Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates

International Nuclear Information System (INIS)

Amore, S.; Ricci, E.; Borzone, G.; Novakovic, R.

2008-01-01

The present work was carried out in the framework of the study of new lead-free solder alloys for technical applications in electronic devices. In the focus of this characterisation the wetting behaviour of several Sn-rich alloys belonging to the In-Sn, Au-Sn and Cu-Sn systems has been studied by measuring the contact angle variations on Cu and Ni substrates as a function of time and temperature. The interface between the alloy and the substrate has been analysed by the use of optical microscopy and scanning electron microscopy combined with energy-dispersive X-ray spectrometry in order to study the reaction between the alloy and the solid substrate and the possible formation of different compounds at the interface. A remarkable effect of the two different substrates on the behaviour of the contact angle as a function of temperature and on the morphology of the interface between the liquid solder and the solid substrate was observed for the In-Sn and Cu-Sn, while the Au-Sn system shows a very similar wetting behaviour on Cu and Ni

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Science.gov (United States)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

The influence of Ni additions on the relative stability of η and η′ Cu6Sn5

KAUST Repository

Schwingenschlö gl, Udo; Di Paola, Cono; Gourlay, C. M.; Nogita, K.

2010-01-01

We investigate how 5 at. % Ni influences the relative stability of η and η′ Cu6Sn5. Synchrotron x-ray diffraction shows that, while Cu6Sn5 exists as η′ at 25 and 150 °C and transforms to η on heating to 200 °C, Cu5.5Ni0.5Sn5 is best fit to η

PRECIPITATION BEHAVIOR IN A Cu-Sn-Ni-Zn-P LEAD FRAME MATERIAL

Institute of Scientific and Technical Information of China (English)

W.H. Tian; C.K. Yan; M.Nemoto

2003-01-01

Transmission electron microscopy (TEM) observations were carried out for examining the precipitation behavior in a Cu-Sn-Ni-Zn-P lead frame material. TEM observations revealed that the precipitate is hexagonal Ni5P2 and the orientation relationship between the Cu matrix and Ni5P2 precipitate is (111)fcc//(0001)hcp,[101]fcc//[11-20]hcp, where the suffix fcc denotes the Cu matrix and hcp denotes the hexagonal Ni5P2 precipitate. The NisP2 precipitate is ovoidal in shape at the beginning of aging at lower temperature. By prolonging the aging time or increasing the aging temperature, Ni5P2 precipitate grows and shows a rod-like shape. The Ni added Cu based lead frame material has a comparative mechanical properties with that of TAMAC15 which has been developed and used in electrical industry.

The crystal structure of (Nb$_{0.75}$Cu$_{0.25}$)Sn$_{2}$ in the Cu-Nb-Sn system

CERN Document Server

Martin, Stefan; Nolze, Gert; Leineweber, Andreas; Leaux, Floriane; Scheuerlein, Christian

2017-01-01

During the processing of superconducting Nb$_{3}$Sn wire, several intermediate intermetallic phases including a previously encountered Cu-Nb-Sn phase show up. The yet unknown crystal structure of this phase is now identified by a combination of different experimental techniques and database search to be of the hexagonal NiMg2 type with a proposed composition of about (Nb0.75Cu0.25)Sn2. The structure determination started from an evaluation of the lattice parameters from EBSD Kikuchi patterns from quenched material suggesting hexagonal or orthorhombic symmetry. A database search then led to the hexagonal NiMg2 type structure, the presence of which was confirmed by a Rietveld analysis on the basis of high energy synchrotron X-ray powder diffraction data. Assuming a partial substitution of Nb in orthorhombic NbSn2 by Cu, the change of the valence electron concentration provokes a structural transformation from the CuMg2 type for NbSn2 to the NiMg2 type for (Nb0.75Cu0.25)Sn2. In the previous literature the (Nb0.7...

Designing a New Ni-Mn-Sn Ferromagnetic Shape Memory Alloy with Excellent Performance by Cu Addition

Directory of Open Access Journals (Sweden)

Kun Zhang

2018-02-01

Full Text Available Both magnetic-field-induced reverse martensitic transformation (MFIRMT and a high working temperature are crucial for the application of Ni-Mn-Sn magnetic shape memory alloys. Here, by first-principles calculations, we demonstrate that the substitution of Cu for Sn is effective not only in enhancing the MFIRMT but also in increasing martensitic transformation, which is advantageous for its application. Large magnetization difference (ΔM in Ni-Mn-Sn alloy is achieved by Cu doping, which arises from the enhancement of magnetization of austenite due to the change of Mn-Mn interaction from anti-ferromagnetism to ferromagnetism. This directly leads to the enhancement of MFIRMT. Meanwhile, the martensitic transformation shifts to higher temperature, owing to the energy difference between the austenite L21 structure and the tetragonal martensite L10 structure increases by Cu doping. The results provide the theoretical data and the direction for developing a high temperature magnetic-field-induced shape memory alloy with large ΔM in the Ni-Mn-Sn Heusler alloy system.

Influence of the Si content on the microstructure and mechanical properties of Ti-Ni-Cu-Si-Sn nanocomposite alloys

Energy Technology Data Exchange (ETDEWEB)

Fornell, J., E-mail: Jordinafornell@gmail.com [Departament de Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain); Van Steenberge, N. [OCAS N.V., Pres. J.F. Kennedylaan 3, BE-9060 Zelzate (Belgium); Surinach, S.; Baro, M.D. [Departament de Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain); Sort, J. [Departament de Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain); Institucio Catalana de Recerca i Estudis Avancats (Spain)

2012-09-25

Highlights: Black-Right-Pointing-Pointer We study the effects of Si addition of Ti-Ni-Cu-Si-Sn alloy. Black-Right-Pointing-Pointer The microstructure evolution is correlated with the obtained mechanical and elastic properties. Black-Right-Pointing-Pointer Higher Young's modulus and larger hardness values are obtained in samples with higher Si contents. - Abstract: (Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4}){sub 100-x}Si{sub x} (x = 0, 2, 4 and 6) alloys were prepared by levitation melting mixtures of the high purity elements in an Ar atmosphere. Rods of 3 mm in diameter were obtained from the melt by copper mould casting. The effects of Si addition on the microstructure, elastic and mechanical properties of the Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4} alloy were investigated by scanning electron microscopy, X-ray diffraction, acoustic measurements and nanoindentation. The main phases composing the Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4} alloy are B2 NiTi, B19 Prime NiTi and tetragonal Ti{sub 2}Ni. Additional phases, like Ti{sub 5}Si{sub 3} or Ni{sub 2}Ti{sub 2}Si, become clearly visible in samples with higher Si contents. The microstructure evolution is correlated with the obtained mechanical and elastic properties. These alloys exhibit very high hardness values, which increase with the Si content, from 9 GPa (for x = 0) to around 10.5 GPa (for x = 6). The Young's modulus of Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4} (around 115 GPa) also increases significantly with Si addition, up to 160 GPa for x = 6.

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

Energy Technology Data Exchange (ETDEWEB)

Gain, Asit Kumar [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)], E-mail: eeycchan@cityu.edu.hk; Yung, Winco K.C. [Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon (Hong Kong)

2009-05-25

The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

International Nuclear Information System (INIS)

Gain, Asit Kumar; Chan, Y.C.; Yung, Winco K.C.

2009-01-01

The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish

Science.gov (United States)

Lee, Tae-Kyu; Duh, Jeng-Gong

2014-11-01

The combined effects on long-term reliability of isothermal aging and chemically balanced or unbalanced surface finish have been investigated for fine-pitch ball grid array packages with Sn-3.0Ag-0.5Cu (SAC305) (wt.%) and Sn-3.5Ag (SnAg) (wt.%) solder ball interconnects. Two different printed circuit board surface finishes were selected to compare the effects of chemically balanced and unbalanced structure interconnects with and without board-side Ni surface finish. NiAu/solder/Cu and NiAu/solder/NiAu interconnects were isothermally aged and thermally cycled to evaluate long-term thermal fatigue reliability. Weibull plots of the combined effects of each aging condition and each surface finish revealed lifetime for NiAu/SAC305/Cu was reduced by approximately 40% by aging at 150°C; less degradation was observed for NiAu/SAC305/NiAu. Further reduction of characteristic life-cycle number was observed for NiAu/SnAg/NiAu joints. Microstructure was studied, focusing on its evolution near the board and package-side interfaces. Different mechanisms of aging were apparent under the different joint configurations. Their effects on the fatigue life of solder joints are discussed.

Incorporation of trace elements in Portland cement clinker: Thresholds limits for Cu, Ni, Sn or Zn

International Nuclear Information System (INIS)

Gineys, N.; Aouad, G.; Sorrentino, F.; Damidot, D.

2011-01-01

This paper aims at defining precisely, the threshold limits for several trace elements (Cu, Ni, Sn or Zn) which correspond to the maximum amount that could be incorporated into a standard clinker whilst reaching the limit of solid solution of its four major phases (C 3 S, C 2 S, C 3 A and C 4 AF). These threshold limits were investigated through laboratory synthesised clinkers that were mainly studied by X-ray Diffraction and Scanning Electron Microscopy. The reference clinker was close to a typical Portland clinker (65% C 3 S, 18% C 2 S, 8% C 3 A and 8% C 4 AF). The threshold limits for Cu, Ni, Zn and Sn are quite high with respect to the current contents in clinker and were respectively equal to 0.35, 0.5, 0.7 and 1 wt.%. It appeared that beyond the defined threshold limits, trace elements had different behaviours. Ni was associated with Mg as a magnesium nickel oxide (MgNiO 2 ) and Sn reacted with lime to form a calcium stannate (Ca 2 SnO 4 ). Cu changed the crystallisation process and affected therefore the formation of C 3 S. Indeed a high content of Cu in clinker led to the decomposition of C 3 S into C 2 S and of free lime. Zn, in turn, affected the formation of C 3 A. Ca 6 Zn 3 Al 4 O 15 was formed whilst a tremendous reduction of C 3 A content was identified. The reactivity of cements made with the clinkers at the threshold limits was followed by calorimetry and compressive strength measurements on cement paste. The results revealed that the doped cements were at least as reactive as the reference cement.

Evaluaciones microcalorimétricas no-isotermas en aleaciones de Cu-9Ni-5,5Sn templadas y deformadas en frío

Directory of Open Access Journals (Sweden)

Donoso, E.

2012-02-01

Full Text Available The thermal aging of both a quenched and a cold rolled homogeneous supersaturated Cu-9 % wt Ni-5.5 wt % Sn alloy has been studied from differential scanning calorimetry (DSC and microhardness measurements. An increase of the hardness during the aging of the quenched sample, because of the precipitation of a Υ´ phase, takes place. On the contrary, no hardness increase was observed during the aging of the cold rolled sample. A theoretical analysis of the enthalpy determined from the first DSC exothermic peak suggests that a segregation of the solute towards the dislocations occurs during the aging of the cold rolled alloy. The values of the n Avrami-Erofeev coefficients estimated from the kinetic analysis supports the above interpretations.

Se ha estudiado por calorimetría diferencial de barrido (DSC y medidas de microdureza, el comportamiento durante el recocido de una aleación Cu-9 % Ni-5,5 % Sn templada y deformada por laminación en frio al 50 %, respectivamente. Se ha concluido que durante el tratamiento térmico de la muestra templada tiene lugar un aumento de la microdureza atribuido a la precipitación de una fase Υ´ de composición (Cu_xNi_1x3Sn. Sin embargo, no se ha observado un aumento de dureza durante el recocido de la muestra deformada en frío. Este comportamiento se ha interpretado considerando que las dislocaciones generadas por la laminación en frío, favorecen la segregación de soluto (níquel y estaño hacia las dislocaciones en lugar de la formación de la fase (Cu_xNi1-x₃Sn. Tanto el análisis teórico de la entalpía determinada para esta etapa como los valores de los coeficientes n de Avrami-Erofeev determinados a partir de un análisis cinético apoyan esta interpretación.

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Science.gov (United States)

Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

2006-10-01

Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

Regularity in the formation of compounds in ternary R-Me-Sn systems, R - REM, Me - Fe, Co, Ni, Cu

International Nuclear Information System (INIS)

Skolozdra, R.V.; Komarovskaya, L.P.; Koretskaya, O.Eh.

1992-01-01

For the ternary alloy systems of (La, Y, Gd, Lu)-Fe-Sn, (Ce, Y, Gd)-Co-Sn, (Ce, Y, Gd, Lu)-Ni-Sn and (Pr, Gd, Lu)-Cu-Sn isothermal sections of phase diagrams were plotted within the range of 670 to 870 K. It was revealed that substitution of transition metal in the kFe-Co-Ni-Cu series led to changes both in a number of ternary stannides and their structural types. A tendency was observed in change of stannide numbers depending on quantity ratio of R and Me components. Crystallochemical analysis of compounds obtained showed that they could be treated as interstitial structures or lsuperstructures with respect to them. The results of magnetic properties measurements were used for explanation of structural features of ternary compounds considered

Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Science.gov (United States)

Chuang, T. H.; Lin, H. J.; Chuang, C. H.; Yeh, W. T.; Hwang, J. D.; Chu, H. S.

2014-12-01

A (Pb, Sn)Te thermoelectric element plated with a Ni barrier layer and a Ag reaction layer has been joined with a Cu electrode coated with Ag and Sn thin films using a solid-liquid interdiffusion bonding method. This method allows the interfacial reaction between Ag and Sn such that Ag3Sn intermetallic compounds form at low temperature and are stable at high temperature. In this study, the bonding strength was about 6.6 MPa, and the specimens fractured along the interface between the (Pb, Sn)Te thermoelectric element and the Ni barrier layer. Pre-electroplating a film of Sn with a thickness of about 1 μm on the thermoelectric element and pre-heating at 250°C for 3 min ensures the adhesion between the thermoelectric material and the Ni barrier layer. The bonding strength is thus increased to a maximal value of 12.2 MPa, and most of the fractures occur inside the thermoelectric material. During the bonding process, not only the Ag3Sn intermetallics but also Cu6Sn5 forms at the Ag3Sn/Cu interface, which transforms into Cu3Sn with increases in the bonding temperature or bonding time.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

Science.gov (United States)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

Structural stability of ternary C22–Zr6X2Co (X=Al, Ga, Sn, As, Sb, Bi, Te) and C22–Zr6Sn2T′ (T′=Fe, Co, Ni, Cu) compounds

International Nuclear Information System (INIS)

Colinet, Catherine; Crivello, Jean-Claude; Tedenac, Jean-Claude

2013-01-01

The crystal and electronic structures, and the thermodynamic properties of Zr 6 X 2 Co (X=Al, Ga, Sn, As, Sb, Bi, Te) and Zr 6 Sn 2 T′ (T′=Fe, Co, Ni, Cu) ternary compounds in the Fe 2 P-type structure have been investigated by means of first principle calculations. The calculated structural parameters are in good agreement with the experimental data. The total electronic densities of states as well as the Bader charges of the atoms have been computed. Both electronic and size effects allow to explain the stability of the ternary Zr 6 X 2 Co (X=Al, Ga, Sn, As, Sb, Bi, Te) and Zr 6 Sn 2 T′ (T′=Fe, Co, Ni, Cu) compounds. - Graphical abstract: Valence charge electronic localization function (ELF) calculated for Zr 6 Sb 2 Co compound. Display Omitted - Highlights: • Structural stability of Zr 6 X 2 T′ compounds (X: p element, T′: late transition metal) in the Fe 2 P-type structure. • First principles calculation of lattice parameters and enthalpies of formation. • Electronic densities of state in the series Zr 6 Sn 2 T′ (T′=Fe, Co, Ni, Cu). • Electronic densities of state in the series Zr 6 X 2 Co (X=Al, Ga, Sn, As, Sb, Bi, Te)

EFFECTS OF TIN ON HARDNESS, WEAR RATE AND COEFFICIENT OF FRICTION OF CAST CU-NI-SN ALLOYS

Directory of Open Access Journals (Sweden)

S. ILANGOVAN

2013-02-01

Full Text Available An investigation was carried out to understand the effects of Sn on hardness, wear rate and the coefficient of friction of spinodal Cu-Ni-Sn alloys. Alloys of appropriate compositions were melted in a crucible furnace under argon atmosphere and cast into sand moulds. Solution heat treated and aged specimens were tested for hardness, wear rate and the coefficient of friction. It was found that the hardness increases when the Sn content increases from 4% to 8% in the solution heat treated conditions. The peak aging time is found to decrease with an increase in the Sn content. Further, the coefficient of friction is independent of hardness whereas the wear rate decreases linearly with hardness irrespective of Sn content.

Martensitic transition, inverse magnetocaloric effect and shape memory characteristics in Mn{sub 48−x}Cu{sub x}Ni{sub 42}Sn{sub 10} Heusler alloys

Energy Technology Data Exchange (ETDEWEB)

Liu, Changqin [Department of Physics, Shanghai University, Shanghai 200444 (China); Li, Zhe [Reasearch center for magnetic materials and devices & Key Laboratory for Advanced Functional and Low Dimensional Materials of Yunnan Higher Education Institute, Qujing Normal University, Qujing 655011 (China); Zhang, Yuanlei [Department of Physics, Shanghai University, Shanghai 200444 (China); Reasearch center for magnetic materials and devices & Key Laboratory for Advanced Functional and Low Dimensional Materials of Yunnan Higher Education Institute, Qujing Normal University, Qujing 655011 (China); Liu, Yang; Sun, Junkun; Huang, Yinsheng; Kang, Baojuan [Department of Physics, Shanghai University, Shanghai 200444 (China); Xu, Kun [Reasearch center for magnetic materials and devices & Key Laboratory for Advanced Functional and Low Dimensional Materials of Yunnan Higher Education Institute, Qujing Normal University, Qujing 655011 (China); Deng, Dongmei [Department of Physics, Shanghai University, Shanghai 200444 (China); Jing, Chao, E-mail: cjing@staff.shu.edu.cn [Department of Physics, Shanghai University, Shanghai 200444 (China)

2017-03-01

In this paper, we have systematically prepared a serials of polycrystalline Mn{sub 48−x}Cu{sub x}Ni{sub 42}Sn{sub 10} alloys (x=0, 1, 3, 5, 6, 8, 10 and 12) and investigated the influence of the Cu doping on martensitic transition (MT) as well as magnetic properties. Experimental results indicate that the MT temperature and the martensite Curie temperature (T{sub c}{sup M}) shift to high temperature with increasing the substitution of Cu (from Mn rich alloy to Ni rich alloy), while the austenite Curie temperature (T{sub c}{sup A}) is almost unchanged. It was found that the structures undergo L2{sub 1} and 4O with the increasing of Cu concentration near room temperature. Therefore, the magnetostructural transition can be tuned by appropriate Cu doping in these alloys. Moreover, we mainly studied the multiple functional properties for inverse magnetocaloric effect and shape memory characteristics associated with the martensitic transition. A large positive isothermal entropy change of Mn{sub 48}Ni{sub 42}Sn{sub 10} was obtained, and the maximum transition entropy change achieves about 48 J/kg K as x=8. In addition, a considerable temperature-induced spontaneous strain with the value of 0.16% was obtained for Mn{sub 48}Ni{sub 42}Sn{sub 10} alloys.

Sintered Fe-Ni-Cu-Sn-C Alloys Made of Ball-Milled Powders

Directory of Open Access Journals (Sweden)

Romański A.

2014-10-01

Full Text Available The main objective of this paper was to perform sinterability studies of ball-milled Fe-12%Ni-6.4%Cu-1.6%Sn-0.6%C powders. A mixture of precisely weighed amounts of elemental iron, nickel and graphite, and pre-alloyed 80/20 bronze powders was ball-milled for 8, 30 and 120 hours. After cold-pressing at 400 MPa the specimens were sintered at 900oC for 30 minutes in a reducing atmosphere and subsequently tested for density and hardness as well as subjected to structural studies using scanning electron microscopy (SEM and X-ray diffraction (XRD analysis.

Structural stability of ternary C22–Zr{sub 6}X{sub 2}Co (X=Al, Ga, Sn, As, Sb, Bi, Te) and C22–Zr{sub 6}Sn{sub 2}T′ (T′=Fe, Co, Ni, Cu) compounds

Energy Technology Data Exchange (ETDEWEB)

Colinet, Catherine, E-mail: ccolinet@simap.grenoble-inp.fr [Science et Ingénierie des Matériaux et Procédés, Grenoble INP, UJF, CNRS, 38402 Saint Martin d’Hères, Cedex (France); Crivello, Jean-Claude [ICMPE-CMTR, CNRS UMR-7182, 2-8 rue Henri Dunant, 94320 Thiais (France); Tedenac, Jean-Claude [Institut de Chimie Moléculaire et des Matériaux I.C.G., UMR-CNRS 5253, Université Montpellier II, Place E. Bataillon, 34095 Montpellier Cedex 5 (France)

2013-09-15

The crystal and electronic structures, and the thermodynamic properties of Zr{sub 6}X{sub 2}Co (X=Al, Ga, Sn, As, Sb, Bi, Te) and Zr{sub 6}Sn{sub 2}T′ (T′=Fe, Co, Ni, Cu) ternary compounds in the Fe{sub 2}P-type structure have been investigated by means of first principle calculations. The calculated structural parameters are in good agreement with the experimental data. The total electronic densities of states as well as the Bader charges of the atoms have been computed. Both electronic and size effects allow to explain the stability of the ternary Zr{sub 6}X{sub 2}Co (X=Al, Ga, Sn, As, Sb, Bi, Te) and Zr{sub 6}Sn{sub 2}T′ (T′=Fe, Co, Ni, Cu) compounds. - Graphical abstract: Valence charge electronic localization function (ELF) calculated for Zr{sub 6}Sb{sub 2}Co compound. Display Omitted - Highlights: • Structural stability of Zr{sub 6}X{sub 2}T′ compounds (X: p element, T′: late transition metal) in the Fe{sub 2}P-type structure. • First principles calculation of lattice parameters and enthalpies of formation. • Electronic densities of state in the series Zr{sub 6}Sn{sub 2}T′ (T′=Fe, Co, Ni, Cu). • Electronic densities of state in the series Zr{sub 6}X{sub 2}Co (X=Al, Ga, Sn, As, Sb, Bi, Te)

Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits

International Nuclear Information System (INIS)

Boettinger, W.J.; Johnson, C.E.; Bendersky, L.A.; Moon, K.-W.; Williams, M.E.; Stafford, G.R.

2005-01-01

High purity bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 μm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min of plating proved that all electrodeposits had in-plane compressive stress. In several days, the surfaces of the Sn-Cu deposits, which have the highest compressive stress, develop 50 μm contorted hillocks and 200 μm whiskers, pure Sn deposits develop 20 μm compact conical hillocks, and Sn-Pb deposits, which have the lowest compressive stress, remain unchanged. The differences between the initial compressive stresses for each alloy and pure Sn is due to the rapid precipitation of Cu 6 Sn 5 or Pb particles, respectively, within supersaturated Sn grains produced by electrodeposition. Over longer time, analysis of beam deflection measurements indicates that the compressive stress is augmented by the formation of Cu 6 Sn 5 on the bronze/Sn interface, while creep of the electrodeposit tends to decrease the compressive stress. Uniform creep occurs for Sn-Pb because it has an equi-axed grain structure. Localized creep in the form of hillocks and whiskers occurs for Sn and Sn-Cu because both have columnar structures. Compact hillocks form for the Sn deposits because the columnar grain boundaries are mobile. Contorted hillocks and whiskers form for the Sn-Cu deposits because the columnar grain boundary motion is impeded

The effect of a fourth element (Co, Cu, Fe, Pd) on the standard enthalpy of formation of the Heusler compound Ni{sub 2}MnSn

Energy Technology Data Exchange (ETDEWEB)

Yin, Ming, E-mail: myin1@hawk.iit.edu; Nash, Philip

2016-05-15

The standard enthalpies of formation of quaternary Heusler compounds (X, Ni){sub 2}MnSn (X = Co, Cu, Fe, Pd) were investigated experimentally using high temperature direct reaction calorimetry. Lattice parameters of these compounds were determined using X-ray diffraction analysis. Microstructures were identified using scanning electron microscopy and energy dispersive spectroscopy. The effect of an additional X element on the standard enthalpy of formation of the Heusler compound Ni{sub 2}MnSn is discussed. - Highlights: • Enthalpies of formation of (X,Ni){sub 2}YZ (X = Co, Cu, Fe, Pd) were measured by drop calorimeters. • Magnetic contribution to enthalpy of formation plays an important role. • Introducing a fourth element could stabilize an unstable Heusler structure. • Lattice parameters do not necessarily obey the Vegard's law. • It is possible to tailor properties of Heusler compounds with enough background information.

Interfacial reaction of Ni{sub 3}Sn{sub 4} intermetallic compound in Ni/SnAg solder/Ni system under thermomigration

Energy Technology Data Exchange (ETDEWEB)

Yang, Yi-Shan; Yang, Chia-Jung; Ouyang, Fan-Yi, E-mail: fyouyang@ess.nthu.edu.tw

2016-07-25

The growth of Ni{sub 3}Sn{sub 4} intermetallic compound (IMC) between liquid–solid interface in micro-scale Ni/SnAg/Ni system was investigated under a temperature gradient of 160 °C/cm at 260 °C on a hot plate. In contrast to a symmetrical growth of Ni{sub 3}Sn{sub 4} on both interfaces under isothermally annealed at 260 °C, the interfacial Ni{sub 3}Sn{sub 4} IMC exhibited asymmetric growth under a temperature gradient; the growth of Ni{sub 3}Sn{sub 4} at cold interface was faster than that at hot side because of temperature gradient induced mass migration of Ni atoms from the hot end toward the cold end. It was found that two-stage growth behavior of Ni{sub 3}Sn{sub 4} IMC under a temperature gradient. A growth model was established and growth kinetic analysis suggested that the chemical potential gradient controlled the growth of Ni{sub 3}Sn{sub 4} at stage I (0–120 min) whereas the dynamic equilibrium between chemical potential gradient and temperature gradient forces was attained at the hot end at stage II (120–210 min). When dynamic equilibrium was achieved at 260 °C, the critical length-temperature gradient product at the hot end was experimentally estimated to be 489.18 μm × °C/cm and the moving velocity of Ni{sub 3}Sn{sub 4} interface due to Ni consumption was calculated to be 0.134 μm/h. The molar heat of transport (Q*) of Ni atoms in molten SnAg solder was calculated to be +0.76 kJ/mol. - Highlights: • Interfacial reaction in Ni/SnAg solder/Ni system under thermal gradient. • Growth rate of Ni{sub 3}Sn{sub 4} at cold end is faster than that at hot end. • Critical length-temperature gradient product at hot end is 489.2 μm°C/cm at 260 °C. • Velocity of Ni{sub 3}Sn{sub 4} moving interface is 0.134 μm/h during dynamic equilibrium. • Molar heat of transport (Q*) of Ni in molten SnAg was +0.76 kJ/mol.

Preparation of PtSnCu/C and PtSn/C electrocatalysts and activation by dealloying processes for ethanol electrooxidation; Preparacao de eletrocatalisadores PtSnCu/C e PtSn/C e ativacao por processos de dealloying para aplicacao na oxidacao eletroquuimica do etanol

Energy Technology Data Exchange (ETDEWEB)

Crisafulli, Rudy

2013-06-01

PtSnCu/C (with different Pt:Sn:Cu atomic ratios) and PtSn/C (50:50) electrocatalysts were prepared by borohydride (BR) and alcohol-reduction (AR) processes using H{sub 2}PtCl{sub 6}.6H{sub 2}O, SnCl{sub 2}.2H{sub 2}O and CuCl{sub 2}.2H{sub 2}O as metal sources, NaBH{sub 4} and ethylene glycol as reducing agents, 2-propanol and ethylene glycol/water as solvents and carbon black as support. In a further step, these electrocatalysts were activated by chemical (CD) and electrochemical (ED) dealloying processes through acid treatment and thin porous coating technique, respectively. These materials were characterized by energy dispersive X-ray, Xray diffraction, transmission electron microscopy, line scan energy dispersive Xray and cyclic voltammetry. Electrochemical studies for ethanol electro-oxidation were performed by cyclic voltammetry, chronoamperometry and in single Direct Ethanol Fuel Cell using Membrane Electrode Assembly (MEA). The anodic effluents were analysed by gas chromatography. The X-ray diffractograms of the as-synthesized electrocatalysts showed the typical face-centered cubic structure (FCC) of platinum and its alloys. After dealloying, the X-ray diffractograms showed that the Pt FCC structure was preserved. The crystallite sizes of the assynthesized electrocatalysts were in the range of <=2 nm to 3 nm and after dealloying there were no significant variations in sizes. The energy dispersive Xray analysis of the as-synthesized electrocatalysts showed a Pt:Sn and Pt:Sn:Cu atomic ratios similar to the nominal values. After chemical and electrochemical dealloying of the electrocatalysts the ranged Pt:Sn and Pt:Sn:Cu atomic ratios showed that Cu and Sn atoms were removed. However, chemical dealloying process proved to be more efficient for removing Cu and electrochemical dealloying for removing Sn. The line scan energy dispersive X-ray analysis showed that acid and electrochemical treatments were efficient to dealloying Cu and/or Sn superficial atoms of

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate

Energy Technology Data Exchange (ETDEWEB)

Kim, Yiseul; Kwon, Jeehye; Yoo, Dayoung; Park, Sungkyu; Lee, Dajeong; Lee, Dongyun [Pusan National University, Busan (Korea, Republic of)

2017-03-15

Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion barrier to Cu and Sn to form the IMCs. Detailed analysis of the microstructure is conducted using an electron probe micro-analyzer (EPMA). The addition of Ni softened the IMCs, which is determined based on the fracture toughness increasing (from 0.71 to 1.55 MPa√m) with the Ni layer thickness. However, above a critical amount of Ni involved in the Cu-Sn IMCs, the softening effect is diminished, and this could result from the segregation of Ni inside the IMCs. Therefore, the optimized condition must be determined in order to obtain a positive Ni effect on enhancing the reliability of the electronic circuits.

Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

Energy Technology Data Exchange (ETDEWEB)

Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

2016-08-15

The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

The tin-rich copper lithium stannides: Li3Cu6Sn4 and Li2CuSn2

International Nuclear Information System (INIS)

Fuertauer, Siegfried; Flandorfer, Hans; Effenberger, Herta S.

2015-01-01

The Sn rich ternary intermetallic compounds Li 3 Cu 6 Sn 4 (CSD-427097) and Li 2 CuSn 2 (CSD-427098) were synthesized from the pure elements by induction melting and annealing at 400 C. Structural investigations were performed by powder- and single-crystal XRD. Li 3 Cu 6 Sn 4 crystallizes in space group P6/mmm; it is structurally related to but not isotypic with MgFe 6 Ge 6 (a = 5.095(2) Aa, c = 9.524(3) Aa; wR 2 = 0.059; 239 unique F 2 -values, 17 free variables). Li 3 Cu 6 Sn 4 is characterized by two sites with a mixed Cu:Sn occupation. In contrast to all other Cu-Li-Sn compounds known so far, any mixed occupation was found for Cu-Li pairs only. In addition, one Li site is only half occupied. The second Sn rich phase is Li 2 CuSn 2 (space group I4 1 /amd, a = 4.4281(15) Aa, c = 19.416(4) Aa; wR 2 = 0.033; 213 unique F 2 -values, 12 atom free variables); it is the only phase in the Cu-Li-Sn system which is noted for full ordering. Both crystal structures exhibit 3D-networks which host Li atoms in channels. They are important for understanding the lithiation mechanism in Cu-Sn electrodes for Li-ion batteries.

Ultraviolet emission from low resistance Cu2SnS3/SnO2 and CuInS2/Sn:In2O3 nanowires

Directory of Open Access Journals (Sweden)

E. Karageorgou

2014-11-01

Full Text Available SnO2 and Sn:In2O3 nanowires were grown on Si(001, and p-n junctions were fabricated in contact with p-type Cu2S which exhibited rectifying current–voltage characteristics. Core-shell Cu2SnS3/SnO2 and CuInS2/Sn:In2O3 nanowires were obtained by depositing copper and post-growth processing under H2S between 100 and 500 °C. These consist mainly of tetragonal rutile SnO2 and cubic bixbyite In2O3. We observe photoluminescence at 3.65 eV corresponding to band edge emission from SnO2 quantum dots in the Cu2SnS3/SnO2 nanowires due to electrostatic confinement. The Cu2SnS3/SnO2 nanowires assemblies had resistances of 100 Ω similar to CuInS2/In2O3 nanowires which exhibited photoluminescence at 3.0 eV.

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Energy Technology Data Exchange (ETDEWEB)

Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

2017-03-01

In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction

Energy Technology Data Exchange (ETDEWEB)

Ho, Cheng-Ying; Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw

2014-11-14

A new multilayer metallization, ENEPIG (Electroless Ni(P)/Electroless Pd/Immersion Au) with ultrathin Ni(P) deposit (ultrathin-ENEPIG), was designed to be used in high frequency electronic packaging in this study because of its ultra-low electrical impedance. Sequential interfacial microstructures of commercial Sn–3.0Ag–0.5Cu solders reflowed on ultarthin-ENEPIG with Ni(P) deposit thickness ranged from 4.79 μm to 0.05 μm were first investigated. Accelerated thermal aging test was then conducted to evaluate the long-term thermal stabilization of solder joints. The results showed that P-rich intermetallic compound (IMC) layer formed when the Ni(P) thickness was greater than a critical vale (about 0.18 μm). Besides, it is interesting to mention that the growth of (Cu,Ni){sub 6}Sn{sub 5} and (Cu,Ni){sub 3}Sn IMCs was suppressed with the formation of P-rich layer, i.e., Ni{sub 3}P and Ni{sub 2}Sn{sub 1+x}P{sub 1−x} phase, even though the electroless-plated Ni(P) layer was exhausted at initial stage of reflow process. The atomic Cu flux in solder joints without P-rich layer was calculated to be several times larger than that with P-rich layer formation after calculation, which implies that the P-rich layer and ultrathin Ni(P) deposit in ENEPIG served as diffusion barrier against rapid Cu diffusion. - Highlights: • Microstructures in ultrathin-ENEPIG with various Ni(P) thickness are investigated. • P-rich IMC layer formed when the Ni(P) thickness is greater than 0.18 μm. • Secondary (Cu,Ni){sub 6}Sn{sub 5} formed when the Ni(P) thickness is between 0.18 and 0.31 μm. • Cu diffusion flux without P-rich layer is larger than those with P-rich layer. • P-rich layer in ultrathin-ENEPIG exhibits good diffusion barrier characteristic.

Determination of Cu, Mn, Ni and Sn in gasoline by electrothermal vaporization inductively coupled plasma mass spectrometry, and emulsion sample introduction

International Nuclear Information System (INIS)

Saint'Pierre, Tatiana D.; Dias, Lucia Felicidade; Pozebon, Dirce; Aucelio, Ricardo Q.; Curtius, Adilson J.; Welz, Bernhard

2002-01-01

Trace metals in fuels, except in the case of additives, are usually undesirable and normally they occur in very low concentrations in gasoline, requiring sensitive techniques for their determination. Coupling of electrothermal vaporization with inductively coupled plasma mass spectrometry minimizes the problems related to the introduction of organic solvents into the plasma. Furthermore, sample preparation as oil-in-water emulsions reduces problems related to gasoline analysis. In this work, a method for determination of Cu, Mn, Ni and Sn in gasoline is proposed. Samples were prepared by forming a 10-fold diluted emulsion with a surfactant (Triton X-100), after treatment with concentrated HNO 3 . The sample emulsion was pre-concentrated in the graphite tube by repeated pipetting and drying. External calibration was used with aqueous standards in a purified gasoline emulsion. Six samples from different gas stations were analyzed, and the analyte concentrations were found to be in the μg l -1 range or below. The limits of detection were 0.22, 0.02, 0.38 and 0.03 μg l -1 for Cu, Mn, Ni and Sn, respectively. The accuracy of the method was estimated using a recovery test

Comparison of the electrochemical performance of mesoscopic Cu2Sb, SnSb and Sn/SnSb alloy powders

International Nuclear Information System (INIS)

Zhang Ge; Huang Kelong; Liu Suqin; Zhang Wei; Gong Benli

2006-01-01

Cu 2 Sb, SnSb and Sn/SnSb mesoscopic alloy powders were prepared by chemical reduction, respectively. The crystal structures and particle morphology of Cu 2 Sb, SnSb and Sn/SnSb were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM). The electrochemical performances of the Cu 2 Sb, SnSb and Sn/SnSb electrodes were investigated by galvanostatic charge and discharge cycling and electrochemical impedance spectroscopy (EIS). The results showed the first charge and discharge capacities of SnSb and Sn/SnSb were higher than Cu 2 Sb, but after 15 cycles, the charge capacity fading rates of Cu 2 Sb, Sn/SnSb and Sn/SnSb were 26.16%, 55.33% and 47.39%, respectively. Cu 2 Sb had a better cycle performance, and Sn/SnSb multiphase alloy was prior to pure SnSb due to the existence of excessive Sn in Sn/SnSb system

Strain relaxation of germanium-tin (GeSn) fins

Science.gov (United States)

Kang, Yuye; Huang, Yi-Chiau; Lee, Kwang Hong; Bao, Shuyu; Wang, Wei; Lei, Dian; Masudy-Panah, Saeid; Dong, Yuan; Wu, Ying; Xu, Shengqiang; Tan, Chuan Seng; Gong, Xiao; Yeo, Yee-Chia

2018-02-01

Strain relaxation of biaxially strained Ge1-xSnx layer when it is patterned into Ge1-xSnx fin structures is studied. Ge1-xSnx-on-insulator (GeSnOI) substrate was realized using a direct wafer bonding (DWB) technique and Ge1-xSnx fin structures were formed by electron beam lithography (EBL) patterning and dry etching. The strain in the Ge1-xSnx fins having fin widths (WFin) ranging from 1 μm down to 80 nm was characterized using micro-Raman spectroscopy. Raman measurements show that the strain relaxation increases with decreasing WFin. Finite element (FE) simulation shows that the strain component in the transverse direction relaxes with decreasing WFin, while the strain component along the fin direction remains unchanged. For various Ge1-xSnx fin widths, transverse strain relaxation was further extracted using micro-Raman spectroscopy, which is consistent with the simulation results.

Synthesis and densification of Cu-coated Ni-based amorphous composite powders

International Nuclear Information System (INIS)

Kim, Yong-Jin; Kim, Byoung-Kee; Kim, Jin-Chun

2007-01-01

Spherical Ni 57 Zr 20 Ti 16 Si 2 Sn 3 (numbers indicate at.%) amorphous powders were produced by the gas atomization process, and ductile Cu phase was coated on the Ni-based amorphous powders by the spray drying process in order to increase the ductility of the consolidated amorphous alloy. The characteristics of the as-prepared powders and the consolidation behaviors of Cu-coated Ni-based amorphous composite powders were investigated. The atomization was conducted at 1450 deg. C under the vacuum of 10 -2 mbar. The Ni-based amorphous powders and Cu nitrate solution were mixed and sprayed at temperature of 130 deg. C. After spray drying and reduction treatment, the sub-micron size Cu powders were coated successfully on the surface of the atomized Ni amorphous powders. The spark plasma sintering process was applied to study the densification behavior of the Cu-coated composite powders. Thickness of the Cu layer was less than 1 μm. The compacts obtained by SPS showed high relative density of over 98% and its hardness was over 800 Hv

Controlling the antibacterial activity of CuSn thin films by varying the contents of Sn

Energy Technology Data Exchange (ETDEWEB)

Kang, Yujin; Park, Juyun; Kim, Dong-Woo; Kim, Hakjun; Kang, Yong-Cheol, E-mail: yckang@pknu.ac.kr

2016-12-15

Highlights: • We deposit CuSn thin films on a Si substrate with various Cu/Sn ratio. • Antibacterial activities of CuSn thin films increased as the ratio of Cu and the contact time increased. • XPS was utilized to assign the chemical environment of CuSn thin films before and after antibacterial test. - Abstract: We investigated antibacterial activity of CuSn thin films against Gram positive Staphylococcus aureus (S. aureus). CuSn thin films with different Cu to Sn ratios were deposited on Si(100) by radio frequency (RF) magnetron sputtering method using Cu and Sn metal anodes. The film thickness was fixed at 200 nm by varying the sputtering time and RF power on the metal targets. The antibacterial test was conducted in various conditions such as different contact times and Cu to Sn ratios in the CuSn films. The antibacterial activities of CuSn thin films increased as the ratio of Cu and the contact time between the film and bacteria suspension increased execpt in the case of CuSn-83. The oxidation states of Cu and Sn and the chemical composition of CuSn thin films before and after the antibacterial test were investigated by X-ray photoelectron spectroscopy (XPS). When the contact time was fixed, the Cu species was further oxidized as the RF power on Cu target increased. The intensity of Sn 3d decreased with increasing Cu ratio. When the sample was fixed, the peak intensity of Sn 3d decreased as the contact time increased due to the permeation of Sn into the cell.

The crystallisation of Cu2ZnSnS4 thin film solar cell absorbers from co-electroplated Cu-Zn-Sn precursors

International Nuclear Information System (INIS)

Schurr, R.; Hoelzing, A.; Jost, S.; Hock, R.; Voss, T.; Schulze, J.; Kirbs, A.; Ennaoui, A.; Lux-Steiner, M.; Weber, A.; Koetschau, I.; Schock, H.-W.

2009-01-01

The best CZTS solar cell so far was produced by co-sputtering continued with vapour phase sulfurization method. Efficiencies of up to 5.74% were reached by Katagiri et al. The one step electrochemical deposition of copper, zinc, tin and subsequent sulfurization is an alternative fabrication technique for the production of Cu 2 ZnSnS 4 based thin film solar cells. A kesterite based solar cell (size 0.5 cm 2 ) with a conversion efficiency of 3.4% (AM1.5) was produced by vapour phase sulfurization of co-electroplated Cu-Zn-Sn films. We report on results of in-situ X-ray diffraction (XRD) experiments during crystallisation of kesterite thin films from electrochemically co-deposited metal films. The kesterite crystallisation is completed by the solid state reaction of Cu 2 SnS 3 and ZnS. The measurements show two different reaction paths depending on the metal ratios in the as deposited films. In copper-rich metal films Cu 3 Sn and CuZn were found after electrodeposition. In copper-poor or near stoichiometric precursors additional Cu 6 Sn 5 and Sn phases were detected. The formation mechanism of Cu 2 SnS 3 involves the binary sulphides Cu 2-x S and SnS 2 in the absence of the binary precursor phase Cu 6 Sn 5 . The presence of Cu 6 Sn 5 leads to a preferred formation of Cu 2 SnS 3 via the reaction educts Cu 2-x S and SnS 2 in the presence of a SnS 2 (Cu 4 SnS 6 ) melt. The melt phase may be advantageous in crystallising the kesterite, leading to enhanced grain growth in the presence of a liquid phase

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Science.gov (United States)

Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

2016-06-01

While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Science.gov (United States)

Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

2011-09-01

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Directory of Open Access Journals (Sweden)

Saliza Azlina O.

2016-01-01

Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

Phase Equilibria of Sn-Co-Cu Ternary System

Science.gov (United States)

Chen, Yu-Kai; Hsu, Chia-Ming; Chen, Sinn-Wen; Chen, Chih-Ming; Huang, Yu-Chih

2012-10-01

Sn-Co-Cu ternary alloys are promising lead-free solders, and isothermal sections of Sn-Co-Cu phase equilibria are fundamentally important for the alloys' development and applications. Sn-Co-Cu ternary alloys were prepared and equilibrated at 523 K, 1073 K, and 1273 K (250 °C, 800 °C, and 1000 °C), and the equilibrium phases were experimentally determined. In addition to the terminal solid solutions and binary intermetallic compounds, a new ternary compound, Sn3Co2Cu8, was found. The solubilities of Cu in the α-CoSn3 and CoSn2 phases at 523 K (250 °C) are 4.2 and 1.6 at. pct, respectively, while the Cu solubility in the α-Co3Sn2 phase is as high as 20.0 at. pct. The Cu solubility increases with temperature and is around 30.0 at. pct in the β-Co3Sn2 at 1073 K (800 °C). The Co solubility in the η-Cu6Sn5 phase is also significant and is 15.5 at. pct at 523 K (250 °C).

Magnetic and electronic properties of the Cu-substituted Weyl semimetal candidate ZrCo2Sn.

Science.gov (United States)

Kushwaha, S K; Wang, Zhijun; Kong, Tai; Cava, Robert

2018-01-04

We report that the partial substitution of Cu for Co has a significant impact on the magnetic properties of the Heusler-phase Weyl fermion candidate ZrCo₂Sn. Polycrystalline samples of ZrCo_2-xCu_xSn (x = 0.0 to 1.0) exhibited a linearly decreasing ferromagnetic transition temperature and similarly decreasing saturated magnetic moment on increasing Cu substitution x. Materials with Cu contents near x = 1 and several other quaternary materials synthesized at the same x (ZrCoT'Sn (T' = Rh, Pd, Ni)) display what appears to be non-ferromagnetic magnetization behavior with spin glass characteristics. Electronic structure calculations suggest that the half-metallic nature of unsubstituted ZrCo₂Sn is disrupted significantly by the Cu substitutions, leading to the breakdown of the magnetization vs. electron count guidelines usually followed by Heusler phases, and a more typical metallic non-spin-polarized electronic structure at high x. © 2018 IOP Publishing Ltd.

Effect of Cooling Rate on the Longitudinal Modulus of Cu3Sn Phase of Ag-Sn-Cu Amalgam Alloy (Part II

Directory of Open Access Journals (Sweden)

R. H. Rusli

2015-10-01

Full Text Available Effects of cooling rate (at the time of solidification on the elastic constants of Cu3Sn phase of Ag-Sn-Cu dental amalgam alloy were studied. In this study, three types of alloys were made, with the composition Cu-38-37 wt% Sn by means of casting, where each alloy was subjected to different cooling rate, such as cooling on the air (AC, air blown (AB, and quenched in the water (WQ. X-ray diffraction, metallography, and Scanning Electron Microscopy with Energy Dispersive Spectroscopy studies of three alloys indicated the existence of Cu3Sn phase. Determination of the modulus of elasticity of Cu3Sn (ε phase was carried out by the measurement of longitudinal and transversal waves velocity using ultrasonic technique. The result shows that Cu3Sn (ε phase on AC gives higher modulus of elasticity values than those of Cu3Sn (ε on AB and WQ. The high modulus of elasticity value will produce a strong Ag-Sn-Cu dental amalagam alloy.

