WorldWideScience

Sample records for hybrid printed circuit

  1. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  2. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  3. "Printed-circuit" rectenna

    Science.gov (United States)

    Dickinson, R. M.

    1977-01-01

    Rectifying antenna is less bulky structure for absorbing transmitted microwave power and converting it into electrical current. Printed-circuit approach, using microstrip technology and circularly polarized antenna, makes polarization orientation unimportant and allows much smaller arrays for given performance. Innovation is particularly useful with proposed electric vehicles powered by beam microwaves.

  4. Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

    Science.gov (United States)

    Zheng, Yi; He, Zhizhu; Gao, Yunxia; Liu, Jing

    2013-01-01

    There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidized alloy ink was demonstrated to be flexibly printed on coated paper, which could compose various functional electronics and the concept of Printed-Circuits-on-Paper was thus presented. Further, RTV silicone rubber was adopted as isolating inks and packaging material to guarantee the functional stability of the circuit, which suggests an approach for printing 3D hybrid electro-mechanical device. The present work paved the way for a low cost and easygoing method in directly printing paper electronics.

  5. A guide to printed circuit board design

    CERN Document Server

    Hamilton, Charles

    1984-01-01

    A Guide to Printed Circuit Board Design discusses the basic design principles of printed circuit board (PCB). The book consists of nine chapters; each chapter provides both text discussion and illustration relevant to the topic being discussed. Chapter 1 talks about understanding the circuit diagram, and Chapter 2 covers how to compile component information file. Chapter 3 deals with the design layout, while Chapter 4 talks about preparing the master artworks. The book also covers generating computer aided design (CAD) master patterns, and then discusses how to prepare the production drawing a

  6. Improving Heat Transfer Performance of Printed Circuit Boards

    Science.gov (United States)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  7. CAD-CAM printed circuit board design

    Science.gov (United States)

    Agy, W. E.

    A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

  8. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    International Nuclear Information System (INIS)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; Hummelgård, Magnus; Olin, Håkan; Hummelgård, Christine

    2014-01-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  9. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    Science.gov (United States)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  10. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    Energy Technology Data Exchange (ETDEWEB)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik [Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Magnus; Olin, Håkan [Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Christine [Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  11. Printed organic thin-film transistor-based integrated circuits

    International Nuclear Information System (INIS)

    Mandal, Saumen; Noh, Yong-Young

    2015-01-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted. (paper)

  12. Printed circuits and their applications: Which way forward?

    Science.gov (United States)

    Cantatore, E.

    2015-09-01

    The continuous advancements in printed electronics make nowadays feasible the design of printed circuits which enable meaningful applications. Examples include ultra-low cost sensors embedded in food packaging, large-area sensing surfaces and biomedical assays. This paper offers an overview of state-of-the-art digital and analog circuit blocks, manufactured with a printed complementary organic TFT technology. An analog to digital converter and an RFID tag implemented exploiting these building blocks are also described. The main remaining drawbacks of the printed technology described are identified, and new approaches to further improve the state of the art, enabling more innovative applications are discussed.

  13. Modelling, analysis, and acceleration of a printed circuit board ...

    Indian Academy of Sciences (India)

    Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

    discuss lead time reduction in a qualitative way with illustrative case studies. Krishnan ... industry practices, and research questions that should drive new methods and computer ... There are three types of printed circuit boards available today.

  14. Printed circuits and their applications : Which way forward?

    NARCIS (Netherlands)

    Cantatore, Eugenio; Kratochvil, E.J.W.L.

    2015-01-01

    The continuous advancements in printed electronics make nowadays feasible the design of printed circuits which enable meaningful applications. Examples include ultra-low cost sensors embedded in food packaging, large-area sensing surfaces and biomedical assays. This paper offers an overview of

  15. Advanced engineering materials and thick film hybrid circuit technology

    International Nuclear Information System (INIS)

    Faisal, S.; Aslam, M.; Mehmood, K.

    2006-01-01

    The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

  16. Active Trimming of Hybrid Integrated Circuits

    OpenAIRE

    Németh, P.; Krémer, P.

    1984-01-01

    One of the more important fields of the microelectronics industry is the manufacturing of hybrid integrated circuits.An important part of the manufacturing process is concerned with the trimming of the hybrid integratedl circuits. This article deals with the basic principles of active trimming and introduces a microprocessor controlled trimming machine. By comparing active trimming with passive techniques, it can be shown that the active system has some advantages. This article outlines these...

  17. Development and verification of printed circuit board toroidal transformer model

    DEFF Research Database (Denmark)

    Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

    2013-01-01

    An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...... by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations...

  18. Hybrid 3D Printing of Soft Electronics.

    Science.gov (United States)

    Valentine, Alexander D; Busbee, Travis A; Boley, John William; Raney, Jordan R; Chortos, Alex; Kotikian, Arda; Berrigan, John Daniel; Durstock, Michael F; Lewis, Jennifer A

    2017-10-01

    Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  19. Printed circuit board permittivity measurement using waveguide and resonator rings

    NARCIS (Netherlands)

    Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

    2014-01-01

    Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

  20. Gas microstrip detectors based on flexible printed circuit

    International Nuclear Information System (INIS)

    Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

    1995-09-01

    We have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. We describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. We also describe two new passivation materials, Tantalum and Niobium, which produce effective surfaces. (author)

  1. Printed Graphene Derivative Circuits as Passive Electrical Filters

    Directory of Open Access Journals (Sweden)

    Dogan Sinar

    2018-02-01

    Full Text Available The objective of this study is to inkjet print resistor-capacitor (RC low pass electrical filters, using a novel water-based cellulose graphene ink, and compare the voltage-frequency and transient behavior to equivalent circuits constructed from discrete passive components. The synthesized non-toxic graphene-carboxymethyl cellulose (G-CMC ink is deposited on mechanically flexible polyimide substrates using a customized printer that dispenses functionalized aqueous solutions. The design of the printed first-order and second-order low-pass RC filters incorporate resistive traces and interdigitated capacitors. Low pass filter characteristics, such as time constant, cut-off frequency and roll-off rate, are determined for comparative analysis. Experiments demonstrate that for low frequency applications (<100 kHz the printed graphene derivative circuits performed as well as the circuits constructed from discrete resistors and capacitors for both low pass filter and RC integrator applications. The impact of mechanical stress due to bending on the electrical performance of the flexible printed circuits is also investigated.

  2. Merging polygons on two-layer printed circuit board

    Directory of Open Access Journals (Sweden)

    Murov S. Yu.

    2011-12-01

    Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

  3. A Printed Organic Circuit System for Wearable Amperometric Electrochemical Sensors.

    Science.gov (United States)

    Shiwaku, Rei; Matsui, Hiroyuki; Nagamine, Kuniaki; Uematsu, Mayu; Mano, Taisei; Maruyama, Yuki; Nomura, Ayako; Tsuchiya, Kazuhiko; Hayasaka, Kazuma; Takeda, Yasunori; Fukuda, Takashi; Kumaki, Daisuke; Tokito, Shizuo

    2018-04-23

    Wearable sensor device technologies, which enable continuous monitoring of biological information from the human body, are promising in the fields of sports, healthcare, and medical applications. Further thinness, light weight, flexibility and low-cost are significant requirements for making the devices attachable onto human tissues or clothes like a patch. Here we demonstrate a flexible and printed circuit system consisting of an enzyme-based amperometric sensor, feedback control and amplification circuits based on organic thin-film transistors. The feedback control and amplification circuits based on pseudo-CMOS inverters were successfuly integrated by printing methods on a plastic film. This simple system worked very well like a potentiostat for electrochemical measurements, and enabled the quantitative and real-time measurement of lactate concentration with high sensitivity of 1 V/mM and a short response time of a hundred seconds.

  4. Highly Conductive Nano-Silver Circuits by Inkjet Printing

    Science.gov (United States)

    Zhu, Dongbin; Wu, Minqiang

    2018-06-01

    Inkjet technology has become popular in the field of printed electronics due to its superior properties such as simple processes and printable complex patterns. Electrical conductivity of the circuits is one of the key factors in measuring the performance of printed electronics, which requires great material properties and a manufactured process. With excellent conductivity and ductility, silver is an ideal material as the wire connecting components. This review summarizes the progress of conductivity studies on inkjet printed nano-silver lines, including ink composition and nanoparticle morphology, deposition of nano-silver lines with uniform and high aspect ratios, sintering mechanisms and alternative methods of thermal sintering. Finally, the research direction on inkjet printed electronics is proposed.

  5. Printed Graphene Derivative Circuits as Passive Electrical Filters.

    Science.gov (United States)

    Sinar, Dogan; Knopf, George K

    2018-02-23

    The objective of this study is to inkjet print resistor-capacitor ( RC ) low pass electrical filters, using a novel water-based cellulose graphene ink, and compare the voltage-frequency and transient behavior to equivalent circuits constructed from discrete passive components. The synthesized non-toxic graphene-carboxymethyl cellulose (G-CMC) ink is deposited on mechanically flexible polyimide substrates using a customized printer that dispenses functionalized aqueous solutions. The design of the printed first-order and second-order low-pass RC filters incorporate resistive traces and interdigitated capacitors. Low pass filter characteristics, such as time constant, cut-off frequency and roll-off rate, are determined for comparative analysis. Experiments demonstrate that for low frequency applications (graphene derivative circuits performed as well as the circuits constructed from discrete resistors and capacitors for both low pass filter and RC integrator applications. The impact of mechanical stress due to bending on the electrical performance of the flexible printed circuits is also investigated.

  6. PUZZLE - A program for computer-aided design of printed circuit artwork

    Science.gov (United States)

    Harrell, D. A. W.; Zane, R.

    1971-01-01

    Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

  7. Gas microstrip detectors based on flexible printed circuit

    International Nuclear Information System (INIS)

    Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

    1995-09-01

    Microstrip Gas Detectors (MSGC's) were introduced some years ago as position sensitive detectors capable of operating at very high rates. The authors have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. They describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. They also describe two new passivation materials, tantalum and niobium, which produce effective surfaces

  8. Improving intrinsic corrosion reliability of printed circuit board assembly

    DEFF Research Database (Denmark)

    Ambat, Rajan; Conseil, Helene

    2016-01-01

    conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

  9. Organic printed photonics: From microring lasers to integrated circuits.

    Science.gov (United States)

    Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

    2015-09-01

    A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

  10. Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

    Directory of Open Access Journals (Sweden)

    V.C. Ho

    2003-01-01

    Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

  11. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    International Nuclear Information System (INIS)

    Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

    2011-01-01

    Highlights: → This paper presents new and important data on characterization of wastes of electric and electronic equipments. → Copper concentration is increasing in mobile phones and remaining constant in personal computers. → Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results

  12. Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

    Science.gov (United States)

    Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

    2017-07-05

    When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

  13. Fast optoelectric printing of plasmonic nanoparticles into tailored circuits

    Science.gov (United States)

    Rodrigo, José A.

    2017-04-01

    Plasmonic nanoparticles are able to control light at nanometre-scale by coupling electromagnetic fields to the oscillations of free electrons in metals. Deposition of such nanoparticles onto substrates with tailored patterns is essential, for example, in fabricating plasmonic structures for enhanced sensing. This work presents an innovative micro-patterning technique, based on optoelectic printing, for fast and straightforward fabrication of curve-shaped circuits of plasmonic nanoparticles deposited onto a transparent electrode often used in optoelectronics, liquid crystal displays, touch screens, etc. We experimentally demonstrate that this kind of plasmonic structure, printed by using silver nanoparticles of 40 nm, works as a plasmonic enhanced optical device allowing for polarized-color-tunable light scattering in the visible. These findings have potential applications in biosensing and fabrication of future optoelectronic devices combining the benefits of plasmonic sensing and the functionality of transparent electrodes.

  14. Packaging printed circuit boards: A production application of interactive graphics

    Science.gov (United States)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  15. [Flexible print circuit technology application in biomedical engineering].

    Science.gov (United States)

    Jiang, Lihua; Cao, Yi; Zheng, Xiaolin

    2013-06-01

    Flexible print circuit (FPC) technology has been widely applied in variety of electric circuits with high precision due to its advantages, such as low-cost, high specific fabrication ability, and good flexibility, etc. Recently, this technology has also been used in biomedical engineering, especially in the development of microfluidic chip and microelectrode array. The high specific fabrication can help making microelectrode and other micro-structure equipment. And good flexibility allows the micro devices based on FPC technique to be easily packaged with other parts. In addition, it also reduces the damage of microelectrodes to the tissue. In this paper, the application of FPC technology in biomedical engineering is introduced. Moreover, the important parameters of FPC technique and the development trend of prosperous applications is also discussed.

  16. Application of parallel processing for automatic inspection of printed circuits

    International Nuclear Information System (INIS)

    Lougheed, R.M.

    1986-01-01

    Automated visual inspection of printed electronic circuits is a challenging application for image processing systems. Detailed inspection requires high speed analysis of gray scale imagery along with high quality optics, lighting, and sensing equipment. A prototype system has been developed and demonstrated at the Environmental Research Institute of Michigan (ERIM) for inspection of multilayer thick-film circuits. The central problem of real-time image processing is solved by a special-purpose parallel processor which includes a new high-speed Cytocomputer. In this chapter the inspection process and the algorithms used are summarized, along with the functional requirements of the machine vision system. Next, the parallel processor is described in detail and then performance on this application is given

  17. Hybrid CMOS/Molecular Integrated Circuits

    Science.gov (United States)

    Stan, M. R.; Rose, G. S.; Ziegler, M. M.

    CMOS silicon technologies are likely to run out of steam in the next 10-15 years despite revolutionary advances in the past few decades. Molecular and other nanoscale technologies show significant promise but it is unlikely that they will completely replace CMOS, at least in the near term. This chapter explores opportunities for using CMOS and nanotechnology to enhance and complement each other in hybrid circuits. As an example of such a hybrid CMOS/nano system, a nanoscale programmable logic array (PLA) based on majority logic is described along with its supplemental CMOS circuitry. It is believed that such systems will be able to sustain the historical advances in the semiconductor industry while addressing manufacturability, yield, power, cost, and performance challenges.

  18. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mitra, Kalyan Yoti, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de; Sowade, Enrico, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Martínez-Domingo, Carme [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra, Spain and Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Ramon, Eloi, E-mail: eloi.ramon@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Carrabina, Jordi, E-mail: jordi.carrabina@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Gomes, Henrique Leonel, E-mail: hgomes@ualg.pt [Universidade do Algarve, Institute of Telecommunications, Faro (Portugal); Baumann, Reinhard R., E-mail: reinhard.baumann@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Fraunhofer Institute for Electronic Nano Systems (ENAS), Department of Printed Functionalities, Chemnitz (Germany)

    2015-02-17

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

  19. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    International Nuclear Information System (INIS)

    Mitra, Kalyan Yoti; Sowade, Enrico; Martínez-Domingo, Carme; Ramon, Eloi; Carrabina, Jordi; Gomes, Henrique Leonel; Baumann, Reinhard R.

    2015-01-01

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit

  20. Circuit QED with hybrid metamaterial transmission lines

    Energy Technology Data Exchange (ETDEWEB)

    Ruloff, Stefan; Taketani, Bruno; Wilhelm, Frank [Theoretical Physics, Universitaet des Saarlandes, Saarbruecken (Germany)

    2016-07-01

    We're working on the theory of metamaterials providing some interesting results. The negative refraction index causes an opposite orientation of the wave vector k and the Poynting vector S of the travelling waves. Hence the metamaterial has a falling dispersion relation ∂ω(k)/∂k < 0 implying that low frequencies correspond to short wavelengths. Metamaterials are simulated by left-handed transmission lines consisting of discrete arrays of series capacitors and parallel inductors to ground. Unusual physics arises when right-and left-handed transmission lines are coupled forming a hybrid metamaterial transmission line. E.g. if a qubit is placed in front of a hybrid metamaterial transmission line terminated in an open circuit, the spontaneous emission rate is weakened or unaffected depending on the transition frequency of the qubit. Some other research interests are the general analysis of metamaterial cavities and the mode structure of hybrid metamaterial cavities for QND readout of multi-qubit operators. Especially the precise answer to the question about the definition of the mode volume of a metamaterial cavity is one of our primary goals.

  1. Inkjet printed large-area flexible circuits: a simple methodology for optimizing the printing quality

    Science.gov (United States)

    Cheng, Tao; Wu, Youwei; Shen, Xiaoqin; Lai, Wenyong; Huang, Wei

    2018-01-01

    In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjet-printed silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics. Project supported by the National Key Basic Research Program of China (Nos. 2014CB648300, 2017YFB0404501), the National Natural Science Foundation of China (Nos. 21422402, 21674050), the Natural Science Foundation of Jiangsu Province (Nos. BK20140060, BK20130037, BK20140865, BM2012010), the Program for Jiangsu Specially-Appointed Professors (No. RK030STP15001), the Program for New Century Excellent Talents in University (No. NCET-13-0872), the NUPT "1311 Project" and Scientific Foundation (Nos. NY213119, NY213169), the Synergetic Innovation Center for Organic Electronics and Information Displays, the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), the Leading Talent of Technological Innovation of National Ten-Thousands Talents Program of China, the Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions (No. TJ217038), the Program for Graduate Students Research and Innovation of Jiangsu Province (No. KYZZ16-0253), and the 333 Project of Jiangsu Province (Nos. BRA2017402, BRA2015374).

  2. Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology.

    Science.gov (United States)

    Fukuda, Kenjiro; Someya, Takao

    2017-07-01

    Printed electronics enable the fabrication of large-scale, low-cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high-speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin-film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high-resolution printing technologies and strategies to enable high-resolution patterning. The main focus of this report is on obtaining printed electrodes with high-resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  3. Microwaves integrated circuits: hybrids and monolithics - fabrication technology

    International Nuclear Information System (INIS)

    Cunha Pinto, J.K. da

    1983-01-01

    Several types of microwave integrated circuits are presented together with comments about technologies and fabrication processes; advantages and disadvantages in their utilization are analysed. Basic structures, propagation modes, materials used and major steps in the construction of hybrid thin film and monolithic microwave integrated circuits are described. Important technological applications are revised and main activities of the microelectronics lab. of the University of Sao Paulo (Brazil) in the field of hybrid and monolithic microwave integrated circuits are summarized. (C.L.B.) [pt

  4. A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

    International Nuclear Information System (INIS)

    Noorliyana, H.A.; Zaheruddin, K.; Mohd Fazlul Bari; M. Sri Asliza; Nurhidayah, A.Z.; Kamarudin, H.

    2009-01-01

    Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

  5. PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

    Directory of Open Access Journals (Sweden)

    Hellington Bastos da Silva de Sant’ana

    2015-07-01

    Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

  6. Waste printed circuit board recycling techniques and product utilization

    International Nuclear Information System (INIS)

    Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

    2015-01-01

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

  7. Recovery of high purity precious metals from printed circuit boards

    International Nuclear Information System (INIS)

    Park, Young Jun; Fray, Derek J.

    2009-01-01

    Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

  8. Advances in Current Rating Techniques for Flexible Printed Circuits

    Science.gov (United States)

    Hayes, Ron

    2014-01-01

    Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

  9. A microelectromechanical accelerometer fabricated using printed circuit processing techniques

    Science.gov (United States)

    Rogers, J. E.; Ramadoss, R.; Ozmun, P. M.; Dean, R. N.

    2008-01-01

    A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52.

  10. A microelectromechanical accelerometer fabricated using printed circuit processing techniques

    International Nuclear Information System (INIS)

    Rogers, J E; Ramadoss, R; Ozmun, P M; Dean, R N

    2008-01-01

    A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52

  11. Waste printed circuit board recycling techniques and product utilization

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

    2015-02-11

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

  12. Inkjet-printed conductive features for rapid integration of electronic circuits in centrifugal microfluidics

    CSIR Research Space (South Africa)

    Kruger, J

    2015-05-01

    Full Text Available This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which...

  13. Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

    Energy Technology Data Exchange (ETDEWEB)

    Yoon, Su-Jong [Idaho National Lab. (INL), Idaho Falls, ID (United States); Sabharwall, Piyush [Idaho National Lab. (INL), Idaho Falls, ID (United States); Kim, Eung-Soo [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2013-09-01

    The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.

  14. Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

  15. Development of a miniaturized watch-type dosimeter using a silicon printed-circuit board

    International Nuclear Information System (INIS)

    Ishikura, Takeshi; Sakamaki, Tsuyoshi; Matsumoto, Iwao; Aoyama, Kei; Nakamura, Takashi

    2008-01-01

    The electrical personal dosimeter using a silicon semiconductor sensor has the advantage of real time response and alarm function, which can prevent unexpected over-exposure. We tried to develop a miniaturized watch-type dosimeter by incorporating the silicon semiconductor sensor on a silicon printed-circuit board. Thin film resistors, capacitors and wiring patterns are formed on a downsized printed-circuit board. Electronic parts including transistors are mounted by soldering on the silicon printed-circuit board. The dosimeter is further miniaturized by downsizing the amplifier circuit, the semiconductor radiation sensor, the power supply circuit, setting parts and alarm part. The performance of the developed dosimeter was evaluated with respect to the gamma-ray spectra, angular dependence and linearity to dose equivalent rate, and it was confirmed that this dosimeter has the performance equivalent to a commercially available electrical personal dosimeter. (author)

  16. Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

    Directory of Open Access Journals (Sweden)

    M. Elsobky

    2017-09-01

    Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

  17. Application specific integrated circuits and hybrid micro circuits for nuclear instrumentation

    International Nuclear Information System (INIS)

    Chandratre, V.B.; Sukhwani, Menka; Mukhopadhyay, P.K.; Shastrakar, R.S.; Sudheer, M.; Shedam, V.; Keni, Anubha

    2009-01-01

    Rapid development in semiconductor technology, sensors, detectors and requirements of high energy physics experiments as well as advances in commercially available nuclear instruments have lead to challenges for instrumentation. These challenges are met with development of Application Specific Integrated Circuits and Hybrid Micro Circuits. This paper discusses various activities in ASIC and HMC development in Bhabha Atomic Research Centre. (author)

  18. Hybrid integrated circuit for charge-to-time interval conversion

    Energy Technology Data Exchange (ETDEWEB)

    Basiladze, S.G.; Dotsenko, Yu.Yu.; Man' yakov, P.K.; Fedorchenko, S.N. (Joint Inst. for Nuclear Research, Dubna (USSR))

    The hybrid integrated circuit for charge-to time interval conversion with nanosecond input fast response is described. The circuit can be used in energy measuring channels, time-to-digital converters and in the modified variant in amplitude-to-digital converters. The converter described consists of a buffer amplifier, a linear transmission circuit, a direct current source and a unit of time interval separation. The buffer amplifier represents a current follower providing low input and high output resistances by the current feedback. It is concluded that the described converter excelled the QT100B circuit analogous to it in a number of parameters especially, in thermostability.

  19. Experimental and numerical study of a printed circuit heat exchanger

    International Nuclear Information System (INIS)

    Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Shi, Shanbin; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

    2016-01-01

    Highlights: • A dynamic model is developed for transient analysis of the straight-channel PCHE. • Transient scenarios of the straight-channel PCHE subject to helium temperature and mass flow rate variations are numerically investigated. • Steady-state temperature distribution inside the straight-channel PCHE is obtained in calculation. • Experiments are conducted to study the dynamic behavior of the straight-channel PCHE. - Abstract: Printed circuit heat exchangers (PCHEs) are promising to be employed in very-high-temperature gas-cooled reactors (VHTRs) due to their high robustness for high-temperature, high-pressure applications and high compactness. PCHEs typically serve as intermediate heat exchangers (IHXs) that isolate the secondary loop from the reactor’s primary system and hence must be sufficiently robust to maintain the system integrity during normal and off-normal conditions. In addition, the performance of the PCHE-type IHX could considerably affect the nuclear power plant overall operation since any transients on the secondary side would be propagated back to the reactor’s primary coolant system via the IHX. It is therefore imperative to understand how the PCHE would dynamically respond to a variety of transients. In the current study, experiments were first conducted to examine the steady-state thermal performance of a reduced-scale straight-channel PCHE. A dynamic model benchmarked in a previous study was then used to predict the steady-state and transient behavior of the PCHE. The steady-state temperature profiles of the working fluids on both the hot and cold sides and in the solid plates of the heat exchanger were obtained, which served as the initial condition for the transient simulations. The detailed dynamic response of the straight-channel PCHE, subject to inlet temperature variations, helium mass flow variations, and combinations of the two, was simulated and analyzed. In addition, two sets of transient tests, one for helium inlet

  20. Hybrid Direct-Current Circuit Breaker

    Science.gov (United States)

    Wang, Ruxi (Inventor); Premerlani, William James (Inventor); Caiafa, Antonio (Inventor); Pan, Yan (Inventor)

    2017-01-01

    A circuit breaking system includes a first branch including at least one solid-state snubber; a second branch coupled in parallel to the first branch and including a superconductor and a cryogenic contactor coupled in series; and a controller operatively coupled to the at least one solid-state snubber and the cryogenic contactor and programmed to, when a fault occurs in the load circuit, activate the at least one solid-state snubber for migrating flow of the electrical current from the second branch to the first branch, and, when the fault is cleared in the load circuit, activate the cryogenic contactor for migrating the flow of the electrical current from the first branch to the second branch.

  1. Hybrid Circuit QED with Electrons on Helium

    Science.gov (United States)

    Yang, Ge

    Electrons on helium (eHe) is a 2-dimensional system that forms naturally at the interface between superfluid helium and vacuum. It has the highest measured electron mobility, and long predicted spin coherence time. In this talk, we will first review various quantum computer architecture proposals that take advantage of these exceptional properties. In particular, we describe how electrons on helium can be combined with superconducting microwave circuits to take advantage of the recent progress in the field of circuit quantum electrodynamics (cQED). We will then demonstrate how to reliably trap electrons on these devices hours at a time, at millikelvin temperatures inside a dilution refrigerator. The coupling between the electrons and the microwave resonator exceeds 1 MHz, and can be reproduced from the design geometry using our numerical simulation. Finally, we will present our progress on isolating individual electrons in such circuits, to build single-electron quantum dots with electrons on helium.

  2. Hybrid 3D printing by bridging micro/nano processes

    International Nuclear Information System (INIS)

    Yoon, Hae-Sung; Jang, Ki-Hwan; Kim, Eunseob; Lee, Hyun-Taek; Ahn, Sung-Hoon

    2017-01-01

    A hybrid 3D printing process was developed for multiple-material/freeform nano-scale manufacturing. The process consisted of aerodynamically focused nanoparticle (AFN) printing, micro-machining, focused ion beam milling, and spin-coating. Theoretical and experimental investigations were carried out to improve the compatibility of each of the processes, enabling bridging of various different techniques. The resulting hybrid process could address the limitations of individual processes, enabling improved process scaling and dimensional degrees of freedom, without losing the advantages of the existing processes. The minimum structure width can be reduced to 50 nm using undercut structures. In addition, AFN printing employs particle impact for adhesion, and various inorganic materials are suitable for printing, including metals and functional ceramics. Using the developed system, we fabricated bi-material cantilevers for applications as a thermal actuator. The mechanical and thermal properties of the structure were investigated using an in situ measurement system, and irregular thermal phenomena due to the fabrication process were analyzed. We expect that this work will lead to improvements in the area of customized nano-scale manufacturing, as well as further improvements in manufacturing technology by combining different fabrication techniques. (paper)

  3. Hybrid 3D printing by bridging micro/nano processes

    Science.gov (United States)

    Yoon, Hae-Sung; Jang, Ki-Hwan; Kim, Eunseob; Lee, Hyun-Taek; Ahn, Sung-Hoon

    2017-06-01

    A hybrid 3D printing process was developed for multiple-material/freeform nano-scale manufacturing. The process consisted of aerodynamically focused nanoparticle (AFN) printing, micro-machining, focused ion beam milling, and spin-coating. Theoretical and experimental investigations were carried out to improve the compatibility of each of the processes, enabling bridging of various different techniques. The resulting hybrid process could address the limitations of individual processes, enabling improved process scaling and dimensional degrees of freedom, without losing the advantages of the existing processes. The minimum structure width can be reduced to 50 nm using undercut structures. In addition, AFN printing employs particle impact for adhesion, and various inorganic materials are suitable for printing, including metals and functional ceramics. Using the developed system, we fabricated bi-material cantilevers for applications as a thermal actuator. The mechanical and thermal properties of the structure were investigated using an in situ measurement system, and irregular thermal phenomena due to the fabrication process were analyzed. We expect that this work will lead to improvements in the area of customized nano-scale manufacturing, as well as further improvements in manufacturing technology by combining different fabrication techniques.

  4. Hybrid 3D-2D printing for bone scaffolds fabrication

    Science.gov (United States)

    Seleznev, V. A.; Prinz, V. Ya

    2017-02-01

    It is a well-known fact that bone scaffold topography on micro- and nanometer scale influences the cellular behavior. Nano-scale surface modification of scaffolds allows the modulation of biological activity for enhanced cell differentiation. To date, there has been only a limited success in printing scaffolds with micro- and nano-scale features exposed on the surface. To improve on the currently available imperfect technologies, in our paper we introduce new hybrid technologies based on a combination of 2D (nano imprint) and 3D printing methods. The first method is based on using light projection 3D printing and simultaneous 2D nanostructuring of each of the layers during the formation of the 3D structure. The second method is based on the sequential integration of preliminarily created 2D nanostructured films into a 3D printed structure. The capabilities of the developed hybrid technologies are demonstrated with the example of forming 3D bone scaffolds. The proposed technologies can be used to fabricate complex 3D micro- and nanostructured products for various fields.

  5. Unit: Electric Circuits, Inspection Pack, National Trial Print.

    Science.gov (United States)

    Australian Science Education Project, Toorak, Victoria.

    As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

  6. A Hybrid, Current-Source/Voltage-Source Power Inverter Circuit

    DEFF Research Database (Denmark)

    Trzynadlowski, Andrzej M.; Patriciu, Niculina; Blaabjerg, Frede

    2001-01-01

    A combination of a large current-source inverter and a small voltage-source inverter circuits is analyzed. The resultant hybrid inverter inherits certain operating advantages from both the constituent converters. In comparison with the popular voltage-source inverter, these advantages include...... reduced switching losses, improved quality of output current waveforms, and faster dynamic response to current control commands. Description of operating principles and characteristics of the hybrid inverter is illustrated with results of experimental investigation of a laboratory model....

  7. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    Directory of Open Access Journals (Sweden)

    Marcos Paulo Kohler Caldas

    2015-06-01

    Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

  8. Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

    Science.gov (United States)

    Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

    2015-05-01

    Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

  9. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    Science.gov (United States)

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  10. Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

    DEFF Research Database (Denmark)

    Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

    2015-01-01

    A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

  11. Effect of ionic contamination on climatic reliability of printed circuit board assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2012-01-01

    The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

  12. An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

    International Nuclear Information System (INIS)

    Combet, M.; Eder, J.; Pagny, C.

    1974-12-01

    A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

  13. Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

    DEFF Research Database (Denmark)

    Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

    2013-01-01

    The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

  14. Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

    International Nuclear Information System (INIS)

    LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

    1999-01-01

    We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

  15. Development of an Economical Interfacing Circuit for Upgrading of SEM Data Printing System

    International Nuclear Information System (INIS)

    Punnachaiya, S.; Thong-Aram, D.

    2002-01-01

    The operating conditions of a Scanning Electron Microscope (SEM) i.e., magnification, accelerating voltage, micron mark and film identification labeling, are very important for the accurate interpretation of a micrograph picture. In the old model SEM, the built-in data printing system for film identification can be inputted only the numerical number. This will be made a confusing problems when various operating conditions were applied in routine work. An economical interfacing circuit, therefore, was developed to upgrade the data printing system for capable of alphanumerical labeling. The developed circuit was tested on both data printing systems of JSM-T220 and JSM-T330 (JEOL SEM). It was found that the interfacing function worked properly and easily installed

  16. A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

    International Nuclear Information System (INIS)

    Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

    2012-01-01

    This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

  17. DC arc plasma disposal of printed circuit board

    International Nuclear Information System (INIS)

    Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

    2004-01-01

    A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

  18. Chemically programmed ink-jet printed resistive WORM memory array and readout circuit

    International Nuclear Information System (INIS)

    Andersson, H; Manuilskiy, A; Sidén, J; Gao, J; Kunninmel, G V; Nilsson, H-E; Hummelgård, M

    2014-01-01

    In this paper an ink-jet printed write once read many (WORM) resistive memory fabricated on paper substrate is presented. The memory elements are programmed for different resistance states by printing triethylene glycol monoethyl ether on the substrate before the actual memory element is printed using silver nano particle ink. The resistance is thus able to be set to a broad range of values without changing the geometry of the elements. A memory card consisting of 16 elements is manufactured for which the elements are each programmed to one of four defined logic levels, providing a total of 4294 967 296 unique possible combinations. Using a readout circuit, originally developed for resistive sensors to avoid crosstalk between elements, a memory card reader is manufactured that is able to read the values of the memory card and transfer the data to a PC. Such printed memory cards can be used in various applications. (paper)

  19. Flexible integrated diode-transistor logic (DTL) driving circuits based on printed carbon nanotube thin film transistors with low operation voltage.

    Science.gov (United States)

    Liu, Tingting; Zhao, Jianwen; Xu, Weiwei; Dou, Junyan; Zhao, Xinluo; Deng, Wei; Wei, Changting; Xu, Wenya; Guo, Wenrui; Su, Wenming; Jie, Jiansheng; Cui, Zheng

    2018-01-03

    Fabrication and application of hybrid functional circuits have become a hot research topic in the field of printed electronics. In this study, a novel flexible diode-transistor logic (DTL) driving circuit is proposed, which was fabricated based on a light emitting diode (LED) integrated with printed high-performance single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs). The LED, which is made of AlGaInP on GaAs, is commercial off-the-shelf, which could generate free electrical charges upon white light illumination. Printed top-gate TFTs were made on a PET substrate by inkjet printing high purity semiconducting SWCNTs (sc-SWCNTs) ink as the semiconductor channel materials, together with printed silver ink as the top-gate electrode and printed poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA/ODA) as gate dielectric layer. The LED, which is connected to the gate electrode of the TFT, generated electrical charge when illuminated, resulting in biased gate voltage to control the TFT from "ON" status to "OFF" status. The TFTs with a PMDA/ODA gate dielectric exhibited low operating voltages of ±1 V, a small subthreshold swing of 62-105 mV dec -1 and ON/OFF ratio of 10 6 , which enabled DTL driving circuits to have high ON currents, high dark-to-bright current ratios (up to 10 5 ) and good stability under repeated white light illumination. As an application, the flexible DTL driving circuit was connected to external quantum dot LEDs (QLEDs), demonstrating its ability to drive and to control the QLED.

  20. Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

    International Nuclear Information System (INIS)

    Sridhar, A.; Dijk, D.J. van; Akkerman, R.

    2009-01-01

    Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two variants of this substrate material, viz. etched and unetched, to determine the influence of substrate surface topography on adhesion and accuracy of the printed tracks. The pull-off adhesion test method was used to quantify adhesive strength. The dependence of the pull-off test results on local geometry of the test area are illustrated with the aid of scanning electron microscope images and interferometer studies. Based on the outcomes of the experiments, conclusions concerning the suitable surface topography for inkjet printing have been arrived at.

  1. Calorimeter Preamplifier Hybrid Circuit Test Jig

    International Nuclear Information System (INIS)

    Abraham, B.M.

