Sample records for diffusion-controlled die soldering

  1. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper


    Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation...... of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  2. Die Soldering in Aluminium Die Casting

    Han, Q.; Kenik, E.A.; Viswanathan, S.


    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  3. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Hamm, Randy; Peterson, Kenneth A.


    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  4. Task 7: Die soldering during host site testing. Final report, January1--December 31, 1997

    Goodwin, F.E. [International Lead Zinc Research Organization, Inc., Research Triangle Park, NC (United States); Walkington, W.G. [Walkington (William G.), Cottage Grove, WI (United States)


    To provide industrial confirmation of laboratory results produced in Task 6 of this project, five industrial trials were organized with cooperative die casters in the USA. Components cast during these trials ranged from functional electronic heat sinks to decorative household plumbing components. Whereas laboratory work indicated that die temperature and draft angle were the most important process factors influencing solder accumulation, it was not possible to vary draft angle on the established production dies used for these trials. Substantial variations in die temperature were realized however and also die surface conditions were varied, confirming the influence of a secondary variable in the laboratory investigation. Substantial evidence from the trials indicated that die surface temperature is the most important factor for controlling solder build up. The surface roughness of the die casting die greatly influenced the number of castings that could be run before solder initially appeared. Development of careful thermal management techniques, now judged to be beyond the capabilities of most US die casters, will be necessary to control incidences of die soldering found in typical production. Thermal control will involve both control of the bulk die temperature through use of thermally controlled cooling lines, and also regulation of surface temperature by well controlled cooling lines, and also regulation of surface temperature by well controlled die spraying (lubrication) techniques. Further research, development and technology transfer to enhance thermal control capabilities of US die casters is recommended.

  5. Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

    Czernohorsky, J; Viering, Matthias; Wright, L; Balanon, G


    Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).

  6. Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

    Kim, Seongjun; Kim, Keun-Soo; Kim, Sun-Sik; Suganuma, Katsuaki


    Interfacial reaction and die attach properties of Zn- xSn ( x = 20 wt.%, 30 wt.%, and 40 wt.%) solders on an aluminum nitride-direct bonded copper substrate were investigated. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, CuZn5, and Cu5Zn8 IMC layers were formed, the thicknesses of which can be controlled by joining conditions such as peak temperature and holding time. During multiple reflow treatments at 260°C, the die attach structure was quite stable. The shear strength of the Cu/solder/Cu joint with Zn-Sn solder was about 30 MPa to 34 MPa, which was higher than that of Pb-5Sn solder (26 MPa). The thermal conductivity of Zn-Sn alloys of 100 W/m K to 106 W/m K was sufficiently high and superior to those of Au-20Sn (59 W/m K) and Pb-5Sn (35 W/m K).

  7. Evolution of Intermetallic Phases in Soldering of the Die Casting of Aluminum Alloys

    Song, Jie; Wang, Xiaoming; DenOuden, Tony; Han, Qingyou


    Most die failures are resulted from chemical reactions of dies and molten aluminum in the die casting of aluminum. The formation of intermetallic phases between a steel die and molten aluminum is investigated by stationary immersion tests and compared to a real die casting process. Three intermetallic phases are identified in the stationary immersion tests: a composite layer and two compact layers. The composite layer is a mixture of α bcc, Al, and Si phases. The α bcc phase changes in morphology from rod-like to spherical shape, while the growth rate of the layer changes from parabolic to linear pattern with immersion time. The first compact layer forms rapidly after immersion and maintains a relatively constant thickness. The second compact layer forms after 4 hours of immersion and exhibits parabolic growth with immersion time. In comparison, only a composite layer and the first compact layer are observed in a real die casting process. The fresh molten aluminum of high growth rate washes away the second intermetallic layer easily.

  8. Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

    Kim, Seongjun; Kim, Keun-Soo; Kim, Sun-Sik; Suganuma, Katsuaki; Izuta, Goro


    The thermal fatigue reliability of Si die-attached joints with Zn-30wt.%Sn, high-temperature, Pb-free solder was investigated, focusing on the interfacial microstructure and joining strength of a Cu/solder/Cu joint during thermal cycling. A sound die attachment on an aluminum nitride (AlN) direct-bonded copper (DBC) substrate was achieved by forming Cu-Zn intermetallic compound (IMC) layers at the interface with the Cu of the substrate. During the thermal cycling test performed between -40°C and 125°C, thermal fatigue cracks were induced by the growth of Cu-Zn IMCs at the interface with the Cu. A thin titanium nitride (TiN) film was applied to suppress the formation of Cu-Zn IMCs. Adequate joint formation was accomplished by using an Au/TiN-coated DBC substrate, and only the TiN layer was observed at both interfaces. In conjunction with the TiN diffusion barrier, the Si die-attached joint created with Zn-30wt.%Sn solder exhibited a stable interfacial microstructure during thermal cycling. No microstructural changes, such as IMC formation, grain growth or formation of fatigue cracks, were observed, and the joining strength was maintained even after 2000 cycles.

  9. Soldering handbook

    Vianco, Paul T


    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  10. Wave soldering with Pb-free solders

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  11. Soldering in electronics assembly

    Judd, Mike


    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  12. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den


    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthala

  13. Solderability test system

    Yost, Fred (Cedar Crest, NM); Hosking, Floyd M. (Albuquerque, NM); Jellison, James L. (Albuquerque, NM); Short, Bruce (Beverly, MA); Giversen, Terri (Beverly, MA); Reed, Jimmy R. (Austin, TX)


    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  14. Solderability test system

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.


    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  15. Reduced oxide soldering activation (ROSA) PWB solderability testing

    Hernandez, C.L.; Hosking, F.M. [Sandia National Labs., Albuquerque, NM (United States). Physical and Joining Metallurgy Dept.; Reed, J. [Texas Instruments, Austin, TX (United States); Tench, D.M.; White, J. [Rockwell Science Center, Thousand Oaks, CA (United States)


    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  16. Lead-free solder

    Anderson, Iver E. (Ames, IA); Terpstra, Robert L. (Ames, IA)


    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  17. Removing Dross From Molten Solder

    Webb, Winston S.


    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  18. Solder dross removal apparatus

    Webb, Winston S. (Inventor)


    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  19. Low temperature aluminum soldering analysis

    Peterkort, W.G.


    The investigation of low temperature aluminum soldering included the collection of spread factor and dihedral angle data for several solder alloys and a study of flux effects on aluminum. Selected solders were subjected to environmental tests and evaluated on the basis of tensile strength, joint resistance, visual appearance, and metallurgical analysis. A production line method for determining adequate flux removal was developed.

  20. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

    HAN Zong-jie; XUE Song-bai; WANG Jian-xin; ZHANG Xin; ZHANG Liang; YU Sheng-lin; WANG Hui


    Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also with infrared reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed laser soldering time, an optimal power exists, while the optimal mechanical properties of QFP micro-joints are gained. Mechanical properties of QFP micro-joints soldered with laser soldering system are better than those of QFP micro-joints soldered with IR reflow soldering method. Fracture morphologies of QFP micro-joints soldered with laser soldering system exhibit the characteristic of tough fracture, and homogeneous and fine dimples appear under the optimal laser output power.

  1. Soldering of Nanotubes onto Microelectrodes

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina


    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...... bonds were consistently found to be mechanically stronger than the carbon nanotubes....

  2. Capillary flow solder wettability test

    Vianco, P.T.; Rejent, J.A.


    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  3. Soldering Formalism Theory and Applications

    Wotzasek, C


    The soldering mechanism is a new technique to work with distinct manifestations of dualities that incorporates interference effects, leading to new physical results that includes quantum contributions. This approach was used to investigate the cases of electromagnetic dualities, and $D\\geq 2$ bosonization. In the former context this technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. The soldered actions in any dimension leads to a master action which is duality invariant under a much bigger set of symmetries. The effects of coupling to gravity are also elaborated. In the later context, a technique is developed that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usu...

  4. Solder joint technology materials, properties, and reliability

    Tu, King-Ning


    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  5. Wetting behavior of alternative solder alloys

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.


    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  6. Solder Joint Health Monitoring Testbed

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.


    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  7. Handbook of machine soldering SMT and TH

    Woodgate, Ralph W


    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  8. Die binding van die konfessie

    P. J. Coetzee


    Full Text Available Ons moet waak teen twee uiterstes. Aan die een kant het die dogma as onversoenlike vyand die dogmatisme en aan die ander kant die antidogmatisme — dit hou enersyds die gevaar in van verabsolutering (oorskatting, en ander- syds die gevaar van relativisme (onderskatting.

  9. Die instelling van die doop

    J. L. Venter


    Full Text Available Die eerste plek in die evangeliebeskrywings waar daar van die doop as ’n opdrag van Jesus Christus gepraat word en waar die betekenis die duidelikste uitkristalliseer, staan in Matteus 28 : 16 - 20. Heilshistories gesien, is dit die begin van kerklike inlywing van die wat gehoor het hoedat Jesus sy koninkryk proklameer, die evangelie aanvaar en tot bekering kom. Vir die doel van hierdie artikel word hierdie gedeelte ondersoek om te sien hoe die instelling geskied het, wat die plek en betekenis van die Christelike doop is.

  10. Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

    Vlahinos, A.; O' Keefe, M.


    This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.

  11. UBM Formation on Single Die/Dice for Flip Chip Applications

    Jittinorasett, Suwanna


    This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. Typically, UBM is deposited on the whole wafers by sputtering, evaporation, or electroless plating. These deposition techniques are not practical for UBM ...

  12. Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces

    Jang, Jin-Wook; Hayes, Scott; Lin, Jong-Kai; Frear, Darrel R.


    The dissolution behavior of Si (100) and (111) dies by eutectic AuSi solder was investigated. On the Si (100) surface, the dissolution primarily occurred by the formation of craters resulting in a rough surface. The dissolution of the Si (111) resulted in a relatively smooth surface. The morphology of the Si (100) surface during a AuSi soldering reaction exhibited more time-dependent behavior and the etching craters on a Si (100) surface grew larger with time whereas Si (111) did not significantly change. This difference was ascribed to the surface energy differences between Si (111) and (100) surfaces that resulted in the two- and three-dimensional dissolution behaviors, respectively. This difference plays an important role in the formation of voids during the AuSi die bonding. The etching craters on Si (100) act as a AuSi solder sink and the regions surrounded by etch pits tend to become voids. For Si (111), flat surfaces were observed in the voided regions. Cross section analysis showed that no solder reaction occurred in the voided region of the Si (111) surface. This suggests the possibility of the formation of a thin inert layer in a potentially voided region prior to assembly. To achieve void-free die bonding, different parameters must be adjusted to the Si (100) and Si (111) surfaces with the AuSi alloy.

  13. Evaluation of permanent die coatings to improve the wear resistance of die casting dies. Final project report, January 1, 1995--April 30, 1997

    Shivpuri, R.


    Die Casting dies are subject to severe service conditions during the die casting operation. While these severe conditions are necessary to achieve high production rates, they cause the dies which are commonly made of H13 die steel, to suffer frequent failures. The major die failure mechanisms are erosion or washout, Heat checking, soldering and corrosion. Due to their geometrical complexity, die casting dies are very expensive (some dies cost over a million dollars), and thus a large number of parts have to be produced by a die, to justify this cost and leverage the advantages of the die casting process (high production rates, low manpower costs). A potential increase in the die service life, thus has a significant impact on the economics of the die; casting operation. There are many ways to extend die life: developing new wear resistant die materials, developing new surface treatments including coatings, improving heat treatment of existing H13 dies, using better lubricants that can protect the die material, or modifying the die geometry and process parameters to reduce the intensity of wear. Of these the use of coatings to improve the wear resistance of the die surface has shown a lot of promise. Consequently, use of coatings in the die casting industry and their wide use to decrease die wear can improve significantly the productivity of shop operations resulting in large savings in material and energy usage.

  14. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging

    Li, Hailong [State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 (China); An, Rong, E-mail: [Key Laboratory of Micro-systems and Micro-structures Manufacturing, Harbin Institute of Technology, Ministry of Education, Harbin 150080 (China); Wang, Chunqing; Jiang, Zhi [State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 (China)


    Highlights: • Cu dissolution during reflowing was mainly occurred under the gaps between scallops. • Though IMC growth was diffusion-controlled, consumption of Cu substrate was not. • Growth of Cu{sub 3}Sn layer in Sn3.0Ag0.5Cu/Cu solder joint was on the both sides. • Ag and Cu lead to a thinner Cu{sub 3}Sn layer due to inhibit the diffusion of Sn into Cu. - Abstract: In situ microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging was quantitatively studied by nanoindentation. The morphology of Cu{sub 6}Sn{sub 5} gradually altered from scallop type to layer type. Though the growth of IMCs was diffusion-controlled, the consumption of Cu substrate was not linear with the square root of aging time. At the initial stage of solid state aging, the Cu atoms essential to the growth of IMCs were mainly from the supersaturated solder matrix. When the Cu atoms from supersaturated solder matrix were exhausted, the Cu atoms for the growth of IMCs were primarily from the Cu substrate. In addition, the IMCs formed at this state were principally used to fill up the gaps between scallops. After the gaps disappeared, the consumption of Cu substrate slowed down. Furthermore, the growth of Cu{sub 3}Sn layer in Sn3.0Ag0.5Cu/Cu solder joint was on the both sides with layer type. Since the Sn atoms were inhibited to diffuse into the Cu substrate by the alloying elements of Ag and Cu, the thickness of Cu{sub 3}Sn layer in SnAgCu/Cu solder joint was much thinner than that in pure Sn/Cu solder joint.

  15. Lead free solder mechanics and reliability

    Pang, John Hock Lye


    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  16. Study on laser and hot air reflow soldering of PBGA solder ball

    田艳红; 王春青


    Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element. Needle-like AuSn4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.

  17. Die topkwark

    R. Tegen


    Full Text Available ’n Oorsig van die belangrikheid van die onlangs ontdekte topkwark by Fermilab in Chicago word gegee. Daar word aangetnon dat die topkwark belangrik is in fisika van die Oerknal, oftewel "Big Bang", en in die Standaard Model van Elementêredeeltjie-fisika. Toepaslike literatuur vir verdere studie kan van die lys van verwysings in hierdie kort, nietegniese artikel, nagegaan word.



    Mar 1, 2012 ... Based on this, a wettability test using copper grid was conducted on the solder alloys produced. The result shows that wetting time varied from 4 seconds to 5 seconds for the lead-free solders ... at the interfaces [4]. This study ...

  19. Nano-soldering to single atomic layer

    Girit, Caglar O.; Zettl, Alexander K.


    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  20. Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics%电子组装无铅焊料的热力学、动力学计算及合金设计

    刘兴军; 王翠萍


    Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem.On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multicomponent system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. Inaddition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.

  1. Characterization and modeling of microstructural evolution of near-eutectic tin-silver-copper solder joints

    Zbrzezny, Adam R.

    Near-eutectic Sn-Ag-Cu (SAC) solders are currently considered as major lead-free replacement candidates for Sn-Pb eutectic alloys in microelectronics applications. In this thesis, the microstructural thermal stability including recrystallization, grain growth behavior, Pb and Au contamination effects and interaction of the SAC solder with Cu and Ni substrates were investigated. The true eutectic composition of the Sn-Ag-Cu alloy was verified to be Sn3.5Ag0.9Cu wt.%, and the eutectic melting temperature was determined to be 217.4 +/- 0.8°C. The system was classified as belonging to faceting (Cu6Sn5)-faceting (Ag3Sn)-nonfaceting (Sn matrix) ternary eutectic. The most significant consequence of Pb contamination was the formation of a quaternary eutectic phase (Sn-Ag-Cu-Pb) with a melting point at 176°C. Similarly, the presence of gold in the SAC alloy led to a development of a new quaternary phase (Sn-Ag-Cu-Au) melting at 204°C. Prolonged aging of SAC-4 wt.% Au on nickel resulted in the deposition of a new, previously unreported, intermetallic (IMC) layer, ((Au1-xCUx)6Sn 5, 15 wt.% of Au) on top of the existing (Cu1-yNi y)6Sn5 layer. The interfacial products that formed during soldering to copper were Cu6Sn5 and Cu3Sn. Soldering to nickel resulted in the formation of one layer, (Cu1-yNiy) 6Sn5, which was different from the expected Ni3Sn 4 layer. A small copper content in the SAC solder (0.7 wt.%) was sufficient to promote this thermodynamic shift. Intermetallic growth on Cu during solid state aging was established to be bulk diffusion controlled. The IMC layers in the SAC system grew at a slower rate than in the Sn-Pb system. It was found that the reliability of SAC solder joints on copper was considerably better than on nickel due to copper enrichment during reflow and subsequent Cu6Sn5 intermetallic precipitation. Enhanced copper and silver diffusion followed by tin recrystallization and grain growth, cavity nucleation and subsequent micro-crack linkage formed

  2. Low cycle fatigue of lead free solder joints

    Schemmann, Lars; Wedi, Andre; Baither, Dietmar; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Muenster (Germany)


    Presently solders containing lead are banned from consumer electronics. Important alternatives are the Sn-Ag-Cu (SAC) solders and solders containing antimony. This work studies the isothermal low cycle fatigue properties of SAC solders and the SnSb(8) solder. For the experiments, model solder joints were produced and used. They consist of two pure copper plates joined together by a circular disk of solder. Low cycle fatigue experiments were done under displacement control. Furthermore hardness was tested by a micro indenter. In order to find an explanation for the different lifetimes of the solders, several micro structural investigations were performed. For this we used transmission and scanning electron microscopy as well as optical microscopy. The measured data showed a strong relation between lifetime and hardness of the solder alloy. We also found, that the type of solder influences the crack propagation.

  3. Energy diffusion controlled reaction rate in dissipative Hamiltonian systems

    Deng Mao-Lin; Zhu Wei-Qiu


    In this paper the energy diffusion controlled reaction rate in dissipative Hamiltonian systems is investigated by using the stochastic averaging method for quasi Hamiltonian systems. The boundary value problem of mean first-passage time (MFPT) of averaged system is formulated and the energy diffusion controlled reaction rate is obtained as the inverse of MFPT. The energy diffusion controlled reaction rate in the classical Kramers bistable potential and in a two-dimensional bistable potential with a heat bath are obtained by using the proposed approach respectively. The obtained results are then compared with those from Monte Carlo simulation of original systems and from the classical Kramers theory. It is shown that the reaction rate obtained by using the proposed approach agrees well with that from Monte Carlo simulation and is more accurate than the classical Kramers rate.

  4. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders


    controlled fatigue life, likely because of increased void -nucleation via creep-fatigue interactions. Since the solder is largely under plastically deform the solder in order to break the oxide layers and eliminate some minor voids around the NiTi particles. Figure 32... Underfill Constraint Effects during Thermomechanical Cycling of Flip Chip Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 4, 2002

  5. Lead Ingestion Hazard in Hand Soldering Environments.



  6. Evaluation of Heat Checking and Washout of Heat Resistant Superalloys and Coatings for Die inserts

    David Schwam; John F. Wallace; Yulong Zhu; Edward Courtright; Harold Adkins


    This project had two main objectives: (1) To design, fabricate and run a full size test for evaluating soldering and washout in die insert materials. This test utilizes the unique capabilities of the 350 Ton Squeeze Casting machine available in the Case Meal Casting Laboratory. Apply the test to evaluate resistance of die materials and coating, including heat resistant alloys to soldering and washout damage. (2) To evaluate materials and coatings, including heat resistant superalloys, for use as inserts in die casting of aluminum alloys.

  7. Modeling the diffusion of solid copper into liquid solder alloys

    Rizvi, M.J. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)], E-mail:; Lu, H.; Bailey, C. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)


    During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn-Pb and Sn-Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn-Pb solder is 2.74 x 10{sup -10} m{sup 2}/s and for Sn-Cu solder is 6.44 x 10{sup -9} m{sup 2}/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.

  8. Organic solderability preservation evaluation. Topical report

    Becka, G.A.; McHenry, M.R.; Slanina, J.T.


    An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

  9. Soldering Chiralities; 2, Non-Abelian Case

    Wotzasek, C


    We study the non-abelian extension of the soldering process of two chiral WZW models of opposite chiralities, resulting in a (non-chiral) WZW model living in a 2D space-time with non trivial Riemanian curvature.

  10. Die menswaardigheid van die menslike embrio : die debat tot dusver

    Vorster, J.M


    ...), "Stem cell research: the ethical issues". Rakende die gebruik van menslike embrio's in stamselnavorsing, behandel hierdie artikels die potensiaal van die menslike embrio, die morele status (menswaardigheid...

  11. Shrink-Fit Solderable Inserts Seal Hermetically

    Croucher, William C.


    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  12. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi


    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  13. Temperature versus time curves for manual and automated soldering processes

    Trent, M.A.


    Temperature-versus-time curves were recorded for various electronic components during pre-tinning, hand soldering, and drag soldering operations to determine the temperature ranges encountered. The component types investigated included a wide range of electronic assemblies. The data collected has been arranged by process and will help engineers to: (1) predetermine the thermal profile to which various components are subjected during the soldering operation; (2) decide--on the basis of component heat sensitivity and the need for thermal relief--where hand soldering would be more feasible than drag soldering; and (3) determine the optimum drag solder control parameters.

  14. Integrated environmentally compatible soldering technologies. Final report

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.


    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  15. SNL initiatives in electronic fluxless soldering

    Hosking, F. M.; Frear, D. R.; Vianco, P. T.; Keicher, D. M.

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories (SNL), Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  16. PWB solder wettability after simulated storage

    Hernandez, C.L.; Hosking, F.M.


    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  17. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.


    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  18. Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.

    Kawada, E; Sakurai, Y; Oda, Y


    To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.

  19. Age-aware solder performance models : level 2 milestone completion.

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann


    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  20. Computer simulation of solder joint failure

    Burchett, S.N.; Frear, D.R. [Sandia National Lab., Albuquerque, NM (United States); Rashid, M.M. [Univ. of California, Davis, CA (United States)


    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  1. Evaluation technology of lead-free solders; Namari free handa zairyo ni okeru hyoka gijutsu

    Yamashita, M.; Shiokawa, K. [Fuji Electric Co. Ltd., Tokyo (Japan); Ueda, A. [Fuji Electric Corporate Research and Development,Ltd., Kanagawa (Japan)


    Solders mainly composed of tin and lead are currently in widespread use in semiconductor devices. However, in view of lead influences on the human body and environmental problems, lead-free solders have been in urgent demand. In this study, aiming to improve the solderability and reliability of a tin-silver solder, one of most promising lead-free solder materials, we have investigated elements to be added. Focusing on typical lead-free tin-silver solders and tin-lead eutectic solders, this paper describes the result of investigations into the mechanical properties solderability, micro structures of the solder materials and gas analysis in soldering. (author)

  2. Die posisie van die Helper in die sending

    I. J. van der Walt


    Full Text Available Gedurende die aanvangsjare van die sending het die helper ’n onmisbare funksie vervul. Hulle het die onherbergsame binnelande geken, waardevolle kontakpunte vir die sendelinge geopen en hulle mense geestelik help voorlig en voorberei.

  3. Effect of Solder Flux Residues on Corrosion of Electronics

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per


    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[...

  4. Efforts to Develop a 300°C Solder

    Norann, Randy A [Perma Works LLC


    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  5. Microstructural evolution of eutectic Au-Sn solder joints

    Song, Ho Geon


    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  6. Microstructural evolution of eutectic Au-Sn solder joints

    Song, Ho Geon [Univ. of California, Berkeley, CA (United States)


    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  7. Testing of printed circuit board solder joints by optical correlation

    Espy, P. N.


    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  8. Casting Characteristics of Aluminum Die Casting Alloys

    Makhlouf M. Makhlouf; Diran Apelian


    The research program investigates the casting characteristics of selected aluminum die casting alloys. Specifically, the alloys' tendencies towards die soldering and sludge formation, and the alloys' fluidity and machinability are evaluated. It was found that: When the Fe and Mn contents of the alloy are low; caution has to be taken against possible die soldering. When the alloy has a high sludge factor, particularly a high level of Fe, measures must be taken to prevent the formation of large hardspots. For this kind of alloy, the Fe content should be kept at its lowest allowable level and the Mn content should be at its highest possible level. If there are problems in die filling, measures other than changing the alloy chemistry need to be considered first. In terms of alloy chemistry, the elements that form high temperature compounds must be kept at their lowest allowable levels. The alloys should not have machining problems when appropriate machining techniques and machining parameters are used.

  9. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan


    Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach: Chan......Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design....../methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid......-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic...

  10. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    M. Provazník; R. Koleňák


    This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  11. A novel method for direct solder bump pull testing using lead-free solders

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  12. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

    ZHANG Shu-guang; HE Li-jun; ZHU Xue-xin; ZHANG Shao-ming; SHI Li-kai; XU Jun


    A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

  13. Solder Joint Health Monitoring Testbed System

    Delaney, Michael M.


    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  14. Pb-Free Soldering Iron Temperature Controller

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  15. Nanocopper Based Solder-Free Electronic Assembly

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.


    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  16. Moisture and aging effects of solder wettability of copper surfaces

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.


    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  17. Parametric study on the solderability of etched PWB copper

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.


    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  18. Lead (Pb)-Free Solder Applications



    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  19. Effects of PCB thickness on adjustable fountain wave soldering

    M S Abdul Aziz; M Z Abdullah; C Y Khor; A Jalar; M A Bakar; W Y W Yusoff; F Che Ani; Nobe Yan; M Zhou; C Cheok


    This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0° and 6°. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

  20. Solder flow over fine line PWB surface finishes

    Hosking, F.M.; Hernandez, C.L.


    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  1. Prototype circuit boards assembled with non-lead bearing solders

    Vianco, P.T.; Rejent, J.A.


    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  2. Capillary flow of solder on chemically roughened PWB surfaces

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.


    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  3. Automatic computer-aided system of simulating solder joint formation

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin


    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  4. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    Ji, Hongjun; Wang, Qiang; Li, Mingyu


    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  5. Multilead, Vaporization-Cooled Soldering Heat Sink

    Rice, John


    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  6. Soldering and Mass Generation in Four Dimensions

    Banerjee, R; Banerjee, Rabin; Wotzasek, Clovis


    We propose bosonised expressions for the chiral Schwinger models in four dimensions. Then, in complete analogy with the two dimensional case, we show the soldering of two bosonised chiral Schwinger models with opposite chiralities to yield the bosonised Schwinger model in four dimensions. The implications of the Schwinger model or its chiral version, as known for two dimensions, thereby get extended to four dimensions.

  7. Solderability test development. Final report. [Meniscograph tests

    Jarboe, D.M.


    Operating procedures and data reduction techniques applicable to the Meniscograph (General Electric Company, Limited) were developed. Using force-time traces from tests involving various sample materials and configurations, flux types, and test temperatures, the wetting rate and contact angle were obtained through statistical treatment of the data. This information provides a means of directly correlating solderability with the physical phenomenon of wetting.

  8. Die regsposisie van die gemolesteerde kind 1

    P.J. Schabort


    Full Text Available Hoe reik die reg uit na die seksueel gemolesteerde kind? As na die reg in wye verband gekyk word, sou dit alie wetgewing en alle gemeneregsbeginsels en alle regsprosedures insluit waardeur die Staat poog om molestering te voorkom en die gemolesteerde kind in beskerming te neem. Dit le baie wyd en sou byvoorbeeld die maatreels insluit van die Kindenvet 33 van 1960; die Wet op Egskeiding 70 van 1979; die Wet op Kindersorg 74 van 1983; die Wet op die Status van Kinders 82 van 1987 en die Wet op Bemiddeling in Sekere Egskeidingsaangeleenthede 24 van 1987. Eersdaags sal dit moontlik ook ’n Manifes vir die Regte van Kinders insluit wat vermoedelik geskoei sal wees op die W O se Konvensie vir die Regte van die Kind (1989 w a arv an die RSA tan s nog nie ’n ondertekenaar is nie.

  9. Diffusion in Solids Fundamentals, Methods, Materials, Diffusion-Controlled Processes

    Mehrer, Helmut


    Diffusion is a vital topic in solid-state physics and chemistry, physical metallurgy and materials science. Diffusion processes are ubiquitous in solids at elevated temperatures. A thorough understanding of diffusion in materials is crucial for materials development and engineering. This book first gives an account of the central aspects of diffusion in solids, for which the necessary background is a course in solid state physics. It then provides easy access to important information about diffuson in metals, alloys, semiconductors, ion-conducting materials, glasses and nanomaterials. Several diffusion-controlled phenomena, including ionic conduction, grain-boundary and dislocation pipe diffusion, are considered as well. Graduate students in solid-state physics, physical metallurgy, materials science, physical and inorganic chemistry or geophysics will benefit from this book as will physicists, chemists, metallurgists, materials engineers in academic and industrial research laboratories.

  10. Diffusion Controlled Reactions, Fluctuation Dominated Kinetics, and Living Cell Biochemistry

    Konkoli, Zoran


    In recent years considerable portion of the computer science community has focused its attention on understanding living cell biochemistry and efforts to understand such complication reaction environment have spread over wide front, ranging from systems biology approaches, through network analysis (motif identification) towards developing language and simulators for low level biochemical processes. Apart from simulation work, much of the efforts are directed to using mean field equations (equivalent to the equations of classical chemical kinetics) to address various problems (stability, robustness, sensitivity analysis, etc.). Rarely is the use of mean field equations questioned. This review will provide a brief overview of the situations when mean field equations fail and should not be used. These equations can be derived from the theory of diffusion controlled reactions, and emerge when assumption of perfect mixing is used.

  11. Microwave Tissue Soldering for Immediate Wound Closure

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James


    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  12. Preparation of solder pads by selective laser scanning

    Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo


    We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprint-ing it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

  13. Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO

    ZHOU Ji-cheng; XIAO Xiao-qing; EN Yun-fei; CHEN Ni; WANG Xiang-zhong


    Based on a method combined artificial neural network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments of accelerated thermal cycling test were performed by ANSYS software. Based on orthogonal array experiments, a back-propagation artificial neural network (BPNN) was used to establish the nonlinear multivariate relationship between thermo-mechanical fatigue reliability and control factors. Then, PSO was applied to obtaining the optimal levels of control factors by using the output of BPNN as the affinity measure. The results show that the control factors, such as print circuit board (PCB) size, PCB thickness, substrate size,substrate thickness, PCB coefficient of thermal expansion (CTE), substrate CTE, silicon die CTE, and solder joint CTE, have a great influence on thermo-mechanical fatigue reliability of PBGA solder joints. The ratio of signal to noise of ANN-PSO method is 51.77dB and its error is 33.3% less than that of Taguchi method. Moreover, the running time of ANN-PSO method is only 2% of that of the BPNN. These conclusions are verified by the confirmative experiments.

  14. Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder

    Jung, Do-Hyun; Sharma, Ashutosh; Lim, Dong-Uk; Yun, Jong-Hyun; Jung, Jae-Pil


    The addition of nanosized AlN particles to Sn-3.0 wt pctAg-0.5 wt pctCu (SAC305) lead-free solder alloy has been investigated. The various weight fractions of AlN (0, 0.03, 0.12, 0.21, 0.60 wt pct) have been dispersed in SAC305 solder matrix by a mechanical mixing and melting route. The influences of AlN nanosized particles on the microstructure, mechanical properties, and solderability ( e.g., spreadability and wettability) have been carried out. The structural and morphological features of the nanocomposite solder were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and transmission electron microscope (TEM). The experimental results show that the best combination of solderability and mechanical properties is obtained at 0.21 wt pct AlN in the solder matrix. The reinforced composite solder with 0.21 wt pct AlN nanoparticles shows ≈25 pct improvement in ultimate tensile strength (UTS), and ≈4 pct increase in the spreadability. In addition, the results of microstructural analyses of composite solders indicate that the nanocomposite solder, especially reinforced with 0.21 wt pct of AlN nanoparticles, exhibits better microstructure and improved elongation percentage, compared with the monolithic SAC305 solder.

