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Sample records for copper alloys

  1. Standard Specification for Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2015-01-01

    Standard Specification for Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

  2. Copper and copper-nickel-alloys - An overview

    Energy Technology Data Exchange (ETDEWEB)

    Klassert, Anton; Tikana, Ladji [Deutsches Kupferinstitut e.V. Am Bonneshof 5, 40474 Duesseldorf (Germany)

    2004-07-01

    With the increasing level of industrialization the demand for and the number of copper alloys rose in an uninterrupted way. Today, the copper alloys take an important position amongst metallic materials due to the large variety of their technological properties and applications. Nowadays there exist over 3.000 standardized alloys. Copper takes the third place of all metals with a worldwide consumption of over 15 millions tons per year, following only to steel and aluminum. In a modern industrial society we meet copper in all ranges of the life (electro-technology, building and construction industry, mechanical engineering, automotive, chemistry, offshore, marine engineering, medical applications and others.). Copper is the first metal customized by humanity. Its name is attributed to the island Cyprus, which supplied in the antiquity copper to Greece, Rome and the other Mediterranean countries. The Romans called it 'ore from Cyprus' (aes cyprium), later cuprum. Copper deposited occasionally also dapper and could be processed in the recent stone age simply by hammering. Already in early historical time copper alloys with 20 to 50 percent tin was used for the production of mirrors because of their high reflecting power. Although the elementary nickel is an element discovered only recently from a historical perspective, its application in alloys - without any knowledge of the alloy composition - occurred at least throughout the last 2.000 years. The oldest copper-nickel coin originates from the time around 235 B.C.. Only around 1800 AD nickel was isolated as a metallic element. In particular in the sea and offshore technology copper nickel alloys found a broad field of applications in piping systems and for valves and armatures. The excellent combination of characteristics like corrosion resistance, erosion stability and bio-fouling resistance with excellent mechanical strength are at the basis of this success. An experience of many decades supports the use

  3. Radiation resistance of copper alloys at high exposure levels

    Energy Technology Data Exchange (ETDEWEB)

    Garner, F.A. (Pacific Northwest Lab., Richland, WA (USA)); Zinkle, S.J. (Oak Ridge National Lab., TN (USA))

    1990-08-01

    Copper alloys are currently being considered for high heat flux applications in fusion power devices. A review is presented of the results of two separate series of experiments on the radiation response of copper and copper alloys. One of these involved pure copper and boron-doped copper in the ORR mixed spectrum reactor. The other series included pure copper and a wide array of copper alloys irradiated in the FFTF fast reactor 16 refs., 13 figs.

  4. Microstructure and Service Properties of Copper Alloys

    OpenAIRE

    Polok-Rubiniec M.; Konieczny J.; Labisz K.; Włodarczyk-Fligier A.

    2016-01-01

    This elaboration shows the effect of combined heat treatment and cold working on the structure and utility properties of alloyed copper. As the test material, alloyed copper CuTi4 was employed. The samples were subjected to treatment according to the following schema: 1st variant – supersaturation and ageing, 2nd variant – supersaturation, cold rolling and ageing. The paper presents the results of microstructure, hardness, and abrasion resistance. The analysis of the wipe profile geometry was...

  5. High Copper Amalgam Alloys in Dentistry

    Directory of Open Access Journals (Sweden)

    Gaurav Solanki

    2012-07-01

    Full Text Available Amalgam Restoration is an example of the material giving its name to the process. Amalgam fillings are made up of mercury, powdered silver and tin. They are mixed and packed into cavities in teeth where it hardens slowly and replaces the missing tooth substance. The high copper have become material of choice as compared to low copper alloys nowadays because of their improved mechanical properties, corrosion resistance, better marginal integrity and improved performance in clinical trial. The high copper amalgam was used as a restorative material. The application of high copper amalgam was found to be much more useful than low copper amalgam. High copper had much more strength, corrosion resistance, durability and resistance to tarnish as compared to low copper amalgams. No marked expansion or condensation was noted in the amalgam restoration after its setting after 24 hrs. By using the high copper alloy, the chances of creep were also minimized in the restored tooth. No discomfort or any kind of odd sensation in the tooth was noted after few days of amalgam restoration in the tooth.

  6. Hydrogen ingress into copper-nickel alloys

    Energy Technology Data Exchange (ETDEWEB)

    Pound, B.G. (SRI International, Menlo Park, CA (United States). Materials Research Center)

    1994-04-01

    Hydrogen (H) ingress into two copper (Cu)-nickel (Ni) alloys -- a commercial 77% Cu-15% Ni alloy (aged) and alloy K-500 (UNS N05500, aged and unaged) --- was studied using a technique referred to as hydrogen ingress analysis by potentiostatic pulsing (HIAPP). Anodic current transients obtained for these alloys in an acetate buffer (1 mol/L acetic acid + 1 mol/L sodium acetate [NaAc]) were analyzed using a diffusion-trapping model to determine trapping constants and H entry fluxes. A small increase was observed in the irreversible trapping constant for alloy K-500 with aging. Trapping constants of the aged alloys were similar within the limits of uncertainty, but H entry flux for the 77% Cu alloy was lower than that for aged or unaged alloy K-500. The lower flux may have accounted at least partly, for the Cu alloy's higher resistance to H embrittlement. Trap densities were consistent qualitatively with levels of sulfur (S) and phosphorus (P) in the two alloys. This finding supported an assumption that S and P provided the primary irreversible traps.

  7. Zirconium modified nickel-copper alloy

    Science.gov (United States)

    Whittenberger, J. D. (Inventor)

    1977-01-01

    An improved material for use in a catalytic reactor which reduces nitrogen oxide from internal combustion engines is in the form of a zirconium-modified, precipitation-strengthened nickel-copper alloy. This material has a nominal composition of Ni-30 Cu-0.2 Zr and is characterized by improved high temperature mechanical properties.

  8. Microstructure and Service Properties of Copper Alloys

    Directory of Open Access Journals (Sweden)

    Polok-Rubiniec M.

    2016-09-01

    Full Text Available This elaboration shows the effect of combined heat treatment and cold working on the structure and utility properties of alloyed copper. As the test material, alloyed copper CuTi4 was employed. The samples were subjected to treatment according to the following schema: 1st variant – supersaturation and ageing, 2nd variant – supersaturation, cold rolling and ageing. The paper presents the results of microstructure, hardness, and abrasion resistance. The analysis of the wipe profile geometry was realized using a Zeiss LSM 5 Exciter confocal microscope. Cold working of the supersaturated solid solution affects significantly its hardness but the cold plastic deformation causes deterioration of the wear resistance of the finally aged CuTi4 alloy.

  9. Irradiation creep of dispersion strengthened copper alloy

    Energy Technology Data Exchange (ETDEWEB)

    Pokrovsky, A.S.; Barabash, V.R.; Fabritsiev, S.A. [and others

    1997-04-01

    Dispersion strengthened copper alloys are under consideration as reference materials for the ITER plasma facing components. Irradiation creep is one of the parameters which must be assessed because of its importance for the lifetime prediction of these components. In this study the irradiation creep of a dispersion strengthened copper (DS) alloy has been investigated. The alloy selected for evaluation, MAGT-0.2, which contains 0.2 wt.% Al{sub 2}O{sub 3}, is very similar to the GlidCop{trademark} alloy referred to as Al20. Irradiation creep was investigated using HE pressurized tubes. The tubes were machined from rod stock, then stainless steel caps were brazed onto the end of each tube. The creep specimens were pressurized by use of ultra-pure He and the stainless steel caps subsequently sealed by laser welding. These specimens were irradiated in reactor water in the core position of the SM-2 reactors to a fluence level of 4.5-7.1 x 10{sup 21} n/cm{sup 2} (E>0.1 MeV), which corresponds to {approx}3-5 dpa. The irradiation temperature ranged from 60-90{degrees}C, which yielded calculated hoop stresses from 39-117 MPa. A mechanical micrometer system was used to measure the outer diameter of the specimens before and after irradiation, with an accuracy of {+-}0.001 mm. The irradiation creep was calculated based on the change in the diameter. Comparison of pre- and post-irradiation diameter measurements indicates that irradiation induced creep is indeed observed in this alloy at low temperatures, with a creep rate as high as {approx}2 x 10{sup {minus}9}s{sup {minus}1}. These results are compared with available data for irradiation creep for stainless steels, pure copper, and for thermal creep of copper alloys.

  10. Electrochemical nucleation and growth of copper and copper alloys

    Science.gov (United States)

    Shao, Wenbo

    This dissertation aims to contribute to a fundamental understanding of the physicochemical processes occurring in electrochemical nucleation and growth. To this end, the effects of various anions (chloride (Cl-), sulfate (SO42-) and sulfamate (NH2SO 3-)) on the electrochemical kinetics and the mechanism of copper reduction, as well as on the microstructure of the resulting films, were studied. On the basis of this work, the deposition of copper alloys (Cu-Ag with positive heat of mixing, Cu-Au with negative heat of mixing) was investigated with the main objective to achieve an insight on the role of solid state thermodynamics on the electrocrystallization process. Chloride ions cause two competing effects: at low chloride concentration the formation of an adsorbed chloride layer introduces an additional reaction pathway, resulting in an overall depolarization of the reduction process with no significant change of the Tafel slope. At high chloride concentration, complexation phenomena induce a cathodic polarization of the deposition process and a decrease in the Tafel slope. Chlorides cause a decrease in the density and an increased size of copper nuclei. Sulfamate depolarizes copper reduction the most and results in the largest nucleus density. Chloride promotes the faceting, and dendritic growth of copper deposits along direction by introducing interfacial anisotropy. Addition of Ag in the solution or in the electrode substrate enhances copper deposition and results in an additional reduction peak. Codeposition of Cu-Ag increases nucleus density and decreases nucleus size. Such enhancement of copper deposition, the increase in nucleus density and the decrease in nucleus size by Ag could be due to the continued formation of a surface alloy of Cu-Ag and the fast interface dynamics of Ag deposition. Cu can be underpotentially codeposited in the Cu-Au alloy. Homogeneous solid solutions are grown under conditions of underpotential deposition of Cu, while precipitation

  11. Development of Lead-Free Copper Alloy-Graphite Castings

    Energy Technology Data Exchange (ETDEWEB)

    Rohatgi, P.K. [Univ. of Wisconsin-Milwaukee (US)

    1999-10-01

    In this project, graphite is used as a substitute for lead in order to maintain the machinability of plumbing components at the level of leaded brass. Graphite dispersed in Cu alloy was observed to impart good machinability and reduce the sizes of chips during machining of plumbing components in a manner similar to lead. Copper alloys containing dispersed graphite particles could be successfully cast in several plumbing fixtures which exhibited acceptable corrosion rate, solderability, platability, and pressure tightness. The power consumption for machining of composites was also lower than that of the matrix alloy. In addition, centrifugally cast copper alloy cylinders containing graphite particles were successfully made. These cylinders can therefore be used for bearing applications, as substitutes for lead-containing copper alloys. The results indicate that copper graphite alloys developed under this DOE project have a great potential to substitute for lead copper alloys in both plumbing and bearing applications.

  12. Discontinuous precipitation in copper base alloys

    Indian Academy of Sciences (India)

    K T Kashyap

    2009-08-01

    Discontinuous precipitation (DP) is associated with grain boundary migration in the wake of which alternate plates of the precipitate and the depleted matrix form. Some copper base alloys show DP while others do not. In this paper the misfit strain parameter, , has been calculated and predicted that if 100 > ± 0.1, DP is observed. This criterion points to diffusional coherency strain theory to be the operative mechanism for DP.

  13. A new acid pickling process for copper alloys

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    The cleaning process of removing oxides on the surface of copper alloy sheets was investigated systematically. Through optimizing, a perfect process was selected that is fit for removing oxides on the surface. By acid pickling, all kinds of copper oxides are removed completely, furthermore, no poisonous gases are given out and a smooth and clean surface of copper alloys is obtained. At present, the process is applied successfully in the copper-processing industry.

  14. Grain Refinement of Permanent Mold Cast Copper Base Alloys

    Energy Technology Data Exchange (ETDEWEB)

    M.Sadayappan; J.P.Thomson; M.Elboujdaini; G.Ping Gu; M. Sahoo

    2005-04-01

    Grain refinement is a well established process for many cast and wrought alloys. The mechanical properties of various alloys could be enhanced by reducing the grain size. Refinement is also known to improve casting characteristics such as fluidity and hot tearing. Grain refinement of copper-base alloys is not widely used, especially in sand casting process. However, in permanent mold casting of copper alloys it is now common to use grain refinement to counteract the problem of severe hot tearing which also improves the pressure tightness of plumbing components. The mechanism of grain refinement in copper-base alloys is not well understood. The issues to be studied include the effect of minor alloy additions on the microstructure, their interaction with the grain refiner, effect of cooling rate, and loss of grain refinement (fading). In this investigation, efforts were made to explore and understand grain refinement of copper alloys, especially in permanent mold casting conditions.

  15. Comparison of the Oxidation Rates of Some New Copper Alloys

    Science.gov (United States)

    Ogbuji, Linus U. J. Thomas; Humphrey, Donald L.

    2002-01-01

    Copper alloys were studied for oxidation resistance and mechanisms between 550 and 700 C, in reduced-oxygen environments expected in rocket engines, and their oxidation behaviors compared to that of pure copper. They included two dispersion-strengthened alloys (precipitation-strengthened and oxide-dispersion strengthened, respectively) and one solution-strengthened alloy. In all cases the main reaction was oxidation of Cu into Cu2O and CuO. The dispersion-strengthened alloys were superior to both Cu and the solution-strengthened alloy in oxidation resistance. However, factors retarding oxidation rates seemed to be different for the two dispersion-strengthened alloys.

  16. Rapid iodometric determination of copper in some copper-base alloys

    NARCIS (Netherlands)

    Agterdenbos, J.; Eelberse, P.A.

    1966-01-01

    Copper-base alloys, especially those containing tin, are readily dissolved in a mixture of hydrofluoric and nitric acids. In the resulting solution copper can be titrated iodometrically in the conventional manner.

  17. Testing Corrosion Inhibitors for the Conservation of Archaeological Copper and Copper Alloys

    Directory of Open Access Journals (Sweden)

    Robert B. Faltermeier

    1997-11-01

    Full Text Available This is a synopsis of the Ph.D. research undertaken at the Institute of Archaeology, University College London. The aim was to evaluate corrosion inhibitors for use in the conservation of copper and copper alloy archaeological artefacts. The objective of this work was to acquire an insight into the performance of copper corrosion inhibitors, when applied to archaeological copper.

  18. Corrosion of copper alloys in sulphide containing district heting systems

    DEFF Research Database (Denmark)

    Thorarinsdottir, R.I.; Maahn, Ernst Emanuel

    1999-01-01

    Copper and some copper alloys are prone to corrosion in sulphide containing geothermal water analogous to corrosion observed in district heating systems containing sulphide due to sulphate reducing bacteria. In order to study the corrosion of copper alloys under practical conditions a test...... was carried out at four sites in the Reykjavik District Heating System. The geothermal water chemistry is different at each site. The corrosion rate and the amount and chemical composition of deposits on weight loss coupons of six different copper alloys are described after exposure of 12 and 18 months...

  19. Explosive compact-coating of tungsten–copper alloy to a copper surface

    Science.gov (United States)

    Chen, Xiang; Li, Xiaojie; Yan, Honghao; Wang, Xiaohong; Miao, Yusong

    2017-03-01

    This study proposed a new method for coating tungsten–copper alloy to copper surface. First, the tungsten–copper alloy powder was pre-compacted to the copper surface. Then, the powder in the hydrogen atmosphere was sintered, and the pre-compacted powder was compacted by explosive compact-coating. Finally, diffusion sintering was conducted to improve the density of the coating layer. The theoretical density of the coating reached 99.3%. Microstructure characteristics indicated that tungsten and copper powders were well mixed. Tungsten particles were larger than copper particles. Scanning electron microscope (SEM) fracture surface analysis was different from the traditional fracture of metals. Coating and substrate joint surfaces, which were analyzed by SEM, indicated that the tungsten–copper alloy was sintered on the copper surface. The hardness of the coating layer was 197.6–245.2 HV, and the hardness of the substrate was approximately 55 HV.

  20. Antimicrobial activity of different copper alloy surfaces against copper resistant and sensitive Salmonella enterica.

    Science.gov (United States)

    Zhu, Libin; Elguindi, Jutta; Rensing, Christopher; Ravishankar, Sadhana

    2012-05-01

    Copper has shown antibacterial effects against foodborne pathogens. The objective of this study was to evaluate the antibacterial activity of copper surfaces on copper resistant and sensitive strains of Salmonella enterica. Six different copper alloy coupons (60-99.9% copper) were tested along with stainless steel as the control. The coupons were surface inoculated with either S. Enteritidis or one of the 3 copper resistant strains, S. Typhimurium S9, S19 and S20; stored under various incubation conditions at room temperature; and sampled at various times up to 2 h. The results showed that under dry incubation conditions, Salmonella only survived 10-15 min on high copper content alloys. Salmonella on low copper content alloys showed 3-4 log reductions. Under moist incubation conditions, no survivors were detected after 30 min-2 h on high copper content alloys, while the cell counts decreased 2-4 logs on low copper content coupons. Although the copper resistant strains survived better than S. Enteritidis, they were either completely inactivated or survival was decreased. Copper coupons showed better antimicrobial efficacy in the absence of organic compounds. These results clearly show the antibacterial effects of copper and its potential as an alternative to stainless steel for selected food contact surfaces.

  1. Effect of fission neutron irradiation on the tensile and electrical properties of copper and copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Fabritsiev, S.A. [D.V. Efremov Institute, St. Petersburg (Russian Federation); Zinkle, S.J.; Rowcliffe, A.F. [Oak Ridge National Lab., TN (United States)] [and others

    1995-04-01

    The objective of this study is to evaluate the properties of several copper alloys following fission reactor irradiation at ITER-relevant temperatures of 80 to 200{degrees}C. This study provides some of the data needed for the ITER research and development Task T213. These low temperature irradiations caused significant radiation hardening and a dramatic decrease in the work hardening ability of copper and copper alloys. The uniform elongation was higher at 200{degree}C compared to 100{degree}C, but still remained below 1% for most of the copper alloys.

  2. Impact Properties of Copper-Alloyed and Nickel-Copper Alloyed ADI

    Science.gov (United States)

    Batra, Uma; Ray, Subrata; Prabhakar, S. R.

    2007-08-01

    The influence of austenitization and austempering parameters on the impact properties of copper-alloyed and nickel-copper-alloyed austempered ductile irons (ADIs) has been studied. The austenitization temperature of 850 and 900 °C have been used in the present study for which austempering time periods of 120 and 60 min were optimized in an earlier work. The austempering process was carried out for 60 min for three austempering temperatures of 270, 330, and 380 °C to study the effect of austempering temperature. The influence of the austempering time on impact properties has been studied for austempering temperature of 330 °C for time periods of 30-150 min. The variation in impact strength with the austenitization and austempering parameters has been correlated to the morphology, size and amount of austenite and bainitic ferrite in the austempered structure. The fracture surface of ADI failed under impact has been studied using SEM.

  3. Nanostructured Alloys as an Alternative to Copper-Beryllium

    Science.gov (United States)

    2014-11-19

    bushing applications;  2) Nanometal/composite for high specific strength/stiffness components; and  3) Nanometal cobalt / copper enabled...performance of Integran’s Nanovate cobalt -based and nickel- cobalt metals is superior to copper beryllium (peak hardness); Mechanical Property Summary...Nanostructured Cobalt Alloy 285 ksi (1967 MPa) 225 ksi (1550 MPa) 290 ksi (2000 MPa) 18855 ksi (130 GPa) Copper Beryllium (C17200-TH04) 142 ksi

  4. Alloyed copper chalcogenide nanoplatelets via partial cation exchange reactions.

    Science.gov (United States)

    Lesnyak, Vladimir; George, Chandramohan; Genovese, Alessandro; Prato, Mirko; Casu, Alberto; Ayyappan, S; Scarpellini, Alice; Manna, Liberato

    2014-08-26

    We report the synthesis of alloyed quaternary and quinary nanocrystals based on copper chalcogenides, namely, copper zinc selenide-sulfide (CZSeS), copper tin selenide-sulfide (CTSeS), and copper zinc tin selenide-sulfide (CZTSeS) nanoplatelets (NPLs) (∼20 nm wide) with tunable chemical composition. Our synthesis scheme consisted of two facile steps: i.e., the preparation of copper selenide-sulfide (Cu2-xSeyS1-y) platelet shaped nanocrystals via the colloidal route, followed by an in situ cation exchange reaction. During the latter step, the cation exchange proceeded through a partial replacement of copper ions by zinc or/and tin cations, yielding homogeneously alloyed nanocrystals with platelet shape. Overall, the chemical composition of the alloyed nanocrystals can easily be controlled by the amount of precursors that contain cations of interest (e.g., Zn, Sn) to be incorporated/alloyed. We have also optimized the reaction conditions that allow a complete preservation of the size, morphology, and crystal structure as that of the starting Cu2-xSeyS1-y NPLs. The alloyed NPLs were characterized by optical spectroscopy (UV-vis-NIR) and cyclic voltammetry (CV), which demonstrated tunability of their light absorption characteristics as well as their electrochemical band gaps.

  5. Evaluation of Microscopic Degradation of Copper and Copper Alloy by Electrical Resistivity Measurement

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Chung Seok [Hanyang University, Seoul (Korea, Republic of); Nahm, Seung Hoon [Korea Research Institute of Standards and Science, Daejeon (Korea, Republic of); Hyun, Chang Young [Seoul National University of Science and Technology, Seoul (Korea, Republic of)

    2010-10-15

    In the present study, the microscopic degradation of copper and copper and alloy subjected to cyclic deformation has been evaluated by the electrical resistivity measurement using the DC four terminal potential method. The copper (Cu) and copper alloy (Cu-35Zn), whose stacking fault energy is much different each other, were cyclically deformed to investigate the response of the electrical resistivity to different dislocation substructures. Dislocation cell substructure was developed in the Cu, while the planar array of dislocation structure was developed in the Cu-35Zn alloy increasing dislocation density with fatigue cycles. The electrical resistivity increased rapidly in the initial stage of fatigue deformation in both materials. Moreover, after the fatigue test it increased by about 7 % for the Cu and 6.5 % for the Cu-35Zn alloy, respectively. From these consistent results, it may be concluded that the dislocation cell structure responds to the electrical resistivity more sensitively than the planar array dislocation structure evolved during cyclic fatigue

  6. Localized corrosion of copper alloys in China seawater for 16 years

    Institute of Scientific and Technical Information of China (English)

    赵月红; 林乐耘; 崔大为

    2004-01-01

    The regulation of localized corrosion of 2 kinds of copper and 17 kinds of copper alloys exposed in seawater of Qingdao, Zhoushan, Yulin and Xiamen for 16 years has been studied. Results show that during immersion copper alloys suffer from pitting corrosion due to high temperature and marine living adhesion at Yulin, and to the higher velocity of seawater containing sand at Zhoushan. However, the seawater of Xiamen inhibits the pitting corrosion of copper alloys. No pitting corrosion is observed on copper alloy plates tested there. The copper alloys suffer from more serious pitting corrosion in the tide zone than that in the immersion zone at Qingdao after long time exposure.

  7. Fatigue behavior of copper and selected copper alloys for high heat flux applications

    Energy Technology Data Exchange (ETDEWEB)

    Leedy, K.D.; Stubbins, J.F.; Singh, B.N.; Garner, F.A.

    1996-04-01

    The room temperature fatigue behavior of standard and subsize specimens was examined for five copper alloys: OFHC Cu, two CuNiBe alloys, a CuCrZr alloy, and a Cu-Al{sub 2}O{sub 3} alloy. Fatigue tests were run in strain control to failure. In addition to establishing failure lives, the stress amplitudes were monitored as a function of numbers of accrued cycles. The results indicate that the alloys with high initial yield strengths provide the best fatigue response over the range of failure lives examined in the present study: N{sub f} = 10{sup 3} to 10{sup 6}. In fact, the fatigue performance of the best alloys is dominated by the elastic portion of the strain range, as would be expected from the correlation of performance with yield properties. The alumina strengthened alloy and the two CuNiBe alloys show the best overall performance of the group examined here.

  8. Friction stir welding of copper alloys

    Institute of Scientific and Technical Information of China (English)

    Liu Shuhua; Liu Meng; Wang Deqing; Xu Zhenyue

    2007-01-01

    Copper plates,brass plates and copper/brass plates were friction stir welded with various parameters. Experimental results show that the microstructure of the weld is characterized by its much finer grains as contrasted with the coarse grains of parent materials and the heat-affected zones are very narrow. The microhardness of the copper weld is a little higher than that of parent plate. The microhardness of brass weld is about 25% higher than that of parent material. The tensile strength of copper joints increases with increasing welding speed in the test range. The range of parameters to obtain good welds for copper is much wider than that for brass. When different materials were welded, the position of copper plate before welding affected the quality of FSW joints. If the copper plate was put on the advancing side of weld, the good quality of weld could be got under proper parameters.

  9. Isotropic copper-invar alloys for microelectronics packaging

    Science.gov (United States)

    Cottle, Rand Duprez

    The recent trend in microelectronics packaging toward surface mounted devices (SMD) has created a need for new types of materials that possess low thermal expansion and high electrical and thermal conductivity. Laminates that combine the high thermal and electrical conductivity of copper with the low thermal expansion of Invar, know as CuInvarCu or CIC, are widely use as core constraining materials in printed wire boards where SMDs are to be employed. CIC is highly anisotropic, and there are potential problems resulting from its anisotropy. An isotropic CuInvar alloy would be of great interest for a variety of applications. In suitable Cu-Fe-Ni alloys, a copper-rich solid solution equilibrates with an Invar-rich solid solution; casting such alloys invariably produces Invar-rich dendrites in a copper-rich solid solution. Casting followed by suitable heat treatments can produce two-phase alloys that combine the properties of copper and Invar. The overall composition controls the relative fractions of Invar and copper and the resulting trade-off between low thermal expansivity and electrical conductivity. Measured thermal expansivities (CTE) of CuInvar alloys follow very closely a linear rule of mixing. Electrical conductivities of as-cast specimens are quite poor due to iron and nickel contamination. Theoretical phase diagrams indicate that nearly pure copper equilibrates with an Invar-rich phase at temperatures below, roughly, 500°C. However, equilibrium compositions have been shown to take extremely, long to form, due to the very sluggish kinetics in the system. Long-term annealing was shown to improve conductivity significantly, but much greater improvements are needed to make CuInvar viable as an electrical conductive material.

  10. Copper-Silicon-Magnesium Alloys for Latent Heat Storage

    Science.gov (United States)

    Gibbs, P. J.; Withey, E. A.; Coker, E. N.; Kruizenga, A. M.; Andraka, C. E.

    2016-12-01

    The systematic development of microstructure, solidification characteristics, and heat of solidification with composition in copper-silicon-magnesium alloys for thermal energy storage is presented. Differential scanning calorimetry was used to relate the thermal characteristics to microstructural development in the investigated alloys and clarifies the location of one of the terminal three-phase eutectics. Repeated thermal cycling highlights the thermal storage stability of the transformation through multiple melting events. Two near-terminal eutectic alloys display high enthalpies of solidification, relatively narrow melting ranges, and stable transformation hysteresis behaviors suited to thermal energy storage.

  11. Corrosion of dental copper, nickel, and gold alloys in artificial saliva and saline solutions.

    Science.gov (United States)

    Johansson, B I; Lemons, J E; Hao, S Q

    1989-09-01

    The purpose of this investigation was to study the tarnish and corrosion of three commercial copper alloys, three experimental copper alloys, two nickel alloys, and one high-gold alloy by exposing the specimens for four weeks to artificial saliva and saline solutions. Half of the specimens were brushed, and the solutions were changed regularly. The copper-based and the beryllium-containing nickel alloys exhibited significant surface alterations after exposure to either solution. The potential of elevated release of ions to the oral cavity and to the target organs by some of the investigated alloys should be considered if dental usage of these alloys is to be extended.

  12. Pattern formation during electrodeposition of copper-antimony alloys

    Directory of Open Access Journals (Sweden)

    Vasil S. Kostov

    2016-04-01

    Full Text Available Aim of the present study is to establish the conditions of the electrolysis for the preparation of structured and unstressed purple-pink coatings of copper-antimony alloys, including their phase characterization. Also the task of the present investigation is, by changing drastically the metal content in the methanesulfonic electrolyte to find out the conditions of electrolysis where the self-organization of the different phases is expressed by higher-order structures - not only waves but also spirals and targets. The possibility to obtain copper-antimony alloy with up to 80 wt. % Sb from methanesulfonic acid is shown. The deposition rate, morphology and the phase composition of the obtained coatings are established. The phenomena of formation of spatio-temporal structures in this alloy are described.It is determined that the observed structures consist of Cu2Sb and Cu11Sb3 intermetallic phases.

  13. Measuring the stability of three copper alloys

    Science.gov (United States)

    Doiron, Theodore D.; Stoup, John R.; Snoots, Patricia; Chaconas, Grace

    1990-11-01

    In this paper we report measurements of the dimensional stability of samples of brass, beryllium copper, and tellurium copper taken over an 18 month time span. Of the materials, brass was the most stable, decreasing slightly in length at the rate of 1 part per million per year (ppm/y) with an uncertainty (3a) of about 1 ppm/y. Tellurium copper shrank at an average rate of 2.Li ppm/y and beryllium copper, the least stable, at the rate of 5.8 ppm/y. To measure the instrumental uncertainty 4 samples of each material were measured, and the measurement scheme was designed to detect and correct for thermal drift ,during measurements. The experiment design problems associated with these measurements and the associated uncertainties are discussed.

  14. Investigation on a Roman copper alloy artefact from Pompeii (Italy).

    Science.gov (United States)

    Baraldi, Pietro; Baraldi, Cecilia; Ferrari, Giorgia; Foca, Giorgia; Marchetti, Andrea; Tassi, Lorenzo

    2006-01-01

    A selection of samples, obtained from a particular copper-alloy domestic artefact of Roman style from Pompeii, has been analysed by using different techniques (IR, Raman, SEM-EDX, FAAS), in order to investigate the chemical nature and composition of the metals utilised for such manufacturing pieces. The surface analysis of the bright red metallic microfragments conducted by different analytical techniques, emphasises the presence of pure unalloyed copper and confirms the absence of other metallic species on the upper layers. On the contrary, the mapping analysis of the section of the laminar metal of the investigated sample shows a consistent enrichment in tin content. Finally, destructive analysis by FAAS confirms that the artefact looks like a bronze metal alloy, with a medium Sn content of about 6.5%.

  15. Friction and wear of titanium alloys and copper alloys sliding against titanium 6-percent-aluminum - 4-percent-vanadium alloy in air at 430 C

    Science.gov (United States)

    Wisander, D. W.

    1976-01-01

    Experiments were conducted to determine the friction and wear characteristics of aluminum bronzes and copper-tin, titanium-tin, and copper-silver alloys sliding against a titanium-6% aluminum-4% vanadium alloy (Ti-6Al-4V). Hemispherically tipped riders of aluminum bronze and the titanium and copper alloys were run against Ti-6Al-4V disks in air at 430 C. The sliding velocity was 13 cm/sec, and the load was 250 g. Results revealed that high tin content titanium and copper alloys underwent significantly less wear and galling than commonly used aluminum bronzes. Also friction force was less erratic than with the aluminum bronzes.

  16. Effect of Copper Addition on Crystallization and Properties of Hafnium Containing HITPERM Alloys

    Science.gov (United States)

    2010-05-01

    AFRL-RZ-WP-TP-2010-2190 EFFECT OF COPPER ADDITION ON CRYSTALLIZATION AND PROPERTIES OF HAFNIUM CONTAINING HITPERM ALLOYS (POSTPRINT) L...SUBTITLE EFFECT OF COPPER ADDITION ON CRYSTALLIZATION AND PROPERTIES OF HAFNIUM CONTAINING HITPERM ALLOYS (POSTPRINT) 5a. CONTRACT NUMBER In-house...8-98) Prescribed by ANSI Std. Z39-18 Effect of copper addition on crystallization and properties of hafnium containing HITPERM alloys „invited

  17. Graphite/copper alloy interfacial energies determined using the sessile drop method

    Science.gov (United States)

    Devincent, Sandra M.; Ellis, David L.; Michal, Gary M.

    1991-01-01

    Graphite surfaces are not wet by pure copper. This lack of wetting is responsible for a debonding phenomenon that was found in continuous graphite fiber/copper matrix composites materials subjected to elevated temperatures. By suitably alloying copper, its capability to wet graphite surfaces can be enhanced. In situ measurements of graphite/copper alloy wetting angles were made using the sessile drop method. Interfacial energy values were calculated based upon these measurements.

  18. Environmental Durability of Coated GRCop-84 Copper Alloys

    Science.gov (United States)

    Raj, Sai V.; Robinson, C.; Barrett, C.; Humphrey, D.

    2005-01-01

    An advanced Cu-8(at.%)Cr-4%Nb alloy developed at NASA's Glenn Research Center, and designated as GRCop-84, is currently being considered for use as liners in combustor chambers and nozzle ramps in NASA s future generations of reusable launch vehicles (RLVs). However, past experience has shown that unprotected copper alloys undergo an environmental attack called "blanching" in rocket engines using liquid hydrogen as fuel and liquid oxygen as the oxidizer. Potential for sulfidation attack of the liners in hydrocarbon-fueled engines is also of concern. As a result, protective overlay coatings alloys are being developed for GRCop-84. The oxidation behavior of several new coating alloys has been evaluated. GRCop-84 specimens were coated with several copper and nickel-based coatings, where the coatings were deposited by either vacuum plasma spraying or cold spraying techniques. Coated and uncoated specimens were thermally cycled in a furnace at different temperatures in order to evaluate the performance of the coatings. Additional studies were conducted in a high pressure burner rig using a hydrocarbon fuel and subjected to a high heat flux hydrogen-oxygen combustion flame in NASA s Quick Access Rocket Exhaust (QARE) rig. The performance of these coatings are discussed.

  19. Synergistic effects of additives to benzotriazole solutions applied as corrosion inhibitors to archaeological copper and copper alloy artefacts.

    OpenAIRE

    Golfomitsou, S.

    2006-01-01

    Benzotriazole (BTA) is a corrosion inhibitor extensively used for the stabilisation of active corrosion of archaeological copper and copper alloys. However, BTA often fails to effectively retard corrosion when applied on heavily corroded artefacts. Although there are numerous studies about its mode of action on clean copper, there is no comprehensive understanding about the way it is bonded to corroded copper. This thesis aimed to understand and compare BTA and its mode of action on clean and...

  20. 铜及铜合金着色%Coloring of copper and copper alloys

    Institute of Scientific and Technical Information of China (English)

    程沪生

    2011-01-01

    简述了铜及铜合金着色的原理.总结了铜及铜合金着黑色、褐色、绿色、蓝色的工艺配方及操作条件,介绍了手工点涂铜绿(铜锈)、双色点蚀(先着黑色再点蚀铜绿)、套色、着土黄铜绿色等多种特殊的着色工艺.%The principle of coloring of copper and copper alloys was described. The process formulations and operation conditions for obtaining black, brown, green, and blue colors on copper and copper alloys were summarized. Some special coloring processes were introduced, such as spot coating to form patina (green corrosion products of copper), black coloring followed by spot corrosion to form two tones, covering with another color on a previously colored workpiece, and successive coloring with khaki and green.

  1. Impedance and XPS study of benzotriazole films formed on copper, copper-zinc alloys and zinc in chloride solution

    Energy Technology Data Exchange (ETDEWEB)

    Kosec, Tadeja; Merl, Darja Kek [Jozef Stefan Institute, Department of Physical and Organic Chemistry, Jamova 39, 1000 Ljubljana (Slovenia); Milosev, Ingrid [Jozef Stefan Institute, Department of Physical and Organic Chemistry, Jamova 39, 1000 Ljubljana (Slovenia); Orthopaedic Hospital Valdoltra, Jadranska c. 31, 6280 Ankaran (Slovenia)], E-mail: ingrid.milosev@ijs.si

    2008-07-15

    The formation of protective layers on copper, zinc and copper-zinc (Cu-10Zn and Cu-40Zn) alloys at open circuit potential in aerated, near neutral 0.5 M NaCl solution containing benzotriazole was studied using electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). Benzotriazole (BTAH), generally known as an inhibitor of copper corrosion, also proved to be an efficient inhibitor for copper-zinc alloys and zinc metal. The surface layers formed on alloys in BTAH-inhibited solution comprised both polymer and oxide components, namely Cu(I)BTA and Zn(II)BTA polymers and Cu{sub 2}O and ZnO oxides, as proved by the in-depth profiling of the layers formed. A tentative structural model describing the improved corrosion resistance of Cu, Cu-xZn alloys and Zn in BTAH containing chloride solution is proposed.

  2. Evaluation of copper alloys for fusion reactor divertor and first wall components

    DEFF Research Database (Denmark)

    Fabritsiev, S.A.; Zinkle, S.J.; Singh, B.N.

    1996-01-01

    This paper presents a critical analysis of the main factors of radiation damage limiting the possibility to use copper alloys in the ITER divertor and first wall structure. In copper alloys the most significant types of radiation damage in the proposed temperature-dose operation range are swellin...

  3. Influence of composition, heat treatment and neutron irradiation on the electrical conductivity of copper alloys

    DEFF Research Database (Denmark)

    Eldrup, Morten Mostgaard; Singh, B.N.

    1998-01-01

    The electrical conductivity of three different types of copper alloys, viz. CuNiBe, CuCrZr and Cu-Al(2)O(3) as well as of pure copper are reported. The alloys have undergone different pre-irradiation heat treatments and have been fission-neutron irradiated up to 0.3 dpa. In some cases post...

  4. Evaluation of copper alloys for fusion reactor divertor and first wall components

    DEFF Research Database (Denmark)

    Fabritsiev, S.A.; Zinkle, S.J.; Singh, B.N.

    1996-01-01

    This paper presents a critical analysis of the main factors of radiation damage limiting the possibility to use copper alloys in the ITER divertor and first wall structure. In copper alloys the most significant types of radiation damage in the proposed temperature-dose operation range are swellin...

  5. Oxidation Behavior of GRCop-84 Copper Alloy Assessed

    Science.gov (United States)

    Thomas-Ogbuji, Linus U.

    2002-01-01

    NASA's goal of safe, affordable space transportation calls for increased reliability and lifetimes of launch vehicles, and significant reductions of launch costs. The areas targeted for enhanced performance in the next generation of reusable launch vehicles include combustion chambers and nozzle ramps; therefore, the search is on for suitable liner materials for these components. GRCop-84 (Cu-8Cr-4Nb), an advanced copper alloy developed at the NASA Glenn Research Center in conjunction with Case Western Reserve University, is a candidate. The current liner of the Space Shuttle Main Engine is another copper alloy, NARloy-Z (Cu-3Ag-0.1Zr). It provides a benchmark against which to compare the properties of candidate successors. The thermomechanical properties of GRCop-84 have been shown to be superior, and its physical properties comparable, to those of NARloy-Z. However, environmental durability issues control longevity in this application: because copper oxide scales are not highly protective, most copper alloys are quickly consumed in oxygen environments at elevated temperatures. In consequence, NARloy-Z and most other copper alloys are prone to blanching, a degradation process that occurs through cycles of oxidation-reduction as the oxide is repeatedly formed and removed because of microscale fluctuations in the oxygen-hydrogen fuel systems of rocket engines. The Space Shuttle Main Engine lining typically degraded by blanching-induced hot spots that lead to surface roughening, pore formation, and coolant leakage. Therefore, resistance to oxidation and blanching are key requirements for second-generation reusable launch vehicle liners. The rocket engine ambient includes H2 (fuel) and H2O (combustion product) and is, hence, under reduced oxygen partial pressures. Accordingly, our studies were expanded to include oxygen partial pressures as low as 322 parts per million (ppm) at the temperatures likely to be experienced in service. A comparison of 10-hr weight gains of

  6. Influence of alloying and secondary annealing on anneal hardening effect at sintered copper alloys

    Indian Academy of Sciences (India)

    Svetlana Nestorovic

    2005-08-01

    This paper reports results of investigation carried out on sintered copper alloys (Cu, 8 at%; Zn, Ni, Al and Cu–Au with 4 at%Au). The alloys were subjected to cold rolling (30, 50 and 70%) and annealed isochronally up to recrystallization temperature. Changes in hardness and electrical conductivity were followed in order to investigate the anneal hardening effect. This effect was observed after secondary annealing also. Au and Al have been found to be more effective in inducing anneal hardening effect.

  7. Oxidation of Copper Alloy Candidates for Rocket Engine Applications

    Science.gov (United States)

    Ogbuji, Linus U. Thomas; Humphrey, Donald L.

    2002-01-01

    The gateway to affordable and reliable space transportation in the near future remains long-lived rocket-based propulsion systems; and because of their high conductivities, copper alloys remain the best materials for lining rocket engines and dissipating their enormous thermal loads. However, Cu and its alloys are prone to oxidative degradation -- especially via the ratcheting phenomenon of blanching, which occurs in situations where the local ambient can oscillate between oxidation and reduction, as it does in a H2/02- fuelled rocket engine. Accordingly, resistance to blanching degradation is one of the key requirements for the next generation of reusable launch vehicle (RLV) liner materials. Candidate copper alloys have been studied with a view to comparing their oxidation behavior, and hence resistance to blanching, in ambients corresponding to conditions expected in rocket engine service. These candidate materials include GRCop-84 and GRCop-42 (Cu - Cr-8 - Nb-4 and Cu - Cr-4 - Nb-2 respectively); NARloy-Z (Cu-3%Ag-0.5%Y), and GlidCop (Cu-O.l5%Al2O3 ODS alloy); they represent different approaches to improving the mechanical properties of Cu without incurring a large drop in thermal conductivity. Pure Cu (OFHC-Cu) was included in the study to provide a baseline for comparison. The samples were exposed for 10 hours in the TGA to oxygen partial pressures ranging from 322 ppm to 1.0 atmosphere and at temperatures of up to 700 C, and examined by SEM-EDS and other techniques of metallography. This paper will summarize the results obtained.

  8. The effect of neutron spectrum on the mechanical and physical properties of pure copper and copper alloys

    DEFF Research Database (Denmark)

    Fabritsiev, S.A.; Pokrovsky, A.S.; Zinkle, S.J.

    1996-01-01

    was independent of displacement dose. The saturation value for Delta rho(rd) was similar to 1.2 n Omega m for pure copper and similar to 1.6 n Omega m for the DS copper alloys irradiated at 100 degrees C in positions with a fast-to-thermal neutron flux ratio of 5, Considerable radiation hardening was observed...

  9. Final report on characterization of physical and mechanical properties of copper and copper alloys before and after irradiation

    DEFF Research Database (Denmark)

    Singh, B.N.; Tähtinen, S.

    2002-01-01

    The present report summarizes and highlights the main results of the work carried out during the last 5-6 years on effects of neutron irradiation on physical and mechanical properties of copper and copper alloys. The work was an European contribution toITER Research and Development programme...... amount of further effort is needed to find a realistic and optimum solution....

  10. Electrochemical and Spectroscopic Study of Benzotriazole Films Formed on Copper, Copper-zinc Alloys and Zinc in Chloride Solution

    OpenAIRE

    Milošev, I.; Kosec, T.

    2009-01-01

    The formation of protective layers on copper, zinc and copper-zinc (Cu-10Zn and Cu-40Zn) alloys at open circuit potential in aerated, near neutral 0.5 M NaCl solution containing benzotriazole (BTA) was studied using potentiodynamic measurements, electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). The addition of benzotriazole affects the dissolution of the materials investigated. Benzotriazole, generally known as an inhibitor of copper corrosion, is als...

  11. Corrosion of copper base alloys in a geothermal brine. SPE Paper No. 7881

    Energy Technology Data Exchange (ETDEWEB)

    Miller, R.L.

    1979-01-01

    The geothermal environment and the experimental procedures and schedules for corrosion tests of copper-base alloys are described. Corrosive attack on these materials was mostly uniform. Some selective leaching of alloying elements was observed, as was crevice corrosion, but the extent of these forms of corrosion was minor. The results of these tests show a trend toward higher corrosion rates with increasing copper content, for the brass alloys. Commercially pure copper, however, showed corrosion rates 20 to 30% of that suggested by the trend in the data. One copper--nickel alloy was tested to verify earlier test data; this alloy showed a corrosion rate about six times that of a brass of similar copper content. The primary agent of the corrosive attack was hydrogen sulfide, present in the water in trace amounts. The primary conclusion from these tests is that copper--zinc alloys are the most economical materials for boiler and preheater construction. The recommendation is made that materials be selected from these brasses: naval brass, yellow brass, admiralty brass, and copper, in this order of decreasing desirability. Aluminum brass and red brass are marginally acceptable. Copper--nickel alloys are unacceptable for boiler and preheater heat exchangers.

  12. Blanch Resistant and Thermal Barrier NiAl Coating Systems for Advanced Copper Alloys

    Science.gov (United States)

    Raj, Sai V. (Inventor)

    2005-01-01

    A method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the cleansed surface of the copper alloy, depositing a NiAl top coat on the bond coat and consolidating the bond coat and the NiAl top coat to form the thermal barrier coating. The bond coat may be a nickel layer or a layer composed of at least one of copper and chromium-copper alloy and either the bond coat or the NiAl top coat or both may be deposited using a low pressure or vacuum plasma spray.

  13. Mechanism of Bainite Nucleation in Steel, Iron and Copper Alloys

    Institute of Scientific and Technical Information of China (English)

    Mokuang KANG; Ming ZHU; Mingxing ZHANG

    2005-01-01

    During the incubation period of isothermal treatment(or aging) within the bainitic transformation temperature range in a salt bath (or quenching in water) immediately after solution treatment, not only are the defects formed at high temperatures maintained, but new defects can also be generated in alloys, iron alloys and steels. Due to the segregation of the solute atoms near defects through diffusion, this leads to non-uniform distributions of solute atoms in the parent phase with distinct regions of both solute enrichment and solute depletion. It is proposed that when the Ms temperature at the solute depleted regions is equal to or higher than the isothermal (or aged) temperature,nucleation of bainite occurs within these solute depleted regions in the manner of martensitic shear. Therefore it is considered that, at least in steel, iron and copper alloy systems, bainite is formed through a shear mechanism within solute depleted regions, which is controlled and formed by the solute atoms diffusion in the parent phase.

  14. Antimicrobial copper alloy surfaces are effective against vegetative but not sporulated cells of gram-positive Bacillus subtilis

    OpenAIRE

    San, Kaungmyat; Long, Janet; Michels, Corinne A.; Gadura, Nidhi

    2015-01-01

    This study explores the role of membrane phospholipid peroxidation in the copper alloy mediated contact killing of Bacillus subtilis, a spore-forming gram-positive bacterial species. We found that B. subtilis endospores exhibited significant resistance to copper alloy surface killing but vegetative cells were highly sensitive to copper surface exposure. Cell death and lipid peroxidation occurred in B. subtilis upon copper alloy surface exposure. In a sporulation-defective strain carrying a de...

  15. Microstructures of ancient and modern cast silver–copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Northover, S.M., E-mail: s.m.northover@open.ac.uk [Materials Engineering, The Open University, Walton Hall, Milton Keynes MK7 6AA (United Kingdom); Northover, J.P., E-mail: peter.northover@materials.ox.ac.uk [Department of Materials, University of Oxford, Parks Rd, Oxford OX1 3PH,UK (United Kingdom)

    2014-04-01

    The microstructures of modern cast Sterling silver and of cast silver objects about 2500 years old have been compared using optical microscopy (OM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), scanning transmission electron microscopy (STEM), energy dispersive X-ray microanalysis (EDX) and electron backscatter diffraction (EBSD). Microstructures of both ancient and modern alloys were typified by silver-rich dendrites with a few pools of eutectic and occasional cuprite particles with an oxidised rim on the outer surface. EBSD showed the dendrites to have a complex internal structure, often involving extensive twinning. There was copious intragranular precipitation within the dendrites, in the form of very fine copper-rich rods which TEM, X-ray diffraction (XRD), SEM and STEM suggest to be of a metastable face-centred-cubic (FCC) phase with a cube–cube orientation relationship to the silver-rich matrix but a higher silver content than the copper-rich β in the eutectic. Samples from ancient objects displayed a wider range of microstructures including a fine scale interpenetration of the adjoining grains not seen in the modern material. Although this study found no unambiguous evidence that this resulted from microstructural change produced over archaeological time, the copper supersaturation remaining after intragranular precipitation suggests that such changes, previously proposed for wrought and annealed material, may indeed occur in ancient silver castings. - Highlights: • Similar twinned structures and oxidised surfaces seen in ancient and modern cast silver • General precipitation of fine Cu-rich rods apparently formed by discontinuous precipitation is characteristic of as-cast silver. • The fine rods are cube-cube related to the matrix in contrast with the eutectic. • The silver-rich phase remains supersaturated with copper. • Possibly age-related grain boundary features seen in ancient cast silver.

  16. Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

    Energy Technology Data Exchange (ETDEWEB)

    Huang, C.A. [Department of Mechanical Engineering, Chang Gung University, Taoyuan, Taiwan (China)], E-mail: gfehu@mail.cgu.edu.tw; Wang, T.H. [Department of Mechanical Engineering, Chang Gung University, Taoyuan, Taiwan (China); Weirich, T. [Gemeinschaeftslabor fuer Elektronenmikroskopie, RWTH Aachen (Germany); Neubert, V. [Zentrum fuer Funktionswerkstoe GmbH, Clausthal-Zellerfeld (Germany)

    2008-05-15

    An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.

  17. Membrane lipid peroxidation in copper alloy-mediated contact killing of Escherichia coli.

    Science.gov (United States)

    Hong, Robert; Kang, Tae Y; Michels, Corinne A; Gadura, Nidhi

    2012-03-01

    Copper alloy surfaces are passive antimicrobial sanitizing agents that kill bacteria, fungi, and some viruses. Studies of the mechanism of contact killing in Escherichia coli implicate the membrane as the target, yet the specific component and underlying biochemistry remain unknown. This study explores the hypothesis that nonenzymatic peroxidation of membrane phospholipids is responsible for copper alloy-mediated surface killing. Lipid peroxidation was monitored with the thiobarbituric acid-reactive substances (TBARS) assay. Survival, TBARS levels, and DNA degradation were followed in cells exposed to copper alloy surfaces containing 60 to 99.90% copper or in medium containing CuSO(4). In all cases, TBARS levels increased with copper exposure levels. Cells exposed to the highest copper content alloys, C11000 and C24000, exhibited novel characteristics. TBARS increased immediately at a very rapid rate but peaked at about 30 min. This peak was associated with the period of most rapid killing, loss in membrane integrity, and DNA degradation. DNA degradation is not the primary cause of copper-mediated surface killing. Cells exposed to the 60% copper alloy for 60 min had fully intact genomic DNA but no viable cells. In a fabR mutant strain with increased levels of unsaturated fatty acids, sensitivity to copper alloy surface-mediated killing increased, TBARS levels peaked earlier, and genomic DNA degradation occurred sooner than in the isogenic parental strain. Taken together, these results suggest that copper alloy surface-mediated killing of E. coli is triggered by nonenzymatic oxidative damage of membrane phospholipids that ultimately results in the loss of membrane integrity and cell death.

  18. Effects of zinc on static and dynamic mechanical properties of copper-zinc alloy

    Institute of Scientific and Technical Information of China (English)

    马志超; 赵宏伟; 鲁帅; 程虹丙

    2015-01-01

    The effects of adding alloy element zinc on the static and dynamic mechanical properties of copper-zinc alloy were investigated. Tensile and low cycle fatigue behaviors of the C11000 copper and H63 copper-zinc alloy were obtained by using a miniature tester that combined the functions of in situ tensile and fatigue testing. A piezoelectric actuator was adopted as the actuator for the fatigue testing, and the feasibility of the fatigue actuator was verified by the transient harmonic response analysis based on static tensile preload and dynamic sinusoidal load. The experimental results show that the yield strength and tensile strength of the C11000 copper are improved after adding 37% (mass fraction) zinc, and H63 copper-zinc alloy presents more obvious cyclic hardening behavior and more consumed irreversible plastic work during each stress cycle compared with C11000 copper for the same strain controlled cycling. Additionally, based on the Manson-Coffin theory, the strain-life equations of the two materials were also obtained. C11000 copper and H63 copper-zinc alloy show transition life of 16832 and 1788 cycles, respectively.

  19. Influence of degree of deformation in rolling on anneal hardening effect of a cast copper alloy

    Indian Academy of Sciences (India)

    Svetlana Nestorovic; Desimir Markovic; Ljubica Ivanic

    2003-10-01

    This paper reports results of investigations carried out on a cast copper alloy containing 8 at.% Al. The alloy, and pure copper for the sake of comparison, were subjected to cold rolling with a final reduction of 30, 50 or 70%. The cold rolled copper and copper alloy samples were isochronally and isothermally annealed up to the recrystallization temperature. The hardness, strength and electrical conductivity were measured and X-ray and DSC analyses performed. Anneal hardening effect was observed in the alloy in the temperature range 180–300°C, followed by an increase in the electrical conductivity. The amount of strengthening increases with increasing degree of prior cold work. The X-ray analysis shows a change in the lattice parameter during annealing when anneal hardening effect was observed. The DSC analysis shows the exothermic character of this effect.

  20. Laser cladding of Ni-based alloy on copper substrate

    Institute of Scientific and Technical Information of China (English)

    Fang Liu; Changsheng Liu; Xingqi Tao; Suiyuan Chen

    2006-01-01

    The laser cladding of Ni1015 alloy on Cu substrate was prepared by a high power continuous wave CO2 laser. Its microstructure was analyzed by optical microscope (OM), scanning electron microscope (SEM), and X-Ray diffraction (XRD). The average microhardness of the cladding coating was Hv 280, which was almost three times of that of the Cu substrate (Hv 85). OM and SEM observations showed that the obtained coating had a smooth and uniform surface, as well as a metallurgical combination with the Cu substrate without cracks and pores at the interface. With the addition of copper into the nickel-based alloy, the differences of thermal expansion coefficient and melting point between the interlayer and cladding were reduced, which resulted in low stresses during rapid cooling. Moreover, large amount of (Cu, Ni) solid solution formed a metallurgical bonding between the cladding coating and the substrate, which also relaxed the stresses, leading to the reduction of interfacial cracks and pores after laser cladding.

  1. Membrane Lipid Peroxidation in Copper Alloy-Mediated Contact Killing of Escherichia coli

    OpenAIRE

    Hong,Robert; Kang, Tae Y.; Michels, Corinne A.; Gadura, Nidhi

    2012-01-01

    Copper alloy surfaces are passive antimicrobial sanitizing agents that kill bacteria, fungi, and some viruses. Studies of the mechanism of contact killing in Escherichia coli implicate the membrane as the target, yet the specific component and underlying biochemistry remain unknown. This study explores the hypothesis that nonenzymatic peroxidation of membrane phospholipids is responsible for copper alloy-mediated surface killing. Lipid peroxidation was monitored with the thiobarbituric acid-r...

  2. Density Of The Copper-Rich Cu-Pb-Fe Alloys

    Directory of Open Access Journals (Sweden)

    Sak T.

    2015-09-01

    Full Text Available Density of the copper-rich corner of the ternary Cu-Pb-Fe alloys was determined with the dilatometric method. Investigated alloys had constant copper content equal to 0.9, 0.8 and 0.7 mole fraction, and varied iron concentration up to 0.1 mole fraction. A model predicting the density of ternary solution from knowledge of density of pure component and the excess of molar volume for limiting binaries is proposed.

  3. Fracture toughness of copper-base alloys for ITER applications: A preliminary report

    Energy Technology Data Exchange (ETDEWEB)

    Alexander, D.J.; Zinkle, S.J.; Rowcliffe, A.F. [Oak Ridge National Lab., TN (United States)

    1997-04-01

    Oxide-dispersion strengthened copper alloys and a precipitation-hardened copper-nickel-beryllium alloy showed a significant reduction in toughness at elevated temperature (250{degrees}C). This decrease in toughness was much larger than would be expected from the relatively modest changes in the tensile properties over the same temperature range. However, a copper-chromium-zirconium alloy strengthened by precipitation showed only a small decrease in toughness at the higher temperatures. The embrittled alloys showed a transition in fracture mode, from transgranular microvoid coalescence at room temperature to intergranular with localized ductility at high temperatures. The Cu-Cr-Zr alloy maintained the ductile microvoid coalescence failure mode at all test temperatures.

  4. Evolution of Microstructures During Austempering of Ductile Irons Alloyed with Manganese and Copper

    Science.gov (United States)

    Dasgupta, Ranjan Kumar; Mondal, Dipak Kumar; Chakrabarti, Ajit Kumar

    2013-03-01

    The influences of relatively high manganese (0.45 through 1.0 wt pct) and copper (0.56 through 1.13 wt pct) contents on microstructure development and phase transformation in three austempered ductile irons have been studied. The experimental ductile irons alloyed with copper and manganese are found to be practically free from intercellular manganese segregation. This suggests that the positive segregation of manganese is largely neutralized by the negative segregation of copper when these alloying elements are added in appropriate proportions. The drop in unreacted austenite volume (UAV) with increasing austempering temperature and time is quite significant in irons alloyed with copper and manganese. The ausferrite morphology also undergoes a transition from lenticular to feathery appearance of increasing coarseness with the increasing austempering temperature and time. SEM micrographs of the austempered samples from the base alloy containing manganese only, as well as copper plus manganese-alloyed irons, clearly reveal the presence of some martensite along with retained austenite and ferrite. X-ray diffraction analysis also confirms the presence of these phases. SEM examination further reveals the presence of twinned martensite in the copper plus manganese-alloyed samples. The possibility of strain-induced transformation of austenite to martensite during austempering heat treatment is suggested.

  5. Defect microstructure in copper alloys irradiated with 750 MeV protons

    DEFF Research Database (Denmark)

    Zinkle, S.J.; Horsewell, A.; Singh, B.N.

    1994-01-01

    Transmission electron microscopy (TEM) disks of pure copper and solid solution copper alloys containing 5 at% of Al, Mn, or Ni were irradiated with 750 MeV protons to damage levels between 0.4 and 2 displacements per atom (dpa) at irradiation temperatures between 60 and 200 degrees C. The defect ...

  6. Electrochemical studies of copper, nickel and a Cu55/Ni45 alloy in aqueous sodium acetate

    Directory of Open Access Journals (Sweden)

    Gonçalves Reinaldo Simões

    2001-01-01

    Full Text Available This paper discusses the electrochemical behavior of copper, nickel and a copper/nickel alloy in aerated aqueous 0.10 and 1.0 mol L-1 sodium acetate. The data obtained from different electrochemical techniques were analyzed to determine the influence of Ni and Cu on the electrochemical processes of the alloy electrode. The shapes of the potentiodynamic I(E curves of the alloy were found to be quite similar to those of the Ni voltamograms. Although the anodic current densities of Ni and the alloy increased with greater concentrations of acetate, the opposite effect occurred in Cu. The impedance measurements taken at the open circuit potential revealed that the polarization resistance (R P of the electrodes decreased in the following order: Ni > Alloy > Cu. With increasing concentrations of acetate, the R P of the alloy and the Cu increased while that of the Ni electrode decreased.

  7. Laser Surface Alloying of Copper, Manganese, and Magnesium with Pure Aluminum Substrate

    Science.gov (United States)

    Jiru, Woldetinsay G.; Sankar, M. Ravi; Dixit, Uday S.

    2016-03-01

    Laser surface alloying is one of the recent technologies used in the manufacturing sector for improving the surface properties of the metals. Light weight materials like aluminum alloys, titanium alloys, and magnesium alloys are used in the locomotive, aerospace, and structural applications. In the present work, an experimental study was conducted to improve the surface hardness of commercially pure aluminum plate. CO2 laser is used to melt pre-placed powders of pure copper, manganese, and magnesium. Microstructure of alloyed surface was analyzed using optical microscope. The best surface alloying was obtained at the optimum values of laser parameters, viz., laser power, scan speed, and laser beam diameter. In the alloyed region, microhardness increased from 30 HV0.5 to 430 HV0.5, while it was 60 HV0.5 in the heat-affected region. Tensile tests revealed some reduction in the strength and total elongation due to alloying. On the other hand, corrosion resistance improved.

  8. Simulation analysis of minimum bending radius for lead frame copper alloys

    OpenAIRE

    Su, Juanhua; Shuguo, Jia; Fengzhang, Ren

    2013-01-01

    Copper alloy has a lot of excellent properties, so it becomes an important alloy for lead frame materials for the integrated circuit. The minimum bending radius of three different copper alloys (Cu-Fe-P, Cu-Ni-Si, Cu-Cr-Sn-Zn) for lead frame materials was analyzed by using finite element. Tensile tests for the three kinds of materials were done to obtain yield stress, ultimate strength and other parameters. The strain-hardening exponent n and normal anisotropy index r of the materials were ob...

  9. Copper, Aluminum and Nickel: A New Monocrystalline Orthodontic Alloy

    Science.gov (United States)

    Wierenga, Mark

    Introduction: This study was designed to evaluate, via tensile and bend testing, the mechanical properties of a newly-developed monocrystalline orthodontic archwire comprised of a blend of copper, aluminum, and nickel (CuAlNi). Methods: The sample was comprised of three shape memory alloys; CuAlNi, copper nickel titanium (CuNiTi), and nickel titanium (NiTi); from various orthodontic manufacturers in both 0.018" round and 0.019" x 0.025" rectangular dimensions. Additional data was gathered for similarly sized stainless steel and beta-titanium archwires as a point of reference for drawing conclusions about the relative properties of the archwires. Measurements of loading and unloading forces were recorded in both tension and deflection testing. Repeated-measure ANOVA (alpha= 0.05) was used to compare loading and unloading forces across wires and one-way ANOVA (alpha= 0.05) was used to compare elastic moduli and hysteresis. To identify significant differences, Tukey post-hoc comparisons were performed. Results: The modulus of elasticity, deflection forces, and hysteresis profiles of CuAlNi were significantly different than the other superelastic wires tested. In all tests, CuAlNi had a statistically significant lower modulus of elasticity compared to the CuNiTi and NiTi wires (P <0.0001). The CuAlNi wire exhibited significantly lower loading and unloading forces than any other wire tested. In round wire tensile tests, loading force at all deflections was significantly lower for CuAlNi than CuNiTi or NiTi (P <0.0001). In tensile testing, the CuAlNi alloy was able to recover from a 7 mm extension (10% elongation) without permanent deformation and with little to no loss in force output. In large-deflection bend tests at 4, 5, and 6 mm deflection, CuAlNi showed the significantly lowest loading forces across the three wire materials (P <0.0001). The NiTi wires showed up to 12 times the amount of energy loss due to hysteresis compared to CuAlNi. CuAlNi showed a hysteresis

  10. Electrochemical formation of holmium-copper alloys on copper cathode in molten KCl-HoCl3

    Institute of Scientific and Technical Information of China (English)

    SU Yu-zhi; YANG Qi-qin; LIU Guan-kun

    2006-01-01

    Cyclic voltammetry, open circuit potential-time curve after potentiostatic electrolysis and potential step chronoamperometry were used to investigate the electrochemical formation processes of holmium-copper alloys on copper cathode in molten HoCl3-KCl. Intermetallic compounds HoCu5, HoCu4, HoCu2 and HoCu are formed in sequence and then the metallic Ho is deposited when Ho3+ is reduced on copper electrode in molten KCl-HoCl3 at 1 066 K. The first charge-transfer reaction is reversible. The structure of holmium-copper alloy film deposited on copper electrode by potentiostatic electrolysis was characterized by X-ray diffraction. The standard free energies of formation for the intermetallic compounds HoCu5, HoCu4, HoCu2 and HoCu are -95.5, -92.6, -73.8 and -44.0 kJ/mol, respectively. The diffusion coefficient and diffusion activation energy of Ho atom in the alloy are estimated to be 10-10-10-11 cm2/s and 75.35 kJ/mol, respectively, from the chronoamperometry data.

  11. Effect of laser treatment on the surface of copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Garbacz, Halina, E-mail: hgarbacz@inmat.pw.edu.pl [Warsaw University of Technology, Faculty of Materials Science and Engineering, Woloska 141, 02-507 Warsaw (Poland); Fortuna-Zalesna, Elzbieta [Warsaw University of Technology, Faculty of Materials Science and Engineering, Woloska 141, 02-507 Warsaw (Poland); Marczak, Jan [Military University of Technology, Institute of Optoelectronics, Gen. S. Kaliskiego 2, 00-908 Warsaw (Poland); Koss, Andrzej; Zatorska, Anna [Academy of Fine Arts in Warsaw, Inter-Academy Institute for Conservation and Restoration of Works of Art, Wybrzeze Kosciuszkowskie 37, 00-379 Warsaw (Poland); Zukowska, Grazyna Z. [Warsaw University of Technology, Faculty of Chemistry, Noakowskiego 3, 00-664 Warsaw (Poland); Onyszczuk, Tomasz; Kurzydlowski, Krzysztof J. [Warsaw University of Technology, Faculty of Materials Science and Engineering, Woloska 141, 02-507 Warsaw (Poland)

    2011-06-15

    The paper presents the results of laser cleaning of the archaeological metal objects using two time widths of pulsed laser radiation, which are around 150 {mu}s and around 120 ns. Two archaeological objects made of copper alloys were studied: a bow and a ring. Both objects came from a cemetery which is located in the garden complex of Wilanow Palace in Warsaw and are dated from XII to XIII century. The bow and bronze ring had ornamental longitudinal grooving and were part of burial jewellery. The materials of which these artefacts were made of, as well as corrosion products on these objects, were studied by using a variety of analytical techniques. The phase composition of the corrosion layers was determined by using Raman spectroscopy. The surface topography as well as the chemical composition of the deposits and cleaned surfaces were investigated. The samples were examined using scanning electron microscopes equipped with EDS. The investigations included observations in SE and BSE modes and point analyses of the chemical composition by EDS.

  12. Brazing development and interfacial metallurgy study of tungsten and copper joints with eutectic gold copper brazing alloy

    Energy Technology Data Exchange (ETDEWEB)

    Easton, David, E-mail: david.easton@strath.ac.uk [University of Strathclyde, Department of Mechanical Engineering, Glasgow G1 1XJ (United Kingdom); Zhang, Yuxuan; Wood, James; Galloway, Alexander; Robbie, Mikael Olsson [University of Strathclyde, Department of Mechanical Engineering, Glasgow G1 1XJ (United Kingdom); Hardie, Christopher [Culham Centre for Fusion Energy CCFE, Culham Science Centre, Oxfordshire OX14 3DB (United Kingdom)

    2015-10-15

    Highlights: • A eutectic gold–copper brazing alloy has been successfully used to produce a highly wetted brazed joint between tungsten and copper. • Relevant materials for fusion applications. • Mechanical testing of W–AuCu–Cu soon to be performed. - Abstract: Current proposals for the divertor component of a thermonuclear fusion reactor include tungsten and copper as potentially suitable materials. This paper presents the procedures developed for the successful brazing of tungsten to oxygen free high conductivity (OFHC) copper using a fusion appropriate gold based brazing alloy, Orobraze 890 (Au80Cu20). The objectives were to develop preparation techniques and brazing procedures in order to produce a repeatable, defect free butt joint for tungsten to copper. Multiple brazing methods were utilised and brazing parameters altered to achieve the best joint possible. Successful and unsuccessful brazed specimens were sectioned and analysed using optical and scanning electron microscopy, EDX analysis and ultrasonic evaluation. It has been determined that brazing with Au80Cu20 has the potential to be a suitable joining method for a tungsten to copper joint.