    1999-01-01

    There are two ways in which the testing may be initiated, remotely or locally. If the remote operation is desired, an external TTL level signal must be provided to the test jig with the remotellocal switch on the side of the test jig switched to remote. A logic high will initiate the test. A logic low will terminate the test. In the event that an external signal is connected to the test jig while local operation occurs, the local control takes precedence over remote control. Once a DVT has been locked in the ZIF socket and the DIP switches are selected, the Push-to-Test button may be depressed. Momentarily depressing the button will initiate a test with a minimum 400 ms duration. At the same time a PBCLOCK and PBLATCH pulses will be initiated and the power rails +12V, +8V, and -6V will be ramped to full voltage. The time at which the power rails reach the full voltage is about 13 ms and it is synchronized with bypass capacitors placed on COMP input of U20 and U22 and on the output of U23 voltage regulators. The voltage rails are supplied to a ±10% window comparator. A red LED indicates the rail is below or above 10% of the design value. A green LED indicates the rail is within acceptable limits. For DDT with a 5 pF and 10 pF feed back capacitor, the +12V and +8V rails are current-regulated to 19rnA and 22 rnA respectively and the -6V rail is short-circuit protected within the regulator. For DUT with a 22 pF feed back capacitor the current regulation is the same as above except that the +8V rail is current regulated to 43 rnA. The power rails are supplied to the DUT via a 10 (Omega) resistor. The voltage drop across this resistor is sensed by a differential amplifier AD620 and amplified by a gain of 10. An external BNC connection is provided from this point to allow for current measurements by the vendor. The current value for each rail is calculated by measuring the voltage value at this point and divided by (10*10(Omega)). The next stage inverts and amplifies the

  2. Calorimeter Preamplifier Hybrid Circuit Test Jig

    Energy Technology Data Exchange (ETDEWEB)

    Abraham, B.M.; /Fermilab

    1999-04-19

    There are two ways in which the testing may be initiated, remotely or locally. If the remote operation is desired, an external TTL level signal must be provided to the test jig with the remotellocal switch on the side of the test jig switched to remote. A logic high will initiate the test. A logic low will terminate the test. In the event that an external signal is connected to the test jig while local operation occurs, the local control takes precedence over remote control. Once a DVT has been locked in the ZIF socket and the DIP switches are selected, the Push-to-Test button may be depressed. Momentarily depressing the button will initiate a test with a minimum 400 ms duration. At the same time a PBCLOCK and PBLATCH pulses will be initiated and the power rails +12V, +8V, and -6V will be ramped to full voltage. The time at which the power rails reach the full voltage is about 13 ms and it is synchronized with bypass capacitors placed on COMP input of U20 and U22 and on the output of U23 voltage regulators. The voltage rails are supplied to a {+-}10% window comparator. A red LED indicates the rail is below or above 10% of the design value. A green LED indicates the rail is within acceptable limits. For DDT with a 5 pF and 10 pF feed back capacitor, the +12V and +8V rails are current-regulated to 19rnA and 22 rnA respectively and the -6V rail is short-circuit protected within the regulator. For DUT with a 22 pF feed back capacitor the current regulation is the same as above except that the +8V rail is current regulated to 43 rnA. The power rails are supplied to the DUT via a 10 {Omega} resistor. The voltage drop across this resistor is sensed by a differential amplifier AD620 and amplified by a gain of 10. An external BNC connection is provided from this point to allow for current measurements by the vendor. The current value for each rail is calculated by measuring the voltage value at this point and divided by (10*10{Omega}). The next stage inverts and amplifies

  3. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    International Nuclear Information System (INIS)

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

    2009-01-01

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

  4. A novel and simple method of printing flexible conductive circuits on PET fabrics

    International Nuclear Information System (INIS)

    Wang, Zehong; Wang, Wei; Jiang, Zhikang; Yu, Dan

    2017-01-01

    Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

  5. A novel and simple method of printing flexible conductive circuits on PET fabrics

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Zehong; Wang, Wei [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Jiang, Zhikang [Saintyear Holding Group Co., Ltd. (China); Yu, Dan, E-mail: vchtian@163.com [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Saintyear Holding Group Co., Ltd. (China)

    2017-02-28

    Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

  6. Development of high-performance printed organic field-effect transistors and integrated circuits.

    Science.gov (United States)

    Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

    2015-10-28

    Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

  7. Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

    Science.gov (United States)

    Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

    2016-09-01

    Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

  8. Study of the computer-aided implantation and layout of printed circuits

    International Nuclear Information System (INIS)

    Baudry, Marc

    1973-01-01

    This research thesis reports the design and implementation of a software aimed at a computer-aided implantation and layout of printed circuits. This work comprises the use of heuristic algorithms and the search for a minimum cost by reduction of computing time and of memory size. The software comprises four independent parts which respectively address data analysis and control, circuit implantation, connection layout, and the exploitation of the obtained results. These four parts and their subroutines are presented. Two examples are reported in appendix

  9. In-situ fabrication of flexible vertically integrated electronic circuits by inkjet printing

    International Nuclear Information System (INIS)

    Wang Zhuo; Wu Wenwen; Yang Qunbao; Li Yongxiang; Noh, Chang-Ho

    2009-01-01

    In this paper, a facile approach for fabricating flexible vertically integrated electronic circuits is demonstrated. A desktop inkjet printer was modified and employed to print silver precursor on a polymer-coated buffer substrates. In-situ reaction was taken place and a conducting line was formed without need of a high temperature treatment. Through this process, several layers of metal integrated circuits were deposited sequentially with polymer buffer layers sandwiched between each layer. Hence, vertically integrated electronic components of diodes, solar cells, flexible flat panel displays, and electrochromic devices can be built with this simple and low-cost technique.

  10. An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Bruno de Castro Braz

    Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

  11. Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Rasa Volungevičienė

    2014-10-01

    Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

  12. Leaching of gold and silver from printed circuit board of mobile phones

    OpenAIRE

    Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

    2015-01-01

    Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

  13. Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

    Directory of Open Access Journals (Sweden)

    Yefimenko A. A.

    2014-12-01

    Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

  14. SPRINT - An Interactive System for Printed Circuit Board Design User’s Guide.

    Science.gov (United States)

    1977-06-01

    effect as decreasing the time limit - your priority and turnaround time are improved. B) You have a very large circuit and an error message says...previous segment. If no path is found, a message is printed to that effect . If HIWIRE thinks the failure may have been due to too small a value of...USAF Academy, Colorado 80840 AUL/LSE-9663 Maxwell AFB, Alabama 36112 AFETR Technical Library P.O. Box 4608, MU 5650 Patrick AFB

  15. EMC and the printed circuit board design theory and layout made simple

    CERN Document Server

    Montrose, Mark I

    1999-01-01

    "This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

  16. Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

    OpenAIRE

    Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong

    2013-01-01

    The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity se...

  17. Preliminary Study of Printed Circuit Heat Exchanger (PCHE) for various power conversion systems for SMART

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Jinsu; Baik, Seungjoon; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

    2016-10-15

    The steam-Rankine cycle was the most widely used power conversion system for a nuclear power plant. The size of the heat exchanger is important for the modulation. Such a challenge was conducted by Kang et al. They change the steam generator type for the SMART from helical type heat exchanger to Printed Circuit Heat Exchanger (PCHE). Recently, there has been a growing interest in the supercritical carbon dioxide (S-CO{sub 2}) Brayton cycle as the most promising power conversion system. The reason is high efficiency with simple layout and compact power plant due to small turbomachinery and compact heat exchanger technology. That is why the SCO{sub 2} Brayton cycle can enhance the existing advantages of Small Modular Reactor (SMR) like SMART, such as reduction in size, capital cost, and construction period. Thermal hydraulic and geometric parameters of a PCHE for the S-CO{sub 2} power cycle coupled to SMART. The results show that the water - CO{sub 2} printed circuit heat exchanger size is smaller than printed circuit steam generator for the superheated steam Rankine cycle. This results show the potential benefit of using the S-CO-2 Brayton power cycle to a water-cooled small modular reactor.

  18. Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

    Science.gov (United States)

    Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

    2017-08-01

    In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

  19. Optimized circuit design for flexible 8-bit RFID transponders with active layer of ink-jet printed small molecule semiconductors

    NARCIS (Netherlands)

    Kjellander, B.K.C.; Smaal, W.T.T.; Myny, K.; Genoe, J.; Dehaene, W.; Heremans, P.; Gelinck, G.H.

    2013-01-01

    We ink-jet print a blend of 6,13-bis(triisopropyl-silylethynyl)pentacene and polystyrene as the active layer for flexible circuits. The discrete ink-jet printed transistors exhibit a saturation mobility of 0.5 cm2 V -1 s-1. The relative spread in transistor characteristics can be very large. This

  20. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  1. Hybrid planar lightwave circuits for defense and aerospace applications

    Science.gov (United States)

    Zhang, Hua; Bidnyk, Serge; Yang, Shiquan; Balakrishnan, Ashok; Pearson, Matt; O'Keefe, Sean

    2010-04-01

    We present innovations in Planar Lightwave Circuits (PLCs) that make them ideally suited for use in advanced defense and aerospace applications. We discuss PLCs that contain no micro-optic components, no moving parts, pose no spark or fire hazard, are extremely small and lightweight, and are capable of transporting and processing a range of optical signals with exceptionally high performance. This PLC platform is designed for on-chip integration of active components such as lasers and detectors, along with transimpedance amplifiers and other electronics. These active components are hybridly integrated with our silica-on-silicon PLCs using fully-automated robotics and image recognition technology. This PLC approach has been successfully applied to the design and fabrication of multi-channel transceivers for aerospace applications. The chips contain hybrid DFB lasers and high-efficiency detectors, each capable of running over 10 Gb/s, with mixed digital and analog traffic multiplexed to a single optical fiber. This highlyintegrated functionality is combined onto a silicon chip smaller than 4 x 10 mm, weighing failures after extreme temperature cycling through a range of > 125 degC, and more than 2,000 hours operating at 95 degC ambient air temperature. We believe that these recent advancements in planar lightwave circuits are poised to revolutionize optical communications and interconnects in the aerospace and defense industries.

  2. Hybrid 3D printing: a game-changer in personalized cardiac medicine?

    Science.gov (United States)

    Kurup, Harikrishnan K N; Samuel, Bennett P; Vettukattil, Joseph J

    2015-12-01

    Three-dimensional (3D) printing in congenital heart disease has the potential to increase procedural efficiency and patient safety by improving interventional and surgical planning and reducing radiation exposure. Cardiac magnetic resonance imaging and computed tomography are usually the source datasets to derive 3D printing. More recently, 3D echocardiography has been demonstrated to derive 3D-printed models. The integration of multiple imaging modalities for hybrid 3D printing has also been shown to create accurate printed heart models, which may prove to be beneficial for interventional cardiologists, cardiothoracic surgeons, and as an educational tool. Further advancements in the integration of different imaging modalities into a single platform for hybrid 3D printing and virtual 3D models will drive the future of personalized cardiac medicine.

  3. Design and implementation of a hybrid circuit system for micro sensor signal processing

    International Nuclear Information System (INIS)

    Wang Zhuping; Chen Jing; Liu Ruqing

    2011-01-01

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

  4. High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

    2010-01-01

    A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

  5. 3D printed barium titanate/poly-(vinylidene fluoride) nano-hybrid with anisotropic dielectric properties

    DEFF Research Database (Denmark)

    Phatharapeetranun, N.; Ksapabutr, B.; Marani, D.

    2017-01-01

    properties of the starting materials are optimized to shape the hybrid by the precision-extrusion-based fuse deposition modeling technique. The 3D-printed BTNFs allow complex shapes with different degrees of fiber alignment as the result of printing shear stress and the chemical composition of the starting...

  6. Toward printed integrated circuits based on unipolar or ambipolar polymer semiconductors.

    Science.gov (United States)

    Baeg, Kang-Jun; Caironi, Mario; Noh, Yong-Young

    2013-08-21

    For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge

  7. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    International Nuclear Information System (INIS)

    Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

    2014-01-01

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

  8. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    Energy Technology Data Exchange (ETDEWEB)

    Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

    2014-01-15

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

  9. Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

    Directory of Open Access Journals (Sweden)

    Araújo Manuel

    2016-01-01

    Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

  10. Comparative study of electromagnetic compatibility methods in printed circuit board design tools

    International Nuclear Information System (INIS)

    Marinova, Galia

    2002-01-01

    The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

  11. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  12. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  13. Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

    Science.gov (United States)

    Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

    2018-02-01

    The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

  14. Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

    International Nuclear Information System (INIS)

    Chiu, K.-C.; Chen, C.-S.

    2007-01-01

    A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

  15. Preparing printed circuit boards for rapid turn-around time on a protomat plotter

    International Nuclear Information System (INIS)

    Hawtree, J.

    1998-01-01

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

  16. On-chip single photon filtering and multiplexing in hybrid quantum photonic circuits.

    Science.gov (United States)

    Elshaari, Ali W; Zadeh, Iman Esmaeil; Fognini, Andreas; Reimer, Michael E; Dalacu, Dan; Poole, Philip J; Zwiller, Val; Jöns, Klaus D

    2017-08-30

    Quantum light plays a pivotal role in modern science and future photonic applications. Since the advent of integrated quantum nanophotonics different material platforms based on III-V nanostructures-, colour centers-, and nonlinear waveguides as on-chip light sources have been investigated. Each platform has unique advantages and limitations; however, all implementations face major challenges with filtering of individual quantum states, scalable integration, deterministic multiplexing of selected quantum emitters, and on-chip excitation suppression. Here we overcome all of these challenges with a hybrid and scalable approach, where single III-V quantum emitters are positioned and deterministically integrated in a complementary metal-oxide-semiconductor-compatible photonic circuit. We demonstrate reconfigurable on-chip single-photon filtering and wavelength division multiplexing with a foot print one million times smaller than similar table-top approaches, while offering excitation suppression of more than 95 dB and efficient routing of single photons over a bandwidth of 40 nm. Our work marks an important step to harvest quantum optical technologies' full potential.Combining different integration platforms on the same chip is currently one of the main challenges for quantum technologies. Here, Elshaari et al. show III-V Quantum Dots embedded in nanowires operating in a CMOS compatible circuit, with controlled on-chip filtering and tunable routing.

  17. The ATPG Attack for Reverse Engineering of Combinational Hybrid Custom-Programmable Circuits

    Science.gov (United States)

    2017-03-23

    Introduction The widely practiced horizontal integrated circuit supply chain exposes a design to various types of attacks including the reverse engineering ...STT_CMOS designs for reverse- engineering prevention, DAC 2016. [5] M. E. Massad and et. al. Integrated circuit (IC) decamouflaging: reverse...The ATPG Attack for Reverse Engineering of Combinational Hybrid Custom-Programmable Circuits Raza Shafiq Hamid Mahmoodi Houman Homayoun Hassan

  18. Organic-inorganic hybrid material SUNCONNECT® for photonic integrated circuit

    Science.gov (United States)

    Nawata, Hideyuki; Oshima, Juro; Kashino, Tsubasa

    2018-02-01

    In this paper, we report the feature and properties about organic-inorganic hybrid material, "SUNCONNECT®" for photonic integrated circuit. "SUNCONNECT®" materials have low propagation loss at 1310nm (0.29dB/cm) and 1550nm (0.45dB/cm) respectively. In addition, the material has high thermal resistance both high temperature annealing test at 300°C and also 260°C solder heat resistance test. For actual device application, high reliability is required. 85°C /85% test was examined by using multi-mode waveguide. As a result, it indicated that variation of insertion loss property was not changed significantly after high temperature / high humidity test. For the application to photonic integrated circuit, it was demonstrated to fabricate polymer optical waveguide by using three different methods. Single-micron core pattern can be fabricated on cladding layer by using UV lithography with proximity gap exposure. Also, single-mode waveguide can be also fabricated with over cladding. On the other hands, "Mosquito method" and imprint method can be applied to fabricate polymer optical waveguide. Remarkably, these two methods can fabricate gradedindex type optical waveguide without using photo mask. In order to evaluate the optical performance, NFP's observation, measurement of insertion loss and propagation loss by cut-back methods were carried out by using each waveguide sample.

  19. Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

    Science.gov (United States)

    Gao, Xuehua; Li, Qisheng; Qiu, Jun

    2018-04-01

    Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

  20. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Science.gov (United States)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  1. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Directory of Open Access Journals (Sweden)

    Ivănuş R.C.

    2010-06-01

    Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  2. Two-Phase Instability Characteristics of Printed Circuit Steam Generator for the Low Pressure Condition

    International Nuclear Information System (INIS)

    Kang, Han-Ok; Han, Hun Sik; Kim, Young-In; Kim, Keung Koo

    2015-01-01

    Reduction of installation space for steam generators can lead to much smaller reactor vessel with resultant decrease of overall manufacturing cost for the components. A PCHE(Printed Circuit Heat Exchanger) is one of the compact types of heat exchangers available as an alternative to conventional shell and tube heat exchangers. Its name is derived from the procedure used to manufacture the flat metal plates that form the core of the heat exchanger, which is done by chemical milling. These plates are then stacked and diffusion bonded, converting the plates into a solid metal block containing precisely engineered fluid flow passages. PCSG(Printed Circuit Steam Generator) is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. For the introduction of new steam generator, design requirement for the two-phase flow instability should be considered. This paper describes two-phase flow instability characteristics of PCSG for the low pressure condition. PCSG is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. Interconnecting flow path was developed to mitigate the two-phase flow instability in the cold side. The flow characteristics of two-phase flow instability at the PCSG is examined experimentally in this study

  3. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

    Energy Technology Data Exchange (ETDEWEB)

    Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

    2013-04-10

    Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  4. Nuclear code case development of printed-circuit heat exchangers with thermal and mechanical performance testing

    Energy Technology Data Exchange (ETDEWEB)

    Aakre, Shaun R. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Jentz, Ian W. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Anderson, Mark H. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering

    2018-03-27

    The U.S. Department of Energy has agreed to fund a three-year integrated research project to close technical gaps involved with compact heat exchangers to be used in nuclear applications. This paper introduces the goals of the project, the research institutions, and industrial partners working in collaboration to develop a draft Boiler and Pressure Vessel Code Case for this technology. Heat exchanger testing, as well as non-destructive and destructive evaluation, will be performed by researchers across the country to understand the performance of compact heat exchangers. Testing will be performed using coolants and conditions proposed for Gen IV Reactor designs. Preliminary observations of the mechanical failure mechanisms of the heat exchangers using destructive and non-destructive methods is presented. Unit-cell finite element models assembled to help predict the mechanical behavior of these high-temperature components are discussed as well. Performance testing methodology is laid out in this paper along with preliminary modeling results, an introduction to x-ray and neutron inspection techniques, and results from a recent pressurization test of a printed-circuit heat exchanger. The operational and quality assurance knowledge gained from these models and validation tests will be useful to developers of supercritical CO2 systems, which commonly employ printed-circuit heat exchangers.

  5. Hybrid circuit prototypes for the CMS Tracker upgrade front-end electronics

    International Nuclear Information System (INIS)

    Blanchot, G; Honma, A; Kovacs, M; Braga, D; Raymond, M

    2013-01-01

    New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic-based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip chip ASICs. A description of the function of the hybrid circuit in the tracker, the first prototype designs, results of some electrical and mechanical properties from the prototypes, and examples of the integration of the hybrids into detector modules are presented

  6. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  7. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    International Nuclear Information System (INIS)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

    2015-01-01

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

  8. Packaging Printing Today

    OpenAIRE

    Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

  9. Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

  10. Fabrication of Ultra-Thin Printed Organic TFT CMOS Logic Circuits Optimized for Low-Voltage Wearable Sensor Applications.

    Science.gov (United States)

    Takeda, Yasunori; Hayasaka, Kazuma; Shiwaku, Rei; Yokosawa, Koji; Shiba, Takeo; Mamada, Masashi; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

    2016-05-09

    Ultrathin electronic circuits that can be manufactured by using conventional printing technologies are key elements necessary to realize wearable health sensors and next-generation flexible electronic devices. Due to their low level of power consumption, complementary (CMOS) circuits using both types of semiconductors can be easily employed in wireless devices. Here, we describe ultrathin CMOS logic circuits, for which not only the source/drain electrodes but also the semiconductor layers were printed. Both p-type and n-type organic thin film transistor devices were employed in a D-flip flop circuit in the newly developed stacked structure and exhibited excellent electrical characteristics, including good carrier mobilities of 0.34 and 0.21 cm(2) V(-1) sec(-1), and threshold voltages of nearly 0 V with low operating voltages. These printed organic CMOS D-flip flop circuits exhibit operating frequencies of 75 Hz and demonstrate great potential for flexible and printed electronics technology, particularly for wearable sensor applications with wireless connectivity.

  11. Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

    Directory of Open Access Journals (Sweden)

    Rajeswari Packianathan

    2015-01-01

    Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

  12. Three-Dimensional (3D Printing of Polymer-Metal Hybrid Materials by Fused Deposition Modeling

    Directory of Open Access Journals (Sweden)

    Susanna Fafenrot

    2017-10-01

    Full Text Available Fused deposition modeling (FDM is a three-dimensional (3D printing technology that is usually performed with polymers that are molten in a printer nozzle and placed line by line on the printing bed or the previous layer, respectively. Nowadays, hybrid materials combining polymers with functional materials are also commercially available. Especially combinations of polymers with metal particles result in printed objects with interesting optical and mechanical properties. The mechanical properties of objects printed with two of these metal-polymer blends were compared to common poly (lactide acid (PLA printed objects. Tensile tests and bending tests show that hybrid materials mostly containing bronze have significantly reduced mechanical properties. Tensile strengths of the 3D-printed objects were unexpectedly nearly identical with those of the original filaments, indicating sufficient quality of the printing process. Our investigations show that while FDM printing allows for producing objects with mechanical properties similar to the original materials, metal-polymer blends cannot be used for the rapid manufacturing of objects necessitating mechanical strength.

  13. Three-Dimensional (3D) Printing of Polymer-Metal Hybrid Materials by Fused Deposition Modeling.

    Science.gov (United States)

    Fafenrot, Susanna; Grimmelsmann, Nils; Wortmann, Martin; Ehrmann, Andrea

    2017-10-19

    Fused deposition modeling (FDM) is a three-dimensional (3D) printing technology that is usually performed with polymers that are molten in a printer nozzle and placed line by line on the printing bed or the previous layer, respectively. Nowadays, hybrid materials combining polymers with functional materials are also commercially available. Especially combinations of polymers with metal particles result in printed objects with interesting optical and mechanical properties. The mechanical properties of objects printed with two of these metal-polymer blends were compared to common poly (lactide acid) (PLA) printed objects. Tensile tests and bending tests show that hybrid materials mostly containing bronze have significantly reduced mechanical properties. Tensile strengths of the 3D-printed objects were unexpectedly nearly identical with those of the original filaments, indicating sufficient quality of the printing process. Our investigations show that while FDM printing allows for producing objects with mechanical properties similar to the original materials, metal-polymer blends cannot be used for the rapid manufacturing of objects necessitating mechanical strength.

  14. Graphene-on-silicon hybrid plasmonic-photonic integrated circuits.

    Science.gov (United States)

    Xiao, Ting-Hui; Cheng, Zhenzhou; Goda, Keisuke

    2017-06-16

    Graphene surface plasmons (GSPs) have shown great potential in biochemical sensing, thermal imaging, and optoelectronics. To excite GSPs, several methods based on the near-field optical microscope and graphene nanostructures have been developed in the past few years. However, these methods suffer from their bulky setups and low GSP-excitation efficiency due to the short interaction length between free-space vertical excitation light and the atomic layer of graphene. Here we present a CMOS-compatible design of graphene-on-silicon hybrid plasmonic-photonic integrated circuits that achieve the in-plane excitation of GSP polaritons as well as localized surface plasmon (SP) resonance. By employing a suspended membrane slot waveguide, our design is able to excite GSP polaritons on a chip. Moreover, by utilizing a graphene nanoribbon array, we engineer the transmission spectrum of the waveguide by excitation of localized SP resonance. Our theoretical and computational study paves a new avenue to enable, modulate, and monitor GSPs on a chip, potentially applicable for the development of on-chip electro-optic devices.

  15. Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Mrazikova Anna

    2015-06-01

    Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

  16. Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

    Science.gov (United States)

    Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

    2012-06-01

    The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

  17. Ductile electroless Ni-P coating onto flexible printed circuit board

    Science.gov (United States)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  18. A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

    International Nuclear Information System (INIS)

    Broadbent, H A; Ketterl, T P; Reid, C S

    2010-01-01

    The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

  19. New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

    Science.gov (United States)

    Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

    2017-06-01

    Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

  20. Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger

    International Nuclear Information System (INIS)

    Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

    2016-01-01

    Highlights: • Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger have been obtained. • Comparisons of experimental data and available correlations have been performed. • New Fanning friction factor and heat transfer correlations for the test PCHE are developed. - Abstract: Printed circuit heat exchanger (PCHE) is one of the leading intermediate heat exchanger (IHX) candidates to be employed in the very-high-temperature gas-cooled reactors (VHTRs) due to its capability for high-temperature, high-pressure applications. In the current study, a reduced-scale zigzag-channel PCHE was fabricated using Alloy 617 plates for the heat exchanger core and Alloy 800H pipes for the headers. The pressure drop and heat transfer characteristics of the PCHE were investigated experimentally in a high-temperature helium test facility (HTHF) at The Ohio State University. The PCHE helium inlet temperatures and pressures were varied up to 464 °C/2.7 MPa for the cold side and 802 °C/2.7 MPa for the hot side, respectively, while the maximum helium mass flow rates on both sides of the PCHE reached 39 kg/h. The corresponding maximum channel Reynolds number was approximately 3558, covering the laminar flow and laminar-to-turbulent flow transition regimes. New pressure drop and heat transfer correlations for the current zigzag channels with rounded bends were developed based on the experimental data. Comparisons between the experimental data and the results obtained from the available PCHE and straight circular pipe correlations were conducted. Compared to the heat transfer performance in straight circular pipes, the zigzag channels provided little advantage in the laminar flow regime but significant advantage near the transition flow regime.

  1. Evaluation of gold and silver leaching from printed circuit board of cellphones

    International Nuclear Information System (INIS)

    Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

    2014-01-01

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

  2. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    Energy Technology Data Exchange (ETDEWEB)

    Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

  3. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

    Energy Technology Data Exchange (ETDEWEB)

    Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

    2014-01-15

    Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

  4. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    International Nuclear Information System (INIS)

    Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

    2014-01-01

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

  5. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

    DEFF Research Database (Denmark)

    Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

    2013-01-01

    Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...

  6. Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

    Science.gov (United States)

    California State Univ., Sacramento. Dept. of Civil Engineering.

    One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

  7. Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

    NARCIS (Netherlands)

    Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

    2008-01-01

    The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

  8. SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

    Directory of Open Access Journals (Sweden)

    Maciej Thomas

    2014-10-01

    Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

  9. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    Science.gov (United States)

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

  10. Natural printed silk substrate circuit fabricated via surface modification using one step thermal transfer and reduction graphene oxide

    Science.gov (United States)

    Cao, Jiliang; Huang, Zhan; Wang, Chaoxia

    2018-05-01

    Graphene conductive silk substrate is a preferred material because of its biocompatibility, flexibility and comfort. A flexible natural printed silk substrate circuit was fabricated by one step transfer of graphene oxide (GO) paste from transfer paper to the surface of silk fabric and reduction of the GO to reduced graphene oxide (RGO) using a simple hot press treatment. The GO paste was obtained through ultrasonic stirring exfoliation under low temperature, and presented excellent printing rheological properties at high concentration. The silk fabric was obtained a surface electric resistance as low as 12.15 KΩ cm-1, in the concentration of GO 50 g L-1 and hot press at 220 °C for 120 s. Though the whiteness and strength decreased with the increasing of hot press temperature and time slowly, the electric conductivity of RGO surface modification silk substrate improved obviously. The surface electric resistance of RGO/silk fabrics increased from 12.15 KΩ cm-1 to 18.05 KΩ cm-1, 28.54 KΩ cm-1 and 32.53 KΩ cm-1 after 10, 20 and 30 washing cycles, respectively. The results showed that the printed silk substrate circuit has excellent washability. This process requires no chemical reductant, and the reduction efficiency and reduction degree of GO is high. This time-effective and environmentally-friendly one step thermal transfer and reduction graphene oxide onto natural silk substrate method can be easily used to production of reduced graphene oxide (RGO) based flexible printed circuit.

  11. Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.

    Science.gov (United States)

    Wang, Lei; Liu, Jing

    2014-12-08

    A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi 35 In 48.6 Sn 16 Zn 0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid-solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi 35 In 48.6 Sn 16 Zn 0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance-temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future.

  12. Evaluation of gold and silver leaching from printed circuit board of cellphones

    Energy Technology Data Exchange (ETDEWEB)

    Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  13. Applications of three-dimensional (3D) printing for microswimmers and bio-hybrid robotics.

    Science.gov (United States)

    Stanton, M M; Trichet-Paredes, C; Sánchez, S

    2015-04-07

    This article will focus on recent reports that have applied three-dimensional (3D) printing for designing millimeter to micrometer architecture for robotic motility. The utilization of 3D printing has rapidly grown in applications for medical prosthetics and scaffolds for organs and tissue, but more recently has been implemented for designing mobile robotics. With an increase in the demand for devices to perform in fragile and confined biological environments, it is crucial to develop new miniaturized, biocompatible 3D systems. Fabrication of materials at different scales with different properties makes 3D printing an ideal system for creating frameworks for small-scale robotics. 3D printing has been applied for the design of externally powered, artificial microswimmers and studying their locomotive capabilities in different fluids. Printed materials have also been incorporated with motile cells for bio-hybrid robots capable of functioning by cell contraction and swimming. These 3D devices offer new methods of robotic motility for biomedical applications requiring miniature structures. Traditional 3D printing methods, where a structure is fabricated in an additive process from a digital design, and non-traditional 3D printing methods, such as lithography and molding, will be discussed.

  14. Hybrid printing of mechanically and biologically improved constructs for cartilage tissue engineering applications

    International Nuclear Information System (INIS)

    Xu Tao; Binder, Kyle W; Albanna, Mohammad Z; Dice, Dennis; Zhao Weixin; Yoo, James J; Atala, Anthony

    2013-01-01

    Bioprinting is an emerging technique used to fabricate viable, 3D tissue constructs through the precise deposition of cells and hydrogels in a layer-by-layer fashion. Despite the ability to mimic the native properties of tissue, printed 3D constructs that are composed of naturally-derived biomaterials still lack structural integrity and adequate mechanical properties for use in vivo, thus limiting their development for use in load-bearing tissue engineering applications, such as cartilage. Fabrication of viable constructs using a novel multi-head deposition system provides the ability to combine synthetic polymers, which have higher mechanical strength than natural materials, with the favorable environment for cell growth provided by traditional naturally-derived hydrogels. However, the complexity and high cost associated with constructing the required robotic system hamper the widespread application of this approach. Moreover, the scaffolds fabricated by these robotic systems often lack flexibility, which further restrict their applications. To address these limitations, advanced fabrication techniques are necessary to generate complex constructs with controlled architectures and adequate mechanical properties. In this study, we describe the construction of a hybrid inkjet printing/electrospinning system that can be used to fabricate viable tissues for cartilage tissue engineering applications. Electrospinning of polycaprolactone fibers was alternated with inkjet printing of rabbit elastic chondrocytes suspended in a fibrin–collagen hydrogel in order to fabricate a five-layer tissue construct of 1 mm thickness. The chondrocytes survived within the printed hybrid construct with more than 80% viability one week after printing. In addition, the cells proliferated and maintained their basic biological properties within the printed layered constructs. Furthermore, the fabricated constructs formed cartilage-like tissues both in vitro and in vivo as evidenced by the

  15. Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

    Science.gov (United States)

    Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

    2016-11-01

    An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

  16. Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

    Science.gov (United States)

    Jadhav, Umesh; Su, C; Hocheng, Hong

    2016-12-01

    In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

  17. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-06-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  18. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    Science.gov (United States)

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

  19. Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

    Science.gov (United States)

    Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

    2015-12-01

    Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

  20. Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers

    Directory of Open Access Journals (Sweden)

    Jang-Won Seo

    2015-05-01

    Full Text Available Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE, which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%‒15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

  1. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-03-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  2. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2014-05-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  3. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

    International Nuclear Information System (INIS)

    Guo Jie; Rao Qunli; Xu Zhenming

    2008-01-01

    The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

  4. Integration of microelectronic chips in microfluidic systems on printed circuit board

    International Nuclear Information System (INIS)

    Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

    2012-01-01

    A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

  5. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    International Nuclear Information System (INIS)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

    2014-01-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

  6. The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

    Science.gov (United States)

    Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

    2009-10-15

    This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

  7. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

  8. Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

    Directory of Open Access Journals (Sweden)

    Alafara A. Baba

    2014-07-01

    Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

  9. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    Directory of Open Access Journals (Sweden)

    Waldir A. Bizzo

    2014-06-01

    Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

  10. High-Temperature Test of 800HT Printed Circuit Heat Exchanger in HELP

    International Nuclear Information System (INIS)

    Kim, Chan Soo; Hong, Sung-Deok; Kim, Min Hwan; Shim, Jaesool

    2014-01-01

    Korea Atomic Energy Research Institute has developed high-temperature Printed Circuit Heat Exchangers (PCHE) for a Very High Temperature gas-cooled Reactor and operated a very high temperature Helium Experimental LooP (HELP) to verify the performance of the high temperature heat exchanger at the component level environment. PCHE is one of the candidates for the intermediate heat exchanger in a VHTR, because its design temperature and pressure are larger than any other compact heat exchanger types. High temperature PCHEs in HELP consist of an alloy617 PCHE and an 800HT PCHE. This study presents the high temperature test of an 800HT PCHE in HELP. The experimental data include the pressure drops, the overall heat transfer coefficients, and the surface temperature distributions under various operating conditions. The experimental data are compared with the thermo-hydraulic analysis from COMSOL. In addition, the single channel tests are performed to quantify the friction factor under normal nitrogen and helium inlet conditions. (author)

  11. CFD Analysis on the Periodic Element of a Printed Circuit Heat Exchanger

    International Nuclear Information System (INIS)

    Tak, Nam-il; Kim, Min-Hwan; Lee, Won-Jae

    2007-01-01

    A typical printed circuit heat exchanger (PCHE) is composed of a large number of flow channels with lateral corrugations. In an effort to investigate fundamental thermo-fluid characteristics of a PCHE with corrugated channels, computational fluid dynamics (CFD) analyses were previously made in. One pair of flow channels (i.e., cold and hot channels) with the entire flow path was considered for the computational domain in the previous studies. Although only one pair of flow channels with coarse meshes was used, computational loads were found to be very high to simulate the entire flow path of the PCHE. Fortunately a recent study has shown that a simplified CFD methodology with a stream wise periodic assumption (called periodic CFD analysis) is feasible for a CFD evaluation of the thermo-fluid performance of compact heat exchangers. Since the periodic CFD analysis focuses on the periodic element of a flow channel, the required computing resources are dramatically reduced. In the present paper, the periodic CFD analysis has been applied to the periodic element of the PCHE. The results are compared with those of the full elements which have an entire flow path. Based on the periodic approach the effects of the corrugation parameters on the thermo-fluid performance of the PCHE are investigated

  12. Study on characteristics of printed circuit board liberation and its crushed products.

    Science.gov (United States)

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2012-11-01

    Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

  13. E-waste: development of recycling process and chemical characterization of circuit printed - motherboard

    International Nuclear Information System (INIS)

    Junior, O.L.F.; Vargas, R.A.; Andreoli, M.; Martinelli, J.R.; Seo, E.S.M.

    2011-01-01

    The electro-electronic industry has been regulated by the National Politic of Solid Residues Act (PNRS) and Bill no. 7.404, concerning the actions, procedures, and method to collect, recycle and promotion of environmentally acceptable final destination of residues. The present work contributes to develop recycling process of printed circuit used in microcomputers and in its chemical characterization. The experimental procedure consisted of grinding, classification, magnetic and electrostatic separation, and separation based on density difference, followed by chemical characterization of the metallic and non metallic materials in the motherboard. It was determined that the amounts of Ag, Al, Ba, Cl, Cr, Cu, Fe, Mn, Pb, and Zn in the residue are above the toxicity allowable levels, and they are in the samples of the decanted material. Among the samples of the floating material, Al, Ba, Br, Ca, Cu, Fe, Pb (in less quantity), Si (in more quantity), and Sn, Ti and Zn were detected. Those materials can be useful in the preparation of red ceramics. (author)

  14. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    Science.gov (United States)

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

  15. Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

    Science.gov (United States)

    Wang, Jianbo; Xu, Zhenming

    2015-01-20

    Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

  16. Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

    International Nuclear Information System (INIS)

    Han, Won Seok; Lee, Jae Young

    2012-01-01

    Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

  17. Numerical investigation on thermal-hydraulic performance of new printed circuit heat exchanger model

    International Nuclear Information System (INIS)

    Kim, Dong Eok; Kim, Moo Hwan; Cha, Jae Eun; Kim, Seong O.