Nanoindentation studies on Cu-Ti-Zr-Ni-Si-Sn bulk metallic glasses

International Nuclear Information System (INIS)

Mukhopadhyay, N.K.; Belger, A.; Paufler, P.; Kim, D.H.

2007-01-01

In the present investigation, Cu 47 Ti 33 Ni 6 Sn 2 Si 1 (numbers indicate at.%) bulk metallic glass (BMG), fabricated by injection casting has been used for indentation experiments. Microindentation and nanoindentation tests were conducted to study the indentation responses of this material. The nanohardness and the Young's modulus were calculated following the standard procedure in literature. Around the indent, shear bands can be clearly observed under scanning electron microscopy examination. Atomic-force microscopy shows the pile of the material in a step-wise manner. The thinned sample near the indent shows the evolution of nanocrystals (∼20-30 nm) by transmission electron microscopy. During nanoindentation (in single- and multi-indent mode) experiments, the load-displacement P-h curves show displacement bursts, which are also known as pop-ins or serrations. The total displacement during indentation can be accounted for by sum total effect of the individual displacement of all the displacement-bursts observed in the P-h curve. Thus the plastic deformation of this glassy material appears to proceed in a discrete manner unlike ductile metallic alloys

The behaviour of the elements Ni, Co, Cu, Pb, Zn, Au, Ag, Mo, Sn, W and U in the magmatic, hydrothermal, sedimentary and weathering environments

International Nuclear Information System (INIS)

Anderson, J.R.

1978-01-01

In the last two decades much has been published on the behaviour of certain elements in the magmatic, hydrothermal, sedimentary and weathering environments, but the information is scattered throughout the literature. This situation prompted the present study on the elements Ni, Co, Cu, Pb, Zn, Au, Ag, Mo, Sn, W and U. The behaviour of the elements Ni, Cu, Pb, Zn, Au, Sn, W and U has been studied experimentally in some depth. Ag has been moderately studied, but there is very little information about Co and Mo. Studies on the complexes formed by the elements within the hydrothermal and aqueous environment are often inconclusive and controversial, but conclusions are drawn as to the more likely complexes formed. A genetic classification of ore deposits is used as a framework for the discussion. The source of the elements is regarded as being the mantle, and therefore discussion on other possible sources is beyond the scope of this dissertation. The crystal chemistry and geochemistry of the elements are presented and the essay concludes with a discussion on the elements within their depositional environments

Enhanced hydrogen storage capacity of Ni/Sn-coated MWCNT nanocomposites

Science.gov (United States)

Varshoy, Shokufeh; Khoshnevisan, Bahram; Behpour, Mohsen

2018-02-01

The hydrogen storage capacity of Ni-Sn, Ni-Sn/multi-walled carbon nanotube (MWCNT) and Ni/Sn-coated MWCNT electrodes was investigated by using a chronopotentiometry method. The Sn layer was electrochemically deposited inside pores of nanoscale Ni foam. The MWCNTs were put on the Ni-Sn foam with nanoscale porosities using an electrophoretic deposition method and coated with Sn nanoparticles by an electroplating process. X-ray diffraction and energy dispersive spectroscopy results indicated that the Sn layer and MWCNTs are successfully deposited on the surface of Ni substrate. On the other hand, a field-emission scanning electron microscopy technique revealed the morphology of resulting Ni foam, Ni-Sn and Ni-Sn/MWCNT electrodes. In order to measure the hydrogen adsorption performed in a three electrode cell, the Ni-Sn, Ni-Sn/MWCNT and Ni/Sn-coated MWCNT electrodes were used as working electrodes whereas Pt and Ag/AgCl electrodes were employed as counter and reference electrodes, respectively. Our results on the discharge capacity in different electrodes represent that the Ni/Sn-coated MWCNT has a maximum discharge capacity of ˜30 000 mAh g-1 for 20 cycles compared to that of Ni-Sn/MWCNT electrodes for 15 cycles (˜9500 mAh g-1). By increasing the number of cycles in a constant current, the corresponding capacity increases, thereby reaching a constant amount for 20 cycles.

Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

Science.gov (United States)

Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

2015-03-01

Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

The crystallisation of Cu{sub 2}ZnSnS{sub 4} thin film solar cell absorbers from co-electroplated Cu-Zn-Sn precursors

Energy Technology Data Exchange (ETDEWEB)

Schurr, R. [Chair for Crystallography and Structural Physics, University of Erlangen-Nuernberg, Staudtstrasse 3, D-91058 Erlangen (Germany)], E-mail: schurr@krist.uni-erlangen.de; Hoelzing, A.; Jost, S.; Hock, R. [Chair for Crystallography and Structural Physics, University of Erlangen-Nuernberg, Staudtstrasse 3, D-91058 Erlangen (Germany); Voss, T.; Schulze, J.; Kirbs, A. [Atotech Deutschland GmbH, Erasmusstrasse 20, D-10553 Berlin (Germany); Ennaoui, A.; Lux-Steiner, M. [Heterogeneous Material Systems SE II, Hahn-Meitner-Institut, Glienickerstr.100, D-14109 Berlin (Germany); Weber, A.; Koetschau, I.; Schock, H.-W. [Technology SE III, Hahn-Meitner-Institut, Glienickerstr.100, D-14109 Berlin (Germany)

2009-02-02

The best CZTS solar cell so far was produced by co-sputtering continued with vapour phase sulfurization method. Efficiencies of up to 5.74% were reached by Katagiri et al. The one step electrochemical deposition of copper, zinc, tin and subsequent sulfurization is an alternative fabrication technique for the production of Cu{sub 2}ZnSnS{sub 4} based thin film solar cells. A kesterite based solar cell (size 0.5 cm{sup 2}) with a conversion efficiency of 3.4% (AM1.5) was produced by vapour phase sulfurization of co-electroplated Cu-Zn-Sn films. We report on results of in-situ X-ray diffraction (XRD) experiments during crystallisation of kesterite thin films from electrochemically co-deposited metal films. The kesterite crystallisation is completed by the solid state reaction of Cu{sub 2}SnS{sub 3} and ZnS. The measurements show two different reaction paths depending on the metal ratios in the as deposited films. In copper-rich metal films Cu{sub 3}Sn and CuZn were found after electrodeposition. In copper-poor or near stoichiometric precursors additional Cu{sub 6}Sn{sub 5} and Sn phases were detected. The formation mechanism of Cu{sub 2}SnS{sub 3} involves the binary sulphides Cu{sub 2-x}S and SnS{sub 2} in the absence of the binary precursor phase Cu{sub 6}Sn{sub 5}. The presence of Cu{sub 6}Sn{sub 5} leads to a preferred formation of Cu{sub 2}SnS{sub 3} via the reaction educts Cu{sub 2-x}S and SnS{sub 2} in the presence of a SnS{sub 2}(Cu{sub 4}SnS{sub 6}) melt. The melt phase may be advantageous in crystallising the kesterite, leading to enhanced grain growth in the presence of a liquid phase.

STUDY OF MICROSTRUCTURE, HARDNESS AND WEAR PROPERTIES OF SAND CAST Cu-4Ni-6Sn BRONZE ALLOY

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S. ILANGOVAN

2015-04-01

Full Text Available An alloy of Cu-4Ni-6Sn was cast in the sand moulds. The cast rods were homogenized, solution heat treated and aged for different periods of time. The specimens were prepared from the rods to study the microstructure, microhardness and wear properties. It was found that the aging process increases the hardness of the alloy significantly. It was due to the change in the microstructure of the alloy. Further, spinodal decomposition and the ordering reaction take place during the aging treatment. Specific wear rate was found to decrease with the hardness of the alloy. Coefficient of friction remains constant and is not affected by the aging process.

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

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Liu Mei Lee

2013-01-01

Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

The tin-rich copper lithium stannides: Li{sub 3}Cu{sub 6}Sn{sub 4} and Li{sub 2}CuSn{sub 2}

Energy Technology Data Exchange (ETDEWEB)

Fuertauer, Siegfried; Flandorfer, Hans [Vienna Univ. (Austria). Inst. of Inorganic Chemistry (Materials Chemisrty); Effenberger, Herta S. [Vienna Univ. (Austria). Inst. of Mineralogy and Crystallography

2015-05-01

The Sn rich ternary intermetallic compounds Li{sub 3}Cu{sub 6}Sn{sub 4} (CSD-427097) and Li{sub 2}CuSn{sub 2} (CSD-427098) were synthesized from the pure elements by induction melting and annealing at 400 C. Structural investigations were performed by powder- and single-crystal XRD. Li{sub 3}Cu{sub 6}Sn{sub 4} crystallizes in space group P6/mmm; it is structurally related to but not isotypic with MgFe{sub 6}Ge{sub 6} (a = 5.095(2) Aa, c = 9.524(3) Aa; wR{sub 2} = 0.059; 239 unique F{sup 2}-values, 17 free variables). Li{sub 3}Cu{sub 6}Sn{sub 4} is characterized by two sites with a mixed Cu:Sn occupation. In contrast to all other Cu-Li-Sn compounds known so far, any mixed occupation was found for Cu-Li pairs only. In addition, one Li site is only half occupied. The second Sn rich phase is Li{sub 2}CuSn{sub 2} (space group I4{sub 1}/amd, a = 4.4281(15) Aa, c = 19.416(4) Aa; wR{sub 2} = 0.033; 213 unique F{sup 2}-values, 12 atom free variables); it is the only phase in the Cu-Li-Sn system which is noted for full ordering. Both crystal structures exhibit 3D-networks which host Li atoms in channels. They are important for understanding the lithiation mechanism in Cu-Sn electrodes for Li-ion batteries.

Structural and microstructural comparative analysis on metallic alloys of composition Cu{sub y%}-Ni{sub x%}-Me (Me = Sn, Cr, Al, Pt)

Energy Technology Data Exchange (ETDEWEB)

Marques, I.M.; Okazaki, A.K.; Silveira, C.R. da; Carvalhal, M.A.; Monteiro, W.A.; Carrio, J.A.G. [Physics Department, CCH, Presbyterian Mackenzie University, Materials Science and Technology Centre, Sao Paulo, SP (Brazil); Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil)], e-mail: jgcarrio@mackenzie.br

2010-07-01

This work presents a comparative study of microstructural and electrical properties of polycrystalline material Cu-Ni alloys synthesized by conventional and powder metallurgy. A sample of Cu{sub 99,33%} Ni{sub 0,23%} Pt{sub 0,43%} was produced in electric furnace with voltaic arc and various samples containing Al, Sn and Cr as third element were produced by powder metallurgy. The microstructure of the samples was studied by optical microscopy, Vickers micro hardness and x rays powder diffraction. Their electrical conductivity was measured with a milliohmeter Agilent (HP) 4338B. Refinements of the crystalline structure of the samples were performed by the Rietveld method, using the refinement program GSAS. The refinement results and Fourier differences calculations indicate that the copper matrix structure presents not significant distortions by the used amounts of the other metal atoms. The refinement of non structural parameters allowed the micro-structural characterization. The dependence of the micro-structure with thermal and mechanical treatments is studied. (author)

Nanoscale structural heterogeneity in Ni-rich half-Heusler TiNiSn

International Nuclear Information System (INIS)

Douglas, Jason E.; Pollock, Tresa M.; Chater, Philip A.; Brown, Craig M.; Seshadri, Ram

2014-01-01

The structural implications of excess Ni in the TiNiSn half-Heusler compound are examined through a combination of synchrotron x-ray and neutron scattering studies, in conjunction with first principles density functional theory calculations on supercells. Despite the phase diagram suggesting that TiNiSn is a line compound with no solid solution, for small x in TiNi 1+x Sn there is indeed an appearance—from careful analysis of the scattering—of some solubility, with the excess Ni occupying the interstitial tetrahedral site in the half-Heusler structure. The analysis performed here would point to the excess Ni not being statistically distributed, but rather occurring as coherent nanoclusters. First principles calculations of energetics, carried out using supercells, support a scenario of Ni interstitials clustering, rather than a statistical distribution.

Diffusion couple studies of the Ni-Bi-Sn system

Directory of Open Access Journals (Sweden)

Vassilev G.

2012-01-01

Full Text Available Investigations of Ni-Bi-Sn system were performed in order to inquire the phase diagram and to assess some diffusion kinetic parameters. For this purpose diffusion couples consisting of solid nickel (preliminary electroplated with tin and liquid Bi-Sn phase were annealed at 370 °C. Three compositions (0.8, 0.6 and 0.4 mole fractions Sn of the Bi-Sn melts were chosen. Annealing times from 24 to 216 h were applied. The phase and chemical compositions of the contact zone were determined by means of electron scanning microscope. It was confirmed that the diffusion layers consist mainly of Ni3Sn4 but other intermetallic phases grow as well. For the first time metastable Ni-Sn phases as NiSn and NiSn8 (NiSn9 were observed in metallurgical alloys (i.e. not in electroplated samples. The existence of a ternary compound previously reported in the literature was confirmed. More than one ternary Ni-Bi-Sn compounds might possibly be admitted. A growth coefficient of (2.29 ± 0.02 x 10-15 m2 s-1 was obtained. It was found that the apparent activation energy for diffusion layers growth (18 ± 8 kJ mol-1 is inferior to that one assessed at growth from solid state Bi-Sn mixtures (88 ± 12 kJ mol-1.

Performance enhancement in uniaxially tensile stressed GeSn n-channel fin tunneling field-effect transistor: Impact of stress direction

Science.gov (United States)

Wang, Hongjuan; Han, Genquan; Jiang, Xiangwei; Liu, Yan; Zhang, Chunfu; Zhang, Jincheng; Hao, Yue

2017-04-01

In this work, the boosting effect on the performance of GeSn n-channel fin tunneling FET (nFinTFET) enabled by uniaxial tensile stress is investigated theoretically. As the fin rotates within the (001) plane, the uniaxial tensile stress is always along its direction. The electrical characteristics of tensile-stressed GeSn nFinTFETs with point and line tunneling modes are computed utilizing the technology computer aided design (TCAD) simulator in which the dynamic nonlocal band-to-band tunneling (BTBT) algorithm is employed. In comparison with the relaxed devices, tensile-stressed GeSn nFinTFETs achieve a substantial enhancement in band-to-band tunneling generation rate (G BTBT) and on-state current I ON owing to the reduced bandgap E G induced by the tensile stress. Performance improvement of GeSn nFinTFETs induced by tensile stress demonstrates a strong dependence on channel direction and tunneling modes. Under the same magnitude of stress, line-nFinTFETs obtain a more pronounced I ON enhancement over the transistors with point tunneling mode.

One dimensional motion of interstitial clusters and void growth in Ni and Ni alloys

Science.gov (United States)

Yoshiie, T.; Ishizaki, T.; Xu, Q.; Satoh, Y.; Kiritani, M.

2002-12-01

One dimensional (1-D) motion of interstitial clusters is important for the microstructural evolution in metals. In this paper, the effect of 2 at.% alloying with elements Si (volume size factor to Ni: -5.81%), Cu (7.18%), Ge (14.76%) and Sn (74.08%) in Ni on 1-D motion of interstitial clusters and void growth was studied. In neutron irradiated pure Ni, Ni-Cu and Ni-Ge, well developed dislocation networks and voids in the matrix, and no defects near grain boundaries were observed at 573 K to a dose of 0.4 dpa by transmission electron microscopy. No voids were formed and only interstitial type dislocation loops were observed near grain boundaries in Ni-Si and Ni-Sn. The reaction kinetics analysis which included the point defect flow into planar sink revealed the existence of 1-D motion of interstitial clusters in Ni, Ni-Cu and Ni-Ge, and lack of such motion in Ni-Si and Ni-Sn. In Ni-Sn and Ni-Si, the alloying elements will trap interstitial clusters and thereby reduce the cluster mobility, which lead to the reduction in void growth.

Synthesis and Characterization of Polyol-Assisted Nano Cu0.2Ni0.2Sn0.2Ba0.4 Fe2O4 by a Wet Hydroxyl Route

Science.gov (United States)

Pavithradevi, S.; Suriyanarayanan, N.; Boobalan, T.; Velumani, S.; Chandramohan, M.; Manivel Raja, M.

2017-08-01

Nanocrystalline spinel ferrite of composition Cu0.2Ni0.2Sn0.2Ba0.4 Fe2O4 has been synthesized by a wet hydroxyl chemical route in ethylene glycol as chelating agent and sodium hydroxide as precipitator at pH 8. Ethylene glycol has been used as the medium which serves as the solvent as well as a complexing agent. The synthesized particles are annealed at temperatures of 350°C, 700°C, and 1050°C. Thermogravimetric (TG) analysis confirms that at 240°C, ethylene glycol has evaporated completely, and a stable phase is formed above 670°C. Fourier transform infrared (FT-IR) spectroscopy of mixed Cu0.2Ni0.2Sn0.2Ba0.4 ferrite nanoparticles like as synthesized and annealed at 1050°C are recorded between 400 cm-1 and 4000 cm-1. FT-IR appraises the structural formation of Cu0.2Ni0.2Sn0.2Ba0.4 Fe2O4 between the as-synthesized sample and the sample annealed at 1050°C. Structural characterizations of all the samples are carried out by x-ray diffraction (XRD) technique. XRD reveals that the particle size increases with the increase in annealing temperatures. Transmission electron microscopy (TEM) and scanning electron microscopy (SEM) confirms that the particles are flaky and spherical with the crystallite size in the range of 11-27 nm. The decrement of dielectric properties, like dielectric constant and dielectric loss, with the increment of frequency as seen in all the samples is an usual dielectric behavior of spinel ferrites. The lack of net magnetization is noticed immediately when the applied magnetic field is removed which prompts superparamagnetic behavior, as seen in all the samples.

Directional Solidification and Liquidus Projection of the Sn-Co-Cu System

Science.gov (United States)

Chen, Sinn-Wen; Chang, Jui-Shen; Pan, Kevin; Hsu, Chia-Ming; Hsu, Che-Wei

2013-04-01

This study investigates the Sn-Co-Cu ternary system, which is of interest to the electronics industry. Ternary Sn-Co-Cu alloys were prepared, their as-solidified microstructures were examined, and their primary solidification phases were determined. The primary solidification phases observed were Cu, Co, Co3Sn2, CoSn, CoSn2, Cu6Sn5, Co3Sn2, γ, and β phases. Although there are ternary compounds reported in this ternary system, no ternary compound was found as the primary solidification phase. The directional solidification technique was applied when difficulties were encountered using the conventional quenching method to distinguish the primary solidification phases, such as Cu6Sn5, Cu3Sn, and γ phases. Of all the primary solidification phases, the Co3Sn2 and Co phases have the largest compositional regimes in which alloys display them as the primary solidification phases. There are four class II reactions and four class III reactions. The reactions with the highest and lowest reaction temperatures are both class III reactions, and are L + CoSn2 + Cu6Sn5 = CoSn3 at 621.5 K (348.3 °C) and L + Co3Sn2 + CoSn = Cu6Sn5 at 1157.8 K (884.6 °C), respectively.

Calculation of Gibbs energy of Zr-Al-Ni, Zr-Al-Cu, Al-Ni-Cu and Zr-Al-Ni-Cu liquid alloys based on quasiregular solution model

International Nuclear Information System (INIS)

Li, H.Q.; Yang, Y.S.; Tong, W.H.; Wang, Z.Y.

2007-01-01

With the effects of electronic structure and atomic size being introduced, the mixing enthalpy as well as the Gibbs energy of the ternary Zr-Al-Cu, Ni-Al-Cu, Zr-Ni-Al and quaternary Zr-Al-Ni-Cu systems are calculated based on quasiregular solution model. The computed results agree well with the experimental data. The sequence of Gibbs energies of different systems is: G Zr-Al-Ni-Cu Zr-Al-Ni Zr-Al-Cu Cu-Al-Ni . To Zr-Al-Cu, Ni-Al-Cu and Zr-Ni-Al, the lowest Gibbs energy locates in the composition range of X Zr 0.39-0.61, X Al = 0.38-0.61; X Ni = 0.39-0.61, X Al = 0.38-0.60 and X Zr = 0.32-0.67, X Al = 0.32-0.66, respectively. And to the Zr-Ni-Al-Cu system with 66.67% Zr, the lowest Gibbs energy is obtained in the region of X Al = 0.63-0.80, X Ni = 0.14-0.24

CuLi2Sn and Cu2LiSn: Characterization by single crystal XRD and structural discussion towards new anode materials for Li-ion batteries.

Science.gov (United States)

Fürtauer, Siegfried; Effenberger, Herta S; Flandorfer, Hans

2014-12-01

The stannides CuLi 2 Sn (CSD-427095) and Cu 2 LiSn (CSD-427096) were synthesized by induction melting of the pure elements and annealing at 400 °C. The phases were reinvestigated by X-ray powder and single-crystal X-ray diffractometry. Within both crystal structures the ordered CuSn and Cu 2 Sn lattices form channels which host Cu and Li atoms at partly mixed occupied positions exhibiting extensive vacancies. For CuLi 2 Sn, the space group F-43m. was verified (structure type CuHg 2 Ti; a =6.295(2) Å; wR 2 ( F ²)=0.0355 for 78 unique reflections). The 4( c ) and 4( d ) positions are occupied by Cu atoms and Cu+Li atoms, respectively. For Cu 2 LiSn, the space group P 6 3 / mmc was confirmed (structure type InPt 2 Gd; a =4.3022(15) Å, c =7.618(3) Å; wR 2 ( F ²)=0.060 for 199 unique reflections). The Cu and Li atoms exhibit extensive disorder; they are distributed over the partly occupied positions 2( a ), 2( b ) and 4( e ). Both phases seem to be interesting in terms of application of Cu-Sn alloys as anode materials for Li-ion batteries.

Electro-oxidation of Ethanol on Carbon Supported PtSn and PtSnNi Catalysts

Directory of Open Access Journals (Sweden)

Nur Hidayati

2016-03-01

Full Text Available Even though platinum is known as an active electro-catalyst for ethanol oxidation at low temperatures (< 100 oC, choosing the electrode material for ethanol electro-oxidation is a crucial issue. It is due to its property which easily poisoned by a strong adsorbed species such as CO. PtSn-based electro-catalysts have been identified as better catalysts for ethanol electro-oxidation. The third material is supposed to improved binary catalysts performance. This work presents a study of the ethanol electro-oxidation on carbon supported Pt-Sn and Pt-Sn-Ni catalysts. These catalysts were prepared by alcohol reduction. Nano-particles with diameters between 2.5-5.0 nm were obtained. The peak of (220 crystalline face centred cubic (fcc Pt phase for PtSn and PtSnNi alloys was repositioned due to the presence of Sn and/or Ni in the alloy. Furthermore, the modification of Pt with Sn and SnNi improved ethanol and CO electro-oxidation. Copyright © 2016 BCREC GROUP. All rights reserved Received: 10th November 2015; Revised: 1st February 2016; Accepted: 1st February 2016 How to Cite: Hidayati, N., Scott, K. (2016. Electro-oxidation of Ethanol on Carbon Supported PtSn and PtSnNi Catalysts. Bulletin of Chemical Reaction Engineering & Catalysis, 11 (1: 10-20. (doi:10.9767/bcrec.11.1.394.10-20 Permalink/DOI: http://dx.doi.org/10.9767/bcrec.11.1.394.10-20

Fabrication and sulfurization of Cu{sub 2}SnS{sub 3} thin films with tuning the concentration of Cu-Sn-S precursor ink

Energy Technology Data Exchange (ETDEWEB)

Wang, Chi-Jie [Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Taiwan (China); Shei, Shih-Chang, E-mail: scshei@mail.nutn.edu.tw [Department of Electrical Engineering, Nation University of Tainan, Taiwan (China); Chang, Shih-Chang [Department of Electrical Engineering, Nation University of Tainan, Taiwan (China); Chang, Shoou-Jinn [Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Taiwan (China)

2016-12-01

Highlights: • Tuning the relative reaction rate of component phases proved to be beneficial in controlling the reaction process. • Low-concentration samples display closely packed Cu{sub 2}SnS{sub 3} grains with a flat morphology. • Optical band-gap energy measured at 1.346 eV suitable for thin-film solar cell applications. - Abstract: In this study, Cu-Sn-S nanoinks were synthesized by combining chelating polyetheramine to Cu, Sn, S powders of various concentrations. X-ray diffraction patterns indicate that nanoinks synthesized at low concentrations are composed almost entirely of binary phases SnS and Cu{sub 2}S. Synthesizing nanoinks at higher concentrations decreased the quantity of binary phase and led to the appearance of ternary phase Cu{sub 4}SnS{sub 4}. Following sulfurization, single phase Cu{sub 2}SnS{sub 3} (CTS) thin film was obtained from nanoinks of low concentration; however, impurities, such as Cu{sub 2}S were detected in the thin film obtained from nanoinks of high concentration. This can be attributed to the fact that lower concentrations reduce the reactivity of all the elements. As a result, the SnS phase reacted more readily and more rapidly, resulting in the early formation of a stoichiometric CTS thin film during sulfurization. Under these reaction conditions, Cu{sub 2}S and SnS transform into CTS and thereby prevent the formation of unwanted phases of Cu{sub 2}S and Cu{sub 4}SnS{sub 4}. Raman spectra revealed that second phase Cu{sub 2}S phase remained in the high-concentration samples, due to an increase in reactivity due to the participation of a greater proportion of the copper in the reaction. The surface microstructure of low-concentration samples display closely packed Cu{sub 2}SnS{sub 3} grains with a flat morphology and an atomic composition ratio of Cu:Sn:S = 34.69:15.90:49.41, which is close to stoichiometric. Hall measurement revealed that low-concentration sample has superior electrical properties; i.e., a hole

Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

Energy Technology Data Exchange (ETDEWEB)

Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

2016-07-04

Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

Systematics of Structural, Phase Stability, and Cohesive Properties of η'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints

Science.gov (United States)

Ramos, S. B.; González Lemus, N. V.; Deluque Toro, C. E.; Cabeza, G. F.; Fernández Guillermet, A.

2017-07-01

Motivated by the high solubility of In in ( mC44) η'-Cu6Sn5 compound as well as the occurrence of an In-doped η'-intermetallic in the microstructure of Cu/In-Sn/Cu solder joints, a theoretical study has been carried out to investigate the various physical effects of incorporating In at Sn Wyckoff sites of the binary η'-phase. Systematic ab initio calculations using the projected augmented wave method and Vienna Ab initio Simulation Package were used to determine the composition dependence of the structural and cohesive properties of η'-Cu6(Sn,In)5 compounds, compared with those expected from the binary end-member compounds Cu6Sn5 and Cu6In5. The molar volume shows significant deviations from Vegard's law. The predicted composition dependence of the cohesive properties is discussed using two complementary approaches, viz. a valence-electron density approach as well as a bond-number approach, both accounting for the roughly linear dependence of the cohesive energy on the In content. A microscopic interpretation for this general trend is given in terms of the key contributions to chemical bonding in this class of compounds, namely Cu d-electron overlap and hybridization of Cu d-states with In and Sn p-electron states. Moreover, a crystallographic site approach is developed to accurately establish the phase-stabilizing effect of incorporating In at specific Wyckoff positions of the ( mC44) η'-Cu6Sn5 structure.

Phase composition of rapidly solidified Ag-Sn-Cu dental alloys

International Nuclear Information System (INIS)

Lecong Dzuong; Do Minh Nghiep; Nguyen van Dzan; Cao the Ha

1996-01-01

The phase composition of some rapidly solidified Ag-Sn-Cu dental alloys with different copper contents (6.22 wtpct) has been studied by XRD, EMPA and optical microscopy. The samples were prepared from melt-spun ribbons. The microstructure of the as-quenched ribbons was microcrystalline and consisted of the Ag sub 3 Sn, Ag sub 4 Sn, Cu sub 3 Sn and Cu sub 3 Sn sub 8 phases. Mixing with mercury (amalgamation) led to formation of the Ag sub 2 Hg sub 3, Sn sub 7 Hg and Cu sub 6 Sn sub 5 phases. The amount of copper atoms in the alloys played an important role in phase formation in the amalgams

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Science.gov (United States)

Zhong, Y.; Zhao, N.; Liu, C. Y.; Dong, W.; Qiao, Y. Y.; Wang, Y. P.; Ma, H. T.

2017-11-01

As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of η-Cu6Sn5 at cold end liquid-Sn/(111)Cu interfaces has been demonstrated. The resultant η-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60° and highly preferred orientation with their ⟨ 11 2 ¯ 0 ⟩ directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies.

Interface between Sn-Sb-Cu solder and copper substrate

Energy Technology Data Exchange (ETDEWEB)

Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

2011-07-15

Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

The complex structure of liquid Cu{sub 6}Sn{sub 5} alloy

Energy Technology Data Exchange (ETDEWEB)

Qin Jingyu; Gu Tingkun; Bian Xiufang [Key Laboratory of Liquid Structure and Heredity of Materials, Ministry of Education, Shandong University, Southern Campus, Jinan 250061 (China); Liu Hui [Shandong High Performance Computing Center, Shandong University, Southern Campus, Jinan 250061 (China)

2009-04-15

By applying ab initio molecular dynamics simulation to liquid Cu{sub 6}Sn{sub 5} alloy, the hetero-coordination tendency is discovered by Bathia-Thornton partial correlation functions and a chemical short-range parameter. However the local structural environment of Sn in l-Cu{sub 6}Sn{sub 5} alloy resembles that of liquid Sn by Voronoi analysis. A new feature, i.e. a subpeak in between the first and second peaks, is discovered by the present method which implies that topologically disordered {beta}-Sn-type structural units may exist in l-Cu{sub 6}Sn{sub 5} alloy. The local density states of electrons show that both Cu-Sn and Sn-Sn bonding exist in l-Cu{sub 6}Sn{sub 5} alloy. This work suggests that chemical short-range order between unlike atoms and self-coordination between Sn atoms coexists in l-Cu{sub 6}Sn{sub 5} alloy.

Estudio DRX en Materiales Catalizadores Cu-Ni-SiO2 para Hidrogenación de aceite de soya. Desarrollo de estructura cristalina y actividad catalítica

Directory of Open Access Journals (Sweden)

Gloria I. Cubillos

2009-01-01

Full Text Available Para buscar elementos experimentales que soporten la hipótesis según la cual se forman estructuras cristalinas Cu-Ni o eventualmente Cu-Ni-SiO2 en la síntesis de catalizadores para la hidrogenación de aceite de soya, se prepararon mezclas de estos tres materiales a partir de sales de los metales con sílice (aerosil. Se calcinaron a 270oC y se redujeron a 330oC en atmósfera de hidrógeno. En  los materiales reducidos se  estudió el difractógrama de RX en el rango 37 a 53 grados, y se comparó con el difractógrama de aleaciones Cu-Ni, en las cuales se conoce la formación  de cristales mixtos, y  con los difractógramas de los elementos puros Cu y Ni.  Los resultados muestran que se presentan señales de difracción diferentes a las señales de los componentes puros. La actividad catalítica se muestra diferente en los materiales que presentan distorsión en su estructura cristalina.  

Femtosecond laser-induced phase transformations in amorphous Cu{sub 77}Ni{sub 6}Sn{sub 10}P{sub 7} alloy

Energy Technology Data Exchange (ETDEWEB)

Zhang, Y.; Zou, G.; Wu, A.; Bai, H. [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Liu, L., E-mail: liulei@tsinghua.edu.cn [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); The State Key Laboratory of Tribology, Tsinghua University, Beijing 100084 (China); Chen, N. [School of Materials Science and Engineering, Tsinghua University, Beijing 100084 (China); Zhou, Y. [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada)

2015-01-14

In this study, the femtosecond laser-induced crystallization of CuNiSnP amorphous ribbons was investigated by utilizing an amplified Ti:sapphire laser system. X-ray diffraction and scanning electronic microscope were applied to examine the phase and morphology changes of the amorphous ribbons. Micromachining without crystallization, surface patterning, and selective crystallization were successfully achieved by changing laser parameters. Obvious crystallization occurred under the condition that the laser fluence was smaller than the ablation threshold, indicating that the structural evolution of the material depends strongly on the laser parameters. Back cooling method was used to inhibit heat accumulation; a reversible transformation between the disordered amorphous and crystalline phases can be achieved by using this method.

Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

International Nuclear Information System (INIS)

Li, Yi; Lim, Adeline B.Y.; Luo, Kaiming; Chen, Zhong; Wu, Fengshun; Chan, Y.C.

2016-01-01

The evolution of microstructure in Cu/In–48Sn/Cu solder bump interconnects at a current density of 0.7 × 10"4 A/cm"2 and ambient temperature of 55 °C has been investigated. During electromigration, tin (Sn) atoms migrated from cathode to anode, while indium (In) atoms migrated from anode to cathode. As a result, the segregation of the Sn-rich phase and the In-rich phase occurred. A Sn-rich layer and an In-rich layer were formed at the anode and the cathode, respectively. The accumulation rate of the Sn-rich layer was 1.98 × 10"−"9 cm/s. The atomic flux of Sn was calculated to be approximately 1.83 × 10"1"3 atoms/cm"2s. The product of the diffusivity and the effective charge number of Sn was determined to be approximately 3.13 × 10"−"1"0 cm"2/s. The In–48Sn/Cu IMC showed a two layer structure of Cu_6(Sn,In)_5, adjacent to the Cu, and Cu(In,Sn)_2, adjacent to the solder. Both the cathode IMC and the anode IMC thickened with increasing electromigration time. The IMC evolution during electromigration was strongly influenced by the migration of Cu atoms from cathode to anode and the accumulation of Sn-rich and In-rich layers. During electromigration, the Cu(In,Sn)_2 at the cathode interface thickened significantly, with a spalling characteristic, due to the accumulation of In-rich layer and the migration of Cu atoms - while the Cu(In,Sn)_2 at the anode interface reduced obviously, due to the accumulation of Sn-rich layer. The mechanism of electromigration-induced failure in Cu/In–48Sn/Cu interconnects was the cathode Cu dissolution-induced solder melt, which led to the rapid consumption of Cu in the cathode pad during liquid-state electromigration and this finally led to the failure. - Highlights: • Sn migrates to the anode, while In migrates to the cathode, during EM in Cu/In–48Sn/Cu. • The atomic flux of Sn has been calculated. • The interfacial IMCs were identified as: Cu_6(Sn,In)_5 + Cu(In,Sn)_2. • The interface evolution is strongly

Effect of Nb on glass forming ability and plasticity of (Ti-Cu)-based bulk metallic glasses

International Nuclear Information System (INIS)

Suo, Z.Y.; Qiu, K.Q.; Li, Q.F.; Ren, Y.L.; Hu, Z.Q.

2010-01-01

A Ti 33 Cu 47 Zr 9 Ni 6 Sn 2 Si 1 Nb 2 bulk metallic glass has been developed by Nb partial substitution for Zr in Ti 33 Cu 47 Zr 11 Ni 6 Sn 2 Si 1 alloy. The glass forming ability Ti 33 Cu 47 Zr 9 Ni 6 Sn 2 Si 1 Nb 2 alloy has been investigated using differential scanning calorimetry and X-ray diffractometry. Partial Nb substitutes for Zr promote the glass forming ability. Ti 33 Cu 47 Zr 9 Ni 6 Sn 2 Si 1 Nb 2 BMG with diameter of 3 mm can be fabricated by Cu-mold injection casting method. The glass forming ability of Ti 33 Cu 47 Zr 9 Ni 6 Sn 2 Si 1 Nb 2 alloy is enhanced by stabilizing the undercooled liquid against crystallization. The plastic strain up to 2.5% was obtained for Ti 33 Cu 47 Zr 9 Ni 6 Sn 2 Si 1 Nb 2 BMG compared to 0.15% for Ti 33 Cu 47 Zr 11 Ni 6 Sn 2 Si 1 BMG, which demonstrates that small amount of Nb addition can have a dramatic effect on plasticity enhancement in Ti-Cu-based BMG. The intersection and branching of the shear bands are observed. The plastic strain of the Ti 33 Cu 47 Zr 9 Ni 6 Sn 2 Si 1 Nb 2 BMG can be improved by the generation of nanocrystalline particles, which lead to multiple shear bands.

Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

International Nuclear Information System (INIS)

Park, M.S.; Stephenson, M.K.; Shannon, C.; Cáceres Díaz, L.A.; Hudspeth, K.A.; Gibbons, S.L.; Muñoz-Saldaña, J.; Arróyave, R.

2012-01-01

Cu/Sn soldering alloys have emerged as a viable alternative to Pb-based solders, and thus have been extensively explored in the past decade, although the fine-scale behavior of the resulting intermetallic compounds (IMCs), particularly during the early stages of interface formation, is still a source of debate. In this work, the microstructural evolution of Cu 6 Sn 5 , in a Cu/Sn soldering reaction at 523 K, was experimentally investigated by dipping a single Cu sample into molten Sn at a near-constant speed, yielding a continuous set of time evolution samples. The thickness, coarsening and morphology evolution of the Cu 6 Sn 5 layer is investigated through the use of scanning electron microscopy. The experimental results are also compared to phase-field simulations of the microstructural evolution of the Cu 6 Sn 5 layer. The influence of model parameters on the kinetics and morphological evolution of the IMC layer was examined. In general, good qualitative agreement is found between experiments and simulations and for a limited parameter set there appears to be good quantitative agreement between the growth kinetics of the Cu 6 Sn 5 layer, the grain boundary (GB) effect on grain coarsening, and the substrate/IMC interface roughness evolution. Furthermore, the parametric investigations of the model suggests that good agreement between experiments and simulations is achieved when the dominant transport mechanism for the reacting elements (Cu and Sn) is GB diffusion.

Determinação das propriedades termomecânicas de ligas Cu-Al-Ni e Cu-Al-Be com efeito memória de forma para utilização como atuadores mecânicos

OpenAIRE

Oliveira, Danniel Ferreira de

2009-01-01

Ligas Cu-Al-Ni e Cu-Al-Be forma elaboradas sob atmosfera ambiente e caracterizadas por microscopia, difração de R-X e Calorimetria Diferencial de varredura. Foram realizados nestas ligas ensaios de tração, recuperação de forma e superelasticidade. As propriedades termomecânicas destas ligas realizadas em diferentes temperaturas permitiu concluir que as ligas Cu-Al-Ni podem ser utilizadas como atuadores mecânicos para temperaturas acima de 90°C e que estas ligas não devem ser empregadas em tem...

Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn

Science.gov (United States)

O, M.; Suzuki, T.; Kajihara, M.

2018-01-01

The Cu/Sn system is one of the most fundamental and important metallic systems for solder joints in electric devices. To realize reliable solder joints, information on reactive diffusion at the solder joint is very important. In the present study, we experimentally investigated the kinetics of the reactive diffusion between solid Cu and liquid Sn using semi-infinite Cu/Sn diffusion couples prepared by an isothermal bonding technique. Isothermal annealing of the diffusion couple was conducted in the temperature range of 533-603 K for various times up to 172.8 ks (48 h). Using annealing, an intermetallic layer composed of Cu6Sn5 with scallop morphology and Cu3Sn with rather uniform thickness is formed at the original Cu/Sn interface in the diffusion couple. The growth of the Cu6Sn5 scallop occurs much more quickly than that of the Cu3Sn layer and thus predominates in the overall growth of the intermetallic layer. This tendency becomes more remarkable at lower annealing temperatures. The total thickness of the intermetallic layer is proportional to a power function of the annealing time, and the exponent of the power function is close to unity at all the annealing temperatures. This means that volume diffusion controls the intermetallic growth and the morphology of the Cu6Sn5/Sn interface influences the rate-controlling process. Adopting a mean value of 0.99 for the exponent, we obtain a value of 26 kJ/mol for the activation enthalpy of the intermetallic growth.

Fabrication and thermoelectric properties of fine-grained TiNiSn compounds

International Nuclear Information System (INIS)

Zou Minmin; Li Jingfeng; Du Bing; Liu Dawei; Kita, Takuji

2009-01-01

Nearly single-phased TiNiSn half-Heusler compound thermoelectric materials were synthesized by combining mechanical alloying (MA) and spark plasma sintering (SPS) in order to reduce its thermal conductivity by refining the grain sizes. Although TiNiSn compound powders were not synthesized directly via MA, dense bulk samples of TiNiSn compound were obtained by the subsequent SPS treatment. It was found that an excessive Ti addition relative to the TiNiSn stoichiometry is effective in increasing the phase purity of TiNiSn half-Heusler phase in the bulk samples, by compensating for the Ti loss caused by the oxidation of Ti powders and MA processing. The maximum power factor value obtained in the Ti-compensated sample is 1720 μW m -1 K -2 at 685 K. A relatively high ZT value of 0.32 is achieved at 785 K for the present undoped TiNiSn compound polycrystals. - Graphical abstract: Nearly single-phased TiNiSn-based half-Heusler compound polycrystalline materials with fine grains were fabricated by combining mechanical alloying (MA) and spark plasma sintering (SPS). A high ZT value for undoped TiNiSn was obtained because of the reduced thermal conductivity.

NiTiCu/AlN/NiTiCu shape memory thin film heterostructures for vibration damping in MEMS

Energy Technology Data Exchange (ETDEWEB)

Kaur, Navjot; Kaur, Davinder, E-mail: dkaurfph@iitr.ernet.in

2014-03-25

Highlights: • Fabrication of NiTiCu/AlN/NiTiCu heterostructure using dc/rf magnetron sputtering. • Exhibits highest hardness (38 GPa) and elastic modulus (187 GPa). • Enhanced dissipation of mechanical energy (E{sub d} = 5.7 N J). • High damping capacity (0.052) and figure of merit (∼0.62). • Can be applied for vibration damping in MEMS. -- Abstract: Shape memory alloy (NiTiCu) thin films coupled with piezoelectric AlN layer produce an intelligent material for vibration damping. In the present study pure NiTiCu, NiTiCu/AlN and NiTiCu/AlN/NiTiCu heterostructures have been deposited on Si substrate using magnetron sputtering technique. By the use of the interfaces and shape memory effect provided by NiTiCu layers, the damping capacity can be increased along with increase in stiffness and mechanical hardness. The heterostructures were characterized in terms of structural, electrical, morphological and mechanical properties by X-ray diffraction (XRD), four probe resistivity method, atomic force microscopy, field emission scanning electron microscopy, and nanoindentation. The NiTiCu/AlN/NiTiCu heterostructure exhibit enhanced mechanical and damping properties as compared to NiTiCu/AlN and pure NiTiCu. This enhancement in hardness and damping of the heterostructure could be attributed to the shape memory effect of NiTiCu, intrinsic piezoelectricity of AlN and increased number of interfaces in heterostructure that help in dissipation of mechanical vibrations. The findings of this work provide additional impetus for the application of these heterostructures in emerging fields of nanotechnology and microelectro mechanical (MEMS) devices.

NiTiCu/AlN/NiTiCu shape memory thin film heterostructures for vibration damping in MEMS

International Nuclear Information System (INIS)

Kaur, Navjot; Kaur, Davinder

2014-01-01

Highlights: • Fabrication of NiTiCu/AlN/NiTiCu heterostructure using dc/rf magnetron sputtering. • Exhibits highest hardness (38 GPa) and elastic modulus (187 GPa). • Enhanced dissipation of mechanical energy (E d = 5.7 N J). • High damping capacity (0.052) and figure of merit (∼0.62). • Can be applied for vibration damping in MEMS. -- Abstract: Shape memory alloy (NiTiCu) thin films coupled with piezoelectric AlN layer produce an intelligent material for vibration damping. In the present study pure NiTiCu, NiTiCu/AlN and NiTiCu/AlN/NiTiCu heterostructures have been deposited on Si substrate using magnetron sputtering technique. By the use of the interfaces and shape memory effect provided by NiTiCu layers, the damping capacity can be increased along with increase in stiffness and mechanical hardness. The heterostructures were characterized in terms of structural, electrical, morphological and mechanical properties by X-ray diffraction (XRD), four probe resistivity method, atomic force microscopy, field emission scanning electron microscopy, and nanoindentation. The NiTiCu/AlN/NiTiCu heterostructure exhibit enhanced mechanical and damping properties as compared to NiTiCu/AlN and pure NiTiCu. This enhancement in hardness and damping of the heterostructure could be attributed to the shape memory effect of NiTiCu, intrinsic piezoelectricity of AlN and increased number of interfaces in heterostructure that help in dissipation of mechanical vibrations. The findings of this work provide additional impetus for the application of these heterostructures in emerging fields of nanotechnology and microelectro mechanical (MEMS) devices

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

International Nuclear Information System (INIS)

Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

2011-01-01

Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

Preparation of PtSnCu/C and PtSn/C electrocatalysts and activation by dealloying processes for ethanol electrooxidation

International Nuclear Information System (INIS)

Crisafulli, Rudy

2013-01-01

PtSnCu/C (with different Pt:Sn:Cu atomic ratios) and PtSn/C (50:50) electrocatalysts were prepared by borohydride (BR) and alcohol-reduction (AR) processes using H 2 PtCl 6 .6H 2 O, SnCl 2 .2H 2 O and CuCl 2 .2H 2 O as metal sources, NaBH 4 and ethylene glycol as reducing agents, 2-propanol and ethylene glycol/water as solvents and carbon black as support. In a further step, these electrocatalysts were activated by chemical (CD) and electrochemical (ED) dealloying processes through acid treatment and thin porous coating technique, respectively. These materials were characterized by energy dispersive X-ray, Xray diffraction, transmission electron microscopy, line scan energy dispersive Xray and cyclic voltammetry. Electrochemical studies for ethanol electro-oxidation were performed by cyclic voltammetry, chronoamperometry and in single Direct Ethanol Fuel Cell using Membrane Electrode Assembly (MEA). The anodic effluents were analysed by gas chromatography. The X-ray diffractograms of the as-synthesized electrocatalysts showed the typical face-centered cubic structure (FCC) of platinum and its alloys. After dealloying, the X-ray diffractograms showed that the Pt FCC structure was preserved. The crystallite sizes of the assynthesized electrocatalysts were in the range of PtSnCu/C (50:40:10) AR/ED > PtSnCu/C (50:10:40) BR/CD. PtSn/C (50:50) BR/CD, PtSnCu/C (50:10:40) BR/CD, PtSnCu/C (50:40:10) AR/CD electrocatalysts and Pt/C BASF, PtSn/C (75:25) BASF commercial electrocatalysts were tested in single Direct Ethanol Fuel Cell. The results showed the following performance for ethanol electro-oxidation: PtSn/C (50:50) BR/CD > PtSnCu/C (50:40:10) AR/CD > PtSnCu/C > PtSn/C (75:25) BASF > PtSnCu/C (50:10:40) BR/CD > Pt/C BASF. (author)

Plan de Mercadeo para una “FinTech”.

