A Study of Protection of Copper Alloys

International Nuclear Information System (INIS)

Kim, E. A.; Kim, S. H.; Kim, C. R.

1974-01-01

Volatile treatment of high capacity boiler water with hydrazine and ammonia is studied. Ammonia comes from the decomposition of excess hydrazine injected to treat dissolved oxygen. Ammonia is also injected for the control of pH. To find an effect of such ammonia on the copper alloy, the relations between pH and iron, and ammonia and copper are studied. Since the dependence of corrosion of iron on pH differs from that of copper, a range of pH was selected experimentally to minimize the corrosion rates of both copper and iron. Corrosion rates of various copper alloys are also compared

Copper alloys for high heat flux structure applications

International Nuclear Information System (INIS)

Zinkle, S.J.; Fabritsiev, S.A.

1994-01-01

The mechanical and physical properties of copper alloys are reviewed and compared with the requirements for high heat flux structural applications in fusion reactors. High heat flux structural materials must possess a combination of high thermal conductivity and high mechanical strength. The three most promising copper alloys at the present time are oxide dispersion-strengthened copper (Cu-Al 2 O 3 ) and two precipitation-hardened copper alloys (Cu-Cr-Zr and Cu-Ni-Be). These three alloys are capable of room temperature yield strengths >400 MPa and thermal conductivities up to 350 W/m-K. All of these alloys require extensive cold working to achieve their optimum strength. Precipitation-hardened copper alloys such Cu-Cr-Zr are susceptible to softening due to precipitate overaging and recrystallization during brazing, whereas the dislocation structure in Cu-Al 2 O 3 remains stabilized during typical high temperature brazing cycles. All three alloys exhibit good resistance to irradiation-induced softening and void swelling at temperatures below 300 degrees C. The precipitation-strengthened allows typically soften during neutron irradiation at temperatures above about 300 degrees C and therefore should only be considered for applications operating at temperatures 2 O 3 ) is considered to be the best candidate for high heat flux structural applications

Copper-beryllium alloys for technical applications

International Nuclear Information System (INIS)

Heller, W.

1976-01-01

Data of physical properties are compiled for the most commonly used copper-beryllium alloys (CuBe 2, CuBe 1.7, CuCoBe, and CuCoAgBe), with emphasis on their temperature dependence and their variation with particular annealing and hardening treatments. The purpose is to provide a reference source and to indicate the versatility of these materials with respect to other copper alloys and to pure copper. The special features of CuBe alloys include high mechanical strength with reasonably high electrical conductivity, as well as good wear and corrosion resistance. For example, CuBe 2 has a yield strength of up to 1200 N/mm 2 , about three times that of pure copper, whilst the electrical conductivity of CuCoBe can be as high as 28 MS/m, nearly half that of pure copper. Typical applications are springs and electrical contacts. The importance of a proper heat treatment is discussed in some detail, notably the metallurgy and effects of low-temperature annealing (precipitation-hardening). A chapter on manufacturing processes covers machining, brazing, welding, and cleaning. This is followed by some remarks on safety precautions against beryllium poisoning. CuBe alloys are commercially available in the form of wires, strips, rods, and bars. Typical dimensions, specifications, a brief cost estimate, and addresses of suppliers are listed. (Author)

Grain Refinement of Permanent Mold Cast Copper Base Alloys

Energy Technology Data Exchange (ETDEWEB)

M.Sadayappan; J.P.Thomson; M.Elboujdaini; G.Ping Gu; M. Sahoo

2005-04-01

Grain refinement is a well established process for many cast and wrought alloys. The mechanical properties of various alloys could be enhanced by reducing the grain size. Refinement is also known to improve casting characteristics such as fluidity and hot tearing. Grain refinement of copper-base alloys is not widely used, especially in sand casting process. However, in permanent mold casting of copper alloys it is now common to use grain refinement to counteract the problem of severe hot tearing which also improves the pressure tightness of plumbing components. The mechanism of grain refinement in copper-base alloys is not well understood. The issues to be studied include the effect of minor alloy additions on the microstructure, their interaction with the grain refiner, effect of cooling rate, and loss of grain refinement (fading). In this investigation, efforts were made to explore and understand grain refinement of copper alloys, especially in permanent mold casting conditions.

Bonding tungsten, W–Cu-alloy and copper with amorphous Fe–W alloy transition

Energy Technology Data Exchange (ETDEWEB)

Wang, Song, E-mail: wangsongrain@163.com [Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing, Beijing 100083 (China); Laboratory of Advanced Materials, Tsinghua University, Beijing 100084 (China); Ling, Yunhan, E-mail: yhling@mail.tsinghua.edu.cn [Laboratory of Advanced Materials, Tsinghua University, Beijing 100084 (China); Zhao, Pei [Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190 (China); Graduate School of the Chinese Academy of Sciences, Beijing 100039 (China); Zang, Nanzhi [Laboratory of Advanced Materials, Tsinghua University, Beijing 100084 (China); Wang, Jianjun [Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing, Beijing 100083 (China); Guo, Shibin [Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190 (China); Graduate School of the Chinese Academy of Sciences, Beijing 100039 (China); Zhang, Jun [Laboratory of Advanced Materials, Tsinghua University, Beijing 100084 (China); Xu, Guiying [Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing, Beijing 100083 (China)

2013-05-15

W/Cu graded materials are the leading candidate materials used as the plasma facing components in a fusion reactor. However, tungsten and copper can hardly be jointed together due to their great differences in physical properties such as coefficient of thermal expansion and melting point, and the lack of solid solubility between them. To overcome those difficulties, a new amorphous Fe–W alloy transitional coating and vacuum hot pressing (VHP) method were proposed and introduced in this paper. The morphology, composition and structure of the amorphous Fe–W alloy coating and the sintering interface of the specimens were analyzed by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The thermal shock resistance of the bonded composite was also tested. The results demonstrated that amorphous structure underwent change from amorphous to nano grains during joining process, and the joined W/Cu composite can endued plasma thermal shock resistance with energy density more than 5.33 MW/m{sup 2}. It provides a new feasible technical to join refractory tungsten to immiscible copper with amorphous Fe–W alloy coating.

Design of a Nickel-Based Bond-Coat Alloy for Thermal Barrier Coatings on Copper Substrates

Directory of Open Access Journals (Sweden)

Torben Fiedler

2014-11-01

Full Text Available To increase the lifetime of rocket combustion chambers, thermal barrier coatings (TBC may be applied on the copper chamber wall. Since standard TBC systems used in gas turbines are not suitable for rocket-engine application and fail at the interface between the substrate and bond coat, a new bond-coat material has to be designed. This bond-coat material has to be chemically compatible to the copper substrate to improve the adhesion and needs a coefficient of thermal expansion close to that of copper to reduce thermal stresses. One approach to achieve this is to modify the standard NiCrAlY alloy used in gas turbines by adding copper. In this work, the influence of copper on the microstructure of NiCrAlY-alloys is investigated with thermodynamical calculations, optical microscopy, SEM, EDX and calorimetry. Adding copper leads to the formation of a significant amount of \\(\\beta\\ and \\(\\alpha\\ Reducing the aluminum and chromium content leads furthermore to a two-phase fcc microstructure.

Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates

International Nuclear Information System (INIS)

Amore, S.; Ricci, E.; Borzone, G.; Novakovic, R.

2008-01-01

The present work was carried out in the framework of the study of new lead-free solder alloys for technical applications in electronic devices. In the focus of this characterisation the wetting behaviour of several Sn-rich alloys belonging to the In-Sn, Au-Sn and Cu-Sn systems has been studied by measuring the contact angle variations on Cu and Ni substrates as a function of time and temperature. The interface between the alloy and the substrate has been analysed by the use of optical microscopy and scanning electron microscopy combined with energy-dispersive X-ray spectrometry in order to study the reaction between the alloy and the solid substrate and the possible formation of different compounds at the interface. A remarkable effect of the two different substrates on the behaviour of the contact angle as a function of temperature and on the morphology of the interface between the liquid solder and the solid substrate was observed for the In-Sn and Cu-Sn, while the Au-Sn system shows a very similar wetting behaviour on Cu and Ni

Corrosion of copper alloys in sulphide containing district heting systems

DEFF Research Database (Denmark)

Thorarinsdottir, R.I.; Maahn, Ernst Emanuel

1999-01-01

Copper and some copper alloys are prone to corrosion in sulphide containing geothermal water analogous to corrosion observed in district heating systems containing sulphide due to sulphate reducing bacteria. In order to study the corrosion of copper alloys under practical conditions a test...... was carried out at four sites in the Reykjavik District Heating System. The geothermal water chemistry is different at each site. The corrosion rate and the amount and chemical composition of deposits on weight loss coupons of six different copper alloys are described after exposure of 12 and 18 months......, respectively. Some major differences in scaling composition and the degree of corrosion attack are observed between alloys and water types....

Wetting of refractory metals with copper base alloys

International Nuclear Information System (INIS)

Anikeev, E.F.; Kostikov, V.I.; Chepelenko, V.N.; Batov, V.M.

1978-01-01

The effect is studied of phosphorus upon the wetting of molybdenum, niobium and tantalum by an alloy of the system copper-silver (10%) as a function of contact time and phosphorus concentration. Experiments have been conducted in vacuum of 5x10 -4 mm Hg at 900 deg C. It is established that the introduction of phosphorus into a copper-silver alloy improves the wetting of molybdenum, niobium and tantalum. Formation of intermetallic compounds on the alloy-refractory metal interface can be avoided by adjusting the time of contact of the solder with molybdenum, niobium and tantalum. As a solder with 2.9% phosphorus spreads well over copper, it is suggested to use said solder for brazing copper and the investigated refractory metals in items intended for service at temperatures of up to 600 deg C

An evaluation of a lathe-cut high-copper amalgam alloy.

Science.gov (United States)

Knibbs, P J; Plant, C G; Shovelton, D S; Jones, P A

1987-09-01

Modification of an amalgam alloy may give rise to improved physical properties. The physical properties of a newly formulated, single-composition lathe-cut amalgam alloy were studied and found to be superior to those of a conventional lathe-cut amalgam alloy. However, such modification in formulation may result in changes in the clinical handling properties of the material. The high-copper amalgam alloy was assessed by a panel of general practitioners who found that the general handling properties of the material were similar to those of conventional lathe-cut amalgam alloys. The longer term performance of the high-copper alloy was assessed by means of a blind, controlled clinical trial carried out by two operators. A 1-year assessment of the resulting restorations and tooth replicas could not distinguish between the high-copper alloy and a conventional alloy. The two alloys had both given good clinical results.

Copper and copper-nickel alloys as zebra mussel antifoulants

Energy Technology Data Exchange (ETDEWEB)

Dormon, J.M.; Cottrell, C.M.; Allen, D.G.; Ackerman, J.D.; Spelt, J.K. [Univ. of Toronto, Ontario (Canada)

1996-04-01

Copper has been used in the marine environment for decades as cladding on ships and pipes to prevent biofouling by marine mussels (Mytilus edulis L.). This motivated the present investigation into the possibility of using copper to prevent biofouling in freshwater by both zebra mussels and quagga mussels (Dreissena polymorpha and D. bugensis collectively referred to as zebra mussels). Copper and copper alloy sheet proved to be highly effective in preventing biofouling by zebra mussels over a three-year period. Further studies were conducted with copper and copper-nickel mesh (lattice of expanded metal) and screen (woven wire with a smaller hole size), which reduced the amount of copper used. Copper screen was also found to be strongly biofouling-resistant with respect to zebra mussels, while copper mesh reduced zebra mussel biofouling in comparison to controls, but did not prevent it entirely. Preliminary investigations into the mechanism of copper antifouling, using galvanic couples, indicated that the release of copper ions from the surface of the exposed metal into the surrounding water is directly or indirectly responsible for the biofouling resistance of copper.

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Directory of Open Access Journals (Sweden)

Soares D.

2007-01-01

Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

Lead-Free Electronics: Impact for Space Electronics

Science.gov (United States)

Sampson, Michael J.

2010-01-01

Pb is used as a constituent in solder alloys used to connect and attach electronic parts to printed wiring boards (PWBs). Similar Pbbearing alloys are electroplated or hot dipped onto the terminations of electronic parts to protect the terminations and make them solderable. Changing to Pb-free solders and termination finishes has introduced significant technical challenges into the supply chain. Tin/lead (Sn/Pb) alloys have been the solders of choice for electronics for more than 50 years. Pb-free solder alloys are available but there is not a plug-in replacement for 60/40 or 63/37 (Sn/Pb) alloys, which have been the industry workhorses.

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Directory of Open Access Journals (Sweden)

Liu Mei Lee

2013-01-01

Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

Irradiation of copper alloys in FFTF

International Nuclear Information System (INIS)

Brager, H.R.; Garner, F.A.

1984-01-01

Nine copper-base alloys in thirteen material conditions have been inserted into the MOTA-18 experiment for irradiation in FFTF at approx.450 0 C. The alloy Ni-1.9Be is also included in this experiment, which includes both TEM disks and miniature tensile specimens

Microstructure and interfacial evaluation of Co-based alloy coating on copper by pulsed Nd:YAG multilayer laser cladding

International Nuclear Information System (INIS)

Yan Hua; Wang Aihua; Xu Kaidong; Wang Wenyan; Huang Zaowen

2010-01-01

Laser cladding defect-free coatings on copper is rather difficult. The purpose of this study is to fabricate high quality Co-based alloy coating on copper substrate by laser cladding. Powder preplacement with a thickness of 0.7 mm improves the absorptivity of copper substrate to laser effectively and generates defect-free coating. Microstructures, phase constitutions and wear properties are investigated by means of scanning electronic microscopy (SEM) with X-ray energy dispersive microanalysis (EDX), transmission electron microscopy (TEM) and X-ray diffraction (XRD), as well as dry sliding wear test. Experimental results show that α-Co solution, Cr 23 C 6 , Ni 17 W 3 and Cr 4 Ni 15 W are the main phases in the Co-based coating. The Ni-based solid solutions (α-Co, Ni) and (Ni, Cu) are formed at interface, which generate metallurgical bonding by diffusion between Co-based coating and copper substrate. The average microhardness of the coating is 478HV 0.1 . Wear resistance of copper is significantly improved by laser cladding Co-based alloy multilayer coating.

Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys.

Science.gov (United States)

Liu, R; Zhang, Z J; Li, L L; An, X H; Zhang, Z F

2015-04-01

In this study, the concept of "twinning induced plasticity (TWIP) alloys" is broadened, and the underlying intrinsic microscopic mechanisms of the general TWIP effect are intensively explored. For the first aspect, "TWIP copper alloys" was proposed following the concept of "TWIP steels", as they share essentially the same strengthening and toughening mechanisms. For the second aspect, three intrinsic features of twinning: i.e. "dynamic development", "planarity", as well as "orientation selectivity" were derived from the detailed exploration of the deformation behavior in TWIP copper alloys. These features can be considered the microscopic essences of the general "TWIP effect". Moreover, the effective cooperation between deformation twinning and dislocation slipping in TWIP copper alloys leads to a desirable tendency: the synchronous improvement of strength and plasticity (SISP). This breakthrough against the traditional trade-off relationship, achieved by the general "TWIP effect", may provide useful strategies for designing high-performance engineering materials.

Irradiation creep of dispersion strengthened copper alloy

Energy Technology Data Exchange (ETDEWEB)

Pokrovsky, A.S.; Barabash, V.R.; Fabritsiev, S.A. [and others

1997-04-01

Dispersion strengthened copper alloys are under consideration as reference materials for the ITER plasma facing components. Irradiation creep is one of the parameters which must be assessed because of its importance for the lifetime prediction of these components. In this study the irradiation creep of a dispersion strengthened copper (DS) alloy has been investigated. The alloy selected for evaluation, MAGT-0.2, which contains 0.2 wt.% Al{sub 2}O{sub 3}, is very similar to the GlidCop{trademark} alloy referred to as Al20. Irradiation creep was investigated using HE pressurized tubes. The tubes were machined from rod stock, then stainless steel caps were brazed onto the end of each tube. The creep specimens were pressurized by use of ultra-pure He and the stainless steel caps subsequently sealed by laser welding. These specimens were irradiated in reactor water in the core position of the SM-2 reactors to a fluence level of 4.5-7.1 x 10{sup 21} n/cm{sup 2} (E>0.1 MeV), which corresponds to {approx}3-5 dpa. The irradiation temperature ranged from 60-90{degrees}C, which yielded calculated hoop stresses from 39-117 MPa. A mechanical micrometer system was used to measure the outer diameter of the specimens before and after irradiation, with an accuracy of {+-}0.001 mm. The irradiation creep was calculated based on the change in the diameter. Comparison of pre- and post-irradiation diameter measurements indicates that irradiation induced creep is indeed observed in this alloy at low temperatures, with a creep rate as high as {approx}2 x 10{sup {minus}9}s{sup {minus}1}. These results are compared with available data for irradiation creep for stainless steels, pure copper, and for thermal creep of copper alloys.

Irradiation creep of dispersion strengthened copper alloy

International Nuclear Information System (INIS)

Pokrovsky, A.S.; Barabash, V.R.; Fabritsiev, S.A.

1997-01-01

Dispersion strengthened copper alloys are under consideration as reference materials for the ITER plasma facing components. Irradiation creep is one of the parameters which must be assessed because of its importance for the lifetime prediction of these components. In this study the irradiation creep of a dispersion strengthened copper (DS) alloy has been investigated. The alloy selected for evaluation, MAGT-0.2, which contains 0.2 wt.% Al 2 O 3 , is very similar to the GlidCop trademark alloy referred to as Al20. Irradiation creep was investigated using HE pressurized tubes. The tubes were machined from rod stock, then stainless steel caps were brazed onto the end of each tube. The creep specimens were pressurized by use of ultra-pure He and the stainless steel caps subsequently sealed by laser welding. These specimens were irradiated in reactor water in the core position of the SM-2 reactors to a fluence level of 4.5-7.1 x 10 21 n/cm 2 (E>0.1 MeV), which corresponds to ∼3-5 dpa. The irradiation temperature ranged from 60-90 degrees C, which yielded calculated hoop stresses from 39-117 MPa. A mechanical micrometer system was used to measure the outer diameter of the specimens before and after irradiation, with an accuracy of ±0.001 mm. The irradiation creep was calculated based on the change in the diameter. Comparison of pre- and post-irradiation diameter measurements indicates that irradiation induced creep is indeed observed in this alloy at low temperatures, with a creep rate as high as ∼2 x 10 -9 s -1 . These results are compared with available data for irradiation creep for stainless steels, pure copper, and for thermal creep of copper alloys

Hydrogen and deuterium permeation in copper alloys, copper--gold brazing alloys, gold, and the in situ growth of stable oxide permeation barriers

International Nuclear Information System (INIS)

Begeal, D.R.

1978-01-01

The deuterium permeation through several copper alloys has been measured over a temperature range of 550 to 830 K using the membrane technique. In some cases, the hydrogen permeability was also measured. The results were divided into three categories: common alloys, gold alloys, and stable oxide forming alloys. Common alloys which showed typical bulk metallic diffusion with litle change in the permeation activation energy as compared to copper (77 kJ/mol for D 2 ) were: (additions are in weight percent) 5% Sn, 2.3% U, 0.15% Zr, 4% Sn+4% Pb+4% Zn, 3% Si, and 7% Al+2% Fe. Compared to copper, the D 2 permeability at 573 K was reduced by factors of 2.0, 2.7, 4.5, 5.3, 5.9, and 7.0, respectively. A series of gold--copper alloys including pure gold, 80% Au, 50% Au, 49% Au, and 35% Au also showed typical bulk metallic diffusion with a trend of decreasing permeability (increasing activation energies for permeation) with increasing gold content. There were also pronounced inflections or shifts in the permeability at approx.370 0 C, or about the order--disorder transition for Cu 3 Au and CuAu, for the 80% and 50% alloys. Two alloys did not exhibit bulk metallic permeation behavior and the permeabiltiy was in fact controlled by surface oxide layers. It was found that a layer of beryllium oxide could be formed on Cu+2% Be and a layer of aluminum oxide could be formed on Cu+7% Al+2% Si. As compared to 0.25 mm-thick copper, the deuterium permeability at 500 0 C was reduced by a factor of approx.250 for Cu--Be and approx.1000 for Cu--Al--Si. The activation energies for deuterium permeation were 98 kJ/mol and 132 kJ/mol, respectively. The mechanism for the oxide growth is the high-temperature hydrogen reduction of nearby less stable oxides, simultaneous with oxidation of the active metal, Be or Al, by trace amounts of water in the hydrogen. Ion microprobe mass analysis identified the oxide layers as containing beryllium or aluminum but not containing copper

Element segregation behavior of aluminum-copper alloy ZL205A

Directory of Open Access Journals (Sweden)

Fan Li

2014-11-01

Full Text Available In aluminum-copper alloy, the segregation has a severe bad effect on the alloying degree, strength and corrosion resistance. A deeper understanding of element segregation behavior will have a great significance on the prevention of segregation. In the study, the element segregation behavior of ZL205A aluminum-copper alloy was investigated by examining isothermally solidified samples using scanning electron microscopy and energy dispersive spectroscopy. The calculated results of segregation coefficients show that Cu and Mn are negative segregation elements; while Ti, V and Zr are positive segregation elements. The sequence of element segregation degree from the greatest to the least in ZL205A alloy is Cu, Mn, V, Ti, Zr and Al. The density of residual liquid is expected to increase with a decrease in the quenching temperature ranging from 630 ºC to 550 ºC. The calculated results confirm that the quenching temperature has an insignificant effect on the liquid density; and the variation of density is mainly due to element segregation. Consequently, segregations of Al, Cu and Mn lead to an increase in density, but Ti, V and Zr present the opposite effect. The contribution of each element to the variation of the liquid density was analyzed. The sequence of contributions of alloying elements to the variation of total liquid density is Cu﹥Al﹥Mn﹥V﹥Ti﹥Zr.

[Compressive and bend strength of experimental admixed high copper alloys].

Science.gov (United States)

Sourai, P; Paximada, H; Lagouvardos, P; Douvitsas, G

1988-01-01

Mixed alloys for dental amalgams have been used mainly in the form of admixed alloys, where eutectic spheres are blend with conventional flakes. In the present study the compressive strength, bend strength and microstructure of two high-copper alloys (Tytin, Ana-2000) is compared with three experimental alloys prepared of the two high copper by mixing them in proportions of 3:1, 1:1 and 1:3 by weight. The results revealed that experimental alloys inherited high early and final strength values without any significant change in their microstructure.

Microstructure and Service Properties of Copper Alloys

Directory of Open Access Journals (Sweden)

Polok-Rubiniec M.

2016-09-01

Full Text Available This elaboration shows the effect of combined heat treatment and cold working on the structure and utility properties of alloyed copper. As the test material, alloyed copper CuTi4 was employed. The samples were subjected to treatment according to the following schema: 1st variant – supersaturation and ageing, 2nd variant – supersaturation, cold rolling and ageing. The paper presents the results of microstructure, hardness, and abrasion resistance. The analysis of the wipe profile geometry was realized using a Zeiss LSM 5 Exciter confocal microscope. Cold working of the supersaturated solid solution affects significantly its hardness but the cold plastic deformation causes deterioration of the wear resistance of the finally aged CuTi4 alloy.

Influence of solutes on heavy ion induced void-swelling in binary copper alloys

International Nuclear Information System (INIS)

Leister, K.H.

1983-05-01

As radiation induced swelling of metals depends on their constitution, swelling of copper and copper alloys with low solute concentration is studied. Diffusion coefficients and solubility of solute in copper were used as criteria of selection of the alloys. The samples were irradiated by 200keV copper ions. Swelling and void densities were measured by transmission electron microscopy. The measurements show low dependence of swelling upon the diffusibility of the solute in the solvent and a strong dependence on their concentration. Alloys of 0.1at% solute show more swelling than pure copper, and alloys of 1at% show less swelling under the irradiation conditions. The different swelling behavior in Cu-Ni alloys is due to the different void densities. (orig.) [de

Neutron irradiation test of copper alloy/stainless steel joint materials

International Nuclear Information System (INIS)

Yamada, Hirokazu; Kawamura, Hiroshi

2006-01-01

As a study about the joint technology of copper alloy and stainless steel for utilization as cooling piping in International Thermonuclear Experimental Reactor (ITER), Al 2 O 3 -dispersed strengthened copper or CuCrZr was jointed to stainless steel by three kinds of joint methods (casting joint, brazing joint and friction welding method) for the evaluation of the neutron irradiation effect on joints. A neutron irradiation test was performed to three types of joints and each copper alloy. The average value of fast neutron fluence in this irradiation test was about 2 x 10 24 n/m 2 (E>1 MeV), and the irradiation temperature was about 130degC. As post-irradiation examinations, tensile tests, hardness tests and observation of fracture surface after the tensile tests were performed. All type joints changed to be brittle by the neutron irradiation effect like each copper alloy material, and no particular neutron irradiation effect due to the effect of joint process was observed. On the casting and friction welding, hardness of copper alloy near the joint boundary changed to be lower than that of each copper alloy by the effect of joint procedure. However, tensile strength of joints was almost the same as that of each copper alloy before/after neutron irradiation. On the other hand, tensile strength of joints by brazing changed to be much lower than CuAl-25 base material by the effect of joint process before/after neutron irradiation. Results in this study showed that the friction welding method and the casting would be able to apply to the joint method of piping in ITER. This report is based on the final report of the ITER Engineering Design Activities (EDA). (author)

Generation of copper, nickel, and CuNi alloy nanoparticles by spark discharge

International Nuclear Information System (INIS)

Muntean, Alex; Wagner, Moritz; Meyer, Jörg; Seipenbusch, Martin

2016-01-01

The generation of copper, nickel, and copper-nickel alloy nanoparticles by spark discharge was studied, using different bespoke alloy feedstocks. Roughly spherical particles with a primary particle Feret diameter of 2–10 nm were produced and collected in agglomerate form. The copper-to-nickel ratios determined by Inductively coupled plasma mass spectrometry (ICP-MS), and therefore averaged over a large number of particles, matched the nominal copper content quite well. Further investigations showed that the electrode compositions influenced the evaporation rate and the primary particle size. The evaporation rate decreased with increasing copper content, which was found to be in good accordance with the Llewellyn-Jones model. However, the particle diameter was increasing with an increasing copper content, caused by a decrease in melting temperature due to the lower melting point of copper. Furthermore, the alloy compositions on the nanoscale were investigated via EDX. The nanoparticles exhibited almost the same composition as the used alloy feedstock, with a deviation of less than 7 percentage points. Therefore, no segregation could be detected, indicating the presence of a true alloy even on the nanoscale.

Stress corrosion cracking and dealloying of copper-gold alloy in iodine vapor

International Nuclear Information System (INIS)

Galvez, M.F.; Bianchi, G.L.; Galvele, J.R.

1993-01-01

The susceptibility to stress corrosion cracking of copper-gold alloy in iodine vapor was studied and the results were analyzed under the scope of the surface mobility stress corrosion cracking mechanism. The copper-gold alloy undergoes stress corrosion cracking in iodine. Copper iodide was responsible of that behavior. The copper-gold alloy shows two processes in parallel: stress corrosion cracking and dealloying. As was predicted by the surface mobility stress corrosion cracking mechanism, the increase in strain rate induces an increase in the crack propagation rate. (Author)

Effect of chemical composition of copper alloys on their hot-brittleness and weldability

International Nuclear Information System (INIS)

Zakharov, M.V.

1985-01-01

Effect of different alloying elements on the hot crack formation in argon-arc welding of M1 copper has been studied. It is shown that the effective crystallization interval has a determining influence on hot-brittleness of low-alloyed high-thermal- and electric conducting welded copper alloys. The narrow is this interval the lower is linear schrinkage and the alloys inclined to the formation of crystallization cracks in welding to a lesser degree. Alloying elements with low solubility in copper in solid state broadening the crystallization interval affect negatively the alloy hot-brittleness. Such additives as zirconium are useful at 0.02-0.O5% content and at > 0.1% content are intolerable. As to cadmium, tin, magnesium, cerium and antimony additives they don't practically strengthen copper and its alloys at 700-800 deg C and they should not be introduced

Fracture toughness of copper-base alloys for ITER applications: A preliminary report

Energy Technology Data Exchange (ETDEWEB)

Alexander, D.J.; Zinkle, S.J.; Rowcliffe, A.F. [Oak Ridge National Lab., TN (United States)

1997-04-01

Oxide-dispersion strengthened copper alloys and a precipitation-hardened copper-nickel-beryllium alloy showed a significant reduction in toughness at elevated temperature (250{degrees}C). This decrease in toughness was much larger than would be expected from the relatively modest changes in the tensile properties over the same temperature range. However, a copper-chromium-zirconium alloy strengthened by precipitation showed only a small decrease in toughness at the higher temperatures. The embrittled alloys showed a transition in fracture mode, from transgranular microvoid coalescence at room temperature to intergranular with localized ductility at high temperatures. The Cu-Cr-Zr alloy maintained the ductile microvoid coalescence failure mode at all test temperatures.

RECYCLING OF SCRAP AND WASTE OF COPPER AND COPPER ALLOYS IN BELARUS

Directory of Open Access Journals (Sweden)

S. L. Rovin

2017-01-01

Full Text Available The construction of a new casting and mechanical shop of unitary enterprise «Tsvetmet» in December 2015 has allowed to solve the complex problem of processing and utilization of scrap and wastes of copper and copper alloys in the Republic of Belarus. The technological processes of fire refinement of copper and manufacturing of copper rod from scrap and production of brass rod by hot pressing (extrusion of the continuously casted round billet have been mastered for the first time in the Republic of Belarus.

He bubble sites in implanted copper alloy

International Nuclear Information System (INIS)

Moreno, D.; Eliezer, D.

1996-01-01

Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

Modelling the effect of temperature and free acid, silver, copper and lead concentrations on silver electrorefining electrolyte conductivity

OpenAIRE

Aji, Arif T.; Kalliomäki, Taina; Wilson, Benjamin P.; Aromaa, Jari; Lundström, Mari

2016-01-01

Conductivity is one of the key physico-chemical properties of electrolyte in silver electrorefining since it affects the energy consumption of the process. As electrorefining process development trends towards high current density operation, having electrolytes with high conductivities will greatly reduce the energy consumption of the process. This study outlines investigations into silver electrorefining electrolyte conductivity as a function of silver, free acid, copper and lead concentrati...

Characterization of lead-free solders for electronic packaging

Science.gov (United States)

Ma, Hongtao

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

Directory of Open Access Journals (Sweden)

Sakinah Mohd Yusof

2013-10-01

Full Text Available Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 Nanostructured lead-free solder Sn-Ag-Cu (SAC was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM. In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed. Normal 0 false false false IN X-NONE X-NONE MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-qformat:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri","sans-serif"; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-fareast-font-family:"Times New Roman"; mso-fareast-theme-font:minor-fareast; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New

A review of the effect of neutron irradiation on the deformation behaviour of copper and copper alloys

International Nuclear Information System (INIS)

Higgy, H.R.

1976-08-01

The basic mechanisms of irradiation hardening are described. The effects of neutron dose, alloying and pre-irradiation deformation on the deformation behaviour of neutron-irradiatied copper and its alloys are considered. The discrepancy in the reported data is discussed. Substitutional and interstitial additions are found to influence the rate of irradiation hardening, while pre-irradiation deformation has no influence. The deformation behaviour of copper is found to alter as a result of irradiation and alloying. (author)

Prevention of pin tract infection with titanium-copper alloys.

Science.gov (United States)

Shirai, Toshiharu; Tsuchiya, Hiroyuki; Shimizu, Tohru; Ohtani, Kaori; Zen, Yo; Tomita, Katsuro

2009-10-01

The most frequent complication in external fixation is pin tract infection. To reduce the incidence of implant-associated infection, many published reports have looked at preventing bacterial adhesion by treating the pin surface. This study aimed to evaluate the antibacterial activity of a Titanium-Copper (Ti-Cu) alloy on implant infection, and to determine the potential use of the Ti-Cu alloy as a biomaterial. Two forms of Ti-Cu alloys were synthesized: one with 1% Cu and the other with 5% Cu. For analyzing infectious behavior, the implants were exposed to Staphylococcus aureus and Escherichia coli. The reaction of pathogens to the Ti-Cu alloys was compared with their reaction to stainless steel and pure titanium as controls. Both Ti-Cu alloys evidently inhibited colonization by both bacteria. Conversely, cytocompatibility studies were performed using fibroblasts and colony formation on the metals was assessed by counting the number of colonies. Ti-1% Cu alloy showed no difference in the number of colonies compared with the control. External fixator pins made of Ti-Cu alloys were evaluated in a rabbit model. The tissue-implant interactions were analyzed for the presence of infection, inflammatory changes and osteoid-formation. Ti-1% Cu alloy significantly inhibited inflammation and infection, and had excellent osteoid-formation. Copper blood levels were measured before surgery and at 14 days postoperatively. Preoperative and postoperative blood copper values were not statistically different. Overall, it was concluded that Ti-Cu alloys have antimicrobial activity and substantially reduce the incidence of pin tract infection. Ti-1% Cu alloy shows particular promise as a biomaterial. (c) 2009 Wiley Periodicals, Inc.

The effect of composition on volatility from a copper alloy

International Nuclear Information System (INIS)

McCarthy, K.A.; Smolik, G.R.; Wallace, R.S.

1994-01-01

During a Loss of Coolant Accident (LOCA) activated structural material can be mobilized through oxidation. Information on how much material is mobilized in an accident is necessary for performing safety assessments of fusion reactor designs. The Fusion Safety Program at the Idaho National Engineering Laboratory has an experimental program to measure mobilized mass as a function of temperature for various oxidizing environments. Materials studied have included beryllium (important because of its toxicity), copper alloys, a niobium alloy, PCA and HT-9 steel, tungsten (pure and an alloy), and a vanadium alloy. Some materials undergo a significant change in composition during irradiation. An example of this is copper (a candidate for the ITER first wall, divertor substrate, and various instrumentation probes and antennas), which can have as much as 1 wt% zinc due to transmutation. Additionally, as the design for ITER evolves, a slightly different copper alloy may be selected. Compositional changes may affect the extent that various elements are volatilized due to such mechanisms as diffusion through the alloy, and penetration and release from oxide layers formed on the material. To accurately calculate offsite doses for various irradiation scenarios, one must understand the effect of composition on volatility

Nanoscale characterization of martensite structures in copper based shape memory alloys

Energy Technology Data Exchange (ETDEWEB)

Adiguzel, O, E-mail: oadiguzel@firat.edu.t [Firat University Department of Physics, 23169 Elazig (Turkey)

2010-11-01

Martensitic transformations are first order displacive transitions and occur in the materials on cooling from high temperature. Shape memory effect is an unusual property exhibited by certain alloy systems, and leads to martensitic transition. Copper-based alloys exhibit this property in beta phase field which possess simple bcc- structures, austenite structure at high-temperatures. As temperature is lowered the austenite undergoes martensitic transition following two ordering reactions, and structural changes in nanoscale govern this transition. Atomic movements are also confined to interatomic lengths in sub-{mu}m or angstrom scale in martensitic transformation. The formation of the layered structures in copper based alloys consists of shears and shear mechanism. Martensitic transformations occur in a few steps with the cooperative movement of atoms less than interatomic distances by means of lattice invariant shears on a {l_brace}110{r_brace} - type plane of austenite matrix which is basal plane or stacking plane of martensite. The lattice invariant shears occurs, in two opposite directions, <110> -type directions on the {l_brace}110{r_brace}-type plane. These shears gives rise to the formation of layered structure.

Copper and nickel alloys and titanium for seawater applications

International Nuclear Information System (INIS)

Richter, H.

1977-01-01

Copper and nickel alloys and titanium have been successfully used for heat exchangers on ships, in power plants and for chemical apparatus and piping systems because of their resistance against corrosion in sea water. Aluminium brass and copper nickel alloys, the standard materials for condensers and coolers, however, may be attacked, the corrosion depending on water quality, water velocity, and structural conditions. The mechanisms of corrosion are discussed. Under severe conditions the use of titanium may be indicated. The use of nickel base alloys is advantageous at elevated temperatures, e.g. for chemical reactions and for evaporation processes. Examples are given for application and for prevention of corrosion. (orig.) [de

Evaluation of biocidal efficacy of copper alloy coatings in comparison with solid metal surfaces: generation of organic copper phosphate nanoflowers.

Science.gov (United States)

Gutierrez, H; Portman, T; Pershin, V; Ringuette, M

2013-03-01

To analyse the biocidal efficacy of thermal sprayed copper surfaces. Copper alloy sheet metals containing >60% copper have been shown to exhibit potent biocidal activity. Surface biocidal activity was assessed by epifluorescence microscopy. After 2-h exposure at 20 °C in phosphate-buffered saline (PBS), contact killing of Gram-negative Escherichia coli and Gram-positive Staphylococcus epidermidis by brass sheet metal and phosphor bronze was 3-4-times higher than that by stainless steel. SEM observations revealed that the surface membranes of both bacterial strains were slightly more irregular when exposed to brass sheet metal than stainless steel. However, when exposed to phosphor bronze coating, E. coli were 3-4 times larger with irregular membrane morphology. In addition, the majority of the cells were associated with spherical carbon-copper-phosphate crystalline nanostructures characteristic of nanoflowers. The membranes of many of the S. epidermidis exhibited blebbing, and a small subset was also associated with nanoflowers. Our data indicate that increasing the surface roughness of copper alloys had a pronounced impact on the membrane integrity of Gram-positive and, to a lesser degree, Gram-negative bacteria. In the presence of PBS, carbon-copper-phosphate-containing nanoflowers were formed, likely nucleated by components derived from killed bacteria. The intimate association of the bacteria with the nanoflowers and phosphor bronze coating likely contributed to their nonreversible adhesion. Thermal spraying of copper alloys provides a strategy for the rapid coating of three-dimensional organic and inorganic surfaces with biocidal copper alloys. Our study demonstrates that the macroscale surface roughness generated by the thermal spray process enhances the biocidal activity of copper alloys compared with the nanoscale surface roughness of copper sheet metals. Moreover, the coating surface topography provides conditions for the rapid formation of organic copper

Volatility from copper and tungsten alloys for fusion reactor applications

International Nuclear Information System (INIS)

Smolik, G.R.; Neilson, R.M. Jr.; Piet, S.J.

1989-01-01

Accident scenarios for fusion power plants present the potential for release and transport of activated constituents volatilized from first wall and structural materials. The extent of possible mobilization and transport of these activated species, many of which are ''oxidation driven'', is being addressed by the Fusion Safety Program at the Idaho National Engineering Laboratory (INEL). This report presents experimental measurements of volatilization from a copper alloy in air and steam and from a tungsten alloy in air. The major elements released included zinc from the copper alloy and rhenium and tungsten from the tungsten alloy. Volatilization rates of several constituents of these alloys over temperatures ranging from 400 to 1200 degree C are presented. These values represent release rates recommended for use in accident assessment calculations. 8 refs., 3 figs., 5 tabs

Radiation induced segregation and point defects in binary copper alloys

International Nuclear Information System (INIS)

Monteiro, W.A.

1984-01-01

Considerable progress, both theoretical and experimental, has been made in establishing and understanding the influence of factors such as temperature, time, displacement rate dependence and the effect of initial solute misfit on radiation induced solute diffusion and segregation. During irradiation, the composition of the alloy changes locally, due to defect flux driven non-equilibrium segregation near sinks such as voids, external surfaces and grain boundaries. This change in composition could influence properties and phenomena such as ductility, corrosion resistance, stress corrosion cracking, sputtering and blistering of materials used in thermo-nuclear reactors. In this work, the effect of 1 MeV electron irradiation on the initiation and development of segregation and defect diffusion in binary copper alloys has been studied in situ, with the aid of a high voltage electron microscope. The binary copper alloys had Be, Pt and Sn as alloying elements which had atomic radii less than, similar and greater than that of copper, respectively. It has been observed that in a wide irradiation temperature range, stabilization and growth of dislocation loops took place in Cu-Sn and Cu-Pt alloys. Whereas in the Cu-Be alloy, radiation induced precipitates formed and transformed to the stable γ phase. (Author) [pt

Method for producing superconductive wires of multifilaments which are encased in copper or a copper alloy and contain niobium and aluminium

International Nuclear Information System (INIS)

Flukiger, R.

1983-01-01

A method is disclosed for producing a superconductive wire of multifilaments having components comprising niobium and aluminum encased in copper or a copper alloy, wherein the multifilament configuration and the formation of a superconductive A15 phase are positively developed from the components disposed in a copper or copper alloy tube having an interior metallic coating serving as a diffusion barrier, by cold forming and subsequent heat treatment

Evaluation of copper alloys for fusion reactor divertor and first wall components

DEFF Research Database (Denmark)

Fabritsiev, S.A.; Zinkle, S.J.; Singh, B.N.

1996-01-01

This paper presents a critical analysis of the main factors of radiation damage limiting the possibility to use copper alloys in the ITER divertor and first wall structure. In copper alloys the most significant types of radiation damage in the proposed temperature-dose operation range are swellin...

NASA-DoD Lead-Free Electronics Project

Science.gov (United States)

Kessel, Kurt

2011-01-01

Original Equipment Manufacturers (OEMs). depots. and support contractors have to be prepared to deal with an electronics supply chain thaI increasingly provides parts with lead-free finishes. some labeled no differently and intenningled with their SnPb counterparts. Allowance oflead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free lenninations, tennination finishes, or circuit boards presents a host of concerns to customers. suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers; 2. Incompatibility oflead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system; and 3. Unknown material properties and incompatibilities that could reduce solder joint re liability.

Ultrafine-Grained Precipitation Hardened Copper Alloys by Swaging or Accumulative Roll Bonding

Directory of Open Access Journals (Sweden)

Igor Altenberger

2015-05-01

Full Text Available There is an increasing demand in the industry for conductive high strength copper alloys. Traditionally, alloy systems capable of precipitation hardening have been the first choice for electromechanical connector materials. Recently, ultrafine-grained materials have gained enormous attention in the materials science community as well as in first industrial applications (see, for instance, proceedings of NANO SPD conferences. In this study the potential of precipitation hardened ultra-fine grained copper alloys is outlined and discussed. For this purpose, swaging or accumulative roll-bonding is applied to typical precipitation hardened high-strength copper alloys such as Corson alloys. A detailed description of the microstructure is given by means of EBSD, Electron Channeling Imaging (ECCI methods and consequences for mechanical properties (tensile strength as well as fatigue and electrical conductivity are discussed. Finally the role of precipitates for thermal stability is investigated and promising concepts (e.g. tailoring of stacking fault energy for grain size reduction and alloy systems for the future are proposed and discussed. The relation between electrical conductivity and strength is reported.

Odontologic use of copper/aluminum alloys: mitochondrial respiration as sensitive parameter of biocompatibility

Directory of Open Access Journals (Sweden)

Rodrigues Luiz Erlon A.

2003-01-01

Full Text Available Copper/aluminum alloys are largely utilized in odontological restorations because they are less expensive than gold or platinum. However, tarnishing and important corrosion in intrabuccal prostheses made with copper/aluminum alloys after 28 days of use have been reported. Several kinds of food and beverage may attack and corrode these alloys. Copper is an essential component of several important enzymes directly involved in mitochondrial respiratory metabolism. Aluminum, in contrast, is very toxic and, when absorbed, plasma values as small as 1.65 to 21.55 mg/dl can cause severe lesions to the nervous system, kidneys, and bone marrow. Because mitochondria are extremely sensitive to minimal variation of cellular physiology, the direct relationship between the mitocondrial respiratory chain and cell lesions has been used as a sensitive parameter to evaluate cellular aggression by external agents. This work consisted in the polarographic study of mitochondrial respiratory metabolism of livers and kidneys of rabbits with femoral implants of titanium or copper/aluminum alloy screws. The experimental results obtained did not show physiological modifications of hepatic or renal mitochondria isolated from animals of the three experimental groups, which indicate good biocompatibility of copper/aluminum alloys and suggest their odontological use.

Creep properties of phosphorus alloyed oxygen free copper under multiaxial stress state

International Nuclear Information System (INIS)

Rui Wu; Sandstroem, Rolf; Seitisleam, Facredin

2009-10-01

Phosphorus alloyed oxygen free copper (Cu-OFP) canisters are planned to be used for spent nuclear fuel in Sweden. The copper canisters will be subjected to creep under multiaxial stress states in the repository. Creep tests have therefore been carried out at 75 deg C using double notch specimens with notch acuities of 0.5, 2, 5, and 18.8, respectively. The creep lifetime for notched specimens is considerably longer than that for the smooth one at a given net section stress, indicating that the investigated Cu-OFP is notch insensitive (notch strengthening). The notch strengthening factor in time is, for instance, greater than 70 at 180 MPa for the bluntest notch (notch acuity = 0.5). The creep lifetime is notch acuity dependent. The sharper the notch, the longer the creep lifetime is. The creep deformation is to a significant extent concentrated to the region around the notches. Different deformation on the two notches is observed. Both axial and radial strains on the failed notch are several times larger than those on the unbroken one. Linear relation between the axial and the radial strains on the notches is found. Transgranular failure is predominant, independent of stress, rupture time, and notch acuity. Adjacent to fracture, elongated grains along the stress direction, separate pores and cavities are often visible. On the unbroken notch, fewer separate cavities and cracks are only seen intergranularly for the sharper notches (notch acuity > 2). To interpret the tests for the notched creep specimens, finite element computations have been performed. A fundamental model for primary and secondary creep without fitting parameters has been used as constitutive equation. The FEM-modelling could represent the creep strain versus time curves for the notched specimens in a satisfactory way. In these curves the strain on loading is included. From the FEM-computations a stationary creep stress could be assessed, which is close to the reference stress. For a given

Recovery of aluminium, nickel-copper alloys and salts from spent fluorescent lamps.

Science.gov (United States)

Rabah, Mahmoud A

2004-01-01

This study explores a combined pyro-hydrometallurgical method to recover pure aluminium, nickel-copper alloy(s), and some valuable salts from spent fluorescent lamps (SFLs). It also examines the safe recycling of clean glass tubes for the fluorescent lamp industry. Spent lamps were decapped under water containing 35% acetone to achieve safe capture of mercury vapour. Cleaned glass tubes, if broken, were cut using a rotating diamond disc to a standard shorter length. Aluminium and copper-nickel alloys in the separated metallic parts were recovered using suitable flux to decrease metal losses going to slag. Operation variables affecting the quality of the products and the extent of recovery with the suggested method were investigated. Results revealed that total loss in the glass tube recycling operation was 2% of the SFLs. Pure aluminium meeting standard specification DIN 1712 was recovered by melting at 800 degrees C under sodium chloride/carbon flux for 20 min. Standard nickel-copper alloys with less than 0.1% tin were prepared by melting at 1250 degrees C using a sodium borate/carbon flux. De-tinning of the molten nickel-copper alloy was carried out using oxygen gas. Tin in the slag as oxide was recovered by reduction using carbon or hydrogen gas at 650-700 degrees C. Different valuable chloride salts were also obtained in good quality. Further research is recommended on the thermodynamics of nickel-copper recovery, yttrium and europium recovery, and process economics.

