Study of a nickel-copper filter for the future conditioning of insoluble residues

Energy Technology Data Exchange (ETDEWEB)

Massoni, Nicolas, E-mail: nicolas.massoni@cea.fr

2016-10-15

This paper deals with the feasibility of a separate conditioning for insoluble residues coming from spent nuclear fuel reprocessing. The two possible conditioning routes considered for insoluble residues were (i) added with cladding hulls with the considered filter (route #1) or (ii) melted with a nickel copper alloy already studied (route #2). Only route #2 was dealt with in this study. In France, the current practice is to store insoluble residues in a water suspension. For the two conditioning routes described here, dry insoluble residues are required for safety with melted metals. A nickel-copper filter was developed that can serve for the two types of conditioning. A filtration test performed with molybdenum particles as insoluble residue surrogates was done. The particle-charged filter was sintered, and Mo particles were kept inside the filter. Thus an integrated flowsheet for the filtration and immobilization of insoluble residues was demonstrated. - Highlights: • The basics for an integrated flowsheet for the filtration and immobilization of insoluble residues were demonstrated. • The filter can serve as an immobilization matrix or can be added in another metal waste. • A theoretical calculation has shown that the conception of the filter should be done to avoid an excessive heat-up.

Corrosion resistance of copper canister weld material

International Nuclear Information System (INIS)

Gubner, Rolf; Andersson, Urban

2007-03-01

The proposed design for a final repository for spent fuel and other long-lived residues is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast iron insert fitted inside a copper canister. SKB has since several years developed manufacturing processes for the canister components using a network of manufacturers. For the encapsulation process SKB has built the Canister Laboratory to demonstrate and develop the encapsulation technique in full scale. The critical part of the encapsulation of spent fuel is the sealing of the canister which is done by welding the copper lid to the cylindrical part of the canister. Two welding techniques have been developed in parallel, Electron Beam Welding (EBW) and Friction Stir Welding (FSW). During the past two decades, SKB has developed the technology EBW at The Welding Institute (TWI) in Cambridge, UK. The development work at the Canister Laboratory began in 1999. In electron beam welding, a gun is used to generate the electron beam which is aimed at the joint. The beam heats up the material to the melting point allowing a fusion weld to be formed. The gun was developed by TWI and has a unique design for use at reduced pressure. The system has gone through a number of improvements under the last couple of years including implementation of a beam oscillation system. However, during fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities at the new grain boundaries that might pose adverse effects on the corrosion resistance of welds. As a new method for joining, SKB has been developing friction stir welding (FSW) for sealing copper canisters for spent nuclear fuel in cooperation with TWI since 1997. FSW was invented in 1991 at TWI and is a thermo

Corrosion resistance of copper canister weld material

Energy Technology Data Exchange (ETDEWEB)

Gubner, Rolf; Andersson, Urban [Corrosion and Metals Research Institute, Sto ckholm (Sweden)

2007-03-15

The proposed design for a final repository for spent fuel and other long-lived residues is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast iron insert fitted inside a copper canister. SKB has since several years developed manufacturing processes for the canister components using a network of manufacturers. For the encapsulation process SKB has built the Canister Laboratory to demonstrate and develop the encapsulation technique in full scale. The critical part of the encapsulation of spent fuel is the sealing of the canister which is done by welding the copper lid to the cylindrical part of the canister. Two welding techniques have been developed in parallel, Electron Beam Welding (EBW) and Friction Stir Welding (FSW). During the past two decades, SKB has developed the technology EBW at The Welding Institute (TWI) in Cambridge, UK. The development work at the Canister Laboratory began in 1999. In electron beam welding, a gun is used to generate the electron beam which is aimed at the joint. The beam heats up the material to the melting point allowing a fusion weld to be formed. The gun was developed by TWI and has a unique design for use at reduced pressure. The system has gone through a number of improvements under the last couple of years including implementation of a beam oscillation system. However, during fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities at the new grain boundaries that might pose adverse effects on the corrosion resistance of welds. As a new method for joining, SKB has been developing friction stir welding (FSW) for sealing copper canisters for spent nuclear fuel in cooperation with TWI since 1997. FSW was invented in 1991 at TWI and is a thermo

Temperature effect on crack resistance and fracture micromechanisms in tungsten-copper pseudoalloy

International Nuclear Information System (INIS)

Babak, A.V.; Gopkalo, E.E.; Krasovskij, A.Ya.; Nadezhdin, G.N.; Uskov, E.I.

1988-01-01

Results of the mechanical- and-physical study of peculiarities of the tungsten-copper pseudoalloy fracture in the temperature range of 293-2273 K are presented. It is shown that the studied material possesses maximum crack resistance in the vicinity of the upper temperature range boundary of the ductile-brittle transition and minimum resistance to cracks propagation when it contains melted copper. It is established that the peculiarities of changes in crack-resistance correspond to peculiarities of fracture micromechanisms for tungsten-copper pseudoalloy in the studied tempearture range

Effects of filler wire on residual stress in electron beam welded QCr0.8 copper alloy to 304 stainless steel joints

International Nuclear Information System (INIS)

Zhang, Bing-Gang; Zhao, Jian; Li, Xiao-Peng; Chen, Guo-Qing

2015-01-01

The electron beam welding (EBW) of 304 stainless steel to QCr0.8 copper alloy with or without copper filler wire was studied in detail. The temperature fields and magnitude and distribution of stress fields in the joints during the welding process were numerically simulated using finite element method. The temperature cycles and residual stresses were also experimentally measured by thermometric and hole-drilling methods, respectively. The accuracy of the modeling procedure was verified by the good agreement between the calculated results and experimental data. The temperature distribution in the joint was found to be asymmetric along the center of weld. In particular, the temperature in the copper alloy plate is much higher than that in the 304 SS plate owing to the great difference in thermal conductivity between the two materials. The peak three-dimensional residual stresses all appeared at the interface between the copper and steel in the two different joints. Furthermore, the weld was subjected to tensile stress. The longitudinal residual stress, generally the most harmful to the integrity of the structure among the stress components in EBW with filler wire (EBFW), was 53 MPa lower than that of autogenous EBW (AEBW), and the through-thickness residual stress was 12 MPa lower. The transverse residual stress of EBFW was 44 MPa higher than that of AEBW. However, analysis of the von Mises stress showed that the EBFW process effectively reduced the extent of the high residual stress region in the weld location and the magnitude of the residual stresses in the copper side compared with those of the AEBW joint. - Highlights: • Copper and steel was welded by electron beam welding with copper filler wire. • The copper wire fed into gap can reduce the peak value of residual stress. • The peak value of longitudinal stress can be reduced 53 MPa by the filler wire. • The range of nov Mises stress in the weld could be reduced by the wire

Corrosion and biofouling resistance evaluation of 90-10 copper-nickel

Energy Technology Data Exchange (ETDEWEB)

Powell, Carol [Consultant to Copper Development Association, UK, Square Covert, Caynham, Ludlow, Shropshire (United Kingdom)

2004-07-01

Copper-nickel alloys for marine use were developed for naval applications in the early part of the 20. century with a view to improving the corrosion resistance of condenser tubes and seawater piping. They still enjoy widespread use today not only for many navies but also in commercial shipping, floating production, storage and off loading vessels (FPSOs), and in multistage flash desalination. The two popular alloys contain 90% or 70% copper and differ in strength and maximum sea water velocity levels they can handle but it is the 90-10 copper-nickel (CuNi10Fe1Mn) which is the more economic and extensively used. An additional benefit of this alloy is its high resistance to biofouling: in recent years this has led to sheathing developments particularly for structures and boat hulls. This paper provides a review of the corrosion and biofouling resistance of 90-10 copper-nickel based on laboratory test data and documented experience of the alloy in marine environments. Particular attention is given to exposure trials over 8 years in Langstone Harbour, UK, which have recently been completed by Portsmouth University on behalf of the Nickel Institute. These examined four sheathing products; plate and foil as well as two composite products with rubber backing. The latter involved copper-nickel granules and slit sheet. The trial results are consistent with the behaviour of the alloy in the overall review. There is an inherent high resistance to marine biofouling when freely exposed. Prolonged exposure to quiet conditions can result in some growth of marine organisms but this is loosely attached and can readily be removed by wiping or a light scraping. The good corrosion resistance of 90-10 copper-nickel in sea water is also confirmed and associated with the formation of a thin, complex, protective and predominantly cuprous oxide surface film, which forms and matures naturally on exposure to seawater. Sound initial oxide film formation is also known to help protect against

Residual stress investigation of copper plate and canister EB-Welds Complementary Results

International Nuclear Information System (INIS)

Gripenberg, H.

2009-03-01

The residual stresses in copper as induced by EB-welding were studied by specimens where the weld had two configurations: either a linear or a circumferential weld. This report contains the residual stress measurements of two plates, containing linear welds, and the full-scale copper lid specimen to which a hollow cylinder section had been joined by a circumferential EB-weld. The residual stress state of the EB-welded copper specimens was investigated by X-ray diffraction (XRD), hole drilling (HD) ring core (RC) and contour method (CM). Three specimens, canister XK010 and plates X251 and X252, were subjected to a thorough study aiming at quantitative determination of the residual stress state in and around the EB-welds using XRD for surface and HD and RC for spatial stress analysis. The CM maps one stress component over a whole cross section. The surface residual stresses measured by XRD represent the machined condition of the copper material. The XRD study showed that the stress changes towards compression close to the weld in the hollow cylinder, which indicates shrinkage in the hoop direction. According to the same analogy, the shrinkage in the axial direction is much smaller. The HD measurements showed that the stress state in the base material is bi-axial and, in terms of von Mises stress, 50 MPa for the plates and 20 MPa for the cylinder part of the canister. The stress state in the EB-welds of all specimens differs clearly from the stress state in the base material being more tensile, with higher magnitudes of von Mises stress in the plate than in the canister welds. The HD and RC results were obtained using linear elastic theory. The RC measurements showed that the maximum principal stress in the BM is close to zero near the surface and it becomes slightly tensile, 10 MPa, deeper under the surface. Welding pushed the general stress state towards tension with the maximum principal stress reaching 50 MPa, deeper than 5 mm below the surface in the weld. The

Direct patterning of highly-conductive graphene@copper composites using copper naphthenate as a resist for graphene device applications.

Science.gov (United States)

Bi, Kaixi; Xiang, Quan; Chen, Yiqin; Shi, Huimin; Li, Zhiqin; Lin, Jun; Zhang, Yongzhe; Wan, Qiang; Zhang, Guanhua; Qin, Shiqiao; Zhang, Xueao; Duan, Huigao

2017-11-09

We report an electron-beam lithography process to directly fabricate graphene@copper composite patterns without involving metal deposition, lift-off and etching processes using copper naphthenate as a high-resolution negative-tone resist. As a commonly used industrial painting product, copper naphthenate is extremely cheap with a long shelf time but demonstrates an unexpected patterning resolution better than 10 nm. With appropriate annealing under a hydrogen atmosphere, the produced graphene@copper composite patterns show high conductivity of ∼400 S cm -1 . X-ray diffraction, conformal Raman spectroscopy and X-ray photoelectron spectroscopy were used to analyze the chemical composition of the final patterns. With the properties of high resolution and high conductivity, the patterned graphene@copper composites could be used as conductive pads and interconnects for graphene electronic devices with ohmic contacts. Compared to common fabrication processes involving metal evaporation and lift-off steps, this pattern-transfer-free fabrication process using copper naphthenate resist is direct and simple but allows comparable device performance in practical device applications.

Effects of chlortetracycline and copper supplementation on antimicrobial resistance of fecal Escherichia coli from weaned pigs.

Science.gov (United States)

Agga, G E; Scott, H M; Amachawadi, R G; Nagaraja, T G; Vinasco, J; Bai, J; Norby, B; Renter, D G; Dritz, S S; Nelssen, J L; Tokach, M D

2014-06-01

Feed-grade chlortetracycline (CTC) and copper are both widely utilized in U.S. pig production. Cluster randomized experiment was conducted to evaluate the effects of CTC and copper supplementation in weaned pigs on antimicrobial resistance (AMR) among fecal Escherichia coli. Four treatment groups: control, copper, CTC, or copper plus CTC were randomly allocated to 32 pens with five pigs per pen. Fecal samples were collected weekly from three pigs per pen for six weeks. Two E. coli isolates per fecal sample were tested for phenotypic and genotypic resistance against antibiotics and copper. Data were analyzed with multilevel mixed effects logistic regression, multivariate probit analysis and discrete time survival analysis. CTC-supplementation was significantly (99% [95% CI=98-100%]) associated with increased tetracycline resistance compared to the control group (95% [95% CI=94-97%]). Copper supplementation was associated with decreased resistance to most of the antibiotics tested, including cephalosporins, over the treatment period. Overall, 91% of the E. coli isolates were multidrug resistant (MDR) (resistant to ≥3 antimicrobial classes). tetA and blaCMY-2 genes were positively associated (PpcoD were negatively associated with MDR. tetA and blaCMY-2 were positively associated with each other and in turn, these were negatively associated with both tetB and pcoD genes; which were also positively associated with one another. Copper minimum inhibitory concentration was not affected by copper supplementation or by pcoD gene carriage. CTC supplementation was significantly associated with increased susceptibilities of E. coli to copper (HR=7 [95% CI=2.5-19.5]) during treatment period. In conclusion, E. coli isolates from the nursery pigs exhibited high levels of antibiotic resistance, with diverse multi-resistant phenotypic profiles. The roles of copper supplementation in pig production, and pco-mediated copper resistance among E. coli in particular, need to be further

Investigation of surface resistance of copper in classical and anomalous skin-effect region

International Nuclear Information System (INIS)

Kutovoj, V.A.; Egorov, A.M.

2008-01-01

The surface resistance of copper in classical and anomalous skin-effect region has been investigated, and the surface resistance improvement factor equal to the ratio of the surface resistance of copper at room temperature to that of helium temperature, depending on the electromagnetic field frequency, has been determined. The improvement factor has been shown to have inverse power law dependence on frequency. The frequencies at which the improvement factor of copper equals 10 have been determined. It has been found that the quality factor of a resonance high-frequency system made of copper, operating at temperature T ≥ 4.2 K can be increased 10 times or more as against a quality factor of a resonance high-frequency system operating at room temperature

Accumulation and resistance to copper of two biotypes of Cynodon dactylon.

Science.gov (United States)

Wang, Youbao; Zhang, Li; Yao, Jing; Huang, Yongjie; Yan, Mi

2009-04-01

The effects of copper accumulation and resistance in two biotypes of Cynodon dactylon were studied. Results showed that at a low concentration of copper (Cynodon dactylon was generally unaffected. As copper concentration increased, negative effects on the growth of Cynodon dactylon became apparent. The critical concentration at which the plant exhibited poisoning symptoms was different for the two biotypes of Cynodon dactylon. At 500 mg/kg copper concentration in soil, the biotype from the polluted area showed significantly higher tolerance of copper than the biotype from the unpolluted area.

Effect of water treatment residuals on soil phosphorus, copper and aluminium availability and toxicity

Energy Technology Data Exchange (ETDEWEB)

Lombi, E., E-mail: enzo.lombi@unisa.edu.a [CSIRO Land and Water, Centre for Environmental Contaminant Research, PMB 2, Glen Osmond, SA 5064 (Australia); Centre for Environmental Risk Assessment and Remediation, University of South Australia, Building X, Mawson Lakes Campus, Mawson Lakes, SA 5095 (Australia); CRC CARE, PO Box 486, Salisbury, SA 5106 (Australia); Stevens, D.P. [CSIRO Land and Water, Centre for Environmental Contaminant Research, PMB 2, Glen Osmond, SA 5064 (Australia); Arris Pty Ltd, PO Box 5143, Burnley, Victoria 3121 (Australia); McLaughlin, M.J. [CSIRO Land and Water, Centre for Environmental Contaminant Research, PMB 2, Glen Osmond, SA 5064 (Australia); Soil and Land Systems, University of Adelaide, PMB 1, Glen Osmond, SA 5064 (Australia)

2010-06-15

Water treatment residuals (WTRs) are produced by the treatment of potable water with coagulating agents. Beneficial recycling in agriculture is hampered by the fact that WTRs contain potentially toxic contaminants (e.g. copper and aluminium) and they bind phosphorus strongly. These issues were investigated using a plant bioassay (Lactuca sativa), chemical extractions and an isotopic dilution technique. Two WTRs were applied to an acidic and a neutral pH soil at six rates. Reductions in plant growth in amended soils were due to WTR-induced P deficiency, rather than Al or Cu toxicity. The release of potentially toxic Al from WTRs was found to be mitigated by their alkaline nature and pH buffering capacity. However, acidification of WTRs was shown to release more soluble Al than soil naturally high in Al. Copper availability was relatively low in all treatments. However, the lability of WTR-Cu increased when the WTR was applied to the soil. - The effect of water treatment residue application to soil was investigated in relation to phosphorus availability, and copper and aluminium phytotoxicity.

Effect of water treatment residuals on soil phosphorus, copper and aluminium availability and toxicity

International Nuclear Information System (INIS)

Lombi, E.; Stevens, D.P.; McLaughlin, M.J.

2010-01-01

Water treatment residuals (WTRs) are produced by the treatment of potable water with coagulating agents. Beneficial recycling in agriculture is hampered by the fact that WTRs contain potentially toxic contaminants (e.g. copper and aluminium) and they bind phosphorus strongly. These issues were investigated using a plant bioassay (Lactuca sativa), chemical extractions and an isotopic dilution technique. Two WTRs were applied to an acidic and a neutral pH soil at six rates. Reductions in plant growth in amended soils were due to WTR-induced P deficiency, rather than Al or Cu toxicity. The release of potentially toxic Al from WTRs was found to be mitigated by their alkaline nature and pH buffering capacity. However, acidification of WTRs was shown to release more soluble Al than soil naturally high in Al. Copper availability was relatively low in all treatments. However, the lability of WTR-Cu increased when the WTR was applied to the soil. - The effect of water treatment residue application to soil was investigated in relation to phosphorus availability, and copper and aluminium phytotoxicity.

Adsorption and oxidation of SO₂in a fixed-bed reactor using activated carbon produced from oxytetracycline bacterial residue and impregnated with copper.

Science.gov (United States)

Zhou, Baohua; Yu, Lei; Song, Hanning; Li, Yaqi; Zhang, Peng; Guo, Bin; Duan, Erhong

2015-02-01

The SO₂removal ability (including adsorption and oxidation ability) of activated carbon produced from oxytetracycline bacterial residue and impregnated with copper was investigated. The activated carbon produced from oxytetracycline bacterial residue and modified with copper was characterized by x-ray diffraction, scanning electron microscopy, and energy-dispersive spectroscopy. The effects of the catalysts, SO₂concentration, weight hourly space velocity, and temperature on the SO₂adsorption and oxidation activity were evaluated. Activated carbon produced from oxytetracycline bacterial residue and used as catalyst supports for copper oxide catalysts provided high catalytic activity for the adsorbing and oxidizing of SO₂from flue gases.

Residual Resistance Data from Cavity Production Projects at Jefferson Lab

International Nuclear Information System (INIS)

Ciovati, Gianluigi; Geng, Rongli; Mammosser, John; Saunders, Jeffrey

2010-01-01

A fundamental limitation towards achieving high quality factors in superconducting radio-frequency cavities is the so-called residual resistance. Understanding and controlling the residual resistance has important implications towards improving the efficiency and reduce the operating cost of continuous wave superconducting linear accelerators. In this contribution we will report on the residual resistance values obtained from measurements of the quality factor of a large set of cavities, with resonant frequency between 805 MHz and 1.5 GHz, all of them processed and tested at Jefferson Lab. Surface treatments included both buffered chemical polishing and electropolishing. The results indicate an approximate value of the residual resistance of about 7-10 n Omega.

A genomic island provides Acidithiobacillus ferrooxidans ATCC 53993 additional copper resistance: a possible competitive advantage.

Science.gov (United States)

Orellana, Luis H; Jerez, Carlos A

2011-11-01

There is great interest in understanding how extremophilic biomining bacteria adapt to exceptionally high copper concentrations in their environment. Acidithiobacillus ferrooxidans ATCC 53993 genome possesses the same copper resistance determinants as strain ATCC 23270. However, the former strain contains in its genome a 160-kb genomic island (GI), which is absent in ATCC 23270. This GI contains, amongst other genes, several genes coding for an additional putative copper ATPase and a Cus system. A. ferrooxidans ATCC 53993 showed a much higher resistance to CuSO(4) (>100 mM) than that of strain ATCC 23270 (<25 mM). When a similar number of bacteria from each strain were mixed and allowed to grow in the absence of copper, their respective final numbers remained approximately equal. However, in the presence of copper, there was a clear overgrowth of strain ATCC 53993 compared to ATCC 23270. This behavior is most likely explained by the presence of the additional copper-resistance genes in the GI of strain ATCC 53993. As determined by qRT-PCR, it was demonstrated that these genes are upregulated when A. ferrooxidans ATCC 53993 is grown in the presence of copper and were shown to be functional when expressed in copper-sensitive Escherichia coli mutants. Thus, the reason for resistance to copper of two strains of the same acidophilic microorganism could be determined by slight differences in their genomes, which may not only lead to changes in their capacities to adapt to their environment, but may also help to select the more fit microorganisms for industrial biomining operations. © Springer-Verlag 2011

Assessment of strains of Pseudomonas syringae pv. tomato from Tanzania for resistance to copper and streptomycin

DEFF Research Database (Denmark)

Shenge, K.C.; Wydra, K.; Mabagala, M.B.

2008-01-01

Fifty-six strains of Pseudomonas syringae pv. tomato (P.s. pv. tomato) were collected from tomato-producing areas in Tanzania and assessed for resistance to copper and antibiotics. The collection was done from three tomato-producing regions (Morogoro, Arusha and Iringa), representing three...... different ecological conditions in the country. After isolation and identification, the P. s. pv. tomato strains were grown on King's medium B (KB) amended with 20% copper sulphate (w/v). The strains were also assessed for resistance to antibiotics. Results indicated that there was widespread resistance...... strains of the pathogen were moderately resistant to copper sulphate, such that 54.0% of them were able to grow on the KB medium amended with 20% (w/v) of the copper compound....

Analytical solutions for peak and residual uplift resistance of pipelines

Energy Technology Data Exchange (ETDEWEB)

Nixon, J.F. [Nixon Geotech Ltd., Calgary, AB (Canada); Oswell, J.M. [Naviq Consulting Inc., Calgary, AB (Canada)

2010-07-01

Frost heave can occur on cold pipelines that traverse unfrozen, non permafrost terrain. The stresses experienced by the pipeline are partly a function of the strength of the soil on the non heaving side of the frozen-unfrozen interface. This paper proposed three analytical solutions to estimate the soil uplift resistance by considering the pipeline and soil to act similar to a strip footing, a punching shear failure, and by considering the formation of horizontal crack emanating from the spring line of the pipe. Peak uplift resistance and residual uplift resistance were discussed. Results for full scale pipe and for laboratory scale model pipes were presented, with particular reference to cover depth, temperature and crack width; and limits to residual uplift resistance. It was concluded that the peak uplift resistance and the residual uplift resistance are generally independent and controlled by different factors. The peak resistance is related directly to pipe diameter, and less strongly dependent on springline depth. It is also strongly dependent on soil temperature. However, the residual uplift resistance is strongly dependent on burial depth, weakly dependent on pipe displacement rate and also on soil temperature. 15 refs., 19 figs.

COPPER RESISTANT STRAIN CANDIDA TROPICALIS RomCu5 INTERACTION WITH SOLUBLE AND INSOLUBLE COPPER COMPOUNDS

Directory of Open Access Journals (Sweden)

Ie. P. Prekrasna

2015-10-01

Full Text Available The focus of the study was interaction of Candida tropicalis RomCu5 isolated from highland Ecuador ecosystem with soluble and insoluble copper compounds. Strain C. tropicalis RomCu5 was cultured in a liquid medium of Hiss in the presence of soluble (copper citrate and CuCl2 and insoluble (CuO and CuCO3 copper compounds. The biomass growth was determined by change in optical density of culture liquid, composition of the gas phase was measured on gas chromatograph, redox potential and pH of the culture fluid was defined potentiometrically. The concentration of soluble copper compounds was determined colorimetrically. Maximal permissible concentration of Cu2+ for C. tropicalis RomCu5 was 30 000 ppm of Cu2+ in form of copper citrate and 500 ppm of Cu2+ in form of CuCl2. C. tropicalis was metabolically active at super high concentrations of Cu2+, despite the inhibitory effect of Cu2+. C. tropicalis immobilized Cu2+ in the form of copper citrate and CuCl2 by it accumulation in the biomass. Due to medium acidification C. tropicalis dissolved CuO and CuCO3. High resistance of C. tropicalis to Cu2+ and ability to interact with soluble and insoluble copper compounds makes it biotechnologically perspective.

Field dependent surface resistance of niobium on copper cavities

Directory of Open Access Journals (Sweden)

T. Junginger

2015-07-01

Full Text Available The surface resistance R_{S} of superconducting cavities prepared by sputter coating a niobium film on a copper substrate increases significantly stronger with the applied rf field compared to cavities of bulk material. A possible cause is that the thermal boundary resistance between the copper substrate and the niobium film induces heating of the inner cavity wall, resulting in a higher R_{S}. Introducing helium gas in the cavity, and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by less than 120 mK when R_{S} increases with E_{acc} by 100  nΩ. This is more than one order of magnitude less than what one would expect from global heating. Additionally, the effects of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for the current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered R_{S}.

Experimental investigation of copper matrix longitudinal resistance in a composite Nb-Ti wire

International Nuclear Information System (INIS)

Gubkin, I.N.; Kozlenkova, N.I.; Nikulin, A.D.; Polikarpova, M.V.; Filkin, V.Ya.

1994-01-01

The longitudinal resistance of multifilamentary superconducting wires is among the major parameters used in design and optimization of superconducting magnetic systems. To enhance the conductivity of the copper matrix, it is made of pipes and rods of enhanced quality copper produced by electron beam melting (resistance ratio between two temperatures, 295 K and 4.2 K, R 295 /R 4.2 > 200). Yet for readily obtainable conductors this parameter is much lower. The reduction of the copper-matrix electrical conductivity may be attributed to wire-production technology involving processes such as extrusion, drawing and intermediate thermal processing, as well as to the size effect. Copper-matrix longitudinal resistance was studied as a function of wire diameter on specimens of multifilamentary Nb-Ti wire with filaments coated by a Nb layer. Experimental results are compared with the Sondheimer calculations for a monofilament conductor as well as with the Gavalloni calculations for an ideal wire with hexagonally located filaments. It has been shown that the best fit with the experiment is provided by the Sondheimer approximation. Comparison of the results of this work with other authors' data obtained for the specimens with no niobium barrier, allows the authors to single out the influence of a pure size effect and diffusion of Ti on the resistivity

Removal of copper from acid wastewater of bioleaching by adsorption onto ramie residue and uptake by Trichoderma viride.

Science.gov (United States)

Wang, Buyun; Wang, Kai

2013-05-01

A continuous batch bioleaching was built to realize the bioleaching of sewage sludge in large scale. In the treatment, heavy metal in acid wastewater of bioleaching was removed by adsorption onto ramie residue. Then, acid wastewater was reused in next bioleaching batch. In this way, most time and water of bioleaching was saved and leaching efficiency of copper, lead and chromium kept at a high level in continuous batch bioleaching. It was found that residual heavy metal in sewage sludge is highly related to that in acid wastewater after bioleaching. To get a high leaching efficiency, concentration of heavy metal in acid wastewater should be low. Adsorption of copper from acid wastewater onto ramie residue can be described by pseudo first-order kinetics equation and Freundlich isotherm model. Trichoderma viride has the potential to be used for the concentration and recovery of heavy metal adsorbed onto ramie residue. Copyright © 2013 Elsevier Ltd. All rights reserved.

An experimental evaluation of joint electrical resistance on power lead thermal performance

International Nuclear Information System (INIS)

Datskov, V.I.; Demko, J.A.; Augustynowicz, S.D.; Hutton, R.D.

1994-01-01

The amount of electrical resistance in braze joints is not known for certain. In addition the annealing processes that occurs during a braze or solder operation can change the residual resistivity ratio (RRR) of the copper. The change in the electrical resistivity of samples of copper because of exposure to conditions that a high current lead would see during a brazing operation were experimentally investigated. A sample was taken from a manufacturing and brazing trial of the high current power leads for the Superconducting Super Collider (SSC), and from oxygen free high conductivity copper (OFHC) 101 rod similar to that used in the trial. The samples were heated under conditions that a current lead would undergo during the brazing process. Measurements were made of the electrical resistance of the copper specimens and across a braze joint in the manufacturing trial sample for temperatures ranging from liquid helium to room temperature. A prototype of the SSC high current lead is shown. This lead was fabricated from 5 sections that were brazed together. Some results for the measured residual resistivity ratio (RRR) along this lead are given

Low-temperature thermal conductivity of highly porous copper

International Nuclear Information System (INIS)

Tomás, G; Bonfait, G; Martins, D; Cooper, A

2015-01-01

The development and characterization of new materials is of extreme importance in the design of cryogenic apparatus. Recently Versarien ® PLC developed a technique capable of producing copper foam with controlled porosity and pore size. Such porous materials could be interesting for cryogenic heat exchangers as well as of special interest in some devices used in microgravit.y environments where a cryogenic liquid is confined by capillarity.In the present work, a system was developed to measure the thermal conductivity by the differential steady-state mode of four copper foam samples with porosity between 58% and 73%, within the temperatures range 20 - 260 K, using a 2 W @ 20 K cryocooler. Our measurements were validated using a copper control sample and by the estimation of the Lorenz number obtained from electrical resistivity measurements at room temperature. With these measurements, the Resistivity Residual Ratio and the tortuosity were obtained. (paper)

Co-selection of antibiotic resistance via copper shock loading on bacteria from a drinking water bio-filter.

Science.gov (United States)

Zhang, Menglu; Chen, Lihua; Ye, Chengsong; Yu, Xin

2018-02-01

Heavy metal contamination of source water frequently occurred in developing countries as a result of accidents. To address the problems, most of the previous studies have focused on engineering countermeasures. In this study, we investigated the effects of heavy metals, particularly copper, on the development of antibiotic resistance by establishing a copper shock loading test. Results revealed that co-selection occurred rapidly within 6 h. Copper, at the levels of 10 and 100 mg/L, significantly increased bacterial resistance to the antibiotics tested, including rifampin, erythromycin, kanamycin, and a few others. A total of 117 antimicrobial-resistance genes were detected from 12 types of genes, and the relative abundance of most genes (particularly mobile genetic elements intⅠand transposons) was markedly enriched by at least one fold. Furthermore, the copper shock loading altered the bacterial community. Numerous heavy metal and antibiotic resistant strains were screened out and enriched. These strains are expected to enhance the overall level of resistance. More noticeably, the majority of the co-selected antibiotic resistance could sustain for at least 20 h in the absence of copper and antimicrobial drugs. Resistance to vancomycin, erythromycin and lincomycin even could remain for 7 days. The prominent selection pressure by the copper shock loading implies that a real accident most likely poses similar impacts on the water environment. An accidental release of heavy metals would not only cause harm to the ecological environment, but also contribute to the development of bacterial antibiotic resistance. Broader concerns should be raised about the biological risks caused by sudden releases of pollutants by accidents. Copyright © 2017. Published by Elsevier Ltd.

Specific features in the behavior of electrical resistivity of the pine biocarbon preform/copper composite

Science.gov (United States)

Burkov, A. T.; Orlova, T. S.; Smirnov, B. I.; Smirnov, I. A.; Misiorek, H.; Jezowski, A.

2010-11-01

The electrical resistivity ρ( T) of the novel type of composites prepared by infiltrating melted copper in vacuum in empty sap channels of white pine high-porosity biocarbon preforms has been measured in the temperature range 5-300 K. Biocarbon preforms have been prepared by pyrolysis of tree wood in an argon flow at two carbonization temperatures, 1000 and 2400°C. The electrical resistivity of the composites has been found to vary relatively weakly with temperature and to pass through a characteristic minimum near 40-50 K, which can be ascribed to iron and manganese impurities penetrating into copper from the carbon preform when liquid copper is infiltrated into it. It has been shown that the electrical resistivity ρ( T) of the composites is governed primarily by the specific microstructure of the preform, which is made up of parallel channels with an average diameter of about 50 μm interrupted by systems of thin capillaries. The small cross section of the copper-filled capillaries accounts for these regions providing the major contribution to the electrical resistivity of the composites. An increase in the wood carbonization temperature brings about a noticeable increase in the effective capillary cross section and a decrease in the electrical resistivity ρ( T) of the composite.

Evolution of copper arsenate resistance for enhanced enargite bioleaching using the extreme thermoacidophile Metallosphaera sedula.

Science.gov (United States)

Ai, Chenbing; McCarthy, Samuel; Liang, Yuting; Rudrappa, Deepak; Qiu, Guanzhou; Blum, Paul

2017-12-01

Adaptive laboratory evolution (ALE) was employed to isolate arsenate and copper cross-resistant strains, from the copper-resistant M. sedula CuR1. The evolved strains, M. sedula ARS50-1 and M. sedula ARS50-2, contained 12 and 13 additional mutations, respectively, relative to M. sedula CuR1. Bioleaching capacity of a defined consortium (consisting of a naturally occurring strain and a genetically engineered copper sensitive strain) was increased by introduction of M. sedula ARS50-2, with 5.31 and 26.29% more copper recovered from enargite at a pulp density (PD) of 1 and 3% (w/v), respectively. M. sedula ARS50-2 arose as the predominant species and modulated the proportions of the other two strains after it had been introduced. Collectively, the higher Cu 2+ resistance trait of M. sedula ARS50-2 resulted in a modulated microbial community structure, and consolidating enargite bioleaching especially at elevated PD.

Radiation enhanced copper clustering processes in Fe-Cu alloys during electron and ion irradiations as measured by electrical resistivity

International Nuclear Information System (INIS)

Ishino, S.; Chimi, Y.; Bagiyono; Tobita, T.; Ishikawa, N.; Suzuki, M.; Iwase, A.

2003-01-01

To study the mechanism of radiation-enhanced clustering of copper atoms in Fe-Cu alloys, in situ electrical resistivity measurements are performed during irradiation with 100 MeV carbon ions and with 2 MeV electrons at 300 K. Two kinds of highly pure Fe-Cu alloys with Cu content of 0.02 and 0.6 wt% are used. The results are summarized as follows: - Although there is a steep initial resistivity increase below about 10 μdpa, the resistivity steadily decreases after this initial transient in Fe-0.6wt%Cu alloy, while in Fe-0.02wt%Cu alloy, the resistivity either decreases slowly or stays almost constant. The rate of change in resistivity depends on copper concentration. - The rate of change in resistivity per dpa is larger for electron irradiation than for ion irradiation. - Change in dose rate from 10 -8 to 10 -9 dpa/s slightly enhances the rate of resistivity change per dpa. The decrease in resistivity with dose is considered to be due to clustering or precipitation of copper atoms. The initial abrupt increase in resistivity is too large to be accounted for by initial introduction of point defects before copper clustering. Tentatively the phenomenon is explained as due to the formation of embryos of copper precipitates with a large strain field around them. Quantitative evaluation of the results using resistivity contribution of a unit concentration of Frenkel pairs and that of copper atoms gives an important conclusion that more than one copper atom are removed from solid solution by one Frenkel pair. The clustering efficiency is surprisingly high in the present case compared with the ordinary radiation-induced or radiation-enhanced precipitation processes

Comparison of oxidation resistance of copper treated by beam-line ion implantation and plasma immersion ion implantation

International Nuclear Information System (INIS)

An Quanzhang; Li Liuhe; Hu Tao; Xin Yunchang; Fu, Ricky K.Y.; Kwok, D.T.K.; Cai Xun; Chu, Paul K.

2009-01-01

Copper which has many favorable properties such as low cost, high thermal and electrical conductivity, as well as easy fabrication and joining is one of the main materials in lead frames, interconnects, and foils in flexible circuits. Furthermore, copper is one of the best antibacterial materials. However, unlike aluminum oxide or chromium oxide, the surface copper oxide layer does not render sufficient protection against oxidation. In this work, in order to improve the surface oxidation resistance of Cu, Al and N were introduced into copper by plasma immersion ion implantation (PIII) and beam-line ion implantation (BII). The implantation fluences of Al and N were 2 x 10 17 ions cm -2 and 5 x 10 16 ions cm -2 , respectively. The implanted and untreated copper samples were oxidized in air at 260 deg. C for 1 h. The X-ray diffraction (XRD), scanning electron microscopy (SEM), as well as X-ray photoelectron spectroscopy (XPS) results indicate that both implantation methods can enhance the oxidation resistance of copper but to different extent. PIII is superior to BII in enhancing the oxidation resistance of copper. The effects and possible mechanisms are discussed.

Copper Pollution Increases the Resistance of Soil Archaeal Community to Changes in Water Regime.

Science.gov (United States)

Li, Jing; Liu, Yu-Rong; Cui, Li-Juan; Hu, Hang-Wei; Wang, Jun-Tao; He, Ji-Zheng

2017-11-01

Increasing efforts have been devoted to exploring the impact of environmental stresses on soil bacterial communities, but the work on the archaeal community is seldom. Here, we constructed microcosm experiments to investigate the responses of archaeal communities to the subsequent dry-rewetting (DW) disturbance in two contrasting soils (fluvo-aquic and red soil) after 6 years of copper pollution. Ten DW cycles were exerted on the two soils with different copper levels, followed by a 6-week recovery period. In both soils, archaeal diversity (Shannon index) in the high copper-level treatments increased over the incubation period, and archaeal community structure changed remarkably as revealed by the non-metric multidimensional scaling ordinations. In both soils, copper pollution altered the response of dominant operational taxonomic units (OTUs) to the DW disturbance. Throughout the incubation and recovery period, the resistance of archaeal abundance to the DW disturbance was higher in the copper-polluted soils than soils without pollution. Taken together, copper pollution altered the response of soil archaeal diversity and community composition to the DW disturbance and increased the resistance of the archaeal abundance. These findings have important implications for understanding soil microbial responses to ongoing environmental change.

On the field dependent surface resistance of niobium on copper cavities

CERN Document Server

Junginger, Tobias

2015-01-01

The surface resistance Rs of superconducting cavities prepared by sputter coating a thin niobium film on a copper substrate increases significantly stronger with the applied RF field compared to cavities of bulk material. A possible cause is that due to the thermal boundary resistance between the copper substrate and the niobium film Rs is enhanced due to global heating of the inner cavity wall. Introducing helium gas in the cavity and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by only 60+/-60 mK when Rs increases with Eacc by 100 nOhm. This is more than one order of magnitude less than what one would expect from global heating. Additionally the effect of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered Rs.

Thermal resistance of indium coated sapphire–copper contacts below 0.1K

CERN Document Server

Eisel, T; Koettig, T

2014-01-01

High thermal resistances exist at ultra-low temperatures for solid-solid interfaces. This is especially true for pressed metal-sapphire joints, where the heat is transferred by phonons only. For such pressed joints it is difficult to achieve good physical, i.e. thermal contacts due to surface irregularities in the microscopic or larger scale. Applying ductile indium as an intermediate layer reduces the thermal resistance of such contacts. This could be proven by measurements of several researchers. However, the majority of the measurements were performed at temperatures higher than 1 K. Consequently, it is difficult to predict the thermal resistance of pressed metal-sapphire joints at temperatures below 1 K. In this paper the thermal resistances across four different copper-sapphire-copper sandwiches are presented in a temperature range between 30 mK and 100 mK. The investigated sandwiches feature either rough or polished sapphire discs (empty set 20 mm x 1.5 mm) to investigate the phonon scattering at the bo...

Aging of residual surface resistance of superconducting lead cavities

DEFF Research Database (Denmark)

Danielsen, M.

1972-01-01

Measurements of the residual surface resistance of superconducting lead cavities as a function of time during a period of a month showed an oscillating variation. An explanation of the ageing curves is proposed. ©1972 The American Institute of Physics......Measurements of the residual surface resistance of superconducting lead cavities as a function of time during a period of a month showed an oscillating variation. An explanation of the ageing curves is proposed. ©1972 The American Institute of Physics...

Relationship between copper, glycopeptide, and macrolide resistance among Enterococcus faecium strains isolated from pigs in Denmark between 1997 and 2003

DEFF Research Database (Denmark)

Hasman, Henrik; Aarestrup, Frank Møller

2005-01-01

A significant relationship between copper resistance (tcrB), glycopeptide resistance (Tn1546), and macrolide resistance [erm(B)] in Enterococcus faecium isolated from pigs was found. The tcrB gene was located closely upstream of the Tn1546 element. However, the continued use of copper sulfate has...... not been able to maintain high levels of macrolide and glycopeptide resistance....

Copper and copper-nickel alloys as zebra mussel antifoulants

Energy Technology Data Exchange (ETDEWEB)

Dormon, J.M.; Cottrell, C.M.; Allen, D.G.; Ackerman, J.D.; Spelt, J.K. [Univ. of Toronto, Ontario (Canada)

1996-04-01

Copper has been used in the marine environment for decades as cladding on ships and pipes to prevent biofouling by marine mussels (Mytilus edulis L.). This motivated the present investigation into the possibility of using copper to prevent biofouling in freshwater by both zebra mussels and quagga mussels (Dreissena polymorpha and D. bugensis collectively referred to as zebra mussels). Copper and copper alloy sheet proved to be highly effective in preventing biofouling by zebra mussels over a three-year period. Further studies were conducted with copper and copper-nickel mesh (lattice of expanded metal) and screen (woven wire with a smaller hole size), which reduced the amount of copper used. Copper screen was also found to be strongly biofouling-resistant with respect to zebra mussels, while copper mesh reduced zebra mussel biofouling in comparison to controls, but did not prevent it entirely. Preliminary investigations into the mechanism of copper antifouling, using galvanic couples, indicated that the release of copper ions from the surface of the exposed metal into the surrounding water is directly or indirectly responsible for the biofouling resistance of copper.

Copper pollution decreases the resistance of soil microbial community to subsequent dry-rewetting disturbance.

Science.gov (United States)

Li, Jing; Wang, Jun-Tao; Hu, Hang-Wei; Ma, Yi-Bing; Zhang, Li-Mei; He, Ji-Zheng

2016-01-01

Dry-rewetting (DW) disturbance frequently occurs in soils due to rainfall and irrigation, and the frequency of DW cycles might exert significant influences on soil microbial communities and their mediated functions. However, how microorganisms respond to DW alternations in soils with a history of heavy metal pollution remains largely unknown. Here, soil laboratory microcosms were constructed to explore the impacts of ten DW cycles on the soil microbial communities in two contrasting soils (fluvo-aquic soil and red soil) under three copper concentrations (zero, medium and high). Results showed that the fluctuations of substrate induced respiration (SIR) decreased with repeated cycles of DW alternation. Furthermore, the resistance values of substrate induced respiration (RS-SIR) were highest in non-copper-stressed (zero) soils. Structural equation model (SEM) analysis ascertained that the shifts of bacterial communities determined the changes of RS-SIR in both soils. The rate of bacterial community variance was significantly lower in non-copper-stressed soil compared to the other two copper-stressed (medium and high) soils, which might lead to the higher RS-SIR in the fluvo-aquic soil. As for the red soil, the substantial increase of the dominant group WPS-2 after DW disturbance might result in the low RS-SIR in the high copper-stressed soil. Moreover, in both soils, the bacterial diversity was highest in non-copper-stressed soils. Our results revealed that initial copper stress could decrease the resistance of soil microbial community structure and function to subsequent DW disturbance. Copyright © 2015. Published by Elsevier B.V.

Grape berry bacterial inhibition by different copper fungicides

Directory of Open Access Journals (Sweden)

Martins Guilherme

2016-01-01

Full Text Available Copper fungicides are widely used in viticulture. Due to its large spectrum of action, copper provides an efficient control over a great number of vine pathogens. Previous studies showed that, high levels of cupric residues can impact grape-berry microbiota, in terms of the size and population structure, reducing the diversity and the abundance. Due to the importance of grape-berry bacterial in crop health, and the potential impact of copper fungicides over the microbiota, we determined Minimum Inhibitory Concentration (MIC of different copper formulations for bacterial species isolated from grape berries. We study the Minimum Inhibitory Concentration (MIC of different copper formulations (copper sulphate (CuSO4 pure, Bordeaux mixture (CuSO4 + Ca(OH2, copper oxide (Cu2O, copper hydroxide (Cu(OH2 over 92 bacterial strains isolated from grape berries in different stages of the ripening process. The results of MIC measurements revealed that the different copper formulations have a variable inhibitory effect and among the different isolates, some species are the most resistant to all copper formulations than others. This study confirm that usage of cupric phytosanitary products should be reasonable independently of the farming system; they also provide evidence of the importance of the choice of which copper formulations are to be used regarding their impact on the grape berry bacterial microbiota.

Interfacial Microstructure and Its Influence on Resistivity of Thin Layers Copper Cladding Steel Wires

Science.gov (United States)

Li, Hongjuan; Ding, Zhimin; Zhao, Ruirong

2018-04-01

The interfacial microstructure and resistivity of cold-drawn and annealed thin layers copper cladding steel (CCS) wires have been systematically investigated by the methods of scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and resistivity testing. The results showed that the Cu and Fe atoms near interface diffused into each other matrixes. The Fe atoms diffused into Cu matrixes and formed a solid solution. The mechanism of solid solution is of substitution type. When the quantity of Fe atoms exceeds the maximum solubility, the supersaturated solid solution would form Fe clusters and decompose into base Cu and α-Fe precipitated phases under certain conditions. A few of α-Fe precipitates was observed in the copper near Cu/Fe interfaces of cold-drawn CCS wires, with 1-5 nm in size. A number of α-Fe precipitates of 1-20 nm in size can be detected in copper near Cu/Fe interfaces of CCS wires annealed at 850°C. When annealing temperature was less than 750°C, the resistivity of CCS wires annealed was lower than that of cold-drawn CCS wires. However, when annealing temperature was above 750°C, the resistivity of CCS wires was greater than that of cold-drawn CCS wires and increased with rising the annealing temperature. The relationship between nanoscale α-Fe precipitation and resistivity of CCS wires has been well discussed.

Normal state resistance and low temperature magnetoresistance of superconducting cables for accelerator magnets

International Nuclear Information System (INIS)

Sampson, W.B.; Garber, M.; Ghosh, A.K.

1988-01-01

The normal state resistivity of the superconducting NbTi cable used in accelerator magnets is usually specified by the resistance per unit length at room temperature (295 K) and the residual resistance ratio (RRR). Using these resistance parameters, the amount of copper in the multifilamentary wire can be calculated. This method is consistent with the traditional etch and weigh technique, and as such is a alternative and convenient way of specifying the copper to superconductor ratio. In principle the magnetoresistance can be calculated from the RRR and the ''Kohler Plot'', for copper. In practice however, measurements of magnetoresistance for a wide variety of SSC inner cables show considerable disagreement with calculation. In this paper the magnetoresistance data on cables with RRR ranging from 50 to 175 are analyzed taking into account the conductor geometry and the effect of the small interfilamentary spacing on the resistivity of copper. 8 refs., 5 figs., 1 tab

Adsorption characteristics of Copper (Ⅱ), Zinc (Ⅱ) and Mercury (Ⅱ) by four kinds of immobilized fungi residues.

Science.gov (United States)

Li, Xia; Zhang, Dan; Sheng, Fei; Qing, Hui

2018-01-01

This study investigated the adsorption characteristics of Copper (Ⅱ), Zinc (Ⅱ) and Mercury (Ⅱ) by immobilized Flammulina velutipes, Auricularia polytricha, Pleurotus eryngii and Pleurotus ostreatus residues. Lagergren model, elovich and intraparticle diffusion model were used to present the adsorption kinetics, and it was proved that Langmuir isotherm model and pseudo-second order kinetics are the best suitable model with high correlation coefficient to characterize the adsorption process of Copper (Ⅱ), Zinc (Ⅱ) and Mercury (Ⅱ). The results showed that adsorption process finished in 120min at pH 6.0. The adsorption rate of Cu 2+ , Zn 2+ and Hg 2+ were reached to 53.8-84.1% of total in the initial 60min, and finished in 120min. Ion exchange and complexation of F. velutipes were the main mechanisms for adsorption of metal ions by characterizations of Scanning electron microscopy (SEM) and Fourier transform infrared (FTIR). In addition the functional group of cell walls such as hydroxyl, amide, carbonyl, phosphoric played a critical role in ions adsorption of edible mushroom residues. Cu 2+ , Zn 2+ and Hg 2+ in wastewater could be efficiently removed by F. velutipes residue with removal ratio of 73.11%, 66.67% and 69.35%, respectively. Copyright © 2017 Elsevier Inc. All rights reserved.

Method For Creating Corrosion Resistant Surface On An Aluminum Copper Alloy

Science.gov (United States)

Mansfeld, Florian B.; Wang, You; Lin, Simon H.

1997-06-03

A method for treating the surface of aluminum alloys hang a relatively high copper content is provided which includes the steps of removing substantially all of the copper from the surface, contacting the surface with a first solution containing cerium, electrically charging the surface while contacting the surface in an aqueous molybdate solution, and contacting the surface with a second solution containing cerium. The copper is substantially removed from the surface in the first step either by (i) contacting the surface with an acidic chromate solution or by (ii) contacting the surface with an acidic nitrate solution while subjecting the surface to an electric potential. The corrosion-resistant surface resulting from the invention is excellent, consistent and uniform throughout the surface. Surfaces treated by the invention may often be certified for use in salt-water services.

Impact of the Residual Resistivity Ratio on the Stability of Nb$_{3}$Sn Magnets

CERN Document Server

Bordini, B; Oberli, L; Rossi, L; Takala, E

2012-01-01

The CERN Large Hadron Collider (LHC) is envisioned to be upgraded in 2020 to increase the luminosity of the machine. The major upgrade will consist in replacing the NbTi quadrupole magnets of the interaction regions with larger aperture magnets. The Nb$_{3}$Sn technology is the preferred option for this upgrade. The critical current density Jc of Nb$_{3}$Sn strands have reached sufficiently high values (in excess of 3000 A/mm2 at 12 T and 4.2 K) allowing larger aperture/stronger field magnets. Nevertheless, such large Jc values may cause magneto-thermal instabilities that can drastically reduce the conductor performance by quenching the superconductor prematurely. In Nb$_{3}$Sn magnets, a relevant parameter for preventing premature quenches induced by magneto-thermal instabilities is the Residual Resistivity Ratio (RRR) of the conductor stabilizing copper. An experimental and theoretical study was carried out to investigate how much the value of the RRR affects the magnet stability and to identify the proper ...

Tendency of the 18-8 type corrosion-resistant steel to cracking in automatic building-up of copper and copper base alloys in argon

International Nuclear Information System (INIS)

Abramovich, V.R.; Andronik, V.A.

1978-01-01

Studied was the tendency of the 18-8 type corrosion-resistant steel to cracking during automatic building-up of copper and bronze in argon. The investigation was carried out on the 0kh18n10t steel in argon. It had been established, that the degree of copper penetration into the steel inceases with the increase in the time of the 0Kh18n10t steel contact with liquid copper. Liquid copper and copper base alloys have a detrimental effect on mechanical properties of the steel under external tensile load during intercontant. It is shown that in building-up of copper base alloys on the steel-0Kh18n10t, tendency of the steel to cracking decreases with increase in stiffness of a surfaced weld metal plate and with decrease in building-up energy per unit length. The causes of macrocracking in steel at building-up non-ferrous metals are explained. The technological procedures to avoid cracking are suggested

The effects of low-level ionizing radiation and copper exposure on the incidence of antibiotic resistance in lentic biofilm bacteria.

Science.gov (United States)

McArthur, J Vaun; Dicks, Christian A; Bryan, A Lawrence; Tuckfield, R Cary

2017-09-01

Environmental reservoirs of antibiotic resistant bacteria are poorly understood. Understanding how the environment selects for resistance traits in the absence of antibiotics is critical in developing strategies to mitigate this growing menace. Indirect or co-selection of resistance by environmental pollution has been shown to increase antibiotic resistance. However no attention has been given to the effects of low-level ionizing radiation or the interactions between radiation and heavy metals on the maintenance or selection for antibiotic resistance (AR) traits. Here we explore the effect of radiation and copper on antibiotic resistance. Bacteria were collected from biofilms in two ponds - one impacted by low-level radiocesium and the other an abandoned farm pond. Through laboratory controlled experiments we examined the effects of increasing concentrations of copper on the incidence of antibiotic resistance. Differences were detected in the resistance profiles of the controls from each pond. Low levels (0.01 mM) of copper sulfate increased resistance but 0.5 mM concentrations of copper sulfate depressed the AR response in both ponds. A similar pattern was observed for levels of multiple antibiotic resistance per isolate. The first principal component response of isolate exposure to multiple antibiotics showed significant differences among the six isolate treatment combinations. These differences were clearly visualized through a discriminant function analysis, which showed distinct antibiotic resistance response patterns based on the six treatment groups. Copyright © 2017 Elsevier Ltd. All rights reserved.

Research surface resistance of copper normal and abnormal skin-effects depending on the frequency of electromagnetic field

International Nuclear Information System (INIS)

Kutovyi, V.A.; Komir, A.I.

2013-01-01

The results of the frequency dependence of surface resistance of copper in diffuse and specular reflection of electrons from the conductive surface of the high-frequency resonance of the system depending on the frequency of the electromagnetic field in the normal and anomalous skin effect. Found, the surface resistance of copper is reduced by more than 10 times at the temperature of liquid helium, as compared with a surface resistivity at room temperature, at frequencies f ≤ 173 MHz, for diffuse reflection of conduction electrons from the surface of the conductive layer, and the specular reflection - at frequencies f ≤ 346 MHz

Investigation of Superficial Resistance of Different Purity Copper at Boiling Nitrogen Temperature Depending on Treatment of Current-Conducting Layer

International Nuclear Information System (INIS)

Kutovoj, V.A.; Nikolaenko, A.A.; Stoev, P.I.

2007-01-01

Results of this scientific work show influence of annealing temperature and deformation degree of initial MOB copper and after electron beam refining on superficial resistance at temperature of boiling nitrogen. It is shown, that 30 % deformation and annealing in 873...923 K temperature range results in appreciable reduction of superficial resistance at the investigated samples of copper. The lowest values of superficial resistance after thermal and mechanical treatment were observed in the samples after electron beam refinement

Fabrication of silicon-embedded low resistance high-aspect ratio planar copper microcoils

Science.gov (United States)

Syed Mohammed, Zishan Ali; Puiu, Poenar Daniel; Aditya, Sheel

2018-01-01

Low resistance is an important requirement for microcoils which act as a signal receiver to ensure low thermal noise during signal detection. High-aspect ratio (HAR) planar microcoils entrenched in blind silicon trenches have features that make them more attractive than their traditional counterparts employing electroplating through a patterned thick polymer or achieved through silicon vias. However, challenges met in fabrication of such coils have not been discussed in detail until now. This paper reports the realization of such HAR microcoils embedded in Si blind trenches, fabricated with a single lithography step by first etching blind trenches in the silicon substrate with an aspect ratio of almost 3∶1 and then filling them up using copper electroplating. The electroplating was followed by chemical wet etching as a faster way of removing excess copper than traditional chemical mechanical polishing. Electrical resistance was further reduced by annealing the microcoils. The process steps and challenges faced in the realization of such structures are reported here followed by their electrical characterization. The obtained electrical resistances are then compared with those of other similar microcoils embedded in blind vias.