  13. Surface microstructures and antimicrobial properties of copper plasma alloyed stainless steel

    Energy Technology Data Exchange (ETDEWEB)

    Zhang Xiangyu; Huang Xiaobo; Jiang Li; Ma Yong; Fan Ailan [Research Institute of Surface Engineering, Taiyuan University of Technology, Taiyuan 030024 (China); Tang Bin, E-mail: tangbin@tyut.edu.cn [Research Institute of Surface Engineering, Taiyuan University of Technology, Taiyuan 030024 (China)

    2011-12-01

    Bacterial adhesion to stainless steel surfaces is one of the major reason causing the cross-contamination and infection in many practical applications. An approach to solve this problem is to enhance the antibacterial properties on the surface of stainless steel. In this paper, novel antibacterial stainless steel surfaces with different copper content have been prepared by a plasma surface alloying technique at various gas pressures. The microstructure of the alloyed surfaces was investigated using glow discharge optical emission spectroscopy (GDOES) and scanning electron microscopy (SEM). The viability of bacteria attached to the antibacterial surfaces was tested using the spread plate method. The antibacterial mechanism of the alloyed surfaces was studied by X-ray photoelectron spectroscopy (XPS). The results indicate that gas pressure has a great influence on the surface elements concentration and the depth of the alloyed layer. The maximum copper concentration in the alloyed surface obtained at the gas pressure of 60 Pa is about 7.1 wt.%. This alloyed surface exhibited very strong antibacterial ability, and an effective reduction of 98% of Escherichia coli (E. coli) within 1 h was achieved by contact with the alloyed surface. The maximum thickness of the copper alloyed layer obtained at 45 Pa is about 6.5 {mu}m. Although the rate of reduction for E. coli of this alloyed surface was slower than that of the alloyed surface with the copper content about 7.1 wt.% over the first 3 h, few were able to survive more than 12 h and the reduction reached over 99.9%. The XPS analysis results indicated that the copper ions were released when the copper alloyed stainless steel in contact with bacterial solution, which is an important factor for killing bacteria. Based on an overall consideration of bacterial killing rate and durability, the alloyed surface with the copper content of 2.5 wt.% and the thickness of about 6.5 {mu}m obtained at the gas pressure of 45 Pa is

  14. Surface microstructures and antimicrobial properties of copper plasma alloyed stainless steel

    Science.gov (United States)

    Zhang, Xiangyu; Huang, Xiaobo; Jiang, Li; Ma, Yong; Fan, Ailan; Tang, Bin

    2011-12-01

    Bacterial adhesion to stainless steel surfaces is one of the major reason causing the cross-contamination and infection in many practical applications. An approach to solve this problem is to enhance the antibacterial properties on the surface of stainless steel. In this paper, novel antibacterial stainless steel surfaces with different copper content have been prepared by a plasma surface alloying technique at various gas pressures. The microstructure of the alloyed surfaces was investigated using glow discharge optical emission spectroscopy (GDOES) and scanning electron microscopy (SEM). The viability of bacteria attached to the antibacterial surfaces was tested using the spread plate method. The antibacterial mechanism of the alloyed surfaces was studied by X-ray photoelectron spectroscopy (XPS). The results indicate that gas pressure has a great influence on the surface elements concentration and the depth of the alloyed layer. The maximum copper concentration in the alloyed surface obtained at the gas pressure of 60 Pa is about 7.1 wt.%. This alloyed surface exhibited very strong antibacterial ability, and an effective reduction of 98% of Escherichia coli (E. coli) within 1 h was achieved by contact with the alloyed surface. The maximum thickness of the copper alloyed layer obtained at 45 Pa is about 6.5 μm. Although the rate of reduction for E. coli of this alloyed surface was slower than that of the alloyed surface with the copper content about 7.1 wt.% over the first 3 h, few were able to survive more than 12 h and the reduction reached over 99.9%. The XPS analysis results indicated that the copper ions were released when the copper alloyed stainless steel in contact with bacterial solution, which is an important factor for killing bacteria. Based on an overall consideration of bacterial killing rate and durability, the alloyed surface with the copper content of 2.5 wt.% and the thickness of about 6.5 μm obtained at the gas pressure of 45 Pa is expected

  15. Perfect cubic texture, structure, and mechanical properties of nonmagnetic copper-based alloy ribbon substrates

    Science.gov (United States)

    Khlebnikova, Yu. V.; Rodionov, D. P.; Gervas'eva, I. V.; Egorova, L. Yu.; Suaridze, T. R.

    2015-03-01

    A sharp cubic texture is formed in a number of copper alloys subjected to cold deformation by rolling by 98.6-99% followed by recrystallization annealing, which opens up fresh opportunities for long thin ribbons made of these alloys to be used as substrates in the production of second-generation high- T c superconductor (2G HTSC) cables. The possibility of creating ternary alloys based on a binary Cu-30 at % Ni alloy with additional elements that harden its fcc matrix (iron, chromium) is shown. The measurements of the mechanical properties of textured ribbons made of these alloys demonstrate that their yield strength is higher than that of a textured ribbon made of pure copper by a factor of 2.5-4.5.

  16. Odontologic use of copper/aluminum alloys: mitochondrial respiration as sensitive parameter of biocompatibility

    Directory of Open Access Journals (Sweden)

    Rodrigues Luiz Erlon A.

    2003-01-01

    Full Text Available Copper/aluminum alloys are largely utilized in odontological restorations because they are less expensive than gold or platinum. However, tarnishing and important corrosion in intrabuccal prostheses made with copper/aluminum alloys after 28 days of use have been reported. Several kinds of food and beverage may attack and corrode these alloys. Copper is an essential component of several important enzymes directly involved in mitochondrial respiratory metabolism. Aluminum, in contrast, is very toxic and, when absorbed, plasma values as small as 1.65 to 21.55 mg/dl can cause severe lesions to the nervous system, kidneys, and bone marrow. Because mitochondria are extremely sensitive to minimal variation of cellular physiology, the direct relationship between the mitocondrial respiratory chain and cell lesions has been used as a sensitive parameter to evaluate cellular aggression by external agents. This work consisted in the polarographic study of mitochondrial respiratory metabolism of livers and kidneys of rabbits with femoral implants of titanium or copper/aluminum alloy screws. The experimental results obtained did not show physiological modifications of hepatic or renal mitochondria isolated from animals of the three experimental groups, which indicate good biocompatibility of copper/aluminum alloys and suggest their odontological use.

  17. A new antibacterial titanium-copper sintered alloy: preparation and antibacterial property.

    Science.gov (United States)

    Zhang, Erlin; Li, Fangbing; Wang, Hongying; Liu, Jie; Wang, Chunmin; Li, Muqin; Yang, Ke

    2013-10-01

    Copper element was added in pure titanium by a powder metallurgy to produce a new antibacterial titanium-copper alloy (Ti-Cu alloy). This paper reported the very early stage results, emphasizing on the preparation, mechanical property and antibacterial activity. The phase constitution was analyzed by XRD and the microstructure was observed under SEM equipped with EDS. The hardness, the compressive strength and the corrosion resistance of Ti-Cu alloy were tested in comparison with cp-Ti. The antibacterial property of the Ti-Cu alloy was assessed by two methods: agar diffusion assay and plate-count method, in which Staphylococcus aureus (S. aureus) and Escherichia coli (E. coli) were used. XRD and SEM results showed that Ti2Cu phase and Cu-rich phase were synthesized in the Ti-Cu sintered alloy, which significantly increases the hardness and the compressive strength compared with cp-Ti and slightly improves the corrosion resistance. No antibacterial activity was detected by the agar diffusion assay on the Ti-Cu alloy, but the plate-count results indicated that the Ti-Cu alloy exhibited strong antibacterial property against both bacteria even after three polishing treatments, which demonstrates strongly that the whole alloy is of antibacterial activity. The antibacterial mechanism was thought to be in associated with the Cu ion released from the Ti-Cu alloy. © 2013.

  18. Stability and structure of nanowires grown from silver, copper and their alloys by laser ablation into superfluid helium.

    Science.gov (United States)

    Gordon, Eugene; Karabulin, Alexander; Matyushenko, Vladimir; Sizov, Vyacheslav; Khodos, Igor

    2014-12-14

    Nanowires with 5 nm diameter made of silver, copper, and their alloys were grown in superfluid helium. The silver nanowires being heated to 300 K disintegrated into individual clusters. In contrast, copper nanowires were stable at room temperature, and nanowires made of alloys were also stable despite their low melting temperature.

  19. The interfacial structure of plated copper alloy resistance spot welded joint

    Science.gov (United States)

    Wu, Jingwei; Zhai, Guofu; Chen, Qing; Wang, Jianqi; Ren, Gang

    2008-09-01

    Plated copper alloys are widely used in electron industry. The plating lay caused the farther decreasing of the welding property of copper alloys, whose intrinsic weldability was poor. In this paper, the bronze and brass specimens with nickel-tin double plating layer were joined by resistance spot welding method. The microstructure and peel strength of the joints were investigated. The experiment results show that a sandwich-like structure was obtained in the faying surface after welding, and the nickel plating layer thickness had severe effect on the reliability of the joints.

  20. The interfacial structure of plated copper alloy resistance spot welded joint

    Energy Technology Data Exchange (ETDEWEB)

    Wu Jingwei [Xiamen Hongfa Electroacoustic Co., Ltd, 361021 Xiamen (China); Harbin Institute of Technology, 150001 Harbin (China)], E-mail: jingweiwu.hit@gmail.com; Zhai Guofu [Harbin Institute of Technology, 150001 Harbin (China); Chen Qing; Wang Jianqi; Ren Gang [Xiamen Hongfa Electroacoustic Co., Ltd, 361021 Xiamen (China)

    2008-09-15

    Plated copper alloys are widely used in electron industry. The plating lay caused the farther decreasing of the welding property of copper alloys, whose intrinsic weldability was poor. In this paper, the bronze and brass specimens with nickel-tin double plating layer were joined by resistance spot welding method. The microstructure and peel strength of the joints were investigated. The experiment results show that a sandwich-like structure was obtained in the faying surface after welding, and the nickel plating layer thickness had severe effect on the reliability of the joints.

  1. Beryllium and copper-beryllium alloys; Beryllium und Kupfer-Beryllium-Legierungen

    Energy Technology Data Exchange (ETDEWEB)

    Nagel, Nikolaus [Materion Brush GmbH, Stuttgart (Germany). Operation and Quality/EH and S

    2017-02-15

    The light metal beryllium is a comparatively rare element, which today is primarily derived from bertrandite. It is mainly used as pure metal or in the form of copper-beryllium alloys, e.g., in automotive industry, aerospace, and electrical components. The wide range of applications is mainly attributed to the extremely high rigidity/density ratio. An overview of the history of the metal, its production, and recycling as well as the properties of CuBe alloys are given.

  2. EXPERIMENTAL INVESTIGATION ON ELECTRICAL DISCHARGE MACHINING OF TITANIUM ALLOY USING COPPER, BRASS AND ALUMINUM ELECTRODES

    Directory of Open Access Journals (Sweden)

    S. DHANABALAN

    2015-01-01

    Full Text Available In the present study, an evaluation has been done on Material Removal Rate (MRR, Surface Roughness (SR and Electrode Wear Rate (EWR during Electrical Discharge Machining (EDM of titanium alloy using copper, brass and aluminum electrodes. Analyzing previous work in this field, it is found that electrode wear and material removal rate increases with an increase current. It is also found that the electrode wear ratio increases with an increase in current. The higher wear ratio is found during machining of titanium alloy using a brass electrode. An attempt has been made to correlate the thermal conductivity and melting point of electrode with the MRR and electrode wear. The MRR is found to be high while machining titanium alloy using brass electrode. During machining of titanium alloy using copper electrodes, a comparatively smaller quantity of heat is absorbed by the work material due to low thermal conductivity. Due to the above reason, the MRR becomes very low. Duringmachining of titanium alloy using aluminium electrodes, the material removal rate and electrode wear rate are only average value while machining of titanium alloy using brass and copper electrodes.

  3. Ultrafine-Grained Precipitation Hardened Copper Alloys by Swaging or Accumulative Roll Bonding

    Directory of Open Access Journals (Sweden)

    Igor Altenberger

    2015-05-01

    Full Text Available There is an increasing demand in the industry for conductive high strength copper alloys. Traditionally, alloy systems capable of precipitation hardening have been the first choice for electromechanical connector materials. Recently, ultrafine-grained materials have gained enormous attention in the materials science community as well as in first industrial applications (see, for instance, proceedings of NANO SPD conferences. In this study the potential of precipitation hardened ultra-fine grained copper alloys is outlined and discussed. For this purpose, swaging or accumulative roll-bonding is applied to typical precipitation hardened high-strength copper alloys such as Corson alloys. A detailed description of the microstructure is given by means of EBSD, Electron Channeling Imaging (ECCI methods and consequences for mechanical properties (tensile strength as well as fatigue and electrical conductivity are discussed. Finally the role of precipitates for thermal stability is investigated and promising concepts (e.g. tailoring of stacking fault energy for grain size reduction and alloy systems for the future are proposed and discussed. The relation between electrical conductivity and strength is reported.

  4. Removal of brownish-black tarnish on silver–copper alloy objects with sodium glycinate

    Energy Technology Data Exchange (ETDEWEB)

    Cura D’Ars de Figueiredo, João, E-mail: joaoc@ufmg.br; Asevedo, Samara Santos, E-mail: samaranix@hotmail.com; Barbosa, João Henrique Ribeiro, E-mail: joaohrb@yahoo.com.br

    2014-10-30

    Highlights: • The use of glycinate to remove brownish-black tarnish on silver–copper alloy objects is studied. • The method is easy to use and harmless. It is based in the coordination of Ag and Cu in tarnish with glycinate. • The surface of corroded silver objects and products of reaction were studied and glycinate showed to be very selective for Ag(I) and Cu(II). The selectivity for Ag(I) was studied by means of quantum chemical calculations. - Abstract: This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver–copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver–copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver–copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver–copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver–copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver–copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish

  5. Choice of copper-based alloys for ribbon substrates with a sharp cube texture

    Science.gov (United States)

    Khlebnikova, Yu. V.; Rodionov, D. P.; Gervas'eva, I. V.; Suaridze, T. R.; Akshentsev, Yu. N.; Kazantsev, V. A.

    2014-12-01

    It has been shown that, in some copper-based alloys subjected to cold deformation by rolling to 98.6-99% followed by recrystallization annealing, a sharp cube texture can be produced. Optimum conditions of annealing have been determined, which make it possible to produce a sharp biaxial texture in Cu-Ni, Cu-Fe, and Cu-Cr alloys with the fraction of cube grains of more than 95%; this opens a possibility of using thin ribbons made of these alloys as substrates for multilayer film compositions, in particular when developing second-generation high-temperature superconductors.

  6. The Effects of Test Temperature, Temper, and Alloyed Copper on the Hydrogen-Controlled Crack Growth Rate of an Al-Zn-Mg-(Cu) Alloy

    Energy Technology Data Exchange (ETDEWEB)

    G.A. Young, Jr.; J.R. Scully

    2000-09-17

    The hydrogen embrittlement controlled stage II crack growth rate of AA 7050 (6.09 wt.% Zn, 2.14 wt% Mg, 2.19 wt.% Cu) was investigated as a function of temper and alloyed copper level in a humid air environment at various temperatures. Three tempers representing the underaged, peak aged, and overaged conditions were tested in 90% relative humidity (RH) air at temperatures between 25 and 90 C. At all test temperatures, an increased degree of aging (from underaged to overaged) produced slower stage II crack growth rates. The stage II crack growth rate of each alloy and temper displayed Arrhenius-type temperature dependence with activation energies between 58 and 99 kJ/mol. For both the normal copper and low copper alloys, the fracture path was predominantly intergranular at all test temperatures (25-90 C) in each temper investigated. Comparison of the stage II crack growth rates for normal (2.19 wt.%) and low (0.06 wt.%) copper alloys in the peak aged and overaged tempers showed the beneficial effect of copper additions on stage II crack growth rate in humid air. In the 2.19 wt.% copper alloy, the significant decrease ({approx} 10 times at 25 C) in stage II crack growth rate upon overaging is attributed to an increase in the apparent activation energy for crack growth. IN the 0.06 wt.% copper alloy, overaging did not increase the activation energy for crack growth but did lower the pre-exponential factor, {nu}{sub 0}, resulting in a modest ({approx} 2.5 times at 25 C) decrease in crack growth rate. These results indicate that alloyed copper and thermal aging affect the kinetic factors that govern stage II crack growth rate. Overaged, copper bearing alloys are not intrinsically immune to hydrogen environment assisted cracking but are more resistant due to an increased apparent activation energy for stage II crack growth.

  7. Spin-density-wave magnetism in dilute copper-manganese alloys

    Energy Technology Data Exchange (ETDEWEB)

    Lamelas, F.J. [Marquette Univ., Milwaukee, WI (United States). Dept. of Physics; Werner, S.A. [Univ. of Missouri, Columbia, MO (United States). Dept. of Physics; Shapiro, S.M. [Brookhaven National Lab., Upton, NY (United States); Mydosh, J.A. [Kammerlingh Onnes Lab., Leiden (Netherlands)

    1995-02-01

    Elastic neutron-scattering measurements on two samples of Cu alloyed with 1.3% Mn and 0.55% Mn show that the spin-density-wave (SDW) features found in more concentrated alloys persist in the limit of very dilute alloys. These features consist of temperature-dependent incommensurate peaks in magnetic neutron scattering, with positions and strengths which are fully consistent with those in the concentrated alloys. The implications of these measurements are twofold. First, it is clear from this data that SDW magnetic ordering occurs across the entire range of CuMn alloys which have typically been interpreted as spin glasses. Second, the more fundamental significance of this work is the suggestion via extrapolation that a peak in the magnetic susceptibility x(q) occurs in pure copper, at a value of q given by the Fermi-surface diameter 2k{sub F}.

  8. Protection of Advanced Copper Alloys With Lean Cu-Cr Coatings

    Science.gov (United States)

    Greenbauer-Seng, L. (Technical Monitor); Thomas-Ogbuji, L.

    2003-01-01

    Advanced copper alloys are used as liners of rocket thrusters and nozzle ramps to ensure dissipation of the high thermal load generated during launch, and Cr-lean coatings are preferred for the protection of these liners from the aggressive ambient environment. It is shown that adequate protection can be achieved with thin Cu-Cr coatings containing as little as 17 percent Cr.

  9. Recent results for bonding S-65C grade Be to copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dombrowski, D.W. [Brush Wellman Inc., Cleveland, OH (United States)

    1995-09-01

    Novel processes for bonding beryllium to copper alloys without the use of a silver bonding aid have been developed at Brush Wellman. Tensile strength results will be presented at room temperature and elevated temperatures. A comparison will be made between bond strengths derived from rectangular tensile specimens and reduced section tensile specimens. Failure modes of the specimens at various temperatures will be shown.

  10. Polyol Synthesis of Cobalt–Copper Alloy Catalysts for Higher Alcohol Synthesis from Syngas

    DEFF Research Database (Denmark)

    Mendes, Laiza V.P.; Snider, Jonathan L.; Fleischman, Samuel D.

    2017-01-01

    Novel catalysts for the selective production of higher alcohols from syngas could offer improved pathways towards synthetic fuels and chemicals. Cobalt–copper alloy catalysts have shown promising results for this reaction. To improve control over particle properties, a liquid phase nanoparticle s...

  11. Laser forming of structures of zinc oxide on a surface of products from copper alloys

    Science.gov (United States)

    Abramov, D. V.; Gorudko, T. N.; Koblov, A. N.; Nogtev, D. S.; Novikova, O. A.

    Laser formation of a protective zinc oxide layer on a surface of products from copper alloys is present. This layer is formed with using of carbon nanotubes. Destructions of the basic material are avoided or minimized at laser nanostructuring of product surfaces. Such laser processing can be made repeatedly. Offered covering have self-clearing and water-repellent properties.

  12. The Corrosion Behavior of Stainless Steels and Copper Alloys Exposed to Natural Seawater

    Science.gov (United States)

    1991-01-01

    significant changes of the corrosion potential (Ecw) or surface properties. Rotating cylinder experiments indicated that both E., and corrosion rates for...and inorganic chloride corrosion layer that contained alloying elements; a biof ilm; and crystalline, spherical phosphate-rich deposits. All copper...nichtrostendem Stahl und bacteria and diatoms that did not cause significant changes of the Titan entstehenden dfinnen Biofilme bestanden aus

  13. Study of Titanizing the Surface of Copper Substrates by the Double Glow Discharge Plasma Surface Alloying Technique

    Institute of Scientific and Technical Information of China (English)

    Zhang Yuefei; Chen Fei; Lü Junxia; Su Yongan; Xu Zhong

    2005-01-01

    This paper discusses a study in which Ti surface alloying has been performed on copper substrates by means of a double glow discharge plasma surface alloying technique. The micro-structure, the phase structure, the micro-hardness and the distribution of Ti concentration of alloying layer were investigated in detail by XRD, SEM and so on. The effect of process parameters on the alloying layer was studied. The experimental results show that a Ti solid solution with the precipitation Cu4Ti alloying layer has been formed on the copper surface. The thickness of the alloying layer is about 120μm and the surface titanium concentration gradually decreases from w (Ti) = 87% to w (Ti) = 4%. The micro-hardness of the alloying layer is between 300 HV ~ 800 HV. Source sputtering, surface absorption, ion bombarding and high temperature diffusion are the major factors that affect the alloying layer.

  14. Laser cladding of stainless steel with a copper-silver alloy to generate surfaces of high antimicrobial activity

    Science.gov (United States)

    Hans, Michael; Támara, Juan Carlos; Mathews, Salima; Bax, Benjamin; Hegetschweiler, Andreas; Kautenburger, Ralf; Solioz, Marc; Mücklich, Frank

    2014-11-01

    Copper and silver are used as antimicrobial agents in the healthcare sector in an effort to curb infections caused by bacteria resistant to multiple antibiotics. While the bactericidal potential of copper and silver alone are well documented, not much is known about the antimicrobial properties of copper-silver alloys. This study focuses on the antibacterial activity and material aspects of a copper-silver model alloy with 10 wt% Ag. The alloy was generated as a coating with controlled intermixing of copper and silver on stainless steel by a laser cladding process. The microstructure of the clad was found to be two-phased and in thermal equilibrium with minor Cu2O inclusions. Ion release and killing of Escherichia coli under wet conditions were assessed with the alloy, pure silver, pure copper and stainless steel. It was found that the copper-silver alloy, compared to the pure elements, exhibited enhanced killing of E. coli, which correlated with an up to 28-fold increased release of copper ions. The results show that laser cladding with copper and silver allows the generation of surfaces with enhanced antimicrobial properties. The process is particularly attractive since it can be applied to existing surfaces.

  15. Inhibition effects of PMA/SbBr3 complex inhibitor on copper and copper-nickel alloy in LiBr solutions

    Institute of Scientific and Technical Information of China (English)

    HU Xian-qi; LIANG Cheng-hao; HUANG Nai-bao

    2005-01-01

    The effects of PMA/SbBr3 inhibitor on copper and copper-nickel alloy in 55%LiBr solution were investigated by chemical immersion and electrochemical measurements. The results indicate that in boiling 55% LiBr solution containing PMA/SbBr3 inhibitor, corrosion rates of copper and copper-nickel alloy are 67.48 μm/a and 38. 14μm/a, respectively. Since both anodic and cathodic electrochemical reactions can be inhibited, PMA/SbBr3 belongs to complex inhibitor. PMA has the effect of inhibiting hydrogen evolution and [PMo12 O40]3- , the anion of PMA,has a strong oxidizing effect. Sb3+ also shows an oxidizing effect. It may exist in LiBr solutions stably with PMA.Because of the synergistic effect of PMA and Sb3+ , a protective film, comprising CuO, Cu2O and Sb, formed on copper and copper-nickel alloy surface may prevent Br- from diffusing to the surface of metals. As a result, the anticorrosion performance of copper and copper-nickel alloy may be improved.

  16. Dealloying of gold–copper alloy nanowires: From hillocks to ring-shaped nanopores

    Directory of Open Access Journals (Sweden)

    Adrien Chauvin

    2016-09-01

    Full Text Available We report on a novel fabrication approach of metal nanowires with complex surface. Taking advantage of nodular growth triggered by the presence of surface defects created intentionally on the substrate as well as the high tilt angle between the magnetron source axis and the normal to the substrate, metal nanowires containing hillocks emerging out of the surface can be created. The approach is demonstrated for several metals and alloys including gold, copper, silver, gold–copper and gold–silver. We demonstrate that applying an electrochemical dealloying process to the gold–copper alloy nanowire arrays allows for transforming the hillocks into ring-like shaped nanopores. The resulting porous gold nanowires exhibit a very high roughness and high specific surface making of them a promising candidate for the development of SERS-based sensors.

  17. Recovery of Pb-Sn Alloy and Copper from Photovoltaic Ribbon in Spent Solar Module

    Science.gov (United States)

    Lee, Jin-Seok; Ahn, Young-Soo; Kang, Gi-Hwan; Wang, Jei-Pil

    2017-09-01

    This research was attempted to recover metal alloy and copper from photovoltaic ribbon (PV ribbon) of spent solar module by means of thermal treatment. In this study, thermal method newly proposed was applied to remove coating layer composed of tin and lead and separate copper substrate. Using thermal treatment under reductive gas atmosphere with CH4 gas coating layer was easily melted down at the range of temperature of 700 °C to 800 °C. In the long run, metal alloy and copper substrate were successfully obtained and their chemical compositions were examined by inductively coupled plasma mass spectrometry (ICP-MS), scanning electron microscopy (SEM) and energy dispersive x-ray Spectroscopy (EDS).

  18. A promising structure for fabricating high strength and high electrical conductivity copper alloys.

    Science.gov (United States)

    Li, Rengeng; Kang, Huijun; Chen, Zongning; Fan, Guohua; Zou, Cunlei; Wang, Wei; Zhang, Shaojian; Lu, Yiping; Jie, Jinchuan; Cao, Zhiqiang; Li, Tingju; Wang, Tongmin

    2016-02-09

    To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu5Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.

  19. Specification of properties and design allowables for copper alloys used in HHF components of ITER

    DEFF Research Database (Denmark)

    Kalinin, G.M.; Fabritziev, S.A.; Singh, B.N.;

    2002-01-01

    Two types of copper alloys, precipitation hardened (PH) Cu (CuCrZr-IG) and dispersion strengthened (DS) Cu (CuAl25-IG), are proposed as heat sink materials for the high heat flux (HHF) components of ITER. However, copper alloys are not included in any national codes, and properties of both Cu......CrZr and CuAl25 are not yet fully characterised. The performed R&D gives a basis for the specification of physical and mechanical properties required for the design analysis in accordance with the ITER Structural Design Criteria for In-vessel Components (SDC-IC). For both CuCrZr-IG and CuAl25-IG alloys...

  20. GRCop-84: A High-Temperature Copper Alloy for High-Heat-Flux Applications

    Science.gov (United States)

    Ellis, David L.

    2005-01-01

    GRCop-84 (Cu-8 at.% Cr-4 at.% Nb) is a new high-temperature copper-based alloy. It possesses excellent high-temperature strength, creep resistance and low-cycle fatigue up to 700 C (1292 F) along with low thermal expansion and good conductivity. GRCop-84 can be processed and joined by a variety of methods such as extrusion, rolling, bending, stamping, brazing, friction stir welding, and electron beam welding. Considerable mechanical property data has been generated for as-produced material and following simulated braze cycles. The data shows that the alloy is extremely stable during thermal exposures. This paper reviews the major GRCop-84 mechanical and thermophysical properties and compares them to literature values for a variety of other high-temperature copper-based alloys.

  1. EFFECT OF COPPER ON PASSIVITY AND CORROSION BEHAVIOR OF FE-XC-5CU ALLOY

    Directory of Open Access Journals (Sweden)

    M. Ferhat

    2014-06-01

    Full Text Available The correlation between corrosion behavior rate of annealed Fe-xC-5Cu alloys and their microstructure and phase composition is presented. The metallurgical analyses, including, X-Ray diffraction (XRD, the scanning electron microscopy (SEM with energy dispersive analysis (EDX, and induction hardening characterization are conducted to study the Fe-C-Cu alloys. Corrosion parameters in H2SO4 1N solution have been established by carrying out electrochemical studies such as potentiodynamic (Tafel polarization and linear polarization, LP and electrochemical impedance spectroscopy (EIS. The coupled effect copper/microstructure is discussed. Alloying Cu showed a beneficial effect on hypoeutectoid steel and harmful effect on hypereutectoid steel. The improved corrosion resistance is related to cementite morphology and by a copper dissolution/re-deposition process.

  2. EFFECT OF COPPER ON PASSIVITY AND CORROSION BEHAVIOR OF FE-XC-5CU ALLOY

    Directory of Open Access Journals (Sweden)

    M. Ferhat

    2015-07-01

    Full Text Available The correlation between corrosion behavior rate of annealed Fe-xC-5Cu alloys and their microstructure and phase composition is presented. The metallurgical analyses, including, X-Ray diffraction (XRD, the scanning electron microscopy (SEM with energy dispersive analysis (EDX, and induction hardening characterization are conducted to study the Fe-C-Cu alloys. Corrosion parameters in H2SO4 1N solution have been established by carrying out electrochemical studies such as potentiodynamic (Tafel polarization and linear polarization, LP and electrochemical impedance spectroscopy (EIS. The coupled effect copper/microstructure is discussed. Alloying Cu showed a beneficial effect on hypoeutectoid steel and harmful effect on hypereutectoid steel. The improved corrosion resistance is related to cementite morphology and by a copper dissolution/re-deposition process.

  3. Modeling the diffusion of solid copper into liquid solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Rizvi, M.J. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)], E-mail: rm77@gre.ac.uk; Lu, H.; Bailey, C. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)

    2009-01-01

    During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn-Pb and Sn-Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn-Pb solder is 2.74 x 10{sup -10} m{sup 2}/s and for Sn-Cu solder is 6.44 x 10{sup -9} m{sup 2}/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.

  4. BEHAVIOUR OF COPPER AND ALUMINIUM ELECTRODES ON EDM OF EN-8 ALLOY STEEL

    Directory of Open Access Journals (Sweden)

    DHANANJAY PRADHAN

    2011-07-01

    Full Text Available Electrical discharge machining (EDM has been recognized as an efficient production method for precision machining of electrically conducting hardened materials. Copper and aluminium are used as electrode materials in this process with Kerosene oil as the dielectric medium. In this work, the behavior of copper and aluminium electrodes on electric discharge machining of EN-8 alloy steel had been studied. Keeping all other machining parameters same, the hardened work material was machined with the two electrodes at different values of peak current, pulse-on time & duty factor according to 23 full factorial design. It has been found that copper shows better results than aluminium in term of surface finish (μm in same dielectric media. Therefore, copper is recommended as a good electrode material.

  5. Electrical conductivity in directionally solidified lead-9 and -20 wt pct copper alloys

    Science.gov (United States)

    Kim, Shinwoo; Flanagan, W. F.; Lichter, B. D.; Grugel, R. N.

    1993-01-01

    Composites consisting of aligned copper dendrites in a lead matrix have been produced by directional solidification processing for potential application as grids in lead-acid batteries. To promote a uniform composite of aligned copper dendrites in a protective lead matrix, two alloy compositions, Pb-9 and -20 wt pct Cu, have been directionally solidified through a temperature gradient of 4.5 K/mm at constant growth velocities which ranged from 1 to 100 micron/s. With slow growth rates (below about 10 microns/s), the copper dendrites were generally columnar and continuous along the sample length; at higher velocities (above 60 microns/s), they assumed an intricate and equiaxed morphology. In accordance with copper content and growth rate, the electrical conductivity of the directionally solidified composites was found to be as much as a 2.5 times that of pure lead. The results are compared with that predicted by a model based on a geometrical dendrite.

  6. A Simplified Test for Blanching Susceptibility of Copper Alloys

    Science.gov (United States)

    Thomas-Ogbuji, Linus U.; Humphrey, Donald; Setlock, John

    2003-01-01

    GRCop-84 (Cu-8Cr-4Nb) is a dispersion-strengthened alloy developed for space-launch rocket engine applications, as a liner for the combustion chamber and nozzle ramp. Its main advantage over rival alloys, particularly NARloy-Z (Cu-Ag-Zr), the current liner alloy, is in high temperature mechanical properties. Further validation required that the two alloys be compared with respect to service performance and durability. This has been done, under conditions resembling those expected in reusable launch engine applications. GRCop-84 was found to have a superior resistance to static and cyclic oxidation up to approx. 700 C. In order to improve its performance above 700 C, Cu-Cr coatings have also been developed and evaluated. The major oxidative issue with Cu alloys is blanching, a mode of degradation induced by oxidation-reduction fluctuations in hydrogen-fueled engines. That fluctuation cannot be addressed with conventional static or cyclic oxidation testing. Hence, a further evaluation of the alloy substrates and Cu-Cr coating material necessitated our devising a test protocol that involves oxidaton-reduction cycles. This paper describes the test protocols used and the results obtained.

  7. Synthesis of Corrosion-resistant Nanocrystalline Nickle-copper Alloy Coatings by Pulse-plating Technique

    Directory of Open Access Journals (Sweden)

    S.K. Ghosh

    2005-01-01

    Full Text Available Bright and smooth nanocrystalline Monel-type Ni-Cu alloy gets deposited from complex citrate electrolyte by pulse electrolysis. Transmission electron microscopy studies have revealedthat the deposited Ni-Cu alloy was nanocrystalline in nature and it comprised a two-phase (fcc+Ll, mixture. The presence of twins could be seen in the nanocrystals. The Ni-Cu alloysprepared by pulse electrolysis were finer grained (- 2.5-28.5 nm than those deposited by direct current method. Nelson-Riley function has been used to calculate the lattice parameters for both the pulse current-plated and direct current-plated alloys from x-ray diffraction analysis. The microhardness values for pulse current-plated alloys were higher than for the direct currentplated alloys. The internal stresses of both the pulse current-deposited and the direct currentdeposited alloys have also been measured; the values were lower for pulse current-plated alloys. Potentiodynamic polarisation studies were carried out in aerated and deaerated neutral 3.0 Wt per cent NaCl solution and instantaneous corrosion current density of the plated alloy was determined and compared with the Monel-400 alloy. It was found that nanocrystalline pulse current-N,-35 8 Wt p;r cent copper alloy uxh~bitedlo wer instantaneous value of corros~onc urrent densirv than that of soeclrnens with direct current method and Monel-400 allov The d~ssolut~on ~ ~~~~-~ behaviour ofthe deposited nanocrystalline material was found to be more like general corrosion rather than localised corrosion as in the case of Monel-400 alloy.

  8. Intermetallic compounds, copper and palladium alloys in Au-Pd ore of the Skaergaard pluton, Greenland

    Science.gov (United States)

    Rudashevsky, N. S.; Rudashevsky, V. N.; Nielsen, T. F. D.

    2015-12-01

    Copper-palladium intermetallic compounds and alloys (2314 grains) from the Au-Pd ore of the Skaergaard layered gabbroic pluton have been studied. Skaergaardite PdCu, nielsenite PdCu3, (Cu,Pd)β, (Cu,Pd)α, (Pd,Cu,Au,Pt) alloys, and native palladium have been identified as a result of 1680 microprobe analyses. The average compositions and various chemical varieties of these minerals are characterized, as well as vertical and lateral zoning in distribution of noble metals. The primary Pd-Cu alloys were formed within a wide temperature interval broadly synchronously with cooling and crystallization of host gabbro and in close association with separation of Fe-Cu sulfide liquid. In the course of crystallization of residual gabbroic melt enriched in iron, noble and heavy metals and saturated with the supercritical aqueous fluid, PGE and Au are selectively concentrated in the Fe-Cu sulfide phase as Pd-Cu and Cu-Au alloys.

  9. Growth of a Copper-Gold Alloy Phase by Bulk Copper Electrodeposition on Gold Investigated by In Situ STM

    DEFF Research Database (Denmark)

    Andersen, Jens Enevold Thaulov; Møller, Per

    1995-01-01

    Simultaneous in situ scanning tunneling microscopy measurements and recordings of voltammograms were used to study in real time the initial cycles of potentiostatic copper electrodeposition and subsequent dissolution on a clean gold polycrystalline electrode. The cycles were carried out by sweeping...... the potential in the double-layer charging region from 500 to -100 mV and back to 500 mV at a sweep rate of 1 mV/s in an acidified copper sulfate electrolyte (0.01M H2SO4, 0.01M CuSO4, and Millipore water). After completion of the first cycle the gold surface had recrystallized and nuclei of an alloy phase were...... formed. After completion of subsequent cycles the distribution of crystallite dimensions and the shape of the crystallites changed and the growth was compared with features of concomitant voltammograms. Relations between charge densities and potentials were deduced from data of the voltammograms. A shift...

  10. Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

    Institute of Scientific and Technical Information of China (English)

    Guisheng ZOU; Jun YANG; Aaiping WU; Genghua HUANG; Deku ZHANG; Jialie REN; Qing WANG

    2003-01-01

    Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. Theeffects of processing conditions on the microstructures and shear strength of the joints were investigated.

  11. Microstructures of erbium modified aluminum-copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Berghof-Hasselbaecher, Ellen; Schmidt, Gerald; Galetz, Mathias; Schuetze, Michael [DECHEMA-Forschungsinstitut, Frankfurt am Main (Germany); Masset, Patrick J. [Fraunhofer UMSICHT-ATZ Entwicklungszentrum, Sulzbach-Rosenberg (Germany); Zhang, Ligang [Technische Univ. Bergakademie Freiberg (Germany). ZIK Virtuhcon; Liu, Libin; Jin, Zhanpeng [Central South Univ., Changsha, Hunan (China)

    2012-07-01

    Alloying with rare earth metals improves to the mechanical properties and corrosion resistance of aluminium base alloys at high temperatures. The rare earth metal erbium may be used for grain refinement. Within a project of computer-aided alloy development based on the CALPHAD (CALculation of PHAse Diagrams) method various alloys were melted on the Al-rich side of the ternary system Al-Cu-Er under argon atmosphere and their microstructures were characterized in the as-cast state or after long-term isothermal annealing (400 C/960 h) by means of different investigation techniques. As a result, the phases fcc (Al), {tau}{sub 1}-Al{sub 8}Cu{sub 4}Er, {theta}-CuAl{sub 2}, {eta}-CuAl, and Al{sub 3}Er were identified, their compositions and fractions were quantified, and their hardnesses were determined. The experimental obtained microstructures agree very well with the calculated solidification behaviors of the cast alloys. The knowledge gained from this work about the phase compositions and microstructures can also be utilized for the fine optimization of the phase diagram. (orig.)

  12. Furfural Hydrogenation on Alloyed Copper Catalysts With Additives of Ferrosilicium

    Directory of Open Access Journals (Sweden)

    T. K. Akilov

    2015-12-01

    Full Text Available The present work is dedicated to the study of influence of ferrosilicium additives [FA*-ferroalloy containing (% mass: 46.8 Si, ~53,0 Fe, other are (C, P, S impurities] on the activity of alloyed Gu-Al = 50-50 catalyst in the reaction of furfural hydrogenation under hydrogen pressure. Components content varied (% mass: Cu- 40...49, aluminum- 50, FA* -1.0...10.0. The catalysts were prepared from 1g alloys by leaching it with 20% of aqueous solution of caustic soda in boiling water-bath during 1 hour. The phase composition and structure of alloys were investigated by means of roentgenographic and X-ray spectrum methods.

  13. Synthesis, Characterization and Cold Workability of Cast Copper-Magnesium-Tin Alloys

    Science.gov (United States)

    Bravo Bénard, Agustín Eduardo; Martínez Hernández, David; González Reyes, José Gonzalo; Ortiz Prado, Armando; Schouwenaars Franssens, Rafael

    2014-02-01

    The use of Mg as an alloying element in copper alloys has largely been overlooked in scientific literature and technological applications. Its supposed tribological compatibility with iron makes it an interesting option to replace Pb in tribological alloys. This work describes the casting process of high-quality thin slabs of Cu-Mg-Sn alloys with different compositions by means of conventional methods. The resulting phases were analyzed using X-ray diffraction, scanning electron microscopy, optical microscopy, and energy dispersive X-ray spectroscopy techniques. Typical dendritic α-Cu, eutectic Cu2Mg(Sn) and eutectoid non-equilibrium microstructures were found. Tensile tests and Vickers microhardness show the excellent hardening capability of Mg as compared to other copper alloys in the as-cast condition. For some of the slabs and compositions, cold rolling reductions of over 95 pct have been easily achieved. Other compositions and slabs have failed during the deformation process. Failure analysis after cold rolling reveals that one cause for brittleness is the presence of casting defects such as microshrinkage and inclusions, which can be eliminated. However, for high Mg contents, a high volume fraction of the intermetallic phase provides a contiguous path for crack propagation through the connected interdendritic regions.

  14. Fabrication of a nanocomposite from in situ iron nanoparticle reinforced copper alloy

    Science.gov (United States)

    Wang, Zidong; Wang, Xuewen; Wang, Qiangsong; Shih, I.; Xu, J. J.

    2009-02-01

    In situ iron nanoparticle reinforced Cu-3Sn-8Zn-6Pb alloy has been fabricated by centrifugal casting in a vacuum chamber with a medium frequency electrical furnace. The microstructure of this alloy was analyzed with a scanning electron microscope (SEM) and a high-resolution transmission electron microscope (HRTEM), and the results show that the grains of Cu-3Sn-8Zn-6Pb alloy without iron have a typical dendrite structure with dimensions from 500 to 1500 µm, and the grains of the alloy with the addition of 1% iron are small and equiaxed, with dimensions from 20 to 60 µm. Then, the relatively uniform dispersed particles in the copper matrix were identified with the HRTEM to be pure iron with dimensions in the order of 2-20 nm. The mechanical properties of the alloys were measured and the results show a significant increase in the tensile strength of the alloy with iron nanoparticles and a slight increase of the elongation compared to that without iron. The mechanism of formation of the iron nanoparticles was analyzed by thermodynamic and dynamic theories, and the results indicate that the in situ iron nanoparticles of Cu-3Sn-8Zn-6Pb alloy can reasonably form during solidification in the centrifugal casting technique.

  15. Study on improved tribological properties by alloying copper to CP-Ti and Ti–6Al–4V alloy

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Song [Biomechanics and Biotechnology Lab, Research Institute of Tsinghua University in Shenzhen, Shenzhen 518057 (China); Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Ma, Zheng [Institute of Metal Research, Chinese Academy of Science, Shenyang 110016 (China); Liao, Zhenhua [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Biomechanics and Biotechnology Lab, Research Institute of Tsinghua University in Shenzhen, Shenzhen 518057 (China); Song, Jian [State Key Laboratory of Tribology, Tsinghua University, Beijing 100084 (China); Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Yang, Ke [Institute of Metal Research, Chinese Academy of Science, Shenyang 110016 (China); Liu, Weiqiang, E-mail: weiqliu@hotmail.com [Biomechanics and Biotechnology Lab, Research Institute of Tsinghua University in Shenzhen, Shenzhen 518057 (China); State Key Laboratory of Tribology, Tsinghua University, Beijing 100084 (China)

    2015-12-01

    Copper alloying to titanium and its alloys is believed to show an antibacterial performance. However, the tribological properties of Cu alloyed titanium alloys were seldom studied. Ti–5Cu and Ti–6Al–4V–5Cu alloys were fabricated in the present study in order to further study the friction and wear properties of titanium alloys with Cu additive. The microstructure, composition and hardness were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscope (TEM) and hardness tester. The tribological behaviors were tested with ZrO{sub 2} counterface in 25% bovine serum using a ball-on-disc tribo-tester. The results revealed that precipitations of Ti{sub 2}Cu intermetallic compounds appeared in both Ti–5Cu and Ti–6Al–4V–5Cu alloys. The tribological results showed an improvement in friction and wear resistance for both Ti–5Cu and Ti–6Al–4V–5Cu alloys due to the precipitation of Ti{sub 2}Cu. The results also indicated that both CP-Ti and Ti–5Cu behaved better wear resistance than Ti–6Al–4V and Ti–6Al–4V–5Cu due to different wear mechanisms when articulated with hard zirconia. Both CP-Ti and Ti–5Cu revealed dominant adhesive wear with secondary abrasive wear mechanism while both Ti–6Al–4V and Ti–6Al–4V–5Cu showed severe abrasive wear and cracks with secondary adhesive wear mechanism due to different surface hardness integrated by their microstructures and material types. - Highlights: • Ti–5Cu and Ti–6Al–4V–5Cu alloys were fabricated with Cu additive. • Precipitations of Ti{sub 2}Cu intermetallic compounds appeared after alloying Cu. • The precipitation of Ti{sub 2}Cu improved both friction and wear resistance. • Plowing was the dominant material removal force with severe plowing phenomenon. • Different dominant and secondary wear mechanisms appeared with different hardness.

  16. Undercooling and demixing of copper-based alloys

    DEFF Research Database (Denmark)

    Kolbe, M.; Brillo, J.; Egry, I.

    2006-01-01

    Since the beginning of materials science research under microgravity conditions immiscible alloys have been an interesting subject. New possibilities to investigate such systems are offered by containerless processing techniques. Of particular interest is the ternary system Cu-Fe-Co, and its limi...

  17. Hardness analysis and morphological characterization of copper-zinc alloys produced in pyrophosphate-based electrolytes

    Directory of Open Access Journals (Sweden)

    Lilian Ferreira de Senna

    2005-09-01

    Full Text Available In this work, copper-zinc alloy coatings on mild steel substrates were obtained in nontoxic pyrophosphate-based electrolytes, at room temperature and under continuous current. The effects of bath composition and current density on the hardness of the coatings, as well as on their morphologies, were evaluated. The results showed that the electrolyte composition, and the use of stress relieving additives strongly influence the hardness of the coatings, while the current density directly affect their morphology. Hence, for a current density of 116 A/m², copper-zinc alloy deposits with no pores or cracks were produced in a pyrophosphate-based electrolyte, especially when allyl alcohol was added to the solution.

  18. Effect of combined deformation on the structure and properties of copper and titanium alloys

    Science.gov (United States)

    Stolyarov, V. V.; Pashinskaya, E. G.; Beigel'Zimer, Ya. E.

    2010-10-01

    The effect of a combination scheme of severe plastic deformation and subsequent cold rolling or electroplastic rolling on the deformability, microstructural evolution, and mechanical properties of copper, titanium of various purities, and a titanium alloy of an equiatomic composition is studied. The combined deformation method is shown to create a number of new nanostructured and ultrafine-grained states with a high strength and ductility.

  19. Selective separation of copper over solder alloy from waste printed circuit boards leach solution.

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Firozi, Sadegh

    2017-02-01

    The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF4 leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF4 solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution.

  20. GRCop-84: A High Temperature Copper-based Alloy For High Heat Flux Applications

    Science.gov (United States)

    Ellis, David L.

    2005-01-01

    While designed for rocket engine main combustion chamber liners, GRCop-84 (Cu-8 at.% Cr-4 at.% Nb) offers potential for high heat flux applications in industrial applications requiring a temperature capability up to approximately 700 C (1292 F). GRCop-84 is a copper-based alloy with excellent elevated temperature strength, good creep resistance, long LCF lives and enhanced oxidation resistance. It also has a lower thermal expansion than copper and many other low alloy copper-based alloys. GRCop-84 can be manufactured into a variety of shapes such as tubing, bar, plate and sheet using standard production techniques and requires no special production techniques. GRCop-84 forms well, so conventional fabrication methods including stamping and bending can be used. GRCop-84 has demonstrated an ability to be friction stir welded, brazed, inertia welded, diffusion bonded and electron beam welded for joining to itself and other materials. Potential applications include plastic injection molds, resistance welding electrodes and holders, permanent metal casting molds, vacuum plasma spray nozzles and high temperature heat exchanger applications.

  1. Grain refinement of permanent mold cast copper base alloys. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Sadayappan, M.; Thomson, J. P.; Elboujdaini, M.; Gu, G. Ping; Sahoo, M.

    2004-04-29

    Grain refinement behavior of copper alloys cast in permanent molds was investigated. This is one of the least studied subjects in copper alloy castings. Grain refinement is not widely practiced for leaded copper alloys cast in sand molds. Aluminum bronzes and high strength yellow brasses, cast in sand and permanent molds, were usually fine grained due to the presence of more than 2% iron. Grain refinement of the most common permanent mold casting alloys, leaded yellow brass and its lead-free replacement EnviroBrass III, is not universally accepted due to the perceived problem of hard spots in finished castings and for the same reason these alloys contain very low amounts of iron. The yellow brasses and Cu-Si alloys are gaining popularity in North America due to their low lead content and amenability for permanent mold casting. These alloys are prone to hot tearing in permanent mold casting. Grain refinement is one of the solutions for reducing this problem. However, to use this technique it is necessary to understand the mechanism of grain refinement and other issues involved in the process. The following issues were studied during this three year project funded by the US Department of Energy and the copper casting industry: (1) Effect of alloying additions on the grain size of Cu-Zn alloys and their interaction with grain refiners; (2) Effect of two grain refining elements, boron and zirconium, on the grain size of four copper alloys, yellow brass, EnviroBrass II, silicon brass and silicon bronze and the duration of their effect (fading); (3) Prediction of grain refinement using cooling curve analysis and use of this method as an on-line quality control tool; (4) Hard spot formation in yellow brass and EnviroBrass due to grain refinement; (5) Corrosion resistance of the grain refined alloys; (6) Transfer the technology to permanent mold casting foundries; It was found that alloying elements such as tin and zinc do not change the grain size of Cu-Zn alloys

  2. Structure and Properties of Cast Near-Congruent Copper-Manganese Alloys

    Science.gov (United States)

    Chaput, Kevin; Trumble, Kevin P.

    2014-10-01

    Microstructure development in the casting of copper-manganese alloys based on the congruent point at 34.6 wt pct Mn and 1146 K (873 °C) has been studied. The alloys were prepared by induction melting of electrolytic Cu and Mn in clay-graphite crucibles in open air. Under conventional casting conditions, the alloys exhibit fine cellular (non-dendritic) solidification morphology with a distinct absence of solidification shrinkage microporosity, and they maintain these attributes over a composition range of approximately 3 wt pct Mn about the congruent point. The high Mn concentration in the alloy admits carbon into solution in the melt, resulting in formation of manganese carbide Mn7C3 particles having two different forms (globular and angular) in the cast microstructure. The Mn carbide was eliminated or controlled to low levels by melting in an alumina or a silicon carbide crucible, or in a clay-graphite crucible at lower temperatures. Microstructure development in casting the alloy was analyzed in terms of the available phase diagrams and thermochemical data. Hardness and tensile testing indicated a potent solid solution strengthening effect of Mn and high ductility in the as-cast condition, with additional hardness (strength) when the alloy contains the Mn carbide phase.

  3. Simulation of aging process of lead frame copper alloy by an artificial neural network

    Institute of Scientific and Technical Information of China (English)

    苏娟华; 董企铭; 刘平; 李贺军; 康布熙

    2003-01-01

    The aging hardening process makes it possible to get higher hardness and electrical conductivity of lead frame copper alloy.The process has only been studied empirically by trial-and-error method so far.The use of a supervised artificial neural network(ANN)was proposed to model the non-linear relationship between parameters of aging process with respect to hardness and conductivity properties of Cu-Cr-Zr alloy.The improved model was developed by the Levenberg-Marquardt training algorithm.A basic repository on the domain knowledge of aging process was established via sufficient data mining by the network.The results show that the ANN system is effective and successful for predicting and analyzing the properties of Cu-Cr-Zr alloy.

  4. Hydrogen-environment-assisted cracking of an aluminum-zinc-magnesium(copper) alloy

    Science.gov (United States)

    Young, George Aloysius, Jr.

    There is strong evidence to indicate that hydrogen embrittlement plays a significant, if not controlling, role in the environmentally assisted cracking of 7XXX series aluminum alloys. In order to better understand hydrogen environment assisted cracking (HEAC), crack growth rate tests in the K-independent stage II crack growth regime were conducted on fracture mechanics specimens of an Al-6.09Zn-2.14Mg-2.19Cu alloy (AA 7050) and a low copper variant (Al-6.87Zn-2.65Mg-0.06Cu). Crack growth rate tests were performed in 90% relative humidity (RH) air between 25 and 90°C to assure hydrogen embrittlement control. The underaged, peak aged, and overaged tempers were investigated. Hydrogen uptake in humid air, hydrogen diffusion, and hydrogen trapping were investigated for each temper. Lastly, near crack tip hydrogen concentration depth profiles were analyzed via nuclear reaction analysis (NRA) and secondary ion mass spectroscopy (SIMS) using a liquid gallium, focused ion beam sputtering source (FIB/SIMS). The results of this study help explain and quantify empirically known trends concerning HEAC resistance and also establish new findings. In the copper bearing alloy, overaged tempers are more resistant but not immune to HEAC. Humid air is an aggressive environment for Al-Zn-Mg alloys because water vapor reacts with bare aluminum to produce high surface concentrations of hydrogen. This occurs in all tempers. Hydrogen diffuses from the near surface region to the high triaxial stress region ahead of the crack tip and collects at the high angle grain boundaries. The combination of tensile stress and high hydrogen concentration at the grain boundaries then causes intergranular fracture. Crack extension bares fresh metal and the process of hydrogen production, uptake, diffusion to the stressed grain boundary, and crack extension repeats. One reason increased degree of aging improves HEAC resistance in copper bearing 7XXX series alloys is that volume lattice and effective

  5. Atomic and magnetic correlations in a copper - 5% manganese alloy

    Energy Technology Data Exchange (ETDEWEB)

    Murani, A.P.; Schaerpf, O.; Andersen, K. [Institut Max von Laue - Paul Langevin (ILL), 38 - Grenoble (France); Raphel, R. [Centre National de la Recherche Scientifique (CNRS), 38 - Grenoble (France)

    1997-04-01

    Interest in magnetism of Cu-Mn alloys has been revived and sustained by a number of very interesting neutron investigations on single-crystal samples which show `spin-density wave` (SDW) peaks at incommensurate wave-vectors. Recently such peaks have been observed even in very dilute samples with Mn concentration as low as {approx} 0.5 at.%. The proposed interpretation by the authors that these peaks represent incommensurate antiferromagnetic ordering, therefore, questions the widely-held view that at low enough temperatures the solute spins in this and similar alloys freeze with random or quasi-random orientations, forming a spin-glass state. Atomic and magnetic correlations have been investigated in a single crystal of Cu-5 at.% Mn within the first Brillouin zone using polarised neutrons and making use of the multi-angle three-dimensional polarisation analysis capability of the D7 spectrometer as a firs step in our aim to shed further light on the phenomenon. (author). 6 refs.

  6. Computer Advisory System in the Domain of Copper Alloys Manufacturing

    Directory of Open Access Journals (Sweden)

    Wilk-Kołodziejczyk D.

    2015-09-01

    Full Text Available The main scope of the article is the development of a computer system, which should give advices at problem of cooper alloys manufacturing. This problem relates with choosing of an appropriate type of bronze (e.g. the BA 1044 bronze with possible modification (e.g. calcium carbide modifications: Ca + C or CaC2 and possible heat treatment operations (quenching, tempering in order to obtain desired mechanical properties of manufactured material described by tensile strength - Rm, yield strength - Rp0.2 and elongation - A5. By construction of the computer system being the goal of presented here work Case-based Reasoning is proposed to be used. Case-based Reasoning is the methodology within Artificial Intelligence techniques, which enables solving new problems basing on experiences that are solutions obtained in the past. Case-based Reasoning also enables incremental learning, because every new experience is retained each time in order to be available for future processes of problem solving. Proposed by the developed system solution can be used by a technologist as a rough solution for cooper alloys manufacturing problem, which requires further tests in order to confirm it correctness.

  7. High-performance copper alloy films for barrierless metallization

    Science.gov (United States)

    Lin, C. H.; Leau, W. K.; Wu, C. H.

    2010-11-01

    In this study, we observe useful properties of V1.1- and V0.8N0.4-bearing copper (Cu) films deposited on barrierless silicon (Si) substrates by a cosputtering process. The Cu98.8(V0.8N0.4), or Cu(VNx) for brevity, films exhibit low resistivity (2.9 μΩ cm) and minimal leakage current after annealing at temperatures up to 700 °C for 1 h; no detectable reaction occurs at the Cu/Si interface. These observations confirm the high thermal stability of Cu(VNx) films. Furthermore, since these films have good adhesion features, they can be used for barrierless Cu metallization.

  8. Friction stir welding (FSW process of copper alloys

    Directory of Open Access Journals (Sweden)

    M. Miličić

    2016-01-01

    Full Text Available The present paper analyzes the structure of the weld joint of technically pure copper, which is realized using friction stir welding (FSW. The mechanism of thermo-mechanical processes of the FSW method has been identified and a correlation between the weld zone and its microstructure established. Parameters of the FSW welding technology influencing the zone of the seam material and the mechanical properties of the resulting joint were analyzed. The physical joining consists of intense mixing the base material along the joint line in the “doughy” phase. Substantial plastic deformations immediately beneath the frontal surface of tool provide fine-grained structure and a good quality joint. The optimum shape of the tool and the optimum welding regime (pressure force, rotation speed and the traverse speed of the tool in the heat affected zone enable the achievement of the same mechanical properties as those of the basic material, which justifies its use in welding reliable structures.

  9. Effect of cold rolling on properties and microstructures of dispersion strengthened copper alloys

    Institute of Scientific and Technical Information of China (English)

    GUO Ming-xing; WANG Ming-pu; SHEN Kun; CAO Ling-fei; LEI Ruo-shan; LI Shu-mei

    2008-01-01

    Mechanical properties and microstructures of unidirectionally and tandem rolled alumina dispersion strengthened copper(ADSC) alloys under different conditions were investigated by tensile test, optical microscopy(OM), transmission electron microscopy(TEM) and scanning electron microscopy(SEM). For unidirectionally rolled ADSC alloys, their strengths and elongations in the longitudinal direction are higher than those in the transverse direction under both cold rolling and annealing conditions. Once fracture appears in their longitudinal stress-strain curves, sudden reduction of overall stress level before complete fracture can be observed in the transverse tensile curves. The anisotropy of mechanical properties for the ADSC alloy can be greatly improved by tandem cold rolling. And no sudden reduction of overall stress level appears in the stress-strain curves for tandem rolled ADSC alloys. The differences of their microstructures and tensile fractures were analyzed. In order to compare the differences of tensile fracture mechanism in different directions, longitudinal and transverse fracture models for unidirectionally rolled ADSC alloys were also introduced.

  10. Copper alloys with improved properties: standard ingot metallurgy vs. powder metallurgy

    Directory of Open Access Journals (Sweden)

    Milan T. Jovanović

    2014-09-01

    Full Text Available Three copper-based alloys: two composites reinforced with Al2O3 particles and processed through powder metallurgy (P/M route, i.e. by internal oxidation (Cu-2.5Al composite and by mechanical alloying (Cu-4.7Al2O3 and Cu-0.4Cr-0.08Zr alloy produced by ingot metallurgy (vacuum melting and casting were the object of this investigation. Light microscope and scanning electron microscope (SEM equipped with electron X-ray spectrometer (EDS were used for microstructural characterization. Microhardness and electrical conductivity were also measured. Compared to composite materials, Cu-0.4Cr-0.08Zr alloy possesses highest electrical conductivity in the range from 20 to 800 ℃, whereas the lowest conductivity shows composite Cu-2.5Al processed by internal oxidation. In spite to somewhat lower electrical conductivity (probably due to inadequate density, Cu-2.5Al composite exhibits thermal stability enabling its application at much higher temperatures than materials processed by mechanical alloying or by vacuum melting and casting.

  11. An austempering study of ductile iron alloyed with copper

    Directory of Open Access Journals (Sweden)

    OLIVERA ERIC

    2005-07-01

    Full Text Available Austempered ductile iron (ADI has proved to be an excellent material as it possesses attractive properties: high strength, ductility and toughness are combined with good wear resistance and machinability. These properties can be achieved upon adequate heat treatment which yields the optimum microstructure for a given chemical composition. In this paper the results of an investigation the austempering of ADI alloyed with 0.45 % Cu for a range of times and temperatures are reported. The microstructure and fracture mode developed throughout these treatments have been identified by means of light and scanning electron microscopy and X-ray diffraction analysis. It was shown that the strength, elongation and impact energy strongly depend on the amounts of bainitic ferrite and retained austenite. Based on these results, and optimal processing window was established.

  12. Development of Beryllium-Copper Alloy Ignition Capsules

    Science.gov (United States)

    Cooley, Jason; Alexander, David; Thoma, Daniel; Field, Robert; Day, Robert; Cameron, Bernard; Nobile, Arthur; Rivera, Gerald; Kelly, Ann; Papin, Pallas; Schulze, Roland; Dauelsberg, Lawrence; Alexander, Neil; Galix, Remy

    2004-11-01

    Cu-doped Be capsules are being developed for ignition on the National Ignition Facility (NIF). Our fabrication approach is based on bonding of cylindrical parts containing precision machined hemispherical cavities, followed by machining an external spherical contour to produce a spherical shell. While we have demonstrated this approach, there are several key issues that need to be resolved before a shell meeting NIF specifications can be produced. These issues are synthesis of high purity small grain size Be0.9at%Cu alloy, formation of a strong hemishell bond that will allow the capsule to contain its 400 atm fill gas at room temperature, precision machining and polishing of the capsule to meet stringent specifications for surface finish and spherical quality, and filling with DT. In this paper we report on the progress that has been made in resolving these key issues.

  13. Tensile and electrical properties of high-strength high-conductivity copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Zinkle, S.J.; Eatherly, W.S. [Oak Ridge National Lab., TN (United States)

    1998-09-01

    Electrical conductivity and tensile properties have been measured on an extruded and annealed CuCrNb dispersion strengthened copper alloy which has been developed for demanding aerospace high heat flux applications. The properties of this alloy are somewhat inferior to GlidCop dispersion strengthened copper and prime-aged CuCrZr over the temperature range of 20--500 C. However, if the property degradation in CuCrZr due to joining operations and the anisotropic properties of GlidCop in the short transverse direction are taken into consideration, CuCrNb may be a suitable alternative material for high heat flux structural applications in fusion energy devices. The electrical conductivity and tensile properties of CuCrZr that was solution annealed and then simultaneously aged and diffusion bonded are also summarized. A severe reduction in tensile elongation is observed in the diffusion bonded joint, particularly if a thin copper shim is not placed in the diffusion bondline.

  14. Nucleation, wetting and agglomeration of copper and copper-alloy thin films on metal liner surfaces

    Science.gov (United States)

    LaBarbera, Stephanie Florence

    One of the key challenges in fabricating narrower and higher aspect ratio interconnects using damascene technology has been achieving an ultra-thin (˜2 nm) and continuous Cu seed coverage on trench sidewalls. The thin seed is prone to agglomeration because of poor Cu wetting on the Ta liner. Using in-situ conductance measurements, the effect of lowering the substrate temperature during Cu seed deposition has been studied on tantalum (Ta) and ruthenium (Ru) liner surfaces. On a Ta surface, it was found that lowering the deposition temperature to --65°C increases the nucleation rate of the Cu thin film, and reduces the minimum coalescing thickness for Cu on Ta liner from ˜4.5 nm (at room temperature) to ˜2 nm. On a Ru surface, Cu coalesces at wetting angle, coalescing thickness, and agglomeration resistance of thin Cu-3% Au, Cu-3% Mn, and Cu-3% Al layers on a Ta liner surface have been studied. It was found that the alloying increases the wetting angle of Cu on Ta at high temperature, as a result of either reduction in Cu alloy surface energy, solute surface segregation, or solute-liner interactions. In addition, the Cu alloys were found to be less agglomeration resistive as compared to pure Cu; their smaller grain size, interaction with the liner surface, and tendency to oxidize were found to accelerate their agglomeration. The coalescing thickness of the Cu alloys was found to be reduced from that of Cu (˜4.5 nm) to ˜2 nm.

  15. Model kekuatan geser dan kekuatan tarik perlekatan copper alloy dengan resin akrilik setelah tin plating (Tensile strength and shear strength models bonds in between copper alloy and acrylic resin after tin plating

    Directory of Open Access Journals (Sweden)

    Endanus Harijanto

    2005-09-01

    Full Text Available Tooth crown restoration was made in a complex system consisting of several elements, namely tensile strength and shear strength bond between copper alloy and acrylic resin after tin plating. The aim of this exemination was to find a model representing connection between tensile strength and shear strength in between copper alloy with acrylic resin in statistic method. In conclusion, this exemination utilizing a strength model = 0.645 + 1.237 × tensile strength resulted shear strength exemination. On the other hand, the utilization of a strength = –0.506 + 0.808 × shear strength resulted tensile strength exemination.

  16. Microstructural Evolution and Mechanical Property Development of Selective Laser Melted Copper Alloys

    Science.gov (United States)

    Ventura, Anthony Patrick

    Selective Laser Melting (SLM) is an additive manufacturing technology that utilizes a high-power laser to melt metal powder and form a part layer-by-layer. Over the last 25 years, the technology has progressed from prototyping polymer parts to full scale production of metal component. SLM offers several advantages over traditional manufacturing techniques; however, the current alloy systems that are researched and utilized for SLM do not address applications requiring high electrical and thermal conductivity. This work presents a characterization of the microstructural evolution and mechanical property development of two copper alloys fabricated via SLM and post-process heat treated to address this gap in knowledge. Tensile testing, conductivity measurement, and detailed microstructural characterization was carried out on samples in the as-printed and heat treated conditions. A single phase solid solution strengthened binary alloy, Cu-4.3Sn, was the first alloy studied. Components were selectively laser melted from pre-alloyed Cu-4.3Sn powder and heat treated at 873 K (600 °C) and 1173 K (900 °C) for 1 hour. As-printed samples were around 97 percent dense with a yield strength of 274 MPa, an electrical conductivity of 24.1 %IACS, and an elongation of 5.6%. Heat treatment resulted in lower yield strength with significant increases in ductility due to recrystallization and a decrease in dislocation density. Tensile sample geometry and surface finish also showed a significant effect on measured yield strength but a negligible change in measured ductility. Microstructural characterization indicated that grains primarily grow epitaxially with a sub-micron cellular solidification sub-structure. Nanometer scale tin dioxide particles identified via XRD were found throughout the structure in the tin-rich intercellular regions. The second alloy studied was a high-performance precipitation hardening Cu-Ni-Si alloy, C70250. Pre-alloyed powder was selectively laser melted to

  17. Self-healing coatings based on halloysite clay polymer composites for protection of copper alloys.

    Science.gov (United States)

    Abdullayev, Elshad; Abbasov, Vagif; Tursunbayeva, Asel; Portnov, Vasiliy; Ibrahimov, Hikmat; Mukhtarova, Gulbaniz; Lvov, Yuri

    2013-05-22

    Halloysite clay nanotubes loaded with corrosion inhibitors benzotriazole (BTA), 2-mercaptobenzimidazole (MBI), and 2-mercaptobenzothiazole (MBT) were used as additives in self-healing composite paint coating of copper. These inhibitors form protective films on the metal surface and mitigate corrosion. Mechanisms involved in the film formation have been studied with optical and electron microscopy, UV-vis spectrometry, and adhesivity tests. Efficiency of the halloysite lumen loading ascended in the order of BTA paint layer for a long time and release was enhanced in the coating defects exposed to humid media with 20-50 h, sufficient for formation of protective layer. Anticorrosive performance of the halloysite-based composite acrylic and polyurethane coatings have been demonstrated for 110-copper alloy strips exposed to 0.5 M aqueous NaCl for 6 months.

  18. Increasing the life of molds for casting copper and its alloys

    Science.gov (United States)

    Smirnov, A. N.; Spiridonov, D. V.

    2010-12-01

    The work of the molds intended for casting copper and copper alloys in semicontinuous casters for producing flat billets is considered. It is shown that, to increase the resistance of mold plates, the inner space of the mold should have a taper shape toward the casting direction and take into account the shrinkage of the linear dimensions of the ingot during its motion in the mold. The taper shape increases the intensity and uniformity of heat removal due to close contact between the ingot and the mold inner surface. Testing of new design molds under industrial conditions demonstrates that their resistance increases by a factor of 4.0-4.5. The taper effect of the mold plates is much more pronounced in their narrow faces.

  19. Tensile and electrical properties of copper alloys irradiated in a fission reactor

    Energy Technology Data Exchange (ETDEWEB)

    Fabritsiev, S.A. [D.V. Efremov Inst., St. Petersburg (Russian Federation); Pokrovsky, A.S. [Scientific Research Inst. of Atomic Reactors, Dimitrovgrad (Russian Federation); Zinkle, S.J.; Rowcliffe, A.F. [Oak Ridge National Laboratory, TN (United States)] [and others

    1996-04-01

    Postirradiation electrical sensitivity and tensile measurements have been completed on pure copper and copper alloy sheet tensile specimens irradiated in the SM-2 reactor to doses of {approx}0.5 to 5 dpa and temperatures between {approx}80 and 400{degrees}C. Considerable radiation hardening and accompanying embrittlement was observed in all of the specimens at irradiation temperature below 200{degrees}C. The radiation-induced electrical conductivity degradation consisted of two main components: solid transmutation effects and radiation damage (defect cluster and particle dissolution) effects. The radiation damage component was nearly constant for the doses in this study, with a value of {approx}1.2n{Omega}m for pure copper and {approx}1.6n{Omega}m for dispersion strengthened copper irradiated at {approx}100{degrees}C. The solid transmutation component was proportional to the thermal neutron flux, and became larger than the radiation damage component for fluences larger than {approx}5 10{sup 24} n.m{sup 2}. The radiation hardening and electrical conductivity degradation decreased with increasing irradiation temperature, and became negligible for temperatures above {approx}300{degrees}C.

  20. Room temperature creep-fatigue response of selected copper alloys for high heat flux applications

    DEFF Research Database (Denmark)

    Li, M.; Singh, B.N.; Stubbins, J.F.