    2008-01-01

    Three-dimensional numerical analysis was performed to investigate heat transfer and pressure drop characteristics of supercritical CO 2 flow in new Printed Circuit Heat Exchanger (PCHE) model using commercial CFD code, Fluent 6.3. First, numerical analysis for conventional zigzag channel PCHE model was performed and compared with previous experimental data. Maximum deviation of in-outlet temperature difference and pressure drop from experimental data is about 10%. A new PCHE model has been designed to optimize thermal-hydraulic performance of PCHE. The new PCHE model has several airfoil shape fins (NACA 0020 model), which are designed to streamlined shape. Simulation results showed that in the airfoil shape fin PCHE, total heat transfer rate per unit volume was almost same with zigzag channel PCHE and the pressure drop was reduced to one-twentieth of that in zigzag channel PCHE. In airfoil shape fin PCHE model, the enhancement of heat transfer area and the uniform flow configuration contributed to obtain the same heat transfer performance with zigzag channel PCHE model. And the reduction of pressure drop in airfoil shape fin PCHE model was caused by suppressing generation of separated flow owing to streamlined shape of airfoil fins

  18. Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

    International Nuclear Information System (INIS)

    Quan Cui; Li Aimin; Gao Ningbo

    2010-01-01

    The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

  19. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

    Energy Technology Data Exchange (ETDEWEB)

    Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

    2016-07-05

    Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

  20. Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

    Science.gov (United States)

    Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

    2018-02-01

    Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

  1. Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

    Science.gov (United States)

    Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

    2014-09-01

    Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10-5Ω.cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript.

  2. Design analysis of a lead–lithium/supercritical CO2 Printed Circuit Heat Exchanger for primary power recovery

    International Nuclear Information System (INIS)

    Fernández, Iván; Sedano, Luis

    2013-01-01

    Highlights: • A design for a PbLi/CO 2 (SC) Printed Circuit Heat Exchanger which optimizes the pressure drop performance is proposed. • Numerical analyses have been performed to optimize the airfoil fins shape and arrangement. • SiC is proposed as structural material and tritium permeation barrier for the PCHE. • The integrated flux is larger than expected and allows reducing the CO 2 mass flow in this sector of the power cycle. • A transport model has been developed to evaluate the permeation of tritium from the liquid metal to the secondary CO 2 . -- Abstract: One of the key issues for fusion power plant technology is the efficient, reliable and safe recovery of the power extracted by the primary coolants. An interesting design option for power conversion cycles based on Dual Coolant Breeding Blankets (DCBB) is a Printed Circuit Heat Exchanger, which is supported by the advantages of its compactness, thermal effectiveness, high temperature and pressure capability and corrosion resistance. This work presents a design analysis of a silicon carbide Printed Circuit Heat Exchanger for lead–lithium/supercritical CO 2 at DEMO ranges (4× segmentation)

  3. Hybrid 2D patterning using UV laser direct writing and aerosol jet printing of UV curable polydimethylsiloxane

    Science.gov (United States)

    Obata, Kotaro; Schonewille, Adam; Slobin, Shayna; Hohnholz, Arndt; Unger, Claudia; Koch, Jürgen; Suttmann, Oliver; Overmeyer, Ludger

    2017-09-01

    The hybrid technique of aerosol jet printing and ultraviolet (UV) laser direct writing was developed for 2D patterning of thin film UV curable polydimethylsiloxane (PDMS). A dual atomizer module in an aerosol jet printing system generated aerosol jet streams from material components of the UV curable PDMS individually and enables the mixing in a controlled ratio. Precise control of the aerosol jet printing achieved the layer thickness of UV curable PDMS as thin as 1.6 μm. This aerosol jet printing system is advantageous because of its ability to print uniform thin-film coatings of UV curable PDMS on planar surfaces as well as free-form surfaces without the use of solvents. In addition, the hybrid 2D patterning using the combination of UV laser direct writing and aerosol jet printing achieved selective photo-initiated polymerization of the UV curable PDMS layer with an X-Y resolution of 17.5 μm.

  4. Rapid Three-Dimensional Printing in Water Using Semiconductor-Metal Hybrid Nanoparticles as Photoinitiators.

    Science.gov (United States)

    Pawar, Amol Ashok; Halivni, Shira; Waiskopf, Nir; Ben-Shahar, Yuval; Soreni-Harari, Michal; Bergbreiter, Sarah; Banin, Uri; Magdassi, Shlomo

    2017-07-12

    Additive manufacturing processes enable fabrication of complex and functional three-dimensional (3D) objects ranging from engine parts to artificial organs. Photopolymerization, which is the most versatile technology enabling such processes through 3D printing, utilizes photoinitiators that break into radicals upon light absorption. We report on a new family of photoinitiators for 3D printing based on hybrid semiconductor-metal nanoparticles. Unlike conventional photoinitiators that are consumed upon irradiation, these particles form radicals through a photocatalytic process. Light absorption by the semiconductor nanorod is followed by charge separation and electron transfer to the metal tip, enabling redox reactions to form radicals in aerobic conditions. In particular, we demonstrate their use in 3D printing in water, where they simultaneously form hydroxyl radicals for the polymerization and consume dissolved oxygen that is a known inhibitor. We also demonstrate their potential for two-photon polymerization due to their giant two-photon absorption cross section.

  5. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

    International Nuclear Information System (INIS)

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-01-01

    Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

  6. Prioritizing material recovery for end-of-life printed circuit boards

    International Nuclear Information System (INIS)

    Wang Xue; Gaustad, Gabrielle

    2012-01-01

    Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  7. Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

    Energy Technology Data Exchange (ETDEWEB)

    Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

    2014-04-01

    Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

  8. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

    International Nuclear Information System (INIS)

    Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

    2010-01-01

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

  9. Evaluation of gold and silver leaching from printed circuit board of cellphones.

    Science.gov (United States)

    Petter, P M H; Veit, H M; Bernardes, A M

    2014-02-01

    Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

  10. Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

    Science.gov (United States)

    Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

    2012-11-30

    Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

  11. Performance Evaluation of a Printed Circuit Steam Generator for Integral Reactors: A Feasibility Test

    Energy Technology Data Exchange (ETDEWEB)

    Han, Hun Sik; Kang, Han-Ok; Yoon, Juhyeon; Kim, Young In; Kim, Keung Koo [KAERI, Daejeon (Korea, Republic of); Seo, Jang-won; Choi, Brain [Alfa Laval Korea Ltd., Daejeon (Korea, Republic of)

    2015-05-15

    SMART (System-integrated Modular Advanced ReacTor) is a small-sized integral type pressurized water reactor. It adopts advanced design features such as structural safety improvement, system simplification, and component modularization to achieve highly enhanced safety and improved economics. The design issues related to further safety enhancement and cost reduction have received significant attention to increase its competitiveness in the global small reactor market. For the cost reduction, it is important to design the reactor vessel as small as possible. Thus, it is necessary to reduce the volume of main components such as a steam generator. Its manufacturing processes of the chemical etching and diffusion bonding provide high effectiveness, high compactness, and inherent structural safety under high temperatures and high pressures. Thus, it is expected to be an alternative to the conventional shell and tube type steam generator in SMART. In this paper, simple thermal-hydraulic performance measurement of a small-scale printed circuit steam generator (PCSG) is conducted to investigate the feasibility of applying it to SMART. The simple thermal-hydraulic performance of the PCSG has been experimentally evaluated. A small-scale PCHE is employed to investigate the feasibility of operating it as a steam generator. The performance assessment reveals that the PCSG stably produces superheated steam, and the increased degree of superheat is obtained at lower water flow rate. However, the flow instability is increased with the decrease of the water flow rate. Thus, it is required to apply the orifice design into the cold side plate to suppress the density-wave oscillations. The pressure drops and heat transfer rates increase with the water flow rate.

  12. Investigation of printed circuit heat exchanger for VHTRs - HTR2008-58097

    International Nuclear Information System (INIS)

    Mylavarapu, S. K.; Sun, X.; Figley, J.; Needler, N. J.; Christensen, R. N.

    2008-01-01

    Very High Temperature Reactors (VHTRs) require high temperature (900-950 deg. C), high integrity, and high efficiency heat exchangers during normal and off-normal conditions. A class of compact heat exchangers, namely, the Printed Circuit Heat Exchangers (PCHEs), made of high temperature materials, found to have the above characteristics, are being increasingly pursued for heavy duty applications. A high-temperature helium experimental test facility, primarily aimed at investigating the heat transfer and pressure drop characteristics of the PCHEs, was designed and is being built at the Ohio State Univ.. The test facility was designed for a maximum operating temperature and pressure of 900 deg. C and 3 MPa, respectively. Owing to the high operating conditions, a detailed investigation various high temperature materials was carried out to aid in design of the test facility and the heat exchangers. The study showed that alloy 617 is the leading candidate material for high temperature heat exchangers. Two PCHEs, each having 10 hot 10 cold plates with 12 channels in each plate, are currently being fabricated from alloy 617 plates and will be tested once test facility is constructed. To supplement the experiments, computational fluid dynamics modeling of a simplified PCHE model is being performed and the results for three flow rate cases of 15, 40, and 90 kg/h and a system pressure of 3 MPa are discussed. In summary, this paper focuses on the study of the high-temperature materials, the design of the helium test facility, the design and fabrication of the PCHEs, and the computational modeling of a simplified PCHE model. (authors)

  13. Effect of fin-endwall fillet on thermal hydraulic performance of airfoil printed circuit heat exchanger

    International Nuclear Information System (INIS)

    Ma, Ting; Xin, Fei; Li, Lei; Xu, Xiang-yang; Chen, Yi-tung; Wang, Qiu-wang

    2015-01-01

    Printed circuit heat exchanger (PCHE) is recommended to be used for intermediate heat exchanger in Very High Temperature Reactor (VHTR). One of the key features is that it is manufactured by the photochemical etching in order to maintain the internal structure and metal properties. In this paper, a photochemical etching experiment is conducted to manufacture the airfoil PCHE plate. The result indicates that the airfoil fin is not an ideal airfoil profile, but has a fin-endwall fillet. For the purpose of simplifying the numerical model and saving computational time, a validated model with a single fluid is used to further study the effect of fin-endwall fillet on the thermal hydraulic performance of airfoil PCHE. It is found that the fin-endwall fillet can increase the heat transfer and pressure drop in the cases with the non-dimensional longitudinal pitch being 1.63. The effect of fin-endwall fillet on thermal hydraulic performance decreases with the increase of transverse pitch, but the longitudinal pitch has little effect when the non-dimensional longitudinal pitch is greater than 1.88. In the studied cases, the maximum difference of Nusselt number and friction factor between the two models with and without fin-endwall fillet is up to 6.7% and 6.4%. - Highlights: • Fillets are formed in the endwall of airfoil fins during the photochemical etching. • Two-fluid model can be replaced by single-fluid model to perform simulation. • Fin-endwall fillet can increase heat transfer and pressure drop at ζ_l = 1.63. • Effect of fin-endwall fillet decreases as transverse pitch increases at ζ_l = 1.63. • Longitudinal pitch has little effect at ζ_l ≥ 1.88.

  14. Quality control process improvement of flexible printed circuit board by FMEA

    Science.gov (United States)

    Krasaephol, Siwaporn; Chutima, Parames

    2018-02-01

    This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

  15. Delay-area trade-off for MPRM circuits based on hybrid discrete particle swarm optimization

    International Nuclear Information System (INIS)

    Jiang Zhidi; Wang Zhenhai; Wang Pengjun

    2013-01-01

    Polarity optimization for mixed polarity Reed—Muller (MPRM) circuits is a combinatorial issue. Based on the study on discrete particle swarm optimization (DPSO) and mixed polarity, the corresponding relation between particle and mixed polarity is established, and the delay-area trade-off of large-scale MPRM circuits is proposed. Firstly, mutation operation and elitist strategy in genetic algorithm are incorporated into DPSO to further develop a hybrid DPSO (HDPSO). Then the best polarity for delay and area trade-off is searched for large-scale MPRM circuits by combining the HDPSO and a delay estimation model. Finally, the proposed algorithm is testified by MCNC Benchmarks. Experimental results show that HDPSO achieves a better convergence than DPSO in terms of search capability for large-scale MPRM circuits. (semiconductor integrated circuits)

  16. Manufacturing experience and test results of the PS prototype flexible hybrid circuit for the CMS Tracker Upgrade

    CERN Document Server

    Kovacs, Mark Istvan; Gadek, Tomasz; Honma, Alan; Vasey, Francois

    2017-01-01

    The CMS Tracker Phase-2 Upgrade for HL-LHC requires High Density Interconnect (HDI) flexible hybrid circuits to build modules with low mass and high granularity. The hybrids are carbon fibre reinforced flexible circuits with flip-chips and passives. Three different manufacturers produced prototype hybrids for the Pixel-Strip type modules. The first part of the presentation will focus on the design challenges of this state of the art circuit. Afterwards, the difficulties and experience related to the circuit manufacturing and assembly are presented. The description of quality inspection methods with comprehensive test results will lead to the conclusion.

  17. The Hybrid Integrated Circuit of the ALICE Inner Tracking System upgrade

    CERN Document Server

    Fiorenza, G; Pastore, C; Valentino, V

    2016-01-01

    The upgrade of the Inner Tracking System scheduled during the second long shutdown is an important milestone of the ALICE upgrade and it will provide a high improvement of its performances. In this contribution the smallest operator unit of the detector, the Hybrid Integrated Circuits, is presented.

  18. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit.

    Science.gov (United States)

    Chakrabarti, B; Lastras-Montaño, M A; Adam, G; Prezioso, M; Hoskins, B; Payvand, M; Madhavan, A; Ghofrani, A; Theogarajan, L; Cheng, K-T; Strukov, D B

    2017-02-14

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore's law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + "Molecular") architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

  19. Hybrid quantum circuit with a superconducting qubit coupled to an electron spin ensemble

    Energy Technology Data Exchange (ETDEWEB)

    Kubo, Yuimaru; Grezes, Cecile; Vion, Denis; Esteve, Daniel; Bertet, Patrice [Quantronics Group, SPEC (CNRS URA 2464), CEA-Saclay, 91191 Gif-sur-Yvette (France); Diniz, Igor; Auffeves, Alexia [Institut Neel, CNRS, BP 166, 38042 Grenoble (France); Isoya, Jun-ichi [Research Center for Knowledge Communities, University of Tsukuba, 305-8550 Tsukuba (Japan); Jacques, Vincent; Dreau, Anais; Roch, Jean-Francois [LPQM (CNRS, UMR 8537), Ecole Normale Superieure de Cachan, 94235 Cachan (France)

    2013-07-01

    We report the experimental realization of a hybrid quantum circuit combining a superconducting qubit and an ensemble of electronic spins. The qubit, of the transmon type, is coherently coupled to the spin ensemble consisting of nitrogen-vacancy (NV) centers in a diamond crystal via a frequency-tunable superconducting resonator acting as a quantum bus. Using this circuit, we prepare arbitrary superpositions of the qubit states that we store into collective excitations of the spin ensemble and retrieve back into the qubit. We also report a new method for detecting the magnetic resonance of electronic spins at low temperature with a qubit using the hybrid quantum circuit, as well as our recent progress on spin echo experiments.

  20. Recent trends in hardware security exploiting hybrid CMOS-resistive memory circuits

    Science.gov (United States)

    Sahay, Shubham; Suri, Manan

    2017-12-01

    This paper provides a comprehensive review and insight of recent trends in the field of random number generator (RNG) and physically unclonable function (PUF) circuits implemented using different types of emerging resistive non-volatile (NVM) memory devices. We present a detailed review of hybrid RNG/PUF implementations based on the use of (i) Spin-Transfer Torque (STT-MRAM), and (ii) metal-oxide based (OxRAM), NVM devices. Various approaches on Hybrid CMOS-NVM RNG/PUF circuits are considered, followed by a discussion on different nanoscale device phenomena. Certain nanoscale device phenomena (variability/stochasticity etc), which are otherwise undesirable for reliable memory and storage applications, form the basis for low power and highly scalable RNG/PUF circuits. Detailed qualitative comparison and benchmarking of all implementations is performed.

  1. Recycling of non-metallic fractions from waste printed circuit boards: A review

    Energy Technology Data Exchange (ETDEWEB)

    Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

    2009-09-15

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  2. Recycling of non-metallic fractions from waste printed circuit boards: A review

    International Nuclear Information System (INIS)

    Guo Jiuyong; Guo Jie; Xu Zhenming

    2009-01-01

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  3. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

    2014-11-15

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  4. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    International Nuclear Information System (INIS)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-01-01

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

  5. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

    International Nuclear Information System (INIS)

    Korneeva, Anna; Shaydurov, Vladimir

    2016-01-01

    In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

  6. Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

    Directory of Open Access Journals (Sweden)

    Ronal D. Montoya-Montoya

    2013-11-01

    Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

  7. Integrating integrated circuit chips on paper substrates using inkjet printed electronics

    CSIR Research Space (South Africa)

    Bezuidenhout, Petrone H

    2016-11-01

    Full Text Available This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively...

  8. Equivalent Circuit Analysis of Photovoltaic-Thermoelectric Hybrid Device with Different TE Module Structure

    Directory of Open Access Journals (Sweden)

    Haijun Chen

    2014-01-01

    Full Text Available Combining two different types of solar cells with different absorption bands into a hybrid cell is a very useful method to improve the utilization efficiency of solar energy. The experimental data of dye-sensitized solar cells (DSSCs and thermoelectric generators (TEG was simulated by equivalent circuit method, and some parameters of DSSCs were obtained. Then, the equivalent circuit model with the obtained parameters was used to optimize the structure design of photovoltaic- (PV- thermoelectric (TE hybrid devices. The output power (Pout first increases to a maximum and then decreases by increasing the TE prism size, and a smaller spacing between p-type prism and n-type prism of a TE p-n junction causes a higher output power of TEG and hybrid device. When the spacing between TE prisms is 15 μm and the optimal base side length of TE prism is 40 μm, the maximum theoretical efficiency reaches 24.6% according to the equivalent circuit analysis. This work would give some enlightenment for the development of high-performance PV-TE hybrid devices.

  9. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

    Science.gov (United States)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

    2015-01-01

    Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

  10. Thermo-hydraulic Analysis of a Water-cooled Printed Circuit Heat Exchanger in a Small-scale Nitrogen Loop

    International Nuclear Information System (INIS)

    Kim, Chan Soo; Hong, Sung Deok; Kim, Min Hwan; Shim, Jaesool; Lee, Gyung Dong

    2013-01-01

    The development of high-temperature heat exchangers is very important because of its higher operation temperature and pressure than those of common light water reactors and industrial process plants. In particular, the intermediate heat exchanger is a key-challenged high temperature component in a Very High Temperature gas-cooled Reactor (VHTR). A printed circuit heat exchanger is one of the candidates for an intermediate heat exchanger in a VHTR. The printed circuit heat exchanger (PCHE) was developed and commercialized by HEATRIC. The compactness is better than any other heat exchanger types, because its core matrices are fabricated by diffusion bonding with photo-chemically etched micro-channels. Various tests and analysis have been performed to verify the performance of PCHE. The thermal stress analysis of the high temperature PCHE is necessary to endure the extremely operation condition of IHX. In this study, the thermo-hydraulic analysis for the laboratory-scale PCHE is performed to provide the input data for the boundary conditions of a structural analysis. The results from the first-principal calculation are compared with those from computational fluid dynamics code analysis. COMSOL 4.3a analysis is successfully performed at the uniform pressure drop condition in a set of flow channel stacks. The heat-exchanged region concentrated to the nitrogen inlet cause the uniform mass velocity distribution in the channels, therefore there is little difference between two analytical results

  11. Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

    Directory of Open Access Journals (Sweden)

    Lee Jacqueline Ann L.

    2016-01-01

    Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

  12. Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

    Science.gov (United States)

    Li, Xingang; Gao, Yujie; Ding, Hui

    2013-10-01

    The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

  13. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Li Shu; Zhang Tong [Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States)], E-mail: lis4@rpi.edu, E-mail: tzhang@ecse.rpi.edu

    2008-05-07

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

  14. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect.

    Science.gov (United States)

    Li, Shu; Zhang, Tong

    2008-05-07

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

  15. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect

    International Nuclear Information System (INIS)

    Li Shu; Zhang Tong

    2008-01-01

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance

  16. Integration of Computed Tomography and Three-Dimensional Echocardiography for Hybrid Three-Dimensional Printing in Congenital Heart Disease.

    Science.gov (United States)

    Gosnell, Jordan; Pietila, Todd; Samuel, Bennett P; Kurup, Harikrishnan K N; Haw, Marcus P; Vettukattil, Joseph J

    2016-12-01

    Three-dimensional (3D) printing is an emerging technology aiding diagnostics, education, and interventional, and surgical planning in congenital heart disease (CHD). Three-dimensional printing has been derived from computed tomography, cardiac magnetic resonance, and 3D echocardiography. However, individually the imaging modalities may not provide adequate visualization of complex CHD. The integration of the strengths of two or more imaging modalities has the potential to enhance visualization of cardiac pathomorphology. We describe the feasibility of hybrid 3D printing from two imaging modalities in a patient with congenitally corrected transposition of the great arteries (L-TGA). Hybrid 3D printing may be useful as an additional tool for cardiologists and cardiothoracic surgeons in planning interventions in children and adults with CHD.

  17. Graphene-based inkjet printing of flexible bioelectronic circuits and sensors

    Science.gov (United States)

    Sinar, Dogan; Knopf, George K.; Nikumb, Suwas

    2013-03-01

    Bioelectronics involves interfacing functional biomolecules or living cells with electronic circuitry. Recent advances in electrically conductive inks and inkjet printing technologies have enabled bioelectronic devices to be fabricated on mechanically flexible polymers, paper and silk. In this research, non-conductive graphene-oxide (GO) inks are synthesized from inexpensive graphite powders. Once printed on the flexible substrate the electrical conductivity of the micro-circuitry can be restored through thermal reduction. Laser irradiation is one method being investigated for transforming the high resistance printed GO film into conductive oxygen reduced graphene-oxide (rGO). Direct laser writing is a precision fabrication process that enables the imprinting of conductive and resistive micro-features on the GO film. The mechanically flexible rGO microcircuits can be further biofunctionalized using molecular self-assembly techniques. Opportunities and challenges in exploiting these emerging technologies for developing biosensors and bioelectronic cicruits are briefly discussed.

  18. A hybrid analytical model for open-circuit field calculation of multilayer interior permanent magnet machines

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Zhen [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China); Xia, Changliang [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China); Tianjin Engineering Center of Electric Machine System Design and Control, Tianjin 300387 (China); Yan, Yan, E-mail: yanyan@tju.edu.cn [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China); Geng, Qiang [Tianjin Engineering Center of Electric Machine System Design and Control, Tianjin 300387 (China); Shi, Tingna [School of Electrical Engineering and Automation, Tianjin University, Tianjin 300072 (China)

    2017-08-01

    Highlights: • A hybrid analytical model is developed for field calculation of multilayer IPM machines. • The rotor magnetic field is calculated by the magnetic equivalent circuit method. • The field in the stator and air-gap is calculated by subdomain technique. • The magnetic scalar potential on rotor surface is modeled as trapezoidal distribution. - Abstract: Due to the complicated rotor structure and nonlinear saturation of rotor bridges, it is difficult to build a fast and accurate analytical field calculation model for multilayer interior permanent magnet (IPM) machines. In this paper, a hybrid analytical model suitable for the open-circuit field calculation of multilayer IPM machines is proposed by coupling the magnetic equivalent circuit (MEC) method and the subdomain technique. In the proposed analytical model, the rotor magnetic field is calculated by the MEC method based on the Kirchhoff’s law, while the field in the stator slot, slot opening and air-gap is calculated by subdomain technique based on the Maxwell’s equation. To solve the whole field distribution of the multilayer IPM machines, the coupled boundary conditions on the rotor surface are deduced for the coupling of the rotor MEC and the analytical field distribution of the stator slot, slot opening and air-gap. The hybrid analytical model can be used to calculate the open-circuit air-gap field distribution, back electromotive force (EMF) and cogging torque of multilayer IPM machines. Compared with finite element analysis (FEA), it has the advantages of faster modeling, less computation source occupying and shorter time consuming, and meanwhile achieves the approximate accuracy. The analytical model is helpful and applicable for the open-circuit field calculation of multilayer IPM machines with any size and pole/slot number combination.

  19. A hybrid analytical model for open-circuit field calculation of multilayer interior permanent magnet machines

    Science.gov (United States)

    Zhang, Zhen; Xia, Changliang; Yan, Yan; Geng, Qiang; Shi, Tingna

    2017-08-01

    Due to the complicated rotor structure and nonlinear saturation of rotor bridges, it is difficult to build a fast and accurate analytical field calculation model for multilayer interior permanent magnet (IPM) machines. In this paper, a hybrid analytical model suitable for the open-circuit field calculation of multilayer IPM machines is proposed by coupling the magnetic equivalent circuit (MEC) method and the subdomain technique. In the proposed analytical model, the rotor magnetic field is calculated by the MEC method based on the Kirchhoff's law, while the field in the stator slot, slot opening and air-gap is calculated by subdomain technique based on the Maxwell's equation. To solve the whole field distribution of the multilayer IPM machines, the coupled boundary conditions on the rotor surface are deduced for the coupling of the rotor MEC and the analytical field distribution of the stator slot, slot opening and air-gap. The hybrid analytical model can be used to calculate the open-circuit air-gap field distribution, back electromotive force (EMF) and cogging torque of multilayer IPM machines. Compared with finite element analysis (FEA), it has the advantages of faster modeling, less computation source occupying and shorter time consuming, and meanwhile achieves the approximate accuracy. The analytical model is helpful and applicable for the open-circuit field calculation of multilayer IPM machines with any size and pole/slot number combination.

  20. A new model for simulating microbial cyanide production and optimizing the medium parameters for recovering precious metals from waste printed circuit boards.

    Science.gov (United States)

    Yuan, Zhihui; Ruan, Jujun; Li, Yaying; Qiu, Rongliang

    2018-04-10

    Bioleaching is a green recycling technology for recovering precious metals from waste printed circuit boards (WPCBs). However, this technology requires increasing cyanide production to obtain desirable recovery efficiency. Luria-Bertani medium (LB medium, containing tryptone 10 g/L, yeast extract 5 g/L, NaCl 10 g/L) was commonly used in bioleaching of precious metal. In this study, results showed that LB medium did not produce highest yield of cyanide. Under optimal culture conditions (25 °C, pH 7.5), the maximum cyanide yield of the optimized medium (containing tryptone 6 g/L and yeast extract 5 g/L) was 1.5 times as high as that of LB medium. In addition, kinetics and relationship of cell growth and cyanide production was studied. Data of cell growth fitted logistics model well. Allometric model was demonstrated effective in describing relationship between cell growth and cyanide production. By inserting logistics equation into allometric equation, we got a novel hybrid equation containing five parameters. Kinetic data for cyanide production were well fitted to the new model. Model parameters reflected both cell growth and cyanide production process. Copyright © 2018 Elsevier B.V. All rights reserved.

  1. Checking a printed board

    CERN Multimedia

    1977-01-01

    An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

  2. Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

    International Nuclear Information System (INIS)

    Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

    2009-01-01

    Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

  3. Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

    Science.gov (United States)

    Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

    2016-11-01

    Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

  4. Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

    Directory of Open Access Journals (Sweden)

    Monier-Vinard Eric

    2016-01-01

    Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

  5. Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

    Science.gov (United States)

    Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

    2018-04-01

    Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

  6. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    International Nuclear Information System (INIS)

    Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

    2014-01-01

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

  7. Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

    International Nuclear Information System (INIS)

    Stafford, F.N.; Hotza, D.

    2012-01-01

    Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

  8. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    Energy Technology Data Exchange (ETDEWEB)

    Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  9. Multi-valued logic circuits using hybrid circuit consisting of three gates single-electron transistors (TG-SETs) and MOSFETs.

    Science.gov (United States)

    Shin, SeungJun; Yu, YunSeop; Choi, JungBum

    2008-10-01

    New multi-valued logic (MVL) families using the hybrid circuits consisting of three gates single-electron transistors (TG-SETs) and a metal-oxide-semiconductor field-effect transistor (MOSFET) are proposed. The use of SETs offers periodic literal characteristics due to Coulomb oscillation of SET, which allows a realization of binary logic (BL) circuits as well as multi-valued logic (MVL) circuits. The basic operations of the proposed MVL families are successfully confirmed through SPICE circuit simulation based on the physical device model of a TG-SET. The proposed MVL circuits are found to be much faster, but much larger power consumption than a previously reported MVL, and they have a trade-off between speed and power consumption. As an example to apply the newly developed MVL families, a half-adder is introduced.

  10. Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

    NARCIS (Netherlands)

    Tereshchenko, O.V.

    2015-01-01

    Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates

  11. Development of high-resolution two-dimensional magnetic field measurement system by use of printed-circuit technology

    Science.gov (United States)

    Akimitsu, Moe; Qinghong, Cao; Sawada, Asuka; Hatano, Hironori; Tanabe, Hiroshi; Ono, Yasushi; TS-Group Team

    2017-10-01

    We have developed a new-types of high-resolution magnetic probe array for our new magnetic reconnection experiments: TS-3U (ST, FRC: R =0.2m, 2017-) and TS-4U (ST, FRC: R =0.5m, 2018-), using the advanced printed-circuit technology. They are equipped with all three-components of magnetic pick-up coils whose size is 1-5mm x 3mm. Each coil is composed of two-sided coil pattern with line width of 0.05mm. We can install two or three printed arrays in a single glass (ceramic) tube for two or three component measurements. Based on this new probe technique, we started high-resolution and high-accuracy measurement of the current sheet thickness and studied its plasma parameter dependence. We found that the thickness of current sheet increases inversely with the guide toroidal field. It is probably determined by the ion gyroradius in agreement with the particle simulation by Horiuchi etc. While the reconnection speed is steady under low guide field condition, it is observed to oscillate in the specific range of guide field, suggesting transition from the quasi-steady reconnection to the intermittent reconnection. Cause and mechanism for intermittent reconnection will be discussed using the current sheet dissipation and dynamic balance between plasma inflow and outflow. This work supported by JSPS KAKENHI Grant Numbers 15H05750, 15K14279 and 17H04863.

  12. Hybrid Binder to Mitigate Feed Powder Segregation in the Inkjet 3D Printing of Titanium Metal Parts

    Directory of Open Access Journals (Sweden)

    Saeed Maleksaeedi

    2018-05-01

    Full Text Available Using feedstock containing discrete dual or multi powders leads to segregation in the powder bed of additive manufacturing processes. In the present study, a new impregnated hybrid binder with properties closer to those of the base powder is developed to mitigate powder segregation in the inkjet 3D printing of titanium components.

  13. Modular bioink for 3D printing of biocompatible hydrogels : sol-gel polymerization of hybrid peptides and polymers

    NARCIS (Netherlands)

    Echalier, C.; Levato, R.; Mateos-Timoneda, Miguel A; Castaño, O.; Déjean, S.; Garric, X.; Pinese, C.; Noël, D.; Engel, E.; Martinez, J.; Mehdi, A.; Subra, G.

    2017-01-01

    An unprecedented generic system allowing the 3D printing of peptide-functionalized hydrogels by soft sol-gel inorganic polymerization is presented. Hybrid silylated inorganic/bioorganic blocks are mixed in biological buffer in an appropriate ratio, to yield a multicomponent bioink that can be

  14. Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

    Science.gov (United States)

    de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

    2018-05-01

    We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

  15. Hybrid 3D printing and electrodeposition approach for controllable 3D alginate hydrogel formation.

    Science.gov (United States)

    Shang, Wanfeng; Liu, Yanting; Wan, Wenfeng; Hu, Chengzhi; Liu, Zeyang; Wong, Chin To; Fukuda, Toshio; Shen, Yajing

    2017-06-07

    Calcium alginate hydrogels are widely used as biocompatible materials in a substantial number of biomedical applications. This paper reports on a hybrid 3D printing and electrodeposition approach for forming 3D calcium alginate hydrogels in a controllable manner. Firstly, a specific 3D hydrogel printing system is developed by integrating a customized ejection syringe with a conventional 3D printer. Then, a mixed solution of sodium alginate and CaCO 3 nanoparticles is filled into the syringe and can be continuously ejected out of the syringe nozzle onto a conductive substrate. When applying a DC voltage (∼5 V) between the substrate (anode) and the nozzle (cathode), the Ca 2+ released from the CaCO 3 particles can crosslink the alginate to form calcium alginate hydrogel on the substrate. To elucidate the gel formation mechanism and better control the gel growth, we can further establish and verify a gel growth model by considering several key parameters, i.e., applied voltage and deposition time. The experimental results indicate that the alginate hydrogel of various 3D structures can be formed by controlling the movement of the 3D printer. A cell viability test is conducted and shows that the encapsulated cells in the gel can maintain a high survival rate (∼99% right after gel formation). This research establishes a reliable method for the controllable formation of 3D calcium alginate hydrogel, exhibiting great potential for use in basic biology and applied biomedical engineering.

  16. A Novel Hybrid Biometric Electronic Voting System: Integrating Finger Print and Face Recognition

    Directory of Open Access Journals (Sweden)

    Shahram Najam

    2018-01-01

    Full Text Available A novel hybrid design based electronic voting system is proposed, implemented and analyzed. The proposed system uses two voter verification techniques to give better results in comparison to single identification based systems. Finger print and facial recognition based methods are used for voter identification. Cross verification of a voter during an election process provides better accuracy than single parameter identification method. The facial recognition system uses Viola-Jones algorithm along with rectangular Haar feature selection method for detection and extraction of features to develop a biometric template and for feature extraction during the voting process. Cascaded machine learning based classifiers are used for comparing the features for identity verification using GPCA (Generalized Principle Component Analysis and K-NN (K-Nearest Neighbor. It is accomplished through comparing the Eigen-vectors of the extracted features with the biometric template pre-stored in the election regulatory body database. The results of the proposed system show that the proposed cascaded design based system performs better than the systems using other classifiers or separate schemes i.e. facial or finger print based schemes. The proposed system will be highly useful for real time applications due to the reason that it has 91% accuracy under nominal light in terms of facial recognition.

  17. A novel hybrid biometric electronic voting system: integrating finger print face recognition

    International Nuclear Information System (INIS)

    Najam, S.S.; Shaikh, A.Z.; Naqvi, S.

    2018-01-01

    A novel hybrid design based electronic voting system is proposed, implemented and analyzed. The proposed system uses two voter verification techniques to give better results in comparison to single identification based systems. Finger print and facial recognition based methods are used for voter identification. Cross verification of a voter during an election process provides better accuracy than single parameter identification method. The facial recognition system uses Viola-Jones algorithm along with rectangular Haar feature selection method for detection and extraction of features to develop a biometric template and for feature extraction during the voting process. Cascaded machine learning based classifiers are used for comparing the features for identity verification using GPCA (Generalized Principle Component Analysis) and K-NN (K-Nearest Neighbor). It is accomplished through comparing the Eigen-vectors of the extracted features with the biometric template pre-stored in the election regulatory body database. The results of the proposed system show that the proposed cascaded design based system performs better than the systems using other classifiers or separate schemes i.e. facial or finger print based schemes. The proposed system will be highly useful for real time applications due to the reason that it has 91% accuracy under nominal light in terms of facial recognition. (author)

  18. All-fiber hybrid photon-plasmon circuits: integrating nanowire plasmonics with fiber optics.

    Science.gov (United States)

    Li, Xiyuan; Li, Wei; Guo, Xin; Lou, Jingyi; Tong, Limin

    2013-07-01

    We demonstrate all-fiber hybrid photon-plasmon circuits by integrating Ag nanowires with optical fibers. Relying on near-field coupling, we realize a photon-to-plasmon conversion efficiency up to 92% in a fiber-based nanowire plasmonic probe. Around optical communication band, we assemble an all-fiber resonator and a Mach-Zehnder interferometer (MZI) with Q-factor of 6 × 10(6) and extinction ratio up to 30 dB, respectively. Using the MZI, we demonstrate fiber-compatible plasmonic sensing with high sensitivity and low optical power.

