WorldWideScience

Sample records for hybrid printed circuit

  1. Printed circuit board industry.

    Science.gov (United States)

    LaDou, Joseph

    2006-05-01

    The printed circuit board is the platform upon which microelectronic components such as semiconductor chips and capacitors are mounted. It provides the electrical interconnections between components and is found in virtually all electronics products. Once considered low technology, the printed circuit board is evolving into a high-technology product. Printed circuit board manufacturing is highly complicated, requiring large equipment investments and over 50 process steps. Many of the high-speed, miniaturized printed circuit boards are now manufactured in cleanrooms with the same health and safety problems posed by other microelectronics manufacturing. Asia produces three-fourths of the world's printed circuit boards. In Asian countries, glycol ethers are the major solvents used in the printed circuit board industry. Large quantities of hazardous chemicals such as formaldehyde, dimethylformamide, and lead are used by the printed circuit board industry. For decades, chemically intensive and often sloppy manufacturing processes exposed tens of thousands of workers to a large number of chemicals that are now known to be reproductive toxicants and carcinogens. The printed circuit board industry has exposed workers to high doses of toxic metals, solvents, acids, and photolithographic chemicals. Only recently has there been any serious effort to diminish the quantity of lead distributed worldwide by the printed circuit board industry. Billions of electronics products have been discarded in every region of the world. This paper summarizes recent regulatory and enforcement efforts.

  2. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  3. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  4. Printed hybrid systems

    Science.gov (United States)

    Karioja, Pentti; Mäkinen, Jukka-Tapani; Keränen, Kimmo; Aikio, Janne; Alajoki, Teemu; Jaakola, Tuomo; Koponen, Matti; Keränen, Antti; Heikkinen, Mikko; Tuomikoski, Markus; Suhonen, Riikka; Hakalahti, Leena; Kopola, Pälvi; Hast, Jukka; Liedert, Ralf; Hiltunen, Jussi; Masuda, Noriyuki; Kemppainen, Antti; Rönkä, Kari; Korhonen, Raimo

    2012-04-01

    This paper presents research activities carried out at VTT Technical Research Centre of Finland in the field of hybrid integration of optics, electronics and mechanics. Main focus area in our research is the manufacturing of electronic modules and product structures with printed electronics, film-over-molding and polymer sheet lamination technologies and the goal is in the next generation of smart systems utilizing monolithic polymer packages. The combination of manufacturing technologies such as roll-to-roll -printing, injection molding and traditional component assembly is called Printed Hybrid Systems (PHS). Several demonstrator structures have been made, which show the potential of polymer packaging technology. One demonstrator example is a laminated structure with embedded LED chips. Element thickness is only 0.3mm and the flexible stack of foils can be bent in two directions after assembly process and was shaped curved using heat and pressure. The combination of printed flexible circuit boards and injection molding has also been demonstrated with several functional modules. The demonstrators illustrate the potential of origami electronics, which can be cut and folded to 3D shapes. It shows that several manufacturing process steps can be eliminated by Printed Hybrid Systems technology. The main benefits of this combination are small size, ruggedness and conformality. The devices are ideally suited for medical applications as the sensitive electronic components are well protected inside the plastic and the structures can be cleaned easily due to the fact that they have no joints or seams that can accumulate dirt or bacteria.

  5. Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

    Science.gov (United States)

    Arrese, J.; Vescio, G.; Xuriguera, E.; Medina-Rodriguez, B.; Cornet, A.; Cirera, A.

    2017-03-01

    Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature (˜150 °C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique.

  6. Hybrid printed electronics

    NARCIS (Netherlands)

    Koetse, M.; Smits, E.; Rubingh, E.; Teunissen, P.; Kusters, R.; Abbel, R.; Brand, J. van den

    2016-01-01

    Although many electronic functionalities can be realized by printed or organic electronics, short-term marketable products often require robust, reproducible, and nondisturbing technologies. In this chapter we show how hybrid electronics, a combination of printed circuitry, thin-film electronics,

  7. Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

    Science.gov (United States)

    Zheng, Yi; He, Zhizhu; Gao, Yunxia; Liu, Jing

    2013-05-01

    There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidized alloy ink was demonstrated to be flexibly printed on coated paper, which could compose various functional electronics and the concept of Printed-Circuits-on-Paper was thus presented. Further, RTV silicone rubber was adopted as isolating inks and packaging material to guarantee the functional stability of the circuit, which suggests an approach for printing 3D hybrid electro-mechanical device. The present work paved the way for a low cost and easygoing method in directly printing paper electronics.

  8. Flexible composite film for printed circuit board

    Science.gov (United States)

    Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

    1982-01-01

    A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

  9. A guide to printed circuit board design

    CERN Document Server

    Hamilton, Charles

    1984-01-01

    A Guide to Printed Circuit Board Design discusses the basic design principles of printed circuit board (PCB). The book consists of nine chapters; each chapter provides both text discussion and illustration relevant to the topic being discussed. Chapter 1 talks about understanding the circuit diagram, and Chapter 2 covers how to compile component information file. Chapter 3 deals with the design layout, while Chapter 4 talks about preparing the master artworks. The book also covers generating computer aided design (CAD) master patterns, and then discusses how to prepare the production drawing a

  10. Pyrolysis of Waste Printed Circuit Board Particles

    OpenAIRE

    Şule Atasever; Pınar A. Bozkurt; Muammer Canel

    2015-01-01

    Electrical and electronic apparatus and instruments which are obsolete value in use or completion of the life can be defined as e-waste. E-waste is one of the fastest growing types of hazardous waste. Printed circuit boards a major component of this waste. In this study, printed circuit board particles of mobile phone (MPCB) were used as electronic waste. MPCB waste was obtained from a local electronic waste factory. The elemental analysis and ICP-MS analysis were performed on these electroni...

  11. Vacuum pyrolysis of waste print circuit board

    Institute of Scientific and Technical Information of China (English)

    GAN Ge; CHEN Lie-qiang; PENG Shao-hong; CAI Ming-zhao

    2005-01-01

    Waste print circuit board containing 11.38% Br was pyrolyzed in vacuum.Thermal stability of waste print circuit board was studied under vacuum condition by thermo-gravimetry(TG). Vacuum pyrolysis of WPCB was studied emphasizing on the kinetics of WPCB pyrolysis reactions. Based on the TG results, a kinetic model was proposed. Kinetic parameters were calculated for reaction with this model including all stages of decomposition. The average activation energy is 68 k J/mol with reaction order 3. These findings provide new insights into the WPCB thermal decomposition and useful data for rational design and operation of pyrolysis.

  12. Slow light on a printed circuit board.

    Science.gov (United States)

    Lanin, Aleksandr A; Voronin, Aleksandr A; Sokolov, Viktor I; Fedotov, Ilya V; Fedotov, Andrei B; Akhmanov, Aleksandr S; Panchenko, Vladislav Ya; Zheltikov, Aleksei M

    2011-05-15

    Slow-light effects induced by stimulated Raman scattering in polymer waveguides on a printed circuit board are shown to enable a widely tunable delay of broadband optical signals, suggesting an advantageous platform for optical information processing and ultrafast optical waveform transformation. © 2011 Optical Society of America

  13. Improving Heat Transfer Performance of Printed Circuit Boards

    Science.gov (United States)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  14. Improving Heat Transfer Performance of Printed Circuit Boards

    Science.gov (United States)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  15. Printed Circuit Board Design with HDL Designer

    Science.gov (United States)

    Winkert, Thomas K.; LaFourcade, Teresa

    2004-01-01

    Staying up to date with the latest CAD tools both from a cost and time perspective is difficult. Within a given organization there may be experts in Printed Circuit Board Design tools and experts in FPGA/VHDL tools. Wouldn't it be great to have someone familiar with HDL Designer be able to design PCBs without having to learn another tool? This paper describes a limited experiment to do this.

  16. Additive Manufacturing of Hybrid Circuits

    Science.gov (United States)

    Sarobol, Pylin; Cook, Adam; Clem, Paul G.; Keicher, David; Hirschfeld, Deidre; Hall, Aaron C.; Bell, Nelson S.

    2016-07-01

    There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

  17. Optical system facilitates inspection of printed circuit boards

    Science.gov (United States)

    Cridlin, M.; Oconnor, J.

    1968-01-01

    Optical comparator method determines the quality and registration of surface features of double-sided printed circuit boards. Color-coded superimposed images of both sides of a printed circuit board are presented to view, clearly showing details and registration of the circuitry.

  18. Waste Printed Circuit Board (PCB) Recycling Techniques.

    Science.gov (United States)

    Ning, Chao; Lin, Carol Sze Ki; Hui, David Chi Wai; McKay, Gordon

    2017-04-01

    With the development of technologies and the change of consumer attitudes, the amount of waste electrical and electronic equipment (WEEE) is increasing annually. As the core part of WEEE, the waste printed circuit board (WPCB) is a dangerous waste but at the same time a rich resource for various kinds of materials. In this work, various WPCB treatment methods as well as WPCB recycling techniques divided into direct treatment (landfill and incineration), primitive recycling technology (pyrometallurgy, hydrometallurgy, biometallurgy and primitive full recovery of NMF-non metallic fraction), and advanced recycling technology (mechanical separation, direct use and modification of NMF) are reviewed and analyzed based on their advantages and disadvantages. Also, the evaluation criteria are discussed including economic, environmental, and gate-to-market ability. This review indicates the future research direction of WPCB recycling should focus on a combination of several techniques or in series recycling to maximize the benefits of process.

  19. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    Science.gov (United States)

    Andersson, Henrik A.; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  20. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    Science.gov (United States)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  1. Printed organic thin-film transistor-based integrated circuits

    Science.gov (United States)

    Mandal, Saumen; Noh, Yong-Young

    2015-06-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted.

  2. Printed circuits and their applications: Which way forward?

    Science.gov (United States)

    Cantatore, E.

    2015-09-01

    The continuous advancements in printed electronics make nowadays feasible the design of printed circuits which enable meaningful applications. Examples include ultra-low cost sensors embedded in food packaging, large-area sensing surfaces and biomedical assays. This paper offers an overview of state-of-the-art digital and analog circuit blocks, manufactured with a printed complementary organic TFT technology. An analog to digital converter and an RFID tag implemented exploiting these building blocks are also described. The main remaining drawbacks of the printed technology described are identified, and new approaches to further improve the state of the art, enabling more innovative applications are discussed.

  3. Standards for compatibility of printed circuit and component lead materials

    Science.gov (United States)

    1968-01-01

    Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.

  4. A new low-expansion nonflammable printed circuit board

    Science.gov (United States)

    Kennedy, B. W.

    1970-01-01

    Printed circuit board has a thermal coefficient of expansion similar to that of the electronic component leads. High-expansion composite materials are sandwiched between the outer layers of copper and woven fiber glass.

  5. Isolation of Battery Chargers Integrated Into Printed Circuit Boards

    Energy Technology Data Exchange (ETDEWEB)

    Sullivan, James S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2013-11-21

    Present test procedures developed by the Federal Government (10 CFR Part 430 “Energy Conservation Program for Consumer Products”) to measure the energy consumption of battery chargers provide no method for the isolation of input power for battery chargers that have been integrated into printed circuit boards internal to electronic equipment. This prevents the measurement of Standby and Off Mode energy consumption. As a result, the energy consumption of battery chargers integrated into the printed circuit board cannot be measured.

  6. Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

    OpenAIRE

    Yi Zheng; Zhizhu He; Yunxia Gao; Jing Liu

    2013-01-01

    There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidize...

  7. Laser Integration on Silicon Photonic Circuits Through Transfer Printing

    Science.gov (United States)

    2017-03-10

    AFRL-AFOSR-UK-TR-2017-0019 Laser integration on silicon photonic circuits through transfer printing Gunther Roelkens UNIVERSITEIT GENT VZW Final...TYPE Final 3. DATES COVERED (From - To) 15 Sep 2015 to 14 Sep 2016 4. TITLE AND SUBTITLE Laser integration on silicon photonic circuits through...parallel integration of III-V lasers on silicon photonic integrated circuits. The report discusses the technological process that has been developed as

  8. Rapid Laser Printing of Paper-Based Multilayer Circuits.

    Science.gov (United States)

    Huang, Gui-Wen; Feng, Qing-Ping; Xiao, Hong-Mei; Li, Na; Fu, Shao-Yun

    2016-09-27

    Laser printing has been widely used in daily life, and the fabricating process is highly efficient and mask-free. Here we propose a laser printing process for the rapid fabrication of paper-based multilayer circuits. It does not require wetting of the paper, which is more competitive in manufacturing paper-based circuits compared to conventional liquid printing process. In the laser printed circuits, silver nanowires (Ag-NWs) are used as conducting material for their excellent electrical and mechanical properties. By repeating the printing process, multilayer three-dimensional (3D) structured circuits can be obtained, which is quite significant for complex circuit applications. In particular, the performance of the printed circuits can be exactly controlled by varying the process parameters including Ag-NW content and laminating temperature, which offers a great opportunity for rapid prototyping of customized products with designed properties. A paper-based high-frequency radio frequency identification (RFID) label with optimized performance is successfully demonstrated. By adjusting the laminating temperature to 180 °C and the top-layer Ag-NW areal density to 0.3 mg cm(-2), the printed RFID antenna can be conjugately matched with the chip, and a big reading range of ∼12.3 cm with about 2.0 cm over that of the commercial etched Al antenna is achieved. This work provides a promising approach for fast and quality-controlled fabrication of multilayer circuits on common paper and may be enlightening for development of paper-based devices.

  9. An inktjet printing-based process chain for conductive structures on printed circuit board materials

    NARCIS (Netherlands)

    Sridhar, Ashok

    2010-01-01

    A process chain to fabricate conductive structures on printed circuit board material is presented in this thesis. This process chain comprises four main steps: plasma treatment, inkjet printing, electroless plating and functional characterisation. It represents a drastic reduction in the number of

  10. 40 CFR 413.80 - Applicability: Description of the printed circuit board subcategory.

    Science.gov (United States)

    2010-07-01

    ... printed circuit board subcategory. 413.80 Section 413.80 Protection of Environment ENVIRONMENTAL... Circuit Board Subcategory § 413.80 Applicability: Description of the printed circuit board subcategory. The provisions of this subpart apply to the manufacture of printed circuit boards, including all...

  11. Fabrication of Transparent Multilayer Circuits by Inkjet Printing.

    Science.gov (United States)

    Jiang, Jieke; Bao, Bin; Li, Mingzhu; Sun, Jiazhen; Zhang, Cong; Li, Yang; Li, Fengyu; Yao, Xi; Song, Yanlin

    2016-02-17

    Conductive microcables embedded in a transparent film are fabricated by inkjet printing silver-nanoparticle ink into a liquid poly(dimethylsiloxane) (PDMS) precursor substrate. By controlling the spreading of the ink droplet and the rheological properties of the liquid substrate, transparent multilayer circuits composed of high-resolution embedded cables are achieved using a commercial inkjet printer. This facile strategy provides a new avenue for inkjet printing of highly integrated and transparent electronics.

  12. Research on dynamic model of printed circuit board based on finite element method

    Science.gov (United States)

    Wei, Hui; Xu, Liangjun

    2017-08-01

    The vibration characteristics of printed circuit boards are related to the reliability of electronic components installed on their surface. Finite element software is a powerful tool to analyze the vibration characteristics of printed circuit boards, and the correct establishment of finite element model is very important. In this paper, the dynamic model of anisotropic printed circuit board is established by analyzing the material properties of printed circuit board. The influence of boundary condition and lumped mass on the vibration characteristics of printed circuit board is analyzed. In order to establish a more realistic printed circuit The finite element model of the plate provides the necessary basis.

  13. A self-aligned approach to printed circuits (Conference Presentation)

    Science.gov (United States)

    Frisbie, C. Daniel

    2016-09-01

    Printed electronics has a number of significant challenges, including spatial resolution, pattern registration, and printed circuit performance. In this talk, I will describe a multi-pronged approach to address these challenges that may bring roll-to-roll printed electronics closer to reality. To begin, I will show that innovations in materials allow the fabrication of printable, low voltage thin film transistors (TFTs), the key building blocks of flexible circuits, and that these can be incorporated into simple printed circuit demonstrations involving two dozen TFTs and an equivalent number of printed resistors and capacitors. The second half of the talk will describe a novel liquid-based fabrication approach that we term SCALE, or Self-Aligned Capillarity-Assisted Lithography for Electronics. The SCALE process employs a combination of digital printing and in-substrate capillary flow to produce self-aligned devices with feature sizes that are currently as small as 1 micron. The talk will finish with a discussion of the new opportunities in flexible microelectronics afforded by liquid-based processing.

  14. Development and verification of printed circuit board toroidal transformer model

    DEFF Research Database (Denmark)

    Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

    2013-01-01

    by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations......An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...

  15. A tool for errors detection in printed circuit boards production

    OpenAIRE

    A. de Luca Pennacchia; L. G. de la Fraga; U. Martínez Hernández

    2009-01-01

    The progressive implementation of software functions in Integrated Circuits (ICs) has considerably increased the number of transistors and pin connections of ICs. For that reason, Printed Circuit Boards (PCBs) are fabricated with the Surface Mount Technology (SMT) nowadays and IC mounting on PCB is a crucial process that requires high precision. An Automatic Mechanical Montage (AMM) system is used to mount ICs on the sockets using a couple of reference points for every IC in order to find the...

  16. Terminal Strip Facilitates Printed-Circuit Board Changes

    Science.gov (United States)

    Pinto, E. A.; Mcosker, C. E.

    1983-01-01

    Laminanted copper and polyimide terminal strip makes it easy to modify printed-circuit (PC) board, after board has been fabricated. When epoxied over conductors or insulating portion of PC board, strip provides series of solder-coated copper conductor pads to which integrated-circuit leads are soldered for functional changes. Terminal strips accommodate leads on dual inline IC package or as staggered single or multiple leads on planar mounted flatpacks.

  17. 75 FR 28656 - Amphenol Printed Circuits, Inc., a Subsidiary of Amphenol Corporation, Including On-Site Leased...

    Science.gov (United States)

    2010-05-21

    ... Employment and Training Administration Amphenol Printed Circuits, Inc., a Subsidiary of Amphenol Corporation... at Amphenol Printed Circuits, Inc., a subsidiary of Amphenol Corporation, Nashua, New Hampshire. The... Hampshire, location of Amphenol Printed Circuits, Inc., a subsidiary of Amphenol Corporation. The...

  18. Printed circuits. Citations from the NTIS data base

    Science.gov (United States)

    Reed, W. E.

    1980-04-01

    The design, fabrication, testing, and applications of printed circuits are presented in these citations of Federally-sponsored research reports. Research on computer aided design, soldering, etching, plating, photolithography, and materials are cited. This updated bibliography contains 175 abstracts, 41 of which are new entries to the previous edition.

  19. Merging polygons on two-layer printed circuit board

    Directory of Open Access Journals (Sweden)

    Murov S. Yu.

    2011-12-01

    Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

  20. Biodegradable materials for multilayer transient printed circuit boards.

    Science.gov (United States)

    Huang, Xian; Liu, Yuhao; Hwang, Suk-Won; Kang, Seung-Kyun; Patnaik, Dwipayan; Cortes, Jonathan Fajardo; Rogers, John A

    2014-11-19

    Biodegradable printed circuit boards based on water-soluble materials are demonstrated. These systems can dissolve in water within 10 mins to yield end-products that are environmentally safe. These and related approaches have the potential to reduce hazardous waste streams associated with electronics disposal. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. Printed circuit board permittivity measurement using waveguide and resonator rings

    NARCIS (Netherlands)

    Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

    2014-01-01

    Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

  2. Testing of printed circuit board solder joints by optical correlation

    Science.gov (United States)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  3. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    Science.gov (United States)

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  4. Printed circuit boards: a review on the perspective of sustainability.

    Science.gov (United States)

    Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

    2013-12-15

    Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. Copyright © 2013 Elsevier Ltd. All rights reserved.

  5. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    2012-01-01

    implemented as solenoids, either in spiral or cylindrical form. Those have the disadvantage of excessive stray fields, which can cause losses and disturbances in adjacent circuitry. Therefore this paper presents the analysis, design and realization of a printed circuit board (PCB) integrated inductor under...

  6. Variants of Topology Editing Strategy in the Subsystem of Printed Circuit Boards Manufacturability Improvement

    OpenAIRE

    Roman Panchak; Konstantyn Kolesnyk; Marian Lobur

    2011-01-01

    This paper focuses on the variants of printed circuit boards topology editing strategies implemented in the subsystem of automatic printed circuit boards topology editing. Depending on the requirements for printed circuit board topology, a subsystem user can create variants of editing strategies in order to minimize the amount of the technologically justified places with a minimum clearance between the elements of the topology.

  7. Effective electromagnetic shielding in multilayer printed circuit boards

    Science.gov (United States)

    Wiles, K. G.; Moe, J. L.

    Multilayer printed circuit boards have proven to be recurrent abettors of electromagnetic coupling problems created by the incessantly faster response times in integrated circuit technologies. Coupling within multilayer boards has not only inhibited meeting certain EMI requirements but has also precipitated 'self-inflicted' malfunctions commonly experienced during development of avionic systems. A recent avionic system, interfacing two asynchronous processors through a fourteen-layer motherboard, permitted coupling through ground plane connector apertures of sufficient amplitude and duration as to cause unintentional intercommunication and system malfunctions. The coupling mechanism and ground plane modifications which reduced this coupling by 40 dB and eliminated the incompatibility are discussed in this paper

  8. WASTE PRINTED CIRCUIT BOARDS SEPARATION IN ELECTROSTATIC SEPARATOR

    Directory of Open Access Journals (Sweden)

    Branimir Fuk

    2012-12-01

    Full Text Available Printed circuit boards from electronic waste are very important source of precious metals by recycling. The biggest challenge is liberation and separation of useful components; thin film which contains copper, zinc, tin, lead and precious metals like silver, gold and palladium from non useful components; polymers, ceramics and glass fibbers. The paper presents results for separation of shredded printed circuit boards from TV sets in electrostatic separator. Testing where conducted with material class 2/1 and 1/0.5 mm in laboratory on equipment for mineral processing. Results showed influence from independent variable; separation knife gradient, drum rotation speed and voltage on concentrate quality and recovery (the paper is published in Croatian.

  9. Improving intrinsic corrosion reliability of printed circuit board assembly

    DEFF Research Database (Denmark)

    Ambat, Rajan; Conseil, Helene

    2016-01-01

    Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....... conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...

  10. Sliding contacts on printed circuit boards and wear behavior

    OpenAIRE

    Le Solleu, J.-P.

    2010-01-01

    Abstract Automotive suppliers use since decades printed circuit boards (PCB) gold plating pads, as direct contact interface for low current sliding contacts. Several gold plating processes are available on the market, providing various wear behaviour. Some specific galvanic hard gold (AuCo or AuNi). plating was developed on PCB's. This specific plating generates extra costs due to the material quantity and also the process complexity. In a cost driven indust...

  11. Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

    Directory of Open Access Journals (Sweden)

    V.C. Ho

    2003-01-01

    Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

  12. Separation and recovery of materials from scrap printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Hall, William J.; Williams, Paul T. [Energy and Resources Research Institute, The University of Leeds, Leeds LS2 9JT (United Kingdom)

    2007-09-15

    Printed circuit boards from waste computers, televisions, and mobile phones were pyrolysed in a fixed bed reactor with the aim of separating and recovering the organic and metallic materials. A selection of printed circuit boards from each of the three waste classes was pyrolysed at 800 C and the pyrolysis products were analysed using GC-FID, GC-TCD, GC-MS, GC-ECD, ICP-MS, and SEM-EDX. The pyrolysis oils contained high concentrations of phenol, 4-(1-methylethyl)phenol, and p-hydroxyphenol, as well as bisphenol A, tetrabromobisphenol A, methyl phenols, and bromophenols. The pyrolysis oils also contained significant concentrations of organo-phosphate compounds and a number of tetrabromobisphenol A pyrolysis products were also identified. The pyrolysis residues were very friable and the organic, glass fibre, and metallic fractions could easily be separated and the electrical components could easily be removed from the remains of the printed circuit boards. The ash in the residue mainly consisted of copper, calcium, iron, nickel, zinc, and aluminium, as well as lower concentrations of valuable metals such as gallium, bismuth, silver, and gold, silver was present in particularly high concentrations. Many other metals were also identified in the ash by ICP-MS and SEM EDX. The pyrolysis gases mainly consisted of CO{sub 2} and CO but all of the C{sub 1}-C{sub 4} alkanes and alkenes were present, as were some inorganic halogens. (author)

  13. A Novel Technique to Perform Plating on Printed Circuit Board

    Directory of Open Access Journals (Sweden)

    S. Jayapoorani

    2011-01-01

    Full Text Available Problem statement: This research attempts to optimize the parameters for pulse plating of silver on printed circuit board. The idea here is to use pulse plating technique which is metal deposition by pulsed electrolysis method. Approach: Printed Circuit Boards (PCB plays a major role in all communication and electronics industry. Silver is a ductile and malleable metal which has 7% higher conductivity than copper. Here the electro deposit is influenced by current density, silver concentration in the bath, applied current type. Pulse plating technique is used in double sided printed circuit board especially in the case of plated through hole technique. Here exist a necessity to do plating which will deposit a metal wall in the substrate and it will connect between the components. Results: This method of pulse plating proves that it avoids the disadvantage of rough deposition that is caused due to DC plating in PCB's. Conclusion: The surface morphology and the grain size is measured using XRD analysis and it proves that the number of pin holes is reduced.

  14. High-performance organic transistors for printed circuits

    Science.gov (United States)

    Takeya, J.

    2014-10-01

    This presentation focuses on recent development of key technologies for printed LSIs which can provide future low-cost platforms for RFID tags, AD converters, data processors, and sensing circuitries. Such prospect bears increasing reality because of recent research innovations in the field of material chemistry, charge transport physics, and solution processes of printable organic semiconductors. Achieving band transport in state-of-the-art printable organic semiconductors, carrier mobility is elevated above 15 cm2/Vs, so that reasonable speed in moderately integrated logic circuits can be available. With excellent chemical and thermal stability for such compounds, we are developing simple integrated devices based on CMOS using p-type and n-type printed organic FETs. Particularly important are new processing technologies for continuous growth of inch-size organic single-crystalline semiconductor "wafers" from solution and for lithographical patterning of semiconductors and metal electrodes. Successful rectification and identification are demonstrated at 13.56 MHz with printed organic CMOS circuits for the first time.

  15. Development of manufacturing technologies of printed circuits at the Mining Electronics Plant

    Energy Technology Data Exchange (ETDEWEB)

    Banas, J.; Giglok, M.; Skalski, Z. (Zaklad Elektroniki Gorniczej, Tychy (Poland))

    1989-12-01

    Discusses development of printed circuit manufacturing by the Mining Electronics Plant in Tychy. The circuits are used in control equipment and computerized control systems for underground black coal mining in Poland. The following aspects of circuit manufacturing are evaluated: design of printed circuits, materials used for circuit manufacturing (copper), manufacturing technologies, licenses and know-how, quality requirements, quality assurance and quality control, reliability, safety.

  16. Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

    Science.gov (United States)

    Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

    2017-07-05

    When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe2O3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

  17. Simulation of INPE's printed circuit laboratory production line

    Science.gov (United States)

    Torgogomes, Arthur

    1988-05-01

    The development of a tool intended to improve, plan, monitor, and control INPE's Printed Circuit Laboratory Production Line is presented. A manipulatable computer model was developed. The model simulates the behavior of the production line elements, when established demand is given. A discrete simulation model of stochastic nature was created departing from study and comprehension of technical and operational characteristics. The system was modeled encompassing physical and chronological dimensions. The computer model utilizes the GASP 4 language simulation. The source program for this language was worked out to make possible such an application. The model was tested and proved operational in a 6800 Burroughs computer. The major significant results that the model provides information on necessary time between an order placed with the Laboratory and the final product ready for delivery to the client; also statistics of waiting time elapsed and starting time for production. Currently, this program is operational. It is being successfully utilized by INPE's Printed Laboratory Production Line.

  18. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

    Science.gov (United States)

    Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2011-12-01

    This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers.

  19. Mass analysis of the components separated from printed circuit boards

    Directory of Open Access Journals (Sweden)

    Hana Charvátová

    2010-06-01

    Full Text Available Methods of effective and ecological recycling of printed circuit boards (PCBs are searched all over the world at this time.The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thispurpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulatedmathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plasticelements. We present the obtained results in this paper.

  20. Microfluidic networks embedded in a printed circuit board

    Science.gov (United States)

    Dong, Liangwei; Hu, Yueli

    2017-07-01

    In order to improve the robustness of microfluidic networks in printed circuit board (PCB)-based microfluidic platforms, a new method was presented. A pattern in a PCB was formed using hollowed-out technology. Polydimethylsiloxane was partly filled in the hollowed-out fields after mounting an adhesive tape on the bottom of the PCB, and solidified in an oven. Then, microfluidic networks were built using soft lithography technology. Microfluidic transportation and dilution operations were demonstrated using the fabricated microfluidic platform. Results show that this method can embed microfluidic networks into a PCB, and microfluidic operations can be implemented in the microfluidic networks embedded into the PCB.

  1. A tool for errors detection in printed circuit boards production

    Directory of Open Access Journals (Sweden)

    A. de Luca Pennacchia

    2009-04-01

    Full Text Available The progressive implementation of software functions in Integrated Circuits (ICs has considerably increased the number oftransistors and pin connections of ICs. For that reason, Printed Circuit Boards (PCBs are fabricated with the Surface MountTechnology (SMT nowadays and IC mounting on PCB is a crucial process that requires high precision. An Automatic MechanicalMontage (AMM system is used to mount ICs on the sockets using a couple of reference points for every IC in order to find thecorrect positions for mounting the IC. Due to some factors in the process of PCB development, there are differences betweendesigned and manufactured PCBs, which could generate delays in their production. In this work, a software tool which allows towork with digital images of PCBs is described. This tool finds the differences generated in PCB development, especially thedifferences in IC reference points using Digital Image Processing (DIP techniques.

  2. Packaging printed circuit boards: A production application of interactive graphics

    Science.gov (United States)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  3. [Flexible print circuit technology application in biomedical engineering].

    Science.gov (United States)

    Jiang, Lihua; Cao, Yi; Zheng, Xiaolin

    2013-06-01

    Flexible print circuit (FPC) technology has been widely applied in variety of electric circuits with high precision due to its advantages, such as low-cost, high specific fabrication ability, and good flexibility, etc. Recently, this technology has also been used in biomedical engineering, especially in the development of microfluidic chip and microelectrode array. The high specific fabrication can help making microelectrode and other micro-structure equipment. And good flexibility allows the micro devices based on FPC technique to be easily packaged with other parts. In addition, it also reduces the damage of microelectrodes to the tissue. In this paper, the application of FPC technology in biomedical engineering is introduced. Moreover, the important parameters of FPC technique and the development trend of prosperous applications is also discussed.

  4. Evaluating waste printed circuit boards recycling: Opportunities and challenges, a mini review.

    Science.gov (United States)

    Awasthi, Abhishek Kumar; Zlamparet, Gabriel Ionut; Zeng, Xianlai; Li, Jinhui

    2017-04-01

    Rapid generation of waste printed circuit boards has become a very serious issue worldwide. Numerous techniques have been developed in the last decade to resolve the pollution from waste printed circuit boards, and also recover valuable metals from the waste printed circuit boards stream on a large-scale. However, these techniques have their own certain specific drawbacks that need to be rectified properly. In this review article, these recycling technologies are evaluated based on a strength, weaknesses, opportunities and threats analysis. Furthermore, it is warranted that, the substantial research is required to improve the current technologies for waste printed circuit boards recycling in the outlook of large-scale applications.

  5. Sequential Multiple Response Optimization for Manufacturing Flexible Printed Circuit

    Directory of Open Access Journals (Sweden)

    Pichpimon Kanchanasuttisang

    2012-01-01

    Full Text Available Problem statement: Flexible Printed Circuit or FPC, one of automotive electronic parts, has been developed for lighting automotive vehicles by assembling with the LED. The quality performances or responses of lighting vehicles are relied on the circuit width of an FPC and the etched rate of acid solution. According to the current operating condition of an FPC company, the capability of the manufacturing process is under the company requirement. The standard deviation of FPC circuit widths is at higher levels and the mean is also worse than specifications. Approach: In this process improvement there was four sequential steps based on the designed experiments, steepest descent and interchangeable linear constrained response surface optimization or IC-LCRSOM. An investigation aims to determine the preferable levels of significant process variables affecting multiple responses. Results: The new settings from the IC-LCRSOM improved all performance measures in terms of both the mean and the standard deviation on all process patterns. Conclusion: From this sequential optimization the developed mathematical model has tested for adequacy using analysis of variance and other adequacy measures. In the actual investigation, the new operating conditions lead to higher levels of the etched rate and process capability including lower levels of the standard deviation of the circuit widths and etched rate when compared.

  6. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mitra, Kalyan Yoti, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de; Sowade, Enrico, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Martínez-Domingo, Carme [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra, Spain and Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Ramon, Eloi, E-mail: eloi.ramon@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Carrabina, Jordi, E-mail: jordi.carrabina@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Gomes, Henrique Leonel, E-mail: hgomes@ualg.pt [Universidade do Algarve, Institute of Telecommunications, Faro (Portugal); Baumann, Reinhard R., E-mail: reinhard.baumann@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Fraunhofer Institute for Electronic Nano Systems (ENAS), Department of Printed Functionalities, Chemnitz (Germany)

    2015-02-17

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

  7. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    Science.gov (United States)

    Mitra, Kalyan Yoti; Sowade, Enrico; Martínez-Domingo, Carme; Ramon, Eloi; Carrabina, Jordi; Gomes, Henrique Leonel; Baumann, Reinhard R.

    2015-02-01

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as "Bridging Platform". This transfer to "Bridging Platform" from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

  8. Hybrid quantum circuit with implanted erbium ions

    Energy Technology Data Exchange (ETDEWEB)

    Probst, S.; Rotzinger, H.; Tkalčec, A. [Physikalisches Institut, Karlsruhe Institute of Technology, D-76128 Karlsruhe (Germany); Kukharchyk, N.; Wieck, A. D. [Angewandte Festkörperphysik, Ruhr-Universität Bochum, Universitätsstraße 150, D-44780 Bochum (Germany); Wünsch, S.; Siegel, M. [Institut für Mikro- und Nanoelektronische Systeme, Karlsruhe Institute of Technology, D-76189 Karlsruhe (Germany); Ustinov, A. V. [Physikalisches Institut, Karlsruhe Institute of Technology, D-76128 Karlsruhe (Germany); Laboratory of Superconducting Metamaterials, National University of Science and Technology “MISIS,” Moscow 119049 (Russian Federation); Bushev, P. A. [Experimentalphysik, Universität des Saarlandes, D-66123 Saarbrücken (Germany)

    2014-10-20

    We report on hybrid circuit quantum electrodynamics experiments with focused ion beam implanted Er{sup 3+} ions in Y{sub 2}SiO{sub 5} coupled to an array of superconducting lumped element microwave resonators. The Y{sub 2}SiO{sub 5} crystal is divided into several areas with distinct erbium doping concentrations, each coupled to a separate resonator. The coupling strength is varied from 5 MHz to 18.7 MHz, while the linewidth ranges between 50 MHz and 130 MHz. We confirm the paramagnetic properties of the implanted spin ensemble by evaluating the temperature dependence of the coupling. The efficiency of the implantation process is analyzed and the results are compared to a bulk doped Er:Y{sub 2}SiO{sub 5} sample. We demonstrate the integration of these engineered erbium spin ensembles with superconducting circuits.

  9. Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

    Science.gov (United States)

    Seaward, R. C.

    1967-01-01

    Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

  10. Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology.

    Science.gov (United States)

    Fukuda, Kenjiro; Someya, Takao

    2016-11-28

    Printed electronics enable the fabrication of large-scale, low-cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high-speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin-film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high-resolution printing technologies and strategies to enable high-resolution patterning. The main focus of this report is on obtaining printed electrodes with high-resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential.

  11. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, Gene R. (Albuquerque, NM); Armendariz, Marcelino G. (Albuquerque, NM); Bryan, Robert P. (Albuquerque, NM); Carson, Richard F. (Albuquerque, NM); Duckett, III, Edwin B. (Albuquerque, NM); McCormick, Frederick B. (Albuquerque, NM); Peterson, David W. (Sandia Park, NM); Peterson, Gary D. (Albuquerque, NM); Reysen, Bill H. (Lafayette, CO)

    2005-03-15

    This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

  12. Crushing performance and resource characteristic of printed circuit board scrap

    Institute of Scientific and Technical Information of China (English)

    WANG Hui; GU Guo-hua; QI Yun-feng

    2005-01-01

    The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especially vibration grinding, which has cut or impact action, excels that of jaw crusher or roller crusher. The PCB scrap is worthwhile to recycle using variety of modern characterization methods. When compared with natural resources, this material stream remains a rich precious metal and nonferrous metals. In PCB scrap, metals account for 47% of the total material composition, in which there exists 19.66% copper, 11.47% iron, 3.93% lead, 300 g/t gold and 5-10 kg/t silver, etc. In addition, the PCB scrap contains 27% of plastics and 26% of refractory oxides.

  13. Sliding contacts on printed circuit boards and wear behavior

    Science.gov (United States)

    Le Solleu, J.-P.

    2010-04-01

    Automotive suppliers use since decades printed circuit boards (PCB) gold plating pads, as direct contact interface for low current sliding contacts. Several gold plating processes are available on the market, providing various wear behaviour. Some specific galvanic hard gold (AuCo or AuNi). plating was developed on PCB's. This specific plating generates extra costs due to the material quantity and also the process complexity. In a cost driven industry, the challenge is to use a standard low cost PCB for systems requesting high reliability performances. After a brief overview of standard PCB manufacturing processes and especially gold plating processes, the global experimental results of wear behaviour of three different gold plating technologies will be exposed and an explanation of the correlation between surface key parameters and wear out will be provided.

  14. Research on Selective Shredding of Wasted Printed Circuit Boards

    Institute of Scientific and Technical Information of China (English)

    曹亦俊; 文学峰; 赵跃民

    2002-01-01

    Electronic scrap, especially wasted printed circuit boards (PCBs), is regarded as an environmental challenge. At present, the physical separation is thought to be the environmental friendly and economical method of treating and reutilizing electronic waste. An effective liberation of metals from non-metallic components is a crucial step towards mechanical separation and recycling of wasted PCBs. In this paper, the selective shredding theory and mechanics characteristics of wasted PCBs were analyzed, and the shredded experiments of wasted PCBs by hammer mill were investigated. The result shows that the selective shredding exists in the wasted PCBs shredded process by hammer mill. The shredding velocity of non-metallic components is far greater than that of metals in the wasted PCBs shredding, which makes the metals concentrate in the coarser fraction. And the impact force of hammer mill is superior to metal liberation from non-metallic components, a satisfied metal liberation degree can be achieved in the wasted PCBs shredding by hammer mill.

  15. A corrected method of distorted printed circuit board image

    Institute of Scientific and Technical Information of China (English)

    Qiao Nao-Sheng; Ye Yu-Tang; Huang Yong-Lin

    2011-01-01

    This paper proposes a corrected method of distorted image based on adaptive control. First, the adaptive control relationship of pixel point positions between distorted image and its corrected image is given by using polynomial fitting,thus control point pairs between the distorted image and its corrected image are found. Secondly, the value of both image distortion centre and polynomial coefficient is obtained with least square method, thus the relationship of each control point pairs is deduced. In the course of distortion image processing, the gray value of the corrected image is changed into integer with bilinear interpolation. Finally, the experiments are performed to correct two distorted printed circuit board images. The results are perfect and the mean square errors of residual error are tiny.

  16. Size distribution of wet crushed waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    Tan Zhihai; He Yaqun; Xie Weining; Duan Chenlong; Zhou Enhui; Yu Zheng

    2011-01-01

    A wet impact crusher was used to breakdown waste printed circuit boards (PCB's) in a water medium.The relationship between the yield of crushed product and the operating parameters was established.The crushing mechanism was analyzed and the effects of hammerhead style,rotation speed,and inlet water volume on particle size distribution were investigated.The results show that the highest yield of -1 + 0.75 mm sized product was obtained with an inlet water volume flow rate of 5.97 m3/h and a smooth hammerhead turning at 1246.15 r/min.Cumulative undersize-product yield curves were fitted to a nonlinear function:the fitting correlation coefficient was greater than 0.998.These research results provide a theoretical basis for the highly effective wet crushing of PCB's.

  17. Printed circuit board metal powder filters for low electron temperatures.

    Science.gov (United States)

    Mueller, Filipp; Schouten, Raymond N; Brauns, Matthias; Gang, Tian; Lim, Wee Han; Lai, Nai Shyan; Dzurak, Andrew S; van der Wiel, Wilfred G; Zwanenburg, Floris A

    2013-04-01

    We report the characterisation of printed circuit boards (PCB) metal powder filters and their influence on the effective electron temperature which is as low as 22 mK for a quantum dot in a silicon MOSFET structure in a dilution refrigerator. We investigate the attenuation behaviour (10 MHz-20 GHz) of filter made of four metal powders with a grain size below 50 μm. The room-temperature attenuation of a stainless steel powder filter is more than 80 dB at frequencies above 1.5 GHz. In all metal powder filters, the attenuation increases with temperature. Compared to classical powder filters, the design presented here is much less laborious to fabricate and specifically the copper powder PCB-filters deliver an equal or even better performance than their classical counterparts.

  18. Investigation of Solder Cracking Problems on Printed Circuit Boards

    Science.gov (United States)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  19. Circuit QED with hybrid metamaterial transmission lines

    Energy Technology Data Exchange (ETDEWEB)

    Ruloff, Stefan; Taketani, Bruno; Wilhelm, Frank [Theoretical Physics, Universitaet des Saarlandes, Saarbruecken (Germany)

    2016-07-01

    We're working on the theory of metamaterials providing some interesting results. The negative refraction index causes an opposite orientation of the wave vector k and the Poynting vector S of the travelling waves. Hence the metamaterial has a falling dispersion relation ∂ω(k)/∂k < 0 implying that low frequencies correspond to short wavelengths. Metamaterials are simulated by left-handed transmission lines consisting of discrete arrays of series capacitors and parallel inductors to ground. Unusual physics arises when right-and left-handed transmission lines are coupled forming a hybrid metamaterial transmission line. E.g. if a qubit is placed in front of a hybrid metamaterial transmission line terminated in an open circuit, the spontaneous emission rate is weakened or unaffected depending on the transition frequency of the qubit. Some other research interests are the general analysis of metamaterial cavities and the mode structure of hybrid metamaterial cavities for QND readout of multi-qubit operators. Especially the precise answer to the question about the definition of the mode volume of a metamaterial cavity is one of our primary goals.

  20. Waste minimization assessment for a printed-circuit-board manufacturer. Environmental research brief

    Energy Technology Data Exchange (ETDEWEB)

    Looby, G.P.; Kirsch, F.W.

    1992-05-01

    Waste Minimization Assessment Centers (WMACs) were established at selected universities, and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual (EPA/625/7-88/003, July 1988). The WMAC team at the University of Tennessee performed an assessment at a plant manufacturing printed circuit boards for television sets--approximately 4.3 million sq ft of finished boards per yr. To make printed circuit boards, the plant begins with making screens as all printing is accomplished using silk-screening techniques. The circuit boards undergo several operations including punching, scrubbing, printing, etching, and soldering. The team's report, detailing findings and recommendations, indicated that the majority of waste was generated in the circuit board production lines but the greatest savings could be obtained by installing a closed-loop cooling water system to reduce (60%) excess water usage in the UV-light curing ovens after screen printing and the cooling of the cupric chloride etch tanks.

  1. Application of the model of the printed circuit board with regard to the topology of external conductive layers for calculation of the thermal conditions of the printed circuit board

    Science.gov (United States)

    Rybakov, I. M.; Goryachev, N. V.; Kochegarov, I. I.; Grishko, A. K.; Brostilov, S. A.; Yurkov, N. K.

    2017-01-01

    The paper proves the necessity of taking into account external conductive layers of the printed circuit board with the thermal physical designing radio-electronic means. For example, a single printed circuit board shows the level of influence of the external conductive layer on the thermal conditions of the printed circuit board. It proved the influence of Joule heat in the thermal conditions of a single conductor. Developed geometrical and thermal printed circuit board models take into account the topological layer and can improve the accuracy of determining the thermal conditions of the printed circuit board.

  2. Flexible Circuits and Soft Actuators by Printing Assembly of Graphene.

    Science.gov (United States)

    Li, Wenbo; Li, Fengyu; Li, Huizeng; Su, Meng; Gao, Meng; Li, Yanan; Su, Dan; Zhang, Xingye; Song, Yanlin

    2016-05-18

    An effective way to improve the electrical conductivity of printed graphene patterns was demonstrated by realizing the assembly of giant graphene oxide sheets during the printing process. The synergetic effect of printing-induced orientation and evaporation-induced interfacial assembly facilitated the formation of laminar-structured patterns. The resulting patterns after chemical reduction showed excellent electrical conductivity in printed graphene electronics. Because of their high conductivity, mechanical flexibility, and advantage in pattern design, printed graphene electrodes were applied in electrical-driven soft actuators, which can realize controllable deformation with low driving voltage. Such achievements will be of great significance for the development of graphene-based flexible and printed electronics.