  15. Die Heimkunft

    Stephen Romer


    Full Text Available En hommage amical à René Gallet.Die HeimkunftRuhig glänzen indes die silberen Höhen darüber,Voll mit Rosen ist schon droben der leuchtende Schnee.- HölderlinAnd then one day the young master returnsfrom a dark placeand birdsong leads the wanderer inand the cat yawns and curls againin the headiness of this instantthe house is fragrantwith woodsmoke and honeysucklewhich is a kind of accomplishment.Returning from dogmahome to the humanehe lays asideknapsack, alpenstock and hat,goes straight to t...

  16. Thermal Simulation of Four Die-Attach Materials


    contact between circuit board layers. ..............................................................5 Figure 4. Simulation results with AuSn braze on...being investigated, three were metallic, with good thermal conductivity. These materials were a Au/Sn braze , in an 80%/20% mixture; a CPES nanoscale...silver powder; and Kester R520A solder paste, an alloy which is 96.5% Sn, 3.0% Ag, and 0.5% Cu , commonly called SAC. The fourth die-attach material

  17. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert


    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  18. Investigation of Solder Cracking Problems on Printed Circuit Boards

    Berkebile, M. J.


    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  19. Assessment of potential solder candidates for high temperature applications

    Multi-Chip module (MCM) technology is a specialized electronic packaging technology recently gaining momentum due to the miniaturization drive in the microelectronics industry. The step soldering approach is being employed in the MCM technology. This method is used to solder various levels...... of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  20. Anomalous creep in Sn-rich solder joints

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay


    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.



    In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of boh fluxless SnPb solder in the vacuum surroundings and flux SnPb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder su rface tension is the important factor achieving fluxless laser soldering.

  2. Calvyn en die Skrifgesag

    L. F. Schulze


    Full Text Available Die probleem van die Skrifgesag het die (teologiese geeste nog altyd in beroering — vandag (ná die Aufklarung! nog meer as gedurende die sestiende eeu. Gedurende die laaste paar jaar is ons in Suid-Afrika hardhandig uit ons isolement geruk en skielik lewensgroot gekonfronteer met die probleem van die Skrifgesag.

  3. Solderability preservation through the use of organic inhibitors

    Sorensen, N.R.; Hosking, F.M.


    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  4. Aging, stressing and solderability of electroplated and electroless copper

    Sorensen, N.R.; Hosking, F.M.


    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  5. High temperature solder alloys for underhood applications: Final report

    Kern, J.A. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Mechanical Engineering; Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Laboratories, Albuquerque, NM (United States); Weiser, M.W. [Johnson-Mathey Electronics Corp., Spokane, WA (United States)


    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  6. Recent Research Trend in Laser-Soldering Process

    Kim, Hwan Tae; Kil, Sang Cheol [Korea Institute of Science and Technology Information, Seoul (Korea, Republic of); Hwang, Woon Suk [Inha University, Incheon (Korea, Republic of)


    The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modem microjoining technology such as micro-resistance spot joining micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

  7. Aspekte van die siekepastoraat

    H. J. C. Pieterse


    Full Text Available Die siekepastoraat vra ons aandag in hierdie tyd omdat die versorging van siekes ’n kenmerk is van die koms van die koninkryk van God. God se barmhartigheid het in sy volheid tot gelding gekom in die optrede van Jesus Christus. Die volle seën van die heil van die Ryk van God hou ook die versorging van die siekes in. Deur die heilswerk van Christus sien die blindes weer, loop die kreupeles, word melaatses gereinig, hoor die dowes, word dooies opgewek (Luk. 7:22.

  8. Die prediking oor die historiese stof van die Ou Testament

    F. N. Lion-Cachet


    Full Text Available Uit ’n steekproef wat gedoen is uit die preke wat in Die Kerkblad (1986- 1987 verskyn het, blyk dit dat 40% van hierdie preke historiese stof uit die Ou Testament as teks gebruik het.

  9. Die gesag van die Heilige Skrif

    S.C.W. Duvenage


    Full Text Available Dit geld nie maar t.o.v. ’n ongeloofsbeskouing soos dié van Karl Jaspers nie wat beweer: „Die Bibel ist das Depositum eines Jahrtausends menschlicher Grenzerfahrung” of van die Rooms-Katolieke skrifbeskouing nie wat die kerklike leertradisie, soos dogmaties op die konsilie van Trente vasgelê is, beskou as die enigste gesaghebbende kriterium vir die kanonisering en interpretasie van die Skrif.

  10. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Mohd Nizam Ab. Rahman


    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  11. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

    XUE Song-bai; YU Sheng-lin; WANG Xu-yan; LIU lin; HU Yong-fang; YAO Li-hua


    Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

  12. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    M. Provazník


    Full Text Available This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2. The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  13. Die ontwrigting van die Afrikanervolk en volkseenheid

    H. du Plessis


    Full Text Available Die gevare wat ons Afrikanerdom voor die deur staan, is baie en ernstig. Daar is die gevaar van immigrasie van buitelanders, daar is die al driester geroep om gelykstelling tussen blank en gekleurd, daar is die dreigende oorheersing van ’n oppervlakkige Amerikaanse „jazz”-gees.

  14. Die Nasionale Vakterminologiediens (NVD

    L. A. Genis


    Full Text Available Die Nasionale Vakterminologiediens (NVD ressorteer onder die Hoofdirektoraat Kultuur en Vakkundige Hulp- dienste van die Departement van Nasionale Opvoeding. Die hoofdoelwit van die NVD is die skepping van ’n fijnksionele vakwoordeskat in veral Afrikaans, parallel met die inter- nasionaal gebruikte terminologieë.

  15. Surface tension and reactive wetting in solder connections

    Wedi, Andre; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Wilhelm-Klemm-Strasse 10, 48149 Muenster (Germany)


    Wetting is an important pre-requisite of a reliable solder connection. However, it is only an indirect measure for the important specific energy of the reactive interface between solder and base metallization. In order to quantify this energy, we measured wetting angles of solder drops as well as surface tension of SnPb solders under systematic variation of composition and gaseous flux at different reflow temperatures. For the latter, we used the sessile drop method placing a solder drop on a glas substrate. From the two independent data sets, the important energy of the reactive interface is evaluated based on Young's equation. Remarkably, although both, the tension between the solder and flux and the wetting angle, reveal significant dependence on solder composition. So the adhesion energy reveals distinguished plateaus which are related to different reaction products in contact to the solder. TEM analysis and calculations of phase stabilities show that there is no Cu6Sn5 for high lead concentrations. The experiments confirm a model of reactive wetting by Eustathopoulos.

  16. Assessment of potential solder candidates for high temperature applications

    of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...

  17. Die kritiese taak van die literator

    A. L. Combrink


    Full Text Available Die beoefening van die literêre kritiek was aanvanklik slegs ’n deeltydse aktiwiteit. Die vroegste literêre kritici was nie as sodanig kritici nie maar het as deel van hulle totale intellektuele aktiwiteit hulle ook uitgelaat oor die letterkunde. Die motivering wat hulle hiertoe gehad het sou in ons dag heeltemal verdag voorkom: ’n uitgesproke didaktiese of moraliserende houding was die reel.

  18. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    Davidson, R.N.


    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  19. A Study of Solder Alloy Ductility for Cryogenic Applications

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.


    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  20. Hybrid microcircuit board assembly with lead-free solders

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.


    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  1. Current Status of Lead-Free Soldering and Conductive Adhesives



    Lead-free soldering technology took offin the Japanese market during the year 2000, and as the year 2001-03 ushered in the 21 st century, a large number of products with lead-free soldering were already appearing on store shelves. Elsewhere, EU deliberation on the draft of the WEEE/RoHS directive finalized in February 2003 and be in force in July 2006. The course had been set for adopting lead-free solder for mounting processes of parts as well, bringing the possibility of lead-free solder mounting very close to achievement. This review will provide a view of the current state of technological progress in lead-free soldering, both in Japan and abroad, and will discuss future prospects.

  2. Development of lead-free solders for hybrid microcircuits

    Hosking, F.M.; Vianco, P.T.; Frear, D.R.; Robinson, D.G.


    Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.

  3. Die Via Dolorosa

    W. J. van der Merwe


    Full Text Available In die hartjie van Jerusalem, die heilige stad vir Jood, Mohammedaan en Christen staan daar ’n boog, die ,,Ecce Homoboog” genaamd, en 'n klein endjie daarvandaan, die Heilige Grafkerk.

  4. Duality Symmetry and Soldering in Different Dimensions

    Banerjee, R


    We develop a systematic method of obtaining duality symmetric actions in different dimensions. This technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. In all cases there are two such distinct actions. Furthermore, by soldering these distinct actions in any dimension a master action is obtained which is duality invariant under a much bigger set of symmetries than is usually envisaged. The concept of swapping duality is introduced and its implications are discussed. The effects of coupling to gravity are also elaborated. Finally, the extension of the analysis for arbitrary dimensions is indicated.

  5. Luther die prediker

    J. J. van der Walt


    Full Text Available ’n Prediker moet ’n getroue herder wees wat magtig is in die Heilige Skrif, want die Woord bring die kerk voort. Daarom moet die prediker in sy bediening aan mense ’n woord van sekerheid hê deur seker te wees hy het die Woord van God. Met hierdie gedagtegang het Luther se pastorale besorgdheid vaste bodem vir die prediking in die gesag van die Woord van God.

  6. Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects

    Chen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing


    The growth of intermetallic compounds (IMCs) on the free surface of 99Sn-1Cu solder joints perpendicular to the interdiffusion direction has been investigated in this work. The specimens were specifically designed and polished to reveal a flat free surface at the solder/Cu interface for investigation. After aging at 175°C for progressively increased durations, the height of the perpendicular IMCs was examined and found to follow a parabolic law with aging duration that could be expressed as y = 0.11√ t, where t is the aging duration in hours and y is the height of the perpendicular IMCs in μm. For comparison, the planar growth of IMCs along the interdiffusion direction was also investigated in 99Sn-1Cu/Cu solder joints. After prolonged aging at 175°C, the thickness of the planar interfacial IMC layers also increased parabolically with aging duration and could be expressed as h_{{IMC}} = 0.27√ t + 4.6, where h is the thickness in μm and t is the time in hours. It was found that both the planar and perpendicular growth of the IMCs were diffusion-controlled processes, but the perpendicular growth of the IMCs was much slower than their planar growth due to the longer diffusion distance. It is proposed that Cu3Sn forms prior to the formation of Cu6Sn5 in the perpendicular IMCs, being the reverse order compared with the planar IMC growth.

  7. Electromigration of composite Sn-Ag-Cu solder bumps

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil


    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  8. Environmentally compatible solder materials for thick film hybrid assemblies

    Hosking, F.M.; Vianco, P.T.; Rejent, J.A.; Hernandez, C.L. [Sandia National Labs., Albuquerque, NM (United States). Materials and Process Sciences Center


    New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

  9. Simulation of thermomechanical fatigue in solder joints

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A. [Sandia National Labs., Albuquerque, NM (United States)


    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  10. Albumin-genipin solder for laser tissue welding

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura


    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  11. Mechanical Reliability of Aged Lead-­Free Solders

    Lewin, Susanne


    The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products.            The reliability of solder joints is an important issue as the failure could destroy the whole function of a product. SnAgCu is a commonly used alloy for lead-­free solders. Co...

  12. Solder technology in the manufacturing of electronic products

    Vianco, P.T.


    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  13. Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    CHEN Wenxue; XUE Songbai; WANG Hui; WANG Jianxin; HAN Zongjie


    The eutectie Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quan-tity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxi-dation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti-nosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the pre-cipitation of ε-AgZn_3 from the liquid solder on preformed interracial intermetallics (Cu_5Zn_8). The peripheral AgZn_3, nodular on the Cu_5Zn_8 IMCs layer, is likely to be generated by a peritectic reaction L+γ-Ag_5Zn8→ε-AgZn_3 and the following crystallization of AgZn_3.

  14. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Liu Mei Lee


    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  15. High temperature solder alloys for underhood applications. Progress report

    Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Labs., Albuquerque, NM (United States); Kern, J.; Weiser, M.W. [Univ. of New Mexico (United States). Dept. of Mechanical Engineering


    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  16. Wêreldmededingendheid en die tegnologie

    C. W. I. Pistorius


    Full Text Available Afgesien van die interne uitdagings wat die Heropbou- en Ontwikkelingsprogram (HOP aan Suid-Afrika bied, moet die land ook tred hou met die veranderende globale omgewing, spesifiek die toenemende belangrikheid van ekonomiese sekuriteit as komponent van nasionale sekuriteit. Die konsep van mededingendheid vergestalt die doelwit wat nagestreef moet word ten einde die ontluikende globale ekonomiese stryd aan te durf. As ’n belangrike drywer van ekonomiese welvaart is tegnologie een van die belangrikste sleutels tot internasionale mededingendheid. Tegnologiese innovasie is die proses wat as hefboom hiervoor gebruik moet word. Dit is egter nodig dat tegnologie, en spesifiek die proses van tegnologiese innovasie, formeel en gestruktureerd bestuur moet word, sowel op nasionale as firmavlak. Op nasionale vlak is die voorsiene Nasionale Innovasiestelsel beslis ’n stap in die regte rigting.

  17. Development of gold based solder candidates for flip chip assembly

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri


    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders for inte......Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  18. Method of defence of solder surface from oxidization

    Kurmashev Sh. D.


    Full Text Available Compositions are developed for defence of fusion solder from oxidization on the basis of mixture of glycerin, urea and powders of refractory oxides, carbides (Al2O3, TiO2, SIC, graphite. The offered compositions can be used for defence of fusion of solder from oxidization in the process of soludering and tinning of explorers, and also electric conclusions of elements of radio electronic apparatus by the method of immersion in stationary baths.

  19. Critical evaluations of lead-free solder alloys and performance comparisons

    Hitch, T.T.; Palit, K.; Prabhu, A.N. [David Sarnoff Research Center, Princeton, NJ (United States)


    This paper discusses the methodology for solder alloy selection, solder preparation processes, test selection, results, and conclusions. The conclusions from this phase of study were that: (1). Solders containing significant amounts of bismuth exhibit poor fatigue life. (2). The Sn-Ag-Cu alloy was the best solder we studied for use as a replacement for Sn-Pb eutectic. A second phase of the work involved detailed study of the Sn-Ag-Cu system with other additions to determine the optimum lead-free solder compositions in terms of melting point, solderability, and mechanical properties.

  20. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Liu Mei Lee; Ahmad Azmin Mohamad


    This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also disc...

  1. Microsurgical anastomosis of sperm duct by laser tissue soldering

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard


    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  2. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Mohammad Sadegh Nourbakhsh


    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  3. Creep properties of Pb-free solder joints

    Song, H.G.; Morris Jr., J.W.; Hua, F.


    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  4. Solderability perservative coatings: Electroless tin vs. organic azoles

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  5. Soldering in prosthodontics--an overview, part I.

    Byrne, Gerard


    The fit of fixed multiunit dental prostheses (FDP), traditionally termed fixed partial dentures (FPDs), is an ongoing problem. Poorly fitting restorations may hasten mechanical failure, due to abutment caries or screw failure. Soldering and welding play an important role in trying to overcome misfit of fixed multiunit prostheses. The term FPD will be used to denote multiunit fixed dental prostheses in this review. This is the first of a series of articles that review the state of the art and science of soldering and welding in relation to the fit of cemented or screw-retained multiunit prostheses. A comprehensive archive of background information and scientific findings is presented. Texts in dental materials and prosthodontics were reviewed. Scientific data were drawn from the numerous laboratory studies up to and including 2009. The background, theory, terminology, and working principles, along with the applied research, are presented. This first article focuses on soldering principles and dimensional accuracy in soldering. There is some discussion and suggestions for future research and development. Soldering may improve dimensional accuracy or reduce the distortion of multiunit fixed prostheses. Many variables can affect the outcome in soldering technique. Research science has developed some helpful guidelines. Research projects are disconnected and limited in scope. © 2011 by The American College of Prosthodontists.

  6. Soldering of Thin Film-Metallized Glass Substrates

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.


    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  7. Die rol van die blanke werker in die motivering van die swart werker

    G. J. Oosthuizen


    Full Text Available The motivation of the Black worker can not be studied in isolation since the White worker still holds many executive positions and therefore has an influence on the Black workers' motivation. The role of the White worker in motivating the Black worker in a specific organisation and the attitude and leadership approach of the White worker on the existence/nonexistence and relative satisfaction of the needs of Black workers are discussed.Opsomming Die motivering van die Swart werker kan nie in die huidige situasie in isolasie bestudeer word nie, omdat die Blanke werker steeds in die bestuursposisie is en daarom die motivering van die Swart werker kan beïnvloed. Hierdie ondersoek was daarop gerig om die rol van die Blanke werker in die motivering van die Swart werker nader te ondersoek. Die houding en die leierskapsbenadering van die Blanke werker teenoor die Swart werker is gemeet, asook die behoeftes wat volgens die Blanke werker by die Swart werker bestaan, bevredig is, of nie bestaan nie. Die behoeftes van Swart werkers, soos deur hulleself gesien, is ook ondersoek. Ten opsigte van sekere aspekte is beduidende verskille gevind.

  8. Die verbondeling in verband

    J. A.L. Taljaard


    Full Text Available Daar is dikwels en deur groot outoriteite al geskryf oor die mens in die samelewing. Hier wil ons egter die saak probeer aanraak uit ’n nuwe hoek, veral om die Skrifbeligting van die siening te benader. Vanselfsprekend verg hierdie benaming ’n skrifmatige mensbeskouing, maar ook ’n skrifmatige verbandsbeskouing. Die mens staan egter nie slegs in verhouding tot sy medemens nie maar ook in verhou­ ding tot stof, plant en dier. Boweal staan die mens in verhouding tot God, en hierdie verhouding is deurslaggewend vir al die ander verhoudinge waarin die mens hom bevind. Tog staan die mens ook in verhouding tot homself; wie kan die diepere roersele van die menslike siel peil, wie weet van die wroeginge, vreugde, leed en genot van die mens beter as hyself? Ook hierdie aspek verdien ons aandag. Op volledigheid kan nie aanspraak gemaak word nie, dit is ook nie my bedoeling nie. Die bedoeling is maar om die omvang van die tema aan te dui, die gedagtes te prikkel en veral om aan te spoor tot nuwe denkoriëntering waarin ook terminologies gebreek behoort te word met die neo-skolastiek binne reformatoriese lyn.

  9. Lead-free solder technology transfer from ASE Americas



    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  10. Wege in die Zukunft

    Kauermann, Göran; Mosler, Karl

    Die Zukunft stellt große Herausforderungen an die Arbeit der Deutschen Statistischen Gesellschaft. Sie betreffen die gestiegenen Anforderungen der Nutzer von Statistik, die Kommunikationsmöglichkeiten des Internets sowie die Dynamik der statistischen Wissenschaften und ihrer Anwendungsgebiete. Das Kapitel 5 beschreibt, wie sich die Gesellschaft diesen Herausforderungen stellt und welche Ziele sie sich in der wissenschaftlichen Zusammenarbeit und im Kampf gegen das Innumeratentum gesetzt hat.

  11. Die Gewalt der Frauen

    Angelika Ebrecht


    Full Text Available Anhand historischer Beispiele aus der Zeit der letzten Jahrhundertwende in Europa stellt die Autorin den Zusammenhang von Transgression, Aggression und Inversion dar. Gegen die gängige Auffassung, Gewalt sei männlich, setzt sie Selbst- und Fremdentwürfe von Frauen, die als Duellantinnen, Soldatinnen und Mörderinnen die gesellschaftlich festgelegten Grenzen der Gewalt verletzten. Sie interpretiert dies als Versuch, die Geschlechtergrenzen zu überschreiten und sich eine Subjektposition anzueignen.

  12. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian


    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  13. Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

    HUANG Chun-yue; WU Zhao-hua; HUANG Hong-yan; ZHOU De-jian


    The solder joint reliability of a 0. 5 mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25 mm× 0.35 mm, the stand-off of 0.02 mm and the solder volume of 0. 026 mm3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5 mm pitch QFP.

  14. Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate

    Chang, T.-C. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Wang, J.-W. [Department of Environmental and Safety Engineering, Chung Hwa College of Medical Technology, 89 Wen-Hwa 1st Street, Jen-Te, Tainan 71703, Taiwan (China); Wang, M.-C. [Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China)]. E-mail:; Hon, M.-H. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Da-Yeh University, 112 Shan Jean Road, Da-tsuen, Chang-hua, Taiwan (China)


    The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 deg. C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential of -1.09 V{sub SCE} and a current density of 9.90 x 10{sup -2} A/cm{sup 2}, shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 deg. C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 deg. C for 2.5 and 5 h, respectively.

  15. Materials on dies for pressure die casting

    E. Ragan


    Full Text Available In the contribution the stress of die materials of thermal fatigue is defi ned and material life is derived theoretically and compared with the measured values. The important properties of the die materials as thermal conductivity, coeffi cient of thermal expansivity, modulus of elasticity and mechanical properties are described. Binding to it single die materials as carbon steels and chrome-tungsten steels are analyzed. As the perspective die material for pressure die casting of ferrous metals appears molybdenum with regard to advantageous properties.

  16. Antiglobalisierung die Andere Globalisierung

    Ljiljana Croce


    Das Ziel der Arbeit ist, ein je größeres Interesse an diesem Thema zu erwecken und auf die Gefahren hinzuweisen, denen wir alle verlaufen, wie die Armen, sowie auch die Reichen und die kleine Gruppe der zum mittleren Stand gehörenden, die immer mehr in die offene Armut versinken. Es wäre zu viel, in einer Welt solcher Globalisierung, die soziale Empfi ndlichkeit der Menschen zueinander zu erwarten. In Wirklichkeit geht sie immer mehr verloren. Der Mensch als Einzelperson, sowie auch die Völke...

  17. Laser micromachining of through via interconnects in active die for 3-D multichip module

    Chu, D.; Miller, W.D.


    One method to increase density in integrated circuits (IC) is to stack die to create a 3-D multichip module (MCM). In the past, special post wafer processing was done to bring interconnects out to the edge of the die. The die were sawed, glued, and stacked. Special processing was done to create interconnects on the edge to provide for interconnects to each of the die. These processes require an IC type fabrication facility (fab) and special processing equipment. In contrast, we have developed packaging assembly methods to created vertical through vias in bond pads of active silicon die, isolate these vias, and metal fill these vias without the use of a special IC fab. These die with through vias can then be joined and stacked to create a 3-D MCM. Vertical through vias in active die are created by laser micromachining using a Nd:YAG laser. Besides the fundamental 1064 nm (infra-red) laser wavelength of a Nd:YAG laser, modifications to our Nd:YAG laser allowed us to generate the second harmonic 532 nm (green) laser wavelength and fourth harmonic 266nm (ultra violet) laser wavelength in laser micromachining for these vias. Experiments were conducted to determine the best laser wavelengths to use for laser micromachining of vertical through vias in order to minimize damage to the active die. Via isolation experiments were done in order to determine the best method in isolating the bond pads of the die. Die thinning techniques were developed to allow for die thickness as thin as 50 {mu}m. This would allow for high 3-D density when the die are stacked. A method was developed to metal fill the vias with solder using a wire bonder with solder wire.

  18. Verrekening van die kragveld van die verbond in die inkleding van die kommunikatiewe driehoeksverhouding tussen teks, hoorder en prediker


    In hierdie artikel word die kommunikatiewe driehoeksverhouding tussen die Bybelse teks, die hoorders en die prediker homileties verken. Die probleemstelling waarmee gewerk word handel oor potensiële versteurings wat kan plaasvind in hierdie driehoeksverhouding wanneer die hoorders en die prediker in hulle menslike beperktheid in verbinding gebring word met die ewige Woord van God soos dit in die Bybelse teks na vore kom. In die loop van die artikel word die volgende aspekte verken: ’n Ideale...

  19. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan


    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  20. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

    Fuquan LI; Chunqing WANG; Yanhong TIAN


    The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2and needle-like AuSn4 are formed at the interface after the liquid state reaction (soldering). The interfacial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface.The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

  1. Development of a new Pb-free solder: Sn-Ag-Cu

    Miller, C.M.


    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  2. A critical review of constitutive models for solders in electronic packaging

    Chen, Gang; Zhao, Xiaochen; Wu, Hao


    .... Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality...

  3. Microbial leaching of waste solder for recovery of metal.

    Hocheng, H; Hong, T; Jadhav, U


    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  4. Die voorspellingswaarde van die takseersentrum: 'n Oorsig

    H. J. Pietersen


    Full Text Available The assessment centre: a brief review of predictive value. Factors such as the rise of the professional manager, industrialization and worker expectations have, over the last few decades, increasingly placed managers in the limelight as a key occupational group. In this regard the assessment centre has become prominent as a method for the identification of managerial potential. However, a brief review of the relevant research literature indicates low predictive variances for the managerial assessment centre. This fact, together with the limited scope of the assessment centre, therefore necessitates, amongst other things, a wider research perspective which will include other work and non-work related factors as well. Opsomming Verskynsels soos die opkoms van die professionele bestuurder, industrialisering en stygende werkerverwagtinge het meegebring dat die kollig die afgelope paar dekades al hoe meer op bestuurders as sleutelberoepskategone geplaas is. In hierdie verband het veral die takseersentrum aandag gekry as 'n metode vir die identifisering van bestuurs- potensiaal 'n Kort oorsig van die betrokke navorsingsliteratuur toon egter lae voorspellingsvariansiesyfers vir die takseersentrum aan. Hierdie feit, tesame met die beperkte fokus van die takseersentrum, noodsaak, onder andere, 'n wyer navorsingsperspektief wat ook ander relevante werk- en nie-werkverwante faktore msluit.

  5. Flocculation of colloidal sols: Diffusion-controlled vs agitation-induced flocculation


    A proposal for carrying out flocculation experiments in microgravity is presented. These experiments might allow a correlation between theory and experiment. First, all particles, whether single primary particles or aggregates of primary particles would not settle or cream at any agitation rate, or even in the absence of agitation. This failure to separate would keep all aggregates active, still serving as centers for diffusion-controlled flocculation. Keeping all particles suspended would allow the possibility of determining the total number of particles as a function of time from beginning to end of flocculation. Finally, the experiments would allow a definite separation diffusion-controlled and agitation-induced flocculation by studying diffusion-controlled flocculation with and without agitation.

  6. Analysis of solderability test methods: predicition model generation for through-hole components

    Woods, Bobby


    peer-reviewed In order to achieve a reduction in solderability related defects on electronic components and Printed Circuit Board???s (PCB???s) in electronics manufacturing, preventive controls such as ???Dip & Look??? and ???Wetting Balance??? solderability testing need to be fully optimised to screen out all poor soldering components and PCB???s. Components and PCB???s that pass these tests should solder correctly in volume production. This thesis initially investigates the variations...

  7. Die ontwikkeling van die bestuursmotiveringsvraelys (BMV

    A. S. Engelbrecht


    Full Text Available The development of the Managerial Motivation Questionnaire (MMQ: Several criticisms of the psychometric suitability of existing measures of managerial motivation are reported in the literature. This study aimed at developing a new psychometrically sound instrument, the Managerial Motivation Questionnaire (MMQ. This was done on the basis of a comprehensive study of the literature on managerial motivation and the role-motivation theory. The preliminary MMQ was systematically shortened and refined until the final MMQ of 98 items was composed. This was based on social desirability and semantic appraisal, item analysis and factor analysis of the questionnaire. The results indicate that it was possible to develop a final MMQ that was relatively free of social desirability. It further demonstrated satsifactory internal consistencies on two samples (a = 0/90, N = 360; a = 0/91, N = 535, where all subscale items were found to be relatively pure measures of the isolated factors. Although some evidence was found providing support for the reliability of the MMQ, a need for further research on the construct validity of managerial motivation still exists. Opsomming In die literatuur word verskeie punte van kritiek teen die psigometriese geskiktheid van bestaande meetinstrumente van bestuursmotivering gerapporteer. Die doelstelling van hierdie studie was dus om aan die hand van die konseptuele omiyning van bestuursmotivering, en die rolmotiveringsteorie as algemene verwysingsraamwerk, 'n nuwe psigometries aanvaarbare meetinstrument, die Bestuursmotiveringsvraelys (BMV, te ontwikkel. Op grond van sosiale wenslikheids- en semantiese beoordeling, itemontleding en faktorontleding van die voorlopige BMV is die vraelys stelselmatig verkort en verfyn totdat die finale BMV van 98 items saamgestel is. Die resultate dui daarop dat hierdie studie wel daarin geslaag het om 'n finale BMV te ontwikkel wat relatief vry van sosiale wenslikheid is, bevredigende interne

  8. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Abdelhadi, Ousama Mohamed Omer

    , η-phase (Cu6Sn 5) and epsilon-phase (Cu3Sn), were found in almost all the cases regardless of the process parameters and size levels. The physics-based analytical model was successfully able to capture the governing mechanisms of IMC growth: chemical reaction controlled and diffusion-controlled. Examination of microstructures of solder joints of different sizes revealed the size of the solder joint has no effect on the type of IMCs formed during the process. Joint size, however, affected the thickness of IMC layers significantly. IMC layers formed in the solder joints of smaller sizes were found to be thicker than those in the solder joints of larger sizes. The growth rate constants and activation energies of Cu3Sn IMC layer were also reported and related to joint thickness. In an effort to optimize the EBSD imaging in the multi-layer configuration, an improved specimen preparation technique and optimum software parameters were determined. Nanoindentation results show that size effects play a major role on the mechanical properties of micro-scale solder joints. Smaller joints show higher Young's modulus, hardness, and yield strength and lower work hardening exponents comparing to thicker joints. To obtain the stress concentration factors in a multilayer specimen with IMC layer as bonding material, a four-point bending notched configuration was used. The analytical solutions developed for peeling and shear stresses in notched structure were used to evaluate the stresses at IMC interface layers. Results were in good agreement with the finite-element simulation. The values of interfacial stresses were utilized in obtaining fracture toughness of the IMC material. (Abstract shortened by UMI.)

  9. Methylene blue solder re-absorption in microvascular anastomoses

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.


    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  10. Reliability of lead-free solders in electronic packaging technology

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  11. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    Chidambaram, Vivek; Hald, John; Ambat, Rajan;


    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, co...

  12. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  13. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  14. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Nagy E.


    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  15. Experimental Methods in Reduced-gravity Soldering Research

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.


    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  16. Low-temperature solder for laser tissue welding

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.


    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55=70°C for tissue repair, which cause more irreversible thermal damage.