OpenAIRE

Escalante Lee, Maria Alejandra

2016-01-01

Las empresas deben contar con una misión clara, estableciendo los objetivos de apoyo, diseñando una cartera de negocio sólida y coordinar sus estrategias a futuro, con el fin de cumplir las metas propuestas para entregar e intercambiar ofertas que tienen valor para los consumidores, clientes, socios y la sociedad en general. El presente trabajo de grado tiene como objetivo proponer un plan de mercadeo para la empresa Comyno una FinTech ubicada en Frankfurt am Main, en Alemania. Este tiene ...

Enhanced Thermoelectric Properties of Graphene/Cu2SnSe3 Composites

Directory of Open Access Journals (Sweden)

Degang Zhao

2017-02-01

Full Text Available Cu2SnSe3 material is regarded as a potential thermoelectric material due to its relatively high carrier mobility and low thermal conductivity. In this study, graphene was introduced into the Cu2SnSe3 powder by ball milling, and the bulk graphene/Cu2SnSe3 thermoelectric composites were prepared by spark plasma sintering. The graphene nanosheets distributed uniformly in the Cu2SnSe3 matrix. Meanwhile, some graphene nanosheets tended to form thick aggregations, and the average length of these aggregations was about 3 μm. With the fraction of graphene increasing, the electrical conductivity of graphene/Cu2SnSe3 samples increased greatly while the Seebeck coefficient was decreased. The introduction of graphene nanosheets can reduce the thermal conductivity effectively resulting from the phonon scattering by the graphene interface. When the content of graphene exceeds a certain value, the thermal conductivity of graphene/Cu2SnSe3 composites starts to increase. The achieved highest figure of merit (ZT for 0.25 vol % graphene/Cu2SnSe3 composite was 0.44 at 700 K.

Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

Science.gov (United States)

Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

2004-10-01

It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

Formation of anomalous eutectic in Ni-Sn alloy by laser cladding

Science.gov (United States)

Wang, Zhitai; Lin, Xin; Cao, Yongqing; Liu, Fencheng; Huang, Weidong

2018-02-01

Ni-Sn anomalous eutectic is obtained by single track laser cladding with the scanning velocity from 1 mm/s to 10 mm/s using the Ni-32.5 wt.%Sn eutectic powders. The microstructure of the cladding layer and the grain orientations of anomalous eutectic were investigated. It is found that the microstructure is transformed from primary α-Ni dendrites and the interdendritic (α-Ni + Ni3Sn) eutectic at the bottom of the cladding layer to α-Ni and β-Ni3Sn anomalous eutectic at the top of the cladding layer, whether for single layer or multilayer laser cladding. The EBSD maps and pole figures indicate that the spatially structure of α-Ni phase is discontinuous and the Ni3Sn phase is continuous in anomalous eutectic. The transformation from epitaxial growth columnar at bottom of cladding layer to free nucleation equiaxed at the top occurs, i.e., the columnar to equiaxed transition (CET) at the top of cladding layer during laser cladding processing leads to the generation of anomalous eutectic.

Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings

Directory of Open Access Journals (Sweden)

Zhao G.L.

2015-06-01

Full Text Available Ni-P/Cu/Ni-P multilayer coatings were prepared by deposition of Cu layer between two Ni–P layers. The Cu layer was deposited by metal displacement reaction between Cu2+ and Fe atoms. Corrosion behavior of single-layer Ni-P coatings, double-layer Ni-P/Cu coatings, and three-layer Ni-P/Cu/Ni-P coatings were investigated by electrochemical tests in 3.5% NaCl solution. The three-layer coatings exhibited more positive Ecorr and decreased Icorr compared with conventional single-layer Ni-P coatings, which indicated an improved corrosion resistance. The polarization curves of the three-layer coatings were characterized by two passive regions. The improved corrosion resistance was not only attributed to the function of the blocked pores of Cu. The Cu interlayer also acted as a sacrificial layer instead of a barrier in the coatings, which altered the corrosion mechanism and further improved the corrosion resistance of the coatings.

Muon spin rotation measurements on LaNiSn

International Nuclear Information System (INIS)

Drew, A.J.; Lee, S.L.; Ogrin, F.Y.; Charalambous, D.; Bancroft, N.; Paul, D. McK.; Takabatake, T.; Baines, C.

2006-01-01

The first microscopic investigation of superconductivity in LaNiSn is reported using muon spin rotation. LaNiSn is found to be mainly a type I superconductor in an intermediate state with some evidence for type II behaviour at low temperatures, possibly due to a temperature dependent Ginzburg Landau parameter κ

Synthesis and magnetic properties of multilayer Ni/Cu and NiFe/Cu ...

Indian Academy of Sciences (India)

The diameter of wires can be easily varied by pore size of alumina, ranging ... saturated HgCl2 solution to remove the remaining Al, and then dipped in 5 wt% ... for NiFe alloy it is 1.3 V, that is higher than for Ni/Cu nanowires to diminish Cu.

Improvement of H2S Sensing Properties of SnO2-Based Thick Film Gas Sensors Promoted with MoO3 and NiO

Directory of Open Access Journals (Sweden)

In Sung Son

2013-03-01

Full Text Available The effects of the SnO2 pore size and metal oxide promoters on the sensing properties of SnO2-based thick film gas sensors were investigated to improve the detection of very low H2S concentrations (<1 ppm. SnO2 sensors and SnO2-based thick-film gas sensors promoted with NiO, ZnO, MoO3, CuO or Fe2O3 were prepared, and their sensing properties were examined in a flow system. The SnO2 materials were prepared by calcining SnO2 at 600, 800, 1,000 and 1,200 °C to give materials identified as SnO2(600, SnO2(800, SnO2(1000, and SnO2(1200, respectively. The Sn(12Mo5Ni3 sensor, which was prepared by physically mixing 5 wt% MoO3 (Mo5, 3 wt% NiO (Ni3 and SnO2(1200 with a large pore size of 312 nm, exhibited a high sensor response of approximately 75% for the detection of 1 ppm H2S at 350 °C with excellent recovery properties. Unlike the SnO2 sensors, its response was maintained during multiple cycles without deactivation. This was attributed to the promoter effect of MoO3. In particular, the Sn(12Mo5Ni3 sensor developed in this study showed twice the response of the Sn(6Mo5Ni3 sensor, which was prepared by SnO2(600 with the smaller pore size than SnO2(1200. The excellent sensor response and recovery properties of Sn(12Mo5Ni3 are believed to be due to the combined promoter effects of MoO3 and NiO and the diffusion effect of H2S as a result of the large pore size of SnO2.

The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

Science.gov (United States)

Sona, Mrunali; Prabhu, K. Narayan

2017-09-01

The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

Correlation between the resistivity and the atomic clusters in liquid Cu-Sn alloys

Science.gov (United States)

Jia, Peng; Zhang, Jinyang; Hu, Xun; Li, Cancan; Zhao, Degang; Teng, XinYing; Yang, Cheng

2018-05-01

The liquid structure of CuxSn100-x (x = 0, 10, 20, 33, 40, 50, 60, 75, 80 and 100) alloys with atom percentage were investigated with resistivity and viscosity methods. It can be found from the resistivity data that the liquid Cu75Sn25 and Cu80Sn20 alloys had a negative temperature coefficient of resistivity (TCR), and liquid Cu75Sn25 alloy had a minimum value of -9.24 μΩ cm K-1. While the rest of liquid Cu-Sn alloys had a positive TCR. The results indicated that the Cu75Sn25 atomic clusters existed in Cu-Sn alloys. In addition, the method of calculating the percentage of Cu75Sn25 atomic clusters was established on the basis of resistivity theory and the law of conservation of mass. The Cu75Sn25 alloy had a maximum volume of the atomic clusters and a highest activation energy. The results further proved the existence of Cu75Sn25 atomic clusters. Furthermore, the correlation between the liquid structure and the resistivity was established. These results provide a useful reference for the investigation of liquid structure via the sensitive physical properties to the liquid structure.

Influence of ni thickness on oscillation coupling in Cu/Ni multilayers

Energy Technology Data Exchange (ETDEWEB)

Gagorowska, B; Dus-Sitek, M [Institute of Physics, Czestochowa University of Technology, Al. Armii Krajowej 19, 42-200 Czestochowa (Poland)

2007-08-15

The results of investigation of magnetic properties of [Cu/Ni]x100 were presented. Samples were deposited by face-to-face sputtering method onto the silicon substrate, the thickness of Cu layer was constant (d{sub Cu} = 2 nm) and the thickness of Ni layer - variable (1 nm {<=} d{sub Ni} {<=} 6 nm). In Cu/Ni multilayers, for the thickness of Ni layer bigger than 2 nm antiferromagnetic coupling (A-F) were observed, for the thickness of Ni smaller than 2 nm A-F coupling is absent.

Influence of ni thickness on oscillation coupling in Cu/Ni multilayers

International Nuclear Information System (INIS)

Gagorowska, B; Dus-Sitek, M

2007-01-01

The results of investigation of magnetic properties of [Cu/Ni]x100 were presented. Samples were deposited by face-to-face sputtering method onto the silicon substrate, the thickness of Cu layer was constant (d Cu = 2 nm) and the thickness of Ni layer - variable (1 nm ≤ d Ni ≤ 6 nm). In Cu/Ni multilayers, for the thickness of Ni layer bigger than 2 nm antiferromagnetic coupling (A-F) were observed, for the thickness of Ni smaller than 2 nm A-F coupling is absent

Expresión de habilidades comunicativas para el desarrollo del pensamiento en niños de 5 a 6 años con el método filosofía para niños

OpenAIRE

Valverde Limbrick, Helen Roxana; Vargas Mora, Mónica Paola; Hidalgo Chinchilla, Rosa María; Núñez Picado, Dagoberto

2014-01-01

Esta es la síntesis de una iniciativa de investigación microetnográfica que dio seguimiento a una experiencia de Filosofía para Niños (FpN) desarrollada en un jardín de niños en San José, en el año 2010. Para su ejecución se realizó una dinámica interactiva entre la docente y el grupo investigador quien ofreció capacitación previa y durante el proceso a la educadora en lo que es Filosofía para niños. Con fin de incentivar el pensamiento filosófico del grupo se hace uso de las lecturas del lib...

Pulsed laser deposition of Cu-Sn-S for thin film solar cells

DEFF Research Database (Denmark)

Ettlinger, Rebecca Bolt; Crovetto, Andrea; Bosco, Edoardo

Thin films of copper tin sulfide were deposited from a target of the stoichiometry Cu:Sn:S ~1:2:3 using pulsed laser deposition (PLD). Annealing with S powder resulted in films close to the desired Cu2SnS3 stoichiometry although the films remained Sn rich. Xray diffraction showed that the final...... films contained both cubic-phase Cu2SnS3 and orthorhombic-phase SnS...

Phase separation and antisite defects in the thermoelectric TiNiSn half-Heusler alloys

International Nuclear Information System (INIS)

Kirievsky, K.; Gelbstein, Y.; Fuks, D.

2013-01-01

The half-Heusler TiNiSn alloys have recently gained an attention as promising candidates for thermoelectric applications. Improvement of these alloys for such applications can be obtained by both electronic and compositional optimizations. The latter can result in a miscibility gap, allowing a phase separation in the nano-scale and consequently a thermal conductivity reduction. Combination of ab initio calculations and statistical thermodynamics was applied for studying the relative stability of a number of superstructures in TiNiSn based alloys. The quasi-binary phase diagram beyond T=0 K for TiNiSn–TiNi 2 Sn solid solutions was calculated using energy parameters extracted from the total energy calculations for ordered structures in the Ni sublattice. We demonstrated that a decomposition of the off-stoichiometric Ni-rich half-Heusler alloy into the stoichiometric TiNiSn phase and into Ni deficient Heusler TiNi 2 Sn phase occurs at elevated temperatures—an effect which recently had been observed experimentally. Furthermore, favorable energetic conditions for antisite defects formation were deduced, based on calculations of the energy of formation, an effect which was explained as a cooperative process of partial disordering on the Ni sublattice. The influence of these two effects on improvement of the thermoelectric performance of TiNiSn based half Heusler compounds is discussed. - Graphical abstract: Phase separation and antisite defects in the thermoelectric TiNiSn alloy, are covered as methods for nanostructuring and thereby enhancement of the thermoelectric potential. - Highlights: • Ab initio calculations/statistical thermodynamics was applied for studying the TiNiSn system. • The phase diagram for TiNiSn–TiNi 2 Sn solid solutions was calculated. • Decomposition of the Ni-rich HH into TiNiSn and Ni deficient TiNi 2 Sn phases was observed. • Favorable energetic conditions for antisite defects formation were deduced

Application of single pan thermal analysis to Cu-Sn peritectic alloys

International Nuclear Information System (INIS)

Kohler, F.; Campanella, T.; Nakanishi, S.; Rappaz, M.

2008-01-01

Single pan thermal analyses (SPTA) have been performed on Cu-14.5 wt.% Sn, Cu-21.3 wt.% Sn and Cu-26.8 wt.% Sn peritectic alloys. For this purpose, a SPTA assembly has been built and calibrated. As the latent heat is a function of temperature and composition during solidification of alloys, a new heat flow model coupled to a Cu-Sn thermodynamic database has been defined for the calculation of the corresponding evolutions of the solid mass fraction, f s (T). To verify the accuracy of this model, a close comparison with a microsegregation model that includes back-diffusion in the primary α-solid phase has also been conducted successfully. The thermal analyses have finally shown that the Cu-Sn phase diagram recently assessed in the review of Liu et al. is the most reliable

Structures, energetics and magnetic properties of (NiSn) n clusters ...

Indian Academy of Sciences (India)

The preference for tetrahedron unit of Ni3 Sn is seen in the lowest-energy configuration of these clusters. The multi-centre bonding between Ni atoms play an important role in stabilizing the stoichiometric Ni–Sn clusters. Doping of Sn atoms enhances the binding energy and reduces the ionization potential of nickel clusters.

Enthalpy of mixing of liquid Ni-Zr and Cu-Ni-Zr alloys

International Nuclear Information System (INIS)

Witusiewicz, V.T.; Sommer, F.

2000-01-01

Since the Al-Cu-Ni-Zr system is a basis for the production of bulk amorphous materials by rapid solidification techniques from the liquid state, it is of great scientific interest to determine the partial and the integral thermodynamic functions of liquid and undercooled liquid alloys. Such data, as was pointed out previously, are important in order to understand their extremely good glass-forming ability in multicomponent metallic systems as well as for processing improvements. In order to measure the thermodynamic properties of the Al-Cu-Ni-Zr quaternary, it is necessary to have reliable thermochemical data for its constituent canaries and ternaries first. In a series of articles, the authors have reported in detail the thermodynamic properties of liquid Al-Cu, Al-Ni, Cu-Ni, Cu-Zr, Al-Zr, Al-Cu-Ni, and Al-Cu-Zr alloys. This article deals with the direct calorimetric measurements of the partial and the integral enthalpies of mixing of liquid Ni-Zr and Cu-Ni-Zr alloys and the heat capacity of liquid Ni 26 Zr 74 . In a subsequent article, the authors will present similar data for the liquid ternary Al-Ni-Zr and for the liquid quaternary Al-Cu-Ni-Zr alloys

CuSn(OH)6 submicrospheres: Room-temperature synthesis, growth mechanism, and weak antiferromagnetic behavior

International Nuclear Information System (INIS)

Zhong, Sheng-Liang; Xu, Rong; Wang, Lei; Li, Yuan; Zhang, Lin-Fei

2011-01-01

Highlights: ► CuSn(OH) 6 spheres have been synthesized via an aqueous solution method at room temperature. ► The diameters of the CuSn(OH) 6 spheres can be tuned by adjusting the molar ratio of SnO 3 2− to Cu 2+ . ► The as-obtained CuSn(OH) 6 spheres are antiferromagnetic and have a weak spin-Peierls transition at about 78 K -- Abstract: CuSn(OH) 6 submicrospheres with diameters of 400–900 nm have been successfully fabricated using a simple aqueous solution method at room temperature. Influencing factors such as the dosage of reactants and reaction time on the preparation were systematically investigated. The products were characterized with X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM), transmission electron microscopy (TEM), thermogravimetric analysis (TG) and differential thermal analysis (DTA). Results reveal that the CuSn(OH) 6 spheres are built from numerous nanoparticles. It is found that the diameter of CuSn(OH) 6 spheres can be readily tuned by adjusting the molar ratio of SnO 3 2− to Cu 2+ . A possible growth mechanism for the CuSn(OH) 6 submicrospheres has been proposed. Amorphous CuSnO 3 submicrospheres were obtained after thermal treatment of the CuSn(OH) 6 submicrospheres at 300 °C for 4 h. Standard magnetization measurements demonstrate that the CuSn(OH) 6 submicrospheres are antiferromagnetic and have a weak spin-Peierls transition at about 78 K.

Impact of Interstitial Ni on the Thermoelectric Properties of the Half-Heusler TiNiSn

Directory of Open Access Journals (Sweden)

Sonia A. Barczak

2018-03-01

Full Text Available TiNiSn is an intensively studied half-Heusler alloy that shows great potential for waste heat recovery. Here, we report on the structures and thermoelectric properties of a series of metal-rich TiNi1+ySn compositions prepared via solid-state reactions and hot pressing. A general relation between the amount of interstitial Ni and lattice parameter is determined from neutron powder diffraction. High-resolution synchrotron X-ray powder diffraction reveals the occurrence of strain broadening upon hot pressing, which is attributed to the metastable arrangement of interstitial Ni. Hall measurements confirm that interstitial Ni causes weak n-type doping and a reduction in carrier mobility, which limits the power factor to 2.5–3 mW m−1 K−2 for these samples. The thermal conductivity was modelled within the Callaway approximation and is quantitively linked to the amount of interstitial Ni, resulting in a predicted value of 12.7 W m−1 K−1 at 323 K for stoichiometric TiNiSn. Interstitial Ni leads to a reduction of the thermal band gap and moves the peak ZT = 0.4 to lower temperatures, thus offering the possibility to engineer a broad ZT plateau. This work adds further insight into the impact of small amounts of interstitial Ni on the thermal and electrical transport of TiNiSn.

Porous SnO2-CuO nanotubes for highly reversible lithium storage

Science.gov (United States)

Cheong, Jun Young; Kim, Chanhoon; Jung, Ji-Won; Yoon, Ki Ro; Kim, Il-Doo

2018-01-01

Facile synthesis of rationally designed structures is critical to realize a high performance electrode for lithium-ion batteries (LIBs). Among different candidates, tin(IV) oxide (SnO2) is one of the most actively researched electrode materials due to its high theoretical capacity (1493 mAh g-1), abundance, inexpensive costs, and environmental friendliness. However, severe capacity decay from the volume expansion and low conductivity of SnO2 have hampered its use as a feasible electrode for LIBs. Rationally designed SnO2-based nanostructures with conductive materials can be an ideal solution to resolve such limitations. In this work, we have successfully fabricated porous SnO2-CuO composite nanotubes (SnO2-CuO p-NTs) by electrospinning and subsequent calcination step. The porous nanotubular structure is expected to mitigate the volume expansion of SnO2, while the as-formed Cu from CuO upon lithiation allows faster electron transport by improving the low conductivity of SnO2. With a synergistic effect of both Sn and Cu-based oxides, SnO2-CuO p-NTs deliver stable cycling performance (91.3% of capacity retention, ∼538 mAh g-1) even after 350 cycles at a current density of 500 mA g-1, along with enhanced rate capabilities compared with SnO2.

Cu-Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO2 to CO

KAUST Repository

Sarfraz, Saad

2016-03-23

We report a selective and stable electrocatalyst utilizing non-noble metals consisting of Cu and Sn for the efficient and selective reduction of CO2 to CO over a wide potential range. The bimetallic electrode was prepared through the electrodeposition of Sn species on the surface of oxide-derived copper (OD-Cu). The Cu surface, when decorated with an optimal amount of Sn, resulted in a Faradaic efficiency (FE) for CO greater than 90% and a current density of −1.0 mA cm−2 at −0.6 V vs. RHE, compared to the CO FE of 63% and −2.1 mA cm−2 for OD-Cu. Excess Sn on the surface caused H2 evolution with a decreased current density. X-ray diffraction (XRD) suggests the formation of Cu-Sn alloy. Auger electron spectroscopy of the sample surface exhibits zero-valent Cu and Sn after the electrodeposition step. Density functional theory (DFT) calculations show that replacing a single Cu atom with a Sn atom leaves the d-band orbitals mostly unperturbed, signifying no dramatic shifts in the bulk electronic structure. However, the Sn atom discomposes the multi-fold sites on pure Cu, disfavoring the adsorption of H and leaving the adsorption of CO relatively unperturbed. Our catalytic results along with DFT calculations indicate that the presence of Sn on reduced OD-Cu diminishes the hydrogenation capability—i.e., the selectivity towards H2 and HCOOH—while hardly affecting the CO productivity. While the pristine monometallic surfaces (both Cu and Sn) fail to selectively reduce CO2, the Cu-Sn bimetallic electrocatalyst generates a surface that inhibits adsorbed H*, resulting in improved CO FE. This study presents a strategy to provide a low-cost non-noble metals that can be utilized as a highly selective electrocatalyst for the efficient aqueous reduction of CO2.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

International Nuclear Information System (INIS)

Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

2010-01-01

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

Energy Technology Data Exchange (ETDEWEB)

Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

2010-02-18

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Corrosion behavior of Zr-x(Nb, Sn and Cu) binary alloys

International Nuclear Information System (INIS)

Kim, M. H.; Lee, M. H.; Park, S. Y.; Jung, Y. H.; We, M. Y.

1999-01-01

For the development of advanced zirconium alloys for nuclear fuel cladding, the corrosion behaviors of zirconium binary alloys were studied on the Zr-xNb, Zr-xSn, and Zr-xCu alloys. The corrosion test were performed in water at 360 deg C, steam at 400 deg C and LiOH at 360 deg C for 45 days. The corrosion behaviors of Zr-xNb was similar to that of Zr-xCu alloys. However, the corrosion behavior of Zr-xSn was different from Zr-xNb and Zr-xCu. The weight gain of Zr-xNb and Zr-xCu was increased with addition of alloying elements. When Sn is added to Zr matrix in range below the solubility limit, the corrosion resistance decrease with increasing Sn-content, while in the range over solubility limit, Sn has an adverse effect on the corrosion resistance. Especially, Zr-xSn alloys showed higher corrosion resistance than Zr-xNb and Zr-xCu alloys in LiOH solution

Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

International Nuclear Information System (INIS)

NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

2007-01-01

Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

Ternary systems Sr-{Ni,Cu}-Si: Phase equilibria and crystal structure of ternary phases

International Nuclear Information System (INIS)

Nasir, Navida; Melnychenko-Koblyuk, Nataliya; Grytsiv, Andriy; Rogl, Peter; Giester, Gerald; Wosik, Jaroslaw; Nauer, Gerhard E.

2010-01-01

Phase relations were established in the Sr-poor part of the ternary systems Sr-Ni-Si (900 deg. C) and Sr-Cu-Si (800 deg. C) by light optical microscopy, electron probe microanalysis and X-ray diffraction on as cast and annealed alloys. Two new ternary compounds SrNiSi 3 (BaNiSn 3 -type) and SrNi 9-x Si 4+x (own-type) were found in the Sr-Ni-Si system along with previously reported Sr(Ni x Si 1-x ) 2 (AlB 2 -type). The crystal structure of SrNi 9-x Si 4+x (own-type, x=2.7, a=0.78998(3), c=1.1337(2) nm; space group P4/nbm) was determined from X-ray single crystal counter to be a low symmetry derivative of the cubic, parent NaZn 13 -type. At higher Si-content X-ray Rietveld refinements reveal the formation of a vacant site (□) corresponding to a formula SrNi 5.5 Si 6.5 □ 1.0 . Phase equilibria in the Sr-Cu-Si system are characterized by the compounds SrCu 2-x Si 2+x (ThCr 2 Si 2 -type), Sr(Cu x Si 1-x ) 2 (AlB 2 -type), SrCu 9-x Si 4+x (0≤x≤1.0; CeNi 8.5 Si 4.5 -type) and SrCu 13-x Si x (4≤x≤1.8; NaZn 13 -type). The latter two structure types appear within a continuous solid solution. Neither a type-I nor a type-IX clathrate compound was encountered in the Sr-{Cu,Ni}-Si systems. Structural details are furthermore given for about 14 new ternary compounds from related alloy systems with Ba. - Graphical abstract: The crystal structure of SrNi 9-x Si 4+x (own-type, x=2.7, a=0.78998(3), c=1.1337(2) nm; space group P4/nbm) was determined from X-ray single crystal counter to be a low symmetry derivative of the cubic, parent NaZn 13 -type and is related to CeNi 8.5 Si 4.5 -type.

Controlled Synthesis of Heterostructured SnO2-CuO Composite Hollow Microspheres as Efficient Cu-Based Catalysts for the Rochow Reaction

Directory of Open Access Journals (Sweden)

Hezhi Liu

2018-04-01

Full Text Available In this work, we report the design and synthesis of a series of heterostructured SnO2-CuO hollow microspherical catalysts (H-SnO2(x-CuO, x is the weight ratio of Sn/Cu for the Rochow reaction. The microspherical catalysts with nanosheets and nanoparticles as building blocks were prepared by a facile one-pot hydrothermal method coupled with calcination. When tested for the Rochow reaction, the prepared H-SnO2(0.2-CuO composite exhibited higher dimethyldichlorosilane selectivity (88.2% and Si conversion (36.7% than the solid CuO, hollow CuO and other H-SnO2(x-CuO microspherical samples, because in the former there is a stronger synergistic interaction between CuO and SnO2.

The activation energy for loop growth in Cu and Cu-Ni alloys

International Nuclear Information System (INIS)

Barlow, P.; Leffers, T.; Singh, B.N.

1978-08-01

The apparent activation energy for the growth of interstitial dislocation loops in copper, Cu-1%Ni, Cu-2%Ni, and Cu-5%Ni during high voltage electron microscope irradiation was determined. The apparent activation energy for loop growth in all these materials can be taken to be 0.34eV+-0.02eV. This value together with the corresponding value of 0.44eV+-0.02eV determined earlier for Cu-10%Ni is discussed with reference to the void growth rates observed in these materials. The apparent activation energy for loop growth in copper (and in Cu-1%Ni that has a void growth rate similar to that in pure copper) is interpreted as twice the vacancy migration energy (indicating that divacancies do not play any significant role). For the materials with higher Ni content (in which the void growth rate is much lower than that in Cu and Cu-1%Ni) the measured apparent activation energy is interpreted to be characteristic of loops positioned fairly close to the foil surface and not of loops in ''bulk material''. From the present results in combination with the earlier results for Cu-10%Ni it is concluded that interstitial trapping is the most likely explanation of the reduced void growth rate in Cu-Ni alloys. (author)

Reference Data for the Density, Viscosity, and Surface Tension of Liquid Al-Zn, Ag-Sn, Bi-Sn, Cu-Sn, and Sn-Zn Eutectic Alloys

Science.gov (United States)

Dobosz, Alexandra; Gancarz, Tomasz

2018-03-01

The data for the physicochemical properties viscosity, density, and surface tension obtained by different experimental techniques have been analyzed for liquid Al-Zn, Ag-Sn, Bi-Sn, Cu-Sn, and Sn-Zn eutectic alloys. All experimental data sets have been categorized and described by the year of publication, the technique used to obtain the data, the purity of the samples and their compositions, the quoted uncertainty, the number of data in the data set, the form of data, and the temperature range. The proposed standard deviations of liquid eutectic Al-Zn, Ag-Sn, Bi-Sn, Cu-Sn, and Sn-Zn alloys are 0.8%, 0.1%, 0.5%, 0.2%, and 0.1% for the density, 8.7%, 4.1%, 3.6%, 5.1%, and 4.0% for viscosity, and 1.0%, 0.5%, 0.3%, N/A, and 0.4% for surface tension, respectively, at a confidence level of 95%.

Obtención y caracterización del polvo de bronce Cu88Sn6,5Zn4Pb1,5 para aplicaciones en cojinetes

Directory of Open Access Journals (Sweden)

Krivij, Natalia

2000-12-01

Full Text Available The aim of this work is the development of alloyed bronze powder Cu88Sn6,5Zn4Pb1,5 to substitute the material used in the manufacture of bearings with antifriction properties. The physical and chemical characterization of the powder has been carried out and an experimental 2³ design to determine the optimal parameters of the technological process of powder sintering has been used in the specific case of sealed bearing manufacture of the subset shaft-seal of the open cooling compressor.

El trabajo tiene como objetivo el desarrollo del polvo de bronce aleado Cu88Sn6,5Zn4Pb1,5 para sustituir el material originalmente utilizado en la fabricación de cojinetes con propiedades antifricción. Se realizó la caracterización física y química del polvo, y se empleó un diseño experimental 2³ con vistas a determinar los parámetros óptimos del proceso tecnológico de sinterización del polvo, para el caso específico de la fabricación del cojinete de sellaje del subconjunto eje-sello del compresor abierto de refrigeración.

Kinetics of the polymorphic phase transformation of Cu6Sn5

International Nuclear Information System (INIS)

Zeng, Guang; McDonald, Stuart D.; Read, Jonathan J.; Gu, Qinfen; Nogita, Kazuhiro

2014-01-01

Cu 6 Sn 5 is a critical intermetallic compound in soldering and three-dimensional integrated circuit packaging technology and exists in at least five different crystal structures in the solid state, with a polymorphic phase transformation from hexagonal to monoclinic structures occurring on cooling. The kinetics of polymorphic transformations in Sn-rich Cu 6 Sn 5 and Cu-rich Cu 6 Sn 5 is systematically investigated in this study. This includes the generation of continuous cooling transformation diagrams as well as time–temperature transformation diagrams. Techniques used include variable temperature synchrotron powder X-ray diffraction and differential scanning calorimetry. The findings have important implications for the manufacture of solder joints and their in-service performance

Plataforma terapeútica basada en Kinect para niños con parálisis cerebral infantil

OpenAIRE

Duro González, Belén

2015-01-01

El sistema SONRIE (Sistema de terapia, basadO en KiNect, paRa nIños con parálisis cErebral), realizado como Proyecto Fin de Grado por Dña. Estefanía Sampedro Sánchez, se desarrolló con el fin de permitir el proceso de rehabilitación de los músculos faciales en niños con Parálisis Cerebral Infantil (PCI). SONRIE se compone de una plataforma de juegos cuyo objetivo es lograr una mejora terapéutica en la musculatura orofacial de niños diagnosticados de PCI con edades comprendidas entre los 4 y l...

CO2 activation on bimetallic CuNi nanoparticles

Directory of Open Access Journals (Sweden)

Natalie Austin

2016-10-01

Full Text Available Density functional theory calculations have been performed to investigate the structural, electronic, and CO2 adsorption properties of 55-atom bimetallic CuNi nanoparticles (NPs in core-shell and decorated architectures, as well as of their monometallic counterparts. Our results revealed that with respect to the monometallic Cu55 and Ni55 parents, the formation of decorated Cu12Ni43 and core-shell Cu42Ni13 are energetically favorable. We found that CO2 chemisorbs on monometallic Ni55, core-shell Cu13Ni42, and decorated Cu12Ni43 and Cu43Ni12, whereas, it physisorbs on monometallic Cu55 and core-shell Cu42Ni13. The presence of surface Ni on the NPs is key in strongly adsorbing and activating the CO2 molecule (linear to bent transition and elongation of C˭O bonds. This activation occurs through a charge transfer from the NPs to the CO2 molecule, where the local metal d-orbital density localization on surface Ni plays a pivotal role. This work identifies insightful structure-property relationships for CO2 activation and highlights the importance of keeping a balance between NP stability and CO2 adsorption behavior in designing catalytic bimetallic NPs that activate CO2.

Terapias alternativas con animales para niños con necesidades especiales

OpenAIRE

Cea-Chueca, Aihnoa

2014-01-01

El presente trabajo de fin de grado consiste en la realización de un análisis y descripción de la literatura acerca de las distintas terapias animales, destinadas a niños con necesidades especiales: cómo y por qué surgieron, en qué consisten las terapias, cómo podemos utilizarlas, etc. Las terapias alternativas con animales se conocen como una alternativa terapéutica, donde se utiliza a un animal como co-terapeuta para poder desarrollar diferentes capacidades de los niños con necesidades espe...

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

International Nuclear Information System (INIS)

Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-01-01

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

Energy Technology Data Exchange (ETDEWEB)

Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-11-25

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

Optoelectronic characterizations of vacuum evaporated Cu 2 SnS 3 ...

African Journals Online (AJOL)

... of non-toxic, cheap earthly abundant, ternary compound of Cu2SnS3 thin film. ... film were investigated by X-Ray Diffraction and Scanning Electron Microscope. ... to determine the electrical properties of the deposited Cu2SnS3 ternary films.

Electrochemical properties of Ti-Ni-Sn materials predicted by {sup 119}Sn Mössbauer spectroscopy

Energy Technology Data Exchange (ETDEWEB)

Ladam, A., E-mail: alix.ladam@univ-montp2.fr; Aldon, L.; Lippens, P.-E.; Olivier-Fourcade, J.; Jumas, J.-C. [Université de Montpellier, Institut Charles Gerhardt, UMR 5253 CNRS (France); Cenac-Morthe, C. [CNES, Service DCT/TV/El (France)

2016-12-15

The electrochemical activity of TiNiSn, TiNi {sub 2}Sn and Ti {sub 6}Sn {sub 5} compounds considered as negative electrode materials for Li-ion batteries has been predicted from the isomer shift- Hume-Rothery electronic density correlation diagram. The ternary compounds were obtained from solid-state reactions and Ti {sub 6}Sn {sub 5} by ball milling. The {sup 119}Sn Mössbauer parameters were experimentally determined and used to evaluate the Hume-Rothery electronic density [e {sub av}]. The values of [e {sub av}] are in the region of Li-rich Li-Sn alloys for Ti {sub 6}Sn {sub 5} and outside this region for the ternary compounds, suggesting that the former compound is electrochemically active but not the two latter ones. Electrochemical tests were performed for these different materials confirming this prediction. The close values of [e {sub av}] for Ti {sub 6}Sn {sub 5} and Li-rich Li-Sn alloys indicate that the observed good capacity retention could be related to small changes in the global structures during cycling.

Preparation and characterization of Cu2SnS3 thin films by electrodeposition

Science.gov (United States)

Patel, Biren; Narasimman, R.; Pati, Ranjan K.; Mukhopadhyay, Indrajit; Ray, Abhijit

2018-05-01

Cu2SnS3 thin films were electrodeposited on F:SnO2/Glass substrates at room temperature by using aqueous solution. Copper and tin were first electrodeposited from single bath and post annealed in the presence of sulphur atmosphere to obtain the Cu2SnS3 phase. The Cu2SnS3 phase with preferred orientation along the (112) crystal direction grows to greater extent by the post annealing of the film. Raman analysis confirms the monoclinic crystal structure of Cu2SnS3 with principle mode of vibration as A1 (symmetric breathing mode) corresponding to the band at 291 cm-1. It also reveals the benign coexistence of orthorhombic Cu3SnS4 and Cu2SnS7 phases. Optical properties of the film show direct band gap of 1.25 eV with a high absorption coefficient of the order of 104 cm-1 in the visible region. Photo activity of the electrodeposited film was established in two electrode photoelectro-chemical cell, where an open circuit voltage of 91.6 mV and a short circuit current density of 10.6 µA/cm2 were recorded. Fabrication of Cu2SnS3 thin film heterojunction solar cell is underway.

Elastic and inelastic {alpha}-scattering cross-sections obtained with the 44 MeV fixed energy Saclay cyclotron on separated targets of {sup 24}Mg, {sup 25}Mg, {sup 26}Mg, {sup 40}Ca, {sup 46}Ti, {sup 48}Ti, {sup 50}Ti, {sup 52}Cr, {sup 54}Fe, {sup 56}Fe, {sup 58}Fe, {sup 58}Ni, {sup 60}Ni, {sup 62}Ni, {sup 64}Ni, {sup 63}Cu, {sup 65}Cu, {sup 64}Zn, {sup 112}Sn, {sup 114}Sn, {sup 116}Sn, {sup 118}Sn, {sup 120}Sn, {sup 122}Sn, {sup 124}Sn and {sup 208}Pb using the Saclay fixed-energy cyclotron; Sections efficaces differentielles elastiques et inelastiques obtenues par diffusion de particules {alpha} de 44 MeV sur des cibles de {sup 24}Mg, {sup 25}Mg, {sup 26}Mg, {sup 40}Ca, {sup 46}Ti, {sup 48}Ti, {sup 50}Ti, {sup 52}Cr, {sup 54}Fe, {sup 56}Fe, {sup 58}Fe, {sup 58}Ni, {sup 60}Ni, {sup 62}Ni, {sup 64}Ni, {sup 63}Cu, {sup 65}Cu, {sup 64}Zn, {sup 112}Sn, {sup 114}Sn, {sup 116}Sn, {sup 118}Sn, {sup 120}Sn, {sup 122}Sn, {sup 124}Sn et {sup 208}Pb au cyclotron a energie fixe de saclay

Energy Technology Data Exchange (ETDEWEB)

Bruge, G [Commissariat a l' Energie Atomique, Saclay (France). Centre d' Etudes Nucleaires. Departement de physique nucleaire, service de physique nucleaire a moyenne energie

1967-01-01

This report contains elastic and inelastic {alpha}-scattering cross-sections obtained with the 44 MeV fixed energy Saclay cyclotron on Mg, Ca, Ti, Cr, Fe, Ni, Co, Zn, Sn and Pb enriched targets. (author) [French] Ce rapport contient les tableaux des sections efficaces differentielles obtenues par diffusion elastique et inelastique des particules {alpha} de 44 MeV, fournies par le cyclotron a energie fixe de Saclay, sur des cibles d'isotopes separes de Mg, Ca, Ti, Cr, Fe, Ni, Co, Zn, Sn et Pb. (auteur)

Microstructural Evolution of Ni-Sn Transient Liquid Phase Sintering Bond during High-Temperature Aging

Science.gov (United States)

Feng, Hongliang; Huang, Jihua; Peng, Xianwen; Lv, Zhiwei; Wang, Yue; Yang, Jian; Chen, Shuhai; Zhao, Xingke

2018-05-01

For high-temperature-resistant packaging of new generation power chip, a chip packaging simulation structure of Ni/Ni-Sn/Ni was bonded by a transient liquid-phase sintering process. High-temperature aging experiments were carried out to investigate joint heat stability. The microstructural evolution and mechanism during aging, and mechanical properties after aging were analyzed. The results show that the 30Ni-70Sn bonding layer as-bonded at 340°C for 240 min is mainly composed of Ni3Sn4 and residual Ni particles. When aged at 350°C, because of the difficulty of nucleation for Ni3Sn and quite slow growth of Ni3Sn2, the bonding layer is stable and the strength of that doesn't change obviously with aging time. When aging temperature increased to 500°C, however, the residual Ni particles were gradually dissolved and the bonding layer formed a stable structure with dominated Ni3Sn2 after 36 h. Meanwhile, due to the volume shrinkage (4.43%) from Ni3Sn2 formation, a number of voids were formed. The shear strength shows an increase, resulting from Ni3Sn2 formation, but then it decreases slightly caused by voids. After aging at 500°C for 100 h, shear strength is still maintained at 29.6 MPa. In addition, the mechanism of void formation was analyzed and microstructural evolution model was also established.

Effects of hydrazine on the solvothermal synthesis of Cu2ZnSnSe4 and Cu2CdSnSe4 nanocrystals for particle-based deposition of films

International Nuclear Information System (INIS)

Chiang, Ming-Hung; Fu, Yaw-Shyan; Shih, Cheng-Hung; Kuo, Chun-Cheng; Guo, Tzung-Fang; Lin, Wen-Tai

2013-01-01

The effects of hydrazine on the synthesis of Cu 2 ZnSnSe 4 (CZTSe) and Cu 2 CdSnSe 4 (CCTSe) nanocrystals in an autoclave as a function of temperature and time were explored. On heating at 190 °C for 24-72 h, pure CZTSe and CCTSe nanocrystals could readily grow in the hydrazine-added solution, while in the hydrazine-free solution the intermediate phases such as ZnSe, Cu 2 Se, and Cu 2 SnSe 3 , and Cu 2 SnSe 3 and CdSe associated with the CZTSe and CCTSe nanocrystals grew, respectively. This result reveals that hydrazine can speed up the synthesis of pure CZTSe and CCTSe nanocrystals via a solvothermal process. The mechanisms for the hydrazine-enhanced growth of CZTSe and CCTSe nanocrystals were discussed. The pure CZTSe and CCTSe nanocrystals were subsequently fabricated to the smooth films by spin coating without further annealing in selenium atmosphere. This processing may be beneficial to the fabrication of the absorber layer for solar cells and thermoelectric devices. - Highlights: • Hydrazine enhances the growth of pure Cu 2 ZnSnSe 4 and Cu 2 CdSnSe 4 nanocrystals. • The nanocrystals can be fabricated to films by spin coating without annealing. • This solvothermal processing is promising for the fabrication of thin film devices

Cu-Sn-Ni-Sn-Zn系銅合金の熱間圧延性について

OpenAIRE

二塚, 錬成; 千葉, 俊一; 鈴木, 竹四

1999-01-01

It was m~inly studied using laboratory hot rolling mill that edge cracks ofhot rolling plates of CDA Copper Alloy C64740 CCu-Sn-Ni-Si-Zn system copperalloy) occur during hot rolling at high temperatures from 1073 to 1173K.One cause of the cracks results from sulfur contamination, which is solvableto red uce sulfur or generate the sulfides of MnS and MgS by adding manganeseand magnesium in melting and casting, in short, by the scavenging effect.Another comes from silicon increase in the alloy,...