Effects of chlortetracycline and copper supplementation on the prevalence, distribution, and quantity of antimicrobial resistance genes in the fecal metagenome of weaned pigs.

Science.gov (United States)

Agga, Getahun E; Scott, H Morgan; Vinasco, Javier; Nagaraja, T G; Amachawadi, Raghavendra G; Bai, Jianfa; Norby, Bo; Renter, David G; Dritz, Steve S; Nelssen, Jim L; Tokach, Mike D

2015-05-01

Use of in-feed antibiotics such as chlortetracycline (CTC) in food animals is fiercely debated as a cause of antimicrobial resistance in human pathogens; as a result, alternatives to antibiotics such as heavy metals have been proposed. We used a total community DNA approach to experimentally investigate the effects of CTC and copper supplementation on the presence and quantity of antimicrobial resistance elements in the gut microbial ecology of pigs. Total community DNA was extracted from 569 fecal samples collected weekly over a 6-week period from groups of 5 pigs housed in 32 pens that were randomized to receive either control, CTC, copper, or copper plus CTC regimens. Qualitative and quantitative PCR were used to detect the presence of 14 tetracycline resistance (tet) genes and to quantify gene copies of tetA, tetB, blaCMY-2 (a 3rd generation cephalosporin resistance gene), and pcoD (a copper resistance gene), respectively. The detection of tetA and tetB decreased over the subsequent sampling periods, whereas the prevalence of tetC and tetP increased. CTC and copper plus CTC supplementation increased both the prevalence and gene copy numbers of tetA, while decreasing both the prevalence and gene copies of tetB. In summary, tet gene presence was initially very diverse in the gut bacterial community of weaned pigs; thereafter, copper and CTC supplementation differentially impacted the prevalence and quantity of the various tetracycline, ceftiofur and copper resistance genes resulting in a less diverse gene population. Published by Elsevier B.V.

Improvement of oxidation resistance of copper by atomic layer deposition

Energy Technology Data Exchange (ETDEWEB)

Chang, M.L.; Cheng, T.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 106, Taiwan (China); Lin, M.C. [Research Center for Biomedical Devices and Prototyping Production, Taipei Medical University, No. 250, Wu-Hsing Street, Taipei 110, Taiwan (China); Lin, H.C., E-mail: hclinntu@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 106, Taiwan (China); Chen, M.J., E-mail: mjchen@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 106, Taiwan (China)

2012-10-01

Graphical abstract: Results of glancing incident angle diffraction (GIXD) show the bare-Cu specimen was attacked by oxidation, whereas the coated-Cu specimens prevented from this problem. Highlights: Black-Right-Pointing-Pointer Deposition of Al{sub 2}O{sub 3} films on pure copper by an atomic layer deposition (ALD) technique. Black-Right-Pointing-Pointer Analysis of properties of the films coated at various substrate temperatures using the ALD technique. Black-Right-Pointing-Pointer Identification of the improvement of oxidation resistance of pure copper by the ALD-Al{sub 2}O{sub 3} films. Black-Right-Pointing-Pointer Assessment of the durability of the ALD-Al{sub 2}O{sub 3} films by adhesion strength. - Abstract: Al{sub 2}O{sub 3} films were deposited by the atomic layer deposition (ALD) technique onto pure copper at temperatures in the range 100-200 Degree-Sign C. The chemical composition, microstructure, and mechanic properties of the ALD-deposited Al{sub 2}O{sub 3} films were systematically analyzed. The variations in the film characteristics with substrate temperature were observed. Oxidation trials revealed that 20-nm-thick Al{sub 2}O{sub 3} films deposited at a substrate temperature as low as 100 Degree-Sign C suppress oxidative attack on pure copper. The Al{sub 2}O{sub 3} films also showed excellent durability of adhesion strength, according to predictions using the Coffin-Manson model based on the results of accelerated temperature cycling tests. These features indicate that ALD-deposited Al{sub 2}O{sub 3} film is a very promising candidate to be a protective coating for pure copper.

Resistivity of epitaxial copper nanolines with trapezoidal cross-section

International Nuclear Information System (INIS)

Lu, Zonghuan; Frey, David M.; Merkh, Thomas; Lord, Robert; Washington, Morris A.; Lu, Toh-Ming

2016-01-01

The resistivity of epitaxial Cu nanolines with line width ranging from 20 to 180 nm and line height from 40 to 50 nm was measured using a four-point probe technique. The Cu nanolines were fabricated using ebeam lithography with a polymethyl methacrylate bilayer resist system for improved line edge smoothness. The cross-section profile of the lines was examined using the focused ion beam milling technique. The results indicate that the cross-section should be more accurately described as trapezoidal rather than as rectangular. Using the trapezoidal profile, the electrical resistivity was calculated from the measured resistance data. Modeling based on the Fuchs–Sondheimer (FS) theory using the trapezoidal profile was also carried out. The results were compared with the experimentally calculated resistivity data. For Cu lines with line width less than 30 nm, the measured resistivity was shown to be up to 20% higher than the value predicted by the FS theory. Further examination of Cu lines using atomic force microscopy and scanning electron microscopy was conducted to extract the surface roughness and line edge roughness information. Their contribution to the resistivity increase was estimated to be only up to 3% for the Cu nanolines fabricated, which did not significantly contribute to the overall resistivity for Cu lines with line width less than 30 nm. Other possible factors affecting the resistivity of the Cu nanolines were also discussed, including the oxide formation on the surface of the Cu lines. - Highlights: • Epitaxial copper nanolines were fabricated using ebeam lithography. • The effect of line cross-section profiles on electrical resistivity was studied. • Trapezoidal cross−section gives better resistivity estimation for lines down to 20 nm. • Impact of surface roughness and line edge roughness to resistivity is small. • Oxidization layer has an effect on the resistivity increase.

Effect of Contact Pressure on the Resistance Contact Value and Temperature Changes in Copper Busbar Connection

Directory of Open Access Journals (Sweden)

Agus Risdiyanto

2012-12-01

Full Text Available This paper discussed the influence of tightness or contacts pressure on copper busbar joints to determine changes in the value of the initial contact resistance and the maximum temperature at the joint due to high current load. The test sample was copper busbar 3 x 30 mm with configuration of bolted overlapping joint. Increasing contact pressure at the joint was measured to find out its effect on the value of contact resistance. The applied pressure was 6 to 36 MPa. Procedure of contact resistance measurement refer to the ASTM B539 standard using four-wire method. The sample subsequently loaded with the current of 350 A for 60 minutes and the maximum temperature at the joint was measured. The result showed that increasing contact pressure at the busbar joint will reduce the contact resistance and maximum temperature. The increase of contact pressure from 6 to 30 MPa causes decreasing contact resistance from 16 μΩ to 11 μΩ. Further increasing of contact pressure more than 30 MPa did not affect the contact resistance significantly. The lowest temperatur of busbar joint of 54°C was reached at a contact pressure of 36 Mpa.

The effect of boron implantation on the corrosion behaviour, microhardness and contact resistance of copper and silver surfaces

International Nuclear Information System (INIS)

Henriksen, O.; Johnson, E.; Johansen, A.; Sarholt-Kristensen, L.

1986-01-01

In order to investigate the influence of boron implantation on the corrosion resistance of electrical contacts, a number of pure copper, pure silver and copper edge connector samples have been implanted with boron (40 keV) to fluences of 5.10 20 m -2 and 2.10 21 m -2 . Atmospheric corrosion tests of the implanted species were conducted using the following exposures: H 2 S (12.5 ppm, 4 days), SO 2 (25 ppm, 21 days), saltfog (5% NaCl, 1 day), moist air (93% RH, 56 days), and hot/dry air (70 C, 56 days). The boron implantations lead to a significant reduction in the sulphidation rate of copper and silver. The corrosive film formed during exposure in H 2 S and SO 2 atmospheres is confined to pitted regions on the implanted areas, while a thick and relatively uniform film formation is observed on the unimplanted samples. The corrosion resistance of copper and silver in saltfog atmosphere is somewhat improved by boron implantation, whilst the results from exposures to moist air or hot/dry air are inconclusive. The improved corrosion behaviour is accompanied by an increase in the contact resistance and in the microhardness of the implanted samples. (orig.)

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

International Nuclear Information System (INIS)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-01-01

Highlights: • Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film. • Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars. • New flow isreduced cost, simplified process and elevated productivity. - Abstract: The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O_2−CF_4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of C−O, O−C=O, C=O and −NO_2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Huge residual resistivity in the quantum critical region of CeAgSb2

International Nuclear Information System (INIS)

Nakashima, Miho; Kirita, Shingo; Asai, Rihito; Kobayashi, Tatsuo C; Okubo, Tomoyuki; Yamada, Mineko; Thamizhavel, Arumugam; Inada, Yoshihiko; Settai, Rikio; Galatanu, Andre; Yamamoto, Etsuji; Ebihara, Takao; Onuki, Yoshichika

2003-01-01

We have studied the effect of pressure on the electrical resistivity of a high-quality single crystal CeAgSb 2 which has a small net ferromagnetic moment of 0.4μ B /Ce. The magnetic ordering temperature T ord = 9.7 K decreases with increasing pressure p and disappears at a critical pressure p c ≅ 3.3 GPa. The residual resistivity, which is close to zero up to 3 GPa, increases steeply above 3 GPa, reaching 55μΩ cm at p c . A huge residual resistivity is found to appear when the magnetic order disappears. (letter to the editor)

Copper Determination in Gunshot Residue by Cyclic Voltammetric and Inductive Coupled Plasma-Optical Emission Spectroscopy

Directory of Open Access Journals (Sweden)

Mohd Hashim Nurul’Afiqah Hashimah

2016-01-01

Full Text Available Analysis of gunshot residue (GSR is a crucial evidences for a forensic analyst in the fastest way. GSR analysis insists a suitable method provides a relatively simple, rapid and precise information on the spot at the crime scene. Therefore, the analysis of Cu(II in GSR using cyclic voltammetry (CV on screen printed carbon electrode (SPCE is a better choice compared to previous alternative methods such as Inductive Coupled Plasma-Optical Emission Spectroscopy (ICP-OES those required a long time for analysis. SPCE is specially designed to handle with microvolumes of sample such as GSR sample. It gives advantages for identification of copper in GSR on-site preliminary test to prevent the sample loss on the process to be analyzed in the laboratory. SPCE was swabbed directly on the shooter’s arm immediately after firing and acetate buffer was dropped on SPCE before CV analysis. For ICP-OES analysis, cotton that had been soaked in 0.5 M nitric acid was swabbed on the shooter’s arm immediately after firing and kept in a tightly closed sampling tube. Gold coated SPCE that had been through nanoparticles modification exhibits excellent performance on voltammograms. The calibration was linear from 1 to 50 ppm of copper, the limit of detection for copper was 0.3 ppm and a relative standard deviation was 6.1 %. The method was successfully applied to the determination of copper in GSR. The Cu determination on SPCE was compared and validated by ICP-OES method with 94 % accuracy.

Grain boundary corrosion of copper canister material

International Nuclear Information System (INIS)

Fennell, P.A.H.; Graham, A.J.; Smart, N.R.; Sofield, C.J.

2001-03-01

The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister. The potential for grain boundary corrosion was investigated by exposing copper specimens, which had undergone different heat treatments and hence had different grain sizes, to aerated artificial bentonite-equilibrated groundwater with two concentrations of chloride, for increasing periods of time. The degree of grain boundary corrosion was determined by atomic force microscopy (AFM) and optical microscopy. AFM showed no increase in grain boundary 'ditching' for low chloride groundwater. In high chloride groundwater the surface was covered uniformly with a fine-grained oxide. No increases in oxide thickness were observed. No significant grain boundary attack was observed using optical microscopy either. The work suggests that in aerated artificial groundwaters containing chloride ions, grain boundary corrosion of copper is unlikely to adversely affect SKB's copper canisters

Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network

Science.gov (United States)

Valencia, Daniel; Wilson, Evan; Jiang, Zhengping; Valencia-Zapata, Gustavo A.; Wang, Kuang-Chung; Klimeck, Gerhard; Povolotskyi, Michael

2018-04-01

Orientation effects on the specific resistance of copper grain boundaries are studied systematically with two different atomistic tight-binding methods. A methodology is developed to model the specific resistance of grain boundaries in the ballistic limit using the embedded atom model, tight- binding methods, and nonequilibrium Green's functions. The methodology is validated against first-principles calculations for thin films with a single coincident grain boundary, with 6.4% deviation in the specific resistance. A statistical ensemble of 600 large, random structures with grains is studied. For structures with three grains, it is found that the distribution of specific resistances is close to normal. Finally, a compact model for grain-boundary-specific resistance is constructed based on a neural network.

Copper and copper-nickel-alloys - An overview

Energy Technology Data Exchange (ETDEWEB)

Klassert, Anton; Tikana, Ladji [Deutsches Kupferinstitut e.V. Am Bonneshof 5, 40474 Duesseldorf (Germany)

2004-07-01

With the increasing level of industrialization the demand for and the number of copper alloys rose in an uninterrupted way. Today, the copper alloys take an important position amongst metallic materials due to the large variety of their technological properties and applications. Nowadays there exist over 3.000 standardized alloys. Copper takes the third place of all metals with a worldwide consumption of over 15 millions tons per year, following only to steel and aluminum. In a modern industrial society we meet copper in all ranges of the life (electro-technology, building and construction industry, mechanical engineering, automotive, chemistry, offshore, marine engineering, medical applications and others.). Copper is the first metal customized by humanity. Its name is attributed to the island Cyprus, which supplied in the antiquity copper to Greece, Rome and the other Mediterranean countries. The Romans called it 'ore from Cyprus' (aes cyprium), later cuprum. Copper deposited occasionally also dapper and could be processed in the recent stone age simply by hammering. Already in early historical time copper alloys with 20 to 50 percent tin was used for the production of mirrors because of their high reflecting power. Although the elementary nickel is an element discovered only recently from a historical perspective, its application in alloys - without any knowledge of the alloy composition - occurred at least throughout the last 2.000 years. The oldest copper-nickel coin originates from the time around 235 B.C.. Only around 1800 AD nickel was isolated as a metallic element. In particular in the sea and offshore technology copper nickel alloys found a broad field of applications in piping systems and for valves and armatures. The excellent combination of characteristics like corrosion resistance, erosion stability and bio-fouling resistance with excellent mechanical strength are at the basis of this success. An experience of many decades supports the use

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Energy Technology Data Exchange (ETDEWEB)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China); Gong, Lijun [Research and Development Department, Guangzhou Fastprint Circuit Tech Co., Ltd., Guangzhou 510663 (China); He, Wei, E-mail: heweiz@uestc.edu.cn [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China); Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou 515000 (China)

2017-07-31

Highlights: • Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film. • Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars. • New flow isreduced cost, simplified process and elevated productivity. - Abstract: The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O{sub 2}−CF{sub 4} low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of C−O, O−C=O, C=O and −NO{sub 2} by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Effect of oxide insertion layer on resistance switching properties of copper phthalocyanine

Science.gov (United States)

Joshi, Nikhil G.; Pandya, Nirav C.; Joshi, U. S.

2013-02-01

Organic memory device showing resistance switching properties is a next-generation of the electrical memory unit. We have investigated the bistable resistance switching in current-voltage (I-V) characteristics of organic diode based on copper phthalocyanine (CuPc) film sandwiched between aluminum (Al) electrodes. Pronounced hysteresis in the I-V curves revealed a resistance switching with on-off ratio of the order of 85%. In order to control the charge injection in the CuPc, nanoscale indium oxide buffer layer was inserted to form Al/CuPc/In2O3/Al device. Analysis of I-V measurements revealed space charge limited switching conduction at the Al/CuPc interface. The traps in the organic layer and charge blocking by oxide insertion layer have been used to explain the absence of resistance switching in the oxide buffer layered memory device cell. Present study offer potential applications for CuPc organic semiconductor in low power non volatile resistive switching memory and logic circuits.

Damage saturation effects on volume and resistivity changes induced by fission-fragment irradiation of copper

International Nuclear Information System (INIS)

Birtcher, R.C.; Blewitt, T.H.

1981-01-01

Damage production and saturation has been monitored in copper by simultaneous electrical resistivity- and length-change measurements. Damage was introduced by 235 U fission fragments at either 7 or 85 K. At both temperatures, the resistivity and length changes were linearly related to each other for resistivity changes less than 80% saturation resistivity. The linear relationship was the same for both irradiation temperatures and was the same as that observed previously for 10 B fission fragment irrations at 4 K. These results are interpreted to show that the resistivity change per defect is unaffected by irradiation under conditions which lead to interstitial clustering. (orig.)

Crystal structure and dimerization equilibria of PcoC, a methionine-rich copper resistance protein from Escherichia coli

Energy Technology Data Exchange (ETDEWEB)

Wernimont, A.K.; Huffman, D.L.; Finney, L.A.; Demeler, B.; O' Halloran, T.V.; Rosenzweig, A.C.

2010-03-08

PcoC is a soluble periplasmic protein encoded by the plasmid-born pco copper resistance operon of Escherichia coli. Like PcoA, a multicopper oxidase encoded in the same locus and its chromosomal homolog CueO, PcoC contains unusual methionine rich sequences. Although essential for copper resistance, the functions of PcoC, PcoA, and their conserved methionine-rich sequences are not known. Similar methionine motifs observed in eukaryotic copper transporters have been proposed to bind copper, but there are no precedents for such metal binding sites in structurally characterized proteins. The high-resolution structures of apo PcoC, determined for both the native and selenomethionine-containing proteins, reveal a seven-stranded barrel with the methionines unexpectedly housed on a solvent-exposed loop. Several potential metal-binding sites can be discerned by comparing the structures to spectroscopic data reported for copper-loaded PcoC. In the native structure, the methionine loop interacts with the same loop on a second molecule in the asymmetric unit. In the selenomethionine structure, the methionine loops are more exposed, forming hydrophobic patches on the protein surface. These two arrangements suggest that the methionine motifs might function in protein-protein interactions between PcoC molecules or with other methionine-rich proteins such as PcoA. Analytical ultracentrifugation data indicate that a weak monomer-dimer equilibrium exists in solution for the apo protein. Dimerization is significantly enhanced upon binding Cu(I) with a measured {Delta}({Delta}G{sup o}) {le} -8.0 kJ/mole, suggesting that copper might bind at the dimer interface.

Copper, lead and zinc production

International Nuclear Information System (INIS)

Ayers, J.; Ternan, S.

2001-01-01

This chapter provides information on the by-products and residues generated during the production of copper, lead and zinc. The purpose of this chapter is to describe by-products and residues which are generated, how these may be avoided or minimised, and available options for the utilization and management of residues. (author)

Antibiotic resistance, ability to form biofilm and susceptibility to copper alloys of selected staphylococcal strains isolated from touch surfaces in Polish hospital wards

Directory of Open Access Journals (Sweden)

Anna Różańska

2017-08-01

Full Text Available Abstract Background Despite the employment of sanitary regimes, contact transmission of the aetiological agents of hospital infections is still exceedingly common. The issue of microbe transmission becomes particularly important when facing multidrug-resistant microorganisms such as methicillin-resistant staphylococci. In the case of deficiencies in cleaning and disinfection procedures, hospital equipment made of copper alloys can play an important role, complementing traditional hospital hygiene procedures. The objective of this study was to characterize staphylococcal strains isolated from touch surfaces in Polish hospital wards in terms of their drug resistance, ability to form biofilm and susceptibility to antimicrobial activity of copper alloys. Methods The materials for the study were 95 staphylococcal strains isolated from touch surfaces in 13 different hospital wards from Małopolska province (the south of Poland. Phenotypic and genotypic antibiotic resistance were checked for erythromycin, clindamycin, gentamycin, ciprofloxacin, trimethoprim/sulfamethoxazole and mupirocin. Biofilm formation ability for the tested strains was checked with the use of culture on Congo red agar. Susceptibility to copper, tin bronze, brass and new silver was tested using a modification of the Japanese standard. Results Over 67% of the analysed staphylococcal strains were methicillin-resistant (MR. Four strains were resistant to all of the tested antibiotics, and 14 were resistant to all except mupirocin. Strains classified as MR had significantly increased resistance to the remaining antibiotic groups. About one-third of the analysed strains revealed biofilm-forming ability. Among the majority of species, biofilm-forming and non-biofilm-forming strains were distributed evenly; in the case of S. haemolyticus only, negative strains accounted for 92.8%. Susceptibility to copper alloys was different between strains and rather lower than in the case of the SA

Recovery of metal values from copper slag and reuse of residual secondary slag.

Science.gov (United States)

Sarfo, Prince; Das, Avimanyu; Wyss, Gary; Young, Courtney

2017-12-01

Resource and environmental factors have become major forces in mining and metallurgy sectors driving research for sustainability purposes. The concept of zero-waste processing has been gaining ground readily. The scant availability of high quality raw materials has forced the researchers to shift their focus to recycling while the exceedingly stringent environmental regulations have forced researchers to explore new frontiers of minimizing/eliminating waste generation. The present work is aimed at addressing both aspects by employing recycling to generate wealth from copper slag and producing utilizable materials at the same time thus restoring the ecosystem. Copper slag was characterized and processed. The pyro-metallurgical processing prospects to generate utilizable materials were arrived at through rigorous thermodynamic analysis. Carbothermal reduction at elevated temperature (near 1440°C) helped recover a majority of the metal values (e.g., Fe, Cu and Mo) into the iron-rich alloy product which can be a feed material for steel making. On the other hand, the non-metallic residue, the secondary slag, can be used in the glass and ceramic industries. Reduction time and temperature and carbon content were shown to be the most important process variables for the reaction which were optimized to identify the most favored operating regime that maximizes the metal recovery and simultaneously maximizes the hardness of the secondary slag and minimizes its density, the two major criteria for the secondary slag product to be utilizable. The flux addition level was shown to have relatively less impact on the process performance if these are maintained at an adequate level. The work established that the copper slag, a waste material, can be successfully processed to generate reusable products through pyrometallurgical processing. Copyright © 2017 Elsevier Ltd. All rights reserved.

The copper metallome in prokaryotic cells

DEFF Research Database (Denmark)

Rensing, Christopher Günther T; Alwathnani, Hend A.; McDevitt, Sylvia F.

2016-01-01

and protozoans also utilize heavy metals such as copper and zinc in the killing of phagocytized bacteria. It seems, therefore, not surprising that many bacteria including pathogens harbor additional copper resistance determinants. However, the occurrence of these resistance determinants is more widespread than...

3D local structure around copper site of rabbit prion-related protein: Quantitative determination by XANES spectroscopy combined with multiple-scattering calculations

Science.gov (United States)

Cui, P. X.; Lian, F. L.; Wang, Y.; Wen, Yi; Chu, W. S.; Zhao, H. F.; Zhang, S.; Li, J.; Lin, D. H.; Wu, Z. Y.

2014-02-01

Prion-related protein (PrP), a cell-surface copper-binding glycoprotein, is considered to be responsible for a number of transmissible spongiform encephalopathies (TSEs). The structural conversion of PrP from the normal cellular isoform (PrPC) to the post-translationally modified form (PrPSc) is thought to be relevant to Cu2+ binding to histidine residues. Rabbits are one of the few mammalian species that appear to be resistant to TSEs, because of the structural characteristics of the rabbit prion protein (RaPrPC) itself. Here we determined the three-dimensional local structure around the C-terminal high-affinity copper-binding sites using X-ray absorption near-edge structure combined with ab initio calculations in the framework of the multiple-scattering (MS) theory. Result shows that two amino acid resides, Gln97 and Met108, and two histidine residues, His95 and His110, are involved in binding this copper(II) ion. It might help us understand the roles of copper in prion conformation conversions, and the molecular mechanisms of prion-involved diseases.

Grain boundary corrosion of copper canister weld material

International Nuclear Information System (INIS)

Gubner, Rolf; Andersson, Urban; Linder, Mats; Nazarov, Andrej; Taxen, Claes

2006-01-01

The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow, they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister, based on the recommendations of the report SKB-TR--01-09 (INIS ref. 32025363). Grain boundary corrosion of copper is not expected to be a problem for the copper canisters in a repository. However, as one step in the experimental verification it is necessary to study grain boundary corrosion of copper in an environment where it may occur. A literature study aimed to find one or several solutions that are aggressive with respect to grain boundary corrosion of copper. Copper specimens cut from welds of real copper canisters where exposed to aerated ammonium hydroxide solution for a period of 14 days at 80 degrees C and 10 bar pressure. The samples were investigated prior to exposure using the scanning Kelvin probe technique to characterize anodic and cathodic areas on the samples. The degree of corrosion was determined by optical microscopy. No grain boundary corrosion could be observed in the autoclave experiments, however, a higher rate of corrosion was observed for the weld material compared to the base material. The work suggests that grain boundary corrosion of copper weld material is most unlikely to adversely affect SKB's copper canisters under the conditions in the repository

Grain boundary corrosion of copper canister weld material

Energy Technology Data Exchange (ETDEWEB)

Gubner, Rolf; Andersson, Urban; Linder, Mats; Nazarov, Andrej; Taxen, Claes [Corrosion and Metals Research Inst. (KIMAB), Stockholm (Sweden)

2006-01-15

The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow, they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister, based on the recommendations of the report SKB-TR--01-09 (INIS ref. 32025363). Grain boundary corrosion of copper is not expected to be a problem for the copper canisters in a repository. However, as one step in the experimental verification it is necessary to study grain boundary corrosion of copper in an environment where it may occur. A literature study aimed to find one or several solutions that are aggressive with respect to grain boundary corrosion of copper. Copper specimens cut from welds of real copper canisters where exposed to aerated ammonium hydroxide solution for a period of 14 days at 80 degrees C and 10 bar pressure. The samples were investigated prior to exposure using the scanning Kelvin probe technique to characterize anodic and cathodic areas on the samples. The degree of corrosion was determined by optical microscopy. No grain boundary corrosion could be observed in the autoclave experiments, however, a higher rate of corrosion was observed for the weld material compared to the base material. The work suggests that grain boundary corrosion of copper weld material is most unlikely to adversely affect SKB's copper canisters under the conditions in the repository.

Oxidation-assisted graphene heteroepitaxy on copper foil

OpenAIRE

Reckinger, Nicolas; Tang, Xiaohui; Joucken, Frédéric; Lajaunie, Luc; Arenal, Raul; Dubois, Emmanuel; Hackens, Benoît; Henrard, Luc; Colomer, Jean-François

2016-01-01

We propose an innovative, easy-to-implement approach to synthesize large-area singlecrystalline graphene sheets by chemical vapor deposition on copper foil. This method doubly takes advantage of residual oxygen present in the gas phase. First, by slightly oxidizing the copper surface, we induce grain boundary pinning in copper and, in consequence, the freezing of the thermal recrystallization process. Subsequent reduction of copper under hydrogen suddenly unlocks the delayed reconstruction, f...

A cytosolic copper storage protein provides a second level of copper tolerance in Streptomyces lividans.

Science.gov (United States)

Straw, Megan L; Chaplin, Amanda K; Hough, Michael A; Paps, Jordi; Bavro, Vassiliy N; Wilson, Michael T; Vijgenboom, Erik; Worrall, Jonathan A R

2018-01-24

Streptomyces lividans has a distinct dependence on the bioavailability of copper for its morphological development. A cytosolic copper resistance system is operative in S. lividans that serves to preclude deleterious copper levels. This system comprises of several CopZ-like copper chaperones and P 1 -type ATPases, predominantly under the transcriptional control of a metalloregulator from the copper sensitive operon repressor (CsoR) family. In the present study, we discover a new layer of cytosolic copper resistance in S. lividans that involves a protein belonging to the newly discovered family of copper storage proteins, which we have named Ccsp (cytosolic copper storage protein). From an evolutionary perspective, we find Ccsp homologues to be widespread in Bacteria and extend through into Archaea and Eukaryota. Under copper stress Ccsp is upregulated and consists of a homotetramer assembly capable of binding up to 80 cuprous ions (20 per protomer). X-ray crystallography reveals 18 cysteines, 3 histidines and 1 aspartate are involved in cuprous ion coordination. Loading of cuprous ions to Ccsp is a cooperative process with a Hill coefficient of 1.9 and a CopZ-like copper chaperone can transfer copper to Ccsp. A Δccsp mutant strain indicates that Ccsp is not required under initial copper stress in S. lividans, but as the CsoR/CopZ/ATPase efflux system becomes saturated, Ccsp facilitates a second level of copper tolerance.

Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain

International Nuclear Information System (INIS)

Glushko, O.; Marx, V.M.; Kirchlechner, C.; Zizak, I.; Cordill, M.J.

2014-01-01

Substantial recovery (decrease) of electrical resistance during and after unloading is demonstrated for copper films on polyethylene terephthalate substrates subjected to a tensile strain with different peak values. Particularly, the films strained to 5% exhibit full resistance recovery after unloading despite clearly visible plastic deformation of the film. The recovery of electrical resistance in connection with the mechanical behavior of film/substrate couple is discussed with the help of in situ scanning electron microscopy and X-ray diffraction analysis. - Highlights: • Tensile tests on 200 nm Cu films on PET substrate are performed. • Electrical resistance is recorded in-situ during loading and unloading. • Significant recovery (decrease) of resistance is observed during and after unloading. • Films strained to 5% demonstrate full resistance recovery. • Viscoelastic relaxation of PET is responsible for recovery of Cu film resistance

Superhydrophobic copper surfaces fabricated by fatty acid soaps in aqueous solution for excellent corrosion resistance

Energy Technology Data Exchange (ETDEWEB)

Xu, Wenlong; Hu, Yuanyuan; Bao, Wenda; Xie, Xiaoyu; Liu, Yiran; Song, Aixin, E-mail: songaixin@sdu.edu.cn; Hao, Jingcheng

2017-03-31

Highlights: • The superhydrophobic property can be realized in a much quicker process (7.5 min) in aqueous solution than in ethanol. • The fabrication process of superhydrophobic metal surfaces greatly increases the safety in industrial manufacture in commercial scale. • The superhydrophobic copper surfaces show excellent corrosion resistance. - Abstract: A simple and safe one-step immersion method was developed to obtain the stable superhydrophobic copper surfaces with excellent corrosion resistance ability using fatty acids in water-medium instead of ethanol. An organic alkali, N,N-dimethylcyclohexylamine (DMCHA), was chosen to solve the poor solubility of fatty acids in water and the high Krafft point of carboxylate salts with inorganic counterions. The superhydrophobic property can be realized in a much quicker process (7.5 min) in aqueous solution than in ethanol (more than 2 d), which is universally feasible for the fabrication of superhydrophobic metal surfaces in industry scale, thereby greatly increasing the safety in industrial manufacture.

Copper-resistant bacteria enhance plant growth and copper phytoextraction.

Science.gov (United States)

Yang, Renxiu; Luo, Chunling; Chen, Yahua; Wang, Guiping; Xu, Yue; Shen, Zhenguo

2013-01-01

In this study, we investigated the role of rhizospheric bacteria in solubilizing soil copper (Cu) and promoting plant growth. The Cu-resistant bacterium DGS6 was isolated from a natural Cu-contaminated soil and was identified as Pseudomonas sp. DGS6. This isolate solubilized Cu in Cu-contaminated soil and stimulated root elongation of maize and sunflower. Maize was more sensitive to inoculation with DGS6 than was sunflower and exhibited greater root elongation. In pot experiment, inoculation with DGS6 increased the shoot dry weight of maize by 49% and sunflower by 34%, and increased the root dry weight of maize by 85% and sunflower by 45%. Although the concentrations of Cu in inoculated and non-inoculated seedlings did not differ significantly, the total accumulation of Cu in the plants increased after inoculation. DGS6 showed a high ability to solubilize P and produce iron-chelating siderophores, as well as significantly improved the accumulation of P and Fe in both maize and sunflower shoots. In addition, DGS6 produced indole-3-acetic acid (IAA) and ACC deaminase, which suggests that it may modulate ethylene levels in plants. The bacterial strain DGS6 could be a good candidate for re-vegetation of Cu-contaminated sites. Supplemental materials are available for this article. Go to the publisher's online edition of International Journal of Phytoremediation to view the supplemental file.

Residual stress effects on the impact resistance and strength of fiber composites

Science.gov (United States)

Chamis, C. C.

1973-01-01

Equations have been derived to predict degradation effects of microresidual stresses on impact resistance of unidirectional fiber composites. Equations also predict lamination residual stresses in multilayered angle ply composites.

APPLICATION OF METAL RESISTANT BACTERIA BY MUTATIONAL ENHANCMENT TECHNIQUE FOR BIOREMEDIATION OF COPPER AND ZINC FROM INDUSTRIAL WASTES

Directory of Open Access Journals (Sweden)

M. R. Shakibaie ، A. Khosravan ، A. Frahmand ، S. Zare

2008-10-01

Full Text Available In this research, using mutation in the metal resistant bacteria, the bioremediation of the copper and zinc from copper factory effluents was investigated. Wastewater effluents from flocculation and rolling mill sections of a factory in the city of Kerman were collected and used for further experiments. 20 strains of Pseudomonas spp. were isolated from soil and effluents surrounding factory and identified by microbiological methods. Minimum inhibitory concentrations for copper (Cu and zinc (Zn were determined by agar dilution method. Those strains that exhibited highest minimum inhibitory concentrations values to the metals (5mM were subjected to 400-3200 mg/L concentrations of the three mutagenic agents, acriflavine, acridine orange and ethidium bromide. After determination of subinhibitory concentrations, the minimum inhibitory concentrations values for copper and zinc metal ions were again determined, which showed more than 10 fold increase in minimum inhibitory concentrations value (10 mM for Cu and 20 mM for Zn with P≤0.05. The atomic absorption spectroscopy of dried biomass obtained from resistant strains after exposure to mutagenic agents revealed that strains 13 accumulate the highest amount of intracellular copper (0.35% Cu/mg dried biomass and strain 10 showed highest accumulation of zinc (0.3% Zn/mg dried biomass respectively with P≤0.05. From above results it was concluded that the treatment of industrial waste containing heavy metals by artificially mutated bacteria may be appropriate solution for effluent disposal problems.

Tribological properties of copper-based composites with copper coated NbSe2 and CNT

International Nuclear Information System (INIS)

Chen, Beibei; Yang, Jin; Zhang, Qing; Huang, Hong; Li, Hongping; Tang, Hua; Li, Changsheng

2015-01-01

Graphical abstract: Morphology of copper coated NbSe 2 and CNT; friction coefficient and wear rate of copper-based composites. - Highlights: • NbSe 2 and CNT were coated with copper layers by the means of electroless plating. • The mechanical and tribological properties of copper composites were studied. • The enhancement mechanisms of copper coated NbSe 2 and CNT were proposed. • Copper–copper coated (12 wt.%NbSe 2 –3 wt.%CNT) composite had the best wear resistance. - Abstract: Copper-based composites with copper coated NbSe 2 and/or CNT were fabricated by the powder metallurgy technique. The morphology and phase composition of copper coated NbSe 2 and carbon nanotube (CNT) were observed using high solution transmission electronic microscope (HRTEM), scanning electronic microscope (SEM equipped with EDS) and X-ray diffraction (XRD). The density, hardness, and bending strength of as-prepared copper-based composites were measured, and their tribological properties were investigated using UMT-2 tester. Results indicated that all copper-based composites showed decreased density and bending strength, but increased hardness in comparison with copper matrix. Besides, the incorporation of copper coated NbSe 2 improved the friction-reducing and anti-wear properties of copper matrix. Addition of copper coated CNT greatly enhanced the mechanical and tribological properties. In particular, when the content of copper coated CNT was 3 wt.%, the corresponding composite exhibited the best tribological properties. This was because NbSe 2 was distributed chaotically in matrix, which greatly improved the friction-reducing property of copper, while CNT with superior mechanical strength enhanced the wear resistance by increasing the load-carrying capacity. More importantly, copper layers coated on NbSe 2 and CNT favored the good interfacial combination between fillers and copper matrix showing beneficial effect for the stresses transferring from matrix to fillers

Botanicals and Phosphonate Show Potential to Replace Copper for Control of Potato Late Blight

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Hans-Rudolf Forrer

2017-11-01

Full Text Available Potato late blight (PLB caused by Phytophthora infestans (Pi is the most harmful disease in potato production worldwide. In organic farming, copper is used despite its persistence in soil and toxicity to soil organisms. To replace copper, suspensions of powders from three promising botanicals, including bark of buckthorn (Frangula alnus, FA, roots of medicinal rhubarb (Rheum palmatum and galls of the nutgall tree (Galla chinensis, were tested in multi-year field experiments. The current study shows for the first time that botanicals could replace copper under field conditions and best PLB reduction on leaves was achieved with FA, reaching a level close to that of 2 to 3 kg copper per hectare and year. Better results than with copper were achieved with Phosfik® (Ph, a phosphonate-based product. For both FA and Ph, the mode of action is based on induced resistance, for Ph also on direct fungicidal effects. A disadvantage of Ph is the accumulation of residues in potato tubers. Nevertheless, two to three applications with 2 to 3 L/ha of Ph would be feasible to not exceed a minimal risk level (MLR of 20 mg/kg of phosphorous acid as proposed by the European Food Safety Authority. Due to an excellent environmental profile and a complex mode of action counteracting Pi resistance, phosphonate-based products would be most suitable for sustainable PLB management in integrated pest management (IPM programmes.

Comparison of Some Mechanical and Physical Methods for Measurement of Residual Stresses in Brush-Plated Nickel Hardened Gold and Silver Coatings

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Harri LILLE

2016-05-01

Full Text Available Hard gold and silver are applied in coating owing to their high hardness, good wear and corrosion resistance for engineering application (e.g. on generators slip rings, sliding contacts and small machine parts and are typically plated on copper (mostly, brass and bronze. The studied nickel-hardened gold and silver coatings were brush plated on open thin-walled copper ring substrates. Residual stresses in the coatings were calculated from the curvature changes of the substrates. Biaxial intrinsic residual stresses were also determined by nanoindentation testing and by the X-ray technique. The values of the residual stresses represented tensile stresses and when determined by the techniques used they were comparable within a maximum limit of measurement uncertainty. These stresses relax; the dependence of relaxation time was approximated by a linear-fractional function.DOI: http://dx.doi.org/10.5755/j01.ms.22.1.7439

Integrated copper-containing wastewater treatment using xanthate process.

Science.gov (United States)

Chang, Yi-Kuo; Chang, Juu-En; Lin, Tzong-Tzeng; Hsu, Yu-Ming

2002-09-02

Although, the xanthate process has been shown to be an effective method for heavy metal removal from contaminated water, a heavy metal contaminated residual sludge is produced by the treatment process and the metal-xanthate sludge must be handled in accordance with the Taiwan EPA's waste disposal requirements. This work employed potassium ethyl xanthate (KEX) to remove copper ions from wastewater. The toxicity characteristic leaching procedure (TCLP) and semi-dynamic leaching test (SDLT) were used to determine the leaching potential and stability characteristics of the residual copper xanthate (Cu-EX) complexes. Results from metal removal experiments showed that KEX was suitable for the treatment of copper-containing wastewater over a wide copper concentration range (50, 100, 500, and 1000 mg/l) to the level that meets the Taiwan EPA's effluent regulations (3mg/l). The TCLP results of the residual Cu-EX complexes could meet the current regulations and thus the Cu-EX complexes could be treated as a non-hazardous material. Besides, the results of SDLT indicated that the complexes exhibited an excellent performance for stabilizing metals under acidic conditions, even slight chemical changes of the complexes occurred during extraction. The xanthate process, mixing KEX with copper-bearing solution to form Cu-EX precipitates, offered a comprehensive strategy for solving both copper-containing wastewater problems and subsequent sludge disposal requirements.

Fabricating Copper Nanotubes by Electrodeposition

Science.gov (United States)

Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel

2009-01-01

Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

Considerations in designing and using superconductors with high resistivity matrices

International Nuclear Information System (INIS)

Bartlett, R.J.; Carlson, R.V.; Laquer, H.L.; Migliori, A.

1976-01-01

Superconductors are often designed with matrices of much higher residual resistivities than copper for reasons of manufacturing (multifilamentary Nb 3 Sn in CuSn bronze) or loss reduction (mixed matrix NbTi with Cu and CuNi). The high resistivity matrix may complicate or degrade contact resistances at the joints, generate excess heat, reduce the stability of the conductor, and interfere with the observation of flux flow resistivities in the 10 -12 Ω-cm region. The minimization of these effects is discussed, presenting both simple and more refined models for the current transfer length, and it is shown how variations in transfer length (with current), particularly under significant self field conditions, can mimic flux flow resistivity

Temperature dependence of residual electrical resistivity of Cu-Au in pseudopotential approximation

International Nuclear Information System (INIS)

Khwaja, F.A.; Ahmed, I.; Shaukat, A.

1986-08-01

The problem of temperature dependence of residual electrical resistivity of Cu-Au system is re-examined in the light of static distortion and thermal vibration of the lattice along with the short-range-order of atoms above critical temperature. The extended version of Ziman's formula for resistivity obtained yields a unified version for the calculation of resistivity in pseudopotential approximation. The temperature dependence of the quantity Δρ/ρ in this framework for Cu-Au system is found to be in better agreement with the experimental data as compared to previous calculation. (author)

In vivo selection of resistant E. coli after ingestion of milk with added drug residues.

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Richard Van Vleck Pereira

Full Text Available Antimicrobial resistance represents a major global threat to modern medicine. In vitro studies have shown that very low concentrations of drugs, as frequently identified in the environment, and in foods and water for human and animal consumption, can select for resistant bacteria. However, limited information is currently available on the in vivo impact of ingested drug residues. The objective of our study was to evaluate the effect of feeding preweaned calves milk containing antimicrobial drug residues (below the minimum inhibitory concentration, similar to concentrations detected in milk commonly fed to dairy calves, on selection of resistant fecal E. coli in calves from birth to weaning. At birth, thirty calves were randomly assigned to a controlled feeding trial where: 15 calves were fed raw milk with no drug residues (NR, and 15 calves were fed raw milk with drug residues (DR by adding ceftiofur, penicillin, ampicillin, and oxytetracycline at final concentrations in the milk of 0.1, 0.005, 0.01, and 0.3 µg/ml, respectively. Fecal samples were rectally collected from each calf once a week starting at birth prior to the first feeding in the trial (pre-treatment until 6 weeks of age. A significantly greater proportion of E. coli resistant to ampicillin, cefoxitin, ceftiofur, streptomycin and tetracycline was observed in DR calves when compared to NR calves. Additionally, isolates from DR calves had a significant decrease in susceptibility to ceftriaxone and ceftiofur when compared to isolates from NR calves. A greater proportion of E. coli isolates from calves in the DR group were resistant to 3 or more antimicrobial drugs when compared to calves in the ND group. These findings highlight the role that low concentrations of antimicrobial drugs have on the evolution and selection of resistance to multiple antimicrobial drugs in vivo.

Pathogenic adaptations to host-derived antibacterial copper

Science.gov (United States)

Chaturvedi, Kaveri S.; Henderson, Jeffrey P.

2014-01-01

Recent findings suggest that both host and pathogen manipulate copper content in infected host niches during infections. In this review, we summarize recent developments that implicate copper resistance as an important determinant of bacterial fitness at the host-pathogen interface. An essential mammalian nutrient, copper cycles between copper (I) (Cu+) in its reduced form and copper (II) (Cu2+) in its oxidized form under physiologic conditions. Cu+ is significantly more bactericidal than Cu2+ due to its ability to freely penetrate bacterial membranes and inactivate intracellular iron-sulfur clusters. Copper ions can also catalyze reactive oxygen species (ROS) generation, which may further contribute to their toxicity. Transporters, chaperones, redox proteins, receptors and transcription factors and even siderophores affect copper accumulation and distribution in both pathogenic microbes and their human hosts. This review will briefly cover evidence for copper as a mammalian antibacterial effector, the possible reasons for this toxicity, and pathogenic resistance mechanisms directed against it. PMID:24551598

Reliability of copper based alloys for electric resistance spot welding

International Nuclear Information System (INIS)

Jovanovicj, M.; Mihajlovicj, A.; Sherbedzhija, B.

1977-01-01

Durability of copper based alloys (B-5 and B-6) for electric resistance spot-welding was examined. The total amount of Be, Ni and Zr was up to 2 and 1 wt.% respectively. Good durability and satisfactory quality of welded spots were obtained in previous laboratory experiments carried out on the fixed spot-welding machine of an industrial type (only B-5 alloy was examined). Electrodes made of both B-5 and B-6 alloy were tested on spot-welding grips and fixed spot-welding machines in Tvornica automobila Sarajevo (TAS). The obtained results suggest that the durability of electrodes made of B-5 and B-6 alloys is more than twice better than of that used in TAS

Solution-processed copper-nickel nanowire anodes for organic solar cells

Science.gov (United States)

Stewart, Ian E.; Rathmell, Aaron R.; Yan, Liang; Ye, Shengrong; Flowers, Patrick F.; You, Wei; Wiley, Benjamin J.

2014-05-01

This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%.This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%. Electronic supplementary information (ESI) available. See DOI: 10.1039/c4nr01024h

Modification of medical metals by ion implantation of copper

Science.gov (United States)

Wan, Y. Z.; Xiong, G. Y.; Liang, H.; Raman, S.; He, F.; Huang, Y.

2007-10-01

The effect of copper ion implantation on the antibacterial activity, wear performance and corrosion resistance of medical metals including 317 L of stainless steels, pure titanium, and Ti-Al-Nb alloy was studied in this work. The specimens were implanted with copper ions using a MEVVA source ion implanter with ion doses ranging from 0.5 × 10 17 to 4 × 10 17 ions/cm 2 at an energy of 80 keV. The antibacterial effect, wear rate, and inflexion potential were measured as a function of ion dose. The results obtained indicate that copper ion implantation improves the antibacterial effect and wear behaviour for all the three medical materials studied. However, corrosion resistance decreases after ion implantation of copper. Experimental results indicate that the antibacterial property and corrosion resistance should be balanced for medical titanium materials. The marked deteriorated corrosion resistance of 317 L suggests that copper implantation may not be an effective method of improving its antibacterial activity.

Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration

International Nuclear Information System (INIS)

Jiang Mengting; Liu Yuling; Yuan Haobo; Chen Guodong; Liu Weijuan

2014-01-01

A novel alkaline copper slurry that possesses a relatively high planarization performance is investigated under a low abrasive concentration. Based on the action mechanism of CMP, the feasibility of using one type of slurry in copper bulk elimination process and residual copper elimination process, with different process parameters, was analyzed. In addition, we investigated the regular change of abrasive concentration effect on copper and tantalum removal rate and within wafer non-uniformity (WIWNU) in CMP process. When the abrasive concentration is 3 wt%, in bulk elimination process, the copper removal rate achieves 6125 Å/min, while WIWNU is 3.5%, simultaneously. In residual copper elimination process, the copper removal rate is approximately 2700 Å/min, while WIWNU is 2.8%. Nevertheless, the tantalum removal rate is 0 Å/min, which indicates that barrier layer isn't eliminated in residual copper elimination process. The planarization experimental results show that an excellent planarization performance is obtained with a relatively high copper removal rate in bulk elimination process. Meanwhile, after residual copper elimination process, the dishing value increased inconspicuously, in a controllable range, and the wafer surface roughness is only 0.326 nm (sq < 1 nm) after polishing. By comparison, the planarization performance and surface quality of alkaline slurry show almost no major differences with two kinds of commercial acid slurries after polishing. All experimental results are conducive to research and improvement of alkaline slurry in the future. (semiconductor technology)

Unraveling the Amycolatopsis tucumanensis copper-resistome.

Science.gov (United States)

Dávila Costa, José Sebastián; Kothe, Erika; Abate, Carlos Mauricio; Amoroso, María Julia

2012-10-01

Heavy metal pollution is widespread causing serious ecological problems in many parts of the world; especially in developing countries where a budget for remediation technology is not affordable. Therefore, screening for microbes with high accumulation capacities and studying their stable resistance characteristics is advisable to define cost-effective any remediation strategies. Herein, the copper-resistome of the novel copper-resistant strain Amycolatopsis tucumanensis was studied using several approaches. Two dimensional gel electrophoresis revealed that proteins of the central metabolism, energy production, transcriptional regulators, two-component system, antioxidants and protective metabolites increased their abundance upon copper-stress conditions. Transcriptome analysis revealed that in presence of copper, superoxide dismutase, alkyl hydroperoxide reductase and mycothiol reductase genes were markedly induced in expression. The oxidative damage of protein and lipid from A. tucumanensis was negligible compared with that observed in the copper-sensitive strain Amycolatopsis eurytherma. Thus, we provide evidence that A. tucumamensis shows a high adaptation towards copper, the sum of which is proposed as the copper-resistome. This adaptation allows the strain to accumulate copper and survive this stress; besides, it constitutes the first report in which the copper-resistome of a strain of the genus Amycolatopsis with bioremediation potential has been evaluated.

Distribution of copper, silver and gold during thermal treatment with brominated flame retardants

International Nuclear Information System (INIS)

Oleszek, Sylwia; Grabda, Mariusz; Shibata, Etsuro; Nakamura, Takashi

2013-01-01

Highlights: • Copper, silver and gold during thermal treatment with brominated flame retardants. • Distribution of copper, silver and gold during thermal processing. • Thermodynamic considerations of the bromination reactions. - Abstract: The growing consumption of electric and electronic equipment results in creating an increasing amount of electronic waste. The most economically and environmentally advantageous methods for the treatment and recycling of waste electric and electronic equipment (WEEE) are the thermal techniques such as direct combustion, co-combustion with plastic wastes, pyrolysis and gasification. Nowadays, this kind of waste is mainly thermally treated in incinerators (e.g. rotary kilns) to decompose the plastics present, and to concentrate metals in bottom ash. The concentrated metals (e.g. copper, precious metals) can be supplied as a secondary raw material to metal smelters, while the pyrolysis of plastics allows the recovery of fuel gases, volatilising agents and, eventually, energy. Indeed, WEEE, such as a printed circuit boards (PCBs) usually contains brominated flame retardants (BFRs). From these materials, hydrobromic acid (HBr) is formed as a product of their thermal decomposition. In the present work, the bromination was studied of copper, silver and gold by HBr, originating from BFRs, such as Tetrabromobisphenol A (TBBPA) and Tetrabromobisphenol A-Tetrabromobisophenol A diglycidyl ether (TTDE) polymer; possible volatilization of the bromides formed was monitored using a thermo-gravimetric analyzer (TGA) and a laboratory-scale furnace for treating samples of metals and BFRs under an inert atmosphere and at a wide range of temperatures. The results obtained indicate that up to about 50% of copper and silver can evolve from sample residues in the form of volatile CuBr and AgBr above 600 and 1000 °C, respectively. The reactions occur in the molten resin phase simultaneously with the decomposition of the brominated resin. Gold is

3D local structure around copper site of rabbit prion-related protein: Quantitative determination by XANES spectroscopy combined with multiple-scattering calculations

International Nuclear Information System (INIS)

Cui, P.X.; Lian, F.L.; Wang, Y.; Wen, Yi; Chu, W.S.; Zhao, H.F.; Zhang, S.; Li, J.; Lin, D.H.; Wu, Z.Y.

2014-01-01

Prion-related protein (PrP), a cell-surface copper-binding glycoprotein, is considered to be responsible for a number of transmissible spongiform encephalopathies (TSEs). The structural conversion of PrP from the normal cellular isoform (PrP C ) to the post-translationally modified form (PrP Sc ) is thought to be relevant to Cu 2+ binding to histidine residues. Rabbits are one of the few mammalian species that appear to be resistant to TSEs, because of the structural characteristics of the rabbit prion protein (RaPrP C ) itself. Here we determined the three-dimensional local structure around the C-terminal high-affinity copper-binding sites using X-ray absorption near-edge structure combined with ab initio calculations in the framework of the multiple-scattering (MS) theory. Result shows that two amino acid resides, Gln97 and Met108, and two histidine residues, His95 and His110, are involved in binding this copper(II) ion. It might help us understand the roles of copper in prion conformation conversions, and the molecular mechanisms of prion-involved diseases. - Highlights: ► The first structure of the metal ion binding site in RaPrP fifth copper-binding site. ► Quantitative determination by XANES spectroscopy combined with ab initio calculations. ► Provide a proof of the roles of copper in prion conformation conversions. ► Provide a proof of the molecular mechanisms of prion-involved diseases

Oxidation-assisted graphene heteroepitaxy on copper foil.

Science.gov (United States)

Reckinger, Nicolas; Tang, Xiaohui; Joucken, Frédéric; Lajaunie, Luc; Arenal, Raul; Dubois, Emmanuel; Hackens, Benoît; Henrard, Luc; Colomer, Jean-François

2016-11-10

We propose an innovative, easy-to-implement approach to synthesize aligned large-area single-crystalline graphene flakes by chemical vapor deposition on copper foil. This method doubly takes advantage of residual oxygen present in the gas phase. First, by slightly oxidizing the copper surface, we induce grain boundary pinning in copper and, in consequence, the freezing of the thermal recrystallization process. Subsequent reduction of copper under hydrogen suddenly unlocks the delayed reconstruction, favoring the growth of centimeter-sized copper (111) grains through the mechanism of abnormal grain growth. Second, the oxidation of the copper surface also drastically reduces the nucleation density of graphene. This oxidation/reduction sequence leads to the synthesis of aligned millimeter-sized monolayer graphene domains in epitaxial registry with copper (111). The as-grown graphene flakes are demonstrated to be both single-crystalline and of high quality.

Irradiation performance of oxide dispersion strengthened copper alloys to 150 dpa at 415 degree C

International Nuclear Information System (INIS)

Edwards, D.J.; Kumar, A.S.; Anderson, K.R.; Stubbins, J.F.; Garner, F.A.; Hamilton, M.L.

1991-11-01

Results have been obtained on the post-irradiation properties of various oxide dispersion strengthened copper alloys irradiated from 34 to 150 dpa at 415 degrees C in the Fast Flux Test Facility. The GlidCop alloys strengthened by Al 2 O 3 continue to outperform other alloys with respect to swelling resistance, and retention of both electrical conductivity and yield strength. Several castable ODS alloys and a Cr 2 O 3 -strengthened alloy show increasingly poor resistance to radiation, especially in their swelling behavior. A HfO 2 -strengthened alloy retains most of its strength and its electrical conductivity reaches a constant level after 50 dpa, but it exhibits a higher residual radioactivity

Effect of copper precipitates on the toughness of low alloy steels for pressure boundary components

International Nuclear Information System (INIS)

Foehl, J.; Willer, D.; Katerbau, K.H.

2004-01-01

The ferritic bainitic steel 15NiCuMoNb5 (WB 36)is widely used for pressure boundary components. Due to the high copper content which leads to precipitation hardening high strength and toughness are characteristic for this type of steel. However, in the initial state, there is still a high amount of dissolved copper in an oversaturated state which makes the steel susceptible to thermal ageing. Ageing and annealing experiments were performed, and the change in microstructure was investigated by small angle neutron scattering (SANS), measurements of the residual electric resistance and hardness measurements. A correlation between micro structural changes and changes in mechanical properties could be established. It could clearly be shown that significant effects on strength and toughness have to be considered when the size of the copper rich precipitates vary in the range from 1.2 to 2.2 nm in radius. The changes in microstructure affect both, the Carpy impact transition temperature and the fracture toughness qualitatively and quantitatively in a similar way. The investigations have contributed to a better understanding of precipitation hardening by copper not only for this type of steel but also for copper containing steels and weld subjected to neutron irradiation. (orig.)