  17. Die sestienpersoonlikheidsfaktorvraelys as hulpmiddel by die takseersentrum

    J. C. D. Augustyn


    Full Text Available The 16PF Personality Test as an aid to the assessment centre Assessment centres still remains costly and thime consuming. This study investigates the reduction of time and costs by the use of the 16 PF Personality Test as a method for measuring management dimensions. Promising results were obtained with a relatively small sample for the prediction of initiative and perseverance. Significant multiple correlations were also found for three criteria of management success. Further research may establish the use of the 16 PF as an aid to management assessment and thereby reduce the costs and time involved in assessment centres. Opsomming Takseersentrums se grootste probleem is gelee in die koste en tyd wat dit behels. Hierdie studie ondersoek die moontlikheid om beide te verminder deur die aanwending van die 16 PF Persoonlikheidsvraelys vir die meting van bestuursdimensies. Belowende resultate is met 'n relatiewe klein steekproef bevind ten opsigte van die voorspelling van inisiatiefen deursettingsvermoe. Beduidende meervoudige korrelasies is ook ten opsigte van drie kriteria van bestuursukses bevind. Verdere navorsing kan die gebruik van die 16 PF as hulpmiddel by bestuursevaluering vestig en sodoende die tydsduur en koste van takseersentrums verminder.

  18. Creep characterization of solder bumps using nanoindentation

    Du, Yingjie; Liu, Xiao Hu; Fu, Boshen; Shaw, Thomas M.; Lu, Minhua; Wassick, Thomas A.; Bonilla, Griselda; Lu, Hongbing


    Current nanoindentation techniques for the measurement of creep properties are applicable to viscoplastic materials with negligible elastic deformations. A new technique for characterization of creep behavior is needed for situations where the elastic deformation plays a significant role. In this paper, the effect of elastic deformation on the determination of creep parameters using nanoindentation with a self-similar nanoindenter tip is evaluated using finite element analysis (FEA). It is found that the creep exponent measured from nanoindentation without taking into account of the contribution of elastic deformation tends to be higher than the actual value. An effective correction method is developed to consider the elastic deformation in the calculation of creep parameters. FEA shows that this method provides accurate creep exponent. The creep parameters, namely the creep exponent and activation energy, were measured for three types of reflowed solder bumps using the nanoindentation method. The measured parameters were verified using FEA. The results show that the new correction approach allows extraction of creep parameters with precision from nanoindentation data.


    norm aan die een kant en deur die S^^eeksnorm aan die ander." (ibid. 384). ...... grondslag, hoewel die groot aantal voorbeelde uit die werke van Thomas Mann ...... Mentrup, W., & P. Kuhn, (1980) "Deutsche Sprache in Osterreich und in der.

  20. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    Zhang, Xuan


    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  1. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.


    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  2. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Vianco, P.T.


    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  3. Horizon Shells and BMS-like Soldering Transformations

    Blau, Matthias


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like ...

  4. Development of alternatives to lead-bearing solders

    Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  5. Bosonisation and Duality Symmetry in the Soldering Formalism

    Banerjee, R


    We develop a technique that solders the dual aspects of some symmetry. Using this technique it is possible to combine two theories with such symmetries to yield a new effective theory. Some applications in two and three dimensional bosonisation are discussed. In particular, it is shown that two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. Similar features also hold for quantum electrodynamics in three dimensions. We also provide a systematic derivation of duality symmetric actions and show that the soldering mechanism leads to a master action which is duality invariant under a bigger set of symmetries than is usually envisaged. The concept of duality swapping is introduced and its implications are analysed. The example of electromagnetic duality is discussed in details.

  6. Corrosion Issues in Solder Joint Design and Service



    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  7. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V


    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  8. Die etiek van Luther

    J. H. van Wyk


    Full Text Available Dink ons aan die etiek van Luther dan spring onmiddellik ’n paar boeiende uitsprake van hom na vore soos o.a. dat Christene vanuit die gemeenskap met Christus nuwe dekaloë moet maak wat helderder as die van Moses kan wees, of dat ons in bepaalde sin vir ons naaste ’n Christus moet word. Die bydrae van Luther 'tot die Christelike etiek is sonder twyfel van groot betekenis en die bestudering daarvan die moeite werd. Luther is geprys as rewolusionêr en verguis as konserwatis, hy is geëer as iemand wat weer die ware be­tekenis van godsdiens ontdek het toe die lewe vervloei het in etiek. Of dit egter korrek is om sy etiek as konserwatief te tipeer, soos White doen, moet betwyfel word.

  9. Process characterization and control of hand-soldered printed wiring assemblies

    Cheray, D.L.; Mandl, R.G.


    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  10. The impact of process parameters on gold elimination from soldered connector assemblies



    Minimizing the likelihood of solder joint embrittlement in connectors is realized by reducing or eliminating retained Au plating and/or Au-Sn intermetallic compound formation from the assemblies. Gold removal is performed most effectively by using a double wicking process. When only a single wicking procedure can be used, a higher soldering temperature improves the process of Au removal from the connector surfaces and to a nominal extent, removal of Au-contaminated solder from the joint. A longer soldering time did not appear to offer any appreciable improvement toward removing the Au-contaminated solder from the joint. Because the wicking procedure was a manual process, it was operator dependent.

  11. Ambrosius en die virginitas

    C. J. Malan


    Full Text Available Ambrosius het met reg die benaming “Leraar van Maagdelikheid” ontvang (Dooley, 1948:119. Die opmerking van Thamin: “C’est une vertu proprement chrétienne que la vertu de virginité, proclame tout d’abord saint Ambroise” (1895:344, gee dadelik aanleiding tot die vraag of Ambrosius dan geen waardering vir die huwelik gehad het nie. Hierdie vraag word nog meer dringend as sy beskrywing van die kruis van die getroude lewe nagegaan word.

  12. A new active solder for joining electronic components



    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  13. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

    M. N. Harif


    Full Text Available Problem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique to increase the service life of future connections is not the total solution. A method must be developed for predicting the remaining service life of many joints already in use. Approach: The effect of High Temperature Storage (HTS on lead free solder joint material for ball grid array application using pull test method is studied in this study. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387, Sn2.3Ag0.08Ni0.01Co (SANC and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contains 8 balls. Results: The mean pull strength for high temperature storage is 2847.66, 2628.20 and 2613.79 g for Sn3.5Ag, SANC and SAC387, respectively. Thus, Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, Intermetallic Compound (IMC thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139, 2.3111 and 2.3931 µm. Conclusion/Recommendations: It was found that IMC thickness for SANC and Sn3

  14. Navorsing op die gebied van die sosiale wetenskappe*

    P. M. Robbertse


    Full Text Available In Hollands is die woord scientia vertaal met wetenskap, wat sowel die natuur- as die geesteswetenskappe insluit, waardeur die woordsy oorspronklike betekenis behou. Die neiging bestaan om die Engels science met wetenskap in Afrikaans te vertaal, waarmee dan eintlik die natuurwetenskap bedoel word.

  15. Foute in die meting van die aarde se magneetveld met die protonmagnetometer

    G. P. Hancke


    Full Text Available Die tipiese foute wat voorkom wanneer die metode van periode-meting gebruik word vir die bepaling van die presessiefrekwensie van die magnetiese moment van protone, word bespreek, en metodes om dit teen te werk word voorgestel. Belangrike gevolgtrekkings wat sal lei tot die optimale funksionering van die periodemeter, word gemaak — veral ten opsigte van die meettyd, polarisasietyd en die eienskappe van die sensorvloeistof.

  16. Wake up and Die

    Schubart, Rikke


    Anmeldelse af den colombianske gyserfilm Volver a morir (eng. titel Wake Up and Die) af Miguel Urrutia......Anmeldelse af den colombianske gyserfilm Volver a morir (eng. titel Wake Up and Die) af Miguel Urrutia...

  17. Die radio in Afrika

    S. de Villiers


    Full Text Available Omvang van radio-uitsendings in en na Afrika. — Redes vir die versnelde tempo van uitbreiding. — Radio as die geskikste massa-kommunikasiemiddel vir Afrika. — Faktore wat die verspreiding bemoeilik. — Skouspelagtige toename in luistertalle.Toe Plinius, wat in die jaar 79 oorlede is, in sy „Historia Naturalis” verklaar het dat daar altyd iets nuuts uit Afrika afkomstig is, kon hy nouliks voorsien het dat die „iets" negentien eeue later in die lug sou setel wat hierdie reuse-vasteland oorspan — ’n Babelse spraakverwarring en ’n ongekende, verbete woorde-oorlog in die etergolwe, onder meer daarop bereken om die harte en hoofde van derduisendes te verower.

  18. Setup Time Reduction On Solder Paste Printing Machine – A Case Study

    Rajesh Dhake


    Full Text Available Lean manufacturing envisages the reduction of the seven deadly wastes referred to as MUDA. Setup time forms a major component of the equipment downtime. It leads to lower machine utilization and restricts the output and product variety. This necessitates the requirement for quick setups. Single Minute Exchange of Die philosophy (a lean manufacturing tool here after referred as “SMED” is one of the important tool which aims at quick setups driving smaller lot sizes, lower production costs, improve productivity in terms of increased output, increased utilization of machine and labor hours, make additional capacity available (often at bottleneck resources, reduce scrap and rework, and increase flexibility[3]. This paper focuses on the application of Single Minute Exchange of Die[1] and Quick Changeover Philosophy[2] for reducing setup time on Solder Past Printing Machine (bottleneck machine in a electronic speedo-cluster manufacturing company. The four step SMED philosophy was adopted to effect reduction in setup time. The initial step was gathering information about the present setup times and its proportion to the total productive time. A detailed video based time study of setup activities was done to classify them into external and internal setup activities in terms of their need (i.e. preparation, replacement or adjustment, time taken and the way these could be reduced, simplified or eliminated. The improvements effected were of three categories viz., mechanical, procedural and organizational. The paper concludes by comparing the present and proposed (implemented methods of setup procedures.

  19. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    Choi, Sunglak


    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  20. Die verhouding doop en geloof

    L. Floor


    Full Text Available By die aanvalle wat op die kinderdoop geloods word, kom telkens die verhouding doop en geloof ter sprake. Die geloof is so wesentlik met die doop verbonde, sodat daar nie gedoop mag word waar die geloof nie aanwesig is nie. 0ns lees inderdaad dwarsdeur die Nuwe Testament van ’n innige samehang wat daar tussen geloof en doop beslaan.

  1. Die gebruik van parallelplaatreologie vir die bepaling van die intrinsieke viskositeit van poli-etileentereftalaat

    O. C. Vorster


    Full Text Available Die bepaling van die intrinsieke viskositeit van poli-etileentereftalaat word bemoeilik deur die feit dat daar tans slegs twee metodes in gebruik is. In die eerste metode word die bepaling deur middel van oplossingsviskometrie gedoen, maar die toksisiteit van die oplosmiddel, asook die tydperk wat dit neem om die bepaling te doen, is ’n probleem. Die tweede metode word beperk deur die kompleksiteit en beskikbaarheid van die apparatuur in Suid-Afrika. In hierdie studie word ’n alternatiewe metode, gebaseer op parallelplaatreologie, voorgestel wat albei hierdie probleme oorkom en die resultate sodoende verkry, word vergelyk met dié wat met bestaande metodes verkry is.

  2. Die invloed van die neo-marxistiese kultuuranalise op die Wêreldraad van Kerke en die Gereformeerde Kerke van Nederland

    J. M. Vorster


    Full Text Available Toe die studente dwarsoor die VSA en Europa in die laat sestigerjare ’n plotselinge en radikale verset openbaar het teen die bestaande orde, het hulle die deur geopen vir ’n nuwe mededinger om die hart van die Westerse kultuur. Dit is die nou reeds bekende neo-Marxisme. Sedertdien het hierdie jongeling sy voetspore op vele vlakke van die Westerse kultuur gelaat.

  3. High-temperature lead-free solder alternatives

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John


    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C a...

  4. Thermomechanical fatigue damage evolution in SAC solder joints

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.


    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  5. Porosity in collapsible Ball Grid Array solder joints

    Gonzalez, C.A. [Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering]|[Lawrence Berkeley National Lab., Berkeley, CA (United States). Materials Science Div.


    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  6. Fundamentals of wetting and spreading with emphasis on soldering

    Yost, F.G.


    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  7. Horizon shells and BMS-like soldering transformations

    Blau, Matthias; O'Loughlin, Martin


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  8. Thermomechanical fatigue damage evolution in SAC solder joints

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.


    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  9. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  10. Horizon shells and BMS-like soldering transformations

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  11. Recycling of lead solder dross, Generated from PCB manufacturing

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter


    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  12. Roles of interfacial reaction on mechanical properties of solder interfaces

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the

  13. Die lebensvision des semonides

    Milivoj Sironić


    Full Text Available Der Autor analysiert die Weibersatire des Semonides und andere seiner kurzen Fragmente. Dabei kommt er zu der Schlussfolgerung, dass sich die Verse der Satire durch eine gute Technik auszeich­ nen, dass aber auch eine unnötige Weitschweifigkeit nicht zu Ubersehen ist. Trotzdem kann man jedoch dem Dichter nicht die künstlerische Überzeugungskraft absprechen, wie auch die Ten­ denz nach Detailschilderungen und die Feinheit geistreicher Charakterisierungen. Die Aussage beinhaltet manchmal eine be­ stimmte innere Ironie in der Einfachheit der Wörter.In kurzen Fragmenten wird die Fähigkeit des Semonides sichtbar, sich sehr präzise auszudrücken. Seine ironisch-epische Sprache ist sehr reich  und verdient vom linguistischen Standpunkt aus Auf­ merksamkeit wegen ihres reichhaltigen lexischen und termino­ logischen Materials, insbesondere was die Bereiche der Tier­ welt und des Essens anbelangt.Die Weltanschauung des Dichters ist in dem ersten Fragment recht deutlich erkennbar. Da sieht man, dass er düster und pessimistisch auf das Leben blickt. Das Fehlen jeglicher positiven Einstellung hat dann den Sar­ kasmus zur Folge, mit dem der Dichter die Darstellung der Weiber einkleidet, ihn aber auch auf die Menschen schlechthin ausweitet.

  14. Verskuiwing in die moraal?

    S.P. van der Walt


    Full Text Available Modewoorde het ons deesdae oorgenoeg in die Christelike sedeleer en hulle kan nogal verwarring stig. U moet my vergun om met u te spreek oor een so ’n modewoord nl „verskuiwing’’ in die moraal. Dis nogal ’n mooi woord, wat so dikwels gebruik word op baie terreine en tog meer wil aandui as maar net ’n veranderde sienswyse, ’n wysiging in opvattinge of nuwe riglyne wat al gangbaar geword het in die praktyk. Die begrip wil eintlik die ewolusionêre gang beklemtoon, want dit is dan eintlik net die ou norme wat effens anders bekyk word of nie meer so nou geneem of dik onderstreep word nie. Die verskuiwing beteken dan dat alles nog dieselfde bly, net die posisie of plek het verander. Verskuiwing beteken tog plekverandering of plekwisseling en dan sekerlik nie in die sin dat die plekke ver uitmekaar lê nie. Verskuiwing beteken net maar vlak langs die vorige te staan kom. As dit dan ’n beter plek is, is dit ewolusie, ontwikkeling, verbetering.


    Y.H.Tian; C.Q.Wang


    Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.

  16. Diffusion-controlled spherulite growth in obsidian inferred from H2O concentration profiles

    Watkins, Jim; Watkins, Jim; Manga, Michael; Huber, Christian; Martin, Michael C.


    Spherulites are spherical clusters of radiating crystals that occur naturally in rhyolitic obsidian. The growth of spherulites requires diffusion and uptake of crystal forming components from the host rhyolite melt or glass, and rejection of non-crystal forming components from the crystallizing region. Water concentration profiles measured by synchrotron-source Fourier transform spectroscopy reveal that water is expelled into the surrounding matrix during spherulite growth, and that it diffuses outward ahead of the advancing crystalline front. We compare these profiles to models of water diffusion in rhyolite to estimate timescales for spherulite growth. Using a diffusion-controlled growth law, we find that spherulites can grow on the order of days to months at temperatures above the glass transition. The diffusion-controlled growth law also accounts for spherulite size distribution, spherulite growth below the glass transition, and why spherulitic glasses are not completely devitrified.

  17. Die karst-ekologie van die Bakwenagrot (Gauteng

    François Durand


    Full Text Available Die Bakwenagrot huisves ’n verskeidenheid organismes wat ’n ingewikkelde en verweefde voedselweb vorm. ’n Kolonie Natalse langvingervlermuise gebruik hierdie grot regdeur die jaar as blyplek. Die vlermuisguano en dooie plantmateriaal wat van buite in die grot inval, vorm die basis van die ekologie in die grot wat ook as ’n tipiese detritus-gedrewe ekostelsel beskryf kan word. Afbrekers soos bakterieë en swamme wat vir die afbraak van die guano en plantreste verantwoordelik is, word deur ’n verskeidenheid organismes, insluitend nematode en myte, as voedselbron benut. Hierdie organismes wat die volgende trofiese vlak vorm, word deur predatoriese artropode as voedselbron benut. Die Bakwenagrot is een van die weinige dolomietiese grotte in Suid-Afrika wat dit vir ‘n mens moontlik maak om tot by die grondwatervlak te kom. Die grondwater huisves verskeie tipes organismes waaronder bakterieë, swamme en diere – hoofsaaklik nematode en krustaseë. Die Bakwenagrot is ook die hoofvindplek waar varswater-amfipode in Suider-Afrika gevind is. Hierdie besondere en sensitiewe ekostelsel is hoofsaaklik van guano van die vlermuiskolonie afhanklik. Die grasveld in die gebied rondom die grot, wat as voedingsarea vir die vlermuiskolonie dien, word tans deur voorstedelike ontwikkeling en die gevolglike habitatfragmentasie en -vernietiging bedreig. Indien die vlermuise die grot sou verlaat, sal dit ’n hele domino-effek van uitsterwing van die grotbewonende organismes tot gevolg hê.

  18. Die voorgeskiedenis van kwantumberekening

    P. H. Potgieter


    Full Text Available

    Die hoofidees wat tans gestalte vind in die teorie en tegnologie van kwantumberekening is in die laat 1970’s en vroeg 1980’s deur fisici in die Weste en ’n wiskundige in die voormalige Sowjetunie neergelˆ e. Dat di´ e teorie ook wortels in die Russiestalige vakliteratuur het, is nie algemeen bekend in die Weste nie. Daar word kortliks gekyk na die idee soos deur Benioff en (veral Feynman in die Weste versprei, asook die voorstel van di´ e rekengrondslag deur Manin in die Russiese literatuur. Die outeur hoop om hiermee so ’n onpartydig moontlike sintese van die vroe ¨ e gedagtegeskiedenis rondom kwantumberekening aan te bied. Die rol van omkeerbare en onomkeerbare berekeningsprosesse word vlugtig bekyk soos dit verband hou met die ontstaan van kwantumberekening, asook die sogenaamde Inligtingsparadoks in die fisika. Die inligtingsteorie en die fisika het heelwat met mekaar te kommunikeer, soos hierdie paradoks uitwys.


    The pre-history of quantum computation

    The main ideas behind developments in the theory and technology of quantum computation were formulated in the late 1970s and early 1980s by two physicists in the West and a mathematician in the former Soviet Union. It is not generally known in the West that the subject has roots in the Russian technical literature. The idea, as propagated by Benioff and (especially Feynman, is reviewed along with the proposition of a foundation for this kind of computation by Manin in the Russian literature. The author hopes to present as impartial a synthesis as possible of the early history of thought on this subject. The role of reversible and irreversible computational processes will be examined briefly as it relates to the origins of quantum computing and the so-called Information Paradox in physics. Information theory and physics, as this paradox shows, have much to communicate to each other.

  19. Second-harmonic plasma response in diffusion-controlled surface-wave-sustained discharges

    Stoev, L.


    The formation of nonlinear plasma response at the second harmonic frequency in diffusion controlled surface-wave-sustained discharges is studied theoretically. The study is aimed at estimating theoretically the ratio of the squared amplitudes of the wave field of fundamental frequency and of the resulting - from the nonlinear effects - electric field at the second harmonic frequency. The model presented is intended for further use in discharge diagnostics.

  20. A Mathematical Model for Diffusion-Controlled Monolithic Matrix Coated with outer Membrane System


    A release model for diffusion-controlled monolithic matrix coated with outer membrane system is proposed and solved by using the refined double integral method. The calculated results are in satisfactory agreement with the experimental release data. The present model can be well used to describe the release process for all cd/cs values. In addition, the release effects of the monolithic matrix coated with outer membrane system are discussed theoretically.

  1. Diffusion Controlled Drug Release from Slurry Formed, Porous, Organic and Clay-derived Pellets

    Jämstorp Berg, Erik


    Coronary artery disease and chronic pain are serious health issues that cause severe discomfort and suffering in society today. Antithrombotic agents and highly potent analgesics play a critical role in improving the recovery process for patients being treated for these diseases. This thesis focuses on the design and study of pellet-based drug dosage forms which allow diffusion-controlled delivery of drugs with the aim of achieving optimal therapeutic outcomes. A wet slurry process was used t...

  2. Diffusion-Controlled Current at the Stationary Finite Disk Electrode. Theory.


    Journal of Electroanalytical Chemistry 19. KEY WORDS (Continue on rev’erse aid& If necessa~ry and idfentlify b block number) diffusion-controlled...Publication in the Journal of Electroanalytical Chemistry State University of New York at Buffalo Department of Chemistry Buffalo, New York October, 1980...Tokuda and G. P. Sat6, 25th Annual Meeting on Polarography and Electroanalytical Chemistry , Oct. 5th- 6th, 1979, Kobe. 10. G. P. Sato, M. Kakihana, H

  3. Diffusion Controlled Drug Release from Slurry Formed, Porous, Organic and Clay-derived Pellets

    Jämstorp Berg, Erik


    Coronary artery disease and chronic pain are serious health issues that cause severe discomfort and suffering in society today. Antithrombotic agents and highly potent analgesics play a critical role in improving the recovery process for patients being treated for these diseases. This thesis focuses on the design and study of pellet-based drug dosage forms which allow diffusion-controlled delivery of drugs with the aim of achieving optimal therapeutic outcomes. A wet slurry process was used t...


    Meng-ge Liu; Wei Yu; Chi-xing Zhou


    The kinetic model for diffusion-controlled intermolecular reaction of homogenous polymer under steady shear was theoretically studied. The classic formalism and the concept of conformation ellipsoids were integrated to get a new equation, which directly correlates the rate constant with shear rate. It was found that the rate constant is not monotonic with shear rate. The scale of rate constant is N-1.5 (N is the length of chains), which is in consistent with de Gennes's result.

  5. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu


    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  6. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu


    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  7. Die benutting van water in die landbou: strategie vir die toekoms

    D. S. van der Merwe


    Full Text Available ’n Uiteensetting word gegee van die faktore wat die hoofrol in die toekomstige waterbenutting in die landbou gaan speel. Hierdie faktore is die hoeveelheid water beskikbaar vir landboudoeleindes; die toenemende mineraiisasie van besproeiingswater; en die invloed wat energiebehoeftes op besproeiing sal hê. Navorsing is nodig om die situasie na wense te hanteer, en die aanbevelings van besproeiingsnavorsingswerksessies in hierdie verband word kortliks aangedui en bespreek.

  8. Energy Saving Melting and Revert Reduction Technology: Improved Die Casting Process to Preserve the Life of the Inserts

    David Schwam, PI; Xuejun Zhu, Sr. Research Associate


    lubricants and technical support. Experiments conducted with these lubricants demonstrated good protection of the substrate steel. Graphite and boron nitride used as benchmarks are capable of completely eliminating soldering and washout. However, because of cost and environmental considerations these materials are not widely used in industry. The best water-based die lubricants evaluated in this program were capable of providing similar protection from soldering and washout. In addition to improved part quality and higher production rates, improving die casting processes to preserve the life of the inserts will result in energy savings and a reduction in environmental wastes. Improving die life by means of optimized cooling line placement, baffles and bubblers in the die will allow for reduced die temperatures during processing, saving energy associated with production. The utilization of optimized die lubricants will also reduce heat requirements in addition to reducing waste associated with soldering and washout. This new technology was predicted to result in an average energy savings of 1.1 trillion BTU's/year over a 10 year period. Current (2012) annual energy saving estimates, based on commercial introduction in 2010, a market penetration of 70% by 2020 is 1.26 trillion BTU's/year. Along with these energy savings, reduction of scrap and improvement in casting yield will result in a reduction of the environmental emissions associated with the melting and pouring of the metal which will be saved as a result of this technology. The average annual estimate of CO2 reduction per year through 2020 is 0.025 Million Metric Tons of Carbon Equivalent (MM TCE).

  9. Energy Saving Melting and Revert Reduction Technology (E-SMARRT): Development of Surface Engineered Coating Systems for Aluminum Pressure Die Casting Dies: Towards a 'Smart' Die Coating

    Dr. John J. Moore; Dr. Jianliang Lin,


    The main objective of this research program was to design and develop an optimal coating system that extends die life by minimizing premature die failure. In high-pressure aluminum die-casting, the die, core pins and inserts must withstand severe processing conditions. Many of the dies and tools in the industry are being coated to improve wear-resistance and decrease down-time for maintenance. However, thermal fatigue in metal itself can still be a major problem, especially since it often leads to catastrophic failure (i.e. die breakage) as opposed to a wear-based failure (parts begin to go out of tolerance). Tooling costs remain the largest portion of production costs for many of these parts, so the ability prevent catastrophic failures would be transformative for the manufacturing industry.The technology offers energy savings through reduced energy use in the die casting process from several factors, including increased life of the tools and dies, reuse of the dies and die components, reduction/elimination of lubricants, and reduced machine down time, and reduction of Al solder sticking on the die. The use of the optimized die coating system will also reduce environmental wastes and scrap parts. Current (2012) annual energy saving estimates, based on initial dissemination to the casting industry in 2010 and market penetration of 80% by 2020, is 3.1 trillion BTU's/year. The average annual estimate of CO2 reduction per year through 2020 is 0.63 Million Metric Tons of Carbon Equivalent (MM TCE).

  10. Openbaring, teologie en die regswetenskap

    S. Postma


    Full Text Available In die jongste tyd is telkens en weer gewaarsku teen die gevare van oorspesialisasie en die hipertrofie van professionalisme. Die gemis aan ’n totaliteitsvisie wat hiermee gepaard gaan, word dan ook tereg teengegaan en wel deur aan die Wysbegeerte as die Wetenskap van die totaliteit van die kosmos in toenemende mate sy regmatige plek as wetenskapsintegreerder te gun. Hierdie grootmoedige gun van ’n plek in die son van geleerdheid kan egter ook uit bedenklike motiewe plaasvind. Die vakwetenskaplike kan nie of wil nie die plek en betekenis van sy spesifieke vak bepaal en bepeins nie en vind dit in elk geval moeilik om die verband tussen Gods Woord en sy besondere vak in duidelike perspektief te sien; vandaar dan ’n grootmoedige toelaat dat die wysbegeerte die „veritas” dien terwyl die eie ek tevrede is om die „utilitas” onderdanig te wees.

  11. Die tug oor ampsdraers tydens die doleansie van 1886

    J. Visser


    Full Text Available In art 29 van die Nederlandse Geloofsbelydenis word bely: “Die merktekens om die ware Kerk te ken is die volgende: As die Kerk die suiwere prediking van die evangelie uitoefen, as dit die suiwer bediening van die sakramente gebruik soos Christus dit ingestel het, as die kerklike tug gebruik word om die sondes te straf.” Dit spreek vanself dat wanneer ampsdraers, aan wie Christus sy kudde toevertrou het (Hand 20 : 28, met leer en /of lewenswandel in sonde volhard en nie daarin met tug gestuit word nie, word die ware kerk nie gebou nie maar afgebreek. 0ns sal later in hierdie artikel aantoon hoedanig die suiwer tug oor ampsdraers, veral leertug, tydens die Doleansie tot skade van die kerk van Christus agterweë gebly het.

  12. Environmentally friendly solders 3-4 beyond Pb-based systems

    GAO Yuan; LIU Peng; GUO Fu; XIA Zhidong; LEI Yongping; SHI Yaowu


    Based on environmental considerations, global economic pressures, enacted by legislations in several countries, have warranted the elimination of lead from solders used in electronic applications.Sn3.5Ag, SnAgCu, and Sn0.7Cu have emerged among various lead-free candidates as the most promising solder alloys to be utilized in microelectronic industries.However, with the vast development and miniaturization of modern electronic packaging, new requirements such as superior service capabilities have been posed on lead-free solders.In order to improve the comprehensive property of the solder alloys, two possible approaches were adopted in the current research and new materials developed were patented.One approach was involved with the addition of alloying elements to make new ternary or quaternary solder alloys.Proper addition of rare earth element such as La and Ce have rendered solder alloys with improved mechanical properties, especially creep rupture lives of their joints.Another approach, the composite approach, was developed mainly to improve the service temperature capability of the solder alloys.Composite solders fabricated by mechanically incorporating various reinforcement particles to the solder paste have again exhibited enhanced properties without altering the existing processing characteristics.The recent progress and research efforts carried out on lead-free solder materials in Beijing University of Technology were reported.The effects of rare earth addition on the microstructure, processing properties, and mechanical properties were presented.The behaviors of various Sn-3.5Ag based composite solders were also explicated in terms of the roles of reinforcement particles on intermetallic growth, steady-state creep rate, the onset of tertiary creep, as well as the overall creep deformation in the solder joints.Thermomechanical fatigue (TMF) behavior of the solder alloys and composite solders were investigated with different parameters such as ramp rate

  13. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint


    Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  14. The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

    CHENGuohai; MAJusheng


    The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shape of the loops will change less, and finally become a line along with the thermal cycle increase. The shear module decreases along with the thermal cycling process. But the creep index of the solder joints is not sensitive to the cycling process,which fluctuates between 5 and 7. Because the elements of the solder and matrix materials diffuse during the process, the voids induced in the solder joints expand. The expansion of the voids will lead to the crystal lattice aberrance of solder crystal.

  15. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

    Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak


    Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

  16. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A


    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  17. Die sterwende kindjie

    J.T. De Jongh van Arkel


    Full Text Available The thought of a child dying appears as an antithesis and thus the feelings evoked by the dying child are stronger than when older persons are dying. Around the child’s death bed there is no place for detached spectators and all become involved in caring for and supporting him. Caregivers also have a supporting responsibility towards the members of the child’s family.

