Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Directory of Open Access Journals (Sweden)

M. Elsobky

2017-09-01

Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

PUZZLE - A program for computer-aided design of printed circuit artwork

Science.gov (United States)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

Organic printed photonics: From microring lasers to integrated circuits.

Science.gov (United States)

Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

2015-09-01

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

Development and verification of printed circuit board toroidal transformer model

DEFF Research Database (Denmark)

Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

2013-01-01

An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...... by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations...

Highly Conductive Nano-Silver Circuits by Inkjet Printing

Science.gov (United States)

Zhu, Dongbin; Wu, Minqiang

2018-06-01

Inkjet technology has become popular in the field of printed electronics due to its superior properties such as simple processes and printable complex patterns. Electrical conductivity of the circuits is one of the key factors in measuring the performance of printed electronics, which requires great material properties and a manufactured process. With excellent conductivity and ductility, silver is an ideal material as the wire connecting components. This review summarizes the progress of conductivity studies on inkjet printed nano-silver lines, including ink composition and nanoparticle morphology, deposition of nano-silver lines with uniform and high aspect ratios, sintering mechanisms and alternative methods of thermal sintering. Finally, the research direction on inkjet printed electronics is proposed.

Development of a miniaturized watch-type dosimeter using a silicon printed-circuit board

International Nuclear Information System (INIS)

Ishikura, Takeshi; Sakamaki, Tsuyoshi; Matsumoto, Iwao; Aoyama, Kei; Nakamura, Takashi

2008-01-01

The electrical personal dosimeter using a silicon semiconductor sensor has the advantage of real time response and alarm function, which can prevent unexpected over-exposure. We tried to develop a miniaturized watch-type dosimeter by incorporating the silicon semiconductor sensor on a silicon printed-circuit board. Thin film resistors, capacitors and wiring patterns are formed on a downsized printed-circuit board. Electronic parts including transistors are mounted by soldering on the silicon printed-circuit board. The dosimeter is further miniaturized by downsizing the amplifier circuit, the semiconductor radiation sensor, the power supply circuit, setting parts and alarm part. The performance of the developed dosimeter was evaluated with respect to the gamma-ray spectra, angular dependence and linearity to dose equivalent rate, and it was confirmed that this dosimeter has the performance equivalent to a commercially available electrical personal dosimeter. (author)

A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

International Nuclear Information System (INIS)

Noorliyana, H.A.; Zaheruddin, K.; Mohd Fazlul Bari; M. Sri Asliza; Nurhidayah, A.Z.; Kamarudin, H.

2009-01-01

Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

CAD-CAM printed circuit board design

Science.gov (United States)

Agy, W. E.

A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

Active Trimming of Hybrid Integrated Circuits

OpenAIRE

Németh, P.; Krémer, P.

1984-01-01

One of the more important fields of the microelectronics industry is the manufacturing of hybrid integrated circuits.An important part of the manufacturing process is concerned with the trimming of the hybrid integratedl circuits. This article deals with the basic principles of active trimming and introduces a microprocessor controlled trimming machine. By comparing active trimming with passive techniques, it can be shown that the active system has some advantages. This article outlines these...

A Printed Organic Circuit System for Wearable Amperometric Electrochemical Sensors.

Science.gov (United States)

Shiwaku, Rei; Matsui, Hiroyuki; Nagamine, Kuniaki; Uematsu, Mayu; Mano, Taisei; Maruyama, Yuki; Nomura, Ayako; Tsuchiya, Kazuhiko; Hayasaka, Kazuma; Takeda, Yasunori; Fukuda, Takashi; Kumaki, Daisuke; Tokito, Shizuo

2018-04-23

Wearable sensor device technologies, which enable continuous monitoring of biological information from the human body, are promising in the fields of sports, healthcare, and medical applications. Further thinness, light weight, flexibility and low-cost are significant requirements for making the devices attachable onto human tissues or clothes like a patch. Here we demonstrate a flexible and printed circuit system consisting of an enzyme-based amperometric sensor, feedback control and amplification circuits based on organic thin-film transistors. The feedback control and amplification circuits based on pseudo-CMOS inverters were successfuly integrated by printing methods on a plastic film. This simple system worked very well like a potentiostat for electrochemical measurements, and enabled the quantitative and real-time measurement of lactate concentration with high sensitivity of 1 V/mM and a short response time of a hundred seconds.

Modelling, analysis, and acceleration of a printed circuit board ...

Indian Academy of Sciences (India)

Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

discuss lead time reduction in a qualitative way with illustrative case studies. Krishnan ... industry practices, and research questions that should drive new methods and computer ... There are three types of printed circuit boards available today.

Merging polygons on two-layer printed circuit board

Directory of Open Access Journals (Sweden)

Murov S. Yu.

2011-12-01

Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

Energy Technology Data Exchange (ETDEWEB)

Yoon, Su-Jong [Idaho National Lab. (INL), Idaho Falls, ID (United States); Sabharwall, Piyush [Idaho National Lab. (INL), Idaho Falls, ID (United States); Kim, Eung-Soo [Idaho National Lab. (INL), Idaho Falls, ID (United States)

2013-09-01

The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.

RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

Directory of Open Access Journals (Sweden)

Marcos Paulo Kohler Caldas

2015-06-01

Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

2015-01-15

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

International Nuclear Information System (INIS)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

2015-01-01

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

Microwaves integrated circuits: hybrids and monolithics - fabrication technology

International Nuclear Information System (INIS)

Cunha Pinto, J.K. da

1983-01-01

Several types of microwave integrated circuits are presented together with comments about technologies and fabrication processes; advantages and disadvantages in their utilization are analysed. Basic structures, propagation modes, materials used and major steps in the construction of hybrid thin film and monolithic microwave integrated circuits are described. Important technological applications are revised and main activities of the microelectronics lab. of the University of Sao Paulo (Brazil) in the field of hybrid and monolithic microwave integrated circuits are summarized. (C.L.B.) [pt

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

International Nuclear Information System (INIS)

Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

2009-01-01

Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

Fabrication of Ultra-Thin Printed Organic TFT CMOS Logic Circuits Optimized for Low-Voltage Wearable Sensor Applications.

Science.gov (United States)

Takeda, Yasunori; Hayasaka, Kazuma; Shiwaku, Rei; Yokosawa, Koji; Shiba, Takeo; Mamada, Masashi; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

2016-05-09

Ultrathin electronic circuits that can be manufactured by using conventional printing technologies are key elements necessary to realize wearable health sensors and next-generation flexible electronic devices. Due to their low level of power consumption, complementary (CMOS) circuits using both types of semiconductors can be easily employed in wireless devices. Here, we describe ultrathin CMOS logic circuits, for which not only the source/drain electrodes but also the semiconductor layers were printed. Both p-type and n-type organic thin film transistor devices were employed in a D-flip flop circuit in the newly developed stacked structure and exhibited excellent electrical characteristics, including good carrier mobilities of 0.34 and 0.21 cm(2) V(-1) sec(-1), and threshold voltages of nearly 0 V with low operating voltages. These printed organic CMOS D-flip flop circuits exhibit operating frequencies of 75 Hz and demonstrate great potential for flexible and printed electronics technology, particularly for wearable sensor applications with wireless connectivity.

Development of an Economical Interfacing Circuit for Upgrading of SEM Data Printing System

International Nuclear Information System (INIS)

Punnachaiya, S.; Thong-Aram, D.

2002-01-01

The operating conditions of a Scanning Electron Microscope (SEM) i.e., magnification, accelerating voltage, micron mark and film identification labeling, are very important for the accurate interpretation of a micrograph picture. In the old model SEM, the built-in data printing system for film identification can be inputted only the numerical number. This will be made a confusing problems when various operating conditions were applied in routine work. An economical interfacing circuit, therefore, was developed to upgrade the data printing system for capable of alphanumerical labeling. The developed circuit was tested on both data printing systems of JSM-T220 and JSM-T330 (JEOL SEM). It was found that the interfacing function worked properly and easily installed

Gas microstrip detectors based on flexible printed circuit

International Nuclear Information System (INIS)

Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

1995-09-01

We have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. We describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. We also describe two new passivation materials, Tantalum and Niobium, which produce effective surfaces. (author)

Hybrid 3D printing: a game-changer in personalized cardiac medicine?

Science.gov (United States)

Kurup, Harikrishnan K N; Samuel, Bennett P; Vettukattil, Joseph J

2015-12-01

Three-dimensional (3D) printing in congenital heart disease has the potential to increase procedural efficiency and patient safety by improving interventional and surgical planning and reducing radiation exposure. Cardiac magnetic resonance imaging and computed tomography are usually the source datasets to derive 3D printing. More recently, 3D echocardiography has been demonstrated to derive 3D-printed models. The integration of multiple imaging modalities for hybrid 3D printing has also been shown to create accurate printed heart models, which may prove to be beneficial for interventional cardiologists, cardiothoracic surgeons, and as an educational tool. Further advancements in the integration of different imaging modalities into a single platform for hybrid 3D printing and virtual 3D models will drive the future of personalized cardiac medicine.

Inkjet printed large-area flexible circuits: a simple methodology for optimizing the printing quality

Science.gov (United States)

Cheng, Tao; Wu, Youwei; Shen, Xiaoqin; Lai, Wenyong; Huang, Wei

2018-01-01

In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjet-printed silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics. Project supported by the National Key Basic Research Program of China (Nos. 2014CB648300, 2017YFB0404501), the National Natural Science Foundation of China (Nos. 21422402, 21674050), the Natural Science Foundation of Jiangsu Province (Nos. BK20140060, BK20130037, BK20140865, BM2012010), the Program for Jiangsu Specially-Appointed Professors (No. RK030STP15001), the Program for New Century Excellent Talents in University (No. NCET-13-0872), the NUPT "1311 Project" and Scientific Foundation (Nos. NY213119, NY213169), the Synergetic Innovation Center for Organic Electronics and Information Displays, the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), the Leading Talent of Technological Innovation of National Ten-Thousands Talents Program of China, the Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions (No. TJ217038), the Program for Graduate Students Research and Innovation of Jiangsu Province (No. KYZZ16-0253), and the 333 Project of Jiangsu Province (Nos. BRA2017402, BRA2015374).

Application specific integrated circuits and hybrid micro circuits for nuclear instrumentation

International Nuclear Information System (INIS)

Chandratre, V.B.; Sukhwani, Menka; Mukhopadhyay, P.K.; Shastrakar, R.S.; Sudheer, M.; Shedam, V.; Keni, Anubha

2009-01-01

Rapid development in semiconductor technology, sensors, detectors and requirements of high energy physics experiments as well as advances in commercially available nuclear instruments have lead to challenges for instrumentation. These challenges are met with development of Application Specific Integrated Circuits and Hybrid Micro Circuits. This paper discusses various activities in ASIC and HMC development in Bhabha Atomic Research Centre. (author)

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Bruno de Castro Braz

Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

Printed circuit board permittivity measurement using waveguide and resonator rings

NARCIS (Netherlands)

Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

2014-01-01

Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

Toward printed integrated circuits based on unipolar or ambipolar polymer semiconductors.

Science.gov (United States)

Baeg, Kang-Jun; Caironi, Mario; Noh, Yong-Young

2013-08-21

For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge

A novel and simple method of printing flexible conductive circuits on PET fabrics

International Nuclear Information System (INIS)

Wang, Zehong; Wang, Wei; Jiang, Zhikang; Yu, Dan

2017-01-01

Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

A novel and simple method of printing flexible conductive circuits on PET fabrics

Energy Technology Data Exchange (ETDEWEB)

Wang, Zehong; Wang, Wei [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Jiang, Zhikang [Saintyear Holding Group Co., Ltd. (China); Yu, Dan, E-mail: vchtian@163.com [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Saintyear Holding Group Co., Ltd. (China)

2017-02-28

Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

Science.gov (United States)

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

[Flexible print circuit technology application in biomedical engineering].

Science.gov (United States)

Jiang, Lihua; Cao, Yi; Zheng, Xiaolin

2013-06-01

Flexible print circuit (FPC) technology has been widely applied in variety of electric circuits with high precision due to its advantages, such as low-cost, high specific fabrication ability, and good flexibility, etc. Recently, this technology has also been used in biomedical engineering, especially in the development of microfluidic chip and microelectrode array. The high specific fabrication can help making microelectrode and other micro-structure equipment. And good flexibility allows the micro devices based on FPC technique to be easily packaged with other parts. In addition, it also reduces the damage of microelectrodes to the tissue. In this paper, the application of FPC technology in biomedical engineering is introduced. Moreover, the important parameters of FPC technique and the development trend of prosperous applications is also discussed.

Gas microstrip detectors based on flexible printed circuit

International Nuclear Information System (INIS)

Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

1995-09-01

Microstrip Gas Detectors (MSGC's) were introduced some years ago as position sensitive detectors capable of operating at very high rates. The authors have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. They describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. They also describe two new passivation materials, tantalum and niobium, which produce effective surfaces

Hybrid 3D printing by bridging micro/nano processes

International Nuclear Information System (INIS)

Yoon, Hae-Sung; Jang, Ki-Hwan; Kim, Eunseob; Lee, Hyun-Taek; Ahn, Sung-Hoon

2017-01-01

A hybrid 3D printing process was developed for multiple-material/freeform nano-scale manufacturing. The process consisted of aerodynamically focused nanoparticle (AFN) printing, micro-machining, focused ion beam milling, and spin-coating. Theoretical and experimental investigations were carried out to improve the compatibility of each of the processes, enabling bridging of various different techniques. The resulting hybrid process could address the limitations of individual processes, enabling improved process scaling and dimensional degrees of freedom, without losing the advantages of the existing processes. The minimum structure width can be reduced to 50 nm using undercut structures. In addition, AFN printing employs particle impact for adhesion, and various inorganic materials are suitable for printing, including metals and functional ceramics. Using the developed system, we fabricated bi-material cantilevers for applications as a thermal actuator. The mechanical and thermal properties of the structure were investigated using an in situ measurement system, and irregular thermal phenomena due to the fabrication process were analyzed. We expect that this work will lead to improvements in the area of customized nano-scale manufacturing, as well as further improvements in manufacturing technology by combining different fabrication techniques. (paper)

Hybrid 3D printing by bridging micro/nano processes

Science.gov (United States)

Yoon, Hae-Sung; Jang, Ki-Hwan; Kim, Eunseob; Lee, Hyun-Taek; Ahn, Sung-Hoon

2017-06-01

A hybrid 3D printing process was developed for multiple-material/freeform nano-scale manufacturing. The process consisted of aerodynamically focused nanoparticle (AFN) printing, micro-machining, focused ion beam milling, and spin-coating. Theoretical and experimental investigations were carried out to improve the compatibility of each of the processes, enabling bridging of various different techniques. The resulting hybrid process could address the limitations of individual processes, enabling improved process scaling and dimensional degrees of freedom, without losing the advantages of the existing processes. The minimum structure width can be reduced to 50 nm using undercut structures. In addition, AFN printing employs particle impact for adhesion, and various inorganic materials are suitable for printing, including metals and functional ceramics. Using the developed system, we fabricated bi-material cantilevers for applications as a thermal actuator. The mechanical and thermal properties of the structure were investigated using an in situ measurement system, and irregular thermal phenomena due to the fabrication process were analyzed. We expect that this work will lead to improvements in the area of customized nano-scale manufacturing, as well as further improvements in manufacturing technology by combining different fabrication techniques.

Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

Science.gov (United States)

Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

2015-05-01

Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

Study of the computer-aided implantation and layout of printed circuits

International Nuclear Information System (INIS)

Baudry, Marc

1973-01-01

This research thesis reports the design and implementation of a software aimed at a computer-aided implantation and layout of printed circuits. This work comprises the use of heuristic algorithms and the search for a minimum cost by reduction of computing time and of memory size. The software comprises four independent parts which respectively address data analysis and control, circuit implantation, connection layout, and the exploitation of the obtained results. These four parts and their subroutines are presented. Two examples are reported in appendix

Hybrid 3D-2D printing for bone scaffolds fabrication

Science.gov (United States)

Seleznev, V. A.; Prinz, V. Ya

2017-02-01

It is a well-known fact that bone scaffold topography on micro- and nanometer scale influences the cellular behavior. Nano-scale surface modification of scaffolds allows the modulation of biological activity for enhanced cell differentiation. To date, there has been only a limited success in printing scaffolds with micro- and nano-scale features exposed on the surface. To improve on the currently available imperfect technologies, in our paper we introduce new hybrid technologies based on a combination of 2D (nano imprint) and 3D printing methods. The first method is based on using light projection 3D printing and simultaneous 2D nanostructuring of each of the layers during the formation of the 3D structure. The second method is based on the sequential integration of preliminarily created 2D nanostructured films into a 3D printed structure. The capabilities of the developed hybrid technologies are demonstrated with the example of forming 3D bone scaffolds. The proposed technologies can be used to fabricate complex 3D micro- and nanostructured products for various fields.

Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Rasa Volungevičienė

2014-10-01

Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

Hybrid 3D Printing of Soft Electronics.

Science.gov (United States)

Valentine, Alexander D; Busbee, Travis A; Boley, John William; Raney, Jordan R; Chortos, Alex; Kotikian, Arda; Berrigan, John Daniel; Durstock, Michael F; Lewis, Jennifer A

2017-10-01

Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Hybrid circuit prototypes for the CMS Tracker upgrade front-end electronics

International Nuclear Information System (INIS)

Blanchot, G; Honma, A; Kovacs, M; Braga, D; Raymond, M

2013-01-01

New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic-based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip chip ASICs. A description of the function of the hybrid circuit in the tracker, the first prototype designs, results of some electrical and mechanical properties from the prototypes, and examples of the integration of the hybrids into detector modules are presented

Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

Directory of Open Access Journals (Sweden)

V.C. Ho

2003-01-01

Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

Three-Dimensional (3D) Printing of Polymer-Metal Hybrid Materials by Fused Deposition Modeling.

Science.gov (United States)

Fafenrot, Susanna; Grimmelsmann, Nils; Wortmann, Martin; Ehrmann, Andrea

2017-10-19

Fused deposition modeling (FDM) is a three-dimensional (3D) printing technology that is usually performed with polymers that are molten in a printer nozzle and placed line by line on the printing bed or the previous layer, respectively. Nowadays, hybrid materials combining polymers with functional materials are also commercially available. Especially combinations of polymers with metal particles result in printed objects with interesting optical and mechanical properties. The mechanical properties of objects printed with two of these metal-polymer blends were compared to common poly (lactide acid) (PLA) printed objects. Tensile tests and bending tests show that hybrid materials mostly containing bronze have significantly reduced mechanical properties. Tensile strengths of the 3D-printed objects were unexpectedly nearly identical with those of the original filaments, indicating sufficient quality of the printing process. Our investigations show that while FDM printing allows for producing objects with mechanical properties similar to the original materials, metal-polymer blends cannot be used for the rapid manufacturing of objects necessitating mechanical strength.

Hybrid printing of mechanically and biologically improved constructs for cartilage tissue engineering applications

International Nuclear Information System (INIS)

Xu Tao; Binder, Kyle W; Albanna, Mohammad Z; Dice, Dennis; Zhao Weixin; Yoo, James J; Atala, Anthony

2013-01-01

Bioprinting is an emerging technique used to fabricate viable, 3D tissue constructs through the precise deposition of cells and hydrogels in a layer-by-layer fashion. Despite the ability to mimic the native properties of tissue, printed 3D constructs that are composed of naturally-derived biomaterials still lack structural integrity and adequate mechanical properties for use in vivo, thus limiting their development for use in load-bearing tissue engineering applications, such as cartilage. Fabrication of viable constructs using a novel multi-head deposition system provides the ability to combine synthetic polymers, which have higher mechanical strength than natural materials, with the favorable environment for cell growth provided by traditional naturally-derived hydrogels. However, the complexity and high cost associated with constructing the required robotic system hamper the widespread application of this approach. Moreover, the scaffolds fabricated by these robotic systems often lack flexibility, which further restrict their applications. To address these limitations, advanced fabrication techniques are necessary to generate complex constructs with controlled architectures and adequate mechanical properties. In this study, we describe the construction of a hybrid inkjet printing/electrospinning system that can be used to fabricate viable tissues for cartilage tissue engineering applications. Electrospinning of polycaprolactone fibers was alternated with inkjet printing of rabbit elastic chondrocytes suspended in a fibrin–collagen hydrogel in order to fabricate a five-layer tissue construct of 1 mm thickness. The chondrocytes survived within the printed hybrid construct with more than 80% viability one week after printing. In addition, the cells proliferated and maintained their basic biological properties within the printed layered constructs. Furthermore, the fabricated constructs formed cartilage-like tissues both in vitro and in vivo as evidenced by the

Inkjet-printed conductive features for rapid integration of electronic circuits in centrifugal microfluidics

CSIR Research Space (South Africa)

Kruger, J

2015-05-01

Full Text Available This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which...

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

International Nuclear Information System (INIS)

Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

2014-01-01

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

Energy Technology Data Exchange (ETDEWEB)

Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

2014-01-15

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

Science.gov (United States)

Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

2016-09-01

Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

Fast optoelectric printing of plasmonic nanoparticles into tailored circuits

Science.gov (United States)

Rodrigo, José A.

2017-04-01

Plasmonic nanoparticles are able to control light at nanometre-scale by coupling electromagnetic fields to the oscillations of free electrons in metals. Deposition of such nanoparticles onto substrates with tailored patterns is essential, for example, in fabricating plasmonic structures for enhanced sensing. This work presents an innovative micro-patterning technique, based on optoelectic printing, for fast and straightforward fabrication of curve-shaped circuits of plasmonic nanoparticles deposited onto a transparent electrode often used in optoelectronics, liquid crystal displays, touch screens, etc. We experimentally demonstrate that this kind of plasmonic structure, printed by using silver nanoparticles of 40 nm, works as a plasmonic enhanced optical device allowing for polarized-color-tunable light scattering in the visible. These findings have potential applications in biosensing and fabrication of future optoelectronic devices combining the benefits of plasmonic sensing and the functionality of transparent electrodes.

Application of parallel processing for automatic inspection of printed circuits

International Nuclear Information System (INIS)

Lougheed, R.M.

1986-01-01

Automated visual inspection of printed electronic circuits is a challenging application for image processing systems. Detailed inspection requires high speed analysis of gray scale imagery along with high quality optics, lighting, and sensing equipment. A prototype system has been developed and demonstrated at the Environmental Research Institute of Michigan (ERIM) for inspection of multilayer thick-film circuits. The central problem of real-time image processing is solved by a special-purpose parallel processor which includes a new high-speed Cytocomputer. In this chapter the inspection process and the algorithms used are summarized, along with the functional requirements of the machine vision system. Next, the parallel processor is described in detail and then performance on this application is given

Effect of ionic contamination on climatic reliability of printed circuit board assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2012-01-01

The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

Three-Dimensional (3D Printing of Polymer-Metal Hybrid Materials by Fused Deposition Modeling

Directory of Open Access Journals (Sweden)

Susanna Fafenrot

2017-10-01

Full Text Available Fused deposition modeling (FDM is a three-dimensional (3D printing technology that is usually performed with polymers that are molten in a printer nozzle and placed line by line on the printing bed or the previous layer, respectively. Nowadays, hybrid materials combining polymers with functional materials are also commercially available. Especially combinations of polymers with metal particles result in printed objects with interesting optical and mechanical properties. The mechanical properties of objects printed with two of these metal-polymer blends were compared to common poly (lactide acid (PLA printed objects. Tensile tests and bending tests show that hybrid materials mostly containing bronze have significantly reduced mechanical properties. Tensile strengths of the 3D-printed objects were unexpectedly nearly identical with those of the original filaments, indicating sufficient quality of the printing process. Our investigations show that while FDM printing allows for producing objects with mechanical properties similar to the original materials, metal-polymer blends cannot be used for the rapid manufacturing of objects necessitating mechanical strength.

Improving intrinsic corrosion reliability of printed circuit board assembly

DEFF Research Database (Denmark)

Ambat, Rajan; Conseil, Helene

2016-01-01

conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

Chemically programmed ink-jet printed resistive WORM memory array and readout circuit

International Nuclear Information System (INIS)

Andersson, H; Manuilskiy, A; Sidén, J; Gao, J; Kunninmel, G V; Nilsson, H-E; Hummelgård, M

2014-01-01

In this paper an ink-jet printed write once read many (WORM) resistive memory fabricated on paper substrate is presented. The memory elements are programmed for different resistance states by printing triethylene glycol monoethyl ether on the substrate before the actual memory element is printed using silver nano particle ink. The resistance is thus able to be set to a broad range of values without changing the geometry of the elements. A memory card consisting of 16 elements is manufactured for which the elements are each programmed to one of four defined logic levels, providing a total of 4294 967 296 unique possible combinations. Using a readout circuit, originally developed for resistive sensors to avoid crosstalk between elements, a memory card reader is manufactured that is able to read the values of the memory card and transfer the data to a PC. Such printed memory cards can be used in various applications. (paper)

Hybrid CMOS/Molecular Integrated Circuits

Science.gov (United States)

Stan, M. R.; Rose, G. S.; Ziegler, M. M.

CMOS silicon technologies are likely to run out of steam in the next 10-15 years despite revolutionary advances in the past few decades. Molecular and other nanoscale technologies show significant promise but it is unlikely that they will completely replace CMOS, at least in the near term. This chapter explores opportunities for using CMOS and nanotechnology to enhance and complement each other in hybrid circuits. As an example of such a hybrid CMOS/nano system, a nanoscale programmable logic array (PLA) based on majority logic is described along with its supplemental CMOS circuitry. It is believed that such systems will be able to sustain the historical advances in the semiconductor industry while addressing manufacturability, yield, power, cost, and performance challenges.

On-chip single photon filtering and multiplexing in hybrid quantum photonic circuits.

Science.gov (United States)

Elshaari, Ali W; Zadeh, Iman Esmaeil; Fognini, Andreas; Reimer, Michael E; Dalacu, Dan; Poole, Philip J; Zwiller, Val; Jöns, Klaus D

2017-08-30

Quantum light plays a pivotal role in modern science and future photonic applications. Since the advent of integrated quantum nanophotonics different material platforms based on III-V nanostructures-, colour centers-, and nonlinear waveguides as on-chip light sources have been investigated. Each platform has unique advantages and limitations; however, all implementations face major challenges with filtering of individual quantum states, scalable integration, deterministic multiplexing of selected quantum emitters, and on-chip excitation suppression. Here we overcome all of these challenges with a hybrid and scalable approach, where single III-V quantum emitters are positioned and deterministically integrated in a complementary metal-oxide-semiconductor-compatible photonic circuit. We demonstrate reconfigurable on-chip single-photon filtering and wavelength division multiplexing with a foot print one million times smaller than similar table-top approaches, while offering excitation suppression of more than 95 dB and efficient routing of single photons over a bandwidth of 40 nm. Our work marks an important step to harvest quantum optical technologies' full potential.Combining different integration platforms on the same chip is currently one of the main challenges for quantum technologies. Here, Elshaari et al. show III-V Quantum Dots embedded in nanowires operating in a CMOS compatible circuit, with controlled on-chip filtering and tunable routing.

Preliminary Study of Printed Circuit Heat Exchanger (PCHE) for various power conversion systems for SMART

Energy Technology Data Exchange (ETDEWEB)

Kwon, Jinsu; Baik, Seungjoon; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

2016-10-15

The steam-Rankine cycle was the most widely used power conversion system for a nuclear power plant. The size of the heat exchanger is important for the modulation. Such a challenge was conducted by Kang et al. They change the steam generator type for the SMART from helical type heat exchanger to Printed Circuit Heat Exchanger (PCHE). Recently, there has been a growing interest in the supercritical carbon dioxide (S-CO{sub 2}) Brayton cycle as the most promising power conversion system. The reason is high efficiency with simple layout and compact power plant due to small turbomachinery and compact heat exchanger technology. That is why the SCO{sub 2} Brayton cycle can enhance the existing advantages of Small Modular Reactor (SMR) like SMART, such as reduction in size, capital cost, and construction period. Thermal hydraulic and geometric parameters of a PCHE for the S-CO{sub 2} power cycle coupled to SMART. The results show that the water - CO{sub 2} printed circuit heat exchanger size is smaller than printed circuit steam generator for the superheated steam Rankine cycle. This results show the potential benefit of using the S-CO-2 Brayton power cycle to a water-cooled small modular reactor.

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

Science.gov (United States)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

DEFF Research Database (Denmark)

Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

2013-01-01

The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

Development of high-performance printed organic field-effect transistors and integrated circuits.

Science.gov (United States)

Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

2015-10-28

Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

In-situ fabrication of flexible vertically integrated electronic circuits by inkjet printing

International Nuclear Information System (INIS)

Wang Zhuo; Wu Wenwen; Yang Qunbao; Li Yongxiang; Noh, Chang-Ho

2009-01-01

In this paper, a facile approach for fabricating flexible vertically integrated electronic circuits is demonstrated. A desktop inkjet printer was modified and employed to print silver precursor on a polymer-coated buffer substrates. In-situ reaction was taken place and a conducting line was formed without need of a high temperature treatment. Through this process, several layers of metal integrated circuits were deposited sequentially with polymer buffer layers sandwiched between each layer. Hence, vertically integrated electronic components of diodes, solar cells, flexible flat panel displays, and electrochromic devices can be built with this simple and low-cost technique.

Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

DEFF Research Database (Denmark)

Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

2015-01-01

A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

Hybrid integrated circuit for charge-to-time interval conversion

Energy Technology Data Exchange (ETDEWEB)

Basiladze, S.G.; Dotsenko, Yu.Yu.; Man' yakov, P.K.; Fedorchenko, S.N. (Joint Inst. for Nuclear Research, Dubna (USSR))

The hybrid integrated circuit for charge-to time interval conversion with nanosecond input fast response is described. The circuit can be used in energy measuring channels, time-to-digital converters and in the modified variant in amplitude-to-digital converters. The converter described consists of a buffer amplifier, a linear transmission circuit, a direct current source and a unit of time interval separation. The buffer amplifier represents a current follower providing low input and high output resistances by the current feedback. It is concluded that the described converter excelled the QT100B circuit analogous to it in a number of parameters especially, in thermostability.

Preparing printed circuit boards for rapid turn-around time on a protomat plotter

International Nuclear Information System (INIS)

Hawtree, J.

1998-01-01

This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

Design analysis of a lead–lithium/supercritical CO2 Printed Circuit Heat Exchanger for primary power recovery

International Nuclear Information System (INIS)

Fernández, Iván; Sedano, Luis

2013-01-01

Highlights: • A design for a PbLi/CO 2 (SC) Printed Circuit Heat Exchanger which optimizes the pressure drop performance is proposed. • Numerical analyses have been performed to optimize the airfoil fins shape and arrangement. • SiC is proposed as structural material and tritium permeation barrier for the PCHE. • The integrated flux is larger than expected and allows reducing the CO 2 mass flow in this sector of the power cycle. • A transport model has been developed to evaluate the permeation of tritium from the liquid metal to the secondary CO 2 . -- Abstract: One of the key issues for fusion power plant technology is the efficient, reliable and safe recovery of the power extracted by the primary coolants. An interesting design option for power conversion cycles based on Dual Coolant Breeding Blankets (DCBB) is a Printed Circuit Heat Exchanger, which is supported by the advantages of its compactness, thermal effectiveness, high temperature and pressure capability and corrosion resistance. This work presents a design analysis of a silicon carbide Printed Circuit Heat Exchanger for lead–lithium/supercritical CO 2 at DEMO ranges (4× segmentation)

An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

International Nuclear Information System (INIS)

Combet, M.; Eder, J.; Pagny, C.

1974-12-01

A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

Science.gov (United States)

Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

2015-01-01

For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

Recent trends in hardware security exploiting hybrid CMOS-resistive memory circuits

Science.gov (United States)

Sahay, Shubham; Suri, Manan

2017-12-01

This paper provides a comprehensive review and insight of recent trends in the field of random number generator (RNG) and physically unclonable function (PUF) circuits implemented using different types of emerging resistive non-volatile (NVM) memory devices. We present a detailed review of hybrid RNG/PUF implementations based on the use of (i) Spin-Transfer Torque (STT-MRAM), and (ii) metal-oxide based (OxRAM), NVM devices. Various approaches on Hybrid CMOS-NVM RNG/PUF circuits are considered, followed by a discussion on different nanoscale device phenomena. Certain nanoscale device phenomena (variability/stochasticity etc), which are otherwise undesirable for reliable memory and storage applications, form the basis for low power and highly scalable RNG/PUF circuits. Detailed qualitative comparison and benchmarking of all implementations is performed.

A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

International Nuclear Information System (INIS)

Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

2012-01-01

This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

OpenAIRE

Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong

2013-01-01

The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity se...

Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

International Nuclear Information System (INIS)

LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

1999-01-01

We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

3D printed barium titanate/poly-(vinylidene fluoride) nano-hybrid with anisotropic dielectric properties

DEFF Research Database (Denmark)

Phatharapeetranun, N.; Ksapabutr, B.; Marani, D.

2017-01-01

properties of the starting materials are optimized to shape the hybrid by the precision-extrusion-based fuse deposition modeling technique. The 3D-printed BTNFs allow complex shapes with different degrees of fiber alignment as the result of printing shear stress and the chemical composition of the starting...