    2004-01-01

    Two copper alloys, dispersion-strengthened CuAl25 and precipitation-hardened CuCrZr, were examined under fatigue and fatigue with hold time loading conditions. Tests were carried out at room temperature and hold times were imposed at maximum tensile and maximum compressive strains. It was found...... times. The influence of hold times on fatigue life in the low cycle fatigue, short life regime (i.e., at high strain amplitudes) was minimal. When hold time effects were observed, fatigue lives were reduced with hold times as short as two seconds. Appreciable stress relaxation was observed during...... the hold period at all applied strain levels in both tension and compression. In all cases, stresses relaxed quickly within the first few seconds of the hold period and much more gradually thereafter. The CuAl25 alloy showed a larger effect of hold time on reduction of high cycle fatigue life than did...

  1. Fretting Behavior of SPR Joining Dissimilar Sheets of Titanium and Copper Alloys

    Directory of Open Access Journals (Sweden)

    Xiaocong He

    2016-12-01

    Full Text Available The fretting performance of self-piercing riveting joining dissimilar sheets in TA1 titanium alloy and H62 copper alloy was studied in this paper. Load-controlled cyclic fatigue tests were carried out using a sine waveform and in tension-tension mode. Scanning electron microscopy and energy-dispersive X-ray techniques were employed to analyze the fretting failure mechanisms of the joints. The experimental results showed that there was extremely severe fretting at the contact interfaces of rivet and sheet materials for the joints at relatively high loads levels. Moreover, the severe fretting in the region on the locked sheet in contact with the rivet was the major cause of the broken locked sheet for the joints at low load level.

  2. Tensile properties of copper alloyed austempered ductile iron: Effect of austempering parameters

    Science.gov (United States)

    Batra, U.; Ray, S.; Prabhakar, S. R.

    2004-10-01

    A ductile iron containing 0.6% copper as the main alloying element was austenitized at 850 °C for 120 min and was subsequently austempered for 60 min at austempering temperatures of 270, 330, and 380 °C. The samples were also austempered at 330 °C for austempering times of 30 150 min. The structural parameters for the austempered alloy austenite (X γ ), average carbon content (C γ ), the product X γ C γ , and the size of the bainitic ferrite needle (d α ) were determined using x-ray diffraction. The effect of austempering temperature and time has been studied with respect to tensile properties such as 0.2% proof stress, ultimate tensile strength (UTS), percentage of elongation, and quality index. These properties have been correlated with the structural parameters of the austempered ductile iron microstructure. Fracture studies have been carried out on the tensile fracture surfaces of the austempered ductile iron (ADI).

  3. Interaction of ions in water system containing copper-zinc alloy for boiler energy saving

    Institute of Scientific and Technical Information of China (English)

    MING Xing; LIANG Jinsheng; OU Xiuqin; TANG Qingguo; DING Yan

    2006-01-01

    Copper-zinc alloy element for boiler energy saving was put in the intake of simulated boiler system to investigate the interaction and transfer of ions in water system both theoretically and experimentally. The fouling was analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray detector (EDX). The results show that the transfer of calcium and magnesium ions in heat-transfer-surface-water system is affected by zinc ions dissolved from the alloy because of primary battery reaction. Some calcium ions of calcium carbonate crystal are replaced by zinc ions, the growth of aragonite crystal nucleus is retarded, and the transition of calcium carbonate from aragonite to calcite is hampered.

  4. Structural and electrical properties of copper-nickel-aluminum alloys obtained by conventional powder metallurgy method

    Energy Technology Data Exchange (ETDEWEB)

    Monteiro, Waldemar A.; Carrio, Juan A.G.; Silveira, C.R. da; Pertile, H.K.S., E-mail: fisica.cch@mackenzie.br [Universidade Presbiteriana Mackenzie (UPM/CCH), Sao Paulo, SP (Brazil). Centro de Ciencias e Humanidades. Dept. de Fisica; Silva, L.C.E. da; Buso, S.J., E-mail: jgcarrio@mackenzie.br [Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil)

    2009-07-01

    This work looked for to search out systematically, in scale of laboratory, copper-nickel-aluminum alloys (Cu-Ni-Al) with conventional powder metallurgy processing, in view of the maintenance of the electric and mechanical properties with the intention of getting electric connectors of high performance or high mechanical damping. After cold uniaxial pressing (1000 kPa), sintering (780 deg C) and convenient homogenization treatments (500 deg C for different times) under vacuum (powder metallurgy), the obtained Cu-Ni-Al alloys were characterized by optical microscopy, electrical conductivity, Vickers hardness. X rays powder diffraction data were collected for the sintered samples in order to a structural and microstructural analysis. The comparative analysis is based on the sintered density, hardness, macrostructures and microstructures of the samples. (author)

  5. Plastic Deformation of Copper-Based Alloy Reinforced with Incoherent Nanoparticles

    Science.gov (United States)

    Matvienko, O. V.; Daneiko, O. I.; Kovalevskaya, T. A.

    2017-06-01

    The paper deals with research carried out into plastic deformation of a heavy-wall pipe made of nanoparticle reinforced copper-based alloy. We present an original approach which combines methods of crystal plasticity and deformable solid mechanics, thereby allowing to study the stress-strain state of the heavy-wall pipe strengthened with incoherent nanoparticles using a homogeneous internal pressure. Dependences are constructed for the yielding area and the pressure, the limit of elasto-plastic resistance is obtained for the heavy-wall pipe and its deformation degree is described. It is shown that the particle size has an effect on strength properties of the material.

  6. Mechanical Properties and Friction/Wear Behavior of Copper Alloyed Powder Composites

    Institute of Scientific and Technical Information of China (English)

    DENG Chen-hong; CHEN Guang-zhi; GE Qi-lu

    2005-01-01

    Copper alloyed powder composites containing nanoparticles were developed by hot pressing. Effects of nanoscale activated sintering aid and fine ceramic particles Al2O3 on hardness, working quality, and behaviors of friction and wear of the composites have been studied, compared with the composites including microscale activated sintering aid and microscale ceramic particles. The microstructures of the samples were analyzed by SEM. The results show that the materials with nanoscale sintering aid and fine ceramic particles have better mechanical properties and abrasive resistance than the materials with microscale activated sintering aid and microceramic particles. Moreover, element mutual transfer occurs between samples (strip) and abrasive wheel (ring).

  7. —Part I. Interaction of Calcium and Copper-Calcium Alloy with Electrolyte

    Science.gov (United States)

    Zaikov, Yurii P.; Batukhtin, Victor P.; Shurov, Nikolay I.; Ivanovskii, Leonid E.; Suzdaltsev, Andrey V.

    2014-06-01

    This paper describes the interaction between calcium and molten CaCl2 and the solubility of calcium in this melt, depending on the calcium content in the copper-calcium alloy that comes in contact with the molten CaCl2. The negative influence of the dissolved calcium on the current efficiency was verified. The negative effects of moisture and CaO impurities on the calcium current efficiency were demonstrated. The dependence of the current efficiency and the purity of the metal obtained by the electrolysis conditions were studied in a laboratory electrolyzer (20 to 80 A).

  8. Brazing open cell reticulated copper foam to stainless steel tubing with vacuum furnace brazed gold/indium alloy plating

    Science.gov (United States)

    Howard, Stanley R.; Korinko, Paul S.

    2008-05-27

    A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 .mu.m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 .mu.m thick, and a second layer of gold, 2.54 .mu.m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

  9. Experience with the use of copper alloys in seawater systems in the Norwegian sector of the North Sea

    Energy Technology Data Exchange (ETDEWEB)

    Johnsen, Roy [Norwegian University of Science and Technology, NO-7491 Trondheim (Norway)

    2004-07-01

    Offshore oil and gas has been produced on the Norwegian Continental Shelf (NCS) for nearly 30 years. Seawater has been used extensively as cooling medium and firewater. Copper alloys have been an alternative material both for piping and equipment like pumps, valves, heat exchangers and screens. In this presentation the experience from the use from different oil companies will be presented. The paper will also contain a discussion about the future for copper alloys in seawater systems. This part will be based on input and discussions with senior corrosion specialists in oil companies. (authors)

  10. Effect of Na2CO3 Addition on Carbothermic Reduction of Copper Smelting Slag to Prepare Crude Fe-Cu Alloy

    Science.gov (United States)

    Guo, Zhengqi; Zhu, Deqing; Pan, Jian; Yao, Weijie; Xu, Wuqi; Chen, Jinan

    2017-09-01

    Copper smelting slag is a useful secondary resource containing high iron and copper, which can be utilized to prepare crude Fe-Cu alloy by a direct reduction-magnetic separation process for making weathering-resistant steel. However, it is difficult to recover iron and copper from the slag by direct reduction since the iron mainly occurs in fayalite and the copper is held in copper sulfide. Therefore, enhancement reduction of copper slag is conducted to improve the recovery of copper and iron. Additives such as Na2CO3 has been proven to be capable of reinforcing the reduction of refractory iron ore. In this research, the effect of Na2CO3 on the carbothermic reduction of copper slag was investigated, and phase transformations during reduction and the distributing characteristics of iron and copper in the alloy and non-metallic phases of the reduced pellets were also studied. The results show that the metallization rate of iron and copper was increased with the addition of Na2CO3, leading to higher iron and copper recovery in Fe-Cu alloy powder. X-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS) results confirm that Na2CO3 is capable of enhancing the reduction of fayaltie, copper silicate and copper sulfide, which agrees well with thermodynamic analysis. Furthermore, the reduction mechanism of copper slag was demonstrated based on systematic experimental observations.

  11. Microstructures and properties of Al2O3 dispersion-strengthened copper alloys prepared through different methods

    Science.gov (United States)

    Yan, Zhi-qiao; Chen, Feng; Ye, Fu-xing; Zhang, Dong-ping; Cai, Yi-xiang

    2016-12-01

    Al2O3 dispersion copper alloy powder was prepared by internal oxidation, and three consolidation methods—high-velocity compaction (HVC), hot pressing (HP), and hot extrusion (HE)—were used to prepare Al2O3 dispersion-strengthened copper (Cu-Al2O3) alloys. The microstructures and properties of these alloys were investigated and compared. The results show that the alloys prepared by the HP and HE methods exhibited the coarsest and finest grain sizes, respectively. The alloy prepared by the HVC method exhibited the lowest relative density (98.3% vs. 99.5% for HP and 100% for HE), which resulted in the lowest electrical conductivity (81% IACS vs. 86% IACS for HP and 87% IACS for HE). However, this alloy also exhibited the highest hardness (77 HRB vs. 69 HRB for HP and 70 HRB for HE), the highest compressive strength (443 MPa vs. 386 MPa for HP and 378 MPa for HE), and the best hardness retention among the investigated alloys. The results illustrate that the alloy prepared by the HVC method exhibits high softening temperature and good mechanical properties at high temperatures, which imply long service life when used as spot-welding electrodes.

  12. The Copper concentration variation to physical properties of high copper amalgam alloy

    Directory of Open Access Journals (Sweden)

    Aminatun Aminatun

    2006-09-01

    Full Text Available The function of copper (Cu inside amalgam is to increase hardness and impact force and to decrease thermal expansion coefficient. In general, amalgam which is used in dentistry and available in the market is contain Cu 22%, while the maximum Cu concentration is 30%. It is necessary to determine the concentration Cu does generate the best physical properties to be used as dental restorative agent. Amalgam is made by mixing blended-metal Ag-Sn-Cu (with Cu concentration of 13%, 21%, 22%, and 29% and Hg, stirred manually in a bowl for 15 minutes,leave it in temperature 27°C for 24 hours to become hardened. The result of X-Ray Diffractometer (XRD, analyzed by Rietveld method and Rietica program, shows amalgam with Cu 29% concentration for Cu3Sn compound density is 31.790 sma/Å3, for Ag2Hg3 compound is 41.733 sma/ Å3, a Cu3Sn relative weight percentage of 43.23%, Ag2Hg3 of 54.54%, Cu 7Hg6 of 2.23% and hardness of Cu 29% is 90.700 ± 0.005 kgf/mm2. These numbers are the highest values on Cu 29% concentrations compared to other copper concentration variants. Whereas amalgam thermal expansion coefficient on Cu 29% is (2.17 ± 0.9110-3 mm/°C is the lowest value compared to other Cu concentration. The conclution is that adding Cu concentration into amalgam will increase density value, Cu3Sn relative weight percentage, hardness level and will decrease amalgam thermal expansion coefficient. Amalgam 29% Cu concentration has better physical properties compared to amalgam Cu 22% concentration.

  13. Inactivation of murine norovirus on a range of copper alloy surfaces is accompanied by loss of capsid integrity.

    Science.gov (United States)

    Warnes, Sarah L; Summersgill, Emma N; Keevil, C William

    2015-02-01

    Norovirus is one of the most common causes of acute viral gastroenteritis. The virus is spread via the fecal-oral route, most commonly from infected food and water, but several outbreaks have originated from contamination of surfaces with infectious virus. In this study, a close surrogate of human norovirus causing gastrointestinal disease in mice, murine norovirus type 1 (MNV-1), retained infectivity for more than 2 weeks following contact with a range of surface materials, including Teflon (polytetrafluoroethylene [PTFE]), polyvinyl chloride (PVC), ceramic tiles, glass, silicone rubber, and stainless steel. Persistence was slightly prolonged on ceramic surfaces. A previous study in our laboratory observed that dry copper and copper alloy surfaces rapidly inactivated MNV-1 and destroyed the viral genome. In this new study, we have observed that a relatively small change in the percentage of copper, between 70 and 80% in copper nickels and 60 and 70% in brasses, had a significant influence on the ability of the alloy to inactivate norovirus. Nickel alone did not affect virus, but zinc did have some antiviral effect, which was synergistic with copper and resulted in an increased efficacy of brasses with lower percentages of copper. Electron microscopy of purified MNV-1 that had been exposed to copper and stainless steel surfaces suggested that a massive breakdown of the viral capsid had occurred on copper. In addition, MNV-1 that had been exposed to copper and treated with RNase demonstrated a reduction in viral gene copy number. This suggests that capsid integrity is compromised upon contact with copper, allowing copper ion access to the viral genome.

  14. A study of the method of making dental prosthetic appliances by sintered titanium alloys: effect of copper powder content on properties of sintered titanium alloy.

    Science.gov (United States)

    Oda, Y; Nakanishi, K; Sumii, T

    1990-02-01

    The effects of added copper powder to the properties of the sintered titanium alloys were investigated by measuring the compressive strength and densities of the green and sintered compacts, the thermal expansion curves and dimensional changes in the sintered compacts, and the accuracy of the crown-type restorations. The compressive strengths of green compacts ranged from 55 to 75 MPa. The expansion of green compacts increased with increased copper content. The sintered density was lower than the green density. The compressive yield strength of sintered compacts ranged from 260 MPa to 410 MPa. The sintered compacts expanded from 0.35% to 1.03% and the expansion increased with increased copper content. The dimensional accuracy of crown-type restorations showed the same dimensional change tendencies as did the sintered compacts. These results showed that the fit and the strength of sintered titanium alloy restorations could be improved.

  15. Effect of Copper and Silicon on Al-5%Zn Alloy as a Candidate Low Voltage Sacrificial Anode

    Science.gov (United States)

    Pratesa, Yudha; Ferdian, Deni; Togina, Inez

    2017-05-01

    One common method used for corrosion protection is a sacrificial anode. Sacrificial anodes that usually employed in the marine environment are an aluminum alloy sacrificial anode, especially Al-Zn-In. However, the electronegativity of these alloys can cause corrosion overprotection and stress cracking (SCC) on a high-strength steel. Therefore, there is a development of the sacrificial anode aluminum low voltage to reduce the risk of overprotection. The addition of alloying elements such as Cu, Si, and Ge will minimize the possibility of overprotection. This study was conducted to analyze the effect of silicon and copper addition in Al-5Zn. The experiment started from casting the sacrificial anode aluminum uses electrical resistance furnace in a graphite crucible in 800°C. The results alloy was analyzed using Optical emission spectroscopy (OES), Differential scanning calorimetry, electrochemical impedance spectroscopy, and metallography. Aluminum alloy with the addition of a copper alloy is the most suitable and efficient to serve as a low-voltage sacrificial anode aluminum. Charge transfer resistivity of copper is smaller than silicon which indicates that the charge transfer between the metal and the electrolyte is easier t to occur. Also, the current potential values in coupling with steel are also in the criteria range of low-voltage aluminum sacrificial anodes.

  16. Final report on characterization of physical and mechanical properties of copper and copper alloys before and after irradiation. (ITER R and D Task no. T213)

    Energy Technology Data Exchange (ETDEWEB)

    Singh, B.N.; Taehtinen, S. [VTT Manufacturing Technology (Finland)

    2001-12-01

    The present report summarizes and highlights the main results of the work carried out during the last 5 - 6 years on effects of neutron irradiation on physical and mechanical properties of copper and copper alloys. The work was an European contribution to ITER Research and Development programme and was carried out by the Associations Euratom - Risoe and Euratom - Tekes. Details of the investigations carried out within the framework of the present task and the main results have been reported in various reports and journal publication. On the basis of these results some conclusions are drawn regarding the suitability of a copper alloy for its use in the first wall and divertor components of ITER. It is pointed out that the present work has managed only to identify some of the critical problems and limitations of the copper alloys for their employment in the hostile environment of 14 MeV neutrons. A considerable amount of further effort is needed to find a realistic and optimum solution. (au)

  17. POROSITY AND STRENGTH PROPERTIES OF GYPSUM BONDED INVESTMENT USING TERENGGANU LOCAL SILICA FOR COPPER ALLOYS CASTING

    Directory of Open Access Journals (Sweden)

    S. Z. M. NOR

    2015-07-01

    Full Text Available In this study, several formulations of gypsum bonded investment (GBI as a mould for copper alloy casting has been developed and their properties had been investigated. The mould was developed using Terengganu local silica sand with the average particle size of 220–250 µm, acted as a refractory and Plaster of Paris (POP as a binder. The formulations used were 75% local silica, 25% plaster and various amounts (31–37% of water. The compressive strength, tensile strength, porosity, core hardness and mould hardness properties of the prepared GBI were studied. It has been found that both compressive strength and tensile strength reduced with a water content due to an increment of mould porosity which was confirmed via Scanning Electron Microscopy analysis. The mould hardness was found unchanged, but the core hardness was slightly reduced with the increment of water. The compressive strength of GBI moulds developed in this work was in the range of 600–1100 kN/m2, which was sufficient for copper alloy casting.

  18. The Effect of Dewaxing and Burnout Temperature in Block Mold Process for Copper Alloy Casting

    Directory of Open Access Journals (Sweden)

    S.Z. Mohd Nor

    2015-10-01

    Full Text Available The main objective of this research is to investigate the effect of dewaxing and burnout temperature on the quality of copper alloy casting produced by a low cost block mold that has been developed. In the molding process, two types of silica sand which contains 97.9% silica (SiO2 and 97.2% silica have been used as a refractory material with POP served as a binder. Several mold formulations contained 15-40% plaster of paris (POP, 60-85% silica sand and 35% water had been developed and each formulation had been tested in the process of copper alloy casting. In the dewaxing process, the temperature of 170oC was found appropriate to be used as an initial mold heating temperature and complete wax burnout was effectively achieved with the temperature of 750oC for 5 hours. The insufficient burnout process has produced a defect casting with carbon residue, appeared as a black stain on the surface of the casting. Meanwhile, rapid initial heating had prevented the wax from flowing out smoothly thus, eroded the surface of the mold cavities. This has resulted in deteriorated cavity surface, hence a rough surface of the casting.

  19. Surface topographic characterization for polyamide composite injection molds made of aluminum and copper alloys.

    Science.gov (United States)

    Pereira, A; Hernández, P; Martinez, J; Pérez, J A; Mathia, T G

    2014-01-01

    In order to ensure flexibility and rapid new product development, the mold industry made use of soft materials for cavity inserts in injection molds. However, materials of this kind are prone to wear. This article analyzes the topographic characterization of the surface and wear processes in injection molds cavities. Two materials have been used to produce the cavities: aluminum alloy EN AW‐6082 T4 and copper alloy Cu Zn39 Pb3. The surface topography was measured with the use of optical interferometry profiling technology; roughness and surface parameters were determined according to ISO 4287, ISO 25178, and EUR 15178N. In order to complete this research, an experimental part with different thicknesses and shapes was designed, and cavity inserts of aluminum and copper were made. Polyamide PA6, with 30% fiberglass reinforcement, was employed in the experimental procedure. Measurements of cavity mold surfaces were performed after 9,200 cycles on each mold and at different locations on the mold. The surface measurement was made with a white light vertical scanning interferometry, also known as coherence scanning interferometry (ISO DIS 25178‐604). The results are analyzed and differences between the two types of cavity inserts materials are discussed.

  20. Hot deformation behavior of KFC copper alloy during compression at elevated temperatures

    Institute of Scientific and Technical Information of China (English)

    ZHANG Hui; ZHANG Hong-gang; PENG Da-shu

    2006-01-01

    The hot deformation behavior of a KFC copper alloy was studied by compression deformation tests on Gleeble 1500 machine at strain rates ranging between 0.01-10 s-1 and deformation temperature of 650-850 ℃, and associated structural changes were studied by observations of metallography and TEM. The results show that the true stress-true strain curves for a KFC copper alloy are characterized by multiple peaks or a single peak flow, and tend to a steady state at high strains. The peak stress can be represented by a Zener-Hollomon parameter in the hyperbolic-sine-type equation with the hot deformation activation energy Q of 289 kJ/mol. The dynamic recrystallization(DRX) occurs by bulging out of part serrated grain-boundary, and the dynamic recrystallization grain size is dependent sensitively on deformation temperature T and strain rate ε, also a function of Z. The dynamic spherical Fe-rich precipitates and successive dynamic particles coarsening has been assumed to be responsible for flow softening at high strains, and this is more effective when samples deformed at low temperatures and higher strain rates.

  1. Anisotropic wetting of copper alloys induced by one-step laser micro-patterning

    Energy Technology Data Exchange (ETDEWEB)

    Hans, M., E-mail: michael.hans@mx.uni-saarland.de [Chair of Functional Materials, Faculty of Natural Sciences and Technology, Saarland University, 66123 Saarbruecken (Germany); Mueller, F.; Grandthyll, S.; Huefner, S. [Experimental Physics, Faculty of Natural Sciences and Technology, Saarland University, 66123 Saarbruecken (Germany); Muecklich, F. [Chair of Functional Materials, Faculty of Natural Sciences and Technology, Saarland University, 66123 Saarbruecken (Germany)

    2012-12-15

    Highlights: Black-Right-Pointing-Pointer One-step, contactless micro-patterning of copper alloys has been achieved. Black-Right-Pointing-Pointer Anisotropic wetting properties are tailored by line-like structures. Black-Right-Pointing-Pointer Both topographical and chemical patterns contribute to the phenomenon. Black-Right-Pointing-Pointer The topographic shape and homogeneity are found to be governing factors. - Abstract: Copper alloys (CuSn8, CuZn23Al3Co) have been micro-patterned with line-like geometries by Laser Interference Surface Structuring (LISS). In the presented study two high power pulsed laser beams are recombined to create unique, line-like intensity distributions with a chosen, constant periodicity of 10 {mu}m at varying laser fluencies. Anisotropic wetting properties on these surfaces have been confirmed by drop shape analysis and static contact angle measurements, which were conducted parallel and perpendicular to the structures revealing up to 25% difference in contact angle. The topography and chemistry of the tailored line structures have been characterized and analyzed by white light interferometry, spatial frequency distribution, AFM and X-ray photoelectron spectroscopy. The topographic shape and homogeneity are considered as key parameters for anisotropic wetting design, although it is concluded that both, the geometry as well as the locally varying chemical composition of the surface structures contribute to the phenomenon. Parallel capillarity effects and perpendicular contact line pinning are found to be the governing mechanisms.

  2. Examination of the Oxidation Protection of Zinc Coatings Formed on Copper Alloys and Steel Substrates

    Science.gov (United States)

    Papazoglou, M.; Chaliampalias, D.; Vourlias, G.; Pavlidou, E.; Stergioudis, G.; Skolianos, S.

    2010-01-01

    The exposure of metallic components at aggressive high temperature environments, usually limit their usage at similar application because they suffer from severe oxidation attack. Copper alloys are used in a wide range of high-quality indoor and outdoor applications, statue parts, art hardware, high strength and high thermal conductivity applications. On the other hand, steel is commonly used as mechanical part of industrial set outs or in the construction sector due to its high mechanical properties. The aim of the present work is the examination of the oxidation resistance of pack cementation zinc coatings deposited on copper, leaded brass and steel substrates at elevated temperature conditions. Furthermore, an effort made to make a long-term evaluation of the coated samples durability. The oxidation results showed that bare substrates appear to have undergone severe damage comparing with the coated ones. Furthermore, the mass gain of the uncoated samples was higher than this of the zinc covered ones. Particularly zinc coated brass was found to be more resistant to oxidation conditions in which it was exposed as it has the lower mass gain as compared to the bare substrates and zinc coated copper. Zinc coated steel was also proved to be more resistive than the uncoated steel.

  3. A detailed study of metallic glass formation in copper-hafnium-titanium alloys

    Institute of Scientific and Technical Information of China (English)

    Ignacio A. Figueroa; Sandro Baez-Pimiento; John D. Plummer; Omar Novelo-Peralta; Hywell A. Davies; Iain Todd

    2012-01-01

    Recently we have reported a number of bulk glass forming compositions in the CuHf-Ti system,with the critical thickness for complete glass formation,dc1 ranging from 2 mm to 4 mm.In order to improve the glass forming ability (GFA) getting even larger dc1 the prevailing approach is to use complex multicomponent systems.This strategy has been investigated by us for the Cu-Hf-Ti bulk glass forming alloy Cu55Hf25Ti20 using >1 at.pct additions of B,Y,Nb,Ta,Al,Mn,Si or V but with no significant improvement in the GFA.Clearly,it is necessary,in order to utilise the full potential of the base ternary system,to identify the best glass-forming compositions as a basis for extending the search into multi-dimensional compositional space.Thus,CuxHfyTiz alloys,where x=(40-70) at.pct,y=(5-30) at.pct,and z=(10-36) at.pct,were prepared by melt spinning and copper mould suction-casting.The composition dependence of the GFA for the Cu-Hf-Ti alloys,as measured by dc for rod and ribbon samples,is reported over the composition range given above.

  4. Characterization of Phases in an As-cast Copper-Manganese-Aluminum Alloy

    Institute of Scientific and Technical Information of China (English)

    J.Iqbal, F.Hasan; F.Ahmad

    2006-01-01

    Copper-manganese-aluminum (CMA) alloys, containing small additions of Fe, Ni, and Si, exhibit good strength and remarkable corrosion resistance against sea water. The alloys are used in as-cast condition, and their microstructure can show wide variations. The morphology, crystallography and composition of the phases presented in an as-cast (CMA) alloy of nominal composition Cu-14%Mn-8%Al-3%Fe-2%Ni were investigated using optical, electron optical, and microprobe analytical techniques. The as-cast microstructure consisted of the grains of fcc α and bcc β-phases alongwith intermetallic precipitates of various morphologies. The dendritic-shaped particles and the cuboid-shaped precipitates, which were rich in Fe and Mn and had an fcc DO3 structure. These four different morphologies of intermetallic precipitates exhibited discrete orientationrelationships with the α-matrix. The β-grains only contained very small cuboid shaped precipitates, which could only be resolved through transmission electron microscopy. These precipitates were found to be based on Fe3Al and had the DO3 structure.

  5. IMPROVING THE MECHANICAL PROPERTIES OF COPPER ALLOYS BY THERMO-MECHANICAL PROCESSING

    Institute of Scientific and Technical Information of China (English)

    M.C.Somani; L.P.Karjalainen

    2004-01-01

    Systematic physical simulation of thermo-mechanical processing routes has been applied on a Gleeble 1500 simulator to four copper alloys(mass %)Cu-0.57Co-0.32Si,Cu-0.55Cr-0.065P,Cu-0.22Zr-0.035Si and Cu-1.01Ni-0.43Si aimed at clarifying the influences of processing conditions on their final properties,strength and electrical conductivity.Flow curves were determined over wide temperature and strain rate ranges.Hardness was used as a measure of the strength level achieved.High hardness was obtained as using equal amounts(strains 0.5)of cold deformation before and after the precipitation annealing stage.The maximum values achieved for the Cu-Co-Si,Cu-Cr-P,Cu-Zr-Si and Cu-Ni-Si alloys were 190,165,178 and 193 HV5,respectively.A thermo-mechanical schedule involving the hot deformation-ageing-cold deformation stages showed even better results for the Cu-Zr-Si alloy.Consequently,the processing routes were designed based on simulation test results and wires of 5 and 2mm in diameters have been successfully processed in the industrial scale.

  6. Final report on in-reactor tensile tests on OFHC - Copper and CuCrZr alloy

    DEFF Research Database (Denmark)

    Singh, B.N; Edwards, D.J.; Tähtinen, S.

    2004-01-01

    of uniaxial tensile tests on pure copper and a CuCrZr alloy in a fission reactor at 363 and 393K. In the following, we first describe the experiments and then present results illustrating the build up ofstress as a function of concurrently increasing strain and displacement dose level. Results on both pre...

  7. Strength of Hycon 3 HP{trademark} Be-Cu and other copper alloys from 20 C to 200 C

    Energy Technology Data Exchange (ETDEWEB)

    Weggel, R.J. [Massachusetts Inst. of Tech., Cambridge, MA (United States). Francis Bitter National Magnet Lab.; Ratka, J.O.; Spiegelberg, W.D. [Brush Wellman Inc., Cleveland, OH (United States); Sakai, Yoshikazu [National Research Inst. for Metals, Ibaraki (Japan)

    1994-07-01

    To be suitable for high-performance water-cooled magnets a conductor must have an excellent combination of electrical conductivity and tensile strength at moderately elevated temperatures. The authors have measured the 0.2% yield and ultimate tensile strengths, elongation and modulus of five copper alloys, in the form of heavily cold-worked strip 0.4 mm to 1.2 mm thick, at temperatures up to 200 C. The alloys are Hycon 3 HP Be-Cu (UNS alloy C17510), a 24% silver-copper being developed by NRIM (Tsukuba, Japan), Glidcop{reg_sign}, Zr-Cu and electrolytic tough pitch copper. Be-Cu, Zr-Cu and Ag-Cu all retained strength very well. Be-Cu decreased in U.T.S. only 10% from room temperature to 200 C, Zr-Cu, 15%. For Ag-Cu the decrease was 10% from 20 to 150 C, and another 10% during the next 50 C. Glidcop weakened 20% by 150 C. So did ETP copper, whose strength then plummeted another 50% by 200 C. Except for Ag-Cu, with its filamentary microstructure, all alloys were isotropic within about 5%. The anisotropy of Ag-Cu was about 12%, with the transverse direction being the stronger.

  8. Accelerated Degradation Test and Predictive Failure Analysis of B10 Copper-Nickel Alloy under Marine Environmental Conditions

    Directory of Open Access Journals (Sweden)

    Bo Sun

    2015-09-01

    Full Text Available This paper studies the corrosion behavior of B10 copper-nickel alloy in marine environment. Accelerated degradation test under marine environmental conditions was designed and performed based on the accelerated testing principle and the corrosion degradation mechanism. With the prolongation of marine corrosion time, the thickness of Cu2O film increased gradually. Its corrosion product was Cu2(OH3Cl, which increased in quantity over time. Cl− was the major factor responsible for the marine corrosion of copper and copper alloy. Through the nonlinear fitting of corrosion rate and corrosion quantity (corrosion weight loss, degradation data of different corrosion cycles, the quantitative effects of two major factors, i.e., dissolved oxygen (DO and corrosion medium temperature, on corrosion behavior of copper alloy were analyzed. The corrosion failure prediction models under different ambient conditions were built. One-day corrosion weight loss under oxygenated stirring conditions was equivalent to 1.31-day weight loss under stationary conditions, and the corrosion rate under oxygenated conditions was 1.31 times higher than that under stationary conditions. In addition, corrosion medium temperature had a significant effect on the corrosion of B10 copper sheet.

  9. Microstructures and properties analysis of dissimilar metal joint in the friction stir welded copper to aluminum alloy

    Institute of Scientific and Technical Information of China (English)

    Wang Xijing; Zhang Zhongke; Da Chaobing; Li Jing

    2007-01-01

    This paper mainly concentrated on the feasibility of friction stir welding of dissimilar metal of aluminum alloy to copper (T2) and a preliminary analysis of welding parameters influencing on the microstructures and properties of joint was carried out. The results indicated that the thickness of workpiece played an important role in the welding parameters which could succeed in the friction stir welding of dissimilar metal of copper to aluminum alloy, and the parameters were proved to be a narrow choice. The interfacial region between copper and aluminum in the dissimilar joint was not uniformly mixed, constituted with part of incomplete mixing zone, complete mixing zone, dispersion zone and the most region's boundary was obvious. Meantime a kind banded structure with inhomogeneous width was formed. The intermetallic compounds generated during friction stir welding in the interfacial region were mainly Cu9Al4 , Al2Cu etc, and their hardness was higher than others.

  10. Foundry technology and its applications of ductile iron castings produced by water-cooled copper alloy mold

    Institute of Scientific and Technical Information of China (English)

    2004-01-01

    The high efficiency mechanized foundry technology of castings produced by using water-cooled copper alloy permanent mold has been systematically studied. Through the researching a Cu-Cr-Mg alloy with high conductivity and good combined mechanical properties used for making permanent mold was developed, and the basic design principles of the water-cooled permanent mold along with the control-range of relevant foundry processing parameters were also established.A cast production line equipped with water-cooled copper alloy mold was designed and fabricated for production of ductile iron automobile gear castings. This production line can consistently make automobile gear castings in QT500-15 and QT600-5 (Chinese Standard) grades of ductile iron with up to 95 % casting success rate.

  11. Effect of composition of titanium in silver-copper-titanium braze alloy on dissimilar laser brazing of binder-less cubic boron nitride and tungsten carbide

    Science.gov (United States)

    Sechi, Yoshihisa; Nagatsuka, Kimiaki; Nakata, Kazuhiro

    2014-08-01

    Laser brazing with Ti as an active element in silver-copper alloy braze metal has been carried out for binder-less cubic boron nitride and tungsten carbide, using silver-copper- titanium braze alloys with titanium content that varied between 0.28 mass% and 1.68 mass%. Observations of the interface using electron probe microanalysis and scanning acoustic microscopy show that efficient interface adhesion between binder-less cubic boron nitride and the silver-copper-titanium braze alloy was achieved for the braze with a titanium content of 0. 28 mass%.

  12. Design of a Nickel-Based Bond-Coat Alloy for Thermal Barrier Coatings on Copper Substrates

    Directory of Open Access Journals (Sweden)

    Torben Fiedler

    2014-11-01

    Full Text Available To increase the lifetime of rocket combustion chambers, thermal barrier coatings (TBC may be applied on the copper chamber wall. Since standard TBC systems used in gas turbines are not suitable for rocket-engine application and fail at the interface between the substrate and bond coat, a new bond-coat material has to be designed. This bond-coat material has to be chemically compatible to the copper substrate to improve the adhesion and needs a coefficient of thermal expansion close to that of copper to reduce thermal stresses. One approach to achieve this is to modify the standard NiCrAlY alloy used in gas turbines by adding copper. In this work, the influence of copper on the microstructure of NiCrAlY-alloys is investigated with thermodynamical calculations, optical microscopy, SEM, EDX and calorimetry. Adding copper leads to the formation of a significant amount of \\(\\beta\\ and \\(\\alpha\\ Reducing the aluminum and chromium content leads furthermore to a two-phase fcc microstructure.

  13. EFFECT OF THERMAL PROCESSES ON COPPER-TIN ALLOYS FOR ZINC GETTERING

    Energy Technology Data Exchange (ETDEWEB)

    Korinko, P.; Golyski, M.

    2013-11-01

    A contamination mitigation plan was initiated to address the discovery of radioactive zinc‐65 in a glovebox. A near term solution was developed, installation of heated filters in the glovebox piping. This solution is effective at retaining the zinc in the currently contaminated area, but the gamma emitting contaminant is still present in a system designed for tritium beta. A project was initiated to develop a solution to contain the {sup 65}Zn in the furnace module. Copper and bronze (a Cu/Sn alloy) were found to be candidate materials to combine with zinc‐65 vapor, using thermodynamic calculations. A series of binary Cu/Sn alloys were developed (after determining that commercial alloys were unacceptable), that were found to be effective traps of zinc vapor. The task described in this report was undertaken to determine if the bronze substrates would retain their zinc gettering capability after being exposed to simulated extraction conditions with oxidizing and reducing gases. Pure copper and three bronze alloys were prepared, exposed to varying oxidation conditions from 250 to 450{degree}C, then exposed to varying reduction conditions in He-H{sub 2} from 250-450{degree}C, and finally exposed to zinc vapor at 350{degree}C for four hours. The samples were characterized using scanning electron microscopy, X-ray diffraction, differential thermal analysis, mass change, and visual observation. It was observed that the as fabricated samples and the reduced samples all retained their zinc gettering capacity while samples in the "as-oxidized" condition exhibited losses in zinc gettering capacity. Over the range of conditions tested, i.e., composition, oxidation temperature, and reduction temperature, no particular sample composition appeared better. Samples reduced at 350{degree}C exhibited the greatest zinc capacity, although there were some testing anomalies associated with these samples. This work clearly demonstrated that the zinc gettering was not adversely

  14. A Novel Algorithm to Scheduling Optimization of Melting-Casting Process in Copper Alloy Strip Production

    Directory of Open Access Journals (Sweden)

    Xiaohui Yan

    2015-01-01

    Full Text Available Melting-casting is the first process in copper alloy strip production. The schedule scheme on this process affects the subsequent processes greatly. In this paper, we build the multiobjective model of melting-casting scheduling problem, which considers minimizing the makespan and total weighted earliness and tardiness penalties comprehensively. A novel algorithm, which we called Multiobjective Artificial Bee Colony/Decomposition (MOABC/D algorithm, is proposed to solve this model. The algorithm combines the framework of Multiobjective Evolutionary Algorithm/Decomposition (MOEA/D and the neighborhood search strategy of Artificial Bee Colony algorithm. The results on instances show that the proposed MOABC/D algorithm outperforms the other two comparison algorithms both on the distributions of the Pareto front and the priority in the optimal selection results.

  15. Auger electron spectroscopy study of surface segregation in the binary alloys copper-1 atomic percent indium, copper-2 atomic percent tin, and iron-6.55 atomic percent silicon

    Science.gov (United States)

    Ferrante, J.

    1973-01-01

    Auger electron spectroscopy was used to examine surface segregation in the binary alloys copper-1 at. % indium, copper-2 at. % tin and iron-6.55 at. % silicon. The copper-tin and copper-indium alloys were single crystals oriented with the /111/ direction normal to the surface. An iron-6.5 at. % silicon alloy was studied (a single crystal oriented in the /100/ direction for study of a (100) surface). It was found that surface segregation occurred following sputtering in all cases. Only the iron-silicon single crystal alloy exhibited equilibrium segregation (i.e., reversibility of surface concentration with temperature) for which at present we have no explanation. McLean's analysis for equilibrium segregation at grain boundaries did not apply to the present results, despite the successful application to dilute copper-aluminum alloys. The relation of solute atomic size and solubility to surface segregation is discussed. Estimates of the depth of segregation in the copper-tin alloy indicate that it is of the order of a monolayer surface film.

  16. Forming a perfect cubic texture in thin copper-yttrium alloy strips during cold rolling and annealing

    Science.gov (United States)

    Schastlivtsev, V. M.; Rodionov, D. P.; Khlebnikova, Yu. V.; Akshentsev, Yu. N.; Egorova, L. Yu.; Suaridze, T. R.

    2016-03-01

    The structure of strips produced from the Cu-1 wt % Y binary alloy using cold deformation by rolling to the degree of deformation of 99%, followed by recrystallization annealing, as well as the process of texture formation in these strips, is studied. The possibility of forming a perfect cubic texture in a thin strip made of a binary yttrium-modified copper-based alloy has been shown in principle, which opens the prospect of the use of this alloy to produce substrates for strip high-temperature superconductors of the second generation. The optimum conditions of annealing have been determined, which make it possible to form a perfect biaxial texture in the Cu-1 wt % Y alloy with a content of cubic grains {001} ± 10° on the surface of the textured strip of over 95%.

  17. Fabrication and Characterization of Nitinol-Copper Shape Memory Alloy Bimorph Actuators

    Science.gov (United States)

    Wongweerayoot, E.; Srituravanich, W.; Pimpin, A.

    2015-02-01

    This study aims to examine the effect of annealing conditions on nitinol (NiTi) characteristics and applies this knowledge to fabricate a NiTi-copper shape memory alloy bimorph actuator. The effect of the annealing conditions was investigated at various temperatures, i.e., 500, 600, and 650 °C, for 30 min. With the characterizations using x-ray diffraction, energy dispersive spectroscopy, and differential scanning calorimetry techniques, the results showed that annealing temperatures at 600 and 650 °C were able to appropriately form the crystalline structure of NiTi. However, at these high annealing temperatures, the oxide on a surface was unavoidable. In the fabrication of actuator, the annealing at 650 °C for 30 min was chosen, and it was performed at two pre-stressing conditions, i.e., straight and curved molds. From static and dynamic response experiments, the results suggested that the annealing temperature significantly affected the deflection of the actuator. On the other hand, the effect of pre-stressing conditions was relatively small. Furthermore, the micro gripper consisting of two NiTi-copper bimorph actuators successfully demonstrated for the viability of small object manipulation as the gripper was able to grasp and hold a small plastic ball with its weight of around 0.5 mg.

  18. Minimally-invasive Laser Ablation Inductively Coupled Plasma Mass Spectrometry analysis of model ancient copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Walaszek, Damian [University of Warsaw, Faculty of Chemistry, Biological and Chemical Research Centre, Żwirki i Wigury 101, 02-089 Warszawa (Poland); Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Senn, Marianne; Wichser, Adrian [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Faller, Markus [Laboratory for Jointing Technology and Corrosion, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Wagner, Barbara; Bulska, Ewa [University of Warsaw, Faculty of Chemistry, Biological and Chemical Research Centre, Żwirki i Wigury 101, 02-089 Warszawa (Poland); Ulrich, Andrea [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland)

    2014-09-01

    This work describes an evaluation of a strategy for multi-elemental analysis of typical ancient bronzes (copper, lead bronze and tin bronze) by means of laser ablation inductively coupled plasma mass spectrometry (LA-ICPMS).The samples originating from archeological experiments on ancient metal smelting processes using direct reduction in a ‘bloomery’ furnace as well as historical casting techniques were investigated with the use of the previously proposed analytical procedure, including metallurgical observation and preliminary visual estimation of the homogeneity of the samples. The results of LA-ICPMS analysis were compared to the results of bulk composition obtained by X-ray fluorescence spectrometry (XRF) and by inductively coupled plasma mass spectrometry (ICPMS) after acid digestion. These results were coherent for most of the elements confirming the usefulness of the proposed analytical procedure, however the reliability of the quantitative information about the content of the most heterogeneously distributed elements was also discussed in more detail. - Highlights: • The previously proposed procedure was evaluated by analysis of model copper alloys. • The LA-ICPMS results were comparable to the obtained by means of XRF and ICPMS. • LA-ICPMS results indicated the usefulness of the proposed analytical procedure.

  19. The effect of copper concentration on the microstructure of Al-Si-Cu alloys

    Directory of Open Access Journals (Sweden)

    R. Maniara

    2007-04-01

    Full Text Available In the metal casting industry, an improvement of component quality depends mainly on better control over the production parameters. In order to gain a better understanding of how to control the as-cast microstructure, it is important to understand the evaluation of microstructure during solidification and understanding how influence the changes of chemical concentration on this microstructure. In this research, the effect of Cu content on the microstructure and solidification parameters of Al-Si-Cu alloys has been investigated. Thus, the thermal analysis of the alloys is used to control of aluminum casting process. The effect of different Cu content on solidification parameters such: aluminum dendrites nucleation temperature (TLiq, Liquidus temperature, α+β eutectic nucleation temperature (TE(Al+SiN, Cu-rich eutectic nucleation temperature (TAl+Cu, solidus temperature (Tsol, solidification range (ΔTs has been studied in liquidus region. Influence of Cu content on the microstructure has been carried out. The principle observation made from this work ware that as copper concentration is increased the liquidus and solodius temperature decried. In addition to this it was observed that increase a Cu content from 1 to 4 wt % caused reduce of the secondary dendrite arm spacing and increase the grain size.

  20. New Screening Test Developed for the Blanching Resistance of Copper Alloys

    Science.gov (United States)

    Thomas-Ogbuji, Linus U.

    2004-01-01

    NASA's extensive efforts towards more efficient, safer, and more affordable space transportation include the development of new thrust-cell liner materials with improved capabilities and longer lives. For rocket engines fueled with liquid hydrogen, an important metric of liner performance is resistance to blanching, a phenomenon of localized wastage by cycles of oxidation-reduction due to local imbalance in the oxygen-fuel ratio. The current liner of the Space Shuttle Main Engine combustion chamber, a Cu-3Ag-0.5Zr alloy (NARloy-Z) is degraded in service by blanching. Heretofore, evaluating a liner material for blanching resistance involved elaborate and expensive hot-fire tests performed on rocket test stands. To simplify that evaluation, researchers at the NASA Glenn Research Center developed a screening test that uses simple, in situ oxidation-reduction cycling in a thermogravimetric analyzer (TGA). The principle behind this test is that resistance to oxidation or to the reduction of oxide, or both, implies resistance to blanching. Using this test as a preliminary tool to screen alloys for blanching resistance can improve reliability and save time and money. In this test a small polished coupon is hung in a TGA furnace at the desired (service) temperature. Oxidizing and reducing gases are introduced cyclically, in programmed amounts. Cycle durations are chosen by calibration, such that all copper oxides formed by oxidation are fully reduced in the next reduction interval. The sample weight is continuously acquired by the TGA as usual.

  1. Heat load behaviors of plasma sprayed tungsten coatings on copper alloys with different compliant layers

    Energy Technology Data Exchange (ETDEWEB)

    Chong, F.L. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031 (China)], E-mail: flch@ipp.ac.cn; Chen, J.L.; Li, J.G. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031 (China); Hu, D.Y.; Zheng, X.B. [Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200051 (China)

    2008-04-15

    Plasma sprayed tungsten (PS-W) coatings with the compliant layers of titanium (Ti), nickel-chromium-aluminum (NiCrAl) alloys and W/Cu mixtures were fabricated on copper alloys, and their properties of the porosity, oxygen content, thermal conductivity and bonding strength were measured. High heat flux tests of actively cooled W coatings were performed by means of an electron beam facility. The results indicated that APS-W coating showed a poorer heat transfer capability and thermo-mechanical properties than VPS-W coating, and the compliant layers improved W coating performance under the heat flux load. Among three compliant layers, W/Cu was the preferable because of its better effects on heat removal and stress alleviating. The optimization of W/Cu compliant layer found that 0.1 mm and 25 vol.%W was optimum compliant layer structure for 1 mm W coating, which induced a 23% reduction of the maximum stress compared to the sharp interface, and the plastic strain was reduced to 0.01% from 1.55%.

  2. Heat load behaviors of plasma sprayed tungsten coatings on copper alloys with different compliant layers

    Science.gov (United States)

    Chong, F. L.; Chen, J. L.; Li, J. G.; Hu, D. Y.; Zheng, X. B.

    2008-04-01

    Plasma sprayed tungsten (PS-W) coatings with the compliant layers of titanium (Ti), nickel-chromium-aluminum (NiCrAl) alloys and W/Cu mixtures were fabricated on copper alloys, and their properties of the porosity, oxygen content, thermal conductivity and bonding strength were measured. High heat flux tests of actively cooled W coatings were performed by means of an electron beam facility. The results indicated that APS-W coating showed a poorer heat transfer capability and thermo-mechanical properties than VPS-W coating, and the compliant layers improved W coating performance under the heat flux load. Among three compliant layers, W/Cu was the preferable because of its better effects on heat removal and stress alleviating. The optimization of W/Cu compliant layer found that 0.1 mm and 25 vol.%W was optimum compliant layer structure for 1 mm W coating, which induced a 23% reduction of the maximum stress compared to the sharp interface, and the plastic strain was reduced to 0.01% from 1.55%.

  3. High-performance Copper Alloy QBD-6%高性能铜合金QBD-6

    Institute of Scientific and Technical Information of China (English)

    曾力维; 张舟逸; 蒋中华

    2015-01-01

    Use electromagnetic stirring, horizontal continuous casting to break casting structure and refine casting the precipitates "Ni - P" compounds by high temperature annealing. After 20 finished rolling mills, the production of QBD - 6 high-performance copper alloy plate strips has high strength, high elasticity, high conductivity, high finish and other characteristics which can replace imported alloy, such as: MF202, CAC5 and some low-intensity C7025. This can be successfully applied to the lead frame materials, connectors, terminals, and motor brush components in power tools.%采用电磁搅拌水平连铸,破碎铸造组织并通过高温退火细化铸造组织中的析出物"Ni-P"化合物,经过20辊轧机的成品轧制,生产的QBD-6高性能铜合金板带材具有高强度、高弹性、高导电和高光洁度等特性,可替代进口合金,如:M F202、C A C5以及部分低强度的C7025.成功应用于引线框架材料、连接器、端子以及电动工具中的电机电刷部件.

  4. Effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 350 degrees C

    DEFF Research Database (Denmark)

    Singh, B.N.; Edwards, D.J.; Eldrup, Morten Mostgaard

    2001-01-01

    Screening experiments were carried out to determine the effect of bonding and bakeout thermal cycles on microstructure, mechanical properties and electrical resistivity of the oxide dispersion strengthened (GlidCop, CuAl-25) and the precipitation hardened (CuCrZr, CuNiBe) copper alloys. Tensile...... results are described and their salient features discussed. The most significant effect of neutron irradiation is a severe loss of ductility in the case of CuNiBe alloys. (C) 2001 Elsevier Science B.V. All rights reserved....

  5. Corrosion Inhibition Performance of Triazole Derivatives on Copper-Nickel Alloy in 3.5 wt.% NaCl Solution

    Science.gov (United States)

    Jiang, B.; Jiang, S. L.; Liu, X.; Ma, A. L.; Zheng, Y. G.

    2015-12-01

    This study investigates the performance of three triazole derivatives with different molecular structures as corrosion inhibitors for the copper-nickel alloy CuNi 90/10 in 3.5 wt.% NaCl solution. Inhibition behavior was systematically determined through electrochemical measurements, scanning electron microscopy, energy-dispersive spectroscopy, and Fourier transform infrared spectroscopy. In addition, adsorption behavior and the inhibition mechanism were investigated via quantum chemical calculation and molecular dynamic simulation. Experimental results indicate that the three inhibitors with triazole rings and heteroatoms exhibited excellent corrosion inhibition capabilities on the copper-nickel alloy surface through physisorption and chemisorption. In particular, 3-amino-5-mercapto-1,2,4-triazole showed the best inhibition capability according to the concentration ranges considered in the experiments. The results of quantum chemical calculation agreed with the experimental findings.

  6. Effects of silicon, copper and iron on static and dynamic properties of alloy 206 (aluminum-copper) in semi-solids produced by the SEED process

    Science.gov (United States)

    Lemieux, Alain

    The advantages of producing metal parts by rheocasting are generally recognised for common foundry alloys of Al-Si. However, other more performing alloys in terms of mechanical properties could have a great interest in specialized applications in the automotive industry, while remaining competitive in the forming. Indeed, the growing demand for more competitive products requires the development of new alloys better suited to semi-solid processes. Among others, Al-Cu alloys of the 2XX series are known for their superior mechanical strength. However, in the past, 2XX alloys were never candidates for pressure die casting. The main reason is their propensity to hot tearing. Semi-solid processes provide better conditions for molding with the rheological behavior of dough and molding temperatures lower reducing this type of defect. In the initial phase, this research has studied factors that reduce hot tearing susceptibility of castings produced by semi-solid SEED of alloy 206. Subsequently, a comparative study on the tensile properties and fatigue was performed on four variants of the alloy 206. The results of tensile strength and fatigue were compared with the specifications for applications in the automotive industry and also to other competing processes and alloys. During this study, several metallurgical aspects were analyzed. The following main points have been validated: i) the main effects of compositional variations of silicon, iron and copper alloy Al-Cu (206) on the mechanical properties, and ii) certain relationships between the mechanism of hot cracking and the solidification rate in semi-solid. Parts produced from the semi-solid paste coming from the SEED process combined with modified 206 alloys have been successfully molded and achieved superior mechanical properties than the requirements of the automotive industry. The fatigue properties of the two best modified 206 alloys were higher than those of A357 alloy castings and are close to those of the

  7. Effects of bonding bakeout thermal cycles on pre- and post irradiation microstructures, physical, and mechanical properties of copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Singh, B.N.; Eldrup, M.; Toft, P.; Edwards, D.J. [Pacific Northwest National Laboratory, Richland, WA (United States)

    1996-10-01

    At present, dispersion strengthened (DS) copper is being considered as the primary candidate material for the ITER first wall and divertor components. Recently, it was agreed among the ITER parties that a backup alloy should be selected from the two well known precipitation hardened copper alloys, CuCrZr and CuNiBe. It was therefore decided to carry out screening experiments to simulate the effect of bonding and bakeout thermal cycles on microstructure, mechanical properties, and electrical resistivity of CuCrZr and CuNiBe alloys. On the basis of the results of these experiments, one of the two alloys will be selected as a backup material. Tensile specimens of CuCrZr and CuNiBe alloys were given various heat treatments corresponding to solution anneal, prime ageing, and bonding thermal cycle followed by reageing and the reactor bakeout treatment at 623K for 100 hours. Tensile specimens of the DS copper were also given the heat treatment corresponding to the bonding thermal cycle. A number of these heat treated specimens of CuCrZr, CuNiBe, and DS copper were neutron irradiated at 523K to a dose level of {approx}0.3 dpa (NRT) in the DR-3 reactor at Riso. Both unirradiated and irradiated specimens with the various heat treatments were tensile tested at 532K. The dislocation, precipitate and void microstructures and electrical resistivity of these specimens were also determined. Results of these investigations will be reported and discussed in terms of thermal and irradiation stability of precipitates and irradiation-induced precipitation and recovery of dislocation microstructure. Results show that the bonding and bakeout thermal cycles are not likely to have any serious deleterious effects on the performance of these alloys. The CuNiBe alloys were found to be susceptible to radiation-induced embrittlement, however, the exact mechanism is not yet known. It is thought that radiation-induced precipitation and segregation of the beryllium may be responsible.

  8. Preparation and Analysis of Complex Barrier Layer of Heterocyclic and Long-Chain Organosilane on Copper Alloy Surface

    Directory of Open Access Journals (Sweden)

    Qian Zhao

    2016-07-01

    Full Text Available A single electrodeposited film of 6-(3-triethoxysilylpropylamino-1,3,5-triazine-2,4-dithiol monosodium (TES on a copper alloy surface was prepared by the galvanostatic method, then octyl-triethoxysilane (OTES or hexadecyl-trimethoxysilane (HDTMS was used to modify the electrodeposited film by the self-assembled technique to fabricate the complex film. The electrodeposition process was inferred by cyclic voltammetry. The single and complex films were characterized by means of contact angle, cyclic voltammetry, Fourier transform infrared spectroscopy (FT-IR, potentiodynamic polarization, electrochemical impedance spectroscopy (EIS and scanning electron microscope (SEM. The results showed that the contact angle of the complex film covering the copper alloy surface was up to 118.1° compared with 89.4° of the bare copper alloy. The cyclic voltammogram, polarization curves and EIS indicated that the anti-corrosion performance of complex film was better than that of single electrodeposited TES film, and the protection efficiency was up to 90.2%.

  9. Auger electron spectroscopy study of initial stages of oxidation in a copper - 19.6-atomic-percent-aluminum alloy

    Science.gov (United States)

    Ferrante, J.

    1973-01-01

    Auger electron spectroscopy was used to examine the initial stages of oxidation of a polycrystalline copper - 19.6 a/o-aluminum alloy. The growth of the 55-eV aluminum oxide peak and the decay of the 59-, 62-, and 937-eV copper peaks were examined as functions of temperature, exposure, and pressure. Pressures ranged from 1x10 to the minus 7th power to 0.0005 torr of O2. Temperatures ranged from room temperature to 700 C. A completely aluminum oxide surface layer was obtained in all cases. Complete disappearance of the underlying 937-eV copper peak was obtained by heating at 700 C in O2 at 0.0005 torr for 1 hr. Temperature studies indicated that thermally activated diffusion was important to the oxidation studies. The initial stages of oxidation followed a logarithmic growth curve.

  10. Effect of Water Nutrient Pollution on Long-Term Corrosion of 90:10 Copper Nickel Alloy

    Directory of Open Access Journals (Sweden)

    Robert E. Melchers

    2015-11-01

    Full Text Available Due to their good corrosion resistance, copper and copper alloys such as 90:10 Cu-Ni are used extensively in high-quality marine and industrial piping systems and also in marine, urban, and industrial environments. Their corrosion loss and pitting behaviour tends to follow a bi-modal trend rather than the classic power law. Field data for 90:10 copper nickel immersed in natural seawater are used to explore the effect of water pollution and in particular the availability of critical nutrients for microbiologically induced corrosion. It is shown, qualitatively, that increased dissolved inorganic nitrogen increases corrosion predominantly in the second, long-term, mode of the model. Other, less pronounced, influences are salinity and dissolved oxygen concentration.

  11. fs/ns dual-pulse LIBS analytic survey for copper-based alloys

    Energy Technology Data Exchange (ETDEWEB)

    Santagata, A. [CNR-IMIP, Unita Operativa di Potenza, Zona Industriale di Tito Scalo, 85050 Tito Scalo, PZ (Italy)], E-mail: santagata@pz.imip.cnr.it; Teghil, R. [Universita degli Studi della Basilicata, Dipartimento di Chimica, Via N. Sauro 85, 85100 Potenza (Italy); Albano, G.; Spera, D.; Villani, P. [CNR-IMIP, Unita Operativa di Potenza, Zona Industriale di Tito Scalo, 85050 Tito Scalo, PZ (Italy); De Bonis, A. [Universita degli Studi della Basilicata, Dipartimento di Chimica, Via N. Sauro 85, 85100 Potenza (Italy); Parisi, G.P. [CNR-IMIP, Unita Operativa di Potenza, Zona Industriale di Tito Scalo, 85050 Tito Scalo, PZ (Italy); Galasso, A. [Universita degli Studi della Basilicata, Dipartimento di Chimica, Via N. Sauro 85, 85100 Potenza (Italy)

    2007-12-15

    The quantitative analytic capability of a fs/ns dual-pulse Laser-Induced Breakdown Spectroscopy technique, based on the orthogonal reheating of a fs-laser ablation plume by a ns-laser pulse, is presented. In this work, it is shown how the effect played by the delay times between the two laser beams can vary the analytical response of this dual-pulse LIBS configuration. In order to address this task, the Sn, Pb and Zn calibration curves of five certified copper-based samples have been investigated. These calibration curves have been obtained, in air at atmospheric pressure, by integrating the emission data collected in two different inter-pulse delay zones, one in the delay interval of 1-41 {mu}s, the other within the range of 46-196 {mu}s. For drawing the species calibration curves, the emission intensities of the considered Pb(I), Sn(I) and Zn(I) electronic transitions have been normalized with a non-resonant Cu(I) emission line. The experimental results have shown that, by varying the inter-pulse delay between the two laser beams, complementary analytical results can be induced. By considering at once all data acquired within the inter-pulse delay time of 1-196 {mu}s, this hypothesis has been strengthened. The calibration curves obtained in this way are characterized by excellent linear regression coefficients (0.988-0.999) despite of the large Sn, Pb and Zn compositional variation of the targets employed. The results presented reveal, for the first time, that, by taking into account the role played by the inter-pulse delay time between the two laser beams, the fs/ns dual-pulse LIBS configuration here used can be improved and provide very good opportunities for performing quantitative analysis of copper-based alloys.

  12. Determination of Copper in Silver Copper Alloys by ICP-AES%ICP-AES法测定银铜合金中的铜

    Institute of Scientific and Technical Information of China (English)

    刘守琼; 黄晴晴; 周西林

    2015-01-01

    采用电感耦合等离子体原子发射光谱法( ICP-AES)测定银铜合金中铜的含量。准确称取0.1000 g的银铜合金样品于三角瓶中,加5 mL硝酸(ρ=1.42 g·mL-1),待反应完毕后,加少许水,加入一定浓度的盐酸溶液,将银沉淀下来,经过滤定容后,选择波长Cu327.396 nm,按照额定工作条件上机测定其铜含量,其检出限为0.01 mg/L,精密度( RSD%)控制在1.0%以内,回收率在(97%~103%)之间;用5个自制样品进行测定(n=10),其结果符合要求。%The content of copper in silver copper alloys was determined by inductively coupled plasma atomic emission spectrometry ( ICP-AES) . Accurately measured 0. 1000 g copper and silver alloy samples in erlenmeyer flask, added 5 mL nitric acid ( P=1. 42 g·mL-1 ) , after waiting for the completion of the reaction, added a little water, and a certain concentration of hydrochloric acid solution, silver precipitation precipitated, after filter and volume, selected wavelength Cu327. 396 nm, the copper content was determinate according to rated working conditions on the machine. The detection limit was 0. 01 mg/L, the precision ( RSD) control was less than 1. 0%, recovery rate was 97% ~103%, five homemade samples were measured ( n=10 ) and the results conformed to the requirements.

  13. Textured tape substrates from binary copper alloys with vanadium and yttrium for the epitaxial deposition of buffer and superconducting layers

    Science.gov (United States)

    Khlebnikova, Yu. V.; Rodionov, D. P.; Egorova, L. Yu.; Suaridze, T. R.

    2016-05-01

    The structure of tapes of binary Cu-0.6 wt % V and Cu-1 wt % Y alloys and texturing process of them in the course of cold deformation by rolling to 99% and subsequent recrystallizing annealing have been studied. The possibility of achieving the perfect cube texture in thin tapes made from binary copper-based alloys with vanadium and yttrium additions has in principle been shown. This opens the prospect of using them as substrates when manufacturing tapes of second-generation high-temperature superconductors. Optimum annealing conditions for the studied alloys have been determined, which have made it possible to produce the perfect biaxial texture with a content of cube {001} ± 10° grains on the surfaces of textured tapes of more than 95%.

  14. The deformation texture of rolled ribbons of copper-based alloys as a condition of producing a sharp cubic texture upon recrystallization

    Science.gov (United States)

    Gervas'eva, I. V.; Rodionov, D. P.; Khlebnikova, Yu. V.

    2015-07-01

    It has been shown that a specific quantitative relationship of main textural components after cold deformation (by rolling to 98.6-99%) of copper alloys determines the possibility of producing a sharp cubic texture in the ribbons after subsequent recrystallization annealing. The binary alloys of copper with nickel (up to 40 at %) and of copper with additions of iron and chromium correspond to this criterion. It has been found that the optimum deformation texture can be created in some ternary copper-nickel alloys with addition of Cr, Fe or Mn. It has been shown that the analysis of the component composition of deformation textures using the orientation distribution function can yield more precise predictions than the stacking fault energy values, as well as make it possible to obtain a cubic texture upon subsequent recrystallization.

  15. Microanalysis of oligodeoxynucleotides by cathodic stripping voltammetry at amalgam-alloy surfaces in the presence of copper ions.

    Science.gov (United States)

    Hason, Stanislav; Vetterl, Vladimír

    2006-05-15

    The application of gold amalgam-alloy electrode (AuAE) for a sensitive voltammetric detection of different oligodeoxynucleotides (ODNs) containing the purine units within the ODN-chains in the presence of copper is described. The detection of ODNs is based on the following procedure: (i) the first step includes an acidic hydrolysis of the ODN (ahODN) samples performing the release of the purine bases from ODN-chain; (ii) the second step includes an electrochemical accumulation of the complex of the purine base residues released from ODN-chain with copper ions Cu(I) (ahODN-Cu(I) complex) at the potential of reduction of copper ions Cu(II) on the amalgam-alloy electrode surfaces; (iii) finally followed the cathodic stripping of the electrochemically accumulated ahODN-Cu(I) complex from the electrode surface. The proposed electrochemical method was used for: (a) detection of different ODN lengths containing only adenine units (the number of adenine units within the ODN-chains was changed from 10 to 80), and (b) determination of the number of purine units within the 30-mer ODNs containing a random sequence segments involving both the purine and pyrimidine units. The intensity of the cathodic stripping current density peak (j(CSP)) of the electrochemically accumulated ahODN-Cu(I) complex increased linearly with the increasing number of purine units within the ODN-chains. We observed a good correlation between the percentage content of purine units to the whole length of different 30-mer ODNs and the percentage content of the intensity of the j(CSP) of the electrochemically accumulated 30-mer ahODN-Cu(I) complexes. The detection of acid hydrolysed 80-mer (A(80)) in the bulk solution and in a 20-mul volume is possible down to 200pM and 2nM at the AuAE, respectively. For the shortest 10-mer (A(10)) a detectable value of 5nM in the bulk solution on the AuAE was observed. The sensitive detection of different ODNs containing the purine units in their chains in the presence of

  16. The effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 C

    Energy Technology Data Exchange (ETDEWEB)

    Edwards, D.J. [Pacific Northwest National Lab., Richland, WA (United States); Singh, B.N.; Toft, P.; Eldrup, M. [Risoe National Lab., Roskilde (Denmark)

    1998-03-01

    This report describes the final irradiation experiment in a series of screening experiments aimed at investigating the effects of bonding and bakeout thermal cycles on irradiated copper alloys. Tensile specimens of CuCrZr and CuNiBe alloys were given various heat treatments corresponding to solution anneal, prime-ageing and bonding thermal treatment. The post-irradiation tests at 100 C revealed the greatest loss of ductility occurred in the CuCrZr alloys, irrespective of the pre-irradiation heat treatment, with the uniform elongation dropping to levels of less than 1.5%. The yield and ultimate strengths for all of the individual heat treated samples increased substantially after irradiation. The same trend was observed for the CuNiBe alloys, which overall exhibited a factor of 3 higher uniform elongation after irradiation with almost double the strength. In both alloys irradiation-induced precipitation lead to a large increase in the strength of the solution annealed specimens with a noticeable decrease in uniform elongation. The Al25 alloy also experienced an increase in the overall strength of the alloy after irradiation, accompanied by approximately a 50% decrease in the uniform and total elongation. The additional bakeout treatments given to the CuCrZr and CuNiBe before irradiation served to increase the strength, but in terms of the ductility no improvement or degradation resulted from the additional thermal exposure. The results of this experiment confirm that the al25 possesses the most resistant microstructure to thermal and irradiation-induced changes, while the competing effects of ballistic dissolution and reprecipitation lead to important changes in the two precipitation strengthened alloys. This study and others have repeatedly shown that these materials can only be used if the very low uniform elongation (1% or less) can be accounted for in the design since pre-irradiation thermal processing cannot mitigate the irradiation embrittlement.

  17. Investigation of copper and copper alloy's welding and discussion on manual SHS welding of copper and copper alloy%铜及铜合金焊接研究现状和手工自蔓延焊接铜问题探讨

    Institute of Scientific and Technical Information of China (English)

    曲利峰; 辛文彤; 吴永胜; 李志尊

    2011-01-01

    Meaning of research on Copper and Copper Alloy's welding is of great importance because of the good property and abroad application. Technical characteristics of Copper and Copper AIloy's normal welding,like gas welding,brazing and soldering,activing welding, MIG welding,friction stir welding, thermit friction stir welding,laser welding,laser welding electron beam welding and Self-propagating High-temperature Synthesis (SHS) welding was studied and classified in the paper as well as the analysis about domestic and foreign present situation of research. It is also analyzed that how normal welding can provide direction and guidance for the Manual SHS Welding Technology of Copper and Copper Alloy. Moreover,the present problem of manual SHS welding of copper and copper alloy is diseussed,especially the wettability between welding seam and base metal,the separation between slag and welding seam on emphasis,and the further research orientation was indicated.%概述了铜及铜合金的气焊、钎焊、活性焊、MIG焊、搅拌摩擦焊及热摩擦搅拌焊、激光焊、电子束焊等常规焊法和自蔓延焊法的技术特点及国内外的研究现状.论述了在当前铜及铜合金手工自蔓延焊接技术的研究过程中如何借鉴融合其他焊接技术的工艺及机理,并讨论了铜及铜合金手工自蔓延焊接所存在的问题并对其产生原因作了初步分析.着重分析了焊接时熳缝金属与母材的润湿性,熔渣与焊缝金属的分离等当亟需解决的问题,指出了需要深入研究的方向和解决问题的思路.

