light source, and the overall luminance uniformity is determined mainly by the luminance uniformity of the OLED panel at high luminances. We have achieved a white color showing the Commission Internationale d'Eclairage (CIE) chromaticity coordinates of (x = 0.34, y = 0.33), the power efficiency of 9.3 lm/W, the luminance uniformity of 63% at the luminance of 3100 cd m –2 , the color rendering index as high as 89.3, and the correlated color temperature finely tunable within the range between 3000 and 8000 K. Such a system facilitates color tuning by adjusting their luminous intensities and hence the implementation of the emotional lighting system. (paper)

Thermal behavior of a quantum dot nanocomposite as a color converting material and its application to white LED

Energy Technology Data Exchange (ETDEWEB)

Woo, Ju Yeon; Kim, Kyung Nam; Jeong, Sohee; Han, Chang-Soo, E-mail: cshan@kimm.re.kr [Nano-Mechanical Systems Research division, Korea Institute of Machinery and Materials (KIMM), Daejeon 305343 (Korea, Republic of)

2010-12-10

We present a novel nanocomposite, a mixture of a CdSe/CdS/ZnS red quantum dot (QD), an Sr{sub 2}SiO{sub 4}:Eu green phosphor and silicone resin for a color converting material. The temperature rise and the optical characteristics of the nanocomposite due to the addition of the QD have been investigated in terms of QD content ratio and the mixing components. The experimental results suggested that a small addition of QDs generated a large amount of heat during light conversion at the wavelength of QD emission. Considering the temperature rise in a nanocomposite, we applied 0.2 wt% QDs on an InGaN blue LED chip. As a result, we could achieve a white LED device with a high color rendering index of 83.2, a high luminance of 65.86 lm W{sup -1} and a moderate temperature increase of 94 deg. C. The white LED converted by the newly developed QD-phosphor nanocomposite has great potential in future illumination.

An AES chip with DPA resistance using hardware-based random order execution

International Nuclear Information System (INIS)

Yu Bo; Li Xiangyu; Chen Cong; Sun Yihe; Wu Liji; Zhang Xiangmin

2012-01-01

This paper presents an AES (advanced encryption standard) chip that combats differential power analysis (DPA) side-channel attack through hardware-based random order execution. Both decryption and encryption procedures of an AES are implemented on the chip. A fine-grained dataflow architecture is proposed, which dynamically exploits intrinsic byte-level independence in the algorithm. A novel circuit called an HMF (Hold-Match-Fetch) unit is proposed for random control, which randomly sets execution orders for concurrent operations. The AES chip was manufactured in SMIC 0.18 μm technology. The average energy for encrypting one group of plain texts (128 bits secrete keys) is 19 nJ. The core area is 0.43 mm 2 . A sophisticated experimental setup was built to test the DPA resistance. Measurement-based experimental results show that one byte of a secret key cannot be disclosed from our chip under random mode after 64000 power traces were used in the DPA attack. Compared with the corresponding fixed order execution, the hardware based random order execution is improved by at least 21 times the DPA resistance. (semiconductor integrated circuits)

An AES chip with DPA resistance using hardware-based random order execution

Science.gov (United States)

Bo, Yu; Xiangyu, Li; Cong, Chen; Yihe, Sun; Liji, Wu; Xiangmin, Zhang

2012-06-01

This paper presents an AES (advanced encryption standard) chip that combats differential power analysis (DPA) side-channel attack through hardware-based random order execution. Both decryption and encryption procedures of an AES are implemented on the chip. A fine-grained dataflow architecture is proposed, which dynamically exploits intrinsic byte-level independence in the algorithm. A novel circuit called an HMF (Hold-Match-Fetch) unit is proposed for random control, which randomly sets execution orders for concurrent operations. The AES chip was manufactured in SMIC 0.18 μm technology. The average energy for encrypting one group of plain texts (128 bits secrete keys) is 19 nJ. The core area is 0.43 mm2. A sophisticated experimental setup was built to test the DPA resistance. Measurement-based experimental results show that one byte of a secret key cannot be disclosed from our chip under random mode after 64000 power traces were used in the DPA attack. Compared with the corresponding fixed order execution, the hardware based random order execution is improved by at least 21 times the DPA resistance.

Studies for an upgrade of ALICE Inner Tracking System: Pixel chip characterization

Directory of Open Access Journals (Sweden)

Park Jonghan

2017-01-01

Full Text Available Inner Tracking System (ITS of ALICE is used for vertex determination and tracking. Future heavy-ion program at the LHC aims to run with high luminosity. To address this challenge, upgrade program of ITS is underway, which aims at better position resolution (factor of 3, high detection efficiency (>99%, high-rate readout capabilities (100 kHz for Pb-Pb and moderate radiation hardness (> 700 krad. The new ITS will be composed with 7 layers of silicon pixel chip based on Monolithic Active Pixel Sensor (MAPS technology. The characterization test of various version of prototype chips at different phases of development has been performed. This contribution will provide the main characterization results obtained from the measurements performed at laboratories and using test beam for finalizing the pixel chip specification.