The ATPG Attack for Reverse Engineering of Combinational Hybrid Custom-Programmable Circuits

Science.gov (United States)

2017-03-23

Introduction The widely practiced horizontal integrated circuit supply chain exposes a design to various types of attacks including the reverse engineering ...STT_CMOS designs for reverse- engineering prevention, DAC 2016. [5] M. E. Massad and et. al. Integrated circuit (IC) decamouflaging: reverse...The ATPG Attack for Reverse Engineering of Combinational Hybrid Custom-Programmable Circuits Raza Shafiq Hamid Mahmoodi Houman Homayoun Hassan

Natural printed silk substrate circuit fabricated via surface modification using one step thermal transfer and reduction graphene oxide

Science.gov (United States)

Cao, Jiliang; Huang, Zhan; Wang, Chaoxia

2018-05-01

Graphene conductive silk substrate is a preferred material because of its biocompatibility, flexibility and comfort. A flexible natural printed silk substrate circuit was fabricated by one step transfer of graphene oxide (GO) paste from transfer paper to the surface of silk fabric and reduction of the GO to reduced graphene oxide (RGO) using a simple hot press treatment. The GO paste was obtained through ultrasonic stirring exfoliation under low temperature, and presented excellent printing rheological properties at high concentration. The silk fabric was obtained a surface electric resistance as low as 12.15 KΩ cm-1, in the concentration of GO 50 g L-1 and hot press at 220 °C for 120 s. Though the whiteness and strength decreased with the increasing of hot press temperature and time slowly, the electric conductivity of RGO surface modification silk substrate improved obviously. The surface electric resistance of RGO/silk fabrics increased from 12.15 KΩ cm-1 to 18.05 KΩ cm-1, 28.54 KΩ cm-1 and 32.53 KΩ cm-1 after 10, 20 and 30 washing cycles, respectively. The results showed that the printed silk substrate circuit has excellent washability. This process requires no chemical reductant, and the reduction efficiency and reduction degree of GO is high. This time-effective and environmentally-friendly one step thermal transfer and reduction graphene oxide onto natural silk substrate method can be easily used to production of reduced graphene oxide (RGO) based flexible printed circuit.

Manufacturing experience and test results of the PS prototype flexible hybrid circuit for the CMS Tracker Upgrade

CERN Document Server

Kovacs, Mark Istvan; Gadek, Tomasz; Honma, Alan; Vasey, Francois

2017-01-01

The CMS Tracker Phase-2 Upgrade for HL-LHC requires High Density Interconnect (HDI) flexible hybrid circuits to build modules with low mass and high granularity. The hybrids are carbon fibre reinforced flexible circuits with flip-chips and passives. Three different manufacturers produced prototype hybrids for the Pixel-Strip type modules. The first part of the presentation will focus on the design challenges of this state of the art circuit. Afterwards, the difficulties and experience related to the circuit manufacturing and assembly are presented. The description of quality inspection methods with comprehensive test results will lead to the conclusion.

Packaging printed circuit boards: A production application of interactive graphics

Science.gov (United States)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Checking a printed board

CERN Multimedia

1977-01-01

An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

A Hybrid, Current-Source/Voltage-Source Power Inverter Circuit

DEFF Research Database (Denmark)

Trzynadlowski, Andrzej M.; Patriciu, Niculina; Blaabjerg, Frede

2001-01-01

A combination of a large current-source inverter and a small voltage-source inverter circuits is analyzed. The resultant hybrid inverter inherits certain operating advantages from both the constituent converters. In comparison with the popular voltage-source inverter, these advantages include...... reduced switching losses, improved quality of output current waveforms, and faster dynamic response to current control commands. Description of operating principles and characteristics of the hybrid inverter is illustrated with results of experimental investigation of a laboratory model....

Equivalent Circuit Analysis of Photovoltaic-Thermoelectric Hybrid Device with Different TE Module Structure

Directory of Open Access Journals (Sweden)

Haijun Chen

2014-01-01

Full Text Available Combining two different types of solar cells with different absorption bands into a hybrid cell is a very useful method to improve the utilization efficiency of solar energy. The experimental data of dye-sensitized solar cells (DSSCs and thermoelectric generators (TEG was simulated by equivalent circuit method, and some parameters of DSSCs were obtained. Then, the equivalent circuit model with the obtained parameters was used to optimize the structure design of photovoltaic- (PV- thermoelectric (TE hybrid devices. The output power (Pout first increases to a maximum and then decreases by increasing the TE prism size, and a smaller spacing between p-type prism and n-type prism of a TE p-n junction causes a higher output power of TEG and hybrid device. When the spacing between TE prisms is 15 μm and the optimal base side length of TE prism is 40 μm, the maximum theoretical efficiency reaches 24.6% according to the equivalent circuit analysis. This work would give some enlightenment for the development of high-performance PV-TE hybrid devices.

Design and implementation of a hybrid circuit system for micro sensor signal processing

International Nuclear Information System (INIS)

Wang Zhuping; Chen Jing; Liu Ruqing

2011-01-01

This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

Optimized circuit design for flexible 8-bit RFID transponders with active layer of ink-jet printed small molecule semiconductors

NARCIS (Netherlands)

Kjellander, B.K.C.; Smaal, W.T.T.; Myny, K.; Genoe, J.; Dehaene, W.; Heremans, P.; Gelinck, G.H.

2013-01-01

We ink-jet print a blend of 6,13-bis(triisopropyl-silylethynyl)pentacene and polystyrene as the active layer for flexible circuits. The discrete ink-jet printed transistors exhibit a saturation mobility of 0.5 cm2 V -1 s-1. The relative spread in transistor characteristics can be very large. This

Hybrid 2D patterning using UV laser direct writing and aerosol jet printing of UV curable polydimethylsiloxane

Science.gov (United States)

Obata, Kotaro; Schonewille, Adam; Slobin, Shayna; Hohnholz, Arndt; Unger, Claudia; Koch, Jürgen; Suttmann, Oliver; Overmeyer, Ludger

2017-09-01

The hybrid technique of aerosol jet printing and ultraviolet (UV) laser direct writing was developed for 2D patterning of thin film UV curable polydimethylsiloxane (PDMS). A dual atomizer module in an aerosol jet printing system generated aerosol jet streams from material components of the UV curable PDMS individually and enables the mixing in a controlled ratio. Precise control of the aerosol jet printing achieved the layer thickness of UV curable PDMS as thin as 1.6 μm. This aerosol jet printing system is advantageous because of its ability to print uniform thin-film coatings of UV curable PDMS on planar surfaces as well as free-form surfaces without the use of solvents. In addition, the hybrid 2D patterning using the combination of UV laser direct writing and aerosol jet printing achieved selective photo-initiated polymerization of the UV curable PDMS layer with an X-Y resolution of 17.5 μm.

A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit.

Science.gov (United States)

Chakrabarti, B; Lastras-Montaño, M A; Adam, G; Prezioso, M; Hoskins, B; Payvand, M; Madhavan, A; Ghofrani, A; Theogarajan, L; Cheng, K-T; Strukov, D B

2017-02-14

Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore's law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + "Molecular") architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

Integration of Computed Tomography and Three-Dimensional Echocardiography for Hybrid Three-Dimensional Printing in Congenital Heart Disease.

Science.gov (United States)

Gosnell, Jordan; Pietila, Todd; Samuel, Bennett P; Kurup, Harikrishnan K N; Haw, Marcus P; Vettukattil, Joseph J

2016-12-01

Three-dimensional (3D) printing is an emerging technology aiding diagnostics, education, and interventional, and surgical planning in congenital heart disease (CHD). Three-dimensional printing has been derived from computed tomography, cardiac magnetic resonance, and 3D echocardiography. However, individually the imaging modalities may not provide adequate visualization of complex CHD. The integration of the strengths of two or more imaging modalities has the potential to enhance visualization of cardiac pathomorphology. We describe the feasibility of hybrid 3D printing from two imaging modalities in a patient with congenitally corrected transposition of the great arteries (L-TGA). Hybrid 3D printing may be useful as an additional tool for cardiologists and cardiothoracic surgeons in planning interventions in children and adults with CHD.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Hybrid quantum circuit with a superconducting qubit coupled to an electron spin ensemble

Energy Technology Data Exchange (ETDEWEB)

Kubo, Yuimaru; Grezes, Cecile; Vion, Denis; Esteve, Daniel; Bertet, Patrice [Quantronics Group, SPEC (CNRS URA 2464), CEA-Saclay, 91191 Gif-sur-Yvette (France); Diniz, Igor; Auffeves, Alexia [Institut Neel, CNRS, BP 166, 38042 Grenoble (France); Isoya, Jun-ichi [Research Center for Knowledge Communities, University of Tsukuba, 305-8550 Tsukuba (Japan); Jacques, Vincent; Dreau, Anais; Roch, Jean-Francois [LPQM (CNRS, UMR 8537), Ecole Normale Superieure de Cachan, 94235 Cachan (France)

2013-07-01

We report the experimental realization of a hybrid quantum circuit combining a superconducting qubit and an ensemble of electronic spins. The qubit, of the transmon type, is coherently coupled to the spin ensemble consisting of nitrogen-vacancy (NV) centers in a diamond crystal via a frequency-tunable superconducting resonator acting as a quantum bus. Using this circuit, we prepare arbitrary superpositions of the qubit states that we store into collective excitations of the spin ensemble and retrieve back into the qubit. We also report a new method for detecting the magnetic resonance of electronic spins at low temperature with a qubit using the hybrid quantum circuit, as well as our recent progress on spin echo experiments.

A Hybrid Circuit for Spoof Surface Plasmons and Spatial Waveguide Modes to Reach Controllable Band-Pass Filters.

Science.gov (United States)

Zhang, Qian; Zhang, Hao Chi; Wu, Han; Cui, Tie Jun

2015-11-10

We propose a hybrid circuit for spoof surface plasmon polaritons (SPPs) and spatial waveguide modes to develop new microwave devices. The hybrid circuit includes a spoof SPP waveguide made of two anti-symmetric corrugated metallic strips and a traditional substrate integrated waveguide (SIW). From dispersion relations, we show that the electromagnetic waves only can propagate through the hybrid circuit when the operating frequency is less than the cut-off frequency of the SPP waveguide and greater than the cut-off frequency of SIW, generating efficient band-pass filters. We demonstrate that the pass band is controllable in a large range by designing the geometrical parameters of SPP waveguide and SIW. Full-wave simulations are provided to show the large adjustability of filters, including ultra wideband and narrowband filters. We fabricate a sample of the new hybrid device in the microwave frequencies, and measurement results have excellent agreements to numerical simulations, demonstrating excellent filtering characteristics such as low loss, high efficiency, and good square ratio. The proposed hybrid circuit gives important potential to accelerate the development of plasmonic integrated functional devices and circuits in both microwave and terahertz frequencies.

Multi and mixed 3D-printing of graphene-hydroxyapatite hybrid materials for complex tissue engineering.

Science.gov (United States)

Jakus, Adam E; Shah, Ramille N

2017-01-01

With the emergence of three-dimensional (3D)-printing (3DP) as a vital tool in tissue engineering and medicine, there is an ever growing need to develop new biomaterials that can be 3D-printed and also emulate the compositional, structural, and functional complexities of human tissues and organs. In this work, we probe the 3D-printable biomaterials spectrum by combining two recently established functional 3D-printable particle-laden biomaterial inks: one that contains hydroxyapatite microspheres (hyperelastic bone, HB) and another that contains graphene nanoflakes (3D-graphene, 3DG). We demonstrate that not only can these distinct, osteogenic, and neurogenic inks be co-3D-printed to create complex, multimaterial constructs, but that composite inks of HB and 3DG can also be synthesized. Specifically, the printability, microstructural, mechanical, electrical, and biological properties of a hybrid material comprised of 1:1 HA:graphene by volume is investigated. The resulting HB-3DG hybrid exhibits mixed characteristics of the two distinct systems, while maintaining 3D-printability, electrical conductivity, and flexibility. In vitro assessment of HB-3DG using mesenchymal stem cells demonstrates the hybrid material supports cell viability and proliferation, as well as significantly upregulates both osteogenic and neurogenic gene expression over 14 days. This work ultimately demonstrates a significant step forward towards being able to 3D-print graded, multicompositional, and multifunctional constructs from hybrid inks for complex composite tissue engineering. © 2016 Wiley Periodicals, Inc. J Biomed Mater Res Part A: 105A: 274-283, 2017. © 2016 Wiley Periodicals, Inc.

Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.

Science.gov (United States)

Wang, Lei; Liu, Jing

2014-12-08

A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi 35 In 48.6 Sn 16 Zn 0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid-solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi 35 In 48.6 Sn 16 Zn 0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance-temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future.

Leaching of gold and silver from printed circuit board of mobile phones

OpenAIRE

Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

2015-01-01

Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

EMC and the printed circuit board design theory and layout made simple

CERN Document Server

Montrose, Mark I

1999-01-01

"This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

Science.gov (United States)

Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

2014-09-01

Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10-5Ω.cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript.

Multi-valued logic circuits using hybrid circuit consisting of three gates single-electron transistors (TG-SETs) and MOSFETs.

Science.gov (United States)

Shin, SeungJun; Yu, YunSeop; Choi, JungBum

2008-10-01

New multi-valued logic (MVL) families using the hybrid circuits consisting of three gates single-electron transistors (TG-SETs) and a metal-oxide-semiconductor field-effect transistor (MOSFET) are proposed. The use of SETs offers periodic literal characteristics due to Coulomb oscillation of SET, which allows a realization of binary logic (BL) circuits as well as multi-valued logic (MVL) circuits. The basic operations of the proposed MVL families are successfully confirmed through SPICE circuit simulation based on the physical device model of a TG-SET. The proposed MVL circuits are found to be much faster, but much larger power consumption than a previously reported MVL, and they have a trade-off between speed and power consumption. As an example to apply the newly developed MVL families, a half-adder is introduced.

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Science.gov (United States)

Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

2010-06-01

Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

OpenAIRE

De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

2007-01-01

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

Circuit QED with hybrid metamaterial transmission lines

Energy Technology Data Exchange (ETDEWEB)

Ruloff, Stefan; Taketani, Bruno; Wilhelm, Frank [Theoretical Physics, Universitaet des Saarlandes, Saarbruecken (Germany)

2016-07-01

We're working on the theory of metamaterials providing some interesting results. The negative refraction index causes an opposite orientation of the wave vector k and the Poynting vector S of the travelling waves. Hence the metamaterial has a falling dispersion relation ∂ω(k)/∂k < 0 implying that low frequencies correspond to short wavelengths. Metamaterials are simulated by left-handed transmission lines consisting of discrete arrays of series capacitors and parallel inductors to ground. Unusual physics arises when right-and left-handed transmission lines are coupled forming a hybrid metamaterial transmission line. E.g. if a qubit is placed in front of a hybrid metamaterial transmission line terminated in an open circuit, the spontaneous emission rate is weakened or unaffected depending on the transition frequency of the qubit. Some other research interests are the general analysis of metamaterial cavities and the mode structure of hybrid metamaterial cavities for QND readout of multi-qubit operators. Especially the precise answer to the question about the definition of the mode volume of a metamaterial cavity is one of our primary goals.

Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

DEFF Research Database (Denmark)

Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

2013-01-01

Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...

Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

International Nuclear Information System (INIS)

Chiu, K.-C.; Chen, C.-S.

2007-01-01

A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

Science.gov (United States)

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

Packaging Printing Today

OpenAIRE

Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

2015-01-01

Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

Applications of three-dimensional (3D) printing for microswimmers and bio-hybrid robotics.

Science.gov (United States)

Stanton, M M; Trichet-Paredes, C; Sánchez, S

2015-04-07

This article will focus on recent reports that have applied three-dimensional (3D) printing for designing millimeter to micrometer architecture for robotic motility. The utilization of 3D printing has rapidly grown in applications for medical prosthetics and scaffolds for organs and tissue, but more recently has been implemented for designing mobile robotics. With an increase in the demand for devices to perform in fragile and confined biological environments, it is crucial to develop new miniaturized, biocompatible 3D systems. Fabrication of materials at different scales with different properties makes 3D printing an ideal system for creating frameworks for small-scale robotics. 3D printing has been applied for the design of externally powered, artificial microswimmers and studying their locomotive capabilities in different fluids. Printed materials have also been incorporated with motile cells for bio-hybrid robots capable of functioning by cell contraction and swimming. These 3D devices offer new methods of robotic motility for biomedical applications requiring miniature structures. Traditional 3D printing methods, where a structure is fabricated in an additive process from a digital design, and non-traditional 3D printing methods, such as lithography and molding, will be discussed.

SPRINT - An Interactive System for Printed Circuit Board Design User’s Guide.

Science.gov (United States)

1977-06-01

effect as decreasing the time limit - your priority and turnaround time are improved. B) You have a very large circuit and an error message says...previous segment. If no path is found, a message is printed to that effect . If HIWIRE thinks the failure may have been due to too small a value of...USAF Academy, Colorado 80840 AUL/LSE-9663 Maxwell AFB, Alabama 36112 AFETR Technical Library P.O. Box 4608, MU 5650 Patrick AFB

Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

Directory of Open Access Journals (Sweden)

Lee Jacqueline Ann L.

2016-01-01

Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

Two-Phase Instability Characteristics of Printed Circuit Steam Generator for the Low Pressure Condition

International Nuclear Information System (INIS)

Kang, Han-Ok; Han, Hun Sik; Kim, Young-In; Kim, Keung Koo

2015-01-01

Reduction of installation space for steam generators can lead to much smaller reactor vessel with resultant decrease of overall manufacturing cost for the components. A PCHE(Printed Circuit Heat Exchanger) is one of the compact types of heat exchangers available as an alternative to conventional shell and tube heat exchangers. Its name is derived from the procedure used to manufacture the flat metal plates that form the core of the heat exchanger, which is done by chemical milling. These plates are then stacked and diffusion bonded, converting the plates into a solid metal block containing precisely engineered fluid flow passages. PCSG(Printed Circuit Steam Generator) is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. For the introduction of new steam generator, design requirement for the two-phase flow instability should be considered. This paper describes two-phase flow instability characteristics of PCSG for the low pressure condition. PCSG is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. Interconnecting flow path was developed to mitigate the two-phase flow instability in the cold side. The flow characteristics of two-phase flow instability at the PCSG is examined experimentally in this study

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Directory of Open Access Journals (Sweden)

Ivănuş R.C.

2010-06-01

Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Solution synthesis of telluride-based nano-barbell structures coated with PEDOT:PSS for spray-printed thermoelectric generators

Science.gov (United States)

Bae, Eun Jin; Kang, Young Hun; Jang, Kwang-Suk; Lee, Changjin; Cho, Song Yun

2016-05-01

Solution-processable telluride-based heterostructures coated with poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (Te-Bi2Te3/PEDOT:PSS) were synthesized through a solution-phase reaction at low temperatures. The water-based synthesis yielded PEDOT:PSS-coated Te-Bi2Te3 nano-barbell structures with a high Seebeck coefficient that can be stably dispersed in water. These hybrid solutions were deposited onto a substrate by the spray-printing method to prepare thermoelectric generators. The thermoelectric properties of the Te-Bi2Te3/PEDOT:PSS hybrid films were significantly enhanced by a simple acid treatment due to the increased electrical conductivity, and the power factor of those materials can be effectively tuned over a wide range depending on the acid concentration of the treatment. The power factors of the synthesized Te-Bi2Te3/PEDOT:PSS hybrids were optimized to 60.05 μW m-1 K-2 with a Seebeck coefficient of 93.63 μV K-1 and an electrical conductivity of 69.99 S cm-1. The flexible thermoelectric generator fabricated by spray-printing Te-Bi2Te3/PEDOT:PSS hybrid solutions showed an open-circuit voltage of 1.54 mV with six legs at ΔT = 10 °C. This approach presents the potential for realizing printing-processable hybrid thermoelectric materials for application in flexible thermoelectric generators.Solution-processable telluride-based heterostructures coated with poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (Te-Bi2Te3/PEDOT:PSS) were synthesized through a solution-phase reaction at low temperatures. The water-based synthesis yielded PEDOT:PSS-coated Te-Bi2Te3 nano-barbell structures with a high Seebeck coefficient that can be stably dispersed in water. These hybrid solutions were deposited onto a substrate by the spray-printing method to prepare thermoelectric generators. The thermoelectric properties of the Te-Bi2Te3/PEDOT:PSS hybrid films were significantly enhanced by a simple acid treatment due to the increased electrical conductivity, and

Ductile electroless Ni-P coating onto flexible printed circuit board

Science.gov (United States)

Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

2016-03-01

In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

Science.gov (United States)

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

Directory of Open Access Journals (Sweden)

Yefimenko A. A.

2014-12-01

Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

Directory of Open Access Journals (Sweden)

Araújo Manuel

2016-01-01

Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

International Nuclear Information System (INIS)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-01-01

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

Energy Technology Data Exchange (ETDEWEB)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

2014-11-15

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

Comparative study of electromagnetic compatibility methods in printed circuit board design tools

International Nuclear Information System (INIS)

Marinova, Galia

2002-01-01

The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

The Hybrid Integrated Circuit of the ALICE Inner Tracking System upgrade

CERN Document Server

Fiorenza, G; Pastore, C; Valentino, V

2016-01-01

The upgrade of the Inner Tracking System scheduled during the second long shutdown is an important milestone of the ALICE upgrade and it will provide a high improvement of its performances. In this contribution the smallest operator unit of the detector, the Hybrid Integrated Circuits, is presented.

Nuclear code case development of printed-circuit heat exchangers with thermal and mechanical performance testing

Energy Technology Data Exchange (ETDEWEB)

Aakre, Shaun R. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Jentz, Ian W. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Anderson, Mark H. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering

2018-03-27

The U.S. Department of Energy has agreed to fund a three-year integrated research project to close technical gaps involved with compact heat exchangers to be used in nuclear applications. This paper introduces the goals of the project, the research institutions, and industrial partners working in collaboration to develop a draft Boiler and Pressure Vessel Code Case for this technology. Heat exchanger testing, as well as non-destructive and destructive evaluation, will be performed by researchers across the country to understand the performance of compact heat exchangers. Testing will be performed using coolants and conditions proposed for Gen IV Reactor designs. Preliminary observations of the mechanical failure mechanisms of the heat exchangers using destructive and non-destructive methods is presented. Unit-cell finite element models assembled to help predict the mechanical behavior of these high-temperature components are discussed as well. Performance testing methodology is laid out in this paper along with preliminary modeling results, an introduction to x-ray and neutron inspection techniques, and results from a recent pressurization test of a printed-circuit heat exchanger. The operational and quality assurance knowledge gained from these models and validation tests will be useful to developers of supercritical CO₂ systems, which commonly employ printed-circuit heat exchangers.

Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

NARCIS (Netherlands)

Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

2008-01-01

The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

Science.gov (United States)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Swarm intelligence-based approach for optimal design of CMOS differential amplifier and comparator circuit using a hybrid salp swarm algorithm

Science.gov (United States)

Asaithambi, Sasikumar; Rajappa, Muthaiah

2018-05-01

In this paper, an automatic design method based on a swarm intelligence approach for CMOS analog integrated circuit (IC) design is presented. The hybrid meta-heuristics optimization technique, namely, the salp swarm algorithm (SSA), is applied to the optimal sizing of a CMOS differential amplifier and the comparator circuit. SSA is a nature-inspired optimization algorithm which mimics the navigating and hunting behavior of salp. The hybrid SSA is applied to optimize the circuit design parameters and to minimize the MOS transistor sizes. The proposed swarm intelligence approach was successfully implemented for an automatic design and optimization of CMOS analog ICs using Generic Process Design Kit (GPDK) 180 nm technology. The circuit design parameters and design specifications are validated through a simulation program for integrated circuit emphasis simulator. To investigate the efficiency of the proposed approach, comparisons have been carried out with other simulation-based circuit design methods. The performances of hybrid SSA based CMOS analog IC designs are better than the previously reported studies.

A laser printing based approach for printed electronics

Energy Technology Data Exchange (ETDEWEB)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

2016-03-07

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

A laser printing based approach for printed electronics

International Nuclear Information System (INIS)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

2016-01-01

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

Printed photodetectors

International Nuclear Information System (INIS)

Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

2015-01-01

Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems. (paper)

Printed photodetectors

Science.gov (United States)

Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

2015-10-01

Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems.

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

Science.gov (United States)

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

3-D printed 2.4 GHz rectifying antenna for wireless power transfer applications

Science.gov (United States)

Skinner, Matthew

In this work, a 3D printed rectifying antenna that operates at the 2.4GHz WiFi band was designed and manufactured. The printed material did not have the same properties of bulk material, so the printed materials needed to be characterized. The antenna and rectifying circuit was printed out of Acrylonitrile Butadiene Styrene (ABS) filament and a conductive silver paste, with electrical components integrated into the circuit. Before printing the full rectifying antenna, each component was printed and evaluated. The printed antenna operated at the desired frequency with a return loss of -16 dBm with a bandwidth of 70MHz. The radiation pattern was measured in an anechoic chamber with good matching to the model. The rectifying circuit was designed in Ansys Circuit Simulation using Schottky diodes to enable the circuit to operate at lower input power levels. Two rectifying circuits were manufactured, one by printing the conductive traces with silver ink, and one with traces made from copper. The printed silver ink is less conductive than the bulk copper and therefore the output voltage of the printed rectifier was lower than the copper circuit. The copper circuit had an efficiency of 60% at 0dBm and the printed silver circuit had an efficiency of 28.6% at 0dBm. The antenna and rectifying circuits were then connected to each other and the performance was compared to a fully printed integrated rectifying antenna. The rectifying antennas were placed in front of a horn antenna while changing the power levels at the antenna. The efficiency of the whole system was lower than the individual components but an efficiency of 11% at 10dBm was measured.

Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

Directory of Open Access Journals (Sweden)

Vučinić Aleksandra S.

2017-01-01

Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

Science.gov (United States)

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

Energy Technology Data Exchange (ETDEWEB)

Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

2013-04-10

Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

Hybrid planar lightwave circuits for defense and aerospace applications

Science.gov (United States)

Zhang, Hua; Bidnyk, Serge; Yang, Shiquan; Balakrishnan, Ashok; Pearson, Matt; O'Keefe, Sean

2010-04-01

We present innovations in Planar Lightwave Circuits (PLCs) that make them ideally suited for use in advanced defense and aerospace applications. We discuss PLCs that contain no micro-optic components, no moving parts, pose no spark or fire hazard, are extremely small and lightweight, and are capable of transporting and processing a range of optical signals with exceptionally high performance. This PLC platform is designed for on-chip integration of active components such as lasers and detectors, along with transimpedance amplifiers and other electronics. These active components are hybridly integrated with our silica-on-silicon PLCs using fully-automated robotics and image recognition technology. This PLC approach has been successfully applied to the design and fabrication of multi-channel transceivers for aerospace applications. The chips contain hybrid DFB lasers and high-efficiency detectors, each capable of running over 10 Gb/s, with mixed digital and analog traffic multiplexed to a single optical fiber. This highlyintegrated functionality is combined onto a silicon chip smaller than 4 x 10 mm, weighing failures after extreme temperature cycling through a range of > 125 degC, and more than 2,000 hours operating at 95 degC ambient air temperature. We believe that these recent advancements in planar lightwave circuits are poised to revolutionize optical communications and interconnects in the aerospace and defense industries.

SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

Directory of Open Access Journals (Sweden)

Maciej Thomas

2014-10-01

Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

Methods for fabrication of flexible hybrid electronics

Science.gov (United States)

Street, Robert A.; Mei, Ping; Krusor, Brent; Ready, Steve E.; Zhang, Yong; Schwartz, David E.; Pierre, Adrien; Doris, Sean E.; Russo, Beverly; Kor, Siv; Veres, Janos

2017-08-01

Printed and flexible hybrid electronics is an emerging technology with potential applications in smart labels, wearable electronics, soft robotics, and prosthetics. Printed solution-based materials are compatible with plastic film substrates that are flexible, soft, and stretchable, thus enabling conformal integration with non-planar objects. In addition, manufacturing by printing is scalable to large areas and is amenable to low-cost sheet-fed and roll-to-roll processes. FHE includes display and sensory components to interface with users and environments. On the system level, devices also require electronic circuits for power, memory, signal conditioning, and communications. Those electronic components can be integrated onto a flexible substrate by either assembly or printing. PARC has developed systems and processes for realizing both approaches. This talk presents fabrication methods with an emphasis on techniques recently developed for the assembly of off-the-shelf chips. A few examples of systems fabricated with this approach are also described.

Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect

Energy Technology Data Exchange (ETDEWEB)

Li Shu; Zhang Tong [Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States)], E-mail: lis4@rpi.edu, E-mail: tzhang@ecse.rpi.edu

2008-05-07

Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect.

Science.gov (United States)

Li, Shu; Zhang, Tong

2008-05-07

Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect

International Nuclear Information System (INIS)

Li Shu; Zhang Tong

2008-01-01

Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance

Rapid Three-Dimensional Printing in Water Using Semiconductor-Metal Hybrid Nanoparticles as Photoinitiators.

Science.gov (United States)

Pawar, Amol Ashok; Halivni, Shira; Waiskopf, Nir; Ben-Shahar, Yuval; Soreni-Harari, Michal; Bergbreiter, Sarah; Banin, Uri; Magdassi, Shlomo

2017-07-12

Additive manufacturing processes enable fabrication of complex and functional three-dimensional (3D) objects ranging from engine parts to artificial organs. Photopolymerization, which is the most versatile technology enabling such processes through 3D printing, utilizes photoinitiators that break into radicals upon light absorption. We report on a new family of photoinitiators for 3D printing based on hybrid semiconductor-metal nanoparticles. Unlike conventional photoinitiators that are consumed upon irradiation, these particles form radicals through a photocatalytic process. Light absorption by the semiconductor nanorod is followed by charge separation and electron transfer to the metal tip, enabling redox reactions to form radicals in aerobic conditions. In particular, we demonstrate their use in 3D printing in water, where they simultaneously form hydroxyl radicals for the polymerization and consume dissolved oxygen that is a known inhibitor. We also demonstrate their potential for two-photon polymerization due to their giant two-photon absorption cross section.

A 24 GHz CMOS oscillator transmitter with an inkjet printed on-chip antenna

KAUST Repository

Ghaffar, Farhan A.

2016-08-15

CMOS based RF circuits have demonstrated efficient performance over the decades. However, one bottle neck with this technology is its lossy nature for passive components such as inductors, antennas etc. Due to this drawback, passives are either implemented off chip or the designers work with the inefficient passives. This problem can be alleviated by using inkjet printing as a post process on CMOS chip. In this work, we demonstrate inkjet printing of a patterned polymer (SU8) layer on a 24 GHz oscillator chip to isolate the lossy Si substrate from the passives which are inkjet printed on top of the SU8 layer. As a proof of concept, a monopole antenna is printed on top of the SU8 layer integrating it with the oscillator through the exposed RF pads to realize an oscillator transmitter. The proposed hybrid fabrication technique can be extended to multiple dielectric and conductive printed layers to demonstrate complete RF systems on CMOS chips which are efficient, cost-effective and above all small in size. © 2016 IEEE.

Delay-area trade-off for MPRM circuits based on hybrid discrete particle swarm optimization

International Nuclear Information System (INIS)

Jiang Zhidi; Wang Zhenhai; Wang Pengjun

2013-01-01

Polarity optimization for mixed polarity Reed—Muller (MPRM) circuits is a combinatorial issue. Based on the study on discrete particle swarm optimization (DPSO) and mixed polarity, the corresponding relation between particle and mixed polarity is established, and the delay-area trade-off of large-scale MPRM circuits is proposed. Firstly, mutation operation and elitist strategy in genetic algorithm are incorporated into DPSO to further develop a hybrid DPSO (HDPSO). Then the best polarity for delay and area trade-off is searched for large-scale MPRM circuits by combining the HDPSO and a delay estimation model. Finally, the proposed algorithm is testified by MCNC Benchmarks. Experimental results show that HDPSO achieves a better convergence than DPSO in terms of search capability for large-scale MPRM circuits. (semiconductor integrated circuits)

Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit.

Science.gov (United States)

Guan, Binbin; Scott, Ryan P; Qin, Chuan; Fontaine, Nicolas K; Su, Tiehui; Ferrari, Carlo; Cappuzzo, Mark; Klemens, Fred; Keller, Bob; Earnshaw, Mark; Yoo, S J B

2014-01-13

We demonstrate free-space space-division-multiplexing (SDM) with 15 orbital angular momentum (OAM) states using a three-dimensional (3D) photonic integrated circuit (PIC). The hybrid device consists of a silica planar lightwave circuit (PLC) coupled to a 3D waveguide circuit to multiplex/demultiplex OAM states. The low excess loss hybrid device is used in individual and two simultaneous OAM states multiplexing and demultiplexing link experiments with a 20 Gb/s, 1.67 b/s/Hz quadrature phase shift keyed (QPSK) signal, which shows error-free performance for 379,960 tested bits for all OAM states.

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

Recovery of high purity precious metals from printed circuit boards

International Nuclear Information System (INIS)

Park, Young Jun; Fray, Derek J.