  18. Orthogonal fs/ns double-pulse libs for copper-based-alloy analysis

    Energy Technology Data Exchange (ETDEWEB)

    Santagata, A.; Spera, D.; Albano, G.; Parisi, G.P.; Villani, P. [Zona Industriale di Tito Scalo, CNR-IMIP, Unita Operativa di Potenza, Tito Scalo (Italy); Teghil, R.; Bonis, A. de [Universita degli Studi della Basilicata, Dipartimento di Chimica, Potenza (Italy)

    2008-12-15

    The analytical response of a fs/ns double-pulse laser induced breakdown spectroscopy technique based on the orthogonal reheating induced by a ns-laser pulse on a fs-laser ablation plume is presented. All investigations have been performed in air at atmospheric pressure and employing certified copper-based-alloy targets. The emission intensities of the considered electronic transitions of Pb(I), Sn(I) and Zn(I) have been normalised with a Cu(I) emission line intensity belonging to the same considered spectral range. Emission data, acquired with inter-pulse steps of 2 {mu}s within the delay range of 1-200 {mu}s, have shown that fractionation takes place. Nevertheless, excellent linear regression coefficients (0.998-0.999), despite the target's large compositional variation and fractionation effects, have been obtained by integrating all emission intensity data along the whole inter-pulse delays used. Deviations from the theoretical ratio of the Zn(I)/Cu(I) emission intensities are shown and some hypotheses about the processes involved are formulated. (orig.)

  19. Influence of annealing treatment on properties and microstructures of alumina dispersion strengthened copper alloy

    Institute of Scientific and Technical Information of China (English)

    SONG Ke-xing; XING Jian-dong; TIAN Bao-hong; LIU Ping; DONG Qi-ming

    2005-01-01

    Alumina dispersion strengthened copper(ADSC) alloy was produced by internal oxidation.The hardness,ultimate tensile strength and electrical conductivity measurements and microstructure observation on the produced 0.12% ADSC(0.24% Al2O3,mass fraction)and 0.25% ADSC(0.50% Al2O3 )subjected to different annealing treatments were conducted.The results show that the microstructure of the produced ADSC is characterized by an uniform distribution of nano-Al2O3 particles in Cu-matrix;the particles range in size from 20 to 50 nm with an interparticle spacing of 30-100 nm.The produced 0.12% ADSC can maintain more than 87% hardness retention after900 ℃,1 h annealing treatment;the recrystallization can be largely retarded and is not fully completed even after annealing at 1 000 ℃ for 1 h,followed by cold deformation of 84%;local grain growth can be observed after 1 050 ℃,1 h annealing treatment.The results also show that increasing either the alumina content or cold deformation degree increases the hardness of the produced ADSC.

  20. ALLOYING EFFECT OF Ni AND Cr ON THE WETTABILITY OF COPPER ON W SUBSTRATE

    Institute of Scientific and Technical Information of China (English)

    X.H.Yang; P.Xiao; S.H.Liang; J.T.Zou; Z.K.Fan

    2008-01-01

    By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and the wetting mechanisms of copper on W substrate have been investigated in detail. The results show that the wetting angles of Cu on the W substrate are decreased with an increase in the content of Ni or Cr, and also decrease with raising the wetting temperatures. SEM, EPMA, and X-ray diffraction have been used to analyze the interracial characteristics of the CuNi/W and CuCr/W systems. The results reveal that there is a transition layer about 2-3 μm in the interface of Cu-4.0 wt pet Ni/W, in which the intermetallic phase Ni4W is precipitated. As to CuCr/W system, no reaction occurs at the interface. The two factors are that the contents of Cr and Ni and the infiltration temperature must be chosen appropriately in order to control the interfacial dissolution and reaction when the Cu-W alloys are prepared by the infiltration method.

  1. Inverse Calibration Free fs-LIBS of Copper-Based Alloys

    Science.gov (United States)

    Smaldone, Antonella; De Bonis, Angela; Galasso, Agostino; Guarnaccio, Ambra; Santagata, Antonio; Teghil, Roberto

    2016-09-01

    In this work the analysis by Laser Induced Breakdown Spectroscopy (LIBS) technique of copper-based alloys having different composition and performed with fs laser pulses is presented. A Nd:Glass laser (Twinkle Light Conversion, λ = 527 nm at 250 fs) and a set of bronze and brass certified standards were used. The inverse Calibration-Free method (inverse CF-LIBS) was applied for estimating the temperature of the fs laser induced plasma in order to achieve quantitative elemental analysis of such materials. This approach strengthens the hypothesis that, through the assessment of the plasma temperature occurring in fs-LIBS, straightforward and reliable analytical data can be provided. With this aim the capability of the here adopted inverse CF-LIBS method, which is based on the fulfilment of the Local Thermodynamic Equilibrium (LTE) condition, for an indirect determination of the species excitation temperature, is shown. It is reported that the estimated temperatures occurring during the process provide a good figure of merit between the certified and the experimentally determined composition of the bronze and brass materials, here employed, although further correction procedure, like the use of calibration curves, can be demanded. The reported results demonstrate that the inverse CF-LIBS method can be applied when fs laser pulses are used even though the plasma properties could be affected by the matrix effects restricting its full employment to unknown samples provided that a certified standard having similar composition is available.

  2. Integrated Behavior of Carbon and Copper Alloy Heat Sink Under Different Heat Loads and Cooling Conditions

    Institute of Scientific and Technical Information of China (English)

    Li Hua; Li Jiangang; Chen Junling; Hu Jiansheng

    2005-01-01

    An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m2 and a water flow rate of 3 m3/h, 4.5 m3/h and 6 m3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m2 of heat flux and 6 ms/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.

  3. Spark plasma sintering of mechanically alloyed in situ copper-niobium carbide composite

    Energy Technology Data Exchange (ETDEWEB)

    Long, B.D. [School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang (Malaysia); Department of Production Systems Engineering, Toyohashi University of Technology (Japan); Othman, R. [School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang (Malaysia); Umemoto, M. [Department of Production Systems Engineering, Toyohashi University of Technology (Japan); Zuhailawati, H., E-mail: zuhaila@eng.usm.m [School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang (Malaysia)

    2010-09-03

    A Cu-NbC composite with high electrical conductivity and high microhardness was synthesized by mechanical alloying and densified using spark plasma sintering (SPS). Mixtures of Cu-NbC powders corresponding to volume fractions of 1, 5, 15 and 25 vol% NbC were milled in a high energy planetary mill under argon atmosphere for 30 h using ethanol as process control agent. The Cu-NbC as-milled powder was sintered using spark plasma sintering temperatures between 900 and 1000 {sup o}C. X-ray diffraction investigation showed that NbC started to form in the copper matrix during ball milling and the reaction between Nb and C was completed after 10 min of SPS sintering. Electrical conductivity and density of the Cu-15 vol% NbC composite increased with increasing sintering temperature. The results showed the superior properties of SPS-prepared Cu-NbC composite: electrical conductivity is almost 4 times higher and microhardness is 3.5 times higher than with normal sintering. A highest density of 98% and electrical conductivity of 45.6% IACS were obtained in the Cu-1 vol% NbC composite. The highest microhardness of 452.9 Hv was achieved in the Cu-25 vol% NbC composite.

  4. Fabrication and characterization of Y{sub 2}O{sub 3} dispersion strengthened copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Carro, G.; Muñoz, A. [Departamento de Física, Universidad Carlos III de Madrid, 28911 Leganés (Spain); Monge, M.A., E-mail: mmonge@fis.uc3m.es [Departamento de Física, Universidad Carlos III de Madrid, 28911 Leganés (Spain); Savoini, B.; Pareja, R.; Ballesteros, C. [Departamento de Física, Universidad Carlos III de Madrid, 28911 Leganés (Spain); Adeva, P. [Centro Nacional de Investigaciones Metalúrgicas, CSIC, Av. Gregorio del Amo, 8, 28040 Madrid (Spain)

    2014-12-15

    Three copper base materials were fabricated following different routes: cast Cu–1 wt.%Y (C-Cu1Y) produced by vacuum induction melting, and Cu–1 wt.%Y (PM-Cu1Y) and Cu–1 wt.%Y{sub 2}O{sub 3} (PM-Cu1Y{sub 2}O{sub 3}) both processed by a powder metallurgy route and sintering by hot isostatic pressing. PM-Cu1Y alloy was prepared by cryomilling and PM-Cu1Y{sub 2}O{sub 3} by conventional milling at room temperature. The materials were characterized by X-ray diffraction, optical and electron microscopy and microhardness measurements. C-Cu1Y presents a characteristic eutectic microstructure while PM-Cu1Y{sub 2}O{sub 3} exhibits a composite like microstructure. Electron microscopy analyses of as-HIP PM-Cu1Y revealed irregular decoration of yttrium-rich oxides at the grain boundaries and an inhomogeneous dispersion of polygonal shaped yttrium-rich oxides dispersed in the Cu matrix. Tensile tests performed on PM-Cu–1Y on the temperature range of 293–773 K have showed a decrease of the yield strength at temperatures higher than 473 K, and monotonically decrease of the ultimate tensile strength and maximum plastic strain on increasing temperature.

  5. The properties of high-energy milled pre-alloyed copper powders containing 1 wt. % Al

    Directory of Open Access Journals (Sweden)

    VISESLAVA RAJKOVIC

    2007-01-01

    Full Text Available The microstructural and morphological changes of inert gas atomized pre-alloyed Cu-1 wt. % Al powders subjected to hith-energy milling were studied. The microhardness of hot-pressed compacts was measured as a function of milling time. The thermal stability during exposure at 800 °C and the electrical conductivity of compacts were also examined. During the high-energy milling, severe deformation led to refinement of the powder particle grain size (from 550 nm to about 55 nm and a decrease in the lattice parameter (0.10 %, indicating precipitation of aluminium from the copper matrix. The microhardness of compacts obtained from 5 h-milled powders was 2160 MPa. After exposure at 800 °C for 5 h, these compacts still exhibited a high microhardness value (1325 MPa, indicating good thermal stability. The increase of microhardness and good thermal stability is attributed to the small grain size (270 and 390 nm before and after high temperature exposure, respectively. The room temperature electrical conductivity of compacts processed from 5 h-milled powder was 79 % IACS.

  6. Mechanisms and rate of dislocation nucleation in aluminum-copper alloys near Guinier-Preston zones

    Science.gov (United States)

    Bryukhanov, I. A.; Larin, A. V.

    2016-12-01

    This article is devoted to a molecular dynamics simulation study of partial dislocation loop nucleation with respect to its mechanism and rate, and its propagation process under high shear stress in aluminum-copper alloys. The mechanisms of dislocation nucleation near Guinier-Preston (GP) zones of various diameters and concentrations have been analyzed. Dislocation nucleation rates near plain GP Cu-zones with diameters of 3.5, 7.5, and 13.5 nm and at various concentrations have been calculated using the mean lifetime method with temperatures in range of 100 and 700 K. It has been found that depending on the temperature and applied stress, the dislocation can nucleate either from the edge, or from the plain area of a GP zone. The dislocation nucleation is preceded by a generation of defect clusters that are formed due to local opposite atomic shifts in two adjacent (111) planes by the half-length of a Burgers vector of a partial dislocation. The expansion of a partial dislocation loop can be accompanied by the formation of twins via a shift of the atoms in the internal region of the loop. The twin velocity along the direction of the partial dislocation Burgers vector inside the loop can achieve longitudinal sound speed. The speeds of the edge and screw segments of a partial dislocation loop as a function of a shear stress component along the Burgers vector have been estimated. The latter seems to be limited by the shear sound speed.

  7. Determination of microstructural changes by severely plastically deformed copper-aluminum alloy: Optical study

    Directory of Open Access Journals (Sweden)

    Romčević N.

    2014-01-01

    Full Text Available Our work deals with the problem of producing a complex metal-ceramic composite using the processes of internal oxidation (IO and severe plastic deformation. For this purpose, Cu-Al alloy with 0.4wt.% of Al was used. IO of sample serves in the first step of the processing as a means for attaining a fine dispersion of nanosized oxide particles in the metal matrix. Production technology continues with repeated application of severe plastic deformation (SPD of the resulting metalmatrix composite to produce the bulk nanoscaled structural material. SPD was carried out with equal channel angular pressing (ECAP, which allowed that the material could be subjected to an intense plastic strain through simple shear. Microstructural characteristics of one phase and multiphase material was studied on internally oxidized Cu with 0.4wt.% of Al sample composed of one phase copper-aluminum solid solution in the core and fine dispersed oxide particles in the same matrix in the mantle region. In this manner AFM, X-ray diffraction and Raman spectroscopy were used. Local structures in plastically deformed samples reflect presence of Cu, CuO, Cu2O, Cu4O3 or Al2O3 structural characteristics, depending on type of sample. [Projekat Ministarstva nauke Republike Srbije, br. III45003

  8. Antimicrobial Properties of Selected Copper Alloys on Staphylococcus aureus and Escherichia coli in Different Simulations of Environmental Conditions: With vs. without Organic Contamination

    Directory of Open Access Journals (Sweden)

    Anna Różańska

    2017-07-01

    Full Text Available Background: Hospital equipment made from copper alloys can play an important role in complementing traditional methods of disinfection. Aims of the study: The aim of this study was to assess the dynamics of the antimicrobial properties of selected copper alloys in different simulations of environmental conditions (with organic contamination vs. without organic contamination, and to test alternatives to the currently used testing methods. Materials and Methods: A modification of Japanese standard JIS Z 2801 as well as Staphylococcus aureus (SA and Escherichia coli (EC suspended in NaCl vs. tryptic soy broth (TSB were used in tests performed on seven commonly used copper alloys, copper, and stainless steel. Results: A much faster reduction of the bacterial suspension was observed for the inoculum prepared in NaCl than in TSB. A faster reduction for EC than for SA was observed in the inoculum prepared in NaCl. The opposite results were found for the inoculum based on TSB. A significant correlation between the copper concentration in the copper alloys and the time and degree of bacterial suspension reduction was only observed in the case of EC. Conclusions: This study confirmed the antimicrobial properties of copper alloys, and additionally showed that Staphylococcus aureus was more resistant than Escherichia coli in the variant of the experiment without organic contamination. However, even for SA, a total reduction of the bacterial inoculum’s density took no longer than 2 h. Under conditions simulating organic contamination, all of the tested alloys were shown to have bactericidal or bacteriostatic properties, which was contrary to the results from stainless steel.

  9. Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

    Science.gov (United States)

    Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

    2017-09-01

    An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

  10. Copper Products Capacity Expansion Stimulate the Copper Consumption

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    <正>The dramatic growth of copper consumption in China can directly be seen from the expansion of copper products capacity.According to sta- tistics,in the past 4 years,the improvement on the balance of trade on copper bar,copper,and copper alloy and copper wire & cable has driven the growth of copper consumption a lot.

  11. Auger electron spectroscopic study of mechanism of sulfide-accelerated corrosion of copper-nickel alloy in seawater

    Science.gov (United States)

    Schrader, Malcolm E.

    The mechanism of sulfide-induced accelerated corrosion of 90-10 copper-nickel(iron) alloy is investigated. Samples of the alloy are exposed to flowing (2.4 m/s) seawater, with and without 0 01 mg/l sulfide, for various periods of time. The resulting surfaces are examined by means of Auger electron spectroscopy coupled with inert-ion-homoardment. A detailed depth profile is thereby obtained of concentrations in the surface region of a total of nine elements. The results are consistent with the hypothesis that iron hydroxide segregates at the surface to form a protective gelatinous layer against the normal chloride-induced corrosion process. Trace sulfide interferes with formation of a good protective layer and leaves the iron hydroxide vulnerable to ultimate partial or complete debonding. When the alloy is first exposed to "pure" seawater for a prolonged period of time, however, subsequent exposure to sulfide is no longer deleterious. This is apparently due to a layer of copper-nickel salt that slowly forms over the iron hydroxide.

  12. Creep properties of phosphorus alloyed oxygen free copper under multiaxial stress state

    Energy Technology Data Exchange (ETDEWEB)

    Rui Wu; Sandstroem, Rolf; Seitisleam, Facredin

    2009-10-15

    Phosphorus alloyed oxygen free copper (Cu-OFP) canisters are planned to be used for spent nuclear fuel in Sweden. The copper canisters will be subjected to creep under multiaxial stress states in the repository. Creep tests have therefore been carried out at 75 deg C using double notch specimens with notch acuities of 0.5, 2, 5, and 18.8, respectively. The creep lifetime for notched specimens is considerably longer than that for the smooth one at a given net section stress, indicating that the investigated Cu-OFP is notch insensitive (notch strengthening). The notch strengthening factor in time is, for instance, greater than 70 at 180 MPa for the bluntest notch (notch acuity = 0.5). The creep lifetime is notch acuity dependent. The sharper the notch, the longer the creep lifetime is. The creep deformation is to a significant extent concentrated to the region around the notches. Different deformation on the two notches is observed. Both axial and radial strains on the failed notch are several times larger than those on the unbroken one. Linear relation between the axial and the radial strains on the notches is found. Transgranular failure is predominant, independent of stress, rupture time, and notch acuity. Adjacent to fracture, elongated grains along the stress direction, separate pores and cavities are often visible. On the unbroken notch, fewer separate cavities and cracks are only seen intergranularly for the sharper notches (notch acuity > 2). To interpret the tests for the notched creep specimens, finite element computations have been performed. A fundamental model for primary and secondary creep without fitting parameters has been used as constitutive equation. The FEM-modelling could represent the creep strain versus time curves for the notched specimens in a satisfactory way. In these curves the strain on loading is included. From the FEM-computations a stationary creep stress could be assessed, which is close to the reference stress. For a given

  13. SU-E-T-10: A Dosimetric Comparison of Copper to Lead-Alloy Apertures for Electron Beam Therapy

    Energy Technology Data Exchange (ETDEWEB)

    Rusk, B; Hogstrom, K; Gibbons, J; Carver, R [Mary Bird Perkins Cancer Center, Baton Rouge, LA (United States)

    2014-06-01

    Purpose: To evaluate dosimetric differences of copper compared to conventional lead-alloy apertures for electron beam therapy. Methods: Copper apertures were manufactured by .decimal, Inc. and matching lead-alloy, Cerrobend, apertures were constructed for 32 square field sizes (2×2 – 20×20 cm{sup 2}) for five applicator sizes (6×6–25×25 cm{sup 2}). Percent depth-dose and off-axis-dose profiles were measured using an electron diode in water with copper and Cerrobend apertures for a subset of aperture sizes (6×6, 10×10, 25×25 cm{sup 2}) and energies (6, 12, 20 MeV). Dose outputs were measured for all field size-aperture combinations and available energies (6–20 MeV). Measurements were taken at 100 and 110 cm SSDs. Using this data, 2D planar absolute dose distributions were constructed and compared. Passing criteria were ±2% of maximum dose or 1-mm distance-to-agreement for 99% of points. Results: A gamma analysis of the beam dosimetry showed 93 of 96 aperture size, applicator, energy, and SSD combinations passed the 2%/1mm criteria. Failures were found for small field size-large applicator combinations at 20 MeV and 100-cm SSD. Copper apertures showed a decrease in bremsstrahlung production due to copper's lower atomic number compared to Cerrobend (greatest difference was 2.5% at 20 MeV). This effect was most prominent at the highest energies with large amounts of shielding material present (small field size-large applicator). Also, an increase in electrons scattered from the collimator edge of copper compared to Cerrobend resulted in an increased dose at the field edge for copper at shallow depths (greatest increase was 1% at 20 MeV). Conclusion: Apertures for field sizes ≥6×6 cm{sup 2} at any energy, or for small fields (≤4×4 cm{sup 2}) at energies <20 MeV, showed dosimetric differences less than 2%/1mm for more than 99% of points. All field size-applicator size-energy combinations passed 3%/1mm criteria for 100% of points. Work partially

  14. Texture and mechanical properties of tape substrates from binary and ternary copper alloys for second-generation high-temperature superconductors

    Science.gov (United States)

    Khlebnikova, Yu. V.; Rodionov, D. P.; Gervas'eva, I. V.; Suaridze, T. R.; Egorova, L. Yu.; Akshentsev, Yu. N.; Kazantsev, V. A.

    2015-01-01

    The process of texture formation in tapes made of a number of binary and ternary copper alloys upon cold rolling to degrees of deformation of 98.6-99% and subsequent recrystallization annealing has been studied. The possibility of designing multicomponent alloys based on the binary Cu-30% Ni alloy additionally alloyed with elements that strengthen the fcc matrix, such as iron or chromium, has been shown. The opportunity of obtaining a perfect cube texture in a thin tape made of binary and ternary copper alloys opens prospects for their use as substrates in the technology of second-generation HTSC cables. Optimum regimes of annealing have been determined, which make it possible to obtain in the Cu- M and Cu-(30-40)Ni- M ( M = Fe, Cr, Mn) alloys a perfect biaxial texture with the fraction of cube grains {001} on the surface of the tape more than 94%. The estimation of the mechanical properties of the textured tapes of the investigated alloys demonstrates a yield strength that is 2.5-4.5 times greater than that in the textured tape of pure copper.

  15. Roseomonas pecuniae sp. nov., isolated from the surface of a copper-alloy coin.

    Science.gov (United States)

    Lopes, André; Esp Rito Santo, Christophe; Grass, Gregor; Chung, Ana Paula; Morais, Paula V

    2011-03-01

    Strain N75(T) was isolated from the surface of a copper-alloy 50 Euro cent coin collected from general circulation. Phylogenetic analysis of the 16S rRNA gene sequence revealed that strain N75(T) formed a distinct branch within the genus Roseomonas and placed it in the Alphaproteobacteria. Strain N75(T) showed 16S rRNA gene sequence similarities of 92.4-97.1  % to type strains of species of the genus Roseomonas. Strain N75(T) was a Gram-negative, non-spore-forming, non-motile coccoid, with an optimum growth temperature of about 30 °C; the strain did not grow at 5 or 37 °C. Strain N75(T) did not grow in medium containing NaCl. The major respiratory quinone was ubiquinone 10 (Q-10). The major fatty acids were unsaturated C₁₆:₁ω7c/C₁₆:₁ω6c and C₁₈:₁ω7c (around 70 % of the total fatty acids); the third most abundant fatty acid was the hydroxylated C₁₈:₁ 2-OH. The major polar lipids were phosphatidylcholine, phosphatidylethanolamine and an unknown aminolipid. The DNA G+C content was 72.8 mol%. On the basis of the phylogenetic analysis and physiological and biochemical characteristics, we conclude that strain N75(T) represents a novel species of the genus Roseomonas, for which we propose the name Roseomonas pecuniae sp. nov. (type strain N75(T) =LMG 25481(T) =CIP 110074(T)).

  16. Surface free energy of copper-zinc alloy for energy-saving of boiler

    Institute of Scientific and Technical Information of China (English)

    WANG Man; LIANG Jinsheng; TANG Qingguo; MING Xing; MENG Junping; DING Yan

    2006-01-01

    Cu-Zn, Cu-Zn-Sn, Cu-Zn-Ni alloys were melted by vacuum smelter. The effect factors to the surface free energy of the alloys such as chemical composition, crystal structure and surface crystal lattice distortion etc. were investigated by OCA30 automatic contact angle test instrument, metallography microscope and XRD instrument etc. Results suggests: adding alloy element to Cu may increase its surface free energy, and the more kinds of alloy elements are added, the more surface free energy increases; the alloy element Sn an increase the surface free energy of Cu-Zn alloy; Cu-Zn alloy with fir-tree crystal structure, great phase discrepancy and obvious composition aliquation has greater surface free energy; Cu-Zn alloy with compounds and serious surface crystal lattice distortion has greater surface free energy.

  17. Superthermostability of nanoscale TIC-reinforced copper alloys manufactured by a two-step ball-milling process

    Science.gov (United States)

    Wang, Fenglin; Li, Yunping; Xu, Xiandong; Koizumi, Yuichiro; Yamanaka, Kenta; Bian, Huakang; Chiba, Akihiko

    2015-12-01

    A Cu-TiC alloy, with nanoscale TiC particles highly dispersed in the submicron-grained Cu matrix, was manufactured by a self-developed two-step ball-milling process on Cu, Ti and C powders. The thermostability of the composite was evaluated by high-temperature isothermal annealing treatments, with temperatures ranging from 727 to 1273 K. The semicoherent nanoscale TiC particles with Cu matrix, mainly located along the grain boundaries, were found to exhibit the promising trait of blocking grain boundary migrations, which leads to a super-stabilized microstructures up to approximately the melting point of copper (1223 K). Furthermore, the Cu-TiC alloys after annealing at 1323 K showed a slight decrease in Vickers hardness as well as the duplex microstructure due to selective grain growth, which were discussed in terms of hardness contributions from various mechanisms.

  18. Heat-Affected Zone Liquation Cracking Resistance of Friction Stir Processed Aluminum-Copper Alloy AA 2219

    Science.gov (United States)

    Karthik, G. M.; Janaki Ram, G. D.; Kottada, Ravi Sankar

    2016-12-01

    In the current work, the effect of friction stir processing on heat-affected zone (HAZ) liquation cracking resistance of aluminum-copper alloy AA 2219 was evaluated. In Gleeble hot-ductility tests and longitudinal Varestraint tests, the FSPed material, despite its very fine dynamically recrystallized equiaxed grain structure, showed considerably higher susceptibility to HAZ liquation cracking when compared to the base material. Detailed microstructural studies showed that the increased cracking susceptibility of the FSPed material is due to (i) increase in the amount of liquating θ phase (equilibrium Al2Cu) and (ii) increase in the population of grain boundary θ particles. An important learning from the current work is that, in certain materials like alloy 2219, the use of FSP as a pretreatment to fusion welding can be counterproductive.

  19. Heat-Affected Zone Liquation Cracking Resistance of Friction Stir Processed Aluminum-Copper Alloy AA 2219

    Science.gov (United States)

    Karthik, G. M.; Janaki Ram, G. D.; Kottada, Ravi Sankar

    2017-04-01

    In the current work, the effect of friction stir processing on heat-affected zone (HAZ) liquation cracking resistance of aluminum-copper alloy AA 2219 was evaluated. In Gleeble hot-ductility tests and longitudinal Varestraint tests, the FSPed material, despite its very fine dynamically recrystallized equiaxed grain structure, showed considerably higher susceptibility to HAZ liquation cracking when compared to the base material. Detailed microstructural studies showed that the increased cracking susceptibility of the FSPed material is due to (i) increase in the amount of liquating θ phase (equilibrium Al2Cu) and (ii) increase in the population of grain boundary θ particles. An important learning from the current work is that, in certain materials like alloy 2219, the use of FSP as a pretreatment to fusion welding can be counterproductive.

  20. Initiation and propagation of cleared channels in neutron-irradiated pure copper and a precipitation hardened CuCrZr alloy

    DEFF Research Database (Denmark)

    Singh, B.N; Edwards, D.J.; Bilde-Sørensen, Jørgen

    2004-01-01

    has emerged. Recently we have studied the problem of initiation and propagation of cleared channels during post-irradiation tensile tests of pure copper and a copper alloy irradiated with fission neutrons.Tensile specimens of pure copper and a precipitation hardened copper alloy (CuCrZr) were neutron...... irradiated at 323 and 373K to displacement doses in the range of 0.01 to 0.3 dpa (displacement per atom) and tensile tested at the irradiation temperature.The stress-strain curves clearly indicated the occurrence of a yield drop. The post-deformation microstructural examinations revealed that the channels...... throughout the whole tensile test, no clear evidencehas been found for the operation of Frank-Read sources in the volume between the channels. Channels have been observed to penetrate through annealing twins, in some cases stopping at the opposite twin boundary and in other cases penetrating even throughthe...

  1. Study of Acidithiobacillus ferrooxidans and enzymatic bio-Fenton process-mediated corrosion of copper-nickel alloy.

    Science.gov (United States)

    Jadhav, U; Hocheng, H

    2016-10-01

    This study presents the corrosion behavior of the copper-nickel (Cu-Ni) alloy in the presence of Acidithiobacillus ferrooxidans (A. ferrooxidans) and glucose oxidase (GOx) enzyme. In both the cases ferric ions played an important role in weight loss and thereby to carry out the corrosion of the Cu-Ni alloy. A corrosion rate of 0.6 (±0.008), 2.11 (±0.05), 3.69 (±0.26), 0.7 (±0.006) and 0.08 (±0.002) mm/year was obtained in 72 h using 9K medium with ferrous sulfate, A. ferrooxidans culture supernatant, A. ferrooxidans cells, GOx enzyme and hydrogen peroxide (H2O2) solution respectively. The scanning electron microscopy (SEM) micrographs showed that a variable extent of corrosion was caused by 9K medium with ferrous sulfate, GOx and A. ferrooxidans cells. An arithmetic average surface roughness (Ra) of 174.78 nm was observed for the control work-piece using optical profilometer. The change in Ra was observed with the treatment of the Cu-Ni alloy using various systems. The Ra for 9K medium with ferrous sulfate, GOx and A. ferrooxidans cells was 374.54, 607.32 and 799.48 nm, respectively, after 24 h. These results suggest that A. ferrooxidans cells were responsible for more corrosion of the Cu-Ni alloy than other systems used.

  2. Investigation of the influence of grain boundary chemistry, test temperatures, and strain rate on the fracture behavior of ITER copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Leedy, K.; Stubbins, J.F.; Krus, D. [and others

    1997-08-01

    In an effort to understand the mechanical behavior at elevated temperatures (>200{degrees}C) of the various copper alloys being considered for use in the ITER first wall, divertor, and limiter, a collaborative study has been initiated by the University of Illinois and PNNL with two industrial producers of copper alloys, Brush Wellman and OMG Americas. Details of the experimental matrix and test plans have been finalized and the appropriate specimens have already been fabricated and delivered to the University of Illinois and PNNL for testing and analysis. The experimental matrix and testing details are described in this report.

  3. Effect of copper ions implantation on the corrosion behavior of ZIRLO alloy in 1 mol/L H2SO4

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    In order to study the effect of copper ion implantation on the aqueous corrosion behavior of ZIRLO alloy, specimens were implanted with copper ions with fluences ranging from l×l016 to 1×1017 ions/cm2, using a metal vapor vacuum arc source (MEVVA) at an extraction voltage of 40 kV.The valence states and depth distributions of elements in the surface layer of the samples were analyzed by X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES), respectively.Glancing angle X-ray diffraction(GAXRD) was employed to examine the phase transformation due to the copper ion implantation.The potentiodynamic polarization technique was used to evaluate the aqueous corrosion resistance of implanted ZIRLO alloy in a l mol/L H2SO4 solution.It was found that a significant improvement was achieved in the aqueous corrosion resistance of ZIRLO alloy implanted with copper ions when the fluence is 5×1016 ions/cm2.When the fluence is l×l016 or l×l017 ions/cm2, the corrosion resistance of implanted samples was bad..Finally, the mechanism of the corrosion behavior of copper-implanted ZIRLO alloy was discussed.

  4. Experimental Investigations on Pulsed Nd:YAG Laser Welding of C17300 Copper-Beryllium and 49Ni-Fe Soft Magnetic Alloys

    Science.gov (United States)

    Mousavi, S. A. A. Akbari; Ebrahimzadeh, H.

    2011-01-01

    Copper-beryllium and soft magnetic alloys must be joined in electrical and electro-mechanical applications. There is a high difference in melting temperatures of these alloys which cause to make the joining process very difficult. In addition, copper-beryllium alloys are of age hardenable alloys and precipitations can brittle the weld. 49Ni-Fe alloy is very hot crack sensitive. Moreover, these alloys have different heat transfer coefficients and reflection of laser beam in laser welding process. Therefore, the control of welding parameters on the formation of adequate weld puddle composition is very difficult. Laser welding is an advanced technique for joining of dissimilar materials since it can precisely control and adjust the welding parameters. In this study, a 100W Nd:YAG pulsed laser machine was used for joining 49Ni-Fe soft magnetic to C17300 copper-beryllium alloys. Welding of samples was carried out autogenously by changing the pulse duration, diameter of beam, welding speed, voltage and frequency. The spacing between samples was set to almost zero. The ample were butt welded. It was required to apply high voltage in this study due to high reflection coefficient of copper alloys. Metallography, SEM analysis, XRD and microhardness measurement was used for survey of results. The results show that the weld strength depends upon the chemical composition of the joints. To change the wells composition and heat input of the welds, it was attempted to deviate the laser focus away from the weld centerline. The best strength was achieved by deviation of the laser beam away about 0.1mm from the weld centerline. The result shows no intermetallic compounds if the laser beam is deviated away from the joint.

  5. Reconciling viability and cost-effective shape memory alloy options – A review of copper and iron based shape memory metallic systems

    Directory of Open Access Journals (Sweden)

    Kenneth Kanayo Alaneme

    2016-09-01

    Full Text Available Shape memory alloys (SMAs are group of alloys that display anthropomorphic characteristics. These alloys recover their pre-deformed morphology when heated above their transition temperatures after being deformed in their lower temperature phase (martensitic phase. This unique material behavior is explored in industrial and technological applications where capacity for strain recovery is a key design parameter. Copper and iron based SMAs are largely viewed as potential cost effective substitute to Ni–Ti SMAs judging from their promising shape memory properties, damping capacity and other functional properties. Despite their outstanding potentials, the susceptibility of copper based SMAS to phase stabilization, transition hysteresis, aging and brittleness creates doubt on the possibility of transiting from the realm of potential to functional long term use in engineering applications. On the other hand the low percentage shape recovery in the Fe based SMAs also creates a gap between the theory and potential use of these alloys. This paper takes a critical look at the science of shape memory phenomena as applicable to copper and iron based SMA systems. It also covers the limitations of these systems, the effect of processing parameters on these alloys, proposed solutions to limitations associated with this group of shape memory alloys and thoughts for future consideration.

  6. Experimental investigation of Ti–6Al–4V titanium alloy and 304L stainless steel friction welded with copper interlayer

    Directory of Open Access Journals (Sweden)

    R. Kumar

    2015-03-01

    Full Text Available The basic principle of friction welding is intermetallic bonding at the stage of super plasticity attained with self-generating heat due to friction and finishing at upset pressure. Now the dissimilar metal joints are especially popular in defense, aerospace, automobile, bio-medical, refinery and nuclear engineerings. In friction welding, some special alloys with dual phase are not joined successfully due to poor bonding strength. The alloy surfaces after bonding also have metallurgical changes in the line of interfacing. The reported research work in this area is scanty. Although the sound weld zone of direct bonding between Ti–6Al–4V and SS304L was obtained though many trials, the joint was not successful. In this paper, the friction welding characteristics between Ti–6Al–4V and SS304L into which pure oxygen free copper (OFC was introduced as interlayer were investigated. Box–Behnken design was used to minimize the number of experiments to be performed. The weld joint was analyzed for its mechanical strength. The highest tensile strength between Ti–6Al–4V and SS304L between which pure copper was used as insert metal was acquired. Micro-structural analysis and elemental analysis were carried out by EDS, and the formation of intermetallic compound at the interface was identified by XRD analysis.

  7. Online determination of copper in aluminum alloy by microchip solvent extraction using isotope dilution ICP-MS method.

    Science.gov (United States)

    Kagawa, Tsuyoshi; Ohno, Masashi; Seki, Tatsuya; Chikama, Katsumi

    2009-09-15

    Isotope dilution mass spectroscopy (IDMS)/ICP-MS combined with microchip solvent extraction was successfully applied for the online determination of copper in an aluminum alloy. The microchip solvent extraction was developed for the separation of Cu from major element, and optimal pH range was wider than that of the batchwise extraction method. The dimensions of the microchip were 30 mm x 70 mm and that of micro-channel on the microchip was 180 microm wide and 40 microm deep. The copper complex with 8-hydroxyquinoline was extracted into o-xylene at pH 5.5 and back extracted with 0.1 mol l(-1) nitric acid at flow rate of 20 microl min(-1). The total extraction efficiency (water/organic solvent/nitric acid) was around 40%. IDMS/ICP-MS was coupled with solvent extraction for precise determination of Cu. The extraction and back-extraction on the microchip took about 1s and the total measurement time for the IDMS/ICP-MS was about 40s/sample. The blank value of this method was 0.1 ng g(-1). The proposed method was used for the determination of Cu in Al standard materials (JSAC 0121-C, The Japan Society for Analytical Chemistry and 7074 Al alloy, Nippon Light Metal Co. Ltd.). The obtained analytical results are in good agreement with the certified values.

  8. Pentacle gold-copper alloy nanocrystals: a new system for entering male germ cells in vitro and in vivo

    Science.gov (United States)

    Lin, Yu; He, Rong; Sun, Liping; Yang, Yushan; Li, Wenqing; Sun, Fei

    2016-12-01

    Gold-based nanocrystals have attracted considerable attention for drug delivery and biological applications due to their distinct shapes. However, overcoming biological barriers is a hard and inevitable problem, which restricts medical applications of nanomaterials in vivo. Seeking for an efficient transportation to penetrate biological barriers is a common need. There are three barriers: blood-testis barrier, blood-placenta barrier, and blood-brain barrier. Here, we pay close attention to the blood-testis barrier. We found that the pentacle gold-copper alloy nanocrystals not only could enter GC-2 cells in vitro in a short time, but also could overcome the blood-testis barrier and enter male germ cells in vivo. Furthermore, we demonstrated that the entrance efficiency would become much higher in the development stages. The results also suggested that the pentacle gold-copper alloy nanocrystals could easier enter to germ cells in the pathological condition. This system could be a new method for theranostics in the reproductive system.

  9. Experimental investigation of Tie6Ale4V titanium alloy and 304L stainless steel friction welded with copper interlayer

    Institute of Scientific and Technical Information of China (English)

    R. KUMAR; M. BALASUBRAMANIAN

    2015-01-01

    The basic principle of friction welding is intermetallic bonding at the stage of super plasticity attained with self-generating heat due to friction and finishing at upset pressure. Now the dissimilar metal joints are especially popular in defense, aerospace, automobile, bio-medical, refinery and nuclear engineerings. In friction welding, some special alloys with dual phase are not joined successfully due to poor bonding strength. The alloy surfaces after bonding also have metallurgical changes in the line of interfacing. The reported research work in this area is scanty. Although the sound weld zone of direct bonding between Tie6Ale4V and SS304L was obtained though many trials, the joint was not successful. In this paper, the friction welding characteristics between Tie6Ale4V and SS304L into which pure oxygen free copper (OFC) was introduced as interlayer were investigated. BoxeBehnken design was used to minimize the number of experiments to be performed. The weld joint was analyzed for its mechanical strength. The highest tensile strength between Tie6Ale4V and SS304L between which pure copper was used as insert metal was acquired. Micro-structural analysis and elemental analysis were carried out by EDS, and the formation of intermetallic compound at the interface was identified by XRD analysis.

  10. The Colors and Chromatic Charts of Gold -Silver -Copper Carat Alloys%Au-Ag-Cu系开金合金的颜色与色度图

    Institute of Scientific and Technical Information of China (English)

    宁远涛

    2012-01-01

    颜色和色度坐标是珠宝饰品设计与制造的重要因素与参数.Au- Ag-Cu系合金是最重要的颜色开金饰品合金.文章评述了Ag、Cu对Au和Au基合金的光反射率和颜色的影响;介绍了Au- Ag-Cu系合金的色度图、金合金色泽标准及某些标准颜色合金成分;讨论了某些合金化元素对Au- Ag-Cu系合金颜色的影响.通过调整Ag、Cu组元含量比例和添加其它合金化元素,Au-Ag - Cu系开金合金可以获得丰富多彩的颜色,对于设计与控制珠宝饰品的颜色有重要意义.%Au - Ag - Cu system alloys are the most important color jewelry alloys. The colors of Au - Ag - Cu alloys depend on the composition and the content of the alloying components. The influences of Ag and Cu components on the reflectivity and color of gold and gold - based alloys were reviewed. The chromatic charts of gold - silver - copper carat alloys, color standard of carat alloys and the compositions of some standard color gold alloys were introduced. The effects of some other alloying elements on the color of gold alloys were also discussed. Au - Ag - Cu carat alloys can develop rich and varied colors through regulating the ratio of the contents of Ag and Cu in alloys and adding other alloying elements, which is the basis for designing and controlling colors of carat alloys based on gold.

  11. The Influence of Copper Condensates Alloying with Co, Mo, Ta Transition Metals on the Structure and the Hall-Petch Dependence

    Directory of Open Access Journals (Sweden)

    M.A. Glushchenko

    2016-10-01

    Full Text Available The structure and mechanical properties of two-component copper based Cu-Co, Cu-Mo, Cu-Ta is investigated. It is shown that cobalt, molybdenum and tantalum disperse the grain structure of the copper matrix to submicron and nanometer dimension, form a supersaturated solid solution in the copper fcc lattice and heterophase structure. Reducing of the grain size of condensates is explained by the formation of adsorption layers of atoms of alloying elements on the surface of the copper matrix metal growing grains. The Hall-Petch dependences for the the yield strength are built. The dependences for Cu-Mo and Cu-Ta condensates have greater slope than a similar function for the single component copper. The observed effect is explained by the influence of monolayer grain boundary segregation of molybdenum and tantalum atoms and multilayer segregation of Co atoms.

  12. Extremely low-outgassing material: 0.2% beryllium copper alloy

    Science.gov (United States)

    Watanabe, Fumio

    2004-01-01

    Exploration for low-outgassing materials for use in ultrahigh vacuum and extreme high-vacuum systems is one of the most important topics of a vacuum researcher. We have found that a copper alloy containing 0.2% beryllium (0.2% BeCu) can attain an extremely low hydrogen outgassing rate of 10-14 Pa (H2) m/s order. Almost the entire surface of 0.2% BeCu is dominated by a BeO layer, after a 400 °C×72 h prebakeout treatment in an ultrahigh vacuum. This layer functions as a barrier to the processes of oxidization and permeation of hydrogen. In addition, this layer resists carbon contamination. Temperature-programmed desorption spectra show only a single peak for water at 150 °C and small quantities of any other desorption gases. Therefore, an in situ bakeout process in which the temperature simply ramps up to 150 °C and immediately ramps back down is enough for degassing; it does not require an ordinary sustained-temperature bakeout. Using an outgassing sample consisting of 0.2% BeCu disks housed in a 0.2% BeCu nipple chamber, a lowest outgassing rate of the 5.6×10-14 Pa (H2) m/s was measured by the pressure-rise method after pump cutoff. The pressure-rise versus time curve was completely nonlinear. It rises over time to a constant slope of 1/2 in a log-log plot, due to hydrogen diffusion from the bulk, but this requires over a week at room temperature. The hydrogen outgassing from the 0.2% BeCu bulk is completely dominated by a diffusion-limited mechanism. This article will describe why we obtain such low-outgassing rates with 0.2% BeCu. It is based on the observed surface changes with prebakeout treatment seen by x-ray photoelectron spectroscopy, and the improvement of hydrogen outgassing measurements by the pressure-rise method. A comparison is made to ordinary stainless steel. In addition, the concept of an outgassing reduction method will be discussed from a review of the published ultralow-outgassing data and reduction methods. .

  13. Effect of processing parameters on the electromagnetic radiation emission during plastic deformation and crack propagation in copper-zinc alloys

    Institute of Scientific and Technical Information of China (English)

    KUMAR Rajeev; MISRA Ashok

    2006-01-01

    This paper presents some investigations on the effect of processing parameters on the emission of electromagnetic radiation (EMR) during plastic deformation and crack propagation in copper-zinc alloys. Timing of the EMR emissions, maximum stress during crack instability, stress-intensity factor, elastic strain energy release rate, maximum EMR amplitude, RMS value of EMR amplitude, EMR frequency and electromagnetic energy release rate were analysed for the effect of rolling directions at different percentage of zinc content in Cu-Zn alloy specimens. The same parameters were also analysed for 68-32 Cu-Zn alloy specimens at different annealing temperatures and at different angles θ, to the rolling direction. EMR emissions are observed to be highly anisotropic in nature. At θ=45° to 60°, marked changes in mechanical and electromagnetic parameters were observed.Specimens annealed at 500 °C, just above the recrystallization temperature, and at 700 °C, when grain-size growth is rapid, EMR responses have been found to have well-defined patterns.

  14. Ideal solution behaviour of glassy Cu–Ti, Zr, Hf alloys and properties of amorphous copper

    Energy Technology Data Exchange (ETDEWEB)

    Ristić, R. [Department of Physics, University of Osijek, Trg Ljudevita Gaja 6, HR-3100 Osijek (Croatia); Cooper, J.R. [Department of Physics, Cavendish Laboratory, J.J. Thomson Avenue, CB3 0HE Cambridge (United Kingdom); Zadro, K.; Pajić, D. [Department of Physics, Faculty of Science, Bijenička cesta 32, HR-10002 Zagreb (Croatia); Ivkov, J. [Institute of Physics, Bijenička cesta 46, HR-10002 Zagreb (Croatia); Babić, E. [Department of Physics, Faculty of Science, Bijenička cesta 32, HR-10002 Zagreb (Croatia)

    2015-02-05

    Highlights: • Ideal solution behaviour (ISB) is established in all Cu–Ti, Zr, Hf glassy alloys. • ISB enables reliable estimates for various properties of amorphous Cu. • ISB also impacts glass forming ability in these and probably other similar alloys. - Abstract: A comprehensive study of selected properties of amorphous (a) Cu–TE alloys (TE = Ti, Zr and Hf) has been performed. Data for average atomic volumes of a-Cu–Hf, Ti alloys combined with literature data show that ideal solution behaviour (Vegard’s law) extends over the whole glass forming range (GFR) in all a-Cu–TE alloys. This enables one to obtain an insight into some properties and probable atomic arrangements for both, a-TEs (Ristić et al., 2010) and a-Cu by extrapolation of the data for alloys. Indeed the atomic volumes and other properties studied for all a-Cu–TE alloys extrapolate to the same values for a-Cu. Depending on the property, these values are either close to those of crystalline (c) Cu, or are close to those for liquid (L) Cu. In particular, the electronic transport properties of a-Cu seem close to those of L-Cu, whereas the static properties, such as the density of states, and Young’s modulus, converge to those of c-Cu. The possible impact of these results on our understanding of a-Cu–TE alloys, including glass forming ability, is discussed.

  15. Standard Practice for Use of Mattsson's Solution of pH 7.2 to Evaluate the Stress- Corrosion Cracking Susceptibility of Copper-Zinc Alloys

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2011-01-01

    1.1 This practice covers the preparation and use of Mattsson's solution of pH 7.2 as an accelerated stress-corrosion cracking test environment for brasses (copper-zinc base alloys). The variables (to the extent that these are known at present) that require control are described together with possible means for controlling and standardizing these variables. 1.2 This practice is recommended only for brasses (copper-zinc base alloys). The use of this test environment is not recommended for other copper alloys since the results may be erroneous, providing completely misleading rankings. This is particularly true of alloys containing aluminum or nickel as deliberate alloying additions. 1.3 This practice is intended primarily where the test objective is to determine the relative stress-corrosion cracking susceptibility of different brasses under the same or different stress conditions or to determine the absolute degree of stress corrosion cracking susceptibility, if any, of a particular brass or brass component ...

  16. Production of copper-niobium carbide nanocomposite powders via mechanical alloying

    Energy Technology Data Exchange (ETDEWEB)

    Marques, M.T. [INETI-DMTP, Estrada do Paco do Lumiar, 22, 1649-038 Lisbon (Portugal)]. E-mail: tmarques@ineti.pt; Livramento, V. [INETI-DMTP, Estrada do Paco do Lumiar, 22, 1649-038 Lisbon (Portugal); Correia, J.B. [INETI-DMTP, Estrada do Paco do Lumiar, 22, 1649-038 Lisbon (Portugal); Almeida, A. [IST-Dep. Eng. de Materiais, Av. Rovisco Pais, 1049-001 Lisbon (Portugal); Vilar, R. [IST-Dep. Eng. de Materiais, Av. Rovisco Pais, 1049-001 Lisbon (Portugal)

    2005-06-15

    Nanocrystalline niobium carbide was synthesed in situ in a copper matrix during high-energy milling of elemental powders. Three powder batches were produced with nominal compositions of 5, 10 and 20 vol.% NbC. Characterisation by X-ray diffraction and scanning electron microscopy indicates that early during the milling process a carbide dispersion is formed within a nanostructured copper matrix. After annealing at 873 K, the carbide structure and particle size are maintained, reflecting the ability of the microstructure to resist to coarsening. The hardness levels attained are more than twice those of nanostructured copper.

  17. Preparation and Characterization of Copper/Silver Alloy Nanoparticles%铜/银合金纳米粒子的制备及表征

    Institute of Scientific and Technical Information of China (English)

    张念椿; 胡建强

    2014-01-01

    The preparation method of copper/silver alloy nanoparticles was studied. The small particle size of nano copper was prepared by using the environmentally friendly ascorbic acid as a reducing agent. But this nano copper had poor stability, and is easy to be oxidized. In order to improve its stability, a small amount of Ag+was added during the preparation of nano copper. The silver layer was covered on the nano copper surface by reduction reaction. The copper/silver alloy nanocrystalline possesses good stability and nanoparticles effect. The copper/silver alloy nanoparticles are expected to having potential application in production of printed circuits. The preparation method has shorter product process than the conventional PCB production, thus it can save resources and reduce the environmental pollution.%研究了铜/银合金纳米粒子的制备方法,用抗坏血酸做还原剂,制备了粒径小的纳米铜粉。由于纳米铜粉的稳定性差,易氧化,为了提高其稳定性,在制备的纳米铜粉中加了少量的Ag+,在纳米铜粉表面还原制备出银纳米层覆盖于在铜上。所制备的纳米铜/银合金纳米粒子稳定性好,具有纳米粒子的效应,有望应用于印制电路的制造。该制备方法可以减少传统印制电路板制作方法的工序,节约资源,且减少对环境的污染。

  18. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping; Aportaciones de estano-plata y estano-cobre en la soldadura blanda por capilaridad de canalizaciones de cobre

    Energy Technology Data Exchange (ETDEWEB)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-07-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs.

  19. Effect of alloying with palladium on the electrical and mechanical properties of copper

    Science.gov (United States)

    Volkov, A. Yu.; Novikova, O. S.; Kostina, A. E.; Antonov, B. D.

    2016-09-01

    Structure and physicomechanical properties of Cu-Pd alloys that contain 0.5-5.9 at % Pd have been studied. It has been shown that, in all alloys, a solid solution is formed; the lattice parameter of the fcc lattice and the electrical resistivity of the alloys grow linearly with an increase in the content of palladium. It has also been revealed that the introduction of palladium leads to an increase in the recrystallization temperature and to an increase in the strength properties. The assumption on the formation of an atomic short-range order in the quenched Cu-4.6 at %Pd and Cu-5.9 at %Pd alloys has been made.

  20. Study on Marine Corrosion and Antifouling Behavior of Copper Alloys Exposed to Sea Areas in China

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    The relationship of corrosion resistance and antifouling behavior of 19 Cu alloys exposed to seawater of Qingdao ,Xiamen,Yulin sea areas in China for 1,2,4,8 year intervals was studied .The experiments were carried on by analyzing the composition of corrosion films formed on the surface of alloy specimens during the immersion time and by using OM,SEM,EDXA and AES experiment methods.The results verify the view point that it is the cuprous oxide film which played an important role in antifouling property of Cu alloys in seawater and throw a light on the view point in details further.The influence of different sea areas on the antifouling property of Cu alloys is also discussed.

  1. Enhancement of surface integrity of titanium alloy with copper by means of laser metal deposition process

    CSIR Research Space (South Africa)

    Erinosho, MF

    2016-04-01

    Full Text Available The laser metal deposition process possesses the combination of metallic powder and laser beam respectively. However, these combinations create an adhesive bonding that permanently solidifies the laser-enhanced-deposited powders. Titanium alloys (Ti...

  2. Novel phenol biosensor based on laccase immobilized on reduced graphene oxide supported palladium-copper alloyed nanocages.

    Science.gov (United States)

    Mei, Li-Ping; Feng, Jiu-Ju; Wu, Liang; Zhou, Jia-Ying; Chen, Jian-Rong; Wang, Ai-Jun

    2015-12-15

    Developing new nanomaterials is of key importance to improve the analytical performances of electrochemical biosensors. In this work, palladium-copper alloyed nanocages supported on reduced graphene oxide (RGO-PdCu NCs) were facilely prepared by a simple one-pot solvothermal method. A novel phenol biosensor based on laccase has been constructed for rapid detection of catachol, using RGO-PdCu NCs as electrode material. The as-developed phenol biosensor greatly enhanced the electrochemical signals for catechol. Under the optimal conditions, the biosensor has two linear ranges from 0.005 to 1.155 mM and 1.655 to 5.155 mM for catachol detection at 0.6 V, the sensitivity of 12.65 µA mM(-1) and 5.51 µA mM(-1), respectively. This biosensor showed high selectivity, low detection limit, good reproducibility, and high anti-interference ability.

  3. The stress relaxation in copper alloys for plug connectors and spring elements. Spannungsrelaxation in Kupferlegierungen fuer Steckverbinder und Federelemente

    Energy Technology Data Exchange (ETDEWEB)

    Boegel, A. (Zentrallabor und Entwicklung, Wieland-Werke AG, Ulm (Germany))

    1994-11-01

    The stress relaxation behaviour of seven copper alloys and one steel materials is evaluated. The measurements refer to two different initial stress levels and are carried out from ambient temperature up to 250 C. An extended discussion of accuracy of measurements and of the influence of test conditions as well as initial stress levels is given. The method according to Larson and Miller can be applied to reduce the duration of tests drastically. Criteria for the admissibility of doing so are presented. Data of stress relaxation behaviour are given graphically and numerically for CuZn30, CuSn6, CuSn1CrNiTi, SuNi2Si, CuNi3Si1Mg, CuCrSiTi, CuFe2P and X12CrNi17,7. (orig.)

  4. A tunable amorphous p-type ternary oxide system: The highly mismatched alloy of copper tin oxide

    Energy Technology Data Exchange (ETDEWEB)

    Isherwood, Patrick J. M., E-mail: P.J.M.Isherwood@lboro.ac.uk; Walls, John M. [CREST, School of Electronic, Electrical and Systems Engineering, Loughborough University, Loughborough, Leicestershire LE11 3TU (United Kingdom); Butler, Keith T.; Walsh, Aron [Centre for Sustainable Technologies and Department of Chemistry, University of Bath, Claverton Down, Bath BA2 7AY (United Kingdom)

    2015-09-14

    The approach of combining two mismatched materials to form an amorphous alloy was used to synthesise ternary oxides of CuO and SnO{sub 2}. These materials were analysed across a range of compositions, and the electronic structure was modelled using density functional theory. In contrast to the gradual reduction in optical band gap, the films show a sharp reduction in both transparency and electrical resistivity with copper contents greater than 50%. Simulations indicate that this change is caused by a transition from a dominant Sn 5s to Cu 3d contribution to the upper valence band. A corresponding decrease in energetic disorder results in increased charge percolation pathways: a “compositional mobility edge.” Contributions from Cu(II) sub band-gap states are responsible for the reduction in optical transparency.

  5. Thermal effects in equilibrium surface segregation in a copper/10-atomic-percent-aluminum alloy using Auger electron spectroscopy

    Science.gov (United States)

    Ferrante, J.

    1972-01-01

    Equilibrium surface segregation of aluminum in a copper-10-atomic-percent-aluminum single crystal alloy oriented in the /111/ direction was demonstrated by using Auger electron spectroscopy. This crystal was in the solid solution range of composition. Equilibrium surface segregation was verified by observing that the aluminum surface concentration varied reversibly with temperature in the range 550 to 850 K. These results were curve fitted to an expression for equilibrium grain boundary segregation and gave a retrieval energy of 5780 J/mole (1380 cal/mole) and a maximum frozen-in surface coverage three times the bulk layer concentration. Analyses concerning the relative merits of sputtering calibration and the effects of evaporation are also included.

  6. Joining of SiC Fiber-Bonded Ceramics using Silver, Copper, Nickel, Palladium, and Silicon-Based Alloy Interlayers

    Energy Technology Data Exchange (ETDEWEB)

    Asthana, Rajiv [University of Wisconsin-Stout, Menomonie; Singh, Mrityunjay [NASA-Glenn Research Center, Cleveland; Lin, Hua-Tay [ORNL; Matsunaga, Kenji [Ube Industries, Ltd.; Ishikawa, Toshihiro [Ube Industries, Ltd.

    2013-01-01

    SiC fiber-bonded ceramics, SA-Tyrannohex, (SA-THX) with perpendicular and parallel fiber orientations were brazed using Ag-, Ni- and Pd-base brazes, and four Si X (X: Ti, Cr, Y, Ta) eutectics. Outcomes were variable, ranging from bonded joints through partially bonded to un-bonded joints. Prominent Ti- and Si-rich interfaces developed with Cusil-ABA, Ticusil, and Copper-ABA and Ni- and Si-rich layers with MBF-20. Stress rupture tests at 650 and 750 C on Cusil-ABA-bonded joints revealed a temperature-dependent behavior for the perpendicular joints but not for the parallel joints with failure occurring at brazed interface. Higher-use temperatures can be targeted with eutectic Si Ti and Si Cr alloys.

  7. Progress report on the influence of test temperature and grain boundary chemistry on the fracture behavior of ITER copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Li, M.; Stubbins, J.F. [Univ. of Illinois, Urbana, IL (United States). Dept. of Nuclear Engineering; Edwards, D.J. [Pacific Northwest National Lab., Richland, WA (United States)

    1998-09-01

    This collaborative study was initiated to determine mechanical properties at elevated temperatures of various copper alloys by University of Illinois and Pacific Northwestern National Lab (PNNL) with support of OMG Americas, Inc. and Brush Wellman, Inc. This report includes current experimental results on notch tensile tests and pre-cracked bend bar tests on these materials at room temperature, 200 and 300 C. The elevated temperature tests were performed in vacuum and indicate that a decrease in fracture resistance with increasing temperature, as seen in previous investigations. While the causes for the decreases in fracture resistance are still not clear, the current results indicate that environmental effects are likely less important in the process than formerly assumed.

  8. Comparison study on the annealing behaviors of dispersion strengthened copper alloys with different nanoparticles

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    The hardness measurement, optical microscopy (OM), and transmission electron microscopy (TEM) microstructure observation on the annealing behaviors of Cu-Al2O3 (2.25 vol.% and 0.54 vol.% A12O3) and Cu-0.52vol.%Nb alloys were carried out. The results show that with the increase of annealing temperature, the hardness of Cu-A12O3 alloys decreases slowly. No change of the fiber structure formed by cold rolling in the Cu-2.25vol.%A12O3 alloy is observed even after annealing at 900℃, and the higher dislocation density can still be observed by TEM. Less combination of fiber formed by cold rolling and subgrains are observed in the Cu-0.54vol.%A12O3 alloy annealed at 900℃. With the increase of annealing temperature, the hardness of the Cu-0.52vol.%Nb alloy exhibits a general decreasing trend, and its falling rate is higher than that of the Cu-A12O3 alloys, indicating that its ability of resistance to softening at elevated temperature is weaker than that of the Cu-Al2O3 alloys. However, when annealed at a temperature of 300-400 ℃, probably owing to the precipitation strengthening of niobium, the hardness of the Cu-0.52vol.%Nb alloy arises slightly. The fibers formed by cold rolling become un-clear and un-straight and have less combination, and considerably more subgrains are observed by TEM.

  9. Effect of copper precipitates on the toughness of low alloy steels for pressure boundary components

    Energy Technology Data Exchange (ETDEWEB)

    Foehl, J.; Willer, D.; Katerbau, K.H. [Materialpruefungsanstalt, Univ. Stuttgart (Germany)

    2004-07-01

    The ferritic bainitic steel 15NiCuMoNb5 (WB 36)is widely used for pressure boundary components. Due to the high copper content which leads to precipitation hardening high strength and toughness are characteristic for this type of steel. However, in the initial state, there is still a high amount of dissolved copper in an oversaturated state which makes the steel susceptible to thermal ageing. Ageing and annealing experiments were performed, and the change in microstructure was investigated by small angle neutron scattering (SANS), measurements of the residual electric resistance and hardness measurements. A correlation between micro structural changes and changes in mechanical properties could be established. It could clearly be shown that significant effects on strength and toughness have to be considered when the size of the copper rich precipitates vary in the range from 1.2 to 2.2 nm in radius. The changes in microstructure affect both, the Carpy impact transition temperature and the fracture toughness qualitatively and quantitatively in a similar way. The investigations have contributed to a better understanding of precipitation hardening by copper not only for this type of steel but also for copper containing steels and weld subjected to neutron irradiation. (orig.)

  10. Cooling curve analysis in binary Al-Cu alloys: Part I- Effect of cooling rate and copper content on the eutectic formation

    Directory of Open Access Journals (Sweden)

    M. Dehnavi

    2015-09-01

    Full Text Available There are many techniques available for investigating the solidification of metals and alloys. In recent years computer-aided cooling curve analysis (CA-CCA has been used to determine thermo-physical properties of alloys, latent heat and solid fraction. In this study, the effect of cooling rate and copper addition was taken into consideration in non- equilibrium eutectic transformation of binary Al- Cu melt via cooling curve analysis. For this purpose, melts with different copper weight percent of 2.2, 3.7 and 4.8 were prepared and cooled in controlled rates of 0.04 and 0.42 °C/s. Results show that, latent heat of alloy highly depends upon the post- solidification cooling rate and composition. As copper content of alloy and cooling rate increase, achieved nonequilibrium eutectic phase increases that leads to release of high amount of latent heat and appearing of second deviation in cooling curve. This deviation can be seen in first time derivative curve in the form of a definite peak.

  11. Metallurgical and chemical characterization of copper alloy reference materials within laser ablation inductively coupled plasma mass spectrometry: Method development for minimally-invasive analysis of ancient bronze objects

    Energy Technology Data Exchange (ETDEWEB)

    Walaszek, Damian, E-mail: damian.walaszek@empa.ch [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); University of Warsaw, Faculty of Chemistry, Pasteura 1, 02-093 Warsaw (Poland); Senn, Marianne [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Faller, Markus [Laboratory for Jointing Technology and Corrosion, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland); Philippe, Laetitia [Laboratory for Mechanics of Materials and Nanostructures, Swiss Federal Laboratories for Materials Science and Technology, Feuerwerkstrasse 39, CH-3602 Thun (Switzerland); Wagner, Barbara; Bulska, Ewa [University of Warsaw, Faculty of Chemistry, Pasteura 1, 02-093 Warsaw (Poland); Ulrich, Andrea [Laboratory for Analytical Chemistry, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, CH-8600 Dübendorf (Switzerland)

    2013-01-01

    The chemical composition of ancient metal objects provides important information for manufacturing studies and authenticity verification of ancient copper or bronze artifacts. Non- or minimal-destructive analytical methods are preferred to mitigate visible damage. Laser ablation inductively coupled plasma mass spectrometry (LA-ICPMS) enables the determination of major elements as well as impurities down to lower ppm-levels, however, accuracy and precision of analysis strongly depend on the homogeneity of reference materials used for calibration. Moreover, appropriate analytical procedures are required e.g. in terms of ablation strategies (scan mode, spot size, etc.). This study reviews available copper alloy (certified) reference materials — (C)RMs from different sources and contributes new metallurgical data on homogeneity and spatial elemental distribution. Investigations of the standards were performed by optical and scanning electron microscopy with X-ray spectrometry (SEM-EDX) for the following copper alloy and bronze (certified) reference materials: NIST 454, BAM 374, BAM 211, BAM 227, BAM 374, BAM 378, BAS 50.01-2, BAS 50.03-4, and BAS 50.04-4. Additionally, the influence of inhomogeneities on different ablation and calibration strategies is evaluated to define an optimum analytical strategy in terms of line scan versus single spot ablation, variation of spot size, selection of the most appropriate RMs or minimum number of calibration reference materials. - Highlights: ► New metallographic data for copper alloy reference materials are provided. ► Influence of RMs homogeneity on quality of LA-ICPMS analysis was evaluated. ► Ablation and calibration strategies were critically discussed. ► An LA-ICPMS method is proposed for analyzing most typical ancient copper alloys.

  12. Dislocation Climb Sources Activated by 1 MeV Electron Irradiation of Copper-Nickel Alloys

    DEFF Research Database (Denmark)

    Barlow, P.; Leffers, Torben

    1977-01-01

    Climb sources emitting dislocation loops are observed in Cu-Ni alloys during irradiation with 1 MeV electrons in a high voltage electron microscope. High source densities are found in alloys containing 5, 10 and 20% Ni, but sources are also observed in alloys containing 1 and 2% Ni. The range......, thermodynamically, there is not complete miscibility in the Cu-Ni system as implied by the published phase diagrams. It is furthermore suggested that these precipitates are platelets of Ni atoms on {100} planes, which would account for the formation of the rectangular loops. The binding energy between vacancies...... of irradiation temperatures corresponding to the highest source densities is approximately 350°–500°C. The climb sources are not related to any pre-existing dislocations resolved in the microscope. The sources emit three types of loop: ‘rectangular’ loops with a100 Burgers vector and {100} habit plane, normal...

  13. Development of a dispersion strengthened copper alloy using a MA-HIP method

    Directory of Open Access Journals (Sweden)

    T. Yamada

    2016-12-01

    Full Text Available A new Cu-Al alloy was fabricated by a MA-HIP method for application to the heat sink materials of divertors. With the increase in MA time, the grain size and Vickers hardness decreased and increased, respectively. At MA time of 32hrs, the hardness of the alloy was comparable to that of Glidcop® although the grain size was much larger. X-ray diffractometry, electrical resistivity measurements and STEM-EDS analyses suggested precipitation of Al-rich phase by MA for 32hrs followed by HIP.

  14. Corrosion and microfouling of copper and its alloys in a tropical marine waters of India (Mangalore)

    Digital Repository Service at National Institute of Oceanography (India)

    Sawant, S.S.; Khandeparker, D.C.; Tulaskar, A.; Venkat, K.; Garg, A.

    Rate of corrosion, extent and nature of microfouling of copper, cupronickel 70/30 and cupronickel 90/10 have been studied for three different seasons at a station on the west coast of India. The corrosion rates for all the three materials are higher...

  15. Raising the Reliability of Forming Rolls by Alloying Their Core with Copper

    Science.gov (United States)

    Zhizhkina, N. A.

    2016-11-01

    The mechanical properties and the structure of forming rolls from cast irons of different compositions are studied. A novel iron including a copper additive that lowers its chilling and raises the homogeneity of the structure is suggested for the roll cores. The use of such iron should raise the reliability of the rolls in operation.

  16. Nickel-copper alloy tapes as textured substrates for YBCO coated conductors

    Energy Technology Data Exchange (ETDEWEB)

    Vannozzi, A; Celentano, G; Angrisani, A; Augieri, A; Colantoni, I; Galluzzi, V; Mancini, A; Rufoloni, A [ENEA, Frascati Research Center, Via E. Fermi 45, 00044 Frascati (Rome) (Italy); Ciontea, L; Petrisor, T; Thalmaier, G [Techn. University of Cluj Napoca, Str. C. Daicoviciu 15, 3400 Cluj-Napoca (Romania); Gambardella, U [INFN-LFN, Via E. Fermi 40, 00044 Frascati (Rome) (Italy)], E-mail: vannozzi@frascati.enea.it

    2008-02-15

    NiCuCo alloy tape was studied as textured substrates for YBCO coated conductors application. The addition of a small amount of cobalt was pursued in order to enhance the microstructure of the NiCu alloy. The use of different thermal treatments during the recrystallization process permitted to obtain area densities of cube orientation as high as 95%. The substrate was thoroughly characterized by means of x-ray diffraction, EBSD and SEM analyses. Further, the mechanical properties and the magnetic behaviour of this substrate have been investigated and compared with those exhibited by Ni, NiW and NiCu tapes. The suitability of this alloy substrate for YBCO coated conductors has been tested through the deposition of a conventional CeO{sub 2}/YSZ/CeO{sub 2} buffer layer architecture using a Pd transient layer. Apart from passivating Ni-Cu-Co substrate, the use of a Pd transient layer produces a relevant texture sharpening in the out-of-plane orientation and the full width at half maximum of the {omega}-scan drops from about 9{sup 0} of NiCuCo to 2{sup 0} of Pd layer. This sharp texture is transferred to the YBCO film and the results indicate that NiCuCo alloy is a promising alternative substrate for the realization of YBCO coated conductors.