  19. A novel circuit topology of modified switched boost hybrid resonant inverter fitted induction heating equipment

    Directory of Open Access Journals (Sweden)

    Bhattacharya Ananyo

    2016-12-01

    Full Text Available A novel circuit topology of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment is presented in this paper for efficient induction heating. Recently, induction heating technique is becoming very popular for both domestic and industrial purposes because of its high energy efficiency and controllability. Generally in induction heating, a high frequency alternating magnetic field is required to induce the eddy currents in the work piece. High frequency resonant inverters are incorporated in induction heating equipment which produce a high frequency alternating magnetic field surrounding the coil. Previously this high frequency alternating magnetic field was produced by voltage source inverters. But VSIs have several demerits. So, in this paper, a new scheme of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment has been depicted which enhances the energy efficiency and controllability and the same is validated by PSIM.

  20. A Hybrid Circuit for Spoof Surface Plasmons and Spatial Waveguide Modes to Reach Controllable Band-Pass Filters.

    Science.gov (United States)

    Zhang, Qian; Zhang, Hao Chi; Wu, Han; Cui, Tie Jun

    2015-11-10

    We propose a hybrid circuit for spoof surface plasmon polaritons (SPPs) and spatial waveguide modes to develop new microwave devices. The hybrid circuit includes a spoof SPP waveguide made of two anti-symmetric corrugated metallic strips and a traditional substrate integrated waveguide (SIW). From dispersion relations, we show that the electromagnetic waves only can propagate through the hybrid circuit when the operating frequency is less than the cut-off frequency of the SPP waveguide and greater than the cut-off frequency of SIW, generating efficient band-pass filters. We demonstrate that the pass band is controllable in a large range by designing the geometrical parameters of SPP waveguide and SIW. Full-wave simulations are provided to show the large adjustability of filters, including ultra wideband and narrowband filters. We fabricate a sample of the new hybrid device in the microwave frequencies, and measurement results have excellent agreements to numerical simulations, demonstrating excellent filtering characteristics such as low loss, high efficiency, and good square ratio. The proposed hybrid circuit gives important potential to accelerate the development of plasmonic integrated functional devices and circuits in both microwave and terahertz frequencies.

  1. Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards

    Science.gov (United States)

    Park, Sanghee; Kim, Ye Chan; Choi, Kisuk; Chae, Heeyop; Suhr, Jonghwan; Nam, Jae-Do

    2017-12-01

    As device miniaturization in microelectronics is currently requested in the development of high performance device, which usually include highly-integrated metal-polyimide multilayer structures. A redistribution layer (RDL) process is currently emerging as one of the most advance fabrication techniques for on-chip interconnect and packaging. One of the major issues in this process is the poor adhesion of the metal-polyimide interfaces particularly in flexible circuit boards due to the flexibility and bendability of devices. In this study, low pressure O2 plasma treatment was investigated to improve the adhesion of metal-polyimide interfaces, using inductively coupled plasma (ICP) treatment. We identified that the adhesion of metal-polyimide interfaces was greatly improved by the surface roughness control providing 46.1 MPa of shear force in the ball shear test after O2 plasma treatment, compared 14.2 MPa without O2 plasma treatment. It was seemingly due to the fact that the adhesion in metal-polyimide interfaces was improved by a chemical conversion of C=O to C-O bonds and by a ring opening reaction of imide groups, which was confirmed with FT-IR analysis. In the finite element numerical analysis of metal-polyimide interfaces, the O2 plasma treated interface showed that the in-plane stress distribution and the vertical directional deformation agreed well with real failure modes in flexible circuits manufacturing.

  2. Laser printed glass planar lightwave circuits with integrated fiber alignment structures

    Science.gov (United States)

    Desmet, A.; Radosavljevic, A.; Missinne, J.; Van Thourhout, D.; Van Steenberge, G.

    2018-02-01

    Femtosecond laser inscription allows straightforward manufacturing of glass planar lightwave circuits such as waveguides, interferometers, directional couplers, resonators and more complex structures. Fiber alignment structures are needed to facilitate communication with the glass planar lightwave circuit. In this study, a technique is described to create optical waveguides and alignment structures in the same laser exposure step. Using an industrial ytterbium-doped 1030 nm fiber laser pulses of 400 fs were focused into glass with a 0.4 NA objective causing permanent alteration of the material. Depending on laser parameters this modification allows direct writing of waveguides or the creation of channels after exposing the irradiated volumes to an etchant such as KOH. Writing of channels and waveguides with different laser powers, frequencies, polarisations, stage translation speeds and scan densities were investigated in fused silica and borosilicate glass. Waveguides with controlled dimensions were created, as well as etched U-grooves with a diameter of 126 μm and a sidewall roughness Ra of 255 nm. Cut back measurements were performed giving a waveguide propagation loss of 1.1 dB/cm in borosilicate glass. A coupling loss of 0.7 dB was measured for a transition between the waveguide and standard single mode fiber at 1550 nm, using index matching liquid. The described technique eliminates active alignment requirements and is useful for many applications such as microfluidic sensing, PLCs, fan-out connectors for multicore fibers and quantum optical networks.

  3. An impedimetric study of DNA hybridization on paper-supported inkjet-printed gold electrodes

    International Nuclear Information System (INIS)

    Ihalainen, Petri; Määttänen, Anni; Peltonen, Jouko; Pettersson, Fredrik; Pesonen, Markus; Österbacka, Ronald; Viitala, Tapani

    2014-01-01

    In this study, two different supramolecular recognition architectures for impedimetric detection of DNA hybridization have been formed on disposable paper-supported inkjet-printed gold electrodes. The gold electrodes were fabricated using a gold nanoparticle based ink. The first recognition architecture consists of subsequent layers of biotinylated self-assembly monolayer (SAM), streptavidin and biotinylated DNA probe. The other recognition architecture is constructed by immobilization of thiol-functionalized DNA probe (HS-DNA) and subsequent backfill with 11-mercapto-1-undecanol (MUOH) SAM. The binding capacity and selectivity of the recognition architectures were examined by surface plasmon resonance (SPR) measurements. SPR results showed that the HS-DNA/MUOH system had a higher binding capacity for the complementary DNA target. Electrochemical impedance spectroscopy (EIS) measurements showed that the hybridization can be detected with impedimetric spectroscopy in picomol range for both systems. EIS signal indicated a good selectivity for both recognition architectures, whereas SPR showed very high unspecific binding for the HS-DNA/MUOH system. The factors affecting the impedance signal were interpreted in terms of the complexity of the supramolecular architecture. The more complex architecture acts as a less ideal capacitive sensor and the impedance signal is dominated by the resistive elements. (paper)

  4. Quality control considerations for the development of the front end hybrid circuits for the CMS Outer Tracker upgrade

    CERN Document Server

    Gadek, Tomasz; Bonnaud, Julien Yves Robert; De Clercq, Jarne Theo; Honma, Alan; Koliatos, Alexandros; Kovacs, Mark Istvan; Luetic, Jelena

    2017-01-01

    The upgrade of the CMS Outer Tracker for the HL-LHC requires the design of new double-sensor modules. They contain two high-density front end hybrid circuits, equipped with flip-chip ASICs, passives and mechanical structures. First prototype hybrids in a close-to-final form have been ordered from three manufacturers. To qualify these hybrids a test setup was built, which emulates future tracker temperature and humidity conditions, provides temporary interconnection, and implements testing features. The system was automated to minimize the testing time in view of the production phase. Failure modes, deliberately implemented in the produced hybrids, provided feedback on the system’s effectiveness.

  5. Single axis controlled hybrid magnetic bearing for left ventricular assist device: hybrid core and closed magnetic circuit.

    Science.gov (United States)

    da Silva, Isaias; Horikawa, Oswaldo; Cardoso, Jose R; Camargo, Fernando A; Andrade, Aron J P; Bock, Eduardo G P

    2011-05-01

    In previous studies, we presented main strategies for suspending the rotor of a mixed-flow type (centrifugal and axial) ventricular assist device (VAD), originally presented by the Institute Dante Pazzanese of Cardiology (IDPC), Brazil. Magnetic suspension is achieved by the use of a magnetic bearing architecture in which the active control is executed in only one degree of freedom, in the axial direction of the rotor. Remaining degrees of freedom, excepting the rotation, are restricted only by the attraction force between pairs of permanent magnets. This study is part of a joint project in development by IDPC and Escola Politecnica of São Paulo University, Brazil. This article shows advances in that project, presenting two promising solutions for magnetic bearings. One solution uses hybrid cores as electromagnetic actuators, that is, cores that combine iron and permanent magnets. The other solution uses actuators, also of hybrid type, but with the magnetic circuit closed by an iron core. After preliminary analysis, a pump prototype has been developed for each solution and has been tested. For each prototype, a brushless DC motor has been developed as the rotor driver. Each solution was evaluated by in vitro experiments and guidelines are extracted for future improvements. Tests have shown good results and demonstrated that one solution is not isolated from the other. One complements the other for the development of a single-axis-controlled, hybrid-type magnetic bearing for a mixed-flow type VAD. © 2011, Copyright the Authors. Artificial Organs © 2011, International Center for Artificial Organs and Transplantation and Wiley Periodicals, Inc.

  6. A microfluidic microprocessor: controlling biomimetic containers and cells using hybrid integrated circuit/microfluidic chips.

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A; Westervelt, Robert M

    2010-11-07

    We present an integrated platform for performing biological and chemical experiments on a chip based on standard CMOS technology. We have developed a hybrid integrated circuit (IC)/microfluidic chip that can simultaneously control thousands of living cells and pL volumes of fluid, enabling a wide variety of chemical and biological tasks. Taking inspiration from cellular biology, phospholipid bilayer vesicles are used as robust picolitre containers for reagents on the chip. The hybrid chip can be programmed to trap, move, and porate individual living cells and vesicles and fuse and deform vesicles using electric fields. The IC spatially patterns electric fields in a microfluidic chamber using 128 × 256 (32,768) 11 × 11 μm(2) metal pixels, each of which can be individually driven with a radio frequency (RF) voltage. The chip's basic functions can be combined in series to perform complex biological and chemical tasks and can be performed in parallel on the chip's many pixels for high-throughput operations. The hybrid chip operates in two distinct modes, defined by the frequency of the RF voltage applied to the pixels: Voltages at MHz frequencies are used to trap, move, and deform objects using dielectrophoresis and voltages at frequencies below 1 kHz are used for electroporation and electrofusion. This work represents an important step towards miniaturizing the complex chemical and biological experiments used for diagnostics and research onto automated and inexpensive chips.

  7. Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

    Science.gov (United States)

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-09-01

    Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

  8. Electrical Differentiation of Mesenchymal Stem Cells into Schwann-Cell-Like Phenotypes Using Inkjet-Printed Graphene Circuits.

    Science.gov (United States)

    Das, Suprem R; Uz, Metin; Ding, Shaowei; Lentner, Matthew T; Hondred, John A; Cargill, Allison A; Sakaguchi, Donald S; Mallapragada, Surya; Claussen, Jonathan C

    2017-04-01

    Graphene-based materials (GBMs) have displayed tremendous promise for use as neurointerfacial substrates as they enable favorable adhesion, growth, proliferation, spreading, and migration of immobilized cells. This study reports the first case of the differentiation of mesenchymal stem cells (MSCs) into Schwann cell (SC)-like phenotypes through the application of electrical stimuli from a graphene-based electrode. Electrical differentiation of MSCs into SC-like phenotypes is carried out on a flexible, inkjet-printed graphene interdigitated electrode (IDE) circuit that is made highly conductive (sheet resistance electrically stimulated/treated (etMSCs) display significant enhanced cellular differentiation and paracrine activity above conventional chemical treatment strategies [≈85% of the etMSCs differentiated into SC-like phenotypes with ≈80 ng mL -1 of nerve growth factor (NGF) secretion vs. 75% and ≈55 ng mL -1 for chemically treated MSCs (ctMSCs)]. These results help pave the way for in vivo peripheral nerve regeneration where the flexible graphene electrodes could conform to the injury site and provide intimate electrical simulation for nerve cell regrowth. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  9. Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

    Science.gov (United States)

    Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

    2013-10-01

    The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

  10. Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

    International Nuclear Information System (INIS)

    2010-01-01

    The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

  11. Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

    Science.gov (United States)

    Li, Jia; Zhou, Quan; Xu, Zhenming

    2014-12-01

    Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

  12. Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

    Directory of Open Access Journals (Sweden)

    Thomas Maciej

    2017-12-01

    Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

  13. Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

    Directory of Open Access Journals (Sweden)

    Eun Hye Yuk

    2018-06-01

    Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

  14. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

    International Nuclear Information System (INIS)

    Xiu Furong; Zhang Fushen

    2009-01-01

    An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

  15. Structural assessment of intermediate printed circuit heat exchanger for sodium-cooled fast reactor with supercritical CO2 cycle

    International Nuclear Information System (INIS)

    Lee, Youho; Lee, Jeong Ik

    2014-01-01

    Highlights: • We numerically model PCHE stress arising from pressure, and thermal loadings. • Stress levels are the highest around S-CO 2 channels, due to high pressure of S-CO 2 . • The conventional analytic models for PCHE underestimate actual stress levels. • Plasticity sufficiently lowers stress levels at channel tips. • PCHE for SFR-SCO 2 is anticipated to assure compliance with ASME design standards. - Abstract: Structural integrity of intermediate Printed Circuit Heat Exchanger (PCHE) for Sodium-cooled Fast Reactor (SFR) attached to Supercritical CO 2 (S-CO 2 ) is investigated. ANSYS-Mechanical was used to simulate stress fields of representative PCHE channels, with temperature fields imported from FLUENT simulation. Mechanical stress induced by pressure loading is found to be the primary source of stress. As plasticity sufficiently lowers local stress concentration at PCHE channel tips, PCHE type intermediate heat exchangers made of SS316 are anticipated to reliably assure compliance with design standards prescribed in the ASME standards, thanks to the structure temperature that is below the effective creep inducing point. The actual life time of PCHE for SFR-SCO 2 is likely to be affected by mechanical behavior change of SS316 with reactions with S-CO 2 and fatigue

  16. Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

    Science.gov (United States)

    Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

    2016-08-01

    Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

  17. Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

    Science.gov (United States)

    Yang, Shuangqiao; Bai, Shibing; Wang, Qi

    2016-11-01

    In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

  18. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

    International Nuclear Information System (INIS)

    Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

    2013-01-01

    Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

  19. Experimental and CFD Analysis of Printed Circuit Heat Exchanger for Supercritical CO{sub 2} Power Cycle Application

    Energy Technology Data Exchange (ETDEWEB)

    Baik, Seungjoon; Kim, Hyeon Tae; Kim, Seong Gu; Lee, Jekyoung; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

    2015-10-15

    The supercritical carbon dioxide (S-CO{sub 2}) power cycle has been suggested as an alternative for the SFR power generation system. First of all, relatively mild sodium-CO{sub 2} interaction can reduce the accident probability. Also the S-CO{sub 2} power conversion cycle can achieve high efficiency with SFR core thermal condition. Moreover, the S-CO{sub 2} power cycle can reduce cycle footprint due to high density of the working fluid. Recently, various compact heat exchangers have been studied for developing an optimal heat exchanger. In this paper, the printed circuit heat exchanger was selected for S-CO{sub 2} power cycle applications and was closely investigated experimentally and analytically. Recently, design and performance prediction of PCHE received attention due to its importance in high pressure power systems such as S-CO{sub 2} cycle. To evaluate a PCHE performance with CO{sub 2} to water, KAIST research team designed and tested a lab-scale PCHE. From the experimental data and CFD analysis, pressure drop and heat transfer correlations are obtained. For the CFD analysis, Ansys-CFX commercial code was utilized with RGP table implementation. In near future, the turbulence model sensitivity study will be followed.

  20. Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

    Directory of Open Access Journals (Sweden)

    Yi-Xuan Wang

    2017-05-01

    Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

  1. Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

    Science.gov (United States)

    Zhan, Lu; Xu, Zhenming

    2008-10-15

    The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

  2. Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

    Science.gov (United States)

    Anshu Priya; Hait, Subrata

    2018-05-01

    Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

  3. Numerical Investigation on the Flow and Heat Transfer Characteristics of Supercritical Liquefied Natural Gas in an Airfoil Fin Printed Circuit Heat Exchanger

    OpenAIRE

    Zhongchao Zhao; Kai Zhao; Dandan Jia; Pengpeng Jiang; Rendong Shen

    2017-01-01

    As a new kind of highly compact and efficient micro-channel heat exchanger, the printed circuit heat exchanger (PCHE) is a promising candidate satisfying the heat exchange requirements of liquefied natural gas (LNG) vaporization at low and high pressure. The effects of airfoil fin arrangement on heat transfer and flow resistance were numerically investigated using supercritical liquefied natural gas (LNG) as working fluid. The thermal properties of supercritical LNG were tested by utilizing t...

  4. Multi and mixed 3D-printing of graphene-hydroxyapatite hybrid materials for complex tissue engineering.

    Science.gov (United States)

    Jakus, Adam E; Shah, Ramille N

    2017-01-01

    With the emergence of three-dimensional (3D)-printing (3DP) as a vital tool in tissue engineering and medicine, there is an ever growing need to develop new biomaterials that can be 3D-printed and also emulate the compositional, structural, and functional complexities of human tissues and organs. In this work, we probe the 3D-printable biomaterials spectrum by combining two recently established functional 3D-printable particle-laden biomaterial inks: one that contains hydroxyapatite microspheres (hyperelastic bone, HB) and another that contains graphene nanoflakes (3D-graphene, 3DG). We demonstrate that not only can these distinct, osteogenic, and neurogenic inks be co-3D-printed to create complex, multimaterial constructs, but that composite inks of HB and 3DG can also be synthesized. Specifically, the printability, microstructural, mechanical, electrical, and biological properties of a hybrid material comprised of 1:1 HA:graphene by volume is investigated. The resulting HB-3DG hybrid exhibits mixed characteristics of the two distinct systems, while maintaining 3D-printability, electrical conductivity, and flexibility. In vitro assessment of HB-3DG using mesenchymal stem cells demonstrates the hybrid material supports cell viability and proliferation, as well as significantly upregulates both osteogenic and neurogenic gene expression over 14 days. This work ultimately demonstrates a significant step forward towards being able to 3D-print graded, multicompositional, and multifunctional constructs from hybrid inks for complex composite tissue engineering. © 2016 Wiley Periodicals, Inc. J Biomed Mater Res Part A: 105A: 274-283, 2017. © 2016 Wiley Periodicals, Inc.

  5. Non-equilibrium correlations and entanglement in a semiconductor hybrid circuit-QED system

    International Nuclear Information System (INIS)

    Contreras-Pulido, L D; Emary, C; Brandes, T; Aguado, Ramón

    2013-01-01

    We present a theoretical study of a hybrid circuit-quantum electrodynamics system composed of two semiconducting charge-qubits confined in a microwave resonator. The qubits are defined in terms of the charge states of two spatially separated double quantum dots (DQDs) which are coupled to the same photon mode in the microwave resonator. We analyse a transport setup where each DQD is attached to electronic reservoirs and biased out-of-equilibrium by a large voltage, and study how electron transport across each DQD is modified by the coupling to the common resonator. In particular, we show that the inelastic current through each DQD reflects an indirect qubit–qubit interaction mediated by off-resonant photons in the microwave resonator. As a result of this interaction, both charge qubits stay entangled in the steady (dissipative) state. Finite shot noise cross-correlations between currents across distant DQDs are another manifestation of this nontrivial steady-state entanglement. (paper)

  6. A hybrid nanomemristor/transistor logic circuit capable of self-programming.

    Science.gov (United States)

    Borghetti, Julien; Li, Zhiyong; Straznicky, Joseph; Li, Xuema; Ohlberg, Douglas A A; Wu, Wei; Stewart, Duncan R; Williams, R Stanley

    2009-02-10

    Memristor crossbars were fabricated at 40 nm half-pitch, using nanoimprint lithography on the same substrate with Si metal-oxide-semiconductor field effect transistor (MOS FET) arrays to form fully integrated hybrid memory resistor (memristor)/transistor circuits. The digitally configured memristor crossbars were used to perform logic functions, to serve as a routing fabric for interconnecting the FETs and as the target for storing information. As an illustrative demonstration, the compound Boolean logic operation (A AND B) OR (C AND D) was performed with kilohertz frequency inputs, using resistor-based logic in a memristor crossbar with FET inverter/amplifier outputs. By routing the output signal of a logic operation back onto a target memristor inside the array, the crossbar was conditionally configured by setting the state of a nonvolatile switch. Such conditional programming illuminates the way for a variety of self-programmed logic arrays, and for electronic synaptic computing.

  7. Swirling flow and its influence on dc arcs in a duo-flow hybrid circuit breaker

    International Nuclear Information System (INIS)

    Kweon, K Y; Lee, H S; Yan, J D; Fang, M T C; Park, K Y

    2009-01-01

    The effects of swirling flow on the behaviour of dc SF 6 arcs in a duo-flow nozzle are computationally investigated in the electric current range 3-7 kA. A swirling flow is produced by the interaction of the magnetic field of a current-carrying coil and the plasma. Results show that a strong swirling flow is generated in regions where a large radial current density exists as a result of the conducting arc column rapidly changing its radial dimension. The presence of the swirling flow reduces the axis pressure, modifies the arc shape and slightly lowers the arc voltage (2-5%) in comparison with the case without considering the swirling flow. The different natures of swirling flows in a plasma jet/arc heater and in a hybrid circuit breaker are also discussed.

  8. Analysis of 3D printing parameters of gears for hybrid manufacturing

    Science.gov (United States)

    Budzik, Grzegorz; Przeszlowski, Łukasz; Wieczorowski, Michal; Rzucidlo, Arkadiusz; Gapinski, Bartosz; Krolczyk, Grzegorz

    2018-05-01

    The paper deals with analysis and selection of parameters of rapid prototyping of gears by selective sintering of metal powders. Presented results show wide spectrum of application of RP systems in manufacturing processes of machine elements, basing on analysis of market in term of application of additive manufacturing technology in different sectors of industry. Considerable growth of these methods over the past years can be observed. The characteristic errors of printed model with respect to ideal one for each technique were pointed out. Special attention was paid to the method of preparation of numerical data CAD/STL/RP. Moreover the analysis of manufacturing processes of gear type elements was presented. The tested gears were modeled with different allowances for final machining and made by DMLS. Metallographic analysis and strength tests on prepared specimens were performed. The above mentioned analysis and tests were used to compare the real properties of material with the nominal ones. To improve the quality of surface after sintering the gears were subjected to final machining. The analysis of geometry of gears after hybrid manufacturing method was performed (fig.1). The manufacturing process was defined in a traditional way as well as with the aid of modern manufacturing techniques. Methodology and obtained results can be used for other machine elements than gears and constitutes the general theory of production processes in rapid prototyping methods as well as in designing and implementation of production.

  9. A One-Dimensional Magnetic Chip with a Hybrid Magnetosensor and a Readout Circuit

    Directory of Open Access Journals (Sweden)

    Guo-Ming Sung

    2018-01-01

    Full Text Available This work presents a one-dimensional magnetic chip composed of a hybrid magnetosensor and a readout circuit, which were fabricated with 0.18 μm 1P6M CMOS technology. The proposed magnetosensor includes a polysilicon cross-shaped Hall plate and two separated metal-oxide semiconductor field-effect transistors (MOSFETs to sense the magnetic induction perpendicular to the chip surface. The readout circuit, which comprises a current-to-voltage converter, a low-pass filter, and an instrumentation amplifier, is designed to amplify the output Hall voltage with a gain of 43 dB. Furthermore, a SPICE macro model is proposed to predict the sensor’s performance in advance and to ensure sufficient comprehension of the magnetic mechanism of the proposed magnetosensor. Both simulated and measured results verify the correctness and flexibility of the proposed SPICE macro model. Measurements reveal that the maximum output Hall voltage VH, the optimum current-related magnetosensitivity SRI, the optimum voltage-related magnetosensitivity SRV, the averaged nonlinearity error NLE, and the relative bias current Ibias are 4.381 mV, 520.5 V/A·T, 40.04 V/V·T, 7.19%, and 200 μA, respectively, for the proposed 1-D magnetic chip with a readout circuit of 43 dB. The averaged NLE is small at high magnetic inductions of ±30 mT, whereas it is large at low magnetic inductions of ±30 G.

  10. Heat transfer and pressure drop of supercritical carbon dioxide flowing in several printed circuit heat exchanger channel patterns

    International Nuclear Information System (INIS)

    Carlson, M.; Kruizenga, A.; Anderson, M.; Corradini, M.

    2012-01-01

    Closed-loop Brayton cycles using supercritical carbon dioxide (SCO 2 ) show potential for use in high-temperature power generation applications including High Temperature Gas Reactors (HTGR) and Sodium-Cooled Fast Reactors (SFR). Compared to Rankine cycles SCO 2 Brayton cycles offer similar or improved efficiency and the potential for decreased capital costs due to a reduction in equipment size and complexity. Compact printed-circuit heat exchangers (PCHE) are being considered as part of several SCO 2 Brayton designs to further reduce equipment size with increased energy density. Several designs plan to use a gas cooler operating near the pseudo-critical point of carbon dioxide to benefit from large variations in thermophysical properties, but further work is needed to validate correlations for heat transfer and pressure-drop characteristics of SCO 2 flows in candidate PCHE channel designs for a variety of operating conditions. This paper presents work on experimental measurements of the heat transfer and pressure drop behavior of miniature channels using carbon dioxide at supercritical pressure. Results from several plate geometries tested in horizontal cooling-mode flow are presented, including a straight semi-circular channel, zigzag channel with a bend angle of 80 degrees, and a channel with a staggered array of extruded airfoil pillars modeled after a NACA 0020 airfoil with an 8.1 mm chord length facing into the flow. Heat transfer coefficients and bulk temperatures are calculated from measured local wall temperatures and local heat fluxes. The experimental results are compared to several methods for estimating the friction factor and Nusselt number of cooling-mode flows at supercritical pressures in millimeter-scale channels. (authors)

  11. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2016-09-05

    Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu{sub 2}O, CuO, and SnO{sub 2} were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu{sup 0} → Cu{sup +} → Cu{sup 2+}) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu{sup +} and Cu{sup 2+}. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  12. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    Energy Technology Data Exchange (ETDEWEB)

    Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  13. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

    International Nuclear Information System (INIS)

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-01-01

    Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu_2O, CuO, and SnO_2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu"0 → Cu"+ → Cu"2"+) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu"+ and Cu"2"+. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  14. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

    Science.gov (United States)

    Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

    2015-11-01

    In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

  15. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    International Nuclear Information System (INIS)

    Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

    2015-01-01

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets

  16. Whole body perfusion for hybrid aortic arch repair: evolution of selective regional perfusion with a modified extracorporeal circuit.

    Science.gov (United States)

    Fernandes, Philip; Walsh, Graham; Walsh, Stephanie; O'Neil, Michael; Gelinas, Jill; Chu, Michael W A

    2017-04-01

    Patients undergoing hybrid aortic arch reconstruction require careful protection of vital organs. We believe that whole body perfusion with tailored dual circuitry may help to achieve optimal patient outcomes. Our circuit has evolved from a secondary circuit utilizing a cardioplegia delivery device for lower body perfusion to a dual-oxygenator circuit. This allows individually controlled regional perfusion with ease of switching from secondary to primary circuit for total body flow. The re-design allows for separate flow and temperature regulation with two oxygenators in parallel. All patients underwent a single-stage operation for simultaneous treatment of arch and descending aortic pathology via a sternotomy, using a hybrid frozen elephant trunk technique. We report six consecutive patients undergoing hybrid arch and frozen elephant trunk reconstruction using a dual-oxygenator circuit. Five patients underwent elective surgery and one was emergent. One patient had an acute dissection while three underwent concomitant procedures, including a Ross procedure and two valve-sparing root reconstructions. Three cases were redo sternotomies. The mean pump time was 358 ± 131 min, the aortic cross clamp time 243 ± 135 min, the cardioplegia volume of 33,208 ml ± 16,173, cerebral ischemia 0 min, lower body ischemia 76 ± 34 min and the average lower body perfusion time was 142 min. Two patients did not require any donor blood products. The median intensive care unit (ICU) and hospital lengths of stay (LOS) were two days and 10 days, respectively. The average peak serum lactate on CPB was 7.47 mmol/L and, at admission to the ICU, it was 3.37 mmol/L. Renal and respiratory failure developed in the salvage acute type A dissection patient. No other complications occurred in this series. Whole body perfusion as delivered through individually controlled dual-oxygenator circuitry allows maximum flexibility for hybrid aortic arch reconstruction. A modified circuit perfusion

  17. Application of Cu-polyimide flex circuit and Al-on-glass pitch adapter for the ATLAS SCT barrel hybrid

    CERN Document Server

    Unno, Y; Ikegami, Y; Iwata, Y; Kohriki, T; Kondo, T; Nakano, I; Ohsugi, T; Takashima, R; Tanaka, R; Terada, S; Ujiie, N

    2005-01-01

    We applied the surface build-up Cu-polyimide flex-circuit technology with laser vias to the ATLAS SCT barrel hybrid to be made in one piece from the connector to the electronics sections including cables. The hybrids, reinforced with carbon-carbon substrates, provide mechanical strength, thermal conductivity, low-radiation length, and stability in application-specific integrated circuit (ASIC) operation. By following the design rules, we experienced little trouble in breaking the traces. The pitch adapter between the sensor and the ASICs was made of aluminum traces on glass substrate. We identified that the generation of whiskers around the wire-bonding feet was correlated with the hardness of metallized aluminum. The appropriate hardness has been achieved by keeping the temperature of the glasses as low as room temperature during the metallization. The argon plasma cleaning procedure cleaned the contamination on the gold pads of the hybrids for successful wire bonding, although it was unsuccessful in the alu...

  18. The role of printing parameters and scaffold biopolymer properties in the efficacy of a new hybrid nano-bioprinting system

    Energy Technology Data Exchange (ETDEWEB)

    Buyukhatipoglu, Kivilcim; Jo, Wonjin; Sun Wei; Clyne, Alisa Morss, E-mail: asm67@drexel.ed [Mechanical Engineering and Mechanics, Drexel University, 3141 Chestnut Street, Philadelphia, PA 19104 (United States)

    2009-09-15

    We created a hybrid nano-bioprinting system, which combines the initial patterning capabilities of direct cell writing with the active patterning capabilities of superparamagnetic nanoparticles. Biofabrication conditions, including printing parameters and scaffold biopolymer properties, may affect cell viability, nanoparticle manipulation and patterning capabilities. Nanoparticles were printed under varied conditions either in the biopolymer or loaded inside cells. Cell viability, alginate viscosity, nanoparticle movement and printing resolution were measured. We now show that while nanoparticles decreased cell viability, nozzle size had no significant effect. High printing pressure decreased cell viability, but viability loss was not accentuated by nanoparticles. High nanoparticle concentrations increased alginate viscosity at higher alginate concentrations. Nanoparticle velocity in response to a magnetic field was a function of nanoparticle diameter and scaffold viscosity, which agreed with a mathematical model of nanoparticle movement. Finally, the nano-bioprinting system resolution and patterning precision were not affected by nanoparticles in the prepolymer solution. These data suggest that nanoparticle incorporation in solid freeform fabrication does not change biofabrication parameters unless high nanoparticle concentrations are used. Future work includes developing vascularized tissue engineering constructs using the nano-bioprinting system.

  19. The role of printing parameters and scaffold biopolymer properties in the efficacy of a new hybrid nano-bioprinting system

    International Nuclear Information System (INIS)

    Buyukhatipoglu, Kivilcim; Jo, Wonjin; Sun Wei; Clyne, Alisa Morss

    2009-01-01

    We created a hybrid nano-bioprinting system, which combines the initial patterning capabilities of direct cell writing with the active patterning capabilities of superparamagnetic nanoparticles. Biofabrication conditions, including printing parameters and scaffold biopolymer properties, may affect cell viability, nanoparticle manipulation and patterning capabilities. Nanoparticles were printed under varied conditions either in the biopolymer or loaded inside cells. Cell viability, alginate viscosity, nanoparticle movement and printing resolution were measured. We now show that while nanoparticles decreased cell viability, nozzle size had no significant effect. High printing pressure decreased cell viability, but viability loss was not accentuated by nanoparticles. High nanoparticle concentrations increased alginate viscosity at higher alginate concentrations. Nanoparticle velocity in response to a magnetic field was a function of nanoparticle diameter and scaffold viscosity, which agreed with a mathematical model of nanoparticle movement. Finally, the nano-bioprinting system resolution and patterning precision were not affected by nanoparticles in the prepolymer solution. These data suggest that nanoparticle incorporation in solid freeform fabrication does not change biofabrication parameters unless high nanoparticle concentrations are used. Future work includes developing vascularized tissue engineering constructs using the nano-bioprinting system.

  20. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-04

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  1. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  2. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2015-03-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  3. Investigation of DC hybrid circuit breaker based on high-speed switch and arc generator

    Science.gov (United States)

    Wu, Yifei; Rong, Mingzhe; Wu, Yi; Yang, Fei; Li, Mei; Zhong, Jianying; Han, Guohui; Niu, Chunping; Hu, Yang

    2015-02-01

    A new design of DC hybrid circuit breaker based on high-speed switch (HSS) and arc generator (AG), which can drastically profit from low heat loss in normal state and fast current breaking under fault state, is presented and analyzed in this paper. AG is designed according to the magnetic pinch effect of liquid metal. By utilizing the arc voltage generated across AG, the fault current is rapidly commutated from HSS into parallel connected branch. As a consequence, the arcless open of HSS is achieved. The post-arc conducting resume time (Δ tc) of AG and the commutation original voltage (Uc), two key factors in the commutation process, are investigated experimentally. Particularly, influences of the liquid metal channel diameter (Φ) of AG, fault current rate of rise (di/dt) and Uc on Δ tc are focused on. Furthermore, a suitable Uc is determined during the current commutation process, aiming at the reliable arcless open of HSS and short breaking time. Finally, the fault current breaking test is carried out for the current peak value of 11.8 kA, and the validity of the design is confirmed by the experimental results.

  4. Investigation of DC hybrid circuit breaker based on high-speed switch and arc generator.

    Science.gov (United States)

    Wu, Yifei; Rong, Mingzhe; Wu, Yi; Yang, Fei; Li, Mei; Zhong, Jianying; Han, Guohui; Niu, Chunping; Hu, Yang

    2015-02-01

    A new design of DC hybrid circuit breaker based on high-speed switch (HSS) and arc generator (AG), which can drastically profit from low heat loss in normal state and fast current breaking under fault state, is presented and analyzed in this paper. AG is designed according to the magnetic pinch effect of liquid metal. By utilizing the arc voltage generated across AG, the fault current is rapidly commutated from HSS into parallel connected branch. As a consequence, the arcless open of HSS is achieved. The post-arc conducting resume time (Δ tc) of AG and the commutation original voltage (Uc), two key factors in the commutation process, are investigated experimentally. Particularly, influences of the liquid metal channel diameter (Φ) of AG, fault current rate of rise (di/dt) and Uc on Δ tc are focused on. Furthermore, a suitable Uc is determined during the current commutation process, aiming at the reliable arcless open of HSS and short breaking time. Finally, the fault current breaking test is carried out for the current peak value of 11.8 kA, and the validity of the design is confirmed by the experimental results.