2009-01-01

Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

Scalable printed electronics: an organic decoder addressing ferroelectric non-volatile memory

Science.gov (United States)

Ng, Tse Nga; Schwartz, David E.; Lavery, Leah L.; Whiting, Gregory L.; Russo, Beverly; Krusor, Brent; Veres, Janos; Bröms, Per; Herlogsson, Lars; Alam, Naveed; Hagel, Olle; Nilsson, Jakob; Karlsson, Christer

2012-01-01

Scalable circuits of organic logic and memory are realized using all-additive printing processes. A 3-bit organic complementary decoder is fabricated and used to read and write non-volatile, rewritable ferroelectric memory. The decoder-memory array is patterned by inkjet and gravure printing on flexible plastics. Simulation models for the organic transistors are developed, enabling circuit designs tolerant of the variations in printed devices. We explain the key design rules in fabrication of complex printed circuits and elucidate the performance requirements of materials and devices for reliable organic digital logic. PMID:22900143

Fully Printed Flexible and Stretchable Electronics

Science.gov (United States)

Zhang, Suoming

Through this thesis proposal, the author has demonstrated series of flexible or stretchable sensors including strain gauge, pressure sensors, display arrays, thin film transistors and photodetectors fabricated by a direct printing process. By adopting the novel serpentine configuration with conventional non-stretchable materials silver nanoparticles, the fully printed stretchable devices are successfully fabricated on elastomeric substrate with the demonstration of stretchable conductors that can maintain the electrical properties under strain and the strain gauge, which could be used to measure the strain in desired locations and also to monitor individual person's finger motion. And by investigating the intrinsic stretchable materials silver nanowires (AgNWs) with the conventional configuration, the fully printed stretchable conductors are achieved on various substrates including Si, glass, Polyimide, Polydimethylsiloxane (PDMS) and Very High Bond (VHB) tape with the illustration of the capacitive pressure sensor and stretchable electroluminescent displays. In addition, intrinsically stretchable thin-film transistors (TFTs) and integrated logic circuits are directly printed on elastomeric PDMS substrates. The printed devices utilize carbon nanotubes and a type of hybrid gate dielectric comprising PDMS and barium titanate (BaTiO3) nanoparticles. The BaTiO3/PDMS composite simultaneously provides high dielectric constant, superior stretchability, low leakage, as well as good printability and compatibility with the elastomeric substrate. Both TFTs and logic circuits can be stretched beyond 50% strain along either channel length or channel width directions for thousands of cycles while showing no significant degradation in electrical performance. Finally, by applying the SWNTs as the channel layer of the thin film transistor, we successfully fabricate the fully printed flexible photodetector which exhibits good electrical characteristics and the transistors exhibit

A hybrid analytical model for open-circuit field calculation of multilayer interior permanent magnet machines

Energy Technology Data Exchange (ETDEWEB)

Zhang, Zhen [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China); Xia, Changliang [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China); Tianjin Engineering Center of Electric Machine System Design and Control, Tianjin 300387 (China); Yan, Yan, E-mail: yanyan@tju.edu.cn [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China); Geng, Qiang [Tianjin Engineering Center of Electric Machine System Design and Control, Tianjin 300387 (China); Shi, Tingna [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China)

2017-08-01

Highlights: • A hybrid analytical model is developed for field calculation of multilayer IPM machines. • The rotor magnetic field is calculated by the magnetic equivalent circuit method. • The field in the stator and air-gap is calculated by subdomain technique. • The magnetic scalar potential on rotor surface is modeled as trapezoidal distribution. - Abstract: Due to the complicated rotor structure and nonlinear saturation of rotor bridges, it is difficult to build a fast and accurate analytical field calculation model for multilayer interior permanent magnet (IPM) machines. In this paper, a hybrid analytical model suitable for the open-circuit field calculation of multilayer IPM machines is proposed by coupling the magnetic equivalent circuit (MEC) method and the subdomain technique. In the proposed analytical model, the rotor magnetic field is calculated by the MEC method based on the Kirchhoff’s law, while the field in the stator slot, slot opening and air-gap is calculated by subdomain technique based on the Maxwell’s equation. To solve the whole field distribution of the multilayer IPM machines, the coupled boundary conditions on the rotor surface are deduced for the coupling of the rotor MEC and the analytical field distribution of the stator slot, slot opening and air-gap. The hybrid analytical model can be used to calculate the open-circuit air-gap field distribution, back electromotive force (EMF) and cogging torque of multilayer IPM machines. Compared with finite element analysis (FEA), it has the advantages of faster modeling, less computation source occupying and shorter time consuming, and meanwhile achieves the approximate accuracy. The analytical model is helpful and applicable for the open-circuit field calculation of multilayer IPM machines with any size and pole/slot number combination.

Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

Directory of Open Access Journals (Sweden)

Rajeswari Packianathan

2015-01-01

Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

Evaluation of gold and silver leaching from printed circuit board of cellphones

Energy Technology Data Exchange (ETDEWEB)

Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

2014-02-15

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

Evaluation of gold and silver leaching from printed circuit board of cellphones

International Nuclear Information System (INIS)

Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

2014-01-01

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

Introduction to printed electronics

CERN Document Server

Suganuma, Katsuaki

2014-01-01

This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

Science.gov (United States)

Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

2017-06-01

Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger

International Nuclear Information System (INIS)

Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

2016-01-01

Highlights: • Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger have been obtained. • Comparisons of experimental data and available correlations have been performed. • New Fanning friction factor and heat transfer correlations for the test PCHE are developed. - Abstract: Printed circuit heat exchanger (PCHE) is one of the leading intermediate heat exchanger (IHX) candidates to be employed in the very-high-temperature gas-cooled reactors (VHTRs) due to its capability for high-temperature, high-pressure applications. In the current study, a reduced-scale zigzag-channel PCHE was fabricated using Alloy 617 plates for the heat exchanger core and Alloy 800H pipes for the headers. The pressure drop and heat transfer characteristics of the PCHE were investigated experimentally in a high-temperature helium test facility (HTHF) at The Ohio State University. The PCHE helium inlet temperatures and pressures were varied up to 464 °C/2.7 MPa for the cold side and 802 °C/2.7 MPa for the hot side, respectively, while the maximum helium mass flow rates on both sides of the PCHE reached 39 kg/h. The corresponding maximum channel Reynolds number was approximately 3558, covering the laminar flow and laminar-to-turbulent flow transition regimes. New pressure drop and heat transfer correlations for the current zigzag channels with rounded bends were developed based on the experimental data. Comparisons between the experimental data and the results obtained from the available PCHE and straight circular pipe correlations were conducted. Compared to the heat transfer performance in straight circular pipes, the zigzag channels provided little advantage in the laminar flow regime but significant advantage near the transition flow regime.

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

Hybrid microcircuits for nuclear instrumentation

International Nuclear Information System (INIS)

Kulkarni, R.G.

2005-01-01

Hybrid microcircuits (HMCs) have distinct advantages over their rival products like printed circuit boards (PCBs) and integrated circuits (ICs), and are able to survive the onslaught of Moore's law, by retaining the niche market for themselves. The ASIC development cost is normally huge and when the volumes are small (less than ten thousand or so), the prohibitively high unit cost deters the potential customers. However the HMCs can be developed at a small fraction of an ASIC development cost and thus they are attractive when the volumes are small, as in the case of professional electronics industries like defense, broadcast, or instrumentation industries. The hybrid microcircuit (HMC) technology can involve one of the two processes: thick-film and thin- film. Broadly the thick-film process consists of printing and firing of, conductor and resistor pastes, on an Alumina substrate. The thin-film process consists of photo lithographic etching of, conductor and resistor patterns, on a metal/resistor sputtered high purity Alumina substrate. The active devices, either in die-form or in surface-mount form, are attached to the thick-film or the thin-film substrate. The passive devices like chip inductors and chip capacitors are also attached to the substrate. This paper discusses in detail the thick-film and the thin-film processes and their relative merits and demerits. The associated qualification and screening procedures followed to provide reliable HMCs to the customer are described. The existing HMC facilities and the product range available in Bharat Electronics including the HMCs developed for nuclear instrumentation are presented. (author)

Whole body perfusion for hybrid aortic arch repair: evolution of selective regional perfusion with a modified extracorporeal circuit.

Science.gov (United States)

Fernandes, Philip; Walsh, Graham; Walsh, Stephanie; O'Neil, Michael; Gelinas, Jill; Chu, Michael W A

2017-04-01

Patients undergoing hybrid aortic arch reconstruction require careful protection of vital organs. We believe that whole body perfusion with tailored dual circuitry may help to achieve optimal patient outcomes. Our circuit has evolved from a secondary circuit utilizing a cardioplegia delivery device for lower body perfusion to a dual-oxygenator circuit. This allows individually controlled regional perfusion with ease of switching from secondary to primary circuit for total body flow. The re-design allows for separate flow and temperature regulation with two oxygenators in parallel. All patients underwent a single-stage operation for simultaneous treatment of arch and descending aortic pathology via a sternotomy, using a hybrid frozen elephant trunk technique. We report six consecutive patients undergoing hybrid arch and frozen elephant trunk reconstruction using a dual-oxygenator circuit. Five patients underwent elective surgery and one was emergent. One patient had an acute dissection while three underwent concomitant procedures, including a Ross procedure and two valve-sparing root reconstructions. Three cases were redo sternotomies. The mean pump time was 358 ± 131 min, the aortic cross clamp time 243 ± 135 min, the cardioplegia volume of 33,208 ml ± 16,173, cerebral ischemia 0 min, lower body ischemia 76 ± 34 min and the average lower body perfusion time was 142 min. Two patients did not require any donor blood products. The median intensive care unit (ICU) and hospital lengths of stay (LOS) were two days and 10 days, respectively. The average peak serum lactate on CPB was 7.47 mmol/L and, at admission to the ICU, it was 3.37 mmol/L. Renal and respiratory failure developed in the salvage acute type A dissection patient. No other complications occurred in this series. Whole body perfusion as delivered through individually controlled dual-oxygenator circuitry allows maximum flexibility for hybrid aortic arch reconstruction. A modified circuit perfusion

Modular bioink for 3D printing of biocompatible hydrogels : sol-gel polymerization of hybrid peptides and polymers

NARCIS (Netherlands)

Echalier, C.; Levato, R.; Mateos-Timoneda, Miguel A; Castaño, O.; Déjean, S.; Garric, X.; Pinese, C.; Noël, D.; Engel, E.; Martinez, J.; Mehdi, A.; Subra, G.

2017-01-01

An unprecedented generic system allowing the 3D printing of peptide-functionalized hydrogels by soft sol-gel inorganic polymerization is presented. Hybrid silylated inorganic/bioorganic blocks are mixed in biological buffer in an appropriate ratio, to yield a multicomponent bioink that can be

A wearable tracking device inkjet-printed on textile

KAUST Repository

Krykpayev, Bauyrzhan

2017-05-20

Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based implementations. An attractive option would be direct printing of circuit layout on the textile itself, negating the use of rigid PCB materials. However, high surface roughness and porosity of textiles prevents efficient and reliable printing of electronics on textile. In this work, by printing an interface layer on the textile first, a complete localization circuit integrated with an antenna has been inkjet-printed on the textile for the first time. Printed conductive traces were optimized in terms of conductivity and resolution by controlling the number of over-printed layers. The tracking device determines the wearer\\'s position using WiFi and this information can be displayed on any internet-enabled device, such as smart phone. The device is compact (55mm×45mm) and lightweight (22g with 500mAh battery) for people to comfortably wear it and can be easily concealed in case discretion is required. The device operates at 2.4GHz communicated up to a distance of 55m, with localization accuracy of up to 8m.

The circuit designer's companion

CERN Document Server

Williams, Tim

1991-01-01

The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

Science.gov (United States)

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

Thermo-hydraulic Analysis of a Water-cooled Printed Circuit Heat Exchanger in a Small-scale Nitrogen Loop

International Nuclear Information System (INIS)

Kim, Chan Soo; Hong, Sung Deok; Kim, Min Hwan; Shim, Jaesool; Lee, Gyung Dong

2013-01-01

The development of high-temperature heat exchangers is very important because of its higher operation temperature and pressure than those of common light water reactors and industrial process plants. In particular, the intermediate heat exchanger is a key-challenged high temperature component in a Very High Temperature gas-cooled Reactor (VHTR). A printed circuit heat exchanger is one of the candidates for an intermediate heat exchanger in a VHTR. The printed circuit heat exchanger (PCHE) was developed and commercialized by HEATRIC. The compactness is better than any other heat exchanger types, because its core matrices are fabricated by diffusion bonding with photo-chemically etched micro-channels. Various tests and analysis have been performed to verify the performance of PCHE. The thermal stress analysis of the high temperature PCHE is necessary to endure the extremely operation condition of IHX. In this study, the thermo-hydraulic analysis for the laboratory-scale PCHE is performed to provide the input data for the boundary conditions of a structural analysis. The results from the first-principal calculation are compared with those from computational fluid dynamics code analysis. COMSOL 4.3a analysis is successfully performed at the uniform pressure drop condition in a set of flow channel stacks. The heat-exchanged region concentrated to the nitrogen inlet cause the uniform mass velocity distribution in the channels, therefore there is little difference between two analytical results

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

Energy Technology Data Exchange (ETDEWEB)

Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

2014-01-15

Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

A hybrid analytical model for open-circuit field calculation of multilayer interior permanent magnet machines

Science.gov (United States)

Zhang, Zhen; Xia, Changliang; Yan, Yan; Geng, Qiang; Shi, Tingna

2017-08-01

Due to the complicated rotor structure and nonlinear saturation of rotor bridges, it is difficult to build a fast and accurate analytical field calculation model for multilayer interior permanent magnet (IPM) machines. In this paper, a hybrid analytical model suitable for the open-circuit field calculation of multilayer IPM machines is proposed by coupling the magnetic equivalent circuit (MEC) method and the subdomain technique. In the proposed analytical model, the rotor magnetic field is calculated by the MEC method based on the Kirchhoff's law, while the field in the stator slot, slot opening and air-gap is calculated by subdomain technique based on the Maxwell's equation. To solve the whole field distribution of the multilayer IPM machines, the coupled boundary conditions on the rotor surface are deduced for the coupling of the rotor MEC and the analytical field distribution of the stator slot, slot opening and air-gap. The hybrid analytical model can be used to calculate the open-circuit air-gap field distribution, back electromotive force (EMF) and cogging torque of multilayer IPM machines. Compared with finite element analysis (FEA), it has the advantages of faster modeling, less computation source occupying and shorter time consuming, and meanwhile achieves the approximate accuracy. The analytical model is helpful and applicable for the open-circuit field calculation of multilayer IPM machines with any size and pole/slot number combination.

A microelectromechanical accelerometer fabricated using printed circuit processing techniques

Science.gov (United States)

Rogers, J. E.; Ramadoss, R.; Ozmun, P. M.; Dean, R. N.

2008-01-01

A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52.

A microelectromechanical accelerometer fabricated using printed circuit processing techniques

International Nuclear Information System (INIS)

Rogers, J E; Ramadoss, R; Ozmun, P M; Dean, R N

2008-01-01

A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52

A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

International Nuclear Information System (INIS)

Broadbent, H A; Ketterl, T P; Reid, C S

2010-01-01

The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

3D printing of hybrid biomaterials for bone tissue engineering: Calcium-polyphosphate microparticles encapsulated by polycaprolactone.

Science.gov (United States)

Neufurth, Meik; Wang, Xiaohong; Wang, Shunfeng; Steffen, Renate; Ackermann, Maximilian; Haep, Natalie D; Schröder, Heinz C; Müller, Werner E G

2017-12-01

Here we describe the formulation of a morphogenetically active bio-ink consisting of amorphous microparticles (MP) prepared from Ca 2+ and the physiological inorganic polymer, polyphosphate (polyP). Those MP had been fortified by mixing with poly-ε-caprolactone (PCL) to allow 3D-bioprinting. The resulting granular PCL/Ca-polyP-MP hybrid material, liquefied by short-time heating to 100 °C, was used for the 3D-printing of tissue-like scaffolds formed by strands with a thickness of 400 µm and a stacked architecture leaving ≈0.5 mm 2 -sized open holes enabling cell migration. The printed composite scaffold turned out to combine suitable biomechanical properties (Young's modulus of 1.60 ± 0.1 GPa; Martens hardness of 153 ± 28 MPa), matching those of cortical and trabecular bone, with morphogenetic activity. This scaffold was capable of attracting and promoting the growth of human bone-related SaOS-2 cells as demonstrated by staining for cell viability (Calcein AM), cell density (DRAQ5) and SEM studies. Furthermore, the hybrid material was demonstrated to upregulate the steady-state-expression of the cell migration-inducing chemokine SDF-1α. EDX analysis and FTIR measurements revealed the presence of hydroxyapatite in the mineral deposits formed on the scaffold surface. Based on the results we conclude that granular PCL/Ca-polyP-MP hybrid material is suitable for the fabrication of bioprintable scaffold which comprises not only biomechanical stability but also morphogenetic potential. In present-day regenerative engineering efforts, biomaterial- and cell-based strategies are proposed that meet the required functional and spatial characteristics and variations, especially in the transition regions between soft (cartilage, tendon or ligament) and hard (bone) tissues. In a biomimetic approach we succeeded to fabricate amorphous Ca-polyP nanoparticles/microparticles which are highly biocompatible. Together with polycaprolactone (PCL), polyP can be

3D Printing of Ball Grid Arrays

Science.gov (United States)

Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

International Nuclear Information System (INIS)

Korneeva, Anna; Shaydurov, Vladimir

2016-01-01

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

Directory of Open Access Journals (Sweden)

Hellington Bastos da Silva de Sant’ana

2015-07-01

Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

Science.gov (United States)

Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

2010-01-01

A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

High-Temperature Test of 800HT Printed Circuit Heat Exchanger in HELP

International Nuclear Information System (INIS)

Kim, Chan Soo; Hong, Sung-Deok; Kim, Min Hwan; Shim, Jaesool

2014-01-01

Korea Atomic Energy Research Institute has developed high-temperature Printed Circuit Heat Exchangers (PCHE) for a Very High Temperature gas-cooled Reactor and operated a very high temperature Helium Experimental LooP (HELP) to verify the performance of the high temperature heat exchanger at the component level environment. PCHE is one of the candidates for the intermediate heat exchanger in a VHTR, because its design temperature and pressure are larger than any other compact heat exchanger types. High temperature PCHEs in HELP consist of an alloy617 PCHE and an 800HT PCHE. This study presents the high temperature test of an 800HT PCHE in HELP. The experimental data include the pressure drops, the overall heat transfer coefficients, and the surface temperature distributions under various operating conditions. The experimental data are compared with the thermo-hydraulic analysis from COMSOL. In addition, the single channel tests are performed to quantify the friction factor under normal nitrogen and helium inlet conditions. (author)

Guanidinium: A Route to Enhanced Carrier Lifetime and Open-Circuit Voltage in Hybrid Perovskite Solar Cells.

Science.gov (United States)

De Marco, Nicholas; Zhou, Huanping; Chen, Qi; Sun, Pengyu; Liu, Zonghao; Meng, Lei; Yao, En-Ping; Liu, Yongsheng; Schiffer, Andy; Yang, Yang

2016-02-10

Hybrid perovskites have shown astonishing power conversion efficiencies owed to their remarkable absorber characteristics including long carrier lifetimes, and a relatively substantial defect tolerance for solution-processed polycrystalline films. However, nonradiative charge carrier recombination at grain boundaries limits open circuit voltages and consequent performance improvements of perovskite solar cells. Here we address such recombination pathways and demonstrate a passivation effect through guanidinium-based additives to achieve extraordinarily enhanced carrier lifetimes and higher obtainable open circuit voltages. Time-resolved photoluminescence measurements yield carrier lifetimes in guanidinium-based films an order of magnitude greater than pure-methylammonium counterparts, giving rise to higher device open circuit voltages and power conversion efficiencies exceeding 17%. A reduction in defect activation energy of over 30% calculated via admittance spectroscopy and confocal fluorescence intensity mapping indicates successful passivation of recombination/trap centers at grain boundaries. We speculate that guanidinium ions serve to suppress formation of iodide vacancies and passivate under-coordinated iodine species at grain boundaries and within the bulk through their hydrogen bonding capability. These results present a simple method for suppressing nonradiative carrier loss in hybrid perovskites to further improve performances toward highly efficient solar cells.

Hybrid Binder to Mitigate Feed Powder Segregation in the Inkjet 3D Printing of Titanium Metal Parts

Directory of Open Access Journals (Sweden)

Saeed Maleksaeedi

2018-05-01

Full Text Available Using feedstock containing discrete dual or multi powders leads to segregation in the powder bed of additive manufacturing processes. In the present study, a new impregnated hybrid binder with properties closer to those of the base powder is developed to mitigate powder segregation in the inkjet 3D printing of titanium components.

Sustainability issues in circuit board recycling

DEFF Research Database (Denmark)

Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

1995-01-01

The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...

Waste printed circuit board recycling techniques and product utilization

International Nuclear Information System (INIS)

Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

2015-01-01

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

Waste printed circuit board recycling techniques and product utilization

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

2015-02-11

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

International Nuclear Information System (INIS)

Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

2014-01-01

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

Application of Cu-polyimide flex circuit and Al-on-glass pitch adapter for the ATLAS SCT barrel hybrid

CERN Document Server

Unno, Y; Ikegami, Y; Iwata, Y; Kohriki, T; Kondo, T; Nakano, I; Ohsugi, T; Takashima, R; Tanaka, R; Terada, S; Ujiie, N

2005-01-01

We applied the surface build-up Cu-polyimide flex-circuit technology with laser vias to the ATLAS SCT barrel hybrid to be made in one piece from the connector to the electronics sections including cables. The hybrids, reinforced with carbon-carbon substrates, provide mechanical strength, thermal conductivity, low-radiation length, and stability in application-specific integrated circuit (ASIC) operation. By following the design rules, we experienced little trouble in breaking the traces. The pitch adapter between the sensor and the ASICs was made of aluminum traces on glass substrate. We identified that the generation of whiskers around the wire-bonding feet was correlated with the hardness of metallized aluminum. The appropriate hardness has been achieved by keeping the temperature of the glasses as low as room temperature during the metallization. The argon plasma cleaning procedure cleaned the contamination on the gold pads of the hybrids for successful wire bonding, although it was unsuccessful in the alu...

ChemicalVia: a CERN-patented technology for use in high-density circuits

CERN Multimedia

Patrice Loïez

2003-01-01

High-density multilayer printed circuits such as those pictured here are found in miniaturized modern equipment from video cameras to mobile phones. Adjacent layers in these circuits are electrically connected by microvias, consisting of a small-diameter hole (usually 50 µm) with a thin metal-deposited surface covering their cylindrical walls to ensure local conductivity between the two layers. ChemicalVia is a new method, patented by CERN, to make microvias on high-density multilayer printed circuits using chemicals rather than complex laser, plasma or photoimaging technology. The process is compatible with all standard printed-circuit assembly lines, and has the advantages of low initial investment and reduced manufacturing costs. http://www.cern.ch/ttdatabase

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2014-09-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2015-03-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Advanced circuit simulation using Multisim workbench

CERN Document Server

Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

2012-01-01

Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

Chip-by-chip configurable interconnection using digital printing techniques

International Nuclear Information System (INIS)

Mashayekhi, Mohammad; Carrabina, Jordi; Winchester, Lee; Laurila, Mika-Matti; Mäntysalo, Matti; Ogier, Simon; Terés, Lluís

2017-01-01

Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results. (paper)

A new model for simulating microbial cyanide production and optimizing the medium parameters for recovering precious metals from waste printed circuit boards.

Science.gov (United States)

Yuan, Zhihui; Ruan, Jujun; Li, Yaying; Qiu, Rongliang

2018-04-10

Bioleaching is a green recycling technology for recovering precious metals from waste printed circuit boards (WPCBs). However, this technology requires increasing cyanide production to obtain desirable recovery efficiency. Luria-Bertani medium (LB medium, containing tryptone 10 g/L, yeast extract 5 g/L, NaCl 10 g/L) was commonly used in bioleaching of precious metal. In this study, results showed that LB medium did not produce highest yield of cyanide. Under optimal culture conditions (25 °C, pH 7.5), the maximum cyanide yield of the optimized medium (containing tryptone 6 g/L and yeast extract 5 g/L) was 1.5 times as high as that of LB medium. In addition, kinetics and relationship of cell growth and cyanide production was studied. Data of cell growth fitted logistics model well. Allometric model was demonstrated effective in describing relationship between cell growth and cyanide production. By inserting logistics equation into allometric equation, we got a novel hybrid equation containing five parameters. Kinetic data for cyanide production were well fitted to the new model. Model parameters reflected both cell growth and cyanide production process. Copyright © 2018 Elsevier B.V. All rights reserved.

Quality control considerations for the development of the front end hybrid circuits for the CMS Outer Tracker upgrade

CERN Document Server

Gadek, Tomasz; Bonnaud, Julien Yves Robert; De Clercq, Jarne Theo; Honma, Alan; Koliatos, Alexandros; Kovacs, Mark Istvan; Luetic, Jelena

2017-01-01

The upgrade of the CMS Outer Tracker for the HL-LHC requires the design of new double-sensor modules. They contain two high-density front end hybrid circuits, equipped with flip-chip ASICs, passives and mechanical structures. First prototype hybrids in a close-to-final form have been ordered from three manufacturers. To qualify these hybrids a test setup was built, which emulates future tracker temperature and humidity conditions, provides temporary interconnection, and implements testing features. The system was automated to minimize the testing time in view of the production phase. Failure modes, deliberately implemented in the produced hybrids, provided feedback on the system’s effectiveness.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

Energy Technology Data Exchange (ETDEWEB)

Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

Integration of microelectronic chips in microfluidic systems on printed circuit board

International Nuclear Information System (INIS)

Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

2012-01-01

A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

All-fiber hybrid photon-plasmon circuits: integrating nanowire plasmonics with fiber optics.

Science.gov (United States)

Li, Xiyuan; Li, Wei; Guo, Xin; Lou, Jingyi; Tong, Limin

2013-07-01

We demonstrate all-fiber hybrid photon-plasmon circuits by integrating Ag nanowires with optical fibers. Relying on near-field coupling, we realize a photon-to-plasmon conversion efficiency up to 92% in a fiber-based nanowire plasmonic probe. Around optical communication band, we assemble an all-fiber resonator and a Mach-Zehnder interferometer (MZI) with Q-factor of 6 × 10(6) and extinction ratio up to 30 dB, respectively. Using the MZI, we demonstrate fiber-compatible plasmonic sensing with high sensitivity and low optical power.

Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Mrazikova Anna

2015-06-01

Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

Hybrid Direct-Current Circuit Breaker

Science.gov (United States)

Wang, Ruxi (Inventor); Premerlani, William James (Inventor); Caiafa, Antonio (Inventor); Pan, Yan (Inventor)

2017-01-01

A circuit breaking system includes a first branch including at least one solid-state snubber; a second branch coupled in parallel to the first branch and including a superconductor and a cryogenic contactor coupled in series; and a controller operatively coupled to the at least one solid-state snubber and the cryogenic contactor and programmed to, when a fault occurs in the load circuit, activate the at least one solid-state snubber for migrating flow of the electrical current from the second branch to the first branch, and, when the fault is cleared in the load circuit, activate the cryogenic contactor for migrating the flow of the electrical current from the first branch to the second branch.

E-waste: development of recycling process and chemical characterization of circuit printed - motherboard

International Nuclear Information System (INIS)

Junior, O.L.F.; Vargas, R.A.; Andreoli, M.; Martinelli, J.R.; Seo, E.S.M.

2011-01-01

The electro-electronic industry has been regulated by the National Politic of Solid Residues Act (PNRS) and Bill no. 7.404, concerning the actions, procedures, and method to collect, recycle and promotion of environmentally acceptable final destination of residues. The present work contributes to develop recycling process of printed circuit used in microcomputers and in its chemical characterization. The experimental procedure consisted of grinding, classification, magnetic and electrostatic separation, and separation based on density difference, followed by chemical characterization of the metallic and non metallic materials in the motherboard. It was determined that the amounts of Ag, Al, Ba, Cl, Cr, Cu, Fe, Mn, Pb, and Zn in the residue are above the toxicity allowable levels, and they are in the samples of the decanted material. Among the samples of the floating material, Al, Ba, Br, Ca, Cu, Fe, Pb (in less quantity), Si (in more quantity), and Sn, Ti and Zn were detected. Those materials can be useful in the preparation of red ceramics. (author)

Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

Directory of Open Access Journals (Sweden)

Alafara A. Baba

2014-07-01

Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

Directory of Open Access Journals (Sweden)

Ronal D. Montoya-Montoya

2013-11-01

Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

Type I Collagen and Strontium-Containing Mesoporous Glass Particles as Hybrid Material for 3D Printing of Bone-Like Materials.

Science.gov (United States)

Montalbano, Giorgia; Fiorilli, Sonia; Caneschi, Andrea; Vitale-Brovarone, Chiara

2018-04-28

Bone tissue engineering offers an alternative promising solution to treat a large number of bone injuries with special focus on pathological conditions, such as osteoporosis. In this scenario, the bone tissue regeneration may be promoted using bioactive and biomimetic materials able to direct cell response, while the desired scaffold architecture can be tailored by means of 3D printing technologies. In this context, our study aimed to develop a hybrid bioactive material suitable for 3D printing of scaffolds mimicking the natural composition and structure of healthy bone. Type I collagen and strontium-containing mesoporous bioactive glasses were combined to obtain suspensions able to perform a sol-gel transition under physiological conditions. Field emission scanning electron microscopy (FESEM) analyses confirmed the formation of fibrous nanostructures homogeneously embedding inorganic particles, whereas bioactivity studies demonstrated the large calcium phosphate deposition. The high-water content promoted the strontium ion release from the embedded glass particles, potentially enhancing the osteogenic behaviour of the composite. Furthermore, the suspension printability was assessed by means of rheological studies and preliminary extrusion tests, showing shear thinning and fast material recovery upon deposition. In conclusion, the reported results suggest that promising hybrid systems suitable for 3D printing of bioactive scaffolds for bone tissue engineering have been developed.

Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

International Nuclear Information System (INIS)

Sridhar, A.; Dijk, D.J. van; Akkerman, R.

2009-01-01

Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two variants of this substrate material, viz. etched and unetched, to determine the influence of substrate surface topography on adhesion and accuracy of the printed tracks. The pull-off adhesion test method was used to quantify adhesive strength. The dependence of the pull-off test results on local geometry of the test area are illustrated with the aid of scanning electron microscope images and interferometer studies. Based on the outcomes of the experiments, conclusions concerning the suitable surface topography for inkjet printing have been arrived at.

Uniformity of fully gravure printed organic field-effect transistors

International Nuclear Information System (INIS)

Hambsch, M.; Reuter, K.; Stanel, M.; Schmidt, G.; Kempa, H.; Fuegmann, U.; Hahn, U.; Huebler, A.C.

2010-01-01

Fully mass-printed organic field-effect transistors were made completely by means of gravure printing. Therefore a special printing layout was developed in order to avoid register problems in print direction. Upon using this layout, contact pads for source-drain electrodes of the transistors are printed together with the gate electrodes in one and the same printing run. More than 50,000 transistors have been produced and by random tests a yield of approximately 75% has been determined. The principle suitability of the gravure printed transistors for integrated circuits has been shown by the realization of ring oscillators.

Organic-inorganic hybrid material SUNCONNECT® for photonic integrated circuit

Science.gov (United States)

Nawata, Hideyuki; Oshima, Juro; Kashino, Tsubasa

2018-02-01

In this paper, we report the feature and properties about organic-inorganic hybrid material, "SUNCONNECT®" for photonic integrated circuit. "SUNCONNECT®" materials have low propagation loss at 1310nm (0.29dB/cm) and 1550nm (0.45dB/cm) respectively. In addition, the material has high thermal resistance both high temperature annealing test at 300°C and also 260°C solder heat resistance test. For actual device application, high reliability is required. 85°C /85% test was examined by using multi-mode waveguide. As a result, it indicated that variation of insertion loss property was not changed significantly after high temperature / high humidity test. For the application to photonic integrated circuit, it was demonstrated to fabricate polymer optical waveguide by using three different methods. Single-micron core pattern can be fabricated on cladding layer by using UV lithography with proximity gap exposure. Also, single-mode waveguide can be also fabricated with over cladding. On the other hands, "Mosquito method" and imprint method can be applied to fabricate polymer optical waveguide. Remarkably, these two methods can fabricate gradedindex type optical waveguide without using photo mask. In order to evaluate the optical performance, NFP's observation, measurement of insertion loss and propagation loss by cut-back methods were carried out by using each waveguide sample.

Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

Science.gov (United States)

Schleunitz, A.; Klein, J. J.; Krupp, A.; Stender, B.; Houbertz, R.; Gruetzner, G.

2017-02-01

The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

A novel hybrid biometric electronic voting system: integrating finger print face recognition

International Nuclear Information System (INIS)

Najam, S.S.; Shaikh, A.Z.; Naqvi, S.