  3. Waste printed circuit board recycling techniques and product utilization

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

    2015-02-11

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

  4. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    Science.gov (United States)

    Jadhav, U.; Hocheng, H.

    2015-09-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h.

  5. Recovery of high purity precious metals from printed circuit boards.

    Science.gov (United States)

    Park, Young Jun; Fray, Derek J

    2009-05-30

    Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH(4))(2)Cl(6). The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

  6. Advances in Current Rating Techniques for Flexible Printed Circuits

    Science.gov (United States)

    Hayes, Ron

    2014-01-01

    Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

  7. PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

    Directory of Open Access Journals (Sweden)

    Hellington Bastos da Silva de Sant’ana

    2015-07-01

    Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

  8. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces.

    Science.gov (United States)

    Jadhav, U; Hocheng, H

    2015-09-29

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h.

  9. Using multiple sensors for printed circuit board insertion

    Science.gov (United States)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

  10. Examining the evolution of metals utilized in printed circuit boards.

    Science.gov (United States)

    Adie, Gilbert Umaye; Sun, Lingyu; Zeng, Xianlai; Zheng, Lixia; Osibanjo, Oladele; Li, Jinhui

    2017-07-01

    Management of waste electrical and electronic equipment (WEEE) has recently attracted worldwide attention because of high metal concentrations in them. Evolution of toxic and precious metals utilized in WEEE can not only reflect the adventure of eco-design, but can also guide the final recycling option. Pb, As, Cu, Au, Sn and Ag were determined in 10 composite samples of printed circuit boards of cathode ray tube televisions (TV-PCBs) that were produced between 1980 and 2005. The obtained results indicated that average metal concentrations in all TV-PCBs were - Cu: 10.6 ± 4.1%, Sn: 4.21 ± 0.90%, Pb: 3.15 ± 0.54%, Ag: 0.0215 ± 0.0068%, Au: 0.0068 ± 0.0049% and As: 0.0007 ± 0.0004%. No remarkable difference was found in compositions of Pb and Sn over the years, suggesting that there were no major modifications of Sn/Pb solder used in joining the circuitry system. The average composition of Cu fluctuated between 5.10% in 1980 and 12.8% in the mid-1990s and decreased afterwards. The decreases in Ag and Cu compositions could possibly be associated with thinner layers of these metals in newer model products.

  11. Optimization Of Assembly Line Of Printed Circuit Board Using Simulation

    Directory of Open Access Journals (Sweden)

    Kamal Alzameli

    2015-08-01

    Full Text Available The development of an assembly line would not stop at a specific research even if that research contains very detailed sectors of one assembly line or starting from customer order to product delivery. Therefore continuous improvement needs to be vigorous for continuous productivity improvement and innovation. The optimization process of printed circuit board assembly line includes hard and soft optimization. The hard optimization includes hardware changes via design and the soft optimization is figured via simulation of the current assembly line and analysis. The aim of the research is to determine the bottlenecks find a solution and develop improvement method via changing the configuration of the setup on the assembly line until the feasible optimal configuration is definite. The software that will be used for this simulation is Arena software. The data of the research is collected from real assembly line. The best engineering assumption for the area is used for no permanent data that could be available such as the data that might be collected from the manual stations. In addition to the aim of the research is to get a better yield via improving the time of the PCB assembly process. Hence the outcome to all of these attempts of optimizing the assembly line of PCB for continuous improvement is to deliver good quality products reduce cost and minimize the time to delivery and meet the customer expectations.

  12. Liberation characteristic and physical separation of printed circuit board (PCB).

    Science.gov (United States)

    Guo, Chao; Wang, Hui; Liang, Wei; Fu, Jiangang; Yi, Xin

    2011-01-01

    Recycling of printed circuit board (PCB) is an important subject and to which increasing attention is paid, both in treatment of waste as well as recovery of valuable material terms. Precede physical and mechanical method, a good liberation is the premise to further separation. In this study, two-step crushing process is employed, and standard sieve is applied to screen crushed material to different size fractions, moreover, the liberation situation and particles shape in different size are observed. Then metal of the PCB is separated by physical methods, including pneumatic separation, electrostatic separation and magnetic separation, and major metal contents are characterized by inductively coupled plasma emission spectrometry (ICP-AES). Results show that the metal and nonmetal particles of PCB are dissociated completely under the crush size 0.6mm; metal is mainly enriched in the four size fractions between 0.15 and 1.25 mm; relatively, pneumatic separation is suitable for 0.6-0.9 mm size fraction, while the electrostatic separation is suitable for three size fractions that are 0.15-0.3mm, 0.3-0.6mm and 0.9-1.25 mm. The whole process that involves crushing, electrostatic and magnetic separation has formed a closed cycle that can return material and provide salable product. Crown Copyright © 2011. Published by Elsevier Ltd. All rights reserved.

  13. Inkjet-printed conductive features for rapid integration of electronic circuits in centrifugal microfluidics

    CSIR Research Space (South Africa)

    Kruger, J

    2015-05-01

    Full Text Available This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which...

  14. Recent developments and perspective of the spent waste printed circuit boards.

    Science.gov (United States)

    Xu, Yuquan; Liu, Junsheng

    2015-05-01

    The amount of spent electronic and electrical solid wastes (i.e. e-wastes) has increased to a new level with the rapid development of electronic and electrical industries. Management of e-wastes challenges the administrators and researchers. As a major component of the e-waste stream, pollution caused by the spent printed circuit boards has captured increasing attention. Various innovative methods have recently been developed to dispose and reuse these municipal spent printed circuit boards. In this mini-review article, the disposal approaches for spent printed circuit boards are highlighted. The present state and future perspective are also discussed. We hope that this mini-review can promote the extensive understanding and effective disposal of the spent printed circuit boards in the field of solid waste treatment and resources.

  15. TSCA Chemical Data Reporting Fact Sheet: Byproducts Reporting for the Printed Circuit Board Industry

    Science.gov (United States)

    This fact sheet provides information on existing Chemical Data Reporting (CDR) rule requirements related to byproducts reporting by persons who manufacture printed circuit boards and may be subject to CDR.

  16. Alternatives Assessment: Partnership to Evaluate Flame Retardants in Printed Circuit Boards

    Science.gov (United States)

    The partnership project on flame retardants in printed circuit boards seeks to improve understanding of the environmental and human health impacts of new and current materials that can be used to meet fire safety standards

  17. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    OpenAIRE

    Marcos Paulo Kohler Caldas; Viviane Tavares de Morae; Eduardo Junca; Jorge Alberto Soares Tenório; Denise Crocce Romano Espinosa

    2015-01-01

    The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES) and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an ox...

  18. Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

    Energy Technology Data Exchange (ETDEWEB)

    Yoon, Su-Jong [Idaho National Lab. (INL), Idaho Falls, ID (United States); Sabharwall, Piyush [Idaho National Lab. (INL), Idaho Falls, ID (United States); Kim, Eung-Soo [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2013-09-01

    The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.

  19. Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

    Directory of Open Access Journals (Sweden)

    M. Elsobky

    2017-09-01

    Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

  20. Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

    Science.gov (United States)

    Elsobky, Mourad; Mahsereci, Yigit; Keck, Jürgen; Richter, Harald; Burghartz, Joachim N.

    2017-09-01

    Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI) substrate to form a Hybrid System-in-Foil (HySiF), which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing) of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA) in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC). The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC), a differential difference amplifier (DDA), and a 10-bit successive approximation register (SAR) ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

  1. Technology development of RF MEMS switches on printed circuit boards

    Science.gov (United States)

    Chang, Hung-Pin

    Today, some engineers have shifted their focus on the micro-electro-mechanical system (MEMS) to pursue better technological advancements. Recent development in RF MEMS technologies have lead to superior switch characteristics, i.e., very low insertion loss, very low power requirements, and high isolation comparing to the conventional semiconductor devices. This success has promised the potential of MEMS to revolutionize RF and microwave system implementation for the next generation of communication applications. However, RF MEMS switches integrated monolithically with various RF functional components on the same substrate to create multifunctional and reconfigurable complete communication systems remains to be a challenge research topic due to the concerns of the high cost of packaging process and the high cost of RF matching requirements in module board implementation. Furthermore, the fabrication of most RF MEMS switches requires thickness control and surface planarization of wide metal lines prior to deposition of a metal membrane bridge, which poses a major challenge to manufacturability. To ease the fabrication of RF MEMS switches and to facilitate their integration with other RF components such as antennas, phase delay lines, tunable filters, it is imperative to develop a manufacturable RF MEMS switch technology on a common substrate housing all essential RF components. Development of a novel RF MEMS technology to build a RF MEMS switch and provide a system-level packaging on microwave laminated printed circuit boards (PCBs) are proposed in this dissertation. Two key processes, high-density inductively coupled plasma chemical vapor deposition (HDICP CVD) for low temperature dielectric deposition, and compressive molding planarization (COMP) for the temporary sacrificial polymer planarization have been developed for fabricating RF MEMS switches on PCBs. Several membrane-type capacitive switches have been fabricated showing excellent RF performance and dynamic

  2. Automated inspection in printed circuit board assembly (PCBA) manufacturing

    Science.gov (United States)

    Abraham, Francy K.

    1997-08-01

    Visual inspection has long been a necessary method of quality control in Printed Circuit Board Assemblies (PCBA) manufacturing. The characteristics of electronic assemblies have changed substantially over the last decade. Todays high lead count, fine pitch SMT components are becoming even more difficult for humans to inspect at the same time automated inspection systems have become reliable than manual inspection and are now accepted as valuable tools for producing high quality PCBA products. The basic requirements of an automated inspection system remain same in all PCBA manufacturing but the type of the automated system (off- line/on-line), where applied in the production flow, entire boards or only on a sample basis, inspection coverage (100% or partial) vary between different PCBA manufacturers. In PCBA manufacturing the emphasis is more in the electrical functionality of the PCBA than in it's appearance. It is nearly impossible to impose stringent specifications in the appearance of the components and other materials used in PCBA manufacturing. Due to the large number of component/PCB supplier and wide variations in materials and processes the challenge in successfully automating the inspection process is the variability in the appearance of components on PCBA. But in a high volume PCBA manufacturing where fewer board types are running in large volumes for long periods of time, the variability in component appearance can be controlled much better than a low volume PCBA manufacturing where more types are running in low volumes for short period of time. This paper discusses the development and implementation of a low cost flexible automated inspection system for PCBAs. The system can detect over ninety percent of visual defects on PCBAs. The key features of the system are quick and easy set-up, capability to inspect different types of board and quick change over between different boards and low cost.

  3. Hybrid 3D-2D printing for bone scaffolds fabrication

    Science.gov (United States)

    Seleznev, V. A.; Prinz, V. Ya

    2017-02-01

    It is a well-known fact that bone scaffold topography on micro- and nanometer scale influences the cellular behavior. Nano-scale surface modification of scaffolds allows the modulation of biological activity for enhanced cell differentiation. To date, there has been only a limited success in printing scaffolds with micro- and nano-scale features exposed on the surface. To improve on the currently available imperfect technologies, in our paper we introduce new hybrid technologies based on a combination of 2D (nano imprint) and 3D printing methods. The first method is based on using light projection 3D printing and simultaneous 2D nanostructuring of each of the layers during the formation of the 3D structure. The second method is based on the sequential integration of preliminarily created 2D nanostructured films into a 3D printed structure. The capabilities of the developed hybrid technologies are demonstrated with the example of forming 3D bone scaffolds. The proposed technologies can be used to fabricate complex 3D micro- and nanostructured products for various fields.

  4. Estimation of the frequency border for tolerable use of the approximate models of transmission lines at the circuit analysis of printed circuit boards

    Directory of Open Access Journals (Sweden)

    Sirotко V. K.

    2010-10-01

    Full Text Available The required frequency border was defined by means of comparison of amplitude signals on receiving end of printed circuit boards transmission lines calculated using more exact electrodynamic models. For the contemporary printed circuit boards materials and designs the frequency border makes 3 GHz.

  5. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    Directory of Open Access Journals (Sweden)

    Marcos Paulo Kohler Caldas

    2015-06-01

    Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

  6. Flexible printed circuit boards laser bonding using a laser beam homogenization process

    Science.gov (United States)

    Kim, Joohan; Choi, Haewoon

    2012-11-01

    A laser micro-bonding process using laser beam shaping is successfully demonstrated for flexible printed circuit boards. A CW Ytterbium fiber laser with a wavelength of 1070 nm and a laser power density of 1-7 W/mm2 is employed as a local heat source for bonding flexible printed circuit boards to rigid printed circuit boards. To improve the bonding quality, a micro-lens array is used to modify the Gaussian laser beam for the bonding process. An electromagnetic modeling and heat transfer simulation is conducted to verify the effect of the micro-lens array on the laser bonding process. The optimal bonding parameters are found experimentally. As the measured temperature ramp rate of the boards exceeds 1100 K/s, bonding occurs within 100-200 ms at a laser power density of 5 W/mm2. The bonding quality of the FPCB is verified with a shear strength test. Process characteristics are also discussed.

  7. Hybrid 3D-2D printing of bone scaffolds Hybrid 3D-2D printing methods for bone scaffolds fabrication.

    Science.gov (United States)

    Prinz, V Ya; Seleznev, Vladimir

    2016-12-13

    It is a well-known fact that bone scaffold topography on micro- and nanometer scale influences the cellular behavior. Nano-scale surface modification of scaffolds allows the modulation of biological activity for enhanced cell differentiation. To date, there has been only a limited success in printing scaffolds with micro- and nano-scale features exposed on the surface. To improve on the currently available imperfect technologies, in our paper we introduce new hybrid technologies based on a combination of 2D (nano imprint) and 3D printing methods. The first method is based on using light projection 3D printing and simultaneous 2D nanostructuring of each of the layers during the formation of the 3D structure. The second method is based on the sequential integration of preliminarily created 2D nanostructured films into a 3D printed structure. The capabilities of the developed hybrid technologies are demonstrated with the example of forming 3D bone scaffolds. The proposed technologies can be used to fabricate complex 3D micro- and nanostructured products for various fields. Copyright 2016 IOP Publishing Ltd.

  8. Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

    DEFF Research Database (Denmark)

    Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

    2013-01-01

    The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda......The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations...

  9. Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

    Science.gov (United States)

    Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

    2015-05-01

    Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

  10. Organic–Inorganic Eu3+/Tb3+ codoped hybrid films for temperature mapping in integrated circuits

    Science.gov (United States)

    Brites, Carlos D. S.; Lima, Patrícia P.; Silva, Nuno J. O.; Millán, Angel; Amaral, Vitor S.; Palacio, Fernando; Carlos, Luís D.

    2013-01-01

    The continuous decrease on the geometric size of electronic devices and integrated circuits generates higher local power densities and localized heating problems that cannot be characterized by conventional thermographic techniques. Here, a self-referencing intensity-based molecular thermometer involving a di-ureasil organic-inorganic hybrid thin film co-doped with Eu3+ and Tb3+ tris (β-diketonate) chelates is used to obtain the temperature map of a FR4 printed wiring board with spatio-temporal resolutions of 0.42 μm/4.8 ms. PMID:24790938

  11. Hybrid Direct-Current Circuit Breaker

    Science.gov (United States)

    Wang, Ruxi (Inventor); Premerlani, William James (Inventor); Caiafa, Antonio (Inventor); Pan, Yan (Inventor)

    2017-01-01

    A circuit breaking system includes a first branch including at least one solid-state snubber; a second branch coupled in parallel to the first branch and including a superconductor and a cryogenic contactor coupled in series; and a controller operatively coupled to the at least one solid-state snubber and the cryogenic contactor and programmed to, when a fault occurs in the load circuit, activate the at least one solid-state snubber for migrating flow of the electrical current from the second branch to the first branch, and, when the fault is cleared in the load circuit, activate the cryogenic contactor for migrating the flow of the electrical current from the first branch to the second branch.

  12. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards.

    Science.gov (United States)

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-08-28

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au(+) and Cu(2+) respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs.

  13. Integrated printed circuit board device for cell lysis and nucleic acid extraction.

    Science.gov (United States)

    Marshall, Lewis A; Wu, Liang Li; Babikian, Sarkis; Bachman, Mark; Santiago, Juan G

    2012-11-01

    Preparation of raw, untreated biological samples remains a major challenge in microfluidics. We present a novel microfluidic device based on the integration of printed circuit boards and an isotachophoresis assay for sample preparation of nucleic acids from biological samples. The device has integrated resistive heaters and temperature sensors as well as a 70 μm × 300 μm × 3.7 cm microfluidic channel connecting two 15 μL reservoirs. We demonstrated this device by extracting pathogenic nucleic acids from 1 μL dispensed volume of whole blood spiked with Plasmodium falciparum. We dispensed whole blood directly onto an on-chip reservoir, and the system's integrated heaters simultaneously lysed and mixed the sample. We used isotachophoresis to extract the nucleic acids into a secondary buffer via isotachophoresis. We analyzed the convective mixing action with micro particle image velocimetry (micro-PIV) and verified the purity and amount of extracted nucleic acids using off-chip quantitative polymerase chain reaction (PCR). We achieved a clinically relevant limit of detection of 500 parasites per microliter. The system has no moving parts, and the process is potentially compatible with a wide range of on-chip hybridization or amplification assays.

  14. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    Science.gov (United States)

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  15. Inkjet printed circuits based on ambipolar and p-type carbon nanotube thin-film transistors

    Science.gov (United States)

    Kim, Bongjun; Geier, Michael L.; Hersam, Mark C.; Dodabalapur, Ananth

    2017-02-01

    Ambipolar and p-type single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs) are reliably integrated into various complementary-like circuits on the same substrate by inkjet printing. We describe the fabrication and characteristics of inverters, ring oscillators, and NAND gates based on complementary-like circuits fabricated with such TFTs as building blocks. We also show that complementary-like circuits have potential use as chemical sensors in ambient conditions since changes to the TFT characteristics of the p-channel TFTs in the circuit alter the overall operating characteristics of the circuit. The use of circuits rather than individual devices as sensors integrates sensing and signal processing functions, thereby simplifying overall system design.

  16. Inkjet printed circuits based on ambipolar and p-type carbon nanotube thin-film transistors

    Science.gov (United States)

    Kim, Bongjun; Geier, Michael L.; Hersam, Mark C.; Dodabalapur, Ananth

    2017-01-01

    Ambipolar and p-type single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs) are reliably integrated into various complementary-like circuits on the same substrate by inkjet printing. We describe the fabrication and characteristics of inverters, ring oscillators, and NAND gates based on complementary-like circuits fabricated with such TFTs as building blocks. We also show that complementary-like circuits have potential use as chemical sensors in ambient conditions since changes to the TFT characteristics of the p-channel TFTs in the circuit alter the overall operating characteristics of the circuit. The use of circuits rather than individual devices as sensors integrates sensing and signal processing functions, thereby simplifying overall system design. PMID:28145438

  17. Inkjet printed circuits based on ambipolar and p-type carbon nanotube thin-film transistors.

    Science.gov (United States)

    Kim, Bongjun; Geier, Michael L; Hersam, Mark C; Dodabalapur, Ananth

    2017-02-01

    Ambipolar and p-type single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs) are reliably integrated into various complementary-like circuits on the same substrate by inkjet printing. We describe the fabrication and characteristics of inverters, ring oscillators, and NAND gates based on complementary-like circuits fabricated with such TFTs as building blocks. We also show that complementary-like circuits have potential use as chemical sensors in ambient conditions since changes to the TFT characteristics of the p-channel TFTs in the circuit alter the overall operating characteristics of the circuit. The use of circuits rather than individual devices as sensors integrates sensing and signal processing functions, thereby simplifying overall system design.

  18. Printed circuit board impedance matching step for microwave (millimeter wave) devices

    Science.gov (United States)

    Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

    2013-10-01

    An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

  19. Hybrid CMOS/Nanodevice Integrated Circuits Design and Fabrication

    Science.gov (United States)

    2008-08-25

    This approach combines a semiconductor transistor system with a nanowire crossbar, with simple two-terminal nanodevices self-assembled at each...hybrid CMOS/nanodevice integrated circuits [10-12]. Such circuit combines a semiconductor transistors system with a nanowire crossbar, with simple two...both with and without embedded metallic clusters), self-assembled molecular monolayers, and thin chalcogenide and crystalline perovskite layers [20

  20. Utilization of MATLAB in Simulation of Linear Hybrid Circuits

    OpenAIRE

    BRANCIK, L.

    2003-01-01

    In the paper a MATLAB-based method for simulating transient phenomena in linear hybrid circuits containing parts with both lumped and distributed parameters is presented. Distributed parts of the circuit are multiconductor transmission lines, which can generally be nonuniform, with frequency-dependent parameters, and under nonzero initial voltage and/or current distributions. In principle a solution is formulated using the modified nodal analysis method in the frequency domain. Subsequently a...

  1. Hybrid HVDC circuit breaker with self-powered gate drives

    OpenAIRE

    Effah, Francis Boafo; Watson, Alan James; Ji, Chao; Amankwah, Emmanuel K.; Johnson, Christopher Mark; Davidson, Colin; Clare, Jon C.

    2016-01-01

    The ever increasing electric power demand and the advent of renewable energy sources have revived the interest in high-voltage direct current (HVDC) multi-terminal networks. However, the absence of a suitable circuit breaker or fault tolerant VSC station topologies with the required characteristics (such as operating speed) have, until recently, been an obstacle in the development of large scale multi-terminal networks for HVDC. This paper presents a hybrid HVDC circuit breaker concept which...

  2. Hybrid HVDC circuit breaker with self-powered gate drives

    OpenAIRE

    Effah, Francis Boafo; Watson, Alan James; Ji, Chao; Amankwah, Emmanuel K.; Johnson, Christopher Mark; Davidson, Colin; Clare, Jon C.

    2016-01-01

    The ever increasing electric power demand and the advent of renewable energy sources have revived the interest in high-voltage direct current (HVDC) multi-terminal networks. However, the absence of a suitable circuit breaker or fault tolerant VSC station topologies with the required characteristics (such as operating speed) have, until recently, been an obstacle in the development of large scale multi-terminal networks for HVDC. This paper presents a hybrid HVDC circuit breaker concept which ...

  3. Hybrid high direct current circuit interrupter

    Science.gov (United States)

    Rockot, J.H.; Mikesell, H.E.; Jha, K.N.

    1998-08-11

    A device and a method are disclosed for interrupting very high direct currents (greater than 100,000 amperes) and simultaneously blocking high voltages (greater than 600 volts). The device utilizes a mechanical switch to carry very high currents continuously with low loss and a silicon controlled rectifier (SCR) to bypass the current around the mechanical switch while its contacts are separating. A commutation circuit, connected in parallel with the SCR, turns off the SCR by utilizing a resonant circuit to divert the SCR current after the switch opens. 7 figs.

  4. Hybrid and monolithic integration of planar lightwave circuits (PLCs)

    Science.gov (United States)

    Chen, Ray T.

    2008-02-01

    In this paper, we review the status of monolithic and hybrid integration of planar lightwave circuits (PLCs). Building blocks needed for system integration based on polymeric materials, III-V semiconductor materials, LiNbO 3 and SOI on Silicon are summarized with pros and cons. Due to the maturity of silicon CMOS technology, silicon becomes the platform of choice for optical application specific integrated circuits (OASICs). However, the indirect bandgap of silicon makes the formation of electrically pumped silicon laser a remote plausibility which requires hybrid integration of laser sources made out of III-V compound semicouductor.

  5. PERSONAL COMPUTER MONITORS: A SCREENING EVALUATION OF VOLATILE ORGANIC EMISSIONS FROM EXISTING PRINTED CIRCUIT BOARD LAMINATES AND POTENTIAL POLLUTION PREVENTION ALTERNATIVES

    Science.gov (United States)

    The report gives results of a screening evaluation of volatile organic emissions from printed circuit board laminates and potential pollution prevention alternatives. In the evaluation, printed circuit board laminates, without circuitry, commonly found in personal computer (PC) m...

  6. Graphene/Si CMOS Hybrid Hall Integrated Circuits

    OpenAIRE

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-01-01

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal a...

  7. Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

    NARCIS (Netherlands)

    Sridhar, A.; Dijk, van D.J.; Akkerman, R.

    2009-01-01

    The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these

  8. Effect of ionic contamination on climatic reliability of printed circuit board assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2012-01-01

    The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

  9. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    Science.gov (United States)

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  10. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    Science.gov (United States)

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  11. Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

    NARCIS (Netherlands)

    Wits, Wessel Willems; Legtenberg, R.; Legtenberg, Rob; Mannak, Jan; van Zalk, Bas; Aripin, A.

    2006-01-01

    A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on

  12. Self-shielding printed circuit boards for high frequency amplifiers and transmitters

    Science.gov (United States)

    Galvin, D.

    1969-01-01

    Printed circuit boards retaining as much copper as possible provide electromagnetic shielding between stages of the high frequency amplifiers and transmitters. Oscillation is prevented, spurious output signals are reduced, and multiple stages are kept isolated from each other, both thermally and electrically.

  13. Modeling printed circuit board curvature in relation to manufacturing process steps

    NARCIS (Netherlands)

    Schuerink, G.A.; Slomp, M.; Wits, Wessel Willems; Legtenberg, R.; Legtenberg, R.; Kappel, E.A.

    2013-01-01

    This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such a

  14. Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

    DEFF Research Database (Denmark)

    Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

    2015-01-01

    A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

  15. A novel and simple method of printing flexible conductive circuits on PET fabrics

    Science.gov (United States)

    Wang, Zehong; Wang, Wei; Jiang, Zhikang; Yu, Dan

    2017-02-01

    Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

  16. DC Arc Plasma Disposal of Printed Circuit Board

    Institute of Scientific and Technical Information of China (English)

    黄建军; 施嘉标; 孟月东; 刘正之

    2004-01-01

    A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board is presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable.

  17. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    Science.gov (United States)

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling.

  18. Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

    NARCIS (Netherlands)

    Sridhar, A.; Dijk, van D.J.; Akkerman, R.

    2009-01-01

    Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two varian

  19. Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

    NARCIS (Netherlands)

    Sridhar, Ashok; van Dijk, D.J.; Akkerman, Remko

    2009-01-01

    Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two

  20. Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed...... a colorimetric tin ion indicator applied as a gel. The examples provided in this paper include visualization of corrosion caused by weak organic acids found in solder fluxes, corrosion profiling on the PCBAs after climatic device level testing, and failure analysis of field returns....

  1. Development of high-performance printed organic field-effect transistors and integrated circuits.

    Science.gov (United States)

    Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

    2015-10-28

    Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

  2. Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

    Science.gov (United States)

    Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

    2016-09-01

    Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

  3. Differential microfluidic sensor on printed circuit board for biological cells analysis.

    Science.gov (United States)

    Shi, Dongyuan; Guo, Jinhong; Chen, Liang; Xia, Chuncheng; Yu, Zhefeng; Ai, Ye; Li, Chang Ming; Kang, Yuejun; Wang, Zhiming

    2015-08-01

    Coulter principal based resistive pulse sensor has been demonstrated as an important platform in biological cell detection and enumeration since several decades ago. Recently, the miniaturized micro-Coulter counter has attracted much attention due to its advantages in point of care diagnostics for on chip detection and enumeration of rare cells, such as circulating tumor cells. In this paper, we present a microfluidic cytometer with differential amplifier based on Coulter principle on a SU-8 coated printed circuit board substrate. The electrical current changes induced by the blockage of the microparticles in the sensing aperture are calibrated by polystyrene particles of standard size. Finally, HeLa cells are used to evaluate the performance of the proposed device for enumeration of biological samples. The proposed cytometer is built upon the cheap and widely available printed circuit board substrate and shows its great potential as personalized healthcare monitor.

  4. Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Rasa Volungevičienė

    2014-10-01

    Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

  5. Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor

    Directory of Open Access Journals (Sweden)

    Jakub Szałatkiewicz

    2016-08-01

    Full Text Available This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass.

  6. The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

    Science.gov (United States)

    Zhu, P; Chen, Y; Wang, L Y; Zhou, M; Zhou, J

    2013-02-01

    Separation of waste printed circuit boards (WPCBs) has been a bottleneck in WPCBs resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent. Various parameters, which included solid to liquid ratio, temperature, WPCB sizes, and time, were studied to understand the separation of WPCBs by dissolving bromine epoxy resin using DMSO. Experimental results showed that the concentration of dissolving the bromine epoxy resin increased with increasing various parameters. The optimum condition of complete separation of WPCBs was solid to liquid ratio of 1:7 and WPCB sizes of 16 mm(2) at 145°C for 60 min. The used DMSO was vapored under the decompression, which obtained the regenerated DMSO and dissolved bromine epoxy resin. This clean and non-polluting technology offers a new way to separate valuable materials from WPCBs and prevent the environmental pollution of waste printed circuit boards effectively.

  7. Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor.

    Science.gov (United States)

    Szałatkiewicz, Jakub

    2016-08-10

    This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass.

  8. Treatment of printed circuit board industrial wastewater by Ferrite process combined with Fenton method.

    Science.gov (United States)

    Lou, Jie-Chung; Huang, Yu-Jen; Han, Jia-Yun

    2009-10-30

    Printed circuit board wastewater typically contains organics and metal ions. The study explored the feasibility of a sequential procedure, FFP (the combination of the Fenton method and the Ferrite process), for treating printed circuit board wastewater, and established the optimum parameters for it. The analytical results showed that the proper pH level was 2 for Fenton oxidation, and the appropriate H2O2 dosing type was batch dosing. For the Ferrite process, the suitable Fe/M (Fe is the total dose of Fe2+ added to a solution and M is the initial total moles of various metal ions in untreated wastewater) molar ratio was 10 and the sludge met the toxicity characteristic leaching procedure (TCLP) standards. Following FFP treatment, effluent water or sludge easily met Taiwan's standards. Finally, the SEM/EDS test demonstrated that particle sizes of the sludge were approximately 50-80 nm, and the saturation magnetization was 67.5 emu/g.

  9. A Formal Algorithm for Routing Traces on a Printed Circuit Board

    Science.gov (United States)

    Hedgley, David R., Jr.

    1996-01-01

    This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

  10. Chemical composition and liberation characterization of printed circuit board comminution fines for beneficiation investigations.

    Science.gov (United States)

    Ogunniyi, I O; Vermaak, M K G; Groot, D R

    2009-07-01

    Chemical composition and liberation are critical attributes in characterizing a resource stock for beneficiation investigations. Though end-of-life printed circuit board is recognized as a valuable secondary resource stock, no procedural standard exists for the determination of its chemical composition, nor for the -75 microm fines generated during its comminution. The effect of the digestion procedure on the final assays in wet spectroscopic analyses was assessed in this work. Liberation was also explored against literature background. Determination of assays of all constituent elements in printed circuit board comminution fines was found to require comparison of data from more than one digestion condition, while composite particles still persist at the fines sizes, though very few. The discussion reflects how these impact the beneficiation investigations.

  11. Highly Conductive Semitransparent Graphene Circuits Screen-Printed from Water-Based Graphene Oxide Ink

    DEFF Research Database (Denmark)

    Overgaard, Marc H.; Kuhnel, Martin; Hvidsten, Rasmus

    2017-01-01

    . Here, the development of a scalable water-based graphene oxide ink is reported that can be screen-printed on flexible plastic substrates and subsequently reduced using a 1: 1 mixture of trifluoroacetic acid and hydroiodic acid, thereby creating an electric circuit. The reduced prints exhibit low sheet......The use of graphene materials as conductive inks for flexible and transparent electronics is promising, but challenged by the need for stabilizers, specialized organic solvents, and/or high temperature annealing, severely limiting performance or compatibility with substrates and printing techniques...... resistance of 327 Omega sq(-1) for thin semitransparent layers with 37% transmittance. This methodology with postprinting chemical reduction outperforms high temperature annealing, thereby eliminating the need for such a step, which is incompatible with flexible plastic substrates. The strategy relies on low...

  12. Converting non-metallic printed circuit boards waste into a value added product

    OpenAIRE

    Shantha Kumari Muniyandi; Johan Sohaili; Azman Hassan; Siti Suhaila Mohamad

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dis...

  13. Fast Fabrication of Flexible Functional Circuits Based on Liquid Metal Dual-Trans Printing.

    Science.gov (United States)

    Wang, Qian; Yu, Yang; Yang, Jun; Liu, Jing

    2015-11-25

    A dual-trans method to print the first functional liquid-metal circuit layout on poly(vinyl chloride) film, and then transfer it into a poly(dimethylsiloxane) substrate through freeze phase transition processing for the fabrication of a flexible electronic device. A programmable soft electronic band and a temperature-sensing module wirelessly communicate with a mobile phone, demonstrating the efficiency and capability of the method.

  14. Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

    Directory of Open Access Journals (Sweden)

    Yefimenko A. A.

    2014-12-01

    Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

  15. EMC and the printed circuit board design theory and layout made simple

    CERN Document Server

    Montrose, Mark I

    1999-01-01

    "This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

  16. Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

    OpenAIRE

    Sridhar, A.; Dijk, van, JMF Jan; Akkerman, R.

    2009-01-01

    The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these materials are generally not very receptive to chemical bond formation with the deposited ink. This paper deals with the surface modification of a high frequency laminate (substrate) using two diffe...

  17. High Aspect Ratio Microstructures in Flexible Printed Circuit Boards : Process and Applications

    OpenAIRE

    Yousef, Hanna

    2008-01-01

    Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and...

  18. On minimizing the number of vias while routing printed circuit boards

    Directory of Open Access Journals (Sweden)

    Luzin S. Yu.

    2009-06-01

    Full Text Available The approaches to minimization the number of vias on the printed circuit board were examined in this article. A method of reducing the number of vias through connecting wires not to the contact, but to the via, attached to a contact or a junction. Traditional methods of reducing the number of vias do not take this option into concideration, but make reduction by changing the layer of segments.

  19. Contact connections in electronic printing circuit, performed using the foil puncture method

    Directory of Open Access Journals (Sweden)

    Efimenko А. А.

    2010-08-01

    Full Text Available The results of theoretical and experimental researches of the unsoldered contact connections performed using the foil puncture method are demonstrated. The structural parameters of printing circuit boards and contacts of electronic components from positions of microminiatu-rization of electronic apparatus are determined. The contact connections are tested on climatic and mechanical factors influence, and the durability of contacts of electronic components is measured for ensuring of their pressing.

  20. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated...... with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  1. Mechanism of hybrid-magnetic-circuit multi-couple motor

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    Discusses the interval between laminations in a permanent-magnet inductor motor which makes the air-gap magnetic field produced by the permanent magnet very uneven in the axial direction, and limits the performance of a motor. Proposes a hybrid-magnetic-circuit multi-couple motor to compensate for the uneven air-gap magnetic field, thereby improving the performance of a motor.

  2. Multimode circuit quantum electrodynamics with hybrid metamaterial transmission lines.

    Science.gov (United States)

    Egger, D J; Wilhelm, F K

    2013-10-18

    Quantum transmission lines are central to superconducting and hybrid quantum computing. In this work we show how coupling them to a left-handed transmission line allows circuit QED to reach a new regime: multimode ultrastrong coupling. Out of the many potential applications of this novel device, we discuss the preparation of multipartite entangled states and the simulation of the spin-boson model where a quantum phase transition is reached up to finite size effects.

  3. Design and implementation of a multi-sensor robot system for printed circuit board insertion

    Science.gov (United States)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.

  4. A multi-stage image charge detector made from printed circuit boards.

    Science.gov (United States)

    Barney, Brandon L; Daly, R Terik; Austin, Daniel E

    2013-11-01

    We present the first reported instance of an image-charge detector for charged particles in which detection elements are patterned onto printed circuit boards. In contrast to conventional techniques involving separately machined and positioned segments of metal tubing, this technique is much simpler to assemble, align, and connect to electrical wiring, with no loss in sensitivity. The performance of single-stage and 5-stage charge detectors is demonstrated using electrospray-charged, micrometer-size polystyrene spheres. Both velocity and charge of each particle are measured. Multiple detection stages--which require no extra effort to pattern or setup compared with a single stage--result in an ensemble averaging effect, improving the detection limit over what can be achieved with a single-stage detector. A comparison is made between the printed circuit board detector and a conventional tubular charge detector and found to be statistically equivalent. These results demonstrate and illustrate that devices for detection, analysis, and/or manipulation of charged particles and ions can be made using printed circuit boards rather than using separately fabricated metal electrodes.

  5. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill.

    Science.gov (United States)

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-Chun; Kim, Wonbaek

    2009-03-01

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of 5.0mm. The fractions of milled printed circuit boards of size zig-zag classifier. The >5.0mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards.

  6. Optimized circuit design for flexible 8-bit RFID transponders with active layer of ink-jet printed small molecule semiconductors

    NARCIS (Netherlands)

    Kjellander, B.K.C.; Smaal, W.T.T.; Myny, K.; Genoe, J.; Dehaene, W.; Heremans, P.; Gelinck, G.H.

    2013-01-01

    We ink-jet print a blend of 6,13-bis(triisopropyl-silylethynyl)pentacene and polystyrene as the active layer for flexible circuits. The discrete ink-jet printed transistors exhibit a saturation mobility of 0.5 cm2 V -1 s-1. The relative spread in transistor characteristics can be very large. This

  7. Printed, sub-3V digital circuits on plastic from aqueous carbon nanotube inks.

    Science.gov (United States)

    Ha, Mingjing; Xia, Yu; Green, Alexander A; Zhang, Wei; Renn, Mike J; Kim, Chris H; Hersam, Mark C; Frisbie, C Daniel

    2010-08-24

    Printing electronic components on plastic foils with functional liquid inks is an attractive approach for achieving flexible and low-cost circuitry for applications such as bendable displays and large-area sensors. The challenges for printed electronics, however, include characteristically slow switching frequencies and associated high supply voltages, which together impede widespread application. Combining printable high-capacitance dielectrics with printable high-mobility semiconductors could potentially solve these problems. Here we demonstrate fast, flexible digital circuits based on semiconducting carbon nanotube (CNT) networks and high-capacitance ion gel gate dielectrics, which were patterned by jet printing of liquid inks. Ion gel-gated CNT thin-film transistors (TFTs) with 50 microm channel lengths display ambipolar transport with electron and hole mobilities >20 cm(2)/V.s; these devices form the basis of printed inverters, NAND gates, and ring oscillators on both polyimide and SiO(2) substrates. Five-stage ring oscillators achieve frequencies >2 kHz at supply voltages of 2.5 V, corresponding to stage delay times of 50 micros. This performance represents a substantial improvement for printed circuitry fabricated from functional liquid inks.

  8. Preparation and characterization of superconductor thin films for application in printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Souza, G.A.; Carvalho, C.L.; Torsoni, G.B.; Rodrigues, V.D.; Souza, E.J.; Zadorosny, R. [UNESP, Ilha Solteira, SP (Brazil). Fac. de Engenharia. Grupo de Desenvolvimento e Aplicacoes de Materiais (GDAM)

    2011-07-01

    Full text: Since the discovery of high temperature superconductors (HTS) many studies have been performed, in terms to discover new materials with higher critical temperature and its potential applications. Technological advances have induced to use superconductor materials in the development of new devices that have higher processing speed, storage capacity and are miniaturized, what may imply in great evolution in the electronic area. Thinking about that advances and looking to supply some requirements, this work proposed to prepare a printed circuit board (PCB) with a superconductor thin film using an inexpensive and conventional photographic method. This work was divided in two steps: synthesis of the precursor solution and film preparation for superconductor printed circuit. In the preparation of superconductor thin film was considered to use the 2223 phase of the BSCCO system, which has been doped with Pb (BPSCCO) for stabilizing the same, and it presents a critical temperature around 110 K. This film was prepared from a precursor solution based on similar method developed by M. P. Pechini. The printed circuit was created by the photographic method of heat transfer which consisted of creation a circuit layout, with different dimensions and printed on photo paper (Epson S041140). The layout was transferred to the FR4 printed copper clad laminate was made with the household clothes iron. The precursor solution was deposited on Si substrate by spin-coating. The control of film thickness was performed by the deposition number that in this case was done five subsequent depositions to obtain an ideal thickness. Between each deposition the film was submitted to calcinations in order to eliminate organic matter. After that the film was submitted a heat treatment around 820 deg C / 5 minutes to obtain the expected superconducting phase and coupling and the grain growth. Film characterizations were made using optical microscopy, XRD and EDX, to check the dimensions and

  9. Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

    Science.gov (United States)

    Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

    2017-08-01

    In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

  10. Performance evaluation of an optical hybrid switch with circuit queued reservations and circuit priority preemption

    Science.gov (United States)

    Wong, Eric W. M.; Zukerman, Moshe

    2006-11-01

    We provide here a new loss model for an optical hybrid switch that can function as an optical burst switch and/or optical circuit switch. Our model is general as it considers an implementation whereby some of the circuits have preemptive priority over bursts and others are allowed to queue their reservations. We first present an analysis based on a 3-dimension state-space Markov chain that provides exact results for the blocking probabilities of bursts and circuits, the proportion of circuits that are delayed and the mean delay of the circuits that are delayed. Because it is difficult to exactly compute the blocking probability in realistic scenarios with a large number of wavelengths, we derive computationally a scalable and accurate approximations based on reducing the 3-dimension state space into a single dimension. These scalable approximations that can produce performance results in a fraction of a second can readily enable switch dimensioning. Extensive numerical results are presented to demonstrate the accuracy and the use of the new approximations.

  11. Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation Therefor

    NARCIS (Netherlands)

    Sridhar, A.; Perik, M.A.; Reiding, J.; Dijk, van D.J.; Akkerman, R.

    2009-01-01

    This paper describes the optimisation of the surface characteristics of a high-frequency substrate material widely used in the PCB (printed circuit board) industry by means of CF4/O2 plasma etching, in order to make it suitable for the fabrication of RF (radio frequency) circuit structures by a comb

  12. Hybrid 3D printing: a game-changer in personalized cardiac medicine?

    Science.gov (United States)

    Kurup, Harikrishnan K N; Samuel, Bennett P; Vettukattil, Joseph J

    2015-12-01

    Three-dimensional (3D) printing in congenital heart disease has the potential to increase procedural efficiency and patient safety by improving interventional and surgical planning and reducing radiation exposure. Cardiac magnetic resonance imaging and computed tomography are usually the source datasets to derive 3D printing. More recently, 3D echocardiography has been demonstrated to derive 3D-printed models. The integration of multiple imaging modalities for hybrid 3D printing has also been shown to create accurate printed heart models, which may prove to be beneficial for interventional cardiologists, cardiothoracic surgeons, and as an educational tool. Further advancements in the integration of different imaging modalities into a single platform for hybrid 3D printing and virtual 3D models will drive the future of personalized cardiac medicine.

  13. Properties and Application Perspective of Hybrid Titania-Silica Patterns Fabricated by Inkjet Printing.

    Science.gov (United States)

    Dzik, Petr; Veselý, Michal; Kete, Marko; Pavlica, Egon; Štangar, Urška Lavrenčič; Neumann-Spallart, Michael

    2015-08-01

    A hybrid titania-silica cold-setting sol has been developed that can be deposited onto a wide variety of surfaces without the need for high-temperature fixing and that is suitable for material printing deposition. Thin hybrid titania-silica coatings were patterned onto glass and PET substrates by inkjet printing. Well-defined hybrid titania-silica patterns, with thicknesses ranging from 40 to 400 nm, were fabricated by overprinting 1 to 10 layers. Excellent mechanical, optical, and photocatalytic properties were observed, making the reported material well suited for the fabrication of transparent self-cleaning coatings both on mineral and organic substrates. The printed patterns exhibit photoelectrochemical activity that can be further improved by thermal or photonic curing. A concept of fully printed interdigitated photoelectrochemical cells on flexible PET substrates utilizing the reported hybrid photocatalyst is disclosed as well.

  14. Toward printed integrated circuits based on unipolar or ambipolar polymer semiconductors.

    Science.gov (United States)

    Baeg, Kang-Jun; Caironi, Mario; Noh, Yong-Young

    2013-08-21

    For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge

  15. Utilization of MATLAB in Simulation of Linear Hybrid Circuits

    Directory of Open Access Journals (Sweden)

    L. Brancik

    2003-12-01

    Full Text Available In the paper a MATLAB-based method for simulating transientphenomena in linear hybrid circuits containing parts with both lumpedand distributed parameters is presented. Distributed parts of thecircuit are multiconductor transmission lines, which can generally benonuniform, with frequency-dependent parameters, and under nonzeroinitial voltage and/or current distributions. In principle a solutionis formulated using the modified nodal analysis method in the frequencydomain. Subsequently an improved fast method of the numerical inversionof Laplace transforms in the vector or matrix form is applied to obtainsolution in the time domain.

  16. Thermal eddy current testing of metallization quality of printed circuit boards (PCB)

    Science.gov (United States)

    Savushkin, D. G.; Polyahov, M. Y.; Chernov, L. A.