Recovery of aluminium, nickel-copper alloys and salts from spent fluorescent lamps

International Nuclear Information System (INIS)

Rabah, Mahmoud A.

2004-01-01

This study explores a combined pyro-hydrometallurgical method to recover pure aluminium, nickel-copper alloy(s), and some valuable salts from spent fluorescent lamps (SFLs). It also examines the safe recycling of clean glass tubes for the fluorescent lamp industry. Spent lamps were decapped under water containing 35% acetone to achieve safe capture of mercury vapour. Cleaned glass tubes, if broken, were cut using a rotating diamond disc to a standard shorter length. Aluminium and copper-nickel alloys in the separated metallic parts were recovered using suitable flux to decrease metal losses going to slag. Operation variables affecting the quality of the products and the extent of recovery with the suggested method were investigated. Results revealed that total loss in the glass tube recycling operation was 2% of the SFLs. Pure aluminium meeting standard specification DIN 1712 was recovered by melting at 800 deg. C under sodium chloride/carbon flux for 20 min. Standard nickel-copper alloys with less than 0.1% tin were prepared by melting at 1250 deg. C using a sodium borate/carbon flux. De-tinning of the molten nickel-copper alloy was carried out using oxygen gas. Tin in the slag as oxide was recovered by reduction using carbon or hydrogen gas at 650-700 deg. C. Different valuable chloride salts were also obtained in good quality. Further research is recommended on the thermodynamics of nickel-copper recovery, yttrium and europium recovery, and process economics

Austenitic stainless steels and high strength copper alloys for fusion components

International Nuclear Information System (INIS)

Rowcliffe, A.F.; Zinkle, S.J.; Alexander, D.J.; Stubbins, J.F.

1998-01-01

An austenitic stainless steel (316LN), an oxide-dispersion-strengthened copper alloy (GlidCop A125), and a precipitation-hardened copper alloy (Cu-Cr-Zr) are the primary structural materials for the ITER first wall/blanket and divertor systems. While there is a long experience of operating 316LN stainless steel in nuclear environments, there is no prior experience with the copper alloys in neutron environments. The ITER first wall (FW) consists of a stainless steel shield with a copper alloy heat sink bonded by hot isostatic pressing (HIP). The introduction of bi-layer structural material represents a new materials engineering challenge; the behavior of the bi-layer is determined by the properties of the individual components and by the nature of the bond interface. The development of the radiation damage microstructure in both classes of materials is summarized and the effects of radiation on deformation and fracture behavior are considered. The initial data on the mechanical testing of bi-layers indicate that the effectiveness of GlidCop A125 as a FW heat sink material is compromised by its strongly anisotropic fracture toughness and poor resistance to crack growth in a direction parallel to the bi-layer interface. (orig.)

Gold-Copper alloy “nano-dumplings” with tunable compositions and plasmonic properties

International Nuclear Information System (INIS)

Verma, Manoj; Kedia, Abhitosh; Kumar, P. Senthil

2016-01-01

The unique yet tunable optical properties of plasmonic metal nanoparticles have made them attractive targets for a wide range of applications including nanophotonics, molecular sensing, catalysis etc. Such diverse applications that require precisely stable / reproducible plasmonic properties depend sensitively on the particle morphology ie. the shape, size and constituents. Herein, we systematically study the size / shape controlled synthesis of gold-copper “dumpling” shaped alloy nanoparticles by simultaneous reduction of gold and copper salts in the PVP-methanol solute-solvent system, by effectively utilizing the efficient but mild reduction as well as capping abilities of Poly (N-vinylpyrrolidone). Introduction of copper salts not only yielded the alloy nanoparticles, but also slowed down the growth process to maintain high mono-dispersity of the new shapes evolved. Copper and gold has different lattice constants (0.361 and 0.408 nm respectively) and hence doping/addition/replacement of copper atoms to gold FCC unit cell introduces strain into the lattice which is key parameter to the shape evolution in anisotropic nanoparticles. Synthesized alloy nanoparticles were characterized by UV-visible absorption spectroscopy, XRD and TEM imaging.

Removal of brownish-black tarnish on silver–copper alloy objects with sodium glycinate

Energy Technology Data Exchange (ETDEWEB)

Cura D’Ars de Figueiredo, João, E-mail: joaoc@ufmg.br; Asevedo, Samara Santos, E-mail: samaranix@hotmail.com; Barbosa, João Henrique Ribeiro, E-mail: joaohrb@yahoo.com.br

2014-10-30

Highlights: • The use of glycinate to remove brownish-black tarnish on silver–copper alloy objects is studied. • The method is easy to use and harmless. It is based in the coordination of Ag and Cu in tarnish with glycinate. • The surface of corroded silver objects and products of reaction were studied and glycinate showed to be very selective for Ag(I) and Cu(II). The selectivity for Ag(I) was studied by means of quantum chemical calculations. - Abstract: This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver–copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver–copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver–copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver–copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver–copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver–copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish

Removal of brownish-black tarnish on silver–copper alloy objects with sodium glycinate

International Nuclear Information System (INIS)

Cura D’Ars de Figueiredo, João; Asevedo, Samara Santos; Barbosa, João Henrique Ribeiro

2014-01-01

Highlights: • The use of glycinate to remove brownish-black tarnish on silver–copper alloy objects is studied. • The method is easy to use and harmless. It is based in the coordination of Ag and Cu in tarnish with glycinate. • The surface of corroded silver objects and products of reaction were studied and glycinate showed to be very selective for Ag(I) and Cu(II). The selectivity for Ag(I) was studied by means of quantum chemical calculations. - Abstract: This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver–copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver–copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver–copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver–copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver–copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver–copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish

Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

Sputtering induced surface composition changes in copper-palladium alloys

International Nuclear Information System (INIS)

Sundararaman, M.; Sharma, S.K.; Kumar, L.; Krishnan, R.

1981-01-01

It has been observed that, in general, surface composition is different from bulk composition in multicomponent materials as a result of ion beam sputtering. This compositional difference arises from factors like preferential sputtering, radiation induced concentration gradients and the knock-in effect. In the present work, changes in the surface composition of copper-palladium alloys, brought about by argon ion sputtering, have been studied using Auger electron spectroscopy. Argon ion energy has been varied from 500 eV to 5 keV. Enrichment of palladium has been observed in the sputter-altered layer. The palladium enrichment at the surface has been found to be higher for 500 eV argon ion sputtering compared with argon ion sputtering at higher energies. Above 500 eV, the surface composition has been observed to remain the same irrespective of the sputter ion energy for each alloy composition. The bulk composition ratio of palladium to copper has been found to be linearly related to the sputter altered surface composition ratio of palladium to copper. These results are discussed on the basis of recent theories of alloy sputtering. (orig.)

Lead and lead-based alloys as waste matrix materials

International Nuclear Information System (INIS)

Arustamov, A.E.; Ojovan, M.I.; Kachalov, M.B.

1999-01-01

Metals and alloys with relatively low melting temperatures such as lead and lead-based alloys are considered in Russia as prospective matrices for encapsulation of spent nuclear fuel in containers in preparation for final disposal in underground repositories. Now lead and lead-based alloys are being used for conditioning spent sealed radioactive sources at radioactive waste disposal facilities

Laser cladding of stainless steel with a copper-silver alloy to generate surfaces of high antimicrobial activity

Science.gov (United States)

Hans, Michael; Támara, Juan Carlos; Mathews, Salima; Bax, Benjamin; Hegetschweiler, Andreas; Kautenburger, Ralf; Solioz, Marc; Mücklich, Frank

2014-11-01

Copper and silver are used as antimicrobial agents in the healthcare sector in an effort to curb infections caused by bacteria resistant to multiple antibiotics. While the bactericidal potential of copper and silver alone are well documented, not much is known about the antimicrobial properties of copper-silver alloys. This study focuses on the antibacterial activity and material aspects of a copper-silver model alloy with 10 wt% Ag. The alloy was generated as a coating with controlled intermixing of copper and silver on stainless steel by a laser cladding process. The microstructure of the clad was found to be two-phased and in thermal equilibrium with minor Cu2O inclusions. Ion release and killing of Escherichia coli under wet conditions were assessed with the alloy, pure silver, pure copper and stainless steel. It was found that the copper-silver alloy, compared to the pure elements, exhibited enhanced killing of E. coli, which correlated with an up to 28-fold increased release of copper ions. The results show that laser cladding with copper and silver allows the generation of surfaces with enhanced antimicrobial properties. The process is particularly attractive since it can be applied to existing surfaces.

Swelling of pure copper and copper alloys after high fluence irradiation in FFTF [Fast Flux Test Facility] at approximately 4500C

International Nuclear Information System (INIS)

Garner, F.A.; Brager, H.R.

1986-03-01

The swelling of pure copper and various copper-base alloys has been determined at 47.2 dpa after irradiation in FFTF-MOTA at ∼450 0 C. Data are also becoming available at 63.3 dpa. The alloys tend to fall into two broad categories, those that swell appreciably, sometimes with an S-shaped behavior, and those that resist swelling to very high neutron exposures. It appears that copper may have an intrinsic swelling rate of ∼1%/dpa that is often not reached due to its tendency toward saturation of swelling. The most swelling-resistant alloys examined to date are CuAl25, MZC and Cu-2.0Be

Lead-free, bronze-based surface layers for wear resistance in axial piston hydraulic pumps

Energy Technology Data Exchange (ETDEWEB)

Vetterick, Gregory Alan [Iowa State Univ., Ames, IA (United States)

2010-01-01

Concerns regarding the safety of lead have provided sufficient motivation to develop substitute materials for the surface layer on a thrust bearing type component known as a valve plate in axial piston hydraulic pumps that consists of 10% tin, 10% lead, and remainder cooper (in wt. %). A recently developed replacement material, a Cu-10Sn-3Bi (wt.%) P/M bronze, was found to be unsuitable as valve plate surface layer, requiring the development of a new alloy. A comparison of the Cu-1-Sn-10Pb and Cu-10Sn-3Bi powder metal valve plates showed that the differences in wear behavior between the two alloys arose due to the soft phase bismuth in the alloy that is known to cause both solid and liquid metal embrittlement of copper alloys.

Discontinuous precipitation in copper base alloys

Indian Academy of Sciences (India)

Discontinuous precipitation (DP) is associated with grain boundary migration in the wake of which alternate plates of the precipitate and the depleted matrix form. Some copper base alloys show DP while others do not. In this paper the misfit strain parameter, , has been calculated and predicted that if 100 > ± 0.1, DP is ...

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

2015-08-15

Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

FEATURES OF SPHEROIDIZING MODIFICATION OF HIGH-STRENGTH CAST IRON WITH MASTER ALLOYS BASED ON COPPER

Directory of Open Access Journals (Sweden)

A. S. Kalinichenko

2016-01-01

Full Text Available The increase of efficiency of modification process for ductile iron is topically, thereby increasing its mechanical and operational properties. For these purposes, in practice, various magnesium containing alloys are used, including «heavy» ones on the basis of Copper and Nickel. The analysis has shown that the application of bulk inoculating alloys based on copper basis were not effectively due to long dissolution period. From this point of view, the interest is high-speed casting, allowing the production of inoculating alloys in the form of strips – chips that are characterized by a low dissolution time and low piroeffekt. The aim of this work is to study the features of structure formation in nodular cast iron using different spheroidizing alloys based on copper. Studies have shown that the transition from the use of briquetted form alloys based on copper and magnesium to the «chips-inoculating alloys» allowed increasing the efficiency of the spheroidizing process. Further improvement in the quality of ductile iron can be achieved by the use in «chip-inoculating alloys» additives of nanosized yttrium oxide powder. 

Mechanical properties of copper-lithium alloys produced by mechanic alloyed and hot extrusion

International Nuclear Information System (INIS)

Castillo B, Ricardo; Gorziglia S, Ezio; Penaloza V, Augusto

2004-01-01

In this work are presented the progress carried out on the characterization of some physical and mechanical properties, together with the determination of the micro mechanism of fracture of the Cu-2% wt Li, that was obtained by mechanical alloying followed hot extrusion at 500 o C and 700 o C. Hardness and tensile mechanical tests were performed together with metallographic and fractographic analysis. The experimental results obtained with powders of the Cu-Li alloy studied are compared with powder of pure copper, under similar test conditions. The results show that by hot extrusion was allowed to obtain very high densification levels for the materials under study. Moreover, it was found that lithium reduce both the tensile strength and elongation, of copper by a mechanism of embrittlement. The results are compares with the literature (au)

Development of bonding techniques between tungsten and copper alloy for plasma facing components by HIP method. 1. Bonding between tungsten and oxygen free copper

International Nuclear Information System (INIS)

Saito, Shigeru; Fukaya, Kiyoshi; Ishiyama, Shintaro; Eto, Motokuni; Akiba, Masato

1999-08-01

In recent years, it has been considered that W (tungsten) is one of candidate materials for armor tiles of plasma facing components, like first wall or divertor, of fusion reactor. On the other hand, oxygen free high thermal conductivity (OFHC)-copper is proposed as heat sink materials behind the plasma facing materials because of its high thermal conductivity. However, plasma facing components are exposed to cyclic high heat load and heavily irradiated by 14 MeV neutron. Under these conditions, many unfavorable effects, for instance, thermal stresses of bonding interface, irradiation damage and He atom production by nuclear transmutation, will be decreased bonding strength between W and Cu alloys. Therefore, it is necessary to develop a reliable bonding techniques in order to make plasma facing components which can resist them. Then, we started the bonding technology development by hot isostatic press (HIP) method to bond W with Cu alloys. In this experiments, to optimize HIP bonding conditions, four point bending were performed for each bonded conditions at temperature from R.T. to 873 K and we could get the best HIP bonding conditions for W and OFHC-Cu as 1273 K x 2 hours x 147 MPa. To evaluate bonding strength of the specimen bonded at these conditions, tensile tests were also performed at same temperature range. The tensile strength was similar with OFHC-Cu which were treated at same conditions. (author)

On the mechanical and electrical properties of copper-silver and copper-silver-zirconium alloys deposits manufactured by cold spray

Energy Technology Data Exchange (ETDEWEB)

Coddet, Pierre, E-mail: pierre-laurent.coddet@univ-orleans.fr [Laboratoire National des Champs Magnétiques Intenses (LNCMI – CNRS-UPS-INSA-UJF), 25 Rue des Martyrs, 38042 Grenoble (France); Verdy, Christophe; Coddet, Christian [UTBM, Site de Sévenans, 90010 Belfort Cedex (France); Debray, François [Laboratoire National des Champs Magnétiques Intenses (LNCMI – CNRS-UPS-INSA-UJF), 25 Rue des Martyrs, 38042 Grenoble (France)

2016-04-26

In this work, several copper alloy deposits were manufactured by cold spray with helium as accelerating and carrier gas. Electrical conductivity was measured to establish the potential of cold spray as a manufacturing process for high strength (>500 MPa) and high conductivity (>90% IACS) copper alloys. The deposits which are characterized by a low oxygen content (<200 ppm) and a low porosity level (<0.1%) present yield strength values up to about 700 MPa and electrical conductivity values up to 58.2 MS/m (100.3% IACS). Results show that, even if a compromise has to be made between the properties according to the objectives of the application, this additive manufacturing route appears suitable for the production of large copper alloys parts with high mechanical properties and high electrical and thermal conductivity. The role of alloy composition and post heat treatments on the strength and conductivity of the deposits was especially considered in this work. Cold spray deposits properties were finally compared with those obtained with other manufacturing routes.

On the mechanical and electrical properties of copper-silver and copper-silver-zirconium alloys deposits manufactured by cold spray

International Nuclear Information System (INIS)

Coddet, Pierre; Verdy, Christophe; Coddet, Christian; Debray, François

2016-01-01

In this work, several copper alloy deposits were manufactured by cold spray with helium as accelerating and carrier gas. Electrical conductivity was measured to establish the potential of cold spray as a manufacturing process for high strength (>500 MPa) and high conductivity (>90% IACS) copper alloys. The deposits which are characterized by a low oxygen content (<200 ppm) and a low porosity level (<0.1%) present yield strength values up to about 700 MPa and electrical conductivity values up to 58.2 MS/m (100.3% IACS). Results show that, even if a compromise has to be made between the properties according to the objectives of the application, this additive manufacturing route appears suitable for the production of large copper alloys parts with high mechanical properties and high electrical and thermal conductivity. The role of alloy composition and post heat treatments on the strength and conductivity of the deposits was especially considered in this work. Cold spray deposits properties were finally compared with those obtained with other manufacturing routes.

Auger electron spectroscopy study of surface segregation in the binary alloys copper-1 atomic percent indium, copper-2 atomic percent tin, and iron-6.55 atomic percent silicon

Science.gov (United States)

Ferrante, J.

1973-01-01

Auger electron spectroscopy was used to examine surface segregation in the binary alloys copper-1 at. % indium, copper-2 at. % tin and iron-6.55 at. % silicon. The copper-tin and copper-indium alloys were single crystals oriented with the /111/ direction normal to the surface. An iron-6.5 at. % silicon alloy was studied (a single crystal oriented in the /100/ direction for study of a (100) surface). It was found that surface segregation occurred following sputtering in all cases. Only the iron-silicon single crystal alloy exhibited equilibrium segregation (i.e., reversibility of surface concentration with temperature) for which at present we have no explanation. McLean's analysis for equilibrium segregation at grain boundaries did not apply to the present results, despite the successful application to dilute copper-aluminum alloys. The relation of solute atomic size and solubility to surface segregation is discussed. Estimates of the depth of segregation in the copper-tin alloy indicate that it is of the order of a monolayer surface film.

Mechanical Behavior and Fracture Properties of NiAl Intermetallic Alloy with Different Copper Contents

Directory of Open Access Journals (Sweden)

Tao-Hsing Chen

2016-03-01

Full Text Available The deformation behavior and fracture characteristics of NiAl intermetallic alloy containing 5~7 at% Cu are investigated at room temperature under strain rates ranging from 1 × 10−3 to 5 × 103 s−1. It is shown that the copper contents and strain rate both have a significant effect on the mechanical behavior of the NiAl alloy. Specifically, the flow stress increases with an increasing copper content and strain rate. Moreover, the ductility also improves as the copper content increases. The change in the mechanical response and fracture behavior of the NiAl alloy given a higher copper content is thought to be the result of the precipitation of β-phase (Ni,CuAl and γ'-phase (Ni,Cu3Al in the NiAl matrix.

Creep crack growth in phosphorus alloyed oxygen free copper

Energy Technology Data Exchange (ETDEWEB)

Wu, Rui; Seitisleam, Facredin (Swerea KIMAB (Sweden)); Sandstroem, Rolf; Jin, Lai-Zhe (Materials Science and Engineering, Royal Inst. of Technology (Sweden))

2011-01-15

Using standard compact tension (CT) specimens taken from a pierce and draw cylinder, creep crack growth (CCG) has been studied in phosphorus-alloyed oxygen-free copper (Cu-OFP) parent metal at 22, 75, 175, and 215 deg C. Pre- and post-test metallography are performed. At higher temperatures the rupture time of CCG is shorter by a factor up of 65 than that of uniaxial at same stress/reference stress. At 175 and 215 deg C, crack does grow by creep about 10 mm before final instantaneous failure. In contrast, there is hardly any visible crack growth at 22 and 75 deg C. The tests were interrupted after 5000 to 13000 hours. For ruptured tests at 175 and 215 deg C, strongly elongated and deformed grains are observed adjacent to crack. Extensive and intergranular creep cavities and microcracks are found several mm around crack. For interrupted tests at 22 and 75 deg C, strongly elongated and deformed grains, creep cavities, as well as microcracks are observed close to crack tip. Surface cracks from both sides have initiated and grown about 45 deg to the load direction towards inside. For the interrupted tests, hardness adjacent to crack tip has more than doubled because of work hardening, or heavy deformation. This is consistent with large crack tip opening. The true strain at the crack tip is estimated to 10 and 4 for the tests at 22 and 75 deg C, respectively. The stress state behind the crack tip has been modelled with FEM. Stress relaxation after loading has also been taken into account. A model for the creep damage based on the creep strain rate has been formulated that can describe the uniaxial creep rupture data without fitting parameters. Based on the formulation for the creep damage, a model for the crack propagation has been set up. When the creep damage has reached the value unity in front of the crack tip, the crack is assumed to propagate. Taking multiaxial effects into account the observed life times of the CT specimens can be well described. The multiaxial

Creep crack growth in phosphorus alloyed oxygen free copper

International Nuclear Information System (INIS)

Wu, Rui; Seitisleam, Facredin; Sandstroem, Rolf; Jin, Lai-Zhe

2011-01-01

Using standard compact tension (CT) specimens taken from a pierce and draw cylinder, creep crack growth (CCG) has been studied in phosphorus-alloyed oxygen-free copper (Cu-OFP) parent metal at 22, 75, 175, and 215 deg C. Pre- and post-test metallography are performed. At higher temperatures the rupture time of CCG is shorter by a factor up of 65 than that of uniaxial at same stress/reference stress. At 175 and 215 deg C, crack does grow by creep about 10 mm before final instantaneous failure. In contrast, there is hardly any visible crack growth at 22 and 75 deg C. The tests were interrupted after 5000 to 13000 hours. For ruptured tests at 175 and 215 deg C, strongly elongated and deformed grains are observed adjacent to crack. Extensive and intergranular creep cavities and microcracks are found several mm around crack. For interrupted tests at 22 and 75 deg C, strongly elongated and deformed grains, creep cavities, as well as microcracks are observed close to crack tip. Surface cracks from both sides have initiated and grown about 45 deg to the load direction towards inside. For the interrupted tests, hardness adjacent to crack tip has more than doubled because of work hardening, or heavy deformation. This is consistent with large crack tip opening. The true strain at the crack tip is estimated to 10 and 4 for the tests at 22 and 75 deg C, respectively. The stress state behind the crack tip has been modelled with FEM. Stress relaxation after loading has also been taken into account. A model for the creep damage based on the creep strain rate has been formulated that can describe the uniaxial creep rupture data without fitting parameters. Based on the formulation for the creep damage, a model for the crack propagation has been set up. When the creep damage has reached the value unity in front of the crack tip, the crack is assumed to propagate. Taking multiaxial effects into account the observed life times of the CT specimens can be well described. The multiaxial

The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

Science.gov (United States)

Werden, Jesse

The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

In vitro and in vivo corrosion evaluation of nickel-chromium- and copper-aluminum-based alloys.

Science.gov (United States)

Benatti, O F; Miranda, W G; Muench, A

2000-09-01

The low resistance to corrosion is the major problem related to the use of copper-aluminum alloys. This in vitro and in vivo study evaluated the corrosion of 2 copper-aluminum alloys (Cu-Al and Cu-Al-Zn) compared with a nickel-chromium alloy. For the in vitro test, specimens were immersed in the following 3 corrosion solutions: artificial saliva, 0.9% sodium chloride, and 1.0% sodium sulfide. For the in vivo test, specimens were embedded in complete dentures, so that one surface was left exposed. The 3 testing sites were (1) close to the oral mucosa (partial self-cleaning site), (2) surface exposed to the oral cavity (self-cleaning site), and (3) specimen bottom surface exposed to the saliva by means of a tunnel-shaped perforation (non-self-cleaning site). Almost no corrosion occurred with the nickel-chromium alloy, for either the in vitro or in vivo test. On the other hand, the 2 copper-aluminum-based alloys exhibited high corrosion in the sulfide solution. These same alloys also underwent high corrosion in non-self-cleaning sites for the in vivo test, although minimal attack was observed in self-cleaning sites. The nickel-chromium alloy presented high resistance to corrosion. Both copper-aluminum alloys showed considerable corrosion in the sulfide solution and clinically in the non-self-cleaning site. However, in self-cleaning sites these 2 alloys did not show substantial corrosion.

Superconducting properties of a copper-ternary alloy

International Nuclear Information System (INIS)

Sharma, R.G.; Aleksivskii, N.E.

1975-01-01

The superconducting properties of a copper-ternary alloy of the type Cu 93 Nb 5 Sn 2 , subjected to a variety of mechanical and heat treatments, are discussed. The as-cast alloy does not turn superconducting down to 4.5K; but the cold-work and subsequent prescribed heat treatments are found to raise the transition temperature Tsub(c) to values as high as 18.1K and the critical current density Jsub(c) (of the Nb 3 Sn formed during annealing) to a value of 3.6x10 5 Acm -2 (at 4.2K and 30kOe). Various possibilities to improve Jsub(c) of this alloy to still higher values are discussed. The as-cast alloy is ductile, easy to draw, and economical from a technical point of view, and the annealed wires and strips are flexible enough for winding. (author)

Mechanical property and conductivity changes in several copper alloys after 13.5 dpa neutron irradiation

International Nuclear Information System (INIS)

Ames, M.; Kohse, G.; Lee, T.S.; Grant, N.J.; Harling, O.K.

1986-01-01

A scoping experiment in which 25 different copper materials of 17 alloy compositions were irradiated to approx.13.5 dpa approx.400 0 C in a fast reactor is described. The materials include rapidly solidified (RS) alloys, with and without oxide dispersion strengthening, as well as conventionally processed alloys. Immersion density (swelling), electrical conductivity (which can be related to thermal conductivity), and yield stress and ductility by miniature disk bend testing have been measured before and after irradiation. It was found, in general, that the Rs alloys are stable under irradiation to 13.5 dpa, showing small conductivity changes and little or no swelling. Reduction of strength and ductility, in post-irradiation tests at the irradiation temperature, are not generally observed. Some conventionally processed alloys also performed well, although irradiation softening and swelling of several percent were observed in some cases, and pure copper swelled in excess of 5%. It is concluded that a number of copper alloys should receive further study, and that higher dose irradiations will be required to establish the limits of swelling suppression in these alloys

New mechanical chemical equilibrium in the copper-zinc alloys obtained by mechanical alloying

International Nuclear Information System (INIS)

Dianez, M.J; Criado, J.M; Donoso, E; Diaz, G

2006-01-01

A series of copper zinc alloys have been synthesized in the entire composition range Cu10Zn to Cu70Zn respectively, by mechanical alloying at room temperature in a planetary high-energy mill. A mechanism is proposed for the mechanical alloying reaction of the copper and zinc. It is made clear that the mechanical treatment considerably extends the range of composition of the α phase up to a content of 41% zinc, instead of the 36% accepted by the conventional phase diagrams. Exact determinations of the phase α reticular parameter were carried out as a function of its composition which can be used to determine the zinc content of the brass α. The results show that a brass phase α may be obtained containing 49% zinc in samples that include a mixture of phases α and β' after reaching stationary state as a function of the milling time. The stability field of phases β' and γ also displace noticeably higher values than those expected from the conventional binary Cu-Zn diagram. This behavior has been explained as a function of the nanometric texture generated by the milling (CW)

Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

International Nuclear Information System (INIS)

Duran, J.; Amo, J. M.; Duran, C. M.

2001-01-01

It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

Analysis of uranium and of some of its compounds and alloys. Copper spectrophotometric determination

International Nuclear Information System (INIS)

Copper determination in uranium, uranium oxides (UO 2 , UO 3 , U 3 O 8 ), ammonium diuranate, U-Al-Fe alloy (700 ppm Al and 300 ppm Fe) and U-Mo alloy (1.1 percent Mo) by acid dissolution reduction of copper by hydroxylamine hydrochloride and formation of a complex with diquinolyle-2,2' amyl alcohol (pH value 6 to 7) and spectrophotometry at 550 nm. The method is applicable for copper content between 5 to 40 ppm in respect of uranium contained in the material [fr

A study of copper precipitation in the thermally aged FeCu alloy using SANS

Energy Technology Data Exchange (ETDEWEB)

Park, D. G.; Kim, J. H.; Kwon, S. C.; Kim, W. W. [Korea Atomic Energy Research Institute, Taejon (Korea, Republic of); Lee, M. N.; Koo, Y. M. [Pohang University of Science and Technology, Pohang (Korea, Republic of)

2005-07-01

The continued operation or lifetime extension of a number of nuclear power plant around the world requires an understanding of the damage imparted to the reactor pressure vessel (RPV) steel by radiation. Irradiation embrittlement of nuclear reactor pressure vessel steels results from a high number of nanometer sized Cu rich precipitates (CRPs) and sub-nanometer defect-solute clusters. The copper precipitation leads to a distortion of the crystal lattice surrounding the copper precipitates and yields an internal micro-stress. In order to study the effect of copper precipitation on the steel embrittlement under neutron irradiation, the characteristics of nano size defects were investigated using small angle neutron scattering (SANS) in the thermal aged FeCu model alloys. The results on the precipitation composition, number density, size distribution and matrix composition obtained using a high resolution TEM and SANS are compared and contrasted.

Defect microstructure in copper alloys irradiated with 750 MeV protons

DEFF Research Database (Denmark)

Zinkle, S.J.; Horsewell, A.; Singh, B.N.

1994-01-01

Transmission electron microscopy (TEM) disks of pure copper and solid solution copper alloys containing 5 at% of Al, Mn, or Ni were irradiated with 750 MeV protons to damage levels between 0.4 and 2 displacements per atom (dpa) at irradiation temperatures between 60 and 200 degrees C. The defect...... significant effect on the total density of small defect clusters, but they did cause a significant decrease in the fraction of defect clusters resolvable as SFT to similar to 20 to 25%. In addition, the dislocation loop density (> 5 nm diameter) was more than an order of magnitude higher in the alloys...

Structural changes in a copper alloy due to helium implantation

International Nuclear Information System (INIS)

Moreno, D.; Eliezer, D.

1996-01-01

The most suitable nuclear fusion reaction for energy production occurs between the two heavy hydrogen isotopes, deuterium and tritium. Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

A novel method for direct solder bump pull testing using lead-free solders

Science.gov (United States)

Turner, Gregory Alan

This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

The effect of processing techniques on microstructural and tribological properties of copper-based alloys

International Nuclear Information System (INIS)

Vencl, Aleksandar; Rajkovic, Viseslava; Zivic, Fatima; Mitrović, Slobodan; Cvijović-Alagić, Ivana; Jovanovic, Milan T.

2013-01-01

Three copper-based alloys, i.e. two composites reinforced with Al 2 O 3 particles and fabricated through PM route and Cu–Cr–Zr alloy processed by the vacuum melting and casting technique were the object of this investigation. Light microscope, scanning electron microscope (SEM) equipped with electron X-ray spectrometer (EDS) and transmission electron microscope (TEM) were used for microstructural characterization. The ball-on-disc nanotribometer served for wear and friction tests applying low sliding speeds (6, 8 and 10 mm/s) at constant load (1 N). The objective of the paper was to investigate the effect of different processing techniques on microstructure, thermal stability and the tribological characteristics of composites and copper ingot alloy. Nano-sized Al 2 O 3 particles (less than 100 nm in size) are present not only in the copper matrix of Cu–2.5 wt.% Al composite, obtained by internal oxidation, but they are also formed at the grain boundaries preventing the grain growth and providing very small grain size. During the high temperature annealing (in the range 300–950 o C) composites behaved much better than the ingot alloy. The highest thermal stability showed Cu–2.5 wt.% Al composite. The pinning effect of nano-sized Al 2 O 3 particles prevents the grain growth slowing down recrystallization of this composite up to 900 o C. Micro-sized Al 2 O 3 particles in Cu–5 wt.% Al 2 O 3 composite, processed by mechanical annealing, are not effective in preventing dislocation motion and the grain growth, whereas microstructure of Cu–0.4 wt.% Cr–0.08 wt.% Zr ingot alloy was completely recrystallized around 550 o C. Cu–2.5 wt.% Al composite showed the best wear resistance, approximately 2.5 times higher than that of Cu–5 wt.% Al 2 O 3 composite. High hardness and nano-sized Al 2 O 3 particles size combined with the fine-grain structure are the main parameters leading to the improved wear resistance of the Cu–2.5Al composite.

Effects of neutron irradiation to 63 dpa on the properties of various commercial copper alloys

International Nuclear Information System (INIS)

Brager, H.R.

1985-04-01

High purity copper and six commercial copper alloys were neutron irradiated to 47 and 63 dpa at about 450 0 C in the FFTF. Immersion density measurements showed a wide range of swelling behavior after irradiation to 63 dpa. At one extreme was CuBe in the aged and tempered (AT) condition which had densified slightly. At the other extreme was 20% CW Cu-0.1% Ag which swelled over 45%. Electrical resistivity measurements followed trends similar to previously published results for the same alloys irradiated to 16 dpa: a continued change in conductivity with fluence which appears to relate to void formation, transmutation products and coarsening of second phase precipitates. These results were compared with electrical conductivity of unirradiated alloys examined after aging for 10,000 hours. The most irradiation resistant high-conductivity copper alloys examined after 63 dpa are A125 and MZC. Cu-2.0Be, only a moderate-conductivity alloy, exhibits very consistent irradiation resistant properties

A new hardware and software developed for copper alloy analyser type XRFA-5

International Nuclear Information System (INIS)

Lakatos, T.; Kovacs, P.; Szadai, J.; Szekely, G.

1991-01-01

In the production of copper alloys a large amount of waste of unknown origin and composition is melted, and rapid analysis of the melt is important. A copper alloy analyzer based on the energy-dispersive x-ray fluorescence was developed in ATOMKI earlier for copper smelting plants in Hungary. The equipment has recently been upgraded by its connection to IBM PC/AT computer. A digital signal processor and analyzer module, a new software tool for the automatic determination of eight elements, and a stand-alone analyzer program DISIP was developed. The upgraded analyzer type XRFA-5.01 is presented briefly. (R.P.) 3 refs

The determination of sulphur in copper, nickel and aluminium alloys by proton activation analysis

International Nuclear Information System (INIS)

Vandecasteele, C.; Dewaele, J.; Esprit, M.; Goethals, P.

1981-01-01

The 34 S(p,n) 34 sup(m)Cl reaction, induced by 13 MeV protons is used for the determination of sulphur in copper, nickel and aluminium alloys. The 34 sup(m)Cl is separated by repeated precipitation as silver chloride. The results obtained were resp. 3.08 +- 0.47, 1.47 +- 0.17 and -1 for copper, nickel and aluminium alloys. (orig.)

Properties of experimental copper-aluminium-nickel alloys for dental post-and-core applications.

Science.gov (United States)

Rittapai, Apiwat; Urapepon, Somchai; Kajornchaiyakul, Julathep; Harniratisai, Choltacha

2014-06-01

This study aimed to develop a copper-aluminium-nickel alloy which has properties comparable to that of dental alloys used for dental post and core applications with the reasonable cost. Sixteen groups of experimental copper alloys with variants of 3, 6, 9, 12 wt% Al and 0, 2, 4, 6 wt% Ni were prepared and casted. Their properties were tested and evaluated. The data of thermal, physical, and mechanical properties were analyzed using the two-way ANOVA and Tukey's test (α=0.05). The alloy toxicity was evaluated according to the ISO standard. The solidus and liquidus points of experimental alloys ranged from 1023℃ to 1113℃ and increased as the nickel content increased. The highest ultimate tensile strength (595.9 ± 14.2 MPa) was shown in the Cu-12Al-4Ni alloy. The tensile strength was increased as the both elements increased. Alloys with 3-6 wt% Al exhibited a small amount of 0.2% proof strength. Accordingly, the Cu-9Al-2Ni and Cu-9Al-4Ni alloys not only demonstrated an appropriate modulus of elasticity (113.9 ± 8.0 and 122.8 ± 11.3 GPa, respectively), but also had a value of 0.2% proof strength (190.8 ± 4.8 and 198.2 ± 3.4 MPa, respectively), which complied with the ISO standard requirement (>180 MPa). Alloys with the highest contents of nickel (6 wt% Ni) revealed a widespread decolourisation zone (5.0-5.9 mm), which correspondingly produced the largest cell response, equating positive control. The copper alloys fused with 9 wt% Al and 2-4 wt% Ni can be considered for a potential use as dental post and core applications.

The effect of neutron spectrum on the mechanical and physical properties of pure copper and copper alloys

International Nuclear Information System (INIS)

Fabritsiev, S.A.; Pokrovsky, A.S.; Sandakov, V.A.; Zinkle, S.J.; Rowcliffe, A.F.; Edwards, D.J.; Garner, F.A.; Singh, B.N.; Barabash, V.R.

1996-01-01

The electrical resistivity and tensile properties of copper and oxide dispersion strengthened (DS) copper alloys have been measured before and after fission neutron irradiation to damage levels of 0.5 to 5 displacements per atom (dps) at ∼100 to 400 degrees C. Some of the specimens were irradiated inside a 1.5 mm Cd shroud in order to reduce the thermal neutron flux. The electrical resistivity data could be separated into two components, a solid transmutation component Δρ tr which was proportional to thermal neutron fluence and a radiation defect component Δρ rd which was independent of the displacement dose. The saturation value for Δρ rd was ∼1.2 nanohm-meters for pure copper and ∼1.6 nanohm-meters for the DS copper alloys irradiated at 100 degrees C in positions with a fast-to-thermal neutron flux ratio of 5. Considerable radiation hardening was observed in all specimens at irradiation temperatures below 200 degrees C. The yield strength was relatively insensitive to neutron spectrum in specimens strengthened by dispersoids or cold- working. 17 refs., 7 figs., 1 tab

Copper and CuNi alloys substrates for HTS coated conductor applications protected from oxidation

Energy Technology Data Exchange (ETDEWEB)

Segarra, M; Diaz, J; Xuriguera, H; Chimenos, J M; Espiell, F [Dept. of Chemical Engineering and Metallurgy, Univ. of Barcelona, Barcelona (Spain); Miralles, L [Lab. d' Investigacio en Formacions Geologiques. Dept. of Petrology, Geochemistry and Geological Prospecting, Univ. of Barcelona, Barcelona (Spain); Pinol, S [Inst. de Ciencia de Materials de Barcelona, Bellaterra (Spain)

2003-07-01

Copper is an interesting substrate for HTS coated conductors for its low cost compared to other metallic substrates, and for its low resistivity. Nevertheless, mechanical properties and resistance to oxidation should be improved in order to use it as substrate for YBCO deposition by non-vacuum techniques. Therefore, different cube textured CuNi tapes were prepared by RABIT as possible substrates for deposition of high critical current density YBCO films. Under the optimised conditions of deformation and annealing, all the studied CuNi alloys (2%, 5%, and 10% Ni) presented (100) left angle 001 right angle cube texture which is compatible for YBCO deposition. Textured CuNi alloys present higher tensile strength than pure copper. Oxidation resistance of CuNi tapes under different oxygen atmospheres was also studied by thermogravimetric analysis and compared to pure copper tapes. Although the presence of nickel improves mechanical properties of annealed copper, it does not improve its oxidation resistance. However, when a chromium buffer layer is electrodeposited on the tape, oxygen diffusion is slowed down. Chromium is, therefore, useful for protecting copper and CuNi alloys from oxidation although its recrystallisation texture, (110), is not suitable for coated conductors. (orig.)

Possibilities of radioisotopic fluorescence analysis application in copper industry

International Nuclear Information System (INIS)

Parus, J.; Kierzek, J.

1983-01-01

The main applications of X-ray fluorescence analysis in copper industry such as: copper ores and other materials from flotation analysis, lead and silver determination in blister copper, analysis of metallurgic dusts and copper base alloys analysis are presented. (A.S.)

In vitro study of stimulation effect on endothelialization by a copper bearing cobalt alloy.

Science.gov (United States)

Jin, Shujing; Qi, Xun; Wang, Tongmin; Ren, Ling; Yang, Ke; Zhong, Hongshan

2018-02-01

Endothelialization is an important process after stenting in coronary artery. Recovery of the injured site timely can reduce the neointima formation and platelet absorbance, leading to a lower risk of in-stent restenosis. Copper is known to be critical in vascular construction. Thus a combination of copper with stent materials is a meaningful attempt. A copper bearing L605-Cu cobalt alloy was prepared and its effect on human umbilical vein endothelial cells (HUVECs) was evaluated in vitro in this study. It was found that HUVECs attached and stretched better on the surface of L605-Cu compared with L605, and the apoptosis of cells was decreased simultaneously. The migration and tube formation of HUVECs were also enhanced by the extract of L605-Cu. Furthermore, L605-Cu increased the mRNA expression of VEGF in HUVECs significantly. However it had no effect on the secretion of NO or mRNA expression of eNOS. The result of blood clotting test indicated that L605-Cu had better blood compatibility. These results above have demonstrated that the L605-Cu alloy is promising to be a new stent material with function of accelerating endothelialization. © 2017 Wiley Periodicals, Inc. J Biomed Mater Res Part A: 106A: 561-569, 2018. © 2017 Wiley Periodicals, Inc.

Reactivity test between beryllium and copper

International Nuclear Information System (INIS)

Kawamura, H.; Kato, M.

1995-01-01

Beryllium has been expected for using as plasma facing material on ITER. And, copper alloy has been proposed as heat sink material behind plasma facing components. Therefore, both materials must be joined. However, the elementary process of reaction between beryllium and copper alloy does not clear in detail. For example, other authors reported that beryllium reacted with copper at high temperature, but it was not obvious about the generation of reaction products and increasing of the reaction layer. In the present work, from this point, for clarifying the elementary process of reaction between beryllium and copper, the out-of-pile compatibility tests were conducted with diffusion couples of beryllium and copper which were inserted in the capsule filled with high purity helium gas (6N). Annealing temperatures were 300, 400, 500, 600 and 700 degrees C, and annealing periods were 100, 300 and 1000h. Beryllium specimens were hot pressed beryllium, and copper specimens were OFC (Oxygen Free Copper)

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Directory of Open Access Journals (Sweden)

Fan Yang

2016-01-01

Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Performance of Lead-Free versus Lead-Based Hunting Ammunition in Ballistic Soap

Science.gov (United States)

Gremse, Felix; Krone, Oliver; Thamm, Mirko; Kiessling, Fabian; Tolba, René Hany; Rieger, Siegfried; Gremse, Carl

2014-01-01

Background Lead-free hunting bullets are an alternative to lead-containing bullets which cause health risks for humans and endangered scavenging raptors through lead ingestion. However, doubts concerning the effectiveness of lead-free hunting bullets hinder the wide-spread acceptance in the hunting and wildlife management community. Methods We performed terminal ballistic experiments under standardized conditions with ballistic soap as surrogate for game animal tissue to characterize dimensionally stable, partially fragmenting, and deforming lead-free bullets and one commonly used lead-containing bullet. The permanent cavities created in soap blocks are used as a measure for the potential wound damage. The soap blocks were imaged using computed tomography to assess the volume and shape of the cavity and the number of fragments. Shots were performed at different impact speeds, covering a realistic shooting range. Using 3D image segmentation, cavity volume, metal fragment count, deflection angle, and depth of maximum damage were determined. Shots were repeated to investigate the reproducibility of ballistic soap experiments. Results All bullets showed an increasing cavity volume with increasing deposited energy. The dimensionally stable and fragmenting lead-free bullets achieved a constant conversion ratio while the deforming copper and lead-containing bullets showed a ratio, which increases linearly with the total deposited energy. The lead-containing bullet created hundreds of fragments and significantly more fragments than the lead-free bullets. The deflection angle was significantly higher for the dimensionally stable bullet due to its tumbling behavior and was similarly low for the other bullets. The deforming bullets achieved higher reproducibility than the fragmenting and dimensionally stable bullets. Conclusion The deforming lead-free bullet closely resembled the deforming lead-containing bullet in terms of energy conversion, deflection angle, cavity shape

Performance of lead-free versus lead-based hunting ammunition in ballistic soap.

Directory of Open Access Journals (Sweden)

Felix Gremse

Full Text Available BACKGROUND: Lead-free hunting bullets are an alternative to lead-containing bullets which cause health risks for humans and endangered scavenging raptors through lead ingestion. However, doubts concerning the effectiveness of lead-free hunting bullets hinder the wide-spread acceptance in the hunting and wildlife management community. METHODS: We performed terminal ballistic experiments under standardized conditions with ballistic soap as surrogate for game animal tissue to characterize dimensionally stable, partially fragmenting, and deforming lead-free bullets and one commonly used lead-containing bullet. The permanent cavities created in soap blocks are used as a measure for the potential wound damage. The soap blocks were imaged using computed tomography to assess the volume and shape of the cavity and the number of fragments. Shots were performed at different impact speeds, covering a realistic shooting range. Using 3D image segmentation, cavity volume, metal fragment count, deflection angle, and depth of maximum damage were determined. Shots were repeated to investigate the reproducibility of ballistic soap experiments. RESULTS: All bullets showed an increasing cavity volume with increasing deposited energy. The dimensionally stable and fragmenting lead-free bullets achieved a constant conversion ratio while the deforming copper and lead-containing bullets showed a ratio, which increases linearly with the total deposited energy. The lead-containing bullet created hundreds of fragments and significantly more fragments than the lead-free bullets. The deflection angle was significantly higher for the dimensionally stable bullet due to its tumbling behavior and was similarly low for the other bullets. The deforming bullets achieved higher reproducibility than the fragmenting and dimensionally stable bullets. CONCLUSION: The deforming lead-free bullet closely resembled the deforming lead-containing bullet in terms of energy conversion

Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

Science.gov (United States)

Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

2004-10-01

It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

Physical properties of lead free solders in liquid and solid state

Energy Technology Data Exchange (ETDEWEB)

Mhiaoui, Souad

2007-04-17

The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

Tendency of the 18-8 type corrosion-resistant steel to cracking in automatic building-up of copper and copper base alloys in argon

International Nuclear Information System (INIS)

Abramovich, V.R.; Andronik, V.A.

1978-01-01

Studied was the tendency of the 18-8 type corrosion-resistant steel to cracking during automatic building-up of copper and bronze in argon. The investigation was carried out on the 0kh18n10t steel in argon. It had been established, that the degree of copper penetration into the steel inceases with the increase in the time of the 0Kh18n10t steel contact with liquid copper. Liquid copper and copper base alloys have a detrimental effect on mechanical properties of the steel under external tensile load during intercontant. It is shown that in building-up of copper base alloys on the steel-0Kh18n10t, tendency of the steel to cracking decreases with increase in stiffness of a surfaced weld metal plate and with decrease in building-up energy per unit length. The causes of macrocracking in steel at building-up non-ferrous metals are explained. The technological procedures to avoid cracking are suggested

Reliability of copper based alloys for electric resistance spot welding

International Nuclear Information System (INIS)

Jovanovicj, M.; Mihajlovicj, A.; Sherbedzhija, B.