2018-01-01

A novel hybrid design based electronic voting system is proposed, implemented and analyzed. The proposed system uses two voter verification techniques to give better results in comparison to single identification based systems. Finger print and facial recognition based methods are used for voter identification. Cross verification of a voter during an election process provides better accuracy than single parameter identification method. The facial recognition system uses Viola-Jones algorithm along with rectangular Haar feature selection method for detection and extraction of features to develop a biometric template and for feature extraction during the voting process. Cascaded machine learning based classifiers are used for comparing the features for identity verification using GPCA (Generalized Principle Component Analysis) and K-NN (K-Nearest Neighbor). It is accomplished through comparing the Eigen-vectors of the extracted features with the biometric template pre-stored in the election regulatory body database. The results of the proposed system show that the proposed cascaded design based system performs better than the systems using other classifiers or separate schemes i.e. facial or finger print based schemes. The proposed system will be highly useful for real time applications due to the reason that it has 91% accuracy under nominal light in terms of facial recognition. (author)

Advances in Current Rating Techniques for Flexible Printed Circuits

Science.gov (United States)

Hayes, Ron

2014-01-01

Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

Unit: Electric Circuits, Inspection Pack, National Trial Print.

Science.gov (United States)

Australian Science Education Project, Toorak, Victoria.

As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

Numerical Investigation on the Flow and Heat Transfer Characteristics of Supercritical Liquefied Natural Gas in an Airfoil Fin Printed Circuit Heat Exchanger

OpenAIRE

Zhongchao Zhao; Kai Zhao; Dandan Jia; Pengpeng Jiang; Rendong Shen

2017-01-01

As a new kind of highly compact and efficient micro-channel heat exchanger, the printed circuit heat exchanger (PCHE) is a promising candidate satisfying the heat exchange requirements of liquefied natural gas (LNG) vaporization at low and high pressure. The effects of airfoil fin arrangement on heat transfer and flow resistance were numerically investigated using supercritical liquefied natural gas (LNG) as working fluid. The thermal properties of supercritical LNG were tested by utilizing t...

Nanosilver conductive lines made by spray coating and aerosol jet printing technique

Science.gov (United States)

Krzeminski, Jakub; Wroblewski, Grzegorz; Dybowska-Sarapuk, Lucja; Lepak, Sandra; Jakubowska, Malgorzata

2017-08-01

Printing electronics even though the printing techniques are known for a long time, are gaining in importance. The possibility of making the electronic circuits on flexible, big-area substrates with efficient and cheap technology make it attractive for the electronic industry. Spray coating, as a one of printing methods, additionally provide the chance to print on the non-flat, complicated shaped substrates. Despite the spray coating is mostly used to print a big pads, it is reachable to spray the separate conductive lines both as a quickly-produced prototype and as a fully manufactured circuit. Our work presents the directly printed lines with spray coating technique. For the printing process self-made ink was used. We tested three different approaches to line formation and compare them in the terms of line edge, resistivity and thickness. Line profiles provide the information about the roughness and the line size. In the end we showed the aerosol jet printed meander to give an overview of this similar to spray coating but more sophisticated technique.

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

Science.gov (United States)

Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

2012-06-01

The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers

Directory of Open Access Journals (Sweden)

Jang-Won Seo

2015-05-01

Full Text Available Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE, which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%‒15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

Directory of Open Access Journals (Sweden)

Xuelin Wang

2016-11-01

Full Text Available This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc. to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good product—all of which are challenges faced by current liquid metal flexible printed electronics—are discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.

One-step inkjet printing of tungsten oxide-poly(3,4-ethylenedioxythiophene):polystyrene sulphonate hybrid film and its applications in electrochromic devices

Energy Technology Data Exchange (ETDEWEB)

Nguyen, Thi-Thuy-Nga, E-mail: thuysnga@gmail.com; Chan, Chih-Yu; He, Ju-Liang

2016-03-31

Hybrid film comprised tungsten oxide and poly (3,4-ethylenedioxythiophene):polystyrene sulphonate (WO{sub 3}–PEDOT:PSS) was developed by applying one-step inkjet printing from an office inkjet printer. The WO{sub 3} nanoparticles were synthesized from commercial crystalline WO{sub 3} powder through a wet ball-milling process, which is a simple, environmentally friendly, and cost-effective method of using water as a green solvent and low-energy milling. The WO{sub 3}–PEDOT:PSS inkjet ink was prepared by dispersing the as-milled WO{sub 3} and PEDOT:PSS in n-propanol and deionized water. The inkjet-printed WO{sub 3}–PEDOT:PSS thin films show marked improvements of cathodic electrochromism over WO{sub 3} films: the transmittance change of 20% at 550 nm (visible region) and 35% at 900 nm (infrared region) along with the response time of 5.67/0.30 s in their colored/bleached state, and the electrochromic coloration efficiency of 27.86 cm{sup 2}/C at 550 nm and 69.64 cm{sup 2}/C at 900 nm. - Highlights: • WO{sub 3} nanoparticles were synthesized by milling commercial crystalline WO{sub 3}. • Wet ball-milling was carried out by using water as a green solvent and low energy. • WO{sub 3}–PEDOT:PSS hybrid ink was simply prepared by adding n-propanol and DI water. • WO{sub 3}–PEDOT:PSS hybrid films were inkjet-printed via an office inkjet printer. • WO{sub 3}–PEDOT:PSS films show better electrochromic performances than WO{sub 3} films.

The role of printing parameters and scaffold biopolymer properties in the efficacy of a new hybrid nano-bioprinting system

Energy Technology Data Exchange (ETDEWEB)

Buyukhatipoglu, Kivilcim; Jo, Wonjin; Sun Wei; Clyne, Alisa Morss, E-mail: asm67@drexel.ed [Mechanical Engineering and Mechanics, Drexel University, 3141 Chestnut Street, Philadelphia, PA 19104 (United States)

2009-09-15

We created a hybrid nano-bioprinting system, which combines the initial patterning capabilities of direct cell writing with the active patterning capabilities of superparamagnetic nanoparticles. Biofabrication conditions, including printing parameters and scaffold biopolymer properties, may affect cell viability, nanoparticle manipulation and patterning capabilities. Nanoparticles were printed under varied conditions either in the biopolymer or loaded inside cells. Cell viability, alginate viscosity, nanoparticle movement and printing resolution were measured. We now show that while nanoparticles decreased cell viability, nozzle size had no significant effect. High printing pressure decreased cell viability, but viability loss was not accentuated by nanoparticles. High nanoparticle concentrations increased alginate viscosity at higher alginate concentrations. Nanoparticle velocity in response to a magnetic field was a function of nanoparticle diameter and scaffold viscosity, which agreed with a mathematical model of nanoparticle movement. Finally, the nano-bioprinting system resolution and patterning precision were not affected by nanoparticles in the prepolymer solution. These data suggest that nanoparticle incorporation in solid freeform fabrication does not change biofabrication parameters unless high nanoparticle concentrations are used. Future work includes developing vascularized tissue engineering constructs using the nano-bioprinting system.

The role of printing parameters and scaffold biopolymer properties in the efficacy of a new hybrid nano-bioprinting system

International Nuclear Information System (INIS)

Buyukhatipoglu, Kivilcim; Jo, Wonjin; Sun Wei; Clyne, Alisa Morss

2009-01-01

We created a hybrid nano-bioprinting system, which combines the initial patterning capabilities of direct cell writing with the active patterning capabilities of superparamagnetic nanoparticles. Biofabrication conditions, including printing parameters and scaffold biopolymer properties, may affect cell viability, nanoparticle manipulation and patterning capabilities. Nanoparticles were printed under varied conditions either in the biopolymer or loaded inside cells. Cell viability, alginate viscosity, nanoparticle movement and printing resolution were measured. We now show that while nanoparticles decreased cell viability, nozzle size had no significant effect. High printing pressure decreased cell viability, but viability loss was not accentuated by nanoparticles. High nanoparticle concentrations increased alginate viscosity at higher alginate concentrations. Nanoparticle velocity in response to a magnetic field was a function of nanoparticle diameter and scaffold viscosity, which agreed with a mathematical model of nanoparticle movement. Finally, the nano-bioprinting system resolution and patterning precision were not affected by nanoparticles in the prepolymer solution. These data suggest that nanoparticle incorporation in solid freeform fabrication does not change biofabrication parameters unless high nanoparticle concentrations are used. Future work includes developing vascularized tissue engineering constructs using the nano-bioprinting system.

Graphene-on-silicon hybrid plasmonic-photonic integrated circuits.

Science.gov (United States)

Xiao, Ting-Hui; Cheng, Zhenzhou; Goda, Keisuke

2017-06-16

Graphene surface plasmons (GSPs) have shown great potential in biochemical sensing, thermal imaging, and optoelectronics. To excite GSPs, several methods based on the near-field optical microscope and graphene nanostructures have been developed in the past few years. However, these methods suffer from their bulky setups and low GSP-excitation efficiency due to the short interaction length between free-space vertical excitation light and the atomic layer of graphene. Here we present a CMOS-compatible design of graphene-on-silicon hybrid plasmonic-photonic integrated circuits that achieve the in-plane excitation of GSP polaritons as well as localized surface plasmon (SP) resonance. By employing a suspended membrane slot waveguide, our design is able to excite GSP polaritons on a chip. Moreover, by utilizing a graphene nanoribbon array, we engineer the transmission spectrum of the waveguide by excitation of localized SP resonance. Our theoretical and computational study paves a new avenue to enable, modulate, and monitor GSPs on a chip, potentially applicable for the development of on-chip electro-optic devices.

The high-voltage system for the LHCb RICH hybrid photon detectors

International Nuclear Information System (INIS)

Arnaboldi, C.; Bellunato, T.; De Lucia, A.; Fanchini, E.; Perego, D.L.; Pessina, G.

2009-01-01

We describe the characterization of the high-voltage (HV) distribution system designed and produced for the pixel hybrid photon detectors of the ring imaging Cherenkov counters of the LHCb experiment. The HV system consists of a series of printed circuit boards with a specific layout designed to prevent any discharge arising from high electric fields. The system has dedicated monitoring and control features to supervise HV set-up during data taking. The full production of the HV system has been now completed and all the boards have been fully characterized and installed in the detector, which is currently being commissioned.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend.

Science.gov (United States)

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-10-04

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d;2',3'-d']benzo[1,2-b;4,5-b']dithiophene (DTBDT-C 6 ) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm 2  V -1  s -1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend

Science.gov (United States)

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-10-01

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d2‧,3‧-d‧]benzo[1,2-b4,5-b‧]dithiophene (DTBDT-C6) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm2 V-1 s-1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

A Novel Hybrid Biometric Electronic Voting System: Integrating Finger Print and Face Recognition

Directory of Open Access Journals (Sweden)

Shahram Najam

2018-01-01

Full Text Available A novel hybrid design based electronic voting system is proposed, implemented and analyzed. The proposed system uses two voter verification techniques to give better results in comparison to single identification based systems. Finger print and facial recognition based methods are used for voter identification. Cross verification of a voter during an election process provides better accuracy than single parameter identification method. The facial recognition system uses Viola-Jones algorithm along with rectangular Haar feature selection method for detection and extraction of features to develop a biometric template and for feature extraction during the voting process. Cascaded machine learning based classifiers are used for comparing the features for identity verification using GPCA (Generalized Principle Component Analysis and K-NN (K-Nearest Neighbor. It is accomplished through comparing the Eigen-vectors of the extracted features with the biometric template pre-stored in the election regulatory body database. The results of the proposed system show that the proposed cascaded design based system performs better than the systems using other classifiers or separate schemes i.e. facial or finger print based schemes. The proposed system will be highly useful for real time applications due to the reason that it has 91% accuracy under nominal light in terms of facial recognition.

Standardization of Schwarz-Christoffel transformation for engineering design of semiconductor and hybrid integrated-circuit elements

Science.gov (United States)

Yashin, A. A.

1985-04-01

A semiconductor or hybrid structure into a calculable two-dimensional region mapped by the Schwarz-Christoffel transformation and a universal algorithm can be constructed on the basis of Maxwell's electro-magnetic-thermal similarity principle for engineering design of integrated-circuit elements. The design procedure involves conformal mapping of the original region into a polygon and then the latter into a rectangle with uniform field distribution, where conductances and capacitances are calculated, using tabulated standard mapping functions. Subsequent synthesis of a device requires inverse conformal mapping. Devices adaptable as integrated-circuit elements are high-resistance film resistors with periodic serration, distributed-resistance film attenuators with high transformation ratio, coplanar microstrip lines, bipolar transistors, directional couplers with distributed coupling to microstrip lines for microwave bulk devices, and quasirregular smooth matching transitions from asymmetric to coplanar microstrip lines.

An impedimetric study of DNA hybridization on paper-supported inkjet-printed gold electrodes

International Nuclear Information System (INIS)

Ihalainen, Petri; Määttänen, Anni; Peltonen, Jouko; Pettersson, Fredrik; Pesonen, Markus; Österbacka, Ronald; Viitala, Tapani

2014-01-01

In this study, two different supramolecular recognition architectures for impedimetric detection of DNA hybridization have been formed on disposable paper-supported inkjet-printed gold electrodes. The gold electrodes were fabricated using a gold nanoparticle based ink. The first recognition architecture consists of subsequent layers of biotinylated self-assembly monolayer (SAM), streptavidin and biotinylated DNA probe. The other recognition architecture is constructed by immobilization of thiol-functionalized DNA probe (HS-DNA) and subsequent backfill with 11-mercapto-1-undecanol (MUOH) SAM. The binding capacity and selectivity of the recognition architectures were examined by surface plasmon resonance (SPR) measurements. SPR results showed that the HS-DNA/MUOH system had a higher binding capacity for the complementary DNA target. Electrochemical impedance spectroscopy (EIS) measurements showed that the hybridization can be detected with impedimetric spectroscopy in picomol range for both systems. EIS signal indicated a good selectivity for both recognition architectures, whereas SPR showed very high unspecific binding for the HS-DNA/MUOH system. The factors affecting the impedance signal were interpreted in terms of the complexity of the supramolecular architecture. The more complex architecture acts as a less ideal capacitive sensor and the impedance signal is dominated by the resistive elements. (paper)

Co-Deposition of a Hydrogel/Calcium Phosphate Hybrid Layer on 3D Printed Poly(Lactic Acid Scaffolds via Dip Coating: Towards Automated Biomaterials Fabrication

Directory of Open Access Journals (Sweden)

Matthias Schneider

2018-03-01

Full Text Available The article describes the surface modification of 3D printed poly(lactic acid (PLA scaffolds with calcium phosphate (CP/gelatin and CP/chitosan hybrid coating layers. The presence of gelatin or chitosan significantly enhances CP co-deposition and adhesion of the mineral layer on the PLA scaffolds. The hydrogel/CP coating layers are fairly thick and the mineral is a mixture of brushite, octacalcium phosphate, and hydroxyapatite. Mineral formation is uniform throughout the printed architectures and all steps (printing, hydrogel deposition, and mineralization are in principle amenable to automatization. Overall, the process reported here therefore has a high application potential for the controlled synthesis of biomimetic coatings on polymeric biomaterials.

Graphene-based inkjet printing of flexible bioelectronic circuits and sensors

Science.gov (United States)

Sinar, Dogan; Knopf, George K.; Nikumb, Suwas

2013-03-01

Bioelectronics involves interfacing functional biomolecules or living cells with electronic circuitry. Recent advances in electrically conductive inks and inkjet printing technologies have enabled bioelectronic devices to be fabricated on mechanically flexible polymers, paper and silk. In this research, non-conductive graphene-oxide (GO) inks are synthesized from inexpensive graphite powders. Once printed on the flexible substrate the electrical conductivity of the micro-circuitry can be restored through thermal reduction. Laser irradiation is one method being investigated for transforming the high resistance printed GO film into conductive oxygen reduced graphene-oxide (rGO). Direct laser writing is a precision fabrication process that enables the imprinting of conductive and resistive micro-features on the GO film. The mechanically flexible rGO microcircuits can be further biofunctionalized using molecular self-assembly techniques. Opportunities and challenges in exploiting these emerging technologies for developing biosensors and bioelectronic cicruits are briefly discussed.

CFD Analysis on the Periodic Element of a Printed Circuit Heat Exchanger

International Nuclear Information System (INIS)

Tak, Nam-il; Kim, Min-Hwan; Lee, Won-Jae

2007-01-01

A typical printed circuit heat exchanger (PCHE) is composed of a large number of flow channels with lateral corrugations. In an effort to investigate fundamental thermo-fluid characteristics of a PCHE with corrugated channels, computational fluid dynamics (CFD) analyses were previously made in. One pair of flow channels (i.e., cold and hot channels) with the entire flow path was considered for the computational domain in the previous studies. Although only one pair of flow channels with coarse meshes was used, computational loads were found to be very high to simulate the entire flow path of the PCHE. Fortunately a recent study has shown that a simplified CFD methodology with a stream wise periodic assumption (called periodic CFD analysis) is feasible for a CFD evaluation of the thermo-fluid performance of compact heat exchangers. Since the periodic CFD analysis focuses on the periodic element of a flow channel, the required computing resources are dramatically reduced. In the present paper, the periodic CFD analysis has been applied to the periodic element of the PCHE. The results are compared with those of the full elements which have an entire flow path. Based on the periodic approach the effects of the corrugation parameters on the thermo-fluid performance of the PCHE are investigated

Prioritizing material recovery for end-of-life printed circuit boards

International Nuclear Information System (INIS)

Wang Xue; Gaustad, Gabrielle

2012-01-01

Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

Directory of Open Access Journals (Sweden)

Chang-Hung Lee

2014-05-01

Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

A low-power integrated humidity CMOS sensor by printing-on-chip technology.

Science.gov (United States)

Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

2014-05-23

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

3D Printed Shock Mitigating Structures

Science.gov (United States)

Schrand, Amanda; Elston, Edwin; Dennis, Mitzi; Metroke, Tammy; Chen, Chenggang; Patton, Steven; Ganguli, Sabyasachi; Roy, Ajit

Here we explore the durability, and shock mitigating potential, of solid and cellular 3D printed polymers and conductive inks under high strain rate, compressive shock wave and high g acceleration conditions. Our initial designs include a simple circuit with 4 resistors embedded into circular discs and a complex cylindrical gyroid shape. A novel ink consisting of silver-coated carbon black nanoparticles in a thermoplastic polyurethane was used as the trace material. One version of the disc structural design has the advantage of allowing disassembly after testing for direct failure analysis. After increasing impacts, printed and traditionally potted circuits were examined for functionality. Additionally, in the open disc design, trace cracking and delamination of resistors were able to be observed. In a parallel study, we examined the shock mitigating behavior of 3D printed cellular gyroid structures on a Split Hopkinson Pressure Bar (SHPB). We explored alterations to the classic SHPB setup for testing the low impedance, cellular samples to most accurately reflect the stress state inside the sample (strain rates from 700 to 1750 s-1). We discovered that the gyroid can effectively absorb the impact of the test resulting in crushing the structure. Future studies aim to tailor the unit cell dimensions for certain frequencies, increase print accuracy and optimize material compositions for conductivity and adhesion to manufacture more durable devices.

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

Energy Technology Data Exchange (ETDEWEB)

Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

2016-07-05

Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

Cosimulation of electromagnetics-circuit systems exploiting DGTD and MNA

KAUST Repository

Li, Ping

2014-06-01

A hybrid electromagnetics (EM)-circuit simulator exploiting the discontinuous Galerkin time domain (DGTD) method and the modified nodal analysis (MNA) algorithm is developed for analyzing hybrid distributive and nonlinear multiport lumped circuit systems. The computational domain is split into two subsystems. One is the EM subsystem that is analyzed by DGTD, while the other is the circuit subsystem that is solved by the MNA method. The coupling between the EM and circuit subsystems is enforced at the lumped port where related field and circuit unknowns are coupled via the use of numerical flux, port voltages, and current sources. Since the spatial operations of DGTD are localized, thanks to the use of numerical flux, coupling matrices between EM and circuit subsystems are small and are directly inverted. To handle nonlinear devices within the circuit subsystem, the standard Newton-Raphson method is applied to the nonlinear coupling matrix system. In addition, a local time-stepping scheme is applied to improve the efficiency of the hybrid solver. Numerical examples including single and multiport linear/nonlinear circuit networks are presented to validate the proposed solver. © 2014 IEEE.

3D printed magnetic polymer composite transformers

Science.gov (United States)

Bollig, Lindsey M.; Hilpisch, Peter J.; Mowry, Greg S.; Nelson-Cheeseman, Brittany B.

2017-11-01

The possibility of 3D printing a transformer core using fused deposition modeling methods is explored. With the use of additive manufacturing, ideal transformer core geometries can be achieved in order to produce a more efficient transformer. In this work, different 3D printed settings and toroidal geometries are tested using a custom integrated magnetic circuit capable of measuring the hysteresis loop of a transformer. These different properties are then characterized, and it was determined the most effective 3D printed transformer core requires a high fill factor along with a high concentration of magnetic particulate.

Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

Science.gov (United States)

Wang, Jianbo; Xu, Zhenming

2015-01-20

Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

Numerical investigation on thermal-hydraulic performance of new printed circuit heat exchanger model

International Nuclear Information System (INIS)

Kim, Dong Eok; Kim, Moo Hwan; Cha, Jae Eun; Kim, Seong O.

2008-01-01

Three-dimensional numerical analysis was performed to investigate heat transfer and pressure drop characteristics of supercritical CO 2 flow in new Printed Circuit Heat Exchanger (PCHE) model using commercial CFD code, Fluent 6.3. First, numerical analysis for conventional zigzag channel PCHE model was performed and compared with previous experimental data. Maximum deviation of in-outlet temperature difference and pressure drop from experimental data is about 10%. A new PCHE model has been designed to optimize thermal-hydraulic performance of PCHE. The new PCHE model has several airfoil shape fins (NACA 0020 model), which are designed to streamlined shape. Simulation results showed that in the airfoil shape fin PCHE, total heat transfer rate per unit volume was almost same with zigzag channel PCHE and the pressure drop was reduced to one-twentieth of that in zigzag channel PCHE. In airfoil shape fin PCHE model, the enhancement of heat transfer area and the uniform flow configuration contributed to obtain the same heat transfer performance with zigzag channel PCHE model. And the reduction of pressure drop in airfoil shape fin PCHE model was caused by suppressing generation of separated flow owing to streamlined shape of airfoil fins

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

2014-05-30

The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

International Nuclear Information System (INIS)

Quan Cui; Li Aimin; Gao Ningbo

2010-01-01

The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

Single axis controlled hybrid magnetic bearing for left ventricular assist device: hybrid core and closed magnetic circuit.

Science.gov (United States)

da Silva, Isaias; Horikawa, Oswaldo; Cardoso, Jose R; Camargo, Fernando A; Andrade, Aron J P; Bock, Eduardo G P

2011-05-01

In previous studies, we presented main strategies for suspending the rotor of a mixed-flow type (centrifugal and axial) ventricular assist device (VAD), originally presented by the Institute Dante Pazzanese of Cardiology (IDPC), Brazil. Magnetic suspension is achieved by the use of a magnetic bearing architecture in which the active control is executed in only one degree of freedom, in the axial direction of the rotor. Remaining degrees of freedom, excepting the rotation, are restricted only by the attraction force between pairs of permanent magnets. This study is part of a joint project in development by IDPC and Escola Politecnica of São Paulo University, Brazil. This article shows advances in that project, presenting two promising solutions for magnetic bearings. One solution uses hybrid cores as electromagnetic actuators, that is, cores that combine iron and permanent magnets. The other solution uses actuators, also of hybrid type, but with the magnetic circuit closed by an iron core. After preliminary analysis, a pump prototype has been developed for each solution and has been tested. For each prototype, a brushless DC motor has been developed as the rotor driver. Each solution was evaluated by in vitro experiments and guidelines are extracted for future improvements. Tests have shown good results and demonstrated that one solution is not isolated from the other. One complements the other for the development of a single-axis-controlled, hybrid-type magnetic bearing for a mixed-flow type VAD. © 2011, Copyright the Authors. Artificial Organs © 2011, International Center for Artificial Organs and Transplantation and Wiley Periodicals, Inc.

Application to printed resistors

International Nuclear Information System (INIS)

Hachiyanagi, Yoshimi; Uraki, Hisatsugu; Sawamura, Masashi

1989-01-01

Most of printed circuit boards are made at present by etching copper foils which are laminated on insulating composite boards of paper/phenol resin or glass nonwoven fabric/epoxy rein. This is called subtractive process, and since this is a wet process, the problem of coping with the pollution due to etching solution, plating solution and others is involved. As the method of solving this problem, attention has been paid to the dry process which forms conductor patterns by screen printing using electro-conductive paste. For such resin substrates, generally polymer thick films (PTF) using thermosetting resin as the binder are used. Also the research on the formation of resistors, condensers and other parts by printing using the technology of cermet thick films (CTF) and PTF is active, and it is partially put in practical use. The problems are the deformation and deterioration of substrates, therefore, as the countermeasures, electron beam hardening type PTF has been studied, and various pastes have been developed. In this paper, electron beam hardening type printed resistors are reported. The features, resistance paste, and a number of the experiments on printed resistors are described. (K.I.)

A hybrid nanomemristor/transistor logic circuit capable of self-programming.

Science.gov (United States)

Borghetti, Julien; Li, Zhiyong; Straznicky, Joseph; Li, Xuema; Ohlberg, Douglas A A; Wu, Wei; Stewart, Duncan R; Williams, R Stanley

2009-02-10

Memristor crossbars were fabricated at 40 nm half-pitch, using nanoimprint lithography on the same substrate with Si metal-oxide-semiconductor field effect transistor (MOS FET) arrays to form fully integrated hybrid memory resistor (memristor)/transistor circuits. The digitally configured memristor crossbars were used to perform logic functions, to serve as a routing fabric for interconnecting the FETs and as the target for storing information. As an illustrative demonstration, the compound Boolean logic operation (A AND B) OR (C AND D) was performed with kilohertz frequency inputs, using resistor-based logic in a memristor crossbar with FET inverter/amplifier outputs. By routing the output signal of a logic operation back onto a target memristor inside the array, the crossbar was conditionally configured by setting the state of a nonvolatile switch. Such conditional programming illuminates the way for a variety of self-programmed logic arrays, and for electronic synaptic computing.

Development of high-resolution two-dimensional magnetic field measurement system by use of printed-circuit technology

Science.gov (United States)

Akimitsu, Moe; Qinghong, Cao; Sawada, Asuka; Hatano, Hironori; Tanabe, Hiroshi; Ono, Yasushi; TS-Group Team

2017-10-01

We have developed a new-types of high-resolution magnetic probe array for our new magnetic reconnection experiments: TS-3U (ST, FRC: R =0.2m, 2017-) and TS-4U (ST, FRC: R =0.5m, 2018-), using the advanced printed-circuit technology. They are equipped with all three-components of magnetic pick-up coils whose size is 1-5mm x 3mm. Each coil is composed of two-sided coil pattern with line width of 0.05mm. We can install two or three printed arrays in a single glass (ceramic) tube for two or three component measurements. Based on this new probe technique, we started high-resolution and high-accuracy measurement of the current sheet thickness and studied its plasma parameter dependence. We found that the thickness of current sheet increases inversely with the guide toroidal field. It is probably determined by the ion gyroradius in agreement with the particle simulation by Horiuchi etc. While the reconnection speed is steady under low guide field condition, it is observed to oscillate in the specific range of guide field, suggesting transition from the quasi-steady reconnection to the intermittent reconnection. Cause and mechanism for intermittent reconnection will be discussed using the current sheet dissipation and dynamic balance between plasma inflow and outflow. This work supported by JSPS KAKENHI Grant Numbers 15H05750, 15K14279 and 17H04863.

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

International Nuclear Information System (INIS)

Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

2014-01-01

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

Energy Technology Data Exchange (ETDEWEB)

Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

2014-05-15

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

Science.gov (United States)

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

Hybdrid integral circuit for proportional chambers

International Nuclear Information System (INIS)

Yanik, R.; Khudy, M.; Povinets, P.; Strmen', P.; Grabachek, Z.; Feshchenko, A.A.

1978-01-01

Outlined briefly are a hybrid integrated circuit of the channel. One channel contains an input amplifier, delay circuit, and memory register on the base of the D-type flip-flop and controlled by the recording gate pulse. Provided at the output of the channel is a readout gating circuit. Presented are the flowsheet of the channel, the shaper amplifier and logical channel. At present the logical circuit was accepted for manufacture

All-printed paper memory

KAUST Repository

Lien, Derhsien

2014-08-26

We report the memory device on paper by means of an all-printing approach. Using a sequence of inkjet and screen-printing techniques, a simple metal-insulator-metal device structure is fabricated on paper as a resistive random access memory with a potential to reach gigabyte capacities on an A4 paper. The printed-paper-based memory devices (PPMDs) exhibit reproducible switching endurance, reliable retention, tunable memory window, and the capability to operate under extreme bending conditions. In addition, the PBMD can be labeled on electronics or living objects for multifunctional, wearable, on-skin, and biocompatible applications. The disposability and the high-security data storage of the paper-based memory are also demonstrated to show the ease of data handling, which are not achievable for regular silicon-based electronic devices. We envision that the PPMDs manufactured by this cost-effective and time-efficient all-printing approach would be a key electronic component to fully activate a paper-based circuit and can be directly implemented in medical biosensors, multifunctional devices, and self-powered systems. © 2014 American Chemical Society.

Laser printing of 3D metallic interconnects

Science.gov (United States)

Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

2016-04-01

The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

Tape transfer printing of a liquid metal alloy for stretchable RF electronics.

Science.gov (United States)

Jeong, Seung Hee; Hjort, Klas; Wu, Zhigang

2014-09-03

In order to make conductors with large cross sections for low impedance radio frequency (RF) electronics, while still retaining high stretchability, liquid-alloy-based microfluidic stretchable electronics offers stretchable electronic systems the unique opportunity to combine various sensors on our bodies or organs with high-quality wireless communication with the external world (devices/systems), without sacrificing enhanced user comfort. This microfluidic approach, based on printed circuit board technology, allows large area processing of large cross section conductors and robust contacts, which can handle a lot of stretching between the embedded rigid active components and the surrounding system. Although it provides such benefits, further development is needed to realize its potential as a high throughput, cost-effective process technology. In this paper, tape transfer printing is proposed to supply a rapid prototyping batch process at low cost, albeit at a low resolution of 150 μm. In particular, isolated patterns can be obtained in a simple one-step process. Finally, a stretchable radio frequency identification (RFID) tag is demonstrated. The measured results show the robustness of the hybrid integrated system when the tag is stretched at 50% for 3000 cycles.

Tape Transfer Printing of a Liquid Metal Alloy for Stretchable RF Electronics

Directory of Open Access Journals (Sweden)

Seung Hee Jeong

2014-09-01

Full Text Available In order to make conductors with large cross sections for low impedance radio frequency (RF electronics, while still retaining high stretchability, liquid-alloy-based microfluidic stretchable electronics offers stretchable electronic systems the unique opportunity to combine various sensors on our bodies or organs with high-quality wireless communication with the external world (devices/systems, without sacrificing enhanced user comfort. This microfluidic approach, based on printed circuit board technology, allows large area processing of large cross section conductors and robust contacts, which can handle a lot of stretching between the embedded rigid active components and the surrounding system. Although it provides such benefits, further development is needed to realize its potential as a high throughput, cost-effective process technology. In this paper, tape transfer printing is proposed to supply a rapid prototyping batch process at low cost, albeit at a low resolution of 150 μm. In particular, isolated patterns can be obtained in a simple one-step process. Finally, a stretchable radio frequency identification (RFID tag is demonstrated. The measured results show the robustness of the hybrid integrated system when the tag is stretched at 50% for 3000 cycles.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Science.gov (United States)

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

Adhesion characterization of inkjet printed tracks

NARCIS (Netherlands)

Sridhar, Ashok; Akkerman, Remko; van Dijk, D.J.

2007-01-01

The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these

Study on characteristics of printed circuit board liberation and its crushed products.

Science.gov (United States)

Quan, Cui; Li, Aimin; Gao, Ningbo

2012-11-01

Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

A One-Dimensional Magnetic Chip with a Hybrid Magnetosensor and a Readout Circuit

Directory of Open Access Journals (Sweden)

Guo-Ming Sung

2018-01-01

Full Text Available This work presents a one-dimensional magnetic chip composed of a hybrid magnetosensor and a readout circuit, which were fabricated with 0.18 μm 1P6M CMOS technology. The proposed magnetosensor includes a polysilicon cross-shaped Hall plate and two separated metal-oxide semiconductor field-effect transistors (MOSFETs to sense the magnetic induction perpendicular to the chip surface. The readout circuit, which comprises a current-to-voltage converter, a low-pass filter, and an instrumentation amplifier, is designed to amplify the output Hall voltage with a gain of 43 dB. Furthermore, a SPICE macro model is proposed to predict the sensor’s performance in advance and to ensure sufficient comprehension of the magnetic mechanism of the proposed magnetosensor. Both simulated and measured results verify the correctness and flexibility of the proposed SPICE macro model. Measurements reveal that the maximum output Hall voltage VH, the optimum current-related magnetosensitivity SRI, the optimum voltage-related magnetosensitivity SRV, the averaged nonlinearity error NLE, and the relative bias current Ibias are 4.381 mV, 520.5 V/A·T, 40.04 V/V·T, 7.19%, and 200 μA, respectively, for the proposed 1-D magnetic chip with a readout circuit of 43 dB. The averaged NLE is small at high magnetic inductions of ±30 mT, whereas it is large at low magnetic inductions of ±30 G.