Coupled stress-strain and electrical resistivity measurements on copper based shape memory single crystals

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Gonzalez Cezar Henrique

2004-01-01

Full Text Available Recently, electrical resistivity (ER measurements have been done during some thermomechanical tests in copper based shape memory alloys (SMA's. In this work, single crystals of Cu-based SMA's have been studied at different temperatures to analyse the relationship between stress (s and ER changes as a function of the strain (e. A good consistency between ER change values is observed in different experiments: thermal martensitic transformation, stress induced martensitic transformation and stress induced reorientation of martensite variants. During stress induced martensitic transformation (superelastic behaviour and stress induced reorientation of martensite variants, a linear relationship is obtained between ER and strain as well as the absence of hys teresis. In conclusion, the present results show a direct evidence of martensite electrical resistivity anisotropy.

Characterization of hafnium oxide resistive memory layers deposited on copper by atomic layer deposition

Energy Technology Data Exchange (ETDEWEB)

Briggs, B.D.; Bishop, S.M. [SUNY College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, NY 12203 (United States); Leedy, K.D. [Air Force Research Laboratory, 2241 Avionics Circle, Wright Patterson Air Force Base, Dayton, OH 45433 (United States); Cady, N.C., E-mail: ncady@albany.edu [SUNY College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, NY 12203 (United States)

2014-07-01

Hafnium oxide-based resistive memory devices have been fabricated on copper bottom electrodes. The HfO{sub x} active layers in these devices were deposited by atomic layer deposition (ALD) at 250 °C with tetrakis(dimethylamido)hafnium(IV) as the metal precursor and an O{sub 2} plasma as the reactant. Depth profiles of the HfO{sub x} by X-ray photoelectron spectroscopy and secondary ion mass spectroscopy revealed a copper concentration on the order of five atomic percent throughout the HfO{sub x} film. In addition to the Cu doped HfO{sub x}, a thin layer (20 nm) of Cu{sub x}O is present at the surface. This surface layer is believed to have formed during the ALD process, and greatly complicates the analysis of the switching mechanism. The resistive memory structures fabricated from the ALD HfO{sub x} exhibited non-polar resistive switching, independent of the top metal electrode (Ni, Pt, Al, Au). Resistive switching current voltage (I–V) curves were analyzed using Schottky emission and ionic hopping models to gain insight into the physical mechanisms underpinning the device behavior. During the forming process it was determined that, at voltages in excess of 2.5 V, an ionic hopping model is in good agreement with the I–V data. The extracted ion hopping distance ∼ 4 Å was within the range of interatomic spacing of HfO{sub 2} during the forming process consistent with ionic motion of Cu{sup 2+} ions. Lastly the on state I–V data was dominated at larger voltages by Schottky emission with an estimated barrier height of ∼ 0.5 eV and a refractive index of 2.59. The consequence of the Schottky emission analysis indicates the on state resistance to be a product of a Pt/Cu{sub 2}O/Cu filament(s)/Cu{sub 2}O/Cu structure. - Highlights: • HfO{sub 2} was grown via atomic layer deposition at 250 and 100 °C on Cu substrates. • A Cu{sub 2}O surface layer and Cu doping were observed in post-deposition of HfO{sub 2}. • Resistive memory devices were fabricated and

Simulation of residual stresses and deformations in electron beam-welded copper canisters

International Nuclear Information System (INIS)

Aronen, A.; Leikko, J.; Taskinen, P.; Karvinen, R.

2013-07-01

This report presents the modelling of residual stresses and deformations of an EB-welded copper canister. Two different mock-up lengths are modelled with the Abaqus FEA program, and the similarity of those results is studied. Canister mock-ups of 450 mm and 915 mm were chosen for the test cases. The heat treatment results presented in Taskinen 2009 are used as input data for the mechanical model. For the mechanical analysis some simplifications were made to the model. The contact surface between pipe and lid is assumed to be tied and support from the bottom surface is provided with four support points. Results show that, due to the similarity of 450 mm and 915 mm canisters, the short mock-up can be used to predict the stresses and deformation on a full-length canister (5000 mm). The similarity of the temperature fields has already been shown in the previous reports (Taskinen 2009). The main result in the deformation is the shape of the canister in the residual state. The top of the canister tries to shrink, resulting in the lid buckling inwards. The deformation of the lid of the canister is about 2.2 mm at the centre of the lid. The main results in the stresses are the stress level on the surface, the deviation of stresses over the circle and the stresses near the welding. On the surface there are areas where the circumferential stress is at tension. However, radial and axial stresses are usually in compression on the surface. The deviation of the stress level over the circle is quite small, except in the overlap area and near it. The residual stresses from 0 deg C to 45 deg C change remarkably, but over the rest of the area the stresses are more constant. Near the welding the stresses on the top surface are in compression, but in the centre of the welding the stresses are in tension. In the modelling, the possibility of calculating a mechanical model with the contact surface between pipe and lid, so that they could be separated during the welding, was also tested

Simulation of residual stresses and deformations in electron beam-welded copper canisters

Energy Technology Data Exchange (ETDEWEB)

Aronen, A.; Leikko, J.; Taskinen, P.; Karvinen, R. [Tampere Univ. of Technology (Finland)

2013-07-15

This report presents the modelling of residual stresses and deformations of an EB-welded copper canister. Two different mock-up lengths are modelled with the Abaqus FEA program, and the similarity of those results is studied. Canister mock-ups of 450 mm and 915 mm were chosen for the test cases. The heat treatment results presented in Taskinen 2009 are used as input data for the mechanical model. For the mechanical analysis some simplifications were made to the model. The contact surface between pipe and lid is assumed to be tied and support from the bottom surface is provided with four support points. Results show that, due to the similarity of 450 mm and 915 mm canisters, the short mock-up can be used to predict the stresses and deformation on a full-length canister (5000 mm). The similarity of the temperature fields has already been shown in the previous reports (Taskinen 2009). The main result in the deformation is the shape of the canister in the residual state. The top of the canister tries to shrink, resulting in the lid buckling inwards. The deformation of the lid of the canister is about 2.2 mm at the centre of the lid. The main results in the stresses are the stress level on the surface, the deviation of stresses over the circle and the stresses near the welding. On the surface there are areas where the circumferential stress is at tension. However, radial and axial stresses are usually in compression on the surface. The deviation of the stress level over the circle is quite small, except in the overlap area and near it. The residual stresses from 0 deg C to 45 deg C change remarkably, but over the rest of the area the stresses are more constant. Near the welding the stresses on the top surface are in compression, but in the centre of the welding the stresses are in tension. In the modelling, the possibility of calculating a mechanical model with the contact surface between pipe and lid, so that they could be separated during the welding, was also tested

Computer model of copper resistivity will improve the efficiency of field-compression devices

International Nuclear Information System (INIS)

Burgess, T.J.

1977-01-01

By detonating a ring of high explosive around an existing magnetic field, we can, under certain conditions, compress the field and multiply its strength tremendously. In this way, we can duplicate for a fraction of a second the extreme pressures that normally exist only in the interior of stars and planets. Under such pressures, materials may exhibit behavior that will confirm or alter current notions about the fundamental structure of matter and the ongoing processes in planetary interiors. However, we cannot design an efficient field-compression device unless we can calculate the electrical resistivity of certain basic metal components, which interact with the field. To aid in the design effort, we have developed a computer code that calculates the resistivity of copper and other metals over the wide range of temperatures and pressures found in a field-compression device

Copper and trace element fractionation in electrokinetically treated methanogenic anaerobic granular sludge

International Nuclear Information System (INIS)

Virkutyte, Jurate; Hullebusch, Eric van; Sillanpaeae, Mika; Lens, Piet

2005-01-01

The effect of electrokinetic treatment (0.15 mA cm -2 ) on the metal fractionation in anaerobic granular sludge artificially contaminated with copper (initial copper concentration 1000 mg kg -1 wet sludge) was studied. Acidification of the sludge (final pH 4.2 in the sludge bed) with the intention to desorb the copper species bound to the organic/sulfides and residual fractions did not result in an increased mobility, despite the fact that a higher quantity of copper was measured in the more mobile (i.e. exchangeable/carbonate) fractions at final pH 4.2 compared to circum-neutral pH conditions. Also addition of the chelating agent EDTA (Cu 2+ :EDTA 4- ratio 1.2:1) did not enhance the mobility of copper from the organic/sulfides and residual fractions, despite the fact that it induced a reduction of the total copper content of the sludge. The presence of sulfide precipitates likely influences the copper mobilisation from these less mobile fractions, and thus makes EDTA addition ineffective to solubilise copper from the granules. - Electrokinetic treatment of copper contaminated anaerobic granular sludge at 0.15 mA cm -2 for 14 days induces copper and trace metal mobility as well as changes in their fractionation (i.e. bonding forms)

Photoelectrochemistry of copper(I) acetylide films electrodeposited onto copper electrodes

Energy Technology Data Exchange (ETDEWEB)

Zotti, G.; Cattarin, S.; Mengoli, G.; Fleischmann, M.; Peter, L.M.

1986-01-01

Films of copper acetylide (Cu/sub 2/C/sub 2/) were grown electrochemically on copper and characterized by transmittance and reflectance techniques. The photoelectrochemical properties of the filmed electrodes in alkaline solution indicate that Cu/sub 2/C/sub 2/ behaves as a p-type semiconducting material (1.5 eV band gap). The photocurrents depend on film thickness and aging and high resistivity or recombination losses limit the quantum yield to some 4% for thicknesses of practical importance (250 nm).

Investigation of mechanical behavior of copper in Nb3Sn superconducting composite wire

International Nuclear Information System (INIS)

Hojo, M.; Matsuoka, T.; Nakamura, M.; Tanaka, M.; Adachi, T.; Ochiai, S.; Miyashita, K.

2004-01-01

The mechanical properties and the thermal residual stress distribution of copper in Nb 3 Sn/Cu composite superconductor were investigated in detail. The stabilizer copper was removed from the composite wire, and the stress-strain behavior of this wire was compared with that of the original composite wire. The subtraction yielded the stress-strain curves of the copper when the Bauschinger effect was taken into account. The tensile test of the composites from which about 30% and 60% of copper was removed suggested the existence of the distribution of the thermal residual stress in the stabilizer copper. When this factor was taken into account, the analytical stress-strain curve agreed well with the experimental stress-strain curve. Thus, the stress-stain behavior of each component was fully understood

Multilevel Dual Damascene copper interconnections

Science.gov (United States)

Lakshminarayanan, S.

Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400o

Leaching of copper concentrates using NaCl and soluble copper contributed by the own concentrate

International Nuclear Information System (INIS)

Herrero, O.; Bernal, N.; Quiroz, R.; Fuentes, G.; Vinals, J.

2005-01-01

Leaching of copper concentrates using cupric chloro complexes, generated in situ by the reaction between Cu(II), aported by the soluble copper content of the concentrate, and sodium chloride in acid media was studied. The concentrate samples were obtained from mineral processing plants from Antofagasta, Chile. Chemical and mineralogical characterization from original concentrates was made. Typical variable such as a chloride concentration, soluble copper concentration, leaching time, solid percentage and temperature were studied. DRX and EDS analyzed some of the residues. the experimental results indicated that it is possible to obtain solutions having high copper content (15 to 35 g/L) and 2 to 5 g/L free acid in order to submit this solution directly to a solvent extraction stage. The leaching tests use common reactive and low cost such as sodium chloride and sulfuric acid. (Author) 16 refs

Copper tolerance in Becium homblei

Energy Technology Data Exchange (ETDEWEB)

Reilly, C; Stone, J

1971-04-09

Analyses show that Becium homblei has apparently no mechanism for limiting copper uptake. As growth proceeds, the concentration of metal increases in leaves and stems. Much of the copper is bound to structural material of the cells. There is a significant difference between the amount of extractable material in root and leaf tissues. These differences, in conjunction with the extrinsic factor of regular bush fires, were important factors in the evolution of this copper-resistant species of Becium. 9 references.

Simultaneous analysis of residual stress and stress intensity factor in a resist after UV-nanoimprint lithography based on electron moiré fringes

International Nuclear Information System (INIS)

Wang, Qinghua; Kishimoto, Satoshi

2012-01-01

In this study, the residual stress in a resist (PAK01) film and the stress intensity factor (SIF) of an induced crack are simultaneously estimated during ultraviolet nanoimprint lithography (UV-NIL) based on electron moiré fringes. A micro grid in a triangular arrangement on the resist film fabricated by UV-NIL is directly used as the model grid. Electron moiré fringes formed by the interference between the fabricated grid and the electron scan beam are used to measure the displacement distribution around the tip of a crack induced by the residual stress in the resist. The SIF of the crack is estimated using a displacement extrapolation method. The residual strain fields and the corresponding residual stress in the resist film far from the crack are determined and analyzed. This method is effective for evaluating the grid quality fabricated by the UV-NIL technique. (paper)

Dependence of the surface resistance of niobium coated copper cavities on the coating temperature

International Nuclear Information System (INIS)

Darriulat, P.; Durand, C.; Janot, P.; Rensing, N.; Weingarten, W.; Bosland, P.; Gobin, J.; Martignac, J.

1996-01-01

Six hydro-formed copper 1.5 GHz cavities have been baked and coated with niobium at different temperatures between 100 deg C and 200 deg C, while keeping the other discharge parameters unchanged. Their surface resistance has been measured as a function RF field and trapped magnetic field. Its dependence on deposition temperature confirms earlier indications obtained using 350 MHz LEP cavities that 150 deg C leads to optimal performances. The critical temperatures of Nb/Cu and bulk niobium cavities have also been measured. (author)

Spectroscopy of Cu(II)-PcoC and the multicopper oxidase function of PcoA, two essential components of Escherichia coli pco copper resistance operon.

Science.gov (United States)

Huffman, David L; Huyett, Jennifer; Outten, F Wayne; Doan, Peter E; Finney, Lydia A; Hoffman, Brian M; O'Halloran, Thomas V

2002-08-06

The plasmid-encoded pco copper resistance operon in Escherichia coli consists of seven genes that are expressed from two pco promoters in response to elevated copper; however, little is known about how they mediate resistance to excess environmental copper. Two of the genes encode the soluble periplasmic proteins PcoA and PcoC. We show here that inactivation of PcoC, and PcoA to a lesser extent, causes cells to become more sensitive to copper than wild-type nonresistant strains, consistent with a tightly coupled detoxification pathway. Periplasmic extracts show copper-inducible oxidase activity, attributed to the multicopper oxidase function of PcoA. PcoC, a much smaller protein than PcoA, binds one Cu(II) and exhibits a weak electronic transition characteristic of a type II copper center. ENDOR and ESEEM spectroscopy of Cu(II)-PcoC and the (15)N- and Met-CD(3)-labeled samples are consistent with a tetragonal ligand environment of three nitrogens and one aqua ligand "in the plane". A weakly associated S-Met and aqua are likely axial ligands. At least one N is a histidine and is likely trans to the in-plane aqua ligand. The copper chemistry of PcoC and the oxidase function of PcoA are consistent with the emerging picture of the chromosomally encoded copper homeostasis apparatus in the E. coli cell envelope [Outten, F. W., Huffman, D. L., Hale, J. A., and O'Halloran, T. V. (2001) J. Biol. Chem. 276, 30670-30677]. We propose a model for the plasmid system in which Cu(I)-PcoC functions in this copper efflux pathway as a periplasmic copper binding protein that docks with the multiple repeats of Met-rich domains in PcoA to effect oxidation of Cu(I) to the less toxic Cu(II) form. The solvent accessibility of the Cu(II) in PcoC may allow for metal transfer to other plasmid and chromosomal factors and thus facilitate removal of Cu(II) from the cell envelope.

The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

Energy Technology Data Exchange (ETDEWEB)

Rosborg, Bo [Division of Surface and Corrosion Science, KTH, Stockholm (Sweden); Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz [Slovenian National Building and Civil Engineering Institute, Ljubljana (Slovenia)

2012-12-15

LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 {mu}m were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

International Nuclear Information System (INIS)

Rosborg, Bo; Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz

2012-12-01

LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 μm were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

Thermal shock resistances of a bonding material of C/C composite and copper

International Nuclear Information System (INIS)

Kurumada, Akira; Oku, Tatsuo; Kawamata, Kiyohiro; Motojima, Osamu; Noda, Nobuaki; McEnaney, B.

1997-01-01

The purpose of this study is to contribute to the development and the safety design of plasma facing components for fusion reactor devices. We evaluated the thermal shock resistance and the thermal shock fracture toughness of a bonding material which was jointed a carbon-fiber-reinforced carbon composite (C/C composite) to oxygen-free copper. We also examined the microstructures of the bonding layers using a scanning electron microscope before and after thermal shock tests. The bonding material did not fracture during thermal shock tests. However, thermal cracks and delamination cracks were observed in the bonding layers. (author)

Residual stress measurement of EB-welded plates with contour method. Part 2: FEM analysis of contour profiles

International Nuclear Information System (INIS)

Romppanen, A.-J.; Immonen, E.

2013-12-01

The residual stresses formed as a result of Electronic Beam welding (EB-welding) in copper are investigated by Posiva. In the present study, residual stresses of EB-welded copper plates were studied with contour method. In the method eleven copper plates (X436 - X440 and X453 - X458) were cut in half with wire electric discharge machining (EDM) after which the deformation due to stress relaxation was measured with coordinate measurement system. The measured data was then used as boundary displacement data for the FEM analyses, in which the corresponding residual stresses were calculated. Before giving the corresponding displacement boundary conditions to the FE models, the deformation data was processed and smoothed appropriately. The residual stress levels of the copper plates were found to be around 40 - 55 MPa at maximum. This corresponds to other reported residual stress measurements and current state of knowledge with this material in Posiva. (orig.)

Copper Contamination Impairs Herbivore Initiation of Seaweed Inducible Defenses and Decreases Their Effectiveness.

Directory of Open Access Journals (Sweden)

Alexandria M Warneke

Full Text Available Seaweed-herbivore interactions are often mediated by environmental conditions, yet the roles of emerging anthropogenic stressors on these interactions are poorly understood. For example, chemical contaminants have unknown consequences on seaweed inducible resistance and herbivore response to these defenses despite known deleterious effects of contaminants on animal inducible defenses. Here, we investigated the effect of copper contamination on the interactions between a snail herbivore and a brown seaweed that displays inducible resistance to grazing. We examined seaweed inducible resistance and its effectiveness for organisms exposed to copper at two time points, either during induction or after herbivores had already induced seaweed defenses. Under ambient conditions, non-grazed tissues were more palatable than grazed tissues. However, copper additions negated the preference for non-grazed tissues regardless of the timing of copper exposure, suggesting that copper decreased both how herbivores initiated these inducible defenses and their subsequent effectiveness. Copper decreased stimulation of defenses, at least in part, by suppressing snail grazing pressure-the cue that turns inducible defenses on. Copper decreased effectiveness of defenses by preventing snails from preferentially consuming non-grazed seaweed. Thus, contaminants can potentially stress communities by changing seaweed-herbivore interactions mediated via inducible defenses. Given the ubiquity of seaweed inducible resistance and their potential influence on herbivores, we hypothesize that copper contamination may change the impact of these resistant traits on herbivores.

Altered localisation of the copper efflux transporters ATP7A and ATP7B associated with cisplatin resistance in human ovarian carcinoma cells

International Nuclear Information System (INIS)

Kalayda, Ganna V; Wagner, Christina H; Buß, Irina; Reedijk, Jan; Jaehde, Ulrich

2008-01-01

Copper homeostasis proteins ATP7A and ATP7B are assumed to be involved in the intracellular transport of cisplatin. The aim of the present study was to assess the relevance of sub cellular localisation of these transporters for acquired cisplatin resistance in vitro. For this purpose, localisation of ATP7A and ATP7B in A2780 human ovarian carcinoma cells and their cisplatin-resistant variant, A2780cis, was investigated. Sub cellular localisation of ATP7A and ATP7B in sensitive and resistant cells was investigated using confocal fluorescence microscopy after immunohistochemical staining. Co-localisation experiments with a cisplatin analogue modified with a carboxyfluorescein-diacetate residue were performed. Cytotoxicity of the fluorescent cisplatin analogue in A2780 and A2780cis cells was determined using an MTT-based assay. The significance of differences was analysed using Student's t test or Mann-Whitney test as appropriate, p values of < 0.05 were considered significant. In the sensitive cells, both transporters are mainly localised in the trans-Golgi network, whereas they are sequestrated in more peripherally located vesicles in the resistant cells. Altered localisation of ATP7A and ATP7B in A2780cis cells is likely to be a consequence of major abnormalities in intracellular protein trafficking related to a reduced lysosomal compartment in this cell line. Changes in sub cellular localisation of ATP7A and ATP7B may facilitate sequestration of cisplatin in the vesicular structures of A2780cis cells, which may prevent drug binding to genomic DNA and thereby contribute to cisplatin resistance. Our results indicate that alterations in sub cellular localisation of transport proteins may contribute to cisplatin resistance in vitro. Investigation of intracellular protein localisation in primary tumour cell cultures and tumour tissues may help to develop markers of clinically relevant cisplatin resistance. Detection of resistant tumours in patients may in turn

Altered localisation of the copper efflux transporters ATP7A and ATP7B associated with cisplatin resistance in human ovarian carcinoma cells

Directory of Open Access Journals (Sweden)

Reedijk Jan

2008-06-01

Full Text Available Abstract Background Copper homeostasis proteins ATP7A and ATP7B are assumed to be involved in the intracellular transport of cisplatin. The aim of the present study was to assess the relevance of sub cellular localisation of these transporters for acquired cisplatin resistance in vitro. For this purpose, localisation of ATP7A and ATP7B in A2780 human ovarian carcinoma cells and their cisplatin-resistant variant, A2780cis, was investigated. Methods Sub cellular localisation of ATP7A and ATP7B in sensitive and resistant cells was investigated using confocal fluorescence microscopy after immunohistochemical staining. Co-localisation experiments with a cisplatin analogue modified with a carboxyfluorescein-diacetate residue were performed. Cytotoxicity of the fluorescent cisplatin analogue in A2780 and A2780cis cells was determined using an MTT-based assay. The significance of differences was analysed using Student's t test or Mann-Whitney test as appropriate, p values of Results In the sensitive cells, both transporters are mainly localised in the trans-Golgi network, whereas they are sequestrated in more peripherally located vesicles in the resistant cells. Altered localisation of ATP7A and ATP7B in A2780cis cells is likely to be a consequence of major abnormalities in intracellular protein trafficking related to a reduced lysosomal compartment in this cell line. Changes in sub cellular localisation of ATP7A and ATP7B may facilitate sequestration of cisplatin in the vesicular structures of A2780cis cells, which may prevent drug binding to genomic DNA and thereby contribute to cisplatin resistance. Conclusion Our results indicate that alterations in sub cellular localisation of transport proteins may contribute to cisplatin resistance in vitro. Investigation of intracellular protein localisation in primary tumour cell cultures and tumour tissues may help to develop markers of clinically relevant cisplatin resistance. Detection of resistant tumours

Dependence of the residual surface resistance of superconducting radio frequency cavities on the cooling dynamics around Tc

Science.gov (United States)

Romanenko, A.; Grassellino, A.; Melnychuk, O.; Sergatskov, D. A.

2014-05-01

We report a strong effect of the cooling dynamics through Tc on the amount of trapped external magnetic flux in superconducting niobium cavities. The effect is similar for fine grain and single crystal niobium and all surface treatments including electropolishing with and without 120 °C baking and nitrogen doping. Direct magnetic field measurements on the cavity walls show that the effect stems from changes in the flux trapping efficiency: slow cooling leads to almost complete flux trapping and higher residual resistance, while fast cooling leads to the much more efficient flux expulsion and lower residual resistance.

Deposition and characterisation of copper for high density interconnects

International Nuclear Information System (INIS)

McCusker, N.

1999-09-01

Copper has been deposited by sputtering and investigated for application as high density interconnects, with a view to maximising its performance and reliability. A sputter deposition process using gettering has been developed, which produces consistently pure, low resistivity films. A relationship between film thickness and resistivity has been explained by studying the grain growth process in copper films using atomic force microscopy. The Maydas-Shatzkes model has been used to separate the contributions of grain boundary and surface scattering to thin film resistivity, in copper and gold. Stress and texture in copper film have been studied. Annealing has been used to promote grain growth and texture development. Electromigration has been studied in copper and aluminium interconnects using a multi-line accelerated test set-up. A difference in failure distributions and void morphologies has been explained by an entirely different damage mechanism. The importance of surface/interface migration in electromigration damage of copper lines has been established and explained using a grain boundary-grooving model. A tantalum overlayer was found to extend the lifetime of copper lines. A composite sputtering target has been used to deposit copper/zirconium alloy films. The composition of the alloys was studied by Rutherford backscattering, Auger and secondary neutral mass spectrometry. The alloy films had an improved electromigration lifetime. A surface controlled mechanism is proposed to explain the advantage. A metal oxide semiconductor (MOS) capacitor technique is used to investigate barrier reliability. Tungsten is shown to be an effective diffusion barrier for copper, up to 700 deg. C. (author)

Increase of the electrical resistance of thin copper film due to 14 MeV neutron irradiation

International Nuclear Information System (INIS)

Agrawal, S.K.; Kumar, U.; Nigam, A.K.; Singh, S.P.

1981-01-01

The variation in the electrical resistance of thin copper film (500 A 0 thick), grown on the glass slide has been measured with increasing 14 MeV neutron irradiation time. The electrical resistance vs irradiation time curve shows an interesting behaviour after an irradiation of 40 minutes. However, there is a net increase in the electrical resistance with increasing neutron dose. The maximum increase in the observed electrical resistance after an irradiation of 115 mins, is 4.45%. The microstructural studies of irradiated film were made using TEM and TED techniques. The TEM patterns up to an irradiation time of 1.00 hr do not show any appreciable change in the microstructure. The TED patterns also do not show any appreciable change in the diffraction pattern up to an irradiation time of 1.0 hr. But after an irradiation time of 1.5 hrs, two extra rings appear in the TED pattern which disappear with increasing neutron irradiation time

Effects of interface edge configuration on residual stress in the bonded structures for a divertor application

International Nuclear Information System (INIS)

Kitamura, K.; Nagata, K.; Shibui, M.; Tachikawa, N.; Araki, M.

1998-01-01

Residual stresses in the interface region, that developed at the cool down during the brazing, were evaluated for several bonded structures to assess the mechanical strength of the bonded interface, using thermoelasto-plastic stress analysis. Normal stress components of the residual stresses around the interface edge of graphite-copper (C-Cu) bonded structures were compared for three types of bonded features such as flat-type, monoblock-type and saddle-type. The saddle-type structure was found to be favorable for its relatively low residual stress, easy fabrication accuracy on bonded interface and armor replacement. Residual stresses around the interface edge in three armor materials/copper bonded structures for a divertor plate were also examined for the C-Cu, tungsten-copper (W-Cu) and molybdenum alloy-copper (TZM-Cu), varying the interface wedge angle from 45 to 135 . An optimal bonded configuration for the least value of residual stress was found to have a wedge angle of 45 for the C-Cu, and 135 for both the W-Cu and TZM-Cu bonded ones. (orig.)

Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

Science.gov (United States)

Chen, Wenjun; Deng, Dunying; Cheng, Yuanrong; Xiao, Fei

2015-07-01

The easy oxidation of copper is one critical obstacle to high-performance copper-filled isotropically conductive adhesives (ICAs). In this paper, a facile method to prepare highly reliable, highly conductive, and low-cost ICAs is reported. The copper fillers were treated by organic acids for oxidation prevention. Compared with ICA filled with untreated copper flakes, the ICA filled with copper flakes treated by different organic acids exhibited much lower bulk resistivity. The lowest bulk resistivity achieved was 4.5 × 10-5 Ω cm, which is comparable to that of commercially available Ag-filled ICA. After 500 h of 85°C/85% relative humidity (RH) aging, the treated ICAs showed quite stable bulk resistivity and relatively stable contact resistance. Through analyzing the results of x-ray diffraction, x-ray photoelectron spectroscopy, and thermogravimetric analysis, we found that, with the assistance of organic acids, the treated copper flakes exhibited resistance to oxidation, thus guaranteeing good performance.

Electrical conduction in composites containing copper core–copper ...

Indian Academy of Sciences (India)

Unknown

of Mott's small polaron hopping conduction model. ... sample exhibited a metallic conduction confirming the formation of a percolative chain of ..... value of εp. Also the oxide layer formation on the initially unoxidized copper particles will increase the resistivity level of the nanocomposite. This is borne out by results shown in ...

Yeast Starter as a Biotechnological Tool for Reducing Copper Content in Wine

Directory of Open Access Journals (Sweden)

Angela Capece

2018-01-01

Full Text Available Copper is widely used in agriculture as a traditional fungicide in organic farming to control downy mildew on grapes, consequently it is possible to find this metal during all stages of the vinification process. Low amounts of copper play a key role on the function of key cell enzymes, whereas excess quantities can exert amount-dependent cytotoxicity, resulting in general cellular damage. Nowadays the excessive copper ions in wines is removed by addition of adsorbents, but these additives can influence the sensory characteristics of wine, as well as detrimental to the health of consumers. It is well known that high concentrations of Cu2+ can be toxic to yeasts, inhibiting growth and activity, causing sluggish fermentation and reducing alcohol production. In this study, 47 S. cerevisiae strains were tested for copper tolerance by two different tests, growth on copper added medium and fermentative activity in copper added grape must. The results obtained by the two different tests were comparable and the high strain variability found was used to select four wild strains, possessing this characteristic at the highest (PP1-13 and A20 and the lowest level (MPR2-24 and A13. The selected strains were tested in synthetic and natural grape must fermentation for ability to reduce copper content in wine. The determination of copper content in wines and yeast cells revealed that at the lowest copper residual in wine corresponded the highest content in yeast cells, indicating a strong strain ability to reduce the copper content in wine. This effect was inversely correlated with strain copper resistance and the most powerful strain in copper reduction was the most sensitive strain, MPR2-24. This wild strain was finally tested as starter culture in cellar pilot scale fermentation in comparison to a commercial starter, confirming the behavior exhibited at lab scale. The use of this wild strain to complete the alcoholic fermentation and remove the copper from

Study of the Effect of Sulfide Ions on the Corrosion Resistance of Copper for Use in Containers for High Level radioactive waste

International Nuclear Information System (INIS)

Urbal Espinoza, Andrea Elizabeth

2000-01-01

The work 'Study of sulfide ion on Resisting Copper Corrosion' is part of the project 'Study of Copper Corrosion in Underground Water Solution in Reducer Conditions', which the Department of Nuclear Materials, Chilean Nuclear Energy Commission is carrying out. These activities are important because of this metal's potential applications for handling and controlling contaminating wastes that are a product of using nuclear energy in electric generation. Copper has important mechanical properties and is also resistant to disintegration in corrosive environments, which is an important condition for its use in manufacturing of high level radioactive waste containers. This work is based on a study of cyclic volta metric curves, anodic and cathodic polarization and potentiostatic measurements, with which the potential range, sweep speed system, electrochemical reactions involved and corrosion speed could be defined. The microstructural characterization of the films was done by Scanning Electron Microscopy (SEM), and the chemical composition and surface contamination of the film were studied by photoelectron spectroscopy induced by X- rays (XPS), and the crystalline structure by X- ray Diffraction (XRD). Some noticeable results, such as low potentials (less than .7 V, in cathode direction) and high concentrations of sulfur make the formation of copper sulfides (I) and (II) possible; unlike the potential over .6 V, in anodic direction, where copper oxides (I) and (II) are formed, but they are inhibited by high sulfur concentrations. The morphological study of the copper surface has shown that the film that forms is more abundant and granular at higher cathodic potentials, forming small pits on the surface. The effect of the presence of sulfur ions is minimal, and the metal's deterioration is inhibited by other ions in the groundwater. The corrosion rate is greater as the sulfur concentration rises, and a time period of 20,000 years can be predicted for the total corrosion of

Laser sintering of copper nanoparticles

International Nuclear Information System (INIS)

Zenou, Michael; Saar, Amir; Ermak, Oleg; Kotler, Zvi

2014-01-01

Copper nanoparticle (NP) inks serve as an attractive potential replacement to silver NP inks in functional printing applications. However their tendency to rapidly oxidize has so far limited their wider use. In this work we have studied the conditions for laser sintering of Cu-NP inks in ambient conditions while avoiding oxidation. We have determined the regime for stable, low-resistivity copper (< ×3 bulk resistivity value) generation in terms of laser irradiance and exposure duration and have indicated the limits on fast processing. The role of pre-drying conditions on sintering outcome has also been studied. A method, based on spectral reflectivity measurements, was used for non-contact monitoring of the sintering process evolution. It also indicates preferred spectral regions for sintering. Finally, we illustrated how selective laser sintering can generate high-quality, fine line (<5 µm wide) and dense copper circuits. (paper)

A copper-induced quinone degradation pathway provides protection against combined copper/quinone stress in Lactococcus lactis IL1403.

Science.gov (United States)

Mancini, Stefano; Abicht, Helge K; Gonskikh, Yulia; Solioz, Marc

2015-02-01

Quinones are ubiquitous in the environment. They occur naturally but are also in widespread use in human and industrial activities. Quinones alone are relatively benign to bacteria, but in combination with copper, they become toxic by a mechanism that leads to intracellular thiol depletion. Here, it was shown that the yahCD-yaiAB operon of Lactococcus lactis IL1403 provides resistance to combined copper/quinone stress. The operon is under the control of CopR, which also regulates expression of the copRZA copper resistance operon as well as other L. lactis genes. Expression of the yahCD-yaiAB operon is induced by copper but not by quinones. Two of the proteins encoded by the operon appear to play key roles in alleviating quinone/copper stress: YaiB is a flavoprotein that converts p-benzoquinones to less toxic hydroquinones, using reduced nicotinamide adenine dinucleotide phosphate (NADPH) as reductant; YaiA is a hydroquinone dioxygenase that converts hydroquinone putatively to 4-hydroxymuconic semialdehyde in an oxygen-consuming reaction. Hydroquinone and methylhydroquinone are both substrates of YaiA. Deletion of yaiB causes increased sensitivity of L. lactis to quinones and complete growth arrest under combined quinone and copper stress. Copper induction of the yahCD-yaiAB operon offers protection to copper/quinone toxicity and could provide a growth advantage to L. lactis in some environments. © 2014 John Wiley & Sons Ltd.

Spatial Pattern of Copper Phosphate Precipitation Involves in Copper Accumulation and Resistance of Unsaturated Pseudomonas putida CZ1 Biofilm.

Science.gov (United States)

Chen, Guangcun; Lin, Huirong; Chen, Xincai

2016-12-28

Bacterial biofilms are spatially structured communities that contain bacterial cells with a wide range of physiological states. The spatial distribution and speciation of copper in unsaturated Pseudomonas putida CZ1 biofilms that accumulated 147.0 mg copper per g dry weight were determined by transmission electron microscopy coupled with energy dispersive X-ray analysis, and micro-X-ray fluorescence microscopy coupled with micro-X-ray absorption near edge structure (micro-XANES) analysis. It was found that copper was mainly precipitated in a 75 μm thick layer as copper phosphate in the middle of the biofilm, while there were two living cell layers in the air-biofilm and biofilm-medium interfaces, respectively, distinguished from the copper precipitation layer by two interfaces. The X-ray absorption fine structure analysis of biofilm revealed that species resembling Cu₃(PO₄)₂ predominated in biofilm, followed by Cu-Citrate- and Cu-Glutathione-like species. Further analysis by micro-XANES revealed that 94.4% of copper were Cu₃(PO₄)₂-like species in the layer next to the air interface, whereas the copper species of the layer next to the medium interface were composed by 75.4% Cu₃(PO₄)₂, 10.9% Cu-Citrate-like species, and 11.2% Cu-Glutathione-like species. Thereby, it was suggested that copper was initially acquired by cells in the biofilm-air interface as a citrate complex, and then transported out and bound by out membranes of cells, released from the copper-bound membranes, and finally precipitated with phosphate in the extracellular matrix of the biofilm. These results revealed a clear spatial pattern of copper precipitation in unsaturated biofilm, which was responsible for the high copper tolerance and accumulation of the biofilm.

Veterinary antibiotic resistance, residues, and ecological risks in environmental samples obtained from poultry farms, Egypt.

Science.gov (United States)

Dahshan, Hesham; Abd-Elall, Amr Mohamed Mohamed; Megahed, Ayman Mohamed; Abd-El-Kader, Mahdy A; Nabawy, Ehab Elsayed

2015-02-01

In Egypt, poultry production constitutes one of the main sources of pollution with veterinary antibiotics (VAs) into the environment. About 80 % of meat production in Egypt is of poultry origin, and the potential environmental risks associated with the use of VAs in these farms have not yet been properly evaluated. Thus, the main purpose of this research was to evaluate the prevalence of antibiotic-resistant enteric key bacteria and the incidence of residual antibiotics in poultry farm environmental samples and to determine whether fertilizing soils with poultry litter from farms potentially brings ecological risks. From December 2011 to September 2012, a total of 225 litter, bird dropping, and water samples were collected from 75 randomly selected boiler poultry farms. A high prevalence of Escherichia coli (n = 179; 79.5 %) in contrast to the low prevalence of Salmonella spp. (n = 7; 3.1 %) was detected. Amongst E. coli isolates, serotypes O142:K86, O125:K70, O91:K, and O119:K69 were the most common. Meanwhile, Salmonella enterica serotypes emek and enteritidis were recovered. The antibiograms using the disc diffusion method revealed significantly more common resistant and multi-resistant isolates in broiler poultry farms. Residues of tetracycline and ciprofloxacin were detected at 2.125 and 1.401 mg kg(-1) mean levels, respectively, in environmental samples contaminated with E. coli-resistant strains by HPLC. The risk evaluations highlighted that tetracycline residues in poultry litter significantly display environmental risks with a hazard quotient value above 1 (1.64). Our study implies that ineffective implementation of veterinary laws which guide and guard against incorrect VA usage may potentially bring health and environmental risks.

Swelling of pure copper and copper alloys after high fluence irradiation in FFTF [Fast Flux Test Facility] at approximately 4500C

International Nuclear Information System (INIS)

Garner, F.A.; Brager, H.R.

1986-03-01

The swelling of pure copper and various copper-base alloys has been determined at 47.2 dpa after irradiation in FFTF-MOTA at ∼450 0 C. Data are also becoming available at 63.3 dpa. The alloys tend to fall into two broad categories, those that swell appreciably, sometimes with an S-shaped behavior, and those that resist swelling to very high neutron exposures. It appears that copper may have an intrinsic swelling rate of ∼1%/dpa that is often not reached due to its tendency toward saturation of swelling. The most swelling-resistant alloys examined to date are CuAl25, MZC and Cu-2.0Be

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Science.gov (United States)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-07-01

The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Radiation-effects limits on copper in superconducting magnets

Energy Technology Data Exchange (ETDEWEB)

Guinan, M.W.

1983-05-25

The determination of the response of copper stabilizers to neutron irradiation in fusion-reactor superconducting magnets requires information in four areas: (1) neutron flux and spectrum determination, (2) resistivity changes at zero field, (3) resistivity changes at field, and (4) the cyclic irradiation and annealing. Applications of our current understanding of the limits of copper stabilizers in fusion-reactor designs are explored in two examples. Recommendations for future additions to the data base are discussed.

Radiation-effects limits on copper in superconducting magnets

International Nuclear Information System (INIS)

Guinan, M.W.

1983-01-01

The determination of the response of copper stabilizers to neutron irradiation in fusion-reactor superconducting magnets requires information in four areas: (1) neutron flux and spectrum determination, (2) resistivity changes at zero field, (3) resistivity changes at field, and (4) the cyclic irradiation and annealing. Applications of our current understanding of the limits of copper stabilizers in fusion-reactor designs are explored in two examples. Recommendations for future additions to the data base are discussed

Residual resistivity and its anisotropy in random CoNi and CuNi ferromagnetic alloys

Czech Academy of Sciences Publication Activity Database

Turek, Ilja; Záležák, Tomáš

2010-01-01

Roč. 200, č. 5 (2010), 052029/1-052029/4 ISSN 1742-6588. [International Conference on Magnetism - ICM 2009. Karlsruhe, 26.07.2009-31.07.2009] Institutional research plan: CEZ:AV0Z20410507 Keywords : residual resistivity * anisotropic magnetoresistance * ferromagnets Subject RIV: BM - Solid Matter Physics ; Magnetism

Encapsulation of electroless copper patterns into diamond films

Energy Technology Data Exchange (ETDEWEB)

Pimenov, S.M.; Shafeev, G.A.; Lavrischev, S.V. [General Physics Institute, Moscow (Russian Federation)] [and others

1995-12-31

The results are reported on encapsulating copper lines into diamond films grown by a DC plasma CVD. The process includes the steps of (i) laser activation of diamond for electroless metal plating, (ii) electroless copper deposition selectively onto the activated surface regions, and (iii) diamond regrowth on the Cu-patterned diamond films. The composition and electrical properties of the encapsulated copper lines were examined, revealing high purity and low electrical resistivity of the encapsulated electroless copper.

Moderate Dilution of Copper Slag by Natural Gas

Science.gov (United States)

Zhang, Bao-jing; Zhang, Ting-an; Niu, Li-ping; Liu, Nan-song; Dou, Zhi-he; Li, Zhi-qiang

2018-01-01

To enable use of copper slag and extract the maximum value from the contained copper, an innovative method of reducing moderately diluted slag to smelt copper-containing antibacterial stainless steel is proposed. This work focused on moderate dilution of copper slag using natural gas. The thermodynamics of copper slag dilution and ternary phase diagrams of the slag system were calculated. The effects of blowing time, temperature, matte settling time, and calcium oxide addition were investigated. The optimum reaction conditions were identified to be blowing time of 20 min, reaction temperature of 1250°C, settling time of 60 min, CaO addition of 4% of mass of slag, natural gas flow rate of 80 mL/min, and outlet pressure of 0.1 MPa. Under these conditions, the Fe3O4 and copper contents of the residue were 7.36% and 0.50%, respectively.

Activation of ADAM 12 protease by copper

DEFF Research Database (Denmark)

Loechel, F; Wewer, Ulla M.

2001-01-01

Conversion of latent proteases to the active form occurs by various mechanisms characteristic for different protease families. Here we report that the disintegrin metalloprotease ADAM 12-S is activated by Cu(II). Copper activation is distinct from the cysteine switch component of latency: elimina......Conversion of latent proteases to the active form occurs by various mechanisms characteristic for different protease families. Here we report that the disintegrin metalloprotease ADAM 12-S is activated by Cu(II). Copper activation is distinct from the cysteine switch component of latency......: elimination of the ADAM 12 cysteine switch by a point mutation in the propeptide had no effect on copper activation, whereas mutation of an unpaired cysteine residue in the catalytic domain resulted in a mutant form of ADAM 12-S that was insensitive to copper. This suggests a multi-step activation mechanism...... for ADAM 12 involving both furin cleavage and copper binding....

Copper bis(diphosphine) complexes: radiopharmaceuticals for the detection of multi-drug resistance in tumours by PET

International Nuclear Information System (INIS)

Lewis, J.S.; Dearling, J.L.S.; Blower, P.J.; Sosabowski, J.K.; Zweit, J.; Carnochan, P.; Kelland, L.R.; Coley, H.M.

2000-01-01

Experience with imaging of the multi-drug resistance (MDR) phenotype in tumours using technetium-99m sestamibi, a substrate of the P-glycoprotein (Pgp) transporter, suggests that better quantification of images and separation of MDR from other variables affecting tracer uptake in tumours are required. One approach to these problems is the development of short half-life positron-emitting tracers which are substrates of Pgp. Several lipophilic cationic copper(I) bis(diphosphine) complexes labelled with copper-64 have been synthesised and evaluated in vitro as substrates for Pgp. The synthesis is rapid and efficient with no need for purification steps. The chemistry is suitable for use with very short half-life radionuclides such as copper-62 (9.7 min) and copper-60 (23.7 min). Incubation of the complexes with human serum in vitro showed that they are sufficiently stable in serum to support clinical imaging, and the more lipophilic members of the series are taken up rapidly by cells (Chinese hamster ovary and human ovarian carcinoma) in vitro with great avidity. Uptake in human ovarian carcinoma cells is significantly reduced after several months of conditioning in the presence of doxorubicin, which induces increased Pgp expression. Uptake in hooded rat sarcoma (HSN) cells, which express Pgp, is significantly increased in the presence of the MDR modulator cyclosporin A. Biodistribution studies in hooded rats show rapid blood clearance, excretion through both kidneys and liver, and low uptake in other tissues. The one complex investigated in HSN tumour-bearing rats showed uptake in tumour increasing up to 30 min p.i. while it was decreasing in other tissues. We conclude that diphosphine ligands offer a good basis for development of radiopharmaceuticals containing copper radionuclides, and that this series of complexes should undergo further evaluation in vivo as positron emission tomography imaging agents for MDR. (orig.)

Indoor residual spraying with a mixture of clothianidin (a neonicotinoid insecticide and deltamethrin provides improved control and long residual activity against pyrethroid resistant Anopheles gambiae sl in Southern Benin.

Directory of Open Access Journals (Sweden)

Corine Ngufor

Full Text Available There is an urgent need for new insecticides for indoor residual spraying (IRS which can provide improved and prolonged control of malaria vectors that have developed resistance to existing insecticides. The neonicotinoid, clothianidin represents a class of chemistry new to public health. Clothianidin acts as an agonist on nicotinic acetyl choline receptors. IRS with a mixture of Clothianidin and another WHO approved insecticide such as deltamethrin could provide improved control of insecticide resistant malaria vector populations and serve as a tool for insecticide resistance management.The efficacy and residual activity of a novel IRS mixture of deltamethrin and clothianidin was evaluated against wild pyrethroid resistant An. gambiae sl in experimental huts in Cove, Benin. Two application rates of the mixture were tested and comparison was made with clothianidin and deltamethrin applied alone. To assess the residual efficacy of the treatments on different local wall substrates, the inner walls of the experimental huts were covered with either cement, mud or plywood.Clothianidin demonstrated a clear delayed expression in mortality of wild pyrethroid resistant An. gambiae sl in the experimental huts which reached its full effect 120 hours after exposure. Overall mortality over the 12-month hut trial was 15% in the control hut and 24-29% in the deltamethrin-treated huts. The mixture of clothianidin 200mg/m2 and deltamethrin 25mg/m2 induced high overall hut mortality rates (87% on mud walls, 82% on cement walls and 61% on wooden walls largely due to the clothianidin component and high hut exiting rates (67-76% mostly due to the deltamethrin component. Mortality rates remained >80% for 8-9 months on mud and cement walls. The residual activity trend was confirmed by results from monthly in situ cone bioassays with laboratory susceptible An. gambiae Kisumu strain.IRS campaigns with the mixture of clothianidin plus deltamethrin have the potential to

Indoor residual spraying with a mixture of clothianidin (a neonicotinoid insecticide) and deltamethrin provides improved control and long residual activity against pyrethroid resistant Anopheles gambiae sl in Southern Benin.

Science.gov (United States)

Ngufor, Corine; Fongnikin, Augustin; Rowland, Mark; N'Guessan, Raphael

2017-01-01

There is an urgent need for new insecticides for indoor residual spraying (IRS) which can provide improved and prolonged control of malaria vectors that have developed resistance to existing insecticides. The neonicotinoid, clothianidin represents a class of chemistry new to public health. Clothianidin acts as an agonist on nicotinic acetyl choline receptors. IRS with a mixture of Clothianidin and another WHO approved insecticide such as deltamethrin could provide improved control of insecticide resistant malaria vector populations and serve as a tool for insecticide resistance management. The efficacy and residual activity of a novel IRS mixture of deltamethrin and clothianidin was evaluated against wild pyrethroid resistant An. gambiae sl in experimental huts in Cove, Benin. Two application rates of the mixture were tested and comparison was made with clothianidin and deltamethrin applied alone. To assess the residual efficacy of the treatments on different local wall substrates, the inner walls of the experimental huts were covered with either cement, mud or plywood. Clothianidin demonstrated a clear delayed expression in mortality of wild pyrethroid resistant An. gambiae sl in the experimental huts which reached its full effect 120 hours after exposure. Overall mortality over the 12-month hut trial was 15% in the control hut and 24-29% in the deltamethrin-treated huts. The mixture of clothianidin 200mg/m2 and deltamethrin 25mg/m2 induced high overall hut mortality rates (87% on mud walls, 82% on cement walls and 61% on wooden walls) largely due to the clothianidin component and high hut exiting rates (67-76%) mostly due to the deltamethrin component. Mortality rates remained >80% for 8-9 months on mud and cement walls. The residual activity trend was confirmed by results from monthly in situ cone bioassays with laboratory susceptible An. gambiae Kisumu strain. IRS campaigns with the mixture of clothianidin plus deltamethrin have the potential to provide

Ligand-Doped Copper Oxo-hydroxide Nanoparticles are Effective Antimicrobials

Science.gov (United States)

Bastos, Carlos A. P.; Faria, Nuno; Ivask, Angela; Bondarenko, Olesja M.; Kahru, Anne; Powell, Jonathan

2018-04-01

Bacterial resistance to antimicrobial therapies is an increasing clinical problem. This is as true for topical applications as it is for systemic therapy. Topically, copper ions may be effective and cheap antimicrobials that act through multiple pathways thereby limiting opportunities to bacteria for resistance. However, the chemistry of copper does not lend itself to facile formulations that will readily release copper ions at biologically compatible pHs. Here, we have developed nanoparticulate copper hydroxide adipate tartrate (CHAT) as a cheap, safe, and readily synthesised material that should enable antimicrobial copper ion release in an infected wound environment. First, we synthesised CHAT and showed that this had disperse aquated particle sizes of 2-5 nm and a mean zeta potential of - 40 mV. Next, when diluted into bacterial medium, CHAT demonstrated similar efficacy to copper chloride against Escherichia coli and Staphylococcus aureus, with dose-dependent activity occurring mostly around 12.5-50 mg/L of copper. Indeed, at these levels, CHAT very rapidly dissolved and, as confirmed by a bacterial copper biosensor, showed identical intracellular loading to copper ions derived from copper chloride. However, when formulated at 250 mg/L in a topically applied matrix, namely hydroxyethyl cellulose, the benefit of CHAT over copper chloride was apparent. The former yielded rapid sustained release of copper within the bactericidal range, but the copper chloride, which formed insoluble precipitates at such concentration and pH, achieved a maximum release of 10 ± 7 mg/L copper by 24 h. We provide a practical formulation for topical copper-based antimicrobial therapy. Further studies, especially in vivo, are merited.

Copper Sensing Function of Drosophila Metal-Responsive Transcription Factor-1 Is Mediated By a Tetranuclear Cu(I) Cluster

Energy Technology Data Exchange (ETDEWEB)

Chen, X.; Hua, H.; Balamurugan, K.; Kong, X.; Zhang, L.; George, G.N.; Georgiev, O.; Schaffner, W.; Giedroc, D.P.

2009-05-12

Drosophila melanogaster MTF-1 (dMTF-1) is a copper-responsive transcriptional activator that mediates resistance to Cu, as well as Zn and Cd. Here, we characterize a novel cysteine-rich domain which is crucial for sensing excess intracellular copper by dMTF-1. Transgenic flies expressing mutant dMTF-1 containing alanine substitutions of two, four or six cysteine residues within the sequence {sup 547}CNCTNCKCDQTKSCHGGDC{sup 565} are significantly or completely impaired in their ability to protect flies from copper toxicity and fail to up-regulate MtnA (metallothionein) expression in response to excess Cu. In contrast, these flies exhibit wild-type survival in response to copper deprivation thus revealing that the cysteine cluster domain is required only for sensing Cu load by dMTF-1. Parallel studies show that the isolated cysteine cluster domain is required to protect a copper-sensitive S. cerevisiae ace1 strain from copper toxicity. Cu(I) ligation by a Cys-rich domain peptide fragment drives the cooperative assembly of a polydentate [Cu{sub 4}-S{sub 6}] cage structure, characterized by a core of trigonally S{sub 3} coordinated Cu(I) ions bound by bridging thiolate ligands. While reminiscent of Cu{sub 4}-L{sub 6} (L = ligand) tetranuclear clusters in copper regulatory transcription factors of yeast, the absence of significant sequence homology is consistent with convergent evolution of a sensing strategy particularly well suited for Cu(I).

Selective leaching process for the recovery of copper and zinc oxide from copper-containing dust.

Science.gov (United States)

Wu, Jun-Yi; Chang, Fang-Chih; Wang, H Paul; Tsai, Ming-Jer; Ko, Chun-Han; Chen, Chih-Cheng

2015-01-01

The purpose of this study was to develop a resource recovery procedure for recovering copper and zinc from dust produced by copper smelting furnaces during the manufacturing of copper-alloy wires. The concentrations of copper in copper-containing dust do not meet the regulation standards defined by the Taiwan Environmental Protection Administration; therefore, such waste is classified as hazardous. In this study, the percentages of zinc and copper in the dust samples were approximately 38.4% and 2.6%, respectively. To reduce environmental damage and recover metal resources for industrial reuse, acid leaching was used to recover metals from these inorganic wastes. In the first stage, 2 N of sulphuric acid was used to leach the dust, with pH values controlled at 2.0-3.0, and a solid-to-liquid ratio of 1:10. The results indicated that zinc extraction efficiency was higher than 95%. A selective acid leaching process was then used to recover the copper content of the residue after filtration. In the second stage, an additional 1 N of sulphuric acid was added to the suspension in the selective leaching process, and the pH value was controlled at 1.5-2.0. The reagent sodium hydroxide (2 N) was used as leachate at a pH greater than 7. A zinc hydroxide compound formed during the process and was recovered after drying. The yields for zinc and copper were 86.9-93.5% and 97.0-98.9%, respectively.

Comparative study on the passivation layers of copper sulphide minerals during bioleaching

Science.gov (United States)

Fu, Kai-bin; Lin, Hai; Mo, Xiao-lan; Wang, Han; Wen, Hong-wei; Wen, Zi-long

2012-10-01

The bioleaching of copper sulphide minerals was investigated by using A. ferrooxidans ATF6. The result shows the preferential order of the minerals bioleaching as djurleite>bornite>pyritic chalcopyrite>covellite>porphyry chalcopyrite. The residues were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). It is indicated that jarosite may not be responsible for hindered dissolution. The elemental sulfur layer on the surface of pyritic chalcopyrite residues is cracked. The compact surface layer of porphyry chalcopyrite may strongly hinder copper extraction. X-ray photoelectron spectroscopy (XPS) further confirms that the passivation layers of covellite, pyritic chalcopyrite, and porphyry chalcopyrite are copper-depleted sulphide Cu4S11, S8, and copper-rich iron-deficient polysulphide Cu4Fe2S9, respectively. The ability of these passivation layers was found as Cu4Fe2S9>Cu4S11>S8>jarosite.

Copper Homeostasis in Escherichia coli and Other Enterobacteriaceae.