Evaporation of Cu, Sn, and S from Fe-C-Cu-Sn-S Liquid Alloys in the Temperature Range from 1513 K to 1873 K (1240 °C to 1600 °C)

Science.gov (United States)

Tafwidli, Fahmi; Choi, Moo-Eob; Yi, Sang-Ho; Kang, Youn-Bae

2018-06-01

Evaporation of Cu or Sn from liquid iron alloys containing C and S was experimentally investigated. The initial C concentration, [pct C]0, in the liquid alloy was varied from zero to C saturation, and the evaporation temperature was varied from 1513 K to 1773 K (1240 °C to 1500 °C). Along with the report by one of the present authors, the evaporation mechanism of Cu and Sn from liquid Fe-C-S alloy is proposed, after a modification from the previous mechanism. It was proposed that Cu and Sn evaporate as Cu(g) and Sn(g) and also evaporate as CuS(g) and SnS(g), which are more volatile species. Therefore, availability of S in the alloy affects the overall evaporation rate of Cu and Sn. At the same time, C in the alloy also forms volatile carbosulfides CS(g) and CS2(g), thereby competing with Cu and Sn. Moreover, C increases the activity coefficients of Cu, Sn, and S. This increases the thermodynamic driving force for the formation of CuS(g) and SnS(g). Therefore, increasing [pct C] partly accelerates the evaporation rate of Cu and Sn by increasing the activity coefficient but partly decelerates the evaporation rate by lowering the available S content. S partly accelerates the evaporation rate by increasing the available S for the sulfide gas species but partly decelerates the evaporation rate due to the surface poisoning effect. Increasing the reaction temperature increases the overall evaporation rate. All these facts were taken into account in order to develop an evaporation rate model. This model was extended from the present authors' previous one by taking into account (1) CS(g), S(g), and CS2(g) (therefore, the following species were considered as dominant evaporating species: Cu(g), CuS(g), Sn(g), SnS(g), S(g), CS(g), and CS2(g)); (2) the effect of C and temperature on the activity coefficients of Cu, Sn, and S; (3) the effect of C and temperature on the density of the liquid alloy; and (4) the effect of temperature on the S adsorption coefficient. This revised

Evaporation of Cu, Sn, and S from Fe-C-Cu-Sn-S Liquid Alloys in the Temperature Range from 1513 K to 1873 K (1240 °C to 1600 °C)

Science.gov (United States)

Tafwidli, Fahmi; Choi, Moo-Eob; Yi, Sang-Ho; Kang, Youn-Bae

2018-02-01

Evaporation of Cu or Sn from liquid iron alloys containing C and S was experimentally investigated. The initial C concentration, [pct C]0, in the liquid alloy was varied from zero to C saturation, and the evaporation temperature was varied from 1513 K to 1773 K (1240 °C to 1500 °C). Along with the report by one of the present authors, the evaporation mechanism of Cu and Sn from liquid Fe-C-S alloy is proposed, after a modification from the previous mechanism. It was proposed that Cu and Sn evaporate as Cu(g) and Sn(g) and also evaporate as CuS(g) and SnS(g), which are more volatile species. Therefore, availability of S in the alloy affects the overall evaporation rate of Cu and Sn. At the same time, C in the alloy also forms volatile carbosulfides CS(g) and CS2(g), thereby competing with Cu and Sn. Moreover, C increases the activity coefficients of Cu, Sn, and S. This increases the thermodynamic driving force for the formation of CuS(g) and SnS(g). Therefore, increasing [pct C] partly accelerates the evaporation rate of Cu and Sn by increasing the activity coefficient but partly decelerates the evaporation rate by lowering the available S content. S partly accelerates the evaporation rate by increasing the available S for the sulfide gas species but partly decelerates the evaporation rate due to the surface poisoning effect. Increasing the reaction temperature increases the overall evaporation rate. All these facts were taken into account in order to develop an evaporation rate model. This model was extended from the present authors' previous one by taking into account (1) CS(g), S(g), and CS2(g) (therefore, the following species were considered as dominant evaporating species: Cu(g), CuS(g), Sn(g), SnS(g), S(g), CS(g), and CS2(g)); (2) the effect of C and temperature on the activity coefficients of Cu, Sn, and S; (3) the effect of C and temperature on the density of the liquid alloy; and (4) the effect of temperature on the S adsorption coefficient. This revised

Teores de Fe, Mn, Zn, Cu, Ni E Co em solos de referência de Pernambuco Concentrations of Fe, Mn, Zn, Cu, Ni and Co in benchmark soils of Pernambuco, Brazil

Directory of Open Access Journals (Sweden)

Caroline Miranda Biondi

2011-06-01

Full Text Available Metais pesados formam um grupo de elementos com particularidades relevantes e de ocorrência natural no ambiente, como elementos acessórios na constituição de rochas. Esses elementos, apesar de associados à toxidez, exigem tratamento diferenciado em relação aos xenobióticos, uma vez que diversos metais possuem essencialidade (Fe, Mn, Cu, Zn e Ni e benefício (Co comprovados para as plantas. Nesse contexto, o objetivo deste trabalho foi determinar os teores naturais dos metais Fe, Mn, Zn, Ni, Cu e Co nos solos de referência de Pernambuco. Foram coletadas amostras de solo nas três regiões fisiográficas (Zona da Mata, Agreste e Sertão, dos dois primeiros horizontes dos 35 solos de referência do Estado de Pernambuco. A digestão das amostras baseou-se no método 3051A (USEPA, 1998, e a determinação foi efetuada em ICP-OES. Correlações significativas foram estabelecidas entre os metais e entre estes e a fração argila do solo, em ambos os horizontes, indicando a associação comum da maioria dos metais com solos mais argilosos. A maioria dos solos apresentou teores de Fe, Mn, Zn, Cu, Ni e Co menores que os de solos de outras regiões do País, com litologia mais máfica, o que corrobora o fato de que os teores desses elementos são mais diretamente relacionados aos minerais Fe-magnesianos. Os resultados indicam baixo potencial dos solos de Pernambuco em liberar Cu, Co e Ni para plantas, enquanto deficiências de Zn, Fe e Mn são menos prováveis. Os teores naturais de Fe, Mn, Zn, Cu, Ni e Co determinados podem ser utilizados como base para definição dos Valores de Referência de Qualidade para os solos de Pernambuco, de acordo com o preconizado pela legislação nacional.Heavy metals are a group of elements with specific features and natural occurrence in the environment, representing an accessory in the formation of rocks. These elements, although associated with toxicity, must be treated different from xenobiotics, since many

Thermoelectric properties of TiNiSn and Zr0.5Hf0.5NiSn thin films and superlattices with reduced thermal conductivities

International Nuclear Information System (INIS)

Jaeger, Tino

2013-01-01

Rising energy costs and enhanced CO 2 emission have moved research about thermoelectric (TE) materials into focus. The suitability of a material for usage in TE devices depends on the figure of merit ZT and is equal to α 2 σTκ -1 including Seebeck coefficient α, conductivity σ, temperature T and thermal conductivity κ. Without affecting the power factor α 2 σ, using nanostructuring, ZT should here be increased by a depressed thermal conductivity. As half-Heusler (HH) bulk materials, the TE properties of TiNiSn and Zr 0.5 Hf 0.5 NiSn have been extensively studied. Here, semiconducting TiNiSn and Zr 0.5 Hf 0.5 NiSn thin films were fabricated for the first time by dc magnetron sputtering. On MgO (100) substrates, strongly textured polycrystalline films were obtained at substrate temperatures of about 450 C. The film consisted of grains with an elongation perpendicular to the surface of 55 nm. These generated rocking curves with FWHMs of less than 1 . Structural analyses were performed by X ray diffraction (XRD). Having deposition rates of about 1 nms -1 within shortest time also films in the order of microns were fabricated. For TiNiSn the highest in-plane power factor of about 0.4 mWK -2 m -1 was measured at about 550 K. In addition, at room temperature a cross-plane thermal conductivity of 2.8 Wm -1 K -1 was observed by the differential 3ω method. Because the reduction of thermal conductivity by mass fluctuation is well-known and interface scattering of phonons is expected, superlattices (SL) were fabricated. Therefore, TiNiSn and Zr 0.5 Hf 0.5 NiSn were successively deposited. While the sputter cathodes were continuously running, for fabrication of SLs the substrates were moved from one to another. The high crystal quality of the SLs and the sharp interfaces were proven by satellite peaks (XRD) and Scanning Transmission Electron Microscopy (STEM). For a SL with a periodicity of 21 nm (TiNiSn and Zr 0.5 Hf 0.5 NiSn each 15 nm) at a temperature of 550 K an

Electrochemical performance of Sn-Sb-Cu film anodes prepared by layer-by-layer electrodeposition

International Nuclear Information System (INIS)

Jiang Qianlei; Xue Ruisheng; Jia Mengqiu

2012-01-01

A novel layer-by-layer electrodeposition and heat-treatment approach was attempted to obtain Sn-Sb-Cu film anode for lithium ion batteries. The preparation of Sn-Sb-Cu anodes started with galvanostatic electrochemically depositing antimony and tin sequentially on the substrate of copper foil collector. Sn-Sb and Cu-Sb alloys were formed when heated. The SEM analysis showed that the crystalline grains become bigger and the surface of the Sn-Sb-Cu anode becomes more denser after annealing. The energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) analysis showed the antimony, tin and copper were alloyed to form SnSb and Cu 2 Sb after heat treatment. The X-ray photoelectron spectroscopy (XPS) analysis showed the surface of the Sn-Sb-Cu electrode was covered by a thin oxide layer. Electrochemical measurements showed that the annealed Sn-Sb-Cu anode has high reversible capacity and good capacity retention. It exhibited a reversible capacity of about 962 mAh/g in the initial cycle, which still remained 715 mAh/g after 30 cycles.

Copper tin sulfide (CTS) absorber thin films obtained by co-evaporation: Influence of the ratio Cu/Sn

Energy Technology Data Exchange (ETDEWEB)

Robles, V., E-mail: victor.robles@ciemat.es; Trigo, J.F.; Guillén, C.; Herrero, J.

2015-09-05

Highlights: • Copper tin sulfide (CTS) thin films were grown by co-evaporation at different Cu/Sn atomic ratios. • Smooth Cu{sub 2}SnS{sub 3} layers with large grains are obtained at Cu/Sn ⩾ 1.5 and T ⩾ 350 °C. • At 450 °C, the cubic Cu{sub 2}SnS{sub 3} phase changes to tetragonal phase. • Cu{sub 2}SnS{sub 3} presents suitable optical and electrical properties for use as photovoltaic absorbers. - Abstract: Copper tin sulfide thin films have been grown on soda-lime glass substrates from the elemental constituents by co-evaporation. The synthesis was performed at substrate temperatures of 350 °C and 450 °C and different Cu/Sn ratios, adjusting the deposition time in order to obtain thicknesses above 1000 nm. The evolution of the morphological, structural, chemical, optical and electrical properties has been analyzed as a function of the substrate temperature and the Cu/Sn ratio. For the samples with Cu/Sn ⩽ 1, Cu{sub 2}Sn{sub 3}S{sub 7} and Cu{sub 2}SnS{sub 3} have been observed by XRD. Increasing the Cu/Sn to 1.5, the Cu{sub 2}SnS{sub 3} phase was the majority, being the formation completed at Cu/Sn ratio around 2. The increment of the substrate temperature leads to a change of cubic structure to tetragonal of the Cu{sub 2}SnS{sub 3} phase. The chemical treatment with KCN was effective to eliminate CuS excess detected in the samples with Cu/Sn > 2.2. The samples with Cu{sub 2}SnS{sub 3} structure show a band gap energy increasing from 0.9 to 1.25 eV and an electrical resistivity decreasing from 7 ∗ 10{sup −2} Ω cm to 3 ∗ 10{sup −3} Ω cm when the Cu/Sn atomic ratio increases from 1.5 to 2.2.

Self-Assembled Cu-Sn-S Nanotubes with High (De)Lithiation Performance.

Science.gov (United States)

Lin, Jie; Lim, Jin-Myoung; Youn, Duck Hyun; Kawashima, Kenta; Kim, Jun-Hyuk; Liu, Yang; Guo, Hang; Henkelman, Graeme; Heller, Adam; Mullins, Charles Buddie

2017-10-24

Through a gelation-solvothermal method without heteroadditives, Cu-Sn-S composites self-assemble to form nanotubes, sub-nanotubes, and nanoparticles. The nanotubes with a Cu 3-4 SnS 4 core and Cu 2 SnS 3 shell can tolerate long cycles of expansion/contraction upon lithiation/delithiation, retaining a charge capacity of 774 mAh g -1 after 200 cycles with a high initial Coulombic efficiency of 82.5%. The importance of the Cu component for mitigation of the volume expansion and structural evolution upon lithiation is informed by density functional theory calculations. The self-generated template and calculated results can inspire the design of analogous Cu-M-S (M = metal) nanotubes for lithium batteries or other energy storage systems.

Synthesis, structural and paramagnetic properties of SnO{sub 2} doped NiO nanoparticles

Energy Technology Data Exchange (ETDEWEB)

Islam, I., E-mail: ishtihadahislam@gmail.com; Dwivedi, Sonam; Dar, Hilal A.; Dar, M. A.; Varshney, Dinesh, E-mail: vdinesh33@rediffmail.com [School of Physics, Vigyan Bhawan, Devi Ahilya University, Khandwa Road Campus, Indore 452001 (India)

2016-05-06

In this work, Sn doped NiO nanoparticles were synthesized by co-precipitation route to explore the impact of doping on lattice structure, dielectric constant and magnetization. X-ray diffraction analysis confirmed cubic (Fd-3m) structure of Sn doped NiO. Average crystallite size decreases from 78.2 nm (Ni{sub 0.95}Sn{sub 0.05}O) to 64.23 nm (Ni{sub 0.8}Sn{sub 0.2}O). Scanning electron microscopy images confirm that nanocrystals have agglomerated spherical morphology. The Raman spectrum exhibits a strong, broad peak at 410 cm{sup -1} and is attributed to the Ni-O stretching mode and doped samples show a blue shift. The dielectric constants at about 1 Hz are measured to be about 1.795, 1.030, 0.442, and 0.302 × 10{sup 3} Ni{sub 1-x}Sn{sub x}O (x = 0.05, 0.1, 0.15, 0.2), respectively. The dielectric constant in nanoparticles of doped Ni{sub 1-x}Sn{sub x}O is three orders of magnitude higher as compared to pure NiO ceramics. The nature of magnetization - applied field (M-H) infers paramagnetic behaviour for Sn doped NiO nanoparticles.

Investigation of microstructural evolution and electrical properties for Ni-Sn transient liquid-phase sintering bonding

Science.gov (United States)

Feng, Hong-Liang; Huang, Ji-Hua; Yang, Jian; Zhou, Shao-Kun; Zhang, Rong; Wang, Yue; Chen, Shu-Hai

2017-11-01

Ni/Ni-Sn/Ni sandwiched simulated package structures were successfully bonded under low temperature and low pressure by Ni-Sn transient liquid-phase sintering bonding. The results show that, after isothermally holding for 240 min at 300 °C and 180 min at 340 °C, Sn was completely transformed into Ni3Sn4 intermetallic compounds. When the Ni3Sn4 phases around Ni particles were pressed together, the porosity of the bonding layer increased, which obviously differed from the normal sintering densification process. With further analysis of this phenomenon, it was found that large volume shrinkage (14.94% at 340 °C) occurred when Ni reacted with Sn to form Ni3Sn4, which caused void formation. A mechanistic model of the microstructural evolution in the bonding layer was proposed. Meanwhile, the resistivity of the bonding layer was measured and analyzed by using the four-probe method; the microstructural evolution was well reflected by the resistivity of the bonding layer. The relationship between the resistivity and microstructure was also discussed in detail.[Figure not available: see fulltext.

Research on Cu2ZnSnTe4 crystals and heterojunctions based on such crystals

Directory of Open Access Journals (Sweden)

Kovaliuk T. T.

2015-12-01

Full Text Available The paper reports on the results of the studies of magnetic, kinetic and optical properties of Cu2ZnSnTe4 crystals. The Cu2ZnSnTe4 crystals showed diamagnetic properties (the magnetic susceptibility almost independent of the magnetic field and temperature. The Cu2ZnSnTe4 crystals possessed p-type of conductivity and the Hall coefficient was independent on temperature. The temperature dependence of the electrical conductivity of the Cu2ZnSnTe4 crystal shows metallic character, i. e. decreases with the increase of temperature, that is caused by the lower charge carrier mobility at higher temperature. Thermoelectric power of the samples ispositive that also indicates on the prevalence of p-type conductivity. Heterojunctions n-TiN/p-Cu2ZnSnTe4, n-TiO2/p-Cu2ZnSnTe4 and n-MoO/p-Cu2ZnSnTe4 were fabricated by the reactive magnetron sputtering of TiN, TiO2 and MoOx thin films, respectively, onto the substrates made of the Cu2ZnSnTe4 crystals. The dominating current transport mechanisms in the n-TiN/p-Cu2ZnSnTe4 and n-TiO2/p-Cu2ZnSnTe4 heterojunctions were established to be the tunnel-recombination mechanism at forward bias and tunneling at reverse bias.

Structural and elemental characterization of high efficiency Cu2ZnSnS4 solar cells

Science.gov (United States)

Wang, Kejia; Shin, Byungha; Reuter, Kathleen B.; Todorov, Teodor; Mitzi, David B.; Guha, Supratik

2011-01-01

We have carried out detailed microstructural studies of phase separation and grain boundary composition in Cu2ZnSnS4 based solar cells. The absorber layer was fabricated by thermal evaporation followed by post high temperature annealing on hot plate. We show that inter-reactions between the bottom molybdenum and the Cu2ZnSnS4, besides triggering the formation of interfacial MoSx, results in the out-diffusion of Cu from the Cu2ZnSnS4 layer. Phase separation of Cu2ZnSnS4 into ZnS and a Cu-Sn-S compound is observed at the molybdenum-Cu2ZnSnS4 interface, perhaps as a result of the compositional out-diffusion. Additionally, grain boundaries within the thermally evaporated absorber layer are found to be either Cu-rich or at the expected bulk composition. Such interfacial compound formation and grain boundary chemistry likely contributes to the lower than expected open circuit voltages observed for the Cu2ZnSnS4 devices.

Filosofía para hacer las paces con niñas y niños. Un estímulo para la creatividad

Directory of Open Access Journals (Sweden)

Sonia París Albert

2017-08-01

Full Text Available La pedagogía bancaria ha disfrutado de una posición privilegiada en las escuelas desde siempre. Sin embargo, las sociedades actuales demandan modelos pedagógicos alternativos que fomenten, por un lado, una mayor participación de las niñas y los niños y, por otro, diálogos con los que impulsar la reflexión sobre temas ajenos a los contenidos del currículum escolar clásico. Con una metodología descriptiva, basada en el análisis crítico, el texto rescata la pedagogía liberadora de Freire a fin de proponer una filosofía para hacer las paces con niñas y niños con la que estimular su pensamiento crítico, ético y creativo sobre cuestiones relativas a la construcción de la paz y a la transformación pacífica de los conflictos. Así, entiende la filosofía para hacer las paces como pedagogía liberadora que conserva muchos de los rasgos de la comunidad de indagación filosófica de Lipman, y en la que la creatividad tiene un papel esencial.

In situ observation of Cu-Ni alloy nanoparticle formation by X-ray diffraction, X-ray absorption spectroscopy, and transmission electron microscopy: Influence of Cu/Ni ratio

DEFF Research Database (Denmark)

Wu, Qiongxiao; Duchstein, Linus Daniel Leonhard; Chiarello, Gian Luca

2014-01-01

Silica-supported, bimetallic Cu-Ni nanomaterials were prepared with different ratios of Cu to Ni by incipient wetness impregnation without a specific calcination step before reduction. Different in situ characterization techniques, in particular transmission electron microscopy (TEM), X-ray...... diffraction (XRD), and X-ray absorption spectroscopy (XAS), were applied to follow the reduction and alloying process of Cu-Ni nanoparticles on silica. In situ reduction of Cu-Ni samples with structural characterization by combined synchrotron XRD and XAS reveals a strong interaction between Cu and Ni species......, which results in improved reducibility of the Ni species compared with monometallic Ni. At high Ni concentrations silica-supported Cu-Ni alloys form a homogeneous solid solution of Cu and Ni, whereas at lower Ni contents Cu and Ni are partly segregated and form metallic Cu and Cu-Ni alloy phases. Under...

Stabilization of a Nb3Sn persistent current switch

International Nuclear Information System (INIS)

Urata, M.; Maeda, H.; Nakayama, S.; Yoneda, E.; Oda, Y.; Kumano, T.; Aoki, N.; Tomisaki, T.; Kabashima, S.

1993-01-01

A 2000 A class Nb 3 Sn persistent current switch has been successfully fabricated in the Toshiba R and D Center. The Nb tube processed conductor with Cu-10 wt.% Ni matrix has been developed for the switch in the Showa Electric Wire and Cable Co. Ltd. The magnetic instability which was observed in the previous 35 Ω Nb 3 Sn persistent current switch was improved in the present switch. The problem of quench current degradation and flux jump on magnetization, emerged in the previous switch, were confirmed to be solved. In the fast ramp, however, the switch degrades from the calculated results assuming the self field ac loss. In the Nb 3 Sn reaction process, Sn in the bronze diffuses into the Nb tube, which decreases the switch resistance. It was observed by a computer aided micro analysis (CMA) that Ni in the CuNi matrix precipitated on the Nb tube, which slightly reduced the switch resistance. (orig.)

Lattice parameter values and phase transitions for the Cu2Cd1-zMnzSnSe4 and Cu2Cd1-zFezSnSe4 alloys

International Nuclear Information System (INIS)

Moreno, E.; Quintero, M.; Morocoima, M.; Quintero, E.; Grima, P.; Tovar, R.; Bocaranda, P.; Delgado, G.E.; Contreras, J.E.; Mora, A.E.; Briceno, J.M.; Avila Godoy, R.; Fernandez, J.L.; Henao, J.A.; Macias, M.A.

2009-01-01

X-ray powder diffraction measurements and differential thermal analysis (DTA) were made on polycrystalline samples of the Cu 2 Cd 1-z Mn z SnSe 4 and Cu 2 Cd 1-z Fe z SnSe 4 alloy systems. The diffraction patterns were used to show the equilibrium conditions and to derive lattice parameter values. For Cu 2 Cd 0.8 Fe 0.2 SnSe 4 as well as for Cu 2 Cd 0.2 Fe 0.8 SnSe 4 the crystal structures were refined using the Rietveld method. It was found that the internal distortion parameter σ decreases as Cd is replaced by either Mn and/or Fe. For the Cu 2 Cd 1-z Mn z SnSe 4 and Cu 2 Cd 1-z Fe z SnSe 4 alloy systems, only two single solid phase fields, the tetragonal stannite α(I4-bar2m) and the wurtz-stannite δ (Pmn2 1 ) structures were found to occur in the diagram. In addition to the tetragonal stannite α phase extra X-ray diffraction lines due to MnSe and/or FeSe 2 were observed for as grown samples in the range 0.7 < z < 1.0. However, it was found that the amount of the extra phase decreased for the compressed samples.

Cu{sub 2}ZnSn(S,Se){sub 4} from Cu{sub x}SnS{sub y} nanoparticle precursors on ZnO nanorod arrays

Energy Technology Data Exchange (ETDEWEB)

Kavalakkatt, Jaison, E-mail: jai.k@web.de [Helmholtz-Zentrum Berlin fuer Materialien und Energie, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Freie Universitaet Berlin, Berlin (Germany); Lin, Xianzhong; Kornhuber, Kai [Helmholtz-Zentrum Berlin fuer Materialien und Energie, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Kusch, Patryk [Freie Universitaet Berlin, Berlin (Germany); Ennaoui, Ahmed [Helmholtz-Zentrum Berlin fuer Materialien und Energie, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Reich, Stephanie [Freie Universitaet Berlin, Berlin (Germany); Lux-Steiner, Martha Ch. [Helmholtz-Zentrum Berlin fuer Materialien und Energie, Hahn-Meitner-Platz 1, D-14109 Berlin (Germany); Freie Universitaet Berlin, Berlin (Germany)

2013-05-01

Solar cells with Cu{sub 2}ZnSnS{sub 4} absorber thin films have a potential for high energy conversion efficiencies with earth-abundant and non-toxic elements. In this work the formation of CZTSSe from Cu{sub x}SnS{sub y} nanoparticles (NPs) deposited on ZnO nanorod (NR) arrays as precursors for zinc is investigated. The NPs are prepared using a chemical route and are dispersed in toluene. The ZnO NRs are grown on fluorine doped SnO{sub 2} coated glass substrates by electro deposition method. A series of samples are annealed at different temperatures between 300 °C and 550 °C in selenium containing argon atmosphere. To investigate the products of the reaction between the precursors the series is analyzed by means of X-ray diffraction (XRD) and Raman spectroscopy. The morphology is recorded by scanning electron microscopy (SEM) images of broken cross sections. The XRD measurements and the SEM images show the disappearing of ZnO NRs with increasing annealing temperature. Simultaneously the XRD and Raman measurements show the formation of CZTSSe. The formation of secondary phases and the optimum conditions for the preparation of CZTSSe is discussed. - Highlights: ► Cu{sub x}SnS{sub y} nanoparticles are deposited on ZnO nanorod arrays. ► Samples are annealed at different temperatures (300–550 °C) in Se/Ar-atmosphere. ► Raman spectroscopy, X-ray diffraction and electron microscopy are performed. ► ZnO disappears with increasing annealing temperature. ► With increasing temperature Cu{sub x}SnS{sub y} and ZnO form Cu{sub 2}ZnSn(S,Se){sub 4}.

Lead-free soldering: Investigation of the Cu-Sn-Sb system along the Sn:Sb = 1:1 isopleth

Energy Technology Data Exchange (ETDEWEB)

Yuan, Y. [State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan 410083 (China); Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy); Borzone, G., E-mail: borzone@chimica.unige.it [Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy); Zanicchi, G.; Delsante, S. [Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy)

2011-02-03

Research highlights: > In the electronics industry, the solder alloys commonly used for assembly belong to the Sn-Pb system. Fulfilment of the EU RoHS (reduction of hazardous substances) requires the development of new lead-free alloys for applications in electronics, with the same or possibly better characteristics than the traditional Sn-Pb alloys. > This research concerns the investigation of the constitutional properties of the Cu-Sn-Sb system which is considered as lead-free replacement for high-temperature applications. - Abstract: The Cu-Sn-Sb system has been experimentally investigated by a combination of optical microscopy, differential scanning calorimetry (DSC) and electron probe microanalysis (EPMA). DSC was used to identify a total number of five invariant ternary reactions and the Sn:Sb = 1:1 isopleth section up to 65 at.% Cu was constructed by combining the DSC data with the EPMA analyses of annealed alloys and literature information. The composition limits of the binary phases were detected.

Effect of the Cu and Ni content on the crystallization temperature and crystallization mechanism of La–Al–Cu(Ni metallic glasses

Directory of Open Access Journals (Sweden)

Peiyou Li

2016-02-01

Full Text Available The effect of the Cu and Ni content on the crystallization mechanism and the crystallization temperatures of La–Al–Cu(Ni metallic glasses (MGs was studied by differential scanning calorimetry (DSC. The experimental results have shown that the DSC curves obtained for the La–Al–Cu and La–Al–Ni MGs exhibit two and three crystallization temperatures, respectively. The crystallization temperatures of the La–Al–Cu and La–Al–Ni MGs result from the merging and splitting of thermal events related to the corresponding eutectic atomic pairs in the La72Cu28 and La81.6Al18.4 MGs, and La72Ni28 and La81.6Al18.4 MGs, respectively. In addition, Al- and Ni-containing clusters with weak or strong atomic interaction in the Al–Ni atomic pairs strongly affect the crystallization mechanism and thus the crystallization temperature of La–Al–Ni MGs. This study provides a novel understanding of the relation between the crystallization temperature and the underlying crystallization mechanisms in La–Al–Cu(Ni MGs.

Teores de Fe, Mn, Zn, Cu, Ni E Co em solos de referência de Pernambuco

Directory of Open Access Journals (Sweden)

Caroline Miranda Biondi

2011-06-01

Full Text Available Metais pesados formam um grupo de elementos com particularidades relevantes e de ocorrência natural no ambiente, como elementos acessórios na constituição de rochas. Esses elementos, apesar de associados à toxidez, exigem tratamento diferenciado em relação aos xenobióticos, uma vez que diversos metais possuem essencialidade (Fe, Mn, Cu, Zn e Ni e benefício (Co comprovados para as plantas. Nesse contexto, o objetivo deste trabalho foi determinar os teores naturais dos metais Fe, Mn, Zn, Ni, Cu e Co nos solos de referência de Pernambuco. Foram coletadas amostras de solo nas três regiões fisiográficas (Zona da Mata, Agreste e Sertão, dos dois primeiros horizontes dos 35 solos de referência do Estado de Pernambuco. A digestão das amostras baseou-se no método 3051A (USEPA, 1998, e a determinação foi efetuada em ICP-OES. Correlações significativas foram estabelecidas entre os metais e entre estes e a fração argila do solo, em ambos os horizontes, indicando a associação comum da maioria dos metais com solos mais argilosos. A maioria dos solos apresentou teores de Fe, Mn, Zn, Cu, Ni e Co menores que os de solos de outras regiões do País, com litologia mais máfica, o que corrobora o fato de que os teores desses elementos são mais diretamente relacionados aos minerais Fe-magnesianos. Os resultados indicam baixo potencial dos solos de Pernambuco em liberar Cu, Co e Ni para plantas, enquanto deficiências de Zn, Fe e Mn são menos prováveis. Os teores naturais de Fe, Mn, Zn, Cu, Ni e Co determinados podem ser utilizados como base para definição dos Valores de Referência de Qualidade para os solos de Pernambuco, de acordo com o preconizado pela legislação nacional.

Crystal structure of R.E. NiSn and R.E. PdSn equiatomic compounds

International Nuclear Information System (INIS)

Dwight, A.E.

1983-03-01

Call constants and volume per formula weight are tabulated for RE NiSn (RE = La to Lu, Y) and RE PdSn (RE = Nd to Ho). The unit cell constants are also plotted versus ionic radius of the RE; trends are noted

Multifilamentar superconductor wires of Cu-Nb-Al and Cu-Nb3Sn obtained by a new method

International Nuclear Information System (INIS)

Lima, O.F. de

1985-01-01

A new method to prepare multifilamentar wires of Cu-Nb 3 Sn which is based on power metallurgy is developed. Wires of Cu+xw%Nb++2wt%Al (x =10,30) were tinned and heat treated for Sn diffusion and reaction (T = 700 0 C), leading to the Nb 3 Sn A 15 phase. Final wires showed microfilament density around 8 x 10 4 mm -2 . The superconducting properties (T sup(c), J sup(c) x H), mechanical properties (tau x epsilon) and eletrical resistivity for Cu-Nb-Al wires were as normally expected. The Cu-Nb 3 Sn wires showed high T sub(c) approx. 17.9 K, very near that for the pure A 15 phase. J sub(c) x H curves were approx. 4 times lower than typical published results for wires prepared by other methods. The experimental evidence shows that J sub(c) increases when decreases the initial Nb particle size. (Author) [pt

Phase equilibria in the ternary In-Ni-Sn system at 700 °C.

Science.gov (United States)

Schmetterer, C; Zemanova, A; Flandorfer, H; Kroupa, A; Ipser, H

2013-04-01

The phase equilibria of the ternary system In-Ni-Sn were investigated experimentally at 700 °C using X-ray diffraction (XRD) and scanning electron microscopy (SEM) including electron micro probe analysis (EMPA) and energy dispersive X-ray spectroscopy (EDX). A corresponding isothermal section was established based on these results. This particular temperature was chosen because it allowed obtaining reliable results within reasonable time. The existence of the ternary phase InNi 6 Sn 5 was confirmed whereas the ternary compound In 2 NiSn, reported earlier in literature, was found to be part of a large solid solution field based on binary InNi. The ternary solubility of the binary phases was established, and continuous solid solutions were found between the isostructural phases Ni 3 Sn LT and InNi 3 as well as between Ni 3 Sn 2 HT and InNi 2 . In addition, this isothermal section could be well reproduced by CALPHAD modelling. The resulting calculated isotherm at 700 °C is presented, too, and compared with the experimental results.

Solidification of Al-Sn-Cu Based Immiscible Alloys under Intense Shearing

Science.gov (United States)

Kotadia, H. R.; Doernberg, E.; Patel, J. B.; Fan, Z.; Schmid-Fetzer, R.

2009-09-01

The growing importance of Al-Sn based alloys as materials for engineering applications necessitates the development of uniform microstructures with improved performance. Guided by the recently thermodynamically assessed Al-Sn-Cu system, two model immiscible alloys, Al-45Sn-10Cu and Al-20Sn-10Cu, were selected to investigate the effects of intensive melt shearing provided by the novel melt conditioning by advanced shear technology (MCAST) unit on the uniform dispersion of the soft Sn phase in a hard Al matrix. Our experimental results have confirmed that intensive melt shearing is an effective way to achieve fine and uniform dispersion of the soft phase without macro-demixing, and that such dispersed microstructure can be further refined in alloys with precipitation of the primary Al phase prior to the demixing reaction. In addition, it was found that melt shearing at 200 rpm and 60 seconds will be adequate to produce fine and uniform dispersion of the Sn phase, and that higher shearing speed and prolonged shearing time can only achieve minor further refinement.

Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

Energy Technology Data Exchange (ETDEWEB)

Huang, M.L., E-mail: huang@dlut.edu.cn; Zhao, J.F.; Zhang, Z.J.; Zhao, N.

2016-09-05

The effect of high diffusivity anisotropy in β-Sn grain on electromigration behavior of micro-bumps was clearly demonstrated using Sn-3.0Ag-0.5Cu solder interconnects with only two β-Sn grains. The orientation of β-Sn grain (θ is defined as the angle between the c-axis of β-Sn grain and the electron flow direction) is becoming the most crucial factor to dominate the different electromigration-induced failure modes: 1) the excessive dissolution of the cathode Cu, blocking at the grain boundary and massive precipitation of columnar Cu{sub 6}Sn{sub 5} intermetallic compounds (IMCs) in the small angle θ β-Sn grain occur when electrons flow from a small angle θ β-Sn grain to a large one; 2) void formation and propagation occur at the cathode IMC/solder interface and no Cu{sub 6}Sn{sub 5} IMCs precipitate within the large angle θ β-Sn grain when electrons flow in the opposite direction. The EM-induced failure mechanism of the two β-Sn grain solder interconnects is well explained in viewpoint of atomic diffusion flux in β-Sn. - Highlights: • High anisotropy in β-Sn dominates different electromigration-induced failure mode. • Excessive dissolution of cathode Cu occurs if electrons flow in forward direction. • Voids initiate and propagate at cathode if electrons flow in reverse direction. • Failure modes are well explained in viewpoint of atomic diffusion flux in β-Sn.

Nitrogen-doped carbon decorated Cu2NiSnS4 microflowers as superior anode materials for long-life lithium-ion batteries

Science.gov (United States)

Pan, Pei; Chen, Lihui; Ding, Yu; Du, Jun; Feng, Chuanqi; Fu, Zhengbin; Qin, Caiqin; Wang, Feng

2018-05-01

Nitrogen-doped carbon (NC) decorated Cu2NiSnS4 (CNTS) microflower composites (NC@CNTS) were fabricated through a facile solvothermal and pyrrole polymerization with further annealing treatment. The NC@CNTS composites possessed a three-dimension (3D) microflower-like hierarchical structure. The unique microflower structure of NC@CNTS composites exhibited remarkable electrochemical performance as electrode materials for long life lithium ion batteries. The as-prepared composites had a stable and reversible capacity that reached 943 mA h g-1 after 160 cycles at a current rate of 0.1 A g-1. It showed satisfactory cycle stability and rate capability even at 2 A g-1, and specific capacity stabilized at 288 mA g-1 after 1000 cycles. The present facile and cost-effective strategy can be applied for the synthesis of other transition metal sulfide nanomaterials for energy storage and conversion applications.

Morphological and humidity sensing characteristics of SnO 2 –CuO ...

Indian Academy of Sciences (India)

This paper reports the synthesis of SnO2–CuO, SnO2–Fe2O3 and SnO2–SbO2 composites of nano oxides and comparative study of humidity sensing on their electrical resistances. CuO, Fe2O3 and SbO2 were added within base material SnO2 in the ratio 1 : 0.25, 1 : 0.50 and 1 : 1. Characterizations of materials were done ...

Preparation of Cu{sub 2}ZnSnS{sub 4} thin films by sulfurization of co-electroplated Cu-Zn-Sn precursors

Energy Technology Data Exchange (ETDEWEB)

Araki, Hideaki; Kubo, Yuki; Jimbo, Kazuo; Maw, Win Shwe; Katagiri, Hironori; Yamazaki, Makoto; Oishi, Koichiro; Takeuchi, Akiko [Nagaoka National College of Technology, 888 Nishikatakai, Nagaoka, Niigata 940-8532 (Japan)

2009-05-15

Cu{sub 2}ZnSnS{sub 4} (CZTS) thin films were prepared by sulfurization of electrodeposited Cu-Zn-Sn precursors. The Cu-Zn-Sn precursors were deposited on Mo-coated glass substrates in a one-step process from an electrolyte containing copper (II) sulfate pentahydrate, zinc sulfate heptahydrate, tin (II) chloride dehydrate and tri-sodium citrate dehydrate. The precursors were sulfurized by annealing with sulfur at temperatures of 580 C and 600 C in an N{sub 2} atmosphere. X-ray diffraction peaks attributable to CZTS were detected in the sulfurized films. Photovoltaic cells with the structure glass/Mo/CZTS/ CdS/ZnO:Al/Al were fabricated using the CZTS films by sulfurizing the electrodeposited precursors. The best photovoltaic cell performance was obtained with Zn-rich samples. An open-circuit voltage of 540 mV, a short-circuit current of 12.6 mA/cm{sup 2} and an efficiency of 3.16% were achieved. (copyright 2009 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

Combinatorial development of Cu2SnS3 as an earth abundant photovoltaic absorber

Science.gov (United States)

Baranowski, Lauryn L.

The development of high efficiency, earth abundant photovoltaic absorbers is critical if photovoltaics are to be implemented on the TW scale. Although traditional thin films absorbers such as Cu(In,Ga)Se2 and CdTe have achieved over 20% device efficiencies, the ultimately scalability of these devices may be limited by elemental scarcity and toxicity issues. To date, the most successful earth abundant thin film absorber is Cu2ZnSn(S,Se) 4, which has achieved 12.6% efficiency as of 2014. However, chemical complexity and disorder issues with this material have made the path to higher efficiency CZTSSe devices unclear. As a result, many researchers are now exploring alternative earth abundant absorber materials. In this thesis, we apply our "rapid development" methodology to the exploration of alternative photovoltaic absorbers. The rapid development (RD) methodology, consisting of exploration, research, and development stages, uses complementary theory and experiment to assess candidate materials and down-select in each stage. The overall result is that, in the time span of ~2-3 years, we are able to rapidly go from tens of possible absorber materials to 1-2 working PV device prototypes. Here, we demonstrate the RD approach as applied to the Cu-Sn-S system. We begin our investigation of the Cu-Sn-S system by evaluating the thermodynamic stability, electrical transport, electronic structure, and optical and defect properties of candidate materials using complementary theory and experiment. We find that Cu2SnS3 is the most promising absorber candidate because of its strong optical absorption, tunable doping, and wide stability range. Our other candidate compounds suffer from serious flaws that preclude them from being successful photovoltaic absorbers, including too high experimental conductivity (Cu4SnS4), or poor hole transport and low absorption coefficient (Cu4Sn7S16). Next, we investigate the doping and defect physics of Cu2SnS 3. We identify the origins of the

Effect of interface intermixing on giant magnetoresistance in NiFe/Cu and Co/NiFe/Co/Cu multilayers

International Nuclear Information System (INIS)

Nagamine, L.C.C.M.; Biondo, A.; Pereira, L.G.; Mello, A.; Schmidt, J.E.; Chimendes, T.W.; Cunha, J.B.M.; Saitovitch, E.B.

2003-01-01

This article reports on the important influence of the spontaneously built-in paramagnetic interfacial layers on the magnetic and magnetoresistive properties of NiFe/Cu and Co/NiFe/Co/Cu multilayers grown by magnetron sputtering. A computational simulation, based on a semiclassical model, has been used to reproduce the variations of the resistivity and of the magnetoresistance (MR) amplitude with the thickness of the NiFe, Cu, and Co layers. We showed that the compositionally intermixed layers at NiFe/Cu interfaces, which are paramagnetic, reduce the flow of polarized electrons and produce a masking on the estimated mean-free path of both types of electrons due to the reduction of their effective values, mainly for small NiFe thickness. Moreover, the transmission coefficients for the electrons decrease when Fe buffer layers are replaced by NiFe ones. This result is interpreted in terms of the variations of the interfacial intermixing and roughness at the interfaces, leading to an increase of the paramagnetic interfacial layer thickness. The effect provoked by Co deposition at the NiFe 16 A/Cu interfaces has also been investigated. The maximum of the MR amplitudes was found at 5 A of Co, resulting in the quadruplication of the MR amplitude. This result is partially attributed to the interfacial spin-dependent scattering due to the increase of the magnetic order at interfaces. Another effect observed here was the increase of the spin-dependent scattering events in the bulk NiFe due to a larger effective NiFe thickness, since the paramagnetic interfacial layer thickness is decreased

A new dental powder from nanocrystalline melt-spun Ag-Sn-Cu alloy ribbons

International Nuclear Information System (INIS)

Do-Minh, N.; Le-Thi, C.; Nguyen-Anh, S.

2003-01-01

A new non-gamma-two dental powder has been developed from nanocrystalline melt-spun Ag-Sn-Cu alloy ribbons. The amalgam made from this powder exhibits excellent properties for dental filling. The nanocrystalline microstructure was found for the first time in as-spun and heat treated Ag(27-28)Sn(9-32) Cu alloy ribbons, using X-ray diffraction, scanning electron microscopy and energy-dispersive spectroscopy. As-spun ribbons exhibited a multi-phase microstructure with preferred existence of β (Ag 4 Sn) phase formed during rapid solidification (RS) due to supersaturating of copper (Cu) atoms and homogenous nanostructure with subgrain size of about (40-50) nm, which seems to be developed during RS process and can be caused by eutectic reaction of the Ag 3 Sn/Ag 4 Sn-Cu 3 Sn system. In heat treated ribbons the clustering of Cu atoms was always favored and stable in an ageing temperature and time interval determined by Cu content. The heat treatment led to essential changes of subgrain morphology, resulted in the appearance of large-angle boundaries with fine Cu 3 Sn precipitates and forming typical recrystallization twins. Such a microstructure variation in melt-spun ribbons could eventually yield enhanced technological, clinical and physical properties of the dental products, controlled by the ADA Specification N deg 1 and reported before. Thus, using the rapid solidification technique a new non-gamma-two dental material of high quality, nanocrystalline ribbon powder, can be produced. Copyright (2003) AD-TECH - International Foundation for the Advancement of Technology Ltd

Development of Nanoporous Ni-Sn Alloy and Application for Chemoselective Hydrogenation of Furfural to Furfuryl Alcohol

Directory of Open Access Journals (Sweden)

Rodiansono Rodiansono

2014-03-01

Full Text Available A very simple synthetic procedure was developed for the preparation of Ni-Sn alloy catalysts that were utilised for chemoselective hydrogenation of furfural, producing furfuryl alcohol almost exclusively. The mixture of nickel nanoparticles supported on aluminium hydroxide (R-Ni/AlOH and a solution containing tin was treated under hydrothermal condition, producing the as prepared nickel-tin alloy supported on aluminium hydroxide (Ni-Sn/AlOH. H2 treatment at range of temperature of 673-873 K for 1.5 h to the as prepared Ni-Sn/AlOH produced nanoporous Ni-Sn alloy catalysts. XRD patterns and SEM images revealed that the formation of Ni-Sn alloy of Ni3Sn and Ni3Sn2 phases and the transformation of crystalline gibbsite and bayerite into amorphous alumina were clearly observed after H2 treatment at 873 K. The formation of the Ni-Sn alloy may have played a key role in the enhancement of the chemoselectivity. © 2014 BCREC UNDIP. All rights reservedReceived: 1st September 2013; Revised: 26th November 2013; Accepted: 7th December 2013[How to Cite: Rodiansono, R., Hara, T., Ichikuni, N., Shimazu, S. (2014. Development of Nanoporous Ni-Sn Alloy and Application for Chemoselective Hydrogenation of Furfural to Furfuryl Alcohol. Bulletin of Chemical Reaction Engineering & Catalysis, 9 (1: 53-59. (doi:10.9767/bcrec.9.1.5529.53-59][Permalink/DOI: http://dx.doi.org/10.9767/bcrec.9.1.5529.53-59

Magnetron sputtered Cu{sub 3}N/NiTiCu shape memory thin film heterostructures for MEMS applications

Energy Technology Data Exchange (ETDEWEB)

Kaur, Navjot; Choudhary, Nitin [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India); Goyal, Rajendra N. [Indian Institute of Technology, Roorkee, Department of Chemistry (India); Viladkar, S. [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India); Matai, I.; Gopinath, P. [Indian Institute of Technology, Roorkee, Centre for Nanotechnology (India); Chockalingam, S. [Indian Institute of Technology, Guwahati, Department of Biotechnology (India); Kaur, Davinder, E-mail: dkaurfph@iitr.ernet.in [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India)

2013-03-15

In the present study, for the first time, Cu{sub 3}N/NiTiCu/Si heterostructures were successfully grown using magnetron sputtering technique. Nanocrystalline copper nitride (Cu{sub 3}N with thickness {approx}200 nm) thin films and copper nanodots were subsequently deposited on the surface of 2-{mu}m-thick NiTiCu shape memory thin films in order to improve the surface corrosion and nickel release properties of NiTiCu thin films. Interestingly, the phase transformation from martensite phase to austenite phase has been observed in Cu{sub 3}N/NiTiCu heterostructures with corresponding change in texture and surface morphology of top Cu{sub 3}N films. Field emission scanning electron microscopy and atomic force microscope images of the heterostructures reveals the formation of 20-nm-sized copper nanodots on NiTiCu surface at higher deposition temperature (450 Degree-Sign C) of Cu{sub 3}N. Cu{sub 3}N passivated NiTiCu films possess low corrosion current density with higher corrosion potential and, therefore, better corrosion resistance as compared to pure NiTiCu films. The concentration of Ni released from the Cu{sub 3}N/NiTiCu samples was observed to be much less than that of pure NiTiCu film. It can be reduced to the factor of about one-ninth after the surface passivation resulting in smooth, homogeneous and highly corrosion resistant surface. The antibacterial and cytotoxicity of pure and Cu{sub 3}N coated NiTiCu thin films were investigated through green fluorescent protein expressing E. coli bacteria and human embryonic kidney cells. The results show the strong antibacterial property and non cytotoxicity of Cu{sub 3}N/NiTiCu heterostructure. This work is of immense technological importance due to variety of BioMEMS applications.

Improvement of thermoelectric properties for half-Heusler TiNiSn by interstitial Ni defects

International Nuclear Information System (INIS)

Hazama, Hirofumi; Matsubara, Masato; Asahi, Ryoji; Takeuchi, Tsunehiro

2011-01-01

We have synthesized off-stoichiometric Ti-Ni-Sn half-Heusler thermoelectrics in order to investigate the relation between randomly distributed defects and thermoelectric properties. A small change in the composition of Ti-Ni-Sn causes a remarkable change in the thermal conductivity. An excess content of Ni realizes a low thermal conductivity of 2.93 W/mK at room temperature while keeping a high power factor. The low thermal conductivity originates in the defects generated by an excess content of Ni. To investigate the detailed defect structure, we have performed first-principles calculations and compared with x ray photoemission spectroscopy measurement. Based on these analyses, we conclude that the excess Ni atoms randomly occupy the vacant sites in the half-Heusler structure, which play as phonon scattering centers, resulting in significant improvement of the figure of merit without any substitutions of expensive heavy elements, such as Zr and Hf.

Martensitic transformation and magnetic properties of manganese-rich Ni-Mn-In and Ni-Mn-Sn Heusler alloys

International Nuclear Information System (INIS)

Krenke, T.