Internet of "printed" Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

Science.gov (United States)

Kawahara, Yoshihiro

2014-11-01

"What if electronics devices are printed using an inkjet printer even at home?" "What if those devices no longer need a battery?" I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that "sintering-free" silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers.

Flexible circuits with integrated switches for robotic shape sensing

Science.gov (United States)

Harnett, C. K.

2016-05-01

Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

International Nuclear Information System (INIS)

Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

2009-01-01

Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

Science.gov (United States)

Jadhav, Umesh; Su, C; Hocheng, Hong

2016-12-01

In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

Science.gov (United States)

Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

2016-11-01

An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

A novel circuit topology of modified switched boost hybrid resonant inverter fitted induction heating equipment

Directory of Open Access Journals (Sweden)

Bhattacharya Ananyo

2016-12-01

Full Text Available A novel circuit topology of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment is presented in this paper for efficient induction heating. Recently, induction heating technique is becoming very popular for both domestic and industrial purposes because of its high energy efficiency and controllability. Generally in induction heating, a high frequency alternating magnetic field is required to induce the eddy currents in the work piece. High frequency resonant inverters are incorporated in induction heating equipment which produce a high frequency alternating magnetic field surrounding the coil. Previously this high frequency alternating magnetic field was produced by voltage source inverters. But VSIs have several demerits. So, in this paper, a new scheme of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment has been depicted which enhances the energy efficiency and controllability and the same is validated by PSIM.

Learning outcomes afforded by self-assessed, segmented video–print combinations

OpenAIRE

Jack Koumi

2015-01-01

Learning affordances of video and print are examined in order to assess the learning outcomes afforded by hybrid video–print learning packages. The affordances discussed for print are: navigability, surveyability and legibility. Those discussed for video are: design for constructive reflection, provision of realistic experiences, presentational attributes, motivational influences and teacher personalisation. The video affordances are examined through a framework of pedagogic design principles...

Printed Electronics

Science.gov (United States)

Wade, Jessica; Hollis, Joseph Razzell; Wood, Sebastian

2018-04-01

The combination of printing technology with manufacturing electronic devices enables a new paradigm of printable electronics, where 'smart' functionality can be readily incorporated into almost any product at low cost. Over recent decades, rapid progress has been made in this field, which is now emerging into the industrial andcommercial realm. However, successful development and commercialisation on a large scale presents some significant technical challenges. For fully-printable electronic systems, all the component parts must be deposited from solutions (inks), requiring the development of new inorganic, organic and hybrid materials.A variety of traditional printing techniques are being explored and adapted forprinting these new materials in ways that result in the best performing electronicdevices. Whilst printed electronics research has initially focused on traditional typesof electronic device such as light-emitting diodes, transistors, and photovoltaics, it is increasingly apparent that a much wider range of applications can be realised. The soft and stretchable nature of printable materials makes them perfect candidates forbioelectronics, resulting in a wealth of research looking at biocompatible printable inks and biosensors. Regardless of application, the properties of printed electronicmaterials depend on the chemical structures, processing conditions, device architecture,and operational conditions, the complex inter-relationships of which aredriving ongoing research. We focus on three particular 'hot topics', where attention is currently focused: novel materials, characterisation techniques, and device stability. With progress advancing very rapidly, printed electronics is expected to grow over the next decade into a key technology with an enormous economic and social impact.

The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

Science.gov (United States)

Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

2009-10-15

This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

International Nuclear Information System (INIS)

Guo Jie; Rao Qunli; Xu Zhenming

2008-01-01

The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

Investigation of printed circuit heat exchanger for VHTRs - HTR2008-58097

International Nuclear Information System (INIS)

Mylavarapu, S. K.; Sun, X.; Figley, J.; Needler, N. J.; Christensen, R. N.

2008-01-01

Very High Temperature Reactors (VHTRs) require high temperature (900-950 deg. C), high integrity, and high efficiency heat exchangers during normal and off-normal conditions. A class of compact heat exchangers, namely, the Printed Circuit Heat Exchangers (PCHEs), made of high temperature materials, found to have the above characteristics, are being increasingly pursued for heavy duty applications. A high-temperature helium experimental test facility, primarily aimed at investigating the heat transfer and pressure drop characteristics of the PCHEs, was designed and is being built at the Ohio State Univ.. The test facility was designed for a maximum operating temperature and pressure of 900 deg. C and 3 MPa, respectively. Owing to the high operating conditions, a detailed investigation various high temperature materials was carried out to aid in design of the test facility and the heat exchangers. The study showed that alloy 617 is the leading candidate material for high temperature heat exchangers. Two PCHEs, each having 10 hot 10 cold plates with 12 channels in each plate, are currently being fabricated from alloy 617 plates and will be tested once test facility is constructed. To supplement the experiments, computational fluid dynamics modeling of a simplified PCHE model is being performed and the results for three flow rate cases of 15, 40, and 90 kg/h and a system pressure of 3 MPa are discussed. In summary, this paper focuses on the study of the high-temperature materials, the design of the helium test facility, the design and fabrication of the PCHEs, and the computational modeling of a simplified PCHE model. (authors)

Quality control process improvement of flexible printed circuit board by FMEA

Science.gov (United States)

Krasaephol, Siwaporn; Chutima, Parames

2018-02-01

This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

A wearable tracking device inkjet-printed on textile

KAUST Repository

Krykpayev, Bauyrzhan; Farooqui, Muhammad Fahad; Bilal, Rana Muhammad; Vaseem, Mohammad; Shamim, Atif

2017-01-01

Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based

High-Throughput Printing Process for Flexible Electronics

Science.gov (United States)

Hyun, Woo Jin

Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2016-01-01

Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

International Nuclear Information System (INIS)

Stafford, F.N.; Hotza, D.

2012-01-01

Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

International Nuclear Information System (INIS)

Khan, Umer Amir; Lee, Jong-Geon; Seo, In-Jin; Amir, Faisal; Lee, Bang-Wook

2015-01-01

Highlights: • A novel hybrid-type superconducting circuit breaker (SDCCB) is proposed. • SDCCB has SFCL located in the main current path to limit the fault current until the final trip signal. • SFCL in SDCCB suppressed the fast rising DC fault current for a predefined time. • SFCL significantly reduced the DC current breaking stress on SDCCB components. • SDCCB isolated the HVDC faulty line in three, four, and five converter stations MTDC. - Abstract: Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

Energy Technology Data Exchange (ETDEWEB)

Khan, Umer Amir [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of); National University of Sciences and Technology, PNEC Campus, Habib Rehmatullah Road, Karachi (Pakistan); Lee, Jong-Geon; Seo, In-Jin [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of); Amir, Faisal [National University of Sciences and Technology, PNEC Campus, Habib Rehmatullah Road, Karachi (Pakistan); Lee, Bang-Wook, E-mail: bangwook@hanyang.ac.kr [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of)

2015-11-15

Highlights: • A novel hybrid-type superconducting circuit breaker (SDCCB) is proposed. • SDCCB has SFCL located in the main current path to limit the fault current until the final trip signal. • SFCL in SDCCB suppressed the fast rising DC fault current for a predefined time. • SFCL significantly reduced the DC current breaking stress on SDCCB components. • SDCCB isolated the HVDC faulty line in three, four, and five converter stations MTDC. - Abstract: Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

3D Printing: 3D Printing of Shape Memory Polymers for Flexible Electronic Devices (Adv. Mater. 22/2016).

Science.gov (United States)

Zarek, Matt; Layani, Michael; Cooperstein, Ido; Sachyani, Ela; Cohn, Daniel; Magdassi, Shlomo

2016-06-01

On page 4449, D. Cohn, S. Magdassi, and co-workers describe a general and facile method based on 3D printing of methacrylated macromonomers to fabricate shape-memory objects that can be used in flexible and responsive electrical circuits. Such responsive objects can be used in the fabrication of soft robotics, minimal invasive medical devices, sensors, and wearable electronics. The use of 3D printing overcomes the poor processing characteristics of thermosets and enables complex geometries that are not easily accessible by other techniques. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Inkjet printed ambipolar transistors and inverters based on carbon nanotube/zinc tin oxide heterostructures

Energy Technology Data Exchange (ETDEWEB)

Kim, Bongjun; Jang, Seonpil; Dodabalapur, Ananth, E-mail: ananth.dodabalapur@engr.utexas.edu [Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758 (United States); Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712 (United States); Geier, Michael L.; Prabhumirashi, Pradyumna L. [Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (United States); Hersam, Mark C. [Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (United States); Department of Chemistry, Northwestern University, Evanston, Illinois 60208 (United States); Department of Medicine, Northwestern University, Evanston, Illinois 60208 (United States)

2014-02-10

We report ambipolar field-effect transistors (FETs) consisting of inkjet printed semiconductor bilayer heterostructures utilizing semiconducting single-walled carbon nanotubes (SWCNTs) and amorphous zinc tin oxide (ZTO). The bilayer structure allows for electron transport to occur principally in the amorphous oxide layer and hole transport to occur exclusively in the SWCNT layer. This results in balanced electron and hole mobilities exceeding 2 cm{sup 2} V{sup −1} s{sup −1} at low operating voltages (<5 V) in air. We further show that the SWCNT-ZTO hybrid ambipolar FETs can be integrated into functional inverter circuits that display high peak gain (>10). This work provides a pathway for realizing solution processable, inkjet printable, large area electronic devices, and systems based on SWCNT-amorphous oxide heterostructures.

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

Directory of Open Access Journals (Sweden)

Domenico Capriglione

2018-03-01

Full Text Available This paper deals with the electromagnetic compatibility (EMC issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs. These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc., based on the Integrated Circuit Emission Model template (ICEM. As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

[Electric short-circuit incident observed with "Upsher" laryngoscopes].

Science.gov (United States)

Tritsch, L; Vailly, B

2006-01-01

We observed an electrical short-circuit between a fasten screw of the printed circuit and the handle of an Upsher universal laryngoscope (serial number UQ1). The isolating Silicone layer was broken above the screw. This isolation defect was found all over our Upsher laryngoscopes of the UQ1 series. No doubt that if accumulators were used instead of batteries, emitted heat would be in largest amount and perhaps dangerous.

Evolvable designs of experiments applications for circuits

CERN Document Server

Iordache, Octavian

2009-01-01

Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

Science.gov (United States)

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Hybrid finite difference/finite element solution method development for non-linear superconducting magnet and electrical circuit breakdown transient analysis

International Nuclear Information System (INIS)

Kraus, H.G.; Jones, J.L.

1986-01-01

The problem of non-linear superconducting magnet and electrical protection circuit system transients is formulated. To enable studying the effects of coil normalization transients, coil distortion (due to imbalanced magnetic forces), internal coil arcs and shorts, and other normal and off-normal circuit element responses, the following capabilities are included: temporal, voltage and current-dependent voltage sources, current sources, resistors, capacitors and inductors. The concept of self-mutual inductance, and the form of the associated inductance matrix, is discussed for internally shorted coils. This is a Kirchhoff's voltage loop law and Kirchhoff's current node law formulation. The non-linear integrodifferential equation set is solved via a unique hybrid finite difference/integral finite element technique. (author)

Inkjet printing technology and conductive inks synthesis for microfabrication techniques

International Nuclear Information System (INIS)

Dang, Mau Chien; Dung Dang, Thi My; Fribourg-Blanc, Eric

2013-01-01

Inkjet printing is an advanced technique which reliably reproduces text, images and photos on paper and some other substrates by desktop printers and is now used in the field of materials deposition. This interest in maskless materials deposition is coupled with the development of microfabrication techniques for the realization of circuits or patterns on flexible substrates for which printing techniques are of primary interest. This paper is a review of some results obtained in inkjet printing technology to develop microfabrication techniques at Laboratory for Nanotechnology (LNT). Ink development, in particular conductive ink, study of printed patterns, as well as application of these to the realization of radio-frequency identification (RFID) tags on flexible substrates, are presented. (paper)

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

DEFF Research Database (Denmark)

Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2015-01-01

Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...

Hybrid Circuit QED with Electrons on Helium

Science.gov (United States)

Yang, Ge

Electrons on helium (eHe) is a 2-dimensional system that forms naturally at the interface between superfluid helium and vacuum. It has the highest measured electron mobility, and long predicted spin coherence time. In this talk, we will first review various quantum computer architecture proposals that take advantage of these exceptional properties. In particular, we describe how electrons on helium can be combined with superconducting microwave circuits to take advantage of the recent progress in the field of circuit quantum electrodynamics (cQED). We will then demonstrate how to reliably trap electrons on these devices hours at a time, at millikelvin temperatures inside a dilution refrigerator. The coupling between the electrons and the microwave resonator exceeds 1 MHz, and can be reproduced from the design geometry using our numerical simulation. Finally, we will present our progress on isolating individual electrons in such circuits, to build single-electron quantum dots with electrons on helium.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

Directory of Open Access Journals (Sweden)

Waldir A. Bizzo

2014-06-01

Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

FEM-based Printhead Intelligent Adjusting Method for Printing Conduct Material

Directory of Open Access Journals (Sweden)

Liang Xiaodan

2017-01-01

Full Text Available Ink-jet printing circuit board has some advantage, such as non-contact manufacture, high manufacture accuracy, and low pollution and so on. In order to improve the and printing precision, the finite element technology is adopted to model the piezoelectric print heads, and a new bacteria foraging algorithm with a lifecycle strategy is proposed to optimize the parameters of driving waveforms for getting the desired droplet characteristics. Results of numerical simulation show such algorithm has a good performance. Additionally, the droplet jetting simulation results and measured results confirmed such method precisely gets the desired droplet characteristics.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

Science.gov (United States)

Petter, P M H; Veit, H M; Bernardes, A M

2014-02-01

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

International Nuclear Information System (INIS)

Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

2010-01-01

The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

Screen printing as a holistic manufacturing method for multifunctional microsystems and microreactors

International Nuclear Information System (INIS)

Bejarano, D; Lozano, P; Mata, D; Cito, S; Constantí, M; Katakis, I

2009-01-01

Microsystems are commonly manufactured by photolithographic or injection moulding techniques in a variety of realizations and on almost any material. A perennial problem in the manufacturing of microsystems is the difficulty to obtain hybrid devices that incorporate distinct materials with different functionalities. In most of the cases, cumbersome prototyping and high investment needed for manufacturing are additional problems that add to the cost of the final product. Such drawbacks are true not only for lab-on-a-chip but also for certain microreactor applications. Most importantly, in many commercial applications where an intermediate product between full fluidics control and a 'strip' is needed, such restraints prohibit the feasibility of reduction to practice. Screen printing on the other hand is a low cost technique that has been used for years in mass producing two-dimensional low cost reproductions of a mask pattern for circuits and art incorporates prototyping in production and allows the use of an almost limitless variety of materials as 'inks'. In this work it is demonstrated that taking advantage of the deposited ink's three-dimensional nature, screen printing can be used as a versatile and low cost technique for the fabrication of microchannels. Microchannels with dimensions in the order of 100 µm were fabricated that could readily incorporate functionalities through the choice of the materials used to create the microstructure. Variables have been investigated through a factorial experimental design as important process parameters that affect the resolution and print thickness of the resulting microchannels that incorporate electroactive elements. Such studies can lead to the optimization of the process for custom applications

A microfluidic microprocessor: controlling biomimetic containers and cells using hybrid integrated circuit/microfluidic chips.

Science.gov (United States)

Issadore, David; Franke, Thomas; Brown, Keith A; Westervelt, Robert M

2010-11-07

We present an integrated platform for performing biological and chemical experiments on a chip based on standard CMOS technology. We have developed a hybrid integrated circuit (IC)/microfluidic chip that can simultaneously control thousands of living cells and pL volumes of fluid, enabling a wide variety of chemical and biological tasks. Taking inspiration from cellular biology, phospholipid bilayer vesicles are used as robust picolitre containers for reagents on the chip. The hybrid chip can be programmed to trap, move, and porate individual living cells and vesicles and fuse and deform vesicles using electric fields. The IC spatially patterns electric fields in a microfluidic chamber using 128 × 256 (32,768) 11 × 11 μm(2) metal pixels, each of which can be individually driven with a radio frequency (RF) voltage. The chip's basic functions can be combined in series to perform complex biological and chemical tasks and can be performed in parallel on the chip's many pixels for high-throughput operations. The hybrid chip operates in two distinct modes, defined by the frequency of the RF voltage applied to the pixels: Voltages at MHz frequencies are used to trap, move, and deform objects using dielectrophoresis and voltages at frequencies below 1 kHz are used for electroporation and electrofusion. This work represents an important step towards miniaturizing the complex chemical and biological experiments used for diagnostics and research onto automated and inexpensive chips.

Direct microcontact printing of oligonucleotides for biochip applications

Directory of Open Access Journals (Sweden)

Trévisiol E

2005-07-01

Full Text Available Abstract Background A critical step in the fabrication of biochips is the controlled placement of probes molecules on solid surfaces. This is currently performed by sequential deposition of probes on a target surface with split or solid pins. In this article, we present a cost-effective procedure namely microcontact printing using stamps, for a parallel deposition of probes applicable for manufacturing biochips. Results Contrary to a previous work, we showed that the stamps tailored with an elastomeric poly(dimethylsiloxane material did not require any surface modification to be able to adsorb oligonucleotides or PCR products. The adsorbed DNA molecules are subsequently printed efficiently on a target surface with high sub-micron resolution. Secondly, we showed that successive stamping is characterized by an exponential decay of the amount of transferred DNA molecules to the surface up the 4th print, then followed by a second regime of transfer that was dependent on the contact time and which resulted in reduced quality of the features. Thus, while consecutive stamping was possible, this procedure turned out to be less reproducible and more time consuming than simply re-inking the stamps between each print. Thirdly, we showed that the hybridization signals on arrays made by microcontact printing were 5 to 10-times higher than those made by conventional spotting methods. Finally, we demonstrated the validity of this microcontact printing method in manufacturing oligonucleotides arrays for mutations recognition in a yeast gene. Conclusion The microcontact printing can be considered as a new potential technology platform to pattern DNA microarrays that may have significant advantages over the conventional spotting technologies as it is easy to implement, it uses low cost material to make the stamp, and the arrays made by this technology are 10-times more sensitive in term of hybridization signals than those manufactured by conventional spotting

FDM 3D printed coffee glove embedded with flexible electronic

KAUST Repository

Bahri, Meznan

2017-10-31

With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.

Elements configuration of the open lead test circuit

International Nuclear Information System (INIS)

Fukuzaki, Yumi; Ono, Akira

2016-01-01

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Elements configuration of the open lead test circuit

Energy Technology Data Exchange (ETDEWEB)

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp [Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan); Ono, Akira [Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)

2016-07-06

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Collagenous matrix supported by a 3D-printed scaffold for osteogenic differentiation of dental pulp cells.

Science.gov (United States)

Fahimipour, Farahnaz; Dashtimoghadam, Erfan; Rasoulianboroujeni, Morteza; Yazdimamaghani, Mostafa; Khoshroo, Kimia; Tahriri, Mohammadreza; Yadegari, Amir; Gonzalez, Jose A; Vashaee, Daryoosh; Lobner, Douglas C; Jafarzadeh Kashi, Tahereh S; Tayebi, Lobat

2018-02-01

A systematic characterization of hybrid scaffolds, fabricated based on combinatorial additive manufacturing technique and freeze-drying method, is presented as a new platform for osteoblastic differentiation of dental pulp cells (DPCs). The scaffolds were consisted of a collagenous matrix embedded in a 3D-printed beta-tricalcium phosphate (β-TCP) as the mineral phase. The developed construct design was intended to achieve mechanical robustness owing to 3D-printed β-TCP scaffold, and biologically active 3D cell culture matrix pertaining to the Collagen extracellular matrix. The β-TCP precursor formulations were investigated for their flow-ability at various temperatures, which optimized for fabrication of 3D printed scaffolds with interconnected porosity. The hybrid constructs were characterized by 3D laser scanning microscopy, X-ray diffraction, Fourier transform infrared spectroscopy, and compressive strength testing. The in vitro characterization of scaffolds revealed that the hybrid β-TCP/Collagen constructs offer superior DPCs proliferation and alkaline phosphatase (ALP) activity compared to the 3D-printed β-TCP scaffold over three weeks. Moreover, it was found that the incorporation of TCP into the Collagen matrix improves the ALP activity. The presented results converge to suggest the developed 3D-printed β-TCP/Collagen hybrid constructs as a new platform for osteoblastic differentiation of DPCs for craniomaxillofacial bone regeneration. Copyright © 2017. Published by Elsevier Ltd.

Internet of ''printed'' Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

International Nuclear Information System (INIS)

Kawahara, Yoshihiro

2014-01-01

''What if electronics devices are printed using an inkjet printer even at home?'' ''What if those devices no longer need a battery?'' I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that ''sintering-free'' silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers

A WiFi Tracking Device Printed Directly on Textile for Wearable Electronics Applications

KAUST Repository

Krykpayev, Bauyrzhan

2015-12-01

Wearable technology is quickly becoming commonplace in our everyday life - fit-ness and health monitors, smart watches, and Google Glass, just to name a few. It is very clear that in near future the wearable technology will only grow. One of the biggest wearable fields is the E-textiles. E-textiles empower clothes with new functionality by enhancing fabrics with electronics and interconnects. The main obstacle to the development of E-textile field is the relative difficulty and large tolerance in its manufacturing as compared to the standard circuit production. Current methods such as the application of conductive foils, embroidering of conductive wires and treatment with conductive coatings do not possess efficient, fast and reliable mass production traits inherent to the electronic industry. On the other hand, the method of conductive printing on textile has the potential to unlock the efficiency similar to PCB production, due to its roll-to-roll and reel-to-reel printing capabilities. Further-more, printing on textiles is a common practice to realize graphics, artwork, etc. and thus adaptability to conductive ink printing will be relatively easier. Even though conductive printing is a fully additive process, the end circuit layout is very similar to the one produced via PCB manufacture. However, due to high surface roughness and porosity of textiles, efficient and reliable printing on textile has remained elusive. Direct conductive printing on textile is possible but only on specialized dense and tightly interwoven fabrics. Such fabrics are usually uncommon and expensive. Another option is to employ an interface layer that flattens the textile surface, thus allowing printing on it. The interface layer method can be used with a variety of textiles such as polyester/cotton that can be found in any store, making this method promising for wearable electronics. Very few examples and that too of simple structures such as a line, square patch or electrode have been

Hybrid 3D printing and electrodeposition approach for controllable 3D alginate hydrogel formation.

Science.gov (United States)

Shang, Wanfeng; Liu, Yanting; Wan, Wenfeng; Hu, Chengzhi; Liu, Zeyang; Wong, Chin To; Fukuda, Toshio; Shen, Yajing

2017-06-07

Calcium alginate hydrogels are widely used as biocompatible materials in a substantial number of biomedical applications. This paper reports on a hybrid 3D printing and electrodeposition approach for forming 3D calcium alginate hydrogels in a controllable manner. Firstly, a specific 3D hydrogel printing system is developed by integrating a customized ejection syringe with a conventional 3D printer. Then, a mixed solution of sodium alginate and CaCO 3 nanoparticles is filled into the syringe and can be continuously ejected out of the syringe nozzle onto a conductive substrate. When applying a DC voltage (∼5 V) between the substrate (anode) and the nozzle (cathode), the Ca 2+ released from the CaCO 3 particles can crosslink the alginate to form calcium alginate hydrogel on the substrate. To elucidate the gel formation mechanism and better control the gel growth, we can further establish and verify a gel growth model by considering several key parameters, i.e., applied voltage and deposition time. The experimental results indicate that the alginate hydrogel of various 3D structures can be formed by controlling the movement of the 3D printer. A cell viability test is conducted and shows that the encapsulated cells in the gel can maintain a high survival rate (∼99% right after gel formation). This research establishes a reliable method for the controllable formation of 3D calcium alginate hydrogel, exhibiting great potential for use in basic biology and applied biomedical engineering.

Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

Science.gov (United States)

Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

2018-04-01

Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

International Nuclear Information System (INIS)

Han, Won Seok; Lee, Jae Young

2012-01-01

Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

Science.gov (United States)

Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

2018-02-01

Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

International Nuclear Information System (INIS)

Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

2013-01-01

Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

Non-equilibrium correlations and entanglement in a semiconductor hybrid circuit-QED system

International Nuclear Information System (INIS)

Contreras-Pulido, L D; Emary, C; Brandes, T; Aguado, Ramón

2013-01-01

We present a theoretical study of a hybrid circuit-quantum electrodynamics system composed of two semiconducting charge-qubits confined in a microwave resonator. The qubits are defined in terms of the charge states of two spatially separated double quantum dots (DQDs) which are coupled to the same photon mode in the microwave resonator. We analyse a transport setup where each DQD is attached to electronic reservoirs and biased out-of-equilibrium by a large voltage, and study how electron transport across each DQD is modified by the coupling to the common resonator. In particular, we show that the inelastic current through each DQD reflects an indirect qubit–qubit interaction mediated by off-resonant photons in the microwave resonator. As a result of this interaction, both charge qubits stay entangled in the steady (dissipative) state. Finite shot noise cross-correlations between currents across distant DQDs are another manifestation of this nontrivial steady-state entanglement. (paper)

Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

Directory of Open Access Journals (Sweden)

Eun Hye Yuk

2018-06-01

Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

Electrical Differentiation of Mesenchymal Stem Cells into Schwann-Cell-Like Phenotypes Using Inkjet-Printed Graphene Circuits.

Science.gov (United States)

Das, Suprem R; Uz, Metin; Ding, Shaowei; Lentner, Matthew T; Hondred, John A; Cargill, Allison A; Sakaguchi, Donald S; Mallapragada, Surya; Claussen, Jonathan C

2017-04-01

Graphene-based materials (GBMs) have displayed tremendous promise for use as neurointerfacial substrates as they enable favorable adhesion, growth, proliferation, spreading, and migration of immobilized cells. This study reports the first case of the differentiation of mesenchymal stem cells (MSCs) into Schwann cell (SC)-like phenotypes through the application of electrical stimuli from a graphene-based electrode. Electrical differentiation of MSCs into SC-like phenotypes is carried out on a flexible, inkjet-printed graphene interdigitated electrode (IDE) circuit that is made highly conductive (sheet resistance electrically stimulated/treated (etMSCs) display significant enhanced cellular differentiation and paracrine activity above conventional chemical treatment strategies [≈85% of the etMSCs differentiated into SC-like phenotypes with ≈80 ng mL -1 of nerve growth factor (NGF) secretion vs. 75% and ≈55 ng mL -1 for chemically treated MSCs (ctMSCs)]. These results help pave the way for in vivo peripheral nerve regeneration where the flexible graphene electrodes could conform to the injury site and provide intimate electrical simulation for nerve cell regrowth. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

A hybrid pulse combining topology utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer.

Science.gov (United States)

Li, Jiangtao; Zhao, Zheng; Sun, Yi; Liu, Yuhao; Ren, Ziyuan; He, Jiaxin; Cao, Hui; Zheng, Minjun

2017-03-01

Numerous applications driven by pulsed voltage require pulses to be with high amplitude, high repetitive frequency, and narrow width, which could be satisfied by utilizing avalanche transistors. The output improvement is severely limited by power capacities of transistors. Pulse combining is an effective approach to increase the output amplitude while still adopting conventional pulse generating modules. However, there are drawbacks in traditional topologies including the saturation tendency of combining efficiency and waveform oscillation. In this paper, a hybrid pulse combining topology was adopted utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer. The factors affecting the combining efficiency were determined including the output time synchronization of Marx circuits, and the quantity and position of magnetic cores. The numbers of the parallel modules and the stages were determined by the output characteristics of each combining method. Experimental results illustrated the ability of generating pulses with 2-14 kV amplitude, 7-11 ns width, and a maximum 10 kHz repetitive rate on a matched 50-300 Ω resistive load. The hybrid topology would be a convinced pulse combining method for similar nanosecond pulse generators based on the solid-state switches.

Electrical and Physical Property Characterization of Single Walled Carbon Nanotube Ink for Flexible Printed Electronics

Science.gov (United States)

2015-03-01

accurately can the 2 ink be printed? How well does the ink adhere to its substrate? How does the substrate affect the adhesion properties? In what...physical characteristics, some of which may be incompatible with inkjet printing, or the Dimatix DMP 2800 specifically. 3.2.1.2 Ink Solvent...The tape test is conducted by applying a flexible adhesive -backed polymer to the fully-dried printed circuit. The tape is then removed and analyzed

Variable-data Printing Serves - Niches Here, There & Everywhere

Directory of Open Access Journals (Sweden)

Roger Ynostroza

2004-12-01

Full Text Available A milestone focus on high-end digital color presses capable of variable-data imaging - a technology that was introduced ten years ago and is just now at the beginning of wider, more successful implementation in commercial printing-tends to overshadow some real achievements on other variable-data fronts. Those activities involve ink-jet and electrophotographic imaging for high-volume transactional printing, print-on-demand books and catalogs, wide-format proofing and imaging, label production, and printing of text and coding of printed packaging.The capabilities of digital production color presses intrigue commercial printers the most, especially new units referred to by manufacturers as "Series II" or "third-generation" systems. Besides having more press-like characteristics, from offset-caliber quality, image consistency, and high output rates to sturdy construction, reliability, and stock choice, the units seem to represent a way to produce printing that’s beyond the norm.Some users are producing hybrid printed products (offset printing a quantity of "shells" that are later personalized by digital presses, while others are utilizing clients’ "dynamic" databases to personalize marketing materials that drive response rates up to 15%, even 35%. Finally, digital color systems prompt the creation of high-margin Internet-based print providers offering easy-to-design and easy-toorder print materials. Printers may do well to adopt the high-value communications capability that digital imaging offers.

The Use of 3D Printing in the Development of Gaseous Radiation Detectors

Directory of Open Access Journals (Sweden)

Fargher Sam

2018-01-01

The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

Application of Inkjet Printing in High-Density Pixelated RGB Quantum Dot-Hybrid LEDs

KAUST Repository

Haverinen, Hanna

2012-05-23

Recently, an intriguing solution to obtain better color purity has been to introduce inorganic emissive quantum dots (QDs) into an otherwise OLED structure. The emphasis of this chapter is to present a simple discussion of the first attempts to fabricate high-density, pixelated (quarter video graphics array (QVGA) format), monochromatic and RGB quantum dots light-emitting diodes (QDLEDs), where inkjet printing is used to deposit the light-emitting layer of QDs. It shows some of the factors that have to be considered in order to achieve the desired accuracy and printing quality. The successful operation of the RGB printed devices indicates the potential of the inkjet printing approach in the fabrication of full-color QDLEDs for display application. However, further optimization of print quality is still needed in order to eliminate the formation of pinholes, thus maximizing energy transfer from organic layers to the QDs and in turn increasing the performance of the devices. Controlled Vocabulary Terms: ink jet printing; LED displays; LED lamps; organic light emitting diodes; quantum dots

Thermal simulation of a cooling system of hybrid commercial vehicles; Thermalsimulation eine Hybrid-LKW-Kuehlsystems

Energy Technology Data Exchange (ETDEWEB)

Stroh, Christoph; Schnoerch, Stefan; Rathberger, Christian [Magna Powertrain Engineering Center Steyr GmbH und Co. KG, St. Valentin (Austria)

2012-11-01

In the past few years hybrid vehicles have been in the center of automotive engineering efforts, in particular in the field of passenger cars. But hybrid powertrains will also be important for commercial trucks. This focus on hybrid vehicles leads to high demands on thermal management since the additional components in a hybrid vehicle need appropriate cooling or even heating. In the given paper the simulation of a complete cooling system of a hybrid commercial vehicle will be explained. For this virtual examination the commercial 1D thermal management software KULI will be used, a co-simulation with several programs will not be done deliberately. Yet all aspects which are relevant for a global assessment of the thermal management are considered. The main focus is put on the investigation of appropriate concepts for the fluid circuits, including low and high temperature circuits, electric water pumps, etc. Moreover, also a refrigerant circuit with a chiller for active battery cooling will be used, the appropriate control strategy is implemented as well. For simulating transient profiles a simple driving simulation model is included, using road profile, ambient conditions, and various vehicle parameters as input. In addition an engine model is included which enables the investigation of fuel consumption potentials. This simulation model shows how the thermal management of a hybrid vehicle can be investigated with a single program and with reasonable effort. (orig.)

Integrating integrated circuit chips on paper substrates using inkjet printed electronics

CSIR Research Space (South Africa)

Bezuidenhout, Petrone H

2016-11-01

Full Text Available This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively...

Zirconia UV-curable colloids for additive manufacturing via hybrid inkjet printing-stereolithography

DEFF Research Database (Denmark)

Rosa, Massimo; Barou, C.; Esposito, Vincenzo

2018-01-01

Currently, additive manufacturing of ceramics by stereolithography (SLA) is limited to single materials and by a poor thickness resolution that strongly depends on the ceramic particles-UV light interaction. Combining selective laser curing with inkjet printing represents a novel strategy...... to overcome these constrains. Nonetheless, this approach requires UV-curable inks that allow hardening of the printed material and sintering to high density. In this work, we report how to design an ink for inkjet printing of yttria stabilized zirconia (YSZ) which can be impressed by addition of UV...