  18. Ontsporing van die regstaatsbegrip en sy konsekwensies vir die afrikanervolk

    N. G.S. Van der Walt


    Full Text Available Die opvatting van die suiwere regstaat bring sy vraagstukke mee wanneer dit in verband gebring word met die leer van die soewereiniteit in eie kring. Laasgenoemde leer wortel in die geloof dat God die mens roep tot diens aan Hom, en dat die mens vry moet wees om ten opsigte van alle lewensaspekte God na die hoogste mate te kan dien. Hierdie verskeidenheid van aspekte is deur dr. A. Kuyper en sy volgelinge gesistemati- seer tot menslike verbande en lewenskringe, elk met ’n be- paalde sfeer waarin ander kringe nie mag inmeng nie. Elkeen is dan soewerein binne sy eie kring. Met verwysing na die staat is dan gespreek van die staatstaak as synde die hand- hawing van die reg, en omdat die staat in toenemende mate hom veral in die latere tyd ook besig gehou het met bedrywig- hede wat nouliks as van juridiese aard beskou kan word, is daar die onderskeid gemaak tussen die primêre en sekundêre taak van die staat. Die sistematiek van die wetsidee, deur prof. Dooyeweerd ontwikkel, waar die staat sy bestemmingsfunksie in die regsaspek vind, het vanselfsprekend geen plek vir so 'n dualistiese staatstaak nie, en die oplossing is deur sommige daarin gesoek om sulke staatsoptrede te vertolk as hebbende wel betrekking op die regsgemeenskap of die regsverkeer. Staatsondernemings soos paaie, spoorweë, spellingreëling, ens. word dan beskou as noodsaaklik vir die instandhouding van die regsgemeenskap en regsverkeer. Tereg wys A. M. Donner1 daarop dat so ’n vertolking eintlik neerkom op ’n oorspanning van die regsbegrip. Hy self sien dan die staatstaak in vrede- of orde-handhawing, wat in die eerste plaas wel regshandha- wing veronderstel. Onder orde word dan alles verstaan wat noodsaaklik is vir die gladde verkeer in die ontwikkelingsgang van die regsgemeenskap. Die wese van die staat het dan vol- gens hom te doen met reg, maar sy taak is meer as suiwere regshandhawing. Wat onrus verwek en die orde versteur, moet uit die openbare lewe verwyder word, en die

  19. Analise van die Tswanaraaisel

    S. A. Swanepoel


    Full Text Available ’n Strukturele, stilistiese en funksionele bcskrywing van die Twanaraaisel bring mee dat daar aan die volgende aspekte aandag gegee moet word: •\tWat is ’n raaisel en lioe word dit in Tswana genoem. •\tTot watter studiegebied en literere genre hoort die raaisel en watter subvorme kan vir Tswana onderskei word. •\tHoe sien die struktuur van Tswanaraaisels daar uit. •\tDeur wie, waar, wanneer en hoe word Tswanaraaisels voorgedra. •\tWatter stilistiese kenmcrke kan in Tswanaraaisels onderskei word. •\tWatter funksies vervul raaisels in ’n Tswanagcmeenskap.

  20. Effect of Drag Reducing Polymer and Suspended Solid on the Rate of Diffusion Controlled Corrosion in 90° Copper Elbow

    Fouad, Mohamed Ahmed; Zewail, Taghreed Mohamed; Amine, Nieven Kamal Abbes


    Rate of diffusion controlled corrosion in 90° Copper Elbow acidified dichromate has been investigated in relation to the following parameters: effect of solution velocity in the absence and presence of drag- reducing polymer on the rate of diffusion controlled corrosion, and effect of the presence of suspended solids on the rate of diffusion controlled corrosion. It was found that the presence of drag reducing polymer inhibited the rate of mass transfer, while the presence of suspended solid increased significantly the rate of mass transfer.

  1. Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

    Chriaštel'Ová, J.; Rízeková Trnková, L.; Pocisková Dimová, K.; Ožvold, M.


    Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed.


    Heinemann, D.; S. Knabner; Baumgarten, D.


    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. ...

  3. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti


    Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated...... with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  4. Die brein soos beskou deur die Grieke en Romeine

    Francois P. Retief


    Full Text Available In Ou Egipte is mummifikasie met uitgebreide reseksie of uitsnyding van organe geassosieer, maar geen kennis is geneem van die morfologie van die brein nie. Griekse skrywers van die sesde en vyfde eeue v.C. het die brein aanvanklik gesien as die setel van intelligensie, die orgaan van sensoriese waarneming en gedeeltelik die oorsprong van sperma. Pneuma het ’n belangrike rol in breinfunksie gespeel. Hippokrates was die eerste om die brein te beskryf as ’n dubbele orgaan, wat met harsingvlies (meninges bedek, funksioneel van pneuma afhanklik en vertolker van begrip is. Tydgenote soos Plato, Aristoteles en Diokles het tot die beskrywing bygedra, maar laasgenoemde twee het beweer dat die hart die middelpunt van intelligensie is en nie die brein nie. Gedurende die laaste helfte van die vierde eeu v.C. is disseksie van die menslike liggaam tydelik aan die mediese skool van Alexandrië toegelaat en het dit tot merkwaardige vooruitgang in die begrip van die menslike anatomie en fisiologie gelei. Herofilus en Erasistratus het uitstekende beskrywings van die struktuur en funksie van die brein gegee wat eers in die tweede eeu n.C. deur Galenus geëwenaar is.

  5. Prediking oor die poëtiese stof van die Ou Testament - Die Psalms

    E. J. Smit


    Full Text Available ’n Belangrike rede waarom die prediking uit die Psalms ’n aparte bespreking regverdig, is die feit dat die Psalms die omvangrykste verteenwoordiging van poetiese stof in die Ou Testament be vat. Dit is nie vir almal ewe maklik om poesie te lees en te verklaar nie.

  6. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    and mechanical properties of these potential candidate alloys with respect to the currently used high-lead content solders is made. Finally, the paper presents the superior characteristics as well as some drawbacks of these proposed high-temperature lead-free solder alternatives....... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  7. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu


    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  8. Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

    Hidaka, N.; Watanabe, H.; Yoshiba, M.


    We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

  9. Joining of Bi-2212 high- Tc superconductors and metals using indium solders

    Oh, S. Y.; Kim, H. R.; Jeong, Y. H.; Hyun, O. B.; Kim, C. J.


    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of AgxIny chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of AgxIny and CuxSny was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  10. Joining of Bi-2212 high-T{sub c} superconductors and metals using indium solders

    Oh, S.Y. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of); Kim, H.R.; Jeong, Y.H.; Hyun, O.B. [Superconductivity and Applications Group, Korea Electric Power Research Institute (KEPRI), Daejeon 305-380 (Korea, Republic of); Kim, C.J. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of)], E-mail:


    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of Ag{sub x}In{sub y} chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of Ag{sub x}In{sub y} and Cu{sub x}Sn{sub y} was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  11. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder



    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  12. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Saliza Azlina O.


    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  13. Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

    K. Arun Vasantha Geethan

    Full Text Available ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste, lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

  14. Die hebsugtige seekoei en Rooikappie: Die groteske in sprokies

    Dineke van der Walt


    Full Text Available Hierdie artikel bied ’n vergelykende lees van twee volksverhale wat ook as kinderverhale getipeer kan word (een vanuit Venda-folklore en die ander ’n populêre Europese narratief met die oog daarop om spesifieke ooreenkomste uit te lig – soos die eet van mensvleis, goedgelowige mense wat deur ‘n maskerspel om die bos gelei word en ander ‘onetiese’ en ‘immorele’ aktiwiteite. In Die hebsugtige seekoei boots die monster byvoorbeeld die stem van die jong seun na om sy suster te flous en toegang tot hulle hut te verkry, terwyl die wolf in Rooikappie op sy beurt die ouma flous om die huis te kan betree sodat hy later ook vir Rooikappie kan mislei. In albei stories word die jong meisies (asook Rooikappie se ouma deur ’n seekoei óf ’n wolf opgeëet. Soos gewoonlik in sprokies, word die slagoffers gered of ontsnap en die verhale het ’n gelukkige einde. Alhoewel dit absurd mag voorkom dat kinderverhale elemente van die groteske bevat, argumenteer ek dat dit inderdaad ’n bruikbare doel dien. Hierdie verhale betrek kinders nie net op ’n emosionele vlak nie (as gevolg van die skokwaarde van die groteske; die groteske dien ook as objek van fassinasie. Sodoende word die waarskuwingsboodskap in die verhale beter oorgedra en onthou deur die kinders.

  15. Die entwicklung, die metamorphose, die entstehung: Die konzepte des organismus von Aristoteles bis Darwin

    Kamerer Eva


    Full Text Available (nemački In diesem Aufsatz versuche ich, die Elemente verschiedener Konzepte des Organismus in der Philosophie und in der Wissenschaft zu analysieren. Die Deutungen des Organismus und der Einheit der Natur bei Aristoteles, Kant und Goethe werden als ein Beispiel der Bewegung von einem finalistischen zum antifinalistischen Bild der Natur verstanden.

  16. Die Gattung Oerstedia

    Stiasny-Wijnhoff, G.


    Die vorliegenden Individuen von Oerstedia dorsalis (Abildg.) wurden in den Helder an der holländischen Küste gesammelt; die Art war in frühern Jahren im Hafen sehr allgemein. Sie lebte zwischen Tubularien und Muschelbrut, welche in der Gezeitenzone den Schiffsrümpfen angewachsen sind und enthielt im

  17. Die Mollusken der Njalindungschichten

    Martin, K.


    Die Versteinerungen, welche im folgenden behandelt sind, sammelten meine Frau und ich im Jahre 1910 in den Preanger-Regentschappen von Java, in der Gegend von Njalindung ¹). Sie stammen aus Sedimenten, für welche ich den Namen Njalindungschichten einführte, und für die Gastropoden wurde bereits eine

  18. Correlation and contingency analysis of atom probe data: Diffusion-controlled dissolution of precipitates

    Camus, E. (Hahn-Meitner-Institut Berlin GmbH (Germany)); Abromeit, C. (Hahn-Meitner-Institut Berlin GmbH (Germany))


    A statistical analysis of atom probe data is developed for evaluating the evolution of local composition fluctuations in concentrated alloys. The model allows the calculation of theoretical correlation and contingency coefficients for a presumed alloy microstructure taking into account the instrumental parameters, i.e. aperture size, block size and detector efficiency. A comparison of theoretical coefficients with those obtained from measured concentration profiles gives access to physically relevant parameters. The analysis is applied to the diffusion-controlled dissolution of spherical precipitates in the technical alloy Nimonic PE16 under ion irradiation. (orig.)

  19. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.


    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  20. Die oorsake vir die ontstaan en besondere aard van die Zion Christian Church

    M. A. Kruger


    Full Text Available Aanvanklik het die Z.C.C. geen opsienbarende groei getoon nie, maar veral sedert die veertigerjare het hulle getalle skerp toegeneem en versprei oor die hele land. In 1963 is Edward Lekganyane toegelaat tot die Stofberg Teologiese Skool van die N.G. Kerk. Sedert die stigting van die Z.C.C. het die groep al verder van die Woord af weg beweeg, maar met hierdie toetrede tot die skool het daar by Edward self ’n mate van verandering gekom.

  1. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    Vianco, P.T.; Rejent, J.A. [Sandia National Labs., Albuquerque, NM (United States). Materials Joining Dept.


    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  2. Tweedetaalteorie vir die eerstetaalonderwyser

    Ludolph Botha


    Full Text Available In hierdie artikel word die eerstetaalonderwyser se aandag op tweedetaalteorie gevestig. Krashen se tweedetaalteorie word uitgesonder en die implikasies van sy werk vir eerstetaalonderwysersword ondersoek. Die oordrewe beklemtoning van vormen struktuur in moedertaalklasse ( oor die taal praatl lees/ skryf word vanuit die gesigspunt van Krashen se taalverwerwingsteorie beskou en die gevolgtrekking word gemaak dat daar veel meer klem op gebruiksvaardigheid behoort te val (in die taal praat!lees!skryf. In this article the first language teacher is made aware of second language teaching theory. Particularly Krashen' s second language theory is referred to and implications of his work for mother tongue teachers are discussed. The over-emphasis on form and structure in first language classes (talking/reading/writing about the language is looked at in terms of Krashen' s theory and it is concluded that the emphasis in first language classes should be far more on the functional use of the language (talking/reading/writing in the language.

  3. Implantation of algorithms of diffuse control in DSPS; Implantacion de algoritmos de control difuso en DSPS

    Perez C, B


    In this thesis work there are presented: a) The characteristics and main components used in an electronic system based on a Dsp guided to control applications of processes, b) The description of an algorithm of diffuse control whose objective is the regulation of neutron power in a model of the punctual kinetics of a nuclear research reactor type TRIGA, and c) The installation in language assembler and execution in real time of the control algorithm in the system based on a Dsp. With regard to the installation and execution of the algorithm, the reaches of the project have been delimited to the following: a) Readiness of the entrance values to the controller in specific registrations of the system Dsp, b) Conversion of the entrances to the numerical formats with those that one obtains the best acting in the control algorithm, c) Execution of the algorithm until the obtaining of the value of the controller's exit, and d) Placement of the result in specific registrations of the Dsp for their later reading for an external parallel interface. It is necessary to mention that the simulation of the punctual kinetics of a reactor type TRIGA in the Pc and its integration with the control system based on the one Dsp is had contemplated as continuation of this work and that one of those will constitute main activities in my project of master thesis. A brief description of the topics presented in this thesis is given next. In the chapter one it is presented a general description of the diffuse logic and some of their applications in the industry. The main characteristics of a Dsp are also presented that they make it different from a micro controller or a microprocessor of general purpose. In the chapter 2 details of the internal architecture of the Dsp TMS320CS0 of Texas Instruments that are not explained with detail in the manual of user of the same one. This chapter has as objective to understand the internal hardware of the Dsp that is used for to carry out the program

  4. Die kairos van die New Age: 'n Kultuurhistoriese skets

    the whole universe, manifesting the two aspects of spirit and matter, .... vestiging van die Christendom het hierdie leer uit die Westerse kultuur verdwyn tot- ... Hegel (1770-1831) het die Simboliste aangespreek (Mathews 1986:30-31, 33). Sy.

  5. Oor die einders van die bladsy as konseptuele kuns

    Rita M.C. Swanepoel


    Full Text Available Hierdie artikel bied ’n filosofies-besinnende oorsig oor konseptuele kuns. Ek argumenteer dat, soos wat die projek Oor die einders van die bladsy die grense van boekwees oorskry en konseptueel uitbrei, dit in geheel ’n konseptuele en taalgebaseerde kunsinstallasie is wat uit verskeie komponente, naamlik kunstenaarsboeke,bestaan. Hierdie saamgestelde konseptuele kunsinstallasie daag vanweë die interdissiplinêre aard daarvan, die grense van konseptuele kuns uit. Hierdie projek en uitstallings bevestig dat kunstenaarsboeke ’n ideale medium is om kunstenaars uit verskillende dissiplines by die spel met en ontdekking van die moontlikhede van die boek te betrek. Die projek kan in die geheel as konseptuele kuns getipeer word omdat die konsep boek herdink, herskep en oor gefilosofeer word.

  6. Die owerheidsinmenging met betrekking tot kerklike tughandelinge.

    L. Roeleveld


    Full Text Available Volgens art 29 NGB is die merktekens van die ware kerk die suiwere prediking van die Evangelie, die suiwere bediening van die Sakramente en die gebruik van die kerklike tug. Art. 32 NGB spreek uit dat die Kerkorde nie mag afwyk van wat Christus ingestel het nie. Menslike vindinge en wette om die gewetens te bind en te dwing, moet daarom verwerp word. Die ekskommunikasie of die ban moet toegepas word volgens die Woord van God.

  7. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

    Yu, Hao


    Continuous miniaturization of electronics devices as well as increasing complexity of soldering metallurgy introduce more and more challenges to the reliability of modern electronics products. Although loading condition plays an important role, the reliability of solder interconnections is ultimately controlled by microstructures' responses to loading. It is therefore of great importance to understand and control the microstructural evolutions of solder interconnections under different loadin...

  8. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu


    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  9. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Sorg, Brian S.; Welch, Ashley J.


    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  10. Active soft solder deposition by magnetron-sputter-ion-plating (MSIP)-PVD-process

    Lugscheider, E.; Bobzin, K.; Erdle, A


    In different technical areas micro electro mechanical systems (M.E.M.S.), e.g. micro pumps, micro sensors, actuators and micro dosage systems are in use today. The components of these M.E.M.S. consist of various materials, which have to be joined. To join materials like ceramics, plastics or metals to a hybrid M.E.M.S., established joining technologies have to be adjusted. For the assembling and mounting of temperature sensible micro components, a low temperature joining process, e.g. transient liquid phase (TLP) bonding or an active soft soldering process can be performed. In this article the deposition of a low melting active soft solder by magnetron-sputter (MS)-PVD deposition with an active substrate cooling will be presented. The substrate temperatures were set and controlled by an additional cooling unit, which was integrated into the sputtering facility. In the performed experiments a substrate temperature range from -40 to +20 deg. C was investigated. The effects of these different substrate temperatures to the microstructure and the soldering suitability of the solder system were investigated by scanning electron microscopy (SEM), nanoindentation and soldering tests. The chemical composition of the deposited solder systems was examined by glow discharge optical spectroscopy (GDOS)-analysis. As a suitable substrate temperature range for deposition -10 to -20 deg. C was detected. Solder systems deposited in this temperature range showed good solder abilities.

  11. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham


    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  12. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S


    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  13. Development of lead-free solders for high-temperature applications

    Chidambaram, Vivek

    -temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve...... as a valuable source of information to those interested in environmentally conscious electronic packaging....

  14. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  15. Development of a solder bump technique for contacting a three-dimensional multi electrode array

    Frieswijk, T.A.; Frieswijk, T.A.; Bielen, J.A.; Bielen, J.A.; Rutten, Wim; Bergveld, Piet


    The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers

  16. The automated system for technological process of spacecraft's waveguide paths soldering

    Tynchenko, V. S.; Murygin, A. V.; Emilova, O. A.; Bocharov, A. N.; Laptenok, V. D.


    The paper solves the problem of automated process control of space vehicles waveguide paths soldering by means of induction heating. The peculiarities of the induction soldering process are analyzed and necessity of information-control system automation is identified. The developed automated system makes the control of the product heating process, by varying the power supplied to the inductor, on the basis of information about the soldering zone temperature, and stabilizing the temperature in a narrow range above the melting point of the solder but below the melting point of the waveguide. This allows the soldering process automating to improve the quality of the waveguides and eliminate burn-troughs. The article shows a block diagram of a software system consisting of five modules, and describes the main algorithm of its work. Also there is a description of the waveguide paths automated soldering system operation, for explaining the basic functions and limitations of the system. The developed software allows setting of the measurement equipment, setting and changing parameters of the soldering process, as well as view graphs of temperatures recorded by the system. There is shown the results of experimental studies that prove high quality of soldering process control and the system applicability to the tasks of automation.

  17. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.


    We demonstrate magnetic nanoparticles (MNPs) in enabling lead-free solder reflow in RF fields and improved mechanical properties that impact solder joint reliability. Here, we report on Sn-Ag-Cu (SAC) alloys. SAC solder-FeCo MNP composites with 0, 1, 2, 3, and 4 wt. % FeCo MNP and the use of AC magnetic fields to achieve localized reflow. Electron microscopy of the as-reflowed samples show a decrease in the volume of Sn dendrite regions as well as smaller and more homogeneously dispersed Ag3Sn intermetallic compounds (IMCs) with increasing MNP concentrations. Mechanical properties of the composites were measured by nanoindentation. In pure solder samples and solder composites with 4 wt. % MNP, hardness values increased from 0.18 GPa to 0.20 GPa and the modulus increased from 39.22 GPa to 71.22 GPa. The stress exponent, reflecting creep resistance, increased from 12.85 of pure solder to 16.47 for solder composites with 4 wt. % MNP. Enhanced mechanical properties as compared with the as-prepared solder joints are explained in terms of grain boundary and dispersion strengthening resulting from the microstructural refinement.

  18. Intermetallic compound layer growth kinetics in non-lead bearing solders

    Vianco, P.T.; Kilgo, A.C.; Grant, R.


    The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thorough investigation of product manufacturability and reliability. Both of these attributes can be impacted by the excessive growth of intermetallic compound (IMC) layers at the solder/substrate interface. An extensive study has documented the stoichiometry and solid state growth kinetics of IMC layers formed between copper and the lead-free solders: 96.5Sn-3.5Ag (wt.%), 95Sn-5Sb, 100Sn, and 58Bi-42Sn. Aging temperatures were 70--205 C for the Sn-based solders and 55--120 C for the Bi-rich solder. Time periods were 1--400 days for all of the alloys. The Sn/Cu, Sn-Ag/Cu, and Sn-Sb/Cu IMC layers exhibited sub-layers of Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn; the latter composition was present only following prolonged aging times or higher temperatures. The total layer growth exhibited a time exponent of n = 0.5 at low temperatures and a value of n = 0.42 at higher temperatures in each of the solder/Cu systems. Similar growth kinetics were observed with the low temperature 58Bi-42Sn solder; however, a considerably more complex sub-layer structure was observed. The kinetic data will be discussed with respect to predicting IMC layer growth based upon solder composition.

  19. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao


    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  20. Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux


    The Indium Corporation of America has introduced WF-7742 Wave Solder Flux specifically designed to meet the process demands of Pb-Free manufacturing. WF-7742 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-holeelectronics assemblies.

  1. Assessment of circuit board surface finishes for electronic assembly with lead-free solders

    Ray, U.; Artaki, I.; Finley, D.W.; Wenger, G.M. [Bell Labs., Princeton, NJ (United States). Lucent Technologies; Pan, T.; Blair, H.D.; Nicholson, J.M. [Ford Motor Co., Dearborn, MI (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

  2. Wettability study of lead free solder paste and its effect towards multiple reflow

    Idris Siti Rabiatull Aisha


    Full Text Available Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.

  3. Electroplated solder alloys for flip chip interconnections

    Annala, P.; Kaitila, J.; Salonen, J.


    Flip chip mounting of bare dice is gaining widespread use in microelectronics packaging. The main drivers for this technology are high packaging density, improved performance at high frequency, low parasitic effects and potentially high reliability and low cost. Many companies have made significant efforts to develop a technology for bump processing, bare die testing and underfill encapsulation to gain the benefit of all potential advantages. We have focussed on low cost bumping of fully processed silicon wafers to develop a flexible scheme for various reflow requirements. The bumping process is based on galvanic plating from an alloy solution or, alternatively, from several elemental plating baths. Sputtered Mo/Cu or Cr/Cu is used as a wettable base for electroplating. Excess base metal is removed by using the bumps as an etching mask. Variation of the alloy composition or the layer structure, allows the adjustment of the bump reflow temperature for the specific requirements of the assembly. Using binary tin-lead and ternary tin-lead-bismuth alloys, reflow temperatures from 100 °C (bismuth rich alloys) to above 300 °C (lead rich alloys) can be covered. The influence of the plating current density on the final alloy composition has been established by ion beam analysis of the plated layers and a series of reflow experiments. To control the plating uniformity and the alloy composition, a new cup plating system has been built with a random flow pattern and continuous adjustment of the current density. A well-controlled reflow of the bumps has been achieved in hot glycerol up to the eutectic point of tin-lead alloys. For high temperature alloys, high molecular weight organic liquids have been used. A tensile pull strength of 20 g per bump and resistance of 5 mΩ per bump have been measured for typical eutectic tin-lead bumps of 100 μm in diameter.

  4. Die verband tussen die sielkundige kontrak en organisasieverbondenheid

    K. J. Stanz


    Full Text Available The relationship between the psychological contract and organisational commitment. The aim of this study is to design a measuring instrument with acceptable metric characteristics for the strength of the psychological contract within the South African context, and to determine empirically the relation between the strength of the psychological contract and organisational commitment. The Dhammanungune Model served as foundation for the design of the Strength of the Psychological Contract Questionnaire which consists of two scales namely, a needs expectation scale and a needs fulfilment expectation scale. The items of each scale have been formulated in the manner that ensures that the respondent reacts consecutively to two instructions namely, (a the level of the expectation and (b the importance of the expectation. This questionnaire was administered together with the Organisational Commitment Questionnaire to two population groups within the military environment. The Pearson Product Moment Correlation was calculated between the strength of the psychological contract and organisational commitment and the significance of the correlations was evaluated. Opsomming Die doel van die studie is om 'n meetinstrument met aanvaarbare metriese eienskappe vir die sterkte van die sielkundige kontrak vir Suid-Afrikaanse omstandighede te ontwerp en om empirics die verband tussen die sterkte van die sielkundige kontrak en organisasieverbondenheid te bepaal. Die sterkte van die sielkundige kontrak vraelys is op grond van die Dhammanungune-model ontwerp en het uit twee skale naamlik, die behoefteverwagting- en vervullingsverwagtingskale bestaan. Items vir eike skaal is sodanig geformuleer dat die respondent agteropeenvolgens op twee instruksies naamlik (a die vlak van die verwagting en (b die belangrikheid van die verwagting moet reageer. Die vraelys is saam met die organisasieverbondenheidsvraelys op twee populasies uit 'n militere omgewing toegepas. Die Pearson

  5. Die postpolitische Stadt

    Erik Swyngedouw


    Full Text Available Die Polis ist tot, es lebe die kreative Stadt! Während die Stadt, zumindest in Teilen des städtischen Raums, blüht und gedeiht, scheint die Polis im idealisierten griechischen Sinn dem Untergang geweiht; in diesem Verständnis ist sie der Ort der öffentlichen politischen Auseinandersetzung und demokratischen Unterhandlung und somit eine Stätte (oft radikaler Abweichung und Unstimmigkeit, an der die politische Subjektivierung buchstäblich ihren Platz hat. Diese Figur einer entpolitisierten (oder postpolitischen und postdemokratischen Stadt im Spätkapitalismus bildet das Leitmotiv des vorliegenden Beitrags. Ich lehne mich dabei an Jacques Rancière, Slavoj Žižek, Chantal Mouffe, Mustafa Dikeç, Alain Badiou und andere Kritiker jenes zynischen Radikalismus an, der dafür gesorgt hat, dass eine kritische Theorie und eine radikale politische Praxis ohnmächtig und unfruchtbar vor jenen entpolitisierenden Gesten stehen, die in der polizeilichen Ordnung des zeitgenössischen neoliberalen Spätkapitalismus als Stadtentwicklungspolitik [urban policy] und städtische Politik [urban politics] gelten. Ziel meiner Intervention ist es, das Politische wieder in den Mittelpunkt der zeitgenössischen Debatten über das Urbane zu stellen. [...

  6. Complex of automated equipment and technologies for waveguides soldering using induction heating

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Bocharov, A. N.


    The article deals with the problem of designing complex automated equipment for soldering waveguides based on induction heating technology. A theoretical analysis of the problem, allowing to form a model of the «inductor-waveguide» system and to carry out studies to determine the form of inducing wire, creating a narrow and concentrated heat zone in the area of the solder joint. Also solves the problem of the choice of the temperature control means, the information from which is used later to generate the effective management of induction soldering process. Designed hardware complex in conjunction with the developed software system is a system of automatic control, allowing to manage the process of induction heating, to prevent overheating and destruction of the soldered products, improve the stability of induction soldering process, to improve the quality of products, thereby reducing time and material costs for the production.

  7. Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

    Zeng, Kejun; Pierce, Mike; Miyazaki, Hiroshi; Holdford, Becky


    To obtain the desired performance of Pb-free packages in mechanical tests, while the solder composition should be carefully selected, the influence of metals dissolved from the soldering pad or under bump metallization (UBM) should also be taken into account. Dissolved metals such as Cu can alter the intermetallic compound (IMC) formation, not only at the local interface but also on the other side of the joint. The high rate of interfacial cracking of Sn-Ag-Cu solder joints on Ni/Au-plated pads is attributed to the high stiffness of the solder and the dual IMC structure of (Cu,Ni)6Sn5 on Ni3Sn4 at the interface. Approaches to avoid this dual IMC structure at the interface are discussed. A rule for selecting the solder alloy composition and the pad surface materials on both sides of the joints is proposed for ball grid array (BGA) packages.

  8. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon


    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  9. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Fan Yang


    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  10. Die Anima in Eschenbachs Parzival

    Kitunen, S. (Sakari)


    In meiner Pro-Gradu -Arbeit untersuche ich die Darstellung und Entwicklung des Jungschen Animabegriffes im Parzival von Wolfram von Eschenbach. Ich werde die in Parzival vorkommenden Charaktere als Anima- und Animus-Figuren analysieren und untersuchen, wie die Interaktion zwischen ihnen die Entwicklung des Helden beeinflusst. Viele Werke, die das Thema Frauen bzw. Weiblichkeit im Mittelalter behandeln, gehen oft davon aus, dass die Frauen in der mittelalterlichen Literatur als Objekte behande...

  11. Comparison and analysis of theoretical models for diffusion-controlled dissolution.

    Wang, Yanxing; Abrahamsson, Bertil; Lindfors, Lennart; Brasseur, James G


    Dissolution models require, at their core, an accurate diffusion model. The accuracy of the model for diffusion-dominated dissolution is particularly important with the trend toward micro- and nanoscale drug particles. Often such models are based on the concept of a "diffusion layer." Here a framework is developed for diffusion-dominated dissolution models, and we discuss the inadequacy of classical models that are based on an unphysical constant diffusion layer thickness assumption, or do not correctly modify dissolution rate due to "confinement effects": (1) the increase in bulk concentration from confinement of the dissolution process, (2) the modification of the flux model (the Sherwood number) by confinement. We derive the exact mathematical solution for a spherical particle in a confined fluid with impermeable boundaries. Using this solution, we analyze the accuracy of a time-dependent "infinite domain model" (IDM) and "quasi steady-state model" (QSM), both formally derived for infinite domains but which can be applied in approximate fashion to confined dissolution with proper adjustment of a concentration parameter. We show that dissolution rate is sensitive to the degree of confinement or, equivalently, to the total concentration C(tot). The most practical model, the QSM, is shown to be very accurate for most applications and, consequently, can be used with confidence in design-level dissolution models so long as confinement is accurately treated. The QSM predicts the ratio of diffusion layer thickness to particle radius (the Sherwood number) as a constant plus a correction that depends on the degree of confinement. The QSM also predicts that the time required for complete saturation or dissolution in diffusion-controlled dissolution experiments is singular (i.e., infinite) when total concentration equals the solubility. Using the QSM, we show that measured differences in dissolution rate in a diffusion-controlled dissolution experiment are a result of

  12. Die liefde wat die son beweeg en die ander sterre: Digterlike transendering – tot die vermenigvuldigde lewe ontroer

    A.S. (Rensia Robinson


    Full Text Available T.T. Cloete se oeuvre word onder andere gekenmerk deur fyn waarneming van ’n mistieke vervlegtheid in die skepping. Dit word op vele maniere ontgin en geïnterpreteer. Die poëtiese potensiaal van die vrou, in uiteenlopende gestaltes, is een van die sentrale temas waardeur die digter hieraan vorm gee. In die kunstige, bibliofiele uitgawe Uit die wit lig van my land gesny val die lig op die vrou se kreatiewe rol in die groter skepping wat haar onder andere identifiseer as haarveer vir digterlike insig en vormgewing. Vrou (alternatief Anna Perenna, universele moeder, is nie slegs draer van die lewenskiem wat tot gees transendeer nie, maar sy funksioneer as ligbron (’sonvrou’ wat selfs kosmiese insig verwesenlik. Dit raak meervoudige vorms en patrone waarin die mens ingeweef is in die universele hologram van lewe. Vir die digter is hierdie patroonvorming vergelykbaar met die maak van Persiese tapyte waarvan die patrone vasgelê is in die geheue van voorouers, en oorgedra word na opeenvolgende geslagte. In dié verkenning word digterlike transendering ontgin as ’n proses waarin die kleurvolheid van lewe en dood in en deur individuele sowel as universele vroulikheid geïnspireer word.

  13. Die liefde wat die son beweeg en die ander sterre: Digterlike transendering – tot die vermenigvuldigde lewe ontroer

    A.S. (Rensia Robinson


    Full Text Available T.T. Cloete se oeuvre word onder andere gekenmerk deur fyn waarneming van ’n mistieke vervlegtheid in die skepping. Dit word op vele maniere ontgin en geïnterpreteer. Die poëtiese potensiaal van die vrou, in uiteenlopende gestaltes, is een van die sentrale temas waardeur die digter hieraan vorm gee. In die kunstige, bibliofiele uitgawe Uit die wit lig van my land gesny val die lig op die vrou se kreatiewe rol in die groter skepping wat haar onder andere identifiseer as haarveer vir digterlike insig en vormgewing. Vrou (alternatief Anna Perenna, universele moeder, is nie slegs draer van die lewenskiem wat tot gees transendeer nie, maar sy funksioneer as ligbron (’sonvrou’ wat selfs kosmiese insig verwesenlik. Dit raak meervoudige vorms en patrone waarin die mens ingeweef is in die universele hologram van lewe. Vir die digter is hierdie patroonvorming vergelykbaar met die maak van Persiese tapyte waarvan die patrone vasgelê is in die geheue van voorouers, en oorgedra word na opeenvolgende geslagte. In dié verkenning word digterlike transendering ontgin as ’n proses waarin die kleurvolheid van lewe en dood in en deur individuele sowel as universele vroulikheid geïnspireer word.