Direct quantification of transendothelial electrical resistance in organs-on-chips

NARCIS (Netherlands)

van der Helm, Marieke Willemijn; Odijk, Mathieu; Frimat, Jean-Philippe; van der Meer, Andries Dirk; Eijkel, Jan C.T.; van den Berg, Albert; Segerink, Loes Irene

2016-01-01

Measuring transendothelial or transepithelial electrical resistance (TEER) is a widely used method to monitor cellular barrier tightness in organs-on-chips. Unfortunately, integrated electrodes close to the cellular barrier hamper visual inspection of the cells or require specialized cleanroom

Modelling, Synthesis, and Configuration of Networks-on-Chips

DEFF Research Database (Denmark)

Stuart, Matthias Bo

This thesis presents three contributions in two different areas of network-on-chip and system-on-chip research: Application modelling and identifying and solving different optimization problems related to two specific network-on-chip architectures. The contribution related to application modelling...... is an analytical method for deriving the worst-case traffic pattern caused by an application and the cache-coherence protocol in a cache-coherent shared-memory system. The contributions related to network-on-chip optimization problems consist of two parts: The development and evaluation of six heuristics...... for solving the network synthesis problem in the MANGO network-on-chip, and the identification and formalization of the ReNoC configuration problem together with three heuristics for solving it....

Research of Dielectric Breakdown Micro fluidic Sampling Chip

International Nuclear Information System (INIS)

Jiang, F.; Lei, Y.; Yu, J.

2013-01-01

Micro fluidic chip is mainly driven electrically by external electrode and array electrode, but there are certain disadvantages in both of ways, which affect the promotion and application of micro fluidic technology. This paper discusses a scheme that uses the conductive solution in a microchannel made by PDMS, replacing electrodes and the way of dielectric breakdown to achieve microfluidic chip driver. It could reduce the driving voltage and simplify the chip production process. To prove the feasibility of this method, we produced a micro fluidic chip used in PDMS material with the lithography technology and experimented it. The results showed that using the dielectric breakdown to achieve microfluidic chip driver is feasible, and it has certain application prospect.

Fundamental study of microelectronic chip response under laser ultrasonic-interferometric inspection using C-scan method

Science.gov (United States)

Yang, Lei; Gong, Jie; Ume, I. Charles

2014-02-01

In modern surface mount packaging technologies, such as flip chips, chip scale packages, and ball grid arrays(BGA), chips are attached to the substrates/printed wiring board (PWB) using solder bump interconnections. The quality of solder bumps between the chips and the substrate/board is difficult to inspect. Laser ultrasonic-interferometric technique was proved to be a promising approach for solder bump inspection because of its noncontact and nondestructive characteristics. Different indicators extracted from received signals have been used to predict the potential defects, such as correlation coefficient, error ratio, frequency shifting, etc. However, the fundamental understanding of the chip behavior under laser ultrasonic inspection is still missing. Specifically, it is not sure whether the laser interferometer detected out-of-plane displacements were due to wave propagation or structural vibration when the chip was excited by pulsed laser. Plus, it is found that the received signals are chip dependent. Both challenges impede the interpretation of acquired signals. In this paper, a C-scan method was proposed to study the underlying phenomenon during laser ultrasonic inspection. The full chip was inspected. The response of the chip under laser excitation was visualized in a movie resulted from acquired signals. Specifically, a BGA chip was investigated to demonstrate the effectiveness of this method. By characterizing signals using discrete wavelet transform(DWT), both ultrasonic wave propagation and vibration were observed. Separation of them was successfully achieved using ideal band-pass filter and visualized in resultant movies, too. The observed ultrasonic waves were characterized and their respective speeds were measured by applying 2-D FFT. The C-scan method, combined with different digital signal processing techniques, was proved to be an very effective methodology to learn the behavior of chips under laser excitation. This general procedure can be

Experiment list: SRX485216 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 3K9me3 ChIP from rhino germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_na...me=H3K9me3 ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fema...le || tissue=ovary || germline knock-down=rhino || chip antibody=Histone H3K9me3

Experiment list: SRX485215 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available K9me3 ChIP from rhino germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_nam...e=H3K9me3 ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=femal...e || tissue=ovary || germline knock-down=rhino || chip antibody=Histone H3K9me3 a

Experiment list: SRX485217 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available 3K9me3 ChIP from piwi germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_nam...e=H3K9me3 ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female... || tissue=ovary || germline knock-down=piwi || chip antibody=Histone H3K9me3 ant

Characterization of imaging pixel detectors of Si and CdTe read out with the counting X-ray chip MPEC 2.3

International Nuclear Information System (INIS)

Loecker, M.