1977-01-01

Durability of copper based alloys (B-5 and B-6) for electric resistance spot-welding was examined. The total amount of Be, Ni and Zr was up to 2 and 1 wt.% respectively. Good durability and satisfactory quality of welded spots were obtained in previous laboratory experiments carried out on the fixed spot-welding machine of an industrial type (only B-5 alloy was examined). Electrodes made of both B-5 and B-6 alloy were tested on spot-welding grips and fixed spot-welding machines in Tvornica automobila Sarajevo (TAS). The obtained results suggest that the durability of electrodes made of B-5 and B-6 alloys is more than twice better than of that used in TAS

Biosorption of copper(II) and lead(II) onto potassium hydroxide treated pine cone powder.

Science.gov (United States)

Ofomaja, A E; Naidoo, E B; Modise, S J

2010-08-01

Pine cone powder surface was treated with potassium hydroxide and applied for copper(II) and lead(II) removal from solution. Isotherm experiments and desorption tests were conducted and kinetic analysis was performed with increasing temperatures. As solution pH increased, the biosorption capacity and the change in hydrogen ion concentration in solution increased. The change in hydrogen ion concentration for lead(II) biosorption was slightly higher than for copper(II) biosorption. The results revealed that ion-exchange is the main mechanism for biosorption for both metal ions. The pseudo-first order kinetic model was unable to describe the biosorption process throughout the effective biosorption period while the modified pseudo-first order kinetics gave a better fit but could not predict the experimentally observed equilibrium capacities. The pseudo-second order kinetics gave a better fit to the experimental data over the temperature range from 291 to 347 K and the equilibrium capacity increased from 15.73 to 19.22 mg g(-1) for copper(II) and from 23.74 to 26.27 for lead(II). Activation energy was higher for lead(II) (22.40 kJ mol(-1)) than for copper(II) (20.36 kJ mol(-1)). The free energy of activation was higher for lead(II) than for copper(II) and the values of DeltaH* and DeltaS* indicate that the contribution of reorientation to the activation stage is higher for lead(II) than copper(II). This implies that lead(II) biosorption is more spontaneous than copper(II) biosorption. Equilibrium studies showed that the Langmuir isotherm gave a better fit for the equilibrium data indicating monolayer coverage of the biosorbent surface. There was only a small interaction between metal ions when simultaneously biosorbed and cation competition was higher for the Cu-Pb system than for the Pb-Cu system. Desorption studies and the Dubinin-Radushkevich isotherm and energy parameter, E, also support the ion-exchange mechanism. Copyright 2010 Elsevier Ltd. All rights reserved.

Growth of a Copper-Gold Alloy Phase by Bulk Copper Electrodeposition on Gold Investigated by In Situ STM

DEFF Research Database (Denmark)

Andersen, Jens Enevold Thaulov; Møller, Per

1995-01-01

the potential in the double-layer charging region from 500 to -100 mV and back to 500 mV at a sweep rate of 1 mV/s in an acidified copper sulfate electrolyte (0.01M H2SO4, 0.01M CuSO4, and Millipore water). After completion of the first cycle the gold surface had recrystallized and nuclei of an alloy phase were...... in peak potential for the anodic current transient from E = 20 mV to E = -2 mV was observed after completion of four subsequent cycles of copper electrodeposition/dissolution. The shift is suggested to be equal to the change in potential of the working electrode owing to the formation of the alloy phase....

Beryllium and copper-beryllium alloys; Beryllium und Kupfer-Beryllium-Legierungen

Energy Technology Data Exchange (ETDEWEB)

Nagel, Nikolaus [Materion Brush GmbH, Stuttgart (Germany). Operation and Quality/EH and S

2017-02-15

The light metal beryllium is a comparatively rare element, which today is primarily derived from bertrandite. It is mainly used as pure metal or in the form of copper-beryllium alloys, e.g., in automotive industry, aerospace, and electrical components. The wide range of applications is mainly attributed to the extremely high rigidity/density ratio. An overview of the history of the metal, its production, and recycling as well as the properties of CuBe alloys are given.

Comparison and analysis of the efficiency of heat exchange of copper rod and copper wires current lead

International Nuclear Information System (INIS)

Fang, J.; Yu, T.; Li, Z.M.; Wei, B.; Qiu, M.; Zhang, H.J.

2013-01-01

Highlights: •An optimized design of HTS binary current leads is proposed. •Temperature distributions of two different current leads are calculated. •Experiments are done to certify the calculated temperature distributions. •The experiments proved that the copper wires increase security margins. -- Abstract: Current leads are the key components that connect the low-temperature and high temperature parts of the cryogenic system. Owing to the wide range of temperatures, current leads are the main sources of heat leakage. Since the HTS tapes have no resistance and the generated Joule heat is almost zero, HTS binary current leads can reduce heat leakage compared to the conventional leads. However, heat will still be generated and conducted to the cryogenic system through the copper parts of the HTS current leads. In order to reduce heat leakage by the copper parts of the HTS current leads, this paper presents an optimized design of the copper parts of HTS binary current leads. Inside the leads, the copper wires were applied as an alternative to the copper rod without changing the overall dimensions. Firstly, the differential function of heat transfer was derived. By solving the function, the optimum number of the copper wires and the temperature distribution of two different current leads were gotten. Then the experiment of the temperature distribution was done, and the experimental results were basically the same with the calculative results. The simulation and related experiments proved that the copper wire can increase security margins and reduce maximum temperatures under the same shunt current

Comparison and analysis of the efficiency of heat exchange of copper rod and copper wires current lead

Energy Technology Data Exchange (ETDEWEB)

Fang, J., E-mail: fangseer@sina.com [School of Electrical Engineering, Beijing Jiaotong University, Beijing (China); Yu, T. [School of Electrical Engineering, Beijing Jiaotong University, Beijing (China); Li, Z.M.; Wei, B.; Qiu, M.; Zhang, H.J. [China Electric Power Research Institute, Haidian District, Beijing (China)

2013-11-15

Highlights: •An optimized design of HTS binary current leads is proposed. •Temperature distributions of two different current leads are calculated. •Experiments are done to certify the calculated temperature distributions. •The experiments proved that the copper wires increase security margins. -- Abstract: Current leads are the key components that connect the low-temperature and high temperature parts of the cryogenic system. Owing to the wide range of temperatures, current leads are the main sources of heat leakage. Since the HTS tapes have no resistance and the generated Joule heat is almost zero, HTS binary current leads can reduce heat leakage compared to the conventional leads. However, heat will still be generated and conducted to the cryogenic system through the copper parts of the HTS current leads. In order to reduce heat leakage by the copper parts of the HTS current leads, this paper presents an optimized design of the copper parts of HTS binary current leads. Inside the leads, the copper wires were applied as an alternative to the copper rod without changing the overall dimensions. Firstly, the differential function of heat transfer was derived. By solving the function, the optimum number of the copper wires and the temperature distribution of two different current leads were gotten. Then the experiment of the temperature distribution was done, and the experimental results were basically the same with the calculative results. The simulation and related experiments proved that the copper wire can increase security margins and reduce maximum temperatures under the same shunt current.

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Energy Technology Data Exchange (ETDEWEB)

Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

2015-03-15

Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Severe plastic deformation of copper and Al-Cu alloy using multiple channel-die compression

International Nuclear Information System (INIS)

Parimi, A.K.; Robi, P.S.; Dwivedy, S.K.

2011-01-01

Research highlights: → SPD of copper and Al-Cu alloy by multiple channel-die compression tests.→ Extensive grain refinement resulting in nano-sized grains after SPD. → Investigation of micro-structure using optical microscope and SEM. → Shear band formation as the failure mechanism in the two phase Al-Cu alloy. → Difficulty in obtaining SPD for Al-Cu alloy in this method. -- Abstract: Severe plastic deformation studies of copper and Al-Cu alloy by multiple channel-die compression tests were investigated. The materials were tested under plane strain condition by maintaining a constant strain rate of 0.001/s. Extensive grain refinement was observed resulting in nano-sized grains after severe plastic deformation with concomitant increase in flow stress and hardness. The microstructural investigation of the severely deformed materials was investigated using optical microscope and scanning electron microscope. Shear band formation was identified as the failure mechanism in the two phase Al-Cu alloy. The results indicate difficulty in obtaining severe plastic deformation for alloys having two phase micro-structure.

Determination of the gaseous hydrogen ductile-brittle transition in copper-nickel alloys

Science.gov (United States)

Parr, R. A.; Johnston, M. H.; Davis, J. H.; Oh, T. K.

1985-01-01

A series of copper-nickel alloys were fabricated, notched tensile specimens machined for each alloy, and the specimens tested in 34.5 MPa hydrogen and in air. A notched tensile ratio was determined for each alloy and the hydrogen environment embrittlement (HEE) determined for the alloys of 47.7 weight percent nickel to 73.5 weight percent nickel. Stacking fault probability and stacking fault energies were determined for each alloy using the x ray diffraction line shift and line profiles technique. Hydrogen environment embrittlement was determined to be influenced by stacking fault energies; however, the correlation is believed to be indirect and only partially responsible for the HEE behavior of these alloys.

Determination of a brass alloy concentration composition using calibration-free laser-induced breakdown spectroscopy

Energy Technology Data Exchange (ETDEWEB)

Achouri, M.; Baba-Hamed, T.; Beldjilali, S. A., E-mail: sidahmed.beldjilali@univ-usto.dz; Belasri, A. [Université des Sciences et de la Technologie d’Oran Mohamed Boudiaf USTO-MB, LPPMCA (Algeria)

2015-09-15

Laser-induced breakdown spectroscopy (LIBS) is a technique that can provide qualitative and quantitative measurements of the characteristics of irradiated metals. In the present work, we have calculated the parameters of the plasma produced from a brass alloy sample under the action of a pulsed Nd: YAG laser operating at 1064 nm. The emission lines of copper atoms (Cu I), zinc atoms (Zn I), and lead atoms (Pb I), which are elements of a brass alloy composition, were used to investigate the parameters of the brass plasma. The spectral profiles of Cu, Zn, and Pb lines have been used to extract the electron temperature and density of the brass alloy plasma. The characteristics of Cu, Zn, and Pb were determined quantatively by the calibration-free LIBS (CF-LIBS) method considering for accurate analysis that the laser-induced ablated plasma is optically thin in local thermodynamic equilibrium conditions and the plasma ablation is stoichiometric. The Boltzmann plot method was used to evaluate the plasma temperature, and the Stark broadened profiles were used to determine the electron density. An algorithm based on the experimentally measured values of the intensity of spectral lines and the basic laws of plasma physics was developed for the determination of Cu, Zn, and Pb concentrations in the brass sample. The concentrations C{sub CF-LIBS} calculated by CF-LIBS and the certified concentrations C{sub certified} were very close.

Stem cell recovering effect of copper-free GHK in skin.

Science.gov (United States)

Choi, Hye-Ryung; Kang, Youn-A; Ryoo, Sun-Jong; Shin, Jung-Won; Na, Jung-Im; Huh, Chang-Hun; Park, Kyoung-Chan

2012-11-01

The peptide Gly-His-Lys (GHK) is a naturally occurring copper(II)-chelating motifs in human serum and cerebrospinal fluid. In industry, GHK (with or without copper) is used to make hair and skin care products. Copper-GHK plays a physiological role in the process of wound healing and tissue repair by stimulating collagen synthesis in fibroblasts. We also reported that copper-GHK promotes the survival of basal stem cells in the skin. However, the effects of copper-free GHK (GHK) have not been investigated well. In this study, the effects of GHK were studied using cultured normal human keratinocytes and skin equivalent (SE) models. In monolayer cultured keratinocytes, GHK increased the proliferation of keratinocytes. When GHK was added during the culture of SE models, the basal cells became more cuboidal than control model. In addition, there was linear and intense staining of α6 and β1 integrin along the basement membrane. The number of p63 and proliferating cell nuclear antigen positive cells was also significantly increased in GHK-treated SEs than in control SEs. Western blot and slide culture experiment showed that GHK increased the expression of integrin by keratinocytes. All these results showed that GHK increased the stemness and proliferative potential of epidermal basal cells, which is associated with increased expression of integrin. In conclusion, copper-free GHK showed similar effects with copper-GHK. Thus, it can be said that copper-free GHK can be used in industry to obtain the effects of copper-GHK in vivo. Further study is necessary to explore the relationship between copper-free GHK and copper-GHK. Copyright © 2012 European Peptide Society and John Wiley & Sons, Ltd.

Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

Science.gov (United States)

Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

2015-03-01

Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

International Nuclear Information System (INIS)

Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

2014-01-01

Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

2014-01-05

Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

The effect of silver (Ag) addition to mechanical and electrical properties of copper alloy (Cu) casting product

Science.gov (United States)

Felicia, Dian M.; Rochiem, R.; Laia, Standley M.

2018-04-01

Copper have good mechanical properties and good electrical conductivities. Therefore, copper usually used as electrical components. Silver have better electrical conductivities than copper. Female contact resistor is one of the electrical component used in circuit breaker. This study aims to analyze the effect of silver addition to hardness, strength, and electric conductivity properties of copper alloy. This study uses variation of 0; 0.035; 0.07; 0.1 wt. % Ag (silver) addition to determine the effect on mechanical properties and electrical properties of copper alloy through sand casting process. Modelling of thermal analysis and structural analysis was calculated to find the best design for the sand casting experiments. The result of Cu-Ag alloy as cast will be characterized by OES test, metallography test, Brinell hardness test, tensile test, and LCR meter test. The result of this study showed that the addition of silver increase mechanical properties of Cu-Ag. The maximum hardness value of this alloy is 83.1 HRB which is Cu-0.01 Ag and the lowest is 52.26 HRB which is pure Cu. The maximum strength value is 153.2 MPa which is Cu-0.07 Ag and the lowest is 94.6 MPa which is pure Cu. Silver addition decrease electrical properties of this alloy. The highest electric conductivity is 438.98 S/m which is pure Cu and the lowest is 52.61 S.m which is Cu-0.1 Ag.

Final report on characterization of physical and mechanical properties of copper and copper alloys before and after irradiation. (ITER R and D Task no. T213)

International Nuclear Information System (INIS)

Singh, B.N.; Taehtinen, S.

2001-12-01

The present report summarizes and highlights the main results of the work carried out during the last 5 - 6 years on effects of neutron irradiation on physical and mechanical properties of copper and copper alloys. The work was an European contribution to ITER Research and Development programme and was carried out by the Associations Euratom - Risoe and Euratom - Tekes. Details of the investigations carried out within the framework of the present task and the main results have been reported in various reports and journal publication. On the basis of these results some conclusions are drawn regarding the suitability of a copper alloy for its use in the first wall and divertor components of ITER. It is pointed out that the present work has managed only to identify some of the critical problems and limitations of the copper alloys for their employment in the hostile environment of 14 MeV neutrons. A considerable amount of further effort is needed to find a realistic and optimum solution. (au)

Corrosion of copper and copper alloys in a basaltic repository environment

International Nuclear Information System (INIS)

Brehm, W.F.

1990-01-01

Corrosion testing done on copper and copper alloys in support of the basalt repository program is discussed. Tests were performed under anoxic conditions at 50C, 100C, 150C and 200C in the presence of a saturated basalt-bentonite packing. Tests were also performed in an air/steam mixture at temperatures between 150C and 200C. Some tests, particularly those in air/steam mixtures, were done in the presence of radiation fields of 10 2 , 10 3 or 10 4 rad/h. Exposure periods were up to 28 months. A synthetic groundwater, Grande Ronde ≠4, was used. The materials studied were ASTM B402μm·a for copper and 17 μm·a for cupronickel, but the average rates were muμm·a was obtained. The rates at longer times were less than a third of this value. Corrosion increased monotonically with time and temperature. Chalcocite (Cu 2 S) was the corrosion product at 200C. There was no detectable radiation effect, and no pitting was observed. In air/steam corrosion was uniform with no pitting. Linear corrosion was observed for pure copper. The maximum corrosion penetration after 25 months was 0.13 mm at 300C; cupronickel corroded more slowly, with a maximum penetration of 0.045mm after 25 months. Cuprite (Cu 2 O) and tenorite (CuO) were identified on cupronickel, but only Cu 2 O on copper. A pronounced radiation effect was seen at 250C, but not at 150C; the surface film morphology was different under irradiation. In the short term the presence of packing increased the corrosion rate. 5 refs

Segregation and diffusion of deffects induced by radiation in binary copper alloys

International Nuclear Information System (INIS)

Monteiro, W.A.

1984-01-01

Actually considerable theoretical and experimental progress has been made in establishing and in understanding the general feactures of the Radiation Induced Solute Difusion or Segregation such as its temperature, time and displacement rate dependence and the effects of some important materials factors such as the initial solute misfit. During irradiation, the local alloy compositions will change by defect flux driven, non-equilibrium segregation near sinks such as voids, external surfaces and grain boundaries and the compositional change are likely to influence a number of properties and phenomena important to Thermonuclear Reactors, as for example, Ductility, Corrosion, Stress, Corrosion Craking, Sputtering and Blistering. Our work is correlated with the 1 MeV electrons irradiations effects in Copper alloys where the alloying elements are Be, Pt, Sn. These three elements are undersized, similar and oversized relating the Copper atom radius, respectively. How starts and develops the Segregation Induced by Irradiation 'In Situ' with help of the High Voltage Electron Microscopy as technique. (Author) [pt

Characteristics of Film Formed on Alloy 600 and Alloy 690 in Water Containing lead

International Nuclear Information System (INIS)

Hwang Seong Sik; Lee, Deok Hyun; Kim, Hong Pyo; Kim, Joung Soo; Kim, Ju Yup

1999-01-01

Anodic polarization behaviors of Alloy 600 and Alloy 690 have been studied as a function of lead content in the solution of pH 4 and 10 at 90 .deg. C. As the amount of lead in the solution increased, critical current densities and passive current densities of Alloy 600 and Alloy 690 increased, while the breakdown potential of the alloys decreased. The high critical current density in the high lead solution was thought to come from the combination of an enhanced dissolution of constituents on the surface of the alloys by the lead and an anodic dissolution of metallic lead deposited on the surface of the specimens. The morphology of lead precipitated on the specimen after the anodic scan changed with the pH of solution: small irregular particles were precipitated on the surface of the specimen in the solution of pH 4, while the high density of regular sized particles was formed on it in the solution of pH 10.Pb was observed to enhance Cr depletion from the outer surface of Alloy 600 and Alloy 690 and also to increase the ratio of O 2- /OH - in the surface film formed in the high lead solution. The SCC resistance of Alloy 600 and Alloy 690 may have decreased due to the poor quality of the passive film formed and the enhanced oxygen evolution in the solution containing lead

Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate

Science.gov (United States)

Wang, C. P.; Dai, T.; Lu, Y.; Shi, Z.; Ruan, J. J.; Guo, Y. H.; Liu, X. J.

2017-08-01

Copper thin films with thickness of about 500 nm doped with different aluminum concentrations have been prepared by magnetron sputtering on Si substrate and their crystal structure, microstructure, and electrical resistivity after annealing at various temperatures (200°C to 600°C) for 1 h or at 400°C for different durations (1 h to 11 h) investigated by grazing-incidence x-ray diffraction (GIXRD) analysis, scanning electron microscopy (SEM), and four-point probe (FPP) measurements. Cu-1.8Al alloy thin film exhibited good thermal stability and low electrical resistivity (˜5.0 μΩ cm) after annealing at 500°C for 1 h or 400°C for 7 h. No copper silicide was observed at the Cu-Al/Si interface by GIXRD analysis or SEM for this sample. This result indicates that doping Cu thin film with small amounts of Al can achieve high thermal stability and low electrical resistivity, suggesting that Cu-1.8Al alloy thin film could be used for barrierless Cu metallization on Si substrate.

Characterization of the microstructure of tin-silver lead free solder

Energy Technology Data Exchange (ETDEWEB)

Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

2016-07-05

Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

Dissociation of dilute immiscible copper alloy thin films

International Nuclear Information System (INIS)

Barmak, K.; Lucadamo, G. A.; Cabral, C. Jr.; Lavoie, C.; Harper, J. M. E.

2000-01-01

The dissociation behavior of dilute, immiscible Cu-alloy thin films is found to fall into three broad categories that correlate most closely with the form of the Cu-rich end of the binary alloy phase diagrams. Available thermodynamic and tracer diffusion data shed further light on alloy behavior. Eight alloying elements were selected for these studies, with five elements from groups 5 and 6, two from group 8, and one from group 11 of the periodic table. They are respectively V, Nb, Ta, Cr, Mo, Fe, Ru, and Ag. The progress of precipitation in approximately 500-nm-thick alloy films, containing 2.5-3.8 at. % solute, was followed with in situ resistance and stress measurements as well as with in situ synchrotron x-ray diffraction. In addition, texture analysis and transmission electron microscopy were used to investigate the evolution of microstructure and texture of Cu(Ta) and Cu(Ag). For all eight alloys, dissociation occurred upon heating, with the rejection of solute and evolution of microstructure often occurring in multiple steps that range over several hundred degrees between approximately 100 and 900 degree sign C. However, in most cases, substantial reductions in resistivity of the films took place below 400 degree sign C, at temperatures of interest to copper metallization schemes for silicon chip technology. (c) 2000 American Institute of Physics

The plastic deformation of copper-beryllium alloy

International Nuclear Information System (INIS)

Gadalla, A.A.

1980-01-01

Copper-2 at. % Be alloy specimens containing coherent and/or incoherent spherical beryllium precipitates have been tested at different temperatures. The precipitation process and dislocation substructure were examined by electron microscopy. The yielding process is consistent with Orwan mechanism, and the work-hardening of the alloy is parabolic in nature for smaller particles but changes to three-stage hardening for larger particles. The extent of stage I deformation is temperature dependent, and the rate of work-hardening is quite steep and may be described by either the Ashby or the Hirsch parabolic models. There is a noticeable softening during this stage which may be attributed to shearing of particles during deformation. The dislocation substructure shows a uniform distribution of fine dislocations as well as propagation of cracks across grains. The precipitates are a mixture of semi-coherent and incoherent particles. (author)

Development of a copper alloy to beryllium HIP bonding technology for the ITER first wall

International Nuclear Information System (INIS)

Sherlock, P.; Peacock, A.T.; Mc Callum, A.D.

2005-01-01

The primary first wall (PFW) panels of the ITER blanket concept comprise a bi-metallic copper alloy/stainless steel water-cooled heatsink faced with a plasma facing material. Precipitation strengthened CuCrZr is one option for the copper alloy of the heatsink; beryllium, in the form of tiles is an option for the plasma facing material. Over recent years, the technology needed to HIP bond the beryllium tiles to CuCrZr alloy has been developed. This paper describes small samples and larger mock-ups produced during the development of this HIP bonding technology and outlines how structural analyses were used to gain an understanding of the bonding process and refine the design

Eutectic structures in friction spot welding joint of aluminum alloy to copper

International Nuclear Information System (INIS)

Shen, Junjun; Suhuddin, Uceu F. H.; Cardillo, Maria E. B.; Santos, Jorge F. dos

2014-01-01

A dissimilar joint of AA5083 Al alloy and copper was produced by friction spot welding. The Al-MgCuAl 2 eutectic in both coupled and divorced manners were found in the weld. At a relatively high temperature, mass transport of Cu due to plastic deformation, material flow, and atomic diffusion, combined with the alloy system of AA5083 are responsible for the ternary eutectic melting

Effects of aluminum and copper chill on mechanical properties and microstructures of Cu-Zn-Al alloys with sand casting

Science.gov (United States)

Ardhyananta, Hosta; Wibisono, Alvian Toto; Ramadhani, Mavindra; Widyastuti, Farid, Muhammad; Gumilang, Muhammad Shena

2018-04-01

Cu-Zn-Al alloy is one type of brass, which has high strength and high corrosion resistant. It has been applied on ship propellers and marine equipment. In this research, the addition of aluminum (Al) with variation of 1, 2, 3, 4% aluminum to know the effect on mechanical properties and micro structure at casting process using a copper chill and without copper chill. This alloy is melted using furnace in 1100°C without holding. Then, the molten metal is poured into the mold with copper chill and without copper chill. The speciment of Cu-Zn-Al alloy were chracterized by using Optical Emission Spectroscopy (OES), Metallography Test, X-Ray Diffraction (XRD), Hardness Test of Rockwell B and Charpy Impact Test. The result is the addition of aluminum and the use of copper chill on the molds can reduce the grain size, increases the value of hardness and impact.

Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

Science.gov (United States)

Tikale, Sanjay; Prabhu, K. Narayan

2018-05-01

The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

Fundamentals of lead-free solder interconnect technology from microstructures to reliability

CERN Document Server

Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

2015-01-01

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

The influence of transmutation, void swelling, and flux/spectra uncertainties on the electrical properties of copper and copper alloys

International Nuclear Information System (INIS)

Edwards, D.J.; Garner, F.A.; Greenwood, L.R.

1993-09-01

A comparison of the predicted and measured electrical conductivities of MARZ copper and two copper alloys irradiated in FFTF shows that the calculated transmutation rates agree within 15% with those required to produce the observed changes. It also appears that the contribution of transmutants and void swelling to conductivity changes are directly additive. Of the three models studied, Euken's model has been found to best describe the contribution of void swelling to conductivity loss

Accelerated Degradation Test and Predictive Failure Analysis of B10 Copper-Nickel Alloy under Marine Environmental Conditions

Science.gov (United States)

Sun, Bo; Ye, Tianyuan; Feng, Qiang; Yao, Jinghua; Wei, Mumeng

2015-01-01

This paper studies the corrosion behavior of B10 copper-nickel alloy in marine environment. Accelerated degradation test under marine environmental conditions was designed and performed based on the accelerated testing principle and the corrosion degradation mechanism. With the prolongation of marine corrosion time, the thickness of Cu2O film increased gradually. Its corrosion product was Cu2(OH)3Cl, which increased in quantity over time. Cl− was the major factor responsible for the marine corrosion of copper and copper alloy. Through the nonlinear fitting of corrosion rate and corrosion quantity (corrosion weight loss), degradation data of different corrosion cycles, the quantitative effects of two major factors, i.e., dissolved oxygen (DO) and corrosion medium temperature, on corrosion behavior of copper alloy were analyzed. The corrosion failure prediction models under different ambient conditions were built. One-day corrosion weight loss under oxygenated stirring conditions was equivalent to 1.31-day weight loss under stationary conditions, and the corrosion rate under oxygenated conditions was 1.31 times higher than that under stationary conditions. In addition, corrosion medium temperature had a significant effect on the corrosion of B10 copper sheet. PMID:28793549

Accelerated Degradation Test and Predictive Failure Analysis of B10 Copper-Nickel Alloy under Marine Environmental Conditions.

Science.gov (United States)

Sun, Bo; Ye, Tianyuan; Feng, Qiang; Yao, Jinghua; Wei, Mumeng

2015-09-10

This paper studies the corrosion behavior of B10 copper-nickel alloy in marine environment. Accelerated degradation test under marine environmental conditions was designed and performed based on the accelerated testing principle and the corrosion degradation mechanism. With the prolongation of marine corrosion time, the thickness of Cu₂O film increased gradually. Its corrosion product was Cu₂(OH)₃Cl, which increased in quantity over time. Cl - was the major factor responsible for the marine corrosion of copper and copper alloy. Through the nonlinear fitting of corrosion rate and corrosion quantity (corrosion weight loss), degradation data of different corrosion cycles, the quantitative effects of two major factors, i.e. , dissolved oxygen (DO) and corrosion medium temperature, on corrosion behavior of copper alloy were analyzed. The corrosion failure prediction models under different ambient conditions were built. One-day corrosion weight loss under oxygenated stirring conditions was equivalent to 1.31-day weight loss under stationary conditions, and the corrosion rate under oxygenated conditions was 1.31 times higher than that under stationary conditions. In addition, corrosion medium temperature had a significant effect on the corrosion of B10 copper sheet.

Accelerated Degradation Test and Predictive Failure Analysis of B10 Copper-Nickel Alloy under Marine Environmental Conditions

Directory of Open Access Journals (Sweden)

Bo Sun

2015-09-01

Full Text Available This paper studies the corrosion behavior of B10 copper-nickel alloy in marine environment. Accelerated degradation test under marine environmental conditions was designed and performed based on the accelerated testing principle and the corrosion degradation mechanism. With the prolongation of marine corrosion time, the thickness of Cu2O film increased gradually. Its corrosion product was Cu2(OH3Cl, which increased in quantity over time. Cl− was the major factor responsible for the marine corrosion of copper and copper alloy. Through the nonlinear fitting of corrosion rate and corrosion quantity (corrosion weight loss, degradation data of different corrosion cycles, the quantitative effects of two major factors, i.e., dissolved oxygen (DO and corrosion medium temperature, on corrosion behavior of copper alloy were analyzed. The corrosion failure prediction models under different ambient conditions were built. One-day corrosion weight loss under oxygenated stirring conditions was equivalent to 1.31-day weight loss under stationary conditions, and the corrosion rate under oxygenated conditions was 1.31 times higher than that under stationary conditions. In addition, corrosion medium temperature had a significant effect on the corrosion of B10 copper sheet.

The recovery between 30K and 400K of copper and copper alloyed with gold after thermal-neutron irradiation

International Nuclear Information System (INIS)

Aspeling, J.C.

1977-08-01

The point defect reactions responsible for the recovery in resistivity between substages I(D) and I(E) in Stage I after thermal-neutron irradiation were investigated, using a new method termed the ideal isochronal method. Another substage was observed between I(D) and I(E). Whereas the peak temperatures of substages I(D) and I(E) are dependent on applied holding times in a well-known way, the main and very unusual characteristic of the new substage is that its peak temperature does not shift with a change in holding time. Using the ideal isochronal method, it was confirmed that substages I(D) and I(E) have a uniquely thermally activated energy. The new substage was attributed to a process whereby the interstitial has to overcome an energy barrier before recombining with a vacancy. In pure copper several recovery stages are observed between substage I(E) (about 52K) and Stage III (about 300K), whereas with the alloying of gold as a substitutional impurity, additional recovery stages are observed. In the alloyed copper a dose dependence contrary to that normally expected for interstitial-impurity reactions was observed. This phenomenon can, however, be explained consistently when the concentrations of interstitials, vacancies, impurities and impurity agglomerates are considered. No other free migrating point defect stage was observed between substage I(E) and Stage III. High-resolution measurements of the recovery stage at 225K, previously believed to shift in temperature with dose, showed that this stage actually consists of two stages and that the latter do not shift with dose. The two stages were explained in terms of close-pair recovery, in contrast to the previous explanation [af

Effect of Copper and Silicon on Al-5%Zn Alloy as a Candidate Low Voltage Sacrificial Anode

Science.gov (United States)

Pratesa, Yudha; Ferdian, Deni; Togina, Inez

2017-05-01

One common method used for corrosion protection is a sacrificial anode. Sacrificial anodes that usually employed in the marine environment are an aluminum alloy sacrificial anode, especially Al-Zn-In. However, the electronegativity of these alloys can cause corrosion overprotection and stress cracking (SCC) on a high-strength steel. Therefore, there is a development of the sacrificial anode aluminum low voltage to reduce the risk of overprotection. The addition of alloying elements such as Cu, Si, and Ge will minimize the possibility of overprotection. This study was conducted to analyze the effect of silicon and copper addition in Al-5Zn. The experiment started from casting the sacrificial anode aluminum uses electrical resistance furnace in a graphite crucible in 800°C. The results alloy was analyzed using Optical emission spectroscopy (OES), Differential scanning calorimetry, electrochemical impedance spectroscopy, and metallography. Aluminum alloy with the addition of a copper alloy is the most suitable and efficient to serve as a low-voltage sacrificial anode aluminum. Charge transfer resistivity of copper is smaller than silicon which indicates that the charge transfer between the metal and the electrolyte is easier t to occur. Also, the current potential values in coupling with steel are also in the criteria range of low-voltage aluminum sacrificial anodes.

Micromechanical Modeling of Grain Boundaries Damage in a Copper Alloy Under Creep

International Nuclear Information System (INIS)

Voese, Markus

2015-01-01

-grained copper-antimony specimens, on the other hand, have been used for the adjustment of the interface model. The calibrated model has finally been used in combination with artificially generated grain structures to investigate influences resulting from numerical and modelling issues. It was found that the mesh size has only a relatively small influence on the macroscopic creep behaviour. But because of the nearly incompressible deformation behaviour of the single crystal model, the use of special purpose continuum element types was necessary to avoid the occurrence of volumetric locking. Also the creep behaviour of polycrystalline materials, which includes the damage development leading to failure, has been analysed for different material and loading parameters. Especially for the copper-antimony alloy under consideration, it becomes evident that the creep behaviour was affected by grain boundary sliding. In particular, stress redistributions at the grain boundaries were comparable to the behaviour of free grain boundary sliding. Furthermore, simulations for multiaxial loading conditions indicated that the damage development is significantly influenced by the maximum principal stress and the von Mises stress.

Calibration curves for commercial copper and aluminum alloys using handheld laser-induced breakdown spectroscopy

Science.gov (United States)

Bennett, B. N.; Martin, M. Z.; Leonard, D. N.; Garlea, E.

2018-03-01

Handheld laser-induced breakdown spectroscopy (HH LIBS) was used to study the elemental composition of four copper alloys and four aluminum alloys to produce calibration curves. The HH LIBS instrument used is a SciAps Z-500, commercially available, that contains a class-1 solid-state laser with an output wavelength of 1532 nm, laser energy of 5 mJ/pulse, and a pulse duration of 5 ns. Test samples were solid specimens comprising copper and aluminum alloys and data were collected from the samples' surface at three different locations, employing a 12-point-grid pattern for each data set. All three data sets of the spectra were averaged, and the intensity, corrected by subtraction of background, was used to produce the elemental calibration curves. Calibration curves are presented for the matrix elements, copper and aluminum, as well as several minor elements. The surface damage produced by the laser was examined by microscopy. The alloys were tested in air and in a glovebox to evaluate the instrument's ability to identify the constituents within materials under different environmental conditions. The main objective of using this HH LIBS technology is to determine its capability to fingerprint the presence of certain elements related to subpercent level within materials in real time and in situ, as a starting point for undertaking future complex material characterization work.

Copper alloys deterioration due to anthropogenic action

Energy Technology Data Exchange (ETDEWEB)

Duran, A.; Perez-Rodriguez, J. L.; Herrera, L. K.; Jimenez-de-Haro, M. C.; Robador, M. D.; Justo, A.; Blanes, J. M.; Perez-Ferrer, J. C.

2008-07-01

Results are presented from several samples taken from leaves of the Pardon Portico of Mosque-Cathedral or Cordoba, where an alteration on their surface was detected. Metal samples analyzed using X-ray microanalysis and powder x-ray diffraction were predominantly constituted by copper with some amounts of zinc attributed to brass, whereas other samples were also constituted by copper, tin and lead attributed to bronze. surface samples were analyzed using the same techniques. In addition Fourier transform infrared spectroscopy was also used. The main compound identified in all the surface of the leaves is copper chloride hydroxide (atacamite). Lead chlorides have also been found. These data show that the sudden alteration that appears may be attributed to the use of some cleaning product containing chloride. Other compounds detected in the surface were gypsum, quartz and oxalates coming from environmental contamination. (Author) 17 refs.

Baking effect on initial pumping characteristics of oxygen free copper duct

International Nuclear Information System (INIS)

Nagai, Yasuchika; Yamamoto, Yoshiki; Saito, Yoshio; Matsuda, Namio.

1994-01-01

Recently, attention has been paid to the application of oxygen-free copper to the field of vacuum vessels, such as the beam duct material for the B Factory. The initial exhaust characteristics of oxygen-free copper vessels were compared before and after the baking, and the change of the surface condition was examined. The material used for this experiment was the oxygen-free copper, to which vacuum degassing treatment was applied. The vacuum vessels of this oxygen-free copper and SUS316L stainless steel were made. The turbo-molecular pump of 400 liter/min and the scroll pump of 270 liter/min were used, and pressure measurement and the analysis of the components in remaining gas were carried out. The procedure of the experiment is explained. The exhaust curves for the oxygen-free copper and stainless steel vacuum vessels are shown. The time required for reaching 1x10 -6 Pa was about 1/2 after the exposure to nitrogen as compared with after the exposure to air, thus the kinds of gas exerted large influence to the exhaust characteristics. The difference before and after baking arose in most cases. (K.I.)

Baking effect on initial pumping characteristics of oxygen free copper duct

Energy Technology Data Exchange (ETDEWEB)

Nagai, Yasuchika; Yamamoto, Yoshiki [Hitachi Cable, Ltd., Tsuchiura, Ibaraki (Japan). System' s Material Lab.; Saito, Yoshio; Matsuda, Namio

1994-03-01

Recently, attention has been paid to the application of oxygen-free copper to the field of vacuum vessels, such as the beam duct material for the B Factory. The initial exhaust characteristics of oxygen-free copper vessels were compared before and after the baking, and the change of the surface condition was examined. The material used for this experiment was the oxygen-free copper, to which vacuum degassing treatment was applied. The vacuum vessels of this oxygen-free copper and SUS316L stainless steel were made. The turbo-molecular pump of 400 liter/min and the scroll pump of 270 liter/min were used, and pressure measurement and the analysis of the components in remaining gas were carried out. The procedure of the experiment is explained. The exhaust curves for the oxygen-free copper and stainless steel vacuum vessels are shown. The time required for reaching 1x10[sup -6] Pa was about 1/2 after the exposure to nitrogen as compared with after the exposure to air, thus the kinds of gas exerted large influence to the exhaust characteristics. The difference before and after baking arose in most cases. (K.I.).

Initiation and propagation of cleared channels in neutron-irradiated pure copper and a precipitation hardened CuCrZr alloy

DEFF Research Database (Denmark)

Singh, B.N; Edwards, D.J.; Bilde-Sørensen, Jørgen

2004-01-01

The phenomenon of plastic flow localization in the form of "cleared" channels has been frequently observed in neutron irradiated metals and alloys for more than 40 years. So far, however, no experimental evidence as to how and where these channels areinitiated during post-irradiation deformation...... has emerged. Recently we have studied the problem of initiation and propagation of cleared channels during post-irradiation tensile tests of pure copper and a copper alloy irradiated with fission neutrons.Tensile specimens of pure copper and a precipitation hardened copper alloy (CuCrZr) were neutron...... irradiated at 323 and 373K to displacement doses in the range of 0.01 to 0.3 dpa (displacement per atom) and tensile tested at the irradiation temperature.The stress-strain curves clearly indicated the occurrence of a yield drop. The post-deformation microstructural examinations revealed that the channels...

Directly smelted lead-tin alloys: A historical perspective

Science.gov (United States)

Dube, R. K.

2010-08-01

This paper discusses evidence related to the genesis and occurrence of mixed lead-tin ore deposit consisting of cassiterite and the secondary minerals formed from galena. These evidences belong to a very long time period ranging from pre-historic to as late as the nineteenth century a.d. This type of mixed ore deposits was smelted to prepare lead-tin alloys. The composition of the alloy depended on the composition of the starting ore mixture. A nineteenth century evidence for the production of directly smelted lead-tin alloys in southern Thailand is discussed. A unique and rather uncommon metallurgical terminology in Sanskrit language— Nāgaja—was introduced in India for the tin recovered from impure lead. This suggests that Indians developed a process for recovering tin from lead-tin alloys, which in all probability was based on the general principle of fire refining. It has been shown that in the context of India the possibility of connection between the word Nāgaja and the directly smelted lead-tin alloys cannot be ruled out.

Electrochemical study of stress corrosion cracking of copper alloys

International Nuclear Information System (INIS)

Malki, Brahim

1999-01-01

This work deals with the electrochemical study of stress corrosion of copper alloys in aqueous environment. Selective dissolution and electrochemical oxidation are two key-points of the stress corrosion of these alloys. The first part of this thesis treats of these aspects applied to Cu-Au alloys. Measurements have been performed using classical electrochemical techniques (in potentio-dynamic, potentio-static and galvano-static modes). The conditions of occurrence of an electrochemical noise is analysed using signal processing techniques. The impact on the behavior of Cu 3 Au are discussed. In the second part, the stress corrosion problem is addressed in the case of surface oxide film formation, in particular for Cu-Zn alloys. We have found useful to extend this study to mechanical stress oxidation mechanisms in the presence of an oscillating potential electrochemical system. The aim is to examine the influence of these new electrochemical conditions (galvano-static mode) on the behavior of stressed brass. Finally, the potential distribution at crack tip is calculated in order to compare the different observations [fr

Dose dependence of microstructural evolution and mechanical properties of neutron irradiated copper and copper alloys

Energy Technology Data Exchange (ETDEWEB)

Singh, B N; Edwards, D J; Horsewell, A; Toft, P

1995-09-01

The present investigation of the effects of neutron irradiation on microstructures and mechanical properties of copper alloys is a part of the ITER (International Thermonuclear Experimental Reactor) programme. Tensile specimens of the candidate alloys Cu-Al{sub 2}O{sub 3}, CuCrZr and CuNiBe were irradiated with fission neutrons in the DR-3 reactor at Risoe with a flux of 2.5 x 10{sup 17} n/m{sup 2}s (E > 1 MeV, i.e. a dose rate of {approx}5 x 10{sup -8} dpa/s) to fluences of 5 x 10{sup 22}, 5 x 10{sup 23} and 1 x 10{sup 24} n/m{sup 2} (E > 1 MeV, i.e. displacement doses of 0.01, 0.1 and 0.2 dpa) at 47 deg. C. The Cu-Al{sub 2}O{sub 3} (CuA125) specimens, were irradiated in the as-cold worked state. Tensile properties and Vickers hardness of both irradiated and unirradiated specimens were determined at 22 deg. C. Pre- and post-deformation microstructures of irradiated as well as unirradiated specimens were examined using a transmission electron microscope. The fractured surfaces of tensile tested specimens were investigated in a scanning electron microscope. The results show the following general trend: (a) that the CuNiBe alloy is stronger than CuCrZr as well as Cu Al{sub 2}O{sub 3}, (b) that even relatively low dose irradiations cause significant increase in the yield strength, but rather drastic decreases in the uniform elongation of CuCrZr and CuNiBe alloys and that the low dose irradiation of the cold-worked Cu-Al{sub 2}O{sub 3} alloy causes a decrease in the yield strength and an increase in the uniform elongation, at higher doses irradiation hardening occurs. The SEM examinations of the fractured surfaces demonstrate that both unirradiated and irradiated specimens fracture in a ductile manner. The lack of uniform elongation in the irradiated copper alloys may be understood in terms of difficulty in dislocation generation due to pinning of grown-in dislocation by defect clusters (loops) at or around them. (EG) 5 tabs., 18 ills., 13 refs.

Dose dependence of microstructural evolution and mechanical properties of neutron irradiated copper and copper alloys

International Nuclear Information System (INIS)

Singh, B.N.; Edwards, D.J.; Horsewell, A.; Toft, P.

1995-09-01

The present investigation of the effects of neutron irradiation on microstructures and mechanical properties of copper alloys is a part of the ITER (International Thermonuclear Experimental Reactor) programme. Tensile specimens of the candidate alloys Cu-Al 2 O 3 , CuCrZr and CuNiBe were irradiated with fission neutrons in the DR-3 reactor at Risoe with a flux of 2.5 x 10 17 n/m 2 s (E > 1 MeV, i.e. a dose rate of ∼5 x 10 -8 dpa/s) to fluences of 5 x 10 22 , 5 x 10 23 and 1 x 10 24 n/m 2 (E > 1 MeV, i.e. displacement doses of 0.01, 0.1 and 0.2 dpa) at 47 deg. C. The Cu-Al 2 O 3 (CuA125) specimens, were irradiated in the as-cold worked state. Tensile properties and Vickers hardness of both irradiated and unirradiated specimens were determined at 22 deg. C. Pre- and post-deformation microstructures of irradiated as well as unirradiated specimens were examined using a transmission electron microscope. The fractured surfaces of tensile tested specimens were investigated in a scanning electron microscope. The results show the following general trend: (a) that the CuNiBe alloy is stronger than CuCrZr as well as Cu Al 2 O 3 , (b) that even relatively low dose irradiations cause significant increase in the yield strength, but rather drastic decreases in the uniform elongation of CuCrZr and CuNiBe alloys and that the low dose irradiation of the cold-worked Cu-Al 2 O 3 alloy causes a decrease in the yield strength and an increase in the uniform elongation, at higher doses irradiation hardening occurs. The SEM examinations of the fractured surfaces demonstrate that both unirradiated and irradiated specimens fracture in a ductile manner. The lack of uniform elongation in the irradiated copper alloys may be understood in terms of difficulty in dislocation generation due to pinning of grown-in dislocation by defect clusters (loops) at or around them. (EG) 5 tabs., 18 ills., 13 refs

Superthermostability of nanoscale TIC-reinforced copper alloys manufactured by a two-step ball-milling process

Science.gov (United States)

Wang, Fenglin; Li, Yunping; Xu, Xiandong; Koizumi, Yuichiro; Yamanaka, Kenta; Bian, Huakang; Chiba, Akihiko

2015-12-01

A Cu-TiC alloy, with nanoscale TiC particles highly dispersed in the submicron-grained Cu matrix, was manufactured by a self-developed two-step ball-milling process on Cu, Ti and C powders. The thermostability of the composite was evaluated by high-temperature isothermal annealing treatments, with temperatures ranging from 727 to 1273 K. The semicoherent nanoscale TiC particles with Cu matrix, mainly located along the grain boundaries, were found to exhibit the promising trait of blocking grain boundary migrations, which leads to a super-stabilized microstructures up to approximately the melting point of copper (1223 K). Furthermore, the Cu-TiC alloys after annealing at 1323 K showed a slight decrease in Vickers hardness as well as the duplex microstructure due to selective grain growth, which were discussed in terms of hardness contributions from various mechanisms.

Lead-Free Piezoelectrics

CERN Document Server

Nahm, Sahn

2012-01-01

Ecological restrictions in many parts of the world are demanding the elimination of Pb from all consumer items. At this moment in the piezoelectric ceramics industry, there is no issue of more importance than the transition to lead-free materials. The goal of Lead-Free Piezoelectrics is to provide a comprehensive overview of the fundamentals and developments in the field of lead-free materials and products to leading researchers in the world. The text presents chapters on demonstrated applications of the lead-free materials, which will allow readers to conceptualize the present possibilities and will be useful for both students and professionals conducting research on ferroelectrics, piezoelectrics, smart materials, lead-free materials, and a variety of applications including sensors, actuators, ultrasonic transducers and energy harvesters.

Transmission electron microscopy characterization of microstructural features in aluminum-lithium-copper alloys

Science.gov (United States)

Avalos-Borja, M.; Larson, L. A.; Pizzo, P. P.