  17. Machining characteristics and fracture morphologies in a copper-beryllium (Cu-2Be) alloy

    Science.gov (United States)

    Sudhakar, K. V.; Cisneros, J. C.; Cervantes, Hector; Pineda, Cosme Gomez

    2006-02-01

    The technology of materials removal is improved greatly by the introduction of advanced cutting tools like cubic boron nitride, ceramics, polycrystalline diamond and the more recent whisker-reinforced materials. In this paper, the influence of cutting temperature on machinability, mechanical properties, microstructure, and fracture morphology of Cu-2Be alloy using a polycrystalline diamond cutter is investigated. The information on machining, microstructure, and fracture morphology of Cu-2Be alloy are very useful to understand their fabrication characteristics and the basic mechanisms of its deformation and fracture. The machinability (in terms of surface finish) of Cu-2Be alloy is evaluated as a function of cutting temperature, resulting from wet and dry cutting. Machining is carried out on a Hardinge Cobra 42 CNC machine (Hardinge Inc., Elmira, NY), and the machining parameters used—cutting speed, depth of cut, and feed rate—are kept constant during both wet and dry cutting. The machined surface finish on Cu-2Be alloy is measured using a surface finish analyzer (Surftest 401, series 178) technique. The machined specimens are examined for their strength and hardness properties using a standard Universal Testing Machine and Rockwell hardness tester, respectively. Wet cutting (using coolants) produced a smooth surface finish when compared with dry cutting of the Cu-2Be alloy. The machined specimens are examined for their microstructural features using a Nikon optical microscope. The specimens are etched using a suitable etchant solution for revealing such microstructure constituents as grain size, phase proportions, and the possible overheated areas (especially in dry cutting). The fractured surfaces from the tensile and impact toughness tests are investigated for their fracture morphologies (dry and wet cutting) using a microprocessor-controlled scanning electron microscope (Jeol Model JSM 5910 LV). A detailed analysis is also made to understand and interpret

  18. Ab initio study of the structural, magnetic, and electronic properties of copper and silver clusters and their alloys with one palladium atom

    Directory of Open Access Journals (Sweden)

    S. J Hashemifar

    2015-01-01

    Full Text Available In this paper, the structural, magnetic, and electronic properties of two- to nine-atom copper and silver clusters and their alloys with one palladium atom are investigated by using full-potential all-electron density functional computations. After calculating minimized energy of several structural isomers of every nanocluster, it is argued that the small size nanoclusters (up to size of 6, ‎ prefer planar structures, while by increasing size a 2D-3D structural transformation is observed. The structural transformation of pure and copper-palladium clusters occurs in the size of seven and that of silver-palladium cluster in happens at the size of six. The calculated second difference and dissociation energies confirm that the two- and eight- atom pure clusters and three- and seven- atom alloyed clusters are magic clusters. The electronic and magnetic properties of stable isomers are calculated and considered after applying many body based GW correction.

  19. Cavitation Erosion of Copper, Brass, Aluminum and Titanium Alloys in Mineral Oil

    Science.gov (United States)

    Rao, B. C. S.; Buckley, D. H.

    1983-01-01

    The variations of the mean depth of penetration, the mean depth rate of penetration, MDRP, the pit diameter 2a and depth h due to cavitation attack on Al 6061-T6, Cu, brass of composition Cu-35Zn-3Pb and Ti-5A1-2.5Sn are presented. The experiments are conducted in a mineral oil of viscosity 110 CS using a magnetostrictive oscillator of 20 kHz frequency. Based on MDRP on the materials, it is found that Ti-5Al-2.5Sn exhibits cavitation erosion resistance which is two orders of magnitude higher than the other three materials. The values of h/a are the largest for copper and decreased with brass, titanium, and aluminum. Scanning electron microscope studies show that extensive slip and cross slip occurred on the surface prior to pitting and erosion. Twinning is also observed on copper and brass.

  20. Copper Alloy Mold process for Production Irons Casting in Japan%日本铜合金金属型生产铸铁件状况

    Institute of Scientific and Technical Information of China (English)

    刘子安; 齐笑冰; 唐骥; 申泽骥

    2001-01-01

    The technique of permanent mold casting for producing iron castings has been applied in advanced countries, the copper alloy mold processes for producing the iron castings are rapidly developing in Japan. The characteristics of copper alloy Mold process and its effect on the properties of ductile iron and gray iron castings are presented in this paper. The situation of production of iron castings by using copper alloy mold processes in Japan is also presented.%铸铁件金属型铸造技术已在工业发达国家得到应用,铜合金金属型生产铸铁件在日本得到很快发展。本文介绍了铜合金金属型的特点及其对所生产的球墨铸铁件、灰铸铁件性能的影响;比较详细地介绍了日本铜合金金属型生产铸铁件的状况。

  1. Optimize Cutting Parameters of Gundrill used in Drilling Silver Copper Alloy%加工银铜合金枪钻切削参数优化

    Institute of Scientific and Technical Information of China (English)

    胡江林; 焦剑; 张伟

    2012-01-01

    Silver copper alloy has excellent ductility and toughness,the chips are hard to break when drilling. A domestic engine company use gundrill processing silver copper alloy deep holes. In view of the problems of hard to break chips, the paper solves the problems by optimize the cutting parameters, and summarizes the relevance between the cutting parameters and the shape of the chips. It provides reference for choosing the cutting parameters when drilling the silver copper alloy.%铜合金具有优良的延展性和韧性,钻削加工时产生的切屑很难折断,不易排出,对深孔加工来说是典型的难加工材料.国内某发动机有限公司零部件生产线采用枪钻加工银铜合金深孔,针对加工中出现的断屑困难问题,本文通过优化切削参数,解决了刀具加工中断屑排屑困难问题,并总结出切削参数与切屑形状的关系,为银铜合金深孔加工参数选择提供参考.

  2. Anti-corrosion film formed on HAl77-2 copper alloy surface by aliphatic polyamine in 3 wt.% NaCl solution

    Science.gov (United States)

    Yu, Yinzhe; Yang, Dong; Zhang, Daquan; Wang, Yizhen; Gao, Lixin

    2017-01-01

    The corrosion inhibition of a polyamine compound, N-(4-amino-2, 3-dimethylbutyl)-2, 3-dimethylbutane-1, 4-diamine (ADDD), was investigated for HAl77-2 copper alloy in 3 wt.% NaCl solution. Electrochemical measurements, scanning electron microscopy (SEM), atomic force microscope (AFM) and Fourier transform infrared spectroscopy (FT-IR) techniques were employed for this research. The results show that ADDD strongly suppresses the corrosion of HAl77-2 alloy. The inhibition efficiency of ADDD is 98.6% at 0.5 mM, which is better than benzotriazole (BTAH) at the same concentration. Polarization curves indicate that ADDD is an anodic type inhibitor. Surface analysis suggests that a protective film is formed via the interaction of ADDD and copper. FT-IR reveals that the inhibition mechanism of ADDD is dominated by chemisorption onto the copper alloy surface to form an inhibition film. Furthermore, quantum chemical calculation and molecular dynamics (MD) simulations methods show that ADDD adsorbs on HAl77-2 surface via amino group in its molecule.

  3. Microstructure and microanalysis studies of copper-nickel-tin alloys obtained by conventional powder metallurgy processing

    Energy Technology Data Exchange (ETDEWEB)

    Monteiro, Waldemar A.; Carrio, Juan A.G.; Masson, T.J.; Vitor, E.; Abreu, C.D.; Marques, I.M., E-mail: fisica.cch@mackenzie.br [Universidade Presbiteriana Mackenzie (CCH), Sao Paulo, SP (Brazil). Centro de Ciencias e Humanidades; Silva, L.C.E. da, E-mail: jgcarrio@mackenzie.br [Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil)

    2009-07-01

    The aim of this paper was to analyze the microstructural development in samples of Cu-Ni-Sn alloys (weight %) obtained by powder metallurgy (P/M). The powders were mixed for 1/2 hour. After this, they were pressed, in a cold uniaxial pressing (1000 kPa). In the next step the specimens were sintered at temperatures varying from 650 up to 780 deg C under vacuum. Secondly, the samples were homogenized at 500 deg C for several special times. The alloys were characterized by optical microscopy, electrical conductivity and Vickers hardness. X-rays powder diffraction data were collected for the sintered samples in order to a structural and microstructural analysis. The comparative analysis is based on the sintered density, densification parameter, hardness, macrostructures and microstructures of the samples. (author)

  4. Rapid growth of primary dendrite in highly undercooled copper-antimany alloy

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    The droplets of Cu-11wt.%Sb hypoeutectic alloy have been rapidly solidified during containerless processing in a 3 m drop tube. The undercooling and cooling rates are estimated, and both play a dominant role in the dendritic growth of primary Cu phase. Undercoolings up to 200 K (0.16TL, where TL is the liquidus temperature) have been obtained in the experiment. With the increase of undercooling, the microstructural evolution of primary Cu phase proceeds from remelted dendrites to the equiaxed grains. A coarse dendritic grain microstructure can form in the undercooling range of 61~102 K and at cooling rates of 1.35×102~2.66×103 K/s. The segregationless solidification of Cu-11wt.%Sb hypoeutectic alloy occurs when undercooling is more than 176 K. The growth of primary Cu phase is mainly controlled by solute diffusion.

  5. Demonstration of Ultra High-Strength Nanocrystalline Copper Alloys for Military Applications

    Science.gov (United States)

    2012-01-22

    the consolidated samples was determined by using Archimedes principle . Processing diagram 1 shows a general flow process for the steps involved in...impossible in the past possible today, such as the replacement of Cu-Be alloys. However, as indicated by thermodynamic principles , nanocrystalline...properties predicted by the Hall-Petch relationship generated a push to produce finer and finer grain sizes and structures over the past five

  6. Temperature and strain rate effects in high strength high conductivity copper alloys tested in air

    Energy Technology Data Exchange (ETDEWEB)

    Edwards, D.J. [Pacific Northwest National Lab., Richland, WA (United States)

    1998-03-01

    The tensile properties of the three candidate alloys GlidCop{trademark} Al25, CuCrZr, and CuNiBe are known to be sensitive to the testing conditions such as strain rate and test temperature. This study was conducted on GlidCop Al25 (2 conditions) and Hycon 3HP (3 conditions) to ascertain the effect of test temperature and strain rate when tested in open air. The results show that the yield strength and elongation of the GlidCop Al25 alloys exhibit a strain rate dependence that increases with temperature. Both the GlidCop and the Hycon 3 HP exhibited an increase in strength as the strain rate increased, but the GlidCop alloys proved to be the most strain rate sensitive. The GlidCop failed in a ductile manner irrespective of the test conditions, however, their strength and uniform elongation decreased with increasing test temperature and the uniform elongation also decreased dramatically at the lower strain rates. The Hycon 3 HP alloys proved to be extremely sensitive to test temperature, rapidly losing their strength and ductility when the temperature increased above 250 C. As the test temperature increased and the strain rate decreased the fracture mode shifted from a ductile transgranular failure to a ductile intergranular failure with very localized ductility. This latter observation is based on the presence of dimples on the grain facets, indicating that some ductile deformation occurred near the grain boundaries. The material failed without any reduction in area at 450 C and 3.9 {times} 10{sup {minus}4} s{sup {minus}1}, and in several cases failed prematurely.

  7. Stress-Stain State of Pipe Made of Copper-Based Alloy Strengthened with Incoherent Nanoparticles

    Science.gov (United States)

    Matvienko, O. V.; Daneyko, O. I.; Kovalevskaya, T. A.

    2017-08-01

    The approach which combines methods of crystal plasticity and deformable solid mechanics is used to explore the stress-strain state of a heavy-wall pipe made of dispersion-hardened Cu-based alloy and subjected to the uniform internal pressure. The distribution of the deformation and stress along the pipe wall is determined for various pipe geometry. The approximating equations are obtained to determine the yielding area and elastic and plastic strength limits.

  8. Palladium/Copper Alloy Composite Membranes for High Temperature Hydrogen Separation

    Energy Technology Data Exchange (ETDEWEB)

    J. Douglas Way; Paul M. Thoen

    2005-08-31

    This report summarizes progress made during the second year of research funding from DOE Grant DE-FG26-03NT41792 at the Colorado School of Mines. The period of performance was September 1, 2004 through August of 2005. We have reformulated our Pd plating process to minimize the presence of carbon contamination in our membranes. This has improved durability and increased permeability. We have developed techniques for plating the outside diameter of ceramic and metal substrate tubes. This configuration has numerous advantages including a 40% increase in specific surface area, the ability to assay the alloy composition non-destructively, the ability to potentially repair defects in the plated surface, and the ability to visually examine the plated surfaces. These improvements have allowed us to already meet the 2007 DOE Fossil Energy pure H{sub 2} flux target of 100 SCFH/ft{sup 2} for a hydrogen partial pressure difference of 100 psi with several Pd-Cu alloy membranes on ceramic microfilter supports. Our highest pure H{sub 2} flux on inexpensive, porous alumina support tubes at the DOE target conditions is 215 SCFH/ft{sup 2}. Progress toward meeting the other DOE Fossil Energy performance targets is also summarized. Additionally, we have adapted our membrane fabrication procedure to apply Pd and Pd alloy films to commercially available porous stainless steel substrates. Stable performance of Pd-Cu films on stainless steel substrates was demonstrated over a three week period at 400 C. Finally, we have fabricated and tested Pd-Au alloy membranes. These membranes also exceed both the 2007 and 2010 DOE pure H{sub 2} flux targets and exhibit ideal H{sub 2}/N{sub 2} selectivities of over 1000 at partial pressure difference of 100 psi.

  9. Variability in Sican copper alloy artifacts: Its relation to material flow patterns during the Middle Sican Period in Peru, AD 900--1100

    Science.gov (United States)

    Bezur, Aniko

    The Middle Sican culture, centered in the Lambayeque region on the north coast of Peru, began successful, intensive production of arsenical copper starting around AD 900. The excavation and analysis of Middle Sican burials has revealed that artifacts made of copper-arsenic alloys played an important role in mortuary practices and ritual activities. Copper-arsenic alloy artifacts were accessible to a relatively wide cross-section of the population, though in different amounts and forms. So-called grouped artifacts, for example, have primarily been recovered from elite graves and ritual contexts. Such grouped artifacts occurred in hoards and were organized into groups by wrapping with spun yarn, vegetable fibers, and textiles. This dissertation documents the patterning of compositional and morphological variation among three types of grouped copper artifacts and builds connections between the observed patterning and material flow during production and distribution in order to explore relations among producers and consumers. Morphological homogeneity is explored in relation to the methods of manufacture involved in the production of different types of grouped artifacts as well as the number of production units whose output was pooled to form a cache. Compositional standardization is addressed in relation to the mass of an individual object as well as material flow between smelting and smithing stages of the metallurgical chaine operatoire. Hypotheses are anchored in research on the production organization of other Middle Sican crafts as well as literature discussing connections between artifact variability and production organization.

  10. Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance.

    Science.gov (United States)

    Li, Wanli; Hu, Dawei; Li, Lingying; Li, Cai-Fu; Jiu, Jinting; Chen, Chuantong; Ishina, Toshiyuki; Sugahara, Tohru; Suganuma, Katsuaki

    2017-07-26

    Printable and flexible Cu-Ag alloy electrodes with high conductivity and ultrahigh oxidation resistance have been successfully fabricated by using a newly developed Cu-Ag hybrid ink and a simple fabrication process consisting of low-temperature precuring followed by rapid photonic sintering (LTRS). A special Ag nanoparticle shell on a Cu core structure is first created in situ by low-temperature precuring. An instantaneous photonic sintering can induce rapid mutual dissolution between the Cu core and the Ag nanoparticle shell so that core-shell structures consisting of a Cu-rich phase in the core and a Ag-rich phase in the shell (Cu-Ag alloy) can be obtained on flexible substrates. The resulting Cu-Ag alloy electrode has high conductivity (3.4 μΩ·cm) and ultrahigh oxidation resistance even up to 180 °C in an air atmosphere; this approach shows huge potential and is a tempting prospect for the fabrication of highly reliable and cost-effective printed electronic devices.

  11. Evaluation of single liquid primers with organic sulfur compound for bonding between indirect composite material and silver-palladium-copper-gold alloy.

    Science.gov (United States)

    Shimoe, Saiji; Tanoue, Naomi; Satoda, Takahiro; Murayama, Takeshi; Nikawa, Hiroki; Matsumura, Hideo

    2010-01-01

    The purpose of this study was to evaluate the effect of primers on bonding between a silver-palladium-copper-gold alloy and an indirect composite material. Cast disks were air-abraded with alumina, conditioned with one of five primers (Alloy Primer, Luna-Wing Primer, Metal Primer II, Metaltite, M.L. Primer), and bonded with a light-activated indirect composite. Shear bond strengths were determined after 20,000 times of thermocycling. The results showed that four of the primers, except the Luna-Wing Primer, were effective in enhancing the bond strength as compared with the unprimed control group. Of these four primers, Alloy Primer, Metal Primer II, and M.L. Primer exhibited significantly greater bond strengths. It can be concluded that the effectiveness of primers varies considerably according to the organic sulfur compounds added to the solvent, and that care must be taken in selecting priming agents for bonding the composite material and the silver-palladium-copper-gold alloy.

  12. Low Temperature Phase Transformations in Copper-Quenched Ti-44.5Al-8Nb-2.5V Alloy.

    Science.gov (United States)

    Cao, Shouzhen; Xiao, Shulong; Chen, Yuyong; Xu, Lijuan; Wang, Xiaopeng; Han, Jianchao

    2017-02-18

    In this study, an easily controlled transformation similar to the β + α → β + α + γ and the analysis of metastable phases in a β solidifying Ti-44.5Al-8Nb-2.5V alloy were investigated. Therefore, a liquid alloy copper-quenching followed by annealing at an application temperature (850 °C) has been carried out. Following quenching, a microstructure composed of several supersaturated phases-the basket-weave β₀ (βbv) phase, the plate-like α₂ (αp) phase and the stripe-like γ (γs) phase-was obtained. In the annealing processes, phase transformations in the prior βbv and αp phases domain corresponded nicely to the β + α → β + α + γ transformation during solidification. Also, in the annealed γs phase, the kinetics of the phase transformations involving the metastable L1₂ phase was firstly detected by transmission electron microscopy (TEM). The L1₂ phase had a lattice structure similar to the γ phase, whereas the composition of the phase was similar to the α₂ phase. The formation of the γ pre-twin phase with an anti-phase boundary (APB) was detected in the γs phase of the matrix. The orientation relationships between the γs and precipitated: γ (γp) phase are <101]γs//<114]γp, (10 1 ¯ )γs//( 1 ¯ 10)γp and (0 1 ¯ 0)γs//(22 1 ¯ )γp.

  13. High Stability Performance of Superhydrophobic Modified Fluorinated Graphene Films on Copper Alloy Substrates

    Directory of Open Access Journals (Sweden)

    Rafik Abbas

    2017-01-01

    Full Text Available A stable self-cleaning superhydrophobic modified fluorinated graphene surface with micro/nanostructure was successfully fabricated on copper substrates via drop coating process. Irregularly stacked island-like multilayered fluorinated graphene nanoflakes comprised the microstructure. The fabricated films exhibited outstanding superhydrophobic property with a water contact angle 167° and water sliding angle lower than 4°. The developed superhydrophobic surface showed excellent corrosion resistance with insignificant decrease of water contact angle 166° in 3.5 wt.% NaCl solution. This stable highly hydrophobic performance of the fluorinated graphene films could be useful in self-cleaning, antifogging, corrosion resistive coatings and microfluidic devices.

  14. Investigation into the stress corrosion cracking properties of AA2099, an aluminum-lithium-copper alloy

    Science.gov (United States)

    Padgett, Barbara Nicole

    Recently developed Al-Li-Cu alloys show great potential for implementation in the aerospace industry because of the attractive mix of good mechanical properties and low density. AA2099 is an Al-Li-Cu alloy with the following composition Al-2.69wt%Cu-1.8wt%Li-0.6wt%Zn-0.3wt%Mg-0.3wt%Mn-0.08wt%Zr. The environmental assisted cracking and localized corrosion behavior of the AA2099 was investigated in this thesis. The consequences of uncontrolled grain boundary precipitation via friction stir welding on the stress corrosion cracking (SCC) behavior of AA2099 was investigated first. Using constant extension rate testing, intergranular corrosion immersion experiments, and potentiodynamic scans, the heat-affected zone on the trailing edge of the weld (HTS) was determined to be most susceptible of the weld zones. The observed SCC behavior for the HTS was linked to the dissolution of an active phase (Al2CuLi, T1) populating the grain boundary. It should be stated that the SCC properties of AA2099 in the as-received condition were determined to be good. Focus was then given to the electrochemical behavior of precipitate phases that may occupy grain and sub-grain boundaries in AA2099. The grain boundary micro-chemistry and micro-electrochemistry have been alluded to within the literature as having significant influence on the SCC behavior of Al-Li-Cu alloys. Major precipitates found in this alloy system are T1 (Al 2CuLi), T2 (Al7.5Cu4Li), T B (Al6CuLi3), and theta (Al2 Cu). These phases were produced in bulk form so that the electrochemical nature of each phase could be characterized. It was determined T1 was most active electrochemically and theta was least. When present on grain boundaries in the alloy, electrochemical behavior of the individual precipitates aligned with the observed corrosion behavior of the alloy (e.g. TB was accompanied by general pitting corrosion and T 1 was accompanied by intergranular corrosion attack). In addition to the electrochemical behavior of

  15. Palladium/Copper Alloy Composite Membranes for High Temperature Hydrogen Separation

    Energy Technology Data Exchange (ETDEWEB)

    J. Douglas Way; Paul M. Thoen

    2006-08-31

    This report summarizes progress made during the a three year University Coal Research grant (DEFG26-03NT41792) at the Colorado School of Mines. The period of performance was September 1, 2003 through August of 2006. We made excellent progress toward our goal of contributing to the development of high productivity, sulfur tolerant composite metal membranes for hydrogen production and membrane reactors. Composite Pd and Pd alloy metal membranes with thin metal films (1-7 {micro}m) were prepared on porous stainless steel and ceramic supports that meet or exceed the DOE 2010 and 2015 pure hydrogen flux targets at differential pressure of only 20 psi. For example, a 2 {micro}m pure Pd membrane on a Pall AccuSep{reg_sign} substrate achieved an ideal H{sub 2}/N{sub 2} separation factor of over 6000, with a pure hydrogen flux of 210 SCFH/ft{sup 2} at only 20 psig feed pressure. Similar performance was achieved with a Pd{sub 80}Au{sub 20} composite membrane on a similar stainless steel substrate. Extrapolating the pure hydrogen flux of this PdAu membrane to the DOE Fossil Energy target conditions of 150 psia feed pressure and 50 psia permeate pressure gives a value of 508 SCFH/ft{sup 2}, exceeding the 2015 target. At these thicknesses, it is the support cost that will dominate the cost of a large scale module. In a direct comparison of FCC phase PdCu and PdAu alloys on identical supports, we showed that a Pd{sub 85}Au{sub 15} (mass %) alloy membrane is not inhibited by CO, CO{sub 2}, or steam present in a water-gas shift feed mixture at 400 C, has better resistance to sulfur than a Pd{sub 94}Cu{sub 6} membrane, and has over twice the hydrogen permeance.

  16. Characterization of Magnetron Sputtered Copper-Nickel Thin Film and Alloys

    Science.gov (United States)

    2016-09-01

    1000 °C in a low- pressure chemical vapor deposition (LPCVD) reactor with a gas mixture of 40%H2/60%Ar at 15 Torr pressure to form the final alloys...uniformity of the film improves if the chamber pressure is decreased and/or the distance between target and substrate is increased, we decided to...of 500 W d.c. to improve the deposition rate in order to achieve a film thickness of 1 µm within a reasonable amount of time. Substrate rotation

  17. Gold-copper nano-alloy, "Tumbaga", in the era of nano: phase diagram and segregation.

    Science.gov (United States)

    Guisbiers, Grégory; Mejia-Rosales, Sergio; Khanal, Subarna; Ruiz-Zepeda, Francisco; Whetten, Robert L; José-Yacaman, Miguel

    2014-11-12

    Gold-copper (Au-Cu) phases were employed already by pre-Columbian civilizations, essentially in decorative arts, whereas nowadays, they emerge in nanotechnology as an important catalyst. The knowledge of the phase diagram is critical to understanding the performance of a material. However, experimental determination of nanophase diagrams is rare because calorimetry remains quite challenging at the nanoscale; theoretical investigations, therefore, are welcomed. Using nanothermodynamics, this paper presents the phase diagrams of various polyhedral nanoparticles (tetrahedron, cube, octahedron, decahedron, dodecahedron, rhombic dodecahedron, truncated octahedron, cuboctahedron, and icosahedron) at sizes 4 and 10 nm. One finds, for all the shapes investigated, that the congruent melting point of these nanoparticles is shifted with respect to both size and composition (copper enrichment). Segregation reveals a gold enrichment at the surface, leading to a kind of core-shell structure, reminiscent of the historical artifacts. Finally, the most stable structures were determined to be the dodecahedron, truncated octahedron, and icosahedron with a Cu-rich core/Au-rich surface. The results of the thermodynamic approach are compared and supported by molecular-dynamics simulations and by electron-microscopy (EDX) observations.

  18. Element segregation behavior of aluminum-copper alloy ZL205A

    Institute of Scientific and Technical Information of China (English)

    Fan Li; Hao Qitang; Xian Fuchao

    2014-01-01

    In aluminum-copper al oy, the segregation has a severe bad effect on the al oying degree, strength and corrosion resistance. A deeper understanding of element segregation behavior wil have a great significance on the prevention of segregation. In the study, the element segregation behavior of ZL205A aluminum-copper al oy was investigated by examining isothermal y solidified samples using scanning electron microscopy and energy dispersive spectroscopy. The calculated results of segregation coefficients show that Cu and Mn are negative segregation elements; while Ti, V and Zr are positive segregation elements. The sequence of element segregation degree from the greatest to the least in ZL205A al oy is Cu, Mn, V, Ti, Zr and Al. The density of residual liquid is expected to increase with a decrease in the quenching temperature ranging from 630 ºC to 550 ºC. The calculated results confirm that the quenching temperature has an insignificant effect on the liquid density;and the variation of density is mainly due to element segregation. Consequently, segregations of Al, Cu and Mn lead to an increase in density, but Ti, V and Zr present the opposite effect. The contribution of each element to the variation of the liquid density was analyzed. The sequence of contributions of al oying elements to the variation of total liquid density is Cu﹥Al﹥Mn﹥V﹥Ti﹥Zr.

  19. Microstructure and mechanical properties of similar and dissimilar joints of aluminium alloy and pure copper by friction stir welding

    Directory of Open Access Journals (Sweden)

    V.C. Sinha

    2016-09-01

    Full Text Available In the present study, the microstructure and mechanical properties of similar and dissimilar friction stir welded joints of aluminium alloy (AlA and pure copper (Cu were evaluated at variable tool rotational speeds from 150 to 900 rpm in steps of 150 rpm at 60 mm/min travel speed and constant tilt angle 2°. The interfacial microstructures of the joints were characterised by optical and scanning electron microscopy. The Al4Cu9, AlCu, Al2Cu and Al2Cu3 intermetallic compounds have been observed at the interface and stir zone region of dissimilar Al/Cu FSWed joints. Variation in the grain size was observed in the stir zone depending upon the heat input value. Axial force, traverse force and torque value were analysed with variation in tool rotational speed. Residual stresses were measured at the stir zone by X-ray diffraction technique. Maximum ultimate tensile strength of ∼75% of AlA strength for AlA–AlA joints has been obtained at 750 rpm and for Cu–Cu joint tensile strength of ∼100% of tensile strength of Cu was obtained at 300 rpm. However, for Cu–AlA joint when processed at 600 rpm tool rotational speed achieved maximum ultimate tensile strength of ∼77% of AlA.

  20. Modelling of nodular particle growth in a liquid-solid film during condensation experiments of copper-silver alloys

    Energy Technology Data Exchange (ETDEWEB)

    Leroux, S.; Ny, J. le; Gueneau, C.; Goldstein, S. [DCC/DPE/SPCP/LEPCA, Commissariat a l' Energie Atomique Saclay, Gif-sur-Yvette (France); Camel, D. [DTA/CEREM/DEM/SPCM, Commissariat a l' Energie Atomique, Centre d' Etudes Nucleaires de Grenoble, Grenoble (France)

    2001-07-01

    Silver-copper alloys are condensed in a liquid-solid domain of the phase diagram on a tilted molybdenum substrate regulated in temperature. After a droplets regime, a film which contains a monolayer of nodular solid crystals forms. The size distribution and density of the particles in the film are measured after different condensation times. Results show that in our experimental conditions a ripening process occurs which is evidenced by a decrease of the number of particles with time, and a broad particle size distribution. However, the decrease rate is smaller than expected without a condensation flux. A model is then developed to interpret and generalize these results. This model results from the modification of the Lifshitz-Slyosov model to take into account the supply from the vapour phase. It is shown that the higher the flux of material to solidify from the vapour phase is, the more the growth from the vapour phase overcomes the ripening process. Once the particle density reaches a characteristic value which is simply proportional to the incoming flux, no more particles are dissolved. The system then tends towards a monomodal distribution with a radius which grows in t{sup 1/3}. (orig.)

  1. Grain size stabilization of nanocrystalline copper at high temperatures by alloying with tantalum

    Energy Technology Data Exchange (ETDEWEB)

    Darling, K.A., E-mail: kristopher.darling.civ@mail.mil [U.S. Army Research Laboratory, Weapons and Materials Research Directorate, Aberdeen Proving Ground, MD 21005-5069 (United States); Roberts, A.J. [ORISE Program, U.S. Army Research Laboratory, Aberdeen Proving Ground, MD 21005-5069 (United States); Mishin, Y. [George Mason University, Dept of Physics and Astronomy, Fairfax, VA 22030 (United States); Mathaudhu, S.N. [U.S. Army Research Laboratory, Army Research Office, Research Triangle Park, NC 27709-2211 (United States); Kecskes, L.J. [U.S. Army Research Laboratory, Weapons and Materials Research Directorate, Aberdeen Proving Ground, MD 21005-5069 (United States)

    2013-10-05

    Highlights: •A mean grain size of 167 nm is retained after annealing at 97% of the melting point. •Hardness surpasses conventional pure nanocrystalline Cu by 2.5 GPa. •Extreme stability is attributed to both thermodynamic and kinetic stabilization. -- Abstract: Nanocrystalline Cu–Ta alloys belong to an emerging class of immiscible materials with potential for high-temperature applications. Differential scanning calorimetry (DSC), Vickers microhardness, transmission and scanning electron microscopy (TEM/SEM), and atomistic simulations have been applied to study the structural evolution in high-energy cryogenically alloyed nanocrystalline Cu–10 at.%Ta. The thermally induced coarsening of the as-milled microstructure was investigated and it was found that the onset of grain growth occurs at temperatures higher than that for pure nanocrystalline Cu. The total heat release associated with grain growth was 0.553 kJ/mol. Interestingly, nanocrystalline Cu–10 at.%Ta maintains a mean grain size (GS) of 167 nm after annealing at 97% of its melting point. The increased microstructural stability is attributed to a combination of thermodynamic and kinetic stabilization effects which, in turn, appear to be controlled by segregation and diffusion of Ta solute atoms along grain boundaries (GBs). The as-milled nanocrystalline Cu–10 at.%Ta exhibits Vickers microhardness values near 5 GPa surpassing the microhardness of conventional pure nanocrystalline Cu by ∼2.5 GPa.

  2. Application of Copper-tin Alloy Contact Wires on Electrified Railways%电气化铁路铜锡合金接触线的应用

    Institute of Scientific and Technical Information of China (English)

    陈绍华; 王作祥

    2011-01-01

    阐述了不同等级的铜锡接触线的性能、应用范围;说明了铜锡接触线可以满足所有速度等级电气化铁路以及城市地铁和轨道交通的要求;对铜锡接触线与铜银接触线和铜镁接触线在使用性能、工艺性能和制造成本方面进行了比较。并对铁道部行业标准提出了修订意见。%The paper illustrates the performances and the scope of application of the copper-tin alloy contact wires;states clearly that the copper-tin contact wires are able to satisfy with the requirements of the electrified railways in different speeds,the metro and urban rail transportation;the comparisons are given for the copper-tin contact wires,copper-silver contact wires and copper-magnesium contact wires in terms of the application performance,processing performance and manufacture costs.It also puts forward the proposals on revision of the industrial standards of the Ministry of Railways.

  3. On the melt infiltration of copper coated silicon carbide with an aluminium alloy

    Science.gov (United States)

    Asthana, R.; Rohatgi, P. K.

    1992-01-01

    Pressure-assisted infiltration of porous compacts of Cu coated and uncoated single crystals of platelet shaped alpha (hexagonal) SiC was used to study infiltration dynamics and particulate wettability with a 2014 Al alloy. The infiltration lengths were measured for a range of experimental variables which included infiltration pressure, infiltration time, and SiC size. A threshold pressure (P(th)) for flow initiation through compacts was identified from an analysis of infiltration data; P(th) decreased while penetration lengths increased with increasing SiC size (more fundamentally, due to changes in interparticle pore size) and with increasing infiltration times. Cu coated SiC led to lower P(th) and 60-80 percent larger penetration lengths compared to uncoated SiC under identical processing conditions.

  4. Hydrogen-induced phase separation of an amorphous cerium-copper alloy

    Energy Technology Data Exchange (ETDEWEB)

    Felsch, W.; Volkmer, H.; Schneider, S.; Kohlmann, J.; Regenbrecht, A.; Samwer, K. (Goettingen Univ. (Germany, F.R.). 1. Physikalisches Inst.)

    1989-01-01

    X-ray diffraction and differential scanning calorimetry show that the amorphous alloy Ce{sub 26}Cu{sub 74} decomposes gradually into a two-phase amorphous structure by the absorption of hydrogen. There is evidence that these phases are close, in their metallic composition, to the intermetallic compounds CeCu{sub 2} and CeCu{sub 6}. Hydrogen is absorbed almost entirely by the amorphous phase related to CeCu{sub 2}. The electrical resistivity increases steeply by a factor of 3 near H/M=0.4. While the magnetic susceptibility shows a small reduction only on the spin-glass temperature due to hydrogen absorption, the low-temperature specific heat is substantially modified, indicating a considerably diminished exchange coupling between the Ce-4f and conduction electrons. (orig.).

  5. Electrical and Magneto-Resistivity Measurements on Amorphous Copper-Titanium Alloys at Low Temperatures

    Science.gov (United States)

    Fan, Renyong

    1992-01-01

    The anomalous transport properties of highly disordered metallic glasses, which require corrections to the classical Boltzmann theory, are due to quantum interference effects of the scattered electron waves. These corrections provide new contributions to the resistivity: "weak localization" and "electron-electron interaction". To study these quantum interference effects, we have made the highest-precision measurements, so far, of the resistances of the amorphous rm Cu_{50}Ti_{50 } and rm Cu_{60}Ti _{40} ribbons at much lower temperatures than before (15mK 0.15K. In contrast, at the lowest temperatures, the magnetoresistances were dominated by weak localization with Zeeman splitting and Maki-Thompson superconducting fluctuations. For higher magnetic fields and lowest temperatures (B/T > 1 T/K), we find discrepancies between our data and the theoretical calculations. We found that most of the parameters of the theoretical fits to the data were similar for both rm Cu_{50}Ti_{50} and rm Cu_{60}Ti_ {40} alloys. The two important exceptions were the inelastic and spin-orbit lifetimes: their zero -field values were about an order of magnitude smaller than those from the magnetoresistances. Also the inelastic lifetimes tend to saturate for T<0.1K in non-zero magnetic fields. Finally, we were also able to estimate the expected superconducting transition temperatures of both rm Cu_{50}Ti_{50} and rm Cu_{60}Ti _{40} alloys: less than 15mK and 5mK, respectively. Our novel technique can, in principle, be used to make high precision resistance measurements down to 15mK on any ribbon or film-like high resistivity metal.

  6. Lack of Involvement of Fenton Chemistry in Death of Methicillin-Resistant and Methicillin-Sensitive Strains of Staphylococcus aureus and Destruction of Their Genomes on Wet or Dry Copper Alloy Surfaces.

    Science.gov (United States)

    Warnes, Sarah L; Keevil, C William

    2016-01-29

    The pandemic of hospital-acquired infections caused by methicillin-resistant Staphylococcus aureus (MRSA) has declined, but the evolution of strains with enhanced virulence and toxins and the increase of community-associated infections are still a threat. In previous studies, 10(7) MRSA bacteria applied as simulated droplet contamination were killed on copper and brass surfaces within 90 min. However, contamination of surfaces is often via finger tips and dries rapidly, and it may be overlooked by cleaning regimes (unlike visible droplets). In this new study, a 5-log reduction of a hardy epidemic strain of MRSA (epidemic methicillin-resistant S. aureus 16 [EMRSA-16]) was observed following 10 min of contact with copper, and a 4-log reduction was observed on copper nickel and cartridge brass alloys in 15 min. A methicillin-sensitive S. aureus (MSSA) strain from an osteomyelitis patient was killed on copper surfaces in 15 min, and 4-log and 3-log reductions occurred within 20 min of contact with copper nickel and cartridge brass, respectively. Bacterial respiration was compromised on copper surfaces, and superoxide was generated as part of the killing mechanism. In addition, destruction of genomic DNA occurs on copper and brass surfaces, allaying concerns about horizontal gene transfer and copper resistance. Incorporation of copper alloy biocidal surfaces may help to reduce the spread of this dangerous pathogen. Copyright © 2016, American Society for Microbiology. All Rights Reserved.

  7. Lack of Involvement of Fenton Chemistry in Death of Methicillin-Resistant and Methicillin-Sensitive Strains of Staphylococcus aureus and Destruction of Their Genomes on Wet or Dry Copper Alloy Surfaces

    Science.gov (United States)

    2016-01-01

    The pandemic of hospital-acquired infections caused by methicillin-resistant Staphylococcus aureus (MRSA) has declined, but the evolution of strains with enhanced virulence and toxins and the increase of community-associated infections are still a threat. In previous studies, 107 MRSA bacteria applied as simulated droplet contamination were killed on copper and brass surfaces within 90 min. However, contamination of surfaces is often via finger tips and dries rapidly, and it may be overlooked by cleaning regimes (unlike visible droplets). In this new study, a 5-log reduction of a hardy epidemic strain of MRSA (epidemic methicillin-resistant S. aureus 16 [EMRSA-16]) was observed following 10 min of contact with copper, and a 4-log reduction was observed on copper nickel and cartridge brass alloys in 15 min. A methicillin-sensitive S. aureus (MSSA) strain from an osteomyelitis patient was killed on copper surfaces in 15 min, and 4-log and 3-log reductions occurred within 20 min of contact with copper nickel and cartridge brass, respectively. Bacterial respiration was compromised on copper surfaces, and superoxide was generated as part of the killing mechanism. In addition, destruction of genomic DNA occurs on copper and brass surfaces, allaying concerns about horizontal gene transfer and copper resistance. Incorporation of copper alloy biocidal surfaces may help to reduce the spread of this dangerous pathogen. PMID:26826226

  8. Extractive spectrophotometric determination of copper(II in water and alloy samples with 3-methoxy-4-hydroxy benzaldehyde-4-bromophenyl hydrazone (3,4-MHBBPH

    Directory of Open Access Journals (Sweden)

    D. REKHA

    2007-03-01

    Full Text Available A facile, sensitive and selective extractive spectrophotometricmethod was developed for the determination of copper(II in various water and alloy samples using a newly synthesized reagent, 3-methoxy-4-hydroxy benzaldehyde 4-bromophenyl hydrazone (3,4-MHBBPH. Copper(II forms a orange colored complex with (3,4-MHBBPH in acetate buffermedium (pH 4 which increases the sensitivity and the complexwas extracted into chloroform. Under optimum conditions, the maximum absorption of the chloroform extract was measured at 462 nm. The Beer law was obeyed in the range of 0.20 to 4.0 mg ml-1 of copper. The molar absorptivity and the Sandell's sensitivity of the complex were 2.0520 ´ 104 mol-1 cm-1 and 0.2540 mg cm-2, respectively. The detection limit was found to be 0.0270 mg mL-1. Adetailed study of various interfering ions made the method more sensitive. The method was successfully applied for the determination of Cu(II in water and alloy samples. The performance of the present method was evaluated in terms of Student 't' test and Variance ratio 'f ' test, which indicate the significance of the present method over reported methods.

  9. Reliability design and assessment of a micro-probe using the results of a tensile test of a beryllium-copper alloy thin film

    Science.gov (United States)

    Park, Jun-Hyub; Shin, Myung-Soo

    2011-09-01

    This paper describes the results of tensile tests for a beryllium-copper (BeCu) alloy thin film and the application of the results to the design of a probe. The copper alloy films were fabricated by electroplating. To obtain the tensile characteristics of the film, the dog-bone type specimen was fabricated by the etching method. The tensile tests were performed with the specimen using a test machine developed by the authors. The BeCu alloy has an elastic modulus of 119 GPa and the 0.2% offset yield and ultimate tensile strengths of 1078 MPa and 1108 MPa, respectively. The design and manufacture of a smaller probe require higher pad density and smaller pad-pitch chips. It should be effective in high-frequency testing. For the design of a new micro-probe, we investigated several design parameters that may cause problems, such as the contact force and life, using the tensile properties and the design of experiment method in conjunction with finite element analysis. The optimal dimensions of the probe were found using the response surface method. The probe with optimal dimensions was manufactured by a precision press process. It was verified that the manufactured probe satisfied the life, the contact force and the over drive through the compression tests and the life tests of the probes.

  10. Formula optimization of copper and copper alloy's manual SHS welding based on uniform design%基于均匀设计法的铜及铜合金手工自蔓延焊接配方优化

    Institute of Scientific and Technical Information of China (English)

    曲利峰; 辛文彤; 吴永胜; 王森

    2011-01-01

    which is based on self-propagating high-temperature synthesis(SHS) theory and manual arc welding technique of copper and copper alloy.lt was introduced that principle of uniform design in contrast with orthogonal design and fast assessment standard of copper and copper alloy's Manual SHS welding technology,on which a project for formula optimization of SHS welding rod is presented.Thermite Al+CuO,slagforming constituent B2O3 and alloying constituent Ni,Zn were chosen as the influencing factors.The main survey index comprises combustion speed,heat quantity,spatter,viscosity,slag detachability,fluidity,spreading,gas hole, inclusion, intensity .The final result of formula optimization shows that it will be welded better when content of thermite was 75, slagforming constituent B2O3 was 23,alloying constituent Ni as well as Zn was 1.Final appearance of the weld seam was analyzed when the formula was adjusted.%通过对比正交设计法介绍了均匀设计法的优点,引入铜及铜合金手工自蔓延焊接快速评价方法,并采用均匀设计法优化已有铜基燃烧型焊条配方.选择高热剂Al+CuO、造渣剂B2O3、合金剂Ni、合金剂Zn 含量为影响因素,以燃速、热量、飞溅、黏度、脱渣、流动、铺展、气孔、夹杂、强度这十项性能作为主要考察指标,按照均匀设计法流程,经计算配方优化结果为:高热剂含量为75、B2O3含量为23、Ni含量为1、Zn含量为1,并对调整配方后的最终焊缝成型情况进行了机理解释.

  11. High-speed blanking of copper alloy sheets: Material modeling and simulation

    Science.gov (United States)

    Husson, Ch.; Ahzi, S.; Daridon, L.

    2006-08-01

    To optimize the blanking process of thin copper sheets ( ≈ 1. mm thickness), it is necessary to study the influence of the process parameters such as the punch-die clearance and the wear of the punch and the die. For high stroke rates, the strain rate developed in the work-piece can be very high. Therefore, the material modeling must include the dynamic effects.For the modeling part, we propose an elastic-viscoplastic material model combined with a non-linear isotropic damage evolution law based on the theory of the continuum damage mechanics. Our proposed modeling is valid for a wide range of strain rates and temperatures. Finite Element simulations, using the commercial code ABAQUS/Explicit, of the blanking process are then conducted and the results are compared to the experimental investigations. The predicted cut edge of the blanked part and the punch-force displacement curves are discussed as function of the process parameters. The evolution of the shape errors (roll-over depth, fracture depth, shearing depth, and burr formation) as function of the punch-die clearance, the punch and the die wear, and the contact punch/die/blank-holder are presented. A discussion on the different stages of the blanking process as function of the processing parameters is given. The predicted results of the blanking dependence on strain-rate and temperature using our modeling are presented (for the plasticity and damage). The comparison our model results with the experimental ones shows a good agreement.

  12. Influence of Bond Coat on HVOF-Sprayed Gradient Cermet Coating on Copper Alloy

    Science.gov (United States)

    Ke, Peng; Cai, Fei; Chen, Wanglin; Wang, Shuoyu; Ni, Zhenhang; Hu, Xiaohong; Li, Mingxi; Zhu, Guanghong; Zhang, Shihong

    2017-06-01

    Coatings are required on mold copper plates to prolong their service life through enhanced hardness, wear resistance, and oxidation resistance. In the present study, NiCr-30 wt.%Cr3C2 ceramic-metallic (cermet) layers were deposited by high velocity oxy-fuel (HVOF) spraying on different designed bond layers, including electroplated Ni, HVOF-sprayed NiCr, and double-decker Ni-NiCr. Annealing was also conducted on the gradient coating (GC) with NiCr bond layer to improve the wear resistance and adhesion strength. Coating microstructure was investigated by scanning electron microscopy and x-ray diffraction analysis. Mechanical properties including microhardness, wear resistance, and adhesion strength of the different coatings were evaluated systematically. The results show that the types of metallic bond layer and annealing process had a significant impact on the mechanical properties of the GCs. The GCs with electroplated Ni bond layer exhibited the highest adhesion strength (about 70 MPa). However, the GC with HVOF-sprayed NiCr bond layer exhibited better wear resistance. The wear resistance and adhesion strength of the coating with NiCr metallic bond layer were enhanced after annealing.

  13. Alloy

    Science.gov (United States)

    Cabeza, Sandra; Garcés, Gerardo; Pérez, Pablo; Adeva, Paloma

    2014-07-01

    The Mg98.5Gd1Zn0.5 alloy produced by a powder metallurgy route was studied and compared with the same alloy produced by extrusion of ingots. Atomized powders were cold compacted and extruded at 623 K and 673 K (350 °C and 400 °C). The microstructure of extruded materials was characterized by α-Mg grains, and Mg3Gd and 14H-LPSO particles located at grain boundaries. Grain size decreased from 6.8 μm in the extruded ingot, down to 1.6 μm for powders extruded at 623 K (350 °C). Grain refinement resulted in an increase in mechanical properties at room and high temperatures. Moreover, at high temperatures the PM alloy showed superplasticity at high strain rates, with elongations to failure up to 700 pct.

  14. Morphology and microstructure of annealed Ni-Co alloy powders electrodeposited on copper substrates

    Directory of Open Access Journals (Sweden)

    Rafailović L.D.

    2009-01-01

    Full Text Available Nickel and cobalt alloy powders from two different electrolyte compositions were obtained by electrodeposition from an ammonium sulfate solution. The structure of Ni-Co deposits formed by electrodeposition at a galvanostatic regime and the influence of current density and the bath composition were studied by SEM, DSC and X-ray diffraction methods. It was shown that the microstructure and morphology of the powders depended on the deposition current density as well as bath composition. Both, bath composition and current density affect strongly the deposit growth mechanism and the deposit composition, microstructure, grain size and surface morphology. It was found that the overpotential significantly affects the structure of the formed deposits. When electrodeposition was performed far from equilibrium conditions face-centered cubic (FCC cobalt was deposited while at low overpotential hexagonal close packed (HCP Co was formed with a lower rate of hydrogen evolution. The increase of HCP phase in the nanocrystalline deposits was caused by increase of the Co content in the powder as well by decrease of the deposition current density. It was shown that the powders change their structure in the temperature interval from 300°C to 600°C. In Co rich samples, structural changes during heating were attributed to the phase transformation of HCP to FCC.

  15. Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry

    Science.gov (United States)

    Tunga, Krishna Rajaram

    This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint.

  16. Status of the Development of Beryllium-Copper Alloy Ignition Capsules by Precision Machining

    Science.gov (United States)

    Nobile, Arthur

    2005-10-01

    Cu-doped Be capsules are being developed for ignition on the National Ignition Facility (NIF). The fabrication approach being pursued at Los Alamos is based on bonding of cylindrical parts containing precision machined hemispherical cavities, followed by machining the external contour to produce a spherical capsule. While we have demonstrated this approach, there are several key issues that need to be resolved before a capsule meeting NIF specifications can be produced. These issues are synthesis of high purity small grain size Be-Cu alloy, formation of a hemishell bond strong enough to allow the capsule to be machined after the hemishells are bonded, precision machining and polishing of the capsule to meet stringent specifications for surface finish and spherical quality, and filling with DT. In this paper we report on the progress that has been made on these issues. This work is performed at Los Alamos National Laboratory and supported by U.S. Department of Energy under contract number W7405-ENG36

  17. Underwater Superoleophobicity Induced by the Thickness of the Thermally Grown Porous Oxide Layer on C84400 Copper Alloy

    Directory of Open Access Journals (Sweden)

    Aniedi Nyong

    2014-02-01

    Full Text Available The underwater contact angle behavior on oxide layers of varying thicknesses was studied. These oxide layers were grown by thermally oxidizing C84400 copper alloys in N2-0.75 wt.% O2 and N2-5 wt.% O2 gas mixtures at 650 °C. Characterization of the oxidized specimens was effected using X-ray diffraction, scanning electron microscope (SEM and contact angle goniometer. The results from the X-ray diffraction analyses confirmed the formation of CuO, ZnO and PbO. The average sizes of the oxide granules were in the range of 70 nm to 750 nm, with the average thickness of the oxide layer increasing with the increase in the weight percent of oxygen in the N2-O2 gas mixtures. The results showed that the oxide layer growth followed the parabolic law. The underwater oil contact angles increased, due to the change in the surface morphology and porosity of the oxide layer. The small sizes and irregular packing of the oxide granules cause hierarchical rough surface layers with pores. The estimated pore sizes, in the range of 88 ± 40 to 280 ± 76, were predominant on the oxide layers of the samples processed in the N2-5 wt.% O2 gas mixture. The presence of these pores caused an increase in the porosities as the thickness of the oxide layers increased. At oxide layer thickness above 25 microns, the measured contact angle exceeded 150° as underwater superoleophobicity was recorded.

  18. Interstitial-impurity interactions in copper-silver and aluminum-magnesium alloys. [Electron beams

    Energy Technology Data Exchange (ETDEWEB)

    Wong, H.P.

    1982-01-01

    The configurations and dynamical properties of complexes formed between interstitials and oversized impurities in electron-irradiated aluminum and copper were determined. Measurements were taken of the ultrasonic attention and resonant frequency in single crystal samples of Cu-Ag and Al-Mg. A variety of peaks appeared in both materials in plots of the logarithmic decrement versus temperature. The simultaneous presence of multiple defects was established by the different annealing behavior shown by each peak. It was found that interstitial trapping in our oversized systems was generally weaker than in previously studied undersized systems. The principal features in Cu-Ag that must be accounted for by a model include the following: (1) Three low-temperature peaks were seen having trigonal symmetry. The main peak annealed away at 110 K uncorrelated with any resistivity recovery and it grew at 60 K, correlated with a resistivity decrease. For Al-MG, the principal features associated with the main peak include: seen at high temperature (>135 K) having trigonal symmetry; annealed away at 127 K and seemed to correlate with a resistivity decrease; remaining peaks grew while the main peak annealed away. The implications of an existing model were developed. No evidence was found for the deeply-trapped <110>-orthorhombic defect predicted by the existing model. Therefore, two alternative models were developed. Model A uses a canted dumb-bell at the next-nearest neighbor position to explain the results. Model B uses a point interstitial at an octahedral position. A distinction between the two which is subject to experimental check is that model A predicts that interstitial migration between different impurity atoms occurs near 127 K in Cu-Ag while model B predicts a migration temperature near 60 K.

  19. The structure and phase composition of the surface layer of the samples during the processing of VT-10 titanium alloys by copper ions

    Science.gov (United States)

    Kalashnikov, Mark P.; Fedorischeva, Marina V.; Nikonenko, Alisa V.; Bozhko, Irina A.; Sergeev, Victor P.

    2016-11-01

    The phase composition, structure and morphology of the surface of VT-10 titanium modified by copper ions have been investigated by X-ray, SEM and TEM. It has been established that there are intermetallide phases of Cu-Ti equilibrium diagram in the surface layer during the treatment of VT-10 titanium by copper ions. The modified surface layer in the cross section is divided into two layers: up to 1 µm in thickness and from 1µm up to 4.5-5.0 µm, depending on the treatment time. Two-level micro and nanoporous nanocrystalline structure was formed in the modified layer. It was found that the phase structure and the morphology of the surface layers of VT-10 alloys depend on the treatment time.

  20. The Effect of the Solution Heat Treatment on the Mechanical Properties of Aluminum-Copper Alloy (2024-T3 Using Rolling Process

    Directory of Open Access Journals (Sweden)

    Khairia Salman Hassan

    2011-01-01

    Full Text Available The effect of solution heat treatment on the mechanical properties of Aluminum-Copper alloy. (2024-T3 by the rolling process is investigated. The solution heat treatment was implemented by heating the sheets to 480 C° and quenching them by water; then forming by rolling for many passes. And then natural aging is done for one month. Mechanical properties (tensile strength and hardness are evaluated and the results are compared with the metal without treatment during the rolling process. ANSYS analysis is used to show the stresses distribution in the sheet during the rolling process. It has been seen that good mechanical properties are evident in the alloy without heat treatment due to the strain hardening and also the mechanical properties are improved after heat treatment and rolling process but with lower forces and stresses when compared with the untreated.

  1. Comparative study on the corrosion behavior of the cold rolled and hot rolled low-alloy steels containing copper and antimony in flue gas desulfurization environment

    Science.gov (United States)

    Park, S. A.; Kim, J. G.; He, Y. S.; Shin, K. S.; Yoon, J. B.

    2014-12-01

    The correlation between the corrosion and microstructual characteristics of cold rolled and hot rolled low-alloy steels containing copper and antimony was established. The corrosion behavior of the specimens used in flue gas desulfurization systems was examined by electrochemical and weight loss measurements in an aggressive solution of 16.9 vol % H2SO4 + 0.35 vol % HCl at 60°C, pH 0.3. It has been shown that the corrosion rate of hot rolled steel is lower than that of cold rolled steel. The corrosion rate of cold rolled steel was increased by grain refinement, inclusion formation, and preferred grain orientation.

  2. MICELLAR SOLUBLIZING SPECTROPHOTOMETRIC DETERMINATION OF MICRO COPPER IN ALUMINUM ALLOY%PAN胶束增溶光度法测定铝合金中铜

    Institute of Scientific and Technical Information of China (English)

    寇兴明; 印红玲

    2001-01-01

    A direct spectrophotometric method for the determination of micro copper in aluminum alloy using PAN as chromogenic reagent has been proposed.   In the presence of CTMAB,a stable red complex between Cu(Ⅱ) and PAN is formed in the buffer solution of pH1.3~4.5.The apparent molar absorptivity is 2.09×104L*mol-1*cm-1 at 558nm.The RSD is 0.8%(n=4).Beer's law is obeyed for 0~80μg/25ml of Cu(Ⅱ).The linear correlation coefficient is 0.9998.

  3. The Effects of Grain Size on the Martensitic Transformation in Copper-Zinc-Aluminum Shape Memory Alloys.

    Science.gov (United States)

    1982-12-01

    production or nearly so. In the medical arts these alloys are being exploited for their SME properties as orthodontic appliances, intercranial aneurism...treatment is applicable to the Cu-Zn-Al alloys. 60 LIST OF REFERENCES 1. Wayman, C. M., "Some Applications of Shape Memory Alloys," Journal of Metals, pp

  4. Failure Analysis on Rupture of a Copper Alloy Water Meter Shell%铜合金自来水表外壳破裂失效分析

    Institute of Scientific and Technical Information of China (English)

    戴维弟

    2011-01-01

    采用宏观检验、断口分析、能谱分析、金相检验以及化学成分分析等方法,对某铜合金自来水表外壳在使用中发生破断开裂、造成泄露的原因进行了分析。结果表明:该铜合金自来水表外壳在使用过程中发生破裂属于应力腐蚀破裂,致使其发生应力腐蚀的原因主要与使用环境中含有硫化物有关。%A copper alloy water meter shell ruptured and resulted in leakage in service, and the rupture reason was analyzed by means of macroscopic examination, fracture analysis, energy spectrum analysis, metallographic examination and chemical compositions analysis. The results show that the rupture of the copper alloy water meter shell in service was stress corrosion cracking which was mainly because there Were sulfides in the service environment.

  5. Electro-deposition metallic tungsten coatings in a Na{sub 2}WO{sub 4}-WO{sub 3} melt on copper based alloy substrate

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Y.H., E-mail: dreamerhong77@126.com [School of Materials Science and Engineering, University of Science and Technology Beijing, 30 Xueyuan Road, Haidian District, Beijing 100083 (China); Zhang, Y.C.; Liu, Q.Z.; Li, X.L.; Jiang, F. [School of Materials Science and Engineering, University of Science and Technology Beijing, 30 Xueyuan Road, Haidian District, Beijing 100083 (China)

    2012-11-15

    Highlights: Black-Right-Pointing-Pointer The tungsten coating (>1 mm) was obtained by electro-deposition method in molten salt. Black-Right-Pointing-Pointer Different thickness tungsten coatings were obtained by using different durations. Black-Right-Pointing-Pointer Good performance of coating was obtained when pulse parameters were modulated. - Abstract: The tungsten coating was prepared by electro-deposition technique on copper alloy substrate in a Na{sub 2}WO{sub 4}-WO{sub 3} melt. The coating's surface and cross-section morphologies as well as its impurities were investigated by XPS, SEM and line analysis. Various plating durations were investigated in order to obtain an optimal coating's thickness. The results demonstrated that the electro-deposited coating was compact, voidless, crackless and free from impurities. The tungsten coating's maximum Vickers hardness was measured to be 520 HV. The tungsten coating's minimum oxygen content was determined to be 0.018 wt%. Its maximum thickness was measured to be 1043.67 {mu}m when the duration of electrolysis was set to 100 h. The result of this study has demonstrated the feasibility of having thicker tungsten coatings on copper alloy substrates. These electrodeposited tungsten coatings can be potentially implemented as reliable armour for the medium heat flux plasma facing component (PFC).

  6. Copper-based alloys, crystallographic and crystallochemical parameters of alloys in binary systems Cu-Me (Me=Co, Rh, Ir, Cu, Ag, Au, Ni, Pd, Pt)

    Energy Technology Data Exchange (ETDEWEB)

    Porobova, Svetlana, E-mail: porobova.sveta@yandex.ru; Loskutov, Oleg, E-mail: lom58@mail.ru [Tomsk State University of Architecture and Building, Russia, Tomsk, 2 Solyanaya sq, Tomsk, 634003 (Russian Federation); Markova, Tat’jana, E-mail: patriot-rf@mail.ru [Siberian State Industrial University. 42 Kirov St., Novokuznetsk, 654007 (Russian Federation); Klopotov, Vladimir, E-mail: vdklopotov@mail.ru [Research Tomsk Polytechnic University, 30 Lenin Ave., Tomsk, 634050 (Russian Federation); Klopotov, Anatoliy, E-mail: klopotovaa@tsuab.ru [Tomsk State University of Architecture and Building, Russia, Tomsk, 2 Solyanaya sq, Tomsk, 634003 (Russian Federation); National Research Tomsk State University, 36, Lenin Ave., Tomsk, 634050 (Russian Federation); Vlasov, Viktor, E-mail: vik@tsuab.ru [Tomsk State University of Architecture and Building, Russia, Tomsk, 2 Solyanaya sq, Tomsk, 634003 (Russian Federation); Research Tomsk Polytechnic University, 30 Lenin Ave., Tomsk, 634050 (Russian Federation)

    2016-01-15

    The article presents the results of the analysis of phase equilibrium of ordered phases in binary systems based on copper Cu- Me (where Me - Co, Rh, Ir, Ag, Au, Ni, Pd, Pt) to find correlations of crystallochemical and crystallographic factors. It is established that the packing index in disordered solid solutions in binary systems based on copper is close to the value of 0.74 against the background of an insignificant deviation of atomic volumes from the Zen’s law.

  7. Process for electroplating copper and silver on titanium alloy%钛合金镀铜、镀银工艺

    Institute of Scientific and Technical Information of China (English)

    刘玉敏; 李鹏; 李任和

    2015-01-01

    In order to eliminate the poor adhesion of copper and silver coatings prepared from cyanide bath on titanium alloy surface, five process schemes for copper and silver plating were designed through changing pretreatment methods of substrate. The optimal process flow is as follows:wet sand blowing, protection, degreasing by scrubbing with light lime, washing with cold water, acid copper plating or cyanide silver plating, washing with cold water again, and drying with compressed air. The production practice showed that all of the products prepared by the given process have qualified adhesion and their hydrogen contents are under the control level. The method for controlling hydrogen content in titanium alloy and some points for attention were described.%为克服钛合金氰化镀铜、镀银层结合力不良的问题,通过改变基体预处理方式设计了5个镀铜、镀银方案并进行结合力表征,得到钛合金镀铜、镀银的最佳工艺流程为:湿吹砂─保护─轻石灰刷洗除油─冷水洗─酸性镀铜或氰化镀银─冷水洗─压缩空气吹干。生产实践证明采用该工艺电镀所得产品结合力均合格,且含氢量不超标。介绍了电镀过程中控制钛合金含氢量的方法和注意事项。

  8. 40 CFR 468.10 - Applicability; description of the copper forming subcategory.

    Science.gov (United States)

    2010-07-01

    ... treatment works from the forming of copper and copper alloys except beryllium copper alloys. ... copper forming subcategory. 468.10 Section 468.10 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS COPPER FORMING POINT SOURCE CATEGORY Copper...

  9. Copper nanowall array grown on bulk Fe-Co-Ni alloy substrate at room temperature as lithium-ion battery current collector

    Energy Technology Data Exchange (ETDEWEB)

    Hu Yingying, E-mail: yyhu@phy.ccnu.edu.cn; Liu Jinping; Ding Ruimin; Wang Kai; Jiang Jian; Ji Xiaoxu; Li Yuanyuan; Huang Xintang, E-mail: xthuang@phy.ccnu.edu.c

    2010-09-30

    Large-scale copper nanowall array on the bulk Fe-Co-Ni alloy substrate has been prepared in aqueous solution at room temperature via an electroless deposition method. The thickness of the nanowalls is about 15 nm. A possible growth mechanism of the nanowalls was proposed. The effects of reaction temperature, reaction time and the amount of critical agent (Fe{sup 3+}) on the morphology and crystalline phase of the nanowalls were investigated. Furthermore, the electrochemical performance of Sn film supported on the as-prepared copper nanowalls current collector is enhanced in comparison with that on the commercial copper foil when used as anode for Li-ion batteries with the operating voltage window of 0.01-2.0 V (vs. Li). After 20 cycles, the discharge capacity of Sn-Cu nanowalls anode still remained 365.9 mAh g{sup -1}, that is, 40% retention of the reversible capacity, while the initial charge capacity of Sn film cast on commercial Cu foil was 590 mAh g{sup -1}, dropping rapidly to 260 mAh g{sup -1} only after 10 cycles.

  10. Electrochemical behaviors of copper and copper-tin alloy electrodeposition from aqueous pyrophosphate electrolyte%焦磷酸盐溶液体系电沉积铜及铜-锡合金的电化学行为

    Institute of Scientific and Technical Information of China (English)

    黄灵飞; 曾振欧; 冯冰; 谢金平; 李树泉

    2014-01-01

    The electrochemical behaviors of Cu and low-Sn Cu-Sn alloy electrodeposition on copper electrode from aqueous pyrophosphate bath were studied by electrochemical test methods. The effect of additive JZ-1 on Cu and Cu-Sn alloy electrodeposition was discussed and the surface morphologies and crystal structures of electrodeposited coatings were analyzed. The results showed that both Cu and Cu-Sn alloy electrodeposition from aqueous pyrophosphate bath are irreversible electrode process, during which electrochemical polarization happens. It was considered that the reaction mechanism of the cathodic process of Cu electrodeposition consists of fast preceding chemical transformation step and direct reduction of 22 7CuP O -. There is interaction between Cu and Sn during Cu-Sn alloy electrodeposition process, as well as mutual promotion between Cu2+ and Sn2+in electrodeposition. The crystal structure of Cu-Sn alloy is Cu13.7Sn. The additive JZ-1 has a dual role of promoting Cu electrodeposition and inhibiting Sn electrodeposition, which is benefit for the reduction of Sn content in Cu-Sn alloy and grain refinement.%采用电化学测试方法研究了焦磷酸盐溶液体系在铜电极表面电沉积Cu及Cu-Sn合金(低Sn)的电化学行为。探讨了添加剂JZ-1对电沉积Cu和Cu-Sn合金的影响,并对电沉积层的表面形貌和晶相结构进行分析。结果表明,焦磷酸盐溶液体系电沉积Cu及Cu-Sn合金均为不可逆电极过程,发生电化学极化。电沉积 Cu 的阴极过程表现为前置转化反应很快和以227CuP O -直接还原的反应机理形式。电沉积Cu-Sn合金过程中Cu与Sn之间存在相互作用,溶液中的Cu2+与Sn2+也存在相互促进电沉积的作用,Cu-Sn合金的晶相结构为Cu13.7Sn。添加剂JZ-1具有促进Cu电沉积和抑制Sn电沉积的双重作用,有利于降低Cu-Sn合金中的Sn含量并细化晶粒。

  11. Fs–ns double-pulse Laser Induced Breakdown Spectroscopy of copper-based-alloys: Generation and elemental analysis of nanoparticles

    Energy Technology Data Exchange (ETDEWEB)

    Guarnaccio, A.; Parisi, G.P.; Mollica, D. [CNR-ISM, U.O.S. Tito Scalo, Zona Industriale, 85050 Tito Scalo, PZ (Italy); De Bonis, A. [CNR-ISM, U.O.S. Tito Scalo, Zona Industriale, 85050 Tito Scalo, PZ (Italy); Dipartimento di Scienze, Università degli Studi della Basilicata, Via dell' Ateneo Lucano 10, 85100 Potenza (Italy); Teghil, R. [Dipartimento di Scienze, Università degli Studi della Basilicata, Via dell' Ateneo Lucano 10, 85100 Potenza (Italy); Santagata, A. [CNR-ISM, U.O.S. Tito Scalo, Zona Industriale, 85050 Tito Scalo, PZ (Italy)

    2014-11-01

    Evolution of nanoparticles ejected during ultra-short (250 fs) laser ablation of certified copper alloys and relative calibration plots of a fs–ns double-pulse Laser Induced Breakdown Spectroscopy orthogonal configuration is presented. All work was performed in air at atmospheric pressure using certified copper-based-alloy samples irradiated by a fs laser beam and followed by a delayed perpendicular ns laser pulse. In order to evaluate possible compositional changes of the fs induced nanoparticles, it was necessary to consider, for all samples used, comparable features of the detected species. With this purpose the induced nanoparticles black-body-like emission evolution and their relative temperature decay have been studied. These data were exploited for defining the distance between the target surface and the successive ns laser beam to be used. The consequent calibration plots of minor constituents (i.e. Sn, Pb and Zn) of the certified copper-based-alloy samples have been reported by taking into account self-absorption effects. The resulting linear regression coefficients suggest that the method used, for monitoring and ruling the fs laser induced nanoparticles, could provide a valuable approach for establishing the occurrence of potential compositional changes of the detected species. All experimental data reveal that the fs laser induced nanoparticles can be used for providing a coherent composition of the starting target. In the meantime, the fs–ns double-pulse Laser Induced Breakdown Spectroscopy orthogonal configuration here used can be considered as an efficient technique for compositional determination of the nanoparticles ejected during ultra-short laser ablation processes. - Highlights: • Laser induced NP continuum black-body-like emission was used for T determination. • Invariable composition of generated NPs was assumed in the range of 20 μs. • Fs-ns DP-LIBS was employed for the compositional characterization of NPs. • NPs obtained by fs

  12. Antibacterial effect of copper-bearing titanium alloy (Ti-Cu) against Streptococcus mutans and Porphyromonas gingivalis

    Science.gov (United States)

    Liu, Rui; Memarzadeh, Kaveh; Chang, Bei; Zhang, Yumei; Ma, Zheng; Allaker, Robert P.; Ren, Ling; Yang, Ke

    2016-07-01

    Formation of bacterial biofilms on dental implant material surfaces (titanium) may lead to the development of peri-implant diseases influencing the long term success of dental implants. In this study, a novel Cu-bearing titanium alloy (Ti-Cu) was designed and fabricated in order to efficiently kill bacteria and discourage formation of biofilms, and then inhibit bacterial infection and prevent implant failure, in comparison with pure Ti. Results from biofilm based gene expression studies, biofilm growth observation, bacterial viability measurements and morphological examination of bacteria, revealed antimicrobial/antibiofilm activities of Ti-Cu alloy against the oral specific bacterial species, Streptococcus mutans and Porphyromonas gingivalis. Proliferation and adhesion assays with mesenchymal stem cells, and measurement of the mean daily amount of Cu ion release demonstrated Ti-Cu alloy to be biocompatible. In conclusion, Ti-Cu alloy is a promising dental implant material with antimicrobial/antibiofilm activities and acceptable biocompatibility.