  5. SEMICONDUCTOR INTEGRATED CIRCUITS: A high performance 90 nm CMOS SAR ADC with hybrid architecture

    Science.gov (United States)

    Xingyuan, Tong; Jianming, Chen; Zhangming, Zhu; Yintang, Yang

    2010-01-01

    A 10-bit 2.5 MS/s SAR A/D converter is presented. In the circuit design, an R-C hybrid architecture D/A converter, pseudo-differential comparison architecture and low power voltage level shifters are utilized. Design challenges and considerations are also discussed. In the layout design, each unit resistor is sided by dummies for good matching performance, and the capacitors are routed with a common-central symmetry method to reduce the nonlin-earity error. This proposed converter is implemented based on 90 nm CMOS logic process. With a 3.3 V analog supply and a 1.0 V digital supply, the differential and integral nonlinearity are measured to be less than 0.36 LSB and 0.69 LSB respectively. With an input frequency of 1.2 MHz at 2.5 MS/s sampling rate, the SFDR and ENOB are measured to be 72.86 dB and 9.43 bits respectively, and the power dissipation is measured to be 6.62 mW including the output drivers. This SAR A/D converter occupies an area of 238 × 214 μm2. The design results of this converter show that it is suitable for multi-supply embedded SoC applications.

  6. Zirconia UV-curable colloids for additive manufacturing via hybrid inkjet printing-stereolithography

    DEFF Research Database (Denmark)

    Rosa, Massimo; Barou, C.; Esposito, Vincenzo

    2018-01-01

    Currently, additive manufacturing of ceramics by stereolithography (SLA) is limited to single materials and by a poor thickness resolution that strongly depends on the ceramic particles-UV light interaction. Combining selective laser curing with inkjet printing represents a novel strategy...... to overcome these constrains. Nonetheless, this approach requires UV-curable inks that allow hardening of the printed material and sintering to high density. In this work, we report how to design an ink for inkjet printing of yttria stabilized zirconia (YSZ) which can be impressed by addition of UV...

  7. 3D printing of hybrid biomaterials for bone tissue engineering: Calcium-polyphosphate microparticles encapsulated by polycaprolactone.

    Science.gov (United States)

    Neufurth, Meik; Wang, Xiaohong; Wang, Shunfeng; Steffen, Renate; Ackermann, Maximilian; Haep, Natalie D; Schröder, Heinz C; Müller, Werner E G

    2017-12-01

    Here we describe the formulation of a morphogenetically active bio-ink consisting of amorphous microparticles (MP) prepared from Ca 2+ and the physiological inorganic polymer, polyphosphate (polyP). Those MP had been fortified by mixing with poly-ε-caprolactone (PCL) to allow 3D-bioprinting. The resulting granular PCL/Ca-polyP-MP hybrid material, liquefied by short-time heating to 100 °C, was used for the 3D-printing of tissue-like scaffolds formed by strands with a thickness of 400 µm and a stacked architecture leaving ≈0.5 mm 2 -sized open holes enabling cell migration. The printed composite scaffold turned out to combine suitable biomechanical properties (Young's modulus of 1.60 ± 0.1 GPa; Martens hardness of 153 ± 28 MPa), matching those of cortical and trabecular bone, with morphogenetic activity. This scaffold was capable of attracting and promoting the growth of human bone-related SaOS-2 cells as demonstrated by staining for cell viability (Calcein AM), cell density (DRAQ5) and SEM studies. Furthermore, the hybrid material was demonstrated to upregulate the steady-state-expression of the cell migration-inducing chemokine SDF-1α. EDX analysis and FTIR measurements revealed the presence of hydroxyapatite in the mineral deposits formed on the scaffold surface. Based on the results we conclude that granular PCL/Ca-polyP-MP hybrid material is suitable for the fabrication of bioprintable scaffold which comprises not only biomechanical stability but also morphogenetic potential. In present-day regenerative engineering efforts, biomaterial- and cell-based strategies are proposed that meet the required functional and spatial characteristics and variations, especially in the transition regions between soft (cartilage, tendon or ligament) and hard (bone) tissues. In a biomimetic approach we succeeded to fabricate amorphous Ca-polyP nanoparticles/microparticles which are highly biocompatible. Together with polycaprolactone (PCL), polyP can be

  8. Application of Inkjet Printing in High-Density Pixelated RGB Quantum Dot-Hybrid LEDs

    KAUST Repository

    Haverinen, Hanna

    2012-05-23

    Recently, an intriguing solution to obtain better color purity has been to introduce inorganic emissive quantum dots (QDs) into an otherwise OLED structure. The emphasis of this chapter is to present a simple discussion of the first attempts to fabricate high-density, pixelated (quarter video graphics array (QVGA) format), monochromatic and RGB quantum dots light-emitting diodes (QDLEDs), where inkjet printing is used to deposit the light-emitting layer of QDs. It shows some of the factors that have to be considered in order to achieve the desired accuracy and printing quality. The successful operation of the RGB printed devices indicates the potential of the inkjet printing approach in the fabrication of full-color QDLEDs for display application. However, further optimization of print quality is still needed in order to eliminate the formation of pinholes, thus maximizing energy transfer from organic layers to the QDs and in turn increasing the performance of the devices. Controlled Vocabulary Terms: ink jet printing; LED displays; LED lamps; organic light emitting diodes; quantum dots

  9. 18k Channels single photon counting readout circuit for hybrid pixel detector

    International Nuclear Information System (INIS)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e − and the equivalent noise charge is 168 e − rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  10. 18k Channels single photon counting readout circuit for hybrid pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Maj, P., E-mail: piotr.maj@agh.edu.pl [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Grybos, P.; Szczygiel, R.; Zoladz, M. [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Sakumura, T.; Tsuji, Y. [X-ray Analysis Division, Rigaku Corporation, Matsubara, Akishima, Tokyo 196-8666 (Japan)

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm Multiplication-Sign 20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96 Multiplication-Sign 192 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 {mu}W/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 {mu}V/e{sup -} and the equivalent noise charge is 168 e{sup -} rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  11. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  12. A Novel Topology of Hybrid HVDC Circuit Breaker for VSC-HVDC Application

    Directory of Open Access Journals (Sweden)

    Van-Vinh Nguyen

    2017-10-01

    Full Text Available The use of high voltage direct current (HVDC circuit breakers (CBs with the capabilities of bidirectional fault interruption, reclosing, and rebreaking can improve the reliable and safe operation of HVDC grids. Although several topologies of CBs have been proposed to perform these capabilities, the limitation of these topologies is either high on-state losses or long time interruption in the case bidirectional fault current interruption. Long time interruption results in the large magnitude of the fault current in the voltage source converter based HVDC (VSC-HVDC system due to the high rate of rise of fault current. This paper proposes a new topology of hybrid CB (HCB with lower conduction loss and lower interruption time to solve the problems. The proposed topology is based on the inverse current injection method, which uses the capacitor to enforce the fault current to zero. In the case of the bidirectional fault current interruption, the capacitor does not change its polarity after identifying the direction of fault current, which can reduce the interruption time accordingly. A switching control algorithm for the proposed topology is presented in detail. Different operation modes of proposed HCB, such as normal current mode, breaking fault current mode, discharging, and reversing capacitor voltage modes after clearing the fault, are considered in the proposed algorithm. The proposed topology with the switching control algorithm is tested in a simulation-based system. Different simulation scenarios such as temporary and permanent faults are carried out to verify the performance of the proposed topology. The simulation is performed in the Matlab/Simulink environment.

  13. A comparison of different silver inks for printing of conductive tracks on paper substrates for rapid prototyping of electronic circuits

    CSIR Research Space (South Africa)

    Bezuidenhout, PH

    2015-11-01

    Full Text Available This study compares the performance between two commercially-available electrically conductive silver inks, Harima NPS-J nanopaste and the NBSIJ-FD02 Mitsubishi conductive ink, used in rapid prototyping of electronic circuits. The comparative...

  14. Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit.

    Science.gov (United States)

    Guan, Binbin; Scott, Ryan P; Qin, Chuan; Fontaine, Nicolas K; Su, Tiehui; Ferrari, Carlo; Cappuzzo, Mark; Klemens, Fred; Keller, Bob; Earnshaw, Mark; Yoo, S J B

    2014-01-13

    We demonstrate free-space space-division-multiplexing (SDM) with 15 orbital angular momentum (OAM) states using a three-dimensional (3D) photonic integrated circuit (PIC). The hybrid device consists of a silica planar lightwave circuit (PLC) coupled to a 3D waveguide circuit to multiplex/demultiplex OAM states. The low excess loss hybrid device is used in individual and two simultaneous OAM states multiplexing and demultiplexing link experiments with a 20 Gb/s, 1.67 b/s/Hz quadrature phase shift keyed (QPSK) signal, which shows error-free performance for 379,960 tested bits for all OAM states.

  15. Guanidinium: A Route to Enhanced Carrier Lifetime and Open-Circuit Voltage in Hybrid Perovskite Solar Cells.

    Science.gov (United States)

    De Marco, Nicholas; Zhou, Huanping; Chen, Qi; Sun, Pengyu; Liu, Zonghao; Meng, Lei; Yao, En-Ping; Liu, Yongsheng; Schiffer, Andy; Yang, Yang

    2016-02-10

    Hybrid perovskites have shown astonishing power conversion efficiencies owed to their remarkable absorber characteristics including long carrier lifetimes, and a relatively substantial defect tolerance for solution-processed polycrystalline films. However, nonradiative charge carrier recombination at grain boundaries limits open circuit voltages and consequent performance improvements of perovskite solar cells. Here we address such recombination pathways and demonstrate a passivation effect through guanidinium-based additives to achieve extraordinarily enhanced carrier lifetimes and higher obtainable open circuit voltages. Time-resolved photoluminescence measurements yield carrier lifetimes in guanidinium-based films an order of magnitude greater than pure-methylammonium counterparts, giving rise to higher device open circuit voltages and power conversion efficiencies exceeding 17%. A reduction in defect activation energy of over 30% calculated via admittance spectroscopy and confocal fluorescence intensity mapping indicates successful passivation of recombination/trap centers at grain boundaries. We speculate that guanidinium ions serve to suppress formation of iodide vacancies and passivate under-coordinated iodine species at grain boundaries and within the bulk through their hydrogen bonding capability. These results present a simple method for suppressing nonradiative carrier loss in hybrid perovskites to further improve performances toward highly efficient solar cells.

  16. Embedding of inkjet-printed Ag-grid/ITO hybrid transparent electrode ...

    Indian Academy of Sciences (India)

    2018-02-02

    Feb 2, 2018 ... Keywords. Solution process; inkjet; electrohydrodynamic printing; transparent electrode; flexible electrode. 1. Introduction. Transparent electrodes (TEs) are one of the most indispensable materials to fabricate rapidly emerging elec- tronic devices, including flexible displays, touch panels, photovoltaic cells ...

  17. Application of Inkjet Printing in High-Density Pixelated RGB Quantum Dot-Hybrid LEDs

    KAUST Repository

    Haverinen, Hanna; Jabbour, Ghassan E.

    2012-01-01

    to fabricate high-density, pixelated (quarter video graphics array (QVGA) format), monochromatic and RGB quantum dots light-emitting diodes (QDLEDs), where inkjet printing is used to deposit the light-emitting layer of QDs. It shows some of the factors

  18. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2014-09-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  19. Hybrid Ag-based inks for nanocomposite inkjet printed lines: RF properties

    Energy Technology Data Exchange (ETDEWEB)

    Chiolerio, Alessandro [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Camarchia, Vittorio, E-mail: vittorio.camarchia@polito.it [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Electronics and Telecommunications Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy); Quaglia, Roberto; Pirola, Marco [Electronics and Telecommunications Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy); Pandolfi, Paolo [Politronica Inkjet Printing S.r.l., C/O i3p, Corso Castelfidardo 30/A, 10129 Torino (Italy); Pirri, Candido Fabrizio [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Applied Science and Technology Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy)

    2014-12-05

    Highlights: • Polymer–silver nanocomposite conductive ink for RF fast prototyping. • Reduction of the sintering temperature. • Improved printing resolution. • State-of-the-art electrical conductivity. • Good RF performances. - Abstract: The development of highly conductive Ag nanoparticle (NP)-based inkjet printed (IP) connections is a fundamental process for the success of next-generation digitally printed electronics. This is true both at low frequency and at RF, considering the increasing integration of heterogeneous technologies and the use of flexible substrates. Ink-based technologies provide and form at liquid state the functional material that is then delivered to solid via a sintering process to achieve NP coalescence and electrical percolation. Sintering must be performed at very low temperatures (depending on the substrate choice) to be compatible with previous process steps, to preserve the geometry and fulfill the requirements in term of electrical conductivity, as well as to reduce production costs. While IP, as additive technology, is now well settled for DC or low frequency applications, few results on electrical characterization at RF or microwave frequencies are present due to low conductivity, poor geometry definition and low reproducibility. Hence, a good setup of ink formulation and technological realization is fundamental to enable system performance assessment in the high frequency regime. In this paper we propose a breakthrough: we present a nanocomposite ink, whose thermal and DC electrical properties are extremely interesting and competitive with pure-metallic ink systems. Introducing a copolymer in the formulation, we obtained a reduction of the overall sintering temperature, if compared to the pristine NP suspension, along with improved printing resolution together with very good electrical conductivity. The RF characterization has been performed in the range 1–6 GHz on geometries printed on sintered alumina and on a power

  20. Hybrid Ag-based inks for nanocomposite inkjet printed lines: RF properties

    International Nuclear Information System (INIS)

    Chiolerio, Alessandro; Camarchia, Vittorio; Quaglia, Roberto; Pirola, Marco; Pandolfi, Paolo; Pirri, Candido Fabrizio

    2014-01-01

    Highlights: • Polymer–silver nanocomposite conductive ink for RF fast prototyping. • Reduction of the sintering temperature. • Improved printing resolution. • State-of-the-art electrical conductivity. • Good RF performances. - Abstract: The development of highly conductive Ag nanoparticle (NP)-based inkjet printed (IP) connections is a fundamental process for the success of next-generation digitally printed electronics. This is true both at low frequency and at RF, considering the increasing integration of heterogeneous technologies and the use of flexible substrates. Ink-based technologies provide and form at liquid state the functional material that is then delivered to solid via a sintering process to achieve NP coalescence and electrical percolation. Sintering must be performed at very low temperatures (depending on the substrate choice) to be compatible with previous process steps, to preserve the geometry and fulfill the requirements in term of electrical conductivity, as well as to reduce production costs. While IP, as additive technology, is now well settled for DC or low frequency applications, few results on electrical characterization at RF or microwave frequencies are present due to low conductivity, poor geometry definition and low reproducibility. Hence, a good setup of ink formulation and technological realization is fundamental to enable system performance assessment in the high frequency regime. In this paper we propose a breakthrough: we present a nanocomposite ink, whose thermal and DC electrical properties are extremely interesting and competitive with pure-metallic ink systems. Introducing a copolymer in the formulation, we obtained a reduction of the overall sintering temperature, if compared to the pristine NP suspension, along with improved printing resolution together with very good electrical conductivity. The RF characterization has been performed in the range 1–6 GHz on geometries printed on sintered alumina and on a power

  1. Hybrid fibre lighting - directed towards a smaller ecological foot print; Hybrid fiber belysning - rettet mod et mindre oekologisk fodaftryk

    Energy Technology Data Exchange (ETDEWEB)

    Bjarklev, A; Scolari, L [DTU Fotonik, Kgs. Lyngby (Denmark); Bjarklev, A; Kjaer, T; Andersen, Jan [RUC-ENSPAC, Roskilde (Denmark); Trolle, H; Laursen, K; Riisberg, V [Designskolen Kolding, Kolding (Denmark); Ibsen, P [IBSEN El-anlaeg ApS, Roskilde (Denmark)

    2010-09-15

    Building on one of the world-leading technologies in fiber optics this project uncovers, whether it is realistic under Danish conditions to exploit opportunities within hybrid fiber illumination - i.e. systems that directly moves the sun indoors via fiber optics. Hybrid lighting is a combination of four technologies: the collection of sunlight (daylight), generation of artificial light, assembly, transportation and distribution of light where needed, and operational control of both natural and artificial light. Some of the significant findings from this project are a design of a hybrid system based on a solar optical system and LED technology, and design and development of fixtures that could combine both daylight and artificial light. The analysis showed that a system based on only LEDs could save 36% energy compared with a system based on the T5 (fluorescent lamps), which today is considered the best available technology. The analysis further indicates an energy saving of 59% when you combine a solar optical system with LED technology in a hybrid system. It is found that there is great potential for further design and applications which can be based for a hybrid lighting combined with the two technologies mentioned above (optical fibers and LEDs). It was also found that hybrid lighting systems are in a very early stage of the innovation life cycle and that one of the most important barriers for successful implementation is the considerably high price. However, this is a typical problem that arises with new technologies and, therefore, further development followed by pilot test projects could bring this technology fast to a more competitive phase, even if one as the basis selects systems based on the T5 technology. There is widespread acceptance of the hybrid system by office users in many areas where it is not possible to have windows, but to make the system work in other sectors, it is necessary to continue research in design that can provide a greater light

  2. Standardization of Schwarz-Christoffel transformation for engineering design of semiconductor and hybrid integrated-circuit elements

    Science.gov (United States)

    Yashin, A. A.

    1985-04-01

    A semiconductor or hybrid structure into a calculable two-dimensional region mapped by the Schwarz-Christoffel transformation and a universal algorithm can be constructed on the basis of Maxwell's electro-magnetic-thermal similarity principle for engineering design of integrated-circuit elements. The design procedure involves conformal mapping of the original region into a polygon and then the latter into a rectangle with uniform field distribution, where conductances and capacitances are calculated, using tabulated standard mapping functions. Subsequent synthesis of a device requires inverse conformal mapping. Devices adaptable as integrated-circuit elements are high-resistance film resistors with periodic serration, distributed-resistance film attenuators with high transformation ratio, coplanar microstrip lines, bipolar transistors, directional couplers with distributed coupling to microstrip lines for microwave bulk devices, and quasirregular smooth matching transitions from asymmetric to coplanar microstrip lines.

  3. INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

    Energy Technology Data Exchange (ETDEWEB)

    Olesen, S. T.

    1971-11-15

    The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

  4. Design and fabrication of advanced hybrid circuits for high energy physics

    International Nuclear Information System (INIS)

    Haller, G.M.; Moss, J.; Freytag, D.R.; Nelson, D.; Yim, A.; Lo, C.C.

    1987-10-01

    Current design and fabrication techniques of hybrid devices are explained for the Drift Chamber and the Liquid Argon Calorimeter for the Stanford Linear Collider Large Detector (SLD) at SLAC. Methods of developing layouts, ranging from hand-cut templates to advanced designs utilizing CAD tools with special hybrid design software were applied. Physical and electrical design rules for good yield and performance are discussed. Fabrication and assembly of the SLD hybrids are described. 7 refs., 10 figs

  5. Printed photodetectors

    International Nuclear Information System (INIS)

    Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

    2015-01-01

    Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems. (paper)

  6. Printed photodetectors

    Science.gov (United States)

    Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

    2015-10-01

    Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems.

  7. Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

    International Nuclear Information System (INIS)

    Khan, Umer Amir; Lee, Jong-Geon; Seo, In-Jin; Amir, Faisal; Lee, Bang-Wook

    2015-01-01

    Highlights: • A novel hybrid-type superconducting circuit breaker (SDCCB) is proposed. • SDCCB has SFCL located in the main current path to limit the fault current until the final trip signal. • SFCL in SDCCB suppressed the fast rising DC fault current for a predefined time. • SFCL significantly reduced the DC current breaking stress on SDCCB components. • SDCCB isolated the HVDC faulty line in three, four, and five converter stations MTDC. - Abstract: Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

  8. Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

    Energy Technology Data Exchange (ETDEWEB)

    Khan, Umer Amir [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of); National University of Sciences and Technology, PNEC Campus, Habib Rehmatullah Road, Karachi (Pakistan); Lee, Jong-Geon; Seo, In-Jin [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of); Amir, Faisal [National University of Sciences and Technology, PNEC Campus, Habib Rehmatullah Road, Karachi (Pakistan); Lee, Bang-Wook, E-mail: bangwook@hanyang.ac.kr [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of)

    2015-11-15

    Highlights: • A novel hybrid-type superconducting circuit breaker (SDCCB) is proposed. • SDCCB has SFCL located in the main current path to limit the fault current until the final trip signal. • SFCL in SDCCB suppressed the fast rising DC fault current for a predefined time. • SFCL significantly reduced the DC current breaking stress on SDCCB components. • SDCCB isolated the HVDC faulty line in three, four, and five converter stations MTDC. - Abstract: Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

  9. Three-input gate logic circuits on chemically assembled single-electron transistors with organic and inorganic hybrid passivation layers.

    Science.gov (United States)

    Majima, Yutaka; Hackenberger, Guillaume; Azuma, Yasuo; Kano, Shinya; Matsuzaki, Kosuke; Susaki, Tomofumi; Sakamoto, Masanori; Teranishi, Toshiharu

    2017-01-01

    Single-electron transistors (SETs) are sub-10-nm scale electronic devices based on conductive Coulomb islands sandwiched between double-barrier tunneling barriers. Chemically assembled SETs with alkanethiol-protected Au nanoparticles show highly stable Coulomb diamonds and two-input logic operations. The combination of bottom-up and top-down processes used to form the passivation layer is vital for realizing multi-gate chemically assembled SET circuits, as this combination enables us to connect conventional complementary metal oxide semiconductor (CMOS) technologies via planar processes. Here, three-input gate exclusive-OR (XOR) logic operations are demonstrated in passivated chemically assembled SETs. The passivation layer is a hybrid bilayer of self-assembled monolayers (SAMs) and pulsed laser deposited (PLD) aluminum oxide (AlO[Formula: see text]), and top-gate electrodes were prepared on the hybrid passivation layers. Top and two-side-gated SETs showed clear Coulomb oscillation and diamonds for each of the three available gates, and three-input gate XOR logic operation was clearly demonstrated. These results show the potential of chemically assembled SETs to work as logic devices with multi-gate inputs using organic and inorganic hybrid passivation layers.

  10. Swarm intelligence-based approach for optimal design of CMOS differential amplifier and comparator circuit using a hybrid salp swarm algorithm

    Science.gov (United States)

    Asaithambi, Sasikumar; Rajappa, Muthaiah

    2018-05-01

    In this paper, an automatic design method based on a swarm intelligence approach for CMOS analog integrated circuit (IC) design is presented. The hybrid meta-heuristics optimization technique, namely, the salp swarm algorithm (SSA), is applied to the optimal sizing of a CMOS differential amplifier and the comparator circuit. SSA is a nature-inspired optimization algorithm which mimics the navigating and hunting behavior of salp. The hybrid SSA is applied to optimize the circuit design parameters and to minimize the MOS transistor sizes. The proposed swarm intelligence approach was successfully implemented for an automatic design and optimization of CMOS analog ICs using Generic Process Design Kit (GPDK) 180 nm technology. The circuit design parameters and design specifications are validated through a simulation program for integrated circuit emphasis simulator. To investigate the efficiency of the proposed approach, comparisons have been carried out with other simulation-based circuit design methods. The performances of hybrid SSA based CMOS analog IC designs are better than the previously reported studies.

  11. Solvent-Assisted Gel Printing for Micropatterning Thin Organic-Inorganic Hybrid Perovskite Films.

    Science.gov (United States)

    Jeong, Beomjin; Hwang, Ihn; Cho, Sung Hwan; Kim, Eui Hyuk; Cha, Soonyoung; Lee, Jinseong; Kang, Han Sol; Cho, Suk Man; Choi, Hyunyong; Park, Cheolmin

    2016-09-27

    While tremendous efforts have been made for developing thin perovskite films suitable for a variety of potential photoelectric applications such as solar cells, field-effect transistors, and photodetectors, only a few works focus on the micropatterning of a perovskite film which is one of the most critical issues for large area and uniform microarrays of perovskite-based devices. Here we demonstrate a simple but robust method of micropatterning a thin perovskite film with controlled crystalline structure which guarantees to preserve its intrinsic photoelectric properties. A variety of micropatterns of a perovskite film are fabricated by either microimprinting or transfer-printing a thin spin-coated precursor film in soft-gel state with a topographically prepatterned elastomeric poly(dimethylsiloxane) (PDMS) mold, followed by thermal treatment for complete conversion of the precursor film to a perovskite one. The key materials development of our solvent-assisted gel printing is to prepare a thin precursor film with a high-boiling temperature solvent, dimethyl sulfoxide. The residual solvent in the precursor gel film makes the film moldable upon microprinting with a patterned PDMS mold, leading to various perovskite micropatterns in resolution of a few micrometers over a large area. Our nondestructive micropatterning process does not harm the intrinsic photoelectric properties of a perovskite film, which allows for realizing arrays of parallel-type photodetectors containing micropatterns of a perovskite film with reliable photoconduction performance. The facile transfer of a micropatterned soft-gel precursor film on other substrates including mechanically flexible plastics can further broaden its applications to flexible photoelectric systems.

  12. Co-Deposition of a Hydrogel/Calcium Phosphate Hybrid Layer on 3D Printed Poly(Lactic Acid Scaffolds via Dip Coating: Towards Automated Biomaterials Fabrication

    Directory of Open Access Journals (Sweden)

    Matthias Schneider

    2018-03-01

    Full Text Available The article describes the surface modification of 3D printed poly(lactic acid (PLA scaffolds with calcium phosphate (CP/gelatin and CP/chitosan hybrid coating layers. The presence of gelatin or chitosan significantly enhances CP co-deposition and adhesion of the mineral layer on the PLA scaffolds. The hydrogel/CP coating layers are fairly thick and the mineral is a mixture of brushite, octacalcium phosphate, and hydroxyapatite. Mineral formation is uniform throughout the printed architectures and all steps (printing, hydrogel deposition, and mineralization are in principle amenable to automatization. Overall, the process reported here therefore has a high application potential for the controlled synthesis of biomimetic coatings on polymeric biomaterials.

  13. Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

    Directory of Open Access Journals (Sweden)

    Vučinić Aleksandra S.

    2017-01-01

    Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

  14. Development of hybrid micro circuit based multi-channel programmable HV supply for BARC-pelletron experimental facility

    International Nuclear Information System (INIS)

    Manna, A.; Thombare, S.; Moitra, S.; Kuswarkar, M.; Punna, M.; Nair, P.M.; Diwakar, M.P.; Pithawa, C.K.

    2013-01-01

    Electronics Division, BARC has developed a Multi channel programmable HV bias supply system for charge particle detector array for use in BARC-TIFR Pelletron-LINAC facility. The HV supplies are compact in size due to use of hybrid micro-circuits developed indigenously and are modular in construction to achieve versatility, scalability and serviceability. All programming operations and monitoring are performed remotely through PC over Ethernet. Each supply has a built-in over voltage, over current and thermal overload protections for safe operation and employs a Zero Voltage Switching (ZVS) technique to reduce thermal stress on the inverter switches. This article describes salient design aspects and performance of the HV supply system. (author)

  15. A novel 3D-printed hybrid simulation model for robotic-assisted kidney transplantation (RAKT).

    Science.gov (United States)

    Uwechue, Raphael; Gogalniceanu, Petrut; Kessaris, Nicos; Byrne, Nick; Chandak, Pankaj; Olsburgh, Jonathon; Ahmed, Kamran; Mamode, Nizam; Loukopoulos, Ioannis

    2018-01-27

    Robotic-assisted kidney transplantation (RAKT) offers key benefits for patients that have been demonstrated in several studies. A barrier to the wider uptake of RAKT is surgical skill acquisition. This is exacerbated by the challenges of modern surgery with reduced surgical training time, patient safety concerns and financial pressures. Simulation is a well-established method of developing surgical skill in a safe and controlled environment away from the patient. We have developed a 3D printed simulation model for the key step of the kidney transplant operation which is the vascular anastomosis. The model is anatomically accurate, based on the CT scans of patients and it incorporates deceased donor vascular tissue. Crucially, it was developed to be used in the robotic operating theatre with the operating robot to enhance its fidelity. It is portable and relatively inexpensive when compared with other forms of simulation such as virtual reality or animal lab training. It thus has the potential of being more accessible as a training tool for the safe acquisition of RAKT specific skills. We demonstrate this model here.

  16. Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

    Science.gov (United States)

    Khan, Umer Amir; Lee, Jong-Geon; Seo, In-Jin; Amir, Faisal; Lee, Bang-Wook

    2015-11-01

    Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

  17. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  18. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution.

    Science.gov (United States)

    Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

    2016-04-15

    The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400°C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200°C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones. Copyright © 2015 Elsevier B.V. All rights reserved.

  19. Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2015-06-15

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  20. Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-01

    The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

  1. Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

    Science.gov (United States)

    Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple.

  2. Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

    Science.gov (United States)

    Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

  3. Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

    Science.gov (United States)

    Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

    2018-02-01

    Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

  4. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

    Energy Technology Data Exchange (ETDEWEB)

    Stuhlpfarrer, Philipp, E-mail: philipp-johannes.stuhlpfarrer@stud.unileoben.ac.at; Luidold, Stefan; Antrekowitsch, Helmut

    2016-04-15

    Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

  5. Numerical Investigation on the Flow and Heat Transfer Characteristics of Supercritical Liquefied Natural Gas in an Airfoil Fin Printed Circuit Heat Exchanger

    Directory of Open Access Journals (Sweden)

    Zhongchao Zhao

    2017-11-01

    Full Text Available As a new kind of highly compact and efficient micro-channel heat exchanger, the printed circuit heat exchanger (PCHE is a promising candidate satisfying the heat exchange requirements of liquefied natural gas (LNG vaporization at low and high pressure. The effects of airfoil fin arrangement on heat transfer and flow resistance were numerically investigated using supercritical liquefied natural gas (LNG as working fluid. The thermal properties of supercritical LNG were tested by utilizing the REFPROF software database. Numerical simulations were performed using FLUENT. The inlet temperature of supercritical LNG was 121 K, and its pressure was 10.5 MPa. The reference mass flow rate of LNG was set as 1.22 g/s for the vertical pitch Lv = 1.67 mm and the staggered pitch Ls = 0 mm, with the Reynolds number of about 3750. The SST k-ω model was selected and verified by comparing with the experimental data using supercritical liquid nitrogen as cold fluid. The airfoil fin PCHE had better thermal-hydraulic performance than that of the straight channel PCHE. Moreover, the airfoil fins with staggered arrangement displayed better thermal performance than that of the fins with parallel arrangement. The thermal-hydraulic performance of airfoil fin PCHE was improved with increasing Ls and Lv. Moreover, Lv affected the Nusselt number and pressure drop of airfoil fin PCHE more obviously. In conclusion, a sparser staggered arrangement of fins showed a better thermal-hydraulic performance in airfoil fin PCHE.

  6. Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

    Science.gov (United States)

    Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

    2008-05-01

    The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

  7. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

    International Nuclear Information System (INIS)

    Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

    2016-01-01

    Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

  8. Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

    International Nuclear Information System (INIS)

    Wang, W.; Kobayashi, T.; Chikushi, J.

    2000-01-01

    Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

  9. Synthesis of pure colloidal silver nanoparticles with high electroconductivity for printed electronic circuits: the effect of amines on their formation in aqueous media.

    Science.gov (United States)

    Natsuki, Jun; Abe, Takao

    2011-07-01

    This paper describes a practical and convenient method to prepare stable colloidal silver nanoparticles for use in printed electronic circuits. The method uses a dispersant and two kinds of reducing agents including 2-(dimethylamino) ethanol (DMAE), which play important roles in the reduction of silver ions in an aqueous medium. The effect of DMAE and dispersant, as well as the factors affecting particle size and morphology are investigated. In the formation of the silver nanoparticles, reduction occurs rapidly at room temperature and the silver particles can be separated easily from the mixture in a short time. In addition, organic solvents are not used. Pure, small and relatively uniform particles with a diameter less than 10 nm can be obtained that exhibit high electroconductivity. The silver nanoparticles are stable, and can be isolated as a dried powder that can be fully redispersed in deionized water. This method of producing colloidal silver nanoparticles will find practical use in electronics applications. Copyright © 2011 Elsevier Inc. All rights reserved.

  10. Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

    Science.gov (United States)

    Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

    2015-01-01

    This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

  11. Hierarchical hybrid control of manipulators: Artificial intelligence in large scale integrated circuits

    Science.gov (United States)

    Greene, P. H.

    1972-01-01

    Both in practical engineering and in control of muscular systems, low level subsystems automatically provide crude approximations to the proper response. Through low level tuning of these approximations, the proper response variant can emerge from standardized high level commands. Such systems are expressly suited to emerging large scale integrated circuit technology. A computer, using symbolic descriptions of subsystem responses, can select and shape responses of low level digital or analog microcircuits. A mathematical theory that reveals significant informational units in this style of control and software for realizing such information structures are formulated.

  12. Introduction to printed electronics

    CERN Document Server

    Suganuma, Katsuaki

    2014-01-01

    This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

  13. Lightwave Circuits in Lithium Niobate through Hybrid Waveguides with Silicon Photonics.

    Science.gov (United States)

    Weigel, Peter O; Savanier, Marc; DeRose, Christopher T; Pomerene, Andrew T; Starbuck, Andrew L; Lentine, Anthony L; Stenger, Vincent; Mookherjea, Shayan

    2016-03-01

    We demonstrate a photonic waveguide technology based on a two-material core, in which light is controllably and repeatedly transferred back and forth between sub-micron thickness crystalline layers of Si and LN bonded to one another, where the former is patterned and the latter is not. In this way, the foundry-based wafer-scale fabrication technology for silicon photonics can be leveraged to form lithium-niobate based integrated optical devices. Using two different guided modes and an adiabatic mode transition between them, we demonstrate a set of building blocks such as waveguides, bends, and couplers which can be used to route light underneath an unpatterned slab of LN, as well as outside the LN-bonded region, thus enabling complex and compact lightwave circuits in LN alongside Si photonics with fabrication ease and low cost.

  14. Lightwave Circuits in Lithium Niobate through Hybrid Waveguides with Silicon Photonics

    Science.gov (United States)

    Weigel, Peter O.; Savanier, Marc; DeRose, Christopher T.; Pomerene, Andrew T.; Starbuck, Andrew L.; Lentine, Anthony L.; Stenger, Vincent; Mookherjea, Shayan

    2016-01-01

    We demonstrate a photonic waveguide technology based on a two-material core, in which light is controllably and repeatedly transferred back and forth between sub-micron thickness crystalline layers of Si and LN bonded to one another, where the former is patterned and the latter is not. In this way, the foundry-based wafer-scale fabrication technology for silicon photonics can be leveraged to form lithium-niobate based integrated optical devices. Using two different guided modes and an adiabatic mode transition between them, we demonstrate a set of building blocks such as waveguides, bends, and couplers which can be used to route light underneath an unpatterned slab of LN, as well as outside the LN-bonded region, thus enabling complex and compact lightwave circuits in LN alongside Si photonics with fabrication ease and low cost. PMID:26927022

  15. Printed Electronics

    Science.gov (United States)

    Wade, Jessica; Hollis, Joseph Razzell; Wood, Sebastian

    2018-04-01

    The combination of printing technology with manufacturing electronic devices enables a new paradigm of printable electronics, where 'smart' functionality can be readily incorporated into almost any product at low cost. Over recent decades, rapid progress has been made in this field, which is now emerging into the industrial andcommercial realm. However, successful development and commercialisation on a large scale presents some significant technical challenges. For fully-printable electronic systems, all the component parts must be deposited from solutions (inks), requiring the development of new inorganic, organic and hybrid materials.A variety of traditional printing techniques are being explored and adapted forprinting these new materials in ways that result in the best performing electronicdevices. Whilst printed electronics research has initially focused on traditional typesof electronic device such as light-emitting diodes, transistors, and photovoltaics, it is increasingly apparent that a much wider range of applications can be realised. The soft and stretchable nature of printable materials makes them perfect candidates forbioelectronics, resulting in a wealth of research looking at biocompatible printable inks and biosensors. Regardless of application, the properties of printed electronicmaterials depend on the chemical structures, processing conditions, device architecture,and operational conditions, the complex inter-relationships of which aredriving ongoing research. We focus on three particular 'hot topics', where attention is currently focused: novel materials, characterisation techniques, and device stability. With progress advancing very rapidly, printed electronics is expected to grow over the next decade into a key technology with an enormous economic and social impact.

  16. Type I Collagen and Strontium-Containing Mesoporous Glass Particles as Hybrid Material for 3D Printing of Bone-Like Materials.