1984-01-01

A transmission electron microscopy (TEM) examination of aluminum-lithium-copper alloys was conducted. The principal purpose is to characterize the nature, size, and distribution of stringer particles which result from the powder metallurgy (P/M) processing of these alloys. Microstructural features associated with the stringer particles are reported that help explain the stress corrosion susceptibility of the powder metallurgy-processed Al-Li-Cu alloys. In addition, matrix precipitaton events are documented for a variety of heat treatments and process variations. Hot rolling is observed to significantly alter the nature of matrix precipitation, and the observations are correlated with concomitant mechanical property variations.

Response of solute and precipitation-strengthened copper alloys at high neutron exposure

International Nuclear Information System (INIS)

Garner, F.A.; Hamilton, M.L.; Shikama, T.; Edwards, D.J.; Newkirk, J.W.

1991-11-01

A variety of solute and precipitation strengthened copper base alloys have been irradiated to neutron-induced displacement levels of 34 to 150 dpa at 415 degrees C and 32 dpa at 529 degrees C in the Fast Flux Test Facility to assess their potential for high heat flux applications in fusion reactors. Several MZC-type alloys appear to offer the most promise for further study. For low fluence applications CuBeNi and spinodally strengthened CuNiTi alloys may also be suitable. Although Cu-2Be resists swelling, it is not recommended for fusion reactor applications because of its low conductivity

Response of solute and precipitation-strengthened copper alloys at high neutron exposure

Energy Technology Data Exchange (ETDEWEB)

Garner, F.A.; Hamilton, M.L. [Pacific Northwest Lab., Richland, WA (United States); Shikama, T. [Tohoku Univ., Oarai Branch (Japan); Edwards, D.J.; Newkirk, J.W. [Missouri Univ., Rolla, MO (United States)

1991-11-01

A variety of solute and precipitation strengthened copper base alloys have been irradiated to neutron-induced displacement levels of 34 to 150 dpa at 415{degrees}C and 32 dpa at 529{degrees}C in the Fast Flux Test Facility to assess their potential for high heat flux applications in fusion reactors. Several MZC-type alloys appear to offer the most promise for further study. For low fluence applications CuBeNi and spinodally strengthened CuNiTi alloys may also be suitable. Although Cu-2Be resists swelling, it is not recommended for fusion reactor applications because of its low conductivity.

Effect of copper content on the properties of electroless Ni–Cu–P coatings prepared on magnesium alloys

International Nuclear Information System (INIS)

Liu, Junjun; Wang, Xudong; Tian, Zhiyong; Yuan, Ming; Ma, Xijuan

2015-01-01

Highlights: • Electroless Ni–Cu–P coatings were obtained on ZK61M magnesium alloys. • The crystallinity and compactness increases with the increasing of copper content. • The introduction of copper element in the coatings contributes to the formation of passivation film. • The coatings with higher corrosion resistance were obtained from the solution with a higher CuSO 4 concentration. - Abstract: The Ni–Cu–P coatings were obtained by electroless plating method on ZK61M magnesium alloys. The effect of copper content on the properties of electroless Ni–Cu–P coatings on magnesium alloys was further studied. The coatings surface and cross-section morphologies were observed with scanning electron microscope. The crystal structure and corrosion resistance of Ni–Cu–P coatings were evaluated by X-ray diffractometer and electrochemical tests. The experimental results showed that the Ni–Cu–P coatings were uniform and compact, and the corrosion resistance of these coatings was superior to Ni–P coatings owing to the introduction of copper. The crystallinity and compactness of the Ni–Cu–P coatings gradually enhanced with the increasing of copper content in the coatings. The introduction of copper element in the Ni–Cu–P coatings contributes to the formation of passivation film. The Ni–Cu–P coatings with higher corrosion resistance were obtained from the solution with a higher CuSO 4 concentration.

The effect of copper, chromium, and zirconium on the microstructure and mechanical properties of Al-Zn-Mg-Cu alloys

Science.gov (United States)

Wagner, John A.; Shenoy, R. N.

1991-01-01

The present study evaluates the effect of the systematic variation of copper, chromium, and zirconium contents on the microstructure and mechanical properties of a 7000-type aluminum alloy. Fracture toughness and tensile properties are evaluated for each alloy in both the peak aging, T8, and the overaging, T73, conditions. Results show that dimpled rupture essentially characterize the fracture process in these alloys. In the T8 condition, a significant loss of toughness is observed for alloys containing 2.5 pct Cu due to the increase in the quantity of Al-Cu-Mg-rich S-phase particles. An examination of T8 alloys at constant Cu levels shows that Zr-bearing alloys exhibit higher strength and toughness than the Cr-bearing alloys. In the T73 condition, Cr-bearing alloys are inherently tougher than Zr-bearing alloys. A void nucleation and growth mechanism accounts for the loss of toughness in these alloys with increasing copper content.

Conceptual design of a 20-kA current lead using forced-flow cooling and Ag-alloy-sheathed Bi-2223 high-temperature superconductors

International Nuclear Information System (INIS)

Heller, R.; Hull, J.R.

1994-01-01

High-temperature superconductors (HTSs), consisting of Bi-2223 HTS tapes sheathed with Ag alloys are proposed for a 20-kA current lead for the planned stellarator WENDELSTEIN 7-X. Forced-flow He cooling is used, and 4-K He cooling of the whole lead as well as 60-K He cooling of the copper part of the lead, is discussed. Power consumption and behavior in case of loss of He flow are given

Electrodeposition of white copper-tin alloys from alkaline cyanide solutions

International Nuclear Information System (INIS)

Purwadaria, H.S.; Zainal Arifin Ahmad

2007-01-01

Electrodeposition of white copper-tin alloys (including with mir alloys) has been done onto planar mild steel substrates from alkaline cyanide solutions at 65 degree C. The chemical composition of the coating is influenced by plating bath composition and current density. White mir alloy can be produced from the test solution containing 10 g/l CuCN 2 ,45 g/l Na 2 SnO 3 , 25 g/l NaCN, and 12 g/l NaOH at current density about 5 mA/cm?2. The local compositions of the coating cross section were analyzed using EDX installed in a FESEM operated at an accelerating voltage of 20 kV. The phases formed during co-deposition process were identified using XRD at 25 mA current and 35 kV voltage. (Author)

Work function of oxygen exposed lead and lead/indium alloy films

International Nuclear Information System (INIS)

Gundlach, K.H.; Hellemann, H.P.; Hoelzl, J.

1982-01-01

The effect of indium in superconducting tunnel junctions with lead/indium alloy base electrodes is investigated by measuring the vacuum work function of lead, indium, and lead/indium alloy films. It is found that the anomalous decrease of the work function of lead upon exposure to oxygen, explained by the penetration of oxygen into the inner surface of the lead film, is reversed into a slight increase in work function when some indium is added to the lead. This result indicates that the addition of indium provides a protection by suppressing the penetration of oxygen (and probably other gases) into the interior of the thin film

Copper and zinc content in wild game shot with lead or non-lead ammunition - implications for consumer health protection.

Science.gov (United States)

Schlichting, Daniela; Sommerfeld, Christine; Müller-Graf, Christine; Selhorst, Thomas; Greiner, Matthias; Gerofke, Antje; Ulbig, Ellen; Gremse, Carl; Spolders, Markus; Schafft, Helmut; Lahrssen-Wiederholt, Monika

2017-01-01

The aim of this study was to examine the contamination of game meat with copper and zinc and establish whether the use of alternative (non-lead) ammunition can lead to higher or unsafe levels of copper and zinc in the meat of roe deer, wild boar and red deer. The research project "Safety of game meat obtained through hunting" (LEMISI) was conducted in Germany with the purpose of examining the entry of lead as well as copper and zinc into the meat of hunted game when using either lead or non-lead ammunition. The outcome of this study shows that the usage of both lead-based ammunition and alternative non-lead ammunition results in the entry of copper and zinc into the edible parts of the game. Using non-lead ammunition does not entail dangerously elevated levels of copper and zinc, so replacing lead ammunition with alternative ammunition does not introduce a further health problem with regard to these metals. The levels of copper and zinc in game meat found in this study are in the range found in previous studies of game. The content of copper and zinc in game meat is also comparable to those regularly detected in meat and its products from livestock (pig, cattle, sheep) for which the mean human consumption rate is much higher. From the viewpoint of consumer health protection, the use of non-lead ammunition does not pose an additional hazard through copper and zinc contamination. A health risk due to the presence of copper and zinc in game meat at typical levels of consumer exposure is unlikely for both types of ammunition.

Investigation of the susceptibility to solidification cracking in copper alloys

Energy Technology Data Exchange (ETDEWEB)

Warren, Richard [Avesta Sheffield R and D, Avesta (Sweden)

2000-04-01

A test procedure has been developed at LuTH for investigating the susceptibility to cracking at high temperatures in weldments. It has been proposed to adapt this testing procedure to investigate the cracking susceptibility at high temperatures during strip casting of certain copper alloys. Six different materials were selected for investigation - OFHC copper, tellurium containing copper, 4% tin bronze, 6% tin bronze, 30% zinc brass and 35% zinc brass. The aim of the investigation was to characterize the cracking susceptibility of the candidate materials so as to be able to rank and compare them in a quantitative manner. A further aim of the work was to study the suitability of using the data on the cracking indices generated in the present work in thermomechanical models of the casting process to optimize the casting parameters for each of the materials.

Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu

Directory of Open Access Journals (Sweden)

Mathias Göken

2011-11-01

Full Text Available The formation of alloys by particle reinforcement during accumulative roll bonding (ARB, and subsequent annealing, is introduced on the basis of the binary alloy system Al-Cu, where strength and electrical conductivity are examined in different microstructural states. An ultimate tensile strength (UTS of 430 MPa for Al with 1.4 vol.% Cu was reached after three ARB cycles, which almost equals UTS of the commercially available Al-Cu alloy AA2017A with a similar copper content. Regarding electrical conductivity, the UFG structure had no significant influence. Alloying of aluminum with copper leads to a linear decrease in conductivity of 0.78 µΩ∙cm/at.% following the Nordheim rule. On the copper-rich side, alloying with aluminum leads to a slight strengthening, but drastically reduces conductivity. A linear decrease of electrical conductivity of 1.19 µΩ∙cm/at.% was obtained.

Fabrication of free-standing copper foils covered with highly-ordered copper nanowire arrays

Science.gov (United States)

Zaraska, Leszek; Sulka, Grzegorz D.; Jaskuła, Marian

2012-07-01

The through-hole nanoporous anodic aluminum oxide (AAO) membranes with relatively large surface area (ca. 2 cm2) were employed for fabrication of free-standing and mechanically stable copper foils covered with close-packed and highly-ordered copper nanowire arrays. The home-made AAO membranes with different pore diameters and interpore distances were fabricated via a two-step self-organized anodization of aluminum performed in sulfuric acid, oxalic acid and phosphoric acid followed by the pore opening/widening procedure. The direct current (DC) electrodeposition of copper was performed efficiently on both sides of AAO templates. The bottom side of the AAO templates was not insulated and consequently Cu nanowire arrays on thick Cu layers were obtained. The proposed template-assisted fabrication of free-standing copper nanowire array electrodes is a promising method for synthesis of nanostructured current collectors. The composition of Cu nanowires was confirmed by energy dispersive X-Ray spectroscopy (EDS) and X-ray diffraction (XRD) analyses. The structural features of nanowires were evaluated from field emission scanning electron microscopy (FE-SEM) images and compared with the characteristic parameters of anodic alumina membranes.

Fabrication of free-standing copper foils covered with highly-ordered copper nanowire arrays

International Nuclear Information System (INIS)

Zaraska, Leszek; Sulka, Grzegorz D.; Jaskuła, Marian

2012-01-01

The through-hole nanoporous anodic aluminum oxide (AAO) membranes with relatively large surface area (ca. 2 cm 2 ) were employed for fabrication of free-standing and mechanically stable copper foils covered with close-packed and highly-ordered copper nanowire arrays. The home-made AAO membranes with different pore diameters and interpore distances were fabricated via a two-step self-organized anodization of aluminum performed in sulfuric acid, oxalic acid and phosphoric acid followed by the pore opening/widening procedure. The direct current (DC) electrodeposition of copper was performed efficiently on both sides of AAO templates. The bottom side of the AAO templates was not insulated and consequently Cu nanowire arrays on thick Cu layers were obtained. The proposed template-assisted fabrication of free-standing copper nanowire array electrodes is a promising method for synthesis of nanostructured current collectors. The composition of Cu nanowires was confirmed by energy dispersive X-Ray spectroscopy (EDS) and X-ray diffraction (XRD) analyses. The structural features of nanowires were evaluated from field emission scanning electron microscopy (FE-SEM) images and compared with the characteristic parameters of anodic alumina membranes.

Calibration equations for energy-dispersive XRF determination of copper, iron and lead in copper ore slurries

International Nuclear Information System (INIS)

Lakosz, M.

1976-01-01

Calibration equations for the X-ray fluorescence analysis determination of copper, iron and lead in copper ore slurries have been derived and tested. The measurement of Ksub(α) lines of copper and iron and Lsub(α) line of lead excited by rays from 238 Pu source have been used. Si/Li detector coupled to multichannel analyzer and minicomputer have been applied in measurements. The matrix and density effect have been eliminated by additional measurement of back-scattered primary radiation. (author)

Copper, lead and zinc production

International Nuclear Information System (INIS)

Ayers, J.; Ternan, S.

2001-01-01

This chapter provides information on the by-products and residues generated during the production of copper, lead and zinc. The purpose of this chapter is to describe by-products and residues which are generated, how these may be avoided or minimised, and available options for the utilization and management of residues. (author)

Effects of cell condition, pH, and temperature on lead, zinc, and copper sorption to Acidithiobacillus caldus strain BC13

International Nuclear Information System (INIS)

Aston, John E.; Apel, William A.; Lee, Brady D.; Peyton, Brent M.

2010-01-01

Research highlights: →At. caldus sorbs lead, zinc, and copper across a range of pH and temperature. →At. caldus shows a relatively high sorption capacity for zinc and copper at low pH. → Lead, zinc, and copper sorption decreases in tertiary mixtures. → Copper appears to sorb via a different mechanism(s) than lead or zinc. - Abstract: This study describes the effects of cell condition, pH, and temperature on lead, zinc, and copper sorption to Acidithiobacillus caldus strain BC13 with a Langmuir model. Copper exhibited the highest loading capacity, 4.76 ± 0.28 mmol g -1 , to viable cells at pH 5.5. The highest k L (binding-site affinity) observed was 61.2 ± 3.0 L mmol -1 to dehydrated cells at pH 4.0. The pHs that maximized loading capacities and binding-site affinities were generally between 4.0 and 5.5, where the sum of free-proton and complexed-metal concentrations was near a minimum. Of additional importance, lead, zinc, and copper sorbed to viable cells at pH values as low as 1.5. Previous studies with other acidithiobacilli did not measure viable-cell sorption below pH 4.0. In separate experiments, desorption studies showed that far less copper was recovered from viable cells than any other metal or cell condition, suggesting that uptake may play an important role in copper sorption by At. caldus strain BC13. To reflect an applied system, the sorption of metal mixtures was also studied. In these experiments, lead, zinc, and copper sorption from a tertiary mixture were 40.2 ± 4.3%, 28.7 ± 3.8%, and 91.3 ± 3.0%, respectively, of that sorbed in single-metal systems.

Growth of second phase particles in a copper--beryllium alloy. Final technical report

International Nuclear Information System (INIS)

Bunch, R.; Wells, R.; Mukherjee, A.K.

1977-01-01

Growth of second phase particles from a solid solution of copper-beryllium was studied to determine this alloy's suitability for acoustic emission testing. Optical and Scanning Electron microscopes were used to study the microstructure. Micro and macro hardness tests were also performed. A hardness curve for aging at 550 0 F was determined. Microscopic examination revealed the presence of large inclusions which make this alloy unsuitable for the acoustic tests envisioned

Applicability of copper alloys for DEMO high heat flux components

Science.gov (United States)

Zinkle, Steven J.

2016-02-01

The current state of knowledge of the mechanical and thermal properties of high-strength, high conductivity Cu alloys relevant for fusion energy high heat flux applications is reviewed, including effects of thermomechanical and joining processes and neutron irradiation on precipitation- or dispersion-strengthened CuCrZr, Cu-Al2O3, CuNiBe, CuNiSiCr and CuCrNb (GRCop-84). The prospects for designing improved versions of wrought copper alloys and for utilizing advanced fabrication processes such as additive manufacturing based on electron beam and laser consolidation methods are discussed. The importance of developing improved structural materials design criteria is also noted.

Advanced processing of high temperature P/M copper alloy for aerospace applications

International Nuclear Information System (INIS)

Raman, R.V.; Rele, S.V.; Lasley, C.C.; Krotz, P.D.

1991-01-01

Copper Alloy 1035 is a rapidly solidified Cu-Cr-Zr alloy developed by Pratt and Whitney, which exhibits good elevated temperature strength and thermal conductivity. RSR Alloy 1035 powder has been consolidated utilizing the patented Ceracon Process. The Ceracon Process is a quasi-isostatic, hot consolidation technique which utilizes a proprietary particulate material as a pressure transmitting medium in place of a gas media as used in HIPping. Measured mechanical properties to 1200 F are compared to materials consolidated via vacuum plasma spraying (VPS), or VPS + HIPping processes. Advantages and disadvantages of these processing techniques are compared. Porosity and microstructural features are also evaluated

Antimicrobial Properties of Selected Copper Alloys on Staphylococcus aureus and Escherichia coli in Different Simulations of Environmental Conditions: With vs. without Organic Contamination.

Science.gov (United States)

Różańska, Anna; Chmielarczyk, Agnieszka; Romaniszyn, Dorota; Sroka-Oleksiak, Agnieszka; Bulanda, Małgorzata; Walkowicz, Monika; Osuch, Piotr; Knych, Tadeusz

2017-07-20

Background: Hospital equipment made from copper alloys can play an important role in complementing traditional methods of disinfection. Aims of the study: The aim of this study was to assess the dynamics of the antimicrobial properties of selected copper alloys in different simulations of environmental conditions (with organic contamination vs. without organic contamination), and to test alternatives to the currently used testing methods. Materials and Methods: A modification of Japanese standard JIS Z 2801 as well as Staphylococcus aureus (SA) and Escherichia coli (EC) suspended in NaCl vs. tryptic soy broth (TSB) were used in tests performed on seven commonly used copper alloys, copper, and stainless steel. Results: A much faster reduction of the bacterial suspension was observed for the inoculum prepared in NaCl than in TSB. A faster reduction for EC than for SA was observed in the inoculum prepared in NaCl. The opposite results were found for the inoculum based on TSB. A significant correlation between the copper concentration in the copper alloys and the time and degree of bacterial suspension reduction was only observed in the case of EC. Conclusions: This study confirmed the antimicrobial properties of copper alloys, and additionally showed that Staphylococcus aureus was more resistant than Escherichia coli in the variant of the experiment without organic contamination. However, even for SA, a total reduction of the bacterial inoculum's density took no longer than 2 h. Under conditions simulating organic contamination, all of the tested alloys were shown to have bactericidal or bacteriostatic properties, which was contrary to the results from stainless steel.

Lead-free soldering: Investigation of the Cu-Sn-Sb system along the Sn:Sb = 1:1 isopleth

Energy Technology Data Exchange (ETDEWEB)

Yuan, Y. [State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan 410083 (China); Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy); Borzone, G., E-mail: borzone@chimica.unige.it [Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy); Zanicchi, G.; Delsante, S. [Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy)

2011-02-03

Research highlights: > In the electronics industry, the solder alloys commonly used for assembly belong to the Sn-Pb system. Fulfilment of the EU RoHS (reduction of hazardous substances) requires the development of new lead-free alloys for applications in electronics, with the same or possibly better characteristics than the traditional Sn-Pb alloys. > This research concerns the investigation of the constitutional properties of the Cu-Sn-Sb system which is considered as lead-free replacement for high-temperature applications. - Abstract: The Cu-Sn-Sb system has been experimentally investigated by a combination of optical microscopy, differential scanning calorimetry (DSC) and electron probe microanalysis (EPMA). DSC was used to identify a total number of five invariant ternary reactions and the Sn:Sb = 1:1 isopleth section up to 65 at.% Cu was constructed by combining the DSC data with the EPMA analyses of annealed alloys and literature information. The composition limits of the binary phases were detected.

Diffusivity, activity and solubility of oxygen in liquid lead and lead-bismuth eutectic alloy by electrochemical methods

International Nuclear Information System (INIS)

Ganesan, Rajesh; Gnanasekaran, T.; Srinivasa, Raman S.

2006-01-01

The diffusivity of oxygen in liquid lead and lead-bismuth eutectic (LBE) alloy was measured by a potentiostatic method and is given by log(D O Pb /cm 2 s -1 )=-2.554-2384/T(+/-0.070), 818-1061K, and log(D O LBE /cm 2 s -1 )=-0.813-3612/T(+/-0.091), 811-980K. The activity of oxygen in lead and LBE was determined by coulometric titration experiments. Using the measured data, the standard free energy of dissolution of oxygen in liquid lead and LBE was derived and is given byG O(Pb) xs =-121349+16.906T(+/-560)J(gatomO) -1 ,815-1090K,G O(LBE) xs = -127398+27.938T(+/-717)J(gatomO) -1 ,812-1012K.Using the above data, the Gibbs energy of formation of PbO(s) and equilibrium oxygen pressures measured over the oxygen-saturated LBE alloy, the solubility of oxygen in liquid lead and LBE were derived. The solubility of oxygen in liquid lead and LBE are given by log(S/at.%O)=-5100/T+4.32 (+/-0.04), 815-1090K and log(S/at.%O)=-4287/T+3.53 (+/-0.06), 812-1012K respectively.

Simultaneous determination of trace-levels of alloying zinc and copper by semi-mercury-free potentiometric stripping analysis with chemometric data treatment

DEFF Research Database (Denmark)

Andersen, Jens Enevold Thaulov; Hansen, Elo Harald

1998-01-01

Assays of copper and zinc in brass samples were performed by Semi-Mercury Free Potentiometric Stripping Analysis (S-MF PSA) using a thin-film mercury covered glassy-carbon working electrode and dissolved oxygen as oxidizing agent during the stripping step. The stripping peak transients were...... resolved by chemometrics which enabled simultaneous determination of both the copper and the zinc concentrations, thereby eliminating the conventional necessary pretreatment of the sample solution, such as initial addition of Ga(III) or solvent extraction of copper. The brass samples were diluted...... by factors in the range 2.104 - 5.105 which resulted in quantification of the copper and of zinc contents comparable to the specified values within 10%. On the basis of the chemometric treatment, an empirical expression is deduced relating the stripping time to the recorded potential....

Influence of composition, heat treatment and neutron irradiation on the electrical conductivity of copper alloys

Science.gov (United States)

Eldrup, M.; Singh, B. N.

1998-10-01

The electrical conductivity of three different types of copper alloys, viz. CuNiBe, CuCrZr and Cu-Al 2O 3 as well as of pure copper are reported. The alloys have undergone different pre-irradiation heat treatments and have been fission-neutron irradiated up to 0.3 dpa. In some cases post-irradiation annealing has been carried out. The results are discussed with reference to equivalent Transmission Electron Microscopy results on the microstructure of the materials. The CuNiBe has the lowest conductivity (⩽55% of that of pure Cu), and Cu-Al 2O 3 the highest (75-90% of pure Cu).

Gas atomization of Cu-modified AB5 metal hydride alloys

International Nuclear Information System (INIS)

Young, K.; Ouchi, T.; Banik, A.; Koch, J.; Fetcenko, M.A.; Bendersky, L.A.; Wang, K.; Vaudin, M.

2011-01-01

Research highlights: → The gas atomization process together with a hydrogen annealing process was demonstrated on AB5 alloys. → The method was found to be effective in restoring the original cycle life sacrificed by the incorporation of copper in the alloy formula as a means of improving the low temperature performance of AB 5 alloys. → The new process also improves high rate, low temperature, and charge retention performances for both Cu-free and Cu-containing AB 5 alloys. - Abstract: Gas atomization together with a hydrogen annealing process has been proposed as a method to achieve improved low-temperature performance of AB 5 alloy electrodes in Ni/MH batteries and restore the original cycle life which was sacrificed by the incorporation of copper in the alloy formula. While the gas atomization process reduces the lattice constant aspect ratio c/a of the Cu-containing alloys, the addition of a hydrogen annealing step recovers this property, although it is still inferior to the conventionally prepared annealed Cu-free alloy. This observation correlates very well with the cycle life performance. In addition to extending the cycle life of the Cu-containing metal hydride electrode, processing by gas atomization with additional hydrogen annealing improves high-rate, low-temperature, and charge retention performances for both Cu-free and Cu-containing AB 5 alloys. The degradation mechanisms of alloys made by different processes through cycling are also discussed.

Characterization of phase changes during fabrication of copper alloys, crystalline and non-crystalline, prepared by mechanical alloying

Directory of Open Access Journals (Sweden)

Paula Rojas

2016-09-01

Full Text Available The manufacture of alloys in solid state has many differences with the conventional melting (casting process. In the case of high energy milling or mechanical alloying, phase transformations of the raw materials are promoted by a large amount of energy that is introduced by impact with the grinding medium; there is no melting, but the microstructural changes go from microstructural refinement to amorphization in solid state. This work studies the behavior of pure metals (Cu and Ni, and different binary alloys (Cu-Ni and Cu-Zr, under the same milling/mechanical alloying conditions. After high-energy milling, X ray diffraction (XRD patterns were analyzed to determine changes in the lattice parameter and find both microstrain and crystallite sizes, which were first calculated using the Williamson-Hall (W-H method and then compared with the transmission electron microscope (TEM images. Calculations showed a relatively appropriate approach to observations with TEM; however, in general, TEM observations detect heterogeneities, which are not considered for the W-H method. As for results, in the set of pure metals, we show that pure nickel undergoes more microstrain deformations, and is more abrasive than copper (and copper alloys. In binary systems, there was a complete solid solution in the Cu-Ni system and a glass-forming ability for the Cu-Zr, as a function of the Zr content. Mathematical methods cannot be applied when the systems have amorphization because there are no equations representing this process during milling. A general conclusion suggests that, under the same milling conditions, results are very different due to the significant impact of the composition: nickel easily forms a solid solution, while with a higher zirconium content there is a higher degree of glassforming ability.

Preliminary characterization of the toxicity of a beryllium-copper alloy

International Nuclear Information System (INIS)

Benson, J.M.; Hoover, M.D.

1994-01-01

Beryllium (Be) is a low-molecular-weight metal with unique strength and nuclear properties. Because of these properties, Be has been used in the production of nuclear weapons and in nuclear reactors. Consequently, thousands of individuals in nuclear weapons facilities may have been exposed to Be. While the need for Be in the nuclear weapons industry has diminished in recent years, industrial applications of Be-containing alloys are increasing. Be-copper (Be-Cu) alloys are used in the electronics industry and are especially useful in spacecraft and aircraft guidance systems. Be-aluminum alloys are lightweight, have structural strength similar to that of pure Be, and are available at lower cost. Potential for human exposure to Be continues with the increasing production and use of Be-containing alloys. The cytotoxicity of metal particles to alveolar macrophages (AMs) provides information regarding their potential to produce a pulmonary inflammatory response when inhaled. The purpose of this study was to begin evaluation of the cytotoxicity of a Be-Cu alloy (2% Be, 98% Cu) to AMs and to attempt to relate cytotoxicity to the specific surface area of the material

Modelling of solidification processing and continuous strip casting for copper-base alloys

Energy Technology Data Exchange (ETDEWEB)

Mahmoudi, Jafar [Royal Inst. of Tech., Stockholm (Sweden). Dept. of Materials Processing

2000-04-01

An experimental and numerical study was carried out to investigate the solidification process in a copper continuous strip casting process. Heat flow and solidification process has been experimentally studied. Cooling curves during solidification were registered using a thermocouple of type K connected to a data acquisition system. Temperature measurements in the mould and cooling water were also performed. The numerical model considers a generalized set of mass, momentum and heat equations that is valid for the solid, liquid and solidification interval in the cast. A k-{epsilon} turbulence model, produced with the commercial program CFX, is used to analyse the solidification process of pure copper in the mould region of the caster. The fluid flow, temperature and heat flux distributions in the mould region of the caster were computed. The shape and location of the solidification front were also determined. The effects of the parameters such as heat transfer coefficient, casting speed, casting temperature, heat of fusion and specific heat on the shape and location of the solidification front and the heat transport at the mould-cast interface were investigated. The predicted temperature and heat flux distributions were compared with experimental measurements, and reasonable agreement was obtained. The solidification behaviour of pure copper and different copper base alloys has been studied. A series of solidification experiments using DTA furnace, mirror furnace and levitation technique were performed on different copper-base alloys. The undercooling, cooling rates of the liquid and the solid states, solidification times and temperatures were evaluated from the curves. The cooling curves for different samples were simulated using a FEM solidification program. It was found that the calculated values of the heat of fusion were much lower than the tabulated ones. The fraction of solid formed before quenching, in the DTA experiments, has been observed to be much higher

Microstructural Evolution and Mechanical Property Development of Selective Laser Melted Copper Alloys

Science.gov (United States)

Ventura, Anthony Patrick

Selective Laser Melting (SLM) is an additive manufacturing technology that utilizes a high-power laser to melt metal powder and form a part layer-by-layer. Over the last 25 years, the technology has progressed from prototyping polymer parts to full scale production of metal component. SLM offers several advantages over traditional manufacturing techniques; however, the current alloy systems that are researched and utilized for SLM do not address applications requiring high electrical and thermal conductivity. This work presents a characterization of the microstructural evolution and mechanical property development of two copper alloys fabricated via SLM and post-process heat treated to address this gap in knowledge. Tensile testing, conductivity measurement, and detailed microstructural characterization was carried out on samples in the as-printed and heat treated conditions. A single phase solid solution strengthened binary alloy, Cu-4.3Sn, was the first alloy studied. Components were selectively laser melted from pre-alloyed Cu-4.3Sn powder and heat treated at 873 K (600 °C) and 1173 K (900 °C) for 1 hour. As-printed samples were around 97 percent dense with a yield strength of 274 MPa, an electrical conductivity of 24.1 %IACS, and an elongation of 5.6%. Heat treatment resulted in lower yield strength with significant increases in ductility due to recrystallization and a decrease in dislocation density. Tensile sample geometry and surface finish also showed a significant effect on measured yield strength but a negligible change in measured ductility. Microstructural characterization indicated that grains primarily grow epitaxially with a sub-micron cellular solidification sub-structure. Nanometer scale tin dioxide particles identified via XRD were found throughout the structure in the tin-rich intercellular regions. The second alloy studied was a high-performance precipitation hardening Cu-Ni-Si alloy, C70250. Pre-alloyed powder was selectively laser melted to

Antimicrobial Properties of Selected Copper Alloys on Staphylococcus aureus and Escherichia coli in Different Simulations of Environmental Conditions: With vs. without Organic Contamination

Directory of Open Access Journals (Sweden)

Anna Różańska

2017-07-01

Full Text Available Background: Hospital equipment made from copper alloys can play an important role in complementing traditional methods of disinfection. Aims of the study: The aim of this study was to assess the dynamics of the antimicrobial properties of selected copper alloys in different simulations of environmental conditions (with organic contamination vs. without organic contamination, and to test alternatives to the currently used testing methods. Materials and Methods: A modification of Japanese standard JIS Z 2801 as well as Staphylococcus aureus (SA and Escherichia coli (EC suspended in NaCl vs. tryptic soy broth (TSB were used in tests performed on seven commonly used copper alloys, copper, and stainless steel. Results: A much faster reduction of the bacterial suspension was observed for the inoculum prepared in NaCl than in TSB. A faster reduction for EC than for SA was observed in the inoculum prepared in NaCl. The opposite results were found for the inoculum based on TSB. A significant correlation between the copper concentration in the copper alloys and the time and degree of bacterial suspension reduction was only observed in the case of EC. Conclusions: This study confirmed the antimicrobial properties of copper alloys, and additionally showed that Staphylococcus aureus was more resistant than Escherichia coli in the variant of the experiment without organic contamination. However, even for SA, a total reduction of the bacterial inoculum’s density took no longer than 2 h. Under conditions simulating organic contamination, all of the tested alloys were shown to have bactericidal or bacteriostatic properties, which was contrary to the results from stainless steel.

Copper alloys with improved properties: standard ingot metallurgy vs. powder metallurgy

Directory of Open Access Journals (Sweden)

Milan T. Jovanović

2014-09-01

Full Text Available Three copper-based alloys: two composites reinforced with Al2O3 particles and processed through powder metallurgy (P/M route, i.e. by internal oxidation (Cu-2.5Al composite and by mechanical alloying (Cu-4.7Al2O3 and Cu-0.4Cr-0.08Zr alloy produced by ingot metallurgy (vacuum melting and casting were the object of this investigation. Light microscope and scanning electron microscope (SEM equipped with electron X-ray spectrometer (EDS were used for microstructural characterization. Microhardness and electrical conductivity were also measured. Compared to composite materials, Cu-0.4Cr-0.08Zr alloy possesses highest electrical conductivity in the range from 20 to 800 ℃, whereas the lowest conductivity shows composite Cu-2.5Al processed by internal oxidation. In spite to somewhat lower electrical conductivity (probably due to inadequate density, Cu-2.5Al composite exhibits thermal stability enabling its application at much higher temperatures than materials processed by mechanical alloying or by vacuum melting and casting.

New barrierless copper-alloy film for future applications

Science.gov (United States)

Lin, Chon-Hsin Lin

2015-09-01

Since Cu metallization results in a conductivity and an electromigration resistance greater than those of Al, it has become popular for making Si-based interconnects for numerous devices in the field of microelectronics. Following the current trend of miniaturization required for most electronic components, there is a greater need for further size reduction in Si-based devices. The most critical side effect of size reduction is the increase in electronic scattering and resistivity when the barrier-layer thickness is further reduced. To explore advanced Cu-metallization methods and to develop a more economical manufacturing process for Cu-alloy films, the development of Cu materials having better quality and higher thermal stability becomes imperative for the metallization and annealing processes. For this purpose, we first fabricated Cu(GeNx) films and examined their thermal stability and electrical reliability after either cyclic or isothermal annealing. The excellent thermal and electrical properties make these new Cu-alloy films highly promising for applications that require more reliable and inexpensive copper interconnects. In this study, we fabricated Cu alloy films by doping a minute amount of Ge or GeNx, respectively, into the Cu films via barrierless Cu metallization, an inexpensive manufacturing method. Using these newly fabricated alloy films, we were able to eliminate or at least substantially reduce the detrimental interaction between the alloy and the barrierless Si substrate. The Cu(GeNx) films also exhibited high thermal stability, low resistivity and leakage current, and long time-dependent dielectric breakdown (TDDB) lifetimes, making such novel films a candidate for high-quality, economical, and more reliable Cu interconnects.

Copper alloys disintegration using pulsating water jet

Czech Academy of Sciences Publication Activity Database

Lehocká, D.; Klich, Jiří; Foldyna, Josef; Hloch, Sergej; Królczyk, J. B.; Cárach, J.; Krolczyk, G.

2016-01-01

Roč. 82, March 2016 (2016), s. 375-383 ISSN 0263-2241 R&D Projects: GA MŠk(CZ) LO1406; GA MŠk ED2.1.00/03.0082 Institutional support: RVO:68145535 Keywords : pulsating water jet * generation of pulses * disintegration * surface morphology * copper alloys Subject RIV: JQ - Machines ; Tools Impact factor: 2.359, year: 2016 http://ac.els-cdn.com/S0263224116000154/1-s2.0-S0263224116000154-main.pdf?_tid=8f8d1de6-99e9-11e6-afbc-00000aacb362&acdnat=1477314089_59912e52847e91e2030d6a1afd09e7b2

Irradiation performance of oxide dispersion strengthened copper alloys to 150 dpa at 415 degree C

International Nuclear Information System (INIS)

Edwards, D.J.; Kumar, A.S.; Anderson, K.R.; Stubbins, J.F.; Garner, F.A.; Hamilton, M.L.

1991-11-01

Results have been obtained on the post-irradiation properties of various oxide dispersion strengthened copper alloys irradiated from 34 to 150 dpa at 415 degrees C in the Fast Flux Test Facility. The GlidCop alloys strengthened by Al 2 O 3 continue to outperform other alloys with respect to swelling resistance, and retention of both electrical conductivity and yield strength. Several castable ODS alloys and a Cr 2 O 3 -strengthened alloy show increasingly poor resistance to radiation, especially in their swelling behavior. A HfO 2 -strengthened alloy retains most of its strength and its electrical conductivity reaches a constant level after 50 dpa, but it exhibits a higher residual radioactivity

Evaluation of Synthesizing Al2O3 Nano Particles in Copper Matrix by Mechanical Alloying of Cu-1% Al and Copper Oxide

Directory of Open Access Journals (Sweden)

S. Safi

2017-06-01

Full Text Available Strengthening of copper matrix by dispersion of metallic oxides particles as an efficient way to increase strength without losing thermal and electrical conductivities has been recognized for many years. Such a composite can withstand high temperatures and keep its properties. Such copper alloys have many applications especially in high temperature including resistance welding electrodes, electrical motors and switches. In the present work, at first, the Cu-1%Al solid solution was prepared by the mechanical alloying process via 48 hours of milling. Subsequently, 0.66 gr of copper oxide was added to Cu-1%Al solid solution and mechanically milled for different milling times of 0,16, 32, 48 hours. The milled powder mixtures were investigated by X-Ray Diffraction and scanning electron microscopy techniques. The lattice parameter of Cu increased at first, but then decreased at longer milling times. The internal strain increased and the average Cu crystal size decreased during milling process.The particle size decreased during the whole process. With increasing annealing temprature from 450°C to 750°C, the microhardness values of samples decreased at the beginning but then increased. From these results, it can be concluded that nanosize aluminaparticles are formed in the copper matrix.

Radiation enhanced copper clustering processes in Fe-Cu alloys during electron and ion irradiations as measured by electrical resistivity

International Nuclear Information System (INIS)

Ishino, S.; Chimi, Y.; Bagiyono; Tobita, T.; Ishikawa, N.; Suzuki, M.; Iwase, A.

2003-01-01

To study the mechanism of radiation-enhanced clustering of copper atoms in Fe-Cu alloys, in situ electrical resistivity measurements are performed during irradiation with 100 MeV carbon ions and with 2 MeV electrons at 300 K. Two kinds of highly pure Fe-Cu alloys with Cu content of 0.02 and 0.6 wt% are used. The results are summarized as follows: - Although there is a steep initial resistivity increase below about 10 μdpa, the resistivity steadily decreases after this initial transient in Fe-0.6wt%Cu alloy, while in Fe-0.02wt%Cu alloy, the resistivity either decreases slowly or stays almost constant. The rate of change in resistivity depends on copper concentration. - The rate of change in resistivity per dpa is larger for electron irradiation than for ion irradiation. - Change in dose rate from 10 -8 to 10 -9 dpa/s slightly enhances the rate of resistivity change per dpa. The decrease in resistivity with dose is considered to be due to clustering or precipitation of copper atoms. The initial abrupt increase in resistivity is too large to be accounted for by initial introduction of point defects before copper clustering. Tentatively the phenomenon is explained as due to the formation of embryos of copper precipitates with a large strain field around them. Quantitative evaluation of the results using resistivity contribution of a unit concentration of Frenkel pairs and that of copper atoms gives an important conclusion that more than one copper atom are removed from solid solution by one Frenkel pair. The clustering efficiency is surprisingly high in the present case compared with the ordinary radiation-induced or radiation-enhanced precipitation processes

Yttrium 3-(4-nitrophenyl)-2-propenoate used as inhibitor against copper alloy corrosion in 0.1 M NaCl solution

International Nuclear Information System (INIS)

Nam, Nguyen Dang; Thang, Vo Quoc; Hoai, Nguyen To; Hien, Pham Van

2016-01-01

Highlights: • Yttrium 3-(4-nitrophenyl)-2-propenoate has been studied as an effective corrosion inhibitor for copper. • A high inhibition performance is attributed to the forming protective inhibiting deposits. • Yttrium 3-(4-nitrophenyl)-2-propenoate mitigates corrosion by promoting random distribution of minor anodes. - Abstract: Yttrium 3-(4-nitrophenyl)-2-propenoate has been studied as an effective corrosion inhibitor for copper alloy in 0.1 M chloride solution. The results show that the surface of copper alloy coupons exposed to solutions containing 0.45 mM yttrium 3-(4-nitrophenyl)-2-propenoate had no signs of corrosion attack due to protective film formation, whereas the surface of copper alloy coupons exposed to non-inhibitor and lower concentrations of yttrium 3-(4-nitrophenyl)-2-propenoate containing solutions were severely corroded. A high inhibition performance is attributed to the forming protective inhibiting deposits that slow down the electrochemical corrosion reactions and mitigate corrosion by promoting random distribution of minor anodes.

Method For Creating Corrosion Resistant Surface On An Aluminum Copper Alloy

Science.gov (United States)

Mansfeld, Florian B.; Wang, You; Lin, Simon H.

1997-06-03

A method for treating the surface of aluminum alloys hang a relatively high copper content is provided which includes the steps of removing substantially all of the copper from the surface, contacting the surface with a first solution containing cerium, electrically charging the surface while contacting the surface in an aqueous molybdate solution, and contacting the surface with a second solution containing cerium. The copper is substantially removed from the surface in the first step either by (i) contacting the surface with an acidic chromate solution or by (ii) contacting the surface with an acidic nitrate solution while subjecting the surface to an electric potential. The corrosion-resistant surface resulting from the invention is excellent, consistent and uniform throughout the surface. Surfaces treated by the invention may often be certified for use in salt-water services.

Influence of composition, heat treatment and neutron irradiation on the electrical conductivity of copper alloys

DEFF Research Database (Denmark)

Eldrup, Morten Mostgaard; Singh, B.N.

1998-01-01

The electrical conductivity of three different types of copper alloys, viz. CuNiBe, CuCrZr and Cu-Al(2)O(3) as well as of pure copper are reported. The alloys have undergone different pre-irradiation heat treatments and have been fission-neutron irradiated up to 0.3 dpa. In some cases post......-irradiation annealing has been carried out. The results are discussed with reference to equivalent Transmission Electron Microscopy results on the microstructure of the materials. The CuNiBe has the lowest conductivity (less than or equal to 55% of that of pure Cu), and Cu-Al(2)O(3) the highest (75-90% of pure Cu). (C...

Characterization of dispersion strengthened copper with 3wt%Al2O3 by mechanical alloying

Directory of Open Access Journals (Sweden)

Rajković Višeslava

2004-01-01

Full Text Available The copper matrix has been dispersion strengthened with 3wt.%Al2O3 by mechanical alloying. Commercial alumina powder with an average particle size of 0.75mm was used for alloying. The mechanical alloying process was performed in a planetary ball mill up to 20h in air. After milling all powders were treated in H2 at 4000C for 1h, and finally hot pressing was used for compaction (800oC, 3h, Ar. Structure observations revealed a lamellar structure (Al2O3 particles largely restricted to interlamellar planes between adjacent copper lamellae accompanied also by structure refinement. These structural changes were mostly completed in the early stage of milling, and retained after compaction. Micro hardness was found to progressively increase with milling time. So, after 5h of milling the micro hardness of the Cu+3twt%Al2O3 compact was 1540MPa, i.e. 2.5 times greater than for the as-received electrolytic copper powder (638MPa compacted under identical conditions, while after 20h of milling it was 2370 MPa. However after exposing the tested compact at 800oC up to 5h, the achieved hardening effect vanished.

Experimental Investigations on Pulsed Nd:YAG Laser Welding of C17300 Copper-Beryllium and 49Ni-Fe Soft Magnetic Alloys

International Nuclear Information System (INIS)

Mousavi, S. A. A. Akbari; Ebrahimzadeh, H.

2011-01-01

Copper-beryllium and soft magnetic alloys must be joined in electrical and electro-mechanical applications. There is a high difference in melting temperatures of these alloys which cause to make the joining process very difficult. In addition, copper-beryllium alloys are of age hardenable alloys and precipitations can brittle the weld. 49Ni-Fe alloy is very hot crack sensitive. Moreover, these alloys have different heat transfer coefficients and reflection of laser beam in laser welding process. Therefore, the control of welding parameters on the formation of adequate weld puddle composition is very difficult. Laser welding is an advanced technique for joining of dissimilar materials since it can precisely control and adjust the welding parameters. In this study, a 100W Nd:YAG pulsed laser machine was used for joining 49Ni-Fe soft magnetic to C17300 copper-beryllium alloys. Welding of samples was carried out autogenously by changing the pulse duration, diameter of beam, welding speed, voltage and frequency. The spacing between samples was set to almost zero. The ample were butt welded. It was required to apply high voltage in this study due to high reflection coefficient of copper alloys. Metallography, SEM analysis, XRD and microhardness measurement was used for survey of results. The results show that the weld strength depends upon the chemical composition of the joints. To change the wells composition and heat input of the welds, it was attempted to deviate the laser focus away from the weld centerline. The best strength was achieved by deviation of the laser beam away about 0.1mm from the weld centerline. The result shows no intermetallic compounds if the laser beam is deviated away from the joint.

Evaluation of copper, aluminum bronze, and copper-nickel container material for the Yucca mountain project

International Nuclear Information System (INIS)

Kass, J.

1990-01-01

Copper, 70 percent aluminum bronze, and 70/30 copper-nickel were evaluated as potential waste-packaging materials as part of the Yucca Mountain Project. The proposed waste repository site is under a desert mountain in southern Nevada. The expected temperatures at the container surface are higher than at other sites, about 250C at the beginning of the containment period; they could fall below the boiling point of water during this period, but will be exposed to very little water, probably less than 5 l/a. Initial gamma flux will be 10 4 rad/h, and no significant hydrostatic or lithostatic pressure is expected. Packages will contain PWR or BWR fuel, or processed-glass waste. Three copper alloys are being considered for containers: oxygen-free copper (CDA 102); 7 percent aluminum bronze (CDA 613); and 70/30 copper-nickel (CDA 715). Phase separation due to prolonged thermal exposure could be a problem for the two alloys, causing embrittlement. The reduction of internal oxides present in pure copper by hydrogen could cause mechanical degradation. Corrosion and oxidation rates measured for the three materials in well water with and without gamma irradiation at flux rates about ten times higher than those expected were all quite small. The corrosion/oxidation rates for CDA715 show a marked increase under irradiation, but are still acceptable. In the presence of ammonia and other nitrogen-bearing species stress corrosion cracking (SCC) is a concern. Welded U-bend specimens of all three materials have been tested for up to 10000 h in highly irradiated environments, showing no SCC. There was some alloy segregation in the Al bronze specimens. The investigators believe that corrosion and mechanical properties will not present problems for these materials at this site. Further work is needed in the areas of weld inspection, welding techniques, embrittlement of weld metal, the effects of dropping the containers during emplacement, and stress corrosion cracking. Other materials

The response of dispersion-strengthened copper alloys to high fluence neutron irradiation at 415 degrees C

International Nuclear Information System (INIS)

Edwards, D.J.; Newkirk, J.W.; Garner, F.A.; Hamilton, M.L.; Nadkarni, A.; Samal, P.