2007-01-01

In the present work, the martensitic transition and the magnetic properties of Manganese rich Ni 50 Mn 50-x Sn x and Ni 50 Mn 50-y In y alloys with 5 at%≤x(y)≤25 at% were investigated. Calorimetry, X-ray and neutron diffraction, magnetization, and strain measurements were performed on polycrystalline samples. It was shown that alloys close to the stoichiometric composition Ni 50 Mn 25 Sn 25 and Ni 50 Mn 25 Sn 25 do not exhibit a structural transition on lowering of the temperature, whereas alloys with x≤15 at% Tin and y≤16 at% Indium transform martensitically. The structural transition temperatures increase linearly with decreasing Tin or Indium content. The crystal structures of the low temperature martensite are modulated as well as unmodulated. Alloys with compositions close to stoichiometry are dominated by ferromagnetic interactions, whereas those close to the binary composition Ni 50 Mn 50 order antiferromagnetically. Ferromagnetic order and structural instability coexist in a narrow composition range between 13 at%≤x≤15 at% and 15 at%≤x≤16 at% for Ni 50 Mn 50-x Sn x and Ni 50 Mn 50-y In y respectively. As a consequence, interesting magnetoelastic effects are observed. The Ni 50 Mn 34 In 16 alloy shows a magnetic field-induced structural transition, whereby application of an external magnetic field in the martensitic state stabilizes the high temperature L2 1 structure. Evidence for this was given by neutron diffraction experiments in external magnetic fields. Moreover, the structural transition temperatures of this alloy show large magnetic field dependencies. By use of calorimetry, M(T), and strain measurements, changes in M s up to -11 K/Tesla are observed. Such large values have, until now, not been observed in Heusler alloys. Since during transformation the volume changes reversibly, magnetic field-induced strains of about 0.12 % appear. Additionally, the alloys Ni 50 Mn 35 Sn 15 , Ni 50 Mn 37 Sn 13 , Ni 50 Mn 34 In 16 , Ni 51.5 Mn 33 In

Martensitic transformation and magnetic properties of manganese-rich Ni-Mn-In and Ni-Mn-Sn Heusler alloys; Untersuchung der martensitischen Umwandlung und der magnetischen Eigenschaften Mangan-reicher Ni-Mn-In- und Ni-Mn-Sn-Heusler-Legierungen

Energy Technology Data Exchange (ETDEWEB)

Krenke, T.

2007-06-29

In the present work, the martensitic transition and the magnetic properties of Manganese rich Ni{sub 50}Mn{sub 50-x}Sn{sub x} and Ni{sub 50}Mn{sub 50-y}In{sub y} alloys with 5 at%{<=}x(y){<=}25 at% were investigated. Calorimetry, X-ray and neutron diffraction, magnetization, and strain measurements were performed on polycrystalline samples. It was shown that alloys close to the stoichiometric composition Ni{sub 50}Mn{sub 25}Sn{sub 25} and Ni{sub 50}Mn{sub 25}Sn{sub 25} do not exhibit a structural transition on lowering of the temperature, whereas alloys with x{<=}15 at% Tin and y{<=}16 at% Indium transform martensitically. The structural transition temperatures increase linearly with decreasing Tin or Indium content. The crystal structures of the low temperature martensite are modulated as well as unmodulated. Alloys with compositions close to stoichiometry are dominated by ferromagnetic interactions, whereas those close to the binary composition Ni{sub 50}Mn{sub 50} order antiferromagnetically. Ferromagnetic order and structural instability coexist in a narrow composition range between 13 at%{<=}x{<=}15 at% and 15 at%{<=}x{<=}16 at% for Ni{sub 50}Mn{sub 50-x}Sn{sub x} and Ni{sub 50}Mn{sub 50-y}In{sub y} respectively. As a consequence, interesting magnetoelastic effects are observed. The Ni{sub 50}Mn{sub 34}In{sub 16} alloy shows a magnetic field-induced structural transition, whereby application of an external magnetic field in the martensitic state stabilizes the high temperature L2{sub 1} structure. Evidence for this was given by neutron diffraction experiments in external magnetic fields. Moreover, the structural transition temperatures of this alloy show large magnetic field dependencies. By use of calorimetry, M(T), and strain measurements, changes in M{sub s} up to -11 K/Tesla are observed. Such large values have, until now, not been observed in Heusler alloys. Since during transformation the volume changes reversibly, magnetic field-induced strains of about

Thermochemical and phase diagram studies of the Sn-Zn-Ni system

International Nuclear Information System (INIS)

Gandova, V.D.; Broz, P.; Bursik, J.; Vassilev, G.P.

2011-01-01

Highlights: → Sn-Zn-Ni phase diagram in the vicinity of the Sn-Zn system. → Unidentified compositions (UX1-UX4) are repeatedly observed. → This indicates up to 6 ternary compounds in the system. → A ternary eutectic reaction at around 190 o C is found. - Abstract: The phase diagram Sn-Zn-Ni was studied by means of DSC and electron microprobe analysis. The samples were positioned in three isopleth sections with nickel contents of 0.04 (section 1), 0.08 (section 2) and 0.12 (section 3) mole fractions. The mole fractions of Sn corresponding to the particular sections were as follows: from 0.230 to 0.768 (section 1), from 0.230 to 0.736 (section 2); from 0.220 to 0.704 (section 3). Mixtures of pure metals were sealed under vacuum in quartz ampoules and annealed at 350 o C. The solid phases identified in the samples were: γ-(i.e. Ni 5 Zn 21 ), (Zn) and the ternary phase T1. Unidentified compositions were observed. One of them: UX1 (X Ni = 0.071 ± 0.005, X Sn = 0.439 ± 0.009 and X Zn = 0.490 ± 0.010) might indicate another (stable or metastable) ternary compound (T3) in the system Sn-Zn-Ni. Considering the data obtained by combining DSC with microstructure observations, the studied alloys could be divided in two groups (A and B). A ternary eutectic reaction at around 190 o C is common for the A-group alloys. The phases taking part in this reaction are, probably, Ni 5 Zn 21 , (Zn), (βSn) and liquid. B-group samples do not show ternary eutectic reaction and are also characterized by the presence of the ternary compound T1 (absent in the A-group alloys). Four other groups of thermal arrests were registered (TA 1 -TA 4 ). It was found that TA 2 peaks were characteristic for most of the A-group samples, while TA 1 peaks were registered with all B-group samples.

Cu{sub 2}ZnSnS{sub 4} thin films obtained by sulfurization of evaporated Cu{sub 2}SnS{sub 3} and ZnS layers: Influence of the ternary precursor features

Energy Technology Data Exchange (ETDEWEB)

Robles, V.; Guillén, C., E-mail: c.guillen@ciemat.es; Trigo, J.F.; Herrero, J.

2017-04-01

Highlights: • Kesterite Cu{sub 2}ZnSnS{sub 4} is got by sulfurization of evaporated Cu{sub 2}SnS{sub 3} and ZnS layers. • Smooth films are obtained by decreasing the growth temperature of Cu{sub 2}SnS{sub 3}. • The lattice strain and the electrical conductivity increase with the Cu-content. • The energy gap diminishes as the Cu-content and/or the surface roughness increase. - Abstract: Cu{sub 2}ZnSnS{sub 4} (CZTS) thin films have been grown by sulfurization of Cu{sub 2}SnS{sub 3} (CTS) and ZnS layers evaporated on glass substrates. Four CTS precursor films have been tested, with two different atomic compositions (Cu/Sn = 1.7 and Cu/Sn = 2.1) and substrate temperatures (350 and 450 °C), together with analogous ZnS layers deposited by maintaining the substrate at 200 °C. The sulfurization of the CTS and ZnS stacked layers was performed at 500 °C during 1 h. The evolution of the crystalline structure, morphology, optical and electrical properties from each CTS precursor to the CZTS compound has been studied, especially the influence of the ternary precursor features on the quaternary film characteristics. The kesterite structure has been identified after sulfurization of the various samples, with main (112) orientation and mean crystallite sizes S{sub 112} = 40–56 nm, being higher for the Cu-poor compositions. The CZTS average roughness has varied in a wide interval R{sub a} = 8–66 nm, being directly related to the CTS precursor layer, which becomes rougher for a higher deposition temperature or Cu content. Besides, the band gap energy and the electrical resistivity of the CZTS films have changed in the ranges E{sub g} = 1.54–1.64 eV and ρ = 0.2–40 Ωcm, both decreasing when the Cu content and/or the surface roughness increase.

Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

International Nuclear Information System (INIS)

He Hongwen; Xu Guangchen; Guo Fu

2009-01-01

Electromigration (EM) behavior of Cu/Sn 3.5 Ag/Cu solder reaction couple was investigated with a high current density of 5 x 10 3 A/cm 2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu 6 Sn 5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu 6 Sn 5 at the cathode interface due to the thermal stress.

Sensors of the gas CO in thin film of SnO{sub 2}:Cu; Sensores del gas CO en pelicula delgada de SnO{sub 2}:Cu

Energy Technology Data Exchange (ETDEWEB)

Tirado G, S.; Sanchez Z, F. E., E-mail: tirado@esfm.ipn.mx [IPN, Escuela Superior de Fisica y Matematicas, Unidad Profesional Adolfo Lopez Mateos, San Pedro Zacatenco, 07738 Mexico D. F. (Mexico)

2011-10-15

Thin films of SnO{sub 2}:Cu with different thickness, were deposited on soda-lime glass substrates and prepared by the Sol-gel process and repeated immersion. The sensor properties of these films to the gas CO for the range of 0-200 ppm in the gas concentration and operating to temperatures of 23, 100, 200, and 300 C were studied. Prepared films of pure SnO{sub 2} were modified superficially with 1, 3, 5 and 10 layers of the catalyst Cu (SnO{sub 2}:Cu) with the purpose of studying the effect on the sensor capacity of the gas CO by part of the films SnO{sub 2}:Cu. Using the changes in the electric properties of the films with the incorporation of the different copper layers and experimental conditions, the sensor modifications of the gas CO were evaluated. To complete this study, was realized a characterization of the superficial morphology of the films by scanning electron microscopy and atomic force microscopy, equally was studied their structure and their electric and optical properties. (Author)

Scanning pattern angle effect on the resulting properties of selective laser sintered monolayers of Cu-Sn-Ni powder

Science.gov (United States)

Sabelle, Matías; Walczak, Magdalena; Ramos-Grez, Jorge

2018-01-01

Laser-based layer manufacturing of metals, also known as additive manufacturing, is a growing research field of academic and industrial interest. However, in the associated laser-driven processes (i.e. selective laser sintering (SLS) or melting (SLM)), optimization of some parameters has not been fully explored. This research aims at determining how the angle of laser scanning pattern (i.e. build orientation) in SLS affects the mechanical properties and structure of an individual Cu-Sn-Ni alloy metallic layer sintered in the process. Experiments consist in varying the angle of the scanning pattern (0°, 30°, 45° 60° and 90° relative to the transverse dimension of the piece), at constant scanning speed and laser beam power, producing specimens of different thicknesses. A noticeable effect of the scan angle on the mechanical strength and degree of densification of the sintered specimens is found. Thickness of the resulting monolayer correlates negatively with increasing scan angle, whereas relative density correlates positively. A minimum porosity and maximum UTS are found at the angle of 60°. It is concluded that angle of the scanning pattern angle plays a significant role in SLS of metallic monolayers.

Influence of the Si content on the microstructure and mechanical properties of Ti–Ni–Cu–Si–Sn nanocomposite alloys

International Nuclear Information System (INIS)

Fornell, J.; Van Steenberge, N.; Suriñach, S.; Baró, M.D.; Sort, J.

2012-01-01

Highlights: ► We study the effects of Si addition of Ti–Ni–Cu–Si–Sn alloy. ► The microstructure evolution is correlated with the obtained mechanical and elastic properties. ► Higher Young's modulus and larger hardness values are obtained in samples with higher Si contents. - Abstract: (Ti 48 Ni 32 Cu 8 Si 8 Sn 4 ) 100−x Si x (x = 0, 2, 4 and 6) alloys were prepared by levitation melting mixtures of the high purity elements in an Ar atmosphere. Rods of 3 mm in diameter were obtained from the melt by copper mould casting. The effects of Si addition on the microstructure, elastic and mechanical properties of the Ti 48 Ni 32 Cu 8 Si 8 Sn 4 alloy were investigated by scanning electron microscopy, X-ray diffraction, acoustic measurements and nanoindentation. The main phases composing the Ti 48 Ni 32 Cu 8 Si 8 Sn 4 alloy are B2 NiTi, B19′ NiTi and tetragonal Ti 2 Ni. Additional phases, like Ti 5 Si 3 or Ni 2 Ti 2 Si, become clearly visible in samples with higher Si contents. The microstructure evolution is correlated with the obtained mechanical and elastic properties. These alloys exhibit very high hardness values, which increase with the Si content, from 9 GPa (for x = 0) to around 10.5 GPa (for x = 6). The Young's modulus of Ti 48 Ni 32 Cu 8 Si 8 Sn 4 (around 115 GPa) also increases significantly with Si addition, up to 160 GPa for x = 6.

Cu2ZnSn(S,Se)4 from CuxSnSy nanoparticle precursors on ZnO nanorod arrays

International Nuclear Information System (INIS)

Kavalakkatt, Jaison; Lin, Xianzhong; Kornhuber, Kai; Kusch, Patryk; Ennaoui, Ahmed; Reich, Stephanie; Lux-Steiner, Martha Ch.

2013-01-01

Solar cells with Cu 2 ZnSnS 4 absorber thin films have a potential for high energy conversion efficiencies with earth-abundant and non-toxic elements. In this work the formation of CZTSSe from Cu x SnS y nanoparticles (NPs) deposited on ZnO nanorod (NR) arrays as precursors for zinc is investigated. The NPs are prepared using a chemical route and are dispersed in toluene. The ZnO NRs are grown on fluorine doped SnO 2 coated glass substrates by electro deposition method. A series of samples are annealed at different temperatures between 300 °C and 550 °C in selenium containing argon atmosphere. To investigate the products of the reaction between the precursors the series is analyzed by means of X-ray diffraction (XRD) and Raman spectroscopy. The morphology is recorded by scanning electron microscopy (SEM) images of broken cross sections. The XRD measurements and the SEM images show the disappearing of ZnO NRs with increasing annealing temperature. Simultaneously the XRD and Raman measurements show the formation of CZTSSe. The formation of secondary phases and the optimum conditions for the preparation of CZTSSe is discussed. - Highlights: ► Cu x SnS y nanoparticles are deposited on ZnO nanorod arrays. ► Samples are annealed at different temperatures (300–550 °C) in Se/Ar-atmosphere. ► Raman spectroscopy, X-ray diffraction and electron microscopy are performed. ► ZnO disappears with increasing annealing temperature. ► With increasing temperature Cu x SnS y and ZnO form Cu 2 ZnSn(S,Se) 4

Isotope correlations as a probe for freeze-out characterization: central {sup 124}Sn+{sup 64}Ni, {sup 112}Sn+{sup 58}Ni collisions

Energy Technology Data Exchange (ETDEWEB)

Geraci, E.; Alderighi, M.; Anzalone, A.; Auditore, L.; Baran, V.; Bartolucci, M.; Berceanu, I.; Blicharska, J.; Bonasera, A.; Borderie, B.; Bougault, R.; Bruno, M.; Brzychczyk, J.; Cardella, G.; Cavallaro, S.; Chbihi, A.; Cibor, J.; Colonna, M.; D' Agostino, M.; De Filippo, E.; Di Toro, M.; Giustolisi, F.; Grzeszczuk, A.; Guazzoni, P.; Guinet, D.; Iacono-Manno, M.; Kowalski, S.; La Guidara, E.; Lanzalone, G.; Lanzano, G.; Le Neindre, N.; Li, S.; Lo Nigro, S.; Maiolino, C.; Majka, Z.; Manfredi, G.; Paduszynski, T.; Pagano, A.; Papa, M.; Petrovici, M.; Piasecki, E.; Pirrone, S.; Politi, G.; Pop, A.; Porto, F.; Rivet, M.F.; Rosato, E.; Russo, S.; Russotto, P.; Sechi, G.; Simion, V.; Sperduto, M.L.; Steckmeyer, J.C.; Trifiro, A.; Trimarchi, M.; Vannini, G.; Vigilante, M.; Wieleczko, J.P.; Wilczynski, J.; Wu, H.; Xiao, Z.; Zetta, L.; Zipper, W

2004-04-05

{sup 124}Sn+{sup 64}Ni and {sup 112}Sn+{sup 58}Ni reactions at 35 AMeV incident energy were studied with the forward part of CHIMERA multi-detector. The most central collisions were selected by means of a multidimensional analysis. The characteristics of the source formed in the central collisions, as size, temperature and volume, were inspected. The measured isotopes of light fragments (3 {<=} Z {<=} 8) were used to examine isotope yield ratios that provide information on the free neutron to proton densities.

Yb5Ni4Sn10 and Yb7Ni4Sn13: New polar intermetallics with 3D framework structures

International Nuclear Information System (INIS)

Lei Xiaowu; Sun Zhongming; Li Longhua; Zhong Guohua; Hu Chunli; Mao Jianggao

2010-01-01

The title compounds have been obtained by solid state reactions of the corresponding pure elements at high temperature, and structurally characterized by single-crystal X-ray diffraction studies. Yb 5 Ni 4 Sn 10 adopts the Sc 5 Co 4 Si 10 structure type and crystallizes in the tetragonal space group P4/mbm (No. 127) with cell parameters of a=13.785(4) A, c=4.492 (2) A, V=853.7(5) A 3 , and Z=2. Yb 7 Ni 4 Sn 13 is isostructural with Yb 7 Co 4 InGe 12 and crystallizes in the tetragonal space group P4/m (No. 83) with cell parameters of a=11.1429(6) A, c=4.5318(4) A, V=562.69(7) A 3 , and Z=1. Both structures feature three-dimensional (3D) frameworks based on three different types of one-dimensional (1D) channels, which are occupied by the Yb atoms. Electronic structure calculations based on density functional theory (DFT) indicate that both compounds are metallic. These results are in agreement with those from temperature-dependent resistivity and magnetic susceptibility measurements. - Graphical abstract: Two new ytterbium nickel stannides, namely, Yb 5 Ni 4 Sn 10 and Yb 7 Ni 4 Sn 13 , have been synthesized and structurally characterized by single-crystal X-ray diffraction studies. Both their structures feature three-dimensional (3D) frameworks based on three different types of one-dimensional (1D) channels, which are situated by all the Yb atoms. Electronic structure calculations based on density functional theory (DFT) indicate that both compounds are metallic, which are in accordance with the results from temperature-dependent resistivity and magnetic susceptibility measurements.

Reduction of secondary phases in Cu{sub 2}SnSe{sub 3} absorbers for solar cell application

Energy Technology Data Exchange (ETDEWEB)

Tang, Zeguo, E-mail: tangzg@fc.ritsumei.ac.jp [Ritsumeikan Global Innovation Research Organization, Ritsumeikan University, Shiga (Japan); Nukui, Yuki; Kosaka, Kiichi; Ashida, Naoki; Uegaki, Hikaru; Minemoto, Takashi [College of Science and Engineering, Ritsumeikan University, Shiga (Japan)

2014-09-01

Highlights: • Cu{sub 2}SnSe{sub 3} thin films for absorber of solar cell are fabricated by selenization of Cu–Sn precursors. • Secondary phase of Cu{sub 2–x}Se can be suppressed via using Se and SnSe mixture powders as Se source. • Selective etching of secondary phase of Cu{sub 2–x}Se is realized by potassium cyanide solution. • Cu{sub 2–x}Se rather than SnSe makes major contribution to the high carrier concentration of CTSe films. - Abstract: The creation of secondary phases, such as Cu{sub 2−x}Se and SnSe, and their influence on electrical properties of Cu{sub 2}SnSe{sub 3} (CTSe) thin films fabricated by selenization of Cu–Sn metal precursors are investigated. The Cu{sub 2−x}Se content in CTSe films is estimated via deconvolution of grazing incidence X-ray diffraction (GIXRD) patterns, and the results suggest that the Cu{sub 2−x}Se content increases with the increasing Cu/Sn ratio in metal precursors. We also found that using Se and SnSe mixture powders as Se source is an effective approach to suppress the creation of Cu{sub 2−x}Se secondary phase. Meanwhile, selective etching of Cu{sub 2−x}Se is realized by potassium cyanide (KCN) solution. Hall measurement results reveal that the secondary phase of Cu{sub 2−x}Se rather than SnSe makes major contribution to the high carrier concentration (larger than 10{sup 18} cm{sup −3}) of CTSe films. The approach to further decrease the carrier concentration in CTSe films is discussed.

Inkjet?Printed Cu2ZnSn(S, Se)4 Solar Cells

OpenAIRE

Lin, Xianzhong; Kavalakkatt, Jaison; Lux?Steiner, Martha Ch.; Ennaoui, Ahmed

2015-01-01

Cu2ZnSn(S, Se)4?based solar cells with total area (0.5 cm2) power conversion efficiency of 6.4% are demonstrated from thin film absorbers processed by inkjet printing technology of Cu?Zn?Sn?S precursor ink followed by selenization. The device performance is limited by the low fill factor, which is due to the high series resistance.

Inkjet-Printed Cu2ZnSn(S, Se)4 Solar Cells.

Science.gov (United States)

Lin, Xianzhong; Kavalakkatt, Jaison; Lux-Steiner, Martha Ch; Ennaoui, Ahmed

2015-06-01

Cu 2 ZnSn(S, Se) 4 -based solar cells with total area (0.5 cm 2 ) power conversion efficiency of 6.4% are demonstrated from thin film absorbers processed by inkjet printing technology of Cu-Zn-Sn-S precursor ink followed by selenization. The device performance is limited by the low fill factor, which is due to the high series resistance.

Influence of PVP in magnetic properties of NiSn nanoparticles prepared by polyol method

Energy Technology Data Exchange (ETDEWEB)

Bobadilla, L.F., E-mail: lbobadilla@iciq.es [Departamento de Quimica Inorganica e Instituto de Ciencia de Materiales, Centro mixto Universidad de Sevilla-CSIC, Av. Americo Vespucio, 41092 Sevilla (Spain); Garcia, C. [Physics Department, Bogazici University, North Campus KB 331-O, Bebek/Istambul (Turkey); Delgado, J.J. [Departamento de Ciencia de los Materiales e Ingenieria Metalurgica y Quimica Inorganica, Facultad de Ciencias, Universidad de Cadiz, Campus Rio San Pedro, E-11510 Puerto Real, Cadiz (Spain); Sanz, O. [Grupo de Ingenieria Quimica, Departamento de Quimica Aplicada, Facultad de Ciencias Quimicas, UPV/EHU, Paseo Manuel de Lardizabal, 3, 20018 San Sebastian (Spain); Romero-Sarria, F.; Centeno, M.A.; Odriozola, J.A. [Departamento de Quimica Inorganica e Instituto de Ciencia de Materiales, Centro mixto Universidad de Sevilla-CSIC, Av. Americo Vespucio, 41092 Sevilla (Spain)

2012-11-15

The influence of PVP on the magnetic properties of NiSn nanoparticles prepared by polyol method has been studied. NiSn nanoparticles exhibit superparamagnetic behavior although there is a ferromagnetic contribution due to particles agglomerated below the blocking temperature. The particle size is controlled by the addiction of PVP in varying amounts. The addition of PVP also favours the particles isolation, narrow the particle size distribution and decrease the interparticle interaction strength increasing the superparamagnetic contribution. - Highlights: Black-Right-Pointing-Pointer Ni{sub x}Sn{sub y} alloys nanoparticles have been prepared by polyol method. Black-Right-Pointing-Pointer NiSn nanoparticles exhibit superparamagnetic behavior. Black-Right-Pointing-Pointer The PVP addition favours the particles isolation.

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

Science.gov (United States)

Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

2017-08-01

Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

Electronic structure and magnetic properties of Ni-doped SnO2 thin films

Science.gov (United States)

Sharma, Mayuri; Kumar, Shalendra; Alvi, P. A.

2018-05-01

This paper reports the electronic structure and magnetic properties of Ni-doped SnO2 thin film which were grown on Si (100) substrate by PLD (pulse laser deposition) technique under oxygen partial pressure (PO2). For getting electronic structure and magnetic behavior, the films were characterized using near edge X-ray absorption fine structure spectroscopy (NEXAFS) and DC magnetization measurements. The NEXAFS study at Ni L3,2 edge has been done to understand the local environment of Ni and Sn ions within SnO2 lattice. DC magnetization measurement shows that the saturation magnetization increases with the increase in substitution of Ni2+ ions in the system.

Design and tailoring of Ni-Sn-W composites for bonded abrasive applications

Energy Technology Data Exchange (ETDEWEB)

Kourtoukova, G.L.; Demetry, C.; Biederman, R.R. [Worcester Polytechnic Inst., MA (United States). Materials Science and Engineering Program; Ramanath, S.; Andrews, R.M.; Jacobs, D.S. [Saint-Gobain/Norton Company, Worcester, MA (United States)

2000-01-15

The combination of properties ideal for metal bonds in abrasive products can rarely be achieved in a monolithic material. This research demonstrates a successful approach for producing a composite bond with higher elastic modulus without a significant increase in wear resistance, by taking advantage of the reaction between matrix and reinforcement to produce intermetallics. Composites comprised of a Ni-Sn matrix with continuous W fiber and/or W powder dispersoid were prepared by powder metallurgy methods. Composite specimens densified by hot pressing were characterized with a combination of scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analyses, measurements of wear resistance, and measurements of Young's modulus and hardness by both bulk and nanoindentation methods. A significant stiffening effect was observed; the elastic modulus of the composites was up to 30% greater than that predicted by a rule of mixtures based on the moduli of the unreacted fiber and matrix constituents alone. As desired, the wear resistance of the composite was approximately equal to that of the Ni-Sn matrix. One contribution to this combination of properties is believed to be the high elastic moduli and likely low fracture toughness of the Ni-W and Ni-Sn intermetallics that are formed. Properties of the Ni-Sn-W composites are contrasted with those of a Ni-Sn matrix reinforced with WC particulate, where no reaction occurs at the interface. (orig.)

Pressure dependence of the Curie temperature in the Kondo lattice compound YbNiSn

Energy Technology Data Exchange (ETDEWEB)

Sparn, G; Thompson, J D [Los Alamos National Lab., NM (United States); Hamzic, A [Dept. of Physics, Zagreb (Yugoslavia)

1992-04-03

We have measured the magnetic susceptibility (2 K < T < 300 K) and the electrical resistivity under pressure (1.2 K < T < 300 K; p < 20 kbar) of the Kondo lattice compound YbNiSn, which may be considered as the ''hole'' analogue of the isostructural compound CeNiSn. In contrast with CeNiSn, YbNiSn does not show an energy gap at low temperatures but instead undergoes a magnetic phase transition at T{sub M} = 5.5 K. The magnetic state might be either a weakly ferromagnetic or a complex antiferromagnetic state. By applying pressure the room temperature resistance {rho}{sub RT} decreases, while T{sub M} increases. This behavior can be interpreted with respect to Doniach's Kondo necklace model as a decrease in the local exchange coupling constant J with increasing pressure, which reduces Kondo spin compensation and favors long-range magnetic order. These results show that the idea that YbNiSn is the hole counterpart to CeNiSn holds well for the properties such as dT{sub M}/dP and d{rho}{sub RT}/dP but that it fails in more detailed aspects, such as the origin of the energy gap formation. (orig.).

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects

DEFF Research Database (Denmark)

Brincker, Mads; Söhl, Stefan; Eisele, Ronald

2017-01-01

As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems...

Effects of hydrazine on the solvothermal synthesis of Cu{sub 2}ZnSnSe{sub 4} and Cu{sub 2}CdSnSe{sub 4} nanocrystals for particle-based deposition of films

Energy Technology Data Exchange (ETDEWEB)

Chiang, Ming-Hung [Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701 (China); Fu, Yaw-Shyan, E-mail: ysfu@mail.nutn.edu.tw [Department of Greenergy, National University of Tainan, Tainan, Taiwan 700 (China); Shih, Cheng-Hung; Kuo, Chun-Cheng [Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701 (China); Guo, Tzung-Fang [Department of Photonics, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan, Taiwan 701 (China); Lin, Wen-Tai, E-mail: wtlin@mail.ncku.edu.tw [Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701 (China)

2013-10-01

The effects of hydrazine on the synthesis of Cu{sub 2}ZnSnSe{sub 4} (CZTSe) and Cu{sub 2}CdSnSe{sub 4} (CCTSe) nanocrystals in an autoclave as a function of temperature and time were explored. On heating at 190 °C for 24-72 h, pure CZTSe and CCTSe nanocrystals could readily grow in the hydrazine-added solution, while in the hydrazine-free solution the intermediate phases such as ZnSe, Cu{sub 2}Se, and Cu{sub 2}SnSe{sub 3}, and Cu{sub 2}SnSe{sub 3} and CdSe associated with the CZTSe and CCTSe nanocrystals grew, respectively. This result reveals that hydrazine can speed up the synthesis of pure CZTSe and CCTSe nanocrystals via a solvothermal process. The mechanisms for the hydrazine-enhanced growth of CZTSe and CCTSe nanocrystals were discussed. The pure CZTSe and CCTSe nanocrystals were subsequently fabricated to the smooth films by spin coating without further annealing in selenium atmosphere. This processing may be beneficial to the fabrication of the absorber layer for solar cells and thermoelectric devices. - Highlights: • Hydrazine enhances the growth of pure Cu{sub 2}ZnSnSe{sub 4} and Cu{sub 2}CdSnSe{sub 4} nanocrystals. • The nanocrystals can be fabricated to films by spin coating without annealing. • This solvothermal processing is promising for the fabrication of thin film devices.

The influence of precursor Cu content and two-stage processing conditions on the microstructure of Cu{sub 2}ZnSnSe{sub 4}

Energy Technology Data Exchange (ETDEWEB)

Márquez-Prieto, J., E-mail: jose.prieto@northumbria.ac.uk [Northumbria Photovoltaic Application Centre, Faculty of Engineering and Environment, Northumbria University, Ellison Building, Newcastle upon Tyne NE1 8ST (United Kingdom); Ren, Y. [Ångström Solar Center, Solid State Electronics, Uppsala University, Uppsala 751 21 (Sweden); Miles, R.W.; Pearsall, N.; Forbes, I. [Northumbria Photovoltaic Application Centre, Faculty of Engineering and Environment, Northumbria University, Ellison Building, Newcastle upon Tyne NE1 8ST (United Kingdom)

2015-05-01

This paper reports the influence of processing temperature on the microstructure of Cu{sub 2}ZnSnSe{sub 4} (CZTSe) absorber layers for temperatures between 380 and 550 °C produced using a 2-stage process. X-ray diffraction analysis showed the formation of Cu{sub 2}ZnSnSe{sub 4} over this temperatures range. The Williamson-Hall method was used for microstructural analysis of the CZTSe absorbers, and this showed a progressive decrease of the micro-strain of the CZTSe with increasing selenisation temperature. The influence of precursor Cu content on the microstructure of the CZTSe was also studied. An increase of Cu content in the precursor is correlated to an increase in grain size and a decrease in micro-strain. Raman measurements show an asymmetrical broadening towards lower energies of the main 197 cm{sup −1} mode for Cu-poor compositions. This study provides an insight into the dependency of the crystallinity of CZTSe on composition and synthesis temperature. - Highlights: • We fabricate Cu{sub 2}ZnSnSe{sub 4} thin films by sputtering and post-reactive annealing. • The micro-strain of Cu{sub 2}ZnSnSe{sub 4} increases when Cu content decreases. • The micro-strain of Cu{sub 2}ZnSnSe{sub 4} decreases with increasing processing temperature. • The defect concentration of Cu{sub 2}ZnSnSe{sub 4} increases when Cu content decreases.

Fabrication and tensile properties of rapidly solidified Cu-10wt. %Ni alloy. [Cu-10Ni

Energy Technology Data Exchange (ETDEWEB)

Baril, D; Angers, R; Baril, J [Dept. of Mining and Metallurgy, Laval Univ., Ste-Foy, Quebec (Canada)

1992-10-15

Cu-10wt.%Ni ribbons were produced by melt spinning and cut into small particles with a blade cutter mill. The powders were then hot consolidated to full density by hot pressing followed by hot extrusion. Tensile properties of the resulting pieces were measured. Cu-10wt.%Ni cast ingots were also hot extruded and mechanically tested to compare with the rapidly solidified alloy and to evaluate the possible benefits brought by the rapid solidification process.

A simple route to Cu{sub x}Sn{sub (100−x)} intermetallic nanoparticle catalyst for ultra-phenol hydroxylation

Energy Technology Data Exchange (ETDEWEB)

Pithakratanayothin, Sakollapath [The Petroleum and Petrochemical College and Center of Excellence on Petrochemical and Materials Technology, Chulalongkorn University, Bangkok 10330 (Thailand); Tongsri, Ruangdaj [Powder Metallurgy Research and Development Unit - PM-RDU, National Metal and Materials Technology Center, Pathum Thani 12120 (Thailand); Chaisuwan, Thanyalak [The Petroleum and Petrochemical College and Center of Excellence on Petrochemical and Materials Technology, Chulalongkorn University, Bangkok 10330 (Thailand); Wongkasemjit, Sujitra, E-mail: dsujitra@chula.ac.th [The Petroleum and Petrochemical College and Center of Excellence on Petrochemical and Materials Technology, Chulalongkorn University, Bangkok 10330 (Thailand)

2016-09-15

A practical methodology and novel, economical materials were proposed to successfully prepare nanoparticle catalysts for phenol hydroxylation. The preparation was carried out via mechanical alloying (MA) of Cu{sub x}Sn{sub (100−x)} powder mixtures (where x = 30, 50, 70, and 100%wt). The mechanical alloyed nanoparticles were characterized using various techniques. X-ray diffraction patterns indicated that η-Cu{sub 6}Sn{sub 5}, ε-Cu{sub 3}Sn, and CuSn phases could be formed in the mechanical alloyed Cu{sub x}Sn{sub (100−x)} materials. Transmission electron micrographs and selected area electron diffraction patterns confirmed the presence of η-Cu{sub 6}Sn{sub 5}, ε-Cu{sub 3}Sn, and CuSn phases. Activity of the catalysts, using the optimal conditions of 70 °C reaction temperature for 1 h, 50 mg of Cu{sub 0.5}Sn{sub 0.5}, and 1:3 phenol:H{sub 2}O{sub 2} ratio, provided more than 98% conversion with 70% catechol (CAT) and 29% hydroquinone (HQ). Experimental results suggested that the presence of the ε-Cu{sub 3}Sn phase gave higher activity while Sn reduced benzoquinone (BQ) to HQ. The catalyst maintained its stability with no structural collapse for more than 24 h. - Highlights: • Cu{sub x}Sn{sub y} intermetallic as a catalyst was successfully synthesized via mechanical alloying. • Cu{sub x}Sn{sub y} intermetallics promoted impressive phenol hydroxylation. • 98% conversion was achieved with high selectivity of catechol.

Hydrothermal Synthesis and Structural Characterization of NiO/SnO2 Composites and Hydrogen Sensing Properties

Directory of Open Access Journals (Sweden)

Chao Wei

2015-01-01

Full Text Available Pure SnO2 and NiO doped SnO2 nanostructures were successfully synthesized via a simple and environment-friendly hydrothermal method. X-ray powder diffraction (XRD, scanning electron microscopy (SEM, energy dispersive X-ray spectroscopy (EDS, and X-ray photoelectron spectra (XPS were used to investigate the crystalline structures, surface morphologies and microstructures, and element components and their valences of the as-synthesized samples. Furthermore, planar chemical gas sensors based on the synthesized pure SnO2 and NiO/SnO2 composites were fabricated and their sensing performances to hydrogen, an important fault characteristic gas dissolved in power transformer oil, were investigated in detail. Gas sensing experiments indicate that the NiO/SnO2 composites showed much higher gas response and lower working temperature than those of pure SnO2, which could be ascribed to the formation of p-n heterojunctions between p-type NiO and n-type SnO2. These results demonstrate that the as-synthesized NiO/SnO2 composites a promising hydrogen sensing material.

Tuning the thermoelectric properties by manipulating copper in Cu2SnSe3 system

DEFF Research Database (Denmark)

Prasad K, Shyam; Rao, Ashok; Christopher, Benedict

2018-01-01

Cu2+xSnSe3 (0 ≤ x ≤ 0.08) compounds were synthesized by conventional solid-state reaction followed by spark plasma sintering (SPS) technique. Transport properties of the samples were measured as a function of temperature in the temperature range 323–773 K. As compared to Cu2SnSe3 sample, the elec......Cu2+xSnSe3 (0 ≤ x ≤ 0.08) compounds were synthesized by conventional solid-state reaction followed by spark plasma sintering (SPS) technique. Transport properties of the samples were measured as a function of temperature in the temperature range 323–773 K. As compared to Cu2SnSe3 sample...

Three NiAs-Ni 2In Type Structures in the Mn-Sn System

Science.gov (United States)

Elding-Pontén, Margareta; Stenberg, Lars; Larsson, Ann-Kristin; Lidin, Sven; Ståhl, Kenny

1997-03-01

TheB8-type structure field of the Mn-Sn system has been investigated. Two high temperature phases (HTP1 and HTP2) and one low temperature phase (Mn3Sn2) were found. They all crystallize with the NiAs structure type with part of the trigonal bipyramidal interstices filled by manganese atoms in an ordered manner. The ordering as well as the manganese content is different for the three phases, giving rise to three different orthorhombic superstructures. Mn3Sn2seems to have the lowest manganese content, since the corresponding basal unit cell is smaller than for HTP1-2. Structural models of the phases are based on selected area electron diffraction, X-ray powder diffraction, and preliminary single crystal X-ray measurements. The ideal cell parameters found are (a=7ahex,b=3ahex,c=chex), (a=5ahex,b=3ahex,c=chex), and (a=2ahex,b=3ahex,c=chex) for HTP1, HTP2, and Mn3Sn2, respectively. The crystal structure of Mn3Sn2has been refined by means of the Rietveld method from X-ray powder diffraction data. Mn3Sn2is orthorhombic,Pnma,a=7.5547(2),b=5.4994(2),c=8.5842(2) Å,Z=4. (Pbnmin the setting above.) The compound is isostructural with Ni3Sn2andγ‧-Co3Sn2(H. Fjellvåg and A. Kjekshus,Acta Chem. Scand.A40, 23-30 (1986)). FinalRp=8.97%,Rwp=11.44%, GOF=2.86, andRBragg=4.11% using 43 parameters and 5701 observations and 330 Bragg reflections.

The Cu2ZnSnSe4 thin films solar cells synthesized by electrodeposition route

Science.gov (United States)

Li, Ji; Ma, Tuteng; Wei, Ming; Liu, Weifeng; Jiang, Guoshun; Zhu, Changfei

2012-06-01

An electrodeposition route for preparing Cu2ZnSnSe4 thin films for thin film solar cell absorber layers is demonstrated. The Cu2ZnSnSe4 thin films are prepared by co-electrodeposition Cu-Zn-Sn metallic precursor and subsequently annealing in element selenium atmosphere. The structure, composition and optical properties of the films were investigated by X-ray diffraction (XRD), Raman spectrometry, energy dispersive spectrometry (EDS) and UV-VIS absorption spectroscopy. The Cu2ZnSnSe4 thin film with high crystalline quality was obtained, the band gap and absorption coefficient were 1.0 eV and 10-4 cm-1, which is quite suitable for solar cells fabrication. A solar cell with the structure of ZnO:Al/i-ZnO/CdS/Cu2ZnSnSe4/Mo/glass was fabricated and achieved an conversion efficiency of 1.7%.

Nanostructure analysis of friction welded Pd-Ni-P/Pd-Cu-Ni-P metallic glass interface

International Nuclear Information System (INIS)

Ohkubo, T.; Shoji, S.; Kawamura, Y.; Hono, K.

2005-01-01

Friction welded Pd 40 Ni 40 P 20 /Pd 40 Cu 30 Ni 10 P 20 metallic glass interface has been characterized by energy filtering transmission electron microscopy. The interface is fully amorphous with a gradual compositional change of Cu and Ni in the range of 30 nm. By annealing above T g , the interdiffusion of Cu and Ni progressed in the supercooled liquid region, and the crystallization occurred from the Pd 40 Ni 40 P 20 glass

Synthesis, characterization and electromagnetic properties of SnO-coated FeNi alloy nanocapsules

Energy Technology Data Exchange (ETDEWEB)

Li, Mingling; Li, Honglin; Xu, Taotao; Nie, Yu, E-mail: lml771212@163.com [College of Chemistry and Material Engineering, Chaohu University (China)

2016-11-15

SnO-coated FeNi alloy nanocapsules have been synthesized by an arc-discharge method. High resolution transmission electron microscopy and x-ray photoelectron spectroscopy analysis show that the nanocapsules have a shell/core structure with FeNi alloy nanoparticles as the core and amorphous SnO as the shell. Dielectric relaxation of SnO shell and the interfacial relaxation between SnO shell and FeNi core lead to the dual nonlinear dielectric resonance. The natural resonance in the SnO coated FeNi nanocapsules shifts to 14.0 GHz. Reflection loss (RL) reaches -46.1 dB at 14.8 GHz for a matching thickness of 1.95 mm, while it exceeds-20 dB over the 13.6 -16.7 GHz range and it exceeds -10 dB in the whole Ku-band (12.4-18 GHz). In addition, the optimal RL values at 5.0-7.6 GHz with the absorbing thickness of 3.4-5.0 mm just exhibit a slight fluctuation. (author)

Central {sup 112}Sn + {sup 58}Ni, {sup 124}Sn + {sup 64}Ni collisions in the Reverse Experiment

Energy Technology Data Exchange (ETDEWEB)

Geraci, E.; Bruno, M.; D' Agostino, M.; Vannini, G. [Bologna Univ., Dipartimento di Fisica (Italy); Anzalone, A.; Baran, V.; Bonasera, A.; Cavallaro, S.; Colonna, M.; Di Toro, M.; Giustolisi, F.; Iacono-Manno, M.; La Guidara, E.; Lanzalone, G.; Porto, F.; Russotto, P.; Maiolino, C.; Sperduto, M.I. [Catania Univ., INFN-LNS and Dipartimento di Fisica e Astronomia (Italy); Alderighi, M.; Bartolucci, M.; Sechi, G. [INFN and Istituto di Fisica Cosmica, CNR, Milano (Italy); Auditore, L.; Trifiro, A.; Rimarchi, M. [Messina Univ., INFN and Dipartimento di Fisica (Italy); Berceanu, I.; Petrovici, M.; Simion, S. [Institute for Physics and Nuclear Engineering, Bucharest (Romania); Guazzoni, P.; Russo, S.; Manfredi, G.; Zetta, L. [Milano Univ., INFN and Dipartimento di Fisica (Italy); Blicharska, J.; Grzeszczuk, A.; Kowalski, S.; Paduszynski, T.; Zipper, W. [Silesia Univ., Institute of Physics, Katowice (Poland); Borderie, B.; Le Neindre, N.; Rivet, M.F. [Institut de Physique nucleaire, IN2P3-CNRS, 91 - Orsay (France); Bougault, B.R.; Steckmeyer, J.C. [Caen Univ., LPC, ENSI, 14 (France); Brzychczyk, J.; Majka, Z. [Jagellonian Univ., M.Smoluchowski Institute of Physics, Cracow (Poland); Cardella, G.; Filippo, E. de; Lanzano, G.; Li, S.; Lo Nigro, S.; Pagano, A.; Papa, M.; Pirrone, S.; Politi, G. [Catania Univ., INFN and Dipartimento di Fisica e Astronomia (Italy); Chbihi, A.; Wieleczko, J.P. [GANIL, CEA, IN2P3-CNRS, 14 - Caen (France); Cibor, J. [H. Niewodniczanski Institute of Nuclear Physics, Cracov (Poland); Guinet, D. [Institut de Physique nucleaire, IN2P3-CNRS, 69 - Lyon (France); Wu, H.; Xiao, Z. [Institute of Modern Physics Lanzhou (China); Piasecki, E. [Warsaw Univ., Institute of Experimental Physics (Poland); Rosato, E.; Vigilante, M. [Napoli Univ., INFN and Dipartimento di Fisica (Italy); Wilczynski, J. [Institute for Nuclear Studies, Otwock-Swierk (Poland)

2003-07-01

{sup 112}Sn + {sup 58}Ni and {sup 124}Sn + {sup 64}Ni reactions at 35 AMeV incident energy were studied using the 688 Si-CsI(Tl) telescopes of the forward part (1 {<=} {theta} {<=} 30 degrees) of CHIMERA multi-detector. The most central part of the total measured cross section was selected by means of a multidimensional analysis of the experimental observables. The characteristics of the source formed in the central collisions, as size, temperature and volume, were inspected. The detected isotopes of light fragments (3 {<=} Z {<=} 8) provided information on breakup temperatures of the emitting sources. The space-time structure of these sources was deduced from the two-fragment velocity correlation functions. Isotope yield ratios were used to extract the freeze-out unbound relative neutron and proton densities and the neutron to proton density of both studied reactions, indicating for a possible isospin distillation mechanism. (authors)

Novel chemical route for deposition of Cu{sub 2}ZnSnS{sub 4} photovoltaic absorbers

Energy Technology Data Exchange (ETDEWEB)

Gordillo, Gerardo; Becerra, Raul A.; Calderón, Clara L., E-mail: ggordillog@unal.edu.co [Universidad Nacional de Colombia, Bogota (Colombia)

2018-05-01

This work reports results of a study carried out to optimize the preparation conditions of Cu{sub 2}ZnSnS{sub 4} (CZTS) thin films grown by sequential deposition of Cu{sub 2}SnS{sub 3} (CTS) and ZnS layers, where the Cu{sub 2}SnS{sub 3} compound was grown using a novel procedure consisting of simultaneous precipitation of Cu{sub 2}S and SnS{sub 2} performed by diffusion membrane assisted chemical bath deposition (CBD) technique. The precipitation across the diffusion membranes allows achieving moderate control of release of metal ions into the work solution favoring the heterogeneous growth mainly through an ion-ion mechanism. Through a parameters study, conditions were found to grow Cu{sub 2}SnS{sub 3} thin films which were used as precursors for the formation of Cu{sub 2}ZnSnS{sub 4} films. The formation of CZTS thin films grown in the Cu{sub 2}ZnSnS{sub 4} phase was verified through measurements of X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and Raman spectroscopy. Solar cells with efficiencies of 4.9% were obtained using CZTS films prepared by membrane assisted CBD technique as absorber layer. (author)

Reaction pathways of furfural, furfuryl alcohol and 2-methylfuran on Cu(111) and NiCu bimetallic surfaces

Science.gov (United States)

Xiong, Ke; Wan, Weiming; Chen, Jingguang G.