    Science.gov (United States)

    Montalbano, Giorgia; Fiorilli, Sonia; Caneschi, Andrea; Vitale-Brovarone, Chiara

    2018-04-28

    Bone tissue engineering offers an alternative promising solution to treat a large number of bone injuries with special focus on pathological conditions, such as osteoporosis. In this scenario, the bone tissue regeneration may be promoted using bioactive and biomimetic materials able to direct cell response, while the desired scaffold architecture can be tailored by means of 3D printing technologies. In this context, our study aimed to develop a hybrid bioactive material suitable for 3D printing of scaffolds mimicking the natural composition and structure of healthy bone. Type I collagen and strontium-containing mesoporous bioactive glasses were combined to obtain suspensions able to perform a sol-gel transition under physiological conditions. Field emission scanning electron microscopy (FESEM) analyses confirmed the formation of fibrous nanostructures homogeneously embedding inorganic particles, whereas bioactivity studies demonstrated the large calcium phosphate deposition. The high-water content promoted the strontium ion release from the embedded glass particles, potentially enhancing the osteogenic behaviour of the composite. Furthermore, the suspension printability was assessed by means of rheological studies and preliminary extrusion tests, showing shear thinning and fast material recovery upon deposition. In conclusion, the reported results suggest that promising hybrid systems suitable for 3D printing of bioactive scaffolds for bone tissue engineering have been developed.

  17. A bidirectional soft switched ultracapacitor interface circuit for hybrid electric vehicles

    Energy Technology Data Exchange (ETDEWEB)

    Farzanehfard, Hosein; Beyragh, Dawood Shekari; Adib, Ehsan [Electrical and Computer Engineering Department, Isfahan University of Technology, Isfahan 84156 (Iran)

    2008-12-15

    Ultracapacitors are used as auxiliary elements beside batteries to increase peak power capability and battery life in hybrid electric vehicles. In such a configuration, a bidirectional high efficiency converter is required as an interface between ultracapacitors and batteries. Since the voltage level of ultracapacitors and batteries are different, the interface must be able to increase or decrease the voltage level in each power flow direction while limiting the current. This paper presents a zero voltage transition (ZVT) buck-and-boost converter for ultracapacitors interface. All the switches in the proposed converter are soft switched to reduce switching losses and increase efficiency. The converter operational modes are analyzed and its performance is discussed. Finally, the experimental results from a 150 W laboratory prototype are presented which justify the theoretical analysis. (author)

  18. The circuit designer's companion

    CERN Document Server

    Williams, Tim

    1991-01-01

    The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

  19. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid

    International Nuclear Information System (INIS)

    Zhu, P.; Chen, Y.; Wang, L.Y.; Qian, G.Y.; Zhou, M.; Zhou, J.

    2012-01-01

    Highlights: ► WPCBs were heated in [EMIM + ][BF 4 − ] for recovering solider at 240 °C. ► The bromine epoxy resins in WPCBs were all dissolved in [EMIM + ][BF 4 − ] at 260 °C. ► Used [EMIM + ][BF 4 − ] is treated by water to obtain regeneration. - Abstract: Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM + ][BF 4 − ]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM + ][BF 4 − ] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM + ][BF 4 − ] was treated by water to generate a solid–liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM + ][BF 4 − ] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

  20. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

    Science.gov (United States)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-01

    Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. Copyright © 2015 Elsevier Ltd. All rights reserved.

  1. Hybrid Spintronic-CMOS Spiking Neural Network with On-Chip Learning: Devices, Circuits, and Systems

    Science.gov (United States)

    Sengupta, Abhronil; Banerjee, Aparajita; Roy, Kaushik

    2016-12-01

    Over the past decade, spiking neural networks (SNNs) have emerged as one of the popular architectures to emulate the brain. In SNNs, information is temporally encoded and communication between neurons is accomplished by means of spikes. In such networks, spike-timing-dependent plasticity mechanisms require the online programing of synapses based on the temporal information of spikes transmitted by spiking neurons. In this work, we propose a spintronic synapse with decoupled spike-transmission and programing-current paths. The spintronic synapse consists of a ferromagnet-heavy-metal heterostructure where the programing current through the heavy metal generates spin-orbit torque to modulate the device conductance. Low programing energy and fast programing times demonstrate the efficacy of the proposed device as a nanoelectronic synapse. We perform a simulation study based on an experimentally benchmarked device-simulation framework to demonstrate the interfacing of such spintronic synapses with CMOS neurons and learning circuits operating in the transistor subthreshold region to form a network of spiking neurons that can be utilized for pattern-recognition problems.

  2. One-step inkjet printing of tungsten oxide-poly(3,4-ethylenedioxythiophene):polystyrene sulphonate hybrid film and its applications in electrochromic devices

    Energy Technology Data Exchange (ETDEWEB)

    Nguyen, Thi-Thuy-Nga, E-mail: thuysnga@gmail.com; Chan, Chih-Yu; He, Ju-Liang

    2016-03-31

    Hybrid film comprised tungsten oxide and poly (3,4-ethylenedioxythiophene):polystyrene sulphonate (WO{sub 3}–PEDOT:PSS) was developed by applying one-step inkjet printing from an office inkjet printer. The WO{sub 3} nanoparticles were synthesized from commercial crystalline WO{sub 3} powder through a wet ball-milling process, which is a simple, environmentally friendly, and cost-effective method of using water as a green solvent and low-energy milling. The WO{sub 3}–PEDOT:PSS inkjet ink was prepared by dispersing the as-milled WO{sub 3} and PEDOT:PSS in n-propanol and deionized water. The inkjet-printed WO{sub 3}–PEDOT:PSS thin films show marked improvements of cathodic electrochromism over WO{sub 3} films: the transmittance change of 20% at 550 nm (visible region) and 35% at 900 nm (infrared region) along with the response time of 5.67/0.30 s in their colored/bleached state, and the electrochromic coloration efficiency of 27.86 cm{sup 2}/C at 550 nm and 69.64 cm{sup 2}/C at 900 nm. - Highlights: • WO{sub 3} nanoparticles were synthesized by milling commercial crystalline WO{sub 3}. • Wet ball-milling was carried out by using water as a green solvent and low energy. • WO{sub 3}–PEDOT:PSS hybrid ink was simply prepared by adding n-propanol and DI water. • WO{sub 3}–PEDOT:PSS hybrid films were inkjet-printed via an office inkjet printer. • WO{sub 3}–PEDOT:PSS films show better electrochromic performances than WO{sub 3} films.

  3. Printed Circuit Board Quality Assurance

    Science.gov (United States)

    Sood, Bhanu

    2016-01-01

    PCB Assurance Summary: PCB assurance actives are informed by risk in context of the Project. Lessons are being applied across Projects for continuous improvements. Newer component technologies, smaller/high pitch devices: tighter and more demanding PCB designs: Identifying new research areas. New materials, designs, structures and test methods.

  4. Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation.

    Science.gov (United States)

    Behnamfard, Ali; Salarirad, Mohammad Mehdi; Veglio, Francesco

    2013-11-01

    A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H2O2 as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H2O2 leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H2O2 leaching system were determined to be 5M HCl, 1V% H2O2, 10V% NaClO at 336K for 3h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed. Copyright © 2013 Elsevier Ltd. All rights reserved.

  5. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    International Nuclear Information System (INIS)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-01-01

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process

  6. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Qi, Yingying [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2015-07-15

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.

  7. Nonlinear dynamic response of a 'flexible-and-heavy' printed circuit board (PCB) to an impact load applied to its support contour

    International Nuclear Information System (INIS)

    Suhir, E; Vujosevic, M; Reinikainen, T

    2009-01-01

    Based on the developed simple and physically meaningful analytical ('mathematical') stress model, we evaluate some major parameters (amplitude, frequency, maximum acceleration, stresses and strains) of the response of a 'flexible-and-heavy' square simply supported printed circuit board (PCB) to an impact drop load applied to its support contour. The analysis is restricted to the first mode of vibrations and is carried out in application to the PCB design employed in an advanced accelerated test setup (test vehicle). This setup is aimed at the assessment of the performance, in accelerated test conditions on the board level, of packaging materials (and, first of all, BGA solder joint interconnections) subjected to dynamic (drop or shock) loading. It is anticipated that heavy masses could be mounted on the PCB to accelerate its dynamic response to an impact load. These masses are expected to be small in size, so that while changing the total mass of the board and generating significant inertia forces, they do not affect the board's flexural rigidity or its stiffness with respect to the in-plane loading. The PCB's contour is considered non-deformable, which is indeed the case in many practical situations. This circumstance, if the drop height and/or the induced inertia forces are significant, leads to elevated in-plane ('membrane') stresses in the PCB and, as a result of that, to the nonlinear response of the board to the impact load: the relationship between the magnitude of the load (determined by the initial impact velocity) and the induced PCB deflections becomes geometrically nonlinear, with a rigid cubic characteristic of the restoring force. The carried out numerical example, although reflects the characteristics of the PCB and loading conditions in an actual experimental setup, is merely an illustration of the general concept and is intended to demonstrate the abilities of the suggested method. Predictions based on this method agree well with the finite element

  8. Methods for fabrication of flexible hybrid electronics

    Science.gov (United States)

    Street, Robert A.; Mei, Ping; Krusor, Brent; Ready, Steve E.; Zhang, Yong; Schwartz, David E.; Pierre, Adrien; Doris, Sean E.; Russo, Beverly; Kor, Siv; Veres, Janos

    2017-08-01

    Printed and flexible hybrid electronics is an emerging technology with potential applications in smart labels, wearable electronics, soft robotics, and prosthetics. Printed solution-based materials are compatible with plastic film substrates that are flexible, soft, and stretchable, thus enabling conformal integration with non-planar objects. In addition, manufacturing by printing is scalable to large areas and is amenable to low-cost sheet-fed and roll-to-roll processes. FHE includes display and sensory components to interface with users and environments. On the system level, devices also require electronic circuits for power, memory, signal conditioning, and communications. Those electronic components can be integrated onto a flexible substrate by either assembly or printing. PARC has developed systems and processes for realizing both approaches. This talk presents fabrication methods with an emphasis on techniques recently developed for the assembly of off-the-shelf chips. A few examples of systems fabricated with this approach are also described.

  9. A laser printing based approach for printed electronics

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

    2016-03-07

    Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

  10. A laser printing based approach for printed electronics

    International Nuclear Information System (INIS)

    Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

    2016-01-01

    Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

  11. An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

    Energy Technology Data Exchange (ETDEWEB)

    Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

    2012-06-15

    A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

  12. UV-curable hybrid organic-inorganic composite inks with a high refractive index for printing interference images and holograms

    NARCIS (Netherlands)

    Eremeeva, Elena A.; Yakovlev, Aleksandr V.; Pidko, Evgeny A.; Vinogradov, Alexandr V.

    2017-01-01

    Herein we report a new, facile and inexpensive methodology for obtaining highly refractive polymers suitable for inkjet printing using hexacoordinated titanium complexes (THC) and a UV-curable lacquer based on triethylene glycol dimethacrylate (TGD) that is a cheap and non-toxic monomer that can be

  13. Hybrid finite difference/finite element solution method development for non-linear superconducting magnet and electrical circuit breakdown transient analysis

    International Nuclear Information System (INIS)

    Kraus, H.G.; Jones, J.L.

    1986-01-01

    The problem of non-linear superconducting magnet and electrical protection circuit system transients is formulated. To enable studying the effects of coil normalization transients, coil distortion (due to imbalanced magnetic forces), internal coil arcs and shorts, and other normal and off-normal circuit element responses, the following capabilities are included: temporal, voltage and current-dependent voltage sources, current sources, resistors, capacitors and inductors. The concept of self-mutual inductance, and the form of the associated inductance matrix, is discussed for internally shorted coils. This is a Kirchhoff's voltage loop law and Kirchhoff's current node law formulation. The non-linear integrodifferential equation set is solved via a unique hybrid finite difference/integral finite element technique. (author)

  14. Evaluation of 320x240 pixel LEC GaAs Schottky barrier X-ray imaging arrays, hybridized to CMOS readout circuit based on charge integration

    CERN Document Server

    Irsigler, R; Alverbro, J; Borglind, J; Froejdh, C; Helander, P; Manolopoulos, S; O'Shea, V; Smith, K

    1999-01-01

    320x240 pixels GaAs Schottky barrier detector arrays were fabricated, hybridized to silicon readout circuits, and subsequently evaluated. The detector chip was based on semi-insulating LEC GaAs material. The square shaped pixel detector elements were of the Schottky barrier type and had a pitch of 38 mu m. The GaAs wafers were thinned down prior to the fabrication of the ohmic back contact. After dicing, the chips were indium bump, flip-chip bonded to CMOS readout circuits based on charge integration, and finally evaluated. A bias voltage between 50 and 100 V was sufficient to operate the detector. Results on I-V characteristics, noise behaviour and response to X-ray radiation are presented. Images of various objects and slit patterns were acquired by using a standard dental imaging X-ray source. The work done was a part of the XIMAGE project financed by the European Community (Brite-Euram). (author)

  15. Wireless Data Transmission at Terahertz Carrier Waves Generated from a Hybrid InP-Polymer Dual Tunable DBR Laser Photonic Integrated Circuit.

    Science.gov (United States)

    Carpintero, Guillermo; Hisatake, Shintaro; de Felipe, David; Guzman, Robinson; Nagatsuma, Tadao; Keil, Norbert

    2018-02-14

    We report for the first time the successful wavelength stabilization of two hybrid integrated InP/Polymer DBR lasers through optical injection. The two InP/Polymer DBR lasers are integrated into a photonic integrated circuit, providing an ideal source for millimeter and Terahertz wave generation by optical heterodyne technique. These lasers offer the widest tuning range of the carrier wave demonstrated to date up into the Terahertz range, about 20 nm (2.5 THz) on a single photonic integrated circuit. We demonstrate the application of this source to generate a carrier wave at 330 GHz to establish a wireless data transmission link at a data rate up to 18 Gbit/s. Using a coherent detection scheme we increase the sensitivity by more than 10 dB over direct detection.

  16. Sustainability issues in circuit board recycling

    DEFF Research Database (Denmark)

    Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

    1995-01-01

    The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...

  17. Hybrid solar cells with outstanding short-circuit currents based on a room temperature soft-chemical strategy: the case of P3HT:Ag2S.

    Science.gov (United States)

    Lei, Yan; Jia, Huimin; He, Weiwei; Zhang, Yange; Mi, Liwei; Hou, Hongwei; Zhu, Guangshan; Zheng, Zhi

    2012-10-24

    P3HT:Ag(2)S hybrid solar cells with broad absorption from the UV to NIR band were directly fabricated on ITO glass by using a room temperature, low energy consumption, and low-cost soft-chemical strategy. The resulting Ag(2)S nanosheet arrays facilitate the construction of a perfect percolation structure with organic P3HT to form ordered bulk heterojunctions (BHJ); without interface modification, the assembled P3HT:Ag(2)S device exhibits outstanding short-circuit current densities (J(sc)) around 20 mA cm(-2). At the current stage, the optimized device exhibited a power conversion efficiency of 2.04%.

  18. Hybrid Heritage: An Investigation into the Viability of 3D-Printed Mashrabiya Window Screens for Bahraini Dwellings

    OpenAIRE

    Almerbati, Nehal

    2016-01-01

    Current debates on design and manufacturing support the claim that the ‘Third Industrial Revolution’ has already started due to Additive Manufacturing (AM) and 3D Printing. The process of solidifying liquid or powder using a binding agent or a melting laser can save time and transportation costs associated with importing primary material if locally sourced material is available. This research investigates a framework approach, titled SAFE, for discussing the functionality, economic viability,...

  19. Multi-format all-optical processing based on a large-scale, hybridly integrated photonic circuit.

    Science.gov (United States)

    Bougioukos, M; Kouloumentas, Ch; Spyropoulou, M; Giannoulis, G; Kalavrouziotis, D; Maziotis, A; Bakopoulos, P; Harmon, R; Rogers, D; Harrison, J; Poustie, A; Maxwell, G; Avramopoulos, H

    2011-06-06

    We investigate through numerical studies and experiments the performance of a large scale, silica-on-silicon photonic integrated circuit for multi-format regeneration and wavelength-conversion. The circuit encompasses a monolithically integrated array of four SOAs inside two parallel Mach-Zehnder structures, four delay interferometers and a large number of silica waveguides and couplers. Exploiting phase-incoherent techniques, the circuit is capable of processing OOK signals at variable bit rates, DPSK signals at 22 or 44 Gb/s and DQPSK signals at 44 Gbaud. Simulation studies reveal the wavelength-conversion potential of the circuit with enhanced regenerative capabilities for OOK and DPSK modulation formats and acceptable quality degradation for DQPSK format. Regeneration of 22 Gb/s OOK signals with amplified spontaneous emission (ASE) noise and DPSK data signals degraded with amplitude, phase and ASE noise is experimentally validated demonstrating a power penalty improvement up to 1.5 dB.

  20. A hybrid pulse combining topology utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer.

    Science.gov (United States)

    Li, Jiangtao; Zhao, Zheng; Sun, Yi; Liu, Yuhao; Ren, Ziyuan; He, Jiaxin; Cao, Hui; Zheng, Minjun

    2017-03-01

    Numerous applications driven by pulsed voltage require pulses to be with high amplitude, high repetitive frequency, and narrow width, which could be satisfied by utilizing avalanche transistors. The output improvement is severely limited by power capacities of transistors. Pulse combining is an effective approach to increase the output amplitude while still adopting conventional pulse generating modules. However, there are drawbacks in traditional topologies including the saturation tendency of combining efficiency and waveform oscillation. In this paper, a hybrid pulse combining topology was adopted utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer. The factors affecting the combining efficiency were determined including the output time synchronization of Marx circuits, and the quantity and position of magnetic cores. The numbers of the parallel modules and the stages were determined by the output characteristics of each combining method. Experimental results illustrated the ability of generating pulses with 2-14 kV amplitude, 7-11 ns width, and a maximum 10 kHz repetitive rate on a matched 50-300 Ω resistive load. The hybrid topology would be a convinced pulse combining method for similar nanosecond pulse generators based on the solid-state switches.

  1. Fully Printed Flexible and Stretchable Electronics

    Science.gov (United States)

    Zhang, Suoming

    Through this thesis proposal, the author has demonstrated series of flexible or stretchable sensors including strain gauge, pressure sensors, display arrays, thin film transistors and photodetectors fabricated by a direct printing process. By adopting the novel serpentine configuration with conventional non-stretchable materials silver nanoparticles, the fully printed stretchable devices are successfully fabricated on elastomeric substrate with the demonstration of stretchable conductors that can maintain the electrical properties under strain and the strain gauge, which could be used to measure the strain in desired locations and also to monitor individual person's finger motion. And by investigating the intrinsic stretchable materials silver nanowires (AgNWs) with the conventional configuration, the fully printed stretchable conductors are achieved on various substrates including Si, glass, Polyimide, Polydimethylsiloxane (PDMS) and Very High Bond (VHB) tape with the illustration of the capacitive pressure sensor and stretchable electroluminescent displays. In addition, intrinsically stretchable thin-film transistors (TFTs) and integrated logic circuits are directly printed on elastomeric PDMS substrates. The printed devices utilize carbon nanotubes and a type of hybrid gate dielectric comprising PDMS and barium titanate (BaTiO3) nanoparticles. The BaTiO3/PDMS composite simultaneously provides high dielectric constant, superior stretchability, low leakage, as well as good printability and compatibility with the elastomeric substrate. Both TFTs and logic circuits can be stretched beyond 50% strain along either channel length or channel width directions for thousands of cycles while showing no significant degradation in electrical performance. Finally, by applying the SWNTs as the channel layer of the thin film transistor, we successfully fabricate the fully printed flexible photodetector which exhibits good electrical characteristics and the transistors exhibit

  2. Double printing of hyaluronic acid/poly(glycidol) hybrid hydrogels with poly(ϵ-caprolactone) for MSC chondrogenesis

    NARCIS (Netherlands)

    Stichler, Simone; Böck, Thomas; Paxton, Naomi; Bertlein, Sarah; Levato, Riccardo; Schill, Verena; Smolan, Willi; Malda, Jos; Teßmar, Jörg; Blunk, Torsten; Groll, Jürgen

    2017-01-01

    This study investigates the use of allyl-functionalized poly(glycidol)s (P(AGE-co-G)) as a cytocompatible cross-linker for thiol-functionalized hyaluronic acid (HA-SH) and the optimization of this hybrid hydrogel as bioink for 3D bioprinting. The chemical cross-linking of gels with 10 wt.% overall

  3. Processes and procedures for a thin film multilevel hybrid circuit metallization system based on W--Au/SiO2/Al/SiO2

    International Nuclear Information System (INIS)

    Hampy, R.E.; Knauss, G.L.; Komarek, E.E.; Kramer, D.K.; Villanueva, J.

    1976-04-01

    The processes and procedures developed for the deposition and photodefinition of a W-Au/SiO 2 /Al/SiO 2 hybrid circuit metallization system for the SLL Micro Actuator are described. The metallization system affords a high degree of miniaturization and permits effective interconnection of a mixture of semiconductor devices and passive components with both gold and aluminum terminations without creating undesirable gold-aluminum interfaces. Sputtered tungsten-gold is the first level conductor except at crossovers where tungsten only is used and aluminum is the second level conductor. Silicon dioxide serves as an insulator between the tungsten and aluminum for crossovers. Vias in the insulating layer permit tungsten-aluminum interconnections where desired. A second layer of silicon dioxide is deposited over the metallization and opened for all gold and aluminum bonding pads. Substrates used were polished sapphire and fine grained alumina. The metallization is capable of withstanding processing temperatures up to 400 0 C for short times

  4. 3D-printed, sugar cube-size microplasma on a hybrid chip used as a spectral lamp to characterize UV-Vis transmission characteristics of polycarbonate chips for microfluidic applications

    Science.gov (United States)

    Devathasan, D.; Trebych, K.; Karanassios, Vassili

    2013-05-01

    A 3d-printed, solar-powered, battery-operated, atmospheric-pressure, self-igniting microplasma the size of a sugar-cube has been used as light source to document the Ultra Violet (UV) and visible transmission characteristics of differentthickness polycarbonate chips that are often used for microfluidic applications. The hybrid microplasma chip was fitted with a quartz plate because quartz is transparent to UV.

  5. Air cooling of refrigerating loops: 'dry-hybrid' systems; Refroidissement par air des circuits frigorifiques: les systemes ''secs hybrides''

    Energy Technology Data Exchange (ETDEWEB)

    Becker, W. [Societe Jaggi-Gunter (Switzerland)

    2003-02-01

    Different type of cooling systems can be implemented on coldness production plants. The choice very often depends on the initial investment, but from a technical and economical point of view, this choice is not necessary the best solution. Thus, it can be useful to know the different existing systems and their exploitation costs with respect to the expected needs. A particular solution which uses a 'dry-hybrid' cooler is presented in this study: 1 - open-loop evaporative cooler; 2 - open-loop evaporative cooler with intermediate exchanger; 3 - close-loop evaporative cooler; 4 - dry-cooler; 5 - dry cooler with spraying in the air flow way; 6 - dry cooler with counterflow spraying; 7 - hybrid dry cooler; 8 - example of a realization in Germany: technical and economical value of the project, description of compared solutions and hypotheses, interpretation of results. (J.S.)

  6. Improvement of Dimensional Accuracy of 3-D Printed Parts using an Additive/Subtractive Based Hybrid Prototyping Approach

    Science.gov (United States)

    Amanullah Tomal, A. N. M.; Saleh, Tanveer; Raisuddin Khan, Md.

    2017-11-01

    At present, two important processes, namely CNC machining and rapid prototyping (RP) are being used to create prototypes and functional products. Combining both additive and subtractive processes into a single platform would be advantageous. However, there are two important aspects need to be taken into consideration for this process hybridization. First is the integration of two different control systems for two processes and secondly maximizing workpiece alignment accuracy during the changeover step. Recently we have developed a new hybrid system which incorporates Fused Deposition Modelling (FDM) as RP Process and CNC grinding operation as subtractive manufacturing process into a single setup. Several objects were produced with different layer thickness for example 0.1 mm, 0.15 mm and 0.2 mm. It was observed that pure FDM method is unable to attain desired dimensional accuracy and can be improved by a considerable margin about 66% to 80%, if finishing operation by grinding is carried out. It was also observed layer thickness plays a role on the dimensional accuracy and best accuracy is achieved with the minimum layer thickness (0.1 mm).

  7. A hybrid magnetic/complementary metal oxide semiconductor three-context memory bit cell for non-volatile circuit design

    International Nuclear Information System (INIS)

    Jovanović, B.; Brum, R. M.; Torres, L.

    2014-01-01

    After decades of continued scaling to the beat of Moore's law, it now appears that conventional silicon based devices are approaching their physical limits. In today's deep-submicron nodes, a number of short-channel and quantum effects are emerging that affect the manufacturing process, as well as, the functionality of the microelectronic systems-on-chip. Spintronics devices that exploit both the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, are promising solutions to circumvent these scaling threats. Being compatible with the CMOS technology, such devices offer a promising synergy of radiation immunity, infinite endurance, non-volatility, increased density, etc. In this paper, we present a hybrid (magnetic/CMOS) cell that is able to store and process data both electrically and magnetically. The cell is based on perpendicular spin-transfer torque magnetic tunnel junctions (STT-MTJs) and is suitable for use in magnetic random access memories and reprogrammable computing (non-volatile registers, processor cache memories, magnetic field-programmable gate arrays, etc). To demonstrate the potential our hybrid cell, we physically implemented a small hybrid memory block using 45 nm × 45 nm round MTJs for the magnetic part and 28 nm fully depleted silicon on insulator (FD-SOI) technology for the CMOS part. We also report the cells measured performances in terms of area, robustness, read/write speed and energy consumption

  8. A hybrid magnetic/complementary metal oxide semiconductor three-context memory bit cell for non-volatile circuit design

    Energy Technology Data Exchange (ETDEWEB)

    Jovanović, B., E-mail: bojan.jovanovic@lirmm.fr, E-mail: lionel.torres@lirmm.fr; Brum, R. M.; Torres, L. [LIRMM—University of Montpellier 2/UMR CNRS 5506, 161 Rue Ada, 34095 Montpellier (France)

    2014-04-07

    After decades of continued scaling to the beat of Moore's law, it now appears that conventional silicon based devices are approaching their physical limits. In today's deep-submicron nodes, a number of short-channel and quantum effects are emerging that affect the manufacturing process, as well as, the functionality of the microelectronic systems-on-chip. Spintronics devices that exploit both the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, are promising solutions to circumvent these scaling threats. Being compatible with the CMOS technology, such devices offer a promising synergy of radiation immunity, infinite endurance, non-volatility, increased density, etc. In this paper, we present a hybrid (magnetic/CMOS) cell that is able to store and process data both electrically and magnetically. The cell is based on perpendicular spin-transfer torque magnetic tunnel junctions (STT-MTJs) and is suitable for use in magnetic random access memories and reprogrammable computing (non-volatile registers, processor cache memories, magnetic field-programmable gate arrays, etc). To demonstrate the potential our hybrid cell, we physically implemented a small hybrid memory block using 45 nm × 45 nm round MTJs for the magnetic part and 28 nm fully depleted silicon on insulator (FD-SOI) technology for the CMOS part. We also report the cells measured performances in terms of area, robustness, read/write speed and energy consumption.

  9. High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits

    Directory of Open Access Journals (Sweden)

    Xianshu eLuo

    2015-04-01

    Full Text Available Integrated optical light source on silicon is one of the key building blocks for optical interconnect technology. Great research efforts have been devoting worldwide to explore various approaches to integrate optical light source onto the silicon substrate. The achievements so far include the successful demonstration of III/V-on-Si hybrid lasers through III/V-gain material to silicon wafer bonding technology. However, for potential large-scale integration, leveraging on mature silicon complementary metal oxide semiconductor (CMOS fabrication technology and infrastructure, more effective bonding scheme with high bonding yield is in great demand considering manufacturing needs. In this paper, we propose and demonstrate a high-throughput multiple dies-to-wafer (D2W bonding technology which is then applied for the demonstration of hybrid silicon lasers. By temporarily bonding III/V dies to a handle silicon wafer for simultaneous batch processing, it is expected to bond unlimited III/V dies to silicon device wafer with high yield. As proof-of-concept, more than 100 III/V dies bonding to 200 mm silicon wafer is demonstrated. The high performance of the bonding interface is examined with various characterization techniques. Repeatable demonstrations of 16-III/V-die bonding to pre-patterned 200 mm silicon wafers have been performed for various hybrid silicon lasers, in which device library including Fabry-Perot (FP laser, lateral-coupled distributed feedback (LC-DFB laser with side wall grating, and mode-locked laser (MLL. From these results, the presented multiple D2W bonding technology can be a key enabler towards the large-scale heterogeneous integration of optoelectronic integrated circuits (H-OEIC.

  10. Photoluminescence and Photoconductivity to Assess Maximum Open-Circuit Voltage and Carrier Transport in Hybrid Perovskites and Other Photovoltaic Materials.

    Science.gov (United States)

    Braly, Ian L; Stoddard, Ryan J; Rajagopal, Adharsh; Jen, Alex K-Y; Hillhouse, Hugh W

    2018-06-06

    Photovoltaic (PV) device development is much more expensive and time consuming than the development of the absorber layer alone. This perspective focuses on two methods that can be used to rapidly assess and develop PV absorber materials independent of device development. The absorber material properties of quasi-Fermi level splitting and carrier diffusion length under steady effective one-Sun illumination are indicators of a material's ability to achieve high VOC and JSC. These two material properties can be rapidly and simultaneously assessed with steady-state absolute intensity photoluminescence and photoconductivity measurements. As a result, these methods are extremely useful for predicting the quality and stability of PV materials prior to PV device development. Here, we summarize the methods, discuss their strengths and weaknesses, and compare photoluminescence and photoconductivity results with device performance for four hybrid perovskite compositions of various bandgaps (1.35 to 1.82 eV), CISe, CIGSe, and CZTSe.

  11. A Spaceborne Synthetic Aperture Radar Partial Fixed-Point Imaging System Using a Field- Programmable Gate Array-Application-Specific Integrated Circuit Hybrid Heterogeneous Parallel Acceleration Technique.

    Science.gov (United States)

    Yang, Chen; Li, Bingyi; Chen, Liang; Wei, Chunpeng; Xie, Yizhuang; Chen, He; Yu, Wenyue

    2017-06-24

    With the development of satellite load technology and very large scale integrated (VLSI) circuit technology, onboard real-time synthetic aperture radar (SAR) imaging systems have become a solution for allowing rapid response to disasters. A key goal of the onboard SAR imaging system design is to achieve high real-time processing performance with severe size, weight, and power consumption constraints. In this paper, we analyse the computational burden of the commonly used chirp scaling (CS) SAR imaging algorithm. To reduce the system hardware cost, we propose a partial fixed-point processing scheme. The fast Fourier transform (FFT), which is the most computation-sensitive operation in the CS algorithm, is processed with fixed-point, while other operations are processed with single precision floating-point. With the proposed fixed-point processing error propagation model, the fixed-point processing word length is determined. The fidelity and accuracy relative to conventional ground-based software processors is verified by evaluating both the point target imaging quality and the actual scene imaging quality. As a proof of concept, a field- programmable gate array-application-specific integrated circuit (FPGA-ASIC) hybrid heterogeneous parallel accelerating architecture is designed and realized. The customized fixed-point FFT is implemented using the 130 nm complementary metal oxide semiconductor (CMOS) technology as a co-processor of the Xilinx xc6vlx760t FPGA. A single processing board requires 12 s and consumes 21 W to focus a 50-km swath width, 5-m resolution stripmap SAR raw data with a granularity of 16,384 × 16,384.

  12. A Spaceborne Synthetic Aperture Radar Partial Fixed-Point Imaging System Using a Field- Programmable Gate Array−Application-Specific Integrated Circuit Hybrid Heterogeneous Parallel Acceleration Technique

    Directory of Open Access Journals (Sweden)

    Chen Yang

    2017-06-01

    Full Text Available With the development of satellite load technology and very large scale integrated (VLSI circuit technology, onboard real-time synthetic aperture radar (SAR imaging systems have become a solution for allowing rapid response to disasters. A key goal of the onboard SAR imaging system design is to achieve high real-time processing performance with severe size, weight, and power consumption constraints. In this paper, we analyse the computational burden of the commonly used chirp scaling (CS SAR imaging algorithm. To reduce the system hardware cost, we propose a partial fixed-point processing scheme. The fast Fourier transform (FFT, which is the most computation-sensitive operation in the CS algorithm, is processed with fixed-point, while other operations are processed with single precision floating-point. With the proposed fixed-point processing error propagation model, the fixed-point processing word length is determined. The fidelity and accuracy relative to conventional ground-based software processors is verified by evaluating both the point target imaging quality and the actual scene imaging quality. As a proof of concept, a field- programmable gate array−application-specific integrated circuit (FPGA-ASIC hybrid heterogeneous parallel accelerating architecture is designed and realized. The customized fixed-point FFT is implemented using the 130 nm complementary metal oxide semiconductor (CMOS technology as a co-processor of the Xilinx xc6vlx760t FPGA. A single processing board requires 12 s and consumes 21 W to focus a 50-km swath width, 5-m resolution stripmap SAR raw data with a granularity of 16,384 × 16,384.

  13. E-waste: development of recycling process and chemical characterization of circuit printed - motherboard; Lixo eletronico: desenvolvimento de processo de reciclagem e caracterizacao quimica de placa de circuito impresso - motherboard

    Energy Technology Data Exchange (ETDEWEB)

    Junior, O.L.F.; Vargas, R.A.; Andreoli, M.; Martinelli, J.R.; Seo, E.S.M., E-mail: olfjunior@usp.br [Instituto de Pesquisas Energeticas e Nucleares (IPEN-CNEN/SP), Sao Paulo, SP (Brazil)

    2011-07-01

    The electro-electronic industry has been regulated by the National Politic of Solid Residues Act (PNRS) and Bill no. 7.404, concerning the actions, procedures, and method to collect, recycle and promotion of environmentally acceptable final destination of residues. The present work contributes to develop recycling process of printed circuit used in microcomputers and in its chemical characterization. The experimental procedure consisted of grinding, classification, magnetic and electrostatic separation, and separation based on density difference, followed by chemical characterization of the metallic and non metallic materials in the motherboard. It was determined that the amounts of Ag, Al, Ba, Cl, Cr, Cu, Fe, Mn, Pb, and Zn in the residue are above the toxicity allowable levels, and they are in the samples of the decanted material. Among the samples of the floating material, Al, Ba, Br, Ca, Cu, Fe, Pb (in less quantity), Si (in more quantity), and Sn, Ti and Zn were detected. Those materials can be useful in the preparation of red ceramics. (author)

  14. An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

    CERN Document Server

    Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

    2004-01-01

    The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

  15. Application to printed resistors

    International Nuclear Information System (INIS)

    Hachiyanagi, Yoshimi; Uraki, Hisatsugu; Sawamura, Masashi

    1989-01-01

    Most of printed circuit boards are made at present by etching copper foils which are laminated on insulating composite boards of paper/phenol resin or glass nonwoven fabric/epoxy rein. This is called subtractive process, and since this is a wet process, the problem of coping with the pollution due to etching solution, plating solution and others is involved. As the method of solving this problem, attention has been paid to the dry process which forms conductor patterns by screen printing using electro-conductive paste. For such resin substrates, generally polymer thick films (PTF) using thermosetting resin as the binder are used. Also the research on the formation of resistors, condensers and other parts by printing using the technology of cermet thick films (CTF) and PTF is active, and it is partially put in practical use. The problems are the deformation and deterioration of substrates, therefore, as the countermeasures, electron beam hardening type PTF has been studied, and various pastes have been developed. In this paper, electron beam hardening type printed resistors are reported. The features, resistance paste, and a number of the experiments on printed resistors are described. (K.I.)