Science.gov (United States)

Rensing, Christopher; Franke, Sylvia

2007-04-01

An interesting model for studying environmental influences shaping microbial evolution is provided by a multitude of copper resistance and copper homeostasis determinants in enteric bacteria. This review describes these determinants and tries to relate their presence to the habitat of the respective organism, as a current hypothesis predicts that the environment should determine an organism's genetic makeup. In Escherichia coli there are four regulons that are induced in the presence of copper. Two, the CueR and the CusR regulons, are described in detail. A central component regulating intracellular copper levels, present in all free-living enteric bacteria whose genomes have so far been sequenced, is a Cu(I)translocating P-type ATPase. The P-type ATPase superfamily is a ubiquitous group of proteins involved in the transport of charged substrates across biological membranes. Whereas some components involved in copper homeostasis can be found in both anaerobes and aerobes, multi-copper oxidases (MCOs) implicated in copper tolerance in E. coli, such as CueO and the plasmid-based PcoA, can be found only in aerobic organisms. Several features indicate that CueO, PcoA, and other related MCOs are specifically adapted to combat copper-mediated oxidative damage. In addition to these well-characterized resistance operons, there are numerous other genes that appear to be involved in copper binding and trafficking that have not been studied in great detail. SilE and its homologue PcoE, for example, are thought to effect the periplasmic binding and sequestration of silver and copper, respectively.

Body of Knowledge (BOK) for Copper Wire Bonds

Science.gov (United States)

Rutkowski, E.; Sampson, M. J.

2015-01-01

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications

Culture-dependent and independent studies of microbial diversity in highly copper-contaminated Chilean marine sediments.

Science.gov (United States)

Besaury, Ludovic; Marty, Florence; Buquet, Sylvaine; Mesnage, Valérie; Muyzer, Gerard; Quillet, Laurent

2013-02-01

Cultivation and molecular-based approaches were used to study microbial diversity in two Chilean marine sediments contaminated with high (835 ppm) and very high concentrations of copper (1,533 ppm). The diversity of cultivable bacteria resistant to copper was studied at oxic and anoxic conditions, focusing on sulfate-, thiosulfate-, and iron-reducing bacteria. For both sediments, the cultivable bacteria isolated at oxic conditions were mostly affiliated to the genus Bacillus, while at anoxic conditions the majority of the cultivable bacteria found were closely related to members of the genera Desulfovibrio, Sphingomonas, and Virgibacillus. Copper resistance was between 100 and 400 ppm, with the exception of a strain affiliated to members of the genus Desulfuromonas, which was resistant up to 1,000 ppm of copper. In parallel, cloning and sequencing of 16S rRNA was performed to study the total bacterial diversity in the sediments. A weak correlation was observed between the isolated strains and the 16S rRNA operational taxonomic units detected. The presence of copper resistance genes (copA, cusA, and pcoA) was tested for all the strains isolated; only copA was detected in a few isolates, suggesting that other copper resistance mechanisms could be used by the bacteria in those highly copper-contaminated sediments.

Mesophilic leaching of copper sulphide sludge

Directory of Open Access Journals (Sweden)

VLADIMIR B. CVETKOVSKI

2009-02-01

Full Text Available Copper was precipitated using a sodium sulphide solution as the precipitation agent from an acid solution containing 17 g/l copper and 350 g/l sulphuric acid. The particle size of nearly 1 µm in the sulphide sludge sample was detected by optical microscopy. Based on chemical and X-ray diffraction analyses, covellite was detected as the major sulphide mineral. The batch bioleach amenability test was performed at 32 °C on the Tk31 mine mesophilic mixed culture using a residence time of 28 days. The dissolution of copper sulphide by direct catalytic leaching of the sulphides with bacteria attached to the particles was found to be worthy, although a small quantity of ferrous ions had to be added to raise the activity of the bacteria and the redox potential of the culture medium. Throughout the 22-day period of the bioleach test, copper recovery based on residue analysis indicated a copper extraction of 95 %, with copper concentration in the bioleach solution of 15 g/l. The slope of the straight line tangential to the exponential part of the extraction curve gave a copper solubilisation rate of 1.1 g/l per day. This suggests that a copper extraction of 95 % for the period of bioleach test of 13.6 days may be attained in a three-stage bioreactor system.

RESULTS OF COPPER CATALYZED PEROXIDE OXIDATION (CCPO) OF TANK 48H SIMULANTS

Energy Technology Data Exchange (ETDEWEB)

Peters, T.; Pareizs, J.; Newell, J.; Fondeur, F.; Nash, C.; White, T.; Fink, S.

2012-08-14

Savannah River National Laboratory (SRNL) performed a series of laboratory-scale experiments that examined copper-catalyzed hydrogen peroxide (H{sub 2}O{sub 2}) aided destruction of organic components, most notably tetraphenylborate (TPB), in Tank 48H simulant slurries. The experiments were designed with an expectation of conducting the process within existing vessels of Building 241-96H with minimal modifications to the existing equipment. Results of the experiments indicate that TPB destruction levels exceeding 99.9% are achievable, dependent on the reaction conditions. The following observations were made with respect to the major processing variables investigated. A lower reaction pH provides faster reaction rates (pH 7 > pH 9 > pH 11); however, pH 9 reactions provide the least quantity of organic residual compounds within the limits of species analyzed. Higher temperatures lead to faster reaction rates and smaller quantities of organic residual compounds. Higher concentrations of the copper catalyst provide faster reaction rates, but the highest copper concentration (500 mg/L) also resulted in the second highest quantity of organic residual compounds. Faster rates of H{sub 2}O{sub 2} addition lead to faster reaction rates and lower quantities of organic residual compounds. Testing with simulated slurries continues. Current testing is examining lower copper concentrations, refined peroxide addition rates, and alternate acidification methods. A revision of this report will provide updated findings with emphasis on defining recommended conditions for similar tests with actual waste samples.

High resistance to sulfur poisoning of Ni with copper skin under electric field

Energy Technology Data Exchange (ETDEWEB)

Xu, Xiaopei; Zhang, Yanxing [College of Physics and Materials Science, Henan Normal University, Xinxiang, Henan 453007 (China); Yang, Zongxian, E-mail: yzx@henannu.edu.cn [College of Physics and Materials Science, Henan Normal University, Xinxiang, Henan 453007 (China); Collaborative Innovation Center of Nano Functional Materials and Applications, Kaifeng, Henan Province (China)

2017-02-12

The effects of sulfur poisoning on the (1 0 0), (1 1 0) and (1 1 1) surfaces of pure Ni and Cu/Ni alloy are studied in consideration of the effect of electric field. The effects of Cu dopants on the S poisoning characteristics are analyzed by the means of the density functional theory results in combination with thermodynamics data using the ab initio atomistic thermodynamic method. When the Cu concentration increases to 50% on the surface layer of the Cu/Ni alloy, the (1 1 0) surface becomes the most vulnerable to the sulfur poisoning. Ni with a copper skin can mostly decrease the sulfur poisoning effect. Especially under the electric field of 1.0 V/Å, the sulfur adsorption and phase transition temperature can be further reduced. We therefore propose that Ni surfaces with copper skin can be very effective to improve the resistance to sulfur poisoning of the Ni anode under high electric field. - Highlights: • The electric field and Cu dopant effects on S poisoning feature of Ni are analyzed. • The present of large electric field can enhance S tolerance. • Cu dopant concentration affect the surface electronic structure of Ni. • 100% Cu doping on surface Ni layer can mostly decrease the sulfur poison.

Nanoscale Copper and Copper Compounds for Advanced Device Applications

Science.gov (United States)

Chen, Lih-Juann

2016-12-01

Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

Weight loss studies of fastener materials corrosion in contact with timbers treated with copper azole and alkaline copper quaternary compounds

Energy Technology Data Exchange (ETDEWEB)

Kear, Gareth [Building Research Association of New Zealand (BRANZ) Ltd., Science and Engineering Services, Private Bag 50 908, Porirua City 5240 (New Zealand)], E-mail: G.Kear@soton.ac.uk; Wu Haizhen; Jones, Mark S. [Building Research Association of New Zealand (BRANZ) Ltd., Science and Engineering Services, Private Bag 50 908, Porirua City 5240 (New Zealand)

2009-02-15

Corrosion rates of mild steel, AISI 316 stainless steel and hot-dipped galvanised steel in contact with preservative-treated Pinus radiata have been determined using four distinct accelerated (49 {+-} 1 deg. C) and non-accelerated (21 {+-} 2 deg. C) weight loss methodologies. The data were measured as a function of timber moisture content and copper concentration over periods of exposure ranging from 2 weeks to 14 months. The results show that the corrosion resistance of the stainless steel was not influenced by classification or magnitude of preservative loading. Corrosion rates of this material were multiple orders of magnitude lower than those of the mild and galvanised steels. In most instances, corrosion rates of hot-dipped galvanised layers in contact with alkaline copper quaternary-treated timbers were up to a factor of 10 times, or greater, than those measured for copper-chrome-arsenate treatments. A direct negative influence of copper ion concentration on the corrosion resistance of mild steel was also observed for each preservative type.

Effects on Tomato Bacterial Canker of Resistance Inducers and Copper Compounds in Greenhouse

OpenAIRE

Baştaş, Kubilay

2014-01-01

Bacterial canker of tomato caused by Clavibacter michiganensis subsp. michiganensis produces considerable economic losses in many countries because effective control measures are lacking. In this study, the effectiveness of some chemicals, a plant growth regulator (Prohexadione-Ca (PC)), two plant activators (hydrogen peroxide (HP)) and harpin protein (Hrp), fungicides, maneb+copper (MC), copper compounds (copper sulfate pentahydrate (CSP) copper hydroxide (CH) and copper oxychloride (CO)) an...

Electroremediation of air pollution control residues in a continuous reactor

DEFF Research Database (Denmark)

Jensen, Pernille Erland; Ferreira, Célia M. D.; Hansen, Henrik K.

2010-01-01

Air pollution control (APC) residue from municipal solid waste incineration is considered hazardous waste due to its alkalinity and high content of salts and mobile heavy metals. Various solutions for the handling of APC-residue exist, however most commercial solutions involve landfilling. A demand...... were made with raw residue, water-washed residue, acid washed residue and acid-treated residue with emphasis on reduction of heavy metal mobility. Main results indicate that the reactor successfully removes toxic elements lead, copper, cadmium and zinc from the feed stream, suggesting...

Correlation models between environmental factors and bacterial resistance to antimony and copper.

Directory of Open Access Journals (Sweden)

Zunji Shi

Full Text Available Antimony (Sb and copper (Cu are toxic heavy metals that are associated with a wide variety of minerals. Sb(III-oxidizing bacteria that convert the toxic Sb(III to the less toxic Sb(V are potentially useful for environmental Sb bioremediation. A total of 125 culturable Sb(III/Cu(II-resistant bacteria from 11 different types of mining soils were isolated. Four strains identified as Arthrobacter, Acinetobacter and Janibacter exhibited notably high minimum inhibitory concentrations (MICs for Sb(III (>10 mM,making them the most highly Sb(III-resistant bacteria to date. Thirty-six strains were able to oxidize Sb(III, including Pseudomonas-, Comamonas-, Acinetobacter-, Sphingopyxis-, Paracoccus- Aminobacter-, Arthrobacter-, Bacillus-, Janibacter- and Variovorax-like isolates. Canonical correspondence analysis (CCA revealed that the soil concentrations of Sb and Cu were the most obvious environmental factors affecting the culturable bacterial population structures. Stepwise linear regression was used to create two predictive models for the correlation between soil characteristics and the bacterial Sb(III or Cu(II resistance. The concentrations of Sb and Cu in the soil was the significant factors affecting the bacterial Sb(III resistance, whereas the concentrations of S and P in the soil greatly affected the bacterial Cu(II resistance. The two stepwise linear regression models that we derived are as follows: MIC(Sb(III=606.605+0.14533 x C(Sb+0.4128 x C(Cu and MIC((Cu(II=58.3844+0.02119 x C(S+0.00199 x CP [where the MIC(Sb(III and MIC(Cu(II represent the average bacterial MIC for the metal of each soil (μM, and the C(Sb, C(Cu, C(S and C(P represent concentrations for Sb, Cu, S and P (mg/kg in soil, respectively, p<0.01]. The stepwise linear regression models we developed suggest that metals as well as other soil physicochemical parameters can contribute to bacterial resistance to metals.

Dependence of the residual surface resistance of superconducting radio frequency cavities on the cooling dynamics around T{sub c}

Energy Technology Data Exchange (ETDEWEB)

Romanenko, A., E-mail: aroman@fnal.gov; Grassellino, A., E-mail: annag@fnal.gov; Melnychuk, O.; Sergatskov, D. A. [Fermi National Accelerator Laboratory, Batavia, Illinois 60510 (United States)

2014-05-14

We report a strong effect of the cooling dynamics through T{sub c} on the amount of trapped external magnetic flux in superconducting niobium cavities. The effect is similar for fine grain and single crystal niobium and all surface treatments including electropolishing with and without 120 °C baking and nitrogen doping. Direct magnetic field measurements on the cavity walls show that the effect stems from changes in the flux trapping efficiency: slow cooling leads to almost complete flux trapping and higher residual resistance, while fast cooling leads to the much more efficient flux expulsion and lower residual resistance.

Residual stress in deuterium implanted nominal copper coatings

International Nuclear Information System (INIS)

Inal, M. Y.; Alam, M.; Peascoe, R. A.; Watkins, T. R.

2000-01-01

The effects of deuterium (D) implantation on the residual stresses in Cu and CuAl 2 phases present in nominal Cu coatings (containing Al) deposited on Al-alloy (Al-6061) substrates were measured using an x-ray diffraction technique. The coatings were deposited by radio frequency magnetron sputtering of a pure Cu target under identical conditions and Al was incorporated in the coatings during growth by diffusion from the substrate. Deuterium was implanted in the coatings at energies of 40 or 40+120 keV with fluences of 1x10 21 , 2x10 21 , or 3x10 21 D + /m 2 . Pole figures of the Cu phase in the coatings prior to and after implantation indicated no effect of implantation on the fibrous texture. Triaxial stress analysis indicated the surface normal stress component to be negligible in Cu and slightly tensile in CuAl 2 under all conditions. Furthermore, under all conditions, the in-plane residual stresses in both phases were found to be compressive and nearly isotropic. The magnitude of the isotropic compressive stress was always higher in CuAl 2 as compared to Cu. The compressive residual stresses in the Cu phase changed only mildly with increasing coating weight, ion energy, and fluence. However, in the CuAl 2 phase the compressive residual stresses changed markedly with increasing ion energy (initial decrease followed by leveling off) and increasing ion fluence (initial decrease followed by an increase), but remained unaffected by increasing coating weight. (c) 2000 American Institute of Physics

The lumenal loop M672-P707 of the Menkes protein (ATP7A) transfers copper to peptidylglycine monooxygenase

Energy Technology Data Exchange (ETDEWEB)

Otoikhian, Adenike [Oregon Health & Sciences University; Barry, Amanda N. [Los Alamos National Laboratory; Mayfield, Mary [Oregon Health & Science University; Nilges, Mark [Illinois EPR Center; Huang, Yiping [Johns Hopkins University; Lutsenko, Svetlana [Johns Hopkins University; Blackburn, Ninian [Oregon Health & Science University

2012-05-14

Copper transfer to cuproproteins located in vesicular compartments of the secretory pathway depends on activity of the copper translocating ATPase (ATP7A or ATP7B) but the mechanism of transfer is largely unexplored. Copper-ATPase ATP7A is unique in having a sequence rich in histidine and methionine residues located on the lumenal side of the membrane. The corresponding fragment binds Cu(I) when expressed as a chimera with a scaffold protein, and mutations or deletions of His and/or Met residues in its sequence inhibit dephosphorylation of the ATPase, a catalytic step associated with copper release. Here we present evidence for a potential role of this lumenal region of ATP7A in copper transfer to cuproenzymes. Both Cu(II) and Cu(I) forms were investigated since the form in which copper is transferred to acceptor proteins is currently unknown. Analysis of Cu(II) using EPR demonstrated that at Cu:P ratios below 1:1, 15N-substituted protein had Cu(II) bound by 4 His residues, but this coordination changed as the Cu(II) to protein ratio increased towards 2:1. XAS confirmed this coordination via analysis of the intensity of outer-shell scattering from imidazole residues. The Cu(II) complexes could be reduced to their Cu(I) counterparts by ascorbate, but here again, as shown by EXAFS and XANES spectroscopy, the coordination was dependent on copper loading. At low copper Cu(I) was bound by a mixed ligand set of His + Met while at higher ratios His coordination predominated. The copper-loaded loop was able to transfer either Cu(II) or Cu(I) to peptidylglycine monooxygenase in the presence of chelating resin, generating catalytically active enzyme in a process that appeared to involve direct interaction between the two partners. The variation of coordination with copper loading suggests copper-dependent conformational change which in turn could act as a signal for regulating copper release by the ATPase pump.

The effect of neutron spectrum on the mechanical and physical properties of pure copper and copper alloys

International Nuclear Information System (INIS)

Fabritsiev, S.A.; Pokrovsky, A.S.; Sandakov, V.A.; Zinkle, S.J.; Rowcliffe, A.F.; Edwards, D.J.; Garner, F.A.; Singh, B.N.; Barabash, V.R.

1996-01-01

The electrical resistivity and tensile properties of copper and oxide dispersion strengthened (DS) copper alloys have been measured before and after fission neutron irradiation to damage levels of 0.5 to 5 displacements per atom (dps) at ∼100 to 400 degrees C. Some of the specimens were irradiated inside a 1.5 mm Cd shroud in order to reduce the thermal neutron flux. The electrical resistivity data could be separated into two components, a solid transmutation component Δρ tr which was proportional to thermal neutron fluence and a radiation defect component Δρ rd which was independent of the displacement dose. The saturation value for Δρ rd was ∼1.2 nanohm-meters for pure copper and ∼1.6 nanohm-meters for the DS copper alloys irradiated at 100 degrees C in positions with a fast-to-thermal neutron flux ratio of 5. Considerable radiation hardening was observed in all specimens at irradiation temperatures below 200 degrees C. The yield strength was relatively insensitive to neutron spectrum in specimens strengthened by dispersoids or cold- working. 17 refs., 7 figs., 1 tab

Gastrointestinal and in vitro release of copper, cadmium, indium, mercury and zinc from conventional and copper-rich amalgams

International Nuclear Information System (INIS)

Brune, D.; Gjerdet, N.; Paulsen, G.

1983-01-01

Particles of a conventional lathe-cut, a spherical non-gamma 2 and a copper amalgam have been gastrointestinally administered to rats for the purpose of evaluation of the dissolution resistance. The animals were sacrificed after 20 hrs. The contents of copper, cadmium, indium, mercury and zinc in kidney, liver, lung or blood were measured using nuclear tracer techniques. From a copper amalgam an extreme release of copper was demonstrated. This study simulates the clinical conditions of elemental release from swallowed amalgam particles after amalgam insertion or after removal of old amalgam fillings. Specimens of the same types of amalgams were also exposed to artificial saliva for a period of 10 days. The amounts of copper and mercury released were measured with flame and flameless atomic absorption spectrophotometry respectively. The levels of copper and mercury released from the copper amalgam were approximately 50 times those of the two other amalgam types studied. (author)

Antibacterial Effect of Copper on Microorganisms Isolated from Bovine Mastitis

Science.gov (United States)

Reyes-Jara, Angelica; Cordero, Ninoska; Aguirre, Juan; Troncoso, Miriam; Figueroa, Guillermo

2016-01-01

The antimicrobial properties of copper have been recognized for several years; applying these properties to the prevention of diseases such as bovine mastitis is a new area of research. The aim of the present study was to evaluate in vitro the antimicrobial activity of copper on bacteria isolated from subclinical and clinical mastitis milk samples from two regions in Chile. A total of 327 microorganisms were recovered between March and September 2013, with different prevalence by sample origin (25 and 75% from the central and southern regions of Chile, respectively). In the central region, Escherichia coli and coagulase negative Staphylococci (CNS) were the most frequently detected in clinical mastitis cases (33%), while in the southern region S. uberis, S. aureus, and CNS were detected with frequencies of 22, 21, and 18%, respectively. Antibiotic susceptibility studies revealed that 34% of isolates were resistant to one or more antibiotics and the resistance profile was different between bacterial species and origins of isolation of the bacteria. The minimum inhibitory concentration of copper (MIC-Cu) was evaluated in all the isolates; results revealed that a concentration as low as 250 ppm copper was able to inhibit the great majority of microorganisms analyzed (65% of isolates). The remaining isolates showed a MIC-Cu between 375 and 700 ppm copper, and no growth was observed at 1000 ppm. A linear relationship was found between the logarithm of viable bacteria number and time of contact with copper. With the application of the same concentration of copper (250 ppm), CNS showed the highest tolerance to copper, followed by S. uberis and S. aureus; the least resistant was E. coli. Based on these in vitro results, copper preparations could represent a good alternative to dipping solutions, aimed at preventing the presence and multiplication of potentially pathogenic microorganisms involved in bovine mastitis disease. PMID:27199953

Potassium sorbate-A new aqueous copper corrosion inhibitor

International Nuclear Information System (INIS)

Abelev, Esta; Starosvetsky, David; Ein-Eli, Yair

2007-01-01

This work presents the novel nature of 2,4-hexadienoic acid potassium salt (potassium sorbate (KCH 3 CH=CHCH=CHCO 2 )) as an effective copper aqueous corrosion inhibitor. The influence of pH and potassium sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in potassium sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of potassium sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-sorbate at the metal surface

Fabrication of Nano-Crossbar Resistive Switching Memory Based on the Copper-Tantalum Pentoxide-Platinum Device Structure

Science.gov (United States)

Olga Gneri, Paula; Jardim, Marcos

Resistive switching memory has been of interest lately not only for its simple metal-insulator-metal (MIM) structure but also for its promising ease of scalability an integration into current CMOS technologies like the Field Programmable Gate Arrays and other non-volatile memory applications. There are several resistive switching MIM combinations but under this scope of research, attention will be paid to the bipolar resistive switching characteristics and fabrication of Tantalum Pentaoxide sandwiched between platinum and copper. By changing the polarity of the voltage bias, this metal-insulator-metal (MIM) device can be switched between a high resistive state (OFF) and low resistive state (ON). The change in states is induced by an electrochemical metallization process, which causes a formation or dissolution of Cu metal filamentary paths in the Tantalum Pentaoxide insulator. There is very little thorough experimental information about the Cu-Ta 2O5-Pt switching characteristics when scaled to nanometer dimensions. In this light, the MIM structure was fabricated in a two-dimensional crossbar format. Also, with the limited available resources, a multi-spacer technique was formulated to localize the active device area in this MIM configuration to less than 20nm. This step is important in understanding the switching characteristics and reliability of this structure when scaled to nanometer dimensions.

A Three-Year Follow-Up Study of Antibiotic and Metal Residues, Antibiotic Resistance and Resistance Genes, Focusing on Kshipra-A River Associated with Holy Religious Mass-Bathing in India: Protocol Paper.

Science.gov (United States)

Diwan, Vishal; Purohit, Manju; Chandran, Salesh; Parashar, Vivek; Shah, Harshada; Mahadik, Vijay K; Stålsby Lundborg, Cecilia; Tamhankar, Ashok J

2017-05-29

Antibiotic resistance (ABR) is one of the major health emergencies for global society. Little is known about the ABR of environmental bacteria and therefore it is important to understand ABR reservoirs in the environment and their potential impact on health. Quantitative and qualitative data will be collected during a 3-year follow-up study of a river associated with religious mass-bathing in Central India. Surface-water and sediment samples will be collected from seven locations at regular intervals for 3 years during religious mass-bathing and in absence of it to monitor water-quality, antibiotic residues, resistant bacteria, antibiotic resistance genes and metals. Approval has been obtained from the Ethics Committee of R.D. Gardi Medical College, Ujjain, India (No. 2013/07/17-311). The results will address the issue of antibiotic residues and antibiotic resistance with a focus on a river environment in India within a typical socio-behavioural context of religious mass-bathing. It will enhance our understanding about the relationship between antibiotic residue levels, water-quality, heavy metals and antibiotic resistance patterns in Escherichia coli isolated from river-water and sediment, and seasonal differences that are associated with religious mass-bathing. We will also document, identify and clarify the genetic differences/similarities relating to phenotypic antibiotic resistance in bacteria in rivers during religious mass-bathing or during periods when there is no mass-bathing.

Two-step flash light sintering of copper nanoparticle ink to remove substrate warping

Energy Technology Data Exchange (ETDEWEB)

Ryu, Chung-Hyeon; Joo, Sung-Jun [Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Kim, Hak-Sung, E-mail: kima@hanyang.ac.kr [Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul, 133-791 (Korea, Republic of)

2016-10-30

Highlights: • We performed the two-step flash light sintering for copper nanoparticle ink to remove substrate warping. • 12 J/cm{sup 2} of preheating and 7 J/cm{sup 2} of main sintering energies were determined as optimum conditions to sinter the copper nanoparticle ink. • The resistivity of two-step sintered copper nanoparticle ink was 3.81 μΩ cm with 5B adhesion level, 2.3 times greater than that of bulk copper. • The two-step sintered case showed a high conductivity without any substrate warping. - Abstract: A two-step flash light sintering process was devised to reduce the warping of polymer substrates during the sintering of copper nanoparticle ink. To determine the optimum sintering conditions of the copper nanoparticle ink, the flash light irradiation conditions (pulse power, pulse number, on-time, and off-time) were varied and optimized. In order to monitor the flash light sintering process, in situ resistance and temperature monitoring of copper nanoink were conducted during the flash light sintering process. Also, a transient heat transfer analysis was performed by using the finite-element program ABAQUS to predict the temperature changes of copper nanoink and polymer substrate. The microstructures of the sintered copper nanoink films were analyzed by scanning electron microscopy. Additionally, an X-ray diffraction and Fourier transform infrared spectroscopy were used to characterize the crystal phase change of the sintered copper nanoparticles. The resulting two-step flash light sintered copper nanoink films exhibited a low resistivity (3.81 μΩ cm, 2.3 times of that of bulk copper) and 5B level of adhesion strength without warping of the polymer substrate.

Characterization of CTX-M enzymes, quinolone resistance determinants, and antimicrobial residues from hospital sewage, wastewater treatment plant, and river water.

Science.gov (United States)

Conte, Danieli; Palmeiro, Jussara Kasuko; da Silva Nogueira, Keite; de Lima, Thiago Marenda Rosa; Cardoso, Marco André; Pontarolo, Roberto; Degaut Pontes, Flávia Lada; Dalla-Costa, Libera Maria

2017-02-01

Multidrug-resistant (MDR) bacteria are widespread in hospitals and have been increasingly isolated from aquatic environments. The aim of the present study was to characterize extended-spectrum β-lactamase (ESBL) and quinolone-resistant Enterobacteriaceae from a hospital effluent, sanitary effluent, inflow sewage, aeration tank, and outflow sewage within a wastewater treatment plant (WWTP), as well as river water upstream and downstream (URW and DRW, respectively), of the point where the WWTP treated effluent was discharged. β-lactamase (bla) genes, plasmid-mediated quinolone resistance (PMQR), and quinolone resistance-determining regions (QRDRs) were assessed by amplification and sequencing in 55 ESBL-positive and/or quinolone-resistant isolates. Ciprofloxacin residue was evaluated by high performance liquid chromatography. ESBL-producing isolates were identified in both raw (n=29) and treated (n=26) water; they included Escherichia coli (32), Klebsiella pneumoniae (22) and Klebsiella oxytoca (1). Resistance to both cephalosporins and quinolone was observed in 34.4% of E. coli and 27.3% of K. pneumoniae. Resistance to carbapenems was found in 5.4% of K. pneumoniae and in K. oxytoca. Results indicate the presence of bla CTX-M (51/55, 92.7%) and bla SHV (8/55, 14.5%) ESBLs, and bla GES (2/55, 3.6%) carbapenemase-encoding resistance determinants. Genes conferring quinolone resistance were detected at all sites, except in the inflow sewage and aeration tanks. Quinolone resistance was primarily attributed to amino acid substitutions in the QRDR of GyrA (47%) or to the presence of PMQR (aac-(6')-Ib-cr, oqxAB, qnrS, and/or qnrB; 52.9%) determinants. Ciprofloxacin residue was absent only from URW. Our results have shown strains carrying ESBL genes, PMQR determinants, and mutations in the gyrA QRDR genes mainly in hospital effluent, URW, and DRW samples. Antimicrobial use, and the inefficient removal of MDR bacteria and antibiotic residue during sewage treatment, may

Copper tolerance of Trichoderma species

Directory of Open Access Journals (Sweden)

Jovičić-Petrović Jelena

2014-01-01

Full Text Available Some Trichoderma strains can persist in ecosystems with high concentrations of heavy metals. The aim of this research was to examine the variability of Trichoderma strains isolated from different ecosystems, based on their morphological properties and restriction analysis of ITS fragments. The fungal growth was tested on potato dextrose agar, amended with Cu(II concentrations ranging from 0.25 to 10 mmol/l, in order to identify copper-resistant strains. The results indicate that some isolated strains of Trichoderma sp. show tolerance to higher copper concentrations. Further research to examine the ability of copper bioaccumulation by tolerant Trichoderma strains is needed. [Projekat Ministarstva nauke Republike Srbije, br. TR 31080 i br. III 43010

Attaching Copper Wires to Magnetic-Reed-Switch Leads

Science.gov (United States)

Kamila, Rudolf

1987-01-01

Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

Composite sheet made of molybdenum and dispersion-strengthened copper

International Nuclear Information System (INIS)

Nicholson, R.D.; Fusco, R.S.

1990-01-01

This patent describes a roll-bonded composite sheet product having at least one layer of dispersion-strengthened copper and at least one layer of molybdenum. The composite is characterized by a sharply defined, cleavage-resistant interface between the copper and the molybdenum with substantially no detectable diffusion of one metal into the other across the interface. The composite is resistant to delamination and being capable of maintaining structural integrity upon repeated high temperature firings at temperatures up to 900 degrees C

Effect of Physical Property and Surface Morphology of Copper Foil at Electrodeposition Parameter

Energy Technology Data Exchange (ETDEWEB)

Woo, Tae Gyu; Park, Il Song; Lee, Man Hyung; Seol, Kyeong Won [Chonbuk National University, Jeonju (Korea, Republic of)

2014-06-15

The effect of additives, current density and plated temperature on the surface morphology and physical property, during copper electrodeposition on polyimide (PI) film was investigated. Two kinds of additives, Cl and leveler (additive B), were used in this study. Electrochemical experiments were performed in conjunction with SEM, XRD and four-point probe to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity was controlled by the concentration of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated in the electrolyte without additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm Cl and 100 ppm additive B. Large particles were observed on the surface of the copper layer electroplated using a current density of 25 mA/cm{sup 2}, but a uniform surface and lower resistivity were obtained using a current density of 10 mA/cm{sup 2}. One of the required important properties of FCCL is flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density, rather than a high current density. Moreover, a reasonable current density is 20 mA/cm{sup 2}, considering the productivity and mechanical properties of copper foil.

Structural measurements and cell line studies of the copper-PEG-Rifampicin complex against Mycobacterium tuberculosis.

Science.gov (United States)

Manning, Thomas; Mikula, Rachel; Wylie, Greg; Phillips, Dennis; Jarvis, Jackie; Zhang, Fengli

2015-02-01

The bacterium responsible for tuberculosis is increasing its resistance to antibiotics resulting in new multidrug-resistant Mycobacterium tuberculosis (MDR-TB) and extensively drug-resistant tuberculosis (XDR-TB). In this study, several analytical techniques including NMR, FT-ICR, MALDI-MS, LC-MS and UV/Vis are used to study the copper-Rifampicin-Polyethylene glycol (PEG-3350) complex. The copper (II) cation is a carrier for the antibiotic Rifampicin as well as nutrients for the bacterium. The NIH-NIAID cell line containing several Tb strains (including antibiotic resistant strains) is tested against seven copper-PEG-RIF complex variations. Copyright © 2014 Elsevier Ltd. All rights reserved.

Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

OpenAIRE

Ugarteche, Caroline Velasques; Furlan, Kaline Pagnan; Pereira, Rafaela do Vale; Trindade, Gabriel; Binder, Roberto; Binder, Cristiano; Klein, Aloisio Nelmo

2015-01-01

Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also resistance is the desired. Effects of copper on the sintering and thermal properties of iron-copper composites produced by powder metallurgy and Fe on copper-iron composites have been investigated. Copper and iron were varied from 20 to 80 vol.% in the samples, alternating the c...

Variation in adult stress resistance does not explain vulnerability to climate change in copper butterflies.

Science.gov (United States)

Klockmann, Michael; Wallmeyer, Leonard; Fischer, Klaus

2017-03-15

Ongoing climate change is a major threat to biodiversity. However, although many species clearly suffer from ongoing climate change, others benefit from it, for example, by showing range expansions. However, which specific features determine a species' vulnerability to climate change? Phenotypic plasticity, which has been described as the first line of defence against environmental change, may be of utmost importance here. Against this background, we here compare plasticity in stress tolerance in 3 copper butterfly species, which differ arguably in their vulnerability to climate change. Specifically, we investigated heat, cold and desiccation resistance after acclimatization to different temperatures in the adult stage. We demonstrate that acclimation at a higher temperature increased heat but decreased cold tolerance and desiccation resistance. Contrary to our predictions, species did not show pronounced variation in stress resistance, though plastic capacities in temperature stress resistance did vary across species. Overall, our results seemed to reflect population-rather than species-specific patterns. We conclude that the geographical origin of the populations used should be considered even in comparative studies. However, our results suggest that, in the 3 species studied here, vulnerability to climate change is not in the first place determined by stress resistance in the adult stage. As entomological studies focus all too often on adults only, we argue that more research effort should be dedicated to other developmental stages when trying to understand insect responses to environmental change. © 2017 Institute of Zoology, Chinese Academy of Sciences.

Effects of copper supplement on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture.

Science.gov (United States)

Rodríguez, L Mato; Alatossava, T

2008-10-01

To determine the effects of supplemented copper (Cu2+) on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture. Thirteen strains belonging to Lactobacillus delbrueckii, Lactobacillus helveticus, Lactobacillus rhamnosus, Streptococcus thermophilus or Propionibacterium freudenreichii species were exposed to various copper concentrations in the proper growth medium at relevant growth temperatures, and the effects of supplemented copper on bacterial growth and cell viability were determined by optical density and pH measurements, also by platings. Among the species considered, L. delbrueckii was the most copper resistant and S. thermophilus the most sensitive to copper. Anaerobic conditions increased this sensitivity significantly. There was also a considerable amount of variation in copper resistance at strain level. Copper resistance is both a species- and strain-dependent property and may reflect variability in copper-binding capacities by cell wall components among species and strains. In addition, the chemical state of copper may be involved. This study revealed that copper resistance is a highly variable property among starter and adjunct strains, and this variability should be considered when strains are selected for Emmental cheese manufacture.

Residual Resistivity Ratio (RRR) Measurements of LHC Superconducting NbTi Cable Strands

CERN Document Server

Charifoulline, Z

2006-01-01

The Rutherford-type superconducting NbTi cables of the LHC accelerator are currently manufactured by six industrial companies. As a part of the acceptance tests, the Residual Resistivity Ratio (RRR) of superconducting strands is systematically measured on virgin strands to qualify the strands before cabling and on extracted strands to qualify the cables and to check the final heat treatment (controlled oxidation to control interstrand resistance). More than 12000 samples of virgin and extracted strands have been measured during last five years. Results show good correlation with the measurements done by the companies and reflect well the technological process of cable production (strand annealing, cabling, cable heat treatment). This paper presents a description of the RRR-test station and the measurement procedure, the summary of the results over all suppliers and finally the correlation between RRR-values of the cables and the magnets.

On residual gas analysis during high temperature baking of graphite tiles

International Nuclear Information System (INIS)

Prakash, A A; Chaudhuri, P; Khirwadkar, S; Reddy, D Chenna; Saxena, Y C; Chauhan, N; Raole, P M

2008-01-01

Steady-state Super-conducting Tokamak-1 (SST-1) is a medium size tokamak with major radius of 1.1 m and minor radius of 0.20 m. It is designed for plasma discharge duration of 1000 seconds to obtain fully steady-state plasma operation. Plasma Facing Components (PFC), consisting of divertors, passive stabilizers, baffles and poloidal limiters are also designed to be UHV compatible for steady state operation. All PFC are made up of graphite tiles mechanically attached to the copper alloy substrate. Graphite is one of the preferred first wall armour material in present day tokamaks. High thermal shock resistance and low atomic number of carbon are the most important properties of graphite for this application. High temperature vacuum baking of graphite tiles is the standard process to remove the impurities. Residual Gas Analyzer (RGA) has been used for qualitative and quantitative measurements of released gases from graphite tiles during baking. Surface Analysis of graphite tiles has also been done before and after baking. This paper describes the residual gas analysis during baking and surface analysis of graphite tiles

On residual gas analysis during high temperature baking of graphite tiles

Energy Technology Data Exchange (ETDEWEB)

Prakash, A A; Chaudhuri, P; Khirwadkar, S; Reddy, D Chenna; Saxena, Y C [Institute for Plasma Research, Bhat, Gandhinagar - 382 428 (India); Chauhan, N; Raole, P M [Facilitation Center for Industrial Plasma Technologies, IPR, Gandhinagar (India)], E-mail: arun@ipr.res.in

2008-05-01

Steady-state Super-conducting Tokamak-1 (SST-1) is a medium size tokamak with major radius of 1.1 m and minor radius of 0.20 m. It is designed for plasma discharge duration of 1000 seconds to obtain fully steady-state plasma operation. Plasma Facing Components (PFC), consisting of divertors, passive stabilizers, baffles and poloidal limiters are also designed to be UHV compatible for steady state operation. All PFC are made up of graphite tiles mechanically attached to the copper alloy substrate. Graphite is one of the preferred first wall armour material in present day tokamaks. High thermal shock resistance and low atomic number of carbon are the most important properties of graphite for this application. High temperature vacuum baking of graphite tiles is the standard process to remove the impurities. Residual Gas Analyzer (RGA) has been used for qualitative and quantitative measurements of released gases from graphite tiles during baking. Surface Analysis of graphite tiles has also been done before and after baking. This paper describes the residual gas analysis during baking and surface analysis of graphite tiles.

A Three-Year Follow-Up Study of Antibiotic and Metal Residues, Antibiotic Resistance and Resistance Genes, Focusing on Kshipra—A River Associated with Holy Religious Mass-Bathing in India: Protocol Paper

Directory of Open Access Journals (Sweden)

Vishal Diwan

2017-05-01

Full Text Available Background: Antibiotic resistance (ABR is one of the major health emergencies for global society. Little is known about the ABR of environmental bacteria and therefore it is important to understand ABR reservoirs in the environment and their potential impact on health. Method/Design: Quantitative and qualitative data will be collected during a 3-year follow-up study of a river associated with religious mass-bathing in Central India. Surface-water and sediment samples will be collected from seven locations at regular intervals for 3 years during religious mass-bathing and in absence of it to monitor water-quality, antibiotic residues, resistant bacteria, antibiotic resistance genes and metals. Approval has been obtained from the Ethics Committee of R.D. Gardi Medical College, Ujjain, India (No. 2013/07/17-311. Results: The results will address the issue of antibiotic residues and antibiotic resistance with a focus on a river environment in India within a typical socio-behavioural context of religious mass-bathing. It will enhance our understanding about the relationship between antibiotic residue levels, water-quality, heavy metals and antibiotic resistance patterns in Escherichia coli isolated from river-water and sediment, and seasonal differences that are associated with religious mass-bathing. We will also document, identify and clarify the genetic differences/similarities relating to phenotypic antibiotic resistance in bacteria in rivers during religious mass-bathing or during periods when there is no mass-bathing.

Recycling and refining of copper for electrical application

Directory of Open Access Journals (Sweden)

Dablement Sébastien

2013-11-01

Full Text Available Copper is, after silver, the best electrical conductor. All residual impurities inside the matrix have high consequences on these properties. Thus, the Nexans factory in Lens “purifies” the copper scraps by a fire refining in order to remove all the internal pollutant. This process, unique in France, is complementary to a traditional process using an electrolytic cathode. It allows, first, to diversify the raw material and, second, to increase the ecological balance compare to the traditional way of scrap treatment for electrical application.

Access to residual carrier concentration in ZnO nanowires by calibrated scanning spreading resistance microscopy

Energy Technology Data Exchange (ETDEWEB)

Wang, L., E-mail: lin.wang@insa-lyon.fr; Brémond, G. [Institut des Nanotechnologies de Lyon (INL), Université de Lyon, CNRS UMR 5270, INSA Lyon, Bat. Blaise Pascal, 7 Avenue Jean Capelle, 69621 Villeurbanne (France); Chauveau, J. M. [Centre de Recherche sur l' Hétéro-Epitaxie et ses Applications (CRHEA), CNRS UPR10, rue Bernard Grégory 06560 Valbonne Sophia Antipolis (France); Physics Department, University of Nice Sophia Antipolis (UNS), Parc Valrose, 06103 Nice (France); Brenier, R. [Institut Lumière Matière (ILM), Université de Lyon, CNRS UMR 5306, Université Claude Bernard Lyon 1, 43 Boulevard du 11 Novembre 1918, 69622 Villeurbanne (France); Sallet, V.; Jomard, F.; Sartel, C. [Groupe d' Étude de la Matière Condensée (GEMaC), CNRS-Université de Versailles St Quentin en Yvelines, Université Paris-Saclay, 45 Avenue des Etats-Unis, 78035 Versailles (France)

2016-03-28

Scanning spreading resistance microscopy (SSRM) was performed on non-intentionally doped (nid) ZnO nanowires (NWs) grown by metal-organic chemical vapor deposition in order to measure their residual carrier concentration. For this purpose, an SSRM calibration profile has been developed on homoepitaxial ZnO:Ga multilayer staircase structures grown by molecular beam epitaxy. The Ga density measured by SIMS varies in the 1.7 × 10{sup 17 }cm{sup −3} to 3 × 10{sup 20 }cm{sup −3} range. From measurements on such Ga doped multi-layers, a monotonic decrease in SSRM resistance with increasing Ga density was established, indicating SSRM being a well-adapted technique for two dimensional dopant/carrier profiling on ZnO at nanoscale. Finally, relevant SSRM signal contrasts were detected on nid ZnO NWs, and the residual carrier concentration is estimated in the 1–3 × 10{sup 18 }cm{sup −3} range, in agreement with the result from four-probe measurements.

Degradation of graphene coated copper in simulated proton exchange membrane fuel cell environment: Electrochemical impedance spectroscopy study

Science.gov (United States)

Ren, Y. J.; Anisur, M. R.; Qiu, W.; He, J. J.; Al-Saadi, S.; Singh Raman, R. K.

2017-09-01

Metallic materials are most suitable for bipolar plates of proton exchange membrane fuel cell (PEMFC) because they possess the required mechanical strength, durability, gas impermeability, acceptable cost and are suitable for mass production. However, metallic bipolar plates are prone to corrosion or they can passivate under PEMFC environment and interrupt the fuel cell operation. Therefore, it is highly attractive to develop corrosion resistance coating that is also highly conductive. Graphene fits these criteria. Graphene coating is developed on copper by chemical vapor deposition (CVD) with an aim to improving corrosion resistance of copper under PEMFC condition. The Raman Spectroscopy shows the graphene coating to be multilayered. The electrochemical degradation of graphene coated copper is investigated by electrochemical impedance spectroscopy (EIS) in 0.5 M H2SO4 solution at room temperature. After exposure to the electrolyte for up to 720 h, the charge transfer resistance (Rt) of the graphene coated copper is ∼3 times greater than that of the bare copper, indicating graphene coatings could improve the corrosion resistance of copper bipolar plates.

Alternative treatments for indoor residual spraying for malaria control in a village with pyrethroid- and DDT-resistant vectors in The Gambia

NARCIS (Netherlands)

Tangena, J.A.A.; Adiamoh, M.; Alessandro, D' U.; Jarju, L.; Jawara, M.; Jeffries, D.; Malik, N.; Nwakanma, D.; Kaur, H.; Takken, W.; Lindsay, S.W.; Pinder, M.

2013-01-01

Background: Malaria vector control is threatened by resistance to pyrethroids, the only class of insecticides used for treating bed nets. The second major vector control method is indoor residual spraying with pyrethroids or the organochloride DDT. However, resistance to pyrethroids frequently

Characterization of copper resistant ciliates: Potential candidates for ...

African Journals Online (AJOL)

Jane

2011-08-17

Aug 17, 2011 ... algae (Rehman and Shakoori, 2001), yeast (Shakoori et al., 2005) ... organisms, this study was undertaken to determine the efficiency of ...... copper, mercury and zinc to ciliates from activated sludge plants. Bull. Environ.

Fusion neutron effects on magnetoresistivity of copper stabilizer materials

International Nuclear Information System (INIS)

Guinan, M.W.; Van Konynenburg, R.A.

1983-01-01

Eight copper wires were repeatedly irradiated at 4.2 to 4.4 K with 14.8 MV neutrons and isochronally annealed at temperatures up to 34 0 C for a total of five cycles. Their electrical resistances were monitored during irradiation under zero applied magnetic field. After each irradiation the magnetoresistances were measured in applied transverse magnetic fields of up to 12 T. Then the samples were isochronally annealed to observe the recovery of the resistivity and magnetoresistivity. After each anneal at the highest temperature (34 0 C), some of the damage remained and contributed to the damage state observed following the subsequent irradiation. In this way, we were able to observe how the changes in magnetoresistance would accumulate during the repeated irradiations and anneals expected to be characteristic of fusion reactor magnets. For each succeeding irradiation the fluence was chosen to produce approximately the same final magnetoresistance at 12 T, taking account of the accumulating residual radiation damage. The increment of magnetoresistivity added by the irradiation varied from 35 to 65% at 12 T and from 50 to 90% at 8 T for the various samples

Copper and CuNi alloys substrates for HTS coated conductor applications protected from oxidation

Energy Technology Data Exchange (ETDEWEB)

Segarra, M; Diaz, J; Xuriguera, H; Chimenos, J M; Espiell, F [Dept. of Chemical Engineering and Metallurgy, Univ. of Barcelona, Barcelona (Spain); Miralles, L [Lab. d' Investigacio en Formacions Geologiques. Dept. of Petrology, Geochemistry and Geological Prospecting, Univ. of Barcelona, Barcelona (Spain); Pinol, S [Inst. de Ciencia de Materials de Barcelona, Bellaterra (Spain)

2003-07-01

Copper is an interesting substrate for HTS coated conductors for its low cost compared to other metallic substrates, and for its low resistivity. Nevertheless, mechanical properties and resistance to oxidation should be improved in order to use it as substrate for YBCO deposition by non-vacuum techniques. Therefore, different cube textured CuNi tapes were prepared by RABIT as possible substrates for deposition of high critical current density YBCO films. Under the optimised conditions of deformation and annealing, all the studied CuNi alloys (2%, 5%, and 10% Ni) presented (100) left angle 001 right angle cube texture which is compatible for YBCO deposition. Textured CuNi alloys present higher tensile strength than pure copper. Oxidation resistance of CuNi tapes under different oxygen atmospheres was also studied by thermogravimetric analysis and compared to pure copper tapes. Although the presence of nickel improves mechanical properties of annealed copper, it does not improve its oxidation resistance. However, when a chromium buffer layer is electrodeposited on the tape, oxygen diffusion is slowed down. Chromium is, therefore, useful for protecting copper and CuNi alloys from oxidation although its recrystallisation texture, (110), is not suitable for coated conductors. (orig.)

Thermal conductivity of tungsten–copper composites

International Nuclear Information System (INIS)

Lee, Sang Hyun; Kwon, Su Yong; Ham, Hye Jeong

2012-01-01

Highlights: ► We present the temperature dependence of the thermophysical properties for tungsten–copper composite from room temperature to 400 °C. The powders of tungsten–copper were produced by the spray conversion method and the W–Cu alloys were fabricated by the metal injection molding. Thermal conductivity and thermal expansion of tungsten–copper composite was controllable by volume fraction copper. - Abstract: As the speed and degree of integration of semiconductor devices increases, more heat is generated, and the performance and lifetime of semiconductor devices depend on the dissipation of the generated heat. Tungsten–copper alloys have high electrical and thermal conductivities, low contact resistances, and low coefficients of thermal expansion, thus allowing them to be used as a shielding material for microwave packages, and heat sinks for high power integrated circuits (ICs). In this study, the thermal conductivity and thermal expansion of several types of tungsten–copper (W–Cu) composites are investigated, using compositions of 5–30 wt.% copper balanced with tungsten. The tungsten–copper powders were produced using the spray conversion method, and the W–Cu alloys were fabricated via the metal injection molding. The tungsten–copper composite particles were nanosized, and the thermal conductivity of the W–Cu alloys gradually decreases with temperature increases. The thermal conductivity of the W–30 wt.% Cu composite was 238 W/(m K) at room temperature.

Mechanical and corrosion behaviors of developed copper-based metal matrix composites

Science.gov (United States)

Singh, Manvandra Kumar; Gautam, Rakesh Kumar; Prakash, Rajiv; Ji, Gopal

2018-03-01

This work investigates mechanical properties and corrosion resistances of cast copper-tungsten carbide (WC) metal matrix composites (MMCs). Copper matrix composites have been developed by stir casting technique. Different sizes of micro and nano particles of WC particles are utilized as reinforcement to prepare two copper-based composites, however, nano size of WC particles are prepared by high-energy ball milling. XRD (X-rays diffraction) characterize the materials for involvement of different phases. The mechanical behavior of composites has been studied by Vickers hardness test and compression test; while the corrosion behavior of developed composites is investigated by electrochemical impedance spectroscopy in 0.5 M H2SO4 solutions. The results show that hardness, compressive strength and corrosion resistance of copper matrix composites are very high in comparison to that of copper matrix, which attributed to the microstructural changes occurred during composite formation. SEM (Scanning electron microscopy) reveals the morphology of the corroded surfaces.

Effective deleting of residual photoconductivity in high-resistance layers GaAs

International Nuclear Information System (INIS)

Sadaev, B.S.; Kadirova, I.T.; Sharipov, E.I.

2004-01-01

Full text: The phenomenon of residual photoconductivity as the storage of optical memory (OM) represents practical interest in micro and optoelectronics. The finding - out of the nature OM represents undoubtedly and scientific interest. Now residual photoconductivity (RPC) is explained by potential barriers arising because of non-monocharacteristical of distribution components of the semiconductor or carriers of a current in volume. Depending on a nature non-monocharacteristical the time relaxation RPC changes in a wide limit. The special interest represents RPC created by impurity. In the given work the results of research of a nature RPC created photos by ionization of the filled centres of chrome in compensated epitaxilogic layers arsenide galls are resulted. Epitaxilogic layers were brought up by a vertical method ZFE. Highness was reached (achieved) by special indemnification of the residual donors deep acceptors of chrome. Substrates served n-GoAs. Lassitude of i-layers has made 70-80 microns. Specific resistance of layers has made (1/3) 108 om·sm. (T= 300 K). The structures were photosensitive as at low (T = 77 K) and at room temperatures. The photosensitivity of structures in impurity to a strip of absorption chrome (= 1,4 microns) was comparable (compared) with own. The researches show, that the structures have RPC. Size RPC the greatest ambassador impurity of illumination is carrying out photoionization Cr2 + - of the centres. That is established, RPC impurity of a photocurrent is effectively erased only at certain length of a wave of external illumination

Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate

Science.gov (United States)

Wang, C. P.; Dai, T.; Lu, Y.; Shi, Z.; Ruan, J. J.; Guo, Y. H.; Liu, X. J.

2017-08-01

Copper thin films with thickness of about 500 nm doped with different aluminum concentrations have been prepared by magnetron sputtering on Si substrate and their crystal structure, microstructure, and electrical resistivity after annealing at various temperatures (200°C to 600°C) for 1 h or at 400°C for different durations (1 h to 11 h) investigated by grazing-incidence x-ray diffraction (GIXRD) analysis, scanning electron microscopy (SEM), and four-point probe (FPP) measurements. Cu-1.8Al alloy thin film exhibited good thermal stability and low electrical resistivity (˜5.0 μΩ cm) after annealing at 500°C for 1 h or 400°C for 7 h. No copper silicide was observed at the Cu-Al/Si interface by GIXRD analysis or SEM for this sample. This result indicates that doping Cu thin film with small amounts of Al can achieve high thermal stability and low electrical resistivity, suggesting that Cu-1.8Al alloy thin film could be used for barrierless Cu metallization on Si substrate.

Splitting of the resistive transition of copper oxide superconductors: Intrinsic double superconducting transitions versus extrinsic effects

International Nuclear Information System (INIS)

Pomar, A.; Curras, S.R.; Veira, J.A.; Vidal, F.

1996-01-01

To prove the possible existence of an intrinsic double superconducting transition in the high-temperature copper oxide superconductors (HTSC), an effect recently attributed by various groups to different intrinsic properties of these materials (including unconventional wave pairing), we present in this paper high resolution data of the electrical resistivity, ρ(T), around the superconducting transition of different single crystal and polycrystal YBa 2 Cu 3 O 7-δ samples. The analysis of the temperature derivative of these ρ(T) data strongly suggests that (i) with a temperature resolution well to within 20 mK, the intrinsic resistive transition of the HTSC does not present any double transition anomaly and (ii) the double peak structure observed in dρ(T)/dT by some authors is probably an extrinsic effect (associated with stoichiometric inhomogeneities in some cases, and with experimental artifacts in other cases). copyright 1996 The American Physical Society

Elicitin-induced distal systemic resistance in plants is mediated through the protein-protein interactions influenced by selected lysine residues

Directory of Open Access Journals (Sweden)

Hana eUhlíková

2016-02-01

Full Text Available Elicitins are a family of small proteins with sterol-binding activity that are secreted by Phytophthora and Pythium spp. classified as oomycete PAMPs. Although alfa- and beta-elicitins bind with the same affinity to one high affinity binding site on the plasma membrane, beta-elicitins (possessing 6-7 lysine residues are generally 50- to 100-fold more active at inducing distal HR and systemic resistance than the alfa-isoforms (with only 1-3 lysine residues.To examine the role of lysine residues in elicitin biological activity, we employed site-directed mutagenesis to prepare a series of beta-elicitin cryptogein variants with mutations on specific lysine residues. In contrast to direct infiltration of protein into leaves, application to the stem revealed a rough correlation between protein’s charge and biological activity, resulting in protection against Phytophthora parasitica. A detailed analysis of proteins’ movement in plants showed no substantial differences in distribution through phloem indicating differences in consequent apoplastic or symplastic transport. In this process, an important role of homodimer formation together with the ability to form a heterodimer with potential partner represented by endogenous plants LTPs is suggested. Our work demonstrates a key role of selected lysine residues in these interactions and stresses the importance of processes preceding elicitin recognition responsible for induction of distal systemic resistance.

Nature and Distribution of Stable Subsurface Oxygen in Copper Electrodes During Electrochemical CO2 Reduction

DEFF Research Database (Denmark)

Cavalca, Filippo Carlo; Ferragut, Rafael; Aghion, Stefano

2017-01-01

Oxide-derived copper (OD-Cu) electrodes exhibit higher activity than pristine copper during the carbon dioxide reduction reaction (CO2RR) and higher selectivity towards ethylene. The presence of residual subsurface oxygen in OD-Cu has been proposed to be responsible for such improvements, although...

Synthesis of cytochrome c oxidase 1 (SCO1) inhibits insulin sensitivity by decreasing copper levels in adipocytes.