  13. Comparison of Super-Hydrophobicity and Corrosion Resistance of Micro-Nano Structured Nickel and Nickel- Cobalt Alloy Coatings on Copper Substrate

    Directory of Open Access Journals (Sweden)

    S. Khorsand

    2016-03-01

    Full Text Available Super-hydrophobic nickel and nickel-cobalt alloy coatings with micro-nano structure were successfully electrodeposited on copper substrates with one and two steps electrodeposition. Surface morphology, wettability and corrosion  resistance were characterized by scanning electron microscopy, water contact angle measurements, electrochemical impedanc spectroscopy (EIS and potentiodynamic polarization curves. The results showed that the wettability of the micro-nano Ni and Ni-Co films varied from super-hydrophilicity to super-hydrophobicity by exposure of the surface to air at room temperature. The corrosion results revealed the positive effect of hydrophobicity on corrosion resistance of Ni coating (~10 times and Ni-Co coating (~100 times in comparison with their fresh coatings. The results showed that super-hydrophobic nickel coating had higher corrosion resistance than super-hydrophobic nickel-cobalt coating.

  14. 采用非洲某铜钴矿生产铜钴合金的工艺研究%Study on the Copper-Cobalt Alloy Production Technology for an Africa Copper-Cobalt Mine

    Institute of Scientific and Technical Information of China (English)

    胡宇杰

    2012-01-01

    Aiming at the copper and cobalt oxide ores with high SiO2 and low CaO in an Africa mine,explored the feasibility to produce copper-cobalt alloy through EF reduction smelting.The result shows that it is reasonable to produce copper-cobalt alloy by EF reduction smelting with coke powders as reducing agent and CaO as refractory agent.The most suitable conditions are that the addition of CaO is about 40% of the raw ores and the coke is about 6%~10%,the smelting temperature is 1 500~1 600 ℃ and the smelting period is about one hour.The valuable metal recovery is: Co 90%,Cu 86% and Ni 90%.Meanwhile the erosion conditions for different refractories were investigated,providing a reference basis for the design of the industrial furnace and the selection of refractory materials.%针对非洲某高SiO2低CaO铜钴氧化矿,探讨了采用电炉还原熔炼生产铜钴合金的可行性。试验结果表明:采用焦粉做还原剂、CaO做造渣剂进行电炉还原熔炼是合理的;最佳工艺条件为:CaO加入的质量占原矿的40%,还原剂焦粉加入的质量占原矿的6%~10%,还原熔炼温度为1 500~1 600℃,还原熔炼时间为1 h;有价金属回收率Co为90%,Cu为86%,Ni为90%。同时还试验考察了不同耐火材料的侵蚀情况,为工业炉的设计及耐火材料的选用提供参考依据。

  15. Aluminum alloy

    Science.gov (United States)

    Blackburn, Linda B. (Inventor); Starke, Edgar A., Jr. (Inventor)

    1989-01-01

    This invention relates to aluminum alloys, particularly to aluminum-copper-lithium alloys containing at least about 0.1 percent by weight of indium as an essential component, which are suitable for applications in aircraft and aerospace vehicles. At least about 0.1 percent by weight of indium is added as an essential component to an alloy which precipitates a T1 phase (Al2CuLi). This addition enhances the nucleation of the precipitate T1 phase, producing a microstructure which provides excellent strength as indicated by Rockwell hardness values and confirmed by standard tensile tests.

  16. Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy

    Institute of Scientific and Technical Information of China (English)

    In-Joon SON; Hiroaki NAKANO; Satoshi OUE; Shigeo KOBAYASHI; Hisaaki FUKUSHIMA; Zenji HORITA

    2009-01-01

    The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis. Anodizing was conducted for 20 min at 200 and 400 A/m2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3-16H2O at 20 ℃. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application of ECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide films are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion.

  17. Conducting water chemistry of the secondary coolant circuit of VVER-based nuclear power plant units constructed without using copper containing alloys

    Science.gov (United States)

    Tyapkov, V. F.

    2014-07-01

    The secondary coolant circuit water chemistry with metering amines began to be put in use in Russia in 2005, and all nuclear power plant units equipped with VVER-1000 reactors have been shifted to operate with this water chemistry for the past seven years. Owing to the use of water chemistry with metering amines, the amount of products from corrosion of structural materials entering into the volume of steam generators has been reduced, and the flow-accelerated corrosion rate of pipelines and equipment has been slowed down. The article presents data on conducting water chemistry in nuclear power plant units with VVER-1000 reactors for the secondary coolant system equipment made without using copper-containing alloys. Statistical data are presented on conducting ammonia-morpholine and ammonia-ethanolamine water chemistries in new-generation operating power units with VVER-1000 reactors with an increased level of pH. The values of cooling water leaks in turbine condensers the tube system of which is made of stainless steel or titanium alloy are given.

  18. Modulating fcc and hcp Ruthenium on the Surface of Palladium-Copper Alloy through Tunable Lattice Mismatch.

    Science.gov (United States)

    Yao, Yancai; He, Dong Sheng; Lin, Yue; Feng, Xiaoqian; Wang, Xin; Yin, Peiqun; Hong, Xun; Zhou, Gang; Wu, Yuen; Li, Yadong

    2016-04-25

    Herein, we report an epitaxial-growth-mediated method to grow face-centered cubic (fcc) Ru, which is thermodynamically unfavorable in the bulk form, on the surface of Pd-Cu alloy. Induced by the galvanic replacement between Ru and Pd-Cu alloy, a shape transformation from a Pd-Cu@Ru core-shell to a yolk-shell structure was observed during the epitaxial growth. The successful coating of the unconventional crystallographic structure is critically dependent on the moderate lattice mismatch between the fcc Ru overlayer and PdCu3 alloy substrate. Further, both fcc and hexagonal close packed (hcp) Ru can be selectively grown through varying the lattice spacing of the Pd-Cu substrate. The presented findings provide a new synthetic pathway to control the crystallographic structure of metal nanomaterials.

  19. Corrosion Behaviours of Copper Alloy in Solutions Containing Na2SO4 and NaCl with Different Concentrations

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    Potentiodynamic polarisation, potential-time measurements, X-ray diffraction (XRD) and infrared spectroscopy (IR)have been used to investigate the effect of different concentrations of Na2SO4 in the absence and presence of NaCl,on the corrosion of Cu-alloy. The electrochemical measurements showed that the increase of Na2SO4 concentration led to increase the corrosion current density of Cu alloy and vice versa. The presence of NaCl shifted the potential to more cathodic potential, which had a great influence on the protectiveness of the Cu oxide layer formed on the surface in presence of Na2SO4. The spectrometric measurements indicated the constituents of the film formed on the alloy surface were mainly Cu2O, in addition to the oxides, NiO and Fe2O3, which were traced by XRD analysis.

  20. Microstructural characterization of copper based alloys produced by reactive milling; caracterizacion microestructural de aleaciones base cobre obtenidas mediante molienda reactiva

    Energy Technology Data Exchange (ETDEWEB)

    Palma, R.; Sepulveda, A.; Zuniga, A.; Donoso, E.; Dianez, M. J.; Criado, J. M.

    2010-07-01

    The micro and nano structure of Cu-Al, Cu-V and Cu-Ti alloys produced by reactive milling were analyzed using X-ray diffraction (XRD) and transmission electron microscopy (TEM). Samples with different milling times (t= 0, 10, 20 and 30 h) were considered. The grain size, dislocation density and residual micro strain were evaluated form the XRD data using the Williamson-Hall and Klug-Alexander methods. The evolution of texture as a function of milling time was also studied using XRD. It was found, using TEM, that the grain size and dispersoid size were nano metric in all three alloys considered. (Author) 12 refs.

  1. Copper-Zinc Alloy Nanopowder : A Robust Precious-Metal-Free Catalyst for the Conversion of 5-Hydroxymethylfurfural

    NARCIS (Netherlands)

    Bottari, Giovanni; Kumalaputri, Angela J; Krawczyk, Krzysztof K; Feringa, Ben L; Heeres, Hero J; Barta, Katalin

    2015-01-01

    Noble-metal-free copper-zinc nanoalloy (<150 nm) is found to be uniquely suited for the highly selective catalytic conversion of 5-hydroxymethylfurfural (HMF) to potential biofuels or chemical building blocks. Clean mixtures of 2,5-dimethylfuran (DMF) and 2,5-dimethyltetrahydrofuran (DMTHF) with com

  2. Mechanical characterization based in the impact test of the cadmium-zinc and cadmium-zinc-copper alloys; Caracterizacion mecanica basada en la prueba de impacto de las aleaciones cadmio-zinc y cadmio-zinc-cobre

    Energy Technology Data Exchange (ETDEWEB)

    Casolco, S.R.; Torres V, G. [Instituto de Investigacion en Materiales, Universidad Nacional Autonoma de Mexico, Apartado Postal 70-360, 04510 Mexico D.F. (Mexico)

    1999-11-01

    The present work is a study carried out in the Institute for Materials Research of the UNAM, of the alloys cadmium-zinc and cadmium-zinc-copper with the fundamental objective of knowing their behavior to the impact that which will allow to establish structural applications of these alloys. This work consists mainly on impact tests of the type Charpy at different temperatures in a range of - 150 Centigrade to 250 Centigrade and to study their fracture morphologies with the help of a scanning electron microscope to recognize the tendency of the material toward the fracture of the fragile type and to determine the ductile-fragile transition. (Author)

  3. Improvement in the Mechanical Properties of High Temperature Shape Memory Alloy (Ti50Ni25Pd25) by Copper Addition

    National Research Council Canada - National Science Library

    Rehman, Saif ur; Khan, Mushtaq; Khan, A. Nusair; Jaffery, Syed Husain Imran; Ali, Liaqat; Mubashar, Aamir

    2015-01-01

      High temperature shape memory alloys Ti50Ni25Pd25 and Ti50Ni20Pd25Cu5 were developed, characterized, and tensile tested in both martensite ( [subscript]Mf[/subscript] - 50°C) and austenite ( [subscript]Af[/subscript] + 50°C) phases...

  4. Effect of test temperature and strain rate on the tensile properties of high-strength, high-conductivity copper alloys

    Energy Technology Data Exchange (ETDEWEB)

    Zinkle, S.J.; Eatherly, W.S. [Oak Ridge National Lab., TN (United States)

    1997-04-01

    The unirradiated tensile properties of wrought GlidCop AL25 (ITER grade zero, IGO) solutionized and aged CuCrZr, and cold-worked and aged and solutionized and aged Hycon 3HP{trademark} CuNiBe have been measured over the temperature range of 20-500{degrees}C at strain rates between 4 x 10{sup {minus}4} s{sup {minus}1} and 0.06 s{sup {minus}1}. The measured room temperature electrical conductivity ranged from 64 to 90% IACS for the different alloys. All of the alloys were relatively insensitive to strain rate at room temperature, but the strain rate sensitivity of GlidCop Al25 increased significantly with increasing temperature. The CuNiBe alloys exhibited the best combination of high strength and high conductivity at room temperature. The strength of CuNiBe decreased slowly with increasing temperature. However, the ductility of CuNiBe decreased rapidly with increasing temperature due to localized deformation near grain boundaries, making these alloy heats unsuitable for typical structural applications above 300{degrees}C. The strength and uniform elongation of GlidCop Al25 decreased significantly with increasing temperature at a strain rate of 1 x 10{sup {minus}3} s{sup {minus}1}, whereas the total elongation was independent of test temperature. The strength and ductility of CuCrZr decreased slowly with increasing temperature.

  5. Recent Development in Strengthening Techniques of High Strength and High Conductive Copper Alloys%高强高导铜合金强化技术研究进展

    Institute of Scientific and Technical Information of China (English)

    张蓓; 张治国; 李卫

    2012-01-01

    Copper and its alloys are extensively applied in various industries. However, with the development of modern industry, the copper alloys with high-strength and high-conductivity prepared by traditional strengthening technologies have lost the ability to fulfill the combination property requirement. The recent progress on enhancing techniques of high-strength and high-conductive copper alloys is reviewed, with the emphasis on the substrate strengthening and surface strengthening technologies. A various technologies, such as spray deposition, pulsed elec-trodeposition of new copper alloy forming technology and the laser cladding, surface spaying, ion implantation and pack cementation of surface modification technology, are introduced, and the trends of surface modification technologies is commented.%铜及铜合金在众多领域得到了广泛应用,然而随着现代工业技术的发展,传统强化方法得到的高强高导铜合金已不能完全满足对其综合性能的需求.从基体强化和表面改性两个方面综述了国内外高强高导铜合金强化技术的最新研究进展.主要介绍了喷射成型法、脉冲电沉积法等新型铜合金成型工艺技术和激光束表面熔覆、喷涂涂覆、离子注入技术及粉末包埋渗等表面改性技术,并展望了铜合金表面改性技术的发展趋势.

  6. A Comparison of Corrosion Behavior of Copper and Its Alloy in Pongamia pinnata Oil at Different Conditions

    Directory of Open Access Journals (Sweden)

    Meenakshi H. N. Parameswaran

    2013-01-01

    Full Text Available Vegetable oils are promising substitutes for petrodiesel as they can be produced from numerous oil seed crops that can be cultivated anywhere and have high energy contents, exhibiting clean combustion behavior with zero CO2 emission and negligible SO2 generation. The impact of biofuel on the corrosion of various industrial metals is a challenge for using biofuel as automotive fuel. Fuel comes in contact with a wide variety of metallic materials under different temperatures, velocities, and loads thereby causing corrosion during storage and flow of fuel. Hence, the present investigation compares the corrosion rates of copper and brass in Pongamia pinnata oil (O100, 3% NaCl, and oil blend with NaCl (O99 obtained by static immersion test and using rotating cage. The corrosivity and conductivity of the test media are positively correlated. This study suggested that the corrosivity of copper is higher than brass in Pongamia pinnata oil (PO.

  7. Adhesive performance of silver-palladium-copper-gold alloy and component metals bonded with organic sulfur-based priming agents and a tri-n-butylborane initiated luting material.

    Science.gov (United States)

    Yamashita, Miyuki; Koizumi, Hiroyasu; Ishii, Takaya; Nakayama, Daisuke; Oba, Yusuke; Matsumura, Hideo

    2013-01-01

    The purpose of the current study was to evaluate the effect of thione-based metal priming agents on the adhesive behavior of a Ag-Pd-Cu-Au alloy and component metals bonded with an acrylic resin. Disk specimens (10 mm in diameter by 3 mm thick) were prepared from a silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell M.C.12), high-purity silver, palladium, copper and gold. Four single-liquid priming agents containing organic sulfur compound (Alloy Primer, Metaltite, M.L. Primer and V-Primer) and three acidic priming agents (All Bond II Primer B, Estenia Opaque Primer and Super-Bond Liquid) were assessed. The metal specimens were flat-ground with abrasive papers, primed with one of the agents and bonded with a tri-n-butylborane initiated resin. The shear bond strengths were determined both before and after repeated thermocycling (5°C and 55°C, 1 min each, 20,000 cycles). The results were statistically analyzed with a non-parametric procedure (p = 0.05 level). The post-thermocycling bond strengths in MPa (median; n = 11) associated with the Alloy Primer, Metaltite, M.L. Primer and V-Primer materials were, respectively, 20.8, 22.8, 17.8 and 18.4 for the Ag-Pd-Cu-Au alloy; 19.6, 21.9, 14.4 and 20.1 for silver; 5.4, 4.5, 12.8 and 5.3 for palladium; 17.1, 19.2, 0.7 and 6.6 for copper; and 18.5, 17.7, 22.8 and 15.4 for gold. It can be concluded that the use of the four priming agents, which are based on organic sulfur compounds, effectively enhanced bonding to the Ag-Pd-Cu-Au alloy and the component metals, although the bonding performance varied among the priming agents and metal elements. The priming agents appeared to have more of an effect on the alloy, silver and gold than on the palladium and copper.

  8. ANALYSIS AND DEVELOPMENT OF COPPER RECYCLING OF DEAD COPPER-CONTAINING CATALYSTS

    OpenAIRE

    O. S. Komarov; I. V. Provorova; V. I. Volosatikov; D. O. Komarov; N. I. Urbanovich

    2009-01-01

    The technology of processing of copper-bearing dead catalysts, which includes leaching and deposition of copper by means of electrolysis and also their application in composition of the mixture for alloy doping is offered.

  9. ANALYSIS AND DEVELOPMENT OF COPPER RECYCLING OF DEAD COPPER-CONTAINING CATALYSTS

    Directory of Open Access Journals (Sweden)

    O. S. Komarov

    2009-01-01

    Full Text Available The technology of processing of copper-bearing dead catalysts, which includes leaching and deposition of copper by means of electrolysis and also their application in composition of the mixture for alloy doping is offered.

  10. Study on electrodeposition of copper-chromium alloy%铜-铬合金电沉积的研究

    Institute of Scientific and Technical Information of China (English)

    滕莹雪; 郭菁

    2013-01-01

    Cu-Cr alloy was prepared by electrodeposition respectively from 4 kinds of electrolytes containing different complexing agents i.e. glycine, ascorbic acid, thiourea, and trisodium citrate. The electrochemical behaviors of different electrolytes were studied by cyclic voltammetry and linear scanning voltammetry. The electrolyte with glycine as complexing agent is most suitable for electrodeposition of Cu-Cr alloy. The Cu-Cr alloy coating obtained therefrom at 10 A/dm2 for 10 min features Cr content up to 18.63%, thickness 25μm, smooth and bright golden yellow surface, strong adhesion, and relative conductivity 68.2%. The conductivity of the Cu-Cr alloy coating basically meets the demand of contact materials.%采用氨基乙酸、抗坏血酸、硫脲和柠檬酸三钠4种配位体系镀液电沉积制备Cu-Cr合金。通过测定循环伏安曲线和线性扫描伏安曲线,研究了不同镀液的电化学行为。氨基乙酸体系镀液最适用于制备Cu-Cr合金,采用该配方制得的Cu-Cr合金中Cr含量高达18.63%,10 A/dm2下电镀10 min所得镀层厚度为25μm,表面平整,呈光亮的金黄色,结合力好,相对导电率达68.2%,导电性基本满足触头材料要求。

  11. Micromechanical Modeling of Grain Boundaries Damage in a Copper Alloy Under Creep; Mikromechanische Modellierung der Korngrenzenschaedigung in einer Kupferlegierung unter Kriechbeanspruchung

    Energy Technology Data Exchange (ETDEWEB)

    Voese, Markus

    2015-07-01

    In order to include the processes on the scale of the grain structure into the description of the creep behaviour of polycrystalline materials, the damage development of a single grain boundary has been initially investigated in the present work. For this purpose, a special simulationmethod has been used, whose resolution procedure based on holomorphic functions. The mechanisms taken into account for the simulations include nucleation, growth by grain boundary diffusion, coalescence and shrinkage until complete sintering of grain boundary cavities. These studies have then been used to develop a simplified cavitation model, which describes the grain boundary damage by two state variables and the time-dependent development by a mechanism-oriented rate formulation. To include the influence of grain boundaries within continuum mechanical considerations of polycrystals, an interface model has been developed, that incorporates both damage according to the simplified cavitation model and grain boundary sliding in dependence of a phenomenological grain boundary viscosity. Furthermore a micromechanical model of a polycrystal has been developed that allows to include a material's grain structure into the simulation of the creep behaviour by means of finite element simulations. Thereby, the deformations of individual grains are expressed by a viscoplastic single crystal model and the grain boundaries are described by the proposed interface model. The grain structure is represented by a finite element model, in which the grain boundaries are modelled by cohesive elements. From the evaluation of experimental creep data, the micromechanical model of a polycrystal has been calibrated for a copper-antimony alloy at a temperature of 823 K. Thereby, the adjustment of the single crystal model has been carried out on the basis of creep rates of pure copper single crystal specimens. The experimental determination of grain boundary sliding and grain boundary porosity for coarse

  12. 海水中泥沙对铜及铜合金腐蚀的影响%Effect of Sea Water Silt on Erosion of Copper and Its Alloy

    Institute of Scientific and Technical Information of China (English)

    金威贤; 谢荫寒; 靳裕康; 朱洪兴

    2001-01-01

    采用室内模拟加速试验装置,对紫铜、青铜、黄铜和白铜等几类铜及铜合金,在不同泥沙含量的海水中的冲蚀情况及腐蚀速率进行了研究。用实体显微镜观察检测表面的腐蚀形貌发现,泥沙的存在明显加速了铜及铜合金在流动海水中的冲刷腐蚀,表面形成点蚀、局部腐蚀和蚀坑,且对不同铜合金的腐蚀影响和规律不一致。%Cailiao Baohu 2001, 34(1), 22~23 (Ch). The erosion rate and morphology of nine kinds copper and copper alloy, including brass and bronze, were investigated in sea water with different silt content through indoor simulated testa The results showed that the existence of silt in flowing sea water could accelerate erosion of copper and copper al- loys, and pitting corrosion was also found on the tested samples The erosion effects was different with the alloys

  13. Toward a Molecular Understanding of the Antibacterial Mechanism of Copper-Bearing Titanium Alloys against Staphylococcus aureus.

    Science.gov (United States)

    Li, Mei; Ma, Zheng; Zhu, Ye; Xia, Hong; Yao, Mengyu; Chu, Xiao; Wang, Xiaolan; Yang, Ke; Yang, Mingying; Zhang, Yu; Mao, Chuanbin

    2016-03-01

    The antibacterial mechanism of the Cu-containing materials has not been fully understood although such understanding is crucial for the sustained clinical use of Cu-containing antibacterial materials such as bone implants. The aim of this study is to investigate the molecular mechanisms by which the Gram-positive Staphylococcus aureus is inactivated through Cu-bearing titanium alloys (Ti6Al4V5Cu). Cu ions released from the alloys are found to contribute to lethal damage of bacteria. They destroy the permeability of the bacterial membranes, resulting in the leakage of reducing sugars and proteins from the cells. They also promote the generation of bacteria-killing reactive oxygen species (ROS). The ROS production is confirmed by several assays including fluorescent staining of intracellular oxidative stress, detection of respiratory chain activity, and measurement of the levels of lipid peroxidation, catalase, and glutathione. Furthermore, the released Cu ions show obvious genetic toxicity by interfering the replication of nuc (species-specific) and 16SrRNA genes, but with no effect on the genome integrity. All of these effects lead to the antibacterial effect of Ti6Al4V5Cu. Collectively, our work reconciles the conflicting antibacterial mechanisms of Cu-bearing metallic materials or nanoparticles reported in the literature and highlights the potential use of Ti6Al4V5Cu alloys in inhibiting bacterial infections.

  14. A Facile Synthesis of Hollow Palladium/Copper Alloy Nanocubes Supported on N-Doped Graphene for Ethanol Electrooxidation Catalyst

    Directory of Open Access Journals (Sweden)

    Zhengyu Bai

    2015-04-01

    Full Text Available In this paper, a catalyst of hollow PdCu alloy nanocubes supported on nitrogen-doped graphene support (H-PdCu/ppy-NG is successfully synthesized using a simple one-pot template-free method. Two other catalyst materials such as solid PdCu alloy particles supported on this same nitrogen-doped graphene support (PdCu/ppy-NG and hollow PdCu alloy nanocubes supported on the reduced graphene oxide support (H-PdCu/RGO are also prepared using the similar synthesis conditions for comparison. It is found that, among these three catalyst materials, H-PdCu/ppy-NG gives the highest electrochemical active area and both the most uniformity and dispersibility of H-PdCu particles. Electrochemical tests show that the H-PdCu/ppy-NG catalyst can give the best electrocatalytic activity and stability towards the ethanol electrooxidation when compared to other two catalysts. Therefore, H-PdCu/ppy-NG should be a promising catalyst candidate for anodic ethanol oxidation in direct ethanol fuel cells.

  15. Spectrophotometric determination of cobalt in copper alloy with picramazochrom%苦氨酸偶氮变色酸光度法测定铜合金中钴

    Institute of Scientific and Technical Information of China (English)

    钟国秀; 黄清华; 唐小红

    2012-01-01

    探讨了显色剂苦氨酸偶氮变色酸与钴的显色反应.pH 10的柠檬酸铵-氨水溶液中,钴与苦氨酸偶氮变色酸反应形成绿色络合物,最大吸收波长为650 nm,表观摩尔吸光系数为2.62×104 L·mol-1·cm-1,钴量在0~2.0 mg/L范围内符合比尔定律.方法通过加入锌粉置换出铜而消除溶液中基体的干扰,用于铜合金中钴的测定,结果与亚硝基R盐光度法一致,相对标准偏差(n=5)小于2%,加标回收率接近100%.%The coloring reaction between coloring reagent picramazochrom and cobalt was studied. In ammonium citrate-ammonia water solution at pH 10,cobalt could react with picramazochrom to form a green complex,which had maximum absorption wavelength at 650 nm. The apparent molar absorptivity was 2. 62 × 104 L · mol-1 · cm-1. Beer's law was obeyed for cobalt in the range of 0-2. 0 mg/L. The interference of matrix in solution could be eliminated by adding zinc to replace copper. The proposed method had been applied to the determination of cobalt in copper alloy,and the results were consistent with those obtained by nitroso R salt spectrophotometry. The relative standard deviation(RSD,n = 5) was less than 2% ,and the recovery was close to 100%.

  16. Thermal processes and solidification kinetcs of evolution of the microstructure of tin-silver-copper solder alloys

    Science.gov (United States)

    Kinyanjui, Robert Kamau

    The adoption of Sn-Ag-Cu (SAC) Pb-free solders will affect electronic manufacturing processes and joint reliability for electronics packages. Since SAC solder has a higher melting temperature than eutectic Pb-Sn solder, higher processing temperatures will be required. The higher processing temperatures can potentially affect the microstructure of these Pb-free solder joints. We investigated the effect of thermal history on the evolution of the microstructure of Sn-xAg-yCu (0 ≤ x ≤ 4.0; 0 ≤ y ≤ 1.4, concentrations are in weight percent) solder alloys. This family of alloys falls within a class of Sn-rich Sn-Ag-Cu (SAC) alloys recommended by various international consortia for implementation in electronic manufacturing industry to replace the conventional PbSn solders. This investigation was divided into three parts: part one was an investigation of an optimum SAC alloy composition devoid of large (in length scales) intermetallic compounds (IMCs) after thermal treatment. The presence of large IMCs, with different mechanical characteristics from the bulk Sn, may compromise the mechanical integrity of the Pb-free solder interconnect. In part two of this study, we examined the growth morphology of Ag3Sn, Cu6Sn 5, and betaSn in the SAC alloys. In part three, an examination of the effect of sample size on undercooling was carried out. A Sn-Ag-Cu alloy of the composition: 96.5Sn-2.6Ag-0.9Cu (in weight percent) was found to exhibit no growth of large Ag3Sn, Cu6Sn 5 intermetallic compounds at cooling rates from 0.1 to 1°C/s. However, growth of large betaSn dendrites was observed. The crystallized Sn-Ag-Cu balls were found to contain only a few Sn grains. Also the solidification temperature of the 96.5Sn-2.6Ag-yCu (0 ≤ y ≤ 1.4) solder system was found to increase with Cu content. Further, this investigation established a strong correlation between Sn-Ag-Cu sample size and degree of undercooling for these Pb-free solder alloys. The degree of undercooling of Sn in

  17. Influence of time of annealing on anneal hardening effect of a cast CuZn alloy

    OpenAIRE

    Nestorović Svetlana; Ivanić Lj.; Marković Desimir

    2003-01-01

    Investigated cast copper alloy containing 8at%Zn of a solute. For comparison parallel specimens made from cast pure copper. Copper and copper alloy were subjected to cold rolling with different a final reduction of 30,50 and 70%. The cold rolled copper and copper alloy samples were isochronally and isothermally annealed up to recrystallization temperature. After that the values of hardness, strength and electrical conductivity were measured and X-ray analysis was performed. These investigatio...

  18. Segmentation of copper alloys processed by equal-channel angular pressing%等径角挤压铜合金的分节断裂

    Institute of Scientific and Technical Information of China (English)

    Omid NEJADSEYFI; Ali SHOKUHFAR; Vahid MOODI

    2015-01-01

    本研究提供了等径角挤压不同铜合金的局部剪切、坯锭开裂和分节断裂的实验依据。结果表明,尽管很多参数影响局部剪切,但是合金的硬度和分节断裂与其有着直接的关系,而硬度与合金的成分和相组成有关。在室温下,α-黄铜可以成功进行等径角挤压,而α/β黄铜甚至在350°C下都不能成功进行等径角挤压。利用DEFORMTM 软件模拟了开裂和分节断裂,研究不同参数对分节断裂的影响。结果表明,摩擦力和加工速率对获得完美坯锭影响很小,而利用背压可以很好地减小局部剪切、坯锭裂纹、分节断裂和破坏。利用背压能减小流动局部化,当背压由0提高到600 MPa时,可以提高材料流动均匀性并且使坯锭的均匀性提高36.1%。%This research provides experimental evidence for localized shear, billet cracking, and segmentation during the processing of various copper alloys. The results demonstrate that although many parameters affect the shear localization, there is a direct relation between segmentation and alloy strength (hardness) that is related to the alloying elements and constitutive phases. For instance, alpha brass is successfully processed by ECAP at room temperature, but alpha/beta brasses fail even at a temperature of 350 °C. Finite element simulation of cracking and segmentation was performed using DEFORMTM to investigate the influence of different parameters on segmentation. The results confirm that friction and processing speed have narrow effects on attaining a perfect billet. However, employing back pressure could be reliably used to diminish shear localization, billet cracking, segmentation, and damage. Moreover, diminishing the flow localization using back pressure leads to uniform material flow and the billet homogeneity increases by 36.1%, when back pressure increases from 0 to 600 MPa.

  19. 引线框架用铜合金材料弯曲回弹有限元分析%Numerical Simulation of Springback of Copper Alloy for Lead Frame

    Institute of Scientific and Technical Information of China (English)

    张国军; 苏娟华

    2011-01-01

    The research and development status of materials for lead frame abroad and in China was described, then the springback amount of copper alloy was discussed. The bending model was built by 3-D modeling software, which was simulated and calculated in simulation software, then the necessary post-processing was made, finally, according to the data, the bending springback amounts of the four kinds of copper alloy materials were calculated. The conclusion is that,from larger to little, the order of springback amounts of the four kinds of materials for lead frame is CuCrZrMg alloy,CuNiSi alloy, CuFeP alloy, CuCrSnZn alloy, it is verified that the bending properties of the four kinds of materials for lead frame increase in turn, the smaller the minimum bending radius of copper alloy for lead frame, the smaller the springback amount.%阐述了引线框架材料在国内外的研究与发展现状,着重分析了铜合金材料的弯曲回弹量.利用三维软件建立弯曲模型,然后在模拟软件中进行模拟,进行计算和必要的后处理后,最后根据有关数据计算出四种铜合金材料的弯曲回弹量的大小,得出四种铜合金材料CuFeP、CuCrSnZn、CuCrZrMg、CuNiSi的回弹量由大到小顺序排列为:CuCrZrMg、CuNiSi、CuFeP、CuCrSnZn,表明四种引线框架铜合金材料的弯曲性能依次增大;铜合金框架材料的最小弯曲半径越小,其回弹量越小.

  20. High strength alloys

    Science.gov (United States)

    Maziasz, Phillip James; Shingledecker, John Paul; Santella, Michael Leonard; Schneibel, Joachim Hugo; Sikka, Vinod Kumar; Vinegar, Harold J.; John, Randy Carl; Kim, Dong Sub

    2012-06-05

    High strength metal alloys are described herein. At least one composition of a metal alloy includes chromium, nickel, copper, manganese, silicon, niobium, tungsten and iron. System, methods, and heaters that include the high strength metal alloys are described herein. At least one heater system may include a canister at least partially made from material containing at least one of the metal alloys. At least one system for heating a subterranean formation may include a tublar that is at least partially made from a material containing at least one of the metal alloys.

  1. High strength alloys

    Energy Technology Data Exchange (ETDEWEB)

    Maziasz, Phillip James [Oak Ridge, TN; Shingledecker, John Paul [Knoxville, TN; Santella, Michael Leonard [Knoxville, TN; Schneibel, Joachim Hugo [Knoxville, TN; Sikka, Vinod Kumar [Oak Ridge, TN; Vinegar, Harold J [Bellaire, TX; John, Randy Carl [Houston, TX; Kim, Dong Sub [Sugar Land, TX

    2010-08-31

    High strength metal alloys are described herein. At least one composition of a metal alloy includes chromium, nickel, copper, manganese, silicon, niobium, tungsten and iron. System, methods, and heaters that include the high strength metal alloys are described herein. At least one heater system may include a canister at least partially made from material containing at least one of the metal alloys. At least one system for heating a subterranean formation may include a tubular that is at least partially made from a material containing at least one of the metal alloys.

  2. Selective dissolution in copper-tin alloys: Formation of corrosion- resistant patina on ancient Chinese bronze mirrors

    Energy Technology Data Exchange (ETDEWEB)

    Taube, M. [State Univ. of New York, Stony Brook, NY (United States). Dept. of Materials Science and Engineering]|[Brookhaven National Lab., Upton, NY (United States); Davenport, A.J. [Brookhaven National Lab., Upton, NY (United States); King, A.H. [State Univ. of New York, Stony Brook, NY (United States). Dept. of Materials Science and Engineering; Chase, T. III [Smithsonian Institution, Washington, D.C. (United States) Freer Gallery of Art, Dept. of Conservation and Scientific Research

    1996-07-01

    Many ancient Chinese bronze mirrors have survived with a patina that leaves the delicate relief surface decorations intact. The microstructure of these ancient mirrors is two-phase and consists of acicular {alpha}-phase (Cu-rich) regions encased in a {delta}-phase (Sn-rich) matrix. At the surface, there is evidence of selective dissolution of the ct phase; the cc-phase regions are replaced pseudomorphically by a mineral product with the {delta} phase remaining metallic. Electrochemical polarization has been used to drive the copper dealloying process in modem, cast bronze. Synchrotron x-ray diffraction was employed to compare the ancient samples with those that were prepared potentiostatically. Poorly crystallized tin oxide (SnO{sub 2}) was found in the {alpha} replacement products of both sample types. The corrosion-resistance of the potentiostatically-treated bronze samples was tested by atmospheric exposure. Comparison with exposed, untreated samples indicated that the treatment was protective.

  3. An Assessment of the Residual Stresses in Low Pressure Plasma Sprayed Coatings on an Advanced Copper Alloy

    Science.gov (United States)

    Raj, S. V.; Ghosn, L. J.; Agarwal, A.; Lachtrupp, T. P.

    2002-01-01

    Modeling studies were conducted on low pressure plasma sprayed (LPPS) NiAl top coat applied to an advanced Cu-8(at.%)Cr-4%Nb alloy (GRCop-84) substrate using Ni as a bond coat. A thermal analysis suggested that the NiAl and Ni top and bond coats, respectively, would provide adequate thermal protection to the GRCop-84 substrate in a rocket engine operating under high heat flux conditions. Residual stress measurements were conducted at different depths from the free surface on coated and uncoated GRCop-84 specimens by x-ray diffraction. These data are compared with theoretically estimated values assessed by a finite element analysis simulating the development of these stresses as the coated substrate cools down from the plasma spraying temperature to room temperature.

  4. PdCu alloy nanoparticle-decorated copper nanotubes as enhanced electrocatalysts: DFT prediction validated by experiment

    Science.gov (United States)

    Wu, Dengfeng; Xu, Haoxiang; Cao, Dapeng; Fisher, Adrian; Gao, Yi; Cheng, Daojian

    2016-12-01

    In order to combine the advantages of both 0D and 1D nanostructured materials into a single catalyst, density functional theory (DFT) calculations have been used to study the PdCu alloy NP-decorated Cu nanotubes (PdCu@CuNTs). These present a significant improvement of the electrocatalytic activity of formic acid oxidation (FAO). Motivated by our theoretical work, we adopted the seed-mediated growth method to successfully synthesize the nanostructured PdCu@CuNTs. The new catalysts triple the catalytic activity for FAO, compared with commercial Pd/C. In summary, our work provides a new strategy for the DFT prediction and experimental synthesis of novel metal NP-decorated 1D nanostructures as electrocatalysts for fuel cells.

  5. 40 CFR 468.20 - Applicability; description of the beryllium copper forming subcategory.

    Science.gov (United States)

    2010-07-01

    ... of pollutants into publicly owned treatment works from the forming of beryllium copper alloys. ... beryllium copper forming subcategory. 468.20 Section 468.20 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS COPPER FORMING POINT SOURCE...

  6. Formation of reacted interfacial zone and improvement of bonding strength in aluminum alloy clad stainless steel and aluminum alloy clad copper plateusing explosive welding technique. Al gokin no stainless ko oyobi do eno bakuhatsu assetsu ni okeru kaimen hannoso no keisei to setsugo kyodo

    Energy Technology Data Exchange (ETDEWEB)

    Hokamoto, K.; Fujita, M. (Kumamoto University, Kumamoto (Japan). Faculty of Engineering); Izuma, T. (Asahi Chemical Industry Co. Ltd., Tokyo (Japan))

    1993-10-31

    Explosive welding experiments using intermediate materials have been performed on combinations of aluminum alloy with stainless steel, and aluminum alloy with copper that are difficult of explosive welding with an ordinary method. The experiments have investigated interfacial reaction layers and bonding strength. The drive plates have used four kinds of aluminum alloy plates with a thickness of 4 mm and a base material of stainless steel (SUS 304) or copper having a thickness of 9 mm. Investigation has been given on how the interfacial structure and the bonding strength change as a result of using intermediate materials of the similar kind with the base material. The composition in the generated reaction layers has higher aluminum concentration than that has been predicted. This is because more aluminum component has been dissolved because of transformation having converged on the side of the aluminum alloy with smaller transformation resistance. Use of the intermediate materials can reduce energy of collision given on the interface, thus controlling the formation of reactive layers on the interface. This has improved the bonding strength largely, leading to a possibility of fabricating clad materials that have good interface properties. 10 refs., 9 figs., 3 tabs.

  7. High temperature characteristics and solidification microstructures of dental metallic materials part I: silver-palladium-copper-gold alloy.

    Science.gov (United States)

    Nagasawa, Sakae; Yoshida, Takamitsu; Mizoguchi, Toshihide; Terashima, Nobuyoshi; Ito, Michio; Platt, Jeffrey A; Oshida, Yoshiki

    2003-09-01

    Ag-Pd-Cu-Au alloy was subjected to a Thermo-Mechanical Analyzer to investigate high temperature properties up to its liquidus temperature. Microstructural examination and elemental analysis with EPMA were also conducted in the solid/liquid mixture region. The following conclusions were obtained. (1) The solidus temperature was 838.3 +/- 2.52 degrees C and 957.7 +/- 1.53 degrees C for the liquidus point. (2) Thermal expansion coefficients were 1.39 +/- 0.08% at the solidus, 2.338 +/- 0.13% at the liquidus, and the melting expansion coefficient was 0.932 +/- 0.058%. (3) The expansion during melting was controlled by a small amount of pressure such as 1/100 of the air pressure, therefore the fit accuracy of castings is suggested not to be influenced by the solidification shrinkage. (4) Although the softening heat treatment and casting exhibited an influence on thermal expansion behavior, casting temperature in addition to post-casting plastic deformation did not show an effect on the thermal expansion. (5) The yield strength at 750 degrees C was reduced down to about 1/400 of that at room temperature, and the modulus of elasticity was about 1/100 of the room temperature value.

  8. Effects of additives on cyanide-flee white copper-tin alloy electroplating%添加剂对无氰电镀白铜锡工艺的影响

    Institute of Scientific and Technical Information of China (English)

    赵洋; 曾振欧; 谢金平; 范小玲; 高帅

    2013-01-01

    研究了多种胺类高分子添加剂对焦磷酸盐体系无氰电镀白铜锡工艺及镀层微观形貌的影响.基础镀液的组成为:K4P2O7·3H2O 200~250 g/L,Cu2P2O7·3H2O 16~19 g/L,Sn2P2O712~15 g/L,pH 8.5~8.7.以IEP(水性阳离子季铵盐)、DPTHE(多胺高分子聚合物)和JZ-1(胺类化合物)作添加剂时,均可在较宽的电流密度范围内得到白亮铜锡合金镀层.以IEP作添加剂时,电镀白铜锡的电流密度上限最高为3.70 A/dm2;以DPTHE作添加剂时,电镀白铜锡合金镀层的电流密度下限最低为0.09 A/dm2,可抑制低电流密度区形成金黄色低锡铜锡合金.以IEP和DPTHE作添加剂时,均可使白铜锡合金镀层持续增厚,电镀50 min可得到白亮、无裂纹的镀层,且IEP具有更明显的整平和细化晶粒作用.%The effects of different kinds of additives on the plating process and surface morphology of white copper-tin alloy coatings were studied in a cyanide-free pyrophosphate plating bath. The basic bath composition is as follows: K4P2O7?3H2O 200-250 g/L, Cu2P2O?3H2O 16-19 g/L, Sn2P2O7 12-15 g/L, and pH 8.5-8.7. Bright white copper-tin alloy coatings can be obtained over wide range of current density when using IEP (a water-soluble quaternary ammonium salt cation), DPTHE (a high-molecular-weight polyamine) and JZ-1 (an amine compound) as the additive. The upper limit of current density for white copper-tin alloy plating is up to 3.70 A/dm2 while using IEP. The lower limit of current density for white copper-tin alloy plating is 0.09 A/dm2 when using DPTHE. DPTHE can inhibit the forming of golden low-tin copper-tin alloy at low current density area. The white copper-tin alloy coatings can be thickened continually when using IEP and DPTHE, and are still brightly white and crack-free after plating for 50 min. IEP has more obvious leveling and grain-refining effects.

  9. 环境友好型替代铜及其合金基体镀金的工艺研究%Research of Environment Friendly Electrical Contact Protective lubricant Instead of Gold Plated Covering on Copper and Its Alloy

    Institute of Scientific and Technical Information of China (English)

    贾成林; 张宝根; 段练

    2014-01-01

    通过长期研究试验,研制出代替镀金用的铜及其合金表面的保护材料SP-2085C和LP-1087C电接触润滑保护剂,经过反复试验,大批量生产实践证明:SP-2085C和LP-1087C电接触润滑保护剂不仅能替代银、铜、镍等金属及其合金上的镀金层,而且保护后的银、铜、镍表面耐蚀能力优于替代前的镀金表面,且电气性能和微波传输性能没有影响。在滑动摩擦的接触表面上,还解决了金、银或铜滑动摩擦的接触表面上的磨损问题。%Through long-term research and test, the electrical contact protective lubricant SP-2085C and LP-1087C instead of gold plated covering on copper and its alloy have been manufactured. after repeated testing, mass production practice has proved that SP-2085C and LP-1087C electrical contact protective lubricant can not only replacing the gold-plating on the silver, copper, nickel and their alloys, but also have no influence on the electricity function and microwave transmission, and with using the protective agent, the corrosion resistance of silver, copper and nickel's surface is better than the gold plated covering before. In addition, the attrition issues of the sliding friction of gold or copper's contact surface have also been solved.

  10. Jiangrun Copper Limited Company Set its Eyes on the Leading Position of Copper Processing Industry in China

    Institute of Scientific and Technical Information of China (English)

    2013-01-01

    <正>Jiangrun Copper Limited Company’s total investment volume for projects of stranded copper wire with high strength and high conductivity as well as high-performance copper and copper alloy wire are 500 million yuan and 360 million yuan, respectively. The company plans to introduce 85 units (sets) of high-end

  11. Nickel, copper and cobalt coalescence in copper cliff converter slag

    Directory of Open Access Journals (Sweden)

    Wolf A.

    2016-01-01

    Full Text Available The aim of this investigation is to assess the effect of various additives on coalescence of nickel, copper and cobalt from slags generated during nickel extraction. The analyzed fluxes were silica and lime while examined reductants were pig iron, ferrosilicon and copper-silicon compound. Slag was settled at the different holding temperatures for various times in conditions that simulated the industrial environment. The newly formed matte and slag were characterized by their chemical composition and morphology. Silica flux generated higher partition coefficients for nickel and copper than the addition of lime. Additives used as reducing agents had higher valuable metal recovery rates and corresponding partition coefficients than fluxes. Microstructural studies showed that slag formed after adding reductants consisted of primarily fayalite, with some minute traces of magnetite as the secondary phase. Addition of 5 wt% of pig iron, ferrosilicon and copper-silicon alloys favored the formation of a metallized matte which increased Cu, Ni and Co recoveries. Addition of copper-silicon alloys with low silicon content was efficient in copper recovery but coalescence of the other metals was low. Slag treated with the ferrosilicon facilitated the highest cobalt recovery while copper-silicon alloys with silicon content above 10 wt% resulted in high coalescence of nickel and copper, 87 % and 72 % respectively.

  12. Shandong Hengyuan 200,000 tonnes of High-Precision Copper Product Project is Making Smooth Progress

    Institute of Scientific and Technical Information of China (English)

    2013-01-01

    <正>Shandong Hengyuan Copper Co., Ltd is an emerging copper product processing enterprise in China, the company plans to invest 1 billion yuan to construct 200,000 t/a high precision copper product, which includes: 20,000 tones of precision copper tube and copper alloy tube, 10,000 tonnes of railway electrification copper

  13. Influence of the control atmosphere and milling time on the morphology and microstructure of pure copper and copper-2.5 % lithium powders produced by mechanical alloying; Influencia de la atmosfera de control y tiempo de molienda sobre la morfologia y microestructura de polvos de cobre puro y cobre-2,5% litio producidos por aleado mecanio

    Energy Technology Data Exchange (ETDEWEB)

    Rojas, P. A.; Alvarez, M. P.; Penaloza, A.; Zuniga, A.; Ordonez, S.

    2009-07-01

    In the present work was investigated the effect of two milling parameters, atmosphere and milling time, on the morphology and microstructure of pure copper powder and a mixture of copper-2,5 wt. % lithium. The mechanical alloying was performed in a SPEX 8000D mill, using steel containers and balls. The two control atmospheres were argon and nitrogen and the milling time was varied from 3 up to 30 hours. The microstructural changes and the phases after milling were analyzed using scanning microscopy and X ray diffraction, whereas the amount of iron was measured by atomic absorption spectroscopy and the amount of oxygen by infrared spectroscopy. The results show the effect of the milling parameters studied on the microstructure as well as on the chemical composition of the samples. (Author) 22 refs.

  14. Synergistic extraction and spectrophotometric determination of copper(II) using 1-(2',4'-dinitro aminophenyl)-4,4,6-trimethyl-1,4-dihydropyrimidine-2-thiol: Analysis of alloys, pharmaceuticals and biological samples

    Science.gov (United States)

    Kamble, Ganesh S.; Kolekar, Sanjay S.; Anuse, Mansing A.

    2011-05-01

    A simple and selective spectrophotometric method was developed for the determination of copper(II) with 1-(2',4'-dinitro aminophenyl)-4,4,6-trimethyl-1,4-dihydropyrimidine-2-thiol [2',4'-dinitro APTPT] as a chromogenic reagent. The procedure was based on the synergistic extraction of copper(II) with 2',4'-dinitro APTPT in the presence of 0.5 mol L -1 pyridine to give green colored ternary complex of a molar ratio 1:2:2 (M:L:Py) in the pH range 8.7-10.5. It exhibits a maximum absorption of colored complex at 445 nm and 645 nm in chloroform against the reagent blank. Beer's law was followed in the concentration range 10-80 μg mL -1 of copper(II) and optimum range of 20-70 μg mL -1 the metal as evaluated from Ringbom's plot. The molar absorptivity and Sandell's sensitivity of copper(II)-2',4'-dinitro APTPT-pyridine complex in chloroform are 0.87 × 10 3 L mol -1 cm -1 and 0.072 μg cm -2, respectively. The interfering effects of various cations and anions were also studied, and use of suitable masking agents enhances the selectivity of the method. The proposed method is rapid, reproducible and successfully applied for the determination of copper(II) in binary and synthetic mixtures, alloys, pharmaceutical formulations, environmental and fertilizer samples. Comparison of the results with those obtained using an atomic absorption spectrophotometer also tested the validity of the method.

  15. 光度法快速测定铜合金中微量铝%RAPID DETERMINATION OF TRACE ALUMINUM IN COPPER ALLOYS

    Institute of Scientific and Technical Information of China (English)

    钟国秀; 黄清华

    2011-01-01

    In hexamethylenetetramine medium pH 4 - 6, aluminum reacts with chlorophosphonazo I to form a blue - violet complex which exhibits an absorption maximum at 600 nm with a apparent molar absorptivity of 3.9 x 104 L/( mol· cm). The absorption spectra, acidity, reagent dosage, interfering ions and other factors were discussed, and the experimental conditions were optimized. Beer's law was obeyed in the range of 0 -25 μg/(50 mL) for aluminum with EDTA - Mn as a masking agent. Coexisting ele-merits didn't interfere with the determination, the method had good selectivity. The proposed method can be applied to determine aluminum directly in copper alloy, and the RSD was less than 2% (n =5). The determination results were corresponded with the certified values.%在pH 4-6的六次甲基四胺介质中,显色剂偶氮氯膦I与铝形成稳定的蓝紫色络合物.讨论了吸收光谱、酸度、试剂用量、干扰离子等因素对实验的影响,确定了反应的最佳条件.铝含量在0-25μg/(50 mL )范围内符合比耳定律,铝络合物在600 nm处有最大吸收,表观摩尔吸光系数为3.9×104L/(mol·cm).用EDTA-Mn作掩蔽剂.共存元素均不干扰测定,方法有良好的选择性.此法可不经过分离直接测定铜合金中的微量铝,测定结果的相对标准偏差小于2%(n=5),测定结果与认定值相符.

  16. 锌镍合金用于载体支撑超薄铜箔剥离层的研究%Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil

    Institute of Scientific and Technical Information of China (English)

    邓庚凤; 黄崛起; 赖远腾; 徐鹏

    2013-01-01

    High-zinc and low-nickel alloy coating used for stripping layer on 35 μm ultra-thin copper foil as carrier foil was electrodeposited. Ultra-thin copper foil was electrodeposited in pyrophosphate solution, and then ultra-thin copper carrier foil was prepared. The effects of ratio of zinc sulfate and nickel sulfate, dosage of complexing agent of potassium pyrophosphate trihydrate, dosage of additives of gelatin on the properties of stripping layer were investigated. The results show that zinc and nickel can be co-electroplated under the conditions including zinc sulfate of 12 g/L, nickel sulfate of 6 g/L, potassium pyrophosphate trihydrate of 0. 5 mol/L, gelatin of 0. 2 g/L and sodium dodecyl benzene sulfonate 0. 2~0. 3 g/L. Peelable strength between ultra-thin copper foil and carrier copper foil is stable and can reach 4. 7 N/cm when zinc-nickel alloy is used as a stripping layer.%在35μm载体铜箔上电镀一层高锌低镍合金镀层作为剥离层,再在焦磷酸盐液中电沉积超薄铜箔层,最后制得载体支撑超薄铜箔.考察了镀液硫酸锌和硫酸镍的配比、焦磷酸钾络合剂及明胶添加剂等对剥离层性能的影响.结果表明,在剥离层镀液中Zn2+∶Ni2+=4∶1,焦磷酸钾0.5 mol/L,明胶0.2g/L,十二烷基苯磺酸钠0.2~0.3 g/L条件下,锌和镍能够共同沉积,该镀层作为剥离层后剥离效果良好,载体箔和超薄铜箔间的剥离强度较稳定,可以达到4.7 N/cm.

  17. Reactivity test between beryllium and copper

    Energy Technology Data Exchange (ETDEWEB)

    Kawamura, H. [Japan Atomic Energy Research Institute, Ibaraki-ken (Japan); Kato, M. [NGK Insulators, Ltd., Aichi-ken (Japan)

    1995-09-01

    Beryllium has been expected for using as plasma facing material on ITER. And, copper alloy has been proposed as heat sink material behind plasma facing components. Therefore, both materials must be joined. However, the elementary process of reaction between beryllium and copper alloy does not clear in detail. For example, other authors reported that beryllium reacted with copper at high temperature, but it was not obvious about the generation of reaction products and increasing of the reaction layer. In the present work, from this point, for clarifying the elementary process of reaction between beryllium and copper, the out-of-pile compatibility tests were conducted with diffusion couples of beryllium and copper which were inserted in the capsule filled with high purity helium gas (6N). Annealing temperatures were 300, 400, 500, 600 and 700{degrees}C, and annealing periods were 100, 300 and 1000h. Beryllium specimens were hot pressed beryllium, and copper specimens were OFC (Oxygen Free Copper).

  18. Standard Specification for Low-Carbon Nickel-Chromium-Molybdenum, Low-Carbon Nickel-Chromium-Molybdenum-Copper, Low-Carbon Nickel-Chromium-Molybdenum-Tantalum, Low-Carbon Nickel-Chromium-Molybdenum-Tungsten, and Low-Carbon Nickel-Molybdenum-Chromium Alloy Plate, Sheet, and Strip

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2015-01-01

    Standard Specification for Low-Carbon Nickel-Chromium-Molybdenum, Low-Carbon Nickel-Chromium-Molybdenum-Copper, Low-Carbon Nickel-Chromium-Molybdenum-Tantalum, Low-Carbon Nickel-Chromium-Molybdenum-Tungsten, and Low-Carbon Nickel-Molybdenum-Chromium Alloy Plate, Sheet, and Strip

  19. Standard Specification for Low-Carbon Nickel-Chromium-Molybdenum, Low-Carbon Nickel-Molybdenum-Chromium, Low-Carbon Nickel-Molybdenum-Chromium-Tantalum, Low-Carbon Nickel-Chromium-Molybdenum-Copper, and Low-Carbon Nickel-Chromium-Molybdenum-Tungsten Alloy Rod

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2015-01-01

    Standard Specification for Low-Carbon Nickel-Chromium-Molybdenum, Low-Carbon Nickel-Molybdenum-Chromium, Low-Carbon Nickel-Molybdenum-Chromium-Tantalum, Low-Carbon Nickel-Chromium-Molybdenum-Copper, and Low-Carbon Nickel-Chromium-Molybdenum-Tungsten Alloy Rod

  20. Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

    DEFF Research Database (Denmark)

    Elguindi, J; Moffitt, S; Hasman, Henrik

    2010-01-01

    The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount...... of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing...... of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper...

  1. Biocompatibility of dental alloys

    Energy Technology Data Exchange (ETDEWEB)

    Braemer, W. [Heraeus Kulzer GmbH and Co. KG, Hanau (Germany)

    2001-10-01

    Modern dental alloys have been used for 50 years to produce prosthetic dental restorations. Generally, the crowns and frames of a prosthesis are prepared in dental alloys, and then veneered by feldspar ceramics or composites. In use, the alloys are exposed to the corrosive influence of saliva and bacteria. Metallic dental materials can be classified as precious and non-precious alloys. Precious alloys consist of gold, platinum, and small amounts of non-precious components such as copper, tin, or zinc. The non-precious alloys are based on either nickel or cobalt, alloyed with chrome, molybdenum, manganese, etc. Titanium is used as Grade 2 quality for dental purposes. As well as the dental casting alloys, high purity electroplated gold (99.8 wt.-%) is used in dental technology. This review discusses the corrosion behavior of metallic dental materials with saliva in ''in vitro'' tests and the influence of alloy components on bacteria (Lactobacillus casei and Streptococcus mutans). The test results show that alloys with high gold content, cobalt-based alloys, titanium, and electroplated gold are suitable for use as dental materials. (orig.)

  2. Simultaneous determination of trace-levels of alloying zinc and copper by semi-mercury-free potentiometric stripping analysis with chemometric data treatment

    DEFF Research Database (Denmark)

    Andersen, Jens Enevold Thaulov; Hansen, Elo Harald

    1998-01-01

    Assays of copper and zinc in brass samples were performed by Semi-Mercury Free Potentiometric Stripping Analysis (S-MF PSA) using a thin-film mercury covered glassy-carbon working electrode and dissolved oxygen as oxidizing agent during the stripping step. The stripping peak transients were...... resolved by chemometrics which enabled simultaneous determination of both the copper and the zinc concentrations, thereby eliminating the conventional necessary pretreatment of the sample solution, such as initial addition of Ga(III) or solvent extraction of copper. The brass samples were diluted...

  3. The Effect of Aging Treatment on the Microstructure and Properties of Copper-Precipitation Strengthened HSLA (High Strength Low Alloy) Steel

    Science.gov (United States)

    1988-12-01

    precipitation of copper from alpha iron and concluded that the copper precipitates as FCC E-phase without any intermediate compounds being formed. Hornbogen...pre- cipitates in an alpha Iron matrix. Their research confirmed the 4 2 A ST.S 9 00- 0 -1400 6 W COPOOr Content Figure 2. Iron-Rich Portion of Fe-Cu...64-67, August 1984. 6. Hornbogen, E., and Glenn, R. C., "A Metallurgical Study of Precip- itation of Copper from Alpha Iron ," Transactions of the

  4. Environment-friendly Chemical Polishing Technology of BFe10-1-1 Copper Alloy%绿色环保型BFe10-1-1铁白铜化学抛光工艺研究

    Institute of Scientific and Technical Information of China (English)

    黄俊学; 张晖; 杨锦瑜

    2011-01-01

    Taking H2O2 as main oxidant, the process of environment-friendly chemical polishing of Bfel 0-1-1 copper alloy was investigated. The influence of type of brightener, type of corrosion inhibitor, type of stabilizer of hydrogen peroxide, the polishing solution composition and polishing condition including polishing temperature and polishing time on the surface quality of the polished BFel0-1-1 copper alloy was discussed, and processing condition was optimized. The optimum composition of the chemical polishing solution for the BFelO-1-1 copper alloy was recommended to be composed of 350 mL/L hydrogen peroxide (30%) , 50 mL/L sulfuric acid, 17--20 mL/L ethyl alcohol, 1 mL/L OP-10, and 1 g/L 1,2,3-Benzotriazole, while the optimized polishing condition was suggested as temperature about 50 ℃ and polishing time 3~5 min.%研究以H2O2为主要氧化剂的化学抛光液对BFe10-1-1铁白铜进行表面化学抛光,考察了光亮剂、缓蚀剂、H2O2稳定剂的种类,化学抛光液各组分的含量,抛光温度以及抛光时间对铜合金抛光效果的影响.优化出抛光液组成及抛光工艺条件:质量分数为30%的H2O2 350 mL/L,浓H2SO450 mL/L,无水乙醇17~20mL/L,OP-10 1 mL/L,苯骈三氮唑(BTA)1 g/L,水余量;在50℃下抛光3~5 min.

  5. BFe30-1-1铜合金的化学抛光工艺研究%Chemical polishing technology of BFe30-1-1 copper alloy

    Institute of Scientific and Technical Information of China (English)

    张晖

    2011-01-01

    The process of chemical polishing of BFe30-l-l copper alloy with nitric acid was investigated. The influence of type of brightener, type of corrosion inhibitor, the polishing solution composition and polishing condition including polishing temperature and polishing time on the surface quality of the polished BFe30-l-l copper alloy was discussed, and processing condition was optimized. The optimum composition of the chemical polishing solution for the BFe30-l -1 copper alloy was 350 ~ 450 mL/L sulfuric acid, 3 ~5 mL/L hydrochloric acid,30 ~40 mL/L nitric acid,2 ~4 mL/L polyoxyethylene octylphenol ether, and 3 g/L benzotriazole, while the optimized polishing conditions were temperature 30℃ and polishing time 3 ~ 5 min.%研究以含硝酸的化学抛光液对BFe30-1-1铜合金进行化学抛光的方法,考察光亮剂的种类、缓蚀剂的种类、化学抛光液各组分的含量、抛光温度以及抛光时间对铜合金抛光效果的影响.结果表明,在实验范围内优化工艺条件为:350~450mL/L H2SO4,3~5 mL/L HCl,30 ~40 mL/L HNO3,2~4 mL/L辛基酚聚氧乙烯醚(OP-10),3 g/L苯骈三氮唑(BTA),水余量,抛光温度30℃左右,抛光时间3~5 min.在此工艺条件下对BFe30-1-1铜合金进行化学抛光,可以获得较好的抛光效果.

  6. JNMC No.1 for White Copper Tube Production Bases in China

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    <正>Recently,JNMC’s 60,000-ton copper-nickel alloy energy-saving transformation project was completed and put into production.With its main products consisting of copper alloy tube,rods,wires and copper processed products

  7. Effect of iron-intermetallics and porosity on tensile and impact properties of aluminum-silicon-copper and aluminum-silicon-magnesium cast alloys

    Science.gov (United States)

    Ma, Zheyuan

    Aluminum-silicon (Al-Si) alloys are an important class of materials that constitute the majority of aluminum cast parts produced, due to their superior properties and excellent casting characteristics. Within this family of alloys, Al-Si-Cu and Al-Si-Mg cast alloys are frequently employed in automotive applications. The commercially popular 319 and 356 alloys, representing these two alloy systems, were selected for study in the present work, with the aim of investigating the effect of iron intermetallics and porosity on the alloy performance. This was carried out through a study of the tensile and impact properties, these being two of the important mechanical properties used in design calculations. Iron, through the precipitation of second phase intermetallic constituents, in particular the platelike beta-Al5FeSi phase, is harmful to the alloy properties. Likewise, gas- or shrinkage porosity in castings is also detrimental to the mechanical properties. By determining the optimum alloying, melt processing and solidification parameters (viz., Fe content, Sr modification and cooling rate) required to minimize the harmful effects of porosity and iron intermetallics, and studying their role on the fracture behavior, the fracture mechanism in the alloys could be determined. Castings were prepared from both industrial and experimental 319.2, B319.2 and A356.2 alloy melts, containing Fe levels of 0.2--1.0 wt%. Sr-modified (˜200 ppm) melts were also prepared for each alloy Fe level. The end-chilled refractory mold used provided directional solidification and a range of cooling rates (or dendrite arm spacings, DAS) within the same casting. Tensile and impact test samples machined from specimen blanks sectioned from the castings at various heights above the chill end provided DASs of 23--85mum. All samples were T6-heat-treated before testing. Tests were carried out employing Instron Universal and Instrumented Charpy testing machines. Optical microscopy, image analysis, SEM

  8. INVESTIGATION OF MAGNESIUM ALLOYS MACHINABILITY

    Directory of Open Access Journals (Sweden)

    Berat Barıs BULDUM

    2013-01-01

    Full Text Available Magnesium is the lightest structural metal. Magnesium alloys have a hexagonal lattice structure, which affects the fundamental properties of these alloys. Plastic deformation of the hexagonal lattice is more complicated than in cubic latticed metals like aluminum, copper and steel. Magnesium alloy developments have traditionally been driven by industry requirements for lightweight materials to operate under increasingly demanding conditions. Magnesium alloys have always been attractive to designers due to their low density, only two thirds that of aluminium and its alloys [1]. The element and its alloys take a big part of modern industry needs. Especially nowadays magnesium alloys are used in automotive and mechanical (trains and wagons manufacture, because of its lightness and other features. Magnesium and magnesium alloys are the easiest of all metals to machine, allowing machining operations at extremely high speed. All standard machining operations such as turning, drilling, milling, are commonly performed on magnesium parts.

  9. Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

    Directory of Open Access Journals (Sweden)

    Yoji Miyajima

    2014-01-01

    Full Text Available Three types of clad sheets, Cu/Al, Cu/AA5052, and Cu/AA5083, were produced by cold roll bonding with the rolling reduction of 50% and 75%. Tensile shear tests which give tensile shear strength were performed in order to assess the bond strength. Scanning electron microscopy was performed on the fractured interface produced by the tensile shear tests, which suggests that the fracture occurs within the Al alloy layer. The tensile shear strengths considering the area fraction of deposit of Al alloy on Cu side were compared with the shear stress converting from the ultimate tensile strengths. As a result, the tensile shear strength of the clad sheets is attributed to the shear strength of Al alloy layer close to the well bonded interface. A simple model was proposed that explains the effects of the rolling reduction and area fraction of deposit of Al alloy.

  10. Microstructure and Properties of Copper Alloy Fabricated by Laser Direct Deposition%激光直接堆积成形铜合金的组织及性能

    Institute of Scientific and Technical Information of China (English)

    张永忠; 章萍芝; 石力开; 程晶; 徐骏; 席明哲

    2001-01-01

    Based upon the mechanism of rapid prototyping,copper alloy components with complicated shape were directed deposited on base table through laser melting metallic powders which were delivered coaxially.The obtained microstructure is fully dense and evenly distributed.The mechanical properties are somewhat higher than that for casting,and meet the requirement for real usage.%基于快速成型原理,采用激光熔化同轴输送的铜合金粉末,在沉积基板上直接制备出具有一定复杂外形的零件。零件组织致密,成分均匀,力学性能较铸态有所提高,能满足直接使用的性能要求。

  11. 铜合金化学热处理在有色金属加工中的应用%Application of Copper Alloy Chemical Heat Treatment in Nonferrous Metal Fabrication

    Institute of Scientific and Technical Information of China (English)

    庄一东; 董云伟; 顾建其

    2001-01-01

    运用铜合金化学热处理技术制成的高性能摩擦件,具有耐磨、减摩、抗咬合、抗高温氧化和抗酸蚀等特性,其应用可降低企业的生产成本,提高产品质量。文中简析了原因。%High functional wear-resisting copper alloy parts made by the application of chemical heat treatment technology have the properties of wearability,antifriction,antiseizing and resistance to high temperature oxidation and acid corrosion,etc.In using these parts,it is proved that the production cost can be reduced and the product quality improved.This paper briefly analyzes the reason for the effects.

  12. Selective dissolution in binary alloys

    Science.gov (United States)

    McCall, Carol Rene

    Corrosion is an important issue in the design of engineering alloys. De-alloying is an aspect of alloy corrosion related to the selective dissolution of one or more of the components in an alloy. The work reported herein focuses on the topic of de-alloying specific to single-phase binary noble metal alloy systems. The alloy systems investigated were gold-silver and gold-copper. The onset of a bulk selective dissolution process is typically marked by a critical potential whereby the more reactive component in the alloy begins dissolving from the bulk, leading to the formation of a bi-continuous solid-void morphology. The critical potential was investigated for the entire composition range of gold-silver alloys. The results presented herein include the formulation of an expression for critical potential as a function of both alloy and electrolyte composition. Results of the first investigation of underpotential deposition (UPD) on alloys are also presented herein. These results were implemented as an analytical tool to provide quantitative measurements of the surface evolution of gold during de-alloying. The region below the critical potential was investigated in terms of the compositional evolution of the alloy surface. Below the critical potential, there is a competition between the dissolution of the more reactive alloying constituent (either silver or copper) and surface diffusion of gold that serves to cover dissolution sites and prevent bulk dissolution. By holding the potential at a prescribed value below the critical potential, a time-dependent gold enrichment occurs on the alloy surface leading to passivation. A theoretical model was developed to predict the surface enrichment of gold based on the assumption of layer-by-layer dissolution of the more reactive alloy constituent. The UPD measurements were used to measure the time-dependent surface gold concentration and the results agreed with the predictions of the theoretical model.

  13. 再生水中硫酸盐还原菌对铜合金的腐蚀%Effect of Sulfate Reducing Bacteria on Corrosion of Copper Alloy HSn701-AB in Recycled Water

    Institute of Scientific and Technical Information of China (English)

    李娟; 李进; 焦迪

    2011-01-01

    The morphology and growth characters of sulfate reducing bacteria, which were separated from recycled water, and its effect on corrosion of copper alloy HSn701-AB in recycled water were investigated by means of microbiological technology, surface analysis technique and electrochemical impedance spectroscopy. The results showed that the growth of SRB had 2 d~3 d's lag phase in recycled water. After immersed in recycled water with SRB for 3 days, the copper alloy HSn701-AB showed features of barrier diffusion impedance, and with the immersion time increased, the corrosion of HSn701-AB became severe in company with formation of a dense SRB bio-film.%采用微生物技术、表面分析技术以及电化学测量技术,研究了从再生水环境中分离提纯得到的硫酸盐还原菌(SRB)的形态、生长规律,以及SRB对铜合金HSn701-AB在再生水环境中腐蚀的影响.结果表明,在再生水环境中SRB的生长曲线存在2 d~3 d的停滞期;铜合金HSn701~AB在接种SRB的再生水环境中浸泡3 d时,出现阻挡层扩散阻抗,随着浸泡时间的增长,腐蚀加重,20 d时其表而生成致密的SRB生物膜.