2016-10-01

Hydrodeoxygenation (HDO) is an important reaction for converting biomass-derived furfural to value-added 2-methylfuran, which is a promising fuel additive. In this work, the HDO of furfural to produce 2-methylfuran occurred on the NiCu bimetallic surfaces prepared on either Ni(111) or Cu(111). The reaction pathways of furfural were investigated on Cu(111) and Ni/Cu(111) surfaces using density functional theory (DFT) calculations, temperature-programmed desorption (TPD) and high-resolution electron energy loss spectroscopy (HREELS) experiments. These studies provided mechanistic insights into the effects of bimetallic formation on enhancing the HDO activity. Specifically, furfural weakly adsorbed on Cu(111), while it strongly adsorbed on Ni/Cu(111) through an η2(C,O) configuration, which led to the HDO of furfural on Ni/Cu(111). The ability to dissociate H2 on Ni/Cu(111) is also an important factor for enhancing the HDO activity over Cu(111).

Ni doping effect on the electronic and sensing properties of 2D SnO2

Science.gov (United States)

Patel, Anjali; Roondhe, Basant; Jha, Prafulla K.

2018-05-01

In the present work using state of art first principles calculations under the frame work of density functional theory the effect of Nickel (Ni) doping on electronic as well as sensing properties of most stable two dimensional (2D) T-SnO2 phase towards ethanol (C2H5OH) has been observed. It has been found that Ni atom when dope on T-SnO2 causes prominent decrement in the band gap from 2.26 eV to 1.48 eV and improves the sensing phenomena of pristine T-SnO2 towards C2H5OH by increasing the binding energy from -0.18eV to -0.93eV. The comparative analysis of binding energy shows that Ni improves the binding of C2H5OH by 5.16 times the values for pristine T-SnO2. The doping of Ni into 2D T-SnO2 reduces the band gap through lowering of the conduction band minimum, thereby increasing the electron affinity which increases the sensing performance of T-SnO2. The variation in the electronic properties after and before the exposure of ethanol reinforced to use Ni:SnO2 nano structure for sensing applications. The results indicate that the Ni doped T-SnO2 can be utilized in improved optoelectronic as well as sensor devices in the future.

Fabrication of hydrogen peroxide biosensor based on Ni doped SnO2 nanoparticles.

Science.gov (United States)

Lavanya, N; Radhakrishnan, S; Sekar, C

2012-01-01

Ni doped SnO(2) nanoparticles (0-5 wt%) have been prepared by a simple microwave irradiation (2.45 GHz) method. Powder X-ray diffraction (XRD) and transmission electron microscopy (TEM) studies confirmed the formation of rutile structure with space group (P(42)/mnm) and nanocrystalline nature of the products with spherical morphology. Direct electrochemistry of horseradish peroxidase (HRP)/nano-SnO(2) composite has been studied. The immobilized enzyme retained its bioactivity, exhibited a surface confined, reversible one-proton and one-electron transfer reaction, and had good stability, activity and a fast heterogeneous electron transfer rate. A significant enzyme loading (3.374×10(-10) mol cm(-2)) has been obtained on nano-Ni doped SnO(2) as compared to the bare glassy carbon (GC) and nano-SnO(2) modified surfaces. This HRP/nano-Ni-SnO(2) film has been used for sensitive detection of H(2)O(2) by differential pulse voltammetry (DPV), which exhibited a wider linearity range from 1.0×10(-7) to 3.0×10(-4)M (R=0.9897) with a detection limit of 43 nM. The apparent Michaelis-Menten constant (K(M)(app)) of HRP on the nano-Ni-SnO(2) was estimated as 0.221 mM. This excellent performance of the fabricated biosensor is attributed to large surface-to-volume ratio and Ni doping into SnO(2) which facilitate the direct electron transfer between the redox enzyme and the surface of electrode. Copyright © 2012 Elsevier B.V. All rights reserved.

Estrabismo após toxina botulínica para fins estéticos

Directory of Open Access Journals (Sweden)

Marta Halfeld Ferrari Alves Lacordia

2011-06-01

Full Text Available RESUMO Nas últimas décadas, a toxina botulínica tem sido aplicada para fins terapêuticos em inúmeras afecções. A toxina do tipo A foi aprovada primeiramente em 1989 para o uso em estrabismo, blefaroespasmo e espasmo hemifacial de pacientes maiores que 12 anos de idade. A observação de que pacientes tratados de blefaroespasmo com toxina botulínica apresentavam um efeito adicional de diminuição das rugas de expressão inspirou estudos sobre a aplicação cosmética da toxina. Recentemente, a toxina botulínica do tipo A foi aprovada para fins estéticos. Este trabalho relata um caso de ocorrência de estrabismo após aplicação de toxina botulínica na face para fins estéticos.

Effect of minor elements on microstructure evolution in Ni alloys irradiated with neutrons

International Nuclear Information System (INIS)

Xu, Q.; Yoshiie, T.

2001-01-01

The minor elements, Si (-5.81%), Cu (7.18%), Ge (14.76%) and Sn (74.08%) were chosen to investigate the effects of volume size factor as shown in the parentheses on void swelling in neutron irradiated Ni alloys. Neutron irradiation temperature and dose were changed widely from 473 K to 703 K, and 0.001 dpa to 1 dpa, respectively. Voids were observed by transmission electron microscopy (TEM) in Ni even after a very small irradiation dose of 0.026 dpa at 573 K. With increasing dose, the number density of voids was nearly constant while void size increased. The microstructure evolution in Ni-2 at%Cu and Ni-2 at%Ge alloys was similar to that in Ni. However, in Ni-2 at%Si and Ni-2 at%Sn alloys, no voids were observed by TEM even at 703 K to 1 dpa. The minor elements, Si and Sn, play an important role for the suppression of vacancy clusters. Vacancies are annihilated by mutual recombination with interstitials in Si and Sn added alloys. (orig.)

Metastable Phase Separation and Concomitant Solute Redistribution of Liquid Fe-Cu-Sn Ternary Alloy

International Nuclear Information System (INIS)

Xiao-Mei, Zhang; Wei-Li, Wang; Ying, Ruan; Bing-Bo, Wei

2010-01-01

Liquid Fe-Cu-Sn ternary alloys with lower Sn contents are usually assumed to display a peritectic-type solidification process under equilibrium condition. Here we show that liquid Fe 47.5 Cu 47.5 Sn 5 ternary alloy exhibits a metastable immiscibility gap in the undercooling range of 51–329 K (0.19T L ). Macroscopic phase separation occurs once undercooling exceeds 196 K and causes the formation of a floating Fe-rich zone and a descending Cu-rich zone. Solute redistribution induces the depletion of Sn concentration in the Fe-rich zone and its enrichment in the Cu-rich zone. The primary Fe phase grows dendritically and its growth velocity increases with undercooling until the appearance of notable macrosegregation, but will decrease if undercooling further increases beyond 236 K. The microsegregation degrees of both solutes in Fe and Cu phases vary only slightly with undercooling. (condensed matter: structure, mechanical and thermal properties)

Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

Directory of Open Access Journals (Sweden)

Youqing Sun

2018-05-01

Full Text Available Dissimilar CuNiCrSi and CuCrZr butt joints were successfully frictionstirwelded at constant welding speed of 150 mm/min and rotational speed of 1400 rpm with the CuCrZr alloy or the CuNiCrSi alloy located on the advancing side (AS. The microstructure and mechanical properties of joints were investigated. When the CuCrZr alloy was located on the AS, the area of retreating material in the nugget zone was a little bigger. The Cr solute-rich particles were found in the nugget zone on CuCrZr side (CuCrZr-NZ while a larger density of solute-rich particles identified as the concentration of Cr and Si element was found in the nugget zone on CuNiCrSi side (CuNiCrSi-NZ. The Cr precipitates and δ-Ni2Si precipitates were found in the base metal on CuNiCrSi side (CuNiCrSi-BM but only Cr precipitates can be observed in the base metal on CuCrZr side (CuCrZr-BM. Precipitates were totally dissolved into Cu matrix in both CuCrZr-NZ and CuNiCrSi-NZ, which led to a sharp decrease in both micro-hardness and tensile strength from BM to NZ. When the CuNiCrSi was located on the AS, the tensile testing results showed the fracture occurred at the CuCrZr-NZ, while the fracture was found at the mixed zone of CuNiCrSi-NZ and CuCrZr-NZ for the other case.

Coherence Kondo gap in CeNiSn and CeRhSb

International Nuclear Information System (INIS)

Takabatake, T.; Nakamoto, G.; Tanaka, H.; Bando, Y.; Fujii, H.; Nishigori, S.; Goshima, H.; Suzuki, T.; Fujita, T.; Oguro, I.; Hiraoka, T.; Malik, S.K.

1994-01-01

CeNiSn and CeRhSb are Kondo-lattice compounds showing the behavior of a small-gap semiconductor at temperatures below 7 K. We review and discuss the magnetic, transport and specific-heat measurements performed on single crystals of CeNiSn and polycrystals of CeRhSb. Prerequisites for gap formation are deduced from the effects of substitution and application of a magnetic field and pressure on the gapped state. ((orig.))

A facile and low cost synthesis of earth abundant element Cu{sub 2}ZnSnS{sub 4} (CZTS) nanocrystals: Effect of Cu concentrations

Energy Technology Data Exchange (ETDEWEB)

Shin, Seung Wook; Han, Jun Hee [Department of Materials Science and Engineering, KAIST, 335 Gwahangno, Yuseong-gu, Daejeon 305-701 (Korea, Republic of); Park, Chan Yeong; Kim, Sae-Rok; Park, Yeon Chan; Agawane, G.L. [Photonics Technology Research Institute, Department of Materials Science and Engineering, Chonnam National University, 300 Yongbong-Dong, Buk-Gu, Gwangju 500-757 (Korea, Republic of); Moholkar, A.V. [Electrochemical Mat. Lab, Department of Physics, Shivaji University, Kolhapur 416-004 (India); Yun, Jae Ho [Photovoltaic Research Group, Korea Institute of Energy Research, 71-2 Jang-Dong, Yuseong-Gu, Daejeon 305-343 (Korea, Republic of); Jeong, Chae Hwan [Solar City Center, Development of Advanced Components and Materials Korea Institute of Industrial Technology, Gwangju 500-480 (Korea, Republic of); Lee, Jeong Yong, E-mail: j.y.lee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, 335 Gwahangno, Yuseong-gu, Daejeon 305-701 (Korea, Republic of); Kim, Jin Hyeok, E-mail: jinhyeok@chonnam.ac.kr [Photonics Technology Research Institute, Department of Materials Science and Engineering, Chonnam National University, 300 Yongbong-Dong, Buk-Gu, Gwangju 500-757 (Korea, Republic of)

2012-11-15

Highlights: Black-Right-Pointing-Pointer Cu{sub 2}ZnSnS{sub 4} (CZTS) nanocrystals (NCs) were prepared by sulfurization of microwave assisted precursor without toxic chemicals. Black-Right-Pointing-Pointer Effect of Cu concentration on the properties of CZTS NCs was investigated using various analysis methods. Black-Right-Pointing-Pointer The properties of CZTS NCs was strongly related to the Cu concentrations. - Abstract: Cu{sub 2}ZnSnS{sub 4} (CZTS) nanocrystals (NCs) were synthesized by sulfurization of microwave assisted precursor powders without toxic chemicals. The effects of different Cu concentration from 0.01 to 0.025 M on the structural, morphological, compositional, chemical and optical properties of CZTS NCs were investigated. X-ray diffraction patterns, X-ray photoelectron spectroscopy and transmission electron microscopy results showed that the precursor powder contains several broad peaks that could not be assigned to CZTS, ZnS, Cu{sub 2-x}S, Sn{sub 2}S{sub 3} and Cu{sub 2}SnS{sub 3}. However, the sulfurized NCs showed both kesterite CZTS and Cu- and Sn-based secondary phases except for that formed at Cu concentration of 0.02 M. Inductively coupled plasma (ICP) results showed that the presence of Cu in the sulfurized CZTS NCs increased with increasing Cu concentration from 16.57 to 32.94 at.% while Zn and Sn in the sulfurized CZTS NCs decreased with increasing Cu concentration. UV-Vis spectroscopy results showed that the absorption coefficient of the sulfurized NCs was over 10{sup 4} cm{sup -1} in the visible region and band gap energy of the sulfurized CZTS NCs decreased from 1.65 to 1.28 eV with increasing Cu concentration.

Synthesis of highly non-stoichiometric Cu{sub 2}ZnSnS{sub 4} nanoparticles with tunable bandgaps

Energy Technology Data Exchange (ETDEWEB)

Hamanaka, Yasushi, E-mail: hamanaka@nitech.ac.jp; Oyaizu, Wataru; Kawase, Masanari [Nagoya Institute of Technology, Department of Materials Science and Engineering (Japan); Kuzuya, Toshihiro [Muroran Institute of Technology, College of Design and Manufacturing Technology (Japan)

2017-01-15

Non-stoichiometric Cu{sub 2}ZnSnS{sub 4} nanoparticles with average diameters of 4–15 nm and quasi-polyhedral shape were successfully synthesized by a colloidal method. We found that a non-stoichiometric composition of Zn to Cu in Cu{sub 2}ZnSnS{sub 4} nanoparticles yielded a correlation where Zn content increased with a decrease in Cu content, suggesting formation of lattice defects relating to Cu and Zn, such as a Cu vacancy (V{sub Cu}), antisite with Zn replacing Cu (Zn{sub Cu}), and/or defect cluster of V{sub Cu} and Zn{sub Cu}. The bandgap energy of Cu{sub 2}ZnSnS{sub 4} nanoparticles systematically varies between 1.56 and 1.83 eV depending on the composition ratios of Cu and Zn, resulting in a wider bandgap for Cu-deficient Cu{sub 2}ZnSnS{sub 4} nanoparticles. These characteristics can be ascribed to the modification in electronic band structures due to formation of V{sub Cu} and Zn{sub Cu} on the analogy of ternary copper chalcogenide, chalcopyrite CuInSe{sub 2}, in which the top of the valence band shifts downward with decreasing Cu contents, because much like the structure of CuInSe{sub 2}, the top of the valence band is composed of a Cu 3d orbital in Cu{sub 2}ZnSnS{sub 4}.

Phase Equilibria in the Sn-Rich Corner of the Ni-Sb-Sn System

Czech Academy of Sciences Publication Activity Database

Mishra, R.; Kroupa, Aleš; Zemanová, Adéla; Ipser, H.

2013-01-01

Roč. 42, č. 4 (2013), s. 646-653 ISSN 0361-5235 Institutional support: RVO:68081723 Keywords : lead-free solder * high-temperature solder * Ni-Sb-Sn system Subject RIV: BJ - Thermodynamics Impact factor: 1.675, year: 2013

TiNiSn and Zr{sub 0.5}Hf{sub 0.5}NiSn superlattices for thermoelectrics

Energy Technology Data Exchange (ETDEWEB)

Jaeger, Tino; Jakob, Gerhard [Institut fuer Physik, Universitaet Mainz, 55099 Mainz (Germany); Schwall, Michael; Kozina, Xeniya; Balke, Benjamin; Felser, Claudia [Institut fuer Analytische und Anorganische Chemie, Universitaet Mainz, 55099 Mainz (Germany); Populoh, Sascha; Weidenkaff, Anke [EMPA, Ueberlandstrasse 129, 8600 Duebendorf (Switzerland)

2012-07-01

In order to increase the attractiveness of thermoelectric devices, their efficiency must be increased. Beside others, the properties of the thermoelectric material can be improved. That can be achieved by either increasing Seebeck coefficient or conductivity or by a depressed thermal conductivity along the thermal gradient. For thin films, superlattices or multilayers can be used to lower the cross plane thermal conductivity. As a bottom up approach, artificially layered films with a periodicity of about 5-6 nm are assumed to generate the most phonon scattering at the interfaces. If electrical properties remain unchanged or less effected, the thermoelectric efficiency is enhanced. Semiconducting Half-Heuslers are well studied thermoelectric bulk materials. Among others, TiNiSn and Zr{sub 0.5}Hf{sub 0.5}NiSn are potential candidates. Essentially, their similar lattice constants enable epitaxial layers on top of each other. Furthermore, varied atomic masses of Ti, Zr and Hf generate the aspired alternating mass distribution. By rotating the substrate in between simultaneously burning cathodes, significant film thicknesses can be achieved by sputter deposition.

Low-temperature thermoelectric properties of Pb doped Cu2SnSe3

Science.gov (United States)

Prasad K, Shyam; Rao, Ashok; Gahtori, Bhasker; Bathula, Sivaiah; Dhar, Ajay; Chang, Chia-Chi; Kuo, Yung-Kang

2017-09-01

A series of Cu2Sn1-xPbxSe3 (0 ≤ x ≤ 0.04) compounds was prepared by solid state synthesis technique. The electrical resistivity (ρ) decreased with increase in Pb content up to x = 0.01, thereafter it increased with further increase in x (till x = 0.03). However, the lowest value of electrical resistivity is observed for Cu2Sn0.96Pb0.04Se3. Analysis of electrical resistivity of all the samples suggests that small poloron hoping model is operative in the high temperature regime while variable range hopping is effective in the low temperature regime. The positive Seebeck coefficient (S) for pristine and doped samples in the entire temperature range indicates that the majority charge carriers are holes. The electronic thermal conductivity (κe) of the Cu2Sn1-xPbxSe3 compounds was estimated by the Wiedemann-Franz law and found that the contribution from κe is less than 1% of the total thermal conductivity (κ). The highest ZT 0.013 was achieved at 400 K for the sample Cu2Sn0.98Pb0.02Se3, about 30% enhancement as compared to the pristine sample.

Lattice positions of Sn in Cu2ZnSnS4 nanoparticles and thin films studied by synchrotron X-ray absorption near edge structure analysis

Science.gov (United States)

Zillner, E.; Paul, A.; Jutimoosik, J.; Chandarak, S.; Monnor, T.; Rujirawat, S.; Yimnirun, R.; Lin, X. Z.; Ennaoui, A.; Dittrich, Th.; Lux-Steiner, M.

2013-06-01

Lattice positions of Sn in kesterite Cu2ZnSnS4 and Cu2SnS3 nanoparticles and thin films were investigated by XANES (x-ray absorption near edge structure) analysis at the S K-edge. XANES spectra were analyzed by comparison with simulations taking into account anti-site defects and vacancies. Annealing of Cu2ZnSnS4 nanoparticle thin films led to a decrease of Sn at its native and defect sites. The results show that XANES analysis at the S K-edge is a sensitive tool for the investigation of defect sites, being critical in kesterite thin film solar cells.

Effect of surfactant on electrodeposited Ni-P layer as an under bump metallization

International Nuclear Information System (INIS)

Lin, Yung-Chi; Duh, Jenq-Gong

2007-01-01

In the microelectronic industry, the nickel plating has been used as the under bump metallization (UBM). The electroplated process was demonstrated to be a favorable alternative approach to produce the Ni-P layer as UBM. In this study, the role of sodium dodecylsulfate (SDS) addition in electrodeposition was investigated. The variations on surface morphology and surface roughness in the SDS-added process of electroplated Ni-P were revealed with both field emission scanning electronic microscope and atomic force microscope. The influence of SDS addition process in wettability of several commercial solder pastes, including Sn-37Pb, Sn-3.5Ag, and Sn-3.0Ag-0.5Cu, on electroplated Ni-P with various phosphorous contents was evaluated. The surface morphology and the surface roughness of Ni-P layer were affected by SDS addition. It was demonstrated that modified surface morphology and surface roughness acted to enhance the wettability of electroplated Ni-P. In addition, the interfacial reactions between Sn-3.0Ag-0.5Cu and electroplated Ni-P UBM with SDS addition during deposition was also probed and discussed

Thermoelectric properties of chalcogenide based Cu2+xZnSn1−xSe4

Directory of Open Access Journals (Sweden)

Ch. Raju

2013-03-01

Full Text Available Quaternary chalcogenide compounds Cu2+xZnSn1−xSe4 (0 ≤ x ≤ 0.15 were prepared by solid state synthesis. Rietveld powder X-ray diffraction (XRD refinements combined with Electron Probe Micro Analyses (EPMA, WDS-Wavelength Dispersive Spectroscopy and Raman spectra of all samples confirmed the stannite structure (Cu2FeSnS4-type as the main phase. In addition to the main phase, small amounts of secondary phases like ZnSe, CuSe and SnSe were observed. Transport properties of all samples were measured as a function of temperature in the range from 300 K to 720 K. The electrical resistivity of all samples decreases with an increase in Cu content except for Cu2.1ZnSn0.9Se4, most likely due to a higher content of the ZnSe. All samples showed positive Seebeck coefficients indicating that holes are the majority charge carriers. The thermal conductivity of doped samples was high compared to Cu2ZnSnSe4 and this may be due to the larger electronic contribution and the presence of the ZnSe phase in the doped samples. The maximum zT = 0.3 at 720 K occurs for Cu2.05ZnSn0.95Se4 for which a high-pressure torsion treatment resulted in an enhancement of zT by 30% at 625 K.

Ethanol sensing properties and dominant sensing mechanism of NiO-decorated SnO2 nanorod sensors

Science.gov (United States)

Sun, Gun-Joo; Lee, Jae Kyung; Lee, Wan In; Dwivedi, Ram Prakash; Lee, Chongmu; Ko, Taegyung

2017-05-01

NiO-decorated SnO2 nanorods were synthesized by the thermal evaporation of Sn powders followed by the solvothermal deposition of NiO. A multi-networked p- n heterostructured nanorod sensor was fabricated by dropping the p-NiO-decorated n-SnO2 nanorods onto the interdigited electrode pattern and then annealing. The multi-networked p- n heterostructured nanorod sensor exhibited enhanced response to ethanol compared with the pristine SnO2 nanorod and NiO nanoparticle sensors. The former also exhibited a shorter sensing time for ethanol. Both sensors exhibited selectivity for ethanol over other volatile organic compounds (VOCs) such as HCHO, methanol, benzene and toluene and the decorated sensor exhibited superior selectivity to the other two sensors. In addition, the dominant sensing mechanism is discussed in detail by comparing the sensing properties and current-voltage characteristics of a p-NiO/ n-SnO2 heterostructured nanorod sensor with those of a pristine SnO2 nanorod sensor and a pristine NiO nanoparticle sensor. Of the two competing electronic mechanisms: a potential barrier-controlled carrier transport mechanism at a NiO-SnO2 p- n junction and a surface-depletio n-controlled carrier transport mechanism, the former has some contribution to the enhanced gas sensing performance of the p- n heterostructured nanorod sensor, however, its contribution is not as significant as that of the latter. [Figure not available: see fulltext.

Azadirachta indica (neem) leaves mediated synthesis of SnO2/NiO nanocomposite and assessment of its photocatalytic activity

Science.gov (United States)

Varshney, Bhaskar; Shoeb, Mohd; Siddiqui, M. J.; Azam, Ameer; Mobin, Mohammad

2018-05-01

SnO2/NiO nanocomposite are prepared by using a simple cost effective and ecofriendly green soft template method followed by ultrasonication treatment further by calcination at 300 °C. The resulting nanocatalysts were characterized by X-ray diffraction (XRD), UV-Visible spectroscopy and transmission electron microscopy (TEM). The SnO2-NiO photocatalyst was made of a mesoporous network of aggregated NiO and cassiterite SnO2 nanocrystallites, the size of which was estimated to be 16.68 nm and 13.17 nm, respectively, after calcination. According to UV-visible spectroscopy, the evident energy band gap value of the SnO2-NiO photocatalyst was estimated to be 3.132 eV to be compared with those of pure SnO2, that is, 3.7 eV. Moreover, the heterostructure SnO2-NiO photocatalyst showed much higher photocatalytic activities for the degradation of methylene blue than those of individual SnO2 and NiO nanomaterials. This behaviour was rationalized in terms of better charge separation and the suppression of charge recombination in the SnO2-NiO photocatalyst because of the energy difference between the conduction band edges of SnO2 and NiO as evidenced by the band alignment determination. Finally, this mesoporous SnO2-NiO heterojunction nanocatalyst was stable and could be easily recycled several times opening new avenues for potential industrial applications.

Fluidez lectora en niños: cuáles son las habilidades subyacentes

Directory of Open Access Journals (Sweden)

Julieta-Carolina Fumagalli

2017-01-01

Full Text Available del aprendizaje de la lectura y la comprensión de textos. En español son escasas las herramientas para evaluar este constructo que involucra aspectos relativos a la precisión lectora, la expresividad, la velocidad y la comprensión. A fin de obtener información para el futuro diseño de una batería que evalúe la fluidez a partir de textos en español, este trabajo se propone establecer las habilidades subyacentes a la fluidez. Para tal fin, se evaluó a un total de 172 niños de 3º, 5º y 7º curso de Educación Primaria sin dificultades para el aprendizaje de la lectura. Los participantes respondieron cinco tareas: fluidez verbal fonológica (FVF, conciencia fonoló- gica (CF, velocidad de denominación (RAN, lectura de palabras y no palabras (Lectura de PyNP y lectura en voz alta de un texto (LVA, a partir de la cual se extrajeron medidas de precisión lectora, velocidad y comprensión. Los resultados obtenidos brindan información sobre variables que inciden de manera directa (RAN y Lectura de PyNP e indirecta (CF y FVF sobre la fluidez lectora. Estos datos resultan relevantes para el futuro diseño de una batería que permita medir este constructo.

First-principles investigations of the Ni3Sn alloy at steam reforming conditions

DEFF Research Database (Denmark)

Saadi, Souheil; Hinnemann, Berit; Helveg, Stig

2009-01-01

The structure and surface composition of a Ni3Sn alloy at conditions relevant for the steam reforming reaction was investigated using density functional theory calculations. Both the flat Ni3Sn [1 0 (1) over bar 0] surface and a surface with steps in the closed packed direction [1 0 (1) over bar 0...

Sensors of the gas CO in thin film of SnO2:Cu

International Nuclear Information System (INIS)

Tirado G, S.; Sanchez Z, F. E.

2011-10-01

Thin films of SnO 2 :Cu with different thickness, were deposited on soda-lime glass substrates and prepared by the Sol-gel process and repeated immersion. The sensor properties of these films to the gas CO for the range of 0-200 ppm in the gas concentration and operating to temperatures of 23, 100, 200, and 300 C were studied. Prepared films of pure SnO 2 were modified superficially with 1, 3, 5 and 10 layers of the catalyst Cu (SnO 2 :Cu) with the purpose of studying the effect on the sensor capacity of the gas CO by part of the films SnO 2 :Cu. Using the changes in the electric properties of the films with the incorporation of the different copper layers and experimental conditions, the sensor modifications of the gas CO were evaluated. To complete this study, was realized a characterization of the superficial morphology of the films by scanning electron microscopy and atomic force microscopy, equally was studied their structure and their electric and optical properties. (Author)

Microalloying with Cd of Antifriction Sn-Sb-Cu Alloys

Directory of Open Access Journals (Sweden)

Cinca Ionel Lupinca

2012-09-01

Full Text Available In the case of bimetallic sliding linings with superior technological characteristics, the use of an antifriction ally is imposed an alloy of the type Sn-Sb-Cu, which possesses a high adherence to the steel stand and a high durability in exploitation. For this reason we use the microalloying of the antifriction alloy with cadmium. The microalloying with Cd of antifriction alloys Sn-Sb-Cu determines an increase of the adhesion property of the antifriction alloy on the steel stand. The steel stand is previously subjected to a process of degreasing with ZnCl2 and washing so that is can later be subjected to a thermal-chemical treatment of tinning.

Microstructure and mechanical properties of Cu-Ni-Si alloys

International Nuclear Information System (INIS)

Monzen, Ryoichi; Watanabe, Chihiro

2008-01-01

The microstructure and mechanical properties of 0.1 wt.% Mg-added and Mg-free Cu-2.0 wt.% Ni-0.5 wt.% Si alloys aged at 400 deg. C have been examined. The addition of Mg promotes the formation of disk-shaped Ni 2 Si precipitates. The Cu-Ni-Si-Mg alloy exhibits higher strength and resistance to stress relaxation than the Cu-Ni-Si alloy. The higher strength or stress relaxation resistance is attributable to the reduction in inter-precipitate spacing by the Mg addition or the drag effect of Mg atoms on dislocation motion. The Cu-Ni-Si alloy with a large grain size of 150 μm shows higher stress relaxation resistance than the alloy with a small grain size of 10 μm because of a lower density of mobile dislocations in the former alloy

Microstructure and mechanical properties of Cu-Ni-Si alloys

Energy Technology Data Exchange (ETDEWEB)

Monzen, Ryoichi [Division of Innovative Technology and Science, Graduate School of Natural Science and Technology, Kanzawa University, Kakuma-machi, Kanazawa 920-1192 (Japan)], E-mail: monzen@t.kanazawa-u.ac.jp; Watanabe, Chihiro [Division of Innovative Technology and Science, Graduate School of Natural Science and Technology, Kanzawa University, Kakuma-machi, Kanazawa 920-1192 (Japan)

2008-06-15

The microstructure and mechanical properties of 0.1 wt.% Mg-added and Mg-free Cu-2.0 wt.% Ni-0.5 wt.% Si alloys aged at 400 deg. C have been examined. The addition of Mg promotes the formation of disk-shaped Ni{sub 2}Si precipitates. The Cu-Ni-Si-Mg alloy exhibits higher strength and resistance to stress relaxation than the Cu-Ni-Si alloy. The higher strength or stress relaxation resistance is attributable to the reduction in inter-precipitate spacing by the Mg addition or the drag effect of Mg atoms on dislocation motion. The Cu-Ni-Si alloy with a large grain size of 150 {mu}m shows higher stress relaxation resistance than the alloy with a small grain size of 10 {mu}m because of a lower density of mobile dislocations in the former alloy.

Study of the magnetic anisotropy in Ni/Cu and Ni/glass thin films

International Nuclear Information System (INIS)

Cherif, S.-M.; Layadi, A.; Ben Youssef, J.; Nacereddine, C.; Roussigne, Y.

2007-01-01

The magnetic properties of evaporated Ni/Cu and Ni/glass thin films have been investigated by means of the vibrating sample magnetometer (VSM), the Brillouin light scattering (BLS) and magnetic force microscopy (MFM). The Ni thickness, t, ranges from 31 to 165 nm. The second- and fourth-order magnetic anisotropy constants, K 1 and K 2 , have been included; for the Ni/Cu series, K 1 was found to decrease from 1.0x10 6 to 0.18x10 6 erg/cm 3 as t increases from 31 to 165 nm, while K 2 increased from 0.24x10 6 to 0.8x10 6 erg/cm 3 . Over all the thickness range, the magnetization easy axis is in plane. For thinner films, there is a good agreement between anisotropy constant values inferred from VSM and BLS. Stripe domains were observed for t≥165 nm in Ni/glass and t≥90 nm in Ni/Cu

Effect of Sn addition on the corrosion behavior of Ti-7Cu-Sn cast alloys for biomedical applications.

Science.gov (United States)

Tsao, L C

2015-01-01

The aim of this study was to investigate the effects of Sn content on the microstructure and corrosion resistance of Ti7CuXSn (x=0-5 wt.%) samples. The corrosion tests were carried out in 0.9 wt.% NaCl solution at 25 °C. The electrochemical corrosion behavior of the Ti7CuXSn alloy samples was evaluated using potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS), and equivalent circuit analysis. The resulting impedance parameters and polarization curves showed that adding Sn improved the electrochemical corrosion behavior of the Ti7CuXSn alloy. The Ti7CuXSn alloy samples were composed of a dual-layer oxide consisting of an inner barrier layer and an outer porous layer. Copyright © 2014 Elsevier B.V. All rights reserved.

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

DEFF Research Database (Denmark)

Sopousek, J.; Palcut, Marián; Hodúlová, Erika

2010-01-01

The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...... to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry...

Phase transformation and morphology of the intermetallic compounds formed at the Sn-9Zn-3.5Ag/Cu interface in aging

International Nuclear Information System (INIS)

Hon, M.-H.; Chang, T.-C.; Wang, M.-C.

2008-01-01

The morphology and phase transformation of the intermetallic compounds (IMCs) formed at the Sn-9Zn-3.5Ag/Cu interface in a solid-state reaction have been investigated by X-ray diffraction (XRD), transmission electron microscopy (TEM), electron diffraction (ED), scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS). The monoclinic η'-Cu 6 Sn 5 transforms to the hexagonal η-Cu 6 Sn 5 and the orthorhombic Cu 5 Zn 8 transforms to the body-centered cubic (bcc) γ-Cu 5 Zn 8 as aged at 180 deg. C. The scallop-shaped Cu 6 Sn 5 layer is retained after aging at 180 deg. C for 1000 h. In the solid-state reaction, Ag is repelled from η'-Cu 6 Sn 5 and reacts with Sn to form Ag 3 Sn, and the Cu 5 Zn 8 layer decomposes. Kirkendall voids are not observed at the Sn-9Zn-3.5Ag/Cu interface even after aging at 180 deg. C for 1000 h

Spin dynamics of the Kondo insulator CeNiSn approaching the metallic phase

DEFF Research Database (Denmark)

Schröder, A.; Aeppli, G.; Mason, T.E.

1997-01-01

The spin dynamics of Kondo insulators has been studied by high-resolution magnetic neutron spectroscopy at a triple-axes spectrometer on CeNi1-xCuxSn single crystals using a vertical 9 T magnet. While upon doping (x = 0.13) the spin gap of the Kondo insulator CeNiSn collapses at the transition to...

Promising Cu-Ni-Cr-Si alloy for first wall ITER applications

International Nuclear Information System (INIS)

Ivanov, A.; Abramov, V.; Rodin, M.

1996-01-01

Precipitation-hardened Cu-Ni-Cr-Si alloy, a promising material for ITER applications, is considered. Available commercial products, chemical composition, physical and mechanical properties are presented. Embrittlement of Cu-Ni-Cr-Si alloy at 250-300 C is observed. Mechanical properties of Cu-Ni-Cr-Si alloy neutron irradiated to a dose of ∝0.2 dpa at 293 C are investigated. Embrittlement of Cu-Ni-Cr-Si alloy can be avoided by annealing. (orig.)

Mechanical properties of highly textured Cu/Ni multilayers

International Nuclear Information System (INIS)

Liu, Y.; Bufford, D.; Wang, H.; Sun, C.; Zhang, X.

2011-01-01

We report on the synthesis of highly (1 1 1) and (1 0 0) textured Cu/Ni multilayers with individual layer thicknesses, h, varying from 1 to 200 nm. When, h, decreases to 5 nm or less, X-ray diffraction spectra show epitaxial growth of Cu/Ni multilayers. High resolution transmission electron microscopy studies show the coexistence of nanotwins and coherent layer interfaces in highly (1 1 1) textured Cu/Ni multilayers with smaller h. Hardnesses of multilayer films increase with decreasing h, approach a maximum at h of a few nanometers, and show softening thereafter at smaller h. The influence of layer interfaces as well as twin interfaces on strengthening mechanisms of multilayers and the formation of twins in Ni in multilayers are discussed.

Segregation and microstructure evolution in chill cast and directionally solidified Ni-Mn-Sn metamagnetic shape memory alloys

Science.gov (United States)

Czaja, P.; Wierzbicka-Miernik, A.; Rogal, Ł.

2018-06-01

A multiphase solidification behaviour is confirmed for a range of Ni-rich and Ni-deficient Ni-Mn-Sn induction cast and directionally solidified (Bridgman) alloys. The composition variation is primarily linked to the changing Mn/Sn ratio, whereas the content of Ni remains largely stable. The partitioning coefficients for the Ni50Mn37Sn13 and Ni46Mn41.5Sn12.5 Bridgman alloys were obtained according to the Scheil equation based on the composition distribution along the longitudinal cross section of the ingots. Homogenization heat treatment performed for 72 h at 1220 K turned out sufficient for ensuring chemical uniformity on the macro- and microscale. It is owed to a limited segregation length scale due to slow cooling rates adopted for the directional solidification process.

Electrolytically exfoliated graphene-loaded flame-made Ni-doped SnO2 composite film for acetone sensing.

Science.gov (United States)

Singkammo, Suparat; Wisitsoraat, Anurat; Sriprachuabwong, Chakrit; Tuantranont, Adisorn; Phanichphant, Sukon; Liewhiran, Chaikarn

2015-02-11

In this work, flame-spray-made SnO2 nanoparticles are systematically studied by doping with 0.1-2 wt % nickel (Ni) and loading with 0.1-5 wt % electrolytically exfoliated graphene for acetone-sensing applications. The sensing films (∼12-18 μm in thickness) were prepared by a spin-coating technique on Au/Al2O3 substrates and evaluated for acetone-sensing performances at operating temperatures ranging from 150 to 350 °C in dry air. Characterizations by X-ray diffraction, transmission/scanning electron microscopy, Brunauer-Emmett-Teller analysis, X-ray photoelectron spectroscopy and Raman spectroscopy demonstrated that Ni-doped SnO2 nanostructures had a spheriodal morphology with a polycrystalline tetragonal SnO2 phase, and Ni was confirmed to form a solid solution with SnO2 lattice while graphene in the sensing film after annealing and testing still retained its high-quality nonoxidized form. Gas-sensing results showed that SnO2 sensing film with 0.1 wt % Ni-doping concentration exhibited an optimal response of 54.2 and a short response time of ∼13 s toward 200 ppm acetone at an optimal operating temperature of 350 °C. The additional loading of graphene at 5 wt % into 0.1 wt % Ni-doped SnO2 led to a drastic response enhancement to 169.7 with a very short response time of ∼5.4 s at 200 ppm acetone and 350 °C. The superior gas sensing performances of Ni-doped SnO2 nanoparticles loaded with graphene may be attributed to the large specific surface area of the composite structure, specifically the high interaction rate between acetone vapor and graphene-Ni-doped SnO2 nanoparticles interfaces and high electronic conductivity of graphene. Therefore, the 5 wt % graphene loaded 0.1 wt % Ni-doped SnO2 sensor is a promising candidate for fast, sensitive and selective detection of acetone.

First-principles calculations of vacancy formation in In-free photovoltaic semiconductor Cu2ZnSnSe4

International Nuclear Information System (INIS)

Maeda, Tsuyoshi; Nakamura, Satoshi; Wada, Takahiro

2011-01-01

To quantitatively evaluate the formation energies of Cu, Zn, Sn, and Se vacancies in kesterite-type Cu 2 ZnSnSe 4 (CZTSe), first-principles pseudopotential calculations using plane-wave basis functions were performed. The formation energies of neutral Cu, Zn, Sn and Se vacancies were calculated as a function of the atomic chemical potentials of constituent elements. The obtained results were as follows: (1) the formation energy of Cu vacancy was generally smaller than those of the other Zn, Sn and Se vacancies, (2) under the Cu-poor and Zn-rich condition, the formation energy of Cu vacancy was particularly low, (3) the formation energy of Zn vacancy greatly depended on the chemical potentials of the constituent elements and under the Zn-poor and Se-rich condition, the formation energy of Zn vacancy was smaller than that of Cu vacancy, and (4) the formation energy of Sn vacancy did not greatly depend on the chemical potentials of the constituent elements and was much larger than those of Cu, Zn, and Se vacancies. These results indicate that Cu vacancy is easily formed under Cu-poor and Zn-rich conditions, but Zn vacancy is easily formed under the Zn-poor and Se-rich conditions.

Study of substitution in the systems UNi5sub(-)sub(x)Msub(x) and ZrNi5sub(-)sub(x)Msub(x) (M = In, Sn, Zn)

International Nuclear Information System (INIS)

Blazina, Z.; Drasner, A.; Ban, Z.; Zagreb Univ.

1981-01-01

X-ray powder diffraction studies and metallographic examinations in the systems UNi 5 sub(-)sub(x)Msub(x) and ZrNi 5 sub(-)sub(x)Msub(x) (M = In, Sn, Zn) revealed the existence of single phase regions up to the composition 1 : 4 : 1, i.e. up to UNi 4 M and ZrNi 4 M, respectively. Comparison between calculated and observed intensity values showed that nickel atoms, in the crystallographic positions 4(c) of the isostructural binary compounds UNi 5 or ZrNi 5 (UNi 5 -type, S.G. F43m), are substituted by M atoms. Vegard's rule is obeyed in the single phase regions of all investigated systems. The crystal structures of UNi 4 M and ZrNi 4 M are superlattice structures of the MgSnCu 4 -type (S.G. F43m). Structural correlations of these phases with corresponding binary prototypes are made in terms of stacking sequences. (orig.)

Synthesis and characterization of Pt-Sn-Ni alloys to application as catalysts for direct ethanol fuel cells; Sintese e caracterizacao de ligas de Pt-Sn-Ni para aplicacao como caztalisadores em celulas a combustivel do tipo DEFC

Energy Technology Data Exchange (ETDEWEB)

Silva, E.L. da; Correa, P.S.; Oliveira, E.L. de; Takimi, A.S.; Malfatti, C.F., E-mail: celia.malfatti@ufrgs.b [Universidade Federal do Rio Grande do Sul (LAPEC/UFRGS), Porto Alegre, RS (Brazil). Programa de Pos-Graduacao em Engenharia Mecanica. Lab. de Pesquisa em Corrosao; Radtke, C. [Universidade Federal do Rio Grande do Sul (IQ/UFRGS), Porto Alegre, RS (Brazil). Inst. de Quimica

2010-07-01

Direct ethanol fuel cells (DEFCs) have been the focus of recent research due its application in mobile energy sources. In order to obtain the maximum efficiency from these systems, it is necessary the total ethanol oxidation, which implies in C-C bond break. Different catalysts described in literature are employed with this intent. This work consists in studying PtSnNi catalysts supported on carbon Vulcan XC72R, to application in DEFCs. Thus, it was used the impregnation/reduction method, varying the atomic proportion among Pt, Sn and Ni. The alloys were characterized by X-Ray Diffraction, Cyclic Voltammetry and Transmission Microscopy. Preliminary results show that predominant structure on the catalysts is the face centered cubic platinum and the densities currents are dependent on the platinum amount. (author)

Ultrafast one-step combustion synthesis and thermoelectric properties of In-doped Cu{sub 2}SnSe{sub 3}

Energy Technology Data Exchange (ETDEWEB)

Li, Yuyang [Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 (China); University of Chinese Academy of Sciences, Beijing, 100049 (China); Liu, Guanghua, E-mail: liugh02@163.com [Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 (China); Li, Jiangtao, E-mail: lijiangtao@mail.ipc.ac.cn [Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 (China); Chen, Kexin [State Key Laboratory of New Ceramics & Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing, 100084 (China); He, Gang; Yang, Zengchao; Han, Yemao; Zhou, Min; Li, Laifeng [Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 (China)

2016-07-01

Bulk In-doped Cu{sub 2}SnSe{sub 3} samples were prepared by a fast and one-step method of high-gravity combustion synthesis. All the synthesized samples were dense with relative densities of >98%. The influence of Indium-doping on the phase composition of the samples was investigated. SEM and EDS measurements confirm the existence of SnSe and Cu{sub 2}Se as secondary phase in the Cu{sub 2}Sn{sub 1−x}In{sub x}Se{sub 3} samples. In addition, the experimental results show that there is a solubility limit of indium in the Cu{sub 2}SnSe{sub 3} matrix. The thermoelectric properties of the samples were measured in a temperature range from 323 K to 773 K, and the Cu{sub 2}Sn{sub 0.8}In{sub 0.2}Se{sub 3} sample achieved a maximum ZT of 0.65 at 773 K, which was comparable with the best-reported result for Cu{sub 2}SnSe{sub 3} materials prepared by conventional sintering approaches. With much reduced time and energy consumption, high-gravity combustion synthesis may offer a more efficient and economical way for producing thermoelectric materials. - Highlights: • Dense bulk Cu{sub 2}SnSe{sub 3} materials are prepared by one-step combustion synthesis. • The solubility limit of Indium into the Cu{sub 2}SnSe{sub 3} matrix has been discussed. • A maximum ZT of 0.65 is obtained for the Cu{sub 2}Sn{sub 1−x}In{sub x}Se{sub 3} (x = 0.2) at 773 K.

Stress-strain effects in alumina-Cu reinforced Nb3Sn wires fabricated by the tube process

International Nuclear Information System (INIS)

Murase, Satoru; Nakayama, Shigeo; Masegi, Tamaki; Koyanagi, Kei; Nomura, Shunji; Shiga, Noriyuki; Kobayashi, Norio; Watanabe, Kazuo.

1997-01-01

In order to fabricate a large-bore, high-field magnet which achieves a low coil weight and volume, a high strength compound superconducting wire is required. For those demands we have developed the reinforced Nb 3 Sn wire using alumina dispersion strengthened copper (alumina-Cu) as a reinforcement material and the tube process of the Nb 3 Sn wire fabrication. The ductility study of the composites which consisted of the reinforcement, Nb tube, Cu, and Cu clad Sn brought a 1 km long alumina-Cu reinforced Nb 3 Sn wire successfully. Using fabricated wires measurements and evaluations of critical current density as parameters of magnetic field, tensile stress, tensile strain, and transverse compressive stress, and those of stress-strain curves at 4.2 K were performed. They showed superior performance such as high 0.3% proof stress (240 MPa at 0.3% strain) and high maximum tolerance stress (320 MPa) which were two times as large as those of conventional Cu matrix Nb 3 Sn wire. The strain sensitivity parameters were obtained for the reinforced Nb 3 Sn wire and the Cu matrix one using the scaling law. Residual stress of the component materials caused by cooling down to 4.2 K from heat-treatment temperature was calculated using equivalent Young's modulus, equivalent yield strength, thermal expansion coefficient and other mechanical parameters. Calculated stress-strain curves at 4.2 K for the reinforced Nb 3 Sn wire and the Cu matrix one based on calculation of residual stress, had good agreement with the experimental values. (author)

Electrodeposition mechanism of quaternary compounds Cu2ZnSnS4: Effect of the additives

Science.gov (United States)

Tang, Aiyue; Li, Zhilin; Wang, Feng; Dou, Meiling; Liu, Jingjun; Ji, Jing; Song, Ye

2018-01-01

The electrodeposition mechanism of pure phase Cu2ZnSnS4 (CZTS) thin film with subsequent annealing was investigated in detail. An electrolyte design principle of quaternary compounds was proposed. The complex ions of Cu(H2C6H5O7)+, Cu2(C6H5O7)+, Zn(C4H5O6)+, Sn(H2C6H5O7)+ and Sn2(C6H5O7)+, which influenced the reduction process and played important roles in co-deposition, were identified by UV spectra. Electrochemical studies indicated that trisodium citrate and tartaric acid could narrow the co-deposition potential range of the four elements to -0.8 V to -1.2 V (vs. SCE). The cause was the synergetic effect that trisodium citrate inhibited the reduction of Cu2+ and Sn2+ and tartaric acid promoted the reduction of Zn2+. The reduction of S2O32- was mainly attributed to the induction effect of the metallic ions, and the H+ dissociated from tartaric acid could also promote the cathode process of S2O32-. The reaction mechanism could be summarized as the following steps: (I) Cu(H2C6H5O7)+, Cu2(C6H5O7)+ → Cu, Sn(H2C6H5O7)+, Sn2(C6H5O7)+ → Sn, Zn(C4H5O6)+ → Zn; (II) the desorption of (H2C6H5O7)- and (C6H5O7)-, and the reduction of S2O32- induced by metallic ions and H+. The mechanism studies provided a path of electrolyte design for multicomponent compounds.

Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys

Directory of Open Access Journals (Sweden)

Kopyto M.

2009-01-01

Full Text Available The electromotive force measurement method was employed to determine the thermodynamic properties of liquid Bi-Cu-Sn alloys using solid electrolyte galvanic cells as shown below: Kanthal+Re, Bi-Cu-Sn, SnO2 | Yttria Stabilized Zirconia | air, Pt, Po2=0.2:1 atm Measurements were carried out for three cross-sections with constant Bi/Cu ratio equal to: 1/3, 1 and 3 and for various tin content varying every 10%, resulting in a total of 26 different alloy compositions. The temperature of the measurements varied within the range from 973 to 1325 K. A linear dependence of the e.m.f. on temperature was observed for all alloy compositions and the appropriate line equations were derived. Tin activities were calculated as function of composition and temperature. Results were presented in tables and figures.

Structural and optical properties of Cu2ZnSnS4 thin film absorbers from ZnS and Cu3SnS4 nanoparticle precursors

International Nuclear Information System (INIS)

Lin, Xianzhong; Kavalakkatt, Jaison; Kornhuber, Kai; Levcenko, Sergiu; Lux-Steiner, Martha Ch.; Ennaoui, Ahmed

2013-01-01

Cu 2 ZnSnS 4 (CZTS) has been considered as an alternative absorber layer to Cu(In,Ga)Se 2 due to its earth abundant and environmentally friendly constituents, optimal direct band gap of 1.4–1.6 eV and high absorption coefficient in the visible range. In this work, we propose a solution-based chemical route for the preparation of CZTS thin film absorbers by spin coating of the precursor inks composed of Cu 3 SnS 4 and ZnS NPs and annealing in Ar/H 2 S atmosphere. X-ray diffraction and Raman spectroscopy were used to characterize the structural properties. The chemical composition was determined by energy dispersive X-ray spectroscopy. Optical properties of the CZTS thin film absorbers were studied by transmission, reflection and photoluminescence spectroscopy

Phase transitions and thermal expansion in Ni51- x Mn36 + x Sn13 alloys

Science.gov (United States)

Kaletina, Yu. V.; Gerasimov, E. G.; Kazantsev, V. A.; Kaletin, A. Yu.

2017-10-01

Thermal expansion and structural and magnetic phase transitions in alloys of the Ni-Mn-Sn system have been investigated. The spontaneous martensitic transformation in Ni51-xMn36 + xSn13 (0 ≤ x ≤ 3) alloys is found to be accompanied by high jumps in the temperature dependences of the linear thermal expansion. The relative change in the linear sizes of these alloys at the martensitic transformation is 1.5 × 10-3. There are no anomalies in the magnetic-ordering temperature range in the temperature dependences of the coefficient of linear thermal expansion. The differences in the behavior of linear thermal expansion at the martensitic transformation in Ni51-xMn36 + xSn13 (0 ≤ x ≤ 3) and Ni47Mn40Sn13( x = 4) alloys have been established.

Fabrication of a Cu/Ni stack in supercritical carbon dioxide at low-temperature

Energy Technology Data Exchange (ETDEWEB)

Rasadujjaman, Md, E-mail: rasadphy@duet.ac.bd [Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511 (Japan); Department of Physics, Dhaka University of Engineering & Technology, Gazipur 1700 (Bangladesh); Watanabe, Mitsuhiro [Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511 (Japan); Sudoh, Hiroshi; Machida, Hideaki [Gas-Phase Growth Ltd., 2-24-16 Naka, Koganei, Tokyo 184-0012 (Japan); Kondoh, Eiichi [Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511 (Japan)

2015-09-30

We report the low-temperature deposition of Cu on a Ni-lined substrate in supercritical carbon dioxide. A novel Cu(I) amidinate precursor was used to reduce the deposition temperature. From the temperature dependence of the growth rate, the activation energy for Cu growth on the Ni film was determined to be 0.19 eV. The films and interfaces were characterized by Auger electron spectroscopy. At low temperature (140 °C), we successfully deposited a Cu/Ni stack with a sharp Cu/Ni interface. The stack had a high adhesion strength (> 1000 mN) according to microscratch testing. The high adhesion strength originated from strong interfacial bonding between the Cu and the Ni. However, at a higher temperature (240 °C), significant interdiffusion was observed and the adhesion became weak. - Highlights: • Cu/Ni stack fabricated in supercritical CO{sub 2} at low temperature. • A novel Cu(I) amidinate precursor was used to reduce the deposition temperature. • Adhesion strength of Cu/Ni stack improved dramatically. • Fabricated Cu/Ni stack is suitable for Cu interconnections in microelectronics.

Soft magnetic properties of hybrid ferromagnetic films with CoFe, NiFe, and NiFeCuMo layers

Energy Technology Data Exchange (ETDEWEB)

Choi, Jong-Gu [Eastern-western Biomedical Engineering, Sangji University, Wonju 220-702 (Korea, Republic of); Hwang, Do-Guwn [Dept. of Oriental Biomedical Engineering, Sangji University, Wonju 220-702 (Korea, Republic of); Rhee, Jang-Roh [Dept. of Physics, Sookmyung Women' s University, Seoul 140-742 (Korea, Republic of); Lee, Sang-Suk, E-mail: sslee@sangji.ac.kr [Dept. of Oriental Biomedical Engineering, Sangji University, Wonju 220-702 (Korea, Republic of)

2011-09-30

Two-layered ferromagnetic alloy films (NiFe and CoFe) with intermediate NiFeCuMo soft magnetic layers of different thicknesses were investigated to understand the relationship between coercivity and magnetization process by taking into account the strength of hard-axis saturation field. The thickness dependence of H{sub EC} (easy-axis coercivity), H{sub HS} (hard-axis saturation field), and {chi} (susceptibility) of the NiFeCuMo thin films in glass/Ta(5 nm)/[CoFe or NiFe(5 nm-t/2)]/NiFeCuMo(t = 0, 4, 6, 8, 10 nm)/[CoFe or NiFe(5 nm-t/2)]/Ta(5 nm) films prepared using the ion beam deposition method was determined. The magnetic properties (H{sub EC}, H{sub HS}, and {chi}) of the ferromagnetic CoFe, NiFe three-layers with an intermediate NiFeCuMo super-soft magnetic layer were strongly dependent on the thickness of the NiFeCuMo layer.

Giant magnetoimpedance effect in sputtered single layered NiFe film and meander NiFe/Cu/NiFe film

International Nuclear Information System (INIS)

Chen, L.; Zhou, Y.; Lei, C.; Zhou, Z.M.; Ding, W.

2010-01-01

Giant magnetoimpedance (GMI) effect on NiFe thin film is very promising due to its application in developing the magnetic field sensors with highly sensitivity and low cost. In this paper, the single layered NiFe thin film and NiFe/Cu/NiFe thin film with a meander structure are prepared by the MEMS technology. The influences of sputtering parameters, film structure and conductor layer width on GMI effect in NiFe single layer and meander NiFe/Cu/NiFe film are investigated. Maximum of the GMI ratio in single layer and sandwich film is 5% and 64%, respectively. The results obtained are useful for developing the high-performance magnetic sensors based on NiFe thin film.

Phase transformation and morphology of the intermetallic compounds formed at the Sn-9Zn-3.5Ag/Cu interface in aging

Energy Technology Data Exchange (ETDEWEB)

Hon, M.-H. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Chang, T.-C. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Electronic and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Bldg. 11, 195, Sec. 4, Chung-Hsing Road, Chutung, Hsinchu, 310, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shi-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw

2008-06-30

The morphology and phase transformation of the intermetallic compounds (IMCs) formed at the Sn-9Zn-3.5Ag/Cu interface in a solid-state reaction have been investigated by X-ray diffraction (XRD), transmission electron microscopy (TEM), electron diffraction (ED), scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS). The monoclinic {eta}'-Cu{sub 6}Sn{sub 5} transforms to the hexagonal {eta}-Cu{sub 6}Sn{sub 5} and the orthorhombic Cu{sub 5}Zn{sub 8} transforms to the body-centered cubic (bcc) {gamma}-Cu{sub 5}Zn{sub 8} as aged at 180 deg. C. The scallop-shaped Cu{sub 6}Sn{sub 5} layer is retained after aging at 180 deg. C for 1000 h. In the solid-state reaction, Ag is repelled from {eta}'-Cu{sub 6}Sn{sub 5} and reacts with Sn to form Ag{sub 3}Sn, and the Cu{sub 5}Zn{sub 8} layer decomposes. Kirkendall voids are not observed at the Sn-9Zn-3.5Ag/Cu interface even after aging at 180 deg. C for 1000 h.

Cu-Nb3Sn superconducting wires prepared by ''Copper Liquid Phase Sintering method'' using the Nb-H

International Nuclear Information System (INIS)

Resende, A.T. de.

1985-01-01

Cu-30% Nb in weighting were prepared by the method of Copper sintering liquid phase the method was improved by substitution of Nb power by Nb-H powder, obtaining a high density material with good mechanical properties, which was reduced to fine. Wire, Without heat treatment. The Cu-Nb 3 Sn wires were obtained by external diffusion process depositing tin in the Cu-30%Nb wires, and by internal diffusion process using the Sn-8.5% Cu in weighting, which was reduced to rods of 3.5 mm. These Cu-30%Nb rods were enclosed in copper tubes and deformed mechanically by rotary swaging and drawing. During the drawing step some wires were fractured, that were analysed and correlated with the microstructure of the Sn-8.5 Wt% Cu alloy. External and internal diffusion samples; after a fast thermal treatment for Sn diffusion, were submited to the temperature of 700 0 C to provide the reaction between Sn and Nb, leading to the Nb 3 Sn phase. Samples with several reaction times, and its influence on T c and J c critical parameters and normal resistivity were prepared and analysed. (author) [pt

Microstructural characterization of alloys of the quasibinary Cu-NiBe system

Energy Technology Data Exchange (ETDEWEB)

Spaic, S.; Markoli, B. [Univ. of Ljubljana, Faculty of Natural Science and Engineering, Ljubljana (Slovenia)

2003-08-01

Alloys of the quasibinary section Cu-NiBe were experimentally investigated with differential thermal analysis, optical microscopy, electron microanalysis, transmission electron microscopy and X-ray diffraction. The construction of the quasibinary Cu-NiBe phase diagram was made based on the experimental results. The constitution of alloys of the whole section was studied along with the investigation of the microstructure and crystallographic relationship of the NiBe phase in aged alloys from the Cu-rich corner of the Cu-NiBe system. (orig.)

Ternary semiconductors NiZrSn and CoZrBi with half-Heusler structure: A first-principles study

Science.gov (United States)

Fiedler, Gregor; Kratzer, Peter

2016-08-01

The ternary semiconductors NiZrSn and CoZrBi with C 1b crystal structure are introduced by calculating their basic structural, electronic, and phononic properties using density functional theory. Both the gradient-corrected PBE functional and the hybrid functional HSE06 are employed. While NiZrSn is found to be a small-band-gap semiconductor (Eg=0.46 eV in PBE and 0.60 eV in HSE06), CoZrBi has a band gap of 1.01 eV in PBE (1.34 eV in HSE06). Moreover, effective masses and deformation potentials are reported. In both materials A B C , the intrinsic point defects introduced by species A (Ni or Co) are calculated. The Co-induced defects in CoZrBi are found to have a higher formation energy compared to Ni-induced defects in NiZrSn. The interstitial Ni atom (Nii) as well as the VNiNii complex introduce defect states in the band gap, whereas the Ni vacancy (VNi) only reduces the size of the band gap. While Nii is electrically active and may act as a donor, the other two types of defects may compensate extrinsic doping. In CoZrBi, only the VCoCoi complex introduces a defect state in the band gap. Motivated by the reported use of NiZrSn for thermoelectric applications, the Seebeck coefficient of both materials, both in the p -type and the n -type regimes, is calculated. We find that CoZrBi displays a rather large thermopower of up to 500 μ V /K when p doped, whereas NiZrSn possesses its maximum thermopower in the n -type regime. The reported difficulties in achieving p -type doping in NiZrSn could be rationalized by the unintended formation of Nii2 + in conjunction with extrinsic acceptors, resulting in their compensation. Moreover, it is found that all types of defects considered, when present in concentrations as large as 3%, tend to reduce the thermopower compared to ideal bulk crystals at T =600 K. For NiZrSn, the calculated thermodynamic data suggest that additional Ni impurities could be removed by annealing, leading to precipitation of a metallic Ni2ZrSn phase.

Metal organic frameworks-derived sensing material of SnO2/NiO composites for detection of triethylamine

Science.gov (United States)

Bai, Shouli; Liu, Chengyao; Luo, Ruixian; Chen, Aifan

2018-04-01

The SnO2/NiO composites were synthesized by hydrothermal followed by calcination using metal-organic framework (MOF) consisting of the ligand of p-benzene-dicarboxylic acid (PTA) and the Sn and Ni center ions as sacrificial templates. The structure and morphology of Sn/Ni-based MOF and SnO2/NiO composites were characterized by XRD, SEM, TEM, FT-IR, TG, XPS and Brunauer-Emmett-Teller analysis. Sensing experiments reveal that the SnO2/NiO composite with the molar ratio of 9:1 not only exhibits the highest response of 14.03 that is 3 times higher than pristine SnO2 to triethylamine at 70 °C, but also shows good selectivity. Such excellent performance is attributed to the MOF-driven strategy and the formation of p-n heterojunctions, because the metal ions can be highly dispersed and separated in the MOFs and can prevent the metal ions aggregation during the MOF decomposition process. The work is a novel route for synthesis of gas sensing material.

Study of the magnetic anisotropy in Ni/Cu and Ni/glass thin films

Energy Technology Data Exchange (ETDEWEB)

Cherif, S.-M. [Laboratoire PMTM, Institut Galilee, Univeriste Paris 13, Villetaneuse, 93340 (France); Layadi, A. [Departement de Physique, Universite Ferhat Abbas, Setif 19000 (Algeria)]. E-mail: a_layadi@yahoo.fr; Ben Youssef, J. [Laboratoire de Magnetisme de Bretagne, U.B.O., Brest 29238 (France); Nacereddine, C. [Departement de Physique, Universite Ferhat Abbas, Setif 19000 (Algeria); Roussigne, Y. [Laboratoire PMTM, Institut Galilee, Univeriste Paris 13, Villetaneuse, 93340 (France)

2007-01-01

The magnetic properties of evaporated Ni/Cu and Ni/glass thin films have been investigated by means of the vibrating sample magnetometer (VSM), the Brillouin light scattering (BLS) and magnetic force microscopy (MFM). The Ni thickness, t, ranges from 31 to 165 nm. The second- and fourth-order magnetic anisotropy constants, K {sub 1} and K {sub 2}, have been included; for the Ni/Cu series, K {sub 1} was found to decrease from 1.0x10{sup 6} to 0.18x10{sup 6} erg/cm{sup 3} as t increases from 31 to 165 nm, while K {sub 2} increased from 0.24x10{sup 6} to 0.8x10{sup 6} erg/cm{sup 3}. Over all the thickness range, the magnetization easy axis is in plane. For thinner films, there is a good agreement between anisotropy constant values inferred from VSM and BLS. Stripe domains were observed for t{>=}165 nm in Ni/glass and t{>=}90 nm in Ni/Cu.

Catalytic Hydrogenation of Levulinic Acid in Water into g-Valerolactone over Bulk Structure of Inexpensive Intermetallic Ni-Sn Alloy Catalysts

Directory of Open Access Journals (Sweden)

Rodiansono Rodiansono

2015-07-01

Full Text Available A bulk structure of inexpensive intermetallic nickel-tin (Ni-Sn alloys catalysts demonstrated highly selective in the hydrogenation of levulinic acid in water into g-valerolactone. The intermetallic Ni-Sn catalysts were synthesized via a very simple thermochemical method from non-organometallic precursor at low temperature followed by hydrogen treatment at 673 K for 90 min. The molar ratio of nickel salt and tin salt was varied to obtain the corresponding Ni/Sn ratio of 4.0, 3.0, 2.0, 1.5, and 0.75. The formation of Ni-Sn alloy species was mainly depended on the composition and temperature of H2 treatment. Intermetallics Ni-Sn that contain Ni3Sn, Ni3Sn2, and Ni3Sn4 alloy phases are known to be effective heterogeneous catalysts for levulinic acid hydrogenation giving very excellence g-valerolactone yield of >99% at 433 K, initial H2 pressure of 4.0 MPa within 6 h. The effective hydrogenation was obtained in H2O without the formation of by-product. Intermetallic Ni-Sn(1.5 that contains Ni3Sn2 alloy species demonstrated very stable and reusable catalyst without any significant loss of its selectivity. © 2015 BCREC UNDIP. All rights reserved. Received: 26th February 2015; Revised: 16th April 2015; Accepted: 22nd April 2015  How to Cite: Rodiansono, R., Astuti, M.D., Ghofur, A., Sembiring, K.C. (2015. Catalytic Hydrogenation of Levulinic Acid in Water into g-Valerolactone over Bulk Structure of Inexpensive Intermetallic Ni-Sn Alloy Catalysts. Bulletin of Chemical Reaction Engineering & Catalysis, 10 (2: 192-200. (doi:10.9767/bcrec.10.2.8284.192-200Permalink/DOI: http://dx.doi.org/10.9767/bcrec.10.2.8284.192-200  

Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

Directory of Open Access Journals (Sweden)

Hwang Jun Ho

2017-06-01

Full Text Available Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.

Ostwald ripening of decomposed phases in Cu-Ni-Cr alloys

International Nuclear Information System (INIS)

Hernandez-Santiago, Felipe; Lopez-Hirata, Victor; Dorantes-Rosales, Hector J.; Saucedo-Munoz, Maribel L.; Gonzalez-Velazquez, Jorge L.; Paniagua-Mercado, Ana Ma.

2008-01-01

A study of the coarsening process of the decomposed phases was carried out in the Cu-34 wt.% Ni-4 wt.% Cr and Cu-45 wt.% Ni-10 wt.% Cr alloys using transmission electron microscopy. As aging progressed, the morphology of the coherent decomposed Ni-rich phase changed from cuboids to platelets aligned in the Cu-rich matrix directions. Prolonged aging caused the loss of coherency between the decomposed phases and the morphology of the Ni-rich phase changed to ellipsoidal. The variation of mean radius of the coherent decomposed phases with aging time followed the modified LSW theory for thermally activated growth in ternary alloy systems. The linear variation of the density number of precipitates and matrix supersaturation with aging time, also confirmed that the coarsening process followed the modified LSW theory in both alloys. The coarsening rate was faster in the symmetrical Cu-45 wt.% Ni-10 wt.% Cr alloy due to its higher volume fraction of precipitates. The activation energy for thermally activated growth was determined to be about 182 and 102 kJ mol -1 in the Cu-34 wt.% Ni-4 wt.% Cr and Cu-45 wt.% Ni-10 wt.% Cr alloys, respectively. The lower energy for the former alloy seems to be related to an increase in the atomic diffusion process as the chromium content increases. The size distributions of precipitates in the Cu-Ni-Cr alloys were broader and more symmetric than that predicted by the modified LSW theory for ternary alloys

Room-Temperature Synthesis of Thiostannates from {[Ni(tren)]2[Sn2S6]}n.

Science.gov (United States)

Hilbert, Jessica; Näther, Christian; Weihrich, Richard; Bensch, Wolfgang

2016-08-15

The compound {[Ni(tren)]2[Sn2S6]}n (1) (tren = tris(2-aminoethyl)amine, C6H18N4) was successfully applied as source for the room-temperature synthesis of the new thiostannates [Ni(tren)(ma)(H2O)]2[Sn2S6]·4H2O (2) (ma = methylamine, CH5N) and [Ni(tren)(1,2-dap)]2[Sn2S6]·2H2O (3) (1,2-dap = 1,2-diaminopropane, C3H10N2). The Ni-S bonds in the Ni2S2N8 bioctahedron in the structure of 1 are analyzed with density functional theory calculations demonstrating significantly differing Ni-S bond strengths. Because of this asymmetry they are easily broken in the presence of an excess of ma or 1,2-dap immediately followed by Ni-N bond formation to N donor atoms of the amine ligands thus generating [Ni(tren)(amine)](2+) complexes. The chemical reactions are fast, and compounds 2 and 3 are formed within 1 h. The synthesis concept presented here opens hitherto unknown possibilities for preparation of new thiostannates.

Interface band gap narrowing behind open circuit voltage losses in Cu2ZnSnS4 solar cells

DEFF Research Database (Denmark)

Crovetto, Andrea; Palsgaard, Mattias Lau Nøhr; Gunst, Tue

2017-01-01

We present evidence that bandgap narrowing at the heterointerface may be a major cause of the large open circuit voltage deficit of Cu2ZnSnS4/CdS solar cells. Bandgap narrowing is caused by surface states that extend the Cu2ZnSnS4valence band into the forbidden gap. Those surface states...... are consistently found in Cu2ZnSnS4, but not in Cu2ZnSnSe4, by first-principles calculations. They do not simply arise from defects at surfaces but are an intrinsic feature of Cu2ZnSnS4 surfaces. By including those states in a device model, the outcome of previously published temperature-dependent open circuit...... voltage measurements on Cu2ZnSnS4 solar cells can be reproduced quantitatively without necessarily assuming a cliff-like conduction band offset with the CdS buffer layer. Our first-principles calculations indicate that Zn-based alternative buffer layers are advantageous due to the ability of...

"Pistolas para el Niño, Muñecas para la Niña"

OpenAIRE

Gianini Belotti, Elena

2004-01-01

Educere:Una Brizna de Aliento en el Tiempo Rivas, Pedro El Paradigma Reinante y su Paideia Alonso, Leonor La Experiencia Contemporánea como Expresión del Fin de una ÉticaAlgunas Ideas desde la Postmodernidad para Releer el Dato Educativo Perdomo, José Camilo La Sociedad del Conocimiento y el Fin de la Escuela Rodríguez Rojas, Pedro Escuela, Alteridad y Experiencia de SíLa Producción Pedagógica del Sujeto Valera Villegas, G...

Sn buffered by shape memory effect of NiTi alloys as high-performance anodes for lithium ion batteries

International Nuclear Information System (INIS)

Hu Renzong; Zhu Min; Wang Hui; Liu Jiangwen; Liuzhang Ouyang; Zou Jin

2012-01-01

By applying the shape memory effect of the NiTi alloys to buffer the Sn anodes, we demonstrate a simple approach to overcome a long-standing challenge of Sn anode in the applications of Li-ion batteries – the capacity decay. By supporting the Sn anodes with NiTi shape memory alloys, the large volume change of Sn anodes due to lithiation and delithiation can be effectively accommodated, based on the stress-induced martensitic transformation and superelastic recovery of the NiTi matrix respectively, which leads to a decrease in the internal stress and closing of cracks in Sn anodes. Accordingly, stable cycleability (630 mA h g −1 after 100 cycles at 0.7C) and excellent high-rate capabilities (478 mA h g −1 at 6.7C) were attained with the NiTi/Sn/NiTi film electrode. These shape memory alloys can also combine with other high-capacity metallic anodes, such as Si, Sb, Al, and improve their cycle performance.

Split Sn-Cu Alloys on Carbon Nanofibers by One-step Heat Treatment for Long-Lifespan Lithium-Ion Batteries

International Nuclear Information System (INIS)

Shen, Zhen; Hu, Yi; Chen, Renzhong; He, Xia; Chen, Yanli; Shao, Hanfeng; Zhang, Xiangwu; Wu, Keshi

2017-01-01

Highlights: • Spilt Sn–Cu alloys and amorphous CNF anodes are introduced. • Sn–Cu–CNFs were prepared by one-step carbonization-alloying reactions. • The spilt Sn–Cu alloys consist of Cu 6 Sn 5 and Cu 3 Sn. • The coexistence of Cu 6 Sn 5 and Cu 3 Sn led to the enhanced cycle durability. - Abstract: To develop next-generation lithium-ion batteries (LIBs) with novel designs, reconsidering traditional materials with enhanced cycle stability and excellent rate performance is crucial. We herein report the successful preparation of three-dimensional (3D) composites in which spilt Sn–Cu alloys are uniformly dispersed in an amorphous carbon nanofiber matrix (Sn–Cu–CNFs) via one-step carbonization-alloying reactions. The spilt Sn–Cu alloys consist of active Cu 6 Sn 5 and inactive Cu 3 Sn, and are controllable by optimization of the carbonization-alloying reaction temperature. The 3D carbon nanofiber framework allowed the Sn–Cu–CNFs to be used directly as anodes in lithium-ion batteries without the requirement for polymer binders or electrical conductors. These composite electrodes exhibited a stable cyclability with a discharge capacity of 400 mA h g −1 at a high current density of 1.0 A g −1 after 1200 cycles, as well as an excellent rate capability, which could be attributed to the improved electrochemical properties of the Sn–Cu–CNFs provided by the buffering effect of Cu 3 Sn and the 3D carbon nanofiber framework. This one-step synthesis is expected to be widely applicable in the targeted structural design of traditional tin-based anode materials.

Synthesis and characterization of thermally evaporated Cu2SnSe3 ternary semiconductor

Science.gov (United States)

Hamdani, K.; Chaouche, M.; Benabdeslem, M.; Bechiri, L.; Benslim, N.; Amara, A.; Portier, X.; Bououdina, M.; Otmani, A.; Marie, P.

2014-11-01

Copper Tin Selenide (CuSnSe) powder was mechanically alloyed by high energy planetary ball milling, starting from elemental powders. Synthesis time and velocity have been optimized to produce Cu2SnSe3 materials. Thin films were prepared by thermal evaporation on Corning glass substrate at Ts = 300 °C. The structural, compositional, morphological and optical properties of the synthesized semiconductor have been analyzed by X-ray diffraction (XRD), energy dispersive X-ray analysis (EDAX), scanning electron microscopy (SEM) and transmission electron microscopy. The analyzed powder exhibited a cubic crystal structure, with the presence of Cu2Se as a secondary phase. On the other hand, the deposited films showed a cubic Cu2SnSe3 ternary phase and extra peaks belonging to some binary compounds. Furthermore, optical measurements showed that the deposited layers have a relatively high absorption coefficient of 105 cm-1 and present a band gap of 0.94 eV.

The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections

Czech Academy of Sciences Publication Activity Database

Schmetterer, C.; Vízdal, J.; Kroupa, Aleš; Kodentsov, A.; Ipser, H.

2009-01-01

Roč. 38, č. 11 (2009), s. 2275-2300 ISSN 0361-5235 R&D Projects: GA MŠk(CZ) OC08053 Institutional research plan: CEZ:AV0Z20410507 Keywords : lead free solder * phase diagram * Ni-P-Sn Subject RIV: BJ - Thermodynamics Impact factor: 1.428, year: 2009

Kinetic study of the annealing reactions in Cu-Ni-Fe alloys; Estudio cinetico de las reacciones de recocido en aleaciones de Cu-Ni-Fe

Energy Technology Data Exchange (ETDEWEB)

Donoso, E.

2014-07-01

The thermal aging of a Cu-45Ni-4Fe, Cu-34Ni-11Fe and Cu-33Ni-22Fe alloys tempered from 1173 K have been studied from Differential Scanning Calorimetry (DSC) and microhardness measurements. The analysis of DSC curves, from room temperature to 950 K, shows the presence of one exothermic reaction associated to the formation of FeNi{sub 3} phase nucleating from a modulate structure, and one endothermic peak attributed to dissolution of this phase. Kinetic parameters were obtained using the usual Avrami-Erofeev equation, modified Kissinger method and integrated kinetic functions. Microhardness measurements confirmed the formation and dissolution of the FeNi{sub 3} phase. (Author)

Multifilamentary Cu-Nb3Sn superconductor wires

International Nuclear Information System (INIS)

Rodrigues, D.; Pinatti, D.G.

1990-01-01

This paper reports on one of the main technological problems concerning Nb 3 Sn superconducting wires production which is the optimization of heat treatments for the formation of the A-15 intermetallic compound. At the present work, Nb 3 Sn superconducting wire is produced by solid-liquid diffusion method which increases considerably the critical current values of the superconductor. Through this method, niobium, copper and Sn 7% wt Cu alloy are kept in the pure state. Thus, the method dispenses intermediate heat treatments of recrystallization during the manufacturing process of the wire. After the wire was ready, optimization work of heat treatments was accomplished aiming to obtain its best superconducting characteristics, Measurement of critical temperature, critical current versus magnetic field, normal and at room temperature resistivity were performed, as well as scanning electron microscopy for determination of Nb 3 Sn layers and transmission electron microscopy measurements of redetermining the grain sizes in Nb 3 Sn formed in each treatment. It was obtained critical current densities of 1.8 x 10 6 A/cm 2 in the Nb 3 Sn layer, at 10 Teslas and 4.2 K. The samples were analyzed by employing the superconducting collective flux pinning theories and a satisfactory agreement between the experimental and theoretical data was attained. The production process and the small size of the filaments used made a successful optimization of the wire possible

Fabrication of folic acid sensor based on the Cu doped SnO2 nanoparticles modified glassy carbon electrode

International Nuclear Information System (INIS)

Lavanya, N; Radhakrishnan, S; Sudhan, N; Sekar, C; Leonardi, S G; Neri, G; Cannilla, C

2014-01-01

A novel folic acid biosensor has been fabricated using Cu doped SnO 2 nanoparticles (NPs) synthesized by a simple microwave irradiation method. Powder XRD and TEM studies confirmed that both the pure and Cu doped SnO 2 (Cu: 0, 10, 20wt%) crystallized in tetragonal rutile-type structure with spherical morphology. The average crystallite size of pure SnO 2 was estimated to be around 16 nm. Upon doping, the crystallite sizes decreased to 9 nm and 5 nm for 10 and 20wt% Cu doped SnO 2 respectively. XPS studies confirmed the electronic state of Sn and Cu to be 4+ and 2+ respectively. Cu (20wt%) doped SnO 2 NPs are proved to be a good sensing element for the determination of folic acid (FA). Cu-SnO 2 NPs (20wt%) modified glassy carbon electrode (GCE) exhibited the lowest detection limit of 0.024 nM over a wide folic acid concentration range of 1.0 × 10 −10 to 6.7 × 10 −5 M at physiological pH of 7.0. The fabricated sensor is highly selective towards the determination of FA even in the presence of a 100 fold excess of common interferent ascorbic acid. The sensor proved to be useful for the estimation of FA content in pharmaceutical sample with satisfactory recovery. (paper)

Enhanced Oxidation-Resistant Cu@Ni Core-Shell Nanoparticles for Printed Flexible Electrodes.

Science.gov (United States)

Kim, Tae Gon; Park, Hye Jin; Woo, Kyoohee; Jeong, Sunho; Choi, Youngmin; Lee, Su Yeon

2018-01-10

In this work, the fabrication and application of highly conductive, robust, flexible, and oxidation-resistant Cu-Ni core-shell nanoparticle (NP)-based electrodes have been reported. Cu@Ni core-shell NPs with a tunable Ni shell thickness were synthesized by varying the Cu/Ni molar ratios in the precursor solution. Through continuous spray coating and flash photonic sintering without an inert atmosphere, large-area Cu@Ni NP-based conductors were fabricated on various polymer substrates. These NP-based electrodes demonstrate a low sheet resistance of 1.3 Ω sq -1 under an optical energy dose of 1.5 J cm -2 . In addition, they exhibit highly stable sheet resistances (ΔR/R 0 flexible heater fabricated from the Cu@Ni film is demonstrated, which shows uniform heat distribution and stable temperature compared to those of a pure Cu film.

Solution-Based Epitaxial Growth of Magnetically Responsive Cu@Ni Nanowires

KAUST Repository

Zhang, Shengmao; Zeng, Hua Chun

2010-01-01

An experiment was conducted to show the solution-based epitaxial growth of magnetically responsive Cu@Ni nanowires. The Ni-sheathed Cu nanowires were synthesized with a one-pot approach. 30 mL of high concentration NaOH, Cu(NO3)2. 3H2O, Cu(NO3)2. 3H2O and 0.07-0.30 mL of Ni(NO3)2. 6H 2O aqueous solutions were added into a plastic reactor with a capacity of 50.0 mL. A varying amount of ethylenediamine (EDA) and hydrazine were also added sequentially, followed by thorough mixing of all reagents. The dimension, morphology, and chemical composition of the products were examined with scanning electron microscopy with energy dispersive X-ray spectroscopy. The XPS analysis on the as formed Cu nanowires confirms that there is indeed no nickel inclusion in the nanowires prior to the formation of nickel overcoat, which rules out the possibility of Cu-Ni alloy formation.

Solution-Based Epitaxial Growth of Magnetically Responsive Cu@Ni Nanowires

KAUST Repository

Zhang, Shengmao

2010-02-23

An experiment was conducted to show the solution-based epitaxial growth of magnetically responsive Cu@Ni nanowires. The Ni-sheathed Cu nanowires were synthesized with a one-pot approach. 30 mL of high concentration NaOH, Cu(NO3)2. 3H2O, Cu(NO3)2. 3H2O and 0.07-0.30 mL of Ni(NO3)2. 6H 2O aqueous solutions were added into a plastic reactor with a capacity of 50.0 mL. A varying amount of ethylenediamine (EDA) and hydrazine were also added sequentially, followed by thorough mixing of all reagents. The dimension, morphology, and chemical composition of the products were examined with scanning electron microscopy with energy dispersive X-ray spectroscopy. The XPS analysis on the as formed Cu nanowires confirms that there is indeed no nickel inclusion in the nanowires prior to the formation of nickel overcoat, which rules out the possibility of Cu-Ni alloy formation.

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

International Nuclear Information System (INIS)

Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

2014-01-01

With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

High temperature neutron powder diffraction study of the Cu{sub 12}Sb{sub 4}S{sub 13} and Cu{sub 4}Sn{sub 7}S{sub 16} phases

Energy Technology Data Exchange (ETDEWEB)

Lemoine, Pierric, E-mail: pierric.lemoine@univ-rennes1.fr [Institut des Sciences Chimiques de Rennes, UMR-CNRS 6226, 263 Avenue du Général Leclerc, CS 74205, 35042 Rennes Cedex (France); Bourgès, Cédric; Barbier, Tristan [Laboratoire CRISMAT, UMR-CNRS 6508, ENSICAEN, 6 Boulevard du Maréchal Juin, 14050 Caen Cedex 04 (France); Nassif, Vivian [CNRS Institut NEEL, F-38000 Grenoble (France); Université de Grenoble Alpes, Institut NEEL, F-38000 Grenoble (France); Cordier, Stéphane [Institut des Sciences Chimiques de Rennes, UMR-CNRS 6226, 263 Avenue du Général Leclerc, CS 74205, 35042 Rennes Cedex (France); Guilmeau, Emmanuel [Laboratoire CRISMAT, UMR-CNRS 6508, ENSICAEN, 6 Boulevard du Maréchal Juin, 14050 Caen Cedex 04 (France)

2017-03-15

Ternary copper-containing sulfides Cu{sub 12}Sb{sub 4}S{sub 13} and Cu{sub 4}Sn{sub 7}S{sub 16} have attracted considerable interest since few years due to their high-efficiency conversion as absorbers for solar energy and promising thermoelectric materials. We report therein on the decomposition study of Cu{sub 12}Sb{sub 4}S{sub 13} and Cu{sub 4}Sn{sub 7}S{sub 16} phases using high temperature in situ neutron powder diffraction. Our results obtained at a heating rate of 2.5 K/min indicate that: (i) Cu{sub 12}Sb{sub 4}S{sub 13} decomposes above ≈792 K into Cu{sub 3}SbS{sub 3}, and (ii) Cu{sub 4}Sn{sub 7}S{sub 16} decomposes above ≈891 K into Sn{sub 2}S{sub 3} and a copper-rich sulfide phase of sphalerite ZnS-type structure with an assumed Cu{sub 3}SnS{sub 4} stoichiometry. Both phase decompositions are associated to a sulfur volatilization. While the results on Cu{sub 12}Sb{sub 4}S{sub 13} are in fair agreement with recent published data, the decomposition behavior of Cu{sub 4}Sn{sub 7}S{sub 16} differs from other studies in terms of decomposition temperature, thermal stability and products of reaction. Finally, the crystal structure refinements from neutron powder diffraction data are reported and discussed for the Cu{sub 4}Sn{sub 7}S{sub 16} and tetrahedrite Cu{sub 12}Sb{sub 4}S{sub 13} phases at 300 K, and for the high temperature form of skinnerite Cu{sub 3}SbS{sub 3} at 843 K. - Graphical abstract: In situ neutron powder diffraction data (heating rate of 2.5 K/min) indicates that (i) the ternary Cu{sub 12}Sb{sub 4}S{sub 13} phase is stable up to 792 K and decomposes at higher temperature into Cu{sub 3}SbS{sub 3} and Cu{sub 1.5}Sb{sub 0.5}S{sub 2}, and (ii) the Cu{sub 4}Sn{sub 7}S{sub 16} phase is stable up to 891 K and decomposes at higher temperature into Sn{sub 2}S{sub 3} and a cubic phase of sphalerite ZnS-type structure. Sulfur volatilization likely occurs in order to balance the overall stoichiometry.

X-ray diffraction study of chalcopyrite CuFeS2, pentlandite (Fe,Ni)9S8 and Pyrrhotite Fe1-xS obtained from Cu-Ni orebodies

International Nuclear Information System (INIS)

Nkoma, J.S.; Ekosse, G.

1998-05-01

The X-ray Diffraction (XRD) technique is applied to study five samples of Cu-Ni orebodies, and it is shown that they contain chalcopyrite CuFeS 2 as the source of Cu, pentlandite (Fe,Ni) 9 S 8 as the source of Ni and pyrrhotite Fe 1-x S as a dominant compound. There are also other less dominant compounds such as bunsenite NiO, chalcocite Cu 2 S, penrosite (Ni, Cu)Se 2 and magnetite Fe 3 O 4 . Using the obtained XRD data, we obtain the lattice parameters for tetragonal chalcopyrite as a=b=5.3069A and c=10.3836A, cubic pentlandite as a=b=c=10.0487A, and hexagonal pyrrhotite as a=b=6.8820A and c=22.8037A. (author)

Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

International Nuclear Information System (INIS)

Cao Yuhan; Luo Le

2009-01-01

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu 6 Sn 5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 x 10 -9 atm cc/s are possible, meeting the demands of MIL-STD-883E. (semiconductor technology)

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Directory of Open Access Journals (Sweden)

Yee Mei Leong

2016-06-01

Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Science.gov (United States)

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

The Effect of Increasing Sn Content on High-Temperature Mechanical Deformation of an Mg-3%Cu-1%Ca Alloy

Directory of Open Access Journals (Sweden)

Georgios S.E. Antipas

2013-11-01

Full Text Available Chill casting of magnesium alloy samples with secondary alloying elements of Cu, Ca and Sn at % w.t. concentrations in the range 1–5, 0.1–5 and 0.1–3 respectively, gave rise to appreciably enhanced resistance to high-temperature creep, while maintaining good heat conductivity. The latter was considered to be driven by Cu and Mg-Cu intermetallics while it was clear that Sn mediated the high-temperature performance, mainly via networks of Mg2Sn and MgCaSn precipitates along the Mg matrix grain boundaries. It was postulated that Sn formed intermetallics by preferential substitution of Ca atoms and, thus, did not degrade the heat conductivity by retaining Cu. The % w.t. stoichiometry with the optimum combination of heat conductivity and resistance to high-temperature creep was found to be Mg-3Cu-1Ca-0.1Sn.

Response speed of SnO2-based H2S gas sensors with CuO nanoparticles

International Nuclear Information System (INIS)

Chowdhuri, Arijit; Gupta, Vinay; Sreenivas, K.; Kumar, Rajeev; Mozumdar, Subho; Patanjali, P. K.

2004-01-01

CuO nanoparticles on sputtered SnO 2 thin-film surface exhibit a fast response speed (14 s) and recovery time (61 s) for trace level (20 ppm) H 2 S gas detection. The sensitivity of the sensor (S∼2.06x10 3 ) is noted to be high at a low operating temperature of 130 deg. C. CuO nanoparticles on SnO 2 allow effective removal of excess adsorbed oxygen from the uncovered SnO 2 surface due to spillover of hydrogen dissociated from the H 2 S-CuO interaction

Phase controlled solvothermal synthesis of Cu_2ZnSnS_4, Cu_2ZnSn(S,Se)_4 and Cu_2ZnSnSe_4 Nanocrystals: The effect of Se and S sources on phase purity

International Nuclear Information System (INIS)

Pal, Mou; Mathews, N.R.; Paraguay-Delgado, F.; Mathew, X.

2015-01-01

In this study, we have reported the synthesis of Cu_2ZnSnSe_4 (CZTSe), Cu_2ZnSnS_4 (CZTS) and Cu_2ZnSn(S,Se)_4 (CZTSSe) nanocrystals with tunable band gap and composition obtained by solvothermal method. The crystalline structure, composition, morphology and optical properties of the nanoparticles were characterized by X-ray diffraction (XRD), Raman scattering, energy dispersive X-ray spectroscopy, transmission electron microscopy and diffuse reflectance (DR) spectroscopy. While the XRD patterns of CZTS and CZTSe nanoparticles prepared with elemental S/Se powder revealed the presence of phase pure nanoparticles, the CZTSSe nanoparticles obtained using a mixture of S and Se, were found to contain many secondary phases under the same synthesis protocol. Formation of impurity phases in CZTSSe sample, can be avoided by using a mixture of 1-dodecanethiol (DT; CH_3(CH_2)_1_1SH)/oleylamine (OLA) instead of S powder and following the same experimental procedure. The incorporation of S in CZTSe nanocrystals prepared in presence of DDT/OLA mixture was confirmed through structural and optical characterizations. The optical properties of the quaternary chalcogenide nanocrystals were found to vary with the chemical composition of the material. - Highlights: • Solvothermal synthesis of CZTS, CZTSSe and CZTSe nanocrystals and discussion on possible formation mechanism. • Use of dodecanethiol/oleylamine mixture to synthesize phase-pure CZTSSe nanocrystals. • Formation of impurity phases can be controlled with proper S and Se sources.

Structural, dielectric and magnetic properties of SnO{sub 2}-CuFe{sub 2}O{sub 4} nanocomposites

Energy Technology Data Exchange (ETDEWEB)

Ali, Kashif [Department of Physics, International Islamic University, Islamabad (Pakistan); Iqbal, Javed, E-mail: javed.saggu@qau.edu.pk [Laboratory of Nanoscience and Technology (LNT), Department of Physics, Qaid-i-Azam University, Islamabad (Pakistan); Jan, Tariq [Department of Physics, University of Lahore, Sargodha Campus, Sargodha (Pakistan); Wan, Dongyun [School of Materials Science and Engineering, Shanghai University, Shanghai 200444 (China); Ahmad, Naeem [Department of Physics, International Islamic University, Islamabad (Pakistan); Ahamd, Ishaq [Experimental Physics Labs, National Center for Physics, Islamabad (Pakistan); Ilyas, Syed Zafar [Department of Physics, Allama Iqbal Open University, Islamabad (Pakistan)

2017-04-15

The nanocomposites of (SnO{sub 2}){sub x}(CuFe{sub 2}O{sub 4}){sub (1−x)} (where x=0–100 wt%) have been successfully synthesized via two steps chemical method. XRD pattern has revealed the formation of inverse spinal phases with tetragonal crystal structure without any impurity phases for CuFe{sub 2}O{sub 4} sample. The thermodynamic solubility limit of SnO{sub 2} in CuFe{sub 2}O{sub 4} matrix has been found to be 30 wt% and above this percentage crystal phases related to SnO{sub 2} started to appear. The average particle size and shape of CuFe{sub 2}O{sub 4} nanoparticles have been strongly influenced by addition of SnO{sub 2} as depicted by TEM results. FTIR results have confirmed the existence of cation vibration bands at tetrahedral and octahedral sites along with Sn-O vibration band at higher concentrations, which also validates the formation of nanocomposites. Furthermore, the dielectric constant, tangent loss and conductivity of CuFe{sub 2}O{sub 4} nanoparticles have been found to increase up to 30 wt% addition of SnO{sub 2} and then decreases with further increase which is attributed to variations in resistivity and space charge carriers. Magnetic measurements have shown that saturation magnetization decreases from 35.68 emu/gm to 10.26 emu/gm with the addition of SnO{sub 2} content. - Highlights: • SnO{sub 2}-CuFe{sub 2}O{sub 4} nanocomposites with varying SnO{sub 2} concentrations were synthesized. • The thermodynamic solubility limit for SnO{sub 2} into CuFe{sub 2}O{sub 4} matrix by employing current method was found to be ≤30 wt%. • At higher concentrations, structural phases related to SnO{sub 2} started to appear. • FTIR results corroborated well with the XRD results. • It has been observed that the addition of SnO{sub 2} significantly influence the morphology, dielectric and magnetic properties of CuFe{sub 2}O{sub 4} nanoparticles.