Science.gov (United States)

Wei, Xiang-Bo; Guo, Liang; Liu, Yang; Zhou, Shui-Rong; Liu, Yuan; Dou, Xin; Du, Shao-Yue; Ding, Meng; Peng, Wan-Qiu; Qian, Shu-Wen; Huang, Hai-Yan; Tang, Qi-Qun

2017-09-23

Dysregulation of insulin signaling leads to type 2 diabetes mellitus (T2DM) and other metabolic disorders. Obesity is an important contributor to insulin resistance, and although the understanding of this relationship has improved in recent years, the mechanism of obesity-induced insulin resistance is not completely understood. Disorders of copper metabolism tend to accompany the development of obesity, which increases the risk of insulin resistance. Synthesis of cytochrome c oxidase 1 (SCO1) functions in the assembly of cytochrome c oxidase (COX) and cellular copper homeostasis. However, the role of SCO1 in the regulation of metabolism remains unknown. Here, we found that obese mice had higher expression of SCO1 and lower levels of copper in white adipose tissue (WAT) than did the control mice. Overexpression of SCO1 in adipocytes was associated with copper deficiency. Copper increased insulin sensitivity by decreasing the level of phosphatase and tensin homolog (PTEN) protein. Ectopic expression of SCO1 led to insulin resistance and was accompanied by a decrease in intracellular copper level, and addition of copper abolished the inhibitory effect of SCO1 on insulin sensitivity. Our results demonstrated a novel role of SCO1 in modulating insulin sensitivity via the regulation of copper concentration in WAT and suggested a potential therapeutic target for T2DM. Copyright © 2017. Published by Elsevier Inc.

Some problems of residual activity measurements

International Nuclear Information System (INIS)

Katrik, P.; Mustafin, E.; Strasik, I.; Pavlovic, M.

2013-01-01

As a preparatory work for constructing the Facility for Antiproton and Ion Research (FAIR) at GSI Darmstadt, samples of copper were irradiated by 500 MeV/u 238 U ion beam and investigated by gamma-ray spectroscopy. The nuclides that contribute dominantly to the residual activity have been identified and their contributions have been quantified by two different methods: from the whole-target gamma spectra and by integration of depth-profiles of residual activity of individual nuclides. Results obtained by these two methods are compared and discussed in this paper. (authors)

Antimicrobial resistance among enterococci from pigs in three European countries

DEFF Research Database (Denmark)

Aarestrup, Frank Møller; Hasman, Henrik; Jensen, Lars Bogø

2002-01-01

to the amounts of antimicrobial agents used in food animal production in those countries. Similar genes were found to encode resistance in the different countries, but the tet(L) and let(S) genes were more frequently found among isolates from Spain. A recently identified transferable copper resistance gene......Enterococci from pigs in Denmark, Spain, and Sweden were examined for susceptibility to antimicrobial agents and copper and the presence of selected resistance genes. The greatest levels of resistance were found among isolates from Spain and Denmark compared to those from Sweden, which corresponds...... was found in all copper-resistant isolates from the different countries....

Structure and activity of Aspergillus nidulans copper amine oxidase

DEFF Research Database (Denmark)

McGrath, Aaron P; Mithieux, Suzanne M; Collyer, Charles A

2011-01-01

Aspergillus nidulans amine oxidase (ANAO) has the unusual ability among the family of copper and trihydroxyphenylalanine quinone-containing amine oxidases of being able to oxidize the amine side chains of lysine residues in large peptides and proteins. We show here that in common with the related...... enzyme from the yeast Pichia pastoris, ANAO can promote the cross-linking of tropoelastin and oxidize the lysine residues in α-casein proteins and tropoelastin. The crystal structure of ANAO, the first for a fungal enzyme in this family, has been determined to a resolution of 2.4 Å. The enzyme is a dimer...... with the archetypal fold of a copper-containing amine oxidase. The active site is the most open of any of those of the structurally characterized enzymes in the family and provides a ready explanation for its lysine oxidase-like activity....

Effects of combinative surface modification on the stability and conductivity of the copper particles

International Nuclear Information System (INIS)

Zeng, Yike; Li, Tongtong; Fu, Ming; Jiang, Shenglin; Zhang, Guangzu

2014-01-01

Highlights: • A combinative method is used to improve the performance of the copper powder. • The method integrates passivation, silver-coating, and coupling agent treatment. • The stability of the copper powder has been improved after the modification. • The sheet resistance of the conductive film is reduced to 15 mΩ. -- Abstract: The specific goal of the present study is to evaluate the surface performance of the copper particles and get excellent copper powder by surface modification. This paper proposes a combinative modification method integrating passivation, silver-coated, and coupling agent. As a result, after 600 h at room temperature the copper powder has the stabilization improved and is well combined with organic matters, and the sheet resistance of the film fabricated by the copper conductive filler is reduced to 15 mΩ. The performance of the copper powder has been greatly enhanced by the combinative modification, and the cost of the copper conductive filler is decreased significantly by this method. The results indicate that the combinative surface modification method can be used for practical electronic application

Electrical resistivity measurements in superconducting ceramics

International Nuclear Information System (INIS)

Muccillo, R.; Bressiani, A.H.A.; Muccillo, E.N.S.; Bressiani, J.C.

1988-01-01

Electrical resistivity measurements have been done in (Y, Ba, Cu, O) - and (Y, A1, Ba, Cu, O) - based superconducting ceramics. The sintered specimens were prepared by applying gold electrodes and winding on the non-metalized part with a copper strip to be immersed in liquid nitrogen for cooling. The resistivity measurements have been done by the four-probe method. A copper-constantan or chromel-alumel thermocouple inserted between the specimen and the copper cold finger has been used for the determination of the critical temperature T c . Details of the experimental set-up and resistivity versus temperature plots in the LNT-RT range for the superconducting ceramics are the major contributions of this communication. (author) [pt

Electrical resistivity measurements in superconducting ceramics

International Nuclear Information System (INIS)

Muccillo, R.; Bressiani, A.H.A.; Muccillo, E.N.S.; Bressian, J.C.

1988-01-01

Electrical resistivity measurements have been done in (Y,Ba,Cu,O)- and (Y,Al,Ba,Cu,O)-based superconducting ceramics. The sintered specimens were prepared by applying gold electrodes and winding on the non-metalized part with a copper strip to be immersed in liquid nitrogen for cooling. The resistivity measurements have been done by the four-probe method. A copper constantan or chromel-alumel thermocouple inserted between the specimen and the copper cold finger has been used for the determination of the critical temperature T c . Details of the experimental set-up and resistivity versus temperature plots in the LNT-RT range for the superconducting ceramics are the major contributions of this communication. (author) [pt

Effect of Copper on Passivity and Corrosion Behavior of Fe-xC-5Cu ...

African Journals Online (AJOL)

... copper/microstructure is discussed. Alloying Cu showed a beneficial effect on hypoeutectoid steel and harmful effect on hypereutectoid steel. The improved corrosion resistance is related to cementite morphology and by a copper dissolution/re-deposition process. Keywords: Corrosion; Copper; cementite; EIS; Passivation ...

Toward High Carrier Mobility and Low Contact Resistance:Laser Cleaning of PMMA Residues on Graphene Surfaces

Institute of Scientific and Technical Information of China (English)

Yuehui Jia; Xin Gong; Pei Peng; Zidong Wang; Zhongzheng Tian; Liming Ren; Yunyi Fu; Han Zhang

2016-01-01

Poly(methyl methacrylate)(PMMA) is widely used for graphene transfer and device fabrication.However,it inevitably leaves a thin layer of polymer residues after acetone rinsing and leads to dramatic degradation of device performance.How to eliminate contamination and restore clean surfaces of graphene is still highly demanded.In this paper,we present a reliable and position-controllable method to remove the polymer residues on graphene films by laser exposure.Under proper laser conditions,PMMA residues can be substantially reduced without introducing defects to the underlying graphene.Furthermore,by applying this laser cleaning technique to the channel and contacts of graphene fieldeffect transistors(GFETs),higher carrier mobility as well as lower contact resistance can be realized.This work opens a way for probing intrinsic properties of contaminant-free graphene and fabricating high-performance GFETs with both clean channel and intimate graphene/metal contact.

Copper imbalances in ruminants and humans: unexpected common ground.

Science.gov (United States)

Suttle, Neville F

2012-09-01

Ruminants are more vulnerable to copper deficiency than humans because rumen sulfide generation lowers copper availability from forage, increasing the risk of conditions such as swayback in lambs. Molybdenum-rich pastures promote thiomolybdate (TM) synthesis and formation of unabsorbable Cu-TM complexes, turning risk to clinical reality (hypocuprosis). Selection pressures created ruminant species with tolerance of deficiency but vulnerability to copper toxicity in alien environments, such as specific pathogen-free units. By contrast, cases of copper imbalance in humans seemed confined to rare genetic aberrations of copper metabolism. Recent descriptions of human swayback and the exploratory use of TM for the treatment of Wilson's disease, tumor growth, inflammatory diseases, and Alzheimer's disease have created unexpected common ground. The incidence of pre-hemolytic copper poisoning in specific pathogen-free lambs was reduced by an infection with Mycobacterium avium that left them more responsive to treatment with TM but vulnerable to long-term copper depletion. Copper requirements in ruminants and humans may need an extra allowance for the "copper cost" of immunity to infection. Residual cuproenzyme inhibition in TM-treated lambs and anomalies in plasma copper composition that appeared to depend on liver copper status raise this question "can chelating capacity be harnessed without inducing copper-deficiency in ruminants or humans?" A model of equilibria between exogenous (TM) and endogenous chelators (e.g., albumin, metallothionein) is used to predict risk of exposure and hypocuprosis; although risk of natural exposure in humans is remote, vulnerability to TM-induced copper deficiency may be high. Biomarkers of TM impact are needed, and copper chaperones for inhibited cuproenzymes are prime candidates.

Conductivity of laser printed copper structures limited by nano-crystal grain size and amorphous metal droplet shell

International Nuclear Information System (INIS)

Winter, Shoshana; Zenou, Michael; Kotler, Zvi

2016-01-01

We present a study of the morphology and electrical properties of copper structures which are printed by laser induced forward transfer from bulk copper. The percentage of voids and the oxidation levels are too low to account for the high resistivities (∼4 to 14 times the resistivity of bulk monocrystalline copper) of these structures. Transmission electron microscope (TEM) images of slices cut from the printed areas using a focused ion beam (FIB) show nano-sized crystal structures with grain sizes that are smaller than the electron free path length. Scattering from such grain boundaries causes a significant increase in the resistivity and can explain the measured resistivities of the structures. The TEM images also show a nano-amorphous layer (∼5 nm) at the droplet boundaries which also contributes to the overall resistivity. Such morphological characteristics are best explained by the ultrafast cooling rate of the molten copper droplets during printing. (paper)

Direct write of copper-graphene composite using micro-cold spray

Directory of Open Access Journals (Sweden)

Sameh Dardona

2016-08-01

Full Text Available Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have good adhesion to the substrate with ∼65x the copper bulk resistivity.

Optimization of copper electroplating process applied for microfabrication on flexible polyethylene terephthalate substrate

International Nuclear Information System (INIS)

Le, Nguyen Ngan; Hue Phan, Thi Cam; Le, Anh Duy; Dung Dang, Thi My; Dang, Mau Chien

2015-01-01

Electroplating is an important step in microfabrication in order to increase thickness of undersized parts up to a few micrometers with a low-cost, fast method that is easy to carry out, especially for metals such as copper, nickel, and silver. This important step promotes the development of the fabrication technology of electronic devices on a flexible substrate, also known as flexible electronic devices. Nevertheless, this technology has some disadvantages such as low surface uniformity and high resistivity. In this paper, parameters of copper electroplating were studied, such as the ratio of copper (II) sulfate (CuSO_4) concentration to sulfuric acid (H_2SO_4) concentration and electroplating current density, in order to obtain low resistivity and high surface uniformity of the copper layer. Samples were characterized by scanning electron microscopy (SEM), four-point probe, and surface profiler. The results showed that the sample resistivity could be controlled from about 2.0 to about 3.5 μΩ · cm, and the lowest obtained resistivity was 1.899 μΩ · cm. In addition, surface uniformity of the electroplated copper layer was also acceptable. The thickness of the copper layer was about 10 μm with an error of about 0.5 μm. The most suitable conditions for the electroplating process were CuSO_4 concentration of 0.4 mol l"−"1, H_2SO_4 concentration of 1.0 mol l"−"1, and low electroplating current density of 10–20 mA cm"−"2. All experiments were performed on a flexible polyethylene terephthalate (PET) substrate. (paper)

PVC/carbon nanotubes nanocomposites: evaluation of electrical resistivity and the residual solvent effect over the thermal properties of nanocomposites

International Nuclear Information System (INIS)

Araujo, Rogerio Gomes; Pires, Alfredo T.N.

2013-01-01

The procedure for obtaining nanocomposite by dispersing the nanoparticles in matrix polymer in solution with subsequent elimination of the solvent has been widely used, considering better efficiency in obtaining homogeneity of the final product. However, the presence of residual solvent may affect the nanocomposites in micro-and macroscopic properties of the product. The aim of this study was to evaluate the thermal properties of nanocomposites of poly(vinylchloride)/multi-walled carbon nanotube obtained from the polymer solution and dispersion of carbon nanotubes in tetrahydrofuran (THF), as well as the electrical resistivity of nanocomposites and the influence of residual solvent. The presence of residual tetrahydrofuran reduces the glass transition temperature (Tg) up to 26 °C, being independent of the amount of carbon nanotubes. The total elimination of the solvent is an important factor that does not induce changes in the properties of the polymeric matrix. The graft-COOH groups in the structure of the nanotubes leads to a considerable reduction of the electrical resistivity in ten orders of magnitude, from 0.4 %wt of nanotubes in the nanocomposite composition. (author)

Survey of pesticide residues in table grapes: Determination of processing factors, intake and risk assessment

DEFF Research Database (Denmark)

Poulsen, Mette Erecius; Hansen, H.K.; Sloth, Jens Jørgen

2007-01-01

of the European Union maximum residue limit (MRL) were found in five samples from Italy. A number of samples were rinsed to study the possible reduction of residues. For copper, iprodione, procymidone and dithiocarbamates a significant effect of rinsing was found (20-49% reduction of residues). However......(-1) for pesticides and 21 mu g day(-1) for copper. Correspondingly, the intakes from South African grapes were 2.6 and 5.7 mu g day(-1) respectively. When the total exposure of pesticides from grapes were related to acceptable daily intake, expressed as the sum of Hazard Quotients, the exposure were...... approximately 0.5% for Italian samples and 1% for South African samples....

Electrochemical impedance study of copper in phosphate buffered solution

International Nuclear Information System (INIS)

Salimon, J.; Mohamad, M.; Yamin, B.M.; Kalaji, M.

2003-01-01

The processes occurring on the copper electrode surface in phosphate buffered solution were investigated using the Electrochemical Impedance Spectroscopy. The electrochemical behaviors of copper through their charge transfer resistance and double-layer capacitance at the onset of the hydrogen evolution region and the anodic passivation layer formation and diffusion of copper species at anodic potential regions are discussed. The specific adsorption of anions (hydroxide and/or H/sub 2/PO/sub 4/) occurred at potential less negative than -0.9V. Adsorbed hydrogen appeared at hydrogen evolution region at potential range of -1.5 to -1.0 V. The deposition of insoluble copper species occurred at anodic potential regions. (author)

Microstructure and Service Properties of Copper Alloys

Directory of Open Access Journals (Sweden)

Polok-Rubiniec M.

2016-09-01

Full Text Available This elaboration shows the effect of combined heat treatment and cold working on the structure and utility properties of alloyed copper. As the test material, alloyed copper CuTi4 was employed. The samples were subjected to treatment according to the following schema: 1st variant – supersaturation and ageing, 2nd variant – supersaturation, cold rolling and ageing. The paper presents the results of microstructure, hardness, and abrasion resistance. The analysis of the wipe profile geometry was realized using a Zeiss LSM 5 Exciter confocal microscope. Cold working of the supersaturated solid solution affects significantly its hardness but the cold plastic deformation causes deterioration of the wear resistance of the finally aged CuTi4 alloy.

Self-field instabilities in high-$J_{c}$ Nb$_{3}$Sn strands the effect of copper RRR

CERN Document Server

Bordini, B

2009-01-01

High critical current density (Jc) Nb$_{3}$Sn conductor is the best candidate for next generation high field (> 10 T) accelerator magnets. Although very promising, state of the art high-Jc Nb$_{3}$Sn strands suffer of magneto-thermal instabilities that can severely limit the strand performance. Recently it has been shown that at 1.9 K the self field instability is the dominating mechanism that limits the performance of strands with a low (<10) Residual Resistivity Ratio (RRR) of the stabilizing copper. At CERN several state of the art high–Jc Nb$_{3}$Sn wires have been tested at 4.2 K and 1.9 K to study the effects on strand self-field instability of: RRR and strand impregnation with stycast. To study the effect of the RRR value on magneto-thermal instabilities, a new 2-D finite element model was also developed at CERN. This model simulates the whole development of the flux jump in the strand cross section also taking into account the heat and current diffusion in the stabilizing copper. In this paper th...

The effects of bio-available copper on macrolide antibiotic resistance genes and mobile elements during tylosin fermentation dregs co-composting.

Science.gov (United States)

Zhang, Bo; Wang, Meng Meng; Wang, Bing; Xin, Yanjun; Gao, Jiaqi; Liu, Huiling

2018-03-01

In this study, aerobic co-composting of tylosin fermentation dregs (TFDs) and sewage sludge with different adding concentrations of copper (Cu) was investigated to inspect the fate of antibiotic resistance genes (ARGs), metal resistance genes (MRGs) and mobile genetic elements (MGEs). Results showed that two concentrations of Cu did affect not only the abiotic factors but the relative abundances of resistance genes. High concentration of Cu inhibited the metabolic capacity of microbial community and the nitrogen-fixing process while had little effect on the degradation of TYL and TOC. The abundance of ermT, mefA, mphA increased partly attributed to the toxic effects and co-selective pressure from heavy metal reflected by MRGs. There was significant correlation among some environmental factors like pH, bio-Cu, organic matters and ARGs. Copyright © 2017 Elsevier Ltd. All rights reserved.

The Bauschinger Effect in Copper

DEFF Research Database (Denmark)

Pedersen, Ole Bøcker; Brown, L .M.; Stobbs, W. M.

1981-01-01

A study of the Bauschinger effect in pure copper shows that by comparison with dispersion hardened copper the effect is very small and independent of temperature. This suggests that the obstacles to flow are deformable. A simple composite model based on this principle accounts for the data semi......-quantitatively and also accounts for the stored energy of cold-work. An interesting feature of the model is that it shows very clearly that, although dislocation pile-ups may exist, the flow stress of the composite is entirely due to the resistance to dislocation motion in the tangles of forest dislocations....

Double coating protection of Nd–Fe–B magnets: Intergranular phosphating treatment and copper plating

International Nuclear Information System (INIS)

Zheng, Jingwu; Chen, Haibo; Qiao, Liang; Lin, Min; Jiang, Liqiang; Che, Shenglei; Hu, Yangwu

2014-01-01

In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd–Fe–B magnets. In other words, the intergranular region of sintered Nd–Fe–B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd–Fe–B. The morphology and corrosion resistance of the phosphated sintered Nd–Fe–B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd–Fe–B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd–Fe–B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd–Fe–B is significantly better than that with a single phosphate film or single plating protection. - Highlights: • We combined intergranular phosphating and copper plating to protect Nd–Fe–B. • The phosphate conversion coating was formed preferably on the intergranular region. • The phosphating coating can obviously improve the corrosion resistance of Nd–Fe–B. • The corrosion resistance of Nd–Fe–B was improved by double coating protection

Double coating protection of Nd–Fe–B magnets: Intergranular phosphating treatment and copper plating

Energy Technology Data Exchange (ETDEWEB)

Zheng, Jingwu; Chen, Haibo; Qiao, Liang [College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014 (China); Lin, Min [Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Material Technology and Engineering Chinese Academy of Science, Ningbo 315201 (China); Jiang, Liqiang; Che, Shenglei [College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014 (China); Hu, Yangwu, E-mail: 346648086@qq.com [College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014 (China); Wenzhou Institute of Industry and Science, Wenzhou 325000 (China)

2014-12-15

In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd–Fe–B magnets. In other words, the intergranular region of sintered Nd–Fe–B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd–Fe–B. The morphology and corrosion resistance of the phosphated sintered Nd–Fe–B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd–Fe–B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd–Fe–B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd–Fe–B is significantly better than that with a single phosphate film or single plating protection. - Highlights: • We combined intergranular phosphating and copper plating to protect Nd–Fe–B. • The phosphate conversion coating was formed preferably on the intergranular region. • The phosphating coating can obviously improve the corrosion resistance of Nd–Fe–B. • The corrosion resistance of Nd–Fe–B was improved by double coating protection.

Detection of clarithromycin-resistant Helicobacter pylori by polymerase chain reaction using residual samples from rapid urease test

Directory of Open Access Journals (Sweden)

Jae-Sik Jeon

2017-01-01

Full Text Available Background: Approximately 50% of the world population is infected with Helicobacter pylori, which corresponds to a high infection rate. Furthermore, the incidence of antibiotic-resistant H. pylori has increased with the recent rise in use of antibiotics for H. pylori elimination, suggesting growing treatment failures. Aim: The study was aimed to assess the use of residual samples from rapid urease test (RUT for biomolecular testing as an effective and accurate method to detect antibiotic-resistant H. pylori. Settings and Design: This study was a retrospective study performed using data obtained from medical records of previously isolated H. pylori strains. Materials and Methods: RUT was conducted for 5440 biopsy samples from individuals who underwent health examination in South Korea. Subsequently, 469 RUT residual samples were randomly selected and subjected to polymerase chain reaction (PCR to detect antibiotic-resistant H. pylori. Statistical Analysis Used: The Chi-square test was used to analyse categorical data. P < 0.05 was considered statistically significant. Results: The results showed a concordance between the results of PCR and conventional RUT in 450 of 469 samples, suggesting that the H. pylori PCR test is a time- and cost-effective detection method. Conclusions: This study demonstrated that PCR test can aid physicians to prescribe the appropriate antibiotics at the time of diagnosis, thus preventing the reduction in H. pylori eradication due to antibiotic resistance, averting progression to serious diseases and increasing the treatment success rate.

Effects of Ultrasonic Nanocrystal Surface Modification on the Residual Stress, Microstructure, and Corrosion Resistance of 304 Stainless Steel Welds

Science.gov (United States)

Ye, Chang; Telang, Abhishek; Gill, Amrinder; Wen, Xingshuo; Mannava, Seetha R.; Qian, Dong; Vasudevan, Vijay K.

2018-03-01

In this study, ultrasonic nanocrystal surface modification (UNSM) of 304 stainless steel welds was carried out. UNSM effectively eliminates the tensile stress generated during welding and imparts beneficial compressive residual stresses. In addition, UNSM can effectively refine the grains and increase hardness in the near-surface region. Corrosion tests in boiling MgCl2 solution demonstrate that UNSM can significantly improve the corrosion resistance due to the compressive residual stresses and changes in the near-surface microstructure.

Cloning and expression analysis of a blue copper- binding protein ...

African Journals Online (AJOL)

Jane

2011-07-20

Jul 20, 2011 ... decreased to constitutive level at 72 h after inoculation in resistant Gh21 line ... lignification of cell wall or scavenging of reactive oxygen species (ROS) during powdery mildew attack ... or other ions in plants (Lin and Wu, 1994), whose .... nutrient-uptake and copper accumulation in protein of copper-tolerant.

Monitoring Interactions Inside Cells by Advanced Spectroscopies: Overview of Copper Transporters and Cisplatin.

Science.gov (United States)

Lasorsa, Alessia; Natile, Giovanni; Rosato, Antonio; Tadini-Buoninsegni, Francesco; Arnesano, Fabio

2018-02-12

Resistance, either at the onset of the treatment or developed after an initial positive response, is a major limitation of antitumor therapy. In the case of platinum- based drugs, copper transporters have been found to interfere with drug trafficking by facilitating the import or favoring the platinum export and inactivation. The use of powerful spectroscopic, spectrometric and computational methods has allowed a deep structural insight into the mode of interaction of platinum drugs with the metal-binding domains of the transporter proteins. This review article focuses on the mode in which platinum drugs can compete with copper ion for binding to transport proteins and consequent structural and biological effects. Three types of transporters are discussed in detail: copper transporter 1 (Ctr1), the major responsible for Cu+ uptake; antioxidant-1 copper chaperone (Atox1), responsible for copper transfer within the cytoplasm; and copper ATPases (ATP7A/B), responsible for copper export into specific subcellular compartments and outside the cell. The body of knowledge summarized in this review can help in shaping current chemotherapy to optimize the efficacy of platinum drugs (particularly in relation to resistance) and to mitigate adverse effects on copper metabolism. Copyright© Bentham Science Publishers; For any queries, please email at epub@benthamscience.org.

Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

International Nuclear Information System (INIS)

Chung, Wan-Ho; Hwang, Hyun-Jun; Kim, Hak-Sung

2015-01-01

In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 μΩ cm), which is comparable to the resistivity of bulk copper (1.68 μΩ cm) were obtained through flash light sintering at room temperature and under ambient conditions. - Highlights: • The hybrid copper inks with precursor and nanoparticles were fabricated. • The hybrid copper ink was sintered via flash light irradiation. • The resistivity of sintered hybrid copper ink was 27.3 μΩ cm. • Highly conductive copper film with low porosity could be achieved

Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

Energy Technology Data Exchange (ETDEWEB)

Chung, Wan-Ho; Hwang, Hyun-Jun [Department of Mechanical Convergence Engineering, Hanyang University, 17 Haendang-Dong, Seongdong-Gu, Seoul 133-791 (Korea, Republic of); Kim, Hak-Sung, E-mail: kima@hanyang.ac.kr [Department of Mechanical Convergence Engineering, Hanyang University, 17 Haendang-Dong, Seongdong-Gu, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul 133-791 (Korea, Republic of)

2015-04-01

In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 μΩ cm), which is comparable to the resistivity of bulk copper (1.68 μΩ cm) were obtained through flash light sintering at room temperature and under ambient conditions. - Highlights: • The hybrid copper inks with precursor and nanoparticles were fabricated. • The hybrid copper ink was sintered via flash light irradiation. • The resistivity of sintered hybrid copper ink was 27.3 μΩ cm. • Highly conductive copper film with low porosity could be achieved.

Laboratory investigation into the development of resistance of Daphnia manga (straus) to environmental pollutants

Energy Technology Data Exchange (ETDEWEB)

LeBlanc, G.A.

1982-04-01

The purpose of this study was to determine the ability of Daphnia magna (Straus) to develop resistance to selected environmental pollutants through physiological adaptation or the selection of genetically fit organisms. The results of the study demonstrated that daphnids pre-exposed to copper, lead or zinc for 20 h had become significantly resistant to the toxic effects of these metals. Similar tests performed with sodium lauryl sulfate, however, resulted in no increased resistance. Exposure of successive generations of daphnids to copper resulted in the development of significant resistance to copper. However, this resistance was determined to be the result of physiological adaptation and was not due to the selection of genetically fit organisms. Multigeneration exposures to sodium lauryl sulfate failed to produce any increased resistance to the toxic effects of this compound.Exposure of successive generations to sodium lauryl sulfate increased each generation's sensitivity to the toxicity of this compound. To determine if resistance to one pollutant might confer resistance to others, the resistance, to zinc and lead, of daphnids pre-exposed to copper was assessed. Copper-resistant daphnids demonstrated no increased resistance to the toxic effects of zinc or lead.

Effects of RF plasma treatment on spray-pyrolyzed copper oxide films on silicon substrates

Science.gov (United States)

Madera, Rozen Grace B.; Martinez, Melanie M.; Vasquez, Magdaleno R., Jr.

2018-01-01

The effects of radio-frequency (RF) argon (Ar) plasma treatment on the structural, morphological, electrical and compositional properties of the spray-pyrolyzed p-type copper oxide films on n-type (100) silicon (Si) substrates were investigated. The films were successfully synthesized using 0.3 M copper acetate monohydrate sprayed on precut Si substrates maintained at 350 °C. X-ray diffraction revealed cupric oxide (CuO) with a monoclinic structure. An apparent improvement in crystallinity was realized after Ar plasma treatment, attributed to the removal of residues contaminating the surface. Scanning electron microscope images showed agglomerated monoclinic grains and revealed a reduction in size upon plasma exposure induced by the sputtering effect. The current-voltage characteristics of CuO/Si showed a rectifying behavior after Ar plasma exposure with an increase in turn-on voltage. Four-point probe measurements revealed a decrease in sheet resistance after plasma irradiation. Fourier transform infrared spectral analyses also showed O-H and C-O bands on the films. This work was able to produce CuO thin films via spray pyrolysis on Si substrates and enhancement in their properties by applying postdeposition Ar plasma treatment.

Synthesis of Oxidation-Resistant Cupronickel Nanowires for Transparent Conducting Nanowire Networks

Energy Technology Data Exchange (ETDEWEB)

Rathmall, Aaron [Duke University; Nguyen, Minh [Duke University; Wiley, Benjamin J [Duke University

2012-01-01

Nanowires of copper can be coated from liquids to create flexible, transparent conducting films that can potentially replace the dominant transparent conductor, indium tin oxide, in displays, solar cells, organic light-emitting diodes, and electrochromic windows. One issue with these nanowire films is that copper is prone to oxidation. It was hypothesized that the resistance to oxidation could be improved by coating copper nanowires with nickel. This work demonstrates a method for synthesizing copper nanowires with nickel shells as well as the properties of cupronickel nanowires in transparent conducting films. Time- and temperature-dependent sheet resistance measurements indicate that the sheet resistance of copper and silver nanowire films will double after 3 and 36 months at room temperature, respectively. In contrast, the sheet resistance of cupronickel nanowires containing 20 mol % nickel will double in about 400 years. Coating copper nanowires to a ratio of 2:1 Cu:Ni gave them a neutral gray color, making them more suitable for use in displays and electrochromic windows. These properties, and the fact that copper and nickel are 1000 times more abundant than indium or silver, make cupronickel nanowires a promising alternative for the sustainable, efficient production of transparent conductors.

Susceptibility of 169 USA300 methicillin-resistant Staphylococcus aureus isolates to two copper-based biocides, CuAL42 and CuWB50.

Science.gov (United States)

Luna, Vicki Ann; Hall, Tony J; King, Debbie S; Cannons, Andrew C

2010-05-01

To test the activity of two copper-based biocides, CuAL42 and CuWB50, and benzalkonium chloride against 169 isolates of methicillin-resistant Staphylococcus aureus (MRSA) pulsotype USA300, a virulent, multiply resistant, widespread clone in the USA. Tests including MIC, MBC and time-kill studies were performed multiple times. The MIC range, MIC(50) and MIC(90) (0.59-18.75, 4.69 and 4.69 ppm, respectively) and the MBC range, MBC(50) and MBC(90) (1.17-18.75, 4.69 and 9.38 ppm, respectively) for CuAL42 were identical with those obtained with CuWB50, except that the MBC range for CuWB50 was wider (0.59-37.5 ppm). In time-kill studies, a 6 log(10) reduction of cfu was achieved within 1 h (150 ppm) and 0.5 h (300 ppm) for CuAL42, and 1.5 h (150 ppm) and 0.75 h (300 ppm) for CuWB50. Both copper-based biocides can effectively kill USA300 MRSA and may facilitate the eradication of the organism from healthcare settings.

Element segregation behavior of aluminum-copper alloy ZL205A

Directory of Open Access Journals (Sweden)

Fan Li

2014-11-01

Full Text Available In aluminum-copper alloy, the segregation has a severe bad effect on the alloying degree, strength and corrosion resistance. A deeper understanding of element segregation behavior will have a great significance on the prevention of segregation. In the study, the element segregation behavior of ZL205A aluminum-copper alloy was investigated by examining isothermally solidified samples using scanning electron microscopy and energy dispersive spectroscopy. The calculated results of segregation coefficients show that Cu and Mn are negative segregation elements; while Ti, V and Zr are positive segregation elements. The sequence of element segregation degree from the greatest to the least in ZL205A alloy is Cu, Mn, V, Ti, Zr and Al. The density of residual liquid is expected to increase with a decrease in the quenching temperature ranging from 630 ºC to 550 ºC. The calculated results confirm that the quenching temperature has an insignificant effect on the liquid density; and the variation of density is mainly due to element segregation. Consequently, segregations of Al, Cu and Mn lead to an increase in density, but Ti, V and Zr present the opposite effect. The contribution of each element to the variation of the liquid density was analyzed. The sequence of contributions of alloying elements to the variation of total liquid density is Cu﹥Al﹥Mn﹥V﹥Ti﹥Zr.

Copper leaching from electronic waste for the improvement of gold recycling.

Science.gov (United States)

Torres, Robinson; Lapidus, Gretchen T

2016-11-01

Gold recovery from electronic waste material with high copper content was investigated at ambient conditions. A chemical preliminary treatment was found necessary to remove the large quantities of copper before the precious metal can be extracted. For this purpose inorganic acids (HCl, HNO 3 and H 2 SO 4 ) and two organic substances EDTA and citrate, were tested. The effect of auxiliary oxidants such as air, ozone and peroxide hydroxide was studied. In pretreatments with peroxide and HCl or citrate, copper extractions greater than 90% were achieved. In the second leaching stage for gold recovery, the solid residue of the copper extraction was contacted with thiourea solutions, resulting in greater than 90% gold removal after only one hour of reaction. Copyright © 2016 Elsevier Ltd. All rights reserved.

Monitoring Antibiotic Residues and Corresponding Antibiotic Resistance Genes in an Agroecosystem

Directory of Open Access Journals (Sweden)

Yasser M. Awad

2015-01-01

Full Text Available Antibiotic resistance genes (ARGs have been commonly reported due to the overuse worldwide of antibiotics. Antibiotic overuse disturbs the environment and threatens public human health. The objective of this study was to measure the residual concentrations of veterinary antibiotics in the tetracycline group (TCs, including tetracycline (TC and chlortetracycline (CTC, as well as those in the sulfonamide group (SAs, including sulfamethazine (SMT, sulfamethoxazole (SMX, and sulfathiazole (STZ. We also isolated the corresponding ARGs in the agroecosystem. Four sediment samples and two rice paddy soil samples were collected from sites near a swine composting facility along the Naerincheon River in Hongcheon, Korea. High performance liquid chromatography-tandem mass spectrometry (HPLC-MS/MS was employed with a solid-phase extraction method to measure the concentration of each antibiotic. ARGs were identified by the qualitative polymerase chain-reaction using synthetic primers. SAs and their corresponding ARGs were highly detected in sediment samples whereas TCs were not detected except for sediments sample #1. ARGs for TCs and SAs were detected in rice paddy soils, while ARGs for TCs were only found in sediment #2 and #4. Continuous monitoring of antibiotic residue and its comprehensive impact on the environment is needed to ensure environmental health.

Control of Copper Resistance and Inorganic Sulfur Metabolism by Paralogous Regulators in Staphylococcus aureus*

Science.gov (United States)

Grossoehme, Nicholas; Kehl-Fie, Thomas E.; Ma, Zhen; Adams, Keith W.; Cowart, Darin M.; Scott, Robert A.; Skaar, Eric P.; Giedroc, David P.

2011-01-01

All strains of Staphylococcus aureus encode a putative copper-sensitive operon repressor (CsoR) and one other CsoR-like protein of unknown function. We show here that NWMN_1991 encodes a bona fide Cu(I)-inducible CsoR of a genetically unlinked copA-copZ copper resistance operon in S. aureus strain Newman. In contrast, an unannotated open reading frame found between NWMN_0027 and NWMN_0026 (denoted NWMN_0026.5) encodes a CsoR-like regulator that represses expression of adjacent genes by binding specifically to a pair of canonical operator sites positioned in the NWMN_0027–0026.5 intergenic region. Inspection of these regulated genes suggests a role in assimilation of inorganic sulfur from thiosulfate and vectorial sulfur transfer, and we designate NWMN_0026.5 as CstR (CsoR-like sulfur transferase repressor). Expression analysis demonstrates that CsoR and CstR control their respective regulons in response to distinct stimuli with no overlap in vivo. Unlike CsoR, CstR does not form a stable complex with Cu(I); operator binding is instead inhibited by oxidation of the intersubunit cysteine pair to a mixture of disulfide and trisulfide linkages by a likely metabolite of thiosulfate assimilation, sulfite. CsoR is unreactive toward sulfite under the same conditions. We conclude that CsoR and CstR are paralogs in S. aureus that function in the same cytoplasm to control distinct physiological processes. PMID:21339296

Control of copper resistance and inorganic sulfur metabolism by paralogous regulators in Staphylococcus aureus.

Science.gov (United States)

Grossoehme, Nicholas; Kehl-Fie, Thomas E; Ma, Zhen; Adams, Keith W; Cowart, Darin M; Scott, Robert A; Skaar, Eric P; Giedroc, David P

2011-04-15

All strains of Staphylococcus aureus encode a putative copper-sensitive operon repressor (CsoR) and one other CsoR-like protein of unknown function. We show here that NWMN_1991 encodes a bona fide Cu(I)-inducible CsoR of a genetically unlinked copA-copZ copper resistance operon in S. aureus strain Newman. In contrast, an unannotated open reading frame found between NWMN_0027 and NWMN_0026 (denoted NWMN_0026.5) encodes a CsoR-like regulator that represses expression of adjacent genes by binding specifically to a pair of canonical operator sites positioned in the NWMN_0027-0026.5 intergenic region. Inspection of these regulated genes suggests a role in assimilation of inorganic sulfur from thiosulfate and vectorial sulfur transfer, and we designate NWMN_0026.5 as CstR (CsoR-like sulfur transferase repressor). Expression analysis demonstrates that CsoR and CstR control their respective regulons in response to distinct stimuli with no overlap in vivo. Unlike CsoR, CstR does not form a stable complex with Cu(I); operator binding is instead inhibited by oxidation of the intersubunit cysteine pair to a mixture of disulfide and trisulfide linkages by a likely metabolite of thiosulfate assimilation, sulfite. CsoR is unreactive toward sulfite under the same conditions. We conclude that CsoR and CstR are paralogs in S. aureus that function in the same cytoplasm to control distinct physiological processes.

Investigation of defects in ultra-thin Al{sub 2}O{sub 3} films deposited on pure copper by the atomic layer deposition technique

Energy Technology Data Exchange (ETDEWEB)

Chang, M.L.; Wang, L.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Lin, H.C., E-mail: hclinntu@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Chen, M.J., E-mail: mjchen@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Lin, K.M. [Department of Materials Science and Engineering, Feng Chia University, No. 100, Wenhwa Road, Seatwen, Taichung 40724, Taiwan (China)

2015-12-30

Graphical abstract: Some residual OH ligands originating from incomplete reaction between TMA and surface species of OH* during ALD process induce the defects in deposited Al{sub 2}O{sub 3} films. Three possible types of defects are suggested. The analytic results indicate the defects are Type-I and/or Type-II but do not directly expose the substrate, like pinholes (Type-III). - Highlights: • Oxidation trials were conducted to investigate the defects in ultra-thin Al{sub 2}O{sub 3} films deposited ALD technique on pure copper. • The residual OH ligands in the deposited Al{sub 2}O{sub 3} films induce looser micro-structure which has worse oxidation resistance. • Superficial contamination particles on substrate surface are confirmed to be one of nucleation sites of the defects. - Abstract: Al{sub 2}O{sub 3} films with various thicknesses were deposited by the atomic layer deposition (ALD) technique on pure copper at temperatures of 100–200 °C. Oxidation trials were conducted in air at 200 °C to investigate the defects in these films. The analytic results show that the defects have a looser micro-structure compared to their surroundings, but do not directly expose the substrate, like pinholes. The film's crystallinity, mechanical properties and oxidation resistance could also be affected by these defects. Superficial contamination particles on the substrate surface are confirmed to be nucleation sites of the defects. A model for the mechanism of defect formation is proposed in this study.

Fate of antibiotic and metal resistance genes during two-phase anaerobic digestion of residue sludge revealed by metagenomic approach.

Science.gov (United States)

Wu, Ying; Cui, Erping; Zuo, Yiru; Cheng, Weixiao; Chen, Hong

2018-03-07

The prevalence and persistence of antibiotic resistance genes in wastewater treatment plants (WWTPs) is of growing interest, and residual sludge is among the main sources for the release of antibiotic resistance genes (ARGs). Moreover, heavy metals concentrated in dense microbial communities of sludge could potentially favor co-selection of ARGs and metal resistance genes (MRGs). Residual sludge treatment is needed to limit the spread of resistance from WWTPs into the environment. This study aimed to explore the fate of ARGs and MRGs during thermophilic two-phase (acidogenic/methanogenic phase) anaerobic digestion by metagenomic analysis. The occurrence and abundance of mobile genetic elements were also determined based on the SEED database. Among the 27 major ARG subtypes detected in feed sludge, large reductions (> 50%) in 6 ARG subtypes were achieved by acidogenic phase (AP), while 63.0% of the ARG subtypes proliferated in the following methanogenic phase (MP). In contrast, a 2.8-fold increase in total MRG abundance was found in AP, while the total abundance during MP decreased to the same order of magnitude as in feed sludge. The distinct dynamics of ARGs and MRGs during the two-phase anaerobic digestion are noteworthy, and more specific treatments are required to limit their proliferation in the environment.

Impact of Water Quality on Chlorine Demand of Corroding Copper

Science.gov (United States)

Copper is the most widely used material in drinking water premise plumbing systems. In buildings such as hospitals, large and complicated plumbing networks make it difficult to maintain good water quality. Sustaining safe disinfectant residuals throughout a building to protect ag...

Ring structures and copper mineralization in Kerman porphyry copper belt, SE Iran

Directory of Open Access Journals (Sweden)

Gholamreza Mirzababaei

2012-10-01

Full Text Available The role of some ring structures in the distribution of porphyry copper deposits in south Kerman porphyry copper belt is discussed. In the study area, ring structures are circular or elliptical shaped features which are partly recognized on satellite images. In this study, Landsat multispectral images were used to identify ring structures in the area. The rudimentary identification stages of the circles were mainly based on their circular characteristics on the images. These structures match with the regional tectonic features and can be seen mainly in two types; namely, large-magnitude and small scale circles. The associated mineralization in the study area is mainly porphyry Cu and vein type base metal sulfide deposits. There is a sensible relationship between the large circles and mineralization. These circles have encompassed almost entire Cu deposits and prospects in south part of Kerman porphyry copper belt. The small circles seem to be external traces of (porphyritic intrusive bodies that appear on surface as small circles. Formation of the large circular structures do not appear to be related to the external processes and there is no clear indication of how they came into existence but, their arrangement around the edges of a positive residual anomaly area shows the probable role of this anomaly in their formation. This matter is also recognized on the generalized crustal thickness map of the region in which an updoming of the upper mantle is observed. This study can improve our collective knowledge for copper exploration in this region.

Hydrometallurgical treatment of copper smelter dusts. Desarsenification of leaching solutions

International Nuclear Information System (INIS)

Alguacil, F.J.; Magne, L.; Navarro, P.; Simpson, J.

1996-01-01

Copper smelter dusts contain along with this metal, which is amenable for its recovery, a number of other metals (especially arsenic) which are considered as toxic. Different alternatives have been proposed for the treatment of such metallurgical residues and among them Hydrometallurgy shows good perspectives for its application in this field. In the present work different hydrometallurgical processes proposed for the treatment of copper smelter dusts are described and evaluated together with different alternatives given for the Desarsenification of the leaching solutions. (Author) 36 refs

Copper thin film for RFID UHF antenna on flexible substrate

International Nuclear Information System (INIS)

Tran, Nhan Ai; Tran, Huy Nam; Dang, Mau Chien; Fribourg-Blanc, Eric

2010-01-01

A process flow using photolithography and sputtering was studied for copper antenna fabrication on thin poly(ethylene terephthalate) (PET) substrate. The lift-off route was chosen for its flexibility at laboratory scale. It was clarified that the cleaning of PET is an important step that necessitates mild oxygen plasma etching. Then copper is sputter deposited after photolithographic definition of the antenna. Care is necessary since PET, as a very flexible substrate, is temperature sensitive. The temperature increase generated by the impact of deposited copper should be maintained below the glass transition temperature of the polymer to avoid detrimental deformation. dc power of 40 to 50 W was found to be the maximum possible sputtering power for commercial PET. It was found that the resistivity of the thin film is below two times the bulk resistivity of copper for a deposition pressure below 4×10 −3  mbar and thickness above 450 nm. These results enable the reliable fabrication of copper RFID UHF antennae on a PET substrate for further testing of new tag designs. The present paper summarizes the effort to test new designs of antennae for RadioFrequency IDentification (RFID) Ultra High Frequency (UHF) tags, for use in various applications (e.g. object tracking and environment monitoring) in Vietnam

Post-induction residual leukemia in childhood acute lymphoblastic leukemia quantified by PCR correlates with in vitro prednisolone resistance

DEFF Research Database (Denmark)

Schmiegelow, K; Nyvold, C; Seyfarth, J

2001-01-01

Most prognostic factors in childhood acute lymphoblastic leukemia (ALL) are informative for groups of patients, whereas new approaches are needed to predict the efficacy of chemotherapy for the individual patient. The residual leukemia following 4 weeks of induction therapy with prednisolone......, vincristine, doxorubicin and i.t. methotrexate and the in vitro resistance to prednisolone, vincristine, and doxorubicin were measured in 30 boys and 12 girls with B (n = 34) or T lineage (n = 8) ALL. The residual leukemia was quantified after 2 (MRD-D15, n = 29) and 4 weeks (MRD-PI, n = 42) of induction...... pronounced when B cell precursor and T cell leukemia were analyzed separately (B cell precursor ALL: MRD-PI vs prednisolone LC50: n = 33, rs = 0.47, P = 0.006; T cell ALL: MRD-PI vs prednisolone resistance: n = 8, rs = 0.84, P = 0.009). After a median follow-up of 5.0 years (75% range 3.2-6.9) eight patients...

Effects of a copper-tolerant grass (Agrostis capillaris) on the ecosystem of a copper-contaminated arable soil

Energy Technology Data Exchange (ETDEWEB)

Boon, G.T. [State Univ. Groningen (Netherlands); Bouwman, L.A.; Bloem, J.; Roemkens, P.F.A.M. [Research Inst. for Agrobiology and Soil Fertility, Haren (Netherlands)

1998-10-01

To test how a dysfunctioning ecosystem of a severely metal-polluted soil responds to renewed plant growth, a pot experiment was conducted with soil from an experimental arable field with pH and copper gradients imposed 13 years ago. In this experiment, four pH/copper combinations from this field were either planted with a pH- and copper-resistant grass cultivar or remained fallow. During a 10-week period, the dynamics of the microbial activity and of the abundances of bacteria, protozoa. and nematodes were measured, as were the dynamics of several chemical soil parameters. After 13 years of copper, which had resulted in severely reduced crop growth, no effects were observed on bacterial numbers, respiration, or protozoan numbers, but bacterial growth was strongly reduced in the low pH plots, and even more so in low pH plots enriched with copper. Of the organisms, only nematodes were negatively affected under conditions of high copper load at low pH. In these plots, numbers belonging to all feeding categories were strongly reduced. Planting of a copper-tolerant grass variety, Agrostis capillaris L. var. Parys Mountain, resulted within 10 weeks in faster bacterial growth and more protozoa and bacterivorous nematodes in comparison with fallow controls; these effects were markedly strongest in the acidic, copper-enriched soils. During incubation, fungivorous nematodes increased in all treatments, in fallow and in planted pots and in the pots with high-copper, low-pH soil. The results of this experiment suggest that introduction of plant growth is one of the major causes of increased biological activity in acidic contaminated soils. Planting such soils with metal-tolerant plant species can reestablish the necessary food base to support soil organism growth, and this can lead to numerous positive effects, reversing the loss of soil functions due to the high copper levels under acidic conditions.

[Migrants from disposable gloves and residual acrylonitrile].

Science.gov (United States)

Wakui, C; Kawamura, Y; Maitani, T

2001-10-01

Disposable gloves made from polyvinyl chloride with and without di(2-ethylhexyl) phthalate (PVC-DEHP, PVC-NP), polyethylene (PE), natural rubber (NR) and nitrile-butadiene rubber (NBR) were investigated with respect to evaporation residue, migrated metals, migrants and residual acrylonitrile. The evaporation residue found in n-heptane was 870-1,300 ppm from PVC-DEHP and PVC-NP, which was due to the plasticizers. Most of the PE gloves had low evaporation residue levels and migrants, except for the glove designated as antibacterial, which released copper and zinc into 4% acetic acid. For the NR and NBR gloves, the evaporation residue found in 4% acetic acid was 29-180 ppm. They also released over 10 ppm of calcium and 6 ppm of zinc into 4% acetic acid, and 1.68-8.37 ppm of zinc di-ethyldithiocarbamate and zinc di-n-butyldithiocarbamate used as vulcanization accelerators into n-heptane. The acrylonitrile content was 0.40-0.94 ppm in NBR gloves.

Radiation effects limits on copper in superconducting magnets

International Nuclear Information System (INIS)

Guinan, M.W.

1984-01-01

The determination of the response of copper stabilizers to neutron irradiation in fusion reactor superconducting magnets requires information in four areas. (1) Neutron flux and spectrum determination are a major factor in the accuracy with which stabilizer response can be predicted. Since magnet stability depends on the weakest link, calculations must be made in sufficient detail to fully account for steep flux gradients and local pertubations from penetrations. (2) Resistivity changes at zero field in magnet spectra are generally calculated from the damage energy cross-section or the equivalent displacement (dpa) rate. (3) Resistivity changes at field for conceptual designs are generally determined from the changes predicted at zero field by the use of a Kohler plot. The cyclic irradiation and annealing, expected to be characteristic of fusion reactor magnet operation, is presently the largest source of uncertainty in determining the limits of neutron exposure for copper stabilizers. Applications of our current understanding of the limits of copper stabilizers in fusion reactor designs are explored in two examples. Recommendations for future additions to the data base are discussed

Comparison and analysis of the efficiency of heat exchange of copper rod and copper wires current lead

International Nuclear Information System (INIS)

Fang, J.; Yu, T.; Li, Z.M.; Wei, B.; Qiu, M.; Zhang, H.J.

2013-01-01

Highlights: •An optimized design of HTS binary current leads is proposed. •Temperature distributions of two different current leads are calculated. •Experiments are done to certify the calculated temperature distributions. •The experiments proved that the copper wires increase security margins. -- Abstract: Current leads are the key components that connect the low-temperature and high temperature parts of the cryogenic system. Owing to the wide range of temperatures, current leads are the main sources of heat leakage. Since the HTS tapes have no resistance and the generated Joule heat is almost zero, HTS binary current leads can reduce heat leakage compared to the conventional leads. However, heat will still be generated and conducted to the cryogenic system through the copper parts of the HTS current leads. In order to reduce heat leakage by the copper parts of the HTS current leads, this paper presents an optimized design of the copper parts of HTS binary current leads. Inside the leads, the copper wires were applied as an alternative to the copper rod without changing the overall dimensions. Firstly, the differential function of heat transfer was derived. By solving the function, the optimum number of the copper wires and the temperature distribution of two different current leads were gotten. Then the experiment of the temperature distribution was done, and the experimental results were basically the same with the calculative results. The simulation and related experiments proved that the copper wire can increase security margins and reduce maximum temperatures under the same shunt current

Comparison and analysis of the efficiency of heat exchange of copper rod and copper wires current lead

Energy Technology Data Exchange (ETDEWEB)

Fang, J., E-mail: fangseer@sina.com [School of Electrical Engineering, Beijing Jiaotong University, Beijing (China); Yu, T. [School of Electrical Engineering, Beijing Jiaotong University, Beijing (China); Li, Z.M.; Wei, B.; Qiu, M.; Zhang, H.J. [China Electric Power Research Institute, Haidian District, Beijing (China)

2013-11-15

Highlights: •An optimized design of HTS binary current leads is proposed. •Temperature distributions of two different current leads are calculated. •Experiments are done to certify the calculated temperature distributions. •The experiments proved that the copper wires increase security margins. -- Abstract: Current leads are the key components that connect the low-temperature and high temperature parts of the cryogenic system. Owing to the wide range of temperatures, current leads are the main sources of heat leakage. Since the HTS tapes have no resistance and the generated Joule heat is almost zero, HTS binary current leads can reduce heat leakage compared to the conventional leads. However, heat will still be generated and conducted to the cryogenic system through the copper parts of the HTS current leads. In order to reduce heat leakage by the copper parts of the HTS current leads, this paper presents an optimized design of the copper parts of HTS binary current leads. Inside the leads, the copper wires were applied as an alternative to the copper rod without changing the overall dimensions. Firstly, the differential function of heat transfer was derived. By solving the function, the optimum number of the copper wires and the temperature distribution of two different current leads were gotten. Then the experiment of the temperature distribution was done, and the experimental results were basically the same with the calculative results. The simulation and related experiments proved that the copper wire can increase security margins and reduce maximum temperatures under the same shunt current.

Effect of copper content on the properties of electroless Ni–Cu–P coatings prepared on magnesium alloys

International Nuclear Information System (INIS)

Liu, Junjun; Wang, Xudong; Tian, Zhiyong; Yuan, Ming; Ma, Xijuan

2015-01-01

Highlights: • Electroless Ni–Cu–P coatings were obtained on ZK61M magnesium alloys. • The crystallinity and compactness increases with the increasing of copper content. • The introduction of copper element in the coatings contributes to the formation of passivation film. • The coatings with higher corrosion resistance were obtained from the solution with a higher CuSO 4 concentration. - Abstract: The Ni–Cu–P coatings were obtained by electroless plating method on ZK61M magnesium alloys. The effect of copper content on the properties of electroless Ni–Cu–P coatings on magnesium alloys was further studied. The coatings surface and cross-section morphologies were observed with scanning electron microscope. The crystal structure and corrosion resistance of Ni–Cu–P coatings were evaluated by X-ray diffractometer and electrochemical tests. The experimental results showed that the Ni–Cu–P coatings were uniform and compact, and the corrosion resistance of these coatings was superior to Ni–P coatings owing to the introduction of copper. The crystallinity and compactness of the Ni–Cu–P coatings gradually enhanced with the increasing of copper content in the coatings. The introduction of copper element in the Ni–Cu–P coatings contributes to the formation of passivation film. The Ni–Cu–P coatings with higher corrosion resistance were obtained from the solution with a higher CuSO 4 concentration.

Authorized limits for Fernald copper ingots

Energy Technology Data Exchange (ETDEWEB)

Frink, N.; Kamboj, S.; Hensley, J.; Chen, S. Y.

1997-09-01

This development document contains data and analysis to support the approval of authorized limits for the unrestricted release of 59 t of copper ingots containing residual radioactive material from the U.S. Department of Energy (DOE) Fernald Environmental Management Project (FEMP). The analysis presented in this document comply with the requirements of DOE Order 5400.5, {open_quotes}Radiation Protection of the Public and the Environment,{close_quotes} as well as the requirements of the proposed promulgation of this order as 10 CFR Part 834. The document was developed following the step-by-step process described in the Draft Handbook for Controlling Release for Reuse or Recycle Property Containing Residual Radioactive Material.

Authorized limits for Fernald copper ingots

International Nuclear Information System (INIS)

Frink, N.; Kamboj, S.; Hensley, J.; Chen, S.Y.