  14. Corrosion behavior of novel colour-stable imitation gold copper alloy with rare earth%抗变色仿金稀土铜合金的耐蚀行为

    Institute of Scientific and Technical Information of China (English)

    罗利阳; 朱安印; 陈景林; 李周; 梁军; 张晓男

    2011-01-01

    A novel colour-stable imitation gold copper alloy with rare earth was designed and prepared. The microstructures, anti-tarnishing and corrosion resistance properties of the designed alloy and the existing mint metal of H72-1-1 were compared by means of metallographic analysis, neutral salt spray test, mass loss measurement, electrochemical impedance spectroscopy and scanning electron microscopy. The results show that the annealed microstructure of the designed alloy is fine and homogeneous, and discoloring time of the alloy in 3.5% NaCl solution is 25% longer than that of H72-1-1 alloy. The mass loss rate of the designed alloy is slightly lower than that of the H72-1-1 alloy in 3.5% NaCl solution, which can be attributed to the uniform and compact corrosion film which retards the corrosion process, and the corrosion rate is 10.3 μm/a. The charge transfer resistance Rct and the diffusion impedance Zw of the designed alloy increase much more greatly than those of the H72-1-1 alloy, which increases the corrosion process resistance.%设计并制备一种新型的抗变色仿金稀土铜合金.采用金相组织分析、中性盐雾试验、质量损失法、电化学阻抗谱和扫描电镜等手段对比研究所设计合金与现有造币用H72-1-1合金的组织结构、抗变色性能和耐蚀性能.结果表明:所设计合金退火组织细小、均匀,在3.5%NaCl溶液中保持不变色的时间较H72-1-1合金的延长了25%.在3.5%NaCl溶液中浸泡腐蚀过程中,所设计合金形成了一层均匀致密、完整的腐蚀产物膜,减缓了腐蚀的进程,其耐腐蚀性能优于H72-1-1合金的,腐蚀速率为10.3 μm/a;所设计合金电荷转移电阻Rct Warburg扩散阻抗Zw与H72-1-1合金的相比都有大幅度的提高,腐蚀过程阻力增加.

  15. The Current Situation of Precision Copper Tube Capacity in China

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    <正>Precision copper tube generally refers to seam- less copper and copper alloy production tube with high dimension precision,high surface quality,narrow performance range and meeting strict requirements on other general perform- ances such as erosion resistance.These prod-

  16. Zinc alloy enhances strength and creep resistance

    Energy Technology Data Exchange (ETDEWEB)

    Machler, M. [Fisher Gauge Ltd., Peterborough, Ontario (Canada). Fishercast Div.

    1996-10-01

    A family of high-performance ternary zinc-copper-aluminum alloys has been developed that provides higher strength, hardness, and creep resistance than the traditional zinc-aluminum alloys Zamak 3, Zamak 5, and ZA-8. Designated ACuZinc, mechanical properties comparable to those of more expensive materials make it suitable for high-load applications and those at elevated temperatures. This article describes the alloy`s composition, properties, and historical development.

  17. Filler metal alloy for welding cast nickel aluminide alloys

    Science.gov (United States)

    Santella, M.L.; Sikka, V.K.

    1998-03-10

    A filler metal alloy used as a filler for welding cast nickel aluminide alloys contains from about 15 to about 17 wt. % chromium, from about 4 to about 5 wt. % aluminum, equal to or less than about 1.5 wt. % molybdenum, from about 1 to about 4.5 wt. % zirconium, equal to or less than about 0.01 wt. % yttrium, equal to or less than about 0.01 wt. % boron and the balance nickel. The filler metal alloy is made by melting and casting techniques such as are melting the components of the filler metal alloy and cast in copper chill molds. 3 figs.

  18. Filler metal alloy for welding cast nickel aluminide alloys

    Energy Technology Data Exchange (ETDEWEB)

    Santella, Michael L. (Knoxville, TN); Sikka, Vinod K. (Oak Ridge, TN)

    1998-01-01

    A filler metal alloy used as a filler for welding east nickel aluminide alloys contains from about 15 to about 17 wt. % chromium, from about 4 to about 5 wt. % aluminum, equal to or less than about 1.5 wt. % molybdenum, from about 1 to about 4.5 wt. % zirconium, equal to or less than about 0.01 wt. % yttrium, equal to or less than about 0.01 wt. % boron and the balance nickel. The filler metal alloy is made by melting and casting techniques such as are melting the components of the filler metal alloy and east in copper chill molds.

  19. Thermal, mechanics and electrical characterization of the Al-0,6%Mg-08%Si alloy refined and modified with different copper contents; Caracterizacao termica, mecanica e eletrica da liga Al-0,6% Mg-0,8% Si refinada e modificada com diferentes teores de cobre

    Energy Technology Data Exchange (ETDEWEB)

    Freitas, E.S. [Universidade Federal do Para (UFPA), Belem, PA (Brazil)], Email: mmanufreitas@gmail.com; Marques, P.R.R.; Santos, W.L.R.; Kamizono, K.A.; Quaresma, J. Maria V.

    2009-07-01

    The aluminum, magnesium and silicon alloys form a very important group, utilized as casted form and worked alloys, especially in 6201 alloy series. These alloys show applicability on cables and wires fabrication to electrical energy transmission. The present work analyzes the copper content variation and its influence in electrical conductivity, tensile strength and in studied alloy ductility. The refined Al-0,6% Mg-0,8% Si studied alloy was modified with the following contents: [0,05; 0,10; 0,20 e 0,30]% Cu and unidirectional solidified. The test specimen were machined to 10 mm diameter and rolled to 3,98 mm, whose deformation rate was 60,2%. The obtained wires were mechanical, electrical and structural characterized and the mechanical and electrical characterization results were associated to fractures of evaluated micro cavities. The highest observation was the Cu content in alloy increases the TS, decreases electrical conductivity and increases liquidus isotherm's velocity, forming micro cavities. (author)

  20. Copper hypersensitivity.

    Science.gov (United States)

    Fage, Simon W; Faurschou, Annesofie; Thyssen, Jacob P

    2014-10-01

    The world production of copper is steadily increasing. Although humans are widely exposed to copper-containing items on the skin and mucosa, allergic reactions to copper are only infrequently reported. To review the chemistry, biology and accessible data to clarify the implications of copper hypersensitivity, a database search of PubMed was performed with the following terms: copper, dermatitis, allergic contact dermatitis, contact hypersensitivity, contact sensitization, contact allergy, patch test, dental, IUD, epidemiology, clinical, and experimental. Human exposure to copper is relatively common. As a metal, it possesses many of the same qualities as nickel, which is a known strong sensitizer. Cumulative data on subjects with presumed related symptoms and/or suspected exposure showed that a weighted average of 3.8% had a positive patch test reaction to copper. We conclude that copper is a very weak sensitizer as compared with other metal compounds. However, in a few and selected cases, copper can result in clinically relevant allergic reactions.

  1. Energy and materials flows in the copper industry

    Energy Technology Data Exchange (ETDEWEB)

    Gaines, L.L.

    1980-12-01

    The copper industry comprises both the primary copper industry, which produces 99.9%-pure copper from copper ore, and the secondary copper industry, which salvages and recycles copper-containing scrap metal to extract pure copper or copper alloys. The United States uses about 2 million tons of copper annually, 60% of it for electrical applications. Demand is expected to increase less than 4% annually for the next 20 years. The primary copper industry is concentrated in the Southwest; Arizona produced 66% of the 1979 total ore output. Primary production uses about 170 x 10/sup 12/ Btu total energy annually (about 100 x 10/sup 6/ Btu/ton pure copper produced from ore). Mining and milling use about 60% of the total consumption, because low-grade ore (0.6% copper) is now being mined. Most copper is extracted by smelting sulfide ores, with concomitant production of sulfur dioxide. Clean air regulations will require smelters to reduce sulfur emissions, necessitating smelting process modifications that could also save 20 x 10/sup 12/ Btu (10 x 10/sup 6/ Btu/ton of copper) in smelting energy. Energy use in secondary copper production averages 20 x 10/sup 6/ Btu/ton of copper. If all copper products were recycled, instead of the 30% now salvaged, the energy conservation potential would be about one-half the total energy consumption of the primary copper industry.

  2. Energy and materials flows in the copper industry

    Energy Technology Data Exchange (ETDEWEB)

    Gaines, L.L.

    1980-12-01

    The copper industry comprises both the primary copper industry, which produces 99.9%-pure copper from copper ore, and the secondary copper industry, which salvages and recycles copper-containing scrap metal to extract pure copper or copper alloys. The United States uses about 2 million tons of copper annually, 60% of it for electrical applications. Demand is expected to increase less than 4% annually for the next 20 years. The primary copper industry is concentrated in the Southwest; Arizona produced 66% of the 1979 total ore output. Primary production uses about 170 x 10/sup 12/ Btu total energy annually (about 100 x 10/sup 6/ Btu/ton pure copper produced from ore). Mining and milling use about 60% of the total consumption, because low-grade ore (0.6% copper) is now being mined. Most copper is extracted by smelting sulfide ores, with concomitant production of sulfur dioxide. Clean air regulations will require smelters to reduce sulfur emissions, necessitating smelting process modifications that could also save 20 x 10/sup 12/ Btu (10 x 10/sup 6/ Btu/ton of copper) in smelting energy. Energy use in secondary copper production averages 20 x 10/sup 6/ Btu/ton of copper. If all copper products were recycled, instead of the 30% now salvaged, the energy conservation potential would be about one-half the total energy consumption of the primary copper industry.

  3. Effect of Copper and Bronze Addition on Corrosion Resistance of Alloyed 316L Stainless Steel Cladded on Plain Carbon Steel by Powder Metallurgy

    Institute of Scientific and Technical Information of China (English)

    Wenjue CHEN; Yueying WU; Jianian SHEN

    2004-01-01

    A sandwich structure with cladding alloyed 316L stainless steel on plain carbon steel was prepared by means of powder metallurgy (PM) processing. Electrolytic Cu and prealloyed bronze (95Cu wt pct, 5Sn wt pct) were added in different contents up to 15% into the surface cladded 316L layers and the effect of alloying concentrations on the corrosion resistance of the 316L cladding layers was studied. The corrosion performances of the cladding samples were studied by immersion tests and potentio-dynamic anodic polarization tests in H2SO4 and FeCl3 solutions. Both 316L and alloyed 316L surface layers with 1.0 mm depth produced by PM cladding had an effect to improve corrosion resistance in H2SO4 and FeCl3 solutions. Small Cu and bronze addition (4%) had a positive effect in H2SO4 and FeCl3 solutions. 4% Cu alloyed 316L surface layer produced by PM cladding showed similar anodic polarization behaviour to the 316L cladding layer in H2SO4 and FeCl3 solutions.

  4. Initiation and propagation of cleared channels in neutron-irradiated pure copper and a precipitation hardened CuCrZr alloy

    DEFF Research Database (Denmark)

    Edwards, D.J.; Singh, B.N.; Bilde-Sørensen, Jørgen

    2005-01-01

    The formation of ‘cleared’ channels in neutron irradiated metals and alloys have been frequently reported for more than 40 years. So far, however, no unambiguous and conclusive evidence showing as to how and where these channels are initiated has emerged. In the following we present experimental ...

  5. 铜基化学镀Ni-P-B合金工艺及镀层性能研究%Study on Technology and Performance of Electroless Ni-P-B Alloy Coating on Copper Substrate

    Institute of Scientific and Technical Information of China (English)

    石建华; 王钰蓉; 王文昌; 刘智超; 陈智栋

    2012-01-01

    Ni-P-B alloy coating with outstanding quality was obtained by introducing trace boron into Ni-P alloy. The optimum processing formulation of electroless Ni-P-B alloy was determined [25 g/L NiSO4 · 6H2O,30 g/L NH2CH2COOH,20 g/L CH3CH(OH)COOH,25 g/L NaH2PO2,0.2 g/L KBH4,1 mg/L CdSO4 · 8H2O, Ph =12,θ=69~71℃] by investigating the influences of complexing agent (NH2CH2COOH and CH3CH( OH)COOH) and reducer (NaH2PO2 and KBH4) on plating rate and component concentration. Corrosion resistance, solderability and adhesive strength of the coating were also tested. Results showed that the Ni-P-B ternary alloy coating was of better corrosion-resistance,solderability and excellent bonding with copper substrate.%通过向Ni-P二元合金镀层中引入微量B元素,制备了性能优异的Ni-P-B三元合金镀层.研究了镀液中络合剂甘氨酸和乳酸、还原剂次磷酸钠和硼氢化钾对镀速、镀层成分的影响,确定镀液的最佳配方及工艺条件为25 g/L NiSO4·6H2O,30 g/L NH2CH2COOH,20 g/L CH3CH(OH) COOH,25 g/L NaH2PO2,0.2 g/L KBH4,1 mg/L CdSO4·8H2O,pH=12,θ=69~71℃.并对在最佳工艺条件下获得的镀层进行了耐腐蚀性、可焊性及与基体结合力的测试.结果表明,该镀层具有较好的抗腐蚀性和可焊性,并且与铜基体结合牢固.

  6. Copper transport.

    Science.gov (United States)

    Linder, M C; Wooten, L; Cerveza, P; Cotton, S; Shulze, R; Lomeli, N

    1998-05-01

    In adult humans, the net absorption of dietary copper is approximately 1 mg/d. Dietary copper joins some 4-5 mg of endogenous copper flowing into the gastrointestinal tract through various digestive juices. Most of this copper returns to the circulation and to the tissues (including liver) that formed them. Much lower amounts of copper flow into and out of other major parts of the body (including heart, skeletal muscle, and brain). Newly absorbed copper is transported to body tissues in two phases, borne primarily by plasma protein carriers (albumin, transcuprein, and ceruloplasmin). In the first phase, copper goes from the intestine to the liver and kidney; in the second phase, copper usually goes from the liver (and perhaps also the kidney) to other organs. Ceruloplasmin plays a role in this second phase. Alternatively, liver copper can also exit via the bile, and in a form that is less easily reabsorbed. Copper is also present in and transported by other body fluids, including those bathing the brain and central nervous system and surrounding the fetus in the amniotic sac. Ceruloplasmin is present in these fluids and may also be involved in copper transport there. The concentrations of copper and ceruloplasmin in milk vary with lactational stage. Parallel changes occur in ceruloplasmin messenger RNA expression in the mammary gland (as determined in pigs). Copper in milk ceruloplasmin appears to be particularly available for absorption, at least in rats.

  7. The shielding against radiation produced by powder metallurgy with tungsten copper alloy applied on transport equipment for radio-pharmaceutical products

    Energy Technology Data Exchange (ETDEWEB)

    Cione, Francisco C.; Sene, Frank F.; Souza, Armando C. de; Betini, Evandro G.; Rossi, Jesualdo L., E-mail: fceoni@hotmail.com, E-mail: ffsene@hotmail.com, E-mail: armandocirilo@yahoo.com, E-mail: evandrobetini@gmail.com, E-mail: jelrossi@ipen.br [Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil); Rizzuto, Marcia A., E-mail: marizzutto@if.usp.br [Universidade de Sao Paulo (IF/USP), SP (Brazil). Instituto de Fisica

    2015-07-01

    Safety is mandatory on medicine radiopharmaceutical transportation and dependent on radiation shielding material. The focus of the present work is to minimize the use of harmful materials as lead and depleted uranium usually used in packages transportation. The tungsten-copper composite obtained by powder metallurgy (PM) is non-toxic. In powder metallurgy the density and the porosity of the compacted parts depends basically upon particle size distribution of each component, mixture, compacting pressure and sintering temperature cycle. The tungsten-copper composite, when used for shielding charged particles, X-rays, gamma photons or other photons of lower energy require proper interpretation of the radiation transport phenomena. The radioactive energy reduction varies according to the porosity and density of the materials used as shielding. The main factor for radiation attenuation is the cross section value for tungsten. The motivation research factor is an optimization of the tungsten and cooper composition in order to achieve the best linear absorption coefficient given by equation I{sub (x)} = I{sub 0}e{sup (-ux)}. Experiments were conducted to quantify the effective radiation shielding properties of tungsten-copper composite produced by PM, varying the cooper amount in the composite. The studied compositions were 15%, 20% and 25% copper in mass. The Compaction pressure was 270 MPa and the sintering atmosphere was in 1.1 atm in N{sub 2}+H{sub 2}. The sintering temperature was 980 deg C for 2 h. The linear absorption coefficient factor was similar either for the green and the sintered compacts, due the amount of porosity did not affect the radiation attenuation. Thus the sintered was meant for size reduction and mechanical properties enhancement. (author)

  8. Copper hypersensitivity

    DEFF Research Database (Denmark)

    Fage, Simon W; Faurschou, Annesofie; Thyssen, Jacob P

    2014-01-01

    hypersensitivity, a database search of PubMed was performed with the following terms: copper, dermatitis, allergic contact dermatitis, contact hypersensitivity, contact sensitization, contact allergy, patch test, dental, IUD, epidemiology, clinical, and experimental. Human exposure to copper is relatively common...

  9. Atomic-absorption determination of copper and zinc in ferroboron

    Energy Technology Data Exchange (ETDEWEB)

    Malinina, R.D.; Toropova, L.S.

    1986-03-01

    This paper reports on the development of an atomic-absorption method for determining copper and zinc impurities in ferroboron, used for alloying steels and special alloys. The work was done on a Model 503 Perkin-Elmer atomic absorption spectrophotometer. Effects of perchloric acid and alloy macrocomponents on zinc and copper atomization were studied. Results by atomic absorption spectrometry were compared with those found by polarography, using a PPT-6016 ac polarograph. Compared with the GOST 14021.7-78 method for determining copper, the proposed procedure is more rapid and decreases the detection limit from 1 X 10/sup -2/ to 5 X 10/sup -3/ wt. %.

  10. Recent results on the neutron irradiation of ITER candidate copper alloys irradiated in DR-3 at 250{degrees}C to 0.3 dpa

    Energy Technology Data Exchange (ETDEWEB)

    Edwards, D.J. [Pacific Northwest National Lab., Richland, WA (United States); Singh, B.N.; Toft, P.; Eldrup, M.

    1997-04-01

    Tensile specimens of CuCrZr and CuNiBe alloys were given various heat treatments corresponding to solution anneal, prime-ageing and bonding thermal treatment with additional specimens re-aged and given a reactor bakeout treatment at 350{degrees}C for 100 h. CuAl-25 was also heat treated to simulate the effects of a bonding thermal cycle on the material. A number of heat treated specimens were neutron irradiated at 250{degrees}C to a dose level of {approximately}0.3 dpa in the DR-3 reactor as Riso. The main effect of the bonding thermal cycle heat treatment was a slight decrease in strength of CuCrZr and CuNiBe alloys. The strength of CuAl-25, on the other hand, remained almost unaltered. The post irradiation tests at 250{degrees}C showed a severe loss of ductility in the case of the CuNiBe alloy. The irradiated CuAl-25 and CuCrZr specimens exhibited a reasonable amount of uniform elongation, with CuCrZr possessing a lower strength.

  11. Role(s) of pretreatment, inhibitors, and other process steps that effect surface composition on the under-paint corrosion of an aluminum-copper-magnesium alloy 2024-T3

    Science.gov (United States)

    Little, Daryl A.

    2006-12-01

    Under-paint corrosion is a surface corrosion that grows under a coating. The composition of an aluminum alloy, particularly Cu and Fe content, has a direct and dominant effect on the growth rate of filiform corrosion (FFC) and scribe-creep. The Cu and Fe content leads to formation of galvanic cells between intermetallic compounds (IMCs) or replated Cu and the aluminum-rich matrix. However, there is no model which describes scribe-creep behavior and can be used to predict the effect of material and surface pretreatment parameters such as inhibitors, chemical surface pretreatment, and alloy microstructure. Surface pretreatments and aging which control the amount of surface copper and alter IMC distributions decrease the growth rate of scribe-creep. Scribe-creep was observed to be enhanced by temperature, regardless of surface pretreatment, as well as by artificial aging and surface pretreatments. Scribe-creep was accelerated by pretreatments that increased surface copper or left a high capacity for Cu-replating such as Cu-containing IMCs. Pretreatment was rationalized to decrease the cathodic oxygen reduction reaction (ORR) rate, which supports anodic undercutting at the head of the corrosion front. In this galvanic corrosion mechanism, the scribe-creep rate will be proportional to the rate of the anodic dissolution at the head. This, in turn, is proportional to the galvanic corrosion rate. Both charge transfer controlled and mass transport controlled cathodic reaction rates occurred at the fastest rates at the scratch and tail. The charge transfer controlled cathodic reaction rate was directly proportional to the surface coverage of Cu (thetaCu) while the mass transport limited rate was a complex nonlinear function of thetaCu . Based on enhanced understanding a galvanic couple model that describes scribe-creep rates in terms of the relevant processes at the tail and head as well as ohmic voltage between the head and tail was developed in order to explain scribe

  12. Study of Rapid Determination of Low-content Silver in Copper Alloy%铜合金中低含量银的快速测定

    Institute of Scientific and Technical Information of China (English)

    范珍媛

    2015-01-01

    The paper presented rapid determination method of low -content silver (0.03% ~0.60%)in copper al oy,and it pointed out that the method has the advantages of rapid reaction,energy efficiency,convenient operation,environmental protection.%文章介绍了铜合金中低含量银(0.03%~0.60%)的快速测定方法,指出该方法快速、节能降耗、操作简便且环保。

  13. Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

    OpenAIRE

    Yoji Miyajima; Kotaro Iguchi; Susumu Onaka; Masaharu Kato

    2014-01-01

    Three types of clad sheets, Cu/Al, Cu/AA5052, and Cu/AA5083, were produced by cold roll bonding with the rolling reduction of 50% and 75%. Tensile shear tests which give tensile shear strength were performed in order to assess the bond strength. Scanning electron microscopy was performed on the fractured interface produced by the tensile shear tests, which suggests that the fracture occurs within the Al alloy layer. The tensile shear strengths considering the area fraction of deposit of Al al...

  14. 二溴对甲偶氮羧光度法测定Cu-C0合金中钴%Spectrophotometric determination of cobalt in copper-cobalt alloy with Dibromomethyl carboxyazo

    Institute of Scientific and Technical Information of China (English)

    钟国秀; 杨浩义; 晏高华

    2011-01-01

    The chromogenic reaction between the reagent Dibromomethyl carboxyazo and cobalt was studied. In ammonium citrate-ammonia solution at pH 10. 2, cobalt reacted with Dibromomethyl carboxyazo, forming a blue complex which exhibited an absorption maximum at 660 nm with an apparent molar absorptivity of 1. 77 × 104 L · mol-1 · cm-1, Beer's law was obeyed in the range of 0-3. 2 mg/L for cobalt. The proposed method has been applied to determine cobalt in copper-cobalt alloy with RSD (n=5) smaller than 2%. The results were consistent with those obtained by nitroso-R salt spectrophotometry.%研究了显色剂二溴对甲偶氮羧与钴的显色反应.pH 10.2的柠檬酸铵-氨水溶液中,钴与二溴对甲偶氮羧反应形成蓝色络合物,最大吸收波长为660 nm,表观摩尔吸光系数为1.77×104L·mol-1·cm-1,钴量在0~3.2 mg/L范围内符合比尔定律.方法用于Cu-Co合金中钴的测定,相对标准偏差小于2%,结果与亚硝基R盐光度法一致.

  15. Copper Recycling in the United States in 2004

    Science.gov (United States)

    Goonan, Thomas G.

    2009-01-01

    As one of a series of reports that describe the recycling of metal commodities in the United States, this report discusses the flow of copper from production through distribution and use, with particular emphasis on the recycling of industrial scrap (new scrap1) and used products (old scrap) in the year 2004. This materials flow study includes a description of copper supply and demand for the United States to illustrate the extent of copper recycling and to identify recycling trends. Understanding how materials flow from a source through disposition can aid in improving the management of natural resource delivery systems. In 2004, the U.S. refined copper supply was 2.53 million metric tons (Mt) of refined unalloyed copper. With adjustment for refined copper exports of 127,000 metric tons (t) of copper, the net U.S. refined copper supply was 2.14 Mt of copper. With this net supply and a consumer inventory decrease of 9,000 t of refined copper, 2.42 Mt of refined copper was consumed by U.S. semifabricators (brass mills, wire rod mills, ingot makers, and foundries and others) in 2004. In addition to the 2.42 Mt of refined copper consumed in 2004, U.S. copper semifabricators consumed 853,000 t of copper contained in recycled scrap. Furthermore, 61,000 t of copper contained in scrap was consumed by noncopper alloy makers, for example, steelmakers and aluminum alloy makers. Old scrap recycling efficiency for copper was estimated to be 43 percent of theoretical old scrap supply, the recycling rate for copper was 30 percent of apparent supply, and the new-scrap-to-old-scrap ratio for U.S. copper product production was 3.2 (76:24).

  16. High toughness-high strength iron alloy

    Science.gov (United States)

    Stephens, J. R.; Witzke, W. R. (Inventor)

    1980-01-01

    An iron alloy is provided which exhibits strength and toughness characteristics at cryogenic temperatures. The alloy consists essentially of about 10 to 16 percent by weight nickel, about 0.1 to 1.0 percent by weight aluminum, and 0 to about 3 percent by weight copper, with the balance being essentially iron. The iron alloy is produced by a process which includes cold rolling at room temperature and subsequent heat treatment.

  17. Creep-fatigue deformation behaviour of OFHC-copper and CuCrZr alloy with different heat treatments and with and without neutron irradiation

    DEFF Research Database (Denmark)

    Singh, B.N.; Li, M.; Stubbins, J.F.

    2005-01-01

    The creep-fatigue interaction behaviour of a precipitation hardened CuCrZr alloy was investigated at 295 and 573 K. To determine the effect of irradiation a number of fatigue specimens were irradiated at 333 and 573 K to a dose level in the range of 0.2 -0.3 dpa and were tested at room temperature...... with a frequency of 0.5 Hz. Holdtimes of up to 1000 seconds were used. Creep-fatigue experiments were carried out using strain, load and extension controlled modesof cyclic loading. In addition, a number of “interrupted” creep-fatigue tests were performed on the prime aged CuCuZr specimens in the strain controlled...

  18. Unusual dealloying effect in gold/copper alloy thin films: the role of defects and column boundaries in the formation of nanoporous gold.

    Science.gov (United States)

    El Mel, Abdel-Aziz; Boukli-Hacene, Farah; Molina-Luna, Leopoldo; Bouts, Nicolas; Chauvin, Adrien; Thiry, Damien; Gautron, Eric; Gautier, Nicolas; Tessier, Pierre-Yves

    2015-02-04

    Understanding the dealloying mechanisms of gold-based alloy thin films resulting in the formation of nanoporous gold with a sponge-like structure is essential for the future design and integration of this novel class of material in practical devices. Here we report on the synthesis of nanoporous gold thin films using a free-corrosion approach in nitric acid applied to cosputtered Au-Cu thin films. A relationship is established between the as-grown Au-Cu film characteristics (i.e., composition, morphology, and structure) and the porosity of the sponge-like gold thin films. We further demonstrate that the dealloying approach can be applied to nonhomogenous Au-Cu alloy thin films consisting of periodic and alternate Au-rich/Au-poor nanolayers. In such a case, however, the dealloying process is found to be altered and unusual etching stages arise. Thanks to defects and column boundaries playing the role of channels, the nitric acid is found to quickly penetrate within the films and then laterally (i.e., parallel to the film surface) attacks the nanolayers rather than perpendicularly. As a consequence to this anisotropic etching, the Au-poor layers are etched preferentially and transform into Au pillars holding the Au-rich layers and preventing them against collapsing. A further exposure to nitric acid results in the collapsing of the Au-rich layers accompanied by a transition from a multilayered to a sponge-like structure. A scenario, supported by experimental observations, is further proposed to provide a detailed explanation of the fundamental mechanisms occurring during the dealloying process of films with a multilayered structure.

  19. China Resumes Processing Trade of Copper Concentrate

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    <正>On December 31,2008,China’s Ministry of Commerce and General Administration of Cus- toms issued its year-2008 No.121 announce- ment,saying it will adjust the forbidden cate- gory of processing trade,which includes non- ferrous metal products such as copper concen- trate,nickel concentrate,cobalt concentrate, refined copper,nickel and nickel alloy.The above products will be exempt from being for- bidden to process starting from Feb.1,2009.

  20. The intermetallic formation and growth kinetics at the interface of near eutectic tin-silver-copper solder alloys and gold/nickel metallization

    Science.gov (United States)

    Gao, Mao

    The formation of a one micron thick layer of an intermetallic compound between a solder alloy and a metallic substrate generally constitutes a good solder joint in an electronic device. However, if the compound grows too thick, and/or if multiple intermetallic compounds form, poor solder joint reliability may result. Thus significant interest has been focused on intermetallic compound phase selection and growth kinetics at such solder/metal interfaces. The present study focuses on one such specific problem, the formation and growth of intermetallic compounds at near eutectic Sn-Ag-Cu solder alloy/Ni interfaces. Sn-3.0Ag-0.5Cu solder was reflowed on Au/Ni substrates, resulting in the initial formation and growth of (CuNi)6Sn 5 at Sn-3.0Ag-0.5Cu /Ni interfaces. (NiCu)3Sn4 formed between the (CuNi)6Sn5 and the Ni substrate when the concentration of Cu in the liquid SnAgCu solder decreased to a critical value which depended upon temperature: 0.37, 0.31 and 0.3(wt.%) at reflow temperatures of 260°C, 245°C and 230°C respectively. The growth rate of (CuNi)6Sn5 was found to be consistent with extrapolations of a diffusion limited growth model formulated for lower temperature, solid state diffusion couples. The long range diffusion of Cu did not limit growth rates. The spalling of (CuNiAu)6Sn5 from (NiCu)3 Sn4 surfaces during reflow was also examined. When the Cu concentration in the solder decreased to approximately 0.28wt.%, the (Cu,Ni,Au) 6Sn5 was observed to spall. Compressive stress in (CuNiAu) 6Sn5 and weak adhesion between (CuNiAu)6Sn 5 and (NiCu)3Sn4 was found to cause this effect.

  1. 影响镍铜合金电镀层成分的因素%Factors affecting the composition of electroplated nickel-copper alloy coating

    Institute of Scientific and Technical Information of China (English)

    王瑞永; 黄中省

    2011-01-01

    研究了以柠檬酸钠为配位剂的硫酸盐体系中影响镍铜合金镀层成分的因素.镀液基本组成及工艺条件为:六水合硫酸镍100 g/L,五水合硫酸铜10g/L,柠檬酸钠70g/L,硼酸30g,氯化钠6g/L,温度55℃C,pH 4.5,电流密度3A/dm2.结果表明:镀层中铜含量随主盐硫酸铜和配位剂柠檬酸钠含量的增大而增加,随电流密度和pH的增大而减少.单独加入丁炔二醇或糖精,可使镀层中铜含量升高,加入明胶则镀层铜含量下降.%The factors affecting the composition of Ni-Cu alloy electroplated from a sulfate bath with sodium citrate as complexing agent were studied. The bath composition and process conditions are as follows: NiSO4·6H2O 100 g/L, CuSO4·5H2O 10 g/L, sodium citrate 70 g/L, H3BO3 30 g/L, NaCl 6 g/L, temperature 55 °C, pH 4.5, and current density 3 A/dm2. The results showed that the Cu content of Ni-Cu alloy deposit is increased with increasing CuSO4 and sodium citrate contents in bath or by the addition of butynediol or saccharin, but decreased with increasing current density and pH or by the addition of gelatin.

  2. Microstructure and Aging of Powder-Metallurgy Al Alloys

    Science.gov (United States)

    Blackburn, L. B.

    1987-01-01

    Report describes experimental study of thermal responses and aging behaviors of three new aluminum alloys. Alloys produced from rapidly solidified powders and contain 3.20 to 5.15 percent copper, 0.24 to 1.73 percent magnesium, 0.08 to 0.92 percent iron, and smaller amounts of manganese, nickel, titanium, silicon, and zinc. Peak hardness achieved at lower aging temperatures than with standard ingot-metallurgy alloys. Alloys of interest for automobile, aircraft, and aerospace applications.

  3. Bulk Copper Electrodeposition on Gold Imaged by In Situ STM

    DEFF Research Database (Denmark)

    Andersen, Jens Enevold Thaulov; Bech-Nielsen, Gregers; Møller, Per

    1996-01-01

    Electrochemical measurements were carried out simultaneously with acquisition of in situ STM images of copper electrodeposition at low cathodic overpotentials and subsequent dissolution from the underlying polycrystalline gold surfaces. The morphologies of the copper deposits were examined...... for correlation with features of the current-voltage diagram. Copper growth is by nucleation and formation of 3D islands. During the initial stages of bulk copper growth the potentials were fixed at selected values and a balance observed between formation of polycrystalline copper nuclei and of copper crystals....... After the first cycle of copper deposition and dissolution the morphology of the polycrystalline gold surface had apparently changed into a recrystallized phase of a copper-gold alloy. At a given stage of the cycle the potential of the electrode was found to depend linearly on the tip potential...

  4. Isolation and Characterization of Bacteria Resistant to Metallic Copper Surfaces▿ †

    OpenAIRE

    Espírito Santo, Christophe; Morais, Paula Vasconcelos; Grass, Gregor

    2010-01-01

    Metallic copper alloys have recently attracted attention as a new antimicrobial weapon for areas where surface hygiene is paramount. Currently it is not understood on a molecular level how metallic copper kills microbes, but previous studies have demonstrated that a wide variety of bacteria, including Escherichia coli, Staphylococcus aureus, and Clostridium difficile, are inactivated within minutes or a few hours of exposure. In this study, we show that bacteria isolated from copper alloy coi...

  5. 无氰铜锡合金仿金电镀添加剂的研究%Study on additives of cyanide-free gold-imitative copper-tin alloy plating

    Institute of Scientific and Technical Information of China (English)

    黄灵飞; 曾振欧; 谢金平; 范小玲

    2015-01-01

    The effects of different types of additives including H-3, DDS, and JZ-1 on the performances of gold-imitative copper–tin alloy coating electroplated from an aqueous pyrophosphate electrolyte was studied in Hull cell and square cell. The plating bath (pH 8.7) is basically composed of Cu2P2O7·3H2O 24 g/L, K4P2O7·3H2O 240 g/L, and Sn2P2O7 2.0 g/L. It is shown that imitation gold coating can be obtained from the pyrophosphate electrolyte only after adding some additive to it. The additive H-3 has a certain effect of leveling, grain refinement, and brightness enhancement. The cathodic current density range for preparation of imitation gold coating on copper alloys from the electrolyte containing H-3 2.8 mL/L is 0.29-2.25 A/cm2. Bright imitation gold coatings can be obtained by conducting the electroplating process in the pyrophosphate electrolyte with additive H-3 on some intermediate layers such as bright acid copper coating, bright nickel coating, and cyanide-free white copper–tin coating or directly on steel substrate.%通过赫尔槽试验和方槽试验研究了添加剂H-3、DDS和JZ-1对焦磷酸盐溶液体系电镀仿金铜锡合金性能的影响。基础镀液组成为:K4P2O7·3H2O 240 g/L,Sn2P2O72.0 g/L,Cu2P2O7·3H2O 24 g/L,pH 8.7。结果表明,采用焦磷酸盐溶液体系电镀铜锡合金时,只有用到添加剂方可得到仿金镀层。添加剂H-3具有一定的整平、细化晶粒和提高光亮度的作用。H-3的用量为2.8 mL/L时,在黄铜基体上获得仿金镀层的阴极电流密度范围为0.29~2.25 A/cm2。焦磷酸盐溶液体系使用添加剂H-3时,在光亮酸铜、光亮镍、无氰白铜锡中间层上和直接在钢铁基体上进行仿金电镀时,均可获得光亮的仿金镀层。

  6. Review of hot shortness problems in copper-containing steel

    OpenAIRE

    Coutsouradis, D.; Leroy, V; Greday, T.; Lecomte-Beckers, Jacqueline

    1983-01-01

    The problem of hot shortness is first briefly discussed in terms of the recycling of scraps and the occurrence of various residual elements in steel. The phenomenon is then defined and described as a function of the factors influencing its different stages : copper solubility in austenite, copper phase melting point, wettability of the liquid copper rich phase, oxidation, furnace atmosphere, occlusion and diffusion. The effect on these phenomena of other residual or alloying elements is discu...

  7. Nanocrystalline Ni-W coatings on copper

    Energy Technology Data Exchange (ETDEWEB)

    Panagopoulos, C.N., E-mail: chpanag@metal.ntua.gr [Laboratory of Physical Metallurgy, National Technical University of Athens, Zografos, 15780, Athens (Greece); Plainakis, G.D.; Lagaris, D.A. [Laboratory of Physical Metallurgy, National Technical University of Athens, Zografos, 15780, Athens (Greece)

    2011-04-15

    Nanocrystalline Ni-W coatings were produced on copper substrates with the aid of electrodeposition technique. The morphology, chemical composition and structure of the produced coatings were examined with the aid of scanning electron microscopy (SEM), electron dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The microhardness of alloy Ni-W coatings on copper substrate was also studied. The adhesion between the Ni-W coating, having W content 50 wt%, and the copper substrate, was also studied with a scratch testing apparatus. The scratch tests resulted in the coatings suffering an intensive brittle fracture and minor delamination.

  8. 锡、锑对铅及铅合金中铜元素检测的干扰探究%Detection of Copper Element in Lead and Lead Alloy, the Inquiry of the Interference about Tin,Antimony

    Institute of Scientific and Technical Information of China (English)

    常守森

    2016-01-01

    本文对国家标准(GB/T 74.4———2000)进行了研究。对含高锑、高锡、高锑锡的铅合金中铜含量的测定进行了重点探究。在样品溶解,试样处理以及测定过程三方面加以探究,获得了满意结果。采取先加入助溶络合剂(酒石酸、柠檬酸、Na2EDTA)帮助溶解样品并防止锑、锡水解,然后再分别除去助溶络合剂以及锡、锑等元素的干扰,从而达到准确测定的目的。测定范围:0.00050%~0.60%。%The national standard (GB/T74 .4-2000)was studied . The determination of copper in lead and lead alloy , the influence of high antimony , high tin or high antimony and tin was mainly discussed . Three aspects were explored :dissolve process , operation process and determination process of sample . Satisfac‐tory results had already obtained . Adding hydrotropy complexing agent ( tartaric acid , citric acid , Na2 EDTA) into the sample at first for dissolve the sample and preventing the hydrolysis of antimony or tin , and then to remove hydrotropy complexing agent , the elements such as tin and antimony . It can elim‐inate the influence of tartaric acid , citric acid , Na2 EDTA and the elements such as tin and antimony , thus achieve the purpose of accurate determination . Measuring range is 0 .00050% ~ 0 .60% .

  9. Temperature field analysis in tungsten-copper alloy powder preparation by molten salt electrolysis%熔盐电解制备钨铜合金粉体槽内温场条件分析

    Institute of Scientific and Technical Information of China (English)

    王旭; 周才英; 廖春发

    2014-01-01

    在熔盐电解法由Na2WO4和CuO制取钨铜合金粉体的研究基础上,分析电解槽内的温度场分布,特别是电极区域的温度分布情况对电解行为的影响。通过位移法测量,采取比较法分析实验误差,结果表明:电解过程中2个主要的外部条件,即电解槽内温场分布与电场分布是联动的;温度条件影响着电极电位;同时,外部槽电压通过电流扰动槽内温场,使电极区域温场分布不均。%Based on the research of preparing tungsten copper alloy powder from Na 2WO4 and CuO by molten salt electrolysis method, the temperature field distribution of the electrolysis cell and the influence of the electrochemical behavior around temperature distribution nearby the electrode area are analyzed. Temperature is measured by the displacement method and the experimental error is analyzed. The results show that temperature field distribution and electric field distribution in the electrolytic cell interact with each other, and the electrode potential is affected by temperature conditions. In the meanwhile, the external electric field disturbs the temperature field in electrolysis cell to make the uneven distribution of temperature field around electrode area.

  10. Influence of the selected alloy additions on limiting the phase formation in Cu-Zn alloys

    Directory of Open Access Journals (Sweden)

    J. Kozana

    2010-01-01

    Full Text Available Influence of the selected alloy additions into copper and zinc alloys was investigated in order to find out the possibility of limiting the precipitation of unfavourable phase . The observation of microstructures and strength tests were performed. The results of metallographic and strength investigations indicate positive influence of small amounts of nickel, cobalt or tellurium. The precise determination of the influence of the selected alloy additions on limiting the gamma phase formation will be the subject of further examinations.

  11. Isolation and characterization of bacteria resistant to metallic copper surfaces.

    Science.gov (United States)

    Santo, Christophe Espírito; Morais, Paula Vasconcelos; Grass, Gregor

    2010-03-01

    Metallic copper alloys have recently attracted attention as a new antimicrobial weapon for areas where surface hygiene is paramount. Currently it is not understood on a molecular level how metallic copper kills microbes, but previous studies have demonstrated that a wide variety of bacteria, including Escherichia coli, Staphylococcus aureus, and Clostridium difficile, are inactivated within minutes or a few hours of exposure. In this study, we show that bacteria isolated from copper alloy coins comprise strains that are especially resistant against the toxic properties exerted by dry metallic copper surfaces. The most resistant of 294 isolates were Gram-positive staphylococci and micrococci, Kocuria palustris, and Brachybacterium conglomeratum but also included the proteobacterial species Sphingomonas panni and Pseudomonas oleovorans. Cells of some of these bacterial strains survived on copper surfaces for 48 h or more. Remarkably, when these dry-surface-resistant strains were exposed to moist copper surfaces, resistance levels were close to those of control strains and MICs for copper ions were at or below control strain levels. This suggests that mechanisms conferring resistance against dry metallic copper surfaces in these newly isolated bacterial strains are different from well-characterized copper ion detoxification systems. Furthermore, staphylococci on coins did not exhibit increased levels of resistance to antibiotics, arguing against coselection with copper surface resistance traits.

  12. Influence of time of annealing on anneal hardening effect of a cast CuZn alloy

    Directory of Open Access Journals (Sweden)

    Nestorović Svetlana

    2003-01-01

    Full Text Available Investigated cast copper alloy containing 8at%Zn of a solute. For comparison parallel specimens made from cast pure copper. Copper and copper alloy were subjected to cold rolling with different a final reduction of 30,50 and 70%. The cold rolled copper and copper alloy samples were isochronally and isothermally annealed up to recrystallization temperature. After that the values of hardness, strength and electrical conductivity were measured and X-ray analysis was performed. These investigations show that anneal hardening effect at alloys was attained under recrystallization temperature in the temperature range of 180-3000C, followed with an increase in hardness. The amount of strengthening increase with increasing degree of prior cold work. Also the X-ray analysis show the change of lattice parameter during annealing when anneal hardening effect was attained.

  13. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    Science.gov (United States)

    Chen, Lih-Juann

    2016-12-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  14. 衍生化结合一阶导数光谱法测定铜合金中的锡%Determination of Tin in Copper Alloy by Derivatization and First-derivative Spectrometry

    Institute of Scientific and Technical Information of China (English)

    邵阳; 宣芳; 徐鉴; 张翠玲

    2015-01-01

    The coloring reaction between novel compound 4-hydroxy-3-( hydroxyimino ) butan-2-ylidene-benzo-hydrazide ( DMPH) and tin was studied. A determination method of tin in copper alloy by derivatization and first-derivative spectrometry was established. The experiment showed that, in hydrochloric acid solution, and in the presence of surfactant cetylpyridinium chloride ( CPC) , the tin could form yellow complex with DMPH. The maxi-mum absorption was at 420nm, with the apparent molal absorptivity at 2. 78 × 104 L·mol-1 ·cm-1, the linear range within 0. 5—5 μg/mL, and the detection limit at 0. 1 μg/mL. The method was applied to the determination of tin in certified reference material of tin brass. The results were consistent with the certified values. The relative standard deviations (RSD) were 1. 6%—2. 7%, and the recovery rate were 98. 6%—104. 1%.%研究了Sn2+与新合成的化合物4-羟基-3(羟基亚氨基)-丁-1,2-二甲基苯甲酰肼( DMPH)的显色反应,建立了一种新型的衍生化结合一阶导数光谱测定合金中锡含量的新方法.实验结果表明:在盐酸介质中,在表面活性剂氯化-N-十六烷基吡啶翁盐( CPC)的作用下,Sn2+能与DMPH形成一种黄色的络合物,最大吸收波长为420 nm,摩尔吸光系数为2.78×104 L · mol-1· cm-1,Sn2+浓度在0.5μg·mL-1~5μg·mL-1范围内符合比尔定律,该方法的检出限为0.1μg· mL-1.使用该方法对锡黄铜光谱标样进行多次测定,测定结果与认定值相符,方法的相对标准偏差在1.6%~2.7%,加标回收率为98.6%~104.1%.

  15. Fire-assay collection of gold and silver by copper.

    Science.gov (United States)

    Diamantatos, A

    1987-08-01

    Gold and silver are very effectively collected in copper after fire-assay fusion at 1200 degrees . The resultant copper button is dissolved in perchloric acid and the parting solution is diluted with an equal volume of water. Both gold and silver are precipitated in the copper perchlorate medium by reduction with formic acid or hydroquinone. The two noble metals are collected, dissolved in acids, and determined by atomic-absorption spectrometry. The proposed procedure is simple, relatively rapid, and has been successfully applied to ores, concentrates, furnace products, and copper alloys. Recoveries compare favourably with those obtained by the classical lead cupellation method.

  16. Bulk amorphous Mg-based alloys

    DEFF Research Database (Denmark)

    Pryds, Nini

    2004-01-01

    The present paper describes the preparation and properties of bulk amorphous quarternary Mg-based alloys and the influence of additional elements on the ability of the alloy to form bulk amorphous. The main goal is to find a Mg-based alloy system which shows both high strength to weight ratio...... and a low glass transition temperature. The alloys were prepared by using a relatively simple technique, i.e. rapid cooling of the melt in a copper wedge mould. The essential structural changes that are achieved by going from the amorphous to the crystalline state through the supercooled liquid state...... are discussed in this paper. On the basis of these measurements phase diagrams of the different systems were constructed. Finally, it is demonstrated that when pressing the bulk amorphous alloy onto a metallic dies at temperatures within the supercooled liquid region, the alloy faithfully replicates the surface...

  17. A lightweight shape-memory magnesium alloy.

    Science.gov (United States)

    Ogawa, Yukiko; Ando, Daisuke; Sutou, Yuji; Koike, Junichi

    2016-07-22

    Shape-memory alloys (SMAs), which display shape recovery upon heating, as well as superelasticity, offer many technological advantages in various applications. Those distinctive behaviors have been observed in many polycrystalline alloy systems such as nickel titantium (TiNi)-, copper-, iron-, nickel-, cobalt-, and Ti-based alloys but not in lightweight alloys such as magnesium (Mg) and aluminum alloys. Here we present a Mg SMA showing superelasticity of 4.4% at -150°C and shape recovery upon heating. The shape-memory properties are caused by reversible martensitic transformation. This Mg alloy includes lightweight scandium, and its density is about 2 grams per cubic centimeter, which is one-third less than that of practical TiNi SMAs. This finding raises the potential for development and application of lightweight SMAs across a number of industries.

  18. Wetting behavior of alternative solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    1993-07-01

    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  19. Diffusion bonding of Al7075 alloy to titanium aluminum vanadate alloy

    Science.gov (United States)

    Alhazaa, Abdulaziz Nasser

    The aluminum alloy (Al7075) and titanium alloy (Ti-6Al-4V) are used in a variety of applications in the aerospace industry. However, the high cost of Ti-6Al-4V alloy has been a major factor which has limited its use and therefore, the ability to join Al7075 alloy to Ti-6Al-4V alloy can provide a product that is less costly, but retains the high strength and light weight properties necessary for the transport industry. However, the large difference in the physical properties between these two alloys prevents the use of conventional joining techniques such as fusion welding to join these dissimilar alloys. Therefore, the diffusion bonding technique was used to join Al7075 alloy to Ti-6Al-4V alloy with the objective of minimizing microstructural changes of the two alloys during the bonding process. In this thesis, solid state and liquid phase bonding processes were undertaken. Solid state bonding was employed without interlayers and was successful at 510°C and 7 MPa. The bond interface showed an absence of the oxides due to the dissolution of oxygen into the titanium solution. Bonds made using copper interlayers at a temperature sufficient enough to form eutectic liquid formation between copper and aluminum were produced. The intermetallics theta(Al2Cu), S(Al2CuMg) and T(Al2Mg3Zn3) were identified at the aluminum interface while Cu3Ti2 intermetallic was identified at the titanium interface. Bonds made using tin based alloys interlayers and copper coatings were successful and gave the highest shear strength. The eutectic formation on the Al7075 alloy was responsible for joint formation at the aluminum interface while the formation of Sn3Ti5 intermetallic was responsible for the joint formation at titanium interface. The corrosion rate of the bonds decreased with increasing bonding time for joints made using the tin based interlayer in 3% NaCl solution. However, the presence of copper within the joint increased the corrosion rate of the bonds and this was attributed to

  20. New Dental Alloys with Special Consumer Properties

    Institute of Scientific and Technical Information of China (English)

    TYKOCHINSKIY D. S.; VASEKIN V. V.

    2012-01-01

    The purpose of the investigation was to create a new gold alloy of yellow for casting the frames of metal-ceramic dentures.The yellow color corresponds to the consumer and aesthetic needs of some patients,because it is a sign of the metal,which is noble and innocuous.The main alloying elements of the majority of gold alloys for metal-ceramics are platinum and palladium,which increase the strength characteristics.Copper,tin,and other precious metals and base metals are also introduced in these alloys.At the same time,it is necessary to ensure the correspondence of the properties of the alloy with those of the ceramics applied onto the metal frame.For this purpose,the thermal expansion coefficient of the alloy (TEC) should be in a range of 13.5~14.5 × 10-6 K-1 when heated from 20 to 600 ℃.The two-component alloys,alloying of gold with platinum and palladium results in a decrease in the TEC,and the introduction of copper,silver,and tin,increases it.Multidirectional influence of the alloying elements is a factor in achieving compliance of the TEC with the given values of the alloy.In multicomponent systems,however,the mutual influence of individual components on the properties of the alloy is unpredictable.This also applies to the color characteristics of the alloys,which vary in the direction of reducing the yellowness with increasing concentration of platinum and palladium,while other elements may have the opposite effect on the results.Yellowness index (YI),calculated according to the results of spectrophotometric studies,has been chosen as an objective indicator of color.In this study,the requirement for YI was given not less than 25; the color of such alloys can be called light yellow.All the alloys investigated contained 85% (by weight)of gold.Therefore,higher corrosion resistance and biological inertness of a finished dental products were ensured.Among the alloys that met the yellowness/TEC requirements,two alloys have been selected that were "most yellow

  1. High conductivity Be-Cu alloys for fusion reactors

    Energy Technology Data Exchange (ETDEWEB)

    Lilley, E.A. [NGK Metals Corp., Reading, PA (United States); Adachi, Takao; Ishibashi, Yoshiki [NGK Insulators, Ltd., Aichi-ken (Japan)

    1995-09-01

    The optimum material has not yet been identified. This will result in heat from plasma to the first wall and divertor. That is, because of cracks and melting by thermal power and shock. Today, it is considered to be some kinds of copper, alloys, however, for using, it must have high conductivity. And it is also needed another property, for example, high strength and so on. We have developed some new beryllium copper alloys with high conductivity, high strength, and high endurance. Therefore, we are introducing these new alloys as suitable materials for the heat sink in fusion reactors.

  2. The effect of zinc on the microstructure and phase transformations of casting Al-Cu alloys

    Directory of Open Access Journals (Sweden)

    Manasijević Ivana I.

    2016-01-01

    Full Text Available Copper is one of the main alloying elements for aluminum casting alloys. As an alloying element, copper significantly increases the tensile strength and toughness of alloys based on aluminum. The copper content in the industrial casting aluminum alloys ranges from 3,5 to 11 wt.%. However, despite the positive effect on the mechanical properties, copper has a negative influence on the corrosion resistance of aluminum and its alloys. In order to further improve the properties of Al-Cu alloys they are additional alloyed with elements such as zinc, magnesium and others. In this work experimental and analytical examination of the impact of zinc on the microstructure and phase transformations of Al-Cu alloys was carried out. In order to determine the effect of the addition of zinc to the structure and phase transformations of Al-Cu alloys two alloys of Al-Cu-Zn system with selected compositions were prepared and then examined using scanning electron microscopy with energy-dispersive spectroscopy (SEM-EDX. The experimental results were compared with the results of thermodynamic calculations of phase equilibria.

  3. Rapidly solidified ferromagnetic shape memory alloys

    Science.gov (United States)

    Craciunescu, C. M.; Ercuta, A.; Mitelea, I.; Valeanu, M.; Teodorescu, V. S.; Lupu, N.; Chiriac, H.

    2008-05-01

    Ferromagnetic shape memory alloys have been manufactured by various techniques involving rapid solidification. Bulk alloys have been obtained by extracting the melted alloy in especially designed copper molds; glass coated wires have been obtained by drawing the melt from glass recipients followed by water cooling and ribbons have been fabricated by melt-spinning. Microstructural observations show particular solidification aspects of fractured areas, while ferromagnetic behavior has been detected in glass coated wires obtained by rapid solidification. The martensitic microstructure was observed on Co-Ni-Ga rapid solidified bulk alloys and Fe-Pd ribbons. The memory effect was detected using a Vibran system that allows the detection of the phase transition for the ribbons and by visual observation for other specimens. The conclusions of the observations are related to the comparison between the ferromagnetic behaviors of shape memory alloys solidified using different techniques.

  4. Survival of bacteria on metallic copper surfaces in a hospital trial.

    Science.gov (United States)

    Mikolay, André; Huggett, Susanne; Tikana, Ladji; Grass, Gregor; Braun, Jörg; Nies, Dietrich H

    2010-08-01

    Basic chemistry of copper is responsible for its Janus-faced feature: on one hand, copper is an essential trace element required to interact efficiently with molecular oxygen. On the other hand, interaction with reactive oxygen species in undesired Fenton-like reactions leads to the production of hydroxyl radicals, which rapidly damage cellular macromolecules. Moreover, copper cations strongly bind to thiol compounds disturbing redox-homeostasis and may also remove cations of other transition metals from their native binding sites in enzymes. Nature has learned during evolution to deal with the dangerous yet important copper cations. Bacterial cells use different efflux systems to detoxify the metal from the cytoplasm or periplasm. Despite this ability, bacteria are rapidly killed on dry metallic copper surfaces. The mode of killing likely involves copper cations being released from the metallic copper and reactive oxygen species. With all this knowledge about the interaction of copper and its cations with cellular macromolecules in mind, experiments were moved to the next level, and the antimicrobial properties of copper-containing alloys in an "everyday" hospital setting were investigated. The alloys tested decreased the number of colony-forming units on metallic copper-containing surfaces by one third compared to control aluminum or plastic surfaces. Moreover, after disinfection, repopulation of the surfaces was delayed on copper alloys. This study bridges a gap between basic research concerning cellular copper homeostasis and application of this knowledge. It demonstrates that the use of copper-containing alloys may limit the spread of multiple drug-resistant bacteria in hospitals.

  5. Oligocrystalline shape memory alloys

    Energy Technology Data Exchange (ETDEWEB)

    Ueland, Stian M.; Chen, Ying; Schuh, Christopher A. [Department of Materials Science and Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA 02139 (United States)

    2012-05-23

    Copper-based shape memory alloys (SMAs) exhibit excellent shape memory properties in single crystalline form. However, when they are polycrystalline, their shape memory properties are severely compromised by brittle fracture arising from transformation strain incompatibility at grain boundaries and triple junctions. Oligocrystalline shape memory alloys (oSMAs) are microstructurally designed SMA structures in which the total surface area exceeds the total grain boundary area, and triple junctions can even be completely absent. Here it is shown how an oligocrystalline structure provides a means of achieving single crystal-like SMA properties without being limited by constraints of single crystal processing. Additionally, the formation of oSMAs typically involves the reduction of the size scale of specimens, and sample size effects begin to emerge. Recent findings on a size effect on the martensitic transformation in oSMAs are compared and a new regime of heat transfer associated with the transformation heat evolution in these alloys is discussed. New results on unassisted two-way shape memory and the effect of loading rate in oSMAs are also reported. (Copyright copyright 2012 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  6. Design and development of novel antibacterial Ti-Ni-Cu shape memory alloys for biomedical application.

    Science.gov (United States)

    Li, H F; Qiu, K J; Zhou, F Y; Li, L; Zheng, Y F

    2016-11-29

    In the case of medical implants, foreign materials are preferential sites for bacterial adhesion and microbial contamination, which can lead to the development of prosthetic infections. Commercially biomedical TiNi shape memory alloys are the most commonly used materials for permanent implants in contact with bone and dental, and the prevention of infections of TiNi biomedical shape memory alloys in clinical cases is therefore a crucial challenge for orthopaedic and dental surgeons. In the present study, copper has been chosen as the alloying element for design and development novel ternary biomedical Ti‒Ni‒Cu shape memory alloys with antibacterial properties. The effects of copper alloying element on the microstructure, mechanical properties, corrosion behaviors, cytocompatibility and antibacterial properties of biomedical Ti‒Ni‒Cu shape memory alloys have been systematically investigated. The results demonstrated that Ti‒Ni‒Cu alloys have good mechanical properties, and remain the excellent shape memory effects after adding copper alloying element. The corrosion behaviors of Ti‒Ni‒Cu alloys are better than the commercial biomedical Ti‒50.8Ni alloys. The Ti‒Ni‒Cu alloys exhibit excellent antibacterial properties while maintaining the good cytocompatibility, which would further guarantee the potential application of Ti‒Ni‒Cu alloys as future biomedical implants and devices without inducing bacterial infections.

  7. Design and development of novel antibacterial Ti-Ni-Cu shape memory alloys for biomedical application

    Science.gov (United States)

    Li, H. F.; Qiu, K. J.; Zhou, F. Y.; Li, L.; Zheng, Y. F.

    2016-11-01

    In the case of medical implants, foreign materials are preferential sites for bacterial adhesion and microbial contamination, which can lead to the development of prosthetic infections. Commercially biomedical TiNi shape memory alloys are the most commonly used materials for permanent implants in contact with bone and dental, and the prevention of infections of TiNi biomedical shape memory alloys in clinical cases is therefore a crucial challenge for orthopaedic and dental surgeons. In the present study, copper has been chosen as the alloying element for design and development novel ternary biomedical Ti‒Ni‒Cu shape memory alloys with antibacterial properties. The effects of copper alloying element on the microstructure, mechanical properties, corrosion behaviors, cytocompatibility and antibacterial properties of biomedical Ti‒Ni‒Cu shape memory alloys have been systematically investigated. The results demonstrated that Ti‒Ni‒Cu alloys have good mechanical properties, and remain the excellent shape memory effects after adding copper alloying element. The corrosion behaviors of Ti‒Ni‒Cu alloys are better than the commercial biomedical Ti‒50.8Ni alloys. The Ti‒Ni‒Cu alloys exhibit excellent antibacterial properties while maintaining the good cytocompatibility, which would further guarantee the potential application of Ti‒Ni‒Cu alloys as future biomedical implants and devices without inducing bacterial infections.

  8. Modeling dissolution in aluminum alloys

    Science.gov (United States)

    Durbin, Tracie Lee

    2005-07-01

    Aluminum and its alloys are used in many aspects of modern life, from soda cans and household foil to the automobiles and aircraft in which we travel. Aluminum alloy systems are characterized by good workability that enables these alloys to be economically rolled, extruded, or forged into useful shapes. Mechanical properties such as strength are altered significantly with cold working, annealing, precipitation-hardening, and/or heat-treatments. Heat-treatable aluminum alloys contain one or more soluble constituents such as copper, lithium, magnesium, silicon and zinc that individually, or with other elements, can form phases that strengthen the alloy. Microstructure development is highly dependent on all of the processing steps the alloy experiences. Ultimately, the macroscopic properties of the alloy depend strongly on the microstructure. Therefore, a quantitative understanding of the microstructural changes that occur during thermal and mechanical processing is fundamental to predicting alloy properties. In particular, the microstructure becomes more homogeneous and secondary phases are dissolved during thermal treatments. Robust physical models for the kinetics of particle dissolution are necessary to predict the most efficient thermal treatment. A general dissolution model for multi-component alloys has been developed using the front-tracking method to study the dissolution of precipitates in an aluminum alloy matrix. This technique is applicable to any alloy system, provided thermodynamic and diffusion data are available. Treatment of the precipitate interface is explored using two techniques: the immersed-boundary method and a new technique, termed here the "sharp-interface" method. The sharp-interface technique is based on a variation of the ghost fluid method and eliminates the need for corrective source terms in the characteristic equations. In addition, the sharp-interface method is shown to predict the dissolution behavior of precipitates in aluminum

  9. Particles carried by ascending gas flow at the Tongchanghe copper mine,Guizhou Province,China

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    We collected and analyzed, using transmission electron microscopy, the particles carried by ascending gas flow in soil above the concealed orebody of the Tongchanghe copper mine, Guizhou Province. Particles of native copper, native copper-iron alloy, and native chromium-iron-copper alloy particles in the ascending gas flow were first discovered. Commonly, they were aggre- gations of relatively small particles. Individual particles within aggregations were subcircular, elliptical, regularly polygonal, or elongate and from 5 to 40 nm in size. The aggregations were subcircular or elliptical and 20-150 nm in size. Chloride, oxide, sulfate, and hydroxide particles containing ore-forming metals in the ascending gas flow were also discovered. The elements of the particles were commonly in a high valence state, suggesting that they were formed in a near-surface oxidizing environment. Discovery of the particles extracted from the ascending gas flow above the Tongchanghe copper mineprovided a powerful tool for exploration for deep concealed orebodies. Our study also showed that native copper, native copper-iron alloys, native chromium-iron-copper alloys, as well as chloride, oxide, sulfate, and hydroxide compounds containing ore-forming metals can be transported in particle form by ascending gas flow below the Earth’s surface.

  10. Physicochemical properties of copper important for its antibacterial activity and development of a unified model.

    Science.gov (United States)

    Hans, Michael; Mathews, Salima; Mücklich, Frank; Solioz, Marc

    2015-03-16

    Contact killing is a novel term describing the killing of bacteria when they come in contact with metallic copper or copper-containing alloys. In recent years, the mechanism of contact killing has received much attention and many mechanistic details are available. The authors here review some of these mechanistic aspects with a focus on the critical physicochemical properties of copper which make it antibacterial. Known mechanisms of contact killing are set in context to ionic, corrosive, and physical properties of copper. The analysis reveals that the oxidation behavior of copper, paired with the solubility properties of copper oxides, are the key factors which make metallic copper antibacterial. The concept advanced here explains the unique position of copper as an antibacterial metal. Based on our model, novel design criteria for metallic antibacterial materials may be derived.

  11. Copper allergy from dental copper amalgam?

    Science.gov (United States)

    Gerhardsson, Lars; Björkner, Bert; Karlsteen, Magnus; Schütz, Andrejs

    2002-05-06

    A 65-year-old female was investigated due to a gradually increasing greenish colour change of her plastic dental splint, which she used to prevent teeth grinding when sleeping. Furthermore, she had noted a greenish/bluish colour change on the back of her black gloves, which she used to wipe her tears away while walking outdoors. The investigation revealed that the patient had a contact allergy to copper, which is very rare. She had, however, had no occupational exposure to copper. The contact allergy may be caused by long-term exposure of the oral mucosa to copper from copper-rich amalgam fillings, which were frequently used in childhood dentistry up to the 1960s in Sweden. The deposition of a copper-containing coating on the dental splint may be caused by a raised copper intake from drinking water, increasing the copper excretion in saliva, in combination with release of copper due to electrochemical corrosion of dental amalgam. The greenish colour change of the surface of the splint is probably caused by deposition of a mixture of copper compounds, e.g. copper carbonates. Analysis by the X-ray diffraction technique indicates that the dominant component is copper oxide (Cu2O and CuO). The corresponding greenish/bluish discoloration observed on the back of the patient's gloves may be caused by increased copper excretion in tears.

  12. Processing of copper anodic-slimes for extraction of valuable metals.

    Science.gov (United States)

    Amer, A M

    2003-01-01

    This work focuses on processing of anodic slimes obtained from an Egyptian copper electrorefining plant. The anodic slimes are characterized by high concentrations of copper, lead, tin and silver. The proposed hydrometallurgical process consists of two leaching stages for the extraction of copper (H(2)SO(4)-O(2)) and silver (thiourea-Fe3+), and pyrometallurgical treatment of the remaining slimes for production of Pb-Sn soldering alloy. Factors affecting both the leaching and smelting stages were studied.

  13. Formation of patina on a copper surface in polyacrylate gels with gold nanoparticles

    Science.gov (United States)

    Kim, E. T.; Abdulmenova, E. V.; Lyamina; Godymchuk, A. Yu

    2015-11-01

    The experimental research demonstrates the effective use of patination of the copper and copper alloys in containing gold nanoparticles in order to increase their protective properties. The copper samples were examined by cyclic voltammetry method, optical microscopy, and X-ray analysis. It has been shown that patinas obtained in the polymer gel solution have a better corrosion resistance in comparison with the patinas obtained with chemical methods.

  14. Systematic corrosion investigation of various Cu-Sn alloys electrodeposited on mild steel in acidic solution: Dependence of alloy composition

    Energy Technology Data Exchange (ETDEWEB)

    Suerme, Yavuz, E-mail: ysurme@nigde.edu.t [Department of Chemistry, Faculty of Science and Art, Nigde University, 51200 Nigde (Turkey); Guerten, A. Ali [Department of Chemistry, Faculty of Science and Art, Osmaniye Korkut Ata University, 80000 Osmaniye (Turkey); Bayol, Emel; Ersoy, Ersay [Department of Chemistry, Faculty of Science and Art, Nigde University, 51200 Nigde (Turkey)

    2009-10-19

    Copper-tin alloy films were galvanostatically electrodeposited on the mild steel (MS) by combining the different amount of Cu and Sn electrolytes at a constant temperature (55 deg. C) and pH (3.5). Alloy films were characterized by using the energy dispersive X-ray analysis (EDX), scanning electron microscopy (SEM), X-ray diffraction (XRD) and micrographing techniques. Corrosion behaviours were evaluated with electrochemical impedance spectrometry (EIS) and electrochemical polarization measurements. Time gradient of electrolysis process was adjusted to obtain same thickness of investigated alloys on MS. The systematic corrosion investigation of various Cu{sub x}-Sn{sub 100-x} (x = 0-100) alloy depositions on MS substrate were carried out in 0.1 M sulphuric acid medium. Results indicate that the corrosion resistance of the alloy coatings depended on the alloy composition, and the corrosion resistance increased at Cu-Sn alloy deposits in proportion to Sn ratio.

  15. Enhance magnetocaloric effects in Mn{sub 1.15}Fe{sub 0.85}P{sub 0.52}Si{sub 0.45}B{sub 0.03} alloy achieved by copper-mould casting and annealing treatments

    Energy Technology Data Exchange (ETDEWEB)

    Yu, H.Y.; Zhu, Z.R.; Lai, J.W. [School of Materials Science & Engineering, South China University of Technology, Guangzhou 510640 (China); Zheng, Z.G., E-mail: mszgzheng@scut.edu.cn [School of Materials Science & Engineering, South China University of Technology, Guangzhou 510640 (China); Zeng, D.C., E-mail: medczeng@scut.edu.cn [School of Materials Science & Engineering, South China University of Technology, Guangzhou 510640 (China); Zhang, J.L. [Department of Physics and Materials Science, City University of Hong Kong, Hong Kong (China)

    2015-11-15

    The Mn{sub 1.15}Fe{sub 0.85}P{sub 0.52}Si{sub 0.45}B{sub 0.03} rods were prepared by copper mould suction casting. The effects of heat treatments on the structure and magnetocaloric properties have been investigated. The X-ray diffraction patterns indicated that the annealed Mn{sub 1.15}Fe{sub 0.85}P{sub 0.52}Si{sub 0.45}B{sub 0.03} rods present hexagonal Fe{sub 2}P-type structure with a small amount of Mn{sub 3}Fe{sub 2}Si{sub 3} impurity. With elevated annealing temperatures from 1123 K to 1423 K, the Curie temperature increases from 205 K to 251 K, the magnetic entropy change jumps from 0.6 to 19.8 J kg{sup –1}K{sup −1} under a magnetic field change of 0–2 T and the thermal hysteresis is reduced from 17 K to 10.5 K. Thus, the heat treatment is suggested to be an effective way to enhance the magnetocaloric effects of Mn{sub 1.15}Fe{sub 0.85}P{sub 0.52}Si{sub 0.45}B{sub 0.03} alloys. - Highlights: • Mn{sub 1.15}Fe{sub 0.85}P{sub 0.52}Si{sub 0.45}B{sub 0.03} alloy was prepared by copper mould suction casting method. • Curie temperature and magnetic entropy change can be tuned by heat treatment. • The −ΔS{sub M} for annealed alloys reaches 19.8 J kg{sup −1}K{sup −1} under the magnetic field change of 0–2 T. • Magnetic transitions are tuned from second-order to first-order by annealing temperature.