2007-04-01

Single photon counting detectors with Si- and CdTe-sensors have been constructed and characterized. As readout chip the MPEC 2.3 is used which consists of 32 x 32 pixels with 200 x 200 μm 2 pixel size and which has a high count rate cabability (1 MHz per pixel) as well as a low noise performance (55 e - ). Measurements and simulations of the detector homogeneity are presented. It could be shown that the theoretical maximum of the homogeneity is reached (quantum limit). By means of the double threshold of the MPEC chip the image contrast can be enhanced which is demonstrated by measurement and simulation. Also, multi-chip-modules consisting of 4 MPEC chips and a single Si- or CdTe-sensor have been constructed and successfully operated. With these modules modulation-transfer-function measurements have been done showing a good spatial resolution of the detectors. In addition, multi-chip-modules according to the Sparse-CMOS concept have been built and tests characterizing the interconnection technologies have been performed

LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

Science.gov (United States)

Tang, Y. K.; Hsu, Y. C.; Lin, E. J.; Hu, Y. J.; Liu, C. Y.

2016-12-01

In this study, light emitting diode (LED) chips were die-bonded on a Ag/Cu substrate by a Sn-BixZn-Sn bonding system. A high die-bonding strength is successfully achieved by using a Sn-BixZn-Sn ternary system. At the bonding interface, there is observed a Bi-segregation phenomenon. This Bi-segregation phenomenon solves the problems of the brittle layer-type Bi at the joint interface. Our shear test results show that the bonding interface with Bi-segregation enhances the shear strength of the LED die-bonding joints. The Bi-0.3Zn and Bi-0.5Zn die-bonding cases have the best shear strength among all die-bonding systems. In addition, we investigate the atomic depth profile of the deposited Bi-xZn layer by evaporating Bi-xZn E-gun alloy sources. The initial Zn content of the deposited Bi-Zn alloy layers are much higher than the average Zn content in the deposited Bi-Zn layers.

On-chip integration of a superconducting microwave circulator and a Josephson parametric amplifier

Science.gov (United States)

Rosenthal, Eric I.; Chapman, Benjamin J.; Moores, Bradley A.; Kerckhoff, Joseph; Malnou, Maxime; Palken, D. A.; Mates, J. A. B.; Hilton, G. C.; Vale, L. R.; Ullom, J. N.; Lehnert, K. W.

Recent progress in microwave amplification based on parametric processes in superconducting circuits has revolutionized the measurement of feeble microwave signals. These devices, which operate near the quantum limit, are routinely used in ultralow temperature cryostats to: readout superconducting qubits, search for axionic dark matter, and characterize astrophysical sensors. However, these amplifiers often require ferrite circulators to separate incoming and outgoing traveling waves. For this reason, measurement efficiency and scalability are limited. In order to facilitate the routing of quantum signals we have created a superconducting, on-chip microwave circulator without permanent magnets. We integrate our circulator on-chip with a Josephson parametric amplifier for the purpose of near quantum-limited directional amplification. In this talk I will present a design overview and preliminary measurements.

ReseqChip: Automated integration of multiple local context probe data from the MitoChip array in mitochondrial DNA sequence assembly

Directory of Open Access Journals (Sweden)

Spang Rainer

2009-12-01

Full Text Available Abstract Background The Affymetrix MitoChip v2.0 is an oligonucleotide tiling array for the resequencing of the human mitochondrial (mt genome. For each of 16,569 nucleotide positions of the mt genome it holds two sets of four 25-mer probes each that match the heavy and the light strand of a reference mt genome and vary only at their central position to interrogate all four possible alleles. In addition, the MitoChip v2.0 carries alternative local context probes to account for known mtDNA variants. These probes have been neglected in most studies due to the lack of software for their automated analysis. Results We provide ReseqChip, a free software that automates the process of resequencing mtDNA using multiple local context probes on the MitoChip v2.0. ReseqChip significantly improves base call rate and sequence accuracy. ReseqChip is available at http://code.open-bio.org/svnweb/index.cgi/bioperl/browse/bioperl-live/trunk/Bio/Microarray/Tools/. Conclusions ReseqChip allows for the automated consolidation of base calls from alternative local mt genome context probes. It thereby improves the accuracy of resequencing, while reducing the number of non-called bases.

Thermal-Aware Scheduling for Future Chip Multiprocessors

Directory of Open Access Journals (Sweden)

Pedro Trancoso

2007-04-01

Full Text Available The increased complexity and operating frequency in current single chip microprocessors is resulting in a decrease in the performance improvements. Consequently, major manufacturers offer chip multiprocessor (CMP architectures in order to keep up with the expected performance gains. This architecture is successfully being introduced in many markets including that of the embedded systems. Nevertheless, the integration of several cores onto the same chip may lead to increased heat dissipation and consequently additional costs for cooling, higher power consumption, decrease of the reliability, and thermal-induced performance loss, among others. In this paper, we analyze the evolution of the thermal issues for the future chip multiprocessor architectures and show that as the number of on-chip cores increases, the thermal-induced problems will worsen. In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss. In order to minimize or even eliminate these problems, we propose thermal-aware scheduler (TAS algorithms. When assigning processes to cores, TAS takes their temperature and cooling ability into account in order to avoid thermal stress and at the same time improve the performance. Experimental results have shown that a TAS algorithm that considers also the temperatures of neighboring cores is able to significantly reduce the temperature-induced performance loss while at the same time, decrease the chip's temperature across many different operation and configuration scenarios.