FABRICATION OF Cu-Al-Ni SHAPE MEMORY THIN FILM BY THERMAL EVOPRATION

OpenAIRE

Özkul, İskender; Canbay, Canan Aksu; Tekataş, Ayşe

2017-01-01

Among the functional, materials shape memory alloysare important because of their unique properties. So, these materials haveattracted more attention to be used in micro/nano electronic andelectromechanic systems. In this work, thermal evaporation method has been usedto produce CuAlNi shape memory alloy thin film. The produced CuAlNi thin filmhas been characterized and the presence of the martensite phase wasinvestigated and compared with the CuAlNi alloy sample. CuAlNi shape memoryalloy thin...

Experimental approach towards shell structure at 100Sn and 78Ni

International Nuclear Information System (INIS)

Grawe, H.; Gorska, M.; Fahlander, C.

2000-07-01

The status of experimental approach to 100 Sn and 78 Ni is reviewed. Revised single particle energies for neutrons are deduced for the N=Z=50 shell closure and evidence for low lying I π =2 + and 3 - states is presented. Moderate E2 polarisation charges of 0.1 e and 0.6 e are found to reproduce the experimental data when core excitation of 100 Sn is properly accounted for in the shell model. For the neutron rich Ni region no conclusive evidence for a N=40 subshell is found, whereas firm evidence for the persistence of the N=50 shell at 78 Ni is inferred from the existence of seniority isomers. The disappearance of this isomerism in the mid νg 9/2 shell is discussed. (orig.)

Centrality dependence of isospin effect signatures in 124Sn+64Ni and 112Sn+58Ni reactions

International Nuclear Information System (INIS)

Planeta, R.; Brzychczyk, J.; Majka, Z.; Sochocka, A.; Amorini, F.; Cavallaro, S.; Toro, M. Di; Giustolisi, F.; Lanzalone, G.; Anzalone, A.; Bonasera, A.; Colonna, M.; Maiolino, C.; Porto, F.; Rizzo, F.; Russotto, P.; Auditore, L.; Trifiro, A.; Trimarchi, M.; Baran, V.

2008-01-01

Signatures of isospin effects were investigated for neutron-rich ( 124 Sn+ 64 Ni) and neutron-poor ( 112 Sn+ 58 Ni) systems at 35 MeV/nucleon for noncentral collisions. The centrality dependence of these signatures was tested for several impact parameter estimators. Our main observations are (i) the yields of 1 H and 3 He particles in the neutron-poor system are strongly enhanced with respect to the neutron-rich system, and the yields of 3 H, 6 He, and 7,8 Li are suppressed at all impact parameters, (ii) the yields of 2 H, 4 He, and 6 Li particles are almost the same for both systems, (iii) the N/Z ratio of intermediate mass fragments is correlated with the neutron richness of the system and is weakly dependent on the centrality of the collision, and (iv) the neutron richness of the detected fragments increases strongly with decreasing rapidity in the range from that of the projectile-like fragment to the c.m. region. The gross features of experimental data are reproduced by quantum molecular dynamics model calculations. A comparison between model calculations and the data indicates that the fragments produced in the c.m. regions are weakly excited

In situ investigation of SnAgCu solder alloy microstructure

International Nuclear Information System (INIS)

Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

2011-01-01

Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

Selective Hydrogenation of Biomass-derived Furfural over Supported Ni3Sn2 Alloy: Role of Supports

Directory of Open Access Journals (Sweden)

Rodiansono Rodiansono

2016-03-01

Full Text Available A highly active and selective hydrogenation of biomass-derived furfural into furfuryl alcohol was achieved using supported single phase Ni3Sn2 alloy catalysts. Various supports such as active carbon (AC, g-Al2O3, Al(OH3, ZnO, TiO2, ZrO2, MgO, Li-TN, and SiO2 have been employed in order to understand the role of the support on the formation of Ni3Sn2 alloy phase and its catalytic performance. Supported Ni3Sn2 alloy catalysts were synthesised via a simple hydrothermal treatment of the mixture of aqueous solution of nickel chloride hexahydrate and ethanol solution of tin(II chloride dihydrate in presence of ethylene glycol at 423 K for 24 h followed by H2 treatment at 673 K for 1.5 h, then characterised by using ICP-AES, XRD, H2- and N2-adsorption. XRD profiles of samples showed that the Ni3Sn2 alloy phases are readily formed during hydrothermal processes and become clearly observed at 2θ = 43-44o after H2 treatment. The presence of Ni3Sn2 alloy species that dispersed on the supports is believed to play a key role in highly active and selective hydrogenation of biomass-derived furfural towards furfuryl alcohol. Ni3Sn2 on TiO2 and ZnO supports exhibited much lower reaction temperature to achieved >99% yield of furfuryl alcohol product compared with other supports. The effects of loading amount of Ni-Sn, reaction conditions (temperature and time profile on the activity and selectivity towards the desired product are systematically discussed. Copyright © 2016 BCREC GROUP. All rights reserved Received: 10th November 2015; Revised: 31st December 2015; Accepted: 5th January 2016 How to Cite: Rodiansono, R., Astuti, M.D., Khairi, S., Shimazu, S. (2016. Selective Hydrogenation of Biomass-derived Furfural over Supported Ni3Sn2 Alloy: Role of Supports. Bulletin of Chemical Reaction Engineering & Catalysis, 11 (1: 1-9. (doi:10.9767/bcrec.11.1.393.1-9 Permalink/DOI: http://dx.doi.org/10.9767/bcrec.11.1.393.1-9

Isoscaling in central {sup 124}Sn+{sup 64}Ni, {sup 112}Sn+{sup 58}Ni collisions at 35 A MeV

Energy Technology Data Exchange (ETDEWEB)

Geraci, E.; Bruno, M.; D' Agostino, M. E-mail: dagostino@bo.infn.it; De Filippo, E.; Pagano, A.; Vannini, G.; Alderighi, M.; Anzalone, A.; Auditore, L.; Baran, V.; Barna, R.; Bartolucci, M.; Berceanu, I.; Blicharska, J.; Bonasera, A.; Borderie, B.; Bougault, R.; Brzychczyk, J.; Cardella, G.; Cavallaro, S.; Chbihi, A.; Cibor, J.; Colonna, M.; De Pasquale, D.; Di Toro, M.; Giustolisi, F.; Grzeszczuk, A.; Guazzoni, P.; Guinet, D.; Iacono-Manno, M.; Italiano, A.; Kowalski, S.; La Guidara, E.; Lanzalone, G.; Lanzano, G.; Le Neindre, N.; Li, S.; Lo Nigro, S.; Maiolino, C.; Majka, Z.; Manfredi, G.; Paduszynski, T.; Papa, M.; Petrovici, M.; Piasecki, E.; Pirrone, S.; Politi, G.; Pop, A.; Porto, F.; Rivet, M.F.; Rosato, E.; Russo, S.; Russotto, P.; Sechi, G.; Simion, V.; Sperduto, M.L.; Steckmeyer, J.C.; Trifiro, A.; Trimarchi, M.; Vigilante, M.; Wieleczko, J.P.; Wilczynski, J.; Wu, H.; Xiao, Z.; Zetta, L.; Zipper, W

2004-02-23

{sup 124}Sn+{sup 64}Ni and {sup 112}Sn+{sup 58}Ni reactions at 35 A MeV incident energy were studied by using the 688 Si-CsI telescopes of the forward part (1 deg. {<=}{theta}{sub lab}{<=}30 deg.) of CHIMERA multi-detector. The most central part, 1% of the total measured cross section was selected by means of a multidimensional analysis of the experimental observables. The detected isotopes of light fragments (3{<=}Z{<=}8) provided information on breakup temperatures of the emitting sources. The space-time structure of these sources was deduced from fragment correlations. An odd-even effect in the fragment production, enhanced by the isospin of the entrance channel, was observed. Freeze-out unbound neutron-to-proton relative densities for both studied reactions have been deduced, indicating for a possible isospin distillation mechanism related to a phenomenon of the liquid-gas phase transition in asymmetric systems.

Cu particles decorated pomegranate-structured SnO2@C composites as anode for lithium ion batteries with enhanced performance

International Nuclear Information System (INIS)

Wen, WeiWei; Zou, Mingzhong; Feng, Qian; Li, Jiaxin; Guan, Lunhui; Lai, Heng; Huang, Zhigao

2015-01-01

In this paper, homogeneous composites of pomegranate-structured SnO 2 @C/Cu have been prepared by a simple hydrothermal reaction coupled with wet-chemical reduction, and directly used as anode materials for lithium ion batteries (LIBs). These SnO 2 @C/Cu anodes with an unique architecture show good LIB performance with a capacity of 660 mAh g −1 tested at 600 mA g −1 after 50 cycles and good rate performance at room temperature. Compared with the pure SnO 2 and SnO 2 @C, SnO 2 @C/Cu anodes exhibit much better low-temperature electrochemical performance including reversible capacity, cycling performance, and rate performance. The good LIB performance of SnO 2 @C/Cu anodes should be associated with carbon shell and the conducting Cu particles. This unique configuration can prevent the agglomeration of active materials and facilitate electron conduction especially at a relative low temperature, and obtain the capacity stability in cycling process for LIBs.

Fully Ab-Initio Determination of the Thermoelectric Properties of Half-Heusler NiTiSn: Crucial Role of Interstitial Ni Defects.

Science.gov (United States)

Berche, Alexandre; Jund, Philippe

2018-05-23

For thermoelectric applications, ab initio methods generally fail to predict the transport properties of the materials because of their inability to predict properly the carrier concentrations that control the electronic properties. In this work, a methodology to fill in this gap is applied on the NiTiSn half Heusler phase. For that, we show that the main defects act as donor of electrons and are responsible of the electronic properties of the material. Indeed, the presence of Ni i interstitial defects explains the experimental valence band spectrum and its associated band gap reported in the literature. Moreover, combining the DOS of the solid solutions with the determination of the energy of formation of charged defects, we show that Ni i defects are also responsible of the measured carrier concentration in experimentally supposed "pure" NiTiSn compounds. Subsequently the thermoelectric properties of NiTiSn can be calculated using a fully ab initio description and an overall correct agreement with experiments is obtained. This methodology can be extended to predict the result of extrinsic doping and thus to select the most efficient dopant for specific thermoelectric applications.

Synthesis and electrochemical characteristics of Sn-Sb-Ni alloy composite anode for Li-ion rechargeable batteries

International Nuclear Information System (INIS)

Guo Hong; Zhao Hailei; Jia Xidi; Qiu Weihua; Cui Fenge

2007-01-01

Micro-scaled Sn-Sb-Ni alloy composite was synthesized from oxides of Sn, Sb and Ni via carbothermal reduction. The phase composition and electrochemical properties of the Sn-Sb-Ni alloy composite anode material were studied. The prepared alloy composite electrode exhibits a high specific capacity and a good cycling stability. The lithiation capacity was 530 mAh g -1 in the first cycle and maintained at 370-380 mAh g -1 in the following cycles. The good electrochemical performance may be attributed to its relatively large particle size and multi-phase characteristics. The former reason leads to the lower surface impurity and thus the lower initial capacity loss, while the latter results in a stepwise lithiation/delithiation behavior and a smooth volume change of electrode in cycles. The Sn-Sb-Ni alloy composite material shows a good candidate anode material for the rechargeable lithium ion batteries

Electrodeposited Cu2ZnSnS4 thin films

CSIR Research Space (South Africa)

Valdes, M

2014-05-01

Full Text Available Cu(sub2)ZnSnS(sub4)(CZTS) thin films have been prepared using Electrochemical Atomic Layer Deposition (EC-ALD)and also by one-step conventional constant potential electrodeposition. Optimal deposition conditionswere investigated using cyclic...

Experimental investigation of phase equilibria in the Zr-Cu-Ni ternary system

International Nuclear Information System (INIS)

Yang, Mujin; Wang, Cuiping; Yang, Shuiyuan; Shi, Zhan; Han, Jiajia; Liu, Xingjun

2017-01-01

The phase equilibria in the Zr-Cu-Ni ternary system are investigated combined with X-ray diffraction, electron probe micro-analysis and differential scanning calorimetry. Two isothermal sections of the Zr-Cu-Ni ternary system at 1 000 C and 1 100 C are experimentally established. Most of the binary intermetallic compounds, e.g. Zr 7 Ni 10 , ZrNi, ZrNi 5 , Zr 14 Cu 51 , and Zr 2 Cu 9 , show a remarkable ternary solubility. A new ternary compound named τ 3 (Zr 31.1-30.7 . Cu 28.5-40.3 Ni 40.4-29.0 ) is detected at 1 000 C and dissolved at 1 020 C because the nearby large liquid phase field further expands. The newly determined phase equilibria will provide important information for both thermodynamic assessment and alloy design of Zr-based metallic glass.

Lattice parameter values and phase transitions for the Cu{sub 2}Cd{sub 1-z}Mn{sub z}SnSe{sub 4} and Cu{sub 2}Cd{sub 1-z}Fe{sub z}SnSe{sub 4} alloys

Energy Technology Data Exchange (ETDEWEB)

Moreno, E. [Centro de Estudios de Semiconductores, Departamento de Fisica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Quintero, M., E-mail: mquinter@ula.v [Centro de Estudios de Semiconductores, Departamento de Fisica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Morocoima, M.; Quintero, E.; Grima, P.; Tovar, R.; Bocaranda, P. [Centro de Estudios de Semiconductores, Departamento de Fisica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Delgado, G.E.; Contreras, J.E. [Laboratorio de Cristalografia, Departamento de Quimica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Mora, A.E.; Briceno, J.M.; Avila Godoy, R.; Fernandez, J.L. [Laboratorio de Analisis Quimico y Estructural de Materiales, Departamento de Fisica, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Henao, J.A.; Macias, M.A. [Grupo de Investigacion en Quimica Estructural (GIQUE), Facultad de Ciencias, Escuela de Quimica, Universidad Industrial de Santander, Apartado aereo 678, Bucaramanga (Colombia)

2009-11-03

X-ray powder diffraction measurements and differential thermal analysis (DTA) were made on polycrystalline samples of the Cu{sub 2}Cd{sub 1-z}Mn{sub z}SnSe{sub 4} and Cu{sub 2}Cd{sub 1-z}Fe{sub z}SnSe{sub 4} alloy systems. The diffraction patterns were used to show the equilibrium conditions and to derive lattice parameter values. For Cu{sub 2}Cd{sub 0.8}Fe{sub 0.2}SnSe{sub 4} as well as for Cu{sub 2}Cd{sub 0.2}Fe{sub 0.8}SnSe{sub 4} the crystal structures were refined using the Rietveld method. It was found that the internal distortion parameter sigma decreases as Cd is replaced by either Mn and/or Fe. For the Cu{sub 2}Cd{sub 1-z}Mn{sub z}SnSe{sub 4} and Cu{sub 2}Cd{sub 1-z}Fe{sub z}SnSe{sub 4} alloy systems, only two single solid phase fields, the tetragonal stannite alpha(I4-bar2m) and the wurtz-stannite delta (Pmn2{sub 1}) structures were found to occur in the diagram. In addition to the tetragonal stannite alpha phase extra X-ray diffraction lines due to MnSe and/or FeSe{sub 2} were observed for as grown samples in the range 0.7 < z < 1.0. However, it was found that the amount of the extra phase decreased for the compressed samples.

Phase transformations behavior in a Cu-8.0Ni-1.8Si alloy

Energy Technology Data Exchange (ETDEWEB)

Lei, Q. [School of Materials Science and Engineering, Central South University, Changsha, 410083 (China); Li, Z., E-mail: lizhou6931@163.com [School of Materials Science and Engineering, Central South University, Changsha, 410083 (China) and Key Laboratory of Nonferrous Metal Materials Science and Engineering, Ministry of Education, Changsha, 410083 (China); Wang, M.P. [School of Materials Science and Engineering, Central South University, Changsha, 410083 (China); Key Laboratory of Nonferrous Metal Materials Science and Engineering, Ministry of Education, Changsha, 410083 (China); Zhang, L.; Gong, S. [School of Materials Science and Engineering, Central South University, Changsha, 410083 (China); Xiao, Z. [Department of Engineering, University of Liverpool, Liverpool, L693 GH (United Kingdom); Pan, Z.Y. [Hunan Nonferrous Metals Holding Group Co., Ltd., Changsha, 410015 (China)

2011-02-24

Research highlights: > High solute concentrations Cu-Ni-Si alloy with super high strength and high conductivity has a good prospect for replacing Cu-Be alloys. At least four different kinds of precipitation products (DO{sub 22} ordered structure, {beta}-Ni{sub 3}Si precipitate, {delta}-Ni{sub 2}Si precipitate and {gamma}-Ni{sub 5}Si{sub 2} precipitate) have been observed in previous investigation. Therefore, the overall phase transformation behavior of Cu-Ni-Si alloy appears to be very complex. And most previous studies on the phase transformation usually investigated the precipitation process at only one temperature or at most a few temperatures, which is far away to establish a time-temperature-transformation (TTT) diagram for Cu-Ni-Si alloy. > The phase transformation behavior of Cu-8.0Ni-1.8Si alloy has been studied systematically at wide temperature range in this paper. The results we have gained are that: after solution treatment, followed by different conditions of isothermal treatment, DO{sub 22} ordering, discontinuous precipitation and continuous precipitation were observed in the alloy; discontinuous precipitates of {beta}-Ni{sub 3}Si phase appeared when the alloy isothermal treated at 550 deg. C for short time, which had not been reported by the previous Cu-Ni-Si system alloy's researchers in their papers; two kinds of precipitates of {beta}-Ni{sub 3}Si and {delta}-Ni{sub 2}Si were determined by the TEM characterization; the orientation relationship between the two kinds of precipitates and Cu-matrix is that: (1 1 0){sub Cu}//(1 1 0){sub {beta}}//(211-bar){sub {delta}}, [112-bar]{sub Cu}//[11-bar 2]{sub {beta}}//[3 2 4]{sub {delta}}; during overaging treatment, Cu-matrix, {beta}-Ni{sub 3}Si, {delta}-Ni{sub 2}Si and {delta}'-Ni{sub 2}Si were distinguished in the samples and the orientation relationship between the precipitates and Cu-matrix can be expressed as that: (0 2 2){sub Cu}//(0 2 2){sub {beta}}//(1 0 0){sub {delta}}, (02-bar 2){sub Cu

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

Science.gov (United States)

Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

2016-12-01

Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

Synthesis and Characterization of an Earth-Abundant Cu2BaSn(S,Se)4 Chalcogenide for Photoelectrochemical Cell Application.

Science.gov (United States)

Shin, Donghyeop; Ngaboyamahina, Edgard; Zhou, Yihao; Glass, Jeffrey T; Mitzi, David B

2016-11-17

Cu 2 BaSnS 4-x Se x films consisting of earth-abundant metals have been examined for photocathode application. Films with different Se contents (i.e., Cu 2 BaSnS 4-x Se x with x ≤ 2.4) were synthesized using a cosputter system with post-deposition sulfurization/selenization annealing treatments. Each film adopts a trigonal P3 1 crystal structure, with progressively larger lattice constants and with band gaps shifting from 2.0 to 1.6 eV, as more Se substitutes for S in the parent compound Cu 2 BaSnS 4 . Given the suitable bandgap and earth-abundant elements, the Cu 2 BaSnS 4-x Se x films were studied as prospective photocathodes for water splitting. Greater than 6 mA/cm 2 was obtained under illumination at -0.4 V versus reversible hydrogen electrode for Pt/Cu 2 BaSnS 4-x Se x films with ∼60% Se content (i.e., x = 2.4), whereas a bare Cu 2 BaSnS 4-x Se x (x = 2.4) film yielded ∼3 mA/cm 2 at -0.4 V/RHE.

Kinetic study of the annealing reactions in Cu-Ni-Fe alloys

International Nuclear Information System (INIS)

Donoso, E.

2014-01-01

The thermal aging of a Cu-45Ni-4Fe, Cu-34Ni-11Fe and Cu-33Ni-22Fe alloys tempered from 1173 K have been studied from Differential Scanning Calorimetry (DSC) and microhardness measurements. The analysis of DSC curves, from room temperature to 950 K, shows the presence of one exothermic reaction associated to the formation of FeNi 3 phase nucleating from a modulate structure, and one endothermic peak attributed to dissolution of this phase. Kinetic parameters were obtained using the usual Avrami-Erofeev equation, modified Kissinger method and integrated kinetic functions. Microhardness measurements confirmed the formation and dissolution of the FeNi 3 phase. (Author)

New modulated design, docking and synthesis of carbohydrate-conjugate heterobimetallic CuII-SnIV complex as potential topoisomerase II inhibitor: in vitro DNA binding, cleavage and cytotoxicity against human cancer cell lines.

Science.gov (United States)

Tabassum, Sartaj; Afzal, Mohd; Arjmand, Farukh

2014-03-03

New carbohydrate-conjugate heterobimetallic complexes [C₂₂H₅₀N₆O₁₃CuSnCl₂] (3) and [C₂₂H₅₈N₆O₁₇NiSnCl₂] (4) were synthesized from their monometallic analogs [C₂₂H₅₂N₆O₁₃Cu] (1) and [C₂₂H₆₀N₆O₁₇Ni] (2) containing N-glycoside ligand (L). In vitro DNA binding studies of L and complexes (1-4) with CT DNA were carried out by employing various biophysical and molecular docking techniques which revealed that heterobimetallic complex 3 strongly binds to DNA in comparison to 4, monometallic complexes (1 and 2) and the free ligand. Complex 3 cleaves pBR322 DNA via hydrolytic pathway (confirmed by T4 DNA ligase assay) and inhibited Topo-II activity in a dose-dependent manner. Furthermore, complex 3 was docked into the ATPase domain of human-Topo-II in order to probe the possible mechanism of inhibition. Copyright © 2013 Elsevier Masson SAS. All rights reserved.

Low-field spin dynamics of Cr7Ni and Cr7Ni-Cu -Cr 7Ni molecular rings as detected by μ SR

Science.gov (United States)

Sanna, S.; Arosio, P.; Bordonali, L.; Adelnia, F.; Mariani, M.; Garlatti, E.; Baines, C.; Amato, A.; Sabareesh, K. P. V.; Timco, G.; Winpenny, R. E. P.; Blundell, S. J.; Lascialfari, A.

2017-11-01

Muon spin rotation measurements were used to investigate the spin dynamics of heterometallic Cr7Ni and Cr7Ni -Cu-Cr7Ni molecular clusters. In Cr7Ni the magnetic ions are arranged in a quasiplanar ring and interact via an antiferromagnetic exchange coupling constant J , while Cr7Ni -Cu-Cr7Ni is composed of two Cr7Ni linked by a bridging moiety containing one Cu ion, that induces an inter-ring ferromagnetic interaction J'≪J . The longitudinal muon relaxation rate λ collected at low magnetic fields μ0H BPP)-like heuristic fitting model that takes into account of a distribution of electronic spin characteristic times for T >5 K, while the shoulder presented by Cr7Ni can be reproduced by a BPP function that incorporates a single electronic characteristic time theoretically predicted to dominate for T <5 K. The flattening of λ (T ) in Cr7Ni -Cu-Cr7Ni occurring at very low temperature can be tentatively attributed to field-dependent quantum effects and/or to an inelastic term in the spectral density of the electronic spin fluctuations.

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Science.gov (United States)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

Directory of Open Access Journals (Sweden)

Soares D.

2006-01-01

Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

Magnetic Properties and Structural Study of Ni-Co/Cu Multilayers Prepared by Electrodeposition Method

Directory of Open Access Journals (Sweden)

M. Jafari Fesharaki

2015-07-01

Full Text Available Ni-Co/Cu multilayers have been grown by electrodeposition method from a single electrolyte (based on Ni(SO4.6H2O, Co(SO4.7H2O, Cu(SO4 and H3BO3 using galvanostatic control on titanium sublayers. The X-ray diffraction (XRD patterns confirmed the multilayered structure with the nanometer thicknesses. Also, electron diffraction x-ray (EDX  analysis confirmed the purity of deposited samples. The morphology of the samples was estimated by scanning electron microscope (SEM. Magnetoresistance (MR measurements were carried out at room temperature for the Ni-Co/Cu multilayers by measuring the resistivity in a magnetic fields varying between ±6kOe as a function of the Ni-Co and Cu layer thicknesses; (1 dCu(nm 4 and 3 dNi-Cu(nm 5. The Maximum value of giant magnetoresistance (GMR was obtained when the Ni-Co and Cu thicknesses were 4.0nm and 4.0nm respectively. The hysteresis loop of the samples at room temperature was studied using an alternating gradient force magnetometer (AGFM. Finally, the temperature dependence of magnetization for Ni-Co/Cu multilayers; (dNi-Cu(4nm/dCu(2nm and dNi-Cu(3nm/dCu(3nm measured by Faraday balance and decreasing the magnetization with increasing the temperature discussed according to electron scattering due to spin fluctuation.

On the evolution of Cu-Ni-rich bridges of Alnico alloys with tempering

Energy Technology Data Exchange (ETDEWEB)

Fan, M. [Department of Materials Science and Engineering, North Carolina State University, Campus Box 7907, Raleigh, NC 27695-7907 (United States); Liu, Y. [Department of Materials Science and Engineering, North Carolina State University, Campus Box 7907, Raleigh, NC 27695-7907 (United States); Analytical Instrumentation Facility, North Carolina State University, Raleigh, NC 27695 (United States); Jha, Rajesh; Dulikravich, George S. [Departments of Mechanical and Materials Engineering, MAIDROC, Florida International University, EC3462, 10555 West Flagler Street, Miami, FL 33174 (United States); Schwartz, J.; Koch, C.C. [Department of Materials Science and Engineering, North Carolina State University, Campus Box 7907, Raleigh, NC 27695-7907 (United States)

2016-12-15

Tempering is a critical step in Alnico alloy processing, yet the effects of tempering on microstructure have not been well studied. Here we report these effects, and in particular the effects on the Cu-Ni bridges. Energy-dispersive X-ray spectroscopy (EDS) maps and line scans show that tempering changes the elemental distribution in the Cu-Ni bridges, but not the morphology and distribution of Cu-bridges. The Cu concentration in the Cu-Ni bridges increases after tempering while other element concentrations decrease, especially Ni and Al. Furthermore, tempering sharpens the Cu bridge boundaries. These effects are primarily related to the large 2C{sub 44}/(C{sub 11}−C{sub 12}) ratio for Cu, largest of all elements in Alnico. In addition, the Ni-Cu loops around the α{sub 1} phases become inconspicuous with tempering. The diffusion of Fe and Co to the α{sub 1} phase during tempering, which increases the difference of saturation magnetization between the α{sub 1} and α{sub 2} phases, is observed by EDS. In summary, α{sub 1}, α{sub 2} and Cu-bridges are concentrated with their major elements during tempering which improves the magnetic properties. The formation of these features formed through elemental diffusion is discussed via energy theories. - Highlights: • Tempering changes the elemental distribution in the Cu-Ni bridges, but not morphology. • Cu concentration in the Cu-Ni bridges increases after tempering while others decrease. • These effects are related to the large 2C{sub 44}/(C{sub 11}−C{sub 12}) ratio for Cu. • The Ni-Cu loops around the α{sub 1} phases become inconspicuous with tempering. • The diffusion of Fe and Co to the α{sub 1} phase during tempering is observed by EDS.

Hydrogen storage properties of LaMgNi3.6M0.4 (M = Ni, Co, Mn, Cu, Al) alloys

International Nuclear Information System (INIS)

Yang, Tai; Zhai, Tingting; Yuan, Zeming; Bu, Wengang; Xu, Sheng; Zhang, Yanghuan

2014-01-01

Highlights: • La–Mg–Ni system AB 2 -type alloys were prepared by induction melting. • Structures and lattice parameters were analysed by XRD. • Hydrogen absorption/desorption performances were studied. • Mechanisms of hydrogen absorption capacity fading were investigated. - Abstract: LaMgNi 3.6 M 0.4 (M = Ni, Co, Mn, Cu, Al) alloys were prepared through induction melting process. The phase compositions and crystal structures were characterised via X-ray diffraction (XRD). The hydrogen storage properties, including activation performance, hydrogen absorption capacity, cycle stability, alloy particle pulverisation and plateau pressure, were systemically investigated. Results show that Ni, Co, Mn and Cu substitution alloys exhibit multiphase structures comprising the main phase LaMgNi 4 and the secondary phase LaNi 5 . However, the secondary phase of the Al substitution alloy changes into LaAlNi 4 . The lattice parameters and cell volumes of the LaMgNi 4 phase follow the order Ni < Co < Al < Cu < Mn. Activation is simplified through partial substitution of Ni with Al, Cu and Co. The hydrogen absorption capacities of all of the alloys are approximately 1.7 wt.% at the first activation process; however, they rapidly decrease with increasing cycle number. In addition, the stabilities of hydriding and dehydriding cycles decrease in the order Al > Co > Ni > Cu > Mn. Hydriding processes result in numerous cracks and amorphisation of the LaMgNi 4 phase in the alloys. The p–c isotherms were determined by a Sieverts-type apparatus. Two plateaus were observed for the Ni, Co and Al substitution alloys, whereas only one plateau was found for Mn and Cu. This result was caused by the amorphisation of the LaMgNi 4 phase during the hydriding cycles. Reversible absorption and desorption of hydrogen are difficult to achieve. Substitutions of Ni with Co, Mn, Cu and Al significantly influence the reduction of hysteresis between hydriding and dehydriding

Thermal stability and primary phase of Al-Ni(Cu)-La amorphous alloys

International Nuclear Information System (INIS)

Huang Zhenghua; Li Jinfu; Rao Qunli; Zhou Youhe

2008-01-01

Thermal stability and primary phase of Al 85+x Ni 9-x La 6 (x = 0-6) and Al 85 Ni 9-x Cu x La 6 (x = 0-9) amorphous alloys were investigated by X-ray diffraction and differential scanning calorimeter. It is revealed that replacing Ni in the Al 85 Ni 9 La 6 alloy by Cu decreases the thermal stability and makes the primary phase change from intermetallic compounds to single fcc-Al as the Cu content reaches and exceeds 4 at.%. When the Ni and La contents are fixed, replacing Al by Cu increases the thermal stability but also promotes the precipitation of single fcc-Al as the primary phase

Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Energy Technology Data Exchange (ETDEWEB)

Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

2009-05-27

The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

Experimental investigation of phase equilibria in the Zr-Cu-Ni ternary system

Energy Technology Data Exchange (ETDEWEB)

Yang, Mujin; Wang, Cuiping; Yang, Shuiyuan; Shi, Zhan; Han, Jiajia; Liu, Xingjun [Xiamen Univ. (China). College of Materials and Fujian Provincial Key Lab. of Materials Genome

2017-08-15

The phase equilibria in the Zr-Cu-Ni ternary system are investigated combined with X-ray diffraction, electron probe micro-analysis and differential scanning calorimetry. Two isothermal sections of the Zr-Cu-Ni ternary system at 1 000 C and 1 100 C are experimentally established. Most of the binary intermetallic compounds, e.g. Zr{sub 7}Ni{sub 10}, ZrNi, ZrNi{sub 5}, Zr{sub 14}Cu{sub 51}, and Zr{sub 2}Cu{sub 9}, show a remarkable ternary solubility. A new ternary compound named τ{sub 3} (Zr{sub 31.1-30.7} . Cu{sub 28.5-40.3}Ni{sub 40.4-29.0}) is detected at 1 000 C and dissolved at 1 020 C because the nearby large liquid phase field further expands. The newly determined phase equilibria will provide important information for both thermodynamic assessment and alloy design of Zr-based metallic glass.

Integrating 3D Flower-Like Hierarchical Cu2NiSnS4 with Reduced Graphene Oxide as Advanced Anode Materials for Na-Ion Batteries.

Science.gov (United States)

Yuan, Shuang; Wang, Sai; Li, Lin; Zhu, Yun-hai; Zhang, Xin-bo; Yan, Jun-min

2016-04-13

Development of an anode material with high performance and low cost is crucial for implementation of next-generation Na-ion batteries (NIBs) electrode, which is proposed to meet the challenges of large scale renewable energy storage. Metal chalcogenides are considered as promising anode materials for NIBs due to their high theoretical capacity, low cost, and abundant sources. Unfortunately, their practical application in NIBs is still hindered because of low conductivity and morphological collapse caused by their volume expansion and shrinkage during Na(+) intercalation/deintercalation. To solve the daunting challenges, herein, we fabricated novel three-dimensional (3D) Cu2NiSnS4 nanoflowers (CNTSNs) as a proof-of-concept experiment using a facile and low-cost method. Furthermore, homogeneous integration with reduced graphene oxide nanosheets (RGNs) endows intrinsically insulated CNTSNs with superior electrochemical performances, including high specific capacity (up to 837 mAh g(-1)), good rate capability, and long cycling stability, which could be attributed to the unique 3D hierarchical structure providing fast ion diffusion pathway and high contact area at the electrode/electrolyte interface.

A feasibility study on SnO2/NiFe2O4 nanocomposites as anodes for Li ion batteries

International Nuclear Information System (INIS)

Balaji, S.; Vasuki, R.; Mutharasu, D.

2013-01-01

Highlights: ► The morphological analysis performed has shown the existence of nanocomposite. ► Sp. capacity after 50 cycles of pure NiFe 2 O 4 , 5 and 10 wt.% SnO 2 are 450, 750 and 780 mA h/g. ► The results are higher than the theoretical capacity of graphite (374 mA h/g). ► The capacity retention is also found to increase with SnO 2 addition in the NiFe 2 O 4 . ► Charge and discharge capacities of LiMn 2 O 4 vs. 10 wt.% SnO 2 /NiFe 2 O 4 are 232 and 138 mA h/g. -- Abstract: The SnO 2 /NiFe 2 O 4 nanocomposite samples with varying concentration of SnO 2 such as 5 wt.% and 10 wt.% were synthesized via urea assisted combustion synthesis. The kinetics of the combustion reactions were studied using thermo gravimetry analysis and from which the compound formation temperature of all the samples were observed to be below 400 °C. From the morphological analysis the grain size of NiFe 2 O 4 , 5 wt.% SnO 2 /NiFe 2 O 4 and 10 wt.% SnO 2 /NiFe 2 O 4 samples were observed to be around 1.7, 2.3 and 3.5 μm. The chrono potentiometry analyses of the samples were performed against lithium metal electrode. The capacity retention was found to be higher for composite with 10 wt.% SnO 2 . The discharge capacity of 10 wt.% SnO 2 sample with respect to Li metal and LiMn 2 O 4 electrode was observed to be around 980 mA h/g and 138 mA h/g respectively

Influence of Sn incorporation on the properties of CuInS2 thin films grown by vacuum evaporation method

International Nuclear Information System (INIS)

Zribi, M.; Rabeh, M. Ben; Brini, R.; Kanzari, M.; Rezig, B.

2006-01-01

Structural, morphological and optical properties of Sn-doped CuInS 2 thin films grown by double source thermal evaporation method were studied. Firstly, the films were annealed in vacuum after evaporation from 250 to 500 deg. C for Sn deposition time equal to 3 min. Secondly, the films deposited for several Sn evaporation times were annealed in vacuum after evaporation at 500 deg. C. The X-ray diffraction spectra indicated that polycrystalline Sn-doped CuInS 2 films were obtained and no Sn binary or ternary phases are observed for the Sn evaporation times equal to 5 min. Scanning electron microscopy observation revealed the decrease of the surface crystallinity with increasing the Sn evaporation times and the annealing temperatures. The Sn-doped samples after annealing have bandgap energy of 1.42-1.50 eV. Furthermore, we found that the Sn-doped CuInS 2 thin films exhibit N-type conductivity after annealing

Influence of Ni Solute segregation on the intrinsic growth stresses in Cu(Ni) thin films

International Nuclear Information System (INIS)

Kaub, T.M.; Felfer, P.; Cairney, J.M.; Thompson, G.B.

2016-01-01

Using intrinsic solute segregation in alloys, the compressive stress in a series of Cu(Ni) thin films has been studied. The highest compressive stress was noted in the 5 at.% Ni alloy, with increasing Ni concentration resulting in a subsequent reduction of stress. Atom probe tomography quantified Ni's Gibbsian interfacial excess in the grain boundaries and confirmed that once grain boundary saturation is achieved, the compressive stress was reduced. This letter provides experimental support in elucidating how interfacial segregation of excess adatoms contributes to the post-coalescence compressive stress generation mechanism in thin films. - Graphical abstract: Cu(Ni) film stress relationship with Ni additions. Atom probe characterization confirms solute enrichment in the boundaries, which was linked to stress response.

Sequestration of radionuclides and heavy metals by hydroxyapatite doped with Fe, Cu and Sn

International Nuclear Information System (INIS)

Neidel, Linnah L.; Moore, Robert Charles; Salas, Fred; Grouios, Fotini; Holt, Kathleen Caroline; Helean, Katheryn B.

2005-01-01

Apatite, Ca 5 (PO 4 ) 3 (F,OH,Cl)(P6 3 /m, Z=2), is the most abundant phosphate mineral on Earth. The end-member hydroxyapatite, Ca 5 (PO 4 ) 3 OH(P2 1 /b), is the primary mineral component in bones and teeth and tends to scavenge and sequester heavy metals in the human body. Hydroxyapatite has also been shown to be effective at sequestering radionuclides and heavy metals in certain natural systems (Dybowska et al., 2004). Hydroxyapatite has been the focus of many laboratory studies and is utilized for environmental remediation of contaminated sites (Moore et al., 2002). The crystal structure of apatite tolerates a great deal of distortion caused by extensive chemical substitutions. Metal cations (e.g. REE, actinides, K, Na, Mn, Ni, Cu, Co, Zn, Sr, Ba, Pb, Cd, Fe) substitute for Ca, and oxyanions (e.g. AsO 4 3- , SO 4 2- , CO 3 2- , SiO 4 4- , CrO 4 2- ) replace PO 4 3- through a series of coupled substitutions that preserve electroneutrality. Owing to the ability of apatite to incorporate 'impurities'(including actinides) gives rise to its proposed use as a waste form for radionuclides. Recent work at Sandia National Laboratory demonstrated that hydroxyapatite has a strong affinity for U, Pu, Np, Sr and Tc reduced from pertechnetate (TcO 4 - ) by SnCl 2 (Moore et al., 2002). Based on these earlier promising results, an investigation was initiated into the use of apatite-type materials doped with aliovalent cations including Fe, Cu and Sn as Tc-scavengers. Synthetic Fe and Cu-doped hydroxyapatite samples were prepared by precipitation of Ca, from Ca-acetate, and P, from ammonium phosphate. The Fe and Cu were introduced as chlorides into the Ca-acetate solution. Stannous chloride was used as a reducing agent and was apparently incorporated into the crystal structures of the hydroxyapatite samples in small, as yet undetermined quantities.

Sequestration of Radionuclides and Heavy Metals by Hydroxyapatite Doped with Fe, Cu and Sn

International Nuclear Information System (INIS)

K.B. Helean; R.C. Moore

2005-01-01

Apatite, Ca 5 (PO 4 ) 3 (F,OH,Cl) (P6 3 /m, Z=2), is the most abundant phosphate mineral on Earth. The end-member hydroxyapatite, Ca 5 (PO 4 ) 3 OH (P2 1 /b), is the primary mineral component in bones and teeth and tends to scavenge and sequester heavy metals in the human body. Hydroxyapatite has also been shown to be effective at sequestering radionuclides and heavy metals in certain natural systems (Dybowska et al., 2004). Hydroxyapatite has been the focus of many laboratory studies and is utilized for environmental remediation of contaminated sites (Moore et al., 2002). The crystal structure of apatite tolerates a great deal of distortion caused by extensive chemical substitutions. Metal cations (e.g. REE, actinides, K, Na, Mn, Ni, Cu, Co, Zn, Sr, Ba, Pb, Cd, Fe) substitute for Ca, and oxyanions (e.g. AsO 4 3- , SO 4 2- , CO 3 2- , SiO 4 4- , CrO 4 2- ) replace PO 4 3- through a series of coupled substitutions that preserve electroneutrality. Owing to the ability of apatite to incorporate ''impurities'' (including actinides) gives rise to its proposed use as a waste form for radionuclides. Recent work at Sandia National Laboratory demonstrated that hydroxyapatite has a strong affinity for U, Pu, Np, Sr and Tc reduced from pertechnetate (TcO 4 - ) by SnCl 2 (Moore et al., 2002). Based on these earlier promising results, an investigation was initiated into the use of apatite-type materials doped with aliovalent cations including Fe, Cu and Sn as Tc-scavengers. Synthetic Fe and Cu-doped hydroxyapatite samples were prepared by precipitation of Ca, from Ca-acetate, and P, from ammonium phosphate. The Fe and Cu were introduced as chlorides into the Ca-acetate solution. Stannous chloride was used as a reducing agent and was apparently incorporated into the crystal structures of the hydroxyapatite samples in small, as yet undetermined quantities

Vibrational properties of stannite and kesterite type compounds: Raman scattering analysis of Cu2(Fe,Zn)SnS4

International Nuclear Information System (INIS)

Fontané, X.; Izquierdo-Roca, V.; Saucedo, E.; Schorr, S.; Yukhymchuk, V.O.; Valakh, M.Ya.; Pérez-Rodríguez, A.; Morante, J.R.

2012-01-01

Highlights: ► Analysis of main and weaker Raman peaks from Cu 2 FeZnS 4 and Cu 2 ZnSnS 4 compounds. ► Identification of a cation disorder induced Raman peak in Cu 2 ZnSnS 4 . ► Analysis of spectral features of main Raman peaks from Cu 2 (Fe,Zn)SnS 4 . - Abstract: This work reports the analysis of the vibrational properties of stannite–kesterite Cu 2 (Fe,Zn)SnS 4 compounds that has been performed by Raman scattering measurements. The detailed analysis of the experimental spectra has allowed determining the frequency and symmetry assignment of the main and weaker peaks from both stannite Cu 2 FeSnS 4 (CFTS) and kesterite Cu 2 ZnSnS 4 (CZTS) phases. The measurements performed in the kesterite CZTS samples have also revealed the presence of local inhomogeneities that are characterised by an additional peak in the spectra at about 331 cm −1 . This peak has been related to the presence in these local regions of a high degree of disorder in the cation sublattice, in agreement with previous neutron diffraction analysis in similar samples. Finally, the spectra from the solid solution alloys show a one-mode behaviour of the main A/A 1 peak with the chemical composition.

Study on sensing mechanism of CuO-SnO2 gas sensors

International Nuclear Information System (INIS)

Zhou Xiaohua; Cao Quanxi; Huang Hui; Yang Peng; Hu Ying

2003-01-01

The preparations of SnO 2 and CuO powders and the manufacture of CuO-SnO 2 gas sensors are described in some details. The CuO content was chosen as 1.5 mol.% (sample 1), 4.4 mol.% (sample 2), 8.4 mol.% (sample 3) and 12.5 mol.% (sample 4), respectively. The resistance of all samples in air and their sensitive properties to H 2 S, alcohol vapor, C 4 H 10 and CH 2 were measured in the temperature range 20-300 deg. C, respectively. The results show that the resistance of all samples decreases exponentially with increasing temperature, when the temperature is >31 deg. C and it increases with an increase in CuO content at a given temperature. Sample 3 exhibits the best sensitive property in the case of the same H 2 S-air mixture concentration and excellent selectivity. The sensitive mechanisms of these samples to different gases are discussed in details

Study of Cu-Al-Ni-Ga as high-temperature shape memory alloys

Science.gov (United States)

Zhang, Xin; Wang, Qian; Zhao, Xu; Wang, Fang; Liu, Qingsuo

2018-03-01

The effect of Ga element on the microstructure, mechanical properties and shape memory effect of Cu-13.0Al-4.0Ni- xGa (wt%) high-temperature shape memory alloy was investigated by optical microscopy, SEM, XRD and compression test. The microstructure observation results showed that the Cu-13.0Al-4.0Ni- xGa ( x = 0.5 and 1.0) alloys displayed dual-phase morphology which consisted of 18R martensite and (Al, Ga)Cu phase, and their grain size was about several hundred microns, smaller than that of Cu-13.0Al-4.0Ni alloy. The compression test results proved that the mechanical properties of Cu-13.0Al-4.0Ni- xGa alloys were improved by addition of Ga element owing to the grain refinement and solid solution strengthening, and the compressive fracture strains were 11.5% for x = 0.5 and 14.9% for x = 1.0, respectively. When the pre-strain was 8%, the shape memory effect of 4.2 and 4.6% were obtained for Cu-13.0Al-4.0Ni-0.5 Ga and Cu-13.0Al-4.0Ni-1.0 Ga alloys after being heated to 400 °C for 1 min.

Ultra Fast Timing Measurements at $^{78}$Ni and $^{132}$Sn

CERN Multimedia

2002-01-01

We propose to measure level lifetimes in the exotic nuclei of $^{81}$Ga and $^{80}$Ga in the vicinity of $^{78}$Ni and of $^{135}$Sb and $^{134}$Sb above $^{132}$Sn by the time-delayed technique. These are relatively simple nuclear systems with a few particles and/or holes outside of the doubly-magic core thus can be treated rather precisely within the shell model. The anticipated new structure information on these nuclei, and in particular the lifetime results will put constraints on the model parameters and will serve to verify their predictions. The selected nuclei are some of the most exotic ones just above $^{78}$Ni or $^{132}$Sn, where the transition rates can be studied at present. Of the strongest interest is the nucleus of $^{81}$Ga, which has only 3 valence protons outside of $^{78}$Ni with the lowest proton orbits being $p_{3/2}$ and $f_{5/2}$. The Ml transition between these states, although allowed by the selection rules, should be $\\textit{l}$-forbidden thus very slow. This should give rise to a...