3D inkjet printed disposable environmental monitoring wireless sensor node

KAUST Repository

Farooqui, Muhammad Fahad

2017-10-24

We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

Energy Technology Data Exchange (ETDEWEB)

Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

2012-06-15

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

Three-input gate logic circuits on chemically assembled single-electron transistors with organic and inorganic hybrid passivation layers.

Science.gov (United States)

Majima, Yutaka; Hackenberger, Guillaume; Azuma, Yasuo; Kano, Shinya; Matsuzaki, Kosuke; Susaki, Tomofumi; Sakamoto, Masanori; Teranishi, Toshiharu

2017-01-01

Single-electron transistors (SETs) are sub-10-nm scale electronic devices based on conductive Coulomb islands sandwiched between double-barrier tunneling barriers. Chemically assembled SETs with alkanethiol-protected Au nanoparticles show highly stable Coulomb diamonds and two-input logic operations. The combination of bottom-up and top-down processes used to form the passivation layer is vital for realizing multi-gate chemically assembled SET circuits, as this combination enables us to connect conventional complementary metal oxide semiconductor (CMOS) technologies via planar processes. Here, three-input gate exclusive-OR (XOR) logic operations are demonstrated in passivated chemically assembled SETs. The passivation layer is a hybrid bilayer of self-assembled monolayers (SAMs) and pulsed laser deposited (PLD) aluminum oxide (AlO[Formula: see text]), and top-gate electrodes were prepared on the hybrid passivation layers. Top and two-side-gated SETs showed clear Coulomb oscillation and diamonds for each of the three available gates, and three-input gate XOR logic operation was clearly demonstrated. These results show the potential of chemically assembled SETs to work as logic devices with multi-gate inputs using organic and inorganic hybrid passivation layers.

HYBRID VEHICLE CONTROL SYSTEM

Directory of Open Access Journals (Sweden)

V. Dvadnenko

2016-06-01

Full Text Available The hybrid vehicle control system includes a start–stop system for an internal combustion engine. The system works in a hybrid mode and normal vehicle operation. To simplify the start–stop system, there were user new possibilities of a hybrid car, which appeared after the conversion. Results of the circuit design of the proposed system of basic blocks are analyzed.

Hybridization of biomedical circuitry

Science.gov (United States)

Rinard, G. A.

1978-01-01

The design and fabrication of low power hybrid circuits to perform vital signs monitoring are reported. The circuits consist of: (1) clock; (2) ECG amplifier and cardiotachometer signal conditioner; (3) impedance pneumobraph and respiration rate processor; (4) hear/breath rate processor; (5) temperature monitor; and (6) LCD display.

Substrate optimization for integrated circuit antennas

OpenAIRE

Alexopoulos, N. G.; Katehi, P. B.; Rutledge, D. B.

1982-01-01

Imaging systems in microwaves, millimeter and submillimeter wave applications employ printed circuit antenna elements. The effect of substrate properties is analyzed in this paper by both reciprocity theorem as well as integral equation approach for infinitesimally short as well as finite length dipole and slot elements. Radiation efficiency and substrate surface wave guidance is studied for practical substrate materials as GaAs, Silicon, Quartz and Duroid.

DC arc plasma disposal of printed circuit board

International Nuclear Information System (INIS)

Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

2004-01-01

A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

Energy Technology Data Exchange (ETDEWEB)

Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

2014-04-01

Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2014-05-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

International Nuclear Information System (INIS)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

2014-01-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

KAUST Repository

Kim, Sangkil; Shamim, Atif; Georgiadis, Apostolos; Aubert, Herve; Tentzeris, Manos M.

2016-01-01

In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

KAUST Repository

Kim, Sangkil

2016-02-11

In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

Decal electronics for printed high performance cmos electronic systems

KAUST Repository

Hussain, Muhammad Mustafa

2017-11-23

High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

Development of hybrid micro circuit based multi-channel programmable HV supply for BARC-pelletron experimental facility

International Nuclear Information System (INIS)

Manna, A.; Thombare, S.; Moitra, S.; Kuswarkar, M.; Punna, M.; Nair, P.M.; Diwakar, M.P.; Pithawa, C.K.

2013-01-01

Electronics Division, BARC has developed a Multi channel programmable HV bias supply system for charge particle detector array for use in BARC-TIFR Pelletron-LINAC facility. The HV supplies are compact in size due to use of hybrid micro-circuits developed indigenously and are modular in construction to achieve versatility, scalability and serviceability. All programming operations and monitoring are performed remotely through PC over Ethernet. Each supply has a built-in over voltage, over current and thermal overload protections for safe operation and employs a Zero Voltage Switching (ZVS) technique to reduce thermal stress on the inverter switches. This article describes salient design aspects and performance of the HV supply system. (author)

Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

Science.gov (United States)

Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

2015-07-01

Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

International Nuclear Information System (INIS)

2010-01-01

The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

Wireless Data Transmission at Terahertz Carrier Waves Generated from a Hybrid InP-Polymer Dual Tunable DBR Laser Photonic Integrated Circuit.

Science.gov (United States)

Carpintero, Guillermo; Hisatake, Shintaro; de Felipe, David; Guzman, Robinson; Nagatsuma, Tadao; Keil, Norbert

2018-02-14

We report for the first time the successful wavelength stabilization of two hybrid integrated InP/Polymer DBR lasers through optical injection. The two InP/Polymer DBR lasers are integrated into a photonic integrated circuit, providing an ideal source for millimeter and Terahertz wave generation by optical heterodyne technique. These lasers offer the widest tuning range of the carrier wave demonstrated to date up into the Terahertz range, about 20 nm (2.5 THz) on a single photonic integrated circuit. We demonstrate the application of this source to generate a carrier wave at 330 GHz to establish a wireless data transmission link at a data rate up to 18 Gbit/s. Using a coherent detection scheme we increase the sensitivity by more than 10 dB over direct detection.

Swirling flow and its influence on dc arcs in a duo-flow hybrid circuit breaker

International Nuclear Information System (INIS)

Kweon, K Y; Lee, H S; Yan, J D; Fang, M T C; Park, K Y

2009-01-01

The effects of swirling flow on the behaviour of dc SF 6 arcs in a duo-flow nozzle are computationally investigated in the electric current range 3-7 kA. A swirling flow is produced by the interaction of the magnetic field of a current-carrying coil and the plasma. Results show that a strong swirling flow is generated in regions where a large radial current density exists as a result of the conducting arc column rapidly changing its radial dimension. The presence of the swirling flow reduces the axis pressure, modifies the arc shape and slightly lowers the arc voltage (2-5%) in comparison with the case without considering the swirling flow. The different natures of swirling flows in a plasma jet/arc heater and in a hybrid circuit breaker are also discussed.

Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

International Nuclear Information System (INIS)

Wang, W.; Kobayashi, T.; Chikushi, J.

2000-01-01

Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

International Nuclear Information System (INIS)

Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

2014-01-01

Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

3D-printed, sugar cube-size microplasma on a hybrid chip used as a spectral lamp to characterize UV-Vis transmission characteristics of polycarbonate chips for microfluidic applications

Science.gov (United States)

Devathasan, D.; Trebych, K.; Karanassios, Vassili

2013-05-01

A 3d-printed, solar-powered, battery-operated, atmospheric-pressure, self-igniting microplasma the size of a sugar-cube has been used as light source to document the Ultra Violet (UV) and visible transmission characteristics of differentthickness polycarbonate chips that are often used for microfluidic applications. The hybrid microplasma chip was fitted with a quartz plate because quartz is transparent to UV.

The performance of silicon solar cells prepared by screen-printing technique

International Nuclear Information System (INIS)

Mursyidah; Mohamed Yahaya; Muhammad Mohd Salleh

2000-01-01

Screen-printing technique is known to produce low cost solar cells. A study has been done to prepare silicon solar cells of n + -p and n + -p-p + structures. The p-type silicon wafers were used as substrates. The phosphorous layer was deposited on top of the substrate using the screen-printing technique. The wafer was then annealed at temperature 1000 degree C for 10 minutes, so that phosphorous atoms are thermally diffused into the wafer to form an n + -p junction. Meanwhile the boron film was deposited at the back surface of the substrate and annealed at temperature 900 degree C for 10 minutes to form a p + layer in the n + -p-p + device. The back and front metal contacts were made using screen-printing technique. The performance of the devices was evaluated from I-V curves measured in the dark and under illumination. It was found that the n + -p-p + device with short circuit current, I SC = 32 mA, open circuit voltage, V OC = 0.46 volt, fill factor, FF=0.63 and efficiency, η = 2.3%, was better than that of the n + -p device. The performance of the n + -p-p + device was successfully improved by depositing titanium dioxide on top of the device as anti-reflection coating using the screen-printing technique. The improved performance was I SC = 38 mA, V OC = 0.48 volt, FF = 0.67 and η = 3. 1%. (Author)

Analysis of 3D printing parameters of gears for hybrid manufacturing

Science.gov (United States)

Budzik, Grzegorz; Przeszlowski, Łukasz; Wieczorowski, Michal; Rzucidlo, Arkadiusz; Gapinski, Bartosz; Krolczyk, Grzegorz

2018-05-01

The paper deals with analysis and selection of parameters of rapid prototyping of gears by selective sintering of metal powders. Presented results show wide spectrum of application of RP systems in manufacturing processes of machine elements, basing on analysis of market in term of application of additive manufacturing technology in different sectors of industry. Considerable growth of these methods over the past years can be observed. The characteristic errors of printed model with respect to ideal one for each technique were pointed out. Special attention was paid to the method of preparation of numerical data CAD/STL/RP. Moreover the analysis of manufacturing processes of gear type elements was presented. The tested gears were modeled with different allowances for final machining and made by DMLS. Metallographic analysis and strength tests on prepared specimens were performed. The above mentioned analysis and tests were used to compare the real properties of material with the nominal ones. To improve the quality of surface after sintering the gears were subjected to final machining. The analysis of geometry of gears after hybrid manufacturing method was performed (fig.1). The manufacturing process was defined in a traditional way as well as with the aid of modern manufacturing techniques. Methodology and obtained results can be used for other machine elements than gears and constitutes the general theory of production processes in rapid prototyping methods as well as in designing and implementation of production.

Polarization Control for Silicon Photonic Circuits

Science.gov (United States)

Caspers, Jan Niklas

In recent years, the field of silicon photonics has received much interest from researchers and companies across the world. The idea is to use photons to transmit information on a computer chip in order to increase computational speed while decreasing the power required for computation. To allow for communication between the chip and other components, such as the computer memory, these silicon photonics circuits need to be interfaced with optical fiber. Unfortunately, in order to interface an optical fiber with an integrated photonics circuit two major challenges need to be overcome: a mode-size mismatch as well as a polarization mismatch. While the problem of mode-size has been well investigated, the polarization mismatch has yet to be addressed. In order to solve the polarization mismatch one needs to gain control over the polarization of the light in a waveguide. In this thesis, I will present the components required to solve the polarization mismatch. Using a novel wave guiding structure, the hybrid plasmonic waveguide, an ultra-compact polarization rotator is designed, fabricated, and tested. The hybrid plasmonic rotator has a performance similar to purely dielectric rotators while being more than an order of magnitude smaller. Additionally, a broadband hybrid plasmonic coupler is designed and measured. This coupler has a performance similar to dielectric couplers while having a footprint an order of magnitude smaller. Finally, a system solution to the polarization mismatch is provided. The system, a polarization adapter, matches the incoming changing polarization from the fiber actively to the correct one of the silicon photonics circuit. The polarization adapter is demonstrated experimentally to prove its operation. This proof is based on dielectric components, but the aforementioned hybrid plasmonic waveguide components would make the system more compact.

Realizing a supercapacitor in an electrical circuit

International Nuclear Information System (INIS)

Fukuhara, Mikio; Kuroda, Tomoyuki; Hasegawa, Fumihiko

2014-01-01

Capacitors are commonly used in electronic resonance circuits; however, capacitors have not been used for storing large amounts of electrical energy in electrical circuits. Here, we report a superior RC circuit which serves as an electrical storage system characterized by quick charging and long-term discharging of electricity. The improved energy storage characteristics in this mixed electric circuit (R 1  + R 2 C 1 ) with small resistor R 1 , large resistor R 2 , and large capacitor C 1 are derived from the damming effect by large R 2 in simple parallel R 2 C 1 circuit. However, no research work has been carried out previously on the use of capacitors as electrical energy storage devices in circuits. Combined with nanotechnology, we hope that our finding will play a remarkable role in a variety of applications such as hybrid electric vehicles and backup power supplies

Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance

Science.gov (United States)

Mościcki, A.; Smolarek-Nowak, A.; Felba, J.; Kinart, A.

2017-07-01

The development of new technologies in electronics related to flexible polymeric substrates forces the industry to introduce suitable tools (special type of dispensers) and modern conductive materials for printing electronic circuits. Moreover, due to the wide use of inexpensive polymeric foils (polyethene, PE, or poly(ethylene terephthalate), PET), there is a need to develop materials with the lowest possible processing temperatures. The present paper presents the selection criteria of suitable components and their preparation for obtaining electrically conductive ink with a special nanosilver base. In the case of the discussed solution, all components allow to make circuits in relatively low sintering temperature (even below 130°C). Additionally, the authors show the most significant ink parameters that should be taken into consideration during Research and Development (R&D) works with electrically conductive inks. Moreover, ink stability parameters are discussed and some examples of printed circuits are presented.

Alternative ceramic circuit constructions for low cost, high reliability applications

International Nuclear Information System (INIS)

Modes, Ch.; O'Neil, M.

1997-01-01

The growth in the use of hybrid circuit technology has recently been challenged by recent advances in low cost laminate technology, as well as the continued integration of functions into IC's. Size reduction of hybrid 'packages' has turned out to be a means to extend the useful life of this technology. The suppliers of thick film materials technology have responded to this challenge by developing a number of technology options to reduce circuit size, increase density, and reduce overall cost, while maintaining or increasing reliability. This paper provides an overview of the processes that have been developed, and, in many cases are used widely to produce low cost, reliable microcircuits. Comparisons of each of these circuit fabrication processes are made with a discussion of advantages and disadvantages of each technology. (author)

A low cost and hybrid technology for integrating silicon sensors or actuators in polymer microfluidic systems

International Nuclear Information System (INIS)

Charlot, Samuel; Gué, Anne-Marie; Tasselli, Josiane; Marty, Antoine; Abgrall, Patrick; Estève, Daniel

2008-01-01

This paper describes a new technology permitting a hybrid integration of silicon chips in polymer (PDMS and SU8) microfluidic structures. This two-step technology starts with transferring the silicon device onto a rigid substrate (typically PCB) and planarizing it, and then it proceeds with stacking of the polymer-made fluidic network onto the device. The technology is low cost, based on screen printing and lamination, can be applied to treat large surface areas, and is compatible with standard photolithography and vacuum based approaches. We show, as an example, the integration of a thermal sensor inside channels made of PDMS or SU8. The developed structures had no fluid leaks at the Si/polymer interfaces and the electrical circuit was perfectly tightproof. (note)

PV power system using hybrid converter for LED indictor applications

International Nuclear Information System (INIS)

Tseng, Sheng-Yu; Wang, Hung-Yuan; Chen, Chien-Chih

2013-01-01

Highlights: • This paper presents a LED indictor driving circuit with a PV arrays as its power source. • The perturb-and-observe method is adopted to extract the maximum power of PV arrays. • The proposed circuit structure has a less component counts and higher conversion efficiency. • A prototype of LED indictor driving circuit has been implemented to verify its feasibility. • The proposed hybrid converter is suitable for LED inductor applications. - Abstract: This paper presents a LED indictor driving circuit with a PV arrays as its power source. The LED indictor driving circuit includes battery charger and discharger (LED driving circuit). In this research, buck converter is used as a charger, and forward converter with active clamp circuit is adopted as a discharger to drive the LED indictor. Their circuit structures use switch integration technique to simplify them and to form the proposed hybrid converter, which has a less component counts, lighter weight, smaller size, and higher conversion efficiency. Moreover, the proposed hybrid converter uses a perturb-and-observe method to extract the maximum power from PV arrays. Finally, a prototype of an LED indictor driving circuit with output voltage of 10 V and output power of 20 W has been implemented to verify its feasibility. It is suitable for the LED inductor applications

Digital power and performance analysis of inkjet printed ring oscillators based on electrolyte-gated oxide electronics

Science.gov (United States)

Cadilha Marques, Gabriel; Garlapati, Suresh Kumar; Dehm, Simone; Dasgupta, Subho; Hahn, Horst; Tahoori, Mehdi; Aghassi-Hagmann, Jasmin

2017-09-01

Printed electronic components offer certain technological advantages over their silicon based counterparts, like mechanical flexibility, low process temperatures, maskless and additive manufacturing possibilities. However, to be compatible to the fields of smart sensors, Internet of Things, and wearables, it is essential that devices operate at small supply voltages. In printed electronics, mostly silicon dioxide or organic dielectrics with low dielectric constants have been used as gate isolators, which in turn have resulted in high power transistors operable only at tens of volts. Here, we present inkjet printed circuits which are able to operate at supply voltages as low as ≤2 V. Our transistor technology is based on lithographically patterned drive electrodes, the dimensions of which are carefully kept well within the printing resolutions; the oxide semiconductor, the electrolytic insulator and the top-gate electrodes have been inkjet printed. Our inverters show a gain of ˜4 and 2.3 ms propagation delay time at 1 V supply voltage. Subsequently built 3-stage ring oscillators start to oscillate at a supply voltage of only 0.6 V with a frequency of ˜255 Hz and can reach frequencies up to ˜350 Hz at 2 V supply voltage. Furthermore, we have introduced a systematic methodology for characterizing ring oscillators in the printed electronics domain, which has been largely missing. Benefiting from this procedure, we are now able to predict the switching capacitance and driver capability at each stage, as well as the power consumption of our inkjet printed ring oscillators. These achievements will be essential for analyzing the performance and power characteristics of future inkjet printed digital circuits.

Efficient Design of Flexible and Low Cost Paper-Based Inkjet-Printed Antenna

Directory of Open Access Journals (Sweden)

A. M. Mansour

2015-01-01

Full Text Available A new, efficient, flexible, and cheap antenna designed at 1.57 GHz microstrip patch antenna based on simple inkjet printer with improved performance using silver nanoparticles ink is developed. The antenna is printed on a kind of flexible substrate “glossy paper,” to offer the advantage of light and flexibility for different applications. The performance of silver nanoparticles ink has been studied through inkjet printing versus postsynthesis annealing and multilayer printing. The conductivity has been improved to have promising values up to 2 Ω/cm at temperatures up to 180°C. The surface morphology of the circuits has been analyzed using SEM with mean diameter of the nanoparticles around 100 nm, uniform surface distribution, and mean thickness of the printed layer around 230 microns. Also, a simple design of a coplanar waveguide (CPW monopole Z-shaped antenna has been considered as an application of fabricated printed antenna using the studied silver nanoparticles ink through a cheap printer.

Hybrid Ag-based inks for nanocomposite inkjet printed lines: RF properties

International Nuclear Information System (INIS)

Chiolerio, Alessandro; Camarchia, Vittorio; Quaglia, Roberto; Pirola, Marco; Pandolfi, Paolo; Pirri, Candido Fabrizio

2014-01-01

Highlights: • Polymer–silver nanocomposite conductive ink for RF fast prototyping. • Reduction of the sintering temperature. • Improved printing resolution. • State-of-the-art electrical conductivity. • Good RF performances. - Abstract: The development of highly conductive Ag nanoparticle (NP)-based inkjet printed (IP) connections is a fundamental process for the success of next-generation digitally printed electronics. This is true both at low frequency and at RF, considering the increasing integration of heterogeneous technologies and the use of flexible substrates. Ink-based technologies provide and form at liquid state the functional material that is then delivered to solid via a sintering process to achieve NP coalescence and electrical percolation. Sintering must be performed at very low temperatures (depending on the substrate choice) to be compatible with previous process steps, to preserve the geometry and fulfill the requirements in term of electrical conductivity, as well as to reduce production costs. While IP, as additive technology, is now well settled for DC or low frequency applications, few results on electrical characterization at RF or microwave frequencies are present due to low conductivity, poor geometry definition and low reproducibility. Hence, a good setup of ink formulation and technological realization is fundamental to enable system performance assessment in the high frequency regime. In this paper we propose a breakthrough: we present a nanocomposite ink, whose thermal and DC electrical properties are extremely interesting and competitive with pure-metallic ink systems. Introducing a copolymer in the formulation, we obtained a reduction of the overall sintering temperature, if compared to the pristine NP suspension, along with improved printing resolution together with very good electrical conductivity. The RF characterization has been performed in the range 1–6 GHz on geometries printed on sintered alumina and on a power

Hybrid Ag-based inks for nanocomposite inkjet printed lines: RF properties

Energy Technology Data Exchange (ETDEWEB)

Chiolerio, Alessandro [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Camarchia, Vittorio, E-mail: vittorio.camarchia@polito.it [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Electronics and Telecommunications Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy); Quaglia, Roberto; Pirola, Marco [Electronics and Telecommunications Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy); Pandolfi, Paolo [Politronica Inkjet Printing S.r.l., C/O i3p, Corso Castelfidardo 30/A, 10129 Torino (Italy); Pirri, Candido Fabrizio [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Applied Science and Technology Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy)

2014-12-05

Highlights: • Polymer–silver nanocomposite conductive ink for RF fast prototyping. • Reduction of the sintering temperature. • Improved printing resolution. • State-of-the-art electrical conductivity. • Good RF performances. - Abstract: The development of highly conductive Ag nanoparticle (NP)-based inkjet printed (IP) connections is a fundamental process for the success of next-generation digitally printed electronics. This is true both at low frequency and at RF, considering the increasing integration of heterogeneous technologies and the use of flexible substrates. Ink-based technologies provide and form at liquid state the functional material that is then delivered to solid via a sintering process to achieve NP coalescence and electrical percolation. Sintering must be performed at very low temperatures (depending on the substrate choice) to be compatible with previous process steps, to preserve the geometry and fulfill the requirements in term of electrical conductivity, as well as to reduce production costs. While IP, as additive technology, is now well settled for DC or low frequency applications, few results on electrical characterization at RF or microwave frequencies are present due to low conductivity, poor geometry definition and low reproducibility. Hence, a good setup of ink formulation and technological realization is fundamental to enable system performance assessment in the high frequency regime. In this paper we propose a breakthrough: we present a nanocomposite ink, whose thermal and DC electrical properties are extremely interesting and competitive with pure-metallic ink systems. Introducing a copolymer in the formulation, we obtained a reduction of the overall sintering temperature, if compared to the pristine NP suspension, along with improved printing resolution together with very good electrical conductivity. The RF characterization has been performed in the range 1–6 GHz on geometries printed on sintered alumina and on a power

Modular thought in the circuit analysis

Science.gov (United States)

Wang, Feng

2018-04-01

Applied to solve the problem of modular thought, provides a whole for simplification's method, the complex problems have become of, and the study of circuit is similar to the above problems: the complex connection between components, make the whole circuit topic solution seems to be more complex, and actually components the connection between the have rules to follow, this article mainly tells the story of study on the application of the circuit modular thought. First of all, this paper introduces the definition of two-terminal network and the concept of two-terminal network equivalent conversion, then summarizes the common source resistance hybrid network modular approach, containing controlled source network modular processing method, lists the common module, typical examples analysis.

Active quenching circuit for a InGaAs single-photon avalanche diode

International Nuclear Information System (INIS)

Zheng Lixia; Wu Jin; Xi Shuiqing; Shi Longxing; Liu Siyang; Sun Weifeng

2014-01-01

We present a novel gated operation active quenching circuit (AQC). In order to simulate the quenching circuit a complete SPICE model of a InGaAs SPAD is set up according to the I–V characteristic measurement results of the detector. The circuit integrated with aROIC (readout integrated circuit) is fabricated in an CSMC 0.5 μm CMOS process and then hybrid packed with the detector. Chip measurement results show that the functionality of the circuit is correct and the performance is suitable for practical system applications. (semiconductor integrated circuits)

Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

Directory of Open Access Journals (Sweden)

Thomas Maciej

2017-12-01

Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

International Nuclear Information System (INIS)

Xiu Furong; Zhang Fushen

2009-01-01

An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

Water Activated Graphene Oxide Transfer Using Wax Printed Membranes for Fast Patterning of a Touch Sensitive Device.

Science.gov (United States)

Baptista-Pires, Luis; Mayorga-Martínez, Carmen C; Medina-Sánchez, Mariana; Montón, Helena; Merkoçi, Arben

2016-01-26

We demonstrate a graphene oxide printing technology using wax printed membranes for the fast patterning and water activation transfer using pressure based mechanisms. The wax printed membranes have 50 μm resolution, longtime stability and infinite shaping capability. The use of these membranes complemented with the vacuum filtration of graphene oxide provides the control over the thickness. Our demonstration provides a solvent free methodology for printing graphene oxide devices in all shapes and all substrates using the roll-to-roll automatized mechanism present in the wax printing machine. Graphene oxide was transferred over a wide variety of substrates as textile or PET in between others. Finally, we developed a touch switch sensing device integrated in a LED electronic circuit.

Packaging strategy for maximizing the performance of a screen printed piezoelectric energy harvester

International Nuclear Information System (INIS)

Zhang, Z; Zhu, D; Tudor, M J; Beeby, S P

2013-01-01

This paper reports the extended design and simulation of a screen printed piezoelectric energy harvester. The proposed design was based on a previous credit card sized smart tag sensor node, and packages the power conditioning circuit in the free space above the tungsten proof mass layer. This approach enables electronic components to be mounted onto the cantilever beam, which provides additional weight at the tip of the cantilever structure. The design structure contains a T-shape cantilever beam with size of 47 mm × 30 mm × 0.85 mm which is fabricated using screen printing. ANSYS simulation results predict the revised architecture can generate 421.9 μW approximately twice of the RMS power produced by the original design along with a higher open-circuit RMS Voltage of 8.0 V while the resonant frequency is dropped to 53.4 Hz

Improved Manufacturing Performance of Screen Printed Carbon Electrodes through Material Formulation.

Science.gov (United States)

Jewell, Eifion; Philip, Bruce; Greenwood, Peter

2016-06-27

Printed carbon graphite materials are the primary common component in the majority of screen printed sensors. Screen printing allows a scalable manufacturing solution, accelerating the means by which novel sensing materials can make the transition from laboratory material to commercial product. A common bottleneck in any thick film printing process is the controlled drying of the carbon paste material. A study has been undertaken which examines the interaction between material solvent, printed film conductivity and process consistency. The study illustrates that it is possible to reduce the solvent boiling point to significantly increase process productivity while maintaining process consistency. The lower boiling point solvent also has a beneficial effect on the conductivity of the film, reducing the sheet resistance. It is proposed that this is a result of greater film stressing increasing charge percolation through greater inter particle contact. Simulations of material performance and drying illustrate that a multi layered printing provides a more time efficient manufacturing method. The findings have implications for the volume manufacturing of the carbon sensor electrodes but also have implications for other applications where conductive carbon is used, such as electrical circuits and photovoltaic devices.

Microwave integrated circuits for space applications

Science.gov (United States)

Leonard, Regis F.; Romanofsky, Robert R.

1991-01-01

Monolithic microwave integrated circuits (MMIC), which incorporate all the elements of a microwave circuit on a single semiconductor substrate, offer the potential for drastic reductions in circuit weight and volume and increased reliability, all of which make many new concepts in electronic circuitry for space applications feasible, including phased array antennas. NASA has undertaken an extensive program aimed at development of MMICs for space applications. The first such circuits targeted for development were an extension of work in hybrid (discrete component) technology in support of the Advanced Communication Technology Satellite (ACTS). It focused on power amplifiers, receivers, and switches at ACTS frequencies. More recent work, however, focused on frequencies appropriate for other NASA programs and emphasizes advanced materials in an effort to enhance efficiency, power handling capability, and frequency of operation or noise figure to meet the requirements of space systems.

Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

Science.gov (United States)

Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

2014-09-01

Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

Science.gov (United States)

Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

2016-08-01

Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

2013-10-01

The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

Experimental and CFD Analysis of Printed Circuit Heat Exchanger for Supercritical CO{sub 2} Power Cycle Application

Energy Technology Data Exchange (ETDEWEB)

Baik, Seungjoon; Kim, Hyeon Tae; Kim, Seong Gu; Lee, Jekyoung; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

2015-10-15

The supercritical carbon dioxide (S-CO{sub 2}) power cycle has been suggested as an alternative for the SFR power generation system. First of all, relatively mild sodium-CO{sub 2} interaction can reduce the accident probability. Also the S-CO{sub 2} power conversion cycle can achieve high efficiency with SFR core thermal condition. Moreover, the S-CO{sub 2} power cycle can reduce cycle footprint due to high density of the working fluid. Recently, various compact heat exchangers have been studied for developing an optimal heat exchanger. In this paper, the printed circuit heat exchanger was selected for S-CO{sub 2} power cycle applications and was closely investigated experimentally and analytically. Recently, design and performance prediction of PCHE received attention due to its importance in high pressure power systems such as S-CO{sub 2} cycle. To evaluate a PCHE performance with CO{sub 2} to water, KAIST research team designed and tested a lab-scale PCHE. From the experimental data and CFD analysis, pressure drop and heat transfer correlations are obtained. For the CFD analysis, Ansys-CFX commercial code was utilized with RGP table implementation. In near future, the turbulence model sensitivity study will be followed.

Realizing a supercapacitor in an electrical circuit

Energy Technology Data Exchange (ETDEWEB)

Fukuhara, Mikio, E-mail: fukuhara@niche.tohoku.ac.jp; Kuroda, Tomoyuki; Hasegawa, Fumihiko [New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579 (Japan)

2014-11-17

Capacitors are commonly used in electronic resonance circuits; however, capacitors have not been used for storing large amounts of electrical energy in electrical circuits. Here, we report a superior RC circuit which serves as an electrical storage system characterized by quick charging and long-term discharging of electricity. The improved energy storage characteristics in this mixed electric circuit (R{sub 1} + R{sub 2}C{sub 1}) with small resistor R{sub 1}, large resistor R{sub 2}, and large capacitor C{sub 1} are derived from the damming effect by large R{sub 2} in simple parallel R{sub 2}C{sub 1} circuit. However, no research work has been carried out previously on the use of capacitors as electrical energy storage devices in circuits. Combined with nanotechnology, we hope that our finding will play a remarkable role in a variety of applications such as hybrid electric vehicles and backup power supplies.

3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2017-05-19

Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

2015-06-01

The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

Low-Cost Manufacturing of Bioresorbable Conductors by Evaporation-Condensation-Mediated Laser Printing and Sintering of Zn Nanoparticles.

Science.gov (United States)

Shou, Wan; Mahajan, Bikram K; Ludwig, Brandon; Yu, Xiaowei; Staggs, Joshua; Huang, Xian; Pan, Heng

2017-07-01

Currently, bioresorbable electronic devices are predominantly fabricated by complex and expensive vacuum-based integrated circuit (IC) processes. Here, a low-cost manufacturing approach for bioresorbable conductors on bioresorbable polymer substrates by evaporation-condensation-mediated laser printing and sintering of Zn nanoparticle is reported. Laser sintering of Zn nanoparticles has been technically difficult due to the surface oxide on nanoparticles. To circumvent the surface oxide, a novel approach is discovered to print and sinter Zn nanoparticle facilitated by evaporation-condensation in confined domains. The printing process can be performed on low-temperature substrates in ambient environment allowing easy integration on a roll-to-roll platform for economical manufacturing of bioresorbable electronics. The fabricated Zn conductors show excellent electrical conductivity (≈1.124 × 10 6 S m -1 ), mechanical durability, and water dissolvability. Successful demonstration of strain gauges confirms the potential application in various environmentally friendly sensors and circuits. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

High Isolation Dual-Polarized Patch Antenna with Hybrid Ring Feeding

Directory of Open Access Journals (Sweden)

Xian-Jing Lin

2017-01-01

Full Text Available This paper presents a hybrid ring feeding dual-polarized patch antenna with high isolation in a wide working band. The proposed antenna consists of a circular radiating patch printed on the upper horizontal substrate, two pairs of Γ shaped strips printed on two vertical substrates, and a hybrid ring feeding network printed on the lower two horizontal substrates. The proposed antenna adopts Γ shape strips coupled feeding structure to achieve a wide operating band. Furthermore, a hybrid ring feeding structure with high isolation in a wide bandwidth, which is firstly proposed, is applied as feeding network. When one port is excited, the feeding network can realize twice the power cancellation. Thus, high ports isolation characteristics can be obtained. A prototype of the proposed antenna is fabricated and measured. Measured results show that the 10 dB reflection coefficient bandwidths of the two ports are both about 38.7%, with port isolation higher than 40 dB through most of the band, and the cross-polarizations are below −24 dB.

Printing Electronic Components from Copper-Infused Ink and Thermoplastic Mediums

Science.gov (United States)

Flowers, Patrick F.