1993-01-01

Various oxide-dispersion-strengthened copper alloys have been irradiated to 150 dpa at 415 degrees C in the Fast Flux Test Facility (FFTF). The Al 2 O 3 -strengthened GlidCop TM alloys, followed closely by a HfO 2 -strengthened alloy, displayed the best swelling resistance, electrical conductivity, and tensile properties. The conductivity of the HfO 2 -strengthened alloy reached a plateau at the higher levels of irradiation, instead of exhibiting the steady decrease in conductivity observed in the other alloys. A high initial oxygen content results in significantly higher swelling for a series of castable oxide-dispersion-strengthened alloys, while a Cr 2 O 3 -strengthened alloy showed poor resistance to radiation

Specification of properties and design allowables for copper alloys used in HHF components of ITER

DEFF Research Database (Denmark)

Kalinin, G.M.; Fabritziev, S.A.; Singh, B.N.

2002-01-01

CrZr and CuAl25 are not yet fully characterised. The performed R&D gives a basis for the specification of physical and mechanical properties required for the design analysis in accordance with the ITER Structural Design Criteria for In-vessel Components (SDC-IC). For both CuCrZr-IG and CuAl25-IG alloys......Two types of copper alloys, precipitation hardened (PH) Cu (CuCrZr-IG) and dispersion strengthened (DS) Cu (CuAl25-IG), are proposed as heat sink materials for the high heat flux (HHF) components of ITER. However, copper alloys are not included in any national codes, and properties of both Cu......, the statistical evaluation of available experimental data has been used to calculate the temperature dependence of the average value and of the 95% confidence limit of tensile properties. The stress limits, Sm, Se, and Sd, have been estimated on the basis of available data. The procedure used for specification...

Effects of neutron irradiation at 4500C and 16 dpa on the properties of various commercial copper alloys

International Nuclear Information System (INIS)

Brager, H.R.; Heinisch, H.L.; Garner, F.A.

1985-01-01

High-purity copper and eight copper alloys were irradiated to approx.16 dpa at approx.450 0 C in the MOTA experiment in FFTF. These alloys were also examined after aging at 400 0 C for 1000 hours. The radiation-induced changes in the electrical conductivity, tensile properties, and density were measured and compared to those of the aged materials. The changes in conductivity can be either positive or negative depending on the alloy. Changes in tensile properties of most, but not all, of the alloys seem to be primarily dependent on thermal effects rather than the effect of atomic displacements. Radiation at 450 0 C induced changes in density varying from 0.66% densification to 16.6% swelling. The latter occurred in Cu-O.1% Ag and implies a swelling rate of at least 1%/dpa. 6 references, 3 figures, 2 tables

Polyol Synthesis of Cobalt–Copper Alloy Catalysts for Higher Alcohol Synthesis from Syngas

DEFF Research Database (Denmark)

Mendes, Laiza V.P.; Snider, Jonathan L.; Fleischman, Samuel D.

2017-01-01

Novel catalysts for the selective production of higher alcohols from syngas could offer improved pathways towards synthetic fuels and chemicals. Cobalt–copper alloy catalysts have shown promising results for this reaction. To improve control over particle properties, a liquid phase nanoparticle s...

The sublethal effects of copper and lead on the haematology and ...

African Journals Online (AJOL)

Toxicity bioassays were conducted on groovy mullet, Liza dumerili, using copper and lead, in order to assess how these metals affected their blood haematology and acid-base balance. Short-term (96 hours) exposure to lead caused significantly more haematological response [PCO2] than copper, when compared to the ...

Anti-corrosion film formed on HAl77-2 copper alloy surface by aliphatic polyamine in 3 wt.% NaCl solution

Energy Technology Data Exchange (ETDEWEB)

Yu, Yinzhe; Yang, Dong; Zhang, Daquan, E-mail: zhdq@sh163.net; Wang, Yizhen; Gao, Lixin

2017-01-15

Highlights: • Properties of ADDD meet environment-friendly requirements. • ADDD’s inhibition efficiency is better than BTA at the low concentration. • ADDD adsorbs on the copper alloy surface by via the N atom in its amino group using flat mode. - Abstract: The corrosion inhibition of a polyamine compound, N-(4-amino-2, 3-dimethylbutyl)-2, 3-dimethylbutane-1, 4-diamine (ADDD), was investigated for HAl77-2 copper alloy in 3 wt.% NaCl solution. Electrochemical measurements, scanning electron microscopy (SEM), atomic force microscope (AFM) and Fourier transform infrared spectroscopy (FT-IR) techniques were employed for this research. The results show that ADDD strongly suppresses the corrosion of HAl77-2 alloy. The inhibition efficiency of ADDD is 98.6% at 0.5 mM, which is better than benzotriazole (BTAH) at the same concentration. Polarization curves indicate that ADDD is an anodic type inhibitor. Surface analysis suggests that a protective film is formed via the interaction of ADDD and copper. FT-IR reveals that the inhibition mechanism of ADDD is dominated by chemisorption onto the copper alloy surface to form an inhibition film. Furthermore, quantum chemical calculation and molecular dynamics (MD) simulations methods show that ADDD adsorbs on HAl77-2 surface via amino group in its molecule.

Structure of the Copper–Enriched Layer Introduced by Anodic Oxidation of Copper-Containing Aluminium Alloy

International Nuclear Information System (INIS)

Hashimoto, T.; Zhou, X.; Skeldon, P.; Thompson, G.E.

2015-01-01

This paper investigates the structure of the copper–enriched layer formed at the alloy/anodic film interface during anodizing of Al–2 wt.% Cu binary alloy using transmission electron microscopy. It was revealed that θ′ phase was formed within the copper–enriched layer. For the copper–enriched layer formed on {1 0 0} aluminum planes, the interface between the aluminum matrix and the θ′ phase within the copper-enriched layer is coherent. For the copper–enriched layer formed on {1 1 0} and {1 1 1} aluminum planes, the interfaces between the aluminum matrix and the θ′ phase within the copper-enriched layer are semi-coherent or incoherent. The interfacial coherency influences the formation of oxygen gas bubbles within the resultant anodic films.

Experience with the use of copper alloys in seawater systems in the Norwegian sector of the North Sea

Energy Technology Data Exchange (ETDEWEB)

Johnsen, Roy [Norwegian University of Science and Technology, NO-7491 Trondheim (Norway)

2004-07-01

Offshore oil and gas has been produced on the Norwegian Continental Shelf (NCS) for nearly 30 years. Seawater has been used extensively as cooling medium and firewater. Copper alloys have been an alternative material both for piping and equipment like pumps, valves, heat exchangers and screens. In this presentation the experience from the use from different oil companies will be presented. The paper will also contain a discussion about the future for copper alloys in seawater systems. This part will be based on input and discussions with senior corrosion specialists in oil companies. (authors)

Microstructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Plating

Science.gov (United States)

Choudhary, R. K.; Laik, A.; Mishra, P.

2017-03-01

Vacuum brazing of stainless steel and copper plates was done using a silver-based filler alloy. In one set of experiments, around 30-µm-thick nickel coatings were electrochemically applied on stainless steel plates before carrying out the brazing runs and its effect in making changes in the braze-zone microstructure was studied. For brazing temperature of 830 °C, scanning electron microscopy examination of the braze-zone revealed that relatively sound joints were obtained when brazing was done with nickel-coated stainless steel than with uncoated one. However, when brazing of nickel-coated stainless steel and copper plates was done at 860 °C, a wide crack appeared in the braze-zone adjacent to copper side. Energy-dispersive x-ray analysis and electron microprobe analysis confirmed that at higher temperature, the diffusion of Cu atoms from copper plate towards the braze-zone was faster than that of Ni atoms from nickel coating. Helium leak rate of the order 10-11 Pa m3/s was obtained for the crack-free joint, whereas this value was higher than 10-4 Pa m3/s for the joint having crack. The shear strength of the joint was found to decrease considerably due to the presence of crack.

EXAMINATION OF THE OXIDATION PROTECTION OF ZINC COATINGS FORMED ON COPPER ALLOYS AND STEEL SUBSTRATES

International Nuclear Information System (INIS)

Papazoglou, M.; Chaliampalias, D.; Vourlias, G.; Pavlidou, E.; Stergioudis, G.; Skolianos, S.

2010-01-01

The exposure of metallic components at aggressive high temperature environments, usually limit their usage at similar application because they suffer from severe oxidation attack. Copper alloys are used in a wide range of high-quality indoor and outdoor applications, statue parts, art hardware, high strength and high thermal conductivity applications. On the other hand, steel is commonly used as mechanical part of industrial set outs or in the construction sector due to its high mechanical properties. The aim of the present work is the examination of the oxidation resistance of pack cementation zinc coatings deposited on copper, leaded brass and steel substrates at elevated temperature conditions. Furthermore, an effort made to make a long-term evaluation of the coated samples durability. The oxidation results showed that bare substrates appear to have undergone severe damage comparing with the coated ones. Furthermore, the mass gain of the uncoated samples was higher than this of the zinc covered ones. Particularly zinc coated brass was found to be more resistant to oxidation conditions in which it was exposed as it has the lower mass gain as compared to the bare substrates and zinc coated copper. Zinc coated steel was also proved to be more resistive than the uncoated steel.

Swelling of copper-aluminum and copper-nickel alloys in FFTF-MOTA at approximately 4500C

International Nuclear Information System (INIS)

Garner, F.A.; Brager, H.R.

1986-06-01

Pure copper appears to swell with an S-shaped behavior at 450 0 C, tending to saturate at higher fluence levels. The addition of solutes such as aluminum and nickel at 5 wt % leads to an extended transient regime and thereby a reduction in swelling at low to moderate fast neutron exposures. The addition of these elements also leads to an increase in the saturation level of swelling, however, resulting in an increase in swelling relative to that of pure copper at high fluence

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Science.gov (United States)

Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

2016-12-01

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

Variations of color with alloying elements in Pd-free Au-Pt-based high noble dental alloys

International Nuclear Information System (INIS)

Shiraishi, Takanobu; Takuma, Yasuko; Miura, Eri; Fujita, Takeshi; Hisatsune, Kunihiro

2007-01-01

The effects of alloying addition of a small amount of base metals (In, Sn, Fe, Zn) on color variations in Pd-free Au-Pt-based high noble dental alloys were investigated in terms of rectilinear and polar color coordinates. The ternary Au-Pt-X (X = In, Sn, Fe, Zn) and quaternary Au-Pt-In-Y (Y = Sn, Fe, Zn) alloys were prepared from high purity component metals. The amount of alloying base metals, X and Y, were restricted up to 2 at.%. The alloying addition of a small amount of Fe, In, Sn, to a binary Au-10 at.% Pt alloy (referred to as AP10) effectively increased chroma, C *. On the other hand, the addition of Zn to the parent alloy AP10 did not change color coordinates greatly. The increase in chroma in the present Au-Pt-based high noble alloys was attributed to the increase in the slope of spectral reflectance curve at its absorption edge near 515 nm. It was found that the addition of a small amount of Fe to the parent alloy AP10 markedly increased lightness, L *, and the addition of Sn gave a very light tint of red to the parent alloy. Although red-green chromaticity index a * contributed to chroma to some extent, contribution of yellow-blue chromaticity index b * was much greater in determining chroma in this Pd-free Au-Pt-based multi-component alloys. The present results are expected to be valuable in case color is to be taken into account in designing Pd-free Au-Pt-based high noble dental alloys

Variations of color with alloying elements in Pd-free Au-Pt-based high noble dental alloys

Energy Technology Data Exchange (ETDEWEB)

Shiraishi, Takanobu [Department of Dental and Biomedical Materials Science, Unit of Basic Medical Sciences, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki 852-8588 (Japan)]. E-mail: siraisi@nagasaki-u.ac.jp; Takuma, Yasuko [Department of Dental and Biomedical Materials Science, Unit of Basic Medical Sciences, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki 852-8588 (Japan); Miura, Eri [Department of Dental and Biomedical Materials Science, Unit of Basic Medical Sciences, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki 852-8588 (Japan); Fujita, Takeshi [Department of Dental and Biomedical Materials Science, Unit of Basic Medical Sciences, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki 852-8588 (Japan); Hisatsune, Kunihiro [Department of Dental and Biomedical Materials Science, Unit of Basic Medical Sciences, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki 852-8588 (Japan)

2007-06-15

The effects of alloying addition of a small amount of base metals (In, Sn, Fe, Zn) on color variations in Pd-free Au-Pt-based high noble dental alloys were investigated in terms of rectilinear and polar color coordinates. The ternary Au-Pt-X (X = In, Sn, Fe, Zn) and quaternary Au-Pt-In-Y (Y = Sn, Fe, Zn) alloys were prepared from high purity component metals. The amount of alloying base metals, X and Y, were restricted up to 2 at.%. The alloying addition of a small amount of Fe, In, Sn, to a binary Au-10 at.% Pt alloy (referred to as AP10) effectively increased chroma, C *. On the other hand, the addition of Zn to the parent alloy AP10 did not change color coordinates greatly. The increase in chroma in the present Au-Pt-based high noble alloys was attributed to the increase in the slope of spectral reflectance curve at its absorption edge near 515 nm. It was found that the addition of a small amount of Fe to the parent alloy AP10 markedly increased lightness, L *, and the addition of Sn gave a very light tint of red to the parent alloy. Although red-green chromaticity index a * contributed to chroma to some extent, contribution of yellow-blue chromaticity index b * was much greater in determining chroma in this Pd-free Au-Pt-based multi-component alloys. The present results are expected to be valuable in case color is to be taken into account in designing Pd-free Au-Pt-based high noble dental alloys.

Fact sheet: National primary drinking water regulations for lead and copper

International Nuclear Information System (INIS)

1991-05-01

The Fact Sheet contains a summary of what the regulations will do, establish, and provide; regulatory impact in regards to benefits and costs; treatment technique requirements; tap water monitoring for lead and copper; water quality monitoring (other than lead and copper); monitoring schedules, regulatory schedules for large, medium-sized, and small systems

Chelation therapy in intoxications with mercury, lead and copper

DEFF Research Database (Denmark)

Cao, yang; Skaug, Marit Aralt; Andersen, Ole

2015-01-01

In the present review we provide an update of the appropriate use of chelating agents in the treatment of intoxications with compounds of mercury, lead and copper. The relatively new chelators meso-2,3-dimercaptosuccinic acid (DMSA) and 2,3-dimercapto-propanesulphonate (DMPS) can effectively...... mobilize deposits of mercury as well as of lead into the urine. These drugs can be administered orally and have relatively low toxicity compared to the classical antidote dimercaptopropanol (BAL). d-Penicillamine has been widely used in copper overload, although 2,3-dimercaptosuccinic acid...

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

International Nuclear Information System (INIS)

Shalaby, Rizk Mostafa

2013-01-01

Mechanical properties and indentation creep of the melt-spun process Bi–42 wt%Sn, Bi–40 wt%Sn–2 wt%In, Bi–40 wt%Sn–2 wt%Ag and Bi–38 wt%Sn–2 wt%In–2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn–37 wt%Pb eutectic alloy. The results show that the structure of Bi–42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn 19 for Bi–40 wt%Sn–2 wt%In and ε-Ag 3 Sn for Bi–40 wt%Sn–2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb–Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag 3 Sn and InSn 19 which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi–Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn 19 and Ag 3 Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi–Sn based alloys have been studied and analyzed.

Co-reduction of Copper Smelting Slag and Nickel Laterite to Prepare Fe-Ni-Cu Alloy for Weathering Steel

Science.gov (United States)

Guo, Zhengqi; Pan, Jian; Zhu, Deqing; Zhang, Feng

2018-02-01

In this study, a new technique was proposed for the economical and environmentally friendly recovery of valuable metals from copper smelting slag while simultaneously upgrading nickel laterite through a co-reduction followed by wet magnetic separation process. Copper slag with a high FeO content can decrease the liquidus temperature of the SiO2-Al2O3-CaO-MgO system and facilitate formation of liquid phase in a co-reduction process with nickel laterite, which is beneficial for metallic particle growth. As a result, the recovery of Ni, Cu, and Fe was notably increased. A crude Fe-Ni-Cu alloy with 2.5% Ni, 1.1% Cu, and 87.9% Fe was produced, which can replace part of scrap steel, electrolytic copper, and nickel as the burden in the production of weathering steel by an electric arc furnace. The study further found that an appropriate proportion of copper slag and nickel laterite in the mixture is essential to enhance the reduction, acquire appropriate amounts of the liquid phase, and improve the growth of the metallic alloy grains. As a result, the liberation of alloy particles in the grinding process was effectively promoted and the metal recovery was increased significantly in the subsequent magnetic separation process.

Lead activity in Pb-Sb-Bi alloys

Directory of Open Access Journals (Sweden)

A. S. Kholkina

2014-11-01

Full Text Available The present work is devoted to the study of lead thermodynamic activity in the Pb-Sb-Bi alloys. The method for EMF measurements of the concentration cell: (–Pb|KCl-PbCl2¦¦KCl-PbCl2|Pb-(Sb-Bi(+ was used. The obtained concentration dependences of the galvanic cell EMF are described by linear equations. The lead activity in the ternary liquid-metal alloy demonstrates insignificant negative deviations from the behavior of ideal solutions.

Glucose sensing on graphite screen-printed electrode modified by sparking of copper nickel alloys.

Science.gov (United States)

Riman, Daniel; Spyrou, Konstantinos; Karantzalis, Alexandros E; Hrbac, Jan; Prodromidis, Mamas I

2017-04-01

Electric spark discharge was employed as a green, fast and extremely facile method to modify disposable graphite screen-printed electrodes (SPEs) with copper, nickel and mixed copper/nickel nanoparticles (NPs) in order to be used as nonenzymatic glucose sensors. Direct SPEs-to-metal (copper, nickel or copper/nickel alloys with 25/75, 50/50 and 75/25wt% compositions) sparking at 1.2kV was conducted in the absence of any solutions under ambient conditions. Morphological characterization of the sparked surfaces was performed by scanning electron microscopy, while the chemical composition of the sparked NPs was evaluated with energy dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy. The performance of the various sparked SPEs towards the electro oxidation of glucose in alkaline media and the critical role of hydroxyl ions were evaluated with cyclic voltammetry and kinetic studies. Results indicated a mixed charge transfer- and hyroxyl ion transport-limited process. Best performing sensors fabricated by Cu/Ni 50/50wt% alloy showed linear response over the concentration range 2-400μM glucose and they were successfully applied to the amperometric determination of glucose in blood. The detection limit (S/N 3) and the relative standard deviation of the method were 0.6µM and green methods in sensor's development. Copyright © 2017 Elsevier B.V. All rights reserved.

Standard Practice for Use of Mattsson's Solution of pH 7.2 to Evaluate the Stress- Corrosion Cracking Susceptibility of Copper-Zinc Alloys

CERN Document Server

American Society for Testing and Materials. Philadelphia

2011-01-01

1.1 This practice covers the preparation and use of Mattsson's solution of pH 7.2 as an accelerated stress-corrosion cracking test environment for brasses (copper-zinc base alloys). The variables (to the extent that these are known at present) that require control are described together with possible means for controlling and standardizing these variables. 1.2 This practice is recommended only for brasses (copper-zinc base alloys). The use of this test environment is not recommended for other copper alloys since the results may be erroneous, providing completely misleading rankings. This is particularly true of alloys containing aluminum or nickel as deliberate alloying additions. 1.3 This practice is intended primarily where the test objective is to determine the relative stress-corrosion cracking susceptibility of different brasses under the same or different stress conditions or to determine the absolute degree of stress corrosion cracking susceptibility, if any, of a particular brass or brass component ...

40 CFR 141.86 - Monitoring requirements for lead and copper in tap water.

Science.gov (United States)

2010-07-01

... copper in tap water. 141.86 Section 141.86 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY... § 141.86 Monitoring requirements for lead and copper in tap water. (a) Sample site location. (1) By the... the water system can collect the number of lead and copper tap samples required in paragraph (c) of...

Brazing open cell reticulated copper foam to stainless steel tubing with vacuum furnace brazed gold/indium alloy plating

Science.gov (United States)

Howard, Stanley R [Windsor, SC; Korinko, Paul S [Aiken, SC

2008-05-27

A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 .mu.m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 .mu.m thick, and a second layer of gold, 2.54 .mu.m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

The microstructure and microhardness of friction stir welded dissimilar copper/Al-5% Mg alloys

Science.gov (United States)

Kalashnikova, T. A.; Shvedov, M. A.; Vasilyev, P. A.

2017-12-01

A friction stir welded joint between copper and aluminum alloy has been investigated and characterized for the microstructure and microhardness number distribution. The microstructural evolution of the joint is studied using optical microscopy and microhardness. The mechanical characteristics in structural zones of FSW joints are determined by Vickers microhardness measurements. Samples were cut across the cross section. It is shown that intermetallic Cu/Al particles are formed at interfaces. The intermetallics microhardness in the dissimilar aluminum/cooper FSW joint differs from that of the joint produced by fusion welding. The grain structures obtained in different dissimilar joint zones are examined.

Corrosion behavior of beryllium copper and other nonmagnetic alloys in simulated drilling environments

International Nuclear Information System (INIS)

Cribb, W.R.; Booker, J.; Kane, R.D.; Turn, J.C.

1984-01-01

Beryllium copper (BeCu) alloys are known to exhibit high strength and good electrical conductivity. Other attractive properties, low magnetic susceptibility and resistance to galling, make these alloys strong contenders for use as drill collars and instrument housings in drilling equipment. Environmental cracking and corrosion tests were conducted in autoclaves at 66, 121 and 149 C (150, 250 and 300 F) in environments as severe as 10% H 2 S, 20% CO 2 balance N 2 . The results indicate Brush Alloy 25 adequately resists environmental cracking for these conditions, whereas certain nonmagnetic stainless steel cracked. Brush Alloy 25 exhibits acceptable corrosion rates at or below temperatures of 149 C (300 F) in environments with up to 1% H 2 S. Acceptable rates were also observed for environments containing up to 10% H 2 S at 66 C (150 F). The alloy showed this similar acceptable behavior in billet or tube form regardless of the aging treatment

Effects of bonding bakeout thermal cycles on pre- and post irradiation microstructures, physical, and mechanical properties of copper alloys

Energy Technology Data Exchange (ETDEWEB)

Singh, B.N.; Eldrup, M.; Toft, P.; Edwards, D.J. [Pacific Northwest National Laboratory, Richland, WA (United States)

1996-10-01

At present, dispersion strengthened (DS) copper is being considered as the primary candidate material for the ITER first wall and divertor components. Recently, it was agreed among the ITER parties that a backup alloy should be selected from the two well known precipitation hardened copper alloys, CuCrZr and CuNiBe. It was therefore decided to carry out screening experiments to simulate the effect of bonding and bakeout thermal cycles on microstructure, mechanical properties, and electrical resistivity of CuCrZr and CuNiBe alloys. On the basis of the results of these experiments, one of the two alloys will be selected as a backup material. Tensile specimens of CuCrZr and CuNiBe alloys were given various heat treatments corresponding to solution anneal, prime ageing, and bonding thermal cycle followed by reageing and the reactor bakeout treatment at 623K for 100 hours. Tensile specimens of the DS copper were also given the heat treatment corresponding to the bonding thermal cycle. A number of these heat treated specimens of CuCrZr, CuNiBe, and DS copper were neutron irradiated at 523K to a dose level of {approx}0.3 dpa (NRT) in the DR-3 reactor at Riso. Both unirradiated and irradiated specimens with the various heat treatments were tensile tested at 532K. The dislocation, precipitate and void microstructures and electrical resistivity of these specimens were also determined. Results of these investigations will be reported and discussed in terms of thermal and irradiation stability of precipitates and irradiation-induced precipitation and recovery of dislocation microstructure. Results show that the bonding and bakeout thermal cycles are not likely to have any serious deleterious effects on the performance of these alloys. The CuNiBe alloys were found to be susceptible to radiation-induced embrittlement, however, the exact mechanism is not yet known. It is thought that radiation-induced precipitation and segregation of the beryllium may be responsible.

Nickel, copper and cobalt coalescence in copper cliff converter slag

Directory of Open Access Journals (Sweden)

Wolf A.

2016-01-01

Full Text Available The aim of this investigation is to assess the effect of various additives on coalescence of nickel, copper and cobalt from slags generated during nickel extraction. The analyzed fluxes were silica and lime while examined reductants were pig iron, ferrosilicon and copper-silicon compound. Slag was settled at the different holding temperatures for various times in conditions that simulated the industrial environment. The newly formed matte and slag were characterized by their chemical composition and morphology. Silica flux generated higher partition coefficients for nickel and copper than the addition of lime. Additives used as reducing agents had higher valuable metal recovery rates and corresponding partition coefficients than fluxes. Microstructural studies showed that slag formed after adding reductants consisted of primarily fayalite, with some minute traces of magnetite as the secondary phase. Addition of 5 wt% of pig iron, ferrosilicon and copper-silicon alloys favored the formation of a metallized matte which increased Cu, Ni and Co recoveries. Addition of copper-silicon alloys with low silicon content was efficient in copper recovery but coalescence of the other metals was low. Slag treated with the ferrosilicon facilitated the highest cobalt recovery while copper-silicon alloys with silicon content above 10 wt% resulted in high coalescence of nickel and copper, 87 % and 72 % respectively.

Lake sediments record prehistoric lead pollution related to early copper production in North America.

Science.gov (United States)

Pompeani, David P; Abbott, Mark B; Steinman, Byron A; Bain, Daniel J

2013-06-04

The mining and use of copper by prehistoric people on Michigan's Keweenaw Peninsula is one of the oldest examples of metalworking. We analyzed the concentration of lead, titanium, magnesium, iron, and organic matter in sediment cores recovered from three lakes located near mine pits to investigate the timing, location, and magnitude of ancient copper mining pollution. Lead concentrations were normalized to lithogenic metals and organic matter to account for processes that can influence natural (or background) lead delivery. Nearly simultaneous lead enrichments occurred at Lake Manganese and Copper Falls Lake ∼8000 and 7000 years before present (yr BP), indicating that copper extraction occurred concurrently in at least two locations on the peninsula. The poor temporal coherence among the lead enrichments from ∼6300 to 5000 yr BP at each lake suggests that the focus of copper mining and annealing shifted through time. In sediment younger than ∼5000 yr BP, lead concentrations remain at background levels at all three lakes, excluding historic lead increases starting ∼150 yr BP. Our work demonstrates that lead emissions associated with both the historic and Old Copper Complex tradition are detectable and can be used to determine the temporal and geographic pattern of metal pollution.

INFLUENCE OF MECHANICAL ALLOYING AND LEAD CONTENT ON MICROSTRUCTURE, HARDNESS AND TRIBOLOGICAL BEHAVIOR OF 6061 ALUMINIUM ALLOYS

Directory of Open Access Journals (Sweden)

M. Paidpilli

2017-03-01

Full Text Available In the present work, one batch of prealloyed 6061Al powder was processed by mixing and another one was ball milled with varying amount of lead content (0-15 vol. %. These powders were compacted at 300MPa and sintered at 590˚C under N2. The instrumented hardness and the young’s modulus of as-sintered 6061Al-Pb alloys were examined as a function of lead content and processing route. The wear test under dry sliding condition has been performed at varying loads (10-40 N using pin-on-disc tribometer. The microstructure and worn surfaces have been investigated using SEM to evaluate the change in topographical features due to mechanical alloying and lead content. The mechanically alloyed materials showed improved wear characteristics as compared to as-mixed counterpart alloys. Delamination of 6061Al-Pb alloys decreases up to an optimum lead composition in both as-mixed and ball-milled 6061Al-Pb alloys. The results indicated minimum wear rate for as-mixed and ball-milled 6061Al alloy at 5 and 10 vol. % Pb, respectively.

Testing of cobalt-free alloys for valve applications using a special test loop

International Nuclear Information System (INIS)

Benhamou, C.

1992-01-01

Considering that use of cobalt alloys should be avoided as far as possible in PWR components, a programme aimed at establishing the performance of cobalt-free alloys has been performed for valve applications, where cobalt alloys are mainly used. Referring to past work, two types of cobalt-free alloys were selected: Ni-Cr-B-Si and Ni-Cr-Fe alloys. Cobalt-free valves' behaviour has been evaluated comparatively with cobalt valves by implementation of a programme in a special PWR test loop. At the issue of the loop test programme, which included endurance, thermal shock and erosion tests, cobalt-free alloys candidate to replace cobalt alloys are proposed in relation with valve type (globe valve and swing check valve). The following was established: (i) Colmonoy 4-26 (Ni-Cr-B-Si alloy) and Cenium Z20 (Ni-Cr-Fe alloy) deposited by plasma arc process were found suitable for use in 3inch swing check valves; (ii) for integral parts acting as guide rings, Nitronic 60 and Cesium Z20/698 were tested successfully; (iii) for small-bore components such as 2inch globe valves, no solution can yet be proposed; introduction of cobalt-free alloys is dependent on the development of automatic advanced arc surfacing techniques applied to small-bore components

Tensile and fracture toughness properties of copper alloys and their HIP joints with austenitic stainless steel in unirradiated and neutron irradiated condition

International Nuclear Information System (INIS)

Taehtinen, S.; Pyykkoenen, M.; Singh, B.N.; Toft, P.

1998-03-01

The tensile strength and ductility of unirradiated CuAl25 IG0 and CuCrZr alloys decreased continuously with increasing temperature up to 350 deg C. Fracture toughness of unirradiated CuAl25 IG0 alloy decreased continuously with increasing temperature from 20 deg C to 350 deg C whereas the fracture toughness of unirradiated CuCrZr alloy remained almost constant at temperatures up to 100 deg C, was decreased significantly at 200 deg C and slightly increased at 350 deg C. Fracture toughness of HIP joints were lower than that of corresponding copper alloy and fracture path in HIP joint specimen was always within copper alloy side of the joint. Neutron irradiation to a dose level of 0.3 dpa resulted in hardening and reduction in uniform elongation to about 2-4% at 200 deg C in both copper alloys. At higher temperatures softening was observed and uniform elongation increased to about 5% and 16% for CuAl25 IG0 and CuCrZr alloys, respectively. Fracture toughness of CuAl25 IG0 alloy reduced markedly due to neutron irradiation in the temperature range from 20 deg C to 350 deg C. The fracture toughness of the irradiated CuCrZr alloy also decreased in the range from 20 deg C to 350 deg C, although it remained almost unaffected at temperatures below 200 deg C and decreased significantly at 350 deg C when compared with that of unirradiated CuCrZr alloy. (orig.)

Recent results for bonding S-65C grade Be to copper alloys

International Nuclear Information System (INIS)

Dombrowski, D.W.

1995-01-01

Novel processes for bonding beryllium to copper alloys without the use of a silver bonding aid have been developed at Brush Wellman. Tensile strength results will be presented at room temperature and elevated temperatures. A comparison will be made between bond strengths derived from rectangular tensile specimens and reduced section tensile specimens. Failure modes of the specimens at various temperatures will be shown

Arsenic, chromium, copper, iron, manganese, lead, selenium and ...

African Journals Online (AJOL)

Arsenic, chromium, copper, iron, manganese, lead, selenium and zinc in the tissues of the largemouth yellowfish, Labeobarbus kimberleyensis (Gilchrist and Thompson, 1913), from the Vaal Dam, South Africa, and associated consumption risks.

Use of neutron diffraction and laser-induced plasma spectroscopy in integrated authentication methodologies of copper alloy artefacts

International Nuclear Information System (INIS)

Siano, S.; Bartol, L.; Mencaglia, A.A.; Agresti, J.; Miccio, M.

2009-01-01

The present study approaches the general problem of the authentication of copper alloy artefacts of art and historical interest using non-invasive analytical techniques. It aims to demonstrate that a suitable combination of time-of-flight neutron diffraction and laser-induced plasma spectroscopy in integrated multidisciplinary authentication methodologies can provide crucial data for discriminating between genuine archaeological objects and modern counterfeits. After introducing the methodology, which is dedicated in particular to copper alloy figurines of ancient style, two representative authentication case studies are discussed. The results of the work provide evidence that the combination of multiphase analysis using TOF-N D and elemental depth profiles provided by Lips makes it possible to solve most of the present authentication problems.

Effect of cold work on creep properties of oxygen-free copper

International Nuclear Information System (INIS)

Martinsson, Aasa; Andersson-Oestling, Henrik C.M.

2009-03-01

Spent nuclear fuel is in Sweden planned to be disposed by encapsulating in waste packages consisting of a cast iron insert surrounded by a copper canister. The cast iron is load bearing and the copper canister gives corrosion protection. The waste package is heavy. Throughout the manufacturing process from the extrusion/pierce-and-draw manufacturing to the final placement in the repository, the copper is subjected to handling which could introduce cold work in the material. It is well known that the creep properties of engineering materials at higher temperatures are affected by cold working. The study includes creep testing of four series of cold worked, oxygen-free, phosphorus doped copper (Cu-OFP) at 75 deg C. The results are compared to reference series for as series of copper cold worked in tension (12 and 24 %) and two series cold worked in compression (12 % parallel to creep load axis and 15 % perpendicular to creep load axis) were tested. The results show that pre-straining in tension of copper leads to prolonged creep life at 75 deg C. The creep rate and ductility are reduced. The influence on the creep properties increases with the amount of cold work. Cold work in compression applied along the creep load axis has no effect on the creep life or the creep rate. Nonetheless the ductility is still impaired. However, cold work in compression applied perpendicular to the creep load direction has a positive effect on the creep life. Cold work in both tension and compression results in a pronounced reduction of the initial creep strain, which is the strain obtained from the beginning of the loading until full creep load is achieved. Yet the area reduction is unaffected by the degree of cold work

Influence of Heat Treatment and Composition Variations on Microstructure, Hardness, and Wear Resistance of C 18000 Copper Alloy

OpenAIRE

Osorio-Galicia, Ramon; Gomez-Garcia, Carlos; Alcantara, Miguel Angel; Herrera-Vazquez, Andres

2012-01-01

The hardness and wear behavior properties of two C 18000 copper alloys with variations in Ni, Si, and Cr concentrations, both within the range of C18000 chemical analysis standard, were studied after the alloy samples had been prepared by melting and casting in sand molds and then heat-treated in solution using two-stage aging for different heating time periods. The results obtained from sample sets of the aforementioned two alloys, C 0 and C 1 , show that the alloy C 1 , with slightly higher...

Grindability of cast Ti-6Al-4V alloyed with copper.

Science.gov (United States)

Watanabe, Ikuya; Aoki, Takayuki; Okabe, Toru

2009-02-01

This study investigated the grindability of cast Ti-6Al-4V alloyed with copper. The metals tested were commercially pure titanium (CP Ti), Ti-6Al-4V, experimental Ti-6Al-4V-Cu (1, 4, and 10 wt% Cu), and Co-Cr alloy. Each metal was cast into five blocks (3.0 x 8.0 x 30.0 mm(3)). The 3.0-mm wide surface of each block was ground using a hand-piece engine with an SiC wheel at four circumferential speeds (500, 750, 1000, and 1250 m/min) at a grinding force of 100 g. The grindability index (G-index) was determined as volume loss (mm(3)) calculated from the weight loss after 1 minute of grinding and the density of each metal. The ratio of the metal volume loss and the wheel volume loss was also calculated (G-ratio, %). Data (n = 5) were statistically analyzed using ANOVA (alpha= 0.05). Ti-6Al-4V and the experimental Ti-6Al-4V-Cu alloys exhibited significantly (p grindability of some of the resultant Ti-6Al-4V-Cu alloys.

Processing of copper anodic-slimes for extraction of valuable metals.

Science.gov (United States)

Amer, A M

2003-01-01

This work focuses on processing of anodic slimes obtained from an Egyptian copper electrorefining plant. The anodic slimes are characterized by high concentrations of copper, lead, tin and silver. The proposed hydrometallurgical process consists of two leaching stages for the extraction of copper (H(2)SO(4)-O(2)) and silver (thiourea-Fe3+), and pyrometallurgical treatment of the remaining slimes for production of Pb-Sn soldering alloy. Factors affecting both the leaching and smelting stages were studied.

Parametric Investigation of Diode and CO2 Laser in Direct Metal Deposition of H13 Tool Steel on Copper Substrate

OpenAIRE

M. Khalid Imran; Syed Masood; Milan Brandt; Sudip Bhattacharya; Jyotirmoy Mazumder

2011-01-01

In the present investigation, H13 tool steel has been deposited on copper alloy substrate using both CO2 and diode laser. A detailed parametric analysis has been carried out in order to find out optimum processing zone for coating defect free H13 tool steel on copper alloy substrate. Followed by parametric optimization, the microstructure and microhardness of the deposited clads have been evaluated. SEM micrographs revealed dendritic microstructure in both clads. However,...

Experimental Study of RF Pulsed Heating on Oxygen Free Electronic Copper

Energy Technology Data Exchange (ETDEWEB)

Pritzkau, David P.

2003-02-10

When the thermal stresses induced by RF pulsed heating are larger than the elastic limit, microcracks and surface roughening will occur due to cyclic fatigue. Therefore, pulsed heating limits the maximum surface magnetic field and through it the maximum achievable accelerating gradient. An experiment using circularly cylindrical cavities operating in the TE{sub 011} mode at a resonant frequency of 11.424 GHz was designed to study pulsed heating on Oxygen Free Electronic (OFE) copper. An X-band klystron delivered up to 10 MW to the cavities in 1.5 {micro}s pulses at 60 Hz repetition rate. One run was executed at a temperature rise of 120 K for 56 x 10{sup 6} pulses. Cracks at grain boundaries, slip bands and cracks associated with these slip bands were observed. The second run consisted of 86 x 10{sup 6} pulses with a temperature rise of 82 K, and cracks at grain boundaries and slip bands were seen. Additional information can be derived from the power-coupling iris, and we conclude that a pulsed temperature rise of 250 K for several million pulses leads to destruction of copper. These results can be applied to any mode of any OFE copper cavity.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

Science.gov (United States)

Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

2017-12-01

An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

Heavy metals (copper, cadmium, lead, mercury) in mute swans from Denmark

Energy Technology Data Exchange (ETDEWEB)

Elvestad, K.; Karlog, O.; Clausen, B.

1982-03-01

During the severe winter of 1978-79, large numbers of mute swans died in coastal areas of Denmark. Of these, 2111 were collected for examination. The analyses confirm previous findings of relatively high copper levels in mute swans (mean for 178 livers was 2680 mg/kg dry weight (Dw) and for 110 kidneys 34 mg/kg Dw) (Table I, Fig. 1). The copper content was not related to sex or age (Table II). The highest liver levels of copper were found in swans from Western Jutland. Cadmium was found at the same relatively low levels as recorded for waterfowl elsewhere (mean for 178 livers was 12 mg/kg Dw, for 110 kidneys 24 mg/kg Dw) (Table I, Fig. 2). The cadmium content was not sex-related, but it increased with age (Table II). The mean mercury content (liver) was 1.4 mg/kg Dw in the 10 birds analysed (Table I). The mean lead content was 15 mg/kg Dw in the 178 livers analysed and 31 mg/kg Dw in 110 sternum (Table I and Fig. 3). The lead content was not sex-related. In sternum, but not in livers, it was related to age (Table II). One third of the swans were found lead-contaminated probably after ingestion of lead pellets. None of the swans carried high levels of both copper, cadmium, and lead (Table III).

Electrothermal atomic absorption spectrometric determination of copper in nickel-base alloys with various chemical modifiers*1

Science.gov (United States)

Tsai, Suh-Jen Jane; Shiue, Chia-Chann; Chang, Shiow-Ing

1997-07-01

The analytical characteristics of copper in nickel-base alloys have been investigated with electrothermal atomic absorption spectrometry. Deuterium background correction was employed. The effects of various chemical modifiers on the analysis of copper were investigated. Organic modifiers which included 2-(5-bromo-2-pyridylazo)-5-(diethylamino-phenol) (Br-PADAP), ammonium citrate, 1-(2-pyridylazo)-naphthol, 4-(2-pyridylazo)resorcinol, ethylenediaminetetraacetic acid and Triton X-100 were studied. Inorganic modifiers palladium nitrate, magnesium nitrate, aluminum chloride, ammonium dihydrogen phosphate, hydrogen peroxide and potassium nitrate were also applied in this work. In addition, zirconium hydroxide and ammonium hydroxide precipitation methods have also been studied. Interference effects were effectively reduced with Br-PADAP modifier. Aqueous standards were used to construct the calibration curves. The detection limit was 1.9 pg. Standard reference materials of nickel-base alloys were used to evaluate the accuracy of the proposed method. The copper contents determined with the proposed method agreed closely with the certified values of the reference materials. The recoveries were within the range 90-100% with relative standard deviation of less than 10%. Good precision was obtained.

Lead-free solder technology transfer from ASE Americas

Energy Technology Data Exchange (ETDEWEB)

FTHENAKIS,V.

1999-10-19

To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

Experimental investigation of Ti–6Al–4V titanium alloy and 304L stainless steel friction welded with copper interlayer

Directory of Open Access Journals (Sweden)

R. Kumar

2015-03-01

Full Text Available The basic principle of friction welding is intermetallic bonding at the stage of super plasticity attained with self-generating heat due to friction and finishing at upset pressure. Now the dissimilar metal joints are especially popular in defense, aerospace, automobile, bio-medical, refinery and nuclear engineerings. In friction welding, some special alloys with dual phase are not joined successfully due to poor bonding strength. The alloy surfaces after bonding also have metallurgical changes in the line of interfacing. The reported research work in this area is scanty. Although the sound weld zone of direct bonding between Ti–6Al–4V and SS304L was obtained though many trials, the joint was not successful. In this paper, the friction welding characteristics between Ti–6Al–4V and SS304L into which pure oxygen free copper (OFC was introduced as interlayer were investigated. Box–Behnken design was used to minimize the number of experiments to be performed. The weld joint was analyzed for its mechanical strength. The highest tensile strength between Ti–6Al–4V and SS304L between which pure copper was used as insert metal was acquired. Micro-structural analysis and elemental analysis were carried out by EDS, and the formation of intermetallic compound at the interface was identified by XRD analysis.

Free energy change of off-eutectic binary alloys on solidification

Science.gov (United States)

Ohsaka, K.; Trinh, E. H.; Lin, J.-C.; Perepezko, J. H.

1991-01-01

A formula for the free energy difference between the undercooled liquid phase and the stable solid phase is derived for off-eutectic binary alloys in which the equilibrium solid/liquid transition takes place over a certain temperature range. The free energy change is then evaluated numerically for a Bi-25 at. pct Cd alloy modeled as a sub-subregular solution.

Electro-deposition metallic tungsten coatings in a Na{sub 2}WO{sub 4}-WO{sub 3} melt on copper based alloy substrate

Energy Technology Data Exchange (ETDEWEB)

Liu, Y.H., E-mail: dreamerhong77@126.com [School of Materials Science and Engineering, University of Science and Technology Beijing, 30 Xueyuan Road, Haidian District, Beijing 100083 (China); Zhang, Y.C.; Liu, Q.Z.; Li, X.L.; Jiang, F. [School of Materials Science and Engineering, University of Science and Technology Beijing, 30 Xueyuan Road, Haidian District, Beijing 100083 (China)

2012-11-15

Highlights: Black-Right-Pointing-Pointer The tungsten coating (>1 mm) was obtained by electro-deposition method in molten salt. Black-Right-Pointing-Pointer Different thickness tungsten coatings were obtained by using different durations. Black-Right-Pointing-Pointer Good performance of coating was obtained when pulse parameters were modulated. - Abstract: The tungsten coating was prepared by electro-deposition technique on copper alloy substrate in a Na{sub 2}WO{sub 4}-WO{sub 3} melt. The coating's surface and cross-section morphologies as well as its impurities were investigated by XPS, SEM and line analysis. Various plating durations were investigated in order to obtain an optimal coating's thickness. The results demonstrated that the electro-deposited coating was compact, voidless, crackless and free from impurities. The tungsten coating's maximum Vickers hardness was measured to be 520 HV. The tungsten coating's minimum oxygen content was determined to be 0.018 wt%. Its maximum thickness was measured to be 1043.67 {mu}m when the duration of electrolysis was set to 100 h. The result of this study has demonstrated the feasibility of having thicker tungsten coatings on copper alloy substrates. These electrodeposited tungsten coatings can be potentially implemented as reliable armour for the medium heat flux plasma facing component (PFC).

NASA Advances Technologies for Additive Manufacturing of GRCop-84 Copper Alloy

Science.gov (United States)

Gradl, Paul; Protz, Chris

2017-01-01

The Low Cost Upper Stage Propulsion project has successfully developed and matured Selective Laser Melting (SLM) Fabrication of the NASA developed GRCop-84 copper alloy. Several parts have been printed in house and at a commercial vendor, and these parts have been successfully machined and have undergone further fabrication steps to allow hot-fire testing. Hot-fire testing has demonstrated parts manufactured with this technique can survive and perform well in the relevant environments for liquid rocket propulsion systems.

Minimally-invasive Laser Ablation Inductively Coupled Plasma Mass Spectrometry analysis of model ancient copper alloys

Energy Technology Data Exchange (ETDEWEB)

Walaszek, Damian [University of Warsaw, Faculty of Chemistry, Biological and Chemical Research Centre, Żwirki i Wigury 101, 02-089 Warszawa (Poland); Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Senn, Marianne; Wichser, Adrian [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Faller, Markus [Laboratory for Jointing Technology and Corrosion, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Wagner, Barbara; Bulska, Ewa [University of Warsaw, Faculty of Chemistry, Biological and Chemical Research Centre, Żwirki i Wigury 101, 02-089 Warszawa (Poland); Ulrich, Andrea [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland)

2014-09-01

This work describes an evaluation of a strategy for multi-elemental analysis of typical ancient bronzes (copper, lead bronze and tin bronze) by means of laser ablation inductively coupled plasma mass spectrometry (LA-ICPMS).The samples originating from archeological experiments on ancient metal smelting processes using direct reduction in a ‘bloomery’ furnace as well as historical casting techniques were investigated with the use of the previously proposed analytical procedure, including metallurgical observation and preliminary visual estimation of the homogeneity of the samples. The results of LA-ICPMS analysis were compared to the results of bulk composition obtained by X-ray fluorescence spectrometry (XRF) and by inductively coupled plasma mass spectrometry (ICPMS) after acid digestion. These results were coherent for most of the elements confirming the usefulness of the proposed analytical procedure, however the reliability of the quantitative information about the content of the most heterogeneously distributed elements was also discussed in more detail. - Highlights: • The previously proposed procedure was evaluated by analysis of model copper alloys. • The LA-ICPMS results were comparable to the obtained by means of XRF and ICPMS. • LA-ICPMS results indicated the usefulness of the proposed analytical procedure.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Biosorption of lead and copper by heavy-metal tolerant Micrococcus luteus DE2008.