  14. Study on Sn-Zn Solder Used in Cu-Al Soldering%用于铜铝焊接的锡锌焊料研究

    倪广春; 张浩; 韩敏


    Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.%电子产品无铅化的推广带动了无铅焊料技术的发展,考虑到成本因素,部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时,存在电化学腐蚀问题,因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆,存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题,提出了Sn一Zn一X多元合金焊接材料,并做了大量实验,取得很好的效果。

  15. Physical properties of lead free solders in liquid and solid state

    Mhiaoui, Souad


    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  16. Die histologie en ultrastruktuur van die hepatopankreas van die bloukurper Oreochromis mossambicus

    M. M. Nel


    Full Text Available Die histologie en ultrastruktuur van die hepatopankreas van die bloukurper Oreochromis mossambicus word beskryf. ’n Dun bindweefselkapsel omring die lewer. Die hepatosietrangskikking vertoon as lobules, met die koorde van hepatosiete wat vanaf ’n sentrale vene uitradieer en met mekaar anastomaseer. Indiwiduele lewerlohules vertoon nie duidelike grense nie, maar enkele duidelike triades word wel in die lewer van O. mossambicus aangetref. Die hepatosiete bevat ’n enkele ronde kern met ’n duidelike nukleolus en die growwe endoplasmiese retikula kom in twee of meer rye om die kerne en teen die selgrense van die hepatosiete voor. Die ander sitoplasmiese organelle kom verspreid in die hepatosietsitoplasma voor. Die eksokriene pankreasselle is om die portale venes gesetel. Die kerne van hierdie selle is rond en is hasaal in die kubies- tot silindervormige selle gelee. ’n Goedontwikkelde growwe endoplasmiese retikulum — vesikulêr, tubulêr en sirkulêr in vorm — en sektretoriese granules wat apikaal in die sel gelee is, kom voor.

  17. Fracture-mechanical analysis of metal/ceramic composites for applications in high-temperature fuel cells (SOFC); Bruchmechanische Untersuchung von Metall/Keramik-Verbunsystemen fuer die Anwendung in der Hochtemperaturbrennstoffzelle (SOFC)

    Kuhn, Bernd Josef


    The author investigated the deformation and damage behaviour of soldered ceramic/metal joints in SOFC stacks, using thermochemical methods. Methods for analyzing sandwich systems and for mechanical characterization of joints were adapted and modified in order to provide fundamental understanding of the mechanical properties of soldered joints. [German] In dieser Arbeit wurde das Verformungs- und Schaedigungsverhalten von Keramik/ Metall-Loetverbindungen fuer SOFC-Stacks thermomechanisch untersucht. Verfahren zur Analyse von Schichtsystemen und fuer die mechanische Charakterisierung von Fuegeverbindungen wurden adaptiert und weiterentwickelt, um zu einem grundlegenden Verstaendnis der mechanischen Eigenschaften von Loetverbindungen zu gelangen.


    Emir Zafer HOŞGÜN


    Full Text Available In this study, Flaxseed oil was extracted by Supercritical Carbondioxide Extraction, and extractionkinetics was modelled using diffusion controlled method.The effect of process parameters, such as pressure (20, 35, 55 MPa, temperature (323 and 343 K, and CO2 flow rate (1 and 3 L CO2 /min on the extraction yield and effective diffusivity (De was investigated. The effective diffusion coefficient varied between 2.4 x10-12 and 10.8 x10-12 m2s-1 for the entire range of experiments and increased with the pressure and flow rate. The model fitted well theexperimental data (ADD varied between 2.35 and 7.48%.

  19. Axisymmetric vortex method for low-Mach number, diffusion-controlled combustion

    Lakkis, I


    A grid-free, Lagrangian method for the accurate simulation of low-Mach number, variable-density, diffusion-controlled reacting flow is presented. A fast-chemistry model in which the conversion rate of reactants to products is limited by the local mixing rate is assumed in order to reduce the combustion problem to the solution of a convection-diffusion-generation equation with volumetric expansion and vorticity generation at the reaction fronts. The solutions of the continuity and vorticity equations, and the equations governing the transport of species and energy, are obtained using a formulation in which particles transport conserved quantities by convection and diffusion. The dynamic impact of exothermic combustion is captured through accurate integration of source terms in the vorticity transport equations at the location of the particles, and the extra velocity field associated with volumetric expansion at low Mach number computed to enforced mass conservation. The formulation is obtained for an axisymmet...

  20. Diffusion-controlled startup of a gas-loaded liquid-metal heat pipe

    Ponnappan, R.; Boehman, L. I.; Mahefkey, E. T.


    Liquid-metal heat pipes have exhibited difficulties starting up from a frozen-state. Inert gas loading is a possible solution to the frozen-state startup problem. The present study deals with the diffusion-controlled startup analysis and testing of an argon-loaded, 2-m-long, stainless steel-sodium heat pipe of the double-walled type with artery channel and long adiabatic section. A two-dimensional, quasi-steady state, binary vapor-gas diffusion model determined the energy transport rate of vapor at the diffusion front. The analytical solution to the diffusion problem provided the vapor flux, which in turn was used in the one-dimensional transient thermal model of the heat pipe to predict the time rate-of-change of temperature and position of the hot front. The experimental test results successfully demonstrated the startup of a gas-loaded sodium heat pipe and validated the diffusion model of the startup.

  1. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    Kostandyan, Erik; Sørensen, John Dalsgaard


    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  2. Pb-free Sn-Ag-Cu ternary eutectic solder

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.


    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  3. Diskussie oor die millenium en die herstel van Israel

    J. J. Engelbrecht van Waverley


    Full Text Available Dit verheug my dat daar eindelik gereageer word op my boekie. Behalwe telefoonoproepe en briewe van medechiliaste was daar tot dusver geen kommentaar van anti-chiliastiese kant. Ek het die boekie aan ongeveer 1800 predikante en professore gestuur en vriendelik uitgenooi tot nuwe besinning. Net soos oor die soteriologie, is die Bybel nêrens in teëspraak met homself oor die eskatologie nie. God gee in sy Woord nie vir ons drie verskillende toekomsbeelde om uit te kies nie. God is een en sy profetiese Woord is deurgaans eenstemmig m.b.t. die raad van God oor Israel, die nasies en die kerk.

  4. Die kerk en die kommunisme, uitgangspunt en perspektief

    A. H. Murray


    Full Text Available Waar ons onmiddellike opdrag is om die konkrete taak van die kerk in die bestryding van Kommunisme en Marxisme te beskrywe, is ons gedwing om terug te dink aan die eerste grondslae van die vyandelike aanslag — die grondslae waarop sy leer en sy beleid van gewelddadige optrede berus. Want ons het nie te doen met ’n opportunistiese onderneming of ’n imperialistiese waagstuk as dit oor die Kommunisme gaan nie, en ook nie met die blinde opbruising van laere en agterlike volksklasse nie, maar wel met ’n deurdagte en afgeronde heelal-filosofie wat oor die aardbol versprei is en wat op sistematiese wyse en met wetenskaplike strategie ’n aanval op die bestaande Christelike orde maak.

  5. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    Easton, John W.; Struk, Peter M.; Rotella, Anthony


    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  6. Die Psychosen bei Epilepsie

    Glauninger G


    Full Text Available In einer Übersicht werden die verschiedenen Formen psychotischer Zustandsbilder bei Epilepsiepatienten, deren Ätiopathogenese und Möglichkeiten der Behandlung dieser Störungen beschrieben. Risikofaktoren finden sich durch neurobiologische Gegebenheiten - besonders bei Mitbeteiligung des Temporallappens, durch psychosoziale Einflüsse und manchmal auch durch medikamentöse Behandlung. Anhand von Fallbeispielen sollen dem Leser typische Krankheitsverläufe von psychotischen Episoden bei Epilepsiepatienten, die zumeist erst bei einer schon länger dauernden Epilepsie auftreten, nähergebracht werden. Es wird deutlich, daß sich die Beschwerden von Patienten mit Epilepsie nicht auf iktale Phänomene beschränken. Bei der Behandlung dieser Patienten kommt einer guten interdisziplinären Zusammenarbeit besondere Bedeutung zu.

  7. Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates

    Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A.


    OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.

  8. Wêreldgebeure gedurende die jaar 1954.

    S. du Toit


    Full Text Available Die jaar 1954 het begin sonder Stalin, die magtigste diktator van die modeme tyd, en dit wa s nog onseker hoe die nuwe regime sou optree.Teen die einde van die ja a r weet ons nou dat hulle oënskynlik meer toeskietlik is maar in wese nog net so geheimsinnig en nog net so geslepe. Die Petrof-gesjriedenis in Australië het weereens laat blyk dat daar oordie hele aarde ’n netwerk van spioene is.

  9. Detection of micro solder balls using active thermography and probabilistic neural network

    He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning


    Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

  10. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S


    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

  11. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    Tribula, D.


    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  12. Evaluation of Scattered Wave and Stress Concentration Field in a Damaged Solder Joint

    Dineva, P.; Gross, D.; Rangelov, T.


    Two different, but equally important problems for solder joint reliability are solved. The evaluation of the dynamic stress concentration field in the thin base layer of a damaged solder joint is the first one. It is considered as a rectangular plate with a central macro-crack surrounded with randomly distributed micro-cracks, subjected to uniform time-harmonic tension. The damaged solder joint state is described by the model of Gross and Zhang [1] (International Journal of Solids and Structures29, 1763-1779). The information of the stress concentration field in a damaged solder joint is important to understand the mechanisms in the base components of all electronic packages.The second problem is ultrasonic wave scattering in a solder joint damaged by micro-cracks, considered as a two-dimensional finite multi-layered system. The solution of this problem may aid the creation of the modern non-destructive evaluation method (NDEM) for a high quality control of products in electronic industry.The method of the solution of both boundary-value problems is a direct BIEM (boundary integral equation method). The numerical results obtained for a solder joint with real geometry and physical properties show how the acoustic and stress concentration fields depend on the solder joint damage state. The character of this dependence is discussed.

  13. Die voorspelling van akademiese prestasie na die eerste universiteitsjaar

    G. K. Huysamen


    Full Text Available The prediction of academic performance after the first year at university. In agreement with findings elsewhere, the correlations of high school performance (Swedish Formula Point and the verbal and nonverbal GSAT scores with the mean percentage marks (MPMs gradually decreased from the first through sixth semester at university, whereas the decrease in the corresponding correlations with the cumulative mean percentage marks (CMPMs was less pronounced. The later the semester for which either an MPM or a CMPM was used as a predictor, the higher the latter tended to correlate with the MPMs of subsequent semesters but these correlations also decreased in size over the ensuing semesters. The best predictor of the MPM of any given semester was either the MPM of the immediately preceding semester or the CMPM of all the preceding semesters. Opsomming In ooreenstemming met bevindings elders, het die korrelasies van hoërskoolprestasie (Sweedse Formulepunt en verbale en nie-verbale ASAT-tellings met die gemiddelde persentasiepunte (GPP's geleidelik van die eerste tot die sesde semester op Universiteit afgeneem, terwyl die afname in die ooreenstemmende korrelasies met die kumulatiewe gemiddelde persentasiepunte (KGP's minder opvallend was. Hoe later die semester waarvan die GGP of KGP as voorspeller gebruik is, hoe hoër was dit geneig om met die GGP's van die daaropvolgende semesters te korreleer, maar die korrelasies het: eweneens met die toename in laasgenoemde semesters in grootte afgeneem. Die beste voorspeller van die GPP van enige gegewe semester was of die GPP van die pas afgelope semester, of die KGP van al die voorafgaande semesters.

  14. Wettability Studies of Pb-Free Soldering Materials

    Moser, Z.; Gąsior, W.; Pstruś, J.; Dębski, A.


    For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

  15. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent


    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  16. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)


    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  17. Die Kunst des Scheiterns

    Juul, Jesper


    Menschen haben von Kindesbeinen an das Verlangen, Erfolge zu erzielen und Kompetenz zu erreichen. Computerspieler entscheiden sich jedoch fortlaufend für eine Aktivität, die oft und wiederholt zum Verlieren führen muss und ein taubes Gefühl der Unfähigkeit erzeugt. Im Kino, im Theatersaal und bei...

  18. Die skool en die onderwyser as faktore in die geestesgesondheid van die kind*

    B. C. Schutte


    Full Text Available Ons hou geestesgesondheidsweke, stig beroepsentrums, samel geld in om mense wat geestelik siek is te genees, klae oor die tekort aan psigiaters, kliniese sielkundiges, bedryfsielkundiges, voorligters, skoolpsigoloë,ens. ’n Karige kwarteeu gelede het ons aan al hierdie dinge slegs akademiese aandag gewy. In hierdie kursus wordverskeie tipes kinders bespreek en geleer hoe om hulle probleme te benader.

  19. Die Kunst des Scheiterns

    Juul, Jesper


    Menschen haben von Kindesbeinen an das Verlangen, Erfolge zu erzielen und Kompetenz zu erreichen. Computerspieler entscheiden sich jedoch fortlaufend für eine Aktivität, die oft und wiederholt zum Verlieren führen muss und ein taubes Gefühl der Unfähigkeit erzeugt. Im Kino, im Theatersaal und bei...

  20. Die Creol Taal

    Rossem, van Cefas; Voort, van der Hein


    Negerhollands is the original creole language, lexically closely related to Dutch, of the Virgin Islands. It emerged as a separate language around 1700 and died out completely only a few years ago, having gradually been replaced by English in the course of the nineteenth century. Apart from giving i

  1. Die andere Revolution

    Kippenhahn, Rudolf


    War Kopernikus der größte Revolutionär des naturwissenschaftlichen Weltbildes? Seine Erkenntnisse waren der Beginn eines jahrhundertelangen Denkprozesses, welcher zur Einsicht führte, dass im Weltall die gleichen physikalischen Gesetze gelten wie auf der Erde.

  2. Die Kosmologie der Griechen.

    Mittelstraß, J.

    Contents: 1. Mythische Eier. 2. Thales-Welten. 3. "Alles ist voller Götter". 4. Griechische Astronomie. 5. "Rettung der Phänomene". 6. Aristotelische Kosmololgie. 7. Aristoteles-Welt und Platon-Welt. 8. Noch einmal: die Göttlichkeit der Welt. 9. Griechischer Idealismus.

  3. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe


    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  4. Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method


    Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (α), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

  5. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe


    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  6. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Xiuyun Zhou


    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  7. Effect of constraint on crack propagation behavior in BGA soldered joints

    王莉; 王国忠; 方洪渊; 钱乙余


    The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near-tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.

  8. Observations of microstructural coarsening in micro flip-chip solder joints

    Barney, Monica M.; Morris, J. W.


    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  9. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B


    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  10. A cause of the non-solderability of ceramic capacitor terminations

    Cozzolino, M. J.; Kumar, A.; Ewell, G. J.


    The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

  11. Wettability study of lead free solder paste and its effect towards multiple reflow

    Idris Siti Rabiatull Aisha; Zuleikha Siti; Abd Malek Zetty Akhtar


    Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solde...

  12. Die ontwikkeling van 'n instrument vir die meting van die konstruk sielkundige diepte-orientasie

    L. C. De Jager


    Full Text Available The development of an instrument (the RD-Depth Questionnaire, Form B for measuring the construct psychological depth orientation is discussed. Results show that the questionnaire has satisfactory internal consistency and that the items of the questionnaire in general measure the same characteristic. Further research is needed to refine and improve the questionnaire until it meets all the psychometric requirements of a good measuring instrument.OpsommingDie ontwikkeling van 'n instrument (die RD-Diepte Vraelys, Vorm B vir die meting van die konstruk sielkundige diepteoriëntasie word bespreek. Resultate dui daarop dat die vraelys bevredigende interne bestendigheid toon en dat die items van die vraelys oor die algemeen dieselfde eienskap meet. Verdere navorsing word egter nog vereis om die vraelys te verfyn en te verbeter sodat dit aan al die psigometriese vereistes van 'n goeie meetinstrument sal voldoen.

  13. Improvement of die life in high speed injection die casting

    Yasuhiro Arisuda; Akihito Hasuno; Junji Yoshida; Kazunari Tanii


    High-speed injection die casting is an efficient manufacturing technology for upgrading aluminum die-cast products. However, deficiencies (such as die damage in eady period) due to larger load on the molding die compared with conventional technology have brought new challenges. In this study, the cause of damage generated in super high-speed injection was investigated by the combination of experimental observation of the dies and CAE simulation (e.g. die temperature analysis, flow analysis and thermal stress analysis). The potential countermeasures to solve the above problems were also proposed.

  14. Improvement of die life in high speed injection die casting

    Akihito Hasuno


    Full Text Available High-speed injection die casting is an effi cient manufacturing technology for upgrading aluminum die-cast products. However, defi ciencies (such as die damage in early period due to larger load on the molding die compared with conventional technology have brought new challenges. In this study, the cause of damage generated in super high-speed injection was investigated by the combination of experimental observation of the dies and CAE simulation (e.g. die emperature analysis, fl ow analysis and thermal stress analysis. The potential countermeasures to solve the above problems were also proposed.

  15. Die Wiege stand doch in Africka


    Kaum ein Forschungsgebiet ist so umstritten wie die Palaeoanthropologie, die Lehre yore Ursprung der Menschheit. Nicht nur die Vorgeschichte, ouch die unmittelbare Entstebung des Homo sapiens entzweit die Experten: Die einen verrnuten die Wiege in Afrika,die anderen gehen davon aus, dass sich tier moderne Mensch auf mehreren Kontinenten gleichzeifig aus Vorfahren eatwickelte,

  16. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    Koo, Ja-Myeong


    Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

  17. Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

    Lai, Yi-Shao; Chiu, Ying-Ta; Chen, Jiunn


    The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated ˜62 μm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average current densities in solder joints and ambient temperatures were considered: 10 kA/cm2 at 150°C, 10 kA/cm2 at 160°C, and 15 kA/cm2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional solder joint with a thin-film-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed in (Cu,Ni)6Sn5 or Cu6Sn5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the ~52- μm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of ~80% Cu-Ni-Sn IMC and ~20% Sn-rich phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder joint.

  18. Die Tambaniprojek: ’n rekenaaranimasie van Die hebsugtige seekoei

    Rita M.C. Swanepoel


    Full Text Available Hierdie artikel bied ’n ondersoek na en refleksie op die tegnieke en die produksieprosesse wat gebruik is in die omskakeling van ’n tradisionele Ngano-Venda-volksverhaal, Die hebsugtige seekoei, vanaf borduurwerk in ’n digitale animasiefilm. Die artikel word gerig deur ’n metode wat afgelei is uit ’n praktykgebaseerde navorsingsmodel vir skeppende uitsette. Hierdie navorsingsmodel omskryf wyses waarvolgens skeppende uitsette as geldige navorsingsopsies gereken kan word. Die metode bestaan uit die dokumentering van en refleksie ten opsigte van die projek in drie fases, naamlik pre-produksie, produksie en post-produksie. Die Tambani-borduurwerkprojek is ’n gemeenskapsuitreikingsinisiatief wat deur Ina le Roux van stapel laat loop is. Ngano is die versamelwoord vir tradisionele Vendavolksverhale. In hierdie artikel argumenteer ons dat rekenaaranimasietegnieke wel suksesvol geïmplementeer word in die digitale omskakeling van ’n Venda-volksverhaal wat oorspronklik uit ’n mondelinge tradisie stam. Ons demonstreer hierdie argument aan die hand van Christiaan van der Westhuizen se omskakeling van Die hebsugtige seekoei in ’n rekenaaranimasie.

  19. Developing a reference material for diffusion-controlled formaldehyde emissions testing.

    Liu, Zhe; Liu, Xiaoyu; Zhao, Xiaomin; Cox, Steven S; Little, John C


    Formaldehyde, a known human carcinogen and mucous membrane irritant, is emitted from a variety of building materials and indoor furnishings. The drive to improve building energy efficiency by decreasing ventilation rates increases the need to better understand emissions from indoor products and to identify and develop lower emitting materials. To help meet this need, formaldehyde emissions from indoor materials are typically measured using environmental chambers. However, chamber testing results are frequently inconsistent and provide little insight into the mechanisms governing emissions. This research addresses these problems by (1) developing a reference formaldehyde emissions source that can be used to validate chamber testing methods for characterization of dynamic sources of formaldehyde emissions and (2) demonstrating that emissions from finite formaldehyde sources can be predicted using a fundamental mass-transfer model. Formaldehyde mass-transfer mechanisms are elucidated, providing practical approaches for developing diffusion-controlled reference materials that mimic actual sources. The fundamental understanding of emissions mechanisms can be used to improve emissions testing and guide future risk reduction actions.

  20. Reaction weakening and emplacement of crystalline thrusts: Diffusion control on reaction rate and strain rate

    O'Hara, Kieran


    In the southern Appalachians, the Blue Ridge-Piedmont crystalline thrust sheet was emplaced onto low-grade Late Precambrian and Paleozoic sedimentary rocks in the footwall along a basal detachment consisting of phyllosilicate-rich mylonites (phyllonites). The phyllonites developed first by mechanical breakdown of feldspar followed by chemical breakdown to white mica in the presence of a pore fluid. Diffusion of solute in the pore fluid is the rate limiting step in controlling reaction rate and also the strain rate. Assuming solute diffusion follows the Stokes-Einstein equation, the shear strain rate is given by ⅆγ/ⅆt=2ωkT/5ηrx for shear stress ≥20 MPa, where n is a constant, ω is a geometric factor, k is Boltzmann's constant, T is absolute temperature, η is water viscosity, r is the atomic radius of the diffusing species, and x is the diffusion distance. A bulk diffusion coefficient in the range of ˜10 -10 to 10 -12 m 2/s over distances of 10-100 m results in strain rates of 10 -14 to 10 -13 s -1 in the temperature range 200-400 °C. It is concluded that greenschist grade crystalline thrust sheets develop on pre-existing basement faults that become weak during reaction softening and localize into high strain phyllonite zones in which pore fluid diffusion controls reaction rate and strain rate.

  1. Die historiese betroubaarheid van die aartsvadervertellinge. 'n Beknopte bespreking van die huidige debat na aanleiding van die jongste publikasie

    W. Vosloo


    Full Text Available Die afgelope twintig jaar was daar �n toenemende belangstelling in die aartsvadervertellinge in Genesis. Benewens die talle tydskrifartikels het skrywers soos die volgende ook boeke oor die onderwerp die lig laat sien: A. Parrot (1962, W. M. Clark (1964, R. Kilian (1966, R. E. Clements (1967, N. Lohfink (1967, H. Weidemann (1968, R. Martin-Achard (1969, T. L. Thompson (1974, J. van Seters (1975, J. P. Fokkelman (1975, C. Westermann (1976, R. Rendtorff (1977, J. Bright (1977, W. McKane (1979 en A. R. Millard en D. J. Wiseman (1980.

  2. Herausforderungen durch die deutsche Wiedervereinigung

    Stäglin, Reiner

    Die Wiedervereinigung stellte auch die Statistik vor große Aufgaben. Die als Organ der staatlichen Planung staatsnah orientierte Statistik der DDR musste auf das zur Neutralität und wissenschaftlichen Unabhängigkeit verpflichtete System der Bundesrepublik umgestellt werden. Ebenso verlangten die Universitäten eine Neuorientierung. Die Deutsche Statistische Gesellschaft hat sich vor allem dreier Aufgaben mit großem Engagement, aber auch mit Bedachtsamkeit angenommen: Aufnahme und Integration der Statistiker aus den neuen Bundesländern in die Gesellschaft, Begleitung der Neuausrichtung des Faches Statistik an deren Hochschulen und Sicherung sowie Nutzung von Datenbeständen der ehemaligen DDR.

  3. Gedagtes oor die begin van die kerk - 'n geskiedenis van ...

    seriously, affirm, and thankfully acknowledge Christendom, the. Church. We must ... In all this we at least approached the theology and practice of a spiritual partisan ..... Hegel se geskiedsfilosofie hou juis 'sintese' voor as die eindpunt van die.

  4. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew


    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  5. Modeling the Mechanical Performance of Die Casting Dies

    R. Allen Miller


    The following report covers work performed at Ohio State on modeling the mechanical performance of dies. The focus of the project was development and particularly verification of finite element techniques used to model and predict displacements and stresses in die casting dies. The work entails a major case study performed with and industrial partner on a production die and laboratory experiments performed at Ohio State.

  6. Film Presentation: Die Urknallmaschine

    Carolyn Lee


    Die Urknallmaschine, an Austrian film by Gerd Baldauf, narrated by Norbert Frischauf (Alpha Österreich - ORF, 2009).  In CERN’s gigantic complex particles are accelerated to almost the speed of light, brought to collision and made to divide into even smaller particles. Public opinion of CERN’s research is also divided. Sceptics fear that black holes may be created. Might the goal to study the origin of the world lead to its destruction? The Austrian researcher Norbert Frischauf worked at CERN for many years. With his guidance it is possible to explore the world’s largest research centre, get a glimpse of the fascinating work the scientists do there and take a crash course in particle physics. Die Urknallmaschine will be presented on Friday, 25 June from 13:00 to 14:00 in the Main Auditorium. Language: German

  7. Dying for security

    Buchan, Bruce


    Full Text Available If political statements and media coverage are any guide, it seems Australians today are dying for security. At no other moment in our history has the spectre of war and terrorism so haunted popular, political and scholarly perceptions of Australia’s colonial past and of its geopolitical future. And yet, debates over colonial war or genocide and contemporary terrorism have been conducted in more or less complete isolation. In this article I argue that our contemporary obsession with ‘security’ is premised on the perennial threat of ‘insecurity’. This is the problem of in/security, and it has played a central role in the development of Western political thought. More importantly, its formulation in Western political thought provided a powerful justification for the violence of the early decades of Australia’s colonisation during which Indigenous Australians could also be said to have been dying for security.

  8. Dying for Security

    Bruce Buchan


    Full Text Available If political statements and media coverage are any guide, it seems Australians today are dying for security. At no other moment in our history has the spectre of war and terrorism so haunted popular, political and scholarly perceptions of Australia’s colonial past and of its geopolitical future. And yet, debates over colonial war or genocide and contemporary terrorism have been conducted in more or less complete isolation. In this article I argue that our contemporary obsession with ‘security’ is premised on the perennial threat of ‘insecurity’. This is the problem of in/security, and it has played a central role in the development of Western political thought. More importantly, its formulation in Western political thought provided a powerful justification for the violence of the early decades of Australia’s colonisation during which Indigenous Australians could also be said to have been dying for security.

  9. Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder

    SHEN Jun; LIU Yongchang; GAO Houxiu


    The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.

  10. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah


    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  11. Thermal analysis of selected tin-based lead-free solder alloys

    Palcut, Marián; Sopoušek, J.; Trnková, L.


    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodyna......The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC...... was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves....

  12. Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples

    Jing Han; Hongtao Chen; Mingyu Li; Chunqing Wang


    In this study,shear tests have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy (SEM) was employed to characterize the microstructures of the samples and orientation imaging microscopy (OIM) with electron backscattered diffraction (EBSD) in SEM was used to obtain crystallographic orientation of grains to provide a detailed characterization of the deformation behavior in Sn3.5Ag solder samples after shear tests.The deformation behavior in solder samples under shear stress was discussed.The experimental results suggest that the dynamic recrystallization could occur under shear stress at room temperature and recrystallized grains should evolve from subgrains by rotation.Compared with that of non-recrystallized and as-reflowed microstructures,the microhardness of the recrystallized microstructure decreased after shear tests.

  13. Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

    邹贵生; 吴爱萍; 张德库; 孟繁明; 白海林; 张永清; 黎义; 巫世杰; 顾兆旃


    Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at temperatures below 70℃. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.

  14. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

    Lee, Tae-Kyu; Liu, Bo; Zhou, Bite; Bieler, Thomas; Liu, Kuo-Chuan


    The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

  15. Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

    Kanda, Yoshihiko; Kariya, Yoshiharu


    The effects of waveform symmetry on the low-cycle fatigue life of the Sn-3.0Ag-0.5Cu alloy have been investigated, using micro solder joint specimens with approximately the same volume of solder as is used in actual products. Focusing on crack initiation life, fatigue tests on Sn-Ag-Cu micro solder joints using asymmetrical triangular waveforms revealed no significant reduction in fatigue life. A slight reduction in fatigue life at low strain ranges caused by an increase in the fatigue ductility exponent, which is the result of a weakening microstructure due to loads applied at high temperature for long testing time, was observed. This was due to the fact that grain boundary damage, which has been reported in large-size specimens subjected to asymmetrical triangular waveforms, does not occur in Sn-Ag-Cu micro size solder joints with only a small number of crystal grain boundaries.

  16. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Rolin, T. D.; Hodge, R. E.


    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  17. Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials

    Kolb, H.; Sottong, R.; Dasgupta, T.; Mueller, E.; de Boor, J.


    Low electrical and thermal contact resistances are a prerequisite for highly efficient thermoelectric generators. Likewise, certain measurement setups for characterization of thermoelectric materials rely on good-quality contacts between sample and setup. Detachable contacts are an interesting alternative to permanent contacting solutions due to ease of handling and nondestructive disassembly of valuable samples. Therefore, the applicability of gallium-based liquid metal solder as detachable contact material was studied, particularly with regard to compatibility of the solder with state-of-the-art thermoelectric materials CoSb3, Mg2Si, and FeSi2. Tungsten, nickel, chromium, and titanium were tested as protective coatings between the thermoelectric material and liquid metal solder. Electrical measurements showed that some materials form excellent and stable contacts with the solder for a limited temperature range. At higher temperatures, application of a protective layer was found to be necessary for all investigated materials. Tungsten and nickel showed promising results as protective layer.

  18. Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite

    Jun SHEN; Yongchang LIU; Dongjiang WANG; Houxiu GAO


    A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size ofβ-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the Hall-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.

  19. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.


    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  20. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    Jee, Y. K.; Yu, Jin


    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  1. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.


    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  2. Dying from cardiac tamponade

    Powari Manish


    Full Text Available Abstract Background To determine the causes of cardiac tamponade (CT, focussing especially on haemopericardium (HP, as a terminal mode of death, within a 430,000 rural English population. Methods Our hospital mortuary register and, all postmortem reports between 1995 and 2004 inclusive, were interrogated for patients dying of CT or HP. The causes of CT/HP and selected morphological characteristics were then determined. Results 14,368 postmortems were performed in this period: of these, 461 patients died of CT. Three cases were due to non-haemorrhagic pericardial effusion. HP accounted for the remaining 458 cases of which, five were post-traumatic, 311 followed rupture of an acute myocardial infarction (RAMI, 138 after intra-pericardial rupture of dissecting ascending aortic aneurysms (RD3A and four were due to miscellaneous causes. HP was more commonly due to RAMI. Men tended to die from RAMI or RD3A earlier than women. RAMI or RD3A were commoner in men Two thirds of RAMI were associated with coronary artery thrombosis. Anterior free wall rupture was commonest overall, and in women, but posterior free wall rupture was commoner in men. The volume of intrapericardial blood in RAMI (mean = 440 ml and RD3A (mean = 498 ml varied between 150 and 1000 ml: intrapericardial blood volume was greater in men than in women dying from either RAMI or RD3A. Conclusion At postmortem, CT is most often related to HP, attributable to either RAMI or intrapericardial RD3A. Post-traumatic and other causes of CT are infrequent.