The demand for printable electronics has sharply increased in recent years and is projected to continue to rise. Unfortunately, electronic materials which are suitable for desired applications while being compatible with available printing techniques are still often lacking. This thesis addresses two such challenging areas. In the realm of two-dimensional ink-based printing of electronics, a major barrier to the realization of printable computers that can run programs is the lack of a solution-coatable non-volatile memory with performance metrics comparable to silicon-based devices. To address this deficiency, I developed a nonvolatile memory based on Cu-SiO2 core-shell nanowires that can be printed from solution and exhibits on-off ratios of 106, switching speeds of 50 ns, a low operating voltage of 2 V, and operates for at least 104 cycles without failure. Each of these metrics is similar to or better than Flash memory (the write speed is 20 times faster than Flash). Memory architectures based on the individual memory cells demonstrated here could enable the printing of the more complex, embedded computing devices that are expected to make up an internet of things. Recently, the exploration of three-dimensional printing techniques to fabricate electronic materials began. A suitable general-purpose conductive thermoplastic filament was not available, however. In this work I examine the current state of conductive thermoplastic filaments, including a newly-released highly conductive filament that my lab has produced which we call Electrifi. I focus on the use of dual-material fused filament fabrication (FFF) to 3D print electronic components (conductive traces, resistors, capacitors, inductors) and circuits (a fully-printed high-pass filter). The resistivity of traces printed from conductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillers was found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of

Performance Evaluation of a Printed Circuit Steam Generator for Integral Reactors: A Feasibility Test

Energy Technology Data Exchange (ETDEWEB)

Han, Hun Sik; Kang, Han-Ok; Yoon, Juhyeon; Kim, Young In; Kim, Keung Koo [KAERI, Daejeon (Korea, Republic of); Seo, Jang-won; Choi, Brain [Alfa Laval Korea Ltd., Daejeon (Korea, Republic of)

2015-05-15

SMART (System-integrated Modular Advanced ReacTor) is a small-sized integral type pressurized water reactor. It adopts advanced design features such as structural safety improvement, system simplification, and component modularization to achieve highly enhanced safety and improved economics. The design issues related to further safety enhancement and cost reduction have received significant attention to increase its competitiveness in the global small reactor market. For the cost reduction, it is important to design the reactor vessel as small as possible. Thus, it is necessary to reduce the volume of main components such as a steam generator. Its manufacturing processes of the chemical etching and diffusion bonding provide high effectiveness, high compactness, and inherent structural safety under high temperatures and high pressures. Thus, it is expected to be an alternative to the conventional shell and tube type steam generator in SMART. In this paper, simple thermal-hydraulic performance measurement of a small-scale printed circuit steam generator (PCSG) is conducted to investigate the feasibility of applying it to SMART. The simple thermal-hydraulic performance of the PCSG has been experimentally evaluated. A small-scale PCHE is employed to investigate the feasibility of operating it as a steam generator. The performance assessment reveals that the PCSG stably produces superheated steam, and the increased degree of superheat is obtained at lower water flow rate. However, the flow instability is increased with the decrease of the water flow rate. Thus, it is required to apply the orifice design into the cold side plate to suppress the density-wave oscillations. The pressure drops and heat transfer rates increase with the water flow rate.

High-performance all-printed amorphous oxide FETs and logics with electronically compatible electrode/ channel interface.

Science.gov (United States)

Sharma, Bhupendra Kumar; Stoesser, Anna; Mondal, Sandeep Kumar; Garlapati, Suresh K; Fawey, Mohammed H; Chakravadhanula, Venkata Sai Kiran; Kruk, Robert; Hahn, Horst; Dasgupta, Subho

2018-06-12

Oxide semiconductors typically show superior device performance compared to amorphous silicon or organic counterparts, especially, when they are physical vapor deposited. However, it is not easy to reproduce identical device characteristics when the oxide field-effect transistors (FETs) are solution-processed/ printed; the level of complexity further intensifies with the need to print the passive elements as well. Here, we developed a protocol for designing the most electronically compatible electrode/ channel interface based on the judicious material selection. Exploiting this newly developed fabrication schemes, we are now able to demonstrate high-performance all-printed FETs and logic circuits using amorphous indium-gallium-zinc oxide (a-IGZO) semiconductor, indium tin oxide (ITO) as electrodes and composite solid polymer electrolyte as the gate insulator. Interestingly, all-printed FETs demonstrate an optimal electrical performance in terms of threshold voltages and device mobility and may very well be compared with devices fabricated using sputtered ITO electrodes. This observation originates from the selection of electrode/ channel materials from the same transparent semiconductor oxide family, resulting in the formation of In-Sn-Zn-O (ITZO) based diffused a-IGZO/ ITO interface that controls doping density while ensuring high electrical performance. Compressive spectroscopic studies reveal that Sn doping mediated excellent band alignment of IGZO with ITO electrodes is responsible for the excellent device performance observed. All-printed n-MOS based logic circuits have also been demonstrated towards new-generation portable electronics.

Design of organic complementary circuits and systems on foil

CERN Document Server

Abdinia, Sahel; Cantatore, Eugenio

2015-01-01

This book describes new approaches to fabricate complementary organic electronics, and focuses on the design of circuits and practical systems created using these manufacturing approaches. The authors describe two state-of-the-art, complementary organic technologies, characteristics and modeling of their transistors and their capability to implement circuits and systems on foil. Readers will benefit from the valuable overview of the challenges and opportunities that these extremely innovative technologies provide. ·         Demonstrates first circuits implemented using specific complementary organic technologies, including first printed analog to digital converter, first dynamic logic on foil and largest complementary organic circuit ·         Includes step-by-step design from single transistor level to complete systems on foil ·         Provides a platform for comparing state-of-the-art complementary organic technologies and for comparing these with other similar technologies, spec...

Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

Science.gov (United States)

Khan, Umer Amir; Lee, Jong-Geon; Seo, In-Jin; Amir, Faisal; Lee, Bang-Wook

2015-11-01

Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

A Hybrid DGTD-MNA Scheme for Analyzing Complex Electromagnetic Systems

KAUST Repository

Li, Peng

2015-01-07

A hybrid electromagnetics (EM)-circuit simulator for analyzing complex systems consisting of EM devices loaded with nonlinear multi-port lumped circuits is described. The proposed scheme splits the computational domain into two subsystems: EM and circuit subsystems, where field interactions are modeled using Maxwell and Kirchhoff equations, respectively. Maxwell equations are discretized using a discontinuous Galerkin time domain (DGTD) scheme while Kirchhoff equations are discretized using a modified nodal analysis (MNA)-based scheme. The coupling between the EM and circuit subsystems is realized at the lumped ports, where related EM fields and circuit voltages and currents are allowed to “interact’’ via numerical flux. To account for nonlinear lumped circuit elements, the standard Newton-Raphson method is applied at every time step. Additionally, a local time-stepping scheme is developed to improve the efficiency of the hybrid solver. Numerical examples consisting of EM systems loaded with single and multiport linear/nonlinear circuit networks are presented to demonstrate the accuracy, efficiency, and applicability of the proposed solver.

Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

International Nuclear Information System (INIS)

Lee, Dae-Young; Lee, Jae-Chang; Shin, Yun-Soo; Park, Sung-Eun; Kim, Yong-Jun; Hwang, Jungho; Yu, Tae-U

2008-01-01

A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

2015-01-01

This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

Progress in 3D Printing of Carbon Materials for Energy-Related Applications.

Science.gov (United States)

Fu, Kun; Yao, Yonggang; Dai, Jiaqi; Hu, Liangbing

2017-03-01

The additive-manufacturing (AM) technique, known as three-dimensional (3D) printing, has attracted much attention in industry and academia in recent years. 3D printing has been developed for a variety of applications. Printable inks are the most important component for 3D printing, and are related to the materials, the printing method, and the structures of the final 3D-printed products. Carbon materials, due to their good chemical stability and versatile nanostructure, have been widely used in 3D printing for different applications. Good inks are mainly based on volatile solutions having carbon materials as fillers such as graphene oxide (GO), carbon nanotubes (CNT), carbon blacks, and solvent, as well as polymers and other additives. Studies of carbon materials in 3D printing, especially GO-based materials, have been extensively reported for energy-related applications. In these circumstances, understanding the very recent developments of 3D-printed carbon materials and their extended applications to address energy-related challenges and bring new concepts for material designs are becoming urgent and important. Here, recent developments in 3D printing of emerging devices for energy-related applications are reviewed, including energy-storage applications, electronic circuits, and thermal-energy applications at high temperature. To close, a conclusion and outlook are provided, pointing out future designs and developments of 3D-printing technology based on carbon materials for energy-related applications and beyond. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Embedding of inkjet-printed Ag-grid/ITO hybrid transparent electrode ...

Indian Academy of Sciences (India)

2018-02-02

Feb 2, 2018 ... Keywords. Solution process; inkjet; electrohydrodynamic printing; transparent electrode; flexible electrode. 1. Introduction. Transparent electrodes (TEs) are one of the most indispensable materials to fabricate rapidly emerging elec- tronic devices, including flexible displays, touch panels, photovoltaic cells ...

Integrated electric circuit CAD system in Minolta Camera Co. Ltd

Energy Technology Data Exchange (ETDEWEB)

Nakagami, Tsuyoshi; Hirata, Sumiaki; Matsumura, Fumihiko

1988-08-26

Development background, fundamental concept, details and future plan of the integrated electric circuit CAD system for OA equipment are presented. The central integrated database is basically intended to store experiences or know-hows, to cover the wide range of data required for designs, and to provide a friendly interface. This easy-to-use integrated database covers the drawing data, parts information, design standards, know-hows and system data. The system contains the circuit design function to support drawing circuit diagrams, the wiring design function to support the wiring and arrangement of printed circuit boards and various parts integratedly, and the function to verify designs, to make full use of parts or technical information, to maintain the system security. In the future, as the system will be wholly in operation, the design period reduction, quality improvement and cost saving will be attained by this integrated design system. (19 figs, 2 tabs)

Experimental and numerical study of a printed circuit heat exchanger

International Nuclear Information System (INIS)

Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Shi, Shanbin; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

2016-01-01

Highlights: • A dynamic model is developed for transient analysis of the straight-channel PCHE. • Transient scenarios of the straight-channel PCHE subject to helium temperature and mass flow rate variations are numerically investigated. • Steady-state temperature distribution inside the straight-channel PCHE is obtained in calculation. • Experiments are conducted to study the dynamic behavior of the straight-channel PCHE. - Abstract: Printed circuit heat exchangers (PCHEs) are promising to be employed in very-high-temperature gas-cooled reactors (VHTRs) due to their high robustness for high-temperature, high-pressure applications and high compactness. PCHEs typically serve as intermediate heat exchangers (IHXs) that isolate the secondary loop from the reactor’s primary system and hence must be sufficiently robust to maintain the system integrity during normal and off-normal conditions. In addition, the performance of the PCHE-type IHX could considerably affect the nuclear power plant overall operation since any transients on the secondary side would be propagated back to the reactor’s primary coolant system via the IHX. It is therefore imperative to understand how the PCHE would dynamically respond to a variety of transients. In the current study, experiments were first conducted to examine the steady-state thermal performance of a reduced-scale straight-channel PCHE. A dynamic model benchmarked in a previous study was then used to predict the steady-state and transient behavior of the PCHE. The steady-state temperature profiles of the working fluids on both the hot and cold sides and in the solid plates of the heat exchanger were obtained, which served as the initial condition for the transient simulations. The detailed dynamic response of the straight-channel PCHE, subject to inlet temperature variations, helium mass flow variations, and combinations of the two, was simulated and analyzed. In addition, two sets of transient tests, one for helium inlet

Joint quantum state tomography of an entangled qubit–resonator hybrid

International Nuclear Information System (INIS)

LinPeng, X Y; Zhang, H Z; Xu, K; Li, C Y; Zhong, Y P; Wang, Z L; Wang, H; Xie, Q W

2013-01-01

The integration of superconducting qubits and resonators in one circuit offers a promising solution for quantum information processing (QIP), which also realizes the on-chip analogue of cavity quantum electrodynamics (QED), known as circuit QED. In most prototype circuit designs, qubits are active processing elements and resonators are peripherals. As resonators typically have better coherence performance and more accessible energy levels, it is proposed that the entangled qubit–resonator hybrid can be used as a processing element. To achieve such a goal, an accurate measurement of the hybrid is first necessary. Here we demonstrate a joint quantum state tomography (QST) technique to fully characterize an entangled qubit–resonator hybrid. We benchmarked our QST technique by generating and accurately characterizing multiple states, e.g. |gN〉 + |e(N − 1)〉 where (|g〉 and |e〉) are the ground and excited states of the qubit and (|0〉,…,|N〉) are Fock states of the resonator. We further provided a numerical method to improve the QST efficiency and measured the decoherence dynamics of the bipartite hybrid, witnessing dissipation coming from both the qubit and the N-photon Fock state. As such, the joint QST presents an important step toward actively using the qubit–resonator element for QIP in hybrid quantum devices and for studying circuit QED. (paper)

Flexible transparent conductive films combining flexographic printed silver grids with CNT coating

International Nuclear Information System (INIS)

Mo, Lixin; Fang, Yi; Zhai, Qingbin; Li, Luhai; Ran, Jun; Yang, Li

2016-01-01

A high-performance ITO-free transparent conductive film (TCF) has been made by combining high resolution Ag grids with a carbon nanotube (CNT) coating. Ag grids printed with flexography have a 20 μm line width at a grid interval of 400 μm. The Ag grid/CNT hybrid film exhibits excellent overall performance, with a typical sheet resistance of 14.8 Ω/□ and 82.6% light transmittance at room temperature. This means a 23.98% reduction in sheet resistance and only 2.52% loss in transmittance compared to a pure Ag grid film. Analysis indicates that filling areas between the Ag grids and interconnecting the silver nanoparticles with the CNT coating are the primary reasons for the significantly improved conductivity of the hybrid film that also exhibits excellent flexibility and mechanical strength compared to an ITO film. The hybrid film may fully satisfy the requirements of different applications, e.g. use as the anode of polymer solar cells (PSCs). The J–V curve shows that the power conversion efficiency (PCE) of the PSCs using the Ag grid/CNT hybrid anode is 0.61%, which is 24.5% higher than that of the pure Ag grids with a PCE of 0.49%. Further investigations to improve the performance of the solar cells based on the printed hybrid TCFs are ongoing. (paper)

Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

Science.gov (United States)

Yang, Shuangqiao; Bai, Shibing; Wang, Qi

2016-11-01

In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

18k Channels single photon counting readout circuit for hybrid pixel detector

International Nuclear Information System (INIS)

Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

2013-01-01

We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e − and the equivalent noise charge is 168 e − rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

18k Channels single photon counting readout circuit for hybrid pixel detector

Energy Technology Data Exchange (ETDEWEB)

Maj, P., E-mail: piotr.maj@agh.edu.pl [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Grybos, P.; Szczygiel, R.; Zoladz, M. [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Sakumura, T.; Tsuji, Y. [X-ray Analysis Division, Rigaku Corporation, Matsubara, Akishima, Tokyo 196-8666 (Japan)

2013-01-01

We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm Multiplication-Sign 20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96 Multiplication-Sign 192 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 {mu}W/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 {mu}V/e{sup -} and the equivalent noise charge is 168 e{sup -} rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

Effects of smoke on functional circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1997-10-01

Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

A screen-printed circular-type paper-based glucose/O2 biofuel cell

Science.gov (United States)

Shitanda, Isao; Nohara, Saki; Hoshi, Yoshinao; Itagaki, Masayuki; Tsujimura, Seiya

2017-08-01

The printable paper-based enzymatic biofuel cell (PBFC) to directly power small devices is an important objective for realizing cost-effective and disposable energy harvesting devices. In the present study, a screen-printed circular-type PBFC, composed of a series of 5 individual cells, was constructed. The PBFC exhibited the open circuit potential of 2.65 V and maximum power of 350 μW at 1.55 V, which were sufficient to illuminate an LED without requiring a booster circuit. The output voltage of this PBFC can also be easily adjusted as required.

A high-precision synchronization circuit for clock distribution

International Nuclear Information System (INIS)

Lu Chong; Tan Hongzhou; Duan Zhikui; Ding Yi

2015-01-01

In this paper, a novel structure of a high-precision synchronization circuit, HPSC, using interleaved delay units and a dynamic compensation circuit is proposed. HPSCs are designed for synchronization of clock distribution networks in large-scale integrated circuits, where high-quality clocks are required. The application of a hybrid structure of a coarse delay line and dynamic compensation circuit performs roughly the alignment of the clock signal in two clock cycles, and finishes the fine tuning in the next three clock cycles with the phase error suppressed under 3.8 ps. The proposed circuit is implemented and fabricated using a SMIC 0.13 μm 1P6M process with a supply voltage at 1.2 V. The allowed operation frequency ranges from 200 to 800 MHz, and the duty cycle ranges between [20%, 80%]. The active area of the core circuits is 245 × 134 μm 2 , and the power consumption is 1.64 mW at 500 MHz. (paper)

Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

Science.gov (United States)

Li, Jia; Zhou, Quan; Xu, Zhenming

2014-12-01

Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

Structural assessment of intermediate printed circuit heat exchanger for sodium-cooled fast reactor with supercritical CO2 cycle

International Nuclear Information System (INIS)

Lee, Youho; Lee, Jeong Ik

2014-01-01

Highlights: • We numerically model PCHE stress arising from pressure, and thermal loadings. • Stress levels are the highest around S-CO 2 channels, due to high pressure of S-CO 2 . • The conventional analytic models for PCHE underestimate actual stress levels. • Plasticity sufficiently lowers stress levels at channel tips. • PCHE for SFR-SCO 2 is anticipated to assure compliance with ASME design standards. - Abstract: Structural integrity of intermediate Printed Circuit Heat Exchanger (PCHE) for Sodium-cooled Fast Reactor (SFR) attached to Supercritical CO 2 (S-CO 2 ) is investigated. ANSYS-Mechanical was used to simulate stress fields of representative PCHE channels, with temperature fields imported from FLUENT simulation. Mechanical stress induced by pressure loading is found to be the primary source of stress. As plasticity sufficiently lowers local stress concentration at PCHE channel tips, PCHE type intermediate heat exchangers made of SS316 are anticipated to reliably assure compliance with design standards prescribed in the ASME standards, thanks to the structure temperature that is below the effective creep inducing point. The actual life time of PCHE for SFR-SCO 2 is likely to be affected by mechanical behavior change of SS316 with reactions with S-CO 2 and fatigue

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

Science.gov (United States)

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

3D printed System-on-Package (SoP) for environmental sensing and localization applications

KAUST Repository

Zhen, Su

2017-12-22

This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

Fine chemicals for the electronics industry: the proceedings of a symposium organised by the Fine Chemicals and Medicinals Group of the Industrial Division of the Royal Society of Chemistry, Bath, UK, 2-4 April 1986

International Nuclear Information System (INIS)

Bamfield, P.

1986-01-01

Most business surveys on electronic chemicals emphasise the importance of semi-conductor materials, printed circuit board chemicals, hybrid circuit materials and others, e.g. liquid crystal materials. This was expanded in this symposium to include chemicals consumed by the telecommunications, optoelectronics, reprographics, displays, and energy conversion sectors. The burgeoning area of molecular electronics was also considered to be important. (author)

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

Science.gov (United States)

Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

2011-01-01

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Laser printed interconnects for flexible electronics

Science.gov (United States)

Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

Screen printing technology applied to silicon solar cell fabrication

Science.gov (United States)

Thornhill, J. W.; Sipperly, W. E.

1980-01-01

The process for producing space qualified solar cells in both the conventional and wraparound configuration using screen printing techniques was investigated. Process modifications were chosen that could be easily automated or mechanized. Work was accomplished to optimize the tradeoffs associated with gridline spacing, gridline definition and junction depth. An extensive search for possible front contact metallization was completed. The back surface field structures along with the screen printed back contacts were optimized to produce open circuit voltages of at least an average of 600 millivolts. After all intended modifications on the process sequence were accomplished, the cells were exhaustively tested. Electrical tests at AMO and 28 C were made before and after boiling water immersion, thermal shock, and storage under conditions of high temperature and high humidity.

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

Science.gov (United States)

Miller, Timothy M.; Jhabvala, Christine A.; Leong, Edward; Costen, Nicholas P.; Sharp, Elmer; Adachi, Tomoko; Benford, Dominic J.

2012-01-01

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

Science.gov (United States)

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Experimental Verification of Guided-Wave Lumped Circuits Using Waveguide Metamaterials

Science.gov (United States)

Li, Yue; Zhang, Zhijun

2018-04-01

Through the construction and characterization in microwave frequencies, we experimentally demonstrate our recently developed theory of waveguide lumped circuits, i.e., waveguide metatronics [Sci. Adv. 2, e1501790 (2016), 10.1126/sciadv.1501790], as a method to design subwavelength-scaled analog circuits. In the paradigm of waveguide metatronics, numbers of lumped inductors and capacitors are easily integrated functionally inside the waveguide, which is an irreplaceable transmission line in millimeter-wave and terahertz systems with the advantages of low radiation loss and low crosstalk. An example of multiple-ordered metatronic filters with layered structures is fabricated utilizing the technique of substrate integrated waveguides, which can be easily constructed by the printed-circuit-board process. The materials used in the construction are also typical microwave materials with positive permittivity, low loss, and negligible dispersion, imitating the plasmonic materials with negative permittivity in the optical domain. The results verify the theory of waveguide metatronics, which provides an efficient platform of functional lumped circuit design for guided-wave processing.

CMOS Imaging of Pin-Printed Xerogel-Based Luminescent Sensor Microarrays.

Science.gov (United States)

Yao, Lei; Yung, Ka Yi; Khan, Rifat; Chodavarapu, Vamsy P; Bright, Frank V

2010-12-01

We present the design and implementation of a luminescence-based miniaturized multisensor system using pin-printed xerogel materials which act as host media for chemical recognition elements. We developed a CMOS imager integrated circuit (IC) to image the luminescence response of the xerogel-based sensor array. The imager IC uses a 26 × 20 (520 elements) array of active pixel sensors and each active pixel includes a high-gain phototransistor to convert the detected optical signals into electrical currents. The imager includes a correlated double sampling circuit and pixel address/digital control circuit; the image data is read-out as coded serial signal. The sensor system uses a light-emitting diode (LED) to excite the target analyte responsive luminophores doped within discrete xerogel-based sensor elements. As a prototype, we developed a 4 × 4 (16 elements) array of oxygen (O 2 ) sensors. Each group of 4 sensor elements in the array (arranged in a row) is designed to provide a different and specific sensitivity to the target gaseous O 2 concentration. This property of multiple sensitivities is achieved by using a strategic mix of two oxygen sensitive luminophores ([Ru(dpp) 3 ] 2+ and ([Ru(bpy) 3 ] 2+ ) in each pin-printed xerogel sensor element. The CMOS imager consumes an average power of 8 mW operating at 1 kHz sampling frequency driven at 5 V. The developed prototype system demonstrates a low cost and miniaturized luminescence multisensor system.

A flexible inkjet printed inverted-F antenna on textile

KAUST Repository

Karimi, Muhammad Akram; Shamim, Atif

2016-01-01

This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

A flexible inkjet printed inverted-F antenna on textile

KAUST Repository

Karimi, Muhammad Akram

2016-12-19

This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

Energy Technology Data Exchange (ETDEWEB)

Olesen, S. T.

1971-11-15

The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

The Use of 3D Printing in the Development of Gaseous Radiation Detectors

Science.gov (United States)

Fargher, Sam; Steer, Chris; Thompson, Lee

2018-01-01

Fused Deposition Modelling has been used to produce a small, single wire, Iarocci-style drift tube to demonstrate the feasibility of using the Additive Manufacturing technique to produce cheap detectors, quickly. Recent technological developments have extended the scope of Additive Manufacturing, or 3D printing, to the possibility of fabricating Gaseous Radiation Detectors, such as Single Wire Proportional Counters and Time Projection Chambers. 3D printing could allow for the production of customisable, modular detectors; that can be easily created and replaced and the possibility of printing detectors on-site in remote locations and even for outreach within schools. The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane) was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity.

Science.gov (United States)

Shen, Wenfeng; Zhang, Xianpeng; Huang, Qijin; Xu, Qingsong; Song, Weijie

2014-01-01

Silver nanoparticles (NPs) which could be kept in solid form and were easily stored without degeneration or oxidation at room temperature for a long period of time were synthesized by a simple and environmentally friendly wet chemistry method in an aqueous phase. Highly stable dispersions of aqueous silver NP inks, sintered at room temperature, for printing highly conductive tracks (∼8.0 μΩ cm) were prepared simply by dispersing the synthesized silver NP powder in water. These inks are stable, fairly homogeneous and suitable for a wide range of patterning techniques. The inks were successfully printed on paper and polyethylene terephthalate (PET) substrates using a common color printer. Upon annealing at 180 °C, the resistivity of the printed silver patterns decreased to 3.7 μΩ cm, which is close to twice that of bulk silver. Various factors affecting the resistivity of the printed silver patterns, such as annealing temperature and the number of printing cycles, were investigated. The resulting high conductivity of the printed silver patterns reached over 20% of the bulk silver value under ambient conditions, which enabled the fabrication of flexible electronic devices, as demonstrated by the inkjet printing of conductive circuits of LED devices.

Recycling of non-metallic fractions from waste printed circuit boards: A review

International Nuclear Information System (INIS)

Guo Jiuyong; Guo Jie; Xu Zhenming

2009-01-01

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Recycling of non-metallic fractions from waste printed circuit boards: A review

Energy Technology Data Exchange (ETDEWEB)

Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

2009-09-15

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Analysis of a gas turbine driven hybrid drive system for heavy vehicles

Energy Technology Data Exchange (ETDEWEB)

Malmquist, Anders

1999-07-01

The goal of this thesis has been to analyze the performance and behavior of a gas turbine driven hybrid drive train. The thesis covers both computer simulations and experimental tests. In two case studies, a number of measurements have been made on gas turbine driven hybrid vehicles that are developed by Volvo and ABB. In the recent years, much effort is currently put into the design and analysis of hybrid drive trains. Many studies involve computer simulations, but they are often made on a general level. This thesis concentrate on gas turbine driven hybrids for heavy vehicles, a field that has previously not been covered to a large extent in academic studies. A major contribution to the field of hybrid drive train design is the development of detailed simulation models that have a close connection to hybrids that are actually built and tested. The access to detailed gas turbine data has further enhanced the possibility to design a dynamic model of the gas turbine driven and the electric circuits. The combination of simulations and extensive field experience gains new knowledge on the properties of gas turbines in hybrid drive trains. Two simulation models have been developed in Matlab and Simulink. One is a quasi-steady state model that can be used for drive cycle simulations, e.g. a complete bus line. The other is a transient model that combines the thermodynamic properties of the gas turbine, the mechanical properties of the combined turbine-generator shaft, the electric power circuit and the control system. The transient model has been used to simulate the power response during accelerations and retardation. An analysis of the internal energy flows and the system efficiency of a hybrid drive train contributes to the understanding of the properties of series hybrid drive trains. An important part of the topology is that the system is based on a DC/DC-converter that is connected between the battery and the DC-bus. It controls the DC-bus voltage and by this

Wirelessly powered microfluidic dielectrophoresis devices using printable RF circuits.

Science.gov (United States)

Qiao, Wen; Cho, Gyoujin; Lo, Yu-Hwa

2011-03-21

We report the first microfluidic device integrated with a printed RF circuit so the device can be wirelessly powered by a commercially available RFID reader. For conventional dielectrophoresis devices, electrical wires are needed to connect the electric components on the microchip to external equipment such as power supplies, amplifiers, function generators, etc. Such a procedure is unfamiliar to most clinicians and pathologists who are used to working with a microscope for examination of samples on microscope slides. The wirelessly powered device reported here eliminates the entire need for wire attachments and external instruments so the operators can use the device in essentially the same manner as they do with microscope slides. The integrated circuit can be fabricated on a flexible plastic substrate at very low cost using a roll-to-roll printing method. Electrical power at 13.56 MHz transmitted by a radio-frequency identification (RFID) reader is inductively coupled to the printed RFIC and converted into 10 V DC (direct current) output, which provides sufficient power to drive a microfluidic device to manipulate biological particles such as beads and proteins via the DC dielectrophoresis (DC-DEP) effect. To our best knowledge, this is the first wirelessly powered microfluidic dielectrophoresis device. Although the work is preliminary, the device concept, the architecture, and the core technology are expected to stimulate many efforts in the future and transform the technology to a wide range of clinical and point-of-care applications. This journal is © The Royal Society of Chemistry 2011

Stabilization of electrohydrodynamic jets by gas discharges and applications to printing

Science.gov (United States)

Korkut, Sibel

From integrated circuits to DNA hybridization micro arrays, many areas of research require flexible and reliable, high resolution surface patterning tools. A new surface patterning technique, electrohydrodynamic printing (EHDP) [1] provides high resolution and speed at the same time, which was not attainable with the existing direct surface patterning techniques. Stability of electrohydrodynamic (EHD) jets determines the accuracy of deployment in EHD printing [1-3]; therefore, understanding non-axisymmetric instability of the jet, which is caused by the surface charges, is crucial to successful operation. In this thesis, fast imaging and image analysis techniques are used to determine non-axisymmetric disturbance growth rates experimentally. Comparison of experimental instability growth rates with the theoretical estimations based on total current reveals a big discrepancy. It is also found that instability growth rates decrease and stability of EHD filaments is enhanced either by decreasing the electrode separation or by changing the surrounding gas. After considering all possible mechanisms, it is concluded that the main reason for stabilization is the increased ionization of the surrounding gas. Gas ionization results in partial neutralization of surface charges on the filament by the oppositely charged ions in the gas phase and stabilizes the jet. A new current balance including the charge transfer through the gas is developed to estimate the charge density left on the filament. Experimental and theoretical instability growth rates agree much better when the estimated charge density is used for the instability growth rate calculations. The second part of the thesis focuses on pattern formation on the surfaces. The final pattern produced with a colloidal suspension by EHDP depends on not only the stability of the jet but also the dynamics of the suspension and the stability of printed lines after the deployment. Rivulet instability, which causes deployed

Materials Integration and Doping of Carbon Nanotube-based Logic Circuits

Science.gov (United States)

Geier, Michael

Over the last 20 years, extensive research into the structure and properties of single- walled carbon nanotube (SWCNT) has elucidated many of the exceptional qualities possessed by SWCNTs, including record-setting tensile strength, excellent chemical stability, distinctive optoelectronic features, and outstanding electronic transport characteristics. In order to exploit these remarkable qualities, many application-specific hurdles must be overcome before the material can be implemented in commercial products. For electronic applications, recent advances in sorting SWCNTs by electronic type have enabled significant progress towards SWCNT-based integrated circuits. Despite these advances, demonstrations of SWCNT-based devices with suitable characteristics for large-scale integrated circuits have been limited. The processing methodologies, materials integration, and mechanistic understanding of electronic properties developed in this dissertation have enabled unprecedented scales of SWCNT-based transistor fabrication and integrated circuit demonstrations. Innovative materials selection and processing methods are at the core of this work and these advances have led to transistors with the necessary transport properties required for modern circuit integration. First, extensive collaborations with other research groups allowed for the exploration of SWCNT thin-film transistors (TFTs) using a wide variety of materials and processing methods such as new dielectric materials, hybrid semiconductor materials systems, and solution-based printing of SWCNT TFTs. These materials were integrated into circuit demonstrations such as NOR and NAND logic gates, voltage-controlled ring oscillators, and D-flip-flops using both rigid and flexible substrates. This dissertation explores strategies for implementing complementary SWCNT-based circuits, which were developed by using local metal gate structures that achieve enhancement-mode p-type and n-type SWCNT TFTs with widely separated and

Vacuum-thermal-evaporation: the route for roll-to-roll production of large-area organic electronic circuits

International Nuclear Information System (INIS)

Taylor, D M

2015-01-01

Surprisingly little consideration is apparently being given to vacuum-evaporation as the route for the roll-to-roll (R2R) production of large-area organic electronic circuits. While considerable progress has been made by combining silicon lithographic approaches with solution processing, it is not obvious that these will be compatible with a low-cost, high-speed R2R process. Most efforts at achieving this ambition are directed at conventional solution printing approaches such as inkjet and gravure. This is surprising considering that vacuum-evaporation of organic semiconductors (OSCs) is already used commercially in the production of organic light emitting diode displays. Beginning from a discussion of the materials and geometrical parameters determining transistor performance and drawing on results from numerous publications, this review makes a case for vacuum-evaporation as an enabler of R2R organic circuit production. The potential of the vacuum route is benchmarked against solution approaches and found to be highly competitive. For example, evaporated small molecules tend to have higher mobility than printed OSCs. High resolution metal patterning on plastic films is already a low-cost commercial process for high-volume packaging applications. Similarly, solvent-free flash-evaporation and polymerization of thin films on plastic substrates is also a high-volume commercial process and has been shown capable of producing robust gate dielectrics. Reports of basic logic circuit elements produced in a vacuum R2R environment are reviewed and shown to be superior to all-solution printing approaches. Finally, the main issues that need to be resolved in order to fully develop the vacuum route to R2R circuit production are highlighted. (paper)

Inkjet printing and inkjet infiltration of functional coatings for SOFCs fabrication

Directory of Open Access Journals (Sweden)

Tomov Rumen I.