Science.gov (United States)

Puyen, Zully M; Villagrasa, Eduard; Maldonado, Juan; Diestra, Elia; Esteve, Isabel; Solé, Antoni

2012-12-01

Micrococcus luteus DE2008 has the ability to absorb lead and copper. The effect of these metals on biomass and viability of this microorganism were investigated and removal of the metals from culture media was determined. Lead had no effect on the biomass expressed as mg Carbon/cm(3) of M. Iuteus DE2008, but in the case of copper, the minimum metal concentration that affected the biomass was 0.1 mM Cu(II). According to these results this microorganism shows a greater tolerance for lead. The minimum metal concentration that affected viability (expressed as the percentage of live cells) was 0.5 mM for both metals. M. luteus DE2008 exhibited a specific removal capacity of 408 mg/g for copper and 1965 mg/g for lead. This microorganism has a greater ability to absorb Pb(II) than Cu(II). M. luteus DE2008 could be seen as a microorganism capable of restoring environments polluted by lead and copper. Copyright © 2012 Elsevier Ltd. All rights reserved.

Gibbs free energy of formation of liquid lanthanide-bismuth alloys

International Nuclear Information System (INIS)

Sheng Jiawei; Yamana, Hajimu; Moriyama, Hirotake

2001-01-01

The linear free energy relationship developed by Sverjensky and Molling provides a way to predict Gibbs free energies of liquid Ln-Bi alloys formation from the known thermodynamic properties of aqueous trivalent lanthanides (Ln 3(5(6+ ). The Ln-Bi alloys are divided into two isostructural families named as the LnBi 2 (Ln=La, Ce, Pr, Nd and Pm) and LnBi (Ln=Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm and Yb). The calculated Gibbs free energy values are well agreed with experimental data

Experimental system design of liquid lithium-lead alloy bubbler for DFLL-TBM

International Nuclear Information System (INIS)

Xie Bo; Li Junge; Xu Shaomei; Weng Kuiping

2011-01-01

The liquid lithium-lead alloy bubbler is a very important composition in the tritium unit of Chinese Dual-Functional Lithium Lead Test Blanket Module (DFLL-TBM). In order to complete the construction and run of the bubbler experimental system,overall design of the system, main circuit design and auxiliary system design have been proposed on the basis of theoretical calculations for the interaction of hydrogen isotope with lithium-lead alloy and experiment for hydrogen extraction from liquid lithium-lead alloy by bubbling with rotational jet nozzle. The key of this design is gas-liquid exchange packed column, to achieve the measurement and extraction of hydrogen isotopes from liquid lithium-lead alloy. (authors)

Microstructures and formation mechanism of W–Cu composite coatings on copper substrate prepared by mechanical alloying method

International Nuclear Information System (INIS)

Meng, Yunfei; Shen, Yifu; Chen, Cheng; Li, Yongcan; Feng, Xiaomei

2013-01-01

In the present work, high-energy mechanical alloying (MA) method was applied to prepare tungsten–copper composite coatings on pure copper surface using a planetary ball mill. During mechanical alloying process, grains on the surface layer of substrate were refined and the substrate surface was activated as a result of repeated collisions by a large number of flying balls along with powder particles. The repeated ball-to-substrate collisions resulted in the deposition of coatings. The microstructures and elemental and phase composition of mechanically alloyed coatings at different milling durations during mechanical alloying process were studied using scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive X-ray spectroscopy (EDS). Microhardness tests were carried out to examine the mechanical properties of the coatings. The results showed that the coatings and the substrates were well bonded, and with the increase of the milling duration, multi-layered coatings with different structures were generated and the coatings became denser. The microhardness tests showed that the maximum microhardness of the coatings reached HV 0.1 228, showing a threefold improvement upon the substrate. And the cross-sectional microhardness values of the processed sample changed gradually, which gave a proof for the cushioning and sustaining functions of the multi-layered coatings. A reasonable formation mechanism of coatings on bulk materials with metallic immiscible system by mechanical alloying method was presented.

Effects of low doses of 14-MeV neutrons on the tensile properties of three binary copper alloys

International Nuclear Information System (INIS)

Heinisch, H.L.; Pintler, J.S.

1986-12-01

Miniature tensile specimens of high purity copper and copper alloyed respectively with five atom percent of Al, Mn, and Ni were irradiated with D-T fusion neutrons in the RTNS-II to fluences up to 1.3 x 10 18 n/cm 2 at 90 0 C. To compare fission and fusion neutron effects, some specimens were also irradiated at the same temperature to similar damage levels in the Omega West Reactor (OWR). Tensile tests were performed at room temperature, and the radiation-induced changes in tensile properties were examined as functions of displacements per atom (dpa). The irradiation-induced strengthening of Cu5%Mn is greater than that of Cu5%Al and Cu5%Ni, which behave about the same. However, all the alloys sustain less irradiation-induced strengthening by 14 MeV neutrons than pure copper, which is in contrast to the reported results of earlier work using hardness measurements. The effects of fission and fusion neutrons on the yield stress of Cu5%Al and Cu5%Ni correlate well on the basis of dpa, but the data for Cu5%Mn suggest that dpa may not be a good correlation parameter for this alloy in this fluence and temperature range

Corrosion-electrochemical behaviour and mechanical properties ofaluminium alloy-321, alloyed by barium

International Nuclear Information System (INIS)

Ganiev, I.; Mukhiddinov, G.N.; Kargapolova, T.V.; Mirsaidov, U.

1995-01-01

The purpose of present work is studying of influence of barium additionson electrochemical corrosion of casting aluminium-copper alloy Al-321,containing as base alloying components copper, chromium, manganese, titanium,zirconium, cadmium

Study on improved tribological properties by alloying copper to CP-Ti and Ti-6Al-4V alloy.

Science.gov (United States)

Wang, Song; Ma, Zheng; Liao, Zhenhua; Song, Jian; Yang, Ke; Liu, Weiqiang

2015-12-01

Copper alloying to titanium and its alloys is believed to show an antibacterial performance. However, the tribological properties of Cu alloyed titanium alloys were seldom studied. Ti-5Cu and Ti-6Al-4V-5Cu alloys were fabricated in the present study in order to further study the friction and wear properties of titanium alloys with Cu additive. The microstructure, composition and hardness were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscope (TEM) and hardness tester. The tribological behaviors were tested with ZrO2 counterface in 25% bovine serum using a ball-on-disc tribo-tester. The results revealed that precipitations of Ti2Cu intermetallic compounds appeared in both Ti-5Cu and Ti-6Al-4V-5Cu alloys. The tribological results showed an improvement in friction and wear resistance for both Ti-5Cu and Ti-6Al-4V-5Cu alloys due to the precipitation of Ti2Cu. The results also indicated that both CP-Ti and Ti-5Cu behaved better wear resistance than Ti-6Al-4V and Ti-6Al-4V-5Cu due to different wear mechanisms when articulated with hard zirconia. Both CP-Ti and Ti-5Cu revealed dominant adhesive wear with secondary abrasive wear mechanism while both Ti-6Al-4V and Ti-6Al-4V-5Cu showed severe abrasive wear and cracks with secondary adhesive wear mechanism due to different surface hardness integrated by their microstructures and material types. Copyright © 2015 Elsevier B.V. All rights reserved.

SOLVING COPPER CORROSION PROBLEMS WHILE MAINTAINING LEAD CONTROL IN A HIGH ALKALINITY WATER USING ORTHOPHOSPHATE

Science.gov (United States)

Lead and Copper Rule sampling in 1992 uncovered high copper levels in many homes in the Indian Hill Water Works, Ohio (IHWW) water system. The 90th percentile copper and lead levels were 1.63 mg/L and 0.012 mg/L, respectively. IHWW supplies water to several suburban communities t...

Copper-Sulfate Pentahydrate as a Product of the Waste Sulfuric Acid Solution Treatment

OpenAIRE

Marković, Radmila; Stevanović, Jasmina; Avramović, Ljiljana; Nedeljković, Dragutin; Jugović, Branimir; Stajić Trošić, Jasna; Gvozdenović, Milica M.

2012-01-01

The aim of this study is synthesis of copper-sulfate pentahydrate from the waste sulfuric acid solution-mother liquor generated during the regeneration process of copper bleed solution. Copper is removed from the mother liquor solution in the process of the electrolytic treatment using the insoluble lead anodes alloyed with 6 mass pct of antimony on the industrial-scale equipment. As the result of the decopperization process, copper is removed in the form of the cathode sludge and is precipit...

Fracture testing and performance of beryllium copper alloy C 17510

International Nuclear Information System (INIS)

Murray, H.A.; Zatz, I.J.

1992-01-01

A series of test programs was undertaken on copper beryllium alloy C 17510 for several variations in material process and chemistry. These variations in C 17510 were primarily optimized for combinations of strength and conductivity. While originally intended for use as cyclically loaded high-field, high-strength conductors in fusion energy research, material testing of C 17510 has indicated that it is an attractive and economical alternative for a host of other structural, mechanical and electrical applications. ASTM tests performed on three variations of C 17510 alloys included both J-integral and plane strain fracture toughness testing (E813, E399) and fatigue crack growth rate tests (E647), as well as verifying tensile, hardness, Charpy, and other well defined mechanical properties. Fracture testing was performed at both room and liquid nitrogen temperatures, which bound the thermal environment anticipated for the fusion components being designed. Fatigue crack propagation stress ratios ranged from nominal zero to minus one at each temperature

Effect of Post Weld Heat Treatment on Corrosion Behavior of AA2014 Aluminum – Copper Alloy Electron Beam Welds

Science.gov (United States)

Venkata Ramana, V. S. N.; Mohammed, Raffi; Madhusudhan Reddy, G.; Srinivasa Rao, K.

2018-03-01

The present work pertains to the study of corrosion behavior of aluminum alloy electron beam welds. The aluminium alloy used in the present study is copper containing AA2014 alloy. Electron Beam Welding (EBW) was used to weld the alloys in annealed (O) condition. Microstructural changes across the welds were recorded and the effect of post weld heat treatment (PWHT) in T4 (Solutionized and naturally aged) condition on pitting corrosion resistance was studied. A software based PAR basic electrochemical system was used for potentio-dynamic polarization tests. From the study it is observed that weld in O condition is prone to more liquation than that of PWHT condition. This may be attributed to re-melting and solidification of excess eutectic present in the O condition of the base metal. It was also observed that slightly higher hardness values are recorded in O condition than that of PWHT condition. The pitting corrosion resistance of the PMZ/HAZ in PWHT condition is better than that of O condition. This is attributed to copper segregation at the grain boundaries of PMZ in O condition.

Thermal conductivity of tungsten–copper composites

International Nuclear Information System (INIS)

Lee, Sang Hyun; Kwon, Su Yong; Ham, Hye Jeong

2012-01-01

Highlights: ► We present the temperature dependence of the thermophysical properties for tungsten–copper composite from room temperature to 400 °C. The powders of tungsten–copper were produced by the spray conversion method and the W–Cu alloys were fabricated by the metal injection molding. Thermal conductivity and thermal expansion of tungsten–copper composite was controllable by volume fraction copper. - Abstract: As the speed and degree of integration of semiconductor devices increases, more heat is generated, and the performance and lifetime of semiconductor devices depend on the dissipation of the generated heat. Tungsten–copper alloys have high electrical and thermal conductivities, low contact resistances, and low coefficients of thermal expansion, thus allowing them to be used as a shielding material for microwave packages, and heat sinks for high power integrated circuits (ICs). In this study, the thermal conductivity and thermal expansion of several types of tungsten–copper (W–Cu) composites are investigated, using compositions of 5–30 wt.% copper balanced with tungsten. The tungsten–copper powders were produced using the spray conversion method, and the W–Cu alloys were fabricated via the metal injection molding. The tungsten–copper composite particles were nanosized, and the thermal conductivity of the W–Cu alloys gradually decreases with temperature increases. The thermal conductivity of the W–30 wt.% Cu composite was 238 W/(m K) at room temperature.

Polarization behavior of new and used lead alloys in acid sulfate solutions

Energy Technology Data Exchange (ETDEWEB)

Yu, P.; O' Keefe, T.J. [Univ. of Missouri-Rolla, Materials Research Center and Dept. of Metallurgical Engineering, Rolla, Missouri (United States)

2001-07-01

Polarization and Electrochemical impedance were used to study various lead alloys commercially used to electrowin zinc and copper from acidic sulfate solutions. Anode specimens that had been in service at several electrowinning operations were tested and their electrochemical performance was compared to that obtained from new anode samples. Tests were conducted in sulfuric acid. Cyclic voltammetry was used in a potential range in which both Pb{sup +2} and Pb{sup +4} formed stable phases. Selected polarization tests were also made to study a number of variables, including changes in the concentration of cobalt and manganese in the electrolyte. Results showed that the phases formed on the surface of the anode were critical in defining the electrochemical behavior of the anodes. In particular, certain active phases, which were depolarizing were identified on some of the used anodes. It was possible to duplicate some of these phases in the laboratory. (author)

Effects of alloying element on weld characterization of laser-arc hybrid welding of pure copper

Science.gov (United States)

Hao, Kangda; Gong, Mengcheng; Xie, Yong; Gao, Ming; Zeng, Xiaoyan

2018-06-01

Effects of alloying elements of Si and Sn on weld characterizations of laser-arc hybrid welded pure copper (Cu) with thickness of 2 mm was studied in detail by using different wires. The weld microstructure was analyzed, and the mechanical properties (micro-hardness and tensile property), conductivity and corrosion resistance were tested. The results showed that the alloying elements benefit the growth of column grains within weld fusion zone (FZ), increase the ultimate tensile strength (UTS) of the FZ and weld corrosion resistance, and decrease weld conductivity. The mechanisms were discussed according to the results.

The effect lead impurities on the corrosion resistance of alloy 600 and alloy 690 in high temperature water

International Nuclear Information System (INIS)

Sakai, T.; Nakagomi, N.; Kikuchi, T.; Aoki, K.; Nakayasu, F.; Yamakawa, K.

1998-01-01

Degradation of nickel-based alloy steam generator (SG) tubing caused by lead-induced corrosion has been reported recently in some PWR plants. Several laboratory studies also have shown that lead causes intergranular or transgranular stress corrosion cracking (IGSCC or TGSCC) of the tubing materials. Information from previous studies suggests two possible explanations for the mechanism of lead-induced corrosion. One is selective dissolution of tube metal elements, resulting in formation of a lead-containing nickel-depleted oxide film as observed in mildly acidic environments. The other explanation is an increase in potential, as has been observed in lead-contaminated caustic environments, although not in all volatile treatment (AVT) water such as the ammonium-hydrazine water chemistry. These observation suggest that an electrochemical reaction between metal elements and dissolved lead might be the cause of lead-induced corrosion. The present work was undertaken to clarify the lead-induced corrosion mechanism of nickel-based alloys from an electrochemical viewpoint, focusing on mildly acidic and basic environments. These are the probable pH conditions in the crevice region between the tube and tube support plate of the SG where corrosion damage could occur. Measurements of corrosion potential and electrochemical polarization of nickel-based alloys were performed to investigate the effect of lead on electrochemical behavior of the alloys. Then, constant extension rate tests (CERT) were carried out to determine the corrosion susceptibility of the alloys in a lead-contaminated environment. (J.P.N.)

Atomic absorption spectrometric determination of copper, zinc, and lead in geological materials

Science.gov (United States)

Sanzolone, R.F.; Chao, T.T.

1976-01-01

An atomic absorption spectrometric method is described for the determination of copper, zinc, and lead in geological materials. The sample is digested with HF-HCl-H2O2; the final solution for analysis is in 10 % (v/v) HCl. Copper and zinc are determined directly by aspirating the solution into an air-acetylene flame. A separate aliquot of the solution is used for determination of lead; lead is extracted into TOPO-MIBK from the acidic solution in the presence of iodide and ascorbic acid. For a 0.50-g sample, the limits of determination are 10-2000 p.p.m. for Cu and Zn, and 5-5000 p.p.m. for Pb. As much as 40 % Fe or Ca. and 10 % Al, Mg, or Mn in the sample do not interfere. The proposed method can be applied to the determination of copper, zinc, and lead in a wide range of geological materials including iron- and manganese-rich, calcareous and carbonate samples. ?? 1976.

Arsenic, chromium, copper, iron, manganese, lead, selenium and ...

African Journals Online (AJOL)

2014-05-20

May 20, 2014 ... Arsenic, chromium, copper, iron, manganese, lead, selenium and zinc in the ... and sediment were collected and trace element concentrations were measured with an ICP-MS. ..... Clay minerals are known to have high sorption affinities ..... sediment/water quality interaction with particular reference to the.

Hydrogen in oxygen-free, phosphorus-doped copper-Charging techniques, hydrogen contents and modelling of hydrogen diffusion and depth profile

International Nuclear Information System (INIS)

Martinsson, Aasa; Sandstroem, Rolf; Lilja, Christina

2013-01-01

In Sweden spent nuclear fuel is planned to be disposed of by encapsulating in cast iron inserts protected by a copper shell. The copper can be exposed to hydrogen released during corrosion processes in the inserts. If the hydrogen is taken up by the copper, it could lead to hydrogen embrittlement. Specimens from oxygen-free copper have been hydrogen charged using two different methods. The purpose was to investigate how hydrogen could be introduced into copper in a controlled way. The thermal charging method resulted in a reduction of the initial hydrogen content. After electrochemical charging of cylindrical specimens, the measured hydrogen content was 2.6 wt. ppm which should compared with 0.6 wt. ppm before charging. The retained hydrogen after two weeks was reduced by nearly 40%. Recently the paper 'Hydrogen depth profile in phosphorus-doped, oxygen-free copper after cathodic charging' (Martinsson and Sandstrom, 2012) has been published. The paper describes experimental results for bulk specimens as well as presenting a model. Almost all the hydrogen is found to be located less than 100 μm from the surface. This model is used to interpret the experimental results on foils in the present report. Since the model is fully based on fundamental equations, it can be used to analyse what happens in new situations. In this report the effect of the charging intensity, the grain size, the critical nucleus size for hydrogen bubble formation as well as the charging time are analysed

Hydrogen in oxygen-free, phosphorus-doped copper - Charging techniques, hydrogen contents and modelling of hydrogen diffusion and depth profile

Energy Technology Data Exchange (ETDEWEB)

Martinsson, Aasa [Swerea KIMAB, Kista (Sweden); Sandstroem, Rolf [Swerea KIMAB, Kista (Sweden); Div. of Materials Science and Engineering, KTH Royal Institute of Technology, Stockholm (Sweden); Lilja, Christina [Swedish Nuclear Fuel and Waste Management Co., Stockholm (Sweden)

2013-01-15

In Sweden spent nuclear fuel is planned to be disposed of by encapsulating in cast iron inserts protected by a copper shell. The copper can be exposed to hydrogen released during corrosion processes in the inserts. If the hydrogen is taken up by the copper, it could lead to hydrogen embrittlement. Specimens from oxygen-free copper have been hydrogen charged using two different methods. The purpose was to investigate how hydrogen could be introduced into copper in a controlled way. The thermal charging method resulted in a reduction of the initial hydrogen content. After electrochemical charging of cylindrical specimens, the measured hydrogen content was 2.6 wt. ppm which should compared with 0.6 wt. ppm before charging. The retained hydrogen after two weeks was reduced by nearly 40%. Recently the paper 'Hydrogen depth profile in phosphorus-doped, oxygen-free copper after cathodic charging' (Martinsson and Sandstrom, 2012) has been published. The paper describes experimental results for bulk specimens as well as presenting a model. Almost all the hydrogen is found to be located less than 100 {mu}m from the surface. This model is used to interpret the experimental results on foils in the present report. Since the model is fully based on fundamental equations, it can be used to analyse what happens in new situations. In this report the effect of the charging intensity, the grain size, the critical nucleus size for hydrogen bubble formation as well as the charging time are analysed.

Subthreshold displacement damage in copper--aluminum alloys during electron irradiation

International Nuclear Information System (INIS)

Drosd, R.; Kosel, T.; Washburn, J.

1976-12-01

During electron irradiation at low energies which results in a negligible damage rate in a pure material, lighter solute atoms are displaced, which may in turn indirectly displace solvent atoms by a focussed replacement collision or an interstitial diffusion jump. The extent to which lighter solute atoms contribute to the subthreshold damage rate has been examined by irradiating copper--aluminum alloys at high temperatures in a high voltage electron microscope. The damage rate, as measured by monitoring the growth rate of dislocation loops, at 300 kV was found to increase linearly with the aluminum concentration

Initiation and propagation of cleared channels in neutron-irradiated pure copper and a precipitation hardened CuCrZr alloy

DEFF Research Database (Denmark)

Edwards, D.J.; Singh, B.N.; Bilde-Sørensen, Jørgen

2005-01-01

The formation of ‘cleared’ channels in neutron irradiated metals and alloys have been frequently reported for more than 40 years. So far, however, no unambiguous and conclusive evidence showing as to how and where these channels are initiated has emerged. In the following we present experimental...... results illustrating initiation and propagation of channels during post-irradiation deformation of neutron irradiated copper and a copper alloy. The observations strongly suggest that the channels are initiated at boundaries, large inclusions and even at previously formed cleared channels. Some...... of these newly generated dislocations in the matrix causes the formation of cleared channels. Implications of these results are discussed with specific reference to the origin and consequences of plastic flow localization....

Study on improved tribological properties by alloying copper to CP-Ti and Ti–6Al–4V alloy

Energy Technology Data Exchange (ETDEWEB)

Wang, Song [Biomechanics and Biotechnology Lab, Research Institute of Tsinghua University in Shenzhen, Shenzhen 518057 (China); Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Ma, Zheng [Institute of Metal Research, Chinese Academy of Science, Shenyang 110016 (China); Liao, Zhenhua [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Biomechanics and Biotechnology Lab, Research Institute of Tsinghua University in Shenzhen, Shenzhen 518057 (China); Song, Jian [State Key Laboratory of Tribology, Tsinghua University, Beijing 100084 (China); Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Yang, Ke [Institute of Metal Research, Chinese Academy of Science, Shenyang 110016 (China); Liu, Weiqiang, E-mail: weiqliu@hotmail.com [Biomechanics and Biotechnology Lab, Research Institute of Tsinghua University in Shenzhen, Shenzhen 518057 (China); State Key Laboratory of Tribology, Tsinghua University, Beijing 100084 (China)

2015-12-01

Copper alloying to titanium and its alloys is believed to show an antibacterial performance. However, the tribological properties of Cu alloyed titanium alloys were seldom studied. Ti–5Cu and Ti–6Al–4V–5Cu alloys were fabricated in the present study in order to further study the friction and wear properties of titanium alloys with Cu additive. The microstructure, composition and hardness were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscope (TEM) and hardness tester. The tribological behaviors were tested with ZrO{sub 2} counterface in 25% bovine serum using a ball-on-disc tribo-tester. The results revealed that precipitations of Ti{sub 2}Cu intermetallic compounds appeared in both Ti–5Cu and Ti–6Al–4V–5Cu alloys. The tribological results showed an improvement in friction and wear resistance for both Ti–5Cu and Ti–6Al–4V–5Cu alloys due to the precipitation of Ti{sub 2}Cu. The results also indicated that both CP-Ti and Ti–5Cu behaved better wear resistance than Ti–6Al–4V and Ti–6Al–4V–5Cu due to different wear mechanisms when articulated with hard zirconia. Both CP-Ti and Ti–5Cu revealed dominant adhesive wear with secondary abrasive wear mechanism while both Ti–6Al–4V and Ti–6Al–4V–5Cu showed severe abrasive wear and cracks with secondary adhesive wear mechanism due to different surface hardness integrated by their microstructures and material types. - Highlights: • Ti–5Cu and Ti–6Al–4V–5Cu alloys were fabricated with Cu additive. • Precipitations of Ti{sub 2}Cu intermetallic compounds appeared after alloying Cu. • The precipitation of Ti{sub 2}Cu improved both friction and wear resistance. • Plowing was the dominant material removal force with severe plowing phenomenon. • Different dominant and secondary wear mechanisms appeared with different hardness.

RESEARCH OF PROCESS OF AN ALLOYING OF THE FUSED COATINGS RECEIVED FROM THE SUPERFICIAL ALLOYED WIRE BY BORON WITH IN ADDITIONALLY APPLIED ELECTROPLATED COATING OF CHROME AND COPPER

Directory of Open Access Journals (Sweden)

V. A. Stefanovich

2015-01-01

Full Text Available Researches on distribution of chrome and copper in the fused coating received from the superficial alloyed wire by boron with in additionally applied electroplated coating of chrome and copper were executed. The structure of the fused coating consists of dendrites on which borders the boride eutectic is located. It is established that the content of chrome in dendrites is 1,5– 1,6 times less than in the borid; distribution of copper on structure is uniformed. Coefficients of digestion of chrome and copper at an argon-arc welding from a wire electrode with electroplated coating are established. The assimilation coefficient for chrome is equal to 0,9–1,0; for copper – 0,6–0,75.

Long term creep strength of silver alloyed copper

International Nuclear Information System (INIS)

Auerkari, P.; Sandlin, S.

1988-12-01

The long term creep strength of silver alloyed copper has been estimated using literature creep data for materials with less than 0.1% Ag. The available data was very limited, and it was necessary to test the differences between various data sets and extrapolation methods. Assuming constant stress level and constant or changing temperature, the creep behaviour has been assessed using mainly Larson-Miller and theta-projection approaches. The calculations indicate that the different extrapolation methods and data sources can yield strongly different life estimates. With the available incomplete data the theta projection method may give the conservative life predictions, whereas the Larson-Miller approach grossly overestimates creep life. It is recommended that supplementary data is acquired to better assess the long term creep properties of canisters in repository conditions

Investigation of the influence of grain boundary chemistry, test temperatures, and strain rate on the fracture behavior of ITER copper alloys

Energy Technology Data Exchange (ETDEWEB)

Leedy, K.; Stubbins, J.F.; Krus, D. [and others

1997-08-01

In an effort to understand the mechanical behavior at elevated temperatures (>200{degrees}C) of the various copper alloys being considered for use in the ITER first wall, divertor, and limiter, a collaborative study has been initiated by the University of Illinois and PNNL with two industrial producers of copper alloys, Brush Wellman and OMG Americas. Details of the experimental matrix and test plans have been finalized and the appropriate specimens have already been fabricated and delivered to the University of Illinois and PNNL for testing and analysis. The experimental matrix and testing details are described in this report.

Assessment of Copper, Cadmium and Lead in Organical Matrix

International Nuclear Information System (INIS)

Gutierrez, Ariel

2000-08-01

In this report the electrochemical method of differential pulse anode voltametry redisolution voltametry is used to quantitative assessment of copper, cadmium and lead in solution. The methodology is described in the preparation of samples for measurement

Influence of heat treatment on fatigue performances for self-piercing riveting similar and dissimilar titanium, aluminium and copper alloys

OpenAIRE

Zhang, Xianlian; He, Xiaocong; Xing, Baoying; Zhao, Lun; Lu, Yi; Gu, Fengshou; Ball, Andrew

2016-01-01

The fatigue performances of self-piercing riveting (SPR) joints connecting similar and dissimilar sheets of TA1 titanium alloy (TA1), Al5052 aluminium alloy (Al5052) and H62 copper alloy (H62) were studied in this paper. The specimens of similar TA1 sheets treated with stress relief annealing were prepared to investigate the influence of relief annealing on the mechanical properties of SPR joints. Fatigue tests were conducted to characterize the fatigue lives and failure modes of the joints. ...

Lead-free piezoceramics.

Science.gov (United States)

Saito, Yasuyoshi; Takao, Hisaaki; Tani, Toshihiko; Nonoyama, Tatsuhiko; Takatori, Kazumasa; Homma, Takahiko; Nagaya, Toshiatsu; Nakamura, Masaya

2004-11-04

Lead has recently been expelled from many commercial applications and materials (for example, from solder, glass and pottery glaze) owing to concerns regarding its toxicity. Lead zirconium titanate (PZT) ceramics are high-performance piezoelectric materials, which are widely used in sensors, actuators and other electronic devices; they contain more than 60 weight per cent lead. Although there has been a concerted effort to develop lead-free piezoelectric ceramics, no effective alternative to PZT has yet been found. Here we report a lead-free piezoelectric ceramic with an electric-field-induced strain comparable to typical actuator-grade PZT. We achieved this through the combination of the discovery of a morphotropic phase boundary in an alkaline niobate-based perovskite solid solution, and the development of a processing route leading to highly textured polycrystals. The ceramic exhibits a piezoelectric constant d33 (the induced charge per unit force applied in the same direction) of above 300 picocoulombs per newton (pC N(-1)), and texturing the material leads to a peak d33 of 416 pC N(-1). The textured material also exhibits temperature-independent field-induced strain characteristics.

Physical, optical and structural studies of copper-doped lead ...

Indian Academy of Sciences (India)

2018-05-23

May 23, 2018 ... Physical, optical and structural studies of copper-doped lead oxychloro ... to the borate glass system increases the Raman scattering cross-section by ..... equations (6) and (7), molar refraction and electronic polariz- ability are ...

Obtention of copper-magnesium alloys wires used in electrical transmission lines

International Nuclear Information System (INIS)

Fernandes, Marcos Gonzales

2010-01-01

The aim of this work was to obtain copper wires in three different chemical compositions starting from electrolytic copper and magnesium. The mains steps were evaluated, starting from the melting of small eutectic cooper-magnesium specimens in an electric arc furnace, followed by further dilution of this buttons in a resistive furnace and casting it in a copper mould. The as cast billets were homogenized in a resistive furnace at 910 degree C for 2 h. The billets were mechanically cold worked by swaging and a final drawing step to attain a round shape and a reasonable surface quality. The cast ingots chemical analysis indicated that the processing route showed to be adequate, in laboratory scale, to obtain wires with cross sectional area of 4 mm2 and 10 m in length. The wires in both conditions - as cold worked and after a recovering heat treatment at 510 degree C for 1 h, were mechanically characterized by tensile testing and hardness. The wires had also the electric conductivity assessed in the recovered heat-treated state and the results were compared to the literature data. The obtained material showed to be adequate to be used as electric conductor. The yield strain and ultimate tensile strength were improved with the increasing amount of Mg in the alloy, 11 % and 24 %, respectively, while the electric conductivity decreased to 60 % IACS (International Annealed Copper Standard). (author)

Radiation induced structural changes in alpha-copper-zinc alloys

International Nuclear Information System (INIS)

Schuele, W.; Gieb, M.

1991-01-01

During irradiation of alpha-copper-zinc alloys with high energy electrons and protons a decrease of the electrical resistivity due to an increase of the degree of short range order is observed through radiation enhanced diffusion followed by an increase of the electrical resistivity through the formation of radiation induced interstitial clusters. The initial formation rate of interstitial clusters increases about linearly with the displacement rate for electron and proton irradiation. The largest initial formation rate is found between 60 and 130 0 C becoming negligibly small above 158 0 C and decreases drastically below 60 0 C. The dynamic steady state interstitial cluster concentration increases with decreasing irradiation temperature in the investigated temperature range between 158 and 40 0 C. Above 158 0 C the formation rate of interstitial clusters is negligibly small. Thus the transition temperature for radiation induced interstitial cluster formation is 158 0 C, depending mainly on the migration activation energy of vacancies. The radiation induced interstitial clusters are precipitates in those alloys in which the diffusion rate of the undersized component atoms via an interstitialcy diffusion mechanism is larger than that of the other atoms

Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys

Directory of Open Access Journals (Sweden)

Kopyto M.

2009-01-01

Full Text Available The electromotive force measurement method was employed to determine the thermodynamic properties of liquid Bi-Cu-Sn alloys using solid electrolyte galvanic cells as shown below: Kanthal+Re, Bi-Cu-Sn, SnO2 | Yttria Stabilized Zirconia | air, Pt, Po2=0.2:1 atm Measurements were carried out for three cross-sections with constant Bi/Cu ratio equal to: 1/3, 1 and 3 and for various tin content varying every 10%, resulting in a total of 26 different alloy compositions. The temperature of the measurements varied within the range from 973 to 1325 K. A linear dependence of the e.m.f. on temperature was observed for all alloy compositions and the appropriate line equations were derived. Tin activities were calculated as function of composition and temperature. Results were presented in tables and figures.

Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

Science.gov (United States)

Reeve, Kathlene N.; Handwerker, Carol A.

2018-01-01

The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

Refining processes in the copper casting technology

OpenAIRE

Rzadkosz, S.; Kranc, M.; Garbacz-Klempka, A.; Kozana, J.; Piękoś, M.

2015-01-01

The paper presents the analysis of technology of copper and alloyed copper destined for power engineering casts. The casts quality was assessed based on microstructure, chemical content analysis and strength properties tests. Characteristic deoxidising (Logas, Cup) and modifying (ODM2, Kupmod2) formulas were used for the copper where high electrical conductivity was required. Chosen examples of alloyed copper with varied Cr and Zr content were studied, and the optimal heat treatment parameter...

A comparison of fingerprint sweat corrosion of different alloys of brass.

Science.gov (United States)

Sykes, Stephanie; Bond, John W

2013-01-01

Fingerprint sweat from 40 donors was deposited onto samples of five α and α + β phase brasses, comprising five alloys with different copper and zinc concentrations, two of which also had the addition of small concentrations of lead. Visual grading of the visibility of the corrosion revealed that brasses with the least amount of zinc produced the most visible and fully formed fingerprints from the most donors. Consideration of previously reported mechanisms for the corrosion of brass suggests red copper (I) oxide as a likely corrosion product for low zinc brasses, and a consideration of the color, composition, and solubility of fingerprint sweat corrosion products suggests that copper (I) oxide produces good contrast and visibility with the brass substrate. Scanning electron microscope images of the corrosion of all five alloys confirmed the enhanced contrast between corroded and uncorroded areas for low zinc alloys. © 2012 American Academy of Forensic Sciences.

High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Science.gov (United States)

Mallampati, Sandeep

Predominant high melting point solders for high-temperature electronics (operating temperatures from 200 to 250°C) are Pb-based which are being banned from usage due to their toxic nature. In this study, high bismuth alloy compositions (Bi-14Cu-8Sn, Bi-20Sb-10Cu, Bi-15Sb-10Cu and Bi-10Sb-10Cu) were designed, cast, and characterized to understand their potential as replacements. The desirable aspect of Bi is its high melting temperature, which is 271°C. Alloying elements Sn, Sb and Cu were added to improve some of its properties such as thermal conductivity, plasticity, and reactivity with Cu and Ni surface. Metallographic sectioning and microstructure analysis were performed on the bulk alloys to compare the evolution of phases predicted from equilibrium phase diagrams. Reflow processes were developed to make die-attach samples out of the proposed alloys and die-shear testing was carried out to characterize mechanical integrity of the joint. Thermal shock between -55°C to 200°C and high temperature storage at 200°C were performed on the assembled die-attach samples to study microstructure evolution and mechanical behavior of the reflowed alloys under accelerated testing conditions. In addition, heat dissipation capabilities, using flash diffusivity, were measured on the bulk alloys and also on the die-attach assembly. Finally, tensile testing was performed on the dogbone specimens to identify the potential for plastic deformation and electron backscatter diffraction (EBSD) analysis was used to study the grain orientations on the fracture surfaces and their influence on the crack propagation. Bi-14Cu-8Sn has formed BiNi by on the die backside metallization and the reaction with Cu was poor. This has resulted in weaker substrate side interface. It was observed that Bi-Sb alloys have strong reactivity with Ni (forming Bi3Ni, BiNi and NiSb intermetallic phases), and with Cu (forming Cu2Sb, Cu4Sb). Spallation was observed in NiSb interfacial intermetallic layer and

Antimicrobial copper alloys decreased bacteria on stethoscope surfaces.

Science.gov (United States)

Schmidt, Michael G; Tuuri, Rachel E; Dharsee, Arif; Attaway, Hubert H; Fairey, Sarah E; Borg, Keith T; Salgado, Cassandra D; Hirsch, Bruce E

2017-06-01

Stethoscopes may serve as vehicles for transmission of bacteria among patients. The aim of this study was to assess the efficacy of antimicrobial copper surfaces to reduce the bacterial concentration associated with stethoscope surfaces. A structured prospective trial involving 21 health care providers was conducted at a pediatric emergency division (ED) (n = 14) and an adult medical intensive care unit located in tertiary care facilities (n = 7). Four surfaces common to a stethoscope and a facsimile instrument fabricated from U.S. Environmental Protection Agency-registered antimicrobial copper alloys (AMCus) were assessed for total aerobic colony counts (ACCs), methicillin-resistant Staphylococcus aureus, gram-negative bacteria, and vancomycin-resistant enterococci for 90 days. The mean ACCs collectively recovered from all stethoscope surfaces fabricated from the AMCus were found to carry significantly lower concentrations of bacteria (pediatric ED, 11.7 vs 127.1 colony forming units [CFU]/cm 2 , P stethoscopes was the most heavily burdened surface; mean concentrations exceeded the health care-associated infection acquisition concentration (5 CFU/cm 2 ) by at least 25×, supporting that the stethoscope warrants consideration in plans mitigating microbial cross-transmission during patient care. Stethoscope surfaces fabricated with AMCus were consistently found to harbor fewer bacteria. Copyright © 2017 Association for Professionals in Infection Control and Epidemiology, Inc. Published by Elsevier Inc. All rights reserved.

Lead, arsenic, and copper content of crops grown on lead arsenate-treated and untreated soils

Energy Technology Data Exchange (ETDEWEB)

Chisholm, D

1972-01-01

Increased lead and arsenic concentrations in the surface soil (0-15 cm), resulting from applications of lead arsenate (PbHAs0/sub 1/), increased both lead and arsenic levels in crops grown on treated plots. The lead levels in some crops approached or exceeded the Canadian residue tolerance of 2.0 ppM. Lead arsenate soil treatments did not affect copper absorption by crops. On areas such as old orchard land contaminated with lead arsenate residues it may be advisable to ascertain crops, and also to determine the lead affinity and arsenic sensitivity of the plants to be grown.

Evaluation of the hazard associated with fabricating beryllium copper alloys

International Nuclear Information System (INIS)

Senn, T.J.

1977-01-01

Beryllium-copper alloys should be considered toxic materials and proper controls must be used when they are machined, heated, or otherwise fabricated. Air samples should be taken for each type of fabrication to determine the worker's exposure and the effectiveness of the controls in use. It has been shown that aerosols containing beryllium are generated during the four methods of fabrication tested, and that these aerosols can be reduced through local exhaust to undetectable levels. Considering the acute, chronic and possibly carcinogenic effects of exposure to beryllium, effective controls should be required because they are feasible both technologically and economically. The health hazards and control measures are reviewed

Ternary equilibria in bismuth--indium--lead alloys

International Nuclear Information System (INIS)

Liao, K.C.; Johnson, D.L.; Nelson, R.C.

1975-01-01

The liquidus surface is characterized by three binary equilibria. One binary extends from the Pb--Bi peritectic to the Pb--In peritectic. The other two extend from In--Bi eutectics, merge at 50 at. percent Bi and 30 at. percent Pb, and end at the Bi--Pb eutectic. Based on analysis of ternary liquidus contours and vertical sections, it is suggested that solidification for high lead and very high indium alloys occurs from two-phase equilibria. Solidification from all other alloys occurs from three-phase equilibria. Four-phase solidification does not occur in this system

Future supply of, and demand for, titanium, copper and lead

International Nuclear Information System (INIS)

Grover, L.K.

1991-01-01

A literature survey has been conducted to assess the future world supply of, and demand for, titanium, copper and lead. These metals are candidates for the fabrication of containers for the immobilization and disposal of Canada's nuclear used-fuel in an underground disposal vault at a Used-Fuel Disposal Centre. The Centre is assumed to begin operation by the year 2020 and continue for about 40 years. The survey has shown that the world has abundant supplies of titanium minerals (mostly in the form of ilmenite), which are expected to last up to at least 2110. However, for copper and lead, the balance between supply and demand may warrant increased monitoring beyond the year 2000. A number of factors that can influence supply and demand are discussed

Enhancing the Ductility of Laser-Welded Copper-Aluminum Connections by using Adapted Filler Materials

Science.gov (United States)

Weigl, M.; Albert, F.; Schmidt, M.

Laser micro welding of direct copper-aluminum connections typically leads to the formation of intermetallic phases and an embrittlement of the metal joints. By means of adapted filler materials it is possible to reduce the brittle phases and thereby enhance the ductility of these dissimilar connections. As the element silicon features quite a well compatibility with copper and aluminum, filler materials based on Al-Si and Cu-Si alloys are used in the current research studies. In contrast to direct Cu-Al welds, the aluminum filler alloy AlSi12 effectuates a more uniform element mixture and a significantly enhanced ductility.

Room temperature fatigue behavior of OFHC copper and CuAl25 specimens of two sizes

DEFF Research Database (Denmark)

Singhal, A.; Stubbins, J.F.; Singh, B.N.

1994-01-01

requiring an understanding of their fatigue behavior.This paper describes the room temperature fatigue behavior of unirradiated OFHC (oxygen-free high-conductivity) copper and CuAl25 (copper strengthened with a 0.25% atom fraction dispersion of alumina). The response of two fatigue specimen sizes to strain......Copper and its alloys are appealing for application in fusion reactor systems for high heat flux components where high thermal conductivities are critical, for instance, in divertor components. The thermal and mechanical loading of such components will be, at least in part, cyclic in nature, thus...

Characterization of atom clusters in irradiated pressure vessel steels and model alloys

International Nuclear Information System (INIS)

Auger, P.; Pareige, P.; Akamatsu, M.; Van Duysen, J.C.

1993-12-01

In order to characterize the microstructural evolution of the iron solid solution under irradiation, two pressure vessel steels irradiated in service conditions and, for comparison, low copper model alloys irradiated with neutrons and electrons have been studied. The characterization has been carried out mainly thanks to small angle neutron scattering and atom probe experiments. Both techniques lead to the conclusion that clusters develop with irradiations. In Fe-Cu model alloys, copper clusters are formed containing uncertain proportions of iron. In the low copper industrial steels, the feature is more complex. Solute atoms like Ni, Mn and Si, sometimes associated with Cu, segregate as ''clouds'' more or less condensed in the iron solid solution. These silicides, or at least Si, Ni, Mn association, may facilitate the copper segregation although the initial iron matrix contains a low copper concentration. (authors). 24 refs., 3 figs., 2 tabs

Electron-photon shower distribution function tables for lead, copper and air absorbers

CERN Document Server

Messel, H

2013-01-01

Electron-Photon Shower Distribution Function: Tables for Lead, Copper and Air Absorbers presents numerical results of the electron-photon shower distribution function for lead, copper, and air absorbers. Electron or photon interactions, including Compton scattering, elastic Coulomb scattering, and the photo-electric effect, are taken into account in the calculations. This book consists of four chapters and begins with a review of both theoretical and experimental work aimed at deducing the characteristics of the cascade produced from the propagation of high energy electrons and photons through

Comparison of inorganic inhibitors of copper, nickel and copper-nickels in aqueous lithium bromide solution

International Nuclear Information System (INIS)

Munoz, A. Igual; Anton, J. Garcia; Guin-tilde on, J.L.; Herranz, V. Perez

2004-01-01

The electrochemical behavior of copper, nickel and two copper-nickel (Cu90/Ni10 and Cu70/Ni30) alloys in 850 g/L LiBr solution in the absence and presence of three different inorganic inhibitors (chromate CrO 4 2- , molybdate MoO 4 2- , and tetraborate B 4 O 7 2- ) has been studied. Differences in inhibition efficiency are discussed in terms of potentiodynamic and cyclic measurements. The best protection is obtained by adding chromate to the 850 g/L LiBr solution while the inhibition efficiencies of molybdate and tetraborate ions were not markedly high. Very aggressive anions, such as bromides, in the present experimental conditions, notably reduce the action of the less efficient molecules (molybdate and tetraborate), but not that of the most efficient ones (chromate). The results of the investigation show that the inhibiting properties depend on the nickel content in the alloy; this element improves the general corrosion resistance of the material in the sense that it shifts free corrosion potential towards more noble values and density corrosion currents towards lower levels. The nickel content in the alloy also enlarges the passivating region of the materials in chromate and molybdate-containing solution; furthermore it decreases the current passivating values to lower values. Nickel addition improves the localized corrosion resistance in the bromide media

Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

International Nuclear Information System (INIS)

Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei; Dong, Peng; Wang, Wen-xian; Ding, Min

2016-01-01

This paper studies microstructure and mechanical properties of Sn-9Zn-x Al 2 O 3 nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al 2 O 3 /Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al 2 O 3 nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al 2 O 3 nanoparticles increased with the increasing weight percentages of Al 2 O 3 nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al 2 O 3 nanoparticles.

Adsorption of copper, nickel and lead ions from synthetic semiconductor industrial wastewater by palm shell activated carbon

International Nuclear Information System (INIS)

Onundi, Y. B.; Mamun, A. A.; Al Khatib, M. F.; Ahmad, Y. M.

2010-01-01

Granular activated carbon produced from palm kernel shell was used as adsorbent to remove copper, nickel and lead ions from a synthesized industrial wastewater. Laboratory experimental investigation was carried out to identify the effect of p H and contact time on adsorption of lead, copper and nickel from the mixed metals solution. Equilibrium adsorption experiments at ambient room temperature were carried out and fitted to Langmuir and Freundlich models. Results showed that p H 5 was the most suitable, while the maximum adsorbent capacity was at a dosage of 1 g/L, recording a sorption capacity of 1.337 mg/g for lead, 1.581 mg/g for copper and 0.130 mg/g for nickel. The percentage metal removal approached equilibrium within 30 minutes for lead, 75 minutes for copper and nickel, with lead recording 100 p ercent , copper 97 p ercent a nd nickel 55 p ercent r emoval, having a trend of Pb 2+ > Cu 2+ > Ni 2+ . Langmuir model had higher R 2 values of 0.977, 0.817 and 0.978 for copper, nickel and lead respectively, which fitted the equilibrium adsorption process more than Freundlich model for the three metals.