  16. Microstructural characteristics of joint region during diffusion-brazing of magnesium alloy and stainless steel using pure copper interlayer%纯铜作中间层的镁合金与不锈钢扩散-钎焊接头区的微观结构特征

    Institute of Scientific and Technical Information of China (English)

    袁新建; 盛光敏; 罗军; 李佳

    2013-01-01

    A novel joining method,double-stage diffusion-brazing of an AZ31 magnesium alloy and a 304L austenitic stainless steel,was carried out using a pure copper interlayer.The solid-state diffusion bonding of 304L to copper was conducted at 850 ℃ for 20 min followed by brazing to AZ31 at 520 ℃ and 495 ℃ for various time.Microstructural characteristics of the diffusion-brazed joints were investigated in detail.A defect flee interface of Fe-Cu diffusion area appeared between the Cu alloy and the 304L steel.Cu-Mg reaction products were formed between AZ31 and Cu alloys.A layered structure including AZ31/Cu-Mg compounds/Cu/Fe-Cu diffusion layer/304L was present in the joint.With time prolonging,the reduction in the width of Cu layer was balanced by the increase in the width of Cu-Mg compounds zone.Microhardness peaks in the zone between AZ31 and Cu layer were attributed to the formation of Mg-Cu compounds in this zone.%以纯铜作中间层采用一种新型的两步式扩散-钎焊方法对AZ31镁合金和304L奥氏体不锈钢进行连接.304L与铜的固态扩散连接在850℃下进行20 min,随后与镁合金在520℃和495℃进行不同时间的钎焊.对扩散-钎焊接头区的微观结构特征进行研究.在铜与304L钢之间形成没有缺陷存在的Fe-Cu扩散界面.在AZ31和铜之间形成Cu-Mg反应物.在接头处出现包含AZ31/Cu-Mg化合物/Cu/Fe-Cu扩散层/304L的层状结构.随着时间的延长,铜层的宽度降低,而Cu-Mg化合物层的宽度增加.形成的Mg-Cu化合物使AZ31和铜层之间的区域出现显微硬度的峰值.

  17. Antwerp Copper Plates

    DEFF Research Database (Denmark)

    Wadum, Jørgen

    1999-01-01

    In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes.......In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes....

  18. 高强高导铜银合金的研究现状及发展趋势%Researching Prospect and Developing Tendency on High-strength and High-conductivity Copper-Silver Alloys

    Institute of Scientific and Technical Information of China (English)

    沈月; 付作鑫; 张国全; 孔健稳; 张吉明; 刘满门; 胡洁琼; 王松; 谢明

    2012-01-01

    Cu-Ag合金作为先进的导体材料,广泛应用于微电子、交通、航空航天及机械制造等工业领域.回顾了近年来高强高导Cu-Ag合金的主要研究进展.针对Cu-Ag合金的导电性和力学性能,主要从合金设计中的Ag成分设计、微合金化和加工工艺中的制备方法、热处理及变形处理等方面进行评述.分析了Cu-Ag合金的成分设计原则,比较了上述几种加工工艺的特点,并提出大塑性变形将会是一种非常有前景的制备高强高导Cu-Ag合金及其它合金的加工工艺.最后指出了现阶段研究中存在的问题及未来发展的趋势.%As an advanced conductive material. Cu-Ag alloy has been widely used in some fields, such as microelectronics, transportation, aerospace and machinery manufacturing industries. The essay mainly focuses on the research progress of high-strength and high-conductivity Cu-Ag alloy. Based on current researches on conductivity and mechanical property of Cu-Ag alloy, how to deal with Ag content in alloy design,micro-alloying,preparation method, heat treatment and the deformation process art reviewed. The choice of Ag content in alloy design is analyzed and the features of the above process are compared It is proposed that severe plastic deforaiation will be a very promising processing technology to prepare high-strength and high-conductivity Cu Ag alloys and other alloys. Finally, existing problems in recent research and future developing tendency are pointed out

  19. Sensitive and selective detection of trace copper in standard alloys, food and biological samples using a bulk optode based on N,N'-(4,4'-ethylene biphenyl) bis(3-methoxy salicylidine imine) as neutral carrier

    Science.gov (United States)

    Arvand, Majid; Lashkari, Zahra

    2013-04-01

    In this paper, an optical sensing film has been proposed for sensitive determination of copper (ІІ) ion in aqueous solutions. The copper sensing membrane was prepared by incorporating N,N'-(4,4'-ethylene biphenyl) bis(3-methoxy salicylidine imine) as ionophore in the plasticized PVC membrane containing bis(2-ethylhexyl) sebacate (DOS) as plasticizer. This proposed membrane works on the basis of a cation-exchange mechanism and shows a significant absorbance signal change on exposure to acetate buffer solution of pH 4.0 containing copper ion. The proposed sensing film displays a linear range of 0.01-32.0 μg mL-1 with a limit of detection 0.008 μg mL-1. Moreover, upon the introduction of a negatively charged lipophilic additive (oleic acid) into the membrane, the optode displayed enhanced sensitivity. In addition, satisfactory analytical sensing characteristics for determining copper (II) ion were obtained in terms of the selectivity, stability and reproducibility. The response time of the optode was less than 3 min, depending on the concentration of Cu(ІІ) ions. The optode membrane has been applied to determine Cu(II) in various real samples.

  20. Copper and copper proteins in Parkinson's disease.

    Science.gov (United States)

    Montes, Sergio; Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

    2014-01-01

    Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

  1. Effect of physicochemical form on copper availability to aquatic organisms

    Energy Technology Data Exchange (ETDEWEB)

    Harrison, F.L.

    1983-11-01

    Copper concentration and speciation were determined in influent and effluent waters collected from eight power stations that used copper alloys in their cooling systems. Quantities of copper associated with particles, colloids, and organic and inorganic ligands differed with the site, season, and mode of operation of the station. Under normal operating conditions, the differences between influent and effluent waters were generally small, and most of the copper was in bound (complexed) species. However, copper was high in concentration and present in labile species during start-up of water circulation through some cooling systems and during changeover from an open- to closed-cycle operation. Copper sensitivity of selected ecologically and economically important aquatic organisms was also evaluted. Our primary emphasis was on acute effects and most of the testing was performed under controlled laboratory conditions. However, sublethal effects of copper on a population of bluegills living in a power station cooling lake containing water of low pH were also assessed. The toxic response to copper differed with the species and life stage of the animal and with the chemical form of copper in the water.

  2. Compatibility of Au-Cu-Ni braze alloy with NH3

    Science.gov (United States)

    Diaz, V., Jr.

    1978-01-01

    Tests show that Gold-Copper-Nickel alloy is compatible with ammonia systems. Joining tubes by brazing has advantages such as reducing chances of excessive grain growth in base metal, saving weight, and cleanliness.

  3. Measurement of stress relaxation on strips of copper materials. Spannungsrelaxationsmessungen an Baendern aus Kupferwerkstoffen

    Energy Technology Data Exchange (ETDEWEB)

    Helmenkamp, T.; Steinkamp, W. (Kabel- und Metallwerke Gutehoffnungshuette AG, Osnabrueck (Germany, F.R.). Zentralbereich Technik); Schleicher, K. (Stolberger Metallwerke GmbH und Co. KG, Stolberg (Germany, F.R.))

    1989-11-01

    The stress relaxation behaviour has been investigated for strips of copper alloys that are commonly used for electromechanical elements like contacts and springs. Among the materials examined, i.e. CuSnMg, CuMg0,7, CuSn6, CuFe2P, CuFe2Mg, CuNi18Zn20, CuNi9Sn2 as well as the age-hardenable alloys CuNi1,5Si0,3 and CuCrZr, the copper-chromium-zirconium alloy proves to have the best stress relaxation properties. (orig.).

  4. FY 1985 status report on feasibility assessment of copper-base waste package container materials in a tuff repository

    Energy Technology Data Exchange (ETDEWEB)

    McCright, R.D.

    1985-09-30

    This report discusses progress made during the first year of a two-year study on the feasibility of using copper or a copper-base alloy as a container material for a waste package in a potential repository in tuff rock at the Yucca Mountain site in Nevada. The expected corrosion and oxidation performances of oxygen-free copper, aluminum bronze, and 70% copper-30% nickel are presented; a test plan for determining whether copper or one of the alloys can meet the containment requirements is outlined. Some preliminary corrosion test data are presented and discussed. Fabrication and joining techniques for forming waste package containers are descibed. Preliminary test data and analyses indicate that copper and copper-base alloys have several attractive features as waste package container materials, but additional work is needed before definitive conclusions can be made on the feasibility of using copper or a copper-base alloy for containers. Plans for work to be undertaken in the second year are indicated.

  5. “Replacing Copper with Aluminum” Looms Large

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    <正>It is said that Yunnan Aluminum has completed China’s first proprietary production line of high-strength aluminum alloy round bars with annual capacity of 40,000 tons. The topic of "replacing copper with aluminum" has heated up again.

  6. Friction and wear of selected metals and alloys in sliding contact with AISI 440 C stainless steel in liquid methane and in liquid natural gas

    Science.gov (United States)

    Wisander, D. W.

    1978-01-01

    Aluminum, titanium, beryllium, nickel, iron, copper, and several copper alloys were run in sliding contact with AISI 440C in liquid methane and natural gas. All of the metals run except copper and the copper alloys of tin and tin-lead showed severely galled wear scars. Friction coefficients varied from 0.2 to 1.0, the lowest being for copper, copper-17 wt. % tin, and copper-8 wt. % tin-22 wt. % lead. The wear rate for copper was two orders of magnitude lower than that of the other metals run. An additional order of magnitude of wear reduction was achieved by the addition of tin and/or lead to copper.

  7. Noble metal alloys for metal-ceramic restorations.

    Science.gov (United States)

    Anusavice, K J

    1985-10-01

    A review of the comparative characteristics and properties of noble metal alloys used for metal-ceramic restorations has been presented. Selection of an alloy for one's practice should be based on long-term clinical data, physical properties, esthetic potential, and laboratory data on metal-ceramic bond strength and thermal compatibility with commercial dental porcelains. Although gold-based alloys, such as the Au-Pt-Pd, Au-Pd-Ag, and Au-Pd classes, may appear to be costly compared with the palladium-based alloys, they have clearly established their clinical integrity and acceptability over an extended period of time. Other than the relatively low sag resistance of the high gold-low silver content alloys and the potential thermal incompatibility with some commercial porcelain products, few clinical failures have been observed. The palladium-based alloys are less costly than the gold-based alloys. Palladium-silver alloys require extra precautions to minimize porcelain discoloration. Palladium-copper and palladium-cobalt alloys may also cause porcelain discoloration, as copper and cobalt are used as colorants in glasses. The palladium-cobalt alloys are least susceptible to high-temperature creep compared with all classes of noble metals. Nevertheless, insufficient clinical data exist to advocate the general use of the palladium-copper and palladium-cobalt alloys at the present time. One should base the selection and use of these alloys in part on their ability to meet the requirements of the ADA Acceptance Program. A list of acceptable or provisionally acceptable alloys is available from the American Dental Association and is published annually in the Journal of the American Dental Association. Dentists have the legal and ethical responsibility for selection of alloys used for cast restorations. This responsibility should not be delegated to the dental laboratory technician. It is advisable to discuss the criteria for selection of an alloy with the technician and the

  8. 引线框架用KFC铜合金低温形变热处理后的组织与性能%Microstructure and Properties of KFC Copper Alloy Used for Lead Frame after Low Temperature Thermo-Mechanical Treatment

    Institute of Scientific and Technical Information of China (English)

    黄鑫; 王德志; 曾菊花; 林高用

    2011-01-01

    The KFC copper alloy plates used for lead frame were cold rolled after solid solution, then cold rolling with different deformation were done between the two aging treatments at 500℃ and 400℃ respectively. The effect of the low temperature thermo-mechanical treatment on the microstructure and properties of the alloy was studies by means of optical microscopy, TEM, mechanical property test machine and conductivity analyzer. The results show that with increase of cold rolling deformation between the aging treatments from 0% to 90%, the dislocation increment of the alloy was more obviously and the precipitation of second phase was more sufficient. When the cold rolling deformation was 75%, the alloy had optimal comprehensive properties, the tensile strength was 417 MPa, the hardness was 126 HV, the elongation was 11%, the conductivity was 91.2% IACS, and its thermal stability was good.%对引线框架用KFC铜合金板坯在固溶处理后进行冷轧变形,然后分别在500,400℃两次时效处理间实施不同变形量的冷轧变形,采用光学显微镜、TEM、力学性能试验机和电导率测试仪等研究了低温形变热处理对KFC铜合金组织和性能的影响。结果表明:随着两次时效之间的冷轧变形量从0%增加到90%,合金的位错增殖越明显,第二相析出越充分;当冷轧变形量为75%时,铜合金可获得最佳的综合性能,其抗拉强度达到417MPa,硬度达到126HV,伸长率达到11%,电导率达到91.2%IAcS,并具有良好的热稳定性。

  9. Surface alloying of Cu with Ti by double glow discharge process

    Institute of Scientific and Technical Information of China (English)

    袁庆龙; 池成忠; 苏永安; 徐重; 唐宾

    2004-01-01

    The surface of pure copper alloyed with Ti using double glow discharge process was investigated. The morphology, structure and forming mechanism of the Cu-Ti alloying layer were analyzed. The microhardness and wear resistance of the Cu-Ti alloying layer were measured, and compared with those of pure copper. The results indicate that the surface of copper activated by Ar and Ti ions bombardment is favorable to absorption and diffusion of Ti element. In current experimental temperature, as the Ti content increases, the liquid phase occurs between the deposited layer and diffused layer, which makes the Ti ions and atoms easy to dissolve and the thickness of Cu-Ti alloying layer increase rapidly. After cooling, the structure of the alloying layer is composed of CuTi, Cu4 Ti and Cu(Ti) solid solution. The solid solution strengthening and precipitation strengthening effects of Ti result in high surface hardness and wear resistance.

  10. Effects of Copper and Austempering on Corrosion Behavior of Ductile Iron in 3.5 Pct Sodium Chloride

    Science.gov (United States)

    Hsu, Cheng-Hsun; Lin, Kuan-Ting

    2013-10-01

    Although alloying and heat treatments are common industrial practices to obtain ductile irons with desired mechanical properties, related information on how the two practices affect corrosion behavior is scarce. In this study, two ductile irons—with and without 1 wt pct copper addition—were austempered to obtain austempered ductile irons (ADIs). Polarization tests and salt spray tests were conducted to explore how both copper-alloying and austempering heat treatments influenced the corrosion behavior of ductile irons. The results showed that the corrosion resistance of 1 wt pct copper-alloyed ductile iron was better than that of the unalloyed one, while ADI had improved corrosion resistance compared with the as-cast. In particular, the ductile iron combined with the copper-alloying and austempering treatments increased the corrosion inhibition efficiency up to 84 pct as tested in 3.5 wt pct NaCl solution.

  11. Surface ordering during underpotential deposition of lead on copper

    Science.gov (United States)

    Vasiljevic, Natasa

    Recently there has been an increased fundamental and practical interest in studies of ultra-thin films in systems with large atomic size mismatch. For those systems interesting surface stress-driven phenomena are observed, such as surface-confined alloying resulting in self-assembly and ordering of domain structures. The system of interest in the present study is the electrochemical deposition of lead on copper that has an atomic size mismatch of 37%. This system shows no bulk alloying and has been thoroughly examined in ultra high vacuum (UHV). Electrodeposition of lead on copper starts by formation of one epitaxial monolayer in the potential region positive with respect to the reversible potential of bulk lead deposition, a phenomenon known in electrochemistry as underpotential deposition (UPD). On copper (111), in-situ STM results have shown (4 x 4) Moire structure of the complete lead monolayer, a structure identical to that observed in UHV. Following stripping of the lead monolayer, STM results revealed nano-organization of the topmost copper layer. Depending on the solution pH value, different types of nanoscale organization have been observed: (i) a Moire pattern of anion-induced reconstruction of the top copper layer, and (ii) a star pattern dislocation network. Additional experiments in lead-free aerated and deaerated solutions at different pH values suggest that observed structures are results of lead-assisted oxy-anion adsorption in which lead plays a catalytic role. On copper (100), the lead UPD process features coverage-dependent phase behavior identical to that observed in UHV. As a function of lead coverage, phases corresponding to a dilute random alloy phase and ordered surface alloy phase that appears at a surface coverage ratio of three lead atoms to eight copper atoms are observed. With increasing lead coverage, lead dealloys from this ordered phase resulting in the formation of a c(2 x 2) lead overlayer phase that transforms with increasing lead

  12. Lack of Involvement of Fenton Chemistry in Death of Methicillin-Resistant and Methicillin-Sensitive Strains of Staphylococcus aureus and Destruction of Their Genomes on Wet or Dry Copper Alloy Surfaces

    OpenAIRE

    Warnes, Sarah L.; Keevil, C. William

    2016-01-01

    The pandemic of hospital-acquired infections caused by methicillin-resistant Staphylococcus aureus (MRSA) has declined, but the evolution of strains with enhanced virulence and toxins and the increase of community-associated infections are still a threat. In previous studies, 107 MRSA bacteria applied as simulated droplet contamination were killed on copper and brass surfaces within 90 min. However, contamination of surfaces is often via finger tips and dries rapidly, and it may be overlooked...

  13. The Development of Rapidly Solidified Magnesium – Copper Ribbons

    Directory of Open Access Journals (Sweden)

    Pastuszak M.

    2016-06-01

    Full Text Available The aim of the present work was to plan and carry out an experiment consisting of amorphization of industrial magnesium alloy WE 43 (Mg - 4 Y - 3 RE - 0.5 Zr modified by the copper addition. Investigated alloy modified with 20% of copper was rapidly quenched with the use of melt spinning technique. The effects of cooling rate on the structure and properties of the obtained material were extensively analyzed. The structure and phase analysis of samples were examined using X-ray diffraction method (XRD while the thermal stability of the samples was determined by differential scanning calorimetry (DSC. Microstructure observations were also conducted. The microhardness tests (HV0.02 and corrosion resistance tests were carried out to investigate the properties of the material. Corrosion resistance measurements were held using a typical three-electrode system. As the result of the research, the effect of cooling rate on microstructure and properties of investigated alloy was determined.

  14. Ferromagnetism of Fe86Mn14-yCuy alloys

    Science.gov (United States)

    França, F.; Paduani, C.; Krause, J. C.; Ardisson, J. D.; Yoshida, M. I.; Schaf, J.

    2007-01-01

    The magnetic properties of disordered Fe86Mn14-yCuy alloys were investigated with several experimental techniques. The results of X-ray diffraction showed that these alloys are single phase with the A2 (BCC) structure. These are ferromagnetic alloys at room temperature, and the Curie temperature decreases with the increase of the Cu content. An abrupt loss of magnetization was observed below TC at a temperature which increases with the reduction of the Mn content in the alloys. The addition of manganese enhances the solubility of copper in iron matrix and retains the BCC structure in iron-rich alloys. The behavior of the magnetization with temperature and its composition dependence indicate that an antiferromagnetic coupling is expected between the Fe and Mn atoms. The magnetic moments of both Fe and Mn atoms are expected to vary strongly with composition in these alloys.

  15. Enhanced Mechanical Properties of Laser Treated Al-Cu Alloys : A Microstructural Analysis

    NARCIS (Netherlands)

    Mol van Otterloo, J.L. de; Bagnoli, D.; Hosson, J.Th.M. De

    1995-01-01

    Both mechanical Vickers hardness and electron microscopic studies have been carried out on laser treated aluminium copper alloys with a copper concentration in the range 0-40 wt%. It is found that a Vickers hardness of 470 kgf/mm2 can be attained, which is high compared to a value of 120 kgf/mm2 for

  16. Grain-boundary character distribution in recrystallized L12 ordered intermetallic alloys

    Science.gov (United States)

    Kaneno, Y.; Takasugi, T.

    2003-11-01

    The grain-boundary character distribution (GBCD) of cold-rolled and, subsequently, recrystallized Co3Ti and Ni3(Si,Ti) ordered alloys with an L12 structure was studied by the electron backscattered diffraction (EBSD) method, in association with texture. For comparison, the GBCD of recrystallized pure copper and aluminum was also determined. The recrystallization textures of the Co3Ti alloys as well as the Ni3(Si,Ti) alloy were significantly weak and different from those of the pure copper and aluminum with a strong cube texture. The GBCD of the Co3Ti alloys was characterized by a high frequency of Σ3 boundaries. On the other hand, the GBCD of the Ni3(Si,Ti) alloy was characterized by a lower frequency of Σ3 and higher frequency of random ( e.g., Σ>29) boundaries than that of the Co3Ti alloys. However, the GBCDs of the Co3Ti and Ni3(Si,Ti) alloys were similar to each other and also quite similar to those of the pure copper and aluminum, when Σ3 boundaries are excluded from the GBCD. Based on these results, the formation mechanism responsible for the recrystallization textures and the grain-boundary structure and energy of the Co3Ti and Ni3(Si,Ti) alloys were discussed, in comparison with those of pure copper and aluminum.

  17. RESEARCH OF THE INFLUENCE NANOMODIFICATION ON THE STRUCTURE AND PROPERTIES OF ZINC ANTIFRICTION ALLOYS

    Directory of Open Access Journals (Sweden)

    F. Rudnicki

    2015-01-01

    Full Text Available This article describes technology of producing of antifriction alloys of zinc–aluminum–copper composition. The effect of modification by nanostructured materials in forming structures of antifriction alloys in the manufacture of heavy-duty plain bearing liners was examined.

  18. DIAGRAM OF STATE AND PHYSICAL-CHEMICAL CHARACTERISTICS OF ALLOYS OF SYSTEM Ni-Cu-Mg

    Directory of Open Access Journals (Sweden)

    Ju. A. Ageev

    2009-01-01

    Full Text Available It is shown that nickel-copper-magnesium alloys, the compositions of which lie above isobar 1,67 atm, must dissolve in cast iron with pyroeffect and with lower assimilation of magnesium than alloys, the compositions of which lie below indicated isobar.

  19. Vacuum Arc Melting Processes for Biomedical Ni-Ti Shape Memory Alloy

    Directory of Open Access Journals (Sweden)

    Tsai De-Chang

    2015-01-01

    Full Text Available This study primarily involved using a vacuum arc remelting (VAR process to prepare a nitinol shape-memory alloy with distinct ratios of alloy components (nitinol: 54.5 wt% to 57 wt%. An advantage of using the VAR process is the adoption of a water-cooled copper crucible, which effectively prevents crucible pollution and impurity infiltration. Optimising the melting production process enables control of the alloy component and facilitates a uniformly mixed compound during subsequent processing. This study involved purifying nickel and titanium and examining the characteristics of nitinol alloy after alloy melt, including its microstructure, mechanical properties, phase transition temperature, and chemical components.

  20. Selective leaching process for the recovery of copper and zinc oxide from copper-containing dust.

    Science.gov (United States)

    Wu, Jun-Yi; Chang, Fang-Chih; Wang, H Paul; Tsai, Ming-Jer; Ko, Chun-Han; Chen, Chih-Cheng

    2015-01-01

    The purpose of this study was to develop a resource recovery procedure for recovering copper and zinc from dust produced by copper smelting furnaces during the manufacturing of copper-alloy wires. The concentrations of copper in copper-containing dust do not meet the regulation standards defined by the Taiwan Environmental Protection Administration; therefore, such waste is classified as hazardous. In this study, the percentages of zinc and copper in the dust samples were approximately 38.4% and 2.6%, respectively. To reduce environmental damage and recover metal resources for industrial reuse, acid leaching was used to recover metals from these inorganic wastes. In the first stage, 2 N of sulphuric acid was used to leach the dust, with pH values controlled at 2.0-3.0, and a solid-to-liquid ratio of 1:10. The results indicated that zinc extraction efficiency was higher than 95%. A selective acid leaching process was then used to recover the copper content of the residue after filtration. In the second stage, an additional 1 N of sulphuric acid was added to the suspension in the selective leaching process, and the pH value was controlled at 1.5-2.0. The reagent sodium hydroxide (2 N) was used as leachate at a pH greater than 7. A zinc hydroxide compound formed during the process and was recovered after drying. The yields for zinc and copper were 86.9-93.5% and 97.0-98.9%, respectively.

  1. Electrical Resistance Alloys and Low-Expansion Alloys

    DEFF Research Database (Denmark)

    Kjer, Torben

    1996-01-01

    The article gives an overview of electrical resistance alloys and alloys with low thermal expansion. The electrical resistance alloys comprise resistance alloys, heating alloys and thermostat alloys. The low expansion alloys comprise alloys with very low expansion coefficients, alloys with very low...

  2. [Copper pathology (author's transl)].

    Science.gov (United States)

    Mallet, B; Romette, J; Di Costanzo, J D

    1982-01-30

    Copper is an essential dietary component, being the coenzyme of many enzymes with oxidase activity, e.g. ceruloplasmin, superoxide dismutase, monoamine oxidase, etc. The metabolism of copper is complex and imperfectly known. Active transport of copper through the intestinal epithelial cells involves metallothionein, a protein rich in sulfhydryl groups which also binds the copper in excess and probably prevents absorption in toxic amounts. In hepatocytes a metallothionein facilitates absorption by a similar mechanism and regulates copper distribution in the liver: incorporation in an apoceruloplasmin, storage and synthesis of copper-dependent enzymes. Metallothioneins and ceruloplasmin are essential to adequate copper homeostasis. Apart from genetic disorders, diseases involving copper usually result from hypercupraemia of varied origin. Wilson's disease and Menkes' disease, although clinically and pathogenetically different, are both marked by low ceruloplasmin and copper serum levels. The excessive liver retention of copper in Wilson's disease might be due to increased avidity of hepatic metallothioneins for copper and decreased biliary excretion through lysosomal dysfunction. Menkes' disease might be due to low avidity of intestinal and hepatic metallothioneins for copper. The basic biochemical defect responsible for these two hereditary conditions has not yet been fully elucidated.

  3. [Copper IUDs (author's transl)].

    Science.gov (United States)

    Thiery, M

    1983-10-01

    Following initial development of the Grafenberg ring in the 1920's, IUDs fell into disuse until the late 1950s, when plastic devices inserted using new technology began to gain worldwide acceptance. Further research indicated that copper had a significant antifertility effect which increased with increasing surface area, and several copper IUDs were developed and adapted, including the Copper T 200, the Copper T 220C, and the Copper T 380 A, probably the most effective yet. The Gravigard and Multiload are 2 other copper devices developed according to somewhat different principles. Copper devices are widely used not so much because of their great effectiveness as because of their suitability for nulliparous patients and their ease of insertion, which minimizes risk of uterine perforation. Records of 2584 women using Copper IUDs for 7190 women-years and 956 women using devices without copper for 6059 women-years suggest that the copper devices were associated with greater effectiveness and fewer removals for complications. Research suggests that the advantages of copper IUDs become more significant with increased duration of use. Contraindications to copper devices include allergy to copper and hepatolenticular degeneration. No carcinogenic or teratogenic effect of copper devices has been found, but further studies are needed to rule out other undesirable effects. Significant modifications of copper devices in recent years have been developed to increase their effectiveness, prolong their duration of usefulness, facilitate insertion and permit insertion during abortion or delivery. The upper limit of the surface area of copper associated with increased effectiveness appears to be between 200-300 sq mm, and at some point increases in copper exposure may provoke expulsion of the IUD. The duration of fertility inhibition of copper IUDs is usually estimated at 2-3 years, but recent research indicates that it may be 6-8 years, and some devices may retain copper surface

  4. Nanocrystalline and ultrafine grain copper obtained by mechanical attrition

    Directory of Open Access Journals (Sweden)

    Rodolfo Rodríguez Baracaldo

    2011-03-01

    Full Text Available This article presents a method for the sample preparation and characterisation of bulk copper having grain size lower than 1 μm (ultra-fine grain and lower than 100 nm grain size (nanocrystalline. Copper is initially manufactured by a milling/alloying me- chanical method thereby obtaining a powder having a nanocrystalline structure which is then consolidated through a process of warm compaction at high pressure. Microstructural characterisation of bulk copper samples showed the evolution of grain size during all stages involved in obtaining it. The results led to determining the necessary conditions for achieving a wide range of grain sizes. Mechanical characterisation indicated an increase in microhardness to values of around 3.40 GPa for unconsolida- ted nanocrystalline powder. Compressivee strength was increased by reducing the grain size, thereby obtaining an elastic limit of 650 MPa for consolidated copper having a ~ 62 nm grain size.

  5. Effect of lithium on the casting microstructure of Cu-Li alloys

    Institute of Scientific and Technical Information of China (English)

    ZHU Dachuan; SONG Mingzhao; YANG Dingming; CHEN Jiazhao; TU Mingjing

    2005-01-01

    The effect of lithium on the casting microstructure of Cu-Li alloys was studied via the Wild MPS 46 Automatic camera, Deitz Diaplan, and scanning electron microscope. The result shows that trace lithium added to copper coarsens the grains of Cu-Li alloys in equiaxed crystal area because of the excellent purification effect. With the amount of lithium increasing, the average grain size increases sharply. But when the amount of lithium increases more, the average grain size decreases instead. At the same time, the typical dentritic crystal area of copper is diminished when lithium is added to pure copper.

  6. In vitro cytotoxicity of Ag-Pd-Cu-based casting alloys.

    Science.gov (United States)

    Niemi, L; Hensten-Pettersen, A

    1985-01-01

    The cytotoxicity and its correlation to alloy composition, structure, corrosion, as well as galvanic coupling was studied with 12 Ag-Pd-Cu-type alloys, one conventional type III gold alloy and pure Ag, Cu, and Pd. The agar overlay cell culture technique was used. Single phase binary CuPd alloys were only slightly cytotoxic below a Cu content of 30 wt%. The tested multiphase alloys were all toxic, but no correlation between toxicity and Cu content could be observed. Solid solution annealing increased the cytotoxicity of a multiphase alloy. Exposure of a single phase alloy to an artificial saliva for 1 week prior to the test decreased its cytotoxicity significantly. Galvanic coupling of the alloys through an outer copper wire decreased their cytotoxicity.

  7. Eletrodissolução de ligas de latão empregando sistemas de análise em fluxo para a determinação de cobre, zinco e chumbo por ICP-AES Electrodissolution of brasses alloys employing flow systems for determination of copper, zinc and lead by ICP-AES

    Directory of Open Access Journals (Sweden)

    Ana Paula G. Gervasio

    1999-09-01

    Full Text Available An on-line electrodissolution procedure implemented in a flow injection system for determination of copper, zinc and lead in brasses alloys by ICP-AES is described. Sample dissolution procedure was carried out by using a PTFE chamber and a DC power supply with constant current. Solid sample was attached to chamber as anode and a gold tubing coupled in the chamber was used as cathode. An electrolytic solution flowing through the gold tubing closed the electric circuit with sample, in order to provide condition for electric dissolution when the DC power supply was switched on. The best results were achieved by using a 1.5 mol l-1 nitric acid solution as electrolyte and a 2.5 A current intensity. The procedure presented a good performance characterized by a relative standard deviation better than < 5% (n=5 and a sample throughput of 180 determinations per hour for Cu, Zn and Pb. Results were in agreement with those obtained by conventional acid dissolution (99% confidence level.

  8. Depletion Gilding: An Ancient Method for Surface Enrichment of Gold Alloys

    CERN Document Server

    Sparavigna, Amelia Carolina

    2016-01-01

    Ancient objects made of noble metal alloys, that is, gold with copper and/or silver, can show the phenomenon of surface enrichment. This phenomenon is regarding the composition of the surface, which has a percentage of gold higher than that of the bulk. This enrichment is obtained by a depletion of the other elements of the alloy, which are, in some manner, removed. This depletion gilding process was used by pre-Columbian populations for their 'tumbaga', a gold-copper alloy, to give it the luster of gold.

  9. Effects of extrusion on chromium precipitation in Cu-Cr alloy

    Institute of Scientific and Technical Information of China (English)

    范志康; 杨红旺; 梁淑华; 肖鹏

    2003-01-01

    Cu-Cr alloys containing Cr from 0.14% to 2.0% in mass were prepared as foils for TEM observation before and after being extruded. The results show that before extrusion, the spheroid or short bar chromium disperse in copper matrix of the Cu-Cr alloy, and the relationship between Cu and Cr follows the Nishiyama-Wasserman (NW) relationship, I.e. [110]Cu∥[001]Cr. After the Cu-Cr alloy was extruded at 860℃, dark field image along (224)Cu clearly shows that there are precipitated chromium particles in copper matrix. However, the SADP comprises only (112)Cu zone.

  10. Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Ying; Liang, Shuhua, E-mail: liangxaut@gmail.com; Yang, Qing; Wang, Xianhui

    2016-11-30

    Highlights: • Nano- or micro-scale fractal dendritic copper (FDC) was synthesized by electroless immersing of Cu-Al alloys in CuCl{sub 2} + HCl. • FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. • Nanoscale Cu{sub 2}O was found at the edge of FDC. Nanoporous copper (NPC) can also be obtained by using Cu{sub 17}Al{sub 83} alloy. • The potential difference between CuAl{sub 2} and α-Al phase and the replacement reaction in multiphase solution are key factors. - Abstract: Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. Compared to Cu{sub 40}Al{sub 60} and Cu{sub 45}Al{sub 55} alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu{sub 17}Al{sub 83} alloy as the starting alloy. The growth direction of the FDC is <110>, and all angles between the trunks and branches are 60°. Nanoscale Cu{sub 2}O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu{sub 17}Al{sub 83} alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl{sub 2} intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

  11. Low-cycle fatigue of dispersion-strengthened copper

    Energy Technology Data Exchange (ETDEWEB)

    Robles, J. (Clorox Co., Pleasanton, CA (United States)); Anderson, K.R.; Groza, J.R.; Gibeling, J.C. (Univ. of California, Davis, CA (United States))

    1994-10-01

    The cyclic deformation behavior of a dispersion-strengthened copper alloy, GlidCop Al-15, has been studied at plastic strain amplitudes in the range 0.1 pct [<=] [Delta][var epsilon][sub p]/2 [<=] 0.8 pct. Compared to pure polycrystalline copper, the dispersion-strengthened material exhibits a relatively stable cyclic response as a consequence of the dislocation substructures inherited from prior processing and stabilized by the Al[sub 2]O[sub 3] particles. These dislocation structures remain largely unaltered during the course of deformation; hence, they do not reveal any of the features classically associated with copper tested in fatigue. At low amplitudes, the fatigue lifetimes of the dispersion-strengthened copper and the base alloy are similar; however, the former is more susceptible to cracking at stress concentrations because of its substantially greater strength. This similarity in fatigue life-times is a consequence of the dispersal of both deformation and damage accumulation by the fine grain size and dislocation/particle interactions in the GlidCop alloy. The operation of these mechanisms is reflected in the fine surface slip markings and rough fracture surface features for this material.

  12. Ni60优化高铝青铜 SAPS--感应重熔涂层组织结构的研究%Investigation of organization structure optimized by Ni60 on high-aluminum copper alloy coating prepared by supersonic plasma spraying-induction remelting

    Institute of Scientific and Technical Information of China (English)

    路阳; 马郡珠; 杨效田; 肖荣振; 杨晓伟

    2014-01-01

    The gradient coating of Ni60/high aluminum copper alloy was prefabricated on 45 # steel substrate by supersonic plasma spraying and induction remelting.The characteristics of organizational structure,the trans-formation of phase structure,element diffusion were analyzed by means of SEM and XRD.The results indicated that the mechanical adhesion was the main way between the matrix and Ni60 coating by the supersonic plasma spraying,the slight sinter properties appear at the interface between Ni60/high aluminum bronze coating,the interface was the mechanical combination and mild metallurgical combination of hybrid combination way.The fully bidirectional diffusion fusion of Ni60 was appeared between the matrix and high aluminum copper alloy coating after the induction remelting.A metallurgical bonding was formed between the Ni60 and the matrix, whose structure was dense and seamless,and whose elements form gradient or uniform distribution.The in-tegrate coating was formed which has not distinct metallurgical belt.The boundary between the Ni60 and the high aluminum copper coating disappeared.The diffused element in this coating distribute as the gradient form.%采用超音速等离子喷涂技术在45#钢基体上制备 Ni60/高铝青铜梯度涂层,并进行高频感应重熔处理。通过 SEM、XRD 等手段分析了感应重熔前后涂层的组织结构特征、相结构变化以及界面元素扩散情况。结果表明,超音速等离子喷涂层在基体/Ni60结合面处以机械咬合为主,在 Ni60/高铝青铜涂层界面处有轻微熔结特性,形成了机械结合和轻微冶金结合的混合结合方式。感应重熔后,Ni60中间层分别与基体、高铝青铜涂层进行充分的双向扩散熔合。在Ni60和基体间形成结构致密、无孔隙的冶金扩散带,元素扩散迁移后不同元素呈现梯度或均匀分布形式。在 Ni60和高铝青铜涂层之间分层界面基本消失,形成了完全的一体化涂层,涂层中元素扩散呈现梯度形式。

  13. Bright nickel plating on surface of machinable zinc-copper-magnesium-aluminum-rare earth zinc alloy%易切削锌-铜-镁-铝-稀土锌合金表面电镀光亮镍

    Institute of Scientific and Technical Information of China (English)

    周宏明; 肖来荣; 刘芙蓉; 李艳芬

    2012-01-01

    以新型易切削Zn-Cu-Mg-Al-RE锌合金为基体,电镀得到光亮镍镀层.其工艺流程主要包括化学除油、活化、预镀镍、光亮镀镍和干燥.研究了温度、pH、电流密度、电镀时间等工艺条件对在以硫酸镍、氯化镍、硼酸和光亮剂为主要成分的镀液中所得光亮镍镀层外观的影响.电镀光亮镍的最佳工艺为:0.045~0.050A/cm2,40~45℃,pH=3.9~4.1,10min.在最佳工艺下得到的镀层总厚度约为80 μm,镀层光滑、致密、光泽度好,无针孔、麻点、起泡等缺陷,与基体结合紧密,界面存在ZnNi过渡层.%Bright nickel coating was electroplated on Zn-Cu-Mg-Al-RE zinc alloy substrate through the following process flow: chemical degreasing, activating, nickel pre-plating, bright nickel plating, and drying. The effects of temperature, pH, current density and plating time on the appearance of bright nickel coating prepared from a bath mainly composed of nickel sulfate, nickel chloride, boric acid, and brightener were studied. The optimal process parameters for bright nickel plating are as follows: 0.045-0.050 A/cm2, 40-45℃, pH 3.9-4.1, and 10 min. The coating with a thickness of ca.80 um is obtained under the optimal parameters, which is smooth, compact and of good glossiness, without defects such as pinholes, pits, and bubbles. The nickel coating is tightly bonded to zinc alloy substrate, and there is a ZnNi transition layer close to the zinc alloy substrate.

  14. Refinement and fracture mechanisms of as-cast QT700-6 alloy by alloying method

    Directory of Open Access Journals (Sweden)

    Min-qiang Gao

    2017-01-01

    Full Text Available The as-cast QT700-6 alloy was synthesized with addition of a certain amount of copper, nickel, niobium and stannum elements by alloying method in a medium frequency induction furnace, aiming at improving its strength and toughness. Microstructures of the as-cast QT700-6 alloy were observed using a scanning-electron microscope (SEM and the mechanical properties were investigated using a universal tensile test machine. Results indicate that the ratio of pearlite/ferrite is about 9:1 and the graphite size is less than 40 μm in diameter in the as-cast QT700-6 alloy. The predominant refinement mechanism is attributed to the formation of niobium carbides, which increases the heterogeneous nucleus and hinders the growth of graphite. Meanwhile, niobium carbides also exist around the grain boundaries, which improve the strength of the ductile iron. The tensile strength and elongation of the as-cast QT700-6 alloy reach over 700 MPa and 6%, respectively, when the addition amount of niobium is 0.8%. The addition of copper and nickel elements contributed to the decrease of eutectoid transformation temperature, resulting in the decrease of pearlite lamellar spacing (about 248 nm, which is also beneficial to enhancing the tensile strength. The main fracture mechanism is cleavage fracture with the appearance of a small amount of dimples.

  15. Solid state consolidation nanocrystalline copper-tungsten using cold spray

    Energy Technology Data Exchange (ETDEWEB)

    Hall, Aaron Christopher [Sandia National Lab. (SNL-CA), Livermore, CA (United States); Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sarobol, Pylin [Sandia National Lab. (SNL-CA), Livermore, CA (United States); Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Argibay, Nicolas [Sandia National Lab. (SNL-CA), Livermore, CA (United States); Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Clark, Blythe [Sandia National Lab. (SNL-CA), Livermore, CA (United States); Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Diantonio, Christopher [Sandia National Lab. (SNL-CA), Livermore, CA (United States); Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-09-01

    It is well known that nanostructured metals can exhibit significantly improved properties compared to metals with conventional grain size. Unfortunately, nanocrystalline metals typically are not thermodynamically stable and exhibit rapid grain growth at moderate temperatures. This severely limits their processing and use, making them impractical for most engineering applications. Recent work has shown that a number of thermodynamically stable nanocrystalline metal alloys exist. These alloys have been prepared as powders using severe plastic deformation (e.g. ball milling) processes. Consolidation of these powders without compromise of their nanocrystalline microstructure is a critical step to enabling their use as engineering materials. We demonstrate solid-state consolidation of ball milled copper-tantalum nanocrystalline metal powder using cold spray. Unfortunately, the nanocrystalline copper-tantalum powder that was consolidated did not contain the thermodynamically stable copper-tantalum nanostructure. Nevertheless, this does this demonstrates a pathway to preparation of bulk thermodynamically stable nanocrystalline copper-tantalum. Furthermore, it demonstrates a pathway to additive manufacturing (3D printing) of nanocrystalline copper-tantalum. Additive manufacturing of thermodynamically stable nanocrystalline metals is attractive because it enables maximum flexibility and efficiency in the use of these unique materials.

  16. pH对锡-银-铜三元合金共沉积的影响%Effect of pH on codeposition of tin-silver-copper ternary alloy

    Institute of Scientific and Technical Information of China (English)

    张莹莹; 石秀敏; 高学朋; 贺岩峰

    2013-01-01

    The effect of pH on codeposition of Sn-Ag-Cu ternary alloy was studied by polarization curve measurement, inductively coupled plasma emission spectroscopy, surface morphology analysis, and X-ray diffraction spectroscopy, using HEDTA [N-(β-hydroxyethyl)ethylenediamine triacetic acid] as main complexing agent. The bath composition and process parameters are as follows: Sn(CH3SO3)2 110 g/L, Ag2O 0.081 1 g/L, Cu(CH3SO3)2 0.876 g/L, HEDTA 278.3 g/L, thiourea 4.6 g/L, alkyl glycosides 1 g/L, temperature 25 ℃, and current density 10 mA/cm2. The results show that the deposition potential shifts towards negative as the pH increases. The Sn-Ag-Cu alloy coatings obtained at 3.22-7.74 are fine-grained and level. The Sn-Ag-Cu alloy coating is composed of Sn, Ag3Sn and Cu6Sn5. The crystal orientation of the coating changes as pH changes. The suitable pH for electrodeposition of Sn-Ag-Cu alloy coating from HEDTA system is 3.00-6.00, and the optimal pH is 5.00-6.00.%以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等研究了pH对Sn-Ag-Cu三元合金共沉积的影响.镀液组成及工艺参数为:Sn(CH3SO3)2 110 g/L,Ag2O0.081 1 g/L,Cu(CH3SO3)2 0.876 g/L,HEDTA 278.3 g/L,硫脲4.6 g/L,烷基糖苷1g/L,温度25℃,电流密度10 mA/cm2.结果表明,随pH增大,Sn-Ag-Cu的沉积电位负移.pH为3.22~7.74时,Sn-Ag-Cu合金镀层结晶细致、表面平整.Sn-Ag-Cu合金镀层由Sn、Ag3Sn和Cu6Sn5组成,其结晶取向随pH改变而变.HEDTA体系电沉积Sn-Ag-Cu合金镀层的适宜pH为3.00 ~ 6.00,最优范围是5.00 ~ 6.00.

  17. Enriched alloy layer on an Al-Cu alloy studied by cyclic voltammetry

    Science.gov (United States)

    García Vergara, S. J.; Blanco Pinzon, C. E.; Skeldon, P.

    2017-01-01

    The behaviour of enriched Al-0.7at.%Cu alloy is investigated using cyclic voltammetry. Enriched alloy layers at the interface between the alloy/oxide film were developed by alkaline etching at 5mAcm-2 in 0.1M sodium hydroxide solution at 298K, with the time of etching determining the extent of enrichment. Cyclic voltammograms were recorded at a scan rate of 10mV s-1 in naturally aerated 0.1M ammonium pentaborate solution at 298K. The current overshoot of the enriched alloys was different from that for non-enriched alloy. The latter material revealed the usual single peaks, which are very similar. In contrast, the overshoot comprised two or more components for the enriched alloys. The behaviour is suggested to be associated with the atomic bonding of aluminium in copper-rich and aluminium-rich regions of the enriched alloy layer, with influence on the activation potentials for oxidation of aluminium.

  18. Handling of Copper and Copper Oxide Nanoparticles by Astrocytes.

    Science.gov (United States)

    Bulcke, Felix; Dringen, Ralf

    2016-02-01

    Copper is an essential trace element for many important cellular functions. However, excess of copper can impair cellular functions by copper-induced oxidative stress. In brain, astrocytes are considered to play a prominent role in the copper homeostasis. In this short review we summarise the current knowledge on the molecular mechanisms which are involved in the handling of copper by astrocytes. Cultured astrocytes efficiently take up copper ions predominantly by the copper transporter Ctr1 and the divalent metal transporter DMT1. In addition, copper oxide nanoparticles are rapidly accumulated by astrocytes via endocytosis. Cultured astrocytes tolerate moderate increases in intracellular copper contents very well. However, if a given threshold of cellular copper content is exceeded after exposure to copper, accelerated production of reactive oxygen species and compromised cell viability are observed. Upon exposure to sub-toxic concentrations of copper ions or copper oxide nanoparticles, astrocytes increase their copper storage capacity by upregulating the cellular contents of glutathione and metallothioneins. In addition, cultured astrocytes have the capacity to export copper ions which is likely to involve the copper ATPase 7A. The ability of astrocytes to efficiently accumulate, store and export copper ions suggests that astrocytes have a key role in the distribution of copper in brain. Impairment of this astrocytic function may be involved in diseases which are connected with disturbances in brain copper metabolism.

  19. Copper oxide as a high temperature battery cathode material

    Science.gov (United States)

    Ritchie, A. G.; Mullins, A. P.

    1994-10-01

    Copper oxide has been tested as a cathode material for high temperature primary reserve thermal batteries in single cells at 530 to 600 C and at current densities of 0.1 to 0.25 A cm(exp -2) using lithium-aluminium alloy anodes and lithium fluoride-lithium chloride-lithium bromide molten salt electrolytes. Initial on-load voltages were around 2.3 V, falling to 1.5 V after about 0.5 F mol(exp -1) had been withdrawn. Lithium copper oxide, LiCu2O2, and cuprous oxide, Cu2O, were identified as discharge products.

  20. On the mechanical properties of TiNb based alloys

    Energy Technology Data Exchange (ETDEWEB)

    Guo, Y. [SIMAP-CNRS, Institut Polytechnique de Grenoble, BP 75, St. Martin d’Hères 38402 (France); Georgarakis, K. [WPI Advanced Institute for Materials Research, Tohoku University, Sendai (Japan); SIMAP-CNRS, Institut Polytechnique de Grenoble, BP 75, St. Martin d’Hères 38402 (France); Yokoyama, Y. [WPI Advanced Institute for Materials Research, Tohoku University, Sendai (Japan); Yavari, A.R., E-mail: euronano@minatec.inpg.fr [SIMAP-CNRS, Institut Polytechnique de Grenoble, BP 75, St. Martin d’Hères 38402 (France)

    2013-09-15

    Highlights: •Systematic study of compressive behaviors of TiNb based alloys in different states. •Comparison between X-ray diffraction results in reflection and transmission mode. •High melting temperature TiNb based alloys were fabricated by copper mold casting. •Textures of studied alloys are analyzed through synchrotron radiation data. -- Abstract: A series of TiNb(Sn) alloys were synthesized by copper mold suction casting and subjected to different heat treatments (furnace cooling or water quenching). The microstructure, thermal and mechanical properties of the as-cast and heat treated samples were investigated. For the Ti–8.34 at.% Nb alloy, the as-cast and water quenched samples possess martensitic α′′ phase at room temperature and compression tests of these samples show occurrence of shape memory effect. For β phase Ti–25.57 at.% Nb alloys, stress-induced martensitic transformation was found during compression in the as-cast and water quenched samples. For the ternary Ti–25.05 at.%Nb–2.04 at.%Sn alloy, conventional linear elastic behavior was observed. It is shown that the addition of Sn increases the stability of the β phase. The Young’s moduli of these alloys were also measured by ultrasonic measurements. Water-quenched Ti–25.57 at.%Nb alloy was found to exhibit the lowest Young’s modulus value. Sn addition has small impact on the Young’s moduli of the TiNb alloys.

  1. Canine models of copper toxicosis for understanding mammalian copper metabolism

    OpenAIRE

    Fieten, Hille; Leegwater, Peter A. J.; Watson, Adrian L.; Rothuizen, Jan

    2011-01-01

    Hereditary forms of copper toxicosis exist in man and dogs. In man, Wilson’s disease is the best studied disorder of copper overload, resulting from mutations in the gene coding for the copper transporter ATP7B. Forms of copper toxicosis for which no causal gene is known yet are recognized as well, often in young children. Although advances have been made in unraveling the genetic background of disorders of copper metabolism in man, many questions regarding disease mechanisms and copper homeo...

  2. Determination of iron, copper and aluminium by gas-liquid chromatography.

    Science.gov (United States)

    Moshier, R W; Schwarberg, J E

    1966-03-01

    Gas chromatography has been utilised in the analysis of two National Bureau of Standard alloys for quantitative determination of aluminium, iron and copper. In the analysis of N.B.S. 162a the relative mean errors were 3.13% for aluminium, 2.06% for iron and -1.72% for copper and for N.B.S. 164a the relative mean errors were -1.39%, -0.19% and -0.89% for aluminium, iron and copper, respectively. The procedure for analysis involves solution of the alloy, conversion of the metal ions to trifluoroacetylacetonates by solvent extraction and, finally, complete separation of the metal chelates and quantitative determination by gas chromatography using a column containing Gas Pack F coated with Tissuemat E, a polyethylene wax. Other metals present in the N.B.S. samples did not interfere with the determination of aluminium, iron and copper.

  3. Hair copper in intrauterine copper device users.

    Science.gov (United States)

    Thiery, M; Heyndrickx, A; Uyttersprot, C

    1984-03-01

    The antifertility effect of copper-bearing IUDs is based on continuous release of copper, which is a result of the reaction between the metal and the uterine secretions. Released cupric ions collect in the endometrium and in the uterine fluid but significant accumulation has not been found in the bloodstream or elsewhere. Following Laker's suggestion that hair be used for monitoring essential trace elements, e.g., copper, we checked the copper content of the hair of women wearing copper-bearing IUDs. Samples of untreated pubic hair removed by clipping before diagnostic curettage were obtained from 10 young (24-34 years old), white caucasian females who until then had been wearing an MLCu250 IUD for more than 1 year. Pubes from 10 comparable (sex, age, race) subjects who had never used a Cu-containing device served as controls. The unwashed material was submitted to the toxicology laboratory, where the copper content was assessed by flameless atomic absorption, a technique whose lower limit of measurement lies at a concentration of 0.05 mcg Cu/ml fluid (50 ppb). Hair samples were washed to remove extraneous traces of metal according to the prescriptions of the International Atomic Energy Agency, weighed, and mineralized, after which a small volume (10 mcl) of the diluted fluid was fed into the graphite furnace. Each sample (75-150 mg) was analyzed 4 times, both before and after washing. Since the cleaning procedure reduces the weight of the sample (mainly by the removal of fat, dust, etc.) this explains why the percentage copper content of washed hair is higher than that of unwashed hair belonging to the same subject. The results indicate that there was no significant difference (Mann-Whitney U test) between the mean copper levels of both unwashed and washed pubes from women who were using or had never used an MLCu250 IUD. We therefore conclude that the use of this copper-containing device is not associated with significant accumulation of copper in (pubic) hair.

  4. China Copper Processing Industry Focus

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    <正>1. Market Consumption The ’China Factor’ and Copper Price Fluctuation We all know China is an enormous consumer of copper,but the exact levels of consumption and where the copper has gone remains a mystery.

  5. Biogenic nanoparticles: copper, copper oxides, copper sulphides, complex copper nanostructures and their applications.

    Science.gov (United States)

    Rubilar, Olga; Rai, Mahendra; Tortella, Gonzalo; Diez, Maria Cristina; Seabra, Amedea B; Durán, Nelson

    2013-09-01

    Copper nanoparticles have been the focus of intensive study due to their potential applications in diverse fields including biomedicine, electronics, and optics. Copper-based nanostructured materials have been used in conductive films, lubrification, nanofluids, catalysis, and also as potent antimicrobial agent. The biogenic synthesis of metallic nanostructured nanoparticles is considered to be a green and eco-friendly technology since neither harmful chemicals nor high temperatures are involved in the process. The present review discusses the synthesis of copper nanostructured nanoparticles by bacteria, fungi, and plant extracts, showing that biogenic synthesis is an economically feasible, simple and non-polluting process. Applications for biogenic copper nanoparticles are also discussed.

  6. Effect of HEDTA on codeposition of tin-silver-copper ternary alloy from methanesulfonate bath%HEDTA对甲基磺酸盐镀液中锡-银-铜三元合金共沉积的影响

    Institute of Scientific and Technical Information of China (English)

    高学朋; 张莹莹; 贺岩峰

    2013-01-01

    以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等技术研究了甲基磺酸盐镀液中HEDTA含量对Sn-Ag-Cu三元合金共沉积的影响.镀液的基础组成和工艺条件为:Sn(CH3SO3)2 0.18 mol/L,Ag2O 0.006 mol/L,Cu(CH3SO3)2 0.001 2 mol/L,硫脲0.06 mol/L,烷基糖苷(APG)1 g/L,pH 4.0 ~ 6.0,温度25℃,电流密度7 mA/cm2,时间30 min.结果表明,随镀液中HEDTA含量的增加,Sn-Ag-Cu的沉积电位负移;但n(HEDTA)∶[Sn (Ⅱ)]大于2.2∶1.0时,HEDTA才可满足一定的配位要求,使沉积电位产生足够大的负移.镀液中HEDTA含量为0.6 ~ 1.2 mol/L,即n(HEDTA)∶n[Sn (Ⅱ)]为(3.3 ~ 6.7)∶1.0时,HEDTA的含量对镀层组成影响不大,所得Sn-Ag-Cu合金镀层结晶细致,表面平整、均匀,主要由Sn、Ag3Sn和Cu6Sn5组成.此外,随镀液中HEDTA含量的变化,镀层的结晶取向发生变化.%The effect of the content of primary complexing agent HEDTA [W-(β-hydroxyethyl)ethylendiamine triacetic acid] on codeposition of Sn-Ag-Cu ternary alloy in methanesulfonate bath was studied by polarization curve measurement, inductively coupled plasma emission spectroscopy, surface morphology observation, and X-ray diffraction analysis. The basic bath compositions and process parameters are as follows: Sn(CH3SO3)20.18 mol/L, Ag2O 0.006 mol/L, Cu(CH3SO3)2 0.001 2 mol/L, thiourea 0.06 mol/L, alkyl glycosides (APG) 1 g/L, pH 4.0-6.0, temperature 25 ℃, current density 7 mA/cm2, and time 30 min. The results show that the deposition potential shifts towards negative as the HEDTA content in bath increases. However, only when the molar ratio of HEDTA to Sn(Ⅱ) is above 2.2:1.0, can HEDTA meet the complexation requirement and make the deposition potential shift towards negative enough. When the HEDTA content in bath is 0.6-1.2 mol/L, that is the molar ratio of HEDTA to Sn(Ⅱ) equals to (3.3-6.7): 1.0, HEDTA content

  7. Determination of Trace Nickel in Copper Alloy by Inductively Coupled Spectrophotometry%萃取分离-分光光度法测定铜合金中痕量镍

    Institute of Scientific and Technical Information of China (English)

    李正权

    2014-01-01

    用硝酸溶解试样,在pH 6.0~7.0范围内,用三氯甲烷萃取丁二酮肟镍与铜基体分离。以盐酸反萃取镍。在碱性介质中,氧化剂存在下,镍与丁二酮肟形成络合物,在波长480nm处测定吸光度。0.2~2μg·mL-1范围内符合朗伯-比尔定律,回收率达100.7%,所测镍量范围为0.001%~0.010%。%Using nitric acid to dissolve the sample, pH was 6.0~7.0, dimethylglyoxime-nickel was separated from copper matrix by chloroform extraction. Hydrochloric acid was used to extract nickel. In alkaline medium, at the presence of oxidizing agent, nickel and dimethylglyoxime formed complex, the absorbance was measured at the wavelength of 480nm. In range of 0.2μg/mL~2μg/mL, the absorbance was accorded with Lambert-Beer’s law, the recovery was 100.7%, the nickel content range was 0.001%~0.010%.

  8. 添加2wt% Cu对Zr-4合金显微结构和耐腐蚀性能的影响%EFFECT OF 2 wt% COPPER ADDITION ON MICROSTRUCTURE AND THE CORROSION BEHAVIORS OF ZIRCALOY-4 ALLOY

    Institute of Scientific and Technical Information of China (English)

    李强; 余康; 刘仁多; 梁雪; 姚美意; 周邦新

    2012-01-01

    研究了在Zr-4合金中添加2 wt% Cu的合金显微组织及其在500℃和10.3 MPa过热蒸汽中的耐腐蚀性能.结果表明,该合金经过热轧、冷轧以及经2h、580℃真空退火处理后,得到以α-Zr为基体的显微组织,合金中主要存在四方结构的Zr2Cu和密排六方结构的Zr(Fe,Cr,Cu)2第二相,Zr2Cu相有长度1~4 μm、厚度约1μm的片状和直径300~500 nm的球形两种形态,并且都会富集一定量的Fe元素.在10.3 MPa、500℃过热水蒸汽中,添加2 wt%Cu的Zr-4合金不发生疖状腐蚀,表明Cu是改善锆合金耐疖状腐蚀性能的有益元素.%The effects of the 2 wt% copper addition on microstnictures and the corrosion behaviors of Zircaloy-4 alloys in the 500? superheated steam of 10. 3 MPa were investigated. The main phase was a-Zr after hot rolled, cold rolled and subsequent vacuum annealing treatment (580? for 2 h). Furthermore, tetragonal-Zr2Cu and hexagonal-Zr( Fe,Cr,Cu)2 precipitates were observed by TEM. Enrichment of Fe element was found in lamellar (about 1 ~ 4 祄 and 1 祄 in length and thickness, respectively) and spherical (300 -500 nm in diameter) Zr2Cu phases. Nodular corrosion was not observed in Zr-4-2Cu after 500 h corrosion in 500? superheated steam of 10.3 MPa, indicating thai Cu was beneficial to improving the nodular corrosion resistance of Zircaloy alloy in the environment stated above.

  9. Experimental Evaluation of Cold-Sprayed Copper Rotating Bands for Large-Caliber Projectiles

    Science.gov (United States)

    2015-05-01

    munition, thereby causing the projectile to spin. Pure copper, copper alloy, and brass rotating bands are typically fabricated to steel munitions using...the weld -overlay process, a radial-pressing process, or a thermal shrink fit. This paper documents the initial development and demonstration of a cold... Fabrication 3 3. Experimental 7 4. Results and Discussion 9 5. Summary 14 6. References and Notes 15 Distribution List 16 iv List of Figures Fig. 1

  10. Analysis of Copper and Zinc Element in Brass Alloy by EDXRF Method%黄铜合金 Cu 、Zn 元素的 EDXRF 分析

    Institute of Scientific and Technical Information of China (English)

    周新杰

    2015-01-01

    本文采用能量色散X射线荧光分析(EDXRF )方法对黄铜合金中的主要元素Cu和Zn的含量进行了分析 ,阐述了分析的基本原理 ,并采用基本参数法以及R-α参数法对其进行基体效应的校正.从实验结果来看 ,分析结果精度较高 ,能够很好的满足工业生产以及检测工作对精度的要求.%This paper uses energy dispersive X ray fluorescence analysis( EDXRF) method , the contents of the main elements in the Cu and Zn brass alloy were analyzed , elaborated the principle of analysis , correc-tion and usingthe fundamental parameter method and parameter method of R - alpha matrix effect on it . From the experimental results , the analysis results of high precision ,can be very good to meet the industri-al production and detection of precision .

  11. The influence of pH on the corrosion of medium strength aerospace alloy 8090, 2091 and 2014

    DEFF Research Database (Denmark)

    Ambat, Rajan; Dwarakadasa, E.S.

    1992-01-01

    The influence of pH on the corrosion behaviour of two aluminium-lithium-copper-magnesium-zirconium (8090 and 2091) alloys was studied and compared with a standard aircraft alloy, 2014 (Al-4.4% Cu) and 99.9% pure Al. In constant exposure and potentiodynamic polarization studies conducted in 3.5% Na...

  12. Investigation of Aluminum-Copper Tube Hydroforming with Axial Feeding

    Science.gov (United States)

    Parto D., M.; Seyedkashi, S. M. H.; Liaghat, Gh.; Naeini, H. Moslemi; Panahizadeh R., V.

    2011-01-01

    Hydroforming of a two-layered Aluminum-Copper tube is investigated numerically and experimentally. Pressure is applied through a nonlinear path along with symmetrical axial feeding. ABAQUS/Explicit commercial code is used for finite element simulation of the process. ASTM C11000 Copper alloy is used as inner layer and ASTM AA1050A Aluminum alloy is used as outer layer. The simulation results show that the part can be successfully formed under internal pressure of 40 MPa with 8 mm axial displacement. Stress distributions on both inner and outer tubes are compared and maximum thinning on their wall is also discussed. Different friction conditions are applied on the process using different coefficients of friction and their effects are investigated on thinning percentage of inner and outer tubes and also on axial feeding. It is observed that finite element results are in good agreement with experimental results.

  13. The Effect of Tool Position for Aluminum and Copper at High Rotational Friction Stir Welding

    OpenAIRE

    Recep Çakır; Sare Çelik

    2015-01-01

    Friction Stir Welding (FSW) is a solid state welding process used for welding similar and dissimilar materials. This welding technique allows welding of Aluminum alloys which present difficulties in fusion joining and allows different material couples to be welded continuously. In this study, 1050 aluminum alloy and commercially pure copper to increase heat input were produced at high rotation rate (2440 rev/min) with four different pin position (0-1-1.5-2 mm) and three different weld speeds ...

  14. IEC 61267: Feasibility of type 1100 aluminium and a copper/aluminium combination for RQA beam qualities.

    Science.gov (United States)

    Leong, David L; Rainford, Louise; Zhao, Wei; Brennan, Patrick C

    2016-01-01

    In the course of performance acceptance testing, benchmarking or quality control of X-ray imaging systems, it is sometimes necessary to harden the X-ray beam spectrum. IEC 61267 specifies materials and methods to accomplish beam hardening and, unfortunately, requires the use of 99.9% pure aluminium (Alloy 1190) for the RQA beam quality, which is expensive and difficult to obtain. Less expensive and more readily available filters, such as Alloy 1100 (99.0% pure) aluminium and copper/aluminium combinations, have been used clinically to produce RQA series without rigorous scientific investigation to support their use. In this paper, simulation and experimental methods are developed to determine the differences in beam quality using Alloy 1190 and Alloy 1100. Additional simulation investigated copper/aluminium combinations to produce RQA5 and outputs from this simulation are verified with laboratory tests using different filter samples. The results of the study demonstrate that although Alloy 1100 produces a harder beam spectrum compared to Alloy 1190, it is a reasonable substitute. A combination filter of 0.5 mm copper and 2 mm aluminium produced a spectrum closer to that of Alloy 1190 than Alloy 1100 with the added benefits of lower exposures and lower batch variability. Copyright © 2015 Associazione Italiana di Fisica Medica. Published by Elsevier Ltd. All rights reserved.

  15. Microstructure and Properties of W-Cu Alloys Prepared with Mechanically Activated Powder

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    W-15% Cu (mass fraction) alloys were sintered with mechanically activated powder in order to develop new preparing processes and improve properties of alloys. The microstructures of the activated powder and the sintered alloy were observed. Properties such as density were measured. The results show that through mechanical activation, the particle size of the powder becomes finer to sub-micron or nanometer level, some copper was soluble in tungsten, and high density W-Cu alloys can be obtained by mechanically activated powder for its action to the activation sintering.

  16. Development and Making of New Jewellery Palladium Based Alloys at JSC "Krastsvetmet"

    Institute of Scientific and Technical Information of China (English)

    YEFIMOV V. N.; MAMONOV S. N.; SHULGIN D. R.; YELTSIN S. I.

    2012-01-01

    Complex of research and development work aimed at implementation of jewellery palladium based alloys technology has been carried out at JSC Krastsvetmet.A range of palladium alloys jewellery fabrication has been organized.Compositions of a number of jewellery palladium alloys grade 850,900,950 and 990 have been proposed,their production and application in jewellery manufacture has been organized.To produce palladium alloys induction melting in inert atmosphere and melt pouring into a copper mould has been used.The ingots heat treatment conditions,as well as semi-finished jewelry plastic deformation parameters have been determined.

  17. Copper and silver halates

    CERN Document Server

    Woolley, EM; Salomon, M

    2013-01-01

    Copper and Silver Halates is the third in a series of four volumes on inorganic metal halates. This volume presents critical evaluations and compilations for halate solubilities of the Group II metals. The solubility data included in this volume are those for the five compounds, copper chlorate and iodate, and silver chlorate, bromate and iodate.

  18. Coping with copper

    DEFF Research Database (Denmark)

    Nunes, Ines; Jacquiod, Samuel; Brejnrod, Asker

    2016-01-01

    Copper has been intensively used in industry and agriculture since mid-18(th) century and is currently accumulating in soils. We investigated the diversity of potential active bacteria by 16S rRNA gene transcript amplicon sequencing in a temperate grassland soil subjected to century-long exposure......, suggesting a potential promising role as bioindicators of copper contamination in soils....

  19. Casting behavior of titanium alloys in a centrifugal casting machine.

    Science.gov (United States)

    Watanabe, K; Miyakawa, O; Takada, Y; Okuno, O; Okabe, T

    2003-05-01

    Since dental casting requires replication of complex shapes with great accuracy, this study examined how well some commercial titanium alloys and experimental titanium-copper alloys filled a mold cavity. The metals examined were three types of commercial dental titanium [commercially pure titanium (hereinafter noted as CP-Ti), Ti-6Al-4V (T64) and Ti-6Al-7Nb (T67)], and experimental titanium-copper alloys [3%, 5% and 10% Cu (mass %)]. The volume percentage filling the cavity was evaluated in castings prepared in a very thin perforated sheet pattern and cast in a centrifugal casting machine. The flow behavior of the molten metal was also examined using a so-called "tracer element technique." The amounts of CP-Ti and all the Ti-Cu alloys filling the cavity were similar; less T64 and T67 filled the cavity. However, the Ti-Cu alloys failed to reach the end of the cavities due to a lower fluidity compared to the other metals. A mold prepared with specially designed perforated sheets was effective at differentiating the flow behavior of the metals tested. The present technique also revealed that the more viscous Ti-Cu alloys with a wide freezing range failed to sequentially flow to the end of the cavity.

  20. Ancient Metal Mirror Alloy Revisited: Quasicrystalline Nanoparticles Observed

    Science.gov (United States)

    Sekhar, J. A.; Mantri, A. S.; Yamjala, S.; Saha, Sabyasachi; Balamuralikrishnan, R.; Rao, P. Rama

    2015-12-01

    This article presents, for the first time, evidence of nanocrystalline structure, through direct transmission electron microscopy (TEM) observations, in a Cu-32 wt.% Sn alloy that has been made by an age-old, uniquely crafted casting process. This alloy has been used as a metal mirror for centuries. The TEM images also reveal five-sided projections of nano-particles. The convergent beam nano-diffraction patterns obtained from the nano-particles point to the nano-phase being quasicrystalline, a feature that has never before been reported for a copper alloy, although there have been reports of the presence of icosahedral `clusters' within large unit cell intermetallic phases. This observation has been substantiated by x-ray diffraction, wherein the observed peaks could be indexed to an icosahedral quasi-crystalline phase. The mirror alloy casting has been valued for its high hardness and high reflectance properties, both of which result from its unique internal microstructure that include nano-grains as well as quasi-crystallinity. We further postulate that this microstructure is a consequence of the raw materials used and the manufacturing process, including the choice of mold material. While the alloy consists primarily of copper and tin, impurity elements such as zinc, iron, sulfur, aluminum and nickel are also present, in individual amounts not exceeding one wt.%. It is believed that these trace impurities could have influenced the microstructure and, consequently, the properties of the metal mirror alloy.