  3. Die medizinische Diskussion um die Fettleibigkeit 1800-1914

    Holstermann, Inga Kristine


    Gegenstand der Untersuchung ist die medizinische Diskussion um die Fettleibigkeit von 1800 bis 1914. Dargestellt werden die unterschiedlichen Betrachtungsweisen der Fettleibigkeit beeinflusst durch gesellschaftliche, industrielle und medizinische Entwicklungen im Untersuchungszeitraum unter den Aspekten der Ursachen (Lebensführung, erbliche Veranlagung, Geschlecht, Alter, Stoffwechselstörungen) und Folgen (Gesundheitsgefahren, Ästhetik, psychische Auswirkungen). Des weiteren werden Konzepte z...

  4. Die Leben Einsteins eine Reise durch die Geschichte der Physik



    Jeder kennt die Namen Einstein, Newton oder Galilei. aber was weiss man über sie? Hier ein Porträt Einsteins anhand von sechs Meilensteinen aus der Geschichte der Physik. Einstein tritt auf als Protagonist in verschiedenen Epochen und bei verschiedenen Entdeckungen, die die Welt verändert haben.

  5. Geslagsverskille in die ouditiewe ontlokte potensiaal van die brein

    Anita D Stuart


    Full Text Available Gender differences in the auditory evoked potential of the brain. Based on literature indications of an association between temperament characteristics and the evoked potential of the brain, and indications of gender differences in certain temperament traits, the purpose of this study was to ascertain whether evoked responses also differentiated between the genders. A sample of 81 male and 210 female students was randomly selected. Two auditory evoked potential procedures were applied. The results indicated statistically significant differences in evoked potential responses between the genders. The results are interpreted against the background of sensory and neurological sources of the evoked potential responses and linked to the neurophysiological foundations of temperament. Opsomming: Gegrond op aanduidings in die literatuur van ’n assosiasie tussen temperamentskenmerke en die ontlokte potensiaal van die brein, sowel as aanduidings van geslagsverskille in sekere temperamentstrekke, was die doel van die huidige studie om te bepaal of ontloktepotensiaal-response ook tussen die geslagte onderskei. ’n Steekproef van 81 manlike en 210 vroulike studente is ewekansig geselekteer. Twee ouditiewe ontloktepotensiaal- prosedures is toegepas. Die resultate het op statisties beduidende verskille tussen die geslagte gedui. Die bevindinge word teen die agtergrond van die sensoriese en neurologiese oorsprong van ontloktepotensiaal–response geïnterpreteer en verbind aan die neurofisiologiese verankering van temperament.

  6. Studies of intermetallic growth in Cu-solder systems and wettability at solid-liquid interfaces

    Martin, Raymond W.


    Approved for public release; distribution is unlimited The metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic compound layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic/copper interface and its dissolution at the intermetallic/liquid solder interface. These were studied by determining the dissolution rates of the copper and the i...

  7. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    Brown, Christina


    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  8. Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

    Horton, W. Scott.


    In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and d...

  9. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Benabou Lahouari


    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  10. Packaging of hard solder 500W QCW diode laser array

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng


    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  11. Modeling of thermal processes in waveguide tracts induction soldering

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Seregin, Yu N.


    The problem solving of the induction heating models development, which describe the heating of the separate structural assembly components of the waveguide path and product generally, is presented in this paper. Proposed mathematical models are based on the thermodynamics equation and on the heat balance law. The system of the heating process mathematical models, such as surge tube and flange heating, and the mathematical model of the energy distribution are presented. During the modeling process with Matlab system by using mathematical models graphs of the tube, flange and coupling heating were obtained. These design charts are confirmed by the results of the experimental study. During the experimental studies pyrometers for temperature control and a video camera for visual control of the process parameters were used. On the basis of obtained models the induction soldering process features analysis is carried out and the need of its automation by the using of the information control systems for thermal management between the connection elements is revealed.

  12. Verrekening van die kragveld van die verbond in die inkleding van die kommunikatiewe driehoeksverhouding tussen teks, hoorder en prediker

    Friedrich W. de Wet


    Full Text Available In hierdie artikel word die kommunikatiewe driehoeksverhouding tussen die Bybelse teks, die hoorders en die prediker homileties verken. Die probleemstelling waarmee gewerk word handel oor potensiële versteurings wat kan plaasvind in hierdie driehoeksverhouding wanneer die hoorders en die prediker in hulle menslike beperktheid in verbinding gebring word met die ewige Woord van God soos dit in die Bybelse teks na vore kom. In die loop van die artikel word die volgende aspekte verken: ’n Ideale tipering van die verhouding tussen die teks, hoorders en prediker waarin al drie faktore ’n regmatige plek het; die maniere waarop die kommunikatiewe driehoek in die spanningsveld tussen teks, hoorders en prediker kan skeeftrek; en pneumatologiese verankering van die kommunikatiewe driehoek in die kragveld van die verbondsruimte, waarin Jesus Christus versoenend (integrerend teenwoordig is. Die gevolgtrekking waartoe gekom word, is dat die prediker in die kragveld van die verbond in staat gestel word om getrou te bly aan die teks (waarin God aan die Woord kom, aan die hoorders (as mededeelgenote in die genade van God sowel as – in missionêre konteks – mense wat geroep word om deelgenote in hierdie genade te word en aan hom- of haarself (as nuwe mens in Christus sonder dat die verbintenis aan een element in die  kommunikatiewe driehoek die verbintenis aan die ander versteur of laat disintegreer.Reckoning with the force field of the covenant in aligning the communicative triangle between text, listener and preacher. In this article the communicative triangular relationship between the Biblical text, the listeners and the preacher is reflected upon from a homiletic point of view. The problem statement deals with potential distortions in this triangular relationship when the listeners and preacher (in their human finitude are brought into contact with the eternal Word of God as it proceeds from the Biblical text. In the course of the article the

  13. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others


    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  14. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Lei Sun


    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  15. Soldering in a Reduced Gravity Environment (SoRGE)

    Easton, John W.; Struk, Peter M.


    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  16. Solder-Filling of a Cicc Cable for the Efda Dipole Magnet

    Bauer, P.; Bruzzone, P.; Cau, F.; Weiss, K.; Portone, A.; Salpietro, E.; Vogel, M.; Vostner, A.


    Several prototype Cable-In-Conduit-Conductors (CICC) for the superconducting EDIPO (Efda DIPOle) revealed a degradation of their critical current (Ic) increasing with each loading cycle. The strong Lorentz-forces during operation in combination with the limited support of the single strands against these forces are thought to be the cause of the permanent degradation of the brittle Nb3Sn superconductor from which the multi-stranded CICC are made. In summer 2006 EFDA started to explore the possibility to remedy the Ic degradation by solder-filling the conductor in order to mechanically stabilize the twisted-strand cable inside the conduit. This solution was not considered as the main one, but as an emergency solution to be applied to the completed magnet, should every other option fail. The solder-filling approach was previously applied with success in some cases. Some issues, however, needed to be clarified before this solution could be proposed for the EDIPO project. The most important among them are the choice of solder material, details of the solder filling process, and the thermo-mechanical implications of a solder-filled, high-field, high-current cable. This work, being reported here, made use not only of simulation but also of experiments, such as the mechanical testing of solder filled cables at cryogenic temperatures.

  17. Preliminary Study on Synthesis of Organolead Halide with Lead Derived from Solder Wire

    Pratiwi, P.; Rahmi, G. N.; Aimon, A. H.; Iskandar, F.; Abdullah, M.; Nuryadin, B. W.


    Organolead halide has attracted great attention for application in perovskite solar cells due to its high power conversion efficiency (PCE) of up to 20.1%. One of the most common perovskite materials is lead based reagent. In this research, we have synthesized organolead halide with lead extracted from solder wire. In the preparation procedure, first PbCl2 and PbI2 are produced by reacting lead from the solder wire with NaCl and KI, which are used as the basic substance for the perovskite material. Then, in order to get perovskite solution, the powders are reacted with methylamine iodide (MAI) in dimethylformamide (DMF) using a solution based method. Further, the spin coating method is used to fabricate perovskite thin film. The XRD peak results agreed with JCPDS Powder Diffraction of PbCl2 and PbI2. Based on FTIR, the transmittance spectra of the organolead mixed halide that was prepared using solder wire lead exhibited absorption peaks identical to organolead mixed halide using commercial lead. The UV-Vis absorbance spectra of the organolead mixed halide from solder wire lead also exhibited the same absorption ability as from commercial lead. Morever, EDS measurement showed that the element composition of the perovskite thin film using lead from solder wire identical to that from commercial lead. This indicates that solder wire lead is suitable enough for organolead halide material synthesis.

  18. Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

    Kao, Szu-Tsung; Duh, Jenq-Gong


    The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

  19. Development of high strength Sn-Mg solder alloys with reasonable ductility

    Alam, Md Ershadul; Gupta, Manoj


    This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

  20. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.


    Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). Intermetallic compound (IMC) layer reaction products that form at the solder/substrate interface have been characterized and their respective growth kinetics quantified. Thicker IMC layers pose a potential reliability problem with solder joint integrity. Since the IMC layer is brittle, the likelihood of mechanical failure of a joint in service is increased. The effect of microstructure and the response of these different materials to wetting, aging and mechanical testing was also investigated. Solid-state reaction data for intermetallic formation and mechanical properties of the solder joints are reported.

  1. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.


    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  2. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads

    Zhang Liang; Xue Songbai; Lu Fangyan; Han Zongjie; Wang Jianxin


    This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle profiles, which is based on non-linear finite element method. By analyzing the stress of soldered joints, it is found that the largest stress is at the area between the soldered joints and the leads, and analysis results indicate that the von Mises stress at the location slightly increases with the increase of lead counts. For PLCC with 84 leads the soldered joints was modeled for three typical loading (273-398 K, 218-398 K and 198-398 K) in order to study the influence of acceleration factors on the reliability of soldered joints. And the estimation of equivalent plastic strain of three different lead-free solder alloys (Sn3.8Ag0.7Cu, Sn3.5Ag and Sn37Pb) was also carried out.

  3. Comparative shear tests of some low temperature lead-free solder pastes

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.


    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  4. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Enrico Mick


    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  5. Die amtliche Kinder- und Jugendhilfestatistik

    Schilling, Matthias


    Unter Rückgriff auf verschiedene wissenschaftliche Methoden umfasst die Dissertation eine differenzierte Untersuchung der amtlichen Kinder- und Jugendhilfestatistik (KJH-Statistik). Da die wissenschaftliche Sozialpädagogik erst langsam und zögerlich beginnt, die amtliche Statistik der Kinder- und Jugendhilfe wahrzunehmen, liegt das Forschungsinteresse darin, dass eine grundlegende und umfassende wissenschaftliche Analyse der Möglichkeiten und Grenzen der KJH-Statistik vorgenommen wird. Die KJ...

  6. Diffusion-controlled toluene reference material for VOC emissions testing: international interlaboratory study.

    Howard-Reed, Cynthia; Liu, Zhe; Cox, Steven; Leber, Dennis; Samarov, Dan; Little, John C


    The measurement of volatile organic compound (VOC) emissions from building products and materials by manufacturers and testing laboratories, and the use of the test results for labeling programs, continue to expand. One issue that hinders wide acceptance for chamber product testing is the lack of a reference material to validate test chamber performance. To meet this need, the National Institute of Standards and Technology (NIST) and Virginia Tech (VT) have developed a prototype reference material that emits a single VOC similar to the emissions of a diffusion-controlled building product source with a dynamic emissions profile. The prototype material has undergone extensive testing at NIST and a pilot interlaboratory study (ILS) with four laboratories. The next development step is an evaluation of the prototype source in multiple-sized chambers of 14 laboratories in seven countries. Each laboratory was provided duplicate specimens and a test protocol. Study results identified significant issues related to the need to store the source at a subzero Celsius temperature until tested and possible inconsistencies in large chambers. For laboratories using a small chamber and meeting all the test method criteria, the results were very encouraging with relative standard deviations ranging from 5% to 10% across the laboratories. Currently, the chamber performance of laboratories conducting product VOC emissions testing is assessed through interlaboratory studies (ILS) using a source with an unknown emission rate. As a result, laboratory proficiency can only be based on the mean and standard deviation of emission rates measured by the participating ILS laboratories. A reference material with a known emission rate has the potential to provide an independent assessment of laboratory performance as well as improve the quality of interlaboratory studies. Several international laboratories with different chamber testing systems demonstrated the ability to measure the emission rate

  7. Diffusion-controlled cementation experiments in porous rock analogues using potash alum and halite

    Hufe, A.; Hilgers, C. [RWTH Aachen Univ. (Germany). Inst. of Reservoir-Petrology; Stanjek, H. [RWTH Aachen Univ. (Germany). Inst. of Interface and Clay Mineralogy


    A good understanding of cementation is critical for reservoir quality predictions. However, studies of core material have shown that cementation may be driven by variations in pore size of the host rock. To better understand the underlying process, we developed a transparent microreactor for diffusion-controlled cementation experiments under the microscope. We studied the effect of different pore sizes and surface charges of solid material at different pH, using rock analogs. High-resolution videos allowed to analyze the nucleation from solution, pore cementation and growth rates of cements. Diffusion - considered the major mass transport during burial diagenesis - was driven along a temperature gradient across the microreactor. Pores were cemented with salt, which is well known to form pore-size dependent seals in silicilastic reservoirs. While halite precipitated primarily in pores bigger than 200 {mu}m, alum nucleated in smaller pores. The growth rate of alum (10{sup -5} mm/s) was one order of magnitude higher than that of halite. However, the dissolution rates of both minerals was similar at about 10{sup -6} mm/s. Authigenic euhdral halite migrated against the bulk diffusion transport and towards the higher-temperature reservoir. Halite growth rates increased by one order of magnitude to 1.8 x 10{sup -5} mm/s, if the phase boundary was vapor-liquid. A comparison nucleation in a 2-phase porous rock analog showed no difference in cementation pattern at a pH 7. However, at a pH of 10.5 the surface energies of the two different solids are altered, and porosity was reduced 60% more by cements in the phase-1 porous layers. Our experiments showed that pore size dependent nucleation and cementation is a process, which may also take place in complex reservoirs. With the successful pore clogging of halite we can now bring our experimental setup to reservoir conditions and establish the processes at elevated p-T conditions. (orig.)

  8. Precision die design by the die expansion method

    Ibhadode, A O Akii


    This book presents a new method for the design of the precision dies used in cold-forging, extrusion and drawing processes. The method is based upon die expansion, and attempts to provide a clear-cut theoretical basis for the selection of critical die dimensions for this group of precision dies when the tolerance on product diameter (or thickness) is specified. It also presents a procedure for selecting the minimum-production-cost die from among a set of design alternatives. The mathematical content of the book is relatively simple and will present no difficulty to those who have taken basic c

  9. Gods hand in die natuur

    A. Duvenage


    Full Text Available Kan ons van so iets spreek? Daaroor bestaan daar seker geen verskil nie. Die Bybel is vol daarvan van Genesis tot Openbaring. God is Skepper. ’n Ander vraag is of ons God ook kan ken uit wat daar in die natuur gebeur? Verloop alles nie maar volgens ewige natuurwette waaraan tog niks verander kan word nie? Ons bely egter dat die Here nie net in die hart van die mens gelê het wat ons noem die „saad van die religie” nie (semen religionis, maar dat ons Hom ook ken deur die skep- ping, onderhouding en regering van die hele wêreld, aangesien dit voor ons oë is soos ’n mooi boek waarin alle skepsels, groot en klein, die letters is wat ons die onsigbare dinge van God duidelik laat sien, nl. sy ewige krag en Goddelikheid ...; dinge wat almal genoegsaam is om die mense te oortuig en hulle alle verontskuldiging te ontneem (Art. 2 Ned. Gel. Bel..

  10. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

    El-Daly, A.A., E-mail: [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); El-Taher, A.M. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); Gouda, S. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt)


    Highlights: • Small amounts of Bi have been added into Sn–1.5Ag–0.7Cu solder. • Bi reduced the undercooling and eutectic temperature of SAC257 solder. • Bi refined the microstructure and diminishes the nucleation rate of IMCs. • Bi increased the creep resistance and fracture lifetime of the solder. • Overall SAC properties can be improved adding not more than 3 wt.% Bi. - Abstract: Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to optimize existing and to develop new SAC solders. Characteristics of new Sn–Ag–Cu–Bi solders were analyzed and compared with those of as-solidified Sn–1.5Ag–0.7Cu (SAC157) alloy. The results of differential scanning calorimetry (DSC) indicate significant reduction of both undercooling, eutectic temperature, solidus and liquidus temperatures with the addition of Bi into SAC(157) solder, although the pasty range remains the same or slightly increased. Moreover, SAC(157) solders containing Bi were found to have a higher creep resistance (126.1 times) than SAC(157) solder at the same stress level and testing temperature. The higher creep resistance was contributed by the solid solution and precipitations strengthen effects of Bi. The precipitation of these Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders. The creep life time of plain SAC(157) alloy was extremely enlarged 23.7 times with the addition of 3 wt.% Bi. Constitutive Garofalo model of creep for both SAC(157) and Sn–Ag–Cu–Bi solders was assembled based on the experimental data.

  11. Die eunug in die klassieke mitologie en samelewing

    F. P. Retief


    Full Text Available Die konsep, eunug, wat na ’n gekastreerde persoon (gewoonlik manlik verwys, het sy oorsprong in die mitologie. Van hier word dit deurgevolg na die Klassieke tydperk. Kastrering vir religieuse redes was deel van godsdiensrituele gekoppel aan verering van aardgodinne en fertiliteit. Die kultusse wat aan die godinne Kubele, Hekate, Atargatis-Dea, Astarte, Artemis en Innana-Ishtar gewy was en wat deur eunugpriesters bedien was, word beskryf. Kastrering vir niereligieuse redes, oorwegend weens sosio-ekonomiese oorwegings, het waarskynlik tydens die 2de millennium v.C. sy oorsprong in Midde-Oosterse lande gehad vanwaar dit teen ongeveer die 5de eeu v.C. na Griekeland, en twee eeue later na Rome uitgebrei het. ’n Oorsig word gelewer van die invloed en rol van die eunug ten tye van die klassieke beskawing. Die sogenaamde “kongenitale eunug” waar hipogonadisme weens ’n aangebore letsel ontstaan, ’n baie seldsame verskynsel, word nie verder bespreek nie.

  12. Aard, funksie en invloed van die Literatuur

    J. van der Elst


    Full Text Available Binne die raam werk van die tema van hierdie simposium gaan dit om twee komponente:die Literatuur, meer bepaald die letterkundige werk of woordkunswerk met sy drie genres endie gemeenskap, die onlvangers of belewers van die Literatuur of doodgewoon die lesers.

  13. Videobasierte Unterrichtsbeobachtung: die Quadratur des Zirkels?

    Fankhauser, Regula


    Seit einigen Jahren wird Unterrichtsforschung vermehrt videobasiert angegangen. Die methodologische Diskussion, die die Weiterentwicklung des Instrumentariums begleitet, kreist dabei zentral um die Frage der Invasivität der Aufzeichnungstechnik und möglicher Kameraeffekte. Je nach methodologischer Ausrichtung wird diesem Problem anders begegnet: So versucht die abbildtheoretische Unterrichtsvideografie, die Invasivität zu kontrollieren. Qualitative Methoden wie die Kameraethnografie dagegen m...

  14. Die wisselende rol van kontinuïteit en diskontinuïteit in die geskiedenis van die filosofie en die wiskunde

    Danie F.M. Strauss


    Full Text Available Hierdie artikel wil lig werp op die onvermydelikheid van diskreetheid en kontinuïteit as primitiewe (ondefinieerbare verklaringswyses in die geskiedenis van die filosofie en die wiskunde. Dit beliggaam die algemene uitdaging om rekenskap van die samehang van iets wat uniek is te gee. Gödel beklemtoon die samehang van ‘primitiewe begrippe’. Die Griekse filosofie het reeds die ruimtelike geheel-dele-relasie – en die oneindige verdeelbaarheid daarvan – ontdek. Gedurende en na die Middeleeue het filosowe wipplank gery tussen ’n atomistiese waardering van die kontinuum en die teenoorgestelde daarvan, wat byvoorbeeld in die denke van Leibniz aangetref word as die gepostuleerde wet van kontinuïteit (lex continui. Die ontdekking van ‘inkommensurabiliteit’ (irrasionale getalle deur die Grieke het aanleiding gegee tot die eerste grondslagkrisis van die wiskunde en die geometrisering daarvan. Leibniz en Newton kon die probleme rondom die limietbegrip nie besleg nie en spoedig sou dit tot die derde grondslagkrisis van die wiskunde aanleiding gee. Dit het Frege en die ‘kontinuum-teoretici’ daartoe gebring om prioriteit aan die kontinuum te gee – diskreetheid is ’n katastrofe. Onlangs waardeer Smooth Infinitesimal Analysis kontinuïteit as iets wat ’n ‘ongebroke en ononderbroke geheel’ daarstel. Die intuïsionistiese wiskunde het opnuut aangesluit by die klem op die ruimtelike geheel-dele-relasie. Ondanks pogings om kontinuïteit eksklusief aritmeties en ruimtelik te verstaan bevestig die geskiedenis van die filosofie en die wiskunde onmiskenbaar dat die medekondisionerende rol van hierdie twee wyses van verklaring ’n konstante metgesel in die nadenke oor kontinuïteit en diskontinuïteit sou bly. (Die rol van kontinuïteit en diskontinuïteit in die fisika en biologie sal in ’n aparte artikel ondersoek word.

  15. Study on Solder Joint Reliability of Plastic Ball Grid Array Component Based on SMT Products Virtual Assembly Technology

    HUANG Chunyue; WU Zhaohua; ZHOU Dejian


    Based on surface mount products virtual assembly technology, the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters, including the upper pad diameter,the stencil thickness, the chip weight on a single solder joint and the lower pad diameter were chose as four control factors. By using an L25(56) orthogonal array the PBGA solder joints which have 25 different process parameters' levels combinations were designed. The numerical models of all the 25 PBGA solder joints were developed and the finite element analysis models were setup. The stress and strain distribution within the PBGA solder joints under thermal cycles were studied by finite element analysis, and the thermal fatigue life of PBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis was performed. The results of study show that that the impact sequence of the four factors from high to low on the fatigue life of PBGA solder joints are the stencil thickness,the upper pad diameter, the lower pad diameter and the chip weight on a single solder joint; the best level combination ofprocess parameters that results in the longest fatigue life is the lower pad diameter of 0.6 mm, the stencil thickness of 0.175 mm, the chip weight on asingle solder joint of 28×10-5 N and the upper pad diameter of 0.5 mm.

  16. Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability


    By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.

  17. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo


    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  18. Reuchlin und die Kabbala


    Auszug: Hundert Jahre nachdem Johannes Reuchlin sein wissenschaftliches Werk vollendet hatte, war der von ihm hinterlassene Eindruck auf die europäische Wissenschaft und das europäische Denken so nachdrücklich, daß er - liebe- oder vorwurfsvoll - einmal >Rabbi Capnion< genannt wurde. Und wirklich - so meint Joseph Blau in seiner Darstellung der christlichen Kabbala - habe Reuchlin der hebräischen Literatur mehr gedient als mancher ordentliche Rabbiner. Ähnlich hat Gershom Scholem, der Begründ...

  19. Die Mythosphilosophie Ernst Cassirers

    Pedersen, Esther Oluffa

    Bogen undersøger Ernst Cassirers filosofiske hovedværk - Die Philosophie der symbolischen Formen - for at finde frem til, hvilken betydning det har, at Cassirer inddrager myten som den menneskelige kulturs grundform og dermed på mange måder sidestillet med videnskab, sprog og kunst. Der...... argumenteres for, at netop arbejdet med myten muliggjorde en frugtbar åbning af erkendelsesteorien i retning af udtryksfænomenet og følelsers betydning for menneskets livsverden. Bogens anden del ser nærmere på, hvordan Cassirer bruger sin mytefilosofi fra 1920'erne til at forstå 1940'ernes fascistiske...

  20. Electrodeposition of lead-free, tin-based alloy solder films

    Han, Chunfen

    The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag-Cu alloys that are produced primarily by electrodeposition. During soldering and solid state aging (storage or in service of the electronic assemblies), interactions take place at the solder/substrate metal interface and form intermetallic compounds (IMCs) which are crucial for the reliability of the solder joints. Simple and "green" Sn-citrate and Sn-Cu-citrate solutions have been developed and optimized to electrodeposit eutectic and near eutectic Sn-Cu solder films. Sn-citrate suspensions with Cu particles and Sn-Cu-citrate suspensions with Ag nano-particles have also been developed and optimized to allow for electrochemical composite deposition of eutectic and near eutectic Sn-Cu and Sn-Ag-Cu solder films. Different plating and post-plating conditions, including solution concentration, current density, agitation, additives, and aging, have been investigated by evaluating their effects on plating rate, deposit composition and microstructure. Tri-ammonium citrate is used as the only complexing agent for Sn, Sn-Cu, and Sn-Ag-Cu deposition. Speciation diagram calculations, reduction potential calculations, and polarization studies are conducted to study Sn-citrate solution chemistry and the kinetics of Sn electrodeposition. X-ray photoelectron spectroscopy (XPS) analysis is used to identify the precipitates formed in Sn-citrate solutions at low pH. Current-controlled and potential-controlled electrochemical techniques, nucleation modeling, and surface morphology characterization techniques are applied to study the nucleation and film growth mechanism of Sn and Sn-Cu electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Reflow and aging tests for deposited Sn

  1. Laser solder repair technique for nerve anastomosis: temperatures required for optimal tensile strength

    McNally-Heintzelman, Karen M.; Dawes, Judith M.; Lauto, Antonio; Parker, Anthony E.; Owen, Earl R.; Piper, James A.


    Laser-assisted repair of nerves is often unsatisfactory and has a high failure rate. Two disadvantages of laser assisted procedures are low initial strength of the resulting anastomosis and thermal damage of tissue by laser heating. Temporary or permanent stay sutures are used and fluid solders have been proposed to increase the strength of the repair. These techniques, however, have their own disadvantages including foreign body reaction and difficulty of application. To address these problems solid protein solder strips have been developed for use in conjunction with a diode laser for nerve anastomosis. The protein helps to supplement the bond, especially in the acute healing phase up to five days post- operative. Indocyanine green dye is added to the protein solder to absorb a laser wavelength (approximately 800 nm) that is poorly absorbed by water and other bodily tissues. This reduces the collateral thermal damage typically associated with other laser techniques. An investigation of the feasibility of the laser-solder repair technique in terms of required laser irradiance, tensile strength of the repair, and solder and tissue temperature is reported here. The tensile strength of repaired nerves rose steadily with laser irradiance reaching a maximum of 105 plus or minus 10 at 12.7 When higher laser irradiances were used the tensile strength of the resulting bonds dropped. Histopathological analysis of the laser- soldered nerves, conducted immediately after surgery, showed the solder to have adhered well to the perineurial membrane, with minimal damage to the inner axons of the nerve. The maximum temperature reached at the solder surface and at the solder/nerve interface, measured using a non-contact fiber optic radiometer and thermocouple respectively, also rose steadily with laser irradiance. At 12.7, the temperatures reached at the surface and at the interface were 85 plus or minus 4 and 68 plus or minus 4 degrees Celsius respectively

  2. Die ideaal van die spreker in die satiriese gedig: M.M. Walters

    S. M. Cameron


    Full Text Available Wanneer van die satirikus gepraat word, word eintlik die spreker in die satiriese gedig veronderstel. “For the Muse ought always to be our reminder that it is not the author as man who casts these shadows on our printed page, but the author as poet” (Mack, 1971:193.

  3. Die historiese Jesus, die Jesus-beweging en die vorming van die kerk

    Andries van Aarde


    Full Text Available The historical Jesus, the Jesus movement and the birth of the church. The article focuses on the birth of the church. The point at which the church began its existence is located within the boundaries of fonnative Judaism. The parting of the ways is explained as a movement from faction to sect, to the eventual fonnation of the church in its own right as distinct from the synagogue. The historical Jesus should therefore not be seen as the founder of the church. However, the article argues that the relation of the life and death of the historical Jesus to the resurrection belief of the post-paschal Jesus movement constitutes the cradle of the church. This continuum between Jesus and New Testament Christendom is referred to by means of the Gennan phrase die Sache Jesu. Reconsideration of this trajectory results in the conviction that the vision and program of the historical Jesus cannot be neglected when one reflects on the nature of the church in the New Testament or on the vocation of the church through history to the present day. Two thought complexes form the kernel of die Sache Jesu: God's unbounded presence and the concept that everyone has unmediated and non-hierarchical access to the grace of God.