    2000-05-01

    Today the fissile thermal control methods are used often enough to evaluate the metallization quality of printed circuit boards. However, it is necessary to note that the existing difficulties while exciting a non-steady thermal wave. There was offered the thermal input, which allows us to supply heat through the upper edge of a metallizing tube and to register parameters of thermal disturbance from the opposite side. The thermal input represents a hollow metal cone where the thermal disturbance is suggested to be effectuated by eddy currents induced by a coil situated above the thermal input. The agitating current is a kind of radio pulse with a high frequency filling. The field frequency, thickness and the electromagnetic characteristics of the thermal input were selected so that the field couldn't propagate into space beneath the thermal input. It is possible to evaluate some parameters of the metallizing tube registering from the other side of the printed circuit board the thermal disturbance parameters (e.g. the arrival time of maximum and amplitude). The numerical calculations were made with a specially developed software with the purpose of obtaining the dependence of the arrival time of maximum and the thermal disturbance amplitude upon a printed circuit board metallization layer, the hole diameter, the board thickness, the metallization tube conductivity, the contact pad diameter. The heat exchange with the board material was not taken into account when making calculations because the thermal disturbance propagation time along the metallization tube is too short and this assumption does not make a considerable error.

  17. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    Energy Technology Data Exchange (ETDEWEB)

    Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

    2014-01-15

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

  18. Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers

    OpenAIRE

    Jang-Won Seo; Yoon-Ho Kim; Dongseon Kim; Young-Don Choi; Kyu-Jung Lee

    2015-01-01

    Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% an...

  19. Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

    Directory of Open Access Journals (Sweden)

    Araújo Manuel

    2016-01-01

    Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

  20. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

    Science.gov (United States)

    Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

    2016-07-05

    The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. Copyright © 2016 Elsevier B.V. All rights reserved.

  1. Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

    Science.gov (United States)

    Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

    2012-01-01

    This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

  2. Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards.

    Science.gov (United States)

    Hwang, S H; Lee, W-J; Lim, J W; Jung, K Y; Cha, K S; Rho, B S

    2008-05-26

    A new optical interconnection scheme based on a rigid flexible optical electrical printed circuit board (RFOE-PCB) is suggested. The easily installed RFOE-PCB can be universally applied for both chip- and board-level optical interconnections. This letter describes the detailed fabrication process, optical properties, and heat-resisting property of the RFOE-PCB. The fabricated RFOE-PCB was also successfully demonstrated with a 2.5-Gb/s data transmission through a 45 degrees-ended optical waveguide embedded in the RFOE-PCB.

  3. Enhanced pluggable out-of-plane coupling components for printed circuit board-level optical interconnections

    Science.gov (United States)

    Van Erps, J.; Heyvaert, S.; Debaes, C.; Van Giel, B.; Hendrickx, N.; Van Daele, P.; Thienpont, H.

    2008-04-01

    We present an enhanced out-of-plane coupling component for Printed Circuit Board-level optical interconnections. Rather than using a standard 45° micro-mirror to turn the light path over 90° we introduce a curvature in the mirror profile and incorporate an extra cylindrical micro-lens for beam collimation. Both modifications enable an increase in coupling efficiency and are extensively investigated using non-sequential ray tracing simulations in combination with Matlab optimization algorithms. The resulting design is fabricated using Deep Proton Writing and experimental characterization of the geometrical properties and measured coupling efficiencies are presented.

  4. Degradation of organic pollutants by Ag, Cu and Sn doped waste non-metallic printed circuit boards.

    Science.gov (United States)

    Ramaswamy, Kadari; Radha, Velchuri; Malathi, M; Vithal, Muga; Munirathnam, Nagegownivari R

    2017-02-01

    The disposal and reuse of waste printed circuit boards have been the major global concerns. Printed circuit boards, a form of Electronic waste (hereafter e-waste), have been chemically processed, doped with Ag(+), Cu(2+) and Sn(2+), and used as visible light photocatalysts against the degradation of methylene blue and methyl violet. The elemental analyses of pristine and metal doped printed circuit board were obtained using energy dispersive X-ray fluorescence (EDXRF) spectra and inductively coupled plasma optical emission spectroscopy (ICP-OES). The morphology of parent and doped printed circuit board was obtained from scanning electron microscopy (SEM) measurements. The photocatalytic activity of parent and metal doped samples was carried out for the decomposition of organic pollutants, methylene blue and methyl violet, under visible light irradiation. Metal doped waste printed circuit boards (WPCBs) have shown higher photocatalytic activity against the degradation of methyl violet and methylene blue under visible light irradiation. Scavenger experiments were performed to identify the reactive intermediates responsible for the degradation of methylene blue and methyl violet. The reactive species responsible for the degradation of MV and MB were found to be holes and hydroxyl radicals. A possible mechanism of degradation of methylene blue and methyl violet is given. The stability and reusability of the catalysts are also investigated.

  5. Packaging Printing Today

    OpenAIRE

    Bolanča, Stanislav; Majnarić, Igor; Golubović, Kristijan

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid print...

  6. Hybrid planar lightwave circuits for defense and aerospace applications

    Science.gov (United States)

    Zhang, Hua; Bidnyk, Serge; Yang, Shiquan; Balakrishnan, Ashok; Pearson, Matt; O'Keefe, Sean

    2010-04-01

    We present innovations in Planar Lightwave Circuits (PLCs) that make them ideally suited for use in advanced defense and aerospace applications. We discuss PLCs that contain no micro-optic components, no moving parts, pose no spark or fire hazard, are extremely small and lightweight, and are capable of transporting and processing a range of optical signals with exceptionally high performance. This PLC platform is designed for on-chip integration of active components such as lasers and detectors, along with transimpedance amplifiers and other electronics. These active components are hybridly integrated with our silica-on-silicon PLCs using fully-automated robotics and image recognition technology. This PLC approach has been successfully applied to the design and fabrication of multi-channel transceivers for aerospace applications. The chips contain hybrid DFB lasers and high-efficiency detectors, each capable of running over 10 Gb/s, with mixed digital and analog traffic multiplexed to a single optical fiber. This highlyintegrated functionality is combined onto a silicon chip smaller than 4 x 10 mm, weighing 125 degC, and more than 2,000 hours operating at 95 degC ambient air temperature. We believe that these recent advancements in planar lightwave circuits are poised to revolutionize optical communications and interconnects in the aerospace and defense industries.

  7. Design and implementation of a hybrid circuit system for micro sensor signal processing

    Energy Technology Data Exchange (ETDEWEB)

    Wang Zhuping; Chen Jing; Liu Ruqing, E-mail: wangzhuping169@163.com [School of Information and Electronics, Beijing Institute of Technology, Beijing 100081 (China)

    2011-04-15

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

  8. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    Science.gov (United States)

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed.

  9. Recovering metals from printed circuit board scrap by a mechanical separation process

    Institute of Scientific and Technical Information of China (English)

    XU Min; LI Guang-ming; HE Wen-zhi; LI Hui

    2008-01-01

    A mechanical separation process was developed for recovering metals from printed circuit board (PCB) scrap; it included three steps: impact crushing, sieving and fluidization separation. The mechanism of the technique was based on the difference in the crushabilities of metallic and nonmetallic materials in the PCBs that led to the concentrated distribution of metals in particles of larger sizes and nonmetals mostly in particles of smaller sizes. It was found that crushed PCB particles from 0.125 mm to 1.000 mm contained about 80% of metals in the PCBs. Metals acquired satisfactory liberation in particles smaller than 0.800 mm. The crushed PCB particles were sieved into fractions of different size ranges. Each fraction separately went through a gas-solid fluidized bed operating at a selected optimal gas velocity for the specific size range. Approximately 95% of metals in printed circuit board particles from 0.125 mm to 0.800 mm was recovered by the gas-fluidized bed separator at the selected optimal gas velocity. However, separation of metals from particles smaller than 0.125 mm was not satisfactory. Further study is needed on metal recovery from fine particles.

  10. Two-Phase Instability Characteristics of Printed Circuit Steam Generator for the Low Pressure Condition

    Energy Technology Data Exchange (ETDEWEB)

    Kang, Han-Ok; Han, Hun Sik; Kim, Young-In; Kim, Keung Koo [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

    2015-05-15

    Reduction of installation space for steam generators can lead to much smaller reactor vessel with resultant decrease of overall manufacturing cost for the components. A PCHE(Printed Circuit Heat Exchanger) is one of the compact types of heat exchangers available as an alternative to conventional shell and tube heat exchangers. Its name is derived from the procedure used to manufacture the flat metal plates that form the core of the heat exchanger, which is done by chemical milling. These plates are then stacked and diffusion bonded, converting the plates into a solid metal block containing precisely engineered fluid flow passages. PCSG(Printed Circuit Steam Generator) is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. For the introduction of new steam generator, design requirement for the two-phase flow instability should be considered. This paper describes two-phase flow instability characteristics of PCSG for the low pressure condition. PCSG is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. Interconnecting flow path was developed to mitigate the two-phase flow instability in the cold side. The flow characteristics of two-phase flow instability at the PCSG is examined experimentally in this study.

  11. Selective separation of copper over solder alloy from waste printed circuit boards leach solution.

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Firozi, Sadegh

    2017-02-01

    The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF4 leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF4 solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution.

  12. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Science.gov (United States)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  13. Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

    Science.gov (United States)

    Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

    2015-10-01

    The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible.

  14. Distribution of heavy metals during pyrolysis of waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    PENG Shao-hong; CHEN Lie-qiang; CAI Ming-zhao; WANG Yun-yu

    2006-01-01

    The volatilization behavior of Cu, Pb, Sn, Sb, Ni, Zn, Mn, Co, Cr, Cd during pyrolysis of waste printed circuit boards was investigated in a bench-scale fixed-bed pyrolysis system. It was found that volatility of heavy metals increases with operating temperature elevating, and bromine and vacuum have an obvious promoting effect on volatility of most of heavy metals. Over 99% weight of Cu and Ni are still remained in solid residue after pyrolysis, about 20% weight of Sb, Zn and Cd are transfered into liquid and gas during a pyrolysis process at 600 ℃, volatilization fractions of Pb, Sn, Mn, Co, Cr are less than 10% at the same conditions. The contents of heavy metals in liquid and gas products depend on not only volatility of metals, but also their initial contents in printed circuit boards, pyrolysis liquid and gas are primarily contaminated by Cu, Pb, Sn,Sb and Zn, their contents in liquid vary from 102 to 103 μg/mL, Mn, Co, Cr, Cd were detected only at very low level, less than 10 μg/mL.

  15. Radiation-tolerant, low-mass, high bandwidth, flexible printed circuit cables for particle physics experiments

    Science.gov (United States)

    McFadden, N. C.; Hoeferkamp, M. R.; Seidel, S.

    2016-09-01

    The design of meter long flexible printed circuit cables required for low-mass ultra-high speed signal transmission in the high radiation environment of the High Luminosity Large Hadron Collider is described. The design geometry is a differential embedded microstrip with 100 Ω nominal impedance. Minimal mass and maximal radiation hardness are pre-eminent considerations. Several dielectric materials are compared. To reduce mass, a cross hatched ground plane is applied. The long flexible printed circuit cables are characterized in bit error rate tests, attenuation versus frequency, mechanical response to temperature induced stress, and dimensional implications on radiation length. These tests are performed before and after irradiation with 1 MeV neutrons to 2×1016/cm2 and 800 MeV protons to 2×1016 1-MeV neutron equivalent/cm2. A 1.0 m Kapton cable with cross hatched ground plane, effective bandwidth of 4.976 gigabits per second, 0.0160% of a radiation length, and no detectable radiation-induced mechanical or electrical degradation is obtained.

  16. Radiation-tolerant, low-mass, high bandwidth, flexible printed circuit cables for particle physics experiments

    Energy Technology Data Exchange (ETDEWEB)

    McFadden, N.C.; Hoeferkamp, M.R.; Seidel, S.

    2016-09-11

    The design of meter long flexible printed circuit cables required for low-mass ultra-high speed signal transmission in the high radiation environment of the High Luminosity Large Hadron Collider is described. The design geometry is a differential embedded microstrip with 100 Ω nominal impedance. Minimal mass and maximal radiation hardness are pre-eminent considerations. Several dielectric materials are compared. To reduce mass, a cross hatched ground plane is applied. The long flexible printed circuit cables are characterized in bit error rate tests, attenuation versus frequency, mechanical response to temperature induced stress, and dimensional implications on radiation length. These tests are performed before and after irradiation with 1 MeV neutrons to 2×10{sup 16}/cm{sup 2} and 800 MeV protons to 2×10{sup 16} 1-MeV neutron equivalent/cm{sup 2}. A 1.0 m Kapton cable with cross hatched ground plane, effective bandwidth of 4.976 gigabits per second, 0.0160% of a radiation length, and no detectable radiation-induced mechanical or electrical degradation is obtained.

  17. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

    Energy Technology Data Exchange (ETDEWEB)

    Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

    2013-04-10

    Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  18. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Directory of Open Access Journals (Sweden)

    Ivănuş R.C.

    2010-06-01

    Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  19. Selective recovery of palladium from waste printed circuit boards by a novel non-acid process.

    Science.gov (United States)

    Zhang, Zhiyuan; Zhang, Fu-Shen

    2014-08-30

    An environmental benign, non-acid process was successfully developed for selective recovery of palladium from waste printed circuit boards (PCBs). In the process, palladium was firstly enriched during copper recovery procedure and dissolved in a special solution made of CuSO4 and NaCl. The dissolved palladium was then extracted by diisoamyl sulfide (S201). It was found that 99.4% of Pd(II) could be extracted from the solution under the optimum conditions (10% S201, A/O ratio 5 and 2min extraction). In the whole extraction process, the influence of base metals was negligible due to the relatively weak nucleophilic substitution of S201 with base metal irons and the strong steric hindrance of S201 molecular. Around 99.5% of the extracted Pd(II) could be stripped from S201/dodecane with 0.1mol/L NH3 after a two-stage stripping at A/O ratio of 1. The total recovery percentage of palladium was 96.9% during the dissolution-extraction-stripping process. Therefore, this study established a benign and effective process for selective recovery of palladium from waste printed circuit boards.

  20. Printed circuit board ion trap mass analyzer: its structure and performance.

    Science.gov (United States)

    Jiang, Dan; Jiang, Gong-Yu; Li, Xiao-Xu; Xu, Fu-Xing; Wang, Liang; Ding, Li; Ding, Chuan-Fan

    2013-06-18

    An ion trap (IT) mass analyzer can be simply built with low cost material-the printed circuit board (PCB). A printed circuit board ion trap (PCBIT) can perform ion trapping, mass analysis, and tandem mass spectrometry as a conventional ion trap mass analyzer. In a PCBIT, each PCB electrode was fabricated to specially designed patterns with several separate electric strips. The strips' electrodes were insulated from each other and applied with different voltages during the experiment. Therefore, the electric field distribution inside the ion trap region may be adjusted and optimized by simply adjusting the voltage on each strip. The performance of the PCBIT can also be optimized since the property of an ion trap is strongly dependent on the field distribution. The fabrication, operation, and performance of the PCBIT are described and characterized in this paper. A prototype PCBIT was built with two pairs of 64 mm × 12 mm PCB rectangular plates and one pair of 10 mm × 10 mm stainless steel square plates. A mass analysis with a resolving power of over 1500 and a mass range of around 3000 Th was observed. The mass-selected isolation and collision-induced dissociation (CID) of ions were also tested using the homemade PCBIT system. The adjustable electric field distribution, simple structure, and low cost of PCBIT make it certainly suitable for the further miniaturization of the portable mass spectrometer.

  1. Magnetic equivalent circuit model for unipolar hybrid excitation synchronous machine

    Directory of Open Access Journals (Sweden)

    Kupiec Emil

    2015-03-01

    Full Text Available Lately, there has been increased interest in hybrid excitation electrical machines. Hybrid excitation is a construction that combines permanent magnet excitation with wound field excitation. Within the general classification, these machines can be classified as modified synchronous machines or inductor machines. These machines may be applied as motors and generators. The complexity of electromagnetic phenomena which occur as a result of coupling of magnetic fluxes of separate excitation systems with perpendicular magnetic axis is a motivation to formulate various mathematical models of these machines. The presented paper discusses the construction of a unipolar hybrid excitation synchronous machine. The magnetic equivalent circuit model including nonlinear magnetization curves is presented. Based on this model, it is possible to determine the multi-parameter relationships between the induced voltage and magnetomotive force in the excitation winding. Particular attention has been paid to the analysis of the impact of additional stator and rotor yokes on above relationship. Induced voltage determines the remaining operating parameters of the machine, both in the motor and generator mode of operation. The analysis of chosen correlations results in an identification of the effective control range of electromotive force of the machine.

  2. High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

    2010-01-01

    A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

  3. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  4. Aerosol-jet-printed, 1 volt H-bridge drive circuit on plastic with integrated electrochromic pixel.

    Science.gov (United States)

    Ha, Mingjing; Zhang, Wei; Braga, Daniele; Renn, Michael J; Kim, Chris H; Frisbie, C Daniel

    2013-12-26

    In this report, we demonstrate a printed, flexible, and low-voltage circuit that successfully drives a polymer electrochromic (EC) pixel as large as 4 mm(2) that is printed on the same substrate. All of the key components of the drive circuitry, namely, resistors, capacitors, and transistors, were aerosol-jet-printed onto a plastic foil; metallic electrodes and interconnects were the only components prepatterned on the plastic by conventional photolithography. The large milliampere drive currents necessary to switch a 4 mm(2) EC pixel were controlled by printed electrolyte-gated transistors (EGTs) that incorporate printable ion gels for the gate insulator layers and poly(3-hexylthiophene) for the semiconductor channels. Upon application of a 1 V input pulse, the circuit switches the printed EC pixel ON (red) and OFF (blue) two times in approximately 4 s. The performance of the circuit and the behavior of the individual resistors, capacitors, EGTs, and the EC pixel are analyzed as functions of the printing parameters and operating conditions.

  5. On-chip single photon filtering and multiplexing in hybrid quantum photonic circuits.

    Science.gov (United States)

    Elshaari, Ali W; Zadeh, Iman Esmaeil; Fognini, Andreas; Reimer, Michael E; Dalacu, Dan; Poole, Philip J; Zwiller, Val; Jöns, Klaus D

    2017-08-30

    Quantum light plays a pivotal role in modern science and future photonic applications. Since the advent of integrated quantum nanophotonics different material platforms based on III-V nanostructures-, colour centers-, and nonlinear waveguides as on-chip light sources have been investigated. Each platform has unique advantages and limitations; however, all implementations face major challenges with filtering of individual quantum states, scalable integration, deterministic multiplexing of selected quantum emitters, and on-chip excitation suppression. Here we overcome all of these challenges with a hybrid and scalable approach, where single III-V quantum emitters are positioned and deterministically integrated in a complementary metal-oxide-semiconductor-compatible photonic circuit. We demonstrate reconfigurable on-chip single-photon filtering and wavelength division multiplexing with a foot print one million times smaller than similar table-top approaches, while offering excitation suppression of more than 95 dB and efficient routing of single photons over a bandwidth of 40 nm. Our work marks an important step to harvest quantum optical technologies' full potential.Combining different integration platforms on the same chip is currently one of the main challenges for quantum technologies. Here, Elshaari et al. show III-V Quantum Dots embedded in nanowires operating in a CMOS compatible circuit, with controlled on-chip filtering and tunable routing.

  6. Fabrication of Ultra-Thin Printed Organic TFT CMOS Logic Circuits Optimized for Low-Voltage Wearable Sensor Applications.

    Science.gov (United States)

    Takeda, Yasunori; Hayasaka, Kazuma; Shiwaku, Rei; Yokosawa, Koji; Shiba, Takeo; Mamada, Masashi; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

    2016-05-09

    Ultrathin electronic circuits that can be manufactured by using conventional printing technologies are key elements necessary to realize wearable health sensors and next-generation flexible electronic devices. Due to their low level of power consumption, complementary (CMOS) circuits using both types of semiconductors can be easily employed in wireless devices. Here, we describe ultrathin CMOS logic circuits, for which not only the source/drain electrodes but also the semiconductor layers were printed. Both p-type and n-type organic thin film transistor devices were employed in a D-flip flop circuit in the newly developed stacked structure and exhibited excellent electrical characteristics, including good carrier mobilities of 0.34 and 0.21 cm(2) V(-1) sec(-1), and threshold voltages of nearly 0 V with low operating voltages. These printed organic CMOS D-flip flop circuits exhibit operating frequencies of 75 Hz and demonstrate great potential for flexible and printed electronics technology, particularly for wearable sensor applications with wireless connectivity.

  7. Fabrication of Ultra-Thin Printed Organic TFT CMOS Logic Circuits Optimized for Low-Voltage Wearable Sensor Applications

    Science.gov (United States)

    Takeda, Yasunori; Hayasaka, Kazuma; Shiwaku, Rei; Yokosawa, Koji; Shiba, Takeo; Mamada, Masashi; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

    2016-05-01

    Ultrathin electronic circuits that can be manufactured by using conventional printing technologies are key elements necessary to realize wearable health sensors and next-generation flexible electronic devices. Due to their low level of power consumption, complementary (CMOS) circuits using both types of semiconductors can be easily employed in wireless devices. Here, we describe ultrathin CMOS logic circuits, for which not only the source/drain electrodes but also the semiconductor layers were printed. Both p-type and n-type organic thin film transistor devices were employed in a D-flip flop circuit in the newly developed stacked structure and exhibited excellent electrical characteristics, including good carrier mobilities of 0.34 and 0.21 cm2 V‑1 sec‑1, and threshold voltages of nearly 0 V with low operating voltages. These printed organic CMOS D-flip flop circuits exhibit operating frequencies of 75 Hz and demonstrate great potential for flexible and printed electronics technology, particularly for wearable sensor applications with wireless connectivity.

  8. Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

    Directory of Open Access Journals (Sweden)

    Rajeswari Packianathan

    2015-01-01

    Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

  9. Graphene/Si CMOS hybrid hall integrated circuits.

    Science.gov (United States)

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-07-07

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal amplifying/process ICs are manufactured via commercial 0.18 um silicon CMOS technology, and graphene Hall elements (GHEs) are fabricated on top of the passivation layer of the CMOS chip via a low-temperature micro-fabrication process. The sensitivity of the GHE on CMOS chip is further improved by integrating the GHE with the CMOS amplifier on the Si chip. This work not only paves the way to fabricate graphene/Si CMOS Hall ICs with much higher performance than that of conventional Hall ICs, but also provides a general method for scalable integration of graphene devices with silicon CMOS ICs via a low-temperature process.

  10. Hybrid circuit cavity quantum electrodynamics with a micromechanical resonator.

    Science.gov (United States)

    Pirkkalainen, J-M; Cho, S U; Li, Jian; Paraoanu, G S; Hakonen, P J; Sillanpää, M A

    2013-02-14

    Hybrid quantum systems with inherently distinct degrees of freedom have a key role in many physical phenomena. Well-known examples include cavity quantum electrodynamics, trapped ions, and electrons and phonons in the solid state. In those systems, strong coupling makes the constituents lose their individual character and form dressed states, which represent a collective form of dynamics. As well as having fundamental importance, hybrid systems also have practical applications, notably in the emerging field of quantum information control. A promising approach is to combine long-lived atomic states with the accessible electrical degrees of freedom in superconducting cavities and quantum bits (qubits). Here we integrate circuit cavity quantum electrodynamics with phonons. Apart from coupling to a microwave cavity, our superconducting transmon qubit, consisting of tunnel junctions and a capacitor, interacts with a phonon mode in a micromechanical resonator, and thus acts like an atom coupled to two different cavities. We measure the phonon Stark shift, as well as the splitting of the qubit spectral line into motional sidebands, which feature transitions between the dressed electromechanical states. In the time domain, we observe coherent conversion of qubit excitation to phonons as sideband Rabi oscillations. This is a model system with potential for a quantum interface, which may allow for storage of quantum information in long-lived phonon states, coupling to optical photons or for investigations of strongly coupled quantum systems near the classical limit.

  11. Graphene/Si CMOS Hybrid Hall Integrated Circuits

    Science.gov (United States)

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-07-01

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal amplifying/process ICs are manufactured via commercial 0.18 um silicon CMOS technology, and graphene Hall elements (GHEs) are fabricated on top of the passivation layer of the CMOS chip via a low-temperature micro-fabrication process. The sensitivity of the GHE on CMOS chip is further improved by integrating the GHE with the CMOS amplifier on the Si chip. This work not only paves the way to fabricate graphene/Si CMOS Hall ICs with much higher performance than that of conventional Hall ICs, but also provides a general method for scalable integration of graphene devices with silicon CMOS ICs via a low-temperature process.

  12. 3D Printed PEG-Based Hybrid Nanocomposites Obtained by Sol-Gel Technique.

    Science.gov (United States)

    Chiappone, Annalisa; Fantino, Erika; Roppolo, Ignazio; Lorusso, Massimo; Manfredi, Diego; Fino, Paolo; Pirri, Candido Fabrizio; Calignano, Flaviana

    2016-03-02

    In this work, three-dimensional (3D) structured hybrid materials were fabricated combining 3D printing technology with in situ generation of inorganic nanoparticles by sol-gel technique. Those materials, consisting of silica nanodomains covalently interconnected with organic polymers, were 3D printed in complex multilayered architectures, incorporating liquid silica precursors into a photocurable oligomer in the presence of suitable photoinitiators and exposing them to a digital light system. A post sol-gel treatment in acidic vapors allowed the in situ generation of the inorganic phase in a dedicated step. This method allows to build hybrid structures operating with a full liquid formulation without meeting the drawbacks of incorporating inorganic powders into 3D printable formulations. The influence of the generated silica nanoparticle on the printed objects was deeply investigated at macro- and nanoscale; the resulting light hybrid structures show improved mechanical properties and, thus, have a huge potential for applications in a variety of advanced technologies.

  13. Inkjet-printed zinc-tin-oxide TFTs with a solution-processed hybrid dielectric layer

    Science.gov (United States)

    Jang, Hye-Ryun; Kwack, Young-Jin; Choi, Woon-Seop

    2014-11-01

    Sol-gel TiO2 was synthesized and used as a gate dielectric for oxide thin-film transistors (TFTs). A hybrid gate insulator composed of sol-gel TiO2/thermally-grown SiO2 was applied to the inkjet-printed zinc-tin oxide (ZTO) TFTs for the first time. The electrical properties of an inkjet-printed ZTO TFT with a hybrid gate insulator show a mobility of 0.17 cm2/Vs, an on-to-off current ratio of 5 × 104, a subthreshold slope of 0.8 V/dec, and a threshold voltage of 0.6 V. The hybrid gate insulator for the inkjet-printed ZTO TFT shows a much improved operating voltage and subthreshold slope and a lower mobility compared to the SiO2 gate insulator.

  14. Waste minimization study for a printed circuit board manufacturing facility in Taiwan

    Energy Technology Data Exchange (ETDEWEB)

    Chiu, Shen-yann; Huang, Hann S.; Peters, R.W.; Tsai, S.Y. (Argonne National Lab., IL (USA)); Tsai, Wen-Tien; Shieh, Shih-Shien; Hsieh, Te-Yuan; Hwang, Li-Shyong (CTCI Corp., Taipei (Taiwan)); Liu, Solo; Peng, Chien-Tang (Printed Wire Corp., Ping Chen, Taoyuan (Taiwan)); Wu, Min H. (Waste Minimization Technology International, Inc., Pewaukee, WI (USA))

    1990-01-01

    This paper presents a demonstration of industrial waste minimization sponsored by the Environmental Protection Administration, Taiwan, Republic of China. Waste reduction opportunities are identified and evaluated for a printed circuit board manufacturing facility in Taiwan. Plant audits were conducted on various processes, such as deburring, alkaline etching, black oxidation, desmearing, electroless copper, and copper and tin/lead plating. Specific areas in which the wastes could be minimized, such as reducing the amount of dragout and rinse water requirements in the plating and etchant lines, and on-site treatment and reuse of spent bath solutions were identified, assessed, and implemented. Jar tests on the wastewater were performed, and the results were used to improve the efficiency of the wastewater treatment plant for removal of heavy metals and reduction of sludge generation. In addition, administrative controls of hazardous wastes designed to reduce associated health and environmental hazards were recommended. 4 figs., 9 tabs.

  15. Vibration suppression of printed circuit boards using an external particle damper

    Science.gov (United States)

    Veeramuthuvel, P.; Sairajan, K. K.; Shankar, K.

    2016-03-01

    Particle damping is an effective method of passive vibration control, of recent research interest. The novel use of particle damper capsule on a Printed Circuit Board (PCB) and the development of Radial Basis Function neural network to accurately predict the acceleration response is presented here. The prediction of particle damping using this neural network is studied in comparison with the Back Propagation Neural network. Extensive experiments are carried out on a PCB for different combinations of particle damper parameters such as particle size, particle density, packing ratio, and the input force during the primary modes of vibration and the obtained results are used for training and testing of neural networks. Based on the prediction from the better trained network, useful design guidelines for the particle damper suitable for PCB are arrived at. The effectiveness of particle dampers for vibration suppression of PCB under random vibration environment is demonstrated based on these design guidelines.

  16. Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

    Science.gov (United States)

    Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

    2012-06-01

    The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones.

  17. Elongating axial conduction path design to enhance performance of cryogeinc compact pche (printed circuit heat exchanger)

    Science.gov (United States)

    Baek, Seungwhan; Kim, Jinhyuck; Hwang, Gyuwan; Jeong, Sangkwon

    2012-06-01

    PCHE (Printed Circuit Heat Exchanger) is one of the promising cryogenic compact heat exchangers due to its compactness, high NTU and robustness. The essential procedure for fabricating PCHE is chemical etching and diffusion bonding. These technologies can create sufficiently large heat transfer area for a heat exchanger with numerous micro channels (Dhheat exchanger when it is operated with a large temperature difference. Elongating the heat conduction path is implemented to reduce axial conduction in PCHE in this study. Two PCHEs with identical channel configuration are fabricated, for comparison, one of which is modified to have longer heat conduction path. Both heat exchangers are tested in cryogenic environment (300~70 K), and the modified PCHE shows better performance with significantly reduced axial conduction. The experimental results indicate that the modification of the heat conduction path is effective to increase the performance of PCHE. This paper discusses and analyses the thermal characteristics of the modified PCHE obtained experimentally.

  18. Development of highly effective cryogenic printed circuit heat exchanger (PCHE) with low axial conduction

    Science.gov (United States)

    Baek, Seungwhan; Kim, Jin-Hyuck; Jeong, Sangkwon; Jung, Jeheon

    2012-07-01

    This paper presents the results of an experimental investigation of the thermal and hydraulic performance of a printed circuit heat exchanger (PCHE) for use in the cryogenic temperature region. Compact PCHEs with multiple corrugated, longitudinal flow microchannels were fabricated using chemical etching and diffusion bonding to evaluate their thermal and hydraulic performance. The testing of the PCHEs was conducted with helium gas at cryogenic temperatures. The pressure drop and thermal effectiveness values obtained from the measured pressures and temperatures are discussed. The thermal performance was predominantly affected by the axial conduction heat transfer in the low Reynolds number ranges of theses experiments. A simple performance calculation model is presented, and the effectiveness calculated from the model is compared with the experimental data. The design of the cryogenic PCHE was then modified to reduce axial conduction losses.

  19. Computer-aided interactive structural optimization of printed-circuit-board design

    Science.gov (United States)

    Duncan, L. B.; Holman, R. E.; Lagasse, B. K.; Sakamoto, L. W.; Sunada, W. H.

    Electronic equipment operating in severe vibration environments plays a critical role in military and aerospace hardware. A crucial element of most modularized electronic equipment is the printed circuit board (PCB). Structural failures of such boards are almost entirely the result of imposed mechanical vibration. It is desirable to incorporate structural guidelines and analysis techniques at an early stage in board development when deficiencies may easily be corrected. However, there are a number of problems connected with such an approach. A computer program has been developed to address the considered situation. The program is to reduce PCB structural analysis to a level readily understood by the average designer. Another objective of the program is to encourage use of structural analysis at an early stage of PCB design and development. Attention is given to board geometry, program organization, board response computation, and a sample problem.

  20. Quadrupole gradient coil design and optimization: a printed circuit board approach.

    Science.gov (United States)

    Chu, K; Rutt, B K

    1994-06-01

    Three different dual-axis quadrupole gradient coils for quantitative high resolution MR imaging of small animals, phantoms and specimens were designed and built using printed circuit board technology. Numerical optimization of the conductor positions was used to increase the volume of 0.4% gradient uniformity by up to a factor of four. In one coil, the volume of 5% gradient uniformity occupied 88% and 83% of the overall diameter and length of the coil, respectively. A systematic error of 0.5% in the wire placement was shown to cause a reduction in the volume of 0.4% gradient uniformity by a factor of two, though the region of 5% gradient uniformity was not significantly affected. Heat transfer calculations were used to determine maximum peak and root-mean-squared currents that could safely be applied to the coils.

  1. Products Made from Nonmetallic Materials Reclaimed from Waste Printed Circuit Boards

    Institute of Scientific and Technical Information of China (English)

    MOU Peng; XIANG Dong; DUAN Guanghong

    2007-01-01

    Printed circuit boards (PCBs) are in all electronic equipment, so with the sharp increase of electronic waste, the recovery of PCB components has become a critical research field. This paper presents a study of the reclaimation and reuse of nonmetallic materials recovered from waste PCBs. Mechanical processes, such as crushing, milling, and separation, were used to process waste PCBs. Nonmetallic materials in the PCBs were separated using density-based separation with separation rates in excess of 95%. The recovered nonmetals were used to make models, construction materials, composite boards, sewer grates,and amusement park boats. The PCB nonmetal products have better mechanical characteristics and durability than traditional materials and fillers. The flexural strength of the PCB nonmetallic material composite boards is 30% greater than that of standard products. Products derived from PCB waste processing have been brought into industrial production. The study shows that PCB nonmetals can be reused in profitable and environmentally friendly ways.

  2. Design of a 75-140 GHz high-pass printed circuit board dichroic filter

    Science.gov (United States)

    Kim, Dong Hwi; Mohyuddin, Wahab; Woo, Dong Sik; Choi, Hyun Chul; Kim, Kang Wook

    2017-03-01

    A new high-performing PCB (Printed Circuit Board) dichroic filter, which can be used for the KSTAR (Korea Superconducting Tokamak Advanced Research) electron cyclotron emission imaging system, is proposed. The current dichroic filter consists of a triangular lattice array of circular holes on the 6-mm thick metal plate, while circular hole spacing limitation caused relatively narrow passband (˜20 GHz). On the other hand, the proposed PCB dichroic filter utilizes the inexpensive commercial PCB fabrication process with a flexible adjustment of circular hole spacing. Therefore, the proposed PCB dichroic filter provides significantly wider passband (˜60 GHz with 0.84 dB insertion loss) with much reduced weight and expense. Also, it is shown that a steep skirt property can be obtained with the thick PCB filter substrate. The design process, fabrication, and measurement results of the new PCB dichroic filter are described.

  3. A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

    Science.gov (United States)

    Broadbent, H. A.; Ketterl, T. P.; Reid, C. S.

    2010-08-01

    The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm-1, 0.01 °C, and ±0.135 dbar, respectively.

  4. Note: Printed circuit board based electrically triggered compact rail gap switch.

    Science.gov (United States)

    Saxena, A K; Kaushik, T C; Goswami, M P; Gupta, Satish C

    2010-05-01

    An electrically triggered rail gap switch has been designed over a commercially available copper clad fiberglass sheet commonly used in making printed circuit boards for applications requiring compact design and direct integration to parallel plate transmission lines. Switch performance has been investigated in terms of its inductance, jitter, and gap closing time. With an electrode separation of 9.0 mm, it has been found to have an inductance of 6 nH, gap closing time of 5 ns, and jitter of about 4-10 ns measured at 95% of self-breakdown voltage. An application of this switch has been demonstrated as an electrically exploding foil accelerator developed over the same board and velocities up to 1.6 km/s have been achieved on Kapton flyers with diameter of 3.0 mm and thickness of 125 microm using a compact 1 microF capacitor bank.

  5. Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Mrazikova Anna

    2015-06-01

    Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

  6. The influence of novel organic gold complex on photoresist layers of printed circuit boards

    Directory of Open Access Journals (Sweden)

    Silvana Dimitrijević

    2015-12-01

    Full Text Available The goal of this paper was to study the influence of organic gold complex based on mercaptotriazole on photoresist layers used in manufacturing of printed circuit boards (PCBs. Investigations were performed by immersion the previously prepared boards in electrolytes with different pH values (pH=2, 4, 7, 9 and 12 at gold concentration of 2.5 g/dm3 and in gold complexes with different gold concentrations (1.5; 2.0; 2.5; 3.0 and 3.5 g/dm3 at pH value of pH=9. Investigations showed that photoresist layers on boards are the most resistant at optimal operating conditions, pH=9 and concentration of gold of 2.5 g/dm3.

  7. Mapping small intestine bioelectrical activity using high-resolution printed-circuit-board electrodes.

    Science.gov (United States)

    Angeli, Timothy R; O'Grady, Gregory; Erickson, Jonathan C; Du, Peng; Paskaranandavadivel, Niranchan; Bissett, Ian P; Cheng, Leo K; Pullan, Andrew J

    2011-01-01

    In this study, novel methods were developed for the in-vivo high-resolution recording and analysis of small intestine bioelectrical activity, using flexible printed-circuit-board (PCB) electrode arrays. Up to 256 simultaneous recordings were made at multiple locations along the porcine small intestine. Data analysis was automated through the application and tuning of the Falling-Edge Variable-Threshold algorithm, achieving 92% sensitivity and a 94% positive-predictive value. Slow wave propagation patterns were visualized through the automated generation of animations and isochronal maps. The methods developed and validated in this study are applicable for use in humans, where future studies will serve to improve the clinical understanding of small intestine motility in health and disease.

  8. Application of printed circuit board technology to FT-ICR MS analyzer cell construction and prototyping.

    Science.gov (United States)

    Leach, Franklin E; Norheim, Randolph; Anderson, Gordon; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICR MS) remains the mass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field's inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  9. Design of a smart ECG garment based on conductive textile electrode and flexible printed circuit board.

    Science.gov (United States)

    Cai, Zhipeng; Luo, Kan; Liu, Chengyu; Li, Jianqing

    2017-08-09

    A smart electrocardiogram (ECG) garment system was designed for continuous, non-invasive and comfortable ECG monitoring, which mainly consists of four components: Conductive textile electrode, garment, flexible printed circuit board (FPCB)-based ECG processing module and android application program. Conductive textile electrode and FPCB-based ECG processing module (6.8 g, 55 mm × 53 mm × 5 mm) are identified as two key techniques to improve the system's comfort and flexibility. Preliminary experimental results verified that the textile electrodes with circle shape, 40 mm size in diameter, and 5 mm thickness sponge are best suited for the long-term ECG monitoring application. The tests on the whole system confirmed that the designed smart garment can obtain long-term ECG recordings with high signal quality.

  10. STUDY ON INFRARED PBS DETECTOR PREPARED USING COPPER ELECTRODES OF PRINTED CIRCUIT BOARD

    Directory of Open Access Journals (Sweden)

    Hariyadi Soetedjo

    2013-01-01

    Full Text Available Copper layers of Printed Circuit Board (PCB have been used as electrodes for PbS infrared structure detector to introduce low cost and simple in preparation. PbS deposition as an active layer detector has been prepared for a few micrometers in thickness using an evaporation technique under vacuum pressure at 10-6 Torr. Photoconductivity phenomenon has been observed from the measurement when IR radiation of a Tungsten lamp introduced to the detector. The sensitivity of the detector respects to the variation of radiation intensities was also observed. The results showed that the detector has good sensitivity indicated by rapid drop voltages at a short-wavelength IR region (1-3 µm. This phenomenon is encouraging for further applications of detector prepared using the electrodes from a commercialized PCB.

  11. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery

    Directory of Open Access Journals (Sweden)

    Salmiaton Ali

    2014-10-01

    Full Text Available Scrap printed circuit boards (PCBs are the most abundant wastes that can be found in the landfills in Malaysia and this disposal certainly poses serious detrimental to the environment. This research aims to investigate optimum temperature for pyrolyzing waste PCBs, find out the best catalyst to be used in accelerating PCBs’ pyrolysis, select suitable ratio of catalyst to PCBs for higher oil yield and examine kinetics pyrolysis of the waste PCBs’ decomposition. Operating temperatures ranged from 200 to 350 ˚C of PCB’s pyrolysis were conducted with the optimum temperature obtained was 275 ˚C. Fluid cata-lytic cracking (FCC catalyst, zeolite socony mobil-5 (ZSM-5, H-Y-type zeolite and dolomite were used to accelerate PCB’s pyrolysis at 275 ˚C and FCC was identified as the best catalyst to be used. Differ-ent ratios of FCC to waste PCBs such as 10:90, 20:80, 30:70, 40:60 and 50:50 were applied in the pyro-lysis at 275 ˚C and ratio of 10:90 was selected as the suitable ratio to be utilized for maximum yield. The kinetic study was done through thermogravimetric analysis on waste PCBs under various heating rates and different particle sizes. The GC-MS analysis revealed that compounds detected in the pyro-oil have the potential to be used as fuel. © 2014 BCREC UNDIP. All rights reservedReceived: 23rd July 2014; Revised: 14th August 2014; Accepted: 14th August 2014 How to Cite: Ng, C.H., Salmiaton, A., Hizam, H. (2014. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery. Bulletin of Chemical Reaction Engineering & Catalysis, 9 (3: 224-240. (doi:10.9767/bcrec.9.3.7148.224-240 Permalink/DOI: http://dx.doi.org/10.9767/bcrec.9.3.7148.224-240

  12. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    Energy Technology Data Exchange (ETDEWEB)

    Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

  13. Full Scale Thermo-hydraulic Simulation of a Helium-Helium Printed Circuit Heat Exchanger

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Injun; Hong, Sungyull; Bai, Cheolho; Shim, Jaesool [Yeungnam Univ., Gyeongsan (Korea, Republic of); Kim, Chansoo; Hong, Sungdeok; Kim, Minhwan [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

    2014-05-15

    In this paper, the thermo-hydraulic full scale simulation is performed to study the temperature distributions, thermal stress, pressure drop and outlet temperature in a Helium-Helium printed circuit heat exchanger (PCHE) in a VHTR simulate helium loop. The entire PCHE is composed of 40 stacks of rectangular shaped micro-channels for helium gas [type A] (inlet temperature, 400 .deg. C) and 40 stacks of semi-ellipse shaped micro-channels for helium [type B] (inlet temperature, 300 .deg. C). The experimental result is compared to that of computer simulation, COMSOL multi-physics software. The Helium-Helium PCHE is considered a prototype of the newly developed PCHE by Korea Atomic Energy Research Institute (KAERI). The full scale thermo-hydraulic simulation was successfully performed to obtain temperature distribution, pressure drop and thermal stress in 40 sets of flow channel stacks in a helium-helium printed circuit heat exchanger in a VHTR simulate helium loop. We obtained a quite similar temperature distribution with the 3D measured infrared temperature distribution. To our knowledge, this is the first full scale numerical study on the PCHE, which considers all microchannels, that the convection effect on the outside surfaces of the PCHE is applied. The very high-temperature reactor (VHTR) or high-temperature gas-cooled reactor(HTGR) is a fourth-generation nuclear power reactor that uses the ceramic coated fuel, TRISO, in which the fission gas does not leak even at temperatures higher than 1600 .deg. C. The VHTR necessarily requires an intermediate loop composed of a hot gas duct (HGD), an intermediate heat exchanger (IHX) and a process heat exchanger (PHE). The IHX is one of the important components of VHTR system because the IHX transfers the 950 .deg. C of high temperature massive heat to a hydrogen production plant or power conversion unit at high system pressure.

  14. New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

    Science.gov (United States)

    Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

    2017-03-23

    Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance.

  15. Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates

    NARCIS (Netherlands)

    Sridhar, A.; Reiding, J.; Adelaar, H.; Achterhoek, F.; Dijk, van D.J.; Akkerman, R.

    2009-01-01

    In this paper, a method to fabricate radio frequency (RF) circuit structures is described. This method involves inkjet printing of a silver nanoparticle-based ink on a functional substrate material to create the seed track (i.e., the seed layer), onto which copper is subsequently deposited by an ele

  16. Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

    NARCIS (Netherlands)

    Palacios-Aguilera, N.B.; Bastemeijer, J.; Mollinger, J.R.; Bossche, A.; Mokkapati, V.R.S.S.; Visser, Roy; Akkerman, Remko

    2012-01-01

    Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit

  17. SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

    Directory of Open Access Journals (Sweden)

    Maciej Thomas

    2014-10-01

    Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

  18. Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

    Science.gov (United States)

    California State Univ., Sacramento. Dept. of Civil Engineering.

    One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

  19. Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane

    DEFF Research Database (Denmark)

    Franek, Ondrej; Sørensen, Morten; Ebert, Hans

    2012-01-01

    Model of a generic printed circuit board (PCB) in a presence of a finite-sized metallic ground plane is introduced as a commonly occurring scenario of electronic module whose electromagnetic fields are disturbed by a nearby object. Finite-difference time-domain simulations are performed...

  20. Design and implementation of a hybrid circuit system for micro sensor signal processing*

    Institute of Scientific and Technical Information of China (English)

    Wang Zhuping; Chen Jing; Liu Ruqing

    2011-01-01

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design.Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system.