  16. Uniformity of fully gravure printed organic field-effect transistors

    International Nuclear Information System (INIS)

    Hambsch, M.; Reuter, K.; Stanel, M.; Schmidt, G.; Kempa, H.; Fuegmann, U.; Hahn, U.; Huebler, A.C.

    2010-01-01

    Fully mass-printed organic field-effect transistors were made completely by means of gravure printing. Therefore a special printing layout was developed in order to avoid register problems in print direction. Upon using this layout, contact pads for source-drain electrodes of the transistors are printed together with the gate electrodes in one and the same printing run. More than 50,000 transistors have been produced and by random tests a yield of approximately 75% has been determined. The principle suitability of the gravure printed transistors for integrated circuits has been shown by the realization of ring oscillators.

  17. Electrical Qualification of the Pre-production of Analogue Opto-Hybrid Circuits for the CMS Tracker Inner Barrel and Inner Disks.

    CERN Document Server

    Brunetti, Maria Teresa; Postolache, Vasile; Ricci, Daniel

    2003-01-01

    A pre-production of 50 analogue opto-hybrid (AOH) circuits to be used in the front-end electronics of the CMS tracker was extensively tested before the incoming start of the massive production. A total of 4000 AOHs are required for the tracker inner barrel (TIB) and inner disk (TID) construction. The electrical response of the TIB/TID AOH pre-production was tested at 25°C both for the static and dynamic behavior. A subset of five AOHs was cooled and tested at -10°C and -15°C. A passive thermal cycle test from -20°C to 25°C was done on a sample of 22 pre-production AOHs, including the previous subset, to measure the mechanical response at possible variations of the nominal tracker temperature of -10°C. Four AOHs from the subset were also kept at -15°C for 20 hours in order to check the long-term stability of the response. The measurements were obtained with the automatic test equip ment (ATE) built for the fast qualification during the massive AOH production and with a custom setup dedicat...

  18. Advanced circuit simulation using Multisim workbench

    CERN Document Server

    Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

    2012-01-01

    Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

  19. Oscillator circuits

    CERN Document Server

    Graf, Rudolf F

    1996-01-01

    This series of circuits provides designers with a quick source for oscillator circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listing

  20. Measuring circuits

    CERN Document Server

    Graf, Rudolf F

    1996-01-01

    This series of circuits provides designers with a quick source for measuring circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listings

  1. Internet printing

    Science.gov (United States)

    Rahgozar, M. Armon; Hastings, Tom; McCue, Daniel L.

    1997-04-01

    The Internet is rapidly changing the traditional means of creation, distribution and retrieval of information. Today, information publishers leverage the capabilities provided by Internet technologies to rapidly communicate information to a much wider audience in unique customized ways. As a result, the volume of published content has been astronomically increasing. This, in addition to the ease of distribution afforded by the Internet has resulted in more and more documents being printed. This paper introduces several axes along which Internet printing may be examined and addresses some of the technological challenges that lay ahead. Some of these axes include: (1) submission--the use of the Internet protocols for selecting printers and submitting documents for print, (2) administration--the management and monitoring of printing engines and other print resources via Web pages, and (3) formats--printing document formats whose spectrum now includes HTML documents with simple text, layout-enhanced documents with Style Sheets, documents that contain audio, graphics and other active objects as well as the existing desktop and PDL formats. The format axis of the Internet Printing becomes even more exciting when one considers that the Web documents are inherently compound and the traversal into the various pieces may uncover various formats. The paper also examines some imaging specific issues that are paramount to Internet Printing. These include formats and structures for representing raster documents and images, compression, fonts rendering and color spaces.

  2. Printed Electronics

    Science.gov (United States)

    Korkut, Sibel (Inventor); Chiang, Katherine S. (Inventor); Crain, John M. (Inventor); Aksay, Ilhan A. (Inventor); Lettow, John S. (Inventor); Chen, Chuan-Hua (Inventor); Prud'Homme, Robert K. (Inventor)

    2018-01-01

    Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

  3. Digital printing

    Science.gov (United States)

    Sobotka, Werner K.

    1997-02-01

    Digital printing is described as a tool to replace conventional printing machines completely. Still this goal was not reached until now with any of the digital printing technologies to be described in the paper. Productivity and costs are still the main parameters and are not really solved until now. Quality in digital printing is no problem anymore. Definition of digital printing is to transfer digital datas directly on the paper surface. This step can be carried out directly or with the use of an intermediate image carrier. Keywords in digital printing are: computer- to-press; erasable image carrier; image carrier with memory. Digital printing is also the logical development of the new digital area as it is pointed out in Nicholas Negropotes book 'Being Digital' and also the answer to networking and Internet technologies. Creating images text and color in one country and publishing the datas in another country or continent is the main advantage. Printing on demand another big advantage and last but not least personalization the last big advantage. Costs and being able to coop with this new world of prepress technology is the biggest disadvantage. Therefore the very optimistic growth rates for the next few years are really nonexistent. The development of complete new markets is too slow and the replacing of old markets is too small.

  4. A 24 GHz CMOS oscillator transmitter with an inkjet printed on-chip antenna

    KAUST Repository

    Ghaffar, Farhan A.

    2016-08-15

    CMOS based RF circuits have demonstrated efficient performance over the decades. However, one bottle neck with this technology is its lossy nature for passive components such as inductors, antennas etc. Due to this drawback, passives are either implemented off chip or the designers work with the inefficient passives. This problem can be alleviated by using inkjet printing as a post process on CMOS chip. In this work, we demonstrate inkjet printing of a patterned polymer (SU8) layer on a 24 GHz oscillator chip to isolate the lossy Si substrate from the passives which are inkjet printed on top of the SU8 layer. As a proof of concept, a monopole antenna is printed on top of the SU8 layer integrating it with the oscillator through the exposed RF pads to realize an oscillator transmitter. The proposed hybrid fabrication technique can be extended to multiple dielectric and conductive printed layers to demonstrate complete RF systems on CMOS chips which are efficient, cost-effective and above all small in size. © 2016 IEEE.

  5. Integrated cooling concepts for printed circuit boards

    NARCIS (Netherlands)

    Wits, Wessel Willems

    2008-01-01

    Thermal management plays an increasingly dominant role in the design process of electronic products. Component sizes decrease while performance and functional demands increase, resulting in more power dissipation on smaller surfaces. In an effort to cope with these growing thermal challenges,

  6. Chemical Characterisation of Printed Circuit Board Wastewater

    Energy Technology Data Exchange (ETDEWEB)

    Sobri, S; Ali, A H M, E-mail: eeza@eng.upm.edu.my [Department of Chemical and Environmental Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 Serdang, Selangor (Malaysia)

    2011-02-15

    Manufacturing of PCBs is highly complicated and involves many processes. Recycling of PCB wastewater receives wide concerns as the recent international growth in the electronics industry has generated a drastic increase in the amount of waste PCBs with profound environmental impacts such as soil and groundwater contamination. This paper reports on the chemical characterization of PCB wastewater as the initial investigation for selective metal recovery.

  7. Printed circuit board designer's reference basics

    CERN Document Server

    Robertson, Chris

    2003-01-01

    PCB design instruction and reference manual, all in one book, with in- depth explanation of the processes and tools used in modern PCB design Standards, formulas, definitions, and procedures, plus software to tie it all together.

  8. AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS

    Science.gov (United States)

    The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning tec...

  9. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  10. Creating and Using Interactive, 3D-Printed Models to Improve Student Comprehension of the Bohr Model of the Atom, Bond Polarity, and Hybridization

    Science.gov (United States)

    Smiar, Karen; Mendez, J. D.

    2016-01-01

    Molecular model kits have been used in chemistry classrooms for decades but have seen very little recent innovation. Using 3D printing, three sets of physical models were created for a first semester, introductory chemistry course. Students manipulated these interactive models during class activities as a supplement to existing teaching tools for…

  11. 3D Printing of Ball Grid Arrays

    Science.gov (United States)

    Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

    Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

  12. Hybdrid integral circuit for proportional chambers

    International Nuclear Information System (INIS)

    Yanik, R.; Khudy, M.; Povinets, P.; Strmen', P.; Grabachek, Z.; Feshchenko, A.A.

    1978-01-01

    Outlined briefly are a hybrid integrated circuit of the channel. One channel contains an input amplifier, delay circuit, and memory register on the base of the D-type flip-flop and controlled by the recording gate pulse. Provided at the output of the channel is a readout gating circuit. Presented are the flowsheet of the channel, the shaper amplifier and logical channel. At present the logical circuit was accepted for manufacture

  13. Hybrid microcircuits for nuclear instrumentation

    International Nuclear Information System (INIS)

    Kulkarni, R.G.

    2005-01-01

    Hybrid microcircuits (HMCs) have distinct advantages over their rival products like printed circuit boards (PCBs) and integrated circuits (ICs), and are able to survive the onslaught of Moore's law, by retaining the niche market for themselves. The ASIC development cost is normally huge and when the volumes are small (less than ten thousand or so), the prohibitively high unit cost deters the potential customers. However the HMCs can be developed at a small fraction of an ASIC development cost and thus they are attractive when the volumes are small, as in the case of professional electronics industries like defense, broadcast, or instrumentation industries. The hybrid microcircuit (HMC) technology can involve one of the two processes: thick-film and thin- film. Broadly the thick-film process consists of printing and firing of, conductor and resistor pastes, on an Alumina substrate. The thin-film process consists of photo lithographic etching of, conductor and resistor patterns, on a metal/resistor sputtered high purity Alumina substrate. The active devices, either in die-form or in surface-mount form, are attached to the thick-film or the thin-film substrate. The passive devices like chip inductors and chip capacitors are also attached to the substrate. This paper discusses in detail the thick-film and the thin-film processes and their relative merits and demerits. The associated qualification and screening procedures followed to provide reliable HMCs to the customer are described. The existing HMC facilities and the product range available in Bharat Electronics including the HMCs developed for nuclear instrumentation are presented. (author)

  14. 3-D printed 2.4 GHz rectifying antenna for wireless power transfer applications

    Science.gov (United States)

    Skinner, Matthew

    In this work, a 3D printed rectifying antenna that operates at the 2.4GHz WiFi band was designed and manufactured. The printed material did not have the same properties of bulk material, so the printed materials needed to be characterized. The antenna and rectifying circuit was printed out of Acrylonitrile Butadiene Styrene (ABS) filament and a conductive silver paste, with electrical components integrated into the circuit. Before printing the full rectifying antenna, each component was printed and evaluated. The printed antenna operated at the desired frequency with a return loss of -16 dBm with a bandwidth of 70MHz. The radiation pattern was measured in an anechoic chamber with good matching to the model. The rectifying circuit was designed in Ansys Circuit Simulation using Schottky diodes to enable the circuit to operate at lower input power levels. Two rectifying circuits were manufactured, one by printing the conductive traces with silver ink, and one with traces made from copper. The printed silver ink is less conductive than the bulk copper and therefore the output voltage of the printed rectifier was lower than the copper circuit. The copper circuit had an efficiency of 60% at 0dBm and the printed silver circuit had an efficiency of 28.6% at 0dBm. The antenna and rectifying circuits were then connected to each other and the performance was compared to a fully printed integrated rectifying antenna. The rectifying antennas were placed in front of a horn antenna while changing the power levels at the antenna. The efficiency of the whole system was lower than the individual components but an efficiency of 11% at 10dBm was measured.

  15. A wearable tracking device inkjet-printed on textile

    KAUST Repository

    Krykpayev, Bauyrzhan; Farooqui, Muhammad Fahad; Bilal, Rana Muhammad; Vaseem, Mohammad; Shamim, Atif

    2017-01-01

    Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based

  16. 3D printed magnetic polymer composite transformers

    Science.gov (United States)

    Bollig, Lindsey M.; Hilpisch, Peter J.; Mowry, Greg S.; Nelson-Cheeseman, Brittany B.

    2017-11-01

    The possibility of 3D printing a transformer core using fused deposition modeling methods is explored. With the use of additive manufacturing, ideal transformer core geometries can be achieved in order to produce a more efficient transformer. In this work, different 3D printed settings and toroidal geometries are tested using a custom integrated magnetic circuit capable of measuring the hysteresis loop of a transformer. These different properties are then characterized, and it was determined the most effective 3D printed transformer core requires a high fill factor along with a high concentration of magnetic particulate.

  17. Analysis of Hybrid-Integrated High-Speed Electro-Absorption Modulated Lasers Based on EM/Circuit Co-simulation

    DEFF Research Database (Denmark)

    Johansen, Tom Keinicke; Krozer, Viktor; Kazmierski, C.

    2009-01-01

    An improved electromagnetic simulation (EM) based approach has been developed for optimization of the electrical to optical (E/O) transmission properties of integrated electro-absorption modulated lasers (EMLs) aiming at 100 Gbit/s Ethernet applications. Our approach allows for an accurate analysis...... of the EML performance in a hybrid microstrip assembly. The established EM-based approach provides a design methodology for the future hybrid integration of the EML with its driving electronics....

  18. Resonance circuits for adiabatic circuits

    Directory of Open Access Journals (Sweden)

    C. Schlachta

    2003-01-01

    Full Text Available One of the possible techniques to reduces the power consumption in digital CMOS circuits is to slow down the charge transport. This slowdown can be achieved by introducing an inductor in the charging path. Additionally, the inductor can act as an energy storage element, conserving the energy that is normally dissipated during discharging. Together with the parasitic capacitances from the circuit a LCresonant circuit is formed.

  19. Digital Textile Printing

    OpenAIRE

    Moltchanova, Julia

    2011-01-01

    Rapidly evolving technology of digital printing opens new opportunities on many markets. One of them is the printed fabric market where printing companies as well as clients benefit from new printing methods. This thesis focuses on the digital textile printing technology and its implementation for fabric-on-demand printing service in Finland. The purpose of this project was to study the technology behind digital textile printing, areas of application of this technology, the requirements ...

  20. Digital Inkjet Textile Printing

    OpenAIRE

    Wang, Meichun

    2017-01-01

    Digital inkjet textile printing is an emerging technology developed with the rise of the digital world. It offers a possibility to print high-resolution images with unlimited color selection on fabrics. Digital inkjet printing brings a revolutionary chance for the textile printing industry. The history of textile printing shows the law how new technology replaces the traditional way of printing. This indicates the future of digital inkjet textile printing is relatively positive. Differen...

  1. Electronic circuit encyclopedia 2

    International Nuclear Information System (INIS)

    Park, Sun Ho

    1992-10-01

    This book is composed of 15 chapters, which are amplification of weak signal and measurement circuit audio control and power amplification circuit, data transmission and wireless system, forwarding and isolation, signal converting circuit, counter and comparator, discriminator circuit, oscillation circuit and synthesizer, digital and circuit on computer image processing circuit, sensor drive circuit temperature sensor circuit, magnetic control and application circuit, motor driver circuit, measuring instrument and check tool and power control and stability circuit.

  2. Electronic circuit encyclopedia 2

    Energy Technology Data Exchange (ETDEWEB)

    Park, Sun Ho

    1992-10-15

    This book is composed of 15 chapters, which are amplification of weak signal and measurement circuit audio control and power amplification circuit, data transmission and wireless system, forwarding and isolation, signal converting circuit, counter and comparator, discriminator circuit, oscillation circuit and synthesizer, digital and circuit on computer image processing circuit, sensor drive circuit temperature sensor circuit, magnetic control and application circuit, motor driver circuit, measuring instrument and check tool and power control and stability circuit.

  3. Solution synthesis of telluride-based nano-barbell structures coated with PEDOT:PSS for spray-printed thermoelectric generators

    Science.gov (United States)

    Bae, Eun Jin; Kang, Young Hun; Jang, Kwang-Suk; Lee, Changjin; Cho, Song Yun

    2016-05-01

    Solution-processable telluride-based heterostructures coated with poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (Te-Bi2Te3/PEDOT:PSS) were synthesized through a solution-phase reaction at low temperatures. The water-based synthesis yielded PEDOT:PSS-coated Te-Bi2Te3 nano-barbell structures with a high Seebeck coefficient that can be stably dispersed in water. These hybrid solutions were deposited onto a substrate by the spray-printing method to prepare thermoelectric generators. The thermoelectric properties of the Te-Bi2Te3/PEDOT:PSS hybrid films were significantly enhanced by a simple acid treatment due to the increased electrical conductivity, and the power factor of those materials can be effectively tuned over a wide range depending on the acid concentration of the treatment. The power factors of the synthesized Te-Bi2Te3/PEDOT:PSS hybrids were optimized to 60.05 μW m-1 K-2 with a Seebeck coefficient of 93.63 μV K-1 and an electrical conductivity of 69.99 S cm-1. The flexible thermoelectric generator fabricated by spray-printing Te-Bi2Te3/PEDOT:PSS hybrid solutions showed an open-circuit voltage of 1.54 mV with six legs at ΔT = 10 °C. This approach presents the potential for realizing printing-processable hybrid thermoelectric materials for application in flexible thermoelectric generators.Solution-processable telluride-based heterostructures coated with poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (Te-Bi2Te3/PEDOT:PSS) were synthesized through a solution-phase reaction at low temperatures. The water-based synthesis yielded PEDOT:PSS-coated Te-Bi2Te3 nano-barbell structures with a high Seebeck coefficient that can be stably dispersed in water. These hybrid solutions were deposited onto a substrate by the spray-printing method to prepare thermoelectric generators. The thermoelectric properties of the Te-Bi2Te3/PEDOT:PSS hybrid films were significantly enhanced by a simple acid treatment due to the increased electrical conductivity, and

  4. Scalable printed electronics: an organic decoder addressing ferroelectric non-volatile memory

    Science.gov (United States)

    Ng, Tse Nga; Schwartz, David E.; Lavery, Leah L.; Whiting, Gregory L.; Russo, Beverly; Krusor, Brent; Veres, Janos; Bröms, Per; Herlogsson, Lars; Alam, Naveed; Hagel, Olle; Nilsson, Jakob; Karlsson, Christer

    2012-01-01

    Scalable circuits of organic logic and memory are realized using all-additive printing processes. A 3-bit organic complementary decoder is fabricated and used to read and write non-volatile, rewritable ferroelectric memory. The decoder-memory array is patterned by inkjet and gravure printing on flexible plastics. Simulation models for the organic transistors are developed, enabling circuit designs tolerant of the variations in printed devices. We explain the key design rules in fabrication of complex printed circuits and elucidate the performance requirements of materials and devices for reliable organic digital logic. PMID:22900143

  5. Adhesion characterization of inkjet printed tracks

    NARCIS (Netherlands)

    Sridhar, Ashok; Akkerman, Remko; van Dijk, D.J.

    2007-01-01

    The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these

  6. Evolvable designs of experiments applications for circuits

    CERN Document Server

    Iordache, Octavian

    2009-01-01

    Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

  7. Hybridization of biomedical circuitry

    Science.gov (United States)

    Rinard, G. A.

    1978-01-01

    The design and fabrication of low power hybrid circuits to perform vital signs monitoring are reported. The circuits consist of: (1) clock; (2) ECG amplifier and cardiotachometer signal conditioner; (3) impedance pneumobraph and respiration rate processor; (4) hear/breath rate processor; (5) temperature monitor; and (6) LCD display.

  8. A Flexible Power Control Method of VSC-HVDC Link for the Enhancement of Effective Short-Circuit Ratio in a Hybrid Multi-Infeed HVDC System

    DEFF Research Database (Denmark)

    Liu, Yan; Chen, Zhe

    2013-01-01

    . To evaluate the contribution of the VSC-HVDC link on the voltage stability of HMIDC system, this paper proposes an effective short circuit ratio (ESCR) calculation method. Through the calculation, the voltage support capability of the VSC-HVDC link can be quantitatively represented by the ESCR. Furthermore......, based on the calculation results, a flexible power control strategy for the VSC-HVDC link is developed to provide maximum reactive power support under grid faults. The theoretical analysis of the HMIDC system is based on the Danish transmission grid, evaluated through PSCAD simulations under different...

  9. All-printed paper memory

    KAUST Repository

    Lien, Derhsien

    2014-08-26

    We report the memory device on paper by means of an all-printing approach. Using a sequence of inkjet and screen-printing techniques, a simple metal-insulator-metal device structure is fabricated on paper as a resistive random access memory with a potential to reach gigabyte capacities on an A4 paper. The printed-paper-based memory devices (PPMDs) exhibit reproducible switching endurance, reliable retention, tunable memory window, and the capability to operate under extreme bending conditions. In addition, the PBMD can be labeled on electronics or living objects for multifunctional, wearable, on-skin, and biocompatible applications. The disposability and the high-security data storage of the paper-based memory are also demonstrated to show the ease of data handling, which are not achievable for regular silicon-based electronic devices. We envision that the PPMDs manufactured by this cost-effective and time-efficient all-printing approach would be a key electronic component to fully activate a paper-based circuit and can be directly implemented in medical biosensors, multifunctional devices, and self-powered systems. © 2014 American Chemical Society.

  10. The high-voltage system for the LHCb RICH hybrid photon detectors

    International Nuclear Information System (INIS)

    Arnaboldi, C.; Bellunato, T.; De Lucia, A.; Fanchini, E.; Perego, D.L.; Pessina, G.

    2009-01-01

    We describe the characterization of the high-voltage (HV) distribution system designed and produced for the pixel hybrid photon detectors of the ring imaging Cherenkov counters of the LHCb experiment. The HV system consists of a series of printed circuit boards with a specific layout designed to prevent any discharge arising from high electric fields. The system has dedicated monitoring and control features to supervise HV set-up during data taking. The full production of the HV system has been now completed and all the boards have been fully characterized and installed in the detector, which is currently being commissioned.

  11. Controllable circuit

    DEFF Research Database (Denmark)

    2010-01-01

    A switch-mode power circuit comprises a controllable element and a control unit. The controllable element is configured to control a current in response to a control signal supplied to the controllable element. The control unit is connected to the controllable element and provides the control...

  12. Circuit Training.

    Science.gov (United States)

    Nelson, Jane B.

    1998-01-01

    Describes a research-based activity for high school physics students in which they build an LC circuit and find its resonant frequency of oscillation using an oscilloscope. Includes a diagram of the apparatus and an explanation of the procedures. (DDR)

  13. HYBRID VEHICLE CONTROL SYSTEM

    Directory of Open Access Journals (Sweden)

    V. Dvadnenko

    2016-06-01

    Full Text Available The hybrid vehicle control system includes a start–stop system for an internal combustion engine. The system works in a hybrid mode and normal vehicle operation. To simplify the start–stop system, there were user new possibilities of a hybrid car, which appeared after the conversion. Results of the circuit design of the proposed system of basic blocks are analyzed.

  14. A wearable tracking device inkjet-printed on textile

    KAUST Repository

    Krykpayev, Bauyrzhan

    2017-05-20

    Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based implementations. An attractive option would be direct printing of circuit layout on the textile itself, negating the use of rigid PCB materials. However, high surface roughness and porosity of textiles prevents efficient and reliable printing of electronics on textile. In this work, by printing an interface layer on the textile first, a complete localization circuit integrated with an antenna has been inkjet-printed on the textile for the first time. Printed conductive traces were optimized in terms of conductivity and resolution by controlling the number of over-printed layers. The tracking device determines the wearer\\'s position using WiFi and this information can be displayed on any internet-enabled device, such as smart phone. The device is compact (55mm×45mm) and lightweight (22g with 500mAh battery) for people to comfortably wear it and can be easily concealed in case discretion is required. The device operates at 2.4GHz communicated up to a distance of 55m, with localization accuracy of up to 8m.

  15. Inkjet printed ambipolar transistors and inverters based on carbon nanotube/zinc tin oxide heterostructures

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Bongjun; Jang, Seonpil; Dodabalapur, Ananth, E-mail: ananth.dodabalapur@engr.utexas.edu [Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758 (United States); Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712 (United States); Geier, Michael L.; Prabhumirashi, Pradyumna L. [Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (United States); Hersam, Mark C. [Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (United States); Department of Chemistry, Northwestern University, Evanston, Illinois 60208 (United States); Department of Medicine, Northwestern University, Evanston, Illinois 60208 (United States)

    2014-02-10

    We report ambipolar field-effect transistors (FETs) consisting of inkjet printed semiconductor bilayer heterostructures utilizing semiconducting single-walled carbon nanotubes (SWCNTs) and amorphous zinc tin oxide (ZTO). The bilayer structure allows for electron transport to occur principally in the amorphous oxide layer and hole transport to occur exclusively in the SWCNT layer. This results in balanced electron and hole mobilities exceeding 2 cm{sup 2} V{sup −1} s{sup −1} at low operating voltages (<5 V) in air. We further show that the SWCNT-ZTO hybrid ambipolar FETs can be integrated into functional inverter circuits that display high peak gain (>10). This work provides a pathway for realizing solution processable, inkjet printable, large area electronic devices, and systems based on SWCNT-amorphous oxide heterostructures.

  16. Realizing a supercapacitor in an electrical circuit

    International Nuclear Information System (INIS)

    Fukuhara, Mikio; Kuroda, Tomoyuki; Hasegawa, Fumihiko

    2014-01-01

    Capacitors are commonly used in electronic resonance circuits; however, capacitors have not been used for storing large amounts of electrical energy in electrical circuits. Here, we report a superior RC circuit which serves as an electrical storage system characterized by quick charging and long-term discharging of electricity. The improved energy storage characteristics in this mixed electric circuit (R 1  + R 2 C 1 ) with small resistor R 1 , large resistor R 2 , and large capacitor C 1 are derived from the damming effect by large R 2 in simple parallel R 2 C 1 circuit. However, no research work has been carried out previously on the use of capacitors as electrical energy storage devices in circuits. Combined with nanotechnology, we hope that our finding will play a remarkable role in a variety of applications such as hybrid electric vehicles and backup power supplies

  17. LOGIC CIRCUIT

    Science.gov (United States)

    Strong, G.H.; Faught, M.L.

    1963-12-24

    A device for safety rod counting in a nuclear reactor is described. A Wheatstone bridge circuit is adapted to prevent de-energizing the hopper coils of a ball backup system if safety rods, sufficient in total control effect, properly enter the reactor core to effect shut down. A plurality of resistances form one arm of the bridge, each resistance being associated with a particular safety rod and weighted in value according to the control effect of the particular safety rod. Switching means are used to switch each of the resistances in and out of the bridge circuit responsive to the presence of a particular safety rod in its effective position in the reactor core and responsive to the attainment of a predetermined velocity by a particular safety rod enroute to its effective position. The bridge is unbalanced in one direction during normal reactor operation prior to the generation of a scram signal and the switching means and resistances are adapted to unbalance the bridge in the opposite direction if the safety rods produce a predetermined amount of control effect in response to the scram signal. The bridge unbalance reversal is then utilized to prevent the actuation of the ball backup system, or, conversely, a failure of the safety rods to produce the predetermined effect produces no unbalance reversal and the ball backup system is actuated. (AEC)

  18. Short- circuit tests of circuit breakers

    OpenAIRE

    Chorovský, P.

    2015-01-01

    This paper deals with short-circuit tests of low voltage electrical devices. In the first part of this paper, there are described basic types of short- circuit tests and their principles. Direct and indirect (synthetic) tests with more details are described in the second part. Each test and principles are explained separately. Oscilogram is obtained from short-circuit tests of circuit breakers at laboratory. The aim of this research work is to propose a test circuit for performing indirect test.

  19. 3D Printed Shock Mitigating Structures

    Science.gov (United States)

    Schrand, Amanda; Elston, Edwin; Dennis, Mitzi; Metroke, Tammy; Chen, Chenggang; Patton, Steven; Ganguli, Sabyasachi; Roy, Ajit

    Here we explore the durability, and shock mitigating potential, of solid and cellular 3D printed polymers and conductive inks under high strain rate, compressive shock wave and high g acceleration conditions. Our initial designs include a simple circuit with 4 resistors embedded into circular discs and a complex cylindrical gyroid shape. A novel ink consisting of silver-coated carbon black nanoparticles in a thermoplastic polyurethane was used as the trace material. One version of the disc structural design has the advantage of allowing disassembly after testing for direct failure analysis. After increasing impacts, printed and traditionally potted circuits were examined for functionality. Additionally, in the open disc design, trace cracking and delamination of resistors were able to be observed. In a parallel study, we examined the shock mitigating behavior of 3D printed cellular gyroid structures on a Split Hopkinson Pressure Bar (SHPB). We explored alterations to the classic SHPB setup for testing the low impedance, cellular samples to most accurately reflect the stress state inside the sample (strain rates from 700 to 1750 s-1). We discovered that the gyroid can effectively absorb the impact of the test resulting in crushing the structure. Future studies aim to tailor the unit cell dimensions for certain frequencies, increase print accuracy and optimize material compositions for conductivity and adhesion to manufacture more durable devices.

  20. Collective of mechatronics circuit

    International Nuclear Information System (INIS)

    1987-02-01

    This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

  1. Collective of mechatronics circuit

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1987-02-15

    This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

  2. Laser printing of 3D metallic interconnects

    Science.gov (United States)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  3. Variable-data Printing Serves - Niches Here, There & Everywhere

    Directory of Open Access Journals (Sweden)

    Roger Ynostroza

    2004-12-01

    Full Text Available A milestone focus on high-end digital color presses capable of variable-data imaging - a technology that was introduced ten years ago and is just now at the beginning of wider, more successful implementation in commercial printing-tends to overshadow some real achievements on other variable-data fronts. Those activities involve ink-jet and electrophotographic imaging for high-volume transactional printing, print-on-demand books and catalogs, wide-format proofing and imaging, label production, and printing of text and coding of printed packaging.The capabilities of digital production color presses intrigue commercial printers the most, especially new units referred to by manufacturers as "Series II" or "third-generation" systems. Besides having more press-like characteristics, from offset-caliber quality, image consistency, and high output rates to sturdy construction, reliability, and stock choice, the units seem to represent a way to produce printing that’s beyond the norm.Some users are producing hybrid printed products (offset printing a quantity of "shells" that are later personalized by digital presses, while others are utilizing clients’ "dynamic" databases to personalize marketing materials that drive response rates up to 15%, even 35%. Finally, digital color systems prompt the creation of high-margin Internet-based print providers offering easy-to-design and easy-toorder print materials. Printers may do well to adopt the high-value communications capability that digital imaging offers.

  4. Circuit parties.

    Science.gov (United States)

    Guzman, R

    2000-03-01

    Circuit parties are extended celebrations, lasting from a day to a week, primarily attended by gay and bisexual men in their thirties and forties. These large-scale dance parties move from city to city and draw thousands of participants. The risks for contracting HIV during these parties include recreational drug use and unsafe sex. Limited data exists on the level of risk at these parties, and participants are skeptical of outside help because of past criticism of these events. Health care and HIV advocates can promote risk-reduction strategies with the cooperation of party planners and can counsel individuals to personally reduce their own risk. To convey the message, HIV prevention workers should emphasize positive and community-centered aspects of the parties, such as taking care of friends and avoiding overdose.

  5. Chip-by-chip configurable interconnection using digital printing techniques

    International Nuclear Information System (INIS)

    Mashayekhi, Mohammad; Carrabina, Jordi; Winchester, Lee; Laurila, Mika-Matti; Mäntysalo, Matti; Ogier, Simon; Terés, Lluís

    2017-01-01

    Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results. (paper)

  6. Commutation circuit for an HVDC circuit breaker

    Science.gov (United States)

    Premerlani, William J.

    1981-01-01

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components.

  7. Substrate optimization for integrated circuit antennas

    OpenAIRE

    Alexopoulos, N. G.; Katehi, P. B.; Rutledge, D. B.

    1982-01-01

    Imaging systems in microwaves, millimeter and submillimeter wave applications employ printed circuit antenna elements. The effect of substrate properties is analyzed in this paper by both reciprocity theorem as well as integral equation approach for infinitesimally short as well as finite length dipole and slot elements. Radiation efficiency and substrate surface wave guidance is studied for practical substrate materials as GaAs, Silicon, Quartz and Duroid.

  8. Electrical and Physical Property Characterization of Single Walled Carbon Nanotube Ink for Flexible Printed Electronics

    Science.gov (United States)

    2015-03-01

    accurately can the 2 ink be printed? How well does the ink adhere to its substrate? How does the substrate affect the adhesion properties? In what...physical characteristics, some of which may be incompatible with inkjet printing, or the Dimatix DMP 2800 specifically. 3.2.1.2 Ink Solvent...The tape test is conducted by applying a flexible adhesive -backed polymer to the fully-dried printed circuit. The tape is then removed and analyzed

  9. Analog circuit design designing dynamic circuit response

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    This second volume, Designing Dynamic Circuit Response builds upon the first volume Designing Amplifier Circuits by extending coverage to include reactances and their time- and frequency-related behavioral consequences.

  10. Trigger circuit

    International Nuclear Information System (INIS)

    Verity, P.R.; Chaplain, M.D.; Turner, G.D.J.

    1984-01-01

    A monostable trigger circuit comprises transistors TR2 and TR3 arranged with their collectors and bases interconnected. The collector of the transistor TR2 is connected to the base of transistor TR3 via a capacitor C2 the main current path of a grounded base transistor TR1 and resistive means R2,R3. The collector of transistor TR3 is connected to the base of transistor TR2 via resistive means R6, R7. In the stable state all the transistors are OFF, the capacitor C2 is charged, and the output is LOW. A positive pulse input to the base of TR2 switches it ON, which in turn lowers the voltage at points A and B and so switches TR1 ON so that C2 can discharge via R2, R3, which in turn switches TR3 ON making the output high. Thus all three transistors are latched ON. When C2 has discharged sufficiently TR1 switches OFF, followed by TR3 (making the output low again) and TR2. The components C1, C3 and R4 serve to reduce noise, and the diode D1 is optional. (author)

  11. Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

    DEFF Research Database (Denmark)

    Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2015-01-01

    Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...

  12. Tape transfer printing of a liquid metal alloy for stretchable RF electronics.

    Science.gov (United States)

    Jeong, Seung Hee; Hjort, Klas; Wu, Zhigang

    2014-09-03

    In order to make conductors with large cross sections for low impedance radio frequency (RF) electronics, while still retaining high stretchability, liquid-alloy-based microfluidic stretchable electronics offers stretchable electronic systems the unique opportunity to combine various sensors on our bodies or organs with high-quality wireless communication with the external world (devices/systems), without sacrificing enhanced user comfort. This microfluidic approach, based on printed circuit board technology, allows large area processing of large cross section conductors and robust contacts, which can handle a lot of stretching between the embedded rigid active components and the surrounding system. Although it provides such benefits, further development is needed to realize its potential as a high throughput, cost-effective process technology. In this paper, tape transfer printing is proposed to supply a rapid prototyping batch process at low cost, albeit at a low resolution of 150 μm. In particular, isolated patterns can be obtained in a simple one-step process. Finally, a stretchable radio frequency identification (RFID) tag is demonstrated. The measured results show the robustness of the hybrid integrated system when the tag is stretched at 50% for 3000 cycles.

  13. Tape Transfer Printing of a Liquid Metal Alloy for Stretchable RF Electronics

    Directory of Open Access Journals (Sweden)

    Seung Hee Jeong

    2014-09-01

    Full Text Available In order to make conductors with large cross sections for low impedance radio frequency (RF electronics, while still retaining high stretchability, liquid-alloy-based microfluidic stretchable electronics offers stretchable electronic systems the unique opportunity to combine various sensors on our bodies or organs with high-quality wireless communication with the external world (devices/systems, without sacrificing enhanced user comfort. This microfluidic approach, based on printed circuit board technology, allows large area processing of large cross section conductors and robust contacts, which can handle a lot of stretching between the embedded rigid active components and the surrounding system. Although it provides such benefits, further development is needed to realize its potential as a high throughput, cost-effective process technology. In this paper, tape transfer printing is proposed to supply a rapid prototyping batch process at low cost, albeit at a low resolution of 150 μm. In particular, isolated patterns can be obtained in a simple one-step process. Finally, a stretchable radio frequency identification (RFID tag is demonstrated. The measured results show the robustness of the hybrid integrated system when the tag is stretched at 50% for 3000 cycles.

  14. Printing quality control automation

    Science.gov (United States)

    Trapeznikova, O. V.