2016-01-01

Full Text Available Inkjet printing fabrication and modification of electrodes and electrolytes of SOFCs were studied. Electromagnetic print-heads were utilized to reproducibly dispense droplets of inks at rates of several kHz on demand. Printing parameters including pressure, nozzle opening time and drop spreading were studied in order to optimize the inks jetting and delivery. Scanning electron microscopy revealed highly conformal ~ 6-10 μm thick dense electrolyte layers routinely produced on cermet and metal porous supports. Open circuit voltages ranging from 0.95 to 1.01 V, and a maximum power density of ~180 mW.cm−2 were measured at 750 °C on Ni-8YSZ/YSZ/LSM single cell 50×50 mm in size. The effect of anode and cathode microstructures on the electrochemical performance was investigated. Two - step fabrication of the electrodes using inkjet printing infiltration was implemented. In the first step the porous electrode scaffold was created printing suspension composite inks. During the second step inkjet printing infiltration was utilized for controllable loading of active elements and a formation of nano-grid decorations on the scaffolds radically reducing the activation polarization losses of both electrodes. Symmetrical cells of both types were characterized by impedance spectroscopy in order to reveal the relation between the microstructure and the electrochemical performance.

Roll-offset printed transparent conducting electrode for organic solar cells

International Nuclear Information System (INIS)

Kim, Inyoung; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

2015-01-01

Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J sc ), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J sc . - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic solar

Roll-offset printed transparent conducting electrode for organic solar cells

Energy Technology Data Exchange (ETDEWEB)

Kim, Inyoung, E-mail: ikim@kimm.re.kr; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

2015-04-01

Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J{sub sc}), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J{sub sc}. - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic

Synthesis of pure colloidal silver nanoparticles with high electroconductivity for printed electronic circuits: the effect of amines on their formation in aqueous media.

Science.gov (United States)

Natsuki, Jun; Abe, Takao

2011-07-01

This paper describes a practical and convenient method to prepare stable colloidal silver nanoparticles for use in printed electronic circuits. The method uses a dispersant and two kinds of reducing agents including 2-(dimethylamino) ethanol (DMAE), which play important roles in the reduction of silver ions in an aqueous medium. The effect of DMAE and dispersant, as well as the factors affecting particle size and morphology are investigated. In the formation of the silver nanoparticles, reduction occurs rapidly at room temperature and the silver particles can be separated easily from the mixture in a short time. In addition, organic solvents are not used. Pure, small and relatively uniform particles with a diameter less than 10 nm can be obtained that exhibit high electroconductivity. The silver nanoparticles are stable, and can be isolated as a dried powder that can be fully redispersed in deionized water. This method of producing colloidal silver nanoparticles will find practical use in electronics applications. Copyright © 2011 Elsevier Inc. All rights reserved.

Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

Directory of Open Access Journals (Sweden)

Yi-Xuan Wang

2017-05-01

Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

Three-Dimensional Printing Model as a Tool to Assist in Surgery for Large Mandibular Tumour: a Case Report

Directory of Open Access Journals (Sweden)

Kazuyuki Yusa

2017-06-01

Full Text Available Objectives: Recently, three-dimensional printing models based on preoperative computed tomography and magnetic resonance imaging images have been widely used in medical fields. This study presents an effective use of the three-dimensional printing model in exploring complex spatial relationship between the tumour and surrounding tissue and in simulation surgery based planning of the operative procedure. Material and Methods: The patient was a 7-year-old boy with ameloblastic fibro-odontoma. Prior to surgery, a hybrid three-dimensional printing model consisting of the jaw bone, the tumour and the inferior alveolar nerve was fabricated. After the simulation surgery based on this model, enucleation of the tumour, leaving tooth 46 intact (Universal Numbering System by ADA safe, was planned. Results: Enucleation of the tumour was successfully carried out. One year later, healing was found to be satisfactory both clinically and radiographically. Conclusions: The study presented an effective application of a novel hybrid three-dimensional printing model composed of hard and soft tissues. Such innovations can bring significant benefits, especially to the field of oncological surgery.

3D printed flexible capacitive force sensor with a simple micro-controller based readout

NARCIS (Netherlands)

Schouten, Martijn G.; Sanders, Remco; Krijnen, Gijs

2017-01-01

This paper describes the development of a proof of principle of a flexible force sensor and the corresponding readout circuit. The flexible force sensor consists of a parallel plate capacitor that is 3D printed using regular and conductive thermoplastic poly-urethane (TPU). The capacitance change

Control of Evaporation Behavior of an Inkjet-Printed Dielectric Layer Using a Mixed-Solvent System

Science.gov (United States)

Yang, Hak Soon; Kang, Byung Ju; Oh, Je Hoon

2016-01-01

In this study, the evaporation behavior and the resulting morphology of inkjet-printed dielectric layers were controlled using a mixed-solvent system to fabricate uniform poly-4-vinylphenol (PVP) dielectric layers without any pinholes. The mixed-solvent system consisted of two different organic solvents: 1-hexanol and ethanol. The effects of inkjet-printing variables such as overlap condition, substrate temperature, and different printing sequences (continuous and interlacing printing methods) on the inkjet-printed dielectric layer were also investigated. Increasing volume fraction of ethanol (VFE) is likely to reduce the evaporation rate gradient and the drying time of the inkjet-printed dielectric layer; this diminishes the coffee stain effect and thereby improves the uniformity of the inkjet-printed dielectric layer. However, the coffee stain effect becomes more severe with an increase in the substrate temperature due to the enhanced outward convective flow. The overlap condition has little effect on the evaporation behavior of the printed dielectric layer. In addition, the interlacing printing method results in either a stronger coffee stain effect or wavy structures of the dielectric layers depending on the VFE of the PVP solution. All-inkjet-printed capacitors without electrical short circuiting can be successfully fabricated using the optimized PVP solution (VFE = 0.6); this indicates that the mixed-solvent system is expected to play an important role in the fabrication of high-quality inkjet-printed dielectric layers in various printed electronics applications.

Structural Integration of Silicon Solar Cells and Lithium-ion Batteries Using Printed Electronics

Science.gov (United States)

Kang, Jin Sung

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200°C in N 2 gas condition. The printed electrodes were made with various widths and thicknesses. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). Reliable dimensions for printed electronics were found from this study. Single-crystalline silicon solar cells were tested under four-point bending to find the feasibility of directly integrating them onto a carbon fiber/epoxy composite laminate. These solar cells were not able to withstand 0.2% strain. On the other hand, thin-film amorphous silicon solar cells were subjected to flexural fatigue loadings. The current density-voltage curves were analyzed at different cycles, and there was no noticeable degradation on its performance up to 100 cycles. A multifunctional composite laminate which can harvest and store solar energy was fabricated using printed electrodes. The integrated printed circuit board (PCB) was co-cured with a carbon/epoxy composite laminate by the vacuum bag molding process in an autoclave; an amorphous silicon solar cell and a thin-film solid state lithium-ion (Li-ion) battery were adhesively joined and electrically connected to a thin flexible PCB; and then the passive components such as resistors and diodes were electrically connected to the printed circuit board by silver pasting. Since a thin-film solid state Li-ion battery was not able to withstand tensile strain above 0.4%, thin Li-ion polymer batteries were tested under various mechanical loadings and environmental conditions to find the feasibility of using the polymer batteries for our multifunctional purpose. It was found that the Li-ion polymer batteries were stable under pressure and tensile loading without any noticeable degradation on its charge and discharge

A Bioactive Hydrogel and 3D Printed Polycaprolactone System for Bone Tissue Engineering

Directory of Open Access Journals (Sweden)

Ivan Hernandez

2017-07-01

Full Text Available In this study, a hybrid system consisting of 3D printed polycaprolactone (PCL filled with hydrogel was developed as an application for reconstruction of long bone defects, which are innately difficult to repair due to large missing segments of bone. A 3D printed gyroid scaffold of PCL allowed a larger amount of hydrogel to be loaded within the scaffolds as compared to 3D printed mesh and honeycomb scaffolds of similar volumes and strut thicknesses. The hydrogel was a mixture of alginate, gelatin, and nano-hydroxyapatite, infiltrated with human mesenchymal stem cells (hMSC to enhance the osteoconductivity and biocompatibility of the system. Adhesion and viability of hMSC in the PCL/hydrogel system confirmed its cytocompatibility. Biomineralization tests in simulated body fluid (SBF showed the nucleation and growth of apatite crystals, which confirmed the bioactivity of the PCL/hydrogel system. Moreover, dissolution studies, in SBF revealed a sustained dissolution of the hydrogel with time. Overall, the present study provides a new approach in bone tissue engineering to repair bone defects with a bioactive hybrid system consisting of a polymeric scaffold, hydrogel, and hMSC.

A Bioactive Hydrogel and 3D Printed Polycaprolactone System for Bone Tissue Engineering.

Science.gov (United States)

Hernandez, Ivan; Kumar, Alok; Joddar, Binata

2017-09-01

In this study, a hybrid system consisting of 3D printed polycaprolactone (PCL) filled with hydrogel was developed as an application for reconstruction of long bone defects, which are innately difficult to repair due to large missing segments of bone. A 3D printed gyroid scaffold of PCL allowed a larger amount of hydrogel to be loaded within the scaffolds as compared to 3D printed mesh and honeycomb scaffolds of similar volumes and strut thicknesses. The hydrogel was a mixture of alginate, gelatin, and nano-hydroxyapatite, infiltrated with human mesenchymal stem cells (hMSC) to enhance the osteoconductivity and biocompatibility of the system. Adhesion and viability of hMSC in the PCL/hydrogel system confirmed its cytocompatibility. Biomineralization tests in simulated body fluid (SBF) showed the nucleation and growth of apatite crystals, which confirmed the bioactivity of the PCL/hydrogel system. Moreover, dissolution studies, in SBF revealed a sustained dissolution of the hydrogel with time. Overall, the present study provides a new approach in bone tissue engineering to repair bone defects with a bioactive hybrid system consisting of a polymeric scaffold, hydrogel, and hMSC.

Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2015-06-15

Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

Science.gov (United States)

Zhan, Lu; Xu, Zhenming

2008-10-15

The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

Design of electrohydrodynamic lens for stabilizing of eletrohydrodynamic jet printing

International Nuclear Information System (INIS)

Park, Sung-Eun; Lee, Dae-Young; Kim, Sang-Yoon; Shin, Yoon-Soo; Hwang, Jungho; Yu, Tae-U

2008-01-01

The generation of micro patterns from conductive material suspensions is gaining significant interests for its usages in the fabrication of flexible display elements and flexible printed circuit boards. In this paper, we presented the results of line patterns of silver nanoparticles obtained by using various types of focusing lenses for electrohydrodynamic jet printing. The pattern widths were measured as 80∼100 μm when the electrohydrodynamic lens having a cone-type inner hole and a cone-type outer wall was used. Electric field strengths were calculated by a commercial solver packages for the four types of electrohydrodynamic lenses. A lens having a cone-type inner hole and a cone-type outer wall of thinner thickness was found to be the best design.

Digital multicolor printing: state of the art and future challenges

Science.gov (United States)

Kipphan, Helmut

1995-04-01

During the last 5 years, digital techniques have become extremely important in the graphic arts industry. All sections in the production flow for producing multicolor printed products - prepress, printing and postpress - are influenced by digitalization, in an evolutionary and revolutionary way. New equipment and network techniques bring all the sections closer together. The focus is put on high-quality multicolor printing, together with high productivity. Conventional offset printing technology is compared with the leading nonimpact printing technologies. Computer to press is contrasted with computer to print techniques. The newest available digital multicolor presses are described - the direct imaging offset printing press from HEIDELBERG with new laser imaging technique as well as the INDIGO and XEIKON presses based on electrophotography. Regarding technical specifications, economic calculations and print quality, it is worked out that each technique has its own market segments. An outlook is given for future computer to press techniques and the potential of nonimpact printing technologies for advanced high-speed multicolor computer to print equipment. Synergy effects from the NIP-technologies to the conventional printing technologies and vice versa are possible for building up innovative new products, for example hybrid printing systems. It is also shown that there is potential for improving the print quality, based on special screening algorithms, and a higher number of grey levels per pixel by using NIP-technologies. As an intermediate step in digitalization of the production flow, but also as an economical solution computer to plate equipment is described. By producing printed products totally in a digital way, digital color proofing as well as color management systems are needed. The newest high-tech equipment using NIP-technologies for producing proofs is explained. All in all it is shown that the state of the art in digital multicolor printing has reached

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

Science.gov (United States)

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

An in-house usage assessment of print reference materials in a ...

African Journals Online (AJOL)

The study investigated the utilization of print reference materials in a Nigerian hybrid medical school library, factors influencing utilization or under utilization, and if utilization commensurate with the library's prospect on the use of these materials. During the period of study, it was assumed that all reference materials pulled ...

Investigation of DC hybrid circuit breaker based on high-speed switch and arc generator

Science.gov (United States)

Wu, Yifei; Rong, Mingzhe; Wu, Yi; Yang, Fei; Li, Mei; Zhong, Jianying; Han, Guohui; Niu, Chunping; Hu, Yang

2015-02-01

A new design of DC hybrid circuit breaker based on high-speed switch (HSS) and arc generator (AG), which can drastically profit from low heat loss in normal state and fast current breaking under fault state, is presented and analyzed in this paper. AG is designed according to the magnetic pinch effect of liquid metal. By utilizing the arc voltage generated across AG, the fault current is rapidly commutated from HSS into parallel connected branch. As a consequence, the arcless open of HSS is achieved. The post-arc conducting resume time (Δ tc) of AG and the commutation original voltage (Uc), two key factors in the commutation process, are investigated experimentally. Particularly, influences of the liquid metal channel diameter (Φ) of AG, fault current rate of rise (di/dt) and Uc on Δ tc are focused on. Furthermore, a suitable Uc is determined during the current commutation process, aiming at the reliable arcless open of HSS and short breaking time. Finally, the fault current breaking test is carried out for the current peak value of 11.8 kA, and the validity of the design is confirmed by the experimental results.

Investigation of DC hybrid circuit breaker based on high-speed switch and arc generator.

Science.gov (United States)

Wu, Yifei; Rong, Mingzhe; Wu, Yi; Yang, Fei; Li, Mei; Zhong, Jianying; Han, Guohui; Niu, Chunping; Hu, Yang

2015-02-01

A new design of DC hybrid circuit breaker based on high-speed switch (HSS) and arc generator (AG), which can drastically profit from low heat loss in normal state and fast current breaking under fault state, is presented and analyzed in this paper. AG is designed according to the magnetic pinch effect of liquid metal. By utilizing the arc voltage generated across AG, the fault current is rapidly commutated from HSS into parallel connected branch. As a consequence, the arcless open of HSS is achieved. The post-arc conducting resume time (Δ tc) of AG and the commutation original voltage (Uc), two key factors in the commutation process, are investigated experimentally. Particularly, influences of the liquid metal channel diameter (Φ) of AG, fault current rate of rise (di/dt) and Uc on Δ tc are focused on. Furthermore, a suitable Uc is determined during the current commutation process, aiming at the reliable arcless open of HSS and short breaking time. Finally, the fault current breaking test is carried out for the current peak value of 11.8 kA, and the validity of the design is confirmed by the experimental results.

Wide Bandgap Semiconductor Based Solid State Smart Circuit Protection, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — Advanced solid state power component technology is necessary for future hybrid aircraft systems with increased power demands. There is a need for adequate circuit...

Effect of fin-endwall fillet on thermal hydraulic performance of airfoil printed circuit heat exchanger

International Nuclear Information System (INIS)

Ma, Ting; Xin, Fei; Li, Lei; Xu, Xiang-yang; Chen, Yi-tung; Wang, Qiu-wang

2015-01-01

Printed circuit heat exchanger (PCHE) is recommended to be used for intermediate heat exchanger in Very High Temperature Reactor (VHTR). One of the key features is that it is manufactured by the photochemical etching in order to maintain the internal structure and metal properties. In this paper, a photochemical etching experiment is conducted to manufacture the airfoil PCHE plate. The result indicates that the airfoil fin is not an ideal airfoil profile, but has a fin-endwall fillet. For the purpose of simplifying the numerical model and saving computational time, a validated model with a single fluid is used to further study the effect of fin-endwall fillet on the thermal hydraulic performance of airfoil PCHE. It is found that the fin-endwall fillet can increase the heat transfer and pressure drop in the cases with the non-dimensional longitudinal pitch being 1.63. The effect of fin-endwall fillet on thermal hydraulic performance decreases with the increase of transverse pitch, but the longitudinal pitch has little effect when the non-dimensional longitudinal pitch is greater than 1.88. In the studied cases, the maximum difference of Nusselt number and friction factor between the two models with and without fin-endwall fillet is up to 6.7% and 6.4%. - Highlights: • Fillets are formed in the endwall of airfoil fins during the photochemical etching. • Two-fluid model can be replaced by single-fluid model to perform simulation. • Fin-endwall fillet can increase heat transfer and pressure drop at ζ_l = 1.63. • Effect of fin-endwall fillet decreases as transverse pitch increases at ζ_l = 1.63. • Longitudinal pitch has little effect at ζ_l ≥ 1.88.

C-share: Optical circuits sharing for software-defined data-centers [arXiv

DEFF Research Database (Denmark)

Ben-Itzhak, Yaniv; Caba, Cosmin Marius; Schour, Liran

2016-01-01

Integrating optical circuit switches in data-centers is an ongoing research challenge. In recent years, state-of-the-art solutions introduce hybrid packet/circuit architectures for different optical circuit switch technologies, control techniques, and traffic rerouting methods. These solutions...... are based on separated packet and circuit planes which do not have the ability to utilize an optical circuit with flows that do not arrive from or delivered to switches directly connected to the circuit’s end-points. Moreover, current SDN-based elephant flow rerouting methods require a forwarding rule...... for each flow, which raise scalability issues. In this paper, we present C-Share - a practical, scalable SDN-based circuit sharing solution for data center networks. C-Share inherently enable elephant flows to share optical circuits by exploiting a flat upper tier network topology. C-Share is based...

Hybrid integrated sensor for position measurement

International Nuclear Information System (INIS)

Schmidt, B.; Schott, H.; Just, H.-J.

1986-01-01

The design, fabrication and performance of an integrated two-dimensional position sensitive photodetector are presented. The optoelectronic device used as sensitive element in the circuit is a full area position sensitive photodiode (PPD) with high linearity over the full sensitive area. The PPD is integrated with the analog electronics in a hybrid circuit using thick film technology. The analog electronics includes the signal amplification and the signal conditioning to form the output signals proportional to the light beam center position at the sensor surface and an output signal proportional to the light beam intensity. Using hybrid integration a new position sensitive transducer is developed giving output signals, transmiting in large distances without problems and driving directly actuators in any control system

Print Quality of Ink Jet Printed PVC Foils

Directory of Open Access Journals (Sweden)

Nemanja Kašiković

2015-09-01

Full Text Available Digital printing technique is used for a wide variety of substrates, one of which are PVC foils. Samples used in this research were printed by digital ink jet printing technique using Mimaki JV22 printing machine and J-Eco Subly Nano inks. As printing substrates, two different types of materials were used (ORACAL 640 - Print Vinyl and LG Hausys LP2712. A test card consisting of fields of CMYK colours was created and printed, varying the number of ink layers applied. Samples were exposed to light after the printing process. Spectrophotometric measurements were conducted before and after the light treatment. Based on spectrophotometricaly obtained data, colour differences ΔE2000 were calculated. Results showed that increasing number of layers, as well as the right choice of substrates, can improve the behaviour of printed product during exploitation.

Design and fabrication of advanced hybrid circuits for high energy physics

International Nuclear Information System (INIS)

Haller, G.M.; Moss, J.; Freytag, D.R.; Nelson, D.; Yim, A.; Lo, C.C.

1987-10-01

Current design and fabrication techniques of hybrid devices are explained for the Drift Chamber and the Liquid Argon Calorimeter for the Stanford Linear Collider Large Detector (SLD) at SLAC. Methods of developing layouts, ranging from hand-cut templates to advanced designs utilizing CAD tools with special hybrid design software were applied. Physical and electrical design rules for good yield and performance are discussed. Fabrication and assembly of the SLD hybrids are described. 7 refs., 10 figs

Design, Fabrication, and Testing of Active Skin Antenna with 3D Printing Array Framework

Directory of Open Access Journals (Sweden)

Jinzhu Zhou

2017-01-01

Full Text Available An active skin antenna with structural load-bearing and electromagnetic functions is usually installed in the structural surface of mobile vehicles such as aircrafts, warships, and high-speed train. This paper presents the design, fabrication, and testing of a novel active skin antenna which consists of an encapsulation shell, antenna skin, and RF and beam control circuits. The antenna skin which consists of the facesheet, honeycomb, array framework, and microstrip antenna elements was designed by using Bayesian optimization, in order to improve the design efficiency. An active skin antenna prototype with 32 microstrip antenna elements was fabricated by using a hybrid manufacturing method. In this method, 3D printing technology was applied to fabricate the array framework, and the different layers were bonded to form the final antenna skin by using traditional composite process. Some experimental testing was conducted, and the testing results validate the feasibility the proposed antenna skin structure. The proposed design and fabrication technique is suitable for the development of conformal load-bearing antenna or smart skin antenna installed in the structural surface of aircraft, warships, and armored vehicles.

Automated DNA electrophoresis, hybridization and detection

International Nuclear Information System (INIS)

Zapolski, E.J.; Gersten, D.M.; Golab, T.J.; Ledley, R.S.

1986-01-01

A fully automated, computer controlled system for nucleic acid hybridization analysis has been devised and constructed. In practice, DNA is digested with restriction endonuclease enzyme(s) and loaded into the system by pipette; 32 P-labelled nucleic acid probe(s) is loaded into the nine hybridization chambers. Instructions for all the steps in the automated process are specified by answering questions that appear on the computer screen at the start of the experiment. Subsequent steps are performed automatically. The system performs horizontal electrophoresis in agarose gel, fixed the fragments to a solid phase matrix, denatures, neutralizes, prehybridizes, hybridizes, washes, dries and detects the radioactivity according to the specifications given by the operator. The results, printed out at the end, give the positions on the matrix to which radioactivity remains hybridized following stringent washing

Skin-inspired hydrogel-elastomer hybrids with robust interfaces and functional microstructures

Science.gov (United States)

Yuk, Hyunwoo; Zhang, Teng; Parada, German Alberto; Liu, Xinyue; Zhao, Xuanhe

2016-06-01

Inspired by mammalian skins, soft hybrids integrating the merits of elastomers and hydrogels have potential applications in diverse areas including stretchable and bio-integrated electronics, microfluidics, tissue engineering, soft robotics and biomedical devices. However, existing hydrogel-elastomer hybrids have limitations such as weak interfacial bonding, low robustness and difficulties in patterning microstructures. Here, we report a simple yet versatile method to assemble hydrogels and elastomers into hybrids with extremely robust interfaces (interfacial toughness over 1,000 Jm-2) and functional microstructures such as microfluidic channels and electrical circuits. The proposed method is generally applicable to various types of tough hydrogels and diverse commonly used elastomers including polydimethylsiloxane Sylgard 184, polyurethane, latex, VHB and Ecoflex. We further demonstrate applications enabled by the robust and microstructured hydrogel-elastomer hybrids including anti-dehydration hydrogel-elastomer hybrids, stretchable and reactive hydrogel-elastomer microfluidics, and stretchable hydrogel circuit boards patterned on elastomer.

Equivalent circuit and characteristic simulation of a brushless electrically excited synchronous wind power generator

Science.gov (United States)

Wang, Hao; Zhang, Fengge; Guan, Tao; Yu, Siyang

2017-09-01

A brushless electrically excited synchronous generator (BEESG) with a hybrid rotor is a novel electrically excited synchronous generator. The BEESG proposed in this paper is composed of a conventional stator with two different sets of windings with different pole numbers, and a hybrid rotor with powerful coupling capacity. The pole number of the rotor is different from those of the stator windings. Thus, an analysis method different from that applied to conventional generators should be applied to the BEESG. In view of this problem, the equivalent circuit and electromagnetic torque expression of the BEESG are derived on the basis of electromagnetic relation of the proposed generator. The generator is simulated and tested experimentally using the established equivalent circuit model. The experimental and simulation data are then analyzed and compared. Results show the validity of the equivalent circuit model.

Nanoscale Resolution 3D Printing with Pin-Modified Electrified Inkjets for Tailorable Nano/Macrohybrid Constructs for Tissue Engineering.

Science.gov (United States)

Kim, Jeong In; Kim, Cheol Sang

2018-04-18

Cells respond to their microenvironment, which is of a size comparable to that of the cells. The macroscale features of three-dimensional (3D) printing struts typically result in whole cell contact guidance (CCG). In contrast, at the nanoscale, where features are of a size similar to that of receptors of cells, the response of cells is more complex. The cell-nanotopography interaction involves nanoscale adhesion localized structures, which include cell adhesion-related particles that change in response to the clustering of integrin. For this reason, it is necessary to develop a technique for manufacturing tailorable nano/macrohybrid constructs capable of freely controlling the cellular activity. In this study, a hierarchical 3D nano- to microscale hybrid structure was fabricated by combinational processing of 3D printing and electrified inkjet spinning via pin motions. This method overcomes the disadvantages of conventional 3D printing, providing a novel combinatory technique for the fabrication of 3D hybrid constructs with excellent cell proliferation. Through a pin-modified electrified inkjet spinning, we have successfully fabricated customizable nano-/microscale hybrid constructs in a fibrous or mesh form, which can control the cell fate. We have conducted this study of cell-topography interactions from the fabrication approach to accelerate the development of next-generation 3D scaffolds.

Evaluation of 320x240 pixel LEC GaAs Schottky barrier X-ray imaging arrays, hybridized to CMOS readout circuit based on charge integration

CERN Document Server

Irsigler, R; Alverbro, J; Borglind, J; Froejdh, C; Helander, P; Manolopoulos, S; O'Shea, V; Smith, K

1999-01-01

320x240 pixels GaAs Schottky barrier detector arrays were fabricated, hybridized to silicon readout circuits, and subsequently evaluated. The detector chip was based on semi-insulating LEC GaAs material. The square shaped pixel detector elements were of the Schottky barrier type and had a pitch of 38 mu m. The GaAs wafers were thinned down prior to the fabrication of the ohmic back contact. After dicing, the chips were indium bump, flip-chip bonded to CMOS readout circuits based on charge integration, and finally evaluated. A bias voltage between 50 and 100 V was sufficient to operate the detector. Results on I-V characteristics, noise behaviour and response to X-ray radiation are presented. Images of various objects and slit patterns were acquired by using a standard dental imaging X-ray source. The work done was a part of the XIMAGE project financed by the European Community (Brite-Euram). (author)

The online sealing performance test of the primary circuit pressure boundary check valve in nuclear power plants

International Nuclear Information System (INIS)

Yang Yunfei; Huang Huimin

2013-01-01

The primary circuit pressure boundary check valves of 320 MW pressurized water reactor is a nuclear grade I key equipment. The sealing demand is very high, which is directly related to the internal leakage rate of the primary circuit system. After the welding check valve is repaired, the sealing performance is judged by color printing checks. If there is water or humid vapor in the pipe, it will affect the accuracy of the color printing checks. For the particularity of the online check valve tightness test, online detecting device is designed by the hydraulic pressure drop method in other nuclear power plants, but the method has some shortcomings and restrictions. In this paper, we design a reliable and portable test equipment by the low-pressure gas seal test flow measurement, which make accurate and quantitative judgment of sealing property after the pressure boundary check valves are repaired. (authors)

Moving the boundary between wavelength resources in optical packet and circuit integrated ring network.

Science.gov (United States)

Furukawa, Hideaki; Miyazawa, Takaya; Wada, Naoya; Harai, Hiroaki

2014-01-13

Optical packet and circuit integrated (OPCI) networks provide both optical packet switching (OPS) and optical circuit switching (OCS) links on the same physical infrastructure using a wavelength multiplexing technique in order to deal with best-effort services and quality-guaranteed services. To immediately respond to changes in user demand for OPS and OCS links, OPCI networks should dynamically adjust the amount of wavelength resources for each link. We propose a resource-adjustable hybrid optical packet/circuit switch and transponder. We also verify that distributed control of resource adjustments can be applied to the OPCI ring network testbed we developed. In cooperation with the resource adjustment mechanism and the hybrid switch and transponder, we demonstrate that automatically allocating a shared resource and moving the wavelength resource boundary between OPS and OCS links can be successfully executed, depending on the number of optical paths in use.

Hybrid quantum computation

International Nuclear Information System (INIS)

Sehrawat, Arun; Englert, Berthold-Georg; Zemann, Daniel

2011-01-01

We present a hybrid model of the unitary-evolution-based quantum computation model and the measurement-based quantum computation model. In the hybrid model, part of a quantum circuit is simulated by unitary evolution and the rest by measurements on star graph states, thereby combining the advantages of the two standard quantum computation models. In the hybrid model, a complicated unitary gate under simulation is decomposed in terms of a sequence of single-qubit operations, the controlled-z gates, and multiqubit rotations around the z axis. Every single-qubit and the controlled-z gate are realized by a respective unitary evolution, and every multiqubit rotation is executed by a single measurement on a required star graph state. The classical information processing in our model requires only an information flow vector and propagation matrices. We provide the implementation of multicontrol gates in the hybrid model. They are very useful for implementing Grover's search algorithm, which is studied as an illustrative example.

SEMICONDUCTOR INTEGRATED CIRCUITS: A high performance 90 nm CMOS SAR ADC with hybrid architecture

Science.gov (United States)

Xingyuan, Tong; Jianming, Chen; Zhangming, Zhu; Yintang, Yang

2010-01-01

A 10-bit 2.5 MS/s SAR A/D converter is presented. In the circuit design, an R-C hybrid architecture D/A converter, pseudo-differential comparison architecture and low power voltage level shifters are utilized. Design challenges and considerations are also discussed. In the layout design, each unit resistor is sided by dummies for good matching performance, and the capacitors are routed with a common-central symmetry method to reduce the nonlin-earity error. This proposed converter is implemented based on 90 nm CMOS logic process. With a 3.3 V analog supply and a 1.0 V digital supply, the differential and integral nonlinearity are measured to be less than 0.36 LSB and 0.69 LSB respectively. With an input frequency of 1.2 MHz at 2.5 MS/s sampling rate, the SFDR and ENOB are measured to be 72.86 dB and 9.43 bits respectively, and the power dissipation is measured to be 6.62 mW including the output drivers. This SAR A/D converter occupies an area of 238 × 214 μm2. The design results of this converter show that it is suitable for multi-supply embedded SoC applications.

Logic circuits composed of flexible carbon nanotube thin-film transistor and ultra-thin polymer gate dielectric

Science.gov (United States)

Lee, Dongil; Yoon, Jinsu; Lee, Juhee; Lee, Byung-Hyun; Seol, Myeong-Lok; Bae, Hagyoul; Jeon, Seung-Bae; Seong, Hyejeong; Im, Sung Gap; Choi, Sung-Jin; Choi, Yang-Kyu

2016-05-01

Printing electronics has become increasingly prominent in the field of electronic engineering because this method is highly efficient at producing flexible, low-cost and large-scale thin-film transistors. However, TFTs are typically constructed with rigid insulating layers consisting of oxides and nitrides that are brittle and require high processing temperatures, which can cause a number of problems when used in printed flexible TFTs. In this study, we address these issues and demonstrate a method of producing inkjet-printed TFTs that include an ultra-thin polymeric dielectric layer produced by initiated chemical vapor deposition (iCVD) at room temperature and highly purified 99.9% semiconducting carbon nanotubes. Our integrated approach enables the production of flexible logic circuits consisting of CNT-TFTs on a polyethersulfone (PES) substrate that have a high mobility (up to 9.76 cm2 V-1 sec-1), a low operating voltage (less than 4 V), a high current on/off ratio (3 × 104), and a total device yield of 90%. Thus, it should be emphasized that this study delineates a guideline for the feasibility of producing flexible CNT-TFT logic circuits with high performance based on a low-cost and simple fabrication process.

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

Directory of Open Access Journals (Sweden)

Seok Young Ji

2018-02-01

Full Text Available The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations.

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

Science.gov (United States)

Ji, Seok Young; Choi, Wonsuk; Jeon, Jin-Woo; Chang, Won Seok

2018-01-01

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations. PMID:29425144

Simplifying the circuit of Josephson parametric converters

Science.gov (United States)

Abdo, Baleegh; Brink, Markus; Chavez-Garcia, Jose; Keefe, George

Josephson parametric converters (JPCs) are quantum-limited three-wave mixing devices that can play various important roles in quantum information processing in the microwave domain, including amplification of quantum signals, transduction of quantum information, remote entanglement of qubits, nonreciprocal amplification, and circulation of signals. However, the input-output and biasing circuit of a state-of-the-art JPC consists of bulky components, i.e. two commercial off-chip broadband 180-degree hybrids, four phase-matched short coax cables, and one superconducting magnetic coil. Such bulky hardware significantly hinders the integration of JPCs in scalable quantum computing architectures. In my talk, I will present ideas on how to simplify the JPC circuit and show preliminary experimental results

Hybrid Back Surface Reflector GaInAsSb Thermophotovoltaic Devices