  1. Fabrication of Nonsintered Alumina-Resin Hybrid Films by Inkjet-Printing Technology

    Science.gov (United States)

    Jang, Hun Woo; Kim, Jihoon; Kim, Hyo-tae; Yoon, Youngjoon; Lee, Sung-nam; Hwang, Haejin; Kim, Jonghee

    2010-07-01

    We used the inkjet printing to fabricate alumina-resin hybrid films without a high temperature sintering process. Single- and co-solvent ink systems showing different evaporation behaviors were formulated in order to understand their impacts on the inkjet-printing of the alumina dots, lines, and films. The packing densities of the inkjet-printed alumina films from both ink systems were around 60% which is higher than the value obtained by other conventional methods. Since the high temperature sintering process was avoided, the polymer-resin was infiltrated through the inkjet-printed alumina films by the same inkjet printing as a binder. The microstructures of these hybrid films were investigated in order to confirm if the microvoids in the films were filled with the resin. The dielectric properties of these hybrid films such as relative permittivity and Q-value were measured in order to assess if these hybrid materials is applicable to three-dimensional (3D) system integration as ceramic package substrates.

  2. An electrical model of VCSEL as optical transmitter for optical printed circuit board

    Science.gov (United States)

    Kim, Do-Kyoon; Yoon, Young-Seol; Choi, Jin-Ho; Kim, Kyung-Min; Choi, Young-Wan; Lee, Seok

    2005-03-01

    Optical interconnection is recent issue for high-speed data transmission. The limitation of high-speed electrical data transmission is caused by impedance mismatching, electric field coupling, microwave loss, and different length of the electrical signal lines. To overcome these limitations, the electrical signal in the current electrical system has to be changed by the optical signal. The most suitable optical source in the OPCB (Optical Printed Circuit Board) is VCSEL (Vertical Cavity Surface Emitting Lasers) that is low-priced and has the characteristic of vertical surface emitting. In this paper, we propose an electrical model of the VCSEL as E/O converting devices for the OPCB. The equivalent circuit of the VCSEL based on the rate equations includes carrier dynamics and material properties. The rate equation parameters are obtained by full analysis based on rate equation and experiment results. The electrical model of the VCSEL has the series resistance determined by I-V characteristic curve, and the parallel capacitance by the parasitic response of the VCSEL chip. The bandwidth of the optical interconnection is analyzed considering those parameters. We design and fabricate the optical transmitter for OPCB considering proposed electrical model of VCSEL.

  3. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    Science.gov (United States)

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

  4. An Architecture for Hybrid Manufacturing Combining 3D Printing and CNC Machining

    OpenAIRE

    Marcel Müller; Elmar Wings

    2016-01-01

    Additive manufacturing is one of the key technologies of the 21st century. Additive manufacturing processes are often combined with subtractive manufacturing processes to create hybrid manufacturing because it is useful for manufacturing complex parts, for example, 3D printed sensor systems. Currently, several CNC machines are required for hybrid manufacturing: one machine is required for additive manufacturing and one is required for subtractive manufacturing. Disadvantages of conventional h...

  5. An Architecture for Hybrid Manufacturing Combining 3D Printing and CNC Machining

    OpenAIRE

    Marcel Müller; Elmar Wings

    2016-01-01

    Additive manufacturing is one of the key technologies of the 21st century. Additive manufacturing processes are often combined with subtractive manufacturing processes to create hybrid manufacturing because it is useful for manufacturing complex parts, for example, 3D printed sensor systems. Currently, several CNC machines are required for hybrid manufacturing: one machine is required for additive manufacturing and one is required for subtractive manufacturing. Disadvantages of conventional h...

  6. Applications of three-dimensional (3D) printing for microswimmers and bio-hybrid robotics.

    Science.gov (United States)

    Stanton, M M; Trichet-Paredes, C; Sánchez, S

    2015-04-07

    This article will focus on recent reports that have applied three-dimensional (3D) printing for designing millimeter to micrometer architecture for robotic motility. The utilization of 3D printing has rapidly grown in applications for medical prosthetics and scaffolds for organs and tissue, but more recently has been implemented for designing mobile robotics. With an increase in the demand for devices to perform in fragile and confined biological environments, it is crucial to develop new miniaturized, biocompatible 3D systems. Fabrication of materials at different scales with different properties makes 3D printing an ideal system for creating frameworks for small-scale robotics. 3D printing has been applied for the design of externally powered, artificial microswimmers and studying their locomotive capabilities in different fluids. Printed materials have also been incorporated with motile cells for bio-hybrid robots capable of functioning by cell contraction and swimming. These 3D devices offer new methods of robotic motility for biomedical applications requiring miniature structures. Traditional 3D printing methods, where a structure is fabricated in an additive process from a digital design, and non-traditional 3D printing methods, such as lithography and molding, will be discussed.

  7. Performance of a Y-Ba-Cu-O superconducting filter/GaAs low noise amplifier hybrid circuit

    Science.gov (United States)

    Bhasin, Kul B.; Toncich, S. S.; Chorey, C. M.; Bonetti, R. R.; Williams, A. E.

    1992-01-01

    A superconducting 7.3 GHz two-pole microstrip bandpass filter and a GaAs low noise amplifier (LNA) were combined into a hybrid circuit and characterized at liquid nitrogen temperatures. This superconducting/seismology circuit's performance was compared to a gold filter/GaAs LNA hybrid circuit. The superconducting filter/GaAs LNA hybrid circuit showed higher gain and lower noise figure than its gold counterpart.

  8. Generation of copper rich metallic phases from waste printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Cayumil, R. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Khanna, R., E-mail: ritakhanna@unsw.edu.au [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Ikram-Ul-Haq, M.; Rajarao, R. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Hill, A. [CSIRO Process Science and Engineering, Clayton, Melbourne, VIC 3168 (Australia); Sahajwalla, V. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia)

    2014-10-15

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  9. Evaluation of gold and silver leaching from printed circuit board of cellphones

    Energy Technology Data Exchange (ETDEWEB)

    Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  10. Design and Implementation of a Hybrid SET-CMOS Based Sequential Circuits

    Directory of Open Access Journals (Sweden)

    Anindya Jana

    2012-05-01

    Full Text Available Single Electron Transistor is a hot cake in the present research area of VLSI design and Microelectron-ics technology. It operates through one-by-one tunneling of electrons through the channel, utilizing the Coulomb blockade Phenomenon. Due to nanoscale feature size, ultralow power dissipation, and unique Coulomb blockade oscillation characteristics it may replace Field Effect Transistor FET. SET is very much advantageous than CMOS in few points. And in few points CMOS is advantageous than SET. So it has been seen that Combination of SET and CMOS is very much effective in the nanoscale, low power VLSI circuits. This paper has given a idea to make different sequential circuits using the Hybrid SET-CMOS. The MIB model for SET and BSIM4 model for CMOS are used. The operations of the proposed circuits are verified in Tanner environment. The performances of CMOS and Hybrid SET-CMOS based circuits are compared. The hybrid SET-CMOS circuit is found to consume lesser power than the CMOS based circuit. Further it is established that hybrid SET-CMOS based circuit is much faster compared to CMOS based circuit.

  11. Reduced 30% scanning time 3D multiplexer integrated circuit applied to large array format 20KHZ frequency inkjet print heads

    CERN Document Server

    Liou, J -C

    2008-01-01

    Enhancement of the number and array density of nozzles within an inkjet head chip is one of the keys to raise the printing speed and printing resolutions. However, traditional 2D architecture of driving circuits can not meet the requirement for high scanning speed and low data accessing points when nozzle numbers greater than 1000. This paper proposes a novel architecture of high-selection-speed three-dimensional data registration for inkjet applications. With the configuration of three-dimensional data registration, the number of data accessing points as well as the scanning lines can be greatly reduced for large array inkjet printheads with nozzles numbering more than 1000. This IC (Integrated Circuit) architecture involves three-dimensional multiplexing with the provision of a gating transistor for each ink firing resistor, where ink firing resistors are triggered only by the selection of their associated gating transistors. Three signals: selection (S), address (A), and power supply (P), are employed toge...

  12. Testing to Investigate Stress-LifetimeCharacteristics of High Voltage Printed Circuit Boards

    Science.gov (United States)

    El Korashy, Oliver; Franke, Andreas; Gollor, Matthias

    2014-08-01

    Printed circuit boards (PCBs) are typically used in all electronic equipment, including those conditioning or controlling high voltage (HV) for space satellite applications. With the use of new subsystems that require higher voltages (generally several hundred volts up to tens of kV), stress-lifetime issues are becoming more complex. In order to allow compact design and cost efficient production of HV modules, there is an increasing demand to improve the design of PCBs with encapsulation or conformal coating at higher voltages.Within a PCB there are a number of electrical field interfaces each of which can have individual stress- lifetime characteristics, and the influence of environmental aging should also be considered, which means a large number of sample types should be tested to gain experimental evidence to define the margin for each interface. This paper demonstrates a method to test multiple samples at a fixed DC voltage stress until the event of a breakdown, and presents test results from 6 single-sided encapsulated PCB samples.

  13. Converting non-metallic printed circuit boards waste into a value added product.

    Science.gov (United States)

    Muniyandi, Shantha Kumari; Sohaili, Johan; Hassan, Azman; Mohamad, Siti Suhaila

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0-30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites.

  14. Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

    Science.gov (United States)

    Lahokallio, Sanna; Saarinen, Kirsi; Frisk, Laura

    2013-09-01

    The tendency of polymers to absorb moisture impairs especially their electrical and mechanical properties. These are important characteristics for printed circuit board (PCB) materials, which should provide mechanical support as well as electrical insulation in many different environments in order to guarantee safe operation for electrical devices. Moreover, the effects of moisture are accelerated at increased temperatures. In this study, three flexible PCB dielectric materials, namely polyimide (PI), fluorinated ethylene-propylene (FEP), and polyethylene terephthalate (PET), were aged over different periods of time in a high-humidity test, in which the temperature was 85°C and relative humidity 85%. After aging, the changes in the structure of the polymers were studied by determining different material parameters such as modulus of elasticity, glass-transition temperature, melting point, coefficient of thermal expansion, water absorption, and crystallinity, and changes in the chemical structure with several techniques including thermomechanical analysis, differential scanning calorimetry, Fourier-transform infrared spectroscopy, moisture analysis, and a precision scale. The results showed that PI was extremely stable under the aging conditions and therefore an excellent choice for electrical applications under harsh conditions. Similarly, FEP proved to be relatively stable under the applied aging conditions. However, its crystallinity increased markedly during aging, and after 6000 h of aging the results indicated oxidation. PET suffered from hydrolysis during the test, leading to its embrittlement after 2000 h of aging.

  15. Catalytic pyrolysis characteristics of scrap printed circuit boards by TG-FTIR.

    Science.gov (United States)

    Zhao, Chunhu; Zhang, Xiaoping; Shi, Lin

    2017-03-01

    In the present work, pyrolysis and catalytic pyrolysis of waste printed circuit boards (WPCBs) was carried out in the coupling of Thermo Gravimetric Analysis and Fourier Transform Infrared Spectroscopy (TG-FTIR) under nitrogen atmosphere. The reaction temperature was increased from 30 to 700°C, while the heating rates were varied from 10 to 40°C/min. Experimental results show that the effect of catalyst on the WPCBs particles pyrolysis was significance. Compared with another two combustion-supporting agents (MgO, CaO), the whole pyrolysis process was optimized when the catalyst ZSM-5 was added into the WPCBs particles. The distributed activation energy model (DAEM) was used to analyze the kinetic parameters of the WPCBs pyrolysis. It was found that values of frequency factor (k0) changed with different activation energy (E) values during pyrolysis process. The activation energy values range from 129.15 to 280.53kJ/mol, and the frequency factor values range from 9.02×10(10) to 4.21×10(22)s(-1). The generated major products for the catalytic pyrolysis of WPCBs were H2, CO2, CO, H2O, phenols and aromatics.

  16. Studies on the reuse of waste printed circuit board as an additive for cement mortar.

    Science.gov (United States)

    Ban, Bong-Chan; Song, Jong-Yoon; Lim, Joong-Yeon; Wang, Soo-Kyoon; An, Kwang-Guk; Kim, Dong-Su

    2005-01-01

    The recent development in electronic industries has generated a drastic increase in production of printed circuit boards (PCB). Accordingly, the amount of waste PCB from electronic productions and waste electronics and its environmental impact such as soil and groundwater contamination have become a great concern. This study aims to propose a method for reuse of waste PCB as an additive for cement mortar. Although the expansibility of waste PCB powder finer than 0.08 mm in water was observed to be greater than 2.0%, the maximum expansion rates in water for 0.08 to approximately 0.15 and 0.15 to approximately 0.30 mm sized PCB powders were less than 2.0%, which satisfied the necessary condition as an alternative additive for cement mortar in place of sand. The difference in the compressive strength of standard mortar and waste PCB added mortar was observed to be less than 10% and their difference was expected to be smaller after prolonged aging. The durability of waste PCB added cement mortar was also examined through dry/wet conditioning cyclic tests and acidic/alkaline conditioning tests. From the tests, both weight and compressive strength of cement mortar were observed to be recovered with aging. The leaching test for heavy metals from waste PCB added mortar showed that no heavy metal ions such as copper, lead, or cadmium were detected in the leachate, which resulted from fixation effect of the cement hydrates.

  17. Evaluation of gold and silver leaching from printed circuit board of cellphones.

    Science.gov (United States)

    Petter, P M H; Veit, H M; Bernardes, A M

    2014-02-01

    Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added.

  18. Conversion of bromine during thermal decomposition of printed circuit boards at high temperature.

    Science.gov (United States)

    Jin, Yu-qi; Tao, Lin; Chi, Yong; Yan, Jian-hua

    2011-02-15

    The conversion of bromine during the thermal decomposition of printed circuit boards (PCBs) was investigated at isothermal temperatures ranging from 800°C to 1100°C by using a quartz tube furnace. The influence of temperature, oxygen concentrations (0%, 10% and 21% in the nitrogen-oxygen atmosphere) and content of steam on conversion of bromine was studied. With the increment of temperature, the conversion from organic bromine in the PCBs to inorganic bromine in the gaseous fraction increased from 69.0% to 96.4%. The bromine was mainly evolved as HBr and Br(2) in oxidizing condition and the Br(2)/HBr mass ratio increased at stronger oxidizing atmosphere. The experimental results also indicated that the existence of steam can reduce the formation of Br(2). Furthermore, co-combustion of PCBs with S and CaO, both as addition agents, was investigated, respectively. In the presence of SO(2), Br(2)/HBr mass ratio obviously decreased. Moreover, the utilization of calcium oxide can efficiently promote the conversion of organic bromine to inorganic bromine. According to the experimental results, incinerating PCBs at high temperature can efficiently destroy the organobrominated compounds that are considered to be possible precursors of polybrominated dibenzeo-p-dioxins and dibenzofurans (PBDD/Fs), but the Br(2) and HBr in flue gas should be efficiently controlled.

  19. Layer modeling of zinc removal from metallic mixture of waste printed circuit boards by vacuum distillation.

    Science.gov (United States)

    Gao, Yujie; Li, Xingang; Ding, Hui

    2015-08-01

    A layer model was established to elucidate the mechanism of zinc removal from the metallic mixture of waste printed circuit boards by vacuum distillation. The removal process was optimized by response surface methodology, and the optimum operating conditions were the chamber pressure of 0.1Pa, heating temperature of 923K, heating time of 60.0min, particle size of 70 mesh (0.212mm) and initial mass of 5.25g. Evaporation efficiency of zinc, the response variable, was 99.79%, which indicates that the zinc can be efficiently removed. Based on the experimental results, a mathematical model, which bears on layer structure, evaporation, mass transfer and condensation, interprets the mechanism of the variable effects. Especially, in order to reveal blocking effect on the zinc removal, the Blake-Kozeny-Burke-Plummer equation was introduced into the mass transfer process. The layer model can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2015 Elsevier Ltd. All rights reserved.

  20. Recycling of waste printed circuit boards: a review of current technologies and treatment status in China.

    Science.gov (United States)

    Huang, Kui; Guo, Jie; Xu, Zhenming

    2009-05-30

    From the use of renewable resources and environmental protection viewpoints, recycling of waste printed circuit boards (PCBs) receives wide concerns as the amounts of scrap PCBs increases dramatically. However, treatment for waste PCBs is a challenge due to the fact that PCBs are diverse and complex in terms of materials and components makeup as well as the original equipment's manufacturing processes. Recycle technology for waste PCBs in China is still immature. Previous studies focused on metals recovery, but resource utilization for nonmetals and further separation of the mixed metals are relatively fewer. Therefore, it is urgent to develop a proper recycle technology for waste PCBs. In this paper, current status of waste PCBs treatment in China was introduced, and several recycle technologies were analyzed. Some advices against the existing problems during recycling process were presented. Based on circular economy concept in China and complete recycling and resource utilization for all materials, a new environmental-friendly integrated recycling process with no pollution and high efficiency for waste PCBs was provided and discussed in detail.

  1. Prioritizing material recovery for end-of-life printed circuit boards.

    Science.gov (United States)

    Wang, Xue; Gaustad, Gabrielle

    2012-10-01

    The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  2. A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid.

    Science.gov (United States)

    Zeng, Xianlai; Li, Jinhui; Xie, Henghua; Liu, Lili

    2013-10-01

    Recycling processes for waste printed circuit boards (WPCBs) have been well established in terms of scientific research and field pilots. However, current dismantling procedures for WPCBs have restricted the recycling process, due to their low efficiency and negative impacts on environmental and human health. This work aimed to seek an environmental-friendly dismantling process through heating with water-soluble ionic liquid to separate electronic components and tin solder from two main types of WPCBs-cathode ray tubes and computer mainframes. The work systematically investigates the influence factors, heating mechanism, and optimal parameters for opening solder connections on WPCBs during the dismantling process, and addresses its environmental performance and economic assessment. The results obtained demonstrate that the optimal temperature, retention time, and turbulence resulting from impeller rotation during the dismantling process, were 250 °C, 12 min, and 45 rpm, respectively. Nearly 90% of the electronic components were separated from the WPCBs under the optimal experimental conditions. This novel process offers the possibility of large industrial-scale operations for separating electronic components and recovering tin solder, and for a more efficient and environmentally sound process for WPCBs recycling.

  3. Metals Recovery from Fine Printed Circuit Boards Using Falcon SB Concentrator

    Institute of Scientific and Technical Information of China (English)

    WEN Xue-feng; ZHAO Yue-min; PAN Yan-jun; HE Ya-qun; SONG Shu-lei; WANG Zhuo-ya

    2005-01-01

    Physical methods show great potential and advantages on comprehensive reutilization of waste printed circuit boards (PCBs) because of lower investment and operation cost, higher efficiency and environment friendliness. However, metals contained in fine fraction of PCBs cannot be recovered effectively by conventional equipments such as high tension electrostatic separator or shaking table. In the paper, this conundrum was resolved successfully with the enhanced Falcon SB concentrator. The separation mechanism of Falcon SB concentrator was analyzed and main factors affecting separation efficiency such as magnitude of rotation frequency of bowl, water counter pressure and slurry concentration of feed were studied and interaction of factors above also were investigated using Design-Expert software. Experiment results show that complete liberation degree and great difference of density between metals and nonmetals are suitable to recover metals from -74 μm PCBs using enhanced Falcon SB concentrator and 80.77 % integration efficiency can be achieved when slurry concentration of feed is 40 g/L with the water counter pressure of 0.01 MPa and rotation frequency of 50 Hz.

  4. Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards.

    Science.gov (United States)

    Zhu, Ping; Chen, Yan; Wang, Liangyou; Qian, Guangren; Zhang, Wei Jie; Zhou, Ming; Zhou, Jin

    2013-03-19

    Improved methods are required for the recycling of waste printed circuit boards (WPCBs). In this study, WPCBs (1-1.5 cm(2)) were separated into their components using dimethyl sulfoxide (DMSO) at 60 °C for 45 min and a metallographic microscope was used to verify their delamination. An increased incubation time of 210 min yielded a complete separation of WPCBs into their components, and copper foils and glass fibers were obtained. The separation time decreased with increasing temperature. When the WPCB size was increased to 2-3 cm(2), the temperature required for complete separation increased to 90 °C. When the temperature was increased to 135 °C, liquid photo solder resists could be removed from the copper foil surfaces. The DMSO was regenerated by rotary decompression evaporation, and residues were obtained. Fourier transform infrared spectroscopy (FT-IR), thermal analysis, nuclear magnetic resonance, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were used to verify that these residues were brominated epoxy resins. From FT-IR analysis after the dissolution of brominated epoxy resins in DMSO it was deduced that hydrogen bonding may play an important role in the dissolution mechanism. This novel technology offers a method for separating valuable materials and preventing environmental pollution from WPCBs.

  5. The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

    Science.gov (United States)

    Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

    2009-10-15

    This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

  6. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    Science.gov (United States)

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs.

  7. Pressure leaching of metals from waste printed circuit boards using sulfuric acid

    Science.gov (United States)

    Jha, Manis K.; Lee, Jae-Chun; Kumari, Archana; Choubey, Pankaj K.; Kumar, Vinay; Jeong, Jinki

    2011-08-01

    Printed circuit boards (PCBs) are essential components of electronic equipments which contain various metallic values. This paper reports a hydrometallurgical recycling process for waste PCBs, which consists of the novel pretreatment consisting of organic swelling of PCBs followed by sulfuric acid leaching of metals from waste PCBs. To recycle the waste PCBs, experiments were carried out for the recovery of copper from the crushed and organic swelled materials of waste PCBs using sulfuric acid leaching in presence of hydrogen peroxide under atmospheric and pressure condition. The leaching of PCBs at 90°C, pulp density 100 g/L under atmospheric condition, using 6M sulfuric acid resulted in the dissolution of a minor amount of copper due to the presence of plastic coating on the surface of metallic layers. On the other hand, when the liberated metal sheets from organic swelled PCBs were treated with dilute sulfuric acid of concentration 2M along with hydrogen peroxide in an autoclave under oxygen atmosphere, the percentage recovery of copper was found to increase from 59.63% to 97.01% with an increase in hydrogen peroxide concentration from 5 to 15% (v/v) keeping constant pulp density 30 g/L.

  8. Metals recovering from waste printed circuit boards (WPCBs) using molten salts.

    Science.gov (United States)

    Flandinet, L; Tedjar, F; Ghetta, V; Fouletier, J

    2012-04-30

    Recycling of waste electrical and electronic equipments (WEEE) has been taken into consideration in the literature due to the large quantity of concerned wastes and their hazardous contents. The situation is so critical that EU published European Directives imposing collection and recycling with a minimum of material recovery [1]. Moreover, WEEEs contain precious metals, making the recycling of these wastes economically interesting, but also some critical metals and their recycling leads to resource conservation. This paper reports on a new approach for recycling waste printed circuit boards (WPCBs). Molten salts and specifically molten KOH-NaOH eutectic is used to dissolve glasses, oxides and to destruct plastics present in wastes without oxidizing the most valuable metals. This method is efficient for recovering a copper-rich metallic fraction, which is, moreover, cleared of plastics and glasses. In addition, analyses of gaseous emission show that this method is environmentally friendly since most of the process gases, such as carbon monoxide and dioxide and halogens, are trapped in the highly basic molten salt. In other respects, under operation without oxygen, a large quantity of hydrogen is produced and might be used as fuel gas or as synthesis gas, leading to a favourable energy balance for this new process.

  9. Column bioleaching copper and its kinetics of waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans.

    Science.gov (United States)

    Chen, Shu; Yang, Yuankun; Liu, Congqiang; Dong, Faqin; Liu, Bijun

    2015-12-01

    Application of bioleaching process for metal recovery from electronic waste has received an increasing attention in recent years. In this work, a column bioleaching of copper from waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans has been investigated. After column bioleaching for 28d, the copper recovery reached at 94.8% from the starting materials contained 24.8% copper. Additionally, the concentration of Fe(3+) concentration varied significantly during bioleaching, which inevitably will influence the Cu oxidation, thus bioleaching process. Thus the variation in Fe(3+) concentration should be taken into consideration in the conventional kinetic models of bioleaching process. Experimental results show that the rate of copper dissolution is controlled by external diffusion rather than internal one because of the iron hydrolysis and formation of jarosite precipitates at the surface of the material. The kinetics of column bioleaching WPCBs remains unchanged because the size and morphology of precipitates are unaffected by maintaining the pH of solution at 2.25 level. In bioleaching process, the formation of jarosite precipitate can be prevented by adding dilute sulfuric acid and maintaining an acidic condition of the leaching medium. In such way, the Fe(2)(+)-Fe(3+) cycle process can kept going and create a favorable condition for Cu bioleaching. Our experimental results show that column Cu bioleaching from WPCBs by A. ferrooxidans is promising.

  10. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  11. Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

    Science.gov (United States)

    Wang, Jianbo; Xu, Zhenming

    2015-01-20

    Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

  12. Neutralization/purification of the wastewaters from printed circuit boards production using waste by-products.

    Science.gov (United States)

    Orescanin, Visnja; Kollar, Robert; Halkijevic, Ivan; Kuspilic, Marin; Flegar, Vanja

    2014-01-01

    The purpose of this work was development of a new method for the neutralization/purification of printed circuit boards wastewater (PCBW) originating from Zagreb, Croatia, using two industrial by-products. PCBW was characterized with low pH value (2.11) and high concentration of TDS (50190 mg L(-1)), copper (4190 mg L(-1)) and iron (2660 mg L(-1)). Waste base (WB), by-product of the alumina production, and waste sludge, by-product of the electrochemical treatment of groundwater, were employed as neutralization/adsorption agents. Due to its high neutralization capacity WB was used for pH adjustment to pH 8 and heavy metals removal from both effluents, yet the final removal of the contaminants down to the regulated values was assessed by adsorption/coagulation with the iron and aluminum rich waste sludge. Following the combined treatment the removal efficiency of iron and copper was higher than 99.99% with their final concentration in the treated water of 0.151 mg L(-1) and 0.129 mg L(-1), respectively. Following the ozone base oxidation the removal efficiency of the organic contaminants was more than 83%. The successful application of the industrial waste by-products for neutralization/purification of the PCBW with the removal efficiencies of the contaminants comparable or better than those obtained with conventional treatment represented the main advantage of our presented method.

  13. Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock.

    Science.gov (United States)

    Li, Jinhui; Duan, Huabo; Yu, Keli; Wang, Siting

    2010-02-01

    Waste printed circuit boards (PCBs) are the focal points for handling electric and electronic waste. In this paper, a thermal shock method was used to pretreat waste PCBs for the improvement of crushing performance. The influence of the thermal shock process on interfacial modification and mechanical property attenuation of PCB waste was studied. The appearance and layer spacing of the basal plane began to change slightly when the temperature reached 200 degrees C. By 250 degrees C, apparent bulging, cracking, and delamination were observed. However, pyrolysis of PCBs occurred when the temperature reached 275 degrees C, where PCBs were carbonized. The thermogravimetric analysis of PCB particles under vacuum showed that 270 degrees C was the starting point of pyrolysis. The tensile and impact strength of PCBs were reduced as shock temperature rose gradually, with a reduction by 2.6 and 16.5%, respectively, at 250 degrees C from its unheated strength. The PCBs that were heated to 250 degrees C achieved 100% liberation, increasing linearly from 13.6% for unheated PCBs through a single-level shear-crusher (2-mm mesh) and resulting in an obvious reduction of 9.5% (dB) in dust and noise at 250 degrees C. These parameters could be helpful for establishing the operational setup for industrial-scale facilities with the aim of achieving a compact process and a highly efficient recovery for waste PCBs compared with those of the traditional combination mechanical technologies.

  14. Modelling, analysis, and acceleration of a printed circuit board fabrication process

    Indian Academy of Sciences (India)

    K S Aithal; Y Narahari; E Manjunath

    2001-10-01

    Product design and fabrication constitute an important business activity in any manufacturing firm. Designing an optimized product fabrication process is an important problem in itself and is of significant practical and research interest. In this paper, we look into a printed circuit board (PCB) fabrication process and investigate ways in which the fabrication cycle time can be minimized. Single class queueing networks constitute the modelling framework for our study. The model developed in this paper and the analysis experiments carried out are based on extensive data collected on a PCB fabrication company located in Bangalore, India. This is a representative PCB fabrication company involving multiple, concurrent fabrication works with contention for human/technical resources. Our model seeks to capture faithfully the flow of the fabrication process in this company and such other organisations, using queueing networks. Using the model developed, we explore how the cycle times can be reduced using input control, load balancing, and variability reduction. The model presented is sufficiently generic and conceptual; its scope extends beyond that of a PCB fabrication organization.

  15. Asphalt modified with nonmetals separated from pulverized waste printed circuit boards.

    Science.gov (United States)

    Guo, Jiuyong; Guo, Jie; Wang, Shifeng; Xu, Zhenming

    2009-01-15

    Nonmetals separated from pulverized waste printed circuit boards (PCBs) were reused as a new modifier to improve the performance of asphalt. The classical and rheological properties of unmodified asphalt and non-metal-modified asphalt (NMA) were determined. Specifically, the influence of nonmetals content and particle size on these properties has been studied. When the nonmetals content was 25 wt% and the particle size group was 0.07-0.09 mm, the NMA had a viscosity of 1225 cP at 135 degrees C, a penetration of 53.7 dmm at 15 degrees C, a ring and ball softening point of 54 degrees C, a ductility of 43.5 cm at 15 degrees C, a G*/sin delta of 3995.27 Pa at 60 degrees C, and an upper limit temperature (G*/sin delta = 1 kPa) of 69.4 degrees C, all of which showed that the high temperature performance of asphalt was improved significantly. Therefore, this study gives a fundamental understanding of NMA and represents a novel attempt to deal with the fast increasing quantities of nonmetals from waste PCBs, which is significant from an environmental and economic standpoint.

  16. Kinetic Study of the Pyrolysis of Waste Printed Circuit Boards Subject to Conventional and Microwave Heating

    Directory of Open Access Journals (Sweden)

    Chunyuan Ma

    2012-08-01

    Full Text Available This paper describes a kinetic study of the decomposition of waste printed circuit boards (WPCB under conventional and microwave-induced pyrolysis conditions. We discuss the heating rates and the influence of the pyrolysis on the thermal decomposition kinetics of WPCB. We find that the thermal degradation of WPCB in a controlled conventional thermogravimetric analyzer (TGA occurred in the temperature range of 300 °C–600 °C, where the main pyrolysis of organic matter takes place along with an expulsion of volumetric volatiles. The corresponding activation energy is decreased from 267 kJ/mol to 168 kJ/mol with increased heating rates from 20 °C/min to 50 °C/min. Similarly, the process of microwave-induced pyrolysis of WPCB material manifests in only one stage, judging by experiments with a microwave power of 700 W. Here, the activation energy is determined to be only 49 kJ/mol, much lower than that found in a conventional TGA subject to a similar heating rate. The low activation energy found in microwave-induced pyrolysis suggests that the adoption of microwave technology for the disposal of WPCB material and even for waste electronic and electrical equipment (WEEE could be an attractive option.

  17. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    Directory of Open Access Journals (Sweden)

    Waldir A. Bizzo

    2014-06-01

    Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

  18. A new technology for recycling materials from waste printed circuit boards.

    Science.gov (United States)

    Zhou, Yihui; Qiu, Keqiang

    2010-03-15

    Waste printed circuit boards (WPCBs) contain lots of valuable resources together with plenty of hazardous materials, which are considered both an attractive secondary resource and an environmental contaminant. In this research, a new process of "centrifugal separation+vacuum pyrolysis" for the combined recovery of solder and organic materials from WPCBs was investigated. The results of centrifugal separation indicated that the separation of solder from WPCBs was complete when WPCBs were heated at 240 degrees C, and the rotating drum was rotated at 1400 rpm for 6 min intermittently. The results of vacuum pyrolysis showed that the type-A of WPCBs without solder pyrolysed to form an average of 69.5 wt% residue, 27.8 wt% oil, and 2.7 wt% gas; and pyrolysis of the type-B of WPCBs without solder led to an average mass balance of 75.7 wt% residue, 20.0 wt% oil, and 4.3 wt% gas. The pyrolysis residues contain various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The pyrolysis oils can be used for fuel or chemical feedstock and the pyrolysis gases can be collected and combusted for the pyrolysis self-sustain. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent the environmental pollution of WPCBs effectively.

  19. Pyrolysis characteristics of the mixture of printed circuit board scraps and coal powder.

    Science.gov (United States)

    Hao, Juan; Wang, Haifeng; Chen, Shuhe; Cai, Bin; Ge, Linhan; Xia, Wencheng

    2014-10-01

    Thermogravimetric (TG) analysis and infrared spectroscopy were used to analyze the pyrolysis characteristics of printed circuit board scraps (PCBs), coal powder and their mixtures under nitrogen atmosphere. The experimental results show that there is a large difference between waste PCBs and coal powder in pyrolysis processing. The pyrolysis properties of the mixing samples are the result of interaction of the PCBs and coal powder, which is influenced by the content of mixture. The degree of pyrolysis and pyrolysis properties of the mixture are much better than that of the single component. The TG and the differential thermogravimetric (DTG) curves of the PCBs mixed with coal powder move towards the high-temperature zone with increasing amount of coal powder and subsequently the DTG peak also becomes wider. The Coats-Redfern integral method was used to determine the kinetic parameters of pyrolysis reaction mechanism with the different proportion of mixture. The gas of pyrolysis mainly composes of CO2, CO, H2O and some hydrocarbon. The bromide characteristic absorption peak has been detected obviously in the pyrolysis gas of PCBs. On the contrary, the absorption peak of the bromide is not obvious in pyrolysis gas of the PCBs samples adding 40% coal powder. Copyright © 2013 Elsevier Ltd. All rights reserved.

  20. Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers

    Directory of Open Access Journals (Sweden)

    Jang-Won Seo

    2015-05-01

    Full Text Available Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE, which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%‒15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

  1. Study on Metals Recovery from -0.074 mm Printed Circuit Boards by Enhanced Gravity Separation

    Institute of Scientific and Technical Information of China (English)

    赵跃民; 温雪峰; 施红霞; 焦红光; 陶有俊

    2006-01-01

    Nowadays study on reutilization of discarded printed circuit boards (PCBs) has great significance for achieving secondary resources recycling and preventing environmental pollution. Physical methods show great potential and advantages on discarded PCBs reutilization, compared with chemical and biological methods. However for the particles of -0.074 mm PCBs, little work has been done in the past because of lower separation efficiency and recovery. In this work, the conundrum of-0.074 mm PCBs reutilization was resolved successfully with the help of Falcon concentrator. Separation mechanism for fine particles with different mass densities in a Falcon centrifugal concentrator was analyzed. The main factors such as magnitude of rotation frequency (centrifugal acceleration), anti-charge water pressure and feeding concentration were studied,and interaction of different factors was analyzed using Design-Expert software. The experimental results show that metals grade of-0.074 mm PCBs and integration efficiency were obtained as 76.89% and 80.77% respectively when feeding concentration was 40 g/L with water pressure of 0.01 MPa and rotation frequency of 50 Hz.

  2. Integration of multimode waveguides and micromirror couplers in printed circuit boards using laser ablation

    Science.gov (United States)

    Van Steenberge, Geert; Geerinck, Peter; Van Put, Steven; Van Daele, Peter

    2004-09-01

    Integration of optical interconnections on a Printed Circuit Board (PCB) is very challenging, as it should remain compatible with existing PCB manufacturing technology based on laminated FR4-substrates and making use of solder-reflow and well-known placement and assembly techniques. In this paper we will describe different technologies being used for integration of such optical interconnections in PCB's. As we will demonstrate, the use of laser ablation, already used in PCB manufacturing for microvia's, is a suitable technique for the fabrication of multimode waveguides and micromirrors to provide optical coupling. Laser ablation is a very flexible technology that is particularly well suited for structuring of polymers because of their excellent UV-absorption properties and highly non-thermal ablation behavior. One of the most critical problems on the integration of optical interconnections in PCB's is coupling the light in and out of the optical plane. Because in our set-up the excimer laser beam can be tilted, the 45 degrees micromirrors can be easily fabricated using laser ablation. The focus is on ablation of waveguides using a frequency tripled Nd-YAG laser and on ablation of 45 degrees facets using a KrF excimer laser. It is shown that these structures can be defined in one single processing step, resulting in a very accurate alignment.

  3. PVC-based composite material containing recycled non-metallic printed circuit board (PCB) powders.

    Science.gov (United States)

    Wang, Xinjie; Guo, Yuwen; Liu, Jingyang; Qiao, Qi; Liang, Jijun

    2010-12-01

    The study is directed to the use of non-metallic powders obtained from comminuted recycled paper-based printed circuit boards (PCBs) as an additive to polyvinyl chloride (PVC) substrate. The physical properties of the non-metallic PCB (NMPCB) powders were measured, and the morphological, mechanical and thermal properties of the NMPCB/PVC composite material were investigated. The results show that recycled NMPCB powders, when added below a threshold, tended to increase the tensile strength and bending strength of PVC. When 20 wt% NMPCB powders (relative to the substrate PVC) of an average diameter of 0.08 mm were added, the composite tensile strength and bending strength reached 22.6 MPa and 39.83 MPa, respectively, representing 107.2% and 123.1% improvement over pure PVC. The elongation at break of the composite material reached 151.94% of that of pure PVC, while the Vicat softening temperature of the composite material did not increase significantly compared to the pure PVC. The above results suggest that paper-based NMPCB powders, when used at appropriate amounts, can be effective for toughening PVC. Thus, this study suggests a new route for reusing paper-based NMPCB, which may have a significant beneficial environmental impact.

  4. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip.

    Science.gov (United States)

    Li, Xuelian; Zang, Jianfeng; Liu, Yingshuai; Lu, Zhisong; Li, Qing; Li, Chang Ming

    2013-04-10

    An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  5. Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil.

    Science.gov (United States)

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2010-07-15

    The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 degrees C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of approximately 338 nm and wall thickness of approximately 86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m(2)/g. The mechanism of the formation of the CNTs and porous carbons was discussed.

  6. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal.

    Science.gov (United States)

    Ortuño, Nuria; Conesa, Juan A; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO2005-TEQ/kg sample, corresponding to the sample with and without metals, respectively.

  7. Printed circuit boards as platform for disposable lab-on-a-chip applications

    Science.gov (United States)

    Leiterer, Christian; Urban, Matthias; Fritzsche, Wolfgang; Goldys, Ewa; Inglis, David

    2015-12-01

    An increasing demand in performance from electronic devices has resulted in continuous shrinking of electronic components. This shrinkage has demanded that the primary integration platform, the printed circuit board (PCB), follow this same trend. Today, PCB companies offer ~100 micron sized features (depth and width) which mean they are becoming suitable as physical platforms for Lab-on-a-Chip (LOC) and microfluidic applications. Compared to current lithographic based fluidic approaches; PCB technology offers several advantages that are useful for this technology. These include: Being easily designed and changed using free software, robust structures that can often be reused, chip layouts that can be ordered from commercial PCB suppliers at very low cost (1 AUD each in this work), and integration of electrodes at no additional cost. Here we present the application of PCB technology in connection with microfluidics for several biomedical applications. In case of commercialization the costs for each device can be even further decreased to approximately one tenth of its current cost.

  8. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2014-05-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  9. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    Science.gov (United States)

    Bizzo, Waldir A.; Figueiredo, Renata A.; de Andrade, Valdelis F.

    2014-01-01

    The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs) from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver) has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions. PMID:28788692

  10. Treatment of waste printed circuit board by green solvent using ionic liquid.

    Science.gov (United States)

    Zhu, P; Chen, Y; Wang, L Y; Zhou, M

    2012-10-01

    Recycling of waste printed circuit boards (WPCBs) is an important subject not only for the protection of environment but also for the recovery of valuable materials. A feasibility study was conducted to dissolve bromine epoxy resins of WPCBs using ionic liquid (IL) of 1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM(+)][BF(4)(-)] (nonaqueous green solvent) for recovering copper foils and glass fibers. Experimental results indicated that the initial delamination had seen from the cross-section of the WPCBs by mean of metallographic microscope and digital camera when WPCBs were heated in [EMIM(+)][BF(4)(-)] at 240°C for a duration of 30 min. When temperature was increased to 260°C for a duration of 10 min, the bromine epoxy resins of WPCBs were throughout dissolved into [EMIM(+)][BF(4)(-)] and the separations of copper foils and glass fibers from WPCBs were completed. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent the environmental pollution of WPCBs effectively. Crown Copyright © 2012. Published by Elsevier Ltd. All rights reserved.

  11. Enhancement of leaching copper by electro-oxidation from metal powders of waste printed circuit board.

    Science.gov (United States)

    Ping, Zhu; ZeYun, Fan; Jie, Lin; Qiang, Liu; Guangren, Qian; Ming, Zhou

    2009-07-30

    Oxidation leaching copper from metal powders of waste printed circuit boards (PCBs) was conducted at room temperature in sulfuric acid solution. The result showed that the copper in metal powders was oxidized by Cu(2+) to form CuCl(2)(-) in the presence of chloride ion without electrochemical oxidation. Then, CuCl(2)(-) was oxidized into CuSO(4) by oxygen derived from the air insufflated into leaching solution. The leaching rate of copper reached 100%. The whole reaction took 5.5h because it was limited by the low solubility of the air in water. In the electro-oxidation conditions, the chloride ion was electro-oxidized into ClO(-), which oxidized CuCl(2)(-) into CuSO(4) and ClO(-) was reduced into Cl(-) itself again at the same time. Since Cl(-) was recycled in the solution not only as a complexing agent but also as an oxidant, which made the reaction speed up to 3.5h to reach 100% leaching rate. Leaching solution was concentrated to crystallize CuSO(4).5H(2)O, and crystal liquor was reused to leach copper from metal powders.

  12. Tetrabromobisphenol A contamination and emission in printed circuit board production and implications for human exposure.

    Science.gov (United States)

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-05-30

    The emission of and exposure to tetrabromobisphenol A (TBBPA) during the production of printed circuit boards (PCBs) were evaluated in this study. TBBPA was determined in production wastes (fine solid waste, rinsing water, effluent and sludge) and environmental samples (dust and PM10) from a typical PCB plant. The TBBPA concentrations of the solid and liquid wastes were on the order of 10(2)-10(4)ng/g and 10(1)-10(2)ng/L, respectively. The highest emission to the environment was exhibited by the fine solid waste (187-1220μg/kg-PCB), suggesting the need for strict control of its production and disposal. Regarding the environmental samples, the TBBPA contents of dust (125-9090ng/g) and PM10 (12.3-1640pg/m(3)) were higher than other values reported worldwide, indicating that PCB production was a non-negligible source of TBBPA for the occupational environment. TBBPA contamination mainly occurred in the form of sedimentary dust rather than suspended particulate matter. According to our estimation, worker exposures to TBBPA via dust ingestion, dust dermal absorption and PM10 inhalation varied widely by process, with the greatest exposures being 1930, 431 and 96.5pg/kg-bw/day, respectively. The exposure via dust represented most of the overall exposure via the above three pathways in PCB workshops. Copyright © 2014 Elsevier B.V. All rights reserved.

  13. Delamination mechanism study of large size waste printed circuit boards by using dimethylacetamide.

    Science.gov (United States)

    Verma, Himanshu Ranjan; Singh, Kamalesh K; Mankhand, Tilak Raj

    2017-07-01

    Present work investigates the recycling of waste printed circuit boards (PCBs) by cracking of its multi-layered structure by using dimethylacetamide (DMA). The study shows that cracking and separation of layers of PCBs increases as the temperature increases; and decreases as the surface area of PCBs increases. After separation of layers, the used solvent was analyzed by proton and carbon nuclear magnetic resonance spectroscopy (NMR) to understand the dissolution phenomenon of resin. Further, NMR and Fourier transform infrared spectroscopy analysis of DMA sample after 1h, 2h, 3h, 4h and 8h of reaction with PCBs at 433K and PCB:DMA ratio (wt/vol) of 3:10 has been carried out to investigate the mechanism of dissolution of resin. These studies revealed that hydroxyl group of PCBs polymeric chain participates in hydrogen bonding with parent carbonyl group of DMA molecule that results in the solvation of resin. Possible chemical reaction based on the above finding has been discussed. Using this technique, separation of the metallic fraction without application of any energy intensive mechanical pre-processing is possible. Copyright © 2017 Elsevier Ltd. All rights reserved.

  14. Impact of nonconductive powder on electrostatic separation for recycling crushed waste printed circuit board.

    Science.gov (United States)

    Wu, Jiang; Qin, Yufei; Zhou, Quan; Xu, Zhenming

    2009-05-30

    The electrostatic separation is an effective and environmentally friendly method for recycling metals and nonmetals from crushed printed circuit board (PCB) wastes. However, it still confronts some problems brought by nonconductive powder (NP). Firstly, the NP is fine and liable to aggregate. This leads to an increase of middling products and loss of metals. Secondly, the stability of separation process is influenced by NP. Finally, some NPs accumulate on the surface of the corona and electrostatic electrodes during the process. These problems lead to an inefficient separation. In the present research, the impacts of NP on electrostatic separation are investigated. The experimental results show that: the separation is notably influenced when the NP content is more than 10%. With the increase of NP content, the middling products sharply increase from 1.4 g to 4.3g (increase 207.1%), while the conductive products decrease from 24.0 g to 19.1g (decrease 20.4%), and the separation process become more instable.