Self-lubricating tribological characterization of lead free Fe-Cu based plain bearing material

Directory of Open Access Journals (Sweden)

Shuhaib Mushtaq

2017-03-01

Full Text Available The negative impact of lead on environment and thereby its reciprocity on the health of mankind, there is a growing emphasis on resisting the usage of lead in bearings. Owing to this, new bearing materials that provide comparable tribological performance to that of lead containing alloys are being developed. In this study, lead free Fe-Cu based powders with addition of elements such as tin, molybdenum disulfide and Nano boron nitride (BN have been developed by powder metallurgy (PM technique in order to improve the tribological and mechanical properties. The powder mixtures were compressed at a pressure of 500 MPa, and then sintered in dry hydrogen atmosphere at 9000C for 50 minutes. The mechanical and tribological properties obtained due to addition of the said elements is presented in this study. The tribological behavior of the selected alloys is analyzed by reciprocating-sliding tests under dry conditions. The morphology of wear scars and the microstructure of the wear surfaces were investigated. The material with 2.5 wt.% of Sn exhibited the highest value of hardness, the material with 7.5 wt.% of Nano BN comparably shows the low coefficient of friction and wear rate as compared with 5 wt.% of Nano BN.

Casting Characteristics of High Cerium Content Aluminum Alloys

Energy Technology Data Exchange (ETDEWEB)

Weiss, D; Rios, O R; Sims, Z C; McCall, S K; Ott, R T

2017-09-05

This paper compares the castability of the near eutectic aluminum-cerium alloy system to the aluminum-silicon and aluminum-copper systems. The alloys are compared based on die filling capability, feeding characteristics and tendency to hot tear in both sand cast and permanent mold applications. The castability ranking of the binary Al–Ce systems is as good as the aluminum-silicon system with some deterioration as additional alloying elements are added. In alloy systems that use cerium in combination with common aluminum alloying elements such as silicon, magnesium and/or copper, the casting characteristics are generally better than the aluminum-copper system. In general, production systems for melting, de-gassing and other processing of aluminum-silicon or aluminum-copper alloys can be used without modification for conventional casting of aluminum-cerium alloys.

Accurate quantitative CF-LIBS analysis of both major and minor elements in alloys via iterative correction of plasma temperature and spectral intensity

Science.gov (United States)

Shuxia, ZHAO; Lei, ZHANG; Jiajia, HOU; Yang, ZHAO; Wangbao, YIN; Weiguang, MA; Lei, DONG; Liantuan, XIAO; Suotang, JIA

2018-03-01

The chemical composition of alloys directly determines their mechanical behaviors and application fields. Accurate and rapid analysis of both major and minor elements in alloys plays a key role in metallurgy quality control and material classification processes. A quantitative calibration-free laser-induced breakdown spectroscopy (CF-LIBS) analysis method, which carries out combined correction of plasma temperature and spectral intensity by using a second-order iterative algorithm and two boundary standard samples, is proposed to realize accurate composition measurements. Experimental results show that, compared to conventional CF-LIBS analysis, the relative errors for major elements Cu and Zn and minor element Pb in the copper-lead alloys has been reduced from 12%, 26% and 32% to 1.8%, 2.7% and 13.4%, respectively. The measurement accuracy for all elements has been improved substantially.

Influence of aging at 200 C on the corrosion resistance of Al-Li and AI-Li-Cu alloys

International Nuclear Information System (INIS)

Kumai, C.; Kusinski, J.; Devine, T.M.

1989-01-01

This paper presents an investigation of the influence of heat treatment on the microstructure and corrosion resistance of an aluminum lithium alloy and two aluminum-lithium-copper alloys. Aging the Al-Li alloy resulted in the precipitation of δ with precipitate-free zone (PFZ) formation along the grain boundaries. The intragranular precipitation of δ did not influence either the morphology of pitting or the magnitude of the pitting potential. Pits appeared to consist of aggregates of submicron-sized cuboidal volumes. Their faceted shape suggests the strong influence of crystallographic factors. Anodic polarization of the Al-Li-Cu alloy is the T8 condition in aqueous solutions containing chloride ions resulted in blistering of the passive film and the formation of pits that were hemispherical in shape. Aging the Al-Li-Cu resulted in the precipitation of Cu-rich phases with PFZ formation along the grain and subgrain boundaries. Energy dispersive x-ray (EDX) microchemical analyses indicated the PFZ was depleted of copper. Anodic polarization of aged samples in chloride ion media resulted in localized attack along the subgrain and grain boundaries. Such attack did not occur in solutions free of chloride ions. The electrochemical tests and microchemical analyses suggest that the boundary corrosion was caused by the pitting corrosion of copper-depleted zones

Copper, Aluminum and Nickel: A New Monocrystalline Orthodontic Alloy

Science.gov (United States)

Wierenga, Mark

Introduction: This study was designed to evaluate, via tensile and bend testing, the mechanical properties of a newly-developed monocrystalline orthodontic archwire comprised of a blend of copper, aluminum, and nickel (CuAlNi). Methods: The sample was comprised of three shape memory alloys; CuAlNi, copper nickel titanium (CuNiTi), and nickel titanium (NiTi); from various orthodontic manufacturers in both 0.018" round and 0.019" x 0.025" rectangular dimensions. Additional data was gathered for similarly sized stainless steel and beta-titanium archwires as a point of reference for drawing conclusions about the relative properties of the archwires. Measurements of loading and unloading forces were recorded in both tension and deflection testing. Repeated-measure ANOVA (alpha= 0.05) was used to compare loading and unloading forces across wires and one-way ANOVA (alpha= 0.05) was used to compare elastic moduli and hysteresis. To identify significant differences, Tukey post-hoc comparisons were performed. Results: The modulus of elasticity, deflection forces, and hysteresis profiles of CuAlNi were significantly different than the other superelastic wires tested. In all tests, CuAlNi had a statistically significant lower modulus of elasticity compared to the CuNiTi and NiTi wires (P orthodontic metallurgy.

Flotation process of lead-, copper-, uranium-, and rare earth minerals

International Nuclear Information System (INIS)

Broman, P.G.; Kihlstedt, P.G.; Du Rietz, C.

1977-01-01

This invention relates to a flotation process of oxide or sulfide ores containing lead-, copper-, uranium-, and rare earth minerals applicating a new collector. Flotation is in the presence of a tertiary amine

Application of SIMS in patina studies on Bronze Age copper alloys

International Nuclear Information System (INIS)

Wouters, H.J.; Butaye, L.A.; Adams, F.C.

1992-01-01

The potential of secondary ion mass spectrometry for the patina studies on Bronze Age copper alloys is discussed. It is shown that the combined use of metallography, electron probe micro-analysis and ion microscopy can obtain very useful information concerning fabrication technology and corrosion mechanisms of ancient metals. Especially the convenience of measuring ion micrographs for relatively rapid qualitative indication of phases and inclusions, which are of interest for the investigation of different corroded surfaces found on ancient bronzes, is outlined. The results of investigated of two bronze objects with a specific patina appearance are presented. (orig.)

Penetration of a magnetic field into superconducting lead and lead-indium alloys

International Nuclear Information System (INIS)

Egloff, C.; Raychaudhuri, A.K.; Rinderer, L.

1983-01-01

The temperature dependence of the magnetic field penetration depth of superconducting lead and lead-indium alloys has been studied over the temperature range between about 2 K and T/sub c/. Data are analyzed in terms of the microscopic theory. The difficulties of a unique analysis of the penetration data are pointed out and a strategy for the analysis is discussed. The penetration depth at T = 0K for pure lead is determined as 522 A. This value, though higher than the previously accepted value for lead, is nevertheless consistent with the strong coupling character of lead

Contamination of urban garden soils with copper, boron, and lead

Energy Technology Data Exchange (ETDEWEB)

Purves, D

1967-04-01

Spectrochemical analysis of representative samples of topsoil from urban gardens and from individual fields in rural areas indicates that the level of total copper, EDTA-extractable copper, water-soluble boron, and acetic-acid extractable lead are markedly enhanced in urban areas. No significant differences were discovered between levels of these elements in soils from built-up areas in small towns and large conurbations. These results suggest the possibility of general enhancement of the trace element content of plants grown in private gardens in built-up areas.

The mode of stress corrosion cracking in Ni-base alloys in high temperature water containing lead

International Nuclear Information System (INIS)

Hwang, S.S.; Kim, H.P.; Lee, D.H.; Kim, U.C.; Kim, J.S.

1999-01-01

The mode of stress corrosion cracking (SCC) in Ni-base alloys in high temperature aqueous solutions containing lead was studied using C-rings and slow strain rate testing (SSRT). The lead concentration, pH and the heat treatment condition of the materials were varied. TEM work was carried out to observe the dislocation behavior in thermally treated (TT) and mill annealed (MA) materials. As a result of the C-ring test in 1M NaOH+5000 ppm lead solution, intergranular stress corrosion cracking (IGSCC) was found in Alloy 600MA, whereas transgranular stress corrosion cracking (TGSCC) was found in Alloy 600TT and Alloy 690TT. In most solutions used, the SCC resistance increased in the sequence Alloy 600MA, Alloy 600TT and Alloy 690TT. The number of cracks that was observed in alloy 690TT was less than in Alloy 600TT. However, the maximum crack length in Alloy 690TT was much longer than in Alloy 600TT. As a result of the SSRT, at a nominal strain rate of 1 x 10 -7 /s, it was found that 100 ppm lead accelerated the SCC in Alloy 600MA (0.01%C) in pH 10 at 340 C. IGSCC was found in a 100 ppm lead condition, and some TGSCC was detected on the fracture surface of Alloy 600MA cracked in the 10000 ppm lead solution. The mode of cracking for Alloy 600 and Alloy 690 changed from IGSCC to TGSCC with increasing grain boundary carbide content in the material and lead concentration in the solution. IGSCC seemed to be retarded by stress relaxation around the grain boundaries, and TGSCC in the TT materials seemed to be a result of the crack blunting at grain boundary carbides and the enhanced Ni dissolution with an increase of the lead concentration. (orig.)

Chemical sensitive interfacial free volume studies of nanophase Al-rich alloys

International Nuclear Information System (INIS)

Lechner, W.; Puff, W.; Wuerschum, R.; Wilde, G.

2006-01-01

Full text: Al-based nanocrystalline alloys have attracted substantial interest due to their outstanding mechanical properties. These alloys can be obtained by crystallization of melt-spun amorphous precursors or by grain refinement upon repeated cold-rolling of elemental layers. For both synthesis routes, the nanocrystallization process is sensitively affected by interfacial chemistry and free volumes. In order to contribute to an atomistic understanding of the interfacial structure and processes during nanocrystallization, the present work deals with studies of interfacial free volumes by means of positron-annihilation-spectroscopy. In addition to positron lifetime spectroscopy which yields information on the size of free volumes, coincident Doppler broadening of the positron-electron annihilation photons is applied as novel technique for studying the chemistry of interfaces in nanophase materials on an atomistic scale. Al-rich alloys of the above mentioned synthesis routes were studied in this work. (author)

In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

DEFF Research Database (Denmark)

Bergmann, René; Tang, Peter Torben; Hansen, Hans Nørgaard

2007-01-01

This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation...

Carbon formation on nickel and nickel-copper alloy catalysts

Energy Technology Data Exchange (ETDEWEB)

Alstrup, I.; Soerensen, O.; Rostrup-Nielsen, J.R. [Haldor Topsoe Research Labs., Lyngby (Denmark); Tavares, M.T.; Bernardo, C.A.

1998-05-01

Equilibrium, kinetic and morphological studies of carbon formation in CH{sub 4} + H{sub 2}, CO, and CO + H{sub 2} gases on silica supported nickel and nickel-copper catalysts are reviewed. The equilibrium deviates in all cases from graphite equilibrium and more so in CO + CO{sub 2} than in CH{sub 4} + H{sub 2}. A kinetic model based on information from surface science results with chemisorption of CH{sub 4} and possibly also the first dehydrogenation step as rate controlling describes carbon formation on nickel catalyst in CH{sub 4} + H{sub 2} well. The kinetics of carbon formation in CO and CO + H{sub 2} gases are in agreement with CO disproportionation as rate determining step. The presence of hydrogen influences strongly the chemisorption of CO. Carbon filaments are formed when hydrogen is present in the gas while encapsulating carbon dominates in pure CO. Small amounts of Cu alloying promotes while larger amounts (Cu : Ni {>=} 0.1) inhibits carbon formation and changes the morphology of the filaments (``octopus`` carbon formation). Adsorption induced nickel segregation changes the kinetics of the alloy catalysts at high carbon activities. Modifications suggested in some very recent papers on the basis of new results are also briefly discussed. (orig.) 31 refs.

Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 350 degrees C

DEFF Research Database (Denmark)

Singh, B.N.; Edwards, D.J.; Eldrup, Morten Mostgaard

2001-01-01

Screening experiments were carried out to determine the effect of bonding and bakeout thermal cycles on microstructure, mechanical properties and electrical resistivity of the oxide dispersion strengthened (GlidCop, CuAl-25) and the precipitation hardened (CuCrZr, CuNiBe) copper alloys. Tensile...... results are described and their salient features discussed. The most significant effect of neutron irradiation is a severe loss of ductility in the case of CuNiBe alloys. (C) 2001 Elsevier Science B.V. All rights reserved....

Evaluation and comparison of shear bond strength of porcelain to a beryllium-free alloy of nickel-chromium, nickel and beryllium free alloy of cobalt-chromium, and titanium: An in vitro study

Directory of Open Access Journals (Sweden)

Ananya Singh

2017-01-01

Conclusion: It could be concluded that newer nickel and beryllium free Co-Cr alloys and titanium alloys with improved strength to weight ratio could prove to be good alternatives to the conventional nickel-based alloys when biocompatibility was a concern.

Corrosion behavior of novel imitation-gold copper alloy with rare earth in 3.5% NaCl solution

International Nuclear Information System (INIS)

Chen, J.L.; Li, Z.; Zhu, A.Y.; Luo, L.Y.; Liang, J.

2012-01-01

Highlights: → The design alloy has better anti-tarnish property than that of H7211 alloy during salt-spray test. → The corrosion rate of design alloy is much lower than that of H7211 alloy as immersed in NaCl solution. → In the low frequency region, the capacitive behavior normally faded and diffusion process had a key role. → In the medium frequency region, the Bode pattern showed a capacitive behavior. -- Abstract: A novel imitation-gold copper alloy with rare earth was designed and prepared. The corrosion behavior of the alloy immersed in 3.5% NaCl solution and its anti-tarnish property in the salt spray for different days has been studied. The designed alloy (CuZnAlNiMeRe) has more excellent anti-tarnish property and lower corrosion rate than those of currency coinage materials of H7211 alloy (used in China). A uniform and compact of corrosion film has been formed after the designed alloy immersed in 3.5% NaCl solution. The corrosion current densities I corr of the alloy decreased while the polarization resistance R p increased with time. The capacitance of the corrosion product film C film of the alloy decreased while the charge transfer resistance R ct . The Warburg diffusion impedance W R and the resistance of the equivalent circuit R increased with time.

Development of Pb-Free Nanocomposite Solder Alloys

Directory of Open Access Journals (Sweden)

Animesh K. Basak

2018-04-01

Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

Copper alloy conducting first wall for the FED-A tokamak

International Nuclear Information System (INIS)

Wiffen, F.W.

1984-01-01

The first wall of the tokamak FED-A device was designed to satisfy two conflicting requirements. They are a low electrical resistance to give a long eddy-current decay time and a high neutron transparency to give a favorable tritium breeding ratio. The tradeoff between these conflicting requirements resulted in a copper alloy first wall that satisfied the specific goals for FED-A, i.e., a minimum eddy-current decay time of 0.5 sec and a tritium breeding ratio of at least 1.2. Aluminum alloys come close to meeting the requirements and would also probably work. Stainless steel will not work in this application because shells thin enough to satisfy temperature and stress limits are not thick enough to give a long eddy-current decay time and to avoid disruption induced melting. The baseline first wall design is a rib-stiffened, double-wall construction. The total wall thickness is 1.5 cm, including a water coolant thickness of 0.5 cm. The first wall is divided into twelve 30-degree sectors. Flange rings at the ends of each sector are bolted together to form the torus. Structural support is provided at the top center of each sector

Research of oxygen free copper of Upcast {sup registered} technology for electric and electronic uses

Energy Technology Data Exchange (ETDEWEB)

Knych, Tadeusz; Smyrak, Beata; Walkowicz, Monika [AGH-Univ. of Science and Technology, Cracow (Poland)

2011-01-15

Rapid development of electronics and electrical engineering imposes a necessity to search for new materials enabling fast and lossless transmission of electrical signals. Increasingly common application of electronic systems and elements of electrical engineering contributed to the development of a new group of products representing highly advanced properties. Modern solutions concerning the materials to be used for manufacturing of the above specified products concentrate mainly on high purity copper. As a standard Oxygen Free Copper (OFC) or high purity Oxygen Free High Conductivity Copper (OFHC) are used for production of this kind of wires. OFHC copper purity class of 4N (99.99 %) contains approximately 1 to 3 ppm of oxygen and the total amount of impurities on the level not exceeding 22 ppm. This type of copper is additionally characterized by excellent deformation capabilities as well as corrosion and hydrogen embrittlement resistance. This article presents the analysis of the results of the complex research program on identification of the properties pertaining to wire rods produced oxygen free copper from Upcast line and ETP wire rod produced on Contirod {sup registered} line - in both cases the same type of cathode was used. Additionally, a subsequent analysis of the annealing susceptibility of wires obtained from Cu-OF rod (Upcast {sup registered}) and Cu-ETP wire rod (Contirod {sup registered}) was carried out. The comparative research on the recrystallization temperature proved to be the most interesting point. (orig.)

Short-range clustering and decomposition in copper-nickel and copper-nickel-iron alloys

International Nuclear Information System (INIS)

Aalders, T.J.A.

1982-07-01

The thermodynamic equilibrium state of short-range clustering and the kinetics of short-range clustering and decomposition has been studied for a number of CuNi(Fe)-alloys by means of neutron scattering. The validity of the theories, which are usually applied to describe spinodal decomposition, nucleation and growth, coarsening etc., was investigated. It was shown that for the investigated substances the conventional theory of spinodal decomposition is valid for the relaxation of short-range clustering only for the case that the initial and final states do not differ too much. The dynamical scaling procedure described by Lebowitz et al. did not lead to a time-independent scaled function F(x) for the relaxation of short-range clustering, for the early stages of decomposition and for the case that an alloy, which was already decomposed at the quench temperature T 1 , was annealed at a temperature T 2 (T 1 ). For the later stages of decomposition, however, the scaling procedure was indeed successful. The coarsening of the alloys could, except for the later stages, be described by the Lifshitz-Slyozov theory. (Auth.)

Polarographic methods for the analysis of beryllium metal and its alloys

International Nuclear Information System (INIS)

Wells, J.M.

1975-10-01

This report describes polarographic methods for the analysis of beryllium metal and its alloys. The elements covered by these methods are aluminium, bismuth, cadmium, cobalt, copper, iron, lead, molybdenum, nickel, thallium, tungsten, uranium, vanadium and zinc. (author)

Copper and Lead levels in two popular leafy vegetables grown ...

African Journals Online (AJOL)

forming an important source of vitamins and minerals ... and the interaction with other metals (Zurera et al., ... is an essential trace element in the functions of the ... The levels of Lead and Copper varied between the vegetable varieties and from ...

Synthesis and application of a novel Cu/RGO@Pb alloy for lead-acid batteries

International Nuclear Information System (INIS)

Wu, Yumeng; Zhao, Ruirui; Zhou, Huawen; Zhang, Dejing; Zhao, Wei; Chen, Hongyu

2016-01-01

In this work, a novel Cu/RGO@Pb alloy was prepared successfully and tested in the simulated lead-acid battery environment. In preparing the novel alloy, Cu/RGO composite was firstly synthesized in order to increase the wettability of RGO to Pb, and then the composite was added to the molten lead to obtain the target alloy. Scanning electron microscope, energy dispersive spectrometer, X-ray diffraction as well as electrochemical measurements were employed to evaluate the performance of the obtained composite and alloy. Results show that the prepared Cu/RGO@Pb possessed higher oxygen evolution over-potential and lower hydrogen evolution over-potential than the contrast alloy, indicating this novel alloy was more suitable for using as positive grids in lead acid batteries. Moreover, the RGO additive could inhibit the formation of Pb(II) and Pb(IV) film on the surface of the alloy, which could enhance the deep-charge/discharge performance of the grids and improve the corrosion resistance.

Biosorption of lead (II and copper (II by biomass of some marine algae

Directory of Open Access Journals (Sweden)

Chaisuksant, Y.

2004-09-01

Full Text Available Biosorption of heavy metal ions by algae is a potential technology for treating wastewater contaminated with heavy metals. Adsorption of lead (II and copper (II in aqueous solutions by some marine algae available in large quantities in Pattani Bay including Gracilaria fisheri, Ulva reticulata and Chaetomorpha sp. were investigated. The effect of pH on metal sorption of the algal biomass and the metal uptake capacity of the algal biomass comparing to that of synthetic adsorbents including activated carbon and siliga gel were studied by using batch equilibrium experiments. Each dried adsorbent was stirred in metal ions solutions with different pH or different concentration at room temperature for 24 hours and the residual metal ions were analysed using atomic absorption spectrophotometer. The initial concentrations of lead and copper ionswere 70 µg/l and 20 mg/l, respectively. It was found that the effect of pH on metal sorption was similar in each algal biomass. The metal uptake capacity increased as pH of the solution increased from 2.0 to 4.0 and reached a plateau at pH 5.0-7.0. The metal uptake capacities of each algal biomass were similar. At low concentrations of metal ions, the metal adsorption occurred rapidly while at higher metal concentration less metal adsorption by each algal biomass was observed. The metal adsorption of activated carbon and silica gel occurred gradually and was less than those of algal biomass. The equilibrium data of copper and lead ions fitted well to the Langmuir and Freundlich isotherm models. The maximum sorption capacity (Qm values (mean±SD of Chaetomorpha sp., U. reticulata, G. fisheri, activated carbon and silica gel for lead ions were 1.26±0.14, 1.19±0.14, 1.18±0.15, 1.14±0.11 and 1.15±0.12 mg/g, respectively. For copper adsorption, the Qm values for G. fisheri, U. reticulata and Chaetomorpha biomass were 15.87±1.03, 14.71±1.02 and 12.35± 1.03 mg/g, respectively. While those of activated carbon and

Creep characteristics of precipitation hardened carbon free martensitic alloys

International Nuclear Information System (INIS)

Muneki, S.; Igarashi, M.; Abe, F.

2000-01-01

A new attempt has been demonstrated using carbon free Fe-Ni-Co martensitic alloys strengthened by Laves phase such as Fe 2 W or Fe 2 Mo to achieve homogeneous creep deformation at high temperatures under low stress levels. Creep behavior of the alloys is found to be completely different from that of the conventional high-Cr ferritic steels. The alloys exhibit gradual change in the creep rate with strain both in the transient and acceleration creep regions, and give a larger strain for the minimum creep rate. In these alloys the creep deformation takes place very homogeneously and no heterogeneous creep deformation is enhanced even at low stress levels. The minimum creep rates of the Fe-Ni-Co alloys at 700 C are found to be much lower than that of the conventional steel, which is due to fine dispersion strengthening useful even at 700 C in these alloys. It is thus concluded that the Fe-Ni-Co martensite strengthened by Laves phase is very useful to increase the creep resistance at elevated temperatures over 650 C. (orig.)

Atmospheric corrosion of metals in tropics and subtropic. 2. Corrosion resistance of different metals and alloys

International Nuclear Information System (INIS)

Strekalov, P.V.

1993-01-01

Data from 169 sources concerning corrosion of different metals, alloys and means of protection, obtained for a 30-year period (up to 1987) in different continent including Europe (Bulgaria, Spain, Italy, France, USSR); America (USA, Panama, Cuba, Venezuela, Brasil, Argentine); Africa (Nigeria, SAR); Australia, New Zeland, Papua-Newguinea, Philippines, are systemized. Actual results of full-scal atmospheric testings of iron, zinc, copper, cadmium, aluminium, tin, lead, carbon, low-alloys. Stainless steels, cast irons, halvanic coatings, copper, aluminium, nickel, titanium, magnesium alloys are presented. Data on the fracture rate can be used for creating the data base in banks on atmospheric resistance of metal materials

Effect of copper addition and section thickness on the mechanical and physical properties of grey cast iron

International Nuclear Information System (INIS)

Malik, F.A.; Zahid, M.; Hassan, M.A.; Sheikh, M.A.; Alam, S.; Qazi, M.A.

1995-01-01

Copper is a graphitizer at the stage of solidification and it acts as antiferritizer during transformation cooling range. Due to this, copper additions to grey cast iron prevent at formation of free ferrite in heavy sections. It also reduces the chilling in thin sections, therefore uniform structure is imparted to grey iron by the copper addition. This gives the appropriate strength and hardness properties to grey iron. Thus copper addition gives certain advantages in relation to the machinability and wear resistance which are important for many engineering properties requires by high duty cast iron. The application of copper as allying element is acceptable due to its price and availability as compared to other alloying elements. (author)

Finite-element solidification modelling of metals and binary alloys

International Nuclear Information System (INIS)

Mathew, P.M.

1986-12-01

In the Canadian Nuclear Fuel Waste Management Program, cast metals and alloys are being evaluated for their ability to support a metallic fuel waste container shell under disposal vault conditions and to determine their performance as an additional barrier to radionuclide release. These materials would be cast to fill residual free space inside the container and allowed to solidify without major voids. To model their solidification characteristics following casting, a finite-element model, FAXMOD-3, was adopted. Input parameters were modified to account for the latent heat of fusion of the metals and alloys considered. This report describes the development of the solidification model and its theoretical verification. To model the solidification of pure metals and alloys that melt at a distinct temperature, the latent heat of fusion was incorporated as a double-ramp function in the specific heat-temperature relationship, within an interval of +- 1 K around the solidification temperature. Comparison of calculated results for lead, tin and lead-tin eutectic melts, unidirectionally cooled with and without superheat, showed good agreement with an alternative technique called the integral profile method. To model the solidification of alloys that melt over a temperature interval, the fraction of solid in the solid-liquid region, as calculated from the Scheil equation, was used to determine the fraction of latent heat to be liberated over a temperature interval within the solid-liquid zone. Comparison of calculated results for unidirectionally cooled aluminum-4 wt.% copper melt, with and without superheat, showed good agreement with alternative finite-difference techniques

NASA-DoD Lead-Free Electronics Project

Science.gov (United States)

Kessel, Kurt

2010-01-01

This slide presentation reviews the current state of the lead-free electronics project. It characterizes the test articles, which were built with lead-free solder and lead-free component finishes. The tests performed and reported on are: thermal cycling, combine environments testing, mechanical shock testing, vibration testing and drop testing.

Conceptual design of a forced-flow-cooled 20-kA current lead using Ag-alloy-sheathed Bi-2223 high-temperature superconductors

International Nuclear Information System (INIS)

Heller, R.

1994-11-01

The use of high-temperature superconductors in current leads to reduce refrigeration power has been investigated by many groups in the past. Most used YBCO and Bi-2212 bulk superconductors, although their critical current density is not very high. In this paper, BI-2223 HTSC tapes sheathed with Ag alloys are used in the design of a 20-kA current lead because of their higher critical current in medium magnetic fields. The lead current of 20 kA is related to the coil current of the planned stellarator WENDELSTEIN 7-X. Forced-now helium cooling has been used in the design, allowing position-independent and well-controlled operation. The design characteristics of the lead are presented and 4-K helium cooling of the whole lead, as well as 60-K helium cooling of the copper part of the lead, is discussed. The power consumption at zero current, and the lead's behaviour in case of loss of coolant flow, are given, The results of the design allow extrapolation to current leads of the 50-kA range

Characterization of exposure to byproducts from firing lead-free frangible ammunition in an enclosed, ventilated firing range.

Science.gov (United States)

Grabinski, Christin M; Methner, Mark M; Jackson, Jerimiah M; Moore, Alexander L; Flory, Laura E; Tilly, Trevor; Hussain, Saber M; Ott, Darrin K

2017-06-01

U.S. Air Force small arms firing ranges began using copper-based, lead-free frangible ammunition in the early 2000s due to environmental and health concerns related to the use of lead-based ammunition. Exposure assessments at these firing ranges have routinely detected chemicals and metals in amounts much lower than their mass-based occupational exposure limits, yet, instructors report work-related health concerns including respiratory distress, nausea, and headache. The objective of this study at one firing range was to characterize the aerosol emissions produced by weapons during firing events and evaluate the ventilation system's effectiveness in controlling instructor exposure to these emissions. The ventilation system was assessed by measuring the range static air pressure differential and the air velocity at the firing line. Air flow patterns were near the firing line. Instructor exposure was sampled using a filter-based air sampling method for metals and a wearable, real-time ultrafine particle counter. Area air sampling was simultaneously performed to characterize the particle size distribution, morphology, and composition. In the instructor's breathing zone, the airborne mass concentration of copper was low (range = free frangible ammunition. Using an ultrafine particle counter appears to be an alternative method of assessing ventilation effectiveness in removing ultrafine particulate produced during firing events.

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

Science.gov (United States)

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Antibiotic resistance, ability to form biofilm and susceptibility to copper alloys of selected staphylococcal strains isolated from touch surfaces in Polish hospital wards

Directory of Open Access Journals (Sweden)

Anna Różańska

2017-08-01

Full Text Available Abstract Background Despite the employment of sanitary regimes, contact transmission of the aetiological agents of hospital infections is still exceedingly common. The issue of microbe transmission becomes particularly important when facing multidrug-resistant microorganisms such as methicillin-resistant staphylococci. In the case of deficiencies in cleaning and disinfection procedures, hospital equipment made of copper alloys can play an important role, complementing traditional hospital hygiene procedures. The objective of this study was to characterize staphylococcal strains isolated from touch surfaces in Polish hospital wards in terms of their drug resistance, ability to form biofilm and susceptibility to antimicrobial activity of copper alloys. Methods The materials for the study were 95 staphylococcal strains isolated from touch surfaces in 13 different hospital wards from Małopolska province (the south of Poland. Phenotypic and genotypic antibiotic resistance were checked for erythromycin, clindamycin, gentamycin, ciprofloxacin, trimethoprim/sulfamethoxazole and mupirocin. Biofilm formation ability for the tested strains was checked with the use of culture on Congo red agar. Susceptibility to copper, tin bronze, brass and new silver was tested using a modification of the Japanese standard. Results Over 67% of the analysed staphylococcal strains were methicillin-resistant (MR. Four strains were resistant to all of the tested antibiotics, and 14 were resistant to all except mupirocin. Strains classified as MR had significantly increased resistance to the remaining antibiotic groups. About one-third of the analysed strains revealed biofilm-forming ability. Among the majority of species, biofilm-forming and non-biofilm-forming strains were distributed evenly; in the case of S. haemolyticus only, negative strains accounted for 92.8%. Susceptibility to copper alloys was different between strains and rather lower than in the case of the SA

An Approach for Impression Creep of Lead Free Microelectronic Solders

Science.gov (United States)

Anastasio, Onofrio A.

2002-06-01

Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

Porous anodic film formation on an Al-3.5 wt% Cu alloy

Energy Technology Data Exchange (ETDEWEB)

Paez, M.A.; Bustos, O.; Thompson, G.E.; Skeldon, P.; Shimizu, K.; Wood, G.C.

2000-03-01

Anodic film growth has been undertaken on an electropolished Al-3.5 wt % Cu alloy to determine the influence of copper in solid solution on the anodizing behavior. At the commencement of anodizing of the electropolished alloy, in the presence of interfacial enrichment of copper, Al{sup 3+} and Cu{sup 2+} ions egress and O{sup 2{minus}} ion ingress proceed; film growth occurs at the alloy/film interface though O{sup 2{minus}} ion ingress, with outwardly mobile Al{sup 3+} and Cu{sup 2+} ions ejected at the film/electrolyte interface, and field-assisted dissolution proceeding at the bases of pores. Oxidation of copper, in the presence of the enriched layer, is also associated with O{sub 2} gas generation, leading to development of oxygen-filled voids. As a result of significant pressures in the voids, film rupture proceeds, with electrolyte access to the alloy, dissolution of the enriched interfacial layer and re-anodizing. The consequence of such processes in the development of anodic films of increased porosity and reduced efficiency of film formation compared with anodizing of superpure aluminum under similar conditions.

Corrosion and biofouling resistance evaluation of 90-10 copper-nickel

Energy Technology Data Exchange (ETDEWEB)

Powell, Carol [Consultant to Copper Development Association, UK, Square Covert, Caynham, Ludlow, Shropshire (United Kingdom)

2004-07-01

susceptibility to sulphide pitting in subsequent exposure to polluted water. Corrosion resistance is maintained at higher flow rates than for steel and most copper alloys due to the resilience of this surface film. However, above a certain breakaway velocity, dependent on component geometry with respect to hydrodynamics of flow, the film can become damaged leading to impingement attack. In piping systems this is well understood and controlled by design. For flatter surfaces such as on marine structures and boat hulls upper flow limits are higher and still to be defined. Copper-nickel is found to have a good resistance to crevice corrosion and is not susceptible to chloride or sulphide or ammonia stress corrosion cracking in sea water. (authors)

Study of the secondary negative ion emission of copper and several of its alloys by impact with Cs+ ions

International Nuclear Information System (INIS)

Vallerand, P.; Baril, M.

1977-01-01

Secondary ion emission studies have been undertaken using Cs + as the primary ion beam. A good vacuum (ca. 10 -8 torr) is needed to eliminate contamination by residual gases. Negative ion emission of pure copper is compared with its alloys. The thermodynamic equilibrium model of Andersen is discussed. For low element concentrations, the experimental data show enhancement in negative emission of P, Al, Fe, Sn, Ni, and attenuation for Zn, Pb. The order of magnitude of ionic efficiency S - for copper is evaluated at 10 -4 . (Auth.)

Determination of new time-temperature-transformation diagrams for lead-calcium alloys

Energy Technology Data Exchange (ETDEWEB)

Rossi, F.; Lambertin, M. [Arts et Metiers Paristech, LaBoMaP, ENSAM, Rue porte de Paris, 71250 Cluny (France); Delfaut-Durut, L. [CEA, centre de Valduc [SEMP, LECM], 21120 Is-sur-Tille (France); Maitre, A. [SPCTS, UFR Sciences et techniques, 87060 Limoges (France); Vilasi, M. [LCSM, Universite Nancy I, 54506 Vandoeuvre les Nancy (France)

2008-12-01

The Pb-Ca is an age hardening alloy that allows for an increase in the hardness compared to pure lead. The hardening is obtained after different successive ageing transformations. In addition, this hardening is followed by an overageing which induces a softening. The ageing and overageing transformation mechanisms are now well identified in lead-calcium alloys. In this paper, we propose to represent the domain of stability of each transformation via time-temperature-transformation diagrams for a calcium concentration from 600 to 1280 ppm and in a range of temperatures from -20 to 180 C. These diagrams are constructed with the data obtained by in situ ageing with metallographic observations, hardness and electrical resistance measurements. The specificities of lead-calcium such as its fast ageing at ambient temperature and its overageing over time required the design of specific devices to be able to identify the characteristics of these alloys. (author)

Copper-induced activation of TRP channels promotes extracellular calcium entry and activation of CaMs and CDPKs leading to copper entry and membrane depolarization in Ulva compressa

Directory of Open Access Journals (Sweden)

Melissa eGómez

2015-03-01

Full Text Available In order to identify channels involved in membrane depolarization, Ulva compressa was incubated with agonists of TRP channels C5, A1 and V1 and the level of intracellular calcium was detected. Agonists of TRPC5, A1 and V1 induced increases in intracellular calcium at 4, 9 and 12 min of exposure, respectively, and antagonists of TRPC5, A1 and V1 corresponding to SKF-96365 (SKF, HC-030031 (HC and capsazepin (CPZ, respectively, inhibited calcium increases indicating that functional TRPs exist in U. compressa. In addition, copper excess induced increases in intracellular calcium at 4, 9 and 12 min which were inhibited by SKF, HC and CPZ, respectively, indicating that copper activate TRPC5, A1 and V1 channels. Moreover, copper-induced calcium increases were inhibited by EGTA, a non-permeable calcium chelating agent, but not by thapsigargin, an inhibitor of endoplasmic reticulum (ER calcium ATPase, indicating that activation of TRPs leads to extracellular calcium entry. Furthermore, copper-induced calcium increases were not inhibited by W-7, an inhibitor of CaMs, and staurosporine, an inhibitor of CDPKs, indicating that extracellular calcium entry did not require CaMs and CDPKs activation. In addition, copper induced membrane depolarization events at 4, 8 and 11 min and these events were inhibited by SKF, HC, CPZ and bathocuproine, a specific copper chelating agent, indicating copper entry through TRP channels leading to membrane depolarization. Moreover, membrane depolarization events were inhibited by W-7 and staurosporine, indicating that CaMs and CDPKs are required in order to activate TRPs to allow copper entry. Thus, light-dependent copper-induced activation TRPC5, A1 and V1 promotes extracellular calcium entry leading to activation of CaMs and CDPKs which, in turn, promotes copper entry through these TRP channels leading to membrane depolarization.

Heat conduction in superconducting lead thallium alloys

International Nuclear Information System (INIS)

Ho, J.L.N.

1975-01-01

The heat conduction of six strong coupling superconducting Pb--Tl alloy specimens (1 to 20 percent wt Tl) was investigated with the emphasis on the effects of impurities upon the phonon thermal conductivity. All the specimens were annealed at 275 0 C for one week. Results show that the superconducting state phonon thermal conductivity of Pb--Tl is in reasonably good agreement with BRT theory. The strong coupling superconductivity of lead alloys can be handled by scaling the gap parameter using a constant factor. The results presented also show that the phonon thermal conductivity at low temperatures of well annealed lead-thallium alloys can be analyzed in terms of phonon scattering by the grain boundaries, point defects, conduction electrons, and other phonons. The phonon-dislocation scattering was found to be unimportant. The phonon relaxation rate due to point defects is in reasonably good agreement with the Klemens theory for the long range strain field scattering introduced by the thallium impurities. At low temperatures, the normal state phonon thermal conductivity showed an increase in the phonon-electron relaxation rate as the thallium concentration increases. The increase of the phonon-electron relaxation rate is attributed to the change of the Fermi surface caused by the presence of thallium impurity. The effect of the strong electron-phonon coupling character upon the phonon-electron relaxation rate has also been considered in terms of the electron-phonon enhancement factor found in the specific heat measurements

Structural and electrical properties of copper-nickel-aluminum alloys obtained by conventional powder metallurgy method

International Nuclear Information System (INIS)

Monteiro, Waldemar A.; Carrio, Juan A.G.; Silveira, C.R. da; Pertile, H.K.S.

2009-01-01

This work looked for to search out systematically, in scale of laboratory, copper-nickel-aluminum alloys (Cu-Ni-Al) with conventional powder metallurgy processing, in view of the maintenance of the electric and mechanical properties with the intention of getting electric connectors of high performance or high mechanical damping. After cold uniaxial pressing (1000 kPa), sintering (780 deg C) and convenient homogenization treatments (500 deg C for different times) under vacuum (powder metallurgy), the obtained Cu-Ni-Al alloys were characterized by optical microscopy, electrical conductivity, Vickers hardness. X rays powder diffraction data were collected for the sintered samples in order to a structural and microstructural analysis. The comparative analysis is based on the sintered density, hardness, macrostructures and microstructures of the samples. (author)

Effect of copper and lead on two consortia of phototrophic microorganisms and their capacity to sequester metals

Energy Technology Data Exchange (ETDEWEB)

Burgos, A. [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); Departamento de Recursos Hidrobiológicos, Universidad de Nariño, Pasto (N) (Colombia); Maldonado, J. [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); De los Rios, A. [Museo Nacional de Ciencias Naturales(CSIC), Serrano 115 dpdo, 28006 Madrid (Spain); Solé, A. [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); Esteve, I., E-mail: isabel.esteve@uab.cat [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); Departamento de Recursos Hidrobiológicos, Universidad de Nariño, Pasto (N) (Colombia); Museo Nacional de Ciencias Naturales(CSIC), Serrano 115 dpdo, 28006 Madrid (Spain)

2013-09-15

Highlights: •We studied the tolerance-resistance of phototrophic microorganisms to copper and lead. •We determined the capacity of consortia of microorganisms to sequester copper and lead. •CLSM-λscan is a technique for evaluating in vivo effect of metals on microorganisms. •SEM-EDX and TEM-EDX determined the capacity of microorganisms to sequester metals. -- Abstract: The roles of consortia of phototrophic microorganisms have been investigated in this paper to determine their potential role to tolerate or resist metals and to capture them from polluted cultures. With this purpose, two consortia of microorganisms: on one hand, Geitlerinema sp. DE2011 (Ge) and Scenedesmus sp. DE2009 (Sc) (both identified in this paper by molecular biology methods) isolated from Ebro Delta microbial mats, and on the other, Spirulina sp. PCC 6313 (Sp) and Chroococcus sp. PCC 9106 (Ch), from Pasteur culture collection were polluted with copper and lead. In order to analyze the ability of these consortia to tolerate and capture metals, copper and lead were selected, because both have been detected in Ebro Delta microbial mats. The tolerance-resistance to copper and lead for both consortia was determined in vivo and at cellular level by Confocal Laser Scanning Microscopy (CLSM-λscan function). The results obtained demonstrate that both consortia are highly tolerant-resistant to lead and that the limits between the copper concentration having cytotoxic effect and that having an essential effect are very close in these microorganisms. The capacity of both consortia to capture extra- and intracellular copper and lead was determined by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) respectively, coupled to an Energy Dispersive X-ray detector (EDX). The results showed that all the microorganisms assayed were able to capture copper extracellularly in the extrapolymeric substances, and lead extra- and intracellularly in polyphosphate inclusions. Moreover

Effect of copper and lead on two consortia of phototrophic microorganisms and their capacity to sequester metals

International Nuclear Information System (INIS)

Burgos, A.; Maldonado, J.; De los Rios, A.; Solé, A.; Esteve, I.

2013-01-01

Highlights: •We studied the tolerance-resistance of phototrophic microorganisms to copper and lead. •We determined the capacity of consortia of microorganisms to sequester copper and lead. •CLSM-λscan is a technique for evaluating in vivo effect of metals on microorganisms. •SEM-EDX and TEM-EDX determined the capacity of microorganisms to sequester metals. -- Abstract: The roles of consortia of phototrophic microorganisms have been investigated in this paper to determine their potential role to tolerate or resist metals and to capture them from polluted cultures. With this purpose, two consortia of microorganisms: on one hand, Geitlerinema sp. DE2011 (Ge) and Scenedesmus sp. DE2009 (Sc) (both identified in this paper by molecular biology methods) isolated from Ebro Delta microbial mats, and on the other, Spirulina sp. PCC 6313 (Sp) and Chroococcus sp. PCC 9106 (Ch), from Pasteur culture collection were polluted with copper and lead. In order to analyze the ability of these consortia to tolerate and capture metals, copper and lead were selected, because both have been detected in Ebro Delta microbial mats. The tolerance-resistance to copper and lead for both consortia was determined in vivo and at cellular level by Confocal Laser Scanning Microscopy (CLSM-λscan function). The results obtained demonstrate that both consortia are highly tolerant-resistant to lead and that the limits between the copper concentration having cytotoxic effect and that having an essential effect are very close in these microorganisms. The capacity of both consortia to capture extra- and intracellular copper and lead was determined by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) respectively, coupled to an Energy Dispersive X-ray detector (EDX). The results showed that all the microorganisms assayed were able to capture copper extracellularly in the extrapolymeric substances, and lead extra- and intracellularly in polyphosphate inclusions. Moreover

Nanoscale Copper and Copper Compounds for Advanced Device Applications

Science.gov (United States)

Chen, Lih-Juann

2016-12-01

Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

Effects of heat treatments and neutron irradiation on the physical and mechanical properties of copper alloys at 100 deg. C

International Nuclear Information System (INIS)

Singh, B.N.; Eldrup, M.; Toft, P.; Edwards, D.J.

1998-05-01

The final irradiation experiment in a series of screening experiments aimed at investigating the effects of bonding and bakeout thermal cycles on irradiated copper alloys is described herein. Tensile specimens of CuCrZr and CuNiBe alloys were given various heat treatments corresponding to solution anneal, prime-ageing and bonding thermal treatment. Additional specimens were reaged and given a reactor bakeout treatment at 350 deg. C for 100 h. GlidCop TM CuAl-15 (previously referred to as CuAl-25) was given a heat treatment corresponding to a bonding thermal cycle only. Specimens were neutron irradiated at 100 deg. C to a dose level of ∼0.3 dpa. Post-irradiation tensile tests at (100 deg. C), electrical resistivity measurements (at 23 deg. C), and microstructural examinations were performed. The post-irradiation tests at 100 deg. C revealed that the greatest loss of ductility occurred in the CuCrZr alloys irradiated at 100 deg. C, irrespective of the pre-irradiation heat treatment, with the uniform elongation dropping to levels of less than 1.5%. The yield and ultimate strengths for all of the individual heat treated samples increased substantially after irradiation. The same trend was observed for the CuNiBe alloys, which exhibited much higher uniform elongation and strength after irradiation than that observed in the case of CuCrZr alloys. In both alloys irradiation-induced precipitation lead to a large increase in the strength of the solution annealed specimens with a noticeable decrease in uniform elongation. The CuAl-25 alloy also experienced an increase in the overall strength of the alloy after irradiation, accompanied by approximately a 50% decrease in the uniform and total elongation. The additional bakeout treatments given to the CuCrZr and CuNiBe before irradiation served to increase the strength, but in terms of the ductility no improvement or degradation resulted from the additional thermal exposure

The effect of zinc on the microstructure and phase transformations of casting Al-Cu alloys

OpenAIRE

Manasijević Ivana I.; Štrbac Nada D.; Živković Dragana T.; Balanović Ljubiša T.; Minić Duško M.; Manasijević Dragan M.

2016-01-01

Copper is one of the main alloying elements for aluminum casting alloys. As an alloying element, copper significantly increases the tensile strength and toughness of alloys based on aluminum. The copper content in the industrial casting aluminum alloys ranges from 3,5 to 11 wt.%. However, despite the positive effect on the mechanical properties, copper has a negative influence on the corrosion resistance of aluminum and its alloys. In order to further improve the properties of Al-Cu alloys th...