  4. Die hermeneutiek van gereformeerde kerkreg

    Andries le Roux du Plooy


    Full Text Available Die artikel het op die belangrikheid en noodsaaklikheid van ‘n hermeneutiek vir die gereformeerde kerkreg gefokus. Die kerkregtelike dokument wat besonderlik ter sake was, is die kerkorde van die Gereformeerde kerke in Suid-Afrika, met sy besondere band met die Dordtse kerkorde van 1618 en 1619. Agtereenvolgens is aandag gegee aan die volgende aspekte soos (1 die eiesoortige aard van ‘n kerkorde as ‘n teologiese dokument en teks, in onderskeiding van regsdokumente; (2 die aard van die hermeneutiek van kerkreg; (3 enkele teorieë oor die interpretasie of uitleg van tekste, veral regstekste en (4 normatiewe vooronderstellings en reëls vir die interpretasie en verstaan van die teks en artikels van die kerkorde asook besluite van kerklike vergaderinge. Die gevolgtrekking was dat weinig indringende navorsing gedoen is oor die saak van hermeneutiek vir kerkreg, hoewel dit noodsaaklik is. Duidelike hermeneutiese reëls is gesuggereer en verduidelik, wat sou kon meehelp dat kerke en kerklike vergaderinge die artikels van die kerkorde asook besluite en reglemente wat daarop berus het, kan interpreteer en toepas.The hermeneutics of reformed church polity. The article focused on the importance and urgency of a design for reformed hermeneutics on church polity. The Church Order referred to in the article is the Church Order of the Reformed Churches in South Africa, which are closely related to the Church Order of Dordt of 1618 and 1619. The following aspects received attention namely (1  the unique character of a Church Order, in comparison to and distinguished from legal documents and statutes; (2 the character and nature of hermeneutics of church polity; (3 theories of interpretation in the common law tradition and their relevance to church polity and (4 normative presuppositions and marks for the interpretation and understanding of the text and articles of the Church Order, as well as the resolutions of church assemblies. It was found that

  5. Modeling diffusion control on organic matter decomposition in unsaturated soil pore space

    Vogel, Laure; Pot, Valérie; Garnier, Patricia; Vieublé-Gonod, Laure; Nunan, Naoise; Raynaud, Xavier; Chenu, Claire


    Soil Organic Matter decomposition is affected by soil structure and water content, but field and laboratory studies about this issue conclude to highly variable outcomes. Variability could be explained by the discrepancy between the scale at which key processes occur and the measurements scale. We think that physical and biological interactions driving carbon transformation dynamics can be best understood at the pore scale. Because of the spatial disconnection between carbon sources and decomposers, the latter rely on nutrient transport unless they can actively move. In hydrostatic case, diffusion in soil pore space is thus thought to regulate biological activity. In unsaturated conditions, the heterogeneous distribution of water modifies diffusion pathways and rates, thus affects diffusion control on decomposition. Innovative imaging and modeling tools offer new means to address these effects. We have developed a new model based on the association between a 3D Lattice-Boltzmann Model and an adimensional decomposition module. We designed scenarios to study the impact of physical (geometry, saturation, decomposers position) and biological properties on decomposition. The model was applied on porous media with various morphologies. We selected three cubic images of 100 voxels side from µCT-scanned images of an undisturbed soil sample at 68µm resolution. We used LBM to perform phase separation and obtained water phase distributions at equilibrium for different saturation indices. We then simulated the diffusion of a simple soluble substrate (glucose) and its consumption by bacteria. The same mass of glucose was added as a pulse at the beginning of all simulations. Bacteria were placed in few voxels either regularly spaced or concentrated close to or far from the glucose source. We modulated physiological features of decomposers in order to weight them against abiotic conditions. We could evidence several effects creating unequal substrate access conditions for

  6. Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

    Wang, Feng-Jiang [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)]. E-mail:; Yu, Zhi-Shui [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China); Qi, Kai [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)


    Intermetallic formations of Sn-3.0Ag-0.5Cu solder alloy with additional 1.0 wt% Zn were investigated for Cu-substrate during soldering and isothermal aging. During soldering condition, the Cu{sub 5}Zn{sub 8} compound with granular-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu-1.0Zn solder, while the Cu{sub 6}Sn{sub 5} compound with scallop-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu solder. During thermal aging, the final interfacial structure for Sn-3.0Ag-0.5Cu-1.0Zn solder is solder/Cu{sub 5}Zn{sub 8}/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu, different from the solder/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu for Sn-3.0Ag-0.5Cu solder. The thickness of Cu-Sn IMC layers increases, while the thickness of Cu{sub 5}Zn{sub 8} compound layer decreases with increasing aging time due to the decomposition of the Cu{sub 5}Zn{sub 8} layer by the diffusion of Cu and Zn atoms into the solder and Cu{sub 6}Sn{sub 5} at higher aging temperature. For Sn-3.0Ag-0.5Cu-1.0Zn solder, at higher aging temperature of 150 or 175 {sup o}C, with the formation of Cu{sub 3}Sn at Cu{sub 6}Sn{sub 5}/Cu, Kirkendall voids can be observed at the interface of Cu{sub 3}Sn/Cu.

  7. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

    WANG Jian-xin; XUE Song-bai; FANG Dian-song; JU Jin-long; HAN Zong-jie; YAO Li-hua


    Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn, in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder. With the increases of output power of diode-laser, the shear force and the microstructures change obviously. The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method, so the shear force is also higher than that using IR reflow soldering method. When the output power value of diode-laser is about 41.0 W, the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

  8. Is die ortodoksie se verstaan van die sondeval belemmerend vir die gesprek tussen teologie en natuurwetenskap?

    Johan Buitendag


    Full Text Available In hierdie artikel is betoog dat die Gereformeerde Ortodoksie se begrip van die sondeval ’n  belemmering  was  vir  die  gesprek  tussen  teologie  en  natuurwetenskap.  Die  rede hiervoor was dat dit ten eerste ’n bepaalde verstaan van liniêre tyd nahou en ten tweede dat dit ’n bonatuurlike ingryp veronderstel het. Albei hierdie aspekte het die debat onnodig problematiseer. Die argument is ontwikkel deur eerstens die probleem te definieer, gevolg deur ’n uiteensetting van die standpunte van Augustinus en Calvyn onderskeidelik oor die sondeval. As ’n heuristiese sleutel is die konsepte van infralapsarisme en supralapsarisme aangewend om die tema te ontleed. Die artikel is afgesluit met die oortuiging dat die imago Dei ’n beliggaamde menslike persoon is wat biologies in die geskiedenis in terme van selfbewussyn en morele verantwoordelikheid ontluik het.Is the Orthodoxy’s notion of the Fall inhibitory for the dialogue between theology and science? In this article it was argued that the Reformed Orthodoxy’s interpretation of the Fall had become an impediment in the dialogue between theology and science. The reason was that it assumed firstly a specific understanding of linear time and secondly a metaphysical intervention. Both events were unnecessarily problematising the debate. The argument was deployed by stating the problem, followed by an exposition of the views of Augustine and Calvin on the Fall. As a heuristic key, the concepts of infralapsarism and supralapsarism were applied respectively to analyse the topic. The article concluded with the conviction that the imago Dei is an embodied human person that had biologically emerged in history as a center of self-awareness, and moral responsibility.

  9. Die verband tussen lokus van beheer en die werks prestasie van swart bemarkers in die lewensversekeringsbedryf

    E. L. Coetzer


    Full Text Available The relationship between locus of control and the work performance of black marketers in the life assurance industry. The aim of the study was to establish the relationship between locus of control and the work performance of black marketers in the life assurance industry. These constructs were selected by virtue of the lack of empirical research regarding the assumed relationship between them. The Locus of Control Scale of Schepers (1995 was used for measuring locus of control. Work performance was measured by the commission earned per month by the marketer, the number of policies generated by the marketer, as well as the percentage of lapsed policies. The relevant measurements were obtained in respect of a sample of 149 black marketing personnel. The results indicated a modest but statistically significant relationship between external locus of control and the work performance of black marketers. Opsomming Die doel van die studie was om die verband tussen lokus van beheer en die werksprestasie van swart bemarkers in die lewensversekeringsbedryf te bepaal. Hierdie konstrukte is gekies op grond van die gebrek aan empiriese navorsing rakende die veronderstelde verband tussen genoemde konstrukte. Die Lokus van Beheer-vraelys van Schepers (1995 is in die meting van lokus van beheer gebruik. Werksprestasie is aan die hand van kommissie per maand verdien, aantal polisse gegenereer deur 'n bemarker en die persentasie vervalde polisse, gemeet. Die tersaaklike metinge is verkry ten opsigte van 'n steekproef van 149 swart bemarkers. Die resultate toon 'n klein, dog statisties beduidende verband tussen eksterne lokus van beheer en die werksprestasie van swart bemarkers in die lewensversekeringsbedryf.

  10. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Suhir, E.; Yi, S.; Ghaffarian, R.


    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  11. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Wang, Chao-Hong; Li, Kuan-Ting


    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  12. High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

    Shnawah, Dhafer Abdulameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Che, Fa Xing


    Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact. Addition of Mn, Ce, Bi, and Ni to low-Ag-content SAC solder effectively improves the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Taking into consideration the improvement in the bulk alloy microstructure and mechanical properties, wetting properties, and growth suppression of the interface intermetallic compound (IMC) layers, addition of Ti, In, Sb, Zn, Al, Fe, and Co to low-Ag-content SAC solder has the potential to improve the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Consequently, further investigations of both thermal-cycling and drop reliability of these modified solder joints must be carried out in future work.


    XUE Songbai; WU Yuxiu; HAN Zongjie; WANG Jianxin


    The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum Simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldered joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

  14. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)


    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  15. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Wang, Chao-Hong; Li, Kuan-Ting


    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  16. Sedimentêre omgewings van die Inhaca-eilandstelsel met spesiale verwysing na die petrografiese en geochemiese eienskappe van die sedimente spesiale verwysing na die petrografiese en geochemiese eienskappe van die sedimente

    Marieke Peché


    Full Text Available Die Inhaca-eilandstelsel is geleë langs die suidooskus van Mosambiek. Die oostekant van die stelsel grens aan die Indiese Oseaan en die westekant aan die Baai van Maputo. Hierdie eilandstelsel bestaan uit Inhaca- en Portugese eiland, asook ’n groep sandbanke wat van die noordlike punt van Inhaca na Portugese eiland strek. Die doel van hierdie studie is om die verskillende moderne en oer-sedimentêre omgewings op die eilandstelsel te identifiseer en te beskryf, die invloed van getye en golfaksie op die moderne sedimentêre omgewing vas te stel en die geochemiese en petrografiese samestelling van die geologiese eenhede te bepaal.

  17. Die gebruik van metode in die filosofie, spesiaal in die reformatoriese tra­disie 1

    N. T. van der Merwe


    Full Text Available Die onderw erp van my voordrag, Die gebruik van metode in die fílosofie, verg ’n paar verduidelikende opinerkings vooraf. Ek dink u verm oed alreeds dat hierdie fomulering ’n versuikerde pil is om u in so ’n mate nuuskierig te maak dat una ’n heerlike vrye filosofiese ‘onderonsie’ gedurende die teepouse darem vir ’n tw eede sessie terugkeer. Want is dit nie twee smaaklike heuningdruppels nie: filosofie en sy metode’ en ‘metode in die Reformatoriese filosofiese tradisie'?! Veral as in gedagte gehou word dat in teenstelling met wat ’n mens sou verw ag, daaroor dié onderwerp as sodanig relatief maar heel weinig geskrywe is en word, selfs as die ‘Inleidings in die Metodologie’ daarby gereken word.

  18. Mechanical Properties and Microstructure Investigation of Lead Free Solder

    Wang, Qing; Gail, William F.; Johnson, R. Wayne; Strickland, Mark; Blanche, Jim


    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a

  19. Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

    Ramirez, Mauricio, E-mail: [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany); Henneken, Lothar [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Virtanen, Sannakaisa [Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany)


    The oxide formation on thin copper films deposited on Si wafer was studied by XPS, SEM and Sequential Electrochemical Reduction Analysis SERA. The surfaces were oxidized in air with a reflow oven as used in electronic assembly at temperatures of 100 deg. C, 155 deg. C, 200 deg. C, 230 deg. C and 260 deg. C. The SERA analyses detected only the formation of Cu{sub 2}O but the XPS analysis done for the calibration of the SERA equipment proved also the presence of a CuO layer smaller than 2 nm above the Cu{sub 2}O oxide. The oxide growth follows a power-law dependence on time within this temperature range and an activation energy of 33.1 kJ/mol was obtained. The wettability of these surfaces was also determined by measuring the contact angle between solder and copper substrate after the soldering process. A correlation between oxide thickness and wetting angle was established. It was found that the wetting is acceptable only when the oxide thickness is smaller than 16 nm. An activation energy of 27 kJ/mol was acquired for the spreading of lead free solder on oxidized copper surfaces. From wetting tests on copper surfaces protected by Organic Solderability Preservatives (OSP), it was possible to calculate the activation energy for the thermal decomposition of these protective layers.

  20. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak


    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys (T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  1. Die derivation der slowenischen substantive

    ]ože Toporišič


    Full Text Available Von der traditionellen slowenischen Wortbildungslehre von Substantiven mit den Suffixen (s. g. Derivation wird die betreffende Problematik so dargestellt, dass man - nach Miklošič's Vorbild - von Suffixen mit einem charakteristischen Konsonanten (oder mit eine charakteristischen Konsonantengruppe aus gehend bei verschiedenen Wortartbasen (Zeitwort, Adjektiv, Substantiv die semantischen kategorien von Wortbildungen mit »demselben« Suffix aufzählt. Aber schon bei A. Bajec (Besedotvorje slovenskega jezika, 1950 findet man auch das Kapitel »Die Suffixe nach ihren Bedeutungen, worin Suffixe für 24 Bedeutungsgruppen festgehalten sind. In der Slovenska slovnica (1956 gibt es 16, im Slovenski knjižni jezik 2 (1966 aber 13 solcher Gruppen von Suffixen. Der vorliegende Ausatz geht ebenfalls von den semantischen Kategorien aus, versucht aber die Zahl der Bedeutungskategorien, die aus verhalen, adjekvsehen oder substantiviseher Basen mit Hilfe von Suffixen gebildet werden, auf 6 grosse Gruppen zu reduzieren. Diese 6 Gruppen sind: 1. die Namen der Agenten, des Eigenschaftstragers und der Verbundenheit; 2. die Namen der Werkzeuge, 3. die Namen der Handlung, der Eigenschaft und des Zustandes, 4. die Namen der vergegenständlichten Tat oder Eigenschaft, 5. die Namen der Lokalisierung und 6. Verschiedene. Nur bei den Wortbildungen aus einer substantivischen Basis gibt es noch eine besondere, die s. g. Modifikationsbedeutungsgruppe (Feminativa und Maskulinativa, Kollektiva, Gradativa, Iuvenalia, Diminutiva, Diminutivhipokoristika, Diminutivpeirotiva und Peiorativa. - Dabei wird keine Riick­ sicht darauf genommen, ob diese Suffixe genain slowenisch oder aus anderen Sprachen übernommen sind. Die Berechtigung dafiir gibt uns nicht nur die produktive Wortbildung mit den entlehnten (nichtautochtonen Suffixen im gegenwärtigen Slowenisch, sondern (was noch wichtiger ist auch das richtige Verständnisvermögen der Sprecher für solche Wortbildungen im

  2. Die invloed van herbivorie en vuur op die oorlewing van sekere meerjarige kruide langs die Sabierivier, Kruger Nasionale Park

    H. Myburgh


    Full Text Available Die groot vloede wat in die jaar 2000 in die Kruger Nasionale Park plaasgevind het, het dierivieroewerplantegroei versteur. Dit het die geleentheid gebied om heinings op te rig langsdie Sabierivier om herbivore uit sekere gebiede uit te sluit en sodoende die herstel van die rivieroewerekosisteme te monitor.

  3. Die heelal en sy onstaan (II

    D. J. Van Rooy


    Full Text Available Ons kennis en wetenskap van die hemelliggame word volkome bepaal deur die lig wat ons van hulle ontvang, d.w.s. as ons die feite wat die Bybel daaromtrent meedeel, buite rekening laat.

  4. Spearman se G en die faktorstrukture van die senior aanlegtoetse en die algemene skolastiese aanlegtoets

    G. P. De Bruin


    Full Text Available Spearman's G and the factor structures of the Senior Aptlitude Test and the General Scholastic Aptitude Test. Scores of 1507 university students on the six subtests of the General Scholastic Aptitude Test (GSAT and on nine subtests of the Senior Aptitude Tests (SAT were subjected to a joint confirmatory factor analysis. This procedure was followed to examine (a the extent to which scores in respect of the two batteries of tests, are explained by a general factor (Spearman's g, and (b the relationship between the two general factors. Scores on the GSAT subtests were adequately explained by just one factor. With regard to the SAT three group factors could be distinguished, namely Verbal Ability, Visual-Spatial Ability and Numerical Ability. The correlations between the group factors were so high that the influence of a general factor was evident. The general factors underlying the SAT and GSAT respectively, also correlated significantly. In view of findings suggesting the general intelligence is the best single predictor of criteria such as academic success and work performance, the GSAT is recommended for selection purposes. Opsomming Tellings van 1507 universiteitstudente op die ses subtoetse van die ASAT en nege subtoetse van die SAT, is gesamentlik aan 'n bevestigende faktorontleding onderwerp. Hierdie prosedure is gevolg om ondersoek in te stel na (a die mate waartoe 'n algemene faktor (Spearman se g die tellings op die twee batterye toetse onderskeidelik onderle, en (b wat die verwantskap tussen die twee algemene faktore sou wees. Ten opsigte van die ASAT is dit duidelik dat slegs een faktor tellings op al ses subtoetse verklaar. Ten opsigte van die SAT kon drie groepsfaktore onderskei word/ naamlik Verbale Vermoe, Visueel-Ruimtelike Vermoe en Numeriese Vermoe. Die korrelasies tussen die drie groepsfaktore was egter so hoog dat dit duidelik is dat daar 'n algemene faktor onderliggend is aan die nege subtoetse. Die algemene faktore wat die

  5. Die MCI im Wandel: User Experience als die zentrale Herausforderung?

    Jetter, Christian


    Die Informationstechnologie hat heute einen Reifegrad erlangt, der stark umkämpfte Massenmärkte von interaktiven Produkten hervorgebracht hat. In diesen sind - wie auch in den herkömmlichen Konsumgütermärkten - nicht nur die pragmatische Produktqualität, sondern auch das Benutzungserlebnis und die Gesamtwirkung auf den Käufer entscheidend für den Markterfolg. Eine erfolgreiche Gestaltung dieser "User Experience" geht dabei über die reine Softwareergonomie hinaus und erfordert interdisziplinär...

  6. Meganisisme, vitalisme en holisme in die Biologie

    P.J. Botha


    Full Text Available Die Biologie word omskryf as die wetenskap van die lewende wesens (organismes. Die lewe staan dus in die brandpunt van die biologiese studie en ondersoek. Vra ons ons egter af wat onder „lewe” verstaan word, besef ons dadelik dat ons hier met ’n uiters moeilik definieerbare begrip te doen het. In verband met die aard van lewe het daar onder die bioloë en natuurfilosowe veral twee denkrigtings posgevat, nl. meganisisme en vitalism.

  7. CO₂ laser welding of corneal cuts with albumin solder using radiometric temperature control.

    Strassmann, Eyal; Livny, Eitan; Loya, Nino; Kariv, Noam; Ravid, Avi; Katzir, Abraham; Gaton, Dan D


    To examine the efficacy and reproducibility of CO₂ laser soldering of corneal cuts using real-time infrared fiber-optic radiometric control of tissue temperature in bovine eyes (in vitro) and to evaluate the duration of this procedure in rabbit eyes (in vivo). In vitro experiment: a 6-mm central perforating cut was induced in 40 fresh bovine eyes and sealed with a CO₂ laser, with or without albumin soldering, following placement of a single approximating nylon suture. A fiber-optic radiometric temperature control system for the CO₂ laser was used. Leaking pressure and histological findings were analyzed and compared between groups. In vivo experiment: following creation of a central perforation, 6 rabbit eyes were treated with a CO₂ laser with albumin solder and 6 rabbit eyes were treated with 10-0 nylon sutures. The amount of time needed for completion of the procedures was compared. In vitro experiment: effective sealing was achieved by CO₂ laser soldering. Mean (± SD) leaking pressure was 109 ± 30 mm Hg in the bovine corneas treated by the laser with albumin solder compared to 51 ± 7 mm Hg in the sutured control eyes (n = 10 each; p laser without albumin solder (48 ± 12 mm Hg) and in the cuts sealed only with albumin without laser welding (6.3 ± 4 mm Hg) than in the cuts treated with laser welding and albumin solder. In vivo experiment: mean surgical time was 140 ± 17 s in the laser-treated rabbits compared to 330 ± 30 s in the sutured controls (n = 6; p laser soldering revealed sealed corneal edges with a small gap bridged by coagulated albumin. The inflammatory reaction was minimal in contrast to the sutured controls. No thermal damage was detected at the wound edges. CO₂ laser soldering combined with the fiber-optic radiometer is an effective, reliable, and rapid tool for the closure of corneal wounds, and holds advantages over conventional suturing in terms of leaking pressure and surgical time. Copyright © 2013 S. Karger AG, Basel.

  8. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  9. Die mites rondom die val van Troje en Vergilius se uitbeelding daarvan in die tweede boek van die Aeneïs

    J. Swanepoel


    Full Text Available Die mites oor die val van Troje vertel ’n aangrypende verhaal en in die tweede boek van die Aeneïs gee Vergilius op ’n besondere wyse gestalte daaraan. Maar Vergilius se vergestalting daarvan is slegs een van die variante van die verhaal.

  10. Lady Di - Die moderne Madonna

    Steuten, Ulrich; Strasser, Hermann


    Die authentischen Bekundungen von Trauer und Wertschätzung, die der bei einem Autounfall in Paris ums Leben gekommenen Prinzessin Diana weltweit entgegengebracht und seit Jahren von mehreren Seiten instrumentalisiert werden, sind unübersehbar. Das Leben und Sterben der Prinzessin von Wales ist nach Ansicht der Autoren geeignet, einer populären Mythenbildung in der modernen Gesellschaft Substanz zu verleihen. Vor allem bietet es die Möglichkeit, einen modernen Kult zu etablieren, der sich im Z...

  11. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao


    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  12. The influence of heat treatment on properties of lead-free solders

    Lýdia Trnková Rízeková


    Full Text Available The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC layers at the copper substrate - solder interface were examined before and after heat treatment at 150°C for 50, 200, 500 and 1000 hours. The thickness of IMC layers of the Cu6Sn5 phase was growing with the increasing time of annealing and shown the typical scallops. For the heat treatment times of 200 hours and longer, the Cu3Sn IMC layers located near the Cu substrate were also observed. The experiments showed there is a link between the thickness of IMC layers and decrease of the shear strength of solder joints. In general, the joints made of the ternary solder showed higher shear strength before and after heat treatment in comparison to joints from solder SnCu0.7.

  13. Application of robust color composite fringe in flip-chip solder bump 3-D measurement

    Kuo, Chung-Feng Jeffrey; Wu, Han-Cheng


    This study developed a 3-D measurement system based on flip-chip solder bump, used fringes with different modulation intensities in color channels, in order to produce color composite fringe with robustness, and proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability. The experimental results showed that the average measurement accuracy is 0.43μm and the standard deviation is 1.38 μm. The results thus proved that the proposed 3-D measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe modulation configurations were tested to overcome the problem of reflective coefficient between the flip-chip base board and the solder bump. The proposed system has a good measurement results and robust stability in the solder bump measurement, and can be used for the measurement of 3-D information for micron flip-chip solder bump application.

  14. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

    Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon


    The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

  15. Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

    Lutum, R; Scheuerlein, C


    For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range from RT to 20 K. A cryocooler set-up has been adapted such that a test current of 150 A could be injected for accurate resistance measurements in the low nΩ range. To study the influence of the solder bulk resistivity on the overall splice resistance, connections produced with Sn96Ag4 and Sn77.2In20Ag2.8 have been studied as well. The influence of the Sn60Pb40 solder resistance is negligible when measuring the splice resistance in a longitudinal configuration over a length of 6 cm. In a transverse measurement configuration the splice resistance is significantly influenced by the solder. The connections prepared with Sn77.2In20Ag2.8 show significantly higher resistance values, as expected from the relatively high sol...

  16. In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints

    Shi, Liting; Mei, Yunhui; Chen, Gang; Chen, Xu


    Reflow voids created by solder oxidation reduce the reliability of lap joints. In situ visualization of reflow voids in Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints under cyclic stressing was realized by X-ray computed tomography (CT), while the ratcheting deformation of the solder joints was monitored by a non-contact displacement detecting system (NDDS). The results revealed that the shape evolution of reflow voids in solder joints, as characterized by the sphericity of the voids, can be divided into three stages: i.e., the initial stage with a sharp drop, a stable stage, and a rapidly declining stage. A new evolution law for describing the progress of sphericity was proposed, and was further introduced into a viscoplastic constitutive model based on the OW-AF nonlinear kinematic hardening rule. The damage-coupled OW-AF model yielded an accurate estimation of the whole-life ratcheting behavior of Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints. [Figure not available: see fulltext.

  17. Improvement of the auto wire feeder machine in a de-soldering process

    Niramon Nonkhukhetkhong


    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  18. The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

    Lee, Tae-Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien-Fu; Duh, Jeng-Gong


    The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high- G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

  19. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

    Kang, Sung K.; Leonard, Donovan; Shih, Da-Yuan; Gignac, Lynne; Henderson, D. W.; Cho, Sungil; Yu, Jin


    The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications of large Ag3Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to suppress the formation of large Ag3Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed.

  20. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

    Leinenbach, C.; Valenza, F.; Giuranno, D.; Elsener, H. R.; Jin, S.; Novakovic, R.


    Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

  1. Metal ion release from silver soldering and laser welding caused by different types of mouthwash.

    Erdogan, Ayse Tuygun; Nalbantgil, Didem; Ulkur, Feyza; Sahin, Fikrettin


    To compare metal ion release from samples welded with silver soldering and laser welding when immersed into mouthwashes with different ingredients. A total of 72 samples were prepared: 36 laser welded and 36 silver soldered. Four samples were chosen from each subgroup to study the morphologic changes on their surfaces via scanning electron microscopy (SEM). Each group was further divided into four groups where the samples were submerged into mouthwash containing sodium fluoride (NaF), mouthwash containing sodium fluoride + alcohol (NaF + alcohol), mouthwash containing chlorhexidine (CHX), or artificial saliva (AS) for 24 hours and removed thereafter. Subsequently, the metal ion release from the samples was measured with inductively coupled plasma mass spectrometry (ICP-MS). The metal ion release among the solutions and the welding methods were compared. The Kruskal-Wallis and analysis of variance (ANOVA) tests were used for the group comparisons, and post hoc Dunn multiple comparison test was utilized for the two group comparisons. The level of metal ion release from samples of silver soldering was higher than from samples of laser welding. Furthermore, greater amounts of nickel, chrome, and iron were released from silver soldering. With regard to the mouthwash solutions, the lowest amounts of metal ions were released in CHX, and the highest amounts of metal ions were released in NaF + alcohol. SEM images were in accord with these findings. The laser welding should be preferred over silver soldering. CHX can be recommended for patients who have welded appliances for orthodontic reasons.

  2. Neurokognitiewe integrasie en die leerproses

    Johan J. Du Preez


    Full Text Available The purpose of this article, "Neuro-cognitive integration and the learning process'; is to find principles and strategies for the development of brain potential and the optimal integration of subject matter. Eight neuro-cognitive systems are identified and their importance to the integration of subject matter is emphasized. These systems are cortical energy, coding, planning and controlling, as well as the verbal sequential, non-verbal holistic, physical-motor, social effective and the subconscious. The relevant principles and strategies can serve as basis for mainstream and special education, guidance as well as psychotherapy. Die doe! met hierdie artikel is om beginsels en strategiee te vind om breinpotensiaal te ontsluit en leerstof optimaal te integreer. Aan die hand van 'n neurokognitiewe model word 'n aantal beginsels en strategiee bespreek en die verband met die leerproses word aangetoon. Agt neurokognitiewe sisteme is gei'dentifiseer en die belangrike rot wat dit speel ten opsigte van die integrasie van leerstof word beklemtoon. Genoemde sisteme sluit die volgende in: kortikale energie, kodering, beplanning en kontrolering, asook die verbaal-sekwensiele, nieverbaal- holistiese, fisiek-motoriese, sosio-affektiewe en die subbewuste. Genoemde beginsels en strategiee kan oak dien as grondslag vir hoofstroomonderwys, spesialiseringsonderwys, voorligting sowel as psigoterapie.

  3. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints

    Yang, Zhongbao; Zhou, Wei; Wu, Ping, E-mail:


    Highlights: •The electromigration behaviors of the composite solder joints were investigated. •The presence of Ni altered the morphology of the IMC layer after reflow. •Carbon nanotube network was observed in solder matrix. •Current crowding occurred at the carbon nanotube networks. •The electromigration effect of composite solder joint was suppressed effectively. -- Abstract: The electromigration behaviors of line-type Cu/Sn–Ag–Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni){sub 6}Sn{sub 5} intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.

  4. Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly

    Boesenberg, Adam James

    The global electronic assembly community is striving for a robust replacement for leaded solders due to increased environmental regulations. A family of Pb-free solder alloys based on Sn-Ag-Cu (SAC) compositions has shown promise; but reliability issues in certain assembly and operating environments have arisen. Elemental (X) additions (Al, Mn, Zn) to SAC3595 were developed recently for better control of heterogeneous nucleation in solder joint solidification. Cu substrate solderability of these SAC+X alloys was investigated at concentrations between 0.01-0.25 wt. % using globule wetting balance tests due to concern about increased oxidation during reflow. Asymmetric four point bend (AFPB) tests were conducted on as-soldered and thermally aged specimens to investigate correlation between decreased shear strength and extended aging time; a common phenomenon seen in solder joints in service. Composition dependence of these X additions also was explored in simplified Cu joints by differential scanning calorimetry (DSC) and joint microstructure analysis to determine the coupling between undercooling and solidification morphology on single and multiple reflow cycles. Interesting observations by methods such as x-ray diffraction (XRD) and nano-indentation of SAC solder joints with aluminum elemental additions led to promising results and provided a possible solution to promoting heterogeneous nucleation and high reliability in these solder alloys.

  5. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

    Vianco, P.; Rejent, J. [Sandia National Labs., Albuquerque, NM (United States); Artaki, I.; Ray, U.; Finley, D.; Jackson, A. [AT and T Bell Labs., Princeton, NJ (United States)


    Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing joints. Both alloys exhibited declines in their melting temperatures with greater Sn-Pb additions. The ring-in-plug shear strength of the Sn-Ag-Cu-Sb solder increased slightly with Sn-Pb levels while the Sn-Ag-Bi alloy experienced a strength loss. The mechanical behavior of the SOIC (Small Outline Integrated Circuit) Sn-Ag-Bi solder joints reproduced the strength levels were insensitive to 10,106 thermal cycles. The Sn-Ag-Cu-Sb solder showed a slight decrease in the gull wing joint strengths that was sensitive to the Pb content of the surface finish.

  6. Modeling Material Properties of Lead-Free Solder Alloys

    Guo, Zhanli; Saunders, Nigel; Miodownik, Peter; Schillé, Jean-Philippe


    A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys.

  7. Op die grens van vakwetenskap en filosofie

    M Elaine Botha


    Full Text Available Die begrip “grens” soos dit voorkom in die titel is vir meerdere uitleg vatbaar. Eerstens sou dit kon dui op ’n onoorskreibare punt tussen die filosofie en die vakwetenskappe, so iets soos ’n grenspaal of baken, met ander woorde ’n punt van waterdigte skeiding tussen die domein van die filosofie en die vakwetenskappe. As ’n mens soms die dramatiese grensgevegte tussen die filo­ sofie en die vakwetenskappe in die wetenskaplike literatuur beskou1 dan blyk dit kennelik noodsaaklik te wees om wel sodanige grens te stel, veral ten einde die gevaar van weten­ skaplike terrorisme van die een of die ander kant die hoof te bied.

  8. het die reformasie die leer gered en aanbidding verloor?

    B. Spoelstra, emeritusprofessor in Diakoniologiese Vakke, Fakulteit Teo- logie, P.U. vir C.H.O. (Skool vir ... Van der Leeuw sê liturgiek en leer is verwant en die geskiedenis van liturgie weerspieël die ...... VAN LEEUWEN G. 1946. Liturgiek.

  9. Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

    Lin, D. C.; Srivatsan, T. S.; Wang, G.-X.; Kovacevic, R.


    This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu6Sn5, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu6Sn5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu6Sn5 intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in

  10. Die wysgerige konsepsie van Thomas van Aquino

    Thomas Van Aquino


    Full Text Available Samevattend is tot dusver die volgende aangetoon: Die werklikheid vertoon volgens Thomas 'n hierargiese struktuur. Daar is verskillende grade van syn. God is die hoogste, die volheid van syn, en by die laere synsniveaus is daar steeds 'n verdere verwydering van hierdie synsvolmaaktheid in die rigting van absolute afwesigheid van syn. Hierdie synshiërargie is volgens die vorm-materieskema opgebou. Die materie in die hoëre synslaag word vorm vir die laere, of omgekeerd: die vorm van die laere is die materie vir die hoëre dinge. God is absoluut suiwer vorm of wet (essensie. Die vorme van die dinge is die goddelike wet (genoem exemplar, similitudo, ratio, verbum of imago wat deur God daarin geskape is. God druk op dié wyse sy gelykenis op wyse uit. Sy absolute volmaaktheid kan alleen tot uitdrukking gebring word deur 'n veelheid en verskeidenheid van geskape dinge. God word deur Thomas die causa effiaiens en exemplaris genoem. Die verhouding tussen Skepper en geskape werklikheid is dus dié van oorsaak en gevolg. As gevolg van sy wetsidee word daar deur Thomas dus nie duidelik tussen Skepper en skepping onderskei nie, want skepping beteken volgens hom onder andere dat God iets goddeliks (die wet in die dinge lê. Via die goddelike wet in die dinge ingeskape, is daar 'n sekere kontinuiteit tussen God en kosmos.