  15. Dielectrophoresis-based cell manipulation using electrodes on a reusable printed circuit board.

    Science.gov (United States)

    Park, Kidong; Suk, Ho-Jun; Akin, Demir; Bashir, Rashid

    2009-08-07

    Particle manipulation based on dielectrophoresis (DEP) can be a versatile and useful tool in lab-on-chip systems for a wide range of cell patterning and tissue engineering applications. Even though there are extensive reports on the use of DEP for cell patterning applications, the development of approaches that make DEP even more affordable and common place is still desirable. In this study, we present the use of interdigitated electrodes on a printed circuit board (PCB) that can be reused to manipulate and position HeLa cells and polystyrene particles over 100 microm thick glass cover slips using DEP. An open-well or a closed microfluidic channel, both made of PDMS, was placed on the glass coverslip, which was then placed directly over the PCB. An AC voltage was applied to the electrodes on the PCB to induce DEP on the particles through the thin glass coverslip. The HeLa cells patterned with DEP were subsequently grown to confirm the lack of any adverse affects from the electric fields. This alternative and reusable platform for DEP particle manipulation can provide a convenient and rapid method for prototyping a DEP-based lab-on-chip system, cost-sensitive lab-on-chip applications, and a wide range of tissue engineering applications.

  16. Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

    Science.gov (United States)

    Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

    2015-12-01

    Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

  17. Fabrication of thermally stable and cost-effective polymeric waveguide for optical printed-circuit board.

    Science.gov (United States)

    Kim, Do-Won; Ahn, Seung Ho; Cho, In-Kui; Im, Dong-Min; Shorab Muslim, Shirazy Md; Park, Hyo-Hoon

    2008-10-13

    A thermally stable polymeric optical waveguide has been fabricated using ultraviolet (UV)-curable epoxy resins for the core and clad materials. A simple and cost-effective fabrication method that uses reusable polydimethylsiloxane (PDMS) masters has been developed. The 12-channel under-clad layer of the UV-cured epoxy was prepared using a PDMS master whose embossed channels had been fabricated by a polycarbonate (PC) secondary master. The thermal stability of the fabricated waveguide was tested at 200 degrees C for one hour. The optical waveguide was not damaged physically by thermal stress. Propagation losses detected by a cut-back method were 0.16 dB/cm and 0.26 dB/cm, respectively, before and after the thermal stability test at 850 nm. Loss increase after the thermal treatment can be attributed to the formation of the absorbing and scattering sources. This waveguide can be applied for areas that require thermal stability such as an optical printed-circuit board.

  18. Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

    Directory of Open Access Journals (Sweden)

    Alafara A. Baba

    2014-07-01

    Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

  19. En masse pyrolysis of flexible printed circuit board wastes quantitatively yielding environmental resources.

    Science.gov (United States)

    Kim, Jang Won; Lee, Albert S; Yu, Seunggun; Han, Jeong Whan

    2017-08-08

    This paper reports the recycling of flexible printed circuit board (FPCB) waste through carbonization of polyimide by dual pyrolysis processes. The organic matter was recovered as pyrolyzed oil at low temperatures, while valuable metals and polyimide-derived carbon were effectively recovered through secondary high temperature pyrolysis. The major component of organics extracted from FPCB waste comprised of epoxy resins were identified as pyrolysis oils containing bisphenol-A. The valuable metals (Cu, Ni, Ag, Sn, Au, Pd) in waste FPCB were recovered as granular shape and quantitatively analyzed via ICP-OES. In attempt to produce carbonaceous material with increased degree of graphitization at low heat-treatment conditions, the catalytic effect of transition metals within FPCB waste was investigated for the efficient carbonization of polyimide films. The morphology of the carbon powder was observed by scanning electron microscopy and graphitic carbonization was investigated with X-ray analysis. The protocols outlined in this study may allow for propitious opportunities to salvage both organic and inorganic materials from FPCB waste products for a sustainable future. Copyright © 2017 Elsevier B.V. All rights reserved.

  20. Study on characteristics of printed circuit board liberation and its crushed products.

    Science.gov (United States)

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2012-11-01

    Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

  1. Life cycle assessment of a printed circuit board manufacturing plant in Turkey.

    Science.gov (United States)

    Ozkan, Elif; Elginoz, Nilay; Germirli Babuna, Fatos

    2017-09-29

    The objective of this study is to investigate the environmental impacts of a printed circuit board (PCB) manufacturing plant through streamlined life cycle assessment approach. As a result, the most effective recommendations on minimizing the environmental impacts for the mentioned sector are revealed and first steps towards establishing a country specific database are taken. The whole PCB production consists of two consecutive stages: namely board fabrication followed by the manufacturing of PCB. Manufacturing of PCB contributes the highest shares to freshwater aquatic ecotoxicity potential (FAETP) and ozone layer depletion potential (ODP). Eighty-nine percent of FAETP is found to be generated from the manufacturing of PCB. Almost all of this contribution can be attributed to the disposal of copper containing wastewater treatment sludge from etching operations to incineration. On the other hand, PCB manufacturing has 73% share in total ODP. Within the manufacturing of PCB, as etching operations are found to be of importance for all the impact categories except eutrophication potential (EP), it is recommended to focus further studies on in-plant control of etching.

  2. Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board

    Science.gov (United States)

    Gong, Jian; Kim, Chang-Jin “CJ”

    2008-01-01

    Digital (i.e. droplet-based) microfluidics, by the electrowetting-on-dielectric (EWOD) mechanism, has shown great potential for a wide range of applications, such as lab-on-a-chip. While most reported EWOD chips use a series of electrode pads essentially in one-dimensional line pattern designed for specific tasks, the desired universal chips allowing user-reconfigurable paths would require the electrode pads in two-dimensional pattern. However, to electrically access the electrode pads independently, conductive lines need to be fabricated underneath the pads in multiple layers, raising a cost issue especially for disposable chip applications. In this article, we report the building of digital microfluidic plates based on a printed-circuit-board (PCB), in which multilayer electrical access lines were created inexpensively using mature PCB technology. However, due to its surface topography and roughness and resulting high resistance against droplet movement, as-fabricated PCB surfaces require unacceptably high (~500 V) voltages unless coated with or immersed in oil. Our goal is EWOD operations of aqueous droplets not only on oil-covered but also on dry surfaces. To meet varying levels of performances, three types of gradually complex post-PCB microfabrication processes are developed and evaluated. By introducing land-grid-array (LGA) sockets in the packaging, a scalable digital microfluidics system with reconfigurable and low-cost chip is also demonstrated. PMID:19234613

  3. Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

    Science.gov (United States)

    Jadhav, Umesh; Su, C; Hocheng, Hong

    2016-12-01

    In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H2O2) was used to leach the metals from CPCB piece. The influence of system variables such as H2O2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H2O2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H2O2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

  4. Converting Non-Metallic Printed Circuit Boards Waste Into A Value Added Product

    Directory of Open Access Journals (Sweden)

    Shantha Kumari Muniyandi

    2013-05-01

    Full Text Available The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB waste as filler in recycled HDPE (rHDPE in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0--30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites.

  5. Microbial recovery of copper from printed circuit boards of waste computer by Acidithiobacillus ferrooxidans.

    Science.gov (United States)

    Choi, Moon-Sung; Cho, Kyung-Suk; Kim, Dong-Su; Kim, Dong-Jin

    2004-01-01

    The bioleaching of copper contained in the printed circuit boards (PCB) of waste computers by A. ferrooxidans was studied. The Fe oxidation rates by A. ferrooxidans in the 9K medium supplemented with the leachate of PCB (0.15-0.13 g L(-1) d(-1)) were similar to that in the 9K medium without the leachate (0.15 g L(-1) d(-1)). This finding suggests that the leachate of PCB did not seriously affect the bioleaching process by this bacterium. The amount of copper leached from PCB shreds increased with the addition of ferrous ion and reached up to 5190 mg L(-1) when the initial concentration of Fe2+ ion was 7 g L(-1). As the microbial leaching progressed, pale brown precipitate was observed to form in the solution. Based on the total amount of copper, both in solution and precipitate, the optimal addition of ferrous ion for the leaching of copper was around 7 g L(-1). When citric acid was not added, only about 37 wt% of the total leached copper remained dissolved; however, the amount of dissolved copper increased to greater than 80 wt% in the presence of citric acid. This fact indicates that the addition of a complexing agent (citric acid) to the bioleaching solution can raise the solubility of the leached metal ions.

  6. Cell electroporation with a three-dimensional microelectrode array on a printed circuit board.

    Science.gov (United States)

    Xu, Youchun; Su, Shisheng; Zhou, Changcheng; Lu, Ying; Xing, Wanli

    2015-04-01

    Electroporation is a commonly used approach to rapidly introduce exogenous molecules into cells without permanent damage. Compared to classical electroporation protocols, microchip-based electroporation approaches have the advantages of high transfection efficiency and low consumption, but they also commonly rely on costly and tedious microfabrication technology. Hence, it is desirable to develop a novel, more affordable, and effective approach to facilitate cell electroporation. In this study, we utilized a standard printed circuit board (PCB) technology to fabricate a chip with an interdigitated array of electrodes for electroporation of suspended cells. The electrodes (thickness ~35 μm) fabricated by PCB technology are much thicker than the two-dimensional (2D) planar electrodes (thickness electroporation. HeLa, MCF7, COS7, Jurkat, and 3T3-L1 cells were efficiently transfected with the pEGFP-N1 plasmid using individually optimal electroporation parameters. This work provides a novel method for convenient and rapid cell transfection and thus holds promise for use as a low-cost disposable device in biomedical research.

  7. Laser ablated coupling structures for stacked optical interconnections on printed circuit boards

    Science.gov (United States)

    Hendrickx, Nina; Van Steenberge, Geert; Geerinck, Peter; Van Erps, Jürgen; Thienpont, Hugo; Van Daele, Peter

    2006-04-01

    Laser ablation is presented as a versatile technology that can be used for the definition of arrays of multimode waveguides and coupling structures in a stacked two layer optical structure, integrated on a printed circuit board (PCB). The optical material, Truemode Backplane TM Polymer, is fully compatible with standard PCB manufacturing and shows excellent ablation properties. A KrF excimer laser is used for the ablation of both waveguides and coupling structures into the optical layer. The stacking of individual optical layers containing waveguides, that guide the light in the plane of the optical layer, and coupling structures, that provide out-of-plane coupling and coupling between different optical layers, is very interesting since it allows us to increase the integration density and routing possibilities and limit the number of passive components that imply a certain loss. Experimental results are presented, and surface roughness and profile measurements are performed on the structured elements for further characterization. Numerical simulations are presented on the tolerance on the angle of the coupling structures and the influence of tapering on the coupling efficiency of the waveguides.

  8. A hybrid electrohydrodynamic drop-on-demand printing system using a piezoelectric MEMS nozzle

    Science.gov (United States)

    Kim, Young-Jae; Lee, Sang-Myun; Kim, Sangjin; Hwang, Jungho; Kim, Yong-Jun

    2012-04-01

    A unique hybrid jetting system based on electrohydrodynamic and piezoelectric forces has been designed to verify the control of the drop velocity and to obtain ultrafine droplets with a high jetting frequency. Piezoelectric nozzles have been fabricated using silicon on insulator wafers and Pyrex glass employing a MEMS process and an anodic bonding process. The plate-type electrode and moving stage were used for the printing process. The droplet ejection mechanisms from the nozzle using the hybrid jetting system were captured by a high-speed camera synchronized with a trigger signal. The deformation of the meniscus and the jetting delay time in regard to the high operational firing frequency were investigated. It was found that controlling the droplet velocity without a change in the droplet volume and obtaining a smaller dot (59 µm in diameter) in hybrid printing mode compared with inkjet printing mode (151 µm in diameter) were possible. These results show this system's promising applicability to the fabrication of micro patterning for a wide range of printed electronics applications.

  9. 印制板技术的最近动向%New technology trend of Printed Circuit Board

    Institute of Scientific and Technical Information of China (English)

    蔡积庆(译)

    2014-01-01

    This paper describes the new technology trend of printed circuit boards including high density trend of PCB, electronic characteristics of PCB, construction and process of PCB, and technology development in build-up process.%概述了最近的PCB技术动向,包括PCB的高密度化趋势,PCB的电气特性,PCB的构造和工艺以及积层法中的技术开发。

  10. Development of printed-circuit-board based industry-compatible point-of-care biosensing and bioprocessing technology with applications

    OpenAIRE

    Tseng, Hsiu-Yang

    2015-01-01

    This thesis presents the development of a technology employing printed circuit board (PCB) technology to facilitate the performance and translation of point-of-care (POC) biosensing and bioprocessing devices toward practical products. Key features of the proposed technology are a universal, standardized platform and a set of techniques, featuring integrated functional units, three-dimensional (3D) configurations, convenient device-instrumentation interconnections, and industry-compatible prec...

  11. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable...... probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions...

  12. High performance printed N and P-type OTFTs enabling digital and analog complementary circuits on flexible plastic substrate

    Science.gov (United States)

    Jacob, S.; Abdinia, S.; Benwadih, M.; Bablet, J.; Chartier, I.; Gwoziecki, R.; Cantatore, E.; van Roermund, A. H. M.; Maddiona, L.; Tramontana, F.; Maiellaro, G.; Mariucci, L.; Rapisarda, M.; Palmisano, G.; Coppard, R.

    2013-06-01

    This paper presents a printed organic complementary technology on flexible plastic substrate with high performance N and P-type Organic Thin Film Transistors (OTFTs), based on small-molecule organic semiconductors in solution. Challenges related to the integration of both OTFT types in a common complementary flow are addressed, showing the importance of surface treatments. Stability on single devices and on an elementary complementary digital circuit (ring oscillator) is studied, demonstrating that a robust and reliable flow with high electrical performances can be established for printed organic devices. These devices are used to manufacture several analog and digital building blocks. The design is carried out using a model specifically developed for this technology, and taking into account the parametric variability. High-frequency measurements of printed envelope detectors show improved speed performance, resulting from the high mobility of the OTFTs. In addition, a compact dynamic flip-flop and a low-offset comparator are demonstrated, thanks to availability of both n-type and p-type OTFTs in the technology. Measurement results are in good agreement with the simulations. The circuits presented establish a complete library of building blocks for the realization of a printed RFID tag.

  13. First order devices, hybrid memristors, and the frontiers of nonlinear circuit theory

    CERN Document Server

    Riaza, Ricardo

    2010-01-01

    Several devices exhibiting memory effects have shown up in nonlinear circuit theory in recent years. Among others, these circuit elements include Chua's memristors, as well as memcapacitors and meminductors. These and other related devices seem to be beyond the, say, classical scope of circuit theory, which is formulated in terms of resistors, capacitors, inductors, and voltage and current sources. We explore in this paper the potential extent of nonlinear circuit theory by classifying such mem-devices in terms of the variables involved in their constitutive relations and the notions of the differential- and the state-order of a device. Within this framework, the frontier of first order circuit theory is defined by so-called hybrid memristors, which are proposed here to accommodate a characteristic relating all four fundamental circuit variables. Devices with differential order two and mem-systems are discussed in less detail. We allow for fully nonlinear characteristics in all circuit elements, arriving at a...

  14. New circular polarization selective surface concepts based on the Pierrot cell using printed circuit technology

    Science.gov (United States)

    Lopez, Humberto Israel

    This M.A.Sc. thesis focuses on finding an alternative method of constructing a circular polarization selective surface (CPSS) based on the Pierrot cell using the standard printed circuit technology. This technique uses a folded flexible substrate, which enables the implementation of the 3D Pierrot cells on a single metal layer defined with precision printed circuit board techniques, without the need for metalized via holes. Different topologies of the CPSS are analyzed in order to make the CPSS more efficient in terms of bandwidth and independence on the direction of propagation of the incident wave. A left-hand CPSS is designed to illustrate the benefits of the proposed approach. The first approach is a simple Pierrot unit cell CPSS which is optimized to have good reflection and transmission coefficients. A prototype is built and then characterized in a test bench operating in the K-band. For the fabricated prototype, the transmission coefficients of plane waves at normal incidence in the right-hand and the left-hand circular polarizations are --0.48 dB and --24 dB respectively. The bandwidth for which the transmission coefficient of the incident left-handed incident wave is greater than --3 dB was of 17.6%. These results are in good agreement with simulations results obtained with HFSS. A second variant considered is a Pierrot cell with a series load in the middle segment. With this cell it is possible to equalize the frequencies giving a better operation in the right- and left-handed circular polarized waves. There is an improvement for the co-pol to cross-pol ratio for the RHCP waves of 10 dB at 20 GHz. The added load does not affect the performance for the left-hand circular polarization, as expected. The third modification is a Pierrot cell at 90 degrees. This cell is designed to allow the combination of two Pierrot cells working at different frequencies on the same substrate in order to increase the frequency bandwidth of the CPSS. Unfortunately, the axial

  15. Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

    Science.gov (United States)

    Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

    2012-11-30

    Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg.

  16. Recovery of metals from waste printed circuit boards by a mechanical method using a water medium.

    Science.gov (United States)

    Duan, Chenlong; Wen, Xuefeng; Shi, Changsheng; Zhao, Yuemin; Wen, Baofeng; He, Yaqun

    2009-07-15

    Research on the recycling of waste printed circuit boards (PCB) is at the forefront of environmental pollution prevention and resource recycling. To effectively crush waste PCB and to solve the problem of secondary pollution from fugitive odors and dust created during the crushing process, a wet impacting crusher was employed to achieve comminution liberation of the PCB in a water medium. The function of water in the crushing process was analyzed. When using slippery hammerheads, a rotation speed of 1470 rpm, a water flow of 6m(3)/h and a sieve plate aperture of 2.2mm, 95.87% of the crushed product was sized less than 1mm. 94.30% of the metal was in this grade of product. Using smashed material graded -1mm for further research, a Falcon concentrator was used to recover the metal from the waste PCB. Engineering considerations were the liberation degree, the distribution ratio of the metal and a way to simplify the technology. The separation mechanism for fine particles of different densities in a Falcon concentrator was analyzed in detail and the separation process in the segregation and separation zones was deduced. Also, the magnitude of centrifugal acceleration, the back flow water pressure and the feed slurry concentration, any of which might affect separation results, were studied. A recovery model was established using Design-Expert software. Separating waste PCB, crushed to -1mm, with the Falcon separator gave a concentrated product graded 92.36% metal with a recovery of 97.05%. To do this the reverse water pressure was 0.05 MPa, the speed transducer frequency was set at 30 Hz and the feed density was 20 g/l. A flow diagram illustrating the new technique of wet impact crushing followed by separation with a Falcon concentrator is provided. The technique will prevent environmental pollution from waste PCB and allow the effective recovery of resources. Water was used as the medium throughout the whole process.

  17. Leaching characteristics of heavy metals and brominated flame retardants from waste printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Xiaoyu [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China); Guo, Jie, E-mail: guojie@ecust.edu.cn [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China); Lin, Kuangfei [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China); Shanghai Key Laboratory of Functional Materials Chemistry, East China University of Science and Technology, Shanghai 200237 (China); Huang, Kai; Deng, Jingjing [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China)

    2013-02-15

    Highlights: ► Cu and Pb were the most leachable heavy metals in WPCBs according to TCLP and SPLP. ► Penta-BDE congeners were dominated in all extracts. ► High dissolved organic matter condition promoted the BFRs leaching rate. ► Leaching from WPCBs was a significant emission source of BFRs in landfill. -- Abstract: Leaching assessment on five heavy metals (copper, zinc, lead, nickel and cadmium) and two brominated flame retardants (BFRs), polybrominated diphenyl ethers (PBDEs) and tetrabromobisphenol A (TBBPA), from waste printed circuit boards (WPCBs) were conducted using various leaching methods. The mean leaching concentrations of copper were the highest in both toxicity characteristic leaching procedures (TCLP) and synthetic precipitation leaching procedures (SPLP) tests at 8.6 mg/L and 1.1 mg/L, while only lead (6.2 mg/L) exceeded the TCLP criteria and Chinese EPA regulatory limit (both 5.0 mg/L). However, PBDEs and TBBPA were not detected in TCLP and SPLP tests. Then the BFRs leaching trends and potential leachabilities were further investigated in actual landfill leachates using a modified method. Leaching characteristics that fast-leaching initially followed by slow-desorption over time were generally observed. In landfill leachate tests, the highest leaching concentrations of PBDEs and TBBPA were determined at 30.39 and 12.27 μg/L. Meanwhile, the highest leaching rates were estimated to reach 0.08% and 1.00%, respectively, which were significantly influenced by the dissolved organic carbon contents of extracts, the hydrophobicities of target BFRs and the specific surface areas of WPCBs materials. These results proved that leaching from WPCBs was a significant emission source of BFRs in landfill and electronic waste recycling dumpsite.

  18. Experimental and Numerical Study on Transient Behavior of Printed Circuit Heat

    Energy Technology Data Exchange (ETDEWEB)

    Park, Byung Ha; Kim, Chan Soo [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

    2015-10-15

    A PCHE(printed circuit heat exchanger (PCHE) is manufactured from diffusion bonding process with multiple metal plates, which have plenty of micro channels. Micro channels on the plates were produced by mechanical machining or chemical etching. A PCHE is a very compact type and it has fine operating efficiency and effectiveness, which saves capital cost. PMR coolant is helium. The evaluation method for steady-state thermal hydraulic performance of a PCHE with helium was well developed. Kim performed a transient test. Cold inlet temperature was suddenly decreased after steady-state. Decreased temperature was about 20. The studies of transient response for counter flow configuration using both analytical and numerical method were well reviewed by Bunce and Kandiakr. Many authors considered conventional heat exchangers, such as shell and tube type. They considered interfacing wall between two fluids but outer shell of heat exchanger was not considered for transient behavior. However, heavy top cover plate and bottom cover plate are attached by diffusion bonding to endure high pressure from working fluid in PCHE. The mass of metal is very large. It is believed that a PCHE system has slow response time because of the heavy metal plates. It is needed to consider the effect of cover plate to evaluate transient behavior of PCHE. The transient behavior of PCHE was experimentally and numerically analyzed in the present study. A PCHE modeling should be performed with considerations on total PCHE metal mass and total heat transfer area. A PCHE has relatively large volume of metal compared with fluid channel due to cover plates to endure high pressure condition. The transient behavior is very sensitive to the metal mass in PCHE. The presented experimental results show start-up process for high temperature operation. Careful consideration is required to design a PCHE system with helium coolant.

  19. Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation.

    Science.gov (United States)

    Zhou, Yihui; Wu, Wenbiao; Qiu, Keqiang

    2010-11-01

    In this research, a two-step process consisting of vacuum pyrolysis and vacuum centrifugal separation was employed to treat waste printed circuit boards (WPCBs). Firstly, WPCBs were pyrolysed under vacuum condition at 600 °C for 30 min in a lab-scale reactor. Then, the obtained pyrolysis residue was heated under vacuum until the solder was melted, and then the molten solder was separated from the pyrolysis residue by the centrifugal force. The results of vacuum pyrolysis showed that the type-A of WPCBs (the base plates of which was made from cellulose paper reinforced phenolic resin) pyrolysed to form an average of 67.97 wt.% residue, 27.73 wt.% oil, and 4.30 wt.% gas; and pyrolysis of the type-B of WPCBs (the base plates of which was made from glass fiber reinforced epoxy resin) led to an average mass balance of 72.20 wt.% residue, 21.45 wt.% oil, and 6.35 wt.% gas. The results of vacuum centrifugal separation showed that the separation of solder was complete when the pyrolysis residue was heated at 400 °C, and the rotating drum was rotated at 1200 rpm for 10 min. The pyrolysis oil and gas can be used as fuel or chemical feedstock after treatment. The pyrolysis residue after solder separation contained various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The recovered solder can be reused directly and it can also be a good resource of lead and tin for refining.

  20. Thermogravimetric analysis and kinetic study on large particles of printed circuit board wastes.

    Science.gov (United States)

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2009-08-01

    Pyrolysis of large printed circuit board (PCB) waste particle was conducted on a specially designed laboratory-scale thermobalance (Macro-TG) with sample loading of 30 g under dynamic nitrogen atmosphere. The effects of heating rate (10, 15, 20 and 25 degrees C min(-1)) and particle size (1 mm x 1 mm, 5 mm x 5 mm, 10 mm x 10 mm and 10 mm x 20 mm) were examined. To compare the different decomposition behavior of fine and large one, the thermal decomposition of PCB waste powder (approximately 5mg) was also performed on a thermogravimetric analyzer (common TG) under various heating rates (10, 15, 20 and 40 degrees C min(-1)) and particle size ranges (0.198-0.165 mm, 0.165-0.074 mm, 0.074-0.055 mm and 0.055-0.047mm). Experimental results show that large particle has a pyrolysis reaction retardancy compared to fine one. The distributed activation energy model was used to study the pyrolysis kinetics. It was found that during pyrolysis process, values of frequency factor (k(0)) changed with different activation energy (E) values. On common TG, the E values range from 156.95 to 319.37 kJ mol(-1) and k(0) values range from 2.67 x 10(13) to 2.24 x 10(27)s(-1). While, on Macro-TG, the range of E was 31.48-41.26 kJ mol(-1) and of the frequency factor was 19.80-202.67s(-1).

  1. Qualitative and quantitative metals liberation assessment for characterization of various waste printed circuit boards for recycling.

    Science.gov (United States)

    Priya, Anshu; Hait, Subrata

    2017-10-04

    Metals liberation and composition are decisive attributes in characterization of e-waste for metal recycling. Though end-of-life printed circuit board (PCB) is an integral part of e-waste as secondary resource reservoir, yet no standardized procedure exists for metals liberation and dissolution for its characterization. Thus, the paper aims at assessment of metals liberation upon comminution employing scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) followed by comparative assessment of the existing United States Environmental Protection Agency (USEPA) digestion procedures, viz., USEPA 3050B, USEPA 3051A, and USEPA 3052, in effective dissolution of metals from comminuted particles of waste PCBs of computer, laptop, mobile phone, and television. Effect of comminution and digestion conditions was assessed to have significant role in metal liberation and dissolution from PCBs. The SEM-EDS analysis demonstrated partial release of metals from the silica matrix of PCBs. The USEPA digestion methods showed statistically significant (P < 0.05) difference with greater dissolution of metals complexed to PCB matrix by the USEPA 3052 method owing to use of strong acid like hydrofluoric acid. Base metals like Cu and Zn and toxic metals such as Pb and Cd were present in abundance in PCBs and in general exceeded the total threshold limit concentration (TTLC). The maximum contents of Cu (20.13 ± 0.04 wt.%) and Zn (1.89 ± 0.05 wt.%) in laptop PCBs, Pb (2.26 ± 0.08 wt.%) in TV PCBs, and Cd (0.0812 ± 0.0008 wt.%) in computer PCBs were observed.

  2. Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis.

    Science.gov (United States)

    Lin, Kuo-Hsiung; Chiang, Hung-Lung

    2014-04-30

    Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200-500°C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)-MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25-28 mg/g, iron 1.3-1.7 mg/g, tin 0.8-1.0mg/g and magnesium 0.4-1.0mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68-73%, hydrogen was 10-14%, nitrogen was 4-5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500°C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust. Copyright © 2014 Elsevier B.V. All rights reserved.

  3. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

    Science.gov (United States)

    Chiang, Hung-Lung; Lin, Kuo-Hsiung

    2014-01-15

    The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60-115, 0.4-4.0, 1.1-10, 30-95, and 0-0.7mg/g, corresponding to temperatures ranging from 200 to 500°C. When the pyrolysis temperature was lower than 300°C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400°C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70-80%. Copyright © 2013 Elsevier B.V. All rights reserved.

  4. Field Emission Properties of the Graphene Double-Walled Carbon Nanotube Hybrid Films Prepared by Vacuum Filtration and Screen Printing

    OpenAIRE

    Jinzhuo Xu; Tao Feng; Yiwei Chen; Zhuo Sun

    2013-01-01

    The graphene double-walled carbon nanotube (DWCNT) hybrid films were prepared by vacuum filtration and screen printing. Their electron field emission properties have been studied systematically. The electron emission properties of the hybrid films are much better than those of pure DWCNT films and pure graphene films. Comparing with the screen printed films, the vacuum filtered films have many advantages, such as lower turn-on field, higher emission current density, better uniformity, better ...

  5. An Architecture for Hybrid Manufacturing Combining 3D Printing and CNC Machining

    Directory of Open Access Journals (Sweden)

    Marcel Müller

    2016-01-01

    Full Text Available Additive manufacturing is one of the key technologies of the 21st century. Additive manufacturing processes are often combined with subtractive manufacturing processes to create hybrid manufacturing because it is useful for manufacturing complex parts, for example, 3D printed sensor systems. Currently, several CNC machines are required for hybrid manufacturing: one machine is required for additive manufacturing and one is required for subtractive manufacturing. Disadvantages of conventional hybrid manufacturing methods are presented. Hybrid manufacturing with one CNC machine offers many advantages. It enables manufacturing of parts with higher accuracy, less production time, and lower costs. Using the example of fused layer modeling (FLM, we present a general approach for the integration of additive manufacturing processes into a numerical control for machine tools. The resulting CNC architecture is presented and its functionality is demonstrated. Its application is beyond the scope of this paper.

  6. Hybridization of detector array and integrated circuit for readout

    Science.gov (United States)

    Fossum, Eric R.; Grunthaner, Frank J.

    1992-04-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  7. Design of Passive Analog Electronic Circuits Using Hybrid Modified UMDA algorithm

    Directory of Open Access Journals (Sweden)

    J. Slezak

    2015-04-01

    Full Text Available Hybrid evolutionary passive analog circuits synthesis method based on modified Univariate Marginal Distribution Algorithm (UMDA and a local search algorithm is proposed in the paper. The modification of the UMDA algorithm which allows to specify the maximum number of the nodes and the maximum number of the components of the synthesized circuit is proposed. The proposed hybrid approach efficiently reduces the number of the objective function evaluations. The modified UMDA algorithm is used for synthesis of the topology and the local search algorithm is used for determination of the parameters of the components of the designed circuit. As an example the proposed method is applied to a problem of synthesis of the fractional capacitor circuit.

  8. Characteristics of the Ni-B film in printed circuit board for high-power light-emitting diodes.

    Science.gov (United States)

    Rha, Sa-Kyun; Cho, Yang-Rae; Yoon, Jae-Sik; Lee, Youn-Seoung

    2013-09-01

    To develop metal printed circuit boards for a high-power light-emitting diode package using electroless plated Ni-B films on an all-in-one Al2O3-Al substrate with a 10 nm pore size, the growth mode of an electroless Ni-B film on a screen-printed Ag pattern/Al2O3-Al substrate was studied. So as not to damage the Al2O3-AI substrate, a nearly neutral Ni plating solution bath (pH 6.5) included dimethylamine borane was used. It was confirmed that the Ni-B film was selectively grown on the printed Ag paste layer, without growth on the Al2O3. The structure of the electroless plated Ni-B film was amorphous, and the deposition rate of the film was 1.64 +/- 0.078 nm/sec. According to the increase in plating time, the grain sizes of the electroless plated Ni-B film became bigger, and the surface morphology gradually became flatter. In addition, both the mass difference and the film thickness were changed linearly. From these results, it can be concluded that the electroless Ni-B film on printed Ag paste grows immediately from the beginning, and then grows linearly with increasing plating time.

  9. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurement

    Energy Technology Data Exchange (ETDEWEB)

    Qiu, S. S.; Zhuang, G.; Zhang, M.; Xia, D. H.; Rao, B.; Zhang, X. Q.; Pan, Y. [College of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074 (China); Gentle, K. [Institute of Fusion Studies, University of Texas at Austin, Austin, Texas 78712 (United States)

    2010-10-15

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  10. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurementa)

    Science.gov (United States)

    Qiu, S. S.; Zhuang, G.; Zhang, M.; Xia, D. H.; Rao, B.; Zhang, X. Q.; Pan, Y.; Gentle, K.

    2010-10-01

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  11. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

    2014-11-15

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  12. Generation of copper rich metallic phases from waste printed circuit boards.

    Science.gov (United States)

    Cayumil, R; Khanna, R; Ikram-Ul-Haq, M; Rajarao, R; Hill, A; Sahajwalla, V

    2014-10-01

    The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150°C under argon gas flowing at 1L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally

  13. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment.

    Science.gov (United States)

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-07-01

    Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873-1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1T and then at 0.8 T. In the +0.5mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723-773 K in air atmosphere and screening of 0.5mm. Silica was removed and 70% of tantalum grade was obtained after more than 823K heating and separation. Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process. The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional

  14. Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic.

    Science.gov (United States)

    Muniyandi, Shantha Kumari; Sohaili, Johan; Hassan, Azman

    2014-09-01

    The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensile, flexural, and impact properties testing specimens. Nonmetallic PCB mainly consists of large amount of glass fiber-reinforced epoxy resin materials. Incorporation of 50 wt% nonmetallic PCB in rHDPE matrix had increased the flexural strength and modulus by 35% and 130%, respectively. Tensile strength reported to be constant without much improvement. However, the Young's modulus has increased by 180%, with incorporation of 50 wt% nonmetallic PCB. The addition of 6 phr (parts per hundred) maleated polyethylene (MAPE) resulted in 2-fold increase in tensile and flexural strength. Regarding the leaching properties, Cu was identified as the metal that leached at the highest level from the raw nonmetallic PCB, at 59.09 mg/L. However, after the nonmetallic PCB was filled in rHDPE/PCB composites, the concentration of Cu was reduced far below the regulatory limit, to only 3 mg/L. Thermal properties of composites were studied, and it was found out that incorporation of nonmetallic PCB fillers in rHDPE resulted in low thermal conductivity, whereas mechanical strength of the composites showed maximum improvements at 220 degrees C. Overall, the encapsulation technique using nonmetallic PCB waste has formed a monolithic waste form that provides a barrier to the dispersion of wastes into the environment. Implications: Nonmetallic materials reclaimed from waste PCBs were used to analyze the chemical composition, and it was found that nonmetalllic PCBs mainly consist of glass fiber-reinforced epoxy resin materials. With such millions of glass fibers in nonmetallic PCBs, there are mass-excellent supporting bodies that enhance the mechanical properties of composites. In fact, utilization

  15. Printed Circuit Boards with Integrated Heat Carrier Channels for Deep Geothermal Resources

    Science.gov (United States)

    Krühn, T.; Overmeyer, L.

    2012-04-01

    The exploration of deep geothermal resources is still very expensive. A large amount of these costs is caused by the drilling process. The high price results from a high failure risk, slow drilling progress and a large amount of manual work. To develop deep heat mining to a sizeable contribution to the European energy portfolio, the exploration process has to become a lot cheaper. One step to achieve lower costs is to monitor and automate the drilling process. Therefore, electronic components such as sensors and data processing units must be integrated into the Bottom Hole Assembly (BHA). The integration of electronics into the BHA faces the challenge of high ambient temperatures. The project "Packaging of Electronic Components for High Temperature Applications" within the "Geothermal Energy and High Performance-Drilling Collaborative Research Program (gebo)" develops a system of heat carrier channels integrated in printed circuit boards (PCB). These channels can be perfused with fluids such as water, oil or gas and provide high heat convection rates. Such PCBs will be able to withstand high ambient temperatures up to 250 °C. We have simulated, manufactured and are currently testing prototype boards with integrated heat carrier channels featuring a thickness of only 1.6 mm. As a simulation scenario, we chose a board measuring 25 mm x 100 mm, dimensions suitable for integration into a BHA. An ambient temperature of 250 °C was used. The simulation results presented in this contribution illustrate that cooling of the whole board as well as cooling of hotspots is possible. The cooling channel layout being the key for high convection rates was meticulously studied and optimized. Parameters such as necessary flow rate and fluid pressure were adjusted accordingly. Preliminary experiments validate the demonstrated and discussed simulation results. With the proposed cooling system, it is possible to integrate microelectronic components into the BHA for drilling

  16. [Composition and characteristics of volatile organic chemicals emission from printed circuit board factories].

    Science.gov (United States)

    Ma, Ying-Ge

    2012-09-01

    Volatile organic chemicals (VOCs) emission were sampled and analyzed from three printed circuit board (PCB) factories in an industrial area in Shanghai. VOCs concentrations, compositions and source profiles were investigated. In September and December, the highest concentration of VOCs from manufacturing spaces in factory A, B and H were (2.94/2.01) x 10(-9), (3.18/1.11) x 10(-6), (0.70/0.18) x 10(-9), respectively; while for the VOCs from the vent of waste gases, they were (0.86/0.90) x 10(-9), (31.2/ 12.0) x 10(-6), (1.24/0.30) x 10(-9), respectively. Factory A total of 67 VOCs compounds of seven classes were detected, such as alkanes and its chlorine substitutes, alkene and its chlorine substitutes, benzene and its chlorine substitutes, ketone group, as well as ester. The highest concentrations in workshop/vent in A, B and H factories were 2-butanone 6.73 mg x m(-3)/2-methyl-n-hexane 5.93 mg x m(-3), ethyl acetate 8.90 mg x m(-3)/propane 9.64 mg x m(-3), and propone 2.04 mg x m(-3)/propone 1.69 mg x m(-3), respectively. With 100% detection rate, the highest and average concentrations of benzene, toluene and xylene of all sampling sites were 0.077 mg x m(-3)/ 0.035 mg x m(-3), 0.56 mg x m(-3)/0.31 mg x m(-3), 0.21 mg x m(-3)/0.12 mg x m(-3) (m-xylene + p-xylene) and 0.081 mg x m(-3)/0.050 mg x m(-3) (o-xylene), respectively. According to the results of source profiles and PCA analysis, benzene, toluene, xylene, acetone and 2-butanone could be defined as the molecular markers for A and B factories. For factory H, molecular markers were alkanes chlorine substitutes and alkene chlorine substitutes, as well as benzene and its chlorine substitutes. Non-point source was located in the workshops and the production lines. Point source pollution of VOCs was from the vent of waste gases.

  17. Cascaded all-optical operations in a hybrid integrated 80-Gb/s logic circuit.

    Science.gov (United States)

    LeGrange, J D; Dinu, M; Sochor, T; Bollond, P; Kasper, A; Cabot, S; Johnson, G S; Kang, I; Grant, A; Kay, J; Jaques, J

    2014-06-01

    We demonstrate logic functionalities in a high-speed all-optical logic circuit based on differential Mach-Zehnder interferometers with semiconductor optical amplifiers as the nonlinear optical elements. The circuit, implemented by hybrid integration of the semiconductor optical amplifiers on a planar lightwave circuit platform fabricated in silica glass, can be flexibly configured to realize a variety of Boolean logic gates. We present both simulations and experimental demonstrations of cascaded all-optical operations for 80-Gb/s on-off keyed data.

  18. Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

    Science.gov (United States)

    Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

    2014-11-01

    E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration. © The Author(s) 2014.

  19. Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

    Science.gov (United States)

    Kuznetsov, G. V.; Kravchenko, E. V.

    2007-09-01

    Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the “aging” (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

  20. Use of picosecond optical pulses and FET's integrated with printed circuit antennas to generate millimeter wave radiation

    Science.gov (United States)

    Ni, D. C.; Plant, D. V.; Fetterman, H. R.; Matloubian, M.

    1991-03-01

    Millimeter-wave radiation has been generated from FETs and high electron mobility transistors (HEMTs), integrated with printed circuit antennas and illuminated with picosecond optical pulses. Modulation of the millimeter waves was achieved by applying a swept RF signal to the transistor gate. Using this technique, tunable electrical sidebands were added to the optically generated carrier providing a method of transmitting information. The technique also provides increased resolution for use in spectroscopic applications. Heterodyne detection demonstrated that the system continuously generated tunable radiation, constrained by the high-gain antenna, from 45 to 75 GHz.

  1. Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board

    Science.gov (United States)

    Hwang, Sung Hwan; Lee, Woo-Jin; Kim, Myoung Jin; Jung, Eun Joo; Kim, Gye Won; An, Jong Bae; Jung, Ki Young; Cha, Kyung Soon; Rho, Byung Sup

    2012-07-01

    We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70×8×0.25 mm. The completed active module has features of thinness (0.5 mm), small size (7×5 mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).

  2. Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

    Directory of Open Access Journals (Sweden)

    Ronal D. Montoya-Montoya

    2013-11-01

    Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

  3. Workload Balancing in Printed Circuit Board Assembly Shops = Baskili Devre Karti Dizgi Atölyelerinde Hat Dengeleme

    Directory of Open Access Journals (Sweden)

    Ekrem DUMAN

    2005-01-01

    Full Text Available In assembling printed circuit boards (PCB, the use of numerically or computer controlled electronic component placement machines has become quite popular in the last decades. However, serious operations research problems arise through their use such as, allocation of component types to machines, board production schedule, feeder configuration and placement sequencing. In this study, the problem of allocation of component types to machines is taken up where two non-identical machines are deployed serially on a line to complete the assembly process of PCBs. For the solution of this problem three heuristic algorithms are suggested and their performances are investigated on experimental data.

  4. Pulse Responses of a Two-layered Printed Circuit with an Improved Line-Pad Connected Structure

    Science.gov (United States)

    Kobayashi, Daisuke; Furukawa, Shinichi; Hinata, Takashi

    The peak value of transmitted pulse in printed circuit boards (PCB) is important for a pulse peak detection devices. When an input line and an output line are connected to each pad with the direction of right angle, the propagating pulses with the narrow time duration separate into some parts and decrease the peak value of pulse response. This paper presents an improved line-pad connected structure. The microstrip line is in contact with a pad from outside by considering the pulse propagation time passing through the via structure. We obtained the large peak value of the pulse response for which the time duration is larger than 0.2ps.

  5. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

    DEFF Research Database (Denmark)

    Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

    2013-01-01

    Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...... across the components, morphology of the coating, and analysis of dendrite formation due to electrochemical migration under the coating. The morphology of the coating before and after exposure was investigated using scanning electron microscopy, and energy dispersive X-ray spectroscopy. Results show...

  6. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

    Science.gov (United States)

    Korneeva, Anna; Shaydurov, Vladimir

    2016-08-01

    In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

  7. Robust Hybrid Finite Element Methods for Antennas and Microwave Circuits

    Science.gov (United States)

    Gong, J.; Volakis, John L.

    1996-01-01

    One of the primary goals in this dissertation is concerned with the development of robust hybrid finite element-boundary integral (FE-BI) techniques for modeling and design of conformal antennas of arbitrary shape. Both the finite element and integral equation methods will be first overviewed in this chapter with an emphasis on recently developed hybrid FE-BI methodologies for antennas, microwave and millimeter wave applications. The structure of the dissertation is then outlined. We conclude the chapter with discussions of certain fundamental concepts and methods in electromagnetics, which are important to this study.

  8. Integrated ion sensor device applications based on printed hybrid material systems (Conference Presentation)

    Science.gov (United States)

    List-Kratochvil, Emil J. W.

    2016-09-01

    Comfortable, wearable sensors and computers will enhance every person's awareness of his or her health condition, environment, chemical pollutants, potential hazards, and information of interest. In agriculture and in the food industry there is a need for a constant control of the condition and needs of plants, animals, and farm products. Yet many of these applications depend upon the development of novel, cheap devices and sensors that are easy to implement and to integrate. Organic semiconductors as well as several inorganic materials and hybrid material systems have proven to combine a number of intriguing optical and electronic properties with simple processing methods. As it will be reviewed in this contribution, these materials are believed to find their application in printed electronic devices allowing for the development of smart disposable devices in food-, health-, and environmental monitoring, diagnostics and control, possibly integrated into arrays of sensor elements for multi-parameter detection. In this contribution we review past and recent achievements in the field. Followed by a brief introduction, we will focus on two topics being on the agenda recently: a) the use of electrolyte-gated organic field-effect transistor (EGOFET) and ion-selective membrane based sensors for in-situ sensing of ions and biological substances and b) the development of hybrid material based resistive switches and their integration into fully functional, printed hybrid crossbar sensor array structures.

  9. Testing of the front-end hybrid circuits for the CMS Tracker upgrade

    Science.gov (United States)

    Gadek, T.; Blanchot, G.; Honma, A.; Kovacs, M.; Raymond, M.; Rose, P.

    2017-01-01

    The upgrade of the CMS Tracker for the HL-LHC requires the design of new double-sensor, silicon detector modules, which implement Level 1 trigger functionality in the increased luminosity environment. These new modules will contain two different, high-density front-end hybrid circuits, equipped with flip-chip ASICs, auxiliary electronic components and mechanical structures. The hybrids require qualification tests before they are assembled into modules. Test methods are proposed together with the corresponding test hardware and software. They include functional tests and signal injection in a cold environment to find possible failure modes of the hybrids under real operating conditions.

  10. Testing of the Front-End Hybrid Circuits for the CMS Tracker Upgrade

    CERN Document Server

    Gadek, Tomasz; Honma, Alan; Kovacs, Mark Istvan; Raymond, David Mark; Rose, Pierre

    2016-01-01

    The upgrade of the CMS tracker for the HL-LHC requires the design of new double-sensor, silicon detector modules, which implement Level 1 trigger functionality in the increased luminosity environment. These new modules will contain two different, high density front-end hybrid circuits, equipped with flip-chip ASICs, auxiliary electronic components and mechanical structures. The hybrids require qualification tests before they are assembled into modules. Test methods are proposed together with the corresponding test hardware and software. They include functional tests and signal injection in a cold environment to find possible failure modes of the hybrids under real operating conditions.