Materials for innovative lead alloy cooled nuclear systems: Overview

International Nuclear Information System (INIS)

Mueller, Georg; Weisenburger, Alfons; Fetzer, Renate; Heinzel, Annette; Jianu, Adrian

2015-01-01

One of the most challenging issues for all future innovative nuclear systems including Gen IV reactors are materials. The selection of the structural materials determines the design which has to consider the properties and the availability of the materials. Beside general requirements for material properties that are common for all fast reactor types specific issues arise from coolant compatibility. The high solubility of steel alloying elements in liquid Pb-alloys at reactor relevant temperatures is clearly detrimental. Therefore, all steels that are considered as structural materials have to be protected by dissolution barriers. The most common barriers for steels under consideration are oxide scales that form in situ during operation. However, increasing the temperature above 500 deg. C will result either in dissolution attack or in enhanced oxidation. For higher temperatures additional barriers like alumina forming surface alloys are discussed and investigated. Mechanical loads like creep stress and fretting will act on the steels. These mechanical loads will interact with the coolant and can increase the negative effects. For a LFR (Lead Fast Reactor) Demonstrator and MYHRRA (ADS) austenitic steels (316L) are selected for most in core components. The 15-15Ti is the choice for the fuel cladding of MYHRRA and a Pb cooled demonstrator. For an industrial LFR (Lead Fast Reactor) the ferritic martensitic steel T91 was selected as fuel clad material due to its improved irradiation resistance. T91 is in both designs the material to be used for the heat exchanger. Surface alloying with alumina forming alloys is considered to assure material functionality at higher temperatures and is therefore selected for fuel cladding of the ELFR and the heat exchanger tubes. This presentation will give an overview on the selected materials for innovative Pb alloy cooled nuclear systems considering, beside pure compatibility, the influence of mechanical interaction like creep and

Investigation on copper alloy and titanium heat exchanger tubes behaviour in sea water service

International Nuclear Information System (INIS)

Casarini, G.; Bianchi, M.; Winkler, L.; Caspani, M.

1982-01-01

Because of the contradictory behaviour in service of some copper alloys used in heat exchangers cooled by sea water (Mediterranean Sea - North Africa), a comparative study on the behaviour of some tubular test samples was performed by means of accelerated test run ''in situ'' using two little heat exchangers supplied by Foster Wheeler Italiana. The aim of the investigation was to obtain quick and reliable information on optimizing the choise of the most suitable material for the construction of new heat exchangers

Copper and lead levels in two popular leafy vegetables grown ...

African Journals Online (AJOL)

A study was carried out to determine the levels of two heavy metals, Lead (Pb) and Copper (Cu), in two popular leafy vegetables grown around Morogoro Municipality in Tanzania. Vegetable samples of Pumpkin leaves ( Cucurbita moschata) and Chinese cabbage ( Brassica chinensis) were collected from three sites and ...

Hydrogen-induced strain localisation in oxygen-free copper in the initial stage of plastic deformation

Science.gov (United States)

Yagodzinskyy, Yuriy; Malitckii, Evgenii; Tuomisto, Filip; Hänninen, Hannu

2018-03-01

Single crystals of oxygen-free copper oriented to easy glide of dislocations were tensile tested in order to study the hydrogen effects on the strain localisation in the form of slip bands appearing on the polished specimen surface under tensile straining. It was found that hydrogen increases the plastic flow stress in Stage I of deformation. The dislocation slip localisation in the form of slip bands was observed and analysed using an online optical monitoring system and atomic force microscopy. The fine structure of the slip bands observed with AFM shows that they consist of a number of dislocation slip offsets which spacing in the presence of hydrogen is markedly reduced as compared to that in the hydrogen-free specimens. The tensile tests and AFM observations were accompanied with positron annihilation lifetime measurements showing that straining of pure copper in the presence of hydrogen results in free volume generation in the form of vacancy complexes. Hydrogen-enhanced free-volume generation is discussed in terms of hydrogen interactions with edge dislocation dipoles forming in double cross-slip of screw dislocations in the initial stage of plastic deformation of pure copper.

Lead-free primary explosives

Science.gov (United States)

Huynh, My Hang V.

2010-06-22

Lead-free primary explosives of the formula (cat).sub.Y[M.sup.II(T).sub.X(H.sub.2O).sub.6-X].sub.Z, where T is 5-nitrotetrazolate, and syntheses thereof are described. Substantially stoichiometric equivalents of the reactants lead to high yields of pure compositions thereby avoiding dangerous purification steps.

Lead free solder mechanics and reliability

CERN Document Server

Pang, John Hock Lye

2012-01-01

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

Microstructure and mechanical properties of Sn-9Zn-xAl{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

Energy Technology Data Exchange (ETDEWEB)

Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Dong, Peng; Wang, Wen-xian [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China); Ding, Min, E-mail: dingmin@tyut.edu.cn [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China)

2016-12-15

This paper studies microstructure and mechanical properties of Sn-9Zn-x Al{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al{sub 2}O{sub 3}/Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al{sub 2}O{sub 3} nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al{sub 2}O{sub 3} nanoparticles increased with the increasing weight percentages of Al{sub 2}O{sub 3} nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al{sub 2}O{sub 3} nanoparticles.

Kinetic investigation of myeloperoxidase upon interaction with copper, cadmium, and lead ions

International Nuclear Information System (INIS)

Shabani, M.; Ani, M.; Movahedian, A.; Samsam Shariat, Z. A.

2011-01-01

Myeloperoxidase, which is abundantly expressed in neutrophils, catalyzes the formation of a number of reactive oxidant species. However, evidence has emerged that Myeloperoxidase-derived oxidants contribute to tissue damage and initiation and propagation of inflammatory diseases, particularly, cardiovascular diseases. Therefore, studying the regulatory mechanisms of the enzyme activity is of great importance. For clarifying some possible mechanism of the enzyme activity, kinetic investigations of Myeloperoxidase in the presence of Copper, Cadmium, and Lead ions were carried out in vitro. Methods: Myeloperoxidase was partially purified from human white blood cells using ion-exchange and gel-filtration chromatography techniques. Its activity was measured spectrophotometrically by using tetramethyl benzidine as substrate. Results: Purified enzyme had a specific activity of 21.7 U/mg protein with a purity index of about 0.71. Copper inhibited Myeloperoxidase activity progressively up to a concentration of 60 m M at which about 80% of inhibition achieved. The inhibition was non-competitive with respect to tetramethyl benzidine. An inhibitory constant (Ki) of about 19 m M was calculated from the slope of repot. Cadmium and Lead did not show any significant inhibitory effect on the enzyme activity. Conclusion: The results of the present study may indicate that there are some places on the enzyme and enzyme-substrate complex for Copper ions. Binding of Copper ions to these places result in conformational changes of the enzyme and thus, enzyme inhibition. This inhibitory effect of Copper on the enzyme activity might be considered as a regulatory mechanism on Myeloperoxidase activity.

Progress in atomizing high melting intermetallic titanium based alloys by means of a novel plasma melting induction guiding gas atomization facility (PIGA)

Energy Technology Data Exchange (ETDEWEB)

Gerling, R.; Schimansky, F.P.; Wagner, R. [GKSS-Forschungszentrum Geesthacht GmbH (Germany). Inst. fuer Werkstofforschung

1994-12-31

For the production of intermetallic titanium based alloy powders a novel gas atomization facility has been put into operation: By means of a plasma torch the alloy is melted in a water cooled copper crucible in skull melting technique. To the tap hole of the crucible, a novel transfer system is mounted which forms a thin melt stream and guides it into the gas nozzle. This transfer system consists of a ceramic free induction heated water cooled copper funnel. Gas atomization of {gamma}-TiAl (melting temperature 1400 C) and Ti{sub 5}Si{sub 3} (2130 C) proved the possibility to produce ceramic free pre-alloyed powders with this novel facility. The TiAl powder particles are spherical; about 20 wt.% are smaller than 45 {mu}m. The oxygen and copper pick up during atomization do not exceed 250 and 35 {mu}g/g respectively. The Ti{sub 5}Si{sub 3} powder particles are almost spherical. Only about 10 wt.% are <45 {mu}m whereas the O{sub 2} and Cu contamination is also kept at a very low level (250 and 20 {mu}g/g respectively). (orig.)

Thermal analysis of selected tin-based lead-free solder alloys

DEFF Research Database (Denmark)

Palcut, Marián; Sopoušek, J.; Trnková, L.

2009-01-01

) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying...... were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phases was obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions...

Specific Labeling of Zinc Finger Proteins using Non-canonical Amino Acids and Copper-free Click Chemistry

Science.gov (United States)

Kim, Younghoon; Kim, Sung Hoon; Ferracane, Dean; Katzenellenbogen, John A.

2012-01-01

Zinc finger proteins (ZFPs) play a key role in transcriptional regulation and serve as invaluable tools for gene modification and genetic engineering. Development of efficient strategies for labeling metalloproteins such as ZFPs is essential for understanding and controlling biological processes. In this work, we engineered ZFPs containing cysteine-histidine (Cys2-His2) motifs by metabolic incorporation of the unnatural amino acid azidohomoalanine (AHA), followed by specific protein labeling via click chemistry. We show that cyclooctyne promoted [3 + 2] dipolar cycloaddition with azides, known as copper-free click chemistry, provides rapid and specific labeling of ZFPs at high yields as determined by mass spectrometry analysis. We observe that the DNA-binding activity of ZFPs labeled by conventional copper-mediated click chemistry was completely abolished, whereas ZFPs labeled by copper-free click chemistry retain their sequence-specific DNA-binding activity under native conditions, as determined by electrophoretic mobility shift assays, protein microarrays and kinetic binding assays based on Förster resonance energy transfer (FRET). Our work provides a general framework to label metalloproteins such as ZFPs by metabolic incorporation of unnatural amino acids followed by copper-free click chemistry. PMID:22871171

Sputtering and emission intensity of copper alloys in a Grimm glow lamp

International Nuclear Information System (INIS)

Yamada, T.; Kashima, J.; Naganuma, K.

1981-01-01

The effects of the metallurgical structure and the aluminium content of copper-aluminium alloy (1-12% Al) on the sputtering and intensities of spectral lines in the Grimm glow lamp are reported. The electrical current and sputtering yield decreased linearly with increasing aluminium content; the intensities of the Al I lines depended linearly on the amount of aluminium in the sputtering yield at a fixed voltage and argon pressure. The structure affected the intensities of the Al I and Cu I lines but not the intensity ratio (Al I/Cu I) for about 100 s after burn-off. Working curves for aluminium for samples of different structure were very similar. (Auth.)

Initiation and propagation of cleared channels in neutron-irradiated pure copper and a precipitation hardened CuCrZr alloy

Energy Technology Data Exchange (ETDEWEB)

Singh, B.N.; Edwards, D.J.; Bilde-Soerensen, J.B

2004-10-01

The phenomenon of plastic flow localization in the form of 'cleared' channels has been frequently observed in neutron irradiated metals and alloys for more than 40 years. So far, however, no experimental evidence as to how and where these channels are initiated during post-irradiation deformation has emerged. Recently we have studied the problem of initiation and propagation of cleared channels during post-irradiation tensile tests of pure copper and a copper alloy irradiated with fission neutrons. Tensile specimens of pure copper and a precipitation hardened copper alloy (CuCrZr) were neutron irradiated at 323 and 373K to displacement doses in the range of 0.01 to 0.3 dpa (displacement per atom) and tensile tested at the irradiation temperature. The stress-strain curves clearly indicated the occurrence of a yield drop. The post-deformation microstructural examinations revealed that the channels are formed already in the elastic regime and their density increases with increasing plastic strain. The channels appear to have been initiated at grain boundaries, twin boundaries, at relatively large inclusions and even at the previously formed cleared channels. Even though the channels are produced throughout the whole tensile test, no clear evidence has been found for the operation of Frank-Read sources in the volume between the channels. Channels have been observed to penetrate through annealing twins, in some cases stopping at the opposite twin boundary and in other cases penetrating even through the opposite twin boundary and continuing further into the grain. In some cases channels have been found to penetrate through grain boundaries too. It is suggested that the high stress levels reached during deformation of the irradiated specimens activate dislocation sources at the sites of stress concentration at the boundaries and inclusions. The propagation of these newly generated dislocations in the matrix causes the formation of cleared channels. Implications

Initiation and propagation of cleared channels in neutron-irradiated pure copper and a precipitation hardened CuCrZr alloy

International Nuclear Information System (INIS)

Singh, B.N.; Edwards, D.J.; Bilde-Soerensen, J.B.

2004-10-01

The phenomenon of plastic flow localization in the form of 'cleared' channels has been frequently observed in neutron irradiated metals and alloys for more than 40 years. So far, however, no experimental evidence as to how and where these channels are initiated during post-irradiation deformation has emerged. Recently we have studied the problem of initiation and propagation of cleared channels during post-irradiation tensile tests of pure copper and a copper alloy irradiated with fission neutrons. Tensile specimens of pure copper and a precipitation hardened copper alloy (CuCrZr) were neutron irradiated at 323 and 373K to displacement doses in the range of 0.01 to 0.3 dpa (displacement per atom) and tensile tested at the irradiation temperature. The stress-strain curves clearly indicated the occurrence of a yield drop. The post-deformation microstructural examinations revealed that the channels are formed already in the elastic regime and their density increases with increasing plastic strain. The channels appear to have been initiated at grain boundaries, twin boundaries, at relatively large inclusions and even at the previously formed cleared channels. Even though the channels are produced throughout the whole tensile test, no clear evidence has been found for the operation of Frank-Read sources in the volume between the channels. Channels have been observed to penetrate through annealing twins, in some cases stopping at the opposite twin boundary and in other cases penetrating even through the opposite twin boundary and continuing further into the grain. In some cases channels have been found to penetrate through grain boundaries too. It is suggested that the high stress levels reached during deformation of the irradiated specimens activate dislocation sources at the sites of stress concentration at the boundaries and inclusions. The propagation of these newly generated dislocations in the matrix causes the formation of cleared channels. Implications of these

Spectroscopic studies of copper doped alkaline earth lead zinc phosphate glasses

Energy Technology Data Exchange (ETDEWEB)

Sastry, S. Sreehari, E-mail: sreeharisastry@yahoo.com [Department of Physics, Acharya Nagarjuna University, Nagarjunanagar 522510 (India); Rao, B. Rupa Venkateswara [Department of Physics, Acharya Nagarjuna University, Nagarjunanagar 522510 (India); Department of Physics, V.R. Siddhartha Engineering College, Vijayawada 52007 (India)

2014-02-01

In this paper spectroscopic investigation of Cu{sup 2+} doped alkaline earth lead zinc phosphate glasses was done through the spectroscopic techniques like X-ray diffraction, Ultra Violet (UV) absorption Spectroscopy, Electron Paramagnetic Resonance (EPR – X band), Fourier Transform Infra Red (FTIR) and Raman Spectroscopy. Alkaline earth lead zinc phosphate glasses containing 0.1% copper oxide (CuO) were prepared by the melt quenching technique. Spectroscopic studies indicated that there is a greater possibility for the copper ions to exist in Cu{sup 2+} state in these glasses. The optical absorption spectra indicated that the absorption peak of Cu{sup 2+} is a function of composition. The maxima absorption peak was reported at 862 nm for strontium lead zinc phosphate glass. Bonding parameters were calculated for the optical and EPR data. All these spectral results indicated clearly that there are certain structural changes in the present glass system with different alkaline earth contents. The IR and Raman spectra noticed the breaking of the P–O–P bonds and creating more number of new P–O–Cu bonds.

Spectroscopic studies of copper doped alkaline earth lead zinc phosphate glasses

International Nuclear Information System (INIS)

Sastry, S. Sreehari; Rao, B. Rupa Venkateswara

2014-01-01

In this paper spectroscopic investigation of Cu 2+ doped alkaline earth lead zinc phosphate glasses was done through the spectroscopic techniques like X-ray diffraction, Ultra Violet (UV) absorption Spectroscopy, Electron Paramagnetic Resonance (EPR – X band), Fourier Transform Infra Red (FTIR) and Raman Spectroscopy. Alkaline earth lead zinc phosphate glasses containing 0.1% copper oxide (CuO) were prepared by the melt quenching technique. Spectroscopic studies indicated that there is a greater possibility for the copper ions to exist in Cu 2+ state in these glasses. The optical absorption spectra indicated that the absorption peak of Cu 2+ is a function of composition. The maxima absorption peak was reported at 862 nm for strontium lead zinc phosphate glass. Bonding parameters were calculated for the optical and EPR data. All these spectral results indicated clearly that there are certain structural changes in the present glass system with different alkaline earth contents. The IR and Raman spectra noticed the breaking of the P–O–P bonds and creating more number of new P–O–Cu bonds

Significant deposits of gold, silver, copper, lead, and zinc in the United States

Science.gov (United States)

Long, K.R.; DeYoung, J.H.; Ludington, S.

2000-01-01

Approximately 99 percent of past production and remaining identified resources of gold, silver, copper, lead, and zinc in the United States are accounted for by deposits that originally contained at least 2 metric tonnes (t) gold, 85 t silver, 50,000 t copper, 30,000 t lead, or 50,000 t zinc. The U.S. Geological Survey, beginning with the 1996 National Mineral Resource Assessment, is systematically compiling data on these deposits, collectively known as 'significant' deposits. As of December 31, 1996, the significant deposits database contained 1,118 entries corresponding to individual deposits or mining districts. Maintaining, updating and analyzing a database of this size is much easier than managing the more than 100,000 records in the Mineral Resource Data System and Minerals Availability System/Minerals Industry Location System, yet the significant deposits database accounts for almost all past production and remaining identified resources of these metals in the United States. About 33 percent of gold, 22 percent of silver, 42 percent of copper, 39 percent of lead, and 46 percent of zinc are contained in or were produced from deposits discovered after World War II. Even within a database of significant deposits, a disproportionate share of past production and remaining resources is accounted for by a very small number of deposits. The largest 10 producers for each metal account for one third of the gold, 60 percent of the silver, 68 percent of the copper, 85 percent of the lead, and 75 percent of the zinc produced in the United States. The 10 largest deposits in terms of identified remaining resources of each of the five metals contain 43 percent of the gold, 56 percent of the silver, 48 percent of the copper, 94 percent of the lead, and 72 percent of the zinc. Identified resources in significant deposits for each metal are less than the mean estimates of resources in undiscovered deposits from the 1996 U.S. National Mineral Resource Assessment. Identified

Nonswelling alloy

Science.gov (United States)

Harkness, S.D.

1975-12-23

An aluminum alloy containing one weight percent copper has been found to be resistant to void formation and thus is useful in all nuclear applications which currently use aluminum or other aluminum alloys in reactor positions which are subjected to high neutron doses.

Nonswelling alloy

International Nuclear Information System (INIS)

Harkness, S.D.

1975-01-01

An aluminum alloy containing one weight percent copper has been found to be resistant to void formation and thus is useful in all nuclear applications which currently use aluminum or other aluminum alloys in reactor positions which are subjected to high neutron doses

Self-healing coatings based on halloysite clay polymer composites for protection of copper alloys.

Science.gov (United States)

Abdullayev, Elshad; Abbasov, Vagif; Tursunbayeva, Asel; Portnov, Vasiliy; Ibrahimov, Hikmat; Mukhtarova, Gulbaniz; Lvov, Yuri

2013-05-22

Halloysite clay nanotubes loaded with corrosion inhibitors benzotriazole (BTA), 2-mercaptobenzimidazole (MBI), and 2-mercaptobenzothiazole (MBT) were used as additives in self-healing composite paint coating of copper. These inhibitors form protective films on the metal surface and mitigate corrosion. Mechanisms involved in the film formation have been studied with optical and electron microscopy, UV-vis spectrometry, and adhesivity tests. Efficiency of the halloysite lumen loading ascended in the order of BTA halloysite formulations have shown the best protection. Inhibitors were kept in the tubes buried in polymeric paint layer for a long time and release was enhanced in the coating defects exposed to humid media with 20-50 h, sufficient for formation of protective layer. Anticorrosive performance of the halloysite-based composite acrylic and polyurethane coatings have been demonstrated for 110-copper alloy strips exposed to 0.5 M aqueous NaCl for 6 months.

Room-temperature base-free copper-catalyzed trifluoromethylation of organotrifluoroborates to trifluoromethylarenes

KAUST Repository

Huang, Yuanyuan; Fang, Xin; Lin, Xiaoxi; Li, Huaifeng; He, Weiming; Huang, Kuo-Wei; Yuan, Yaofeng; Weng, Zhiqiang

2012-01-01

An efficient room temperature copper-catalyzed trifluoromethylation of organotrifluoroborates under the base free condition using an electrophilic trifluoromethylating reagent is demonstrated. The corresponding trifluoromethylarenes were obtained in good to excellent yields and the reaction tolerates a wide range of functional groups. © 2012 Elsevier Ltd. All rights reserved.

Room-temperature base-free copper-catalyzed trifluoromethylation of organotrifluoroborates to trifluoromethylarenes

KAUST Repository

Huang, Yuanyuan

2012-12-01

An efficient room temperature copper-catalyzed trifluoromethylation of organotrifluoroborates under the base free condition using an electrophilic trifluoromethylating reagent is demonstrated. The corresponding trifluoromethylarenes were obtained in good to excellent yields and the reaction tolerates a wide range of functional groups. © 2012 Elsevier Ltd. All rights reserved.

Neutronic design for a 100MWth Small modular natural circulation lead or lead-alloy cooled fast reactors core

International Nuclear Information System (INIS)

Chen, C.; Chen, H.; Zhang, H.; Chen, Z.; Zeng, Q.

2015-01-01

Lead or lead-alloy cooled fast reactor with good fuel proliferation and nuclear waste transmutation capability, as well as high security and economy, is a great potential for the development of fourth-generation nuclear energy systems. Small natural circulation reactor is an important technical route lead cooled fast reactors industrial applications, which has been chosen as one of the three reference technical for solution lead or lead-alloy cooled fast reactors by GIF lead-cooled fast reactor steering committee. The School of Nuclear Science and Technology of USTC proposed a small 100MW th natural circulation lead cooled fast reactor concept called SNCLFR-100 based realistic technology. This article describes the SNCLFR-100 reactor of the overall technical program, core physics calculation and analysis. The results show that: SNCLFR-100 with good neutronic and safety performance and relevant design parameters meet the security requirements with feasibility. (author)

Influences of magnetic field on the fractal morphology in copper electrodeposition

Science.gov (United States)

Sudibyo; How, M. B.; Aziz, N.

2018-01-01

Copper magneto-electrodeposition (MED) is used decrease roughening in the copper electrodeposition process. This technology plays a vital role in electrodeposition process to synthesize metal alloy, thin film, multilayer, nanowires, multilayer nanowires, dot array and nano contacts. The effects of magnetic fields on copper electrodeposition are investigated in terms of variations in the magnetic field strength and the electrolyte concentration. Based on the experimental results, the mere presence of magnetic field would result in a compact deposit. As the magnetic field strength is increased, the deposit grows denser. The increment in concentration also leads to the increase the deposited size. The SEM image analysis showed that the magnetic field has a significant effect on the surface morphology of electrodeposits.

Calculation of the surface free energy of fcc copper nanoparticles

International Nuclear Information System (INIS)

Jia Ming; Lai Yanqing; Tian Zhongliang; Liu Yexiang

2009-01-01

Using molecular dynamics simulations with the modified analytic embedded-atom method we calculate the Gibbs free energy and surface free energy for fcc Cu bulk, and further obtain the Gibbs free energy of nanoparticles. Based on the Gibbs free energy of nanoparticles, we have investigated the heat capacity of copper nanoparticles. Calculation results indicate that the Gibbs free energy and the heat capacity of nanoparticles can be divided into two parts: bulk quantity and surface quantity. The molar heat capacity of the bulk sample is lower compared with the molar heat capacity of nanoparticles, and this difference increases with the decrease in the particle size. It is also observed that the size effect on the thermodynamic properties of Cu nanoparticles is not really significant until the particle is less than about 20 nm. It is the surface atoms that decide the size effect on the thermodynamic properties of nanoparticles

Effects of blending of desalinated water with treated surface drinking water on copper and lead release.

Science.gov (United States)

Liu, Haizhou; Schonberger, Kenneth D; Korshin, Gregory V; Ferguson, John F; Meyerhofer, Paul; Desormeaux, Erik; Luckenbach, Heidi

2010-07-01

This study examined effects of desalinated water on the corrosion of and metal release from copper and lead-containing materials. A jar test protocol was employed to examine metal release from copper and lead-tin coupons exposed to water chemistries with varying blending ratios of desalinated water, alkalinities, pHs and orthophosphate levels. Increasing fractions of desalinated water in the blends resulted in non-monotonic changes of copper and lead release, with generally lower metal concentrations in the presence of desalinated water, especially when its contribution increased from 80% to 100%. SEM examination showed that the increased fractions of desalinated water were associated with pronounced changes of the morphology of the corrosion scales, likely due to the influence of natural organic matter. This hypothesis was corroborated by the existence of correlations between changes of the zeta-potential of representative minerals (malachite and hydrocerussite) and metal release. For practical applications, maintaining pH at 7.8 and adding 1 mg/L orthophosphate as PO(4) were concluded to be adequate to decrease copper and lead release. Lower alkalinity of desalinated water was beneficial for blends containing 50% or more desalinated water. Copyright 2010 Elsevier Ltd. All rights reserved.

The development and mechanical characterization of aluminium copper-carbon fiber metal matrix hybrid composite

Science.gov (United States)

Manzoor, M. U.; Feroze, M.; Ahmad, T.; Kamran, M.; Butt, M. T. Z.

2018-04-01

Metal matrix composites (MMCs) come under advanced materials that can be used for a wide range of industrial applications. MMCs contain a non-metallic reinforcement incorporated into a metallic matrix which can enhance properties over base metal alloys. Copper-Carbon fiber reinforced aluminium based hybrid composites were prepared by compo casting method. 4 weight % copper was used as alloying element with Al because of its precipitation hardened properties. Different weight compositions of composites were developed and characterized by mechanical testing. A significant improvement in tensile strength and micro hardness were found, before and after heat treatment of the composite. The SEM analysis of the fractured surfaces showed dispersed and embedded Carbon fibers within the network leading to the enhanced strength.

Effects of filler wire on residual stress in electron beam welded QCr0.8 copper alloy to 304 stainless steel joints

International Nuclear Information System (INIS)

Zhang, Bing-Gang; Zhao, Jian; Li, Xiao-Peng; Chen, Guo-Qing

2015-01-01

The electron beam welding (EBW) of 304 stainless steel to QCr0.8 copper alloy with or without copper filler wire was studied in detail. The temperature fields and magnitude and distribution of stress fields in the joints during the welding process were numerically simulated using finite element method. The temperature cycles and residual stresses were also experimentally measured by thermometric and hole-drilling methods, respectively. The accuracy of the modeling procedure was verified by the good agreement between the calculated results and experimental data. The temperature distribution in the joint was found to be asymmetric along the center of weld. In particular, the temperature in the copper alloy plate is much higher than that in the 304 SS plate owing to the great difference in thermal conductivity between the two materials. The peak three-dimensional residual stresses all appeared at the interface between the copper and steel in the two different joints. Furthermore, the weld was subjected to tensile stress. The longitudinal residual stress, generally the most harmful to the integrity of the structure among the stress components in EBW with filler wire (EBFW), was 53 MPa lower than that of autogenous EBW (AEBW), and the through-thickness residual stress was 12 MPa lower. The transverse residual stress of EBFW was 44 MPa higher than that of AEBW. However, analysis of the von Mises stress showed that the EBFW process effectively reduced the extent of the high residual stress region in the weld location and the magnitude of the residual stresses in the copper side compared with those of the AEBW joint. - Highlights: • Copper and steel was welded by electron beam welding with copper filler wire. • The copper wire fed into gap can reduce the peak value of residual stress. • The peak value of longitudinal stress can be reduced 53 MPa by the filler wire. • The range of nov Mises stress in the weld could be reduced by the wire

Auger electron spectroscopy study of initial stages of oxidation in a copper - 19.6-atomic-percent-aluminum alloy

Science.gov (United States)

Ferrante, J.

1973-01-01

Auger electron spectroscopy was used to examine the initial stages of oxidation of a polycrystalline copper - 19.6 a/o-aluminum alloy. The growth of the 55-eV aluminum oxide peak and the decay of the 59-, 62-, and 937-eV copper peaks were examined as functions of temperature, exposure, and pressure. Pressures ranged from 1x10 to the minus 7th power to 0.0005 torr of O2. Temperatures ranged from room temperature to 700 C. A completely aluminum oxide surface layer was obtained in all cases. Complete disappearance of the underlying 937-eV copper peak was obtained by heating at 700 C in O2 at 0.0005 torr for 1 hr. Temperature studies indicated that thermally activated diffusion was important to the oxidation studies. The initial stages of oxidation followed a logarithmic growth curve.

Effect of triethanolamine and heliotropin on cathodic polarization of weakly acidic baths and properties of Sn-Ag-Cu alloy electrodeposits

International Nuclear Information System (INIS)

Zhang Jinqiu; An Maozhong; Chang Limin; Liu Guiyuan

2008-01-01

The effect of triethanolamine (TEA) and heliotropin (HT) on the cathodic polarization of weakly acidic baths and the properties of Sn-Ag-Cu alloy electrodeposits were investigated. Lead-free Sn-Ag-Cu solder alloy were electrodeposited in weakly acidic baths (pH 5.5) containing Sn(CH 3 SO 3 ) 2 , AgI, Cu(CH 3 SO 3 ) 2 , K 4 P 2 O 7 , KI, hydroquinone, TEA, HT and methylsulfonic acid (MSA). The cathodic polarization of baths and the properties of electrodeposits were evaluated by Liner sweep voltammetry (LSV), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), Fourier transform infrared spectrometer (FT-IR) and X-ray photoelectron spectroscopy (XPS). The results indicate that HT is a main brightening agent that increases the cathodic polarization of baths and refines the grains of electrodeposits; TEA is a complexing agent for copper ions and a brightening promoter that decreases the cathodic polarization of baths and densifies the electrodeposits. The bright, compact, and smooth Sn-Ag-Cu alloy electrodeposits contain 88-95 wt% tin, 5-10 wt% silver and 0.5-2 wt% copper. Organic compounds used in the baths neither adsorb on the electrodeposits surfaces nor are included in the electrodeposits. It can be therefore concluded that the use of both TEA and HT is better than that of them either in the process of electroplating bright Sn-Ag-Cu alloy

Corrosion characteristics of copper and leaded bronze in palm biodiesel

Energy Technology Data Exchange (ETDEWEB)

Haseeb, A.S.M.A.; Masjuki, H.H.; Ann, L.J.; Fazal, M.A. [Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia)

2010-03-15

Biodiesel has become more attractive as alternative fuel for automobiles because of its environmental benefits and the fact that it is made from renewable sources. However, corrosion of metals in biodiesel is one of the concerns related to biodiesel compatibility issues. This study aims to characterize the corrosion behavior of commercial pure copper and leaded bronze commonly encountered in the automotive fuel system in diesel engine. Static immersion tests in B0, B50 and B100 fuels were carried out at room temperature for 2640 h. Similar immersion tests in B0, B100 and B100 (oxidized) fuels were also conducted at 60 C for 840 h. At the end of the test, corrosion behavior was investigated by weight loss measurements and changes in surface morphology. Fuels were analyzed by using TAN analyzer, FTIR, MOA (multi-element oil analyzer) to investigate acid concentration, oxidation level with water content and corrosive impurities respectively. Results showed that under the experimental conditions, pure copper was more susceptible to corrosion in biodiesel as compared to leaded bronze. (author)

Copper removal from aqueous solution using Aspergillus niger mycelia in free and polyurethane-bound form

Energy Technology Data Exchange (ETDEWEB)

Tsekova, K.; Ilieva, S. [Inst. of Microbiology, Bulgarian Academy of Sciences, Sofia (Bulgaria)

2001-07-01

This study assesses the ability of mycelia of Aspergillus niger B-77 (both free and immobilized on polyurethane foam) to remove copper from single-ion solution. All experiments were conducted using 0.5 mM solutions of CuSO{sub 4}.5H{sub 2} O. Mycelia immobilized on polyurethane foam cells showed a three-fold increase in uptake, compared with that of free cells. The efficiency of copper removal (mg Cu{sup 2+} removed/mg Cu{sup 2+} added) in a column system reached more than 99% before the break-through point was attained. (orig.)

Corrosion Inhibition of Copper-nickel Alloy: Experimental and Theoretical Studies

Energy Technology Data Exchange (ETDEWEB)

Khadom, Anees A. [Univ. of Daiyla, Baquba (Iran, Islamic Republic of); Yaro, Aprael S. [Univ. of Baghdad, Aljadreaa (Iran, Islamic Republic of); Musa, Ahmed Y.; Mohamad, Abu Bakar; Kadhum, Abdul Amir H. [UniversitiKebangsaan Malaysia, Bangi (Malaysia)

2012-08-15

The corrosion inhibition of copper-nickel alloy by Ethylenediamine (EDA) and Diethylenetriamine (DETA) in 1.5M HCl has been investigated by weight loss technique at different temperatures. Maximum value of inhibitor efficiency was 75% at 35 .deg. C and 0.2 M inhibitor concentration EDA, while the lower value was 4% at 35 .deg. C and 0.01 M inhibitor concentration DETA. Two mathematical models were used to represent the corrosion rate data, second order polynomial model and exponential model respectively. Nonlinear regression analysis showed that the first model was better than the second model with high correlation coefficient. The reactivity of studied inhibitors was analyzed through theoretical calculations based on density functional theory (DFT). The results showed that the reactive sites were located on the nitrogen (N1, N2 and N4) atoms.

Medium-Power Lead-Alloy Reactors: Missions for This Reactor Technology

International Nuclear Information System (INIS)

Todreas, Neil E.; MacDonald, Philip E.; Hejzlar, Pavel; Buongiorno, Jacopo; Loewen, Eric P.

2004-01-01

A multiyear project at the Idaho National Engineering and Environmental Laboratory and the Massachusetts Institute of Technology investigated the potential of medium-power lead-alloy-cooled technology to perform two missions: (1) the production of low-cost electricity and (2) the burning of actinides from light water reactor (LWR) spent fuel. The goal of achieving a high power level to enhance economic performance simultaneously with adoption of passive decay heat removal and modularity capabilities resulted in designs in the range of 600-800 MW(thermal), which we classify as a medium power level compared to the lower [∼100 MW(thermal)] and higher [2800 MW(thermal)] power ratings of other lead-alloy-cooled designs. The plant design that was developed shows promise of achieving all the Generation-IV goals for future nuclear energy systems: sustainable energy generation, low overnight capital cost, a very low likelihood and degree of core damage during any conceivable accident, and a proliferation-resistant fuel cycle. The reactor and fuel cycle designs that evolved to achieve these missions and goals resulted from study of the following key trade-offs: waste reduction versus reactor safety, waste reduction versus cost, and cost versus proliferation resistance. Secondary trade-offs that were also considered were monolithic versus modular design, active versus passive safety systems, forced versus natural circulation, alternative power conversion cycles, and lead versus lead-bismuth coolant.These studies led to a selection of a common modular design with forced convection cooling, passive decay heat removal, and a supercritical CO 2 power cycle for all our reactor concepts. However, the concepts adopt different core designs to optimize the achievement of the two missions. For the low-cost electricity production mission, a design approach based on fueling with low enriched uranium operating without costly reprocessing in a once-through cycle was pursued to achieve a

Influence of the cooling rate on the ageing of lead-calcium alloys

Energy Technology Data Exchange (ETDEWEB)

Rossi, F.; Lambertin, M. [LaBoMaP, Arts et Metiers ParisTech, Rue porte de Paris, 71250 Cluny (France); Delfaut-Durut, L. [CEA, centre de Valduc [SEMP, LECM], 21120 Is-sur-Tille (France); Maitre, A. [SPCTS, UFR Sciences et Techniques, 87060 Limoges (France); Vilasi, M. [LCSM, Universite Nancy I, 54506 Vandoeuvre les Nancy (France)

2009-03-01

Cast lead-calcium alloys were known to be sensitive to experimental parameters, which cause large variations on the ageing and overageing behaviour. From the study of these parameters, the quenching rate was the only significant parameter. A critical cooling rate was defined based on hardness, electrical resistivity and metallographical observations. The inconsistencies in the literature noticed on the evolutions of lead-calcium alloys can now be explained by whether or not this critical cooling rate was respected. (author)

Study of the secondary negative ion emission of copper and several of its alloys by impact with Cs/sup +/ ions

Energy Technology Data Exchange (ETDEWEB)

Vallerand, P; Baril, M [Laval Univ., Quebec City (Canada). Dept. de Physique

1977-07-01

Secondary ion emission studies have been undertaken using Cs/sup +/ as the primary ion beam. A good vacuum (ca. 10/sup -8/ torr) is needed to eliminate contamination by residual gases. Negative ion emission of pure copper is compared with its alloys. The thermodynamic equilibrium model of Andersen is discussed. For low element concentrations, the experimental data show enhancement in negative emission of P, Al, Fe, Sn, Ni, and attenuation for Zn, Pb. The order of magnitude of ionic efficiency S/sup -/ for copper is evaluated at 10/sup -4/.

Comparative shear tests of some low temperature lead-free solder pastes

Science.gov (United States)

Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

2016-12-01

The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

Genesis of copper-lead mineralization in the regionally zoned Agnigundala Sulfide Belt, Cuddapah Basin, Andhra Pradesh, India

Science.gov (United States)

Bhattacharya, H. N.; Bandyopadhyay, Sandip

2018-03-01

Shallow marine sandstone-shale-carbonate sedimentary rocks of the Paleoproterozoic northern Cuddapah basin host copper (Nallakonda deposit), copper-lead (Dhukonda deposit), and lead mineralization (Bandalamottu deposit) which together constitute the Agnigundala Sulfide Belt. The Cu sulfide mineralization in sandstone is both stratabound and disseminated, and Pb sulfide mineralization occurs as stratabound fracture filling veins and/or replacement veins within dolomite. Systematic mineralogical and sulfur, carbon, and oxygen isotope studies of the three deposits indicate a common ore-fluid that deposited copper at Nallakonda, copper-lead at Dhukonda, and lead at Bandalamottu under progressive cooling during migration through sediments. The ore-fluid was of low temperature (water sulfate produced sulfide for ore deposition. It is envisaged that basal red-bed and evaporite-bearing rift-related continental to shallow marine sediments might have acted as the source for the metals. Rift-related faults developed during sedimentation in the basin might have punctured the ore-fluid pool in the lower sedimentary succession and also acted as conduits for their upward migration. The ore-bearing horizons have participated in deformations during basin inversion without any recognizable remobilization.

Microstructures and mechanical properties of age-formed 7050 aluminum alloy

International Nuclear Information System (INIS)

Chen, J.F.; Zhen, L.; Jiang, J.T.; Yang, L.; Shao, W.Z.; Zhang, B.Y.

2012-01-01

Highlights: ► Age-forming leads to the grain elongation in 7050 alloy. ► Age-forming varies the texture components in 7050 alloy. ► Age-forming promotes precipitates growth and PFZ enlargement in 7050 alloy. ► Age-forming induces to descend apparently elongation in 7050 alloy. ► The effect of age-forming on microstructure and properties is discussed in-depth. - Abstract: The effects of age-forming on microstructures and mechanical properties of 7050 Al alloy were investigated in this work. The alloy was subjected to age-forming as well as stress-free ageing at 160 °C for 6, 12, 18 and 24 h, and its microstructures were characterized by electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM). It was shown that creep might lead to grain elongation during age-forming, and the applied stress induces the coarsening of precipitates in 7050 Al alloy. The texture in the alloy was also influenced by age-forming. Consequently, the differences in microstructures result in differences in mechanical properties of age-forming versus traditional stress-free ageing. The ultimate tensile strength of age-formed samples were slightly lower than that of stress-free aged samples, while the yield strength of age-formed samples were apparently lower than that of stress-free aged samples. Specifically, the elongation of samples age-formed displays apparently decrease.

Fabrication of lithium/C-103 alloy heat pipes for sharp leading edge cooling

Science.gov (United States)

Ai, Bangcheng; Chen, Siyuan; Yu, Jijun; Lu, Qin; Han, Hantao; Hu, Longfei

2018-05-01

In this study, lithium/C-103 alloys heat pipes are proposed for sharp leading edge cooling. Three models of lithium/C-103 alloy heat pipes were fabricated. And their startup properties were tested by radiant heat tests and aerothermal tests. It is found that the startup temperature of lithium heat pipe was about 860 °C. At 1000 °C radiant heat tests, the operating temperature of lithium/C-103 alloy heat pipe is lower than 860 °C. Thus, startup failure occurs. At 1100 °C radiant heat tests and aerothermal tests, the operating temperature of lithium/C-103 alloy heat pipe is higher than 860 °C, and the heat pipe starts up successfully. The startup of lithium/C-103 alloy heat pipe decreases the leading edge temperature effectively, which endows itself good ablation resistance. After radiant heat tests and aerothermal tests, all the heat pipe models are severely oxidized because of the C-103 poor oxidation resistance. Therefore, protective coatings are required for further applications of lithium/C-103 alloy heat pipes.

Dimensional analysis of the transition from columnar to equiaxial structure in aluminium-copper and lead-tin alloys

International Nuclear Information System (INIS)

Gueijman, Sergio Fabian; Ares, Alicia Esther; Schvezov, Carlos E

2004-01-01

The importance of directional solidification studies is well known from systematic scientific research undertaken to understand the characteristics of the solidification of alloys. Such studies offer much information about the morphology of the interphase and the distribution of solute during solidification. Most alloys grow while attaining dendritic interphases. So considerable effort has been expended to understand the dendritic growth characteristics under controlled solidification conditions. A treatment that can quantitatively explain all the available test data and that correctly includes the physics of the problem is not yet available. This work carries out a theoretical analysis of columnar and equiaxial growth and of dendritic spacing under different conditions of solidification of the test pieces. The basic parameters that are used characterize a given alloy system. Next, we define non-dimensional parameters, that are used to formulate the final result of our problem regardless of the specific alloy being studied. We present the important functional relationships of our study, including the physical interpretation of the results obtained in the first work (CW)

Hydrophobic pinning with copper nanowhiskers leads to bactericidal properties.

Directory of Open Access Journals (Sweden)

Ajay Vikram Singh

Full Text Available The considerable morbidity associated with hospitalized patients and clinics in developed countries due to biofilm formation on biomedical implants and surgical instruments is a heavy economic burden. An alternative to chemically treated surfaces for bactericidal activity started emerging from micro/nanoscale topographical cues in the last decade. Here, we demonstrate a putative antibacterial surface using copper nanowhiskers deposited by molecular beam epitaxy. Furthermore, the control of biological response is based on hydrophobic pinning of water droplets in the Wenzel regime, causing mechanical injury and cell death. Scanning electron microscopy images revealed the details of the surface morphology and non-contact mode laser scanning of the surface revealed the microtopography-associated quantitative parameters. Introducing the bacterial culture over nanowhiskers produces mechanical injury to cells, leading to a reduction in cell density over time due to local pinning of culture medium to whisker surfaces. Extended culture to 72 hours to observe biofilm formation revealed biofilm inhibition with scattered microcolonies and significantly reduced biovolume on nanowhiskers. Therefore, surfaces patterned with copper nanowhiskers can serve as potential antibiofilm surfaces. The topography-based antibacterial surfaces introduce a novel prospect in developing mechanoresponsive nanobiomaterials to reduce the risk of medical device biofilm-associated infections, contrary to chemical leaching of copper as a traditional bactericidal agent.

Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

DEFF Research Database (Denmark)

Elguindi, J; Moffitt, S; Hasman, Henrik

2010-01-01

of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper...... on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing....

Safety considerations of lithium lead alloy as a fusion reactor breeding material

International Nuclear Information System (INIS)

Jeppson, D.W.; Muhlestein, L.D.

1985-01-01

Test results and conclusions are presented for lithium lead alloy interactions with various gas atmospheres, concrete and potential reactor coolants. The reactions are characterized to evaluate the potential of volatilizing and transporting radioactive species associated with the liquid breeder under postulated fusion reactor accident conditions. The safety concerns identified for lithium lead alloy reactions with the above materials are compared to those previously identified for a reference fusion breeder material, liquid lithium. Conclusions made from this comparison are also included

Material Characterization of Dissimilar Friction Stir Spot Welded Aluminium and Copper Alloy

Science.gov (United States)

Sanusi, K. O.; Akinlabi, E. T.

2017-08-01

In this research study, material characterization of dissimilar friction stir spot welded Aluminium and Copper was evaluated. Rotational speeds of 800 rpm and transverse speeds of 50 mm/min, 150 mm/min and 250 mm/min were used. The total numbers of samples evaluated were nine altogether. The spot welds were characterised by microstructure characterization using optical microscope (OEM) and scanning electron microscopy technique (SEM) by observing the evolution of the microstructure across the weld’s cross-section. lap-shear test of the of the spot weld specimens were also done. From the results, it shows that welding of metals and alloys using Friction stir spot welding is appropriate and can be use in industrial applications.

Amorphous Alloy: Promising Precursor to Form Nanoflowerpot

Directory of Open Access Journals (Sweden)

Guo Lan

2014-01-01

Full Text Available Nanoporous copper is fabricated by dealloying the amorphous Ti2Cu alloy in 0.03 M HF electrolyte. The pore and ligament sizes of the nanoporous copper can be readily tailored by controlling the dealloying time. The as-prepared nanoporous copper provides fine and uniform nanoflowerpots to grow highly dispersed Au nanoflowers. The blooming Au nanoflowers in the nanoporous copper flowerpots exhibit both high catalytic activity and stability towards the oxidation of glucose, indicating that the amorphous alloys are ideal precursors to form nanoflowerpot which can grow functional nanoflowers.

Lead and copper removal from aqueous solutions by porous glass derived calcium hydroxyapatite

International Nuclear Information System (INIS)

Liang Wen; Zhan Lei; Piao Longhua; Ruessel, Christian

2011-01-01

Graphical abstract: . Adsorption of Pb 2+ increases with the increase in NaCl volume percentage (1:0%, 2:30%, 3:40%, 4:40%) of the Glass Derived Hydroxyapatite and reaches equilibrium after 24 h. Highlights: → Novel porous glass derived hydroxyapatite matrix is prepared. → Glass derived hydroxyapatite matrix adsorbs lead and copper ions in solutions effectively. → Two adsorption mechanisms including ion exchange theory and the dissolution and precipitation theory are involved in removal of the heavy metal ions from the solutions. - Abstract: A porous glass was prepared by sintering Na 2 O-CaO-B 2 O 3 glass powder with powdered sodium chloride. Subsequently, the sodium chloride was dissolved in water resulting in a highly porous material. A sample was prepared consisting of 60 vol% glass and 40 vol% salt which both had particle sizes 2 HPO 4 solutions at room temperature for 1 day. The porous glass derived hydroxyapatite matrix was then processed for removing lead and copper ions from aqueous solutions. The results showed that the glass derived calcium hydroxyapatite matrix effectively immobilizes lead and copper ions in solution. The adsorption mechanism was investigated by the X-ray Diffraction (XRD) and Scanning Electron Microscopy including Energy Dispersive X-Ray Spectrometry (SEM-EDX).