  11. Numerical optimization of die geometry in open die forging

    Christiansen, Peter; Hattel, Jesper Henri; Bay, Niels


    This paper deals with numerical optimization of open die forging of large metallic ingots made by casting implying risk of defects, e.g. central pores. Different material hardening properties and die geometries are combined in order to investigate, which geometry gives rise to maximum closure...... of a centreline hole in a single compression operation. Friction is also taken into account. The numerical analysis indicates that a lower die angle of approximately 140o results in the largest centreline hole closure for a wide range of material hardening. The value of optimum die angle is not influenced...... by friction, which was found only to change the degree of centreline porosity closure in case of small lower die angle....

  12. Statues Also Die

    Pierre-Philippe Fraiture


    Full Text Available “African thinking,” “African thought,” and “African philosophy.” These phrases are often used indiscriminately to refer to intellectual activities in and/or about Africa. This large field, which sits at the crossroads between analytic philosophy, continental thought, political philosophy and even linguistics is apparently limitless in its ability to submit the object “Africa” to a multiplicity of disciplinary approaches. This absence of limits has far-reaching historical origins. Indeed it needs to be understood as a legacy of the period leading to African independence and to the context in which African philosophy emerged not so much as a discipline as a point of departure to think colonial strictures and the constraints of colonial modes of thinking. That the first (self-appointed exponents of African philosophy were Westerners speaks volumes. Placide Tempels but also some of his predecessors such as Paul Radin (Primitive Man as Philosopher, 1927 and Vernon Brelsford (Primitive Philosophy, 1935 were the first scholars to envisage this extension of philosophy into the realm of the African “primitive.” The material explored in this article – Statues Also Die (Marker, Resnais, and Cloquet, Bantu Philosophy (Tempels, The Cultural Unity of Negro Africa (Cheikh Anta Diop, and It For Others (Duncan Campbell - resonates with this initial gesture but also with the ambition on part of African philosophers such as VY Mudimbe to challenge the limits of a discipline shaped by late colonialism and then subsequently recaptured by ethnophilosophers. Statues Also Die is thus used here as a text to appraise the limitations of African philosophy at an early stage.  The term “stage,” however, is purely arbitrary and the work of African philosophers has since the 1950s often been absorbed by an effort to retrieve African philosophizing practices before, or away from, the colonial matrix. This activity has gained momentum and has been

  13. An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

    Saud Norainiza


    Full Text Available In this research, varying fraction of titanium oxide (TiO2 reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX. The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC formation at the interface as will be discussed further.

  14. Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

    SHEN Jun; LIU Yongchang; Han Yajing; GAO Houxiu


    A lead-free Sn-3.5Ag solder was prepared by rapid solidification technology. The high solidification rate, obtained by rapid cooling, promotes nucleation, and suppresses the growth of Ag3Sn intermetallic compounds (IMCs) in Ag-rich zone, yielding fine Ag3Sn nanoparticulates with spherical morphology in the matrix of the solder. The large amount of tough homogeneously-dispersed IMCs helps to improve the surface area per unit volume and obstructs the dislocation lines passing through the solder, which fits with the dispersion-strengthening theory. Hence, the rapidly-solidified Sn-3.5Ag solder exhibits a higher microhardness when compared with a slowly-solidified Sn-3.5Ag solder.


    Pavol Šebo


    Full Text Available Developing and microstructure of lead-free Sn-Cu solders containing 3, 5 and 10 wt. % of copper in bulk as well as in ribbon form is presented. Wetting of copper substrate by these solders at the temperatures 300, 350 and 400°C in air (partially in N2+10H2 during 1800 s was studied by sessile drop method. Joints Cu – solder – Cu were prepared at 300°C and 1800 s in air as well as in gas mix and their shear strength was measured. The microstructure was studied by light and scanning electron microscopy (SEM equipped with energy dispersive X-ray analyzer and standard X-ray diffraction machine. Wetting angle decreases with increasing wetting temperature. Wetting angle increased for higher (10 wt. % amount of copper in solder. Shear strength of the joints decreases with increasing the copper concentration in solder.

  16. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

    Ren, Guang [Stokes Laboratories, Bernal Institute, University of Limerick (Ireland); Department of Civil Engineering and Materials Science, University of Limerick (Ireland); Wilding, Ian J. [Henkel Ltd, Hemel Hempstead (United Kingdom); Collins, Maurice N., E-mail: [Stokes Laboratories, Bernal Institute, University of Limerick (Ireland)


    Due to its commercial potential and the technological challenges associated with processing, low temperature soldering is a topic gaining widespread interest in both industry and academia in the application space of consumer and “throw away” electronics. This review focuses on the latest metallurgical alloys, tin zinc (Sn–Zn) and tin bismuth (Sn–Bi), for lower temperature processed electronic interconnections. The fundamentals of solder paste production and flux development for these highly surface active metallic powders are introduced. Intermetallic compounds that underpin low temperature solder joint production and reliability are discussed. The influence of alloying on these alloys is described in terms of critical microstructural changes, mechanical properties and reliability. The review concludes with an outlook for next generation electronic interconnect materials. - Highlights: • Review of the latest advances in Sn–Zn and Sn–Bi solder alloys. • Technological developments underpinning low temperature soldering. • Micro alloying influences on next generation interconnect materials.

  17. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning


    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  18. Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates

    Satyanarayan; Prabhu, K. N.


    The effect of surface roughness of copper substrate on the reactive wetting of Sn-Ag-Cu solder alloys and morphology of intermetallic compounds (IMCs) was investigated. The spreading behavior of solder alloys on smooth and rough Cu substrates was categorized into capillary, diffusion/reaction, and contact angle stabilization zones. The increase in substrate surface roughness improved the wetting of solder alloys, being attributed to the presence of thick Cu3Sn IMC at the interface. The morphology of IMCs transformed from long needle shaped to short protruded type with an increase in the substrate surface roughness for the Sn-0.3Ag-0.7Cu and Sn-3Ag-0.5Cu solder alloys. However, for the Sn-2.5Ag-0.5Cu solder alloy the needle-shaped IMCs transformed to the completely scallop type with increase in the substrate surface roughness. The effect of Ag content on wetting behavior was not significant.

  19. Die Presbiter by Lukas en Paulus

    L. Floor


    Full Text Available In die jongste navorsing oor Lukas word die skrywer van die derde evangelieverhaal en die Handelinge van die Apostels aan ons bekend gestel as ’n teoloog wat uit die ‘Sitz im Leben’ (uit die situasie van sy eie tyd die boodskap aangaande Christus interpreteer . Lukas sou hom by sy interpretasie van die Christusboodskap laat lei het deur ’n bepaalde dogmatiese ‘Verstandnis’ waardeur hy homself verraai as ’n teoloog van die na-apostoliese tyd.

  20. A statistical mechanics model to predict electromigration induced damage and void growth in solder interconnects

    Wang, Yuexing; Yao, Yao; Keer, Leon M.


    Electromigration is an irreversible mass diffusion process with damage accumulation in microelectronic materials and components under high current density. Based on experimental observations, cotton type voids dominate the electromigration damage accumulation prior to cracking in the solder interconnect. To clarify the damage evolution process corresponding to cotton type void growth, a statistical model is proposed to predict the stochastic characteristic of void growth under high current density. An analytical solution of the cotton type void volume growth over time is obtained. The synchronous electromigration induced damage accumulation is predicted by combining the statistical void growth and the entropy increment. The electromigration induced damage evolution in solder joints is developed and applied to verify the tensile strength deterioration of solder joints due to electromigration. The predictions agree well with the experimental results.

  1. Bosonisation and Soldering of Dual Symmetries in Two and Three Dimensions

    Banerjee, R


    We develop a technique that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, thereby leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usual gauge invariant expression leading to the Schwinger model or, alternatively, the Thirring model. Likewise, two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. The current bosonisation formulas are given, both in the original independent formulation as well as the effective theory, and shown to yield consistent results for the correlation functions. Similar features also hold for quantum electrodynamics in three dimensions.

  2. Multistate Degradation Mo del for Prognostics of Solder Joints Under Vibration Conditions

    TANG Wei; JING Bo; HUANG Yifeng; SHENG Zengjin; JIAO Xiaoxuan


    This paper develops a multistate degra-dation structure of the solder joints which can be used under various vibration conditions based on nonhomoge-neous continuous-time hidden semi-Markov process. The parameters of the structure were estimated to illustrate the stochastic relationship between the degradation pro-cess and the monitoring indicator by using unsupervised learning methods. Random vibration tests on solder joints with different levels of power spectral density and fixed forms were conducted with a real time monitoring electri-cal resistance to examine the suitability of the model. It was experimentally verified that the multistate degrada-tion structure matches the experimental process reason-ably and accurately. Based on this multistate degradation model, the online prognostics of solder joint were analyzed and the results indicated that faults or failures can be de-tected timely, leading to appreciate maintenance actions scheduled to avoid catastrophic failures of electronics.

  3. The Lead-Free Solder Selection Method and Process Optimization Based on Design of Experiment

    Wang Bing


    Full Text Available In the study, through researching the characteristic of the lead-free solder, we introduce the method of QFD (Quality Function Deployment to transform the demand of production properties and process into the technical demand of the lead-free solder, thus we could transform the demand concept of sampling into a concrete performance index. Finally we can obtain two parameters of the technological competitive power index and market competitive power index to evaluate performance of the lead-free solder through making a series of experiments. We utilize the design of experiment method to find out key parameter of process and the best collocation of parameter, which make the co planarity of tin ball descend to 149 from 178 and promote the process’s ability up to 95.2 from 85%.

  4. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Wolfe, Larry


    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  5. High-precision optomechanical lens system for space applications assembled by a local soldering technique

    Pleguezuelo, Pol Ribes; Koechlin, Charlie; Hornaff, Marcel; Kamm, Andreas; Beckert, Erik; Fiault, Guillaume; Eberhardt, Ramona; Tünnermann, Andreas


    Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glass, ceramics, and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard using specifications and requirements found for the optical beam expander for the European Space Agency EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands of handling high mechanical and thermal loads without losing the optical performance. Finally, a high-precision optomechanical lens mount has been assembled with minimal localized stress (<1 MPa) showing outstanding performance in terms of wave-front error and beam depolarization ratio before and after environmental tests.

  6. Research and application of visual location technology for solder paste printing based on machine vision

    Luosi WEI; Zongxia JIAO


    A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and then the design and implementation of the visual location system are described. In the system, two key techniques are completed by secondary development based on VisionPro.One is accurate image location solved by the pattern-based location algorithms of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate. Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming, and high-speed location of objects whose appearance is rotated, scaled, and/or stretched.

  7. Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials

    Mavoori, Hareesh; Ramirez, Ainissa G.; Jin, Sungho


    The surfaces of electronic and optical materials such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamond, silicon, and GaAs are known to be very difficult to bond with low melting point solders (<300 °C). We have achieved a direct and powerful bonding on these surfaces by using low temperature solders doped with rare-earth elements. The rare earth is stored in micron-scale, finely-dispersed intermetallic islands (Sn3Lu or Au4Lu), and when released, causes chemical reactions at the interface producing strong bonds. These solders directly bond to semiconductor surfaces and provide ohmic contacts. They can be useful for providing direct electrical contacts and interconnects in a variety of electronic assemblies, dimensionally stable and reliable bonding in optical fiber, laser, or thermal management assemblies.

  8. Single Image Camera Calibration in Close Range Photogrammetry for Solder Joint Analysis

    Heinemann, D.; Knabner, S.; Baumgarten, D.


    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  9. Awareness of Dying Preface

    Barney G. Glaser, PhD, Hon. PhD


    Full Text Available Recently The New York Times reported: “VERY ILL CHILDREN TOLD OF DISEASE; Leukemia Patients at N.I.H. Not Shielded From Truth. . . . A child should always be told the truth, even when he has an incurable disease such as leukemia, according to two researchers who interviewed 51 children hospitalized at the National Cancer Institute, Bethesda, Maryland, for treat¬ment of leukemia.” This kind of news item reflects the growing concern among researchers and public about matters which touch on morality as much as on the technical aspects of medi¬cine. The rapidly increasing proportion of elderly people in the American population presents a range of personal and social questions; not the least is how they view their newly won longevity (often including anticipated years of chronic disease as well as their attitudes toward death. In consequence, many geriatric specialists are beginning to study American attitudes toward death, while others, spurred on by what seems a sense-less prolonging of life within hospital walls by medical tech¬nology run wild, are raising questions about death and dying in American life.

  10. Adapt or die?

    Visser, S S; Nel, A H


    The worldwide economic recession and the concomitant limited stock of finances have had an influence on the available money of every household and have also inhibited the improvement of socio-economic conditions and medicine. The Reconstruction and Development Programme (RDP) has the objective of improving the living conditions of the people with regard to housing, education, training and health care. The latter seems to be a major problem which has to be addressed with the emphasis on the preventive and promotional aspects of health care. A comprehensive health care system did not come into being property in the past because of the maldistribution of health care services, personnel and differences in culture and health care beliefs and values. The question that now arises, is how to render a quality health care service within the constraints of inadequate financing and resources. A comprehensive literature study has been done with reference to quality health care and financing followed by a survey of existing health services and finances. Recommendations are made about minimum requirements to be accepted if one were to adapt rather than die in terms of the provision of healthcare: the decentralization and rationalization of the administration of health care, the stress on and realization of effective and efficient primary health care, the acceptance of participative management in health providing organizations, the provision of financial management training for health care managers and the application of management accounting principles for the improvement of the efficiency and effectiveness of management.

  11. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.


    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  12. Die etiek van Karl Barth

    J. H. van Wyk


    Full Text Available Die etiek van Barth kan nie reg verstaan word sonder begrip van sy ganse teologiese agtergrond en opset, en ek wil byvoeg: sonder die besondere tydsomstandighede (oorlog! waarin hy geleef en gewerk het nie. Dit is verder bekend dat in sy teologiese ontwikkeling verskillende figure groot invloed op hom uitgeoefen het.

  13. Die Parlamentswahlen 2008 in Malaysia

    Reher, Stefanie; Knirsch, Thomas


    Nach den Parlamentswahlen vom März 2008 in Malaysia deutet manches auf einen politischen Umbruch hin: Die regierende Barisan Nasional (BN), die sich bislang einer komfortablen Zweidrittelmehrheit von 91,4 Prozent der Sitze im Parlament des Landes erfreut hatte, rutschte auf 63,1 Prozent ab und das...

  14. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Mohammad Sadegh Nourbakhsh


    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  15. Effect of Ag on Sn–Cu and Sn–Zn lead free solders

    Alam S.N.


    Full Text Available Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM, filed emission scanning electron microscope (FESEM, electron diffraction X-ray spectroscopy (EDX and X-ray diffraction (XRD. Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC. Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

  16. The microstructure and properties of as-cast Sn-Zn-Bi solder alloys

    Mladenović Srba A.


    Full Text Available Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu, and Sb to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens’ microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders.

  17. Diffusion-controlled anisotropic growth of stable and metastable crystal polymorphs in the phase-field crystal model.

    Tegze, G; Gránásy, L; Tóth, G I; Podmaniczky, F; Jaatinen, A; Ala-Nissila, T; Pusztai, T


    We use a simple density functional approach on a diffusional time scale, to address freezing to the body-centered cubic (bcc), hexagonal close-packed (hcp), and face-centered cubic (fcc) structures. We observe faceted equilibrium shapes and diffusion-controlled layerwise crystal growth consistent with two-dimensional nucleation. The predicted growth anisotropies are discussed in relation with results from experiment and atomistic simulations. We also demonstrate that varying the lattice constant of a simple cubic substrate, one can tune the epitaxially growing body-centered tetragonal structure between bcc and fcc, and observe a Mullins-Sekerka-Asaro-Tiller-Grinfeld-type instability.

  18. Leierskapstyl en die lerende organisasie

    W. G. Victor


    Full Text Available Leadership style and the learning organisation. In the present highly competitive environment, it has become increasingly important for organisational leaders to establish a learning organisation. In this study the focus was on the extent of influence that the evolution of organisations, as determined by their relative level of leadership practises (leadership style, has on the establishment of a learning organisation. Opsomming Die daarstel van ’n lerende organisasie deur bedryfsleiers word toenemend belangrik in die hedendaagse hoogskompeterende omgewing. In hierdie studie is gefokus op die mate van beinvloeding wat die evolusie van organisasies, soos deur hul relatiewe vlak van demokratiese leierskapspraktyke (leierskapstyl bepaal, op die daarstelling van’n lerende organisasie het.

  19. Montessori-skole: die ander kant

    Monica Viljoen


    Full Text Available Na aanleiding van die artikel “Die invloed van die New Age-beweging op die onderwysagenda van die toekoms” deur Lien van Niekerk en Corinne Meier van die Departement Historiese Opvoedkunde van Unisa (vgl. Koers, 59 (1 1994:69-84 wil ek graag ’n ander sy van Montessori-skole onder die aandag van Koers lesers bring.

  20. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Georgiana PADURARU


    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  1. Suppressing tin whisker growth in lead-free solders and platings

    Hoffman, Elizabeth N; Lam, Poh-Sang


    A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

  2. The Numerical Analysis of Strain Behavior at Solder Joint and Interface of Flip Chip Package

    S; C; Chen; Y; C; Lin


    The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joint...

  3. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    Kostandyan, Erik; Sørensen, John Dalsgaard


    Traditionally assessment of reliability of electrical components is done by classical reliability techniques using failure rates as the basic measure of reliability. In this paper a structural reliability approach is applied in order to include all relevant uncertainties and to give a more detailed...... description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...

  4. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan


    , and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...... by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under...

  5. Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling

    马鑫; 钱乙余


    Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.

  6. Observation of amorphous chromium in modified C4 flip chip solder joints after thermal stress testing

    Hooghan, T.K.; Nakahara, S.; Hooghan, K.; Privette, R.W.; Bachman, M.A.; Moyer, R.S


    Flip chip reliability was evaluated using thermal stress tests at 150 deg. C. Electrical failures of flip chip devices were found to occur at the solder/under-bump-metallization interface by forming a porous amorphous chromium layer. The formation of the porous amorphous layer responsible for electrical failures resulted from the outdiffusion of copper atoms from a copper-chromium co-deposit, used as one of the under-bump-metallization layers. A strong interaction of Cu with the Sn component of the solder is the driving force of the Cu outdiffusion.

  7. Filosofiese tendense in die wordinggeskiedenis van ons verstaan van die fisiese natuur

    D. F. M. Strauss


    Full Text Available Die ontstaan van ’n lang tradisie van natuurwetenskaplike denke is in antieke Griekeland te vind – die bakermat van die Westerse beskawing en die bron van geartikuleerde rasionele besinning. Die vroegste fases van die Griekse kultuur het reeds geboorte geskenk aan ’n teoretiese nadenke oor die heelal. Die Pythagoreërs is veral bekend vir hul klem op die verklaringskrag van getalsverhoudinge. In hul tese dat “alles getal is” het hulle egter slegs rasionale getalle (breuke erken en gevolglik uiteindelik vasgeloop in die ontdekking van irrasionale getalle wat tot die geometrisering van die Griekse wiskunde gelei het en tegelyk die bedding gevorm het van waaruit ’n magtige tradisie van ruimte-metafisika gegroei het wat die hele middeleeuse tydperk omspan het. Die vermeende statiese syn is in die mees ekstreme geval – die skool van Parmenides en die argumente van Zeno teen veelheid en beweging – tot in die uiteindelike antinomiese konsekwensies daarvan deurdink. Dit was egter eers die vroeg-moderne tyd – die voorgangers en nakomelinge van Galilei – wat naas getal en ruimte ’n waardering ontwikkel het vir die verklaringskrag van beweging (vergelyk die klassieke meganistiese wêreldbeeld van die heelal as ’n meganisme van stofdeeltjies in beweging. Maar ook hierdie meganistiese reduksie (waardeur alle fisiese verskynsels herlei is tot die beweging van al of niegelade massapunte sou uiteindelik misluk omdat dit nie van die onomkeerbaarheid van fisiese prosesse rekenskap kon gee nie. Gevolglik beliggaam eers die fisika van die 20ste eeu ’n erkenning van die deurslaggewend-stempelende rol van energie-werking (dus van die fisiese aspek in die aard van stoflike dinge en prosesse. Die artikel word afgesluit met ’n vlugtige verduideliking van die implikasies van die voorafgaande argumentasie vir ’n benadering van die misterie van die bestaan van materie.

  8. Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

    Huang, M. L.; Zhao, N.


    Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

  9. Die rym in Jukstaposisie (T.T. Cloete en die regverdiging van enkele fonologiese begrippe

    D. P. Wissing


    Full Text Available Die taalkundige hon daarvan om te kan se dat die goeie literator sonder taalkundige insigte geen volledige cn behoorlike teksanalise kan docn nie. Maar die situasic kan ook omgekeerd wees: die letterkunde (eintlik die woordkunswerk kan ook vir die taalkunde van waarde wees. In hierdie stuk wil ek meer in die besonder probeer aantoon dat en hoe die taalkundige ook ondersteuning vir die invoering van bepaalde fonologiese begrippe uit die gedig kan vind. Vir die doel beperk ek my tot die bunde Jukstaposisie van T.T. Cloete.

  10. Ekumeniese kerkreg: Die aangewese weg?

    Pieter J. Strauss


    Full Text Available Die argument word gehoor dat kerkregeringstelsels soos dié van die Rooms-Katolieke, Lutherse en gereformeerde kerke van ’n transendentale aard was en is. Daardeur word geïmpliseer dat hierdie stelsels een transendentale, unieke vaste beginsel gebruik om ’n hele stelsel van kerkregering van buite af te bepaal. Volgens Leo Koffeman, ’n voorstander van ’n ekumeniese kerkreg, plaas hierdie stelsels hulself hiermee buite die diskoers oor kerkreg en kerkregering en die beweging van die Heilige Gees. ’n Ekumeniese kerkreg, daarenteen, is ten gunste van ’n gemeenskaplike kerkreg tussen kerke. Omdat dit verskillende tradisies bymekaar bring, is dit ’n kritiese en daarom beter benadering. Die skrywer oorweeg hierdie argumente krities in die lig van ’n gereformeerde benadering tot kerkreg.The argument is used that church political systems like that of the Roman Catholic, Lutheran and reformed churches were of a transcendental character. By that it is implied that it used one transcendental and unique ‘hard principle’ from outside to direct a system of church government. Such uniqueness, according to Leo Koffeman who advocates an ecumenical church polity, places it outside the church political discourse and the way of the Holy Spirit. An ecumenical church polity seeks a combined polity between churches and is, by bringing different traditions together, a critical and therefore better undertaking. The author examines these arguments critically in the light of a reformed church polity.

  11. 'n Begronde bedieningsmodel vir die diakonia van die gemeente

    15 Feb 2012 ... This work is licensed under the ... Grobler & Van der Walt 2008; Lingenfelter 2005; Armour & Browning 2000) en daarmee saam die ...... missionary structure of the church', Swedish Missiological Themes 93(3), 433–447.

  12. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

    Sun Peng [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China) and Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden)]. E-mail:; Andersson, Cristina [Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden); Wei Xicheng [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China); Cheng Zhaonian [Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden); Shangguan Dongkai [Flextronics International, San Jose, CA (United States); Liu Johan [Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai (China); Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Goeteborg (Sweden)


    The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 deg. C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn{sub 2} and finer Cu{sub 6}Sn{sub 5} particles, while only one ternary (Cu, Ni){sub 6}Sn{sub 5} interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn{sub 2} particles found in the Sn-Co-Cu solder and the Ag{sub 3}Sn particles found in the Sn-Ag-Cu solder, the Cu{sub 6}Sn{sub 5} particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 {mu}m, 4.3 {mu}m and 4.1 {mu}m, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point.

  13. Die Valenz als textgrammatische Kategorie

    Stojan Bračič


    Full Text Available Vor mehr als dreißig Jahren kam der französische Linguist Lucien Tesnière auf die geniale Idee, die gegenseitigen Relationen zwischen dem Verb eines Satzes einerseits und den anderen Satzteilen andererseits mit den chemischen Relationen in der Struktur eines Moleküls zu vergleichen. Die Eigenschaft des Verbs, andere Wörter an sich zu binden, nannte er Verbvalenz. Tesnière schreibt (schon 1959 wörtlich: "Man kann das Verb mit einem Atom vergleichen, an dem Häkchen angebracht sind, so daß es -je nach der Anzahl der Häkchen - eine wechselnde Zahl von Aktanten an sich ziehen und in Abhängigkeit halten kann. Die Anzahl der Häkchen, die ein Verb aufweist, und dementsprechend die Zahl der Aktanten, die es regieren kann, ergibt das, was man die Valenz des Verbs nennt" (Tesnière 1980: 161. Und weiter: "Aufgrund der strukturalen Konnexionen bestehen Dependenzbeziehungen (Abhängigkeitsbeziehungen zwischen den Wörtem. Jede Konnexion verbindet im Prinzip einen übergeordneten mit einem untergeordneten Term" (ibid., 27. Schematisch hat Tesnière diese Relationen bekannt­ lich in den sogenannten Stemmata (Strukturbaumen, graphischen Darstellungen von Konnexionsstrukturen; ibid., 384 wiedergegeben. Im Satz "Mon vieil ami chante cette chanson fort jolie" ist das Verb "chante" als "régissant" allen anderen Wortkonstituenten iibergeordnet, wobei die üntergeordneten Elemente "ami" und "chanson" in einer zweiten Rangstufe wiederum den untergeordneten Elementen "mon", "vieil", "cette", "jolie" übergeordnet sind. (Vgl. Greule 1982: 99.

  14. Die Dankesrede bei der Preisverleihung

    Elenmari Pletikos Olof


    Full Text Available Festliche Preisverleihungen sind Gelegenheiten, bei denen von den Preisträgerneine kurze Rede erwartet wird. Obwohl die Dankesrede eine kleinere Randgattung innerhalb des epideiktischen Genres ist, steht sie im Mittelpunkt des Ereignisses. Rhetorikhandbücher geben zahlreiche Ratschläge, wie eine gute Festrede vorbereitet werden soll, um zu unterhalten, zu bewegen und zu belehren. Ziel dieser Untersuchung ist es festzustellen, welche Eigenschaften der Dankesrede die Zuhörer als erwünscht oder unerwünscht wahrnehmen und welche Charakteristika am meisten zur Qualität festlicher Dankesreden beitragen. Das Korpus der gesprochenen Texte bilden 30 Dankesreden anlässlich kroatischer Preisverleihungen in den Bereichen Schauspiel, Sport, Musik, Fernsehen, Literatur und Wirtschaft. Die Audio-Aufnahmen der Dankesreden wurden einer Gruppe von Hörern zur Bewertung in folgenden Kategorien vorgelegt: interessant, geistreich, hoher Sprachstil, feierlich, emotiv, persönlich, originell, bescheiden, vorbereitet und spontan. Zusätzlich wurde zu jeder Rede die offene Frage gestellt, was dem Zuhörer an der Rede gefallen oder nicht gefallen habe. Die Resultate der Perzeptionsanalye lassen erkennen, dass die Interessantheit einer Rede mit der Eigenschaft des Geistreichen, des Originellen, des Emotionalen und des Persönlichen in Verbindung gebracht wird und die Eigenschaft des Festlichen im Wesentlichen nur mit dem hohen Sprachstil und der Vorbereitetheit des Textes korreliert. Einige Eigenschaften können sowohl erwünscht als auch unerwünscht sein, z. B. Dialekt, Persönliches und Kürze. Die besten Dankesreden haben Eigenschaften, die im Grunde schwer miteinander zu verbinden sind: Einerseits soll der Text vorbereitet sein (hoher Stil, Wortwahl, Figuren, Originalität der Geschichte, Humor, andererseits wird bei der Ausführung Spontaneität (Aufrichtigkeit, Emotionalität, Persönlichkeit erwartet.

  15. Die wêreld en ons

    D. W. Kruger


    Full Text Available Gedurende die jaar 1949 het Sowjet-Rusland twee groot suksesse behaal, n.l. die oorwinning van die Komniunisnie in China en die vervaardiging van die atoombom, albei gebeurtenisse wat vir sy westerse teenstanders ’n groot ontngtering was.

  16. Ueber die Neoperla-Arten aus Java

    Klapálek, Fr.


    Die Anregung zum Versuche die bisher aus Java bekannten Neoperla-Arten zusammenzustellen, gab mir die Sendung des Herrn E. Jacobson aus Semarang. Sie enthielt zwei Arten, von welchen die eine für mich neu war; ich nehme mir die Freiheit dieselbe ihrem Entdecker zu widmen. Bei dieser Gelegenheit habe

  17. Vraagstelling vir bemagtiging: die tradisionele klaskamer as ...

    Erna Kinsey

    ... loep geneem aan die hand van kwalitatiewe data wat tydens 'n empiriese studie op die voor- .... stelling in die klas opgelei, wat die hantering van die leerders se ant- ..... tent, but as part of the meta-communication in the classroom. Reasons.

  18. Afrika die Onbekende: Die Federasie van Rhodesie Njassaland (I

    J. S. van der Merwe


    Full Text Available Die grondgebied van die Federasie van Rhodesië en Njassaland strek oor 14° 15’ in ’n N.-S.-rigting (vanaf22“ 30’ S. to t 8° 15’ S. en ongeveervanaf 22° 0 to t 36° 0. Dit verteenwoordig afstande in albei gevalle van tussen 900 en 1000 myl.

  19. Decorative pleats; Falten, die schmuecken

    Marfurt, P. [Sulzer Rueti AG, Rueti (Switzerland)


    Pleated fabrics - also known as plisses - are very popular in the fashion industry. The pleats are normally created in a process which involves pressing and heat-setting. The Sulzer Ruti G6200 rapier weaving machine is now available with special equipment, which allows the pleats to be woven directly into the fabric. (orig.) [Deutsch] Im modischen Bereich sind Faltengewebe - sogenannte Plissees - sehr beliebt. Ueblicherweise entstehen die Falten in einem Press- und Thermofixiervorgang. Die Greiferwebmaschine G6200 von Sulzer Rueti ist jetzt mit einer speziellen Ausruestung lieferbar, mit deren Hilfe die Falten direkt in den Stoff gewebt werden koennen. (orig.)

  20. Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

    Wang, Wei-Lin, E-mail:; Tsai, Yi-Chia, E-mail:


    Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.% Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on the titanium content. Solder with a 0.5 wt.% Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 {+-} 0.64 MPa. The maximum bonding strength reached 22.24 {+-} 0.70 MPa at a 3 wt.% Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti phases at the joint interfaces. - Highlights: Black-Right-Pointing-Pointer Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. Black-Right-Pointing-Pointer The maximum bonding strength occurs at 3 wt.% Ti addition. Black-Right-Pointing-Pointer The Ti reacts with anodized Al oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti at joint interface.