  11. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

    Science.gov (United States)

    Chakrabarti, B.; Lastras-Montaño, M. A.; Adam, G.; Prezioso, M.; Hoskins, B.; Cheng, K.-T.; Strukov, D. B.

    2017-02-01

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

  12. The Hybrid Integrated Circuit of the ALICE Inner Tracking System upgrade

    CERN Document Server

    Fiorenza, G; Pastore, C; Valentino, V

    2016-01-01

    The upgrade of the Inner Tracking System scheduled during the second long shutdown is an important milestone of the ALICE upgrade and it will provide a high improvement of its performances. In this contribution the smallest operator unit of the detector, the Hybrid Integrated Circuits, is presented.

  13. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

    Science.gov (United States)

    Chakrabarti, B.; Lastras-Montaño, M. A.; Adam, G.; Prezioso, M.; Hoskins, B.; Cheng, K.-T.; Strukov, D. B.

    2017-01-01

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit. PMID:28195239

  14. Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

    Science.gov (United States)

    Li, Xingang; Gao, Yujie; Ding, Hui

    2013-10-01

    The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

  15. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

    Science.gov (United States)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

    2015-01-01

    Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

  16. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

    Science.gov (United States)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-11-01

    This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  17. Development of Radiation-Tolerant, Low Mass, High Bandwidth Flexible Printed Circuit Cables for Particle Detection Applications

    Science.gov (United States)

    McFadden, Neil

    2016-03-01

    Design options for meter long flexible printed circuit cables required for low mass ultra-high speed signal transmission in the high radiation environment at the High Luminosity run of the Large Hadron Collider (LHC) are described. Two dielectric materials were considered in this study, Kapton and a Kapton/Teflon mixture. The design geometry is a differential embedded microstrip with nominal 100 Ω impedance. Minimal mass and maximal radiation hardness are pre-eminent considerations. The long flexible printed circuit cables are characterized in bit error rate tests (BERT), attenuation versus frequency, mechanical response to stress and temperature change, and RLC decomposition. These tests are performed before and after irradiation with 1 MeV neutrons to 2x1016/cm 2 and 800 MeV protons to 2x1016 1 MeV-neq/cm2. A 1.0 m Kapton cable, with bandwidth of 6.22 gigabits per second, 0.03% of a radiation length, and no radiation induced mechanical or electrical degradation is obtained.

  18. Hybrid quantum circuit with a superconducting qubit coupled to an electron spin ensemble

    Energy Technology Data Exchange (ETDEWEB)

    Kubo, Yuimaru; Grezes, Cecile; Vion, Denis; Esteve, Daniel; Bertet, Patrice [Quantronics Group, SPEC (CNRS URA 2464), CEA-Saclay, 91191 Gif-sur-Yvette (France); Diniz, Igor; Auffeves, Alexia [Institut Neel, CNRS, BP 166, 38042 Grenoble (France); Isoya, Jun-ichi [Research Center for Knowledge Communities, University of Tsukuba, 305-8550 Tsukuba (Japan); Jacques, Vincent; Dreau, Anais; Roch, Jean-Francois [LPQM (CNRS, UMR 8537), Ecole Normale Superieure de Cachan, 94235 Cachan (France)

    2013-07-01

    We report the experimental realization of a hybrid quantum circuit combining a superconducting qubit and an ensemble of electronic spins. The qubit, of the transmon type, is coherently coupled to the spin ensemble consisting of nitrogen-vacancy (NV) centers in a diamond crystal via a frequency-tunable superconducting resonator acting as a quantum bus. Using this circuit, we prepare arbitrary superpositions of the qubit states that we store into collective excitations of the spin ensemble and retrieve back into the qubit. We also report a new method for detecting the magnetic resonance of electronic spins at low temperature with a qubit using the hybrid quantum circuit, as well as our recent progress on spin echo experiments.

  19. A system-on-chip and paper-based inkjet printed electrodes for a hybrid wearable bio-sensing system.

    Science.gov (United States)

    Xie, Li; Yang, Geng; Mäntysalo, Matti; Jonsson, Fredrik; Zheng, Li-Rong

    2012-01-01

    This paper presents a hybrid wearable bio-sensing system, which combines traditional small-area low-power and high-performance System-on-Chip (SoC), flexible paper substrate and cost-effective Printed Electronics. Differential bio-signals are measured, digitized, stored and transmitted by the SoC. The total area of the chip is 1.5 × 3.0 mm(2). This enables the miniaturization of the wearable system. The electrodes and interconnects are inkjet printed on paper substrate and the performance is verified in in-vivo tests. The quality of electrocardiogram signal sensed by printed electrodes is comparable with commercial electrodes, with noise level slightly increased. The paper-based inkjet printed system is flexible, light and thin, which makes the final system comfortable for end-users. The hybrid bio-sensing system offers a potential solution to the next generation wearable healthcare technology.

  20. Delay-area trade-off for MPRM circuits based on hybrid discrete particle swarm optimization

    Institute of Scientific and Technical Information of China (English)

    Jiang Zhidi; Wang Zhenhai; Wang Pengjun

    2013-01-01

    Polarity optimization for mixed polarity Reed-Muller (MPRM) circuits is a combinatorial issue.Based on the study on discrete particle swarm optimization (DPSO) and mixed polarity,the corresponding relation between particle and mixed polarity is established,and the delay-area trade-off of large-scale MPRM circuits is proposed.Firstly,mutation operation and elitist strategy in genetic algorithm are incorporated into DPSO to further develop a hybrid DPSO (HDPSO).Then the best polarity for delay and area trade-off is searched for large-scale MPRM circuits by combining the HDPSO and a delay estimation model.Finally,the proposed algorithm is testified by MCNC Benchmarks.Experimental results show that HDPSO achieves a better convergence than DPSO in terms of search capability for large-scale MPRM circuits.

  1. Checking a printed board

    CERN Multimedia

    1977-01-01

    An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

  2. Integrating integrated circuit chips on paper substrates using inkjet printed electronics

    CSIR Research Space (South Africa)

    Bezuidenhout, Petrone H

    2016-11-01

    Full Text Available superglue manufactured by Loctite, the second was Unplasticised Polyvinyl Chloride (PVC-U) manufactured by Tangit and the third was a general-purpose silicone adhesive manufactured by Devil. 2.3 Measurement techniques 2.3.1 Structural analysis... connections may differ. Figure 6 shows several SOIC16 packages connected by printing connections using 5 µm, 25 µm, 35 µm and 50 µm drop spacing for 1, 2 or 3 printed layers. Superglue was used to attach the packages to the paper after the tracks were...

  3. Reactive Microcontact Printing of DNA Probes on (DMA-NAS-MAPS) Copolymer-Coated Substrates for Efficient Hybridization Platforms.

    Science.gov (United States)

    Castagna, Rossella; Bertucci, Alessandro; Prasetyanto, Eko Adi; Monticelli, Marco; Conca, Dario Valter; Massetti, Matteo; Sharma, Parikshit Pratim; Damin, Francesco; Chiari, Marcella; De Cola, Luisa; Bertacco, Riccardo

    2016-04-05

    High-performing hybridization platforms fabricated by reactive microcontact printing of DNA probes are presented. Multishaped PDMS molds are used to covalently bind oligonucleotides over a functional copolymer (DMA-NAS-MAPS) surface. Printed structures with minimum width of about 1.5 μm, spaced by 10 μm, are demonstrated, with edge corrugation lower than 300 nm. The quantification of the immobilized surface probes via fluorescence imaging gives a remarkable concentration of 3.3 × 10(3) oligonucleotides/μm(2), almost totally active when used as probes in DNA-DNA hybridization assays. Indeed, fluorescence and atomic force microscopy show a 95% efficiency in target binding and uniform DNA hybridization over printed areas.

  4. [Characterization of pyrolysis of waste printed circuit boards by high-resolution pyrolysis gas chromatography-mass spectrometry].

    Science.gov (United States)

    Zhang, Yanhong; Huang, Hong; Xia, Zhengbin; Chen, Huanqin

    2008-07-01

    Thermal degradation of pyrolysis of waste circuit boards was investigated by high-resolution pyrolysis gas chromatography-mass spectrometry (PyGC-MS) and thermogravimetry (TG). In helium atmosphere, the products of FR-4 waste printed circuit board were pyrolyzed at 350, 450, 550, 650, and 750 degrees degrees C, separately, and the pyrolysis products were identified by online MS. The results indicated that the pyrolysis products of the FR-4 waste circuit board were three kinds of substances, such as the low boiling point products, phenol, bisphenol and their related products. Moreover, under 300 degrees degrees C, only observed less pyrolysis products. As the increase of pyrolysis temperature, the relative content of the low boiling point products increased. In the range of 450-650 degrees degrees C, the qualitative analysis and character were similar, and the relative contents of phenol and bisphenol were higher. The influence of pyrolysis temperature on pyrolyzate yields was studied. On the basis of the pyrolyzate profile and the dependence of pyrolyzate yields on pyrolysis temperature, the thermal degradation mechanism of brominated epoxy resin was proposed.

  5. Capacitive and Inductive Parasitic Effects Determination, Due to the Traces in a Printed Circuit Board, when Using a π Type Filter

    OpenAIRE

    Uribe-Cruz O.; Peña-Rivero R.

    2011-01-01

    In this work the parasitic capacitive and inductive effects due to the strip lines in a printed circuit board are calculated. To find their values a MatLab code program was implemented and validated solving the electric equivalent circuit using the commercial software called Serenade. In this research a second order π-type filter was used in a commercial single-layer printedcircuit board.

  6. Capacitive and Inductive Parasitic Effects Determination, Due to the Traces in a Printed Circuit Board, when Using a π Type Filter

    Directory of Open Access Journals (Sweden)

    Uribe-Cruz O.

    2011-10-01

    Full Text Available In this work the parasitic capacitive and inductive effects due to the strip lines in a printed circuit board are calculated. To find their values a MatLab code program was implemented and validated solving the electric equivalent circuit using the commercial software called Serenade. In this research a second order π-type filter was used in a commercial single-layer printedcircuit board.

  7. An adaptive metamaterial beam with hybrid shunting circuits for extremely broadband control of flexural waves

    Science.gov (United States)

    Chen, Y. Y.; Hu, G. K.; Huang, G. L.

    2016-10-01

    A great deal of research has been devoted to controlling the dynamic behaviors of phononic crystals and metamaterials by directly tuning the frequency regions and/or widths of their inherent band gaps. Here, we report a new class of adaptive metamaterial beams with hybrid shunting circuits to realize super broadband Lamb-wave band gaps at an extreme subwavelength scale. The proposed metamaterial is made of a homogeneous host beam on which tunable local resonators consisting of hybrid shunted piezoelectric stacks with proof masses are attached. The hybrid shunting circuits are composed of negative-capacitance and negative-inductance elements connected in series or in parallel in order to tune the desired frequency-dependent stiffness. It is shown theoretically and numerically that by properly modifying the shunting impedance, the adaptive mechanical mechanism within the tunable resonator can produce high-pass and low-pass wave filtering capabilities for the zeroth-order anti-symmetric Lamb-wave modes. These unique behaviors are due to the hybrid effects from the negative-capacitance and negative-inductance circuit elements. Such a system opens up important perspectives for the development of adaptive vibration or wave-attenuation devices for broadband frequency applications.

  8. Full Wave Simulation of Integrated Circuits Using Hybrid Numerical Methods

    Science.gov (United States)

    Tan, Jilin

    Transmission lines play an important role in digital electronics, and in microwave and millimeter-wave circuits. Analysis, modeling, and design of transmission lines are critical to the development of the circuitry in the chip, subsystem, and system levels. In the past several decays, at the EM modeling level, the quasi-static approximation has been widely used due to its great simplicity. As the clock rates increase, the inter-connect effects such as signal delay, distortion, dispersion, reflection, and crosstalk, limit the performance of microwave systems. Meanwhile, the quasi-static approach loses its validity for some complex system structures. Since the successful system design of the PCB, MCM, and the chip packaging, rely very much on the computer aided EM level modeling and simulation, many new methods have been developed, such as the full wave approach, to guarantee the successful design. Many difficulties exist in the rigorous EM level analysis. Some of these include the difficulties in describing the behavior of the conductors with finite thickness and finite conductivity, the field singularity, and the arbitrary multilayered multi-transmission lines structures. This dissertation concentrates on the full wave study of the multi-conductor transmission lines with finite conductivity and finite thickness buried in an arbitrary lossy multilayered environment. Two general approaches have been developed. The first one is the integral equation method in which the dyadic Green's function for arbitrary layered media has been correctly formulated and has been tested both analytically and numerically. By applying this method, the double layered high dielectric permitivitty problem and the heavy dielectrical lossy problem in multilayered media in the CMOS circuit design have been solved. The second approach is the edge element method. In this study, the correct functional for the two dimensional propagation problem has been successfully constructed in a rigorous way

  9. Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

    Science.gov (United States)

    Bai, Shi; Zhang, Shigang; Zhou, Weiping; Ma, Delong; Ma, Ying; Joshi, Pooran; Hu, Anming

    2017-10-01

    Stretchable electronic sensing devices are defining the path toward wearable electronics. High-performance flexible strain sensors attached on clothing or human skin are required for potential applications in the entertainment, health monitoring, and medical care sectors. In this work, conducting copper electrodes were fabricated on polydimethylsiloxane as sensitive stretchable microsensors by integrating laser direct writing and transfer printing approaches. The copper electrode was reduced from copper salt using laser writing rather than the general approach of printing with pre-synthesized copper or copper oxide nanoparticles. An electrical resistivity of 96 μΩ cm was achieved on 40-μm-thick Cu electrodes on flexible substrates. The motion sensing functionality successfully demonstrated a high sensitivity and mechanical robustness. This in situ fabrication method leads to a path toward electronic devices on flexible substrates.[Figure not available: see fulltext.

  10. Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company.

    Science.gov (United States)

    Szoboszlai, Z; Kertész, Zs; Szikszai, Z; Angyal, A; Furu, E; Török, Zs; Daróczi, L; Kiss, A Z

    2012-02-15

    In this case study, the elemental composition and mass size distribution of indoor aerosol particles were determined in a working environment where soldering of printed circuit boards (PCB) took place. Single particle analysis using ion and electron microscopy was carried out to obtain more detailed and reliable data about the origin of these particles. As a result, outdoor and indoor aerosol sources such as wave soldering, fluxing processes, workers' activity, mineral dust, biomass burning, fertilizing and other anthropogenic sources could be separated. With the help of scanning electron microscopy, characteristic particle types were identified. On the basis of the mass size distribution data, a stochastic lung deposition model was used to calculate the total and regional deposition efficiencies of the different types of particles within the human respiratory system. The information presented in this study aims to give insights into the detailed characteristics and the health impact of aerosol particles in a working environment where different kinds of soldering activity take place.

  11. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    Energy Technology Data Exchange (ETDEWEB)

    Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  12. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    Science.gov (United States)

    Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

    2014-05-01

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  13. Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

    Science.gov (United States)

    Li, Jia; Xu, Zhenming; Zhou, Yaohe

    2008-05-30

    Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES.

  14. Electrostatic separation for recycling waste printed circuit board: a study on external factor and a robust design for optimization.

    Science.gov (United States)

    Hou, Shibing; Wu, Jiang; Qin, Yufei; Xu, Zhenming

    2010-07-01

    Electrostatic separation is an effective and environmentally friendly method for recycling waste printed circuit board (PCB) by several kinds of electrostatic separators. However, some notable problems have been detected in its applications and cannot be efficiently resolved by optimizing the separation process. Instead of the separator itself, these problems are mainly caused by some external factors such as the nonconductive powder (NP) and the superficial moisture of feeding granule mixture. These problems finally lead to an inefficient separation. In the present research, the impacts of these external factors were investigated and a robust design was built to optimize the process and to weaken the adverse impact. A most robust parameter setting (25 kv, 80 rpm) was concluded from the experimental design. In addition, some theoretical methods, including cyclone separation, were presented to eliminate these problems substantially. This will contribute to efficient electrostatic separation of waste PCB and make remarkable progress for industrial applications.

  15. Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

    Science.gov (United States)

    Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

    2016-11-01

    Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

  16. Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

    Directory of Open Access Journals (Sweden)

    Monier-Vinard Eric

    2016-01-01

    Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

  17. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect.

    Science.gov (United States)

    Li, Shu; Zhang, Tong

    2008-05-07

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

  18. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Li Shu; Zhang Tong [Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States)], E-mail: lis4@rpi.edu, E-mail: tzhang@ecse.rpi.edu

    2008-05-07

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

  19. Performance evaluation for an optical hybrid switch with circuit queued reservations

    Science.gov (United States)

    Wong, Eric W. M.; Zukerman, Moshe

    2005-11-01

    We provide here a new loss model for an optical hybrid switch that can function as an optical burst switch or optical circuit switch or both simultaneously. We introduce the feature of circuit queued reservation. That is, if a circuit request arrives and cannot find a free wavelength, and if there are not too many requests queued for reservations, it may join a queue and wait until such wavelength becomes available. We first present an analysis based on a 3-dimension state-space Markov chain that provides exact results for the blocking probabilities of bursts and circuits. We also provide results for the proportion of circuits that are delayed and the mean delay of the circuits that are delay. Because it is difficult to exactly compute the blocking probability in realistic scenarios with a large number of wavelengths, we derive computationally scalable and accurate approximations which are based on reducing the 3-dimension state space into a single dimension. These scalable approximations that can produce performance results in a fraction of a second can readily enable switch dimensioning.

  20. Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology

    Science.gov (United States)

    Kim, Jong-Hoi; Choe, Joong-Seon; Choi, Kwang-Seong; Youn, Chun-Ju; Kim, Duk-Jun; Jang, Sun-Hyok; Kwon, Yong-Hwan; Nam, Eun-Soo

    2011-12-01

    A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90°-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s.

  1. Series-connected substrate-integrated lead-carbon hybrid ultracapacitors with voltage-management circuit

    Indian Academy of Sciences (India)

    A Banerjee; R Srinivasan; A K Shukla

    2015-02-01

    Cell voltage for a fully charged-substrate-integrated lead-carbon hybrid ultracapacitor is about 2.3 V. Therefore, for applications requiring higher DC voltage, several of these ultracapacitors need to be connected in series. However, voltage distribution across each series-connected ultracapacitor tends to be uneven due to tolerance in capacitance and parasitic parallel-resistance values. Accordingly, voltage-management circuit is required to protect constituent ultracapacitors from exceeding their rated voltage. In this study, the design and characterization of the substrate-integrated lead-carbon hybrid ultracapacitor with co-located terminals is discussed. Voltage-management circuit for the ultracapacitor is presented, and its effectiveness is validated experimentally.

  2. A novel protection layer of superconducting microwave circuits toward a hybrid quantum system

    CERN Document Server

    Lee, Jongmin

    2014-01-01

    We propose a novel multilayer structure based on Bragg layers that can protect a superconducting microwave resonator from photons and blackbody radiation and have little effect on its quality factor. We also discuss a hybrid quantum system exploiting a superconducting microwave circuit and a two-color evanescent field atom trap, where surface-scattered photons and absorption-induced broadband blackbody radiation might deteriorate the system.

  3. Efficient scheme for hybrid teleportation via entangled coherent states in circuit quantum electrodynamics.

    Science.gov (United States)

    Joo, Jaewoo; Ginossar, Eran

    2016-06-01

    We propose a deterministic scheme for teleporting an unknown qubit state through continuous-variable entangled states in superconducting circuits. The qubit is a superconducting two-level system and the bipartite quantum channel is a microwave photonic entangled coherent state between two cavities. A Bell-type measurement performed on the hybrid state of solid and photonic states transfers a discrete-variable unknown electronic state to a continuous-variable photonic cat state in a cavity mode. In order to facilitate the implementation of such complex protocols we propose a design for reducing the self-Kerr nonlinearity in the cavity. The teleporation scheme enables quantum information processing operations with circuit-QED based on entangled coherent states. These include state verification and single-qubit operations with entangled coherent states. These are shown to be experimentally feasible with the state of the art superconducting circuits.

  4. Efficient scheme for hybrid teleportation via entangled coherent states in circuit quantum electrodynamics

    Science.gov (United States)

    Joo, Jaewoo; Ginossar, Eran

    2016-06-01

    We propose a deterministic scheme for teleporting an unknown qubit state through continuous-variable entangled states in superconducting circuits. The qubit is a superconducting two-level system and the bipartite quantum channel is a microwave photonic entangled coherent state between two cavities. A Bell-type measurement performed on the hybrid state of solid and photonic states transfers a discrete-variable unknown electronic state to a continuous-variable photonic cat state in a cavity mode. In order to facilitate the implementation of such complex protocols we propose a design for reducing the self-Kerr nonlinearity in the cavity. The teleporation scheme enables quantum information processing operations with circuit-QED based on entangled coherent states. These include state verification and single-qubit operations with entangled coherent states. These are shown to be experimentally feasible with the state of the art superconducting circuits.

  5. Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

    NARCIS (Netherlands)

    Tereshchenko, Olga Victorivna

    2015-01-01

    Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates thr

  6. A hybrid analytical model for open-circuit field calculation of multilayer interior permanent magnet machines

    Science.gov (United States)

    Zhang, Zhen; Xia, Changliang; Yan, Yan; Geng, Qiang; Shi, Tingna

    2017-08-01

    Due to the complicated rotor structure and nonlinear saturation of rotor bridges, it is difficult to build a fast and accurate analytical field calculation model for multilayer interior permanent magnet (IPM) machines. In this paper, a hybrid analytical model suitable for the open-circuit field calculation of multilayer IPM machines is proposed by coupling the magnetic equivalent circuit (MEC) method and the subdomain technique. In the proposed analytical model, the rotor magnetic field is calculated by the MEC method based on the Kirchhoff's law, while the field in the stator slot, slot opening and air-gap is calculated by subdomain technique based on the Maxwell's equation. To solve the whole field distribution of the multilayer IPM machines, the coupled boundary conditions on the rotor surface are deduced for the coupling of the rotor MEC and the analytical field distribution of the stator slot, slot opening and air-gap. The hybrid analytical model can be used to calculate the open-circuit air-gap field distribution, back electromotive force (EMF) and cogging torque of multilayer IPM machines. Compared with finite element analysis (FEA), it has the advantages of faster modeling, less computation source occupying and shorter time consuming, and meanwhile achieves the approximate accuracy. The analytical model is helpful and applicable for the open-circuit field calculation of multilayer IPM machines with any size and pole/slot number combination.

  7. Surface Breakdown of Printed Circuit Board under Magnetic Field with Reduced Pressure

    Institute of Scientific and Technical Information of China (English)

    杜伯学; 朱晓辉; 高宇; 卢欣

    2010-01-01

    Epoxy resin laminate onto which a pair of copper foil was printed was employed as test samples.The samples were placed in an artificial atmospheric chamber, which was vacuumed by a rotary pump from 100 kPa to 5 kPa.The magnetic field was produced by permanent magnets that were assembled to make E×B drift away from, into and parallel to the sample surface, respectively.Magnetic flux density was adjusted at 120 mT, 180 mT and 240 mT respectively.By applying a negative bias voltage between the electrodes, the ...

  8. [Physical work capacity of electronics workers (the assembling and checking of printed circuit boards)].

    Science.gov (United States)

    Khadzhiolova, I; Mincheva, L; Nakasheva, E; Diankova, M

    1984-01-01

    The physical capacity for work of electronic workers that assembly and check up the printed was determined. The physical capacity for work of the female assembly-workers is assessed to be moderate and that of the operators-very good. A reduction of the maximum oxygen consumption with 0.375 ml/kg per year was established in the female assembly-workers, in the age group 21-40. The results obtained are discussed in connection with the unfavourable effect of the reduced motor activity during work, taken as base for the elaboration of measures for the improvement of the physical capacity for work.

  9. Behaviour of one-step spray-coated carbon nanotube supercapacitor in ambient light harvester circuit with printed organic solar cell and electrochromic display

    Science.gov (United States)

    Tuukkanen, Sampo; Välimäki, Marja; Lehtimäki, Suvi; Vuorinen, Tiina; Lupo, Donald

    2016-03-01

    A printed energy harvesting and storage circuit powered by ambient office lighting and its use to power a printed display is reported. The autonomous device is composed of three printed electronic components: an organic photovoltaic module, a carbon-nanotubes-only supercapacitor and an electrochromic display element. Components are fabricated from safe and environmentally friendly materials, and have been fabricated using solution processing methods, which translate into low-cost and high-throughput manufacturing. A supercapacitor made of spray-coated carbon nanotube based ink and aqueous NaCl electrolyte was charged using a printed organic photovoltaic module exposed to office lighting conditions. The supercapacitor charging rate, self-discharge rate and display operation were studied in detail. The supercapacitor self-discharge rate was found to depend on the charging rate. The fully charged supercapacitor was used as a power source to run the electrochromic display over 50 times.

  10. Behaviour of one-step spray-coated carbon nanotube supercapacitor in ambient light harvester circuit with printed organic solar cell and electrochromic display.

    Science.gov (United States)

    Tuukkanen, Sampo; Välimäki, Marja; Lehtimäki, Suvi; Vuorinen, Tiina; Lupo, Donald

    2016-03-09

    A printed energy harvesting and storage circuit powered by ambient office lighting and its use to power a printed display is reported. The autonomous device is composed of three printed electronic components: an organic photovoltaic module, a carbon-nanotubes-only supercapacitor and an electrochromic display element. Components are fabricated from safe and environmentally friendly materials, and have been fabricated using solution processing methods, which translate into low-cost and high-throughput manufacturing. A supercapacitor made of spray-coated carbon nanotube based ink and aqueous NaCl electrolyte was charged using a printed organic photovoltaic module exposed to office lighting conditions. The supercapacitor charging rate, self-discharge rate and display operation were studied in detail. The supercapacitor self-discharge rate was found to depend on the charging rate. The fully charged supercapacitor was used as a power source to run the electrochromic display over 50 times.

  11. Hybrid copper complex-derived conductive patterns printed on polyimide substrates

    Science.gov (United States)

    Lee, Byoungyoon; Jeong, Sooncheol; Kim, Yoonhyun; Jeong, Inbum; Woo, Kyoohee; Moon, Jooho

    2012-06-01

    We synthesized new copper complexes that can be readily converted into highly conductive Cu film. Mechanochemical milling of copper (I) oxide suspended in formic acid resulted in the submicron-sized Cu formate together Cu nanoparticles. The submicrometer-sized Cu formates are reactive toward inter-particle sintering and metallic Cu seeds present in the Cu complexes assist their decomposition and the nucleation of Cu. The hybrid copper complex film printed on polyimide substrate is decomposed into dense and uniform Cu layer after annealing at 250 °C for 30 min under nitrogen atmosphere. The resulting Cu film exhibited a low resistivity of 8.2 μΩ·cm and good adhesion characteristics.

  12. Hybrid 3D printing and electrodeposition approach for controllable 3D alginate hydrogel formation.

    Science.gov (United States)

    Shang, Wanfeng; Liu, Yanting; Wan, Wenfeng; Hu, Chengzhi; Liu, Zeyang; Wong, Chin To; Fukuda, Toshio; Shen, Yajing

    2017-06-07

    Calcium alginate hydrogels are widely used as biocompatible materials in a substantial number of biomedical applications. This paper reports on a hybrid 3D printing and electrodeposition approach for forming 3D calcium alginate hydrogels in a controllable manner. Firstly, a specific 3D hydrogel printing system is developed by integrating a customized ejection syringe with a conventional 3D printer. Then, a mixed solution of sodium alginate and CaCO3 nanoparticles is filled into the syringe and can be continuously ejected out of the syringe nozzle onto a conductive substrate. When applying a DC voltage (∼5 V) between the substrate (anode) and the nozzle (cathode), the Ca(2+) released from the CaCO3 particles can crosslink the alginate to form calcium alginate hydrogel on the substrate. To elucidate the gel formation mechanism and better control the gel growth, we can further establish and verify a gel growth model by considering several key parameters, i.e., applied voltage and deposition time. The experimental results indicate that the alginate hydrogel of various 3D structures can be formed by controlling the movement of the 3D printer. A cell viability test is conducted and shows that the encapsulated cells in the gel can maintain a high survival rate (∼99% right after gel formation). This research establishes a reliable method for the controllable formation of 3D calcium alginate hydrogel, exhibiting great potential for use in basic biology and applied biomedical engineering.

  13. Field Emission Properties of the Graphene Double-Walled Carbon Nanotube Hybrid Films Prepared by Vacuum Filtration and Screen Printing

    Directory of Open Access Journals (Sweden)

    Jinzhuo Xu

    2013-01-01

    Full Text Available The graphene double-walled carbon nanotube (DWCNT hybrid films were prepared by vacuum filtration and screen printing. Their electron field emission properties have been studied systematically. The electron emission properties of the hybrid films are much better than those of pure DWCNT films and pure graphene films. Comparing with the screen printed films, the vacuum filtered films have many advantages, such as lower turn-on field, higher emission current density, better uniformity, better long-term stability, and stronger adhesive strength with conductive substrates. The optimized hybrid films with 20% weight ratio of graphene, which were fabricated by vacuum filtration, show the best electron emission performances with a low turn-on field of 0.50 Vμm−1 (at 1 μAcm−2 and a high field enhancement factor β of 27000.

  14. Low-loss characteristics of a multimode polymer optical circuit at 1.3-μm wavelength on printed circuit board

    Science.gov (United States)

    Amano, Takeru; Noriki, Akihiro

    2017-02-01

    We propose an optical and electrical hybrid LSI package with high bandwidth of 2.4 Tb/s and parallel multi-mode optical links at 1.3 μm using a polymer optical waveguide and our original optical I/O module. We report a silicate based organic-inorganic hybrid polymer optical circuit fabrication including waveguide, mirror and connector on electrical LSI package substrate. We also present about the propagation loss, bending loss and coupling loss at 1.3 μm using a MMF and a Si photonics transmitter. The propagation loss of the multimode polymer waveguide is 0.3 dB/cm at 1.3 μm. The minimum bending radian and value generated additional loss is 5 mm and 0.2 dB, respectively. The coupling loss of butt-coupling and mirror coupling from the polymer optical waveguide to the MMF is 0.4 dB and 1.2 dB, respectively. In addition, we measure the optical characteristics of LSI package substrate using our Si photonics transmitter integrated with vertical polymer waveguide. Owing to adoption of multi-mode transmission, large 1-dB alignment tolerances were obtained with efficient optical coupling.

  15. Electrically engineered polymer-carbon hybrid heterojunction for high-performance printed transistors

    Science.gov (United States)

    Kim, Do Hwan; Kang, Gyu Won; Shin, Hyeon-Jin; Kim, Woo-Jae

    2014-10-01

    Molecularly hybridized materials composed of polymer semiconductors (PSCs) and single-walled carbon nanotubes (SWNTs) may provide a new platform to exploit an advantageous combination of semiconductors, which yields electrical properties that are not available in a single component system. In this talk, we demonstrate high-performance ink-jet printed hybrid transistors with an electrically engineered heterostructure by using specially designed PSCs and semiconducting SWNTs (sc-SWNTs) whose system achieved a high mobility of 0.23 cm2V-1s-1, no Von shift, a low off-current, and good bias-stability. We also revealed that binding energy between PSCs and sc-SWNT was strongly affected by side-chain length of PSCs, leading to the formation of homogeneous nanohybrid film. Eventually, understanding of electrostatic interactions in the heterostructure and experimental results suggest criteria for the design of nanohybrid heterostructures. Acknowledgement. This work was supported by a grant (Code No. 2011-0031628) from the Center for Advanced Soft Electronics under the Global Frontier Research Program of the Ministry of Science, ICT and Future Planning, Korea. The authors acknowledge Prof. Kilwon Cho for collaboration on the analysis of x-ray diffraction.

  16. The study of hybrid model identification,computation analysis and fault location for nonlinear dynamic circuits and systems

    Institute of Scientific and Technical Information of China (English)

    XIE Hong; HE Yi-gang; ZENG Guan-da

    2006-01-01

    This paper presents the hybrid model identification for a class of nonlinear circuits and systems via a combination of the block-pulse function transform with the Volterra series.After discussing the method to establish the hybrid model and introducing the hybrid model identification,a set of relative formulas are derived for calculating the hybrid model and computing the Volterra series solution of nonlinear dynamic circuits and systems.In order to significantly reduce the computation cost for fault location,the paper presents a new fault diagnosis method based on multiple preset models that can be realized online.An example of identification simulation and fault diagnosis are given.Results show that the method has high accuracy and efficiency for fault location of nonlinear dynamic circuits and systems.

  17. Fluorescence detection test by black printed circuit board based microfluidic channel for polymerase chain reaction.

    Science.gov (United States)

    Hwang, Ji-Soo; Kim, Yu-Seop; Song, Hye-Jeong; Kim, Jong-Dae; Park, Chan-Young

    2015-01-01

    This paper proposes the optimal structure of a PCB-based micro PCR chip constructed on a PCB substrate using commercial adhesive tapes and plastic covers. The solder mask of the PCB substrate was coated black, and the area where the reaction chamber is attached was legend printed with white silk to minimize the noise during fluorescence detection. The performance of the PCR and fluorescence detection was compared using 6 types of reaction chambers, each made with different double-sided tapes. Three of the chambers were unsuccessful in completing the PCR. The performance of the other three chambers that successfully amplified DNA was compared using Taqman probe for Chlamydia Trachomatis DNA. The amplified product was illuminated diagonally with a blue LED to excite the product just before imaging, and the LED was turned off when the image was captured to prevent quenching of the probe. The images were taken 10 seconds prior to the last extension step for each cycle using a DSLR camera. The experiments were run as a quartet for each three chambers made with different double-sided tape. The results showed that there were significant difference between the three tapes.

  18. Single axis controlled hybrid magnetic bearing for left ventricular assist device: hybrid core and closed magnetic circuit.

    Science.gov (United States)

    da Silva, Isaias; Horikawa, Oswaldo; Cardoso, Jose R; Camargo, Fernando A; Andrade, Aron J P; Bock, Eduardo G P

    2011-05-01

    In previous studies, we presented main strategies for suspending the rotor of a mixed-flow type (centrifugal and axial) ventricular assist device (VAD), originally presented by the Institute Dante Pazzanese of Cardiology (IDPC), Brazil. Magnetic suspension is achieved by the use of a magnetic bearing architecture in which the active control is executed in only one degree of freedom, in the axial direction of the rotor. Remaining degrees of freedom, excepting the rotation, are restricted only by the attraction force between pairs of permanent magnets. This study is part of a joint project in development by IDPC and Escola Politecnica of São Paulo University, Brazil. This article shows advances in that project, presenting two promising solutions for magnetic bearings. One solution uses hybrid cores as electromagnetic actuators, that is, cores that combine iron and permanent magnets. The other solution uses actuators, also of hybrid type, but with the magnetic circuit closed by an iron core. After preliminary analysis, a pump prototype has been developed for each solution and has been tested. For each prototype, a brushless DC motor has been developed as the rotor driver. Each solution was evaluated by in vitro experiments and guidelines are extracted for future improvements. Tests have shown good results and demonstrated that one solution is not isolated from the other. One complements the other for the development of a single-axis-controlled, hybrid-type magnetic bearing for a mixed-flow type VAD.

  19. Hybrid quantum processors: molecular ensembles as quantum memory for solid state circuits.

    Science.gov (United States)

    Rabl, P; DeMille, D; Doyle, J M; Lukin, M D; Schoelkopf, R J; Zoller, P

    2006-07-21

    We investigate a hybrid quantum circuit where ensembles of cold polar molecules serve as long-lived quantum memories and optical interfaces for solid state quantum processors. The quantum memory realized by collective spin states (ensemble qubit) is coupled to a high-Q stripline cavity via microwave Raman processes. We show that, for convenient trap-surface distances of a few microm, strong coupling between the cavity and ensemble qubit can be achieved. We discuss basic quantum information protocols, including a swap from the cavity photon bus to the molecular quantum memory, and a deterministic two qubit gate. Finally, we investigate coherence properties of molecular ensemble quantum bits.

  20. Hybrid Quantum Processors: molecular ensembles as quantum memory for solid state circuits

    CERN Document Server

    Rabl, P; Doyle, J M; Lukin, M D; Schölkopf, R J; Zoller, P

    2006-01-01

    We investigate a hybrid quantum circuit where ensembles of cold polar molecules serve as long-lived quantum memories and optical interfaces for solid state quantum processors. The quantum memory realized by collective spin states (ensemble qubit) is coupled to a high-Q stripline cavity via microwave Raman processes. We show that for convenient trap-surface distances of a few $\\mu$m, strong coupling between the cavity and ensemble qubit can be achieved. We discuss basic quantum information protocols, including a swap from the cavity photon bus to the molecular quantum memory, and a deterministic two qubit gate. Finally, we investigate coherence properties of molecular ensemble quantum bits.

  1. All-fiber hybrid photon-plasmon circuits: integrating nanowire plasmonics with fiber optics.

    Science.gov (United States)

    Li, Xiyuan; Li, Wei; Guo, Xin; Lou, Jingyi; Tong, Limin

    2013-07-01

    We demonstrate all-fiber hybrid photon-plasmon circuits by integrating Ag nanowires with optical fibers. Relying on near-field coupling, we realize a photon-to-plasmon conversion efficiency up to 92% in a fiber-based nanowire plasmonic probe. Around optical communication band, we assemble an all-fiber resonator and a Mach-Zehnder interferometer (MZI) with Q-factor of 6 × 10(6) and extinction ratio up to 30 dB, respectively. Using the MZI, we demonstrate fiber-compatible plasmonic sensing with high sensitivity and low optical power.

  2. Characterization of 4 K CMOS devices and circuits for hybrid Josephson-CMOS systems

    OpenAIRE

    Yoshikawa, Nobuyuki; Tomida, T.; Tokuda, A.; Liu, Q.; Meng, X.(Institute of High Energy Physics, Beijing, China); Whiteley, SR.; VanDuzer, T.

    2005-01-01

    Characterization and modeling of CMOS devices at 4.2 K are carried out in order to simulate low-temperature operation of CMOS circuits for Josephson-CMOS hybrid systems. CMOS devices examined in this study have been fabricated by using 0.18 mu m, 0.25 mu m, and 0.35 mu m commercial CMOS processes. Their static IN characteristics and capacitances are measured at 4.2 K to establish the low-temperature device model based on the BSIM3 SPICE model. The propagation delays of CMOS inverters measured...

  3. Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method.

    Science.gov (United States)

    Lee, Kyu Byung; Kim, Jong Rok; Park, Goon Cherl; Cho, Hyoung Kyu

    2016-12-27

    Liquid film thickness measurements under temperature-varying conditions in a two-phase flow are of great importance to refining our understanding of two-phase flows. In order to overcome the limitations of the conventional electrical means of measuring the thickness of a liquid film, this study proposes a three-electrode conductance method, with the device fabricated on a flexible printed circuit board (FPCB). The three-electrode conductance method offers the advantage of applicability under conditions with varying temperatures in principle, while the FPCB has the advantage of usability on curved surfaces and in relatively high-temperature conditions in comparison with sensors based on a printed circuit board (PCB). Two types of prototype sensors were fabricated on an FPCB and the feasibility of both was confirmed in a calibration test conducted at different temperatures. With the calibrated sensor, liquid film thickness measurements were conducted via a falling liquid film flow experiment, and the working performance was tested.

  4. Chemical inertness of UV-cured optical elastomers within the printed circuit board manufacturing process for embedded waveguide applications

    Science.gov (United States)

    Kruse, Kevin; Walczak, Karl; Thomas, Nicholas; Swatowski, Brandon; Demars, Casey; Middlebrook, Christopher

    2014-03-01

    Embedding polymer optical waveguides (WGs) into printed circuit boards (PCBs) for intra-board or board-to-board high speed data communications requires polymer materials that are compatible and inert when exposed to common PCB manufacturing processes. Ensuring both WG functionality after chemical exposure and maintaining PCB manufacturing integrities within the production process is crucial for successful implementation. The PCB manufacturing flow is analyzed to expose major requirements that would be required for the successful implementation of polymer materials for embedded WG development. Chemical testing and analysis were performed on Dow Corning ® OE-4140 UV-Cured Optical Elastomer Core and Dow Corning® OE-4141 UV-Cured Optical Elastomer Cladding which are designed for low loss embedded optical WGs. Contamination testing was conducted to demonstrate polymer compatibility in both cured and uncured form. Various PCB chemicals were treated with uncured polymer material and tested for effective contamination. Fully polymerized multimode WGs were fabricated and exposed to PCB chemicals at temperatures and durations comparable to PCB manufacturing conditions. Chemical analysis shows that the chosen polymer is compatible and inert with most common PCB manufacturing processes.

  5. Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

    Science.gov (United States)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Song, In-Sang; Park, Junhong; Kim, Hak-Sung

    2015-03-01

    Woven glass fabric/BT (bismaleimide triazine) composite laminate (BT core), copper (Cu), and photoimageable solder resist (PSR) are the most widely used materials for semiconductors in electronic devices. Among these materials, BT core and PSR contain polymeric materials that exhibit viscoelastic behavior. For this reason, these materials are considered to have time- and temperature-dependent moduli during warpage analysis. However, the thin geometry of multilayer printed circuit board (PCB) film makes it difficult to identify viscoelastic characteristics. In this work, a vibration test method was proposed for measuring the viscoelastic properties of a multilayer PCB film at different temperatures. The beam-shaped specimens, composed of a BT core, Cu laminated on a BT core, and PSR and Cu laminated on a BT core, were used in the vibration test. The frequency-dependent variation of the complex bending stiffness was determined using a transfer function method. The storage modulus (E‧) of the BT core, Cu, and PSR as a function of temperature and frequency were obtained, and their temperature-dependent variation was identified. The obtained properties were fitted using a viscoelastic model for the BT core and the PSR, and a linear elastic model for the Cu. Warpage of a line pattern specimen due to temperature variation was measured using a shadow Moiré analysis and compared to predictions using a finite element model. The results provide information on the mechanism of warpage, especially warpage due to temperature-dependent variation in viscoelastic properties.

  6. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

    Science.gov (United States)

    Conseil-Gudla, Hélène; Jellesen, Morten S.; Ambat, Rajan

    2017-02-01

    Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable user environments. The investigation reported in this paper focuses on understanding the synergistic effect of such parameters, namely contamination, humidity, PCB surface finish, pitch distance, and potential bias on leakage current under different humidity levels, and electrochemical migration probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions. The level of base leakage current (BLC) was similar for the different surface finishes and NaCl contamination levels up to relative humidity (RH) of 65%. A significant increase in leakage current was found for comb patterns contaminated with NaCl above 70% to 75% RH, close to the deliquescent RH of NaCl. Droplet tests on Cu comb patterns with varying pitch size showed that the initial BLC before dendrite formation increased with increasing NaCl contamination level, whereas electrochemical migration and the frequency of dendrite formation increased with bias voltage. The effect of different surface finishes on leakage current under humid conditions was not very prominent.

  7. An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

    Science.gov (United States)

    Birloaga, Ionela; Coman, Vasile; Kopacek, Bernd; Vegliò, Francesco

    2014-12-01

    This study refers to two chemical leaching systems for the base and precious metals extraction from waste printed circuit boards (WPCBs); sulfuric acid with hydrogen peroxide have been used for the first group of metals, meantime thiourea with the ferric ion in sulfuric acid medium were employed for the second one. The cementation process with zinc, copper and iron metal powders was attempted for solutions purification. The effects of hydrogen peroxide volume in rapport with sulfuric acid concentration and temperature were evaluated for oxidative leaching process. 2M H2SO4 (98% w/v), 5% H2O2, 25 °C, 1/10 S/L ratio and 200 rpm were founded as optimal conditions for Cu extraction. Thiourea acid leaching process, performed on the solid filtrate obtained after three oxidative leaching steps, was carried out with 20 g/L of CS(NH2)2, 6g/L of Fe(3+), 0.5M H2SO4, The cross-leaching method was applied by reusing of thiourea liquid suspension and immersing 5 g/L of this reagent for each other experiment material of leaching. This procedure has lead to the doubling and, respectively, tripling, of gold and silver concentrations into solution. These results reveal a very efficient, promising and environmental friendly method for WPCBs processing.

  8. Zinc Oxide Nanorods Grown on Printed Circuit Board for Extended-Gate Field-Effect Transistor pH Sensor

    Science.gov (United States)

    Van Thanh, Pham; Nhu, Le Thi Quynh; Mai, Hong Hanh; Tuyen, Nguyen Viet; Doanh, Sai Cong; Viet, Nguyen Canh; Kien, Do Trung

    2017-02-01

    Zinc oxide (ZnO) nanorods (NRs) were grown directly on printed circuit boards with a 35-μm-thick copper layer using a seedless galvanic-cell hydrothermal process. The hexagonal structure of the synthesized ZnO NRs was observed by scanning electron microscopy. The microstructural characteristics of the as-grown ZnO NRs were investigated by x-ray diffraction analysis, revealing preferred (002) growth direction. Raman and photoluminescence spectra confirmed the high crystalline quality of the ZnO NRs. As-grown ZnO NRs were then grown for 7 h using the galvanic effect for use as the pH membrane of an extended-gate field-effect transistor pH sensor (pH-EGFET). The current-voltage characteristics showed sensitivity of 15.4 mV/pH and 0.26 (μA)1/2/pH in the linear and saturated region, respectively. Due to their cost effectiveness, low-temperature processing, and ease of fabrication, such devices are potential candidates for use as flexible, low-cost, disposable biosensors.