    2018-04-01

    One of the most important problems in the concept of standardizing the process of offset printing is the control the quality rating of printing and its automation. To solve the problem, a software has been developed taking into account the specifics of printing system components and the behavior in printing process. In order to characterize the distribution of ink layer on the printed substrate the so-called deviation of the ink layer thickness on the sheet from nominal surface is suggested. The geometric data construction the surface projections of the color gamut bodies allows to visualize the color reproduction gamut of printing systems in brightness ranges and specific color sectors, that provides a qualitative comparison of the system by the reproduction of individual colors in a varying ranges of brightness.

  15. Making PMT halftone prints

    Energy Technology Data Exchange (ETDEWEB)

    Corey, J.D.

    1977-05-01

    In the printing process for technical reports presently used at Bendix Kansas City Division, photographs are reproduced by pasting up PMT halftone prints on the artwork originals. These originals are used to make positive-working plastic plates for offset lithography. Instructions for making good-quality halftone prints using Eastman Kodak's PMT materials and processes are given in this report. 14 figures.

  16. Print and Manuscript

    OpenAIRE

    Erne, Lukas Christian

    2007-01-01

    Positioning Shakespeare at the "crossroads of manuscript and print" and exploring what the choice of print or manuscript reveals about the poet's intended audience and the social persona the poet wanted to assume and fashion, argues that "Shakespeare's authorial self-presentation begins as a poet and, more specifically, as a print-published poet" with the publication of Venus and Adonis in 1593 and the allusion to the publication of Rape of Lucrece in the next year. Yet also considers the imp...

  17. [Electric short-circuit incident observed with "Upsher" laryngoscopes].

    Science.gov (United States)

    Tritsch, L; Vailly, B

    2006-01-01

    We observed an electrical short-circuit between a fasten screw of the printed circuit and the handle of an Upsher universal laryngoscope (serial number UQ1). The isolating Silicone layer was broken above the screw. This isolation defect was found all over our Upsher laryngoscopes of the UQ1 series. No doubt that if accumulators were used instead of batteries, emitted heat would be in largest amount and perhaps dangerous.

  18. Engraving Print Classification

    International Nuclear Information System (INIS)

    Hoelck, Daniel; Barbe, Joaquim

    2008-01-01

    A print is a mark, or drawing, made in or upon a plate, stone, woodblock or other material which is cover with ink and then is press usually into a paper reproducing the image on the paper. Engraving prints usually are image composed of a group of binary lines, specially those are made with relief and intaglio techniques. Varying the number and the orientation of lines, the drawing of the engraving print is conformed. For this reason we propose an application based on image processing methods to classify engraving prints

  19. Printing Has a Future

    Directory of Open Access Journals (Sweden)

    Hans Georg Wenke

    2004-12-01

    Full Text Available Printing will also be done in the future. Printed items meet basic needs and are deeply anchored in people’s habits. Being able to handle and collect printed matter is highly attractive. And paper is now more alive than ever. It is therefore too shortsighted to disclaim the importance of one of the still large economic sectors just because of a few looming-recession instigated market shifts.The exciting aspect of drupa 2004 is: printing will be reinvented, so to speak. Much more printing will be done in the future than at present. On the one hand, people are concentrating on process optimization and automation to ensure this. Measuring and testing, process control and optimization, and linking up "office software" with printing technology will be very central topics at drupa 2004. Electronics and print are not rivals; a symbiosis exists. And printing is high-tech: hardly any other multifaceted sector which has been so successful for centuries is as computerized as the printing industry.A series of "new chapters" in the variety of printing possibilities will be opened at drupa. Talk will be generated by further technical developments, often the connection between paper/cardboard and electronics, the link between the office world and graphics industry, text databases and their link-up to graphic page production tools, and "on the fly" dynamic printing over networks.All of this and more belongs to future potentialities, which are so substantial overall, the outlook is by no means black for the "black art". Like its predecessors, drupa 2004 is also a product trade fair. However, more than ever before in its history, it is also an "information village". The exhibits are useful, because they occasionally make what this means visible.

  20. Solid-state circuits

    CERN Document Server

    Pridham, G J

    2013-01-01

    Solid-State Circuits provides an introduction to the theory and practice underlying solid-state circuits, laying particular emphasis on field effect transistors and integrated circuits. Topics range from construction and characteristics of semiconductor devices to rectification and power supplies, low-frequency amplifiers, sine- and square-wave oscillators, and high-frequency effects and circuits. Black-box equivalent circuits of bipolar transistors, physical equivalent circuits of bipolar transistors, and equivalent circuits of field effect transistors are also covered. This volume is divided

  1. Circuit analysis for dummies

    CERN Document Server

    Santiago, John

    2013-01-01

    Circuits overloaded from electric circuit analysis? Many universities require that students pursuing a degree in electrical or computer engineering take an Electric Circuit Analysis course to determine who will ""make the cut"" and continue in the degree program. Circuit Analysis For Dummies will help these students to better understand electric circuit analysis by presenting the information in an effective and straightforward manner. Circuit Analysis For Dummies gives you clear-cut information about the topics covered in an electric circuit analysis courses to help

  2. Current limiter circuit system

    Science.gov (United States)

    Witcher, Joseph Brandon; Bredemann, Michael V.

    2017-09-05

    An apparatus comprising a steady state sensing circuit, a switching circuit, and a detection circuit. The steady state sensing circuit is connected to a first, a second and a third node. The first node is connected to a first device, the second node is connected to a second device, and the steady state sensing circuit causes a scaled current to flow at the third node. The scaled current is proportional to a voltage difference between the first and second node. The switching circuit limits an amount of current that flows between the first and second device. The detection circuit is connected to the third node and the switching circuit. The detection circuit monitors the scaled current at the third node and controls the switching circuit to limit the amount of the current that flows between the first and second device when the scaled current is greater than a desired level.

  3. Screen printing as a holistic manufacturing method for multifunctional microsystems and microreactors

    International Nuclear Information System (INIS)

    Bejarano, D; Lozano, P; Mata, D; Cito, S; Constantí, M; Katakis, I

    2009-01-01

    Microsystems are commonly manufactured by photolithographic or injection moulding techniques in a variety of realizations and on almost any material. A perennial problem in the manufacturing of microsystems is the difficulty to obtain hybrid devices that incorporate distinct materials with different functionalities. In most of the cases, cumbersome prototyping and high investment needed for manufacturing are additional problems that add to the cost of the final product. Such drawbacks are true not only for lab-on-a-chip but also for certain microreactor applications. Most importantly, in many commercial applications where an intermediate product between full fluidics control and a 'strip' is needed, such restraints prohibit the feasibility of reduction to practice. Screen printing on the other hand is a low cost technique that has been used for years in mass producing two-dimensional low cost reproductions of a mask pattern for circuits and art incorporates prototyping in production and allows the use of an almost limitless variety of materials as 'inks'. In this work it is demonstrated that taking advantage of the deposited ink's three-dimensional nature, screen printing can be used as a versatile and low cost technique for the fabrication of microchannels. Microchannels with dimensions in the order of 100 µm were fabricated that could readily incorporate functionalities through the choice of the materials used to create the microstructure. Variables have been investigated through a factorial experimental design as important process parameters that affect the resolution and print thickness of the resulting microchannels that incorporate electroactive elements. Such studies can lead to the optimization of the process for custom applications

  4. Printing Ancient Terracotta Warriors

    Science.gov (United States)

    Gadecki, Victoria L.

    2010-01-01

    Standing in awe in Xian, China, at the Terra Cotta warrior archaeological site, the author thought of sharing this experience and excitement with her sixth-grade students. She decided to let her students carve patterns of the ancient soldiers to understand their place in Chinese history. They would make block prints and print multiple soldiers on…

  5. Print like an Egyptian.

    Science.gov (United States)

    Weisensee, Marilyn

    1990-01-01

    Describes a relief printmaking unit for sixth graders with the objective of decorating the inside of a pyramid. Ancient Egyptian imagery was used to help students become familiar with the style. Students designed and printed linoleum prints in different colors. They then critiqued their work and made their selection for the pyramid. (KM)

  6. Learning outcomes afforded by self-assessed, segmented video–print combinations

    OpenAIRE

    Jack Koumi

    2015-01-01

    Learning affordances of video and print are examined in order to assess the learning outcomes afforded by hybrid video–print learning packages. The affordances discussed for print are: navigability, surveyability and legibility. Those discussed for video are: design for constructive reflection, provision of realistic experiences, presentational attributes, motivational influences and teacher personalisation. The video affordances are examined through a framework of pedagogic design principles...

  7. Inkjet printing technology and conductive inks synthesis for microfabrication techniques

    International Nuclear Information System (INIS)

    Dang, Mau Chien; Dung Dang, Thi My; Fribourg-Blanc, Eric

    2013-01-01

    Inkjet printing is an advanced technique which reliably reproduces text, images and photos on paper and some other substrates by desktop printers and is now used in the field of materials deposition. This interest in maskless materials deposition is coupled with the development of microfabrication techniques for the realization of circuits or patterns on flexible substrates for which printing techniques are of primary interest. This paper is a review of some results obtained in inkjet printing technology to develop microfabrication techniques at Laboratory for Nanotechnology (LNT). Ink development, in particular conductive ink, study of printed patterns, as well as application of these to the realization of radio-frequency identification (RFID) tags on flexible substrates, are presented. (paper)

  8. Digital multicolor printing: state of the art and future challenges

    Science.gov (United States)

    Kipphan, Helmut

    1995-04-01

    During the last 5 years, digital techniques have become extremely important in the graphic arts industry. All sections in the production flow for producing multicolor printed products - prepress, printing and postpress - are influenced by digitalization, in an evolutionary and revolutionary way. New equipment and network techniques bring all the sections closer together. The focus is put on high-quality multicolor printing, together with high productivity. Conventional offset printing technology is compared with the leading nonimpact printing technologies. Computer to press is contrasted with computer to print techniques. The newest available digital multicolor presses are described - the direct imaging offset printing press from HEIDELBERG with new laser imaging technique as well as the INDIGO and XEIKON presses based on electrophotography. Regarding technical specifications, economic calculations and print quality, it is worked out that each technique has its own market segments. An outlook is given for future computer to press techniques and the potential of nonimpact printing technologies for advanced high-speed multicolor computer to print equipment. Synergy effects from the NIP-technologies to the conventional printing technologies and vice versa are possible for building up innovative new products, for example hybrid printing systems. It is also shown that there is potential for improving the print quality, based on special screening algorithms, and a higher number of grey levels per pixel by using NIP-technologies. As an intermediate step in digitalization of the production flow, but also as an economical solution computer to plate equipment is described. By producing printed products totally in a digital way, digital color proofing as well as color management systems are needed. The newest high-tech equipment using NIP-technologies for producing proofs is explained. All in all it is shown that the state of the art in digital multicolor printing has reached

  9. Microwave integrated circuits for space applications

    Science.gov (United States)

    Leonard, Regis F.; Romanofsky, Robert R.

    1991-01-01

    Monolithic microwave integrated circuits (MMIC), which incorporate all the elements of a microwave circuit on a single semiconductor substrate, offer the potential for drastic reductions in circuit weight and volume and increased reliability, all of which make many new concepts in electronic circuitry for space applications feasible, including phased array antennas. NASA has undertaken an extensive program aimed at development of MMICs for space applications. The first such circuits targeted for development were an extension of work in hybrid (discrete component) technology in support of the Advanced Communication Technology Satellite (ACTS). It focused on power amplifiers, receivers, and switches at ACTS frequencies. More recent work, however, focused on frequencies appropriate for other NASA programs and emphasizes advanced materials in an effort to enhance efficiency, power handling capability, and frequency of operation or noise figure to meet the requirements of space systems.

  10. The Use of 3D Printing in the Development of Gaseous Radiation Detectors

    Directory of Open Access Journals (Sweden)

    Fargher Sam

    2018-01-01

    The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

  11. Effects of smoke on functional circuits

    International Nuclear Information System (INIS)

    Tanaka, T.J.

    1997-10-01

    Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

  12. Intuitive analog circuit design

    CERN Document Server

    Thompson, Marc

    2013-01-01

    Intuitive Analog Circuit Design outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject. In this book, Dr. Thompson describes intuitive and ""back-of-the-envelope"" techniques for designing and analyzing analog circuits, including transistor amplifi

  13. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1972-01-01

    Electronic Devices and Circuits, Volume 3 provides a comprehensive account on electronic devices and circuits and includes introductory network theory and physics. The physics of semiconductor devices is described, along with field effect transistors, small-signal equivalent circuits of bipolar transistors, and integrated circuits. Linear and non-linear circuits as well as logic circuits are also considered. This volume is comprised of 12 chapters and begins with an analysis of the use of Laplace transforms for analysis of filter networks, followed by a discussion on the physical properties of

  14. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    2012-01-01

    Modern power semiconductors allow for switching frequencies of power converters in the very high frequency (VHF) band (30 MHz to 300 MHz). The major advantage of this frequency increase is a remarkable reduction of the size of power converters due to smaller passive components. However crucial...

  15. Novel waste printed circuit board recycling process with molten salt

    OpenAIRE

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450?470??C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, a...

  16. Novel waste printed circuit board recycling process with molten salt.

    Science.gov (United States)

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450-470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl-KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. •The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept.•This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L.•The treated PCBs can be removed via leg B while the process is on-going.

  17. Advances in Integrated Heat Pipe Technology for Printed Circuit Boards

    NARCIS (Netherlands)

    Wits, Wessel Willems; te Riele, Gert Jan

    2010-01-01

    Designing thermal control systems for electronic products has become very challenging due to the continuous miniaturization and increasing performance demands. Two-phase cooling solutions, such as heat pipes or vapor chambers, are increasingly used as they offer higher thermal coefficients for heat

  18. Novel waste printed circuit board recycling process with molten salt

    Science.gov (United States)

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450–470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl–KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. • The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept. • This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L. • The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  19. Integrated Printed Circuit Board (PCB) Active Cooling With Piezoelectric Actuator

    Science.gov (United States)

    2012-09-01

    prepreg epoxy. Individual FR-4 lamina were mechanically machined to pattern each layer. The layers were aligned, stacked, and laminated to form the...The cooler substrate is a laminated multilayer FR-4 substrate. Individual layers are patterned to support the active element, form a resonant... laminated with 70/30 copper-nickel alloy or 80/20 nickel-chrome alloy and patterned by means of photolithographic techniques and wet etching in a ferric

  20. Colour printing techniques

    OpenAIRE

    Parraman, C.

    2017-01-01

    Invited chapter in the book Colour Design: Theories and Applications. In PART 3 COLOUR, DESIGN AND COLORATION this chapter covers:\\ud - Hardcopy colour: analogue versus digital\\ud - Colour theory in relation to printing\\ud - Overview of halftoning and digital print technologies\\ud - Overview and development of inks\\ud - Inkjet papers and inks\\ud - Recent and future trends in colour, printing inks and hardware.\\ud \\ud This book differs from other existing books in the field, with the aim of an...

  1. Cosimulation of electromagnetics-circuit systems exploiting DGTD and MNA

    KAUST Repository

    Li, Ping

    2014-06-01

    A hybrid electromagnetics (EM)-circuit simulator exploiting the discontinuous Galerkin time domain (DGTD) method and the modified nodal analysis (MNA) algorithm is developed for analyzing hybrid distributive and nonlinear multiport lumped circuit systems. The computational domain is split into two subsystems. One is the EM subsystem that is analyzed by DGTD, while the other is the circuit subsystem that is solved by the MNA method. The coupling between the EM and circuit subsystems is enforced at the lumped port where related field and circuit unknowns are coupled via the use of numerical flux, port voltages, and current sources. Since the spatial operations of DGTD are localized, thanks to the use of numerical flux, coupling matrices between EM and circuit subsystems are small and are directly inverted. To handle nonlinear devices within the circuit subsystem, the standard Newton-Raphson method is applied to the nonlinear coupling matrix system. In addition, a local time-stepping scheme is applied to improve the efficiency of the hybrid solver. Numerical examples including single and multiport linear/nonlinear circuit networks are presented to validate the proposed solver. © 2014 IEEE.

  2. Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

    Directory of Open Access Journals (Sweden)

    Xuelin Wang

    2016-11-01

    Full Text Available This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc. to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good product—all of which are challenges faced by current liquid metal flexible printed electronics—are discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.

  3. Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

    Science.gov (United States)

    Schleunitz, A.; Klein, J. J.; Krupp, A.; Stender, B.; Houbertz, R.; Gruetzner, G.

    2017-02-01

    The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

  4. Electrical Circuits and Water Analogies

    Science.gov (United States)

    Smith, Frederick A.; Wilson, Jerry D.

    1974-01-01

    Briefly describes water analogies for electrical circuits and presents plans for the construction of apparatus to demonstrate these analogies. Demonstrations include series circuits, parallel circuits, and capacitors. (GS)

  5. ChemicalVia: a CERN-patented technology for use in high-density circuits

    CERN Multimedia

    Patrice Loïez

    2003-01-01

    High-density multilayer printed circuits such as those pictured here are found in miniaturized modern equipment from video cameras to mobile phones. Adjacent layers in these circuits are electrically connected by microvias, consisting of a small-diameter hole (usually 50 µm) with a thin metal-deposited surface covering their cylindrical walls to ensure local conductivity between the two layers. ChemicalVia is a new method, patented by CERN, to make microvias on high-density multilayer printed circuits using chemicals rather than complex laser, plasma or photoimaging technology. The process is compatible with all standard printed-circuit assembly lines, and has the advantages of low initial investment and reduced manufacturing costs. http://www.cern.ch/ttdatabase

  6. Electric circuits essentials

    CERN Document Server

    REA, Editors of

    2012-01-01

    REA's Essentials provide quick and easy access to critical information in a variety of different fields, ranging from the most basic to the most advanced. As its name implies, these concise, comprehensive study guides summarize the essentials of the field covered. Essentials are helpful when preparing for exams, doing homework and will remain a lasting reference source for students, teachers, and professionals. Electric Circuits I includes units, notation, resistive circuits, experimental laws, transient circuits, network theorems, techniques of circuit analysis, sinusoidal analysis, polyph

  7. Piezoelectric drive circuit

    Science.gov (United States)

    Treu, C.A. Jr.

    1999-08-31

    A piezoelectric motor drive circuit is provided which utilizes the piezoelectric elements as oscillators and a Meacham half-bridge approach to develop feedback from the motor ground circuit to produce a signal to drive amplifiers to power the motor. The circuit automatically compensates for shifts in harmonic frequency of the piezoelectric elements due to pressure and temperature changes. 7 figs.

  8. Load testing circuit

    DEFF Research Database (Denmark)

    2009-01-01

    A load testing circuit a circuit tests the load impedance of a load connected to an amplifier. The load impedance includes a first terminal and a second terminal, the load testing circuit comprising a signal generator providing a test signal of a defined bandwidth to the first terminal of the load...

  9. Short-circuit logic

    NARCIS (Netherlands)

    Bergstra, J.A.; Ponse, A.

    2010-01-01

    Short-circuit evaluation denotes the semantics of propositional connectives in which the second argument is only evaluated if the first argument does not suffice to determine the value of the expression. In programming, short-circuit evaluation is widely used. A short-circuit logic is a variant of

  10. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, S.M.; Vertregt, Maarten

    2011-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital

  11. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, S.M.; Vertregt, Maarten

    2010-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital

  12. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-05-19

    Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

  13. Print Quality of Ink Jet Printed PVC Foils

    Directory of Open Access Journals (Sweden)

    Nemanja Kašiković

    2015-09-01

    Full Text Available Digital printing technique is used for a wide variety of substrates, one of which are PVC foils. Samples used in this research were printed by digital ink jet printing technique using Mimaki JV22 printing machine and J-Eco Subly Nano inks. As printing substrates, two different types of materials were used (ORACAL 640 - Print Vinyl and LG Hausys LP2712. A test card consisting of fields of CMYK colours was created and printed, varying the number of ink layers applied. Samples were exposed to light after the printing process. Spectrophotometric measurements were conducted before and after the light treatment. Based on spectrophotometricaly obtained data, colour differences ΔE2000 were calculated. Results showed that increasing number of layers, as well as the right choice of substrates, can improve the behaviour of printed product during exploitation.

  14. 3D Printing: 3D Printing of Shape Memory Polymers for Flexible Electronic Devices (Adv. Mater. 22/2016).

    Science.gov (United States)

    Zarek, Matt; Layani, Michael; Cooperstein, Ido; Sachyani, Ela; Cohn, Daniel; Magdassi, Shlomo

    2016-06-01

    On page 4449, D. Cohn, S. Magdassi, and co-workers describe a general and facile method based on 3D printing of methacrylated macromonomers to fabricate shape-memory objects that can be used in flexible and responsive electrical circuits. Such responsive objects can be used in the fabrication of soft robotics, minimal invasive medical devices, sensors, and wearable electronics. The use of 3D printing overcomes the poor processing characteristics of thermosets and enables complex geometries that are not easily accessible by other techniques. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  15. Feedback in analog circuits

    CERN Document Server

    Ochoa, Agustin

    2016-01-01

    This book describes a consistent and direct methodology to the analysis and design of analog circuits with particular application to circuits containing feedback. The analysis and design of circuits containing feedback is generally presented by either following a series of examples where each circuit is simplified through the use of insight or experience (someone else’s), or a complete nodal-matrix analysis generating lots of algebra. Neither of these approaches leads to gaining insight into the design process easily. The author develops a systematic approach to circuit analysis, the Driving Point Impedance and Signal Flow Graphs (DPI/SFG) method that does not require a-priori insight to the circuit being considered and results in factored analysis supporting the design function. This approach enables designers to account fully for loading and the bi-directional nature of elements both in the feedback path and in the amplifier itself, properties many times assumed negligible and ignored. Feedback circuits a...

  16. Realizing a supercapacitor in an electrical circuit

    Energy Technology Data Exchange (ETDEWEB)

    Fukuhara, Mikio, E-mail: fukuhara@niche.tohoku.ac.jp; Kuroda, Tomoyuki; Hasegawa, Fumihiko [New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579 (Japan)

    2014-11-17

    Capacitors are commonly used in electronic resonance circuits; however, capacitors have not been used for storing large amounts of electrical energy in electrical circuits. Here, we report a superior RC circuit which serves as an electrical storage system characterized by quick charging and long-term discharging of electricity. The improved energy storage characteristics in this mixed electric circuit (R{sub 1} + R{sub 2}C{sub 1}) with small resistor R{sub 1}, large resistor R{sub 2}, and large capacitor C{sub 1} are derived from the damming effect by large R{sub 2} in simple parallel R{sub 2}C{sub 1} circuit. However, no research work has been carried out previously on the use of capacitors as electrical energy storage devices in circuits. Combined with nanotechnology, we hope that our finding will play a remarkable role in a variety of applications such as hybrid electric vehicles and backup power supplies.

  17. Active quenching circuit for a InGaAs single-photon avalanche diode

    International Nuclear Information System (INIS)

    Zheng Lixia; Wu Jin; Xi Shuiqing; Shi Longxing; Liu Siyang; Sun Weifeng

    2014-01-01

    We present a novel gated operation active quenching circuit (AQC). In order to simulate the quenching circuit a complete SPICE model of a InGaAs SPAD is set up according to the I–V characteristic measurement results of the detector. The circuit integrated with aROIC (readout integrated circuit) is fabricated in an CSMC 0.5 μm CMOS process and then hybrid packed with the detector. Chip measurement results show that the functionality of the circuit is correct and the performance is suitable for practical system applications. (semiconductor integrated circuits)

  18. Laser printed interconnects for flexible electronics

    Science.gov (United States)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  19. Printed Spacecraft Separation System

    Energy Technology Data Exchange (ETDEWEB)

    Dehoff, Ryan R [ORNL; Holmans, Walter [Planetary Systems Corporation

    2016-10-01

    In this project Planetary Systems Corporation proposed utilizing additive manufacturing (3D printing) to manufacture a titanium spacecraft separation system for commercial and US government customers to realize a 90% reduction in the cost and energy. These savings were demonstrated via “printing-in” many of the parts and sub-assemblies into one part, thus greatly reducing the labor associated with design, procurement, assembly and calibration of mechanisms. Planetary Systems Corporation redesigned several of the components of the separation system based on additive manufacturing principles including geometric flexibility and the ability to fabricate complex designs, ability to combine multiple parts of an assembly into a single component, and the ability to optimize design for specific mechanical property targets. Shock absorption was specifically targeted and requirements were established to attenuate damage to the Lightband system from shock of initiation. Planetary Systems Corporation redesigned components based on these requirements and sent the designs to Oak Ridge National Laboratory to be printed. ORNL printed the parts using the Arcam electron beam melting technology based on the desire for the parts to be fabricated from Ti-6Al-4V based on the weight and mechanical performance of the material. A second set of components was fabricated from stainless steel material on the Renishaw laser powder bed technology due to the improved geometric accuracy, surface finish, and wear resistance of the material. Planetary Systems Corporation evaluated these components and determined that 3D printing is potentially a viable method for achieving significant cost and savings metrics.

  20. Printing at CERN

    CERN Multimedia

    Otto, R

    2007-01-01

    For many years CERN had a very sophisticated print server infrastructure which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today’s situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer regis...

  1. CERN printing infrastructure

    International Nuclear Information System (INIS)

    Otto, R; Sucik, J

    2008-01-01

    For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all (∼1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration

  2. CERN printing infrastructure

    Energy Technology Data Exchange (ETDEWEB)

    Otto, R; Sucik, J [CERN, Geneva (Switzerland)], E-mail: Rafal.Otto@cern.ch, E-mail: Juraj.Sucik@cern.ch

    2008-07-15

    For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all ({approx}1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration.

  3. Nanosilver conductive lines made by spray coating and aerosol jet printing technique

    Science.gov (United States)

    Krzeminski, Jakub; Wroblewski, Grzegorz; Dybowska-Sarapuk, Lucja; Lepak, Sandra; Jakubowska, Malgorzata

    2017-08-01

    Printing electronics even though the printing techniques are known for a long time, are gaining in importance. The possibility of making the electronic circuits on flexible, big-area substrates with efficient and cheap technology make it attractive for the electronic industry. Spray coating, as a one of printing methods, additionally provide the chance to print on the non-flat, complicated shaped substrates. Despite the spray coating is mostly used to print a big pads, it is reachable to spray the separate conductive lines both as a quickly-produced prototype and as a fully manufactured circuit. Our work presents the directly printed lines with spray coating technique. For the printing process self-made ink was used. We tested three different approaches to line formation and compare them in the terms of line edge, resistivity and thickness. Line profiles provide the information about the roughness and the line size. In the end we showed the aerosol jet printed meander to give an overview of this similar to spray coating but more sophisticated technique.

  4. 3D inkjet printed disposable environmental monitoring wireless sensor node

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-10-24

    We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

  5. RD53A Integrated Circuit Specifications

    OpenAIRE

    Garcia-Sciveres, Mauricio

    2015-01-01

    Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. The wafer scale production will permit the experiments to prototype bump bonding assembly with...

  6. Modular thought in the circuit analysis

    Science.gov (United States)

    Wang, Feng

    2018-04-01

    Applied to solve the problem of modular thought, provides a whole for simplification's method, the complex problems have become of, and the study of circuit is similar to the above problems: the complex connection between components, make the whole circuit topic solution seems to be more complex, and actually components the connection between the have rules to follow, this article mainly tells the story of study on the application of the circuit modular thought. First of all, this paper introduces the definition of two-terminal network and the concept of two-terminal network equivalent conversion, then summarizes the common source resistance hybrid network modular approach, containing controlled source network modular processing method, lists the common module, typical examples analysis.

  7. Computer Security: Printing confidentially

    CERN Document Server

    Stefan Lueders, Computer Security Team

    2015-01-01

    Have you ever hesitated to print a confidential document using CERN printers? Or perhaps you have rushed quickly to the printer after hitting the “print” button in order to avoid someone else getting hold of and reading your document? These times are over now with the new printing infrastructure!   Indeed, many of us regularly print out confidential documents like our salary slips, MARS forms, tendering documents and drafts of preliminary papers. The upcoming CERN data protection policy will require all of us to respect the confidentiality of such documents and, as the word “confidential” implies, access to “confidential” or sensitive documents will be tightly controlled. What can we do about the public printers located in many buildings, floors and shared spaces - accessible not only to CERN staff and users but also to visitors and guests? Some printers are located in the vicinity of restaurants, cafeterias or close to paths taken b...

  8. FDM 3D printed coffee glove embedded with flexible electronic

    KAUST Repository

    Bahri, Meznan

    2017-10-31

    With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.

  9. A low cost and hybrid technology for integrating silicon sensors or actuators in polymer microfluidic systems

    International Nuclear Information System (INIS)

    Charlot, Samuel; Gué, Anne-Marie; Tasselli, Josiane; Marty, Antoine; Abgrall, Patrick; Estève, Daniel

    2008-01-01

    This paper describes a new technology permitting a hybrid integration of silicon chips in polymer (PDMS and SU8) microfluidic structures. This two-step technology starts with transferring the silicon device onto a rigid substrate (typically PCB) and planarizing it, and then it proceeds with stacking of the polymer-made fluidic network onto the device. The technology is low cost, based on screen printing and lamination, can be applied to treat large surface areas, and is compatible with standard photolithography and vacuum based approaches. We show, as an example, the integration of a thermal sensor inside channels made of PDMS or SU8. The developed structures had no fluid leaks at the Si/polymer interfaces and the electrical circuit was perfectly tightproof. (note)

  10. Printed MIMO antenna engineering

    CERN Document Server

    Sharawi, Mohammad S

    2014-01-01

    Wireless communications has made a huge leap during the past two decades. The multiple-input-multiple-output (MIMO) technology was proposed in the 1990's as a viable solution that can overcome the data rate limit experienced by single-input-single-output (SISO) systems. This resource is focused on printed MIMO antenna system design. Printed antennas are widely used in mobile and handheld terminals due to their conformity with the device, low cost, good integration within the device elements and mechanical parts, as well as ease of fabrication.A perfect design companion for practicing engineers

  11. Plasmonic colour laser printing

    DEFF Research Database (Denmark)

    Zhu, Xiaolong; Vannahme, Christoph; Højlund-Nielsen, Emil

    2016-01-01

    -beam lithography (EBL) or focused ion beam (FIB), both expensive and not scalable processes that are not suitable for post-processing customization. Here we show a method of colour printing on nanoimprinted plasmonic metasurfaces using laser post-writing. Laser pulses induce transient local heat generation...... that leads to melting and reshaping of the imprinted nanostructures. Depending on the laser pulse energy density, different surface morphologies that support different plasmonic resonances leading to different colour appearances can be created. Using this technique we can print all primary colours...

  12. Electric circuits and signals

    CERN Document Server

    Sabah, Nassir H

    2007-01-01

    Circuit Variables and Elements Overview Learning Objectives Electric Current Voltage Electric Power and Energy Assigned Positive Directions Active and Passive Circuit Elements Voltage and Current Sources The Resistor The Capacitor The Inductor Concluding Remarks Summary of Main Concepts and Results Learning Outcomes Supplementary Topics on CD Problems and Exercises Basic Circuit Connections and Laws Overview Learning Objectives Circuit Terminology Kirchhoff's Laws Voltage Division and Series Connection of Resistors Current Division and Parallel Connection of Resistors D-Y Transformation Source Equivalence and Transformation Reduced-Voltage Supply Summary of Main Concepts and Results Learning Outcomes Supplementary Topics and Examples on CD Problems and Exercises Basic Analysis of Resistive Circuits Overview Learning Objectives Number of Independent Circuit Equations Node-Voltage Analysis Special Considerations in Node-Voltage Analysis Mesh-Current Analysis Special Conside...

  13. [Shunt and short circuit].

    Science.gov (United States)

    Rangel-Abundis, Alberto

    2006-01-01

    Shunt and short circuit are antonyms. In French, the term shunt has been adopted to denote the alternative pathway of blood flow. However, in French, as well as in Spanish, the word short circuit (court-circuit and cortocircuito) is synonymous with shunt, giving rise to a linguistic and scientific inconsistency. Scientific because shunt and short circuit made reference to a phenomenon that occurs in the field of the physics. Because shunt and short circuit are antonyms, it is necessary to clarify that shunt is an alternative pathway of flow from a net of high resistance to a net of low resistance, maintaining the stream. Short circuit is the interruption of the flow, because a high resistance impeaches the flood. This concept is applied to electrical and cardiovascular physiology, as well as to the metabolic pathways.

  14. Control of Evaporation Behavior of an Inkjet-Printed Dielectric Layer Using a Mixed-Solvent System

    Science.gov (United States)

    Yang, Hak Soon; Kang, Byung Ju; Oh, Je Hoon

    2016-01-01

    In this study, the evaporation behavior and the resulting morphology of inkjet-printed dielectric layers were controlled using a mixed-solvent system to fabricate uniform poly-4-vinylphenol (PVP) dielectric layers without any pinholes. The mixed-solvent system consisted of two different organic solvents: 1-hexanol and ethanol. The effects of inkjet-printing variables such as overlap condition, substrate temperature, and different printing sequences (continuous and interlacing printing methods) on the inkjet-printed dielectric layer were also investigated. Increasing volume fraction of ethanol (VFE) is likely to reduce the evaporation rate gradient and the drying time of the inkjet-printed dielectric layer; this diminishes the coffee stain effect and thereby improves the uniformity of the inkjet-printed dielectric layer. However, the coffee stain effect becomes more severe with an increase in the substrate temperature due to the enhanced outward convective flow. The overlap condition has little effect on the evaporation behavior of the printed dielectric layer. In addition, the interlacing printing method results in either a stronger coffee stain effect or wavy structures of the dielectric layers depending on the VFE of the PVP solution. All-inkjet-printed capacitors without electrical short circuiting can be successfully fabricated using the optimized PVP solution (VFE = 0.6); this indicates that the mixed-solvent system is expected to play an important role in the fabrication of high-quality inkjet-printed dielectric layers in various printed electronics applications.

  15. Analog circuits cookbook

    CERN Document Server

    Hickman, Ian

    2013-01-01

    Analog Circuits Cookbook presents articles about advanced circuit techniques, components and concepts, useful IC for analog signal processing in the audio range, direct digital synthesis, and ingenious video op-amp. The book also includes articles about amplitude measurements on RF signals, linear optical imager, power supplies and devices, and RF circuits and techniques. Professionals and students of electrical engineering will find the book informative and useful.

  16. Analog circuit design

    CERN Document Server

    Dobkin, Bob

    2012-01-01

    Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. The book's in-depth application examples provide insight into circuit design and application solutions that you can apply in today's demanding designs. <

  17. Regenerative feedback resonant circuit

    Science.gov (United States)

    Jones, A. Mark; Kelly, James F.; McCloy, John S.; McMakin, Douglas L.

    2014-09-02

    A regenerative feedback resonant circuit for measuring a transient response in a loop is disclosed. The circuit includes an amplifier for generating a signal in the loop. The circuit further includes a resonator having a resonant cavity and a material located within the cavity. The signal sent into the resonator produces a resonant frequency. A variation of the resonant frequency due to perturbations in electromagnetic properties of the material is measured.

  18. Advances in Home Photo Printing

    Institute of Scientific and Technical Information of China (English)

    Qian Lin; Brian Atkins; Huitao Luo

    2004-01-01

    With digital camera adoptions going main stream, consumers capture a record number of photos.Currently, the majority of the digital photos are printed at home. One of the key enablers of this transformation is the advancement of home photo printing technologies. In the past few years, inkjet printing technologies have continued to deliver smaller drop size, larger number of inks, and longer-lasting prints. In the mean time, advanced image processing automatically enhances captured digital photos while being printed. The combination of the above two forces has closed the gap between the home photo prints and AgX prints. It will give an overview of the home photo printing market and technology trends, and discuss major advancements in automatic image processing.

  19. A flexible inkjet printed inverted-F antenna on textile

    KAUST Repository

    Karimi, Muhammad Akram; Shamim, Atif

    2016-01-01

    This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

  20. A flexible inkjet printed inverted-F antenna on textile

    KAUST Repository

    Karimi, Muhammad Akram

    2016-12-19

    This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.