1997-09-01

This development document contains data and analysis to support the approval of authorized limits for the unrestricted release of 59 t of copper ingots containing residual radioactive material from the U.S. Department of Energy (DOE) Fernald Environmental Management Project (FEMP). The analysis presented in this document comply with the requirements of DOE Order 5400.5, open-quotes Radiation Protection of the Public and the Environment,close quotes as well as the requirements of the proposed promulgation of this order as 10 CFR Part 834. The document was developed following the step-by-step process described in the Draft Handbook for Controlling Release for Reuse or Recycle Property Containing Residual Radioactive Material

INTRACELLULAR COPPER ACCUMULATION ENHANCES THE GROWTH OF KINEOCOCCUS RADIOTOLERANS DURING CHRONIC IRRADIATION

International Nuclear Information System (INIS)

Bagwell, C; Charles Milliken, C

2007-01-01

The actinobacteria Kineococcus radiotolerans is highly resistant to ionizing radiation, desiccation, and oxidative stress; though the underlying biochemical mechanisms are unknown. The purpose of this study was to explore a possible linkage between the uptake of transition metals and extreme resistance to ionizing radiation and oxidative stress. The effects of 6 different divalent cationic metals on growth were examined in the absence of ionizing radiation. None of the metals tested were stimulatory, though cobalt was inhibitory to growth. In contrast, copper supplementation dramatically increased cell growth during chronic irradiation. K. radiotolerans exhibited specific uptake and intracellular accumulation of copper compared to only a weak response to both iron and manganese supplementation. Copper accumulation sensitized cells to hydrogen peroxide. Acute irradiation induced DNA damage was similar between the copper-loaded culture as the age-synchronized no copper control culture, though low molecular weight DNA was more persistent during post-irradiation recovery in the Cu-loaded culture. Still, the estimated times for genome restoration differed by only 1 hr between treatments. While we cannot discount the possibility that copper fulfills an unexpectedly important biochemical role in a radioactive environment; K. radiotolerans has a high capacity for intracellular copper sequestration, and presumably efficiently coordinated oxidative stress defenses and detoxification systems, which confers cross-protection from the damaging affects ionizing radiation

Effectiveness of 5-Pyrrolidone-2-carboxylic Acid and Copper Sulfate Pentahydrate Association against Drug Resistant Staphylococcus Strains.

Science.gov (United States)

Governa, Paolo; Miraldi, Elisabetta; De Fina, Gianna; Biagi, Marco

2016-04-01

Bacterial resistance is an ongoing challenge for pharmacotherapy and pharmaceutical chemistry. Staphylococcus aureus is the bacterial species which makes it most difficult to treat skin and soft tissue infections and it is seen in thousands of hospitalization cases each year. Severe but often underrated infectious diseases, such as complicated nasal infections, are primarily caused by MRSA and S. epidermidis too. With the aim of studying new drugs with antimicrobial activity and effectiveness on drug resistant Staphylococcus strains, our attention in this study was drawn on the activity of a new association between two natural products: 5-pyrrolidone-2-carboxylic acid (PCA), naturally produced by certain Lactobacillus species, and copper sulfate pentahydrate (CS). The antimicrobial susceptibility test was conducted taking into account 12 different Staphylococcus strains, comprising 6 clinical isolates and 6 resistant strains. PCA 4%, w/w, and CS 0.002%, w/w, association in distilled water solution was found to have bactericidal activity against all tested strains. Antimicrobial kinetics highlighted that PCA 4%, w/w, and CS 0.002% association could reduce by 5 log10 viable bacterial counts of MRSA and oxacillin resistant S. epidennidis in less than 5 and 3 minutes respectively. Microscopic investigations suggest a cell wall targeting mechanism of action. Being very safe and highly tolerated, the natural product PCA and CS association proved to be a promising antimicrobial agent to treat Staphylococcus related infections.

Nickel–copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

International Nuclear Information System (INIS)

Lee, Jong-Gun; Kim, Do-Yeon; Kang, Byungjun; Kim, Donghwan; Song, Hee-eun; Kim, Jooyoung; Jung, Woonsuk; Lee, Dukhaeng; Al-Deyab, Salem S.; James, Scott C.; Yoon, Sam S.

2015-01-01

High-performance electrodes are fabricated through supersonic spraying of nickel and copper particles. These electrodes yield low specific resistivities, comparable to electrodes produced by screen-printed silver paste and light-induced plating. The appeal of this fabrication method is the low cost of copper and large area scalability of supersonic spray-coating techniques. The copper and nickel electrode was fabricated in the open air without any pre- or post-treatment. The spray-coated copper–nickel electrode was characterized by optical microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction, and energy dispersive spectroscopy. Although both SEM and TEM images confirmed voids trapped between flattened particles in the fabricated electrode, this electrode’s resistivity was order 10 −6 Ω cm, which is comparable to the bulk value for pure copper

The Effect of Preceding Crops on the Chemical Fractions of Copper (Cu in the Rhizosphere and the Bulk Soil and its Relationship with Copper Uptake by Wheat

Directory of Open Access Journals (Sweden)

shahrzad kabirinejad

2017-02-01

Full Text Available Introduction: Preceding crops as a source of organic matter are an important source of micronutrient and can play an important role in the soil fertility and the micronutrients cycle of soil. In addition to the role of the organic matter in increasing the concentration of micronutrients in soil solution, attention also should be paid to the role of the kind and the quantity of the root’s exudates that are released in response to the incorporation of different plant residues in the rhizosphere. Present research was conducted with the objective of studying the effect of the kind of preceding crops: Trifolium (Trifolium pretense L, Sofflower (Carthamus tinectirus L, Sorghum (Sorghum bicolor L, Sunflower (Heliantus annus L and control (fallow on the chemical forms of copper in the wheat rhizosphere and the bulk soil and Cu uptake by wheat and also investigating the correlation between the fractions of Cu in soil and Cu uptake in wheat. Materials and Methods: The present research was conducted as split plot in a Randomized Complete Block design (RCBD with 3 replications and 5 treatments, in field conditions. In the beginning, the preceding crops were cultivated in the experimental plots and after ending growth, preceding crops were harvested. Then the wheat was cultivated in the experimental plots. Finally, after harvesting the wheat, soil samples were collected from the two parts of the root zone (the wheat rhizosphere and the bulk soil. The soil samples were air dried ground and passed through a 2-mm sieve and stored for chemical analysis. Soil pH (in the soil saturation extract and organic matter (Walkley–Black wet digestion were measured in standard methods (1. The Total Organic Carbon (TOC was measured by Analyzer (Primacs SLC TOC Analyzer (CS22, Netherlands. The available Cu in soil was extracted by DTPA and determined using atomic absorption spectroscopy (2. The fractionation of soil Cu was carried out using the MSEP method (3. Results and

Damage coefficient and defect level of copper-contaminated silicon N+P diode

International Nuclear Information System (INIS)

Usami, A.; Kato, Y.

1975-01-01

The damage coefficient at 298 0 K of copper-contaminated N + P diodes is smaller than that of non-contaminated ones. In these copper-contaminated samples, the higher the bulk resistivity is, the smaller is the damage coefficient. For non-contaminated diodes, the damage coefficient of samples of pulled bulk crystals is smaller than that of floating zone crystals, and the higher bulk resistivity diodes have smaller damage coefficient. At 217 0 K measurement, the effect of copper-contamination on the damage coefficient could not be observed. The energy levels of defects introduced by gamma ray irradiation are approximately0.30 eV, and approximately0.28 eV with non-contaminated FZ 135 ohm-cm and CZ 10 ohm-cm bulk samples, respectively. In copper-contaminated samples, approximately0.60 eV and approximately0.45 eV are obtained as the defect energy levels for FZ 135 ohm-cm and CZ 10 ohm-cm bulk samples. (U.S.)

Measurement of residual radioactivity in cooper exposed to high energy heavy ion beam

Energy Technology Data Exchange (ETDEWEB)

Kim, Eunjoo; Nakamura, Takashi [Tohoku Univ., Sendai (Japan). Cyclotron and Radioisotope Center; Uwamino, Yoshitomo; Ito, Sachiko; Fukumura, Akifumi

1999-03-01

The residual radioactivities produced by high energy heavy ions have been measured using the heavy ion beams of the Heavy Ion Medical Accelerator (HIMAC) at National Institute of Radiological Sciences. The spatial distribution of residual radioactivities in 3.5 cm, 5.5 cm and 10 cm thick copper targets of 10 cm x 10 cm size bombarded by 290 MeV/u, 400 MeV/u-{sup 12}C ion beams and 400 MeV/u-{sup 20}Ne ion beam, respectively, were obtained by measuring the gamma-ray activities of 0.5 mm thick copper foil inserted in the target with a high purity Ge detector after about 1 hour to 6 hours irradiation. (author)

Two draft genome sequences of Pseudomonas jessenii strains isolated from a copper contaminated site in Denmark

DEFF Research Database (Denmark)

Qin, Yanan; Wang, Dan; Brandt, Kristian Koefoed

2016-01-01

Pseudomonas jessenii C2 and Pseudomonas jessenii H16 were isolated from low-Cu and high-Cu industrially contaminated soil, respectively. P. jessenii H16 displayed significant resistance to copper when compared to P. jessenii C2. Here we describe genome sequences and interesting features of these ......Pseudomonas jessenii C2 and Pseudomonas jessenii H16 were isolated from low-Cu and high-Cu industrially contaminated soil, respectively. P. jessenii H16 displayed significant resistance to copper when compared to P. jessenii C2. Here we describe genome sequences and interesting features...... of these two strains. The genome of P. jessenii C2 comprised 6,420,113 bp, with 5814 protein-coding genes and 67 RNA genes. P. jessenii H16 comprised 6,807,788 bp, with 5995 protein-coding genes and 70 RNA genes. Of special interest was a specific adaptation to this harsh copper-contaminated environment as P....... jessenii H16 contained a novel putative copper resistance genomic island (GI) of around 50,000 bp....

Residual Stress Studies Using the Cairo Fourier Diffractometer Facility

International Nuclear Information System (INIS)

Maayouf, R.M.A.; El-Shaer, Y.H.

2002-01-01

The present paper deals with residual stress studies using the Cairo Fourier diffractometer facility CFDF. The CFDF is a reverse - time of -flight (RTOF) diffractometer; applies a Fourier chopper. The measurements were performed for copper samples in order to study the residual stress after welding. The maximum modulation of the Fourier chopper during the measurements was 136 khz; leading to a time resolution half-width of about 7 μ s. It has been found from the present measurements that, the resulting diffraction spectra could be successfully used for studying the residual stress; in the wavelength range between 0.7-2.9 A degree at ∼ 0.45 % relative resolution

A brief review of cavity swelling and hardening in irradiated copper and copper alloys

International Nuclear Information System (INIS)

Zinkle, S.J.

1990-01-01

The literature on radiation-induced swelling and hardening in copper and its alloy is reviewed. Void formation does not occur during irradiation of copper unless suitable impurity atoms such as oxygen or helium are present. Void formation occurs for neutron irradiation temperatures of 180 to 550 degree C, with peak swelling occurring at ∼320 degree C for irradiation at a damage rate of 2 x 10 -7 dpa/s. The post-transient swelling rate has been measured to be ∼0.5%/dpa at temperatures near 400 degree C. Dispersion-strengthened copper has been found to be very resistant to void swelling due to the high sink density associated with the dispersion-stabilized dislocation structure. Irradiation of copper at temperatures below 400 degree C generally causes an increase in strength due to the formation of defect clusters which inhibit dislocation motion. The radiation hardening can be adequately described by Seeger's dispersed barrier model, with a barrier strength for small defect clusters of α ∼ 0.2. The radiation hardening apparently saturates for fluences greater than ∼10 24 n/m 2 during irradiation at room temperature due to a saturation of the defect cluster density. Grain boundaries can modify the hardening behavior by blocking the transmission of dislocation slip bands, leading to a radiation- modified Hall-Petch relation between yield strength and grain size. Radiation-enhanced recrystallization can lead to softening of cold-worked copper alloys at temperatures above 300 degree C

The electrical characteristics of copper slags in a 270 kVA DC arc furnace

International Nuclear Information System (INIS)

Derin, Bora; Sahin, Filiz Cinar; Yucel, Onuralp

2003-01-01

The electrical resistance of slags is the main criteria to determine the design and the operation conditions of slag resistance furnace (SRF) depending on temperature and composition. In this study, a 270 kVA DC electric arc furnace were used to determine the electrical characteristic of molten ancient copper slags. The specific conductivity of the slag was estimated by using furnace geometric factor given in the literature as an empirical formula and by using furnace resistance measured during smelting of the copper slag with or without different additives such as coke, CaO and Al 2 O 3 . (Original)

Switching operation and degradation of resistive random access memory composed of tungsten oxide and copper investigated using in-situ TEM.

Science.gov (United States)

Arita, Masashi; Takahashi, Akihito; Ohno, Yuuki; Nakane, Akitoshi; Tsurumaki-Fukuchi, Atsushi; Takahashi, Yasuo

2015-11-27

In-situ transmission electron microscopy (in-situ TEM) was performed to investigate the switching operation of a resistive random access memory (ReRAM) made of copper, tungsten oxide and titanium nitride (Cu/WOx/TiN). In the first Set (Forming) operation to initialize the device, precipitation appeared inside the WOx layer. It was presumed that a Cu conducting filament was formed, lowering the resistance (on-state). The Reset operation induced a higher resistance (the off-state). No change in the microstructure was identified in the TEM images. Only when an additional Reset current was applied after switching to the off-state could erasure of the filament be seen (over-Reset). Therefore, it was concluded that structural change relating to the resistance switch was localized in a very small area around the filament. With repeated switching operations and increasing operational current, the WOx/electrode interfaces became indistinct. At the same time, the resistance of the off-state gradually decreased. This is thought to be caused by Cu condensation at the interfaces because of leakage current through the area other than through the filament. This will lead to device degradation through mechanisms such as endurance failure. This is the first accelerated aging test of ReRAM achieved using in-situ TEM.

A novel compound cleaning solution for benzotriazole removal after copper CMP

International Nuclear Information System (INIS)

Gu Zhangbing; Liu Yuling; Gao Baohong; Wang Chenwei; Deng Haiwen

2015-01-01

After the chemical mechanical planarization (CMP) process, the copper surface is contaminated by a mass of particles (e.g. silica) and organic residues (e.g. benzotriazole), which could do great harm to the integrated circuit, so post-CMP cleaning is essential. In particular, benzotriazole (BTA) forms a layer of Cu-BTA film with copper on the surface, which leads to a hydrophobic surface of copper. So an effective cleaning solution is needed to remove BTA from the copper surface. In this work, a new compound cleaning solution is designed to solve two major problems caused by BTA: one is removing BTA and the other is copper surface corrosion that is caused by the cleaning solution. The cleaning solution is formed of alkaline chelating agent (FA/O II type), which is used to remove BTA, and a surfactant (FA/O I type), which is used as a corrosion inhibitor. BTA removal is characterized by contact angle measurements and electrochemical techniques. The inhibiting corrosion ability of the surfactant is also characterized by electrochemical techniques. The proposed compound cleaning solution shows advantages in removing BTA without corroding the copper surface. (paper)

Preparation and adsorption characteristics for heavy metals of active silicon adsorbent from leaching residue of lead-zinc tailings.

Science.gov (United States)

Lei, Chang; Yan, Bo; Chen, Tao; Xiao, Xian-Ming

2018-05-19

To comprehensively reuse the leaching residue obtained from lead-zinc tailings, an active silicon adsorbent (ASA) was prepared from leaching residue and studied as an adsorbent for copper(II), lead(II), zinc(II), and cadmium(II) in this paper. The ASA was prepared by roasting the leaching residue with either a Na 2 CO 3 /residue ratio of 0.6:1 at 700 °C for 1 h or a CaCO 3 /residue ratio of 0.8:1 at 800 °C for 1 h. Under these conditions, the available SiO 2 content of the ASA was more than 20%. The adsorption behaviors of the metal ions onto the ASA were investigated and the Langmuir, Freundlich, and Dubinin-Radushkevich isotherm models were used to analyze the adsorption isotherm. The result showed that the maximum adsorption capacities of copper(II), lead(II), cadmium(II), and zinc(II) calculated by the Langmuir model were 3.40, 2.83, 0.66, and 0.62 mmol g -1 , respectively. The FT-IR spectra of the ASA and the mean free adsorption energies indicated that ion exchange was the mechanism of copper(II), lead(II), and cadmium(II) adsorption and that chemical reaction was the mechanism of zinc(II) adsorption. These results provide a method for reusing the leaching residue obtained from lead-zinc tailings and show that the ASA is an effective adsorbent for heavy metal pollution remediation.

Copper recovery from slag by indirect bio leaching

International Nuclear Information System (INIS)

Mazuelos, A.; Iglesias, N.; Romero, R.; Forcat, O.; Carranza, F.

2009-01-01

The main source of copper loss from a smelter is copper in discard slag. Slag can contain Cu in concentrations very much higher than those of many ores. Cu is present in slag entrained in very small drops of matte, white metal and blister copper occluded in fayalitic phase. In this work, the technical viability of the BRISA process, that is based on the indirect bio leaching, for this residue has been proved. A sample of slag, containing 2 % of copper, has been chemical, granulometric and metallographic characterized and it has been leached with ferric sulphate solutions in agitated reactors. The influence of several variables have been investigated. Once the best operating conditions had been selecting and an economic estimation had been done (with very really attractive results), the leaching stage has been designed for a plant of 30 tonnes per hour capacity. Cu extractions higher than 70% can be achieved with a residence time of only five hours. Despite of Cu(II) concentration in fed is as high as 30 g/l, bio oxidation stage can supply Fe(III) demanded by ferric leaching stage. (Author) 17 refs

Resolving distinct molecular origins for copper effects on PAI-1.

Science.gov (United States)

Bucci, Joel C; McClintock, Carlee S; Chu, Yuzhuo; Ware, Gregory L; McConnell, Kayla D; Emerson, Joseph P; Peterson, Cynthia B

2017-10-01

Components of the fibrinolytic system are subjected to stringent control to maintain proper hemostasis. Central to this regulation is the serpin plasminogen activator inhibitor-1 (PAI-1), which is responsible for specific and rapid inhibition of fibrinolytic proteases. Active PAI-1 is inherently unstable and readily converts to a latent, inactive form. The binding of vitronectin and other ligands influences stability of active PAI-1. Our laboratory recently observed reciprocal effects on the stability of active PAI-1 in the presence of transition metals, such as copper, depending on the whether vitronectin was also present (Thompson et al. Protein Sci 20:353-365, 2011). To better understand the molecular basis for these copper effects on PAI-1, we have developed a gel-based copper sensitivity assay that can be used to assess the copper concentrations that accelerate the conversion of active PAI-1 to a latent form. The copper sensitivity of wild-type PAI-1 was compared with variants lacking N-terminal histidine residues hypothesized to be involved in copper binding. In these PAI-1 variants, we observed significant differences in copper sensitivity, and these data were corroborated by latency conversion kinetics and thermodynamics of copper binding by isothermal titration calorimetry. These studies identified a copper-binding site involving histidines at positions 2 and 3 that confers a remarkable stabilization of PAI-1 beyond what is observed with vitronectin alone. A second site, independent from the two histidines, binds metal and increases the rate of the latency conversion.

Trophic-metabolic activity of earthworms (Lumbricidae as a zoogenic factor of maintaining reclaimed soils’ resistance to copper contamination

Directory of Open Access Journals (Sweden)

Y. L. Kulbachko

2014-07-01

which restricts movement of excess chemicals, maintains stability and increases resistance to soil contamination, in particular, with copper. Besides, it is possible to accelerate the artificial forest edaphotop naturalization on reclaimed land, and to increase its ecological value

Compatibility studies of copper, brass and cupronickel with Hytherm-500 thermofluid

International Nuclear Information System (INIS)

Pujar, M.G.; Dayal, R.K.; Gnanamoorthy, J.B.

1989-01-01

Carbon steel used as a structural material in thermofluid/water heat exchangers in the Fast Breeder Test Reactor (FBTR) got perforated resulting in leakage. To suggest an alternative better corrosion resistant material for these exchangers, corrosion resistance studies of copper based alloy systems in both a s received and pickled conditions were carried out in the thermofluid medium (Hytherm-500) at room temperature (∼298 K), 373 K and 423 K upto 500 h duration. The tested materials, copper, admiralty brass and 70/30 cupronickel were found to have excellent corrosion resistance in both as-received and pickled conditions. In all the cases corrosion rates decreased with increased duration of exposure. All the above materials showed better corrosion resistance in pickled condition compared to that in as-received condition. The relative corrosion resistance of these three alloys was as follows: admiralty brass > cop per > cupronickel. This trend in the corrosion resistance was observed in both as-received and pickled conditions. In general, the corrosion resistance in pickled condition was found to be better than that in as-received condition. (author). 3 refs., 3 figs., 2 tabs

Role of copper oxides in contact killing of bacteria.

Science.gov (United States)

Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

2013-12-31

The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

The Use of Copper Pesticides in Germany and the Search for Minimization and Replacement Strategies

Directory of Open Access Journals (Sweden)

Stefan Kuehne

2017-02-01

Full Text Available Copper pesticides used to control fungal and bacterial diseases such as grapes downy mildew (Plasmopara viticola, downy mildew of hops (Pseudoperonospora humili, apple scab (Venturia spp., fireblight (Erwinia amylovora and potato late blight (Phytophthora infestans, play an important role in plant protection. In a 2013 survey of copper application in Germany we found, that while the amounts of copper used per hectare in conventional grape (0.8 kg ha−1, hop (1.7 kg ha−1 and potato-farming (0.8 kg ha−1 were well below those used in organic farming (2.3, 2.6 and 1.4 kg ha−1, respectively, they were nearly identical to those used in apple growing (1.4 kg ha−1. Due to the smaller farming area, only 24% (26.5 tonnes of the total amount of copper was applied in organic farming compared to 76% (84.8 tonnes in conventional farming. Since 2001, the Federal Agency for Agriculture and Food (BLE promoted a copper research and minimization strategy which was funded with a total of C10.2 million. Our status quo analysis of research in this field shows that some progress is being made concerning alternative compounds, resistant varieties and decision support systems. However, it also shows that new approaches are not yet able to replace copper pesticides completely, especially in organic farming. In integrated pest management, copper preparations are important for the necessary active substance rotation and successful resistance management. The availability of such products is often essential for organic grapes, hops and fruit production and for extending the organic farming of these crops. We conclude that the complete elimination of copper pesticides is not yet practicable in organic farming as the production of several organic crops would become unprofitable and may lead to organic farmers reverting to conventional production. Several existing copper reduction strategies were, however, identified, and some, like modified forecast models adapted to

Overlapping Residual Herbicides for Control of Photosystem (PS) II- and 4-Hydroxyphenylpyruvate Dioxygenase (HPPD)-Inhibitor-Resistant Palmer amaranth (Amaranthus palmeri S. Watson) in Glyphosate-Resistant Maize

Science.gov (United States)

Chahal, Parminder S.; Ganie, Zahoor A.; Jhala, Amit J.

2018-01-01

A Palmer amaranth (Amaranthus palmeri S. Watson) biotype has evolved resistance to photosystem (PS) II- (atrazine) and 4-hydroxyphenylpyruvate dioxygenase (HPPD)-inhibiting herbicides (mesotrione, tembotrione, and topramezone) in maize seed production field in Nebraska, USA. The objectives of this study were to determine the effect of soil residual pre-emergence (PRE) herbicides followed by (fb) tank-mixture of residual and foliar active post-emergence (POST) herbicides on PS-II- and HPPD-inhibitor-resistant Palmer amaranth control, maize yield, and net economic returns. Field experiments were conducted in a grower's field infested with PS II- and HPPD-inhibitor-resistant Palmer amaranth near Shickley in Fillmore County, Nebraska, USA in 2015 and 2016. The contrast analysis suggested that saflufenacil plus dimethenamid-P or pyroxasulfone plus saflufenacil applied PRE provided 80–82% Palmer amaranth control compared to 65 and 39% control with saflufenacil and pyroxasulfone applied alone at 3 weeks after PRE (WAPRE), respectively. Among the PRE fb POST herbicide programs, 95–98% Palmer amaranth control was achieved with pyroxasulfone plus safluefenacil, or saflufenacil plus dimethenamid-P applied PRE, fb glyphosate plus topramezone plus dimethenamid-P plus atrazine, glyphosate plus diflufenzopyr plus dicamba plus pyroxasulfone, glyphosate plus diflufenzopyr plus pendimethalin, or glyphosate plus diflufenzopyr plus dicamba plus atrazine applied POST at 3 weeks after POST (WAPOST) through maize harvest. Based on contrast analysis, PRE fb POST programs provided 77–83% Palmer amaranth control at 3 WAPOST through maize harvest compared to 12–15% control with PRE-only and 66–84% control with POST-only programs. Similarly, PRE fb POST programs provided 99% biomass reduction at 6 WAPOST compared to PRE-only (28%) and POST-only (87%) programs. PRE fb POST programs provided higher maize yield (13,617 kg ha−1) and net return (US $1,724 ha−1) compared to the PRE

Surface Impedance of Copper MOB Depending on the Annealing Temperature and Deformation Degree

International Nuclear Information System (INIS)

Kutovoj, V.A.; Nikolaenko, A.A.; Stoev, P.I.; Vinogradov, D.V.

2006-01-01

Results of researches of influence of annealing temperature and deformation degree on mechanical features of copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were subject to pre-deformation and were annealed in the range of temperatures 873...923 K

Zinc resistance of Staphylococcus aureus of animal origin is strongly associated with methicillin resistance

DEFF Research Database (Denmark)

Cavaco, Lina; Hasman, Henrik; Aarestrup, Frank Møller

2011-01-01

This study was conducted to determine the occurrence of zinc and copper resistances in methicillin-resistant Staphylococcus aureus (MRSA) from swine and veal calves in a global strain collection.The test population consisted of 476 porcine MRSA isolates from ten European countries, 18 porcine MRSA...... of the pig MRSA from Europe and the seven Chinese isolates belonged to other CCs and 3 isolates were not classified into a CC.All isolates were tested for susceptibility to zinc chloride and copper sulphate using agar dilution and tested by PCR for the czrC gene encoding zinc resistance.Phenotypic zinc...... resistance (MIC>2mM) was observed in 74% (n=324) and 42% (n=39) of European MRSA CC398 from pigs and veal calves, respectively, and in 44% of the Canadian isolates (n=8), but not among the Chinese isolates. Almost all (99%) zinc-resistant MRSA carried czrC. Of the 37 European non-CC398 MRSA, 62% were...

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

2014-05-30

The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

Combination of aquatic species and safeners improves the remediation of copper polluted water.

Science.gov (United States)

Panfili, Ivan; Bartucca, Maria Luce; Ballerini, Eleonora; Del Buono, Daniele

2017-12-01

In the last decades, many anthropogenic activities have resulted in heavy metal contamination of freshwaters and surrounding environments. This poses serious threats to human health. Phytoremediation is a cost-effective technology which is useful for remediating polluted soils and water. Recently, the use of aquatic free-floating plants has been proposed to remediate polluted water. In this context, a study on the capacity of two aquatic plants, Lemna minor (duckweed) and Salvinia auriculata (salvinia), to remediate Cu +2 (Cu) polluted water was carried out. Initially, the species were exposed to different copper concentrations (1, 5, 10, 20 and 50μmolL -1 ) in order to assess Cu +2 toxicity to the plants. In addition, plants were treated with two safeners (benoxacor and dichlormid), with the aim of pointing out any safening effect of these compounds on the aquatic species. Toxicity tests showed that safened plants had a greater Cu resistance, especially at the higher Cu doses. Finally, unsafened and safened plants were tested in the decontamination of water polluted by copper (1.2mgL -1 ). In general, duckweed removed higher amounts of Cu from polluted water than salvinia, and, surprisingly, for both the species the safeners significantly increased the plants' capacity to remove the metal from the polluted waters. Lastly, an HPLC-based method was developed and standardized to monitor the residual amounts of the two safeners in the water. While dichlormid was completely absorbed by duckweed within few days after the treatments, some residual amounts of both safeners were found in salvinia vegetated water after two weeks. In conclusion, the results of this research show that the use of aquatic species in combination with safeners is an attractive and reliable tool to make plants more effective in phytoremediation of water polluted with metals (or other toxic compounds). Copyright © 2017 Elsevier B.V. All rights reserved.

Enhancement Experiment on Cementitious Activity of Copper-Mine Tailings in a Geopolymer System

Directory of Open Access Journals (Sweden)

Lin Yu

2017-12-01

Full Text Available Copper-mine tailings are the residual products after the extraction of precious copper metal from copper ores, and their storage can create numerous environmental problems. Many researchers have used copper-mine tailings for the preparation of geopolymers. This paper studies the enhancement of the cementitious activity of copper-mine tailings in geopolymer systems. First, copper-mine tailings are activated through mechanical grinding activation. Then, the mechanically activated copper-mine tailings are further processed through thermal activation and alkaline-roasting activation. The cementitious activity index of copper-mine tailings is characterized through the degree of leaching concentration of Si and Al. It was observed that the Si and Al leaching concentration of mechanically activated tailings was increased by 26.03% and 93.33%, respectively. The concentration of Si and Al was increased by 54.19% and 119.92%, respectively. For alkaline-roasting activation, roasting time, temperature and the mass ratio of copper-mine tailings to NaOH (C/N ratio were evaluated through orthogonal tests, and the best condition for activation was 120 min at 600 °C with a C/N ratio of 5:1. In this study, scanning electron microscopy (SEM, X-ray diffraction (XRD and infra-red (IR analysis show that mechanical, thermal and alkaline-roasting activation could be used to improve the cementitious activity index of copper-mine tailings.

Bioleaching of a low-grade nickel-copper sulfide by mixture of four thermophiles.

Science.gov (United States)

Li, Shuzhen; Zhong, Hui; Hu, Yuehua; Zhao, Jiancun; He, Zhiguo; Gu, Guohua

2014-02-01

This study investigated thermophilic bioleaching of a low grade nickel-copper sulfide using mixture of four acidophilic thermophiles. Effects of 0.2g/L l-cysteine on the bioleaching process were further evaluated. It aimed at offering new alternatives for enhancing metal recoveries from nickel-copper sulfide. Results showed a recovery of 80.4% nickel and 68.2% copper in 16-day bioleaching without l-cysteine; while 83.7% nickel and 81.4% copper were recovered in the presence of l-cysteine. Moreover, nickel recovery was always higher than copper recovery. l-Cysteine was found contributing to lower pH value, faster microbial growth, higher Oxidation-Reduction Potential (ORP), higher zeta potential and absorbing on the sulfide surfaces through amino, carboxyl and sulfhydryl groups. X-ray Diffraction (XRD) patterns of leached residues showed generation of S, jarosite and ammoniojarosite. Denaturing Gradient Gel Electrophoresis (DGGE) results revealed that l-cysteine could have variant impacts on different microorganisms and changed the microbial community composition dramatically during nickel-copper sulfide bioleaching. Copyright © 2013 Elsevier Ltd. All rights reserved.

He bubble sites in implanted copper alloy

International Nuclear Information System (INIS)

Moreno, D.; Eliezer, D.

1996-01-01

Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

Copper-beryllium alloys for technical applications

International Nuclear Information System (INIS)

Heller, W.

1976-01-01

Data of physical properties are compiled for the most commonly used copper-beryllium alloys (CuBe 2, CuBe 1.7, CuCoBe, and CuCoAgBe), with emphasis on their temperature dependence and their variation with particular annealing and hardening treatments. The purpose is to provide a reference source and to indicate the versatility of these materials with respect to other copper alloys and to pure copper. The special features of CuBe alloys include high mechanical strength with reasonably high electrical conductivity, as well as good wear and corrosion resistance. For example, CuBe 2 has a yield strength of up to 1200 N/mm 2 , about three times that of pure copper, whilst the electrical conductivity of CuCoBe can be as high as 28 MS/m, nearly half that of pure copper. Typical applications are springs and electrical contacts. The importance of a proper heat treatment is discussed in some detail, notably the metallurgy and effects of low-temperature annealing (precipitation-hardening). A chapter on manufacturing processes covers machining, brazing, welding, and cleaning. This is followed by some remarks on safety precautions against beryllium poisoning. CuBe alloys are commercially available in the form of wires, strips, rods, and bars. Typical dimensions, specifications, a brief cost estimate, and addresses of suppliers are listed. (Author)

Effect of copper and lead on two consortia of phototrophic microorganisms and their capacity to sequester metals

Energy Technology Data Exchange (ETDEWEB)

Burgos, A. [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); Departamento de Recursos Hidrobiológicos, Universidad de Nariño, Pasto (N) (Colombia); Maldonado, J. [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); De los Rios, A. [Museo Nacional de Ciencias Naturales(CSIC), Serrano 115 dpdo, 28006 Madrid (Spain); Solé, A. [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); Esteve, I., E-mail: isabel.esteve@uab.cat [Departament de Genètica i Microbiologia, Universitat Autònoma de Barcelona, Edifici C, Campus de UAB, Bellaterra (Cerdanyola del Vallès), 08193 Barcelona (Spain); Departamento de Recursos Hidrobiológicos, Universidad de Nariño, Pasto (N) (Colombia); Museo Nacional de Ciencias Naturales(CSIC), Serrano 115 dpdo, 28006 Madrid (Spain)

2013-09-15

Highlights: •We studied the tolerance-resistance of phototrophic microorganisms to copper and lead. •We determined the capacity of consortia of microorganisms to sequester copper and lead. •CLSM-λscan is a technique for evaluating in vivo effect of metals on microorganisms. •SEM-EDX and TEM-EDX determined the capacity of microorganisms to sequester metals. -- Abstract: The roles of consortia of phototrophic microorganisms have been investigated in this paper to determine their potential role to tolerate or resist metals and to capture them from polluted cultures. With this purpose, two consortia of microorganisms: on one hand, Geitlerinema sp. DE2011 (Ge) and Scenedesmus sp. DE2009 (Sc) (both identified in this paper by molecular biology methods) isolated from Ebro Delta microbial mats, and on the other, Spirulina sp. PCC 6313 (Sp) and Chroococcus sp. PCC 9106 (Ch), from Pasteur culture collection were polluted with copper and lead. In order to analyze the ability of these consortia to tolerate and capture metals, copper and lead were selected, because both have been detected in Ebro Delta microbial mats. The tolerance-resistance to copper and lead for both consortia was determined in vivo and at cellular level by Confocal Laser Scanning Microscopy (CLSM-λscan function). The results obtained demonstrate that both consortia are highly tolerant-resistant to lead and that the limits between the copper concentration having cytotoxic effect and that having an essential effect are very close in these microorganisms. The capacity of both consortia to capture extra- and intracellular copper and lead was determined by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) respectively, coupled to an Energy Dispersive X-ray detector (EDX). The results showed that all the microorganisms assayed were able to capture copper extracellularly in the extrapolymeric substances, and lead extra- and intracellularly in polyphosphate inclusions. Moreover

Effect of copper and lead on two consortia of phototrophic microorganisms and their capacity to sequester metals

International Nuclear Information System (INIS)

Burgos, A.; Maldonado, J.; De los Rios, A.; Solé, A.; Esteve, I.

2013-01-01

Highlights: •We studied the tolerance-resistance of phototrophic microorganisms to copper and lead. •We determined the capacity of consortia of microorganisms to sequester copper and lead. •CLSM-λscan is a technique for evaluating in vivo effect of metals on microorganisms. •SEM-EDX and TEM-EDX determined the capacity of microorganisms to sequester metals. -- Abstract: The roles of consortia of phototrophic microorganisms have been investigated in this paper to determine their potential role to tolerate or resist metals and to capture them from polluted cultures. With this purpose, two consortia of microorganisms: on one hand, Geitlerinema sp. DE2011 (Ge) and Scenedesmus sp. DE2009 (Sc) (both identified in this paper by molecular biology methods) isolated from Ebro Delta microbial mats, and on the other, Spirulina sp. PCC 6313 (Sp) and Chroococcus sp. PCC 9106 (Ch), from Pasteur culture collection were polluted with copper and lead. In order to analyze the ability of these consortia to tolerate and capture metals, copper and lead were selected, because both have been detected in Ebro Delta microbial mats. The tolerance-resistance to copper and lead for both consortia was determined in vivo and at cellular level by Confocal Laser Scanning Microscopy (CLSM-λscan function). The results obtained demonstrate that both consortia are highly tolerant-resistant to lead and that the limits between the copper concentration having cytotoxic effect and that having an essential effect are very close in these microorganisms. The capacity of both consortia to capture extra- and intracellular copper and lead was determined by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) respectively, coupled to an Energy Dispersive X-ray detector (EDX). The results showed that all the microorganisms assayed were able to capture copper extracellularly in the extrapolymeric substances, and lead extra- and intracellularly in polyphosphate inclusions. Moreover

Copper tolerance in Frankia sp. strain EuI1c involves surface binding and copper transport.

Science.gov (United States)

Rehan, Medhat; Furnholm, Teal; Finethy, Ryan H; Chu, Feixia; El-Fadly, Gomaah; Tisa, Louis S

2014-09-01

Several Frankia strains have been shown to be copper-tolerant. The mechanism of their copper tolerance was investigated for Frankia sp. strain EuI1c. Copper binding was shown by binding studies. Unusual globular structures were observed on the surface of the bacterium. These globular structures were composed of aggregates containing many relatively smaller "leaf-like" structures. Scanning electron microscopy with energy-dispersive X-ray (SEM-EDAX) analysis of these structures indicated elevated copper and phosphate levels compared to the control cells. Fourier transform infrared spectroscopy (FTIR) analysis indicated an increase in extracellular phosphate on the cell surface of copper-stressed cells. Bioinformatics' analysis of the Frankia sp. strain EuI1c genome revealed five potential cop genes: copA, copZ, copC, copCD, and copD. Experiments with Frankia sp. strain EuI1c using qRT-PCR indicated an increase in messenger RNA (mRNA) levels of the five cop genes upon Cu(2+) stress. After 5 days of Cu(2+) stress, the copA, copZ, copC, copCD, and copD mRNA levels increased 25-, 8-, 18-, 18-, and 25-fold, respectively. The protein profile of Cu(2+)-stressed Frankia sp. strain EuI1c cells revealed the upregulation of a 36.7 kDa protein that was identified as FraEuI1c_1092 (sulfate-binding periplasmic transport protein). Homologues of this gene were only present in the genomes of the Cu(2+)-resistant Frankia strains (EuI1c, DC12, and CN3). These data indicate that copper tolerance by Frankia sp. strain EuI1c involved the binding of copper to the cell surface and transport proteins.

Nanocarbon-copper thin film as transparent electrode

International Nuclear Information System (INIS)

Isaacs, R. A.; Zhu, H.; Preston, Colin; LeMieux, M.; Jaim, H. M. Iftekhar; Hu, L.; Salamanca-Riba, L. G.; Mansour, A.; Zavalij, P. Y.; Rabin, O.

2015-01-01

Researchers seeking to enhance the properties of metals have long pursued incorporating carbon in the metallic host lattice in order to combine the strongly bonded electrons in the metal lattice that yield high ampacity and the free electrons available in carbon nanostructures that give rise to high conductivity. The incorporation of carbon nanostructures into the copper lattice has the potential to improve the current density of copper to meet the ever-increasing demands of nanoelectronic devices. We report on the structure and properties of carbon incorporated in concentrations up to 5 wt. % (∼22 at. %) into the crystal structure of copper. Carbon nanoparticles of 5 nm–200 nm in diameter in an interconnecting carbon matrix are formed within the bulk Cu samples. The carbon does not phase separate after subsequent melting and re-solidification despite the absence of a predicted solid solution at such concentrations in the C-Cu binary phase diagram. This material, so-called, Cu covetic, makes deposition of Cu films containing carbon with similar microstructure to the metal possible. Copper covetic films exhibit greater transparency, higher conductivity, and resistance to oxidation than pure copper films of the same thickness, making them a suitable choice for transparent conductors

Nanocarbon-copper thin film as transparent electrode

Energy Technology Data Exchange (ETDEWEB)

Isaacs, R. A.; Zhu, H.; Preston, Colin; LeMieux, M.; Jaim, H. M. Iftekhar; Hu, L., E-mail: binghu@umd.edu; Salamanca-Riba, L. G., E-mail: riba@umd.edu [Materials Science and Engineering Department, University of Maryland, College Park, Maryland 20742 (United States); Mansour, A. [Carderock Division, Naval Surface Warfare Center, West Bethesda, Maryland 20817 (United States); Zavalij, P. Y. [Department of Chemistry and Biochemistry, University of Maryland, College Park, Maryland 20742 (United States); Rabin, O. [Materials Science and Engineering Department, University of Maryland, College Park, Maryland 20742 (United States); Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742 (United States)

2015-05-11

Researchers seeking to enhance the properties of metals have long pursued incorporating carbon in the metallic host lattice in order to combine the strongly bonded electrons in the metal lattice that yield high ampacity and the free electrons available in carbon nanostructures that give rise to high conductivity. The incorporation of carbon nanostructures into the copper lattice has the potential to improve the current density of copper to meet the ever-increasing demands of nanoelectronic devices. We report on the structure and properties of carbon incorporated in concentrations up to 5 wt. % (∼22 at. %) into the crystal structure of copper. Carbon nanoparticles of 5 nm–200 nm in diameter in an interconnecting carbon matrix are formed within the bulk Cu samples. The carbon does not phase separate after subsequent melting and re-solidification despite the absence of a predicted solid solution at such concentrations in the C-Cu binary phase diagram. This material, so-called, Cu covetic, makes deposition of Cu films containing carbon with similar microstructure to the metal possible. Copper covetic films exhibit greater transparency, higher conductivity, and resistance to oxidation than pure copper films of the same thickness, making them a suitable choice for transparent conductors.

Kinetics of the conversion of copper sulfide to blister copper

Directory of Open Access Journals (Sweden)

Carrillo, F.

2002-10-01

Full Text Available The desulfurization of copper sulfide by air and oxygen has been studied in two laboratory reactors where the gas is blown onto the melt surface. Rates of oxidation in a vertical resistance furnace may be explained by the mass transfer control in the gas phase. However, results for a horizontal tube suggest that the chemical resistance is controlling.

La desulfuración del sulfuro cuproso con aire y oxígeno se ha estudiado en dos reactores de laboratorio, en los cuales el gas se sopla sobre la superficie del fundido. La velocidad de reacción en un horno de resistencias verticales se puede explicar considerando como controlante la resistencia a la transferencia de materia de la fase gas. Sin embargo, los resultados del horno horizontal indican que la resistencia química es la controlante.

Resistance to and Accumulation of Heavy Metals by Actinobacteria Isolated from Abandoned Mining Areas

Directory of Open Access Journals (Sweden)

Soraia El Baz

2015-01-01

Full Text Available Accumulation of high concentrations of heavy metals in environments can cause many human health risks and serious ecological problems. Nowadays, bioremediation using microorganisms is receiving much attention due to their good performance. The aim of this work is to investigate heavy metals resistance and bioaccumulation potential of actinobacteria strains isolated from some abandoned mining areas. Analysis of mining residues revealed that high concentration of zinc “Zn” was recorded in Sidi Bouatman, Arbar, and Bir Nhass mining residues. The highest concentration of lead “Pb” was found in Sidi Bouatman. Copper “Cu,” cadmium “Cd,” and chromium “Cr” were found with moderate and low concentrations. The resistance of 59 isolated actinobacteria to the five heavy metals was also determined. Using molecular identification 16S rRNA, these 27 isolates were found to belong to Streptomyces and Amycolatopsis genera. The results showed different levels of heavy metal resistance; the minimum inhibitory concentration (MIC recorded was 0.55 for Pb, 0.15 for Cr, and 0.10 mg·mL−1 for both Zn and Cu. Chemical precipitation assay of heavy metals using hydrogen sulfide technic (H2S revealed that only 27 isolates have a strong ability to accumulate Pb (up to 600 mg of Pb per g of biomass for Streptomyces sp. BN3.

Resistance to and Accumulation of Heavy Metals by Actinobacteria Isolated from Abandoned Mining Areas

Science.gov (United States)

El Baz, Soraia; Baz, Mohamed; El Gharmali, Abdelhay; Imziln, Boujamâa

2015-01-01

Accumulation of high concentrations of heavy metals in environments can cause many human health risks and serious ecological problems. Nowadays, bioremediation using microorganisms is receiving much attention due to their good performance. The aim of this work is to investigate heavy metals resistance and bioaccumulation potential of actinobacteria strains isolated from some abandoned mining areas. Analysis of mining residues revealed that high concentration of zinc “Zn” was recorded in Sidi Bouatman, Arbar, and Bir Nhass mining residues. The highest concentration of lead “Pb” was found in Sidi Bouatman. Copper “Cu,” cadmium “Cd,” and chromium “Cr” were found with moderate and low concentrations. The resistance of 59 isolated actinobacteria to the five heavy metals was also determined. Using molecular identification 16S rRNA, these 27 isolates were found to belong to Streptomyces and Amycolatopsis genera. The results showed different levels of heavy metal resistance; the minimum inhibitory concentration (MIC) recorded was 0.55 for Pb, 0.15 for Cr, and 0.10 mg·mL−1 for both Zn and Cu. Chemical precipitation assay of heavy metals using hydrogen sulfide technic (H2S) revealed that only 27 isolates have a strong ability to accumulate Pb (up to 600 mg of Pb per g of biomass for Streptomyces sp. BN3). PMID:25763383

Effect of thickness and temperature of copper phthalocyanine films on their properties

Directory of Open Access Journals (Sweden)

Alieva Kh. S.

2012-06-01

Full Text Available The research has shown that copper phthalocyanine films, having a set of unique properties, can be successfully used as gas-sensitive coating of resistive structures. The thickness of the film, in contrast to its temperature, is not the determining factor for high sensitivity. Low operating temperature of structures with copper phthalocyanine films allows to exploit them in economy mode.

Dependence of stability of metastable superconductors on copper fraction

International Nuclear Information System (INIS)

Elrod, S.A.; Lue, J.W.; Miller, J.R.; Dresner, L.

1980-12-01

The stability of composite superconductors operating in the metastable regime depends upon such factors as matrix resistivity, cooled surface dimensions, fraction of critical current, and volume fraction of stabilizer. By assuming constant thermophysical properties, we developed analytic expressions for the energy and voltage of the minimum propagating zone (MPZ). With other factors held constant, these expressions have been used to predict composite superconductor stability as a function of copper fraction: lower copper fractions lead to higher MPZ energies. MPZ voltages have been measured for three NbTi/Cu composites having different copper fractions and different critical current densities for several magnetic fields and transport currents. Experimental MPZ voltages have been used to calculate an effective heat transfer coefficient, which is subsequently used to calculate the MPZ energy. The experimental MPZ energies support the theoretical expectation that lower copper fractions lead to higher stability in the metastable regime

Copper and Copper Proteins in Parkinson's Disease

Science.gov (United States)

Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

2014-01-01

Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology. PMID:24672633

Evolution of the microstructure in electrochemically deposited copper films at room temperature

DEFF Research Database (Denmark)

Pantleon, Karen; Somers, Marcel A. J.

2007-01-01

The room temperature evolution of the microstructure in copper electrodeposits (self-annealing) was investigated by means of X-ray diffraction analysis and simultaneous measurement of the electrical resistivity as a function of time with an unprecedented time resolution. Independent of the copper...... the crystallographic texture changes by a multiple twinning mechanism. The kinetics of self-annealing is strongly affected by the thickness of the deposit. Storage of the copper films at sub-zero temperatures effectively hinders self-annealing and does not affect the kinetics of self-annealing upon reheating to room...... temperature....

The thermal decomposition of copper(II) oxalate revisited

International Nuclear Information System (INIS)

Lamprecht, Emmanuel; Watkins, Gareth M.; Brown, Michael E.

2006-01-01

DSC, TG and TG-FT-IR, and XRPD have been used to examine the effects of supposedly inert atmospheres of argon and nitrogen on the mechanism of the thermal decomposition of copper(II) oxalate. The DSC curves in pure argon at 10 deg. C min -1 show a broad endotherm with onset at about 280 deg. C and maximum at about 295 deg. C. In mixtures of argon and nitrogen, as the proportion of argon gas is decreased, the endothermic character of the decomposition decreases until, when nitrogen is the main component, the decomposition exhibits a complex broad exothermic character. XRPD studies showed that, regardless of the proportions of nitrogen and argon, the DSC residues consisted of mainly copper metal with small amounts of copper(I) oxide (cuprite) and, under some conditions, traces of copper(II) oxide (tenorite). Various explanations for this behaviour are discussed and a possible answer lies in the disproportionation of CO 2 (g) to form small quantities of O 2 (g) or monatomic oxygen. The possibility exists that the exothermicity in nitrogen could be explained by reaction of the nitrogen with atomic oxygen to form N 2 O(g), but this product could not be detected using TG-FT-IR

The thermal decomposition of copper(II) oxalate revisited

Energy Technology Data Exchange (ETDEWEB)

Lamprecht, Emmanuel [Chemistry Department, Rhodes University, Grahamstown 6140 (South Africa); Watkins, Gareth M. [Chemistry Department, Rhodes University, Grahamstown 6140 (South Africa); Brown, Michael E. [Chemistry Department, Rhodes University, Grahamstown 6140 (South Africa)]. E-mail: m.brown@ru.ac.za

2006-07-01

DSC, TG and TG-FT-IR, and XRPD have been used to examine the effects of supposedly inert atmospheres of argon and nitrogen on the mechanism of the thermal decomposition of copper(II) oxalate. The DSC curves in pure argon at 10 deg. C min{sup -1} show a broad endotherm with onset at about 280 deg. C and maximum at about 295 deg. C. In mixtures of argon and nitrogen, as the proportion of argon gas is decreased, the endothermic character of the decomposition decreases until, when nitrogen is the main component, the decomposition exhibits a complex broad exothermic character. XRPD studies showed that, regardless of the proportions of nitrogen and argon, the DSC residues consisted of mainly copper metal with small amounts of copper(I) oxide (cuprite) and, under some conditions, traces of copper(II) oxide (tenorite). Various explanations for this behaviour are discussed and a possible answer lies in the disproportionation of CO{sub 2}(g) to form small quantities of O{sub 2}(g) or monatomic oxygen. The possibility exists that the exothermicity in nitrogen could be explained by reaction of the nitrogen with atomic oxygen to form N{sub 2}O(g), but this product could not be detected using TG-FT-IR.

Culture-Dependent and Independent Studies of Microbial Diversity in Highly Copper-Contaminated Chilean Marine Sediments

NARCIS (Netherlands)

Besaury, L.; Marty, F.; Buquet, S.; Mesnage, V.; Muijzer, G.; Quillet, L.

2013-01-01

Cultivation and molecular-based approaches were used to study microbial diversity in two Chilean marine sediments contaminated with high (835 ppm) and very high concentrations of copper (1,533 ppm). The diversity of cultivable bacteria resistant to copper was studied at oxic and anoxic conditions,

Separation of copper-64 from copper phthalocyanine

International Nuclear Information System (INIS)

Battaglin, R.I.M.

1979-01-01

The separation of copper-64 from irradiated copper phthalocyanine by Szilard-Chalmers effect is studied. Two methods of separation are used: one of them is based on the dissolution of the irradiated dry compound in concentrated sulfuric acid following its precipitation in water. In the other one the compound is irradiated with water in paste form following treatment with water and hydrochloric acid. The influence of the crystal form of the copper phthalocyanine on the separation yield of copper-64 is shown. Preliminary tests using the ionic exchange technique for purification and changing of copper-64 sulfate to chloride form are carried out. The specific activity using the spectrophotometric technique, after the determination of the copper concentration in solution of copper-64, is calculated. (Author) [pt

Acibenzolar-S-methyl induces lettuce resistance against ...

African Journals Online (AJOL)

... contributing to the enhancement of plant resistance. The effect was comparable with copper treatment. As a marker of resistance, PR protein activity chitinase showed remarkable increase, depending on decreasing bacterial growth in planta. Key words: Acibenzolar-S-methyl, induced resistance, Xanthomonas campestris ...

Use of Fatty Acid Methyl Ester Profiles to Compare Copper-Tolerant and Copper-Sensitive Strains of Pantoea ananatis.

Science.gov (United States)

Nischwitz, C; Gitaitis, R; Sanders, H; Langston, D; Mullinix, B; Torrance, R; Boyhan, G; Zolobowska, L

2007-10-01

acid/14-methylpentadecenoic acid) also had an impact on the differences observed between copper-sensitive parents and copper-resistant mutants. Finding these changes in bacterial fatty acid composition could lead to the development of a laboratory assay to identify copper-tolerant strains using gas chromatography as well as providing clues to further elucidate the mode of action of copper tolerance.

Effect of copper nanoparticles administered in ovo on the activity of proliferating cells and on the resistance of femoral bones in broiler chickens

DEFF Research Database (Denmark)

Mroczek-Sosnowska, Natalia; Lukasiewicz, Monika; Adamek, Dobrochna

2017-01-01

The objective of this study was to evaluate bone resistance after in ovo administration of copper nanoparticles (NanoCu) and to determine the number of cells positive for proliferating cell nuclear antigen (PCNA) in the femoral bones of broiler chickens (n = 12 per group). The study demonstrated...... that femoral bones from the NanoCu group were characterised by a higher weight and volume and by significantly greater resistance to fractures compared to the Control group. NanoCu promoted the proliferation of PCNA-positive cells in the long bones of chickens. A significantly higher number of PCNA......-positive cells in the bones of birds in the NanoCu group compared with the Control group (137 and 122, respectively) indicate a stimulatory effect during embryogenesis. Considering the improvement in bone resistance to fractures and the effect of NanoCu on the number of PCNA-positive cells in femoral bones, Nano...

A novel copper complex induces ROS generation in doxorubicin resistant Ehrlich ascitis carcinoma cells and increases activity of antioxidant enzymes in vital organs in vivo

International Nuclear Information System (INIS)

Mookerjee, Ananda; Roy, Syamal; Choudhuri, Soumitra K; Basu, Jayati Mookerjee; Majumder, Surajit; Chatterjee, Shilpak; Panda, Gouri S; Dutta, Pranabananda; Pal, Smarajit; Mukherjee, Pratima; Efferth, Thomas

2006-01-01

In search of a suitable GSH-depleting agent, a novel copper complex viz., copper N-(2-hydroxyacetophenone) glycinate (CuNG) has been synthesized, which was initially found to be a potential resistance modifying agent and later found to be an immunomodulator in mice model in different doses. The objective of the present work was to decipher the effect of CuNG on reactive oxygen species (ROS) generation and antioxidant enzymes in normal and doxorubicin-resistant Ehrlich ascites carcinoma (EAC/Dox)-bearing Swiss albino mice. The effect of CuNG has been studied on ROS generation, multidrug resistance-associated protein1 (MRP1) expression and on activities of superoxide dismutase (SOD), catalase (CAT) and glutathione peroxidase (GPx). CuNG increased ROS generation and reduced MRP1 expression in EAC/Dox cells while only temporarily depleted glutathione (GSH) within 2 h in heart, kidney, liver and lung of EAC/Dox bearing mice, which were restored within 24 h. The level of liver Cu was observed to be inversely proportional to the level of GSH. Moreover, CuNG modulated SOD, CAT and GPx in different organs and thereby reduced oxidative stress. Thus nontoxic dose of CuNG may be utilized to reduce MRP1 expression and thus sensitize EAC/Dox cells to standard chemotherapy. Moreover, CuNG modulated SOD, CAT and and GPx activities to reduce oxidative stress in some vital organs of EAC/Dox bearing mice. CuNG treatment also helped to recover liver and renal function in EAC/Dox bearing mice. Based on our studies, we conclude that CuNG may be a promising candidate to sensitize drug resistant cancers in the clinic

Copper radical oxidases and related extracellular oxidoreductases of wood-decay Agaricomycetes

Science.gov (United States)

Phil Kersten; Dan Cullen

2014-01-01

Extracellular peroxide generation, a key component of oxidative lignocellulose degradation, has been attributed to various enzymes including the copper radical oxidases. Encoded by a family of structurally related sequences, the genes are widely distributed among wood decay fungi including three recently completed polypore genomes. In all cases, core catalytic residues...