  9. Comparative study on performance of a zigzag printed circuit heat exchanger with various channel shapes and configurations

    Science.gov (United States)

    Lee, Sang-Moon; Kim, Kwang-Yong

    2013-07-01

    Comparative study has been performed with various channel cross-sectional shapes and channel configurations of a zigzag printed circuit heat exchanger (PCHE), which has been considered as a heat exchanging device for the gas turbine based generation systems. Three-dimensional Reynolds-averaged Navier-Stokes equations and heat transfer equations are solved to analyze conjugate heat transfer in the zigzag channels. The shear stress transport model with a low Reynolds number wall treatment is used as a turbulence closure. The global Nusselt number, Colburn j-factor, effectiveness, and friction factor are used to estimate the thermal-hydraulic performance of the PCHE. Four different shapes of channel cross section (semicircular, rectangular, trapezoidal, and circular) and four different channel configurations are tested to determine their effects on thermal-hydraulic performance. The rectangular channel shows the best thermal performance but the worst hydraulic performance, while the circular channel shows the worst thermal performance. The Colburn j-factor and friction factor are found to be inversely proportional to the Reynolds number in cold channels, while the effectiveness and global Nusselt number are proportional to the Reynolds number.

  10. Experimental and CFD Analysis of Printed Circuit Heat Exchanger for Supercritical CO{sub 2} Power Cycle Application

    Energy Technology Data Exchange (ETDEWEB)

    Baik, Seungjoon; Kim, Hyeon Tae; Kim, Seong Gu; Lee, Jekyoung; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

    2015-10-15

    The supercritical carbon dioxide (S-CO{sub 2}) power cycle has been suggested as an alternative for the SFR power generation system. First of all, relatively mild sodium-CO{sub 2} interaction can reduce the accident probability. Also the S-CO{sub 2} power conversion cycle can achieve high efficiency with SFR core thermal condition. Moreover, the S-CO{sub 2} power cycle can reduce cycle footprint due to high density of the working fluid. Recently, various compact heat exchangers have been studied for developing an optimal heat exchanger. In this paper, the printed circuit heat exchanger was selected for S-CO{sub 2} power cycle applications and was closely investigated experimentally and analytically. Recently, design and performance prediction of PCHE received attention due to its importance in high pressure power systems such as S-CO{sub 2} cycle. To evaluate a PCHE performance with CO{sub 2} to water, KAIST research team designed and tested a lab-scale PCHE. From the experimental data and CFD analysis, pressure drop and heat transfer correlations are obtained. For the CFD analysis, Ansys-CFX commercial code was utilized with RGP table implementation. In near future, the turbulence model sensitivity study will be followed.

  11. Electrokinetic recovery of Cd, Cr, As, Ni, Zn and Mn from waste printed circuit boards: effect of assisting agents.

    Science.gov (United States)

    Xiu, Fu-Rong; Zhang, Fu-Shen

    2009-10-15

    The printed circuit boards (PCBs) contains large number of heavy metal such as Cd, Cr, As, Ni, Zn and Mn. In this study, the use of electrokinetic (EK) treatment with different assisting agents has been investigated to recover the heavy metals from waste PCBs, and the effectiveness of different assisting agents (HNO(3), HCl, citric acid) was evaluated. The PCBs were first pre-treated by supercritical water oxidation (SCWO) process, then subjected to EK process. The heavy metal speciation, migration and recovery efficiency in the presence of different assisting agents during EK process were discussed. The mass loss of Cd, Cr, As and Zn during the SCWO process was negligible, but approximately 52% of Ni and 56% of Mn were lost in such a process. Experimental results showed that different assisting agents have significant effect on the behavior and recovery efficiency of different heavy metals. HCl was highly efficient for the recovery of Cd in waste PCBs due to the low pH and the stable complexation of Cl(-). Citric acid was highly efficient for the recovery of Cr, Zn and Mn. HNO(3) was low efficient for recovery of most heavy metals except for Ni.

  12. Direct extraction of palladium and silver from waste printed circuit boards powder by supercritical fluids oxidation-extraction process.

    Science.gov (United States)

    Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

    2016-11-15

    The current study was carried out to develop an environmental benign process for direct recovery of palladium (Pd) and silver (Ag) from waste printed circuit boards (PCBs) powder. The process ingeniously combined supercritical water oxidation (SCWO) and supercritical carbon dioxide (Sc-CO2) extraction techniques. SCWO treatment could effectively enrich Pd and Ag by degrading non-metallic component, and a precious metal concentrate (PMC) could be obtained, in which the enrichment factors of Pd and Ag reached 5.3 and 4.8, respectively. In the second stage, more than 93.7% Pd and 96.4% Ag could be extracted from PMC by Sc-CO2 modified with acetone and KI-I2 under optimum conditions. Mechanism study indicated that Pd and Ag extraction by Sc-CO2 was a complicated physiochemical process, involving oxidation, complexation, anion exchange, mass transfer and migration approaches. Accordingly, this study established a benign and effective process for selective recovery of dispersal precious metals from waste materials.

  13. A novel recovery method of copper from waste printed circuit boards by supercritical methanol process: Preparation of ultrafine copper materials.

    Science.gov (United States)

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen; Chen, Mengjun

    2017-02-01

    In this study, supercritical methanol (SCM) process was successfully used for the preparation of ultrafine copper materials from waste printed circuit boards (PCBs) after nitric acid pretreatment. Waste PCBs were pretreated twice in nitric acid. Sn and Pb were recovered by the first nitric acid pretreatment. The leach liquor with a high concentration of copper ions after the second nitric acid leaching was subjected to SCM process. The mixture of Cu and Cu2O with poor uniformity of particle size was formed due to the effect of ferric iron contained in the leach liquor of waste PCBs, while more uniform and spherical Cu particles with high monodispersity and smaller size could be prepared after the removal of Fe. The size of Cu particles increased obviously with the decline of SCM temperature, and particles became highly aggregated when the reaction temperature decreased to 300°C. The size of Cu particles decreased markedly with the decrease of initial concentration of copper ion in the leach liquor of waste PCBs. It is believed that the process developed in this study is simple and practical for the preparation of ultrafine copper materials from waste PCBs with the aim of recycling these waste resources as a high value-added product. Copyright © 2016 Elsevier Ltd. All rights reserved.

  14. Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

    Science.gov (United States)

    Yang, Shuangqiao; Bai, Shibing; Wang, Qi

    2016-11-01

    In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources.

  15. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

    Science.gov (United States)

    Conseil-Gudla, Hélène; Jellesen, Morten S.; Ambat, Rajan

    2016-10-01

    Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable user environments. The investigation reported in this paper focuses on understanding the synergistic effect of such parameters, namely contamination, humidity, PCB surface finish, pitch distance, and potential bias on leakage current under different humidity levels, and electrochemical migration probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions. The level of base leakage current (BLC) was similar for the different surface finishes and NaCl contamination levels up to relative humidity (RH) of 65%. A significant increase in leakage current was found for comb patterns contaminated with NaCl above 70% to 75% RH, close to the deliquescent RH of NaCl. Droplet tests on Cu comb patterns with varying pitch size showed that the initial BLC before dendrite formation increased with increasing NaCl contamination level, whereas electrochemical migration and the frequency of dendrite formation increased with bias voltage. The effect of different surface finishes on leakage current under humid conditions was not very prominent.

  16. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride).

    Science.gov (United States)

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-09-05

    In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu2O, CuO, and SnO2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu(0)→Cu(+)→Cu(2+)) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu(+) and Cu(2+). After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  17. Electrostatic separation for multi-size granule of crushed printed circuit board waste using two-roll separator.

    Science.gov (United States)

    Wu, Jiang; Li, Jia; Xu, Zhenming

    2008-11-30

    The electrostatic separation is an effective method for recycle of crushed waste electrical and electronic equipment (WEEE). However, the robustness of the classical roll-type separator is vulnerable because of its sensitivity to variation of granule size. A new "two-roll type corona-electrostatic separator" was built to overcome the limitation of the classical one considering the actual situation of the industrial application which always contains granule with different size. Multi-size granule of crushed printed circuit board (PCB) wastes was used for investigation and the results showed that the efficiency of the separation process was improved by using the new separator. Compared with the process (lower voltage) performed on the old separator, the metal products increased 34% while the middling products reduced 73%, respectively. Compared with the process (higher voltage) performed on the old separator, the metal products increased 22% while the middling products reduced 59%, respectively. In addition, the metal component of the middling products using new machine notably decreased, 33% (new machine) compared with 58% (lower voltage) and 66% (higher voltage). The efficiency of the separation process is enhanced compared with the classical one.

  18. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process.

    Science.gov (United States)

    Xiu, Fu-Rong; Zhang, Fu-Shen

    2009-06-15

    An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu(2)O and beta-PbO(2) in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11h, 20 mA cm(-2), respectively. The recovery percentages of copper and lead under optimum SCWO+EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

  19. Recovery of metals from waste printed circuit boards by supercritical water pre-treatment combined with acid leaching process.

    Science.gov (United States)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2013-05-01

    Waste printed circuit boards (PCBs) contain a large number of metals such as Cu, Sn, Pb, Cd, Cr, Zn, and Mn. In this work, an efficient and environmentally friendly process for metals recovery from waste PCBs by supercritical water (SCW) pre-treatment combined with acid leaching was developed. In the proposed process, waste PCBs were pre-treated by SCW, then the separated solid phase product with concentrated metals was subjected to an acid leaching process for metals recovery. The effect of SCW pre-treatment on the recovery of different metals from waste PCBs was investigated. Two methods of SCW pre-treatment were studied: supercritical water oxidation (SCWO) and supercritical water depolymerization (SCWD). Experimental results indicated that SCWO and SCWD pre-treatment had significant effect on the recovery of different metals. SCWO pre-treatment was highly efficient for enhancing the recovery of Cu and Pb, and the recovery efficiency increased significantly with increasing pre-treatment temperature. The recovery efficiency of Cu and Pb for SCWO pre-treatment at 420°C was 99.8% and 80%, respectively, whereas most of the Sn and Cr were immobilized in the residue. The recovery of all studied metals was enhanced by SCWD pre-treatment and increased along with pre-treatment temperature. Up to 90% of Sn, Zn, Cr, Cd, and Mn could be recovered for SCWD pre-treatment at 440°C. Copyright © 2013 Elsevier Ltd. All rights reserved.

  20. Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

    Energy Technology Data Exchange (ETDEWEB)

    2010-12-01

    The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

  1. Wideband vibrational electromagnetic energy harvesters with nonlinear polyimide springs based on rigid-flex printed circuit boards technology

    Science.gov (United States)

    Chiu, Yi; Hong, Hao-Chiao; Hsu, Wei-Hung

    2016-12-01

    A wideband vibrational electromagnetic energy harvester employing nonlinear spring effects is proposed and demonstrated. The harvesters were designed and fabricated by commercial rigid-flex printed circuit boards technology. Rigid FR-4 boards were used for mechanical support and coil winding, whereas flexible polyimide films were patterned for mechanical springs and mass platforms. Two sets of coils were patterned and fabricated in the harvester with an internal coil resistance of about 16 Ω each. Two rare-earth magnets were attached to the central platform as shuttle mass. The total dimension of the harvester was 20 × 20 × 4 mm3. In vibration tests, nonlinearity could be observed even at 0.1 grms vibration level due to the spring hardening effect. The frequency for peak induced voltage increased from 187 Hz at low vibration to 382 Hz at 5 grms vibration. The effective half-power bandwidth increased from 8 Hz at 0.1 grms to 32 Hz at 1 grms and 52 Hz at 5 grms due to the hysteresis in frequency response. For a matched load and 1 grms vibration at 250 Hz, the maximum output power was 160 nW, corresponding to a power density of 100 nW cm-3.

  2. Performance of the heavy fraction of pyrolysis oil derived from waste printed circuit boards in modifying asphalt.

    Science.gov (United States)

    Yang, Fan; Sun, Shuiyu; Zhong, Sheng; Li, Shenyong; Wang, Yi; Wu, Jiaqi

    2013-09-15

    The focus of this research was the development of efficient and affordable asphalt modifiers. Pyrolysis oil was produced as a byproduct from the pyrolysis of waste printed circuit boards (WPCBs). The high boiling point fraction was separated from the pyrolysis oil through distillation and is referred to as the heavy fraction of pyrolysis oil (HFPO). The HFPO was tested as an asphalt modifier. Three asphalt modifiers were tested: HFPO; styrene-butadiene rubber (SBR); and HFPO + SBR (1:1). The physical properties and road performance of the three modified asphalts were measured and evaluated. The results have shown that when the amount of modifier was less than 10%, the HFPO modified asphalt had the highest softening point of the three. The dynamic stability (DS) and water resistance of the asphalt mixture with the HFPO modified asphalt was 10,161 cycles/mm and 87.2%, respectively. The DS was much larger than for the HFPO + SBR and SBR modified asphalt mixtures. These results indicate that using HFPO as an asphalt modifier has significant benefits not only for road engineering but also for resource recycling.

  3. Production and characterization of polypropylene composites filled with glass fibre recycled from pyrolysed waste printed circuit boards.

    Science.gov (United States)

    Li, Shenyong; Sun, Shuiyu; Liang, Haifeng; Zhong, Sheng; Yang, Fan

    2014-01-01

    Waste printed circuit boards (WPCBs) are composed of nearly 70% non-metals, which are generally recycled as low-value filling materials or even directly dumped in landfills. In this study, polypropylene (PP) composites reinforced by recycled pure glass fibres (RGF) from pyrolysed WPCBs were successfully produced. The manufacturing process, mechanical properties and thermal behaviour of the composites were investigated. The results showed that the appropriate addition of RGF in the composites can significantly improve the mechanical properties and thermal behaviour. When the added content of RGF was 30%, the maximum increment of tensile strength, impact strength, flexural strength and flexural modulus of the glass fibre (GF)/PP composites are 25.93%, 41.38%, 31.16% and 68.42%, respectively, and the vicat softening temperature could rise by 4.6°C. Furthermore, leaching of the GF/PP composites was also investigated. The GF/PP composites exhibited high performance and non-toxicity, offering a promising method to recycle RGF from pyrolysed WPCBs with high-value applications.

  4. Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

    Science.gov (United States)

    Zhan, Lu; Xu, Zhenming

    2008-10-15

    The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

  5. Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology.

    Science.gov (United States)

    Zhou, Yihui; Wu, WenBiao; Qiu, Keqiang

    2011-12-01

    Here, we focused on the recycling of waste printed circuit boards (WPCBs) using vacuum pyrolysis-centrifugation coupling technology (VPCT) aiming to obtain valuable feedstock and resolve environmental pollution. The two types of WPCBs were pyrolysed at 600°C for 30 min under vacuum condition. During the pyrolysis process, the solder of WPCBs was separated and recovered when the temperature range was 400-600°C, and the rotating drum was rotated at 1000 rpm for 10 min. The type-A of WPCBs pyrolysed to form an average of 67.91 wt.% residue, 27.84 wt.% oil, and 4.25 wt.% gas; and pyrolysis of the type-B of WPCBs led to an average mass balance of 72.22 wt.% residue, 21.57 wt.% oil, and 6.21 wt.% gas. The GC-MS and FT-IR analyses showed that the two pyrolysis oils consisted mainly of phenols and substituted phenols. The pyrolysis oil can be used for fuel or chemical feedstock for further processing. The recovered solder can be recycled directly and it can also be a good resource of lead and tin for refining. The pyrolysis residues contained various metals, glass fibers and other inorganic materials, which could be recovered after further treatment. The pyrolysis gases consisted mainly of CO, CO(2), CH(4), and H(2), which could be collected and recycled.

  6. Suppressing effect of calcium-based waste on control of bromine flux during the pyrolysis of printed circuit boards.

    Science.gov (United States)

    Jie, Guan; Min, Xu; Wu, Wenjie; Zhang, Chenglong; Wang, Jingwei; Bai, Jianfeng

    2012-11-01

    The effect of calcium-based addition on the brominate flux during printed circuit board (PCB) pyrolysis was investigated. It was found that bromine (Br) can be effectively fixed in solid phase during PCB pyrolysis by adding calcium-based waste materials. Phenol and 4-ethylphenol are the major products of pyrolysis. When the two kinds of red mud were used as additive, their content was 85.25 and 84.81%, respectively, which was higher than others. The 2-bromophenol and 2-bromo-4-methyl-benzene are the main Br-containing pyrolysis volatiles. After adding calcium-based additive, these two volatiles were apparently reduced and only small amounts of 2-bromo-4-methyl-benzene were detected in the products, namely 0.71 and 0.86%, respectively for the two kinds of red mud. Hence, no matter from the perspective of product use or simple Br-fixing, the bromine in the three-phase products can be effectively regulated and controlled by adding calcium-based waste residue during PCB pyrolysis. Finally, the Br-fixing mechanism was analysed. As a result, when calcium-based waste materials were added to the PCB pyrolysis it made bromine fix easily in the resident yielding a byproduct that can be further used.

  7. Study of the transference rules for bromine in waste printed circuit boards during microwave-induced pyrolysis.

    Science.gov (United States)

    Sun, Jing; Wang, Wenlong; Liu, Zhen; Ma, Chunyuan

    2011-05-01

    The production of waste printed circuit boards (WPCBs) has drawn increasing global concern, especially because the high bromine (Br) content (5-15%) places obstacles in the way of simple disposal techniques. Microwave-induced pyrolysis of WPCBs provides a promising way to dispose of these hazardous and resource-filled wastes. The transference rules for Br during microwave-induced pyrolysis have been investigated experimentally. It was found that the microwave energy could be used more efficiently to accelerate the heating rate and improve the final pyrolysis temperature by adding some activated carbon (AC) as microwave absorbents. The high temperature and rapid pyrolysis process promoted the yields of gaseous products and the decomposition of brominated compounds into hydrogen bromide and then benefited the capture of Br and the debromination of byproducts. The application of a calcium carbonate (CaCO3) layer overhead led to over 95% debromination of the liquid products and over 50% capture of the total Br. It can be concluded that the presented method is suitable for the control of Br transference in the recycling of WPCBs. This method can also be extended to the disposal of the electronic scraps.

  8. Determination of the potential gold electrowinning from an ammoniacal thiosulphate solution applied to recycling of printed circuit board scraps.

    Science.gov (United States)

    Kasper, Angela C; Carrillo Abad, Jordi; García Gabaldón, Montserrat; Veit, Hugo M; Pérez Herranz, Valentín

    2016-01-01

    The use of electrochemical techniques in the selective recovery of gold from a solution containing thiosulphate, ammonia, and copper, obtained from the leaching of printed circuit boards from mobile phones using ammoniacal thiosulphate, are shown in this work. First, cyclic voltammetry tests were performed to determine the potential of electrodeposition of gold and copper, and then, electrowinning tests at different potentials for checking the rates of recovery of these metals were performed. The results of the cyclic voltammetry show that copper deposition occurs at potentials more negative than -600 mV (Ag/AgCl), whereas the gold deposition can be performed at potentials more positives than -600 mV (Ag/AgCl). The results of electrowinning show that 99% of the gold present in solutions containing thiosulphate and copper can be selectively recovered in a potential range between -400 mV (vs Ag/AgCl) and -500 mV (vs Ag/AgCl). Furthermore, 99% of copper can be recovered in potentials more negative than -700 mV (vs Ag/AgCl).

  9. Investigation of measuring hazardous substances in printed circuit boards using the micro-focus X-ray fluorescence screening

    CERN Document Server

    Fu, M L; Fakhrtdinov, R; Grigoriev, M; Quan, B S; Le, Z C; Roshchupkin, D

    2014-01-01

    Printed circuit boards (PCBs) are widely used in most electrical and electronic equipments or products. Hazardous substances such as Pb, Hg, Cd, etc, can be present in high concentrations in PCBs and the degradation and release of these substances poses a huge threat to humans and the environment. To investigation the chemical composition of PCBs in domestic market of China, a practical micro-focus X-ray fluorescence system is setup to make the elements analysis, especially for detecting hazardous substances. Collimator is adopted to focus the X-ray emitted from X-ray tube. BRUKER X-ray detector with proportional counter is used to detect the emitted fluorescence from the PCB samples. Both single layer PCB samples and double layers PCB samples made of epoxy glass fiber are purchased from the domestic market of China. Besides, a MC55 wireless communication module made by SIEMENS in Germany is used as the reference material. Experimental results from the fluorescence spectrums of the testing points of PCB sampl...

  10. Ultra-sensitive electrical immunoassay biosensors using nanotextured zinc oxide thin films on printed circuit board platforms.

    Science.gov (United States)

    Jacobs, Michael; Muthukumar, Sriram; Panneer Selvam, Anjan; Engel Craven, Jon; Prasad, Shalini

    2014-05-15

    This study demonstrates the development of nanotextured zinc oxide (ZnO) thin films sputter deposited on printed circuit boards (PCB) to enhance the capability in detecting low concentrations of the protein troponin-T. The presence of this particular biomarker in the bloodstream is a direct indicator of current and/or future risk of various forms of cardiovascular diseases. Electrical transduction through impedance spectroscopy was used to detect troponin-T functionalized immunoassays on nanotextured ZnO surfaces. Calibration of the immunoassay was performed by measuring the impedance changes resulting from the binding of increasing concentrations of troponin-T to the immobilized antibodies on the ZnO surface in (i) phosphate buffered saline (PBS) and (ii) human serum. The limit of detection achieved using this platform was 10 fg/mL and 100 fg/mL in PBS and human serum, respectively. Enhanced detection of troponin-T was found to correlate to the oxygen vacancies in the ZnO thin film. PCB was chosen as the substrate for ease of integration with microelectronic device manufacturing. © 2013 Elsevier B.V. All rights reserved.

  11. Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

    Science.gov (United States)

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-09-01

    Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

  12. Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

    Science.gov (United States)

    Li, Jia; Zhou, Quan; Xu, Zhenming

    2014-12-01

    Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

  13. High temperature transformations of waste printed circuit boards from computer monitor and CPU: Characterisation of residues and kinetic studies.

    Science.gov (United States)

    Rajagopal, Raghu Raman; Rajarao, Ravindra; Sahajwalla, Veena

    2016-11-01

    This paper investigates the high temperature transformation, specifically the kinetic behaviour of the waste printed circuit board (WPCB) derived from computer monitor (single-sided/SSWPCB) and computer processing boards - CPU (multi-layered/MLWPCB) using Thermo-Gravimetric Analyser (TGA) and Vertical Thermo-Gravimetric Analyser (VTGA) techniques under nitrogen atmosphere. Furthermore, the resulting WPCB residues were subjected to characterisation using X-ray Fluorescence spectrometry (XRF), Carbon Analyser, X-ray Photoelectron Spectrometer (XPS) and Scanning Electron Microscopy (SEM). In order to analyse the material degradation of WPCB, TGA from 40°C to 700°C at the rates of 10°C, 20°C and 30°C and VTGA at 700°C, 900°C and 1100°C were performed respectively. The data obtained was analysed on the basis of first order reaction kinetics. Through experiments it is observed that there exists a substantial difference between SSWPCB and MLWPCB in their decomposition levels, kinetic behaviour and structural properties. The calculated activation energy (EA) of SSWPCB is found to be lower than that of MLWPCB. Elemental analysis of SSWPCB determines to have high carbon content in contrast to MLWPCB and differences in materials properties have significant influence on kinetics, which is ceramic rich, proving to have differences in the physicochemical properties. These high temperature transformation studies and associated analytical investigations provide fundamental understanding of different WPCB and its major variations. Copyright © 2015 Elsevier Ltd. All rights reserved.

  14. Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

    Directory of Open Access Journals (Sweden)

    Yi-Xuan Wang

    2017-05-01

    Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

  15. Zinc Oxide Nanorods Grown on Printed Circuit Board for Extended-Gate Field-Effect Transistor pH Sensor

    Science.gov (United States)

    Van Thanh, Pham; Nhu, Le Thi Quynh; Mai, Hong Hanh; Tuyen, Nguyen Viet; Doanh, Sai Cong; Viet, Nguyen Canh; Kien, Do Trung

    2017-06-01

    Zinc oxide (ZnO) nanorods (NRs) were grown directly on printed circuit boards with a 35- μm-thick copper layer using a seedless galvanic-cell hydrothermal process. The hexagonal structure of the synthesized ZnO NRs was observed by scanning electron microscopy. The microstructural characteristics of the as-grown ZnO NRs were investigated by x-ray diffraction analysis, revealing preferred (002) growth direction. Raman and photoluminescence spectra confirmed the high crystalline quality of the ZnO NRs. As-grown ZnO NRs were then grown for 7 h using the galvanic effect for use as the pH membrane of an extended-gate field-effect transistor pH sensor (pH-EGFET). The current-voltage characteristics showed sensitivity of 15.4 mV/pH and 0.26 ( μA)1/2/pH in the linear and saturated region, respectively. Due to their cost effectiveness, low-temperature processing, and ease of fabrication, such devices are potential candidates for use as flexible, low-cost, disposable biosensors.

  16. The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells.

    Science.gov (United States)

    Mazzuferi, Manuela; Bovolenta, Roberta; Bocchi, Massimo; Braun, Tanja; Bauer, Joerg; Jung, Erik; Iafelice, Bruno; Guerrieri, Roberto; Destro, Federica; Borgatti, Monica; Bianchi, Nicoletta; Simonato, Michele; Gambari, Roberto

    2010-02-01

    Printed circuit board (PCB) technology can be used for producing lab-on-a-chip (LOAC) devices. PCBs are characterized by low production costs and large-scale development, both essential elements in the frame of disposable applications. LOAC platforms have been employed not only for diagnostic and/or analytical purposes, but also for identification and isolation of eukaryotic cells, including cancer and stem cells. Accordingly, the compatibility of the employed materials with the biological system under analysis is critical for the development of LOAC devices to be proposed for efficient and safe cell isolation. In this study, we analyzed the in-vitro compatibility of a large set of materials and surface treatments used for LOAC development and evaluation with quasi-standard PCB processes. Biocompatibility was analyzed on hippocampal primary cells (a model of attached cell cultures), in comparison with the reference K562 cell line (a model of cells growing in suspension). We demonstrate here that some of the materials under study alter survival, organization, morphology and adhesion capacity of hippocampal cells, and inhibit growth and differentiation of K562 cells. Nonetheless, a subset of the materials tested did not negatively affect these functions, thus demonstrating that PCB technology, with some limitations, is suitable for the realization of LOAC devices well compatible at least with these preparations. (c) 2009 Elsevier Ltd. All rights reserved.

  17. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board.

    Science.gov (United States)

    Jiang, Wu; Jia, Li; Zhen-Ming, Xu

    2009-01-15

    The electrostatic separation is an effective method for recycling waste electrical and electronic equipment (WEEE). The efficiency of electrostatic separation processes depends on the ability of the separator. As a classical one, the roll-type corona-electrostatic separator has some advantages in recycling metals and plastics from waste printed circuit board (PCB). However, its industry application still faces some problems, such as: the further disposal of the middling products of the separation process; the balance of the production capacity and the good separation efficiency; the separation of the fine granular mixture and the stability of the separation process. A new "two-roll-type corona-electrostatic separator" was built to overcome the limitation of the classical one. The experimental data were discussed and the results showed that the outcome of the separation process was improved by using the new separator. Compared with the classical machine, the mass of conductive products increases 8.9% (groups 2 and 3) and10.2% (group 4) while the mass of the middling products decreases 45% (groups 2 and 3) and 31.7% (group 4), respectively. The production capacity of the new machine increases, and the stability of the separation process is enhanced.

  18. High-resolution mapping of in vivo gastrointestinal slow wave activity using flexible printed circuit board electrodes: methodology and validation.

    Science.gov (United States)

    Du, Peng; O'Grady, G; Egbuji, J U; Lammers, W J; Budgett, D; Nielsen, P; Windsor, J A; Pullan, A J; Cheng, L K

    2009-04-01

    High-resolution, multi-electrode mapping is providing valuable new insights into the origin, propagation, and abnormalities of gastrointestinal (GI) slow wave activity. Construction of high-resolution mapping arrays has previously been a costly and time-consuming endeavor, and existing arrays are not well suited for human research as they cannot be reliably and repeatedly sterilized. The design and fabrication of a new flexible printed circuit board (PCB) multi-electrode array that is suitable for GI mapping is presented, together with its in vivo validation in a porcine model. A modified methodology for characterizing slow waves and forming spatiotemporal activation maps showing slow waves propagation is also demonstrated. The validation study found that flexible PCB electrode arrays are able to reliably record gastric slow wave activity with signal quality near that achieved by traditional epoxy resin-embedded silver electrode arrays. Flexible PCB electrode arrays provide a clinically viable alternative to previously published devices for the high-resolution mapping of GI slow wave activity. PCBs may be mass-produced at low cost, and are easily sterilized and potentially disposable, making them ideally suited to intra-operative human use.

  19. Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

    Science.gov (United States)

    Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

    2016-08-01

    Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

  20. A novel circuit topology of modified switched boost hybrid resonant inverter fitted induction heating equipment

    Directory of Open Access Journals (Sweden)

    Bhattacharya Ananyo

    2016-12-01

    Full Text Available A novel circuit topology of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment is presented in this paper for efficient induction heating. Recently, induction heating technique is becoming very popular for both domestic and industrial purposes because of its high energy efficiency and controllability. Generally in induction heating, a high frequency alternating magnetic field is required to induce the eddy currents in the work piece. High frequency resonant inverters are incorporated in induction heating equipment which produce a high frequency alternating magnetic field surrounding the coil. Previously this high frequency alternating magnetic field was produced by voltage source inverters. But VSIs have several demerits. So, in this paper, a new scheme of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment has been depicted which enhances the energy efficiency and controllability and the same is validated by PSIM.

  1. A Hybrid Circuit for Spoof Surface Plasmons and Spatial Waveguide Modes to Reach Controllable Band-Pass Filters.

    Science.gov (United States)

    Zhang, Qian; Zhang, Hao Chi; Wu, Han; Cui, Tie Jun

    2015-11-10

    We propose a hybrid circuit for spoof surface plasmon polaritons (SPPs) and spatial waveguide modes to develop new microwave devices. The hybrid circuit includes a spoof SPP waveguide made of two anti-symmetric corrugated metallic strips and a traditional substrate integrated waveguide (SIW). From dispersion relations, we show that the electromagnetic waves only can propagate through the hybrid circuit when the operating frequency is less than the cut-off frequency of the SPP waveguide and greater than the cut-off frequency of SIW, generating efficient band-pass filters. We demonstrate that the pass band is controllable in a large range by designing the geometrical parameters of SPP waveguide and SIW. Full-wave simulations are provided to show the large adjustability of filters, including ultra wideband and narrowband filters. We fabricate a sample of the new hybrid device in the microwave frequencies, and measurement results have excellent agreements to numerical simulations, demonstrating excellent filtering characteristics such as low loss, high efficiency, and good square ratio. The proposed hybrid circuit gives important potential to accelerate the development of plasmonic integrated functional devices and circuits in both microwave and terahertz frequencies.

  2. Multi and mixed 3D-printing of graphene-hydroxyapatite hybrid materials for complex tissue engineering.

    Science.gov (United States)

    Jakus, Adam E; Shah, Ramille N

    2017-01-01

    With the emergence of three-dimensional (3D)-printing (3DP) as a vital tool in tissue engineering and medicine, there is an ever growing need to develop new biomaterials that can be 3D-printed and also emulate the compositional, structural, and functional complexities of human tissues and organs. In this work, we probe the 3D-printable biomaterials spectrum by combining two recently established functional 3D-printable particle-laden biomaterial inks: one that contains hydroxyapatite microspheres (hyperelastic bone, HB) and another that contains graphene nanoflakes (3D-graphene, 3DG). We demonstrate that not only can these distinct, osteogenic, and neurogenic inks be co-3D-printed to create complex, multimaterial constructs, but that composite inks of HB and 3DG can also be synthesized. Specifically, the printability, microstructural, mechanical, electrical, and biological properties of a hybrid material comprised of 1:1 HA:graphene by volume is investigated. The resulting HB-3DG hybrid exhibits mixed characteristics of the two distinct systems, while maintaining 3D-printability, electrical conductivity, and flexibility. In vitro assessment of HB-3DG using mesenchymal stem cells demonstrates the hybrid material supports cell viability and proliferation, as well as significantly upregulates both osteogenic and neurogenic gene expression over 14 days. This work ultimately demonstrates a significant step forward towards being able to 3D-print graded, multicompositional, and multifunctional constructs from hybrid inks for complex composite tissue engineering. © 2016 Wiley Periodicals, Inc. J Biomed Mater Res Part A: 105A: 274-283, 2017. © 2016 Wiley Periodicals, Inc.

  3. 废旧电路板中金的碘化法回收工艺%Gold recovery process with iodine method from waste printed circuit board

    Institute of Scientific and Technical Information of China (English)

    李桂春; 苑仁财; 康华; 王会平

    2012-01-01

    Aimed at recovering gold from waste printed circuit board, this paper proposes a crush-flotation-iodide leaching process. The process consists of crushing and classifying the waste printed circuit board, separating each particle size powder into metallic and nonmetallic, removing the base metal in metallic powder by nitric acid leaching, filtration, and recovering gold in the residue with iodine leaching method. Results show that metals and non-metals in the printed circuit boards exhibit a complete dissociation granularity of 0. 450 mm, the separation of less than 0. 450 mm printed circuit board powder by flo- tation process yields a mass fraction of sediment metals of 87.32%, and metal recovery of 90. 11%, and the iodine and iodide solutions gives effective leaching of the gold in the printed circuit boards powder within 3 h, with a leaching rate of 95.53%.%针对电路板中金的回收问题,提出粉碎一浮选一碘化浸出工艺。采用浮选法对经粉碎分级的电路板粉末进行分选实验,分选出的金属粉末用硝酸去除贱金属,过滤,由碘化法浸出滤渣中的金。实验结果表明:电路板中金属和非金属完全解离粒度为0.450mm;浮选分离小于0.450mm电路板粉末,沉物金属质量分数为87.32%,金属回收率为90.11%;碘和碘化物溶液可以在3h内有效浸出电路板粉末中的金,金浸出率为95.53%。

  4. A microfluidic microprocessor: controlling biomimetic containers and cells using hybrid integrated circuit/microfluidic chips.

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A; Westervelt, Robert M

    2010-11-07

    We present an integrated platform for performing biological and chemical experiments on a chip based on standard CMOS technology. We have developed a hybrid integrated circuit (IC)/microfluidic chip that can simultaneously control thousands of living cells and pL volumes of fluid, enabling a wide variety of chemical and biological tasks. Taking inspiration from cellular biology, phospholipid bilayer vesicles are used as robust picolitre containers for reagents on the chip. The hybrid chip can be programmed to trap, move, and porate individual living cells and vesicles and fuse and deform vesicles using electric fields. The IC spatially patterns electric fields in a microfluidic chamber using 128 × 256 (32,768) 11 × 11 μm(2) metal pixels, each of which can be individually driven with a radio frequency (RF) voltage. The chip's basic functions can be combined in series to perform complex biological and chemical tasks and can be performed in parallel on the chip's many pixels for high-throughput operations. The hybrid chip operates in two distinct modes, defined by the frequency of the RF voltage applied to the pixels: Voltages at MHz frequencies are used to trap, move, and deform objects using dielectrophoresis and voltages at frequencies below 1 kHz are used for electroporation and electrofusion. This work represents an important step towards miniaturizing the complex chemical and biological experiments used for diagnostics and research onto automated and inexpensive chips.

  5. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    Energy Technology Data Exchange (ETDEWEB)

    Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  6. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Jinxiu; Chen, Mengjun, E-mail: kyling@swust.edu.cn; Chen, Haiyan; Chen, Shu; Sun, Quan

    2014-02-15

    Highlights: • A Brønsted acidic ILs was used to leach Cu from WPCBs for the first time. • The particle size of WPCBs has significant influence on Cu leaching rate. • Cu leaching rate was higher than 99% under the optimum leaching conditions. • The leaching process can be modeled with shrinking core model, and the E{sub a} was 25.36 kJ/mol. - Abstract: In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO{sub 4}), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1–0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO{sub 4} can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol.

  7. Development of two-step process for enhanced biorecovery of Cu-Zn-Ni from computer printed circuit boards.

    Science.gov (United States)

    Shah, Monal B; Tipre, Devayani R; Purohit, Mamta S; Dave, Shailesh R

    2015-08-01

    Metal pollution due to the huge electronic waste (E-waste) accumulation is widespread across the globe. Extraction of copper, zinc and nickel from computer printed circuit boards (c-PCB) with a two-step bleaching process using ferric sulphate generated by Leptospirillum ferriphilum dominated consortium and the factors influencing the process were investigated in the present study. The studied factors with 10 g/L pulp density showed that pH 2.0 was optimum which resulted in 87.50-97.80% Cu-Zn-Ni extraction. Pre-treatment of PCB powder with acidified distilled water and NaCl solution showed 3.80-7.98% increase in metal extraction corresponding to 94.08% Cu, 99.80% Zn and 97.99% Ni extraction. Particle size of 75 μm for Cu and Zn while 1680 μm for Ni showed 2-folds increase in metal extraction, giving 97.35-99.80% Cu-Zn-Ni extraction in 2-6 days of reaction time. Whereas; 2.76-3.12 folds increase in Cu and Zn extraction was observed with the addition of 0.1% chelating agents. When the studies were carried out with high pulp density, ferric iron concentration of 16.57 g/L was found to be optimum for metal extraction from 75 g/L c-PCB and c-PCB addition in multiple installments resulted in 8.81-26.35% increase in metal extraction compared to single addition. The studied factors can be implemented for the scale-up aimed at faster recovery of multimetals from E-waste and thereby providing a secondary source of metal in an eco-friendly manner. Copyright © 2014 The Society for Biotechnology, Japan. Published by Elsevier B.V. All rights reserved.

  8. Copper sludge from printed circuit board production/recycling for ceramic materials: a quantitative analysis of copper transformation and immobilization.

    Science.gov (United States)

    Tang, Yuanyuan; Lee, Po-Heng; Shih, Kaimin

    2013-08-06

    The fast development of electronic industries and stringent requirement of recycling waste electronics have produced a large amount of metal-containing waste sludge. This study developed a waste-to-resource strategy to beneficially use such metal-containing sludge from the production and recycling processes of printed circuit board (PCBs). To observe the metal incorporation mechanisms and phase transformation processes, mixtures of copper industrial waste sludge and kaolinite-based materials (kaolinite and mullite) were fired between 650 and 1250 °C for 3 h. The different copper-hosting phases were identified by powder X-ray diffraction (XRD) in the sintered products, and CuAl2O4 was found to be the predominant hosting phase throughout the reactions, regardless of the strong reduction potential of copper expected at high temperatures. The experimental results indicated that CuAl2O4 was generated more easily and in larger quantities at low-temperature processing when using the kaolinite precursor. Maximum copper transformations reached 86% and 97% for kaolinite and mullite systems, respectively, when sintering at 1000 °C. To monitor the stabilization effect after thermal process, prolonged leaching tests were carried out using acetic acid with an initial pH value of 2.9 to leach the sintered products for 20 days. The results demonstrated the decrease of copper leachability with the formation of CuAl2O4, despite different sintering behavior in kaolinite and mullite systems. This study clearly indicates spinel formation as the most crucial metal stabilization mechanism when sintering copper sludge with aluminosilicate materials, and suggests a promising and reliable technique for reusing metal-containing sludge as ceramic materials.

  9. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

    Science.gov (United States)

    Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

    2015-11-01

    In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

  10. Laser-induced breakdown spectroscopy (LIBS) combined with hyperspectral imaging for the evaluation of printed circuit board composition.

    Science.gov (United States)

    Carvalho, Rodrigo R V; Coelho, Jomarc A O; Santos, Jozemir M; Aquino, Francisco W B; Carneiro, Renato L; Pereira-Filho, Edenir R

    2015-03-01

    In this study, laser-induced breakdown spectroscopy (LIBS) was combined with chemometric strategies (PCA, Principal Component Analysis) and scanning electron microscopy with energy-dispersive X-ray spectroscopy (SEM-EDS) to investigate the metal composition of a printed circuit board (PCB) sample from a mobile phone. Scanning electron microscopy-EDS was used for two main reasons: it was possible at the same time to visualize the sample surface, craters (made by the laser pulses) and also the chemical composition of the samples. A 30 mm×40 mm area of the mobile phone PCB sample, which was manufactured in 2011, was investigated. In this case, a matrix with 30 rows and 40 columns (1200 points) was analyzed, and 10 pulses were performed at each point. A total of 12,000 emission spectra were recorded in the wavelength range from 186 to 1040 nm. After an initial exploratory investigation using PCA, 18 emission lines were selected (representing the elements Al, Au, Ba, Ca, Co, Cu, Fe, K, Li, Mg, Mn, Na, Ni, Sb, Si, Sn, Ti and Zn) and then normalized by the relative intensities, and a new PCA was calculated with the autoscaled data. For example, Au and Si were mainly observed in the superficial electrical contacts and in the bulk of the PCB, respectively. A second sample (a mouse PCB) was also analyzed and Pb (emission lines 357.273, 363.956, 368.346, 373.994 and 405.780 nm) was identified in the solders. In addition, this element was determined using FAAS (flame atomic absorption spectrometry) and the Pb concentration was around 25% (w/w). This study opens the possibility for improved recycling processes and the chemical investigation of solid samples measuring a few millimeters in dimension without sample preparation. Copyright © 2014 Elsevier B.V. All rights reserved.

  11. Characterization and inventory of PCDD/Fs and PBDD/Fs emissions from the incineration of waste printed circuit board.

    Science.gov (United States)

    Duan, Huabo; Li, Jinhui; Liu, Yicheng; Yamazaki, Norimasa; Jiang, Wei

    2011-08-01

    Many developing countries have not significantly changed their course with regard to electronic waste contamination, and they are still facing the specter of mountains of hazardous electronic waste, with serious consequences for both the environment and public health. An efficient and stable analytical method was developed to determine the inventory and emission factors of polybrominated dibenzo-p-dioxin and dibenzofurans (PBDD/Fs) and polychlorinated dibenzo-p-dioxin and dibenzofurans (PCDD/Fs) formed from the incineration of scrap printed circuit boards (PCBs). Both PBDD/Fs and PCDD/Fs have been found in all experimental sections with a maximum formation rate at temperatures between 250 and 400 °C. The amounts tended first to increase and then began to decrease as the temperature rose. When subjected to a heating temperature of 325 °C, the total content of twelve 2,3,7,8-substituted PBDD/Fs congeners (tetra- through octabromo-) gathered from three outputs was the largest, at 19 000, 160 000, and 57 ng TEQ/kg in solid, liquid, and gaseous fractions, respectively; the total content of seventeen 2,3,7,8-substituted PCDD/Fs congeners (tetra- through octachloro-) was 820, 550, and 1.4 ng TEQ/kg. The formation of PCDD/Fs was remarkably less than that of PBDD/Fs because bromine concentrations considerably exceeded chlorine concentrations. The ingredients and conditions necessary to form PCDD/Fs or PBDD/Fs were definitely present, such as products of incomplete combustion, halogenides, an oxidizing atmosphere, and a catalyst-Cu salts being the most effective, significantly increasing the yields of PCDD/Fs and PBDD/Fs and decreasing the optimum temperature range.

  12. Volatile organic compounds and metal leaching from composite products made from fiberglass-resin portion of printed circuit board waste.

    Science.gov (United States)

    Guo, Jie; Jiang, Ying; Hu, Xiaofang; Xu, Zhenming

    2012-01-17

    This study focused on the volatile organic compounds (VOCs) and metal leaching from three kinds of composite products made from fiberglass-resin portion (FRP) of crushed printed circuit board (PCB) waste, including phenolic molding compound (PMC), wood plastic composite (WPC), and nonmetallic plate (NMP). Released VOCs from the composite products were quantified by air sampling on adsorbent followed by thermal desorption and GC-MS analysis. The results showed that VOCs emitted from composite products originated from the added organic components during manufacturing process. Phenol in PMC panels came primarily from phenolic resin, and the airborne concentration of phenol emitted from PMC product was 59.4 ± 6.1 μg/m(3), which was lower than odor threshold of 100% response for phenol (180 μg/m(3)). VOCs from WPC product mainly originated from wood flour, e.g., benzaldehyde, octanal, and d-limonene were emitted in relatively low concentrations. For VOCs emitted from NMP product, the airborne concentration of styrene was the highest (633 ± 67 μg/m(3)). Leaching characteristics of metal ions from composite products were tested using acetic acid buffer solution and sulphuric acid and nitric acid solution. Then the metal concentrations in the leachates were tested by ICP-AES. The results showed that only the concentration of Cu (average = 893 mg/L; limit = 100 mg/L) in the leachate solution of the FRP using acetic acid buffer solution exceeded the standard limit. However, concentrations of other metal ions (Pb, Cd, Cr, Ba, and Ni) were within the standard limit. All the results indicated that the FRP in composite products was not a major concern in terms of environmental assessment based upon VOCs tests and leaching characteristics.

  13. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2016-09-05

    Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu{sub 2}O, CuO, and SnO{sub 2} were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu{sup 0} → Cu{sup +} → Cu{sup 2+}) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu{sup +} and Cu{sup 2+}. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  14. 3D printing of high-resolution PLA-based structures by hybrid electrohydrodynamic and fused deposition modeling techniques

    Science.gov (United States)

    Zhang, Bin; Seong, Baekhoon; Nguyen, VuDat; Byun, Doyoung

    2016-02-01

    Recently, the three-dimensional (3D) printing technique has received much attention for shape forming and manufacturing. The fused deposition modeling (FDM) printer is one of the various 3D printers available and has become widely used due to its simplicity, low-cost, and easy operation. However, the FDM technique has a limitation whereby its patterning resolution is too low at around 200 μm. In this paper, we first present a hybrid mechanism of electrohydrodynamic jet printing with the FDM technique, which we name E-FDM. We then develop a novel high-resolution 3D printer based on the E-FDM process. To determine the optimal condition for structuring, we also investigated the effect of several printing parameters, such as temperature, applied voltage, working height, printing speed, flow-rate, and acceleration on the patterning results. This method was capable of fabricating both high resolution 2D and 3D structures with the use of polylactic acid (PLA). PLA has been used to fabricate scaffold structures for tissue engineering, which has different hierarchical structure sizes. The fabrication speed was up to 40 mm/s and the pattern resolution could be improved to 10 μm.

  15. Spectrally resolved single-photon imaging with hybrid superconducting - nanophotonic circuits

    CERN Document Server

    Kahl, O; Kovalyuk, V; Vetter, A; Lewes-Malandrakis, G; Nebel, C; Korneev, A; Goltsman, G; Pernice, W

    2016-01-01

    The detection of individual photons is an inherently binary mechanism, revealing either their absence or presence while concealing their spectral information. For multi-color imaging techniques, such as single photon spectroscopy, fluorescence resonance energy transfer microscopy and fluorescence correlation spectroscopy, wavelength discrimination is essential and mandates spectral separation prior to detection. Here, we adopt an approach borrowed from quantum photonic integration to realize a compact and scalable waveguide-integrated single-photon spectrometer capable of parallel detection on multiple wavelength channels, with temporal resolution below 50 ps and dark count rates below 10 Hz. We demonstrate multi-detector devices for telecommunication and visible wavelengths and showcase their performance by imaging silicon vacancy color centers in diamond nanoclusters. The fully integrated hybrid superconducting-nanophotonic circuits enable simultaneous spectroscopy and lifetime mapping for correlative imagi...

  16. Technological and Physical Compatibilities in Hybrid Integration of Laser and Monolithic Integration of Waveguide, Photodetector and CMOS Circuits on Silicon

    NARCIS (Netherlands)

    Zhou, M.J.; Ikkink, T.; Chalmers, J.; Kranenburg, H. van; Albers, H.; Holleman, J.; Lambeck, P.V.; Joppe, J.L.; Bekman, H.H.P.T.; Krijger, A.J.T. de

    1994-01-01

    In this paper, technological and physical compatibilities in hybrid integration of AlInGaP laser and monolithic integration of ZnO monomode waveguide, pin-photodetector, CMOS circuits for laser power control and signal amplification on silicon substrate are studied. Prospective problems and their po

  17. Technological and physical compatibilities in hybrid integration of laser and monolithic integration of waveguide, photodetector and CMOS circuits on silicon

    NARCIS (Netherlands)

    Zhou, Ming-Jiang; Ikkink, Ton; Chalmers, John; Kranenburg, van Herma; Albers, Hans; Holleman, Jisk; Lambeck, Paul; Joppe, Jan Leendert; Bekman, Herman; Krijger, de Ton; Lambeck, P.V.

    1994-01-01

    In this paper, technological and physical compatibilities in hybrid integration of AlInGaP laser and monolithic integration of ZnO monomode waveguide, pin-photodetector, CMOS circuits for laser power control and signal amplification on silicon substrate are studied. Prospective problems and their po

  18. Compact Hybrid Subsystem of 16 Channel Optical Demultiplexer, 2x2 Switches, Optical Power Monitors and Control Circuit

    Institute of Scientific and Technical Information of China (English)

    Kenichiro Takahashi; Toshihiko Kishimoto; Shintaro Mouri; Youichi Hata; Hideaki Yusa; Mitsuaki Tamura; Kazuhito Saito; Hisao Maki

    2003-01-01

    A compact hybrid subsystem of 16channel optical demultiplexer, 2x2 switches, optical power monitors and control circuit board is developed. The subsystem is able to add or drop arbitrary optical channels and monitor the optical power level by software commands. The size of the subsystem is 170x200x30(mm).

  19. A Comparative Performance Study of Hybrid SET-CMOS Based Logic Circuits for the Estimation of Robustness

    Directory of Open Access Journals (Sweden)

    Biswabandhu Jana

    2013-10-01

    Full Text Available The urge of inventing a new low power consuming device for the post CMOS future technology has drawn the attention of the researchers on Single Electron Transistor [SET]. The two main virtues, ultra low power consumption [1] and ultra small dimension of SET [12, 13] have stimulated the researchers to consider it as a possible alternative. In our past paper [1] we have designed and simulated some basic gates. In this paper we have designed and simulated hybrid SET-CMOS based counter circuits, shift register to show that the hybrid SET-MOS based circuits consumes the lesser power than MOS based circuits. All the simulation were done and verified in Tanner environment using the MIB model for SET and the BSIM4.6.1 model for MOSFET.

  20. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2015-03-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  1. Whole body perfusion for hybrid aortic arch repair: evolution of selective regional perfusion with a modified extracorporeal circuit.

    Science.gov (United States)

    Fernandes, Philip; Walsh, Graham; Walsh, Stephanie; O'Neil, Michael; Gelinas, Jill; Chu, Michael W A

    2017-04-01

    Patients undergoing hybrid aortic arch reconstruction require careful protection of vital organs. We believe that whole body perfusion with tailored dual circuitry may help to achieve optimal patient outcomes. Our circuit has evolved from a secondary circuit utilizing a cardioplegia delivery device for lower body perfusion to a dual-oxygenator circuit. This allows individually controlled regional perfusion with ease of switching from secondary to primary circuit for total body flow. The re-design allows for separate flow and temperature regulation with two oxygenators in parallel. All patients underwent a single-stage operation for simultaneous treatment of arch and descending aortic pathology via a sternotomy, using a hybrid frozen elephant trunk technique. We report six consecutive patients undergoing hybrid arch and frozen elephant trunk reconstruction using a dual-oxygenator circuit. Five patients underwent elective surgery and one was emergent. One patient had an acute dissection while three underwent concomitant procedures, including a Ross procedure and two valve-sparing root reconstructions. Three cases were redo sternotomies. The mean pump time was 358 ± 131 min, the aortic cross clamp time 243 ± 135 min, the cardioplegia volume of 33,208 ml ± 16,173, cerebral ischemia 0 min, lower body ischemia 76 ± 34 min and the average lower body perfusion time was 142 min. Two patients did not require any donor blood products. The median intensive care unit (ICU) and hospital lengths of stay (LOS) were two days and 10 days, respectively. The average peak serum lactate on CPB was 7.47 mmol/L and, at admission to the ICU, it was 3.37 mmol/L. Renal and respiratory failure developed in the salvage acute type A dissection patient. No other complications occurred in this series. Whole body perfusion as delivered through individually controlled dual-oxygenator circuitry allows maximum flexibility for hybrid aortic arch reconstruction. A modified circuit perfusion

  2. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  3. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  4. Thermal hydraulic performance testing of printed circuit heat exchangers in a high-temperature helium test facility

    Energy Technology Data Exchange (ETDEWEB)

    Sai K. Mylavarapu; Xiaodong Sun; Richard E. Glosup; Richard N. Christensen; Michael W. Patterson

    2014-04-01

    In high-temperature gas-cooled reactors, such as a very high temperature reactor (VHTR), an intermediate heat exchanger (IHX) is required to efficiently transfer the core thermal output to a secondary fluid for electricity generation with an indirect power cycle and/or process heat applications. Currently, there is no proven high-temperature (750–800 °C or higher) compact heat exchanger technology for high-temperature reactor design concepts. In this study, printed circuit heat exchanger (PCHE), a potential IHX concept for high-temperature applications, has been investigated for their heat transfer and pressure drop characteristics under high operating temperatures and pressures. Two PCHEs, each having 10 hot and 10 cold plates with 12 channels (semicircular cross-section) in each plate are fabricated using Alloy 617 plates and tested for their performance in a high-temperature helium test facility (HTHF). The PCHE inlet temperature and pressure were varied from 85 to 390 °C/1.0–2.7 MPa for the cold side and 208–790 °C/1.0–2.7 MPa for the hot side, respectively, while the mass flow rate of helium was varied from 15 to 49 kg/h. This range of mass flow rates corresponds to PCHE channel Reynolds numbers of 950 to 4100 for the cold side and 900 to 3900 for the hot side (corresponding to the laminar and laminar-to-turbulent transition flow regimes). The obtained experimental data have been analyzed for the pressure drop and heat transfer characteristics of the heat transfer surface of the PCHEs and compared with the available models and correlations in the literature. In addition, a numerical treatment of hydrodynamically developing and hydrodynamically fully-developed laminar flow through a semicircular duct is presented. Relations developed for determining the hydrodynamic entrance length in a semicircular duct and the friction factor (or pressure drop) in the hydrodynamic entry length region for laminar flow through a semicircular duct are given. Various

  5. Application of Cu-polyimide flex circuit and Al-on-glass pitch adapter for the ATLAS SCT barrel hybrid

    CERN Document Server

    Unno, Y; Ikegami, Y; Iwata, Y; Kohriki, T; Kondo, T; Nakano, I; Ohsugi, T; Takashima, R; Tanaka, R; Terada, S; Ujiie, N

    2005-01-01

    We applied the surface build-up Cu-polyimide flex-circuit technology with laser vias to the ATLAS SCT barrel hybrid to be made in one piece from the connector to the electronics sections including cables. The hybrids, reinforced with carbon-carbon substrates, provide mechanical strength, thermal conductivity, low-radiation length, and stability in application-specific integrated circuit (ASIC) operation. By following the design rules, we experienced little trouble in breaking the traces. The pitch adapter between the sensor and the ASICs was made of aluminum traces on glass substrate. We identified that the generation of whiskers around the wire-bonding feet was correlated with the hardness of metallized aluminum. The appropriate hardness has been achieved by keeping the temperature of the glasses as low as room temperature during the metallization. The argon plasma cleaning procedure cleaned the contamination on the gold pads of the hybrids for successful wire bonding, although it was unsuccessful in the alu...

  6. Note: Design and construction of a simple and reliable printed circuit board-substrate Bradbury-Nielsen gate for ion mobility spectrometry

    Science.gov (United States)

    Du, Yongzhai; Cang, Huaiwen; Wang, Weiguo; Han, Fenglei; Chen, Chuang; Li, Lin; Hou, Keyong; Li, Haiyang

    2011-08-01

    A less laborious, structure-simple, and performance-reliable printed circuit board (PCB) based Bradbury-Nielsen gate for high-resolution ion mobility spectrometry was introduced and investigated. The gate substrate was manufactured using a PCB etching process with small holes (Φ 0.1 mm) drilled along the gold-plated copper lines. Two interdigitated sets of rigid stainless steel spring wire (Φ 0.1 mm) that stands high temperature and guarantees performance stability were threaded through the holes. Our homebuilt ion mobility spectrometer mounted with the gate gave results of about 40 for resolution while keeping a signal intensity of over 0.5 nano-amperes.

  7. Note: Design and construction of a simple and reliable printed circuit board-substrate Bradbury-Nielsen gate for ion mobility spectrometry.

    Science.gov (United States)

    Du, Yongzhai; Cang, Huaiwen; Wang, Weiguo; Han, Fenglei; Chen, Chuang; Li, Lin; Hou, Keyong; Li, Haiyang

    2011-08-01

    A less laborious, structure-simple, and performance-reliable printed circuit board (PCB) based Bradbury-Nielsen gate for high-resolution ion mobility spectrometry was introduced and investigated. The gate substrate was manufactured using a PCB etching process with small holes (Φ 0.1 mm) drilled along the gold-plated copper lines. Two interdigitated sets of rigid stainless steel spring wire (Φ 0.1 mm) that stands high temperature and guarantees performance stability were threaded through the holes. Our homebuilt ion mobility spectrometer mounted with the gate gave results of about 40 for resolution while keeping a signal intensity of over 0.5 nano-amperes.

  8. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  9. Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte Processing of printed circuit boards of small electrical and electronic devices

    Directory of Open Access Journals (Sweden)

    Sérgio de Souza Henrique Júnior

    2013-01-01

    Full Text Available A hydrometallurgical process applicable to printed circuit boards of small electrical and electronic devices was developed. This involved three leaching steps (60 ºC, 2 h: 6 mol L-1 NaOH, 6 mol L-1 HCl and aqua regia. NaOH removed the resin and flame retardant that covered the circuit boards. HCl dissolved the most electropositive metals and a small amount of copper (~0.3 wt%. Aqua regia dissolved the noble metals. Silver precipitated as AgCl. Gold and platinum were quantitatively extracted with pure methyl-isobutylketone and Alamine 336 (10 % vol. in kerosene, respectively. Slow evaporation of the raffinate crystallized CuCl2.4H2O (89% yield.

  10. A comparison of different silver inks for printing of conductive tracks on paper substrates for rapid prototyping of electronic circuits

    CSIR Research Space (South Africa)

    Bezuidenhout, PH

    2015-11-01

    Full Text Available of the selection process of different conductive inks for printing onto paper substrates. These results can be utilized in the development process for fully printable rapidly prototyped electronic systems, which can range from environmental sensing solutions...

  11. Hybrid winding concept for toroids

    DEFF Research Database (Denmark)

    Schneider, Henrik; Andersen, Thomas; Knott, Arnold;

    2013-01-01

    This paper proposes a hybrid winding concept for toroids using the traces in a printed circuit board to make connection to bended copper foil cutouts. In a final product a number of strips with a certain thickness would be held by a former and the whole assembly could be placed by pick and placem...

  12. Application of Inkjet Printing in High-Density Pixelated RGB Quantum Dot-Hybrid LEDs

    KAUST Repository

    Haverinen, Hanna

    2012-05-23

    Recently, an intriguing solution to obtain better color purity has been to introduce inorganic emissive quantum dots (QDs) into an otherwise OLED structure. The emphasis of this chapter is to present a simple discussion of the first attempts to fabricate high-density, pixelated (quarter video graphics array (QVGA) format), monochromatic and RGB quantum dots light-emitting diodes (QDLEDs), where inkjet printing is used to deposit the light-emitting layer of QDs. It shows some of the factors that have to be considered in order to achieve the desired accuracy and printing quality. The successful operation of the RGB printed devices indicates the potential of the inkjet printing approach in the fabrication of full-color QDLEDs for display application. However, further optimization of print quality is still needed in order to eliminate the formation of pinholes, thus maximizing energy transfer from organic layers to the QDs and in turn increasing the performance of the devices. Controlled Vocabulary Terms: ink jet printing; LED displays; LED lamps; organic light emitting diodes; quantum dots

  13. 谈PCB企业中央研究院的战略定位%The strategic positioning of printed circuit board enterprise center institute

    Institute of Scientific and Technical Information of China (English)

    黄勇; 朱兴华; 陈正清; 吴会兰

    2012-01-01

    This article focuses on the strategic positioning of printed circuit board enterprise center institute, By constructing a entities department of printed circuit board enterprise institute to create the basis platform of the technological innovation system, from the strategic height to make its overall planning, enhance the innovation capability and core competitiveness, eventually become the center of technological and product innovation, the center of innovation management and resource integration, the Center of industrial planning and the center of talent aggregation. The four centers are interdependent with each other.%主要讲述了电路板企业中央研究院的战略定位,通过组建中央研究院实体部门,建立企业创新研究体系的基础平台,从战略高度对其进行整体规划,增强中央研究院的创新能力和核心竞争力,最终成为企业的产品技术研发中心、创新管理及资源整合中心、发展规划中心和人才聚合中心。四大中心职能相互依赖,相互配合。

  14. 废旧线路板中塑料的回收及利用%Recycling and Reusing of Plastic in Waste Printed Circuit Board

    Institute of Scientific and Technical Information of China (English)

    李启胜

    2012-01-01

    总结了废旧线路板中塑料的回收处置方法和废旧线路板中塑料的回收利用现状.重点介绍了废旧线路板中塑料的物理回收法、热解回收法和溶液回收法,在综合比较废旧线路板中塑料回收利用的各种方法的基础上展望了废旧线路板中塑料回收利用的发展趋势.%The recycling technology and comprehensive application-situation of plastic in waste printed circuit board were summarized, and the physical recovery method, pyrolysis recovery method and solution recovery method were mainly introduced. On the basis of comprehensive comparing of the recycling methods, the recyling trends of plastic in waste printed circuit board was prospected.

  15. Mixed potential integral equation technique for hybrid microstrip-slotline multilayered circuits using a mixed rectangular-triangular mesh

    Science.gov (United States)

    Sercu, Jeannick; Fache, Niels; Libbrecht, Frank; Lagasse, Paul

    1995-05-01

    In this paper, a mixed potential integral equation (MPIE) formulation for hybrid microstrip-slotline multilayered circuits is presented. This integral equation is solved with the method of moments (MoM) in combination with Galerkin's method. The vector-valued rooftop functions defined over a mixed rectangular-triangular mesh are used to model the electric and magnetic currents on the microstrip and slotline structures. An efficient calculation technique for the quadruple interaction integrals between two cells in the system matrix equation is presented. Two examples of hybrid microstrip-slotline circuits are discussed. The first example compares the simulation results for a microstrip-slotline transition with measured data. The second example illustrates the use of the simulation technique in the design process of a broadband slot-coupled microstrip line transition.

  16. Modeling and Experimental Demonstration of a Hopfield Network Analog-to-Digital Converter with Hybrid CMOS/Memristor Circuits.

    Science.gov (United States)

    Guo, Xinjie; Merrikh-Bayat, Farnood; Gao, Ligang; Hoskins, Brian D; Alibart, Fabien; Linares-Barranco, Bernabe; Theogarajan, Luke; Teuscher, Christof; Strukov, Dmitri B

    2015-01-01

    The purpose of this work was to demonstrate the feasibility of building recurrent artificial neural networks with hybrid complementary metal oxide semiconductor (CMOS)/memristor circuits. To do so, we modeled a Hopfield network implementing an analog-to-digital converter (ADC) with up to 8 bits of precision. Major shortcomings affecting the ADC's precision, such as the non-ideal behavior of CMOS circuitry and the specific limitations of memristors, were investigated and an effective solution was proposed, capitalizing on the in-field programmability of memristors. The theoretical work was validated experimentally by demonstrating the successful operation of a 4-bit ADC circuit implemented with discrete Pt/TiO2- x /Pt memristors and CMOS integrated circuit components.

  17. Enhanced bone tissue regeneration using a 3D printed microstructure incorporated with a hybrid nano hydrogel.

    Science.gov (United States)

    Heo, Dong Nyoung; Castro, Nathan J; Lee, Se-Jun; Noh, Hanaul; Zhu, Wei; Zhang, Lijie Grace

    2017-04-20

    Three-dimensional (3D) functional constructs with biomimetic mechanical and chemical properties are ideal for various regenerative medicine applications. These properties of 3D fabricated constructs mainly depend on the intrinsic characteristics of the materials and fabrication method. In this respect, the current use of hydrogels for musculoskeletal tissue repair is not ideal due to the lack of suitable mechanical properties, as well as the high biomimetic requirement for success. To overcome this limitation, we developed a novel functionalized hydrogel with bioactive gold nanoparticles (GNPs), reinforcing a 3D printed microstructure via fused deposition modeling (FDM) for bone tissue regeneration. We used biodegradable thermoplastic polylactic acid (PLA) as the 3D printed microstructure in combination with photo-curable gelatin hydrogels as the encapsulation matrix for the incorporation of cyclic RGD conjugated GNPs (RGNP), and investigated their mechanical properties. In addition, human adipose-derived stem cells (ADSCs) were encapsulated within the gelatin hydrogel and examined for viability, morphology, and osteogenic differentiation in vitro. The results showed that the stiffness of the composite hydrogel on reinforcing a 3D printed microstructure can be readily modulated to simulate the stiffness of the human mandibular condyle. ADSCs encapsulated in the composite structures remained viable within the hydrogel and showed excellent spreading on the 3D printed PLA microstructure. More importantly, osteogenic differentiation with incorporated RGNPs promoted significantly higher gene expression of osteogenic specific factors. Therefore, reinforced composite hydrogels are suitable for stem cell differentiation control and bone tissue regeneration.

  18. Analyzing Biological Performance of 3D-Printed, Cell-Impregnated Hybrid Constructs for Cartilage Tissue Engineering.

    Science.gov (United States)

    Izadifar, Zohreh; Chang, Tuanjie; Kulyk, William; Chen, Xiongbiao; Eames, B Frank

    2016-03-01

    Three-dimensional (3D) bioprinting of hybrid constructs is a promising biofabrication method for cartilage tissue engineering because a synthetic polymer framework and cell-impregnated hydrogel provide structural and biological features of cartilage, respectively. During bioprinting, impregnated cells may be subjected to high temperatures (caused by the adjacent melted polymer) and process-induced mechanical forces, potentially compromising cell function. This study addresses these biofabrication issues, evaluating the heat distribution of printed polycaprolactone (PCL) strands and the rheological property and structural stability of alginate hydrogels at various temperatures and concentrations. The biocompatibility of parameters from these studies was tested by culturing 3D hybrid constructs bioprinted with primary cells from embryonic chick cartilage. During initial two-dimensional culture expansion of these primary cells, two morphologically and molecularly distinct cell populations ("rounded" and "fibroblastic") were isolated. The biological performance of each population was evaluated in 3D hybrid constructs separately. The cell viability, proliferation, and cartilage differentiation were observed at high levels in hybrid constructs of both cell populations, confirming the validity of these 3D bioprinting parameters for effective cartilage tissue engineering. Statistically significant performance variations were observed, however, between the rounded and fibroblastic cell populations. Molecular and morphological data support the notion that such performance differences may be attributed to the relative differentiation state of rounded versus fibroblastic cells (i.e., differentiated chondrocytes vs. chondroprogenitors, respectively), which is a relevant issue for cell-based tissue engineering strategies. Taken together, our study demonstrates that bioprinting 3D hybrid constructs of PCL and cell-impregnated alginate hydrogel is a promising approach for

  19. Hybrid Ag-based inks for nanocomposite inkjet printed lines: RF properties

    Energy Technology Data Exchange (ETDEWEB)

    Chiolerio, Alessandro [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Camarchia, Vittorio, E-mail: vittorio.camarchia@polito.it [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Electronics and Telecommunications Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy); Quaglia, Roberto; Pirola, Marco [Electronics and Telecommunications Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy); Pandolfi, Paolo [Politronica Inkjet Printing S.r.l., C/O i3p, Corso Castelfidardo 30/A, 10129 Torino (Italy); Pirri, Candido Fabrizio [Center for Space Human Robotics, Istituto Italiano di Tecnologia, Corso Trento 21, 10129 Torino (Italy); Applied Science and Technology Department, Politecnico di Torino Corso Duca degli Abruzzi 24, 10129 Torino (Italy)

    2014-12-05

    Highlights: • Polymer–silver nanocomposite conductive ink for RF fast prototyping. • Reduction of the sintering temperature. • Improved printing resolution. • State-of-the-art electrical conductivity. • Good RF performances. - Abstract: The development of highly conductive Ag nanoparticle (NP)-based inkjet printed (IP) connections is a fundamental process for the success of next-generation digitally printed electronics. This is true both at low frequency and at RF, considering the increasing integration of heterogeneous technologies and the use of flexible substrates. Ink-based technologies provide and form at liquid state the functional material that is then delivered to solid via a sintering process to achieve NP coalescence and electrical percolation. Sintering must be performed at very low temperatures (depending on the substrate choice) to be compatible with previous process steps, to preserve the geometry and fulfill the requirements in term of electrical conductivity, as well as to reduce production costs. While IP, as additive technology, is now well settled for DC or low frequency applications, few results on electrical characterization at RF or microwave frequencies are present due to low conductivity, poor geometry definition and low reproducibility. Hence, a good setup of ink formulation and technological realization is fundamental to enable system performance assessment in the high frequency regime. In this paper we propose a breakthrough: we present a nanocomposite ink, whose thermal and DC electrical properties are extremely interesting and competitive with pure-metallic ink systems. Introducing a copolymer in the formulation, we obtained a reduction of the overall sintering temperature, if compared to the pristine NP suspension, along with improved printing resolution together with very good electrical conductivity. The RF characterization has been performed in the range 1–6 GHz on geometries printed on sintered alumina and on a power

  20. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2014-09-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  1. 18k Channels single photon counting readout circuit for hybrid pixel detector

    Science.gov (United States)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e- and the equivalent noise charge is 168 e- rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  2. 18k Channels single photon counting readout circuit for hybrid pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Maj, P., E-mail: piotr.maj@agh.edu.pl [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Grybos, P.; Szczygiel, R.; Zoladz, M. [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Sakumura, T.; Tsuji, Y. [X-ray Analysis Division, Rigaku Corporation, Matsubara, Akishima, Tokyo 196-8666 (Japan)

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm Multiplication-Sign 20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96 Multiplication-Sign 192 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 {mu}W/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 {mu}V/e{sup -} and the equivalent noise charge is 168 e{sup -} rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  3. The Design of Drive Circuit with High-power Output for Two-phase Hybrid Stepping Motor Based on BY-5064

    Institute of Scientific and Technical Information of China (English)

    MA Xiao-jiao; LI Cheng-gui; CAI Zheng; ZHAO Li-guo

    2011-01-01

    A kind of drive circuit which high-power output for stepping motor, based two-phase hybrid stepping motor are designed, achieved. is low power consumption, high-performance and on BY-5064, and a kind of dedicated circuit for drive control for stepping motor with high-power is

  4. Hybrid fibre lighting - directed towards a smaller ecological foot print; Hybrid fiber belysning - rettet mod et mindre oekologisk fodaftryk

    Energy Technology Data Exchange (ETDEWEB)

    Bjarklev, A.; Scolari, L. (DTU Fotonik, Kgs. Lyngby (Denmark)); Bjarklev, A.; Kjaer, T.; Andersen, Jan (RUC-ENSPAC, Roskilde (Denmark)); Trolle, H.; Laursen, K.; Riisberg, V. (Designskolen Kolding, Kolding (Denmark)); Ibsen, P. (IBSEN El-anlaeg ApS, Roskilde (Denmark))

    2010-09-15

    Building on one of the world-leading technologies in fiber optics this project uncovers, whether it is realistic under Danish conditions to exploit opportunities within hybrid fiber illumination - i.e. systems that directly moves the sun indoors via fiber optics. Hybrid lighting is a combination of four technologies: the collection of sunlight (daylight), generation of artificial light, assembly, transportation and distribution of light where needed, and operational control of both natural and artificial light. Some of the significant findings from this project are a design of a hybrid system based on a solar optical system and LED technology, and design and development of fixtures that could combine both daylight and artificial light. The analysis showed that a system based on only LEDs could save 36% energy compared with a system based on the T5 (fluorescent lamps), which today is considered the best available technology. The analysis further indicates an energy saving of 59% when you combine a solar optical system with LED technology in a hybrid system. It is found that there is great potential for further design and applications which can be based for a hybrid lighting combined with the two technologies mentioned above (optical fibers and LEDs). It was also found that hybrid lighting systems are in a very early stage of the innovation life cycle and that one of the most important barriers for successful implementation is the considerably high price. However, this is a typical problem that arises with new technologies and, therefore, further development followed by pilot test projects could bring this technology fast to a more competitive phase, even if one as the basis selects systems based on the T5 technology. There is widespread acceptance of the hybrid system by office users in many areas where it is not possible to have windows, but to make the system work in other sectors, it is necessary to continue research in design that can provide a greater light

  5. Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-01

    The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  6. Synthesis of pure colloidal silver nanoparticles with high electroconductivity for printed electronic circuits: the effect of amines on their formation in aqueous media.

    Science.gov (United States)

    Natsuki, Jun; Abe, Takao

    2011-07-01

    This paper describes a practical and convenient method to prepare stable colloidal silver nanoparticles for use in printed electronic circuits. The method uses a dispersant and two kinds of reducing agents including 2-(dimethylamino) ethanol (DMAE), which play important roles in the reduction of silver ions in an aqueous medium. The effect of DMAE and dispersant, as well as the factors affecting particle size and morphology are investigated. In the formation of the silver nanoparticles, reduction occurs rapidly at room temperature and the silver particles can be separated easily from the mixture in a short time. In addition, organic solvents are not used. Pure, small and relatively uniform particles with a diameter less than 10 nm can be obtained that exhibit high electroconductivity. The silver nanoparticles are stable, and can be isolated as a dried powder that can be fully redispersed in deionized water. This method of producing colloidal silver nanoparticles will find practical use in electronics applications.

  7. Research on Ultrafine Tungsten Carbide-Cobalt (WC-Co) Cemented Carbide Rods of Miniature Drills for Highly Integrated Printed Circuit Board (PCB)

    Institute of Scientific and Technical Information of China (English)

    Xiaoliang SHI; Gangqin SHAO; Xinglong DUAN; Runzhang YUAN

    2005-01-01

    Nanocrystalline tungsten carbide-cobalt (WC-Co) composite powders produced through spray thermal decomposition-continuous reduction and carburization technology were used to prepare φ3.25 mm ×38 mm ultrafine tungsten carbidecobalt (WC-Co) cemented carbide rods through vacuum sintering plus sinterhip technology. The microstructure,Vickers hardness, density and Rockwell A hardness (HRA), transverse rupture strength (TRS), saturated magnetization and coercivity force were tested. The results show that the average grain size of the sintering body prepared through vacuum sintering plus sinterhip technology was 430 nm; transverse rupture strength (TRS) was 3850 MPa;Vickers hardness was 1890 and Rockwell A hardness of sintering body was 93. High strength and high hardness ultrafine WC-Co cemented carbide rods used to manufacture printed circuit board (PCB) drills were obtained.

  8. Computer simulation of the pneumatic separator in the pneumatic-electrostatic separation system for recycling waste printed circuit boards with electronic components.

    Science.gov (United States)

    Xue, Mianqiang; Xu, Zhenming

    2013-05-07

    Technologies could be integrated in different ways into automatic recycling lines for a certain kind of electronic waste according to practical requirements. In this study, a new kind of pneumatic separator with openings at the dust hooper was applied combing with electrostatic separation for recycling waste printed circuit boards. However, the flow pattern and the particles' movement behavior could not be obtained by experimental methods. To better control the separation quantity and the material size distribution, computational fluid dynamics was used to model the new pneumatic separator giving a detailed understanding of the mechanisms. Simulated results showed that the tangential velocity direction reversed with a relatively small value. Axial velocity exhibited two sharp decreases at the x axis. It is indicated that the bottom openings at the dust hopper resulted in an enormous change in the velocity profile. A new phenomenon that was named dusting was observed, which would mitigate the effect of particles with small diameter on the following electrostatic separation and avoid materials plugging caused by the waste printed circuit boards special properties effectively. The trapped materials were divided into seven grades. Experimental results showed that the mass fraction of grade 5, grade 6, and grade 7 materials were 27.54%, 15.23%, and 17.38%, respectively. Grade 1 particles' mass fraction was reduced by 80.30% compared with a traditional separator. Furthermore, the monocrystalline silicon content in silicon element in particles with a diameter of -0.091 mm was 18.9%, higher than that in the mixed materials. This study could serve as guidance for the future material flow control, automation control, waste recycling, and semiconductor storage medium destruction.

  9. 印制电路板的防抄板技术及实现方法%Anti-copy board technology and implementation of printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    张松; 张亚

    2015-01-01

    嵌入式系统的快速发展要求设计者必须将印制电路板做到高精度、高密度和高可靠性,这对设计者是一个很大的挑战。与此同时,黑客技术的迅速发展与芯片解剖技术的逐渐成熟,使得嵌入式系统所面临的各种攻击也越来越多,随之而生的印制电路板抄板技术也很快的引起了广大电路板设计者的重视。文章提出的印制电路板硬件的防抄板措施以及其核心芯片加密的实现方法,可以非常有效的应对各类抄板问题。%The rapid development of embedded systems requires the designer must be printed circuit board to do high precision, high density and high reliability,this is a big chall-enge to designers.At the same time,the development of hacking and anatomy of the chip technology,allows embedded systems are facing more and more attacks.With raw copy board technology has also caused the attention of the product designers.The artic-le puts forward the prevent printed circuit board hardware copy plate measures and the realization method of the core chip encryption,can be very effective to deal with all kinds of copy board problem.

  10. Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit.

    Science.gov (United States)

    Guan, Binbin; Scott, Ryan P; Qin, Chuan; Fontaine, Nicolas K; Su, Tiehui; Ferrari, Carlo; Cappuzzo, Mark; Klemens, Fred; Keller, Bob; Earnshaw, Mark; Yoo, S J B

    2014-01-13

    We demonstrate free-space space-division-multiplexing (SDM) with 15 orbital angular momentum (OAM) states using a three-dimensional (3D) photonic integrated circuit (PIC). The hybrid device consists of a silica planar lightwave circuit (PLC) coupled to a 3D waveguide circuit to multiplex/demultiplex OAM states. The low excess loss hybrid device is used in individual and two simultaneous OAM states multiplexing and demultiplexing link experiments with a 20 Gb/s, 1.67 b/s/Hz quadrature phase shift keyed (QPSK) signal, which shows error-free performance for 379,960 tested bits for all OAM states.

  11. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

    Directory of Open Access Journals (Sweden)

    Pan Yi

    2017-02-01

    Full Text Available The electrochemical migration (ECM behavior of copper-clad laminate (PCB-Cu and electroless nickel/immersion gold printed circuit boards (PCB-ENIG under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed.

  12. A K-Band RF-MEMS-Enabled Reconfigurable and Multifunctional Low-Noise Amplifier Hybrid Circuit

    Directory of Open Access Journals (Sweden)

    R. Malmqvist

    2011-01-01

    Full Text Available A K-band (18–26.5 GHz RF-MEMS-enabled reconfigurable and multifunctional dual-path LNA hybrid circuit (optimised for lowest/highest possible noise figure/linearity, resp. is presented, together with its subcircuit parts. The two MEMS-switched low-NF (higher gain and high-linearity (lower gain LNA circuits (paths present 16.0 dB/8.2 dB, 2.8 dB/4.9 dB and 15 dBm/20 dBm of small-signal gain, noise figure, and 1 dB compression point at 24 GHz, respectively. Compared with the two (fixed LNA subcircuits used within this design, the MEMS-switched LNA circuit functions show minimum 0.6–1.3 dB higher NF together with similar values of P1 dB at 18–25 GHz. The gain of one LNA circuit path is reduced by 25–30 dB when the MEMS switch and active circuitry used within in the same switching branch are switched off to select the other LNA path and minimise power consumption.

  13. Low Insertion HVDC Circuit Breaker: Magnetically Pulsed Hybrid Breaker for HVDC Power Distribution Protection

    Energy Technology Data Exchange (ETDEWEB)

    None

    2012-01-09

    GENI Project: General Atomics is developing a direct current (DC) circuit breaker that could protect the grid from faults 100 times faster than its alternating current (AC) counterparts. Circuit breakers are critical elements in any electrical system. At the grid level, their main function is to isolate parts of the grid where a fault has occurred—such as a downed power line or a transformer explosion—from the rest of the system. DC circuit breakers must interrupt the system during a fault much faster than AC circuit breakers to prevent possible damage to cables, converters and other grid-level components. General Atomics’ high-voltage DC circuit breaker would react in less than 1/1,000th of a second to interrupt current during a fault, preventing potential hazards to people and equipment.

  14. An adaptive metamaterial beam with hybrid shunting circuits for extremely broadband control of flexural wave (Conference Presentation)

    Science.gov (United States)

    Chen, Yangyang; Huang, Guoliang

    2017-04-01

    A great deal of research has been devoted to controlling the dynamic behaviors of phononic crystals and metamaterials by directly tuning the frequency regions and/or widths of their inherent band gaps. Here, we present a novel approach to achieve extremely broadband flexural wave/vibration attenuation based on tunable local resonators made of piezoelectric stacks shunted by hybrid negative capacitance and negative inductance circuits with proof masses attached on a host beam. First, wave dispersion relations of the adaptive metamaterial beam are calculated analytically by using the transfer matrix method. The unique modulus tuning properties induced by the hybrid shunting circuits are then characterized conceptually, from which the frequency dependent modulus tuning curves of the piezoelectric stack located within wave attenuation frequency regions are quantitatively identified. As an example, a flexural wave high-pass band filter with a wave attenuation region from 0 to 23.0 kHz is demonstrated analytically and numerically by using the hybrid shunting circuit, in which the two electric components are connected in series. By changing the connection pattern to be parallel, another super wide wave attenuation region from 13.5 to 73.0 kHz is demonstrated to function as a low-pass filter at a subwavelength scale. The proposed adaptive metamaterial possesses a super wide band gap created both naturally and artificially. Therefore, it can be used for the transient wave mitigation at extremely broadband frequencies such as blast or impact loadings. We envision that the proposed design and approach can open many possibilities in broadband vibration and wave control.

  15. Solvent-Assisted Gel Printing for Micropatterning Thin Organic-Inorganic Hybrid Perovskite Films.

    Science.gov (United States)

    Jeong, Beomjin; Hwang, Ihn; Cho, Sung Hwan; Kim, Eui Hyuk; Cha, Soonyoung; Lee, Jinseong; Kang, Han Sol; Cho, Suk Man; Choi, Hyunyong; Park, Cheolmin

    2016-09-27

    While tremendous efforts have been made for developing thin perovskite films suitable for a variety of potential photoelectric applications such as solar cells, field-effect transistors, and photodetectors, only a few works focus on the micropatterning of a perovskite film which is one of the most critical issues for large area and uniform microarrays of perovskite-based devices. Here we demonstrate a simple but robust method of micropatterning a thin perovskite film with controlled crystalline structure which guarantees to preserve its intrinsic photoelectric properties. A variety of micropatterns of a perovskite film are fabricated by either microimprinting or transfer-printing a thin spin-coated precursor film in soft-gel state with a topographically prepatterned elastomeric poly(dimethylsiloxane) (PDMS) mold, followed by thermal treatment for complete conversion of the precursor film to a perovskite one. The key materials development of our solvent-assisted gel printing is to prepare a thin precursor film with a high-boiling temperature solvent, dimethyl sulfoxide. The residual solvent in the precursor gel film makes the film moldable upon microprinting with a patterned PDMS mold, leading to various perovskite micropatterns in resolution of a few micrometers over a large area. Our nondestructive micropatterning process does not harm the intrinsic photoelectric properties of a perovskite film, which allows for realizing arrays of parallel-type photodetectors containing micropatterns of a perovskite film with reliable photoconduction performance. The facile transfer of a micropatterned soft-gel precursor film on other substrates including mechanically flexible plastics can further broaden its applications to flexible photoelectric systems.

  16. Development of distribution and subtransmission SF/sub 6/ circuit breaker and hybrid transmission interrupter. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Votta, G.A.

    1978-06-01

    This project covered the development of a new generation of SF/sub 6/ arc spinner interrupters, a 15-kV circuit breaker (distribution) using this interrupter, and investigated the feasibility of a high voltage (transmission) hybrid interrupter using the arc-spinner and a vacuum interrupter in series. The arc spinner interrupter concept uses a self-generated magnetic field to drive an arc, on a circular path in an atmosphere of SF/sub 6/ gas, to achieve interruption. Test models of the arc spinner interrupter were built and tested to determine the component requirements and arrangements necessary for the desired performance. A single-phase laboratory model of this interrupter was successfully tested up through 25 kA at 13.5 kV. Interruption of 40 kA at 13.5 kV was demonstrated; however, satisfactory performance was not obtained at significant current levels during this program when tested at higher voltages. A full-scale model of a three-phase outdoor distribution power circuit breaker rated 18 kA at 15.5 kV was built and successfully tested to standards. The hybrid interrupter concept (transmission) uses an arc spinner and a vacuum interrupter in series. The vacuum interrupter handles the high initial rate of rise of recovery voltage associated with short line faults, and the arc spinner interrupter handles the high peak transient recovery voltage. The hybrid interrupter demonstrated an ability to handle the initial high rate of rise recovery voltage but encountered dielectric failures at relatively low current levels. This feasibility investigation was limited by the unavailability of a suitable rating of vacuum interrupters and by limitations inherent to an early model arc spinner interrupter for the tests. The investigation of the hybrid was discontinued until further development of a higher voltage arc spinner interrupter could be accomplished.

  17. Method for producing a hybridization of detector array and integrated circuit for readout

    Science.gov (United States)

    Fossum, Eric R.; Grunthaner, Frank J.

    1993-08-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  18. A Brief Discussion of the Research Situation of Disassembly Technology of Waste Printed Circuit Boards%浅谈印刷电路板拆解技术的研究现状

    Institute of Scientific and Technical Information of China (English)

    张晓娇; 李挺

    2015-01-01

    There exist lots of methods for the processing of printed circuit boards .Currently ,the recovery pro‐cessing of printed circuit boards is divided into three stages ,including disassembly and break ,material's gath‐ering and separation ,and product purification .The efficiency of resource utilization of the waste printed cir‐cuit boards is quite low .T herefore ,adopting the concept of circular economy and recycling recovery process‐ing is one of the ways to deal with printed circuit boards reasonably .In order to recycle the components on printed circuit boards ,it is necessary to disassemble components from PCB in good condition .Through the understanding of current processing technology of PCB ,this article puts forward a new processing direction of PCB ,w hich is of high efficiency and resource utilization rate .%指出了废弃印刷电路板的回收处理大体分为拆卸和破碎、物质富集分离、产品精制三个阶段,为了能够回收印刷电路板上的元器件,有必要对线路板上的元器件进行无损拆解。对国内外现有印刷电路板的处理处置技术进行了分析,提出了一种新的、高效、高资源利用率的线路板处理处置方向。

  19. CHARACTERISTICS OF DROPLET TRANSFER IN CO2 LASER-MIG HYBRID WELDING WITH SHORT-CIRCUITING MODE

    Institute of Scientific and Technical Information of China (English)

    LEI Zhenglong; CHEN Yanbin; LI Liqun; WU Lin

    2006-01-01

    LF6 aluminum alloy plates with 4.5 mm thickness are welded in this experiment. Welding is carried out by using the CO2 laser-MIG paraxial hybrid welding in flat position. The experimental results indicate that the inherent droplet transfer cycle time of conventional MIG arc is changed due to the interaction between CO2 laser beam and MIG arc in the short-circuiting mode of laser-MIG hybrid welding. Because of the preheating action of CO2 laser to electrode and base material, the droplet transfer frequency of MIG arc is increased in the hybrid welding process. When laser power is increased to a certain degree, the droplet transfer frequency is decreased due to the effect of laser-induced keyhole. Furthermore, through analyzing the MIG welding current and arc voltage waveforms and the characteristics of droplet transfer in the hybrid welding process, the effect of laser energy and the action point between laser beam and arc on the frequency of droplet transfer and weld appearance is investigated in details.

  20. 废弃电路板中非金属组分的回收利用%Recycling of non-metallic fractions from waste printed circuit boards

    Institute of Scientific and Technical Information of China (English)

    刘旸; 刘静欣; 江晓健; 郭学益

    2016-01-01

    废弃电路板是电子废弃物的重要组成部分。目前工业生产及工艺开发多针对极具经济回收价值的电路板金属组分。然而,占电路板质量分数70%的非金属组分却关注较少。文章分析了废弃电路板非金属组分的组成及其有害组分,其含有树脂及玻璃纤维等有价成分和溴、夹杂重金属等污染环境的物质,其回收利用对于资源循环利用及环境保护均有重要意义。非金属组分回收利用主要有物理处理和化学处理2种技术:物理处理技术主要将非金属组分用作结构材料填料、塑料改性剂和建筑材料改性剂;化学处理技术通过焚烧将非金属组分用作燃料和熔剂或通过热解回收或溶剂分解回收可将非金属组分转化为化工产品。这2种技术在非金属组分资源化利用上各有优势,都已有部分工业化应用。%Waste printed circuit boards (WPCBs) are important parts in the electronic waste. Nowadays, recov-ering metals from WPCBs are developed but non-metallic fractions which accounts for 70% of waste printed circuit boards have not been effectively utilized. The non-metallic fractions and hazards in waste printed cir-cuit boards were analyzed in this paper. The results show that resins and glass fiber in non-metallic fractions can be recycled and bromine and heavy metals could pollute environment. Recovering non-metallic fractions are important to recycling and environment, which can be divided into physical recycling technology and chemical recycling technology, with the formal using non-metallic fractions as the filler materials, plastic modifier or building material modifiers, and the latter using non-metallic fractions as the fuel and smelting flux through incineration or convert non-metallic fractions into chemical products through pyrolysis or solvent decomposition. Both technologies have their own advantages in resource utilization of non-metallic fractions, and partly