Effects of neutron irradiation to 63 dpa on the properties of various commercial copper alloys

International Nuclear Information System (INIS)

Brager, H.R.

1985-04-01

High purity copper and six commercial copper alloys were neutron irradiated to 47 and 63 dpa at about 450 0 C in the FFTF. Immersion density measurements showed a wide range of swelling behavior after irradiation to 63 dpa. At one extreme was CuBe in the aged and tempered (AT) condition which had densified slightly. At the other extreme was 20% CW Cu-0.1% Ag which swelled over 45%. Electrical resistivity measurements followed trends similar to previously published results for the same alloys irradiated to 16 dpa: a continued change in conductivity with fluence which appears to relate to void formation, transmutation products and coarsening of second phase precipitates. These results were compared with electrical conductivity of unirradiated alloys examined after aging for 10,000 hours. The most irradiation resistant high-conductivity copper alloys examined after 63 dpa are A125 and MZC. Cu-2.0Be, only a moderate-conductivity alloy, exhibits very consistent irradiation resistant properties

Leaching of copper concentrates using NaCl and soluble copper contributed by the own concentrate; Lixiviacion de concentrados de cobre utilizando NaCl y el cobre soluble aportado por el propio concentrado

Energy Technology Data Exchange (ETDEWEB)

Herrero, O.; Bernal, N.; Quiroz, R.; Fuentes, G.; Vinals, J.

2005-07-01

Leaching of copper concentrates using cupric chloro complexes, generated in situ by the reaction between Cu(II), aported by the soluble copper content of the concentrate, and sodium chloride in acid media was studied. The concentrate samples were obtained from mineral processing plants from Antofagasta, Chile. Chemical and mineralogical characterization from original concentrates was made. Typical variable such as a chloride concentration, soluble copper concentration, leaching time, solid percentage and temperature were studied. DRX and EDS analyzed some of the residues. the experimental results indicated that it is possible to obtain solutions having high copper content (15 to 35 g/L) and 2 to 5 g/L free acid in order to submit this solution directly to a solvent extraction stage. The leaching tests use common reactive and low cost such as sodium chloride and sulfuric acid. (Author) 16 refs.

Water leaching of titanium from ore flotation residue.

Science.gov (United States)

Jaworska, Malgorzata M; Guibal, Eric

2003-01-01

Copper ore tailings were tested for the stability of titanium submitted to water leaching in three different reactor systems (agitated vessel, bioreactor and percolated fixed-bed column). For each of these systems, titanium extraction did not exceed 1% of the available metal. Biomass removed from ore residue adsorbed a small part of the titanium with sorption capacities below 20-30 mg g(-1), but most of this biomass was sequestered in the ore residue. Oxygen and carbon dioxide concentrations were monitored and changes in concentration correlated with bacteria development at the initial stage of the process and to fungal development in the latter stages.

Removal of heavy metals from aqueous solution by Carrot residues

International Nuclear Information System (INIS)

Eslamzadeh, T.; Nasernejad, B.; Bonakdar Pour, B.; Zamani, A.; Esmaail-Beygi, M.

2004-01-01

The removal of Copper(II), Zinc(II), and Chromium (III) from wastewater by carrot residues was investigated to evaluate cation exchange capacity. The effects of solution P H and co-ions were studied in batch experiments. Adsorption equilibria were initially rapidly established, and then decreased markedly after 10 min. Column experiments were carried out in a glass column filled with carrot residues to evaluate the metal removal capacity. The influences of the feed concentration and feed rate were also studied in order to compare the dynamic capacity for metal binding in different feed concentrations

Copper substrate as a catalyst for the oxidation of chemical vapor deposition-grown graphene

International Nuclear Information System (INIS)

Li, Zhiting; Zhou, Feng; Parobek, David; Shenoy, Ganesh J.; Muldoon, Patrick; Liu, Haitao

2015-01-01

We report the catalytic effect of copper substrate on graphene–oxygen reaction at high temperature. Previous studies showed that graphene grown on copper are mostly defect-free with strong oxidation resistance. We found that a freshly prepared copper-supported graphene sample can be completely oxidized in trace amount of oxygen (<3 ppm) at 600 °C within 2 h. Both X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) suggest that upon ambient air exposure, oxygen molecules diffuse into the space between graphene and copper, resulting in the formation of copper oxide which acts as catalytic sites for the graphene-oxygen reaction. This result has important implications for the characterization, processing, and storage of copper-supported graphene samples. - Graphical abstract: The copper substrate enhances the thermel oxidation of single-layer graphene. - Highlights: • A copper-supported graphene can be oxidized in Ar (O 2 <3 ppm, 600 °C, 2 h). • O 2 intercalates between graphene and copper upon exposure to air. • The copper foil should not be considered as an inert substrate

Effects of irradiation on the copper normal metal of a composite superconductor

International Nuclear Information System (INIS)

Williams, J.M.; Klabunde, C.E.; Redman, J.K.; Coltman, R.R. Jr.; Chaplin, R.L.

1978-01-01

This report presents a new body of magnetoresistance data for copper that were obtained in neutron irradiation experiments at 4K and 330K. These data are combined with previously obtained results on initial damage rates and saturation effects to yield a projection of total resistivity vs neutron dose (expressed in displacements per atom) for copper in service at < 10 K in a magnetic field

Corrosion resistance of a copper canister for spent nuclear fuel

International Nuclear Information System (INIS)

1983-04-01

The report presents an evaluation of copper as canister material for spent nuclear fuel. The evaluation is made from the viewpoint of corrosion and applies to a concept of 1977. Supplementary corrosion studies have been performed. The report includes 9 appendices which deal with experimental data. (G.B.)

Axenic aerobic biofilms inhibit corrosion of copper and aluminum.

Science.gov (United States)

Jayaraman, A; Ornek, D; Duarte, D A; Lee, C C; Mansfeld, F B; Wood, T K

1999-11-01

The corrosion behavior of unalloyed copper and aluminum alloy 2024 in modified Baar's medium has been studied with continuous reactors using electrochemical impedance spectroscopy. An axenic aerobic biofilm of either Pseudomonas fragi K or Bacillus brevis 18 was able to lessen corrosion as evidenced by a consistent 20-fold increase in the low-frequency impedance value of copper as well as by a consistent four- to seven-fold increase in the polarization resistance of aluminum 2024 after six days exposure compared to sterile controls. This is the first report of axenic aerobic biofilms inhibiting generalized corrosion of copper and aluminum. Addition of the representative sulfate-reducing bacterium (SRB) Desulfovibrio vulgaris (to simulate consortia corrosion behavior) to either the P. fragi K or B. brevis 18 protective biofilm on copper increased the corrosion to that of the sterile control unless antibiotic (ampicillin) was added to inhibit the growth of SRB in the biofilm.

Residual stress characterization of steel TIG welds by neutron diffraction and by residual magnetic stray field mappings

Science.gov (United States)

Stegemann, Robert; Cabeza, Sandra; Lyamkin, Viktor; Bruno, Giovanni; Pittner, Andreas; Wimpory, Robert; Boin, Mirko; Kreutzbruck, Marc

2017-03-01

The residual stress distribution of tungsten inert gas welded S235JRC+C plates was determined by means of neutron diffraction (ND). Large longitudinal residual stresses with maxima around 600 MPa were found. With these results as reference, the evaluation of residual stress with high spatial resolution GMR (giant magneto resistance) sensors was discussed. The experiments performed indicate a correlation between changes in residual stresses (ND) and the normal component of local residual magnetic stray fields (GMR). Spatial variations in the magnetic field strength perpendicular to the welds are in the order of the magnetic field of the earth.

Copper produced from powder by HIP to encapsulate nuclear fuel elements

International Nuclear Information System (INIS)

Ekbom, L.B.; Bogegaard, S.

1989-02-01

In the Swedish nuclear waste mangement program, nuclear fuel elements are proposed to be encapsulated in copper canisters. To fill the space between the fuel elements two methods have been proposed. Originally lead was proposed to be cast into the canister. According to a second method the space between the fuel rods is filled with copper powder and hot isostatic pressed (HIP) to seal the canister lid and to densify the powder to homogenous copper. This latter method has the advantage that each fuel rod is individually encapsulated in a very corrosion resistant material. This investigation was performed to find out to what extent pure copper powder can be hot isosatic pressed to full density and to achieve properties comparable to that of the oxygen free high conductivity (OFHC) copper of the canister. OFHC copper was molten under helium gas protection and atomized to a fine spherical powder in a pilot plant. The powder was transfered to a glove box with an argon atmosphere. The powder was filled into a steel container, which was evacuated and sealed. HIP was done at 550 degree C and 200 MPa for one hour. The resulting copper was found to have a good ductility and mechanical properties comparable to that of ordinary copper. The constant strainrate stress corrosion test used to test the canister copper showed that the HIP-ed copper has the same good properties as OFHC copper. (authors)

Impact of chlorinated disinfection on copper corrosion in hot water systems

Energy Technology Data Exchange (ETDEWEB)

Montes, J. Castillo [Centre Scientifique et Technique du Bâtiment Nantes, 11 rue Henri Picherit, BP 82341, 44323 Nantes Cedex 03 (France); Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Hamdani, F. [Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Creus, J., E-mail: jcreus@univ-lr.fr [Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Touzain, S. [Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Correc, O. [Centre Scientifique et Technique du Bâtiment Nantes, 11 rue Henri Picherit, BP 82341, 44323 Nantes Cedex 03 (France)

2014-09-30

Highlights: • Impact of disinfectant treatment on the durability of copper pipes. • Synergy between disinfectant concentration and temperature. • Pitting corrosion of copper associated to the corrosion products formation on copper. - Abstract: In France, hot water quality control inside buildings is occasionally ensured by disinfection treatments using temperature increases or addition of sodium hypochlorite (between 0.5 ppm and 1 ppm residual free chlorine). This disinfectant is a strong oxidiser and it could interact with metallic pipes usually used in hot water systems. This work deals with the study of the impact of these treatments on the durability of copper pipes. The objective of this work was to investigate the influence of sodium hypochlorite concentration and temperature on the copper corrosion mechanism. Copper samples were tested under dynamic and static conditions of ageing with sodium hypochlorite solutions ranging from 0 to 100 ppm with temperature at 50 °C and 70 °C. The efficiency of a corrosion inhibitor was investigated in dynamic conditions. Visual observations and analytical analyses of the internal surface of samples was studied at different ageing duration. Corrosion products were characterised by X-ray diffraction and Raman spectroscopy. Temperature and disinfectant were found to considerably affect the copper corrosion mechanism. Surprisingly, the corrosiveness of the solution was higher at lower temperatures. The temperature influences the nature of corrosion products. The protection efficiency is then strongly depend on the nature of the corrosion products formed at the surface of copper samples exposed to the aggressive solutions containing different concentration of disinfectant.

Computational Investigation of Effects of Grain Size on Ballistic Performance of Copper

Science.gov (United States)

He, Ge; Dou, Yangqing; Guo, Xiang; Liu, Yucheng

2018-01-01

Numerical simulations were conducted to compare ballistic performance and penetration mechanism of copper (Cu) with four representative grain sizes. Ballistic limit velocities for coarse-grained (CG) copper (grain size ≈ 90 µm), regular copper (grain size ≈ 30 µm), fine-grained (FG) copper (grain size ≈ 890 nm), and ultrafine-grained (UG) copper (grain size ≈ 200 nm) were determined for the first time through the simulations. It was found that the copper with reduced grain size would offer higher strength and better ductility, and therefore renders improved ballistic performance than the CG and regular copper. High speed impact and penetration behavior of the FG and UG copper was also compared with the CG coppers strengthened by nanotwinned (NT) regions. The comparison results showed the impact and penetration resistance of UG copper is comparable to the CG copper strengthened by NT regions with the minimum twin spacing. Therefore, besides the NT-strengthened copper, the single phase copper with nanoscale grain size could also be a strong candidate material for better ballistic protection. A computational modeling and simulation framework was proposed for this study, in which Johnson-Cook (JC) constitutive model is used to predict the plastic deformation of Cu; the JC damage model is to capture the penetration and fragmentation behavior of Cu; Bao-Wierzbicki (B-W) failure criterion defines the material's failure mechanisms; and temperature increase during this adiabatic penetration process is given by the Taylor-Quinney method.

X-ray diffraction investigation of self-annealing in nanocrystalline copper electrodeposits

DEFF Research Database (Denmark)

Pantleon, Karen; Somers, Marcel A. J.

2006-01-01

X-ray diffraction analysis and electrical resistivity measurements were conducted simultaneously for in-situ examination of self-annealing in copper electrodeposits. Considerable growth of the as-deposited nano-sized crystallites occurs with time and the crystallographic texture changes by multip...... twinning during self-annealing. The kinetics of self-annealing depends on the layer thickness as well as on the orientation and/or the size of the as-deposited crystallites. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.......X-ray diffraction analysis and electrical resistivity measurements were conducted simultaneously for in-situ examination of self-annealing in copper electrodeposits. Considerable growth of the as-deposited nano-sized crystallites occurs with time and the crystallographic texture changes by multiple...

Measurements of copper corrosion in the LOT Project at the Aespoe Hard Rock Laboratory

International Nuclear Information System (INIS)

Rosborg, B.; Karnland, O.; Quirk, G.; Werme, L.

2003-01-01

Real-time monitoring, of corrosion by means of electrochemical noise and other electrochemical techniques may offer interesting possibilities to estimate the kind and degree of corrosion in a sample or component, and further visualize the corrosion resistance of pure copper in repository environments. As a pilot effort, three cylindrical copper electrodes for such measurements, each of about 100 cm 2 surface area, have been installed in a test parcel in the Aespoe Hard Rock Laboratory and electrochemical measurements using InterCorr's SmartCET system were initiated in May 2001. The first results from real-time monitoring of copper corrosion in the Aespoe HRL under actual repository environment conditions by means of linear polarisation resistance, harmonic distortion analysis and electrochemical noise techniques are presented, and compared with the results obtained from one of the retrieved test parcels. (authors)

Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

Energy Technology Data Exchange (ETDEWEB)

Kwon, Young-Tae [Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588 (Korea, Republic of); Lee, Young-In [Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul 01811 (Korea, Republic of); Kim, Seil [Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588 (Korea, Republic of); Lee, Kun-Jae [Department of Energy Engineering, Dankook University, Cheonan 31116 (Korea, Republic of); Choa, Yong-Ho, E-mail: choa15@hanyang.ac.kr [Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588 (Korea, Republic of)

2017-02-28

Highlights: • Hydrogen thermally- and plasma- treatments are applied to reduce and sinter the inkjet-printed copper patterns at low temperature. • Plasma sintered Cu patterns have fully densified microstructure with the resistivity of 3.23 μW cm. • Cu conductive track with dense microstructure remains its electrical resistivity after 1 month. • Thermal sintered Cu patterns show a relatively poor microstructure and high resistivity. - Abstract: Low temperature sintering techniques are crucial in developing flexible printed electronics. In this work, we demonstrate a novel hydrogen plasma sintering method that achieves a full reduction and densification of inkjet-printed patterns using a copper complex ion ink. After inkjet printing on polyethylene terephthalate (PET) substrates, both hydrogen plasma and conventional hydrogen thermal treatment were employed to compare the resulting microstructures, electrical properties and anti-oxidation behavior. The plasma treated pattern shows a fully densified microstructure with a resistivity of 3.23 μΩ cm, while the thermally treated pattern shows a relatively poor microstructure and high resistivity. In addition, the hydrogen plasma-treated copper pattern retains its electrical resistivity for one month without any significant decrease. This novel hydrogen plasma sintering technique could be used to produce conductive patterns with excellent electrical properties, allowing for highly reliable flexible printed electronics.

Chemical modelling of trace elements in pore water from PFBC residues containing ammonia

International Nuclear Information System (INIS)

Karlsson, L.G.; Brandberg, F.

1993-01-01

Ammonia is added to the PFBC process with the purpose to reduce the emissions of NO x in the stack gases. The design of the system for cleaning the stack gases will lead to an increased adsorption of ammonia and an accumulation of soluble ammonium salts in the cyclone ash from PFBC processes. This can be an environmental problem since the amounts will increase over the coming years and there will be a need to dispose the residues. When infiltrating rainwater penetrates the disposed residues ammonia and ammonium salts result in a contamination of the pore water with ammonia in the disposed residues. This entail the solubility of several trace elements in the residues that form soluble complexes with ammonia will increase and cause an increased contamination of groundwater and surface water. In this study the increased solubilities is calculated for the trace elements cadmium, cobalt, copper, mercury, nickel, silver and zinc in the residues using thermodynamical data. The calculations have been performed with probable solid phases of the trace elements at oxidizing and reducing conditions as a function of pH and at varying concentration of ammonia in the pore water. The thermodynamic calculations have been performed with the geochemical code EQ3NR. The results from the calculations show that as a concentration of 17 mg NH 3 /l in the pore water of the residues increases the solubilities for copper and silver. If the concentration of ammonia increases to 170 mg NH 3 /l will the solubilities increase also for cadmium, nickel and zinc. (12 refs., 39 figs.)

Copper diffusion in Ti-Si-N layers formed by inductively coupled plasma implantation

International Nuclear Information System (INIS)

Ee, Y.C.; Chen, Z.; Law, S.B.; Xu, S.; Yakovlev, N.L.; Lai, M.Y.

2006-01-01

Ternary Ti-Si-N refractory barrier films of 15 nm thick was prepared by low frequency, high density, inductively coupled plasma implantation of N into Ti x Si y substrate. This leads to the formation of Ti-N and Si-N compounds in the ternary film. Diffusion of copper in the barrier layer after annealing treatment at various temperatures was investigated using time-of-flight secondary ion mass spectrometer (ToF-SIMS) depth profiling, X-ray diffractometer (XRD), field emission scanning electron microscopy (FESEM), energy dispersive X-ray (EDX) and sheet resistance measurement. The current study found that barrier failure did not occur until 650 deg. C annealing for 30 min. The failure occurs by the diffusion of copper into the Ti-Si-N film to form Cu-Ti and Cu-N compounds. FESEM surface morphology and EDX show that copper compounds were formed on the ridge areas of the Ti-Si-N film. The sheet resistance verifies the diffusion of Cu into the Ti-Si-N film; there is a sudden drop in the resistance with Cu compound formation. This finding provides a simple and effective method of monitoring Cu diffusion in TiN-based diffusion barriers

Copper and Copper Proteins in Parkinson’s Disease

Directory of Open Access Journals (Sweden)

Sergio Montes

2014-01-01

Full Text Available Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson’s disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson’s disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson’s disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson’s disease and that a mutation in ATP7B could be associated with Parkinson’s disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

Copper availability as related to soil copper fractions in oxisols under liming Calagem e os teores disponíveis e as frações de cobre em latossolos

Directory of Open Access Journals (Sweden)

Clístenes Williams Araújo do Nascimento

2003-02-01

Full Text Available The knowledge of the chemical forms of copper in soils and the relationships of these forms with soil copper availability are important for predicting the copper behavior in the soil-plant system. The present work studies the influence of liming on the available contents of copper as well as on the forms of copper fractions in six types of Oxisols. Soil samples, with and without liming, received copper at rates of 0.0, 20.0 and 40.0 mg dm-3 and remained incubated for 30 days. Then, available copper was extracted with Mehlich-1, Mehlich-3, DTPA and EDTA solutions, and analyzed by atomic absorption spectrophotometry. Additionally, soil samples were extracted in a sequential procedure to determine Cu in fractions of soil, as follows: exchangeable-Cu fraction, organic matter-Cu fraction, Mn oxide-Cu fraction, amorphous Fe oxide-Cu fraction, crystalline Fe oxide-Cu fraction, residual-Cu fraction, and the total Cu content in the soil. Soil samples to which Cu was added presented higher Cu retention in the organic matter fraction with a small percentage retained in the exchangeable-Cu fraction. Liming resulted in a decrease of Cu in the exchangeable and organic matter fractions and an increase in the Fe and Mn oxide fractions and in the residual fraction. Without liming, the organic matter fraction presented the highest contribution to Cu content found in the soil extracts obtained with all extractors, except EDTA. For treatments with liming, Cu contents in the organic matter fraction were better correlated to Cu contents in extracts obtained with DTPA and Mehlich-3.O conhecimento das formas químicas em que se encontra o cobre em solos, e suas relações com os teores disponíveis, são importantes para a previsão do seu comportamento no sistema solo-planta. Nesse sentido, este trabalho estuda a influência da calagem sobre os teores disponíveis e sobre o fracionamento de Cu em amostras de seis Latossolos. Essas amostras, submetidas ou não a

Copper alloys for high heat flux structure applications

International Nuclear Information System (INIS)

Zinkle, S.J.; Fabritsiev, S.A.

1994-01-01

The mechanical and physical properties of copper alloys are reviewed and compared with the requirements for high heat flux structural applications in fusion reactors. High heat flux structural materials must possess a combination of high thermal conductivity and high mechanical strength. The three most promising copper alloys at the present time are oxide dispersion-strengthened copper (Cu-Al 2 O 3 ) and two precipitation-hardened copper alloys (Cu-Cr-Zr and Cu-Ni-Be). These three alloys are capable of room temperature yield strengths >400 MPa and thermal conductivities up to 350 W/m-K. All of these alloys require extensive cold working to achieve their optimum strength. Precipitation-hardened copper alloys such Cu-Cr-Zr are susceptible to softening due to precipitate overaging and recrystallization during brazing, whereas the dislocation structure in Cu-Al 2 O 3 remains stabilized during typical high temperature brazing cycles. All three alloys exhibit good resistance to irradiation-induced softening and void swelling at temperatures below 300 degrees C. The precipitation-strengthened allows typically soften during neutron irradiation at temperatures above about 300 degrees C and therefore should only be considered for applications operating at temperatures 2 O 3 ) is considered to be the best candidate for high heat flux structural applications

Electric properties of polymeric nanocomposites filler with copper particles polymerized in situ by means of gamma radiation

International Nuclear Information System (INIS)

Poblete, V.H; Alvarez, M; Pilleux, M.E

2002-01-01

Different concentrations of copper metallic nanoparticles (80-120 diameter nm) were distributed in a methyl metacrilate (MMA) matrix. The polymerization of the mixture was carried out by means of gamma radiation using 16 kGy (2 kGy/hour) dose, applied in situ, obtaining an homogeneous and resistant mechanically samples. For comparison the same experience was carried out using 3,25-4,5 um of copper particles diameter. The morphology and the composite formation was studied by means of X-ray diffraction and scanning electronic microscopy for the different concentrations of the conductive metal into the polymeric matrix (5-30 vol. copper%). The electric resistance observed was analyzed in function of the distance between electric contacts. The strong lineal dependence show a homogeneous distribution of the metal in the composite. The specific resistivities obtained in function of the concentration of the conductive metal is in the range from the 12 to 42 Ωm for 10 vol.% concentrations. This results is in agreement with the threshold limit of the system. Also, the dependence of the resistivity with the particle size is showed (author)

Does Bt Corn Really Produce Tougher Residues

Science.gov (United States)

Bt corn hybrids produce insecticidal proteins that are derived from a bacterium, Bacillus thuringiensis. There have been concerns that Bt corn hybrids produce residues that are relatively resistant to decomposition. We conducted four experiments that examined the decomposition of corn residues und...

Recycling of copper used in fusion power plants

International Nuclear Information System (INIS)

Forty, C.B.A.; Butterworth, G.J.; Turner, A.D.; Junkison, A.J.

1997-04-01

One of the major safety and environmental advantages of fusion power is a limited waste management burden on future generations. In this connection, the ability to recycle end-of-service materials from fusion power plant is beneficial both in terms of the conservation of natural resources and the minimisation of the volumes of activated wastes. After 100 years, the residual activity of near-plasma copper components exceeds that permitted for free release or contact handling. The presence of silver as a common impurity in copper may exacerbate this problem, through generation of 108m Ag. Removal of the silver impurity in a separate refining step prior to use of the copper in a fusion plant obviates the problems associated with formation of 108m Ag. Two alternative desilveration processes have been demonstrated; one involving the segregation of silver as AgBr and the other the absorption of Ag + by ion exchange. The present study demonstrates that conventional electrorefining techniques can be adapted to recover used copper in a single refining stage, with sufficient decontamination to permit its reuse in fusion power plants or, with a second stage, unrestricted release. Shielding requirements for the processing of scrap copper in conventional hot cells indicate a decay storage period of 50-100 years. To maximise the cost of savings of reclamation over direct geological disposal, the activation products may be separated out and disposed of in a metallic form. A substantial reduction in the overall volume of active waste should thus be achievable, especially if supercompaction can be applied to the product. (Author)

Recycling of copper used in fusion power plants

International Nuclear Information System (INIS)

Butterworth, G.J.; Forty, C.B.A.

1998-01-01

One of the major safety and environmental advantages of fusion power is a limited waste management burden on future generations. In this connection, the ability to recycle end-of-service materials from fusion power plants is beneficial both in terms of the conservation of natural resources and the minimisation of the volume of activated wastes. After 100 years, the residual activity of near-plasma copper components exceeds that permitted for free release or contact handling. The presence of silver as a common impurity in copper may exacerbate this problem, through generation of 108m Ag. Removal of the silver impurity in a separate refining step prior to use of the copper in a fusion plant obviates the problems associated with formation of 108m Ag. Two alternative desilverisation processes have been demonstrated; one involving the segregation of silver as AgBr and the other the absorption of Ag + by ion exchange. The present study demonstrates that conventional electrorefining techniques can be adapted to recover used copper in a single refining stage, with sufficient decontamination to permit its reuse in fusion power plants or, with a second stage, unrestricted release. Shielding requirements for the processing of scrap copper in conventional hot cells indicate a decay storage period of 50-100 years. To maximise the cost savings of reclamation over direct geological disposal, the activation products may be separated out and disposed of in a metallic form. A substantial reduction in the overall volume of active waste should thus be achievable, especially if supercompaction can be applied to the product. (orig.)

The Extracellular Domain of Human High Affinity Copper Transporter (hNdCTR1), Synthesized by E. coli Cells, Chelates Silver and Copper Ions In Vivo.

Science.gov (United States)

Sankova, Tatiana P; Orlov, Iurii A; Saveliev, Andrey N; Kirilenko, Demid A; Babich, Polina S; Brunkov, Pavel N; Puchkova, Ludmila V

2017-11-03

There is much interest in effective copper chelators to correct copper dyshomeostasis in neurodegenerative and oncological diseases. In this study, a recombinant fusion protein for expression in Escherichia coli cells was constructed from glutathione-S-transferase (GST) and the N-terminal domain (ectodomain) of human high affinity copper transporter CTR1 (hNdCTR1), which has three metal-bound motifs. Several biological properties of the GST-hNdCTR1 fusion protein were assessed. It was demonstrated that in cells, the protein was prone to oligomerization, formed inclusion bodies and displayed no toxicity. Treatment of E. coli cells with copper and silver ions reduced cell viability in a dose- and time-dependent manner. Cells expressing GST-hNdCTR1 protein demonstrated resistance to the metal treatments. These cells accumulated silver ions and formed nanoparticles that contained AgCl and metallic silver. In this bacterial population, filamentous bacteria with a length of about 10 µm were often observed. The possibility for the fusion protein carrying extracellular metal binding motifs to integrate into the cell's copper metabolism and its chelating properties are discussed.

Copper carrier protein in copper toxic sheep liver

Energy Technology Data Exchange (ETDEWEB)

Harris, A L; Dean, P D.G.

1973-01-01

The livers of copper-toxic sheep have been analyzed by gel electrophoresis followed by staining the gels for copper with diethyldithiocarbamate and for protein with amido schwartz. These gels were compared with similar gels obtained from the livers of normal and copper-deficient animals. The copper-toxic livers contained an extra protein band which possessed relatively weakly bound copper. Possible origins of this protein are discussed. 8 references, 1 figure, 2 tables.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2014-05-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

International Nuclear Information System (INIS)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

2014-01-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

Origin and fate of copper in a small Mediterranean vineyard catchment: New insights from combined chemical extraction and δ{sup 65}Cu isotopic composition

Energy Technology Data Exchange (ETDEWEB)

El Azzi, D. [Université de Toulouse (France); INPT, UPS (France); Laboratoire Ecologie Fonctionnelle et Environnement (ECOLAB), ENSAT, Avenue de l' Agrobiopole, 31326 Castanet Tolosan Cedex (France); CNRS (France); ECOLAB, ENSAT, Avenue de l' Agrobiopole, 31326 Castanet Tolosan Cedex (France); Viers, J. [Université de Toulouse (France); UPS, Géosciences Environnement Toulouse (GET), 14, avenue Édouard Belin, Toulouse31400 (France); CNRS, IRD, CNES (France); GET, 14, avenue Édouard Belin, Toulouse 31400 (France); Guiresse, M.; Probst, A. [Université de Toulouse (France); INPT, UPS (France); Laboratoire Ecologie Fonctionnelle et Environnement (ECOLAB), ENSAT, Avenue de l' Agrobiopole, 31326 Castanet Tolosan Cedex (France); CNRS (France); ECOLAB, ENSAT, Avenue de l' Agrobiopole, 31326 Castanet Tolosan Cedex (France); Aubert, D. [Université de Perpignan Via Domitia, CEntre de Formation et de Recherche sur les Environnements Méditérranéens (CEFREM), UMR 5110, F-66860, Perpignan (France); CNRS, CEFREM, UMR 5110, F-66860, Perpignan (France); Caparros, J.; Charles, F.; Guizien, K. [CNRS, FRE 3350, LECOB, Observatoire Océanologique, F-66651 Banyuls/mer (France); UPMC Université Paris 6, FRE 3350, LECOB, Observatoire Océanologique, F-66651 Banyuls/mer (France); Probst, J.L., E-mail: jean-luc.probst@ensat.fr [Université de Toulouse (France); INPT, UPS (France); Laboratoire Ecologie Fonctionnelle et Environnement (ECOLAB), ENSAT, Avenue de l' Agrobiopole, 31326 Castanet Tolosan Cedex (France); CNRS (France); ECOLAB, ENSAT, Avenue de l' Agrobiopole, 31326 Castanet Tolosan Cedex (France)

2013-10-01

For centuries, many Mediterranean catchments were covered with vineyards in which copper was widely applied to protect grapevines against fungus. In the Mediterranean-type flow regime, brief and intense flood events increase the stream water discharge by up to 10 times and cause soil leaching and storm runoff. Because vineyards are primarily cultivated on steep slopes, high Cu fluxes are discharged by surface water runoff into the rivers. The purpose of this work was to investigate the riverine behavior and transport of anthropogenic Cu by coupling a sequential chemical extraction (SCE) procedure, used to determine Cu partitioning between residual and non-residual fractions, with δ{sup 65}Cu isotopic measurements in each fraction. In the Baillaury catchment, France, we sampled soils (cultivated and abandoned), river bed sediments (BS), suspended particulate matter (SPM), and river water during the flash flood event of February 2009. Copper partitioning using SCE show that most of Cu in abandoned vineyard soil was in the residual phase (> 60%) whereas in cultivated soil, BS and SPM, Cu was mostly (> 25%) in non-residual fractions, mainly adsorbed onto iron oxide fractions. A small fraction of Cu was associated with organic matter (5 to 10%). Calculated enrichment factors (EF) are higher than 2 and the anthropogenic contribution was estimated between 50 to 85%. Values for δ{sup 65}Cu in bulk samples were similar to bedrock therefore; δ{sup 65}Cu on SCE fractions of superficial soils and SPM allowed for discrimination between Cu origin and distribution. Copper in residual fractions was of natural mineral origin (δ{sup 65}Cu close to local bedrock, + 0.07‰). Copper in water soluble fraction of SPM (δ{sup 65}Cu = + 0.26‰) was similar to dissolved river Cu (δ{sup 65}Cu = + 0.31‰). Copper from fungicide treatment (δ{sup 65}Cu = − 0.35‰) was bound to organic matter (δ{sup 65}Cu = − 0.20‰) without or with slight isotopic fractioning. A preferential

Indoor residual spraying with a mixture of clothianidin (a neonicotinoid insecticide) and deltamethrin provides improved control and long residual activity against pyrethroid resistant Anopheles gambiae sl in Southern Benin.

OpenAIRE

Ngufor, C; Fongnikin, A; Rowland, M; N'Guessan, R

2017-01-01

There is an urgent need for new insecticides for indoor residual spraying (IRS) which can provide improved and prolonged control of malaria vectors that have developed resistance to existing insecticides. The neonicotinoid, clothianidin represents a class of chemistry new to public health. Clothianidin acts as an agonist on nicotinic acetyl choline receptors. IRS with a mixture of Clothianidin and another WHO approved insecticide such as deltamethrin could provide improved control of insectic...

Automatic residue removal for high-NA extreme illumination

Science.gov (United States)

Moon, James; Nam, Byong-Sub; Jeong, Joo-Hong; Kong, Dong-Ho; Nam, Byung-Ho; Yim, Dong Gyu

2007-10-01

An epidemic for smaller node has been that, as the device architecture shrinks, lithography process requires high Numerical Aperture (NA), and extreme illumination system. This, in turn, creates many lithography problems such as low lithography process margin (Depth of Focus, Exposure Latitude), unstable Critical Dimension (CD) uniformity and restricted guideline for device design rule and so on. Especially for high NA, extreme illumination such as immersion illumination systems, above all the related problems, restricted design rule due to forbidden pitch is critical and crucial issue. This forbidden pitch is composed of numerous optical effects but majority of these forbidden pitch compose of photo resist residue and these residue must be removed to relieve some room for already tight design rule. In this study, we propose automated algorithm to remove photo resist residue due to high NA and extreme illumination condition. This algorithm automatically self assembles assist patterns based on the original design layout, therefore insuring the safety and simplicity of the generated assist pattern to the original design and removes any resist residue created by extreme illumination condition. Also we tested our automated algorithm on full chip FLASH memory device and showed the residue removal effect by using commercial verification tools as well as on actual test wafer.

Copper current collectors reduce long-term fouling of air cathodes in microbial fuel cells

KAUST Repository

Myung, Jaewook; Yang, Wulin; Saikaly, Pascal; Logan, Bruce E

2018-01-01

Long-term operation of wastewater-fed, microbial fuel cells (MFCs) with cathodes made of activated carbon and stainless steel (SS) current collectors can result in decreased performance due to cathode fouling. Copper has good antimicrobial properties, and it is more electrically conductive than SS. To demonstrate that a copper current collector could produce a more fouling resistant cathode, MFCs with air cathodes using either SS or copper current collectors were operated using domestic wastewater for 27 weeks. The reduction in biofouling over time was shown by less biofilm formation on the copper cathode surface compared to SS cathodes, due to the antimicrobial properties of copper. Maximum power densities from 17–27 weeks were 440 ± 38 mW/m2 using copper and 370 ± 21 mW/m2 using SS cathodes. The main difference in the microbial community was a nitrifying community on the SS cathodes, which was not present on the copper cathodes.

Copper current collectors reduce long-term fouling of air cathodes in microbial fuel cells

KAUST Repository

Myung, Jaewook

2018-02-05

Long-term operation of wastewater-fed, microbial fuel cells (MFCs) with cathodes made of activated carbon and stainless steel (SS) current collectors can result in decreased performance due to cathode fouling. Copper has good antimicrobial properties, and it is more electrically conductive than SS. To demonstrate that a copper current collector could produce a more fouling resistant cathode, MFCs with air cathodes using either SS or copper current collectors were operated using domestic wastewater for 27 weeks. The reduction in biofouling over time was shown by less biofilm formation on the copper cathode surface compared to SS cathodes, due to the antimicrobial properties of copper. Maximum power densities from 17–27 weeks were 440 ± 38 mW/m2 using copper and 370 ± 21 mW/m2 using SS cathodes. The main difference in the microbial community was a nitrifying community on the SS cathodes, which was not present on the copper cathodes.

Cellular membrane accommodation of copper-induced oxidative conditions in the coral Seriatopora caliendrum

Energy Technology Data Exchange (ETDEWEB)

Tang, Chuan-Ho, E-mail: chtang@nmmba.gov.tw [Institute of Marine Biodiversity and Evolutionary Biology, National Dong Hwa University, Pingtung, Taiwan, ROC (China); National Museum of Marine Biology and Aquarium, Pingtung, Taiwan, ROC (China); Lin, Ching-Yu [Institute of Environmental Health, National Taiwan University, Taipei City, Taiwan, ROC (China); Lee, Shu-Hui [Center of General Education, National Kaohsiung Marine University, Kaohsiung, Taiwan, ROC (China); Wang, Wei-Hsien [National Museum of Marine Biology and Aquarium, Pingtung, Taiwan, ROC (China); Department of Marine Biotechnology and Resources and Asia-Pacific Ocean Research Center, National Sun Yat-sen University, Kaohsiung, Taiwan, ROC (China)

2014-03-01

Highlights: • Coral cells alter membrane lipid to accommodate copper-induce oxidative conditions • Coral membrane repair occur due to lipid alterations • Zooxanthellae release results from membrane repair by symbiosome fusion • Copper-induced lipid alterations perturb membrane-related functions in coral cells • Copper chronic effect on coral fitness are related to long-term membrane perturbation - Abstract: Oxidative stress has been associated with copper-induced toxicity in scleractinian corals. To gain insight into the accommodation of the cellular membrane to oxidative conditions, a pocilloporid coral, Seriatopora caliendrum, was exposed to copper at distinct, environmentally relevant dose for various lengths of time. Glycerophosphocholine profiling of the response of the coral to copper exposure was characterized using a validated method. The results indicate that coral lipid metabolism is programmed to induce membrane alterations in response to the cellular deterioration that occurs during the copper exposure period. Decreasing lyso-phosphatidylcholines and exchanging polyunsaturated phosphatidylcholines for polyunsaturated plasmanylcholines were the initial actions taken to prevent membrane permeabilization. To relax/resist the resulting membrane strain caused by cell/organelle swelling, the coral cells inversely exchanged polyunsaturated plasmanylcholines for polyunsaturated phosphatidylcholines and further increased the levels of monounsaturated glycerophosphocholines. At the same time, the levels of saturated phosphatidylcholines were also increased to increase membrane rigidity and protect against oxidative attack. Interestingly, such alterations in lipid metabolism were also required for membrane fusion to repair the deteriorated membranes by repopulating them with proximal lipid reservoirs, similar to symbiosome membranes. Additionally, increasing saturated and monounsaturated plasmanylcholines and inhibiting the suppression of saturated lyso

Cellular membrane accommodation of copper-induced oxidative conditions in the coral Seriatopora caliendrum

International Nuclear Information System (INIS)

Tang, Chuan-Ho; Lin, Ching-Yu; Lee, Shu-Hui; Wang, Wei-Hsien

2014-01-01

Highlights: • Coral cells alter membrane lipid to accommodate copper-induce oxidative conditions • Coral membrane repair occur due to lipid alterations • Zooxanthellae release results from membrane repair by symbiosome fusion • Copper-induced lipid alterations perturb membrane-related functions in coral cells • Copper chronic effect on coral fitness are related to long-term membrane perturbation - Abstract: Oxidative stress has been associated with copper-induced toxicity in scleractinian corals. To gain insight into the accommodation of the cellular membrane to oxidative conditions, a pocilloporid coral, Seriatopora caliendrum, was exposed to copper at distinct, environmentally relevant dose for various lengths of time. Glycerophosphocholine profiling of the response of the coral to copper exposure was characterized using a validated method. The results indicate that coral lipid metabolism is programmed to induce membrane alterations in response to the cellular deterioration that occurs during the copper exposure period. Decreasing lyso-phosphatidylcholines and exchanging polyunsaturated phosphatidylcholines for polyunsaturated plasmanylcholines were the initial actions taken to prevent membrane permeabilization. To relax/resist the resulting membrane strain caused by cell/organelle swelling, the coral cells inversely exchanged polyunsaturated plasmanylcholines for polyunsaturated phosphatidylcholines and further increased the levels of monounsaturated glycerophosphocholines. At the same time, the levels of saturated phosphatidylcholines were also increased to increase membrane rigidity and protect against oxidative attack. Interestingly, such alterations in lipid metabolism were also required for membrane fusion to repair the deteriorated membranes by repopulating them with proximal lipid reservoirs, similar to symbiosome membranes. Additionally, increasing saturated and monounsaturated plasmanylcholines and inhibiting the suppression of saturated lyso

Electrokinetic remediation of copper mine tailings

DEFF Research Database (Denmark)

Hansen, Henrik K.; Rojo, Adrián; Ottosen, Lisbeth M.

2007-01-01

Important process parameters to optimize in electrokinetic soil remediation are those influencing remediation time and power consumption since these directly affect the cost of a remediation action. This work shows how the electrokinetic remediation (EKR) process could be improved by implementing...... bipolar electrodes in the porous material. The bipolar electrodes in EKR meant two improvements: (1) a shorter migration pathway for the contaminant, and (2) an increased electrical conductivity in the remediation system. All together the remediation proceeded faster with lower electrical resistance than...... in similar experiments but without the bipolar electrodes. The new electrokinetic remediation design was tested on copper mine tailings with different applied electric fields, remediation times and pre-treatment. The results showed that the copper removal was increased from 8% (applying 20V for 8 days...

Efficient removal of copper from wastewater by using mechanically activated calcium carbonate.

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Hu, Huimin; Li, Xuewei; Huang, Pengwu; Zhang, Qiwu; Yuan, Wenyi

2017-12-01

Copper removal from aqueous solution is necessary from the stances of both environmental protection and copper resource recycling. It is important to develop a new chemical precipitation method suitable for removing copper particularly at low concentration as the case of waste mine water, with regards to the various problems related to the current precipitation methods by using strong alkalis or soluble sulfides. In this research, we studied a possible chemical precipitation of copper ions at concentration around 60 mg/L or lower by cogrinding copper sulfate in water with calcium carbonate (CaCO 3 ) using wet stirred ball milling. With the aid of ball milling, copper precipitation as a basic sulfate (posnjakite: Cu 4 (SO 4 ) (OH) 6 ·H 2 O) occurred at a very high copper removal rate of 99.76%, to reduce the residual copper concentration in the solution less than 0.5 mg/L, reaching the discharge limit, even with the addition amount of CaCO 3 as a stoichiometric ratio of CaCO 3 /Cu 2+ at 1:1. It is more interesting to notice that, at the same conditions, other heavy metals such as Ni, Mn, Zn and Cd do not precipitate obviously just with CaCO 3 addition at CaCO 3 /M 2+ at 1:1 so that the precipitate without the impurities can be processed as good source to recover copper. This newly proposed concept can be further developed to treat wastewaters with other metals to serve both purposes of environmental purification and resource recovery in a similar way. Copyright © 2017 Elsevier Ltd. All rights reserved.

Pyruvic oxime nitrification and copper and nickel resistance by a Cupriavidus pauculus, an active heterotrophic nitrifier-denitrifier.

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Ramirez, Miguel; Obrzydowski, Jennifer; Ayers, Mary; Virparia, Sonia; Wang, Meijing; Stefan, Kurtis; Linchangco, Richard; Castignetti, Domenic

2014-01-01

Heterotrophic nitrifiers synthesize nitrogenous gasses when nitrifying ammonium ion. A Cupriavidus pauculus, previously thought an Alcaligenes sp. and noted as an active heterotrophic nitrifier-denitrifier, was examined for its ability to produce nitrogen gas (N2) and nitrous oxide (N2O) while heterotrophically nitrifying the organic substrate pyruvic oxime [CH3-C(NOH)-COOH]. Neither N2 nor N2O were produced. Nucleotide and phylogenetic analyses indicated that the organism is a member of a genus (Cupriavidus) known for its resistance to metals and its metabolism of xenobiotics. The microbe (a Cupriavidus pauculus designated as C. pauculus strain UM1) was examined for its ability to perform heterotrophic nitrification in the presence of Cu(2+) and Ni(2+) and to metabolize the xenobiotic phenol. The bacterium heterotrophically nitrified well when either 1 mM Cu(2+) or 0.5 mM Ni(2+) was present in either enriched or minimal medium. The organism also used phenol as a sole carbon source in either the presence or absence of 1 mM Cu(2+) or 0.5 mM Ni(2+). The ability of this isolate to perform a number of different metabolisms, its noteworthy resistance to copper and nickel, and its potential use as a bioremediation agent are discussed.

Copper removal and microbial community analysis in single-chamber microbial fuel cell.

Science.gov (United States)

Wu, Yining; Zhao, Xin; Jin, Min; Li, Yan; Li, Shuai; Kong, Fanying; Nan, Jun; Wang, Aijie

2018-04-01

In this study, copper removal and electricity generation were investigated in a single-chamber microbial fuel cell (MFC). Result showed that copper was efficiently removed in the membrane-less MFC with removal efficiency of 98.3% at the tolerable Cu 2+ concentration of 12.5 mg L -1 , the corresponding open circuit voltage and maximum power density were 0.78 V and 10.2 W m -3 , respectively. The mechanism analysis demonstrated that microbial electrochemical reduction contributed to the copper removal with the products of Cu and Cu 2 O deposited at biocathode. Moreover, the microbial community analysis indicated that microbial communities changed with different copper concentrations. The dominant phyla were Proteobacteria and Bacteroidetes which could play key roles in electricity generation, while Actinobacteria and Acidobacteria were also observed which were responsible for Cu-resistant and copper removal. It will be of important guiding significance for the recovery of copper from low concentration wastewater through single-chamber MFC with simultaneous energy recovery. Copyright © 2018 Elsevier Ltd. All rights reserved.

Examination of Critical Length Effect in Copper Interconnects With Oxide and Low-k Dielectrics

International Nuclear Information System (INIS)

Thrasher, Stacye; Gall, Martin; Justison, Patrick; Hernandez, Richard; Kawasaki, Hisao; Capasso, Cristiano; Nguyen, Timothy

2004-01-01

As technology moves toward faster microelectronic devices with smaller feature sizes, copper is replacing aluminum-copper alloy and low-k dielectric is replacing oxide as the materials of choice for advanced interconnect integrations. Copper not only brings to the table the advantage of lower resistivity, but also exhibits better electromigration performance when compared to Al(Cu). Low-k dielectric materials are advantageous because they reduce power consumption and improve signal delay. Due to these advantages, the industry trend is moving towards integrating copper and low-k dielectric for high performance interconnects. The purpose of this study is to evaluate the critical length effect in single-inlaid copper interconnects and determine the critical product (jl)c, for a variety of integrations, examining the effect of ILD (oxide vs. low-k), geometry, and stress temperature

Copper (II) complexes of bidentate ligands exhibit potent anti-cancer activity regardless of platinum sensitivity status.

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Wehbe, Mohamed; Lo, Cody; Leung, Ada W Y; Dragowska, Wieslawa H; Ryan, Gemma M; Bally, Marcel B

2017-12-01

Insensitivity to platinum, either through inherent or acquired resistance, is a major clinical problem in the treatment of many solid tumors. Here, we explored the therapeutic potential of diethyldithiocarbamate (DDC), pyrithione (Pyr), plumbagin (Plum), 8-hydroxyquinoline (8-HQ), clioquinol (CQ) copper complexes in a panel of cancer cell lines that differ in their sensitivity to platins (cisplatin/carboplatin) using a high-content imaging system. Our data suggest that the copper complexes were effective against both platinum sensitive (IC 50  ~ 1 μM platinum) and insensitive (IC 50  > 5 μM platinum) cell lines. Furthermore, copper complexes of DDC, Pyr and 8-HQ had greater therapeutic activity compared to the copper-free ligands in all cell lines; whereas the copper-dependent activities of Plum and CQ were cell-line specific. Four of the copper complexes (Cu(DDC) 2 , Cu(Pyr) 2 , Cu(Plum) 2 and Cu(8-HQ) 2 ) showed IC 50 values less than that of cisplatin in all tested cell lines. The complex copper DDC (Cu(DDC) 2 ) was selected for in vivo evaluation due to its low nano-molar range activity in vitro and the availability of an injectable liposomal formulation. Liposomal (Cu(DDC) 2 ) was tested in a fast-growing platinum-resistant A2780-CP ovarian xenograft model and was found to achieve a statistically significant reduction (50%; p < 0.05) in tumour size. This work supports the potential use of copper-based therapeutics to treat cancers that are insensitive to platinum drugs.

Do antibiotic residues in soils play a role in amplification and transmission of antibiotic resistant bacteria in cattle populations?

Directory of Open Access Journals (Sweden)

Douglas Ruben Call

2013-07-01

Full Text Available When we consider factors that contribute to the emergence, amplification, and persistence of antibiotic resistant bacteria, the conventional assumption is that antibiotic use is the primary driver in these processes and that selection occurs primarily in the patient or animal. Evidence suggests that this may not always be the case. Experimental trials show that parenteral administration of a third-generation cephalosporin (ceftiofur in cattle has limited or short-term effects on the prevalence of ceftiofur-resistant bacteria in the gastrointestinal tract. While this response may be sufficient to explain a pattern of widespread resistance to cephalosporins, approximately two-thirds of ceftiofur metabolites are excreted in the urine raising the possibility that environmental selection plays an important additive role in the amplification and maintenance of antibiotic resistant E. coli on farms. Consequently, we present a rationale for an environmental selection hypothesis whereby excreted antibiotic residues such as ceftiofur are a significant contributor to the proliferation of antibiotic resistant bacteria in food animal systems. We also present a mathematical model of our hypothesized system as a guide for designing experiments to test this hypothesis. If supported for antibiotics such as ceftiofur, then there may be new approaches to combat the proliferation of antibiotic resistance beyond the prudent use mantra.

Compressive Residual Strains in Mineral Nanoparticles as a Possible Origin of Enhanced Crack Resistance in Human Tooth Dentin.

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Forien, Jean-Baptiste; Fleck, Claudia; Cloetens, Peter; Duda, Georg; Fratzl, Peter; Zolotoyabko, Emil; Zaslansky, Paul

2015-06-10

The tough bulk of dentin in teeth supports enamel, creating cutting and grinding biostructures with superior failure resistance that is not fully understood. Synchrotron-based diffraction methods, utilizing micro- and nanofocused X-ray beams, reveal that the nm-sized mineral particles aligned with collagen are precompressed and that the residual strains vanish upon mild annealing. We show the link between the mineral nanoparticles and known damage propagation trajectories in dentin, suggesting a previously overlooked compression-mediated toughening mechanism.

Effect of red mud addition on tetracycline and copper resistance genes and microbial community during the full scale swine manure composting.

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Wang, Rui; Zhang, Junya; Sui, Qianwen; Wan, Hefeng; Tong, Juan; Chen, Meixue; Wei, Yuansong; Wei, Dongbin

2016-09-01

Swine manure has been considered as the reservoir of antibiotic resistance genes (ARGs). Composting is one of the most suitable technologies for treating livestock manures, and red mud was proved to have a positive effect on nitrogen conservation during composting. This study investigated the abundance of eight tetracycline and three copper resistance genes, the bacterial community during the full scale swine manure composting with or without addition of red mud. The results showed that ARGs in swine manure could be effectively removed through composting (reduced by 2.4log copies/g TS), especially during the thermophilic phase (reduced by 1.5log copies/g TS), which the main contributor might be temperature. Additionally, evolution of bacterial community could also have a great influence on ARGs. Although addition of red mud could enhance nitrogen conservation, it obviously hindered removal of ARGs (reduced by 1.7log copies/g TS) and affected shaping of bacterial community during composting. Copyright © 2016 Elsevier Ltd. All rights reserved.

Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

Science.gov (United States)

Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

2014-11-04

Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

Corrosion resisting properties of 90/10 copper-nickel-iron alloy with particular reference to offshore oil and gas applications

Energy Technology Data Exchange (ETDEWEB)

Gilbert, P T

1979-01-01

The use of a copper-nickel-iron alloy for seawater pipeline systems and various other applications on offshore oil and gas platforms is now proving attractive, according to the UK's Yorkshire Imperial Metals Ltd. The alloy has already proved a useful and reliable material in many applications: It has given good results in seawater-cooled condensers and heat exchangers and seawater piping systems, in power stations, ships, desalination plant, and refrigeration service. Its antifouling and corrosion-resistant properties are valuable in these applications. The main limitations that have to be observed in its use are (1) the design, construction, and operation of systems within prescribed velocity and turbulence limits, to avoid the occurrence of impingement attack, and (2) problems that may arise because of badly polluted seawater.

Utilization of Copper Alloys for Marine Applications

Science.gov (United States)

Drach, Andrew

Utilization of copper alloy components in systems deployed in marine environment presents potential improvements by reducing maintenance costs, prolonging service life, and increasing reliability. However, integration of these materials faces technological challenges, which are discussed and addressed in this work, including characterization of material performance in seawater environment, hydrodynamics of copper alloy components, and design procedures for systems with copper alloys. To characterize the hydrodynamic behavior of copper alloy nets, mesh geometry of the major types of copper nets currently used in the marine aquaculture are analyzed and formulae for the solidity and strand length are proposed. Experimental studies of drag forces on copper alloy net panels are described. Based on these studies, empirical values for normal drag coefficients are proposed for various types of copper netting. These findings are compared to the previously published data on polymer nets. It is shown that copper nets exhibit significantly lower resistance to normal currents, which corresponds to lower values of normal drag coefficient. The seawater performance (corrosion and biofouling) of copper alloys is studied through the field trials of tensioned and untensioned specimens in a one-year deployment in the North Atlantic Ocean. The corrosion behavior is characterized by weight loss, optical microscopy, and SEM/EDX analyses. The biofouling performance is quantified in terms of the biomass accumulation. To estimate the effects of stray electrical currents on the seawater corrosion measurements, a low cost three-axis stray electric current monitoring device is designed and tested both in the lab and in the 30-day field deployment. The system consists of a remotely operated PC with a set of pseudo-electrodes and a digital compass. The collected data is processed to determine magnitudes of AC and DC components of electric field and dominant AC frequencies. Mechanical behavior of

Heavy metals in liquid pig manure in light of bacterial antimicrobial resistance

Energy Technology Data Exchange (ETDEWEB)

Hoelzel, Christina S., E-mail: Christina.Hoelzel@wzw.tum.de [Chair of Animal Hygiene, Technische Universitaet Muenchen, Weihenstephaner Berg 3, 85354 Freising (Germany); Mueller, Christa [Institute for Agroecology, Organic Farming and Soil Protection, Bavarian State Research Center for Agriculture (LfL), Lange Point 12, 85354 Freising (Germany); Harms, Katrin S. [Chair of Animal Hygiene, Technische Universitaet Muenchen, Weihenstephaner Berg 3, 85354 Freising (Germany); Mikolajewski, Sabine [Department for Quality Assurance and Analytics, Bavarian State Research Center for Agriculture (LfL), Lange Point 4, 85354 Freising (Germany); Schaefer, Stefanie; Schwaiger, Karin; Bauer, Johann [Chair of Animal Hygiene, Technische Universitaet Muenchen, Weihenstephaner Berg 3, 85354 Freising (Germany)

2012-02-15

Heavy metals are regularly found in liquid pig manure, and might interact with bacterial antimicrobial resistance. Concentrations of heavy metals were determined by atomic spectroscopic methods in 305 pig manure samples and were connected to the phenotypic resistance of Escherichia coli (n=613) against 29 antimicrobial drugs. Concentrations of heavy metals (/kg dry matter) were 0.08-5.30 mg cadmium, 1.1-32.0 mg chrome, 22.4-3387.6 mg copper, <2.0-26.7 mg lead, <0.01-0.11 mg mercury, 3.1-97.3 mg nickel and 93.0-8239.0 mg zinc. Associated with the detection of copper and zinc, resistance rates against {beta}-lactams were significantly elevated. By contrast, the presence of mercury was significantly associated with low antimicrobial resistance rates of Escherichia coli against {beta}-lactams, aminoglycosides and other antibiotics. Effects of subinhibitory concentrations of mercury on bacterial resistance against penicillins, cephalosporins, aminoglycosides and doxycycline were also demonstrated in a laboratory trial. Antimicrobial resistance in the porcine microflora might be increased by copper and zinc. By contrast, the occurrence of mercury in the environment might, due to co-toxicity, act counter-selective against antimicrobial resistant strains.

Advanced Copper Composites Against Copper-Tolerant Xanthomonas perforans and Tomato Bacterial Spot.

Science.gov (United States)

Strayer-Scherer, A; Liao, Y Y; Young, M; Ritchie, L; Vallad, G E; Santra, S; Freeman, J H; Clark, D; Jones, J B; Paret, M L

2018-02-01

Bacterial spot, caused by Xanthomonas spp., is a widespread and damaging bacterial disease of tomato (Solanum lycopersicum). For disease management, growers rely on copper bactericides, which are often ineffective due to the presence of copper-tolerant Xanthomonas strains. This study evaluated the antibacterial activity of the new copper composites core-shell copper (CS-Cu), multivalent copper (MV-Cu), and fixed quaternary ammonium copper (FQ-Cu) as potential alternatives to commercially available micron-sized copper bactericides for controlling copper-tolerant Xanthomonas perforans. In vitro, metallic copper from CS-Cu and FQ-Cu at 100 μg/ml killed the copper-tolerant X. perforans strain within 1 h of exposure. In contrast, none of the micron-sized copper rates (100 to 1,000 μg/ml) from Kocide 3000 significantly reduced copper-tolerant X. perforans populations after 48 h of exposure compared with the water control (P copper-based treatments killed the copper-sensitive X. perforans strain within 1 h. Greenhouse studies demonstrated that all copper composites significantly reduced bacterial spot disease severity when compared with copper-mancozeb and water controls (P copper composites significantly reduced disease severity when compared with water controls, using 80% less metallic copper in comparison with copper-mancozeb in field studies (P copper composites have the potential to manage copper-tolerant X. perforans and tomato bacterial spot.

Cost-benefit analysis of copper recovery in remediation projects: A case study from Sweden.

Science.gov (United States)

Volchko, Yevheniya; Norrman, Jenny; Rosén, Lars; Karlfeldt Fedje, Karin

2017-12-15

Contamination resulting from past industrial activity is a problem throughout the world and many sites are severely contaminated by metals. Advances in research in recent years have resulted in the development of technologies for recovering metal from metal-rich materials within the framework of remediation projects. Using cost-benefit analysis (CBA), and explicitly taking uncertainties into account, this paper evaluates the potential social profitability of copper recovery as part of four remediation alternatives at a Swedish site. One alternative involves delivery of copper-rich ash to a metal production company for refining. The other three alternatives involve metal leaching from materials and sale of the resulting metal sludge for its further processing at a metal production company using metallurgical methods. All the alternatives are evaluated relative to the conventional excavation and disposal method. Metal recovery from the ash, metal sludge sale, and disposal of the contaminated soil and the ash residue at the local landfill site, was found to be the best remediation alternative. However, given the present conditions, its economic potential is low relative to the conventional excavation and disposal method but higher than direct disposal of the copper-rich ash for refining. Volatile copper prices, the high cost of processing equipment, the highly uncertain cost of the metal leaching and washing process, coupled with the substantial project risks, contribute most to the uncertainties in the CBA results for the alternatives involving metal leaching prior to refining. However, investment in processing equipment within the framework of a long-term investment project, production of safe, reusable soil residue, and higher copper prices on the metal market, can make metal recovery technology socially profitable. Copyright © 2017 Elsevier B.V. All rights reserved.

Expeditious low-temperature sintering of copper nanoparticles with thin defective carbon shells

Science.gov (United States)

Kim, Changkyu; Lee, Gyoungja; Rhee, Changkyu; Lee, Minku

2015-04-01

The realization of air-stable nanoparticles, well-formulated nanoinks, and conductive patterns based on copper is a great challenge in low-cost and large-area flexible printed electronics. This work reports the synthesis of a conductively interconnected copper structure via thermal sintering of copper inks at a low temperature for a short period of time, with the help of thin defective carbon shells coated onto the copper nanoparticles. Air-stable copper/carbon core/shell nanoparticles (typical size ~23 nm, shell thickness ~1.0 nm) are prepared by means of an electric explosion of wires. Gaseous oxidation of the carbon shells with a defective structure occurs at 180 °C, impacting the choice of organic solvents as well as the sintering conditions to create a crucial neck formation. Isothermal oxidation and reduction treatment at 200 °C for only about 10 min yields an oxide-free copper network structure with an electrical resistivity of 25.1 μΩ cm (14.0 μΩ cm at 250 °C). Finally, conductive copper line patterns are achieved down to a 50 μm width with an excellent printing resolution (standard deviation ~4.0%) onto a polyimide substrate using screen printing of the optimized inks.The realization of air-stable nanoparticles, well-formulated nanoinks, and conductive patterns based on copper is a great challenge in low-cost and large-area flexible printed electronics. This work reports the synthesis of a conductively interconnected copper structure via thermal sintering of copper inks at a low temperature for a short period of time, with the help of thin defective carbon shells coated onto the copper nanoparticles. Air-stable copper/carbon core/shell nanoparticles (typical size ~23 nm, shell thickness ~1.0 nm) are prepared by means of an electric explosion of wires. Gaseous oxidation of the carbon shells with a defective structure occurs at 180 °C, impacting the choice of organic solvents as well as the sintering conditions to create a crucial neck formation

Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate

Directory of Open Access Journals (Sweden)

Jiushuai Xu

2014-04-01

Full Text Available Copper films were grown on (3-Mercaptopropyltrimethoxysilane (MPTMS, (3-Aminopropyltriethoxysilane (APTES and 6-(3-(triethoxysilylpropylamino-1,3,5- triazine-2,4-dithiol monosodium (TES self-assembled monolayers (SAMs modified acrylonitrile-butadiene-styrene (ABS substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM and X-ray diffraction (XRD. Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111 preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.

Effect of grain size on corrosion of nanocrystalline copper in NaOH solution

International Nuclear Information System (INIS)

Luo Wei; Xu Yimin; Wang Qiming; Shi Peizhen; Yan Mi

2010-01-01

Research highlights: → Coppers display an active-passive-transpassive behaviour with duplex passive film. → Grain size variation has little effect on the overall corrosion behaviour of Cu. → Little effect on corrosion may be due to duplex passivation in NaOH solution. → Bulk nanocrystalline Cu show bamboo-like flake corrosion structure. - Abstract: Effect of grain size on corrosion of bulk nanocrystalline copper was investigated using potentiodynamic polarization measurements in 0.1 M NaOH solution. Bulk nanocrystalline copper was prepared by inert gas condensation and in situ warm compress (IGCWC) method. The grain sizes of all bulk nanocrystalline samples were determined to be 48, 68 and 92 nm using X-ray diffraction (XRD). Results showed that bulk coppers displayed an active-passive-transpassive behaviour with duplex passive films. From polycrystalline to nanocrystalline, grain size variation showed little effect on the overall corrosion resistance of copper samples.

Copper as a target for prostate cancer therapeutics: copper-ionophore pharmacology and altering systemic copper distribution

Science.gov (United States)

Denoyer, Delphine; Pearson, Helen B.; Clatworthy, Sharnel A.S.; Smith, Zoe M.; Francis, Paul S.; Llanos, Roxana M.; Volitakis, Irene; Phillips, Wayne A.; Meggyesy, Peter M.; Masaldan, Shashank; Cater, Michael A.

2016-01-01

Copper-ionophores that elevate intracellular bioavailable copper display significant therapeutic utility against prostate cancer cells in vitro and in TRAMP (Transgenic Adenocarcinoma of Mouse Prostate) mice. However, the pharmacological basis for their anticancer activity remains unclear, despite impending clinical trails. Herein we show that intracellular copper levels in prostate cancer, evaluated in vitro and across disease progression in TRAMP mice, were not correlative with copper-ionophore activity and mirrored the normal levels observed in patient prostatectomy tissues (Gleason Score 7 & 9). TRAMP adenocarcinoma cells harbored markedly elevated oxidative stress and diminished glutathione (GSH)-mediated antioxidant capacity, which together conferred selective sensitivity to prooxidant ionophoric copper. Copper-ionophore treatments [CuII(gtsm), disulfiram & clioquinol] generated toxic levels of reactive oxygen species (ROS) in TRAMP adenocarcinoma cells, but not in normal mouse prostate epithelial cells (PrECs). Our results provide a basis for the pharmacological activity of copper-ionophores and suggest they are amendable for treatment of patients with prostate cancer. Additionally, recent in vitro and mouse xenograft studies have suggested an increased copper requirement by prostate cancer cells. We demonstrated that prostate adenocarcinoma development in TRAMP mice requires a functional supply of copper and is significantly impeded by altered systemic copper distribution. The presence of a mutant copper-transporting Atp7b protein (tx mutation: A4066G/Met1356Val) in TRAMP mice changed copper-integration into serum and caused a remarkable reduction in prostate cancer burden (64% reduction) and disease severity (grade), abrogating adenocarcinoma development. Implications for current clinical trials are discussed. PMID:27175597

Low-cost optical fabrication of flexible copper electrode via laser-induced reductive sintering and adhesive transfer

Science.gov (United States)

Back, Seunghyun; Kang, Bongchul

2018-02-01

Fabricating copper electrodes on heat-sensitive polymer films in air is highly challenging owing to the need of expensive copper nanoparticles, rapid oxidation of precursor during sintering, and limitation of sintering temperature to prevent the thermal damage of the polymer film. A laser-induced hybrid process of reductive sintering and adhesive transfer is demonstrated to cost-effectively fabricate copper electrode on a polyethylene film with a thermal resistance below 100 °C. A laser-induced reductive sintering process directly fabricates a high-conductive copper electrode onto a glass donor from copper oxide nanoparticle solution via photo-thermochemical reduction and agglomeration of copper oxide nanoparticles. The sintered copper patterns were transferred in parallel to a heat-sensitive polyethylene film through self-selective surface adhesion of the film, which was generated by the selective laser absorption of the copper pattern. The method reported here could become one of the most important manufacturing technologies for fabricating low-cost wearable and disposable electronics.

Removal of Copper by Eichhornia crassipes and the Characterization of Associated Bacteria of the Rhizosphere System

Directory of Open Access Journals (Sweden)

Raisa Kabeer

2014-06-01

Full Text Available Excess doses of trace element contamination make conventional water treatment methods less effective and more expensive, where in alternative biotechnological applications open up new opportunities with their reduced cost and lesser impacts to the environment. In the present investigation, effectiveness of aquatic macrophyte Eichhornia crassipes was tested for the removal of copper in laboratory conditions. Water samples were collected from macrophytes natural habitat and water tubs used for growing E. crassipes and analysed along with plant tissues for Cu content. The work also characterized the associated microbiota of the rhizosphere system of the E. crassipes as well as the wetland system of its occurrence. Copper concentration of the wetland water samples ranged from 0.009 to 0.03ppm. Six bacterial genera (Acinetobacter, Alcaligenes, Bacillus, Kurthia, Listeria and Chromobacterium were represented in rhizosphere of E.crassipes and 4 bacterial genera (Acinetobacter, Bacillus, Listeria and Chromobacterium were recorded in wetland water samples. Copper resistance studies of the bacterial isolates showed that out of 26 isolates from rhizosphere and 19 strains from water samples,12 of them showed low resistance (80% of copper during 15 days experiment. Copper accumulation was found to be high in the root followed by leaf and petiole. Results of the present study concluded that E. crassipes is an efficient plant for the removal of copper.

Surfactant-free electrodeposition of reduced graphene oxide/copper composite coatings with enhanced wear resistance

Science.gov (United States)

Mai, Y. J.; Zhou, M. P.; Ling, H. J.; Chen, F. X.; Lian, W. Q.; Jie, X. H.

2018-03-01

How to uniformly disperse graphene sheets into the electrolyte is one of the main challenges to synthesize graphene enhanced nanocomposites by electrodeposition. A surfactant-free colloidal solution comprised of copper (II)-ethylene diamine tetra acetic acid ([CuIIEDTA]2-) complexes and graphene oxide (GO) sheets is proposed to electrodeposit reduced graphene oxide/copper (RGO/Cu) composite coatings. Anionic [CuIIEDTA]2- complexes stably coexist with negatively charged GO sheets due to the electrostatic repulsion between them, facilitating the electrochemical reduction and uniform dispersion of GO sheets into the copper matrix. The RGO/Cu composite coatings are well characterized by XRD, Raman, SEM and XPS. Their tribological behavior as a function of RGO content in composite coatings and normal loads are investigated. Also the chemical composition and topography of the wear tracks for the composite coatings are analyzed to deduce the lubricating and anti-wear mechanism of RGO/Cu composite coatings.

Single vs. double dose of copper oxide wire particles (COWP) for treatment of anthelmintic resistant Haemonchus contortus in weanling lambs.

Science.gov (United States)

Schweizer, Nikki M; Foster, Derek M; Knox, William B; Sylvester, Hannah J; Anderson, Kevin L

2016-10-15

Haemonchus contortus parasitism is a major disease of sheep, with these parasites frequently demonstrating multi-drug class anthelmintic resistance. Copper oxide wire particles (COWP) have shown potential as adjuncts or alternatives to anthelmintics in resistant flocks. The purpose of this study was to compare the efficacy of two different COWP treatment regimens or placebo in the control of H. contortus in weaned lambs within a flock historically shown to have multi-drug resistant H. contortus using the DrenchRite ® assay. Data from 43 lambs within 3 treatment groups in a double blind study were included in the experiment. Treatments were administered as a total of 2 boluses, each given on separate occasions (day 0 and day 42), so that each lamb received either 2 placebos, a single dose of 2g COWP followed by placebo, or two doses of 1g COWP. Strongyle-type fecal egg counts (FEC) were performed at initial treatment (day 0), on day 10, at second treatment (day 42), on day 52, and at study end (day 84). At the start of the trial, mean±standard deviation FEC were 1634.4±825.2, 2241.7±1496.8, and 2013.3±1194.2epg for the 2g, 1g×2, and control groups, respectively. At the end of the trial, FEC were 757.1±825.3, 483.4±557.2, and 1660.0±1345.3epg for the 2g, 1g×2, and control groups, respectively. Lambs given a 2g single dose of COWP or a 1g dose of COWP twice had reductions in strongyle-type FEC (p≤0.01) from trial start to trial end, whereas lambs given placebo did not. Average daily gains did not differ significantly among groups. Although copper is potentially toxic to sheep, no signs of toxicity were observed during this trial, which was consistent with similar studies at this treatment dose. The study indicated that administering COWP to lambs at weaning reduced FEC. Copyright © 2016 Elsevier B.V. All rights reserved.

Neutron activation analysis of copper traces: a study for sodium correction factor

International Nuclear Information System (INIS)

Tripathi, A.B.R.; Bhadkambekar, C.A.; Basu, A.K.; Chattopadhyay, N.

2007-01-01

Peak ratio correction factors for accurate quantitative determination of copper by NAA via 64 Cu radioisotope in presence of high 24 Na radioactivities has been established. Copper is the principal element as a marker of bullet residues on targets in connection to forensic ballistics cases. Reliable and precise estimation of copper by NAA either via non-destructive way or by resorting to radiochemical separation is of importance in forensic analysis for arriving at definitive inferences. However, majority of samples originating from wearing apparels, paper, leather, skin, glass or any other metal exhibit matrices contain high levels of sodium. The NAA scheme for determination of copper rests on measurements of net counts at 511 KeV which is the positron annihilation peak of 64 Cu. 24 Na also contributes significantly exactly at 511 KeV of gamma energy albeit by different mechanism i.e., by pair production. Therefore, total signal at 511 KeV is contributed by both. The easiest approach for correct estimation of copper traces has been established by the peak ratio correction factor. This has significance as both 64 Cu and 24 Na have comparable half lives, hence, as such time gap measurements cannot improve the situation. The consistency of peak ratio correction factor could be established for a particular geometry. (author)

ASSESSING CHILDREN'S EXPOSURES TO THE WOOD PRESERVATIVE CCA (CHROMATED COPPER ARSENATE) ON TREATED PLAYSETS AND DECKS

Science.gov (United States)

Concerns have been raised regarding the safety of young children contacting arsenic and chromium residues while playing on and around Chromated Copper Arsenate (CCA) treated wood playground structures and decks. Although CCA registrants voluntarily canceled treated wood for re...

Comparison of inorganic inhibitors of copper, nickel and copper-nickels in aqueous lithium bromide solution

International Nuclear Information System (INIS)

Munoz, A. Igual; Anton, J. Garcia; Guin-tilde on, J.L.; Herranz, V. Perez

2004-01-01

The electrochemical behavior of copper, nickel and two copper-nickel (Cu90/Ni10 and Cu70/Ni30) alloys in 850 g/L LiBr solution in the absence and presence of three different inorganic inhibitors (chromate CrO 4 2- , molybdate MoO 4 2- , and tetraborate B 4 O 7 2- ) has been studied. Differences in inhibition efficiency are discussed in terms of potentiodynamic and cyclic measurements. The best protection is obtained by adding chromate to the 850 g/L LiBr solution while the inhibition efficiencies of molybdate and tetraborate ions were not markedly high. Very aggressive anions, such as bromides, in the present experimental conditions, notably reduce the action of the less efficient molecules (molybdate and tetraborate), but not that of the most efficient ones (chromate). The results of the investigation show that the inhibiting properties depend on the nickel content in the alloy; this element improves the general corrosion resistance of the material in the sense that it shifts free corrosion potential towards more noble values and density corrosion currents towards lower levels. The nickel content in the alloy also enlarges the passivating region of the materials in chromate and molybdate-containing solution; furthermore it decreases the current passivating values to lower values. Nickel addition improves the localized corrosion resistance in the bromide media

Effect of Sulfide Concentration on Copper Corrosion in Anoxic Chloride-Containing Solutions

Science.gov (United States)

Kong, Decheng; Dong, Chaofang; Xu, Aoni; Man, Cheng; He, Chang; Li, Xiaogang

2017-04-01

The structure and property of passive film on copper are strongly dependent on the sulfide concentration; based on this, a series of electrochemical methods were applied to investigate the effect of sulfide concentration on copper corrosion in anaerobic chloride-containing solutions. The cyclic voltammetry and x-ray photoelectron spectroscopy analysis demonstrated that the corrosion products formed on copper in anaerobic sulfide solutions comprise Cu2S and CuS. And the corrosion resistance of copper decreased with increasing sulfide concentration and faster sulfide addition, owing to the various structures of the passive films observed by the atomic force microscope and scanning electron microscope. A p-type semiconductor character was obtained under all experimental conditions, and the defect concentration, which had a magnitude of 1022-1023 cm-3, increased with increasing sulfide concentration, resulting in a higher rate of both film growth and dissolution.

The Extracellular Domain of Human High Affinity Copper Transporter (hNdCTR1, Synthesized by E. coli Cells, Chelates Silver and Copper Ions In Vivo

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Tatiana P. Sankova

2017-11-01

Full Text Available There is much interest in effective copper chelators to correct copper dyshomeostasis in neurodegenerative and oncological diseases. In this study, a recombinant fusion protein for expression in Escherichia coli cells was constructed from glutathione-S-transferase (GST and the N-terminal domain (ectodomain of human high affinity copper transporter CTR1 (hNdCTR1, which has three metal-bound motifs. Several biological properties of the GST-hNdCTR1 fusion protein were assessed. It was demonstrated that in cells, the protein was prone to oligomerization, formed inclusion bodies and displayed no toxicity. Treatment of E. coli cells with copper and silver ions reduced cell viability in a dose- and time-dependent manner. Cells expressing GST-hNdCTR1 protein demonstrated resistance to the metal treatments. These cells accumulated silver ions and formed nanoparticles that contained AgCl and metallic silver. In this bacterial population, filamentous bacteria with a length of about 10 µm were often observed. The possibility for the fusion protein carrying extracellular metal binding motifs to integrate into the cell’s copper metabolism and its chelating properties are discussed.

Effect of copper and lead on two consortia of phototrophic microorganisms and their capacity to sequester metals.

Science.gov (United States)

Burgos, A; Maldonado, J; De Los Rios, A; Solé, A; Esteve, I

2013-09-15

The roles of consortia of phototrophic microorganisms have been investigated in this paper to determine their potential role to tolerate or resist metals and to capture them from polluted cultures. With this purpose, two consortia of microorganisms: on one hand, Geitlerinema sp. DE2011 (Ge) and Scenedesmus sp. DE2009 (Sc) (both identified in this paper by molecular biology methods) isolated from Ebro Delta microbial mats, and on the other, Spirulina sp. PCC 6313 (Sp) and Chroococcus sp. PCC 9106 (Ch), from Pasteur culture collection were polluted with copper and lead. In order to analyze the ability of these consortia to tolerate and capture metals, copper and lead were selected, because both have been detected in Ebro Delta microbial mats. The tolerance-resistance to copper and lead for both consortia was determined in vivo and at cellular level by Confocal Laser Scanning Microscopy (CLSM-λscan function). The results obtained demonstrate that both consortia are highly tolerant-resistant to lead and that the limits between the copper concentration having cytotoxic effect and that having an essential effect are very close in these microorganisms. The capacity of both consortia to capture extra- and intracellular copper and lead was determined by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) respectively, coupled to an Energy Dispersive X-ray detector (EDX). The results showed that all the microorganisms assayed were able to capture copper extracellularly in the extrapolymeric substances, and lead extra- and intracellularly in polyphosphate inclusions. Moreover, the studied micro-organisms did not exert any inhibitory effect on each other's metal binding capacity. From the results obtained in this paper, it can be concluded that consortia of phototrophic microorganisms could play a very important role in biorepairing sediments polluted by metals, as a result of their ability to tolerate or resist high concentrations of metals and to

Native copper as a natural analogue for copper canisters

International Nuclear Information System (INIS)

Marcos, N.

1989-12-01

This paper discusses the occurrence of native copper as found in geological formations as a stability analogue of copper canisters that are planned to be used for the disposal of spent nuclear fuel in the Finnish bedrock. A summary of several publications on native copper occurrences is presented. The present geochemical and geohydrological conditions in which copper is met with in its metallic state show that metallic copper is stable in a wide range of temperatures. At low temperatures native copper is found to be stable where groundwater has moderate pH (about 7), low Eh (< +100 mV), and low total dissolved solids, especially chloride. Microscopical and microanalytical studies were carried out on a dozen of rock samples containing native copper. The results reveal that the metal shows no significant alteration. Only the surface of copper grains is locally coated. In the oldest samples there exist small corrosion cracks; the age of the oldest samples is over 1,000 million years. A review of several Finnish groundwater studies suggests that there are places in Finland where the geohydrological conditions are favourable for native copper stability. (orig.)

Characterization of Lactobacillus brevis L62 strain, highly tolerant to copper ions.

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Mrvčić, Jasna; Butorac, Ana; Solić, Ema; Stanzer, Damir; Bačun-Družina, Višnja; Cindrić, Mario; Stehlik-Tomas, Vesna

2013-01-01

Lactic acid bacteria (LAB) as starter culture in food industry must be suitable for large-scale industrial production and possess the ability to survive in unfavorable processes and storage conditions. Approaches taken to address these problems include the selection of stress-resistant strains. In food industry, LAB are often exposed to metal ions induced stress. The interactions between LAB and metal ions are very poorly investigated. Because of that, the influence of non-toxic, toxic and antioxidant metal ions (Zn, Cu, and Mn) on growth, acid production, metal ions binding capacity of wild and adapted species of Leuconostoc mesenteroides L3, Lactobacillus brevis L62 and Lactobacillus plantarum L73 were investigated. The proteomic approach was applied to clarify how the LAB cells, especially the adapted ones, protect themselves and tolerate high concentrations of toxic metal ions. Results have shown that Zn and Mn addition into MRS medium in the investigated concentrations did not have effect on the bacterial growth and acid production, while copper ions were highly toxic, especially in static conditions. Leuc. mesenteroides L3 was the most efficient in Zn binding processes among the chosen LAB species, while L. plantarum L73 accumulated the highest concentration of Mn. L. brevis L62 was the most copper resistant species. Adaptation had a positive effect on growth and acid production of all species in the presence of copper. However, the adapted species incorporated less metal ions than the wild species. The exception was adapted L. brevis L62 that accumulated high concentration of copper ions in static conditions. The obtained results showed that L. brevis L62 is highly tolerant to copper ions, which allows its use as starter culture in fermentative processes in media with high concentration of copper ions.

Antimicrobial residues and resistance against critically important antimicrobials in non-typhoidal Salmonella from meat sold at wet markets and supermarkets in Vietnam.

Science.gov (United States)

Nhung, Nguyen Thi; Van, Nguyen Thi Bich; Cuong, Nguyen Van; Duong, Truong Thi Quy; Nhat, Tran Thi; Hang, Tran Thi Thu; Nhi, Nguyen Thi Hong; Kiet, Bach Tuan; Hien, Vo Be; Ngoc, Pham Thi; Campbell, James; Thwaites, Guy; Carrique-Mas, Juan

2018-02-02

Excessive antimicrobial usage and deficiencies in hygiene in meat production systems may result in undesirable human health hazards, such as the presence of antimicrobial drug residues and non-typhoidal Salmonella (NTS), including antimicrobial resistant (AMR) NTS. Recently, Vietnam has witnessed the emergence of integrated intensive animal production systems, coexisting with more traditional, locally-sourced wet markets. To date no systematic studies have been carried out to compare health hazards in beef, pork and chicken in different production systems. We aimed to: (1) estimate the prevalence of antimicrobial residues in beef, pork and chicken meat; (2) investigate the prevalence and levels of NTS contamination; and (3) investigate serovar distribution and AMR against critically important antimicrobials by animal species and type of retail (wet market vs. supermarket) in Vietnam. Fresh pork, beef and chicken meat samples (N=357) sourced from wet markets and supermarkets in Ho Chi Minh City (HCMC), Hanoi and Dong Thap were screened for antimicrobial residues by PremiTest, and were further investigated by Charm II. Samples from HCMC (N=113) were cultured using ISO 6579:2002/Amd 1:2007. NTS bacteria were quantified using a minimum probable number (MPN) technique. NTS isolates were assigned to serovar by Multilocus Sequence Typing (MLST), and were investigated for their phenotypic susceptibility against 32 antimicrobials. A total of 26 (7.3%) samples tested positive by PremiTest (9.5% beef, 4.1% pork and 8.4% chicken meat). Sulfonamides, tetracyclines and macrolides were detected by Charm in 3.1%, 2.8% and 2.0% samples, respectively. Overall, meat samples from wet markets had a higher prevalence of residues than those from supermarkets (9.6% vs. 2.6%) (p=0.016). NTS were isolated from 68.4% samples from HCMC. Chicken samples from wet markets had by far the highest NTS counts (median 3.2 logMPN/g). NTS isolates displayed high levels of resistance against quinolones

Obtention of copper-magnesium alloys wires used in electrical transmission lines

International Nuclear Information System (INIS)

Fernandes, Marcos Gonzales

2010-01-01

The aim of this work was to obtain copper wires in three different chemical compositions starting from electrolytic copper and magnesium. The mains steps were evaluated, starting from the melting of small eutectic cooper-magnesium specimens in an electric arc furnace, followed by further dilution of this buttons in a resistive furnace and casting it in a copper mould. The as cast billets were homogenized in a resistive furnace at 910 degree C for 2 h. The billets were mechanically cold worked by swaging and a final drawing step to attain a round shape and a reasonable surface quality. The cast ingots chemical analysis indicated that the processing route showed to be adequate, in laboratory scale, to obtain wires with cross sectional area of 4 mm2 and 10 m in length. The wires in both conditions - as cold worked and after a recovering heat treatment at 510 degree C for 1 h, were mechanically characterized by tensile testing and hardness. The wires had also the electric conductivity assessed in the recovered heat-treated state and the results were compared to the literature data. The obtained material showed to be adequate to be used as electric conductor. The yield strain and ultimate tensile strength were improved with the increasing amount of Mg in the alloy, 11 % and 24 %, respectively, while the electric conductivity decreased to 60 % IACS (International Annealed Copper Standard). (author)

Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

Science.gov (United States)

Curtis, Calvin J [Lakewood, CO; Miedaner, Alexander [Boulder, CO; Van Hest, Maikel [Lakewood, CO; Ginley, David S [Evergreen, CO; Nekuda, Jennifer A [Lakewood, CO

2011-11-15

Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

COPPER AND COPPER-CONTAINING PESTICIDES: METABOLISM, TOXICITY AND OXIDATIVE STRESS

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Viktor Husak

2015-05-01

Full Text Available The purpose of this paper is to provide a brief review of the current knowledge regarding metabolism and toxicity of copper and copper-based pesticides in living organisms. Copper is an essential trace element in all living organisms (bacteria, fungi, plants, and animals, because it participates in different metabolic processes and maintain functions of organisms. The transport and metabolism of copper in living organisms is currently the subject of many studies. Copper is absorbed, transported, distributed, stored, and excreted in the body via the complex of homeostatic processes, which provide organisms with a needed constant level of this micronutrient and avoid excessive amounts. Many aspects of copper homeostasis were studied at the molecular level. Copper based-pesticides, in particularly fungicides, bacteriocides and herbicides, are widely used in agricultural practice throughout the world. Copper is an integral part of antioxidant enzymes, particularly copper-zinc superoxide dismutase (Cu,Zn-SOD, and plays prominent roles in iron homeostasis. On the other hand, excess of copper in organism has deleterious effect, because it stimulates free radical production in the cell, induces lipid peroxidation, and disturbs the total antioxidant capacity of the body. The mechanisms of copper toxicity are discussed in this review also.

Copper and nickel alloys and titanium for seawater applications

International Nuclear Information System (INIS)

Richter, H.

1977-01-01

Copper and nickel alloys and titanium have been successfully used for heat exchangers on ships, in power plants and for chemical apparatus and piping systems because of their resistance against corrosion in sea water. Aluminium brass and copper nickel alloys, the standard materials for condensers and coolers, however, may be attacked, the corrosion depending on water quality, water velocity, and structural conditions. The mechanisms of corrosion are discussed. Under severe conditions the use of titanium may be indicated. The use of nickel base alloys is advantageous at elevated temperatures, e.g. for chemical reactions and for evaporation processes. Examples are given for application and for prevention of corrosion. (orig.) [de

Earthquake resistance of residual heat removed (RHR) pump for pressurized water reactors (PWR)

International Nuclear Information System (INIS)

Uga, Takeo; Shiraki, K.; Honma, T.; Matsubayashi, H.; Inazuka, H.

1980-01-01

The present paper deals with the earthquake resistance of the residual heat removed (RHR) pump of single stage double volute type, which is one of the structurally simplest pumps used for pressurized water reactors (PWR). The results of the study can be summarized as follows: (1) Any trouble which can give effect on the functions of the pump at earthquake does not become a problem so long as each part of the pump is of aseismatically rigid structure. (2) Aseismatic tolerance test in the pump's operating condition has shown that the earthquake resistance of the pump at its location has a tolerance about five times the dynamic design acceleration. (3) The pump is provided with an impeller-casing wear ring at the pressure boundary between the suction side pressure and discharge side pressure. This wear ring acts as an underwater bearing when the pump is in operation, and improves the vibration characteristics, particularly damping ratio, of the pump shaft to a great extent to make the pump more aseismatic. (4) In the evaluation of the underwater bearing characteristics of the wear ring, the evaluation accuracy of the vibration characteristics of the pump shaft can be improved by taking into consideration the pressure loss in the wear ring part from the head of the single stage of the pump due to the rotation of the impeller. (author)

Effect of copper addition and section thickness on the mechanical and physical properties of grey cast iron

International Nuclear Information System (INIS)

Malik, F.A.; Zahid, M.; Hassan, M.A.; Sheikh, M.A.; Alam, S.; Qazi, M.A.

1995-01-01

Copper is a graphitizer at the stage of solidification and it acts as antiferritizer during transformation cooling range. Due to this, copper additions to grey cast iron prevent at formation of free ferrite in heavy sections. It also reduces the chilling in thin sections, therefore uniform structure is imparted to grey iron by the copper addition. This gives the appropriate strength and hardness properties to grey iron. Thus copper addition gives certain advantages in relation to the machinability and wear resistance which are important for many engineering properties requires by high duty cast iron. The application of copper as allying element is acceptable due to its price and availability as compared to other alloying elements. (author)

Uptake and internalisation of copper by three marine microalgae: comparison of copper-sensitive and copper-tolerant species.

Science.gov (United States)

Levy, Jacqueline L; Angel, Brad M; Stauber, Jennifer L; Poon, Wing L; Simpson, Stuart L; Cheng, Shuk Han; Jolley, Dianne F

2008-08-29

Although it has been well established that different species of marine algae have different sensitivities to metals, our understanding of the physiological and biochemical basis for these differences is limited. This study investigated copper adsorption and internalisation in three algal species with differing sensitivities to copper. The diatom Phaeodactylum tricornutum was particularly sensitive to copper, with a 72-h IC50 (concentration of copper to inhibit growth rate by 50%) of 8.0 microg Cu L(-1), compared to the green algae Tetraselmis sp. (72-h IC50 47 microg Cu L(-1)) and Dunaliella tertiolecta (72-h IC50 530 microg Cu L(-1)). At these IC50 concentrations, Tetraselmis sp. had much higher intracellular copper (1.97+/-0.01 x 10(-13)g Cu cell(-1)) than P. tricornutum (0.23+/-0.19 x 10(-13)g Cu cell(-1)) and D. tertiolecta (0.59+/-0.05 x 10(-13)g Cu cell(-1)), suggesting that Tetraselmis sp. effectively detoxifies copper within the cell. By contrast, at the same external copper concentration (50 microg L(-1)), D. tertiolecta appears to better exclude copper than Tetraselmis sp. by having a slower copper internalisation rate and lower internal copper concentrations at equivalent extracellular concentrations. The results suggest that the use of internal copper concentrations and net uptake rates alone cannot explain differences in species-sensitivity for different algal species. Model prediction of copper toxicity to marine biota and understanding fundamental differences in species-sensitivity will require, not just an understanding of water quality parameters and copper-cell binding, but also further knowledge of cellular detoxification mechanisms.

Study on the CMP characteristics of a copper passivity layer formed by dipping in an oxidizer

International Nuclear Information System (INIS)

Choi, Youn-Ok; Lee, Woo-Sun; Choi, Gwon-Woo; Lee, Kang-Yeon; Kim, Nam-Oh

2011-01-01

Copper has been the material for ultra-large-scale integrated circuits owing to its excellent electromigration resistance and low electrical resistance. The polishing mechanism of metal chemical mechanical polishing (CMP) has been reported to be a repeated process of passive oxide layer formation through the use of on oxidizer and then the abrasion action of the slurry. However, because copper is softer and more sensitive to corrosion than tungsten, the slurry composition and the polishing mechanism during the copper CMP process may be more complicated. In a general Cu-CMP process, a mixture of an alumina-based slurry and an oxidizer in proper proportion is used in order to form a passive oxide layer such as CuO and CuO 2 . However, a conventional CMP process consumes an unnecessary amount of slurry to formed the passive layer. Therefore, in this paper, we propose a new method. The copper samples were oxidized by dipping in an oxidizer for an appropriate time to minimize the consumption of slurry before the CMP process. Then, we performed the CMP process. In order to compare the polishing characteristics of the copper thin film, we discuss the CMP removal rate and non-uniformity, as well as the microstructure of the surface and a layer cross-section based on a scanning.

Control of residual carbon concentration in GaN high electron mobility transistor and realization of high-resistance GaN grown by metal-organic chemical vapor deposition

Energy Technology Data Exchange (ETDEWEB)

He, X.G. [State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, P.O. Box 912, Beijing 100083 (China); Zhao, D.G., E-mail: dgzhao@red.semi.ac.cn [State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, P.O. Box 912, Beijing 100083 (China); Jiang, D.S.; Liu, Z.S.; Chen, P.; Le, L.C.; Yang, J.; Li, X.J. [State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, P.O. Box 912, Beijing 100083 (China); Zhang, S.M.; Zhu, J.J.; Wang, H.; Yang, H. [Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215125 (China)

2014-08-01

GaN films were grown by metal-organic chemical vapor deposition (MOCVD) under various growth conditions. The influences of MOCVD growth parameters, i.e., growth pressure, ammonia (NH{sub 3}) flux, growth temperature, trimethyl-gallium flux and H{sub 2} flux, on residual carbon concentration ([C]) were systematically investigated. Secondary ion mass spectroscopy measurements show that [C] can be effectively modulated by growth conditions. Especially, it can increase by reducing growth pressure up to two orders of magnitude. High-resistance (HR) GaN epilayer with a resistivity over 1.0 × 10{sup 9} Ω·cm is achieved by reducing growth pressure. The mechanism of the formation of HR GaN epilayer is discussed. An Al{sub x}Ga{sub 1−x}N/GaN high electron mobility transistor structure with a HR GaN buffer layer and an additional low-carbon GaN channel layer is presented, exhibiting a high two dimensional electron gas mobility of 1815 cm{sup 2}/Vs. - Highlights: • Influence of MOCVD parameters on residual carbon concentration in GaN is studied. • GaN layer with a resistivity over 1 × 10{sup 9} Ω·cm is achieved by reducing growth pressure. • High electron mobility transistor (HEMT) structures were prepared. • Control of residual carbon content results in HEMT with high 2-D electron gas mobility.

Influence factors of the inter-nanowire thermal contact resistance in the stacked nanowires

Science.gov (United States)

Wu, Dongxu; Huang, Congliang; Zhong, Jinxin; Lin, Zizhen

2018-05-01

The inter-nanowire thermal contact resistance is important for tuning the thermal conductivity of a nanocomposite for thermoelectric applications. In this paper, the stacked copper nanowires are applied for studying the thermal contact resistance. The stacked copper nanowires are firstly made by the cold-pressing method, and then the nanowire stacks are treated by sintering treatment. With the effect of the volumetric fraction of nanowires in the stack and the influence of the sintering-temperature on the thermal contact resistance discussed, results show that: The thermal conductivity of the 150-nm copper nanowires can be enlarged almost 2 times with the volumetric fraction increased from 32 to 56% because of the enlarged contact-area and contact number of a copper nanowire. When the sintering temperature increases from 293 to 673 K, the thermal conductivity of the stacked 300-nm nanowires could be enlarged almost 2.5 times by the sintering treatment, because of the improved lattice property of the contact zone. In conclusion, application of a high volumetric fraction or/and a sintering-treatment are effectivity to tune the inter-nanowire thermal contact resistance, and thus to tailor the thermal conductivity of a nanowire network or stack.

Microstructure, Residual Stress, Corrosion and Wear Resistance of Vacuum Annealed TiCN/TiN/Ti Films Deposited on AZ31

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Haitao Li

2016-12-01

Full Text Available Composite titanium carbonitride (TiCN thin films deposited on AZ31 by DC/RF magnetron sputtering were vacuum annealed at different temperatures. Vacuum annealing yields the following on the structure and properties of the films: the grain grows and the roughness increases with an increase of annealing temperature, the structure changes from polycrystalline to single crystal, and the distribution of each element becomes more uniform. The residual stress effectively decreases compared to the as-deposited film, and their corrosion resistance is much improved owing to the change of structure and fusion of surface defects, whereas the wear-resistance is degraded due to the grain growth and the increase of surface roughness under a certain temperature.

Electro-thermal analysis of contact resistance

Science.gov (United States)

Pandey, Nitin; Jain, Ishant; Reddy, Sudhakar; Gulhane, Nitin P.

2018-05-01

Electro-Mechanical characterization over copper samples are performed at the macroscopic level to understand the dependence of electrical contact resistance and temperature on surface roughness and contact pressure. For two different surface roughness levels of samples, six levels of load are selected and varied to capture the bulk temperature rise and electrical contact resistance. Accordingly, the copper samples are modelled and analysed using COMSOLTM as a simulation package and the results are validated by the experiments. The interface temperature during simulation is obtained using Mikic-Elastic correlation and by directly entering experimental contact resistance value. The load values are varied and then reversed in a similar fashion to capture the hysteresis losses. The governing equations & assumptions underlying these models and their significance are examined & possible justification for the observed variations are discussed. Equivalent Greenwood model is also predicted by mapping the results of the experiment.

Pyruvic Oxime Nitrification and Copper and Nickel Resistance by a Cupriavidus pauculus, an Active Heterotrophic Nitrifier-Denitrifier

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Miguel Ramirez

2014-01-01

Full Text Available Heterotrophic nitrifiers synthesize nitrogenous gasses when nitrifying ammonium ion. A Cupriavidus pauculus, previously thought an Alcaligenes sp. and noted as an active heterotrophic nitrifier-denitrifier, was examined for its ability to produce nitrogen gas (N2 and nitrous oxide (N2O while heterotrophically nitrifying the organic substrate pyruvic oxime [CH3–C(NOH–COOH]. Neither N2 nor N2O were produced. Nucleotide and phylogenetic analyses indicated that the organism is a member of a genus (Cupriavidus known for its resistance to metals and its metabolism of xenobiotics. The microbe (a Cupriavidus pauculus designated as C. pauculus strain UM1 was examined for its ability to perform heterotrophic nitrification in the presence of Cu2+ and Ni2+ and to metabolize the xenobiotic phenol. The bacterium heterotrophically nitrified well when either 1 mM Cu2+ or 0.5 mM Ni2+ was present in either enriched or minimal medium. The organism also used phenol as a sole carbon source in either the presence or absence of 1 mM Cu2+ or 0.5 mM Ni2+. The ability of this isolate to perform a number of different metabolisms, its noteworthy resistance to copper and nickel, and its potential use as a bioremediation agent are discussed.

Heavy metals in liquid pig manure in light of bacterial antimicrobial resistance

International Nuclear Information System (INIS)

Hölzel, Christina S.; Müller, Christa; Harms, Katrin S.; Mikolajewski, Sabine; Schäfer, Stefanie; Schwaiger, Karin; Bauer, Johann

2012-01-01

Heavy metals are regularly found in liquid pig manure, and might interact with bacterial antimicrobial resistance. Concentrations of heavy metals were determined by atomic spectroscopic methods in 305 pig manure samples and were connected to the phenotypic resistance of Escherichia coli (n=613) against 29 antimicrobial drugs. Concentrations of heavy metals (/kg dry matter) were 0.08–5.30 mg cadmium, 1.1–32.0 mg chrome, 22.4–3387.6 mg copper, <2.0–26.7 mg lead, <0.01–0.11 mg mercury, 3.1–97.3 mg nickel and 93.0–8239.0 mg zinc. Associated with the detection of copper and zinc, resistance rates against β-lactams were significantly elevated. By contrast, the presence of mercury was significantly associated with low antimicrobial resistance rates of Escherichia coli against β-lactams, aminoglycosides and other antibiotics. Effects of subinhibitory concentrations of mercury on bacterial resistance against penicillins, cephalosporins, aminoglycosides and doxycycline were also demonstrated in a laboratory trial. Antimicrobial resistance in the porcine microflora might be increased by copper and zinc. By contrast, the occurrence of mercury in the environment might, due to co-toxicity, act counter-selective against antimicrobial resistant strains.

Streptococcus mutans copper chaperone, CopZ, is critical for biofilm formation and competitiveness.

Science.gov (United States)

Garcia, S S; Du, Q; Wu, H

2016-12-01

The oral cavity is a dynamic environment characterized by hundreds of bacterial species, saliva, and an influx of nutrients and metal ions such as copper. Although there is a physiologic level of copper in the saliva, the oral cavity is often challenged with an influx of copper ions. At high concentrations copper is toxic and must therefore be strictly regulated by pathogens for them to persist and cause disease. The cariogenic pathogen Streptococcus mutans manages excess copper using the copYAZ operon that encodes a negative DNA-binding repressor (CopY), the P1-ATPase copper exporter (CopA), and the copper chaperone (CopZ). These hypothetical roles of the copYAZ operon in regulation and copper transport to receptors led us to investigate their contribution to S. mutans virulence. Mutants defective in the copper chaperone CopZ, but not CopY or CopA, were impaired in biofilm formation and competitiveness against commensal streptococci. Characterization of the CopZ mutant biofilm revealed a decreased secretion of glucosyltransferases and reduced expression of mutacin genes. These data suggest that the function of copZ on biofilm and competitiveness is independent of copper resistance and CopZ is a global regulator for biofilm and other virulence factors. Further characterization of CopZ may lead to the identification of new biofilm pathways. © 2015 John Wiley & Sons A/S. Published by John Wiley & Sons Ltd.

Determination of thymine glycol residues in irradiated or oxidized DNA by formation of methylglyceric acid

International Nuclear Information System (INIS)

Schellenberg, K.A.; Shaeffer, J.

1986-01-01

Treatment of DNA solutions with X-irradiation various oxidants including hydrogen peroxide plus ferrous ion, hydrogen peroxide plus copper ion and ascorbate, permanganate, or sonication in the presence of dissolved oxygen all produced varying amounts of thymine glycol residues. After denaturing the DNA with heat, the glycol residues were reduced and labeled at the 6 position with tritium- labeled sodium borohydride. Subsequent reaction with anhydrous methanolic HCl gave a quantitative yield of the methyl ester of methylglyceric acid, which was determined by thin layer chromatography. The method, developed using thymidine as a model, was used to ascertain the requirements for glycol formation in DNA. It was shown that hydroxyl radical generating systems, permanganate, X-irradiation, or sonication in presence of oxygen were required, but hydrogen peroxide in the absence of iron or copper and ascorbate was inactive. Application to determination of DNA damage in vivo is being explored

Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

International Nuclear Information System (INIS)

Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan; Sowade, Enrico; Baumann, Reinhard R.; Feng, Zhe-Sheng

2017-01-01

Highlights: • Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. • Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. • High conductivity can be obtained without many printing passes and high temperature sintering. • This approach can largely avoid nozzle-clogging problems. • This approach presents a potential way in the flexible printed electronics with simple process. - Abstract: A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

Energy Technology Data Exchange (ETDEWEB)

Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054 (China); Sowade, Enrico; Baumann, Reinhard R. [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz, 09126 (Germany); Feng, Zhe-Sheng, E-mail: fzs@uestc.edu.cn [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054 (China)

2017-02-28

Highlights: • Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. • Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. • High conductivity can be obtained without many printing passes and high temperature sintering. • This approach can largely avoid nozzle-clogging problems. • This approach presents a potential way in the flexible printed electronics with simple process. - Abstract: A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

Enhancement of tribofilm formation from water lubricated PEEK composites by copper nanowires

Science.gov (United States)

Gao, Chuanping; Fan, Shuguang; Zhang, Shengmao; Zhang, Pingyu; Wang, Qihua

2018-06-01

A high-performance tribofilm is crucial to enhance the tribological performance of tribomaterials. In order to promote tribofilm formation under water lubrication conditions, copper nanowires as a functional nanomaterial were filled into neat polyetheretherketone (PEEK) and PEEK10SCF8Gr (i.e., PEEK filled with 10 vol.% short carbon fibers and 8 vol.% graphite flakes). The results show that the addition of copper nanowires and a greater applied load can enhance materials transfer and tribofilm formation during sliding process. Moreover, copper nanowires can share a part of applied load, and retard the fatigue effect to some extent. In addition, copper nanowires, carbon fibers and graphite can synergistically improve the tribological performance and the tribofilm formation under water lubrication and severe working conditions. In particular, only 0.5 vol.% copper nanowires can form a high-performance tribofilm, which endows superior lubricating property and wear resistance capacity of the PEEK10SCF8Gr. Furthermore, the surface analysis indicates that the tribofilm contains some transferred materials and the products from tribochemical reactions as well.

Gold-copper ores processing-Case study: optimization of flotation residue cyanidation

International Nuclear Information System (INIS)

McMullen, J.; Pelletier, P.; Breau, Y.; Pelletier, D.

1999-01-01

Typically, economic optimization of Gold-Copper ore processing presents challenges. Barrick's Bousquet II ore is a good example where many processing units such as gravity, flotation and cyanidation are required to efficiently recover the metals from the ore. Flowsheet criterion, operating strategy selections, cyanidation process optimization and its inter-dependence with flotation are discussed in detail. Real-time conservation integration of the cyanide control strategy has allowed a reduction of cyanide consumption of over 40% since 1994, while maintaining or improving metals recovery. A detailed analysis of the cyanidation control strategy such as key process sensor reliability and accuracy, process monitoring and fault detection is presented. This robust and efficient control strategy is a key building block that enhances the overall economic return of the process plant. (author)

Control of pyrethroid and DDT-resistant Anopheles gambiae by application of indoor residual spraying or mosquito nets treated with a long-lasting organophosphate insecticide, chlorpyrifos-methyl

Directory of Open Access Journals (Sweden)

Chabi Joseph

2010-02-01

Full Text Available Abstract Background Scaling up of long-lasting insecticidal nets (LLINs and indoor residual spraying (IRS with support from the Global Fund and President's Malaria Initiative is providing increased opportunities for malaria control in Africa. The most cost-effective and longest-lasting residual insecticide DDT is also the most environmentally persistent. Alternative residual insecticides exist, but are too short-lived or too expensive to sustain. Dow Agrosciences have developed a microencapsulated formulation (CS of the organophosphate chlorpyrifos methyl as a cost-effective, long-lasting alternative to DDT. Methods Chlorpyrifos methyl CS was tested as an IRS or ITN treatment in experimental huts in an area of Benin where Anopheles gambiae and Culex quinquefasiactus are resistant to pyrethroids, but susceptible to organophosphates. Efficacy and residual activity was compared to that of DDT and the pyrethroid lambdacyalothrin. Results IRS with chlorpyrifos methyl killed 95% of An. gambiae that entered the hut as compared to 31% with lambdacyhalothrin and 50% with DDT. Control of Cx. quinquefasciatus showed a similar trend; although the level of mortality with chlorpyrifos methyl was lower (66% it was still much higher than for DDT (14% or pyrethroid (15% treatments. Nets impregnated with lambdacyhalothrin were compromized by resistance, killing only 30% of An. gambiae and 8% of Cx. quinquefasciatus. Nets impregnated with chlorpyrifos methyl killed more (45% of An gambiae and 15% of Cx. quinquefasciatus, but its activity on netting was of short duration. Contact bioassays on the sprayed cement-sand walls over the nine months of monitoring showed no loss of activity of chlorpyrifos methyl, whereas lambdacyhalothrin and DDT lost activity within a few months of spraying. Conclusion As an IRS treatment against pyrethroid resistant mosquitoes chlorpyrifos methyl CS outperformed DDT and lambdacyhalothrin. In IRS campaigns, chlorpyrifos methyl CS should

Electrical conduction in composites containing copper core-copper

Indian Academy of Sciences (India)

Composites of nanometre-sized copper core-copper oxide shell with diameters in the range 6.1 to 7.3 nm dispersed in a silica gel were synthesised by a technique comprising reduction followed by oxidation of a suitably chosen precursor gel. The hot pressed gel powders mixed with nanometre-sized copper particles ...

Process solutions for reducing PR residue over non-planar wafer

Science.gov (United States)

Lin, C. H.; Huang, C. H.; Yang, Elvis; Yang, T. H.; Chen, K. C.; Lu, Chih-Yuan

2011-03-01

SAS (Self-Aligned Source) process has been widely adopted on manufacturing NOR Flash devices. To form the SAS structure, the compromise between small space patterning and sufficiently removing photo resist residue in topographical substrate has been a critical challenge as the device scaling down. In this study, photo simulation, layout optimization, resist processing and tri-layer materials were evaluated to form defect-free and highly extendible SAS structure for NOR Flash devices. Photo simulation suggested more coherent light source allowed the incident light to reach the trench bottom that facilitates the removal of photo resist. Mask bias also benefited the process latitude extension for residue-free SAS printing. In the photo resist processing, both lowering the SB (Soft Bake) and raising PEB (Post-Exposure Bake) temperature of photo resist were helpful to broaden the process window but the final pattern profile was not good enough. Thermal flow for pos-exposure pattern shrinkage achieved small CD (Critical Dimension) patterning with residue-free, however the materials loading effect is another issue to be addressed at memory array boundary. Tri-layer scheme demonstrated good results in terms of free from residue, better substrate reflectivity control, enabling smaller space printing to loosen overlay specification and minimizing the poly gate clipping defect. It was finally proposed to combine with etch effort to from the SAS structure. Besides it is also promising to extend to even smaller technology nodes.

Detection of residues antibiotics in food using a microbiological method

International Nuclear Information System (INIS)

Ben Ali, Ahmed

2007-01-01

Antibiotics are effective therapeutic agents because of their property of selective bacterial toxicity which helps controlling infections. Animals, just like humans, can be treated with antibiotics. This use of antibiotics can lead to the development of resistance. Resistant strains may cause severe infections in humans and animals. In addition, antibiotic residues might represent a problem for human health. Our objective is to develop a microbiological method for the detection of antibiotic residues in poultry(muscle, liver,...). For this purpose, antibiotic sensitive bacteria and selective agar media were used. An inhibition growth zone surrounds each of the food samples containing antibiotic residues after a prescribed incubation time. (Author). 23 refs

Effect of self purification on the structural optical and electrical properties of copper doped oxidized Zn films

International Nuclear Information System (INIS)

Koshy, Obey; Abdul Khadar, M.

2015-01-01

The effect of self purification mechanism is studied on oxidized Cu–Zn thin films. Oxidized Cu–Zn thin films were prepared by thermal evaporation on glass substrates. XRD studies indicate that the oxidized Cu–Zn thin films are of hexagonal wurtzite structure. AFM images shows that with increase in copper wt. percent the nanoparticle morphology of oxidized Zn film turned to one dimensional nanorod morphology. XPS spectra of the oxidized Cu–Zn thin films shows the oxidized state of zinc and copper. The PL spectra of oxidized Zn film showed a strong and narrow near band edge emission at 380 nm whereas in the case of oxidized Cu–Zn thin films the emission showed peak near 410 nm corresponding to peak related to copper. With increase in copper content, the intensity of the defect emission decreased due to the self purification mechanism in nanomaterials. In addition the resistivity of doped films increased due to the self purification mechanism in nanomaterials. - Highlights: • Copper doping in ZnO resulted in the increase in blue emission due to defect levels formed. • The intensity of the luminescence peak of the doped film sample decreased and resistivity increased due to the self purification mechanism in nanomaterials.